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Stanford engineers envision an electronic switch just 3 atoms thick

Tue, 7 Jul 2014
Computer simulation shows how to make a crystal that would toggle like a light switch between conductive and non-conductive structures; this could lead to flexible electronic materials and enable a cell phone to be woven into a shirt.

New discovery could pave the way for spin-based computing

Fri, 9 Sep 2014
A University of Pittsburgh research team has discovered a way to fuse these two distinct properties in a single material, paving the way for new ultrahigh density storage and computing architectures.

Collecting light with artificial "moth eyes"

Mon, 6 Jun 2014
Empa researchers have developed such a photoelectrochemical cell, recreating a moth’s eye to drastically increase its light collecting efficiency. The cell is made of cheap raw materials – iron and tungsten oxide.

Flexible glass firms branch into new applications

Sun, 6 Jun 2014
Ultrathin glass is well suited for use as interposers in semiconductor packaging applications.

Noise cancellation: The new failure and yield analysis superpower

Sun, 6 Jun 2014
Root cause deconvolution is a quick and cost effective way to determine the underlying root causes represented in a population of failing devices from test data alone.

A silicon replacement? USC Viterbi School of Engineering overcomes major issue in carbon nanotube tech

Mon, 6 Jun 2014
Researchers from the USC Viterbi School of Engineering describe how they have overcome a major issue in carbon nanotube technology by developing a flexible, energy-efficient hybrid circuit combining carbon nanotube thin film transistors with other thin film transistors.

Singapore researchers use FEI Titan S/TEM to link plasmonics with molecular electronics

Tue, 6 Jun 2014
The National University of Singapore, Singapore University of Technology and Design, and the A*STAR institutes: Institute of High Performance Computing and Institute of Materials Research and Engineering announced their recent discovery of quantum plasmonic tunneling.

ConFab panelists discuss optimizing R&D in the changing semi landscape

Tue, 6 Jun 2014
Overheard @The ConFab: “I feel the best I’ve felt about semi since 2009.” –Mike Noonen, Silicon Catalyst

“What comes next?” — Latest technology breakthroughs featured at SEMICON West

Fri, 6 Jun 2014
The latest manufacturing, materials and production developments for emerging and adjacent markets will be featured at SEMICON West 2014, to be held on July 8-10 at the Moscone Center in San Francisco, Calif.

CEA-Leti and CORIMA collaborate on force sensors integrated in cycle wheels

Fri, 6 Jun 2014
CEA-Leti and CORIMA, a supplier of carbon-composite wheels and frames for track and road-racing cyclists, today announced they are developing an integrated sensor system to measure the power output of riders as they pedal.

EVG clears key barriers to 3DIC/TSV HVM with fusion wafer bonding solution

Mon, 6 Jun 2014
EV Group today unveiled the GEMINI FB XT—its next-generation fusion wafer bonding platform, which combines several performance breakthroughs to move the semiconductor industry closer to the goal of high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs).

Gigaphoton develops world's first helium-free purge process for ArF immersion lasers

Mon, 6 Jun 2014
Gigaphoton Inc., a major lithography light source manufacturer, announced today that it has succeeded in the development of an innovative purge process, one that does not use the rare gas helium, for its flagship "GT Series" of ArF immersion lasers.

Bending the rules

Tue, 7 Jul 2014
A UCSB postdoctoral scholar in physics discovers a counterintuitive phenomenon: the coexistence of superconductivity with dissipation.

Columbia researchers observe tunable quantum behavior in bilayer graphene

Thu, 7 Jul 2014
Columbia researchers have observed the fractional quantum Hall effect in bilayer graphene and shown that this exotic state of matter can be tuned by an electric field.

Making dreams come true : Making graphene from plastic?

Thu, 7 Jul 2014
Recently, a domestic research team developed a carbon material without artificial defects commonly found during the production process of graphene while maintaining its original characteristics.

With "ribbons" of graphene, width matters

Thu, 7 Jul 2014
Using graphene ribbons of unimaginably small widths – just several atoms across – a group of researchers at the University of Wisconsin-Milwaukee (UWM) has found a novel way to "tune" the wonder material, causing the extremely efficient conductor of electricity to act as a semiconductor.

Entegris launches ultra clean filter for semiconductor manufacturing

Tue, 7 Jul 2014
Entegris, Inc. announced the latest addition to its Torrento family of ultra clean liquid filtration solutions used in the semiconductor manufacturing process.

Applied Materials unveils CVD and CMP systems

Tue, 7 Jul 2014
On Monday, Applied Materials announced two new systems, a Reflexion LK Prime CMP system and a Producer XP Precision CVD system, both aimed at complex devices with 3D architectures.

Entegris announces new VaporSorb filter for advanced yield protection

Wed, 7 Jul 2014
Entegris, Inc. today announced a product extension for its VaporSorb line of airborne molecular contamination (AMC) filters.

A cool approach to flexible electronics

Thu, 7 Jul 2014
A nanoparticle ink that can be used for printing electronics without high-temperature annealing presents a possible profitable approach for manufacturing flexible electronics.

2014 iTherm

Thu, 7 Jul 2014
iTherm is the Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. The 2014 iTherm was held concurrently with the ECTC in Orlando, FL. This year’s General Chair was Mehdi Basheghi of Stanford and program chair was Madhusudan of Google. Attendance this year was up 50% to ~ 400.

Bruker introduces Inspire nanoscale chemical mapping system

Tue, 7 Jul 2014
Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial resolution in chemical and materials property mapping.

Graphene grain boundaries reviewed

Tue, 7 Jul 2014
Graphene has attracted overwhelming attention both for exploring fundamental science and for a wide range of technological applications.

A nanosensor to identify vapors based on a Graphene/Silicon heterojunction Schottky diode

Tue, 7 Jul 2014
Among other carbon-based nanomaterials, graphene represents a great promise for gas sensing applications.

Renasas Electronics announces development of new capacitive-touch sensing technology

Wed, 7 Jul 2014
Renesas Electronics America Inc., a supplier of advanced semiconductor solutions, today announced development of innovative new intellectual property (IP) that implements capacitive-touch sensing technology ideal for home appliances and healthcare equipment.

Former NetLogic CEO and Broadcom executive, Ron Jankov, joins eASIC board of directors

Wed, 7 Jul 2014
eASIC Corporation, a provider of Single Mask Adaptable ASIC devices, today announced the appointment of Ron Jankov to the company’s Board of Directors.

Solid State Equipment wins 2014 3D InCites Award for WaferEtch TSV Revealer

Tue, 7 Jul 2014
Solid State Equipment LLC (SSEC), a provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D ICs), MEMS, and compound semiconductor markets, was awarded a 2014 3D InCites Award in the category of 2.5D/3D Manufacturing Equipment.

Allegro MicroSystems announces new silicon carbide Schottky barrier diode FMCA series

Tue, 7 Jul 2014
Allegro MicroSystems, LLC announces the release of the next generation series of silicon carbide Schottky barrier diodes.

Compact vibration harvester power supply with highest efficiency opens door to “Fix-and-Forget” sensor nodes

Wed, 7 Jul 2014
OMRON and Holst Centre/imec have unveiled a prototype of an extremely compact vibrational energy harvesting DC power supply with worlds’ highest efficiency.

Fundamental chemistry findings could help extend Moore’s Law

Wed, 7 Jul 2014
A Berkeley Lab-Intel collaboration outlines the chemistry of photoresist, enabling smaller features for future generations of microprocessors.

Understanding graphene’s electrical properties on an atomic level

Wed, 7 Jul 2014
Graphene, a material that consists of a lattice of carbon atoms, one atom thick, is widely touted as being the most electrically conductive material ever studied. However, not all graphene is the same. With so few atoms comprising the entirety of the material, the arrangement of each one has an impact on its overall function.

A new multi-bit 'spin' for MRAM storage

Wed, 7 Jul 2014
Interest in magnetic random access memory (MRAM) is escalating, thanks to demand for fast, low-cost, nonvolatile, low-consumption, secure memory devices. MRAM, which relies on manipulating the magnetization of materials for data storage rather than electronic charges, boasts all of these advantages as an emerging technology, but so far it hasn't been able to match flash memory in terms of storage density.

SMIC and JCET establish a joint venture

Fri, 8 Aug 2014
Semiconductor Manufacturing International Corporation and Jiangsu Changjiang Electronics Technology Co., Ltd. announced today the formation of a joint venture for 12-inch bumping and related testing, from the previously signed joint venture agreement, which will be established in Jiangyin National High-Tech Industrial Development Zone (JOIND), in Jiangsu Province, China.

A*STAR and industry partners form S$200M semiconductor R&D joint labs

Thu, 7 Jul 2014
Four joint laboratories, representing a commitment of S$200m between private and public sectors, were launched today between A*STAR's Institute of Microelectronics (IME), and its 10 industry partners.

National Science Foundation tests out the assembly line of the future

Tue, 8 Aug 2014
NSF's Center for Hierarchical Manufacturing proves good test bed for large-scale nanomanufacturing designs .

New material allows for ultra-thin solar cells

Mon, 8 Aug 2014
Extremely thin, semi-transparent, flexible solar cells could soon become reality.

Taking great ideas from the lab to the fab

Tue, 8 Aug 2014
NSF and Intel support the development of domain-specific hardware to address health care needs.

SEMATECH and CNSE/SUNY launch new patterning center

Thu, 8 Aug 2014
SEMATECH and the newly merged SUNY College of Nanoscale Science and Engineering (CNSE) / SUNY Institute of Technology (SUNYIT) announced today they have launched their joint Patterning Center of Excellence.

STATS ChipPAC’s fcCuBE technology surpasses 100 million unit milestone

Wed, 8 Aug 2014
STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, announced today that it has shipped over 100 million semiconductor packages with the company’s fcCuBE technology, advanced flip chip packaging with fine pitch copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and enhanced assembly processes.

SRC, UC Davis explore new materials and device structures to develop next-generation “Race Track Memory” technologies

Tue, 8 Aug 2014
University of California, Davis researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, are exploring new materials and device structures to develop next-generation memory technologies.

Notre Dame paper offers insights into a new class of semiconducting materials

Tue, 8 Aug 2014
A new paper by University of Notre Dame researchers describes their investigations of the fundamental optical properties of a new class of semiconducting materials known as organic-inorganic "hybrid" perovskites.

Pairing old technologies with new for next-generation electronic devices

Tue, 8 Aug 2014
UCL scientists have discovered a new method to efficiently generate and control currents based on the magnetic nature of electrons in semiconducting materials, offering a radical way to develop a new generation of electronic devices.

Eco-friendly "pre-fab nanoparticles" could revolutionize nano manufacturing

Wed, 8 Aug 2014
A team of materials chemists, polymer scientists, device physicists and others at the University of Massachusetts Amherst today report a breakthrough technique for controlling molecular assembly of nanoparticles over multiple length scales that should allow faster, cheaper, more ecologically friendly manufacture of organic photovoltaics and other electronic devices.

New test reveals purity of graphene

Wed, 8 Aug 2014
Graphene may be tough, but those who handle it had better be tender. The environment surrounding the atom-thick carbon material can influence its electronic performance, according to researchers at Rice and Osaka universities who have come up with a simple way to spot contaminants.

Researchers prove stability of wonder material silicene

Fri, 8 Aug 2014
An international team of researchers has taken a significant step towards understanding the fundamental properties of the two-dimensional material silicene by showing that it can remain stable in the presence of oxygen.

Gigaphoton unveils new function that enables 50% reduction of neon gas consumption for ArF immersion lasers

Mon, 8 Aug 2014
Gigaphoton Inc., a lithography light source manufacturer, today unveils a new function, called “eTGM,” available for its flagship high-output GT Series of ArF immersion laser products.

Mentor Graphics announces 25th annual PCB Technology Leadership Awards program

Tue, 8 Aug 2014
Mentor Graphics Corporation today announced the call-for-entries of its 25th annual Technology Leadership Awards (TLA) competition, continuing its tradition of recognizing excellence in printed circuit board (PCB) design.

Intersil announces single-chip display power and LED driver for smartphones

Tue, 8 Aug 2014
Intersil Corporation, a provider of power management and precision analog solutions, today announced the ISL98611 display power and LED driver for smartphones.

Himax Technologies and Lumus announce collaboration to develop next-generation smart glasses

Tue, 8 Aug 2014
Himax Technologies, Inc., a supplier and fabless manufacturer of display drivers and other semiconductor products, and Lumus, a producer of Augmented Reality glasses, announced today another joint initiative to continue developing the next-generation of smart glasses that will set new technological standards in image quality and performance.

MIPT and RAS scientists made an important step towards creating medical nanorobots

Tue, 8 Aug 2014
Researchers from the Institute of General Physics of the Russian Academy of Sciences, the Institute of Bioorganic Chemistry of the Russian Academy of Sciences and MIPT have made an important step towards creating medical nanorobots.

Promising ferroelectric materials suffer from unexpected electric polarizations

Tue, 8 Aug 2014
Electronic devices with unprecedented efficiency and data storage may someday run on ferroelectrics—remarkable materials that use built-in electric polarizations to read and write digital information, outperforming the magnets inside most popular data-driven technology.

Renesas Electronics expands portfolio of Simple Power Supply ICs

Wed, 8 Aug 2014
Renesas Electronics America, a leading supplier of advanced semiconductor solutions, today expands its portfolio of Simple Power Supply ICs, with innovative 16V input capable synchronous buck regulators that deliver up to 3A continuous current to loads at voltages as low as 0.8V.

A breakthrough in imaging gold nanoparticles to atomic resolution by electron microscopy

Fri, 8 Aug 2014
Nanometer-scale gold particles are intensively investigated for application as catalysts, sensors, drug delivery devices, biological contrast agents and components in photonics and molecular electronics.

JEDEC releases LPDDR4 Standard for low power memory devices

Mon, 8 Aug 2014
JEDEC Solid State Technology Association today announced the publication of JESD209-4 Low Power Double Data Rate 4 (LPDDR4).

Renasas introduces new package for safety systems for industrial equipment

Tue, 8 Aug 2014
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today announced that it has obtained IEC 61508 (Functional Safety) certification for the RX631, RX63N Safety Package.

Engineers develop new sensor to detect tiny individual nanoparticles

Tue, 9 Sep 2014
A team of researchers at Washington University in St. Louis, led by Lan Yang, PhD, the Das Family Career Development Associate Professor in Electrical & Systems Engineering, and their collaborators at Tsinghua University in China have developed a new sensor that can detect and count nanoparticles, at sizes as small as 10 nanometers, one at a time.

SemiLEDs launches EF FlipChip LED series

Wed, 8 Aug 2014
SemiLEDs Corporation, a global provider of vertical LED technology solutions, today announced sampling and volume availability of the first in its new Enhanced FlipChip, or EF, LED series.

Competition for graphene

Wed, 8 Aug 2014
A new argument has just been added to the growing case for graphene being bumped off its pedestal as the next big thing in the high-tech world by the two-dimensional semiconductors known as MX2 materials.

The industry's first foundry business for MEMS utilizing thin-film piezoelectric elements

Thu, 8 Aug 2014
ROHM has recently established a process for MEMS utilizing thin-film piezoelectric elements, and implemented the industry's first foundry business that integrates product design and manufacturing processes, from wafer pulling to mounting, in order to meet a variety of customer needs.

Seoul Semiconductor launches smart lighting Acrich LED Light Engine

Thu, 8 Aug 2014
Seoul Semiconductor announced the release of a new LED light engine with Acrich 3 technology.

SEMI-GAS broadens gas mixing capabilities for highly corrosive gases

Thu, 8 Aug 2014
SEMI-GAS Systems, a provider of ultra-high purity gas delivery equipment, recently broadened the capabilities of its custom Xturion Blixer gas blender product line.

A new, tunable device for spintronics

Fri, 8 Aug 2014
An international team of scientists including physicist Jairo Sinova from the University of Mainz realises a tunable spin-charge converter made of GaAs.

Copper shines as flexible conductor

Fri, 8 Aug 2014
Bend them, stretch them, twist them, fold them: modern materials that are light, flexible and highly conductive have extraordinary technological potential, whether as artificial skin or electronic paper.

MEI Wet Processing Systems reveals performance data for new critical etch system

Tue, 9 Sep 2014
MEI Wet Processing Systems and Services revealed performance data today on its newly released Cu & TiW Critical Etch System for compound semiconductor manufacturing.

TowerJazz and Triune Systems announce Neo-Iso Products ramping to mass production

Tue, 9 Sep 2014
TowerJazz, the global specialty foundry, and Triune Systems LLC, a mixed signal and power management IC provider, today announced that Triune has developed a proprietary isolated power and data technology using the TowerJazz TS18PM process on its 0.18um based power management platform.

Breakthrough in light sources for new quantum technology

Tue, 9 Sep 2014
Electronic circuits are based on electrons, but one of the most promising technologies for future quantum circuits are photonic circuits, i.e. circuits based on light (photons) instead of electrons.

Analog Devices releases high-temperature MEMS gyroscope

Wed, 9 Sep 2014
Analog Devices, Inc. today introduced the first and only MEMS gyroscope specified to withstand temperatures of up to 175 degrees Celsius commonly encountered by oil and gas drilling equipment.

Samsung adopts ProPlus Designs' 14nm finFET process

Wed, 9 Sep 2014
ProPlus Design Solutions, Inc. today announced Samsung Electronics has extended its partnership with ProPlus through the deployment of ProPlus' BSIMProPlus modeling platform for its 14-nanometer (nm) FinFET SPICE modeling.

UCSB researchers develop ultra sensitive biosensor from molybdenite semiconductor

Thu, 9 Sep 2014
Move over, graphene. An atomically thin, two-dimensional, ultrasensitive semiconductor material for biosensing developed by researchers at UC Santa Barbara promises to push the boundaries of biosensing technology in many fields, from health care to environmental protection to forensic industries.

Sidense demonstrates working one-time programmable bit cells in TSMC 16nm finFET technology

Fri, 9 Sep 2014
Sidense Corp., a developer of non-volatile memory OTP IP cores, today announced that it successfully demonstrated read and write capability for its 1T-OTP bit-cell architecture on test silicon fabricated in a 16nm CMOS FinFET process.

Cree SiC MOSFETs help power Japan’s growing solar energy infrastructure

Mon, 9 Sep 2014
Cree, Inc. has announced that its C2M, 1200V, 80mOhm SiC MOSFETs have been selected by Sanix Corporation, Japan, to be designed into their new 9.9kW three-phase solar inverters for use in the construction of commercial photovoltaic systems in the fast-growing Japanese solar energy market.

Layered graphene sandwich for next generation electronics

Mon, 9 Sep 2014
Sandwiching layers of graphene with white graphene could produce designer materials capable of creating high-frequency electronic devices, University of Manchester scientists have found.

Doped graphene nanoribbons with potential

Mon, 9 Sep 2014
Researchers from Empa and the Max Planck Institute for Polymer Research have now developed a new method to selectively dope graphene molecules with nitrogen atoms.

NSF and SRC announce research awards to 10 universities

Tue, 9 Sep 2014
The National Science Foundation (NSF) and Semiconductor Research Corporation (SRC) today announced nine research awards to 10 universities totaling nearly $4 million under a joint program focused on Secure, Trustworthy, Assured and Resilient Semiconductors and Systems (STARSS).

GLOBALFOUNDRIES and SRC announce new scholarship for undergraduate engineering students

Tue, 9 Sep 2014
GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced the “GLOBALFOUNDRIES Undergraduate Research Scholarship,” a new scholarship recognizing and rewarding aspiring, leadership-oriented engineering students interested in careers in the semiconductor industry.

Fermilab implements Ziptronix's DBI hybrid bonding in high-end 3D image sensors

Tue, 9 Sep 2014
Ziptronix Inc. today announced that its Direct Bond Interconnect (DBI) hybrid bonding has been implemented by Fermi National Accelerator Laboratory (Fermilab) to improve the performance of high-end 3D sensor arrays, which are used for particle detection in large-scale particle physics and x-ray imaging experiments.

Intematix and SABIC collaborate to deliver increased efficiency solutions for LED systems

Tue, 9 Sep 2014
Intematix Corporation, a manufacturer of phosphor solutions for LED lighting, has collaborated with SABIC's Innovative Plastics business to create the ChromaLit Linear - a LED offering developed for the lighting industry.

Global shutter image sensors

Tue, 9 Sep 2014
Different GS pixel architectures and technologies are presented and performances compared.

Leti and LUCIOM focusing on high-data-rate bidirectional transceivers for enriched LiFi applications

Wed, 9 Sep 2014
CEA-Leti and LUCIOM, which develops visible-light communication using light-emitting diodes (LEDs), have launched a project to develop high-data-rate LiFi transceivers.

Beautiful, brilliant people

Wed, 9 Sep 2014
It would be difficult to overstate how critical the development of a workable, high volume manufacturing EUV lithography solution is to the semiconductor industry.

eBeam Initiative Survey indicates new eBeam expectations for photomask production

Tue, 9 Sep 2014
Continued semiconductor scaling drives new mask design requirements; use of complex mask shapes predicted to increase

Element Six selected by European Consortium as a partner to develop ultrafast pulse disk lasers

Tue, 9 Sep 2014
Element Six today announced it has been selected by the European Commission’s Seventh Framework Programme for Research and Technological Development to help develop a new ultrafast pulse disk laser.

Veeco Ion Beam Deposition technology reaches significant milestone to support EUV commercialization roadmap

Wed, 9 Sep 2014
Veeco Instruments Inc. announced today that its new Odyssey Ion Beam Deposition (IBD) Upgrade for the NEXUS IBD-LDD System has repeatedly produced photomask blanks with zero deposition defects larger than 70nm.

Oxford Instruments launches 3rd annual Indian nanotechnology seminars in Kolkata and Delhi

Thu, 9 Sep 2014
Oxford Instruments is hosting its third series of annual seminars for the nanotechnology industry in India in November.

New research proves whiteness and color rendering has strong effect on LED lamp preference

Thu, 9 Sep 2014
Soraa, a developer of GaN on GaN LED technology, announced today new psychophysical research proving that whiteness and color rendering have a strong effect on the perception of energy-efficient LED lighting.

Samsung now mass producing industry’s first 20nm 6Gb LPDDR3 mobile DRAM

Thu, 9 Sep 2014
The new mobile memory chip will enable longer battery run-time and faster application loading on large screen mobile devices with higher resolution.

Making quantum dots glow brighter

Thu, 9 Sep 2014
Ultrathin layers of metal oxides can change the way quantum dots behave, in some cases turning them into more efficient light emitters.

Toward optical chips

Fri, 9 Sep 2014
A promising light source for optoelectronic chips can be tuned to different frequencies.

Northeastern University researchers develop novel method for working with nanotubes

Fri, 9 Sep 2014
Northeastern University researchers have developed a novel method for controllably constructing precise inter-nanotube junctions and a variety of nanocarbon structures in carbon nanotube arrays.

NVIDIA unveils Maxwell GPU architecture

Fri, 9 Sep 2014
In a major leap forward for gaming, NVIDIA today introduced the first high-end products based on its Maxwell chip architecture -- the new GeForce GTX 980 and 970 GPUs -- delivering unmatched performance, major new graphics capabilities and twice the energy efficiency of the previous generation.

Vesper launches with very high SNR MEMS microphone

Mon, 9 Sep 2014
Intending to improve the smallest audio component found in smartphones, wearables and Internet of Things (IoT) devices, a new Boston-based sensor company called Vesper has designed a microphone that will enhance consumers' acoustic experience with voice capture and sound recording.

Physicists heat freestanding graphene to control curvature of ripples

Mon, 9 Sep 2014
An international team of physicists, led by a research group at the University of Arkansas, has discovered that heating can be used to control the curvature of ripples in freestanding graphene.

Future flexible electronics based on carbon nanotubes

Wed, 9 Sep 2014
Study in Applied Physics Letters show how to improve nanotube transistor and circuit performance with fluoropolymers

Flexible LEDs

Wed, 9 Sep 2014
Flexible light-emitting diode (LED) displays and solar cells crafted with inorganic compound semiconductor micro-rods are moving one step closer to reality, thanks to graphene and the work of a team of researchers in Korea.

Southampton scientists grow a new challenger to graphene

Wed, 9 Sep 2014
A team of researchers from the University of Southampton's Optoelectronics Research Centre (ORC) has developed a new way to fabricate a potential challenger to graphene.

Honeywell advanced materials help mobile devices dissipate heat

Thu, 9 Sep 2014
Honeywell Electronic Materials announced today that its advanced materials are being integrated into the production of tablets and smartphones, helping them stay cool and perform better.

Photomask Technology speaker says EUV is nearly production-ready

Fri, 10 Oct 2014
Highlights at the recent SPIE Photomask Technology 2014 conference included a confident announcement from ASML about current EUV source capabilities, an insightful industry-expert panel discussion on mask-making complexities, and fresh energy from the co-located SPIE Scanning Microscopies conference.

New technology may lead to prolonged power in mobile devices

Tue, 9 Sep 2014
Researchers from The University of Texas at Dallas have created technology that could be the first step toward wearable computers with self-contained power sources or, more immediately, a smartphone that doesn’t die after a few hours of heavy use.

All directions are not created equal for nanoscale heat sources

Wed, 10 Oct 2014
Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths.

Quantum Materials scaling up photoactive quantum dot production for solar power generation

Wed, 10 Oct 2014
Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies.

FlipChip International creates 250 multi-product wafer bump designs

Wed, 10 Oct 2014
FlipChip International (FCI), the global technology leader in flip chip bumping and advanced wafer level packaging, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013.

Crumpled graphene could provide an unconventional energy storage

Fri, 10 Oct 2014
Two-dimensional carbon 'paper' can form stretchable supercapacitors to power flexible electronic devices.

Platinum meets its match in quantum dots from coal

Fri, 10 Oct 2014
Graphene quantum dots created at Rice University grab onto graphene platelets like barnacles attach themselves to the hull of a boat. But these dots enhance the properties of the mothership, making them better than platinum catalysts for certain reactions within fuel cells.

EV Group unveils room-temperature covalent bonder

Mon, 10 Oct 2014
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 580 ComBond.

Albert Theuwissen of Harvest Imaging honored with European SEMI Award 2014

Wed, 10 Oct 2014
Albert Theuwissen, CEO of Harvest Imaging and professor at Delft University of Technology, is the recipient of the European SEMI Award 2014.

Next-generation nanoimprint lithography technology

Tue, 10 Oct 2014
EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process.

Seoul Semiconductor announces the mass production of the Acrich MJT 3030

Thu, 10 Oct 2014
Seoul Semiconductor, a global LED manufacturer, announced the availability of Acrich MJT 3030 a new LED in the Acrich MJT product family which improves on performance and enables lower system costs.

A novel platform for future spintronic technologies

Mon, 10 Oct 2014
Scientists at EPFL, working with Université Paris-Sud and Paul Scherrer Institut, have discovered that a common insulating material behaves as a perfect spintronic conductor because it is not affected by background electron charge.

Revving up fluorescence for superfast LEDs

Mon, 10 Oct 2014
Duke University researchers have made fluorescent molecules emit photons of light 1,000 times faster than normal -- setting a speed record and making an important step toward realizing superfast light emitting diodes (LEDs) and quantum cryptography.

Smallest world record has 'endless possibilities' for bio-nanotechnology

Mon, 10 Oct 2014
Scientists from the University of Leeds have taken a crucial step forward in bio-nanotechnology, a field that uses biology to develop new tools for science, technology and medicine.

Printing in the hobby room: Paper-thin and touch-sensitive displays on various materials

Mon, 10 Oct 2014
What if you could integrate paper-thin displays into the cards, which could be printed at home and which would be able to depict self-created symbols or even react to touch? Those only some of the options computer scientists in Saarbrücken can offer.

The mystery of reed relays: Understanding specifications

Wed, 10 Oct 2014
Specifications of reed relays, which are used for current switching in ATE and other applications are explained, including carry current, lifetime, minimum switch capacity, hot switching, operating speed and thermoelectric switching.

Element Six introduces new thermal grade of CVD diamond

Wed, 10 Oct 2014
Element Six this week announced the development of a new thermal grade of diamond grown by chemical vapor deposition (CVD), DIAFILM TM130.

Beyond LEDs: Brighter, new energy-saving flat panel lights based on carbon nanotubes

Thu, 10 Oct 2014
Planar light source using a phosphor screen with highly crystalline single-walled carbon nanotubes (SWCNTs) as field emitters demonstrates its potential for energy-efficient lighting device.

Magnetic mirrors enable new technologies by reflecting light in uncanny ways

Fri, 10 Oct 2014
As in Alice’s journey through the looking-glass to Wonderland, mirrors in the real world can sometimes behave in surprising and unexpected ways, including a new class of mirror that works like no other.

Semiconductor “dust” enables low cost solar cells, LEDs

Fri, 10 Oct 2014
The U.S. Patent Office has issued US Patent No. 8,859,310 to Versatilis LLC that shows how fine semiconductor particles, powders or fines, often the waste byproduct of dicing semiconductor wafers into ever smaller chips, can be processed into a sea of low cost solar cells or micro-LEDs.

MEMS Industry Group goes to the 'Shark Tank' for MEMS and sensor-based products

Mon, 10 Oct 2014
MIG announces finalists for Elevator Pitch Session at MEMS Executive Congress US 2014.

VaporSorb filter line protects advanced yield production from Entegris

Tue, 10 Oct 2014
Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters.

Special UO microscope captures defects in nanotubes

Tue, 10 Oct 2014
University of Oregon chemists have devised a way to see the internal structures of electronic waves trapped in carbon nanotubes by external electrostatic charges.

Samsung starts mass production of 8Gb DDR4 based on 20nm process technology

Wed, 10 Oct 2014
Samsung today announced that it is mass producing the industry’s most advanced 8-gigabit (Gb) DDR4 memory and 32-gigabyte (GB) module, both of which will be manufactured based on a new 20-nanometer (nm) process technology, for use in enterprise servers.

Cree's new SC5 Technology Platform doubles light output to radically lower system cost

Thu, 10 Oct 2014
This new class of LEDs can reduce system costs by up to 40 percent in most lighting applications.

SMIC and Maxscend collaborate on 55nm RF IP platform

Thu, 10 Oct 2014
Semiconductor Manufacturing International Corporation and Maxscend Technologies Inc., a RF IP company based in China, announced that Maxscend Bluetooth RF IP has been silicon proven on SMIC's 55nm low leakage logic process.

New 3D display technology promises greater energy efficiency

Thu, 10 Oct 2014
LCD technology developed in Hong Kong maintains the 3D images it displays without drawing power.

TSMC, Kilopass deliver non-volatile memory for the 16nm finFET process node

Tue, 10 Oct 2014
Kilopass Technology Inc., a provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), announced today that it has successfully ported its one-time programmable (OTP) NVM technology to TSMC's 16 nanometer (nm) FinFET process.

Synopsys announces availability of DesignWare, non-volatile memory IP for TowerJazz 180nm process technology

Thu, 10 Oct 2014
Synopsys, Inc. today announced the availability of the silicon-proven DesignWare AEON Few Time Programmable (FTP) Trim Non-Volatile Memory (NVM) IP for TowerJazz 180-nanometer (nm) SL process technology.