letter-ap-business

Topic Index

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z 0-9


GS Nanotech pioneers 3D packaging technology in Russia

Thu, 6 Jun 2014
GS Nanotech, microelectronics products development and manufacture center, plans to launch mass assembly of 3D stacked TSV (through-silicon via) microcircuits in next few years.

Entegris opens new facility in Bedford, MA

Thu, 6 Jun 2014
Entegris Inc., a Billerica-based materials and solutions provider to the microelectronics industries, today inaugurated its new i2M Center for Advanced Materials Science ("The i2M Center") in Bedford, Massachusetts.

200mm equipment market gaining new lease on life

Mon, 6 Jun 2014
In 2004/2005, shipments of 300mm wafer fab equipment (WFE) began to outpace that of 200mm platforms.

Boston Semi Equipment acquires MVTS Technologies

Tue, 6 Jun 2014
Boston Semi Equipment LLC (BSE) today announced it has completed the acquisition of MVTS Technologies (MVTS).

SMIC establishes the first 12 in CIS supply chain in China

Tue, 6 Jun 2014
Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, today announced that the first 12" color filter and micro lens array production line in mainland China has been completed and put into production by Toppan SMIC Electronics of Shanghai

Jordan Valley Semiconductors wins more market share in advanced wafer level packaging

Thu, 7 Jul 2014
Jordan Valley Semiconductors Ltd., a supplier of X-ray based metrology tools for advanced semiconductor manufacturing lines, today announced that its micro-spot X-ray Fluorescence (µXRF) metrology tool has been qualified for production monitoring of advanced Wafer Level Packaging (WLP) processes, by another memory player.

Permanent bonding: A key technology for MEMS, advanced packaging, LEDs and SOI

Mon, 7 Jul 2014
Yole Développement has released a new report, Permanent Wafer Bonding, detailing permanent bonding technologies and the microelectronic applications that use permanent bonding such as MEMS, Advanced Packaging, LEDs and SOI substrates.

SEMI forecasts double-digit business growth in 2014, 2015

Wed, 7 Jul 2014
The worldwide semiconductor capital equipment market is forecast to increase 20.8 percent this year to $38.44 billion, compared with 2013’s $31.82 billion, and another 10.8 percent in 2015 to $42.6 billion, according to Semiconductor Equipment and Materials International.

SEMI announces new South America Semiconductor Strategy Summit

Tue, 7 Jul 2014
SEMI today announced the launch of the association's first-ever event in Latin America.

Harnessing big data

Mon, 7 Jul 2014
Addressing the analytics challenges in supply chain management.

A call to provide advanced equipment to growth companies

Mon, 7 Jul 2014
Historically, the major semiconductor capital equipment manufacturers have focused on supporting the bigger semiconductor companies at the expense of the smaller ones.

Materials matter — Enabling the future of IC fabrication and packaging

Thu, 7 Jul 2014
The SEMI Strategic Materials Conference, held September 30–October 1 in Santa Clara, Calif., will examine the drivers for new materials and how they impact material suppliers and the value chain they serve.

Micron Technology appoints Stephen Pawlowski as Vice President of Advanced Computing Solutions

Mon, 8 Aug 2014
Micron Technology, Inc. today announced that Stephen Pawlowski has been named as vice president of Advanced Computing Solutions.

Global semiconductor industry on pace for record sales through first half of 2014

Tue, 8 Aug 2014
Sales up across every region and nearly all product categories compared to last year; Americas region shows strongest growth.

Si2 announces new director of 3DIC programs

Thu, 8 Aug 2014
The Silicon Integration Initiative (Si2), a global semiconductor standards consortium, announced today that Herb Reiter is joining the team of professionals in the role of Director, 3D IC Programs.

Mentor Graphics announces 25th annual PCB Technology Leadership Awards program

Tue, 8 Aug 2014
Mentor Graphics Corporation today announced the call-for-entries of its 25th annual Technology Leadership Awards (TLA) competition, continuing its tradition of recognizing excellence in printed circuit board (PCB) design.

Order activity for semiconductor equipment holds steady in July

Thu, 8 Aug 2014
North America-based manufacturers of semiconductor equipment posted $1.41 billion in orders worldwide in July 2014 (three-month average basis) and a book-to-bill ratio of 1.07, according to the July EMDS Book-to-Bill Report published today by SEMI.

S2C opens Korean office and appoints country manager

Tue, 8 Aug 2014
S2C, Inc. announced today the opening of a direct sales and support office in Seoul, Korea, appointing Suk-Ha Lee (SH Lee) as country manager.

Lean strategies and decentralized value chains fuel RFID uptake in manufacturing

Wed, 8 Aug 2014
New analysis from Frost & Sullivan, Analysis of the Global RFID in Manufacturing Market, finds that the market earned revenues of $1.29 billion in 2013 and estimates this to nearly quadruple to $4.99 billion in 2020.

Shinichi Machida named President and CEO of Fujitsu Semiconductor America

Thu, 9 Sep 2014
Fujitsu Semiconductor America (FSA) today announced that Shinichi "James" Machida, who led the company from late 2008 until spring of 2011, has been named as the new president and CEO of FSA.

NVIDIA files complaints against Samsung and Qualcomm

Fri, 9 Sep 2014
NVIDIA today announced that it has filed complaints against Samsung and Qualcomm at the International Trade Commission and in the U.S. District Court in Delaware, alleging that the companies are both infringing NVIDIA GPU patents covering technology including programmable shading, unified shaders and multithreaded parallel processing.

Second quarter 2014 semi equipment billings 28% higher than 2013 second quarter

Tue, 9 Sep 2014
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 9.62 billion in the second quarter of 2014.

35 European start-ups showcased at SEMICON Europa’s Innovation Village

Mon, 9 Sep 2014
35 major European start-ups will participate in the Innovation Village and present their new technologies at SEMICON Europa.

Mentor Graphics appoints Vice President for Embedded Technologies

Thu, 9 Sep 2014
Mentor Graphics Corp. today announced the appointment of Glenn Perry to the role of vice president of the company's Embedded Systems Division.

ProPlus Design Solutions expands sales operations to Europe

Thu, 9 Sep 2014
ProPlus Design Solutions, Inc. announced today it expanded its sales operations to Europe.

North American semiconductor equipment industry posts August 2014 book-to-bill ratio of 1.04

Thu, 9 Sep 2014
A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

SEMI forms new Tablet Working Group

Wed, 9 Sep 2014
When you say the word sapphire most people think of a brilliant blue gemstone. The members that have formed the Tablet Working Group think of sapphire as a key enabler of future growth for their respective businesses.

Printed, flexible, and organic electronics will account for 18% of wearable athletics sensors in 2024

Fri, 9 Sep 2014
Printed, flexible and organic electronic (PFOE) sensors can offer flexible form factors, larger area, lower cost, lower power, and better disposability compared to conventional sensors, key attributes for wearable applications.

European 3D TSV Summit: “Smarter system integration” theme to focus on both business and technology

Tue, 9 Sep 2014
On January 19-21, 2015, SEMI will hold its 3rd edition of the European 3D TSV Summit in Grenoble, France.

Tessera Technologies names Craig Mitchell as CTO and president of Invensas

Mon, 9 Sep 2014
Tessera Technologies, Inc. today announced it has named Craig Mitchell as chief technology officer for Tessera and president of Invensas Corporation, effective immediately.

SEMICON Japan features "World of IoT"

Wed, 10 Oct 2014
Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs.

Boston Semi Equipment creates industry's largest independent ATE organization

Wed, 10 Oct 2014
Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name.

ARM and TSMC unveil roadmap for 64-bit ARM-based processors on 10FinFET process technology

Thu, 10 Oct 2014
ARM and TSMC today announced a new multi-year agreement that will deliver ARMv8-A processor IP optimized for TSMC 10FinFET process technology.

Silicon Cloud International launches semiconductor collaborative platform in Singapore

Fri, 10 Oct 2014
Silicon Cloud International (SCI), a provider of secure and private cloud computing infrastructure, announced today successful pilot program launch of its semiconductor workflow platform in Singapore.

China's wafer foundry market: 15% growth in 2014

Thu, 10 Oct 2014
The wafer foundry market experienced a wavy development, jumping by 39.4 percent in 2010 following a 7.9 percent decline in 2009.

Advanced packaging technologies are changing the LED manufacturing supply chain

Wed, 10 Oct 2014
At the LED packaging equipment level, growth will return for the next three years.

Mentor Graphics wins $36M in patent infringement suit

Mon, 10 Oct 2014
A Portland, Oregon jury today delivered a verdict in favor of Mentor Graphics in a patent infringement trial against Synopsys, Inc., awarding Mentor Graphics $35 million in damages and royalties.

Texas Instruments announces 22B copper wire bond technology units shipped

Tue, 10 Oct 2014
Texas Instruments today announced it has shipped more than 22 billion units of copper wire bonding technology from its internal assembly sites and is now in production for major high reliability applications including automotive and industrial.

IRLYNX and CEA-Leti to streamline new CMOS-based infrared sensing modules

Wed, 10 Oct 2014
IRLYNX and CEA-Leti today announced they have launched a technology-development partnership for a new CMOS-based infrared technology that will allow a new type of smart and connected detectors in buildings and cities.

Intermolecular appoints Dr. Bruce McWilliams as President and CEO

Thu, 10 Oct 2014
Intermolecular, Inc. announced this week that Dr. Bruce McWilliams has been appointed president and chief executive officer.

Qualcomm to acquire CSR

Thu, 10 Oct 2014
Qualcomm today announced that it has reached agreement with CSR regarding the terms of a recommended cash acquisition of CSR will be acquired by Qualcomm Global Trading Pte. Ltd.

Canadian semiconductor manufacturing industry revenue expected to decline 8% in 2014

Fri, 10 Oct 2014
Industry manufacturers, which are typically small- to mid-sized enterprises, will find it difficult to match the research and development (R&D) spending of multinational competitors.

Semiconductor equipment book-to-bill declines in September

Tue, 10 Oct 2014
While order activity moderated, equipment spending this year is expected to be robust and remain on pace for double-digit year-over-year growth.

Mentor Graphics appoints vice president for PCB Design

Thu, 10 Oct 2014
Mentor Graphics Corp. today announced the appointment of A.J. Incorvaia to the role of vice president and general manager of the company's Board Systems Division.

IMAPS Award Winners for 2014

Fri, 10 Oct 2014
At the IMAPS (International Microelecronics & Packaging Society) meeting last week, several of their key annual awards were given out.

KLA-Tencor reveals 'leveraged recapitalization' plan and an expanded stock repurchase program

Fri, 10 Oct 2014
Yesterday, KLA-Tencor announced a plan to significantly accelerate its strategy to drive stockholder returns.

TSI Semiconductors and Silvaco extend collaboration to accelerate launch of 0.25um BCDMOS process

Wed, 10 Oct 2014
Silvaco, Inc. (Silvaco) and TSI Semiconductors, LLC (TSI) today announced that they have extended their collaboration to accelerate the development and production launch of TSI's 0.25um BCDMOS process technology.

SEMICON Japan 2014: New venue and new ideas for rebounding industry

Wed, 10 Oct 2014
Today, SEMI announced an exceptional lineup of speakers for SEMICON Japan’s Opening Day — Accenture, Applied Materials, ARM, IBM Japan, Intel K.K., NIICT, Scripps, Toshiba, and Toyota.

Global semiconductor industry posts highest-ever quarterly sales

Mon, 11 Nov 2014
Global sales for the month of September 2014 reached $29 billion, 8 percent higher than the September 2013 total of $26.9 billion and 1.9 percent more than last month's total of $28.5 billion.

Tetsuro Higashi to receive the SEMI Sales and Marketing Excellence Award

Wed, 11 Nov 2014
SEMI today announced that Tetsuro (Terry) Higashi, chairman, president and CEO of Tokyo Electron Limited (TEL), has been selected as the 2015 recipient of the SEMI Sales and Marketing Excellence Award, inspired by the late Bob Graham.

SEMATECH names Ronald Goldblatt permanent CEO

Fri, 11 Nov 2014
SEMATECH, the global consortium of semiconductor manufacturers, today announced that Dr. Ronald Goldblatt has been named President and Chief Executive Officer by the company’s Board of Directors, effective immediately. Dr. Goldblatt has served as acting President and Chief Executive Officer since April 2014.

$1,000,000 "Challenge Grant" goal achieved for SEMI high tech industry workforce development

Tue, 11 Nov 2014
With generous “Morgan Challenge Matchmaker” contributions, the SEMI Foundation recently reached its goal of $1 million for workforce development.

Deal to expand information technology agreement will strengthen semiconductor industry

Tue, 11 Nov 2014
Agreement will extend tariff-free coverage of the latest semiconductor products and technologies.

Slight increase in third quarter 2014 silicon wafer shipments

Wed, 11 Nov 2014
Worldwide silicon wafer area shipments increased during the third quarter 2014 when compared to second quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Professors from UC Berkeley and UT Dallas honored for excellence in semiconductor research

Thu, 11 Nov 2014
The Semiconductor Industry Association (SIA), in consultation with Semiconductor Research Corporation (SRC), today presented its University Research Award to professors from University of California, Berkeley and University of Texas at Dallas in recognition of their outstanding contributions to semiconductor research.

Notebook PC shipments rise year over year as tablet PCs decline

Tue, 11 Nov 2014
Notebook PC growth was primarily driven by the developed regions of North America and Western Europe, which increased year-over-year shipments by more than 20 percent in the third quarter.

European 3D TSV Summit 2015: Keynote speakers announced

Wed, 11 Nov 2014
This week, SEMI announced the keynote speakers for the third edition of the European 3D TSV Summit, event that will take place on January 19-21, 2015 in Grenoble, France.

North American book-to-bill report shows equipment order activity has moderated

Fri, 11 Nov 2014
North America-based manufacturers of semiconductor equipment posted $1.10 billion in orders worldwide in October 2014 (three-month average basis) and a book-to-bill ratio of 0.93, according to the October EMDS Book-to-Bill Report published today by SEMI.

SEMICON Korea focuses on breaking through the limitations of semiconductor technology

Mon, 12 Dec 2014
Over 500 exhibiting companies from 20 countries and more than 40,000 attendees are expected to attend SEMICON Korea 2015, to be held February 4-6 at COEX in Seoul.

Semiconductor equipment sales forecast: $38B in 2014 to nearly $44B in 2015

Tue, 12 Dec 2014
SEMI projects that worldwide sales of new semiconductor manufacturing equipment will increase 19.3 percent to $38.0 billion in 2014, according to the SEMI Year-end Forecast, released today at the annual SEMICON Japan exposition.

SEMI Industry Strategy Symposium to focus on changing supply chain ecosystem and directions for growth

Wed, 12 Dec 2014
Microelectronics industry executives will convene at the SEMI Industry Strategy Symposium (ISS) on January 11-14 to discuss “Riding the Wave of Silicon Magic.”

What to expect from the 3rd Edition of the European 3D TSV Summit

Thu, 12 Dec 2014
Interview with SEMI Europe’s Yann Guillou gives attendees a preview of the event.

Veeco completes acquisition of Solid State Equipment Holdings LLC

Mon, 12 Dec 2014
Veeco Instruments Inc. announced that it has acquired privately held Solid State Equipment Holdings LLC (“SSEC”), based in Horsham, Pennsylvania.

SEMI reports third quarter 2014 worldwide semiconductor equipment figures

Tue, 12 Dec 2014
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 8.82 billion in the third quarter of 2014.

TSMC recognizes outstanding suppliers at Supply Chain Management Forum

Tue, 12 Dec 2014
TSMC held its 14th annual Supply Chain Management forum on December 4, 2014 to show appreciation for the support and contributions of its suppliers in 2014, and to recognize nine outstanding equipment and materials suppliers.

John Neuffer named president and CEO of SIA

Thu, 12 Dec 2014
The Semiconductor Industry Association (SIA) announced that John Neuffer has been named president & CEO of the association.

Global Semiconductor Alliance announces 2014 Award recipients

Fri, 12 Dec 2014
GSA members identified the Most Respected Public Semiconductor Company Award winners by casting ballots for the industry’s most respected companies for its products, vision and future opportunities.

Murata completes acquisition of Peregrine Semiconductor

Fri, 12 Dec 2014
Murata Electronics North America, Inc. and Peregrine Semiconductor Corporation, founder of RF silicon on insulator (SOI) and pioneer of advanced RF solutions, today announce that Murata has acquired all outstanding shares of Peregrine.

Worth the detour: European 3D TSV Summit 2015 offers new outlooks on 2.5 and 3D technology

Tue, 12 Dec 2014
With just over a month left to go, industry experts are looking forward to the third edition of the European 3D TSV Summit (Jan 19-21, 2015 in Grenoble, France), this year focusing on “Enabling Smarter Systems.”

Amkor Technology licenses proprietary copper pillar wafer bump technology to GLOBALFOUNDRIES

Tue, 12 Dec 2014
Amkor Technology, Inc., a provider of semiconductor assembly and test services, today announced that it has granted GLOBALFOUNDRIES a non-exclusive license to its proprietary copper pillar wafer bump technology.

Book-to-bill climbs above parity in November

Thu, 12 Dec 2014
North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.

The ConFab 2015: Time for collaboration

Tue, 12 Dec 2014
The future of the semiconductor industry continues to shine brightly.

European 3D TSV Summit 2015: What business for 3D smart systems?

Tue, 1 Jan 2015
SEMI Europe will ring in the New Year by holding the first major, international 3D TSV event of 2015. On January 19-21, members of the 3D TSV industry will convene in Grenoble, France for the 3rd edition of the European 3D TSV Summit.

SEMICON West 2015: “Call for Papers” for Semiconductor Technology Symposium and TechXPOTs

Wed, 1 Jan 2015
SEMI today announced a “Call for Papers” for SEMICON West, North America’s premier microelectronics event, to be held July 14-16 at the Moscone Center in San Francisco, Calif.

New secondary fab equipment market report available from SEMI

Fri, 1 Jan 2015
With new cost-sensitive semiconductor devices driving capacity demand, 200mm wafer size and currently existing (legacy) fabs are seeing a renaissance, SEMI completed a thorough study of the secondary fab equipment market to identify the market size and to capture key trends and issues impacting this industry segment.

IHS identifies technologies to transform the world over next five years

Mon, 1 Jan 2015
The Internet of Everything, cloud computing/big data and 3-D printing are the three technologies most likely to transform the world during the next five years, according to IHS Technology.

Mentor Graphics acquires Flexras Technologies

Tue, 1 Jan 2015
The Flexras timing-driven partitioning technology will expand and strengthen the portfolio of tools available from Mentor to help engineers overcome the challenges of increasingly complex design prototyping.

Further growth seen for semiconductor equipment and materials at SEMI ISS 2015

Wed, 1 Jan 2015
The SEMI Industry Strategy Symposium (ISS) opened yesterday with the theme “Riding the Wave of Silicon Magic.”

Orbotech announces collaboration between SPTS and Fraunhofer on process development of wafer level packaging

Thu, 1 Jan 2015
Orbotech Ltd. today announced that SPTS Technologies is collaborating with Fraunhofer IZM, an international institute specializing in applied and industrial contract research, on next generation wafer level packaging of microelectronic devices.

Amkor Technology announces settlement with Tessera

Thu, 1 Jan 2015
Amkor Technology, Inc. today announced the settlement of its outstanding litigation and arbitration proceedings with Tessera, Inc.

Will new policy in China trigger big changes?

Wed, 1 Jan 2015
In June 2014, the State Council of China issued the "National Guideline for the Development and Promotion of the IC Industry,” to support the domestic semiconductor industry. The document addresses development targets, approaches, and measures.

North American semiconductor equipment industry posts December 2014 book-to-bill ratio of 0.98

Mon, 1 Jan 2015
North America-based manufacturers of semiconductor equipment posted $1.37 billion in orders worldwide in December 2014 (three-month average basis) and a book-to-bill ratio of 0.98, according to the December EMDS Book-to-Bill Report published today by SEMI.

2014 was bumper year for automotive semiconductors

Tue, 1 Jan 2015
The automotive semiconductor market did exceptionally well in 2014, according to new analysis from IHS.

New MES operations improvement software from critical manufacturing features integrated scheduling

Wed, 1 Jan 2015
Critical Manufacturing, a supplier of integrated manufacturing execution systems (MES), introduces cmNavigo 4.0, the industry’s first comprehensive MES software with embedded finite scheduling.

Gov. Baker announces $4M grant to UMass Lowell to fuel emerging printed electronics cluster

Thu, 1 Jan 2015
Gov. Charlie Baker today announced a $4 million dollar grant from the Massachusetts Technology Collaborative (“MassTech”) to UMass Lowell to support development of a printed and flexible electronics industry cluster, an emerging field that has the potential to become a $76 billion global market in the next decade.

SEMICON Korea opens tomorrow: Korea IC manufacturing fueled by memory and mobility

Tue, 2 Feb 2015
SEMICON Korea 2015 at COEX in Seoul opens tomorrow with more than 500 exhibiting companies and an expected 40,000 attendees.

The CMOS image sensors industry is about to change, with major investment in manufacturing & design

Tue, 2 Feb 2015
Driven by mobile and automotive applications, the CIS industry is expected to grow at a CAGR of 10.6 percent from 2014 – 2020.

Spansion and XMC expand partnership to jointly develop 3D NAND

Mon, 2 Feb 2015
Spansion Inc. and XMC, China's fastest growing 300mm semiconductor foundry, today announced that the two companies will work together to develop and manufacture 3D NAND technology.

Qualcomm and China's National Development and Reform Commission reach resolution

Mon, 2 Feb 2015
Qualcomm Incorporated today announced that it has reached a resolution with China's National Development and Reform Commission (NDRC) regarding the NDRC's investigation of Qualcomm under China's Anti-Monopoly Law.

Mentor Graphics launches broadest embedded systems solution for industrial automation

Mon, 2 Feb 2015
Mentor Graphics Corporation today announced the embedded systems industry's broadest portfolio for industrial automation.

Strategy is key differentiator as more efficient GaN, SiC power electronics enter market

Tue, 2 Feb 2015
Power electronics based on gallium nitride (GaN) and silicon carbide (SiC) have the potential to significantly improve efficiency. But since these materials are higher-cost, companies need market-specific strategies in order to succeed as these new wide-bandgap (WBG) materials claim market share from silicon-based semiconductors, according to Lux Research.

Silicon wafer shipments reach record levels in 2014

Wed, 2 Feb 2015
Worldwide silicon wafer area shipments increased 11 percent in 2014 when compared to 2013 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

Amkor Technology names Susan Kim to Board of Directors

Wed, 2 Feb 2015
Amkor Technology, Inc. today announced that Susan Y. Kim has been appointed as a new member of the Company’s Board of Directors.

Samsung announces mass production of industry’s first 14nm finFET mobile application processor

Tue, 2 Feb 2015
Samsung Electronics Co., Ltd. announced that it has begun mass production of industry’s first mobile application processor using the advanced 14-nanometer (nm) FinFET process technology.

China's semiconductor investment plans focus of SEMICON China 2015

Thu, 2 Feb 2015
China's new industry investment and government promotion policies outlined in the recent "National Guidelines for Development and Promotion of the IC Industry" represents major opportunities for China and global semiconductor companies.

Mentor Graphics announces call for entries for Don Miller Award for Thermo-Fluid Design Excellence

Thu, 2 Feb 2015
Mentor Graphics Corporation today announced the call-for-entries for its first annual Don Miller Award for Excellence in System Level Thermo-Fluid Design.

Micron appoints Robert Peglar as Vice President of Advanced Storage Solutions

Thu, 2 Feb 2015
Micron Technology, Inc. today announced that Robert Peglar has been named as vice president of Advanced Storage Solutions.

January 2015 book-to-bill supports positive outlook for semiconductor equipment industry

Fri, 2 Feb 2015
A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

Fan-Out Wafer Level Packaging: With a $200M market in 2015, Yole is expecting 30% CAGR in the coming years

Tue, 2 Feb 2015
“Fan-Out Wafer Level Packaging (FOWLP) is already in high-volume” announces Yole Développement (Yole) in its new report, Fan-Out and Embedded Die: Technologies & Market. According to Yole’s analysts, FOWLP market reaches almost $200M in 2015.

Penang to host inaugural SEMICON Southeast Asia

Wed, 2 Feb 2015
The inaugural SEMICON Southeast Asia, will run from 22–24 April at the Subterranean Penang International Convention and Exhibition Centre (SPICE) in Penang, Malaysia.