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Topic Index

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Industry sustainability efforts mount with III-Vs and other advanced technologies

Thu, 6 Jun 2014
The introduction of new materials, such as III-Vs, into high-volume manufacturing of semiconductors, likely will occur sometime around the 7nm and/or 5nm nodes.

450mm transition toward sustainability: Facility and infrastructure requirements

Thu, 6 Jun 2014
Design and construction professionals are showing unprecedented levels of collaboration through the G450C.

SPTS and CEA-Leti/Nanoelec collaborate on 3D-TSV

Tue, 6 Jun 2014
SPTS Technologies, a manufacturer of etch, deposition and thermal processing equipment for the semiconductor industry, today announced that it has signed an agreement with CEA-Leti in Grenoble, France, to develop 3D-TSV technologies.

Bookings and billings maintain a consistent pace in May 2014

Fri, 6 Jun 2014
North American semiconductor equipment industry posts May 2014 book-to-bill ratio of 1.00.

Gopal Rao at The ConFab: Scaling isn’t enough anymore

Wed, 6 Jun 2014
The core element of the semiconductor industry’s roadmap has been scaling – but Gopal Rao believes that isn’t enough anymore.

Internet of Things: big numbers, many opportunities

Thu, 7 Jul 2014
Whatever forecast one uses for the future of the Internet of Things in terms of connected objects or business opportunities, the IoT will be big.

SEMI and Solid State Technology announce the 2014 “Best of West” Award finalists

Tue, 7 Jul 2014
Each year at SEMICON West, the largest and most influential microelectronics exposition in North America, the “Best of West” awards are presented by Solid State Technology and SEMI. The award was established to recognize contributors moving the industry forward with their technological developments in the microelectronics supply chain.

IBM announces $3B research initiative

Tue, 7 Jul 2014
IBM announced it is investing $3 billion over the next 5 years in two broad research and early stage development programs to push the limits of chip technology needed to meet the emerging demands of cloud computing and Big Data systems.

VCs still investing in semiconductor technology, but need strategic partners and capital efficiency

Thu, 7 Jul 2014
Investors are still looking for differentiated technologies that solve high-value problems in semiconductor manufacturing, or that bring semiconductor technology to disruptive applications in other fields, particularly in the medical and environmental sectors

Fusion bonding for next-generation 3D-ICs

Thu, 7 Jul 2014
Recent developments in wafer bonding technology have demonstrated the ability to achieve improved bond alignment accuracy.

Can lean innovation bring growth and profits back to semiconductors?

Fri, 7 Jul 2014
New approaches to start-ups can unlock mega-trend opportunities.

SMIC and JCET establish a joint venture

Fri, 8 Aug 2014
Semiconductor Manufacturing International Corporation and Jiangsu Changjiang Electronics Technology Co., Ltd. announced today the formation of a joint venture for 12-inch bumping and related testing, from the previously signed joint venture agreement, which will be established in Jiangyin National High-Tech Industrial Development Zone (JOIND), in Jiangsu Province, China.

STATS ChipPAC’s fcCuBE technology surpasses 100 million unit milestone

Wed, 8 Aug 2014
STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, announced today that it has shipped over 100 million semiconductor packages with the company’s fcCuBE technology, advanced flip chip packaging with fine pitch copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and enhanced assembly processes.

Intel releases new packaging, test technologies for 14nm foundries

Wed, 8 Aug 2014
Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies.

GaAs device market posts record revenues in 2013

Fri, 9 Sep 2014
Ongoing growth in cellular and Wi-Fi applications will continue to drive GaAs device revenues higher.

10nm success depends on concurrent design and development

Mon, 9 Sep 2014
The Prophets of Doom greet every new process node with a chorus of dire warnings about the end of scaling, catastrophic thermal effects, parasitics run amok and . . . you know the rest.

Rigorously tuned compact models: Extending predictive models to full-chip

Tue, 9 Sep 2014
Fast and predictive 3D resist compact models are needed for OPC applications. A methodology to build such models is described, starting from a 3D bulk image, and including resist interface effects such as diffusion.

Global shutter image sensors

Tue, 9 Sep 2014
Different GS pixel architectures and technologies are presented and performances compared.

Equipment spending shows strong growth for 2014 and 2015

Wed, 9 Sep 2014
Front End fab equipment spending is projected to increase up to another 20 percent in 2015 to US$ 42 billion.

The semiconductor industry: Out in front, but lagging behind

Wed, 9 Sep 2014
Capital equipment suppliers must provide advanced analytical systems that leverage data generated by their tools to help their fab customers address the challenges of Big Data and advanced analytics.

Outlook: Healthy equipment spending into 2015

Wed, 9 Sep 2014
The general consensus for the semiconductor industry is for this year’s positive trend to continue into 2015 as both revenue growth and unit shipment growth are expected to be in the mid- to high- single digit range.

Rudolph introduces new acoustic metrology and defect inspection technology

Thu, 9 Sep 2014
Rudolph Technologies has introduced its new SONUS Technology for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs).

NANIUM launches the industry’s largest WLCSP in volume production

Tue, 9 Sep 2014
NANIUM today announced it has successfully launched the industry’s largest Wafer-Level Chip Scale Package (WLCSP) in volume.

Europe: Strong growth in chip equipment spending in 2015

Mon, 10 Oct 2014
Global capital spending on semiconductor equipment is projected to grow 21.1 percent in 2014 and 21.0 percent in 2015.

Adoption of SiC & GaN to directly impact the power electronics industry

Mon, 10 Oct 2014
Emergence of new wide bandgap (WBG) technologies such as SiC and GaN materials will definitely reshape part of the established power electronics industry, according to Yole Développement (Yole).

Global semiconductor sales continue to climb in August

Mon, 10 Oct 2014
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $28.4 billion for the month of August 2014.

SEMI announces rising annual silicon wafer shipment forecast

Tue, 10 Oct 2014
SEMI recently completed its annual silicon shipment forecast for the semiconductor industry. This forecast provides an outlook for the demand in silicon units for the period 2014-–2016.

Samsung to invest $14.7B in new semiconductor fab

Tue, 10 Oct 2014
Samsung Electronics announced plans on Monday to invest $14.7 billion (15.6 trillion Korean won) in a new semiconductor fabrication facility in Pyeongtaek, South Korea.

Altera CEO John Daane to receive Robert N. Noyce Award

Wed, 10 Oct 2014
The Semiconductor Industry Association announced that John P. Daane, President, CEO, and Chairman of the Board of Altera, has been named the 2014 recipient of SIA's highest honor, the Robert N. Noyce Award.

Threshold voltage tuning for 10nm and beyond CMOS integration

Mon, 10 Oct 2014
A novel metal gate integration scheme to achieve precise threshold voltage (VT) control for multiple VTs is described.

Semiconductor market in India is expected to reach US$ 52.58B by 2020

Tue, 10 Oct 2014
India has a very large industry base of electronics items, but there is little manufacturing base for semiconductors.

The mystery of reed relays: Understanding specifications

Wed, 10 Oct 2014
Specifications of reed relays, which are used for current switching in ATE and other applications are explained, including carry current, lifetime, minimum switch capacity, hot switching, operating speed and thermoelectric switching.

Growing momentum in semiconductor manufacturing in Vietnam

Fri, 10 Oct 2014
The 2nd annual SEMI Vietnam Semiconductor Strategy Summit, co-organized with the Saigon Hi-Tech Park and with FabMax as the premier sponsor, was held September 16-17, 2014 in Ho Chi Minh City.

IBM to pay GlobalFoundries $1.5B to take over chip fabs

Mon, 10 Oct 2014
IBM and GLOBALFOUNDRIES today announced that GLOBALFOUNDRIES will acquire IBM's global commercial semiconductor technology business.

Mergers, acquisitions reshape the automotive semi supplier landscape

Wed, 10 Oct 2014
Capped by last week’s announcement that Qualcomm Inc. would buy CSR PLC, the automotive semiconductor industry recently has been undergoing a wave of merger and acquisition (M&A) activity that has shaken up the competitive order of the market.

TI to open 300mm wafer bumping facility in Chengdu, China

Thu, 11 Nov 2014
Chengdu assembly/test facility now in production; site celebrates grand opening

Double-digit growth: Record sales to shake up Top 20 semi supplier ranking

Mon, 11 Nov 2014
TSMC, MediaTek, and SK Hynix’s sales are each expected to jump by >20% this year.

Intel CEO Brian Krzanich elected chairman of Semiconductor Industry Association

Thu, 11 Nov 2014
The Semiconductor Industry Association (SIA) today announced that the SIA board of directors has elected Brian Krzanich, CEO of Intel, as its 2015 chairman and Dr. Necip Sayiner, president, CEO and director of Intersil, as its 2015 vice chairman.

TSV integration is creating growth and significant interest in the equipment and materials industry

Tue, 11 Nov 2014
The materials market will grow from $789M in 2013 to over $2.1B with a CAGR of 18%.

Slideshow: IEDM 2014 Preview

Wed, 11 Nov 2014
Browse for an advance look at some of the most newsworthy topics and papers to be presented at the 60th annual meeting, to be held at the Hilton San Francisco Union Square Hotel from December 15-17, 2014.

TSV based memory going to volume production: the era of 3DIC finally begins

Mon, 12 Dec 2014
With the recent Samsung announcement of mass production of 64 GB DDR4 DIMMs that use TSV technology for enterprise servers and cloud-based applications, all three of the major DRAM memory manufactures, Samsung, Hynix and Micron, have now announced the commercialization of TSV based memory architectures.

Cypress and Spansion to merge in $4B all-stock transaction

Wed, 12 Dec 2014
Cypress Semiconductor Corp. and Spansion, Inc. this week announced a definitive agreement to merge in an all-stock, tax-free transaction valued at approximately $4 billion.

Global semiconductor sales increase in October; Substantial growth projected for 2014

Wed, 12 Dec 2014
The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $29.7 billion for the month of October 2014, an increase of 9.6 percent from the October 2013 total.

3D TSV begins

Wed, 12 Dec 2014
“Engineering samples have already started to ship and preparation is on-going for entering volume manufacturing,” announces Yole.

Innovation in the shadow of volcanic change

Tue, 12 Dec 2014
The semiconductor equipment and materials industry is currently enjoying a double-digit annual growth rate and good prospects looking forward to 2015.

Process Watch: Fab managers don’t like surprises

Thu, 12 Dec 2014
Nobody likes surprises - especially the managers of $10 billion factories.

The most expensive defect

Thu, 12 Dec 2014
Defects that aren’t detected inline cost fabs the most.

IoT's divergent needs will drive different types of technologies

Fri, 12 Dec 2014
Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical.