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Stacking 2-dimensional materials may lower cost of semiconductor devices

Fri, 12 Dec 2014
A team of researchers led by North Carolina State University has found that stacking materials that are only one atom thick can create semiconductor junctions that transfer charge efficiently, regardless of whether the crystalline structure of the materials is mismatched - lowering the manufacturing cost for a wide variety of semiconductor devices such as solar cells, lasers and LEDs.

3D TSV begins

Wed, 12 Dec 2014
“Engineering samples have already started to ship and preparation is on-going for entering volume manufacturing,” announces Yole.

What’s next for MEMS?

Tue, 12 Dec 2014
The proliferation of sensors into high volume consumer markets, and into the emerging Internet of Things, is driving the MEMS market to maturity, with a developed ecosystem to ease use and grow applications. But it is also bringing plenty of demands for new technologies, and changes in how companies will compete.