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GS Nanotech pioneers 3D packaging technology in Russia

Thu, 6 Jun 2014
GS Nanotech, microelectronics products development and manufacture center, plans to launch mass assembly of 3D stacked TSV (through-silicon via) microcircuits in next few years.

Entegris opens new facility in Bedford, MA

Thu, 6 Jun 2014
Entegris Inc., a Billerica-based materials and solutions provider to the microelectronics industries, today inaugurated its new i2M Center for Advanced Materials Science ("The i2M Center") in Bedford, Massachusetts.

200mm equipment market gaining new lease on life

Mon, 6 Jun 2014
In 2004/2005, shipments of 300mm wafer fab equipment (WFE) began to outpace that of 200mm platforms.

Boston Semi Equipment acquires MVTS Technologies

Tue, 6 Jun 2014
Boston Semi Equipment LLC (BSE) today announced it has completed the acquisition of MVTS Technologies (MVTS).

SMIC establishes the first 12 in CIS supply chain in China

Tue, 6 Jun 2014
Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, today announced that the first 12" color filter and micro lens array production line in mainland China has been completed and put into production by Toppan SMIC Electronics of Shanghai

Jordan Valley Semiconductors wins more market share in advanced wafer level packaging

Thu, 7 Jul 2014
Jordan Valley Semiconductors Ltd., a supplier of X-ray based metrology tools for advanced semiconductor manufacturing lines, today announced that its micro-spot X-ray Fluorescence (µXRF) metrology tool has been qualified for production monitoring of advanced Wafer Level Packaging (WLP) processes, by another memory player.

Permanent bonding: A key technology for MEMS, advanced packaging, LEDs and SOI

Mon, 7 Jul 2014
Yole Développement has released a new report, Permanent Wafer Bonding, detailing permanent bonding technologies and the microelectronic applications that use permanent bonding such as MEMS, Advanced Packaging, LEDs and SOI substrates.

SEMI forecasts double-digit business growth in 2014, 2015

Wed, 7 Jul 2014
The worldwide semiconductor capital equipment market is forecast to increase 20.8 percent this year to $38.44 billion, compared with 2013’s $31.82 billion, and another 10.8 percent in 2015 to $42.6 billion, according to Semiconductor Equipment and Materials International.

SEMI announces new South America Semiconductor Strategy Summit

Tue, 7 Jul 2014
SEMI today announced the launch of the association's first-ever event in Latin America.

Harnessing big data

Mon, 7 Jul 2014
Addressing the analytics challenges in supply chain management.

A call to provide advanced equipment to growth companies

Mon, 7 Jul 2014
Historically, the major semiconductor capital equipment manufacturers have focused on supporting the bigger semiconductor companies at the expense of the smaller ones.

Materials matter — Enabling the future of IC fabrication and packaging

Thu, 7 Jul 2014
The SEMI Strategic Materials Conference, held September 30–October 1 in Santa Clara, Calif., will examine the drivers for new materials and how they impact material suppliers and the value chain they serve.

Micron Technology appoints Stephen Pawlowski as Vice President of Advanced Computing Solutions

Mon, 8 Aug 2014
Micron Technology, Inc. today announced that Stephen Pawlowski has been named as vice president of Advanced Computing Solutions.

Global semiconductor industry on pace for record sales through first half of 2014

Tue, 8 Aug 2014
Sales up across every region and nearly all product categories compared to last year; Americas region shows strongest growth.

Si2 announces new director of 3DIC programs

Thu, 8 Aug 2014
The Silicon Integration Initiative (Si2), a global semiconductor standards consortium, announced today that Herb Reiter is joining the team of professionals in the role of Director, 3D IC Programs.

Mentor Graphics announces 25th annual PCB Technology Leadership Awards program

Tue, 8 Aug 2014
Mentor Graphics Corporation today announced the call-for-entries of its 25th annual Technology Leadership Awards (TLA) competition, continuing its tradition of recognizing excellence in printed circuit board (PCB) design.

Order activity for semiconductor equipment holds steady in July

Thu, 8 Aug 2014
North America-based manufacturers of semiconductor equipment posted $1.41 billion in orders worldwide in July 2014 (three-month average basis) and a book-to-bill ratio of 1.07, according to the July EMDS Book-to-Bill Report published today by SEMI.

S2C opens Korean office and appoints country manager

Tue, 8 Aug 2014
S2C, Inc. announced today the opening of a direct sales and support office in Seoul, Korea, appointing Suk-Ha Lee (SH Lee) as country manager.

Lean strategies and decentralized value chains fuel RFID uptake in manufacturing

Wed, 8 Aug 2014
New analysis from Frost & Sullivan, Analysis of the Global RFID in Manufacturing Market, finds that the market earned revenues of $1.29 billion in 2013 and estimates this to nearly quadruple to $4.99 billion in 2020.

Shinichi Machida named President and CEO of Fujitsu Semiconductor America

Thu, 9 Sep 2014
Fujitsu Semiconductor America (FSA) today announced that Shinichi "James" Machida, who led the company from late 2008 until spring of 2011, has been named as the new president and CEO of FSA.

NVIDIA files complaints against Samsung and Qualcomm

Fri, 9 Sep 2014
NVIDIA today announced that it has filed complaints against Samsung and Qualcomm at the International Trade Commission and in the U.S. District Court in Delaware, alleging that the companies are both infringing NVIDIA GPU patents covering technology including programmable shading, unified shaders and multithreaded parallel processing.

Second quarter 2014 semi equipment billings 28% higher than 2013 second quarter

Tue, 9 Sep 2014
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 9.62 billion in the second quarter of 2014.

35 European start-ups showcased at SEMICON Europa’s Innovation Village

Mon, 9 Sep 2014
35 major European start-ups will participate in the Innovation Village and present their new technologies at SEMICON Europa.

Mentor Graphics appoints Vice President for Embedded Technologies

Thu, 9 Sep 2014
Mentor Graphics Corp. today announced the appointment of Glenn Perry to the role of vice president of the company's Embedded Systems Division.

ProPlus Design Solutions expands sales operations to Europe

Thu, 9 Sep 2014
ProPlus Design Solutions, Inc. announced today it expanded its sales operations to Europe.

North American semiconductor equipment industry posts August 2014 book-to-bill ratio of 1.04

Thu, 9 Sep 2014
A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

SEMI forms new Tablet Working Group

Wed, 9 Sep 2014
When you say the word sapphire most people think of a brilliant blue gemstone. The members that have formed the Tablet Working Group think of sapphire as a key enabler of future growth for their respective businesses.

Printed, flexible, and organic electronics will account for 18% of wearable athletics sensors in 2024

Fri, 9 Sep 2014
Printed, flexible and organic electronic (PFOE) sensors can offer flexible form factors, larger area, lower cost, lower power, and better disposability compared to conventional sensors, key attributes for wearable applications.

European 3D TSV Summit: “Smarter system integration” theme to focus on both business and technology

Tue, 9 Sep 2014
On January 19-21, 2015, SEMI will hold its 3rd edition of the European 3D TSV Summit in Grenoble, France.

Tessera Technologies names Craig Mitchell as CTO and president of Invensas

Mon, 9 Sep 2014
Tessera Technologies, Inc. today announced it has named Craig Mitchell as chief technology officer for Tessera and president of Invensas Corporation, effective immediately.

SEMICON Japan features "World of IoT"

Wed, 10 Oct 2014
Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs.

Boston Semi Equipment creates industry's largest independent ATE organization

Wed, 10 Oct 2014
Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name.

ARM and TSMC unveil roadmap for 64-bit ARM-based processors on 10FinFET process technology

Thu, 10 Oct 2014
ARM and TSMC today announced a new multi-year agreement that will deliver ARMv8-A processor IP optimized for TSMC 10FinFET process technology.

Silicon Cloud International launches semiconductor collaborative platform in Singapore

Fri, 10 Oct 2014
Silicon Cloud International (SCI), a provider of secure and private cloud computing infrastructure, announced today successful pilot program launch of its semiconductor workflow platform in Singapore.

China's wafer foundry market: 15% growth in 2014

Thu, 10 Oct 2014
The wafer foundry market experienced a wavy development, jumping by 39.4 percent in 2010 following a 7.9 percent decline in 2009.

Advanced packaging technologies are changing the LED manufacturing supply chain

Wed, 10 Oct 2014
At the LED packaging equipment level, growth will return for the next three years.

Mentor Graphics wins $36M in patent infringement suit

Mon, 10 Oct 2014
A Portland, Oregon jury today delivered a verdict in favor of Mentor Graphics in a patent infringement trial against Synopsys, Inc., awarding Mentor Graphics $35 million in damages and royalties.

Texas Instruments announces 22B copper wire bond technology units shipped

Tue, 10 Oct 2014
Texas Instruments today announced it has shipped more than 22 billion units of copper wire bonding technology from its internal assembly sites and is now in production for major high reliability applications including automotive and industrial.

IRLYNX and CEA-Leti to streamline new CMOS-based infrared sensing modules

Wed, 10 Oct 2014
IRLYNX and CEA-Leti today announced they have launched a technology-development partnership for a new CMOS-based infrared technology that will allow a new type of smart and connected detectors in buildings and cities.

Intermolecular appoints Dr. Bruce McWilliams as President and CEO

Thu, 10 Oct 2014
Intermolecular, Inc. announced this week that Dr. Bruce McWilliams has been appointed president and chief executive officer.

Qualcomm to acquire CSR

Thu, 10 Oct 2014
Qualcomm today announced that it has reached agreement with CSR regarding the terms of a recommended cash acquisition of CSR will be acquired by Qualcomm Global Trading Pte. Ltd.

Canadian semiconductor manufacturing industry revenue expected to decline 8% in 2014

Fri, 10 Oct 2014
Industry manufacturers, which are typically small- to mid-sized enterprises, will find it difficult to match the research and development (R&D) spending of multinational competitors.

Semiconductor equipment book-to-bill declines in September

Tue, 10 Oct 2014
While order activity moderated, equipment spending this year is expected to be robust and remain on pace for double-digit year-over-year growth.

Mentor Graphics appoints vice president for PCB Design

Thu, 10 Oct 2014
Mentor Graphics Corp. today announced the appointment of A.J. Incorvaia to the role of vice president and general manager of the company's Board Systems Division.

IMAPS Award Winners for 2014

Fri, 10 Oct 2014
At the IMAPS (International Microelecronics & Packaging Society) meeting last week, several of their key annual awards were given out.

KLA-Tencor reveals 'leveraged recapitalization' plan and an expanded stock repurchase program

Fri, 10 Oct 2014
Yesterday, KLA-Tencor announced a plan to significantly accelerate its strategy to drive stockholder returns.