North Dakota State University, Fargo, researchers have developed a packaging technology using Thermo-Mechanical Selective Laser Assisted Die Transfer (tmSLADT) to reduce the size and cost of microelectronics packages.
Nanotech accelerator SVTC Technologies, wet chem equipment maker Amerimade Technology, and chemicals company Shanghai Sinyang Semiconductor Materials will collaborate on electroplating processes for TSV that are production-ready for advanced packages and MEMS.
Thanks to MEMS, 3D packaging, LEDs, power devices, and other applications, thinned wafers will be the majority of wafers in the market by 2016, according to Yole D
The 2011 iNEMI Roadmap, published by the International Electronics Manufacturing Initiative (iNEMI), includes a new chapter on MEMS and sensors, and an expanded chapter on packaging to include substrates discussions.
IMT introduced its hermetic gold-to-gold (Au-Au) thermo compression bonding for wafer-level packaging (WLP). In development for nearly a year, this bond is being actively used in production.
Hesse & Knipps Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Wedge Bonding for RF and Microwave Devices" at the Advanced Technology Workshop and Tabletop Exhibition on RF and Microwave Packaging
The SMTA released its call for presenters for SMTA International (SMTAI) 2012, October 14-18 in Orlando, FL. The association, along with Chip Scale Review magazine, also announced the keynote for the International Wafer-level Packaging Conference (IWLPC), held November 5-8, San Jose, CA.
Haruo Matsuno, president and CEO of Advantest Corporation (TSE:6857, NYSE:ATE) shares the company's major goals, including expansion into new measurement applications, utilization of cloud computing, and more.
SPP Process Technology Systems (SPTS) received a follow-on purchase order from CEA-Leti for its Sigma fxP PVD system. The 300mm system will be used for advanced TSV development at Leti's new 300mm fab extension in Grenoble.
DelfMEMS and KFM Technology signed a common agreement to combine their expertise in RF micro-electro-mechanical systems (MEMS) and thin film packaging (TFP) technology. DelfMEMS will use the collaboration to provide packaged MEMS switches, fixed capacitors, and high-Q inductors on the same chip.
The migration to the 22nm node is about more than just scaling down, it's also about scaling up with thinner devices stacked into a single package -- and these require new manufacturing considerations with wafer bonding playing a central role, writes Bioh Kim from EV Group.
The collaboration will result in new applications in multi-chip modules in radar, communication, and electronic warfare systems. The new technology platform would enable miniaturization of wireless applications that are faster, lighter and can withstand higher temperatures.
Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.
X-FAB Silicon Foundries, a More-than-Moore semiconductor foundry, has used SFT's R3D (Resistive 3D) software for its 0.18
3M launched a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced electromagnetic interference (EMI).
2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device flow sensor that uses Ticona's Vectra E840i LDS laser-activated LCP for electronic circuits. The Vectra E840i forms circuits on 3D injection moldings produced with an LDS process.
The USPTO is looking to increase the diversity of honorees for its annual National Medal of Technology and Innovation (NMTI), honoring "this nation's creative geniuses."
Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity TSV etch tool for 200mm wafers.
EV Group (EVG) launched a new flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system throughput 26% to 18-20WPH with enhanced automation capabilities and low-temperature processing.
Ziptronix Inc. has licensed use of its oxide bonding technology for backside illumination imaging sensors patents to Sony Corporation. ZiBond technology enables more die per wafer, improving costs and quality for consumer, automotive, and other end-use applications.
SMArt systems Co-design (SMAC) launched today, bringing together a multinational, multidisciplinary partnership of leading companies on a three-year project for design and integration of smart systems.
Nanotechnology accelerator SVTC Technologies partnered with SUSS MicroTec on wafer-level packaging for MEMS, and 3D IC bonding technology development.
SEMATECH has created an online 3D Standards Dashboard, allowing 3D semiconductor and MEMS interconnect professionals to exchange standards activity information.
The MiQro Innovation Collaborative Centre (C2MI) will purchase three Akrion Systems GAMA automated wet process systems for the development and manufacture of advanced devices at C2MI's state-of-the-art MEMS facility in Quebec.
ALLVIA, through-silicon via (TSV) foundry, will present its latest analysis on silicon interposers and embedded capacitors during the IMAPS Conference on Device Packaging in Scottsdale, AZ, March 9. Dr. Sergey Savastiouk, CEO at ALLVIA, will present "Silicon Interposers Enable High Performance Capacitors."
Honeywell Microelectronics will use Tezzaron's 3D stacking on Honeywell
Singapore's A*STAR IME and 3D IC developer Tezzaron Semiconductor signed a research collaboration agreement to develop and exploit advanced through silicon interposer (TSI) technology.
inTEST will acquire the assets and certain liabilities of Thermonics from Test Enerprises. inTEST's Temptronic Corporation, of the Thermal Solutions Group, will integrate the company.
Singapore's Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR) launched the 11th cycle of its 15-year packaging R&D with 23 companies and 4 main projects.
FEI's new Vion plasma focused ion beam (PFIB) system based on inductively-coupled plasma (ICP) source technology using a xenon ion beam generates more than a micro-amp of beam current and can remove material faster than liquid metal ion sources, says product marketing manager Peter Carleson.
Wafer bonding is a complex process, used on 2" to 12" wafers for MEMS, image sensors, advanced packaging, LEDs, and other chips. Yole Développement published a technology study and market research report, "Permanent wafer bonding," to derive trends in the market and technology through 2016.
SEMICON West is a major conference for semiconductor manufacturing professionals. Semiconductor packaging has become a major focus in recent years, and this year, BEOL attendees have ATE Vision 2020, 3D IC standards meetings, a keynote, and multiple sessions dedicated to packaging technologies. Here's your guide to attending SEMICON West on a packaging track.
Cascade Microtech Inc. (NASDAQ: CSCD) released WinCalXE version 4.5 calibration software, with improved model and process quality. WinCalXE 4.5 contains the features of WinCalXE and SussCal, and operates with all manual and semi-automatic Cascade Microtech and former SUSS MicroTec probe stations.
The semiconductor industry is moving to 3D device structures, says Raj Jammy, SEMATECH, at The ConFab 2011, discussing TSV and system-in-package (SiP) opportunities and challenges. He also summarizes logic and memory roadmaps.
Tessera appointed Rick Neely, Jr. as EVP and CFO, responsible for the company
Global Semiconductor Alliance (GSA) recently named Jay Esfandyari, STMicroelectronics, as its MEMS Working Group chairman and Ken Potts, Cadence Design Systems, as the 3D IC Working Group chairman.
At SEMICON West, the working groups of the International Technology Roadmap for Semiconductors (ITRS) outlined 2012 updates to the roadmap. Check out the back-end process info here.
SemiProbe has developed proprietary technologies awarded a patent by the United States Patent and Trademark Office. The Probe System for Life allows the company and users to configure test and inspection systems that meet unique requirements usually served by custom products.
Wire bond inspection system maker Viscom introduced software tools for its very high resolution (VHR) camera module, which has the ability to provide exact measurements of balls and wedges. With this technology, 25-µm gold thin-wire wedge sizes can be measured with a standard deviation of 1 µm. In addition to inspecting qualitative characteristics of wire bonds, balls and wedges statistical evaluation and trend analysis of critical geometric dimensions can also be performed in the production process.
Innovative Micro Technology Inc. (IMT) added a new geometry point in its technology roadmap for through silicon vias (TSVs). Joining the copper-filled 15 by 60um depth TSV configuration that has been in production for nearly 2 years, 50 by 250um copper-filled TSV is planned for production at the beginning of 2011.
The MiQro Innovation Collaborative Centre (MICC; Bromont, QC, Canada) will receive a $14.1 million grant as part of the Canadian government's Centres of Excellence for Commercialization and Research (CECR) program. The grant will be used for 200mm MEMS and WLP research.
Dr. Nagesh Vodrahalli, vice president of technology and manufacturing at ALLVIA, will present a discussion on December 9 titled "Silicon Interposers with TSVs and Embedded Capacitors for Advanced Logic Applications."
MicroProbe Inc., supplier of wafer test technology to the global semiconductor industry, released the MEMS-based Mx-FinePitch (Mx-FP) probe card. The test card series targets ultra-fine-pitch testing of leading-edge SoC and logic devices found in applications like digital cameras, set-top boxes and digital TVs.
SUSS MicroTec and Fraunhofer for Surface Engineering and Thin Films IST launched SELECT, a technology for bond aligners and mask aligners that selectively activates parts of wafer surfaces through plasma.
The IDTechEx report, "Active RFID and Sensor Networks 2011-2021," comprehensively analyzes the technologies, players and markets with detailed 10-year forecasts, including tag numbers, unit prices and interrogator numbers and prices.
IDTechEx announced "RFID Forecasts, Players & Opportunities 2011-2021," which shows RFID as a $5.63 billion market in 2010.
The test community is embracing 3D ICs, as evidenced by presentations at the first IEEE International Workshop on Testing 3D stacked ICs that addressed a range of test challenges and solutions, reports Dr. Phil Garrou.
Alchimer's Electrografting (eG) technology has been validated by scientists at RTI International (RTI). The paper confirmed that electrografting is a proven technology for depositing "insulator, barrier and seedlayer into high aspect ratio TSVs for 3D integration applications."
ICAP Ocean Tomo, the intellectual property brokerage division of ICAP Plc (IAP.L), is offering for sale a patent portfolio relating to wafer-level semiconductor packaging owned by Hymite A/S. The 77 issued U.S. and foreign patents and patent applications cover new packaging technologies for optical communications components, LED emitters, and semiconductor fabrication.
Sensonor Technologies is developing SAR500, a novel high-precision, low-noise, high-stability, calibrated and compensated digital oscillatory gyroscope with SPI interface housed in a custom-made ceramic package.
At the ITRS 2012 update, back-end technologies session, at SEMICON West, roadmapping for More than Moore was addressed as both a philosophical and technical matter.
Tessera received notice from Powertech Technology Inc. (PTI) that it will terminate its license agreement with the semiconductor packaging and optics technology company. Tessera also completed phase 1 of its acquisition of camera module technologies from Flextronics.
Day 3 of the 15th IITC (International Interconnect Technology Conference) opened in San Jose, CA under clear sunny skies and a pleasant breeze. The herd thinned a bit, down to ~150 hearty souls from the original 230 the prior two days.
Tanaka Kikinzoku Kogyo KK will partner with SUSS MicroTec KK to develop pattern transfer and bonding technology using sub-micron gold particles. The companies hope to replace gold bumping, sputtering, and other technologies in MEMS, LED, and 3D IC packaging.
SemiProbe released a 300mm manual test probe configuration of its Probe System for Life, M-12. The M-12 is field-upgradable to 450mm.
Nanoplas introduced a fully automatic dry-processing batch system for high-volume 200mm production. The DSB 9000A is based on Nanoplas’s High Density Radical Flux (HDRF) technology.
Presentations at this year's International Symposium on Microelectronics (IMAPS, San Jose, Nov. 1-5) included discussion of TSV/3D integration challenges and temporary bonding steps qualified for different process flows, and a wafer-level packaging (WLP) encapsulation process and stacked multi-chip package (MCP) for a MEMS variable capacitor and control IC chip.
Last month's SEMICON Taiwan 3D Technology Forum shed some insight into what several foundries, assembly houses and customers are thinking about the timing for 3D interposers and full 3D IC, reports Phil Garrou.
Silex Microsystems brought its Met-Via full-wafer-thickness TSV technology into Chip Architectures by Joint Associated Labs for European Diagnostics, where it is being used to create cost-effective molded chip-level packaging with through metal vias.
SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.
Karen Lightman, the Managing Director of the MEMS Industry Group, blogs from the MEMS Executive Congress Europe, which was held March 20th, in Zurich, Switzerland.
Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.
Sensors in Design 2012 was opened March 28 at the San Jose McEnery Convention Center, in conjunction with Design West. Blogger Mike Fury reports.
The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.
JP Sercel Associates, Inc. (JPSA) expanded its Ultrafast processing capabilities, using Pico-second lasers with innovative laser beam delivery techniques.
The SIA shows 2011 worldwide semiconductor sales hit $299.5 billion, a 0.4% year-on-year increase and new record. Semico Research's forecast for 2012 shows a 10.11% growth in semiconductors revenues over 2011. Barclays Capital and Strategy Analytics also weigh in.
Tokyo Electron Ltd. (TEL) restructured its organization, with a new "Organic EL Division" established under GM Takeshi Okubo, as well as other new and consolidating subsidiaries in the semiconductor and liquid crystal production segments.
SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.
CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its CVD and gas control equipment assembly, and unifying its nano-materials lab.
MATHESON debuted the Lasso System, a customer-centric supply chain and inventory management system that can monitor the location and operating status of gas products and other assets in the REAL-Time Gas and Asset Management System.
Edwards Limited uncrated the STP-iXR1606 series magnetically-levitated turbo-molecular pumps (TMP) with fully integrated onboard controllers. Its new rotary design improves throughput by about 40% at high gas flow rates; nearly 90% percent in maximum gas flow.
The 2012 Symposia on VLSI Technology and Circuits, this June in Honolulu, HI, will foster joint interactions among device technologists and circuit/system designers with overlapping technical programs of both symposia, and joint focus sessions on important topics.
Researchers at Brown University are working on a new sensor, based on plasmaonic interferometers, that can check blood sugar levels by measuring glucose concentrations in saliva instead.
Researchers at INCDTIM in Romania will use NanoInk's NanoFabrication Systems Division's DPN 5000 system for supramolecular structure fabrication, molecular recognition and self-assembling process applications.
36% of semiconductor fabs are in high-risk zones, finds Semico, noting the industry disruptions caused by the Japan earthquake and tsunami and Thai flooding and the challenges these presented to chip makers in the regions.
Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufacturing fabs, pilot lines, and major R&D organizations.
For the first time, Apple Inc. has publicly published a list of over 150 companies that the electronics giant says represent 97% of its procurement expenditures for materials, manufacturing, and assembly of products worldwide.
Qualcomm MEMS Technologies Inc.'s mirasol display technology is used in 2 new e-readers for the Chinese market, the Hanvon C18 and the Bambook Sunflower from Shanda Networking.
Qualcomm MEMS Technologies Inc. and e-reader provider Koobe announced the next-generation Jin Yong Reader uses MEMS display technology. The original Jin Yong Reader had a black and white display.
While Apple's release of the iPhone 4S in Q4 2011 "unleashed tremendous pent-up demand" from consumers, Samsung used its broad range of smartphones to take the top spot, reports IHS.
Hexagon Metrology released the Optiv Classic 321GL tp benchtop vision-measuring metrology system for the North American market. It suits electronics and precision parts inspection, including micro-holes, fiber optics, filters, and more.
EPIC, the European Photonics Industry Consortium, announced at its annual general meeting that Carlos Lee has been appointed as director general, succeeding Thomas Pearsall, who has led the association since its founding in 2003.
Texas Instruments awarded 15 of its 12,000 suppliers with Supplier Excellence Awards for delivering outstanding service and support, based on cost, environmental responsibility, technology responsiveness, assurance of supply, and quality.
Blogger Michael A. Fury, Techcet Group, reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: nanowire FETs, laminate MEMS, nanoparticles in security printing, graphene nanoribbons, Ta2O5 memristors, redox flow batteries, graphene, and more.
Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- κ dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.
At International Solid-State Circuits Conference (ISSCC), imec and Holst Centre are presenting 14 papers on low-power design for wireless communication and wireless sensor networks, and organic electronics.
MIT researchers used gases to precisely control nanowires' width and composition as they grow, which could yield complex structures optimally designed for particular applications, like LED substrates or solar panels.
MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.
The 10th Annual MEMS Technology Symposium sponsored by MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 23 at the San Jose Holiday Inn. This year’s theme was “Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion.”
IEEE International Electron Devices Meeting (IEDM) is seeking original presentations on microelectronics research and development, with a focus on silicon and non-silicon device and process technology, circuit/device interactions; energy-harvesting, biomedical, and power electronics; magnetics and spintronics; and other topics.
SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30.
Libelium, a wireless sensor networks platform provider, has released a list of 54 sensor applications for a smarter world, covering the most disruptive sensor and “internet of things” applications.
SEMI presented US Congressman Dave Camp (R-MI) with its 2012 North American Government Leadership Award for his leadership and support of the US microelectronics and photovoltaic manufacturing value chain.
Contributing editor Steve Groothuis reviews a book titled “Energy Harvesting for Autonomous Systems (Smart Materials, Structures, and Systems).” The book highlights the progression from the basic principles behind energy harvesting to the comprehensive systems that control the sensing, actuation, and transmission of those devices.
MEI uses Vycom Flametec PVC-C for chemical rinse tanks and other wafer-contacting elements of its process tools, reducing tool-based contamination and protecting fab workers. Bill McGinty, MEI operations manager, discusses the benefits the new-generation plastic for semiconductor fab tools.
Media tablets, experiencing "remarkably rapid ascension," will become the 4th largest application for semiconductors by 2014, up from 35th in 2010, according to IHS.
Confovis will begin providing MountainsMap imaging and surface analysis software from Digital Surf with its ConfoCAM LED grid-confocal measuring systems for inspection and research.
Researchers from North Carolina State University have developed the first functional oxide thin films that can be used efficiently in electronics, opening the door to an array of new high-power devices and smart sensors.
The Global Semiconductor Alliance (GSA) has formed a new working group and identify various alternatives to encourage startups to innovate, woo investors, generate returns, and keep generating sustainable industry M&A.
After a strong surge in 2010 and solid growth in 2011, the market for optoelectronics, sensors/actuators, and discrete semiconductors (O-S-D) has lost most of its momentum amid a wobbling world economy, says IC Insights.
Communications applications are far and away the leading growth market for ICs over the next five years, and PCs and consumer applications have fallen far back in the pack.
In case anyone needed a reminder or a wake-up, new data from SEMI reiterates chip tool sales are slumping badly in the latter part of this year.
SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.
The Global Semiconductor Alliance (GSA) says it has formed a Technology Steering Committee to help address key business and technology areas of interest to its members, and "encourage the advancement and adoption of leading technology and practices."
In the seventh installment in a series called Process Watch, the authors discuss cycle time and the impact of inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.
With this week's IEEE International Electron Devices Meeting (IEDM 2012) now underway, here are four of the papers that were accepted late: on 90nm integrated silicon photonics, ZnNO for next-gen displays, and III-V TFETs for the 7nm node.
At the International Electron Devices Meeting in San Francisco, An Chen of GLOBALFOUNDRIES presented a survey of emerging nanoelectronic devices, which he divided into two categories: Charge-based and non-charge based.
Attendees at this year’s International Electron Devices Meeting (IEDM) were delighted and perhaps somewhat horrified when the plenary speaker popped some electronics gear in his mouth and proclaimed, “It tastes like chicken!”
Despite weak financial performances, sluggish global markets and strong regional competition, Japanese consumer electronics giants Sony and Toshiba are increasing their investments in new products to revitalize their businesses.
Semiconductor equipment demand is persistently sluggish as the industry takes a break from a "multiyear expansion period" to digest recent investments and wrestle with a broader economic slowdown, acknowledges SEMI in its updated year-end forecast. But make no mistake: leading-edge technology investments are still happening, and growth will return in the typical cyclical pattern.
KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers.
MIPI Alliance has formed an open "Birds of a Feather" (BoF) group that will investigate the requirements related to integrating sensors into mobile systems. The group will address challenges facing the sensor and wireless markets.
EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services.
A reference book from the Global Semiconductor Alliance (GSA) and IC Insights puts foundry information at the fingertips of those who need it the most.
Rolla, MO-based Brewer Science introduced a line of conductive CNT ink materials that are surfactant free, require no additional rinse steps, and are compatible with a broad range of printed electronic substrates.
Qualcomm Incorporated announced an expansion of its display technology agreement between its subsidiary Pixtronix, Inc. and Sharp Corporation to develop and commercialize high-quality color, low-power MEMS displays incorporating IGZO technology.
TechSearch International and the IEEE Women in Engineering Committee (WIE) are establishing a $2500 scholarship for women going into the field of engineering.
Industry watchers have been lowering their outlooks for 2013 over the past few weeks, but there's one set of opinions that still see optimism for an industry rebound in 2013 -- chip industry executives themselves.
Nikon and the Singapore A*STAR IME are jointly setting up a R&D lab to develop optical ArF lithography technology for semiconductor manufacturing to and below the 20nm device node.
SMIC is claiming a breakthrough in its development of backside-illuminated (BSI) CMOS image sensor (CIS) technology, with the first test chip demonstrating good image quality even in low-light conditions.
Ultratech has acquired the assets of Cambridge Nanotech, a developer and supplier of atomic-layer deposition (ALD) technology, which had quietly been put on the auction block after ceasing operations in November.
Canon U.S.A., Inc. recently launched the FPA-3030i5+ i-line stepper, designed for the manufacturing of LEDs, MEMS and power semiconductors.
Each December, IBM unveils the 5 in 5 -- five predictions about technology innovations that will change the way we work, live and play within the next five years.
Joining the growing chorus of industry watchers lowering their outlooks on the semiconductor sector, Gartner has reduced both its 2012 and 2013 forecasts for semiconductor sales but is remarkably more bullish on prospects in 2014.
Magnetic sensor semiconductors are robust but steady in application sectors like automotive, military/medical, and data processing. But the devices saw 50% growth in one segment last year: wireless/consumer, according to IHS.
Edwards (NASDAQ:EVAC) introduced the new iXH645H dry pump, optimized for metal-organic chemical vapor deposition, a key step in LED and compound semiconductor manufacturing.
JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.
Terry Brewer, one of the newest members of SEMI's North American advisory board, talks about semiconductor industry consolidation, as well as new technologies and materials in the industry. He shares how SEMI is reacting to this evolution.
Chip scaling will go on for the foreseeable future, enabling new product with more compute power, more memory, faster on-chip communication. That was one of the conclusions put forth by imec’s An Steegen, speaking on technology trends at The ConFab 2012.
The ConFab’s sessions opened with “The Economic Outlook for the Semiconductor Industry,” featuring Jackie Sturm of Intel, Dan Hutcheson of VLSIresearch, and Jim Feldhan of Semico.
The first MEMS Business Forum, sponsored by MEMS Journal and MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 24 at the Santa Clara Biltmore Hotel. Ten speakers presented on topics ranging from near- and mid-term business opportunities to roles of MEMS in broad visions for the future.
At imec's International Technology Forum, Denis Wirtz, co-director of the John Hopkins Institute for NanoBio Technology, described the latest efforts to fight cancer.
Intel's Jackie Sturm will bring to light some of the emerging, growth markets for semiconductors, and what they mean for chipmakers and the fab suppliers in the first session of The ConFab, “The Economic Outlook for the Semiconductor Industry.”
We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco.
In mid-2011, semiconductor manufacturing and assembly equipment supplier Applied Materials (NASDAQ:AMAT) acquired Varian Semiconductor Equipment Associates Inc. Now, the company is adding Varian’s former CEO Gary Dickerson as president.
MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.
As the dust settles after the launch of the iPhone 5, analysts tally which suppliers in the semiconductor ecosphere are most likely to gain the most.
Singapore's Institute of Microelectronics (IME) and MOSIS have signed a memorandum of understanding (MOU) to offer a multiple-project wafer service targeting silicon integrated photonics.
Propelled by strong sales to tablet and cellphone manufacturers, AKM led the semiconductor magnetic sensor market for the third year in a row in 2011. Of the top-10 magnetic sensor suppliers, Memsic saw the highest growth: 1340%.
Laser nanofabrication can now meet the needs of submicron and nanoscale feature size manufacturing, and can operate in air, vacuum, or liquid processes. Sister publication Industrial Laser Solutions recently published Laser nanofabrication: A route toward next-generation mass production.
Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.
At the recent imec International Technology Forum Press Gathering in Leuven, Belgium, imec CEO Luc Van den hove outlined uses in blood cell sorting, mobile apps for personalized medicine (such as brain monitoring of EEG activity), and advanced bio research.
Tokyo Electron (TEL) and imec announce the participation of TEL in imec’s bio-research program Human++. The agreement includes collaboration on bio-sensors and specialty imaging.
Imec, Holst Centre and Panasonic have developed a new prototype of a wireless EEG (electroencephalogram) headset.
Big data, 3D printing, activity streams, Internet TV, Near Field Communication (NFC) payment, cloud computing and media tablets are some of the fastest-moving technologies identified in Gartner Inc.'s 2012 Hype Cycle for Emerging Technologies.
Scientists at Fraunhofer Research Institution for Modular Solid State Technologies EMFT, together with Ketek GmbH, have developed a novel, silicon-based optical sensor component called a silicon photomultiplier (SiPM).
Rambus Inc. (NASDAQ:RMBS), a technology licensing company, will undergo a restructuring and related cost saving measures to cut its expenses by$30-35 million annually.
Fab equipment spending continues to soften in 2012, and hopes for a reprieve in 2013 are waning, warns one analyst.
Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy, the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.
Macroeconomic malaise continues to weigh down global semiconductor sales, although there's a possible ray of hope for a boost by year's end thanks to introduction of much-desired electronics devices (hello iPhone 5).
Tezzaron Semiconductor is taking over SVTC Technologies' wafer fab in Austin, TX, amid reports that the semiconductor/MEMS development organization is cutting back activities in Austin and in California.
At the upcoming International Electron Device Meeting, Macronix researchers will describe how they built flash memories that could heal themselves by means of tiny onboard heaters that provide thermal annealing just at the spots where it is needed.
imec announced that it has integrated an ultra-thin, flexible chip with bendable and stretchable interconnects into a package that adapts dynamically to curving and bending surfaces.
At IEDM, IBM researchers will demonstrate high-performance state-of-the-art CMOS circuits —including SRAM memory and ring oscillators—on a flexible plastic substrate.
The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.
Demand for chip tools fell again in August and is off by -30% from its peak in early summer, fulfilling fears that the second half of 2012 will be sluggish for chipmaking investments, according to the latest data from SEMI.
Over 45 percent market participants forecast a positive market trend with their company turnover growth outpacing that of the industry as a whole.
UC Santa Barbara researchers demonstrate first n-type field effect transistors on monolayer tungsten diselenide with record performance.
Market demand for new sensors will lead to a $6.4B market by 2018.
Multitest’s James Quinn will present during the 2013 SEMICON West exhibition and conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA.
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.31 billion in the first quarter of 2013.
Single-wafer cleaning solution is suitable for 3D-IC/TSV, advanced packaging, MEMS and compound semiconductor applications.
For the first time ever, no clear winner has emerged to claim top honors in the MEMS business for 2012, with Bosch of Germany and French-Italian STMicroelectronics ending up evenly splitting the title of No. 1 supplier for the year.
In an industry where finer features are driving market needs, current deposition processes are no longer sufficient to address challenges like interconnect dimensions below 16/14nm or high aspect ratio TSVs (>8) without experiencing defects, voids, or low reliability.
In the development of new MEMS products, the team is the most important factor.
Since the start of production in 1995, Bosch has manufactured well in excess of three billion MEMS sensors.
CEA-Leti will present recent advances and a preview of future developments in micro- and nanotechnologies, followed by workshops on key technical fields, during Leti Innovation Days, June 25-28, on the MINATEC campus.
Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function.
Fab equipment spending will grow two percent year-over-year (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.
A new report from IC Insights shows that we could be on the verge of entering into “the post-PC era.”
CEA-Leti will host a workshop for industrial companies to present its latest advances in MEMS and an overview of the success of its recent MEMS startup, Wavelens, during Transducers’ 2013 and Eurosensors XXVII in Barcelona, Spain.
ATIC and SRC today launched the ATIC-SRC Center of Excellence for Energy Efficient Electronic Systems (ACE4S), to be hosted jointly in Abu Dhabi by Khalifa University of Science, Technology and Research, and Masdar Institute of Science and Technology.
ST-Ericsson, a joint venture of STMicroelectronics and Ericsson, today announced the signature of a definitive agreement to sell the assets and intellectual property rights associated with its mobile connectivity Global Navigation Satellite System (GNSS) business to a semiconductor company.
OMRON Corporation today announced that they have finished development work on the world's first infrared sensor manufactured with wafer-level vacuum packaging technology to create a 16x16 element MEMS non-contact infrared thermal sensor capable of highly precise 90-degree area detection.
The winning teams successfully conceptualized, developed and built demonstrable prototypes of entirely new applications using ST's iNEMO MEMS sensor-fusion modules.
LAST POWER, the European Union-sponsored program aimed at developing a cost-effective and reliable technology for power electronics, today announced its three-year program achievements.
New research led by University of Cincinnati physics professors Howard Jackson and Leigh Smith could contribute to better ways of harnessing solar energy, more effective air quality sensors or even stronger security measures against biological weapons such as anthrax
The critical processes and technologies necessary to continue Moore’s Law are currently more uncertain than ever before in the history of advanced semiconductor manufacturing.
MEMS Industry Group (MIG), a global industry organization with more than 140 member-companies and partners, will welcome micro-electromechanical systems (MEMS), medical industry and academic experts to Cambridge, Mass. for Member-to-Member (M2M) Forum 2013, a conference on the MEMS connection to advancements in healthcare, medical and biomedical applications.
AG Semiconductor Services today announced that Michael (Mike) Mardesich has joined the company in the role of senior director of sales.
MEMSIC, Inc., a MEMS solution provider, today announced that it has agreed to be acquired by IDG-Accel China Capital II, L.P. and its affiliates MZ Investment Holdings Limited and MZ Investment Holdings Merger Sub Limited, for $4.225 per share in cash.
SAMCO Inc, head quartered in Kyoto, Japan, has expanded its OPTO Films Research Laboratory in California’s Silicon Valley in order to strengthen its research structure and after-sale process support.
MEMS pressure sensors will achieve accelerated growth this year and become the leading type of MEMS device, driven by increasing use in automotive and the fast-growing handset space, according to insights from the IHS iSuppli MEMS & Sensors Service from information and analytics provider IHS.
Recent progress in the engineering of plasmonic structures has enabled new kinds of nanometer-scale optoelectronic devices as well as high-resolution optical sensing.
STMicroelectronics has revealed that its Orly system-on-chip (SoC) is powering a new generation of advanced set-top boxes announced on April 17 from NTT Plala Inc., an Internet / IPTV service provider in Japan. This STB has been developed by Sumitomo Electric Networks, Inc., a Japanese equipment producer for home entertainment and broadband service providers, with operations around the world.
Element Six last week announced, in collaboration with Delft University of Technology, the entanglement of electron spin qubits (quantum bits) in two synthetic diamonds separated in space.
The 59th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking original work in microelectronics research and development. The paper submission deadline is Monday, June 24, 2013.
Intel announced that the board of directors has unanimously elected Brian Krzanich as its next chief executive officer (CEO), succeeding Paul Otellini. The board also named Renée James, 48, to be president of Intel.
Semiconductor Research Corporation (SRC) recently joined the National Science Foundation (NSF) as a partner in an ongoing NSF project to further develop compact models of emerging nanoelectronic devices such as might be used in next-generation consumer electronics.
Scientists from IBM today unveiled the world's smallest movie, made with one of the tiniest elements in the universe: atoms. Named "A Boy and His Atom," the Guinness World Records -verified movie used thousands of precisely placed atoms to create nearly 250 frames of stop-motion action.
Once again demonstrating Apple’s power to ordain winners in the electronics supply chain, the top suppliers last year of microelectromechanical systems microphones were those that provided devices for iPhones and iPads.
IMT, the largest pure-play MEMS foundry in the US, announced today the appointment of MEMS industry pioneer and technology visionary Dr. Kurt Petersen to the IMT board of directors.
The total market for open short-range wireless (SRW) technology based ICs, such as Bluetooth, Wi-Fi, ZigBee, NFC, and GPS, is expected to reach almost 5 billion units in 2013 and grow to nearly 8 billion by 2018, according to ABI Research. This includes standalone wireless connectivity ICs, wireless connectivity combo ICs, and also platforms with integrated wireless connectivity.
In the world of optical defect inspection, finding on defect on a 300mm wafer can be like trying to find a single coin on the island of Taiwan. Now imagine being able to find that coin in just an hour, along with any other coins that look exactly like it.
Worldwide silicon wafer area shipments decreased during the first quarter 2013 when compared to fourth quarter 2012 area shipments, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.
SRC and NIST will provide a combined $5 million in annual funding for three multi-university research centers tasked with demonstrating non-conventional, low-energy technologies that outperform current technologies on critical applications in 10 years and beyond.
Photonics societies across the United States today announced the launch of the National Photonics Initiative.
IDC expects the semiconductor market to return to growth in 2013 with revenues forecast to increase by 3.5 percent this year.
China rose to the top of the PC market for the first time ever on an annual basis last year, relegating the United States to second place with a lead of more than 3 million units, according to an IHS iSuppli PC Dynamics Market Brief from information and analytics provider IHS.
An estimated 405 million handsets, including 197 million smartphones, were shipped in the first quarter of 2013, according to market intelligence firm ABI Research.
Dongbu HiTek today announced that it has begun volume production of Ambient Light Proximity Sensor (ALPS) chips for Clairpixel Co., Ltd., a Korean company specializing in single-chip image and motion sensor solutions for mobile, automotive, medical and security applications.
About 1,000 of the world’s leading experts in the field of microelectronics will gather here for the 2013 Symposia on VLSI Technology and Circuits, from June 11-13, 2013 (Technology) and from June 12-14, 2013 (Circuits).
The Agency for Science, Technology and Research (A*STAR) and Veredus Laboratories, a supplier of innovative molecular diagnostic tools, announced the launch of VereTropTM, the first biochip in the molecular diagnostics market that can identify 13 different major tropical diseases from a single blood sample.
When a team of University of Illinois engineers set out to grow nanowires of a compound semiconductor on top of a sheet of graphene, they did not expect to discover a new paradigm of epitaxy.
In another sign of the worldwide shift in preferred personal devices, PC shipments posted the steepest decline ever in a single quarter, according to the International Data Corporation Worldwide Quarterly PC Tracker (IDC).
Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia.
It sounds futuristic, but today Carnegie Mellon University researchers are developing edible electronic devices that can be implanted in the body to improve patient care.
Despite stronger-than-expected growth during the fourth quarter, 2012 was still a miserable year for the semiconductor market and suppliers, with only eight out of the Top 25 chipmakers managing to eke out revenue growth—but nine suffering double-digit declines.
Veredus Laboratories today announced that the current version of VereFlu detects the current subtype of H7N9 (Avian Flu) that is responsible for the flu outbreak in China. H7N9 is the latest mutation to cause concern and increased surveillance in the region.
From smart wristwatches that record heart rates, to intelligent armbands that track physical activities, wearable electronics and fitness monitoring devices are attracting increased attention from health-conscious consumers, causing shipments of MEMS sensors used in these products to more than quadruple in just five years.
memsstar Limited, a provider of etch and deposition equipment and technology solutions to manufacturers of semiconductors and MEMS, today announced the appointment of Tony McKie as its new chief executive officer (CEO). McKie is tasked with capitalising on the company's experience and reputation in the semiconductor and MEMS markets to drive its growth.
The global semiconductor materials market decreased 2 percent in 2012 compared to 2011 while worldwide semiconductor revenues declined 3 percent. Revenues of $47.11 mark the first decline in the semiconductor materials market in three years.
Controlling the shapes of nanometer-sized catalytic and electrocatalytic particles made from noble metals such as platinum and palladium may be more complicated than previously thought.
Original equipment manufacturers (OEMs) are increasingly turning to electronics manufacturing service (EMS) providers to better handle the escalating volumes of electronic content in the medical industry.
MEMS Industry Group (MIG) today announced its conference and exposition line-up for the 2013 Sensors Expo and Conference.
After a functional A-sample prototype is built, it doesn't take long for a project to gain traction that has market pull. This is usually the point that a project becomes highly visible within a company and it enters the Technology Development Process (TDP).
Combo MEMS sensors for automotive applications are off to another exhilarating ride this year as revenue continues to climb, spurred by rapidly accelerating use in car safety systems.
Researchers from IMDEA-Nanociencia Institute and from Autonoma and Complutense Universities of Madrid have managed to give graphene magnetic properties.
The market for Bluetooth semiconductors is expected to boom by nearly 100 percent from 2011 to 2017, with the majority of the growth driven by demand for wireless combination integrated circuits (ICs) and mobile system-on-chip (MSoC) devices with integrated wireless connectivity that are used in mobile devices like smartphones and media tablets.
North America-based manufacturers of semiconductor equipment posted $1.14 billion in orders worldwide in March 2013 (three-month average basis) and a book-to-bill ratio of 1.14, according to the March Book-to-Bill Report published today by SEMI.
The fast growing market for sensors for smart phones is re-shuffling the ranks of MEMS suppliers. For the first time, suppliers of inertial sensors have surpassed the major makers of micro mirrors and inkjet heads that have long dominated the industry on Yole Développement’s annual ranking of the Top 30 MEMS companies.
Increasing HD video content, social networking, shared data via the cloud, low power consumption, and “instant on” features continue to drive growth of consumer, communication, and computing devices that use NAND flash memory.
Researchers at the Georgia Institute of Technology are developing a novel technology that would facilitate close monitoring of structures for strain, stress and early formation of cracks.
The gyroscope market is driven by mobile applications, where until recently only two players, STMicroelectronics (ST) and InvenSense, were competing.
Though they be but little, they are fierce. The most powerful batteries on the planet are only a few millimeters in size, yet they pack such a punch that a driver could use a cellphone powered by these batteries to jump-start a dead car battery – and then recharge the phone in the blink of an eye.
Researchers are developing a new type of semiconductor technology for future computers and electronics based on "two-dimensional nanocrystals" layered in sheets less than a nanometer thick that could replace today's transistors.
Chemists at Ohio State University have developed the technology for making a one-atom-thick sheet of germanium, and found that it conducts electrons more than ten times faster than silicon and five times faster than conventional germanium.
Proposed increases in funds for scientific R&D and a greater emphasis on STEM education in the 2014 budget proposal announced by the White House this week reflect the President’s commitment to science and engineering, SPIE leaders said.
Once a white-hot PC product that sold in the tens of millions of units annually, netbook computers are now marking their final days, with the rise of tablets causing their shipments to wind down to virtually zero after next year, according to an IHS iSuppli Compute Electronics Market Tracker Report from information and analytics provider IHS.
Over the last few years, glass has gained considerable interest from the semiconductor industry due to its very attractive electrical, physical and chemical properties, as well as its prospects for a relevant and cost-efficient solution. The application scope of glass substrates in the semiconductor field is broad and highly diversified.
TESEC Corporation today announced the development and sales of the ULTRA MEMS Handler, targeting Inertial (Accelerometer, Gyroscope and Magnetometer) MEMS devices.
Only light, aerial oxygen, and a catalyst are needed to remove pollutants from water. Ruhr-Universitat Bochum researchers led by Professor Radim Beránek are collaborating with colleagues from seven different countries in order to develop a photocatalyst that is efficient enough to be profitable.
The ability to improve silicon transistors is reaching its fundamental limit, so researchers are searching for new ways to keep making electronic devices faster and more powerful. University of Nebraska-Lincoln physicists and colleagues have taken a major step toward breaking that silicon barrier.
The quantum dot recently emerged as a next-generation display material. Quantum dots, whose diameter is just a few nanometers, are semiconductor crystals.
Nanobiotechnology, an integration of physical sciences, molecular engineering, biology, chemistry and biotechnology holds considerable promise of advances in pharmaceuticals and healthcare.
Sensors and optoelectronics will continue to grow faster than the mainstream semiconductor market. We currently expect 9%-13% growth in these sectors in 2013, accompanied by rapid changes in technology and market structures.
Recent advances in diamond applications (diamond-on-silicon, MEMS, optical) suggest that its utilization into a broader scope of commercial products is not far away.
While the consumer market continues to evolve and the demand for better, faster, smaller increases even further, MEMS should continue to grow and find success as they are designed into more and more devices.
It is becoming increasingly clear that new MEMS and 3D high-volume, low-cost manufacturing technologies will accelerate a radical change to society’s cyber skyline.
In 2013, it is anticipated that M&A transaction activities will increase and result in further consolidation of the semiconductor supply chain.
2013 will mark the beginning of the next cyclical upturn—one in which the IC market CAGR will more than triple to 7.4% in the 2012-2017 time period.
The global market for MEMS microphones has reached approximately $422 million in 2012. The market is predicted to increase to $865 million in 2017.
Microelectromechanical (MEMS) devices are shaping the competitive landscape in the global medical device industry.
Tablet and cellphone processors, NAND flash, and telecom-specific ICs to enjoy best growth.
Markets for solid state thin-film batteries at $65.9 million in 2012 are anticipated to reach $5.95 billion by 2019, according to a new report released by ReportsnReports.com.
Roland Thomas, subcommittee chair of ISSCC, writes of the substantial growth and future in key areas of technology.
Tronics kicks-off the industrialization of a unique piezoresistive nanowire MEMS technology that can take 9 DOF motion sensors to a new level of competitiveness.
In the second article of the MEMS new product development blog, the importance of the first prototype will be discussed.
STMicroelectronics and the University of Amsterdam Faculty of Science have announced that a sophisticated bird-tracking system developed by the university is using advanced MEMS sensing technology from ST.
A strong uptake in consumer and mobile devices will power the market for microelectromechanical systems (MEMS) to solid revenue growth in 2013, with breakthroughs in new sensor applications also expected this year, according to insights from the IHS iSuppli MEMS service at information and analytics provider IHS.
Agilent Technologies Inc. announced yesterday the intent to donate a $90 million in software to Georgia Institute of Technology, the largest in-kind software donation ever in its longstanding relationship with the university.
Facing a relentless onslaught from tablets, smartphones and solid state drives (SSD), global hard disk drive (HDD) market revenue in 2013 will decline by about 12 percent this year, according to IHS.
Five University of California, Riverside professors will receive a total of $5 million as part of a $35 million research center aimed at developing materials and structures.
A*STAR’s Institute of Microelectronics signed an agreement to collaborate with Petroleum Geo-Services to develop a high performance MEMS-based sensor for deep sea seismic oil and gas exploration.
Joint effort will drive innovative engine-train and smart-power products
A*STAR’s Institute of Microelectronics, or IME, and Stanford University will collaborate to advance innovations in nano-electromechanical systems (NEMS) switch technology for ultra-low power digital systems.
GCAP targets a range of industrial applications as well as research labs, advanced gas analysis and biomedical screening.
SEMI, in collaboration with strategic investing groups throughout the global semiconductor industry, has announced the Silicon Innovation Forum, or SIF, to bridge funding gaps for new and early-stage companies with valuable semiconductor manufacturing and technology solutions.
Smartphones and media tablets continue to the prime movers of technology industries, with the two mobile platforms spurring a double-digit increase in the market for microelectromechanical system (MEMS) motion sensors this year.
The rise in mobile computing, changes to the fabless-foundry model, uncertainties in technical innovation, and global macroeconomic trends are becoming the dominant forces in 2013 and beyond, according to industry leaders speaking at this week's SEMI Industry Strategy Symposium (ISS).
Components are prominent this year, on the main stage, and the CES exhibit floors.Todd Traylor of Smith & Associates reports.
In David DiPaola's blog, he discuss the critical factors needed for success in the early stage of new MEMS product development.
The International Data Corporation is forecasting that semiconductor revenues worldwide will improve by 4.9% to $319 billion in 2013 and log a compound annual growth rate (CAGR) of 4.1% from 2011-2016.
Global semiconductor sales in November 2012 were the largest monthly tally of the entire year,according to the SIA -- and growth was especially sparkling in the North America region.
Based on current indications, capital spending would seem to be flat in 2013. However, Semico predicts healthy revenue growth this year, which may encourage more spending, particularly in the second half of the year. This may bring total capex for 2013 into the positive range.
memsstar Limited announced two etch system order wins from new MEMS customers in Asia
SiTime Corp. introduced the SiT8920 MEMS oscillator for industrial and high reliability applications.
MEMS Industry Group (MIG) will host its second annual MEMS Executive Congress® Europe, March 12, 2013 in Amsterdam.
Given the ascension of smartphones, it's no surprise that Samsung and Apple remain far and away the biggest end-users of semiconductors, and are widening their lead on the rest of the field, according to the latest Gartner rankings.
DARPA researchers have recently demonstrated the most complex 2-D optical phased array ever. The array, which has dimensions of only 576µm x 576µm is composed of 4,096 (64 x 64) nanoantennas integrated onto a silicon chip.
Researchers at North Carolina State University have developed a new type of nanoscale structure that resembles a “nano-shish-kebab,” consisting of multiple two-dimensional nanosheets that appear to be impaled upon a one-dimensional nanowire.
ISSCC, the International Solid-State Circuits Conference, is being held on February 17-21, 2013, at the San Francisco Marriott Marquis Hotel. This year, in honor of the conference’s 60th anniversary, we have assembled highlights of the topics and trends that are being discussed.
DRS Technologies, Inc., a Finmeccanica Company, and Cypress Semiconductor Corp. (NASDAQ: CY) today announced that DRS will transfer its Microbolometer technology for uncooled infrared detectors to Cypress for high-volume manufacturing.
In its new report MEMS Front-End Manufacturing Trends, Yole Développement goes further in the equipment and materials market forecasts and in the manufacturing trends for MEMS. The report gives detailed analyses about MEMS device technology process flow, manufacturing trends and manufacturing cost breakdown.
We are entering the era of cognitive systems, where electronic devices will mimic the human senses—in their own way, to see, smell, touch, taste and hear. IBM assembled this infographic to illustrate what they call the “5 in 5,” five innovations that will change our lives within five years.
China looks a good bet to be the engine of growth again in 2013, while U.S. will see improving PC market and more software growth.
Improvement in nanotechnology enables 'liquid biopsies' for metastatic melanoma.
JEDEC Solid State Technology Association, a developer of standards for the microelectronics industry, announced today that its Board of Directors has appointed two new members: Mr. Jong H. Oh, Vice President, SK hynix and Mr. Hung Vuong, Qualcomm.
Toshiba Corporation announced the development of a CMOS image sensor with a small area and low power pixel readout circuits. A sample sensor embedded with the readout circuits shows double the performance of a conventional one. Toshiba presented this development at ISSCC 2013 in San Francisco, CA on Feb. 20.
Researchers at the National Institute of Standards and Technology (NIST) have demonstrated a solid-state refrigerator that uses quantum physics in micro- and nanostructures to cool a much larger object to extremely low temperatures.
Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase.
PNI Sensor Corporation and EM Microelectronic -Marin SA announce the introduction of the Sentral sensor fusion hub: a new, highly effective way to integrate complex motion sensors on mobile devices.
Toshiba Corporation today announced that it has developed an intelligent vital signs sensor module: Smart healthcare Intelligent Monitor Engine and Ecosystem with Silmee, that simultaneously senses information on key vital signs, Electric Cardio Gram, pulse, body temperature and movements, and that can deliver the data to smartphones and tablet PCs with wireless technology.
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is developing equipment and process technology to enable covalent bonds at room temperature.
InvenSense, Inc. and Avnet Memec this week announced the formation of a pan-European distribution agreement. With the new partnership, Avnet Memec is chartered with sales and support for InvenSense’s MotionTracking devices throughout Europe and Israel.
O-S-D’s marketshare of total semiconductor sales in 2012 was highest since 1991. Seven O-S-D product categories and device groups reached record-high sales in 2012 compared to 14 new records being set in 2011, according to data shown in the 2013 edition of IC Insights’ O-S-D Report.
Solid State Technology is proud to announce that Yoon-Woo Lee will be speaking at The ConFab 2013. The event will be held June 23-26, 2013 at The Encore at The Wynn in Las Vegas. Lee is the Executive Advisor of Samsung Electronics.
System Plus Consulting analyzed a BAW MEMS Filter manufactured by Avago Technologies, assessing its manufacturing process, costing results and breakdown. With more than 1 billion units produced per year and a market share of 65%, System Plus Consulting found that Avago Technologies clearly dominates the BAW filter market. Avago BAW filters are all-silicon MEMS devices manufactured with Avago's FBAR and Microcap technologies.
ALTIS Semiconductor, a global specialty foundry based in France, announced today the finalization of a foundry agreement with IBM Microelectronics. Under the terms of this agreement, ALTIS will be the foundry partner for the IBM 180nm SOI technology. ALTIS will deliver high volume products starting Q2 2013 and will secure capacity increase for 2014 and beyond to address the IBM forecasted demand.
Shipments of MEMS microphones in 2012 amounted to 2.05 billion units, up 57% from 1.30 billion in 2011, according to IHS iSuppli. Shipments will climb by another 30% to 2.66 billion units in 2013, to be followed by at least three more years of notable double-digit-rate increases.
Brooks Instrument, a provider of flow measurement and control instrumentation to the microelectronics industry, will launch the GF135 pressure transient insensitive (PTI) mass flow controller at SEMICON China, March 19-21 at Shanghai New International Expo Center.
New automotive technologies that go beyond touchscreens, satellite radio, and voice-activated GPS commands are being tested and improved, and will soon begin to appear in many more new car models, resulting in solid growth for the automotive IC market through 2016.
Yole Développement’s research has credited STMicroelectronics for capitalizing on the booming demand for MEMS in mobile devices by shipping 58% more MEMS units in 2012, to become the first company to reach $1 billion in MEMS sales.
New spin technique moves researchers at the University of Pittsburgh and Delft University of Technology closer to creating the first viable high-speed quantum computer.
Integrated Device Technology, Inc. yesterday announced the industry’s first differential MEMS oscillators with 100 femtosecond (fs) typical phase jitter performance and integrated frequency margining capability.
Roger Grace to present MEMS Commercialization Report Card at annual international technical forum.
In a new discovery that represents a major step in solving a critical design challenge, Arizona State University Professor Hao Yan has led a research team to produce a wide variety of 2-D and 3-D structures that push the boundaries of the burgeoning field of DNA nanotechnology.
Volunteers sponsored by SPIE, the international society for optics and photonics, were in Washington, D.C., last week to thank Congressional representatives for recent support for photonics R&D and to urge future support for in several key areas vital to economic growth and scientific progress.
The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR) in Singapore, has launched the Copper (Cu) Wire Bonding Consortium II. The consortium which rides on the successes of Phase I launched in 2010 aims to improve the reliability of semiconductor devices by tackling copper wire bonding issues related to corrosion and stress.
North America-based manufacturers of semiconductor equipment posted $1.07 billion in orders worldwide in February 2013 (three-month average basis) and a book-to-bill ratio of 1.10, according to the February Book-to-Bill Report published today by SEMI. A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month.
In the third article of the MEMS new product development blog, critical design and process steps that lead to successful prototypes will be discussed.
Next generation memories are the emerging non-volatile memory technologies, which are expected to replace existing memories. However, not all existing memories will be replaced.
STMicroelectronics yesterday filed a complaint with the United States International Trade Commission (ITC). The complaint requests that the ITC initiate an investigation into the alleged infringement of five ST patents covering all of InvenSense, Inc.'s MEMS device offerings, as well as products from two of InvenSense's customers.
The futuristic “Internet of Things” will more than double to 2.1 billion units, leading to a dramatic growth of domestic companies, says Lux Research.
STMicroelectronics announced today that Didier Lamouche, Chief Operating Officer, whose operational role was suspended when he took the assignment as President and Chief Executive Officer at ST-Ericsson in December 2011, has decided to resign from the company effective March 31, 2013 to pursue other opportunities.
According to the latest analysis by Semicast Research, Renesas Electronics was again the leading vendor of semiconductors to the OE automotive sector in 2012, ahead of Infineon Technologies. STMicroelectronics retained its position as third largest supplier, with Freescale fourth and NXP fifth. Semicast calculates that revenues for OE automotive semiconductors grew by 12% to USD $25.5 billion in 2012, while the total semiconductor industry is judged to have declined by almost three percent to USD $292 billion.
Berkeley Lab researchers recreate elusive phenomenon with artificial nuclei; highly relevant for future nanoscle devices where electrical charge is concentrated into very small areas
Lattice Semiconductor Corporation today announced the iCE40 LP384 FPGA, the smallest member of its iCE40 family of ultra-low density FPGAs. Enabling designers to rapidly add new features and differentiate cost-sensitive, space-constrained, low-power products, the new small footprint FPGA is ideal for applications such as portable medical monitors, smartphones, digital cameras, eReaders, and compact embedded systems.
Global electronic components distributor Digi-Key Corporation today announced the signing of a global distribution agreement with MEMSIC, a provider of MEMS sensor components, sophisticated inertial systems, and leading-edge wireless sensor networks.
Smartphones are set to become even more flexible and more satisfying to use, thanks to a unique sensor system developed by STMicroelectronics. Combining three optical elements in a single compact package, the VL6180 is the first member of ST’s FlightSense family and uses a new optical-sensing technology that reduces the incidence of dropped calls and enables innovative new user interactions with smartphones.
How the semiconductor industry can create the next generations of nanoscale computing technology will be one of the themes of the 2013 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics, to be held at the National Institute of Standards and Technology (NIST), March 25-28, 2013, at its campus in Gaithersburg, Md.
Latest offerings enhance power efficiency and miniaturization for smart meters, industrial machinery and medical devices.
Shipments this year are expected to double to 162 million units, as presented in the attached figure, primarily due to Samsung’s usage of pressure sensors in the Galaxy S4 and other smartphone models.
Dynamic changes to R&D processes, tools, technical challenges, and funding/business models will be highlighted at SEMICON West 2013, along with product displays of the latest semiconductor manufacturing technology, components and subsystems.
STMicroelectronics and CMP today announced that ST's THELMA MEMS manufacturing process, the process ST uses for its industry-leading accelerometers and gyroscopes, which have shipped in billions of units, is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP.
Silex Microsystems and BroadPak today announced the immediate availability of their jointly developed silicon interposer solution in high-volume manufacturing.
STMicroelectronics has introduced the world's smallest TVS diode for protecting sensitive electronics in consumer products and handhelds.
The fourth article of the MEMS new product development blog is Part 2 of the critical design and process steps that lead to successful prototypes. In the last article, the discussion focused on definition of the customer specification, product research, a solid model and engineering analysis to validate the design direction. The continuation of this article reviews tolerance stacks, DFMEA, manufacturing assessment and process mapping.
AIXTRON SE today announced that it is participating as a key partner in the recently announced European Union (EU) Future Emerging Technology (FET) flagship project “Graphene.”
University of Manchester graphene researchers have been awarded a £3.5 million (or approximately US$5 million) funding boost that could bring desalination plants, safer food packaging and enhanced disease detection closer to reality.
It’s no secret that Samsung is up against Apple in many ways, in products, sales and innovation. However, even in the face of Apple’s patent infringement lawsuits, Samsung is still climbing the charts.
STMicroelectronics has begun working with research partners to develop a pilot line for next-generation MEMS devices augmented with advanced technologies such as piezoelectric or magnetic materials and 3D packaging. The project was launched by the European Nanoelectronics Initiative Advisory Council (ENIAC) Joint Undertaking (JU), a public-private partnership in nanoelectronics.
A joint industry/academia consortium, supported by the European Union's Seventh Framework Programme, has reported the successful conclusion of a three-year project and the release of its design-synthesis tool flow and related litho-friendly cell libraries and evaluation metrics.
American Graphite Technologies Inc. announced today the successful production of test samples of a graphene paper product by its development and manufacturing partner, CTI Nanotechnologies LLC.
Ericsson and STMicroelectronics today announced an agreement on the way forward for the joint venture ST-Ericsson. As communicated by the parent companies in December 2012, both have been working together toward a strategic solution for the JV. After months of intensive joint work, the parent companies have selected the strategic option which maximizes their respective future prospects and growth plans.
Brewer Science, a developer of lithography enhancement materials for semiconductor manufacturing, announces the installation of a scale-up reactor to increase production of its CNTRENE C100 family of electronics-grade CNT materials by tenfold.
Researchers of Karlsruhe Institute of Technology and French colleagues from Grenoble and Strasbourg have now found a way to combine both carbon nanotubes and magnetic molecules on the atomic level and to build a quantum mechanical system with novel properties.
Cisco Systems is preparing for a major shift in the industry, as the Internet of Things starts to become a reality. At an annual press event in San Jose, California this week, Cisco officials claimed that the much-anticipated IoT industry could be a $14 trillion opportunity, and they are ready to embrace the change.
Imec announced today the launch of its fully integrated silicon photonics platform through a cost-sharing Multi-Project Wafer (MPW) service via ePIXfab.
Nanoplas, a global supplier of plasma processing equipment to the semiconductor industry, today announced a new dry-etch process offering virtually unlimited etch selectivity for removing dielectric films on microprocessors and memories at high throughput.
The newest AVIA micromachining laser from Coherent, Inc. (Santa Clara, CA) delivers the highest power commercially available at its wavelength and repetition rate.
Pixelligent Technologies, a manufacturer of nanocrystal additives for the electronics and semiconductor markets, last week announced the launch of its PixClear Zirconia nanocrystals. When incorporated into existing products, the nanoadditives can dramatically increase light output and readability of modern touch screens and displays.
Many users of microwave ovens have had the frightening experience of leaving a fork, crumpled piece of aluminum foil or some other pointy metal item inside the cooking chamber. The sharp metal object acts as an antenna for the oven’s microwave radiation, causing strong local heating or sparking.
Semiconductor test equipment supplier Advantest Corporation entered the high-growth market for testing MEMS-based sensors by installing V93000 Smart Scale systems at several of Freescale Semiconductor's facilities around the world.
China-based manufacturers of cellphones and tablets in 2012 more than doubled their share of purchases of MEMS motion sensors, reflecting the rising prominence of the companies in the global market, according to an IHS iSuppli MEMS Topical Report from information and analytics provider IHS.
SiTime Corporation, one of the fastest growing semiconductor companies, today introduced the SiT15xx family of 32 kHz MEMS oscillators that are intended to replace legacy quartz crystal resonators.
Holst Centre and imec have developed an integrated piezoelectric energy interface IC with zero bias rectifier circuit and energy-aware supply regulator.
Despite facing five consecutive quarters of decline and a slowdown in consumption in smartphones and tablets, the global market for NAND flash memory pulled off a surprise growth spurt during the last three months of 2012, causing sales to reach a record high.
MEMS pressure sensor is one of the very first MEMS components appearing in the microsystem world. The technologies are quite mature and the market is big and expected to grow from $1.9B in 2012 to $3B in 2018.
A new undergraduate program approved this week at the University of Central Florida (UCF) will help the U.S. stay competitive in global technology as well as broaden the path for students seeking rewarding careers in the important field of optics and photonics, say leaders of SPIE, the international society for optics and photonics.
Analog Devices ADMP801 MEMS microphone delivers 27 dBA EIN, consumes only 17 µA at 1 V supply, and is available in a 7.3 mm³ package.
India registered 221.6 million mobile handset shipments during 2012, according to CMR’s India Mobile Handsets Market Review, CY 2012, March 2013 release. During the same period, 15.2 million smartphones were shipped in the country.
Zachary Olmsted, a junior Nanoscale Engineering major at SUNY’s College of Nanoscale Science and Engineering (CNSE), has been chosen to receive the prestigious Barry M. Goldwater Scholarship, the second consecutive year that a CNSE student has been honored with the nation’s premier undergraduate award designed to foster and encourage outstanding students to pursue careers in the fields of mathematics, the natural sciences, and engineering.
The high-value microelectromechanical system (MEMS) market experienced soft growth last year, mainly due to weakness in the mainstay medical electronics and industrial sectors, according to an IHS iSuppli MEMS High-Value MEMS Market Tracker Report from information and analytics provider IHS.
Nanosys, enabling a new generation of high color fidelity, energy-efficient displays with its quantum-dot technology, today announced that it has expanded into a new, high-capacity production facility in Milpitas, California.
A year ago, the microtechnology, nanotechnology, and advanced materials industry looked out on the year 2012 with quite positive expectations. As it turned out, the unstable economic situation has left its mark on these industries, too. For 2013, at least, the companies expect a slight upwards trend.
Imagine if you could drink a glass of water just by inserting a solid wire into it and sucking on it as though it were a soda straw. It turns out that if you were tiny enough, that method would work just fine — and wouldn’t even require the suction to start.
Techcet's Michael A. Fury continues his observations from this year's IEEE International Interconnect Technology Conference (IITC) meeting near San Francisco. From Day 2: Back-end memory, MEMS, reliability/characterization, and posters spanning the breadth of interconnect topics, especially 3D TSV and MEMS integration.
Techcet's Michael A. Fury continues his observations from this year's IEEE International Interconnect Technology Conference (IITC) meeting near San Francisco. From Day 1: Themes including variations on 3D and through-silicon vias (TSV), and barrier films for reducing copper electromigration.
Analysts speaking at a breakfast seminar near Boston agree that current chip sales estimates are "conservative" -- even after one of them breaks out new optimistic forecasts -- and strong demand is pulling the industry back into seasonal trends and more reliable growth patterns.
Highlights from Day 4 of the 2010 MRS Spring meeting, reported by Techcet's Michael A. Fury: TSVs and flexible interconnects for 3D CMOS/MEMS; 300mm BCB wafer bonding; carbon nanotube interfaces for interconnects and vias; phase-change memory devices; interfaces during ALD of rare earth-based high-k dielectrics; and graphene's use in on-chip interconnects and transparent conductor electrodes.
Keithley exec Lee Stauffer explains how adding ultra-fast voltage waveform generation and current/voltage measurement capabilities to the company's Model 4200-SCS semiconductor characterization system benefits a range of applications, from flash memory to CMOS and MEMS.
Tegal Corporation (Nasdaq: TGAL) is launching a new member of its ProNova family of high-density inductively coupled plasma (ICP) reactors for the company’s DRIE series wafer processing products. The ProNova2 is targeted for fast-growing 200mm MEMS and 3D IC applications.
Following are some of the highlights of the SEMICON West exhibit halls, open July 13-15 at the Moscone Center in San Francisco, CA. Products on display include TSV technology, ALD systems, vacuum and wafer transport tools, and more for semiconductor and package manufacturing.
SEMI has reorged into three groups to align its focus areas into IC manufacturing, solar photovoltaic (PV), and related/tangential markets including MEMS and LEDs.
SEMICON Taiwan will say "bienvenue" to 10 companies from France, including research group CEA-Leti, international development agency UBI France, and suppliers like Satin Technologies and IBS.
16 papers with imec authors were accepted for IEEE International Electron Devices Meeting (IEDM), December 6-8, 2010, in San Francisco. Both ITRS-related as well as More-than-Moore-related research papers have been accepted, rewarding imec’s multidisciplinary R&D platform (featuring two state-of-the-art R&D fabs).
Techcet's Michael A. Fury continues with observations from the second day of IEDM 2010 presentations, examining papers on several graphene-based devices, a RRAM device stack on flexible substrates, using MEMS for RF channel switching, and Jedi tricks for post-FinFET circuit design.
Exotic pads for CMPs, flow meters with a nod to Napoleon, and driving down LED costs were among themes pursued by Techcet's Michael A. Fury on a walk through the SEMICON West show floor.
Semiconductor industry heavyweights Intel, Samsung and Toshiba (in that order) topped semiconductor sales so far in 2011, according to a report from ABI Research. As a whole, the semiconductor market should see about 4% growth during 2011.
United Microelectronics Corporation (UMC) launched the A+ technology platform, a specialized 0.11
The updated "Garment System Considerations for Cleanrooms and Other Controlled Environments" document includes new sections on measuring footwear, frocks and other garments, as well as a new subsection for tracking system use, such as RFID chips and barcodes.
Displays for pure-play e-book readers will see 108% higher shipments in 2011, but slower growth ahead. In the future, e-reader makers will turn to color display technologies, predicts IHS iSuppli.
Asahi Kasei E-Materials Corporation purchased an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EV Group (EVG).
ULVAC Inc. developed the ENTRONTM-EX2 W300 CVD-Ni/CVD-Co system for CVD-Ni and CVD-Co silicidation of 3D semiconductor gates and MEMS. The system is a response to a semiconductor industry transition from PVD to CVD in advanced 3D gate structure film step coverage, ULVAC reports.
Ahead of next week's 57th IEEE International Electron Devices Meeting (IEDM, Dec. 5-7), we've scanned the entire program to present a quick slideshow sampling of some of the more intriguing papers.
STMicroelectronics (NYSE: STM), a global semiconductor company, launched ST New Ventures, its corporate venture capital fund currently under incorporation.
SEMI is looking for presenters for technical sessions and other opportunities at SEMICON West 2012, July 10-12 in San Francisco, CA.
imec is presenting a record number of 17 papers at the IEEE International Electron Device Meeting (IEDM), ending today in Washington, DC.
Worldwide silicon wafer area shipments decreased slightly during the first quarter 2011 when compared to fourth quarter 2010 area shipments, and were marginally higher than first quarter 2010, according to the SEMI Silicon Manufacturers Group.
The F30 module offers improved throughput over the entire sensitivity range. Two European fabs, a leading Asian foundry, a leading MEMS producer, and a process equipment manufacturer that is developing an integrated inspection solution have ordered the Rudolph system.
In an SST-exclusive series of blogs, imec reports from its International Technology Forum this week in Brussels. Francesco Pessolano, manager of imec's NVision program, reviews how digital optics can make future vision systems smaller, faster, cheaper, and more reliable.
SPTS completed the acquisition of deep reactive ion etch (DRIE) technology and certain related assets from Tegal Corporation. In addition, the deal includes the transfer to SPTS of the capital stock and operations of Tegal France SAS.
EV Group (EVG) received an order from new customer Shenyang Silicon Technology Co. Ltd. (SST). SST will use an EVG850LT automated production bonding system for silicon-on-insulator (SOI) wafers.
The IC industry, which had a phenomenal growth year in 2010, is in a cautious mode under greater macro-economic uncertainty and hesitancy. Some positive milestones are on the horizon, however, shows data within IC Insight's Mid-Year Update, such as the 200 billion IC shipment milestone in 2011, and the $300 billion mark expected in 2013.
Singapore has launched the Manufacturing Productivity Technology Centre at A*STAR's Singapore Institute of Manufacturing Technology. GlobalFoundries signed a 5-year Manufacturing Productivity Enhancement master plan agreement with SIMTech, working on materials recycling, wafer transport, and more.
SEMICON Taiwan (Sept. 7-9) approaches, the island's most celebrated event for microelectronics manufacturing, coorganized by SEMI and the Taiwan External Trade Development Council (TAITRA), offers more than 60 programs and sessions and 550 exhibitors spanning the entire semiconductor value chain and related high-growth industries.
SEMICON Europa is coming up fast (Oct. 11-13), and SST (and some friends) will be reporting on-scene. Here's a summary of the presentations we're looking forward to, from the Fab Managers' Forum to conferences on test, packaging, MEMS, and hot topics including 3D ICs and 450mm.
ATREG's Barnett Silver reports from SEMICON Europa, where the overall mood on the show floor is optimistic yet cautious, with hope for strong growth by mid-2012. Key themes include a slowdown in 200mm demand, an elite membership for 450mm, and keen interest in MEMS.
While the market has currently softened, early-2011 momentum will carry the year's semiconductor silicon sales to a higher total than 2010, said Stanley T. Myers, president and CEO of SEMI, noting the figures are an industry record. Growth will continue at "modest levels" through 2013.
DALSA Semiconductor VP/GM Claude Jean talks with SST about the new $218M microelectronics center being formed in Quebec, and how the company will contribute to its focus on MEMS and 3D wafer-level packaging and vice-versa.
Scottish foundry Semefab says it is investing £6.6M (US $11M) ina new wafer fab for frontend processing of MEMS structures.
Among a spate of presentations at IMEC's annual Technology Forum this week, the European R&D consortium trotted out a new program for foundries and fabless companies, an "incubation" pact with TSMC, and developments in multithreading and radio chips.
Processing and characterization of a positive thick photoresist
OVERVIEW There is increasing interest in the thick, positive, epoxy-based photoresist made of the material AZ P4620 because of its wide applications in micro-fluidic devices and micro-electromechanical systems (MEMS). The optimization of polymerization for this material under near ultraviolet (UV) lithography...
A crowd of Japanese suppliers are gambling that rising demand for MEMS devices for high volume products is about to spur a real volume market for production tools and services. There are now 20 Japanese companies offering microelectromechanical foundry services and 12 supplying MEMS etching equipment, according to a recent report from PennWell partner Nikkei Microdevices.
Whether it's pursuing MEMS in medical device applications, or MEMS/MOEMS for use in displays, communications, consumer products, lithography, or sensors and actuators - especially those used for toys - the opportunities for MEMS span sectors and industries. A panel discussion moderated by Edward Motamedi, CTO of Revoltech Microsystems, covered the challenges and possibilities for MEMS growth at Photonics West, held Jan. 22-27.
Key issues under discussion for the 2005 edition of the International Technology Roadmap for Semiconductors include the introduction of 450mm wafers, the problem of improving critical dimension control, and clearer definitions for half pitch to keep everybody honest, said regional committee chairmen in a press conference at the recent SEMICON Europa.
Molecular vapor deposition of coatings for MEMS devices
Results of a surface modification technique called molecular vapor deposition (MVD) are presented. The method is an enhancement of a generic vapor deposition process of self-assembling monolayers (SAM) with various surface preparation techniques, precise dosing of vapor precursors, and temperature control...
On November 45, 2007, the MEMS Congress met in San Diego to discuss new applications and future technology challenges for MEMS with keynotes and panel discussions. Last year's gathering numbered 110 participants; this year it grew to 150 attendees. Day one was taken up with social events: a golf outing and a wine and beer tour, and ended with a reception for worldwide attendees.
Yole Développement shares highlights from its latest "Status of the MEMS Industry" report, noting changes in the MEMS supply chain as companies add foundries or go fab-lite, and multi-chip MEMS packages create new relationships between companies.
Commercializing MEMS can take years and millions of dollars. While the MEMS industry shares some aspects with the larger semiconductor industry, the comparison is not fair in product development. Karen Lightman, MEMS Industry Group and Alissa M. Fitzgerald of A.M. Fitzgerald & Associates explain what makes developing new MEMS devices so hard.
Increasing sensor counts in Chinese cars, upcoming government mandates for sensors, and the booming automotive market in the country will push China's automotive MEMS consumption to a higher growth rate than that of the rest of the world.
Marlow Industries launched the EverGen series, thermoelectric-based energy harvesting devices offering low-cost, zero-maintenance power for wireless sensor applications.
Both graphene and carbon nanotubes (CNT) suit applications from flexible displays to silicon-replacing transistors. In a relatively short time, graphene has emerged as a low-cost, tunable material for all kinds of electronics. Will graphene overtake CNTs as the nanomaterial of future devices?
NIST developed a method to etch diamond crystals, exploiting the cubic nature of diamond crystals. These diamond-etched features could lead to better micro electro mechanical system (MEMS) devices.
Lemoptix and Hamamatsu Photonics signed a long-term collaboration agreement to develop, industrialize and commercialize micro optical electro mechanical system (MOEMS) laser scanning and microprojection devices.
Precision positioning systems specialist PI (Physik Instrumente) opened a direct office in Singapore to expand its Asia market presence.
MIT named Vladimir Bulović as director of MIT's Microsystems Technology Laboratories (MTL). Bulović has experience in a range of advanced electronics technologies, from photovoltaics to MEMS.
Bosch Research and Technology Center is developing "Alan," a personal robot designed to be affordable, capable, and safe to serve residential users in chores. Automotive and consumer MEMS sensors are helping Alan navigate and perform tasks for less.
Beginning in 2005, consumer/mobile electronics makers started integrating MEMS motion sensors into devices. Almost every consumer device or cell phone today has a motion sensor embedded inside. Jay Esfandyari, STMicroelectronics, writes about motion sensing’s evolution and future in this blog, in association with MEMS Industry Group.
The maturing MEMS market and increased adoption of secondary equipment for semiconductor manufacturing have led deposition and etch tool supplier memsstar Limited to expand in Livingston, Scotland. memsstar added new positions in logistics, administration, and skilled and semi-skilled engineering to its jobs roster in conjunction with the expansion.
Sensor fusion -- where inputs from multiple micro electro mechanical systems (MEMS) are "fused" to increase response and accuracy -- is the next step for tablet/smartphone designs, according to a new IHS iSuppli MEMS & Sensors Special Report.
Submit an abstract now to present at a group of co-located micro/nano manufacturing conferences. MM Live USA 2012 will co-locate with MEMS Live USA and NANO Live USA in Rosemont, IL, March 7-8.
The National Institutes of Health awarded Boston University engineering and microbiology researchers $4.8 million to develop a chip-sized, low-cost and easily deployed virus detection platform. The product is conceived as an easily transported and simply operated detector for the front lines of an outbreak.
Despite being a mature market -- and the largest one for MEMS -- inkjet heads are seeing increased sales as consumers print more digital photos, and as industrial and electronics manufacturers look to print product, according to GIA.
InvenSense Inc. founder and CEO Steve Nasiri will deliver a keynote "MotionTracking - Driving Hi-Impact Motion-Based Applications in the Digital World" at Semicon Europa's International MEMS Forum.
Jean-Christophe Eloy, president & CEO, Yole Développement, shares an analyst's view of the micro electro mechanical system (MEMS) industry, calling 2011 a year of transition and changes.
Combo sensors, comprising MEMS accelerometers, gyroscopes, or electronic compasses, are filling a need in consumer and automotive applications. Combined revenue from these sectors will grow by a factor of 50 over 5 years, shows IHS iSuppli.
STMicroelectronics has hosted 3 2011 iNEMO Campus Design Contests, for the US, China and Taiwan. This week, Taiwan's first place went to students from the National Yunlin University of Science and Technology for a smart hula hoop design.
In its new report, Emerging Markets For Microfluidic Applications, Yole Développement asserts that microfluidics are a "key technology" for the life sciences market, which will prop up microfluidics growth to $4 billion in 2016.
Boston Micromachines Corporation will use a NASA contract to develop better microfabrication processes for deformable mirrors, which will be used in exoplanet imaging research.
Yole studies the evolution of inertial MEMS and magnetometers and provides reverse costing analysis of the MEMS devices in "Technology Trends for Inertial MEMS." The report considers 23 MEMS devices.
After taking 13 years to fab its first 1 billion MEMS sensors, Bosch has added another billion in just 3 years. The company's MEMS sensor production is nearing half a billion a year.
Tegal sold over 30 patents from the NLD portfolio, Lots 1-3, covering pulsed-chemical vapor deposition (CVD), plasma-enhanced atomic-layer deposition (PEALD) and NLD.
Imec says it has built an integrated poly-SiGe-based piezoresistive pressure sensor on top of 0.13μm copper backend CMOS, the first such device directly fabricated above its readout circuit and the first poly-SiGe MEMS device of any kind processed on top of Cu-backend CMOS.
Imec says it has developed a fT/fMAX 245GHz/450GHz SiGe:C heterojunction bipolar transistor (HBT) device, useful for future high-volume millimeter-wave circuits in various applications.
Wafer supplier IQE released a customizable range of silicon on insulator (SOI) products that IQE reports afford improved thickness and doping control.
EQT III will sell VTI Technologies, leading independent designer and manufacturer of high-performance MEMS sensors, to the publicly listed Japanese electronic components company Murata Manufacturing.
STMicroelectronics (NYSE:STM) has implemented through-silicon vias (TSV) in high-volume micro electro mechanical system (MEMS) devices. ST is using TSV in its smart sensors and multi-axis inertial modules.
The market for electronic compasses is set to grow 73% this year to $419.1 million, according to a new IHS iSuppli MEMS & Sensors special report on magnetic sensors. This high growth is projected to continue, with Japanese manufacturers dominating the space.
The University of Houston College of Optometry is using MEMS-based deformable mirrors, Multi-DM, from Boston Micromachines Corporation (BMC) in glaucoma research.
CTS Electronic Components, of CTS Corporation (NYSE:CTS), received 2 production orders for piezoceramic products from a major US sonar manufacturer. Revenues should total about $5 million.
X-FAB Silicon Foundries Group and Senodia Technologies (Shanghai) Co., Ltd today announced they have concluded development and are ramping production of microelectromechanical system (MEMS) gyroscopes for high-volume consumer applications.
The COWIN project is a European Commission (EC) initiative under FP6 and FP7 European research projects for smart nano and micro technologies benefiting diagnostic and medical applications. The 3-year project has a January 2012 closing for micro and nano bioconvergence systems’ research projects.
mPhase Technologies was granted access to the technical facilities at the Center for Nanoscale Materials, Argonne National Labs, for work on its MEMS Smart silicon membrane, a key component of the mPhase Smart NanoBattery.
Panorama Synergy has formed an exclusive worldwide licensing agreement with the University of Western Australia for optical technologies related to highly sensitive measurements by multiple, simultaneous micro-cantilever MEMS sensors.
IHS and Chipworks share details from their preliminary teardowns of the Apple iPhone 4S. The device resembles an iPad/iPhone hybrid, and the 5-lens autofocus camera module is the first IHS has encountered in a smartphone.
MIT researchers developed a glass-stamp-based technique that helps fabricate lab-on-chip sensors at a lower cost than e-beam lithography and in a more reproducible manner than nanoimprint lithography.
At the MEMS Executive Congress 2011 in November, a demo event will showcase MEMS-enabled applications from medical devices to entertainment and computing systems. Here are the Showcase finalists.
Asahi Kasei Microsystems (AKM) in 2010 retained its position as the world’s largest supplier of silicon magnetic sensors, according to an IHS iSuppli Magnetic Sensors Special Report. AKM has scored design wins for its 3-axis electronic compasses in the iPad, iPad 2, iPhone 3GS and iPhone 4, among other notable smartphone and tablet products.
Imec engineers have simplified the thin-film wafer-level MEMS packaging process with nanopores that prevent leaks into the package and a low-temperature processing approach.
Scientific & Biomedical Microsystems, a developer of scientific and medical sensors and systems based on MEMS and other microfabrication technologies, was awarded a 5-year Schedule 871 contract by the US General Services Administration.
Researchers from NIST and University of Colorado Boulder developed a low-power microchip combining microfluidics and magnetic switches to trap and transport magnetic beads.
CALIENT Technologies raised $19.4 million in venture financing to expand into data center and cloud computing markets and ramp its new portfolio of 3D MEMS photonic switching systems and modules for OEMs and system integration partners.
Pixtronix Inc. and Chimei Innolux Corp. (CMI) collaborated on the development of 5"-diagonal micro electro mechanical system (MEMS) display prototypes. The displays use Pixtronix's proprietary MEMS technology and were built by CMI.
Helsinki-based ScanNano,a private Finnish R&D firm that specializes in MEMS technology at the nanoscale, has partnered with STMicroelectronics with the goal of combining RF MEMS and CMOS.
The co-located Energy Harvesting & Storage and Wireless Sensor Networks & RTLS USA 2011 conference were held in Boston, MA recently. Following are some main points and announcements from the keynoters.
Qualcomm MEMS Technologies and Kyobo Book Centre of Korea launched the first e-reader using mirasol display technology. The touch display features vibrant color in bright sunlight and power management enables weeks of reading.
SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announces the cooperation with Swansea University´s Centre for NanoHealth (CNH).
Whether it’s keeping athletes in top form, improving navigation in medical robots, helping industrial operators extend factory equipment life, or preventing automotive rollovers, high-performance MEMS inertial sensing technology adds a new dimension that transforms many conventional applications, says blogger Howard Wisniowski, Analog Devices.
Innovative Solutions Bulgaria Ltd. acquired Bulgaria’s largest MEMS fab, built north of Sofia in 2004. This new facility provides space to expand production capacity of AFM products.
Drug delivery companies Leonardo Biosystems Inc. and NanoMedical Systems Inc. (NMS) will collaborate, with NMS developing and establishing a commercial process to manufacture nanoporous silicon particles for Leonardo's multi-stage drug delivery system.
Integrated Device Technology, Inc. (IDT, NASDAQ:IDTI) developed and demonstrated commercially available oscillators incorporating piezoelectric micro electro mechanical system (pMEMS) resonators.
Sensors are hot items for ultrabook functionalities, boosting MEMS sales. The thin form factor of ultrabooks will deter DRAM device integration and DRAM use as memory upgrades, according to IHS iSuppli Semiconductor Value Chain.
IHS shares the growth map for semiconductor magnetic sensors in automotive applications, where the sensors are used in vehicles, and technology trends. Top suppliers are also listed.
STMicroelectronics (NYSE:STM), MEMS maker, named a winner in its 2011 iNEMO Campus Design Contest in China: Sky Worker Team 1 from Tsinghua University. ST operates the open competition in China and Taiwan, and the US.
A multi-institution team has produced a cobalt/iron alloy that could be the basis for a new class of sensors and micromechanical devices controlled by magnetism. The alloy does not use rare-earth elements to achieve its properties.
Applied Materials Inc. (AMAT) launched the Applied Producer Optiva chemical vapor deposition (CVD) system for back-side-illuminated (BSI) image sensor manufacturing. It deposits low-temperature conformal films that boost the low-light performance of the sensor while improving its durability.
USHIO Inc. is introducing the UX4-MEMS FFPL 200 with the overlay accuracy of 0.5µm for manufacturing MEMS devices, mounted with the newly developed lens module having a maximum depth of focus of 500µm and the auto mask changer module for manufacturing multiple device types.
Semiconductor Research Corporation (SRC), university-research consortium for semiconductors and related technologies, is working with Cornell University researchers to develop on-chip silicon technologies for mobile devices. The aim is a micro-mechanical resonator for RF MEMS.
JPK Instruments introduced QI, or quantitative imaging mode, for the recently launched NanoWizard3 AFM analytical system. QI enables full control of tip-sample force at every pixel.
Imec and Holst Centre micromachined a vibration-energy harvester with 489µW output power, using piezoelectric material in a MEMS cantilever. The team presented results at IEEE's International Electron Devices Meeting (IEDM) this week in Washington DC.
MEMS Industry Group (MIG) shares the MEMS-related exhibits and discusses at the 2012 International CES, which covers consumer electronics, January 10-13 in Las Vegas.
Teledyne DALSA manufactured the CCD sensors -- designed by NASA -- on the NASA mission to Mars. The sensors will help the Rover navigate the surface of the planet.
DelfMEMS SA named Tronics as its micro electro mechanical systems (MEMS) foundry partner. Tronics will manufacture RF MEMS switches for DelfMEMS, with high-capacity runs starting in 2012.
Linkstar customers have qualified the pilot shipment of silicon optic devices fabricated with Singapore's A*STAR Institute of Microelectronics MEMS technology. The IME silicon MEMS technology enables accurate alignment of optical devices to the optical fiber arrays.
China's MEMS spending will see a 12.1% CAGR 2010-2015, driven in the near future by expanding smartphone/tablet demand, new consumer experiences, and a rapid drop in MEMS production costs as MEMS designs and production processes improve, says IHS.
Researchers at the Georgia Institute of Technology have developed a prototype wireless sensor capable of detecting trace amounts of a key ingredient found in many explosives.
MEMS pressure sensors have relatively high average selling prices and a range of applications, making them to leading MEMS device by 2014, according to IHS iSuppli MEMS & Sensors Market Tracker. The largest application? Automotive.
The Behlman Electronics subsidiary of Orbit International received 3 new orders, totaling in excess of $1.5 million, for COTS power supplies to an electro-optical sensing system, a computer system, and an all-weather airborne reconnaissance aircraft.
Asylum Research introduced the Variable Field Module2 (VFM2) for the MFP-3D AFM. It allows researchers to apply magnetic fields in conductive AFM experiments, magnetic force microscopy, and other applications.
Micrel Inc. (Nasdaq:MCRL) has begun manufacturing MEMS at its San Jose, CA wafer foundry operations, offering 6" wafer fab and tools to produce advanced MEMS devices.
Huntsman Corporation (NYSE:HUN) Advanced Materials division sold its stereolithography resin and Digitalis MEMS manufacturing machine businesses to 3D Systems Corporation (NYSE:DDD) for $41 million in cash.
Silex Microsystems licensed its Silex Sil-Via through-silicon-via (TSV) packaging platform to Nanoshift for use in early development of complex MEMS products.
Dr. Giles Humpston, Tessera, presents the free, on-demand webcast Lens Tilt in Small Auto-Focus Cameras. Dr. Humpston covers the dominant auto-focus miniature camera technology today -- VCM -- and an improved technology based on MEMS, which is being commercialized now.
Micronit opened its MEMS division, specializing in the design, prototyping and manufacturing of MEMS devices and wafers based on glass and silicon.
Ziptronix ZiBond direct bonding process contribute minimum distortion in backside illuminated (BSI) image sensors because of its low-temperature processing and high bond strength, the company reports.
Yole Développement's new report, "Inertial Combo Sensors for Consumer & Automotive" shows that supply chains need to adapt to the "very large market opportunity" for inertial combo sensors.
Sand 9, a MEMS oscillator developer, reports that it has raised $3,095,262 of its 6,190,528 equity funding round, in a recent SEC filing.
MEMS foundry Silex Microsystems and MEMS development firm A.M. Fitzgerald & Associates completed a multi-year collaboration on medical and biotech MEMS development, halving device development time.
MEMS foundry Micralyne Inc. brought Nanoshift LLC, a product development firm specializing in emerging technologies, on board for design, process development, fabrication and packaging partnerships.
The Heterogeneous Technology Alliance in Europe is developing new packaging and test methods for MEMS targeting space missions.
The automobile industry is a "lucrative" sensor integration market globally, as sensors that enhance comfort, fuel-efficiency, and safety are integrated by vehicle manufacturers. MEMS sensor production costs are set to drop, which will bring automotive sensors into the price/benefit range of every level of automobile, says Global Industry Analysts.
The Ontario Centres of Excellence gave the Martin Walmsley Fellowship for Technological Entrepreneurship award, totalling $50,000, to Innovative Processing Technologies Inc.
Measurement Specialties Inc. (NASDAQ:MEAS), sensor designer and manufacturer, entered into an amendment to its senior secured credit facility dated June 1, 2010, among JPMorgan Chase Bank N.A. and certain other parties.
Shanghai Simgui Technology Co. Ltd., a Chinese wafer manufacturer, placed a follow-on order for an EVG850 automated production bonding system for SOI wafer bonding. Simgui is moving from EVG's semi-automated wafer bonder to advance high-volume SOI production.
MicroVision Inc. (Nasdaq:MVIS), maker of ultra-miniature laser display technology based on MEMS, intends sell shares of its common stock in an underwritten public offering, using the funds for general corporate purposes.
Auburn University chemical engineering researchers William R. Ashurst and Virginia A. Davis were awarded a National Science Foundation grant to investigate cellulose nanocrystals in MEMS.
Micro electro mechanical systems (MEMS) are seen in mainstream devices and creating "exciting new ways" of interacting with the world, say MEMS Executive Congress organizers MEMS Industry Group (MIG).
Optex Systems entered into an MoU with Bridge Semiconductor Corporation to develop and sell thermal systems for a range of military applications. The thin-film ferroelectric technology aims to displace microbolometers for uncooled thermal sensing applications.
Precision Mechatronics Pty Ltd acquired Surfx Technologies, which specializes in high-speed atmospheric plasma technology for MEMS, microfluidics, semiconductors, solar cells, medical devices, and other manufacturing.
MEMS maker InvenSense Inc. (NYSE:INVN) priced its initial public offering of 10 million shares of common stock at a price to the public of $7.50 per share.
Microelectronics experts at Aurrion Inc. are seeking to develop military microelectronics technology for optoelectronic microsystems, under terms of a $13.9 million DARPA contract.
Specialty foundry TowerJazz signed a non-exclusive memorandum of understanding (MOU) with a European entity to transfer processes and projects to India and Brazil, including semiconductor and MEMS devices.
MicroVision Inc. (NASDAQ:MVIS) closed its public offering of 17,948,716 shares of its common stock with a draw of approximately $9.8 million after expenses.
System Plus Consulting releases MEMS CoSim+ V3.0, a comprehensive simulation tool for the non-standard manufacturing process of MEMS sensors.
University of Wisconsin-Madison engineers and physicists have integrated highly piezoelectric single-crystal material onto silicon to fabricate a low-voltage MEMS for communications, energy harvesting, sensing, actuators and other applications.
Gentex Corporation has acquired substantially all assets of InterSense, which makes MEMS-based hybrid motion tracking systems.
The InPhone microphone test system can be combined with the Multitest InStrip test handler for highly parallel MEMS test and the calibration of MEMS microphones.
Alphabet Energy Inc. closed its Series A funding round with $12 million, led by TPG Biotech, the venture arm of TPG. Alphabet Energy's prototype device converts waste heat to electricity. The silicon device leverages MEMS/semiconductor manufacturing technologies.
Sensors have the potential to do everything from monitor airplane fuselages for cracks to improve wrist rotation in prostetic arms. Student researchers describe their sensor development work in video blogs from TECHCON 2011.
MEMS foundry Tronics upgraded its Grenoble headquarters and manufacturing facilities, making a more than half a million euro investment, along with new equipment capital expenditures.
IHS iSuppli's Richard Dixon looks at the market for automotive MEMS sensors over the next few years: which technologies and regions are driving growth, who are the top auto MEMS firms today and the up-and-comers, and how China is emerging as a market driver and supplier base.
Sanmina-SCI Corporation (Nasdaq:SANM) will produce a family of optical components based on Kaiam's MEMS hybrid integration technology.
MEMS vendors comprise MNC and MEMS-centric and small-portfolio companies. The market will grow as tablet/smartphone adoption increases, and MEMS makers co-opt the economies of scale that other semiconductor segments have used to reach maturity, according to ABI Research.
A*STAR's Singapore Institute of Manufacturing Technology opened the SIMTech Microfluidics Foundry, offering microfluidics development, customization, and manufacturing. A*STAR's goal is to combine biomedical and engineering expertise to foster a microfluidics industry in Singapore.
A MEMS oscillator maker chose the MT9928 xm tri-temp test handler from Multitest for a novel oscillator application. The MEMS device required extremely accurate temperature calibration.
Halma plc, safety, health, and sensor technology group, acquired Avo Photonics Inc., opto-electronic design, packaging, and manufacturing specialist.
Qualtré Inc. recently demonstrated its first tri-axial solid-state silicon BAW MEMS gyroscope, prompting investors to supply an additional $10 million in capital to the company for a commercial ramp.
The MEMS Executive Congress 2011, November 2-3 in Monterey, CA, keynote speakers include a strategist, financial expert, and technologist.
STMicroelectronics (NYSE: STM) opened 2 2011 iNEMO Campus Design Contests, in China and Taiwan. The contest encourages students and young engineers to design innovative products based on STM's iNEMO MEMS platform.
mPhase Technologies Inc. (OTC.BB: XDSL) completed its 2nd working prototype of a new automotive and marine product, reducing size by 20% and increasing the product's functionality.
ClassOne Equipment sold its 150th mask aligner, which will be installed in the Smart System Technology & Commercialization Center of the College of Nanoscale Science and Engineering (CNSE) at UAlbany.
The state of Colorado named Synkera (HQ: Longmont, CO) among 50 Colorado Companies to Watch, honoring the second-stage, growing company.
Sensor manufacturer Sensirion inaugurated a new building in mid-July 2011 in Stäfa, Switzerland, and will move all of its production there.
Multitest added a new application to its MEMS test and calibration portfolio, MT MEMS tester, testing 3D earth magnetic field sensors for mobile applications and GPS-free state-of-the-art navigation applications.
MANCEF announce that the Commercialization of Micro-and Nano-Systems (COMS) 2011 conference will be held in Greensboro, North Carolina, August 28th – 31st, 2011, at the Grandover Resort.
Epson Electronics America (EEA) launched two new series of sensing platforms, based on Epson's QMEMS and semiconductor technologies. The new Epson evaluation tools will help developers create and evaluate consumer applications.
Two researchers at Mexico's Monterrey Technological Institute have reportedly been the subjects of a targeted letter-bomb attack by an "anti-technology anarchist group" for their work in nanotechnology including MEMS.
Sensors are experiencing faster growth than the overall semiconductor chip industry, according to the Q3 Sensors and MEMS Market Tracker released by MarketResearch.com. Sensors hit almost $7 billion in 2010, with 6.5 million units shipped.
Symmetricom Inc. (NASDAQ:SYMM) and Jackson Labs Technologies Inc. signed a joint marketing agreement to market and sell Jackson Lab's CSAC GPSDO timing and frequency board with Symmetricom's atomic oscillator, the SA.45s chip-scale atomic clock (CSAC).
TowerJazz advanced 0.18µm power management and CMOS image sensor (CIS) technology and sophisticated process design kits are now available for prototyping to companies, universities and research labs through the services provided by CMP.
For producing and analyzing microemulsions, the Small Droplet Chips allow the user to create micro-droplets from 5 to 30μm in diameter. Microemulsions offer increased stability, a higher interfacial area, and the capacity to solubilize both aqueous and oil-soluble compounds.
Honeywell Aerospace Microelectronics & Precision Sensors is developing miniature rate-integrating gyroscope technology for precision-guided munitions, ships, vehicles, aircraft, and individual combatants under a $5.9 million DARPA contract. The micro-sensor vibrating-structure gyroscope will measure rotation under harsh conditions immune to temperature, vibration, or other influences.
To capture part of the fast-growing consumer electronics MEMS market, VTI Technologies will ramp volume production of its CMR3000.
IHS iSuppli research indicates that 97% of all digital compass manufacturing worldwide in 2010 was conducted in Japan. Japan's March 11 earthquake has decimated transportation and utility power in the country. The top digital compass manufacturers in Japan say their operations are "normal."
MEMS can take the form of (or be incorporated in) accelerometers, gyroscopes, magnetometers, altimeters, screens, projectors, and microphones. Often, consumer devices contain more than 1 MEMS component, and that trend is growing.
Semico chief of technology and blogger Tony Massimini looks at the AKU230 MEMS microphone from Akustica, and finds the tiny device trimmed down by use of semiconductor manufacturing processes rather than traditional MEMS fab.
Five years after losing its leadership position in the global market for microelectromechanical systems (MEMS), Texas Instruments Inc. reclaimed the top spot in 2010 because of resurgent demand for the company's Digital Light Processing (DLP) chips, new IHS iSuppli research indicates.
BioScale relocated its corporate headquarters to scale up its commercial, scientific, R&D, and manufacturing functions in a newly renovated 30,000 square foot facility including Biological Level 2 laboratories and a clean room for its MEMS sensor manufacturing and assembly.
NanoSuite 6.0 promises speed, flexibility, ease of use and new application methods for nanomechanical properties measurements involving polymers, composites, thin film materials, MEMS, surface topology, stiffness mapping, and scratch testing.
ST Microelectronics has installed a µPG101 from Heidelberg Instruments in the "More Than Moore" Research Labs in Agrate Brianza to develop prototypes of new microfluidics devices for medical diagnostic, and lab-on-chip applications.
Movea created a wireless, miniaturized, inertial measurement unit (IMU) that uses MEMS sensors (partnering an accelerometer, gyroscope and magnetometer) to accurately measure 9 degree-of-freedom (DOF) motion for healthcare through gaming apps.
The MEMS industry grew 25% in 2010, and the 4 largest companies grew even faster, increasing their domination of Yole Développement's annual top 30 MEMS company ranking. These giants now account for some $2.9 billion of the sector's $8.6 billion in total sales.
Dolomite launched a range of optical systems that capture high-quality still and moving images of microfluidic experiments. Applications include testing various microfluidic chips for droplet generation and particle imaging, etc.
STMicroelectronics (NYSE: STM) and bTendo Ltd. will jointly develop the world's smallest pico projector for smart phones and other portable consumer-electronics devices, based on bTendo's Scanning Laser Projection engine technology and ST's MEMS, video processing, and semiconductor process technology expertise.
Fluidigm Corporation priced its initial public offering (IPO) under the symbol FLDM. Fluidigm develops, manufactures, and markets microfluidic systems comprising instruments and consumables, including chips and reagents.
The University of South Florida received $5.45 million in grants from the Bill & Melinda Gates Foundation to create advanced devices that mimic the human liver to better study the life cycle of the malaria parasite, and to develop effective therapies for the disease.
Panasonic Corp. and Seiko Epson Corp. are leading Japanese companies' resurgence in the MEMS market. Japanese firms were global leaders back in the 1990s, making such parts as sensors for car airbags. But the 2000s saw major U.S. and European semiconductor companies enter the field, grabbing market share by making massive capital investments and sharply boosting production efficiency.
A North Carolina State University endowment fund established to bridge pure research and product commercialization for entrepreneurs has awarded a $10k grant to a biomedical engineering project that will use MEMS to make catheters flexible, then stiff, for stent delivery.
MEMSCAP (MEMS) completed die-level reliability testing beyond 200 millions cycles on its Thermally Actuated Variable Optical Attenuators. MEMS-based Variable Optical Attenuators are gaining momentum and market share over competing traditional technologies, according to MEMSCAP.
Current R&D successes with Singapore's A*STAR IMRE prompted Nitto Denko to invest more in Singapore by building a prototyping center there, which will be incubated at local research institute. The prototyping center will focus on an optical waveguide for biosensing applications.
NEC announced the development of a compact sensor that measures the power consumption of electronic devices and delivers this information to energy management systems, without needing an external power supply or battery.
The Smart System Technology & Commercialization Center at U Albany's CNSE was selected by SPAWAR to build innovative sensor systems for U.S. military intelligence gathering and by EPRI to develop a groundbreaking wireless sensor network to monitor the efficiency of power generation. The two initiatives are valued at $6 million.
An uptick in passenger car production, improving consumer demand, and dwindling stockpiles in the supply chain have revived MEMS shipments. Investments in new product development, innovation, and expansion of production capacity bode well for the future of the market.
Aerotech ANT95-R and ANT130-R direct-drive rotary stages offer in-position stability of 0.005 arc sec and incremental motion of 0.01 arc sec using the company's direct-drive technology. They suit disk-drive and MEMS manufacture and test, fiber-optic device alignment, as well as laboratory R&D applications.
Researchers at imec -- Danae Delbeke and Francesco Pessolano -- discuss announcements made in conjunction with Photonics West regarding the research consortium's NVISION program (for advanced imaging solutions) and silicon. Imec's silicon photonics platform allows for the miniaturization of complex photonic functions on a single chip.
USHIO America will start marketing the nano-imprint vacuum ultra violet (VUV) ashing system "CHIPs (Compact HiPower System)" in the US. Incorporated into nano-imprint lithography (NIL) equipment, the CHIPs allows non-contact and damage-free cleaning, surface improvement, and ashing of templates and workpieces.
Helios Crew Corporation (HCC) Taiwan released its LED product S35, a packaged component LED that integrates MEMS with semiconductor processing to produce a unique silicon packaging technology.
Dolomite, microfluidic designer and manufacturer, expanded its range of temperature control systems with the Hotplate Adaptor - Chip Holder H, which allows control over internal temperatures of microfluidic chips without any disruptions to the fluid flow.
Coventor and imec formed a strategic partnership to improve and expand the use of advanced design and manufacturing techniques for the development of CMOS-integrated MEMS. The partnership includes strategic alignment on R&D roadmaps and collaboration on advanced research topics.
X-FAB Silicon Foundries and MEMS Foundry Itzehoe will combine their existing MEMS foundry capabilities and resources. MFI's contract MEMS manufacturing experience will broaden X-FAB's foundry capacity in 8" wafers, while MFI will access X-FAB's analog/mixed-signal Si foundry technology.
Sandia National Labs will leverage the traditional electronics manufacturing expertise in Mexico into MEMS design lessons for University of Guadalajara students. It says MEMS R&D can stabilize Mexico's economy while adding to US/Mexico border defense technologies.
Primaxx provides residue-free MEMS dry etch release products, and is based in Allentown, PA. The transfer strengthens SPTS' etch technology portfolio that includes deep silicon etch, dielectric etch, inductively coupled plasma (ICP) etch, and now hydrogen fluoride (HF) vapor oxide etch.
Update, February 22: MEMStim received $27,000 for best business and presentation, and outstanding team. The Samuel Zell & Robert H. Lurie Institute for Entrepreneurial Studies at the University of Michigan Ross School of Business announced that eight teams have advanced to the semi-finals of this year's Michigan Business Challenge, including MEMStim, an ODM that sells MEMS electrode leads for medical devices.
Sand 9, Inc. is planning volume launch of its MEMS oscillator technology for wireless applications. The company appointed Skyworks EVP Greg Waters to their Board of Directors, using his experience in wireless communications to help Sand 9 manage the transition from development to volume production.
Capitalizing on their design wins in Apple Inc.'s iPhone 4 and iPad, semiconductor suppliers STMicroelectronics and TriQuint in 2010 achieved industry-leading growth in the global market for MEMS in consumer electronics and mobile devices, new IHS iSuppli research indicates.
Alchimer announced that the Centre de Collaboration MiQro Innovation/MiQro Innovation Collaborative Centre (C2MI) has licensed its suite of products and its Electrografting (eG) technology to support the center’s 3D MEMS programs.
Boston Micromachines Corporation (BMC) won a $100k contract from NASA to support space-based imaging research. The contract will help develop a micro electromechanical deformable mirror (MEMS-DM) with critical enhancements to reliability and fault-tolerance.
CMOS image sensors for digital still cameras are set for rapid growth over the next 3 years, allowing shipments to exceed those of CCDs for the first time in 2013, according to IHS iSuppli. CMOS image sensors are winning over Sony, Canon, and other OEMs with better power consumption, lower fab costs, and circuit integration, among other benefits.
A two-day seminar later this month in San Jose will offer insights into testing of MEMS inertial sensors and a "strategic plan" to decrease cost and increase efficiency of MEMS device testing.
MSGI Technology Solutions provided a science and technology update to its investors on its lab-on-chip chemical sensing technology being developed for NASA. Applications range from blood-less diabetes tests to bio-terrorism detection.
Vistec Lithography received a major order from Greece's National Center for Scientific Research (NCSR Demokritos) Institute of Microelectronics (IMEL). This will be the first 100kV lithography system in Greece.
Yale's Jan Schroers and his team are using a new processing technique to fabricate miniature resonators for microelectromechanical systems (MEMS) as well as gyroscopes and other resonator applications from bulk metallic glasses (BMGs) twice as strong as steel.
Engineers at Oregon State University have invented a new way to use surface-mount adhesives (SMAs) in the production of low-temperature, microchannel heat exchangers. University officials are now seeking a commercial partner in private industry to continue development and marketing of the technology.
CEA-Leti has been developing microsensors capable of precisely measuring their orientation in relation to the Earth's gravitational and magnetic fields. Dominique Vicard and Nathalie Sprynski, CEA-Leti, say they are now beginning to incorporate arrays of these tiny micro sensors into new kinds of instrumented -- or proprioceptive -- materials.
Ferroelectric materials were considered exotic semiconductor materials in the past. Thanks to better knowledge and industrialization of these materials, they are increasingly used in many new applications, especially in the MEMS field, says Yole Développement.
Discera Inc. launched high-performance DSC21XX I2C and DSC22XX SPI application programmable MEMS oscillators. The products fit into flexible FPGA- and CPLD-based designs.
The AKU230 is the first Akustica CMOS MEMS microphone manufactured by Bosch. The company claims that the monolithic microphone die is world's smallest at 0.70mm2. The package is industry-standard.
Coventor Inc., software supplier for developing micro-electromechanical systems (MEMS), expanded its reach in two key geographies with the opening of a new office in Italy, and a new distribution agreement in China.
TESCAN, scanning electron microscope and focused ion beam workstation maker, delivered a VEGA 3 scanning electron microscope (SEM) to the Massachusetts Institute of Technology (MIT) Micro and Nano Engineering lab.
Coventor Inc. announced availability of SEMulator3D 2011, the latest version of its virtual fabrication software for semiconductor and MEMS process development organizations. It includes the debut of SEMulator3D Reader.
Plasma-Therm LLC, plasma etch and deposition equipment supplier, secured majority shareholder status of Advanced Vacuum, a vacuum and thin film equipment provider headquartered in Sweden.
In light of the March 11 earthquake and tsunami that devastated northwestern Japan, and led to power outages and transport disurptions across the nation, we provide here a list of MEMS companies that have issued updates on their facilities and staff.
The top European MEMS manufacturers -- Bosch, STMicroelectronics and VTI -- beat out the overall MEMS segment in 2010 growth. Growth came from automotive and consumer markets, with new product launches laying the groundwork for a strong 2011 as well.
To enter the MEMS for medical apps market, Panasonic could scale up MEMS operations in Fukui Prefecture, Japan, reports Nikkei. Panasonic, which already produces MEMS for consumer electronics, could enter the medical MEMS sector as early as 2011.
OPEN ENGINEERING, the Multiphysics branch of the SAMTECH Group, signed a cooperation agreement with the Russian University of Information Technologies, Mechanics and Optics (ITMO).
MicroVision (Nasdaq: MVIS), ultra-miniature display technology provider, opened a research and development center at Nanyang Technological University (NTU), Singapore. MicroVision plans to staff the new R&D facility with up to 25 engineers by 2012.
New MEMS, a 4-yr old segment of the MEMS market specifically for consumer electronics (CE) and mobile handsets, will grow by 157.4% in 2011, powering the expansion of the overall MEMS industry, according to new IHS iSuppli research.
Microelectronics scientists at DARPA are reaching out to industry to find new ways of blending electronic, photonic, and MEMS components on one silicon IC using today's semiconductor manufacturing technologies.
Yole released a new report, MEMS Microphone, presenting MEMS microphones technologies, the related supply chain and its key players. The mobile phone market is still the largest consumer of MEMS microphones, and Knowles is still the dominant market player, though other companies are finding space in the sector.
Si-Ware Systems (SWS) announced a novel Self Compensating Oscillator (SCO) technology, which produces an all-silicon oscillator that can achieve an overall frequency stability better than 100ppm over a temperature range of -20 to +70ºC.
The CES, annual consumer electronics show, will feature for the first time a MEMS TechZone and MEMS conference program at CES 2012.
Stanford University will install 3 Plasma-Therm dry etch systems in its research facility for nanotechnology and photonics, joining 2 Plasma-Therm deposition systems the university requisitioned during a facility upgrade in February 2010.
At the Swiss EPFL Integrated Actuactors Laboratory, researchers have constructed an electromagnetic three-phase motor on silicon that could make watches 3x more efficient and add other applications to time keeping.
FLIR Systems priced a public offering of $250 million aggregate principal amount, planning to fund general corporate needs, such as working capital, investments in or extensions of credit to FLIR subsidiaries, capital expenditures, stock repurchases, and acquisitions.
Benedetto Vigna, group VP and GM of ST Microelectronics MEMS, Sensors, and High-Performance Analog Division, will keynote the International Microtech/MEMS Conference with "The Future of MEMS and Challenges to Success."
Potomac Photonics added advanced quality control (QC) and inspection capabilities to its service offerings for micro-electronics, MEMS, micro-fluidics and other projects.
Sporian Microsystems received a DOE contract to evaluate harsh-environment materials, MEMS, and packaging technologies for Generation IV nuclear reactor use.
Imec and Holst Centre showcase research on an ASIC architecture that provides readout functions for accelerometers and strain sensors without draining device power. The chip could be used for various sensors in a continuous monitoring application, as for seismic activity.
The automotive MEMS sensor market will rise starting in 2012, according to IHS. Revenues will increase 16% to $2.31 billion, thanks to vehicle production ramp-up as Japan recovers from the earthquake/tsunami and various countries implement safety regulations.
Magnetic sensors will exceed $3.2 billion in sales by 2017 driven largely by "E-compassing" applications, according to Global Industry Analysts. Unique end-use applications, along with technology innovations, interoperability with devices and competitive pricing, will fuel "robust" magnetic sensors growth.
EVG will install a 200mm Gemini fully automated wafer-bonding system with cleaning module at the MiQro Innovation Collaborative Centre in Quebec.
The MEMS DemoZone Display, presented by the MEMS Industry Group, will display MEMS products and suppliers at SEMICON West, showcasing the diversity, enabling capabilities, and nuances of MEMS technology.
OmniVision Technologies Inc. (NASDAQ:OVTI) will acquire wafer-level lens production and assembly processes out of its TSMC JV, VisEra.
Silicon Sensor International's subsidiary Microelectronic Packaging Dresden will extend its sensor fab contract for an auto maker, doubling production of a steering angle detection sensor. The contract could be worth EUR50M.
Frontrunner STMicroelectronics is winning by a distance in the MEMS foundry race: outpacing mixed-model and pure-play MEMS makers alike by at least 5x. While mixed-model players earned more than pure-play foundries in 2010, the pure foundries are where growth is happening, says IHS iSuppli.
A quadcopter designed by "Team McGill," students at McGill University, won the iNEMO Design Contest, hosted by STMicroelectronics and Digi-Key. Team McGill used the iNEMO evaluation board and 9 embedded degrees of freedom for their winning quad-copter design.
poLight AS, reflowable autofocus actuated cameraphone lenses maker, closed its Series B financing round with NOK100 million (USD 18.5 million), led by Norway's Investinor.
tMt will help refine areas in IME's three-party collaboration model for MEMS prototyping and mass production for medical, consumer, and other applications.
Pure-play MEMS foundry Micralyne Inc. and A.M. Fitzgerald & Associates (AMFitzgerald), a MEMS product development firm, partnered to fast-track product commercialization.
CEA-Leti has revamped its RF MEMS manufacturing for higher reliability and performance, using thin-film packaging and replacing gold with ruthenium for the contacts. The design also prevents contact between the electrodes when the bridge is down.
Kurt J. Lesker's new Atomic Layer Deposition system, the ALD 150LX, can operate as a stand-alone or fully integrated cluster tool system for nano, microelectronics, optics, MEMS, semiconductor, photovoltaics, photonics, catalysis & fuel cells, and OLED manufacturing.
Fraunhofer and Vuzix have partnered on R&D, with the goal being a MEMS device that integrates the display and optics into a monolithic display engine, aiming for "sunglass-styled" video glasses.
Rasco GmbH, a Cohu Inc. (NASDAQ: COHU) subsidiary, added the Pressure Test Unit (PTU) and the Acoustic Test Unit (ATU) to its line of testers for MEMS ICs.
Maxim Integrated Products (MXIM) acquired SensorDynamics, an Austrian semiconductor company that develops proprietary sensor and microelectromechanical (MEMS) devices, for $130 million plus about $34 million of debt.
MuSES Laboratory researchers at Michigan Tech have characterized the output flow power of round and square/rectangular microfluidic channels, revealing distinct improvements with round geometries.
iNEMI and the MEMS Industry Group will host MEMS Needs and Opportunities, a workshop running September 15-16, with the goal of identifying gaps in technologies, processes, and test methodologies and forming collaborations to tackle them.
Tony McKie, GM of MEMSSTAR, tackles the question of how to make MEMS truly manufacturable. "Nobody builds a MEMS manufacturing line anymore," says McKie.
TI developed a single-chip passive IR MEMS temperature sensor for contactless temperature measurement in portable consumer electronics. The TMP006 integrates an on-chip MEMS thermopile sensor, signal conditioning, a 16-bit ADC, local temperature sensor and voltage references on a single 1.6mm2 chip.
A dragonfly with beating wings and an ultra-sensitive microvalve were top winners at Sandia National Lab's student design contest for MEMS.
Dolomite, microfluidic device maker, designed the Multiflux range of microfluidic connectors and interfaces.
The new Melexis MLX90614ESF-DCH and MLX90614ESF-DCI offer heightened acuracy thanks to a combination of sensors and digital processing technology.
Sensor maker Measurement Specialties Inc. (MEAS) was awarded the R&D Technology Certification along with RMB3 million funding from the Shenzhen government.
For the MEMS industry in general and for Japan's MEMS sector in particular, the damage from the March 11 earthquake and tsunami was not as severe as initially feared due to a fortuitous accident of geography. Only three of the 22 most important MEMS and compass fabrication plants in Japan suffered direct damage, IHS iSuppli research shows.
The International Trade Commission ruled in Analog Devices' favor and found that Knowles Electronics infringed ADI's Wafer Anti-Stiction Application (WASA) patent. The ITC also issued an exclusion order prohibiting further importation into the US of Knowles' infringing "MEMS [microphone] devices and products containing the same."
CMOS image sensors did not see the same strong rebound in 2010 that the semiconductor industry at large experienced. New momentum, driven by new system applications outside of camera phones and digital still cameras, could focus CMOS image sensors on growth from 2011 on, says IC Insights.
Using lithography-compatible nano self-assembly, plasma etching, and sacrificial etch release, University of Minnesota researchers created carbon nanotube (CNT) based thin film MEMS/NEMS structures.
STMicroelectronics (NYSE: STM) and McGill University collaborated on an undergraduate course that teaches the integration of multiple state-of-the-art sensors into embedded computer systems, via lab exercises and projects based around STM's iNEMO platform. Some 35 students have already completed the course, with final projects in gaming, aerospace electronics, and more.
Northrop Grumman Corporation (NYSE:NOC) and Georgia Tech are developing a new type of MEMS gyroscope based on a new MEMS fabrication process that should allow smaller size, lighter weight, and lower power consumption with same performance to current silicon MEMS devices.
The SiTime SiT820X family consists of the SiT8208 and SiT8209 programmable oscillators that operate from 1 to 80MHz and 80 to 220MHz respectively. These devices achieve 2x better stability over the industrial temperature range than quartz-based solutions, the company reports.
ULIS launched Pico640E, a video graphics array (VGA) 640 x 480 17µm IR imaging sensor that offers new advantages in size, performance and factor of merit.
To significantly reduce size and power consumption and increase performance of micromirror devices, Lemoptix used semiconductor-like equipment to build micromirrors with actuation based on magnetic and heat-dissipating principles instead of gearings.
MEMS foundries shared unequally in the MEMS market's 25% growth in 2010. Total combined revenues of the top 20 MEMS foundries climbed only 10%, as companies doing internal production instead grabbed most of the big growth in consumer and automotive markets. Not to worry though, specialized foundry work yielded higher margins than the volume stuff.
Smart phones are a booming market. MEMS and sensors are a booming market. Semico estimates that the total available market for MEMS and sensors in the smartphone market will reach $3.0 billion in 2011, an annual growth of 52.7%.
Oregon State University scientists tap into the capability of ferromagnetic iron oxide nanoparticles to detect chemicals with sensitivity and selectivity. These ferromagnetic iron oxide nanoparticles can be incorporated into a system of ICs to instantly display the findings.
Samsung Electronics in 2010 recaptured the top spot from Nintendo as the largest buyer of MEMS sensors for mobile phones and other consumer electronics, while Apple Inc. grabbed second place to move within striking distance of number 1, according to new research from Jérémie Bouchaud of IHS iSuppli.
University of Michigan engineers have developed a vibration energy harvester with high-quality piezoelectrics built using silicon micro-machining processes that would allow high-volume production. The harvester could operate wireless sensor networks in factories for 20+ years without maintenance.
Slightly above average growth rates in 2011 will lift sales of optoelectronics, sensors and actuators, and discrete semiconductors to new record-high levels again this year, thanks to growth in MEMS and LED markets, says IC Insights.
Robert Bosch GmbH (Bosch), one of the top 4 MEMS suppliers, has standardized on an enhanced custom/analog flow based on Virtuoso v6.1 technology from Cadence Design Systems Inc.
Camtek received a follow-on order for its new Gannet automatic optical inspection (AOI) system from a leading Asian integrated device manufacturer (IDM) for the application of CMOS image sensor inspection.
SSSM100 is a tiny analog output CMOS MEMS microphone manufactured under standard CMOS process and wafer level packaging (WLP) technology.
SB Microsystems, specializing in the design, simulation, prototyping, and testing of microfluidic devices and micro electromechanical system (MEMS) fabrication, is now certified as COMSOL Multiphysics experts.
DelfMEMS has delivered custom RF MEMS samples to telecom operator NTT DOCOMO. DelfMEMS provided arrays of custom MEMS ohmic switches to enable tunability into RF FEM for mobile applications. Voltage, size, losses, isolation, ultra-fast switching time and power handling will be evaluated by NTT DOCOMO.
SolMateS received investments for the final development of the PiezoFlare 1200 piezoelectric thin film deposition machine. PiezoFlare 1200 is an automated deposition system for PZT thin films on 6" or 8" wafers, based on pulsed laser deposition.
Crystals and MEMS are used in electronic components as the basis of oscillators. Both are popular in consumer electronics devices like smartphones. Crystal growth was significantly interupted by the major March 11 earthquake off the coast of Sendai, Japan. MEMS, on the other hand, seem to have escaped the disaster largely unscathed, show 2 new reports from IHS iSuppli.
STMicroelectronics (NYSE: STM) launched a complete hardware solution for advanced sensing applications with 10 degrees of freedom. A set of 3 thin, high-performance MEMS sensors provides accurate and comprehensive information on linear, angular, and magnetic motion together with altitude readings.
Optics Balzers is offering a portfolio of patterning technologies for producing high-grade optical components. Depending on the application, patterning techniques such as photolithography, laser ablation, or masked coatings are available.
Dolomite and Sphere Fluidics established a collaboration, wherein Dolomite will help bring Sphere Fluidics microdroplet technologies to market faster. Dolomite expects to gain new capabilities via the partnership.
The MEMS Industry Group (MIG) is organizing the inaugural "MEMS in the Machine" DemoZone at SEMICON West, sharing compelling examples of MEMS in action.
The MF3 Microfluidics Consortium, which includes Philips, STMicroelectronics (STM) and others, recognizes a need for standards in how microfluidic chips are connected to systems. Since microfluidics perform diverse tasks, three main interconnect types were identified.
Analog Devices Inc. (ADI) released the ADXL206 high precision, low power, dual-axis iMEMS accelerometer with signal conditioned analog voltage outputs. Instead of using additional temperature compensation circuitry, ADI's design techniques ensure that high performance is built in.
Sunrise Optical LLC debuted the Zebraoptical low coherence fiber optic interferometer with microscope attachment. The Zebraoptical Integrated Metrology Tool (ZIMT) provides metrology readings on micro electromechanical system (MEMS) wafers.
Newport Corporation, lasers and photonics technology provider, introduced the Laser µFAB tabletop laser microfabrication workstation for researchers. Equipped with submicron resolution and a large stage, the tool can perform polymerization and ablation for MEMS, microelectronics, and other applications.
STMicroelectronics (NYSE: STM) will bump up its MEMS production capacity to more than 3 million sensors a day by year's end. The capacity ramp is being supported by a "beefed-up manufacturing machine," said Benedetto Vigna, group VP and GM of ST's MEMS, Sensors and High Performance Analog Division
Specialty foundry TowerJazz will collaborate as a manufacturing partner with Singapore's Institute of Microelectronics (IME) on MEMS, packaging and ASICs. This marks another notch in TowerJazz's Asia expansion, which includes new China offices and a potential fab buy in Japan.
The sensors industry will be worth $91.5 billion in five years, according to BCC Research. While the largest segment -- image, flow and level sensors -- will see 8.5% CAGR, biosensors and chemical sensors will see the fastest market growth at 9.6% CAGR.
Nanoelectronics is not only about smaller transistors and more complex chips, it's about a whole new world of opportunities and solutions to major societal challenges, underlined imec president/CEO Luc Van de hove, in his opening keynote at imec's annual International Technology Forum this week in Brussels.
Catalan Institute of Nanotechnology Professor Adrian Bachtold and his research group created resonators from nanoscale graphene and carbon nanotubes (CNT) that exhibit nonlinear damping. This result could lead to supersensitive detectors of force or mass.
The MEMS Industry Group welcomed Frauhofer Institute for Silicon Technology to its membership. The research facility focuses on microelectronics and microsystems technology. Siconnex, which builds diverse MEMS fab equipment, also joined the association.
Consumer and mobile MEMS devices will see record revenue growth in 2011, thanks to higher MEMS content in smartphones and tablets, as well as increased smartphone/tablet adoption. New MEMS devices coming on the scene promise continued growth.
CellGuide selected Baolab's 3D NanoCompass IC technology as a companion to its location and positioning products, fully integrating GPS and compass functionalities in the CLIOX-C. The nanoscale MEMS manufacturing technique used for the NanoCompass supports high-volume, space-constrained applications.
Benedetto Vigna, group VP and GM of ST Microelectronics' MEMS, Sensors, and High-Performance Analog Division, will keynote the iNEMI MEMS workshop.
poLight will work with SVTC Technologies to optimize its TLens production process for large volumes.
SPTS Technologies received an order for an Omega deep reactive ion etch (DRIE) process module from an Asian MEMS foundry. This marks SPTS' 900th DRIE tool sold.
NanoInk's NanoFabrication Systems Division will deliver an NLP 2000 nanofabrication system to West Virginia University's Multifunctional and Energy Ceramics Laboratory for research on developing micro-sensors based on complex nanomaterials and nanocomposites.
Jérémie Bouchaud, IHS, reports on motion sensing MEMS growth through 2015, including new motion sensors to be integrated into smartphones and tablets. These devices are driving a sales boom for MEMS sensors.
The Entrepreneurship Innovation Center at Lorain County Community College in Ohio hosted a groundbreaking ceremony today for its Richard Desich SMART Commercialization Center for Microsystems.
Turkey's Roketsan Missiles Industries Inc. ordered Goodrich (NYSE:GR) SiIMU02 inertial measurement units (IMU) for precision guidance tasks on Roketsan's new CIRIT 70mm laser-guided missile for attack helicopters.
Silicon magnetic sensors are riding an upswing in automotive production and the expansion in tablet/smartphone adoption to 23.7% revenue growth in 2011, according to IHS iSuppli. This amounts to $1.46 billion in revenue.
Nanostart AG (OTCQX:NASRY) is progressing in its planned stake increase in Microlight Sensors, now holding 31% of the optical sensor maker.
MicroVision Inc. (Nasdaq: MVIS) secured a committed equity financing facility, wherein it can sell Azimuth Opportunity Ltd. up to $35 million of its shares of common stock over a 24-month period.
MIT researchers have constructed a piezo-MEMS energy harvester using a bridge design rather than a cantilever. The bridge allows a wider frequency range to generate electricity, and keeps the piezoelectric material to a single layer.
Micro-cantilevers can measure lipid bilayers interactions with surfactants with a new level of sensitivity, say Rice University researcher Sibani Lisa Biswal and Kai-Wei Liu, a graduate student. Applications range from better detergents to buckyball/cell interaction research, to investigations of how viruses penetrate cells.
Based on COMSOL Multiphysics simulation software, the new COMSOL Inc. Microfluidics Module enables users to study microfluidic devices and rarefied gas flows. The module is designed for microfluidics and vacuum researchers and engineers.
As smartphones usher in a host of new high-volume MEMS applications, semiconductor and electronics roadmaps are paying serious attention to the manufacturing and costs gaps in MEMS production. NIST's Michael Gaitan and the MEMS Industry Group are helping shape iNEMI, ITRS roadmaps with MEMS in the spotlight.
SEMICON West preview: Rapid growth in mainstream consumer markets is changing the structure of the MEMS industry from an artisanal to a volume manufacturing business -- creating a new set of challenges and opportunities to companies to find better ways to speed the production ramp, find better ways to integrate multiple die and software, and to find the right business models.
University of Pennsylvania researchers formed biological molecules connected to electrodes, paving the way for direct biological integration into electronic circuits. The team also developed a new microscope technique to measure the electrical properties of these constructs.
Oxford Instruments debuted the PlasmaPro Estrelas100 deep silicon etch technology for the MEMS R&D and fabrication market. The tool is designed to be flexible, accomodating multiple processes without changing chamber hardware, and multiple wafer sizes for R&D-to-production ramp.
A major test house in Asia will install Multitest's InCarrier loader/unloader, InStrip, and InMEMS module for accelerometer MEMS test.
The US Court of Appeals for the Federal Circuit affirmed that MemsTech's importation and sale of certain MEMS microphone packages infringes Knowles Electronics LLC's US Patents 7,242,089 and 6,781,231.
Boston Micromachines Corporation (BMC) will use a $1.2M NASA award to expand on an existing NASA project to develop fault-tolerant microelectromechanical deformable mirror (MEMS-DM) arrays and smaller, lower-power drive electronics.
Moog acquired Crossbow Technology for its innovative MEMS technology, which will complement Moog's controls products. The purchase price was $32 million.
Omron's Micro Device Division (MDD) will release numerous MEMS products in the coming year, notably an absolute pressure sensor for high-accuracy navigation and a thermal IR sensing array for smart buildings and appliances.
In 2016, about 150 million systems will be installed in vehicles, containing over 830 million MEMS chips, says ABI Research. The growth is thanks to more MEMS in each safety or performance device, as well as government and consumer demand for new cars with integrated safety features.
Fraunhofer Institute for Microelectronic Circuits and Systems IMS developed a gas-based etch step that allow MEMS designers to use a wider range of materials for the functional layer, while preventing device damage during etch.
The US National Institute of Standards and Technology's (NIST) Center for Nanoscale Science and Technology (CNST) has improved atomic force microscopy (AFM) by replacing the microscope's optical instrumentation with a nanomechanical cantilever probe and nanophotonic interferometer on a chip.
A major consolidation is coming to the industrial MEMS market in the next 12-18 months, predicts Frankfurt Partners. The industrial MEMS market is both highly attractive and highly fragmented.
NanoInk's NanoFabrication Systems Division is launching a force sensor and levelling devices at the Nanotech Conference and Expo, part of TechConnect World. NanoInk will also be presenting on Dip Pen Nanolithography (DPN) advances.
Kaiam closed its Series B investment round with over $5 million. TriplePoint Capital, which led the round, cited Kaiam's MEMS-based optical integration as "applicable as much for high-end high-capacity data transport as for low cost FTTH applications."
Taiwan's Industrial Technology Research Institute (ITRI) will install more EV Group (EVG) wafer bonding tools to research and develop advanced manufacturing processes for next-generation micro electro mechanical system (MEMS) devices, especially on 200mm wafers.
SEMICON West preview: Companies are scrambling for a piece of the growing market of MEMS microphones for mobile phones, where applications are widening and demands are getting more sophisticated.
STMicroelectronics (NYSE:STM) debuted "FingerTip" technology, which enables a single-chip solution for capacitive touchscreens up to 10" diameter with multi-touch capability. FingerTip shares STM's MEMS sensors methodology: a sensing element connected to a high-performance capacitance-sensing circuit.
X-FAB Silicon Foundries released ready-to-use design IP blocks for MEMS accelerometers, as part of its MEMS foundry service offerings. The IP blocks can be used in gyroscopes and accelerometers spec'd up to 100 G-force, shortening NPI and HVM ramp.
CMSF Corporation (OTCBB:CMSF) will merge with Plures, which, through its 95%-owned subsidiary, Advanced MicroSensors Corporation, is a semiconductor foundry developing and fabricating high-quality, high-margin MEMS and spintronics products.
Wrap-up of what we heard and saw at SEMICON West 2010. Lesson 5: Interest was overflowing for high-growth areas outside traditional CMOS: MEMS, LEDs, solar. And the industry really can reach everywhere around us.
Jay Esfandyari, Roberto De Nuccio, Gang Xu, STMicroelectronics, introduce how MEMS gyroscopes work and their applications, the main parameters of a MEMS gyroscope with analog or digital outputs, practical MEMS gyroscope calibration techniques, and how to test the MEMS gyroscope performance in terms of angular displacement.
Dan Siewiorek, Karen Lightman, Rich Duncombe, Vida Ilderem, and other speakers from the MEMS industry shared their visions for the future at the MEMS Executive Congress 2010. Following are summaries of their talks, from the "iPhone 20" lifetime smart-companion to seisic imaging developments, energy management, and more MEMS opportunities.
Driven by the rapid recovery in automotive production and inventory rebuilding among sensor component suppliers, the market for automotive microelectromechanical system (MEMS) sensors will expand to record size in 2010, according to market research firm iSuppli, now part of IHS.
Scientists involved in the European Union's "Smart inspection systems for high-speed and multifunctional testing of MEMS and MOEMS" (SMARTHIEHS) project are developing a new test concept based on parallel inspection of devices at wafer level.
InvenSense released its MPU-6000 product family. The MPU-6000 MEMS motion sensing technology integrates a 3-axis gyroscope and a 3-axis accelerometer on the same silicon die together with an onboard Digital Motion Processor (DMP) capable of processing complex 9-axis sensor fusion algorithms.
Kionix Inc. announced a portfolio of MEMS inertial sensors featuring 3 new accelerometers that set company benchmarks for low power, performance over temperature, and user programmability. Kionix also released its first two gyros for mass-market consumer applications.
The Microelectronics Research Center of the University of Texas at Austin increased its facility capabilities by installing a Plasma-Therm VERSALINE DSE system. The addition of leading deep silicon etch technology enables process advances in MRC’s micro, nano and opto-electronics research.
iSuppli MEMS analyst Richard Dixon takes a closer look at what's driving the market for MEMS sensors in automotive applications (hint: safety and China), new applications and market shifts, and the long-awaited arrival of consumer-oriented suppliers.
The University of Michigan College of Engineering will present Packaging for MEMS March 31 to April 1, 2011, in Boston, MA. MEMS packaging is a significant part of product cost. This program highlights what to consider in developing application-specific packaging that will meet your goals for product performance, durability, and total cost.
iSuppli MEMS analyst Richard Dixon analyzes one of the fastest-growing MEMS sectors today: "high-value" technologies specifically built for use in industry, medical, energy, and wired telecommunications.
At IEDM, Panasonic and imec discussed components of their lab-on-chip collaboration: miniaturized pump for on-chip generation of high pressures, a micropillar filter optimized for DNA separation achieving record resolution, and a SNP detector allowing on-chip detection using very small sample volumes.
Techcet's Michael A. Fury continues his report from IDTechEx's combined Printed Electronics/ PV USA events, with talks about 3D stacked interconnects made from printed inks, printed biosensors for textiles, a disposable explosives-detecting wipe, silicon-organic PV cells, printed rewritable permanent memory devices, and more.
A new laser-beam steering system that aims and focuses bursts of light onto single atoms for use in quantum computers has been demonstrated by collaborating researchers from Duke University and the University of Wisconsin-Madison.
The DNA Medicine Institute (DMI) successfully completed reduced-gravity experiments on its rHEALTH sensor for the 2010 Facilitated Access to the Space Environment for Technology (FAST) program, at NASA in Houston.
Highlighted by their adoption in Apple Inc.’s iPhone 4, microelectromechanical system (MEMS) microphones are set to achieve a more than 50% increase in shipments in 2010 and a fourfold rise by 2014, according to the market research firm iSuppli, now part of IHS Inc. (NYSE: IHS).
Microvisk Technologies, developer of a system to monitor the blood clotting status of patients taking Warfarin, raised £6 million through a rights issue to existing investors in an oversubscribed round. Microvisk has developed a medical diagnostic strip based on MEMS technology.