Thu, 12 Dec 2015
Reaction materials for chemical vapor deposition are typically delivered into the chamber in a gaseous form. The source materials can be gases or liquids.
Fri, 12 Dec 2015
Chemical vapor deposition (CVD) is used to produce high-purity thin films.
Mon, 11 Nov 2010
Cost-of-ownership (COO) will be a main driver for ALD equipment selection in cost-sensitive markets; and in foundry or other logic applications, equipment choice is more a mix between COO, turn-around time and process performance considerations. M. Verghese, ASM, Phoenix, AZ USA; J. W. Maes, ASM, Leuven, Belgium; N. Kobayashi, ASM, Tokyo, Japan
Thu, 4 Apr 2011
ASM International N.V. (NASDAQ: ASMI) received multiple system orders for its plasma enhanced atomic layer deposition (PEALD) reactor from a leading memory customer in Asia. The company also qualified a new PEALD oxide application with a memory manufacturer for the 2X nm node.
Tue, 1 Jan 2016
Stanford University researchers sponsored by Semiconductor Research Corporation (SRC) have developed a new area selective atomic layer deposition (ALD) process that promises to accelerate the manufacturing of higher performing, more energy efficient semiconductors.