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Industry sustainability efforts mount with III-Vs and other advanced technologies

Thu, 6 Jun 2014
The introduction of new materials, such as III-Vs, into high-volume manufacturing of semiconductors, likely will occur sometime around the 7nm and/or 5nm nodes.

450mm transition toward sustainability: Facility and infrastructure requirements

Thu, 6 Jun 2014
Design and construction professionals are showing unprecedented levels of collaboration through the G450C.

SPTS and CEA-Leti/Nanoelec collaborate on 3D-TSV

Tue, 6 Jun 2014
SPTS Technologies, a manufacturer of etch, deposition and thermal processing equipment for the semiconductor industry, today announced that it has signed an agreement with CEA-Leti in Grenoble, France, to develop 3D-TSV technologies.

Bookings and billings maintain a consistent pace in May 2014

Fri, 6 Jun 2014
North American semiconductor equipment industry posts May 2014 book-to-bill ratio of 1.00.

Gopal Rao at The ConFab: Scaling isn’t enough anymore

Wed, 6 Jun 2014
The core element of the semiconductor industry’s roadmap has been scaling – but Gopal Rao believes that isn’t enough anymore.

Internet of Things: big numbers, many opportunities

Thu, 7 Jul 2014
Whatever forecast one uses for the future of the Internet of Things in terms of connected objects or business opportunities, the IoT will be big.

SEMI and Solid State Technology announce the 2014 “Best of West” Award finalists

Tue, 7 Jul 2014
Each year at SEMICON West, the largest and most influential microelectronics exposition in North America, the “Best of West” awards are presented by Solid State Technology and SEMI. The award was established to recognize contributors moving the industry forward with their technological developments in the microelectronics supply chain.

IBM announces $3B research initiative

Tue, 7 Jul 2014
IBM announced it is investing $3 billion over the next 5 years in two broad research and early stage development programs to push the limits of chip technology needed to meet the emerging demands of cloud computing and Big Data systems.

VCs still investing in semiconductor technology, but need strategic partners and capital efficiency

Thu, 7 Jul 2014
Investors are still looking for differentiated technologies that solve high-value problems in semiconductor manufacturing, or that bring semiconductor technology to disruptive applications in other fields, particularly in the medical and environmental sectors

Fusion bonding for next-generation 3D-ICs

Thu, 7 Jul 2014
Recent developments in wafer bonding technology have demonstrated the ability to achieve improved bond alignment accuracy.

Can lean innovation bring growth and profits back to semiconductors?

Fri, 7 Jul 2014
New approaches to start-ups can unlock mega-trend opportunities.

SMIC and JCET establish a joint venture

Fri, 8 Aug 2014
Semiconductor Manufacturing International Corporation and Jiangsu Changjiang Electronics Technology Co., Ltd. announced today the formation of a joint venture for 12-inch bumping and related testing, from the previously signed joint venture agreement, which will be established in Jiangyin National High-Tech Industrial Development Zone (JOIND), in Jiangsu Province, China.

STATS ChipPAC’s fcCuBE technology surpasses 100 million unit milestone

Wed, 8 Aug 2014
STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, announced today that it has shipped over 100 million semiconductor packages with the company’s fcCuBE technology, advanced flip chip packaging with fine pitch copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and enhanced assembly processes.

Intel releases new packaging, test technologies for 14nm foundries

Wed, 8 Aug 2014
Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies.

GaAs device market posts record revenues in 2013

Fri, 9 Sep 2014
Ongoing growth in cellular and Wi-Fi applications will continue to drive GaAs device revenues higher.

10nm success depends on concurrent design and development

Mon, 9 Sep 2014
The Prophets of Doom greet every new process node with a chorus of dire warnings about the end of scaling, catastrophic thermal effects, parasitics run amok and . . . you know the rest.

Rigorously tuned compact models: Extending predictive models to full-chip

Tue, 9 Sep 2014
Fast and predictive 3D resist compact models are needed for OPC applications. A methodology to build such models is described, starting from a 3D bulk image, and including resist interface effects such as diffusion.

Global shutter image sensors

Tue, 9 Sep 2014
Different GS pixel architectures and technologies are presented and performances compared.

Equipment spending shows strong growth for 2014 and 2015

Wed, 9 Sep 2014
Front End fab equipment spending is projected to increase up to another 20 percent in 2015 to US$ 42 billion.

The semiconductor industry: Out in front, but lagging behind

Wed, 9 Sep 2014
Capital equipment suppliers must provide advanced analytical systems that leverage data generated by their tools to help their fab customers address the challenges of Big Data and advanced analytics.

Outlook: Healthy equipment spending into 2015

Wed, 9 Sep 2014
The general consensus for the semiconductor industry is for this year’s positive trend to continue into 2015 as both revenue growth and unit shipment growth are expected to be in the mid- to high- single digit range.

Rudolph introduces new acoustic metrology and defect inspection technology

Thu, 9 Sep 2014
Rudolph Technologies has introduced its new SONUS Technology for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs).

NANIUM launches the industry’s largest WLCSP in volume production

Tue, 9 Sep 2014
NANIUM today announced it has successfully launched the industry’s largest Wafer-Level Chip Scale Package (WLCSP) in volume.

Europe: Strong growth in chip equipment spending in 2015

Mon, 10 Oct 2014
Global capital spending on semiconductor equipment is projected to grow 21.1 percent in 2014 and 21.0 percent in 2015.

Adoption of SiC & GaN to directly impact the power electronics industry

Mon, 10 Oct 2014
Emergence of new wide bandgap (WBG) technologies such as SiC and GaN materials will definitely reshape part of the established power electronics industry, according to Yole Développement (Yole).

Global semiconductor sales continue to climb in August

Mon, 10 Oct 2014
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $28.4 billion for the month of August 2014.

SEMI announces rising annual silicon wafer shipment forecast

Tue, 10 Oct 2014
SEMI recently completed its annual silicon shipment forecast for the semiconductor industry. This forecast provides an outlook for the demand in silicon units for the period 2014-–2016.

Samsung to invest $14.7B in new semiconductor fab

Tue, 10 Oct 2014
Samsung Electronics announced plans on Monday to invest $14.7 billion (15.6 trillion Korean won) in a new semiconductor fabrication facility in Pyeongtaek, South Korea.

Altera CEO John Daane to receive Robert N. Noyce Award

Wed, 10 Oct 2014
The Semiconductor Industry Association announced that John P. Daane, President, CEO, and Chairman of the Board of Altera, has been named the 2014 recipient of SIA's highest honor, the Robert N. Noyce Award.

Threshold voltage tuning for 10nm and beyond CMOS integration

Mon, 10 Oct 2014
A novel metal gate integration scheme to achieve precise threshold voltage (VT) control for multiple VTs is described.

Semiconductor market in India is expected to reach US$ 52.58B by 2020

Tue, 10 Oct 2014
India has a very large industry base of electronics items, but there is little manufacturing base for semiconductors.

The mystery of reed relays: Understanding specifications

Wed, 10 Oct 2014
Specifications of reed relays, which are used for current switching in ATE and other applications are explained, including carry current, lifetime, minimum switch capacity, hot switching, operating speed and thermoelectric switching.

Growing momentum in semiconductor manufacturing in Vietnam

Fri, 10 Oct 2014
The 2nd annual SEMI Vietnam Semiconductor Strategy Summit, co-organized with the Saigon Hi-Tech Park and with FabMax as the premier sponsor, was held September 16-17, 2014 in Ho Chi Minh City.

IBM to pay GlobalFoundries $1.5B to take over chip fabs

Mon, 10 Oct 2014
IBM and GLOBALFOUNDRIES today announced that GLOBALFOUNDRIES will acquire IBM's global commercial semiconductor technology business.

Mergers, acquisitions reshape the automotive semi supplier landscape

Wed, 10 Oct 2014
Capped by last week’s announcement that Qualcomm Inc. would buy CSR PLC, the automotive semiconductor industry recently has been undergoing a wave of merger and acquisition (M&A) activity that has shaken up the competitive order of the market.

TI to open 300mm wafer bumping facility in Chengdu, China

Thu, 11 Nov 2014
Chengdu assembly/test facility now in production; site celebrates grand opening

Double-digit growth: Record sales to shake up Top 20 semi supplier ranking

Mon, 11 Nov 2014
TSMC, MediaTek, and SK Hynix’s sales are each expected to jump by >20% this year.

Intel CEO Brian Krzanich elected chairman of Semiconductor Industry Association

Thu, 11 Nov 2014
The Semiconductor Industry Association (SIA) today announced that the SIA board of directors has elected Brian Krzanich, CEO of Intel, as its 2015 chairman and Dr. Necip Sayiner, president, CEO and director of Intersil, as its 2015 vice chairman.

TSV integration is creating growth and significant interest in the equipment and materials industry

Tue, 11 Nov 2014
The materials market will grow from $789M in 2013 to over $2.1B with a CAGR of 18%.

Slideshow: IEDM 2014 Preview

Wed, 11 Nov 2014
Browse for an advance look at some of the most newsworthy topics and papers to be presented at the 60th annual meeting, to be held at the Hilton San Francisco Union Square Hotel from December 15-17, 2014.

TSV based memory going to volume production: the era of 3DIC finally begins

Mon, 12 Dec 2014
With the recent Samsung announcement of mass production of 64 GB DDR4 DIMMs that use TSV technology for enterprise servers and cloud-based applications, all three of the major DRAM memory manufactures, Samsung, Hynix and Micron, have now announced the commercialization of TSV based memory architectures.

Cypress and Spansion to merge in $4B all-stock transaction

Wed, 12 Dec 2014
Cypress Semiconductor Corp. and Spansion, Inc. this week announced a definitive agreement to merge in an all-stock, tax-free transaction valued at approximately $4 billion.

Global semiconductor sales increase in October; Substantial growth projected for 2014

Wed, 12 Dec 2014
The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $29.7 billion for the month of October 2014, an increase of 9.6 percent from the October 2013 total.

3D TSV begins

Wed, 12 Dec 2014
“Engineering samples have already started to ship and preparation is on-going for entering volume manufacturing,” announces Yole.

Innovation in the shadow of volcanic change

Tue, 12 Dec 2014
The semiconductor equipment and materials industry is currently enjoying a double-digit annual growth rate and good prospects looking forward to 2015.

Process Watch: Fab managers don’t like surprises

Thu, 12 Dec 2014
Nobody likes surprises - especially the managers of $10 billion factories.

The most expensive defect

Thu, 12 Dec 2014
Defects that aren’t detected inline cost fabs the most.

IoT's divergent needs will drive different types of technologies

Fri, 12 Dec 2014
Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical.

Global semiconductor market set for strongest growth in four years in 2014

Tue, 12 Dec 2014
Worldwide semiconductor market revenue is on track to achieve a 9.4 percent expansion this year, with broad-based growth across multiple chip segments driving the best industry performance since 2010.

DRAM capacity rises from slump; Sector faces new challenges

Mon, 1 Jan 2015
SEMI today announced details from the SEMI World Fab Forecast Report illuminating the state of the semiconductor manufacturing industry, coincident with convening SEMI’s Industry Strategy Symposium (ISS) in Half Moon Bay, Calif.

Underdog DRAM

Tue, 1 Jan 2015
DRAM shifts out of a slump, but sector still faces obstacles.

2015 outlook: Tech trends and drivers

Tue, 1 Jan 2015
Leading industry experts provide their perspectives on what to expect in 2015. 3D devices and 3D integration, rising process complexity and “big data” are among the hot topics.

Global semiconductor industry posts record sales in 2014

Mon, 2 Feb 2015
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that the global semiconductor industry posted record sales totaling $335.8 billion in 2014, an increase of 9.9 percent from the 2013 total of $305.6 billion.

Processing of graphene on 300mm Si wafers in a state-of-the-art CMOS fabrication facility

Tue, 2 Feb 2015
The building blocks are described that can be used to fabricate other novel device architectures that can take advantage of the unique properties of graphene or other interesting single-layer (i.e., 2D) materials.

Applied's merger with TEL: Still a work in progress

Wed, 2 Feb 2015
Applied Materials on Wednesday reported that its proposed merger with Tokyo Electron Ltd. (TEL) is still under way, without giving a deadline or expected date of conclusion.

Process Watch: The most expensive defect - Part 2

Thu, 7 Jul 2015
The December 2014 edition of Process Watch suggested that the most expensive defect is the one that goes undetected until the end of line. Indeed, undetected excursions typically result in the scrap of millions of dollars per year of defective semiconductor chips.

Freescale and NXP agree to $40 Billion merger

Tue, 3 Mar 2015
Chipmaker NXP Semiconductors NV announced Sunday night that it has agreed to buy Freescale Semiconductor Ltd for $11.8 billion and merge business operations.

Strong fab equipment spending expected in 2015; Slowing but positive 2016

Tue, 3 Mar 2015
SEMI today announced an update of the SEMI World Fab Forecast report which updates outlooks for 2015 and 2016.

11 IC product categories to exceed total IC market growth in 2015

Thu, 3 Mar 2015
IC Insights’ March Update to the 2015 McClean Report (being released later this month) refreshes the forecasts for 33 major IC product categories through 2019.

Cypress and Spansion complete $5 Billion merger

Fri, 3 Mar 2015
Cypress Semiconductor Corp. and Spansion, Inc. announced that they have closed the merger of the two companies in an all-stock, tax-free transaction valued at approximately $5 billion.

NXP-Freescale merger to result in world's eighth largest chip maker

Wed, 3 Mar 2015
The recent acquisition of Freescale Semiconductor by NXP Semiconductors would catapult the merged entity into the world’s eighth-largest chipmaker, positioning the newly minted giant for an even more formidable presence in key industrial sectors, according to IHS.

Supplier Hub answers the needs of a changing semiconductor industry

Thu, 4 Apr 2015
Supplier Hub answers the needs of a changing semiconductor industry.

Imaging tomorrow’s components, acoustically

Thu, 4 Apr 2015
Packages are changing. Acoustic methods provide a way to image and analyze them.

Consider packaging requirements at the beginning, not the end, of the design cycle

Thu, 4 Apr 2015
Consider these eight issues where the packaging team should be closely involved with the circuit design team.

Fifty years of Moore's Law made possible by semiconductor equipment and materials suppliers worldwide

Tue, 4 Apr 2015
April 2015 marks the 50th anniversary of one of the business world’'s most profound drivers, now commonly referred to as Moore's Law.

Top 10 2015 semiconductor sales leaders forecast to include NXP/Freescale

Fri, 4 Apr 2015
Total top 10 marketshare of semiconductor industry now back over 50 percent.

Global semiconductor market achieves strong, broad-based growth in 2014

Mon, 4 Apr 2015
Highest annual growth rate since 2010; strong growth expected again in 2015.

ITRS 2.0: Heterogeneous integration

Wed, 5 May 2015
Interconnecting transistors and other components in the IC, in the package, on the printed circuit board and at the system and global network level, are where the future limitations in performance, power, latency and cost reside.

TI strengthens analog marketshare; Skyworks gains from Apple's favor

Mon, 5 May 2015
Top 10 suppliers accounted for 57% of analog sales in 2014; 9 of 10 top suppliers with analog sales greater than $1.0 billion.

IBM's silicon photonics technology ready to speed up cloud and Big Data applications

Tue, 5 May 2015
IBM today announced a significant milestone in the development of silicon photonics technology, which enables silicon chips to use pulses of light instead of electrical signals over wires to move data at rapid speeds and longer distances in future computing systems.

Moore's Law to keep on 28nm

Wed, 5 May 2015
Scaling is now bifurcating - some scaling on with 28/22nm, while other push below 14nm.

Process Watch: Time is the enemy of profitability

Thu, 5 May 2015
There are three main phases to semiconductor manufacturing: research and development (R&D), ramp, and high volume manufacturing (HVM). All of them are expensive and time is a critical element in all three phases.

3D NAND, MRAM, RRAM: Emerging opportunities and challenges for the changing memory market

Thu, 5 May 2015
Ever growing volumes of data to be stored and accessed, and advancing process technologies for sophisticated control of deposition and etch in complex stacks of new materials, are creating a window of opportunity for an emerging variety of next-generation non-volatile memory technologies.

North America: A critical player in the advanced semiconductor market

Mon, 6 Jun 2015
As the fabless business model has transformed the semiconductor manufacturing landscape, Taiwan and South Korea have undeniably grown into key semiconductor producing regions. However, it should be noted that North America is home to Intel, Texas Instruments, Micron, GLOBALFOUNDRIES, Freescale, Fairchild, Microchip, ON Semiconductor, significant operations of Samsung, and other manufacturers.

Fab equipment growth continues into 2015

Thu, 6 Jun 2015
Fab equipment spending is forecast to depart from the typical historic trend over the past 15 years of two years of spending growth followed by one of decline. For the first time, equipment spending could grow every year for three years in a row: 2014, 2015, and 2016.

Move over, 16nm – here comes 10nm chips

Mon, 6 Jun 2015
Taiwan Semiconductor Manufacturing wants you to know that they’re ready, willing, and able to help you design chips with 10-nanometer features.

Drive profitability through better forecasting

Wed, 6 Jun 2015
Different forecasting algorithms are highlighted and a framework is provided on how best to estimate product demand using a combination of qualitative and quantitative approaches.

More change for the chip industry

Thu, 6 Jun 2015
As if scaling to 7nm geometries and going vertical with FinFETs, TSVs and other emerging technologies wasn’t challenge enough, the emerging market for connected smart devices will bring more changes to the semiconductor sector. And then there’s 3D printing looming in the wings.

“Easy does it” ─ Fabs trim spending plans

Fri, 6 Jun 2015
Still capex and equipment spending expected to increase in 2015 and 2016.

IC manufacturers close or repurpose 83 wafer fabs from 2009-2014

Wed, 6 Jun 2015
150mm and 200mm wafer fabs account for two-thirds of total closures.

IHS says Moore's Law led to trillions of dollars added to global economy

Fri, 6 Jun 2015
From connectivity to globalization and sustainability, the “Law” created by Gordon Moore’s prediction for the pace of semiconductor technology advances has set the stage for global technology innovation and contribution for 50 years.

Technology innovation is driving fan-in wafer level packaging adoption with more and more applications

Mon, 6 Jun 2015
Fan-in WLP is experiencing continuous growth and attracting new applications, according to Yole Développement's latest report “Fan-in Wafer Level Packaging: Market & Technology Trends."

Power transistors seen stabilizing and setting record sales in 2015

Thu, 6 Jun 2015
After six years of gyrating between strong increases and sales declines, the power transistor business is returning to more normal growth patterns.

What chipmakers will need to address growing complexity, cost of IC design and yield ramps

Mon, 6 Jun 2015
As these early days of the Internet of Things show the network’s promise and reveal technological challenges that could threaten its ability to meet user expectations in the years ahead, technology providers will be charged with supplying the solutions that will meet those challenges.

Building a better semiconductor

Mon, 6 Jun 2015
Research led by Michigan State University could someday lead to the development of new and improved semiconductors.

GLOBALFOUNDRIES completes acquisition of IBM Microelectronics business

Wed, 7 Jul 2015
GLOBALFOUNDRIES today announced that it has completed its acquisition of IBM’s Microelectronics business.

Process Watch: Increasing process steps and the tyranny of numbers

Mon, 7 Jul 2015
Moving to the next design rule can be stressful for the inspection and metrology engineer. Like everything else in the fab, process control generally doesn’t get any easier as design rules shrink and new processes are introduced.

IBM Research alliance produces industry's first 7nm node test chips

Thu, 7 Jul 2015
IBM Research today announced that working with alliance partners at SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE) it has produced the semiconductor industry’s first 7nm (nanometer) node test chips with functional transistors.

IoT platform, Silicon Impulse, energy efficiency and consumer applications focus of LetiDays discussion

Thu, 7 Jul 2015
Smart devices for the Internet of Things are among the top three growth drivers for the semiconductor industry, but the IoT is a highly fragmented market where multiple applications have varying energy requirements.

Substrate innovation for extending Moore and more than Moore

Fri, 7 Jul 2015
Engineered SOI substrates are now a mainstream option for the semiconductor industry.

GLOBALFOUNDRIES launches industry's first 22nm FD-SOI technology platform

Mon, 7 Jul 2015
GLOBALFOUNDRIES today launched a new semiconductor technology developed specifically to meet the ultra-low-power requirements of the next generation of connected devices.

Controlling measurements of WLP on high mix, high volume manufacturing

Tue, 7 Jul 2015
The demand for 4-mask layer Cu-plated wafer-level chip scale packaging (WLCSP) is increasing rapidly, and the current capability for in-line Cu height measurements is not suitable for high volume manufacturing (HVM).

Chinese chipmaker Tsinghua prepares $23B bid for Micron Technology

Tue, 7 Jul 2015
China’s state-owned Tsinghua Unigroup Ltd. is preparing a $23 billion bid for chipmaker Micron Technology, in what analysts say would be the biggest Chinese takeover of a U.S. company.

Inspection smooths a bumpy road

Thu, 7 Jul 2015
Wafer bumping has several advantages over traditional wire bonding. Bumps can be placed almost anywhere on the die, where wire bonding is limited to the periphery of the devices. And bumps give you the ability to put many more I/O points on an individual die.

Opportunities in packaging are driving photolithography equipment demand

Mon, 7 Jul 2015
Within the photolithography equipment market reaching $150M in 2014, advanced packaging applications experienced the strongest growth.

Tsunami of M&A deals underway in the semiconductor industry in 2015

Wed, 7 Jul 2015
Marketshare expansion, Internet of Things opportunities, rising costs of R&D, and China’s aggressive new focus on the semiconductor industry all driving the recent M&A surge.

SEMICON West: The road forward is 3DIC

Fri, 7 Jul 2015
SEMICON West 2015 had a strong and rich undercurrent – the roadmap forward is most certainly 3DIC.

Samsung 3D TSV stacked DDR4 DRAM: the first analyzed memory product with via- middle TSV

Fri, 7 Jul 2015
According to Yole, 3D TSV technology is expected to reach $4.8B billion in revenues by 2019.

Mid-year global semiconductor sales ahead of last year's pace by 4 percent

Mon, 8 Aug 2015
The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $84.0 billion during the second quarter of 2015, an increase of 1.0 percent over the previous quarter and 2.0 percent compared to the second quarter of 2014.

Samsung cuts Intel's semiconductor sales lead to 16% in second quarter

Thu, 8 Aug 2015
Samsung’s excellent growth rate in 2Q15 put the company closer to catching Intel and becoming the world’s leading semiconductor supplier.

CMOS image sensors see higher growth from diversity of uses

Wed, 8 Aug 2015
Dependency on camera phones lessens as imaging technology moves into a wider range of systems -- from automotive and machine vision to surveillance and sensors for Internet of Things.

Comparison 1Y nanometer NAND architecture and beyond

Mon, 8 Aug 2015
Do we still think the 2D NAND Flash technologies have hit the scaling wall?

Small electronics companies spent $78.3B on semiconductors in 2014

Fri, 8 Aug 2015
Startups and small electronics companies spent $78.3 billion on semiconductors in 2014, representing 23 percent of the total market, compelling semiconductor companies to revisit their sales strategy to focus on the large number of smaller organizations than relying on big deals from large customers, research firm Gartner said.

New AMS fab going to Marcy, NY

Thu, 8 Aug 2015
Austria-based ams AG, formerly known as Austriamicrosystem, announced plans to locate a new 360,000 ft2 fab in upstate New York at the Nano Utica site in Marcy, NY.

Asia-Pacific to dominate IC sales across system categories in 2015

Fri, 9 Sep 2015
Europe to remain largest regional market for auto ICs, but Asia-Pacific gaining fast.

Global semiconductor sales down slightly in July

Fri, 9 Sep 2015
Softening demand, currency devaluation lead to slower sales.

Slideshow: 2015 IEDM Preview

Tue, 10 Oct 2015
An advance look at some of the most newsworthy topics and papers that will be presented at this year's IEEE International Electron Devices Meeting.

S3S - the conference for IoT technologies

Fri, 9 Sep 2015
The upcoming IEEE S3S Conference 2015 in Sonoma, CA, on October 5-8, will focus on key technologies for the IoT era.

Process Watch: Risky business

Fri, 9 Sep 2015
This is the ninth in a series of 10 installments that explore certain fundamental truths about process control--defect inspection and metrology--for the semiconductor industry.

Dialog Semiconductor to acquire Atmel for $4.6 billion

Mon, 9 Sep 2015
Dialog Semiconductor and Atmel Corporation announced today that Dialog has agreed to acquire Atmel in a cash and stock transaction for total consideration of approximately $4.6 billion.

Permanent data storage with light

Thu, 9 Sep 2015
The first all-optical permanent on-chip memory has been developed by scientists of Karlsruhe Institute of Technology (KIT) and the universities of Münster, Oxford, and Exeter.

Lam Research to acquire KLA-Tencor

Wed, 10 Oct 2015
Lam Research Corporation (LRCX) and KLA-Tencor Corporation (KLAC) announced that they have entered into a definitive agreement for Lam Research to acquire all outstanding KLA-Tencor shares in a cash and stock transaction.

New NSF-SRC report on energy efficient computing

Thu, 10 Oct 2015
A report that resulted from a workshop funded by Semiconductor Research Corporation and National Science Foundation outlines key factors limiting progress in computing and novel device and architecture research that can overcome these barriers.

IDT to Acquire ZMDI for $310 Million

Tue, 10 Oct 2015
Integrated Device Technology, Inc. announced an agreement to acquire privately held ZMDI for total consideration of $310M in cash.

Sally L. Bixby joins Extension Media as Senior Events Director

Wed, 10 Oct 2015
Extension Media announced today the addition of Sally L. Bixby as Senior Events Director for Extension Media's fast-growing conference division.

Reports: TI, STMicro to add to semiconductor acquisitions spree

Fri, 10 Oct 2015
Texas Instruments (Maxim Integrated) and STMicro (Fairchild) may be considering large acquisitions.

China's Tsinghua Unigroup invests in Taiwan's Powertech

Tue, 11 Nov 2015
Tsinghua Unigroup Ltd., a Chinese government-owned chipmaker will make a $600 million investment in Powertech Technology of Taiwan, according to multiple reports.

It's all about packaging - in this material world, who is your partner?

Thu, 11 Nov 2015
With the emergence of the IoT (Internet of Things), advanced packaging is clearly the enabling technology providing solutions for mobile applications and for semiconductor devices fabricated at 16 nm and below process nodes.

Intel and ASM look to TCB

Tue, 11 Nov 2015
Is there any question that TCB is real and will be the next big bonding technology? The focus this month is more on this very important new assembly process from Intel and ASM.

Mobile sector continues to dominate the advanced packaging market; IoT looms on the horizon

Thu, 12 Dec 2015
Advanced packaging will reach 44% of packaging services and a revenue of US$ 30 billion by 2020.

Advanced lithography and electroplating approach to form high-aspect ratio copper pillars

Tue, 12 Dec 2015
It is possible to fabricate copper pillars more than 100μm in height, with aspect ratios up to 6:1, using advanced packaging stepper lithography in conjunction with electroplating.

Fab equipment spending: Look for upward swing into 2016

Wed, 12 Dec 2015
Worldwide semiconductor fab equipment capital expenditure growth (new and used) for 2015 is expected to be 0.5 percent (total capex of US$35.8 billion), increasing another 2.6 percent (to a total of $36.7 billion) in 2016, according to the latest update of the quarterly SEMI World Fab Forecast report.

Imec advances drive current in vertical 3D NAND memory devices

Wed, 12 Dec 2015
At this week’s IEEE IEDM conference, nano-electronics research center imec showed for the first time the integration of high mobility InGaAs as a channel material for 3D vertical NAND memory devices formed in the plug (holes) with the diameter down to 45nm.

2016 bounce to modest gains

Mon, 12 Dec 2015
After deflated 2015, 3D leads the way.

Advanced packaging industry: What's new on the market?

Wed, 1 Jan 2016
The mobile sector is driving production and market growth; however a new market driver, IoT is on the horizon and is expected to have a significant impact on the advanced packaging industry.

Advanced semiconductor packaging drives materials consumption through 2019

Tue, 12 Dec 2015
The $18 billion semiconductor packaging materials will undergo steady single-digit unit volume growth for many material segments through 2019, including laminate substrates, IC leadframes, underfill, and copper wire.

Koyanagi and Ramm win 3DIC Pioneering Award

Mon, 12 Dec 2015
At the 12th annual 3D ASIP [Architectures for Semiconductor Interconnect and Packaging] Conference, sponsored by RTI Int, in Redwood City CA last week, Professor Mitsumasa Koyanagi of Tohoku University and Dr. Peter Ramm of Fraunhofer EMFT were the conference's first recipients of the “3DIC Pioneer Award”.

A wild ride in 2015 - and two steps forward in 2016

Thu, 1 Jan 2016
“In like a lion, out like a lamb” is just half the story for 2015. While initial expectations forecasted a double-digit growth year, the world economy faded and dragged our industry down to nearly flat 2015/2014 results.

Worldwide semiconductor revenue declined 1.9% in 2015, Gartner reports

Fri, 1 Jan 2016
Worldwide semiconductor revenue totaled $333.7 billion in 2015, a 1.9 percent decrease from 2014 revenue of $340.3 billion, according to preliminary results by Gartner, Inc.

A Year in Review: A look back at the top stories from 2015

Mon, 1 Jan 2016
2015 was a year of unprecedented consolidation in the semiconductor industry, as well as a technological crossroads in Moore’s Law. Below is a round-up, based on reader popularity, of the most read stories on Solid State Technology from 2015.

Growing application of semiconductor ICs in the IoT driving global packaging and assembly equipment market

Thu, 1 Jan 2016
Technavio analysts forecast the global semiconductor packaging and assembly equipment market to post a CAGR of 4.7% by 2020, according to their latest report.

Yield and cost challenges at 16nm and beyond

Mon, 2 Feb 2016
A new 5D solution utilizes multiple types of metrology systems to identify and control fab-wide sources of pattern variation, with an intelligent analysis system to handle the data being generated.

Cautious expectations amid a slow-growth global economy

Thu, 2 Feb 2016
The health of the IC industry is increasingly tied to the health of the worldwide economy. Rarely can there be strong IC market growth without at least a “good” worldwide economy to support it.

Improved ion implant exhaust management reduces energy, capital costs

Tue, 2 Feb 2016
How Texas Instruments got greener, safer and saved money.

Semiconductor capital spending rebound fails to materialize in 2015

Tue, 2 Feb 2016
Recent capital spending trends indicative of maturing semiconductor industry.

FinFET technology market worth $35.12B by 2022

Thu, 2 Feb 2016
The FinFET technology market is expected to grow from $4.91 billion USD in 2015 to $35.12 billion by 2022, at a compound annual growth rate (CAGR) of 26.2% between 2016 and 2022.

Slow but positive 2016 followed by double digits in 2017

Thu, 3 Mar 2016
Front-end fab equipment spending (including new, used, and in-house) is projected to increase 3.7 percent in 2016 (to US$ 37.2 billion) and another 13 percent in 2017 (to $42.1 billion) according to most recent edition of the SEMI World Fab Forecast.

High-K precursors for ICs to reach ~$400M by 2020

Mon, 3 Mar 2016
Chemical precursors (inorganic and organic) used to form high dielectric constant (High-K) materials, metals and metal nitrides needed in advanced ICs are forecasted to reach $400M USD in global sales by 2020, as highlighted in TECHCET’s 2016 Critical Materials Report.

Process Watch: Reducing production costs with process control

Fri, 3 Mar 2016
Adding process control reduces production costs and cycle time.

Impact of triboelectric charging from DI water on transistor gate damage

Wed, 3 Mar 2016
Optimized settings for DI water pressure at CMP and careful analysis of interconnect layout are used to improve quality on a complex analog design.

Samsung starts mass producing industry's first 10nm class DRAM

Tue, 4 Apr 2016
Samsung Electronics Co., Ltd. announced today that it has begun mass producing the industry’s first 10-nanometer (nm) class, 8-gigabit (Gb) DDR4 (double-data-rate-4) DRAM chips and the modules derived from them.

Flip chip technology market worth $31.27B by 2022

Fri, 4 Apr 2016
The flip chip technology market is driven by factors such as increasing demand for miniaturization and high performance in electronic devices, and strong penetration in consumer electronics sector.

Packaging materials: Strong growth rates for small form factors

Wed, 4 Apr 2016
While much of the recent attention has been focused on the growth of wafer level packages (WLPs), specifically fan-out WLPs, this is not the only segment forecast to undergo strong unit growth.

14 IC product categories to exceed total IC market growth in 2016

Tue, 4 Apr 2016
Cellphone App MPUs and Signal Conversion top the list; Tablet MPU growth stalls, DRAM tumbles.

Many mixes to match litho apps

Fri, 4 Apr 2016
The world’s leading lithographers gather each year in San Jose, California at SPIE’s Advanced Lithography conference to discuss how to extend optical lithography. So of all the NGL technologies, which will win out in the end?

IEEE introduces new international roadmap for devices and systems to set the course for end-to-end computing

Wed, 5 May 2016
Together, this group will ensure alignment and consensus across a range of stakeholders to identify trends and develop the roadmap for all of the related technologies in the computer industry.

Global semiconductor sales increase slightly in March

Fri, 5 May 2016
The Semiconductor Industry Association (SIA) this week announced worldwide sales of semiconductors reached $26.1 billion for the month of March 2016, a slight increase of 0.3 percent compared to the previous month's total of $26.0 billion.

STATS ChipPAC's fan-out wafer level packaging shipments exceed 1 billion units

Wed, 5 May 2016
Reflects strong demand for eWLB in mobile market with accelerating adoption in Internet of Things, wearables, MEMS and automotive applications.

Worldwide semiconductor capital spending to decline 2 percent in 2016

Wed, 5 May 2016
Worldwide semiconductor capital spending is projected to decline 2 percent in 2016, to $62.8 billion, according to Gartner, Inc. This is up from the estimated 4.7 percent decline in Gartner's previous quarterly forecast.

Seven Top-20 semiconductor suppliers show double-digit declines

Thu, 5 May 2016
Qualcomm, Micron, and SK Hynix registered ≥25% drops, with total top-20 sales off by 6%.

IBM scientists achieve storage memory breakthrough

Wed, 5 May 2016
For the first time, scientists at IBM Research have demonstrated reliably storing 3 bits of data per cell using a relatively new memory technology known as phase-change memory (PCM).

Communications, computer systems drive IC sales across all regions

Wed, 5 May 2016
Automotive systems forecast to remain a major application in Europe and Japan.

Long-term strategy pays off as TI maintains analog leadership

Tue, 5 May 2016
Infineon, Skyworks Solutions move up, ST slips in shakeup of top analog suppliers of 2015.

An interview with Dr. Dongkai Shangguan

Wed, 6 Jun 2016
Dr. Dongkai Shangguan is currently the Chief Marketing Officer of STATS ChipPAC. Previously, Dongkai served as the founding CEO of the National Center for Advanced Packaging Co., Ltd. (“NCAP China”), worked for 10 years at Ford Motor Company in various technical and management functions, and for 11 years at Flextronics as Corporate Vice President of Global Advanced Technology.

Equipment spending up: 19 new fabs and lines to start construction

Fri, 6 Jun 2016
While semiconductor fab equipment spending is off to a slow start in 2016, it is expected to gain momentum through the end of the year. For 2016, 1.5 percent growth over 2015 is expected while 13 percent growth is forecast in 2017.

Changing markets drive smarter manufacturing by IC sector

Mon, 6 Jun 2016
The changing market for ICs means the end of business as usual for the greater semiconductor supply chain. Smarter use of data analytics looks like a key strategy to get new products more quickly into high yield production at improved margins.

What is driving the advanced packaging market in China?

Thu, 6 Jun 2016
Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach US$ 4.6 billion in 2020, against US$ 2.2 billion in 2015.

North American semiconductor equipment industry posts May 2016 book-to-bill ratio of 1.09

Fri, 6 Jun 2016
North America-based manufacturers of semiconductor equipment posted $1.75 billion in orders worldwide in May 2016 (three-month average basis) and a book-to-bill ratio of 1.09.

SEMI and Solid State Technology announce the 2016 "Best of West" award finalists

Tue, 6 Jun 2016
Each year at SEMICON West, the "Best of West" awards are presented by Solid State Technology and SEMI.

Process Watch: Process control and production cycle time

Fri, 6 Jun 2016
In the early stages of development, having more process control can help reduce both the number and duration of cycles-of-learning (the iterations required to solve a particular problem).

HITRS roadmap aims to integrate photonic devices in SiP

Wed, 6 Jun 2016
A new roadmap, the Heterogeneous Integration Technology Roadmap for Semiconductors (HITRS), aims to integrate fast optical communication made possible with photonic devices.

ASML president to receive Robert N. Noyce Award

Thu, 6 Jun 2016
Van den Brink will accept the award at the annual SIA Award Dinner on Thursday, Nov. 10 in San Jose, an event that will commemorate the 25thanniversary of the Noyce Award.

IoT and mobile devices: Big market opportunities but more challenges towards security threats

Tue, 7 Jul 2016
Assuring IoT security will require strategies to manage the entire value and supply chains.

Packaging and displays drive new litho requirements

Wed, 7 Jul 2016
Fan-out wafer level packaging (FOWLP) is gaining traction, leading to higher I/Os and larger formats, and new mobile displays are pushing the limits of pixel per inch (PPI) while also moving to larger formats.

Three-in-one tool speeds bump inspection

Tue, 7 Jul 2016
Last year, Rudolph Technologies, Inc. announced the widespread adoption and success of its newest macro defect inspection tool, the NSX 330 Series.

China’s final chance to achieve its IC industry ambitions now underway

Wed, 7 Jul 2016
Over the past 20 years, China has become increasingly frustrated over the gap between its IC imports and indigenous IC production

Global semiconductor sales increase in second quarter

Tue, 8 Aug 2016
The Semiconductor Industry Association today announced worldwide sales of semiconductors reached $79.1 billion during the second quarter of 2016, an increase of 1.0 percent over the previous quarter and a decrease of 5.8 percent compared to the second quarter of 2015.

What’s happening to Japan’s semiconductor industry?

Thu, 7 Jul 2016
The 2016 global semiconductor market is forecast to decrease by 2.4 percent from the previous year according to the World Semiconductor Trade Statistics (WSTS).

Second quarter 2016 silicon wafer shipments increase quarter-over-quarter; sets a new record

Wed, 7 Jul 2016
Worldwide silicon wafer area shipments increased during the second quarter 2016 when compared to first quarter 2016 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

DRAM on track to be worst-performing market in 2016

Thu, 8 Aug 2016
16% plunge in DRAM ASP expected to lead to 19% DRAM market decline.

Seven Top-20 semiconductor suppliers show double-digit gains in 2Q16

Mon, 8 Aug 2016
MediaTek and AMD register the fastest 2Q16/1Q16 growth rates of 32% and 23%, respectively.

Fan-Out Wafer Level Packaging: Breakthrough advantages and surmountable challenges

Tue, 8 Aug 2016
New wafer processing technologies overcome FOWLP’s technical hurdles, paving the way for a new generation of ultra compact, high I/O electronic devices.

TowerJazz and SMIC’s sales forecast to surge in 2016

Tue, 8 Aug 2016
Total pure-play foundry market expected to jump 9% this year, up from 6% growth in 2015.

Will fan-out packaging be sustainable long-term?

Tue, 8 Aug 2016
2016 is a turning point for the Fan-Out market since both leaders, Apple and TSMC, changed the game and may create a trend of acceptance of Fan-Out packages

MCU market forecast to reach record high revenues through 2020

Tue, 8 Aug 2016
After recent years of price erosion, MCU ASPs are forecast to rise and help lift sales to new highs.

Fab equipment spending ascending

Thu, 9 Sep 2016
Expect 4% growth (YoY) for 2016 and 11% for 2017

GLOBALFOUNDRIES extends FDX roadmap with 12nm FD-SOI technology

Thu, 9 Sep 2016
GLOBALFOUNDRIES today unveiled a new 12nm FD-SOI semiconductor technology, extending its leadership position by offering the industry's first multi-node FD-SOI roadmap.

Moore's Law did indeed stop at 28nm

Mon, 9 Sep 2016
As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

≤200mm semiconductor manufacturing is here to stay

Tue, 9 Sep 2016
Ted Shafer of ASML reports on the highlights from the ≤200mm manufacturing session during SEMICON West, organized by the SEMI Secondary Equipment and Applications Special Interest Group.

Solid State Technology announces expanded conference for The ConFab 2017

Wed, 9 Sep 2016
The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.

2016 a sequel to last year’s M&A mania

Wed, 9 Sep 2016
Value of semiconductor industry M&A agreements already over $50 billion this year.

Process Watch: Salami slicing your yield

Mon, 9 Sep 2016
The Process Watch series explores key concepts about process control -- defect inspection and metrology -- for the semiconductor industry. This new series of articles highlights additional trends in process control, including successful implementation strategies and the benefits for IC manufacturing.

Leading-edge leads the way in pure-play foundry growth

Wed, 9 Sep 2016
Sales of ICs built using <40nm process technology forecast to rise 23% at pure-play foundries.

Global semiconductor industry posts largest monthly sales increase in 3 years

Wed, 10 Oct 2016
August sales up 3.5 percent compared to July, increase year-to-year for first time in more than a year.

3D TSV is for the development of heterogeneous interconnection, high end memory and performance applications

Thu, 10 Oct 2016
This year again, both market segments, high end and low end, are the main targets of the TSV technologies providers.

Wafer shipments forecast to increase in 2016, 2017 and 2018

Thu, 10 Oct 2016
SEMI recently completed its annual silicon shipment forecast for the semiconductor industry. This forecast provides an outlook for the demand in silicon units for the period 2016–2018.

2016 IC market forecast raised from -2% to +1%

Wed, 10 Oct 2016
Rebound in DRAM market helps raise outlook for total IC market.

Qualcomm to acquire NXP

Thu, 10 Oct 2016
Qualcomm Incorporated and NXP Semiconductors N.V. today announced a definitive agreement, unanimously approved by the boards of directors of both companies, under which Qualcomm will acquire NXP.

Global semiconductor sales increase 11.5% in Q3

Tue, 11 Nov 2016
Industry posts highest-ever quarterly sales; market still behind 2015's year-to-date total.

The Chinese advanced packaging ecosystem: Looking ahead

Wed, 11 Nov 2016
In 2015, more than US$1 billion was invested in China’s advanced packaging ecosystem, announces Yole in its report Status and Prospects for the Advanced Packaging Industry.

Automotive systems forecast to show strongest growth through 2020

Thu, 11 Nov 2016
Newly updated report reviews many of the end-use system applications that are presently impacting and that are forecast to help propel the IC market through 2020.

Siemens announces plans to acquire Mentor Graphics in $4.5B deal

Mon, 11 Nov 2016
Siemens and Mentor Graphics today announced that they have entered into a merger agreement under which Siemens will acquire Mentor for an enterprise value of $4.5 billion.

IoT and automotive to drive IC market growth through 2020

Wed, 11 Nov 2016
New report also projects good IC sales increases in medical electronics, digital TVs, and servers.

Five suppliers to hold 41% of global semiconductor marketshare in 2016

Wed, 12 Dec 2016
Two years of busy M&A activity boost marketshare among top suppliers.

Global semiconductor sales increase 5% year-over-year in October

Thu, 12 Dec 2016
The global semiconductor market has rebounded in recent months, with October marking the largest year-to-year sales increase since March 2015.