MATERIALS AND EQUIPMENT
WAFER LEVEL PACKAGING
PACKAGING AND TESTING
LED PACKAGING AND TESTING
FPDs AND TFTs
IBM develops sub-20nm nanofluidic channels for lab-on-chip
Tue, 10 Oct 2013
At IEDM, IBM researchers will report on a CMOS-compatible 200 mm wafer-scale sub-20nm nanochannel fabrication method that enables stretching, translocation and real-time fluorescence microscopy imaging of single DNA molecules.
EU project to industrialize world record high-density capacitors
Wed, 10 Oct 2013
CEA-Leti, Fraunhofer IPMS-CNT and three European companies have launched a two-year project to industrialize 3D integrated capacitors with world-record density using atomic layer deposition.
SRC launches synthetic biology research for novel semiconductor applications
Wed, 10 Oct 2013
Research at six universities including MIT, University of Massachusetts at Amherst, Yale, Georgia Tech, Brigham Young and Washington
Imec and John Hopkins University team to expand healthcare applications for silicon nanotech
Thu, 10 Oct 2013
Researchers and physicians at Johns Hopkins University will collaborate with the nanoelectronics R&D center imec to advance silicon applications in healthcare, beginning with development of a device to enable a broad range of clinical tests.
MEMS devices for biomedical applications
Mon, 10 Oct 2013
Dr. Ramesh Ramadoss, Senior Manager in the MicroProbe Product Group of FormFactor Inc., provides an overview of MEMS and highlights a variety of applications in the biomedical area, including pressure sensors, inertial sensors, transducers for hearing aids, microfluidics for diagnostics and drug delivery, micromachined needles and microsurgical tools.
ConFab panelists discuss optimizing R&D in the changing semi landscape
Tue, 6 Jun 2014
Overheard @The ConFab: “I feel the best I’ve felt about semi since 2009.” –Mike Noonen, Silicon Catalyst
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