By Scott D. Szymanski, March Plasma Systems
Commercially available plasma treatment systems can be used for a variety of wafer-level packaging (WLP) process steps including removal of photoresist residue after development (i.e. descum); organic, metal, and oxide contamination removal; wafer surface cleaning; and other processes. Through various alterations to the plasma chemistry or chamber configurations, these systems meet demanding WLP processing requirements.
ACM Research Shanghai, Ltd., introduced the integrated Ultra iSFP stress-free polishing (SFP) semiconductor manufacturing tool for 65-45nm copper (Cu) interconnects, improving through silicon vias (TSV) with better heat dissipation.
Brewer Science Inc. and EV Group (EVG) will both commercialize ZoneBOND technology for temporary wafer bonding, thin wafer processing, and debonding applications.
Nanotech accelerator SVTC Technologies, wet chem equipment maker Amerimade Technology, and chemicals company Shanghai Sinyang Semiconductor Materials will collaborate on electroplating processes for TSV that are production-ready for advanced packages and MEMS.
ERS uncrated the ERS AirCool 3 wafer thermal test system with modular options and easy integration into all major wafer prober systems.
Rudolph Technologies Inc. (NASDAQ:RTEC) shipped its Wafer Scanner 3880 3D Inspection System, multiple NSX Macro Defect Inspection Systems and its Discover Yield Management Software Suite to a leading semiconductor manufacturer for use in developing through silicon via (TSV) structures.
Amkor will acquire Toshiba Electronics Malaysia Sdn. Bhd., Toshiba
In a podcast interview with ElectroIQ.com, Ziptronix president & CEO, Daniel Donabedian, and company CTO, Paul Enquist, discussed both the Ziptronix wafer bonding technology and their partnership with Sony.
GLOBALFOUNDRIES entered into a strategic partnership with Amkor (NASDAQ:AMKR) to develop integrated semiconductor assembly and test processes for advanced silicon nodes. The aim is integrated fab-bump-probe-assembly-test steps that can be commercialized across multiple customers and end-market applications.
SATS provider Unisem purchased a LTX-Credence PAx RF Test System for its Sunnyvale, CA, test development center, joining other recent test/wafer equipment purchases at the site.
EV Group (EVG), wafer bonding and lithography equipment supplier, began a manufacturing capacity expansion at its Austrian headquarters, adding floorspace, equipment, worker comforts, and a state-of-the-art visitor area. EVG will hire about 100 new staff members as part of the expansion.
3D semiconductor packaging processes involve various groups, and standards are important in the hand-offs between them, explains Mark Berry, sales director at Metryx. He covers how to use metrology to protect wafer yields in 3D packaging.
At SEMICON West, 100+ attendees gathered at the Suss MicroTec workshop "3D Integration: Are we there yet?" to hear technical experts from around the globe to present updates on the status of 3D technology.
IMT introduced its hermetic gold-to-gold (Au-Au) thermo compression bonding for wafer-level packaging (WLP). In development for nearly a year, this bond is being actively used in production.
Camtek Ltd. (Nasdaq:CAMT; TASE:CAMT) received an order for multiple wafer inspection systems from one of the world's largest manufacturers of CMOS image sensors (CIS).
Mitsubishi Heavy Industries launched a fully automated 12" (300mm) wafer bonding tool, Bond Meister MWB-12-ST, capable of producing 3D LSI circuits at room temperature. The 300mm bonder targets production of memory chips and MPUs.
With many advanced packaging processes taking place on the semiconductor wafer, the traditional supply chain of front-end fab at the foundry and back-end fab at the packaging and test house is falling apart. The ConFab session,
Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds.
Dave Rose, Keithley Instruments, addresses specific cabling techniques for DC, multi-frequency capacitance, and ultra-fast I-V and pulse testing, as well as the importance of proper grounding and shielding, choosing the proper interconnect for a specific measurement, and troubleshooting common interconnect problems.
During the past ten years, Clarkson University has received more than $1.4 million of direct and indirect (through Semiconductor Research Corporation) funding from Intel Corporation.
DelfMEMS and KFM Technology signed a common agreement to combine their expertise in RF micro-electro-mechanical systems (MEMS) and thin film packaging (TFP) technology. DelfMEMS will use the collaboration to provide packaged MEMS switches, fixed capacitors, and high-Q inductors on the same chip.
Dr. Phil Garrou looks ahead to a laundry list of changes coming in the next ITRS Update with respect to assembly and advanced packaging, including 3D integration, interposers, and applications from medical to automotive and embedded applications.
STATS ChipPAC Ltd. (SGX-ST:STATSChP), semiconductor test and advanced packaging service provider, expanded its wafer level package (WLP) offering with new 300mm manufacturing capabilities in Taiwan.
SEMI named Thomas DiStefano, John W. Smith Jr., and Michael Warner as recipients of the 2010 SEMI Award for North America for contributions to the development and commercialization of Micro Ball Grid Array (μBGA) technology.
China WLCSP Co. Ltd., provider of wafer level (WLP) miniaturization technologies for the electronics industry, confirmed its commitment to the US market with the opening of a new R&D center in Sunnyvale, CA.
The migration to the 22nm node is about more than just scaling down, it's also about scaling up with thinner devices stacked into a single package -- and these require new manufacturing considerations with wafer bonding playing a central role, writes Bioh Kim from EV Group.
The development effort involves the integration of defect inspection with a debonding tool. Manufacturing efficiencies, along with the ability to handle ultra-thin wafers, necessitates the integration of inspection in de-bonding applications. Rudolph is bringing its inspection technologies to this three-way collaboration to provide this integrated process control solution.
The trend toward complex semiconductor devices is fueling demand for more advanced wafer probe cards capable of accurately and cost-effectively testing these ICs, says January Kister, Microprobe. Kister examines the variables that impact current carrying capability (CCC) during semiconductor wafer test, and describe an optimal probe design with a composite metal structure.
Accretech’s next generation prober, the UF3000EX, offers high-speed wafer handling, a low-noise XY stage, and high accuracy with its OTS (Optical Target Scope) positioning technology.
SEMATECH experts reported new breakthroughs in wafer bonding at the 7th Annual Device Packaging Conference (DPC), March 7-10 in Scottsdale, AZ. Low-temp die tacking has yielded faster die-to-wafer integration.
Getting thinner appears to be the goal driving the market in both the wafer-level and substrate-level sectors, and innovative tooling and process technology will become paramount in addressing thinned packaging and ramping up to volume reliably, writes Dave Foggie from DEK.
Are we closer than we think to our needed mass production costs for silicon interposers? Phil Garrou gleans some insights from the year-ending RTI Architectures for Semiconductor Integration and Packaging conference.
Singapore's Institute of Microelectronics (IME) has launched a new multiproject wafer service for 2.5D through-silicon interposers, to provide a cost-effective platform for R&D prototyping and proof-of-concept in the technology.
Tezzaron Semiconductor has licensed patents regarding Ziptronix's direct bonding technologies, "direct bond interconnect" (DBI) and "direct oxide bonding (ZiBond), for use in 3D memory.
Dr. Phil Garrou reports from the 2nd annual Georgia Tech 2.5D Interposer Conference: what's the market projection for silicon and glass interposers, what's preventing high-volume manufacturing, and is there a crossover with flat-panel display glass manufacturing?
Alchimer SA says it is seeking partnerships with various semiconductor equipment and materials companies as it welcomes two top execs: Bruno Morel is the company's CEO since May of this year, and product development director Fr
Deca Technologies has introduced a new chip-scale packaging (CSP) product line for applications where its existing wafer-level CSP option isn't a good fit. Details and analysis to come.
TEL will acquire semiconductor packaging equipment supplier NEXX Systems. NEXX makes advanced deposition equipment, including ECD and PVD tools, for wafer-level packaging (WLP).
Lockheed Martin scientists have developed a new "nanotechnology" copper-based solder that it says will produce joints with up to 10
Fraunhofer IZM's All Silicon System Integration Dresden (ASSID) center will add SPTS' etch and PECVD process capabilities to investigate low-temperature dielectric films for through-silicon vias (TSV) in 3D IC packaging.
The advent of leading-edge semiconductor packaging technologies dictates efficient use of capital, and only the top-tier semiconductor assembly and test services (SATS) companies will have the financial wherewithal to develop required expertise and capacity, says one analyst.
Researchers at the Karlsruhe Institute of Technology (KIT) say they have developed a novel optical connection process for semiconductors using "photonic wire bonding" that achieves data transmission rates of several Tbit/sec.
EV Group's updated modular EVG150 high-volume coater/developer adds new modules for conformal coating of high topography surfaces, and coating surfaces with vertical sidewall angles, such as through-silicon vias (TSV).
EV Group (EVG) launched a new flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system throughput 26% to 18-20WPH with enhanced automation capabilities and low-temperature processing.
Unisem installed a V93000 Port Scale RF tester from Verigy, an Advantest Group company, at its European test development center in Wales. Unisem will test and develop wireless RF and complex mixed-signal semiconductors.
Ziptronix Inc. has licensed use of its oxide bonding technology for backside illumination imaging sensors patents to Sony Corporation. ZiBond technology enables more die per wafer, improving costs and quality for consumer, automotive, and other end-use applications.
Backside-illuminated image sensors require more precise wafer processing -- uniform extreme wafer thinning, dopant control, epitaxy growth, trench manipulation, etc. -- but the payoff in image quality is significant. Researchers at imec experimented with different wafer fab technologies to make a record BSI sensor. They also consider new architectures/packaging techniques for this technology.
Deca Technologies, a new company backed by Cypress Semiconductor and SunPower, will combine solar wafer manufacturing methods with semiconductor manufacturing support to create wafer-level chipscale packaging (WLCSP) derivatives.
SPP Process Technology Systems (SPTS) won a multi-system order for its Sigma PVD, Omega Etch and Delta CVD wafer processing systems from a leading outsourced semiconductor assembly and test (OSAT) provider in the Asia-Pacific region.
STATS ChipPAC Ltd. (SGX-ST: STATSChP), semiconductor test and advanced packaging service provider, is expanding its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities.
Zvi Or-Bach, MonolithIC 3D, describes the TSV-beating monolithic IC fab process, and argues for scaling "up" rather than down. Or-Bach compares the costs of further semiconductor scaling to advanced packaging.
Sonix Inc., scanning acoustic microscope designer and manufacturer, introduced its Stacked Die Imaging (SDI) enhancement, which effectively inspects for defects in semiconductor stacked die and wafer level packages (WLP) by selectively increasing the ultrasonic signal gain for deeper interfaces of interest.
Tokyo Electron Limited (TEL) has successfully demonstrated dynamicing -- device switching/dynamic characteristic (AC) -- of a power device at the wafer level.
SUSS MicroTec launched the XBS300 temporary bonder for high-volume wafer manufacturing. The Bond Cluster is configured to temporarily bond 200mm and 300mm wafers for 3D integration applications as well as other processes that require thin wafer handling.
Mentor Graphics Corporation (NASDAQ:MENT), in a cooperative effort with Tezzaron Semiconductor and MOSIS, created a process for economically developing and manufacturing 3D-IC prototypes on multi-project wafers (MPWs).
Yole Développement forecasts the temporary wafer bonding process growth and worth through 2016, and explains why there are so many process options, and who is working on them.
FormFactor (NASDAQ:FORM) introduced its new generation of the SmartMatrix 300mm full wafer contact probe cards for DRAM device test. The SmartMatrix 100XP probe card uses FORM's MicroSpring 3D MEMS contact technology and increases probe card parallelism to over 850 die, enabling single touchdown DRAM wafer test.
Today at The ConFab, John Chen (Nvidia), Jeong-ki Min (Samsung Electronics), and Abraham Yee (Nvidia) gathered foundry, OSAT, and chip maker leaders to discuss what happens beyond Moore's Law. The following are key points from "Collaboration to Strengthen the IC Supply Chain."
Wafer bonding is a complex process, used on 2" to 12" wafers for MEMS, image sensors, advanced packaging, LEDs, and other chips. Yole Développement published a technology study and market research report, "Permanent wafer bonding," to derive trends in the market and technology through 2016.
Semiconductor die and packaging specialist Chip Supply Inc. is changing its name to Micross Components, which reflects the acquisition of Chip Supply last November by Micross Components. Micross provides specialist products and services for high-reliability and state-of-the-art electronics for high-reliability, industrial, and commercial applications.
Alchimer's wet-deposition process, AquiVantage, grows interconnect layers for interposer redistribution layers (RDLs) and significantly enhances via-last backside wafer interconnects. The process eliminates 2 costly photolithography steps.
Yole Développement released "Equipment & Materials for 3DIC and Wafer-Level-Packaging," a database and complete report analyzing in detail the equipment and materials tool-box for wafer-level packaging (WLP). This semiconductor packaging technology falls into the "mid-end," where frontend semiconductor wafer fabs and backend packaging facilities both operate.
The ConFab gathers semiconductor industry leaders to discuss the biggest trends in the chip manufacturing sector. One of these major trends is 3D packaging, and Session 2 on Monday (May 16) will combine packaging house, fabless, and foundry approaches to the new supply chain, with speakers from Amkor, GLOBALFOUNDRIES, STATS ChipPAC, and Qualcomm.
Rudolph Technologies (NASDAQ: RTEC) released the Wafer Scanner 3880 to inspect micro and standard bumps, through silicon via (TSV) post-via-fill copper protrusions (nails) and re-distribution layers (RDL) used in 3D IC packaging.
Heavy monsoons moving through the Philippines are causing floods in and around Manila, the capital. The Philippines is a small but growing area for microelectronics manufacturing and packaging facilities.
SemiProbe has developed proprietary technologies awarded a patent by the United States Patent and Trademark Office. The Probe System for Life allows the company and users to configure test and inspection systems that meet unique requirements usually served by custom products.
The group will work on standard terminology and reference points for the mechanical interfaces of probers, handlers, testers, dockings, contactors and load boards. All companies that use or supply test equipment are invited to actively contribute.
Research and Markets released "Embedded Wafer-Level-Packages: Fan-out WLP/Chip Embedding in Substrate - 2010 Report," which covers embedded IC packaging markets, technology innovations, the manufacturing processes for fan-out and embedded wafer-level packaging, cost targets, and more.
Mark Privett, Brewer Science, says that new technologies allow use of higher temperatures as well as room-temperature processes, such as wafer de-bonding. The 3D industry is nearly ready for high-volume, yet still without industry standards.
In this video interview, Philip Garrou, microelectronics consultant and Advanced Packaging blogger, offers information on his blog, Insights from the leading edge, and summarizes reasonable roadmaps for 3D technology and TSV in particular. 2012 mainstream adoption seems too aggressive to Garrou.
In this video, Timothy Dunn, Marcy Nano Center, discusses building an eco system for advanced semiconductor manufacturing in the US. Marcy Nano Center is pre-permitted and site-ready to build a semiconductor site with a packaging focus, with its academic and industry partners.
Advanced Micro-Fabrication Equipment Inc. (AMEC) is fielding interest from packaging companies in the Primo D-RIE tool, which can be used to etch wafers for through-silicon via (TSV) interconnects.
Unisem Advanced Technologies (UAT) is expanding wafer bumping capacity in its factory in Ipoh, Malaysia. The bumping facility’s floor space will be increased by 100% and the increased capacity will be three times that of UAT’s current bumping capacity.
RoodMicrotec N.V. has successfully secured mezzanine capital of € 1.994 million without repayment obligation, providing a long-term strengthening of the company’s equity position.
3D IC technology will require significant changes across the design, tool, and manufacturing spectrum -- that sounds a lot like how the industry transitioned from bipolar to CMOS, writes Dr. Phil Garrou, reporting from themes at an IEEE 3D event in Munich.
The Centre Intégré de Microélectronique Provence Alpes Côte d'Azur (CIMPACA) selected DCG Systems products for its characterization and failure analysis platform: the ELITE lock-in thermography system and the Meridian WaferScan emission microscopy wafer prober with LVx option.
SEMATECH, the SIA, and SRC have established a new 3D Enablement program targeting standards in inspection, metrology, microbumping, bonding, and thin wafer and die handling.
FormFactor Inc. (NASDAQ: FORM) announced that Executive Chairman Carl Everett was elected to serve as non-executive Chairman of the Board of Directors. Current lead independent director Jim Prestridge will remain on the Board. FORM also announced the resignations of Board members Homa Bahrami, Chenming Hu and Harvey Wagner.
In this video from SEMICON West 2010, Marcus Wimplinger, EV Group, summarizes the results of SEMATECH work using EVG's 300mm bonding systems that enables submicron alignment. Highly accruate wafer bonding is used for Cu-to-Cu bonding and other packaging applications.
MicroProbe Inc., supplier of wafer test technology to the global semiconductor industry, released the MEMS-based Mx-FinePitch (Mx-FP) probe card. The test card series targets ultra-fine-pitch testing of leading-edge SoC and logic devices found in applications like digital cameras, set-top boxes and digital TVs.
In this video interview, Dave Stepniak, Texas Instruments, talks about a wafer-level packaging (WLP) trends paper he presented at SEMICON West. He summarizes the paper for senior technical editor Debra Vogler.
Cascade Microtech (NASDAQ: CSCD), supplier of production probe cards with signal integrity for multi-site die testing, released S-Technology, which provides a unique mechanical architecture for Pyramid probe cards to consistently deliver evenly distributed contact force for solder bump technologies in die tests.
Users of WIN's GaAs foundry services can engage in wafer-level and package test in Silicon Valley, CA, and Grenoble, France.
Jim Walker, research VP at Gartner, told attendees at the Gartner Semiconductor Briefing (11/4/10, San Jose, CA) that, after declining 14.7% in 2009, the outsourced semiconductor assembly and test services (OSATS) market will expand by 37% this year, and by 6.2% in 2011.
SUSS MicroTec and Fraunhofer for Surface Engineering and Thin Films IST launched SELECT, a technology for bond aligners and mask aligners that selectively activates parts of wafer surfaces through plasma.
Semiconductor packaging and test provider Unisem (M) Berhad announced results for the second quarter, ended 30 June 2010 (2Q10).
Indium Corporation’s global product manager, Andy C. Mackie, Ph. D., MSc, is presenting at the International Wafer-Level Packaging Conference (IWLPC) October 11-14, 2010 in Santa Clara, CA.
Integra Technologies, IC test and evaluation services provider, was selected by Proteus Biomedical for development and production test of their new integrated circuit (IC) designs for future medical electronics products.
Tamar Technology received orders from major semiconductor equipment manufacturers for its TSV measurement technology. Tamar’s proprietary Wafer Thickness Sensor can measure etch depth for TSVs as well as wafer thickness for single or bonded wafers.
STATS ChipPAC Ltd. opened a new 300mm embedded Wafer-Level Ball Grid Array (eWLB) manufacturing facility, switching over from 200mm technology. The official inauguration was held at STATS ChipPAC's Yishun facility in Singapore with more than 150 local dignitaries, customer representatives, business partners and management participating.
FormFactor Inc. (NASDAQ: FORM) is ceasing its transition of manufacturing operations to Singapore. The wafer probe company's decision will result in a reduction of approximately 70 employees at its Singapore facility. Manufacturing that was planned for Singapore will stay in Livermore, CA.
Joachim Burghartz, IMS CHIPS, presented an improved version of the group's Chipfilm technology introduced at IEDM 4 years ago. The researchers now have a manufacturable process technology.
MicroProbe, wafer test technology supplier, is extending its direct-dock offering to support Advantest's T2000 SoC test platform. The T2000 platform-compatible option enables test coverage at wafer sort. More than 100 direct-dock probe cards are already in the field.
TechSearch International’s new study, "2010 Flip Chip and WLP: Market Projections and New Developments," projects a CAGR of more than 15% for flip chip units. In unit volumes, WLPs are expected to see a 12.48% CAGR from 2009 to 2014. The report profiles drivers for the demand for gold and solder bumping, as well as WLP.
Mattson Technology Inc. (NASDAQ: MTSN) received a repeat order for the Alpine etch system from a leading semiconductor manufacturer. The system will be used in the customer's leading-edge 300mm packaging facility in Asia for advanced wafer-level packaging processes.
Electro Scientific Industries Inc. (Nasdaq: ESIO), a provider of photonic and laser systems for micro-engineering applications, appointed a new member, David Nierenberg, to its Board of Directors. Nierenberg, with professional experience in investing and management consulting, comes to ESI with significant expertise in strategic planning and corporate governance matters.
System Plus Consulting released its new reverse costing analysis of the enhanced Wafer Level BGA (eWLB) packaging used in the X-GOLD 213 circuit from Infineon. eWLB is a ball grid array (BGA) package based on the emerging fan-out wafer-level package (FO-WLP) concept. All the packaging operations are done at the wafer level, and a fan-out area is provided to extend the package size beyond the IC surface area to allow for higher ball counts. The ball pitch is 0.5mm and only one redistribution layer is used for this 217 balls, 8 × 8mm package.
The Burn-in & Test Socket (BiTS) Workshop will take place March 7–10, 2010 at the Hilton Phoenix East/Mesa Hotel in Mesa, AZ. More than 30 papers and posters will be presented; participants include end users and suppliers of sockets, boards, burn-in systems, handlers, and packages; and other related equipment, materials, and services. The TechTalk session on PCB design, fabrication and assembly is booked full, as is the tutorial on RF socket characterization by Gert Hohenwarter, Ph.D. of Gatewave Northern Inc. Here are some of the show highlights.
ULIS invested EUR20 million in a new state-of-the-art facility to meet increasing market demands for IR technology, with a move to 200mm wafers and pixel/wafer-level packaging techniques.
CEA-Leti and Replisaurus Technologies will begin applying Replisaurus' ElectroChemical Pattern Replication (ECPR) metallization process to customer target products, following a near-100% yield master.
Sitaram Arkalgud, director of interconnect at SEMATECH, discusses the high-volume manufacturability issues and gaps in both 2.5D and 3D semiconductor technologies with respect to backside processing and wafer bonding, thinning, and handling. Standards are also covered.
Jan Vardaman, president and founder of TechSearch International, summarizes highlights from her SEMICON West presentation on TSVs, speaking to RDL development, LED packaging, and TSV-alternative PoP.
Greg Baker, Olympus Integrated Technologies America, discusses why the company chose to focus its efforts on IR metrology for defect inspection of bonded wafers. Olympus-ITA launched the latest 3DIR Metrology and Defect Review System at SEMICON West 2011, booth 1524.
The 3M Semiconductor Innovation Center will serve the Asia region with 3M's Wafer Support System (WSS) materials and processes for temporary bonding for ultra-thin wafer handling applications.
SemiProbe released a 300mm manual test probe configuration of its Probe System for Life, M-12. The M-12 is field-upgradable to 450mm.
EV Group (EVG) added an in-line metrology module for its EVG850TB/DB automated temporary bonding and debonding systems.
New Venture Research, a technology market research company, released "Advanced IC Packaging Technologies and Markets, 2010 Edition," a strategic report on the latest technologies in IC packaging, with forecasts of key markets.
Camtek Ltd. (NASDAQ and TASE: CAMT) received an order for multiple wafer inspection systems from a major outsourced semiconductor assembly and test (OSAT) company in southeast Asia.
DEK has launched ProActiv process technology to enable electronics manufacturers to print pastes with high-density heterogeneous PCBs and ultra fine pitch assemblies such as advanced package assembly.
Kwan-yu Lai, Micralyne, and Jeffrey G. Stark, Sensor Products, describe the use of color-coded pressure-indicating film to ensure uniform, correct pressure during wafer bonding. Wafers are bonded by applying precise combinations of physical pressure, temperature, and/or voltage. Pressure is measured as an average, assuming perfectly flat pressure plates.
Extending its capabilities for placing solder spheres at high speed, DEK's DirEKt Ball Placement process now enables accurate solder sphere deposition for spheres as small as 200µm in diameter with pitches as tight as 300µm.
The Asys Group say it has acquired the IP and patents of fellow German firm DynTest Technologies, seeking to apply the company's wafer singulation technology to high-brightness LEDs.
Worldwide semiconductor capital equipment spending is projected to surpass $29.4 billion in 2010, a 76.1% increase from 2009 spending of $16.7 billion, according to Gartner Inc. Gartner cites a dramatic recovery in semiconductor orders for the equipment order surge.
Substantial amounts of electrostatic discharge (ESD) damage are not only possible, but probable in semiconductor die attach operations, leading to substantial yield losses. Roger Peirce and Brad Williford from Simco illustrate seven distinct mechanisms in typical die attach operations that cause electrostatic discharge (ESD) damage to chips being handled.
Given the advantages and technical feasibility of through-silicon vias (TSV), the major focus now is on the manufacturability and integration of all the different building blocks for TSVs and 3D interconnects. EV Group's Thorsten Matthias et al. review advances in lithography, thin wafer processing, and wafer bonding, and the integration of all these process steps.
Nagesh Vodrahalli, VP of technology & manufacturing at Allvia, discussed some of the issues in developing through-silicon via (TSV) technologies with Solid State Technology/Advanced Packaging in conjunction with his presentation at the recent 3-D Architectures for Semiconductor Integration and Packaging conference.
A new study suggests that through-silicon vias (TSV) with higher aspect ratios (20:1 or 10:1, vs. 5:1) offer a significant payback by saving space on a die, up to $700 per wafer.
Execs from Applied Materials and Semitool discuss the motivations behind AMAT's $364M acquisition, to solidify and widen a presence in two key growth segments: advanced packaging and copper interconnects for memory.
Hitachi Via Mechanics says it has developed new processes for microhole drilling cast polyimide wafers and multilayered materials used in high density electronics packaging, that can produce ≤100μm-dia. holes in high-volume manufacturing.
Presentations at this year's International Symposium on Microelectronics (IMAPS, San Jose, Nov. 1-5) included discussion of TSV/3D integration challenges and temporary bonding steps qualified for different process flows, and a wafer-level packaging (WLP) encapsulation process and stacked multi-chip package (MCP) for a MEMS variable capacitor and control IC chip.
Rudolph Technologies, Inc., announced that is has received orders for 20 tools from the world’s four largest outsourced assembly and test (OSAT) companies and major foundry companies. The orders are for Rudolph’s automated macro defect inspection equipment, which typically sell within a range of $600k to $1.2m.
Süss MicroTec's Stojan Kanev tells SST/AP about the company's new addition to its toolset for 3D integration: a probe station targeting 300mm wafer-level 3D stacked structures.
At the Electronic Components & Technology Conference (ECTC) this month in Las Vegas the CPMT (Components, Packaging and Manufacturing Technology) Society of IEEE bought out their long time partners ECA (formerly EIA). Other news: STATSChipPAC expanded its presence in eWLB, copper-copper bonding in 3D was reviewed, and Doublecheck Semiconductors, working with Disco and the Fraunhoffer IZM claims to have developed technology that enables standard silicon wafers to be thinned down to less than 100µm.
High-density through-silicon stacking (TSS) shows promise for very high-volume applications, but work still needs to be done to "tame" key issues in manufacturing, improve costs, and smooth out the supply-chain, said Matt Nowak, director of engineering in Qualcomm's VLSI technology group, in a presentation at The ConFab in Las Vegas.
The global semiconductor materials -- wafer fabrication and packaging materials -- market increased 7% in 2011 compared to 2010, with record revenues of $47.86 billion, said SEMI.
The worldwide semiconductor foundry market totaled $29.8 billion in 2011, a 5.1% increase from 2010, according to Gartner. Given aggressive foundry spending in 2010 and 2011, oversupply was "inevitable," Gartner says.
The Global Semiconductor Alliance (GSA) released its GSA Q1 Wafer Fabrication & Back-End Pricing Reports, tracking fab utilization rates, wafer and mask costs, and package pricing.
Applied Materials will host its annual Analyst meeting this week (March 28). Barclays Capital shares its expectations for AMAT's update and the wafer fab equipment (WFE) outlook in general.
At the recent Common Platform Technology Forum -- produced by Global Foundries, Samsung and IBM -- Simon Segars, executive vice president and general manager of the physical IP division at ARM, spoke about the impact of the internet of things and mobile computing on the way electronics are designed and used.
The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.
JP Sercel Associates, Inc. (JPSA) expanded its Ultrafast processing capabilities, using Pico-second lasers with innovative laser beam delivery techniques.
Novellus debuted the VECTOR Strata dielectric deposition tool for high-volume VIM Flash manufacturing. VECTOR Strata aims for ultra-smooth films with exceptional defect performance, enabling in-situ deposition of the alternating silicon-based layers used in the formation of the VIM structure.
The electronics industry will edge out coal-fired boilers as the biggest purchaser of ultrapure water systems and consumables in 2012, according to the McIlvaine report: Ultrapure Water World Markets.
Worldwide silicon wafer revenues improved 2% YOY, shows the SEMI Silicon Manufacturers Group. Worldwide silicon wafer area shipments, however, decreased 3%, indicating a loss of momentum in H2 2011, said Kazuyo Heinink, SEMI SMG.
Veeco Instruments (Nasdaq:VECO) reported 3 wins for its TurboDisc K465i GaN MOCVD tool : the same systems will be used for high-volume LED fab, GaN-on-Si research, and Si-based LED development.
Tokyo Electron Ltd. (TEL) restructured its organization, with a new "Organic EL Division" established under GM Takeshi Okubo, as well as other new and consolidating subsidiaries in the semiconductor and liquid crystal production segments.
University of Texas at Austin researchers demonstrated high-quality, wafer-scale graphene deposition on evaporated copper films, using an AIXTRON cold-wall vertical BM (Black Magic) Pro reactor.
SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.
CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its CVD and gas control equipment assembly, and unifying its nano-materials lab.
AIXTRON's training and demonstration center in Suzhou, China, will focus on improving MOCVD in advanced semiconductor and LED manufacturing operations around China, as well as on employee and environmental safety in electronics production environments.
Infineon Technologies ordered the Probus-SiC epitaxy film growth tool from TEL for mass production of advanced SiC power devices.
VLSIresearch released its 2011 Top Semiconductor Equipment suppliers rankings, noting important acquisitions and strong spending in lithography tools in 2011. Semiconductor equipment spending was driven by aggressive capacity expansion in the foundry and logic sectors.
Execs from Samsung, IBM, GlobalFoundries and ARM looked to the future at The Common Technology Platform Forum in Santa Clara. They focused on the innovation pipeline for 20nm and 14nm technology nodes, and the role that EUV, FinFETs, TSVs, CNTs and DSA will play.
SAFC Hitech opened a multi-million dollar 270000sq.ft. expansion at its facility in Kaohsiung, Taiwan, increasing capacity for high-quality LED precursor production.
MATHESON debuted the Lasso System, a customer-centric supply chain and inventory management system that can monitor the location and operating status of gas products and other assets in the REAL-Time Gas and Asset Management System.
Twin Creeks Technologies, semiconductor and solar cell manufacturing equipment supplier, debuted its first commercial silicon wafer production system that reduces solar module and semiconductor device wafers by up to 90%.
Riber, MBE tool supplier will work with imec on epitaxy process technologies for next-generation III-V semiconductor CMOS devices.
RASIRC determined that a new wet thermal oxidation process on a RASIRC Steamer enables 87% better wafer throughput than dry oxidation of uniform thin oxides.
Worldwide sales of semiconductor manufacturing equipment totaled $43.53 billion in 2011, representing a year-over-year increase of 9%, shows SEMI. North America surpassed Taiwan as the region with the highest amount of spending.
Worldwide semiconductor revenue is projected to total $316 billion in 2012, a 4% increase from 2011, according to Gartner Inc. This outlook is up from Gartner's previous forecast, made in Q4 2011, for 2.2% growth.
The Global Semiconductor Alliance (GSA), global semiconductor industry association, appointed Ajit Manocha, CEO of GLOBALFOUNDRIES, to its board of directors.
Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the second day: OLED TFT displays, single transistor DRAMs, silicon photonic wires, CNTs, 3D optical interconnects, graphene for RF and sensing, transparent ZnO, epidermal electronic systems, stretchable electronics, ultra-low-k dielectrics, patterning of electroceramics, PRAM (an alternative to NRAM), and inkjet printing of superconducting films.
Edwards Limited uncrated the STP-iXR1606 series magnetically-levitated turbo-molecular pumps (TMP) with fully integrated onboard controllers. Its new rotary design improves throughput by about 40% at high gas flow rates; nearly 90% percent in maximum gas flow.
The 2012 Symposia on VLSI Technology and Circuits, this June in Honolulu, HI, will foster joint interactions among device technologists and circuit/system designers with overlapping technical programs of both symposia, and joint focus sessions on important topics.
centrotherm thermal solutions, a semiconductor-manufacturing-focused subsidiary of centrotherm photovoltaics AG, joined the SEMATECH Front End Processes (FEP) program, and will work with SEMATECH to develop low-temperature processing techniques for next-generation logic and memory devices.
Barclays Capital compiled its 2011 analysis of semiconductor wafer fab equipment (WFE) spending, with a look at the top players and underlying trends by process step.
Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse separates the rising and declining styles of deposition.
Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse looks at trends in wafer cleaning, such as single wafer and bevel clean.
Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse explains changes at the etch step.
Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by step. Barclays looks at the possibilities for ion implant.
Barclays Capital looks at wafer fab equipment trends in 2011, based on Gartner data. Top 5 takeaways? The top 5 vendors continue to gain market share, Intel is a key customer, segment-leading vendors strengthened their holds, intensity edged higher, and changes are in store in 2012.
Tanaka Kikinzoku Kogyo K.K. developed a platinum electrode that produces ozone solution at 40x the efficiency of existing technology.
North America-based manufacturers of semiconductor equipment posted $1.16 billion in orders in December 2011, $1.32 billion in billings, and a book-to-bill ratio of 0.88, according to SEMI. The book-to-bill ratio has been climbing since September 2011. In December, bookings climbed back above the $1 billion mark.
Intel plans $12.5 billion semiconductor capital expeditures in 2012; Samsung plans $12.2 billion. Watch for wide and growing separation between these two companies and their competition, says IC Insights.
Tanaka Kikinzoku Kogyo K.K. developed a ruthenium material able to form a film up to 6x the normal depth for capacitor electrodes used in DRAM, working with Professor Seiji Ogo of Kyushu University.
USCi will develop next-generation silicon carbide (SiC) devices with AIXTRON SE's VP2400 hot-wall CVD tool. USCi plans to install the CVD system in Q3 2012.
Expertech's Compact Thermal Reactor was ordered by a US semiconductor foundry to bolster 200mm wafer capacity. The CTR offers processes for atmospheric and LPCVD, including hydrogen and high-temperature wafer processing.
Air Liquide Electronics completed a series of expansions at its ALOHA manufacturing sites in the US, France and Japan, doubling its advanced precursor production capacity for semiconductor manufacturing applications.
Hine Automation shipped its Star SL-300 single-substrate vacuum transfer system to Annealsys, which will integrate the wafer transfer system onto its MC-200 MOCVD tool for R&D and pilot environments.
Researchers at INCDTIM in Romania will use NanoInk's NanoFabrication Systems Division's DPN 5000 system for supramolecular structure fabrication, molecular recognition and self-assembling process applications.
Michael A. Fury, Ph.D., Techcet Group, reports from SEMI’s International Semiconductor Strategy meeting, with a closing day focused on innovation and new applications.
36% of semiconductor fabs are in high-risk zones, finds Semico, noting the industry disruptions caused by the Japan earthquake and tsunami and Thai flooding and the challenges these presented to chip makers in the regions.
Day 2 of SEMI’s Industry Strategy Symposium (ISS) 2012 included talks by Mike Splinter of Applied Materials, Mark Thirsk of Linx Consulting, Tim Hendry of Intel, David Lazovsky of Intermolecular, a panel session on could computing run by Harvey Frye of TEL, Handel Jones of IBS and another panel session focused on 450mm, moderated by G. Dan Hutcheson of VLSI Research. Michael A. Fury of Techcet reports.
Lita Shon-Roy and Michael Fury, PhD, Techcet will present "CMP Market Outlook & New Technology - Dynamic Slurry Metrology," a free webinar at 2 times on February 22.
The economic outlook for the world is dismal, the semiconductor industry has consolidated and matured to the point where it’s looking for tips from the automotive industry, and unprecedented challenges must be overcome to stay on the path defined by Moore’s Law. Duncan Meldrum of IHS provides a top ten list of economic trends to watch in 2012.
The Industry Strategy Symposium (ISS) kicked off today in Half Moon Bay, CA under blustery skies with choppy seas, an apt metaphor for the information about to be shared inside, says blogger Michael A. Fury, Techcet.
Taiwan became the region with the largest share of installed wafer capacity in 2011, according to IC Insights' Global Wafer Capacity 2011-12 report. This is the first time Taiwan has led the global wafer capacity rankings, with 21% of total in mid-2011.
Semiconductor sales were weaker than expected in Q3 2011, and Q4 shows weak guidance, prompting chip makers to reduce production. Gartner expects this inventory correction to work out in early 2012.
Former SEMI president and CEO Stanley T. Myers was named a director emeritus of the association by itsl Board of Directors. Myers led SEMI for 15 years, was a board member for 24, and has been part of the semiconductor industry for more than 50.
Key points from SEMI's 2012 semiconductor fab equipment spending forecast include a predicted decline of 11% to $35 billion, steady growth in 300mm installs, and an H1 dip/H2 surge format.
Materion Microelectronics & Services added 50% more space in its PVD parts cleaning and surface treatment facility, with an automated robotic twin wire arc spray, increased precious metal refining capacity, new cleaning processes, and a Class 10,000-certified cleanroom.
The GaAs device market recovered sharply in 2010, driven mobile handsets. Increased use of pure-play foundries met the surge in demand and was in-line with a trend toward outsourcing, says Strategy Analytics.
Nocilis Materials opened its silicon foundry service globally. Nocilis Materials AB provides epitaxy service of advanced Si-Ge-Sn-C alloys for electronic and photonic applications.
Defect control at 22nm is a critical focus for chemical mechanical polishing (CMP). Michael A. Fury, Techcet Group, discusses the current companies and trends on the leading edge of CMP for 22nm.
Solid State Technology asked top analysts and technologists to provide insights on the transition to 22nm semiconductor devices. Read through the whole 10-forecast series, or check out the individual articles as you have time to see perspectives on lithography, device architecture, and more.
Soitec (Euronext Paris) completed its acquisition of all of the outstanding shares of Altatech Semiconductor S.A. The final purchase price was EUR15 million.
Gore introduced a 20nm-rated PTFE filter, available in a HDPE cartridge. The filter is optimized for bulk processing high-purity chemicals used in semiconductor and flat panel display manufacturing.
Cambrios Technologies Corporation appointed John LeMoncheck as president and CEO, and announced a $5 million Series D-3 financing round from Samsung Venture Investment Corporation.
The global semiconductor market will see a slow 2012, reports IHS, with economic uncertainty and semiconductor inventory not moving enough to stimulate new production. Expect negative growth in Q1 2012, a nascent rebound in Q2, and strong growth in Q3 2012, IHS reports.
Texas Instruments (TI, NASDAQ:TXN) will close 2 older semiconductor manufacturing facilities in Hiji, Japan and Houston, TX over the course of the next 18 months. Production from these analog chip sites will be moved to more advanced TI facilities.
President Barack Obama visited the Intel Ocotillo campus in Chandler, AZ. The President spoke about Intel's technological innovation, and manufacturing jobs in America.
ABB Robotics introduced an ISO 5 (Class 100) Cleanroom version of the IRB 120, its smallest multipurpose 6-axis robot. Any source materials in the IRB 120 prone to particle generation were modified to eliminate contamination potential in the manufacturing area.
Test Advantage Capital Group, a business of BSE Group, surpassed $150M in its portfolio of semiconductor manufacturing equipment under management. Boston Semi Equipment's fab equipment leasing business also received a $100M annual commitment from its financial backer, Wafra Capital Partners.
Due to stronger demand for TSMC’s 28nm technology and the pull-in of a 20nm R&D process line, the foundry raised its estimate for 2012 capital expenditures from $6 billion to $8-8.5 billion.
As semiconductor nodes shrink, filter manufacturers and cleanroom designers must offer products that remove the smallest possible particles. While hardware can accomplish much of this, the cleanliness of a room is a function of the motion of the employees in the room.
Strong lithography spending, as well as several acquisitions and divestures in the space, brought changes to the critical subsystems of semiconductor/related markets sector, says VLSIresearch.
The corresponding combined revenue opportunity for MBE and MOCVD is estimated to be around US $6.1 billion for the 2012-2020 periods, shows Yole Développement.
With a book-to-bill ratio of 1.13, North America-based manufacturers of semiconductor equipment saw a sixth climb in the ratio, which has steadily improved since it hit 0.71 in September 2011, shows SEMI.
The 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2012) will be held May 15-17 in Saratoga Springs, New York. The conference will feature presentations of more than 85 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features a panel discussion on “Competing for R&D Dollars,” moderated by Solid State Technology Editor-in-Chief Pete Singer.
Brewer Science released new wafer processing equipment for thin wafer separation and post-debond cleaning during compound semiconductor device processing: a thermal debonder, separation tool, and megasonic cleaning system.
Veeco Instruments Inc. debuted the SPECTOR-HT ion beam deposition tool for thin-film deposition in optical products, such as lasers, telecommunications chips, and more.
Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: electronic skin, energy storage with nanowires, printable inks, gas sensing, inkjet printing, semiconductor polymers for organic devices, CNTs, OFETs, touch screen fabrics, and the coffee breaks.
Intel Corporation announced 9 winners of the company's Supplier Continuous Quality Improvement (SCQI) award for outstanding commitment to quality and performance excellence.
Entegris (NASDAQ:ENTG), contamination control and handling system supplier to the semiconductor and microelectronics industries, will build the Entegris i2M Center for Advanced Materials Science in Bedford, MA, near its headquarters in Billerica. i2M denotes ideas to market.
The National Institute of Advanced Industrial Science and Technology in Japan is using its AIXTRON SE BM 300 system to grow monolayer graphene on 300mm wafers.
Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- κ dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.
Intel Corporation announced its 2011 Intel Preferred Quality Supplier (PQS) awards, selecting 19 of its thousands of suppliers. Two suppliers received Intel’s Achievement Award.
This SEMI News and Views blog, written by Jonathan Davis, president, SEMI Semiconductor Business, covers SEMI's efforts with government and policy-shapers in the US and Europe.
Wright Williams & Kelly, Inc. (WWK) opened its 2012 semiconductor industry survey on equipment and process timing. Only participants will receive the full results, free of charge.
The UpTime sub-atmospheric dopant gas delivery system from Praxair Electronics will be Applied Materials' (AMAT's) factory default standard for the Varian VIISta ion implant platform.
IC manufacturers closed 49 wafer fabs between 2009 and 2011, according to IC Insights. Smaller wafer fabs (≤200mm) suffered the most closures, and Japan and North America led the way.
Tool obsolescence is increasingly important to semiconductor manufacturers running 200mm wafer fab lines, reports ISMI, which has chartered an Equipment Obsolescence Forum for alternative sourcing.
Astro Pak Corporation opened its Class 100 and Class 1000 cleanrooms, recently renovated and expanded, in Downey, CA. The cleanrooms host contract precision cleaning for the semiconductor manufacturing, aerospace, and other industries.
Dow Corning will add 2 AIXTRON AIX 2800G4 WW planetary reactor platforms to its silicon carbide (SiC) epitaxy capacity for next-generation power electronics.
EMI added two members its North American Advisory Board: Terry Brewer of Brewer Science and Wayne Mitchell of Air Products.
Coherent Inc., supplier of laser power and energy management instruments, achieved a certificate of accreditation to ISO/IEC 17025:2005 at its Wilsonville, OR calibration laboratory.
University of Warsaw, Poland, researchers will grow GaN materials on a new AIXTRON SE Close Coupled Showerhead MOCVD reactor in a 3 x 2” wafer configuration.
Worldwide silicon wafer area shipments increased slightly during Q1 2012 when compared to Q4 2011 area shipments, according to SEMI. Wafer shipments fell 11% from Q1 2011.
President Barack Obama toured the SUNY - Albany Nano-Tech Complex today, speaking about the economy and education in the CNSE NanoFab Extension Building.
At The ConFab in Las Vegas, TSMC’s BJ Woo, senior director, Graphic/PLD/CPU Business Development Division, will present “Bridging the Fabless-Foundry Gap.”
Barclays Capital updates its wafer fab/semiconductor production equipment (WFE/SPE) capital expenditures expectations for TSMC, Samsung, Intel, UMC, GLOBALFOUNDRIES, SMIC, and Huali.
Bühler’s acquisition of Leybold Optics from EQT III, for an undisclosed sum, was approved without any restrictions by anti-trust authorities.
SPTS Technologies installed a Sigma fxP physical vapor deposition (PVD) system at a Chinese foundry producing RF devices on gallium arsenide (GaAs) substrates.
SENSIRION introduced the SLQ-QT105 semiconductor-grade flow sensor for flow rates below 2cc/sec (120ml/min) of hydrocarbon-based liquids, such as photoresists and solvents.
Nanotrons Corporation launched the SPray Assisted Layer-by-layer Assembly System (SPALAS) for nano-enabled optical coatings on semiconductor, plastic, and glass substrates using layer-by-layer (LbL) self-assembly.
North America-based manufacturers of semiconductor equipment posted $1.18 billion in orders, $1.24 billion in billings, and a book-to-bill of 0.95 in January 2012, according to SEMI.
SEMICON China takes place March 20-22 in Shanghai. Check out the special pavillions and events, and keynote speakers scheduled.
SEMI’s International Strategy Symposium (ISS) meets for its Europe session February 26-28 in Munich, Germany. Following are some of the 450mm wafer presentations scheduled to take place.
AIXTRON SE sold 2 BM Pro 4"-wafer deposition tools to the Italian Institute of Technology for the development and production of graphene used in novel hydrogen storage systems.
MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.
EV Group (EVG) shipped an EVG301 semi-automated single-wafer cleaning system to Tokyo Institute of Technology, for research on advanced optical communication ICs.
Air Products will acquire all of DuPont's interest in DuPont Air Products NanoMaterials LLC (DA NanoMaterials), a 50-50 JV that the companies set up for the semiconductor and wafer polishing industries.
GLOBALFOUNDRIES appointed Magnus Matthiasson, formerly of Philips Lumileds, as chief procurement officer (CPO), reporting to CFO Dan Durn.
The Handbook of Physical Vapor Deposition (PVD) Processing, Edition No. 2 has been released, covering all aspects of PVD process technology, from characterization and preparation of the substrate material, through deposition and film characterization, to post-deposition processing.
A common theme among the presenters at SEMI's ISS Europe was how Europe might bridge the so-called “valley of death” between basic research and volume manufacturing.
EpiGaN NV opened its GaN epitaxial material production site, on the Research Campus Hasselt in Belgium. EpiGaN’s GaN-on-Si material is used in next-generation power electronics.
Axus Technology introduced the Titan Carrier Upgrade for IPEC and Strasbaugh legacy CMP chemical mechanical polishing/planarization (CMP) tools for semiconductor and related manufacturing.
North America-based manufacturers of semiconductor fab equipment posted $1.60 billion in orders and $1.45 billion in billings in April 2012 for a book-to-bill ratio of 1.10, according to SEMI.
Brown University is using supercomputer simulations to better understand the ion bombardment of metal surfaces used in manufacturing nanoelectronics.
Indian River State College in FL will be the first college in the southeastern US to offer students access to the instrumentation and curriculum provided by the NanoProfessor Nanoscience Education Program from NanoInk.
SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30.
North America-based makers of semiconductor equipment posted $1.33 billion in orders in February 2012, $1.32 billion in billings, and a book-to-bill ratio of 1.01, according to SEMI.
The Dow Chemical Company (NYSE: DOW) inaugurated its Dow Seoul Technology Center, a global R&D center with focus on technological advances in display and semiconductor applications.
Dow Electronic Materials released KLEBOSOL II 1730 colloidal silica slurry for CMP of inter-layer dielectrics and post-metal buff.
Taiwan raised investment ceilings for Chinese investors in LCDs, semiconductors, IC assembly and test, microelectronics production equipment, and metal tool manufacturing.
Worldwide semiconductor manufacturing equipment spending is projected to total $38.9 billion in 2012, an 11.6% decline from 2011 spending of $44 billion, according to Gartner Inc.
Fraunhofer IZM and Fraunhofer CNT will use CMP supplier Axus Technology exclusively to provide advanced 300mm wafer process development and foundry services to North American customers.
AMEC installed a second-generation dielectric etch tool, the Primo AD-RIE, at Chinese foundry SMIC. It is the first time AMEC has installed the Primo AD-RIE in China.
CEA-Leti has introduced the “LETI-3S” concept, for “Silicon Specialty Solutions.” The research is oriented to start-ups, component integrators, fabless or fablite chip companies, and equipment/consumable suppliers.
Solid State Technology and SEMI will present the 2012 Best of West product awards at SEMICON West 2012, July 10-12 in San Francisco. Best of West recognizes important product and technology developments in the microelectronics industries.
CEA will extend its collaboration with Arkema beyond photovoltaics into microelectronics and organic electronics, setting up two joint public-private research projects in CEA-Leti and CEA-Liten.
Crossing Automation Inc. formed a business unit around 450mm semiconductor wafer automation platforms. The company has a comprehensive line of 450mm wafer handling products currently shipping to fabs and tool makers.
CVD Equipment completed the sale of its Ronkonkoma, NY, facility, where its Application Laboratory was located. This is part of CVD Equipment’s move to its recently purchased building in Central Islip, NY.
Fujitsu Semiconductor will transfer ownership of its Iwate Plant, a semiconductor wafer fab in Iwate, Japan producing system LSI, microcontrollers, etc., to DENSO.
A leading semiconductor manufacturer placed a follow-on order with Mattson Technology Inc. (NASDAQ:MTSN), wafer fab equipment supplier, for a Millios millisecond annealing system (MSA).
MEI uses Vycom Flametec PVC-C for chemical rinse tanks and other wafer-contacting elements of its process tools, reducing tool-based contamination and protecting fab workers. Bill McGinty, MEI operations manager, discusses the benefits the new-generation plastic for semiconductor fab tools.
Fraunhofer Center Nanoelectronic Technologies is collaborating with bubbles & beyond to jointly develop novel cleaning solutions for the microelectronics industry, specifically, removing lithographic materials from semiconductor wafers.
Siltronic, subsidiary of Wacker Chemie AG, will stop producing 150mm silicon wafers at its Portland, OR, facility in Fall 2012, and will consolidate 150mm production at its Burghausen, Germany, site.
Singulus Technologies Aktiengesellschaft (SINGULUS) received 2 orders for its TIMARIS vacuum deposition system from the semiconductor industry.
Meaglow Ltd., MOCVD and epitaxy supplier, launched a range of nitrogen-rich indium nitride (InN) wafers for research and industry development around the compound semiconductor material.
Researchers from North Carolina State University have developed the first functional oxide thin films that can be used efficiently in electronics, opening the door to an array of new high-power devices and smart sensors.
Owens Design Inc. released multiple customized film frame automated handlers to customers in the semiconductor and LED manufacturing tool industries.
Semiconductor fab equipment spending will remain flat in 2012, says SEMI. But look for a record spend from semiconductor makers in 2013, jumping from $38.85 billion spent in 2012 to $45 billion in 2013.
After only 2 months, semiconductor foundries are already considering raising their 2012 capex budgets, says Terence Whalen, Semiconductor Equipment analyst for North America at Citi.
Materials experts from across the supply chain gathered at the 2012 Strategic Materials Conference 2012 in San Jose in October, discussing key materials needs for micromanufacturing outside the CMOS mainstream: OLEDs and GaN-on-silicon power semiconductors, graphene, CNTs, and self-assembling polymers.
Applied Materials has announced two new tools for display manufacturing: one with a new design for depositing IGZO films for TFTs, the other handling bigger LTPS-deposited substrates to help lower manufacturing costs.
Brooks Automation says it has agreed to acquire privately-held Crossing Automation for $63 million, combining two firms in semiconductor automation technology and services.
Semiconductor manufacturers can expect equipment costs to increase about 15% for each new process node, but previously enjoyed advantages of moving to smaller feature sizes are no longer offsetting those costs -- even with a 450mm wafer transition.
Wafer demand is slowly turning back toward growth, and a closer look at the numbers from SEMI and Semico Research shows what's behind the trends -- and why they give purchasing managers headaches.
In case anyone needed a reminder or a wake-up, new data from SEMI reiterates chip tool sales are slumping badly in the latter part of this year.
At SEMICON Europa, European government representatives, consortia, and suppliers discussed programs to support and participate in the 450mm wafer-size transition -- including a comprehensive presentation from ASML about its roadmap for 450mm EUV platforms.
Intel spoke of caution in end markets when discussing its 3Q12 results, but a big dip in capex and lack of 2013 visibility will likely cause concern in the semiconductor manufacturing ecosystem.
SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.
The Global Semiconductor Alliance (GSA) says it has formed a Technology Steering Committee to help address key business and technology areas of interest to its members, and "encourage the advancement and adoption of leading technology and practices."
In the seventh installment in a series called Process Watch, the authors discuss cycle time and the impact of inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.
With this week's IEEE International Electron Devices Meeting (IEDM 2012) now underway, here are four of the papers that were accepted late: on 90nm integrated silicon photonics, ZnNO for next-gen displays, and III-V TFETs for the 7nm node.
At the International Electron Devices Meeting in San Francisco, An Chen of GLOBALFOUNDRIES presented a survey of emerging nanoelectronic devices, which he divided into two categories: Charge-based and non-charge based.
Attendees at this year’s International Electron Devices Meeting (IEDM) were delighted and perhaps somewhat horrified when the plenary speaker popped some electronics gear in his mouth and proclaimed, “It tastes like chicken!”
STMicroelectronics has a new strategic plan that will focus on five product areas (MEMS/sensors, smart power, automotive products, microcontrollers, and application processors), and also exit its mobile chip JV with communications giant Ericsson.
Semiconductor equipment demand is persistently sluggish as the industry takes a break from a "multiyear expansion period" to digest recent investments and wrestle with a broader economic slowdown, acknowledges SEMI in its updated year-end forecast. But make no mistake: leading-edge technology investments are still happening, and growth will return in the typical cyclical pattern.
Axcelis Technologies, Inc. (NASDAQ: ACLS) and Lam Research Corp., (NASDAQ: LRCX) announced a strategic collaboration agreement focusing on the interrelationship between ion implantation, etch processes, and photoresist strip applications.
KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers.
The global market for consumables used in chemical mechanical planarization (CMP) operations continues to rebound, as "magic triangle" combinations of slurry, pad, and conditioner are emerging to improve performance for ≤45nm requirements, reports TechCet Group.
After a nice spurt in 2Q12, worldwide silicon wafer area shipments fell back to a -slight decline in 3Q12, according to updated data from SEMI, and remain on track for cautious projections of flat growth for the full year.
Updating its "top 20" semiconductor supplier rankings from earlier this year, IC Insights finds most of the same trends holding true: a tough year overall for chipmakers, but fabless and foundry firms still showing very good growth.
In the sixth installment in a series called Process Watch, the authors discuss the ins and outs of parametric correlation when using measurements based on reflectometry, ellipsometry, or a combination of the two. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.
Soitec says it has more than doubled production of bonded silicon-on-sapphire (BSoS) substrates to meet increased demand from partner Peregrine Semiconductor, which has surged its own production capacity for RF switches used in cellular handsets, including the newest iPhone 5.
FEI, Hillsboro, OR, has introduced its new Helios NanoLab 450 F1 DualBeam system designed to provide faster, better images of their most advanced device architectures.
imec announced two research collaboration efforts to advance STT-MRAM technology, an alternative high-density memory technology. The developments include working with Canon Anelva Corp. on its deposition tool and working with Tokyo Electron (TEL) on its Tactras etch tool, both installed in imec’s 300mm cleanroom.
Wide bandgap semiconductor materials can significantly outperform traditional silicon-based devices in power electronics and light-emitting diodes (LEDs), but they're vastly more expensive. So where's the midpoint where GaN's capabilities and extra costs align to make it the preferred technology for each application?
This year's International Conference on Planarization/CMP Technology (ICPT) encompassed five themes describing use of CMP: new device structures, equipment and methods, Cu interconnects, consumables, and new CMP methods and processes.
EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services.
A reference book from the Global Semiconductor Alliance (GSA) and IC Insights puts foundry information at the fingertips of those who need it the most.
Sales of electronic gases are seen growing a modest 3.2% growth overall in 2012, following a 15% increase in 2011 to $3.1B, according to an updated report from Techcet Group.
The latest monthly numbers for semiconductor manufacturing equipment demand aren't pretty: lows in both orders and sales not seen since the last major downcycle three years ago, and the short-term comparisons continue to widen.
TELEFUNKEN Semiconductors is expanding its manufacturing capacity at the Roseville, California facility, to 220,000+ 8 inch wafers.
Rolla, MO-based Brewer Science introduced a line of conductive CNT ink materials that are surfactant free, require no additional rinse steps, and are compatible with a broad range of printed electronic substrates.
We've scanned the entire conference program for next week's 58th annual IEEE International Electron Devices Meeting (IEDM), to present a quick sampling of some of the more intriguing papers.
Researchers have demonstrated a technique for growing virtually pure samples of single-wall carbon nanotubes (CNT) with identical structures, a process likened to "cloning" them -- and possibly an important step toward controlling their manufacture for future electronic devices.
Applied Materials is combining its Display and Energy and Environmental Solutions (EES) under one roof led by former KLA-Tencor exec Ali Salehpour, which also means the departure of those two units' current leaders, Mark Pinto and Tom Edman.
Industry watchers have been lowering their outlooks for 2013 over the past few weeks, but there's one set of opinions that still see optimism for an industry rebound in 2013 -- chip industry executives themselves.
Nikon and the Singapore A*STAR IME are jointly setting up a R&D lab to develop optical ArF lithography technology for semiconductor manufacturing to and below the 20nm device node.
Global spending on wafer fab equipment (WFE) is now on pace to finish 2012 with a -17% annual decline, and 2013 now looks like it'll only be slightly better at a -10% dropoff, before the next cyclical spending upturn begins in 2014, according to an updated forecast from Gartner.
Ultratech has acquired the assets of Cambridge Nanotech, a developer and supplier of atomic-layer deposition (ALD) technology, which had quietly been put on the auction block after ceasing operations in November.
Canon U.S.A., Inc. recently launched the FPA-3030i5+ i-line stepper, designed for the manufacturing of LEDs, MEMS and power semiconductors.
Samsung's reaffirmation of its planned $4B investments in its Austin, TX facilities don't offer much extra info, but do serve as a message to the market about its future plans -- with or without Apple.
In the third installment in a series called Process Watch, the authors discuss some of the challenges of 450mm wafers. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.
IC Insights released a Q2 update to its top-20 ranking of semiconductor companies. Three pure-play foundries are in the top 20 ranking, with a cumulative increase of 20% from Q1 2012 to Q2 2012.
The ConFab, Solid State Technology’s invitation-only event for the semiconductor industry, took place in June, with presenters from top companies and analyst firms. If you couldn’t be there, check out all the coverage from the event -- reports, presentations, video interviews and more.
Semiconductor foundry United Microelectronics Corporation (NYSE:UMC; TWSE:2303) gained LEED-NC Gold recognition for its 300mm Fab 12A P3 & P4 in Tainan, Taiwan, from the U.S. Green Building Council.
Crossing Automation, Inc. announced three new options for the Spartan 300 that deliver an end-to-end contamination-free sorter environment. The new options target high volume manufacturing at 32nm and below.
CGI Americas is introducing the QMO Series inert gas and vacuum ovens and MOL Series Class 100 cleanroom ovens, based on the SMO Series precision ovens from C Sun, to the North American market.
Pfeiffer Vacuum introduced the Sputter Process Monitor SPM 220 and High Pressure Analyzer HPA 220 gas analysis systems to monitor and document vacuum processes.
Teknek debuted an elastomer roller care system for all contact cleaning rollers. Unlike IPA cleaning, the elastomer Roller Doctor rejuvenation pad exfoliates the roller surface with a precise quantity of proprietary cleaning solution.
EMCORE, compound semiconductor-based components and subsystems supplier, will replace multiple legacy manufacturing systems in its compound semiconductor fab and back-end packaging operations with the Camstar Enterprise Platform.
Solid State Technology and SEMI today announced the finalists for the 2012 “Best of West” awards, recognizing important product and technology developments in the microelectronics supply chain.
CEA-Leti installed a CVD tool from Altatech, a subsidiary of Soitec, to research sub-20nm phase-change memory (PCM) and high-k metal gate (HKMG) semiconductor devices.
Edwards (NASDAQ:EVAC) introduced the new iXH645H dry pump, optimized for metal-organic chemical vapor deposition, a key step in LED and compound semiconductor manufacturing.
JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.
Worldwide wafer fab equipment spending will total $33 billion in 2012, down 8.9% from 2011’s $36.2 billion spending level, say Gartner analysts. Chipmakers will spend more than $35.4 billion on WFE in 2013, ramping 7.4% over this year.
Linde North America is expanding its capacity to supply ultra-high purity (UHP) gases to a major global semiconductor manufacturer’s Pacific Northwest location.
Semiconductor manufacturers will spend $2.3 billion in 2012 for flow control and treatment products, shows McIlvaine Company. Even more pure water is required as the line sizes on chips are decreasing. This aspect, coupled with the opportunity for water reuse, is creating new opportunities.
North-America-based manufacturers of semiconductor fab equipment posted $1.61 billion in orders worldwide in May 2012, $1.54 billion in billings, and a 1.05 book-to-bill ratio, shows SEMI.
The Semiconductor Industry Association (SIA) presented its 2012 University Researcher Awards to Stanford University professors Krishna Saraswat and Bruce Wooley as well as its 2012 Congressional Leadership Awards to Sen. Carl Levin, Sen. John McCain, Rep. Kevin Brady and Rep. Wally Herger.
Semiconductor foundry United Microelectronics Corporation (NYSE:UMC; TWSE:2303) has licensed IBM technology to expedite the development of its 20nm CMOS process with FinFET 3D transistors.
Maxim is spending $200 million to upgrade and expand its US semiconductor manufacturing facilities in San Antonio and Dallas, TX; Beaverton, OR; and San Jose, CA. Maxim manufactures about 50% of its products in the US.
Cambridge NanoTech entered a licensing agreement with Ghent University in Belgium to commercialize an ALD particle coating technology that uses thermal and plasma processes.
Semiconductor manufacturers identified key factory productivity challenges that need to be addressed and shared effective solutions they will need to stay leading-edge and competitive amid turbulent industry transitions during the recent ISMI Manufacturing Week.
Applied Materials introduced a new dielectric etch system called the Centura Avatar, which can etch holes and trenches in complex film stacks with depth to width aspect ratios of up to 80:1. It is designed to meet new requirements in creating 3D memory architectures.
IC Insights’ latest survey and ranking of the major semiconductor capital spenders shows that only 6 of the 35 major semiconductor suppliers -- Intel, Samsung, Hynix, TSMC, UMC, and Rohm -- with significant capital expenditure budgets are expected to spend more in 2012 than they did in 2011.
BSE Tech, a BSE Group company, sold diffusion equipment for front-end semiconductor production to Microchip Technology Inc. The equipment will be used in the production of PIC microcontrollers in Microchip’s Tempe, AZ, fab.
SEMICON West kicked off with a surprise announcement regarding Intel's investment in ASML, but generally the event highlighted trends “as expected” in the fab supply chain, say Barclays analysts.
Terry Brewer, one of the newest members of SEMI's North American advisory board, talks about semiconductor industry consolidation, as well as new technologies and materials in the industry. He shares how SEMI is reacting to this evolution.
The overriding message for 2012 is that the roadmap has been largely
stabilized with the significant changes that were input last year in the
2012 publication,” said Intel’s Alan Allan, speaking at Semicon West.
Newport Corporation introduced a line of high-performance air bearing stages specifically designed for the 450mm semiconductor wafer initiative.
At SEMICON West, SEMI honored six industry leaders for their outstanding accomplishments in developing standards for the microelectronics and related industries.
CEA-Leti presented research updates alongside SEMICON West this week. After the talks on device architecture, 3D and 2.5 packaging interconnects, large-scale computing and power consumption, and more, CEA-Leti’s researchers joined Solid State Technology to talk about their fields of interest.
Barclays Capital is seeing various reasons for a Q3 2012 semiconductor fab order/shipment pull-back, following meetings around SEMICON West 2012. The analysts expect strong orders in Q4.
After meeting with various semiconductor manufacturing tool suppliers -- Applied Materials, KLA-Tencor, Lam Research, Tokyo Electron, Teradyne and Cymer -- at SEMICON West, Citi analysts share impressions on foundry spending plans and tool choices.
Industrially proven and robust, picosecond lasers are proving their worth in cutting and patterning of delicate materials for a wide variety of industrial applications.
Sanjay Rajguru, director of ISMI, will present “Tool Obsolescence and the Impact on 200mm Manufacturing” at The ConFab 2012’s final session, Maximizing the Longevity of Investments.
Picosun Oy delivered a second PICOSUN ALD tool to Uppsala University’s Ångström Laboratory in Sweden for work on surface treatment of carbon nanostructures, transition metal and compound semiconductor thin film manufacturing, and ultrathin polymer layer deposition on various substrates.
Element Six, maker of synthetic diamond supermaterials, opened its first US manufacturing facility in Silicon Valley, housing production, technical, and customer service.
In this first installment of a series called "Process Watch,” experts from KLA-Tencor explain why a defect might be classified as “Not Found” or “SEM Non-visual (SNV),” and how a SNV count can disguise or hide real problems.
Mike Fury reports on Day 2 of the 15th IITC (International Interconnect Technology Conference), from San Jose, CA.
At The ConFab 2012, fabless companies and foundries have a common goal: reduce power, increase performance and reduce price (not necessarily in that order).
Chip scaling will go on for the foreseeable future, enabling new product with more compute power, more memory, faster on-chip communication. That was one of the conclusions put forth by imec’s An Steegen, speaking on technology trends at The ConFab 2012.
The 15th IITC (International Interconnect Technology Conference) opened Monday, June 4 at the Doubletree Hotel in San Jose, CA. Recurring themes this year were variations on 3D and TSV, novel systems and packaging, and back end memory. Mike Fury reports.
Semiconductor manufacturing facilities dramatically decreased their normalized fab energy consumption from 1997 to 2011, shows ISMI's Worldwide Fab Energy Study.
John Chen of Nvidia gave the opening keynote address of The ConFab 2012, presenting the concept of a “virtual IDM” comprising fabless companies, semiconductor foundries, and packaging houses working seamlessly together. After his speech, Chen caught up with Pete Singer.
Dan Hutcheson, VLSI Research Inc. spoke with Solid State Technology editor-in-chief Pete Singer at The ConFab 2012. Hutcheson presented on the cyclical nature of the semiconductor industry.
At The ConFab’s opening session, “The Economic Outlook for the Semiconductor Industry,” capex was a major point of interest. Jackie Sturm of Intel, Dan Hutcheson of VLSIresearch, and Jim Feldhan of Semico all touched on it, with Hutcheson expanding on the idea of capex trends to present an entire ecosystem of semiconductor business management.
The ConFab 2012, Solid State Technology’s invitation-only meeting of the semiconductor industry, opened today in Las Vegas with a keynote address from John Chen, PhD, VP of technology and foundry operations at Nvidia Corporation.
A*STAR Institute of Microelectronics and NXP Semiconductors (NASDAQ:NXPI) will collaborate on 200mm GaN-on-Si process and technology development for high-voltage power devices.
Michael A. Fury reports on the NCCAVS CMP Users Group meeting, held on May 16th.
At imec's International Technology Forum, An Steegen, Senior Vice President Process Technology at imec, discusses the three technology knobs that are key for a further system scaling.
At imec's International Technology Forum, the research consortium's CEO, Lec van den Hove, draws attention to the need for the industry to solve the world's health problems.
At imec's International Technology Forum, Greg Bartlett, CTO of GLOBALFOUNDRIES, said the key to survival in the semiconductor industry is adaptability and collaboration.
THE BEST rankings from VLSIresearch identify the highest-rated suppliers of wafer processing, assembly, and test equipment. Check out the top-rated suppliers of wafer processing equipment, by company size and customer ranking.
At imec's International Technology Forum, SEMI's Denny McGuirck describes how Moore's Law has been the major driver in the semiconducotr industry.
VLSIresearch polled semiconductor manufacturers about their tool suppliers, asking chipmakers to rank equipment providers on customer satisfaction. This year’s results show renewed focus on fab needs.
Blogger Michael A. Fury, Ph.D., Techcet Group, reports on Day 2 of SEMICON West with insights from the Sokudo Lithography Forum and NCCAVS CMPUG meeting, and -- sadly -- none on SEMICON West’s Happy Hour.
Pall Corporation, filtration, separation and purification technology provider, joined the International SEMATECH Manufacturing Initiative (ISMI) program on equipment productivity and factory automation projects to address equipment stability and sustainability challenges as well as next-generation processing issues.
ATMI Inc. (NASDAQ-GS:ATMI) entered into a joint development agreement with IBM to address critical wet process challenges at the14nm semiconductor node and smaller.
ASM International (ASMI) launched advanced deposition systems for epitaxy, PEALD and PECVD. The 2 tools enable high-volume 300mm wafer processing for 20nm and smaller nodes and 3D transistors.
Luc Van den hove, president and CEO, imec, spoke with Solid State Technology, covering imec’s major announcements and research presentations to take place during SEMICON West 2012.
Semiconductor equipment sales will reach $42.4 billion in 2012, according to the mid-year edition of the SEMI Capital Equipment Forecast, released at SEMICON West 2012.
Michael A. Fury, Ph.D., reports from the pre-opening day (July 9) of SEMICON West at the Moscone Center in San Francisco, CA. The first day hosts SEMI’s press conference on semiconductor revenues and the SEMI/Gartner Market Symposium.
SEMI’s annual Board of Directors election results are in, with new directors Jifan Gao, Trina Solar; Nobu Koshiba, JSR Corp.; Sue Lin, Hermes-Epitek; and Natsunosuke Yago, Ebara Corp., joining.
imec will build a 450mm wafer fab cleanroom at the research organization’s site in Belgium, with a new EUR100 million Belgian investment. We caught up with Luc Van den hove of imec to discuss the implications for semiconductor manufacturing at 450mm, how to build a 450mm-capable cleanroom, and more.
Following are some of the new and flagship products that will appear this week at SEMICON West, July 10-12 in the Moscone Center of San Francisco, CA.
We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco.
Vantage Technology formally qualified its SlurryScope System for analysis of undiluted slurry used during CMP at major IC production fabs.
Linde Gases, a division of The Linde Group, will deliver on-site fluorine (F2) for SK Hynix Inc., under a new long-term supply contract for multiple volume semiconductor production sites in Korea.
In the second installment in a series called Process Watch, the author provides tips on how to make sure you’re reviewing the yield killing defects and not wasting time reviewing nuisance events. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions for chip manufacturing at the leading edge.
STMicroelectronics announced that GLOBALFOUNDRIES has agreed to manufacture devices for ST using ST’s proprietary Fully Depleted Silicon-on-Insulator (FD-SOI) technology in both the 28nm and 20nm nodes.
Speaking at The ConFab 2012, Sanjay Rajguru, director of ISMI, pointed out that more than half the current fab capacity today comes from facilities that are more than ten years old, which is creating a problem with equipment obsolescence.
Tom Jefferson, G450 Consortium, shares an update on 450mm wafers for semiconductor manufacturing. The consortium is adding staff and ramping its silicon supply, and getting ready for equipment selection.
Applied Materials introduced the Applied Varian VIISta Trident single-wafer, high-current ion implant system, which embeds dopant atoms on 20nm semiconductor wafers at high yields.
Bill Ross, ISMI, is moderating a session today at The ConFab 2012 on managing legacy semiconductor fabs and dealing with tool and materials obsolescence at 200mm and smaller. He speaks with Pete Singer about coping with these changes.
Fab equipment spending has improved in 2012, breaking the barrier into positive growth for the year, shows SEMI. Semiconductor makers will invest $39.5 billion in fabs, up 2% from 2011 spending. Fab capex will hit a record in 2013, $46.3 billion or 17% above 2012.
Optomec’s Aerosol Jet deposition tools are being used for printed sensor, display, solar cell, CMOS and passive devices, and other development areas, with new installations at CEA Liten (France), Innovation Lab (Germany) and the University of Sheffield (UK).
While communications make up the bulk of analog IC sales, growth is coming from automotive, energy, mobility, and medical/healthcare apps, according to Semico. This semiconductor sector is also moving to 300mm wafer production at smaller device nodes, which offers cost advantages.
AIXTRON SE introduced a 5 x 200mm gallium nitride on silicon (GaN-on-Si) reactor design for its G5 Planetary Reactor MOCVD platform. AIX G5+ comprises special reactor hardware and process design, developed with customers in AIXTRON’s R&D lab.
GLOBALFOUNDRIES will add 90,000 more square feet of semiconductor manufacturing space to Module 1 of Fab 8 in NY. The completed semiconductor manufacturing area will total 300,000sq.ft.
Mattson Technology installed its paradigmE etch system at a major foundry, expanding the tool's customer base.
SEMI recently conducted a survey of semiconductor fab equipment and materials suppliers, finding that 60+% of respondents say that IP challenges have had an adverse impact on their companies.
SiC is a niche material for semiconductor, power electronics, and LED manufacturing. Yole analyzed patents related to SiC growth and wafer manufacturing to glean trends in production, R&D, top companies, barriers to entry, and more.
RED Equipment’s Carl McMahon suggests a different model for handling secondary semiconductor equipment for greater efficiency, cost reduction and quality control: full turnkey services engineered to the fab’s needs without the expense of customization.
IPC and JPCA released their first operational-level standard for the printed electronics industry, defining terms and establishes basic requirements for substrate materials used in printed electronics: ceramic, organic, metal, glass and other.
"Following seven months of increases, the three-month average bookings declined in June and likely reflects some slowing in investment plans attributed to weaknesses in the broader economy," said Denny McGuirk, SEMI. "While order activity may slow, equipment spending this year will continue to be directed towards advanced technologies in wafer processing and packaging assembly."
Ultratech Inc. (UTEK) shipped its 50th laser spike anneal (LSA) system, with an order from a major Asian foundry.
The 2012 TechConnect World Summit, Expo & Showcase opened Tuesday, June 19, 2012 at the Santa Clara Convention Center. The event serves as host to the National Innovation Showcase, whose mission is to accelerate the commercialization of “the world’s top innovations.”
In mid-2011, semiconductor manufacturing and assembly equipment supplier Applied Materials (NASDAQ:AMAT) acquired Varian Semiconductor Equipment Associates Inc. Now, the company is adding Varian’s former CEO Gary Dickerson as president.
Some of the new and flagship wafer fab products and supporting facility products, like vacuum valves, that will be on the show floor at SEMICON West, from ion implant to MOCVD traps and gas blenders.
H-Square Corp introduced its 450mm Ergolift for handling new 450mm semiconductor wafer FOSB/MACs, which can weigh more than 60lbs.
imec and Panasonic Inc. have entered into the next phase of a comprehensive and broadened collaboration agreement for joint R&D on healthcare, wireless communication, flexible electronics and advanced CMOS process technologies.
Older production facilities face equipment obsolescence; skills obsolescence; scarce availability of parts, software, and support; and equipment capability extension and tool re-use. At the ConFab 2012 Executive Roundtable, representatives from Sematech/ISMI, IDMs, OEMs, equipment dealers, and industry consultants gathered to have an open discussion on concerns, roadblocks, and possible solutions.
Semiconductor manufacturing equipment billings and bookings were virtually tied in Q1 2012, reports SEMI, with $10.61 billion in billings and $10.07 in bookings. This is a 13-14% improvement sequentially, and 9% below the same quarter last year.
Researchers at Rice U. and the Université catholique de Louvain in Belgium have devised a method for converting discarded silicon into a key material for lithium-ion batteries.
As the dust settles after the launch of the iPhone 5, analysts tally which suppliers in the semiconductor ecosphere are most likely to gain the most.
Dow Electronic Materials introduced its new IKONIC polishing pad platform for chemical mechanical planarization (CMP).
Samsung Electronics Co., Ltd., held a groundbreaking ceremony for a major new memory fabrication line in Xi'an, China. Once completed, the new facility will make use of advanced 10-19nm technology to produce NAND flash memory chips, according to the company.
Global demand for semiconductor manufacturing equipment slipped -4% in 2Q12 with softness in just about every region -- except Taiwan which stepped on the pedal during the quarter, according to updated data from SEMI and SEAJ.
Researchers at the Norwegian University of Science and Technology in Trondheim (NTNU) have patented and are commercializing GaAs nanowires grown on graphene.
A team led by University of Toronto physicists has developed a simple new technique using Scotch poster tape that has enabled them to induce high-temperature superconductivity in a semiconducto.
Semiconductor Research Corporation (SRC) recognized two outstanding professors in SRC-supported, chip-related research and education for 2012.
Analysts weigh the reasons behind Intel's downwardly-revised 3Q12 results, from macroeconomic sluggishness to tablet-PC cannibalization -- and whether its pullback in 2012 capex plans spells trouble for the market overall.
While various industry segments appear to be tapping the brakes, others are revving their engines, observes SEMI's Christian Gregor Dieseldorff -- and a 2012 stall could pave the way for a record-breaking 2013.
Spending on R&D by semiconductor companies worldwide is expected to grow 10% in 2012 to a record $53.4 billion, as companies all across the ecosystem try to keep up with more complex IC designs and new process technologies, according to data from IC Insights.
Three leaders in their respective fields have formed a technology alliance to bring a new glass cutting technology to market. InnoLas Systems GmbH licensed process technology developed by FiLaser LLC and will use ultra-short pulse lasers produced exclusively for InnoLas by LUMERA LASER GmbH.
Laser nanofabrication can now meet the needs of submicron and nanoscale feature size manufacturing, and can operate in air, vacuum, or liquid processes. Sister publication Industrial Laser Solutions recently published Laser nanofabrication: A route toward next-generation mass production.
In this SEMI News and Views blog, Karen Savala covers EUV lithography, 450mm wafers, and 3D IC developments, based on her recent presentation at SEMICON West, “Supply Chain Readiness in an Era of Accelerated Change.”
AIXTRON launched the PRODOS-200 PVPD system for deposition of organic thin film materials, used to make OTFT displays and OLEDs, and in other manufacturing applications.
Citing continued financial struggles in Europe, an inventory buildup at TSMC, and lower US GDP, Semico revised its 2012 semiconductor industry forecast from 8-10% to 6-8%.
Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.
Soitec and Shin-Etsu Handotai (SEH) have extended their cooperation in Soitec's Smart Cut technology with an extended 10-year licensing agreement, including a new level of joint technology cooperation, to facilitate development and wafer supply of silicon-on-insulator (SOI) wafers.
Azzurro and Epistar say they have achieved GaN-on-Si based high-brightness LEDs on 150mm GaN-on-Si substrates, billed as "one step further towards implementation in mass production."
Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”
Imec, the research consortium in Leuven, Belgium, plans to start construction of a 450mm pilot line next year, with early production focused on sub-10nm devices starting at the end of 2016.
Global semiconductor market revenue in Q2 2012 fell by 3% Y/Y to $75.2 billion, and grew sequentially <3%, resulting in widespread revenue declines for chip suppliers, particularly those headquartered in Japan and Europe, according to IHS.
H2 2011 saw slow growth for gallium arsenide (GaAs) substrates in semiconductor and related devices, as well as a shift away from GaAs as a handset switch technology. However, the March 2011 earthquake and tsunami in Japan disrupted the supply chain, driving up substrate pricing and overall revenue to nearly $230 million.
Semiconductor foundry United Microelectronics Corporation (NYSE:UMC; TWSE:2303) will close its fab operation in Japan through the dissolution and liquidation of its wholly-owned subsidiary, UMC Japan.
Learn about the changes in semiconductor manufacturing as well as related markets -- photovoltaics, displays, LEDs, etc -- at the 2012 Strategic Materials Conference (SMC), to be held on October 23-24 in San Jose, CA. SEMI reports.
ASMC 2013, the leading international technical conference for exploring solutions to improve collective microelectronics manufacturing expertise, has issued a call for papers.
An unnamed "major Asian customer" will use Aixtron's Prodos polymer PVD tool to deposit organic polymer thin films for production of flexible electronic devices.
Samsung Austin Semiconductor LLC says it will spend "about $4 billion" to renovate and retrofit its existing facility for "full system LSI production," mainly to produce mobile SoCs on 300mm wafers using 28nm process technologies.
Applied DNA Sciences, a provider of DNA-based anti-counterfeiting and security solutions, was named by the DoD Defense Logistics Agency as the provider of authentication services for microcircuits supplied by defense contractors.
"Bookings and billings for North American semiconductor equipment in July are close to values reported exactly one year ago," said Denny McGuirk, SEMI, noting seasonally slow investment activity.
Matheson has acquired a majority stake in RASIRC, supplementing its gas purification and material businesses with RASIRC's water vapor systems.
Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, is poised to celebrate its 30th anniversary at its annual TECHCON conference Sept. 10-11.
Two extensions to Brooks Automation's vacuum quality monitoring (VQM) components make it easier to measure gases and conditions inside a vacuum chamber.
SEMI's new "450 Central" information portal offers news and perspectives about the 450mm wafer-size transition.
AKHAN Technologies is sharing characterization data relating to its Miraj Diamond materials, gleaned in collaborative work with the CNM at Argonne National Laboratory.
At a meeting of its Board, TSMC approved capital appropriations to expand and upgrade advanced technology capacity, and to construct a semiconductor fab building.
Printing is emerging as a technology that can replace traditional photolithography processes for electronics manufacturing, reducing costly material use, very complex processes, and expensive equipment.
National Central University (NCU) in Taiwan will use an AIXTRON MOCVD system to research GaN-on-Si power semiconductors.
Worldwide silicon wafer area shipments increased during Q2 2012, compared to Q1 and to Q2 2011, reports SEMI’s Silicon Manufacturers Group (SMG).
Tokyo Electron Limited and FSI International entered into a definitive agreement under which TEL will acquire FSI for approximately $252.5 million.
ON Semiconductor has joined imec to collaborate on the development of next-generation GaN-on-Si power devices. ON Semiconductor is presently building a GaN processing line in its Oudenaarde facility in Belgium Oudenaarde, and it is expected to employ GaN-on-Si technology.
Applied Materials says it will reduce its work force by between 6% and 9% (900-1300 positions) amid a global realignment deemed necessary to achieve certain strategic objectives, freeing up to $190M annually "to fund key growth initiatives."
Fab equipment spending continues to soften in 2012, and hopes for a reprieve in 2013 are waning, warns one analyst.
Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy, the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.
Intermolecular says that it is working with both GlobalFoundries and IBM to speed development of manufacturing technologies down to the 10nm node, using its High Productivity Combinatorial (HPC) technology.
Researchers at the U. of Illinois have devised a method to monitor a semiconductor surface as it is etched, in real time, with nanometer precision.
Axcelis Technologies said it has signed a five-year $30M contract with "one of the world's leading semiconductor manufacturers" to support its implant, cleaning, and thermal processing equipment at multiple fabs in the US.
Driven by market demand, the semiconductor industry is progressing toward consensus on building-block standards for automating LED production on 6-in wafers, explains Paula Doe in an article for SST sister magazine LEDs Magazine.
Tezzaron Semiconductor is taking over SVTC Technologies' wafer fab in Austin, TX, amid reports that the semiconductor/MEMS development organization is cutting back activities in Austin and in California.
Researchers at Cornell have developed a new laser-based method for ultra-fast anneal of thin photoresist films. The research, sponsored by Semiconductor Research Corporation (SRC), has shown that the new anneal outperforms state-of-art hotplate bake for both 193nm and EUV lithography applications.
Researchers have begun to investigate a new 2D material—molybdenum sulfide (MoS)—which has similar characteristics but offers something graphene doesn’t: a wide energy bandgap, enabling transistors and circuits to be built from it directly.
At the upcoming International Electron Device Meeting, Macronix researchers will describe how they built flash memories that could heal themselves by means of tiny onboard heaters that provide thermal annealing just at the spots where it is needed.
In an invited paper at the International Electron Devices Meeting, researchers from Everspin Technologies will describe how they built the largest functional ST-MRAM circuit ever built, a 64-Mb device with good electrical characteristics.
At the International Electron Devices Meeting (IEDM) in December, a team led by IBM will report on the world’s first high-performance hybrid-channel ETSOI CMOS device.The researchers built a ring oscillator circuit to benchmark performance that worked even better than FinFETs.
Even with the persistent troubles in global economics and various technology hurdles in advanced semiconductor manufacturing, IC market growth will continue to improve -- and the key is a shift away from what's been driving the market dynamics, explains IC Insights.
The Institute of Metal Research (IMR) at the Chinese Academy of Sciences has ordered a new Aixtron tool to support its research in carbon nanotubes and graphene technologies.
Semi-Gas Systems is now offering an automatic gas sampling system that eliminates operator touch time while certifying cylinders of blended gas mixtures.
The semiconductor equipment maker is battening down the hatches to reduce costs and improve profitability in the face of near-term macroeconomic conditions.
LFoundry says it will invest a total of €25 million in R&D and innovative projects over the next three years, thanks to " the materialization of several large-scale projects."
At IEDM, IBM researchers will demonstrate high-performance state-of-the-art CMOS circuits —including SRAM memory and ring oscillators—on a flexible plastic substrate.
ProPlus Design Solutions, Inc. unveiled NanoYield, yield prediction and optimization software for memory, logic, analog and digital circuit design.
EV Group says it has received an order for its EVG850 temporary bonding/debonding systems from a leading maker of compound semiconductor-based components, what it says is the first use of its ZoneBOND technology in this area.
Sumitomo Chemical has joined the Holst Center's shared research program on printed organic lighting and signage, to contribute to research into multilayer solution processes for high-efficiency organic light-emitting diodes (OLEDs).
During sessions at this month's SEMICON Taiwan, execs from TEL, Lam Research, Applied Materials and KLA-Tencor revealed the latest developments in 450mm technology.
TriQuint Semiconductor says it has received a $2.7M contract from the Defense Advanced Research Projects Agency (DARPA) to triple the power handling performance of gallium nitride (GaN) circuits.
Demand for chip tools fell again in August and is off by -30% from its peak in early summer, fulfilling fears that the second half of 2012 will be sluggish for chipmaking investments, according to the latest data from SEMI.
At this year’s International Electron Devices Meeting (IEDM), foundry TSMC will describe a heterogeneous epitaxial growth process which for the first time enables Ge to be directly grown on Si.
The first working 3D NAND flash memory at sub-40nm feature sizes will be described by Macronix researchers at this year’s International Electron Devices Meeting (IEDM).
At this year’s IEDM, a team led by Korea’s Gwangju Institute of Science and Technology will detail a high-speed pattern-recognition system comprising CMOS “neurons” and an array of resistive-RAM (RRAM)-based “synapses,” which demonstrated STDP, a brain-like function.
A book-to-bill of 1.08 means that $108 worth of orders were received for every $100 of product billed for the month.
EPIC, the European Photonics Industry Consortium, has published a public database of more than 5000 company entries, an interactive map, and a report on the photonics ecosystem in Europe.
Outlook for semiconductor equipment market improves, but remains soft in the short term.
Rozich, who previously was a member of the company’s board, succeeds Michael R. Polcari, who served as chairman since November 2009.
Total inventory held by semiconductor suppliers declined significantly in the first quarter as excess stockpiles created during the global economic malaise of 2012 were cleared away, done in anticipation of a resurgence in consumer demand for electronic products expected by the second half of 2013.
Markets predicted by Maxtech International to reach >$5B by 2015.
Industry’s newfound maturity yields growth amid adversity.
A team of researchers has found a way to make the manufacture of crystalline silicon materials faster and more affordable.
IBM and United Microelectronics Corporation, a global semiconductor foundry, today announced that UMC will join the IBM Technology Development Alliances as a participant in the group's development of 10nm CMOS process technology.
Single-wafer cleaning solution is suitable for 3D-IC/TSV, advanced packaging, MEMS and compound semiconductor applications.
In an industry where finer features are driving market needs, current deposition processes are no longer sufficient to address challenges like interconnect dimensions below 16/14nm or high aspect ratio TSVs (>8) without experiencing defects, voids, or low reliability.
Mr. Balasubramanian (known as Bala) brings more than 37 years experience in the semiconductor industry to his new role on Freescale's board of directors.
The agreement will broaden the foundry's specialty process portfolio that already includes a range of eMemory eNVM IP solutions from 0.18um and below.
Much has been said of the 450mm transition. But the description of this inflection is something of a misnomer.
At next week's 50th Design Automation Conference in Austin, Texas, GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support its most advanced manufacturing processes.
Critical trends and developments in the technologies, methodologies, and applications challenges in semiconductor test will be presented at the 6th annual IEEE Test Vision 2020 Workshop held in conjunction with SEMICON West 2013, on July 10-11 at the San Francisco Marriot Marquis Hotel.
In advance of the 2013 SEMICON West TechXPOTs on lithography and nonplanar transistors beyond 20nm, SEMI asked some of the speakers and industry experts to comment on the challenges they wanted to highlight. Many of the inputs focused on the need for precision in the processes used to form transistors, as well as how EDA can contribute to mitigating variability.
Fab equipment spending will grow two percent year-over-year (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.
Dr. Zhihong Liu, Executive Chairman of ProPlus Design Solutions, Inc., says that design-for-yield (DFY) considerations are more important than ever. And yet, we as an industry may not fully understand device modeling and its impact on DFY results.
Element Six today announced it has acquired the assets and intellectual property of Group4 Labs, Inc. (Group4), a semiconductor wafer materials company that manufactured gallium nitride (GaN) on-diamond semiconductor technology for RF and high-power devices.
This year’s SEMICON West front-end processing TechXPOTs on lithography and transistors below 20nm will provide critical updates on how technologists are coping with the next scaling challenges.
Samsung Electronics Co., Ltd., a provider of advanced semiconductor solutions, today announced the industry’s first 45nm embedded flash logic process development called eFlash. Samsung successfully implemented the new process into the smart card test chip, which means that this process technology fulfills the stringent quality requirements of the security solution market and can be successfully deployed on a commercial scale.
ProPlus Design Solutions, Inc. announced today that Semiconductor Manufacturing International Corporation has deployed ProPlus' NanoYield High-Sigma (HS) within its advanced technology development flow.
LAST POWER, the European Union-sponsored program aimed at developing a cost-effective and reliable technology for power electronics, today announced its three-year program achievements.
The critical processes and technologies necessary to continue Moore’s Law are currently more uncertain than ever before in the history of advanced semiconductor manufacturing.
SAMCO Inc, head quartered in Kyoto, Japan, has expanded its OPTO Films Research Laboratory in California’s Silicon Valley in order to strengthen its research structure and after-sale process support.
MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with imec, Ireland's Tyndall National Institute and ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs.
DARPA's Near Junction Thermal Transport (NJTT) effort recently demonstrated the first-ever GaN-on-diamond high electron mobility transistor (HEMT).
More than 100 representatives from government and the photonics industry convened in Washington, D.C., on February 28 to identify focus areas for a national photonics initiative (NPI), engaging academia, industry, and government in a collaboration to address barriers to continued U.S. leadership in photonics.
Over 2,000 industry professionals attended last week’s SPIE Advanced Lithography, where important progress reports were revealed on extreme ultraviolet (EUV), lithography, directed self-assembly (DSA), metrology, and related topics. The event ran February 24-28 in San Jose, California.
Semiconductor technology leaders ST and CMP help universities, research labs and companies prototype next generation of Systems-on-Chip.
LFoundry to manufacture wafers for Aptina following LFoundry’s purchase of Micron’s Avezzano, Italy semiconductor fabrication facility.
Following a healthy expansion in 2012, the growth of the global automotive semiconductor market will decelerate slightly this year because of a slowdown in the aftermarket and portable navigation device (PND) segments.
Diodes Incorporated today announced that it has completed its acquisition of BCD Semiconductor Manufacturing Limited in an all cash deal, valued at approximately $151 million.
While investments and capital spending in Asia-Pacific garner much of the attention regarding semiconductor manufacturing, spending on equipment and materials in North America has totaled more than $100 billion over the past decade as leading device manufacturers expand capacity and invest in new facilities.
The eight leading suppliers of industrial electronics suffered revenue declines in 2012, reflecting weak conditions for the beleaguered market.
In the world of optical defect inspection, finding on defect on a 300mm wafer can be like trying to find a single coin on the island of Taiwan. Now imagine being able to find that coin in just an hour, along with any other coins that look exactly like it.
Worldwide silicon wafer area shipments decreased during the first quarter 2013 when compared to fourth quarter 2012 area shipments, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.
SRC and NIST will provide a combined $5 million in annual funding for three multi-university research centers tasked with demonstrating non-conventional, low-energy technologies that outperform current technologies on critical applications in 10 years and beyond.
Intel Corporation today took the wraps off its brand new, low-power, high-performance microarchitecture named Silvermont.
LFoundry confirmed the signature of the final agreement regarding the acquisition of Avezzano (Italy) manufacturing facility.
IDC expects the semiconductor market to return to growth in 2013 with revenues forecast to increase by 3.5 percent this year.
Qualcomm, TSMC, and SK Hynix each register greater than 20 percent year-over-year growth.
Axcelis Technologies, Inc. today announced the introduction of the Purion XE next generation single wafer high energy implanter, the second tool in its expanding family of Purion ion implanters.
Spansion Inc. and Fujitsu Semiconductor Limited today announced they have executed a definitive agreement for Spansion to acquire the Microcontroller and Analog Business of Fujitsu Semiconductor for approximately $110 million, plus approximately $65 million for inventory.
SEMI today announced that Philip Yeo, chairman of SPRING Singapore, and Lee Kok Choy, country manager of Micron Technology Inc. Singapore, have been voted by the SEMI Singapore Regional Advisory Board as recipients of two prestigious awards recognizing their contributions to the development and success of the Southeast Asian semiconductor industry.
Cadence Design Systems, Inc. announced today that GLOBALFOUNDRIES has collaborated with Cadence to provide pattern classification data for manufacturing processes of 20 and 14 nanometers.
Morgan Advanced Materials has joined SEMATECH’s International SEMATECH Manufacturing Initiative (ISMI), a program designed to improve semiconductor equipment manufacturing productivity, yield, and cost.
Infineon Technologies and GLOBALFOUNDRIES Inc. today announced a joint technology development and production agreement for 40nm embedded flash (eFlash) process technology.
Global macroeconomic developments and technological advances, personal computers, and memory markets are expected to drive demand over the forecast period, Research and Markets predicts in their report, “Global Semiconductor Industry 2012-2017: Trend, Profit and Forecast Analysis.”
Hitachi Cable, Ltd. announced today that it has developed a new mass-production technology for GaN-templates, in which a high-quality gallium nitride (GaN) single-crystal thin film is grown on a sapphire substrate.
Natcore Technology Inc. announced major strides in advancing its black silicon solar cells to commercial levels of efficiency and, as part of its development process, has discovered that its technology could finally provide a low-cost selective emitter application.
Samsung has begun mass producing a 128-gigabit (Gb), 3-bit multi-level-cell (MLC) NAND memory chip using 10 nanometer (nm)-class process technology this month. This chip will enable high-density memory solutions such as embedded NAND storage and solid state drives (SSDs).
Electro Scientific Industries, Inc. today announced it had signed a definitive agreement to acquire the Semiconductor Systems business of GSI Group, Inc., a supplier of precision photonics, laser-based solutions and precision motion devices to the medical, industrial, scientific, and electronics markets
Advanced Micro-Fabrication Equipment Inc. (AMEC) said today that it has developed a Single-Station Chamber Advanced Dielectric Etcher (SSC AD-RIE) capable of processing the most rigorous semiconductor applications.
Sales in March 2013 were up slightly compared to February 2013 and March 2012.
Chip Memory Technology Inc. (CMT), a new embedded memory technology developer, has emerged from stealth mode to reveal company details and its latest product.
The €8.5 million European Commission project developed a complete design and fabrication supply chain for integrating a photonic layer with a CMOS circuit, using microelectronics fabrication processes.
1/f noise is an important characteristic for various semiconductor devices, such as MOSFETs, BJTs, JFETs, Diode, and IC resistors. Not only does it directly impact the circuit performance of modern ICs, but it has been used also as an important technique to characterize the manufacturing process quality.
IQE plc announces the launch of gallium nitride-based, high electron mobility transistor (GaN HEMT) epitaxial wafers on 150mm diameter semi-insulating silicon carbide (SiC) substrates.
The market for Bluetooth semiconductors is expected to boom by nearly 100 percent from 2011 to 2017, with the majority of the growth driven by demand for wireless combination integrated circuits (ICs) and mobile system-on-chip (MSoC) devices with integrated wireless connectivity that are used in mobile devices like smartphones and media tablets.
The semiconductor chip giant revealed plans to branch out beyond PCs. Will it work?
In order to meet the rapidly growing business demands in the Chinese market and further expand the mass market in that region, Freescale Semiconductor announced today that the company plans to open ten new sales offices covering key areas across the mainland area.
AIXTRON SE today announced that the University of Cambridge has successfully commissioned another multi-wafer Close Coupled Showerhead (CCS) MOCVD reactor at its new facility at the Department of Material Science and Metallurgy. The CCS 6x2-inch system will be configured to handle single 6-inch (150mm) wafers (1x6-inch).
Error correction code and redundant addresses are both techniques well-known in memories as a way of optimizing yield. But new data from the University of Ferrara shows that these common techniques may be overused. By classifying erratic bits more carefully, it’s possible to use less ECC and up to 35 percent less redundancy.
The ability of a resistive RAM device to maintain its resistance state, otherwise known as retention time, can be impacted by the electrode materials used.
New flash memory chips are replacing the floating gate with thin layers of material that "trap the charge." The charge trap is a sandwich of materials such as silicon-oxide-nitride-oxide-silicon (SONOS), metal-oxide-nitride-oxide-silicon (MONOS) and tantalum-aluminum oxide-nitride-oxide-silicon (TANOS), all of which are substantially smaller than the floating gate.
At the International Reliability Physics Symposium (IRPS), being held April 14-18, 2013 at the Hyatt Regency Monterey Resort & Spa in Monterey, CA, imec will present new research focused on the stress induced breakdown between the tungsten trench local interconnects (M1, M2) and metal gate in a 28nm CMOS technology. Imec’s Thomas Kauerauf will present a paper titled “Reliability of MOL local interconnects.”
New finFETs feature high-k dielectrics, which are better than conventional silicon nitride dielectrics in that they can be thinner, yet still enable good control of the transistor’s channel region from the gate.
It’s well-known that transistors generate heat when they’re operating, and that can have a significant impact on the chip’s reliability and longterm longevity. A small increase of 10°C–15°C in the junction temperature may result in ∼ 2× reduction in the lifespan of the device.
FinFETs offer several advantages compared to traditional planar transistors, but it’s not yet clear what kind of new reliability problems might arise as FinFETs are scaled to smaller dimensions.
Several years ago when the challenges to 450mm wafer processing, EUV development and novel transistor designs were first being discussed, SEMI commissioned a study that predicted the industry could face an R&D funding gap that could exceed $9 billion if current technology and economic trends continue.
Over the last few years, glass has gained considerable interest from the semiconductor industry due to its very attractive electrical, physical and chemical properties, as well as its prospects for a relevant and cost-efficient solution. The application scope of glass substrates in the semiconductor field is broad and highly diversified.
At this week’s International Solid State Circuits Conference (ISSCC 2013), imec and Holst Centre presented an ultra-low power processor that operates reliably at near-threshold voltages.
STMicroelectronics announced today another milestone in its testing of its 28nm FD-SOI Technology Platform.
In semiconductor manufacturing, 450mm is the next big opportunity. Issues of economic scale and complexity will force fab designers, OEMs and process integrators to investigate all open avenues in the search for solutions to the huge challenges that accompany 450mm.
80 percent of the devices used for portable and mobile applications are currently manufactured on 200mm or smaller wafers. How this plays out going forward could change who the dominant players will be.
Unprecedented precision engineering will be needed to manufacture chips features measured in nanometers. At these dimensions every atom counts and controlling variability is vital to meet performance and productivity targets.
The development of innovative technologies that solve the critical issues for the transition and adoption of 450-mm manufacturing will be the defining factor for whether a company merely survives or thrives.
While solutions are available to extend Moore’s Law, these solutions come at considerable increases in cost and complexity. As it has in the past, this industry will find more innovative solutions to overcome the challenges of inflection.
It is becoming increasingly clear that new MEMS and 3D high-volume, low-cost manufacturing technologies will accelerate a radical change to society’s cyber skyline.
The SEMI Consensus Forecast and the SEMI World Fab Forecast, with data collected from two different methodologies, point to the same conclusion: 0% growth for 2013.
The global market for MEMS microphones has reached approximately $422 million in 2012. The market is predicted to increase to $865 million in 2017.
Microelectromechanical (MEMS) devices are shaping the competitive landscape in the global medical device industry.
Worldwide silicon wafer revenues declined by 12 percent in 2012 compared to 2011, according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.
In the second of two installments, Linx Consulting reports a steady growth in semiconductor production, as released in The Econometric Semiconductor Forecast.
Mitsubishi Electric Corporation announced this week that is has developed a prototype to improve productivity of SiC slice processing for semiconductor wafers.
Although many are small companies manufacturing low-pin count devices, all of the world’s “Top 10” OSAT, Outsourced Semiconductor Assembly and Test, players have one or more assembly and testing facilities in China.
In the first of two installments, we examine the global issues facing the semiconductor industry, as released by Linx Consulting in The Econometric Semiconductor Forecast.
A new econometric semiconductor industry forecast predicts semiconductor wafer area production to grow slightly less than 6% in 2013, according to Linx Consulting.
To help the Taiwan LED industry tackle the increasing challenges, an in-depth analysis of LED global market opportunities and technology breakthroughs were recently provided at the 2013 LED Market and Outlook seminar held by SEMI Taiwan.
Dow Electronic Materials launched the first pads from its new IKONIC 2000 and IKONIC 3000 polishing pad series.
SEMATECH announced today that Araca Inc., a leading provider of products and services for chemical mechanical planarization research and development, and the International SEMATECH Manufacturing Initiative (ISMI) are partnering to deliver CMP processing and productivity solutions to help chip manufacturers increase yields, reduce equipment downtime and lower consumables costs.
Spending on research and development by semiconductor companies grew 7% in 2012 to a record-high $53.0 billion, even though the semiconductor market declined 1% to $317.6 billion.
Scientists at RTI International are advancing the state of science in electronic devices for optical systems by using superlattice structures to optimize the performance of germanium optical detectors on silicon chips.
The Global Semiconductor Alliance (GSA) announced the appointment of three new members to the GSA Board of Directors.
SEMI announced that Joung Cho (JC) Kim, chairman, Edwards Korea Limited, is the recipient of the 14th annual SEMI Sales and Marketing Excellence Award.
Cabot will collaborate with SEMATECH to develop advanced solutions for emerging CMP applications.
The rise in mobile computing, changes to the fabless-foundry model, uncertainties in technical innovation, and global macroeconomic trends are becoming the dominant forces in 2013 and beyond, according to industry leaders speaking at this week's SEMI Industry Strategy Symposium (ISS).
GlobalFoundries says it plans to build a $2 billion "Technology Development Center" R&D facility at its Fab 8 campus in Saratoga County, NY, for semiconductor technology development and manufacturing: EUV lithography photomasks to new interconnect and packaging technologies enabling 3D chip stacking, "and everything in between."
SEMI's HB-LED Standards Committee has approved its first standard, specifying sapphire wafers used in making high-brightness light-emitting diode (HB-LED) devices.
Klaus Schuegraf, former exec at Applied Materials responsible for the company's semiconductor products technology roadmap, will now lead Cymer's EUV engineering and development programs.
We are in an age where chemistry is center stage in the race to advance Moore’s Law and More Than Moore.
The International Data Corporation is forecasting that semiconductor revenues worldwide will improve by 4.9% to $319 billion in 2013 and log a compound annual growth rate (CAGR) of 4.1% from 2011-2016.
Based on current indications, capital spending would seem to be flat in 2013. However, Semico predicts healthy revenue growth this year, which may encourage more spending, particularly in the second half of the year. This may bring total capex for 2013 into the positive range.
Predictions for 2013 show several notable trends: overall silicon area growth for 2013 should average approximately 6%; the first quarter and the second half are likely to show slower growth than the second quarter; and the modest growth forecast for 2013 is predominantly demand driven.
New York represents Exhibit A of a new way of thinking; a true 21st century model for technology, workforce and economic development.
Dr. Zhihong Liu, Executive Chairman, ProPlus Design Solutions, blogs about dealing with increased random variations and layout-dependent effects.
A particle as small as three microns in diameter, attached to the back side of the wafer—the dark side, if you will—can cause yield-limiting defects on the front side of the wafer during patterning of a critical layer.
In the ranks of top foundries, there's a new Number Three in town: Samsung, which climbed up the ranks again in 2012 thanks to its ubiquity in smart phone technology, according to updated rankings by IC Insights.
Samsung tops list; IC foundries expected to show biggest capacity gains through 2017.
Stretched-out clothing might not be a great practice for laundry day, but in the case of microprocessor manufacture, stretching out the atomic structure of the silicon in the critical components of a device can be a good way to increase a processor's performance.
DRS Technologies, Inc., a Finmeccanica Company, and Cypress Semiconductor Corp. (NASDAQ: CY) today announced that DRS will transfer its Microbolometer technology for uncooled infrared detectors to Cypress for high-volume manufacturing.
New marketing and technical support center opened in Reading, UK.
Snapdragon 800 processor on 28nm HPM process delivers high performance and low power for mobile devices.
Molecular Imprints, Inc. (MII), a developer of advanced semiconductor lithography, has announced the delivery of an advanced lithography platform which uses Xaar 1001 inkjet printheads to pattern 450mm silicon wafer substrates.
Peregrine Semiconductor Corporation, a fabless provider of high-performance radio frequency integrated circuits (RFICs), yesterday announced plans to collaborate with Murata Manufacturing Company on a multisource arrangement for RF switches and other components based on Peregrine’s proprietary UltraCMOS technology
Samsung Vice-President Kwon Oh-hyun released a statement today, apologizing for the fatal hydrofluoric acid spill that left one worker dead and four others injured.
New 200 mm diameter wafer enhances photolithography capability.
Coherent, Inc. has expanded its family of industrial ultrafast lasers with the new Talisker 1000 series. This new series of high power picosecond lasers is designed for high-throughput, precision materials processing applications in the semiconductor, solar (photovoltaics), medical devices, consumer electronics and automotive industries.
Worldwide sales of semiconductors were $24.05 billion the month of January, up 3.8% from January 2012 and down 2.8% from December 2012, according to the Semiconductor Industry Association (SIA).
After reaching a worrisome high in the third quarter of 2012, global semiconductor inventories held by chip suppliers fell at a surprisingly fast rate in the fourth quarter, led by dramatic reductions for market leader Intel Corp.
Cadence Design Systems, Inc. today announced plans to aquire Tensilica, Inc. for approximately $380 million in cash. Tensilica had approximately $30 million of cash as of December 31, 2012.
This week, India’s Finance Minister P Chidambaram offered incentives to chip makers to set up headquarters in India, in an effort to encourage local electronics manufacturing. However, the response from the industry has been less than positive. Many believe that is it is a good start, but far from sufficient.
STM, Imec, CEA-LETI, ASML, Soitec and EU representatives discussed directions at ISS Europe 2013 in Italy.
Mentor Graphics Corp. today announced availability of the Kronos Cell Characterization and Analysis platform. The Kronos platform quickly produces accurate performance models for standard cells, I/Os, and complex cells within an advanced, integrated environment.
Intel announced Monday a major move to expand its foundry business. Altera Corporation and Intel Corporation have entered into an agreement for the future manufacture of Altera FPGAs on Intel's 14nm tri-gate transistor technology.
Transphorm Inc. today announced at the 2013 ARPA-E Energy Innovation Summit that its novel 600V Gallium Nitride (GaN) module has enabled the world’s first GaN-based high power converter. Transphorm will demonstrate the product built with its customer-partner Yaskawa Electric, Japan at the upcoming APEC 2013 industry conference.
Tokyo-based Asahi Glass Co., Ltd. and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1 million to co-found a subsidiary business, Triton Micro Technologies , to develop via-fill technology for interposers, enabling next-generation semiconductor packaging solutions using ultra-thin glass.
Everyone wants faster access to stored data, and the issue is becoming critical with Big Data and cloud initiatives. With the speed of DRAM and the non-volatility of storage, Magnetoresistive Random Access Memory (MRAM) encourages a new way of thinking about storage applications. Storage is associated with longer latencies, but with MRAM storage can have similar latencies to memory. These capabilities and others make MRAM a catalyst for new thinking about how we design storage applications.
Researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, today announced development of a modeling process designed to simulate atomic-level etching with chemicals that are effective alternatives to widely used perfluorocarbon (PFC) gases.
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. and Benjamin S. Louie of Zeno Semiconductor blog about dimensional scaling as it relates to EUV and future per transistor device cost.
Brion Technologies, a division of ASML, announced a major milestone today in its partnership with GLOBALFOUNDRIES. The companies are collaborating to deliver high-volume computational lithography capabilities for 28 nm and 20 nm tapeouts, while also accelerating the development of future nodes, including extreme ultraviolet (EUV) lithography.
Semiconductor manufacturers, suppliers and academia to collaborate on real-world issues at SEMI event.
Wafers with a diameter of 450mm enable the micro-chip industry an increase in yield of up to 80%. This leads to an enormous increase in productivity. In order to control the product quality, these wafers receive a specific marking from the manufacturer.
In an effort that will accelerate commercialization of extreme ultraviolet (EUV) lithography technology and the development of next-generation transistors, SEMATECH announced today that Intermolecular, Inc. has joined SEMATECH’s Lithography and Front End Processes (FEP) programs.
Solid State Technology is excited to announce that Mark Thirsk, managing partner at Linx Consulting, will be discussing the cost and technology needed to implement next-generation device technology at The ConFab 2013. Thirsk has over 20 years of experience in the chemical industry, working with a variety of materials and processes utilized in wafer fabrication.
Fulfilling the promise of performance and power scaling at 16nm, ARM and Cadence today announced details behind their collaboration to implement the first ARM Cortex-A57 processor on TSMC's 16nm FinFET manufacturing process.
AIXTRON SE today announced that it is participating as a key partner in the recently announced European Union (EU) Future Emerging Technology (FET) flagship project “Graphene.”
The Temescal Division of Ferrotec Corporation today announced the Temescal UEFC-5700, a ultra-high efficiency electron beam metallization system for lift-off compound semiconductor applications.
Kotura inks fab agreement; announces relationships with Mindspeed and BinOptics.
MV Products has announced that their high-capacity, modular vacuum pump inlet-exhaust traps can be stacked for semiconductor wafer fabrication processes which produce a lot of heavy particulates.
OneChip Photonics this week revealed strategic, outsourcing plans to expand into new markets, with announcements of newly-established relationships with semiconductor foundry GCS and wafer supplier IQE. Both announcements related to OneChip’s bigger, strategic plan to expand its services into the high-volume DCI market.
Imec announced today the launch of its fully integrated silicon photonics platform through a cost-sharing Multi-Project Wafer (MPW) service via ePIXfab.
Nanoplas, a global supplier of plasma processing equipment to the semiconductor industry, today announced a new dry-etch process offering virtually unlimited etch selectivity for removing dielectric films on microprocessors and memories at high throughput.
Intermolecular, Inc. today announced that Dr. Raj Jammy has joined the company as senior vice president and general manager of the semiconductor group.
ARM and TSMC today announced the first tape-out of an ARM Cortex-A57 processor on FinFET process technology. The Cortex-A57 processor is ARM's highest performing processor, designed to further extend the capabilities of future mobile and enterprise computing, including compute intensive applications such as high-end computer, tablet and server products.
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $23.25 billion for the month of February 2013, an increase of 1.4 percent from February 2012 when sales were $22.93 billion. Effective government policies needed to spur stronger growth.
Intel and Micron researchers will reveal the key process advances and electrical results behind their multilevel cell (MLC), 64Gb NAND flash memory technology at the upcoming International Electron Devices Meeting (IEDM) in December.
Analysts break down Intel's $6B-$8B pledge to build and expand its US facilities to accommodate 22nm process technologies: what sites get new tools (and who gets the old ones), and why the new R&D fab's name isn't logical.
The International SEMATECH Manufacturing Initiative Inc. (ISMI) will relocate its headquarters and operations to CNSE's Albany NanoTech Complex beginning in January 2011. It is expected to create more than 100 jobs in NY.
Worldwide silicon wafer area shipments increased during the third quarter 2010 when compared to second quarter 2010 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.
ON Semiconductor (ONNN) plans to install another $15.7 million worth of production equipment in its 8" Pocatello, Idaho, wafer manufacturing facility during the next 6 months. This investment is in addition to the company's announcement in June of an $11 million equipment expansion.
Chip foundry giant Taiwan Semiconductor Manufacturing Co. (TSMC) has greenlighted investments in fab infrastructure, including a new 300mm gigafab -- but there may not be any immediate capex adjustment for it, and that may be a good thing.
Researchers from Intermolecular describe an atomic-layer deposition (ALD) process development chamber that allows multiple site-isolated depositions on different quadrants of a 300mm wafer, with data from a case study of ZrO2 film development.
Among key takeaways from SEMATECH's Litho Forum last week in NYC was a proposal to create a consortium to support multibeam mask writing efforts, similar to what's being done for EUV.
Execs from Texas Instruments and Luminescent Technologies describe a "source/design optimization" technique that blends source/mask optimization (SMO) techniques with design rules, and realizes significant improvements in overall die area.
After two months of punishing declines, worldwide silicon wafer shipments rebounded through most of 2010, though in terms of sales there's still a lot of ground to make up, according to new numbers from SEMI.
Confirming rumors, Chinese flagship foundry Semiconductor Manufacturing International Corp. (SMIC) says it has appointed several new top execs, and that it is in talks with an unidentified investor for a financial infusion.
Techcet's Michael A. Fury concludes his observations from this year's IEEE International Interconnect Technology Conference (IITC) meeting near San Francisco. From Day 3: Intel's airgaps for 32-22nm, Si nanowires, more on 3D bonding and TSV schemes, electromigration in Au nano-junctions -- and enforcing "Zafiropoulo's Law."
Samsung's announcement that it has completed testing of its 32nm high-k/metal gate architecture, ramping to volume possibly by year's end -- and following quickly with a 28nm version -- has the industry buzzing about a possible reshaping of leading-edge semiconductor foundry manufacturing.
Targeting CMP consumables suppliers, commercial device manufacturers, and academic R&D organizations, the agreement enables customers to leverage the combined strengths of both companies with in-depth analysis and fundamental research for virtually any aspect of CMP on any material.
Maxim Integrated Products (Nasdaq:MXIM) qualified and shipped production analog product built on 300mm wafers. This gives Maxim a significant technology edge in the analog/mixed-signal market.
Rigaku Innovative Technologies announced further expansion into the optics market for extreme ultraviolet (EUV) lithography. RIT plans to continue supporting the industry by supplying Osmic Coatings, a line of multilayer coated optics that are essential to EUVL.
Laura Peters, contributing editor, discusses TSMC's HfZrO/TiN stack, fabricated by a novel multi-deposition, multi-anneal process. TSMC will present the results at the upcoming International Electron Devices Meeting (IEDM, San Francisco, CA, December 6-8, 2010) with researchers from the Nanyang Technological University (Singapore).
Applied Materials (AMAT) speaks about its new conductor etch system -- the Centris AdvantEdge Mesa Etch -- released at SEMICON Japan this week. The company sees the gap in the lithography roadmap is an etch opportunity. Thorsten Lill, VP Etch Business Group, at Applied, told ElectroIQ that new steps in advanced transistors, double-patterning, and advanced packaging are driving growth in the conductor etch market (~$1.6B market in 2010).
Semiconductor manufacturing seems to have slipped a bit in 3Q10, according to the latest data from SICAS, but utilization rates remain extremely high. And foundries continue to sizzle.
The ongoing debate over the next wafer-size transition to 450mm, with discussions about pros and cons in costs and technology gains, misses the point -- it's the message we send about the semiconductor industry's mindset and future, argues Semico's Joanne Itow.
New data from North America and Japan points to still growing demand for suppliers of semiconductor makers.
SEMATECH's Dan Armbrust underscores the need to determine up-front what areas are truly important to keep pushing scaling and cost-effectiveness in the semiconductor industry.
A two-step plasma cleaning process proves to be a fast and effective method of maintaining a high uptime and high productivity for ALD of Ti- and Ta-based electrode materials, reports Aviza Technology and Pivotal Systems.
Updating outlooks for foundry rivals TSMC and UMC, FBR Research analyst Mehdi Hosseini suggests that business will stay brisk through year's end -- and that the leading-edge horizon is clear of trouble for the top foundry.
Demand for semiconductor capital equipment continued to increase in the final month of 2009, and with the key book-to-bill ratio now six straight months above parity suggests growth still lies ahead, according to the latest industry data.
X-Fab Semiconductor Foundries AG and semiconductor printing startup Semprius have agreed to a partnership for turnkey silicon wafer fabrication, under which X-Fab will invest $1.5M in the company and become its designated foundry.
Fabless giant Qualcomm has made two deals to reserve leading-edge semiconductor manufacturing capacity: one with longtime partner TSMC, and the other with upstart GlobalFoundries.
Execs from Novellus Systems describe how the company's new Sola xT ultraviolet thermal processing system addresses high-volume manufacturing of advanced logic devices at 45nm and below -- and how it potentially stacks up in wafer-to-wafer performance vs. competitors' offerings.
ASM exec Shawn Thomas explains to SST how the company's new PowerFill process, which enables void-free filling of deep trenches with doped, epitaxial silicon, addresses needs for smaller die sizes and on-state resistance of power management devices.
Veeco exec Jim Jenson explains the workings of the company's new MOCVD tool targeting high-volume high-brightness LED manufacturing, a market expected to triple in the next four years to $15B.
In two exclusive interviews, Lode Lauwers, senior director of business development at IMEC, and Tom Jefferson, ISMI 450mm program manager, speak with Debra Vogler, senior technical editor, in advance of the SEMICON Europa 450mm session.
RFMD added its GaAs technology to its foundry services portfolio and will begin providing a full suite of GaAs pHEMT technologies. RFMD also expanded its Foundry Services to deliver multiple molecular beam epitaxial (MBE) platforms, epitaxial characterization and epitaxial development structures.
Mattson Technology Inc. (NASDAQ: MTSN), advanced wafer fab process equipment supplier, received orders for multiple Suprema photoresist strip systems from a new Asian customer. The Supremas will be used in both front-end-of-line (FEOL) and back-end-of-line (BEOL) applications for advanced logic device production.
Camtek Ltd. (NASDAQ and TASE: CAMT) received two orders for its, new automatic optical inspection (AOI) system for the front-end semiconductor industry, the Gannet. Front-End Macro Inspection is a new market for Camtek.
Highlights from Day 4 of the 2010 MRS Spring meeting, reported by Techcet's Michael A. Fury: TSVs and flexible interconnects for 3D CMOS/MEMS; 300mm BCB wafer bonding; carbon nanotube interfaces for interconnects and vias; phase-change memory devices; interfaces during ALD of rare earth-based high-k dielectrics; and graphene's use in on-chip interconnects and transparent conductor electrodes.
Keithley exec Lee Stauffer explains how adding ultra-fast voltage waveform generation and current/voltage measurement capabilities to the company's Model 4200-SCS semiconductor characterization system benefits a range of applications, from flash memory to CMOS and MEMS.
Sanjay Kapasi from KLA-Tencor tells SST how the latest-generation PROLITH virtual lithography tool, PROLITH X3.1, takes aim at the skyrocketing R&D expenses being incurred at the 1X and 2Xnm nodes, by leveraging simulations rather than printed test wafers.
Tokyo Electron Limited and Tanaka Kikinzoku Kogyo K.K. have developed a sucessful recycling process for ruthenium precursors (CVD-ruthenium material) used in next-generation semiconductor miniaturization technology.
According to Dean Freeman, research VP at Gartner, the LED market will see ~11% growth in 2010, and ~35% growth in 2011. Reaping the benefits of the accelerating interest in LEDs is the MOCVD equipment market.
Techcet's Michael A. Fury continues his observations from the 7th International Surface Cleaning and Preparation Workshop in Boston. Key takeaways included GaAs heterojunctions, CMP evolutions & revolutions, preventing water adsorption in low-k films, glass surface prep for LEDs, and membrane filters to remove ionic contaminants.
Willbe S&T selected VICTREX PEEK polymer as the material in its chemical mechanical planarization (CMP) retaining rings. Willbe S&T’s insert molded CMP ring provides better performance, longer life and reduced cost compared to traditional two-piece bonded type CMP retaining rings made with stainless steel and polyphenylene sulfide.
HBr with consistently low water vapor levels is critical to prevent delivery system corrosion and device performance issues during trench etch for CMOS fabrication. Jianlong Yao et al, Matheson, present the effect of cylinder material on delivered moisture concentration in gas phase HBr. Polished AISI Cr-Mo steel, Nickel-lined AISI Cr-Mo steel, and 316L stainless steel cylinders show markedly different results.
Advantest Corporation released a SEM-based critical dimension (CD) measurement system for next-generation photomasks and patterned media. The E3630 is fully compatible with Advantest’s existing E3610/E3620 CD-SEM measurement systems and software, and boasts 30% improved linewidth repeatability.
DCG Systems announced the P3X Cobra FIB circuit edit system for complex edit challenges, even at advanced 22 nm device process technologies. The P3X Cobra delivers ion beam performance from 2keV to 30keV beam energies.
The VIISta Trident high-current ion implanter from Varian Semiconductor Equipment Associates Inc. (NASDAQ: VSEA) enables high-performance, low-leakage devices while improving productivity at the sub30nm wafer fab node.
Over the years, undesirable process effects related to ion implantation have become well known: the like channeling effect, for example, and how to minimize it for 25μm and 13μm mature technology. Patrick Demarest, Altis Semiconductor, describes how a stable process can emerge in data mining analysis for low final test yield, and provides definitions for incidence, tilt and twist angles, and channeling effects.
Techcet's Michael A. Fury reports from the 7th International Surface Cleaning and Preparation Workshop put on by Northeastern and Hanyang universities in Boston, with early talks involving various themes: EUV mask cleaning and chemical mechanical planarization (CMP), crystalline silicon solar cell texturing, and even nano-chopsticks.
Michael A. Fury continues with observations from IEDM 2010, looking at 2nd-day papers on a 90nm CMOS image sensor; an 11nm planar multi-gate CMOS design with self-assembled gates; SiC/GaN power electronics for auto systems; an update on future memory technologies; and a transparent photosensor array with triple oxide TFTs as both switches and sensor elements.
Techcet's Michael A. Fury reports in-depth from sessions at IEDM 2010, looking at papers on NAND flash using airgaps, a lock-and-key method for 3D integration, RF performance of graphene FETs, and FET-built DNA biosensors.
Soitec and Sumitomo Electric Industries are working together to develop engineered gallium nitride (GaN) substrates. The alliance will draw on Sumitomo Electric’s GaN wafer manufacturing technology and Soitec’s Smart Cut layer transfer technology.
Researchers with the U.S. DOE's Berkeley Lab have been able to fabricate nanochannels that are only 2nm in size, using standard semiconductor manufacturing processes. These channels function differently than their larger counterparts.
Tegal Corporation (Nasdaq: TGAL) is launching a new member of its ProNova family of high-density inductively coupled plasma (ICP) reactors for the company’s DRIE series wafer processing products. The ProNova2 is targeted for fast-growing 200mm MEMS and 3D IC applications.
Jeff Schake, et al, DEK Printing Machines, discuss the flatness characteristics of available wafer pallets, and use them in an experiment with thinned wafers in automated printing. With thin wafers, and the requirement for low coating thickness, the wafer-support tooling surface metrology should have an appreciable impact on coating thickness control.
Intel's lowered 3Q outlook was at least expected, if not overdue, according to analysts and market watchers, who break down the news and what it means for consumer technology markets and equipment/materials suppliers.
The latest advances in HRXRD technology to allow true in-line monitoring, are described. Paul Ryan, et al, Jordan Valley Semiconductors UK Ltd.
McPherson’s vacuum ultraviolet (UV) spectrometer, Model 234/302, is now available with improved efficiency over a wide wavelength range. New platinum-coated gratings suit use at windowless wavelengths, shorter than 120nm (>10eV).
In this video from SEMICON West 2010, Sagar Kekare, Synopsis, presents ideas from his paper on rapid root cause analysis and process change validation using design-centric volume diagnostics.
There is often a direct relationship between PECVD chambers failing first-pass film checks and the gapping method used to examine the gap between a heater and gas showerhead. Craig Ramsey from CyberOptics Semiconductor describes an automated gap measurement method used in a 300mm fab's thin-film production that uses a wireless gapping device.
Imec and ASML collaborated to qualify ASML’s Tachyon Source Mask Optimization and programmable illuminator system FlexRay, proving its potential with the demonstration of a 22nm SRAM memory cell. In October 2010, the ASML XT:1900i lithography scanner at imec will be equipped with FlexRay, enabling imec to explore the ultimate frontiers of immersion lithography.
Amid efforts to keep afloat as the industry tides recover, Tegal Corp. has sold off much of its technology portfolio to the OEM Group, and is poised to forge on with DRIE and certain deposition technologies.
Several discussions and presentations at last week's SPIE Advanced Lithography Conference deserve special note -- from work with e-beam EUV mask inspection, to nanoimprint achievements (11nm!), an EUV tool platform roadmap, mask productivity and cost issues at 22nm, and more on SMO and tunable DOEs.
TSMC has officially broken ground for its new LED lighting R&D center and fab in Taiwan's Hsinchu Science Park, part of its multibillion-dollar initiative to establish a foothold in higher-growth markets outside of core IC fabrication.
The semiconductor industry is at its most profitable point now than any other time in the past decade thanks to industrywide efforts to aggressively manage costs and capacity -- but wild optimism about surging growth forgets the truth that this recovery only resets to levels from three years ago, according to iSuppli.
The light-emitting diode (LED) market has gone through two cycles of major growth, but an even bigger "third cycle" based on super-efficient lighting looms ahead, reports SST's Bob Haavind from a recent SEMI breakfast at Teradyne near Boston on March 10. And the wide range of problems to be tackled will make it an attractive target for those now in the semiconductor processing markets.
Last week's 6.4-magnitude earthquake in Taiwan caused some emergency evacuations and shutdowns among the island's electronics manufacturing sector, with the biggest impact so far seeming to be in the LCD manufacturing sector.
Techcet's Michael Fury reports from Day 1 of SEMICON West, from keynotes to CMP to thermal characterization, and the continued use of “zombie” semiconductor manufacturing technologies.
Gary Green, co-chair of the yield enhancement/methodologies sessions at this week’s Advanced Semiconductor Manufacturing Conference (colocated with SEMICON West), reviews key themes discussed, including techniques aimed at faster root cause analysis, new methods in analyzing contact failures using e-beam and TEM tools, and increasing test coverage while reducing the number of test wafers.
ASML Holding NV (ASML) announced broad customer adoption of holistic lithography products that optimize semiconductor scanner performance and provide a faster start to chip production. All of ASML’s leading-edge scanners are now sold with one or more holistic lithography components.
Applied Materials etch VP Thorsten Lill explains how the company’s AdvantEdge Mesa etch tool, debuting at this year’s SEMICON West, uses synchronizing plasma pulsing to tackle problems inherent with advanced conductor etch.
With continued device geometry and new process steps comes increasing use and variety of CMP steps, and an increasing need to learn more about (and ultimately manage/eliminate) particles in the slurry that can wafer defects and yield losses. Enter Vantage Technology, which is debuting a new slurry particle measurement technology, SlurryScope (patented in the US and internationally), to provide undiluted real-time measurement of industry-standard production slurries.
The Diamond series atmospheric robots use ultra low inertia, high-response brushless servomotors coupled with zero-backlash Harmonic Drive gears to achieve greatly enhanced dexterity and precision.
Following are some of the highlights of the SEMICON West exhibit halls, open July 13-15 at the Moscone Center in San Francisco, CA. Products on display include TSV technology, ALD systems, vacuum and wafer transport tools, and more for semiconductor and package manufacturing.
In addition to market analysis, recent IP activity and supply chain issues, “Quartz for Semicon-ductor Applications, A Critical Materials Report 2010,” includes profiles and updates for base material and crucible suppliers and an update on 450mm preparedness. The rate of implementation of 450mm wafer fabrication will impact the near-term prospects for the quartz industry.
While we were not allowed to snap photos of the proprietary processes inside Applied Materials, Solid State Technology editor in chief Pete Singer put together these photos with information from the Applied Materials tour. Highlights include a solar-panel roof on the parking area, and discussion of AMAT's new products.
Tom Jefferson, ISMI's 450mm program manager, gives SST an exclusive rundown of ISMI's closed-door update on 450mm progress at SEMICON West.
AMC concerns have changed over time: what were chip makers and exposure tool OEMs concerned about 10 years ago and now, with 248nm, 193nm, and 192 immersion processes? In this video interview, Jürgen M Lobert, Ph.D., Entegris, discusses AMC tools and process protection in micro lithograhy.
CHAD Industries developed wafer-handling capabilities for Sapphire wafers used in the LED market.
TSMC beat estimates with its 2Q10 results, but analysts are taking a more cautious stance amid worries of inventories on the rise and capacity additions slowing down.
SEMICON West 2010 wrapped this week in San Francisco. This article includes JC Kim, SEMI Board of Directors Chair, discussing the show and the semiconductor industry future. We also have POVs from the show floor by the ElectroIQ.com bloggers.
Entegris entered into a worldwide patent license agreement with 3S Korea, covering a suite of Entegris patents for 300mm front opening shipping box (FOSB) products used to transport silicon wafers for semiconductor manufacturing.
Unit shipments of key semiconductor materials are already back to record levels just a year after the most punishing period in the industry's history, but the growth will slow in 2011 for several reasons, according to the latest forecast data presented at SEMICON West.
Renewed demand for consumer oriented electronics products requiring (generally speaking) more advanced semiconductor devices has caused iSuppli to upwardly adjust its two-month-old revenue forecast for pure-play semiconductor foundries.
Chip suppliers are reporting rising inventory, but the swelling stockpiles do not represent a cause for concern at present, with demand on the rise in coming months, according to iSuppli Corp. Inventory levels are now more appropriately aligned with end-market demand, which was necessary given the level of under-shipment across many end-markets since 2HCY09, adds Doug Freedman, Gleacher & Company.
New quarterly total area shipments are 40% greater than second quarter 2009 shipments and are at their highest levels ever.
ON Semiconductor's 6" (150mm) wafer manufacturing facility in Oudenaarde, Belgium specializes in application specific high-voltage technologies for the automotive and industrial industry, and integrated and discrete standard products for a wide range of market segments.
The World Fab Forecast released at the end of August indicates a 133% increase in equipment spending for front-end fabs this year and about 18% growth in 2011. The data reveals that for both 2010 and 2011, over 150 fab projects will contribute an estimated $83 billion in spending.
In a series of podcasts, 3 of the presenters at the SEMICON Europa Lithography session speak with senior technical editor Debra Vogler. Interviewees include consultant Wolfgang Arden, Rolf Seltmann of Globalfoundries, and IMEC's Roel Gronheid.
The ConFab, an invitation-only global conference and networking event for semiconductor industry executives, announces the appointment of five new advisory board members for 2011. The ConFab also welcomes the industry association SEMI, which has agreed for the first time to sponsor The ConFab in 2011.
There are 13 fabless IC companies expected to register more than $1.0 billion in sales in 2010, up from 10 companies in 2009 and 8 in 2008. These 13 suppliers are forecast to have a combined $41.4 billion in sales and represent about 70% of the $59.6 billion worth of total fabless company IC sales expected in 2010.
NexPlanar will open a new manufacturing facility in Hillsboro, Oregon, by the end of 2010 for increased production of chemical mechanical planarization (CMP) pads used in semiconductor manufacturing. The company is moving into an 18,000 square foot facility from a smaller location in the same town.
Under the agreement, a team of mask cleaning experts from Dai Nippon will work with experts from SEMATECH’s Mask Clean program at CNSE’s Albany NanoTech Complex to improve the cleaning yield on extreme ultraviolet (EUV) lithography patterned, non-patterned substrates and nanoimprint lithography (NIL) templates.
Techcet's Michael A. Fury continues his observations from this year's International Symposium on CMP at Clarkson U. in New York. Highlights from Day 3: Horrifying CMP "fangs," dissolved gases in megasonics, a dual-purpose slurry injector, the usefulness of CMP levelers, CVD Co as a Cu barrier, HB-LED sapphire wafer polishing, and a CMP Broadway moment.
Techcet's Michael A. Fury offers his observations from this year's International Symposium on CMP at Clarkson U. in New York. Highlights from Day 2: Creating "porosity on demand;" a CMP Rubik's Cube vs. Whack-A-Mole; the evolution of CMP process control; and a missing manufacturing acronym.
Techcet's Michael A. Fury offers his observations from this year's International Symposium on CMP at Clarkson U. in New York. Highlights from Day 1: The latest uses of CMP in device integration; SOI wafer bonding; pad surface texture and slurry flow; Cu dendrites in 45nm interconnect patterns; and using microfluidics to measure CMP slurry particle concentration.
As 2010 shapes up as a record year for semiconductor equipment spending, so the following two years will be a slow fall back to Earth with low single-digit overall growth, according to SEMI's updated forecasts -- though there are some interesting trends within the numbers.
Applied execs played coy about the "unique" technology behind their new Eterna FCVD tool, which targets a $400M market (and twice that in a couple of years), but analysis of what was said offers some insights into how it works.
Applied Materials (NASDAQ:AMAT) today released Eterna, a new flowable CVD (FCVD) technology. Ajay Bhatnagar, director, global product management in the Gap Fill Dielectric Division, explains in-depth how it differs from conventional CVD. The technology is run on AMAT's Producer Eterna FCVD system. He also explains how it is being applied to new device architectures such as DRAM vertical transistors, NAND vertical bit stacks, and FinFETs.
In a podcast interview, Paul Semenza, SVP of Analyst Services at DisplaySearch, explains how a maturing OLED manufacturing capability is contributing to the surge in interest, as is consumer response to products that use OLEDs. One challenge, however, is scaling up vapor deposition, and solutions are being developed.
Brooks Instrument, provider of advanced flow measurement, control and level solutions, released product enhancements to the GF Series ultra-high purity mass flow controllers. Brooks has increased the range of flow rates available on the GF Series from the current 3 sccm to 30 slpm, to a new full-scale flow rate of 55 slpm. Along with a normally open valve option, this enables use in Epi, diffusion, batch CVD, and MOCVD.
In this video interview, Matthew Taylor, Edwards, addresses the solar and semiconductor markets. How can vacuum pumps be less expensive to operate? How can equipment providers improve service to maintain the pumps over a longer life?
Tom Gubiotti, product marketing manager at KLA-Tencor, discusses the design decisions that drove the company’s new film metrology tool -- the Aleris 8330 -- targeted for non-critical films at 32nm and below. Among the drivers -- especially for memory manufacturers -- is the need for high-throughput, low cost-of-ownership tools that are capable of recipe sharing around the fab, so-called, “future proofing.”
Jennifer Braggin, Entegris, chaired a session at ASMC on defect inspection. In this video, she summarizes the key points: new processes and materials add new detection challenges, and analysis from the lab is now moving into the fab. Wafer-edge inspection is highlighted.
James Moyne, Applied Materials, highlights a new technology: virtual metrology. Virtual metrology, on which Moyne presented at ASMC/SEMICON, enables tighter semi fab control using line data analysis. The summarized data is synched with real metrology data. Virtual metrology is now adaptive.
Techcet's Michael A. Fury reports from SEMI's NCCAVS CMP Users Group meeting in San Jose, CA. Highlights included a market growth overview, and talks ranging from market growth to consumables challenges to new technologies for chromatography, noncontact probe, 3D topography, polishing, and HDD substrate slurry.
The IC community has been searching for a manufacturable low-k dielectric which could scale to below K = 2.0, says Dr. Phil Garrou. Microindent photos of uLK 124, released by SBA Materials show a clean ductile indent. SBA reports that their uLK materials can be integrated into existing fab lines using equipment and process flows already in place.
Robert Pagliaro, RP Innovative Engineering Solutions, demonstrates that simple but effective enhancements to wet clean steps can help achieve more stringent surface preparation and reduce complexity, cost of ownership (COO), and environmental concerns associated with existing methods. Contamination left or caused by cleaning and drying steps can adversely affect wafer yields.
Keithley Instruments Inc. (NYSE:KEI) updated its ACS Basic Edition Semiconductor Parametric Test Software for semiconductor test and measurement applications. ACS Basic Edition Version 1.2 performs characterization of component or discrete (packaged) semiconductor devices.
DCG Systems sees strong adoption in the design debug and failure analysis market for the LVx capabilities, which include continuous wave laser voltage probing (CW-LVP) and laser voltage imaging (LVI) through a combination of hardware and software.
A daylong series of presentations, facility tour, and one-on-one discussions at a recent SEMI-hosted seminar at the U. of Albany College of Nanoscale Science and Engineering (CNSE) spurred intense discussion about the state of leading-edge chipmaking technologies, including 3D ICs and new device structures, and why Wall Street and roadmaps are hampering true technology innovation.
CHAD Industries has launched WaferWare, a new software front end for its WaferMate family of automated wafer handling systems. The new WaferWare release was driven to provide a flexible software platform for automated wafer handling and to meet the SEMI E95-1101 specification.
While silicon semiconductor wafer growth was nearly flat year-over-year -- up 1% in Q2 2011 over Q2 2010 -- the unbroken supply chain is impressive in the immediate aftermath of the earthquake and ensuing tsunami in Japan.
Silicon carbide parts for semiconductor applications rose sharply in 2010, up 38% year-over-year to $200 million, according to Techcet. SiC fell 5% shy of the 2008 peak, and will see continued growth.
Ricky Jackson, Texas Instruments (TI), discusses analog IC developments, and how analog and digital semiconductors are pursuing Moore's Law and More than Moore in different ways. He also touches on TI's new fab capacity.
SEMICON West may not be the big-iron displayfest it once was, but there are still plenty of new product introductions to go around. Here's just a brief rundown of some of the ones we tracked from this year's show.
Translucent demonstrated its Mirrored Si technology on a 100mm-diameter wafer that exhibits high reflectivity using a lattice-matched REO material grown on a Si substrate, capped by a GaN layer that can support further nitride epitaxy for LED structure growth.
SEMATECH announced a 450mm imprinted wafer, accomplished by EV Group (EVG). Markus Wimplinger, EVG, described the timeline for the 450mm effort and how the company decided to make a strategic move.
Updates from ISMI's 450mm industry briefing at SEMICON West reveal intensifying participation and development underway for most required capabilities, and evaluations showing "low risk" for factory integration.
Since the beginning of 2011, the supply chain has been secure and ready to make the wafer size transition from 300mm to 450mm, says Tom Jefferson, 450mm program manager, ISMI, in this video interview at The ConFab 2011.
Building "cumulative headwinds" -- inflation, consumer skepticism, energy costs, and Japan recovery -- are causing semiconductors and display manufacturers to push out near-term orders, according to Applied Materials execs laying out their 2Q11 books and future projections. They also describe who's spending and who's not, why solar equipment is a concern, and what are three keys for bridging the 450mm wafer-size transition.
In an SST-exclusive series of blogs, imec reports from its International Technology Forum this week in Brussels. Geert Vandenberghe talks about how EUV lithography is at a readiness crossroads, but he feels "fairly secure" about its current capabilities.
Bob Krakauer, CFO of GlobalFoundries, summarized industry trends in manufacturing and end-applications, a changing foundry landscape, and his company's own long-term investments in semiconductor manufacturing, in his Confab presentation.
Mike Besnard, ATMI, speaks about evolving the high-productivity combinatorial research method to vet wafer processing tools for the ramp to high-volume, not just to screen semiconductor materials. He caught up with ElectroIQ.com at The ConFab.
Photoresist revenues will grow at about 5% for the next several years, says Techcet Group. Consolidation is long overdue among resist suppliers, and EUV may be the last straw. For materials, supply is abundant.
Avto Metals' Avto Quantum Transistor (AQT) modulates electrical signals via a tunneling electron either constructively or destructively interfering with electrons' wave function in a gate material. Avto credits a "unique surface geometry" for the transistor's properties.
FSI International Inc. (Nasdaq:FSII), surface conditioning equipment supplier, won orders for multiple ORION single wafer cleaning systems. A memory maker will use the ORION in wet photoresist strip and etch and a foundry will use it for backend-of-line (BEOL) processes, like cleaning film stacks.
Semiconductor Research Corporation and UCLA researchers developed design-dependent process monitoring for semiconductor wafer manufacturing. They expect the method to save 15% of semiconductor fab costs and boost productivity, potentially increasing per-chip profits by 12%. The yield improvement could equal that of a technology node, said one researcher.
Applied Materials (AMAT) unveiled the extension of its Reflexion GT chemical mechanical polishing (CMP) system to include planarization of tungsten films. Sidney Huey, director, CMP product manager, CMP Division, Silicon Systems Group at Applied Materials, discusses the tool and the technology.
The requirement for CMP slurry to perform consistently during the wafer polishing process has resulted in a push on the part of IC manufacturers to improve slurry metrics. Marty Mason, Vantage Technology Corp., explains how on-wafer slurry conditions can differ from slurry measurements, and new advances to rectify measurements.
IBM researchers built an integrated circuit (IC) fabricated from wafer-scale graphene on SiC, integrating a graphene transistor with other electronics circuits.
AMEC launched its Primo 300mm very-high-frequency advanced decoupled reactive ion etch tool for sub-28nm. AMEC's Ben Lee describes the tool's mini-batch cluster architecture, and the physics that makes it work.
EV Group (EVG) released a wafer bonding system for 450mm silicon-on-insulator (SOI) wafers: EVG850SOI/450-mm. EVG's Paul Lindner discusses the tool, and challenges of 450mm and SOI.
Bill Shaner, VP and GM, Microenvironments Division, Entegris, discusses key changes in the semiconductor manufacturing industry's move from 300 to 450mm wafers: Wafer fragility, wafer sag, increased weight, and higher capital investment.
Nordson MARCH introduced the FlexTRAK-WF low-cost, cassette-based automated plasma treatment system that handles five wafer sizes with minimal hardware change-over.
Solid State Technology and SEMI today announced the finalists for the 2011
Avantor Performance Materials will launch the first in its new J.T.Baker SLCT Series of selective etch surface treatment chemistries, SLCT 128 sigma etchant, at SEMICON West. The product results from a partnership with etch specialist SACHEM.
Applied Materials' new Vantage Vulcan RTP tool switches the heating to the backside of the wafer, to improve heat distribution and uniformity, widen the temperature range, and shorten residence times -- all of which are important as process technologies shrink to and below the 2Xnm generation, the company says.
The semiconductor sputtering target market is outgrowing semiconductor fab equipment as a whole, with double-digit growth through 2013. The skyrocketing price of tantalum is a major factor, but not the only one, says Techcet Group.
Semiconductor wet chemicals saw 13% growth year-over-year in 2010, while the electronics fab gasses market grew 16%, according to 2 new reports from Techcet Group.
The semiconductor industry will invest about $44 billion in production equipment globally in 2011, which industry organization SEMI calls a "record sum."
Applied Materials Inc. (AMAT) launched the Applied Vantage Vulcan rapid thermal processing (RTP) system for wafer annealing. Backside heating with AMAT's honeycomb lamp reduces "hot spots," enabling 20nm transistor designs.
Sharon Stiefel, IHS iSuppli, reports that a cushion in the semiconductor supply chain helped balance out off-line fabs in Japan following the Sendai-area earthquake and tsunami. As fabs ramp back up, or products are transferred to lines in other facilities, Q2 should avoid component shortages as well. But will the disaster be the end of just-in-time inventory management?
What is being called an "explosion" and/or "flash fire" at one of Intel's Chandler, AZ fabs injured eight people earlier this week (June 7), according to multiple reports.
Bill McClean, IC Insights, explains that demand is good for the IC industry, thanks to smartphones and tablets. Supply, on the other hand, is relatively tight. IC Insights is forecasting 10% growth for the semiconductor market in 2011. The video was recorded at The ConFab 2011 in Las Vegas.
At CEA-Leti's Annual Review, STMicroelectronics CTO Jean-Marc Chery reviewed the challenges facing IDM companies focused on SoC markets, and the three primary challenges for IDMs: FinFETs, EUV lithography, and 450mm.
At CEA-Leti's Annual Review, Leti CEO Laurent Malier noted how the important role that research and technology organizations should play in strengthening industry in Europe, and how their roles differ from groups in other regions.
To maintain profitability and growth in the next 10 years, semiconductor executives must understand and successfully execute lab-to-fab transitions of new technologies. 2 SEMICON West sessions aim to tackle these issues.
The board of directors of GLOBALFOUNDRIES appointed new leadership to run GlobalFoundries, the company's first CEO change since its inception.
Nigel Farrar, Cymer, provides a status report on EUV lithography source technology, extensions to ArF lithography, the laser crystallization process from the company's TCZ display equipment product division, and Cymer's newest DUV source product the OnPulse Plus data monitoring system.
GLOBALFOUNDRIES will use Intermolecular's High Productivity Combinatorial technology on research and development of its next-generation and mature semiconductor manufacturing lines.
The formation of advanced thin nickel-silicide films poses major challenges as devices integration moves beyond the 45nm technology node. X. Pages et al, Renesas Electronics, explain how optimized low-temperature rapid thermal processing (RTP) annealing schemes address this issue.
Suss Microtec and imec are expanding a research collaboration in mask cleaning to develop an in-fab approach to EUV lithography mask integrity, aiming to develop a sophisticated approach to preserving mask integrity prior to exposure.
ATMI's SVP/CTO, Larry Dubois shares the 3 guidelines ATMI keeps in mind when designing eco materials for semiconductor wafer fab, and gives an update on the materials supplier's LED fab products.
A trio of analysts who participated in SEMICON West's Bulls/Bears panel have some top-takeaways list for the industry: why WFE spending is slow, why it's only a short pause, and which will comes first, EUV or 450mm.
A four-month fab design verification project was approved for CEITEC S.A., for what is said to be the first semi conductor manufacturing facility to be built in Central and South America. CEITEC S.A. is a Brazilian company that produces application-specific standard products (ASSPs) for RFID, wireless communication and digital multimedia. The design verification project was overseen by Lotus Technical Services, one of five operational divisions of the LotusWorks based in Sligo, Ireland.
United Microelectronics Corporation (UMC) launched the A+ technology platform, a specialized 0.11
Mohith Verghese, ASM America, covers the gate stack changes expected when 22nm semiconductors ramp in volume production. Topics include high-k gate dielectrics, strained silicon including nMOS strain, and the importance of conformal deposition wafer processing technology.
The updated "Garment System Considerations for Cleanrooms and Other Controlled Environments" document includes new sections on measuring footwear, frocks and other garments, as well as a new subsection for tracking system use, such as RFID chips and barcodes.
Regardless of transistor architecture, the impact of process variability on device and circuit performance has emerged as a significant concern at 22nm. Effects that until recently were negligible or could be mitigated with improved wafer manufacturing control are now first-order effects, says Howard Ko, Synopsys, who outlines the main culprits.
Jenoptik plans to expand its Berlin-Adlershof semiconductor production facility to meet rapidly increasing demand, particularly from Asia, for high-power diode lasers.
Semiconductor execs are much less confident about the coming year's business prospects than they were leading into 2011, according to KPMG's annual survey.
Novellus authors investigated the film characteristics and process integration of TaN produced using iALD. High-density TaN with low resistivity and excellent conformality is demonstrated. With the adoption of Cu metallization, metal barriers such as TaN are needed to enhance the adhesion of metal to the dielectric and prevent the diffusion of Cu through the dielectric.
SEMI projects that worldwide sales of new semiconductor manufacturing equipment will reach $41.8 billion in 2011, decline in 2012, and rebound again in 2013. Front-end equipment experienced an increase in sales this year, while back-end tools saw a decrease.
ASM International N.V. created a new 14nm high-k gate dielectric process that achieved less than 6angstroms equivalent oxide thickness, while maintaining gate leakage below 1A/cm2.
Crossing Automation Inc., semiconductor fab automation product provider, introduced the Dynamic Access Recirculating Transport and Storage (DARTS) FOUP buffer to improve wafer movement and storage.
EV Group (EVG), wafer bonding and lithography equipment supplier, introduced the XT Frame equipment platform for better process throughput and tool functionality. The platform will be used for all high-volume manufacturing tool offerings.
Innolas Semiconductor GmbH, wafer sorting and laser marking system maker, received its first contract for a 450mm wafer handling system.
ULVAC Inc. developed the ENTRONTM-EX2 W300 CVD-Ni/CVD-Co system for CVD-Ni and CVD-Co silicidation of 3D semiconductor gates and MEMS. The system is a response to a semiconductor industry transition from PVD to CVD in advanced 3D gate structure film step coverage, ULVAC reports.
Dainippon Screen Mfg. Co., Ltd. has developed a scrubber-type SS-3200 single wafer cleaning system with up to 800 wafers per hour capacity and highly stable processing.
Under new CEO Ajit Monocha's realignment plan, GLOBALFOUNDRIES named new CFO, CTO, and customer engineering and quality leaders. The CTO position is a new one at the semiconductor foundry. The moves are meant to separate technology strategy from technology development.
Dr. John Chen, VP of technology and foundry operations at Nvidia, and Thomas Jefferson, ISMI's 450mm project manager, are among the updated speaking roster of ConFab 2012, which will address the economics of semiconductor manufacturing and associated industries (LEDs, MEMS, displays).
Applied Materials released a new film treatment, Applied Producer Onyx, that reduces the power consumption in semiconductor chips while increasing mechanical strength. The product targets the challenges associated with 3D packaging applications and technologies.
AKHAN Technologies has developed a shallow n-type diamond material over silicon that has characteristics such as a shallow ionization energy, high carrier mobility, and no graphitic phases. Adam Khan, president of AKHAN Technologies, says that the bottleneck in development of diamond films has always been the fabrication of n-type diamond.
Paul Feeney, director of process technology at Axus and ITRS co-leader for planarization topics, reports from the International Conference on Planarization/CMP Technology in Korea. Technical themes continue to address main areas (STI, ULK) but also explore new applications (e.g. TSVs), non-uniformity, and interaction between all the CMP process components.
Even if you don't plan on being a 450mm wafer size early adopter, should your planned upgrades handle the layout, utilities, vibration, and cleanroom criteria suitable for a 450mm semiconductor manufacturing environment? Yes, says Terry Behrens, or else be prepared to pay more.
"The recent period
Intermolecular Inc. (Nasdaq:IMI) priced its initial public offering of 9,650,000 shares of common stock at a public offering price of $10.00 per share.
Mattson Technology Inc. (NASDAQ:MTSN) received orders for multiple SUPREMA photoresist strip systems from a leading semiconductor manufacturer.
We scan the industry-watcher landscape to gauge reactions to the proposed Lam Research-Novellus combination: technology and customer synergies, valuation questions, and possible M&A aftershocks.
North America-based manufacturers of semiconductor equipment posted $973.3 million in orders in November 2011, $1.17 billion in billings, and a book-to-bill ratio of 0.83, according to the November Book-to-Bill Report from SEMI.
Lam Research Corp. (NASDAQ:LRCX) will acquire Novellus Systems Inc. (NASDAQ:NVLS), in an all-stock deal worth $3.3 billion. In addition, Lam Research announced a $1.6 billion stock repurchase program.
SEMI reports worldwide semiconductor manufacturing equipment bookings fell 38% year-over-year in Q3 2011; billings dropped 5% for the same quarter.
SEMI is looking for presenters for technical sessions and other opportunities at SEMICON West 2012, July 10-12 in San Francisco, CA.
SMIC entered into a settlement agreement with Elpida Memory Inc. to settle all pending arbitration claims and counterclaims relating to the parties' Amended and Restated 200mm Wafer Products Business Agreement.
Fraunhofer CNT and semiconductor fab equipment supplier ASM International NV will collaborate under a Joint Development Agreement on various new projects over the next 5 years, including CVD and ALD process development.
Siltronic, Wacker Chemie AG
A number of big-name frontend equipment firms highlight TSMC's annual supplier awards in 2011, as the foundry expands its list of top suppliers.
The last day of this week's SEMI/IEEE Advanced Semiconductor Manufacturing Conference (ASMC) featured talks on EUV readiness and hurdles, CMOS image sensors' increasing complexity, embedded memory failure analysis to improve yields, and a coming shift from chip technology efficiency back to innovation.
High performance and low power consumption are expected of today's chips and LEDs. Today's chip makers still expect to keep their costs down. The key to making this work, says Brian Trafas, KLAC, is yield optimization. Trafas, speaking at The ConFab 2011 in Las Vegas, touches on tool supplier/user collaborations as well.
Demand for semiconductor manufacturing equipment continues to inch up, with demand staying relatively steady as prior sales flush out the supply chain, according to data from SEMI.
Another eventful (but still rainy) day at this week's SEMI/IEEE Advanced Semiconductor Manufacturing Conference (May 16-18) offered two highlights sharing a theme: how partnerships can address challenges in device scaling and manufacturing.
Thomas Jefferson, ISMI 450mm program manager, presented results to date on the consortium's progress in ushering in the next wafer transition, and how industry participants are doing their part to keep momentum going.
An Steegen, imec, shares how imec is helping enable Moore's Law's continuation to <10nm. Moore's Law through 19nm could be lithography-enabled, Steegen says, but past that point we need to rely on materials, such as high-k, and new device architectures. She also provides an update on imec's EUV progress.
Bill Tobey, ConFab advisory board member and president of ACT International, discusses the role of fab managers in today's chip manufacturing environment. After the 2008 financial fallout, and 3 years of recovery, 2012 and onward present challenges and opportunities for research and development, collaboration, etc.
Nanotronics Imaging LLC launched the nSPEC semiconductor analysis system with proprietary software and hardware for rapid and detailed analysis of wafer defects. Complete system automation with cassette-to-cassette loading of 2-8" wafers is available.
Longtime semiconductor exec Takeshi Hattori continues his reporting on the aftermath of the massive Japanese earthquake and tsunami: new aftershocks have pushed back fab recovery efforts, some early estimates of lost productivity, preparing for summertime blackouts, and more tips for traveling to and around Japan.
ACS Motion Control developed an EtherCAT slave Universal Drive Module that directly drives one or two axes. The product suits use in wafer handling robots and positioning stages and optical wafer inspection as well as FPD inspection machines, custom robotics, and medical CT Scanning machines.
Alchimer's Erik Smith explains the molecular growth and building method of electrografting, and how electrolytic and electroless electrografting can grow isolation liners, fill through silicon vias (TSVs), and save money in the process.
Supply disruptions and potential shortages following the March 11 earthquake and tsunami in Japan have uplifted semiconductor prices, especially in the memory sector. This means increased semiconductor revenues in 2011, says IHS iSuppli.
The SD1024FL spectrograph replaces Verity Instruments' SD1024DL with improved line-shape uniformity, resolution, and noise equivalent power, as well as a second-order blocking addition.
Worldwide silicon wafer area shipments decreased slightly during the first quarter 2011 when compared to fourth quarter 2010 area shipments, and were marginally higher than first quarter 2010, according to the SEMI Silicon Manufacturers Group.
Longtime semiconductor exec Takeshi Hattori continues his reporting on the aftermath of the massive Japanese earthquake and tsunami: Japan's reviewing its energy policy to deemphasize nuclear power, and updates on recovery efforts at Renesas, Toshiba, and Tohoku U.
Novellus Systems (NASDAQ: NVLS) subsidiary Peter Wolters GmbH introduced innovative gap measurement technology for double-side silicon prime wafer polishing. New high-resolution sensors and software algorithms increase control of wafer quality, as well as throughput for the AC2000-P3 system.
Peter Singer recently toured the Center for Advanced Materials Processing (CAMP) at Clarkson University. The following video interviews with researchers and professors cover particle transport, chemical-mechanical planarization (CMP), cleanroom technologies, and bright nano particles, among other topics.
Total wafer demand will increase 11.2% to 185.3M wafers (200mm equivalent), with a number of factors driving growth above average rates, according to a recent Semico Research report.
A new "power" rankings list of chipmakers reiterates how 300mm chipmaking capacity is being concentrated to a select group of players -- i.e., the ones that equipment and materials suppliers will need to focus on for future business.
Carl Zeiss introduced a new production tool aimed to improve registration and overlay of advanced photomasks. RegC is based on ZEISS femtosecond-laser technology. RegC enables correction on high-end photomasks for remaining registration errors after the pattern generation process. Current results show registration improvements over 50% in advanced lithography.
Renesas Electronics America will sell its semiconductor wafer fabrication facility in Roseville, CA, to TELEFUNKEN Semiconductors International LLC. TELEFUNKEN will use the 200mm, 8" line at the Roseville factory to manufacture its own analog/mixed-signal, HV products, Renesas products, and jobs for strategic foundry partners.
Defect source analysis (DSA) and spatial signature analysis (SSA) go beyond process control to determine where in the process defects are introduced, which defects are common from one process step to the next, how defects propagate throughout the production line, and defect signatures and causes. John Robinson, KLA-Tencor, offers examples of defects and how these can be missed or mis-identified, wasting wafers and time.
As a follow-up Intel's announcement of a new 22nm trigate transistor structure, we polled and tracked multiple industry watchers for their thoughts on the technology. Their key takeaways: Intel reasserts its manufacturing prowess, and could be setting up for plays in mobile and foundry.
IXYS Corporation (NASDAQ:IXYS) and General Motors Components Holdings (GMCH) entered into an agreement for the fabrication of power semiconductor wafers at the Kokomo, IN plant.
Applied Materials said it will acquire Varian Semi in a $4.9B deal. VSEA stockholders have now approved the buy.
ASM International N.V. (NASDAQ: ASMI) received multiple system orders for its plasma enhanced atomic layer deposition (PEALD) reactor from a leading memory customer in Asia. The company also qualified a new PEALD oxide application with a memory manufacturer for the 2X nm node.
Crossing Automation received both new and follow-on orders for multiple 300mm Spartan Sorters. The orders were received from a single foundry customer and the systems will be installed in two of its leading-edge semiconductor manufacturing facilities for use in volume production.
Longtime semiconductor exec Takeshi Hattori continues his reporting on the aftermath of the massive Japanese earthquake and tsunami: Updates on upcoming summertime electricity demand, Renesas and SEH restarting operations, and more travel tips to Japan.
Longtime semiconductor exec Takeshi Hattori continues his reporting on the aftermath of the massive Japanese earthquake and tsunami: Updates on efforts to control the nuclear crisis, efforts to shift to "summertime" schedules to manage energy usage, and evidence of shortages in key materials for semiconductor manufacturing (H2O2 and silicon).
The F30 module offers improved throughput over the entire sensitivity range. Two European fabs, a leading Asian foundry, a leading MEMS producer, and a process equipment manufacturer that is developing an integrated inspection solution have ordered the Rudolph system.
At 13% of the total equipment spending for semiconductor manufacturing, secondary equipment and services are gaining importance at both 300 and 200mm fabs. SEMI and Semico announce results of their Secondary Semiconductor Equipment Market Study.
Applied Materials Inc. (AMAT) launched the Applied AKT-Aristo Twin system for manufacturing touch-enabled displays. Featuring two independent processing tracks on a single system, the AKT-Aristo Twin enables simultaneous fabrication of two different film stacks.
Two keynote talks at The ConFab 2011 will address the impact of the ongoing disaster in Japan, including the state of Japan’s semiconductor manufacturing operations and the impact of lost production on the supply chain. Keenan Evans, the Senior Vice President for Quality, Reliability & EHS for ON Semiconductor, will give the keynote on the first day of the conference, May 16th. Bill McClean, President of IC Insights, will give the keynote on the second day, May 17th.
Analysts break down Texas Instruments' proposed acquisition of National Semiconductor: Key factors, where both companies benefit, whether TI is overpaying, and if more analog M&A is imminent.
TowerJazz is looking to buy Micron Technology's semiconductor fab in Nishiwaki City, Hyogo, Japan. The proposed purchase would nearly double TowerJazz's current internal manufacturing capacity, increasing production by 60,000 wafers per month, and set up a supply agreement between the companies.
Longtime semiconductor exec Takeshi Hattori continues his reporting on the aftermath of the massive Japanese earthquake and tsunami, with updates on the nuclear crisis, advice on traveling to Japan, and the current status of facilities and production struggles.
As SEMI's numbers for semiconductor manufacturing equipment climbed again in March, one slice of the data suggests that the backend-as-leading-cyclical-indicator wisdom we've been taught to follow may not be valid this time around.
Brooks Automation Inc. (Nasdaq:BRKS) will sell its contract manufacturing business to Celestica Inc. for approximately $80 million in cash. Cash generated from this transaction will fund initiatives that leverage its existing technology capabilities, particularly into market sectors other than wafer frontend semiconductor capital equipment.
Aerotech's AVS1000 series stages suit applications that require positioning of large or heavy loads over very small incremental movements in elevation above a horizontal plane. A low profile and precise motion capability make these stages a fit for semiconductor manufacturing and inspection.
Kilopass Technology Inc., semiconductor logic non-volatile memory (NVM) intellectual property (IP) provider, unveiled Itera, an embedded multi-time programmable (MTP) NVM in 40nm.
Boston Semi Equipment acquired the assets of Asia Tech Corporation, launching BSE Tech LLC. BSE Tech will deliver pre-owned front end semiconductor manufacturing equipment and spare parts, technical capabilities and financial solutions from a larger facility, with added cleanroom space.
Picosun Oy has launched production of plasma enhanced ALD (PEALD) systems based on a highly advanced ion-free remote plasma source, Picoplasma. Various excited species such as oxygen, nitrogen and hydrogen radicals with zero charge can be generated to broaden the range of ALD process chemistries.
GT Solar International Inc. (NASDAQ:SOLR) introduced the ASF100 advanced sapphire growth system, which produces larger 100kg sapphire boules in the standard furnace chamber. Larger sapphire boules can enable lower costs for LED chips.
Varian, Novellus, and Disco prove that customer service really does matter, in VLSI Research's latest annual customer satisfaction survey of large and small chipmaking equipment suppliers.
LED manufacturing processes lack the level of automation seen in the semi chip fab industry. Wafer size transitions are occuring rapidly, and thicknesses also vary. The forefront of LED fab, much like chip fab, is wafer level packaging, cluster tools for automation, and advanced substrate materials. Iain Black, Philips Lumileds, presents an overview of LED fabrication, device architectures, and markets for the end products.
Gary Green, co-chair of the interactive poster session at last week's Advanced Semiconductor Manufacturing Conference (ASMC), reviews key themes discussed, including the need for collaboration across several fields, as well as technical topics from metrics for defect sampling to lithography patterning for 32nm and below.
Janice Golda, Intel, co-led a session at The ConFab 2011 on continued device scaling. EUV infrastructure will be a major topic, as well as transistor challenges. While lithography difficulties exist at tighter device densities, Golda reminds us that metrology obstacles must also be tackled.
Silicon Valley's NY cousin, Mohawk Valley, is attracting investment with university-industry collaborations on leading edge semiconductor manufacturing. Mark Reynolds, Marcy Nanocenter and Mohawk Valley Edge and David Rooney, Center for Economic Growth, speak with Debra Vogler at The ConFab 2011.
Weimin Li, ATMI, looks at changes in the materials side of wafer fab that might occur in 2011, especially for advanced DRAM devices. For every evolutionary change or radical new method, cost and performance considerations are high. This is an online exclusive essay in SST's Forecast for 2011: Back to Reality series.
Wafer fab capex in 2011 is expected to stick around 2010 levels. But don't despair of growth, says Dean Freeman of Gartner. For one thing, cutting-edge wafer fab equipment will be hot. On top of that, 2011 will be a brief respite, with a strong 2012/2013 waiting in the wings.
Toppan Printing Co. Ltd. extended a joint development agreement with IBM for leading-edge photomask process, covering the 14nm technology node for logic devices. Toppan and IBM will focus their joint development efforts on ArF immersion lithography for the 14nm node.
The conditions and challenges at the 22nm technology node are becoming clear: double patterning, source-mask optimization are becomign pervasive, EUV is on the doorstep, and they will all have significant impact on mask manufacturers, writes Franklin Kalk from Toppan Photomasks.
CyberOptics Semiconductors updated its wafer vibration monitoring software, offering new capabilities for data analysis and third-party data interfaces. CyberOptics’ AVS 2.0 vibration monitoring software provides engineers with the data needed to predict equipment failures related to vibration during semiconductor fabrication to improve process yield and cycle times.
Ionizers can improve wafer back- and frontside particle performance in PVD processing tools by removing surface charges that hold electrostatically adhered particles. Controlling charges results in higher yields for chip manufacturers and improved tool performance. Viraj Pandit and Emery Kuo, Novellus Systems and Cheryl Avery, ION Systems show that the INOVA PVD system’s good particle performance (with good quality wafers) is made more robust with an ionizer installation (with marginal quality wafers).
Spacers are considered "conventional materials," and thus an odd topic for the cutting-edge IEDM. ASM CTO Ivo Raaijmakers points out that semiconductor fab below 22nm will require different processes for spacers: atomic layer deposition (ALD) and plasma-enhanced ALD (PEALD).
Jonathan Rullan et al compare resistance from chemical vapor deposited (CVD) ruthenium liners and direct seed (DS) copper used with advanced Electrofill processes to conventional methods, using different annealing temps and simulated back-end-of-line (BEOL) thermal stress builds. 2X nm trenches were shown to have complete gap fill, eliminating the need for conventional PVD Cu seed.
Robert L. Rhoades, Entrepix, examines the ever-shrinking contamination particle size, and the switch from immersion cleans to single-wafer systems. Custom solutions and new materials at the 22nm wafer fab will mean custom CMP and clean formulations -- if possible, tunable by the user. This is an online exclusive essay in SST's Forecast for 2011: Back to Reality series.
Gilles Baujon, CEO of Nanoplas, explains how the industry's migration toward the 32nm and 22nm nodes will require development of new process integration schemes, device structures, new materials assemblies -- and thus innovative surface-engineering solutions.
To help the global semiconductor industry prepare for the 22nm node and 450mm wafers, sealing products supplier Applied Seals North America is leading a new SEMI Standards task force to develop the first substantial standards for perfluoroelastomer (FFKM) o-rings and sealing elements.
Ultrasonic Systems, Inc. (USI) released a heated vacuum chuck option for the Prism spray coating system. The heated vacuum chuck option for Prism suits thin substrate, wafer, foil, and membrane coating applications, where it enhances control of the substrate.
KLA-Tencor (KLAC) debuted an automated inspection system for substrates and epitaxial wafers used in HBLED manufacturing. The Candela 8620 provides automated defect inspection for LED materials such as gallium nitride, sapphire, and silicon carbide, enabling enhanced quality control of both opaque and transparent substrates, faster time-to-root cause, and improved MOCVD reactor uptime and yield. Frank Burkeen, KLA-Tencor, discusses the Candela 8620 inspection system.
The amount of data that will need to be moved in the not-too-distant future motivates research into a better way to connect devices, said Intel Fellow and director of the Photonics Lab at Intel Labs, Mario Paniccia, at SEMI’s Industry Strategy Symposium (ISS). Paniccia discusses the manufacturing requirements for silicon photonics, including optical testers.
Paul Kirby, FEI, provides insights on the shift to complex 3D device structures and complex interconnect methods such as TSV. In the future, 3D analysis techniques could play increasingly important roles, he says. In advanced packaging, failure analysis is more critical because multi-die stacks can fail due to one bad die. This is an online exclusive essay in SST's Forecast for 2011: Back to Reality series.
With double-digit growth in consumption in key sectors (PCs, cell phones), strong GDP increase, wafer fab capex increases, and firm ASPs, Bill McClean, president, IC Insights, gave SEMI Industry Strategy Symposium (ISS) attendees some "reasons for optimism."
McPherson’s high-resolution spectrometer, Model 2061, is now available for scanning and imaging applications via 2D CCD or CMOS detectors. It suits emission, luminescence, Raman (strained Silicon), and high-temperature plasma measurement with better than 0.02nm full width half maximum spectra.
AMEC says it's won two key patent disputes with Lam Research over etch technologies. Is this merely marketplace posturing, or is there significance here?
CAMECA unveiled the latest addition to its line of high-end metrology systems: the EX-300 metrology tool targeted for front-end process control of 22 nm technology nodes and beyond. e EX-300 is a versatile metrology tool based on LEXES (Low-energy Electron induced X-ray Emission Spectrometry) technology.
Appropriate for this blustery ski season, the clear view of semiconductor equipment demand appears to be heading down a slope, according to data from semiconductor manufacturing equipment makers.
By the end of 2011 there may be only three leading-edge high-volume foundries -- TSMC, GlobalFoundries, and Samsung -- able and willing to push the leading edge of CMOS through the 32nm and to 22nm and beyond, says IHS iSuppli.
Sanjay Yedur et al, from Pivotal Systems and J.H. Lee et al from Samsung’s R&D Equipment Engineering Team discuss the use of a real-time gas flow monitoring system that allows for in-situ flow measurements, based on a highly accurate rate of pressure drop over a known volume and temperature. Using this system, insights are gained on the run-to-run repeatability of mass flow controller (MFC) transient and steady-state flow during wafer processing.
Aki Fujimura, chairman & CEO of D2S, provides an update of the eBeam Initiative roadmap. Speaking at SPIE Advanced Lithography with editor Debra Vogler, Fujimura recalls mask cost/yield and write time developments, summarizes the eBeam Initiative's meeting, and describes member Dai-Nippon Printing's impressive time results with an "impossible" mask.
Novellus Systems (NASDAQ: NVLS) debuted the VECTOR Excel for pre- and/or post-processing of dielectric films, such as diffusion barriers. New interface engineering reduces the RC delay constant without incorporating new materials into the back-end-of line (BEOL) integration scheme.
Mattson Technology Inc. (NASDAQ: MTSN) introduced the SUPREMA XP5 photoresist dry strip system for high-volume production of current and future-generation logic, DRAM and flash memory devices.
ON Semiconductor Corporation (Nasdaq: ONNN) completed its acquisition of SANYO Semiconductor Co., Ltd., a subsidiary of SANYO Electric, and other assets related to SANYO Electric’s semiconductor business.
Dan Armbrust, SEMATECH, spoke about the role of collaboration in his SEMI Industry Strategy Symposium presentation. Significant technology transitions facing the semiconductor industry include lithography (introduction of EUV), interconnects (TSVs and 3D packaging), and productivity (450mm wafer manufacturing). Additionally, disruptive technology in logic and memory devices will challenge the industry.
For the first time, the newly updated International Technology Roadmap for Semiconductors (ITRS) overtly addresses energy consumption. Laura Peters looks at how the ITRS maps out the influence that devices can have on power consumption in various applications, and long-term goals for developing energy-efficient materials and devices.
SoftJin Technologies, a provider of customized automation software for electronic design and manufacturing, enhanced NxDAT, its defect analysis software. The enhanced version of NxDAT is optimized for better speed and memory performance.
Custom fabricated sapphire wafer carriers that are uniform, parallel, and impervious to solvents and etchants for thinning semiconductor materials are available from Meller Optics Inc.
Novellus Systems subsidiary Peter Wolters GmbH introduced a new version of its microLine double side lapping system for prime silicon wafers. The AC-2100L system features independently driven inner and outer pin rings, automatic force calibration, and in-situ wafer thickness metrology.
Wafer capacity rose about twice as fast as output in the 2010 calendar year-ending quarter, so utilization rates pulled back slightly -- but one sector showed surprising strength.
Xradia has unveiled its latest micro computed tomography (CT) 3D X-ray imaging system, the VersaXRM. Kevin Fahey, PhD, VP of marketing at Xradia, discusses how the new platform uses geometrical magnification in tandem with an X-ray microscope.
Sales of semiconductor materials rose 25% in 2010 to a new record $43.55B thanks to surging device shipments, according to final tallies from SEMI.
Longtime semiconductor exec Takeshi Hattori reports on the aftermath of the massive Japanese earthquake and tsunami, updating the status of facilities and the struggles to ramp production in the face of rolling blackouts (hint: overnight operations) and major holes in the supply chain.
András Poppe, PhD, marketing manager in Mentor Graphics' MicReD division, discusses LED testing challenges, such as neglected power flux, LED cooling, and the gap between lab and real operating conditions.
There are over 100 production semiconductor fab lines in 53 locations in Japan, say analyst groups IHS iSuppli and Semico. Over a week after the crippling earthquake and tsunami hit northeastern Japan, analysts consider the next business step, with power outages and aftershocks still disrupting production in areas not directly hit by the crisis.
Veeco Instruments' new TurboDisc MaxBright GaN MOCVD multi-reactor system is poised to take advantage of what the company believes is an accelerated rate of LED TV penetration. The new system targets manufacturing of HB-LEDs and is capable of single- or multi-chamber layer growth.
Finally feeling the heat of price whipsaws (or withering stare of inevitability), Taiwan DRAM players seem ready to embrace tie-ups with Japan's Elpida Memory.
Global wafer shipments and revenues rebounded strongly in 2010, according to updated data from SEMI's Silicon Manufacturers Group (SMG) -- but one is at record levels while the other lags behind.
TSMC's Morris Chang has laid out a surprisingly bullish timeline for the foundry's 450mm wafer-size transition. Analysts weigh in on whether TSMC's goals are achievable, and what it means for the rest of the industry.
Avantor Performance Materials, Inc. (formerly Mallinckrodt Baker, Inc.) plans to open an electronics applications laboratory in Taiwan in 2Q11, to conduct customer demos, perform process-of-record (POR) development, and support the company's global electronics technologies development.
After beta testing and product analysis, CyberOptics Semiconductor has released the WaferSense Airborne Particle Sensor for wafer processing equipment. The sensor identifies particle sources in tools, moving through semiconductor process equipment and automation material handing systems to monitor airborne particles. It reports information in real-time on wafer contamination.
Xitronix Corporation, a developer of advanced measurement systems designed to control key process steps in semiconductor manufacturing, received a final judgment invalidating KLA-Tencor Corporation patent claims against the company.
On March 2, Solid State Technology and LEDs Magazine will co-host "Light and Color Measurement of Today's LED Technology," a free webcast sponsored by Konica Minolta Sensing Americas. The company's presenters will provide in-depth information on optical measurement techniques of LED technology, such as lighting, color theory, and LED structure.
Siltronic completed the SIGMADT research project, which aimed to adapt the properties of silicon wafers to the requirements of future three-dimensional transistors. To achieve higher efficiencies and lower energy consumption for future electronics densities, the transition into the third dimension for transistors is an important step, say researchers. The starting material -- the silicon wafer -- was the focus of this work.
The adaptive SMIF-LPT solutions offer cost-effective upgrades of non-SMIF tools to SMIF, thereby enabling the conversion of existing 200mm facilities for semiconductor manufacturing at technology nodes below 180nm.
Reticle Labs released RS-Mini, an enterprise-class highly compact mask inspection defect management framework for mask and wafer fabrication plant infrastructure. It allows fabs to share inspection results, track defect trends, summarize inspection results from multiple systems, and more.
Live from Japan, longtime semiconductor exec Takeshi Hattori describes the situation facing semiconductor fabs -- and why power blackouts are the real problem, not earthquake or tsunami damage.
Applied Materials Inc. (AMAT) introduced the Applied Centura Conforma, with conformal plasma doping (CPD) targeted for 22nm and beyond logic and memory chips. The technology replaces ion beam implantation for conformal doping of complex 3D structures.
Applied Materials Inc. (AMAT) debuted the Applied DFinder darkfield inspection system, which uses deep ultraviolet (DUV) laser scanning for particle sensitivity down to 40nm on patterned wafers. The product suits inspecting the interconnect layers in 22nm and below memory and logic chips.
EV Group (EVG) received an order from new customer Shenyang Silicon Technology Co. Ltd. (SST). SST will use an EVG850LT automated production bonding system for silicon-on-insulator (SOI) wafers.
An earthquake of magnitude 8.9 struck March 11 off the coast of Japan's main island, Honshu. Jim Handy, Objective Analysis semiconductor market research, and other analysts share insights into Japan's semiconductor fabs and the quake's impact range. The update includes information from individual semiconductor companies in the area.
Among the topics covered at KLA-Tencor’s annual Lithography Users Forum was extension of KLAC's Teron 600 platform for inspection of EUV blanks at the 16nm hp node. Here, Brian Trafas speaks with Debra Vogler about process control in advanced lithography.
Applied Materials integrated Magma's CAD-based navigation and yield analysis software with AMAT inspection systems; it's called Excalibur Litho and targets designs at 2xnm and below. Ankush Oberai, Magma and Erez Paran, AMAT, explain why hot spot identification and real line data for libraries will fuel better lithography processes.
Toppan Photomasks will expand its Shanghai manufacturing operation serving China's semiconductor industry. Costing about $20 million, the expansion will increase photomask production significantly, and enable more advanced photomasks made with feature sizes as small as 90nm.
Reversing its 2009 decision to close the 200mm wafer fab, Fairchild Semiconductor (NYSE:FCS) will keep open its Mountain Top, PA, facility. Moutain Top makes high-voltage and automotive semiconductor products.
ICs manufactured at 65nm nodes and smaller introduce new design-specific and feature-sensitive failure mechanisms, with systematic yield issues even more challenging to diagnose and overcome. SMIC and Mentor Graphics cover how to use scan diagnosis for better semiconductor yields.
Applied Materials Inc. (Nasdaq:AMAT) presented five companies with awards for helping Applied meet its strategic business goals in 2011.
Boston Semi Equipment LLC (BSE Group) established Boston Semi K.K. in Tokyo, Japan, for customers of its flexible financing on front-end and back-end semiconductor manufacturing equipment.
TSMC's Board of Directors approved additional capital expenditures for advanced semiconductor manufacturing technologies and more 12" wafer capacity. The company also nailed down its R&D and 2012 capex budgets.
Plasma-Therm LLC sold a multi-chamber VERSALINE etch and deposition system to a leading North American wireless compound semiconductor manufacturer.
Simulation work can play an important role in understanding fundamental plasma physics, and providing insights into process optimization and development in wafer etch and deposition. Quantemol and TEL authors discuss their simulations and observations.
Dual-beam laser spike annealing (LSA) technology allows access to new temperature-time regimes and enables new CMOS logic applications for the 28nm node and beyond. J. Hebb et al, Ultratech, explain dual-beam LSA's use in long dwell time, and low-temperature applications.
Brooks Instrument launched a new Safe Delivery System (SDS) option for its GF120 mass flow controllers. The GF120 SDS is a low-pressure drop mass flow controller that delivers sub-atmospheric SDS gases used in implant and etch processes.
Fabricated silicon parts for semiconductor and LED equipment use made up a $310 million market in 2010, according to the Techcet Group. By 2014, the market will reach $412 million.
Gallium nitride (GaN) based devices are launching for applications in defense, wireless infrastructure, CATV, satellite and power electronics markets, according to the Strategy Analytics GaAs and Compound Semiconductor Technologies Service viewpoint.
Lam Research Corporation (NASDAQ:LRCX) will transition Martin B. Anstice to CEO with the new year. Anstice has spent 10+ years with LRCX, including his roles as president and COO (current), and CFO.
SEMI and the SEAJ gathered semiconductor manufacturing equipment sales and shipments data from over 100 global equipment companies for their Q2 report. While shipments (billings) rose 31% over Q2 2010, sales (bookings) fell 8% YOY.
Mattson Technology received multiple follow-on orders for its SUPREMA photoresist strip systems from major customers fabs in Asia, Europe and the US for volume production of advanced logic, foundry and flash memory devices for 3Xnm and below technology nodes.
Noting caution in the markets, SEMI has revised its World Fab Forecast to a 23% year-on-year increase, down from the 31% growth forecast in May 2011. Capital expenditure will still increase to $41.1 billion in 2011.
The SIA's latest monthly numbers suggest the chip market remains stalled, though some industry watchers still hope for a seasonal growth push in 4Q11.
North America-based semiconductor equipment manufacturers posted $1.18 billion in orders in August 2011, which led to a book-to-bill ratio of 0.80, according to SEMI's August Book-to-Bill Report.
Techcet's Michael A. Fury shares some bullet-point analyses from IC Insights' Fall Forecast Seminar in Sunnyvale, CA, where the firm offered its latest take on semiconductor sales, capex, and application growth for 2011 and 2012.
Techcet's Michael A. Fury reports from a NCAAVS CMP user group meeting in San Jose, CA, with the overall theme of CMP for the hard-disk drive industry: market outlooks for HDDs, different requirements and challenges vs. IC manufacturing, and new technologies and applications for CMP in patterned media.
Jim Walker, VP, Research of Semiconductor Manufacturing and Emerging Technologies, at Gartner, speaks with Solid State Technology about revising Gartner
Slowing foundry demand, lower utilizations and "an awful lot" of equipment reuse at 28nm, DRAM going nowhere, and debate about how long into 2011 it'll all last -- all these were top of mind among AMAT executives and industry watchers after the company released its fiscal 3Q11 (July quarter) results and commentary.
Imec highlights recent research on using CVD, and commercially available precursors, to grow GeSn in a manner that could be replicated on 200mm and 300mm wafer production environments.
Micronas (SIX Swiss Exchange: MASN) is acquiring a EUR10 million stake in the X-FAB Silicon Foundries Group, which is also supporting Micronas with 0.18um high-voltage CMOS process with embedded flash manufacturing.
The IC industry, which had a phenomenal growth year in 2010, is in a cautious mode under greater macro-economic uncertainty and hesitancy. Some positive milestones are on the horizon, however, shows data within IC Insight's Mid-Year Update, such as the 200 billion IC shipment milestone in 2011, and the $300 billion mark expected in 2013.
The U.S. Court of Appeals for the Federal Circuit issued an opinion yesterday vacating the adverse judgment against Camtek in a patent infringement case brought against it by August Technology Corp., now Rudolph Technologies Inc.
Semiconductor manufacturing using 12" (300mm) wafers enables scalability for high-volume wafer fab. 300mm production will nearly double from 2010 to 2015 as IDMs and foundries recognize the value of 300mm wafers for mature products, according to IHS.
Rubicon Technology (RBCN) completed company-wide enhancements to its proprietary crystal growth furnaces, upgrading to Rubicon Furnace Version ES2-XLG3.0, which produces large-diameter sapphire material with greater automation and higher yields.
A rising LED surplus, slowed LED adoption, tighter credit in China, and other factors are converging to stall out MOCVD equipment installs in 2011. Once the LED oversupply is drained off, LED manufacturers will kickstart capacity expansions, likely in 2012, according to IMS Research.
Three years after shuttering its East Kilbride operation, Freescale sloughs off the operation to a real estate developer, though it's leasing back some of the site for R&D.
CHAD Industries launched the WaferMate300-2SS sorter/stocker workcell with multiple customer installations. The compact wafer buffer modules each hold 150 wafers.
Taiwan's Sino-American Silicon Products (SAS) is acquiring Japan's Covalent Materials' (n
KLA-Tencor Corporation (NASDAQ:KLAC) launched the eDR-7000 electron-beam (e-beam) wafer defect review system for chip manufacturing at the 20nm device nodes and below.
OPC technologies use aggressive assist features with sub-80nm features on the mask to offer improved process window, and therefore yield. MB-MDP, coupled with new-generation mask-writing equipment, produces overlapping e-beam shots that result in lower shot count.
Translucent launched its Si wafer templates commerically for GaN growth, and Bridgelux set a new Lumens/W record for Gan-on-Si LEDs.
Singapore has launched the Manufacturing Productivity Technology Centre at A*STAR's Singapore Institute of Manufacturing Technology. GlobalFoundries signed a 5-year Manufacturing Productivity Enhancement master plan agreement with SIMTech, working on materials recycling, wafer transport, and more.
Analog semiconductors will buck the trend of contraction in the overall chip industry, growing 13.8% in 2011, 8.6% in 2012, then 12.8% in 2013.
Jan Willis from the eBeam Initiative summarizes the group's annual event at SPIE BACUS 2011, with presentations on both improving wafer quality and mask write times at the 20nm node. Other presentations dealt with EUV masks and a lack of funding support.
The fab-lite (or asset-lite) trend in IC industry has spread quickly and caused a good deal of debate about the future of chip making, says IC Insights in its latest research bulletin from The McClean Report. Fab-lite integrated device manufacturers (IDMs) from the US and Europe are now joined by large Japanese IC makers -- Toshiba, Renesas, Sony, and Fujitsu -- increasing utilization of third-party foundries.
Mark Danna, Owens Design, continues his series on the right way to outsource a project. Take these 3 steps before deciding on an outsourcing partner: Check references, consult your professional network, and do some online research.
FSI International (Nasdaq:FSII) will ship an ORION single wafer cleaning system to a leading Asian semiconductor foundry for 28nm FEOL cleaning.
Semiconductor equipment spending in 2011 looks to be slightly weaker than anticipated, and is looking a lot softer in 2012 across the board, according to Gartner's new semiconductor capex forecasts.
Engineers at the NIST Center for Nanoscale Science and Technology (CNST) NanoFab have developed a plasma etch/argon process that improves etch rate, mask selectivity, and the sidewall profile of silicon structures.
Applied Energy Systems Inc. is breaking ground on its Semiconductor Equipment Manufacturing and Technology (SEMAT) Center next week. The SEMAT Center will manufacture leading edge gas source and distribution systems.
Semico predicts that the semiconductor manufacturing industry is undergoing a three-quarter (Q3 2011-Q1 2012) downturn, with foundries trimming capital expenditures and OEMs holding excess inventory.
Extreme ultraviolet (EUV) lithography introduces new patterning distortions -- flare along with proximity effects -- that must be accurately modeled and corrected on the reticle. James Word and Christian Zuniga of Mentor Graphics discuss an all model-based approach to flare compensation.
With PC demand waning, reports indicate Intel is rethinking part of its 22nm investment plans, which would dent industrywide capex forecasts for 2012.
Mark Danna, Owens Design's VP for new business development, covers the questions to ask when you’re looking for the right outsourcing partner on a particular project. This article is part of a series from Owens Design on outsourcing decisions.
SEMICON Taiwan (Sept. 7-9) approaches, the island's most celebrated event for microelectronics manufacturing, coorganized by SEMI and the Taiwan External Trade Development Council (TAITRA), offers more than 60 programs and sessions and 550 exhibitors spanning the entire semiconductor value chain and related high-growth industries.
Alpha and Omega Semiconductor will exercise an option to acquire 200mm wafer fabrication facility assets from Integrated Device Technology, taking it from fabless to fab-lite for faster time-to-market for high-value products, along with expansion into new markets.
Update: Video interviews with the award winners. Semiconductor Research Corporation (SRC) bestowed its Aristotle and Technical Excellence awards on teams researching TCAD IC simulation and test/validation methods on the IC fab line.
Scott Zafiropoulo explains Ultratech's business and positioning strategies in an interview at SEMICON West, including how the company weathers market cyclicality and prepares for a 450mm wafer-size transition.
IC manufacturers are becoming more aggressive with strain engineering as they go from 28nm to more advanced nodes, explains Jeff Hebb, VP of laser product marketing at Ultratech. The company is working on a dual-beam laser-spike annealing to address requirements for 20nm and 14nm.
Syn: Robert Newcomb from Qcept Technologies discusses non-visual defects in today's wafer fab processes, at 22nm, and in the advanced nodes below 22nm. As nodes shrink, more defects will escape optical metrology, he predicts.
New York State has entered into agreements for $4.4 billion in investments over the next 5 years from Intel, IBM, GlobalFoundries, TSMC, and Samsung to create a 450mm consortium and manufacturing center there.
SEMICON Europa is coming up fast (Oct. 11-13), and SST (and some friends) will be reporting on-scene. Here's a summary of the presentations we're looking forward to, from the Fab Managers' Forum to conferences on test, packaging, MEMS, and hot topics including 3D ICs and 450mm.
Crossing Automation Inc. launched its 450mm sorter, the Spartan 450. A leading semiconductor manufacturer has ordered the sorter, Crossing Automation reports, planning the install in Q1 2012.
Macroeconomic factors will tug down global electronics demand in 2011, said IHS, which lowered its semiconductor revenue growth forecast for 2011. While the slowdown comes at a bad time -- pre-holiday sales season -- lessons learned in 2008 could shorten the down period significantly.
Synopsys enhanced its TetraMAX ATPG and Yield Explorer to improve volume diagnostics flow and speed up yield ramp for IC manufacturing. Flow in TetraMAX ATPG and Yield Explorer is automated with a new direct connection between the two products.
InstruTech released its Cold cathode Ionization vacuum gauge CCM501, which the company is calling its Hornet module. The CCM501 is a rugged Cold Cathode gauge based on double inverted magnetron technology. It measures pressures from 1 x 10-8 to 1 x 10-2 Torr.
Reporting from this week's SPIE BACUS Photomask Technology conference, Franklin Kalk from Toppan Photomasks picks through the "10 best" papers that were to have been presented at Photomask Japan earlier this year.
Paul Fego from Texas Instruments, a keynote speaker at ISMI Manufacturing Week (Oct. 17-21, Austin, TX), summarizes how TI's collaborative culture can address specific semiconductor manufacturing challenges -- notably the ramps of its 300mm analog fab and assembly/test factory.
Imec and Lam Research have developed a quantitative evaluation method for wafer drying techniques. Silicon nano-pillar test structures with high aspect ratios (up to 28) demonstrate the mechanisms of pattern collapse and sticking in the wafer drying step.
Awaiting "stability in the overall economic outlook," semiconductor device makers spent 40.4% less with North America-based manufacturers of semiconductor equipment year-over-year in September 2011. The September book-to-bill ratio published by SEMI fell to 0.75.
Mattson Technology Inc. (NASDAQ: MTSN) won acceptance for its Helios XP rapid thermal processing (RTP) system for process of record from a major Asian foundry.
Once you've chosen an outsourcing partner, focus on the details. Mark Danna of Owens Design shares how to write a project specification that is adaptable and designed to bring a project in on time and on budget.
Demand for NAND devices will grow more than 20% in 2011, while DRAM demand will decline by more than 1%. Other trends? 45nm and smaller nodes are increasing market share, says Semico.
RASIRC debuted the Steamer Turbo for specialty applications in the semiconductor and photovoltaic industries, featuring integrated gas blending control.
ATREG's Barnett Silver reports from SEMICON Europa, where the overall mood on the show floor is optimistic yet cautious, with hope for strong growth by mid-2012. Key themes include a slowdown in 200mm demand, an elite membership for 450mm, and keen interest in MEMS.
Edwards Limited expanded its iXH harsh process dry pump family with the iXH500H series of 500m3/h pumps optimized for flat panel display (FPD), solar, and advanced semiconductor processes requiring high gas flows and flexible pump temperature profiles.
While the market has currently softened, early-2011 momentum will carry the year's semiconductor silicon sales to a higher total than 2010, said Stanley T. Myers, president and CEO of SEMI, noting the figures are an industry record. Growth will continue at "modest levels" through 2013.
Imec and tool vendor ASML have signed a new 5-year deal to continue collaboration on lithography technologies, both immersion and EUV, as well as associated components -- including new sensors to help calibrate lens alignment and dose.
Key themes summed up from ISMI's Manufacturing Week (Oct. 17-21) included predicting and monitoring equipment health, optimizing WIP and maintenance scheduling, reducing energy consumption at both the tool and fab-wide level, and various areas of nanomaterial health/safety concerns.
"Silicon shipments for the most recent quarter are reflecting the general hesitancy of the market,
Avantor Performance Materials and SSMC Inc. compare the use of a semi-aqueous post-etch ash residue remover with an industry-standard HA-based residue removal chemistry. The semi-aqueous-based product was shown to reduce COO for manufacturing of low- and high-voltage logic devices, and increase yields.
The Semiconductor Industry Association (SIA) elected Freescale Semiconductor CEO Rich Beyer as its 2012 chairman. This will be the SIA's 35th year.
ATMI has taken control of, and responsibility for, worldwide distribution of its proprietary Safe Delivery Source (SDS), gas storage and delivery system and related technologies from Matheson Tri-Gas.
Crossing Automation Inc. introduced its Crossing Spartan 450mm Development Platform and Crossing Certon 450 Loadport. Crossing Automation's May Su discusses the product design, including single FOUP EFEM.
GLOBALFOUNDRIES named Ajit Manocha its permanent CEO, chosen by the foundry's Board of Directors. He had served as interim CEO since June 2011.
Two Wall Street analysts report their impressions from last week's EUV Symposium (Oct. 17-19 in Miami), where companies in the EUV supply chain reported their latest results and planned progress through 2012. And don't look now but there's a competition brewing in source power.
ACM Research Shanghai Ltd. will install its Ultra C 12" (300mm) single-wafer megasonic cleaning tool at a leading Korea-based memory manufacturer. The tool will be implemented as part of the customer
The GSA released its September statistics for monthly, year-to-date, and year-over-year semiconductor funding, initial public offerings (IPO), and mergers and acquisitions (M&A).