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Kateeva receives $38 million in financing

Mon, 9 Sep 2014
Kateeva announced that it has closed its Series D round with $38 million in financing. The newest participant is Samsung Venture Investment Corporation (SVIC).

Alchimer CEO Predicts Demise of Vapor Deposition Processes for TSVs by 2009

Tue, 3 Mar 2008
(March 17 2008) Massy, France — After being appointed CEO of Alchimer SA, Steve Lerner immediately predicted the demise of vapor deposition processes for depositing nanoscale films in through silicon vias (TSVs) within a year. Steve Lerner is a technologist with 29 years' experience in semiconductor development and manufacturing. He founded advanced packaging and device companies Alpha Szenszor, GigSys, and CS2, and has held executive positions at Amkor, Swire, and AME.

Tessera Receives Job Development Investment Grant from North Carolina

Mon, 3 Mar 2008
(March 17, 2008) Charlotte, NC & San Jose, CA — The North Carolina Economic Investment Committee has awarded a job development investment grant (JDIG) to Tessera Technologies Inc., a provider of miniaturization technologies for the electronics industry. This grant will support Tessera's consumer optics plans, enabling the company to add 185 jobs and invest approximately $30 million in its Charlotte-based wafer-level optics facilities during the next five years.

Solder Ball Transfer for Flip Chip and WLCSP

Sun, 3 Mar 2008
By Andrew Strandjord, PacTech USA
(March 19, 2008) — Wafer bumping is often separated into two different categories: flip chip bumping and wafer-level chip scale packaging (WLCSP). This categorization and affiliated nomenclature is mainly based on solder bump size and the type of equipment used to create them. "Flip chip" refers to bumps on semiconductor wafers in the range of 50-200 µm in height. "WLCSP" refers to bumps that are in the range of 200-500 µm.

U.S. Computer Maker to Use Dow Corning Compound at China Facility

Fri, 3 Mar 2008
(March 14, 2008) Midland, MI — A U.S.-based personal computer maker has qualified Dow Corning's TC-5121 thermally conductive compound for use in its manufacturing operations in China. TC-5121, introduced in December, is designed for mid-range electronic systems such as desktop computers and graphic processing units.

Georgia Institute of Technology to Hold Nanopackaging Workshop April 15

Fri, 3 Mar 2008
(March 14, 2008) Atlanta, GA — The Georgia Institute of Technology (GIT) will be hosting the Industry-Academia Consortium Workshop on Nano Materials, Components, Packaging and Systems (NanoPack) on April 15, 2008, at the Microsystems Packaging Research Center at GIT in Atlanta, GA. For information and registration, go to www.prc.gatech.edu/events/nanopack.

Tessera Introduces its MVP

Tue, 3 Mar 2008
(March 19, 2008) SAN JOSE, CA — Whether the acronym stands for micro via package or most valuable package, it looks like Shellcase MVP, introduced yesterday by Tessera Technologies, will answer to both. This recent addition to the SHELLCASE family is reportedly one of the industry's first applications of through silicon via (TSV) technologies and supports 3D die-stacking of the image sensor with other ICs.

Palomar Technologies to Discuss Microelectronic Services at iMAPS DP Conference

Thu, 3 Mar 2008
(March 12, 2008) Carlsbad, CA — Palomar Technologies, provider of precision automation equipment and process development for microelectronic assembly, will discuss its microelectronic packaging services at the iMAPS International Conference and Exhibition on Device Packaging to be held in Scottsdale, AZ, on March 18 and 19. Palomar Technologies will be exhibiting in booth #66.

New CSP for Converters Offers Portable Systems Designers Space Savings

Wed, 3 Mar 2008
(March 12, 2008) Santa Clara, CA — Advanced Analogic Technologies Inc. (AnalogicTech), a developer of power management semiconductors for mobile consumer electronic devices, has made available chip scale packages (CSPs) for its AAT1149 and AAT1171 DC/DC converters. Bond wires are eliminated, offering a reduction in footprint.

Koh Young Opens Japan Sales, Service Division

Wed, 3 Mar 2008
(March 12, 2008) Seoul, South Korea — 3D inspection technology company Koh Young announces the establishment and opening of a sales and service division in Chiba, Japan, called Japan Koh Young Company Ltd. The branch has been established to better serve the evolving needs of the company's Japanese customers.

Cadence Acquires Chip Estimate Corp.

Wed, 3 Mar 2008
(March 12, 2008) San Jose, CA — Cadence Design Systems Inc. has acquired Chip Estimate Corp., a company that delivers IC planning and enterprise-level IP reuse management solutions. Founded in 2003, Chip Estimate products enable electronics design teams to predict the die size, yield, power consumption, performance, and cost of chips based on almost any design architecture, IP, and silicon process node options. Terms of the agreement were not disclosed.

BTU Receives $3M Order for Pyramax Products from Leading SATS Company

Tue, 3 Mar 2008
(March 11, 2008) North Billerica, MA — BTU International, a supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, today announced the receipt of a $3M multiple-machine order, the largest single Pyramax order in company history, from a leading semiconductor assembly and test subcontractor (SATS).

Europractice IC Service Expands to MEMS Prototyping

Tue, 3 Mar 2008
(March 11, 2008) CROLLES, France, and LEUVEN, Belgium — Tronics Microsystems SA and IMEC, representing Europractice IC Service, announced today their collaboration to enable Europractice IC Service to add MEMS to its Multi-Project Wafer (MPW) programs. Tronics, a manufacturer of custom MEMS components, is the first technology provider selected by IMEC to support Europractice IC Service's extension of its production portfolio to MEMS.

LSI to Purchase Infineon Hard Drive Semiconductor Business

Mon, 3 Mar 2008
(March 10, 2008) Milpitas, CA — LSI Corp. today announced that it has signed a definitive agreement to acquire the assets and IP of the hard disk drive semiconductor (HDD) business of Infineon Technologies AG, including product designs, related software, inventory, and test equipment. Financial terms are not being disclosed.

SMTA Announces "Best of Conference" Award for Pan Pacific 2008 Symposium

Fri, 3 Mar 2008
(March 7, 2008) Minneapolis, MN — The SMTA has announced "Best of Conference Awards" to two presenters from this year's Annual Pan Pacific Microelectronics Symposium and Tabletop Exhibition, held in late January in Hawaii. These awards are chosen by attendee ratings.

Multitest Pick & Place Handler Delivered to European R&D Site

Fri, 3 Mar 2008
(March 7, 2008) Rosenheim, Germany — Multitest's MT2168 pick & place handler, which was introduced at SEMICON Europa 2007, has been delivered to its first customer. The MT2168 beta-site version was installed at an European R&D and production site of an international IDM.

FUJIFILM Dimatix, Agilent Collaborate on Inkjet Technology for Advanced Life Sciences

Fri, 3 Mar 2008
(March 7, 2008) Santa Clara, CA — FUJIFILM Dimatix Inc. today announced its collaboration with Agilent Technologies Inc. to supply the company with innovative inkjet products based on the latest semiconductor manufacturing technologies for use in life sciences applications. Agilent uses the FUJIFILM Dimatix inkjet technology to develop products that allow life scientists to more efficiently target and analyze sequences of genetic material.

Datacon, Ablestik Partner on Research and Evaluation for Advanced Epoxy Processes

Thu, 3 Mar 2008
(March 6, 2008) Radfeld, Austria & Rancho Dominguez, CA — Datacon and Ablestik have joined forces to provide joint technological development and shared product evaluations and demonstrations to the marketplace. The aim of this partnership is to strengthen technological leadership, especially in processes such as thin die and/or stacked die handling as well as other advanced epoxy processes, and to advise customers of both companies on the best solutions for their production needs.

ELMOS, MagnaChip to Cooperate on Foundry Services

Tue, 3 Mar 2008
(March 4, 2008) Dortumund, Germany and Seoul, South Korea — ELMOS Semiconductor AG and MagnaChip Semiconductor Ltd. have signed a cooperation agreement regarding the development of automotive semiconductor technologies. In a second step, ELMOS will use the foundry services of MagnaChip for these automotive technologies, with MagnaChip delivering processed wafers to ELMOS.

March Events Preview

Mon, 3 Mar 2008
(March 5, 2008) — March is a busy travel month for the Advanced Packaging editors. In the next few weeks, we'll be reporting from Arizona, where both the BITS Workshop (March 9–12, 2008) and IMAPS' International Device Packaging Symposium, in conjunction with the Global Business Council (March 17–20, 2008), will be taking place; as well as Shanghai, where Gail Flower, editor-in-chief, will attend SEMICON China (March 18–20, 2008).

Thin-film TECs for High-heat Flux Rapid Thermal Response

Mon, 3 Mar 2008
By Paul A. Magill, Nextreme Thermal Solutions, Inc.

(March 5, 2008) — In the semiconductor industry, device characterization or screening occurs through the use of two related tests: burn-in and elevated temperature device characterization, with both tests using temperatures >99°C: the first to accelerate device failure modes that could be related to those in the field, and the second to simulate functional device behavior while characterizing its performance level.

3D Packaging Processes

Mon, 3 Mar 2008
adapted for print by AP editors

(March 5, 2008) — This article is the third in a series on 3D packaging technology, and summarizes information presented during a January 2008 webcast hosted by Advanced Packaging magazine. Participants were: Fred Roozeboom, Research Fellow, NXP Semiconductors and professor at TU Eindhoven; Kai Zoschke, Research Engineer for Fraunhofer IZM; and Thorsten Matthias, Director of Technology North America, EV Group.

FINETECH Shanghai, Kyzen Corp., to Display New Products at SEMICON China

Mon, 3 Mar 2008
(March 3, 2008) — At SEMICON China 2008, taking place March 18-20 at the Shanghai New International Expo Centre, two of the companies that will showcase new products are FINETECH Shanghai and Kyzen Corp. FINETECH Shanghai will present the FINEPLACER CR7.MD compact rework system at its Booth 2166 and Kyzen will feature its MICRONOX MX2302 engineered semi-aqueous solvent blend at two representatives' booths: WKK's Booth 2636 and Sigmatek's Booth 3725.

Power Integrations Introduces eSIP Power Package to Support Low-Profile Trend in Consumer Electronics

Mon, 3 Mar 2008
(March 3, 2008) San Jose, CA — Power Integrations today announced the availability of its TOPSwitch-HX series of AC-DC power conversion ICs in the new eSIP-7C eco-single-inline-package. This package exhibits the low thermal impedance of the traditional TO-220, yet stands less than 10mm above the PCB.

Fujitsu Achieves Self-organizing Carbon Nanotube Composite with Graphene

Mon, 3 Mar 2008
(March 3, 2008) Atsugi, Japan — Fujitsu Laboratories Ltd. today announced the successful formation of a new nano-scale carbon composite featuring a self-organizing structure by combining carbon nanotubes and graphene, which are both nano-scale carbon structures. The newly-discovered composite structure is synthesized at a temperature of 510°C.

ASE Inc. Enters Syndicated Loan Agreement for the Proposed Acquisition of ASE Test Ltd.

Mon, 3 Mar 2008
(March 3, 2008) Taipei, Taiwan — Advanced Semiconductor Engineering Inc. has announced that it has entered into a syndicated loan agreement with a banking syndicate led by Citibank, N.A., Taipei Branch, for a NT$24,750 million term loan facility.

Thermal Limit Monitor

Mon, 2 Feb 2008
This custom version of the TLM-8 thermal limit monitor supports applications that have a need for higher accuracy temperature limits or specific limit settings not otherwise available. This version is a good fit for application in industries such as packaging, plastics injection molding and extrusion, and semiconductors requiring SEMI S2.

Wire Bonder

Mon, 2 Feb 2008
The Wire Bonder 3200's new air bearing technology and rotary axis enable it to attain 22 wires/sec with very thin wires (for diameters down to 35 µm, or 35 thousandths of a millimeter). The wire bonder makes the electrical connections between the semiconductor and the terminals on the substrate. The control pulses generated in the chip reach the surrounding area via a gold wire that is thinner than a human hair.

Golden Track Technology

Mon, 2 Feb 2008
The "golden track" technology meets the challenges of electro-static stiction of small and thin devices in the tracks of the MT9928 platform. The tracks get a dedicated coating, which ensures a smooth handling of devices down to 2 × 2 mm size and a thickness down to 0.3 mm. The

Jet Dispensing System

Mon, 2 Feb 2008
The PicoDot jet dispensing system brings new capabilities to EFD's line of precision fluid dispensing systems. Because the PicoDot systems do not contact the substrate, they will enable manufacturers to deposit controlled amounts of fluid on hard-to-access areas, uneven surfaces, or in applications where a conventional dispensing needle cannot be used — at speeds up to 150 dots/sec.

Glass for Wafer-Level CSP and Optics

Mon, 2 Feb 2008
The AF 32 glass is designed for leading-edge opto-electronics, image sensor packaging, WLO, and MEMS applications. It matches the CTE of silicon, which helps prevent warp during the manufacture of complex assemblies and during reflow, when a WLCSP imager is attached to a printed circuit board.

APEX Preview

Tue, 1 Jan 2002
This year APEX will be held January 20-24, 2002, at the San Diego Convention Center. To help our readers prepare for the show, we're offering a preview of products and technologies that will be exhibited

IMAPS Workshop Report

Tue, 1 Jan 2002
IMAPS held its third Advanced Technology Workshop on "Packaging of MEMS and Related Micro Integrated Nano Systems" in early November in Scotts Valley, Calif.

MicroScale begins bumping services in Korea

Tue, 1 Jan 2002
MicroScale Co. Ltd., Korea's largest chip bumping house, has begun to operate a bumping line for semiconductor chips

JEDEC announces lead-free definition

Tue, 1 Jan 2002
JEDEC has recently approved a definition for lead-free solid state devices, which is "a solid state device that contains no more than 0.2 % by weight of elemental lead (Pb)

Boeing introduces automated MEMS aligner

Tue, 1 Jan 2002
The Boeing Company has engineered a MEMS device and soldering technique that provides rapid and precise alignment of single-mode optical fibers to laser sources, photodetectors and other single-mode optical fibers

Advancements in acoustic microscopy

Tue, 1 Jan 2002
Builders of high reliability systems that incorporate commercial off-the-shelf (COTS) components can enhance system reliability by using a new type of acoustic microscope system developed by Sonoscan Inc.

The MEPTEC and Advanced Packaging Technologists of the Year Award

Tue, 1 Jan 2002
The Third Annual Microelectronics Packaging Technologist of the Year Award, sponsored by the Microelectronics Packaging and Test Engineering Council (MEPTEC) and Advanced Packaging magazine, was presented in October during a special MEPTEC luncheon

Time flies

Tue, 1 Jan 2002
We take great pleasure this year in celebrating the 10th anniversary of Advanced Packaging. Yes, it was way back in 1992 when AP hit the streets

First Bond Failures in Leaded Packages

Mon, 12 Dec 2003
A fabless semiconductor company using an outsourcing model relies on a foundry for wafer fabrication, a testing house for wafer sort and an assembly house for chip assembly. The multiple manufacturing processes involved make it difficult for the fabless company to isolate the cause of an assembly failure.

New Methods for 3-D Chip Integration

Mon, 12 Dec 2003
When a new technology emerges, talk typically centers on more gigahertz, fewer micrometers or higher integration densities. In the background, however, a quiet revolution is taking place in the form of process technologies, manufacturing structures and new forms of collaboration between industry partners.

Thermal Process of Low-temperature Cofired Ceramics

Mon, 12 Dec 2003
Low-temperature cofired ceramics (LTCC) are finding increasing application in standard components such as multilayer chip capacitors, which are manufactured in high volume today.

Packaging for Higher Yield

Mon, 12 Dec 2003
Many factors in semiconductor manufacturing have contributed to an increased need for protection of wafers, singulated die or ICs during the back-end processes.

Microsurgery on Microchips

Mon, 12 Dec 2003
The seemingly unquenchable thirst of semiconductor manufacturers for faster and more powerful microchips places great demands on required semiconductor manufacturing processes.

Wafer-level MEMS packaging

Mon, 4 Apr 2002
Microelectromechanical systems (MEMS) contain fragile parts that require encapsulation in a hermetically sealed cavity for reasons of protection, reliability and tuning of performance

Variable frequency microwave curing

Mon, 4 Apr 2002
Advanced process finds optoelectronic applications

10th Anniversary Insights
A short history of wafer-level packaging

Mon, 4 Apr 2002
There have been only a few fundamental shifts in the history of electronic packaging that changed the whole industry. One was the step from through-hole assembly to surface mount technology (SMT)

Squares Within Squares

Mon, 4 Apr 2002
Mary wanted to plant tulips and marked out a 12 feet square area with four stakes at the corners, intending to prepare the bed later in the week

SEMICON Europa Products

Mon, 4 Apr 2002
Aluminium nitride ceramic heatsinks are ideal for passively cooled, high-powered laser diode modules and can be more thermally efficient than aluminium oxide components.

New system automates thermal measurements

Mon, 4 Apr 2002
Netzsch Instruments introduced a new line of flash diffusivity instruments for measurement of thermal properties, such as specific heat and thermal conductivity

Progress on thin wafer handling

Mon, 4 Apr 2002
There has been much progress in the past year on wafer thinning, with portable electronics providing the driving force for thin die

Bluetooth progress facilitated by ASE's fine pitch technology

Mon, 4 Apr 2002
Advanced Semiconductor Engineering (ASE) is working with Cambridge Silicon Radio (CSR) to build its next generation Bluetooth chip

Plexus licenses Tessera technology

Mon, 4 Apr 2002
Plexus Corp., an electronic manufacturing services (EMS) provider, will be licensing Tessera's chip scale packaging (CSP) and multichip packaging (MCP) technology

SECAP spreads the word with APiA launch

Mon, 4 Apr 2002
SECAP, the Semiconductor Equipment Consortium for Advanced Packaging, is in its second year now with some interesting projects underway

Packaging industry leading the way

Mon, 4 Apr 2002
A common topic of discussion on these pages and in the industry as a whole is the convergence of wafer processing and packaging technology

The back-end process: Step 3 - Wafer backgrinding

Fri, 3 Mar 2002
With the proliferation of smaller and thinner packages for portable and hand-held products, there is an increased need for thinner semiconductor devices

Understanding the value of patents

Mon, 7 Jul 2002
Patents are becoming increasingly important to the electronics packaging industry. The number of patents in new packaging technology is growing by more than 40 percent per year

Packaging defines products

Mon, 7 Jul 2002
Last month I had the good fortune to have a lengthy chat with the leadership of the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society during ECTC

BGA, CSP and flip chip

Sat, 6 Jun 2002
When to use which process, and why

The back-end process: Step 6 - Wire bonding

Sat, 6 Jun 2002
Ongoing demands for higher I/O counts while minimizing board real estate are driving high-density connections between chips and the packages

A new approach to X-ray

Sat, 6 Jun 2002
Contract manufacturers and printed circuit board (PCB) assemblers are realizing that an X-ray system is a required tool rather than a "nice to have" system in their arsenal of inspection tools

Stacked fine-pitch BGA packages

Sat, 6 Jun 2002
Addressing high-density memory requirements

10th Anniversary Insights
Packaging matured as volumes grew

Sat, 6 Jun 2002
During the past 30 years, the semiconductor assembly process has undergone dramatic changes that continue to affect the industry's requirements for human resources, equipment and facilities

Think Tank

Sat, 6 Jun 2002
The Math and Logic Teasers Association (MALTA) was inaugurated a few years ago. At the end of the first year, its membership dropped by 10 percent

Movers and shakers

Sat, 6 Jun 2002
Unitive Inc. (Research Triangle Park, N.C.) appointed Arthur Bergens, Jr., as vice president and chief financial officer. He will be responsible for leading the company's financial strategy and growth

Amkor continues expansion in Japan with Fujitsu deal

Sat, 6 Jun 2002
Amkor Technology announced a preliminary agreement to create a joint venture with Fujitsu

Special needs of large flip chip being addressed

Sat, 6 Jun 2002
ASE Test Limited and MTBSolutions (MTBS) announced that they are jointly developing packaging technology for large flip chip devices

New system for testing chips after dicing and thinning

Sat, 6 Jun 2002
Electroglas Inc. has developed test/handling equipment that allows for fully automated testing of ultra-thin chips, including the ability to test integrated circuits (ICs) after dicing or in wafer format

Final packaging equipment figures for 2001

Sat, 6 Jun 2002
The semiconductor packaging equipment market dropped by 56 percent in 2001, according a report from Gartner Dataquest, making it the worst annual contraction in the industry's history. The revenue in 2001 was $2.98 billion

10th Anniversary Insights
The Evolution of Packaging Education

Thu, 8 Aug 2002
The first university course in packaging was offered nearly two decades ago, but the most significant changes in availability and breadth of university-level education programs have occurred in the past 10 to 15 years

Think Tank

Thu, 8 Aug 2002
The Building Lot

Product Preview

Thu, 8 Aug 2002
A two-axis noncontact measuring system combining quality control laboratory accuracy, repeatability and optical quality with ease of use, Kestrel incorporates the company's patented Dynascope optical projection technology, which provides high-contrast, high-resolution images of complex parts of various materials

Analysis Tools from Zuken Include Package Re-use

Thu, 8 Aug 2002
Zuken USA added a "packaging re-use" capability to its Packaging Predictor set of analysis tools

NEMI Announces Opto Projects

Thu, 8 Aug 2002
The National Electronics Manufacturing Initiative (NEMI) launched three new projects as part of its effort to "improve yields and decrease costs of optoelectronic assemblies and products."

C-MAC Launches Integrated Opto Module Program

Thu, 8 Aug 2002
C-MAC MicroTechnology filled out its optoelectronic manufacturing technology portfolio and now offers an integrated assembly and test program for those applications

Growth Projections from SIA and VLSI Research

Thu, 8 Aug 2002
The Semiconductor Industry Association (SIA) gave its 2002 mid-year forecast, predicting a 3 percent growth in semiconductor sales in 2002 compared to 2001, reaching a total market of $143 billion

APiA Adds Seven Members to Alliance

Thu, 8 Aug 2002
The Advanced Packaging and Interconnect Alliance (APiA) added seven organizations to its roster, increasing the scope of technologies included in its effort to address advanced packaging challenges

China Update: SEMI, Carsem, ChipMOS

Thu, 8 Aug 2002

Packaging of Cu/low-k Addressed at IITC

Thu, 8 Aug 2002
The annual International Interconnect Technology Conference (IITC) added advanced packaging as one of its focus topics this year

Datacon Tops Equipment Rankings; Assembly Dominates Industry-wide List

Thu, 8 Aug 2002
Datacon Technology of Austria has topped this year's VLSI Research ranking of assembly equipment suppliers

Materials Science to the Rescue

Thu, 8 Aug 2002
When asked to put together a presentation recently, I forced myself to take a close look at the latest version of the International Technology Roadmap for Semiconductors (ITRS)

The back-end process: Step 7 - X-ray inspection

Mon, 7 Jul 2002
Flip chip challenges

EMI filter packaging

Mon, 7 Jul 2002
CHIP SCALE PACKAGES ENHANCE PERFORMANCE

Reliability of BGA solder bumps

Mon, 7 Jul 2002
Moiré interferometry evaluates shock and vibration performance

Thermal Performance of Lead-free Packages

Mon, 12 Dec 2003
Impending legislation is forcing the pace of progress toward lead-free electronic products, and the industry is close to finalizing suitable replacement solder alloys and associated processes.

X-ray Inspection: Evolution from Microfocus to Nanofocus

Mon, 12 Dec 2003
Today's trend of increased miniaturization of components and packages is continuing in the electronics and micromechanics industries. Design and manufacturing technologies such as optoelectronics, microelectromechanical systems (MEMS) and micro-opto-electromechanical systems (MOEMS) are creating new application requirements and inspection needs.

Data Bank

Mon, 12 Dec 2003

New Products

Mon, 12 Dec 2003

Who Needs a Dog That Doesn't Bark?

Mon, 12 Dec 2003
My wife and I have always been Sherlock Holmes fans. While not as exciting as Harry Potter, who can forget those old Basil Rathbone black-and-white episodes, or the newer ones starring Jeremy Brett and his slicked-back hair?

In The News

Mon, 12 Dec 2003

I Answer Your Questions

Mon, 12 Dec 2003
The other day I had a few extra moments and decided to indulge in a guilty pleasure — reading a magazine just for the fun of it.

Strip Testing: Uniformity in Final Package Test

Sat, 11 Nov 2003
The goal of saving time and money by conducting final test in strip or matrix format can be achieved by applying prober-based sort floor technologies and methods to final test handling. While today's sort floors can process multiple types of devices in the same physical format, a wafer, final test has a proliferation of multiple handler types for each package family.

Underfill Techniques: Automated Dispensing and Jetting

Sun, 6 Jun 2003
Devices that use underfill have proliferated both in package type and volume. The need for underfilling a wide variety of packages for reliability is well established.

Flip Chip PBGAs

Sun, 6 Jun 2003
Flip chip packaging has seen explosive growth in recent years, with more and more high-performance devices being designed in flip chip technology. Additionally, flip-chip-in-package (FCIP) is increasingly seen as a solution for higher I/O devices.

Hygroscopic Swelling of Encapsulated Microcircuits

Sun, 6 Jun 2003
The hygroscopic swelling of five commercially available mold compounds is analyzed and the coefficient of hygroscopic swelling is determined for each mold compound using moiré interferometry. The results indicate that the deformation caused by hygroscopic swelling can be as significant as the deformation caused by a thermal expansion of 90°C.

Board-level Reliability Design

Sun, 6 Jun 2003
A chip scale package (CSP) is defined as any IC package with an area less than 1.5x in die area, a package width less than 1.2x in die width, or any fine-pitch (0.5 mm or less) area-array package.

Data Bank

Sun, 6 Jun 2003
Global semiconductor sales reached $12.1 billion in March 2003, a 2.6 percent increase from the $11.8 billion in revenue reported in February 2003.

New Products

Sun, 6 Jun 2003

Development Packaging Solutions: Flip Chip and Beyond

Sun, 6 Jun 2003
In times of reduced research and development (R&D) budgets and a slump in venture financing, time- and cost-efficient execution of the new product development often is a matter of survival. Yet, few developments follow a straightforward path, and this can be particularly true for products requiring advanced packaging.

Mapping and Traceability Minimize Recall Costs

Sun, 6 Jun 2003
Manufacturing industry's pressing need for open systems standards for traceability is motivating new developments in standards for test assembly and packaging.

Smaller Die Size Means Capacity Gains

Fri, 8 Aug 2003
The continuous push for cost reduction, increased functionality and performance, system compactness, and enhanced quality remain unabated in consumer, communications, defense and medical electronics.

Is Packaging Leading the Return of Semiconductor Growth?

Fri, 8 Aug 2003
It appears that past history again may be an indicator that growth is returning to the semiconductor industry. In our cyclic world of semiconductors, an increase in sales for the outsourcing of packaging and test services usually has been an early indicator that the industry has bottomed and a return to growth is on the way.

In the News

Fri, 8 Aug 2003

Getting More Creative

Fri, 8 Aug 2003
This month I did quite a bit of traveling, while getting to know the readers and advertisers in Advanced Packaging a little better by face-to-face visits.

Ribbon Wedge Bonding

Tue, 7 Jul 2003
With the recent growth of optoelectronics assembly, the use of ribbon wire for interconnects has become more widely used. This article explores the basics of the ribbon bonding machine configuration and some of the finer points of ribbon wedge tools and wire.

Wafer Bump Reflow

Tue, 7 Jul 2003
Wafer-level packaging has grown in popularity in recent years because manufacturers can now maintain the cost of the IC packaging as a constant percentage of the total wafer cost.

Productivity Enhancements in Advanced Packaging Lithography

Tue, 7 Jul 2003
The need for faster devices and smaller form factor has resulted in a prolific adoption of advanced packaging techniques. As semiconductor devices continue to migrate to smaller features, higher frequencies, higher power densities and lower voltages, the industry requires an aggressive packaging technology roadmap.

Multi-functional Dispensing for Semiconductor Back-end Packaging

Tue, 7 Jul 2003
Liquid dispensers have long played an essential role in printed circuit board (PCB) assembly.

The back-end process: Step 1 - Package design

Tue, 1 Jan 2002
As semiconductor devices become significantly more complex, designers are challenged to fully harness their computing power

Functional tuning of hybrids

Tue, 1 Jan 2002
Functional laser tuning of traditional ceramic-based hybrid circuits has been accomplished with the use of a standard 1.064-µm wavelength Nd:YAG laser for more than two decades

Cleaning laser debris from TAB circuits

Tue, 1 Jan 2002
The formation of carbon residue while UV lasers drill microvias in polyimide or other dielectric materials is normal and expected

Die Traceability

Tue, 1 Jan 2002
Strip packaging and wafer-level packaging (WLP) are now making packaging and final test more like fab processing

Next-generation packaging for fiber optics & MEMS

Tue, 1 Jan 2002
Next-generation packaging for fiber optic and MEMS modules will require improved levels of mechanical, thermal and environmental stability combined with increased capability to integrate electrical and optical functions

Packaging of fiber collimators

Tue, 1 Jan 2002
Packaging and assembly still dominate the overall cost of any fiber optic devices,1 largely because fiber optic alignment and attachment are difficult and time consuming

Think Tank Celebrates 10 Years!

Tue, 1 Jan 2002
K.H. "Wicks" Wickremasinghe has been writing Think Tank challenges for AP for 10 years now, and we'd like to commemorate the anniversary by telling you about the man behind the puzzles

Moving automation from the front end to the back end

Tue, 1 Jan 2002
Twenty years ago, there was little focus on software and automation in wafer fabrication. The frontiers of science were being pushed back to keep up with Moore's Law and enabling technologies were bound to succeed

Subsidiary evolution

Tue, 1 Jan 2002
There has been a profound shift in paradigm in regard to multinational corporations (MNCs) and their foreign subsidiaries during the past 10 years

10thAnniversary
Anniversary Insights

Tue, 1 Jan 2002
Today's artificially intelligent systems are fabricated using sub-micron scale devices in micro- and meso-scale packages, primarily using electronic signals and the logic of programming to interface to the macroscopic world

Reducing Flip Chip BGA Open and Short Fail Rate

Tue, 7 Jul 2003
Due to its excellent thermal and electrical performance, the flip chip ball grid array (FCBGA) package has become more and more popular in the semiconductor packaging industry for high pin count integrated circuit devices.

Part II: Hygroscopic Swelling of Encapsulated Microcircuits

Tue, 7 Jul 2003
Polymeric mold compounds absorb moisture and, thus, swell when exposed to a humid environment.

Leadframe Chip Scale Packaging

Tue, 7 Jul 2003
The proliferation of new packaging families and variations today is more rapid than ever before.

Data Bank

Tue, 7 Jul 2003

Product Preview

Tue, 7 Jul 2003

Build It and They Will Come

Tue, 7 Jul 2003
I was up late the other night and flipped to the classic movie channel as the movie "Field of Dreams" was playing. I hadn't seen it in a few years and decided to watch it again. In the movie, a voice keeps hounding Kevin Costner to take the ultimate risk of plowing his crop of fully mature corn under to build a baseball field.

Quarterly Reports Show Few Bright Spots For Sub-contractors

Tue, 7 Jul 2003
For the most part, the good news still has not arrived in the packaging and test sub-contractor world.

News

Tue, 7 Jul 2003

Front End, Back End and a Little of the Middle

Tue, 7 Jul 2003
Now that SEMICON West is upon us the idea of back-end and front-end points out the separation of each step of electronics packaging. Each step in the process sometimes becomes so removed from the mainstream that engineers may lose sight of how an understanding of the whole benefits each step.

Onward and Upward

Mon, 9 Sep 2003
Generally, companies save their exciting new product introductions for the major trade shows to make the biggest industry splash possible.

Sorting Stacked-die
The Challenges of Building SiPs

Fri, 8 Aug 2003
Many designers have discovered that the benefits of system-on-chips (SoCs) do not always justify the costs. The challenges of combining digital, analog and RF functions, typically optimized for different process technologies, in a single piece of silicon have proved daunting.

Stencil Cleaning: Choices and Proven Strategies

Fri, 8 Aug 2003
Much discussion and debate have taken place in engineering circles regarding the 21st century question: "To clean or not to clean?" No-clean flux or cleanable flux? Batch or inline technologies? Open- or closed-loop? Chemical or water-only processes?

Acoustic System-on-chips Aim to Revolutionize Sound

Fri, 8 Aug 2003
From the advent of the telephone and the world's first radio broadcast to the development of the electronic hearing aid and the cellular phone, technology has transformed the way people use sound at work, home and play.

3-D Packaging Solution for High-performance Memory

Fri, 8 Aug 2003
The new generations of dynamic random access memory (DRAM) and synchronous dynamic random access memory (SDRAM) technologies are contributing to increased system performance significantly.

Accelerating Test Socket Design

Fri, 8 Aug 2003
Today's semiconductor test engineer faces frustrations that 10 years ago hardly could be imagined.

Data Bank

Fri, 8 Aug 2003

New Products

Fri, 8 Aug 2003

New materials highlighted at SEMI-THERM

Sat, 6 Jun 2002
Many new materials and technologies for addressing thermal management challenges were presented at IEEE's 18th annual Semiconductor Thermal Measurement and Management Symposium and Exhibition

IPC forms photonics group

Sat, 6 Jun 2002
The IPC announced the formation of the Photonics Manufacturers Association (PMA) Council, whose function will be to "organize and coordinate roadmapping, standardization, legislative, market research and education efforts" in the photonics industry

New Products

Sat, 6 Jun 2002
The DS-107 aligner bonder is an ultra-high precision assembly platform designed to align, place, and attach bare die, components and packages

Less than zero

Sat, 6 Jun 2002
Packaging almost seems like the kind of enterprise that has to have a finite future. Think about it - our task is to package chips while adding as little as possible to the size, cost and parasitics that detract from performance

The back-end process: Step 5 - Flip chip attach
Process and material options

Wed, 5 May 2002
Flip chip is a technology where semiconductor devices are mounted and electrically connected face-down directly onto substrates

Wafer-level burn-in with test

Wed, 5 May 2002
A key enabler for low-cost SoC and SiP

Ball bond shear testing

Wed, 5 May 2002
Advanced shear tools for gold ball bonds

Die bonding for high-power devices

Wed, 5 May 2002
Thermal management for broadband component assembly

10th Anniversary Insights
The evolution of the subcontractor

Wed, 5 May 2002
The role and status of the packaging, assembly and test subcontractor has steadily increased over time

In the News

Sat, 11 Nov 2003

Let's Do the Numbers

Sat, 11 Nov 2003
Everything is measured in numbers. This September, Sunnyvale-based Advanced Micro Devices introduced a 64-bit chip designed for speeding up and increasing memory in desktop computers. Though most wonder if the increase from today's 32-bit is useful, since most desktop software cannot take advantage of the new capabilities.

Mold Compound

Wed, 10 Oct 2003
Mold compounds are the plastics used to encapsulate many types of electronic packages, from capacitors and transistors to central processing units (CPUs) and memory devices.

Op-amp Performance

Wed, 10 Oct 2003
To understand the impact of package stress, what key parameter of an operational amplifier (op-amp) the stress affects most must be considered. A general-purpose op-amp specifies an input offset voltage (VIO). This parameter is the DC voltage that must be applied to the input terminals to cancel the DC offset within the op-amp to force the quiescent DC output voltage to a specified level (Figure 1).

The Impact of Embedded Components

Wed, 10 Oct 2003
Different types of materials, increased automation and advanced team design processes are just some of the ways companies can lower costs and maintain high standards. Add to that the desire of consumers to have smaller and lighter products, and the challenge that OEMs face today is clearly recognized.

Emerging Micro-technology Finds Favor with Wafer Producers

Wed, 10 Oct 2003
Tangible progress is being made in the wafer fabrication world and beyond based on new micro-production and replication technology, which presents nickel as a low-cost alternative to silicon for a growing number of next-generation production processes, concepts and applications.

Reliability Requirements for Portable Electronics

Wed, 10 Oct 2003
Chip scale packaging (CSP) has been driven primarily by the small form factors required for portable electronics and other high-density semiconductor applications. It has been shown that reliability requirements can be met in spite of the design constraints imposed by these applications. Even when the form factor dictates a stacked approach, ultra-thin CSPs can be stacked and still meet — and exceed — the physical and reliability requirements.

Cost Benefit of Strip Test

Sat, 11 Nov 2003
A major challenge facing the semiconductor manufacturing industry is increasing the efficiency of final manufacturing processes. The migration of cost structure from wafer fab toward final manufacturing has placed it in the crosshairs of fiscal scrutiny and revealed economic and technical issues that could conceivably impair some manufacturers' economic viability.

MEMS Applications for Scanning Acoustic Microscopy

Sat, 11 Nov 2003
Microelectromechanical systems (MEMS) are finding applications in products or systems that require reliable operation over extended periods of time.

Assembly Processes for Flip Chips on Substrates

Sat, 11 Nov 2003
Flip chip assembly is a key capability to enable product miniaturization. Our previous studies have investigated several flip chip interconnection types, including anisotropic conductive film or paste, and Au-Au thermosonic bonding. This project focuses on the assembly of 0.200- and 0.250-mm-pitch solder flip chip devices.

3-D Measurement System for Use in Microelectronics

Sat, 11 Nov 2003
Ball grid array (BGA) package warpage caused by the mismatch of coefficients of thermal expansion and asymmetric package geometry creates some solder joint reliability problems — especially for chip-scale packages.

N2 Inerting for Reflow of Lead-free Solders

Sat, 11 Nov 2003
Due to environmental and health concerns about lead contamination, there is increasing pressure in legislation and a growing market demand to eliminate toxic materials. Lead-free soldering for the electronics industry is becoming a global trend, and several alloy systems alternatives have been recommended.

Next-generation Electronics Packaging Using Flip Chip Technology

Sat, 11 Nov 2003
There is a rapid increase in the number of electronic packages using flip chip technology. With the ongoing expansion of the Internet, mobile phones, PDAs, desktop computers and laptops, digital camcorders, digital cameras and other electronic-based consumer products, the flip chip revolution is in full swing.

Data Bank

Sat, 11 Nov 2003

Product Preview

Sat, 11 Nov 2003

Another Perspective on Outsourcing

Sat, 11 Nov 2003
Recent columns published in Advanced Packaging reported on the moves of IC makers to outsource assembly and test operations based on the argument that if a capability is not something that you put in your sales literature, then maybe that capability should be outsourced.

Solder Ball Endurance

Mon, 9 Sep 2003
Ball shear strength alone does not guarantee a reliable package. By design, ball grid array (BGA) and chip scale package (CSP) device families have to overcome repeat temperature extremes and environmental conditions.

Automating Military Hybrids and Microwave Module Assembly

Mon, 9 Sep 2003
Military hybrids and microwave devices are a distinct subset of microelectronics assembly. Because these devices emphasize power, reliability and robustness in harsh operating environments, assembly techniques require a high level of precision, particularly in the areas of dispensing epoxy and handling die.

Design your own ASIC

Mon, 9 Sep 2003
The potential of 90 nm application-specific integrated circuit (ASIC) designs is introducing new packaging challenges that threaten the IC designer's ability to take full advantage of this advanced process technology.

Data Bank

Mon, 9 Sep 2003
Global semiconductor sales reached $12.54 billion in June 2003, up slightly from the $12.49 billion in revenue reported in May 2003.

Award Winners

Mon, 9 Sep 2003

AP Award Program Sees Another Successful Year

Mon, 9 Sep 2003
Innovation again took center stage at Advanced Packaging's 2003 Advanced Packaging Awards Ceremony, held July 16 in conjunction with SEMI and the back-end portion of SEMICON West.

The Revival of Vertical Manufacturing

Mon, 9 Sep 2003
A number of years ago when I became involved in electronics manufacturing, many of the large companies that dominated the marketplace, such as IBM, Motorola and Xerox, operated as "vertically integrated" organizations.

News

Mon, 9 Sep 2003

Think Tank

Wed, 5 May 2002
For 1,001 nights, the princess related stories to the sultan. At the end of this time, the sultan said, "Do you know the number of nights that we had musicians entertaining us at dinner?"

10 years ago in Advanced Packaging

Wed, 5 May 2002
In the very first issue of Advanced Packaging, thermal management was probably the biggest topic

Movers and shakers

Wed, 5 May 2002
Stephan H. Schmidt, general manager, has been elected to the LPKF Laser & Electronics USA (Wilsonville, Ore.) board of directors.

Updates on folded flex and thin packaging at ICAPS

Wed, 5 May 2002
IMAPS held its first International Conference on Advanced Packaging and Systems (ICAPS) in March in Reno

K&S adds packaging know-how to low-k alliance

Wed, 5 May 2002
Dow Chemical Co. announced the addition of five new members to its SiLKnet Alliance, a collaboration working to create products and processes for low-k dielectric materials

Intel reveals heat sink approach

Wed, 5 May 2002
The importance of thermal management to Intel's microprocessors was demonstrated by the prominence given to a recent announcement about heat sink technology

Assembly and test activity in China heats up

Wed, 5 May 2002
In an effort to leverage the production capabilities and growing markets in China, many companies are forming partnerships or opening new facilities there. Recent announcements include

New opto packages announced at OFC

Wed, 5 May 2002
The Optical Fiber Conference (OFC) in Anaheim in March included announcements of many new packaging technologies and products

IEEE's CPMT announces winners

Wed, 5 May 2002
Pisctaway, N.J. - The Components, Packaging and Manufacturing Technology Society (CPMT) of the IEEE recently announced the winners of its annual awards for technical excellence, achievement, leadership and service.

Assembly equipment revenue roller coaster San Jose, Calif.

Wed, 5 May 2002
The final numbers for the revenue generated by assembly equipment sales in 2001 are in, and the results are not pretty

New Products

Wed, 5 May 2002
The FXS-160.40 inspection system is designed for off-axis inspection of planar devices

Plus or minus 10 years

Wed, 5 May 2002
While putting together our 10th anniversary issue, it was great fun to look through old issues of Advanced Packaging to see what has changed and what hasn't in the past decade

The back-end process: Step 4 - Die attach
Today's challenges

Mon, 4 Apr 2002
In back-end semiconductor manufacturing, the die attach process is a critical step. In simple terms, die attach is picking a chip from a wafer and placing it onto a substrate or metal lead frame

Integrated packaging and testing of optical MEMS

Mon, 4 Apr 2002
Working toward fully integrated solutions

Plated leadframe metrology

Mon, 4 Apr 2002
Optical collimation improves capabilities for Au/Pd/Ni films

Polyimide for flip chip packaging

Fri, 2 Feb 2002
Improving image quality in photosensitive polyimide films

Die attach solder design

Fri, 2 Feb 2002
Calculation of phase diagrams for lead-free power IC die attach

Micro inspection for wafer bumping

Fri, 2 Feb 2002
Inspection requirements for wafer-level packaging processes

10th Anniversary Insights
The wire-bonding tyranny of "or"

Fri, 2 Feb 2002
Many industry luminaries today debate what will be the interconnect technology of choice for semiconductor devices in the future

Think Tank

Fri, 2 Feb 2002
Liz and Brenda live on opposite sides of the street, where there are an equal number of houses on each side

Positive signs in the industry

Fri, 2 Feb 2002
Many people in the semiconductor industry have been waiting until the first quarter of 2002 to try to get some idea of where the industry is headed

Johns Hopkins makes advances on optical interconnect

Fri, 2 Feb 2002
Optical interconnect has generated much interest over the years because of the performance benefits of transmitting signals at the speed of light rather than through copper wire or other solid conductors

Wafer thinning development continues

Fri, 2 Feb 2002
The latest advance in the active area of wafer thinning was announced by ChipPAC

Progress on wafer-level burn-in and test

Fri, 2 Feb 2002
Motorola Semiconductor Products Sector (SPS) has developed and qualified the industry's first wafer-level burn-in and test (WLBT) process for high-performance flip chip microprocessors

New alliance to accelerate advanced packaging

Fri, 2 Feb 2002
A group of seven companies have begun a collaboration to accelerate the commercial development of advanced packaging technologies, such as wafer-level packaging (WLP)

Cool Chips 2002 conference lineup

Fri, 2 Feb 2002
Portland, MAINE - Intertech has set the agenda for its conference, "Cool Chips 2002 - Developing New Market, Material and Design Strategies for Thermal and Power Management," which will be held April 3-4 in Monterey, California

The hot potato of test

Fri, 2 Feb 2002
Early this year I met with a number of packaging sub-contractors, and one theme that came up at virtually every one of them is the increasing importance of test in their business

Flip chip defect detection

Fri, 3 Mar 2002
Acoustic micro imaging and destructive correlation

New reflowable underfill materials

Fri, 3 Mar 2002
Processing parameters and reliability performance

10th Anniversary Insights
As semiconductor packaging and board assembly converge

Fri, 3 Mar 2002
Throughout the electronics industry, new packaging technologies are driving changes in manufacturing

Liquid crystal polymers

Fri, 3 Mar 2002
A flex circuit substrate option

Think Tank

Fri, 3 Mar 2002
Farmer Giles had an equilateral-triangle-shaped lawn with a side of 42 yards. Being too lazy to mow such a large area, he bought a goat to eat the grass

Newport to acquire MRSI

Fri, 3 Mar 2002
Newport Corp. announced during APEX and Photonics West that it will be acquiring Micro Robotics Systems Inc. (MRSI), a privately held company based in North Billerica, Mass.

MEPTEC MEETING REPORT

Fri, 3 Mar 2002
Intel's Packaging Plans Discussed

APEX focuses on test and inspection

Fri, 3 Mar 2002
Test and inspection equipment of all kinds could be found all over the show floor at the IPC's APEX conference and exhibition in January

New Products

Fri, 3 Mar 2002
System A45 is an automatic pick-and-place system designed to handle wafers up to 8-inches with low pick-up force and features an improved ink dot and wafer mapping capability

Antidote for supply chain woes

Fri, 3 Mar 2002
When talking with industry contacts, I often ask people what they see happening to help the poor "visibility" up and down the supply chain. The answers are not very encouraging.

The back-end process: Step 2 - Wafer bumping Low-alpha lead considerations

Fri, 2 Feb 2002
As a result of decades of manufacturing flip chip packages, there exists a large database of reliability information about lead solder bumps

SEMICON West Technical Talks

Sun, 9 Sep 2002
The technical sessions began with the presentation of the IEEE/CPMT Electronics Manufacturing Technology Award to Scott Kulicke of K&S for his "commitment and dedication" and "outstanding leadership and service.

NEXX Systems Joins SECAP

Sun, 9 Sep 2002
MUNICH - NEXX Systems, an advanced packaging equipment supplier, joined the Semiconductor Equipment Consortium for Advanced Packaging (SECAP)

IBM Introduces New Technology, Collaborations

Sun, 9 Sep 2002
EAST FISHKILL, N.Y. - IBM announced its second-generation "surface laminar circuit" (SLC) flip chip packaging technology, as well as agreements with Amkor Technologies, ASAT Holdings Ltd. and Advanced Semiconductor Engineering Inc. to provide the technology for their customers.

Palomar Creates Process Development, Prototyping Capability

Sun, 9 Sep 2002
VISTA, CALIF. - Palomar Technologies established a new service that provides design, engineering and prototyping for its customers

Auburn Offers Wireless Engineering Degree

Sun, 9 Sep 2002
AUBURN, ALA. - This fall, Auburn University's Samuel Ginn College of Engineering will launch the nation's first bachelor of wireless engineering degree program to provide students with the expertise needed for many related emerging technologies.

Movers and shakers

Sun, 9 Sep 2002
MRSI, A Newport Corp. Co., (North Billerica, Mass.) appointed Vincent Chin to applications engineer for the Asia Pacific region.

APiA to Supply ACE Semiconductor, Adds New Members

Sun, 9 Sep 2002
SAN JOSE, CALIF. - The Advanced Packaging and Interconnect Alliance (APiA) has agreed to work with ACE Semiconductor to provide a 200 mm advanced packaging process line in ACE's Shanghai fab

SEMICON West: Technology Advances During a Slow Recovery

Sun, 9 Sep 2002
SAN JOSE, CALIF. In spite of continuing uncertainty in the semiconductor industry, there was a healthy level of excitement on the show floor at the back-end portion of SEMICON West in San Jose this year

"Manufacturing-less" IC companies

Sun, 9 Sep 2002
As consumer and computing applications increase in functionality, semiconductor components are becoming more complex to meet the technology requirements of these products

Don't Forget the Equipment Engineers

Sun, 9 Sep 2002
Last month in this space I highlighted the importance of the material suppliers to the future of our industry. As if they had a preview copy of that, the equipment engineers ambushed me at SEMICON West with more brilliant developments than I have ever seen at a single event

The back-end process: Step 8
Flip Chip Underfill

Thu, 8 Aug 2002
The advantages of the flip chip package over other types of electronic packaging are many, but the most obvious is the reduction in the package size, which delivers savings in board real estate and product thickness.

Lithography for Advanced Packaging

Thu, 8 Aug 2002
With the evolution in front-end semiconductor technology and end product platforms, there is a need for further process development to package these products effectively

Fast Moiré Interferometry

Thu, 8 Aug 2002
Semiconductor manufacturers are pressured these days to decrease the size of components while increasing their functionality

die products

Mon, 7 Jul 2002
Standards provide key to progress

Flexible flip chip

Mon, 7 Jul 2002
Solutions for high-performance applications

10th Anniversary Insights
New (?) and emerging (?) technologies

Mon, 7 Jul 2002
Today, packaging and assembly of integrated circuits (ICs) can be characterized as an aggressive ongoing development effort

Think TANK

Mon, 7 Jul 2002
Tom bought black and white tiles, 12 x 12-inches each, to lay on his square patio deck. He planned to have a perfect square of black tiles in the center of the deck with a border of white tiles around it

Semicon West Products

Mon, 7 Jul 2002
For more information, circle the corresponding numbers on the reader service card and mail back. For faster results, fax the card to 413-637-4343, or visit www.onlinecenter.to/ap.

Novel processes at IMAPS Garden State symposium

Mon, 7 Jul 2002
The Garden State Chapter of the International Microelectronics and Packaging Society (IMAPS) held its Spring Packaging Symposium in May where companies provided the latest updates on their new advanced packaging technologies

China update: K&S, Intel making progress

Mon, 7 Jul 2002
Intel has announced plans for a $100 million expansion of its Pentium 4 assembly and test facilities in Shanghai. It reported that work would be completed on the plant this year, as part of a $500 million investment in facilities in China

STATS licenses ITRI Technology, introduces new PBGA

Mon, 7 Jul 2002
ST Assembly and Test Services (STATS) has licensed a heat dissipation technology developed and patented by the Industrial Technology Research Institute (ITRI)

Wafer handling partnership for Adept and DEK

Mon, 7 Jul 2002
Adept Technology and DEK have announced a partnership to develop a fully automated wafer handling system for DEK's screen printer wafer bumping and ball placement system

Shake-up in probe card suppliers

Mon, 7 Jul 2002
There was significant motion in the ranking of probe card suppliers in 2001, according to a report from VLSI Research Inc

Database for die products

Mon, 7 Jul 2002
To assist design engineers working with bare die, the Die Products Consortium (DPC) has created a database of information on available die products

Kyocera combines copper conductors and alumina ceramic

Mon, 7 Jul 2002
Kyocera Corp. has developed a new ceramic packaging technology that combines features of low-temperature co-fired ceramics (LTCC) with tradition alumina ceramics.

UTAC establishes US design center

Mon, 7 Jul 2002
United Test and Assembly Center (UTAC) is setting up a package design center in Pleasanton, Calif., to support the design needs of customers in North America

CSPs, stacked packaging proliferate

Mon, 7 Jul 2002
Several announcements by major semiconductor manufacturers indicate the extent to which advanced packaging technologies have permeated mainstream products

MEPTEC optoelectronics update

Mon, 7 Jul 2002
MEPTEC held its second optoelectronics symposium in April. The symposium, entitled "The Opto-Mystic Industry," had a smaller crowd than last year's standing-room-only event.

Advanced Packaging added to Chemical Abstracts Service

Mon, 7 Jul 2002
The American Chemical Society has selected Advanced Packaging for inclusion in its Chemical Abstracts Service (CAS)

Collaboration Joins Sensor, PCB, and MEMS Companies

Tue, 1 Jan 2007
(January 9, 2007) PITTSBURGH, PA and HSINCHU, Taiwan — Virtus Advanced Sensors, which specializes in MEMS-based sensors, entered into a collaboration agreement with several UMC Group companies including PCB manufacturer Unimicron and affiliated MEMS foundry Chipsense, both based in Taiwan.

Indium Changes Product Support Staff

Tue, 1 Jan 2007
(January 9, 2007) CLINTON, NY — Indium Corporation appointed Tim Jensen product manager for advanced assembly materials, and promoted Jordan Ross to product specialist for thermal applications. Both Jensen and Ross will continue to operate out of Indium headquarters in Clinton.

WUS Closes Microelectronics Business

Tue, 1 Jan 2007
(January 9, 2007) TAIPEI, Taiwan — WUS Printed Circuit Co., Ltd., will shutter packaging-substrate supplier WUS Microelectronics Co., Ltd., due to long-term operating losses. The microelectronics unit was formed in 2000 from the company's tape automated bonding (TAB) and flexible printed circuits businesses.

Sigrity Enhances Electrical-analysis Software

Mon, 1 Jan 2007
(January 8, 2007) SANTA CLARA, CA — Sigrity, Inc., upgraded its PowerSI electrical analysis tool for IC packages and PCBs with a parallel/distributed computing feature.

Hymite Closes European Investment Round

Mon, 1 Jan 2007
(January 8, 2007) COPENHAGEN, Denmark — Hymite A/S, wafer-level packaging supplier, closed a round of series preferred B financing at 9 million euros. A European consortium proffered the investment.

Software Strengthens MEMS Performance

Fri, 1 Jan 2007
(January 5, 2007) LONDON — ViaLogy, Boeing, and NASA's Jet Propulsion Laboratory (Pasadena, CA) collaborated to create active-error-suppression software to improve stability of MEMS in harsh environments.

Samsung Intros TFT for Double-sided LCDs

Fri, 1 Jan 2007
(January 5, 2007) SEOUL, Korea — Samsung Electronics Co., Ltd., created an LCD panel that generates two independent displays, front and back, using proprietary amorphous silicon gate (ASG) technology in conjunction with double-gate thin-film transistors (TFTs).

Ceramic Package Tests Well for Loss

Thu, 1 Jan 2007
(January 4, 2007) SAN DIEGO — StratEdge released the SMX series of surface mount ceramic packages for test-and-measurement, VSAT, point-to-point, point-to-multipoint, and WiMax applications. The packages, tested by JDS Uniphase (Bloomfield, CT), are designed with thermal management functions incorporated.

Companies Collaborate for ID ICs

Tue, 1 Jan 2007
(January 2, 2007) SUNNYVALE, CA — Fujitsu Microelectronics America Inc., together with Cryptolex Trust Systems Inc. and Biometric Solutions LLC, integrated the MBF200 single-touch sensor IC into Cryptolex's Mobio handheld biometric security device.

Carl Freidhoff's Work in Aerospace Electronics Recognized

Tue, 1 Jan 2007
(January 3, 2007) BALTIMORE — The selection committee of Cambridge Who's Who, a database of executives and other professionals, awarded Carl Freidhoff Professional of the Year in aerospace electronics. Freidhoff — fellow engineer; modeling, simulation, and analysis at Northrop Grumman Corporation — co-developed mass spectrography on a chip, such as MEMS-based pumps with piezoelectric actuators.

Taiwan Green-lights Advanced Components in China

Tue, 1 Jan 2007
(January 3, 2007) TAIPEI, Taiwan — The Taiwan Cabinet approved legislation to allow domestic chipmakers to produce advanced electronic components in mainland China, although concerns for intellectual property (IP) protection were raised.

Soft Landing Forecast for Components Market

Tue, 1 Jan 2007
(January 3, 2007) EL SEGUNDO, CA — While 2007 will be a modest "peak year" for the semiconductor industry historically, global revenue should avoid damaging contractions in this growth cycle, according to a report released by iSuppli. The forecasting firm predicts double-digit growth tempered by changing business dynamics to about 10.6%, below previous peak years of 30 or 40% growth.

Aetrium Divests Certain Test Technologies

Tue, 1 Jan 2007
(January 3, 2007) ST. PAUL, MN — Aetrium Inc., test equipment supplier for the semiconductor industry, divested product lines manufactured at its Dallas, TX, facility, including burn-in board loaders and turret-based test handlers. The intellectual property (IP), inventory, equipment, and other assets divested will transfer to privately held WEB Technology, Inc., a group formed with members of the Dallas business. Aetrium announced that it will focus on reliability-test equipment.

APEX 2007 Pursues Interest in Packaging

Tue, 1 Jan 2007
Following is a preview of the advanced packaging industry on display at IPC Printed Circuits/APEX/Designers Summit 2007, February 20 – 22, in Los Angeles. Look for more APEX previews leading up to the show in the newsletter and the January/February issue of Advanced Packaging.

BGA Rework Station for Lead-free

Fri, 3 Mar 2007
The APR-5000-XLS array package rework system incorporates six convection underboard heaters, an upper nozzle, and revised heating algorithms for reworking lead-free BGAs without damaging ICs.

Thermal Gap Fillers

Fri, 3 Mar 2007
THERM-A-GAP 569 and 579 thermal gap-filler materials offer high conformability in pre-formed thicknesses of 0.02

Planar Heat Spreader

Fri, 3 Mar 2007
A thin, planar superconducting heat spreader, IsoSkin provides thermal conductivities as high as 10,000 W/mK. The product is available in thicknesses down to 500 µm. It can replace the outer shell of electronic components, and is said to eliminate the need for heatsinks or other cooling devices in some applications.

Peristaltic Pump Dispenser

Tue, 3 Mar 2007
Precision dispensing of dangerous or toxic substances can be controlled by the model PPD-130 peristaltic pump dispenser, which accurately and repeatably deposits low-viscosity fluids such as adhesives, oils, solvents, and other materials. The peristaltic pumping principle applies pressure to a soft Teflon tube, which accepts deformation and recovers its initial shape, improving occlusion.

RF Calibration Software

Tue, 3 Mar 2007
WinCal XE calibration software addresses complexities encountered with complex, wafer-level RF measurements. Automated hybrid calibration algorithms allow users to calibrate up to four ports with a "precision probing tolerant" in place for differential measurements. Multi-port setup guides, calibration-standards management, and vector network analyzer (VNA) ports support the tool.

Updated Identification Software

Tue, 3 Mar 2007
The latest version of EconoCR industrial optical character recognition (OCR) software suits smart cameras, micro vision systems, and sensors tracking substrates, PCBs, glass, or electronic components in laboratory, manufacturing, and material-handling processes.

USDC Adds Governing Members

Fri, 3 Mar 2007
(March 30, 2007) SAN JOSE, CA — The U.S. Display Consortium (USDC) elected Michael McCreary as chairman of the consortium's governing board. James R. Buntaine, Ph.D., of Eastman Kodak; Steven Frilich, Ph.D., of DuPont; and Daniel Gamota, Ph.D., Motorola, also joined the board.

RVSI Expands in Singapore

Fri, 3 Mar 2007
(March 30, 2007) HAUPPAUGE, NY — RVSI Inspection LLC is relocating and expanding its Singapore offices for package and wafer inspection. The site will include a demonstration, applications, and training facility.

Intel Recognizes Suppliers

Thu, 3 Mar 2007
(March 29, 2007) SANTA CLARA, CA — Intel Corporation recognized 44 companies with the preferred quality supplier (PQS) award acknowledging quality and performance in 2006. Winners received the award at a ceremony in Burlingame, CA, this week. The awards are part of Intel's supplier continuous quality improvement (SCQI) process.

SEMI Launches High Tech U. en Français

Wed, 3 Mar 2007
(March 28, 2007) CROLLES, France — SEMI is hosting its High Tech U. program for about 40 secondary school students in Crolles March 27–29. Students will learn — in a play-oriented, interactive, hands-on experimental environment — how semiconductors and microelectronics are made, the science of microchips and interconnect, and the scope of career opportunities in this sector. This marks SEMI's first presentation of the class in Europe.

Infotonics Selects SUSS Bonders for MEMS

Wed, 3 Mar 2007
(March 28, 2007) MUNICH, Germany and CANANDAIGUA, NY — Infotonics, a collaborative center of excellence for photonics and microsystems in Canandaigua, chose the SUSS ABC200 wafer-bonding cluster tool and FC150 device bonder as strategic investments for its MEMS packaging laboratory.

Series C Nets $17.5M

Tue, 3 Mar 2007
(March 27, 2007) SAN JOSE, CA — Discera Inc. completed a series C funding round with $17.5 million, led by Scale Venture Partners in Foster City, CA. The investment will be allocated to increasing production, distribution, and marketing. Discera concurrently announced a strategic partnership with distributor ABRACON.

Fan-in PoP Allows Flexible Die Parameters

Mon, 3 Mar 2007
(March 26, 2007) SINGAPORE — STATS ChipPAC Ltd. developed a fan-in package-on-package (FiPoP) assembly solution that enables designers to integrate a wider range of die sizes than with conventional PoP packages. The FiPoP reportedly builds on the capabilities of PoP, including use of known good die (KGD) and use of the Z space, without the footprint and ball-height constraints of prior designs.

IBM Prototypes Optical SiP

Mon, 3 Mar 2007
(March 26, 2007) ANAHEIM, CA and YORKTOWN HEIGHTS, NY — Based on the concept of reducing costs through packaging integration, IBM researchers will introduce an optical chipset prototype for supercomputing applications that incorporates optical and CMOS components in one system-in-package (SiP), or optical module, at the 2007 Optical Fiber Conference, March 25–29 in Anaheim.

Trans-climate Lead-free Paste for QFP, CSP

Fri, 3 Mar 2007
(March 23, 2007) IRVINE, CA — Designed for manufacturability and flexibility in various regional climatic conditions, the Multicore LF600 lead-free solder paste from the electronics group of Henkel provides humidity resistance, 24-hour open times, and low voiding.

EI Receives DoD Contracts

Fri, 3 Mar 2007
(March 23, 2007) ENDICOTT, NY — The U.S. Department of Defense (DoD) awarded $164 million in contracts for engineering, verification, and production to Endicott Interconnect Technologies, Inc. (EI). The project includes organic packaging; module assembly; PCB design and fabrication; board assembly; verification and test of these systems; and support for logistics, shipping, and storage. The end product is a high-reliability, high-performance computing application.

SUSS, STS Launch MEMS Show

Fri, 3 Mar 2007
(March 23, 2007) MUNICH, Germany — SUSS MicroTec and Surface Technology Systems (STS) will cohost a MEMS technology showcase, "MEMS Technology: Embracing the Future." The show will debut in Boston on April 20, and include speakers from various aspects of the MEMS manufacturing process.

TSMC and NEXX Collaborate

Thu, 3 Mar 2007
(March 22, 2007) BILLERICA, MA — NEXX Systems (Billerica) and Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC) of Hsinchu, Taiwan, will co-develop processes for cost-effective use of through-silicon vias (TSVs), wafer-level chip-scale packages (WLCSPs), and redistribution layers.

Antares Distributes 3M Outside Japan

Thu, 3 Mar 2007
(March 22, 2007) AUSTIN, TX — Antares Advanced Test Technologies will distribute 3M Textool-branded BGA test and burn-in sockets outside of Japan, under a global distribution agreement between the companies.

Methods of Comparing Junction Temperatures

Fri, 3 Mar 2007
By Jia-Sheng Huang, Rongsheng Miao, Hanh Lu, Charlie Wang, Chris Helms, and Hamdi Demerci, Emcore

To design device performance and reliability accurately, knowledge of junction temperature is important. One common method used to estimate heating is by wavelength shift, measured at a room temperature, free-standing condition. The deduced junction temperature from the wavelength method is often used as a reference; however, such approach may lead to inaccurate life test estimates.

Book-to-Bill Continues to Climb in February

Fri, 3 Mar 2007
(March 16, 2007) SAN JOSE, CA — North America-based semiconductor-equipment manufactures posted a 1.05 book-to-bill ratio in February 2007, with $1.65B in orders received and $1.58B billings worldwide. The book-to-bill, published by SEMI, has risen incrementally since October 2006, and remained above parity since December.

Benchtop Dispensing Suits Prototypes

Thu, 3 Mar 2007
(March 15, 2007) CARLSBAD, CA — Asymtek, a Nordson company, released an automated dispensing system, the DispenseMate D583/585, based on the company's DispenseMate D-550 benchtop series. It targets dispensing applications that require compact, benchtop equipment, such as batch productions, laboratories, new product development, and prototyping.

Zuken Joins SiP Partnership

Wed, 3 Mar 2007
(March 14, 2007) MUNICH, Germany and WESTFORD, MA — Zuken joined the ADEPT-SiP project, a collaboration between industry partners, academia, and the U.K. government to develop a design and manufacturing methodology for system-in-package (SiP) technology.

Manufacturing Begins for Printed Sensors

Tue, 3 Mar 2007
(March 13, 2007) LINZ, Austria — NANOIDENT Technologies AG opened its first manufacturing facility for printed semiconductor-based optoelectronic sensors, NANOIDENT ORGANIC FAB, in Linz. The production facility uses no toxic materials, according to the company, and supports prototype through high-volume production.

EI Names Rajinder Rai VP R&D

Tue, 3 Mar 2007
(March 13, 2007) ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI), appointed Rajinder Rai as VP of R&D. Rai will assume immediate responsibility for assembling a development team to implement advanced processes and manufacturing, and will manage resources and support functions for the company's current and future R&D projects. He will also monitor and respond to state and federal program agencies for R&D opportunities.

SEMICON China to Host Advanced Technologies

Mon, 3 Mar 2007
(March 12, 2007) SHANGHAI, China — SEMICON China 2007, March 21–23 in Shanghai, will include CEO forums on wafer processing and test-and-assembly, a discussion of MEMS opportunities, various talks on the logistics of operating in China and in cooperation with China RoHS, and an IC-design suppliers pavilion, in conjunction with the FSA and SICA. Various exhibitors will also highlight cleanroom technologies, advanced automation, and multi-metal compatibilities.

Antares Reps Speak at BiTS

Mon, 3 Mar 2007
(March 12, 2007) VANCOUVER, WA and MESA, AZ — Steven B. Strauss, VP of engineering at Antares Advanced Test Technologies, spoke at the opening dinner of the eighth annual Burn-in and Test Socket Workshop (BiTS) March 11–14 in Mesa. The test supply company will also present four papers at the conference.

K&S Receives Combined Wire-, Die-bonder Order

Fri, 3 Mar 2007
(March 9, 2007) FORT WASHINGTON, PA — Kulicke & Soffa Industries, Inc., received purchase orders for a combination of 12 Easyline die bonders and 50 Maxum Ultra/Elite wire bonders from a customer in northwestern China equipping its new start-up production facility.

Qimonda Expands Back-end Capacity

Fri, 3 Mar 2007
(March 9, 2007) MUNICH, Germany; SUZHOU, China; JOHOR, Malaysia; and THIEF RIVER FALLS, MN — Qimonda AG plans to expand its assembly-and-test facilities for memory ICs in the Suzhou Industrial Park, west of Shanghai. Growth in front-end capacities led to requisite back-end expansion, said Kin Wah Loh, president and CEO.

Synthesis Support for Complex FPGAs

Fri, 3 Mar 2007
(March 9, 2007) WILSONVILLE, Ore. — Mentor Graphics Corporation, after a collaboration with Xilinx, Inc., released an update to Precision Synthesis (2006a Update 2) to support Virtex-5 SXT FPGAs. Support within Mentor's LeonardoSpectrum tool suite is expected shortly.

IMEC Predicts Increased Packaging Research

Thu, 3 Mar 2007
(March 8, 2007) LEUVEN, Belgium — IMEC and the Government of Flanders, represented by the Flemish Minister of Science and Innovation, Fientje Moerman, signed a frame agreement for the period 2007–2011. The research institute underwent an evaluation by a group of independent external consultants and peer reviewers to determine grant budgets for upcoming years.

Consumer Strong, Military Slow in New Year

Tue, 3 Mar 2007
(March 7, 2007) BEIJING and SAN JOSE, CA — Global semiconductor sales rose 9.2% in January, due in large part to strong consumer sectors — cell phones, personal computers, digital cameras, and music players. The year-to-year increase brought chip sales to $21.47B, according to the Semiconductor Industry Association (SIA), although global sales dipped 1.2% from December 2006.

System-in-Cube Technology Addresses Parasitics, KGD

Tue, 3 Mar 2007
(March 7, 2007) COSTA MESA, CA — Irvine Sensors Corporation demonstrated its 3D packaging technologies to stack four 500-mHz DDR memory chips without operating-speed degradation, which was verified by the chip maker. The company will now explore commercial exploitation of packaging techniques for the memory chips.

Packaging TidBiTS

Tue, 3 Mar 2007
With the 8th annual Burn-in Test and Socket Workshop (BiTS) coming up March 11–14 in Mesa, AZ, Advanced Packaging collected news, events, and products around the industry focused on test, sockets, and the BiTS event. Meet the Press at BiTS, March 12, to learn more about editorial submissions, and the variety of publishing opportunities available to the industry.

Test Handler System

Tue, 5 May 2007
The MT9928 semiconductor test handler system, with up to eight parallel test sites, supports 28,000 units-per-hour throughput and fast changeover between various package types. It reportedly offers temperature control and test accuracy.

DRAM Probe Card

Tue, 5 May 2007
For testing smaller-sized, smaller-density DRAM devices (512 Mb and below), the PH150XP wafer probe card incorporates a MicroSpring contact design that accommodates more than 25,000 contacts. It suits testing of consumer and mobile DRAM packages with high pin counts.

High-accuracy Bonder

Tue, 5 May 2007
The KADETT semi-automatic device bonder, designed for R&D labs, university research, and pre-production environments, performs high-accuracy placement and bonding processes for advanced packaging, MEMS, and other assembly tasks.

DRAM Collaboration for SiPs and MCPs

Thu, 5 May 2007
(May 31, 2007) SAN JOSE, CA and HSIN-CHU, Taiwan — Inapac Technology, Inc. (Hsin-chu), partnered with DRAM manufacturer ProMOS Technologies (San Jose) to develop a low-power, 256 Mb DDR SDRAM based on Inapac's SiPFLOW platform. ProMOS will manufacture the bare-die product in known good die (KGD) from system-in-package (SiP) and multi-chip package (MCP) devices.

DAC Hosts Range of Design Presentations

Wed, 5 May 2007
(May 30, 2007) SAN DIEGO — The Design Automation Conference (DAC), June 4–8 in San Diego, features an automotive theme focused on fuel cells, electric drivetrains, advanced entertainment and safety systems, and disruptive designs in the automotive sector. Other presentations at the conference will cover intellectual property (IP), design and verification, low-power designs, and related topics.

EI Enters Long-term DoD Contract

Wed, 5 May 2007
(May 30, 2007) ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI), received a $49 million follow-on production contract from the U.S. Department of Defense (DoD) for a new generation of packaging, PCB, and substrate technologies. The R&D will focus on high-productivity computing, and is part of a five-year agreement.

SENSOR + TEST Attendance Up 15%

Tue, 5 May 2007
(May 29, 2007) NURNBERG, Germany — SENSOR + TEST conference and exhibition reports 15% higher attendance in 2007 than 2006, with 8,600 visitors and 610 exhibitors. The show was held in conjunction with GESA Expert Forum; OPTO conference on optical technologies, optical sensors, and measuring techniques; and the IRS2 conference on infrared (IR) sensors and systems, May 22–24 in Nürnberg.

OLED Cross-licensing for Active Matrix Displays

Fri, 5 May 2007
(May 25, 2007) ROCHESTER, NY and TAINAN, Taiwan — Eastman Kodak Company (Rochester) will cross license its active matrix organic LED (OLED) intellectual property (IP) and manufacturing processes to Chi Mei Optoelectronics (CMO) and its subsidiary Chi Mei EL (CMEL), both based in the South Taiwan Science Park (Tainan). CMEL expects to use the technology for small-panel mobile displays.

Rogers Highlights High-frequency at IMS

Fri, 5 May 2007
(May 25, 2007) ROGERS, CT — Rogers Corporation will exhibit specialty materials for the high-frequency market at IEEE MTT-S International Microwave Symposium (IMS), June 5–7 in Honolulu, HI, at Booth 843. Offerings include advanced packaging materials, copper bond technology, and antenna-grade materials.

EI Adds LDI and AOI Systems for BGAs

Thu, 5 May 2007
(May 24, 2007) BILLERICA, MA — Orbotech, Inc., North American subsidiary of Orbotech Ltd., received a multi-million-dollar order from Endicott Interconnect Technologies, Inc. (EI), for its laser direct imaging (LDI) and automated optical inspection (AOI) equipment. EI will incorporate the machines in its production facility in Endicott, NY, making it Orbotech's largest client in the Americas.

USCD Names CTO

Thu, 5 May 2007
(May 24, 2007) SAN JOSE, CA — The U.S. Display Consortium (USDC) appointed Mark A. Hartney, Ph.D., as chief technical officer (CTO), responsible for directing the partnership's R&D and technical programs in the flat panel display (FPD) industry. Bob Pinnel, Ph.D., will retire from the post, after serving as CTO since USDC's inception in 1993.

IBM and Partners Continue JDA into 32-nm Node

Thu, 5 May 2007
(May 24, 2007) EAST FISHKILL, NY — IBM, its Common Platform partners Charted Semiconductor Manufacturing (Singapore) and Samsung Electronics (Seoul, South Korea), and joint development alliance (JDA) partners Infineon Technologies (Munich, Germany) and Freescale Semiconductor (Austin, TX) signed a series of JDAs for 32-nm semiconductor process development and manufacturing. This is the fourth development node on which the partners have collaborated.

ECTC Paper Presentation Preview

Wed, 5 May 2007
(May 23, 2007) RENO, NV — The 57th annual Electronic Components and Technology Conference (ECTC), May 29 to June 1 in Reno, NV, will feature developments in packaging, components, and microelectronic systems technology. Paper presentations include four technical pieces from Endicott Interconnect (EI — Endicott, NY) and five by Freescale Semiconductor (Austin, TX).

FETtest Completes Amicronix Buy

Wed, 5 May 2007
(May 23, 2007) MORGAN HILL, CA — FETtest, Inc., acquired Amicronix, Inc. (San Jose, CA), adding production mixed-signal semiconductor test equipment to its product portfolio.

SEMI Reports Q'01 Shipments Rising

Tue, 5 May 2007
(May 22, 2007) SAN JOSE, CA — SEMI reported that Q'01 bookings worldwide for semiconductor manufacturing equipment rose about 6% in 2007 over 2006; billings rose approximately 12% over the same quarter last year. Billings increased significantly in Korea, China, and Taiwan.

Avago Cuts Manufacturing in Strategic Shift

Mon, 5 May 2007
(May 21, 2007) SAN JOSE, Calif. — Avago Technologies expanded its manufacturing outsourcing program as part of a business model shift announced in January 2007. The component supplier will reduce its Singapore manufacturing staff by about 230 people to allot resources to higher value-added activities.

Temasek Increases STATS ChipPAC Holdings

Mon, 5 May 2007
(May 21, 2007) SINGAPORE — Singapore Technologies Semiconductors Pte Ltd., wholly owned subsidiary of Temasek Holdings Limited, closed its voluntary conditional cash offer for STATS ChipPAC shares and convertible notes by increasing its holdings to 83.1%.

Sonoscan Investigates Air and Fluid Contamination

Fri, 5 May 2007
(May 18, 2007) ELK GROVE Village, IL — Sonoscan determined that some delaminations in plastic IC packages contain air and fluid contaminants, possibly caused by silicone used as a release agent in molding equipment. Acoustic microscopic imaging identified partly red and partly white delaminations on plastic-encapsulated microcircuits, which indicated two types of contaminants.

Smart Phones to Drive Mobile Chips Market

Thu, 5 May 2007
(May 17, 2007) BEIJING — The Semiconductor Industry Research Center of CCID Consulting reports that mobile phone production in China experienced typically slow growth in Q'01 2007 from Q'04 2006, but overall grew 45.7% in 2006. The mobile phone chip market did not slow as much as mobile phone production, due in part to the increasing prevalence of smart phones.

Nanocomp Celebrates CNT Textiles

Wed, 5 May 2007
(May 16, 2007) CONCORD, NH — It looks like cotton candy as its being synthesized, but has the strength of carbon steel. It is as electrically conductive as copper at 50MHz and is thermally conductive. It has application possibilities across military, aerospace, and semiconductor markets. Is it any wonder that Nanocomp Technologies, the company that manufactures this carbon nanotube (CNT) textile, received the New Hampshire High Tech Council's "Product of the Year" in 2006?

STATS ChipPAC Builds R&D for Packaging Technologies

Wed, 5 May 2007
(May 16, 2007) SINGAPORE — STATS ChipPAC Ltd. will establish a Singapore R&D facility for through-silicon via (TSV), microbumping, die embedding, and advanced substrate technologies to create advanced packages. Core operations will focus on wafer-level processing and advanced wafer integration.

Amkor, UTAC to Cross-license Packaging

Tue, 5 May 2007
(May 15, 2007) CHANDLER, AZ and SINGAPORE — Amkor Technology, Inc. (Chandler), and United Test and Assembly Center Ltd. (UTAC — Singapore) entered a multi-year cross-licensing agreement wherein UTAC will adopt Amkor's MLF technology and Amkor will use UTAC's QFN patents. The deal covers intellectual property rights (IPR) and transfer of associated packaging technologies.

AMD Orders Flip Chip Equipment

Tue, 5 May 2007
(May 15, 2007) RADFELD, Austria — AMD Penang ordered its first Datacon 8800 FC Quantum flip chip bonder, and is expected to add more in the coming months, to began producing single- and multi-flip chip assemblies for high-end processors. This marks Datacon's first order for flip chip equipment from an integrated device manufacturer (IDM).

DAC Approaching in June

Tue, 5 May 2007
Keynoters, workshops, tutorials, and panel discussions covering wild-and-wacky to practical will highlight this year's DAC, June 4–8 in San Diego. The conference will host 161 papers, eight special sessions, seven full-day tutorials, eight panels, 18 pavilion panels, and seven hand-on tutorials in its 44th year. Technical presentations, submitted from 25 countries, cover electronics design from design for manufacture (DfM) to low-power design and a range of other topics.

SEMX Names Executive VPs

Tue, 5 May 2007
(May 15, 2007) ARMONK, NY — SEMX Corporation, the parent company of Semiconductor Packaging Materials (SPM), appointed Paul Nikac and Vito Tanzi as executive vice presidents of the corporation, following Kenneth J. Huth's retirement.

Cadence Improves Co-design Platform

Tue, 5 May 2007
(May 15, 2007) SAN JOSE, CA — Cadence Design Systems, Inc., released product and technology enhancements within its Allegro system interconnect design platform for PCB design, including constraint-driven flow and global routing.

KLA-Tencor Cleared to Buy Therma-Wave

Mon, 5 May 2007
(May 14, 2007) FREMONT and SAN JOSE, CA — The German Federal Cartel Office (FCO) approved KLA-Tencor's bid to purchase Therma-Wave shares, completing the regulatory approval process for the metrology equipment company's acquisition.

Microsoft, SanDisk Enter Joint Venture

Mon, 5 May 2007
(May 14, 2007) REDMOND, WA and MILPITAS, CA — To develop a next-generation hardware and software solution for USB flash drives, Microsoft and SanDisk Corporation will collaborate and open an entity for licensing compatible hardware designs and intellectual property (IP). Revenues from the joint venture will be shared. Microsoft is discussing licensing software with third-party hardware vendors.

Experimental Satellite Integrates SIX SIGMA CGA

Fri, 5 May 2007
(May 11, 2007) MILPITAS, CA — SIX SIGMA, a division of Winslow Automation, Inc., integrated its SolderQuik reinforced column grid array technology onto six FPGAs on the Los Alamos National Laboratory Cibola Flight Experiment Satellite (CFEsat). SIX SIGMA reconfigured the FPGAs for Los Alamos to allow these components to withstand extreme thermal cycling while the satellite monitors weather patterns.

2D, 3D and Beyond: Inspecting Stacked Die in MCPs

Fri, 5 May 2007
By Matt Wilson and Rajiv Roy, Rudolph Technologies, Inc.

The value of fast, accurate inspection capability, which can detect existing defects and preempt further process investment, is multiplied in multichip packaging (MCP) applications by the large investment already made in multiple, fully processed die and the unrecoverable nature of the packaging process. One serious defect can kill its own die and take the rest of the stack down as well.

SUSS Apps Center Opens in Singapore

Fri, 5 May 2007
(May 11, 2007) SINGAPORE — SUSS MicroTec AC opened its Applications & Measurement Center for the Asia-Pacific region. The Singapore center hosts test equipment for wafer test and semiconductor characterization.

LED Lab Optimizes Operating Parameters

Thu, 5 May 2007
(May 10, 2007) NEW YORK — TT electronics OPTEK Technology opened an in-house visible LED laboratory with resources to assess LED packages on junction temperature variation, optical performance, and other parameters. The lab aids in design, manufacturing, and test.

Intel Capital Invests in Phoenix Micro

Thu, 5 May 2007
(May 10, 2007) CARLSBAD, CA — Intel Capital, the venture capital branch of Intel Corporation, invested in six new companies, totaling $31 million. In the semiconductor space, Intel invested in China-based Phoenix Microelectronics.

Nordson Adds Businesses to Dage, Asymtek Subsidiaries

Wed, 5 May 2007
(May 9, 2007) WESTLAKE, OH — Nordson Corporation acquired YESTech, Inc., adding the AOI and X-ray supplier to its Dage Holdings company; and PICO Dosiertechnik (PICODOSTEC), a piezoelectric dispensing system company that will join Nordson's Asymtek subsidiary, in two separate purchases. The total acquisition cost about $53 million. Nordson expects to leverage the business' core technologies across its advanced technology segment for packaging and electronics assembly products.

Indium Names Business Directors

Wed, 5 May 2007
(May 9, 2007) CLINTON, NY — Indium Corporation named Terry Guckes as business development director for metals and chemicals, and Bill Brunstedt as associate director of Asia-Pacific sales and marketing. Both men will be responsible for developing business relationships.

Mainstream MEMS MEPTEC's Focus

Tue, 5 May 2007
(May 8, 2007) SAN JOSE, Calif. — MEPTEC's final program for the 5th annual MEMS Packaging Symposium, "MEMS in the Mainstream: $50 Billion and Growing," will include industry, academia, and financial institutions discussing various commercial and volume markets for MEMS, and innovations to fuel a viable MEMS industry. The symposium will occur May 16 and 17 in San Jose.

Unisem Buys AIT

Mon, 5 May 2007
(May 7, 2007) BATAM, Indonesia — Unisem Berhad of Malaysia will purchase Advanced Interconnect Technologies (AIT) of Singapore for approximately $70 million. The acquisition brings Unisem into the advanced packaging and test arena, with BGA, QFN, and flip chip capabilities. AIT will become a full subsidiary.

IITC Celebrates 10 Years

Fri, 5 May 2007
(May 4, 2007) SAN FRANCISCO, CA — The IEEE International Interconnect Technology Conference (IITC) began 10 years ago in 1997 in response to IBM's copper interconnection technology ramp. The forum, June 4–6 in San Francisco, presents R&D work on semiconductor processing, advanced materials, equipment development, and interconnect systems for scientific, engineering, and related industries.

Mentor Graphics Appoints CFO

Fri, 5 May 2007
(May 4, 2007) WILSONVILLE, OR — Mentor Graphics Corporation named Maria M. Pope vice president and chief financial officer (CFO), responsible for treasury, tax, accounting, internal audit, corporate development, and investor relationships. She also will manage facilities and purchasing.

From the Tradeshow Floor: IMAPS Device Packaging

Thu, 5 May 2007
By Meredith Courtemanche, assistant editor

IMAPS Device Packaging in Scottsdale, AZ, brought me from a below-freezing New England blizzard to the hot, sunny Arizona desert alongside dedicated members of the advanced packaging industry. Lead-free, flip chips, MEMS, and every variety of stacked package seemed to be the main topics around the tradeshow floor.

QES Distributes RVSI to Southeast Asia

Wed, 5 May 2007
(May 3, 2007) HAUPPAUGE, NY — RVSI Inspection LLC appointed QES, headquartered in Kuala Lumpur, Malaysia, to represent its Lead Scanner and Wafer Scanner product lines in Singapore, Malaysia, Indonesia, and Thailand. QES serves front- and back-end markets.

TDI Ramps InGaN Substrates

Fri, 8 Aug 2007
(August 17, 2007) SILVER SPRING, MD — Technologies and Devices International, Inc. (TDI), began producing indium-gallium-nitride (InGaN) substrates for packaging GaN-based high-brightness LEDs and blue and green laser diodes. The material's crystal lattice and thermal properties are composed to match the given overgrown GaN device, which can reduce defects, improve device efficiency and output, and boost lifetime and power usage.

July Book-to-Bill Tumbles to 0.84

Fri, 8 Aug 2007
(August 17, 2007) SAN JOSE, CA — The July book-to-bill for North America-based semiconductor equipment manufacturers fell to 0.84, reports SEMI. The book-to-bill has hovered around parity throughout 2007, but July saw lower order levels than any previous months in 2007, with a month-to-month drop of $167.6 million.

Apple Influences Chip Manufacturing, iSuppli Reports

Thu, 8 Aug 2007
(August 16, 2007) EL SEGUNDO, CA — Apple Inc.'s iPhone release bumped up the company's influence on semiconductor design in the first half of 2007, analyst firm iSuppli Corp. reports. Its regional design influence tool (RDIT) shows Apple's design activity to have a significant impact on the global electronics supply chain.

TI Buys RFIC Design Business

Thu, 8 Aug 2007
(August 16, 2007) DALLAS — Texas Instruments Inc. (TI) acquired Integrated Circuit Designs, Inc. (ICD — Ellicott City, MD) to enhance its low-power RF industrial, commercial, and consumer solutions. Transactions terms were undisclosed.

Turnkey Modules for Cell Phones

Thu, 8 Aug 2007
By Erkki Soininen, Elcoteq

As EMS providers become more involved in design and R&D, they have started working on advanced miniaturization technologies and different component packaging methods. One method to improve TCO and solve design challenges for multifunctional phones is modules. Mobile phones can be designed using modules and hardware and software platforms that adapt quickly. Multiple functions can be combined in a single module to save space.

TSMC Approves WLP Plan

Wed, 8 Aug 2007
(August 15, 2007) TAIPEI, Taiwan — TSMC board members approved a proposal for capacity investments leading to 300-mm wafer-level packaging (WLP) production capability. The investment equals $59.8 million in capital appropriation. It is designed to reduce form factor for more competitve end products.

SEMI Q'02 Figures Show Sustainable Market

Wed, 8 Aug 2007
(August 15, 2007) SAN JOSE, Calif. — SEMI reported global semiconductor manufacturing equipment billings at $11.06B in Q'02 2007, and bookings at $10.22B. Strong memory investments in the first half of 2007 led to an increase in billings, according to Stanley T. Myers, president and CEO, SEMI, adding that bookings declined, but remained at "sustainable levels."

No Reprieve in Raw Metals Costs

Tue, 8 Aug 2007
(August 15, 2007) LONDON, NEW YORK and TOKYO — Data from the London Mercantile Exchange (LME) confirms that — at mid-year 2007 — copper, lead, and tin raw metal prices remain above 2006 levels. Leadframe materials, including copper and nickel, are hitting record prices, asserts The Nikkei Business Daily, which suggests that component manufacturers are resistant to absorbing the higher raw metals costs.

JV Installs SUSS Coater/Developer

Tue, 8 Aug 2007
(August 14, 2007) MUNICH, Germany — SUSS MicroTec delivered a 200-mm Gamma production coating and developer cluster to HD MicroSystems, LLC (Wilmington, DE), to support the company's polyimide and PBO material technologies. HD MicroSystems is a joint venture (JV) of Hitachi Chemical Co. Ltd. and DuPont Electronic Technologies. It will use the production cluster to support expansion into advanced packaging markets, said John Malloy, U.S. marketing and sales manager, HD MicroSystems.

Verdant Names Advisory Board

Mon, 8 Aug 2007
(August 13, 2007) SUNNYVALE, CA — Verdant Electronics named more than 15 members from packaging, interconnect, PCB, and related industries to its board of advisors, including Happy Holden, Werner Engelmaier, and others. These contributors helped frame the Occam package-first assembly method Verdant introduced, and will bring the process from concept to development, said Joe Fjelstad, president, Verdant.

Consortium Undertakes MEMS, Advanced Electronics

Mon, 8 Aug 2007
(August 13, 2007) LIVINGSTON, Scotland, U.K. — Scotland-based R&D-focused institutions and companies founded a consortium to engage emerging technology companies in MEMS, biomedical, control electronics, remote sensing, and advanced technology sectors. The Institute for System-level Integration (iSLI), the Scottish Microelectronics Centre (SMC), Optocap, and Photonix Limited plan to provide R&D, commercial scaling, and higher-value services to U.K.-based and global industry members.

SEMI Appoints International Board

Fri, 8 Aug 2007
(August 10, 2007) SAN FRANCISCO — Jerry Coder, president emeritus of the semiconductor materials business unit of Dupont Electronic Technologies, was elected by SEMI as chairman of the industry association's International Board of Directors. Coder succeeds Archie Hwang, chairman and CEO of Hermes-Epitek, who served for the past year.

Job Shop Serves Emerging Markets

Fri, 8 Aug 2007
(August 10, 2007) MANCHESTER, NH — J P Sercel Associates (JPSA) expanded its contract manufacturing, job shop, and applications laboratory capabilities with various laser types, including infrared (IR) and "green" lasers for thin-film solar-panel manufacturing and other developing industries. The company also supplemented its DPSS and excimer laser capacity with more workstations, performing tasks such as wafer singulation and LED lift-off.

Next-generation Flash Programmers Ship

Fri, 8 Aug 2007
(August 10, 2007) HOUSTON — BPM Microsystems shipped the first units of its next-generation NAND and NOR flash device programmer, Flashstream. Flashstream is the company's first dedicated hardware design for flash memories.

Exopack Acquires Electronics Films Division

Fri, 8 Aug 2007
(August 10, 2007) SOUTH HADLEY, MA and SPARTANBURG, SC — InteliCoat Technologies sold its electronic and engineered films (EEF) business unit to Exopack Holding, Inc., for an undisclosed amount. The division gives Exopack a European facility and new markets.

Qualmark Sees Japan HALT/HASS Market Up

Thu, 8 Aug 2007
(August 9, 2007) DENVER — Qualmark Corporation sold a Typhoon Chamber HALT/HASS system to a major consumer-electronics manufacturer in Japan. The country provides advanced electronic components and products, said Charles Johnston, president and CEO, Qualmark, adding that this niche suits use of accelerated test systems to help bring products to market.

Carsem Installs Teradyne Test

Thu, 8 Aug 2007
(August 9, 2007) NORTH READING, MA — SATS provider Carsem will install a Teradyne, Inc., microFLEX test system at its Ipoh, Malaysia, facility. Carsem plans to test battery-management devices used in automotive applications, with the microFLEX equipped with DC90 instrumentation.

Yole, Chipworks Host Asia Briefing

Wed, 8 Aug 2007
(August 8, 2007) TOKYO — Yole Développement (Lyons, France) and Chipworks, Inc. (Ottawa, Canada), presented their first MEMS market briefing in Asia, with speakers from BOSCH Japan and Silex Microsystems. The event occurred this July at Micromachine 2007 in Tokyo.

Unisem Names Group CEO from AIT

Wed, 8 Aug 2007
(August 8, 2007) KUALA LUMPUR — Unisem Berhad appointed Bruno Guilmart executive director and group CEO, as part of integrating Advanced Interconnect Technologies Limited (AIT) into the SATS company. Ang Chye Hock, formerly president, will assume the role of executive director and group chief operating officer (COO), Unisem.

IC Foundries Face Shortages

Tue, 8 Aug 2007
(August 7, 2007) SCOTTSDALE, AZ — The major IC foundries — including TSMC, UMC, SMIC, and Chartered — will move from 78.5% capacity utilization in Q'01 2007 to 97.5% by Q'04 2007, according to the "August Update to the McClean Report," from IC Insights. This shift signals IC foundry customers to secure Q'04 2007 and early 2008 capacity needs, as space may run out.

STATS Adds Director

Mon, 8 Aug 2007
(August 6, 2007) SINGAPORE — SATS provider STATS ChipPAC named Jimmy Phoon Siew Heng to its Board of Directors, effective immediately, citing Phoon's financial and investment experience. Phoon is senior managing director and chief investment officer at Temasek Holdings Limited, which has previously bid to acquire STATS, and holds majority stock in the company.

Investors Back Vietnam Packaging

Mon, 8 Aug 2007
(August 6, 2007) PALO ALTO, CA — Several Silicon Valley companies invested as much as $200 million to launch a packaging plant in Hanoi, Vietnam. The company, Vietnam-Chipscale Advanced Packaging Services (V-Caps) will involve executives from the Silicon Valley region and the local industry in Vietnam, and could employ up to 1,500 workers initially.

Henkel Adds N.A. Distributor

Fri, 8 Aug 2007
(August 3, 2007) IRVINE, CA — Henkel Corporation partnered with Production Automation Corporation (PAC), extending its distribution network in the U.S. and Mexico. PAC will market and support Henkel's Hysol, Loctite, and Multicore electronics assembly and semiconductor packaging materials.

Package-first Electronics Assembly

Fri, 8 Aug 2007
(August 3, 2007) SANTA CLARA, CA — Verdant Electronics will develop a PCB and PCB assembly (PCBA) technique, Occam, that eliminates soldering in favor of an encapsulation and plating process. The reverse-order interconnection process directly connects component terminations with circuit traces, and may eliminate issues with lead-free assembly.

Outsourced Packaging Outgrowing In-house

Fri, 8 Aug 2007
(August 3, 2007) WELLESLEY, MA — BCC Research finds, in "The Global Market for Advanced Electronic Packaging," the outsourced semiconductor packaging and test (OSPT) services sector outpacing conventional in-house package-and-test in growth, though outsourcing remains a $16.2B industry compared to $23.3B done in-house. The overall package-and-test market will grow from $38.5B in 2006 to $57.6B by 2011, according to the report.

DEK Plans Shenzhen Facility Grand Opening

Thu, 8 Aug 2007
(August 2, 2007) WEYMOUTH, U.K. — DEK will host SMTA members, customers and suppliers, and local government representatives at a grand opening for its Shenzhen, China, manufacturing facility on August 27, 2007. The facility will expand DEK's production capacity for entry-level and medium-range printer platforms, and support for Asia-Pacific customers.

IBM Streamlines VT Package-and-test Facility

Thu, 8 Aug 2007
(August 2, 2007) ESSEX JUNCTION, VT — IBM reportedly will lay off up to 450 employees, mostly from its systems and technologies group in upstate NY, amid cost-cutting efforts. About 90 layoffs will come from the company's site in Essex Junction, VT, notes the Associated Press (AP).

ICE Executes Counterfeit Components Raid

Thu, 8 Aug 2007
(August 2, 2007) WASHINGTON, DC — U.S. Immigration and Customs Enforcement (ICE) agents, assisted by electronics industry representatives, executed a large-scale raid on businesses and residences suspected of imports, sales and distribution, and installation of illegal modification chips (mods) and other IP violations. The investigation, comprising 32 federal search warrants in 16 states, and 22 ICE offices, targeted illegal chip and software manufacture for gaming consoles.

Flexible Circuit Substrate

Mon, 6 Jun 2007
Keratherm 86/77 flexible thermal circuit (FTC) comprises a thin, etchable copper layer bonded to a thermally conductive silicone film. It can be attached with thermally conductive adhesive to to non-linear, heat-spreading structures, and provides an electrically conductive bonding site for LEDs and other high-heat components.

MEMS Metrology System

Mon, 6 Jun 2007
The DSM200 automated metrology system performs cassette-to-cassette front-to-back alignment for front- to back-side alignment applications, such as MEMS, power semiconductor, and optoelectronics assembly.

MEMS/Nano Software Suite

Mon, 6 Jun 2007
Targeting the MEMS and nanotechnology industries, the IntelliSuite v8.2 software tool for MEMS/nano-device development includes nanostructure design tools to enable carbon nanotube (CNT) and nano-structure use in computing, display, medical, sensor, and related devices.

Microprobing Inspection Microscope

Mon, 6 Jun 2007
Developed for university and research laboratories inspecting wafers and substrates, the NAT-31 42×–540× microscope inspection system includes a USB 2.0 color camera with high-clarity-zoom optics and 1-µm or below feature resolution. When used in conjunction with the company's probe station, the system detects defects, alignment, and probe placement.

Stacked Flip Chip Package

Mon, 6 Jun 2007
The Flip Chip PiP combines a baseband digital signal processor (DSP) flip chip with stacked memory and analog devices for a small package-to-die ratio and high I/O with a small footprint. This package-in-package (PiP) suits a range of mobile devices, including cell phones.

Complex Package Analysis Tool

Tue, 6 Jun 2007
The PakSi-E quasi-static electromagnetic analysis software for IC, system-in-package (SiP), and PCB design includes various updates and improvements that reportedly enhance performance up to 3× that of previous versions. It targets a unified analysis environment for signal, power, and thermal integrity through multi-port design, front-end CAD import uniformity, and streamlined user interfacing.

Compact Wind Tunnel

Tue, 6 Jun 2007
The BWT-104 research-quality, open-loop, benchtop wind tunnel suits thermal characterization for components, PCB assemblies (PCBAs), and heatsink-type cooling devices. Twelve ports allow users to insert probes and temperature and velocity sensors for analysis, while a Plexiglass viewing section enables visual flow characterization.

Ceramic BGA Resistor Components

Tue, 6 Jun 2007
With all circuits wired on the bottom of the ceramic BGA (CBGA) package, the CHC-Precision series resistor network components eliminates wrap-around terminations to reduce parasitic effects and enable under-side washing.

Enhanced Temperature Differential

Tue, 6 Jun 2007
The eTEC thin-film miniature embedded thermoelectric component was enhanced to achieve 55°–60°C temperature differentials at room temperature in a research environment. Proprietary materials for cooling or power generation measure 5–15-µm thick.

SPICE Model for 90 nm

Tue, 6 Jun 2007
Developed at the University of Hiroshima (Japan) with professor Mitiko Miura-Mattausch, the HiSIM SPICE modeling solution targets modeling and simulation based on the physics of 90-nm CMOS geometries and below. It incorporates the surface potential-based model.

Molded Ceramic Packages

Tue, 6 Jun 2007
MIL-STD-883-certified hermetic, the molded ceramic surface-mount packages are low profile and target aerospace, avionics, and telecom applications, packaging LEDs, MEMS, and optical devices.

Power-device Characterization Test System

Tue, 6 Jun 2007
The Telsa power-device characterization system tests and characterizes power devices prior to packaging, providing on-wafer probing for over-temperature, low-contact-resistance measurement up to 60 A and 3,000 V. Characterization prior to packaging is said to improve accuracy of test data and models.

SEMICON West Preview

Thu, 6 Jun 2007
SEMICON West will take place July 16–20 in San Francisco, bringing together equipment suppliers, SATS providers, R&D institutes, and related companies in the semiconductor packaging industry to highlight new processes, systems, and packages.

Ironwood Debuts QFN Socket

Fri, 6 Jun 2007
(June 29, 2007) BURNSVILLE, MN — Designed to last 100,000 insertions, the DG-QFN40C-01 socket for 0.4-mm-pitch QFN 40-pin ICs from Ironwood Electronics suits a 5- × 5-mm package and operates at up to 40 GHz with <1 dB insertion loss. The socket is constructed with high-performance, low-inductance diamond particle interconnect contactor.

Shaken, Not Stirred: IMAPS N.E. Connects to Bond Theme

Tue, 5 May 2007
By Meredith Courtemanche, assistant editor

IMAPS New England, May 1st in Boxborough, MA, was a regional show with a national feel — a strong technical program, about 70 exhibitors, and approximately 450 attendees checking out booths and listening to detailed keynotes and presentations. The show included a new vendor workshop on the exhibit floor and a Bond, James Bond theme complete with playing cards, tuxedos, and an energetic environment.

IEEE Devises Nano Roadmap

Tue, 5 May 2007
(May 1, 2007) PISCATAWAY, N.J. — The IEEE's "Nanoelectronics Standards Roadmap (NESR)" suggests five standards for 2007, involving conductive interconnect nanomaterials, organic sensors, and nano-scale devices. With industry approval, the group plans to complete seven nanomaterial and five nanodevice standards for 2008.

Optical Inspection Station

Tue, 4 Apr 2007
The SPM ProberStation 150 combines 3-D inspection and modern optical microscopy in a vision inspection system for atomic force microscopy (AFM) and scanning probe microscopy (SPM) studies. Travel area across the motorized stage accommodates samples up to 150 × 250 mm; measurements are said to be highly repeatable at ±200 nm for measuring surface roughness and features.

Laser System for Flex

Tue, 4 Apr 2007
The MicroLine UV cuts openings in polyimide coverlayer foils and flex circuits, performing routing, skiving, drilling, pocket cutting, etch/solder-resist structuring, and ceramic substrate micromachining. It suits prototyping and pre-series production environments.

Low Outgassing Dielectric Gels

Tue, 4 Apr 2007
EPM-2480, 2481, and 2482 dielectric gels are designed to encapsulate packages when outgassing-related contamination poses a problem within a device. The products cure to a soft and compliant silicone, and reportedly reduce stress on assemblies during temperature cycling.

Hot Wax Dispensing

Mon, 4 Apr 2007
Hot wax, used as a gate or valve, enables lab-on-a-chip applications, containing fluids on a chip until they are released, by temperature change, to interact with other fluids or specimens deposited on the chip, for diagnostic testing. The DispenseJet DJ-9000 jet dispenses wax onto discrete locations on the chip, enabling biological testing on-chip without contaminations.

Upgrade for Device Programmer

Mon, 4 Apr 2007
The Version 1.1 application software and device support upgrade for the FLX500 desktop automated device programmer enables real-time, on-demand statistical reporting and other features.

Microscopic Glass Beads

Mon, 4 Apr 2007
Designed to produce hermetic glass-to-metal seals in IC packages, Direct-Draw- and Redraw-formed beads offer small quantities in a range of colored or opaque glass, or larger quantities of continuously formed clear glass tubing and rod.

MEMS Roadshow Highlights 300-mm Technologies

Fri, 4 Apr 2007
By Françoise von Trapp, managing editor

MEMS technology spans the entire semiconductor industry, with wafer processes through test, assembly, and packaging. As these micro-sized devices involve delicate structures, processes continue to evolve to address the complexities of MEMS manufacturing. SUSS and STS joined forces to present a U.S.-based roadshow "MEMS Technology: Embracing the Future," to share developments that are bringing manufacturing processes into the 300-mm range.

Memory Collaboration for MCPs

Fri, 4 Apr 2007
(April 27, 2007) MILPITAS, CA and MUNICH, Germany — SanDisk Corporation and Qimonda AG will jointly develop and manufacture muli-chip packages (MCPs), incorporating SanDisk NAND flash and controllers with Qimonda low-power mobile DRAM, through a jointly owned company in Portugal. The MCPs target high-capacity memory requirements of data-intensive mobile applications.

Probe Card Boasts 26,000 Pins

Thu, 4 Apr 2007
(April 26, 2007) LIVERMORE, CA — FormFactor, Inc., shipped a 26,000 pin-count wafer probe card, based on its PH150XP platform, to packaging and wafer-test house Tera Probe, Inc., for testing advanced DRAM wafers.

Skip Fehr Joins Mirror's Board

Wed, 4 Apr 2007
(April 25, 2007) SAN JOSE, CA — Gerald K. "Skip" Fehr, Ph.D., joined Mirror Semiconductor's technical advisory board (TAB), to develop the company's wire-bonding designs, named Mirrored Pinout. Fehr, an industry consultant in San Jose, has served at Fairchild Semiconductor, Intel, LSI Logic, and Texas Instruments (TI).

SMT/Hybrid/Packaging Highlights

Wed, 4 Apr 2007
(April 25, 2007) NUREMBERG, Germany — SMT/Hybrid/Packaging, April 24–26 in Nuremberg, hosts technical sessions, tutorials, exhibitions, live packaging demonstrations, and other events geared toward advanced applications in packaging and electronics assembly. Following are some highlights from the show.

$7M Raised for High-power LED Engines

Wed, 4 Apr 2007
(April 25, 2007) WESTHAMPTON, NJ — In series D funding, Lamina Ceramics, Inc., raised $7 million to fund expansion of its high-brightness, high-power LED business. Easton Capital Investment Group (New York and Florida) led the round.

Zuken Offers TI DSP Data to Package Engineers

Tue, 4 Apr 2007
(April 24, 2007) MUNICH, Germany and WESTFORD, MA — Zuken is supporting free footprint data for Texas Instruments' digital signal processor (DSP) products to CR-5000 users. The engineering consulting firm's Japanese, European, and American operations joined the TI DSP Third Party Network, increasing customer access to DSP designs.

MCP Built with 20 Stacked Die

Mon, 4 Apr 2007
(April 23, 2007) AKITA, Japan — Akita Elpida Memory, Inc., developed a 1.4-mm-thick multi-chip package (MCP) encompassing 20 thinned and stacked die. The company plans to incorporate processes used on this 20-die package to improve performance and manufacturability of more widely used 5- to 7-die-stack 3D packages.

Samsung Develops DRAM Stack with TSVs

Mon, 4 Apr 2007
(April 23, 2007) SEOUL, South Korea — Samsung Electronics Co., Ltd., has developed an all-DRAM stacked-memory package using through-silicon vias (TSVs) housed in aluminum pads to avoid performance slow-downs caused by the redistribution layer. The company applied a proprietary wafer-thinning technique to eliminate warped die in the low-profile package.

Nan Ya PCB Boosts Flip Chip Substrate Line

Fri, 4 Apr 2007
(April 20, 2007) TAIPEI, Taiwan — Nan Ya PCB Corporation added an additional line to its flip chip substrate production capacity, increasing output to 30 million units monthly. The line will produce seven million units, reports Taiwan's China Economic News Service (CENS).

Getter Services for MEMS WLP

Fri, 4 Apr 2007
(April 20, 2007) SANTA BARBARA, CA — Innovative Micro Technology (IMT) began offering getter deposition services of wafer-level packaging (WLP) of MEMS devices, and other components requiring a hard vacuum. In testing, IMT reportedly demonstrated vacuum levels below 10 mTorr for inorganic devices — equal to or better than industry standard.

March Book-to-Bill Even

Fri, 4 Apr 2007
(April 20, 2007) SAN JOSE, CA — North America-based semiconductor equipment manufacturers posted $1.42B in orders and billings in March, generating an even book-to-bill of 1.00, according to SEMI's monthly book-to-bill report. Bookings improved slightly while billings remained at February levels. The book-to-bill had dropped slightly below parity in February at 0.98.

Gartner Forecasts Lower Revenue in 2007

Thu, 4 Apr 2007
(April 19, 2007) STAMFORD, CT — Gartner published a Dataquest Insight report predicting a 3% decline in sales revenues for semiconductor capital equipment in 2007. The research firm indicates that growth will begin in 2008, slow in 2009, and pick up again in 2010. Consumer spending, investments, and inventory control will dictate the semiconductor markets.

Major MEMS Manufacturers Dominate Market Share

Thu, 4 Apr 2007
(April 19, 2007) LYON, France — Yole Développement compiled a list of major MEMS manufacturers globally, market drivers, and industry shifts in "Analysis: Top 30 MEMS Manufacturers." The top 30 represent 88% of the total MEMS industry, with $5.2B in 2006 sales. Minimum sales in the top ranking grew to $26 million, up from $15 million in 2005. Yole noted that military MEMS business is difficult to track, and may represent a larger portion of the industry than predicted.

IEEE Recognizes Fraunhofer's Reichl

Wed, 4 Apr 2007
(April 18, 2007) BERLIN — The IEEE components, packaging, and manufacturing technology (CPMT) society — an international forum for scientists and engineers in microsystems packaging design and manufacture R&D and development — named professor Herbert Reichl, director of Fraunhofer IZM, recipient of its electronics manufacturing technology award.

Tronics Expands MEMS Capabilities

Wed, 4 Apr 2007
(April 18, 2007) CROLLES, France — Tronics Microsystems SA expanded its characterization, assembly, packaging, and testing capabilities with additional space and tools. The expansion will support design-to-manufacturing services, and support its MEMS device supply chain.

SEMI Lowers Early 2007 Book-to-Bill Estimates

Wed, 4 Apr 2007
(April 18, 2007) SAN JOSE, CA — SEMI released corrections to its January and February book-to-bill estimates for the North America semiconductor equipment manufacturing industry, lowering the ratios to 1.00 and 0.98, respectively. SEMI blames a data-input error for the incorrect averages initially reported.

Tessera Interconnect Platform Targets Limitations

Tue, 4 Apr 2007
By Françoise von Trapp, managing editor

Tessera Technologies, Inc., launched an interconnection platform intended to address technical limitations of current-generation packaging technologies, such as pitch, profile, performance, reliability, and test capacity. The company expects this technology to become a fundamental building block of next-generation mobile, computing, and consumer electronic products.

Thermal-focused Packages Debut

Tue, 4 Apr 2007
(April 18, 2007) SAN DIEGO — StratEdge released "Power Packages," a package series that incorporates beryllium oxide (BeO) ceramic and a copper-composite base to provide thermal management for high-frequency, high-power chips. Package construction directly affects chip performance, said Jerry Carter, senior applications engineer, adding that the series is constructed for design engineers considering performance and reliability of their chips.

IP Piracy

Tue, 4 Apr 2007
By Meredith Courtemanche, assistant editor

Central to the outsourcing debate is the issue of protection for intellectual property (IP). The U.S. plans to bring copyright and IP violation charges against China to the WTO, highlighting the struggle between industry groups and the outsourcing strategies that maintain the electronics industry.

SolVision Inspects Flip Chip Substrates

Tue, 4 Apr 2007
(April 17, 2007) BOUCHERVILLE, Quebec — SolVision installed a Nano 3D SX bump metrology system at a flip chip substrate manufacturer based in Japan. The repeat order resulted from the machine's flexibility, support for lead-free bumps, and multi-die-substrate capabilities, said Jean-Lévy Beaudoin, product manager, substrate inspection, SolVision. The machine will be used for flip chip substrate inspection.

Asymtek Presents Coating and Dispensing Workshop

Fri, 4 Apr 2007
(April 13, 2007) Carlsbad, CA —Asymtek, a Nordson company, is sponsoring a conformal coating and jet dispensing workshop on Thursday, May 3 at the Doubletree Hotel in Orlando, FL. The workshop will focus on electronics assembly for military and industrial applications and will feature speakers from Dymax, Henkel, Humiseal, Lockheed Martin, and Asymtek.

Antares Co-brands Gryphics Socket

Thu, 4 Apr 2007
(April 12, 2007) VANCOUVER, WA; PLYMOUTH, MN; and BEAVERTON, OR — Antares Advanced Test Technologies and Gryphics, Inc., wholly owned subsidiary of Cascade Microtech, Inc., partnered for sales, distribution, and service on Gryphics' LQFN test-socket product line. Antares will rename the sockets "Kalypso," and provide global distribution and service.

LED Output Increases with 100-mm Dicing

Thu, 4 Apr 2007
(April 12, 2007) MANCHESTER, NH — A 100-mm sapphire wafer-dicing capability, developed on J.P. Sercel Associates' IX-200 Chromadice DPSS UV laser wafer-singulation system, reportedly increases LED yields by processing larger sapphire wafers than prior methods.

EoPlex Achieves 'Cool Vendor' Status

Wed, 4 Apr 2007
(April 11, 2007) REDWOOD CITY, CA — EoPlex Technologies has been named a "Cool Vendor" by Gartner, Inc. as part of the research company's 2007 report "Cool Vendors in Semiconductors, 2007". Gartner defines a Cool Vendor as a company that offers technologies or solutions that are innovative, impactful, and intriguing; having caught Gartner's interest or curiosity in the past six months.

Didier Andre To Lead European Operations for NEXX Systems

Wed, 4 Apr 2007
(April 11, 2007) BILLERICA, MA — NEXX Systems, a provider of processing equipment for advanced wafer-level packaging applications, has named Didier Andre as Director of European Customer Operations. Andre will work closely with NEXX's distributor, TELTEC, to strengthen NEXX's position with existing customers and to establish new opportunities in Europe.

Discera, Tyco Qualify MOS1 for Military

Tue, 4 Apr 2007
(April 10, 2007) SAN JOSE, CA — Tyco Electronics' M/A-COM division, which provides wireless RF, microwave, and millimeter-wave components and systems, qualified Discera, Inc., MEMS-based oscillators, MOS1, for use in telemetry transmitters. Component volumes and delivery times are still to be determined, said Venkat Bahl of Discera.

Johnson Recognized with TEEM Award

Tue, 4 Apr 2007
(April 10, 2007) DEARBORN, MI — The Society of Manufacturing Engineers (SME) electronics manufacturing tech group honored professor R. Wayne Johnson with the 2007 Total Excellence in Electronics Manufacturing (TEEM) award, in recognition of dedication and innovation in electronics manufacturing.

Materials Upgrade for Test Sockets

Mon, 4 Apr 2007
(April 9, 2007) CHANDLER, AZ and LIBERTYVILLE, IL — Piper Plastics, Inc., a plastics-parts machining company, is producing test socket components from EPM-2204U-W: a proprietary grade, based on VICTREX PEEK polymer, that resists moisture absorption and suits tight pitch and fine-diameter holes. The plastic components offer advantages over ceramics and other polymers, according to Dave Wilkinson, materials engineering manager.

Invetech Automates Thin-foil Capacitor Production

Mon, 4 Apr 2007
(April 9, 2007) SAN FRANCISCO — Invetech completed a commercialization project developing high-volume, low-cost processes for prismatic supercapacitor manufacturing. CAP-XX (Sydney, Australia) partnered with Invetech for product development and manufacturing technologies to commercialize the proprietary power-storage devices in mobile telecom, medical, automotive, and industrial markets.

Cohu Unit Acquires Component Manufacturer

Fri, 4 Apr 2007
(April 6, 2007) POWAY, CA — Broadcast Microwave Services, Inc. (BMS), subsidiary of Cohu, Inc., purchased Tandberg Televisions AVS GmbH (AVS) for about $8.3 million cash. Cohu supplies test handling, burn-in, and thermal solutions for semiconductor, microwave, and closed-circuit-television equipment markets.

Gartner Finalizes 2006 Figures

Thu, 6 Jun 2007
(June 28, 2007) STAMFORD, CT — Gartner, Inc., finalized figures for the global semiconductor assembly and test services (SATS) market in 2006, indicating 26.5% growth, about 1% higher than previously indicated. This marks the fifth consecutive year this sector has exhibited double-digit growth. Revenues totaled $19.2 billion for the SATS industry.

SPP Adds to MEMS Equipment Holdings

Thu, 6 Jun 2007
(June 28, 2007) AMAGASAKI, Japan — Sumitomo Precision Products Co. Ltd. (SPP) completed its acquisition of Primaxx, Inc., adding MEMS etch-release equipment to its businesses. SPP holds majority stake in Surface Technology Systems plc (STS) and considers Primaxx equipment complementary to STS's advanced deep silicon etch and deposition technologies. Primaxx plans to develop its MEMS business under SPP, as well as venturing into related fields, such as wafer-surface modification.

Taiwan Approves Packaging in China

Thu, 6 Jun 2007
(June 28, 2007) TAIPEI, Taiwan — Taiwan's government approved plans for four domestic packaging-and-test firms to invest in mainland China operations, relaxing restrictions on advanced technology outsourcing and investment in China. Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Greatek Electronics, and Walton Advanced Engineering received approval to operate packaging houses or invest in China subsidiaries.

Equity Group Proposes UTAC Acquisition

Wed, 6 Jun 2007
(June 27, 2007) SINGAPORE — United Test and Assembly Center Ltd. (UTAC) confirmed that Affinity Equity Partners and TPG Capital, under a combined umbrella company, Global A&T Electronics, would acquire all issued ordinary shares in UTAC for up to $0.71–0.77/share in cash. The purchase is valued at about $2.2 billion.

Analysts Probe RF Developments, End Markets

Wed, 6 Jun 2007
(June 27, 2007) LYONS, France and CAMBRIDGE, U.K. — Yole Développement will release a report on the RF MEMS switches market in July, outlining market potential in defense, industrial, automotive, and telecom applications. The report is in-line with forecasts by IDTechEx regarding end markets for RFID components, including medical, defense/aerospace/military, and telecom.

iSuppli: 2007 Outlook Dims, 2008 Steady

Tue, 6 Jun 2007
(June 26, 2007) EL SEGUNDO, CA — In the industry's latest bearish move, research firm iSuppli Corp. has tweaked its outlook for 2007 downward again, though the firm expects chip sales "will gain momentum throughout 2007 following the first-quarter trough."

JPSA Adds Quality, Applications Staff

Tue, 6 Jun 2007
(June 26, 2007) MANCHESTER, NH — J P Sercel Associates (JPSA) appointed Joseph Brun as quality assurance manager and Ji Fu, Ph.D., as laser applications engineer.

Elmos Transfers IC Assembly to AIT

Mon, 6 Jun 2007
(June 25, 2007) SINGAPORE — Advanced Interconnect Technologies (AIT) signed a multi-year assembly service agreement with Elmos Semiconductor of Dortmund, Germany, wherein Elmos will transfer IC assembly and supporting equipment from Holland to an AIT facility in Batam, Indonesia. Elmos is a global mixed-signal ASIC provider primarily serving automotive applications.

Spansion Awards Suppliers

Mon, 6 Jun 2007
(June 25, 2007) BROOKFIELD, CT — Flash-memory supplier Spansion recognized Wentworth Laboratories, Inc., with one of 17 "World Class Supplier Achievement Awards for 2006," based on an evaluation of supplier performance in technology, quality, cost, flexibility, and service parameters. Spansion also recognized Oerlikon Assembly Equipment with a "Spotlight Award."

DEK Adds Asia Product Support

Mon, 6 Jun 2007
(June 25, 2007) WEYMOUTH, U.K. — DEK promoted David Hayes and Leon Lee to product support positions in Asia, aiding in R&D, region-specific product development, and opening a service control center in Shenzhen, China. Hayes was named product support manager; Lee will become Asia product manager.

Collaborative Focus on MEMS Forecasts

Fri, 6 Jun 2007
(June 22, 2007) LYON, France and OTTAWA — Chipworks and Yole Développement signed an agreement to collaborate on in-depth business and technical analysis for the MEMS industry. Chipworks, which provides reverse engineering and technical analysis of semiconductors and microelectronic systems, will supplement Yole's market research and business development data.

MagnaChip Implements Circuit under Pad

Thu, 6 Jun 2007
(June 21, 2007) SEOUL, South Korea — MagnaChip Semiconductor Ltd. has applied circuit under pad (CUP) technology to its foundry business processes for image sensor, mixed-signal, and digital multimedia components. CUP places the I/O circuit on the unused area of a chip, under the pad, and can reduce semiconductor sizes without reducing I/O count.

Book-to-Bill Steady in May

Wed, 6 Jun 2007
(June 21, 2007) SAN JOSE, CA — North America-based semiconductor equipment manufacturers posted $1.67 billion in bookings and billings in May, based on a three-month average, bringing the book-to-bill to 1.00 for the month, according to SEMI's report. Values in both segments are up from May of 2006 and from April 2007.

SW Test: The Place to Be for Die- and Wafer-level Testing

Tue, 6 Jun 2007
By Terence Q. Collier, contributing editor

If you want to know the latest and greatest on how to test complete packages, the BiTS Workshop provides an opportunity to interact with peers, suppliers, and other renegades. However, if die- and wafer-level testing is your niche, the complementary equivalent is an exciting show held annually at Paradise Point (yes, it is as great as it sounds) in San Diego: IEEE's SWTest Workshop, held June 3–6, 2007.

Freescale Names CTO

Tue, 6 Jun 2007
(June 19, 2007) AUSTIN, TX — Freescale Semiconductor named Lisa Su, Ph.D., as senior vice president and chief technology officer (CTO), leading the company's global technical R&D activities. Su served previously as VP of semiconductor R&D at IBM, and received her electrical engineering education at Massachusetts Institute of Technology (MIT).

Database Targets MEMS Manufacturability

Tue, 6 Jun 2007
(June 19, 2007) MATERIALS PARK, OH — ASM International released its MEMS Materials Database: Packaging Module, a licensed database containing mechanical, physical, processing, and component data for materials selection in MEMS packaging. The database targets improvements to time-to-market, reliability, and design and manufacturing of MEMS devices.

XSiL Completes Expansion

Tue, 6 Jun 2007
(June 20, 2007) DUBLIN, Ireland — Laser system provider XSiL completed a relocation and renovation project, moving its headquarters to a larger, more modern facility in Dublin's Sandyford enterprise center.

Tradeshow Preview: SEMICON West

Tue, 6 Jun 2007
Our series of product and event previews leading up to SEMICON West 2007, July 16–20 in San Francisco, continues with summaries of exhibits from Micro Control Company, Hyphenated Systems, Siemens, Ultratech, DfR Solutions, JPSA, Synopsys, and more.

IMAPS, China Electronics Packaging Society Collaborate

Tue, 6 Jun 2007
(June 19, 2007) WASHINGTON — A Memorandum of Cooperation — developed during a visit in China between Jim Drehle, first past president, IMAPS; Steve Adamson, president elect, IMAPS; and professor BI Keyun, president of China Electronics Packaging Society (CEPS) and China Institute of Electronics (CIE) — will enable the societies to develop relationships in technical participation and international chapters.

Laurier Joins Datacon Group

Mon, 6 Jun 2007
(June 18, 2007) LONDONDERRY, NH — BESI will consolidate its Laurier division into the Datacon Technology GmbH die-attach equipment division, integrating sales, customer support, and manufacturing and product management. The reorganization is based on complementary product lines and markets, said Helmut Rutterschmidt, president and CEO, Datacon.

To Short or Not to Short
Power Supply Shorting in Packaging, Part II

Mon, 6 Jun 2007
By Javier DeLaCruz, eSilicon Corp.

Part I of this article discussed noise sources in packages, supply collapse and bounce, and return paths. Part II covers more on return paths, noise ripple, resonances, differential signals, thermal benefits, and the exceptions to the rule.

Chip Suppliers Increase Packaging Orders

Mon, 6 Jun 2007
(June 18, 2007) TAIPEI, Taiwan — Suppliers of graphics chips, mobile phone components, LCD driver ICs, and memory modules are driving business growth at packaging houses in Taiwan, according to CENS. Capacity utilization at Taiwan-based SATS providers is reported to be in the 90% range, up from forecasts of 80–90% earlier in 2007. CENS suggests that the increase in packaging capacity will create an increase in demand for substrates and contact probes at Taiwan-based assemblers.

IEEE Awards Packaging Professionals

Fri, 6 Jun 2007
(June 15, 2007) PISCATAWAY, NJ — During the Electronic Components and Technology Conference in Reno, NV, the IEEE presented Dimitry Grabbe; Rao R. Tummala; Philip Garrou, Ph.D.; Chin C. Lee, Ph.D.; Herbert Reichl, Ph.D.; and Myung Jin Yim, Ph.D., its technical awards for contributions to components, packaging and electronics manufacturing technology.

Dense CNTs Viable 3D Interconnects

Thu, 6 Jun 2007
(June 14, 2007) TROY, NY — As part of research designed to manufacture carbon nanotubes (CNTs) as viable replacements for copper in 3D die-stacking applications, researchers at Rensselaer Polytechnic Institute have implemented a method for compacting CNTs into bundles, enabling better thermal and electrical conductivity. Densification occurs post-growth, allowing scientists to use a known, conventional CNT growth process. CNT density was increased 5–25× in the experiments.

Test Enterprises Expands in Asia

Thu, 6 Jun 2007
(June 14, 2007) SUNNYVALE, CA — Test-equipment supplier Test Enterprises expanded its sales and support throughout Asia by opening TEST Inc. Asia, a wholly owned subsidiary dedicated to direct sales and service support for the group of Test Enterprises companies. These include Thermonics Inc., with a line of precision temperature forcing systems; and FETtest, with discrete and analog/mixed signal semiconductor test systems.

STATS Transfers Out Discrete Power Packages

Tue, 6 Jun 2007
(June 12, 2007) SINGAPORE — As part of a long-term portfolio refocusing onto advanced products, STATS ChipPAC Ltd. signed a definitive agreement to sell select manufacturing assets to Ningbo Mingxin Microelectronics, a high-volume manufacturer that caters to the power semiconductor market. Divesting assembly and test assets for discrete-power-package manufacture will allow STATS to concentrate resources on high-growth, advanced packages, noted Tan Lay Koon, president and CEO, STATS.

Toshiba Touts 3D Memory

Tue, 6 Jun 2007
(June 12, 2007) TOKYO — Presenting at the VLSI Symposium this week in Japan, Toshiba says it has developed a 3D memory cell array structure using through-silicon vias (TSVs) that could be a potential candidate for higher-density NAND flash devices.

Tessera Introduces Wafer-level Camera Technology

Mon, 6 Jun 2007
By Françoise von Trapp, managing editor

(June 11, 2007) SAN JOSE, CA — Moore's Law is about to be tested — again. Tessera Technologies added to its wafer-level technology portfolio with the unveiling of the OptiML WLC, a wafer-level camera technology that will reportedly advance the integration of miniaturized cameras in cell phones, personal computers, security cameras, and other electronics.

Synova, Disco Co-develop Hybrid Dicing Tool

Mon, 6 Jun 2007
(June 11, 2007) LAUSANNE, Switzerland and MUNICH, Germany — Synova and Disco Hi-Tec Europe will partner to develop a hybrid dicing tool that uses both Synova's Laser Microjet (LMJ) water-jet-guided laser technology and the latest-generation blade-saw dicing systems for advanced dicing applications. The resulting tool is expected to allow semiconductor manufacturers to achieve a high throughput while minimizing damage to silicon and advanced-material wafers of any thickness.

Amkor Exec Keynotes IWLPC

Fri, 6 Jun 2007
(June 8, 2007) SAN JOSE, CA and CHANDLER, AZ — Oleg Khaykin, chief operation officer (COO) and executive VP of Amkor Technology, Inc., will keynote the International Wafer-level Packaging Conference (IWLPC), September 17–19 in San Jose. The event, co-sponsored by the SMTA, also hosts workshops, panels, and technical presentations.

Webinar Spotlights Printing Flip Chip Bumps

Thu, 6 Jun 2007
(June 7, 2007) FRANKLIN, MA — Speedline Technologies will host a webinar July 19, 2007, at 11am EST, focused on the parameters and challenges of stencil printing solder paste to form bumps in flip chip applications. The Webinar will provide process optimization advice and defect examples.

Untangling CNT Interconnect Issues

Tue, 6 Jun 2007
(June 5, 2007) SAN DIEGO — Since carbon nanotubes (CNTs) tend to grow with erratic kinks and bends in the tube structure, a group of engineers from Stanford University has devised circuit-simulation algorithms that eliminate bad connections caused by errant CNTs. The work, which involves fine grids rather that direct interconnects, is being presented at the Design Automation Conference (DAC), June 4–8 in San Diego.

Digi-Key to Distribute ISSI

Tue, 6 Jun 2007
(June 6, 2007) THIEF RIVER FALLS, MN and SAN JOSE, CA — Electronic component distributor Digi-Key Corporation and memory provider Integrated Silicon Solution, Inc. (ISSI) signed a global distribution agreement, wherein Digi-Key will distribute ISSI EEPROM chips, SDRAM, and SRAM components in various package form factors and memory capacities.

Flash Advancing in Media Industry

Tue, 6 Jun 2007
(June 6, 2007) EL SEGUNDO, CA — Flash memory will become a large factor in the portable media player (PMP) market by 2011, reports analyst firm iSuppli. Flash is expected to grow 25× in this sector by 2011, bringing the quantity of flash-equipped PMPs to 150.2 million units. In 2007, shipments of PMPs with flash components will reach 54.8 million units. iSuppli predicts NAND packages will replace HDDs, based on storage capacity requirements for video as well as audio output.

To Short or Not to Short:
Power Supply Shorting in Packaging, Part I

Mon, 6 Jun 2007
By Javier DeLaCruz, eSilicon Corp.

There are several notions that govern when to short power supplies in a package together. Many of these are driven by incorrect "rules of thumb," instead of a clear understanding of possible ramifications. Some IP providers also give misleading instructions with respect to supply shorts. The following guidelines for when to short supplies in a package and how to handle signal routing with these options offer practical solutions.

Micro-tech R&D Facility Installs EVG Mask Aligner

Mon, 6 Jun 2007
(June 1, 2007) ST. FLORIAN, Austria and LYNGBY, Denmark — EV Group (St. Florian) installed an EVG620 precision mask and bond aligner system at repeat-customer Danish Advanced Nanotech Center for Highly Integrated Production (DANCHIP) facilities at the Technical University of Denmark (DTU — Lyngby). The machine will be used for research, education, prototyping, and small-scale production of micro- and nanotechnology.

Nextreme Names Business Development VP

Mon, 6 Jun 2007
(June 4, 2007) RESEARCH TRIANGLE PARK, N.C. — Nextreme appointed Paul A. Magill, Ph.D., as VP of marketing and business development, citing his entrepreneurial experience and background in electronics packaging and thermal management. Magill has founded several companies, such as Unitive and Avo Photonics.

SST ConFab Examines:
The New Rules for Packaging Strategies

Mon, 6 Jun 2007
By Bob Haavind, editorial director, Solid State Technology

At sister publication Solid State Technology's (SST) ConFab conference, a panel titled "Think Outside the Fab," chaired by James Doyle, VP, packaging and supply chain at IBM, explored the dramatic shifts that are reshaping packaging strategies at all chipmakers.

Hermetic Microelectronics Packages

Tue, 5 May 2007
Highly engineered, the CPS hermetic package is made from Kovar, aluminum (Al), steel, and other materials. It suits military, satellite, and aerospace end products.

Fiber-based Laser Platform

Tue, 5 May 2007
The fiber-based picosecond UV laser, developed with proprietary diode laser technology, fiber coupling, and frequency conversions, produces 12-W output power at a 355-nm wavelength. It enables scribing and other processing steps on dielectric, glass, and semiconductor materials.

Plastic Hermetic Package

Tue, 5 May 2007
HermeTech, a hermetic plastic package that meets JEDEC standards, combines Quantech materials with the UltraSeal ultrasonic lid process to offer adjustable properties, low moisture permeability, and high temperature stability.

Die Sorter Platform

Tue, 5 May 2007
A high-speed system for tape-reel processing, the CS1250 sorter packages wafer-level chip-scale packages, flip chips, and other devices from wafer to tape reel. Four inspection points — pre-pick, post-flip, in-pocket, and post-seal — examine bump size, shape, and array; edge chip; laser mark; position and flatness in pocket; and other parameters.

Next-generation Wafer Bonder

Tue, 5 May 2007
With a new design platform and attention to uniformity, the ELAN CB8 wafer bonder suits emerging technologies such as MEMS and 3D interconnects, as well as high-volume wafer-bonding applications.

Digital Underfill Dispenser

Tue, 5 May 2007
The DX-350 series of digital dispensers/controllers target precise fluid volumes with accuracy and repeatability for solder paste or underfill dispensing. The DX-350, with operating pressure between 0 and 100 psi, controls variation in pneumatic dispense valves and suits a range of fluid viscosities. The DX-355 dispenses low-viscosity fluids, with an operating pressure of 0–15 psi.

Adhesive for Flip Chip BGAs

Tue, 5 May 2007
The DA-6534 one-part, high-performance thermal adhesive uses silver filler with a silicone-based chemistry to offer flexibility, reliability, and thermal conductivity. It targets thermal management packaging for flip chip BGAs and other advanced components.

WLP Photoresist Descuming with Plasma Treatment

Mon, 2 Feb 2007

By Scott D. Szymanski, March Plasma Systems

Commercially available plasma treatment systems can be used for a variety of wafer-level packaging (WLP) process steps including removal of photoresist residue after development (i.e. descum); organic, metal, and oxide contamination removal; wafer surface cleaning; and other processes. Through various alterations to the plasma chemistry or chamber configurations, these systems meet demanding WLP processing requirements.


Joint Venture Developing in Suzhou

Fri, 2 Feb 2007
(February 2, 2007) EINDHOVEN, the Netherlands and TAIPEI, Taiwan — NXP Semiconductors, founded by Philips Semiconductors, and Advanced Semiconductor Engineering, Inc. (ASE), signed a memorandum of understanding to form a joint venture in Suzhou, China, focused on packaging and test.

Tessera to Acquire Eyesquad

Fri, 2 Feb 2007
(February 2, 2007) SAN JOSE, CA — Tessera Technologies Inc. signed a definitive agreement to acquire Eyesquad, a Tel-Aviv, Israel-based development and design company for digital auto-focus and optical zoom solutions in camera phones and other electronic applications. Tessera is building an integrated consumer optics module solution through acquisitions of Shellcase Ltd., Digital Optics Corporation, and Eyesquad.

XJTAG Implements Global Plan

Thu, 2 Feb 2007
(February 1, 2007) CAMBRIDGE, U.K. — XJTAG appointed eight distributors to expand representation outside of England, which is the first phase of a strategy to ramp sales in the global market. The distributors cover 21 countries across Europe, the Far East, Australasia, North America, and the Middle East.

ASIC, Power Designs Intro at DesignCon

Thu, 2 Feb 2007
(February 1, 2007) SANTA CLARA, CA — DesignCon, held January 29–February 1, 2007, in Santa Clara, highlighted several products and services introduced to advance the packaging industry. The show also hosted the DesignVision awards and a two-day business forum, and closes with half-day technical programs.

RFID Production Laser

Tue, 1 Jan 2007
The ProtoLaser 200 laser system reportedly accelerates the production of prototype RFID antennae and small-batch prototypes. It replaces chemical and mechanical production methods, structuring circuits on substrates such as aluminum, copper-coated PET films, and others.

Preassembled Pistons for Dispense Systems

Tue, 1 Jan 2007
A next-generation line of preassembled pistons for potting and encapsulant dispensing systems features improved air venting. The design improvement allows for more efficient, clean use of cartridges.

Cleanroom Dispense System

Tue, 1 Jan 2007
The Axiom X-1000 series dispensing system, with a stainless steel enclosure, targets manufacturing applications in Class 100 cleanrooms, such as wafer-level packaging (WLP) and others sensitive to contamination by sub-micron sized particles.

Software Upgrade

Thu, 1 Jan 2007
For use with Medalist 5DX automated X-ray inspection (AXI) systems, Agilent's version 8.4 software includes new algorithms and an additional inspection threshold.

Memory Test System

Tue, 1 Jan 2007
The T5761/T5761ES, for NAND flash memory wafer- and package-level test, was created to address efficiency and cost issues with testing NAND components in consumer devices, such as digital cameras.

Nano-silver Powder

Tue, 1 Jan 2007
Designed for cost-efficient performance and high-volume applications, the Nano Silver 7000-95 powder suits radio frequency identification (RFID), flexible displays, and printed flexible circuits.

Laser-based Materials Processing

Tue, 1 Jan 2007
The IX-70 ChromAblate on-target inspection and short-deletion system is said to deliver high precision and power in a small footprint. The laser-based materials-processing system has a compact benchtop configuration.

SEZ Taps Korean Market

Wed, 1 Jan 2007
(January 31, 2007) SEOUL, South Korea and VILLACH, Austria — A major Korean semiconductor manufacturer placed an order with the SEZ Group for Da Vinci systems, to be used for back-end-of-line (BEOL) polymer removal. The four systems will perform aluminum/copper polymer cleans on 300- and 200-nm DRAM memory devices with sub-90-nm process technologies.

Dage's Bernard to Staff APEX Process Clinic

Wed, 1 Jan 2007
(January 31, 2007) FREMONT, CA — David Bernard, Ph.D., product manager of X-ray systems at Dage Precision Industries, will staff the Process Advice and Defect Clinic held during IPC Printed Circuits Expo/APEX/Designers Summit, February 20–22 in Los Angeles.

Canada Steps Up Presence at Photonics West

Tue, 1 Jan 2007
(January 30, 2007) OTTAWA — Ottawa-based companies, researchers, and scientists formed part of a Canadian delegation to Photonics West, held January 23–25, 2007, in San Jose, CA. The Canadian Photonics Pavilion represented the first booth dedicated to Canadian exhibitors in the show's history. Photonics West is a global platform, said Greg Bell, VP of marketing at Lumenera Corporation in Ottawa.

Transistor Technology Claims Low Leakage

Tue, 1 Jan 2007
(January 30, 2007) SANTA CLARA, CA — Intel Corporation is using new materials to build insulating walls and switching gates to enable 45-nm transistor technology. The hafnium-based high-k gate dielectric and metal-composite transistor gate electrode will be incorporated into a product family codenamed Penryn.

AMI Ramps Production with AIT SiP

Mon, 1 Jan 2007
(January 29, 2007) SINGAPORE — AMI Semiconductor is in full production mode with Advanced Interconnect Technologies (AIT) stacked-die quad flat package no leads (QFN) modules. AMI will incorporate the packages into several consumer electronics applications. The QFN-MCM product uses a pyramid formation of stacked, wire-bonded die in a system-in-package (SiP), explained Chris Stai of AIT.

High-k Technology Shrinks Transistor Size

Mon, 1 Jan 2007
(January 29, 2007) YORKTOWN, HEIGHTS, NY — IBM is in the development stage with 45-nm transistor technology that uses high-k gate dielectric and a proprietary metal composite for the transistor gate electrode. Constructing the transistor with conventional methods, such as high-temperature annealing, is a familiar process that gives engineers more control and reduces the possibility of error, said Ghavam Shahidi, director of silicon technology.

EU Approves Acquisition for H.C. Starck

Fri, 1 Jan 2007
(January 26, 2007) BRUSSELS, Belgium — The EU approved a bid by Advent International and the Carlyle Group to purchase Goslar, Germany-based H.C. Starck, a MaterialScience Group subsidiary of the Bayer Group. H.C. Starck, which specializes in high-purity refractory metals and ceramics in powder and engineered parts, will likely make an initial public offering (IPO) in 3 to 5 years.

F&K Delvotec Repositions European Team

Fri, 1 Jan 2007
(January 26, 2007) OTTOBRUNN, Germany — F&K Delvotec announced two appointments within its European sales organization. Philip Homami became sales and marketing manager Europe. Effective March 1, 2007, Ralph Christoph will be account manager in European sales.

Fotofab Chooses Distributor Digi-Key

Thu, 1 Jan 2007
(January 25, 2007) THIEF RIVER FALLS, MN and CHICAGO — Digi-Key Corporation and Fotofab signed a distribution agreement wherein Digi-Key will carry Fotofab's precision metal parts, photochemical machining products, and custom items.

Military Supplier Places GaN Order

Thu, 1 Jan 2007
(January 25, 2007) GREENSBORO, NC — RF Micro Devices, Inc., received its first order for gallium nitride (GaN) power amplifier ICs produced with proprietary GaN high electron mobility transistor (HEMT) process technology. The tier-one military customer ordered RF3825 power IC broadband amplifiers, 15-W devices used in software-defined military-communications radios.

Synova Appoints North America Manager

Wed, 1 Jan 2007
(January 24, 2007) LAUSANNE, Switzerland — Synova appointed Notker Kling as general manager, overseeing operations in the company's North American micromachining centers (MMCs) in Boston and Silicon Valley.

Fraunhofer to Use STS's DRIE in Packaging Research

Wed, 1 Jan 2007
(January 24, 2007) NEWPORT, Wales, U.K. — Surface Technology Systems plc (STS) won a European Union (EU) tender from the Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM (Munich, Germany) for an MPX Pegasus system. The advanced silicon etch (ASE) system has a single process chamber with manually loaded vacuum loadlock and a carousel wafer handler for 2-4 wafers. Fraunhofer IZM will use the system in industrial R&D for packaging applications.

Consumers, Integration Dictate Future of MEMS, 3-D Packages

Wed, 1 Jan 2007
(January 24, 2007) LYON, France and PITTSBURGH — The future of MEMS and 3-D packages relies on similar factors — consumer drivers and increased integration — according to industry analysts. 3-D integration will affect MEMS and IC packaging industries, says Yole Développement's "3-D ICs." Advanced packages require acceptance from the consumer market to reach targets for technological advancement, commercialization, and sector revenues.

Nextreme Appoints Senior Technical Fellow

Tue, 1 Jan 2007
(January 23, 2007) RESEARCH TRIANGLE PARK, NC — Nextreme Thermal Solutions named Phil Deane, Ph.D., senior technology fellow, appointed to address thermal management and thermoelectric packaging issues, and to define product and packaging strategies for customers with the company's thermoelectric coolers. Thin-film thermoelectric technology represents an advancement in in-package cooling, said Deane.

Omron Expands Distribution Agreement

Mon, 1 Jan 2007
(January 22, 2007) HOOFDDROP, The Netherlands — RS Components and Omron Electronic Components Business Europe, with corporate headquarters in Japan, signed a pan-European distribution agreement. RS Components will carry a broader offering of Omron products and technologies under the extended partnership.

Blaze DFM Adds Staff and Space

Mon, 1 Jan 2007
(January 22, 2007) SUNNYVALE, CA — Blaze DFM opened a development and support center in San Diego for its electrical design for manufacture (DfM) products. The company concurrently appointed Steffen Rochel, Ph.D., as vice president of engineering. President and CEO Jacob Jacobsson remarked that the moves coincide with the company shipping initial products and initiating further development of intellectual property (IP).

Book-to-Bill Hits 1.05 in December

Fri, 1 Jan 2007
(January 19, 2007) SAN JOSE, CA — After a brief period below parity, the North American semiconductor equipment book-to-bill ratio reached 1.05 in December 2006, according to a SEMI report. The positive ratio suggests near-term growth for semiconductor-equipment manufacturing.

Endevco Appoints MEMS Business Manager

Fri, 1 Jan 2007
(January 19, 2007) SUNNYVALE, CA — Endevco Corporation, a Meggitt group company, named Jennifer MacDonell MEMS business manager, with responsibility for the MEMS research and production facility in Sunnyvale.

OTB Display Produces Hermetic OLED Packages

Thu, 1 Jan 2007
(January 18, 2007) EINDHOVEN, The Netherlands — OTB Display, a subsidiary of OTB Group BV, created a method of producing thin-film-encapsulated organic light-emitting diode (OLED) devices for commercial applications. The process of multilayer thin-film stacking eliminates clean room equipment, facilitating mass production.

EDA Consortium Identifies Sector Growth

Thu, 1 Jan 2007
(January 18, 2007) SAN JOSE, CA — The EDA Consortium's market statistics service (MSS) released estimates of electronic design automation (EDA) industry revenue growth from Q'03 2005 to Q'03 2006. The industry as a whole reached $1,309 million, up about 16% from $1,122 a year ago. Professionals in the EDA companies tracked by MSS rose 11% to 25,018 year-to-year.

HP Presents FPGA Research Using Nanowires

Thu, 1 Jan 2007
(January 18, 2007) PALO ALTO, CA — Greg Snider and Stan Williams, HP researchers, created a hybrid circuit, in simulation, that could lead to FPGAs that are up to eight times denser that current devices. The concept combines conventional CMOS technology with nanoscale switching devices in a hybrid circuit. The chips could be constructed without modifying transistor size.

Gartner Dataquest Predicts SATS, PAE Scenarios

Wed, 1 Jan 2007
(January 17, 2007) STAMFORD, CT — Gartner Dataquest released near-future predictions for the packaging industry and capital equipment market, with numbers representing an overall positive outlook through 2008.

electronica Records Positive Statistics

Tue, 1 Jan 2007
(January 16, 2007) Munich, Germany — electronica 2006 hosted approximately 78,000 attendees, with rises in international attendance and exhibiting, and leadership attendance. The trade show also used an application-specific layout to focus on individual platforms such as wireless and automotive electronics sectors.

Lloyd Doyle Signs Agency Agreement

Tue, 1 Jan 2007
(January 17, 2007) WALTON-ON-THAMES, Surrey, U.K. — Lloyd Doyle Ltd. signed an agency agreement making Sigmatek Corporation its representative in Taiwan. 2007 will be a growth year for bumped-substrate manufacturing in the region, predicts Richard Frisk, president of Lloyd Doyle.

Actel Broadens Partnerships for FPGA Design

Tue, 1 Jan 2007
(January 17, 2007) MOUNTAIN VIEW, CA — Actel Corporation expanded its partnership with Mentor Graphics Corporation (Wilsonville, OR) through a new OEM agreement and technology and marketing partnership. Actel incorporates tools from Mentor, Synplicity, and SynaptiCAD in its next-generation integrated design environment (IDE) for FPGAs.

Xradia Attains Series D Investment

Tue, 1 Jan 2007
(January 17, 2007) NEW YORK — Harris & Harris Group, in a Series D Preferred round of financing, invested $4 million in Xradia, Inc. (Concord, CA). Alexei A. Andreev, Ph.D., of Harris & Harris will join the imaging company's board of directors.

Mentor Graphics Appoints CIO

Mon, 1 Jan 2007
(January 15, 2007) WILSONVILLE, OR — Mentor Graphics named Ananthan Thandri as chief information officer (CIO). He has a background in information technology and experience in electronic-design automation.

Thermal Solutions Names CEO

Mon, 1 Jan 2007
(January 15, 2007) HAMPTON, NH — Thermal Solutions, Inc., appointed Gregory R. Tucker as CEO; he will also join the company's board of directors. Arlington Capital Partners, which invests in Thermal Solutions as a portfolio company, praised Tucker's global-operations experience, acquisition capabilities, and leadership.

Nanosys Partners with Japanese Capital Investment

Fri, 1 Jan 2007
(January 12, 2007) PALO ALTO, CA — Nanosys, Inc., entered into a multi-level collaboration with NTT DoCoMo, Inc., and wholly-owned U.S. subsidiary DoCoMo Capital, Inc. The exclusive agreement involves developing nanotechnologies for product opportunities in wireless, mobile telecommunications in Japan.

IEC Celebrates DesignVision Finalists

Thu, 1 Jan 2007
(January 11, 2007) CHICAGO — The International Engineering Consortium (IEC) announced finalists for its 2007 DesignVision Awards, chosen the 96 judges selected by EIC's Technical Program Committee.

Dage X-ray Signs U.K. Distribution Agreement

Thu, 1 Jan 2007
(January 11, 2007) DORSET, U.K. — Blakell Europlacer, Ltd., will distribute Dage X-ray products in the U.K. under a partnership agreement.

Component Orders Trend Positive

Wed, 1 Jan 2007
(January 10, 2007) ARLINGTON, VA — Orders for electronic components rose in December 2006, following a slight drop in November, according to the Electronic Components, Assemblies, & Materials Association (ECA) index. The 12-month average continued an upward trend.

SEMICON Taiwan Kicks Off

Wed, 9 Sep 2007
(September 12, 2007) TAIPEI, Taiwan — SEMICON Taiwan, September 12–14 at the Taipei World Trade Center, Taiwan, begins today with more than 700 Taiwan-based and international companies exhibiting. Following are the show highlights from DEK, Palomar Technologies, and Rudolph Technologies.

Gartner: Outsourcing Hits Packaging Sector

Wed, 9 Sep 2007
By James Montgomery, contributing editor

(September 12, 2007) DANBURY, CT — Global PAT revenues are expected to grow at half the rate in 2007 that they did in 2006, and will improve marginally in 2008, according to new data from Gartner Dataquest. A closer look inside the numbers reveals the emergence of outsourced SATS providers, poised to balloon by nearly a third over the next three years and reach equal footing with IDMs.

Emerging MEMS Manufacturers Look Beyond Auto Apps

Wed, 9 Sep 2007
(September 12, 2007) PHOENIX — The MEMS market is an attractive area to operate in, according to Semiconductor Partners, because MEMS revenue will double from $5B in 2005 to $10B in 2011. "Driving MEMS Beyond Automotive," suggests that a "select group of large, well-established MEMS suppliers" will benefit from growth in the automotive sector, while "new, emerging entrants" to the MEMS market will capitalize on opportunities in consumer, communications, and portable product sectors.

White Paper Details Urethane Potting Technology

Tue, 9 Sep 2007
(September 11, 2007) CRANSTON, RI — Epoxies Etc... released "New Urethane Technology for Potting & Encapsulation in Electronics," targeting assemblers potting components for use in harsh environments, such as aerospace, automotive, and marine industries.

Rohm and Haas Orders SUSS' Coat/Develop Cluster

Tue, 9 Sep 2007
(September 11, 2007) MUNICH, Germany — SUSS MicroTec will install the first Famma XPress coating and developing cluster tool at Rohm and Haas' photoresist manufacturing site in Nigata, Japan. Rohm and Haas will develop, characterize, and optimize photodielectrics, and thick- and thin-film photoresists on the Gamma tool.

tMt Installs Alcatel DRIE Tool for MEMS Fab

Mon, 9 Sep 2007
(September 10, 2007) TAIPEI, Taiwan — Alcatel Micro Machining Systems (Annecy, France) shipped an advanced deep reactive ion etch (DRIE) production tool to Touch Micro-system Technology (tMt — Yang-Mei, Taoyuan, Taiwan), allowing the MEMS foundry to begin producing advanced MEMS devices, including micro mirrors, silicon microphones, and gyroscopes.

Electronics Largest Nanomaterial Market Near-term

Fri, 9 Sep 2007
(September 7, 2007) CLEVELAND — Nanomaterials have established a $1B market, primarily for use in electronics production, according to "World Nanomaterials," from the Freedonia Group, Inc. The report suggests that more conventional uses — wafer-polishing slurries or reinforced plastic composites — still consume the volume of nanomaterials, but novel materials — nanotubes and dendrimers — will grow in popularity over the coming 10–20 years.

Automotive LED Manufacturer Selects Henkel Materials

Fri, 9 Sep 2007
(September 7, 2007) IRVINE, CA — Grote Industries selected a custom-formulated Hysol potting compound from Henkel to enable full automation at its 1-million-parts per year LED lamp assembly line. The compound met 19 engineering requirements for environmental friendliness, thermal conductivity, reliability, and other criteria, and will be deployed for use across 10 product families.

Cobar Group Becomes Part of Balver Zinn

Fri, 9 Sep 2007
(September 6, 2007) BALVE, Germany and BREDA, Holland — The Cobar Group BV became part of Balver Zinn with the final full transfer of ownership, following a signed Letter of Intent to merge in March 2007. Balvar Zinn Group focuses on the metallurgy of solder materials and non-ferrous metals. Cobar will lead the future development of solder paste, flux, and other related materials.

ASE, Mitsui Collaborate for Hybrid Packaging

Thu, 9 Sep 2007
(September 6, 2007) SANTA CLARA, CA — Advanced Semiconductor Engineering Inc. (ASE) and Mitsui High-tec Inc. signed a multi-year cross-licensing agreement to design and make hybrid manufacturing technologies (HMT), with each side sharing IP rights and technical expertise. The deal centers on Mitsui's HMT technology, a JEDEC/JEITA standards-conforming, copper leadframe-based area array package that offers a reportedly more flexible footprint than a multi-row QFN.

U.S. IDM Installs Olympus Wafer Inspection System

Thu, 9 Sep 2007
(September 6, 2007) SAN JOSE, CA — Olympus Integrated Technologies America (Olympus-ITA), a subsidiary of Olympus Corporation of Japan, completed sale of its Model AL3300 wafer inspection and defect review system to a U.S.-based integrated device manufacturer (IDM). The company will use the AL3300 to inspect tops, edges, and back-sides of 300-mm wafers for bad coats, hot spots, scratches, and contamination.

Qualmark Accesses Military Sector

Thu, 9 Sep 2007
(September 6, 2007) DENVER — Ling Electronics (West Haven, CT), wholly owned subsidiary of Qualmark Corporation, received military orders for electro-dynamic testing equipment, totaling more than $300,000. Ling will install the systems at a test facility serving the U.S. military and the Department of Defense (DoD), along with military-certified suppliers.

Antares Presents Spring-pin Test at KGD

Thu, 9 Sep 2007
(September 6, 2007) SANTA CLARA, CA and VANCOUVER, WA — Antares Advanced Test Technologies will detail wafer-level testing possibilities with small-pitch spring pins at the 2007 KGD Packaging & Test Workshop on September 11. The workshop will take place September 9–12 in Napa, CA.

DEK, BTU Partner in Photovoltaics

Wed, 9 Sep 2007
(September 5, 2007) FLEMINGTON, NJ — DEK and BTU International formed a strategic partnership to combine skill sets and global footprints in the photovoltaic manufacturing sector. The combined screen printing and drying systems offering will meet cost, throughput, and reliability requirements to bring solar-cell manufacturing to a commercially viable level, according to company representatives.

Hynix Stacks 24 Chips

Wed, 9 Sep 2007
(September 5, 2007) SEOUL, South Korea — Hynix Semiconductor reportedly developed a multichip package (MCP) with 24 stacked NAND flash memory chips, improving on its existing design, according to Korea Times.

MEMS Show Travels to Europe

Tue, 9 Sep 2007
(September 4, 2007) MUNICH, Germany — SUSS MicroTec and Surface Technology Systems (STS) will bring their "MEMS Technology: Embracing the Future" Roadshow to Europe in September, following a five-city tour in the U.S. this April. The Roadshow event features presentations from SUSS, STS, Primaxx, and XACTIX, covering trends in wafer bonding, wafer-level test, and other manufacturing steps.

Semi Dice Named IRC Distributor

Tue, 9 Sep 2007
(September 5, 2007) CORPUS CHRISTI, TX — IRC Advanced Film, a business of TT electronics, franchised Semi Dice (Los Alamitos, CA) as a global distributor for wire-bondable products. Semi Dice offered the component manufacturer a partner experienced in bare die and the semiconductor industry, said Steve Wade, director, sales and marketing, IRC.

Plasma, Thermal Partnership Yields Combined Equipment

Tue, 9 Sep 2007
(September 5, 2007) PFAFFENHOFEN, Germany — UniTemp GmbH, in partnership with plasma-finish GmbH, developed a semiconductor processing and packaging system that combines plasma and thermal applications. The resulting plasma-temperature processing oven, Model PTP, features a compact chamber and fast ramp rates.

Alcatel Supplies Next-gen DRIE for STMicro

Tue, 9 Sep 2007
(September 5, 2007) ANNECY, France — STMicroelectronics SAS (Tours, France), a division of STMicroelectronics NV Group, ordered the AMS 4200 DRIE production tool from Alcatel Micro Machining Systems. STMicro will use the tool for deeper advanced etching to realize 3D semiconductors and integrated MEMS packages.

Cohu Selects CFO

Tue, 9 Sep 2007
(September 4, 2007) POWAY, CA — Cohu Inc. named Jeffrey D. Jones as VP of finance and chief financial officer (CFO), succeeding John H. Allen. Allen will retire in November. Jones previously served with Delta Design, Inc., wholly owned subsidiary of Cohu.

Silver-filled Epoxy Resin
Epoxies, Etc...

Tue, 9 Sep 2007
A two-component epoxy adhesive, 40-3900 is filled with pure, non-alloyed silver in the resin and hardener. It is electrically conductive with electrical resistivity of less than 1 × 10-4 Ω/cm.

Thin-film Epoxy
Master Bond

Tue, 9 Sep 2007
A low-viscosity transparent epoxy, Master Bond EP30-4 cures to components and various substrates without external heat. It forms a 0.025" or thicker film for conformal coating, potting, adhesive, and sealant uses. The two-component product can be spray or flow dispensed.

Flip Chip Adhesive

Tue, 7 Jul 2007
For use in flip chip packaging, EA-6800 and 6900 adhesives are designed for lead-free processing temperatures and fast cure times, respectively. Each adhesive reduces voiding from residual moisture within substrates.

AlSiC Heat Spreader for SiP

Tue, 7 Jul 2007
RoHS compliant, aluminum silicon carbide (AlSiC) metal-matrix composite lids target system-in-package (SiP) applications. The heat spreaders are said to reduce bowing and flexing with a low coefficient of thermal expansion (CTE) between die and packaging.

Thin-wafer Handling System

Tue, 7 Jul 2007
A polymeric spin-on coating, WaferBOND HT-250, temporarily attaches device substrates to a carrier substrate, enabling wafer thinning and subsequent processing. It will reportedly permit advanced packaging processes such as the creation of through-silicon vias (TSVs), 3D stacking, and other etching, plating, and follow-on processes.

Scientific-grade Imaging

Tue, 7 Jul 2007
A camera and detector combination, Impix, improves range, accuracy, repeatability, and feature recognition of the Revolution Nanotech X-ray inspection system. It also augments the system's computerized tomography (CT) inspection.

Low-temp Potting Compound

Tue, 7 Jul 2007
The 20-2300 series of urethane potting compounds, targeting electronic assemblies exposed to extremely low temperatures or wet environments, reportedly maintains flexibility and softness at -40°C and above.

Heated Chuck

Tue, 7 Jul 2007
The HPR-90 heated work holder suits photoresist, epoxy resin, and adhesives annealing; manual wire bonding; device heating; and other packaging processes. It offers a 90-mm heated area and 360° rotation. The heated area can be changed without moving the equipment.

Thermal Material

Tue, 7 Jul 2007
Burn-in material, a reusable thermal interface material (TIM), provides repeatable thermal performance over thousands of cycles, and offers an alternative to greases, phase change materials (PCMs), and gap pads in thermal module test applications.

SiP Ballast IC

Mon, 7 Jul 2007
A highly integrated ballast IC, the FAN7710 — targeting compact fluorescent lam (CFL) assemblies — combines a high-side 625-V gate-driver circuit, two 550-V MOSFETs, a frequency-control circuit, and a shunt regulator in an 8-DIP system-in-package (SiP).

Active Heat Spreaders

Mon, 7 Jul 2007
The CL-1000 series of heat spreaders offer a large, flat, and thin surface area to connect components and thermal interface materials (TIMs), or serve as a heat pipe or heatsink. The products are reportedly 44% lighter than pure copper and 10–15× more thermally conductive.

Simulator for Complex Packages

Mon, 7 Jul 2007
A full-wave electromagnetic field simulator for signal- and power-integrity, and electromagnetic interference (EMI) analyses, SIwave v3.5 enables modeling and simulations for complex IC packages and PCBs. It reportedly enables engineers to eliminate layout problems, and bond-wire and via EMI damages, prior to prototyping.

Light-weight Dispense Valve

Mon, 7 Jul 2007
The CV629 cartridge valve, weighing 4.8 oz, suits handheld dispensing of silicones, adhesives, and other fluids; it also can be integrated into an automated system.

Package Development Blends Emerging Technologies

Tue, 7 Jul 2007
(August 1, 2007) SANTA CLARA, CA — Promex Industries, Inc., will use Microbond's (Ontario, Canada) technologies and Mirror Semiconductor's (Irvine, CA) designs to develop advanced, complex packages. Introducing next-generation technologies requires engineering collaborations, said representatives of each company.

Henkel Opens Solder Sphere Facility

Tue, 7 Jul 2007
(July 31, 2007) YANTAI, China — The electronics group of Henkel marked the grand opening of its Yantai, China, solder sphere production facility, welcoming more than 300 guests and employees to the ceremony. This event follows the 2006 acquisition of Accurus Scientific Company Limited, a Taiwan-based solder sphere manufacturer.

News Wrap from SEMICON West

Tue, 7 Jul 2007
By Françoise von Trapp, managing editor

Following are announcements of expansion, integration, and partnerships made on the floor at SEMICON West this July. News comes from Palomar, Tessera and Alps Electronics, Besi, and Watlow.

Thin Is In:
Thin-film Thermoelectrics Tackle Heat

Tue, 7 Jul 2007
By Jesko von Windheim, Nextreme

Thermoelectric devices have been available for decades, and in that time the technology has not changed much. Thermoelectric modules based on thin-film thermoelectric materials have higher design flexibility, lower cost structure, and better performance than conventional thermoelectric solutions. Thin-film thermoelectric modules show significant promise to solve electronics and optoelectronics cooling.

BPM Appoints China Distributor

Tue, 7 Jul 2007
(July 31, 2007) HOUSTON and HONG KONG — BPM appointed Kasion Automation Ltd. (KAL), based in Hong Kong, as an authorized BPM distributor in China. KAL will manage device-programmer distribution, after-sales support, and service.

CMC Names Principal Laboratory Analyst

Fri, 7 Jul 2007
(July 27, 2007) TEMPE, AZ — CMC Interconnect Technologies promoted Erich Rubel to principal analyst. Rubel is experienced in failure analysis (FA), focused on advanced materials and electronic interconnect technologies across device, package, and board levels.

ZyCube Intros Buried Interconnects

Fri, 7 Jul 2007
(July 27, 2007) TOKYO — ZyCube Co. developed a chip-sized packaging technology, ZyCSP, for CMOS image sensors used for cell-phone cameras. ZyCube will market the technology and a line of chips it manufactures using ZyCSP globally, reports the Nikkei Business Daily.

SUSS Device Bonders Bought Out

Fri, 7 Jul 2007
(July 27, 2007) SAINT-JEOIRE, France — SUSS MicroTec France's president, Gaël Schmidt, used a management buy out (MBO) agreement to acquire SUSS MicroTec's device bonder division. He will rename the company Smart Equipment Technology (S.E.T.); S.E.T. will operate as a simplified joint stock company with about €40,000 ($55,000) capital.

Book-to-Bill Falls in June

Thu, 7 Jul 2007
(July 26, 2007) SAN JOSE, CA — The North American semiconductor equipment manufacturing book-to-bill ratio fell to 0.94 in June 2007, which the indicator hasn't approached since an October 2006 ratio of 0.95. The dip belies the fact that booking and billing amounts are trending up slightly, and hitting highs for the year, said Stanley T. Myers, president and CEO, SEMI.

STATS Acquires Thai Assembly and Test

Thu, 7 Jul 2007
(July 26, 2007) SINGAPORE — STATS ChipPAC Ltd. will acquire assembly and test operations in Pathumthani, Thailand, from LSI Corporation. For about $100 million aggregate, STATS will obtain manufacturing space, equipment, related assets, and potential contracts with LSI staff.

Gartner Predicts Tempered Expansion

Wed, 7 Jul 2007
(July 25, 2007) STAMFORD, CT — Three semiconductor manufacturing facilities, all in China, began production in the second quarter of 2007; however, generally slow growth in semiconductors will keep the packaging-and-test sector from meeting growth levels set in 2006, according to Gartner Inc.'s report "Semiconductor Packaging, Assembly, and Test Facilities: Worldwide, Q'03 2007."

Mouser to Distribute Cypress SoC and Tooling

Tue, 7 Jul 2007
(July 24, 2007) Mansfield, TX and San Jose, CA — Mouser Electronics, Inc., will globally distribute Cypress Semiconductor Corporation's family of PSoC programmable system-on-chip (SoC) products and associated development tools.

CEA Installs Alcatel Systems for TSVs

Mon, 7 Jul 2007
(July 23, 2007) GRENOBLE and ANNECY, France — Alcatel Micro Machining Systems will provide two 200-mm DRIE and LTPE CVD systems at CEO/Léti-Minatec R&D institute under a joint development agreement. The parties will collaborate to develop and demonstrate a suite of turnkey silicon microvia technologies for 3D integration at wafer and die levels.

Packaging Needs for High Temperatures and Harsh Environments

Tue, 3 Mar 2007
By Jacob Li, Vectron International

High-temperature electronics are poised to become the strategic technology of this century. Increases in worldwide demand for oil, evolving electronic needs in the automotive industry, and a resurgence of high-reliability in the military and aerospace industry are driving interest. These harsh-environment applications require electronic systems that can survive well beyond the traditional operating temperature range, in high shock and vibration.

IC Technologies for Mixed-signal and RF SiP

Tue, 3 Mar 2007
By David Cheskis, Ph.D., Jazz Semiconductor

Today's analog systems (PCS, Bluetooth, WLAN) have turned to a mixed-signal system-in-package (SiP) that requires specialty foundries providing advanced analog CMOS-based process technologies for better cost, performance, and time to market than a system-on-chip (SoC). The SiP approach also offers an alternative to challenges involved with integrating analog and digital functions into an SoC design.

Aeroflex Agrees to Francisco and General Atlantic Acquisition

Mon, 3 Mar 2007
(March 5, 2007) PLAINVIEW, NY — Aeroflex Incorporated entered into an agreement with General Atlantic and Francisco Partners wherein the private equity firms would acquire Aeroflex for approximately $1B. The deal is subject to stockholder approval and closing conditions.

GE, TOKKI Incorporating Encapsulation into OLED Manufacture

Mon, 3 Mar 2007
(March 5, 2007) NISKAYUNA, N.Y. — GE Global Research and OLED-manufacturing equipment supplier TOKKI Corporation (Tokyo) partnered to use plasma enhanced chemical vapor deposition (PECVD) film encapsulation technology and manufacturing equipment to build organic electronics, such as OLED flat panel displays, in thinner and more cost-effective packages.

Open Standard for Low-power IC Designs Approved

Fri, 3 Mar 2007
(March 2, 2007) NAPA, CA — Accellera members and directors approved the unified power format (UPF) 1.0 as an Accellera open standard, following recent approval by the company's technical subcommittee (TSC). The standard, developed and approved over five months, incorporates technologies from seven companies — EDA vendors, end customers, Accellera member companies, and others. It is specific to low-power ICs.

Synova Licenses Laser MicroJet Technology

Thu, 3 Mar 2007
(March 1, 2007) LAUSANNE, Switzerland — Synova restructured its strategic business model, allowing select partners to license proprietary Laser MicroJet technology. End users, certain equipment manufacturers, and R&D institutions will gain access to the technology via licensing agreements. "This came about in a natural way, as the fastest method to expand the technology into higher capacities and different markets," said Bernold Richerzhagen, CEO.

Technology Partnership Delivers Medical Assembly

Thu, 3 Mar 2007
(March 1, 2007) ENDICOTT, NY — Endicott Interconnect Technologies (EI) entered into a manufacturing services agreement with a intravascular ultrasound (IVUS) catheter manufacturer, due to a process development and manufacturing partnership with Unovis-Solutions. In the $3.9 million contract, EI will develop and manufacture a certain quantity of flexible substrates, and assemble flip chips to the substrates, over 2 years.

Temasek Bids for STATS ChipPAC

Thu, 3 Mar 2007
(March 1, 2007) SINGAPORE — Temasek Holdings Ltd.'s wholly owned subsidiary Singapore Technologies Semiconductors Pte Ltd. (STS) intends to launch a voluntary conditional cash offer for remaining, unowned shares in STATS ChipPAC. STS holds approximately 35.6% stake in the publicly traded packaging house.

Technical Sales Firm Announces Initial Clients

Thu, 3 Mar 2007
(March 1, 2007) SAN JOSE, CA — Danny Fields established Pacific Gate Technologies, a technical sales firm, with initial clients Minami (Tokyo), a screen printing and reflow systems manufacturer; and PTA (Penang, Malaysia), an assembly service provider. Both companies will also be represented in Japan by Yoshihiro Shimada of PacVision Corp.

Chip/Package I/O Planning Helps Shrinking Profit Margins

Wed, 3 Mar 2007
By Joel McGrath, Rio Design Automation Inc.

No one disputes the predictions and analysis that package costs are on the rise. However, minimizing layer count results in increased routing complexity on the package, and the majority of routing must take place on a single layer with little flexibility. This complexity, along with price sensitivity, is driving an emerging chip design methodology known as package-aware chip design.

Photo-etched Lead Frames
PhotoFabrication Engineering

Tue, 9 Sep 2007
Surface-mount and insert-mount, photo-etched leadframes range in thickness from 0.5 to 40 mil, with feature sizes as small as 4 mil on a 0.010 mil center. The leadframes can be reproduced in volume quantities without tooling wear.

Universal Bond Tester
Royce

Tue, 9 Sep 2007
The System 650 universal bond tester offers quick-start modules for wire-pull, tweezer-pull, ball-bond-shear, cold-ball-pull, and die-shear test. Its high-resolution motion-control system measures bond shears down to 1-µm; the system can shear die up to 200 Kgf.

Die-attach Paste and Flip Chip Underfill
Henkel

Tue, 9 Sep 2007
Hysol QMI708 targets applications with copper leadframes and small footprints. It was developed to attach 2.5- × 2.5-mm and smaller die in QFN and SOIC packages.

Analog/Mixed-signal Tester
FETtest

Tue, 9 Sep 2007
Supporting parallel test of up to 32 multisites with 96-pin analog/digital stimulus and measure, the AMX400 modular test system tests a variety of devices, including amplifiers, DC/DC converters, and power-management modules.

Non-contact Test Probe
Scanimetrics

Tue, 9 Sep 2007
Wireless test access port (Wi-TAP) technology tests semiconductors and systems-in-package (SiPs) using a micro-scale radio frequency (RF) method rather than physical connection. The wireless probes interface to automated test equipment (ATE); all antennae structures and electronic components are CMOS compliant.

Environmentally Safe Flux Remover
ZESTRON

Tue, 9 Sep 2007
An MPC Technology product, VIGON RC 101 cleans accumulated flux residues from ovens and general solder waste from wave soldering machines. The chemistry has no flash point, and removes eutectic and lead-free flux residues.

MCP Memory Test
Verigy

Tue, 9 Sep 2007
Performing quality assurance (QA), characterization, and small-lot production, the V5000ep builds on the V5000e platform with increased automation, testing and characterizing all memory types from wafer sort through final test. When testing multi-chip packages (MCPs), the system uses proprietary Matrix technology to automatically shift resources from one die to another without manual reinsertion of the device under test (DUT).

Flip Chip Metrology
Veeco

Tue, 9 Sep 2007
The Wyko SP9900 surface-profiling optical metrology tool monitors height, yield, roughness, and other parameters of multilayer organic panels for pin grid array (FC-PGA) and ball grid array (FC-BGA) flip chip packaging. It offers faster measurement, increased sample access, and up to 600 × 600 mm panel measurement within the SP equipment footprint.

Thermoplastic Molding
Victrex

Tue, 9 Sep 2007
T-series TF-60C compound, a proprietary blend of PEEK polymer, Celazole polybenzimidazole (PBI), and carbon-fiber reinforcement, can replace polyimides and metals in semiconductor and electronics assembly. TF-60C is a melt-processable thermoplastic that tolerates harsh environments up to 300°C.

FCXO for Complex Timing
Vectron

Tue, 9 Sep 2007
The C3430 frequency controlled crystal oscillator (FCXO) suits wireline and wireless infrastructure, test-and-measurement, and military applications. The component line converts one input frequency to up to four independent output frequencies.

SEMICON Europa 2007: Mobilizing European Strengths

Fri, 9 Sep 2007
STUTTGART, GERMANY— According to research conducted by SEMI, the European microelectronics market is diverse and growing. However, with the increasing migration of semiconductor and other high-tech manufacturing to Asia, many in Europe are concerned about the future of the industry in the region. This year's SEMICON Europa, October 9-11, 2007, held for the first time at the Stuttgart Trade Fair Centre, Stuttgart, Germany, will address these concerns.

Kyzen Launches Proprietary Database

Fri, 9 Sep 2007
(September 28, 2007) NASHVILLE, TN— After more than a year in development, Kyzen Corporation, provider of environmentally friendly precision cleaning products for electronics and high-tech manufacturing operations, announced that its proprietary Know the Score database is live in Kyzen's applications and R&D laboratories.

ASE Group and NXP Semiconductors Complete Joint Venture

Fri, 9 Sep 2007
(September 28, 2007) SUZHOU, CHINA— Advanced Semiconductor Engineering Incorporated (ASE), and NXP Semiconductors announced the completion of an assembly and test joint venture, ASEN, initially announced in February 2007.

iSuppli's 2007 Semiconductor Forecast Remains Optimistic

Thu, 9 Sep 2007
(September 27, 2007) EL SEGUNDO, CA— iSuppli Corp. has reduced its original revenue growth forecast for the global semiconductor industry from 6 to 3.5%, even as chip revenue is up, equipment markets are on the rise, and memory sales are improving. The research firm reportedly revised its original predictions because these stronger conditions are still insufficient to offset the impact of the first half of the year's results.

Asymtek Opens Facilty in India

Thu, 9 Sep 2007
(September 27, 2007) CARLESBAD, CA— Asymtek has opened a technical support and sales office in Chennai, India to support the area's expanding markets and offer local support to the company's existing customers. The new office is co-located with parent company Nordson Corporation, and provides on-site equipment service, training, and applications assistance.

FlipChip International Names VP Sales and Marketing for WLP and Bumping Business

Tue, 9 Sep 2007
(September 25, 2007) PHEONIX, AZ—FlipChip International (FCI) announced the appointment of David McComb as global vice president, sales and marketing for its wafer level packaging (WLP) and bumping business. McComb, who joined FCI in 2005 as the director of European business and sales, will assume responsibilities for sales, marketing, and licensing for FCI's activities for international customers.

Seminar Series Targets Integrated Process Solutions for 3D Packaging

Tue, 9 Sep 2007
(September 25, 2007) MUNICH, Germany— SUSS Microtec, NEXX Systems, and Surface Technology Systems (STS), manufacturers of semiconductor process equipment, announced their collaboration with Fraunhofer IZM to demonstrate integrated process solutions for 3D wafer-level packaging (WLP).

McGee Joins Carl Zeiss SMT as North American VP of Sales

Tue, 9 Sep 2007
(September 25, 2007) OBERKOCHEN, GERMANY/PEABODY, MA— Carl Zeiss SMT appointed Daniel McGee, former VP of IBM Global Alliance at KLA-Tencor, to the position of vice president of sales and service for North America. The company noted McGee's 28 years of management expertise as a key factor in their decision.

WiSpry Appoints CFO

Mon, 9 Sep 2007
(September 24, 2007) IRVINE, CA— WiSpry, developer of radio frequency micro-electro-mechanical systems (RF-MEMS) tunable components and modules, announced the appointment of Mark Becker as chief financial officer.

NEC Adopts Cadence Platform for High-performance Processor

Mon, 9 Sep 2007
(September 24, 2007) SAN JOSE, CA— Cadence Design Systems, Inc., announced that NEC Electronics America has adopted Cadence Encounter digital design IC platform to implement their high-performance, low-power ARM11 MPCore multicore processors. The processor reportedly is rated at over 700MHz and built on 90-nm process technology, The success of the dual-core implementation of the device prompted NEC to add the platform as one of its tapeout methodologiesof-choice.

Keithley and CNSI Announce Nanotechnology Measurement Partnership

Fri, 9 Sep 2007
(September 21, 2007) CLEVELAND, OH — Keithley Instruments, Inc. has partnered with The California NanoSystems Institute (CNSI) at UCLA to support research collaboration for next-generation instrumentation and measurement requirements to serve the semiconductor industry. The two organiziations intend to share research information to further the understanding of nanotechnology and nanoelectronic technologies

Phillipy to Succeed Deuster as CEO of Newport Corp.

Fri, 9 Sep 2007
(September 21, 2007) IRVINE, CA— Newport Corporation has named Robert J. Phillippy, to succeed Robert G. Deuster as CEO, following the announcement of Deuster's retirement, effective October 5, 2007. Currently Newport's president and chief operating officer, Phillippy will also serve on the company's Board of Directors. Kenneth F. Potashner, member of the Board since 1998, has been appointed non-executive chairman of the Board.

Test Advantage Ranks in Inc's 5000

Fri, 9 Sep 2007
(September 21, 2007) NEW YORK/TEMPE, AZ— Test Advantage announced it has been ranked at 3110 on the Inc. 5,000 list of the fastest-growing private companies in the country. An extension of Inc. magazine's annual Inc. 500 list, the Inc. 5,000, catches businesses that are too big to grow at the pace required to make the Inc. 500, as well as a host of smaller firms.

CoorsTek Receives Colorado Top Company Award

Thu, 9 Sep 2007
(September 20, 2007) DENVER, CO— CoorsTek, Inc., a global technical ceramics manufacturer, received the Colorado Top Company Award for excellence in financial performance, manufacturing, and community involvement. Presented in a ceremony at the 20th Annual Top Company competition, the award was received by John K. Coors, president, CEO, and Chairman of CoorsTek, Inc.

Redshift Systems Partners with IMT to Develop Next-gen Thermal Imaging Device

Thu, 9 Sep 2007
(September 20, 2007) BURLINGTON, MA— RedShift Systems, provider of next-generation thermal imaging solutions, will join forces with MEMS manufacturer,Innovative Micro Technology (IMT) to produce a solid-state, passive optical component that shifts long-wavelength thermal infrared radiation to visible light to allow standard CMOS and CCD digital cameras to "see heat."

Cadence User Conference Achieves Record Attendance

Tue, 9 Sep 2007
(September 18, 2007) SAN JOSE, CA— Cadence Design System Inc. reports that over 700 registered designers, design managers, and executives attended this year's CDNLive! Silicon Valley Conference for semiconductor and electronics systems designers held Sept. 10-12, 2007 at the San Jose McEnery Convention Center.

Texas Instruments to Fund Medical Technology Research

Tue, 9 Sep 2007
(September 18, 2007) DALLAS, TX— Texas Instruments Inc. will allocate 15 M to fund medical research at selected universities worldwide. The company is excited to partner with universities to develop the next-generation of medical electronics, says Kent Novak, vice president of TI's medical business unit. Targeted R&D areas will include personal medical devices, implantables, medical imaging, wireless healthcare systems, and biosensor technology.

SiTest Solutions Ltd to Provide Test Services for Austin Semiconductor

Mon, 9 Sep 2007
(September 17, 2007) HONG KONG/AUSTIN, TX— Austin Semiconductor has selected SiTest Solutions Ltd. as their pre-production and production test solutions provider for their latest integrated products. Frank Muscolino, president Austin Semiconductor, said the choice was prompted by a need for a unique test methodology and capability not readily found at test service companies.

IBM's Nanoscale Printing to Increase Miniaturization

Mon, 9 Sep 2007
By Meredith Courtemanche, assistant editor

(September 19, 2007) ZURICH, Switzerland — IBM researchers and scientists from the ETH Zurich demonstrated a nanoscale printing technique that could bring nanowires, miniature lenses for optical chips, and nanoscale biosensors into future generations of advanced chips and packages. Key to the technique is a combination of directed self-assembly and a printing process that retains particle order, said Heiko Wolf, IBM researcher.

MEPTEC Medical Electronics Symposium Program

Fri, 9 Sep 2007
(September 14, 2007) SAN JOSE, CA — MEPTEC finalized the itinerary for its 2nd annual Medical Electronics symposium, titled "Growth Opportunities for Medical MicroElectronics." The show will take place at the Arizona State University (ASU) campus, Tempe, AZ, on Sept 25th, 2007.

Balver Zinn Receives Nihon Award

Fri, 9 Sep 2007
(September 14, 2007) BALVE, Germany — Japan-based Nihon Superior awarded solder distributor Balver Zinn its Gold Award, recognizing sales of Nihon's SN100C lead-free solders to Europe-based electronics assemblers. Balver built a successful partnership with Nihon in part through its global alliance with DKL Metals in the U.K. and FCTA in the U.S., said Josef Jost, managing director, Balver Zinn.

TXP Deploys PoP Assembly

Thu, 9 Sep 2007
(September 13, 2007) RICHARDSON, TX — Pre-manufacturing service provider TXP has developed a package-on-package (PoP) assembly process that it asserts will reduce manufacturing time and associated costs. The company will deploy PoP technologies for several of its global customers.

ESI Ships Dual-beam Laser to Korea Memory Manufacturer

Thu, 9 Sep 2007
(September 13, 2007) PORTLAND, OR — Electro Scientific Industries Inc. (ESI) received an initial order from a Korea-based memory manufacturer for its Model 9850 dual-beam infrared (IR) laser link-processing system. The customer will implement yield and throughput improvements to its advanced memory device manufacturing processes with the 9850.

Handbook Focuses on Nanoscale Measurements

Fri, 4 Apr 2007
(April 6, 2007) CLEVELAND — The "Nanotechnology Measurement Handbook," published by Keithley Instruments, provide guides for electrical measurements on nanoscale applications, such as carbon nanotubes (CNT), and references when testing new phenomena in R&D. Practical assistance aids in measuring low-level DC and pulses on nanomaterials and devices, while theoretical and practical considerations are listed for measuring currents, resistances, and voltages typical of nanomaterials.

Cascade Acquires Gryphics

Thu, 4 Apr 2007
(April 5, 2007) BEAVERTON, OR — Cascade Microtech acquired Gryphics, Inc., a private company, for about 843,000 shares of Cascade common stock and $13.7 million cash. Cascade reported this as a strategic step in expanding its advanced production test consumable for high-performance ICs. This market is less volatile than semiconductor-production capacity equipment, explained Eric Strid, CEO.

Gartner Reports 23% Growth in Equipment

Thu, 4 Apr 2007
(April 5, 2007) STAMFORD, CT — Capacity needs, competitive investment in memory, 65-nm ramping, and 45-nm introductions all contributed to a 23% revenue increase in 2006, said Gartner, Inc.'s "Dataquest Insight: Semiconductor Manufacturing Equipment Sales Expanded in 2006."

Raytheon Signs on to Ziptronix Bonds

Thu, 4 Apr 2007
(April 5, 2007) MORRISVILLE, N.C. — Ziptronix, Inc., in conjunction with Raytheon Vision Systems (RVS), demonstrated compatibility with multi-layer CMOS IC production for its Direct Bond Interconnect (DBI) process. The die-to-wafer/wafer-to-wafer bond process uses no external pressure or heat to produce stacked die. Raytheon selected the process to manufacture focal-plane imagers and high-performance sensor arrays, said Stefan Baur, RVS director for advanced technology.

Raw Materials Pressure Solder Surcharges

Thu, 4 Apr 2007
(April 5, 2007) JERSEY CITY, NJ; CLINTON, NY; ITASCA, IL — Major solder companies are adjusting prices on tin-bearing solders, following reports that 2007 tin consumption would greatly outrun available raw tin supply. Mining and production shortfalls in Bolivia and Indonesia drove the market shift, and solder companies will roll out price adjustments as temporary or tiered increases. The surcharges are expected to last for the majority of 2007.

Amkor Extends Korean Finance

Wed, 4 Apr 2007
(April 4, 2007) CHANDLER, AZ — Amkor Technology's wholly owned Korean subsidiary, Amkor Technology Korea, Inc., entered a $300 million, seven-year, secured credit financing agreement with Woori Bank, a member of Woori Financial Group. Proceeds from the loan, prepayment fees, and accrued interests will be used to pay an existing $300 million second lien term loan, which bears interest at a higher rate.

Bruce McWilliams Founds Fellowship

Tue, 4 Apr 2007
(April 3, 2007) PITTSBURGH — Bruce McWilliams, chairman, president, and CEO of Tessera Technologies, along with his wife Astrid, donated more than $1 million to the Carnegie Mellon College of Science, as seed funding for the Astrid and Bruce McWilliams Fellowship, supporting graduate students conducting research in emerging fields. Bruce McWilliams holds bachelor's, master's, and doctorate degrees in physics from Carnegie Mellon, and serves on the physics department advisory board.

Analysts Weigh In

Tue, 4 Apr 2007
As 2007 progresses, analysts are examining the past and future for electronic components and advanced technology applications. Following are summaries of reports from iSuppli, Henderson Ventures, Yole Développement and SEMI, and In-Stat, covering MEMS, NAND and NOR flash, SoC, and other technologies.

Equipment Sales Climb 23% in 2006

Mon, 4 Apr 2007
(April 4, 2007) SAN JOSE, CA — Worldwide sales of semiconductor manufacturing equipment totaled $40.47 billion in 2006, up 23.1% over 2005. Assembly and packaging sectors grew a total of 14%; test equipment sales increased by 21% over the prior year, according to SEMI's "Worldwide Semiconductor Equipment Market Statistics (SEMS) Report."

Wafer Bump Providers Partner

Mon, 4 Apr 2007
(April 2, 2007) COLORADO SPRINGS, CO and JANGYIN, China — Wafer-bumping service provider IC Interconnect (ICI) and Jiangyin Changdian Advanced Packaging (JCAP), which produces solder, gold, and pillar bumps, formed an international alliance to transfer ICI technologies to Asia and JCAP bumping services to North America.

MEPTEC Symposium Highlights Cooperative Solutions

Mon, 4 Apr 2007
By Jeffrey C. Demmin, contributing editor

"Collaboration is the key," was the gist of the third annual MEPTEC "The Heat is On" symposium on thermal management, held in San Jose, CA, this February. Jerry Bartley's keynote talk stressed the requirement for collaboration between different engineering disciplines throughout the supply chain. "More interaction to close the gaps between the disciplines will provide large paybacks," he said.

Flip Chip Bonding and Underfill System

Tue, 2 Feb 2007
The FS2500N meets requirements for high-density interconnects (HDI) with reportedly increased speed and accuracy over previous generations. Its flip chip packing system performs alignment and bonding at 1.7 sec. per chip excluding process time, with accuracies of less than 2 µm, and the bonding system suits various materials with low voiding.

Engineer-level User-interface Software

Tue, 2 Feb 2007
JPSAControls32 system-control software provides control for all system devices and software components for system setup and programming. Windows-based and English-language, the software offers features such as a system-configuration editor for editing settings, and CAD file translation capability for .dxf files, allowing automated programming of complex designs. The product integrates motion devices, including laser-fire commands, with a dual-camera system.

AOI for MEMS

Tue, 2 Feb 2007
The Falcon 600 automated optical inspection (AOI) system targets MEMS and other special applications for the semiconductor manufacturing and packaging industries. The model targets applications that require special handling and inspection capabilities, such as optoelectronic devices, MEMS, wafer-level packaging (WLP), and glass substrates.

Advanced Packaging Software

Tue, 2 Feb 2007
The Turbo Package Analyzer v5. introduces automation, design flow, and simulation capabilities to the software program, enabling extraction of electrical characteristics for complex BGA packages — wire-bond BGAs, flip chip BGAs, chip-scale packages (CSPs), and system-in-package (SiP). SiP design tools include wirebond layouts for trace-to-trace, cascaded, and die-to-die configurations.

Custom and Select Optics

Mon, 2 Feb 2007
A variety of custom and select optics suit deep-UV excimer and UV-DPSS lasers and beam-delivery systems. Made from premium UV-grade fused silica, calcium fluoride, and magnesium fluoride materials, the optics are 100% lab-inspected. The multi-element imaging lenses enable users to drill and micromachine micron-scale features, and feature reportedly tighter tolerances and longer lifetimes than off-the-shelf optics.

OSD Demand Outpaces ICs

Wed, 2 Feb 2007
(February 28, 2007) SCOTTSDALE, AZ — The optoelectronics, sensors and actuators, and discretes (OSD) market grew 10% in 2006, one percentage point higher than the IC market's 9% increase, says IC Insights' "O-S-D Report." Optoelectronics and discretes each represented 43% of the $38.2 billion OSD market revenue. Sensors and actuators hit $5.3 billion, with MEMS-based devices accounting for 80% of revenues.

SolVision Nabs IC Inspection Contract

Wed, 2 Feb 2007
(February 28, 2007) BOUCHERVILLE, Quebec — A major Korean semiconductor contract manufacturer (CM) selected AV6010 vision systems from SolVision Inc. for IC package inspection at its assembly and test house. The manufacturer will use multiple systems to inspect packages, including advanced flip chip devices.

SATS Industry Grows 26%

Tue, 2 Feb 2007
(February 27, 2007) STAMFORD, CT — The global semiconductor assembly and test services (SATS) market grew 25.7% in 2006, the fifth consecutive year this sector has exhibited double-digit growth, according to preliminary reports from Gartner, Inc. The SATS industry, the outsourcing portion of back-end packaging, assembly, and test, is propelled by major transitions to advanced packaging, including wafer-level, chip-scale, flip chip, and system-in-package (SiP) methods, said Jim Walker.

India Plant Expansion Serves Local Market

Mon, 2 Feb 2007
(February 26, 2007) IRVINE, CA — Henkel Corporation will expand its existing plant in Pune, India, to incorporate a solder-paste blending facility. Tin/lead and lead-free solders produced at the facility, under the Multicore brand, will be distributed to the India region electronics market.

Oscillator Release Formalizes Partnership

Mon, 2 Feb 2007
(February 26, 2007) SAN JOSE, CA and HUDSON, NH — Discera (San Jose) and Vectron International (Hudson, NH), a Dover company, formalized their strategic partnership with the MOS1 product rollout for the high-performance clock oscillator space. The oscillator, available in a ceramic or quad flat pack (QFP) plastic package, suits frequencies from 1 to 125 MHz.

Dynaloy, BASF Expand WLP Partnership

Thu, 2 Feb 2007
(February 22, 2007) INDIANAPOLIS and LUDWIGSHAFEN, Germany — Dynaloy LLC and BASF AG entered into an expanded sales and distribution agreement for strippers and cleaners used in wafer-level packaging (WLP) and bumping processes. BASF expects the partnership to broaden its back-end semiconductor market penetration, while Dynaloy is targeting Asian and European markets.

Andigilog Completes Series B

Thu, 2 Feb 2007
(February 22, 2007) TEMPE, AZ — Andigilog received $18 million in a series B financing round, with four new investors and three returning venture capital companies. The thermal management solutions company will use this funding to penetrate for desktop, notebook, and cooling fan markets; and to extend its product portfolio.

Agilent Names VP Corporate Development

Wed, 2 Feb 2007
(February 21, 2007) SANTA CLARA, CA — Shiela Robertson will succeed John Eaton as VP of corporate development at Agilent Technologies Inc. Eaton will retire after 23 years with Agilent and Hewlett-Packard (HP). Robertson's post as operational CFO, electronic measurement group (EMG), will be filled by Robert Cantrell.

Printed Electronics Advance by Creating Markets

Tue, 2 Feb 2007
By Meredith Courtemanche, assistant editor

Printed electronics may be a disruptive development for human interfacing, networks, and environment technology. Reports and industry input suggest that intelligent, mass-producible printed electronic circuits will impact primarily markets that were previously inaccessible. Various sources agree that the printed electronic device will be less likely to compete with existing technologies that meet current needs.

IEC Launches Collection of RFID Standards

Tue, 2 Feb 2007
(February 20, 2007) GENEVA — The International Electrotechnical Commission (IEC) published a thematic collection of radio frequency identification (RFID) standards, developed by the International Standards Organization (ISO) and IEC joint technical committee JTC 1.

SanDisk Restructures to Reduce Costs

Tue, 2 Feb 2007
(February 20, 2007) MILPITAS, CA — SanDisk will reduce its workforce and cut salaries for executives, among other measures, to respond to an "aggressive" pricing cycle in Q'01 2007, announced Eli Harari, chairman and CEO. The industry-wide NAND component price deterioration, 50% over the past two months, stems from seasonally weak demand in Q'01 and an excess supply. SanDisk states that these factors impacted pricing more than anticipated, leading to the cost-reduction steps.

Back-end Process — Wafer Bumping

Tue, 2 Feb 2007
Advanced Packaging Techniques
By Terence Q. Collier, CVInc.

Traditionally, die are electrically connected to the outside world using fine gold or aluminum wires that attach from the die's bond pad to the land of a substrate or PCB. Wafer bumping involves taking those traditional aluminum pads and converting into a format that provides a desirable structure for solder adhesion (bumping). There are a number of new, old, and relatively untested techniques for bumping wafers.

University to Hold Embedded Systems Course Online

Mon, 2 Feb 2007
(February 19, 2007) IRVINE, CA — To provide advanced training to a broad student base, University of California, Irvine Extension, will offer "Fundamentals of Embedded Systems Design and Programming," as an online course, beginning April 6, 2007.

Honeywell to Expand Packaging Materials R&D

Thu, 2 Feb 2007
(February 15, 2007) TEMPE, AZ — Honeywell Electronic Materials will expand its Spokane, WA, R&D center for advanced packaging materials, investing more than $1 million and adding about 85 pieces of equipment. The company plans to develop thermal management, electrical interconnect, and burn-in materials. The construction project is expected to finish by the end of 2007.

Micron Intros Multichip Packages

Thu, 2 Feb 2007
(February 15, 2007) BOISE, ID — Micron Technology, Inc., will incorporate its next-generation 1Gb mobile DRAM into "bundle" packages with the company's NAND flash memory. The multichip packages (MCPs) will target high-end mobile phone applications.

MEMS Reaching Broader Industries

Wed, 2 Feb 2007
(February 14, 2007) SCOTTSDALE, AZ — The commercial use of MEMS and nanotechnology ranges from display, gyro-sensor, and ink-jet printing to smart-RFID, RF-MEMS, and wireless-sensing sectors; this technology expansion is creating competitive and converging applications for MEMS devices, according to Bourne Research. The research firm released seven market briefs outlining the dynamics of MEMS and nanotechnology in emerging applications.

EoPlex Raises $8M to Expand Printed Circuitry Technology

Mon, 2 Feb 2007
(February 12, 2007) REDWOOD CITY, CA — EoPlex Technologies closed Series C financing with $8 million in investments, led by ATA Ventures. The company plans to expand design and manufacturing capacities, and increase its customer base, with the funding.

LG.Philips LCD Expands Substrate Capacity

Mon, 2 Feb 2007
(February 12, 2007) SEOUL, South Korea — LG.Phillips LCD plans to increase design capacity at its 7th generation thin-film transistor liquid crystal display (TFT-LCD) plant, P7, in Paju, Korea. P7 processes 1950- × 2250-mm glass substrate for 42 and 47" LCD displays.

BPA Appraises Coreless and Thin-core Substrates

Fri, 2 Feb 2007
(February 9, 2007) DORKING, Surrey, U.K. — BPA Consulting Ltd. released its market predictions for coreless and thin-core substrates for IC packages. BPA defines coreless and thin-core as emerging technologies, which reached a $1 million market in 2005. BPA expects the market to burst open to $2B by 2011.

Nextreme Names Packaging-focused CTO

Fri, 2 Feb 2007
(February 9, 2007) RESEARCH TRIANGLE PARK, NC — Nextreme Thermal Solutions appointed Seri Lee, Ph.D., as chief technology officer. Bringing Lee to Nextreme is part of a corporate plan to focus on electronic and optoelectronic packaging, and thermal management, said Jesko von Windheim, CEO, adding that Lee will also advance the company's efforts in thermoelectric power generation.

MEMS Lab to Use SUSS Bonders

Thu, 2 Feb 2007
(February 8, 2007) MUNICH, Germany — SUSS MicroTec will supply advanced wafer-bonding equipment to the University of Juarez (UACJ), Mexico, for MEMS research and hybrid packaging developments.

IMEC Names Fellows for Nanotech, Organics Study

Thu, 2 Feb 2007
(February 8, 2007) LEUVEN, Belgium — IMEC admitted Guido Groeseneken and Paul Heremans to the level of scientific fellow for their work in CMOS device technology and solar/organic technology, respectively. IMEC's scientific career program ranges from senior scientist to senior fellow, rewarding researchers who advance IMEC's technical position and contribute to technology transfers to industry partners. Promotions are based on research, global recognition, and academic activities.

Vectron Acquires BiODE, Establishes R&D Center

Tue, 2 Feb 2007
(February 7, 2007) HUDSON, NH — Vectron International, a Dover company, completed its acquisition of BiODE Inc., a fluid-viscosity sensor and viscometer reader designer and manufacturer. The BiODE organization will be integrated into Vectron's sensors and advanced packaging (SAP) business unit. The company will also construct an R&D facility in Westbrook, ME, to facilitate integration of BiODE's core technologies into Vectron products.

IST Project Promises VERTIGO

Tue, 2 Feb 2007
(February 7, 2007) AGRATE, Italy — The EU's verification and validation of embedded system design workbench (VERTIGO), proposes a broad aim of maintaining competitive status in the embedded-systems sector for the European electronics industry. The project's multi-pronged approach includes improving modeling synergy, developing validation techniques for designs that integrate various flows and also transfer to simulation, and prototyping a co-verification environment.

Epson Selects SUSS for WLCSP

Mon, 2 Feb 2007
(February 5, 2007) MUNICH, Germany — Seiko Epson Corp. purchased an MA200Compact mask aligner from SUSS MicroTec to support wafer-level chip-scale packaging (WLCSP). Epson evaluated several systems, selecting SUSS due to the machine's throughput and submicron overlay and alignment accuracy.

IBM Creates Method for Measuring CNT Performance

Tue, 10 Oct 2007
(October 16, 2007) YORKTOWN HEIGHTS, NY — Scientists at IBM announced that they have measured the distribution of electrical charges in tubes of carbon that measure less than 2 nanometers in diameter, 50,000 times thinner than a strand of human hair.

People in the News

Mon, 10 Oct 2007
Companies spanning the spectrum of the back-end semiconductor manufacturing industry announced strategic promotions, appointments and new hires in the past week. Among them are STATS ChipPAC, Henkel Corporation, J.P. Sercel Associates, Cobar Europe BV, and Hesse & Knipps, Inc.

Embedded Passives' Role in 3D Packaging

Mon, 10 Oct 2007
By Happy Holden, Mentor Graphics, Inc.
3D packaging technology is evolving rapidly to improve functionality and performance while maintaining a compact form-factor. Embedded passive components (EP) will play a major role in all of these 3D schemes.

Synova Secures First Orders in China

Mon, 10 Oct 2007
(October 15, 2007) LAUSANNE, SWITZERLAND— Synova, pioneer and patent holder of water jet-guided laser technology, announced that two Chinese customers have placed orders for systems incorporating Synova's Laser MicroJet (LMJ) technology for semiconductor and micro-machining applications. These customers represent a strengthened foothold in the Chinese market and throughout Asia for Synova.

Austrian Semiconductor Manufacturer Installs Fouth EVG Aligner

Thu, 10 Oct 2007
(October 9, 2007) ST. FLORIAN, AUSTRIA — EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, announced the installation of its fourth IQ Aligner System for packaging applications at a major semiconductor manufacturing facility in Austria. This purchase reportedly strengthens the customer's capacity for wafer-level packaging of MEMS and display devices.

ZESTRON America Sponsors PWAR 5K to Benefit SERVE

Thu, 10 Oct 2007
(October 11, 2007) MANASSAS, VA — ZESTRON America recently sponsored the PWAR Community Service 3rd Annual 5K Run/Walk to benefit Securing Emergency Resources through Volunteer Efforts (SERVE).

Nextreme Introduces Thermal Copper Pillar Bump

Thu, 10 Oct 2007
(October 11, 2007) RESEARCH TRIANGLE PARK, NC — Nextreme, manufacturer of micro-scale thermal and power management products, announces the integration of cooling and power generation into the copper pillar bumping process used in high-volume electronic packaging. This breakthrough in flip chip process technology reportedly addresses two serious issues in electronics today — thermal and power management constraints.

EVGroup Announces Bonder Install

Mon, 10 Oct 2007
(October 8, 2007) ST. FLORIAN, AUSTRIA — EV Group (EVG) announced the selection and installation of its EVG850TB fully automated temporary wafer bonding system by an Austrian semiconductor manufacturer. They system, designed for high-volume processing of thin- and ultra-thin device wafers, reportedly allows secure and reliable handling of high-value wafers while contributing to higher yield.

Kulicke & Soffa Rated Best Assembly Equipment Supplier By Taiwan Chipmakers

Fri, 10 Oct 2007
(October 5, 2007) FORT WASHINGTON, PA — According to a customer satisfaction survey on chip making equipment conducted by VLSI Research, Inc., Taiwan chip makers have rated Kulicke & Soffa as the best supplier of assembly equipment.

iNEMI Ramps Up For 2009 Roadmap at Fall Conferences

Fri, 10 Oct 2007
(October 5, 2007) HERNDON, VA — The International Electronics Manufacturing Initiative (iNEMI) is gearing up for the 2009 Roadmap with a series of meetings being held at industry conferences this fall.

Alcatel Receives DRIE Cluster Tool Order

Thu, 10 Oct 2007
(October 4, 2007) ANNECY, FRANCE— Alcatel Micro Machining Systems, a supplier of deep silicon etching equipment (DRIE) for MEMS and 3D semiconductors, has received an order for its AMS 4200 DRIE multi-chamber production tool from Boehringer Ingelheim microParts GmbH to increase volume production of MEMS micro-nozzles for Respimat inhaler.

ISSYS Receives NSF Grant to Develop Wafer-level, Hermetic, Hybrid Integration of MEMS and Electronics

Thu, 10 Oct 2007
(October 4, 2007) YPSILANTI, MI— Integrated Sensing Systems, Inc. (ISSYS) was awarded a Phase II Small Business Innovation Research contract from the National Science Foundation (NSF). The 2-year project, "Wafer-Scale, Hermetic, Packaging of MEMS-Based Systems," is aimed towards development of a novel packaging method to simplify the packaging of MEMS and their associated electronics.

STATS ChipPAC Completes LSI Acquisition

Tue, 10 Oct 2007
(OCTOBER 3, 2007) SINGAPORE — STATS ChipPAC announced it has completed the acquisition of LSI Corporation's assembly and test operation, located in Pathumthani, Thailand. The agreement was initially announced July 26, 2007.

Location, Location, Location

Tue, 10 Oct 2007
A Summary of IWLPC 2007
By Terence Q. Collier, contributing editor
In real estate, three words are important: location, location, and location. In semiconductor packaging, three words are also important: location, location, and size. As size limits of package approaches that of chip-scale packaging (CSP), space optimization can only go in one remaining direction; up.

STMicroelectronics' Next-generation MEMS Motion Sensors Meet Demand

Tue, 10 Oct 2007
(OCTOBER 2, 2007) GENEVA — STMicroelectronics, manufacturer of MEMS devices, have introduced next-generation 'nano' three-axis linear accelerometers to meet the demand for miniaturized motion-sensing solutions in the consumer and industrial markets.

AOI Programming Software

Mon, 8 Aug 2007
EasyPro3D hosts simplified parameterizing; an IPC-compliant, 1,600 component library, LIB2007; and updated repair station. The shortened parameter list reportedly speeds high-quality inspection with low false calls, while automatic parameter optimization (APO) allows use with all LIB2007 algorithms.

Wafer-bump, LED Cluster

Mon, 8 Aug 2007
An advanced coating cluster, the Gamma XPress suits gold bump coating, under bump metallization or redistribution coating, high-volume LED coating, and other film-development applications based on chosen configuration. It is said to shorten lead times with flexible production setup.

Atom Probe Microscope

Mon, 8 Aug 2007
The LEAP HR microscope family enables materials science research, particularly metallurgical applications. With high (mass) resolution, researchers can examine individual atoms with compositional accuracy in voltage-pulse mode. The design is said to increase throughput and suit mechanical, electrical, and magnetic observations.

High-tensile TIM

Mon, 8 Aug 2007
Targeting long-term use and reworkable assemblies, the Keratherm 86/82 high-tensile-strength thermal interface material (TIM) is thermally conductive and electrically isolating, comprising silicone film with a fiberglass layer.

Green Materials for Flex Circuits

Mon, 8 Aug 2007
A halogen-free, RoHS-compliant transparent epoxy polyimide laminate product line, R/flex JADE A targets flexible circuit needs in portable electronics, computing, packages, and other applications.

Advanced SEMs

Mon, 8 Aug 2007
Nova NanoSEM 30 series of field-emission scanning-electron microscopes (SEMs) are designed to analyze and characterize a range of materials, perform lithography and deposition prototyping, and host in-situ experimentation and testing.

Micropelt Introduces MEMS-based Thermoelectric Cooler Technology

Thu, 8 Aug 2007
(August 30, 2007) FREIBURG, GERMANY — Micropelt GmbH, manufacturer of thin film thermoelectric devices, introduced a technology advancement in its ultra-small, microchip thermoelectric coolers (TECs) that is expected to open possibilities for laser and photonic sensor manufacturers whose applications require a large bandwidth of thermal control.

ZESTRON Officially Opens Global Center of Competence

Wed, 8 Aug 2007
(August 29, 2007) MANASSAS, VA — ZESTRON officially announced the opening of its Worldwide Center of Competence and Excellence for Inline Cleaning. Speedline Technologies, Stoelting and Trek Industries are among the international companies whose state-of-the-art equipment is installed in the new facility.

MILMEGA Puts Cree MESFETS in UHF Amplifiers

Wed, 8 Aug 2007
(August 29, 2007) DURHAM, NC — In a move to reduce form factor while increasing power of its UHF power amplifiers, MILMEGA Ltd. has chosen Cree silicon carbide (SiC) MESFETS to power its new line. Cree's SiC MESFETs are said to provide greater power density than conventional semiconductor materials, allowing for improved efficiency and more capabilities in a smaller form factor.

Rohm and Haas Receives SMIC Excellent Supplier Award

Tue, 8 Aug 2007
(August 28, 2007) PHEONIX, AZ — Semiconductor Manufacturing International Corporation honored Rohm and Haas Electronic Materials, CMP Technologies with the company's 2007 Excellent Supplier Award, recognizing the efforts of the four Rohm and Haas business units that support SMIC: CMP Technologies, Microelectronic Technologies, Packaging and Finishing Technologies and Ion Exchange Resins.

Discera Qualifies MEMS Oscillators

Mon, 8 Aug 2007
(August 27, 2007) SAN JOSE, CA — Discera, Inc., qualified its MEMS-based oscillators with a series of frequency-stability and standard semiconductor qualification and reliability tests, comparing the silicon-based MEMS resonators to quartz for timing devices. Discera tested three separate manufacturing lots to prove process consistency in high-volume production, said Venkat Bahle, VP of marketing, Discera.

RF Integration — A Paradigm Shift

Fri, 8 Aug 2007
By Per Vicklund, Mentor Graphics

The character of RF design has changed quite dramatically in the past few years. It's quite rare that RF designs are isolated pieces of circuitry, but rather part of a much bigger context. RF designs today typically are much larger and much more complex. They are multi-technology designs consisting of multiple RF modules integrated with high-speed digital, analog, power, and bias networks, all on the same dense circuit board.

Viscom Buys IR Inspection Line

Fri, 8 Aug 2007
(August 24, 2007) HANOVER, Germany and HILLSBORO, OR — Viscom AG will acquire the MX family of infrared (IR) inspection systems for semiconductor, MEMS, and package inspection from Phoseon Technology. The deal includes intellectual property (IP), product development, licensing, customer base, and employees attached to the inspection line. It will broaden Viscom's offering beyond AOI and X-ray inspection tools, said Volker Pape, co-founder and board member, Viscom.

Photovoltaic Show Highlights Product Intros

Fri, 8 Aug 2007
(August 24, 2007) MILANO, Italy — The 22nd European Photovoltaic Solar Energy Conference, September 3–7 in Milano, will feature an increased presence of electronics materials companies launching products targeting the photovoltaics market. Following are the introductions Cookson and Indium plan for the show.

Packaging Passives

Thu, 8 Aug 2007
By Craig Hunter, AVX, for SMT Magazine

Many innovations in passives can be traced back to the need for smaller, lighter devices. For capacitors, that's resulted in shrinking case sizes from 1210 down to 0201, and even to 01005s. The need to make passive components thinner, as witnessed by increased sales of newer, thinner MP3 players, adds to this. For passive component manufacturers, this means meeting the requirements of the smallest semiconductor package available.

QLP Adds West Coast Manufacturing

Thu, 8 Aug 2007
(August 23, 2007) WILMINGTON, MA — Quantum Leap Packaging, Inc. (QLP), purchased a second manufacturing site, located in Poway, CA. It plans to manufacture high-performance air-cavity packages at the Poway site by early 2008.

Surfect Launches Wafer-bumping Service

Wed, 8 Aug 2007
(August 24, 2007) TEMPE, AZ

Enthone Appoints Process Integration Manager

Wed, 8 Aug 2007
(August 22, 2007) WEST HAVEN, CT — Enthone, Inc., a business of Cookson Electronics, named Bioh Kim as process integration manager of electronic materials. Kim has a metallurgical and semiconductor packaging background.

Nano Micro Facility Installs Vistec VB6

Wed, 8 Aug 2007
(August 22, 2007) WATERVLIET, NY — The Forschungszentrum Karlsruhe independent science and research institute (Germany) began running applications on a Vistec VB6 electron beam lithography system in its Karlsruhe Nano Micro Facility. The system will allow researchers to develop new applications in nanotechnology and microsystems technologies.

JMD Launches 3D Via Processes

Wed, 8 Aug 2007
(August 22, 2007) ATLANTA — Jacket Micro Devices (JMD) patented a fabrication method for 3D, all-organic interconnect structures that uses high- and low-temperature single-sided liquid crystal polymer (LCP) structures. The technique is based on JMD's multi-layer organic (MLO) packaging portfolio.

DoD Supplements EI's MCM Contract

Tue, 8 Aug 2007
(August 21, 2007) ENDICOTT, NY — The U.S. Department of Defense (DoD) awarded Endicott Interconnect Technologies, Inc. (EI), a $19 million contract modification to existing work, requiring additional multi chip module (MCM) assemblies and equipment. EI provides fully assembled MCMs for a high-reliability, high-performance DoD computing application.

IPC Studies Global Development, Microelectronics

Tue, 8 Aug 2007
(August 21, 2007) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries commissioned in-depth market studies on strategies for global expansion and microelectronics trends and technologies. BPA Consulting (Dorking, Surrey, U.K.) and Prismark Partners (Cold Spring Harbor, N.Y.) will conduct the research. IPC's Executive Market Forum oversees the project, and will publish the final reports.

ICI Adds AAA to Electronic Materials Group

Mon, 8 Aug 2007
(August 20, 2007) RANCHO DOMINGUEZ, CA — ICI acquired Advanced Applied Adhesives (AAA — San Diego, CA) to expand its electronic materials (EM) group. AAA and sister company Designer Molecules, Inc. (DMI), offer die-attach adhesives for power applications and other packaging materials. Terms of the transaction were not disclosed.

DEK Puts Local Imprint on Website

Mon, 8 Aug 2007
(August 20, 2007) FLEMINGTON, NJ — DEK introduced a regional-content feature to its website, enabling visitors to view product, process, and company information in local languages and tailored to the production parameters of a region. Users select Asia, Europe, or U.S. content when entering the site.

Environmentally safe molding compound

Thu, 11 Nov 2001
Evaluation of new flame retardants

Process integration of electroplated solder bumps for WLP

Thu, 11 Nov 2001
Providing high density and performance for chip-to-system interconnection

The back-end process: Step 11 - Scribe and break

Thu, 11 Nov 2001
Die separation of thin silicon wafers and delicate III-V substrates creates challenges for traditional saw dicing

Options in flip chip cleaning

Thu, 11 Nov 2001
Meeting performance and reliability standards

Think Tank

Thu, 11 Nov 2001
The "Couples Only" Cruise had 1,100 married couples as passengers. Four-fifths of the husbands who were taller than their wives were also older. Five-sixths of the husbands who were older than their wives were also taller

Improving business with electronic document management

Thu, 11 Nov 2001
Document management software enables colleagues and business partners to collaborate around the world and around the clock.

Education and collaboration beyond borders

Thu, 11 Nov 2001
"As a young engineer, I learned as much from traveling as I did while a student in a classroom."

Toshiba introduces new medium-power packages

Thu, 11 Nov 2001
Toshiba America Electronic Components Inc. has expanded its lineup of medium-power packaging solutions to include US-Flat, S-Flat, M-Flat, thin flat package (TFP) and VS-6 devices

Movers and shakers

Thu, 11 Nov 2001
Paul Lin has joined Kulicke & Soffa (Willow Grove, Pa.) as director of process integration

Meeting wrap-up

Thu, 11 Nov 2001
Third lead-free summit offers new data

Movers and shakers

Wed, 8 Aug 2001
Etalon, a division of Piezo Technologies (Indianapolis), has hired Andreas Hadjicostis to head up its engineering development group

News

Wed, 8 Aug 2001
Zuken addresses time-to-market with predictive analysis tool

What, me worry...?

Wed, 8 Aug 2001
Why are so many upper echelon managers in our industry reluctant to admit what everyone else seems to know: that they have problems in their businesses? Their employees and factory workers, their suppliers and even their competitors know that they have problems

New products

Wed, 8 Aug 2001
The Enviro 300-mm Advanced Dry Strip System is a multi-chamber, single-wafer tool that is designed to remove resist and polymer residue by using microwave and low-energy RF plasmas

Packaging for microwave and millimeter wave components

Wed, 8 Aug 2001
Packaging for high-frequency components has never received much attention. Historically, high-speed millimeter wave integrated circuit (MMIC) devices were developed primarily as a resource for the United States military

Pennant races

Wed, 8 Aug 2001
Perhaps the most intriguing thing about the semiconductor industry is the cycle that propels the business up and down by astounding amounts over short periods of time

Movers and shakers

Sun, 7 Jul 2001
Novellus Systems Inc. (San Jose, Calif.) has promoted Peter R. Hanley to company president. Hanley will also join chairman of the board and chief executive officer Richard S. Hill in a newly created office of the chief executive officer

Briefly Speaking

Sun, 7 Jul 2001
Semitool (Kalispell, Mont.) has received a patent for copper seed layer enhancement, an advancement in technology that will help semiconductor device manufacturers achieve high-performance devices and smaller chips from copper interconnect-based semiconductor devices

In the News

Sun, 7 Jul 2001
Tessera and Intel make strides in stacked chip technology

Think Tank

Sun, 7 Jul 2001
Al, the youngest of six seniors (Al, Ben, Cam, David, Ezra and Fred), announced, "For each of us, I have calculated our average age before and then after including each of our ages. Fred's age is 50-percent higher than mine

BGA underfills

Sat, 12 Dec 2001
Increasing board-level solder joint reliability

Heat pipe simulation

Sat, 12 Dec 2001
A simplified technique for modeling heat pipe assisted heat sinks

Think TANK

Sat, 12 Dec 2001
Four prominent trees grew on the perimeter of the city's Circular Park. The path due south from the cypress tree to the dogwood tree intersected the path due west from the baobab tree to the acacia tree at the Lion Fountain

The optoelectronics assembly roller coaster

Sat, 12 Dec 2001
Entering the optoelectronics industry has been an up-and-down affair for many. A few years ago in the late 1990s, assembly equipment suppliers for the semiconductor back-end industry became involved in optoelectronics

Texas Instruments launches another logic family

Sat, 12 Dec 2001
Texas Instruments (TI) has recently introduced a new logic family, the advanced ultra-low voltage CMOS (AUC); the products in this family are optimized at 1.8 V but are operational to sub-1-V levels

Vishay makes advances in passive technology

Sat, 12 Dec 2001
Vishay Intertechnology Inc. has begun sampling solid capacitors that use niobium as the anode material.

LSI Logic licenses flip chip technology to AIT

Sat, 12 Dec 2001
LSI Logic Corp. and Advanced Interconnect Technologies have signed a licensing agreement under which AIT will license LSI Logic's organic laminate flip chip FPBGA technology

KGD MEETING REPORT

Sat, 12 Dec 2001
SIPs at forefront of KGD Packaging and Test Workshop

Intel packaging technology aims to enable 20-GHz processors by 2006

Sat, 12 Dec 2001
Intel Corp. recently announced that it has demonstrated a new packaging technology that could enable the development of 20-GHz microprocessors by 2006 or 2007

IMAPS optoelectronics Report

Sat, 12 Dec 2001
At the IMAPS Advanced Technology Workshop on Optoelectronics Packaging (October 11-14, 2001, in Bethlehem, Pa.) the mood was upbeat and the technology quite innovative

IMAPS meeting Report

Sat, 12 Dec 2001
The exhibit floor at the IMAPS Symposium was not exactly packed, but most conference attendees thought that the turnout and content made it worthwhile

ASE introduces multi-package BGA

Sat, 12 Dec 2001
Advanced Semiconductor Engineering Inc. (ASE) has launched its new multi-package ball grid array technology (MPBGA), a member of the multi-chip module (MCM) package family

Silver lining

Sat, 12 Dec 2001
One of the clichés that you hear during slow times in the electronics industry is that a lull gives manufacturers the chance to develop new products rather than focusing on getting more of the same old products out the door

XinTec Expands Shellcase CSP Technology

Sun, 12 Dec 2002
SCHÄRDING, AUSTRIA — EV Group (EVG), a manufacturer of various wafer processing equipment, completed another equipment purchase agreement with XinTec Inc. of Taiwan.

The Year of Living Dangerously

Sun, 12 Dec 2002
Here we are at the end of 2002, at pretty much the same point we were at the end of 2001?having survived a very difficult year and assuming/hoping that business would be better by about the middle of the following year.

Optical Inspection of CSPs

Fri, 11 Nov 2002
Until recently, X-ray technology was the only option for inspecting hidden solder joints on chip scale packages (CSP).

Wafer-level Packaging and Test, Technologies and Trends

Fri, 11 Nov 2002
The term "wafer-level packaging" (WLP) entered the microelectronics industry's lexicon in the late 1990s.

BGA solder joints

Fri, 11 Nov 2002
Plastic ball grid array (BGA) packages have gained popularity because of trends in product miniaturization and enhanced in-package electrical performance.

Stressed Metal Nanosprings

Fri, 11 Nov 2002
A critical area of microtechnology is the mechanical stress of thin films. Generally, the goal is to keep the stress as low as possible for providing durable and reliable film stacks.

Think Tank

Fri, 11 Nov 2002

New Products

Fri, 11 Nov 2002

Ceramic Packaging's Long Road

Fri, 11 Nov 2002
Packaging markets have come full circle over the past 40 years. In the 1960s, thick- and thin-film hybrid technology addressed, in part, limitations of integrated circuit (IC) technology.

New Tessera Stacked Packages

Fri, 11 Nov 2002
SAN JOSE, CALIF. — Tessera Technologies developed a package stacking technology that addresses business and logistical issues created by multichip integration.

New (ad)ventures in Asia

Thu, 2 Feb 2001
Excitement abounds here at Advanced Packaging magazine whenever we work on something new. While each and every month we deliver a new magazine to your desk, lately we have also been working on some other projects related to the magazine

WLP power components shrink portable equipment

Thu, 2 Feb 2001
New power and protection devices in wafer-level packaging (WLP) are aiding in the overall reduction of size and weight of portable equipment products

The Back-end Process: Step 2 - Die Placement

Thu, 2 Feb 2001
The expansive growth rate of flip-chip in packaging (FCIP) continues to task flip chip attach (FCA) equipment suppliers with new challenges

Palladium-plated packages

Thu, 2 Feb 2001
As a leadframe finish material, palladium has many advantages over tin-lead (SnPb) solder; it is more environmentally friendly and the package assembly process with palladium-plated leadframes is more efficient

Small-volume dispensing

Thu, 2 Feb 2001
Micro-valve dispensing can minimize setup between PCB runs and reduce material costs

Motorola innovates packaging with new strategies

Mon, 1 Jan 2001
Motorola Semiconductor Products Sector (SPS) is the strong, silent type. The industry might characterize the company as having been elusive in terms of its packaging developments in recent years, but behind this silence comes some good news for the packaging arena

Briefly speaking

Mon, 1 Jan 2001
Advanced Interconnect Technologies (AIT) now offers a new Web site at www.aitsales.com. The site includes company and product information, reports and data sheets, assembly and test capabilities

Movers and shakers

Mon, 1 Jan 2001
Ferro Electronic Materials, a division of Ferro Corp., Vista, Calif., appointed Robert S. Hodder, Jr. as North American sales manager, East region

Advanced Packaging launches Asia edition

Mon, 1 Jan 2001
NASHUA, N.H., AND Taipei, TAIWAN - PennWell Publishing and Arco Publishing have recently launched a Chinese/English language edition of Advanced Packaging magazine

Alice and Her Daughters

Mon, 1 Jan 2001
One day recently, out of the blue, my sister Alice made this remark about her three daughters and herself

Two metal layer flex

Thu, 3 Mar 2001
Typical flex-based packages can be made of pliable base materials, like polyimide or Mylar, onto which conductive metals are deposited and patterned

Chip-level packaging

Thu, 3 Mar 2001
CPU package design must start by addressing form factor. Whether for a high-performance desktop or a high-end workstation/ server, high-speed microprocessor packaging must be designed with the smallest form factor in mind

Shopping Spree

Thu, 3 Mar 2001
Three engineers, Alfred, Benjamin and Charles, and their wives, Althea, Bernice and Cora (not necessarily in that order), went shopping together while on holiday

News

Thu, 3 Mar 2001
Stacked BGA package for wireless communications introduced

Levels of factory automation

Thu, 3 Mar 2001
Factory automation continues to be a much-debated subject in assembly factories. While advertising campaigns and marketing efforts would have us believe that full automation is a necessity or that only the very best will produce the very best

New products

Thu, 3 Mar 2001
PT Series relays have low profiles and offer 2-, 3- or 4-pole double throw contacts for switching currents up to 12, 10 or 6 amps, respectively

Pursuing excellence

Thu, 3 Mar 2001
There are a few things I can count on hearing when I talk it up with folks in the industry. Among the general niceties people bestow upon us, there is always a mix of good questions, such as "When are you going to cover such-and-such topic?" and "Does this product really work?"

Why reuse?

Thu, 3 Mar 2001
The term reuse is commonly defined as using something again after some special treatment or processing. Today, it has become socially acceptable to reuse many of the things we have created and mass-produced

Meeting wrap-up

Fri, 6 Jun 2001
It was hard not to miss the optoelectronic bandwagon rolling through the HD International Conference in Santa Clara in April. Many companies were clearly shifting their focus to optoelectronic applications and finding significant new markets.

Briefly speaking

Fri, 6 Jun 2001
Ian McEvoy, managing director of DEK, has been appointed to lead the IPC SMEMA Council for 2001. As chair of the council, McEvoy will be responsible for setting the tone and direction of SMEMA's activities and leading the council's steering committee.

Movers and Shakers

Fri, 6 Jun 2001
Palomar Technologies Inc. (Vista, Calif.) has named Kevin Conlon chief operating officer

News

Fri, 6 Jun 2001
eople have talked about 3-D packaging for years, and there have been many demonstrations of stacked chip configurations, including high-volume production of SRAM/Flash memory stacks for mobile phones starting around 1999

The New Neighbors

Fri, 6 Jun 2001
ast week a new family moved into our neighborhood. My daughter soon made friends with a girl, Susan, in that family. I should have known better, but I asked my daughter, "How old is your new friend?"

Automation wizards conquer package design

Fri, 6 Jun 2001
Packaging no longer is an afterthought - it has moved into the mainstream, directly in the critical path of product design. Focusing on packaging at the last minute can cost a company up to 40 percent in performance, but fortunately software tools can help expedite package design

Nuclear particles and the green movement

Fri, 6 Jun 2001
The most common modern use for lead is in solders for electronics manufacture because of lead's low melting point and corrosion resistance. Historically, lead has been used in a wide variety of ways for thousands of years

Save the whales ... not the lead!

Fri, 6 Jun 2001
During the first week of November each year, Japanese whaling vessels leave the ports of Hiroshima and Yamaguchi in western Japan bound for the Antarctic to catch another haul of Minke whales

A second chance to do it right

Fri, 6 Jun 2001
Historically, a rite of passage for a semiconductor packaging professional was the realization that packaging was an afterthought or seen as a necessary evil-or worse-in the IC world. Packaging added cost and leadtime, and more often than not it ruined some perfectly good chips

The back-end process: Step 6 - Lead forming step by step

Fri, 6 Jun 2001
The integrated circuit (IC) packaging industry currently seems to be concentrating on the development of non-leaded packages (such as chip scale ball grid arrays [CSBGAs] and QFNs), but leaded products

Challenges and trends in back-end inspection and tray-to-tape packaging

Mon, 1 Jan 2001
Emphasis has shifted from upstream processes to optimization of back-end operations for BGA packages

Wafer-scale Encapsulation: Controlling MEMS Packaging Costs

Sun, 12 Dec 2002
Microelectromechanical systems (MEMS) technology quickly made the transition from innovative concepts to practical demonstrations and on to early products.

Industry experts speak on WLP and co-design

Sun, 12 Dec 2002
The editors of Advanced Packaging and Solid State Technology magazines conducted an exclusive survey of key figures in the semiconductor manufacturing industry. We gathered input on two critical areas of front and backend convergence ? WLP and chip/package co-design. Following is what the industry experts had to say.

Quality System Requirements

Sun, 12 Dec 2002
Changes affecting the semiconductor supply chain

Molding Simulation

Sun, 12 Dec 2002
Predicting voids and unbalanced mold flow

"Hot-bottom"Ceramic Package

Sun, 12 Dec 2002
Revisiting An Old Packaging Approach

Think Tank

Sun, 12 Dec 2002

The Changing Role of the Materials Supplier

Sun, 12 Dec 2002
Electronics packaging materials suppliers traditionally have functioned as developers of continuously evolving formulations that enhance both component and assembly performance and reliability.

APEX Product Preview

Mon, 1 Jan 2001
The second annual IPC SMEMA Council Electronics Assembly Process Exhibition and Conference (APEX) will be held at the San Diego Convention Center, January 14-18, 2001

Market outlook 2001

Mon, 1 Jan 2001
There are a variety of factors indicating that 2001 could be an interesting year for forecasting. PC sales are down and so is the communications market

New Products

Mon, 1 Jan 2001
Laser Height Sensor
The new CCD noncontact laser height sensor for the Millennium Series M-2000 system is said to provide high-speed dispense height measurement for delicate substrates, hybrids and ICs that may be compromised by tactile sensing

Breaking the solder barrier

Mon, 1 Jan 2001
As the electronics manufacturing industry moves into a new century, it finds itself searching to create a more environmentally friendly manufacturing environment

Kicking off 2001

Mon, 1 Jan 2001
Beginning a new year always conjures up all sorts of resolutions... organizing your desk (because it might be condemned by the local fire marshal)...eating the "right" foods (we'll bypass the whole dieting thing altogether)...maybe even setting aside more savings (so we can retire sooner?)

Step 1: The back-end process

Mon, 1 Jan 2001
During the past 30 years, dicing systems and blades have been continuously improved to address process challenges and accommodate the requirements of different types of substrates

Improving flip-chip manufacturing through proper cleaning

Mon, 1 Jan 2001
Incorporating cleaning into the manufacturing process can increase throughput, performance and yield

CSP devices on printed wiring boards

Mon, 1 Jan 2001
Second-level reliability characterization using temperature cycling

Chip/package co-design

Fri, 6 Jun 2001
Because of deep sub-micron technology, chips now contain more functionality and are being driven to higher performance levels than ever before. At the same time, manufacturing technology is undergoing rapid change, and mixed analog/digital logic can now be placed on the same die

CSP and flip chip underfill

Fri, 6 Jun 2001
Optimizing production throughput by leveraging dual-lane dispensing

May Day Party

Tue, 5 May 2001
Cathy was driving her daughter, Kathy, to the Advanced Packaging May Day party. Cathy planned to be there 15 minutes early (to straighten the ribbons in Kathy's hair) by driving 60 mph on the highway and 30 mph on the 20-mile stretch of side road.

New Products

Tue, 5 May 2001
The Model 410 flip chip bonder can now be ordered equipped with thermosonic bonding capability that satisfies a range of applications, including small microwave and optical devices, and large devices with substantial bump counts requiring high bond loads

Buddy, can you spare a dime? (You can keep your stock options!)

Tue, 5 May 2001
During the past few years, stock options have become an increasingly popular component in nego tiating employment packages. For attracting new employees, retaining current employees, and encouraging company longevity and loyalty, stock options have been key

Movers and shakers

Tue, 5 May 2001
Asymtek (Carlsbad, Calif.) has named Bill Donges product manager of conformal coatings, David Canny technical process manager, and Joe Curran technical support manager for western North America

LSI Logic ready for lead-free

Tue, 5 May 2001
In a response to industry demand for lead-free products and, more specifically, to customer projections to implement lead-free processes, LSI Logic Corp. has introduced a set of lead-free ball grid arrays (BGAs) for use in communication and storage products

Unpack your suitcase

Tue, 5 May 2001
Finally, the summer months are upon us. Oftentimes, this can translate into less business travel, as trade shows wind down (revving up for the big SEMICON West show, I suppose) and there are fewer conferences

The back-end process: Step 5 - Encapsulation step by step

Tue, 5 May 2001
The demand for high-performance, high-density semiconductor assemblies continually pushes materials suppliers and packaging engineers to develop enhanced integrated circuit (IC) package designs

Plasma technology and integrated circuits

Tue, 5 May 2001
Critical plasma processing parameters for improved strength of wire bonds

Packaging of liquid crystal on silicon microdisplays

Tue, 5 May 2001
LCoS manufacturing incorporates both traditional and novel packaging methods

Computer simulations of solder joint reliability tests

Tue, 5 May 2001
In the microelectronics industry, reliability of a package is usually assessed by the integrity of its solder joints. Tin-lead eutectic and near-eutectic solder alloys are the most commonly used bonding materials in electronic packaging, providing electrical and thermal interconnection, as well as mechanical support

The back-end process: Step 4 - Wire bonding step by step

Sun, 4 Apr 2001
In the semiconductor and overall electronics industry, the move continues unabated toward further miniaturizing of packages, components and modules while also increasing their functionality

Bluetooth designs

Sun, 4 Apr 2001
How low-temperature co-fired ceramic substrate can maximize performance

Bumping technology

Sun, 4 Apr 2001
Addressing industrial issues is key

The Boxes for Birthday Presents

Thu, 2 Feb 2001
Tom, the older brother, made a rectangular box in which to pack his father's birthday present. The box was one foot in height, with a base diagonal of 37 inches

Web Watch

Thu, 2 Feb 2001
Scapa Tapes has recently redesigned its Web site, www.scapatapesna.com, with improved features and expanded information

Movers and shakers

Thu, 2 Feb 2001
Exatron Inc., San Jose, Calif., has announced the appointments of Bo Mendoza to customer relations manager, Bob Garcia to particle interconnect product manager, and Denise Smith as particle interconnect coordinator

Meeting wrap-up

Thu, 2 Feb 2001
Lively discussions charge lead-free solder implementation summit

Briefly speaking

Thu, 2 Feb 2001
Advanced Semiconductor Engineering Inc. (ASE) has opened its Chungli Intelligent Industrial Park, which combines the services of a group of ASE companies

Solid growth in 2000 for semiconductor market

Thu, 2 Feb 2001
The worldwide semiconductor market closed 2000 by marking a 31-percent increase over 1999 revenues to reach figures of $222.1 billion, according to preliminary results from a Dataquest Inc.

Technology licensing

Thu, 2 Feb 2001
Technology licensing is prolific in many industries, including the pharmaceutical and biotechnology arenas, and is used heavily for consumer products

EtroniX preview

Thu, 2 Feb 2001
EtroniX is a multi-disciplinary event that will feature automated design tools, components, test, production, packaging and more

New products

Thu, 2 Feb 2001
Benchtop Lead Attach Machine
Die-Tech's Model 3005 attaches single in-line placement leadframes to substrates and is an alternative to hand-tooling

Environmentally conscious electronics

Sun, 4 Apr 2001
A trend driven by global regulations and aggressive marketing strategies

Lead-free packaging

Sun, 4 Apr 2001
Investigating pure tin as an alternative finish

Alice Meets the Infamous Mad Hatter

Sun, 4 Apr 2001
At his tea party, the Mad Hatter said, "I have noticed something about my age. If you add the square of its second digit to twice the square of its first digit, you get the same number as my age."

Entering the photonics world of packaging

Sun, 4 Apr 2001
If you're like many engineers, you may have recently developed a curious interest in the photonics industry. This interest was likely piqued by the packaging technology employed for photonics or by the way packaging applies to optoelectronic components and modules

New products

Sun, 4 Apr 2001
A new line of thermoelectric/solid state air conditioners provides a broad range of thermoelectric cooling and heating protection in laser-based systems, scientific instruments and computer control packages for industrial and military applications

Movers and shakers

Sun, 4 Apr 2001
ASAT Inc. (Fremont, Calif.), has received the second annual Bob Graham Award presented by Semiconductor Equipment and Materials International (SEMI)

WEB WATCH

Sun, 4 Apr 2001
Lytron Inc. has announced an updated version of its Thermal Reference Guide at www.lytron.com. The online guide provides specifications, performance data and selection guidelines for the company's full line of thermal management products

In the news

Sun, 4 Apr 2001
Unitive announces venture in Taiwan

The glitch we can't stop talking about

Sun, 4 Apr 2001
Mention the word "dot-com" lately and undoubtedly your co-workers will give you a mixed bag of comments, from the "I told you so" naysayers to the "You haven't seen nothin' yet" optimists

New age manufacturing systems

Sun, 4 Apr 2001
Now we are entering a 'New Age' of manufacturing systems, which places emphasis on the elimination of waste and the reduction of inefficiencies...

Technology comparisons and the economics of flip chip packaging

Thu, 3 Mar 2001
The decision to use flip chip packaging is not a simple one. Many equipment, product, and process variables affect the relative merits of flip chip vs. wire bonded packages

From dicing to packing: Examining the packaging process

Thu, 3 Mar 2001
Despite the many advances in assembly manufacturing since the IC was invented, the basic process has not changed significantly

C4 makes way for electroplated bumps

Thu, 3 Mar 2001
Until recently, controlled collapse chip connection bump technology, developed in the late 1960s, provided a reliable interconnect for high-performance, leading-edge microprocessors

The back-end process: Step 3 - Die attach step by step

Thu, 3 Mar 2001
In the past, most integrated circuit (IC) packages used wirebonding as the interconnect technology between chip and leadframe

Advanced tools for HDI design

Thu, 3 Mar 2001
Build-up substrates and next-generation design tools Contribute to the miniaturization of electronics

Lithography requirements for 300-mm WLP

Sun, 7 Jul 2001
Photodefinable polyimide addresses packaging challenges

Automated ribbon bonding

Sun, 7 Jul 2001
The extent of the commercial marketplace for high-frequency devices requires high-quality, high-volume ribbon bonding. The ability to automatically bond ribbon wire with consistency is important for producing the required electrical and mechanical performance

Automation of optoelectronic assembly

Sun, 7 Jul 2001
Advances in automating first-level interconnection of optoelectronic components are essential to reducing costs in the optical network

New products

Fri, 6 Jun 2001
Each month, Advanced Packaging brings you information on the newest products and services in the semiconductor packaging arena, so that you can stay abreast of the myriad of solutions available to you. From coatings and encapsulants, from design software to custom packages, these pages are consistently filled with product specifications to help you learn of new products and services

Divide and Conquer?

Tue, 10 Oct 2002
The packaging world has seen profound changes over the decades and we may be faced with another one shortly.

Think Tank

Tue, 10 Oct 2002
Margaret, who saw Alf, Ben and Chuck exchange sports cards, asked, "How many cards do you guys have?"

The back-end process: Step 9
QFN Singulation

Sun, 9 Sep 2002
Two processes compared

Automated MEMS assembly

Sun, 9 Sep 2002
Design and process issues in optoelectronics

Solder bump inspection

Sun, 9 Sep 2002
Evaluating new flip chip designs

The X-ray Inspection Revolution

Sun, 9 Sep 2002
Pinpointing one pivotal advancement in X-ray inspection technology over the past decade is impossible given the many noteworthy innovations in recent years

Shining Stars of the Industry

Sun, 9 Sep 2002
Second Annual Advanced Packaging Awards

Think Tank

Sun, 9 Sep 2002
Little David went to the post office to buy stamps for his father. When he reached the counter, he had forgotten what his father wanted. From what he remembered, he asked the clerk for some 1-cent stamps; six times as many 5-cent stamps and 25-cent stamps for the remainder of the $4.00 his father had given him

New products

Sun, 9 Sep 2002
For more information, circle the corresponding numbers on the reader service card and mail back. For faster results, fax the card to 413-637-4343, or visit www.onlinecenter.to/ap.

SEMICON West Headlines

Sun, 9 Sep 2002
SAN JOSE, CALIF. - Below are some of the many press releases announced during SEMICON West. Visit the Advanced Packaging Web site at www.apmag.com to find links to all these and other stories from SEMICON West.

News

Thu, 11 Nov 2001
Kyocera America Inc. has introduced the industry's first flip chip build-up substrate that is capable of withstanding 260?C solder reflow, which is necessary for lead-free processing

New Products

Thu, 11 Nov 2001
Abletherm 3100 is a new family of advanced thermal interface materials for high-performance, flip chip BGA packages

Hang around - the fun is just beginning

Thu, 11 Nov 2001
If you want to see the future of packaging, check out "Brain-Implantable Biomimetic Electronics as the Next Era in Neural Prosthetics" in the July 2001 issue of Proceedings of the IEEE

Movers and Shakers

Mon, 10 Oct 2001
Unitive Inc. (Research Triangle Park, N.C.) has announced the retirement of chief executive officer Wayne Machon. The office of CEO will be filled by Ken Donahue, the company's former chief financial officer.

Web Watch

Mon, 10 Oct 2001
Aries Electronics (Frenchtown, N.J.) has expanded the RF test socket segment of its Web site. The expanded site now features a full listing of design footprints for both manual and automatic applications

News

Mon, 10 Oct 2001
Electronic Trend Publications Inc. (ETP) has recently released the eighth edition of "The Worldwide Contract Electronics Manufacturing Services Market" report, wherein it predicts that "growth will continue

Back-end assembly: Closing the traceability gap

Mon, 10 Oct 2001
In semiconductor manufacturing, the high value of semiconductor wafers has traditionally placed a heightened emphasis on wafer traceability - the ability to automatically track a wafer through the fabrication process

Curious Al

Mon, 10 Oct 2001
Curious Al just had to know the height of the lightning rod atop the church, which had a foundation that was 20 feet above water level. Being resourceful, he planted a 14-foot-long pole vertically in the ground

New Products

Mon, 10 Oct 2001
The Easy Release X Form dispensing tips are designed for conductive epoxy dispensing in die-bonding applications

"Total Solutions" vs. "Core Competencies"

Mon, 10 Oct 2001
Many equipment and material suppliers in our industry talk about providing "total solutions" to their customers, rather than just a piece of equipment or batch of material

PTFE Coatings

Sat, 4 Apr 2000
Calfornia Fine Wire offers polytetraflouroethylene (PTFE) coatings that can be enameled to almost all of its 1,000 metals and alloys. A proprietary process applies liquified PTFE to fine wires in continuous lengths of up to 10,000 feet. The wire is then run through a furnace to set the coating. The coating is said to be a good insulator, with a dielectric strength of 5,000 volts.

3-D and 2-D Microscope

Sat, 4 Apr 2000
The Combizoom 400 microscope integrates a two lens objective shuttle with a 1:12 zoom stereomicroscope, creating an effective zoom range from 10x to 350x magnification with a free working distance of 30 mm. The product provides both macro 3-D and micro 2-D inspection, and its stand comes with both coaxial fiberoptic illumination and oblique fiberoptic side lighting. Customer specifications can be accommodated.

PC-based Board Tester

Sat, 4 Apr 2000
The TracerMDA provides sophisticated in-circuit test capabilities, accurately and reliably measuring board level resistors, capacitors, inductors, diodes, transistors and IC clamping diodes. According to the company, the system can detect assembly failures, such as SMT opens, missing components, shorts, open traces, solder bridges and improperly inserted components with minimal programming time and maximum throughput. The test head control module plugs into any industry standard PC; the main sys

Dispensing Needles

Sat, 4 Apr 2000
Easy Release custom dispensing needles are designed for precise, repeatable application of encapsulation and underfill material. Encapsulation needles feature the standard conically chamfered tip that ensures complete transfer of material from the needle to the substrate or package. Underfill needles feature a "relieved" tip that allows the needle to be adjacent to the chip for better wicking action. Needles are available in 11 to 30 gauge in .250- to .350-in. lengths.

Manual Conditioner

Sat, 4 Apr 2000
The benchtop Dana MLCS-1, with a footprint of 10 x 10 in., can recondition packages with 0.5-mm pitch (.020-in.) in less than 90 seconds, restoring lead pitch, sweep, standoff and coplanarity per Jedec standards. The part is clamped into a holding nest and the operator moves a gearshift-like lever through short guided strokes to process the component one side at a time. The leads are oscillated left and right, and then they are combed, while up and down movement simultaneously occurs to correct

K&S gets serious...about saws

Sat, 4 Apr 2000
For years, Kulicke & Soffa has been the market leader in wire bond technology. From time to time, companies from Japan and Switzerland challenge its market share or technology position but, in the long run, K&S has come out on top. While the company has dabbled in other assembly equipment products, such as die bonders, dicing saws and autolines, its main focus and most effective resources were always applied to the wire bond product sector. Some have joked that if the equipment didn`t have a "W"

The springtime swirl

Sat, 4 Apr 2000
As springtime activities spin around us, everyone at Advanced Packaging magazine is squeezing in time to dash off to the dry cleaners, pack suitcases and make last-minute limo reservations for the litany of upcoming shows we plan to attend. By the time this issue goes to press, we will have just completed trips to NEPCON West, APEX 2000 and IMAPS` International Symposium on Advanced Packaging Materials. We certainly understand the importance of getting away from our desks and talking with reader

To better reflect the current nature of its business, Sunnyvale, Calif.-based Transition Technology International and its manufacturing division

Sat, 4 Apr 2000
To better reflect the current nature of its business, Sunnyvale, Calif.-based Transition Technology International and its manufacturing division, Silicon 2000, have changed their names to TTI Silicon. The company has also leased an additional 10,000 square feet of manufacturing space at its Vancouver, Wash., site.

Techcon Systems Inc. has relocated its corporate headquarters from Carson, Calif., to a 50,800 square foot facility at 12151 Monarch Street, Garden Grove, Calif. 92841; tel: 714-799-9910.

Sat, 4 Apr 2000

ScanCAD International Inc., Morrison, Colo., and JD Photo-Tools have announced a distributor agreement to sell ScanCAD programming and inspection workstations in the UK.

Sat, 4 Apr 2000

onQ Technology, Austin, Texas, has opened a 15,000 square foot manufacturing and customer support facility in the Philippines to provide back-end packaging services.

Sat, 4 Apr 2000

International Rectifier, El Segundo, Calif., has opened a North American automotive sales office at 26200 Town Center Drive, Suite 265, Novi, MI 48375; tel: 248-347-1830.

Sat, 4 Apr 2000

Semiconductor Equipment and Materials International, Tokyo, Japan, has named Hidehiko Katoh director of worldwide flat panel display operations.

Sat, 4 Apr 2000

Entegris Inc., Chaska, Minn., has promoted Michael Wright to senior vice president of corporate marketing.

Sat, 4 Apr 2000

Addison, Ill.-based PCT Automation Systems Corp. has promoted H. Paul Hickman to president, Brian Harstine to chief operating officer and James Wersching to director of sales.

Sat, 4 Apr 2000

ViTechnology LLC, Haverhill, Mass., has appointed Holly Roche to sales coordinator for automated optical inspection systems.

Sat, 4 Apr 2000

Quad Systems Corp., Willow Grove, Pa., has appointed Ted Shoneck to chief executive officer.

Sat, 4 Apr 2000

SMTA International 2000 comes to Chicago

Sat, 4 Apr 2000
NORWALK, CONN. - The Surface Mount Technology Association (SMTA) is moving its flagship technical conference, SMTA International 2000, to the Rosemont Convention Center near Chicago. The show will take place September 24-28. Assembly Technology Expo will also relocate to the Rosemont Convention Center and will be held September 26-28.

Driver IC shortage to hurt Taiwan?

Sat, 4 Apr 2000
TAIPEI - Prices of thin-film transistor liquid-crystal displays (TFT-LCDs) have been rising since the third quarter of 1999 due to a severe shortage, according to Nikkei Business reports. The price increases have prompted TFT-LCD makers in Japan, Korea and Taiwan to expand operations, which in turn has resulted in a paucity of key components. The shortage of driver integrated circuits (ICs) will affect Taiwan manufacturers` expansion plans in 2000, according to market analysts.

IBM tops speeds on computer circuits

Sat, 4 Apr 2000
IBM Research has announced breakthrough results in developing a family of experimental high-speed computer circuits that run at test speeds up to five times faster than today`s top chips. The new circuits employ an innovative design called Interlocked Pipelined CMOS (complementary metal oxide semiconductor) to reach speeds of 3.3 to 4.5 billion cycles per second (3.3 to 4.5 GHz) using conventional silicon transistors, while dramatically reducing power consumption. IBM researchers estimate that c

Micronic sues Etec Systems

Sat, 4 Apr 2000
Micronic Laser Systems AB has commenced a court action in a U.S. federal court against Etec Systems Inc. Micronic filed the litigation against Etec, a competitor of Micronic in the market for laser pattern generation equipment, in response to statements by Etec allegedly purporting to indicate that Micronic may be infringing certain Etec U.S. patents. Micronic`s action alleges that Micronic does not infringe the patents in question and that Etec`s patents may be invalid.

ECTC meets in Las Vegas

Sat, 4 Apr 2000
The Electronic Components and Technology Conference (ECTC) will celebrate its 50th anniversary May 21-24 at Caesar`s Palace in Las Vegas. The conference is expected to attract more than 800 designers, engineers and technical managers from the packaging, components and materials segments of the electronics industry. The meeting features more than 300 technical papers, short courses, a review of educational programs and initiatives in packaging, and a technology corner featuring exhibits by leadin

Combo Memory agreement

Sat, 4 Apr 2000
APack Technologies Inc., the first wafer bumping and flip chip foundry service provider in Taiwan, signed a memorandum of understanding (MOU) with Itochu Corp., Linvex Finet Japan and Siix Corp. for joint development and promotion of Combo Memory to the worldwide market. The Combo Memory module stacks SRAM and flash memory components to fulfill the small form-factor requirement of wireless communication handsets. According to the MOU, APack will provide its packaging design and manufacturing kno

The back-end process: Step 12 - Packing and shipping Material integrity issues

Sat, 12 Dec 2001
The supplies used to protect and transport critical materials in the semiconductor industry are becoming more consequential in the current business and technical environment

Lithography for advanced packaging

Sat, 12 Dec 2001
Solutions for wafer edge processing

Progress!

Fri, 11 Nov 2002
Editors and other people with the luxury of observing and commenting have been exhorting the packaging part of the semiconductor industry to work more closely with the front-end portion of it.

Package Marking Lasers and other options

Tue, 10 Oct 2002
For many years, semiconductor package marking commanded little attention and continued with little change.

Design for reliability

Tue, 10 Oct 2002
Package and Board-level Reliability Analysis with CAE

A Novel MCM Technology

Tue, 10 Oct 2002
Multilayer thin film interconnect on a laminate substrate

Wafer Bumping Solutions Consumer to advanced applications

Tue, 10 Oct 2002
Wafer bumping technology recently has attracted considerable attention in the high-end computing and networking markets, primarily because this technology has enabled high performance for high-density MPU, ASIC and memory device structures.

Preparing for Next-generation Electronics

Tue, 10 Oct 2002
Since the early 1990s people have been excited about a new generation of consumer electronics — a true "anything, anytime, anywhere" generation that would enable instant communications through a wide range of devices.

U.K. Companies Find Packaging Niches

Tue, 10 Oct 2002
LONDON — The United Kingdom is not known as a critical location for semiconductor packaging, but there are numerous companies doing some very interesting work there.

Unitive to Install 300 mm Bumping Line

Tue, 10 Oct 2002
RESEARCH TRIANGLE PARK, N.C. — Unitive announced its intent to install a 300 mm production line and support for electroplated wafer bumping and WLP.

Advanpack Announces Fine-Pitch Lead-free Bumping

Tue, 10 Oct 2002
SINGAPORE — Advanpack Solutions PTE Ltd. (APS), a packaging developer and contract wafer bumper, announced a new capability to meet the legislative restrictions imposed by the European Commission that require lead-free electronics packaging by January 1, 2006.

ASE Introduces Three-tier Fine-pitch Wire Bonding

Tue, 10 Oct 2002
SANTA CLARA, CALIF. — Advanced Semiconductor Engineering Inc. (ASE) announced a new wire bonding technology with three tiers of fine-pitch wire bonds.

Consolidation Among Taiwan's Subcontractors

Tue, 10 Oct 2002
HSINCHU and KAOHSIUNG, TAIWAN — Chipbond Technology Corp. and Fupo Electronics Corp., two Taiwan-based packaging subcontractors, will merge.

EEMS Expands 300 mm Packaging Capability

Tue, 10 Oct 2002
RIETI, ITALY — Assembly and test subcontractor EEMS Italia Spa is increasing its 300 mm capabilities by placing a repeat order for a 300 mm dicing and grinding system from Disco Corp. of Tokyo.

Wafer-level Packaging Evolves and Grows

Tue, 10 Oct 2002
MEPTEC's latest one-day symposium, "International Wafer- level Packaging Conference: The Convergence of Fab and Assembly," focused on one of the hottest topics in the industry.

AIT and Nakaya Microdevices Form Joint Venture

Tue, 10 Oct 2002
TOKYO AND PLEASANTON, CALIF. — Advanced Interconnect Technologies (AIT) and Nakaya Microdevices Corp. of Japan have created a joint venture to provide subcontract assembly and test services to Japan.

Invensas, Allvia ink 3D IC tie-up

Tue, 11 Nov 2011

Invensas has "acquired" dozens of 3D IC packaging patents from Allvia, and the two have agreed to further collaboration in the area.


3D packaging enters the mainstream: Attend the conference

Tue, 11 Nov 2011

2.5D, 3D and Beyond - Bringing 3D Integration to the Packaging Mainstream will take place November 9 in Santa Clara, CA. The MEPTEC conference follows the trend of 3D and 2.5D packaging moving from roadmap to factory production.


ONNN update: Thai floods close Rojana SATS ops indefinitely

Mon, 10 Oct 2011

ON Semi believes that its SANYO Semiconductor division's Thai operations in the Rojana Industrial Park have been severely damaged by Thailand's flood. Another facility in Bang Pa In, previously unaffected, is now flooded. ONNN says none of its employees in Thailand have been endangered by flood waters on-site.


Spansion consolidates test and assembly ops

Mon, 10 Oct 2011

Spansion Inc. (NYSE:CODE) will consolidate its 2 semiconductor assembly and test services (SATS) operations, closing its facility in Kuala Lumpur, Malaysia, to reduce costs by about $30 million annually.


Multitest vertical contact test probe technology eschews barrels

Fri, 10 Oct 2011

Multitest debuted the Quad Tech concept, next-generation vertical contact technology with a barrel-less architecture.


Global Unichip focuses on ASIC biz

Fri, 10 Oct 2011

Global Unichip Corp. (GUC; TW:3443) refined its business and technology model to become a full-service, flexible ASIC company. President Jim Lai refers to the model as GUC's branded Flexible ASIC Model, covering SoC integration, implementation methodologies, and integrated manufacturing.


TSV fab tool combines stress-free CMP with thermal flow etch

Fri, 10 Oct 2011

ACM Research Shanghai, Ltd., introduced the integrated Ultra iSFP stress-free polishing (SFP) semiconductor manufacturing tool for 65-45nm copper (Cu) interconnects, improving through silicon vias (TSV) with better heat dissipation.


OmniVision faces lawsuit over lost Apple image sensor contract

Thu, 10 Oct 2011

Levi & Korsinsky is bringing a class action lawsuit against OmniVision Technologies Inc. (NASDAQ:OVTI) on behalf of stockholders that allege that OmniVision failed to disclose properly the loss of an exclusive contract with Apple for image sensors, in-house production delays, as well as other counts.


EVG launches ZoneBond-capable modules

Thu, 10 Oct 2011

EV Group (EVG) launched a suite of temporary bonding and debonding equipment modules that support ZoneBOND technology.


Lasers package ultrathin semiconductors at low cost, high volume

Wed, 10 Oct 2011

North Dakota State University, Fargo, researchers have developed a packaging technology using Thermo-Mechanical Selective Laser Assisted Die Transfer (tmSLADT) to reduce the size and cost of microelectronics packages.


Xilinx FPGA boasts 6.8B transistors

Tue, 10 Oct 2011

Xilinx Inc. (Nasdaq:XLNX) began shipping its Virtex-7 2000T field programmable gate array (FPGA), a programmable logic device with 6.8 billion transistors: 2 million logic cells, a die-stack architecture, low power consumption, and a more flexible design than large ASICS and monolithic FPGAs.


Brewer Science, EVG commercialize temporary wafer bonding with zoning laws

Thu, 10 Oct 2011

Brewer Science Inc. and EV Group (EVG) will both commercialize ZoneBOND technology for temporary wafer bonding, thin wafer processing, and debonding applications.


TSV electroplating dev team unites SVTC, Amerimade Technology, Shanghai Sinyang Semiconductor Materials

Wed, 10 Oct 2011

Nanotech accelerator SVTC Technologies, wet chem equipment maker Amerimade Technology, and chemicals company Shanghai Sinyang Semiconductor Materials will collaborate on electroplating processes for TSV that are production-ready for advanced packages and MEMS.


Nantong Fujitsu Microelectronics installs NEXX tool for copper pillar, RDL packaging

Wed, 10 Oct 2011

NEXX Systems shipped a Stratus electrochemical deposition tool to Nantong Fujitsu Microelectronics Co. Ltd. (NFME), based in Jiangsu province, China. NFME will use the Stratus for copper pillar and RDL advanced packaging applications.


SUSS MicroTec wins thin-wafer temporary bonder order

Tue, 10 Oct 2011

SUSS MicroTec, in partnership with temporary bonding adhesive maker TMAT, will deliver SUSS MicroTec's new-generation high-volume temporary wafer bond tool clusters to a leading IDM.


MVTS expands in California, Malaysia, and Taiwan

Tue, 10 Oct 2011

MVTS Technologies opened new offices in San Jose, CA; Penang, Malaysia; and Hsinchu, Taiwan to support growing demand for test, assembly, and other IC production equipment and services among semiconductor manufacturers.


Air-cooled wafer probe chuck debuts in modular format

Mon, 10 Oct 2011

ERS uncrated the ERS AirCool 3 wafer thermal test system with modular options and easy integration into all major wafer prober systems.


IMAPS: Markovich takes reins, Jones given Lifetime Achievement Award

Fri, 10 Oct 2011

At the IMAPS 44th International Symposium on Microelectronics in Long Beach, CA, Voya Markovich, well-known industry PCB and packaging expert, took over the reins as the organization

IMAPS semiconductor packaging award bestowed on Nordson Asymtek's Adamson

Fri, 10 Oct 2011

Steven J. Adamson, marketing specialist with Nordson ASYMTEK, received the Daniel C. Hughes, Jr., Memorial Award, for the greatest contribution to IMAPS and the microelectronics packaging industry.


Fraunhofer, EVG develop temporary wafer bonding for thicker die

Tue, 10 Oct 2011

EV Group (EVG) will work with Fraunhofer IZM's ASSID research center to develop temporary bonding/debonding technologies for thicker die structures, some as large as 600

CSCD probe head accurately tests high-frequency devices on small pads

Tue, 10 Oct 2011

Cascade Microtech Inc. debuted InfinityQuad, a multi-contact probe head capable of automatically probing aluminum (Al), copper (cu), or gold (Au) pads as small as 30 x 50

Fraunhofer IZM's packaging center installs Altatech CVD

Tue, 10 Oct 2011

All Silicon System Integration Dresden (ASSID) installed an Altatech 300mm CVD tool for dielectric film deposition on advanced through silicon vias (TSV), with diameters as small as 10

DuPont LTCC material suits 50GHz+ electronics

Fri, 10 Oct 2011

DuPont Microcircuit Materials, part of DuPont Electronics & Communications, uncrated its DuPont GreenTape 9K5 low temperature co-fired ceramic (LTCC) packaging material, offering good dielectric constant properties for higher speed, frequency, and reliability applications.


Multitest wins gravity test handler order for leaded and leadless package test

Thu, 10 Oct 2011

Test equipment provider Multitest installed a MT9928 XM Gravity Test Handler at a semiconductor production facility after a 1-year+ benchmarking against two major competitors.


Thin wafers win majority in electronics by 2016

Thu, 10 Oct 2011

Thanks to MEMS, 3D packaging, LEDs, power devices, and other applications, thinned wafers will be the majority of wafers in the market by 2016, according to Yole D

ADI unveils digital isolator package to meet 8mm creepage reqs

Wed, 10 Oct 2011

Analog Devices Inc. (ADI) introduced a packaging technology for digital isolators that achieves a minimum of 8mm creepage distance required by global industry standards to ensure safe operation in high-voltage medical and industrial applications.


Tamar Technology debuts TSV metrology tool WaferScan

Tue, 10 Oct 2011

Tamar Technology shipped its first fully automated WaferScan system to a major semiconductor fab. The system performs TSV etch depth, deep trench depth, wafer thickness, photo-resist thickness, and hole diameter metrology.


IMAPS 2011 preview

Mon, 10 Oct 2011

IMAPS 2011, the 44th International Symposium on Microelectronics, will take place in less than one week at the Long Beach Convention Center. Ahead of the show, here are some of the highlights for attendees.


Rudolph wins TSV inspection systems order

Mon, 10 Oct 2011

Rudolph Technologies Inc. (NASDAQ:RTEC) shipped its Wafer Scanner 3880 3D Inspection System, multiple NSX Macro Defect Inspection Systems and its Discover Yield Management Software Suite to a leading semiconductor manufacturer for use in developing through silicon via (TSV) structures.


Toshiba selling Amkor its Malaysian SATS ops

Fri, 9 Sep 2011

Amkor will acquire Toshiba Electronics Malaysia Sdn. Bhd., Toshiba

Samsung embedded memory fits 8 die in 1.4mm stack

Thu, 9 Sep 2011

Samsung Electronics Co. Ltd. developed a high-performance 64GB embedded memory with 64Gb NAND. The package contains an 8 die stack in a low profile for smartphones, tablets and other mobile devices.


Epson inkjet semiconductor marking system prevents die damage

Tue, 9 Sep 2011

Seiko Epson Corporation introduced the IP-2000 inkjet semiconductor marking system to print identification data on the surface of a semiconductor package without the danger of damage from laser cutting


CSCD completes test socket biz sale, authorizes stock repurchase

Tue, 9 Sep 2011

Cascade Microtech (NASDAQ:CSCD) completed the sale of its test socket manufacturing business for $550,000 to R&D Interconnect Solutions. Cascade's board of directors also authorized a stock repurchase program under which up to $2,000,000 of its common stock may be repurchased.


Ziptronix low-temp direct oxide bonding scales pixels to 0.7

Tue, 9 Sep 2011

In a podcast interview with ElectroIQ.com, Ziptronix president & CEO, Daniel Donabedian, and company CTO, Paul Enquist, discussed both the Ziptronix wafer bonding technology and their partnership with Sony.


Embedded RF Component and Devices in 3D LCP Package, Part 2

Thu, 8 Aug 2008
Laminated Thin Film Resistors on LCP
By Swapan K. Bhattacharya, Stephen Horst, and John Papapolymerou, Georgia Institute of Technology
Embedded resistors are generally implemented with either thick- or thin-film processes. Thin-film processes use a variety of metal alloys usually deposited by sputtering process under vacuum An alternative to this approach involves the use of commercially available resistive films on a carrier conductive copper foil.5-8

High Conductivity Thermal Greases

Mon, 8 Aug 2008
LORD Corporation's high thermal conductivity greases are designed to maximize heat transfer from high-end chips to the heat spreader. As chips continue to significantly increase in heat, they need more efficient methods of heat removal. Thermal grease reportedly saves time and energy costs as it does not require a cure step.

High-speed Test Handler

Mon, 8 Aug 2008
Delta Design's high-speed test handler, the MATRiX, was designed to handle small, fine-pitch packages while increasing equipment utilization and throughput. This tri-temperature handler is said to achieve 3

Next-generation Test Socket

Mon, 8 Aug 2008
Multitest's latest test socket generation, the nanoKelvin, was designed to suit automotive applications on various handler brands. The socket is available in standard and plunge-to-board design, both without any limitations for its Kelvin capability. nanoKelvin is suitable for small pad sizes such as CSPs, smallest QFN, SO and QFP.

Stress-free Epoxy
Cotronics, Corp.

Mon, 11 Nov 2008
Duralco 125 stress-free epoxy from Cotronics Corp. forms a flexible, electrically conductive bond for continuous use to 400°F. It reportedly provides outstanding electrical conductivity, high bond strength, thermal and mechanical shock resistance, adhesion to dissimilar substrates, and chemical resistance.

Single Mode Green Laser

Mon, 11 Nov 2008
AVIA 532-45 from Coherent, Inc. is a powerful diode-pumped, solid state green laser that delivers diffraction-limited output. This laser is said to provide 45W of average power (at 120 kHz) at 532nm, in a single mode output beam (M2 < 1.3).

Inspection Software

Mon, 11 Nov 2008
Inspect-X 1.5 software from Metris was developed to streamline system operations in computed tomography (CT) applications and X-ray electronics inspection. The software offers an integrated setup wizard for optimized CT data acquisition, thereby reportedly reducing reconstruction time for a 3D volume model. In addition, software enhancements for electronics inspection facilitate operation and automation, which further improve inspection accuracy and repeatability.

High-speed Bondtester

Mon, 11 Nov 2008
High strain-rate bondtesting using the 4000HS is a technique for detecting brittle fracture failures in lead-free materials. The high-speed trigger capture software and rising table work holder for cold bump bondtesting are innovations built into the toolset. Bond failure energy measurements make it possible to detect subtle differences between solder materials, bump metallization, and process parameter changes.

Convertible Laser Workstation

Mon, 11 Nov 2008
The IX-100-C from J. P. Sercel Associates Inc. (JPSA) was developed for R&D labs and universities searching for an affordable and flexible system in a compact footprint. A variety of accessories and options allow the system to be used with wavelengths from 157nm through 1064nm. Innovative galvanometer technology reportedly permits f-theta lens from 100mm to 254mm focal length to be used with fields-of-view up to 170mm

Thermoelectric Cooler

Mon, 11 Nov 2008
The OptoCooler HV series, a new class of RoHS-compliant high voltage, heat pumping thermoelectric coolers, has been optimized for standard circuitry and power requirements. The OptoCooler HV14, the first module in the series, has been designed for the optoelectronics and telecom industry.

Oerlikon Esec and M

Wed, 11 Nov 2008
(November 26, 2008) CHAM, Switzerland and RODING, Germany, — Oerlikon Esec, semiconductor equipment manufacturer, and M

STATS ChipPAC Expands QFN Portfolio

Tue, 11 Nov 2008
(November 24, 2008) SINGAPORE — STATS ChipPAC Ltd. has expanded its quad flat no-lead (QFN) packaging portfolio with a strip-etch version for applications requiring increased design flexibility and higher input/output (I/O) performance in a small, thin package profile. The new QFN package family, referred to as QFNs-se, reportedly features a higher number of very thin I/O terminal pads than conventional single or dual-row QFN or leadframe-based quad flat packages (QFPs).

EV Group Reports Continued Growth

Thu, 11 Nov 2008
(November 20, 2008) ST. FLORIAN, Austria,— Crediting the continued demand in the 3D interconnect interconnect/through-silicon via (TSV) an nanoimprint lithography markets, EV Group reports an increase in revenue for 2008 of more than 15%. Despite the current global economic slowdown, the company says it remains cautiously optimistic about its outlook for 2009 given the expected growth opportunities to ensue as these novel technologies gain market acceptance/penetration.

electronica 2008 Highlights

Thu, 11 Nov 2008
(November 20, 2008) MUNICH, Germany — electronica 2008 attendance was stable this year despite the difficult financial situation facing many exhibitors and attendees, reported event coordinators Messe München International (MMI). Of the 2,800 exhibitors, 58% were international. Around 72,000 people attended.

MEPTEC Symposium: Density and Cost is Driving Innovation

Tue, 11 Nov 2008
by Julia Goldstein, Ph.D. contributing editor
Speakers at MEPTEC's Packaging Developments and Innovations Symposium, November 13, 2008 in San Jose, CA, presented various new technologies to enable package miniaturization while keeping costs in check. Much of the focus was on materials innovations that optimize the existing infrastructure. One departure from that was discussions surrounding through silicon via (TSV) advancements.

Gartner Forecasts SATS Market Decline

Tue, 11 Nov 2008
(November 18, 2008) STAMFORD, CT — Following 3Q earnings reports of companies in the semiconductor assembly and test services (SATS) industry, Jim Walker, analyst, Gartner, reports yet another decline in projected sales to between 8% and 20% in the 4Q08. Walker cites the world financial crisis as the primary cause of the drop.

IMAPS International 2008 In Review

Mon, 11 Nov 2008
By Gail Flower, Editor-in-Chief
This year's IMAPS International Symposium had great international participation, good attendance and excellent presentations from keynoters to the technologically cutting-edge educational papers. It was election day when the IMAPS conference began, and by the second day of the conference, a new president entered the picture. Therefore, the first day proceeded without a rush of attendees as expected, but the second perked up with lively conversation.

IMEC and Panasonic Join Forces for CMOS Research

Fri, 11 Nov 2008
(November 14, 2008)OSAKA, Japan and LEUVEN, Belgium — IMEC and Panasonic Corporation have signed a joint research contract that will focus on advanced technologies in the semiconductor, networks, wireless, and biomedical fields. For this purpose, the Panasonic IMEC Center will be established at the IMEC premises in December 2008.

EV Group Appoints General Manager of Korean Subsidiary

Wed, 11 Nov 2008
(November 12, 2008) ST. FLORIAN, Austria — EV Group has appointed industry veteran, Weonsik Yang, Ph.D. as the new general manager of EV Group Korea Ltd. — the company's subsidiary in Seoul that opened earlier this year. In this role, Yang is charged with leading EVG's strategic efforts in the growing region, which includes strengthening the company's regional customer sales, service and support efforts, as well as expanding upon its existing R&D partnerships.

Amkor Licenses FusionQuad to ASAT

Mon, 11 Nov 2008
(November 10, 2008) CHANDLER, AZ — Amkor Technology, Inc. has announced a licensing agreement with ASAT Holdings LTD. for its FusionQuad package technology. This agreement will enable ASAT to manufacture packages based on Amkor's FusionQuad technology platform.

JPSA Laser names Charles E. Cuneo President

Mon, 11 Nov 2008
(November 10, 2008) MANCHESTER, NH — JPSA Laser announced the appointment of Charles E. Cuneo as its president. Cuneo takes over responsibilities from Jefferey P. Sercel, founder, who will continue on as chairman and chief scientist.

DuPont Teijin Films Joins Holst Centre Systems-in-Foil Research Program

Thu, 11 Nov 2008
(November 6, 2008) EINDHOVEN, the Netherlands — DuPont Teijin Films joined the systems-in-foil program of Holst Centre, a research initiative of the Flemish and Dutch research centers IMEC and TNO. DuPont Teijin, as a major substrate vendor, completes the ecosystem of industrial players for its systems-in-foil program line.

Dual-purpose 300mm dicing frame prober

Mon, 11 Nov 2008
The WDF 12DP is designed to address increased demand for probing ultrathin and diced wafers, and wafer-level testing of chip-scale and wafer-level packaging, stacked, and 3D technologies, as well as KGD testing of ultra-hin wafers, singulated wafers, and strips on a dicing frame.

Advisory Board

Mon, 11 Nov 2008

By R. Wayne Johnson, Ph.D., Auburn University

While $4/gal.gasoline prices have dropped, it is inevitable they will rise again. So what does this have to do with advanced packaging? A lot! While we hear discussions of alternate energy, we will continue to use oil for the foreseeable future. Electronics (and advanced packaging) are important for measurements during well drilling and for production management over the life of the well.


Multi Flip Chip Assembly for the Mass Market

Mon, 7 Jul 2008
By Christian Pichler, Datacon Technology GmbH
Originally targeted to high-end applications, flip chip assembly technology is rapidly finding its way into low-end applications for high-volume products with multiple chips, due to cheaper substrates and cost-effective bumping. This requires high speed and precision, which can be achieved cost-effectively by processing directly from the wafer using tried-and-tested, high-throughput flip-chip bonder platforms.

ECPR — Micro-cell Plating for Advanced Packaging

Mon, 7 Jul 2008
Affordable Accuracy at High Speeds By Patrik M

Packaging Requirements Key to Advancing Wafer Bonding Technology

Mon, 7 Jul 2008
By Paul Lindner, EV Group, St. Florian, Austria
Well-established as a process for forming silicon-on-insulator (SOI) substrates, wafer bonding is broadening its horizons to encompass bonding wafers for a variety of fast-growing applications. Regardless of the materials involved, packaging has emerged as the primary underlying driver. As wafer bonding technology evolves, key market, application, and industry trends can be linked to emerging advanced packaging requirements.

2008 Advanced Packaging Award Winners Announced At SEMICON West

Thu, 7 Jul 2008
(July 17, 2008) SAN FRANCISCO — Once again, SEMICON West provided the perfect backdrop for Advanced Packaging Magazine to announce the recipients of the 8th annual Advanced Packaging Awards, recognizing excellence in industry innovation. During an elegant celebration and ceremony held at the St. Regis Hotel, Wednesday, July 16, 2008, Gail Flower, editor-in-chief, Advanced Packaging talked about hope, and commended this year's participants.

K&S CEO Scott Kulicke Offers Industry Insight

Thu, 7 Jul 2008
(July 16, 2008) SAN FRANCISCO — In a round table discussion over lunch, Scott Kulicke, CEO, Kulicke & Soffa, responded with candor to questions posed by analysts from Prismark Partners, VLSI Research, and TechInternational; and editors from a variety of industry publications. Topics ranged from the success of the company's recent tool launch, last year's acquisition of Alphasem, the transition to copper wire bonding from gold wire, and the state of the industry

SEMICON West Packaging Summit Address Path to TSV Adoption

Wed, 7 Jul 2008
(July 15, 2008) SAN FRANCISCO — In a panel discussion hosted by Bill Bottoms, CEO of Nanonexus, and Jan Vardaman, TechSearch International, Industry experts from IBM, Intel, R3Logic, TSMC and Amkor emphasized a growing need for TSV adoption, what the drivers will be, how they will be used beyond being a replacement for electronic wiring, and what needs to happen to achieve this by established timelines.

U.S. Election 2008: SEMI Voices Industry Platform

Tue, 7 Jul 2008
(July 14, 2008) SAN FRANCISCO — Urging presidential candidates to make technology policy a top priority, SEMI North America voiced their agenda for Washington at the SEMI Press Conference, held July 14 during SEMICON West. The agenda zeroed in on four critical areas: technology, tax, talent, and trade.

Stan Myers, SEMI, Provides Perspectives on R&D and Outlook for the Semiconductor Industry

Mon, 7 Jul 2008
(July 14, 2008) SAN FRANCISCO — Setting the tone for the week's events, Stan Myers lead off SEMICON West's opening press conference, presenting the latest trends worldwide, midyear equipment forecast by market segment, and reporting the findings of the SEMI equipment productivity working group's (EPWG).

Electronics Industry Association News

Mon, 7 Jul 2008
(July 14, 2008) — IMEC and Qualcomm collaborate on 3D packaging technologies; IPC meets internationally to discuss urgent trends; iNEMI releases recommendations for lead-free alloy alternatives.

STMicroelectronics to Manufacture TSV-based Image Sensors on EV Group 300-mm Tools

Tue, 7 Jul 2008
(July 8, 2008) ST FLORIAN, AUSTRIA — EV Group(EVG)announced the order and successful installation of its 300-mm bonding, alignment, and photoresist fully automatic processing tools at ST Microelectronics'(ST) 300-mm through-silicon-via (TSV) pilot line in Crolles, France. The company says the tools will be used in the manufacture of CMOS imaging sensors (CIS) Using TSV technology.

Advanced Packaging Roadshow: Northwest Passage

Tue, 7 Jul 2008
Near Nature; Near Perfect
By Gail Flower, editor-in-chief
Early this spring the Advanced Packaging Roadshow flew out to Wilsonville, Oregon, to visit Mentor Graphics Corporation's U.S. headquarters, which is situated in a beautiful, park-like setting. The beauty of nature — with nutria feeding on the grounds, ducklings gathering in the lake, tulips in bloom, and greening outdoor soccer fields — provided a great spot for quiet thinking.

Henkel Expands into South Africa

Tue, 7 Jul 2008
(July 8, 2008) IRVINE, CA — As part of its expansion strategy into established and emerging electronics manufacturing regions, the electronics group of Henkel announced a distribution partnership with PEM Technologies in South Africa to represent its line of Loctite brand electronics adhesives.

Countdown to SEMICON West: Exhibitor Preview

Mon, 7 Jul 2008
(July 7, 2008) SAN FRANCISCO, CA — With SEMICON West 2008 just one week away, July 15-17,at the Moscone Center, San Francisco CA, exhibitors are getting the word out to make sure attendees don't miss a thing. While SEMI has a full-line up of conferences, keynotes, and workshops planned, many exhibitors will be leveraging the venue to announce new processes, technologies, products, and more.

EDA Consortium Reports Revenue Decline

Mon, 7 Jul 2008
(July 7, 2008) SAN JOSE, CA — The EDA Consortium (EDAC) Market Statistics Service (MSS) has reported a 1.2% decline in electronic design automation (EDA) industry revenue for Q1 2008, from a Q4 2007 revenue of $1366.8M to $1350.7M. The four-quarter average growth rate, which compares the most recent four quarters to the same four quarters in the prior year, was up 5.9%.

High-speed, Fully Automatic Wedge Bonder for Wire and Ribbon

Wed, 7 Jul 2008
The BONDJET BJ820, from Hesse & Knipps, is a high-speed, fully automatic wedge bonder for both high-speed round wire and deep access ribbon and wire bonding. It handles all challenging fine pitch wire bonding applications in a single platform - including RF and microwave devices, COB, MCM and hybrids, fiber optics and automotive - using aluminum or gold wire or ribbon. It reportedly offers bond speeds up to 7 wires-per-second.

The $38 Billion Blunder: A Rebuttal

Fri, 6 Jun 2008
Rick Short, marketing communications director for Indium Corp. doesn't quite see eye to eye with recent commentary on the cost of lead-free compliance in the electronics industry in a recent segment of The Riley Report, George Riley's monthly column in AP Semi-monthly. In this editorial, Short offers his perspective on this controversial topic

Wafer Scanner for Bump Metrology

Tue, 6 Jun 2008
The WS 3840, Rudolph Technologies' latest addition to the Wafer Scanner product family for inspection and metrology, integrates the company's laser triangulation technology for 3D bump metrology and sensitive 2D image-based macro defect inspection on the same wafer handler platform that is used by all of its advanced inspection and metrology tools. Laser triangulation reportedly allows for fast and accurate measurement of bump height and coplanarity.

MEPTEC Symposium Highlights MEMS Evolution

Tue, 6 Jun 2008
By Julia Goldstein, Ph.D., contributing editor
(June 3, 2008) SAN JOSE, CA — When Advanced Packaging magazine covered MEPTEC's first MEMS Symposium in 2003, MEMS was a technology with potential that needed to move from a technology-driven to a market-driven approach to succeed commercially. This year's symposium on May 22, 2008 was subtitled "MEMS Market Evolution — From Technology Push to Market Pull," suggesting that the potential has been realized.

Entorian Introduces Novel Package-on-Package Technology

Mon, 6 Jun 2008
(June 14, 2008) AUSTIN, TX — Offered as an alternative to dual-die package stacking, Entorian Technologies, provider of advanced electronic technologies and solutions for enterprise, consumer and other high-growth markets, has introduced RC Stakpak, a low-cost, package-on-package (PoP) stacking technology for DRAM memory.

Unisem Licenses FlipChip International's WLP Technologies

Mon, 6 Jun 2008
(June 16, 2008) KUALA LAMPUR, Malaysia — Unisem Berhad and its subsidiary, Unisem-Advantpack Technologies (UAT) have entered into an agreement with FlipChip International (FCI) to license FCI's wafer bumping and wafer-level packaging (WLP) technologies. The agreement will reportedly include FCI's core technologies. In return, FCI will become a shareholder in UAT.

Asymtek Celebrates 25 Years in Business

Mon, 6 Jun 2008
June 16, 2008 — Asymtek, a Nordson company, provider of dispense, coating, and jetting technologies, recently celebrated the company's 25th anniversary. Asymtek's systems are known for innovative technology in dispensing, closed-loop process controls, and patented processes in jetting and coating. SMT Magazine talked to founder, Alec Babiarz about the company's history.

SMT/Hybrid/Packaging 2008: Exhibitor Offerings Span Electronics Supply Chain

Fri, 6 Jun 2008
Nuremberg, Germany — Bigger and more international than ever, exhibitors at SMT/Hybrid Packaging, June 2-4, Nuremberg, Germany, focused their product showcases around the theme of automotive electronics, or used the venue for the European launch of new products.

Replisaurus Unveils "Middle-end-of-Line" Metallization Technology

Tue, 6 Jun 2008
(June 10, 2008) KISTA, Sweden and ST. JEOIRE, France — Just because Replisaurus, Inc. has maintained a low profile since announcing their first round of funding in August 2006, it doesn't mean there hasn't been a lot going on for the start-up company. In fact, just the opposite is true. With last week's announcement of the company's acquisition of Smart Equipment Technologies (SET), the company is ready show the world what it's been up to.

Report: China's IC Market

Tue, 6 Jun 2008
(June 10, 2008) DUBLIN — Research and Markets released an overview of the Chinese market for ICs, with focus on four key emerging markets: Shenzhen, Suzhou, Tianjin, and Chengdu. The report includes the three IC segments: design, manufacturing, and packaging & testing.

Replisaurus Acquires S.E.T.

Thu, 6 Jun 2008
(June 5, 2008) Kista, SWEDEN— Replisaurus Technologies, Inc., pioneer in nanoscale electrodeposition of metal patterns, has acquired S.E.T. SAS to establish a production site for its integrated and fully automated high-volume manufacturing tools for its proprietary ElectroChemical Pattern Replication (ECPR) technology.

Non-silcone Thermal Die Attatch Lid

Tue, 6 Jun 2008
MT-431, from Lord Corporation, is a non-silicone thermal die lid attach (TDLA) adhesive that was reportedly developed to replace two material processes, with a single effective solution. The material is formulated with thermal and adhesion properties that perform well enough to replace both typical thermal interface materials (TIMS) and lid attach adhesive.

Hermetic Microelectronic Packages

Tue, 6 Jun 2008
TO-250-type hermetic microelectronic packages from CPS Technologies, Inc. were developed for military, electronics, satellite, and aerospace markets, and can be manufactured in a variety of combinations. Products consist of a cold rolled steel frame with hermetic seals made with alloy #52 or copper-cored alloy #52 pins in a compression glass seal or ceramic terminal. Bottom choices can be OFHC copper, copper moly, copper tungsten or glidcop. Braze material is 72% Ag / 28% Cu (BT braze).

Macro-inspection Software Option

Tue, 6 Jun 2008
Systems combining multiple inspection tasks in one tool such as frontside, backside and edge inspection traditionally can run only one wafer lot at a time. With Vistec's software package option, Parallel Job Control for LDS3300 C, it is possible to run multiple control jobs at the same time, rather than have single modules sitting idle without measuring a wafer, while other modules are continuously scanning wafers.

Probe Card for Flip Chip / Bumped Logic Devices

Tue, 6 Jun 2008
Megamax, the latest addition to Wentworth Laboratories, Inc.'s vertical probe card line addresses major probe card challenges encountered when probing high power flip chip devices such as microprocessor units (MPU's), graphics processing units (GPU's) and System on Chip (SoC's).

OEM Ultraviolet Laser

Thu, 8 Aug 2008
The MATRIX 355 BE from Coherent, Inc. is a frequency-tripled, diode pumped solid state (DPSS) laser that combines low output noise and low beam divergence. This is achieved by incorporating an integral beam expander within the sealed laser head, which results in an output beam diameter (1/e2) of 2.2mm and a divergence of only 0.5mrad.

Die-attach Adhesives and Adhesive Films

Mon, 8 Aug 2008
The 118-06 series of products from Creative Materials are based on single-component, electrically conductive, B-stageable epoxy adhesives. Available for a variety of application techniques, such as screen-printing, pad-printing, stencil application and B-staged films, These products reportedly offer thermal stability, high-temperature performance and an operating temperature range of -55°C to 230°C.

Force-indicating Compression Screws

Mon, 8 Aug 2008
The TS-SS-11, TS-SS-12, TS-SG-01 and TS-SG-02 force-indicating compression screws from Ironwood Electronics were designed to allow for quick and error-free chip insertion in sockets with up to 40 GHz bandwidth. When added to Ironwood electronics sockets, these mechanisms are said to enable the socket user to insert chips into sockets while always having the proper downward force on the chip.

STATS ChipPAC and Infineon Sign Second Agreement on eWLB Technology

Sun, 8 Aug 2008
(August 31, 2008) SINGAPORE— STATS ChipPAC Ltd. and Infineon Technologies have signed a second agreement in which STATS ChipPAC will provide manufacturing services for products based on Infineon's first generation embedded wafer-level ball grid array (eWLB) technology. This agreement between the two companies comes closely follows the Aug. 7 release announcing an agreement between Infineon, STMicroelectronics and STATS ChipPAC on joint development of next generation eWLB technology.

Advantest Completes Buyout of Credence Systems GmbH

Wed, 8 Aug 2008
(August 27, 2008) TOKYO — Advantest Corporation, manufacturer of semiconductor test equipment, has completed its buyout of Credence Systems GmbH (CSG), a manufacturer of test systems for automotive semiconductors.

SEMICON Europa Moves to Dresden in 2009

Mon, 8 Aug 2008
b>(August 25, 2008) DRESDEN, Germany After a two year stint in Stuttgart, SEMICON Europa will be on the move once again, this time to Dresden, reportedly the largest semiconductor center in Europe; so-called Silicon Saxony. The announcement was made by was Heinz Kundert, President of SEMI Europe at a joint press conference with SILICON SAXONY e.V., the State of Saxony and the City of Dresden.

Packaging, Novel Interconnect Methods Examined at SMTAI

Fri, 8 Aug 2008
By Meredith Courtemanche, managing editor, SMT
I was afraid Florida would be too hot to visit in August for SMTA International (SMTAI) 2008. The sun was no concern, as Hurricane Fay winds tossed about the palm trees outside the convention center. Safe inside, we concentrated on the next big thing to hit the electronics interconnect community: thru-silicon via (TSV) and other chip/package/board manufacturing technologies.

Amkor Introduces Novel Flip Chip Technology

Wed, 7 Jul 2008
(July 2, 2008) CHANDLER, AZ — Amkor Technology, Inc. announced the introduction of a high-performance flip chip packaging technology using an advanced molding process technology that is expected to provide a number of design, cost and performance advantages for field programmable gate arrays (FPGAs), CPUs, graphics processors, and ASICs. The company plans to feature this technology during SEMICON West 2008, July 15 - 17, in San Jose, CA.

Advanced Probe Card Analysis Improves Yields, Speeds Product Development and Reduces Test Costs

Tue, 7 Jul 2008
By Darren James, Rudolph Technologies, Inc.
With the cost of some advanced packages reaching several times the cost of the die they contain, the value contributed by functional testing, which allows manufacturers to avoid the cost of packaging defective die, has grown dramatically. Of course, testing has its own costs in both money and time.

Indium Receives Quality Award

Tue, 7 Jul 2008
(July 1, 2008) UTICA, NY — Indium Corp.was recognized by Diodes, Inc. as a recipient of the "Full Mark Supplier" Quality Award for the 3rd Quarter of 2007. Guoping Lu, quality manager for Diodes/Kaihong Electronics Co. Ltd., presented the award to Indium Corp's Andy C. Mackie, Ph.D., product manager for semiconductor assembly materials, and Michael Qiu, area sales manager for semiconductor assembly Materials in China.

VLSI Research Announces 10 Best Suppliers of 2008

Tue, 7 Jul 2008
(July 1, 2008) SANTA CLARA, CA &%151 VLSI Research, a public source for customer feedback on semiconductor equipment, recently announced the winners of the 2008 BEST Awards. Recognizing the top 10 equipment suppliers in three areas of semiconductor manufacturing — wafer processing and diagnistics; chip making; and test, handling and assembly equipment — the results are based on 4,565 surveys collected from chip makers that represent more than 95% of worldwide chip production.

Henkel Launches Research and Failure Analysis Center with Shanghai University

Tue, 7 Jul 2008
(July 1, 2008) IRVINE, CA. — To promote electronics material advancement in the burgeoning China region, Henkel and Shanghai University, in conjunction with several leading research universities, entered into an agreement to form a Shanghai Region Joint Electronics Research and Failure Analysis Center. The official signing ceremony marking the commencement of the partnership took place on June 10, 2008 at Henkel Asia-Pacific and China headquarters in Shanghai, China.

Wafer Loader Series

Tue, 7 Jul 2008
Designed for ultra-thin wafer handling, especially for back-end inspection, the NWL200 Series of wafer loaders from Nikon Instruments is said to be capable of loading wafers as thin as 100 µm. A chuck system to transfer wafers, an optimized arrangement of sensor beams that allow for accurate detection of wafer shape, and an optional edge-chipping detection function that automatically detects wafer cracking reportedly allows macro inspections of all areas.

Mask Aligner for 3D Packaging

Tue, 7 Jul 2008
The second-generation SUSS MA300, from SUSS MicroTec is a highly automated mask aligner platform for 300-mm and 200-mm wafers. Specifically designed for 3D packaging, it features a dedicated alignment kit for creating 3D interconnects for applications like chip stacking and 3D image sensor packaging. It also targets wafer bumping and wafer level packaging (WLP) applications, but can be used for other technologies where geometries in the range of 5 and 100 µm must be exposed.

Solvent-based Defluxing Agent
Zestron

Tue, 7 Jul 2008
ZESTRON DS 100, from Zestron America, is a solvent-based cleaning agent designed to remove flux residues at low temperatures from electronic assemblies, ceramic hybrids, power modules and leadframes in self-regenerative closed-loop cleaning systems. It is particularly suited for applications when rinsing with water is not permitted.

QFN Test Socket

Wed, 7 Jul 2008
The Z-Socket, or impedance socket, from Antares, is an RF QFN test socket developed to combine the reliability of traditional spring-probe technology with the impedance-matching functionality of shorter interconnects at higher price points.

Rudolph Receives Order from Micronas

Mon, 6 Jun 2008
(June 30, 2008) FLANDERS, NJ — Rudolph Technologies, Inc. has received a follow-on order from Micronas for both NSX Inspection System and Discover in-line defect analysis and data management software. The purchase will reportedly allow Micronas — supplier of integrated circuits (ICs) and sensor system solutions for consumer and automotive electronics — to provide additional inspection capacity demanded by the 100% inspection requirements customers in the automotive market.

Nextreme Receives Grant to Enhance Efficiency of Thermoelectrics

Mon, 6 Jun 2008
(June 30, 2008) DURHAM, NC — Nextreme Thermal Solutions, manufacturer of microscale thermal and power management products for the electronics industry, has been awarded a grant from the North Carolina Green Business Fund to enhance the efficiency of thin-film thermoelectrics used to convert waste heat into electricity.

A RoHS By Any Other Name...

Mon, 6 Jun 2008
(June 30, 2008) Gail Flower, editor_in_chief of Advanced Packaging, offers her perspective in a lead-free debate initiated by Rick Short of Indium, in response to a segment of The Riley Report, "The $38 Billion Blunder" penned by AP's columnist, George A. Riley, Ph.D.

June Names in the News

Mon, 6 Jun 2008
(June 30, 2008) It was a month for names in the news as acquisitions and evolving business strategies inspired executive appointments and reorganization; industry organizations added members and directors, and books got published. Company announcements came in from JP Sercel Associates, TRUMPF, Dage Precision Industries, ECD, Jordan Valley, Rogers Corp., Formfactor, Unisem Group, Mentor Graphics, and Alchimer.

Credence and LTX Sign Merger Agreement

Fri, 6 Jun 2008
(June 22, 2008) MILPITAS, CA and NORWOOD, MA — Credence Systems Corporation and LTX Corporation, both providers of automated test equipment (ATE) for the worldwide consumer semiconductor industry, have entered into a definitive agreement to combine the two companies in a tax-free, all-stock merger of equals.

electronica 2008 to Showcase on Micro and Nanoelectronics

Fri, 6 Jun 2008
(June 25, 2008) MUNICH, Germany — Microelectronics is a driving force behind innovation for industries such as automotive, biomedical technology, telecommunications, automation technology, environmental engineering and building technology. Micro-nano systems have become so important that electronica 2008 will dedicate a focus area to sub-miniature electronics. Exhibitors will display micro-nano products for automotive, consumer, medical and environmental applications.

Wireless 2.O Conference Addresses Next-gen Wireless

Fri, 6 Jun 2008
(June 27, 2008) BRISTOL, UK — Silicon South West, the UK network for the region's electronics industry, will host 'Wireless 2.0', a conference intended to gather key players, analysts, and influential academics for an agenda-setting debate on innovation opportunities fror the next generation of wireless technology. The event is set to take place July 10th & 11th, 2008 in Bristol UK.

iNEMI Roadmap Workshop Scheduled for Shanghai

Fri, 6 Jun 2008
(June 27, 2008) SHANGHAI, China — The International Electronics Manufacturing Initiative (iNEMI), has scheduled a workshop — to be held in conjunction with the ICEPT-HDP conference in Zhangjiang, Pudong — to give industry the opportunity to review "work in progress" on the 2009 iNEMI Roadmap. This workshop is the third of three regional meetings held in North America, Europe and Asia.

LORD Corp. Expands Labs, R&D Center

Thu, 6 Jun 2008
(June 26, 2008) CARY, NC — LORD Corporation, supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics industry, will embark on a $2.5 million renovation to its electronic materials labs in Cary, N.C. The expansion is intended to allow the company to add capabilities for technology development, such as individual package device reliability testing, said John Hill, technology manager for LORD's electronic boards and components industry group.

Towa's Novel Chip Packaging Technique Uses Less Gold

Tue, 6 Jun 2008
(June 24, 2008) KYOTO, JAPAN — Towa Corp., manufacturer of molding systems for semiconductor devices, anounced the development of a novel compression molding system that uses reportedly 60% thinner gold wires. The traditional transfer molding process, in which the resin is poured across the substrate, require gold wires to be at least 25 µm in diameter to withstand the resin's drag force without breaking. With Towa's new process, the gold wires can be made as thin as 16 µm.

Verigy Gains Business and Recognition from STATS ChipPAC

Tue, 6 Jun 2008
(June 24, 2008) Cupertino, CA — Semiconductor test company, Verigy, announced that STATS ChipPAC Ltd., provider of semiconductor assembly and test services, has purchased its Port Scale RF systems for testing highly integrated wireless RF devices. In addition, Verigy was recently recognized by STATS ChipPAC with an Outstanding Overall Service Award for exemplary performance and service.

Photonic Interconnects Enable the Continuation of Moore's Law

Tue, 11 Nov 2008
By Fran

Wafer-level CSP Interposers

Mon, 11 Nov 2008
Synergetix test socket interposers for wafer-level chip scale package (WLCSP) testing are used for vertical probing applications. The interposers have a plastic assembly containing IDI's semiconductor probe technology built in. Combined with an easy-to-design-and-fabricate load board, interposers require minimal attention throughout their life cycle.

Automatic Wafer Inspection

Tue, 10 Oct 2008
Viscom AG has broadened its platform into the semiconductor market with the introduction of the MX20000IR fully automatic wafer inspection system. The application scope of the system includes MEMS, wafer bonds, flip chip and photovoltaics. Wafers can be composed of various materials including silicon, gallium arsenide, aluminum oxide or III-IV composites, and others.

Next-generation Contacting Sockets

Tue, 10 Oct 2008
The Multitest NanoKelvin socket was developed to meet the requirements of small pad QFN devices. It integrates the benefits of Kelvin technology with plunge-to-board capabilities. Proprietary Dura/Tecta coating combined with high contact force of 0.5 Newton at 0.4mm lead pitch and minimum scrub reportedly ensures electrical repeatability. The coating is said to guarantee socket lifespan of more that 1M insertions.

SEMICON Europe: Connecting Companies for 3D Interconnects

Fri, 10 Oct 2008
By Paul Collander, Poltronics, Inc. At the recent Advanced Packaging Conference at SEMICON Europe in Stuttgart, Germany, (October 7-9, 2008) Fran

IMAPS International Symposium 2008 Preview

Thu, 10 Oct 2008
By Fran

Mentor Graphics Chairman and CEO to Keynote at GSA Semiconductor Leaders Forum

Thu, 10 Oct 2008
(October 30, 2008) WILSONVILLE, OR— Walden C. Rhines, Chairman and CEO, Mentor Graphics, Corp. will be giving the keynote address at the GSA Semiconductor Leaders Forum on November 5, 2008 in Hsinchu, Taiwan, addressing the belief that the electronics industry is maturing, and its glory days are over.

Online Intervew: Paul Magill Recaps Nextreme's Cool Year

Wed, 10 Oct 2008
(October 29, 2008) DURHAM, NC —Time flies when you're having fun, or when you're getting a start-up off the ground. From the introduction of an enabling technology, through several rounds of funding, award of a grant, four product launches incorporating said technology, the construction and grand opening of a manufacturing facility, RoHS compliance, and ongoing plans for more, the past year has been peppered with notable events for Nextreme Thermal Solutions.

SUSS MicroTec and STS Take the Show on the Road

Wed, 10 Oct 2008
(October 29, 2008) NEWPORT, UK and GARCHING, Germany— SUSS MicroTec and Surface Technology Systems (STS) are once again hosting a technology roadshow in five major Asian locations from October 29 to November 7. Similar to the US roadshow last spring, the series of one-day events is intended to provide a comprehensive overview of the latest developments 3D Integration and advanced packaging.

IMEC Research Energetically Stacks Up

Tue, 10 Oct 2008
by Gail Flower, Editor-in-Chief, Advanced Packaging
IMEC remains on the forefront of research in many areas including nanotechnology, RF MEMS packaging, flip-chip, substrates, organic electronics, CMOS-based research, solar cells, and 3D stacked integrated circuits. In 3D stacked packages an area of predicted high-growth, IMEC has announced notable achievements.

Quasys Takes Over Datacon Feeder Lines

Fri, 10 Oct 2008
(October 24, 2008) CHAM, Switzerland — After the transfer of all product rights from BESI/Datacon (formerly Laurier Inc.) to Quasys, the Laurier feeders will now be manufactured by Quasys in Switzerland.

MEPTEC/Advanced Packaging Announce Symposium Final Program

Wed, 10 Oct 2008
(October 22, 2008) SAN JOSE, CA — MEPTEC, the MicroElectronics Packaging and Test Engineering Council, and Advanced Packaging magazine have finalized the program for their upcoming symposium titled "Packaging Developments and Innovations: From System Design to Integrated Delivery" to be held on Thursday, November 13, 2008 at the Wyndham Hotel, San Jose, CA.

Indium's Weiping Liu Appointed to International Advisory Board

Tue, 10 Oct 2008
(October 21, 2008) UTICA, NY— Weiping Liu, Ph.D. research metallurgist for Indium Corp. was invited to become a member of the International Scientific Advisory Board for the International Brazing and Soldering Conference (IBSC) 2009, organized by the American Welding Society and ASM International.

Advanced Materials CVD and ALD Tool

Tue, 10 Oct 2008
The AltaCVD chemical vapor deposition (CVD) and atomic layer deposition (ALD) tool from Altatech combines a unique vaporizer technology, chamber design, and gas/liquid panel integration. The combination of a proprietary reactor design and precursor introduction path with a pulsed liquid injection and vaporization is said to enable nanoscale control of thickness, uniformity, composition, and stoichiometry in complex materials.

SEMI Europe Aims to Increase Region's Industry Competitiveness

Thu, 10 Oct 2008
(October 9, 2008) STUTTGART, Germany — In an effort to increase Europe's microelectronic industry competitiveness, SEMI has published a paper outlining six recommendations. Heinz Kundert, president of SEMI Europe, explained the impetus for this paper, as well as the outcome, during his presentation, "What We Can Accomplish Together" at SEMICON Europa, Tuesday, October 7, 2008.

SEMI Panel Advises Equipment Manufacturers — Hang on to Your Cash

Tue, 10 Oct 2008
(October 7, 2008) STUTTGART, Germany — Beginning his presentation with the caveat that the current state of the economy could change the statistics in his report, Stan Myers, president and CEO of SEMI offered a conservative outlook on the state of the semiconductor industry worldwide. Panelists Andre-Jacques Auberton-Herv

Cooling 3D Packages with Thin-film Thermoelectrics

Mon, 10 Oct 2008
By Paul A. Magill, Ph.D., Nextreme Thermal Solutions, Inc.
The electronics industry is moving to 3D packaging structures which will shorten the electrical path length, thereby allowing for higher transmission speeds. As this clears the way for faster processors, it also means that thermal management solutions for these 3D structures will need to be developed.

Online Interview: Ziptronix Joins Low-cost Quest for True 3D-IC

Tue, 10 Oct 2008
By Fran

Protecting Brand Reputation

Fri, 8 Aug 2008
By Carsten Barth, Elcoteq
At this time of economic downturn and with reduced consumer confidence, the equity of a brand can be one critical factor in ensuring that sales and margins are maintained while lesser brands get squeezed. Brand equity can be a function of many things — image, price, innovation, tradition — but at the end of the day, they all boil down to reputation.

MEPTEC and Advanced Packaging Magazine to Hold Packaging Symposium

Tue, 8 Aug 2008
(AUGUST 12, 2008) SAN JOSE, CA — In recognition of MEPTEC's 30th year, MEPTEC and Advanced Packaging magazine will present Packaging Developments and Innovations: From System Design to Integrated Delivery, Thursday, November 13, 2008, at the Wyndham Hotel in San Jose, CA. The symposium will include a special luncheon featuring keynote speaker, Glenn Daves, director of packaging technology, Freescale Semiconductor.

STMicroelectronics, STATSChip PAC, and Infineon Join Forces in Next-gen WLP Development

Thu, 8 Aug 2008
(August 7, 2008), GENEVA, SINGAPORE, and NEUBIBERG, Germany — STMicroelectronics, STATS ChipPAC, and Infineon Technologies AG have signed an agreement to jointly develop the next-generation of embedded wafer-level ball grid array (eWLB) technology, based on Infineon's first-generation technology, for use in manufacturing future-generation semiconductor packages.

SEMICON Europa's Advanced Packaging Conference Shifts Focus from TSV to WLP

Tue, 8 Aug 2008
August 5, 2008 — Shifting away from focus on 3D IC and TSV processes, this year's Advanced Packaging Conference at SEMICON Europa, titled "Technologies, Manufacturing and Supply Chain", will focus on more immediate issues facing the back-end sector of the semiconductor industry. Eef Bagerman, general manager operations, back-end innovation, NXP Semiconductors offered some insight about how the program was selected, and what technologies will be most likely to spark discussion.

Conductive Adhesives for Flexible Circuits

Mon, 8 Aug 2008
A line of fast-setting, one-component conductive adhesives designed for connecting passive components and bare die on lead frames and PCB substrates has been introduced by the Contact Materials Division (CMD) of Heraeus. Intended uses for these materials include smart cards and flexible circuits found in camera phones and automotive or semiconductor applications.

Embedded Passives in Device Packaging: What is Limiting Widespread Adoption?

Mon, 8 Aug 2008
By Dirk. M Baars, Rogers Corp.
The expectation that embedded passives technology will be required to meet size, performance and cost requirements of devices has been a driver of R&D activity in many materials suppliers' laboratories. In particular, the proliferation of multiple-function handheld devices with multiple wireless functions should require that discrete components be integrated into the package to save space and minimize electrical distances for optimum performance.

RF Components and Devices in 3D LCP Package

Mon, 8 Aug 2008
Part 1: Embedded Actives
By Swapan K. Bhattacharya, Chad Patterson, and John Papapolymerou, Georgia Tech
As real estate in electronic packages has been compromised in the Z direction, thin has become the buzz word — encompassing die, dielectric, passives, and ultimately resulting in thin packages. This series of articles will overview trends from thick to thin packages with embedded RF passive and active components.

Beyond the Bunny: "Printing" Your Way To Battery-free Power

Fri, 8 Aug 2008
By Arthur L. Chait, EoPlex
Batteries are everywhere, powering everything from laptops to greener vehicles. The first dry-cell batteries were mass-produced in 1896. Today's batteries are vast improvements over these early products. Panasonic recently claimed the Guinness record for longest-life alkaline battery with the Evolta that powered a robot for seven hours as it climbed out of the Grand Canyon.

K&S To Acquire Orthodyne Electronics; Divest Wire Business Unit to Heraeus

Fri, 8 Aug 2008
(August 1, 2008) FORT WASHINGTON PA — In a strategic move to further capitalize on its strengths as an equipment manufacturer, Kulicke & Soffa Industries announced that the company will acquire the assets of Orthodyne Electronics Corp., while also divesting its wire business unit to W.C. Heraeus GmbH.

Plasma Etching/Cleaning System

Mon, 8 Aug 2008
The PE-200-RIE Convertible, from Plasma Etch, is a convertible RIE configuration of the companies PE-200 plasma etching/cleaning system. Designed for anisotropic etching of nitrides, oxides, and polyimide, the system features a 13

Executive Viewpoint

Fri, 8 Aug 2008
Shrink the iPhone
By Jim Stratigos, Jacket Micro Devices
Apple's recently introduced 3G iPhone is a marvel of engineering from just about any perspective; compact, feature rich, cool touch screen, and a plethora of wireless functions. It's also an indication of how far the electronics industry has yet to achieve in terms of miniaturization of complex analog circuits.

Wafer Backside Coating

Mon, 8 Aug 2008
Using stencil, screen printing, and spin coating techniques, Henkel's Ablestik 8000 series, wafer backside coating (WBC) reportedly enables the deposition of die-attach materials to the wafer backside down to a thickness of 20 µm on wafers as thin as 100 20 µm and up to 300 mm in diameter. Unlike conventional dispensing methods, printing or spin coating materials onto the wafer is said to deliver a tightly controlled, high UPH for high-volume die attach adhesive deposition.

High-power UV Laser for Micromachining

Mon, 8 Aug 2008
The AVIA 355-28, from Coherent extends the company's family of micromachining lasers to deliver] 28 Watts of output at 355 nm (at 110 kHz). This high power and repetition rate is said to increase throughput for micromachining applications in semiconductor fabrication and packaging. Target applications include dicing and scribing of silicon wafers and low-k semiconductors, and via-hole drilling in PCBs and flip chips.

Embedded RF Components and Devices in 3D LCP Package, Part 3:

Tue, 9 Sep 2008
Power Dividers on LCP
By Swapan K. Bhattacharya, Stephen Horst, and John Papapolymerou, Georgia Institute of Technology
The Wilkinson power divider is one of the most commonly used components in wireless communication systems for power division and/or combination. This article discusses the application of embedded thin-film resistors as power divider has been discussed in the frequency range 27 to 110GHz on the liquid crystal polymer substrate.

2N Gold Ball Bonding Wire

Tue, 9 Sep 2008
RelMax, from Kulicke & Soffa Industries, is a 2N gold ball bonding wire developed in response to market demand for increased interconnect (IC) reliability, process robustness and reduced costs.

Lead-free No-Clean Die-attach Solder Paste

Tue, 9 Sep 2008
Indium9.32 Die-attach Solder Paste is a halogen-free, no-clean, die-attach solder paste used in high-volume manufacturing for lead-free die-attach applications. Formulated to leave a benign, invisible residue, it is designed for reflow in forming gas.

Solder-free Connectors Using Buckled Pillars

Fri, 9 Sep 2008
By Peter Salmon, Salmon Technologies
A particularly versatile form of wafer bumping is stud bumping, using either gold or copper wire. The equipment required is an adaptation of a traditional wire bonder. A ball bond is made at a first contact pad using heat and ultrasonic energy. The wire is extended in a precise direction and a flying lead is created by terminating the wire, for example using electronic flame-off (EFO).

Automatic Wire Bond Inspection System

Tue, 9 Sep 2008
Viscom's S6053BO-V wire bond AOI system was conceived specifically for small wire bond analysis. Both the camera technology and transport can be adapted for varying production demands. A universal, high-resolution VHR camera module make it possible to inspect down to a resolution of 2 to 5µm/pixel. The camera module can be arrayed with one or several cameras and specialized illumination units, allowing for 100% inspection of bond wires smaller than 20 5µm/pixel in diameter.

X-Ray Inspection Identifies Flip Chip Detects

Tue, 9 Sep 2008
Using 2D and 3D X-ray techniques to find and confirm manufacturing defects in flip-chip devices
By Evstatin Krastev, Ph.D. Dage Precision Industries, a Nordson Company
While flip chip design eliminates excessive packaging, high-density flip chip devices place a greater burden upon device inspection. The combination of 2D x-ray and CT analysis offers powerful analytical capabilities need for the complete inspection of flip-chip devices and stacked packages.

Socket for Processor and POP

Tue, 7 Jul 2008
The SG-BGA-7116 socket from Ironwood Electronics is made for socketing a 0.4-mm BGA IC, 12

Acoustic Micro Imaging

Tue, 7 Jul 2008
The HiRes Generation THRU-Scan from Sonoscan, was developed to significantly enhance through-transmission imaging with Sonoscan's C-SAM line of acoustic microscopes. Reflection-mode acoustic imaging (the most frequently used mode) is limited to a defined depth within a sample, but THRU-Scan images the whole thickness in one scan.

High Resolution SEM

Tue, 7 Jul 2008
With the Magellan XHR SEM, FEI Company has launched a class of instruments called extreme high-resolution scanning electron microscopes that allow scientists and engineers to view 3D surface images at different angles and at resolutions below one nanometer. The Magellan XHR SEM images samples at very low beam energies, avoiding distortions otherwise caused by the beam penetrating into the material below.

Test Measurement Unit

Wed, 7 Jul 2008
The ITC59200 test measurement unit (TMU), from Integrated Technology Corp. is designed to provide two test functions: die attach and forward bias safe operating area (FBSOA). Die attach testing is performed to detect voids under the die and other types of device construction flaws that could affect the lifetime and safe operating area SOA of the device. The FBSOA non-destructive test is used to determine the SOA of the device.

CT Inspection System Software

Wed, 7 Jul 2008
The Quick View CT inspection system from Dage allows users to obtain initial computerized tomography (CT) reconstructions within 5 minutes, compared to previous times of over 20 minutes. This quick view CT software makes CT a more viable process tool for production and failure analysis applications

FEI and Icon Analytical Selected to Develop India's Premier Imaging Facility

Tue, 7 Jul 2008
(July 29, 2008) HILLSBORO, OR — India's International Centre for Material Science (ICMS) in Bangalore has selected FEI Company and its Mumbai-based agent, Icon Analytical Equipment Private Ltd., to develop a unique electron microscopy facility in India. The ICMS Imaging Centre will reportedly include a suite of FEI electron microscopes.

Henkel Names New Electronics Executive Team

Fri, 7 Jul 2008
(July 25, 2008) IRVINE, CA — Following its acquisition of the Adhesives and Electronics Materials businesses from National Starch and Chemical Company, Henkel has announced its executive team to take the company forward. Under the direction of Alan Syzdek, corporate senior V.P. the electronics group of Henkel will be organized on a global basis by industry sector.

iNEMI Schedules Sustainability Summit

Fri, 7 Jul 2008
(July 25, 2008 ) Herndon, VA — The International Electronics Manufacturing Initiative (iNEMI) will bring together leaders from industry and academia September 22-23 to identify and prioritize areas where the electronics industry can collaborate on proactive environmental programs.

JPSA Partners with DynTest for Wafer Scriber/Breaker Development

Thu, 7 Jul 2008
(July 24, 2008) MANCHESTER, NH — J P Sercel Associates (JPSA) and DynTest Technologies of Grassau, Germany, have entered into a collaborative partnership reportedly to develop and manufacture high-precision scriber / breaker solutions for wafer singulation. DynTest specializes in precise, accurate, and efficient breaking systems, while JPSA specializes in high-speed, high-accuracy laser workstations for wafer scribing.

Advanced Packaging and Solid State Technology Applaud 2008 ACA Winners

Tue, 7 Jul 2008
(July 22, 2008) NASHUA, NH — On Wednesday, July 16, 2008, the editors and publisher of Solid State Technology (SST) and Advanced Packaging Magazine presented the 2008 ACA Awards, in usual impromptu style on the floor at SEMICON West. This was the sixth straight year attendees of SEMICON West were invited to vote on products they saw at the annual trade show.

SEMICON West Exhibitor 2008 Spotlight

Tue, 7 Jul 2008
by Fran

Hermes European Embedded Dies Consortia Partners with Flip Chip International

Mon, 7 Jul 2008
(July 8, 2008) PHOENIX, AZ — Hermes, the Eurpoean consortia for the development and industrialization of embedded die technology, has partnered with Flip Chip International (FCI) to leverage the company's proprietary embeddable die customization (EDC) technology to enable the consortium's pursuit of heterogeneous systems integration.

Evaluating a TIM for Flip Chip Packages

Mon, 10 Oct 2008
By V. Gektin, M. Stern, Sun Microsystems; L. Larson, D. Bhagwagar, J. Marin, Dow Corning Corp. K.Nakayoshi , Dow Corning Toray Co., Ltd.
As power levels and heat generation increase in high-performance CPUs and other semiconductor devices, the thermal performance of commonly used packaging components is becoming a limiting factor. A silver-filled silicone material specifically for TIM 1 applications (the die/lid interface) was designed to meet this challenge.

Nanoimprint Toolkit for Mask Aligners

Tue, 10 Oct 2008
SUSS MicroTec now offers a nanoimprint toolkit that reportedly enhances the capabilities of its manual mask aligners by enabling them to pattern large areas with repeatable sub-50nm printing capability. The technology, substrate conformal imprint lithography (SCIL)was developed by Philips Research, (Eindhoven/The Netherlands) and transferred to SUSS MicroTec in a technology license agreement.

C4NP Process Update

Mon, 10 Oct 2008
Proven for high-volume 300mm manufacturing
By Emmet Hughlett, SUSS MicroTec, Inc.
In July 2007, IBM announced the qualification of C4NP for 200µm pitch lead-free solder bumping for shipped product. Since then, IBM has qualified 150µm pitch C4NP lead-free bumped wafers on a fully populated high-volume production line. SUSS MicroTec is completing build of additional C4NP equipment to meet ramping demand at IBM's Hopewell Junction bumping facility.

Packaging Materials: Trends for 2009

Fri, 10 Oct 2008
By Andy C. Mackie, Ph.D., Indium Corporation, Utica, NY
Despite the relative stagnancy of the semiconductor market in 2009, there will be significant growth in the standard and power semiconductor assembly market spaces, as many device makers move to reduce costs by outsourcing assembly. As such, materials considerations are expected to play an increasingly important role. This article discusses technology drivers for materials used in these two distinct markets.

Executive Panel Addresses Options in WLP

Tue, 10 Oct 2008
By Fran

DNP Develops Slim Leadframe

Thu, 1 Jan 2009
(January 29, 2009) TOKYO — Dai Nippon Printing Co. Ltd. (DNP) developed a package leadframe to slim down the semiconductor package mounted on electronic devices. The leadframe enables known good die (KGD) semiconductor packaging with a thickness of 0.15 mm, using precision plating processes.

Oerlikon hands off Esec packaging biz to Be Semi

Tue, 1 Jan 2009
Seeing no more synergies with its now-core technical and strategic areas, Germany's Oerlikon says it has sold its Esec die attach/bonder business to Dutch firm BE Semiconductor.

SEMI ISS EUROPE 2009 Looks at the Emerging Russian Semi Market

Tue, 1 Jan 2009
(January 13, 2009) BRUSSELS, Belgium — SEMI Europe confirmed that Anatoly Chubais, head of Russian Corporation of Nanotechnologies (RUSNANO) will join the roster of keynote speakers at this year's Industry Strategy Symposium (ISS Europe), February 1-3, 2009, Dresden, Germany. Chubais will offer his insights and experiences on the state of the semiconductor industry in Russia.

Replisaurus/S.E.T. to Collaborate with IMEC on 3D Integration

Tue, 1 Jan 2009
(January 13, 2009) SAINT JEOIRE, France — Smart Equipment Technology (S.E.T.), a wholly-owned subsidiary of Replisaurus Technologies, announced a collaboration with IMEC to develop die pick-and-place and bonding processes for 3D chip integration using S.E.T.'s flip chip bonder equipment. As part of the collaboration, S.E.T. will join IMEC's Industrial Affiliation Program (IIAP) on 3D integration.

Embedded RF Component and Devices in 3D LCP Package Part 4:

Wed, 1 Jan 2009

Electroless Plated Thin-film Resistors on Organic Substrates

By Swapan K. Bhattacharya, Premjeet Chahal, and John Papapolymerou, Georgia Tech

Thin film resistors on organic substrates can be realized by vacuum deposition, direct foil lamination, and electroless and/or electroplating. This article introduces the feasibility of electroless plated thin-film Ni-W-P and Ni-P resistors on LCP substrate using low-cost PCB process technology.


Tessera Acquires IP Rights from Kronos

Fri, 4 Apr 2008
(April 4, 2008) San Jose, CA and Belmont, MA— Tessera Technologies, Inc. provider of miniaturization technologies for the electronics industry, and Kronos Advanced Technologies, Inc. developer of ionic- based products and technologies for air movement and purification, announced the sale and licensing of certain intellectual property (IP) rights related to Kronos proprietary technologies to Tessera.

3D Packaging Technologies Steal the Show at IMAPS

Tue, 4 Apr 2008
By Fran

Semiconductor Materials Post Record Revenues

Tue, 4 Apr 2008
(April 1, 2008) SAN JOSE, CA — The global semiconductor materials market grew 14% in 2007 and is forecasted to grow over 11% in 2008 according to the latest materials forecast from SEMI. While the semiconductor industry grew 3% in 2007 to reach the $256B published by the Semiconductor Industry Association (SIA), the global semiconductor materials market grew 14% in 2007 to reach a record $42 billion.

DuPont Microcircuit Materials Highlights Developments at Printed Electronics Europe

Tue, 4 Apr 2008
(April 1, 2008) BRISTOL, U.K. — As part of DuPont Microcircuit Materials' (MCM) participation at IDTechEx Printed Electronics Europe, which focuses on thin film and organic electronics, Kerry Adams, Ph.D, market development lead, DuPont, will discuss the company's developments in inks and imaging for printed electronics. The event will be held at Maritim Hotel and Congress Centre in Dresden, Germany on April 8

Thermally Conductive Adhesive Tape

Mon, 4 Apr 2008
TC-20SAS, a thermally conductive silicone double-sided adhesive tape is from Shin-Etsu Chemical Co., Ltd. provides thermal resistance and electrical insulation properties in addition to its thermal conductivity of 0.7 W/m

Microlithographic Polymer Films

Tue, 9 Sep 2008
DuPont PerMx Series 3000 is a new version of permanent microlithographic polymer films designed for applications such as redistribution, bonding, and structuring. This multi-purpose film features high resolution, low-temperature cure and reportedly outstanding mechanical properties. These films are available in 10, 15 and 20&3181; thicknesses. It is said to achieve high yield and quality through uniform resist thickness across the entire wafer.

Antenna-grade High-frequency Circuit Materials

Wed, 9 Sep 2008
RO3000 and RO4000 laminates, from Roger's Corp. are antenna-grade materials that feature low passive intermodulation (PIM), low loss, and are suited for use in antennas for 3G, WiMAX and LTE cellular base stations, satellite earth stations, GPS systems, and RFID readers.

Transistor Outline Packages

Tue, 9 Sep 2008
SCHOTT Electronic Packaging offers a hermetic transistor outline (TO) for fiber channel applications of 17 gigabits/second and beyond. The TO PLUS Line reportedly overcomes the normal limitations of a TO by combining glass and packaging design aspects. Up to 6 pins, including higher frequency and DC (electrical) ports, most of the necessary electronics can be packaged into a regular TO footprint, rather than resorting bulky complex hybrid packages.

Wafer Bonder for CMOS Image Sensors

Tue, 9 Sep 2008
In response to market needs for 300mm process equipment capabilities to demonstrate 3D processes, SUSS MicroTec has introduced The XBC300. The XBC300 is designed for 3D integration and 3D packaging with through silicon vias (TSVs) and is ideal for the CMOS image sensor (CIS) early adopter market.

Electron Source Module

Mon, 9 Sep 2008
The extreme field emission gun (X-FEG) electron source module for FEI's Titan family of scanning transmission electron microscopes (S/TEMs) combines higher brightness with the high, ultra-stable current of thermally-assisted field emission. This combination is said to improve resolution, speed, sensitivity and ease of use to the Titan.

Online Interview: Wilfried Bair, SUSS MicroTec, Talks 3D

Thu, 9 Sep 2008
(September 25, 2008) WATERBURY, VT — Things may appear to be slow right now in the semiconductor industry, but fab expanision due to the 300mm transition, the focus of resources on improving factory efficiency, and the expected adoption of through silicon vias (TSVs) bodes well for equipment manufactures in 2009. Wilfried Bair, VP business development and general manager, Bonder Division talked to AP about how SUSS MicroTec is getting ready for 300mm and 3D integration.

SMT Magazine Presents Packaging Panel at IPC Midwest

Wed, 9 Sep 2008
(September 24, 2008) SHAUMBURG, ILSMT editor-in-chief Gail Flower chaired a panel comprising equipment supplier, laboratory, EMS provider, and consultant voices at IPC Midwest in Schaumburg, Ill. David Geiger, Flextronics International; Jacques Coderre, Unovis Solutions; Vern Solberg, STI - Madison; and Gene Dunn, Panasonic Factory Solutions of America spoke about emerging packaging technologies.

Combating Component Obsolescence — A Visit to Rochester Electronics

Tue, 9 Sep 2008
By Meredith Courtemanche, managing editor, SMT Magazine
"In a perfect world." This is a phrase uttered by many a project leader or product designer compiling a bill of materials (BOM) for a new product, new run of an existing assembly, or modified design. In a perfect world, market trends, materials changes, and technology advances would have no effect on the availability of components. No component would ever be obsolesced.

EMC3D Consortium Achieves Cost Goal for TSV

Mon, 9 Sep 2008
(September 8, 2008) SANTA CLARA, CA — 2 years ago, the EMC3D Consortium, open consortia of equipment and materials manufacturers, established itself and set out to develop a process flow and cost model for 3D integration. Focusing on via-first TSVs as the method of interconnect, the intention was to find a solution to achieving this for $200/wafer cost of ownership (CoO) on a 3-year timeline. It appears, however, that they've beaten their own goal ahead of schedule.

Tegal to Acquire Alcatel Micro Machining Systems Product Line

Fri, 9 Sep 2008
(September 5, 2008) PETALUMA, CA — Tegal Corporation announced an agreement with Alcatel Micro Machining Systems (AMMS) and Alcatel-Lucent to acquire their deep reactive ion etch (DRIE) and plasma-enhanced chemical vapor deposition (PECVD) products, and the related intellectual property. The addition of these capabilities to Tegal's plasma-etch and deposition systems will reportedly enable Tegal to further expand into MEMS and 3D wafer level packaging applications.

Pac Tech Announces Grand Opening and Technical Symposium

Mon, 9 Sep 2008
(August 31, 2008)SANTA CLARA, CA— In celebration of its new 55,000 sq.ft. wafer bumping and back-end processing facility in Penang, Malasia, Pac Tech Packaging Technologies is planning a grand opening ceremony and technical symposium on September 18 and 19, 2008, respectively. The festivities are intended to bring attendees up to date on all facility's capabilities, and inform them on new developments in packaging technology.

From the Advisory Board

Mon, 9 Sep 2008
Temperature Stabilization for MEMS Devices
By Seri Lee, Ph.D., Nextreme Thermal Solutions
Advances in thin-film thermoelectrics enable novel temperature stabilization for applications in MEMS packaging. As the electronics industry moves towards smaller packaging form factors and higher heat densities, non-uniform thermal conditions can directly affect the performance and reliability of MEMS devices.

Wafer Bond Cluster Tool

Mon, 9 Sep 2008
Designed for advanced MEMS manufacturing and 3D wafer bonding, the CBC200 from SUSS MicroTec is a fully-automated, wafer bond cluster with up to 90 kN bond force and 600°C thermal capacity. These features are said to enable die size and cost reduction for MEMS devices. Additional features include post-bond alignment accuracy for metallic bonds to 1.25µm and cluster design concept and software for 24/7 production.

3D Technology and Beyond: 3D All Silicon System Module

Tue, 9 Sep 2008
By Ritwik Chatterjee, Ph.D., and Rao R. Tummala, Ph.D, Packaging Research Center—Georgia Institute of Technology
There is a need for miniaturization at the IC, module, and system levels. There is stil research and development required to bring this hetero-integration technology to cost-effective implementation with required reliability and performance needs. In addition to the module level, we must focus on performance, form factor, cost, and reliability of the entire system.

RFIC Design Environment

Tue, 9 Sep 2008
Version 2008 of Applied Wave Research's (AWR) Analog Office design environment is targeted for radio frequency integrated circuit (RFIC) design, and reportedly includes numerous enhancements to the user interface and design flow for increased user flexibility and productivity. Project, elements, layout tabs, and the status window are now dockable and floatable, providing a design environment that is fully configurable to suit personal preferences.

EV Group and Brewer Science Establish Ultra-thin Wafer Bonding Lab

Wed, 1 Jan 2009
(January 7, 2009) ST. FLORIAN, Austria and ROLLA, MO— In response to a call for localized support and increased demand of 3D IC process development in Asia Pacific, EV Group (EVG) and Brewer Science, Inc. have set out to outfit an ultra-thin wafer bonding lab in Taiwan. To this end, the companies announced the installation of an EVG 500 series wafer-bonding system at Brewer Science's Taiwan applications lab in Hsinchu Science Park.

FINETECH Appoints Axiomatek as Exclusive Rep in Mexico

Wed, 1 Jan 2009
(January 7, 2009) TEMPE, AZ — FINETECH, an equipment provider for advanced rework and packaging and assembly applications, has selected Axiomatek as the exclusive sales representative in Mexico to provide those customers local access to FINETECH's product line. Axiomatek is headquartered in Santa Teresa, New Mexico and has multiple offices in Mexico.

Sarnoff Awarded Reverse Engineering DoD Contract

Tue, 1 Jan 2009
(January 6, 2009) PRINCETON, N.J— In a move to safeguard its military microcircuit supply against obsolete, counterfeit, or Trojan horse microcircuits, the Department of Defense (DoD) has contracted with Sarnoff Corp. to enhance its existing microcircuit reverse engineering capabilities used for remanufacturing obsolete military quality microcircuits.

TSV First and Last: Through-Si Via Technologies for 3D SIC and 3D WLP

Wed, 1 Jan 2009
Part 2
By Jan Provoost and Eric Beyne, IMEC
3D SIC uses a via first approach to connect circuits at the global IC level. 3D WLP uses a via last approach to connect circuits at the bond pad level. Both these approaches occupy a separate space on the 3D roadmap. This article, presented in two parts, offers both options and describes the process to realize them.

EVG, AMAT pair for 3D thin-wafer bonding

Fri, 7 Jul 2009
EV Group and Applied Materials say they will jointly develop wafer bonding processes for making through-silicon vias (TSV) in 3D IC packaging applications, working as members within the Semiconductor 3D Equipment and Materials Consortium (EMC-3D).

Stepping up to the 3D challenge

Wed, 7 Jul 2009
Soitec's president and CEO, André-Jacques Auberton-Hervé, discusses the three pillars of 3D integration at the wafer level, as well as bonding at room temperature. Also noted is Soitec's partnership with IBM, announced during SEMICON West.

Mentor Graphics Chairman, CEO Keynotes Semicon West

Mon, 7 Jul 2009
(July 13, 2009) WILSONVILLE, OR — Mentor Graphics Corporation's Walden C. Rhines, Ph.D., will present the keynote at Semicon West 2009 in San Francisco, CA, this week. The chairman and CEO of the design software company will talk about the myths and realities of the global semiconductor industry on July 15, at 10 am.

Lockheed Martin Partners with Nextreme for Thermal and Power Management Tech Development

Tue, 7 Jul 2009
(July 28, 2009) DURHAM, NC — Nextreme Thermal Solutions and Lockheed Martin (NYSE: LMT) entered into a cooperation agreement to develop new products based on Nextreme's thin-film thermoelectric materials. The agreement allows Lockheed Martin to use Nextreme's thin-film thermoelectric products and thermal and power management design services in solutions it is developing for government and civil applications.

International Wafer-Level Packaging Conference (IWLPC) Finalized

Wed, 7 Jul 2009
(July 22, 2009) MINNEAPOLIS — The 6th Annual International Wafer-Level Packaging Conference (IWLPC), October 27-30, 2009, Santa Clara, CA includes tutorials, expert panel discussions, Dr. Rao Tummala keynoting, and 18 tech sessions.

Reuters: Samsung Investing $4.3B for Environmentally Friendly Electronics

Mon, 7 Jul 2009
(July 20, 2009) SEOUL, South Korea — Samsung Electronics will invest 5.4 trillion won ($4.3 billion) in green research and development and facilities to make it a leading eco-friendly company by 2013, report Cho Meeyoung and Rhee So-eui, Reuters.

Linde Electronics Roundtable on Gases

Fri, 7 Jul 2009
At Intersolar, held in conjunction with SEMICON West in San Francisco this week, Linde Electronics, supplier of ultra-high purity bulk and specialty gases and services to the semiconductor, flat panel display, PV and electronic packaging industries, held a roundtable discussion.

SEMICON West: Jan Vardaman and Paul Siblerud Analysis

Fri, 7 Jul 2009
Paul Siblerud, SEMITOOL, discusses the role of the EMC-3D consortium in developing new packaging technologies, such as through silicon vias (TSV). Jan Vardaman, TechSearch International, examines the barriers, and breakthroughs, around 3D integration.

Nextreme Raises $8M in Corporate Funding

Fri, 7 Jul 2009
(July 10, 2009) DURHAM, N.C. — Nextreme Thermal Solutions raised $8 million in additional Series B financing from undisclosed corporate investors. Nextreme has now raised more than $21 million in Series B financing and $35 million since its inception in 2004. The additional funding will be used to expand energy harvesting for micro and portable power and for thermal management products in computing, consumer, and mobile markets.

Integrated Circuit (IC) Economics Market Report

Tue, 7 Jul 2009
(July 7, 2009) MONTREAL, Canada — The 2009 IC Economics report is a comprehensive overview of the economics of IC manufacturing and the IC industry in general, released by Electronics.ca Publications. The product is designed to provide a broad understanding of IC manufacturing costs and presents benchmarking data. A high level discussion of the economics of the IC industry with market and cost trends is also included.

Technologists Investigate Challenges for 3D Interconnect Metrology

Wed, 7 Jul 2009
July 1, 2009 -- To gain a better understanding of how new and existing wafer metrology technologies can be used, modified, or enhanced to measure and improve 3D interconnect processes, SEMATECH will host a workshop dedicated to 3D interconnect metrology on July 15 in conjunction with SEMICON West in San Francisco, CA.

Interplex Acquires Quantum Leap Packaging

Mon, 7 Jul 2009
(July 20, 2009) COLLEGE POINT, NY — Component and assembly maker Interplex Industries acquired Quantum Leap Packaging Inc. (QLP), an electronics packaging and polymer science company. Included in the transaction are all of QLP's proprietary technologies including resin technologies such as Quantech for hermetic semiconductor packaging.

3D integration: A status report

Tue, 7 Jul 2009
3D IC technology, an alternative approach to wire-bonded chip stacking utilizing interconnets with through-silicon vias (TSVs) fabricated with front-end-like processes, is a hot topic at SEMICON West, and the focus of an on-line virtual forum hosted by public relations firm MCA.

SUSS, Thin Materials Cooperate on Temporary Bonding for 3D Packaging

Wed, 7 Jul 2009
(July 8, 2009) GARCHING and MUNICH, Germany — SUSS MicroTec and Thin Materials, a semiconductor process development company, are cooperating on a temporary bonding solution to be used for challenging thin wafer handling technologies required for emerging 3D integration and packaging technologies. With this cooperation SUSS MicroTec extends its solution portfolio for temporary bonding and thin wafer handling.

VLSI Forecast for Semiconductor Equipment

Thu, 7 Jul 2009
Semiconductor equipment manufacturers posted a book-to-bill ratio of 1.01 in June, according to VLSI Research. It was the first increase above parity since July 2008. Although bookings and billings remain well below normal levels, business activity is beginning to improve. Back-end suppliers are seeing a considerable pick up in business activity amid soaring utilization rates at the subcontractors.

Nanolab Technologies Adds X-Ray Capabilities

Wed, 7 Jul 2009
July 1, 2009 -- Xradia, Inc., a developer and manufacturer of high-resolution 3D X-ray imaging systems, announced a partnership with NanoLab Technologies. The companies will offer 3D X-ray imaging as part of a service model that enables customers in the electronics and semiconductor industry to address semiconductor packaging development and failure analysis challenges while evaluating the purchase of their own systems.

AMAT Joins EMC-3D Consortium

Tue, 2 Feb 2009
Applied Materials, Inc. has joined the international EMC-3D semiconductor equipment and materials consortium, which focuses on 3D chip stacking and MEMS integration.

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Mon, 2 Feb 2009
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GLOBALFOUNDRIES, Amkor co-develop semiconductor assembly and test methods

Mon, 8 Aug 2011

GLOBALFOUNDRIES entered into a strategic partnership with Amkor (NASDAQ:AMKR) to develop integrated semiconductor assembly and test processes for advanced silicon nodes. The aim is integrated fab-bump-probe-assembly-test steps that can be commercialized across multiple customers and end-market applications.


Cabot divests Supermetals biz to GAM

Fri, 8 Aug 2011

Cabot Corp. (NYSE:CBT) will sell its Supermetals business to Global Advanced Metals (GAM), a supplier of tantalum ore to the Supermetals business.


Package-on-package (PoP) track at SMTAI

Wed, 8 Aug 2011

The SMTA will host conference events with Amkor, Research in Motion, and TechLead Corporation on package-on-package (PoP) 3D stacking at SMTA International (SMTAI), October 16-20 in Fort Worth, TX.


Assembleon launches packaging toolset with low impact force

Tue, 8 Aug 2011

Assembl

STATS ChipPAC names top suppliers of 2010

Tue, 8 Aug 2011

SATS provider STATS ChipPAC Ltd. (SGX-ST:STATSChP) honored its top materials and equipment suppliers in 2010, recognizing "intense focus and commitment to performance, quality, cycle time, and cost."


NATI adds PPMU and SMU test modules to PXI platform

Mon, 8 Aug 2011

National Instruments (Nasdaq: NATI) added per-pin parametric measurement unit modules and source measure unit modules to its PXI platform for semiconductor characterization and production test.


STATS ChipPAC adds former STM exec to Board

Mon, 8 Aug 2011

Semiconductor packaging and test provider STATS ChipPAC Ltd. (SGX-ST: STATSChP) welcomed Pasquale Pistorio as an advisor to its Board of Directors.


Compugraphics expanding photomask sizes for WLP

Fri, 8 Aug 2011

Compugraphics International is widening its line of photomasks to include larger-area products up to 16 in2, responding to customer demand for wafer-level packaging and other semiconductor and optical applications.


Multitest test contactor wins out in IDM yield comparison

Thu, 8 Aug 2011

An IDM recently performed side-by-side comparisons of a Multitest Mercury test contactor and an "established contactor of an incumbent Asian competitor" during high-volume production package testing.


Inside the Known Good Die conference

Wed, 8 Aug 2011

The annual Known Good Die (KGD) conference, taking place Nov. 10 in Santa Clara, CA, will address semiconductor die testing, assembly, manufacturing, and business challenges, with the tagline "KGD in an Era of Multi-Die Packaging and 3D Integration."


Nemotek wafer-level camera integrates CMOS image sensors

Wed, 8 Aug 2011

Nemotek Technologie uncrated the Exiguus, with a VGA wafer-level camera integrating wafer-level optics assembled with CMOS image sensors (CIS).


MEMS, 3D packaging major factors in iNEMI roadmap

Tue, 8 Aug 2011

The 2011 iNEMI Roadmap, published by the International Electronics Manufacturing Initiative (iNEMI), includes a new chapter on MEMS and sensors, and an expanded chapter on packaging to include substrates discussions.


Johnstech renames Kelvin-ready test contactor

Mon, 8 Aug 2011

Johnstech International Corporation is rereleasing the configurable ROL 200K (Kelvin) Test Contactor as the ROL 200KR Kelvin-Ready Test Contactor for both pad and leaded style devices.


Tessera adds DARPA former director to board

Mon, 8 Aug 2011

Tessera Technologies appointed Anthony J. Tether, Ph.D., to its board of directors. Tether is CEO of The Sequoia Group, and has held executive positions at DARPA and Ford Aerospace Corp., among others.


SEMI convenes system-in-package summit alongside SEMICON Taiwan

Fri, 8 Aug 2011

SEMI will hold the first-ever SiP Global Summit, September 7-9, co-located with SEMICON Taiwan. Three forums cover system in package (SiP) test, the "3D IC era," and the requirements of mobile electronics.


Henkel's Dixon at SEMICON West: Silver sintering, die-attach validation

Thu, 8 Aug 2011

Doug Dixon from Henkel explains two announcements the company made at SEMICON West: a silver sintering material that requires no pressure, and joint work with STMicroelectronics on conductive die attach films for very small package configurations.


LED packaging equipment for better throughput, quality, and yields

Thu, 8 Aug 2011

In these 2 video interviews from SEMICON West 2011, ESI technologists John Sabol and Vernon Cooke discuss what LED chips require on the back-end manufacturing line, starting at wafer scribing and moving on through test.


Plasma treatment research lab launched in China

Thu, 8 Aug 2011

Nordson MARCH and Science College of Donghua University, Shanghai, China launched a joint laboratory for plasma research and education. The college and supplier will share equipment, research projects, personnel resources, and additional resources as needed.


Lack of EDA tools, thermal issues impeding 3D packaging technology

Wed, 8 Aug 2011

Amkor's Ron Huemoeller shares his thoughts about two panels from SEMICON West, on 2.5D silicon interposer packaging technologies and its supply chain, and 3D packaging technology and its ecosystem.


Microbonds wins University of Waterloo support

Wed, 8 Aug 2011

The University of Waterloo, Ontario, through the Applied Research and Commercialization Initiative, is supporting several companies researching and developing new products. One company receiving aid from the school is Microbonds, maker of semiconductor bonding wire.


Multitest intros 16-site package test handler

Wed, 8 Aug 2011

Multitest launched a 16-site tri-temp pick-and-place handler, the MT9510 x16. The platform can be kitted to test a range of semiconductor packages.


Amkor expands package design kit for Agilent ADS

Tue, 8 Aug 2011

Amkor has extended its Quad Flat No-Lead (QFN) package design kit to be the first such kit available for Agilent Technologies' Advanced Design System (ADS) electronic design automation software.


Analyst: Gold price surge helping Cu wire shipments

Mon, 8 Aug 2011

Industry efforts to transition from gold to copper wire are accelerating as prices for gold continue to spike to near record levels, notes TechSearch International in a new report.


Nomura divests semiconductor packaging substrate maker shares

Sun, 8 Aug 2011

Nomura Principal Finance Co. Ltd., a wholly owned subsidiary of Nomura Holdings Inc., transferred all the shares it owns in Eastern Co. Ltd. to Eastern.


iPad teardown reveals Apple's hardware supremacy

Thu, 8 Aug 2011

Apple Inc.'s iPad has thus far thwarted competitive tablets in design efficiency, according to an IHS iSuppli Teardown Analysis of eight tablet models from IHS. Major savings come from Apple's control of chips like SDRAM and applications processors.

 


DEK licenses stencil system to Great Lakes Engineering

Wed, 8 Aug 2011

Great Lakes Engineering will supply DEK's VectorGuard packaging and surface mount assembly stencil system to customers in 32 states and 3 countries.


Agilent, UC Davis found millimeter wave research center

Wed, 8 Aug 2011

Agilent and UC Davis established the Davis Millimeter Wave Research Center to develop advanced mm wave and THz systems for radar, sensors, imaging systems, communications and integrated passive devices (IPDs) found in electromagnetic metamaterials and antennae.


Data I/O's next-gen pre-placement programmer prevents operator errors

Tue, 8 Aug 2011

Data I/O Corporation (NASDAQ: DAIO) debuted the RoadRunner3 in-line programming system, a just-prior-to-placement programming tool with modules to automate processes and eliminate operator interventions.


Unisem adds LTX-Credence tester to US test dev center

Mon, 8 Aug 2011

SATS provider Unisem purchased a LTX-Credence PAx RF Test System for its Sunnyvale, CA, test development center, joining other recent test/wafer equipment purchases at the site.


TI achieves volume production with stacked clip-bonded QFN

Thu, 7 Jul 2011

Texas Instruments has shipped more than 30 million units of its PowerStack packaging technology, a combination of chip stacking and clip bonding that is designed to improve performance and chip densities in power management devices.


EVG expands HQ, hiring 100

Wed, 7 Jul 2011

EV Group (EVG), wafer bonding and lithography equipment supplier, began a manufacturing capacity expansion at its Austrian headquarters, adding floorspace, equipment, worker comforts, and a state-of-the-art visitor area. EVG will hire about 100 new staff members as part of the expansion.


TSV zen comes down to wafer processing balance

Tue, 7 Jul 2011

3D semiconductor packaging processes involve various groups, and standards are important in the hand-offs between them, explains Mark Berry, sales director at Metryx. He covers how to use metrology to protect wafer yields in 3D packaging.


3D IC with TSV show significant advances in last 12 months

Tue, 7 Jul 2011

Dr. Phil Garrou summarizes the significant commercial strides made over the past 12 months in 3D IC integration -- as defined vs. other "3D" technologies -- thanks to the promised combination of low cost and high performance.


Suss MicroTec 3D IC workshop addresses thin wafer handling and testing

Mon, 7 Jul 2011

At SEMICON West, 100+ attendees gathered at the Suss MicroTec workshop "3D Integration: Are we there yet?" to hear technical experts from around the globe to present updates on the status of 3D technology.


NSMAT licenses Pd-coated Cu bonding wire to competitor

Fri, 7 Jul 2011

Nippon Micrometal Corporation (NMC) licensed their single-layer-palladium (Pd) coated copper (Cu) bonding wire for LSI packaging to Tanaka Denshi Kogyo K.K., bonding wire manufacturer and traditionally a competitor.


Optomec aerosol jet printing featured as wire bond, TSV alternative at IMAPS Device Packaging

Tue, 3 Mar 2011

Optomec Aerosol Jet product manager Mike O’Reilly will give a presentation titled "Aerosol Jet Printing as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications" at the IMAPS Device Packaging Conference on March 9.


Hermetic wafer level packaging lowers cost with IMT Au Au bond

Tue, 3 Mar 2011

IMT introduced its hermetic gold-to-gold (Au-Au) thermo compression bonding for wafer-level packaging (WLP). In development for nearly a year, this bond is being actively used in production.


Thin film passives consortium wants participants

Fri, 3 Mar 2011

A new global R&D consortium is seeking companies to join its efforts working on embedding thin-film passive components into packages using through-silicon vias (TSV), for use in smart mobile electronics and implantable bio-electronic systems.


Gold tin process from Stellar Industries improves wettability in die bonding

Mon, 2 Feb 2011

The new gold/tin (AuSn) process from Stellar Industries is ideally matched to Stellar’s proprietary CPU copper on aluminum nitride (AlN) submounts with its sharp guillotine edge for precise edge alignments.The new gold/tin (AuSn) process from Stellar Industries is ideally matched to Stellar’s proprietary CPU copper on AlN submounts with its sharp guillotine edge for precise edge alignments.


Samsung announces wide I/O DRAM with TSVs for mobile apps

Sun, 2 Feb 2011

Weeks after announcing a 40nm 8GB DDR3 memory with 3D through-silicon vias (TSV), Samsung is showing a wide I/O 1GB DRAM also utilizing 3D TSVs, targeting mobile applications.


Multitest wins InCarrier test handling system order

Thu, 2 Feb 2011

Multitest test handling systemMultitest received its fifth full purchase order for its InCarrier device transfer system with InStrip test handling system adapted to metal frame-based carriers.


Nanometrics WLP bonding metrology tool launches with logic order

Thu, 2 Feb 2011

The Unifire 7900IR provides 3D inspection of wafer-scale packaging features as well as registration for wafer-to-wafer bonding applications for use in advanced wafer scale packaging process control.


K&S high volume fine pitch Cu wire bonding

Wed, 2 Feb 2011

Figure. Copper transition and roadmap planning. SOURCE: Kulicke & SoffaAs gold becomes more expensive, copper wire bonding becomes more appealing for chip packaging. Reverse bonding, fine-pitch bonding, looping, second bonds, and other technologies are ramping on roadmaps, according to Kulicke & Soffa (K&S).


300mm bonder will demo chip to wafer direct metallic bonding tech developed at Leti

Tue, 2 Feb 2011

CEA-Leti, in a multi-partner project with SET, STMicroelectronics, ALES and CNRS-CEMES, will demonstrate high-alignment-accuracy chip-to-wafer structures made by direct metallic bonding. Such structures are required for high-performance 3D ICs, and possibly microelectronics, optoelectronics, or MEMS.


The road ahead for SiPs

Tue, 2 Feb 2011
With the proper up-front evaluation of SiP designs, a tool box of enabling technologies, and strong team interactions between all involved parties, SiP solutions can enable novel electronic products with faster time to market than would be possible with traditional scaling. Darvin Edwards, Masood Murtuza, Texas Instruments, Dallas, TX USA

Tessera terminates Amkor license

Mon, 2 Feb 2011

Tessera Technologies Inc. (NASDAQ:TSRA) announced that on February 17, 2011, it sent Amkor Technology, Inc. an official notice of termination of their license agreement with Tessera. The two companies are currently in arbitration regarding multiple issues.


Advanced transmission lines replacement for TSVs

Fri, 2 Feb 2011

Jamal Izadian, co-founder & president of RFCONNEXT, makes the case for shaped membrane transmission lines (SMTL) for use in high-speed 3D packaging applications. SMTL supports and improves flip-chip, micro-bumping, wafer thinning, system-in-package (SiP), package-on-package (PoP), and other packaging processes by extending the bandwidth and high-speed limits of these technologies.


inTEST brings ATE subsidiaries under inTEST Thermal Solutions

Thu, 2 Feb 2011

inTEST Corporation (NASDAQ: INTT) subsidiaries, Temptronic and Sigma Systems, both in Sharon, MA, will begin operating under the umbrella trade name, inTEST Thermal Solutions Corp.


Agilent oscilloscope series debut for tight budgets

Wed, 2 Feb 2011

Agilent Technologies Inc. (NYSE:A) expanded its mixed-signal and digital-storage oscilloscope portfolio with 26 new models that comprise its next-generation InfiniiVision 2000 and 3000 X-Series. Entry-level mixed-signal oscilloscopes and an integrated function generator are part of the 2 new product groups.


STATS ChipPAC launches flip chip packaging for advanced silicon nodes

Wed, 2 Feb 2011

STATS ChipPAC launched fcCuBE technology, an advanced flip chip packaging technology that features copper (Cu) column bumps, bond-on-lead (BOL) interconnection and enhanced assembly processes. STATS ChipPAC claims the flip chip package is cost-comprable to standard packaging processes, and compatible with shrinking semiconductor device nodes down to 28nm.


Camtek logs CMOS image sensor inspection unit orders

Tue, 2 Feb 2011

Camtek Ltd. (Nasdaq:CAMT; TASE:CAMT) received an order for multiple wafer inspection systems from one of the world's largest manufacturers of CMOS image sensors (CIS).


Intel Capital leads InVisage Series C venture funding

Tue, 2 Feb 2011

InVisage pixel capture as compared to traditional image sensors.InVisage Technologies, image sensor technology start-up, received its series C round of venture funding, led by Intel Capital. The undisclosed amount will be used to bring the company's quantum-dot-based QuantumFilm technology and products into mass production.


Palomar discusses high volume HB LED assembly at Strategies in Light

Fri, 2 Feb 2011

Palomar Technologies, precision microelectronics and optoelectronic packaging systems provider, will hold meetings at Stategies in Light to discuss its recent upgrades to high-brightness LED (HB-LED) assembly.


Semiconductor industry veteran takes helm at Minco Technology Labs

Fri, 1 Jan 2012

Minco Technology Labs, hi-rel semiconductor die processing, packaging and test provider, appointed board member Bill Bradford as president and CEO.


Samsung Electronics ramps embedded multi-chip packaging with memory products

Thu, 1 Jan 2012

Samsung Electronics began producing embedded multi-chip package (eMCP) memory for use in entry- to mid-level smartphones. The products use low power double-data-rate 2 (LPDDR2) 30nm DRAM and 20nm NAND flash memory.


Hitachi Chemical claims die bonding film patent violation

Thu, 1 Jan 2012

Hitachi Chemical filed a lawsuit against INNOX in Taiwan, alleging infringement on Hitachi Chemical's Taiwanese patent related to die bonding film used in semiconductor packaging processes.


Optomec expands aerosol jet lab for 3D semiconductor packaging, PV, other device formation

Thu, 1 Jan 2012

Optomec opened its new and expanded Advanced Applications Lab and Product Development Facility in St. Paul, MN. The facility will help Optomec grow its Aerosol Jet additive manufacturing technology for advanced printed electronics applications.


Anti-counterfeiting program uses DNA to uniquely code computer chips

Wed, 1 Jan 2012

The College of Nanoscale Science and Engineering (CNSE) and Applied DNA Sciences (APDN) are partnering to prevent the counterfeiting of computer chips.


Hesse & Knipps discusses wedge bonding for RF and microwave devices at workshop

Wed, 1 Jan 2012

Hesse & Knipps Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Wedge Bonding for RF and Microwave Devices" at the Advanced Technology Workshop and Tabletop Exhibition on RF and Microwave Packaging


MHI room-temp wafer bonder line grows with 300mm tool

Mon, 1 Jan 2012

Mitsubishi Heavy Industries launched a fully automated 12" (300mm) wafer bonding tool, Bond Meister MWB-12-ST, capable of producing 3D LSI circuits at room temperature. The 300mm bonder targets production of memory chips and MPUs.


Zymet PoP underfill offers lower viscosity, CTE for finer pitches

Wed, 1 Jan 2012

Zymet introduced the CN-1736 reworkable underfill encapsulant for 0.4mm-pitch package-on-package (PoP) assemblies.


Semiconductor packaging houses gain from more device complexity

Wed, 1 Jan 2012

Increased I/O density, power/performance reqs, and other factors are increasing use of flip chip, 2.5D and 3D technologies, a boon to packaging subcontractors. But they face a challenge from foundries, and must navigate under-utilization of wire bonding capacity.


Upcoming SMTA events: IWLPC keynote named, SMTAI seeks presenters

Tue, 1 Jan 2012

The SMTA released its call for presenters for SMTA International (SMTAI) 2012, October 14-18 in Orlando, FL. The association, along with Chip Scale Review magazine, also announced the keynote for the International Wafer-level Packaging Conference (IWLPC), held November 5-8, San Jose, CA.


Teledyne Microelectronics to package Zephyr Photonics VCSELs

Tue, 1 Jan 2012

Teledyne Microelectronic Technologies will expand its optical packaging portfolio in a partnership with Zephyr Photonics, which makes a proprietary high-temp vertical-cavity surface-emitting laser (VCSEL).


Inari proposes acquisition of Amertron

Tue, 1 Jan 2012

Packaging house Inari Berhad signed an MOU to acquire Amertron Global, which operates in the Philippines and China providing microelectronics and optoelectronics manufacturing services.


UltraFlat wafer-level semiconductor test process creates permanent PCB flatness

Mon, 1 Jan 2012

Multitest qualified its UltraFlat process for high parallel vertical probe card tests. UltraFlat provides permanent overall PCB flatness for better wafer-level test.


Hesse & Knipps heavy wire bonder handles power semis

Fri, 1 Jan 2012

Hesse & Knipps Inc. introduced its next-generation BONDJET BJ93X heavy wire bonder for back-end semiconductor assembly, targeting manufacturers of power semiconductors and automotive electronics.


JEDEC publishes wide-I/O mobile DRAM standard

Thu, 1 Jan 2012

JEDEC Solid State Technology Association released a new standard for wide I/O mobile DRAM: JESD229 Wide I/O Single Data Rate. Wide I/O mobile DRAM increases die integration -- stacking chips with TSV interconnects with a SoC -- and improves bandwidth, latency, power, weight, and form factor.


Advantest to expand beyond semiconductor test

Thu, 1 Jan 2012

Haruo Matsuno, president and CEO of Advantest Corporation (TSE:6857, NYSE:ATE) shares the company's major goals, including expansion into new measurement applications, utilization of cloud computing, and more.


STATS ChipPAC expands WLP capacity with new Singapore facility

Thu, 1 Jan 2012

STATS ChipPAC held the groundbreaking ceremony for a new factory in Singapore, which will enable STATS ChipPAC to expand its manufacturing capabilities for advanced wafer level technologies.


TSRA faces stockholder challenge to Board of Directors

Wed, 1 Jan 2012

Tessera Technologies (TSRA) received a letter from Starboard Value and Opportunity Master Fund Ltd, intending to nominate 3 candidates for the TSRA Board of Directors. Tessera issued a response, saying that it has the right Board and management team in place.


PTI buys NEXX deposition tool for RDL and Cu pillar fab

Tue, 1 Jan 2012

NEXX Systems sold a 300mm Stratus electrochemical deposition (ECD) system to Powertech Technology for copper pillar bumps and re-distribution layers (RDL) fab, and possibly to make TSVs.


3D integration key to 22nm semiconductor devices

Mon, 1 Jan 2012

The benefits of 3D IC integration can be combined with aggressively scaled 22nm semiconductor devices, with More Moore (scaling) and More than Moore (package advances) developing in parallel but relatively independently, says Paul Lindner, EV Group (EVG).


FormFactor probe card tests SoCs

Thu, 6 Jun 2012

FormFactor Inc. (NASDAQ: FORM) introduced TrueScale Matrix probe cards for 200mm and 300mm Full Wafer Contact system-on-chip (SoC) test applications.


ConFab interview: Amkor's Ron Huemoeller on 3D packaging readiness

Wed, 6 Jun 2012

Ron Huemoeller of Amkor presented in the Advanced Packaging session of Solid State Technology

@ The ConFab: Supply chain or supply web for 3D packaging?

Wed, 6 Jun 2012

With many advanced packaging processes taking place on the semiconductor wafer, the traditional supply chain of front-end fab at the foundry and back-end fab at the packaging and test house is falling apart. The ConFab session,

3D and 2.5D semiconductor packaging technologies @ The ConFab

Wed, 6 Jun 2012

As packaging has played a larger and larger role in chip performance, form factor, and capabilities, The ConFab has increased its focus on back-end processes. Cue

Flash memory maker orders additional Aehr full-wafer test tool

Tue, 6 Jun 2012

Aehr Test Systems (Nasdaq:AEHR) will install an additional FOX-1 full-wafer test system at a leading flash memory manufacturer.


LED package sales to increase but revenues will stay flat until 2014

Mon, 6 Jun 2012

Displaybank published a 2009-2014 analysis of LED packages, the finished LED components used in various applications. While LED package units will grow steadily through the forecast period, revenues will remain mostly flat from 2010 to 2013.


APDN extends DNA products to microelectronics counterfeit prevention with S3IP

Mon, 6 Jun 2012

The New York State Center of Excellence in Small Scale Systems Integration and Packaging at Binghamton University (S3IP), and Applied DNA Sciences will develop new ways to embed and authenticate DNA on various substrates. This may involve marking semiconductor packaging, and exploring rapid-reading technologies to screen chips.


Xilinx relies on stacked silicon interconnect for 28Gbps FPGA

Thu, 5 May 2012

Xilinx Inc. (NASDAQ:XLNX) began shipping a 3D heterogeneous all-programmable FPGA, the Virtex-7 H580T FPGA, using its stacked silicon interconnect (SSI) technology to reach up to 16 28Gbps and 72 13.1Gbps transceiver bandwidth.


AT&S cuts embedded package design time by 40% with Mentor Graphics

Thu, 5 May 2012

Mentor Graphics collaborated with Austria Technologie & Systemtechnik (AT&S) to implement AT&S Embedded Component Package (ECP) process in Mentor Graphics

Ziptronix wafer stacking tech expands to 3D memory devices

Wed, 5 May 2012

Ziptronix Inc. is helping a 3D memory device maker replace standard die stacking with its DBI wafer-stacking technology, which has been proven in image sensor packaging.


New Japan Radio implements Cu wire bonding for power semiconductors

Wed, 5 May 2012

New Japan Radio Co. Ltd. adopted Tanaka Denshi Kogyo KK

IC package revenues outgrow unit shipments through 2016

Tue, 5 May 2012

Increased demand for product functionality is driving up IC packaging revenue faster -- a 9.8% compound annual growth rate (CAGR) -- than IC unit growth -- 7.3% CAGR 2010-2016, says New Venture Research (NVR).


Semiconductor packaging house orders 14 Rudolph Technologies inspection tools

Tue, 5 May 2012

Rudolph Technologies Inc. will deliver 14 NSX Series 320 inspection systems to a large outsourced semiconductor assembly and test (OSAT) provider.


ASE opens Phase 3 semiconductor packaging and test facility in Weihai

Tue, 5 May 2012

Advanced Semiconductor Engineering Incorporated (ASE) opened its Phase 3 manufacturing facility in Weihai, Shangdong province, China, boosting discrete packaging and test capacity.


Top suppliers of semiconductor assembly and test equipment: VLSIresearch survey

Fri, 5 May 2012

THE BEST rankings from VLSIresearch identify the highest-rated suppliers of wafer processing, assembly, and test equipment. The top 2 test equipment suppliers were just fractions apart in the rankings.


Direct chip bonding, all-SiC design increase power density in Mitsubishi Electric inverter

Wed, 5 May 2012

Mitsubishi Electric Corporation developed a prototype forced-air-cooled three-phase 400V output inverter with all-silicon carbide (SiC) power modules and direct lead bonding that has a power density of 50kVA per liter.


APNT's new thermal interface materials meet power semiconductors' reqs

Wed, 5 May 2012

Applied Nanotech Holdings Inc. uncrated the THERCOBOND family of highly thermally conductive bonding and printed materials for power electronics and photonics packaging.


Indium expands electronics materials manufacturing with new facility in NY

Wed, 5 May 2012

Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds.


Invensas debuts high-I/O PoP semiconductor packaging design

Tue, 5 May 2012

Invensas Corporation, Tessera subsidiary, debuted bond via array (BVA) technology, an ultra-high-I/O PoP semiconductor packaging alternative to wide-I/O TSV packaging.


Dow Electronic Materials promotes Muni to direct advanced packaging products

Mon, 5 May 2012

Bhavesh Muni took the helm as global business director for the Advanced Packaging Technologies business of Dow Electronic Materials, covering Dow's semiconductor packaging materials product portfolio and its manufacturing capabilities.


Amkor plans semiconductor packaging and test facility in Korea

Sat, 5 May 2012

Amkor Technology Inc. (NASDAQ:AMKR) plans to build a state-of-the-art factory and global research and development center in the Incheon Free Economic Zone, which is located in the greater metropolitan area of Seoul, Korea.


IC packaging substrates heading for $8.67B in 2012

Fri, 5 May 2012

In 2012, the global IC substrate market will reach a value of USD8.67 billion, according to Research in China

Silicon Labs offers bare die from 1 wafer and up

Wed, 5 May 2012

Mixed-signal IC maker Silicon Laboratories Inc. (NASDAQ: SLAB) introduced a microcontroller (MCU) die sales program with a minimum order quantity of 1 wafer.


Wire bonder debuts with Cu wire optimization, automatic rethreading from ASM Pacific Technology

Wed, 5 May 2012

The ASM iHawk Xpress Opto Wire Bonder from backend semiconductor assembly equipment supplier ASM Pacific Technology offers new innovations in transport, copper-wire bonding, and automatic rethreading.


Kulicke & Soffa expands Singapore HQ, bolsters bonder tool R&D and manufacturing

Wed, 5 May 2012

Kulicke & Soffa broke ground on its Singapore global headquarters expansion, near the current leased headquarters location. A state-of-the-art facility in Serangoon will bolster the company

DRIE expands from MEMS to advanced packaging and more applications

Tue, 5 May 2012


"3.5D interposer technology could someday replace PCBs" -- TSMC's Doug Yu

Tue, 5 May 2012

TSMC

Heraeus Al-clad Cu bonding wire avoids metallization changes in power semiconductors

Mon, 5 May 2012

Heraeus introduced its high-reliability composite aluminum/copper (CucorAl) semiconductor bonding wire, which offers strong mechanical and electrical bonds to semiconductor pads, with good thermal properties.


Amkor record 2010 financials capital investments in 2011

Thu, 2 Feb 2011

Amkor Technology Inc. (NASDAQ: AMKR), semiconductor assembly and test services provider, announced financial results for 2010, with net sales of $2.94 billion, net income of $232 million, and earnings per diluted share of $0.91. Amkor is currently planning capital additions of approximately $500 million for 2011.


FPGAs lure designers from ASICs DSPs embedded processors says Linley report

Fri, 2 Feb 2011

Altera closed the gap on Xilinx considerably in 2010, but Xilinx's competitive 28nm product should enable it to stay at the top of the FPGA market. Start-up Achronix could be the first to reach 22nm because of its Intel connection. The Linley Group's FPGA report, "A Guide to FPGAs," covers competitors within the FPGA space, as well as FPGA adoption in the chip industry.


Hitachi Chemical Henkel die attach film license

Sun, 2 Feb 2011

Hitachi Chemical has granted Henkel a worldwide license for the manufacture and sales of certain dicing die attach film.


Keithley Avoid wafer test probe set up cabling errors

Mon, 2 Feb 2011

Dave Rose, Keithley Instruments, addresses specific cabling techniques for DC, multi-frequency capacitance, and ultra-fast I-V and pulse testing, as well as the importance of proper grounding and shielding, choosing the proper interconnect for a specific measurement, and troubleshooting common interconnect problems.


CEA Leti adds SPTS on 3D IC line with 300mm PVD order

Wed, 2 Feb 2011

SPP Process Technology Systems (SPTS) received a follow-on purchase order from CEA-Leti for its Sigma fxP PVD system. The 300mm system will be used for advanced TSV development at Leti's new 300mm fab extension in Grenoble.


Flexible silicon on polymer CMOS enables 3DICs flexible tablet PCs

Wed, 2 Feb 2011

FleX Silicon-on-Polymer replaces the mechanical substrate of a traditional silicon wafer with a pliable polymer. Compatible with CMOS wafers from varioius foundries, FleX is a wafer-scale process that can be used to produce single die up to full 200mm flexible wafers.


Stacked silicon interconnect is better than 3D stacking Xilinx

Tue, 2 Feb 2011

ElectroIQ caught up with Suresh Ramalingam, director of advanced package design and development at Xilinx, at the January MEPTEC luncheon, where he gave a presentation on the company's stacked silicon interconnect technology. In an interview with Debra Vogler, Ramalingam discusses SSIT in relation to die stacking and TSV.


Camgian integrates Air Force radar on chip with low power active logic

Fri, 2 Feb 2011

Under a 3-year, $9.3 million contract with the Air Force Research Lab (AFRL), Camgian Microsystems will develop two ASICs with ultra-low-power characteristics: an RF transceiver ASIC will use radar-on-a-chip technology, while a DSP architecture will integrate aggressive power management.


Clarkson U tallies 1.4M support from Intel

Fri, 2 Feb 2011

During the past ten years, Clarkson University has received more than $1.4 million of direct and indirect (through Semiconductor Research Corporation) funding from Intel Corporation.


3D integration comes in many flavors for semiconductor industry, says CEA Leti chief scientist

Wed, 2 Feb 2011

All the major semiconductor players are embracing 3D integration, says Simon Deleonibus. The CEA-Leti scientist and IEEE Fellow wants to see TSV mature and new technologies develop based on wafer bonding. He speaks with Debra Vogler.


Agilent Infiniium oscilloscopes gain deeper standard memory

Wed, 2 Feb 2011

Infiniium 9000, AgilentAgilent Technologies Inc. (NYSE: A) enhanced the memory depth of its Infiniium oscilloscope lineup. All 30 models now ship with the industry's deepest standard memory and offer the deepest memory options, according to the company.


Conductive pressure sensitive tapes films introduced by Creative Materials

Tue, 2 Feb 2011

Creative Materials Inc. announced a new series of pressure-sensitive tapes that suit use in the fabrication of solar cells and modules; to replace solder and/or conductive adhesive connections; or as bus bar materials for a wide variety of printed electronics applications, including touch panels, LCDs, electro-chromatic displays, and electro-luminescent displays.


RF MEMS packaging collab DelfMEMS KFM

Tue, 2 Feb 2011

DelfMEMS and KFM Technology signed a common agreement to combine their expertise in RF micro-electro-mechanical systems (MEMS) and thin film packaging (TFP) technology. DelfMEMS will use the collaboration to provide packaged MEMS switches, fixed capacitors, and high-Q inductors on the same chip.


Silicon Si interposers aim of CEA Leti SHINKO common lab

Fri, 1 Jan 2011

CEA-Leti signed a multiyear agreement with SHINKO ELECTRIC INDUSTRIES CO. LTD. to develop advanced semiconductor packaging technology. They will focus on volume production of silicon interposers.


Gate structure and 3D stacking winners will determine semiconductor industry direction

Tue, 1 Jan 2011

Arthur W. Zafiropoulo, Ultratech, sees the 20/22nm node as a competition for gate-first and gate-last proponents to discover which will lead the semiconductor industry. Device makers that master TSV chip stacking will be the winners over the course of this decade, he says. This is an online exclusive essay in SST's Forecast for 2011: Back to Reality series.


Leti on more Moore for TSV

Mon, 1 Jan 2011

Engineered substrates and 3D integration technology based on direct bonding for future More Moore and More than Moore integrated devicesLaurent Clavelier, head of solar technologies department at Leti, discusses the significance of Leti's IEDM paper #2.6 "Engineered substrates and 3D integration technology based on direct bonding for future More Moore and More than Moore integrated devices" with Debra Vogler, senior technical editor.


Tessera director Bruce McWilliams SuVolta resigns

Tue, 1 Jan 2011

Tessera Technologies (Nasdaq:TSRA) announced that Bruce McWilliams, PhD, has resigned as a member of Tessera’s board of directors effective immediately, to devote his time and attention to the needs of SuVolta's growing business.


Brush Engineered Materials changes name to Materion

Thu, 1 Jan 2011

Brush Engineered Materials Inc. (NYSE:BW) will change its name to Materion Corporation (NYSE:MTRN) and unify all of its businesses under the new name effective March 8, 2011.


Packaging, assembly changes coming in next ITRS Update

Wed, 1 Jan 2011

Dr. Phil Garrou looks ahead to a laundry list of changes coming in the next ITRS Update with respect to assembly and advanced packaging, including 3D integration, interposers, and applications from medical to automotive and embedded applications.

 


STATS ChipPAC expands wafer level packaging WLP with 300mm line

Tue, 1 Jan 2011

STATS ChipPAC Ltd. (SGX-ST:STATSChP), semiconductor test and advanced packaging service provider, expanded its wafer level package (WLP) offering with new 300mm manufacturing capabilities in Taiwan.


CEA Leti ramps 300mm 3D packaging integration line

Mon, 1 Jan 2011

CEA-Leti is expanding its technology offering, ramping up one of Europe’s first 300mm lines dedicated to 3D-integration applications. The new line is dedicated to R&D and prototyping and includes 3D-oriented lithography, deep etching, dielectric deposition, metallization, wet etching, and packaging tools.


Chipscale packaging tech garners SEMI award

Mon, 1 Jan 2011

SEMI named Thomas DiStefano, John W. Smith Jr., and Michael Warner as recipients of the 2010 SEMI Award for North America for contributions to the development and commercialization of Micro Ball Grid Array (μBGA) technology.


JEDEC expands solid state drive SSD standards

Wed, 1 Jan 2011

JEDEC Solid State Technology Association, standards developer for the microelectronics industry, today announced that its JC-64.8 Subcommittee for Solid State Drives will target the development of standards for SSDs in applications beyond conventional disk drive form factors.


China WLCSP established R and D subsidiary in CA

Mon, 1 Jan 2011

China WLCSP Co. Ltd., provider of wafer level (WLP) miniaturization technologies for the electronics industry, confirmed its commitment to the US market with the opening of a new R&D center in Sunnyvale, CA.


RoHS, device shrinks will continue to drive packaging technology

Tue, 1 Jan 2011

Environmental legislation in combination with device miniaturization will continue to drive packaging development efforts throughout 2011 and beyond, writes Doug Dixon from Henkel. And the paradigm of "smaller, thinner, more powerful" is challenging traditional design and assembly rules.


Ziptronix accuses Omnivision, TSMC of patent infringement

Fri, 1 Jan 2011

Dr. Phil Garrou takes a closer look at an IP dispute lobbed by Ziptronix against Omnivision and TSMC over low-temperature oxide bonding, used in making backside-illumination CMOS image sensors.


Interposer focus at recent RTI 3D conference

Thu, 1 Jan 2011

Fresh off 3D announcements of IBM and Samsung, several industry leaders talked about the imminent use of 3D Interposers at the RTI 3-D Architectures for Semiconductor Integration and Packaging Conference in Burlingame CA, reports Dr. Phil Garrou.


Nautic_acquires Aavid Thermalloy for thermal management products

Tue, 1 Jan 2011

Nautic Partners has partnered with management to acquire Aavid Thermalloy LLC. Aavid designs and manufactures high-performance thermal management products used in a wide range of electronics systems and energy supplies.


Rogers buys power electronics substrate maker Curamik Electronics

Tue, 1 Jan 2011

Rogers Corporation (NYSE: ROG) has closed on the transaction to acquire Curamik Electronics GmbH, a manufacturer of power electronic substrate products headquartered in Eschenbach, Germany.


CoorsTek acquires Saint Gobain Advanced Ceramics

Tue, 1 Jan 2011

CoorsTek Inc., technical ceramics manufacturer, completed its purchase of the advanced ceramics business of Saint-Gobain. CoorsTek adds manufacturing facilities and product lines such as silicon carbide for semiconductors.


TCS to acquire Trident Space & Defense to bolster expertise in secure wireless communications

Mon, 1 Jan 2011

Trident Space & Defense, which specializes in semiconductor packaging, data storage solid state drives, high-reliability electronic components, and turnkey full-tracking ground stations, will become part of the TeleCommunication Systems Inc. (TCS) government segment, as part of an acquisition announced in 2010.


22nm: The era of wafer bonding

Tue, 1 Jan 2011

The migration to the 22nm node is about more than just scaling down, it's also about scaling up with thinner devices stacked into a single package -- and these require new manufacturing considerations with wafer bonding playing a central role, writes Bioh Kim from EV Group.


Thermal nano tape for semiconductor packaging

Mon, 1 Jan 2011

SRC and researchers from Stanford University have developed a combination of elements that yields a unique nanostructure material for packaging. This advance should allow longer life for semiconductor devices while costing less than current state-of-the-art materials.


Advanced packaging collab Rudolph Technologies process tool supplier IC device manufacturer for defect inspection wafer debonding

Tue, 1 Jan 2011

The development effort involves the integration of defect inspection with a debonding tool. Manufacturing efficiencies, along with the ability to handle ultra-thin wafers, necessitates the integration of inspection in de-bonding applications. Rudolph is bringing its inspection technologies to this three-way collaboration to provide this integrated process control solution.


Aries 0.30mm pitch test sockets suit BGA CSP MLF packages

Fri, 1 Jan 2011

High-frequency center probe test sockets from AriesAries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers machined high-frequency center probe test sockets to accommodate IC devices with a lead pitch of 0.30mm.


Wafer probe parameters for current carrying capability in semiconductor test Microprobe

Tue, 3 Mar 2011

Typical plot resulting from the SEMI methodology; a 20% contact force reduction marks the CCC spec. CCC improvement achieved through probe material conductivity (electrical and thermal) and high temperature strength increase. 75µm probe deflection.The trend toward complex semiconductor devices is fueling demand for more advanced wafer probe cards capable of accurately and cost-effectively testing these ICs, says January Kister, Microprobe. Kister examines the variables that impact current carrying capability (CCC) during semiconductor wafer test, and describe an optimal probe design with a composite metal structure.


IMAPS: 3D IC toolset readiness, Cu bonding, interposer failings

Tue, 3 Mar 2011

Dr. Phil Garrou reports on several talks and trends of note from the recent IMAPS meeting and Device Packaging Conference: the readiness of 3D IC toolsets, what's holding back Cu bonding; and rumors of interposers failing thermal tests.


TSV can deal with stress says Synopsys

Mon, 3 Mar 2011

Victor Moroz discusses the strong but doable effects of stress on TSVs. TSV stress ranges are comparable to the size of the TSV, and analog behaves differently than digital. Synopsys recently presented results (part of a collaboration with imec) at a SEMATECH event.


CEA Leti IPDiA partner 3D integration for passives on Si

Mon, 3 Mar 2011

CEA-Leti and IPDiA have formed a common lab to capitalize on their complementary expertise in miniaturization and 3D integration on silicon. The common lab will develop very high-end passive components that will resist harsh environments, functional sub-mounts for LEDs, and assembly technologies.


IBM to use water cooling for future 3D IC processors

Fri, 3 Mar 2011

At the recent CeBIT Fair in Hanover Germany, IBM announced that its 3D technology to appear in its Power8 processor by 2013 will incorporate microchannel cooling.


Samsung licenses Tessera OptiML zoom tech

Thu, 3 Mar 2011

The System LSI Division of Samsung Electronics Co. Ltd. has licensed the OptiML Zoom image enhancement solution from Tessera Technologies Inc. (NASDAQ:TSRA).


GE thermal material substrate conducts heat better than copper

Wed, 3 Mar 2011

Figure. A diagram of GE's advanced thermal material system. Leveraging unique surface engineered coatings that both repel and attract water, GE's system achieves twice the heat conducting properties of copper and can function under extreme forces of gravity.GE's prototype thermal interface material, developed with nanotechnologies, suits high-heat, high-reliability applications in mobile devices, aviation electronics, and other systems.


Japan quake hampering package substrate supplies

Wed, 3 Mar 2011

Amid questions about the impact of the Japan earthquake on electronics and semiconductor production, there's one angle that could directly affect the semiconductor packaging sector: BT resin shortages.


KLAC packaged IC inspector ICOS CI T620

Tue, 3 Mar 2011

KLAC's ICOS CI-T620, a high-performance component inspector system for tape and reel.KLA-Tencor Corporation (Nasdaq: KLAC) introduced the ICOS CI-T620, a high-performance component inspector system for tape and reel. The CI-T620 system has dual tapers working sequentially with minimal operator intervention to increase units per hour.


TeraView partners with HELIOS on THz semiconductor package failure analysis

Tue, 3 Mar 2011

TeraView and HELIOS are partnering to improve semiconductor package failure analysis using terahertz technology. The technology was originally developed with Intel and isolates faults in advanced 3D semiconductor packages.


Unisem adds Accretech wafer prober for 12 in wafers in Sunnyvale

Mon, 3 Mar 2011

Accretech’s next generation prober, the UF3000EX, offers high-speed wafer handling, a low-noise XY stage, and high accuracy with its OTS (Optical Target Scope) positioning technology. 


Molex joins antenna consortium

Mon, 3 Mar 2011

Molex Incorporated, interconnect supplier, has joined with other researchers to advance the goals of the Danish SAFE (Smart Antenna Front End) project. Scheduled to span four years, the $8.7 million project is being conducted by a consortium comprising Aalborg University, Intel Mobile Communications, WiSpry and Molex.


SEMATECH reports die to wafer bonding progress for 3D integration

Wed, 3 Mar 2011

SEMATECH experts reported new breakthroughs in wafer bonding at the 7th Annual Device Packaging Conference (DPC), March 7-10 in Scottsdale, AZ. Low-temp die tacking has yielded faster die-to-wafer integration.


Hynix Semiconductor joins SEMATECH 3D Interconnect Program at UAlbany NanoCollege

Wed, 3 Mar 2011

Hynix Semiconductor Inc., DRAM and flash memory supplier, joined SEMATECH's 3D Interconnect program at CNSE's Albany NanoTech Complex to address industry infrastructure and technology gaps in materials, equipment, integration and product-related issues for high-volume adoption of through silicon vias (TSV).


Accel RF ships reliability test systems for compound semiconductors in Asia

Fri, 3 Mar 2011

Accel-RF Corporation installed two advanced semiconductor reliability test systems for customers in Taiwan and Japan. The systems were delivered in Q4 2010 with installation completed in early January 2011.


Multitest wafer level test contactors approved by fabless customer for Asia testing

Thu, 3 Mar 2011

Multitest announced that a major fabless semiconductor manufacturer has evaluated and approved its Mercury-based wafer-level contactors for subcontractors in Asia.


TSV substrates for power amplifiers A*STAR IME partners with ELTA Systems

Mon, 3 Mar 2011

The collaboration will result in new applications in multi-chip modules in radar, communication, and electronic warfare systems. The new technology platform would enable miniaturization of wireless applications that are faster, lighter and can withstand higher temperatures.


Thermal modeling software aids 3D IC, SoC, SiP designs

Thu, 3 Mar 2012

Docea Power, power and thermal analysis software supplier, released AceThermalModeler for generating compact thermal models of SoCs, 3D ICs, SiP devices, and complete boards.


Package and test provider orders new Verigy Smart Scale technology

Thu, 3 Mar 2012

Two-element wafer-level camera from Nemotek boasts low distortion

Tue, 2 Feb 2012

Nemotek Technologie uncrated a two-element wafer-level camera, Exiguus H12-A2. The two-element lense gives Exiguus H12-A2 high resolution and low (<0.5%) distortion.


LED packaging report reveals costs, reliability impact of package

Fri, 2 Feb 2012

With thermal issues accounting for half of all lighting failures, and costs prohibitive to widespread adoption, assembly and packaging are keys to improving LEDs. TechSearch International tracks LED packaging materials and methods, as well as reliability and package efficiency.


NEXX Systems bolsters employee skills with new grant

Thu, 2 Feb 2012

Present at ESTC 2012 in Amsterdam

Tue, 2 Feb 2012

Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.


Amkor plans IMAPS Device Packaging keynote

Tue, 2 Feb 2012

The 2012 IMAPS Device Packaging Conference will take place March 6-8 in Fountain Hills, AZ, with Amkor's Dr. Robert Darveaux presenting "Escalating Challenges in Developing Complex Solutions for Next Generation Package and Interconnect Technologies."


Join iNEMI's electronics manufacturing supply chain workshop at IPC APEX

Fri, 2 Feb 2012

iNEMI will hold the industry kick-off for its 2013 Roadmap in an open workshop immediately following IPC APEX EXPO in San Diego, CA, March 1-2.


Georgia Tech produces 130um 3D organic semiconductor package

Thu, 2 Feb 2012

Georgia Tech

Universities: Enter to win a Finetech die bonder

Wed, 2 Feb 2012

Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges.


Hesse & Knipps opens wedge bonder demo lab on West Coast

Wed, 2 Feb 2012

Backend packaging equipment supplier Hesse & Knipps Inc. opened a West Coast Demo and Applications Laboratory at its manufacturer rep Chalman Technologies.


LEDs, power semiconductors packaged with high-thermal-conductivity die attach adhesives

Wed, 2 Feb 2012

Engineered Material Systems released the DA-5045-2 and DA-5045-4 high-thermal-conductivity die attach adhesives for LEDs and small power semiconductor die packaging.


Amkor continues cost reductions with voluntary retirement in Japan

Fri, 2 Feb 2012

Amkor (NASDAQ:AMKR) shared that it cut costs through workforce reductions in Q4 2012, and announced a voluntary retirement program in Japan to continue this initiative.


Synova Laser MicroJet wafer dicing tools to be made by Makino

Thu, 2 Feb 2012

Synova SA formed an OEM agreement with its partner Makino Milling Machine Co. Ltd., wherein Makino will manufacture Laser MicroJet (LMJ) tools based on Synova technology.


SATS providers order BTU reflow ovens in Asia

Wed, 2 Feb 2012

BTU International Inc. won multiple orders for PYRAMAX solder reflow ovens from semiconductor assembly and test subcontractors (SATS) in Asia.


Kyocera doubles flip-chip assembly with new cleanroom in US

Tue, 2 Feb 2012

Kyocera America, Inc. doubled its flip chip assembly capacity for microelectronic devices with a $3.5 million Class-10,000 cleanroom, offering lead-free processes in San Diego.


Rudolph sells metrology tool for back-end wafer packaging processes

Mon, 2 Feb 2012

Rudolph Technologies (NASDAQ:RTEC) delivered the first MetaPULSE metrology system to measure under bump metallization (UBM) and redistribution layers (RDL) in advanced package manufacturing.


SUSS wafer bonder/debonder features up to 6 modules in new generation

Mon, 2 Feb 2012

SUSS MicroTec launched the XBC300 Gen2 high-volume 3D wafer processing tool for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers.


X-FAB Silicon Foundries adopts SFT software

Fri, 2 Feb 2012

X-FAB Silicon Foundries, a More-than-Moore semiconductor foundry, has used SFT's R3D (Resistive 3D) software for its 0.18

3M debuts high-capacitance ECM for IC packaging, RF, other apps

Thu, 2 Feb 2012

3M launched a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced electromagnetic interference (EMI).


Multitest launches MT9510 x16 test tool with Asian sale

Wed, 2 Feb 2012

Multitest launched its tri-temp 16-site pick-and-place platform, MT9510 x16, with an installation at a high-volume chip test site in Asia.


STATS ChipPAC shutters Thailand semiconductor packaging plant after floods

Wed, 2 Feb 2012

STATS ChipPAC decided not to resume semiconductor assembly operations in its Thailand plant, owing to extensive equipment and facility damages sustained during the disastrous floods in 2011.


CEA-Leti launches 3D semiconductor packaging platform

Tue, 1 Jan 2012

CEA-Leti launched a major new platform, Open 3D, that provides industrial and academic partners with a global offer of mature 3D packaging technologies for their advanced semiconductor products and research projects.


Tanaka establishes copper bonding wire production in Taiwan

Tue, 1 Jan 2012

Tanaka Denshi Kogyo K.K., of Tanaka Precious Metals, will establish a production subsidiary for manufacturing copper bonding wire in Taiwan, with manufacturing ramp on February 1.


Keithley Instruments upgrades semiconductor test software suite

Thu, 1 Jan 2012

Keithley Instruments Inc. upgraded the capabilities of its Automated Characterization Suite Test Environment to ACS Version 4.4. The software is used with several Keithley instrument and system configurations for automated device characterization and reliability analysis.


3D MID sensor fabricated with Ticona laser-activated LCP circuits

Wed, 1 Jan 2012

2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device flow sensor that uses Ticona's Vectra E840i LDS laser-activated LCP for electronic circuits. The Vectra E840i forms circuits on 3D injection moldings produced with an LDS process.


Presto Engineering semiconductor service hub opens in Israel

Tue, 1 Jan 2012

Presto Engineering, integrated semiconductor test and product engineering services provider, opened its newest Hub to serve the semiconductor design community, in Israel.


USPTO seeks nominees for National Medal of Technology and Innovation

Tue, 1 Jan 2012

The USPTO is looking to increase the diversity of honorees for its annual National Medal of Technology and Innovation (NMTI), honoring "this nation's creative geniuses."


Sony stacks CMOS image sensor pixel structures and chips

Mon, 1 Jan 2012

Sony has developed a backside-illuminated CMOS image sensor that layers the pixel section with back-illuminated structures over the chips containing signal processing circuits, instead of using supporting substrates.


WLCSP QFN ELP Semiconductor packaging for consumer applications

Wed, 1 Jan 2011

Semiconductor packaging for consumer products. Source: UnisemThere are a few key attributes in new consumer electronics: a reduced footprint and/or profile, high electrical performance, fine-pitch design, custom features, and a low cost. Multi-row, wafer-level, flip-chip, and multi-chip packaging can meet these needs, say Unisem writers Rico San Antonio and Chris Stai. They compare the value of each packaging type.


Wafer level packaging of image sensors

Sat, 1 Jan 2011
Wafer-level packages that use a glass cover over the package cavity and through-silicon vias to interconnect the die bond pads satisfy the packaging requirements for CMOS image sensors: compact, reliable, low cost, and accommodate both front- and back-illuminated image sensors with no external changes. Giles Humpston, Tessera Inc., San Jose, California, USA

Tooling and process technology vital for thin packages

Tue, 1 Jan 2011

Getting thinner appears to be the goal driving the market in both the wafer-level and substrate-level sectors, and innovative tooling and process technology will become paramount in addressing thinned packaging and ramping up to volume reliably, writes Dave Foggie from DEK.


QFN leadframes without plating etching waste or bulk EoPlex

Mon, 1 Jan 2011

EoPlex model showing different materials (colors) and different metastructures (patterns).Arthur Chait, president and CEO of EoPlex, describes the company’s high-volume print forming technology -- a lead carrier product called xLC-- and how it enables a cost-effective replacement for conventional quad flat pack no-lead (QFN) leadframes.


Low shrinkage adhesive for optical assembly

Thu, 1 Jan 2011

DYMAX OP-67-LS opto-mechanical adhesiveA fast-cure, low-shrinkage adhesive for optics and optical assembly, DYMAX OP-67-LS opto-mechanical adhesive cures in seconds for bonding of optical components. The product's low-shrink nature virtually eliminates movement during curing and subsequent thermal cycling.


Lifting the veil on silicon interposer pricing

Mon, 12 Dec 2012

Are we closer than we think to our needed mass production costs for silicon interposers? Phil Garrou gleans some insights from the year-ending RTI Architectures for Semiconductor Integration and Packaging conference.


Singapore IME launches 2.5D silicon interposer MPW

Wed, 12 Dec 2012

Singapore's Institute of Microelectronics (IME) has launched a new multiproject wafer service for 2.5D through-silicon interposers, to provide a cost-effective platform for R&D prototyping and proof-of-concept in the technology.


Tezzaron licenses Ziptronix's bonding tech for 3D memory

Mon, 12 Dec 2012

Tezzaron Semiconductor has licensed patents regarding Ziptronix's direct bonding technologies, "direct bond interconnect" (DBI) and "direct oxide bonding (ZiBond), for use in 3D memory.


Will the $2 interposer be silicon or glass?

Tue, 11 Nov 2012

Dr. Phil Garrou reports from the 2nd annual Georgia Tech 2.5D Interposer Conference: what's the market projection for silicon and glass interposers, what's preventing high-volume manufacturing, and is there a crossover with flat-panel display glass manufacturing?


Alchimer pursuing partners with new CEO, CTO

Tue, 11 Nov 2012

Alchimer SA says it is seeking partnerships with various semiconductor equipment and materials companies as it welcomes two top execs: Bruno Morel is the company's CEO since May of this year, and product development director Fr

Deca tips new M-Series chip-scale packaging offering

Wed, 11 Nov 2012

Deca Technologies has introduced a new chip-scale packaging (CSP) product line for applications where its existing wafer-level CSP option isn't a good fit. Details and analysis to come.


Texas Instruments (TI) embedded die package teardown report released

Thu, 3 Mar 2012

Texas Instruments' MicroSiP module is the first embedded die package in high volume production. Yole D

Altera taps Amkor for molded flip chip packaging of FPGA family

Wed, 3 Mar 2012

Altera Corporation will use an exposed-die molded flip chip technology from Amkor on its 28nm Arria V FPGA. Amkor

Imec's via-middle TSV fab 'reveals' contacts by wafer thinning/etch

Tue, 3 Mar 2012

Imec developed a via-middle approach to through-silicon via (TSV) manufacturing for 3D packaging, using wafer thinning and a silicon etch process to reveal TSV contacts on the wafer.


Teradyne tester boasts high throughput of consumer digital chips

Tue, 3 Mar 2012

Teradyne uncrated its Magnum semiconductor test system with a proprietary scalable chassis design and tester-per-board architecture for high compound parallel test efficiency on consumer digital devices.


Declining display costs lower large tablet prices in 2016

Mon, 3 Mar 2012

The media tablet computer market took off when Apple launched the first iPad in April 2010. Apple uses a 9.7" display; Amazon's Kindle Fire uses a 7" screen: Samsung offers Galaxy Tabs with 7", 8.9" and 10.1" displays. NPD In-Stat analyzed the tablet market by display size.


New LTXC semiconductor test tools suit ASSP, RF test

Mon, 3 Mar 2012

LTX-Credence Corporation (Nasdaq:LTXC) released the Diamondx test platform for ASSP