ap-mems

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Europractice IC Service Expands to MEMS Prototyping

Tue, 3 Mar 2008
(March 11, 2008) CROLLES, France, and LEUVEN, Belgium — Tronics Microsystems SA and IMEC, representing Europractice IC Service, announced today their collaboration to enable Europractice IC Service to add MEMS to its Multi-Project Wafer (MPW) programs. Tronics, a manufacturer of custom MEMS components, is the first technology provider selected by IMEC to support Europractice IC Service's extension of its production portfolio to MEMS.

LSI to Purchase Infineon Hard Drive Semiconductor Business

Mon, 3 Mar 2008
(March 10, 2008) Milpitas, CA — LSI Corp. today announced that it has signed a definitive agreement to acquire the assets and IP of the hard disk drive semiconductor (HDD) business of Infineon Technologies AG, including product designs, related software, inventory, and test equipment. Financial terms are not being disclosed.

Glass for Wafer-Level CSP and Optics

Mon, 2 Feb 2008
The AF 32 glass is designed for leading-edge opto-electronics, image sensor packaging, WLO, and MEMS applications. It matches the CTE of silicon, which helps prevent warp during the manufacture of complex assemblies and during reflow, when a WLCSP imager is attached to a printed circuit board.

IMAPS Workshop Report

Tue, 1 Jan 2002
IMAPS held its third Advanced Technology Workshop on "Packaging of MEMS and Related Micro Integrated Nano Systems" in early November in Scotts Valley, Calif.

Boeing introduces automated MEMS aligner

Tue, 1 Jan 2002
The Boeing Company has engineered a MEMS device and soldering technique that provides rapid and precise alignment of single-mode optical fibers to laser sources, photodetectors and other single-mode optical fibers

Wafer-level MEMS packaging

Mon, 4 Apr 2002
Microelectromechanical systems (MEMS) contain fragile parts that require encapsulation in a hermetically sealed cavity for reasons of protection, reliability and tuning of performance

In the News

Fri, 8 Aug 2003

Acoustic System-on-chips Aim to Revolutionize Sound

Fri, 8 Aug 2003
From the advent of the telephone and the world's first radio broadcast to the development of the electronic hearing aid and the cellular phone, technology has transformed the way people use sound at work, home and play.

New Products

Fri, 8 Aug 2003

MEMS Applications for Scanning Acoustic Microscopy

Sat, 11 Nov 2003
Microelectromechanical systems (MEMS) are finding applications in products or systems that require reliable operation over extended periods of time.

Movers and shakers

Wed, 5 May 2002
Stephan H. Schmidt, general manager, has been elected to the LPKF Laser & Electronics USA (Wilsonville, Ore.) board of directors.

Integrated packaging and testing of optical MEMS

Mon, 4 Apr 2002
Working toward fully integrated solutions

Collaboration Joins Sensor, PCB, and MEMS Companies

Tue, 1 Jan 2007
(January 9, 2007) PITTSBURGH, PA and HSINCHU, Taiwan — Virtus Advanced Sensors, which specializes in MEMS-based sensors, entered into a collaboration agreement with several UMC Group companies including PCB manufacturer Unimicron and affiliated MEMS foundry Chipsense, both based in Taiwan.

Software Strengthens MEMS Performance

Fri, 1 Jan 2007
(January 5, 2007) LONDON — ViaLogy, Boeing, and NASA's Jet Propulsion Laboratory (Pasadena, CA) collaborated to create active-error-suppression software to improve stability of MEMS in harsh environments.

Infotonics Selects SUSS Bonders for MEMS

Wed, 3 Mar 2007
(March 28, 2007) MUNICH, Germany and CANANDAIGUA, NY — Infotonics, a collaborative center of excellence for photonics and microsystems in Canandaigua, chose the SUSS ABC200 wafer-bonding cluster tool and FC150 device bonder as strategic investments for its MEMS packaging laboratory.

SUSS, STS Launch MEMS Show

Fri, 3 Mar 2007
(March 23, 2007) MUNICH, Germany — SUSS MicroTec and Surface Technology Systems (STS) will cohost a MEMS technology showcase, "MEMS Technology: Embracing the Future." The show will debut in Boston on April 20, and include speakers from various aspects of the MEMS manufacturing process.

SEMICON China to Host Advanced Technologies

Mon, 3 Mar 2007
(March 12, 2007) SHANGHAI, China — SEMICON China 2007, March 21–23 in Shanghai, will include CEO forums on wafer processing and test-and-assembly, a discussion of MEMS opportunities, various talks on the logistics of operating in China and in cooperation with China RoHS, and an IC-design suppliers pavilion, in conjunction with the FSA and SICA. Various exhibitors will also highlight cleanroom technologies, advanced automation, and multi-metal compatibilities.

High-accuracy Bonder

Tue, 5 May 2007
The KADETT semi-automatic device bonder, designed for R&D labs, university research, and pre-production environments, performs high-accuracy placement and bonding processes for advanced packaging, MEMS, and other assembly tasks.

Mainstream MEMS MEPTEC's Focus

Tue, 5 May 2007
(May 8, 2007) SAN JOSE, Calif. — MEPTEC's final program for the 5th annual MEMS Packaging Symposium, "MEMS in the Mainstream: $50 Billion and Growing," will include industry, academia, and financial institutions discussing various commercial and volume markets for MEMS, and innovations to fuel a viable MEMS industry. The symposium will occur May 16 and 17 in San Jose.

Unisem Buys AIT

Mon, 5 May 2007
(May 7, 2007) BATAM, Indonesia — Unisem Berhad of Malaysia will purchase Advanced Interconnect Technologies (AIT) of Singapore for approximately $70 million. The acquisition brings Unisem into the advanced packaging and test arena, with BGA, QFN, and flip chip capabilities. AIT will become a full subsidiary.

Consortium Undertakes MEMS, Advanced Electronics

Mon, 8 Aug 2007
(August 13, 2007) LIVINGSTON, Scotland, U.K. — Scotland-based R&D-focused institutions and companies founded a consortium to engage emerging technology companies in MEMS, biomedical, control electronics, remote sensing, and advanced technology sectors. The Institute for System-level Integration (iSLI), the Scottish Microelectronics Centre (SMC), Optocap, and Photonix Limited plan to provide R&D, commercial scaling, and higher-value services to U.K.-based and global industry members.

SEMI Appoints International Board

Fri, 8 Aug 2007
(August 10, 2007) SAN FRANCISCO — Jerry Coder, president emeritus of the semiconductor materials business unit of Dupont Electronic Technologies, was elected by SEMI as chairman of the industry association's International Board of Directors. Coder succeeds Archie Hwang, chairman and CEO of Hermes-Epitek, who served for the past year.

Yole, Chipworks Host Asia Briefing

Wed, 8 Aug 2007
(August 8, 2007) TOKYO — Yole Développement (Lyons, France) and Chipworks, Inc. (Ottawa, Canada), presented their first MEMS market briefing in Asia, with speakers from BOSCH Japan and Silex Microsystems. The event occurred this July at Micromachine 2007 in Tokyo.

Unisem Names Group CEO from AIT

Wed, 8 Aug 2007
(August 8, 2007) KUALA LUMPUR — Unisem Berhad appointed Bruno Guilmart executive director and group CEO, as part of integrating Advanced Interconnect Technologies Limited (AIT) into the SATS company. Ang Chye Hock, formerly president, will assume the role of executive director and group chief operating officer (COO), Unisem.

MEMS Metrology System

Mon, 6 Jun 2007
The DSM200 automated metrology system performs cassette-to-cassette front-to-back alignment for front- to back-side alignment applications, such as MEMS, power semiconductor, and optoelectronics assembly.

MEMS/Nano Software Suite

Mon, 6 Jun 2007
Targeting the MEMS and nanotechnology industries, the IntelliSuite v8.2 software tool for MEMS/nano-device development includes nanostructure design tools to enable carbon nanotube (CNT) and nano-structure use in computing, display, medical, sensor, and related devices.

Molded Ceramic Packages

Tue, 6 Jun 2007
MIL-STD-883-certified hermetic, the molded ceramic surface-mount packages are low profile and target aerospace, avionics, and telecom applications, packaging LEDs, MEMS, and optical devices.

Shaken, Not Stirred: IMAPS N.E. Connects to Bond Theme

Tue, 5 May 2007
By Meredith Courtemanche, assistant editor

IMAPS New England, May 1st in Boxborough, MA, was a regional show with a national feel — a strong technical program, about 70 exhibitors, and approximately 450 attendees checking out booths and listening to detailed keynotes and presentations. The show included a new vendor workshop on the exhibit floor and a Bond, James Bond theme complete with playing cards, tuxedos, and an energetic environment.

MEMS Roadshow Highlights 300-mm Technologies

Fri, 4 Apr 2007
By Françoise von Trapp, managing editor

MEMS technology spans the entire semiconductor industry, with wafer processes through test, assembly, and packaging. As these micro-sized devices involve delicate structures, processes continue to evolve to address the complexities of MEMS manufacturing. SUSS and STS joined forces to present a U.S.-based roadshow "MEMS Technology: Embracing the Future," to share developments that are bringing manufacturing processes into the 300-mm range.

Getter Services for MEMS WLP

Fri, 4 Apr 2007
(April 20, 2007) SANTA BARBARA, CA — Innovative Micro Technology (IMT) began offering getter deposition services of wafer-level packaging (WLP) of MEMS devices, and other components requiring a hard vacuum. In testing, IMT reportedly demonstrated vacuum levels below 10 mTorr for inorganic devices — equal to or better than industry standard.

March Book-to-Bill Even

Fri, 4 Apr 2007
(April 20, 2007) SAN JOSE, CA — North America-based semiconductor equipment manufacturers posted $1.42B in orders and billings in March, generating an even book-to-bill of 1.00, according to SEMI's monthly book-to-bill report. Bookings improved slightly while billings remained at February levels. The book-to-bill had dropped slightly below parity in February at 0.98.

Major MEMS Manufacturers Dominate Market Share

Thu, 4 Apr 2007
(April 19, 2007) LYON, France — Yole Développement compiled a list of major MEMS manufacturers globally, market drivers, and industry shifts in "Analysis: Top 30 MEMS Manufacturers." The top 30 represent 88% of the total MEMS industry, with $5.2B in 2006 sales. Minimum sales in the top ranking grew to $26 million, up from $15 million in 2005. Yole noted that military MEMS business is difficult to track, and may represent a larger portion of the industry than predicted.

IEEE Recognizes Fraunhofer's Reichl

Wed, 4 Apr 2007
(April 18, 2007) BERLIN — The IEEE components, packaging, and manufacturing technology (CPMT) society — an international forum for scientists and engineers in microsystems packaging design and manufacture R&D and development — named professor Herbert Reichl, director of Fraunhofer IZM, recipient of its electronics manufacturing technology award.

Tronics Expands MEMS Capabilities

Wed, 4 Apr 2007
(April 18, 2007) CROLLES, France — Tronics Microsystems SA expanded its characterization, assembly, packaging, and testing capabilities with additional space and tools. The expansion will support design-to-manufacturing services, and support its MEMS device supply chain.

SEMI Lowers Early 2007 Book-to-Bill Estimates

Wed, 4 Apr 2007
(April 18, 2007) SAN JOSE, CA — SEMI released corrections to its January and February book-to-bill estimates for the North America semiconductor equipment manufacturing industry, lowering the ratios to 1.00 and 0.98, respectively. SEMI blames a data-input error for the incorrect averages initially reported.

SPP Adds to MEMS Equipment Holdings

Thu, 6 Jun 2007
(June 28, 2007) AMAGASAKI, Japan — Sumitomo Precision Products Co. Ltd. (SPP) completed its acquisition of Primaxx, Inc., adding MEMS etch-release equipment to its businesses. SPP holds majority stake in Surface Technology Systems plc (STS) and considers Primaxx equipment complementary to STS's advanced deep silicon etch and deposition technologies. Primaxx plans to develop its MEMS business under SPP, as well as venturing into related fields, such as wafer-surface modification.

Analysts Probe RF Developments, End Markets

Wed, 6 Jun 2007
(June 27, 2007) LYONS, France and CAMBRIDGE, U.K. — Yole Développement will release a report on the RF MEMS switches market in July, outlining market potential in defense, industrial, automotive, and telecom applications. The report is in-line with forecasts by IDTechEx regarding end markets for RFID components, including medical, defense/aerospace/military, and telecom.

Collaborative Focus on MEMS Forecasts

Fri, 6 Jun 2007
(June 22, 2007) LYON, France and OTTAWA — Chipworks and Yole Développement signed an agreement to collaborate on in-depth business and technical analysis for the MEMS industry. Chipworks, which provides reverse engineering and technical analysis of semiconductors and microelectronic systems, will supplement Yole's market research and business development data.

Database Targets MEMS Manufacturability

Tue, 6 Jun 2007
(June 19, 2007) MATERIALS PARK, OH — ASM International released its MEMS Materials Database: Packaging Module, a licensed database containing mechanical, physical, processing, and component data for materials selection in MEMS packaging. The database targets improvements to time-to-market, reliability, and design and manufacturing of MEMS devices.

Consumers, Integration Dictate Future of MEMS, 3-D Packages

Wed, 1 Jan 2007
(January 24, 2007) LYON, France and PITTSBURGH — The future of MEMS and 3-D packages relies on similar factors — consumer drivers and increased integration — according to industry analysts. 3-D integration will affect MEMS and IC packaging industries, says Yole Développement's "3-D ICs." Advanced packages require acceptance from the consumer market to reach targets for technological advancement, commercialization, and sector revenues.

Endevco Appoints MEMS Business Manager

Fri, 1 Jan 2007
(January 19, 2007) SUNNYVALE, CA — Endevco Corporation, a Meggitt group company, named Jennifer MacDonell MEMS business manager, with responsibility for the MEMS research and production facility in Sunnyvale.

Emerging MEMS Manufacturers Look Beyond Auto Apps

Wed, 9 Sep 2007
(September 12, 2007) PHOENIX — The MEMS market is an attractive area to operate in, according to Semiconductor Partners, because MEMS revenue will double from $5B in 2005 to $10B in 2011. "Driving MEMS Beyond Automotive," suggests that a "select group of large, well-established MEMS suppliers" will benefit from growth in the automotive sector, while "new, emerging entrants" to the MEMS market will capitalize on opportunities in consumer, communications, and portable product sectors.

tMt Installs Alcatel DRIE Tool for MEMS Fab

Mon, 9 Sep 2007
(September 10, 2007) TAIPEI, Taiwan — Alcatel Micro Machining Systems (Annecy, France) shipped an advanced deep reactive ion etch (DRIE) production tool to Touch Micro-system Technology (tMt — Yang-Mei, Taoyuan, Taiwan), allowing the MEMS foundry to begin producing advanced MEMS devices, including micro mirrors, silicon microphones, and gyroscopes.

MEMS Show Travels to Europe

Tue, 9 Sep 2007
(September 4, 2007) MUNICH, Germany — SUSS MicroTec and Surface Technology Systems (STS) will bring their "MEMS Technology: Embracing the Future" Roadshow to Europe in September, following a five-city tour in the U.S. this April. The Roadshow event features presentations from SUSS, STS, Primaxx, and XACTIX, covering trends in wafer bonding, wafer-level test, and other manufacturing steps.

Alcatel Supplies Next-gen DRIE for STMicro

Tue, 9 Sep 2007
(September 5, 2007) ANNECY, France — STMicroelectronics SAS (Tours, France), a division of STMicroelectronics NV Group, ordered the AMS 4200 DRIE production tool from Alcatel Micro Machining Systems. STMicro will use the tool for deeper advanced etching to realize 3D semiconductors and integrated MEMS packages.

Redshift Systems Partners with IMT to Develop Next-gen Thermal Imaging Device

Thu, 9 Sep 2007
(September 20, 2007) BURLINGTON, MA— RedShift Systems, provider of next-generation thermal imaging solutions, will join forces with MEMS manufacturer,Innovative Micro Technology (IMT) to produce a solid-state, passive optical component that shifts long-wavelength thermal infrared radiation to visible light to allow standard CMOS and CCD digital cameras to "see heat."

Analysts Weigh In

Tue, 4 Apr 2007
As 2007 progresses, analysts are examining the past and future for electronic components and advanced technology applications. Following are summaries of reports from iSuppli, Henderson Ventures, Yole Développement and SEMI, and In-Stat, covering MEMS, NAND and NOR flash, SoC, and other technologies.

AOI for MEMS

Tue, 2 Feb 2007
The Falcon 600 automated optical inspection (AOI) system targets MEMS and other special applications for the semiconductor manufacturing and packaging industries. The model targets applications that require special handling and inspection capabilities, such as optoelectronic devices, MEMS, wafer-level packaging (WLP), and glass substrates.

MEMS Reaching Broader Industries

Wed, 2 Feb 2007
(February 14, 2007) SCOTTSDALE, AZ — The commercial use of MEMS and nanotechnology ranges from display, gyro-sensor, and ink-jet printing to smart-RFID, RF-MEMS, and wireless-sensing sectors; this technology expansion is creating competitive and converging applications for MEMS devices, according to Bourne Research. The research firm released seven market briefs outlining the dynamics of MEMS and nanotechnology in emerging applications.

MEMS Lab to Use SUSS Bonders

Thu, 2 Feb 2007
(February 8, 2007) MUNICH, Germany — SUSS MicroTec will supply advanced wafer-bonding equipment to the University of Juarez (UACJ), Mexico, for MEMS research and hybrid packaging developments.

Austrian Semiconductor Manufacturer Installs Fouth EVG Aligner

Thu, 10 Oct 2007
(October 9, 2007) ST. FLORIAN, AUSTRIA — EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, announced the installation of its fourth IQ Aligner System for packaging applications at a major semiconductor manufacturing facility in Austria. This purchase reportedly strengthens the customer's capacity for wafer-level packaging of MEMS and display devices.

Alcatel Receives DRIE Cluster Tool Order

Thu, 10 Oct 2007
(October 4, 2007) ANNECY, FRANCE— Alcatel Micro Machining Systems, a supplier of deep silicon etching equipment (DRIE) for MEMS and 3D semiconductors, has received an order for its AMS 4200 DRIE multi-chamber production tool from Boehringer Ingelheim microParts GmbH to increase volume production of MEMS micro-nozzles for Respimat inhaler.

ISSYS Receives NSF Grant to Develop Wafer-level, Hermetic, Hybrid Integration of MEMS and Electronics

Thu, 10 Oct 2007
(October 4, 2007) YPSILANTI, MI— Integrated Sensing Systems, Inc. (ISSYS) was awarded a Phase II Small Business Innovation Research contract from the National Science Foundation (NSF). The 2-year project, "Wafer-Scale, Hermetic, Packaging of MEMS-Based Systems," is aimed towards development of a novel packaging method to simplify the packaging of MEMS and their associated electronics.

STMicroelectronics' Next-generation MEMS Motion Sensors Meet Demand

Tue, 10 Oct 2007
(OCTOBER 2, 2007) GENEVA — STMicroelectronics, manufacturer of MEMS devices, have introduced next-generation 'nano' three-axis linear accelerometers to meet the demand for miniaturized motion-sensing solutions in the consumer and industrial markets.

Micropelt Introduces MEMS-based Thermoelectric Cooler Technology

Thu, 8 Aug 2007
(August 30, 2007) FREIBURG, GERMANY — Micropelt GmbH, manufacturer of thin film thermoelectric devices, introduced a technology advancement in its ultra-small, microchip thermoelectric coolers (TECs) that is expected to open possibilities for laser and photonic sensor manufacturers whose applications require a large bandwidth of thermal control.

Discera Qualifies MEMS Oscillators

Mon, 8 Aug 2007
(August 27, 2007) SAN JOSE, CA — Discera, Inc., qualified its MEMS-based oscillators with a series of frequency-stability and standard semiconductor qualification and reliability tests, comparing the silicon-based MEMS resonators to quartz for timing devices. Discera tested three separate manufacturing lots to prove process consistency in high-volume production, said Venkat Bahle, VP of marketing, Discera.

RF Integration — A Paradigm Shift

Fri, 8 Aug 2007
By Per Vicklund, Mentor Graphics

The character of RF design has changed quite dramatically in the past few years. It's quite rare that RF designs are isolated pieces of circuitry, but rather part of a much bigger context. RF designs today typically are much larger and much more complex. They are multi-technology designs consisting of multiple RF modules integrated with high-speed digital, analog, power, and bias networks, all on the same dense circuit board.

Photovoltaic Show Highlights Product Intros

Fri, 8 Aug 2007
(August 24, 2007) MILANO, Italy — The 22nd European Photovoltaic Solar Energy Conference, September 3–7 in Milano, will feature an increased presence of electronics materials companies launching products targeting the photovoltaics market. Following are the introductions Cookson and Indium plan for the show.

Movers and shakers

Wed, 8 Aug 2001
Etalon, a division of Piezo Technologies (Indianapolis), has hired Andreas Hadjicostis to head up its engineering development group

Wafer-scale Encapsulation: Controlling MEMS Packaging Costs

Sun, 12 Dec 2002
Microelectromechanical systems (MEMS) technology quickly made the transition from innovative concepts to practical demonstrations and on to early products.

Automated MEMS assembly

Sun, 9 Sep 2002
Design and process issues in optoelectronics

Lasers package ultrathin semiconductors at low cost, high volume

Wed, 10 Oct 2011

North Dakota State University, Fargo, researchers have developed a packaging technology using Thermo-Mechanical Selective Laser Assisted Die Transfer (tmSLADT) to reduce the size and cost of microelectronics packages.


TSV electroplating dev team unites SVTC, Amerimade Technology, Shanghai Sinyang Semiconductor Materials

Wed, 10 Oct 2011

Nanotech accelerator SVTC Technologies, wet chem equipment maker Amerimade Technology, and chemicals company Shanghai Sinyang Semiconductor Materials will collaborate on electroplating processes for TSV that are production-ready for advanced packages and MEMS.


Thin wafers win majority in electronics by 2016

Thu, 10 Oct 2011

Thanks to MEMS, 3D packaging, LEDs, power devices, and other applications, thinned wafers will be the majority of wafers in the market by 2016, according to Yole D

Embedded RF Component and Devices in 3D LCP Package, Part 2

Thu, 8 Aug 2008
Laminated Thin Film Resistors on LCP
By Swapan K. Bhattacharya, Stephen Horst, and John Papapolymerou, Georgia Institute of Technology
Embedded resistors are generally implemented with either thick- or thin-film processes. Thin-film processes use a variety of metal alloys usually deposited by sputtering process under vacuum An alternative to this approach involves the use of commercially available resistive films on a carrier conductive copper foil.5-8

EV Group Reports Continued Growth

Thu, 11 Nov 2008
(November 20, 2008) ST. FLORIAN, Austria,— Crediting the continued demand in the 3D interconnect interconnect/through-silicon via (TSV) an nanoimprint lithography markets, EV Group reports an increase in revenue for 2008 of more than 15%. Despite the current global economic slowdown, the company says it remains cautiously optimistic about its outlook for 2009 given the expected growth opportunities to ensue as these novel technologies gain market acceptance/penetration.

IMAPS International 2008 In Review

Mon, 11 Nov 2008
By Gail Flower, Editor-in-Chief
This year's IMAPS International Symposium had great international participation, good attendance and excellent presentations from keynoters to the technologically cutting-edge educational papers. It was election day when the IMAPS conference began, and by the second day of the conference, a new president entered the picture. Therefore, the first day proceeded without a rush of attendees as expected, but the second perked up with lively conversation.

Countdown to SEMICON West: Exhibitor Preview

Mon, 7 Jul 2008
(July 7, 2008) SAN FRANCISCO, CA — With SEMICON West 2008 just one week away, July 15-17,at the Moscone Center, San Francisco CA, exhibitors are getting the word out to make sure attendees don't miss a thing. While SEMI has a full-line up of conferences, keynotes, and workshops planned, many exhibitors will be leveraging the venue to announce new processes, technologies, products, and more.

MEPTEC Symposium Highlights MEMS Evolution

Tue, 6 Jun 2008
By Julia Goldstein, Ph.D., contributing editor
(June 3, 2008) SAN JOSE, CA — When Advanced Packaging magazine covered MEPTEC's first MEMS Symposium in 2003, MEMS was a technology with potential that needed to move from a technology-driven to a market-driven approach to succeed commercially. This year's symposium on May 22, 2008 was subtitled "MEMS Market Evolution — From Technology Push to Market Pull," suggesting that the potential has been realized.

electronica 2008 to Showcase on Micro and Nanoelectronics

Fri, 6 Jun 2008
(June 25, 2008) MUNICH, Germany — Microelectronics is a driving force behind innovation for industries such as automotive, biomedical technology, telecommunications, automation technology, environmental engineering and building technology. Micro-nano systems have become so important that electronica 2008 will dedicate a focus area to sub-miniature electronics. Exhibitors will display micro-nano products for automotive, consumer, medical and environmental applications.

Photonic Interconnects Enable the Continuation of Moore's Law

Tue, 11 Nov 2008
By Fran

Automatic Wafer Inspection

Tue, 10 Oct 2008
Viscom AG has broadened its platform into the semiconductor market with the introduction of the MX20000IR fully automatic wafer inspection system. The application scope of the system includes MEMS, wafer bonds, flip chip and photovoltaics. Wafers can be composed of various materials including silicon, gallium arsenide, aluminum oxide or III-IV composites, and others.

RF Components and Devices in 3D LCP Package

Mon, 8 Aug 2008
Part 1: Embedded Actives
By Swapan K. Bhattacharya, Chad Patterson, and John Papapolymerou, Georgia Tech
As real estate in electronic packages has been compromised in the Z direction, thin has become the buzz word — encompassing die, dielectric, passives, and ultimately resulting in thin packages. This series of articles will overview trends from thick to thin packages with embedded RF passive and active components.

Plasma Etching/Cleaning System

Mon, 8 Aug 2008
The PE-200-RIE Convertible, from Plasma Etch, is a convertible RIE configuration of the companies PE-200 plasma etching/cleaning system. Designed for anisotropic etching of nitrides, oxides, and polyimide, the system features a 13

Tessera Acquires IP Rights from Kronos

Fri, 4 Apr 2008
(April 4, 2008) San Jose, CA and Belmont, MA— Tessera Technologies, Inc. provider of miniaturization technologies for the electronics industry, and Kronos Advanced Technologies, Inc. developer of ionic- based products and technologies for air movement and purification, announced the sale and licensing of certain intellectual property (IP) rights related to Kronos proprietary technologies to Tessera.

3D Packaging Technologies Steal the Show at IMAPS

Tue, 4 Apr 2008
By Fran

Tegal to Acquire Alcatel Micro Machining Systems Product Line

Fri, 9 Sep 2008
(September 5, 2008) PETALUMA, CA — Tegal Corporation announced an agreement with Alcatel Micro Machining Systems (AMMS) and Alcatel-Lucent to acquire their deep reactive ion etch (DRIE) and plasma-enhanced chemical vapor deposition (PECVD) products, and the related intellectual property. The addition of these capabilities to Tegal's plasma-etch and deposition systems will reportedly enable Tegal to further expand into MEMS and 3D wafer level packaging applications.

From the Advisory Board

Mon, 9 Sep 2008
Temperature Stabilization for MEMS Devices
By Seri Lee, Ph.D., Nextreme Thermal Solutions
Advances in thin-film thermoelectrics enable novel temperature stabilization for applications in MEMS packaging. As the electronics industry moves towards smaller packaging form factors and higher heat densities, non-uniform thermal conditions can directly affect the performance and reliability of MEMS devices.

Wafer Bond Cluster Tool

Mon, 9 Sep 2008
Designed for advanced MEMS manufacturing and 3D wafer bonding, the CBC200 from SUSS MicroTec is a fully-automated, wafer bond cluster with up to 90 kN bond force and 600°C thermal capacity. These features are said to enable die size and cost reduction for MEMS devices. Additional features include post-bond alignment accuracy for metallic bonds to 1.25µm and cluster design concept and software for 24/7 production.

International Wafer-Level Packaging Conference (IWLPC) Finalized

Wed, 7 Jul 2009
(July 22, 2009) MINNEAPOLIS — The 6th Annual International Wafer-Level Packaging Conference (IWLPC), October 27-30, 2009, Santa Clara, CA includes tutorials, expert panel discussions, Dr. Rao Tummala keynoting, and 18 tech sessions.

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Mon, 2 Feb 2009
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MEMS, 3D packaging major factors in iNEMI roadmap

Tue, 8 Aug 2011

The 2011 iNEMI Roadmap, published by the International Electronics Manufacturing Initiative (iNEMI), includes a new chapter on MEMS and sensors, and an expanded chapter on packaging to include substrates discussions.


Hermetic wafer level packaging lowers cost with IMT Au Au bond

Tue, 3 Mar 2011

IMT introduced its hermetic gold-to-gold (Au-Au) thermo compression bonding for wafer-level packaging (WLP). In development for nearly a year, this bond is being actively used in production.


The road ahead for SiPs

Tue, 2 Feb 2011
With the proper up-front evaluation of SiP designs, a tool box of enabling technologies, and strong team interactions between all involved parties, SiP solutions can enable novel electronic products with faster time to market than would be possible with traditional scaling. Darvin Edwards, Masood Murtuza, Texas Instruments, Dallas, TX USA

Hesse & Knipps discusses wedge bonding for RF and microwave devices at workshop

Wed, 1 Jan 2012

Hesse & Knipps Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Wedge Bonding for RF and Microwave Devices" at the Advanced Technology Workshop and Tabletop Exhibition on RF and Microwave Packaging


Upcoming SMTA events: IWLPC keynote named, SMTAI seeks presenters

Tue, 1 Jan 2012

The SMTA released its call for presenters for SMTA International (SMTAI) 2012, October 14-18 in Orlando, FL. The association, along with Chip Scale Review magazine, also announced the keynote for the International Wafer-level Packaging Conference (IWLPC), held November 5-8, San Jose, CA.


Advantest to expand beyond semiconductor test

Thu, 1 Jan 2012

Haruo Matsuno, president and CEO of Advantest Corporation (TSE:6857, NYSE:ATE) shares the company's major goals, including expansion into new measurement applications, utilization of cloud computing, and more.


DRIE expands from MEMS to advanced packaging and more applications

Tue, 5 May 2012


CEA Leti adds SPTS on 3D IC line with 300mm PVD order

Wed, 2 Feb 2011

SPP Process Technology Systems (SPTS) received a follow-on purchase order from CEA-Leti for its Sigma fxP PVD system. The 300mm system will be used for advanced TSV development at Leti's new 300mm fab extension in Grenoble.


RF MEMS packaging collab DelfMEMS KFM

Tue, 2 Feb 2011

DelfMEMS and KFM Technology signed a common agreement to combine their expertise in RF micro-electro-mechanical systems (MEMS) and thin film packaging (TFP) technology. DelfMEMS will use the collaboration to provide packaged MEMS switches, fixed capacitors, and high-Q inductors on the same chip.


22nm: The era of wafer bonding

Tue, 1 Jan 2011

The migration to the 22nm node is about more than just scaling down, it's also about scaling up with thinner devices stacked into a single package -- and these require new manufacturing considerations with wafer bonding playing a central role, writes Bioh Kim from EV Group.


TSV substrates for power amplifiers A*STAR IME partners with ELTA Systems

Mon, 3 Mar 2011

The collaboration will result in new applications in multi-chip modules in radar, communication, and electronic warfare systems. The new technology platform would enable miniaturization of wireless applications that are faster, lighter and can withstand higher temperatures.


Present at ESTC 2012 in Amsterdam

Tue, 2 Feb 2012

Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.


X-FAB Silicon Foundries adopts SFT software

Fri, 2 Feb 2012

X-FAB Silicon Foundries, a More-than-Moore semiconductor foundry, has used SFT's R3D (Resistive 3D) software for its 0.18

3M debuts high-capacitance ECM for IC packaging, RF, other apps

Thu, 2 Feb 2012

3M launched a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced electromagnetic interference (EMI).


3D MID sensor fabricated with Ticona laser-activated LCP circuits

Wed, 1 Jan 2012

2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device flow sensor that uses Ticona's Vectra E840i LDS laser-activated LCP for electronic circuits. The Vectra E840i forms circuits on 3D injection moldings produced with an LDS process.


USPTO seeks nominees for National Medal of Technology and Innovation

Tue, 1 Jan 2012

The USPTO is looking to increase the diversity of honorees for its annual National Medal of Technology and Innovation (NMTI), honoring "this nation's creative geniuses."


AMEC debuts TSV etch tool with Chinese installations

Wed, 3 Mar 2012

Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity TSV etch tool for 200mm wafers.


UMC, ST to develop 65nm backside CMOS image sensors

Mon, 9 Sep 2012

Wafer-level packaging emerges for uncooled IR imagers

Fri, 9 Sep 2011

Yole D

EVG enhances fusion wafer bonder throughput, accuracy

Wed, 9 Sep 2011

EV Group (EVG) launched a new flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system throughput 26% to 18-20WPH with enhanced automation capabilities and low-temperature processing.


Sony licenses Ziptronix oxide wafer bonding patents

Wed, 8 Aug 2011

Ziptronix Inc. has licensed use of its oxide bonding technology for backside illumination imaging sensors patents to Sony Corporation. ZiBond technology enables more die per wafer, improving costs and quality for consumer, automotive, and other end-use applications.


Smart systems research group tackles design methodology

Fri, 11 Nov 2011

SMArt systems Co-design (SMAC) launched today, bringing together a multinational, multidisciplinary partnership of leading companies on a three-year project for design and integration of smart systems.


SUSS MicroTec sends equipment to SVTC in MEMS, 3D IC dev partnership

Tue, 11 Nov 2011

Nanotechnology accelerator SVTC Technologies partnered with SUSS MicroTec on wafer-level packaging for MEMS, and 3D IC bonding technology development.


SEMATECH creates 3D packaging standards development forum

Mon, 11 Nov 2011

SEMATECH has created an online 3D Standards Dashboard, allowing 3D semiconductor and MEMS interconnect professionals to exchange standards activity information.


C2MI's 3D MEMS fab adds Akrion Systems' advanced wet stations

Wed, 4 Apr 2011

The MiQro Innovation Collaborative Centre (C2MI) will purchase three Akrion Systems GAMA automated wet process systems for the development and manufacture of advanced devices at C2MI's state-of-the-art MEMS facility in Quebec.


Silicon interposers embedded capacitors subject of ALLVIA presentation at IMAPS Device Packaging

Wed, 3 Mar 2011

ALLVIA, through-silicon via (TSV) foundry, will present its latest analysis on silicon interposers and embedded capacitors during the IMAPS Conference on Device Packaging in Scottsdale, AZ, March 9. Dr. Sergey Savastiouk, CEO at ALLVIA, will present "Silicon Interposers Enable High Performance Capacitors."


Honeywell taps Tezzaron Semiconductor to stack rad-hard die

Fri, 12 Dec 2011

Honeywell Microelectronics will use Tezzaron's 3D stacking on Honeywell

Silicon interposer partnership sets roadmap

Tue, 12 Dec 2011

Singapore's A*STAR IME and 3D IC developer Tezzaron Semiconductor signed a research collaboration agreement to develop and exploit advanced through silicon interposer (TSI) technology.


inTEST to acquire Thermonics division of Test Enterprises

Tue, 12 Dec 2011

inTEST will acquire the assets and certain liabilities of Thermonics from Test Enerprises. inTEST's Temptronic Corporation, of the Thermal Solutions Group, will integrate the company.


Embedded WLP, TSV interposers, copper pillar, materials: 4 projects of IME packaging consortium

Wed, 6 Jun 2011

Singapore's Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR) launched the 11th cycle of its 15-year packaging R&D with 23 companies and 4 main projects.


FEI plasma FIB tool targets packaging apps

Mon, 6 Jun 2011

High-speed sectioning of TSVs with plasma FIB. The device was located, cross-sectioned, polished, and imaged with PFIB. SOURCE: FEI FEI's new Vion plasma focused ion beam (PFIB) system based on inductively-coupled plasma (ICP) source technology using a xenon ion beam generates more than a micro-amp of beam current and can remove material faster than liquid metal ion sources, says product marketing manager Peter Carleson.


Wafer bonding: Many options for many devices

Tue, 5 May 2011

Wafer bonding. SOURCE: Yole May 2011. Wafer bonding is a complex process, used on 2" to 12" wafers for MEMS, image sensors, advanced packaging, LEDs, and other chips. Yole Développement published a technology study and market research report, "Permanent wafer bonding," to derive trends in the market and technology through 2016.


What SEMICON West offers packaging professionals in 2011

Thu, 6 Jun 2011

SEMICON West is a major conference for semiconductor manufacturing professionals. Semiconductor packaging has become a major focus in recent years, and this year, BEOL attendees have ATE Vision 2020, 3D IC standards meetings, a keynote, and multiple sessions dedicated to packaging technologies. Here's your guide to attending SEMICON West on a packaging track.


Cascade Microtech's WinCalXE integrates SussCal for better on-wafer VNA measurements

Mon, 5 May 2011

Cascade Microtech Inc. (NASDAQ: CSCD) released WinCalXE version 4.5 calibration software, with improved model and process quality. WinCalXE 4.5 contains the features of WinCalXE and SussCal, and operates with all manual and semi-automatic Cascade Microtech and former SUSS MicroTec probe stations.


Non-planar device scaling: SEMATECH talks TSV, SoC, SiP

Thu, 5 May 2011

The semiconductor industry is moving to 3D device structures, says Raj Jammy, SEMATECH, at The ConFab 2011, discussing TSV and system-in-package (SiP) opportunities and challenges. He also summarizes logic and memory roadmaps.


Tessera changes CFO, Neely brings high-tech experience

Thu, 8 Aug 2012

Tessera appointed Rick Neely, Jr. as EVP and CFO, responsible for the company

New MEMS, 3D IC packaging working group chairs at GSA

Tue, 7 Jul 2012

Global Semiconductor Alliance (GSA) recently named Jay Esfandyari, STMicroelectronics, as its MEMS Working Group chairman and Ken Potts, Cadence Design Systems, as the 3D IC Working Group chairman.


2012 ITRS update: Back-end packaging and MEMS

Fri, 7 Jul 2012

At SEMICON West, the working groups of the International Technology Roadmap for Semiconductors (ITRS) outlined 2012 updates to the roadmap. Check out the back-end process info here.


SemiProbe patent for modular test system approved

Wed, 8 Aug 2010

SemiProbe has developed proprietary technologies awarded a patent by the United States Patent and Trademark Office. The Probe System for Life allows the company and users to configure test and inspection systems that meet unique requirements usually served by custom products.


Viscom introduces measurement tools for wire bond inspection

Tue, 1 Jan 2010

Wire bond inspection system maker Viscom introduced software tools for its very high resolution (VHR) camera module, which has the ability to provide exact measurements of balls and wedges. With this technology, 25-µm gold thin-wire wedge sizes can be measured with a standard deviation of 1 µm. In addition to inspecting qualitative characteristics of wire bonds, balls and wedges statistical evaluation and trend analysis of critical geometric dimensions can also be performed in the production process.


IMT-adds-TSV-geometry-point

Wed, 12 Dec 2010

Innovative Micro Technology Inc. (IMT) added a new geometry point in its technology roadmap for through silicon vias (TSVs). Joining the copper-filled 15 by 60um depth TSV configuration that has been in production for nearly 2 years, 50 by 250um copper-filled TSV is planned for production at the beginning of 2011.


MEMS packaging facility lands Canadian grant

Thu, 12 Dec 2010

The MiQro Innovation Collaborative Centre (MICC; Bromont, QC, Canada) will receive a $14.1 million grant as part of the Canadian government's Centres of Excellence for Commercialization and Research (CECR) program. The grant will be used for 200mm MEMS and WLP research.


Logic apps for Si interposers and embedded capacitors: ALLVIA talk at 3D Packaging Forum

Mon, 12 Dec 2010

Dr. Nagesh Vodrahalli, vice president of technology and manufacturing at ALLVIA, will present a discussion on December 9 titled "Silicon Interposers with TSVs and Embedded Capacitors for Advanced Logic Applications."


MicroProbe debuts MEMS-based, multi-DUT, ultra-fine-pitch probe card for IC wafer test

Tue, 7 Jul 2010

MicroProbe Inc., supplier of wafer test technology to the global semiconductor industry, released the MEMS-based Mx-FinePitch (Mx-FP) probe card. The test card series targets ultra-fine-pitch testing of leading-edge SoC and logic devices found in applications like digital cameras, set-top boxes and digital TVs.


Bond-align-mask-align-SUSS-MicroTec-Fraunhofer-collab

Thu, 11 Nov 2010

SUSS MicroTec and Fraunhofer for Surface Engineering and Thin Films IST launched SELECT, a technology for bond aligners and mask aligners that selectively activates parts of wafer surfaces through plasma.


IDTechEx launches active RFID and sensor networks report

Mon, 8 Aug 2010

The IDTechEx report, "Active RFID and Sensor Networks 2011-2021," comprehensively analyzes the technologies, players and markets with detailed 10-year forecasts, including tag numbers, unit prices and interrogator numbers and prices.


IDTechEx releases RFID forecast publication

Thu, 8 Aug 2010

IDTechEx announced "RFID Forecasts, Players & Opportunities 2011-2021," which shows RFID as a $5.63 billion market in 2010.


Focus on 3D TEST at IEEE Workshop

Wed, 12 Dec 2010

The test community is embracing 3D ICs, as evidenced by presentations at the first IEEE International Workshop on Testing 3D stacked ICs that addressed a range of test challenges and solutions, reports Dr. Phil Garrou.


Alchimer-Electrografting-for-3D-TSV-apps-validated-by-RTI

Tue, 11 Nov 2010

Alchimer's Electrografting (eG) technology has been validated by scientists at RTI International (RTI). The paper confirmed that electrografting is a proven technology for depositing "insulator, barrier and seedlayer into high aspect ratio TSVs for 3D integration applications."


Hymite will sell portfolio of wafer-level semiconductor packaging patents

Mon, 2 Feb 2010

ICAP Ocean Tomo, the intellectual property brokerage division of ICAP Plc (IAP.L), is offering for sale a patent portfolio relating to wafer-level semiconductor packaging owned by Hymite A/S. The 77 issued U.S. and foreign patents and patent applications cover new packaging technologies for optical communications components, LED emitters, and semiconductor fabrication.


Gyroscope integrates MEMS/ASIC in custom package

Mon, 8 Aug 2010

Sensonor Technologies is developing SAR500, a novel high-precision, low-noise, high-stability, calibrated and compensated digital oscillatory gyroscope with SPI interface housed in a custom-made ceramic package.


Roadmapping More than Moore: When the application matters

Fri, 7 Jul 2012

At the ITRS 2012 update, back-end technologies session, at SEMICON West, roadmapping for More than Moore was addressed as both a philosophical and technical matter.


Tessera: Adding Vista Point Technologies, losing Powertech Technology?

Mon, 7 Jul 2012

Tessera received notice from Powertech Technology Inc. (PTI) that it will terminate its license agreement with the semiconductor packaging and optics technology company. Tessera also completed phase 1 of its acquisition of camera module technologies from Flextronics.


Conference report: IITC closes with talks from EUV to TSV

Thu, 6 Jun 2012

Day 3 of the 15th IITC (International Interconnect Technology Conference) opened in San Jose, CA under clear sunny skies and a pleasant breeze. The herd thinned a bit, down to ~150 hearty souls from the original 230 the prior two days.


Gold pattern transfer/bonding tech for MEMS, LED packaging under dev at SUSS, Tanaka

Tue, 7 Jul 2011

Tanaka Kikinzoku Kogyo KK will partner with SUSS MicroTec KK to develop pattern transfer and bonding technology using sub-micron gold particles. The companies hope to replace gold bumping, sputtering, and other technologies in MEMS, LED, and 3D IC packaging.


300-450mm manual wafer test probe configuration out from SemiProbe

Wed, 6 Jun 2011

SemiProbe released a 300mm manual test probe configuration of its Probe System for Life, M-12. The M-12 is field-upgradable to 450mm.


Forging a TSV supply chain in a consolidated market

Fri, 10 Oct 2010
Steve Lerner, Alchimer S.A., Massy, France

Nanoplas targets 200mm MEMS and 3D TSV packaging with dry processing tool

Tue, 10 Oct 2010

Nanoplas toolNanoplas introduced a fully automatic dry-processing batch system for high-volume 200mm production. The DSB 9000A is based on Nanoplas’s High Density Radical Flux (HDRF) technology.


IMAPS 2009: Fusion bonding for 3D/TSV, wafer-level/multichip packaging for MEMS

Mon, 11 Nov 2009

Presentations at this year's International Symposium on Microelectronics (IMAPS, San Jose, Nov. 1-5) included discussion of TSV/3D integration challenges and temporary bonding steps qualified for different process flows, and a wafer-level packaging (WLP) encapsulation process and stacked multi-chip package (MCP) for a MEMS variable capacitor and control IC chip.


3D roadmaps begin to converge

Mon, 10 Oct 2010

Last month's SEMICON Taiwan 3D Technology Forum shed some insight into what several foundries, assembly houses and customers are thinking about the timing for 3D interposers and full 3D IC, reports Phil Garrou.


AP Interview: Ann Witvrouw, manager, MEMS integration research program, IMEC

Sun, 4 Apr 2007
Advanced Packaging talked with IMEC’s Ann Witvrouw about recent developments in MEMS and CMOS processing, and how the technology could lead to advanced packaging techniques across the spectrum of MEMS structures.

API Diversifies with MEMS

Thu, 3 Mar 2007
TORONTO - API Nanotronics Corp. closed acquisition of National Hybrid Inc.

Extreme Environment Advancements

Tue, 5 May 2007
Extreme-environment electronics operate in conditions outside the parameters of mainstream electronics.

Sockets Meet Future Technology Challenges: Part I

Thu, 3 Mar 2007
Though the basic requirement of sockets remains unchanged - making a stable electrical contact from the device to the PCB - the future holds even more demands on this important electrical/mechanical device.

Dicing MEMS

Sun, 7 Jul 2007
Micro-electromechanical systems (MEMS) include a variety of miniaturized intelligent mechanical systems such as accelerometers, flow sensors, motion mirrors, and radio-frequency (RF) devices.

IN THE NEWS

Sun, 7 Jul 2007

MEMS Market Shows Growth

Sun, 7 Jul 2007
Micro-electromechanical systems (MEMS) comprise a broad category of packages - sensors, gyroscopes, accelerometers, and more - that attract attention everywhere.

The Times, They Are A-changin’

Mon, 1 Jan 2007
The times, they are a-changin’ - Bob Dylan famously announced in 1964, creaing an anthem for America’s social revolution in the 1960s.

Mold packaging meets metal TSV for 5-10x density of conventional substrates

Thu, 4 Apr 2012

Silex Microsystems brought its Met-Via full-wafer-thickness TSV technology into Chip Architectures by Joint Associated Labs for European Diagnostics, where it is being used to create cost-effective molded chip-level packaging with through metal vias.


SUSS buys Tamarack for lithography, laser structuring lines

Fri, 3 Mar 2012

SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.


Conference Report: MEMS Executive Congress Europe

Mon, 4 Apr 2012

Karen Lightman, the Managing Director of the MEMS Industry Group, blogs from the MEMS Executive Congress Europe, which was held March 20th, in Zurich, Switzerland.

 


SEMICON West heralds 22nm, EUVL, 450mm, mobile electronics speakers

Mon, 4 Apr 2012

Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.


Field Report: Sensors in Design 2012

Thu, 3 Mar 2012

Sensors in Design 2012 was opened March 28 at the San Jose McEnery Convention Center, in conjunction with Design West. Blogger Mike Fury reports.


2011 ITRS: DRAM, 3D Flash, MEMS, nano scaling steal the show

Wed, 2 Feb 2012

The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.


JPSA expands Ultrafast laser machining technology

Wed, 2 Feb 2012

JP Sercel Associates, Inc. (JPSA) expanded its Ultrafast processing capabilities, using Pico-second lasers with innovative laser beam delivery techniques.


UPDATED: Record semiconductor sales in 2011, 2012 outlook

Wed, 2 Feb 2012

The SIA shows 2011 worldwide semiconductor sales hit $299.5 billion, a 0.4% year-on-year increase and new record. Semico Research's forecast for 2012 shows a 10.11% growth in semiconductors revenues over 2011. Barclays Capital and Strategy Analytics also weigh in.


Tokyo Electron (TEL) establishes organic EL and FPD departments, eliminates MEMS dev

Fri, 2 Feb 2012

Tokyo Electron Ltd. (TEL) restructured its organization, with a new "Organic EL Division" established under GM Takeshi Okubo, as well as other new and consolidating subsidiaries in the semiconductor and liquid crystal production segments.


SUSS combines resist coat and develop platforms

Mon, 3 Mar 2012

SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.


CVD Equipment doubles manufacturing space with new NY facility

Mon, 3 Mar 2012

CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its CVD and gas control equipment assembly, and unifying its nano-materials lab.


MATHESON incorporates RFID, pressure monitoring in compressed gas control system

Wed, 3 Mar 2012

MATHESON debuted the Lasso System, a customer-centric supply chain and inventory management system that can monitor the location and operating status of gas products and other assets in the REAL-Time Gas and Asset Management System.


Vacuum pumps improve throughput by 90% with new rotary design

Tue, 4 Apr 2012

Edwards Limited uncrated the STP-iXR1606 series magnetically-levitated turbo-molecular pumps (TMP) with fully integrated onboard controllers. Its new rotary design improves throughput by about 40% at high gas flow rates; nearly 90% percent in maximum gas flow.


Attend joint sessions at VLSI Technology and Circuits

Tue, 4 Apr 2012

The 2012 Symposia on VLSI Technology and Circuits, this June in Honolulu, HI, will foster joint interactions among device technologists and circuit/system designers with overlapping technical programs of both symposia, and joint focus sessions on important topics.


New biochip measures glucose in saliva, not blood

Mon, 1 Jan 2012

Researchers at Brown University are working on a new sensor, based on plasmaonic interferometers, that can check blood sugar levels by measuring glucose concentrations in saliva instead.


Supramolecular researchers install NanoInk lithography system

Thu, 1 Jan 2012

Researchers at INCDTIM in Romania will use NanoInk's NanoFabrication Systems Division's DPN 5000 system for supramolecular structure fabrication, molecular recognition and self-assembling process applications.


Fabs in high-risk zones, 450mm, 3D IC themes of Semico's Semiconductor Fab Database

Wed, 1 Jan 2012

36% of semiconductor fabs are in high-risk zones, finds Semico, noting the industry disruptions caused by the Japan earthquake and tsunami and Thai flooding and the challenges these presented to chip makers in the regions. 


European microelectronics fab database tracks major changes over past 5 years

Mon, 2 Feb 2012

Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufacturing fabs, pilot lines, and major R&D organizations.


Apple shares list of suppliers

Fri, 1 Jan 2012

For the first time, Apple Inc. has publicly published a list of over 150 companies that the electronics giant says represent 97% of its procurement expenditures for materials, manufacturing, and assembly of products worldwide.


Qualcomm MEMS Technologies reports 2 e-reader design wins in China

Thu, 1 Jan 2012

Qualcomm MEMS Technologies Inc.'s mirasol display technology is used in 2 new e-readers for the Chinese market, the Hanvon C18 and the Bambook Sunflower from Shanda Networking.


Qualcomm MEMS Technologies brings color display to Jin Yong e-reader

Tue, 1 Jan 2012

Qualcomm MEMS Technologies Inc. and e-reader provider Koobe announced the next-generation Jin Yong Reader uses MEMS display technology. The original Jin Yong Reader had a black and white display.


Apple iPhone 4S steals smartphone show in Q4 2011; Samsung wins the year

Fri, 1 Jan 2012

While Apple's release of the iPhone 4S in Q4 2011 "unleashed tremendous pent-up demand" from consumers, Samsung used its broad range of smartphones to take the top spot, reports IHS.


Metrology tool offers economical price point with high accuracy

Mon, 4 Apr 2012

Hexagon Metrology released the Optiv Classic 321GL tp benchtop vision-measuring metrology system for the North American market. It suits electronics and precision parts inspection, including micro-holes, fiber optics, filters, and more.


EPIC names new director general, promises closer ties with EU

Thu, 4 Apr 2012

EPIC, the European Photonics Industry Consortium, announced at its annual general meeting that Carlos Lee has been appointed as director general, succeeding Thomas Pearsall, who has led the association since its founding in 2003.


Texas Instruments (TI, TXN) names top suppliers

Thu, 4 Apr 2012

Texas Instruments awarded 15 of its 12,000 suppliers with Supplier Excellence Awards for delivering outstanding service and support, based on cost, environmental responsibility, technology responsiveness, assurance of supply, and quality.


Conference Report: MRS Spring 2012, Day 4

Fri, 4 Apr 2012

Blogger Michael A. Fury, Techcet Group, reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: nanowire FETs, laminate MEMS, nanoparticles in security printing, graphene nanoribbons, Ta2O5 memristors, redox flow batteries, graphene, and more.


Conference Report: MRS Spring 2012, Day 3

Thu, 4 Apr 2012

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- κ dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.


International Solid-State Circuits preview: imec's wireless sensor, organic electronics work

Mon, 2 Feb 2012

At International Solid-State Circuits Conference (ISSCC), imec and Holst Centre are presenting 14 papers on low-power design for wireless communication and wireless sensor networks, and organic electronics.


MIT's nanowire growth control method could optimize LEDs, other semiconductors

Wed, 2 Feb 2012

MIT researchers used gases to precisely control nanowires' width and composition as they grow, which could yield complex structures optimally designed for particular applications, like LED substrates or solar panels.


Chip substrate factory begins producing thermal-control substrates in Russia

Wed, 2 Feb 2012

MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.


MEMS Symposium Report: Chasing 1 Trillion

Thu, 5 May 2012

The 10th Annual MEMS Technology Symposium sponsored by MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 23 at the San Jose Holiday Inn. This year’s theme was “Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion.”


Present at IEEE IEDM 2012

Wed, 5 May 2012

IEEE International Electron Devices Meeting (IEDM) is seeking original presentations on microelectronics research and development, with a focus on silicon and non-silicon device and process technology, circuit/device interactions; energy-harvesting, biomedical, and power electronics; magnetics and spintronics; and other topics.


SEMICON Europa 2012 seeks presenters

Fri, 3 Mar 2012

SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30.


Top 50 “internet of things” applications

Wed, 5 May 2012

Libelium, a wireless sensor networks platform provider, has released a list of 54 sensor applications for a smarter world, covering the most disruptive sensor and “internet of things” applications.


SEMI lauds Congressman Dave Camp (R-MI) for microelectronics/photovoltaics support

Wed, 5 May 2012

SEMI presented US Congressman Dave Camp (R-MI) with its 2012 North American Government Leadership Award for his leadership and support of the US microelectronics and photovoltaic manufacturing value chain.


SST Book Review: Energy Harvesting for Autonomous Systems

Mon, 4 Apr 2012

Contributing editor Steve Groothuis reviews a book titled “Energy Harvesting for Autonomous Systems (Smart Materials, Structures, and Systems).” The book highlights the progression from the basic principles behind energy harvesting to the comprehensive systems that control the sensing, actuation, and transmission of those devices. 


MEI semiconductor wet process tools built to prevent contamination

Fri, 4 Apr 2012

MEI uses Vycom Flametec PVC-C for chemical rinse tanks and other wafer-contacting elements of its process tools, reducing tool-based contamination and protecting fab workers. Bill McGinty, MEI operations manager, discusses the benefits the new-generation plastic for semiconductor fab tools.


Media tablets join top 5 semiconductor end-markets in 2012

Fri, 3 Mar 2012

Media tablets, experiencing "remarkably rapid ascension," will become the 4th largest application for semiconductors by 2014, up from 35th in 2010, according to IHS.


Confovis taps Digital Surf for metrology tool imaging software

Fri, 3 Mar 2012

Confovis will begin providing MountainsMap imaging and surface analysis software from Digital Surf with its ConfoCAM LED grid-confocal measuring systems for inspection and research.


NCSU researchers create functional oxide films

Wed, 3 Mar 2012

Researchers from North Carolina State University have developed the first functional oxide thin films that can be used efficiently in electronics, opening the door to an array of new high-power devices and smart sensors.


GSA working group evaluates new semiconductor startup models to attract investors

Tue, 11 Nov 2012

The Global Semiconductor Alliance (GSA) has formed a new working group and identify various alternatives to encourage startups to innovate, woo investors, generate returns, and keep generating sustainable industry M&A.


O-S-D market momentum fades as world economy stalls

Fri, 11 Nov 2012

After a strong surge in 2010 and solid growth in 2011, the market for optoelectronics, sensors/actuators, and discrete semiconductors (O-S-D) has lost most of its momentum amid a wobbling world economy, says IC Insights.


Comm, auto apps are now driving the IC market

Fri, 10 Oct 2012

Communications applications are far and away the leading growth market for ICs over the next five years, and PCs and consumer applications have fallen far back in the pack.


Semi equipment demand still sinking

Mon, 10 Oct 2012

In case anyone needed a reminder or a wake-up, new data from SEMI reiterates chip tool sales are slumping badly in the latter part of this year.


SEMI adds session, extends abstract deadline for China chip conference

Tue, 10 Oct 2012

SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.


GSA forms technology steering committee to guide working groups

Tue, 10 Oct 2012

The Global Semiconductor Alliance (GSA) says it has formed a Technology Steering Committee to help address key business and technology areas of interest to its members, and "encourage the advancement and adoption of leading technology and practices."


Process Watch: Cycle time’s paradoxical relationship to inspection

Tue, 12 Dec 2012

In the seventh installment in a series called Process Watch, the authors discuss cycle time and the impact of inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.


IEDM 2012: Late papers on silicon photonics, large TFTs, III-V devices

Tue, 12 Dec 2012

With this week's IEEE International Electron Devices Meeting (IEDM 2012) now underway, here are four of the papers that were accepted late: on 90nm integrated silicon photonics, ZnNO for next-gen displays, and III-V TFETs for the 7nm node.


IEDM: Nanoelectronics provide a path beyond CMOS

Tue, 12 Dec 2012

At the International Electron Devices Meeting in San Francisco, An Chen of GLOBALFOUNDRIES presented a survey of emerging nanoelectronic devices, which he divided into two categories: Charge-based and non-charge based.


IEDM keynote: It tastes like chicken

Tue, 12 Dec 2012

Attendees at this year’s International Electron Devices Meeting (IEDM) were delighted and perhaps somewhat horrified when the plenary speaker popped some electronics gear in his mouth and proclaimed, “It tastes like chicken!”


Sony and Toshiba fight declines with chip spending -- can it work?

Mon, 12 Dec 2012

Despite weak financial performances, sluggish global markets and strong regional competition, Japanese consumer electronics giants Sony and Toshiba are increasing their investments in new products to revitalize their businesses.


SEMI: Chip equipment slump extending into 2013, across-the-board rebound in 2014

Thu, 12 Dec 2012

Semiconductor equipment demand is persistently sluggish as the industry takes a break from a "multiyear expansion period" to digest recent investments and wrestle with a broader economic slowdown, acknowledges SEMI in its updated year-end forecast. But make no mistake: leading-edge technology investments are still happening, and growth will return in the typical cyclical pattern.


KLA-Tencor's updated LED wafer inspection tool boosts throughput, efficiency

Thu, 12 Dec 2012

KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers.


MIPI Alliance forms group to study sensor integration in mobile systems

Mon, 11 Nov 2012

MIPI Alliance has formed an open "Birds of a Feather" (BoF) group that will investigate the requirements related to integrating sensors into mobile systems. The group will address challenges facing the sensor and wireless markets.


EV Group completes cleanroom expansion, opens new R&D labs

Wed, 11 Nov 2012

EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services.


GSA, IC Insights team on 5th edition of IC Foundry Almanac

Wed, 11 Nov 2012

A reference book from the Global Semiconductor Alliance (GSA) and IC Insights puts foundry information at the fingertips of those who need it the most.


Brewer Science introduces CNT inks for printed electronics

Thu, 11 Nov 2012

Rolla, MO-based Brewer Science introduced a line of conductive CNT ink materials that are surfactant free, require no additional rinse steps, and are compatible with a broad range of printed electronic substrates.


Qualcomm expands IGZO display tech agreement with Sharp

Tue, 12 Dec 2012

Qualcomm Incorporated announced an expansion of its display technology agreement between its subsidiary Pixtronix, Inc. and  Sharp Corporation to develop and commercialize high-quality color, low-power MEMS displays incorporating IGZO technology.


Scholarship created for women going into engineering

Tue, 12 Dec 2012

TechSearch International and the IEEE Women in Engineering Committee (WIE) are establishing a $2500 scholarship for women going into the field of engineering.


Semi execs see a bright 2013, says survey

Fri, 12 Dec 2012

Industry watchers have been lowering their outlooks for 2013 over the past few weeks, but there's one set of opinions that still see optimism for an industry rebound in 2013 -- chip industry executives themselves.


Singapore IME, Nikon building R&D lab for sub-20nm semiconductor litho

Thu, 12 Dec 2012

Nikon and the Singapore A*STAR IME are jointly setting up a R&D lab to develop optical ArF lithography technology for semiconductor manufacturing to and below the 20nm device node.


SMIC claims breakthrough in backside-illuminated image sensors

Thu, 12 Dec 2012

SMIC is claiming a breakthrough in its development of backside-illuminated (BSI) CMOS image sensor (CIS) technology, with the first test chip demonstrating good image quality even in low-light conditions.


Ultratech buys Cambridge Nanotech assets, adds ALD tech

Thu, 12 Dec 2012

Ultratech has acquired the assets of Cambridge Nanotech, a developer and supplier of atomic-layer deposition (ALD) technology, which had quietly been put on the auction block after ceasing operations in November.


Canon stepper targets LED, MEMS, power device manufacturing

Tue, 12 Dec 2012

Canon U.S.A., Inc. recently launched the FPA-3030i5+ i-line stepper, designed for the manufacturing of LEDs, MEMS and power semiconductors.


IBM 5 in 5: Five innovations that will change our lives within five years

Mon, 12 Dec 2012

Each December, IBM unveils the 5 in 5 -- five predictions about technology innovations that will change the way we work, live and play within the next five years.


Gartner reduces 2012-2013 chip outlooks, but 2014 looks better

Fri, 12 Dec 2012

Joining the growing chorus of industry watchers lowering their outlooks on the semiconductor sector, Gartner has reduced both its 2012 and 2013 forecasts for semiconductor sales but is remarkably more bullish on prospects in 2014.


Wireless consumer devices reenergize magnetic sensor IC sector

Mon, 8 Aug 2012

Magnetic sensor semiconductors are robust but steady in application sectors like automotive, military/medical, and data processing. But the devices saw 50% growth in one segment last year: wireless/consumer, according to IHS.


Edwards tailors vacuum pump for LED, compound semiconductor manufacturing

Tue, 6 Jun 2012

Edwards (NASDAQ:EVAC) introduced the new iXH645H dry pump, optimized for metal-organic chemical vapor deposition, a key step in LED and compound semiconductor manufacturing.


JPSA picosecond laser micromachining platform reduces debris and thermal damage

Tue, 6 Jun 2012

JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.


Terry Brewer chats about SEMI and semiconductors at SEMICON West

Fri, 7 Jul 2012

Terry Brewer, one of the newest members of SEMI's North American advisory board, talks about semiconductor industry consolidation, as well as new technologies and materials in the industry. He shares how SEMI is reacting to this evolution.


The ConFab: Turning the technology knobs for system scaling

Tue, 6 Jun 2012

Chip scaling will go on for the foreseeable future, enabling new product with more compute power, more memory, faster on-chip communication. That was one of the conclusions put forth by imec’s An Steegen, speaking on technology trends at The ConFab 2012.


@ The ConFab: Semiconductor industry experts look to the future

Mon, 6 Jun 2012

The ConFab’s sessions opened with “The Economic Outlook for the Semiconductor Industry,” featuring Jackie Sturm of Intel, Dan Hutcheson of VLSIresearch, and Jim Feldhan of Semico.


Conference report: MEMS Business Forum

Fri, 5 May 2012

The first MEMS Business Forum, sponsored by MEMS Journal and MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 24 at the Santa Clara Biltmore Hotel. Ten speakers presented on topics ranging from near- and mid-term business opportunities to roles of MEMS in broad visions for the future.


ITF: New approaches in the battle against cancer

Fri, 5 May 2012

At imec's International Technology Forum, Denis Wirtz, co-director of the John Hopkins Institute for NanoBio Technology, described the latest efforts to fight cancer.


How emerging growth sectors impact the overall semiconductor industry: ConFab preview

Thu, 5 May 2012

Intel's Jackie Sturm will bring to light some of the emerging, growth markets for semiconductors, and what they mean for chipmakers and the fab suppliers in the first session of The ConFab, “The Economic Outlook for the Semiconductor Industry.”


Top conference reports from H1 2012

Fri, 7 Jul 2012

We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco.


AMAT’s Varian integration continues with Dickerson named president

Wed, 6 Jun 2012

In mid-2011, semiconductor manufacturing and assembly equipment supplier Applied Materials (NASDAQ:AMAT) acquired Varian Semiconductor Equipment Associates Inc. Now, the company is adding Varian’s former CEO Gary Dickerson as president.


Metrology merger: MicroSense acquires SigmaTech

Wed, 6 Jun 2012

MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.


iPhone 5: Which semiconductor suppliers are the big winners?

Fri, 9 Sep 2012

As the dust settles after the launch of the iPhone 5, analysts tally which suppliers in the semiconductor ecosphere are most likely to gain the most.


Singapore IME, MOSIS to offer silicon photonics wafer prototyping service

Tue, 9 Sep 2012

Singapore's Institute of Microelectronics (IME) and MOSIS have signed a memorandum of understanding (MOU) to offer a multiple-project wafer service targeting silicon integrated photonics.


AKM tops magnetic sensor rankings, but competition looms with 6-axis compasses

Fri, 8 Aug 2012

Propelled by strong sales to tablet and cellphone manufacturers, AKM led the semiconductor magnetic sensor market for the third year in a row in 2011. Of the top-10 magnetic sensor suppliers, Memsic saw the highest growth: 1340%.


Laser nanofabrication for mass production at the nanoscale

Fri, 8 Aug 2012

Laser nanofabrication can now meet the needs of submicron and nanoscale feature size manufacturing, and can operate in air, vacuum, or liquid processes. Sister publication Industrial Laser Solutions recently published Laser nanofabrication: A route toward next-generation mass production.


From fuzzy to focused: Phase I in project development

Fri, 10 Oct 2012

Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.


Semiconductors and healthcare converging

Mon, 10 Oct 2012

At the recent imec International Technology Forum Press Gathering in Leuven, Belgium, imec CEO Luc Van den hove outlined uses in blood cell sorting, mobile apps for personalized medicine (such as brain monitoring of EEG activity), and advanced bio research.


TEL and imec extend partnership into life science related research

Mon, 10 Oct 2012

Tokyo Electron (TEL) and imec announce the participation of TEL in imec’s bio-research program Human++. The agreement includes collaboration on bio-sensors and specialty imaging.   


EEG headset prototype developed

Mon, 10 Oct 2012

Imec, Holst Centre and Panasonic have developed a new prototype of a wireless EEG (electroencephalogram) headset.


Gartner identifies fast-moving technologies with Hype Cycle report

Fri, 8 Aug 2012

Big data, 3D printing, activity streams, Internet TV, Near Field Communication (NFC) payment, cloud computing and media tablets are some of the fastest-moving technologies identified in Gartner Inc.'s 2012 Hype Cycle for Emerging Technologies.


Fraunhofer develops new silicon photomultiplier

Thu, 8 Aug 2012

Scientists at Fraunhofer Research Institution for Modular Solid State Technologies EMFT, together with Ketek GmbH, have developed a novel, silicon-based optical sensor component called a silicon photomultiplier (SiPM).


Technology licensing company Rambus restructures, creates CTO role

Thu, 8 Aug 2012

Rambus Inc. (NASDAQ:RMBS), a technology licensing company, will undergo a restructuring and related cost saving measures to cut its expenses by$30-35 million annually.


Analyst: Fab spending softness 2012 extending into 2013

Thu, 10 Oct 2012

Fab equipment spending continues to soften in 2012, and hopes for a reprieve in 2013 are waning, warns one analyst.


Japan's semiconductor industry: Fabs, equipment, and materials

Wed, 10 Oct 2012

Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy,  the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.


SIA: Chip sales essentially flat in August

Wed, 10 Oct 2012

Macroeconomic malaise continues to weigh down global semiconductor sales, although there's a possible ray of hope for a boost by year's end thanks to introduction of much-desired electronics devices (hello iPhone 5).


Tezzaron takes over SVTC's Austin fab amid layoff reports

Mon, 10 Oct 2012

Tezzaron Semiconductor is taking over SVTC Technologies' wafer fab in Austin, TX, amid reports that the semiconductor/MEMS development organization is cutting back activities in Austin and in California.


On-board heaters can self-heal flash memories

Thu, 9 Sep 2012

At the upcoming International Electron Device Meeting, Macronix researchers will describe how they built flash memories that could heal themselves by means of tiny onboard heaters that provide thermal annealing just at the spots where it is needed.


imec advances electronics that flex and stretch

Tue, 9 Sep 2012

imec announced that it has integrated an ultra-thin, flexible chip with bendable and stretchable interconnects into a package that adapts dynamically to curving and bending surfaces.


IBM demos high-performance CMOS on flexible plastic substrates

Tue, 9 Sep 2012

At IEDM, IBM researchers will demonstrate high-performance state-of-the-art CMOS circuits —including SRAM memory and ring oscillators—on a flexible plastic substrate.


IEDM unveils 2012 program highlights

Mon, 9 Sep 2012

The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.


Chip demand still sliding, hopes for soft 3Q landing and recovery

Fri, 9 Sep 2012

Demand for chip tools fell again in August and is off by -30% from its peak in early summer, fulfilling fears that the second half of 2012 will be sluggish for chipmaking investments, according to the latest data from SEMI.


Market participants back microelectronics development potential in Russia

Fri, 6 Jun 2013

Over 45 percent market participants forecast a positive market trend with their company turnover growth outpacing that of the industry as a whole.


Two-dimensional atomically-flat transistors show promise for next-generation green electronics

Fri, 6 Jun 2013

UC Santa Barbara researchers demonstrate first n-type field effect transistors on monolayer tungsten diselenide with record performance.


MEMS for mobile industry will reach $6.4B by 2018

Thu, 6 Jun 2013

Market demand for new sensors will lead to a $6.4B market by 2018.


Multitest VP to discuss quality in 3D assembly at SEMICON West

Tue, 6 Jun 2013

Multitest’s James Quinn will present during the 2013 SEMICON West exhibition and conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA.


SEMI releases report on first quarter 2013 manufacturing equipment billings

Tue, 6 Jun 2013

SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.31 billion in the first quarter of 2013.


EVG and Dynaloy develop single-wafer cleaning solution

Mon, 6 Jun 2013

Single-wafer cleaning solution is suitable for 3D-IC/TSV, advanced packaging, MEMS and compound semiconductor applications.


Bosch and STM hold joint honors as No. 1 MEMS suppliers for 2012

Tue, 6 Jun 2013

For the first time ever, no clear winner has emerged to claim top honors in the MEMS business for 2012, with Bosch of Germany and French-Italian STMicroelectronics ending up evenly splitting the title of No. 1 supplier for the year.


Alchimer to collaborate with imec on advanced nano-interconnect technologies

Tue, 6 Jun 2013

In an industry where finer features are driving market needs, current deposition processes are no longer sufficient to address challenges like interconnect dimensions below 16/14nm or high aspect ratio TSVs (>8) without experiencing defects, voids, or low reliability.


Necessary attributes of a MEMS engineer for new product development

Mon, 6 Jun 2013

In the development of new MEMS products, the team is the most important factor.


Bosch reaches 3 billion sensor milestone

Tue, 6 Jun 2013

Since the start of production in 1995, Bosch has manufactured well in excess of three billion MEMS sensors.


Leti Innovation Days to present preview of future developments in nanotechnologies

Thu, 6 Jun 2013

CEA-Leti will present recent advances and a preview of future developments in micro- and nanotechnologies, followed by workshops on key technical fields, during Leti Innovation Days, June 25-28, on the MINATEC campus.


"Generation Mobile": Advanced Packaging Technology at SEMICON West

Thu, 6 Jun 2013

Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function.


Fab equipment spending: 23% growth for 2014

Tue, 6 Jun 2013

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.


Smartphones forecast to represent over 50% of total cellphone sales for the first time in 2013

Tue, 6 Jun 2013

A new report from IC Insights shows that we could be on the verge of entering into “the post-PC era.”


Leti to present latest R&D results in MEMS at Transducers’ 2013 in Barcelona

Wed, 5 May 2013

CEA-Leti will host a workshop for industrial companies to present its latest advances in MEMS and an overview of the success of its recent MEMS startup, Wavelens, during Transducers’ 2013 and Eurosensors XXVII in Barcelona, Spain.


Abu Dhabi doubles down on semiconductor research

Wed, 5 May 2013

ATIC and SRC today launched the ATIC-SRC Center of Excellence for Energy Efficient Electronic Systems (ACE4S), to be hosted jointly in Abu Dhabi by Khalifa University of Science, Technology and Research, and Masdar Institute of Science and Technology.


Updated: STMicroelectronics announces sale of ST-Ericsson mobile connectivity GNSS business to Intel

Wed, 5 May 2013

ST-Ericsson, a joint venture of STMicroelectronics and Ericsson, today announced the signature of a definitive agreement to sell the assets and intellectual property rights associated with its mobile connectivity Global Navigation Satellite System (GNSS) business to a semiconductor company.


OMRON develops MEMS non-contact thermal sensor utilizing wafer-level vacuum packaging

Wed, 5 May 2013

OMRON Corporation today announced that they have finished development work on the world's first infrared sensor manufactured with wafer-level vacuum packaging technology to create a 16x16 element MEMS non-contact infrared thermal sensor capable of highly precise 90-degree area detection.


STMicroelectronics announces winners of the iNEMO Design Contest 2013

Fri, 5 May 2013

The winning teams successfully conceptualized, developed and built demonstrable prototypes of entirely new applications using ST's iNEMO MEMS sensor-fusion modules.


EU announces achievements of three-year power microelectronics program

Thu, 5 May 2013

LAST POWER, the European Union-sponsored program aimed at developing a cost-effective and reliable technology for power electronics, today announced its three-year program achievements.


New nanowire structure has potential to increase semiconductor applications

Tue, 4 Apr 2013

New research led by University of Cincinnati physics professors Howard Jackson and Leigh Smith could contribute to better ways of harnessing solar energy, more effective air quality sensors or even stronger security measures against biological weapons such as anthrax


Critical updates on EUV, 3D transistors and 450mm manufacturing at SEMICON West 2013

Tue, 4 Apr 2013

The critical processes and technologies necessary to continue Moore’s Law are currently more uncertain than ever before in the history of advanced semiconductor manufacturing.


M2M Forum 2013 explores MEMS and the future of medical devices

Tue, 4 Apr 2013

MEMS Industry Group (MIG), a global industry organization with more than 140 member-companies and partners, will welcome micro-electromechanical systems (MEMS), medical industry and academic experts to Cambridge, Mass. for Member-to-Member (M2M) Forum 2013, a conference on the MEMS connection to advancements in healthcare, medical and biomedical applications.


AG Semiconductor appoints new senior director of sales

Tue, 4 Apr 2013

AG Semiconductor Services today announced that Michael (Mike) Mardesich has joined the company in the role of senior director of sales.


MEMSIC to be acquired by IDG-Accel China

Tue, 4 Apr 2013

MEMSIC, Inc., a MEMS solution provider, today announced that it has agreed to be acquired by IDG-Accel China Capital II, L.P. and its affiliates MZ Investment Holdings Limited and MZ Investment Holdings Merger Sub Limited, for $4.225 per share in cash.


SAMCO to relocate and expand Silicon Valley office

Mon, 4 Apr 2013

SAMCO Inc, head quartered in Kyoto, Japan, has expanded its OPTO Films Research Laboratory in California’s Silicon Valley in order to strengthen its research structure and after-sale process support.


Automotive, wireless applications to drive pressure sensors to become top-selling MEMS devices

Mon, 4 Apr 2013

MEMS pressure sensors will achieve accelerated growth this year and become the leading type of MEMS device, driven by increasing use in automotive and the fast-growing handset space, according to insights from the IHS iSuppli MEMS & Sensors Service from information and analytics provider IHS.


University of Illinois researchers measure behavior of semiconductor plasmonic microparticles

Mon, 4 Apr 2013

Recent progress in the engineering of plasmonic structures has enabled new kinds of nanometer-scale optoelectronic devices as well as high-resolution optical sensing.


STMicroelectronics’ SoC powers next-generation smart IPTV set-top boxes

Mon, 4 Apr 2013

STMicroelectronics has revealed that its Orly system-on-chip (SoC) is powering a new generation of advanced set-top boxes announced on April 17 from NTT Plala Inc., an Internet / IPTV service provider in Japan. This STB has been developed by Sumitomo Electric Networks, Inc., a Japanese equipment producer for home entertainment and broadband service providers, with operations around the world.


Element Six and Delft University demonstrate milestone in solid-state diamond research

Mon, 5 May 2013

Element Six last week announced, in collaboration with Delft University of Technology, the entanglement of electron spin qubits (quantum bits) in two synthetic diamonds separated in space.


IEDM announces 2013 call for papers

Fri, 5 May 2013

The 59th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking original work in microelectronics research and development. The paper submission deadline is Monday, June 24, 2013.


Intel board elects Brian Krzanich as CEO, Renée James as President

Thu, 5 May 2013

Intel announced that the board of directors has unanimously elected Brian Krzanich as its next chief executive officer (CEO), succeeding Paul Otellini. The board also named Renée James, 48, to be president of Intel.

SRC and NSF partner to develop compact models for emerging nanotech

Wed, 5 May 2013

Semiconductor Research Corporation (SRC) recently joined the National Science Foundation (NSF) as a partner in an ongoing NSF project to further develop compact models of emerging nanoelectronic devices such as might be used in next-generation consumer electronics.


IBM Research makes world’s smallest movie using atoms

Wed, 5 May 2013

Scientists from IBM today unveiled the world's smallest movie, made with one of the tiniest elements in the universe: atoms. Named "A Boy and His Atom," the Guinness World Records -verified movie used thousands of precisely placed atoms to create nearly 250 frames of stop-motion action.


Leading MEMS microphone suppliers ride Apple’s gravy train to the top

Wed, 5 May 2013

Once again demonstrating Apple’s power to ordain winners in the electronics supply chain, the top suppliers last year of microelectromechanical systems microphones were those that provided devices for iPhones and iPads.


Kurt Petersen, MEMS industry pioneer and technology vision, joins IMT board of directors

Tue, 4 Apr 2013

IMT, the largest pure-play MEMS foundry in the US, announced today the appointment of MEMS industry pioneer and technology visionary Dr. Kurt Petersen to the IMT board of directors.


Short-range wireless technology IC market to reach almost 5 billion units shipped in 2013

Wed, 3 Mar 2013

The total market for open short-range wireless (SRW) technology based ICs, such as Bluetooth, Wi-Fi, ZigBee, NFC, and GPS, is expected to reach almost 5 billion units in 2013 and grow to nearly 8 billion by 2018, according to ABI Research. This includes standalone wireless connectivity ICs, wireless connectivity combo ICs, and also platforms with integrated wireless connectivity.


A new way to discover and monitor defects

Thu, 5 May 2013

In the world of optical defect inspection, finding on defect on a 300mm wafer can be like trying to find a single coin on the island of Taiwan. Now imagine being able to find that coin in just an hour, along with any other coins that look exactly like it.


First quarter 2013 reports slight decrease in silicon wafer shipments

Thu, 5 May 2013

Worldwide silicon wafer area shipments decreased during the first quarter 2013 when compared to fourth quarter 2012 area shipments, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.


Second phase of Nanoelectronics Research Initiative to focus on post-CMOS electronics

Wed, 5 May 2013

SRC and NIST will provide a combined $5 million in annual funding for three multi-university research centers tasked with demonstrating non-conventional, low-energy technologies that outperform current technologies on critical applications in 10 years and beyond.


Photonics societies launch the National Photonics Initiative to increase R&D and economy

Thu, 5 May 2013

Photonics societies across the United States today announced the launch of the National Photonics Initiative.


IDC predicts semiconductor market to experience 3-4% revenue growth in 2013

Wed, 5 May 2013

IDC expects the semiconductor market to return to growth in 2013 with revenues forecast to increase by 3.5 percent this year.


China becomes world’s leading PC market in 2012

Mon, 4 Apr 2013

China rose to the top of the PC market for the first time ever on an annual basis last year, relegating the United States to second place with a lead of more than 3 million units, according to an IHS iSuppli PC Dynamics Market Brief from information and analytics provider IHS.


Handset market grows in Q1, despite Samsung and Apple’s different approaches

Fri, 4 Apr 2013

An estimated 405 million handsets, including 197 million smartphones, were shipped in the first quarter of 2013, according to market intelligence firm ABI Research.


TSMC

Fri, 4 Apr 2013

TSMC

Dongbu HiTek starts volume production of ALPS chips for Clairpixel

Thu, 4 Apr 2013

Dongbu HiTek today announced that it has begun volume production of Ambient Light Proximity Sensor (ALPS) chips for Clairpixel Co., Ltd., a Korean company specializing in single-chip image and motion sensor solutions for mobile, automotive, medical and security applications.


Breakthroughs in transistors and more to be discussed at VLSI Symposia 2013

Thu, 4 Apr 2013

About 1,000 of the world’s leading experts in the field of microelectronics will gather here for the 2013 Symposia on VLSI Technology and Circuits, from June 11-13, 2013 (Technology) and from June 12-14, 2013 (Circuits).


A*Star and Veredus create first lab-on-chip for the detection of tropical infectious diseases

Thu, 4 Apr 2013

The Agency for Science, Technology and Research (A*STAR) and Veredus Laboratories, a supplier of innovative molecular diagnostic tools, announced the launch of VereTropTM, the first biochip in the molecular diagnostics market that can identify 13 different major tropical diseases from a single blood sample.


Nanowires grown on graphene have surprising structure

Wed, 4 Apr 2013

When a team of University of Illinois engineers set out to grow nanowires of a compound semiconductor on top of a sheet of graphene, they did not expect to discover a new paradigm of epitaxy.


Personal computer shipments post worst quarter on record, says IDC

Thu, 4 Apr 2013

In another sign of the worldwide shift in preferred personal devices, PC shipments posted the steepest decline ever in a single quarter, according to the International Data Corporation Worldwide Quarterly PC Tracker (IDC).


Memory, foundry and LED markets drive fab spending in southeast Asia

Thu, 4 Apr 2013

Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia.


Carnegie Mellon research team develops edible electronics for medical device industry

Thu, 4 Apr 2013

It sounds futuristic, but today Carnegie Mellon University researchers are developing edible electronic devices that can be implanted in the body to improve patient care.


Fourth-quarter reprieve spurs 2013 rebound for semiconductor makers

Wed, 4 Apr 2013

Despite stronger-than-expected growth during the fourth quarter, 2012 was still a miserable year for the semiconductor market and suppliers, with only eight out of the Top 25 chipmakers managing to eke out revenue growth—but nine suffering double-digit declines.


Veredus confirms VereFlu lab-on-chip detects the current subtype of avian flu

Wed, 4 Apr 2013

Veredus Laboratories today announced that the current version of VereFlu detects the current subtype of H7N9 (Avian Flu) that is responsible for the flu outbreak in China. H7N9 is the latest mutation to cause concern and increased surveillance in the region.


Health awareness spurs quadrupling in MEMS sensor market for wearable electronics

Tue, 4 Apr 2013

From smart wristwatches that record heart rates, to intelligent armbands that track physical activities, wearable electronics and fitness monitoring devices are attracting increased attention from health-conscious consumers, causing shipments of MEMS sensors used in these products to more than quadruple in just five years.


memsstar appoints Tony McKie CEO

Tue, 4 Apr 2013

memsstar Limited, a provider of etch and deposition equipment and technology solutions to manufacturers of semiconductors and MEMS, today announced the appointment of Tony McKie as its new chief executive officer (CEO). McKie is tasked with capitalising on the company's experience and reputation in the semiconductor and MEMS markets to drive its growth.


SEMI reports 2012 global semiconductor materials sales of $47.1 billion

Tue, 4 Apr 2013

The global semiconductor materials market decreased 2 percent in 2012 compared to 2011 while worldwide semiconductor revenues declined 3 percent. Revenues of $47.11 mark the first decline in the semiconductor materials market in three years.


Researchers find surface diffusion plays significant role in shapes of catalytic nanoparticles

Tue, 4 Apr 2013

Controlling the shapes of nanometer-sized catalytic and electrocatalytic particles made from noble metals such as platinum and palladium may be more complicated than previously thought.


Opportunities for electronics manufacturing services in medical industry are increasing

Wed, 5 May 2013

Original equipment manufacturers (OEMs) are increasingly turning to electronics manufacturing service (EMS) providers to better handle the escalating volumes of electronic content in the medical industry.


Trends and techniques in sensor fusion to be discussed at 2013 Sensors Expo and Conference

Wed, 5 May 2013

MEMS Industry Group (MIG) today announced its conference and exposition line-up for the 2013 Sensors Expo and Conference.


MEMS New Product Development Blog: The technology development process and design review checklist

Tue, 5 May 2013

After a functional A-sample prototype is built, it doesn't take long for a project to gain traction that has market pull.  This is usually the point that a project becomes highly visible within a company and it enters the Technology Development Process (TDP).


Combo MEMS inertial sensors report brisk growth in automotive market

Mon, 5 May 2013

Combo MEMS sensors for automotive applications are off to another exhilarating ride this year as revenue continues to climb, spurred by rapidly accelerating use in car safety systems.


New magnetic graphene may revolutionize electronics

Fri, 5 May 2013

Researchers from IMDEA-Nanociencia Institute and from Autonoma and Complutense Universities of Madrid have managed to give graphene magnetic properties.


Bluetooth chip shipments to nearly double by 2017

Fri, 4 Apr 2013

The market for Bluetooth semiconductors is expected to boom by nearly 100 percent from 2011 to 2017, with the majority of the growth driven by demand for wireless combination integrated circuits (ICs) and mobile system-on-chip (MSoC) devices with integrated wireless connectivity that are used in mobile devices like smartphones and media tablets.


SEMI reports March book-to-bill ratio of 1.14

Fri, 4 Apr 2013

North America-based manufacturers of semiconductor equipment posted $1.14 billion in orders worldwide in March 2013 (three-month average basis) and a book-to-bill ratio of 1.14, according to the March Book-to-Bill Report published today by SEMI.


Top 30 MEMS companies of 2012

Fri, 4 Apr 2013

The fast growing market for sensors for smart phones is re-shuffling the ranks of MEMS suppliers. For the first time, suppliers of inertial sensors have surpassed the major makers of micro mirrors and inkjet heads that have long dominated the industry on Yole Développement’s annual ranking of the Top 30 MEMS companies.


Smartphones, tablets, SSDs propelling NAND flash sales in 2013

Thu, 4 Apr 2013

Increasing HD video content, social networking, shared data via the cloud, low power consumption, and “instant on” features continue to drive growth of consumer, communication, and computing devices that use NAND flash memory.


“Smart Skin” sensors could provide remote monitoring of aging infrastructure

Wed, 4 Apr 2013

Researchers at the Georgia Institute of Technology are developing a novel technology that would facilitate close monitoring of structures for strain, stress and early formation of cracks.


Examining the MEMS gyroscope patent landscape

Wed, 4 Apr 2013

The gyroscope market is driven by mobile applications, where until recently only two players, STMicroelectronics (ST) and InvenSense, were competing.


New microbatteries could mean a big boost for electronics

Tue, 4 Apr 2013

Though they be but little, they are fierce. The most powerful batteries on the planet are only a few millimeters in size, yet they pack such a punch that a driver could use a cellphone powered by these batteries to jump-start a dead car battery – and then recharge the phone in the blink of an eye.


Layered '2-D nanocrystals' are a promising new semiconductor

Tue, 4 Apr 2013

Researchers are developing a new type of semiconductor technology for future computers and electronics based on "two-dimensional nanocrystals" layered in sheets less than a nanometer thick that could replace today's transistors.


Thin-layer germanium may replace silicon in semiconductors

Mon, 4 Apr 2013

Chemists at Ohio State University have developed the technology for making a one-atom-thick sheet of germanium, and found that it conducts electrons more than ten times faster than silicon and five times faster than conventional germanium.


SPIE leaders encouraged by increased science funding in Obama budget proposal

Mon, 4 Apr 2013

Proposed increases in funds for scientific R&D and a greater emphasis on STEM education in the 2014 budget proposal announced by the White House this week reflect the President’s commitment to science and engineering, SPIE leaders said.


Net loss for netbooks: Product set for extinction by 2015

Fri, 4 Apr 2013

Once a white-hot PC product that sold in the tens of millions of units annually, netbook computers are now marking their final days, with the rise of tablets causing their shipments to wind down to virtually zero after next year, according to an IHS iSuppli Compute Electronics Market Tracker Report from information and analytics provider IHS.


Cracking the potential of the glass wafer market

Thu, 4 Apr 2013

Over the last few years, glass has gained considerable interest from the semiconductor industry due to its very attractive electrical, physical and chemical properties, as well as its prospects for a relevant and cost-efficient solution. The application scope of glass substrates in the semiconductor field is broad and highly diversified.


Corporate partnership produces next generation MEMS handler

Fri, 2 Feb 2013

TESEC Corporation today announced the development and sales of the ULTRA MEMS Handler, targeting Inertial (Accelerometer, Gyroscope and Magnetometer) MEMS devices.


Painting with catalysts: Nano-engineered materials for detoxifying water

Fri, 2 Feb 2013

Only light, aerial oxygen, and a catalyst are needed to remove pollutants from water. Ruhr-Universitat Bochum researchers led by Professor Radim Beránek are collaborating with colleagues from seven different countries in order to develop a photocatalyst that is efficient enough to be profitable.


UNL research moving closer to cracking silicon barrier

Fri, 2 Feb 2013

The ability to improve silicon transistors is reaching its fundamental limit, so researchers are searching for new ways to keep making electronic devices faster and more powerful. University of Nebraska-Lincoln physicists and colleagues have taken a major step toward breaking that silicon barrier.


Key patent analysis on quantum dot displays released

Thu, 2 Feb 2013

The quantum dot recently emerged as a next-generation display material. Quantum dots, whose diameter is just a few nanometers, are semiconductor crystals.


Report delivers latest analysis on nanobiotechnology applications, markets and companies

Thu, 2 Feb 2013

Nanobiotechnology, an integration of physical sciences, molecular engineering, biology, chemistry and biotechnology holds considerable promise of advances in pharmaceuticals and healthcare.


2013: Beyond CMOS, steady growth and accelerating change across non-mainstream chip markets

Thu, 1 Jan 2013

Sensors and optoelectronics will continue to grow faster than the mainstream semiconductor market. We currently expect 9%-13% growth in these sectors in 2013, accompanied by rapid changes in technology and  market structures.


2013: The year of the diamond?

Thu, 1 Jan 2013

Recent advances in diamond applications (diamond-on-silicon, MEMS, optical) suggest that its utilization into a broader scope of commercial products is not far away.


2013: MEMS devices better, faster, smaller

Thu, 1 Jan 2013

While the consumer market continues to evolve and the demand for better, faster, smaller increases even further, MEMS should continue to grow and find success as they are designed into more and more devices.


2013: Building the internet of things with MEMS and 3D advances

Wed, 1 Jan 2013

It is becoming increasingly clear that new MEMS and 3D high-volume, low-cost manufacturing technologies will accelerate a radical change to society’s cyber skyline.


2013: Look for continued consolidation

Wed, 1 Jan 2013

In 2013, it is anticipated that M&A transaction activities will increase and result in further consolidation of the semiconductor supply chain.


2013: The beginning of the next IC industry upturn

Wed, 1 Jan 2013

2013 will mark the beginning of the next cyclical upturn—one in which the IC market CAGR will more than triple to 7.4% in the 2012-2017 time period.


Global market for MEMS microphone to more than double in five years

Wed, 2 Feb 2013

The global market for MEMS microphones has reached approximately $422 million in 2012. The market is predicted to increase to $865 million in 2017.


MEMS devices shape medical industry, microsystem devices to reach $6.6 billion in 2018

Wed, 2 Feb 2013

Microelectromechanical (MEMS) devices are shaping the competitive landscape in the global medical device industry.


10 IC product segments to exceed total IC market growth in 2013

Tue, 2 Feb 2013

Tablet and cellphone processors, NAND flash, and telecom-specific ICs to enjoy best growth.


Solid state thin film batteries market worth $6 Billion by 2019

Tue, 2 Feb 2013

Markets for solid state thin-film batteries at $65.9 million in 2012 are anticipated to reach $5.95 billion by 2019, according to a new report released by ReportsnReports.com.


ISSCC 2013: Imagers, MEMS, medical and displays

Mon, 2 Feb 2013

Roland Thomas, subcommittee chair of ISSCC, writes of the substantial growth and future in key areas of technology.


Tronics to produce submicron MEMS technology of CEA-LETI

Mon, 2 Feb 2013

Tronics kicks-off the industrialization of a unique piezoresistive nanowire MEMS technology that can take 9 DOF motion sensors to a new level of competitiveness.


Opinion: MEMS new product development: The first prototype

Mon, 2 Feb 2013

In the second article of the MEMS new product development blog, the importance of the first prototype will be discussed.


STMicroelectronics and University of Amsterdam Faculty of Science use advanced MEMS to soar with birds

Thu, 2 Feb 2013

STMicroelectronics and the University of Amsterdam Faculty of Science have announced that a sophisticated bird-tracking system developed by the university is using advanced MEMS sensing technology from ST.


MEMS revenue to climb a healthy 8 percent this year

Thu, 2 Feb 2013

A strong uptake in consumer and mobile devices will power the market for microelectromechanical systems (MEMS) to solid revenue growth in 2013, with breakthroughs in new sensor applications also expected this year, according to insights from the IHS iSuppli MEMS service at information and analytics provider IHS.


Agilent Technologies commits $90 million gift of software to Georgia Institute of Technology

Tue, 2 Feb 2013

Agilent Technologies Inc. announced yesterday the intent to donate a $90 million in software to Georgia Institute of Technology, the largest in-kind software donation ever in its longstanding relationship with the university.


Hard disk drive market revenue set for double-digit decline

Mon, 2 Feb 2013

Facing a relentless onslaught from tablets, smartphones and solid state drives (SSD), global hard disk drive (HDD) market revenue in 2013 will decline by about 12 percent this year, according to IHS.


FAME center to focus on advanced electronics

Mon, 2 Feb 2013

Five University of California, Riverside professors will receive a total of $5 million as part of a $35 million research center aimed at developing materials and structures.


A*STAR and PGS to collaborate on MEMS sensor for oil and gas applications

Thu, 1 Jan 2013

A*STAR’s Institute of Microelectronics signed an agreement to collaborate with Petroleum Geo-Services to develop a high performance MEMS-based sensor for deep sea seismic oil and gas exploration.


STMicroelectronics and Hyundai Autron cooperate to develop integrated products for next-generation vehicles

Fri, 2 Feb 2013

Joint effort will drive innovative engine-train and smart-power products


Institute of Microelectronics and Stanford University to develop switch technology for efficiency in mobile devices

Fri, 2 Feb 2013

A*STAR’s Institute of Microelectronics, or IME, and Stanford University will collaborate to advance innovations in nano-electromechanical systems (NEMS) switch technology for ultra-low power digital systems.


APIX Technology introduces gas chromatography device based on silicon nano-scale components

Thu, 2 Feb 2013

GCAP targets a range of industrial applications as well as research labs, advanced gas analysis and biomedical screening.


SEMI announces Silicon Innovation Forum to bridge funding gaps for early-stage companies

Thu, 2 Feb 2013

SEMI, in collaboration with strategic investing groups throughout the global semiconductor industry, has announced the Silicon Innovation Forum, or SIF, to bridge funding gaps for new and early-stage companies with valuable semiconductor manufacturing and technology solutions.


Smartphones and tablets drive continued double-digit growth in MEMS motion sensor market

Thu, 2 Feb 2013

Smartphones and media tablets continue to the prime movers of technology industries, with the two mobile platforms spurring a double-digit increase in the market for microelectromechanical system (MEMS) motion sensors this year.


ISS 2013: Semiconductor leaders see massive industry transformation

Tue, 1 Jan 2013

The rise in mobile computing, changes to the fabless-foundry model, uncertainties in technical innovation, and global macroeconomic trends are becoming the dominant forces in 2013 and beyond, according to industry leaders speaking at this week's SEMI Industry Strategy Symposium (ISS).


CES 2013: The brains behind smart devices are front and center

Wed, 1 Jan 2013

Components are prominent this year, on the main stage, and the CES exhibit floors.Todd Traylor of Smith & Associates reports.


Opinion: MEMS new product development, a sellable plan

Wed, 1 Jan 2013

In David DiPaola's blog, he discuss the critical factors needed for success in the early stage of new MEMS product development.


IDC: Semiconductor revenues will grow 4.9% in 2013

Fri, 1 Jan 2013

The International Data Corporation is forecasting that semiconductor revenues worldwide will improve by 4.9% to $319 billion in 2013 and log a compound annual growth rate (CAGR) of 4.1% from 2011-2016.


SIA: November chip sales best of the year

Fri, 1 Jan 2013

Global semiconductor sales in November 2012 were the largest monthly tally of the entire year,according to the SIA -- and growth was especially sparkling in the North America region.


2013: Healthy revenue growth, but capex likely flat

Fri, 1 Jan 2013

Based on current indications, capital spending would seem to be flat in 2013.  However, Semico predicts healthy revenue growth this year, which may encourage more spending, particularly in the second half of the year.  This may bring total capex for 2013 into the positive range.


memsstar lands multiple MEMS etch R&D system orders in Asia

Tue, 1 Jan 2013

memsstar Limited announced two etch system order wins from new MEMS customers in Asia


SiTime expands portfolio with +125C MEMS oscillators

Mon, 1 Jan 2013

SiTime Corp. introduced the SiT8920 MEMS oscillator for industrial and high reliability applications.


MEMS Industry Group announces MEMS Executive Congress Europe 2013

Mon, 1 Jan 2013

MEMS Industry Group (MIG) will host its second annual MEMS Executive Congress® Europe, March 12, 2013 in Amsterdam.


Samsung, Apple swap spots as top chip consumers, while total market lags

Fri, 1 Jan 2013

Given the ascension of smartphones, it's no surprise that Samsung and Apple remain far and away the biggest end-users of semiconductors, and are widening their lead on the rest of the field, according to the latest Gartner rankings.


World’s most complex 2d laser beamsteering array demonstrated

Thu, 1 Jan 2013

DARPA researchers have recently demonstrated the most complex 2-D optical phased array ever. The array, which has dimensions of only 576µm x 576µm is composed of 4,096 (64 x 64) nanoantennas integrated onto a silicon chip.


Researchers create semiconductor 'nano-shish-kebabs' with potential for 3-D technologies

Wed, 2 Feb 2013

Researchers at North Carolina State University have developed a new type of nanoscale structure that resembles a “nano-shish-kebab,” consisting of multiple two-dimensional nanosheets that appear to be impaled upon a one-dimensional nanowire.


Energy-Efficiency Trends

Tue, 12 Dec 2012

Analog Trends

Tue, 12 Dec 2012

RF Trends

Tue, 12 Dec 2012

High-Performance Digital Trends

Tue, 12 Dec 2012

Large-Area Flexible Electronics Trends

Tue, 12 Dec 2012

Imagers, MEMs, Medical & Displays

Tue, 12 Dec 2012

ISSCC 2013 Slideshow: Highlights

Tue, 2 Feb 2013

ISSCC, the International Solid-State Circuits Conference, is being held on February 17-21, 2013, at the San Francisco Marriott Marquis Hotel. This year, in honor of the conference’s 60th anniversary, we have assembled highlights of the topics and trends that are being discussed.


Memory Trends

Tue, 12 Dec 2012

DRS Technologies and Cypress Semiconductor reach agreement to manufacture uncooled detectors

Tue, 2 Feb 2013

DRS Technologies, Inc., a Finmeccanica Company, and Cypress Semiconductor Corp. (NASDAQ: CY) today announced that DRS will transfer its Microbolometer technology for uncooled infrared detectors to Cypress for high-volume manufacturing.


Manufacturing innovations to drive MEMS equipment market to a >5% CAGR over 2012-2018

Tue, 2 Feb 2013

In its new report MEMS Front-End Manufacturing Trends, Yole Développement goes further in the equipment and materials market forecasts and in the manufacturing trends for MEMS. The report gives detailed analyses about MEMS device technology process flow, manufacturing trends and manufacturing cost breakdown.


Infographic: Computers with human senses

Tue, 2 Feb 2013

We are entering the era of cognitive systems, where electronic devices will mimic the human senses—in their own way, to see, smell, touch, taste and hear. IBM assembled this infographic to illustrate what they call the “5 in 5,” five innovations that will change our lives within five years.


Tech spending still strong, despite economic volatility

Mon, 2 Feb 2013

China looks a good bet to be the engine of growth again in 2013, while U.S. will see improving PC market and more software growth.


UCLA researchers refine 'NanoVelcro' device to grab single cancer cells from blood

Mon, 2 Feb 2013

Improvement in nanotechnology enables 'liquid biopsies' for metastatic melanoma.


JEDEC elects two new members to its Board of Directors

Mon, 2 Feb 2013

JEDEC Solid State Technology Association, a developer of standards for the microelectronics industry, announced today that its Board of Directors has appointed two new members: Mr. Jong H. Oh, Vice President, SK hynix and Mr. Hung Vuong, Qualcomm. 


Toshiba develops CMOS image sensor for small and low power applications

Mon, 2 Feb 2013

Toshiba Corporation announced the development of a CMOS image sensor with a small area and low power pixel readout circuits. A sample sensor embedded with the readout circuits shows double the performance of a conventional one. Toshiba presented this development at ISSCC 2013 in San Francisco, CA on Feb. 20.


eMemory’s eNVM SIPs reach 5 million wafer production record

Wed, 3 Mar 2013
eMemory announced today that the accumulated number of customers’ wafers incorporating eMemory’s eNVM SIPs have now surpassed 5 million production mark.

NIST quantum refrigerator offers extreme cooling and convenience

Wed, 3 Mar 2013

Researchers at the National Institute of Standards and Technology (NIST) have demonstrated a solid-state refrigerator that uses quantum physics in micro- and nanostructures to cool a much larger object to extremely low temperatures.


Fab Spending Forecast: Equipment spending is expected to remain flat in 2013

Wed, 3 Mar 2013

Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase.


Smart new sensor fusion chip enables mobile devices to operate multiple sensors

Tue, 3 Mar 2013

PNI Sensor Corporation and EM Microelectronic -Marin SA announce the introduction of the Sentral sensor fusion hub: a new, highly effective way to integrate complex motion sensors on mobile devices.


Toshiba develops intelligent, wearable vital signs sensor module

Tue, 3 Mar 2013

Toshiba Corporation today announced that it has developed an intelligent vital signs sensor module: Smart healthcare Intelligent Monitor Engine and Ecosystem with Silmee, that simultaneously senses information on key vital signs, Electric Cardio Gram, pulse, body temperature and movements, and that can deliver the data to smartphones and tablet PCs with wireless technology.


EV Group to develop equipment to enable covalent bonds at room temperature

Tue, 3 Mar 2013

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is developing equipment and process technology to enable covalent bonds at room temperature.


Avnet Memec signs agreement with MEMS sensor line

Fri, 3 Mar 2013

InvenSense, Inc. and Avnet Memec this week announced the formation of a pan-European distribution agreement. With the new partnership, Avnet Memec is chartered with sales and support for InvenSense’s MotionTracking devices throughout Europe and Israel.


Seven opto-sensor-discrete products achieved record sales in 2012

Thu, 3 Mar 2013

O-S-D’s marketshare of total semiconductor sales in 2012 was highest since 1991. Seven O-S-D product categories and device groups reached record-high sales in 2012 compared to 14 new records being set in 2011, according to data shown in the 2013 edition of IC Insights’ O-S-D Report.


Yoon-Woo Lee of Samsung Electronics to give keynote address at The ConFab 2013

Wed, 3 Mar 2013

Solid State Technology is proud to announce that Yoon-Woo Lee will be speaking at The ConFab 2013. The event will be held June 23-26, 2013 at The Encore at The Wynn in Las Vegas. Lee is the Executive Advisor of Samsung Electronics.


Avago MEMS Filter: The highest volume production MEMS using TSV

Wed, 3 Mar 2013

System Plus Consulting analyzed a BAW MEMS Filter manufactured by Avago Technologies, assessing its manufacturing process, costing results and breakdown. With more than 1 billion units produced per year and a market share of 65%, System Plus Consulting found that Avago Technologies clearly dominates the BAW filter market. Avago BAW filters are all-silicon MEMS devices manufactured with Avago's FBAR and Microcap technologies.


ATLIS Semiconductor selected as IBM Microelectronics’ long-term foundry partner for 180nm SOI technology

Tue, 3 Mar 2013

ALTIS Semiconductor, a global specialty foundry based in France, announced today the finalization of a foundry agreement with IBM Microelectronics. Under the terms of this agreement, ALTIS will be the foundry partner for the IBM 180nm SOI technology. ALTIS will deliver high volume products starting Q2 2013 and will secure capacity increase for 2014 and beyond to address the IBM forecasted demand.


MEMS microphone shipments to climb 30% this year

Thu, 2 Feb 2013

Shipments of MEMS microphones in 2012 amounted to 2.05 billion units, up 57% from 1.30 billion in 2011, according to IHS iSuppli. Shipments will climb by another 30% to 2.66 billion units in 2013, to be followed by at least three more years of notable double-digit-rate increases.


Brooks Instrument to launch new mass flow controller at SEMICON China

Thu, 2 Feb 2013

Brooks Instrument, a provider of flow measurement and control instrumentation to the microelectronics industry, will launch the GF135 pressure transient insensitive (PTI) mass flow controller at SEMICON China, March 19-21 at Shanghai New International Expo Center.


Emerging technologies create strong opportunity for automotive ICs

Wed, 2 Feb 2013

New automotive technologies that go beyond touchscreens, satellite radio, and voice-activated GPS commands are being tested and improved, and will soon begin to appear in many more new car models, resulting in solid growth for the automotive IC market through 2016.


STMicroelectronics is first $1 billion MEMS company

Wed, 2 Feb 2013

Yole Développement’s research has credited STMicroelectronics for capitalizing on the booming demand for MEMS in mobile devices by shipping 58% more MEMS units in 2012, to become the first company to reach $1 billion in MEMS sales.


Connecting the (quantum) dots

Tue, 2 Feb 2013

New spin technique moves researchers at the University of Pittsburgh and Delft University of Technology closer to creating the first viable high-speed quantum computer.


IDT announces world’s lowest jitter MEMS oscillators with integrated frequency margining capability

Tue, 3 Mar 2013

Integrated Device Technology, Inc. yesterday announced the industry’s first differential MEMS oscillators with 100 femtosecond (fs) typical phase jitter performance and integrated frequency margining capability.


“State of the MEMS Industry” market study to be presented at Smart Systems Integration Conference

Mon, 3 Mar 2013

Roger Grace to present MEMS Commercialization Report Card at annual international technical forum.


ASU scientists develop innovative twists to DNA nanotechnology

Mon, 3 Mar 2013

In a new discovery that represents a major step in solving a critical design challenge, Arizona State University Professor Hao Yan has led a research team to produce a wide variety of 2-D and 3-D structures that push the boundaries of the burgeoning field of DNA nanotechnology.


SPIE volunteers urge Congress to boost jobs, economy through photonics support

Mon, 3 Mar 2013

Volunteers sponsored by SPIE, the international society for optics and photonics, were in Washington, D.C., last week to thank Congressional representatives for recent support for photonics R&D and to urge future support for in several key areas vital to economic growth and scientific progress.


IME to address copper interconnects reliability issues at Copper Wire Consortium

Mon, 3 Mar 2013

The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR) in Singapore, has launched the Copper (Cu) Wire Bonding Consortium II. The consortium which rides on the successes of Phase I launched in 2010 aims to improve the reliability of semiconductor devices by tackling copper wire bonding issues related to corrosion and stress.


North American semiconductor equipment industry posts February 2013 book-to-bill ratio of 1.10

Fri, 3 Mar 2013

North America-based manufacturers of semiconductor equipment posted $1.07 billion in orders worldwide in February 2013 (three-month average basis) and a book-to-bill ratio of 1.10, according to the February Book-to-Bill Report published today by SEMI.  A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month.


MEMS new product development, critical design and process steps for successful prototypes (Part 1)

Fri, 3 Mar 2013

In the third article of the MEMS new product development blog, critical design and process steps that lead to successful prototypes will be discussed.


Non-volatile memory market report: Drivers and challenges of emerging memory technologies

Fri, 3 Mar 2013

Next generation memories are the emerging non-volatile memory technologies, which are expected to replace existing memories. However, not all existing memories will be replaced.


STMicroelectronics requests ITC investigation of InvenSense

Tue, 3 Mar 2013

STMicroelectronics yesterday filed a complaint with the United States International Trade Commission (ITC). The complaint requests that the ITC initiate an investigation into the alleged infringement of five ST patents covering all of InvenSense, Inc.'s MEMS device offerings, as well as products from two of InvenSense's customers.


China’s RFID card market to nearly double to $807 million in 2017

Tue, 3 Mar 2013

The futuristic “Internet of Things” will more than double to 2.1 billion units, leading to a dramatic growth of domestic companies, says Lux Research.


STMicroelectronics announces resignation of COO and Interim President, Didier Lamouche

Mon, 3 Mar 2013

STMicroelectronics announced today that Didier Lamouche, Chief Operating Officer, whose operational role was suspended when he took the assignment as President and Chief Executive Officer at ST-Ericsson in December 2011, has decided to resign from the company effective March 31, 2013 to pursue other opportunities.


OE automotive semiconductor market grew 12% in 2012

Mon, 3 Mar 2013

According to the latest analysis by Semicast Research, Renesas Electronics was again the leading vendor of semiconductors to the OE automotive sector in 2012, ahead of Infineon Technologies. STMicroelectronics retained its position as third largest supplier, with Freescale fourth and NXP fifth. Semicast calculates that revenues for OE automotive semiconductors grew by 12% to USD $25.5 billion in 2012, while the total semiconductor industry is judged to have declined by almost three percent to USD $292 billion.


Long-predicted atomic collapse state observed in graphene

Mon, 3 Mar 2013

Berkeley Lab researchers recreate elusive phenomenon with artificial nuclei; highly relevant for future nanoscle devices where electrical charge is concentrated into very small areas


Lattice announces world’s smallest FPGA

Mon, 3 Mar 2013

Lattice Semiconductor Corporation today announced the iCE40 LP384 FPGA, the smallest member of its iCE40 family of ultra-low density FPGAs. Enabling designers to rapidly add new features and differentiate cost-sensitive, space-constrained, low-power products, the new small footprint FPGA is ideal for applications such as portable medical monitors, smartphones, digital cameras, eReaders, and compact embedded systems.


Digi-Key Corporation and MEMSIC announce global distribution agreement

Fri, 3 Mar 2013

Global electronic components distributor Digi-Key Corporation today announced the signing of a global distribution agreement with MEMSIC, a provider of MEMS sensor components, sophisticated inertial systems, and leading-edge wireless sensor networks.


STMicroelectronics proximity sensor solves smartphone hang-ups

Fri, 3 Mar 2013

Smartphones are set to become even more flexible and more satisfying to use, thanks to a unique sensor system developed by STMicroelectronics. Combining three optical elements in a single compact package, the VL6180 is the first member of ST’s FlightSense family and uses a new optical-sensing technology that reduces the incidence of dropped calls and enables innovative new user interactions with smartphones.


Nanoelectronics Conference will focus on semiconductor industry’s future

Fri, 3 Mar 2013

How the semiconductor industry can create the next generations of nanoscale computing technology will be one of the themes of the 2013 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics, to be held at the National Institute of Standards and Technology (NIST), March 25-28, 2013, at its campus in Gaithersburg, Md.


Fujitsu releases new 1 Mbit and 2 Mbit FRAM products

Thu, 3 Mar 2013

Latest offerings enhance power efficiency and miniaturization for smart meters, industrial machinery and medical devices.


MEMS pressure sensors in cellphones set to rise to 681M units in 2016

Wed, 3 Mar 2013

Shipments this year are expected to double to 162 million units, as presented in the attached figure, primarily due to Samsung’s usage of pressure sensors in the Galaxy S4 and other smartphone models.


SEMICON West 2013 to address industry R&D challenges and opportunities

Tue, 3 Mar 2013

Dynamic changes to R&D processes, tools, technical challenges, and funding/business models will be highlighted at SEMICON West 2013, along with product displays of the latest semiconductor manufacturing technology, components and subsystems.


STMicroelectronics and CMP’s MEMS manufacturing process available for prototyping

Tue, 3 Mar 2013

STMicroelectronics and CMP today announced that ST's THELMA MEMS manufacturing process, the process ST uses for its industry-leading accelerometers and gyroscopes, which have shipped in billions of units, is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP.


Silex and BroadPak partnership produces 2.5D IC packaging capabilities

Tue, 4 Apr 2013

Silex Microsystems and BroadPak today announced the immediate availability of their jointly developed silicon interposer solution in high-volume manufacturing.


New miniaturization record by STMicroelectronics makes more room for mobile functionality

Mon, 4 Apr 2013

STMicroelectronics has introduced the world's smallest TVS diode for protecting sensitive electronics in consumer products and handhelds.


MEMS New Product Development Blog: Critical design and process steps for successful prototypes Part 2

Mon, 4 Apr 2013

The fourth article of the MEMS new product development blog is Part 2 of the critical design and process steps that lead to successful prototypes.  In the last article, the discussion focused on definition of the customer specification, product research, a solid model and engineering analysis to validate the design direction.  The continuation of this article reviews tolerance stacks, DFMEA, manufacturing assessment and process mapping.  


AIXTRON leads workpackage production in Graphene Flagship project

Thu, 4 Apr 2013

AIXTRON SE today announced that it is participating as a key partner in the recently announced European Union (EU) Future Emerging Technology (FET) flagship project “Graphene.”


Manchester leads the way in graphene membrane research

Thu, 4 Apr 2013

University of Manchester graphene researchers have been awarded a £3.5 million (or approximately US$5 million) funding boost that could bring desalination plants, safer food packaging and enhanced disease detection closer to reality.


How Samsung is climbing the charts

Thu, 4 Apr 2013

It’s no secret that Samsung is up against Apple in many ways, in products, sales and innovation. However, even in the face of Apple’s patent infringement lawsuits, Samsung is still climbing the charts.


STMicroelectronics heads European research team in advanced MEMS devices development

Thu, 4 Apr 2013

STMicroelectronics has begun working with research partners to develop a pilot line for next-generation MEMS devices augmented with advanced technologies such as piezoelectric or magnetic materials and 3D packaging. The project was launched by the European Nanoelectronics Initiative Advisory Council (ENIAC) Joint Undertaking (JU), a public-private partnership in nanoelectronics.


EU-funded SYNAPTIC project delivers design-synthesis tool flow

Mon, 3 Mar 2013

A joint industry/academia consortium, supported by the European Union's Seventh Framework Programme, has reported the successful conclusion of a three-year project and the release of its design-synthesis tool flow and related litho-friendly cell libraries and evaluation metrics.


American Graphite Technologies announces successful test production of graphene paper

Mon, 3 Mar 2013

American Graphite Technologies Inc. announced today the successful production of test samples of a graphene paper product by its development and manufacturing partner, CTI Nanotechnologies LLC.


Ericsson and STMicroelectronics agree on strategic way forward for ST-Ericsson

Mon, 3 Mar 2013

Ericsson and STMicroelectronics today announced an agreement on the way forward for the joint venture ST-Ericsson. As communicated by the parent companies in December 2012, both have been working together toward a strategic solution for the JV. After months of intensive joint work, the parent companies have selected the strategic option which maximizes their respective future prospects and growth plans.


Brewer Science installs scale-up reactor to support electronics-grade carbon nanotube materials

Mon, 3 Mar 2013

Brewer Science, a developer of lithography enhancement materials for semiconductor manufacturing, announces the installation of a scale-up reactor to increase production of its CNTRENE C100 family of electronics-grade CNT materials by tenfold.


KIT researchers develop smallest vibration sensor in the quantum world

Fri, 3 Mar 2013

Researchers of Karlsruhe Institute of Technology and French colleagues from Grenoble and Strasbourg have now found a way to combine both carbon nanotubes and magnetic molecules on the atomic level and to build a quantum mechanical system with novel properties.


$14 trillion opportunity in Internet of Things, predicts Cisco

Fri, 3 Mar 2013

Cisco Systems is preparing for a major shift in the industry, as the Internet of Things starts to become a reality. At an annual press event in San Jose, California this week, Cisco officials claimed that the much-anticipated IoT industry could be a $14 trillion opportunity, and they are ready to embrace the change.


Imec to offer fully integrated silicon photonics platform in a multi-project wafer service

Thu, 3 Mar 2013

Imec announced today the launch of its fully integrated silicon photonics platform through a cost-sharing Multi-Project Wafer (MPW) service via ePIXfab.


Nanoplas introduces a new class of dry-etching technology

Thu, 3 Mar 2013

Nanoplas, a global supplier of plasma processing equipment to the semiconductor industry, today announced a new dry-etch process offering virtually unlimited etch selectivity for removing dielectric films on microprocessors and memories at high throughput.


Coherent launches highest power UV laser for microelectronics manufacturing

Mon, 4 Apr 2013

The newest AVIA micromachining laser from Coherent, Inc. (Santa Clara, CA) delivers the highest power commercially available at its wavelength and repetition rate.


Pixelligent Technologies launches PixClear Zirconia nanocrystals for increased light output in touchscreens

Thu, 3 Mar 2013

Pixelligent Technologies, a manufacturer of nanocrystal additives for the electronics and semiconductor markets, last week announced the launch of its PixClear Zirconia nanocrystals. When incorporated into existing products, the nanoadditives can dramatically increase light output and readability of modern touch screens and displays.


Microstructures made of adjoining semiconductor disks could lead to powerful nanoscale sensors

Thu, 3 Mar 2013

Many users of microwave ovens have had the frightening experience of leaving a fork, crumpled piece of aluminum foil or some other pointy metal item inside the cooking chamber. The sharp metal object acts as an antenna for the oven’s microwave radiation, causing strong local heating or sparking.


Freescale Semiconductor installs Advantest's production platform for testing MEMS-based sensors

Thu, 3 Mar 2013

Semiconductor test equipment supplier Advantest Corporation entered the high-growth market for testing MEMS-based sensors by installing V93000 Smart Scale systems at several of Freescale Semiconductor's facilities around the world.


Chinese cellphone and tablet makers gain share in MEMS sensor purchasing in 2012

Thu, 3 Mar 2013

China-based manufacturers of cellphones and tablets in 2012 more than doubled their share of purchases of MEMS motion sensors, reflecting the rising prominence of the companies in the global market, according to an IHS iSuppli MEMS Topical Report from information and analytics provider IHS.


SiTime enters smartphone market with first MEMS oscillator

Wed, 3 Mar 2013

SiTime Corporation, one of the fastest growing semiconductor companies, today introduced the SiT15xx family of 32 kHz MEMS oscillators that are intended to replace legacy quartz crystal resonators.


New energy-efficient interface IC to provide voltage regulation for piezoelectric energy harvesters

Tue, 3 Mar 2013

Holst Centre and imec have developed an integrated piezoelectric energy interface IC with zero bias rectifier circuit and energy-aware supply regulator.


NAND flash market defies trends and grows to record level in Q4

Wed, 3 Mar 2013

Despite facing five consecutive quarters of decline and a slowdown in consumption in smartphones and tablets, the global market for NAND flash memory pulled off a surprise growth spurt during the last three months of 2012, causing sales to reach a record high.


Emerging consumer applications are boosting the growth of the MEMS pressure sensor market

Tue, 3 Mar 2013

MEMS pressure sensor is one of the very first MEMS components appearing in the microsystem world. The technologies are quite mature and the market is big and expected to grow from $1.9B in 2012 to $3B in 2018.


University of Central Florida launches new undergrad program in photonics

Tue, 3 Mar 2013

A new undergraduate program approved this week at the University of Central Florida (UCF) will help the U.S. stay competitive in global technology as well as broaden the path for students seeking rewarding careers in the important field of optics and photonics, say leaders of SPIE, the international society for optics and photonics.


Smallest MEMS microphone designed for hearing aid applications features low EIN and power consumption

Tue, 3 Mar 2013

Analog Devices ADMP801 MEMS microphone delivers 27 dBA EIN, consumes only 17 µA at 1 V supply, and is available in a 7.3 mm³ package.


Over 221 million mobile devices shipped in India during 2012

Tue, 4 Apr 2013

India registered 221.6 million mobile handset shipments during 2012, according to CMR’s India Mobile Handsets Market Review, CY 2012, March 2013 release. During the same period, 15.2 million smartphones were shipped in the country.


SUNY’s CNSE undergrad to receive the nation’s most prestigious award for science and engineering

Tue, 4 Apr 2013

Zachary Olmsted, a junior Nanoscale Engineering major at SUNY’s College of Nanoscale Science and Engineering (CNSE), has been chosen to receive the prestigious Barry M. Goldwater Scholarship, the second consecutive year that a CNSE student has been honored with the nation’s premier undergraduate award designed to foster and encourage outstanding students to pursue careers in the fields of mathematics, the natural sciences, and engineering.


High-value MEMS market growth slows due to weak medical electronics and industrial sectors

Tue, 4 Apr 2013

The high-value microelectromechanical system (MEMS) market experienced soft growth last year, mainly due to weakness in the mainstay medical electronics and industrial sectors, according to an IHS iSuppli MEMS High-Value MEMS Market Tracker Report from information and analytics provider IHS.


Nanosys expands U.S. manufacturing as demand for displays with lifelike color heats up

Tue, 4 Apr 2013

Nanosys, enabling a new generation of high color fidelity, energy-efficient displays with its quantum-dot technology, today announced that it has expanded into a new, high-capacity production facility in Milpitas, California.


Unsettled economic situation leaves mark on microtechnology industry

Tue, 4 Apr 2013

A year ago, the microtechnology, nanotechnology, and advanced materials industry looked out on the year 2012 with quite positive expectations. As it turned out, the unstable economic situation has left its mark on these industries, too. For 2013, at least, the companies expect a slight upwards trend.


MIT researchers observe nanowires lifting liquids as effectively as tubes

Mon, 4 Apr 2013

Imagine if you could drink a glass of water just by inserting a solid wire into it and sucking on it as though it were a soda straw. It turns out that if you were tiny enough, that method would work just fine — and wouldn’t even require the suction to start.


IITC Day 2: Backend memory, MEMS, 3D/TSV -- and no firearms

Mon, 6 Jun 2010

Techcet's Michael A. Fury continues his observations from this year's IEEE International Interconnect Technology Conference (IITC) meeting near San Francisco. From Day 2:  Back-end memory, MEMS, reliability/characterization, and posters spanning the breadth of interconnect topics, especially 3D TSV and MEMS integration.


IITC Day 1: 3D/TSV, Cu barrier films, critical collaboration

Fri, 6 Jun 2010

Techcet's Michael A. Fury continues his observations from this year's IEEE International Interconnect Technology Conference (IITC) meeting near San Francisco. From Day 1: Themes including variations on 3D and through-silicon vias (TSV), and barrier films for reducing copper electromigration.


Broad-based demand underpins brighter chip forecasts

Fri, 6 Jun 2010

Analysts speaking at a breakfast seminar near Boston agree that current chip sales estimates are "conservative" -- even after one of them breaks out new optimistic forecasts -- and strong demand is pulling the industry back into seasonal trends and more reliable growth patterns.


MRS Day 4: TSVs and CMOS+MEMS, wafer bonding, CNT interfaces, ALD for rare-earth HK, graphene redux

Mon, 4 Apr 2010

Highlights from Day 4 of the 2010 MRS Spring meeting, reported by Techcet's Michael A. Fury: TSVs and flexible interconnects for 3D CMOS/MEMS; 300mm BCB wafer bonding; carbon nanotube interfaces for interconnects and vias; phase-change memory devices; interfaces during ALD of rare earth-based high-k dielectrics; and graphene's use in on-chip interconnects and transparent conductor electrodes.


Keithley's latest system goes for ultra-fast I-V solution

Fri, 2 Feb 2010

Keithley exec Lee Stauffer explains how adding ultra-fast voltage waveform generation and current/voltage measurement capabilities to the company's Model 4200-SCS semiconductor characterization system benefits a range of applications, from flash memory to CMOS and MEMS.


Tegal-expands-ProNova-ICP-silicon-DRIE-reactor-family

Wed, 12 Dec 2010

Tegal Corporation (Nasdaq: TGAL) is launching a new member of its ProNova family of high-density inductively coupled plasma (ICP) reactors for the company’s DRIE series wafer processing products. The ProNova2 is targeted for fast-growing 200mm MEMS and 3D IC applications.


SEMICON West Exhibits Preview

Mon, 7 Jul 2010

Following are some of the highlights of the SEMICON West exhibit halls, open July 13-15 at the Moscone Center in San Francisco, CA. Products on display include TSV technology, ALD systems, vacuum and wafer transport tools, and more for semiconductor and package manufacturing.


SEMI reorgs, splits into three-way focus groups

Mon, 8 Aug 2010

SEMI has reorged into three groups to align its focus areas into IC manufacturing, solar photovoltaic (PV), and related/tangential markets including MEMS and LEDs.


SEMICON Taiwan welcomes French wafer fab equipment suppliers, research orgs

Fri, 9 Sep 2010

SEMICON Taiwan will say "bienvenue" to 10 companies from France, including research group CEA-Leti, international development agency UBI France, and suppliers like Satin Technologies and IBS.


Imec IEDM presentations to cover More than Moore, ITRS

Thu, 8 Aug 2010

16 papers with imec authors were accepted for IEEE International Electron Devices Meeting (IEDM), December 6-8, 2010, in San Francisco. Both ITRS-related as well as More-than-Moore-related research papers have been accepted, rewarding imec’s multidisciplinary R&D platform (featuring two state-of-the-art R&D fabs).


IEDM Reflections, Day 2: Graphene, RRAM, MEMS, and Jedi circuit designs

Fri, 12 Dec 2010

Techcet's Michael A. Fury continues with observations from the second day of IEDM 2010 presentations, examining papers on several graphene-based devices, a RRAM device stack on flexible substrates, using MEMS for RF channel switching, and Jedi tricks for post-FinFET circuit design.


SEMICON West: Roaming the floor, LEDs, CMP pads, kudos to Napoleon

Thu, 7 Jul 2011

Exotic pads for CMPs, flow meters with a nod to Napoleon, and driving down LED costs were among themes pursued by Techcet's Michael A. Fury on a walk through the SEMICON West show floor.


Intel, Samsung, Toshiba lead semiconductor sales

Mon, 6 Jun 2011

Semiconductor industry heavyweights Intel, Samsung and Toshiba (in that order) topped semiconductor sales so far in 2011, according to a report from ABI Research. As a whole, the semiconductor market should see about 4% growth during 2011.


UMC debuts 200mm Al BEOL fab process

Fri, 12 Dec 2011

United Microelectronics Corporation (UMC) launched the A+ technology platform, a specialized 0.11

IEST cleanroom apparel doc update includes measurement guide

Thu, 12 Dec 2011

The updated "Garment System Considerations for Cleanrooms and Other Controlled Environments" document includes new sections on measuring footwear, frocks and other garments, as well as a new subsection for tracking system use, such as RFID chips and barcodes.


Color displays could boost e-reader sales in coming years

Tue, 12 Dec 2011

Displays for pure-play e-book readers will see 108% higher shipments in 2011, but slower growth ahead. In the future, e-reader makers will turn to color display technologies, predicts IHS iSuppli.


EVG installs UV-lithography system at Asahi Kasei

Tue, 12 Dec 2011

Asahi Kasei E-Materials Corporation purchased an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EV Group (EVG).


ULVAC CVD-Co, -Ni system suits 3D gate, MEMS fab

Thu, 12 Dec 2011

ULVAC Inc. developed the ENTRONTM-EX2 W300 CVD-Ni/CVD-Co system for CVD-Ni and CVD-Co silicidation of 3D semiconductor gates and MEMS. The system is a response to a semiconductor industry transition from PVD to CVD in advanced 3D gate structure film step coverage, ULVAC reports.


IEDM 2011 slideshow: Sneak-peek at 10 conference papers

Mon, 11 Nov 2011

Ahead of next week's 57th IEEE International Electron Devices Meeting (IEDM, Dec. 5-7), we've scanned the entire program to present a quick slideshow sampling of some of the more intriguing papers.


STM: Semiconductor maker, MEMS specialist, venture capitalist?

Fri, 12 Dec 2011

STMicroelectronics (NYSE: STM), a global semiconductor company, launched ST New Ventures, its corporate venture capital fund currently under incorporation.


SEMICON West 2012: Submit an abstract today

Mon, 12 Dec 2011

SEMI is looking for presenters for technical sessions and other opportunities at SEMICON West 2012, July 10-12 in San Francisco, CA.


imec's IEDM papers reach "record number"

Wed, 12 Dec 2011

imec is presenting a record number of 17 papers at the IEEE International Electron Device Meeting (IEDM), ending today in Washington, DC.


Silicon semiconductor wafer shipments edged up from Q1 2010 to Q1 2011

Wed, 5 May 2011

Worldwide silicon wafer area shipments decreased slightly during the first quarter 2011 when compared to fourth quarter 2010 area shipments, and were marginally higher than first quarter 2010, according to the SEMI Silicon Manufacturers Group.


Rudolph's new F30 advanced macro inspection module wins foundry, MEMS orders

Mon, 4 Apr 2011

Rudolph's F30 module The F30 module offers improved throughput over the entire sensitivity range. Two European fabs, a leading Asian foundry, a leading MEMS producer, and a process equipment manufacturer that is developing an integrated inspection solution have ordered the Rudolph system.


Imec ITF: Vision systems entering a new era of digital optics

Wed, 5 May 2011

In an SST-exclusive series of blogs, imec reports from its International Technology Forum this week in Brussels. Francesco Pessolano, manager of imec's NVision program, reviews how digital optics can make future vision systems smaller, faster, cheaper, and more reliable.


DRIE tech transferred from Tegal to SPTS

Thu, 2 Feb 2011

SPTS completed the acquisition of deep reactive ion etch (DRIE) technology and certain related assets from Tegal Corporation. In addition, the deal includes the transfer to SPTS of the capital stock and operations of Tegal France SAS.


EVG-wins-SOI-order-from-Shenyang-Silicon-Technology

Wed, 3 Mar 2011

EV Group (EVG) received an order from new customer Shenyang Silicon Technology Co. Ltd. (SST). SST will use an EVG850LT automated production bonding system for silicon-on-insulator (SOI) wafers.


IC market to top $300 billion in 2013

Wed, 8 Aug 2011

The IC industry, which had a phenomenal growth year in 2010, is in a cautious mode under greater macro-economic uncertainty and hesitancy. Some positive milestones are on the horizon, however, shows data within IC Insight's Mid-Year Update, such as the 200 billion IC shipment milestone in 2011, and the $300 billion mark expected in 2013.


GlobalFoundries signs onto new A*STAR productivity enhancement program

Fri, 10 Oct 2011

Singapore has launched the Manufacturing Productivity Technology Centre at A*STAR's Singapore Institute of Manufacturing Technology. GlobalFoundries signed a 5-year Manufacturing Productivity Enhancement master plan agreement with SIMTech, working on materials recycling, wafer transport, and more.


SEMICON Taiwan preview: Forums span key technology, markets

Tue, 8 Aug 2011

SEMICON Taiwan (Sept. 7-9) approaches, the island's most celebrated event for microelectronics manufacturing, coorganized by SEMI and the Taiwan External Trade Development Council (TAITRA), offers more than 60 programs and sessions and 550 exhibitors spanning the entire semiconductor value chain and related high-growth industries.


Fab management, packaging, 450mm on our SEMICON Europa agenda

Tue, 9 Sep 2011

SEMICON Europa is coming up fast (Oct. 11-13), and SST (and some friends) will be reporting on-scene. Here's a summary of the presentations we're looking forward to, from the Fab Managers' Forum to conferences on test, packaging, MEMS, and hot topics including 3D ICs and 450mm.


SEMICON Europa 2011: Hopes for 2012 growth, no room for gloom

Thu, 10 Oct 2011

ATREG's Barnett Silver reports from SEMICON Europa, where the overall mood on the show floor is optimistic yet cautious, with hope for strong growth by mid-2012. Key themes include a slowdown in 200mm demand, an elite membership for 450mm, and keen interest in MEMS.


Flat silicon wafer shipments will pick up in 2012, 2013

Wed, 10 Oct 2011

While the market has currently softened, early-2011 momentum will carry the year's semiconductor silicon sales to a higher total than 2010, said Stanley T. Myers, president and CEO of SEMI, noting the figures are an industry record. Growth will continue at "modest levels" through 2013.


Qualcomm, Foxlink expanding MEMS work

Thu, 5 May 2008
May 8, 2008 - Qualcomm's MEMS subsidiary and Cheng Uei Precision Industry Co. Ltd. (dba "Foxlink") say they are opening a new dedicated fab in Taoyuan, Taiwan, to make Qualcomm's "mirasol" displays. The plant is slated to become fully operational in 2009.

IDM economics at 32nm and beyond

Wed, 5 May 2008
by Ed Korczynski, senior technical editor, Solid State Technology
May 21, 2008 - Masaaki Kinugawa, GM of Toshiba's Oita operations, discussed the tough challenges faced by fabs developing advanced processes today in his Confab talk, including increasing complexity of process and device technologies (and proportionally rising costs) -- and an ugly truth waiting around the corner at the 32nm node.

Two different approaches to integrated MEMS

Wed, 5 May 2008
by Dick James, Senior Technology Advisor, Chipworks
May 12, 2008 - After the 45nm hype of the last few months, let's go to the other end of the CMOS scale and examine some interesting MEMS devices that are leading the penetration into new markets like consumer electronics -- and would not have been manufacturable without the deep etching processes that have evolved over the last few years.

TSMC announces entry into MEMS market

Mon, 5 May 2008
May 5, 2008 - Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) has unveiled plans to enter the MEMS business, presenting a roadmap of the MEMS process and desires to cover trends in MEMS production at "CMOS integrated MEMS foundries," according to Nikkei Microdevices magazine.

MEMS at SEMICON West: Smaller consumer die creates need for new etch, clean processes

Mon, 6 Jun 2008
by Dr. Paula Doe, Contributing Editor, Solid-State Technology
New technologies in MEMS etching is one of the hot topics at this year's SEMICON West (July 13-17, San Francisco). Growing demand for MEMS systems in consumer gear means higher volumes and price pressures, so device-makers are shrinking geometry die to cut costs -- and the finer processes needed on those smaller die may require new kinds of etching and cleaning processes.

Researchers tout metallization technique with magnetic materials

Thu, 6 Jun 2008
June 26, 2008 - Researchers from the National Institute of Standards and Technology (NIST) say they have developed a process to build 3D nanoscale structures using magnetic materials, using techniques "compatible with semiconductor manufacturing," which they say could open doors to new classes of sensors and MEMS devices.

Analyst: MEMS sensor/actuator growth taking off

Fri, 3 Mar 2008
Mar. 28, 2008 - After growing at a 9% CAGR over the past five years, demand for MEMS-based semiconductor sensors and actuators is expected to accelerate to 19% CAGR through 2012, as emerging MEMS technologies find traction in new markets and applications, according to a report by IC Insights. The firm projects MEMS sensors/actuator sales will increase to $9.7B by 2012, vs. $4.1B in 2007.

Analyst: Silicon MEMS microphones demand stalls

Tue, 3 Mar 2008
Mar. 18, 2008 - The silicon MEMS microphone sector grew 12.4% in 2007 to 238M units, well off the pace of the prior two years (2005-2006) where installations doubled to account for 20% of mobile phones manufactured, due to a drop in cell phone growth and converged devices, according to a new report from The Information Network.

Freescale chairman/CEO stepping down

Fri, 2 Feb 2008
Feb. 8, 2008 - Michel Mayer, chairman and CEO of Freescale Semiconductor, is stepping aside, four years after joining the company and leading it through its spinoff from Motorola, subsequent IPO, and leveraged buyout. The company indicated that Mayer will stay on in his current role until the search for a new CEO is completed, and will remain chairman through the transition.

Test firms KVD, Unisem sharing US facilities

Mon, 2 Feb 2008
Feb. 4, 2008 - Unisem Berhad, a Malaysian semiconductor assembly/test services provider, has agreed to lease part of its facilities in Sunnyvale, CA, to KVD, a test supplier located down the coast in Carlsbad, CA, to use the site for analog test and final test/wafer sorting.

AMIS hands future "Smart Power" R&D to IMEC

Mon, 1 Jan 2008
Jan. 28, 2008 - AMI Semiconductor and European R&D consortium IMEC say they have entered into a new two-year program to develop AMIS' future 14T "Smart Power" platform technology, which will allow the creation of complex systems-on-chip integrating high-voltage and power functions with dense logic, processors and memories.

RF MEMS designer nails down $7M funding

Mon, 3 Mar 2008
Mar. 10, 2008 - WiSpry, a developer of programmable radio frequency (RF) semiconductor products, says it has tacked on another $7M to its Series B round of funding, for a total of $18M raised in the round. The funds will be used to transition from technology development into product qualification, the company noted in a statement.

Analyst: MEMS test equipment priorities: low-cost, standardized

Fri, 3 Mar 2008
Mar. 28, 2008 - In a sector dominated by expensive customized products, the best opportunities in the MEMS test equipment market are to develop cost-effective standardized technologies, according to a new report from Frost & Sullivan.

Will MEMS + nanoprobes succeed flash memory scaling?

Tue, 2 Feb 2008
by Debra Vogler, Senior Technical Editor, Solid State Technology
Feb. 5, 2008 - With flash process technology scaling approaching its limits, along comes Nanochip, a developer of MEMS silicon data storage chips, with a technology that does not use lithography in its manufacture. Company execs tell WaferNEWS about their planned >100GB/chipset products, which could start prototyping this year and be ready for manufacturing by 2010.

SEMI tips standards for FPDs, MEMS, chips

Wed, 6 Jun 2008
June 25, 2008 - SEMI has published four new technical standards targeting substrate and processes in LCD, MEMS, and semiconductor manufacturing, as part of its triannual standards update.

Suss swaps CEO over "differing" strategic views

Tue, 10 Oct 2008
Suss MicroTec has replaced board member and CEO Stefan Schneidewind with Christian Schubert effective immediately, citing "differing views regarding the future strategy of the company." A search for a new permanent CEO will take place.

Tegal+AMMS eyes growth in 3D packaging, MEMS

Mon, 9 Sep 2008
Tegal Corp.'s proposed acquisition of Alcatel Micro Machining Systems' (AMMS) deep reactive ion etch (DRIE) and plasma-enhanced chemical vapor deposition (PECVD) products is "a critical part of our growth strategy" to extend into higher-growth markets in 3D IC packaging and MEMS devices, the company asserts.

HP optimizes low-cost processing for inkjet printheads

Fri, 8 Aug 2008
One of the most common and most ignored types of chips is on almost every desk in this electronic world of ours -- the inkjet printhead. This edition of Chip Forensics examines a three-color printhead device out of Hewlett Packard's low-cost HP 60 Tricolor ink cartridge launched earlier this year.

Aviza's Cutini optimistic about 3D IC, MEMS market

Mon, 7 Jul 2008
Speaking at the SEMInvest forum on Monday, Aviza's CEO Jerry Cutini said that the MEMS and through-silicon-via/3D IC markets are finally starting to buy equipment in production quantities. He said these markets plus ALD represent a billion dollar TAM (total available market) by 2011 for all products, with a compound annual growth rate of ~18%.

TSMC approves capex, buyback plans

Mon, 8 Aug 2008
Taiwan foundry TSMC says its board of directors has approved new capex expenditures for 200mm and 300mm capacity, and a new stock buyback program.

Custom fit: Tronics surges in MEMS foundry sector

Fri, 4 Apr 2008
by Debra Vogler, Senior Technical Editor, Solid State Technology
April 18, 2008 - MEMS foundry and LETI spinoff Tronics Microsystems says its 2007 sales were nearly double the sector's CAGR for the year. WaferNEWS talked with them to find out how this custom component manufacturer is getting it done, what it feels is its key differentiator, and what it's working on next.

Freescale starts up 200mm MEMS line in TX

Mon, 1 Jan 2008
Jan. 14, 2008 - Freescale Semiconductor has established a new 200mm MEMS line at its Oak Hill fab in Austin, TX, complementing an existing 150mm MEMS line in Japan.

IEDM: IMEC touts 11MP micromirror array

Tue, 12 Dec 2008
Dec. 15, 2008 - In a paper discussed at this week's IEDM, researchers from IMEC reveal a monolithically integrated 11-megapixel 10cm2micromirror array, double the pixel density of comparable micromirrors, and a 10312 cycle mechanical lifetime, also a record, they claim.

Electroglas patents "active vibration cancellation" tech

Mon, 1 Jan 2008
Jan. 7, 2008 - Electroglas, a supplier of wafer probing systems for semiconductor manufacturing, has received a patent for its proprietary "active vibration cancellation" hardware and software algorithms.

Navigating the coming flood of used 200mm tools

Fri, 1 Jan 2008
Market analysts are projecting an imminent surge of 200mm wafer processing tools swamping the market, valued in billions of dollars each year through 2012. It seems clear that an extra 100 fabs will be for sale over the next few years, with MEMS and advanced packaging lines likely snapping up this extra manufacturing capacity -- but watch out if a used 200mm tool flood washes over into mainstream CMOS.

iSuppli: Auto MEMS sensors to surge by 2012

Mon, 9 Sep 2008
New government mandates will help nearly double the global shipments of automotive microelectromechanical systems (MEMS) from 2006-2012 (a 12% CAGR), while sales surge to $2.1B (8% CAGR), according to data from iSuppli.

Tegal to Acquire Alcatel's DRIE, PECVD product lines

Wed, 9 Sep 2008
Sept. 3, 2008 - Tegal Corp., a designer and manufacturer of plasma etch and deposition systems, has agree to acquire ' (AMMS) and Alcatel-Lucent's deep reactive ion etch (DRIE) and plasma-enhanced chemical vapor deposition (PECVD) products and related IP in a $5M in cash-and-stock transaction.

Tegal seeks "DRIE" land in MEMS

Tue, 9 Sep 2008
Tom Mika, CEO of Tegal, gives SST some further insights into his company's plans behind its proposed acquisition of Alcatel Micro Machining Systems' deep reactive ion etch and other technologies -- including how the company will leverage its existing presence in MEMS, finding the balance between serving R&D and production needs, and fighting much larger competitors.

Analyst: Next big MEMS market is cell phones

Thu, 7 Jul 2008
A new report from Yole Développement criticizes MEMS-based sensor and actuator firms for not figuring out how tap into what it says is the largest growth opportunity for MEMS devices over the next five years: wireless handsets.

Commercializing a WLCSP passivation layer solution

Mon, 8 Aug 2009
Lord Corp. exec Russell Stapleton talks with SST about the company's first-generation passivation layer solution for wafer-level chipscale packaging, due to launch in 1Q10.

DALSA to play major role in Quebec Microelectronics Innovation Center

Fri, 9 Sep 2009

DALSA Semiconductor VP/GM Claude Jean talks with SST about the new $218M microelectronics center being formed in Quebec, and how the company will contribute to its focus on MEMS and 3D wafer-level packaging and vice-versa.


Report: MEMS-based system market to generate $13B supply chain revenue in 2012

Tue, 8 Aug 2009
MEMS-based systems were a $46 billion business in 2008, and despite the recession MEMS-based systems should see 12% annual growth through 2012 to an $83 billion industry, meaning a $13 billion market for MEMS devices and the equipment and materials needed to produce them, according to a report on the MEMS supply chain from SEMI and Yole Développement.

ClassOne Equipment Purchases Assets of Colibrys MEMS Facility

Tue, 11 Nov 2009
Atlanta-based ClassOne Equipment, Inc., a supplier of refurbished equipment for the semiconductor and nanotechnology markets, has recently purchased all of the equipment assets of Colibrys’ MEMS facility in Stafford, Texas, outside of Houston.

MEMS sector takes hit from auto, economy slump

Mon, 3 Mar 2009
As the economy slogs along, big-ticket consumer purchases such as cars have dried up -- car shipments slipped 8% in 2008 and are expected to sink 19% in 2009. And that's bad news for, among others, suppliers of automotive electronics, notes iSuppli in a recent report.

Semefab building new 150mm MEMS fab

Thu, 12 Dec 2009

Scottish foundry Semefab says it is investing £6.6M (US $11M) ina new wafer fab for frontend processing of MEMS structures.


IMEC Tech forum: Leading-edge "insight," radio chips, multithreaded processors

Tue, 10 Oct 2009

Among a spate of presentations at IMEC's annual Technology Forum this week, the European R&D consortium trotted out a new program for foundries and fabless companies, an "incubation" pact with TSMC, and developments in multithreading and radio chips.


How CMP enables innovation in memory, 3D, MEMS

Wed, 8 Aug 2009
Robert Rhoades, CTO, Entrepix, describes the nontraditional technology behind TFT-dual gate memory and how CMP enables that innovation among others -- e.g., TSVs, 3D packaging, MEMS, and engineered substrates.

Foundries, IDMs will catalyze broad adoption of 3D/TSV and NIL

Thu, 1 Jan 2009
The macroeconomic issues that plagued the second half of 2008 will continue to impact the semiconductor and MEMS markets in 2009, specifically in segments that are automotive and consumer-product driven. Despite the effects, companies in these markets remain committed to innovation, and in turn, are expected to continue to invest in new manufacturing technologies (e.g., 3D/TSVs and nanoimprint lithography) to bring to market novel devices.

SVTC, Entrepix expand CMP work to 300mm

Wed, 1 Jan 2009
An extended partnership between SVTC and Entrepix widens their outsourced CMP services to 300mm wafers, for both semiconductor manufacturers and suppliers -- and, execs tell SST, gets them on an early track for growth areas several years down the road.

MRS Spring Day 3: DNA origami, silicon ribbons, self-assembled 3D cubes

Fri, 4 Apr 2009
In an exclusive daily blog for SST, Techcet's Michael A. Fury reviews talks about new technology in mobile phones; "DNA origami" self-assembly; hyperspectral imaging; single-crystal silicon ribbons; 3D patterned devices made with MEMS and self-assembly techniques; and the utility of "toys" based on electro-osmotic ionic flux.

Effective partnering and an outsourced service/process model needed in 2009

Thu, 1 Jan 2009
Looking ahead to 2009, we believe the semiconductor market will continue further down the newly split paths as announced in the 2007 ITRS Roadmap. That is, there are now two distinct groups of device manufacturers: 1) The leading edge (scaling) -- "More Moore," with a focus on 300mm and larger wafers, and 90nm and smaller technology nodes; and 2) functional diversification/mainstream -- "More than Moore," with a focus on 200mm and smaller wafers, and 90nm and larger technology nodes.

VC buys into analytical probe firm

Wed, 7 Jul 2006
July 19, 2006 - The Micromanipulator Co., Carson City, NV, a developer of analytical probe systems, said that venture capital firm Flywheel Ventures has purchased a majority ownership in the firm for an undisclosed amount, and will invest an extra $1 million in cash to support future growth and acquisitions.

Synova using extra funding for global expansion

Tue, 8 Aug 2006
August 15, 2006 - Synova, a privately held Swiss developer of water jet-guided laser technology, has secured an additional $8.1 million (CHF 10 million) in funding from Swiss banks, to help fuel its push to create several micromachining centers in key high-tech regions around the world.

Report from SEMICON West: MEMS going mainstream

Tue, 7 Jul 2006
The MEMS market is currently fragmented in terms of the types of devices being produced and the companies producing them, but over the next ten years MEMS components will increasingly be integrated into modules that will replace existing electronics systems, and manufacturing will be absorbed by mainstream semiconductor companies. That was the message delivered at SEMICON West by Jean-Christophe Eloy, GM of market research firm Yole Developpement.

MEMS sensor firm adds 150mm line

Wed, 10 Oct 2006
October 11, 2006 - Silicon Microstructures, Inc. (SMI), a developer of silicon pressure sensors, says it has ramped to 40,000 sensors/day on a new 150mm MEMS manufacturing line.

Japan's ULVAC testing C4NP molds

Mon, 9 Sep 2006
September 11, 2006 - Ulvac Coating Corp.'s glass MEMS division has demonstrated trial production of reusable glass molds used in C4NP (Controlled Collapse Chip Connection - New Process), the wafer bumping technology developed by IBM, according to the companies.

Packaging materials, CMOS integration promise best growth opportunities in MEMS market

Tue, 10 Oct 2006
A new report from SEMI and Yole Developpement Group finds several emerging trends in MEMS that promise new opportunities for chip companies and suppliers to expand their business. Integration of CMOS continues, with synergies in technology and processes flowing both ways. Demand for new supporting technologies is taking shape, particularly for packaging materials, and large chipmakers (including foundries) are lending legitimacy to the market with their increasing activity in MEMS development.

Omron buying Seiko Epson 200mm chip fab

Thu, 10 Oct 2006
October 26, 2006 - Automation and control technology firm Omron Corp. has agreed to acquire a 200mm CMOS semiconductor factory in Yasu, Shiga, Japan from Yasu Semiconductor Corp., a consolidated subsidiary of Seiko Epson. Terms of the deal were not disclosed.

Report: MEMS in handsets topping $1B by 2010

Tue, 5 May 2006
May 23, 2006 - Mobile handsets, the second largest market for semiconductors after PCs, also presents big opportunities for microelectromechanical systems (MEMS), with consumption poised to soar from $157 million in 2005 to more than $1.0 billion by 2010, according to a new report from In-Stat Inc.

UAlbany, Corrnell top nano institute rankings

Tue, 5 May 2006
May 23, 2006 - Ten US universities from New York to Texas to the midwest have been ranked as tops among universities' efforts in micro- and nanotechnology research, according to a survey conducted by Solid State Technology sister publication Small Times.

Purdue touts MEMS on-chip microcooler

Fri, 4 Apr 2006
April 28, 2006 - Scientists at Purdue U. have developed a MEMS-based micropump small enough to fit on a computer chip that circulates coolant through channels etched directly into the chip.

April 2006 Exclusive Feature: LITHOGRAPHY

Processing and characterization of a positive thick photoresist

Fri, 5 May 2006
By Shang-Chou Chang, Shen Chi Hsieh, Kun Shan U., Taiwan; Tsung Chieh Cheng , Bau Tong Dai, National Nano Device Laboratories, Taiwan

OVERVIEW There is increasing interest in the thick, positive, epoxy-based photoresist made of the material AZ P4620 because of its wide applications in micro-fluidic devices and micro-electromechanical systems (MEMS). The optimization of polymerization for this material under near ultraviolet (UV) lithography...

sp3 wins Fed deal to develop GaN on silicon/diamond

Thu, 6 Jun 2006
June 29, 2006 - sp3 Diamond Technologies Inc., Santa Clara, CA, a developer of diamond substrate technology for enhancing thermal management, has received a $750,000 Phase II contract from the Missile Defense Agency to develop gallium nitride (GaN) on silicon-on-diamond devices.

Interconnect startup scores $32M in funds

Wed, 6 Jun 2006
June 14, 2006 - NanoNexus, San Jose, CA, a developer of semiconductor interconnect technology, has secured $32 million in an oversubscribed Series A round of financing, with participation from new investor Cypress Semiconductor.

Fuji Photo buys Dimatix for inkjet technology

Tue, 6 Jun 2006
June 13, 2006 - Fuji Photo Film Co. Ltd. has agreed to acquire Dimatix Inc., a developer and manufacturer of industrial inkjet printheads, precision micropumps, and specialized print systems, for an undisclosed amount. The company develops systems for jetting fluids such as nanoparticle-based metallic and organic materials in applications such as microelectronic packaging substrates.

Soitec adds CEA-Leti spinoff's thin-film layer transfer tech

Thu, 6 Jun 2006
June 8, 2006 - Soitec, Bernin, France, has acquired CEA-Leti spinoff TraciT Technologies for an undisclosed amount, adding to its portfolio technology for thin-film layer transfers used in MEMS and power circuit production.

FlipChip, Engent to make 3D packaging tech

Fri, 5 May 2006
May 26, 2006 - FlipChip International LLC and Engent Inc. are partnering to develop 3D wafer-level CSP (WLCSP) technologies, seen as a low-cost alternative to system-on-chip for highly integrated stacked die packaging applications.

TEL tips MEMS tester

Wed, 4 Apr 2006
April 4, 2006 - Tokyo Electron Ltd. is offering a new wafer-level microelectromechanical system (MEMS) tester to help manufacturers isolate and validate electrical and mechanical functionality at the wafer level prior to packaging.

Test methods, safety, CD photomask spec on SEMI standards list

Mon, 6 Jun 2006
June 5, 2006 - SEMI has published eight new technical standards for the semiconductor, flat-panel display (FPD), and MEMS manufacturing industries, including safety guidelines for hydrogen peroxide storage and handling systems, specifications for critical dimension (CD) measurement information data for photomask manufacturing, and test methods for measurement of the resistivity of resin black matrix for LCD color filters.

X-Fab, Akustica partner for CMOS MEMS microphones

Thu, 6 Jun 2006
June 1, 2006 - Akustica Inc., a start-up that is developing acoustic components in silicon using micro-electromechanical systems (MEMS) manufacturing processes, has signed on with X-Fab Semiconductor Foundries AG to produce MEMS-based single-chip microphones.

Analyst: Probe card market nearing $1B in 2006

Thu, 6 Jun 2006
June 29, 2006 - After a 20% surge in 2005, the probe card market is expected to enjoy another solid year of growth in 2006 due largely for memory test needs, according to a new report from VLSI Research Inc.

AMD commits to 300mm fab in upstate NY

Mon, 6 Jun 2006
June 26, 2006 - In another vote of support for the US' semiconductor manufacturing industry, Advanced Micro Devices Inc. (AMD) said it will build a new 300mm semiconductor manufacturing facility in upstate New York, investing together with the state as much as $5.0 billion over the next few years.

IMEC, India groups tie knot for chip R&D

Mon, 11 Nov 2006
November 6, 2006 - European R&D consortium IMEC has signed memorandums of understanding with SemIndia and the Indian Institute of Science (IISc), moves that help solidify India's plans for developing into a semiconductor fabrication center, as well as IMEC's inroads into the region.

ST fires up 200mm MEMS line

Mon, 11 Nov 2006
November 27. 2006 - STMicroelectronics has inaugurated a new 200mm wafer fab line at its Agrate site near Milan, Italy, dedicated to manufacturing MEMS devices, saying it is the first major MEMS maker to make the devices on 200mm wafers.

Scottish MEMS program gets more funding

Mon, 2 Feb 2006
February 27, 2006 - Semefab is establishing a new design and development center for nanotechnology in its Glenrothes, Fife, operation, under a GBP15 million (US $26.2 million) project jointly managed by the Scottish Enterprise and the UK's Department of Trade and Industry.

Analyst: MEMS sales slowing, demand shifting

Tue, 4 Apr 2006
April 18, 2006 - Sales growth for MEMS devices slowed dramatically in 2005 despite "very strong" unit shipments, with demand increasing for newer markets outside the mainstays, according to a new report by In-Stat.

SVTC to expand into MEMS, help customers "get hands dirty," says exec

Tue, 2 Feb 2007
February 6, 2007 - The new owners of Cypress Semiconductor's Silicon Valley Technology Center bring two varied backgrounds of technology and services expertise, both of which will help the center expand into new areas such as MEMS, and possibly extend relationships with foundries, according to GM Bert Bruggeman, in an interview with WaferNEWS.

Cypress tabs UMC for 65nm SRAM manufacturing

Mon, 2 Feb 2007
February 26, 2007 - Cypress Semiconductor Corp. says it will contract with Taiwan foundry United Microelectronics Corp. (UMC) to produce its next-generation flagship SRAM products, continuing efforts to retreat from leading-edge manufacturing and development following the planned sale of its 65nm process R&D shop, the Silicon Valley Technology Center (SVTC).

The progeny of chip commoditization: Fab-lite AND process-lite

Tue, 4 Apr 2007
With silicon manufacturing fast becoming -- if not already -- a commodity, those who do not have IP and design as value adders will start dropping lower and lower on the food chain. That's ushering in a new class of "process-lite" firms that rely heavily on foundries for process development, according to Gartner analyst Dean Freeman, speaking at a SEMI lunch panel. And that makes life harder for equipment and materials suppliers.

Omron, Seiko finalize 200mm fab sale

Mon, 4 Apr 2007
April 2, 2007 - Omron Corp. has finalized its acquisition of a 200mm CMOS semiconductor factory in Yasu, Shinga, Japan, from Yasu Semiconductor Corp., a consolidated subsidiary of Seiko Epson., five months after announcing the deal, according to the companies.

Study: TI, inkjet print heads top MEMS drivers ranks

Mon, 4 Apr 2007
April 23, 2007 - Texas Instruments is the number one MEMS company worldwide thanks to its DLP chips business, raking in a record-setting $905 million in sales in 2006, nearly twice as much as No. 2 ranked Hewlett-Packard, according to German research firm Wicht Technologie Consulting. The firm's updated MEMS market survey also shows that HP led a pack of firms focusing on the biggest current MEMS cash cow: inkjet print heads.

Getter services for MEMS WLP

Mon, 4 Apr 2007
April 23, 2007 - Innovative Micro Technology has begun offering getter deposition services of wafer-level packaging (WLP) of MEMS devices and other components requiring a hard vacuum, saying it has demonstrated vacuum levels below 10 mTorr for inorganic devices, equal to or better than industry standard.

Analyst: Silicon MEMS microphones gaining adoption in phones

Thu, 4 Apr 2007
April 5, 2007 - Silicon MEMS microphones were installed in 20% of mobile phones manufactured in 2006, up from 10% in the previous year, but in reality there are only two suppliers who reap the benefits, according to data from The Information Network.

Synova, Manz Automation eye growth in PV sector

Tue, 4 Apr 2007
April 3, 2007 - Manz Automation AG, a laser process technology component supplier, and Synova SA, a privately held Swiss developer of water jet-guided laser technology, will integrate their technologies into manufacturing equipment for photovoltaics applications through a new technology licensing agreement.

Lam, DNS climb 2006 tool ranks

Wed, 4 Apr 2007
April 25, 2007 - The top 10 suppliers of semiconductor equipment remained largely unchanged in 2006, even though only half beat the entire equipment industry's 23% growth rate, according to new data from VLSI Research.

SEMICON WEST TiS PREVIEW: Quantum modeling software, diamond films, and nanoimprint tools start to go mainstream in semiconductors

Tue, 7 Jul 2007
Despite the fact that it's done much of its manufacturing in nanoscale dimensions for years, the semiconductor industry hasn't yet had much use for the unique nanoscale properties of the nanoparticles, nanowires, quantum dots, etc. usually considered nanotechnology, nor found much use for the nanoscale patterning processes developed by the chipmakers. But that may be starting to change, judging by the crop of emerging technologies selected for SEMICON West's Technology Innovation Showcase.

IMEC looks to the future as SEMICON West opens

Tue, 7 Jul 2007
As another SEMICON West opens, IMEC's experts discussed with WaferNEWS what they see are they major keys to the future of semiconductor industry: exploring new markets, bringing finFETs into manufacturing, mastering 3D integration, and addressing sub-32nm low-k deposition challenges.

FormFactor announces new test technology

Wed, 7 Jul 2007
July 18, 2007 - FormFactor Inc. has developed a probing contact technology capable of full-area wafer probing of high pin density, ultra-fine pitch devices, announced the company at SEMICON West.

Is a new business model in the works for small foundries?

Tue, 7 Jul 2007
Silterra recently announced an extension of its JDP with IMEC to create a foundry-compatible 90nm CMOS process technology, with the intent to further scale to 65nm. WaferNEWS caught up with both Silterra president/COO Tzu Yin Chiu and IMEC's Ludo Deferm to talk about the competitive landscape, and the larger issue of what smaller foundries need to do to withstand the industry's drive to consolidate.

FormFactor endeavors to reduce cost of test

Wed, 7 Jul 2007
In the past week, two announcements by FormFactor, provider of advanced wafer probe cards, illustrate the company's pursuit to bring down the cost of test by taking IC testing upstream to the wafer level. "The only cost-efficient way to test is to test on the wafer," stated Igor Khandros, CEO, FormFactor.

Big push coming on two routes to 3D

Fri, 7 Jul 2007
3D chip packaging with through-silicon vias (TSV) will sweep across the industry over the next 3-5 years, based on presentations and discussions at SEMICON West. Using TSVs will enable very compact packaging offering much better performance. Many chipmaker roadmaps include 3D as an interim step from the 45nm to the 32nm node, sources said.

Emerging PV and MEMS markets poised for growth

Wed, 7 Jul 2007
Photovoltaics (PV) and micro-electromechanical systems (MEMS) equipment and materials were singled out as emerging market growth leaders through the end of the decade by SEMI president and CEO Stan Myers, during a press conference on Monday detailing SEMI's new consensus market forecast.

SUSS spins off device bonder unit

Fri, 7 Jul 2007
July 27, 2007 - SUSS MicroTec has carved out its device bonder division through a management buyout initiated by SUSS France president Gael Schmidt, in order to gain independence from the parent company which has little strategic synergies.

ICOS introduces automated 300mm wafer handling system

Wed, 7 Jul 2007
July 18, 2007 - ICOS Vision Systems Corp. NV, Leuven, Belgium, has introduced its new HM-300 automated wafer handling system for 300mm wafers at the SEMICON West trade show. Key market segments for the new product are semiconductor ICs, optoelectronics, advanced packaging, and MEMS.

SAFC, memsstar pair for SPD precursor mats for nanocoatings

Wed, 7 Jul 2007
July 17, 2007 - SAFC Hitech, part of the Sigma-Aldrich Group, has signed a deal to supply standard precursor chemical materials for memsstar Technology's surface preparation and deposition systems, to develop surface coatings on microdevices such as MEMS.

Startup shows new diamond-coated wafers for MEMS

Mon, 7 Jul 2007
July 16, 2007 - Advanced Diamond Technologies, Inc. (ADT), a startup targeting development and applications for diamond films, is revealing new product lines of diamond-coated wafers at SEMICON West.

Cypress selling STVC R&D site to private equity firms

Tue, 1 Jan 2007
January 30, 2007 - Count one more chipmaker that's decided to get out of the leading-edge R&D rat-race. Cypress Semiconductor Corp. says it is selling its Silicon Valley Technology Center (SVTC) 65nm process R&D shop to a pair of private equity firms for approximately $53 million in cash.

Fab owners group adds trio to roster

Wed, 5 May 2007
May 30, 2007 - The Fab Owners Association (FOA), a collection of an association of mainly second-tier semiconductor manufacturers, has expanded its roster with the addition of three chipmakers: Austriamicrosystems AG (analog), Avago Technologies (analog+mixed-signal, opto), and X-Fab (mixed-signal foundry).

Final score: Half-Pitchers 0.00000035, Red Brick Walls 0.000000022

Tue, 7 Jul 2007
Looks like the US has a lot to learn from European soccer superiority, even in the nanoscale world. ETH Zurich took home three top prizes in last weekend's nanogram demonstration at the RoboCup games, placing first in all three skills tests -- a goal-to-goal "2mm dash" (316ms), slalom around fixed polymer photoresist posts patterned onto the "field" (583ms), and ball handling drill (3 goals in 3 minutes).

Alcatel, Tronics join for MEMS DRIE

Thu, 6 Jun 2007
June 7, 2007 - Tronics Microsystems SA and Alcatel Micro Machining Systems (AMMS) say they will jointly develop deep reactive ion etch (DRIE) systems for "extreme-performance" MEMS.

Japan's Sumitomo buys US MEMS etch firm

Thu, 6 Jun 2007
June 28, 2007 - Primaxx Inc., an Allentown, PA-based developer of MEMS etch equipment, has agreed to be acquired by Sumitomo Precision Products Co. Ltd., its partner in Japan for selling and servicing MEMS-CET etching products, for an undisclosed all-cash deal.

Synova, Disco to develop hybrid dicing tool

Thu, 6 Jun 2007
June 13, 2007 - Swiss firm Synova SA and the German subsidiary of Japan's Disco Corp. say they are developing a hybrid dicing tool that combines Synova's Laser Microjet water-jet-guided laser technology with Disco's blade-saw dicing technology, to give semiconductor customers a high-throughput tool that minimizes damage to silicon and advanced-material wafers.

More flavors season the consortia "stew" in a fab /process-lite environment

Mon, 5 May 2007
In a fab-lite/process-lite business environment, consortia would be expected to have even more power and responsibility as more companies rely upon a shared cost model for process and materials R&D. In addition to the usual consortia membership (IDMs, foundries, and equipment/materials suppliers), IMEC's director of strategic program partnerships, Lode Lauwers, expects memory manufacturers, and more recently, fab-lite converts, to add their own needs or "flavors" to consortia research programs.

SVTC, TSMC pave silicon R&D pathway

Wed, 5 May 2007
May 30, 2007 - Fulfilling one of the strategic plans laid out when spinning out into a standalone entity, SVTC Technologies -- nee the Silicon Valley Technology Center, which was sold by Cypress Semiconductor in February to private equity investors -- has announced a "technology incubation program" with top foundry TSMC.

ST, SAES Getters partnership eyes booming MEMS gyroscope biz

Thu, 5 May 2007
May 17, 2007 - STMicroelectronics and the SAES Getters Group say they will integrate SAES' PageWafer getter thin-film technology, used in high-vacuums in wafer-level packaged MEMS devices, into ST's next-generation MEMS gyroscopes, targeting consumer devices, gaming, and navigation devices.

Fab owners' group launches purchasing program

Mon, 6 Jun 2007
June 4, 2007 - The Fab Owners Association (FOA), a collection of an association of mainly second-tier semiconductor manufacturers, has formed a group purchasing organization, FOA Purchasing Partners Inc., to represent the FOA and its devicemaker members with procurement services for semiconductor manufacturing consumables.

Prescription for pure-play MEMS foundries outlined at MEPTEC

Tue, 5 May 2007
Seeking to accelerate the growth of the MEMS device market, CEO and founder of LV Sensors Inc. (LVSI), Janusz Bryzek, called for the formation of a world-class pure MEMS foundry business with customizable standard unit processes at last week's MEPTEC conference. These unit processes, characterized and modeled over a broad range of settings, would be enabled by state-of-the-art high-volume processing equipment with first pass process yields similar to what is achievable in CMOS manufacturing.

New study compiles European fab stats

Mon, 3 Mar 2007
March 19, 2007 - The firm Research and Markets has released a new market study that compiles European fab stats. The company found that Europe accounts for more than 280 production and research fabs active in one or more of the investigated technology fields, including ICs and MEMS. Also, Europe employs about 65,000 people related to fab manufacturing activity.

UK etch/dep firm going private

Mon, 8 Aug 2007
August 27, 2007 - Surface Technology Systems Plc (STS), a UK-based supplier of deep silicon etch and deposition systems, says its parent company Sumitomo Precision Products Co. (SPP) has offered to buy back the 37% of shares in the company it does not own, in order to register the firm as a private company.

Emerging MEMS manufacturers look beyond auto apps

Wed, 9 Sep 2007
September 12, 2007 - MEMS revenue will double from $5B in 2005 to $10B in 2011, with a "select group of large, well-established MEMS suppliers" benefiting from growth in the automotive sector, and "new, emerging entrants" to the MEMS market capitalizing on opportunities in consumer, communications, and portable end-product sectors, according to Semiconductor Partners.

Taiwan's MediaTek buying ADI's baseband chipset unit

Mon, 9 Sep 2007
September 10, 2007 - Analog Devices Inc. has agreed to sell parts of its baseband chipset division to Taiwan's MediaTek for $350 million in cash.

Outsourcing spreads for process development and manufacturing

Tue, 8 Aug 2007
Chipmakers are turning to collaborations and partnerships to help manage escalating costs, as well as compressed cycle times and margins brought by "consumerization." Part of their strategy involves expanding their use of outsourcing, especially for process development. Speakers at a SEMICON West panel discussed this increased interest in outsourcing, citing the benefits of flexible capacity, better IP management, and assurances that outsourcing is viable even in an industry slowdown.

Semefab expanding capacity for MEMS output

Tue, 8 Aug 2007
August 14, 2007 - Scotland's Semefab Ltd. says it has acquired the building next to its Fab 1 and Fab 2 operations, as part of an expansion phase to create 3000 sq. m of new cleanroom floorspace for MEMS frontend processing

Silicon Valley Technology Center becomes independent company

Fri, 3 Mar 2007
March 9, 2007 - Silicon Valley Technology Center (SVTC), a development foundry for silicon-based technologies, has announced it is now an independent company, having closed its previously announced purchase by two private equity firms.

FOA inks first "preferred vendor" agreements

Mon, 10 Oct 2007
October 22, 2007 - The Fab Owners Association (FOA), an association of mainly second-tier semiconductor manufacturers and suppliers, says its recently-formed purchasing organization, FOA Purchasing Partners Inc., has signed several agreements for services including logistics/transportation, cleanroom supplies, publishing, telecom services, B2B office supplies/equipment, and auto rentals.

Firm touts "breakthrough" for 32nm maskless litho

Sat, 9 Sep 2007
September 14, 2007 - Dutch firm Mapper Lithography says it has achieved "massively parallel electron beam writing" with its newest maskless litho technology, demonstrating 45nm dense patterns in resist.

Synova, Manz ready combined PV "edge isolation" system

Wed, 9 Sep 2007
September 5, 2007 - Synova SA and Manz Automation say they've created a hybrid tool combining their technologies: an inline laser edge isolation system for photovoltaic manufacturing of solar cells.

Who needs through-silicon vias?

Thu, 10 Oct 2007
Experts at the recent daylong International Wafer-Level Packaging Conference in San Jose expressed confidence that technology integration can create a manufacturable fab flow using through-silicon vias. But while 3D-WLP is already commercially viable, wire-bonding already can handle up to 16 chips, and two-level connections can be easily flip-chipped. So let's acknowledge the elephant in the room: besides MEMS and optoelectronics, does anyone really need TSVs for commercial ICs?

Bosch: Deep etch tools on target for 100µm/min throughput in 2-3 years

Mon, 10 Oct 2007
Deep etching equipment is about to make a big jump in throughput. Franz Laermer of Robert Bosch GmbH, inventor of the widely used Bosch process for deep reactive ion etching, told SST partner Nikkei Microdevices how faster volume production speeds will not only bring down the costs of MEMS devices to expand their use in consumer applications and wafer-level packaging, but will also make production of 3D interconnect with through-silicon vias practical.

Semicon Europa sneak peek: Tracking Europe's present, future in PV, R&D, TAP, MEMS

Tue, 10 Oct 2007
After bouncing around on the calendar and in venue, Semicon Europa, formerly a springtime event in Munich, Germany, is ready to open its doors next week in Stuttgart (conveniently at the same time as Germany's second-biggest beer festival, Cannstatter Volksfest...complete with multistory fruit tower). Here follows a quick scan of highlights from Europa's program schedule, and sessions you'll want to bookmark.

SVTC, SEMATECH's ATDF merge to expand R&D capabilities

Tue, 12 Dec 2007
December 4, 2007 - Months after significant reorgs on both sides, the SVTC (nee the Silicon Valley Technology Center) and SEMATECH's R&D foundry subsidiary Advanced Technology Development Facility (ATDF) in Austin, TX, are merging to expand their ability to offer an alternative to dedicated R&D fabs or shared development/production operations, months after both sides took steps earlier this year to reorganize and expand.

MEMS, packaging groups to support others' efforts

Mon, 11 Nov 2007
November 19, 2007 - The MEMS Industry Group, a trade association representing MEMS and microstructure industries, and the MicroElectronics Packaging and Test Engineering Council (MEPTEC) have formed a strategic alliance to support each other's goals and industry events, through a variety of marketing programs.

MCNC-RDI, Lucent team on nanotechnology for the DOD

Mon, 11 Nov 2004
November 1, 2004 - MCNC Research & Development Institute, a North Carolina-based nonprofit research organization, has contracted with Lucent Technologies to provide 3D interconnect technology as part of a joint R&D project for the US Department of Defense's Coherent Communications, Imaging, and Targeting (CCIT) program.

EV, Datacon combine bonder equipment

Thu, 10 Oct 2004
October 13, 2004 - EV Group, Scharding, Austria, and Datacon Technology AG, Radfeld, Austria, have agreed to jointly develop and market a new chip-to-wafer bonding platform combining their technologies.

AML: No more MEMS fabless model for us

Thu, 2 Feb 2004
February 19, 2004 - UK-based AML said it is abandoning the foundry model for fabricating MEMS devices, calling it a "flawed concept" and "not flexible enough" to meet its demands, and is reverting back to in-house fabrication.

SEMI releases new standards

Thu, 2 Feb 2004
February 5, 2004 - SEMI, San Jose, CA, has published 25 new standards governing various steps for manufacturing semiconductors and flat-panel displays.

Cypress acquires CMOS sensor firm

Tue, 6 Jun 2004
June 22, 2004 - Cypress Semiconductor Corp., San Jose, CA, has agreed to acquire FillFactory NV, a Belgium-based developer of active-pixel CMOS image sensor technology, for $100 million in cash.

IEEE, SEMI sit at MEMS table

Mon, 6 Jun 2004
June 7, 2004 - SEMI and IEEE have signed an agreement to support each other's efforts in creating nanotechnology and microelectromechanical systems (MEMS) standards, the first standards collaboration between the two organizations.

EV Group expands UV-nanoimprint consortium

Wed, 8 Aug 2004
August 25, 2004 - EV Group today announced that a major Canadian research organization has joined its nanoimprint lithography (NIL) consortium formed to commercialize this technology.

Euro firms combine for MEMS packaging

Tue, 4 Apr 2004
April 20, 2004 - Alphasem AG, a Swiss supplier of die attach equipment, has acquired Sister Semiconductor Equipment GmbH (SSE), Singen, Germany, in an effort to expand into both upstream and downstream processes.

CEA Leti and Thales form joint microwave microsystems lab

Thu, 9 Sep 2004
September 9, 2004 - Thales and the French atomic energy commission CEA have formed a new joint laboratory in Grenoble, France, to work on RF MEMS to design and develop high-power microwave microswitches and ICs based on them.

Akrion will ship multiple systems to major MEMS supplier

Wed, 5 May 2005
May 18, 2005 - Akrion Inc. today announced the receipt of several orders from a long-time customer, one of the world's largest suppliers of MEMS. The order, valued at more than $2.5 million, includes 2 V3 batch-immersion systems and an upgrade to an existing GAMA Series wet cleaning system.

STG and SEMI partner to offer online education for standards

Wed, 5 May 2005
May 18, 2005 -The Standards Technology Group Inc. (STG) and SEMI today announced a partnership to provide SEMI standards training and online courses to the semiconductor industry. Under the terms of the agreement, SEMI standards courses will be designed and presented by STG and marketed by SEMI. Seminars are now available for GEM300 and EDA standards.

View from Japan: MEMS players to watch

Mon, 3 Mar 2005
By Paula Doe, Contributing Editor

A crowd of Japanese suppliers are gambling that rising demand for MEMS devices for high volume products is about to spur a real volume market for production tools and services. There are now 20 Japanese companies offering microelectromechanical foundry services and 12 supplying MEMS etching equipment, according to a recent report from PennWell partner Nikkei Microdevices.

Panelists discuss MEMS growth challenges at Photonics West

Mon, 3 Mar 2005
By Debra Vogler, Senior Technical Editor

Whether it's pursuing MEMS in medical device applications, or MEMS/MOEMS for use in displays, communications, consumer products, lithography, or sensors and actuators - especially those used for toys - the opportunities for MEMS span sectors and industries. A panel discussion moderated by Edward Motamedi, CTO of Revoltech Microsystems, covered the challenges and possibilities for MEMS growth at Photonics West, held Jan. 22-27.

Heard at Europa: ITRS stewards seek clarity, consensus for Roadmap priorities

Tue, 5 May 2005
By Paula Doe, Contributing Editor, WaferNews

Key issues under discussion for the 2005 edition of the International Technology Roadmap for Semiconductors include the introduction of 450mm wafers, the problem of improving critical dimension control, and clearer definitions for half pitch to keep everybody honest, said regional committee chairmen in a press conference at the recent SEMICON Europa.

European collaboration will use SOI for MEMS fabrication

Fri, 4 Apr 2005
New technology developed by QinetiQ, Malvern, UK, is to be used by Tronic's Microsystems SA, Crolles, France, for the volume production of innovative micro-electromechanical system (MEMS) devices. The technology teams will collaborate to achieve process design and compatibility, including full process statistics.

Eight new SEMI standards cover FPDs and MEMS

Fri, 10 Oct 2005
October 13, 2005 - Semiconductor Equipment and Materials International (SEMI) has published eight new technical standards for the semiconductor, flat-panel display (FPD), and microelectromechanical systems (MEMS) manufacturing industries.

Fab owners form manufacturing alliance

Tue, 2 Feb 2005
February 8, 2005 - Nine global semiconductor companies, representing 500,000 200mm-equivalent wafers/month and $7 billion in combined annual revenues, have formed the Fab Owners Association (FOA) to identify problems and potential solutions for common manufacturing issues.

Europe seeks flexible solutions to minifab manufacture

Fri, 1 Jan 2005
High-volume production of standard devices that have a long lifetime, such as DRAMs, continues to move towards Southeast Asia. However, in other regions there is a growing need for very flexible "minifabs" that can be rapidly and economically set up to make low-volume products that have very short lifetimes.

MEMS industry group receives funding from DARPA

Thu, 1 Jan 2005
January 20, 2005 - The MEMS Industry Group (MIG) announced that it has received funding from the Defense Advanced Research Projects Agency (DARPA) to continue its MEMS Cost Assessment Tool (MEMS CAT) project, and has chosen ISMI to modify its software for MIG.

EV Group ships Gemini production wafer bonder to DALSA

Thu, 3 Mar 2005
March 24, 2005 - EV Group today announced that it has successfully installed a Gemini production wafer bonder at DALSA Corp.'s Semiconductor Division in Bromont, Quebec, Canada. The Gemini wafer bonder is designed for alignment and low-temperature plasma bonding for a wide variety of wafer types and sizes.

Oki retools chip lines to handle different wafer sizes

Wed, 3 Mar 2005
March 23, 2005 - Oki Electric Industry Co. has retooled the semiconductor manufacturing lines at Miyazaki Oki Electric Co. so that its three fabrication lines can handle different wafer sizes, said the Nihon Keizai Shimbun.

IME to create lab-on-chip using EV Group equipment

Thu, 8 Aug 2005
August 18, 2005 - EV Group, Scharding, Austria, has announced lab-on-a-chip (LoC) developments achieved at its Singapore customer Institute of Microelectronics (IME).

RSL opens packaging R&D lab with Suss MicroTec

Wed, 8 Aug 2005
August 10, 2005 - RoseStreet Labs (RSL), Phoenix, AZ, has announced the opening of its 3D Research and Development laboratory for next-generation semiconductor packaging, as well as an alliance with Suss MicroTec, which will provide the lab with a full suite of lithography and 3D packaging equipment.

August 2005 Exclusive Feature: DEPOSITION

Molecular vapor deposition of coatings for MEMS devices

Mon, 8 Aug 2005
Boris Kobrin, Victor Fuentes, Srikanth Dasaradhi, Applied MicroStructures; Robert Ashurst, Carlo Carraro, Roya Maboudian, U. of California at Berkeley

Results of a surface modification technique called molecular vapor deposition (MVD) are presented. The method is an enhancement of a generic vapor deposition process of self-assembling monolayers (SAM) with various surface preparation techniques, precise dosing of vapor precursors, and temperature control...

Transparent Networks moves to new HQ

Wed, 7 Jul 2002
July 17, 2002 - Milpitas, CA - Transparent Networks Inc., a developer of intelligent photonic switching systems, has expanded and relocated its headquarters from Santa Clara to Milpitas, CA.

European NanoBusiness Assoc. launches in Brussels

Thu, 4 Apr 2002
Brussels, Belgium - The European NanoBusiness Association has been launched with the goal of ensuring that Europe's strong scientific base in nanotechnology is successfully translated into innovative and dynamic European-based businesses.

Sandia and Ardesta: A partnership changed by 9-11

Thu, 8 Aug 2002
Roughly a year ago, Sandia National Laboratories, Albuquerque, NM, and Ardesta LLC, Ann Arbor, MI, announced a partnership aimed at transferring MEMS and microsystems technology to start-up companies in the commercial sector.

Jazz Semi partners with MEMSCAP for MEMS-based wireless ICs

Wed, 5 May 2002
May 29, 2002 - Newport Beach, CA and San Jose, CA - Jazz Semiconductor, an independent mixed-signal and RF silicon wafer foundry, has entered into a joint manufacturing and marketing agreement with MEMSCAP, a provider of MEMS solutions.

Europeans ponder: Whither MEMS?

Tue, 8 Aug 2002
While development of microelectromechanical systems (MEMS) has been going strong all over the world for at least a decade, Europe has been in the vanguard.

Veeco signs distribution agreement with Epion

Thu, 3 Mar 2002
March 7, 2002 - Woodbury, NY - Veeco Instruments Inc. has entered a distribution agreement with Epion Corp., a JDS Uniphase company, to distribute Epion's gas cluster ion beam (GCIB) product to the data storage, MRAM, MEMs, photomask, and wireless telecommunications markets.

US MEMS industry is growing rapidly, says MIG

Tue, 2 Feb 2002
"We are on our way" seems to be the sentiment coming from the MEMS Industry Group (MIG), which recently reported that the US MEMS industry will grow from 2000's $2 to $5 billion to an $8 to $15 billion industry by 2004.

Big excitement over tiny explosives

Thu, 1 Jan 2002
Chemists at U-Cal, San Diego have discovered that silicon wafers can be easily made into tiny explosives that might be used one day to chemically analyze samples in the field or serve as power sources for teensy electronic sensors the size of a speck of dust.

SiGen, Umicore partner for thick-SOI wafers

Tue, 1 Jan 2002
Jan. 22, 2002 - Campbell, CA - Silicon Genesis Corp. (SiGen), a developer of SOI wafer technologies, and Umicore, a Belgian-based metals and materials supplier, are collaborating to manufacture thick silicon-on-insulator wafers for electronic, photonic, and MEMS applications.

MEMS industry group and NEXUS form partnership

Thu, 11 Nov 2002
Nov. 21, 2002 - Pittsburgh, PA - The MEMS Industry Group (MIG), the trade association representing the North American MEMS and microstructure industries, and NEXUS, the European Microsystems Network, based in Grenoble, France, have announced that they have entered into a partnership to foster greater development and commercialization of MEMS and MEMS-enabled devices in Europe and North America.

NEXX Systems acquires All Wet Technologies

Wed, 4 Apr 2003
April 23, 2003 - Wilmington, MA - NEXX Systems has completed the acquisition of All Wet Technologies Inc. (AWT). AWT has developed electro-deposition technology for metal and photoresist. Arthur Keigler, president of AWT, joins NEXX Systems as VP of technology and board member.

TriQuint completes acquisition of optoelectronics biz from Agere Systems

Thu, 1 Jan 2003
Jan 2, 2003 - Hillsboro, OR - TriQuint Semiconductor Inc. has completed the acquisition of a substantial portion of the Agere Systems optoelectronics business for $40 million in cash.

Web broadcast to highlight impact of IC interconnects

Tue, 7 Jul 2003
July 1, 2003 - Dr. Kenneth A. Monnig, interconnects program associate director, International SEMATECH, will give the keynote presentation of the 3rd annual Surface Conditioning Process Symposium, held July 9-11, 2003, in Chaska, MN. Dr. Monnig's talk on the impact of challenges in IC interconnects on the semiconductor industry will be broadcast live on the Web via the Process Outlook Forum.

FEI scoops up firms

Thu, 7 Jul 2003
July 16, 2003 - FEI Co., Hillsboro, OR, has acquired two companies to complement its circuit edit and design-to-yield business.

Atmospheric-pressure plasma for surface prep/bonding

Fri, 10 Oct 2003
A new surface activation and wafer-to-wafer bonding process that uses atmospheric pressure plasma has been developed by SUSS MicroTec, eliminating the need for a vacuum chamber and associated process time.

MEMGen changes name

Tue, 9 Sep 2003
September 2, 2003 - MEMGen, Burbank, CA, has changed its name to Microfabrica, in order to more clearly define what the company does.

VLSI ranks 2002 probe card suppliers

Fri, 6 Jun 2003
June 9, 2003 - San Jose, CA - Advanced probe card technologies, including MEMS, continue to take a bite out of the semiconductor wafer test probe card market, according to a report from VLSI Research Inc., San Jose, CA.

Primaxx, ST Systems link for MEMS

Mon, 8 Aug 2003
August 4, 2003 - Primaxx, Allentown, PA, a manufacturer of thin film deposition and dry etch systems, has chosen ST Systems, Redwood City, CA, as the North American representative for its MEMS etching products. ST Systems will provide sales and service for Primaxx's MEMS-CET dry etch system.

MEMS group names leader

Tue, 9 Sep 2003
August 29, 2003 - The International MEMS Steering Group, a special interest group launched earlier this year by Semiconductor Equipment and Materials International (SEMI), has appointed Joseph Brown as its first chairman.

SMI finishes MEMS fab

Mon, 9 Sep 2003
September 16, 2003 - Silicon Microstructures Inc. (SMI), Milpitas, CA, says it has completed expansion at its MEMS wafer fab in Milpitas two months ahead of schedule.

Olympus forms MEMS division

Tue, 9 Sep 2003
September 15, 2003 - Olympus Optical Co. Ltd, Tokyo, Japan, has formed a new MEMS technology division to unify its MEMS activities.

Xicor Sells Milpitas Fab to Standard MEMS

Thu, 10 Oct 2000
Milpitas, California--Oct. 26, 2000--A definitive agreement has been signed by Xicor, Inc. to sell its Milpitas 6-inch wafer fab assets and inventory to Standard MEMS for approximately $12.5 million. Under a related agreement, Standard MEMS will become Xicor's fourth foundry.

RPI and Standard MEMS team up for micropackaging R&D

Tue, 12 Dec 2000
Burlington, Massachusetts--Standard MEMs, Inc. and Rensselaer Polytechnic Institute's Center for Automation Technologies have teamed up to create a joint micropackaging research and development (R&D) program that will focus on developing and prototyping state-of-the-art micromanufacturing technologies.

Fab joint venture announced

Mon, 9 Sep 2000
Itzehoe, Germany--Sept. 25, 2000--Standard MEMS, Inc. and Philips Semiconductors have announced a joint venture to build a MOS 8-inch wafer manufacturing facility for micro-electro mechanical systems (MEMS) and integrated discrete semiconductors in Itzehoe, Germany.

STMicroelectronics Acquires Waferscale Integration, Inc.

Thu, 9 Sep 2000
Geneva, Switzerland--Sept. 21, 2000--STMicroelectronics recently completed its aquisition of Silicon Valley-based Waferscale Integration, Inc., a leader in flash-based programmable system devices (PSDs).

JDS Uniphase to Purchase Motorola facility for MEMS Expansion

Wed, 6 Jun 2000
SAN JOSE, Calif.--June 14, 2000--JDS Uniphase Corp. announced a definitive agreement to purchase a North Carolina facility to expand its Cronos MEMS manufacturing capacity.

Cypress Acquires Silicon Light Machines

Fri, 7 Jul 2000
SAN JOSE, Calif.--July 27, 2000--Cypress Semiconductor Corporation has acquired Silicon Light Machines, moving Cypress into the optical networking market.

STMicroelectronics introduces MEMS-based rotational accelerometer

Mon, 8 Aug 2001
Aug. 20, 2001 - Geneva, Switzerland - STMicroelectronics has introduced a new rotational acceleration sensor device based on MEMS technology that addresses applications in hard disk drives and consumer products.

How to survive a downturn: Find hot niches

Tue, 9 Sep 2001
While the downturn in the chip industry has humbled even the mightiest semiconductor equipment companies, there are a handful of firms that have steered into good market niches. While no one is immune to this downturn, some companies are faring better than average due to management decisions fostering market adaptation based on core competencies.

Clare And Linear Dimensions team up to drive optical switching equipment

Wed, 9 Sep 2001
September 5, 2001 - Beverly, MA - Clare Inc. designer and manufacturer of high-voltage ICs, has entered into a product licensing and services agreement with Linear Dimensions Inc. to design, develop and market high-voltage linear amplifier products.

MEMS testing makes the grade

Wed, 8 Aug 2001
In recent months a trend has hit the semiconductor industry - and it has nothing to do with the economy or the downturn. While a few companies have earned money testing MicroElectroMechanical Systems (MEMS), it is a fairly new niche that is beginning to play host to companies throughout the chip industry.

Motorola moves ahead with the new accelerometer generation and MEMS technology

Mon, 10 Oct 2001
October 15, 2001 - Paris, France - Motorola and CEA-Leti, a department of CEA (Atomic Energy Commission of France), an R&D laboratory for MEMS products and technologies, have entered into an agreement to jointly develop and industrialize the next generation of surface micro-machined linear inertial sensors.

Modeling MEMS at Sandia

Wed, 11 Nov 2001
Modelers at Sandia National Laboratories are helping micromachine designers choose the device they want fully fabricated through new nano-modeling programs.

Mitsubishi Electric to ship MEMS samples

Tue, 9 Sep 2001
Mitsubishi Electric plans to start shipping samples of a new MEMS acceleration sensor chip set in October.

Equipment suppliers pursue MEMS opps

Wed, 12 Dec 2001
At a time when few business opportunities should be ignored, one is the infrastructure required for MEMS manufacturing. This is an area where growth has been limited by a lack of major support in key segments of the equipment industry. Although a number of suppliers recognized the business potential years ago, more work is needed.

MEMS-Industry Group trade association launches

Thu, 1 Jan 2001
Pittsburgh, Pennsylvania--A new trade association has been launched by leading microelectromechanical systems (MEMS) developers in the U.S. to represent the growing $2 billion technology sector. The association, MEMS-Industry Group, will function as a member-resource, sharing technology roadmaps, global market information, state of the industry reports, and acting as an advocate in public policy issues.

Suss enters new markets

Wed, 5 May 2001
May 2, 2001 - Munich, Germany - Drawing on the company's knowledge of MEMS equipment and probe systems, Karl Suss has added vacuum and cryogenic stations to its range of analytical probe systems.

August Technology expands wafer inspection applications to include MEMS and photonics markets

Tue, 3 Mar 2001
March 13, 2001--Bloomington, Minnesota--August Technology Corp. today announced that it has received orders for NSX Series inspection systems from two new U.S.-based customers with applications in the emerging markets of microelectromechanical systems (MEMS) and photonics.

From the Editor: Getting My Fix

Tue, 1 Jan 2008
I'm becoming an emerging technology junkie. One of the great things about my job is learning about new developments before everyone else in the world. Most of the time, I get to write about what I learned. Sometimes I don't. It's that word "embargoed" and the phrase "off-the-record" that hold me back. Eventually, I usually get to write about it — hopefully before anybody else does.

IMAPS Global Business Council's Spring 2008 Meeting Answers Industry Challenges

Wed, 1 Jan 2008
(January 30, 2008) WASHINGTON, DC — "Addressing Cost and Performance-driven Semiconductor Packaging through the Supply Chain." is the theme of this year's Global Business Council of the International Microelectronics And Packaging Society (IMAPS) Spring Meeting, set to take place March 17, 2008 at the Fort McDowell Resort, Scottsdale, AZ.

MEMS Forecast: Consumer Applications Drive Steady Growth

Wed, 1 Jan 2008
(January 30, 2008) PARIS — The latest market research released by Yole D

MEMS Software Tools

Tue, 1 Jan 2008
The schematic-based MEMS design environment ARCHITECT features a 3D visualization tool called Scene3D, which allows users to create 3D views of an ARCHITECT schematic and visualize simulation results with fully contoured 3D animations.

300-mm Wafer Bonding Tool

Tue, 1 Jan 2008
The GEMINI platform is a production manufacturing solution for high-volume wafer bonding applications for MEMS, 3D integration, and advanced packaging, as well as compound semiconductor applications.

Wafer Inspection Tool

Tue, 1 Jan 2008
Suited to inspection of MEMS devices, the AW200 Series C-SAM acoustic micro imaging system from Sonoscan performs automated inspection, analysis and sorting of bonded wafers up to 200-mm in diameter.

Automated Submicron Bonder

Tue, 1 Jan 2008
The FEMTO is the newest bonder in the FINEPLACER family, capable of handling the assembly and bonding of laser bars and diodes, flip chips, VCSELs, MEMs, sensors, micro-optics, surface mount photonics, as well as simple die attach.

Renesas Expands Back-end Facility, Establishes Design Company in Malaysia

Fri, 1 Jan 2008
(January 11, 2008) TOKYO — Renesas Technology Corp. has announced plans to expand its back-end process plant in Malaysia to further strengthen the company's analog and discrete semiconductor business. In addition, Renesas has established a new analog and discrete semiconductor design company in Malaysia to increase its design resources.

Freescale Establishes Advanced 200-mm MEMS Production Line

Mon, 1 Jan 2008
(January 14, 2008) TUCSON, AZ — Freescale Semiconductor has established an advanced microelectromechanical systems (MEMS) 200-mm (8-in.) production line to address growing sensors market demand. The newly added line at Freescale's Oak Hill Fab in Austin, TX, complements the company's existing 150-mm (6-in.) MEMS capacity in Sendai, Japan.

Tessera Licenses Consumer Optics Technologies to Nemotek

Wed, 1 Jan 2008
(January 16, 2008) SAN JOSE, CA — Tessera Technologies Inc. has announced that it has licensed its OptiML wafer-level camera (WLC) technology and SHELLCASE wafer-level chip scale packaging (WLCSP) solutions to Nemotek S.A. The combination of these consumer optics technologies enables Nemotek to offer a full range of cost-efficient camera solutions from wafer-level packaging of image sensors and wafer-level lenses to fully-integrated camera modules.

Freescale Selects 200mm SUSS Tool Set for MEMS Facility

Wed, 1 Jan 2008
(January 16, 2008) MUNICH, Germany — SUSS MicroTec has shipped and successfully installed several microelectromechanical systems (MEMS) production tools at Freescale Semiconductor. The equipment included a new DSM200 Series front-to-back alignment verification system, the latest generation SUSS MA200 compact mask aligner as well as a SUSS ABC200 series wafer bond cluster system for use in MEMS sensor applications.

Freescale Ramps Up with Advanced 200-mm MEMS Production Line

Thu, 1 Jan 2008
(January 17, 2008) AUSTIN — Freescale Semiconductor has established an advanced microelectromechanical systems (MEMS) 200-mm (8-inch) production line to address growing sensors market demand. The newly added line at Freescale's Oak Hill Fab in Austin, TX, complements the company's existing 150-mm (6-inch) MEMS capacity in Sendai, Japan.

Datacon Technology Joins EMC-3D Consortium

Wed, 4 Apr 2008
(April 9, 2008) Radfeld, AUSTRIA — EMC3D, an international semiconductor equipment and materials consortium dedicated to the cost-effective development of 3D through silicon via (TSV) interconnects, announced the addition of Datacon Technology to the organization. Datacon, manufacturer of die bonding & sorting equipment will provide high-precision assembly expertise to the consortium.

MEMS Accelerometers Find Multiple Applications

Thu, 4 Apr 2008
(April 10, 2008) Scottsdale, AZ — - MEMS accelerometers have hit the limelight with all the consumer applications in gaming devices, such as the Nintendo Wii, and smart phones like Apple's iPhone. But these popular products are only the high-profile advance wave of what will be a rising tide of new and innovative uses for the tiny motion sensors, says Douglas McEuen, senior analyst at ABI Research.

STMicroelectronics Introduces High-performance MEMS Motion Sensors

Tue, 4 Apr 2008
(April 15, 2008) GENEVA — STMocroelectronics, a supplier of the MEMS devices found in many gaming and mobile multimedia applications, announced the addition of two accelerometers to its ultra-compact portfolio of devices in 4

Lee to Deliver Keynote at MEPTEC MEMS Packaging Symposium

Fri, 4 Apr 2008
(April 18, 2008) Medicine Park, OK — Luke P. Lee, Ph.D., from the Department of Bioengineering at UC Berkeley has been selected as keynote speaker for MEPTEC's 6th Annual MEMS Packaging symposium titled "MEMS Market Evolution: From Technology Push to Market Pull" on May 22, 2008. This one-day event will take place at the Wyndham Hotel, San Jose, CA.

SEMI Publishes Eight New Technical Standards

Tue, 2 Feb 2008
(February 12, 2008) San Jose, CA — SEMI has published eight new technical standards applicable to the semiconductor, flat panel display (FPD), and MEMS manufacturing industries. One of the standards, the SEMI MS6, provides a guide for design and materials for interfacing MEMS microfluidic systems.

Slotting MEMS Inkjet Devices with Water-jet Guided Lasers

Wed, 2 Feb 2008
By Tuan Anh Mai, Ph.D. and Bernhold Richerzhagen, Ph.D., Synova
February 20, 2008 — Inkjet printer heads hold one of the largest shares of the MEMS market. Printer manufacturers generally use thermal bubble jet technology or piezoelectric jet technology. A silicon chip is used as a barrier between the orifice plate, which contains hundreds of nozzles, and the ink reservoir.

Yole Releases WLP Report

Fri, 2 Feb 2008
(February 15, 2008) Lyon, France — Yole Developpement has just released a new report entitled "WLP & Embedded Die Technologies 2008". This report presents the manufacturing challenges faced by the wafer level packaging industry in terms of MEMS, CMOS image sensors and semiconductor ICs.

SEMICON West Courses Announced

Tue, 2 Feb 2008
(February 19, 2008) — Going to SEMICON West? PTI Seminars and SEMI have announced semiconductor courses at the San Francisco show in July. Some courses of interest include: Fundamentals of MEMS Design and Fabrication, Introduction to Chip and Wire Assembly in Microelectronics Packaging, and Low-cost Flip Chip, WLCSP, and Lead-free Technologies.

Georgia Tech orders STS DRIE Tool for Nano and MEMS Research

Tue, 2 Feb 2008
(February 26, 2008) NEWPORT, WALES and ATLANTA, GA — Surface Technology Systems (STS)announced that Georgia Institute of Technology (Georgia Tech) ordered a Pegasus Deep Reactive Ion Etch (DRIE) tool for their new Nanotechnology Research Center Building (NRCB), which is due for completion in fall 2008. Georgia Tech is the first university to acquire the latest generation of STS' advanced silicon etch (ASE) systems.

New Analysis Estimates MEMS Market to Reach $120.2M in 2014

Thu, 3 Mar 2008
(March 27, 2008) PALO ALTO, CA — If the MEMS test equipment market is to match the pace of the overall MEMS market, it has to develop cost-effective, standardized solutions. This is especially pertinent in a market where expensive customized products vastly outnumber off-the-shelf products. New analysis from Frost & Sullivan "World MEMS Test Equipment Markets," finds that the market earned revenues of $56.5M in 2007 and estimates this to reach $120.2M in 2014.

Vietnam - Chipscale Advanced Packaging Services Receives Certification

Wed, 5 May 2008
(May 14, 2008) Hanoi, VIETNAM — Vietnam-Chipscale Advanced Packaging Services, an outsource semiconductor assembly and test services provider based in Vietnam, has been presented with its investment certificate from th Vietnamese government, recognizing the company as a 100% foreign owned venture.

EV Group Expands Presence in Korea

Wed, 5 May 2008
(May 14, 2008) St. Florian, AUSTRIA — EV Group, equipment manufacturer for semiconductor, MEMS, and nanotechnology applications, announced the opening of a subsidiary, EV Group Korea Ltd., in Seoul, Korea to serve as a direct-to-customer site for sales, service, and support efforts for EVG's existing and potential new customer base. The subsidiary will reportedly house sales, service, process/application and administrative capabilities.

Wet Copper Seed Deposition Process Spells the End for PVD in TSV Construction

Mon, 5 May 2008
By Steve Lerner, CEO, Alchimer
It seems hard to believe that in just half a century the semiconductor industry has emerged from obscurity to become a key indicator for global economic prosperity. In that time it has developed a cyclic nature; periods of high growth followed by periods of low (or even negative) growth that, due to our overriding dependency on semiconductors, now impacts greatly on the developed world.

Standardization of Automotive MEMS Sensor Tests

Mon, 5 May 2008
Cost Pressure Switches from Consumer to Automotive Applications
By Andreas Nagy, Multitest
For every semiconductor company, final test and quality control adds cost without adding additional functional value to their product. That is why cost of test is constantly under pressure. In the early days of MEMS, cost-per-unit were not considered that critical, as MEMS prices were sometimes lower then traditional sensor prices by a factor of 100.

AML Ships R&D and Production Systems

Tue, 7 Jul 2007
(July 3, 2007) DIDCOT, OXON, U.K. — Applied Microengineering Ltd. (AML) won a European tender to supply Fraunhofer Institute for Mechanics of Materials (IWMH — Halle, Germany) with a wafer bonder for R&D, and an order from Semefab (Scotland, U.K.) for a production-volume bonder for use in MEMS manufacture.

TechXPOT at SEMICON West: MEMS

Mon, 7 Jul 2007
(July 16, 2007) SAN FRANCISCO — Discera, Inc., chief technology officer (CTO) Wan-Thai Hsu will present "The New Heart Beat for Electronics — MEMS Oscillators," at the Emerging Technologies and Markets TechXPOT, July 18, during SEMICON West, July 16–20 in San Francisco.

DALSA Semiconductor to License Alchimer's eG ViaCoat Technology

Mon, 12 Dec 2008
(December 15, 2008) BROMONT, Canada and MASSY, France —DALSA Semiconductor, supplier of specialized and custom wafer foundry services announced successful tests creating conformal copper seed layers on through-silicon via structures (TSVs) using the eG ViaCoat process from Alchimer S.A. As a result DALSA reportedly intends to license Alchimer's technology to enhance its MEMS production capabilities.

MEMUNITY Announces 8th Workshop on Wafer-Level MEMS Testing

Fri, 2 Feb 2008
(February 1, 2008) Dresden, GERMANY — Following a successful series of events held in Europe, MEMUNITY has announced its eighth workshop under the title "Critical Success Factors for Commercialization: Production Test of MEMS at Wafer Level". The workshop will be held on March 13 at the Institute for Microelectronic and Micromechanical Systems (IMMS) in Ilmenau, Germany.

Unisem, KVD Partner to Share US Testing Facilities and Equipment

Mon, 2 Feb 2008
(February 04, 2008) SUNNYVALE, CA — Unisem Berhad today announced that KVD, a provider of test solutions for the analog-dominant device market, will be leasing part of Unisem's Sunnyvale testing facilities for KVD's analog testing services and solutions for final test and wafer sorting. KVD will have its own engineering staff onsite and will utilize Unisem's onsite training facilities to provide classes for engineers and operators.

IIT Bombay Selects EV Group Bonders for Micro-Fabricated Sensor R&D Project

Tue, 2 Feb 2008
(February 5, 2008) St Florian, Austria — EV Group (EVG) has announced it has received an order from the Indian Institute of Technology (IIT), Bombay, for two of EVG's MEMS-focused systems. The systems will be for a new Indian government-supported automotive MEMS R&D project and are slated for installation this month in IIT Bombay's Mumbai facility.

In The News

Mon, 5 May 2006
SAN JOSE, CA - In response to the success of Technology Innovations Showcase (TIS), SEMI has expanded the idea, introducing TechXPOTs to SEMICON West 2006, July 11-14 at the Moscone Center in San Francisco, CA.

3-D Integration of ICs

Sun, 5 May 2005
NEW PRODUCTION TECHNOLOGIES

Growth Markets for Advanced Packages

Wed, 6 Jun 2005
Summertime offers lots of opportunities to look at new markets, refocus on those in the past, and regroup in general.

In the News

Sat, 7 Jul 2006
With silver prices almost double what they were in the fourth quarter of 2005, materials costs are starting to be affected.

Extreme-Environment Electronics for the Future

Fri, 4 Apr 2005
Electronics have dramatically changed the way we live, conduct business, communicate, and educate.

What Is IC/Package Co-design?

Fri, 4 Apr 2005
Enabling Global Optimization & Characterization of Design

Is ‘Packaging’ a Valid Academic Subject?

Sun, 5 May 2005
The answer is yes. First, we need to define ‘packaging.

A New Hierarchy for Electronic Interconnections

Fri, 9 Sep 2006
The hierarchy of electronic interconnections has undergone some significant changes over the last several years.

MEMS Packaging Update

Thu, 9 Sep 2005
Providing a foundation for future packaging advancements

MEMS: Poised for Success

Sat, 10 Oct 2005
Diving competitions always draw my attention. Having the courage to align one’s body in a head-downward position from a precipice high above the water seems illogical, risky, and difficult.

To Infinity and Beyond

Tue, 4 Apr 2008
When it comes to semiconductor and MEMS devices, it is well-known that the industry is experiencing certain limitations – whether they are related to functionality, reliability or cost.

THE WEEKLY WRAP FROM WAFER NEWS

Wed, 9 Sep 2003
Privacy groups could slow down RFID chip growth The optimism surrounding Wal-Mart's June announcement that strongly encouraged its top 100 suppliers to start using radio frequency identification (RFID) tags by 2005 (see WaferNews, V10n24, June 16, 2003) may have been premature.
(September 17)
Click here for these and more WaferNews briefs.

THE WEEKLY WRAP FROM WAFERNEWS

Wed, 10 Oct 2003
Mid-4Q updates: Happy holidays for chipmakers
(December 15, 2003) Halfway through the current fiscal quarter, several big chipmakers are spreading holiday cheer with revised financial outlooks — but one chipmaker will also receive a lump of coal in its stocking.

Developing MEMS for Marine Sensors

Wed, 11 Nov 2006
MEMS is an enabling technology allowing for the development of smart products, augmenting the computational ability of microelectronics with the perception and control capabilities of microsensors and microactuators and expanding the space of possible designs and applications.

In the News

Sun, 8 Aug 2004

Trends in Wafer-level Packaging of MEMS

Thu, 4 Apr 2004
Microelectromechanical systems (MEMS) are miniaturized systems with electrical and non-electrical components.

In the News

Tue, 11 Nov 2005

Advances in MEMS Packaging

Thu, 4 Apr 2004
The microelectromechanical systems (MEMS) component market size is forecasted to continue growing over the next few years. This article presents design considerations to provide a better understanding of the unique challenges facing MEMS packaging engineers, when compared to traditional IC packaging. Automatic MEMS assembly requires optimized equipment and processes.

Technology Drivers Still Changing the Packaging Industry

Fri, 10 Oct 2004
Those involved in the packaging industry are quite familiar with two key technology drivers: Moore's Law (which dictates that the number of transistors will double in an IC every 24 months), and the increasing need to pack more capability (MIPs, Mbytes, GB/sec) into less space.

Standard Open Tool Packages for MEMS-enabled Products

Wed, 9 Sep 2004
MEMS DESIGN SOFTWARE SPEEDS PRODUCTION

In the News

Thu, 7 Jul 2004

MEETING REPORT

Tue, 5 May 2002
Updates on folded flex and thin packaging at ICAPS
RENO, NEV.
The International Microelectronics and Packaging Society held its first International Conference on Advanced Packaging and Systems (ICAPS) in March in Reno. The event featured sessions on most critical areas of advanced packaging technology, including design and test, 3-D packaging, MEMS packaging, and thermal management. Tabletop exhibits accompanied the two parallel technical sessions.

ESEC Introduces 5 µm Die Attach Solution

Fri, 8 Aug 2002
Cham/Switzerland, July 17, 2002 - ESEC, a leading provider of chip-assembly equipment and system solutions for the semiconductor industry, announces the introduction of a 5 µm Die Attach solution on its Micron 5003 Die and Flip Chip Attach Machine. This tool fulfills an important request from ESEC's customers and will insure more accurate bonding performance and overall superior results.

IN THE NEWS

Sat, 3 Mar 2008
Setting the tone for the 9th annual BITS Workshop, March 9-12, Mesa, AZ, with a presentation entitled “Packaging & Assembly in Pursuit of Moore’s Law and Beyond”, keynoter Karl Johnson , Ph.D., V.P and senior fellow at the advanced packaging systems integration laboratory, Freescale Semiconductor, will address new challenges, trends in packaging and assembly, and some unique solutions including system-on-chip (SOC) , 3D, system-in-package (SiP) and wafer-level assembly.

IN THE NEWS

Tue, 1 Jan 2008
STAMFORD, CT - A glut in the DRAM market, slower than expected growth in NAND spending, and concerns about a U.

IMAPS inaugurates president for 2004

Wed, 11 Nov 2003
(November 19, 2003) Boston, Mass.—Yesterday, at its annual meeting held in Boston, the International Microelectronics and Packaging Society - North America (IMAPS) inaugurated Phillip J. Zulueta as president for the 2004 term.

Wafer Probe Card

Fri, 12 Dec 2007
The TrueScale PP40 wafer probe card is designed to enable high-efficiency and high parallelism wafer probing on advanced wire bond logic and SoC devices. By supporting pad pitches down to 40 microns, this probe card allows IC manufacturers to shrink the size of their test pads, enabling some users to retain a single-row pad layout.

April '06 Book-to-Bill Ratio Continues Climb

Mon, 5 May 2006
San Jose, CA — On a 3-month average basis, North American-based semiconductor equipment manufacturers posted $1.60 billion in orders and a book-to-bill ratio of 1.11 in April 2006, according to SEMI's April 2006 Book-to-Bill Report.

Freescale Orders SUSS Production Wafer-bonding System

Thu, 5 May 2006
Munich, Germany — Freescale Semiconductor recently ordered one of SUSS MicroTec's ABC200 automated production wafer-bonding systems. Silicon wafer bonding is a critical wafer-level packaging technology and an enabling technology for the mass production of cost-effective MEMS accelerometers for Freescale, so SUSS' automated production wafer bonders ideally suit their needs.

FlipChip International and Engent Form Strategic Alliance

Fri, 5 May 2006
Phoenix, AZ — Aiming to speed up development and deployment of 3-D wafer-level chip-scale packages(WLCSP) for integrated stack-die packages, FlipChip International (FCI) and Engent have formed a strategic alliance. FCI specializes in wafer-level bumping, while Engent's focus is 3-D flip chip assembly.

Digital Hearing Aids Adopt RF

Fri, 7 Jul 2006
(July 7, 2006) POCATELLO, ID — Interton, a hearing aid system manufacturer, has selected AMI Semiconductor (AMIS) to develop advanced wireless capabilities for hearing aid devices. The battery life expectancy for hearing devices complicates additions of wireless technology; therefore, AMIS will develop ultra low-power radio frequency (RF) subsystems for devices.

Micralyne Expands with SUSS

Mon, 7 Jul 2006
(July 10, 2006) EDMONTON, Alberta — Micralyne, a MEMS components manufacturer, announced it has purchased SB6e wafer bonder and BA6 aligner systems from SUSS MicroTec, Inc.

Infotonics' MEMS Facility Selects Eyelit's Integrated MES and QM Software Suite

Thu, 11 Nov 2007
(November 08, 2007) TORONTO, Canada — Infotonics Technology Center (ITC) in upstate New York has selected Eyelit's Enterprise Manufacturing Execution (MES) and Quality Management Software Suite for improving overall process control in Infotonics collaborative manufacturing facility. Eyelit Inc. is a manufacturing software provider for visibility, control and coordination of manufacturing operations.

Early MEMS Accelerometer Adopters See Profits Roll In

Thu, 11 Nov 2007
(November 15, 2007) SCOTTSDALE, AZ — Accelerometers — devices that sense motion — have been with us for a long time, but only recently have they have been miniaturized as silicon-based devices. Consumer electronics makers who saw their hidden potential and built new products such as Nintendo's Wii, Apple's iPhone, and Activision's "Guitar Hero" game around them have achieved huge market success by revolutionizing the user-interface.

MEMS Congress Grows as Applications Abound

Mon, 11 Nov 2007
By Gail Flower, Editor-in-Chief

On November 4–5, 2007, the MEMS Congress met in San Diego to discuss new applications and future technology challenges for MEMS with keynotes and panel discussions. Last year's gathering numbered 110 participants; this year it grew to 150 attendees. Day one was taken up with social events: a golf outing and a wine and beer tour, and ended with a reception for worldwide attendees.

Joanne Solomon Named Amkor Technology CFO

Mon, 11 Nov 2007
(November 19, 2007) CHANDLER, AZ — Amkor Technology Inc. has announced that Joanne Solomon has been appointed Corporate VP and CFO, succeeding Ken Joyce in that position. Solomon will continue to report to Joyce, who has been named to the new position of Chief Administrative Officer.

Magnetometer Designed on MEMS Chip

Wed, 8 Aug 2006
(August 30, 2006) LITTLE FALLS, NJ — A prototype magnetometer that could improve perimeter control in war zones and border control for various military organizations is currently under development at the New Jersey Nanotechnology Consortium's Laboratory, Murray Hill, NJ. The prototype, developed by mPhase Technologies, accurately locates a metal object more than 30 ft. away, using a MEMS device to sense changes in magnetic fields.

MEMS: Getting Under Your Skin

Tue, 9 Sep 2006
By Meredith Courtemanche, assistant editor

MEMS are a seductive option for manufacturers of medical devices. Microscopic mechanical structures on MEMS chips open a range of sensing and detection options — pressure sensors, magnetic and light detection, microinjections, and more. Bio-MEMS are creating a niche in the industry for high-reliability, critical-application, sophisticated sensors that doctors can implant or inject into a human body.

SUSS Installs Probe Systems in IMEC Research Center

Thu, 3 Mar 2006
Munich, Germany — SUSS MicroTec AG has installed PA300PS ProbeShield semiautomatic probe systems with ReAlign and ContactView technology and PA300 probe systems for RF-noise and S-parameter measurements at IMEC, a Leuven, Belgium-based nanoelectronics research center. The two companies will also collaborate on enhancing 300-mm probe systems in the future.

Device Packaging Conference Takes Off

Fri, 3 Mar 2006
Phoenix, AZ — The second annual IMAPS Device Packaging Conference, March 20–23, drew double the audience of last year. Sessions were crowded, exhibit space was sold out, and excitement was high. The conference, which this year incorporated the former IMAPS Flip Chip Workshop, offered three keynote speakers and five parallel tracks, with 26 sessions totaling about 100 papers.
By George Riley, Ph.D., contributing editor

SEMICON Europa: An Editor's Perspective

Tue, 10 Oct 2007
For an editor of a semiconductor manufacturing publication, there are several sides to every trade show. On one hand are the technical sessions, where we get a glimpse of the latest and greatest technologies being developed. On the other hand, are the industry players

Aviza Receives System Order from Bosch

Thu, 10 Oct 2007
(October 18, 2007) SCOTTS VALLEY, CA— Aviza Technology, Inc. (NASDAQ:AVZA), a supplier of advanced semiconductor capital equipment and process technologies announced a system order of its Omega fxP cluster system from Robert Bosch GmbH, a MEMS sensor manufacturer specializing in automotive sensors and consumer devices. This is Aviza's second major MEMS customer to be announced in three months.

Tire Pressure Monitoring Market to Reach $183M in 2012

Mon, 10 Oct 2007
(October 22, 2007) Lyon, France— The current market for tire pressure monitoring system (TPMS) sensors is expected to reach $183M in 2012 from $168M in 2007, seeing a CAGR of 2% till 2012 in revenue due to a strong erosion of prices, despite an increase of 12% in volume, says a new report from Yole Developpement. 99% of direct TPM systems use MEMS pressure sensors.

WiSpry Introduces MEMS-tunable Digital Capacitors

Thu, 10 Oct 2007
(October 25, 2007) IRVINE, CA — WiSpry Inc. has introduced its product family of MEMS tunable digital capacitors for cellular applications. These products integrate low power CMOS control and voltage generation logic with an array of tunable RF-MEMS digital capacitors. Samples of these capacitors will be available in 2Q08.

Expanding MEMS Market to Draw Industry to MEMS Congress

Thu, 10 Oct 2007
(October 24, 2007) PITTSBURGH, PA — With the market for microelectromechanical systems (MEMS) technology expected to grow to US$10.7 billion by 2011, both traditional semiconductor companies with MEMS divisions and MEMS-centric companies will meet to discuss this expanding market at the Annual MEMS Industry Group Event and Congress on November 4-5 in Del Mar, CA.

Sensors Strip Off their Packaging with VTI Chip-On-MEMS

Wed, 10 Oct 2007
(October 31, 2007) VANTAA, Finland — VTI Technologies has developed manufacturing concepts that offer better ways of combining MEMS and ASIC technology to create smaller, smarter, and lower cost sensing devices suitable for large volume production. The work being carried out by VTI could open up a raft of new sensing applications for a wide range of handheld devices.

Teneo, GA Tech Combine on Precision Microtools for MEMS

Mon, 11 Nov 2007
(November 5, 2007) ATLANTA, GA — Teneo Micro Instruments LLC, an IP2Biz company, has launched the Teneo TM70xx line of mechanically actuated microtools. The tool set, created by researchers at the Georgia Institute of Technology, offers a diversity of tool materials, requires no electrical or thermal power to operate, and seamlessly integrates and augments standard microprobe and micromanipulator stations.

MEMS Microphone Chip

Mon, 4 Apr 2006
The AKU2000 surface-mountable complementary metal oxide semiconductor (CMOS) microelectromechanical systems (MEMS) microphone integrates an acoustic transducer, output amplifier, and 4th-order sigma-delta modulator in a single chip.

Another Word on Nano

Tue, 6 Jun 2006
The day after I wrote my last editorial entitled Nano-inspiration, I attended the MEMS and Nanotechnology session at the IMAPS New England Symposium, May 16, in Boxborough, MA. There was so much discussion about nano-hype, multiple definitions of nano, how nanomaterials are made, and what you can do with them that I wished the session had occurred a few days earlier.

SEMI Holds Meeting on MEMS Packaging Standards

Tue, 6 Jun 2006
(June 6, 2006) SAN JOSE, CA — If you're like most people who responded to SEMI's survey on MEMS packaging standards, you're not aware that SEMI has published three MEMS-related standards. Existing standards cover microscale fluidic systems, terminology, and wafer bonding. SEMI's MEMS technical committee has identified MEMS packaging as a task force area, and standardization efforts are just beginning.

MEMS Propel High-vacuum Bonding

Mon, 7 Jul 2006
(July 24, 2006) MUNICH, Germany — A prototype wafer-bonding system designed for high-vacuum applications debuted at SEMICON West 2006, billed as a MEMS-centric wafer bonder. SUSS MicroTec's M-Lock, expected in production in Q'03 2006, is a load-locked system developed for the specific challenges presented by advanced MEMS devices.

Technology Exchange Offers Diamonds

Wed, 7 Jul 2006
(July 26, 2006) SANTA CLARA, CA — The MEMS and Nanotechnology Exchange will incorporate sp3 Diamond Technologies Inc.'s diamond-on-silicon (DOS) foundry service into processes they offer. Developers with the Exchange can access proprietary chemical vapor deposition (CVD) services and thermal, mechanical, and wear properties of diamond technology.

Companies Collaborate for Etching Tool Suite

Thu, 7 Jul 2006
(July 27, 2006) SAN FRANCISCO — XACTIX and Surface Technology Systems have released a suite of etching tools specific to MEMS, combining STS and XACTIX products. The xenon difluoride silicon-etch systems enable unconventional processes, "such as etching after package insertion and wire-bonding," says David Springer, president of XACTIX. They use xenon difluoride gas to selectively isotropic etch into bulk silicon or remove sacrificial layers made by silicon, germanium, or molybdenum.

MEMS Market Forecasted to Hit $12.5B in 2010

Thu, 1 Jan 2006
Norwalk, CT — The global market for MEMS devices and production equipment was worth an estimated $5 billion in 2005, and will increase to $12.5 billion through 2010, an average annual growth rate (AAGR) of more than 20%, claims a soon-to-be-released, updated technical market research report, RGB-270R MEMS: A Roadmap to Technologies and Applications from Business Communications Co. Inc.

300mm Wafer Probe Card for Burn-In Test

Mon, 11 Nov 2007
The latest addition to its Harmony family of full-area, 300mm wafer probe solutions — the Harmony wafer-level burn-in (WLBI) probe card — is reportedly designed to maximize throughput, as well as ensure higher quality and reliability of semiconductor devices.

BPM Microsystems' Flash Programmer Reduces Programming Time for STMicro

Tue, 12 Dec 2007
(December 4, 2007) Houston, TX — BPM Microsystems has announced that its newest flash memory programmer, the Flashstream, has dramatically reduced the programming time for the NAND Flash Large Page Family from chipmaker STMicroelectronics.

From the Editor
A Household Word

Tue, 12 Dec 2007
As I waited my turn at the grocery checkout recently, I passed the time scanning magazines for juicy tabloid gossip. Much to my surprise, tucked between covers revealing the truth about Britney's drug problem and Brad and Angelina's most recent tiff, was a cover line on Diabetic Living, a Better Homes and Gardens publication, about ultra-small insulin pumps, which reportedly rely on MEMS devices to achieve miniature size and increased functionality.

May Book-to-Bill Increases 3%

Fri, 6 Jun 2006
(June 23, 2006) SAN JOSE, CA — North American-based semiconductor equipment manufacturers posted $1.65B in orders in May 2006 with a book-to-bill ratio of 1.12, according to SEMI's May 2006 Book-to-Bill Report. Average worldwide bookings in May 2006 equaled $1.65B, up three percent from last month and 62% from May 2005.

'Growing' microchip circuits

Fri, 10 Oct 2003
(October 24, 2003) TUCSON, Ariz.—The University of Arizona's nanotechnology research group is using proteins from living cells to "grow" wires for microchips, with funding from a U.S. National Science Foundation grant.

IMEC, EV Group team to work on wafer-level packaging

Fri, 10 Oct 2003
(October 24, 2003) Schärding, Austria—A collaboration agreement on wafer-level packaging and MEMS bonding is bringing together EV Group, an Austria-based manufacturer of MEMS and wafer processing equipment, and IMEC, a Belgium-based independent research institute on microelectronics and micro/nanotechnology.

IMAPS and ACerS call for papers for International Conference on Ceramic Interconnect and Ceramic Microsystems Technology

Thu, 8 Aug 2004
(August 26, 2004) Washington, D.C.—The International Microelectronics and Packaging Society (IMAPS) and The American Ceramic Society (ACerS) recently issued a call for papers for the first International Conference on Ceramic Interconnect and Ceramic Microsystems Technology. The conference will take place April 10-13, 2005, at the Baltimore Marriott Waterfront Hotel in Baltimore, Maryland, and will be co-located with the 107th Annual Meeting and Exposition of The American Ceramics Society.

Penn State researchers creating tiny lubricants for MEMS

Thu, 4 Apr 2004
(April 1, 2004) University Park, Penn.—Tiny machines built as part of silicon chips are all around us, and their need for lubrication is the same as large machines such as automobile engines, but conventional lubricants, like oils, are too heavy for these microelectromechanical systems (MEMS), so Penn State researchers are looking to gases to provide thin films of slippery coating.

Nanogold doesn't glitter, but its future looks bright

Wed, 4 Apr 2004
(April 27, 2004) Bethlehem, Pa.—All that glitters is not gold, goes the old adage. But the shrinking frontiers of science require a qualifier: gold itself does not always glitter. In fact, if gold is created in small enough chunks, it turns red, blue, yellow and other colors, says Chris Kiely, who directs the new Nanocharacterization Laboratory in Lehigh's Center for Advanced Materials and Nanotechnology.

Merging MEMS and wafer-level packaging

Mon, 5 May 2004
(May 3, 2004) Contributed by Jody Mahaffey, JDM Resources.
If you've been reading the trade-press these past couple months, you may think that MEMS are one of the hottest topics in the industry today. It's been reported by varying sources that MEMS revenues are forecast to increase at a compound annual growth rate of 15-20 percent over the next few years, while units shipped are forecast to grow at a compound annual growth rate of 25-30 percent.

SUSS MEMS equipment package chosen by SensoNor to make tire pressure sensors

Mon, 1 Jan 2004
(January 19, 2004) Munich, Germany—SUSS MicroTec AG's MEMS production systems have been chosen by SensoNor, a MEMS manufacturer for the automotive industry, to manufacture tire pressure sensors. Lithography and wafer-to-wafer bonding are two important steps in the MEMS fabrication process.

China IC packaging and testing firm to offer chip-scale packaging

Mon, 10 Oct 2004
(October 4, 2004) Taipei—China-based Jiangyin Changdian Advanced Packaging (JCAP) is setting up chip-scale packaging lines and wafer-bumping lines, slated for mass production next year.

Freescale joins E3 Lead-free initiative, makes it E4

Fri, 6 Jun 2004
(June 4, 2004) Munich, Germany—Freescale Semiconductor Inc., a subsidiary of Motorola Inc., has joined STMicroelectronics, Infineon Technologies and Philips to further lead-free electronics packaging. Formerly E3, the group is now called E4 (environmental 4) and focuses on accelerating the use of lead-free packages while stimulating further development of environmentally friendly package technologies.

SEMI, IEEE collaborate on MEMS, nano standards

Mon, 6 Jun 2004
(June 7, 2004) San Jose, Calif.—SEMI and IEEE recently agreed to support each other's efforts to create nanotechnology and MEMS standards. The organizations will appoint liaisons, define a regular exchange of information and schedule periodic joint meetings to present updates and disseminate standards information on nanotechnology and MEMS.

New report predicts 'banner year' for MEMS industry

Tue, 6 Jun 2004
(June 29, 2004) Scottsdale, Ariz.—While the first half of 2003 was not terribly promising for microelectromechanical systems (MEMS) suppliers, business activity picked up considerably in the fourth quarter of 2003, and has remained strong through the first half of 2004, reports In-Stat/MDR in its new report, Step by Step to Success: 2004 MEMS Industry Overview and Forecast. This high-tech market research firm predicts that 2004 will be a banner year for this industry.

SEMICON West 2004 to include keynote speakers, panel discussions and special programs

Tue, 6 Jun 2004
(June 29, 2004) San Jose, Calif.—SEMICON West 2004, the largest exposition in North America for the semiconductor and microelectronics manufacturing industry, will feature keynote presentations by industry leaders, focused panel discussions among technology experts and other programs designed to facilitate information exchange between the global IC community and their manufacturing technology providers.

Microfabrica Kicks Off MEMS Design Competition

Fri, 9 Sep 2005
Burbank, Calif. — Microfabrica and MOSIS have launched the EFAB Access Design Competition for microdevices. Offered by MOSIS, EFAB Access, a low-cost prototyping service for MEMS and microdevice development, is the first multi-project run service to offer Microfabrica's EFAB 3-D micromanufacturing technology. The three winning microdevice designs will be built free of charge through the EFAB Access program.

Bright Future Predicted at IMAPS

Thu, 10 Oct 2005
By Françoise von Trapp, Advanced Packaging Associate Editor
Projected industry growth, offshore migration of manufacturing, challenges caused by rapid developments in technology, and advances in nanotechnology dominated industry discussion at the 2005 International Microelectronics and Packaging Society (IMAPS) Symposium, September 25-29th in Philadelphia.

SMT, SMT China Announce Call for Papers for Upcoming Conference

Fri, 8 Aug 2005
Shanghai, China — Advanced Packaging Magazine sister publications, SMT and SMT China, along with the China Electronics Appliance Corporation (CEAC), announce the Call for Papers for the 2005 SMT China International Conference on Emerging Technologies & Lead-free Challenges. Held annually, SMT and SMT China Magazines will focus on SMT, emerging technologies, and hot topics for modern assembly methods.

MEMS Industry Group Adds New Members

Tue, 8 Aug 2005
Pittsburgh, Pa. — The MEMS Industry Group (MIG), a trade association representing the MEMS and microstructures industries, has added 9 new members during the second quarter of 2005 to its roster, including Boston Micromachines, Eyelit Inc., IceMos Technology, Makino, Meggitt Electronics, MicroBridge Technologies, SAES Getters, SiTime, and Tronics Microsystems.

Vectron, Discera to Co-develop MEMS Devices

Tue, 11 Nov 2006
(November 15, 2006) MUNICH, Germany — Discera, Inc., and Vectron International will work together to commercialize MEMS oscillators for electronics manufacturing. The companies announced during electronica 2006, November 14 – 17 in Munich, that quartz-crystal resonator company Vectron tested and approved the MEMS-based timing devices offered by Discera, and that they will work closely together to gain exposure for the MEMS devices and develop new products.

EV Group Partners at Wafer Level

Fri, 12 Dec 2006
(December 1, 2006) ST. FLORIAN, Austria — Sonix, Inc., selected EV Group as exclusive worldwide reseller and distributor for select products. Sonix (Springfield, VA), a wholly owned subsidiary of the Danaher Corporations, manufactures acoustic NDT solutions for bonded wafers and MEMS.

University Selects SUSS Wafer Bonder

Mon, 12 Dec 2006
(December 4, 2006) MUNICH, Germany — The University of Alberta's NanoFab chose SUSS MicroTec's ELAN CB6L wafer-bonding equipment for its research and production activities. The NanoFab is an open access micro- and nano-fabrication facility used by more than 130 research groups from the University of Alberta, other Canadian universities, and industry. The manual bonder will be used in nanotechnology research, RF MEMS switches for wireless applications, and other research activities.

The News from SEMICON Japan

Tue, 12 Dec 2006
(December 6, 2006) TOKYO — Celebrating its 30th anniversary, SEMICON Japan drew exhibitors showcasing products and processes alongside symposia, seminars, and standards meetings December 6 – 8 in Chiba, Japan. Vanguard topics of MEMS and nanotechnology demonstrated the show's motto "sharing expertise, making innovation." The SEMI Technology Symposium (STS), seminars, and a 30th anniversary gala provide a range of opportunities for networking.

Yole Reports on MEMS

Tue, 12 Dec 2006
(December 5, 2006) LYON, France — Yole Développement's market research report, "Status of the MEMS Industry," examines markets, fiscal forecasts, and geographical considerations for MEMS through 2010. Yole studies various business models in the sector as well as emerging MEMS activities in India and China. Analysis of the packaging and test business linked to MEMS manufacturing is also supplied. Yole expects MEMS to reach $10B by 2010, and defines reasons for growth.

Dynamic Summits from Cadence and Microsoft

Wed, 10 Oct 2006
By Julia Goldstein, Ph.D., contributing editor

More companies are holding summits where they present recent corporate news and invite their customers, partners, and/or suppliers as presenters and attendees. While these events are high on glitz — huge screens, video demonstrations, special effects — they also tend to bring in dynamic speakers and provide an opportunity for networking among various players in the supply chain.

ChipMOS Reports Revenue for December 2004

Wed, 1 Jan 2005
(January 19, 2005) Hsinchu, Taiwan — ChipMOS Technologies (Bermuda) Ltd. has reported unaudited consolidated revenue for the month of December 2004.

MEMS Industry Group Continues Phase II of MEMS CAT Project

Wed, 1 Jan 2005
(January 19, 2005) Pittsburgh, Pa. — The MEMS Industry Group (MIG) announces that it has received funding from the Defense Advanced Research Projects Agency (DARPA) to continue its MEMS Cost Assessment Tool (MEMS CAT) project.

Model Predicts Weaker IC Demand in the Second Half of 2005

Tue, 1 Jan 2005
(January 25, 2005) Saratoga, Calif. — The contracting IC industry may face another setback later this year, according to Advanced Forecasting's quantitative forecasting model. The model is predicting a downward turning point in the second half for underlying demand for ICs, but the slowdown currently being experienced in the industry reduces the impact, according to the firm's founder, Moshe Handelsman.

Lab-on-a-Chip Technology Catches on in MEMS Field

Wed, 1 Jan 2005
(January 26, 2005) Scottsdale, Ariz. — After two decades of development, and despite increased competition from alternative technologies and more companies developing lab-on-a-chip products, lab-on-a-chip technology finally appears to be making its mark within the MEMS industry, according to In-Stat (www.in-stat.com).

SUSS Chooses ULCOAT for C4NP

Mon, 9 Sep 2006
(September 11, 2006) MUNICH, Germany — At SEMICON Taiwan, SUSS MicroTec, Inc., announced that it has selected a potential commercial source for controlled collapse chip connection – new process (C4NP) glass molds. The glass MEMS division of ULVAC Coating Corporation, based in Saitama, Japan, demonstrated trial production of the reusable glass molds needed to bump wafers using IBM's C4NP process.

STS Develops 300-mm DRIE Plasma Source

Tue, 9 Sep 2006
(September 12, 2006) TAIPEI, Taiwan — Surface Technology Systems (STS) developed a deep reactive ion etch (DRIE) plasma source compatible with 300-mm wafers. The 300-mm platform is founded on the technology in the company's Pegasus DRIE source, released for MEMS customers in 2005.

MOEMS Market Geared Toward End-users

Fri, 9 Sep 2006
(September 15, 2006) DUBLIN, Ireland — Research and Markets has released a report, "MEMS4Display 06: Market Analysis of MEMS-based Microdisplays," which reveals that consumer interests will control the application of MEMS in display technology. Branding, portability, reliability, and picture quality will determine growth in the MEMS display sector.

Upcoming Symposium Sweats the Small Stuff

Tue, 10 Oct 2006
(October 4, 2006) NISKAYUNA, NY — The annual National Trends in Small-scale Systems and Microelectronics Packaging symposium hosts scientists and researchers from around the country. Jointly operated by Binghamton University of NY and General Electrics' Global Research Center, the symposium educates industry members and students on packaging advances made at the molecular level, including nanotechnology and MEMS. Sessions will take place October 23 and 24, 2006, in Niskayuna, NY.

SEMI Issues 13 New Technical Standards

Fri, 6 Jun 2005
(June 24, 2005) San Jose, Calif. — Included in SEMI's new July 1, 2005 standards are 13 new specifications and guidelines for ellipsometer equipment for integrated metrology, sensor/actuator network communications, silicon carbide wafers, and safety in multi-employer work areas. The 13 new technical standards apply to the semiconductor, flat panel display (FPD), and MEMS manufacturing industries.

Global Semiconductor Sales Strengthen in February

Mon, 4 Apr 2005
(April 4, 2005) San Jose, Calif. — Normally a weak month for microchip sales, worldwide sales of $18.1 billion in February were 2% below the revised January sales of $18.4 billion, but were 15.8% higher than February 2004 sales of $15.6 billion, according to the Semiconductor Industry Association (SIA).

MEMS Component Vendors Challenged by Price-sensitive Market

Tue, 4 Apr 2005
(April 5, 2005) Palo Alto, Calif. — Innovation's slow rate in the recovering telecom market is holding back the rapid expansion of the micro-electromechanical systems (MEMS)-based components market. Although MEMS technology is important, time-based value engineering in a potentially high-demand industry compels vendors to adopt different strategies to stay active in a price-sensitive market.

EV Group Installs Wafer Bonder at SMI

Tue, 4 Apr 2005
(April 26, 2005) Schärding, Austria — EV Group (EVG) has installed a low-temperature wafer-bonding system at Silicon Microstructures Inc. (SMI), a silicon pressure and inertial sensors provider for automotive, medical, and industrial applications.

ISSYS Selects Wafer Bonder for MEMS

Wed, 12 Dec 2006
(December 6, 2006) SAN JOSE, CA — Integrated Sensing Systems (ISSYS), Ypsilanti, MI, purchased and installed an AML Bonder from OAI, along with a mask aligner system. ISSYS purchased the stand-alone wafer bonder and complementary mask system to increase production of MEMS devices.

SEMI Announces Competition

Wed, 12 Dec 2006
(December 13, 2006) SAN JOSE, CA — SEMI put out a call for innovations for the fifth annual Technology Innovation Showcase (TIS) to be held in conjunction with SEMICON West 2007, July 17 – 19, 2007, in San Francisco. Nanotechnology, MEMS, test, assembly, packaging, and wafer processing submissions are sought by February 2, 2007.

Biomedical MEMS Drive Research Project

Mon, 12 Dec 2006
(December 18, 2006) CALDICOT, U.K. — With the aim of powering implanted medical devices with "two feet and a heartbeat," a U.K. industry consortium will develop prototypes — expected in 2007 — for medical devices powered by the human body. The self-energizing implantable medical micro-system (SIMM) project, with collaboration from the Department of Trade and Industry, will use microgenerators created as MEMS devices to convert human energy expenditure into electrical power.

Rite Track announces first European orders with Tokyo Electron Limited (TEL)

Fri, 7 Jul 2005
WEST CHESTER, Ohio--(BUSINESS WIRE)--July 7, 2005--Rite Track, a leading provider of track systems for the semiconductor, MEMS and thin film head industries, today announced the receipt of their first European order for remanufactured TEL CLEAN TRACK MARK series.

Kionix Completes MEMS Facility

Mon, 11 Nov 2001
November 12, 2001 -- ITHACA, NY -- MEMS-based product manufacturer Kionix has completed a new self-contained fabrication facility that includes 40,000 square feet of cleanroom and office space.

Particles

Tue, 3 Mar 2005
SCOTTSDALE, Ariz.-According to research conducted by In-Stat (www.in-stat.com), companies are increasingly developing lab-on-a-chip products despite increased competition and alternative technologies.

Particles

Sun, 5 May 2005
ROLLING MEADOWS, Ill.-Gordon Ely of Nelson Laboratories will lead an online class covering biocontamination issues, Wednesday, June 22, at 11 a.m. (CDT) via the IEST's Web site (www.iest.org).

Cassette-to-cassette system targets new semi processes

Wed, 6 Jun 2005
NEWPORT, Wales-Designed for 200-mm semiconductor processes, Trikon Technologies (www.trikon.com) began shipments in April for its Omega i2L dry-etch system, which combines the company's inline cassette-to-cassette handling subsystem with Windows NT control software and process modules from the company's fxP series cluster tools.

Collaboration to manufacture high-sensitivity biosensors for food and clinical samples

Wed, 2 Feb 2006
A new mass-detection system utilizing microelectromechanical systems (MEMS) and a unique resonating sensor is being developed by a collaboration of academic, industrial and government groups, and initially promises several performance improvements over existing technologies in the detection of foodborne pathogens, infectious diseases and cancer.

SEMI publishes eight new technical standards

Tue, 4 Apr 2008
SEMI has published eight new technical standards applicable to the semiconductor, flat-panel display, and MEMS manufacturing industries.

STS ships VPX Pegasus to Semefab for volume production of nano/MEMS products

Tue, 7 Jul 2007
July 17, 2007 -- /PRNewswire/ -- NEWPORT, U.K. -- Surface Technology Systems plc (STS) today announced that it has sold a VPX Pegasus system to Semefab, a Scottish-based semiconductor company that specializes in the design and manufacture of silicon IC and MEMS devices.

MicroFluidic Systems begins Phase III contract to prepare BAND system for manufacturing

Tue, 6 Jun 2007
May 23, 2007 -- /PRNewswire/ -- FREMONT, CA -- MicroFluidic Systems, a privately held company, announced today that it will begin its Phase III effort of the Bioagent Autonomous Networked Detector (BAND) development contract from the Department of Homeland Security's (DHS) Science and Technology Directorate.

RASIRC delivers 25th Steamer

Thu, 8 Aug 2007
August 8, 2007 -- SAN DIEGO, CA -- RASIRC(TM), the steam purification company, announces it has sold and shipped its 25th Steamer.

Harvard University Center orders ICP and PECVD tools from STS for nanoscale research

Thu, 7 Jul 2007
July 4, 2007 -- /PRNewswire/ -- NEWPORT, U.K. -- Surface Technology Systems plc (STS) today announced that it has sold two plasma processing systems to Harvard University.

Apogee Begins Test and Research Initiative for MEMS-Based Medical Device with University of Medicine and Dentistry New Jersey

Fri, 3 Mar 2005
NORWOOD, Mass.--(BUSINESS WIRE)--March 10, 2005--

Innovative Micro Technology selects Eyelit's manufacturing suite to support increased customer demand at world's largest independent MEMS foundry

Tue, 6 Jun 2005
SAN JOSE, Calif.--(BUSINESS WIRE)--June 21, 2005--Eyelit, Inc., a manufacturing software provider for visibility, control and coordination of manufacturing operations for the electronics, life sciences, and semiconductor industries announced today that Innovative Micro Technology (IMT), a leading MEMS manufacturing partner, purchased Eyelit's enterprise manufacturing suite to manage and control its wafer fab R & D and production operations.

Polychromix and Ocean Optics partner to deliver cost-effective NIR spectroscopy solutions to a variety of industries

Mon, 5 May 2005
WILMINGTON, Mass. & DUNEDIN, Fla.--(BUSINESS WIRE)--May 9, 2005--Polychromix, Inc., a leading developer of advanced wavelength management solutions, and Ocean Optics announced a worldwide distribution agreement to market cost-effective spectroscopy solutions for general purpose applications.

Tronics strengthens characterization, assembly and test capabilities for custom MEMS

Fri, 4 Apr 2007
April 12, 2007 -- /BUSINESS WIRE/ -- CROLLES, FRANCE -- Tronics Microsystems SA today announced that is has expanded the characterization, assembly, packaging and testing capabilities at its Crolles headquarters.

Micralyne breaks ground on new expansion

Tue, 2 Feb 2007
February 7, 2007 -- /Micralyne/ -- Edmonton, Alberta -- Micralyne Inc., a world leading independent MEMS microfabrication company, has broken ground on a facility expansion that will increase its manufacturing capacity to accommodate its growing customer base.

Tanner Labs now offers scanning electron micrograph (SEM) services in its MEMS R&D and fabrication facility

Thu, 1 Jan 2007
January 8, 2007 -- /BUSINESS WIRE/ -- PASADENA, CA -- Tanner Labs, a division of Tanner Research, today said it will begin offering scanning electron micrograph (SEM) services in its MEMS R&D and Fabrication Facility in Pasadena.

MEMS market building steam

Thu, 6 Jun 2003
JUNE 5--NEWPORT, Wales--The market for micro-electro-mechanical systems (MEMS) will see approximately 45 percent compound annual growth rate (CAGR) in unit volumes in the next two years according to Ian Smith, chief executive of Surface Technology Systems (STS), a supplier of plasma etch systems.

Intel donates fab tools

Tue, 2 Feb 2003
FEB. 18--RIO RANCHO, N.M.--Intel Corp. has donated $17.5 million worth of old six-inch process tools to the University of New Mexico's (UNM) Manufacturing Training and Technology Center for microelectromechanical systems (MEMS) research and development.

Tronic's Microsystem unveils new facility

Fri, 5 May 2003
MAY 9--GRENOBLE, France--Tronic's Microsystems, a maker of micro electro mechanical systems (MEMS), is making the finishing touches on a production facility in Crolles, France, which will include a 4,300-square-foot cleanroom that is expected to be completed by July and in full volume production by year's end.

MEMS pavillion, other new programs at SEMICON West 2003

Tue, 5 May 2003
MAY 20--SAN JOSE, Calif.-- A MEMS Pavilion is just one of the new programs that will be featured at SEMICON West 2003, a tradeshow highlighting the global supply chain for semiconductor and related microelectronics manufacturing.

Use of silver nanoparticles rapidly expanding in the consumer and medical markets, according to Bourne Research

Fri, 4 Apr 2006
April 18, 2006 -- /BUSINESS WIRE/ -- SCOTTSDALE, Ariz. -- Silver nanoparticles are emerging as one of the fastest growing product categories in the Nanotechnology industry, according to Bourne Research (http://www.bourneresearch.com).

MEMS without cleanrooms

Fri, 3 Mar 2002
BURBANK, CA—Saying it will revolutionize the micro-machining industry, a toolmaker has unveiled a micro electro mechanical systems (MEMS) fabrication process that eliminates the need for cleanrooms.

Achieving the finely tuned world of the microminiaturized

Sun, 6 Jun 2003
Whoever coined the phrase "good things come in small packages" would be amazed to learn about the evolution of MicroElectroMechanical Systems, or MEMS.

New technologies drive demand for cleanrooms

Mon, 9 Sep 1997
While aerospace, medical and pharmaceutical applications drove the cleanroom industry in the 1960s and 1970s, high technology areas such as semiconductors, microelectromechanical, flat-panel displays and newer industries such as biotechnology will carry the cleanroom into the next century.

A cast of reasonable predictions

Sun, 6 Jun 2003
Where were you in your career 10 years ago? Where will you be 10 years from now? Take a look at your situation today: Did you have any idea you'd be where you are?

Out with the laminar flow hoods, in with the cleanrooms

Tue, 5 May 2001
These are the times that try the souls of optical component manufacturers. No matter where they turn, they are faced with heated demands for bandwidth; ever-changing network traffic patterns; a slew of fiber deployments; emerging technologies; and, of course, increased costs and competitive pressures.

MEMS drive supply chain changes with new applications

Thu, 9 Sep 2011

Yole Développement shares highlights from its latest "Status of the MEMS Industry" report, noting changes in the MEMS supply chain as companies add foundries or go fab-lite, and multi-chip MEMS packages create new relationships between companies.


MEMS product development -- why is it so hard?

Fri, 9 Sep 2011

Commercializing MEMS can take years and millions of dollars. While the MEMS industry shares some aspects with the larger semiconductor industry, the comparison is not fair in product development. Karen Lightman, MEMS Industry Group and Alissa M. Fitzgerald of A.M. Fitzgerald & Associates explain what makes developing new MEMS devices so hard.


China taking automotive MEMS consumption lead

Fri, 9 Sep 2011

Increasing sensor counts in Chinese cars, upcoming government mandates for sensors, and the booming automotive market in the country will push China's automotive MEMS consumption to a higher growth rate than that of the rest of the world.


Energy harvesting thermoelectrics uncrated by Marlow Industries

Tue, 9 Sep 2011

Marlow Industries launched the EverGen series, thermoelectric-based energy harvesting devices offering low-cost, zero-maintenance power for wireless sensor applications.


Graphene races CNT for nanomaterial commercialization

Wed, 9 Sep 2011

Both graphene and carbon nanotubes (CNT) suit applications from flexible displays to silicon-replacing transistors. In a relatively short time, graphene has emerged as a low-cost, tunable material for all kinds of electronics. Will graphene overtake CNTs as the nanomaterial of future devices?


NIST etches MEMS out of diamonds

Wed, 9 Sep 2011

NIST developed a method to etch diamond crystals, exploiting the cubic nature of diamond crystals. These diamond-etched features could lead to better micro electro mechanical system (MEMS) devices.


Hamamatsu Photonics helps Lemoptix commercialize MOEMS

Wed, 9 Sep 2011

Lemoptix and Hamamatsu Photonics signed a long-term collaboration agreement to develop, industrialize and commercialize micro optical electro mechanical system (MOEMS) laser scanning and microprojection devices.


PI (Physik Instrumente) opens Singapore office

Wed, 9 Sep 2011

Precision positioning systems specialist PI (Physik Instrumente) opened a direct office in Singapore to expand its Asia market presence.


MIT names Microsystems Technology Lab leader

Thu, 9 Sep 2011

MIT named Vladimir Bulović as director of MIT's Microsystems Technology Laboratories (MTL). Bulović has experience in a range of advanced electronics technologies, from photovoltaics to MEMS.


Bosch incorporates MEMS for lower-cost personal robots

Fri, 9 Sep 2011

Bosch Research and Technology Center is developing "Alan," a personal robot designed to be affordable, capable, and safe to serve residential users in chores. Automotive and consumer MEMS sensors are helping Alan navigate and perform tasks for less.


MEMS motion sensors' continuing evolution in commercial markets

Mon, 10 Oct 2011

Beginning in 2005, consumer/mobile electronics makers started integrating MEMS motion sensors into devices. Almost every consumer device or cell phone today has a motion sensor embedded inside. Jay Esfandyari, STMicroelectronics, writes about motion sensing’s evolution and future in this blog, in association with MEMS Industry Group.


memsstar expands in Silicon Glen

Tue, 10 Oct 2011

The maturing MEMS market and increased adoption of secondary equipment for semiconductor manufacturing have led deposition and etch tool supplier memsstar Limited to expand in Livingston, Scotland. memsstar added new positions in logistics, administration, and skilled and semi-skilled engineering to its jobs roster in conjunction with the expansion.


Sensor fusion drives mobile electronics' future apps

Tue, 10 Oct 2011

Sensor fusion -- where inputs from multiple micro electro mechanical systems (MEMS) are "fused" to increase response and accuracy -- is the next step for tablet/smartphone designs, according to a new IHS iSuppli MEMS & Sensors Special Report.


Present on MEMS manufacturing, inspection

Wed, 10 Oct 2011

Submit an abstract now to present at a group of co-located micro/nano manufacturing conferences. MM Live USA 2012 will co-locate with MEMS Live USA and NANO Live USA in Rosemont, IL, March 7-8.


BU lab-on-chip wins NIH funding

Wed, 10 Oct 2011

The National Institutes of Health awarded Boston University engineering and microbiology researchers $4.8 million to develop a chip-sized, low-cost and easily deployed virus detection platform. The product is conceived as an easily transported and simply operated detector for the front lines of an outbreak.


Inkjet heads: Mature MEMS market, with room for growth

Thu, 10 Oct 2011

Despite being a mature market -- and the largest one for MEMS -- inkjet heads are seeing increased sales as consumers print more digital photos, and as industrial and electronics manufacturers look to print product, according to GIA.


InvenSense CEO keynotes Semicon Europa MEMS Forum

Thu, 10 Oct 2011

InvenSense Inc. founder and CEO Steve Nasiri will deliver a keynote "MotionTracking - Driving Hi-Impact Motion-Based Applications in the Digital World" at Semicon Europa's International MEMS Forum.


MEMS: The year past and the year ahead

Tue, 12 Dec 2011

Jean-Christophe Eloy, president & CEO, Yole Développement, shares an analyst's view of the micro electro mechanical system (MEMS) industry, calling 2011 a year of transition and changes.


MEMS combo sensors bring price, size advantages to auto and consumer sectors

Thu, 12 Dec 2011

Combo sensors, comprising MEMS accelerometers, gyroscopes, or electronic compasses, are filling a need in consumer and automotive applications. Combined revenue from these sectors will grow by a factor of 50 over 5 years, shows IHS iSuppli.


ST's Taiwan iNEMO contest lauds smart hula hoop

Fri, 12 Dec 2011

STMicroelectronics has hosted 3 2011 iNEMO Campus Design Contests, for the US, China and Taiwan. This week, Taiwan's first place went to students from the National Yunlin University of Science and Technology for a smart hula hoop design.


Microfluidics: $4B in 2016, thanks to life sciences

Mon, 12 Dec 2011

In its new report, Emerging Markets For Microfluidic Applications, Yole Développement asserts that microfluidics are a "key technology" for the life sciences market, which will prop up microfluidics growth to $4 billion in 2016.


NASA grants BMC contract to refine microfabrication process

Wed, 12 Dec 2011

Boston Micromachines Corporation will use a NASA contract to develop better microfabrication processes for deformable mirrors, which will be used in exoplanet imaging research.


MEMS die size grows, test evolves, and other trends

Mon, 12 Dec 2011

Yole studies the evolution of inertial MEMS and magnetometers and provides reverse costing analysis of the MEMS devices in "Technology Trends for Inertial MEMS." The report considers 23 MEMS devices.


Bosch fabs 2B MEMS sensors

Wed, 12 Dec 2011

After taking 13 years to fab its first 1 billion MEMS sensors, Bosch has added another billion in just 3 years. The company's MEMS sensor production is nearing half a billion a year.


Tegal sells deposition patents

Fri, 12 Dec 2011

Tegal sold over 30 patents from the NLD portfolio, Lots 1-3, covering pulsed-chemical vapor deposition (CVD), plasma-enhanced atomic-layer deposition (PEALD) and NLD.


Imec: First poly-SiGe MEMS on Cu-backend CMOS

Mon, 10 Oct 2011

Imec says it has built an integrated poly-SiGe-based piezoresistive pressure sensor on top of 0.13μm copper backend CMOS, the first such device directly fabricated above its readout circuit and the first poly-SiGe MEMS device of any kind processed on top of Cu-backend CMOS.


Imec demos faster HBTs in SiGe for wireless, imaging

Mon, 10 Oct 2011

Imec says it has developed a fT/fMAX 245GHz/450GHz SiGe:C heterojunction bipolar transistor (HBT) device, useful for future high-volume millimeter-wave circuits in various applications.


Custom SOI wafers debut from IQE for MEMS, related manufacturing

Tue, 10 Oct 2011

Wafer supplier IQE released a customizable range of silicon on insulator (SOI) products that IQE reports afford improved thickness and doping control.


VTI Technologies sold to Murata Manufacturing

Tue, 10 Oct 2011

EQT III will sell VTI Technologies, leading independent designer and manufacturer of high-performance MEMS sensors, to the publicly listed Japanese electronic components company Murata Manufacturing.


STMicroelectronics uses TSV in high-volume MEMS devices

Tue, 10 Oct 2011

STMicroelectronics (NYSE:STM) has implemented through-silicon vias (TSV) in high-volume micro electro mechanical system (MEMS) devices. ST is using TSV in its smart sensors and multi-axis inertial modules.


Electronic compasses: Strong revenues from nav, gaming, military apps

Tue, 10 Oct 2011

The market for electronic compasses is set to grow 73% this year to $419.1 million, according to a new IHS iSuppli MEMS & Sensors special report on magnetic sensors. This high growth is projected to continue, with Japanese manufacturers dominating the space.


Deformable-mirror MEMS improve glaucoma research

Wed, 10 Oct 2011

The University of Houston College of Optometry is using MEMS-based deformable mirrors, Multi-DM, from Boston Micromachines Corporation (BMC) in glaucoma research.


CTS contracted for 2 piezo-ceramic programs

Wed, 10 Oct 2011

CTS Electronic Components, of CTS Corporation (NYSE:CTS), received 2 production orders for piezoceramic products from a major US sonar manufacturer. Revenues should total about $5 million.


X-FAB, Senodia ramp MEMS gyroscope production

Thu, 10 Oct 2011

X-FAB Silicon Foundries Group and Senodia Technologies (Shanghai) Co., Ltd today announced they have concluded development and are ramping production of microelectromechanical system (MEMS) gyroscopes for high-volume consumer applications.


COWIN medical/diagnostics sensor initiative update

Fri, 10 Oct 2011

The COWIN project is a European Commission (EC) initiative under FP6 and FP7 European research projects for smart nano and micro technologies benefiting diagnostic and medical applications. The 3-year project has a January 2012 closing for micro and nano bioconvergence systems’ research projects.


mPhase develops MEMS membrane at Argonne Labs

Fri, 10 Oct 2011

mPhase Technologies was granted access to the technical facilities at the Center for Nanoscale Materials, Argonne National Labs, for work on its MEMS Smart silicon membrane, a key component of the mPhase Smart NanoBattery.


Multi-cantilever MEMS technology basis of Panorama Synergy, UWA partnership

Fri, 10 Oct 2011

Panorama Synergy has formed an exclusive worldwide licensing agreement with the University of Western Australia for optical technologies related to highly sensitive measurements by multiple, simultaneous micro-cantilever MEMS sensors.


iPhone 4S first with 5-lens autofocus camera, other component changes

Mon, 10 Oct 2011

IHS and Chipworks share details from their preliminary teardowns of the Apple iPhone 4S. The device resembles an iPad/iPhone hybrid, and the 5-lens autofocus camera module is the first IHS has encountered in a smartphone.


MIT etches MEMS structures with glass stamp

Wed, 10 Oct 2011

MIT researchers developed a glass-stamp-based technique that helps fabricate lab-on-chip sensors at a lower cost than e-beam lithography and in a more reproducible manner than nanoimprint lithography.


Intel, pico projector, surf boards and heart monitors: Meet the MEMS Executive Congress Technology Showcase finalists

Thu, 10 Oct 2011

At the MEMS Executive Congress 2011 in November, a demo event will showcase MEMS-enabled applications from medical devices to entertainment and computing systems. Here are the Showcase finalists.


AKM stays atop silicon magnetic sensor rankings with Apple wins

Thu, 10 Oct 2011

Asahi Kasei Microsystems (AKM) in 2010 retained its position as the world’s largest supplier of silicon magnetic sensors, according to an IHS iSuppli Magnetic Sensors Special Report. AKM has scored design wins for its 3-axis electronic compasses in the iPad, iPad 2, iPhone 3GS and iPhone 4, among other notable smartphone and tablet products.


Imec wafer-level MEMS packaging relies on nanoporous alumina membrane

Fri, 10 Oct 2011

Imec engineers have simplified the thin-film wafer-level MEMS packaging process with nanopores that prevent leaks into the package and a low-temperature processing approach.


Scientific & Biomedical Microsystems awarded Schedule 871 contract

Fri, 10 Oct 2011

Scientific & Biomedical Microsystems, a developer of scientific and medical sensors and systems based on MEMS and other microfabrication technologies, was awarded a 5-year Schedule 871 contract by the US General Services Administration.


NIST, CU microchip combines microfluidics and magnetism without power drain

Mon, 10 Oct 2011

Researchers from NIST and University of Colorado Boulder developed a low-power microchip combining microfluidics and magnetic switches to trap and transport magnetic beads.


CALIENT raises $19M+ to bring photonic MEMS switches to cloud computing

Tue, 10 Oct 2011

CALIENT Technologies raised $19.4 million in venture financing to expand into data center and cloud computing markets and ramp its new portfolio of 3D MEMS photonic switching systems and modules for OEMs and system integration partners.


MEMS display from Pixtronix and Chimei Innolux boasts low power, high resolution

Wed, 10 Oct 2011

Pixtronix Inc. and Chimei Innolux Corp. (CMI) collaborated on the development of 5"-diagonal micro electro mechanical system (MEMS) display prototypes. The displays use Pixtronix's proprietary MEMS technology and were built by CMI.


ScanNano partners with STMicroelectronics on MEMS devices

Thu, 10 Oct 2011

Helsinki-based ScanNano,a private Finnish R&D firm that specializes in MEMS technology at the nanoscale, has partnered with STMicroelectronics with the goal of combining RF MEMS and CMOS.


Energy harvesting event keynotes showcase key applications, new technologies

Wed, 11 Nov 2011

The co-located Energy Harvesting & Storage and Wireless Sensor Networks & RTLS USA 2011 conference were held in Boston, MA recently. Following are some main points and announcements from the keynoters.


Qualcomm MEMS display launched in Korean e-readers

Thu, 11 Nov 2011

Qualcomm MEMS Technologies and Kyobo Book Centre of Korea launched the first e-reader using mirasol display technology. The touch display features vibrant color in bright sunlight and power management enables weeks of reading.


SUSS MicroTec partners for health research

Fri, 11 Nov 2011

SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announces the cooperation with Swansea University´s Centre for NanoHealth (CNH).


MEMS sensor technology used to train competitive rowers

Mon, 11 Nov 2011

Whether it’s keeping athletes in top form, improving navigation in medical robots, helping industrial operators extend factory equipment life, or preventing automotive rollovers, high-performance MEMS inertial sensing technology adds a new dimension that transforms many conventional applications, says blogger Howard Wisniowski, Analog Devices.


Innovative Solutions Bulgaria buys large MEMS fab

Mon, 11 Nov 2011

Innovative Solutions Bulgaria Ltd. acquired Bulgaria’s largest MEMS fab, built north of Sofia in 2004. This new facility provides space to expand production capacity of AFM products.


Nanomedical collaboration improves drug delivery system

Tue, 11 Nov 2011

Drug delivery companies Leonardo Biosystems Inc. and NanoMedical Systems Inc. (NMS) will collaborate, with NMS developing and establishing a commercial process to manufacture nanoporous silicon particles for Leonardo's multi-stage drug delivery system.


IDT MEMS oscillator commercializes piezoelectric resonators

Wed, 11 Nov 2011

Integrated Device Technology, Inc. (IDT, NASDAQ:IDTI) developed and demonstrated commercially available oscillators incorporating piezoelectric micro electro mechanical system (pMEMS) resonators.


MEMS win, DRAM lose in ultrabook designs

Fri, 11 Nov 2011

Sensors are hot items for ultrabook functionalities, boosting MEMS sales. The thin form factor of ultrabooks will deter DRAM device integration and DRAM use as memory upgrades, according to IHS iSuppli Semiconductor Value Chain.


Semiconductor magnetic sensors rev up in auto sector

Thu, 12 Dec 2011

IHS shares the growth map for semiconductor magnetic sensors in automotive applications, where the sensors are used in vehicles, and technology trends. Top suppliers are also listed.


ST chooses China's winning iNEMO student designs

Thu, 12 Dec 2011

STMicroelectronics (NYSE:STM), MEMS maker, named a winner in its 2011 iNEMO Campus Design Contest in China: Sky Worker Team 1 from Tsinghua University. ST operates the open competition in China and Taiwan, and the US.


New sensors use ancient metallurgical technique

Fri, 12 Dec 2011

A multi-institution team has produced a cobalt/iron alloy that could be the basis for a new class of sensors and micromechanical devices controlled by magnetism. The alloy does not use rare-earth elements to achieve its properties.


AMAT BSI image sensor CVD tool operates at low processing temps

Mon, 12 Dec 2011

Applied Materials Inc. (AMAT) launched the Applied Producer Optiva chemical vapor deposition (CVD) system for back-side-illuminated (BSI) image sensor manufacturing. It deposits low-temperature conformal films that boost the low-light performance of the sensor while improving its durability.


Ushio releases lithography tools for MEMS, power device, and LSI fab

Mon, 12 Dec 2011

USHIO Inc. is introducing the UX4-MEMS FFPL 200 with the overlay accuracy of 0.5µm for manufacturing MEMS devices, mounted with the newly developed lens module having a maximum depth of focus of 500µm and the auto mask changer module for manufacturing multiple device types.


Cornell, SRC develop RF MEMS technologies

Wed, 12 Dec 2011

Semiconductor Research Corporation (SRC), university-research consortium for semiconductors and related technologies, is working with Cornell University researchers to develop on-chip silicon technologies for mobile devices. The aim is a micro-mechanical resonator for RF MEMS.


AFM images MEMS structures with quantitative measurements

Thu, 12 Dec 2011

JPK Instruments introduced QI, or quantitative imaging mode, for the recently launched NanoWizard3 AFM analytical system. QI enables full control of tip-sample force at every pixel.


imec presents MEMS energy harvester at IEDM

Thu, 12 Dec 2011

Imec and Holst Centre micromachined a vibration-energy harvester with 489µW output power, using piezoelectric material in a MEMS cantilever. The team presented results at IEEE's International Electron Devices Meeting (IEDM) this week in Washington DC.


MEMS at CES: MEMS Industry Group events

Mon, 12 Dec 2011

MEMS Industry Group (MIG) shares the MEMS-related exhibits and discusses at the 2012 International CES, which covers consumer electronics, January 10-13 in Las Vegas.


NASA Curiosity Rover takes Teledyne-DALSA sensors to Mars

Mon, 12 Dec 2011

Teledyne DALSA manufactured the CCD sensors -- designed by NASA -- on the NASA mission to Mars. The sensors will help the Rover navigate the surface of the planet.


Tronics wins MEMS fab contract from DelfMEMS

Tue, 12 Dec 2011

DelfMEMS SA named Tronics as its micro electro mechanical systems (MEMS) foundry partner. Tronics will manufacture RF MEMS switches for DelfMEMS, with high-capacity runs starting in 2012.


MEMS-aligned optical devices ship to Linkstar customer

Wed, 12 Dec 2011

Linkstar customers have qualified the pilot shipment of silicon optic devices fabricated with Singapore's A*STAR Institute of Microelectronics MEMS technology. The IME silicon MEMS technology enables accurate alignment of optical devices to the optical fiber arrays.


China MEMS purchases slow to "healthy rate" in 2011

Thu, 10 Oct 2011

China's MEMS spending will see a 12.1% CAGR 2010-2015, driven in the near future by expanding smartphone/tablet demand, new consumer experiences, and a rapid drop in MEMS production costs as MEMS designs and production processes improve, says IHS.


Paper-based sensor can detect explosive devices

Thu, 10 Oct 2011


Researchers at the Georgia Institute of Technology have developed a prototype wireless sensor capable of detecting trace amounts of a key ingredient found in many explosives.


Pressure sensors squeeze to top of MEMS ranks

Thu, 10 Oct 2011

MEMS pressure sensors have relatively high average selling prices and a range of applications, making them to leading MEMS device by 2014, according to IHS iSuppli MEMS & Sensors Market Tracker. The largest application? Automotive.


ORBT delivers power supply for Navy's electro-optical sensor system

Fri, 10 Oct 2011

The Behlman Electronics subsidiary of Orbit International received 3 new orders, totaling in excess of $1.5 million, for COTS power supplies to an electro-optical sensing system, a computer system, and an all-weather airborne reconnaissance aircraft.


AFM attachment uses rare-earth magnets for conductive and magnetic microscopy

Tue, 11 Nov 2011

Asylum Research introduced the Variable Field Module2 (VFM2) for the MFP-3D AFM. It allows researchers to apply magnetic fields in conductive AFM experiments, magnetic force microscopy, and other applications.


Micrel ramps MEMS manufacturing in San Jose foundry

Tue, 11 Nov 2011

Micrel Inc. (Nasdaq:MCRL) has begun manufacturing MEMS at its San Jose, CA wafer foundry operations, offering 6" wafer fab and tools to produce advanced MEMS devices.


HUN sells MEMS printing fab technology to DDD

Tue, 11 Nov 2011

Huntsman Corporation (NYSE:HUN) Advanced Materials division sold its stereolithography resin and Digitalis MEMS manufacturing machine businesses to 3D Systems Corporation (NYSE:DDD) for $41 million in cash.


Silex MEMS TSV tech licensed to Nanoshift

Wed, 11 Nov 2011

Silex Microsystems licensed its Silex Sil-Via through-silicon-via (TSV) packaging platform to Nanoshift for use in early development of complex MEMS products.


MEMS alternatives for miniature auto-focus cameras

Wed, 11 Nov 2011

Dr. Giles Humpston, Tessera, presents the free, on-demand webcast Lens Tilt in Small Auto-Focus Cameras. Dr. Humpston covers the dominant auto-focus miniature camera technology today -- VCM -- and an improved technology based on MEMS, which is being commercialized now.


Micronit launches MEMS division

Wed, 11 Nov 2011

Micronit opened its MEMS division, specializing in the design, prototyping and manufacturing of MEMS devices and wafers based on glass and silicon.


BSI image sensors avoid distortion with Ziptronix bonding process

Thu, 11 Nov 2011

Ziptronix ZiBond direct bonding process contribute minimum distortion in backside illuminated (BSI) image sensors because of its low-temperature processing and high bond strength, the company reports.


Sensor fusion opens MEMS supply chain to sensor management players

Fri, 11 Nov 2011

Yole Développement's new report, "Inertial Combo Sensors for Consumer & Automotive" shows that supply chains need to adapt to the "very large market opportunity" for inertial combo sensors.


Sand 9 is halfway to $6M funding goal

Fri, 11 Nov 2011

Sand 9, a MEMS oscillator developer, reports that it has raised $3,095,262 of its 6,190,528 equity funding round, in a recent SEC filing.


Silex, AMFitzgerald accelerate MEMS ramp with DfM

Mon, 11 Nov 2011

MEMS foundry Silex Microsystems and MEMS development firm A.M. Fitzgerald & Associates completed a multi-year collaboration on medical and biotech MEMS development, halving device development time.


Micralyne brings MEMS design, prototyping partner into foundry model

Mon, 11 Nov 2011

MEMS foundry Micralyne Inc. brought Nanoshift LLC, a product development firm specializing in emerging technologies, on board for design, process development, fabrication and packaging partnerships.


MEMS packaging and test project aims for space

Tue, 11 Nov 2011

The Heterogeneous Technology Alliance in Europe is developing new packaging and test methods for MEMS targeting space missions.


Low-cost MEMS sensors drive automotive integration at all levels

Tue, 11 Nov 2011

The automobile industry is a "lucrative" sensor integration market globally, as sensors that enhance comfort, fuel-efficiency, and safety are integrated by vehicle manufacturers. MEMS sensor production costs are set to drop, which will bring automotive sensors into the price/benefit range of every level of automobile, says Global Industry Analysts.


Multiple-memory material garners Ontario entrepreneurship award

Wed, 11 Nov 2011

The Ontario Centres of Excellence gave the Martin Walmsley Fellowship for Technological Entrepreneurship award, totalling $50,000, to Innovative Processing Technologies Inc.


Measurement Specialties amends credit facility

Wed, 11 Nov 2011

Measurement Specialties Inc. (NASDAQ:MEAS), sensor designer and manufacturer, entered into an amendment to its senior secured credit facility dated June 1, 2010, among JPMorgan Chase Bank N.A. and certain other parties.


EVG moves Chinese SOI bonder customer to full automation

Thu, 11 Nov 2011

Shanghai Simgui Technology Co. Ltd., a Chinese wafer manufacturer, placed a follow-on order for an EVG850 automated production bonding system for SOI wafer bonding. Simgui is moving from EVG's semi-automated wafer bonder to advance high-volume SOI production.


MicroVision public offering of stock

Fri, 11 Nov 2011

MicroVision Inc. (Nasdaq:MVIS), maker of ultra-miniature laser display technology based on MEMS, intends sell shares of its common stock in an underwritten public offering, using the funds for general corporate purposes.


NSF funds MEMS made with cellulose nanocrystals

Mon, 11 Nov 2011

Auburn University chemical engineering researchers William R. Ashurst and Virginia A. Davis were awarded a National Science Foundation grant to investigate cellulose nanocrystals in MEMS.


25% jump in MEMS Executive Congress attendance signals emerging MEMS "mainstream"

Mon, 11 Nov 2011

Micro electro mechanical systems (MEMS) are seen in mainstream devices and creating "exciting new ways" of interacting with the world, say MEMS Executive Congress organizers MEMS Industry Group (MIG).


Thin-film ferroelectric sensor challenges microbolometers

Tue, 11 Nov 2011

Optex Systems entered into an MoU with Bridge Semiconductor Corporation to develop and sell thermal systems for a range of military applications. The thin-film ferroelectric technology aims to displace microbolometers for uncooled thermal sensing applications.


US atmospheric plasma tech company joins Precision Mechatronics

Wed, 11 Nov 2011

Precision Mechatronics Pty Ltd acquired Surfx Technologies, which specializes in high-speed atmospheric plasma technology for MEMS, microfluidics, semiconductors, solar cells, medical devices, and other manufacturing.


InvenSense (INVN) prices IPO

Wed, 11 Nov 2011

MEMS maker InvenSense Inc. (NYSE:INVN) priced its initial public offering of 10 million shares of common stock at a price to the public of $7.50 per share.


DARPA looks to Aurrion for E-PHI program to mix electronic, photonic, and MEMS components on one silicon chip

Wed, 11 Nov 2011

Microelectronics experts at Aurrion Inc. are seeking to develop military microelectronics technology for optoelectronic microsystems, under terms of a $13.9 million DARPA contract.


TowerJazz brings European partner to India and Brazil

Thu, 11 Nov 2011

Specialty foundry TowerJazz signed a non-exclusive memorandum of understanding (MOU) with a European entity to transfer processes and projects to India and Brazil, including semiconductor and MEMS devices.


MVIS closes stock offering

Thu, 11 Nov 2011

MicroVision Inc. (NASDAQ:MVIS) closed its public offering of 17,948,716 shares of its common stock with a draw of approximately $9.8 million after expenses.


MEMS costing tool calculates price structure of MEMS designs

Mon, 11 Nov 2011

System Plus Consulting releases MEMS CoSim+ V3.0, a comprehensive simulation tool for the non-standard manufacturing process of MEMS sensors.


Microfabricated piezoelectric creates hyper-active MEMS

Mon, 11 Nov 2011

University of Wisconsin-Madison engineers and physicists have integrated highly piezoelectric single-crystal material onto silicon to fabricate a low-voltage MEMS for communications, energy harvesting, sensing, actuators and other applications.


Gentex acquires InterSense for precise motion tracking tech

Tue, 11 Nov 2011

Gentex Corporation has acquired substantially all assets of InterSense, which makes MEMS-based hybrid motion tracking systems.


Multitest launches MEMS microphone tester with European order

Thu, 9 Sep 2011

The InPhone microphone test system can be combined with the Multitest InStrip test handler for highly parallel MEMS test and the calibration of MEMS microphones.


Alphabet Energy raises $12M for Si thermoelectric dev

Thu, 9 Sep 2011

Alphabet Energy Inc. closed its Series A funding round with $12 million, led by TPG Biotech, the venture arm of TPG. Alphabet Energy's prototype device converts waste heat to electricity. The silicon device leverages MEMS/semiconductor manufacturing technologies.


Sensor research benefits planes to prosthetics at TECHCON 2011

Fri, 9 Sep 2011

Sensors have the potential to do everything from monitor airplane fuselages for cracks to improve wrist rotation in prostetic arms. Student researchers describe their sensor development work in video blogs from TECHCON 2011.


Tronics expands MEMS manufacturing, HQ

Mon, 9 Sep 2011

MEMS foundry Tronics upgraded its Grenoble headquarters and manufacturing facilities, making a more than half a million euro investment, along with new equipment capital expenditures.


2012 sees automotive sensor market back to healthy growth track

Mon, 9 Sep 2011

IHS iSuppli's Richard Dixon looks at the market for automotive MEMS sensors over the next few years: which technologies and regions are driving growth, who are the top auto MEMS firms today and the up-and-comers, and how China is emerging as a market driver and supplier base.


Sanmina-SCI tapped for Kaiam MEMS-based optical component fab

Mon, 9 Sep 2011

Sanmina-SCI Corporation (Nasdaq:SANM) will produce a family of optical components based on Kaiam's MEMS hybrid integration technology.


MEMS "transition period" toward market maturity evident in mobile boom

Tue, 9 Sep 2011

MEMS vendors comprise MNC and MEMS-centric and small-portfolio companies. The market will grow as tablet/smartphone adoption increases, and MEMS makers co-opt the economies of scale that other semiconductor segments have used to reach maturity, according to ABI Research.


Microfluidics foundry opens under A*STAR in Singapore

Wed, 9 Sep 2011

A*STAR's Singapore Institute of Manufacturing Technology opened the SIMTech Microfluidics Foundry, offering microfluidics development, customization, and manufacturing. A*STAR's goal is to combine biomedical and engineering expertise to foster a microfluidics industry in Singapore.


MEMS oscillator maker taps Multitest for test handling

Wed, 9 Sep 2011

A MEMS oscillator maker chose the MT9928 xm tri-temp test handler from Multitest for a novel oscillator application. The MEMS device required extremely accurate temperature calibration.


Halma acquires photonics packaging company Avo Photonics

Thu, 7 Jul 2011

Halma plc, safety, health, and sensor technology group, acquired Avo Photonics Inc., opto-electronic design, packaging, and manufacturing specialist.


Qualtre raises $10m on gyroscope success

Fri, 7 Jul 2011

Qualtré Inc. recently demonstrated its first tri-axial solid-state silicon BAW MEMS gyroscope, prompting investors to supply an additional $10 million in capital to the company for a commercial ramp.


MEMS Executive Congress keynote line-up

Mon, 7 Jul 2011

The MEMS Executive Congress 2011, November 2-3 in Monterey, CA, keynote speakers include a strategist, financial expert, and technologist.


STM launches MEMS design competitions in Asia

Mon, 7 Jul 2011

STMicroelectronics (NYSE: STM) opened 2 2011 iNEMO Campus Design Contests, in China and Taiwan. The contest encourages students and young engineers to design innovative products based on STM's iNEMO MEMS platform.


mPhase hints at new auto and marine energy product

Wed, 7 Jul 2011

mPhase Technologies Inc. (OTC.BB: XDSL) completed its 2nd working prototype of a new automotive and marine product, reducing size by 20% and increasing the product's functionality.


CNSE adds mask aligner for MEMS fab

Thu, 7 Jul 2011

ClassOne Equipment sold its 150th mask aligner, which will be installed in the Smart System Technology & Commercialization Center of the College of Nanoscale Science and Engineering (CNSE) at UAlbany.


MEMS maker Synkera recognized in CO

Mon, 8 Aug 2011

The state of Colorado named Synkera (HQ: Longmont, CO) among 50 Colorado Companies to Watch, honoring the second-stage, growing company.


Sensirion expands CMOS sensor production

Mon, 8 Aug 2011

Sensor manufacturer Sensirion inaugurated a new building in mid-July 2011 in Stäfa, Switzerland, and will move all of its production there.


Multitest MEMS tester performs earth magnetic test

Tue, 8 Aug 2011

Multitest added a new application to its MEMS test and calibration portfolio, MT MEMS tester, testing 3D earth magnetic field sensors for mobile applications and GPS-free state-of-the-art navigation applications.


COMS 2011 to be held August 28-31

Thu, 8 Aug 2011

MANCEF announce that the Commercialization of Micro-and Nano-Systems (COMS) 2011 conference will be held in Greensboro, North Carolina, August 28th – 31st, 2011, at the Grandover Resort.


Epson uncrates sensor platforms based on QMEMS and semi tech

Thu, 8 Aug 2011

Epson Electronics America (EEA) launched two new series of sensing platforms, based on Epson's QMEMS and semiconductor technologies. The new Epson evaluation tools will help developers create and evaluate consumer applications.


Report: Mexico MEMS profs hurt in bomb attack

Wed, 8 Aug 2011

Two researchers at Mexico's Monterrey Technological Institute have reportedly been the subjects of a targeted letter-bomb attack by an "anti-technology anarchist group" for their work in nanotechnology including MEMS.


MEMS tracker report shows sensors outpacing semiconductor growth

Wed, 8 Aug 2011

Sensors are experiencing faster growth than the overall semiconductor chip industry, according to the Q3 Sensors and MEMS Market Tracker released by MarketResearch.com. Sensors hit almost $7 billion in 2010, with 6.5 million units shipped.


EVG wins SOI order from Shenyang Silicon Technology

Wed, 3 Mar 2011

EV Group (EVG) received an order from new customer Shenyang Silicon Technology Co. Ltd. (SST). SST will use an EVG850LT automated production bonding system for silicon-on-insulator (SOI) wafers.


Symmetricom MEMS based chip scale atomic clock integrated onto Jackson Labs Technologies GPSDO

Thu, 3 Mar 2011

Symmetricom SA.45s chip-scale atomic clock (CSAC).Symmetricom Inc. (NASDAQ:SYMM) and Jackson Labs Technologies Inc. signed a joint marketing agreement to market and sell Jackson Lab's CSAC GPSDO timing and frequency board with Symmetricom's atomic oscillator, the SA.45s chip-scale atomic clock (CSAC).


CMP selects TowerJazz CMOS image sensor power management processes

Fri, 3 Mar 2011

TowerJazz advanced 0.18µm power management and CMOS image sensor (CIS) technology and sophisticated process design kits are now available for prototyping to companies, universities and research labs through the services provided by CMP.


Dolomite launches Small Droplet Chip

Mon, 3 Mar 2011

Small Droplet Chip from DolomiteFor producing and analyzing microemulsions, the Small Droplet Chips allow the user to create micro-droplets from 5 to 30μm in diameter. Microemulsions offer increased stability, a higher interfacial area, and the capacity to solubilize both aqueous and oil-soluble compounds.


Honeywell to develop precision micro sensor gyro for smart munitions and hand held devices

Tue, 3 Mar 2011

miniature gyroscopeHoneywell Aerospace Microelectronics & Precision Sensors is developing miniature rate-integrating gyroscope technology for precision-guided munitions, ships, vehicles, aircraft, and individual combatants under a $5.9 million DARPA contract. The micro-sensor vibrating-structure gyroscope will measure rotation under harsh conditions immune to temperature, vibration, or other influences.


VTI ramps 3 axis gyro sensor production

Wed, 3 Mar 2011

CMR3000 from VTITo capture part of the fast-growing consumer electronics MEMS market, VTI Technologies will ramp volume production of its CMR3000.


Digital compass manufacturing: With nearly all makers in Japan, will the earthquake affect supply?

Fri, 3 Mar 2011

Global digital compass shipment forecast (Millions of units) SOURCE: IHS iSuppli March 2011.IHS iSuppli research indicates that 97% of all digital compass manufacturing worldwide in 2010 was conducted in Japan. Japan's March 11 earthquake has decimated transportation and utility power in the country. The top digital compass manufacturers in Japan say their operations are "normal."


5B MEMS to ship in 2016 thanks to consumer market

Fri, 3 Mar 2011

MEMS can take the form of (or be incorporated in) accelerometers, gyroscopes, magnetometers, altimeters, screens, projectors, and microphones. Often, consumer devices contain more than 1 MEMS component, and that trend is growing.


Akustica MEMS saves space by turning to semiconductor not MEMS fab

Tue, 4 Apr 2011

Semico chief of technology and blogger Tony Massimini looks at the AKU230 MEMS microphone from Akustica, and finds the tiny device trimmed down by use of semiconductor manufacturing processes rather than traditional MEMS fab.


Texas Instruments regains MEMS leadership in 2010, thanks to DLP chips

Wed, 4 Apr 2011

Five years after losing its leadership position in the global market for microelectromechanical systems (MEMS), Texas Instruments Inc. reclaimed the top spot in 2010 because of resurgent demand for the company's Digital Light Processing (DLP) chips, new IHS iSuppli research indicates.


BioScale scales up with new MEMS sensor fab cleanrooms, HQ

Wed, 4 Apr 2011

BioScale's new headquarters in Lexington MA include cleanroom space to manufacture MEMSBioScale relocated its corporate headquarters to scale up its commercial, scientific, R&D, and manufacturing functions in a newly renovated 30,000 square foot facility including Biological Level 2 laboratories and a clean room for its MEMS sensor manufacturing and assembly.


Agilent NanoSuite software improves nano indentation, tensile testing

Thu, 4 Apr 2011

NanoSuite 6.0 promises speed, flexibility, ease of use and new application methods for nanomechanical properties measurements involving polymers, composites, thin film materials, MEMS, surface topology, stiffness mapping, and scratch testing.


STMicro installs Heidelberg litho system for lab on chip development

Thu, 4 Apr 2011

ST Microelectronics has installed a µPG101 from Heidelberg Instruments in the "More Than Moore" Research Labs in Agrate Brianza to develop prototypes of new microfluidics devices for medical diagnostic, and lab-on-chip applications.


Miniaturized IMU from Movea measures 9 degrees of freedom

Mon, 4 Apr 2011

MotionPod from MoveaMovea created a wireless, miniaturized, inertial measurement unit (IMU) that uses MEMS sensors (partnering an accelerometer, gyroscope and magnetometer) to accurately measure 9 degree-of-freedom (DOF) motion for healthcare through gaming apps.


Top 4 MEMS suppliers rake in 1/3 total MEMS revenues

Tue, 4 Apr 2011

The MEMS industry grew 25% in 2010, and the 4 largest companies grew even faster, increasing their domination of Yole Développement's annual top 30 MEMS company ranking. These giants now account for some $2.9 billion of the sector's $8.6 billion in total sales.


Optical systems capture microfluidic experiment data

Wed, 4 Apr 2011

Optical systems that capture high-quality still and moving images of microfluidic experiments from DolomiteDolomite launched a range of optical systems that capture high-quality still and moving images of microfluidic experiments. Applications include testing various microfluidic chips for droplet generation and particle imaging, etc.


STMicro bTendo partner on pico projectors for mobile

Fri, 2 Feb 2011

STMicroelectronics (NYSE: STM) and bTendo Ltd. will jointly develop the world's smallest pico projector for smart phones and other portable consumer-electronics devices, based on bTendo's Scanning Laser Projection engine technology and ST's MEMS, video processing, and semiconductor process technology expertise.


Fluidigm prices FLDM IPO

Mon, 2 Feb 2011

Fluidigm Corporation priced its initial public offering (IPO) under the symbol FLDM. Fluidigm develops, manufactures, and markets microfluidic systems comprising instruments and consumables, including chips and reagents.


Draper Lab USF making microfluidic systems to test malaria drugs

Tue, 2 Feb 2011

A microfluidic device used to create human mimetic tissue models for testing potential malaria drugs.The University of South Florida received $5.45 million in grants from the Bill & Melinda Gates Foundation to create advanced devices that mimic the human liver to better study the life cycle of the malaria parasite, and to develop effective therapies for the disease.


Panasonic Seiko Epson lead MEMS resurgence in Japan

Thu, 2 Feb 2011

Panasonic Corp. and Seiko Epson Corp. are leading Japanese companies' resurgence in the MEMS market. Japanese firms were global leaders back in the 1990s, making such parts as sensors for car airbags. But the 2000s saw major U.S. and European semiconductor companies enter the field, grabbing market share by making massive capital investments and sharply boosting production efficiency.


Smart catheter funded for commercialization at NCSU

Fri, 2 Feb 2011

A North Carolina State University endowment fund established to bridge pure research and product commercialization for entrepreneurs has awarded a $10k grant to a biomedical engineering project that will use MEMS to make catheters flexible, then stiff, for stent delivery.


MEMSCAP thermally actuated variable optical attenuator demonstrates 200 million cycle+ reliability in die level tests

Mon, 2 Feb 2011

MEMSCAP (MEMS) completed die-level reliability testing beyond 200 millions cycles on its Thermally Actuated Variable Optical Attenuators. MEMS-based Variable Optical Attenuators are gaining momentum and market share over competing traditional technologies, according to MEMSCAP.


Nitto Denko plans prototyping center in Singapore for biosensors

Wed, 2 Feb 2011

Current R&D successes with Singapore's A*STAR IMRE prompted Nitto Denko to invest more in Singapore by building a prototyping center there, which will be incubated at local research institute. The prototyping center will focus on an optical waveguide for biosensing applications.


Energy harvesting lets NEC sensor measure power consumption without external power supply

Thu, 2 Feb 2011

NEC announced the development of a compact sensor that measures the power consumption of electronic devices and delivers this information to energy management systems, without needing an external power supply or battery.


CNSE wins 6M in sensor projects for military power gen

Fri, 2 Feb 2011

The Smart System Technology & Commercialization Center at U Albany's CNSE was selected by SPAWAR to build innovative sensor systems for U.S. military intelligence gathering and by EPRI to develop a groundbreaking wireless sensor network to monitor the efficiency of power generation. The two initiatives are valued at $6 million.


Auto consumer resurgence bodes well for global MEMS consumption

Tue, 2 Feb 2011

An uptick in passenger car production, improving consumer demand, and dwindling stockpiles in the supply chain have revived MEMS shipments. Investments in new product development, innovation, and expansion of production capacity bode well for the future of the market.


Aerotech nanopositioners provide lab accuracy at fab

Tue, 2 Feb 2011

ANT95-R and ANT130-R rotary stages Aerotech ANT95-R and ANT130-R direct-drive rotary stages offer in-position stability of 0.005 arc sec and incremental motion of 0.01 arc sec using the company's direct-drive technology. They suit disk-drive and MEMS manufacture and test, fiber-optic device alignment, as well as laboratory R&D applications.


Imec taps into silicon photonics advanced imaging 3D visualization

Mon, 2 Feb 2011

MEMS, imecResearchers at imec -- Danae Delbeke and Francesco Pessolano -- discuss announcements made in conjunction with Photonics West regarding the research consortium's NVISION program (for advanced imaging solutions) and silicon. Imec's silicon photonics platform allows for the miniaturization of complex photonic functions on a single chip.


USHIO brings NIL ashing system to US market

Wed, 2 Feb 2011

USHIO develops and begins marketing nano-imprint VUV ashing system "CHIPs" (Photo: Business Wire)USHIO America will start marketing the nano-imprint vacuum ultra violet (VUV) ashing system "CHIPs (Compact HiPower System)" in the US. Incorporated into nano-imprint lithography (NIL) equipment, the CHIPs allows non-contact and damage-free cleaning, surface improvement, and ashing of templates and workpieces.


Helios Crew SemiLEDs intros LED packaged with MEMS

Wed, 2 Feb 2011

MEMS packaged LED from HCCHelios Crew Corporation (HCC) Taiwan released its LED product S35, a packaged component LED that integrates MEMS with semiconductor processing to produce a unique silicon packaging technology.


Dolomite chip holder allows microfluidic temperature control

Mon, 2 Feb 2011

Dolomite's Hotplate Adaptor - Chip Holder HDolomite, microfluidic designer and manufacturer, expanded its range of temperature control systems with the Hotplate Adaptor - Chip Holder H, which allows control over internal temperatures of microfluidic chips without any disruptions to the fluid flow.


IC MEMS design partnership imec Coventor

Tue, 2 Feb 2011

Coventor and imec formed a strategic partnership to improve and expand the use of advanced design and manufacturing techniques for the development of CMOS-integrated MEMS. The partnership includes strategic alignment on R&D roadmaps and collaboration on advanced research topics.


MEMS foundry combo X FAB grabs 25 share in MFI

Thu, 2 Feb 2011

X-FAB Silicon Foundries and MEMS Foundry Itzehoe will combine their existing MEMS foundry capabilities and resources. MFI's contract MEMS manufacturing experience will broaden X-FAB's foundry capacity in 8" wafers, while MFI will access X-FAB's analog/mixed-signal Si foundry technology.


In Mexico MEMS course brings students in partnership with Sandia National Labs

Mon, 2 Feb 2011

A Mexican student works on MEMS design in a cleanroomSandia National Labs will leverage the traditional electronics manufacturing expertise in Mexico into MEMS design lessons for University of Guadalajara students. It says MEMS R&D can stabilize Mexico's economy while adding to US/Mexico border defense technologies.


SPTS acquires Primaxx etch tech for MEMS manufacturing

Mon, 2 Feb 2011

Primaxx provides residue-free MEMS dry etch release products, and is based in Allentown, PA. The transfer strengthens SPTS' etch technology portfolio that includes deep silicon etch, dielectric etch, inductively coupled plasma (ICP) etch, and now hydrogen fluoride (HF) vapor oxide etch.


MEMS venture chip tech companies among semi finalists in Zell Lurie Institute Annual Michigan Business Challenge

Tue, 2 Feb 2011

Update, February 22: MEMStim received $27,000 for best business and presentation, and outstanding team. The Samuel Zell & Robert H. Lurie Institute for Entrepreneurial Studies at the University of Michigan Ross School of Business announced that eight teams have advanced to the semi-finals of this year's Michigan Business Challenge, including MEMStim, an ODM that sells MEMS electrode leads for medical devices.


Sand 9 plans commercial MEMS oscillator production adds director

Wed, 2 Feb 2011

Sand 9, Inc. is planning volume launch of its MEMS oscillator technology for wireless applications. The company appointed Skyworks EVP Greg Waters to their Board of Directors, using his experience in wireless communications to help Sand 9 manage the transition from development to volume production.


DRIE tech transferred from Tegal to SPTS

Thu, 2 Feb 2011

SPTS completed the acquisition of deep reactive ion etch (DRIE) technology and certain related assets from Tegal Corporation. In addition, the deal includes the transfer to SPTS of the capital stock and operations of Tegal France SAS.


STMicro TriQuint make marks on MEMS market says iSuppli

Thu, 2 Feb 2011

Capitalizing on their design wins in Apple Inc.'s iPhone 4 and iPad, semiconductor suppliers STMicroelectronics and TriQuint in 2010 achieved industry-leading growth in the global market for MEMS in consumer electronics and mobile devices, new IHS iSuppli research indicates.


MEMS 3D researchers license wet deposition from Alchimer

Mon, 2 Feb 2011

Alchimer announced that the Centre de Collaboration MiQro Innovation/MiQro Innovation Collaborative Centre (C2MI) has licensed its suite of products and its Electrografting (eG) technology to support the center’s 3D MEMS programs.


NASA grant for MEMS deformable mirror fab awarded to Boston Micromachines

Mon, 3 Mar 2011

Boston Micromachines Corporation (BMC) won a $100k contract from NASA to support space-based imaging research. The contract will help develop a micro electromechanical deformable mirror (MEMS-DM) with critical enhancements to reliability and fault-tolerance.


CMOS image sensors overrun CCD for digital cameras

Tue, 3 Mar 2011

Figure. Digital still camera (DSC) image sensor unit shipments by technology (millions of units). SOURCE: IHS iSuppliCMOS image sensors for digital still cameras are set for rapid growth over the next 3 years, allowing shipments to exceed those of CCDs for the first time in 2013, according to IHS iSuppli. CMOS image sensors are winning over Sony, Canon, and other OEMs with better power consumption, lower fab costs, and circuit integration, among other benefits.


Hermetic wafer-level packaging lowers cost with IMT Au-Au bond

Tue, 3 Mar 2011

IMT introduced its hermetic gold-to-gold (Au-Au) thermo compression bonding for wafer-level packaging (WLP). In development for nearly a year, this bond is being actively used in production.


MIG seminar targets MEMS testing

Wed, 3 Mar 2011

A two-day seminar later this month in San Jose will offer insights into testing of MEMS inertial sensors and a "strategic plan" to decrease cost and increase efficiency of MEMS device testing.


MSGI blends nanotechnology, chemical-sensing IP in iPhone lab-on-chip for NASA

Thu, 3 Mar 2011

MSGI lab-on-chip for iPhone, developed with NASAMSGI Technology Solutions provided a science and technology update to its investors on its lab-on-chip chemical sensing technology being developed for NASA. Applications range from blood-less diabetes tests to bio-terrorism detection.


Nanotechnology researchers in Greece install Vistec lithography system

Thu, 3 Mar 2011

Vistec Lithography received a major order from Greece's National Center for Scientific Research (NCSR Demokritos) Institute of Microelectronics (IMEL). This will be the first 100kV lithography system in Greece.


Novel bulk metallic glasses mold like plastics, perform like metals

Tue, 3 Mar 2011

Yale materials scientist Jan SchroersYale's Jan Schroers and his team are using a new processing technique to fabricate miniature resonators for microelectromechanical systems (MEMS) as well as gyroscopes and other resonator applications from bulk metallic glasses (BMGs) twice as strong as steel.


Microchannel heat exchanger cuts bonding costs 90

Fri, 4 Apr 2011

Surface-mount adhesives can create microchannels on a wide variety of metals. SOURCE: Oregon State UniversityEngineers at Oregon State University have invented a new way to use surface-mount adhesives (SMAs) in the production of low-temperature, microchannel heat exchangers. University officials are now seeking a commercial partner in private industry to continue development and marketing of the technology.


Micro sensor enabled smart materials

Mon, 4 Apr 2011

The shape of more-complex surfaces can be acquired using multiple sensor ribbons in a comb structure.CEA-Leti has been developing microsensors capable of precisely measuring their orientation in relation to the Earth's gravitational and magnetic fields. Dominique Vicard and Nathalie Sprynski, CEA-Leti, say they are now beginning to incorporate arrays of these tiny micro sensors into new kinds of instrumented -- or proprioceptive -- materials.


MEMS ferroelectric thin films report

Mon, 4 Apr 2011

Ferroelectric materials were considered exotic semiconductor materials in the past. Thanks to better knowledge and industrialization of these materials, they are increasingly used in many new applications, especially in the MEMS field, says Yole Développement.


Discera ships application programmable MEMS oscillators

Wed, 3 Mar 2011

Discera Inc. launched high-performance DSC21XX I2C and DSC22XX SPI application programmable MEMS oscillators. The products fit into flexible FPGA- and CPLD-based designs.


Akustica digital microphone uses smallest fully integrated MEMS

Wed, 3 Mar 2011

The AKU230 is the first Akustica CMOS MEMS microphone manufactured by Bosch. The company claims that the monolithic microphone die is world's smallest at 0.70mm2. The package is industry-standard.


MEMS growth drives Coventor expansion

Thu, 3 Mar 2011

Coventor Inc., software supplier for developing micro-electromechanical systems (MEMS), expanded its reach in two key geographies with the opening of a new office in Italy, and a new distribution agreement in China.


MIT adds TESCAN SEM for nano MEMS microfluidics studies

Tue, 3 Mar 2011

TESCAN's VEGA 3 SEMTESCAN, scanning electron microscope and focused ion beam workstation maker, delivered a VEGA 3 scanning electron microscope (SEM) to the Massachusetts Institute of Technology (MIT) Micro and Nano Engineering lab.


Coventor updates SEMulator3D software for semiconductor and MEMS processes

Mon, 3 Mar 2011

Coventor Inc. announced availability of SEMulator3D 2011, the latest version of its virtual fabrication software for semiconductor and MEMS process development organizations. It includes the debut of SEMulator3D Reader.


Plasma Therm acquires majority share of Advanced Vacuum

Mon, 3 Mar 2011

Plasma-Therm LLC, plasma etch and deposition equipment supplier, secured majority shareholder status of Advanced Vacuum, a vacuum and thin film equipment provider headquartered in Sweden.


MEMS Japan earthquake updates

Wed, 3 Mar 2011

In light of the March 11 earthquake and tsunami that devastated northwestern Japan, and led to power outages and transport disurptions across the nation, we provide here a list of MEMS companies that have issued updates on their facilities and staff.


European MEMS top dogs led the pack in 2010, says IHS iSuppli

Wed, 3 Mar 2011

Top MEMS manufacturers in Europe. SOURCE: IHS iSuppliThe top European MEMS manufacturers -- Bosch, STMicroelectronics and VTI -- beat out the overall MEMS segment in 2010 growth. Growth came from automotive and consumer markets, with new product launches laying the groundwork for a strong 2011 as well.


Panasonic plans medical MEMS launch

Wed, 4 Apr 2011

To enter the MEMS for medical apps market, Panasonic could scale up MEMS operations in Fukui Prefecture, Japan, reports Nikkei. Panasonic, which already produces MEMS for consumer electronics, could enter the medical MEMS sector as early as 2011.


Russian university adopts MEMS/MOEMS CAE software from Open Engineering

Fri, 4 Apr 2011

OPEN ENGINEERING, the Multiphysics branch of the SAMTECH Group, signed a cooperation agreement with the Russian University of Information Technologies, Mechanics and Optics (ITMO).


Display tech commercialization, student collaboration goals of MicroVision global R&D center in Singapore

Mon, 4 Apr 2011

MicroVision (Nasdaq: MVIS), ultra-miniature display technology provider, opened a research and development center at Nanyang Technological University (NTU), Singapore. MicroVision plans to staff the new R&D facility with up to 25 engineers by 2012.


New MEMS flex muscle in 2011

Tue, 4 Apr 2011

New MEMS, a 4-yr old segment of the MEMS market specifically for consumer electronics (CE) and mobile handsets, will grow by 157.4% in 2011, powering the expansion of the overall MEMS industry, according to new IHS iSuppli research.


Electronic + photonic + MEMS chip: DAPRA requests proposals

Wed, 4 Apr 2011

Microelectronics scientists at DARPA are reaching out to industry to find new ways of blending electronic, photonic, and MEMS components on one silicon IC using today's semiconductor manufacturing technologies.


MEMS microphone providers see big market opps, big competition

Thu, 4 Apr 2011

Yole released a new report, MEMS Microphone, presenting MEMS microphones technologies, the related supply chain and its key players. The mobile phone market is still the largest consumer of MEMS microphones, and Knowles is still the dominant market player, though other companies are finding space in the sector.


Self compensating oscillator tech beats quartz and SiMEMS, says SWS

Mon, 4 Apr 2011

Si-Ware Systems (SWS) announced a novel Self Compensating Oscillator (SCO) technology, which produces an all-silicon oscillator that can achieve an overall frequency stability better than 100ppm over a temperature range of -20 to +70ºC.


CES adds MEMS program for 2012

Thu, 8 Aug 2011

The CES, annual consumer electronics show, will feature for the first time a MEMS TechZone and MEMS conference program at CES 2012.


Stanford adds 3 dry etch systems from Plasma-Therm

Tue, 8 Aug 2011

Stanford University will install 3 Plasma-Therm dry etch systems in its research facility for nanotechnology and photonics, joining 2 Plasma-Therm deposition systems the university requisitioned during a facility upgrade in February 2010.


MEMS watch motor brings 3-phase motor onto Si

Tue, 8 Aug 2011

At the Swiss EPFL Integrated Actuactors Laboratory, researchers have constructed an electromagnetic three-phase motor on silicon that could make watches 3x more efficient and add other applications to time keeping.


FLIR public offering could fund acquisitions, subsidiary expansions

Wed, 8 Aug 2011

FLIR Systems priced a public offering of $250 million aggregate principal amount, planning to fund general corporate needs, such as working capital, investments in or extensions of credit to FLIR subsidiaries, capital expenditures, stock repurchases, and acquisitions.


STM MEMS exec keynotes International Microtech/MEMS Conference in Korea

Thu, 8 Aug 2011

Benedetto Vigna, group VP and GM of ST Microelectronics MEMS, Sensors, and High-Performance Analog Division, will keynote the International Microtech/MEMS Conference with "The Future of MEMS and Challenges to Success."


Potomac Photonics adds QC, inspection to micro-machine services

Thu, 8 Aug 2011

Potomac Photonics added advanced quality control (QC) and inspection capabilities to its service offerings for micro-electronics, MEMS, micro-fluidics and other projects.


Sporian sensors in development for Gen IV nuclear use

Fri, 8 Aug 2011

Sporian Microsystems received a DOE contract to evaluate harsh-environment materials, MEMS, and packaging technologies for Generation IV nuclear reactor use.


Imec, Holst MEMS readout chip eschews customization

Mon, 8 Aug 2011

Imec and Holst Centre showcase research on an ASIC architecture that provides readout functions for accelerometers and strain sensors without draining device power. The chip could be used for various sensors in a continuous monitoring application, as for seismic activity.


Automotive MEMS sensors recalculating for growth after 2010-2011 disruptions

Tue, 8 Aug 2011

The automotive MEMS sensor market will rise starting in 2012, according to IHS. Revenues will increase 16% to $2.31 billion, thanks to vehicle production ramp-up as Japan recovers from the earthquake/tsunami and various countries implement safety regulations.


MEMS bring magnetic sensors growth in mobile applications

Thu, 8 Aug 2011

Magnetic sensors will exceed $3.2 billion in sales by 2017 driven largely by "E-compassing" applications, according to Global Industry Analysts. Unique end-use applications, along with technology innovations, interoperability with devices and competitive pricing, will fuel "robust" magnetic sensors growth.


EVG installs MEMS bonder at Quebec research center

Tue, 6 Jun 2011

EVG will install a 200mm Gemini fully automated wafer-bonding system with cleaning module at the MiQro Innovation Collaborative Centre in Quebec.


See the MEMS tech showcase at SEMICON West

Tue, 6 Jun 2011

The MEMS DemoZone Display, presented by the MEMS Industry Group, will display MEMS products and suppliers at SEMICON West, showcasing the diversity, enabling capabilities, and nuances of MEMS technology.


OmniVision brings wafer-level lens fab in-house, for $45 million

Thu, 6 Jun 2011

OmniVision Technologies Inc. (NASDAQ:OVTI) will acquire wafer-level lens production and assembly processes out of its TSMC JV, VisEra.


Silicon Sensor International expands auto sensor fab deal

Fri, 7 Jul 2011

Silicon Sensor International's subsidiary Microelectronic Packaging Dresden will extend its sensor fab contract for an auto maker, doubling production of a steering angle detection sensor. The contract could be worth EUR50M.


MEMS foundry rankings show STM's dominance, pure-play foundry growth

Tue, 7 Jul 2011

Frontrunner STMicroelectronics is winning by a distance in the MEMS foundry race: outpacing mixed-model and pure-play MEMS makers alike by at least 5x. While mixed-model players earned more than pure-play foundries in 2010, the pure foundries are where growth is happening, says IHS iSuppli.


Quadcopters take top prize in STM MEMS iNEMO contest

Thu, 7 Jul 2011

A quadcopter designed by "Team McGill," students at McGill University, won the iNEMO Design Contest, hosted by STMicroelectronics and Digi-Key. Team McGill used the iNEMO evaluation board and 9 embedded degrees of freedom for their winning quad-copter design.


poLight raises $18.5 million for MEMS-based auto-focus lenses

Thu, 7 Jul 2011

poLight AS, reflowable autofocus actuated cameraphone lenses maker, closed its Series B financing round with NOK100 million (USD 18.5 million), led by Norway's Investinor.


tMt joins MEMS research at IME, growing foundry presence

Fri, 7 Jul 2011

tMt will help refine areas in IME's three-party collaboration model for MEMS prototyping and mass production for medical, consumer, and other applications.


A.M. Fitzgerald and Micralyne partner to bring MEMS concepts to HVM

Tue, 7 Jul 2011

Pure-play MEMS foundry Micralyne Inc. and A.M. Fitzgerald & Associates (AMFitzgerald), a MEMS product development firm, partnered to fast-track product commercialization.


CEA-Leti improves MEMS reliability with new packaging, ruthenium

Wed, 7 Jul 2011

CEA-Leti has revamped its RF MEMS manufacturing for higher reliability and performance, using thin-film packaging and replacing gold with ruthenium for the contacts. The design also prevents contact between the electrodes when the bridge is down.


ALD tool from Lesker suits MEMS, nano fab

Thu, 7 Jul 2011

Kurt J. Lesker's new Atomic Layer Deposition system, the ALD 150LX, can operate as a stand-alone or fully integrated cluster tool system for nano, microelectronics, optics, MEMS, semiconductor, photovoltaics, photonics, catalysis & fuel cells, and OLED manufacturing.


Fraunhofer MEMS enable Vuzix video glasses goal

Thu, 7 Jul 2011

Fraunhofer and Vuzix have partnered on R&D, with the goal being a MEMS device that integrates the display and optics into a monolithic display engine, aiming for "sunglass-styled" video glasses.


MEMS testing units bolster Rasco product line with high parallelism

Fri, 7 Jul 2011

Rasco GmbH, a Cohu Inc. (NASDAQ: COHU) subsidiary, added the Pressure Test Unit (PTU) and the Acoustic Test Unit (ATU) to its line of testers for MEMS ICs.


MXIM buys SensorDynamics, builds MEMS portfolio

Mon, 7 Jul 2011

Maxim Integrated Products (MXIM) acquired SensorDynamics, an Austrian semiconductor company that develops proprietary sensor and microelectromechanical (MEMS) devices, for $130 million plus about $34 million of debt.


Round microchannels prove better than rectangular channels

Tue, 7 Jul 2011

MuSES Laboratory researchers at Michigan Tech have characterized the output flow power of round and square/rectangular microfluidic channels, revealing distinct improvements with round geometries.


MEMS Workshop aims to fill ecosystem gaps

Tue, 7 Jul 2011

iNEMI and the MEMS Industry Group will host MEMS Needs and Opportunities, a workshop running September 15-16, with the goal of identifying gaps in technologies, processes, and test methodologies and forming collaborations to tackle them.


MEMS manufacturing on retuned CMOS lines

Thu, 7 Jul 2011

Tony McKie, GM of MEMSSTAR, tackles the question of how to make MEMS truly manufacturable. "Nobody builds a MEMS manufacturing line anymore," says McKie.


TI's single-chip IR MEMS thermometer targets mobile devices with small form factor and low power consumption

Mon, 6 Jun 2011

Texas Instrument's (TI) TMP006 MEMSTI developed a single-chip passive IR MEMS temperature sensor for contactless temperature measurement in portable consumer electronics. The TMP006 integrates an on-chip MEMS thermopile sensor, signal conditioning, a 16-bit ADC, local temperature sensor and voltage references on a single 1.6mm2 chip.


Sandia MEMS design student contest winners

Tue, 6 Jun 2011

A dragonfly with beating wings and an ultra-sensitive microvalve were top winners at Sandia National Lab's student design contest for MEMS.


Dolomite debuts microfluidics connector line

Wed, 6 Jun 2011

Dolomite, microfluidic device maker, designed the Multiflux range of microfluidic connectors and interfaces.


Freescale adds MEMS pressure sensor to Xtrinsic line

Thu, 6 Jun 2011
Freescale Semiconductor (NYSE:FSL) debuted a high-precision MEMS pressure sensor, Xtrinsic MPL3115A2, for altitude detection.

Melexis contactless MEMS IR temp sensors avoid temp-induced errors

Thu, 6 Jun 2011

The new Melexis MLX90614ESF-DCH and MLX90614ESF-DCI offer heightened acuracy thanks to a combination of sensors and digital processing technology.


Measurement Specialties' China operation wins gov funding for R&D

Fri, 6 Jun 2011

Sensor maker Measurement Specialties Inc. (MEAS) was awarded the R&D Technology Certification along with RMB3 million funding from the Shenzhen government.


MEMS post-earthquake: Japan's MEMS industry dodges disaster

Tue, 5 May 2011

For the MEMS industry in general and for Japan's MEMS sector in particular, the damage from the March 11 earthquake and tsunami was not as severe as initially feared due to a fortuitous accident of geography. Only three of the 22 most important MEMS and compass fabrication plants in Japan suffered direct damage, IHS iSuppli research shows.


Knowles MEMS microphones using ADI IP banned from US by ITC

Wed, 5 May 2011

The International Trade Commission ruled in Analog Devices' favor and found that Knowles Electronics infringed ADI's Wafer Anti-Stiction Application (WASA) patent. The ITC also issued an exclusion order prohibiting further importation into the US of Knowles' infringing "MEMS [microphone] devices and products containing the same."


CMOS image sensors see growth beyond cellphones

Wed, 5 May 2011

Figure. CMOS vs CCD image sensor dollar volumes. Source: IC Insights May 2011.CMOS image sensors did not see the same strong rebound in 2010 that the semiconductor industry at large experienced. New momentum, driven by new system applications outside of camera phones and digital still cameras, could focus CMOS image sensors on growth from 2011 on, says IC Insights.


CNT-based thin-film structures create new MEMS/NEMS

Thu, 5 May 2011

Using lithography-compatible nano self-assembly, plasma etching, and sacrificial etch release, University of Minnesota researchers created carbon nanotube (CNT) based thin film MEMS/NEMS structures.


McGill, STMicro co-create sensor course

Thu, 5 May 2011

STMicroelectronics (NYSE: STM) and McGill University collaborated on an undergraduate course that teaches the integration of multiple state-of-the-art sensors into embedded computer systems, via lab exercises and projects based around STM's iNEMO platform. Some 35 students have already completed the course, with final projects in gaming, aerospace electronics, and more.


DARPA commissions MEMS from Northrop Grumman, GA Tech: New fab process underway

Wed, 5 May 2011

Northrop Grumman Corporation (NYSE:NOC) and Georgia Tech are developing a new type of MEMS gyroscope based on a new MEMS fabrication process that should allow smaller size, lighter weight, and lower power consumption with same performance to current silicon MEMS devices.


SiTime's new MEMS oscillators offer jitter, stability improvements for telecom, networking, storage and wireless

Mon, 5 May 2011

SiTime SiT820X The SiTime SiT820X family consists of the SiT8208 and SiT8209 programmable oscillators that operate from 1 to 80MHz and 80 to 220MHz respectively. These devices achieve 2x better stability over the industrial temperature range than quartz-based solutions, the company reports.


ULIS IR imaging sensor has military, surveillance apps

Tue, 4 Apr 2011

ULIS launched Pico640E, a video graphics array (VGA) 640 x 480 17µm IR imaging sensor that offers new advantages in size, performance and factor of merit.


Silicon magnetically actuated MEMS micromirror from Lemoptix replaces galvanometer and rotating mirrors

Tue, 4 Apr 2011

MEMS mirror chip.To significantly reduce size and power consumption and increase performance of micromirror devices, Lemoptix used semiconductor-like equipment to build micromirrors with actuation based on magnetic and heat-dissipating principles instead of gearings.


MEMS IDMs grab consumer, auto biz; top 20 MEMS foundries lag market

Wed, 4 Apr 2011

MEMS foundries shared unequally in the MEMS market's 25% growth in 2010. Total combined revenues of the top 20 MEMS foundries climbed only 10%, as companies doing internal production instead grabbed most of the big growth in consumer and automotive markets. Not to worry though, specialized foundry work yielded higher margins than the volume stuff.


C2MI's 3D MEMS fab adds Akrion Systems' advanced wet stations

Wed, 4 Apr 2011

The MiQro Innovation Collaborative Centre (C2MI) will purchase three Akrion Systems GAMA automated wet process systems for the development and manufacture of advanced devices at C2MI's state-of-the-art MEMS facility in Quebec.


MEMS + smart phones: Better together, says Semico

Wed, 4 Apr 2011

Smart phones are a booming market. MEMS and sensors are a booming market. Semico estimates that the total available market for MEMS and sensors in the smartphone market will reach $3.0 billion in 2011, an annual growth of 52.7%.


Nano bead could revolutionize sensor technology

Thu, 4 Apr 2011

Immunoassay based sensor: Oregon State UniversityOregon State University scientists tap into the capability of ferromagnetic iron oxide nanoparticles to detect chemicals with sensitivity and selectivity. These ferromagnetic iron oxide nanoparticles can be incorporated into a system of ICs to instantly display the findings.


Samsung Apple Nintendo buy most consumer/mobile MEMS sensors in 2010

Thu, 4 Apr 2011

Top consumer and mobile MEMS purchasers (millions of USD). IHS iSuppliSamsung Electronics in 2010 recaptured the top spot from Nintendo as the largest buyer of MEMS sensors for mobile phones and other consumer electronics, while Apple Inc. grabbed second place to move within striking distance of number 1, according to new research from Jérémie Bouchaud of IHS iSuppli.


Energy harvesting beyond the lab thanks to silicon micromachining

Fri, 4 Apr 2011

Photo. A new energy harvester developed by University of Michigan researchers can harness energy from vibrations and convert it to electricity with five to ten times greater efficiency and power than other devices in its class. Credit: Erkan AktakkaUniversity of Michigan engineers have developed a vibration energy harvester with high-quality piezoelectrics built using silicon micro-machining processes that would allow high-volume production. The harvester could operate wireless sensor networks in factories for 20+ years without maintenance.


Optoelectronics, sensors and discretes sight another record year

Tue, 4 Apr 2011

Figure. Sales changes in the economic downturn and recovery. SOURCE: IC InsightsSlightly above average growth rates in 2011 will lift sales of optoelectronics, sensors and actuators, and discrete semiconductors to new record-high levels again this year, thanks to growth in MEMS and LED markets, says IC Insights.


Bosch deploys Cadence for custom/analog flow

Mon, 5 May 2011

Robert Bosch GmbH (Bosch), one of the top 4 MEMS suppliers, has standardized on an enhanced custom/analog flow based on Virtuoso v6.1 technology from Cadence Design Systems Inc.


CMOS image sensor IDM orders multiple Camtek AOI systems

Tue, 5 May 2011

Camtek received a follow-on order for its new Gannet automatic optical inspection (AOI) system from a leading Asian integrated device manufacturer (IDM) for the application of CMOS image sensor inspection.


Wafer-level MEMS mic debuts from 3S

Tue, 5 May 2011

SSSM100 is a tiny analog output CMOS MEMS microphone manufactured under standard CMOS process and wafer level packaging (WLP) technology.


SB Microsystems named COMSOL Certified Consultant

Tue, 5 May 2011

SB Microsystems, specializing in the design, simulation, prototyping, and testing of microfluidic devices and micro electromechanical system (MEMS) fabrication, is now certified as COMSOL Multiphysics experts.


DelfMEMS RF MEMS delivered to NTT DOCOMO

Wed, 5 May 2011

DelfMEMS has delivered custom RF MEMS samples to telecom operator NTT DOCOMO. DelfMEMS provided arrays of custom MEMS ohmic switches to enable tunability into RF FEM for mobile applications. Voltage, size, losses, isolation, ultra-fast switching time and power handling will be evaluated by NTT DOCOMO.


Piezoelectric deposition tech wins $3M investment, SolMateS plans MEMS fab equip penetration

Thu, 5 May 2011

SolMateS PiezoFlare 1200SolMateS received investments for the final development of the PiezoFlare 1200 piezoelectric thin film deposition machine. PiezoFlare 1200 is an automated deposition system for PZT thin films on 6" or 8" wafers, based on pulsed laser deposition.


MEMS unaffected, crystals disrupted by Japan earthquake

Thu, 5 May 2011

MEMS fabs in Japan after earthquakeCrystals and MEMS are used in electronic components as the basis of oscillators. Both are popular in consumer electronics devices like smartphones. Crystal growth was significantly interupted by the major March 11 earthquake off the coast of Sendai, Japan. MEMS, on the other hand, seem to have escaped the disaster largely unscathed, show 2 new reports from IHS iSuppli.


STM sensing hardware uses 3 MEMS for 10 DoF

Fri, 5 May 2011

STMicroelectronics (NYSE: STM) launched a complete hardware solution for advanced sensing applications with 10 degrees of freedom. A set of 3 thin, high-performance MEMS sensors provides accurate and comprehensive information on linear, angular, and magnetic motion together with altitude readings.


Optics Balzers offers optical patterning processes

Fri, 5 May 2011

Optics Balzers is offering a portfolio of patterning technologies for producing high-grade optical components. Depending on the application, patterning techniques such as photolithography, laser ablation, or masked coatings are available.


Dolomite, Sphere Fluidics collaborate on microfluidics

Mon, 5 May 2011

Dolomite and Sphere Fluidics established a collaboration, wherein Dolomite will help bring Sphere Fluidics microdroplet technologies to market faster. Dolomite expects to gain new capabilities via the partnership.


MEMS showcase at SEMICON West proves MEMS role in mainstream electronics

Mon, 5 May 2011

The MEMS Industry Group (MIG) is organizing the inaugural "MEMS in the Machine" DemoZone at SEMICON West, sharing compelling examples of MEMS in action.


Microfluidics consortium eyes standards in chip interconnect

Thu, 5 May 2011

The MF3 Microfluidics Consortium, which includes Philips, STMicroelectronics (STM) and others, recognizes a need for standards in how microfluidic chips are connected to systems. Since microfluidics perform diverse tasks, three main interconnect types were identified.


Analog Devices iMEMS accelerometers bypass temperature compensation circuitry

Tue, 5 May 2011

Analog Devices Inc. (ADI) released the ADXL206 high precision, low power, dual-axis iMEMS accelerometer with signal conditioned analog voltage outputs. Instead of using additional temperature compensation circuitry, ADI's design techniques ensure that high performance is built in.


MEMS wafers characterized by Zebraoptical integrated metrology tool

Tue, 5 May 2011

Zebraoptical Integrated Metrology Tool (ZIMT)Sunrise Optical LLC debuted the Zebraoptical low coherence fiber optic interferometer with microscope attachment. The Zebraoptical Integrated Metrology Tool (ZIMT) provides metrology readings on micro electromechanical system (MEMS) wafers.


Newport laser microfabrication station optimized for MEMS research

Wed, 5 May 2011

Laser µFAB from Newport CorporationNewport Corporation, lasers and photonics technology provider, introduced the Laser µFAB tabletop laser microfabrication workstation for researchers. Equipped with submicron resolution and a large stage, the tool can perform polymerization and ablation for MEMS, microelectronics, and other applications.


STM ramps MEMS production to 3 million a day

Wed, 5 May 2011

STMicroelectronics (NYSE: STM) will bump up its MEMS production capacity to more than 3 million sensors a day by year's end. The capacity ramp is being supported by a "beefed-up manufacturing machine," said Benedetto Vigna, group VP and GM of ST's MEMS, Sensors and High Performance Analog Division


MEMS + CMOS aim of IME, Towerjazz partnership

Wed, 5 May 2011

Specialty foundry TowerJazz will collaborate as a manufacturing partner with Singapore's Institute of Microelectronics (IME) on MEMS, packaging and ASICs. This marks another notch in TowerJazz's Asia expansion, which includes new China offices and a potential fab buy in Japan.


Sensors worth $91.5B in 2016; Bio/chemical sensing tops growth

Thu, 5 May 2011

Figure. Global sensors market, 2009-2016 in $ millions. Source: BCC Research May 2011.The sensors industry will be worth $91.5 billion in five years, according to BCC Research. While the largest segment -- image, flow and level sensors -- will see 8.5% CAGR, biosensors and chemical sensors will see the fastest market growth at 9.6% CAGR.


Imec ITF: A world of opportunities for nanoelectronics

Thu, 5 May 2011

Nanoelectronics is not only about smaller transistors and more complex chips, it's about a whole new world of opportunities and solutions to major societal challenges, underlined imec president/CEO Luc Van de hove, in his opening keynote at imec's annual International Technology Forum this week in Brussels.


Wafer bonding: Many options for many devices

Tue, 5 May 2011

Wafer bonding. SOURCE: Yole May 2011. Wafer bonding is a complex process, used on 2" to 12" wafers for MEMS, image sensors, advanced packaging, LEDs, and other chips. Yole Développement published a technology study and market research report, "Permanent wafer bonding," to derive trends in the market and technology through 2016.


Graphene, CNT NEMS resonators exhibit nonlinear damping

Tue, 5 May 2011

A depiction of the nanoscale mechanical resonators constructed with graphene and CNTs.Catalan Institute of Nanotechnology Professor Adrian Bachtold and his research group created resonators from nanoscale graphene and carbon nanotubes (CNT) that exhibit nonlinear damping. This result could lead to supersensitive detectors of force or mass.


Fraunhofer ISIT joins MEMS Industry Group

Fri, 8 Aug 2011

The MEMS Industry Group welcomed Frauhofer Institute for Silicon Technology to its membership. The research facility focuses on microelectronics and microsystems technology. Siconnex, which builds diverse MEMS fab equipment, also joined the association.


Record MEMS revenues from tablet, smartphone adoption

Wed, 8 Aug 2011

Consumer and mobile MEMS devices will see record revenue growth in 2011, thanks to higher MEMS content in smartphones and tablets, as well as increased smartphone/tablet adoption. New MEMS devices coming on the scene promise continued growth.


CellGuide chooses Baolab MEMS-based compass for GPS

Wed, 8 Aug 2011

CellGuide selected Baolab's 3D NanoCompass IC technology as a companion to its location and positioning products, fully integrating GPS and compass functionalities in the CLIOX-C. The nanoscale MEMS manufacturing technique used for the NanoCompass supports high-volume, space-constrained applications.


STM exec keynotes MEMS workshop from iNEMI

Fri, 9 Sep 2011

Benedetto Vigna, group VP and GM of ST Microelectronics' MEMS, Sensors, and High-Performance Analog Division, will keynote the iNEMI MEMS workshop.


poLight taps SVTC for optical MEMS commercialization ramp

Tue, 9 Sep 2011

poLight will work with SVTC Technologies to optimize its TLens production process for large volumes.


Asian MEMS foundry installs SPTS DRIE tool

Wed, 9 Sep 2011

SPTS Technologies received an order for an Omega deep reactive ion etch (DRIE) process module from an Asian MEMS foundry. This marks SPTS' 900th DRIE tool sold.


NanoInk sells nanofabrication tool to West Virginia University

Thu, 9 Sep 2011

NanoInk's NanoFabrication Systems Division will deliver an NLP 2000 nanofabrication system to West Virginia University's Multifunctional and Energy Ceramics Laboratory for research on developing micro-sensors based on complex nanomaterials and nanocomposites.


Smartphone/tablet motion sensor MEMS: What's next?

Thu, 9 Sep 2011

Jérémie Bouchaud, IHS, reports on motion sensing MEMS growth through 2015, including new motion sensors to be integrated into smartphones and tablets. These devices are driving a sales boom for MEMS sensors.


Microsystem commercialization center breaks ground in OH

Fri, 9 Sep 2011

The Entrepreneurship Innovation Center at Lorain County Community College in Ohio hosted a groundbreaking ceremony today for its Richard Desich SMART Commercialization Center for Microsystems.


Goodrich MEMS IMU ordered for Turkish missiles

Mon, 9 Sep 2011

Turkey's Roketsan Missiles Industries Inc. ordered Goodrich (NYSE:GR) SiIMU02 inertial measurement units (IMU) for precision guidance tasks on Roketsan's new CIRIT 70mm laser-guided missile for attack helicopters.


Silicon magnetic sensors follow the right course through 2015

Mon, 9 Sep 2011

Silicon magnetic sensors are riding an upswing in automotive production and the expansion in tablet/smartphone adoption to 23.7% revenue growth in 2011, according to IHS iSuppli. This amounts to $1.46 billion in revenue.


Nanostart's Microlight Sensors stake increases

Tue, 9 Sep 2011

Nanostart AG (OTCQX:NASRY) is progressing in its planned stake increase in Microlight Sensors, now holding 31% of the optical sensor maker.


MicroVision may sell Azimuth $35M in common stock

Wed, 9 Sep 2011

MicroVision Inc. (Nasdaq: MVIS) secured a committed equity financing facility, wherein it can sell Azimuth Opportunity Ltd. up to $35 million of its shares of common stock over a 24-month period.


MIT redesigns MEMS for better energy harvester

Wed, 9 Sep 2011

MIT researchers have constructed a piezo-MEMS energy harvester using a bridge design rather than a cantilever. The bridge allows a wider frequency range to generate electricity, and keeps the piezoelectric material to a single layer.


Microcantilevers sense interactions between nanomaterials and living cells

Tue, 5 May 2011

Micro-cantilevers can measure lipid bilayers interactions with surfactants with a new level of sensitivity, say Rice University researcher Sibani Lisa Biswal and Kai-Wei Liu, a graduate student. Applications range from better detergents to buckyball/cell interaction research, to investigations of how viruses penetrate cells.


Microfluidics module handles single- and multi-phase flow simulation

Fri, 5 May 2011

Based on COMSOL Multiphysics simulation software, the new COMSOL Inc. Microfluidics Module enables users to study microfluidic devices and rarefied gas flows. The module is designed for microfluidics and vacuum researchers and engineers.


NIST collaborates on MEMS roadmaps: ITRS, iNEMI

Mon, 5 May 2011

As smartphones usher in a host of new high-volume MEMS applications, semiconductor and electronics roadmaps are paying serious attention to the manufacturing and costs gaps in MEMS production. NIST's Michael Gaitan and the MEMS Industry Group are helping shape iNEMI, ITRS roadmaps with MEMS in the spotlight.


The future of MEMS: Rethinking business strategies and manufacturing technology for volume systems markets

Tue, 6 Jun 2011

SEMICON West preview: Rapid growth in mainstream consumer markets is changing the structure of the MEMS industry from an artisanal to a volume manufacturing business -- creating a new set of challenges and opportunities to companies to find better ways to speed the production ramp, find better ways to integrate multiple die and software, and to find the right business models.


Peptides, electrodes work together on bio-circuit at U Penn

Wed, 6 Jun 2011

University of Pennsylvania researchers formed biological molecules connected to electrodes, paving the way for direct biological integration into electronic circuits. The team also developed a new microscope technique to measure the electrical properties of these constructs.


Deep silicon etch from Oxford Instruments offers process flexibility

Mon, 6 Jun 2011

PlasmaPro Estrelas100 deep silicon etch technology from Oxford Instruments.Oxford Instruments debuted the PlasmaPro Estrelas100 deep silicon etch technology for the MEMS R&D and fabrication market. The tool is designed to be flexible, accomodating multiple processes without changing chamber hardware, and multiple wafer sizes for R&D-to-production ramp.


Asia package test house selects Multitest equip for MEMS test

Wed, 6 Jun 2011

Multitest InFlipA major test house in Asia will install Multitest's InCarrier loader/unloader, InStrip, and InMEMS module for accelerometer MEMS test.


Knowles patents upheld against MemsTech

Wed, 6 Jun 2011

The US Court of Appeals for the Federal Circuit affirmed that MemsTech's importation and sale of certain MEMS microphone packages infringes Knowles Electronics LLC's US Patents 7,242,089 and 6,781,231.


NASA grants BMC Phase II space imaging contract

Thu, 6 Jun 2011

Boston Micromachines Corporation (BMC) will use a $1.2M NASA award to expand on an existing NASA project to develop fault-tolerant microelectromechanical deformable mirror (MEMS-DM) arrays and smaller, lower-power drive electronics.


Moog buys MEMS device maker Crossbow Technology for $32M

Mon, 6 Jun 2011

Moog acquired Crossbow Technology for its innovative MEMS technology, which will complement Moog's controls products. The purchase price was $32 million.


Omron shares MEMS dev at Sensors Expo

Thu, 6 Jun 2011

Omron's Micro Device Division (MDD) will release numerous MEMS products in the coming year, notably an absolute pressure sensor for high-accuracy navigation and a thermal IR sensing array for smart buildings and appliances.


More MEMS-per-device coming to automotive safety systems

Wed, 6 Jun 2011

 In 2016, about 150 million systems will be installed in vehicles, containing over 830 million MEMS chips, says ABI Research. The growth is thanks to more MEMS in each safety or performance device, as well as government and consumer demand for new cars with integrated safety features.


Gas-based etch enables MEMS materials flexibility, commercial reliability at Fraunhofer

Fri, 6 Jun 2011

A researcher operates Fraunhofer's MEMS production tools. Copyright Fraunhofer IMS.Fraunhofer Institute for Microelectronic Circuits and Systems IMS developed a gas-based etch step that allow MEMS designers to use a wider range of materials for the functional layer, while preventing device damage during etch.


NEMS sensor improves AFM

Fri, 6 Jun 2011

The US National Institute of Standards and Technology's (NIST) Center for Nanoscale Science and Technology (CNST) has improved atomic force microscopy (AFM) by replacing the microscope's optical instrumentation with a nanomechanical cantilever probe and nanophotonic interferometer on a chip.


Industrial MEMS market headed for consolidation, says Frankfurt Partners

Wed, 6 Jun 2011

A major consolidation is coming to the industrial MEMS market in the next 12-18 months, predicts Frankfurt Partners. The industrial MEMS market is both highly attractive and highly fragmented.


Levelling tech from NanoInk enables better nano-printed arrays

Tue, 6 Jun 2011

NanoInk's NanoFabrication Systems Division is launching a force sensor and levelling devices at the Nanotech Conference and Expo, part of TechConnect World. NanoInk will also be presenting on Dip Pen Nanolithography (DPN) advances.


Kaiam MEMS-based optical ICs attract investors

Thu, 6 Jun 2011

Kaiam closed its Series B investment round with over $5 million. TriplePoint Capital, which led the round, cited Kaiam's MEMS-based optical integration as "applicable as much for high-end high-capacity data transport as for low cost FTTH applications."


ITRI installs EVG bonders to ramp 200mm MEMS

Wed, 6 Jun 2011

Taiwan's Industrial Technology Research Institute (ITRI) will install more EV Group (EVG) wafer bonding tools to research and develop advanced manufacturing processes for next-generation micro electro mechanical system (MEMS) devices, especially on 200mm wafers.


Projected 23% CAGR in MEMS microphone market attracts crowd of entrants

Thu, 6 Jun 2011

SEMICON West preview: Companies are scrambling for a piece of the growing market of MEMS microphones for mobile phones, where applications are widening and demands are getting more sophisticated.


FEI plasma FIB tool suits MEMS, 3D packaging

Mon, 6 Jun 2011

High-speed sectioning of TSVs with plasma FIB. The device was located, cross-sectioned, polished, and imaged with PFIB. SOURCE: FEI FEI's new Vion plasma focused ion beam (PFIB) system based on inductively-coupled plasma (ICP) source technology using a xenon ion beam generates more than a micro-amp of beam current and can remove material faster than liquid metal ion sources, says product marketing manager Peter Carleson.


STM branches MEMS tech out into touchscreen displays

Mon, 6 Jun 2011

STMicroelectronics (NYSE:STM) debuted "FingerTip" technology, which enables a single-chip solution for capacitive touchscreens up to 10" diameter with multi-touch capability. FingerTip shares STM's MEMS sensors methodology: a sensing element connected to a high-performance capacitance-sensing circuit.


X-FAB MEMS accelerometer design IP blocks shorten dev time

Thu, 6 Jun 2011

X-FAB Silicon Foundries released ready-to-use design IP blocks for MEMS accelerometers, as part of its MEMS foundry service offerings. The IP blocks can be used in gyroscopes and accelerometers spec'd up to 100 G-force, shortening NPI and HVM ramp.


Plures, MEMS and spintronics foundry, merges with CMSF Corporation

Fri, 6 Jun 2011

CMSF Corporation (OTCBB:CMSF) will merge with Plures, which, through its 95%-owned subsidiary, Advanced MicroSensors Corporation, is a semiconductor foundry developing and fabricating high-quality, high-margin MEMS and spintronics products.


SEMICON West Lesson #5: Interests outside CMOS

Mon, 7 Jul 2010

Wrap-up of what we heard and saw at SEMICON West 2010. Lesson 5: Interest was overflowing for high-growth areas outside traditional CMOS: MEMS, LEDs, solar. And the industry really can reach everywhere around us.


Introduction to MEMS gyroscopes

Mon, 11 Nov 2010

MEMS gyroscope introductionJay Esfandyari, Roberto De Nuccio, Gang Xu, STMicroelectronics, introduce how MEMS gyroscopes work and their applications, the main parameters of a MEMS gyroscope with analog or digital outputs, practical MEMS gyroscope calibration techniques, and how to test the MEMS gyroscope performance in terms of angular displacement.


MEMS-in-2011-and-beyond: POVs from the MEMS Executive Congress

Thu, 11 Nov 2010

Dan Siewiorek, Karen Lightman, Rich Duncombe, Vida Ilderem, and other speakers from the MEMS industry shared their visions for the future at the MEMS Executive Congress 2010. Following are summaries of their talks, from the "iPhone 20" lifetime smart-companion to seisic imaging developments, energy management, and more MEMS opportunities.


Automotive-MEMS-sensor-market-on-a-roll

Tue, 11 Nov 2010

Driven by the rapid recovery in automotive production and inventory rebuilding among sensor component suppliers, the market for automotive microelectromechanical system (MEMS) sensors will expand to record size in 2010, according to market research firm iSuppli, now part of IHS.


Faster inspection of MEMS possible with microinterferometer arrays

Mon, 11 Nov 2010

Scientists involved in the European Union's "Smart inspection systems for high-speed and multifunctional testing of MEMS and MOEMS" (SMARTHIEHS) project are developing a new test concept based on parallel inspection of devices at wafer level.


InvenSense-integrates-3-axis-gyroscope-3-axis-accelerometer-on-single-silicon-die

Wed, 11 Nov 2010

InvenSense released its MPU-6000 product family. The MPU-6000 MEMS motion sensing technology integrates a 3-axis gyroscope and a 3-axis accelerometer on the same silicon die together with an onboard Digital Motion Processor (DMP) capable of processing complex 9-axis sensor fusion algorithms.


Kionix-extends-reach-in-inertial-MEMS-sensors-debuts-gyros-accelerometers

Tue, 11 Nov 2010

Kionix Inc. announced a portfolio of MEMS inertial sensors featuring 3 new accelerometers that set company benchmarks for low power, performance over temperature, and user programmability. Kionix also released its first two gyros for mass-market consumer applications.


Silicon-etch-for-microelectronics-research-at-university-Texas-at-Austin

Tue, 11 Nov 2010

The Microelectronics Research Center of the University of Texas at Austin increased its facility capabilities by installing a Plasma-Therm VERSALINE DSE system. The addition of leading deep silicon etch technology enables process advances in MRC’s micro, nano and opto-electronics research. 


Automotive MEMS market witnessing a record 2010

Wed, 12 Dec 2010

iSuppli MEMS analyst Richard Dixon takes a closer look at what's driving the market for MEMS sensors in automotive applications (hint: safety and China), new applications and market shifts, and the long-awaited arrival of consumer-oriented suppliers.


MEMS packaging conference planned for 2011

Tue, 12 Dec 2010

The University of Michigan College of Engineering will present Packaging for MEMS March 31 to April 1, 2011, in Boston, MA. MEMS packaging is a significant part of product cost. This program highlights what to consider in developing application-specific packaging that will meet your goals for product performance, durability, and total cost.


Quiet revolution: MEMS thrives on application diversity

Thu, 12 Dec 2010

iSuppli MEMS analyst Richard Dixon analyzes one of the fastest-growing MEMS sectors today: "high-value" technologies specifically built for use in industry, medical, energy, and wired telecommunications.


Lab-on-chip system could provide fast detection of single nucleotide variations in DNA: IEDM news

Thu, 12 Dec 2010

At IEDM, Panasonic and imec discussed components of their lab-on-chip collaboration: miniaturized pump for on-chip generation of high pressures, a micropillar filter optimized for DNA separation achieving record resolution, and a SNP detector allowing on-chip detection using very small sample volumes.


Printed everything: PE/PV show highlights flexible 3D interconnects, biosensors, memory, PV cell hybrids

Thu, 12 Dec 2010

Techcet's Michael A. Fury continues his report from IDTechEx's combined Printed Electronics/ PV USA events, with talks about 3D stacked interconnects made from printed inks, printed biosensors for textiles, a disposable explosives-detecting wipe, silicon-organic PV cells, printed rewritable permanent memory devices, and more.


Quantum-computing-focus-of-MEMS-mirrors

Mon, 12 Dec 2010

A new laser-beam steering system that aims and focuses bursts of light onto single atoms for use in quantum computers has been demonstrated by collaborating researchers from Duke University and the University of Wisconsin-Madison.


Reduced-gravity-NASA-funded-rHEALTH-microfluidics-sensor-test

Thu, 12 Dec 2010

NASA testing of a lab-on-chip microfluidics sensorThe DNA Medicine Institute (DMI) successfully completed reduced-gravity experiments on its rHEALTH sensor for the 2010 Facilitated Access to the Space Environment for Technology (FAST) program, at NASA in Houston.


iPhone-4-MEMS-microphone-technology-boon

Fri, 12 Dec 2010

Highlighted by their adoption in Apple Inc.’s iPhone 4, microelectromechanical system (MEMS) microphones are set to achieve a more than 50% increase in shipments in 2010 and a fourfold rise by 2014, according to the market research firm iSuppli, now part of IHS Inc. (NYSE: IHS).


Automotive MEMS market witnessing a record 2010

Wed, 12 Dec 2010

iSuppli MEMS analyst Richard Dixon takes a closer look at what's driving the market for MEMS sensors in automotive applications (hint: safety and China), new applications and market shifts, and the long-awaited arrival of consumer-oriented suppliers.


Microvisk raises third funding round for MEMS based blood clot monitor

Thu, 1 Jan 2011

Microvisk Technologies, developer of a system to monitor the blood clotting status of patients taking Warfarin, raised £6 million through a rights issue to existing investors in an oversubscribed round. Microvisk has developed a medical diagnostic strip based on MEMS technology.


Measurement Specialties buys MWS Sensorik

Thu, 1 Jan 2005

IMT raises $17 million

Wed, 1 Jan 2005

Microfabrica and MOSIS launch MEMS fab service

Tue, 1 Jan 2005

JPSA announces micromachining for medical device manufacture

Thu, 1 Jan 2005

Rite Track announces Tokyo Electron agreement

Thu, 1 Jan 2005

Akrion GAMA systems to ship to Singapore fab

Wed, 1 Jan 2005

Dust sweeps up $22 million and a pair of new partners

Thu, 2 Feb 2005

Rite Track to ship deep UV track system

Wed, 2 Feb 2005

Coventor names new VP of marketing, biz dev

Wed, 2 Feb 2005

Kionix ships tiny tri-axis accelerometer

Tue, 2 Feb 2005

MEMS Industry Group releases '05 report

Wed, 2 Feb 2005

Companies launch fab owner's association

Thu, 2 Feb 2005

Dalsa, Primaxx partner on MEMS

Fri, 2 Feb 2005

From the 2004 archives: Michigan researchers, companies continue to engineer growth

Fri, 2 Feb 2005
Each year, Small Times ranks the U.S. states for their research, development and commercialization proficiency in the areas of nanotechnology, MEMS and microsystems. Last year, Michigan ranked eighth. Its 2004 report card follows.

Hymite announces new silicon MEMS package

Thu, 12 Dec 2005

Tegal announces etch tool orders

Fri, 12 Dec 2005

SUSS nets Chinese MEMS order

Mon, 12 Dec 2005

Sensant to put MEMS into ultrasound

Tue, 1 Jan 2005

MEMS enable smart golf clubs

Thu, 1 Jan 2005

A VC's perspective on valuation

Mon, 1 Jan 2005
We at Harris & Harris Group are more confident than ever that nanotechnology will spawn some great new companies. But we and other venture capitalists are not paying – and should not pay – premium valuations for nanotechnology-enabled companies.

2005 may be a momentous year for MEMS, or maybe just a momentum-building year

Fri, 1 Jan 2005
As a new year begins, it seems to be a good time to ask: What will 2005 bring? Within the MEMS industry, there’s always something interesting afoot, so let’s answer that question by exploring 2004’s accomplishments and developments that could shape 2005. Accelerometers got their foot in the door with cell phones in 2004 – a huge accomplishment. But, will the use of accelerometers for peripheral applications, such as pedometers and game controllers, really catch on?

Metconnex appoints Peter Becke CEO

Mon, 1 Jan 2005

EV installs IQ aligner at Promerus

Wed, 1 Jan 2005

MEMS Industry Group to provide cost assessment tool

Wed, 1 Jan 2005

TRONIC'S to open U.S. MEMS office

Wed, 1 Jan 2005

Semi groups announce nanoelectronics study

Mon, 1 Jan 2005

Ohio's 2004 performance in Small Times' rankings: diversity, practicality pay off

Wed, 1 Jan 2005

Kronos and U Washington collaborating on chip cooling

Wed, 1 Jan 2005

Side-impact regulations could drive more demand for MEMS sensors

Wed, 2 Feb 2005
The airbag accelerometer is generally regarded as one of the best examples of a MEMS sensor giving automakers a simultaneous price and performance advantage. The same may one day be said of MEMS-based tire pressure monitors, now being integrated in mainstream models in response to safety legislation. Now there’s another area where MEMS is poised to make inroads in automotive – side-impact crash protection.

NanoCon wraps up with talks on biotech, funding

Mon, 9 Sep 2006
Small Times NanoCon International in Las Vegas came to a close on Friday with a keynote address by a veteran of the biotech industry and a second keynote on how the Sarbanes-Oxley act affects nanotech, as well as a trio of panels that covered the life sciences, what it takes to go public, and how to get early stage funding for a nanotech startup.

STS announces development of 300mm DRIE plasma source for high volume IC manufacturing

Tue, 9 Sep 2006
Surface Technology Systems plc (STS), a developer of plasma process technologies required in the manufacturing and packaging of MEMS and advanced electronic devices, announced the development of a new Deep Reactive Ion Etch plasma source which is compatible with 300mm silicon wafers.

Crossbow unveils uNAV sensor pack

Tue, 6 Jun 2005

BEI to supply MEMS to Thales Aerospace

Mon, 6 Jun 2005

Changing mindsets is key to success

Fri, 6 Jun 2005
The Washington Technology Center's (WTC) Microfabrication Laboratory is celebrating its tenth anniversary. Like any entrepreneurial venture, we experienced successes and challenges in achieving this milestone.

American Sensor acquires Macro Sensors

Fri, 6 Jun 2005

Swiss institute mixes training, languages

Mon, 6 Jun 2005
The Swiss Federal Institute of Technology (EPFL) in Lausanne may be located on the idyllic banks of Lake Leman, but the institute has its feet solidly on the ground. Its programs combine technical training with something rarely emphasized in science and engineering: linguistic dexterity. Its leaders believe that mix will make the institute more attractive to students and to the businesses that eventually hire them.

Globalization alters manufacturers' rules
Are nano, micro as vulnerable as anything else?

Mon, 6 Jun 2005
As globalization continues its relentless onslaught, the question inevitably arises: Precisely who benefits from this scenario? Certainly shareholders stand to benefit from innovation and the industrial development that follows. The employees of new firms benefit, too. And then there are the local economies in which such industries develop. They benefit from the creation of new jobs, the expansion of the local service sector, and from the reinvigorated tax base that results.

'04 nano funding report: less money but record number of rounds

Wed, 2 Feb 2005
The amount of money invested by venture capitalists in U.S. companies commercializing nanotechnology fell a precipitous 35 percent last year, according to data released today by Small Times. However, the number of companies receiving funding increased 32 percent, to the highest level Small Times has tracked in data going back to 1995.

FormFactor announces first delivery from new factory

Thu, 6 Jun 2005

IMT partners with MEMTronics on RF MEMS

Tue, 6 Jun 2005

Akrion names senior VP for sales

Thu, 3 Mar 2005

Fabrinet to supply BEI division

Fri, 3 Mar 2005

Apogee begins testing MEMS medical device

Fri, 3 Mar 2005

SUSS expands wafer bonder line

Thu, 4 Apr 2006
SUSS MicroTec, a supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, announced it is extending its existing wafer bonder range to include a new platform designed specifically for research, development and other low volume bonding applications. Currently the bonder carries the project name of "Elan".

Cascade introduces new measurement platform

Tue, 4 Apr 2006
Cascade Microtech of Beaverton, Ore., announced the introduction of a 150mm device measurement platform for measuring anything from semiconductor wafers, ICs, printed circuit boards and MEMS to bioscience devices.

IMT forms biosensor division

Mon, 12 Dec 2005

Chinese auto sensor companies move into India

Tue, 12 Dec 2005
China Automotive Systems Inc., a Wuhan, Hubei, China, power steering components and systems supplier and Sensor System Solutions Inc., an Irvine, Calif., manufacturer of MEMS sensors, interface electronics and control systems, announced a new project for its joint venture to manufacture and distribute manifold absolute pressure (MAP) and temperature and manifold air pressure (TMAP) sensors in India, as well as provide technical and commercial support to an unnamed Indian automobile manufacturer.

Measurement Specialties acquires MEMS sensor company

Fri, 12 Dec 2005

SiTime announces sampling of MEMS oscillators

Mon, 4 Apr 2006
By his own admission, MEMS industry veteran Kurt Petersen didn't think MEMS resonators were a viable commercial product. For starters, moisture would eventually creep into the packaging, undermining performance. And to make matters worse, the packaging itself would make it difficult if not impossible to compete in a price-driven market.

Richardson to distribute TeraVicta RF MEMS

Thu, 4 Apr 2006

Amtech announces solar order

Fri, 4 Apr 2006
Amtech Systems Inc., a supplier of production and automation systems and related supplies to the semiconductor, solar cell and silicon wafer industries, announced that a major U.S. manufacturer of solar energy products awarded the company an order for its Bruce Technologies horizontal BDF 200 diffusion furnace.

SUSS sells to MiPlaza

Tue, 4 Apr 2006

Tokyo Electron delivers new MEMS tester

Wed, 4 Apr 2006

Olympus, Movaz launch joint venture

Fri, 4 Apr 2006

sp3 unveils diamond deposition system

Tue, 4 Apr 2006

Publicly-traded nano VC firm rings NASDAQ closing bell

Tue, 5 May 2006
Saying that its listing on the NASDAQ has played a big role in Harris & Harris (NASDAQ: TINY) becoming one of the venture capital firms with the most investments in nanotechnology, company Chairman and CEO, Charles Harris, rang the closing bell.

MEMSIC opens design center

Tue, 5 May 2006

Freescale orders production wafer bonding system from SUSS MicroTec

Wed, 5 May 2006

INEX completes facilities upgrade

Fri, 3 Mar 2006

IMEC installs SUSS systems

Wed, 3 Mar 2006

Surface Technology nets MEMS order

Thu, 3 Mar 2006

Lightconnect announces new VOA with polarization maintaining fiber

Thu, 3 Mar 2006
Lightconnect, a supplier of MEMS optical components, announced a new variable optical attenuator with polarization maintaining fiber for power control and receiver protection in next generation optical networks.

JDSU introduces new MEMS optical product

Mon, 3 Mar 2006
JDSU introduced three new optical communications products under its Agile Optical Network (AON) strategy, which is intended to address the need for more agile, dynamically reconfigurable networks for consumer and business services.

Xponent begins production at IMT

Thu, 3 Mar 2006
Xponent Photonics, a maker of optical components, announced that it has begun production volumes of silicon planar lightwave circuits (PLCs) at Innovative Micro Technology.

Nintendo sources tri-axis accelerometer to Analog, ST Micro

Wed, 5 May 2006
Analog Devices Inc. and ST Microelectronics announced on Tuesday that they would be supplying tri-axis MEMS accelerometers for use in Nintendo's new home video game console, the Wii. The accelerometers will be used to provide a motion-activated user interface for the gaming machine.

mPhase names nano researcher chief scientist

Wed, 2 Feb 2006

Nano financiers aim to reinvent seed funding

Wed, 2 Feb 2006
Private funding works a certain way. Entrepreneurs bootstrap their moonlight tinkerings into small startups. They raise early financing from friends, family and angel investors. They go to venture capitalists. But a couple of companies actively funding nanotech are not so certain that's the best way after all.

Integral Vision announces new orders

Fri, 2 Feb 2006

IMT installs new SUSS wafer bonder

Wed, 2 Feb 2006

Sensor System Solutions signs agreement with X-Labs Global

Tue, 3 Mar 2006
Sensor System Solutions Inc., a manufacturer of MEMS sensors, intelligent sensor interface electronics and intelligent embedded control systems, announced it has signed an agreement with X-Labs Global, a technology advisory and consulting firm based in Los Angeles.

Companies partner on automotive sensor development

Thu, 3 Mar 2006
Methode Electronics International GmbH, a division of Methode Electronics Inc., a global developer and manufacturer of electronic component and subsystem devices, and SensorDynamics AG, a development company manufacturing intricate microchip and micro-sensor systems, announced that they have signed a long-term collaboration agreement.

GenISys announces Layout LAB simulation software for MEMS

Tue, 12 Dec 2006
Developers of MEMS and flat panel displays now have a powerful new development and productivity tool from GenISys GmbH, a leading-edge provider of software solutions for efficient processing optimization of microstructure fabrication.

EV Group, Sonix collaborating

Fri, 12 Dec 2006
EV Group (EVG), a St. Florian, Austria, supplier of wafer-bonding and lithography equipment for the advanced packaging, MEMS and semiconductor markets, and Sonix Inc., a supplier of advanced acoustic NDT solutions for bonded wafers & MEMS, announced they are joining forces as Sonix selects EVG as their exclusive worldwide reseller/distributor of selected Sonix products.

SemiSurplus revamps site

Fri, 12 Dec 2006
SemiSurplus Inc. of West Chester, Ohio, launched a new web site for sales of semiconductor, MEMS, and nanotechnology equipment.

Tegal receives order for 6500 advanced etch system from Skyworks Solutions

Fri, 12 Dec 2006
Tegal Corp., a San Jose, Calif., designer and manufacturer of plasma etch and deposition systems, announced that it had received an order for an 6500 Advanced Etch cluster tool from Skyworks Solutions Inc.

Companies partner on MEMS communication devices

Wed, 8 Aug 2006
Advanced Diamond Technologies Inc. announced that the company and its collaborators received a $1.4 million Phase II program award from the Defense Advanced Research Projects Agency (DARPA) to advance next-generation broadband communication devices based on Advanced Diamond's Ultrananocrystalline Diamond (UNCD).

Siargo announces low power MEMS fuel cell sensors

Wed, 8 Aug 2006
Siargo Ltd. of Santa Clara, Calif., announced the release of its low power MEMS sensors for fuel cell systems, including a gas mass flow sensor for solid oxide fuel cells and a methanol concentration sensor for direct methanol fuel cells.

MEMSIC opens new Asia offices

Tue, 8 Aug 2006
MEMSIC Inc., a provider of CMOS-based MEMS accelerometers/motion sensors, announced it has opened branch offices in Tokyo, Japan and in Taipei, Taiwan. The company said it will open additional offices in Shanghai and in Shenzhen, mainland China for local customer support in Asia.

IMT receives ISO 9001 certification

Thu, 8 Aug 2006
Innovative Micro Technology (IMT), a Santa Barbara, Calif.-based contract manufacturer for MEMS, announced that it received ISO 9001:2000 certification from Det Norske Veritas (DNV).

Discera names Japanese distributors

Mon, 12 Dec 2006
Discera Inc., a San Jose, Calif.-based company developing MEMS resonator technology and provider of MEMS-based timing solutions, announced a pair of partnerships to distribute Discera's MEMS resonator-based timing products.

XCOM Wireless selects IMT to make RF relays

Mon, 12 Dec 2006
Dec. 4, 2006 -- XCOM Wireless Inc., a Signal Hill, Calif., developer of radio frequency products, announced it selected Innovative Micro Technology, a Santa Barbara, Calif., MEMS contract manufacturer, to manufacture die for its RF MEMS relay product.

SiTime names new operations VP

Wed, 12 Dec 2006
SiTime Corp., a Sunnyvale, Calif., start-up commercializing silicon MEMS resonators, announced the appointment of Regina Rekhtman as vice president of operations.

WiSpry names new management team members

Mon, 12 Dec 2006
WiSpry Inc., an Irvine, Calif., company developing RF MEMS tunable components and devices for the wireless industry, announced the appointment of Scott Feltenberg and Collin Baker to its executive team. Feltenberg joins WiSpry as vice president of finance and Baker joins WiSpry as vice president of customer engineering.

Entrepix selected by defense contractor to provide CMP for infrared sensor production

Fri, 12 Dec 2006
Entrepix Inc., a Tempe, Ariz., provider of CMP foundry and equipment services, announced the signing of a CMP FastForward volume pricing agreement with a leading aerospace defense contractor.

austriamicrosystems announces 50V high-voltage CMOS process with embedded flash

Fri, 12 Dec 2006
austriamicrosystems' foundry business unit announced a 50V High-Voltage CMOS process with embedded Flash. The company says this is the consequent next step in extending austriamicrosystems' position in High-Voltage CMOS technology.

EV Group, Sawatec extend agreement

Fri, 12 Dec 2006
EV Group (EVG), a St. Florian, Austria supplier of wafer-bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets and Sawatec, a manufacturer of advanced components and manual loaded instruments for photolithography, have signed a reseller agreement.

The Nov/Dec issue

Wed, 12 Dec 2006
Read our predictions for the year ahead, a review of the aerospace market, the 2006 MEMS industry report card and more. Plus a report on how 2-year colleges are training the nano workforce of the future, MEMS-based energy monitoring, and how microfluidics solved the spinach scare.

The Small Times staff will be on a nano (or micro, depending on your point of view) break starting Dec. 23 and will return Jan. 2

Fri, 12 Dec 2006
* * * * * * * * *
As the publisher of Small Times, I want to take this opportunity to wish all of our readers, advertisers, sponsors, and contributing writers a very happy ...

Air mouse threatens to replace TV remotes

Wed, 3 Mar 2006
As MEMS-based products make their way into the consumer electronics market, one promising application is a device a reviewer dubbed the "remote control bagel."

Dalsa receives new CCD contracts

Thu, 3 Mar 2006

Omron to buy Seiko Epson subsidiary's semi assets

Mon, 10 Oct 2006
OMRON Corp., a developer of automation, sensing and control technologies, announced that it has reached a preliminary agreement to acquire the semiconductor business assets of Seiko Epson's consolidated subsidiary, Yasu Semiconductor Corp.

EV Group and Datacon extend cooperation on advanced-chip-to-wafer technology

Mon, 10 Oct 2006
EV Group, a St. Florian, Austria, supplier of wafer-bonding and lithography equipment for the advanced packaging, MEMS and semiconductor markets and Datacon Technology GmbH, a leading supplier of flip-chip and die bonding equipment, announced the installation of an EVG540C2W System at Datacon.

Integral Vision announces additional SharpEye order

Tue, 10 Oct 2006
Integral Vision Inc. of Wixom, Mich., announced that it has received an additional order for its SharpEye inspection system from a MEMS display manufacturer. This customer currently uses several SharpEye systems in the manufacture of displays. Integral Vision's products provide for detection of display defects to assure quality in the manufacturing process.

Block MEMS nets funds to develop gas sensor

Thu, 10 Oct 2006
Block MEMS LLC of Marlborough, Mass., announced it was recently awarded a $4.5 million contract by the U. S. Army Research Office.

SMI moves into high volume with 6-inch MEMS fab

Tue, 10 Oct 2006
Silicon Microstructures Inc. (SMI) of Milpitas, Calif., announced production levels of more than 40,000 pressure sensors per day on its recently installed six-inch wafer MEMS manufacturing line.

Hymite expands North American effort

Tue, 10 Oct 2006
Hymite A/S, a manufacturer of silicon-based packaging products for electronic devices, announced the expansion of its North American sales operations with the addition of a worldwide sales director and new offices in Rockwall, Texas. The expansion is designed to answer the growing market need for wafer-scale packages for consumer and industrial, medical and automotive components, including LEDs.

Virtus expanding MEMS development program

Mon, 10 Oct 2006
Virtus Advanced Sensors, a developer of MEMS multi-axis inertial sensors, announced plans to expand its program for accelerometers, gyroscopes and integrated motion sensors.

MEMS fab nets automotive ISO certification

Tue, 10 Oct 2006
Silicon Microstructures Inc. (SMI), a Milpitas, Calif., silicon sensor designer and manufacturer, announced it has achieved ISO/TS 16949:2002 certification for its new six-inch MEMS production line.

Researchers developing self-cleaning PV arrays, non-stick MEMS

Wed, 10 Oct 2006
Researchers at the Georgia Institute of Technology are mimicking one of Nature's best non-stick surfaces to help create more reliable electric transmission systems, photovoltaic arrays that retain their efficiency, MEMS structures unaffected by water and improved biocompatible surfaces able to prevent cells from adhering to implanted medical devices.

ULCOAT chosen as potential mold supplier for SUSS C4NP

Tue, 9 Sep 2006
SUSS MicroTec announced that the first potential commercial source for C4NP glass molds has been selected. SUSS explained that the Glass MEMS Division of ULVAC COATING CORPORATION (ULCOAT) of Saitama, Japan has successfully demonstrated trial production of the reusable glass molds needed to bump wafers using IBM's C4NP process.

NanoWorld selects SUSS wafer bonding system

Mon, 9 Sep 2006
SUSS MicroTec, a Munich, Germany, supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, announced an order for its ELAN CB6L wafer bonding system to NanoWorld Services.

Small Times announces upgrade to publication Web site

Wed, 9 Sep 2006
Small Times today announced the re-launch of its web site -- SmallTimes.com. The premier online destination covering commercial micro and nanotechnology, SmallTimes.com has been enhanced with an upgrade to its Web platform. The announcement was made at Small Times NanoCon International in Las Vegas.

Small Times Magazine announces Best of Small Tech Awards at leading nanotech business event

Thu, 9 Sep 2006
Small Times (TM) Magazine presented its highly respected Best of Small Tech Awards at the Small Times NanoCon International conference and trade show today in Las Vegas. This is the fifth annual Small Times (TM) Magazine Best of Small Tech Awards, which spotlight the top leaders and the biggest successes in nanotechnology, MEMS, and microsystems during the past year.

Applied Microstructures ships MVD150 series

Thu, 8 Aug 2006
Applied MicroStructures, a San Jose, Calif., provider of molecular vapor deposition equipment and contract deposition services, announced it has delivered its first MVD150 automated production system to a leading global manufacturer of MEMS devices for use in the deposition of anti-stiction layers.

Tegal nets repeat orders for 900 series etcher

Mon, 8 Aug 2006
Tegal Corp., a designer and manufacturer of plasma etch and deposition systems used in the production of integrated circuits and nanotechnology devices, announced that two leading Japanese companies had placed repeat orders for Tegal 900 series plasma etch systems.

PI announces new translation stage

Fri, 8 Aug 2006
PI of Auburn, Mass., announced its P-652 piezoelectric linear-motor driven translation stage.

Collaborating on aero and defense can be like shooting for the moon

Tue, 9 Sep 2006
The French city of Toulouse is an aerospace town. The headquarters of Airbus and the French National Center for Space Studies are nearby, as is Aerospace Valley, a French cluster of hundreds of companies and state bodies focused on space.

Bifano to lead BU Photonics Center

Mon, 10 Oct 2006
Boston University announced that Thomas Bifano, a professor in its College of Engineering, has been named director of the Boston University Photonics Center. Bifano has served as the center's interim director since January, when founding director Donald Fraser retired.

Bell Helicopter chooses Honeywell MEMS system

Tue, 2 Feb 2006
Bell Helicopter selected Honeywell to provide five key avionic products for the new Bell 429 helicopter, Honeywell announced this week. The centerpiece of the avionics is the new KSG-7200 Air Data Attitude Heading Reference System (ADAHRS).

Akustica launches single-chip microphone

Tue, 2 Feb 2006

XCOM, IMT process makes RF relays more economical

Thu, 12 Dec 2007
XCOM Wireless Inc., a developer of radio frequency products, and Innovative Micro Technology, a MEMS contract manufacturer, say they have reached a "critical milestone" in producing a joint RF MEMS relay product.

Sensors strip off packaging with VTI chip-on-MEMS

Thu, 12 Dec 2007
VTI Technologies has developed manufacturing concepts that it says offer better ways of combining MEMS and ASIC technologies.

Explosives-on-a-chip improve military detonators

Thu, 12 Dec 2007
Developed by a team of scientists from the Georgia Tech Research Institute, tiny copper structures with pores at both the nanometer and micron size scales could play a key role in the next generation of detonators used to improve the reliability, reduce the size and lower the cost of certain military munitions.

ISE releases five-recipe controller for MEMS production

Thu, 8 Aug 2007
ISE has released a five-recipe temperature timer controller (TTC) is designed for use with virtually all process etch, strip, and develop wet-process baths.

MEMSConcepts.com launches idea-exchange platform

Thu, 8 Aug 2007
MEMSConcepts.com has officially launched its membership-based network to join innovators and idea seekers.

Tegal sells plasma etch system to Japanese sensor and control maker

Mon, 8 Aug 2007
Tegal Corp., designer and manufacturer of plasma etch and deposition systems used in the production of integrated circuits, MEMS, and nanotechnology devices, has received an order for a Tegal 915 batch etch system from a leading Japanese sensor and control system maker.

Lam Research ships first 300 mm system for 3-D IC through-silicon via etch

Wed, 8 Aug 2007
Lam Research Corp. has shipped its first 300 mm 2300 Syndion etch system, designed for 3-D IC through-silicon via (TSV) etch applications.

Coventor software used in MEMS design contest

Wed, 12 Dec 2007
Coventor Inc.'s 3D MEMS Designer and Analyzer software has been selected by Hong Kong University and Kyoto University as the platform for a MEMS design contest.

Microvision has deal with Tier 1 auto supplier

Fri, 12 Dec 2007
Microvision Inc., a U.S. developer of light scanning technologies for display and imaging products, has signed a development agreement with an unnamed European supplier of automotive and industrial technologies.

Tong Hsing predicts MEMS will help drive 2008 sales

Fri, 12 Dec 2007
Tong Hsing Electronic Industries, based in Taiwan, said that it plans to extend its foothold into niche markets in 2008 and predicted that LED substrates and MEMS devices for projectors and the automotive sector will drive annual sales growth by more than 20 percent.

Omron's MEMS air flow sensor available from TTI

Mon, 12 Dec 2007
Omron's new MEMS-based air flow sensor, suitable for flow rate monitoring and dumper control in HVAC/VAV (variable air volume) applications, is now available through TTI. The D6F-P delivers uni- or bi-directional sensing; a key feature is its integrated, patent-pending dust-segregation system.

MEMSIC prices IPO

Tue, 12 Dec 2007
MEMSIC Inc. has filed a statement with the U.S. Securities and Exchange Commission setting its planned initial public offering at 6 million shares, with an estimated price range of $11 to $13 a share.

MEMSIC IPO raises $60 million

Thu, 12 Dec 2007
MEMSIC Inc., an Andover, Mass., company that develops MEMS technology for sensors and accelerometers, has raised $60 million in its recent IPO in a transaction that values the firm at $226 million.

ASM service to facilitate successful MEMS packaging

Thu, 6 Jun 2007
Recognizing that packaging and manufacturing are among the most crucial challenges facing MEMS engineers, ASM International has announced its MEMS Materials Database: Packaging Module to facilitate materials selection for MEMS packages.

SiTime surpasses MEMS production milestone of 100,000/week

Fri, 8 Aug 2007
SiTime Corp., developer of MEMS-based timing solutions, says that its SiT8002 and SiT1 oscillator families are shipping at a production rate of more than 100,000 units per week. This, the company says, makes these products the top-selling MEMS-based oscillators worldwide.

New AlwaysReady CEO Fred Allen to lead MEMS/nano commercialization

Tue, 8 Aug 2007
AlwaysReady, Inc. has named Dr. Fred Allen as Chief Executive Officer. AlwaysReady, Inc. was created in April 2007 to create shareholder value in mPhase's leading-edge nanotechnology battery and MEMS based products.

SVTC-TSMC partnership bridges MEMS development-production gap

Wed, 5 May 2007
Process development foundry SVTC Technologies has unveiled a technology incubation program with TSMC, the world's largest dedicated semiconductor foundry. The deal aims to streamline the transfer of designs to high-volume manufacturing. Small Times' Barbara Goode puts the announcement in context.

Yole's new MEMS foundry ranking reveals dramatic growth, key differences

Thu, 5 May 2007
In a just-released update to its MEMS Foundry Ranking, Yole Developpement reports that global MEMS foundry and contract manufacturing grew at a rate of 35% in 2006. The firm predicts similar growth for the next three years.

Micralyne and Polychromix partner for manufacturing

Mon, 5 May 2007
Micralyne Inc., an independent MEMS fabrication company, has announced a partnership with Polychromix, developer of inspection and analysis tools, to manufacture MEMS near-infrared (NIR) devices for the Polychromix's Phazir product line.

Boston Micromachines' MEMS advance multiphoton microscopy

Wed, 5 May 2007
Boston Micromachines Corp. says its MEMS-based deformable mirror products have helped realize achievements in multi photon microscopy, an advanced optical technique that increases the imaging depth in living tissue. Boston University's Biomedical Engineering Biomicroscopy Lab has recently demonstrated high resolution images of biological tissue using BMC's deformable mirrors in its multiphoton microscopy research.

MEMS enhance Microvision's PicoP display engine

Fri, 5 May 2007
Microvision Inc., developer of ultra-miniature projection display and image capture products for mobile applications, has announced new advancements to its PicoP display system.

SUSS targets MEMS production with double-sided alignment tool

Wed, 5 May 2007
SUSS MicroTec's new DSM200 is an automated metrology system for double-sided (front-to-back) alignment and exposure applications. The tool serves applications in the manufacture of MEMS devices, power semiconductors, and optoelectronics.

Oxford Instruments to equip new UK lab

Thu, 12 Dec 2007
Oxford Instruments has received an order for nine process tool systems worth more than £2.5m ($5m) to equip a new cleanroom facility at the University of Southampton in the UK, the company announced in a news release.

Melexis and UMC to deliver chips for automobile applications

Fri, 7 Jul 2007
After several years of collaboration, Melexis and UMC have delivered chips to market for diversified automotive applications, using UMC's 0.18um eFlash process and eFlash micro.

ISSYS wins patent for wireless, batteryless, implantable sensors

Mon, 7 Jul 2007
The U.S. Patent Office has granted to MEMS producer Integrated Sensing Systems, Inc. (ISSYS) a patent titled "System for monitoring conduit obstruction." The patent covers design and manufacture of a wireless implantable sensing system for non-invasive monitoring of pressure and/or pressure gradients in a cardiac conduit.

ICx launches "industry first" low-power MEMS CO2 sensor

Thu, 7 Jul 2007
ICx Photonics has launched its SensorChip CO2 4P, which it calls "a revolutionary technology" for carbon dioxide detection. ICx reduced power consumption from the original design of 132 mW down to 99 mW, and says it has produced the lowest power sensor of this type.

Semefab to offer U.K.'s first MEMS open access facility

Fri, 7 Jul 2007
Scotland semiconductor technology company, Semefab, is set to become the U.K.'s primary center for the design and development of MEMS and nano-systems, helping to drive advances in medicine, drug discovery, communications, and manufacturing in the U.K.

Tegal professorship to honor micro/nano pioneer Clarke

Wed, 6 Jun 2007
Tegal professorship at CSNI to honor Peter Clarke's micro/nano achievements

Knowles and Akustica agree to cross-license MEMS microphones

Tue, 6 Jun 2007
Immediately following product announcements by both Knowles Acoustics and Akustica, Inc., the two MEMS microphone suppliers now announce a cross-licensing arrangement that hopes to reinforce the partners' respective patent portfolios.

NemeriX/Bosch collaboration promises "revolutionary" vertical accuracy in MEMS GPS

Wed, 6 Jun 2007
NemeriX and Bosch Sensortec say they have successfully integrated their technologies to deliver a multi-sensing GPS solution that promises significantly enhanced results for navigating urban stacked road systems and multi-level bridges and tunnels.

MEMS in space: Draper inertial stellar compass fully operational

Mon, 1 Jan 2007
Draper Laboratory in Cambridge, Mass., announced that its Inertial Stellar Compass (ISC) is now fully operational on board the TacSat-2 spacecraft, representing the first use of a MEMS gyro in a complete spacecraft attitude determination system.

MEMS enables FormFactor's wafer test "breakthrough"

Thu, 8 Aug 2007
FormFactor Inc. says it has developed a breakthrough probing contact technology capable of full area wafer probing of high pin density, ultra fine-pitch devices. Compared to today's probing capabilities, FormFactor's new technology promises a 10x reduction in pitch (spacing between contacts), and potentially allow the probing of 1000x more contacts on a 300 mm wafer in a single touchdown.

First Nano ships first of its EasyTube 6000 systems for labs

Fri, 8 Aug 2007
First Nano, a division of CVD Equipment Corp., has shipped its first EasyTube 6000 chemical vapor deposition system. The unit is available with processes for research in the semiconductor, MEMS, nanotechnology, and solar cell markets.

Virtus to collaborate with Unimicron Group and affiliated MEMS foundry ChipSense

Wed, 1 Jan 2007
Virtus Advanced Sensors of Pittsburgh announced it has entered into a strategic collaboration agreement with several Taiwan-based UMC Group companies including Unimicron, Taiwan's largest printed circuit board (PCB) manufacturer and affiliated MEMS foundry ChipSense.

Knowles introduces MEMS ultrasonic acoustic sensor

Mon, 6 Jun 2007
Knowles Acoustics has introduced its Ultrasonic Acoustic Sensor (UAS) for use as a component to detect/receive ultrasonic sound in air. The Ultrasonic Acoustic Sensor uses MEMS innovations to provide performance over a wide environmental range. Sampling and low volume production is being offered now with mass production available beginning of Q2 2007. Pricing is comparative to current piezo ultrasonic receiving sensors on the market.

Nanomanufacturing supply chain reaches beyond R&D

Wed, 6 Jun 2007
The nascent nano supply-chain and production infrastructure shows signs of moving beyond R&D, says Small Times' Tom Cheyney, in our third report of findings from NSTI Nanotech 2007. He quotes keynoter John Hofmeister of Shell Oil (right).

Tronics and Alcatel partner on advanced MEMS DRIE

Thu, 6 Jun 2007
Tronics Microsystems SA and Alcatel Micro Machining Systems have announced a joint development project on DRIE for extreme-performance MEMS. The partners hope to establish a new performance benchmark for the MEMS industry.

Okmetic's high-uniformity SOI wafers promise super-sensitive MEMS

Fri, 6 Jun 2007
Okmetic Oyj, supplier of