atomic-layer-deposition

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Atomic Layer Deposition

Fri, 12 Dec 2015
ALD is a technique capable of depositing a variety of thin film materials from the vapor phase.

CVD Source Materials

Thu, 12 Dec 2015
Reaction materials for chemical vapor deposition are typically delivered into the chamber in a gaseous form. The source materials can be gases or liquids.

Chemical Vapor Deposition

Fri, 12 Dec 2015
Chemical vapor deposition (CVD) is used to produce high-purity thin films.

Atomic layer deposition goes mainstream in 22nm logic technologies

Mon, 11 Nov 2010
Cost-of-ownership (COO) will be a main driver for ALD equipment selection in cost-sensitive markets; and in foundry or other logic applications, equipment choice is more a mix between COO, turn-around time and process performance considerations. M. Verghese, ASM, Phoenix, AZ USA; J. W. Maes, ASM, Leuven, Belgium; N. Kobayashi, ASM, Tokyo, Japan

ASM plasma-enhanced atomic layer deposition (ALD) ordered for HVM, new app

Thu, 4 Apr 2011

ASM International N.V. (NASDAQ: ASMI) received multiple system orders for its plasma enhanced atomic layer deposition (PEALD) reactor from a leading memory customer in Asia. The company also qualified a new PEALD oxide application with a memory manufacturer for the 2X nm node.


Improving the reliability of dry vacuum pumps in high-k ALD processes

Tue, 2 Feb 2015
Design features that contributed most to the improved performance include increased rotational speed, integrated rotor sleeves, and increased purge injection temperature.

Stanford researchers advance area selective ALD to develop more energy efficient electronics

Tue, 1 Jan 2016
Stanford University researchers sponsored by Semiconductor Research Corporation (SRC) have developed a new area selective atomic layer deposition (ALD) process that promises to accelerate the manufacturing of higher performing, more energy efficient semiconductors.

Molecular-scale ALD discovery could have industrial-sized impact

Thu, 3 Mar 2016
In the world of nano-scale technology, where work is conducted at the atomic level, even the smallest changes can have an enormous impact. And a new discovery by a University of Alberta materials engineering researchers has caught the attention of electronics industry leaders looking for more efficient manufacturing processes.

Samco increases local sales staff for North American, European and Asian locations

Thu, 4 Apr 2016
Samco, a Japan-based semiconductor process equipment developer and manufacturer, is employing around 20 more people at its locations in North America, China, Taiwan and Singapore, as well as its subsidiary Samco-UCP in Liechtenstein.

Ultratech Cambridge Nanotech forms research collaboration with Northeastern University

Tue, 5 May 2016
Ultratech, Inc. announced the formation of a research collaboration with Professor Thomas J. Webster, Ph.D. at Northeastern University, to study the use of nano-materials produced via ALD for medical applications.

Lam Research enables next-generation memory with industry's first ALD process for low-fluorine tungsten fill

Tue, 8 Aug 2016
Lam Research Corp. (NASDAQ: LRCX), an advanced manufacturer of semiconductor equipment, today introduced an atomic layer deposition (ALD) process for depositing low-fluorine-content tungsten films, the latest addition to its ALTUS family of products.

Lam Research introduces dielectric atomic layer etching capability for advanced logic

Wed, 9 Sep 2016
Lam Research Corp., an advanced manufacturer of semiconductor equipment, today announced that it is expanding its atomic layer etching (ALE) portfolio with the addition of ALE capability on its Flex dielectric etch systems.