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GS Nanotech pioneers 3D packaging technology in Russia

Thu, 6 Jun 2014
GS Nanotech, microelectronics products development and manufacture center, plans to launch mass assembly of 3D stacked TSV (through-silicon via) microcircuits in next few years.

Entegris opens new facility in Bedford, MA

Thu, 6 Jun 2014
Entegris Inc., a Billerica-based materials and solutions provider to the microelectronics industries, today inaugurated its new i2M Center for Advanced Materials Science ("The i2M Center") in Bedford, Massachusetts.

200mm equipment market gaining new lease on life

Mon, 6 Jun 2014
In 2004/2005, shipments of 300mm wafer fab equipment (WFE) began to outpace that of 200mm platforms.

Boston Semi Equipment acquires MVTS Technologies

Tue, 6 Jun 2014
Boston Semi Equipment LLC (BSE) today announced it has completed the acquisition of MVTS Technologies (MVTS).

SMIC establishes the first 12 in CIS supply chain in China

Tue, 6 Jun 2014
Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, today announced that the first 12" color filter and micro lens array production line in mainland China has been completed and put into production by Toppan SMIC Electronics of Shanghai

Jordan Valley Semiconductors wins more market share in advanced wafer level packaging

Thu, 7 Jul 2014
Jordan Valley Semiconductors Ltd., a supplier of X-ray based metrology tools for advanced semiconductor manufacturing lines, today announced that its micro-spot X-ray Fluorescence (µXRF) metrology tool has been qualified for production monitoring of advanced Wafer Level Packaging (WLP) processes, by another memory player.

Permanent bonding: A key technology for MEMS, advanced packaging, LEDs and SOI

Mon, 7 Jul 2014
Yole Développement has released a new report, Permanent Wafer Bonding, detailing permanent bonding technologies and the microelectronic applications that use permanent bonding such as MEMS, Advanced Packaging, LEDs and SOI substrates.

SEMI forecasts double-digit business growth in 2014, 2015

Wed, 7 Jul 2014
The worldwide semiconductor capital equipment market is forecast to increase 20.8 percent this year to $38.44 billion, compared with 2013’s $31.82 billion, and another 10.8 percent in 2015 to $42.6 billion, according to Semiconductor Equipment and Materials International.

SEMI announces new South America Semiconductor Strategy Summit

Tue, 7 Jul 2014
SEMI today announced the launch of the association's first-ever event in Latin America.

Harnessing big data

Mon, 7 Jul 2014
Addressing the analytics challenges in supply chain management.

A call to provide advanced equipment to growth companies

Mon, 7 Jul 2014
Historically, the major semiconductor capital equipment manufacturers have focused on supporting the bigger semiconductor companies at the expense of the smaller ones.

Materials matter — Enabling the future of IC fabrication and packaging

Thu, 7 Jul 2014
The SEMI Strategic Materials Conference, held September 30–October 1 in Santa Clara, Calif., will examine the drivers for new materials and how they impact material suppliers and the value chain they serve.

Micron Technology appoints Stephen Pawlowski as Vice President of Advanced Computing Solutions

Mon, 8 Aug 2014
Micron Technology, Inc. today announced that Stephen Pawlowski has been named as vice president of Advanced Computing Solutions.

Global semiconductor industry on pace for record sales through first half of 2014

Tue, 8 Aug 2014
Sales up across every region and nearly all product categories compared to last year; Americas region shows strongest growth.

Si2 announces new director of 3DIC programs

Thu, 8 Aug 2014
The Silicon Integration Initiative (Si2), a global semiconductor standards consortium, announced today that Herb Reiter is joining the team of professionals in the role of Director, 3D IC Programs.

Mentor Graphics announces 25th annual PCB Technology Leadership Awards program

Tue, 8 Aug 2014
Mentor Graphics Corporation today announced the call-for-entries of its 25th annual Technology Leadership Awards (TLA) competition, continuing its tradition of recognizing excellence in printed circuit board (PCB) design.

Order activity for semiconductor equipment holds steady in July

Thu, 8 Aug 2014
North America-based manufacturers of semiconductor equipment posted $1.41 billion in orders worldwide in July 2014 (three-month average basis) and a book-to-bill ratio of 1.07, according to the July EMDS Book-to-Bill Report published today by SEMI.

S2C opens Korean office and appoints country manager

Tue, 8 Aug 2014
S2C, Inc. announced today the opening of a direct sales and support office in Seoul, Korea, appointing Suk-Ha Lee (SH Lee) as country manager.

Lean strategies and decentralized value chains fuel RFID uptake in manufacturing

Wed, 8 Aug 2014
New analysis from Frost & Sullivan, Analysis of the Global RFID in Manufacturing Market, finds that the market earned revenues of $1.29 billion in 2013 and estimates this to nearly quadruple to $4.99 billion in 2020.

Shinichi Machida named President and CEO of Fujitsu Semiconductor America

Thu, 9 Sep 2014
Fujitsu Semiconductor America (FSA) today announced that Shinichi "James" Machida, who led the company from late 2008 until spring of 2011, has been named as the new president and CEO of FSA.

NVIDIA files complaints against Samsung and Qualcomm

Fri, 9 Sep 2014
NVIDIA today announced that it has filed complaints against Samsung and Qualcomm at the International Trade Commission and in the U.S. District Court in Delaware, alleging that the companies are both infringing NVIDIA GPU patents covering technology including programmable shading, unified shaders and multithreaded parallel processing.

Second quarter 2014 semi equipment billings 28% higher than 2013 second quarter

Tue, 9 Sep 2014
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 9.62 billion in the second quarter of 2014.

35 European start-ups showcased at SEMICON Europa’s Innovation Village

Mon, 9 Sep 2014
35 major European start-ups will participate in the Innovation Village and present their new technologies at SEMICON Europa.

Mentor Graphics appoints Vice President for Embedded Technologies

Thu, 9 Sep 2014
Mentor Graphics Corp. today announced the appointment of Glenn Perry to the role of vice president of the company's Embedded Systems Division.

ProPlus Design Solutions expands sales operations to Europe

Thu, 9 Sep 2014
ProPlus Design Solutions, Inc. announced today it expanded its sales operations to Europe.

North American semiconductor equipment industry posts August 2014 book-to-bill ratio of 1.04

Thu, 9 Sep 2014
A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

SEMI forms new Tablet Working Group

Wed, 9 Sep 2014
When you say the word sapphire most people think of a brilliant blue gemstone. The members that have formed the Tablet Working Group think of sapphire as a key enabler of future growth for their respective businesses.

Printed, flexible, and organic electronics will account for 18% of wearable athletics sensors in 2024

Fri, 9 Sep 2014
Printed, flexible and organic electronic (PFOE) sensors can offer flexible form factors, larger area, lower cost, lower power, and better disposability compared to conventional sensors, key attributes for wearable applications.

European 3D TSV Summit: “Smarter system integration” theme to focus on both business and technology

Tue, 9 Sep 2014
On January 19-21, 2015, SEMI will hold its 3rd edition of the European 3D TSV Summit in Grenoble, France.

Tessera Technologies names Craig Mitchell as CTO and president of Invensas

Mon, 9 Sep 2014
Tessera Technologies, Inc. today announced it has named Craig Mitchell as chief technology officer for Tessera and president of Invensas Corporation, effective immediately.

SEMICON Japan features "World of IoT"

Wed, 10 Oct 2014
Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs.

Boston Semi Equipment creates industry's largest independent ATE organization

Wed, 10 Oct 2014
Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name.

ARM and TSMC unveil roadmap for 64-bit ARM-based processors on 10FinFET process technology

Thu, 10 Oct 2014
ARM and TSMC today announced a new multi-year agreement that will deliver ARMv8-A processor IP optimized for TSMC 10FinFET process technology.

Silicon Cloud International launches semiconductor collaborative platform in Singapore

Fri, 10 Oct 2014
Silicon Cloud International (SCI), a provider of secure and private cloud computing infrastructure, announced today successful pilot program launch of its semiconductor workflow platform in Singapore.

China's wafer foundry market: 15% growth in 2014

Thu, 10 Oct 2014
The wafer foundry market experienced a wavy development, jumping by 39.4 percent in 2010 following a 7.9 percent decline in 2009.

Advanced packaging technologies are changing the LED manufacturing supply chain

Wed, 10 Oct 2014
At the LED packaging equipment level, growth will return for the next three years.

Mentor Graphics wins $36M in patent infringement suit

Mon, 10 Oct 2014
A Portland, Oregon jury today delivered a verdict in favor of Mentor Graphics in a patent infringement trial against Synopsys, Inc., awarding Mentor Graphics $35 million in damages and royalties.

Texas Instruments announces 22B copper wire bond technology units shipped

Tue, 10 Oct 2014
Texas Instruments today announced it has shipped more than 22 billion units of copper wire bonding technology from its internal assembly sites and is now in production for major high reliability applications including automotive and industrial.

IRLYNX and CEA-Leti to streamline new CMOS-based infrared sensing modules

Wed, 10 Oct 2014
IRLYNX and CEA-Leti today announced they have launched a technology-development partnership for a new CMOS-based infrared technology that will allow a new type of smart and connected detectors in buildings and cities.

Intermolecular appoints Dr. Bruce McWilliams as President and CEO

Thu, 10 Oct 2014
Intermolecular, Inc. announced this week that Dr. Bruce McWilliams has been appointed president and chief executive officer.

Qualcomm to acquire CSR

Thu, 10 Oct 2014
Qualcomm today announced that it has reached agreement with CSR regarding the terms of a recommended cash acquisition of CSR will be acquired by Qualcomm Global Trading Pte. Ltd.

Canadian semiconductor manufacturing industry revenue expected to decline 8% in 2014

Fri, 10 Oct 2014
Industry manufacturers, which are typically small- to mid-sized enterprises, will find it difficult to match the research and development (R&D) spending of multinational competitors.

Semiconductor equipment book-to-bill declines in September

Tue, 10 Oct 2014
While order activity moderated, equipment spending this year is expected to be robust and remain on pace for double-digit year-over-year growth.

Mentor Graphics appoints vice president for PCB Design

Thu, 10 Oct 2014
Mentor Graphics Corp. today announced the appointment of A.J. Incorvaia to the role of vice president and general manager of the company's Board Systems Division.

IMAPS Award Winners for 2014

Fri, 10 Oct 2014
At the IMAPS (International Microelecronics & Packaging Society) meeting last week, several of their key annual awards were given out.

KLA-Tencor reveals 'leveraged recapitalization' plan and an expanded stock repurchase program

Fri, 10 Oct 2014
Yesterday, KLA-Tencor announced a plan to significantly accelerate its strategy to drive stockholder returns.

TSI Semiconductors and Silvaco extend collaboration to accelerate launch of 0.25um BCDMOS process

Wed, 10 Oct 2014
Silvaco, Inc. (Silvaco) and TSI Semiconductors, LLC (TSI) today announced that they have extended their collaboration to accelerate the development and production launch of TSI's 0.25um BCDMOS process technology.

SEMICON Japan 2014: New venue and new ideas for rebounding industry

Wed, 10 Oct 2014
Today, SEMI announced an exceptional lineup of speakers for SEMICON Japan’s Opening Day — Accenture, Applied Materials, ARM, IBM Japan, Intel K.K., NIICT, Scripps, Toshiba, and Toyota.

Global semiconductor industry posts highest-ever quarterly sales

Mon, 11 Nov 2014
Global sales for the month of September 2014 reached $29 billion, 8 percent higher than the September 2013 total of $26.9 billion and 1.9 percent more than last month's total of $28.5 billion.

Tetsuro Higashi to receive the SEMI Sales and Marketing Excellence Award

Wed, 11 Nov 2014
SEMI today announced that Tetsuro (Terry) Higashi, chairman, president and CEO of Tokyo Electron Limited (TEL), has been selected as the 2015 recipient of the SEMI Sales and Marketing Excellence Award, inspired by the late Bob Graham.

SEMATECH names Ronald Goldblatt permanent CEO

Fri, 11 Nov 2014
SEMATECH, the global consortium of semiconductor manufacturers, today announced that Dr. Ronald Goldblatt has been named President and Chief Executive Officer by the company’s Board of Directors, effective immediately. Dr. Goldblatt has served as acting President and Chief Executive Officer since April 2014.

$1,000,000 "Challenge Grant" goal achieved for SEMI high tech industry workforce development

Tue, 11 Nov 2014
With generous “Morgan Challenge Matchmaker” contributions, the SEMI Foundation recently reached its goal of $1 million for workforce development.

Deal to expand information technology agreement will strengthen semiconductor industry

Tue, 11 Nov 2014
Agreement will extend tariff-free coverage of the latest semiconductor products and technologies.

Slight increase in third quarter 2014 silicon wafer shipments

Wed, 11 Nov 2014
Worldwide silicon wafer area shipments increased during the third quarter 2014 when compared to second quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Professors from UC Berkeley and UT Dallas honored for excellence in semiconductor research

Thu, 11 Nov 2014
The Semiconductor Industry Association (SIA), in consultation with Semiconductor Research Corporation (SRC), today presented its University Research Award to professors from University of California, Berkeley and University of Texas at Dallas in recognition of their outstanding contributions to semiconductor research.

Notebook PC shipments rise year over year as tablet PCs decline

Tue, 11 Nov 2014
Notebook PC growth was primarily driven by the developed regions of North America and Western Europe, which increased year-over-year shipments by more than 20 percent in the third quarter.

European 3D TSV Summit 2015: Keynote speakers announced

Wed, 11 Nov 2014
This week, SEMI announced the keynote speakers for the third edition of the European 3D TSV Summit, event that will take place on January 19-21, 2015 in Grenoble, France.

North American book-to-bill report shows equipment order activity has moderated

Fri, 11 Nov 2014
North America-based manufacturers of semiconductor equipment posted $1.10 billion in orders worldwide in October 2014 (three-month average basis) and a book-to-bill ratio of 0.93, according to the October EMDS Book-to-Bill Report published today by SEMI.

SEMICON Korea focuses on breaking through the limitations of semiconductor technology

Mon, 12 Dec 2014
Over 500 exhibiting companies from 20 countries and more than 40,000 attendees are expected to attend SEMICON Korea 2015, to be held February 4-6 at COEX in Seoul.

Semiconductor equipment sales forecast: $38B in 2014 to nearly $44B in 2015

Tue, 12 Dec 2014
SEMI projects that worldwide sales of new semiconductor manufacturing equipment will increase 19.3 percent to $38.0 billion in 2014, according to the SEMI Year-end Forecast, released today at the annual SEMICON Japan exposition.

SEMI Industry Strategy Symposium to focus on changing supply chain ecosystem and directions for growth

Wed, 12 Dec 2014
Microelectronics industry executives will convene at the SEMI Industry Strategy Symposium (ISS) on January 11-14 to discuss “Riding the Wave of Silicon Magic.”

What to expect from the 3rd Edition of the European 3D TSV Summit

Thu, 12 Dec 2014
Interview with SEMI Europe’s Yann Guillou gives attendees a preview of the event.

Veeco completes acquisition of Solid State Equipment Holdings LLC

Mon, 12 Dec 2014
Veeco Instruments Inc. announced that it has acquired privately held Solid State Equipment Holdings LLC (“SSEC”), based in Horsham, Pennsylvania.

SEMI reports third quarter 2014 worldwide semiconductor equipment figures

Tue, 12 Dec 2014
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 8.82 billion in the third quarter of 2014.

TSMC recognizes outstanding suppliers at Supply Chain Management Forum

Tue, 12 Dec 2014
TSMC held its 14th annual Supply Chain Management forum on December 4, 2014 to show appreciation for the support and contributions of its suppliers in 2014, and to recognize nine outstanding equipment and materials suppliers.

John Neuffer named president and CEO of SIA

Thu, 12 Dec 2014
The Semiconductor Industry Association (SIA) announced that John Neuffer has been named president & CEO of the association.

Global Semiconductor Alliance announces 2014 Award recipients

Fri, 12 Dec 2014
GSA members identified the Most Respected Public Semiconductor Company Award winners by casting ballots for the industry’s most respected companies for its products, vision and future opportunities.

Murata completes acquisition of Peregrine Semiconductor

Fri, 12 Dec 2014
Murata Electronics North America, Inc. and Peregrine Semiconductor Corporation, founder of RF silicon on insulator (SOI) and pioneer of advanced RF solutions, today announce that Murata has acquired all outstanding shares of Peregrine.

Worth the detour: European 3D TSV Summit 2015 offers new outlooks on 2.5 and 3D technology

Tue, 12 Dec 2014
With just over a month left to go, industry experts are looking forward to the third edition of the European 3D TSV Summit (Jan 19-21, 2015 in Grenoble, France), this year focusing on “Enabling Smarter Systems.”

Amkor Technology licenses proprietary copper pillar wafer bump technology to GLOBALFOUNDRIES

Tue, 12 Dec 2014
Amkor Technology, Inc., a provider of semiconductor assembly and test services, today announced that it has granted GLOBALFOUNDRIES a non-exclusive license to its proprietary copper pillar wafer bump technology.

Book-to-bill climbs above parity in November

Thu, 12 Dec 2014
North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.

The ConFab 2015: Time for collaboration

Tue, 12 Dec 2014
The future of the semiconductor industry continues to shine brightly.

European 3D TSV Summit 2015: What business for 3D smart systems?

Tue, 1 Jan 2015
SEMI Europe will ring in the New Year by holding the first major, international 3D TSV event of 2015. On January 19-21, members of the 3D TSV industry will convene in Grenoble, France for the 3rd edition of the European 3D TSV Summit.

SEMICON West 2015: “Call for Papers” for Semiconductor Technology Symposium and TechXPOTs

Wed, 1 Jan 2015
SEMI today announced a “Call for Papers” for SEMICON West, North America’s premier microelectronics event, to be held July 14-16 at the Moscone Center in San Francisco, Calif.

New secondary fab equipment market report available from SEMI

Fri, 1 Jan 2015
With new cost-sensitive semiconductor devices driving capacity demand, 200mm wafer size and currently existing (legacy) fabs are seeing a renaissance, SEMI completed a thorough study of the secondary fab equipment market to identify the market size and to capture key trends and issues impacting this industry segment.

IHS identifies technologies to transform the world over next five years

Mon, 1 Jan 2015
The Internet of Everything, cloud computing/big data and 3-D printing are the three technologies most likely to transform the world during the next five years, according to IHS Technology.

Mentor Graphics acquires Flexras Technologies

Tue, 1 Jan 2015
The Flexras timing-driven partitioning technology will expand and strengthen the portfolio of tools available from Mentor to help engineers overcome the challenges of increasingly complex design prototyping.

Further growth seen for semiconductor equipment and materials at SEMI ISS 2015

Wed, 1 Jan 2015
The SEMI Industry Strategy Symposium (ISS) opened yesterday with the theme “Riding the Wave of Silicon Magic.”

Orbotech announces collaboration between SPTS and Fraunhofer on process development of wafer level packaging

Thu, 1 Jan 2015
Orbotech Ltd. today announced that SPTS Technologies is collaborating with Fraunhofer IZM, an international institute specializing in applied and industrial contract research, on next generation wafer level packaging of microelectronic devices.

Amkor Technology announces settlement with Tessera

Thu, 1 Jan 2015
Amkor Technology, Inc. today announced the settlement of its outstanding litigation and arbitration proceedings with Tessera, Inc.

Will new policy in China trigger big changes?

Wed, 1 Jan 2015
In June 2014, the State Council of China issued the "National Guideline for the Development and Promotion of the IC Industry,” to support the domestic semiconductor industry. The document addresses development targets, approaches, and measures.

North American semiconductor equipment industry posts December 2014 book-to-bill ratio of 0.98

Mon, 1 Jan 2015
North America-based manufacturers of semiconductor equipment posted $1.37 billion in orders worldwide in December 2014 (three-month average basis) and a book-to-bill ratio of 0.98, according to the December EMDS Book-to-Bill Report published today by SEMI.

2014 was bumper year for automotive semiconductors

Tue, 1 Jan 2015
The automotive semiconductor market did exceptionally well in 2014, according to new analysis from IHS.

New MES operations improvement software from critical manufacturing features integrated scheduling

Wed, 1 Jan 2015
Critical Manufacturing, a supplier of integrated manufacturing execution systems (MES), introduces cmNavigo 4.0, the industry’s first comprehensive MES software with embedded finite scheduling.

Gov. Baker announces $4M grant to UMass Lowell to fuel emerging printed electronics cluster

Thu, 1 Jan 2015
Gov. Charlie Baker today announced a $4 million dollar grant from the Massachusetts Technology Collaborative (“MassTech”) to UMass Lowell to support development of a printed and flexible electronics industry cluster, an emerging field that has the potential to become a $76 billion global market in the next decade.

SEMICON Korea opens tomorrow: Korea IC manufacturing fueled by memory and mobility

Tue, 2 Feb 2015
SEMICON Korea 2015 at COEX in Seoul opens tomorrow with more than 500 exhibiting companies and an expected 40,000 attendees.

The CMOS image sensors industry is about to change, with major investment in manufacturing & design

Tue, 2 Feb 2015
Driven by mobile and automotive applications, the CIS industry is expected to grow at a CAGR of 10.6 percent from 2014 – 2020.

Spansion and XMC expand partnership to jointly develop 3D NAND

Mon, 2 Feb 2015
Spansion Inc. and XMC, China's fastest growing 300mm semiconductor foundry, today announced that the two companies will work together to develop and manufacture 3D NAND technology.

Qualcomm and China's National Development and Reform Commission reach resolution

Mon, 2 Feb 2015
Qualcomm Incorporated today announced that it has reached a resolution with China's National Development and Reform Commission (NDRC) regarding the NDRC's investigation of Qualcomm under China's Anti-Monopoly Law.

Mentor Graphics launches broadest embedded systems solution for industrial automation

Mon, 2 Feb 2015
Mentor Graphics Corporation today announced the embedded systems industry's broadest portfolio for industrial automation.

Strategy is key differentiator as more efficient GaN, SiC power electronics enter market

Tue, 2 Feb 2015
Power electronics based on gallium nitride (GaN) and silicon carbide (SiC) have the potential to significantly improve efficiency. But since these materials are higher-cost, companies need market-specific strategies in order to succeed as these new wide-bandgap (WBG) materials claim market share from silicon-based semiconductors, according to Lux Research.

Silicon wafer shipments reach record levels in 2014

Wed, 2 Feb 2015
Worldwide silicon wafer area shipments increased 11 percent in 2014 when compared to 2013 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

Amkor Technology names Susan Kim to Board of Directors

Wed, 2 Feb 2015
Amkor Technology, Inc. today announced that Susan Y. Kim has been appointed as a new member of the Company’s Board of Directors.

Samsung announces mass production of industry’s first 14nm finFET mobile application processor

Tue, 2 Feb 2015
Samsung Electronics Co., Ltd. announced that it has begun mass production of industry’s first mobile application processor using the advanced 14-nanometer (nm) FinFET process technology.

China's semiconductor investment plans focus of SEMICON China 2015

Thu, 2 Feb 2015
China's new industry investment and government promotion policies outlined in the recent "National Guidelines for Development and Promotion of the IC Industry" represents major opportunities for China and global semiconductor companies.

Mentor Graphics announces call for entries for Don Miller Award for Thermo-Fluid Design Excellence

Thu, 2 Feb 2015
Mentor Graphics Corporation today announced the call-for-entries for its first annual Don Miller Award for Excellence in System Level Thermo-Fluid Design.

Micron appoints Robert Peglar as Vice President of Advanced Storage Solutions

Thu, 2 Feb 2015
Micron Technology, Inc. today announced that Robert Peglar has been named as vice president of Advanced Storage Solutions.

January 2015 book-to-bill supports positive outlook for semiconductor equipment industry

Fri, 2 Feb 2015
A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

Fan-Out Wafer Level Packaging: With a $200M market in 2015, Yole is expecting 30% CAGR in the coming years

Tue, 2 Feb 2015
“Fan-Out Wafer Level Packaging (FOWLP) is already in high-volume” announces Yole Développement (Yole) in its new report, Fan-Out and Embedded Die: Technologies & Market. According to Yole’s analysts, FOWLP market reaches almost $200M in 2015.

Penang to host inaugural SEMICON Southeast Asia

Wed, 2 Feb 2015
The inaugural SEMICON Southeast Asia, will run from 22–24 April at the Subterranean Penang International Convention and Exhibition Centre (SPICE) in Penang, Malaysia.

SEMICON Russia 2015 presents Microelectronics Market Conference and new TechARENA sessions

Mon, 3 Mar 2015
SEMICON Russia, a meeting place of the entire micro- and nanoelectronics industry in Russia, will take place from 16 to 18 June in Moscow.

Yole reports growth recovery in power electronics industry

Tue, 3 Mar 2015
Yole Développement (Yole) announces the return to the power electronics market growth, after two years of stagnancy.

Embedded die in substrate: Challenges are still ahead

Tue, 3 Mar 2015
Embedded die in substrate: what are the next steps for the growth?

Comparing market sizes and forecasted growth rates for systems, ICs

Tue, 3 Mar 2015
Cellphones expand as largest system market; IoT growing fastest through 2018.

Global semiconductor industry posts highest-ever January sales

Tue, 3 Mar 2015
Global sales from January 2015 were 2 percent lower than the December 2014 total of $29.1 billion, reflecting normal seasonal trends.

TowerJazz begins mass production of advanced IR sensor

Tue, 3 Mar 2015
TowerJazz, a specialty foundry, announced today it has begun mass production of an IR sensor used by Intel in one of its new 3D sensing solutions.

Intel honors 21 companies with Preferred Quality Supplier and Achievement Awards

Wed, 3 Mar 2015
Intel Corporation today announced that 19 companies will receive the 2014 Intel Preferred Quality Supplier (PQS) award that recognizes commitment to performance excellence and continuous improvement.

Mentor Graphics joins the Center for Power Electronics Systems

Wed, 3 Mar 2015
Mentor Graphics Corporation today announced that it has joined the Center for Power Electronics Systems (CPES) at Virginia Tech, the industry consortium dedicated to improving electrical power processing and distribution across various systems.

XMC ships over 100 million units of backside illumination CMOS image sensors

Thu, 3 Mar 2015
XMC, a 300mm semiconductor manufacturing company, today announces it has shipped over 100 million Backside Illumination (BSI) CMOS Image Sensor (CIS) units.

SEMI reports 2014 global semiconductor equipment sales of $37.5B

Tue, 3 Mar 2015
SEMI today reported that worldwide sales of semiconductor manufacturing equipment totaled $37.50 billion in 2014, representing a year-over-year increase of 18 percent.

Power module packaging performance is now essential for power electronics industry

Tue, 3 Mar 2015
The power packaging market is growing, pulled by the interconnection and substrate segments, respectively +14 percent and +13 percent between 2014 and 2020.

Imec to honor TSMC Chairman Dr. Morris Chang with "Lifetime of Innovation Award"

Tue, 3 Mar 2015
Nano-electronics research center imec has announced that it will award Dr. Morris Chang, founding chairman of Taiwan Semiconductor Manufacturing Company, Limited (TSMC), the world's first and largest semiconductor foundry, with a lifetime of innovation award.

Poised for more growth

Tue, 3 Mar 2015
Strong fab equipment spending expected in 2015; Slower but positive 2016.

Ziptronix licenses DBI hybrid bonding patents to Sony for advanced image sensor applications

Wed, 3 Mar 2015
Ziptronix Inc., a developer and provider of patented, low-temperature direct bonding technology for 3D integration, today announced a patent licensing agreement with Sony Corporation for application in advanced image sensors.

Small powerful systems give rise to medical semiconductor sales

Thu, 3 Mar 2015
Market for medical semiconductors seen rising to $8.2 billion in 2018.

North American semiconductor equipment industry posts February 2015 book-to-bill ratio of 1.02

Fri, 3 Mar 2015
A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month.

NXP and GlobalFoundries announce production of 40nm embedded non-volatile memory technology

Tue, 3 Mar 2015
GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, and NXP Semiconductor N.V, a semiconductor company for secure connection solutions, today announced that they have jointly developed a next-generation embedded non-volatile memory.

Cypress to acquire Broadcom's Wireless of Internet of Things business

Thu, 4 Apr 2016
Cypress Semiconductor Corp. (Nasdaq: CY) and Broadcom Limited (Nasdaq: AVGO) today announced the signing of a definitive agreement under which Cypress will acquire Broadcom's Wireless Internet of Things (IoT) business and related assets in an all-cash transaction valued at $550 million.

Optoelectronics, sensors/actuators, and discretes growth accelerates

Wed, 3 Mar 2015
After two years of sluggishness, O-S-D sales strengthen with an improving economy and a boost from new applications, says new 2015 report.

Mentor Graphics launches Xpedition Package Integrator flow for IC-package-board design

Fri, 3 Mar 2015
Mentor Graphics Corporation announced its new Xpedition Package Integrator flow, the industry’s broadest solution for integrated circuit (IC), package, and printed circuit board (PCB) co-design and optimization.

NXP-Freescale fusion creates automotive semiconductor powerhouse, IHS Says

Tue, 3 Mar 2015
The merged company would become the leading supplier of semiconductors to the automotive market, with at least $1 billion more revenue than the next-largest supplier, Renesas.

Southeast Asia to spend $19B for semiconductor equipment and materials by 2016

Thu, 4 Apr 2015
Programme information is now available on the inaugural SEMICON Southeast Asia, which will run from 22–24 April at SPICE in Penang.

U.S.-headquartered companies capture bulk of IDM, fabless IC sales

Fri, 4 Apr 2015
Recent acquisitions expeted to boost Europe's share in coming years.

AWSC purchases ClassOne’s Solstice S8 electroplater

Fri, 4 Apr 2015
Semiconductor equipment manufacturer ClassOne Technology announced the sale and delivery of its Solstice S8 Plating System to Advanced Wireless Semiconductor Company (AWSC) of Taiwan.

Global semiconductor sales increase in February compared to last year

Mon, 4 Apr 2015
The Semiconductor Industry Association today announced worldwide sales of semiconductors reached $27.8 billion for the month of February 2015, an increase of 6.7 percent from February 2014 when sales were $26.0 billion.

SEMI reports 2014 global semiconductor materials sales of $44.3B

Tue, 4 Apr 2015
The global semiconductor materials market increased 3 percent in 2014 compared to 2013 while worldwide semiconductor revenues increased 10 percent.

Cavendish Kinetics adopts STATS ChipPAC's wafer level technology for its SmarTune RF MEMS tuners

Tue, 4 Apr 2015
STATS ChipPAC Ltd. announced that Cavendish Kinetics, a provider of high performance RF MEMS tuning solutions for LTE smartphones and wearable devices, has adopted its advanced wafer level packaging technology

2014: A year in review - Semiconductor equipment and materials market and outlook

Thu, 4 Apr 2015
2014 was the second record breaking year in a row in terms of semiconductor device revenues; the industry grew a robust 10 percent to total $336 billion, according to the WSTS.

IDT appoints semiconductor veteran Robert A. Rango to Board of Directors

Fri, 4 Apr 2015
Integrated Device Technology, Inc. today announced that Robert A. Rango, a former Broadcom Corp. executive with extensive leadership skills in the global semiconductor market, has been appointed to IDT’s Board of Directors, effective April 6, 2015.

A*STAR's IME and partners to enable low cost packaging technology for system scaling within smart devices

Wed, 4 Apr 2015
A*STAR’s Institute of Microelectronics (IME), together with industry partners, have formed a High-Density Fan-Out Wafer Level Packaging (FOWLP) consortium to extend FOWLP capabilities for applications in devices such as smart phones, tablets, navigation tools and gaming consoles.

Samsung Galaxy S6 Edge pricier to build, cheaper to buy than comparable Apple iPhone 6 Plus

Thu, 4 Apr 2015
The recently released Samsung Galaxy S6 Edge is the most expensive Galaxy S line smartphone yet built, but has a lower retail price than a comparable iPhone 6 Plus, according to a preliminary estimate by IHS and its Technology Mobile Handsets Intelligence Service.

Semiconductor CEOs urge congress to enact Trade Promotion Authority

Thu, 4 Apr 2015
The SIA board of directors, led by Intel CEO and SIA chairman Brian Krzanich, sent a letter today to congressional leaders expressing support for the legislation and urging its swift passage.

Synopsys to acquire software security company Codenomicon

Tue, 4 Apr 2015
Synopsys, Inc. today announced it has signed a definitive agreement to acquire Codenomicon.

North American semiconductor equipment industry posts March 2015 book-to-bill ratio of 1.10

Wed, 4 Apr 2015
A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month.

Communications, computer systems drive IC sales across all regions

Thu, 4 Apr 2015
Automotive systems forecast to remain a major application in Europe.

Silicon Motion announces agreement to acquire Shannon Systems

Fri, 4 Apr 2015
Silicon Motion Technology Corporation, a developer of NAND flash controllers for solid state storage devices, today announced that it has entered into a definitive agreement to acquire Shannon Systems.

Entegris elects James P. Lederer to Board of Directors

Fri, 5 May 2015
Entegris, Inc., a provider of yield-enhancing materials and solutions for advanced manufacturing processes, announced the election of James P. Lederer as an independent director at the Company's Annual Meeting of Shareholders held today.

First quarter semiconductor sales up 6% compared to last year

Mon, 5 May 2015
The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $83.1 billion during the first quarter of 2015, an increase of 6.0 percent compared to the first quarter of 2014.

New study suggests that rapid innovation in semiconductors provides hope for better economic times ahead

Mon, 5 May 2015
A new study coauthored by Wellesley economist, Professor Daniel E. Sichel, reveals that innovation in an important technology sector is happening faster than experts had previously thought, creating a backdrop for better economic times ahead.

MagnaChip announces management changes

Mon, 5 May 2015
MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that Tae Young Hwang has resigned as the Company's Chief Operating Officer and President and from all other officer and director positions.

Silicon Storage Technology, GLOBALFOUNDRIES announce qualification of automotive grade 55nm flash memory tech

Tue, 5 May 2015
Microchip Technology Inc., through its Silicon Storage Technology subsidiary, and GLOBALFOUNDRIES today announced the full qualification and availability of SST’s 55nm embedded SuperFlash non-volatile memory on GLOBALFOUNDRIES’ 55nm Low Power Extended (LPx)/ RF enabled platform.

New approaches to small problems

Thu, 5 May 2015
The market expectations of modern electronics technology are changing the landscape in terms of performance and, in particular, power consumption, and new innovations are putting unprecedented demands on semiconductor devices.

Microchip Technology to acquire Micrel

Thu, 5 May 2015
Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and Micrel, Incorporated today announced that Microchip has signed a definitive agreement to acquire Micrel.

ASE and TDK announce plans for joint venture agreement

Fri, 5 May 2015
Driving towards market leadership in setting the industry standard for semiconductor miniaturization in portable and wearable consumer devices.

IEEE International Electron Devices Meeting announces 2015 Call for Papers

Tue, 5 May 2015
The paper submission deadline is Monday, June 22, 2015 at 23:59 p.m. Pacific Time.

SRC names former Freescale CTO Ken Hansen as new president and CEO

Thu, 5 May 2015
Semiconductor Research Corporation (SRC) announced today that Ken Hansen has been appointed SRC’s new President and Chief Executive Officer (CEO), effective June 1.

SEMICON West 2015 focuses on the most critical issues in semiconductor manufacturing

Fri, 5 May 2015
SEMI today announced the SEMICON West 2015 technical and business program agenda tackling the most important issues facing the future of semiconductor manufacturing.

First quarter silicon wafer shipments reach record levels

Tue, 5 May 2015
Worldwide silicon wafer area shipments increased during the first quarter 2015 when compared to fourth quarter 2014 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Six top 20 semiconductor suppliers show >20% growth

Thu, 5 May 2015
SK Hynix moves into top 5, MediaTek climbs into top 10, and Sharp and UMC move into the top 20 ranking.

Samtec joins IRT Nanoelec Silicon Photonics Program

Thu, 5 May 2015
Samtec, Inc., a supplier of high-speed interconnects, microelectronics, and micro-optical solutions, is pleased to announce its entrance in the Silicon Photonics Program of the IRT Nanoelec.

SEMI April 2015 book-to-bill report shows continued improvements in bookings and billings

Thu, 5 May 2015
A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

NXP and Stora Enso to develop intelligent packaging solutions

Fri, 5 May 2015
NXP Semiconductors and Stora Enso have entered into joint development of intelligent packaging solutions.

Tablet shipments lose momentum; Total PC unit forecast downgraded

Fri, 5 May 2015
IC Insights has downgraded its forecast for the overall personal computing market, including much lower growth in tablets and continued weakness in standard PCs.

Fan-in WLP manufacturing capacities are full and more volume is required

Fri, 5 May 2015
The semiconductor industry is facing a new era in which device scaling and cost reduction will not continue on the path they followed for the past few decades, with Moore’s law in its foundation.

GLOBALFOUNDRIES solidifies 14nm finFET design infrastructure for next-generation chip design

Tue, 6 Jun 2015
GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced it has reached a critical milestone in providing a design infrastructure for its 14-nanometer (nm) FinFET process technology.

Global semiconductor sales increase in April; Steady growth projected

Wed, 6 Jun 2015
The Semiconductor Industry Association (SIA) announced worldwide sales of semiconductors reached $27.6 billion for the month of April 2015, 4.8 percent higher than the April 2014 total of $26.3 billion and 0.4 percent lower than last month's total of $27.7 billion.

SEMI reports first quarter 2015 worldwide semiconductor equipment figures; billings $9.52B

Tue, 6 Jun 2015
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$9.52 billion in the first quarter of 2015.

Leti launches new Silicon Impulse FD-SOI Development Program

Mon, 6 Jun 2015
CEA-Leti announced today during the Design Automation Conference that seven partners have joined its new FD-SOI IC development program, Silicon Impulse.

Three trends driving optoelectronics market growth through 2019

Tue, 6 Jun 2015
Laser transmitters, CMOS image sensors, and high-brightness LEDs will be key to expansion.

ISSI agrees to merger terms with Cypress Semiconductor

Wed, 6 Jun 2015
Integrated Silicon Solution, Inc. today announced that it has finalized a definitive agreement to be acquired by Cypress Semiconductor Corporation for $20.25 per share in cash.

Industry 4.0, automotive, and emerging markets highlights at SEMICON Europa

Thu, 6 Jun 2015
Today, SEMI announced that SEMICON Europa 2015, the region’s largest microelectronics manufacturing event, will offer new themes to support the semiconductor industry’'s development in Europe.

Renesas Electronics announces Synergy Platform for IoT

Mon, 6 Jun 2015
Renesas Electronics, a supplier of advanced semiconductor solutions, today announced the Renesas Synergy Platform.

SK Hynix ramps production of high bandwidth memory

Tue, 6 Jun 2015
SK Hynix Inc. announced today that it is shipping mass production volumes of 1st generation High Bandwidth Memory (HBM1) based on SK hynix’s advanced 20nm-class DRAM process technology.

North American semiconductor equipment industry posts May 2015 book-to-bill ratio of 0.99

Thu, 6 Jun 2015
North America-based manufacturers of semiconductor equipment posted $1.56 billion in orders worldwide in May 2015 (three-month average basis) and a book-to-bill ratio of 0.99.

Sondrel announces further investment in graduate training for the semiconductor sector

Fri, 6 Jun 2015
Graham Curren, Sondrel CEO, has announced his commitment to further investment in the training of graduate engineers looking to develop a career in the IC design sector, by providing a teaching fellow, and nine scholarship awards to students engaged on the Sondrel University of Nottingham Ningbo (UNNC) School of VLSI Design.

UMC collaborates with ARM to validate UMC 14nm finFET process

Mon, 6 Jun 2015
United Microelectronics Corporation, a global semiconductor foundry, today announced it has collaborated with ARM to tape out a process qualification vehicle (PQV) test chip on UMC's 14nm FinFET technology to help validate an ARM Cortex-A family core on the advanced foundry process node.

SMIC, Huawei, imec, and Qualcomm in joint investment on SMIC's new R&D company

Tue, 6 Jun 2015
The joint venture company will focus on R&D towards next generation CMOS logic technology and build China's most advanced integrated circuit (IC) development R&D platform.

Deca Technologies exceeds half billion units shipped

Thu, 6 Jun 2015
Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, announced today that it has shipped more than half a billion units since the company's launch.

Photolithography equipment & materials market is attracting new players, but success is not guaranteed

Mon, 6 Jun 2015
Growing photolithography equipment markets in advanced packaging, MEMS and LEDs are attracting new players; but they have to navigate complex roadmaps.

Taiwan tops fab spending - Driving anticipation for SEMICON Taiwan 2015

Mon, 6 Jun 2015
In 2015,Taiwan is projected to have the highest capex for semiconductor manufacturing worldwide.

SPP Technologies to acquire SPTS Technologies' Thermal Products business

Wed, 7 Jul 2015
ORBOTECH LTD. today announced that SPTS Technologies Group Ltd. (SPTS), an Orbotech company and supplier of advanced wafer processing solutions, has sold its Thermal Products business to SPP Technologies Co, Ltd.

Smartphone sales remain an important IC market driver in 2015

Thu, 7 Jul 2015
Smartphones forecast to represent 80% of total cellphone shipments in 4Q15.

Global semiconductor sales increase five percent in May 2015

Mon, 7 Jul 2015
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced worldwide sales of semiconductors reached $28.2 billion for the month of May 2015, an increase of 5.1 percent from May 2014, when sales were $26.8 billion.

Surging phablets to shoot past stalled tablet market in 2015

Wed, 7 Jul 2015
Updated forecast shows large-screen smartphone shipments climbing 66% this year to 252 million units while the lack of replacement purchases stymies tablets.

Micron Technology names Trevor Schulze as Chief Information Officer

Thu, 7 Jul 2015
Micron Technology, Inc. today announced it has appointed Trevor Schulze as Chief Information Officer (CIO).

Blood and tears at DAC

Tue, 7 Jul 2015
At this year’s Design Automation Conference (DAC) in San Francisco, Brian Otis, a Director at Google, talked about how hundreds of millions of people are at risk of diabetes – and how a smart contact lens that continuously monitors blood glucose levels and transmits the data to a smartphone might just be the ideal solution.

SEMI Standards leaders honored at SEMICON West 2015

Wed, 7 Jul 2015
SEMI honored six industry leaders for their outstanding accomplishments in developing Standards for the microelectronics and related industries.

Amkor Technology announces expansion of China operations

Tue, 7 Jul 2015
Amkor Technology, Inc. today announced plans to expand its assembly and test factory located in China’s Shanghai Waigaoqiao Free Trade Zone.

“Above and beyond TSV for advanced ICs” - SEMI European 3D Summit 2016

Wed, 7 Jul 2015
SEMI today announced the fourth annual European 3D Summit. Entitled “European 3D Summit 2016: Above and Beyond TSV,” the advanced semiconductor Summit will take place on January 18-20, 2016 in Minatec in Grenoble, France.

SIA commends launch of Congressional Semiconductor Caucus

Wed, 7 Jul 2015
SIA recognized members of the caucus at a reception on Capitol Hill Tuesday evening and honored the caucus's co-chairs, Sen. James Risch (R-Idaho), Sen. Angus King (I-Maine), Rep. Pete Sessions (R-Texas), and Rep. Zoe Lofgren (D-Calif.).

ROHM Semiconductor acquires Powervation

Thu, 7 Jul 2015
ROHM Co., Ltd., a developer of analog power IC solutions, announced today that it has completed the acquisition of Powervation Ltd., a privately held digital power IC company that develops Digital Power Management system-on-chip (SoC) solutions.

Qualcomm appoints Sunil Lalvani as vice president and president of Qualcomm India

Mon, 7 Jul 2015
Qualcomm Incorporated today announced the appointment of Sunil Lalvani as vice president and president of Qualcomm India, and the departure of Avneesh Agrawal, senior vice president and president of Qualcomm India and South Asia.

Chinese automotive semiconductor revenues to hit $6.2B in 2015

Tue, 7 Jul 2015
The growth rate for vehicle shipments in China is slowing, but more and better performing semiconductors will still be required in automotive applications in the coming years.

Microchip Technology completes acquisition of Micrel

Tue, 8 Aug 2015
Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and Micrel, Incorporated today announced that Microchip has completed its previously announced acquisition of Micrel.

Intel to collaborate with Georgia Tech

Wed, 8 Aug 2015
Intel Corporation announced it will invest $5 million over the next five years to deepen its engineering pipeline partnership with the Georgia Institute of Technology and deploy research-driven solutions to inspire and retain women and underrepresented minorities to start and complete computer science and engineering degrees.

STATS ChipPAC appoints co-president and CEO

Wed, 8 Aug 2015
STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, announced today the promotion and appointment of Dr. Han Byung Joon as Co-President and Chief Executive Officer for the Company, together with Mr. Tan Lay Koon.

Record shipments levels continue into the second quarter 2015

Tue, 8 Aug 2015
Worldwide silicon wafer area shipments increased during the second quarter 2015 when compared to first quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Low Power Conference at SEMICON Europa 2015

Wed, 8 Aug 2015
Trends and innovations for low and ultra-low power integrated circuits are the focus of the Low Power Conference at the SEMICON Europa 2015 in Dresden, October 6-8.

Leon Panetta to deliver keynote address at annual SIA Award Dinner

Tue, 8 Aug 2015
The Semiconductor Industry Association (SIA) announced former Defense Secretary Leon Panetta will deliver the keynote address at the upcoming SIA Award Dinner, taking place on Thursday, Dec. 3 in San Jose, Calif.

Update for exporters: Trade wins and delays

Tue, 8 Aug 2015
With trade policy dominating headlines in recent weeks, all eyes were on Maui in the waning days of August as trade ministers from twelve nations convened for perhaps the final time to finalize the Trans-Pacific Partnership (TPP).

Microcontroller unit shipments surge but falling prices sap sales growth

Wed, 8 Aug 2015
Explosion of smartcards, embedded sensors, and new Internet of Things applications are driving up unit volumes of low-cost 32-bit MCU solutions, says Mid-Year Update.

ON Semiconductor names former Texas Instruments VP to Board of Directors

Wed, 8 Aug 2015
ON Semiconductor Corporation this week announced that Gilles Delfassy has joined its Board of Directors.

MagnaChip appoints Gary Tanner to Board of Directors

Thu, 8 Aug 2015
MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced the appointment of Gary Tanner to its Board of Directors.

Book-to-bill ratio reports indicate a solid year for the industry

Thu, 8 Aug 2015
A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month.

Opportunities in South America for semiconductor manufacturing

Mon, 8 Aug 2015
SEMI today announced the second annual SEMI South America Semiconductor Strategy Summit (SA SSS) at the Sheraton Rio on November 10-12 in Rio De Janeiro, Brazil.

Pure-play foundry sales forecast to surpass $12B in fourth quarter 2015

Fri, 8 Aug 2015
Atypical 2015 sales pattern, but stronger growth forecast to resume in second half of this year.

A partnership to secure and protect the emerging Internet of Things

Fri, 8 Aug 2015
The National Science Foundation (NSF), in partnership with Intel Corporation, one of the world's leading technology companies, today announced two new grants totaling $6 million to research teams that will study solutions to address the security and privacy of cyber-physical systems.

Tessera to acquire Ziptronix for $39M

Fri, 8 Aug 2015
The acquisition expands on Tessera’s existing advanced packaging capabilities by adding a low-temperature wafer bonding technology platform that will accelerate delivery of 2.5D and 3D-IC solutions to semiconductor industry customers.

Advanced packaging and 3D-IC markets drive growth for EVG's automated 300mm polymer adhesive wafer bonding

Mon, 8 Aug 2015
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the company is experiencing strong demand for its automated 300mm polymer adhesive wafer bonding systems.

20th annual SEMICON Taiwan 2015 opens today

Wed, 9 Sep 2015
SEMICON Taiwan 2015 opened today starting a three-day event drawing over 43,000 attendees from electronics manufacturing.

Automotive industry now the third largest end market for power semiconductors

Thu, 9 Sep 2015
In 2014, the automotive sector significantly outperformed the overall market average for semiconductors.

Key industry leaders join The ConFab Advisory Board

Fri, 9 Sep 2015
Solid State Technology is thrilled to announce that several key industry leaders have joined the Advisory Board for its annual conference and networking event, The ConFab.

Nordson Corporation announces acquisition of MatriX Technologies GmbH

Fri, 9 Sep 2015
Nordson Corporation today announced it has acquired Munich, Germany-based MatriX Technologies GmbH, a manufacturer of automated X-ray inspection (AXI) equipment used to ensure the quality of electronic printed circuit boards, critical electronic devices and fully assembled products in consumer, automotive and other industrial end markets worldwide.

ASE Chairman Jason Chang receives SEMI award for advancements of copper wire bonding technology

Tue, 9 Sep 2015
The SEMI award recognizes Jason’s significant achievements in the development and commercialization of copper wire in the IC assembly process.

Patent analysis: GaN power devices

Tue, 9 Sep 2015
The GaN devices market for power electronics application will explode in 2016, reaching US$300 million in 2020.

Semiconductor Research Corporation expands benchmarking research program

Wed, 9 Sep 2015
Marking an industry first for emerging electronics devices, Semiconductor Research Corporation (SRC) today announced a significant expansion of its benchmarking research.

Intersil acquires Great Wall Semiconductor

Wed, 9 Sep 2015
Intersil Corporation, a provider of innovative power management and precision analog solutions, today announced the acquisition of Great Wall Semiconductor.

Europe's secondary industry in the spotlight

Tue, 9 Sep 2015
The dramatic shift from the trend for increasingly advanced technology to a vast array and volume of application-based devices presents Europe with a huge opportunity.

SUNY Poly announces joint development agreement with INFICON

Mon, 9 Sep 2015
The collaboration is expected to advance semiconductor manufacturing processes and lead to the creation of 50 jobs at SUNY Poly statewide facilities.

ams offers truly scalable transistors in High-Voltage CMOS

Mon, 9 Sep 2015
The Full Service Foundry division of ams AG today announced a further expansion of its industry-leading 0.35µm High-Voltage CMOS specialty process platform.

2016 Symposia on VLSI Technology and Circuits announces call for papers

Mon, 9 Sep 2015
The official Call for Papers has been issued for the 2016 Symposia on VLSI Technology and Circuits, to be held at the Hilton Hawaiian Village June 13-16, 2016 (Technology) and June 15-17, 2016 (Circuits).

Rudolph acquires inspection technology of Stella Alliance, LLC

Tue, 9 Sep 2015
Acquired patents to enhance Rudolph’s inspection capabilities in advanced packaging and extend inspection into new applications

Leti joins GLOBALFOUNDRIES' ecosystem partners supporting 22FDX platform

Wed, 10 Oct 2015
CEA-Leti announced that it has joined the GLOBALSOLUTIONS ecosystem as an ASIC provider, specifically to support GLOBALFOUNDRIES' 22FDX (TM) technology platform.

Applied Materials and A*STAR announce new R&D joint lab in Singapore for advanced semiconductor technology

Mon, 10 Oct 2015
Applied Materials, Inc. announced it plans to establish a new R&D laboratory in Singapore in collaboration with the Agency for Science, Technology and Research (A*STAR).

Evonik and SCREEN FT enter strategic partnership to promote iXsenic technology

Mon, 10 Oct 2015
German chemical company Evonik Industries AG and Japanese FPD production equipment manufacturer SCREEN Finetech Solutions Co., Ltd. have signed a contract for a strategic partnership.

Siborg Systems introduces educational version of MicroTec semiconductor process and device simulator

Mon, 10 Oct 2015
Siborg has recently made a new MicroTec version available particularly targeting educational use of the software.

Historic era of consolidation for chip makers

Mon, 10 Oct 2015
We are in a historic era for consolidation among semiconductor manufacturers, and the reasons are surprising.

Plasma-Therm acquires plasma processing technology from Nanoplas France

Tue, 11 Nov 2015
Plasma-Therm announced that it has acquired a High Density Radical Flux plasma technology that enables low-temperature Bosch polymer removal.

Brewer Science and Arkema announce partnership to bring high-performance material to semiconductor market

Tue, 10 Oct 2015
Brewer Science, Inc., and Arkema announced a partnership to produce high-quality directed self-assembly (DSA) materials for use in semiconductor manufacturing.

Nordson EFD launches P-Jet non-contact jetting technology for higher throughput yields

Wed, 10 Oct 2015
Nordson EFD introduces a new series of pneumatic non-contact dispensing systems.

Ziptronix and Fraunhofer collaborate on low-cost 3D integration solutions

Fri, 10 Oct 2015
Ziptronix, Inc. announced it has entered into a development agreement with Fraunhofer IZM-ASSID.

Silicon shipment levels decline in third quarter 2015

Fri, 11 Nov 2015
Worldwide silicon wafer area shipments decreased during the third quarter 2015 when compared to second quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Cut costs: Improve competitive advantage

Fri, 11 Nov 2015
Systematic – and predictive – cost reduction in semiconductor equipment manufacturing

Europe’s secondary industry in the spotlight

Tue, 11 Nov 2015
The dramatic shift from the trend for increasingly advanced technology to a vast array and volume of application-based devices presents Europe with a huge opportunity.

TowerJazz to acquire Maxim Integrated's Texas wafer manufacturing plant

Wed, 11 Nov 2015
TowerJazz announced today it has signed an agreement with Maxim Integrated Products, Inc. to purchase Maxim's 8-inch fabrication facility in San Antonio, Texas, United States.

Qualcomm names Cristiano Amon president of QCT

Thu, 11 Nov 2015
Qualcomm Incorporated today announced that Cristiano Amon has been promoted to executive vice president, Qualcomm Technologies, Inc. and president of QCT, effective immediately.

Bookings and billings in semiconductor equipment industry weaken for second consecutive month

Fri, 11 Nov 2015
North America-based manufacturers of semiconductor equipment posted $1.33 billion in orders worldwide in October 2015 (three-month average basis) and a book-to-bill ratio of 0.98.

Silicon Labs acquires Telegesis, a provider of ZigBee modules

Tue, 11 Nov 2015
A privately held company founded in 1998 and based near London, Telegesis has established itself as a ZigBee expert with strong momentum in the smart energy market, providing ZigBee module solutions to many of the world’s top smart metering manufacturers.

Mentor Graphics announces collaboration with GLOBALFOUNDRIES

Wed, 11 Nov 2015
Mentor Graphics Corp. announced it is collaborating with GLOBALFOUNDRIES to qualify the Mentor RTL to GDS platform, including the RealTime Designer physical RTL synthesis solution and Olympus-SoC place & route system, for the current version of the GLOBALFOUNDRIES 22FDX platform reference flow.

GaN Systems announces 10x production increase at TSMC

Tue, 12 Dec 2015
GaN Systems, a manufacturer of gallium nitride power transistors, announces that its foundry, Taiwan Semiconductor Manufacturing Corporation (TMSC), has expanded the high volume production of products based on GaN System’s proprietary Island Technology by 10X in response to surging global demand from consumer and enterprise customers.

Leti to collaborate with Keysight Technologies to enable expansion of FD-SOI technology

Mon, 12 Dec 2015
CEA-Leti today announced it has signed an agreement with Keysight Technologies, a device-modeling software supplier, to adapt Leti’s UTSOI extraction flow methodology within Keysight’s device modeling solutions for high-volume SPICE model generation.

Cellphones remain the largest driver of IC sales, but growth stalls

Fri, 12 Dec 2015
The total production value of electronic systems is forecast to decrease 2% in 2015 to an estimated $1,423 billion, marking only the fourth time in history that the systems market registers a decline.

SEMI European 3D Summit: Beyond TSV in advanced ICs

Fri, 12 Dec 2015
SEMI this week announced details about the fourth annual European 3D Summit.

Strong semiconductor growth forecast for electric vehicle DC fast-charging stations

Wed, 12 Dec 2015
The global market for semiconductors used in electric vehicle (EV) charging stations for plug-in hybrid (PH) and battery electric vehicles (BEV) will continue to expand in the coming years, providing significant growth opportunities to semiconductor manufacturers.

SEMI applauds congressional action to make R&D tax credit permanent; extend solar tax credit

Fri, 12 Dec 2015
SEMI has been working to make the popular tax incentive a permanent part of the tax code since the R&D credit was first established in 1981.

Internet of Things market to nearly double by 2019

Thu, 12 Dec 2015
Between 2015 and 2019, worldwide systems revenues for applications connecting to the Internet of Things will nearly double, reaching $124.5 billion in the final year of this decade, according to IC Insights’ new 2016 edition of its IC Market Drivers report. During that same timeframe, new connections to the Internet of Things (IoT) will grow from about 1.7 billion in 2015 to nearly 3.1 billion in 2019 (Figure 1), based on the forecast in the new 450-page report, which examines emerging and major end-use applications fueling demand for ICs.

Semiconductor equipment sales forecast: $37B in 2015 and $38B in 2016

Tue, 12 Dec 2015
SEMI projects that worldwide sales of new semiconductor manufacturing equipment will decrease 0.6 percent to $37.3 billion in 2015.

Rudolph Technologies receives order for multiple NSX 330 Systems in Asia

Tue, 1 Jan 2016
Rudolph Technologies, Inc., has received an order for over $15 million from a foundry in Asia for multiple NSX 330 Systems.

Samsung, TSMC remain tops in available wafer fab capacity

Thu, 1 Jan 2016
GlobalFoundries, TSMC, SK Hynix show greatest gains in wafer capacity in 2015.

Global semiconductor sales dip slightly in November

Tue, 1 Jan 2016
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $28.9 billion for the month of November 2015.

Semiconductor capital spending market in the US to reach over $31B by 2019

Mon, 1 Jan 2016
Technavio's market research analysts estimate the semiconductor capital spending market in the US, to grow at a CAGR of around 9% between 2015 and 2019.

SEMI Awards honor process and technology integration achievements

Thu, 1 Jan 2016
SEMI announced the recipients of the 2015 SEMI Awards for the Americas.

Qualcomm and TDK announce joint venture

Thu, 1 Jan 2016
Qualcomm and TDK to expand their collaboration across multiple technologies.

Smart Equipment Technology joins IRT Nanoelec 3D Integration Program

Fri, 1 Jan 2016
Will work with Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D die-to-wafer stacking technologies using direct Cu-Cu bonding

Gartner says worldwide IT spending is forecast to grow 0.6% in 2016

Fri, 1 Jan 2016
Worldwide IT spending is forecast to total $3.54 trillion dollars in 2016, just a 0.6 percent increase over 2015 spending of $3.52 trillion dollars, according to Gartner, Inc.

North American semiconductor equipment industry posts December 2015 book-to-bill ratio of 0.99

Wed, 1 Jan 2016
A book-to-bill of 0.99 means that $99 worth of orders were received for every $100 of product billed for the month.

Samsung, Apple continue to lead as top global semiconductor customers

Wed, 1 Jan 2016
Samsung Electronics and Apple remained the top semiconductor buyers in 2015, representing 17.7 percent of the market, according to Gartner, Inc.

Presto Engineering expands turnkey IC production management services with three new operations in Asia

Tue, 2 Feb 2016
Presto Engineering Inc. announced this week that it has significantly expanded its turnkey capabilities with the opening of two new manufacturing hubs and a world-wide logistics center in Asia.

Panel level packaging: The high volume manufacturing roadmap has yet to be built

Fri, 2 Feb 2016
When will the panel industry take off? How will it evolve?

What's happening in the China market?

Fri, 2 Feb 2016
A brief recap of China market news for January 2016.

Foundries takeover 200mm fab capacity by 2018

Mon, 2 Feb 2016
IoT drives worldwide 200mm fab capacity in 2018 back to 2006 levels.

58% of pure-play foundry capacity under high risk for seismic activity

Tue, 2 Feb 2016
As of December 2015, roughly half of the world’s total IC wafer production capacity was located in seismically active areas.

Orbotech collaborates with Nippon Mektron on digital flexible printed circuit board manufacturing

Wed, 2 Feb 2016
Orbotech Ltd. today announced that, Nippon Mektron Mektec, a maker of flexible printed circuit boards (FPCBs), is deploying Orbotech direct imaging (DI) and automated optical inspection (AOI) systems in multiple factories.

SEMI launches new integrated packaging assembly and test group

Wed, 2 Feb 2016
SEMI announced today the launch of the European Semiconductor integrated Packaging and Test (ESiPAT) Special Interest Group.

EV Group joins IRT Nanoelec 3D Integration Program

Thu, 2 Feb 2016
EVG joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D wafer-to-wafer bonding technologies.

Demand for semiconductor ICs fueling global wafer-level manufacturing equipment market through 2020

Tue, 2 Feb 2016
According to the latest market study released by Technavio, the global wafer-level manufacturing equipment market is set to post a CAGR of over 4 percent by 2020.

New 2016 McClean Report examines worldwide GDP growth and its impact on 2016 IC market growth

Wed, 2 Feb 2016
Slow-growth regional GDPs weigh heavy on potential global IC growth.

BiTS: The ever-shrinking package underscores emerging challenges and solutions

Thu, 2 Feb 2016
What’s the single area that is being most disrupted by emergent technologies like the Internet of Things (or the Internet of Vehicles) and Silicon Photonics? We think it’s packaging.

ON Semiconductor releases new CMOS digital image sensor

Mon, 2 Feb 2016
ON Semiconductor Corporation has expanded its portfolio of imaging solutions with the release of its new CMOS digital image sensor, the AR1337.

STATS ChipPAC honored with Supplier of the Year Award from Inphi

Tue, 3 Mar 2016
STATS ChipPAC Ltd. today announced that it has been honored with the “Supplier of the Year” award from Inphi Corporation.

Global semiconductor sales off to sluggish start in 2016

Fri, 3 Mar 2016
The Semiconductor Industry Association today announced worldwide sales of semiconductors reached $26.9 billion for the month of January 2016, 2.7 percent lower than the previous month's total of $27.6 billion and 5.8 percent down from the January 2015 total of $28.5 billion.

CyberOptics and Nordson ink a strategic OEM supplier agreement for 3D MRS sensors

Wed, 3 Mar 2016
CyberOptics today announced an OEM supplier agreement with Nordson YESTECH to supply its proprietary 3D Multi-Reflection Suppression (MRS) sensors.

SMIC and Crossbar announce strategic partnership agreement

Fri, 3 Mar 2016
Semiconductor Manufacturing International Corporation and Crossbar, Inc. jointly announced today that they had signed a strategic partnership agreement on non-volatile RRAM development and production.

Imec opens new 300mm cleanroom for 7nm and beyond chip scaling

Fri, 3 Mar 2016
Nanoelectronics research center imec has today announced the opening of its new 300mm cleanroom.

SEMI reports 2015 global semiconductor equipment sales of $36.5B

Tue, 3 Mar 2016
SEMI today reported that worldwide sales of semiconductor manufacturing equipment totaled $36.53 billion in 2015, representing a year-over-year decrease of 3 percent.

ARM and TSMC announce multi-year agreement to collaborate on 7nm FinFET process

Wed, 3 Mar 2016
ARM and TSMC announced a multi-year agreement to collaborate on a 7nm FinFET process technology which includes a design solution for future low-power, high-performance compute SoCs.

India PC shipments grew 10.6% in fourth quarter of 2015

Tue, 3 Mar 2016
PC shipments in India totalled nearly 2.6 million units in the fourth quarter of 2015, a 10.6 percent increase over the fourth quarter of 2014, according to Gartner, Inc.

Amkor announces shipment of 700M RF and advanced SiP modules

Fri, 3 Mar 2016
Amkor Technology Inc. announced it has shipped 700 million RF and front-end advanced system-in-package (SiP) modules for mobile device applications.

How finFETs ended the service contract of silicide process

Fri, 3 Mar 2016
A look into how the silicide process has evolved over the years, trying to cope with the progress in scaling technology and why it could no longer be of service to finFET devices.

Texas Instruments names Devan Iyer Vice President

Tue, 3 Mar 2016
Texas Instruments Incorporated (TI) announced that Devan Iyer has been elected vice president of the company.

Alpha and Omega Semiconductor announces joint venture agreement in China

Thu, 3 Mar 2016
Alpha and Omega Semiconductor Limited (AOS) (Nasdaq:AOSL), a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today announced that it has executed a definitive agreement with two strategic investment funds owned by the Municipality of Chongqing, China.

Molex acquires Interconnect Systems, Inc.

Fri, 4 Apr 2016
Molex, a global manufacturer of electronic solutions, announced today the acquisition of Interconnect Systems, Inc. ("ISI") which specializes in the design and manufacture of high density silicon packaging with advanced interconnect technologies.

The advanced packaging industry has reached its zenith

Thu, 4 Apr 2016
To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have been developed by industrial companies.

Sandia National Laboratories licenses ZiBond and DBI technologies

Tue, 4 Apr 2016
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc., announced today that Sandia National Laboratories signed a new license agreement for ZiBond and Direct Bond Interconnect (DBI) technologies.

EU regulation update: What could impact the industry next?

Wed, 4 Apr 2016
In a global industry, monitoring regulatory developments across different regions can be a challenge.

North American semiconductor equipment industry posts March 2016 book-to-bill ratio of 1.15

Fri, 4 Apr 2016
Order activity remains steady and is on par with both the previous quarter and one year ago.

Global semiconductor packaging materials market to grow at 4.79% CAGR from 2016-2020

Fri, 4 Apr 2016
Research and Markets’ recent report, "Global Semiconductor Packaging Materials Market 2016-2020", expects the global semiconductor packaging materials market to grow at a CAGR of 4.79% during the period of 2016-2020.

Imec honors Dr. Gordon Moore with "Lifetime of Innovation Award"

Tue, 5 May 2016
Nanoelectronics research center imec has announced that Dr. Gordon E. Moore, creator of the famous Moore’s law theory and co-founder of Intel, is the recipient of its lifetime of innovation award.

Cypress subsidiary Deca Technologies to receive $60M investment from ASE

Fri, 5 May 2016
Advanced Semiconductor Engineering, Inc. and Deca Technologies, a subsidiary of Cypress Semiconductor Corp., announced the signing of an agreement whereby ASE will invest $60 million in Deca and will license Deca's M-Series Fan-out Wafer-Level Packaging (FOWLP) technologies and processes.

GSA announces appointment of Dr. Leo Li as chairman of the GSA Board of Directors

Mon, 5 May 2016
The Global Semiconductor Alliance (GSA) is pleased to announce the appointment of Dr. Leo Li as the chairman of the GSA Board of Directors for 2016 and 2017.

STMicroelectronics reveals advanced silicon-carbide power devices

Mon, 5 May 2016
STMicroelectronics announced advanced high-efficiency power semiconductors for Hybrid and Electric Vehicles (EVs) with a timetable for qualification to the automotive quality standard AEC-Q101.

IBM keynoter outlines disruptive "Economy of Things" at SEMI’s ASMC 2016

Wed, 5 May 2016
The 27th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2016), opened today (May 17) in Saratoga Springs, New York.

The CEA announces expanded collaboration with Intel

Wed, 5 May 2016
The CEA (Atomic Energy Commission) and Intel are boosting their collaboration through a new R&D agreement signed in Paris on Thursday 12 May.

Mike Noonen joins Silego Technology

Mon, 5 May 2016
Silego Technology, the Configurable Mixed-signal Integrated Circuit (CMIC) pioneer, today announced the appointment of Mike Noonen to lead sales and business development.

Tessera files legal proceedings against Broadcom for patent infringement

Tue, 5 May 2016
Tessera Technologies, Inc. announced today that it and certain of its subsidiaries filed legal proceedings for patent infringement in both domestic and international jurisdictions against Broadcom.

NXP introduces new high performance GaN RF power transistors

Wed, 5 May 2016
NXP Semiconductors N.V. today announced an expansion to its portfolio of 48V Gallium Nitride (GaN) RF power transistors optimized for Doherty power amplifiers for use in current and next-generation cellular base stations.

SEMICON West 2016 expands technical programming by nearly 50%

Thu, 5 May 2016
As the opening day of SEMICON West (July 12-14) approaches, the electronics manufacturing industry is experiencing disruptive changes, making “business as usual” a thing of the past. To help technical and business professionals navigate this fast-changing landscape, SEMICON West programming has been upgraded extensively.

High Tech U in Taiwan for first time

Tue, 6 Jun 2016
The SEMI High Tech U learning program commenced April 20-22 in Hsinchu, Taiwan.

China-based smartphone suppliers held 8 of Top 12 spots in first quarter ranking

Thu, 6 Jun 2016
An India-based smartphone supplier -- Micromax -- joins the top 12 ranking for the first time.

Global semiconductor sales decrease in April; Annual sales projected to dip slightly in 2016

Fri, 6 Jun 2016
The Semiconductor Industry Association (SIA) this week announced worldwide sales of semiconductors reached $25.8 billion for the month of April 2016.

Samsung Electro-Mechanics to launch IC packaging business

Wed, 6 Jun 2016
Samsung Electro-Mechanics, an electronic parts affiliate of Samsung Group, is preparing to dive into the integrated circuit packaging industry, according to news reports on Monday.

ams acquires CCMOSS

Thu, 6 Jun 2016
ams, a manufacturer of high performance sensor and analog solutions, has signed an agreement to acquire 100% of the shares in Cambridge CMOS Sensors Ltd (CCMOSS), a developer of micro hotplate structures for gas sensing and infrared applications, in an all-cash transaction.

Amkor Technology receives Qualcomm Technologies’ 2015 Supplier of the Year award

Tue, 6 Jun 2016
Amkor Technology Inc., a provider of semiconductor packaging and test services, today announced it has received the Supplier of the Year award from Qualcomm Technologies, Inc.

EV Group scores fourth consecutive triple crown win in annual VLSIresearch customer satisfaction survey

Tue, 6 Jun 2016
EV Group (EVG) today announced that, for the fourth successive year, it has earned all three awards resulting from VLSIresearch Inc.'s annual Customer Satisfaction Survey.

Power transistors to see less volatility in second half of this decade

Wed, 6 Jun 2016
Greater demand for energy efficiency in systems, cars, portable electronics, and new connections to the Internet of Things will steadily drive power transistor sales to new record-high levels in the next three years.

Ultratech receives multiple system, follow-on order for fan-out wafer-level packaging applications

Tue, 6 Jun 2016
Ultratech's AP300 lithography systems will be used for next-generation, high-volume, fan-out wafer-level packaging applications.

ALLVIA launches new product lines for Through Glass Vias and Through Quartz Vias

Wed, 6 Jun 2016
ALLVIA, Inc. has expanded its capacity into glass and quartz via manufacturing to accommodate customer requests in via-fill technology from silicon interposers to glass and quartz interposers.

A*STAR'S IME launches Chip-On-Wafer Consortium II and Cost Effective Interposer Consortium

Thu, 6 Jun 2016
A*STAR’s Institute of Microelectronics (IME) has partnered semiconductor companies to develop cost-effective solutions in 2.5D and 3D wafer-level integrated circuit (IC) packaging.

AMICRA to provide precision die attach system to Fabrinet in Silicon Valley

Fri, 7 Jul 2016
AMICRA Microtechnologies, a German-based vendor of advanced back-end assembly processing equipment for advanced packaging applications, has received an order for the AFC Plus System from Fabrinet West.

Kulicke & Soffa joins Chip-on-Wafer Consortium II

Fri, 7 Jul 2016
Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC), a designer and manufacturer of semiconductor and LED assembly equipment, has joined A*STAR’s Institute of Microelectronics (IME)’s Chip-on-Wafer Consortium II, together with other major industry players.

Global semiconductor sales up slightly in May

Tue, 7 Jul 2016
Sales increase 0.4 percent compared to April, decrease 7.7 percent year-to-year.

Dr. Cheryl L. Shavers elected to Mentor Graphics Board of Directors

Thu, 7 Jul 2016
Mentor Graphics Corp. today announced that on June 15, 2016, the company's shareholders elected Dr. Cheryl L. Shavers to the company's board of directors.

IC Insights lowers 2016 semiconductor market forecast to -1%

Fri, 7 Jul 2016
Weak global economy and poor DRAM market to drag down growth this year.

TECHCET 2016 forecast: $1.39B in photoresists, $680M in extensions

Fri, 7 Jul 2016
Photoresist manufacturers had reason to smile as fiscal 2015 closed, with sales growing nicely to $1.37B, a 6.2% increase over 2014.

AppliedMicro adopting TSMC 7nm finFET process technology

Mon, 7 Jul 2016
AppliedMicro's innovative silicon products enabled by TSMC's advanced technology.

Amkor Technology receives "Device of the Year" for SWIFT semiconductor package

Wed, 7 Jul 2016
Amkor Technology, Inc. recently received the 3D InCites "Device of the Year" award during SEMICON West for its' SWIFT semiconductor package.

Solid State Technology Contributing Editor receives "Lifetime Achievement Award" for "Excellence in 3D Packaging Technologies"

Thu, 7 Jul 2016
Contributing editor and blogger Phil Garrou received the 3D InCites "Device of the Year" award during the 2016 SEMICON West conference for "Excellence in 3D Packaging Technologies."

North American semiconductor equipment industry posts June 2016 book-to-bill ratio of 1.00

Fri, 7 Jul 2016
Billings activity for equipment companies based in North America are at their highest level since February 2011.

A*STAR'S IME kicks off consortia to develop packaging solutions for IoT applications

Tue, 7 Jul 2016
Innovative capabilities developed will lead to higher power efficiency and lower costs for MEMS and silicon photonics devices.

Applied Materials appoints Judy Bruner to Board of Directors

Mon, 7 Jul 2016
Applied Materials, Inc. today announced the appointment of Judy Bruner to serve on its Board of Directors. Ms. Bruner has also been appointed to serve as a member of the Audit Committee of the Board.

Evolving flip-chip technology boosting markets

Mon, 7 Jul 2016
New levels of performance of electronics technology have been enabled by flip-chip technology, fueling the growth of global markets for semiconductors, electronic devices, and a host of industrial and consumer products.

SJSemi and Qualcomm announce mass production of 14nm wafer bumping technology

Thu, 7 Jul 2016
SJ Semiconductor Corp. and Qualcomm Technologies, Inc. jointly announced that SJSemi has begun mass production of 14nm wafer bumping for Qualcomm Technologies.

Ultratech receives 'Outstanding Supplier Award' from SJ Semiconductor

Tue, 8 Aug 2016
Ultratech, Inc. today announced that it has received an 'Outstanding Supplier Award' from SJ Semiconductor Corp.

Huge 2H16 spending surge expected from Samsung, TSMC, and Intel

Thu, 8 Aug 2016
Combined outlays from the “Big 3” spenders is forecast to almost double in 2H16 over 1H16.

OnChip announces semiconductor wafer fabrication services

Mon, 8 Aug 2016
OnChip’s wafer foundry offers Thin Film, CMOS, and BiPolar processes and has produced more than 250 different high-volume products under the OnChip brand as well as for other companies globally.

Time to uncover the process mystery for IC designs

Mon, 8 Aug 2016
Semiconductor processes have long been a mystery for many circuit designers. They didn’t need to worry about how chips were fabricated most of the time, thanks to the many EDA innovations that make their jobs easier and complex designs possible.

Advanced packaging: Hot topic at SEMICON Taiwan 2016

Wed, 8 Aug 2016
SEMI announced today that over 43,000 visitors are expected to attend SEMICON Taiwan September 7-9 at the TWTC Nangang Exhibition Hall in Taipei.

Intel to produce 10nm ARM chip designs

Fri, 8 Aug 2016
ARM and Intel Custom Foundry this week at the Intel Developer Forum in San Francisco an agreement to accelerate the development and implementation of ARM SoCs on Intel’s 10nm process.

Littelfuse to acquire select product portfolio from ON Semiconductor

Fri, 8 Aug 2016
Littelfuse, Inc. today announced it has entered into definitive agreements to acquire the product portfolio of transient voltage suppression diodes, switching thyristors and insulated gate bipolar transistors for automotive ignition applications from ON Semiconductor Corporation for a combined purchase price of $104 million.

ASMC 2017 "Call for Papers" deadline is October 17

Thu, 9 Sep 2016
SEMI announced today that the deadline for presenters to submit an abstract for the annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is October 17.

Semiconductor industry icons to gather at SIA Award Dinner Nov. 10 in San Jose

Fri, 9 Sep 2016
The Semiconductor Industry Association today announced more than a dozen semiconductor industry icons, leaders, and founders will come together at the annual SIA Award Dinner on Thursday, Nov. 10 in San Jose to celebrate the 25th anniversary of the Robert N. Noyce Award, the industry's highest honor.

IC Insights updates semiconductor outlook for Internet of Things

Wed, 9 Sep 2016
Lower sales projections for connected cities leads to reduced semiconductor IoT market forecast.

Global semiconductor sales rebound in July

Wed, 9 Sep 2016
The Semiconductor Industry Association announced worldwide sales of semiconductors reached $27.1 billion for the month of July 2016.

iPhone 7 materials costs higher than previous versions

Thu, 9 Sep 2016
The bill of materials (BOM) for an iPhone 7 equipped with 32 gigabytes (GB) of NAND flash memory carries $219.80 in bill of materials costs, according to a preliminary estimate from IHS Markit.