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Stanford engineers envision an electronic switch just 3 atoms thick

Tue, 7 Jul 2014
Computer simulation shows how to make a crystal that would toggle like a light switch between conductive and non-conductive structures; this could lead to flexible electronic materials and enable a cell phone to be woven into a shirt.

Ghent University and imec demonstrate interaction between light and sound in nanoscale waveguide

Tue, 2 Feb 2015
Silicon photonics enables extreme light-matter interaction.

Laser spike annealing resolves sub-20nm logic device manufacturing challenges

Thu, 12 Dec 2014
LSA technology plays an enabling role to overcoming manufacturing challenges for sub-20nm logic devices.

Russian scientists develop the world's fastest nanoscale photonics switch

Thu, 10 Oct 2015
An international team of researchers from Lomonosov Moscow State University and the Australian National University in Canberra created an ultrafast all-optical switch on silicon nanostructures.

New discovery could pave the way for spin-based computing

Fri, 9 Sep 2014
A University of Pittsburgh research team has discovered a way to fuse these two distinct properties in a single material, paving the way for new ultrahigh density storage and computing architectures.

Collecting light with artificial "moth eyes"

Mon, 6 Jun 2014
Empa researchers have developed such a photoelectrochemical cell, recreating a moth’s eye to drastically increase its light collecting efficiency. The cell is made of cheap raw materials – iron and tungsten oxide.

Flexible glass firms branch into new applications

Sun, 6 Jun 2014
Ultrathin glass is well suited for use as interposers in semiconductor packaging applications.

Noise cancellation: The new failure and yield analysis superpower

Sun, 6 Jun 2014
Root cause deconvolution is a quick and cost effective way to determine the underlying root causes represented in a population of failing devices from test data alone.

A silicon replacement? USC Viterbi School of Engineering overcomes major issue in carbon nanotube tech

Mon, 6 Jun 2014
Researchers from the USC Viterbi School of Engineering describe how they have overcome a major issue in carbon nanotube technology by developing a flexible, energy-efficient hybrid circuit combining carbon nanotube thin film transistors with other thin film transistors.

Singapore researchers use FEI Titan S/TEM to link plasmonics with molecular electronics

Tue, 6 Jun 2014
The National University of Singapore, Singapore University of Technology and Design, and the A*STAR institutes: Institute of High Performance Computing and Institute of Materials Research and Engineering announced their recent discovery of quantum plasmonic tunneling.

ConFab panelists discuss optimizing R&D in the changing semi landscape

Tue, 6 Jun 2014
Overheard @The ConFab: “I feel the best I’ve felt about semi since 2009.” –Mike Noonen, Silicon Catalyst

“What comes next?” — Latest technology breakthroughs featured at SEMICON West

Fri, 6 Jun 2014
The latest manufacturing, materials and production developments for emerging and adjacent markets will be featured at SEMICON West 2014, to be held on July 8-10 at the Moscone Center in San Francisco, Calif.

CEA-Leti and CORIMA collaborate on force sensors integrated in cycle wheels

Fri, 6 Jun 2014
CEA-Leti and CORIMA, a supplier of carbon-composite wheels and frames for track and road-racing cyclists, today announced they are developing an integrated sensor system to measure the power output of riders as they pedal.

EVG clears key barriers to 3DIC/TSV HVM with fusion wafer bonding solution

Mon, 6 Jun 2014
EV Group today unveiled the GEMINI FB XT—its next-generation fusion wafer bonding platform, which combines several performance breakthroughs to move the semiconductor industry closer to the goal of high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs).

Gigaphoton develops world's first helium-free purge process for ArF immersion lasers

Mon, 6 Jun 2014
Gigaphoton Inc., a major lithography light source manufacturer, announced today that it has succeeded in the development of an innovative purge process, one that does not use the rare gas helium, for its flagship "GT Series" of ArF immersion lasers.

Bending the rules

Tue, 7 Jul 2014
A UCSB postdoctoral scholar in physics discovers a counterintuitive phenomenon: the coexistence of superconductivity with dissipation.

Columbia researchers observe tunable quantum behavior in bilayer graphene

Thu, 7 Jul 2014
Columbia researchers have observed the fractional quantum Hall effect in bilayer graphene and shown that this exotic state of matter can be tuned by an electric field.

Making dreams come true : Making graphene from plastic?

Thu, 7 Jul 2014
Recently, a domestic research team developed a carbon material without artificial defects commonly found during the production process of graphene while maintaining its original characteristics.

With "ribbons" of graphene, width matters

Thu, 7 Jul 2014
Using graphene ribbons of unimaginably small widths – just several atoms across – a group of researchers at the University of Wisconsin-Milwaukee (UWM) has found a novel way to "tune" the wonder material, causing the extremely efficient conductor of electricity to act as a semiconductor.

Entegris launches ultra clean filter for semiconductor manufacturing

Tue, 7 Jul 2014
Entegris, Inc. announced the latest addition to its Torrento family of ultra clean liquid filtration solutions used in the semiconductor manufacturing process.

Applied Materials unveils CVD and CMP systems

Tue, 7 Jul 2014
On Monday, Applied Materials announced two new systems, a Reflexion LK Prime CMP system and a Producer XP Precision CVD system, both aimed at complex devices with 3D architectures.

Entegris announces new VaporSorb filter for advanced yield protection

Wed, 7 Jul 2014
Entegris, Inc. today announced a product extension for its VaporSorb line of airborne molecular contamination (AMC) filters.

A cool approach to flexible electronics

Thu, 7 Jul 2014
A nanoparticle ink that can be used for printing electronics without high-temperature annealing presents a possible profitable approach for manufacturing flexible electronics.

2014 iTherm

Thu, 7 Jul 2014
iTherm is the Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. The 2014 iTherm was held concurrently with the ECTC in Orlando, FL. This year’s General Chair was Mehdi Basheghi of Stanford and program chair was Madhusudan of Google. Attendance this year was up 50% to ~ 400.

Bruker introduces Inspire nanoscale chemical mapping system

Tue, 7 Jul 2014
Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial resolution in chemical and materials property mapping.

Graphene grain boundaries reviewed

Tue, 7 Jul 2014
Graphene has attracted overwhelming attention both for exploring fundamental science and for a wide range of technological applications.

A nanosensor to identify vapors based on a Graphene/Silicon heterojunction Schottky diode

Tue, 7 Jul 2014
Among other carbon-based nanomaterials, graphene represents a great promise for gas sensing applications.

Renasas Electronics announces development of new capacitive-touch sensing technology

Wed, 7 Jul 2014
Renesas Electronics America Inc., a supplier of advanced semiconductor solutions, today announced development of innovative new intellectual property (IP) that implements capacitive-touch sensing technology ideal for home appliances and healthcare equipment.

Former NetLogic CEO and Broadcom executive, Ron Jankov, joins eASIC board of directors

Wed, 7 Jul 2014
eASIC Corporation, a provider of Single Mask Adaptable ASIC devices, today announced the appointment of Ron Jankov to the company’s Board of Directors.

Solid State Equipment wins 2014 3D InCites Award for WaferEtch TSV Revealer

Tue, 7 Jul 2014
Solid State Equipment LLC (SSEC), a provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D ICs), MEMS, and compound semiconductor markets, was awarded a 2014 3D InCites Award in the category of 2.5D/3D Manufacturing Equipment.

Allegro MicroSystems announces new silicon carbide Schottky barrier diode FMCA series

Tue, 7 Jul 2014
Allegro MicroSystems, LLC announces the release of the next generation series of silicon carbide Schottky barrier diodes.

Compact vibration harvester power supply with highest efficiency opens door to “Fix-and-Forget” sensor nodes

Wed, 7 Jul 2014
OMRON and Holst Centre/imec have unveiled a prototype of an extremely compact vibrational energy harvesting DC power supply with worlds’ highest efficiency.

Fundamental chemistry findings could help extend Moore’s Law

Wed, 7 Jul 2014
A Berkeley Lab-Intel collaboration outlines the chemistry of photoresist, enabling smaller features for future generations of microprocessors.

Understanding graphene’s electrical properties on an atomic level

Wed, 7 Jul 2014
Graphene, a material that consists of a lattice of carbon atoms, one atom thick, is widely touted as being the most electrically conductive material ever studied. However, not all graphene is the same. With so few atoms comprising the entirety of the material, the arrangement of each one has an impact on its overall function.

A new multi-bit 'spin' for MRAM storage

Wed, 7 Jul 2014
Interest in magnetic random access memory (MRAM) is escalating, thanks to demand for fast, low-cost, nonvolatile, low-consumption, secure memory devices. MRAM, which relies on manipulating the magnetization of materials for data storage rather than electronic charges, boasts all of these advantages as an emerging technology, but so far it hasn't been able to match flash memory in terms of storage density.

SMIC and JCET establish a joint venture

Fri, 8 Aug 2014
Semiconductor Manufacturing International Corporation and Jiangsu Changjiang Electronics Technology Co., Ltd. announced today the formation of a joint venture for 12-inch bumping and related testing, from the previously signed joint venture agreement, which will be established in Jiangyin National High-Tech Industrial Development Zone (JOIND), in Jiangsu Province, China.

A*STAR and industry partners form S$200M semiconductor R&D joint labs

Thu, 7 Jul 2014
Four joint laboratories, representing a commitment of S$200m between private and public sectors, were launched today between A*STAR's Institute of Microelectronics (IME), and its 10 industry partners.

National Science Foundation tests out the assembly line of the future

Tue, 8 Aug 2014
NSF's Center for Hierarchical Manufacturing proves good test bed for large-scale nanomanufacturing designs .

New material allows for ultra-thin solar cells

Mon, 8 Aug 2014
Extremely thin, semi-transparent, flexible solar cells could soon become reality.

Taking great ideas from the lab to the fab

Tue, 8 Aug 2014
NSF and Intel support the development of domain-specific hardware to address health care needs.

SEMATECH and CNSE/SUNY launch new patterning center

Thu, 8 Aug 2014
SEMATECH and the newly merged SUNY College of Nanoscale Science and Engineering (CNSE) / SUNY Institute of Technology (SUNYIT) announced today they have launched their joint Patterning Center of Excellence.

STATS ChipPAC’s fcCuBE technology surpasses 100 million unit milestone

Wed, 8 Aug 2014
STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, announced today that it has shipped over 100 million semiconductor packages with the company’s fcCuBE technology, advanced flip chip packaging with fine pitch copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and enhanced assembly processes.

SRC, UC Davis explore new materials and device structures to develop next-generation “Race Track Memory” technologies

Tue, 8 Aug 2014
University of California, Davis researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, are exploring new materials and device structures to develop next-generation memory technologies.

Notre Dame paper offers insights into a new class of semiconducting materials

Tue, 8 Aug 2014
A new paper by University of Notre Dame researchers describes their investigations of the fundamental optical properties of a new class of semiconducting materials known as organic-inorganic "hybrid" perovskites.

Pairing old technologies with new for next-generation electronic devices

Tue, 8 Aug 2014
UCL scientists have discovered a new method to efficiently generate and control currents based on the magnetic nature of electrons in semiconducting materials, offering a radical way to develop a new generation of electronic devices.

Finding the Achilles' heel of GaN-based LEDs in harsh radiation environments

Mon, 12 Dec 2014
Gallium nitride (GaN) based devices are attractive for harsh environment electronics because of their high chemical and the mechanical stability of GaN itself that has a higher atomic displacement energy than other semiconductor materials.

Micron and Intel unveil new 3D NAND flash memory

Thu, 3 Mar 2015
Micron Technology, Inc. and Intel Corporation today revealed the availability of their 3D NAND technology, the world’s highest-density flash memory.

Eco-friendly "pre-fab nanoparticles" could revolutionize nano manufacturing

Wed, 8 Aug 2014
A team of materials chemists, polymer scientists, device physicists and others at the University of Massachusetts Amherst today report a breakthrough technique for controlling molecular assembly of nanoparticles over multiple length scales that should allow faster, cheaper, more ecologically friendly manufacture of organic photovoltaics and other electronic devices.

New test reveals purity of graphene

Wed, 8 Aug 2014
Graphene may be tough, but those who handle it had better be tender. The environment surrounding the atom-thick carbon material can influence its electronic performance, according to researchers at Rice and Osaka universities who have come up with a simple way to spot contaminants.

Researchers prove stability of wonder material silicene

Fri, 8 Aug 2014
An international team of researchers has taken a significant step towards understanding the fundamental properties of the two-dimensional material silicene by showing that it can remain stable in the presence of oxygen.

Gigaphoton unveils new function that enables 50% reduction of neon gas consumption for ArF immersion lasers

Mon, 8 Aug 2014
Gigaphoton Inc., a lithography light source manufacturer, today unveils a new function, called “eTGM,” available for its flagship high-output GT Series of ArF immersion laser products.

Mentor Graphics announces 25th annual PCB Technology Leadership Awards program

Tue, 8 Aug 2014
Mentor Graphics Corporation today announced the call-for-entries of its 25th annual Technology Leadership Awards (TLA) competition, continuing its tradition of recognizing excellence in printed circuit board (PCB) design.

Intersil announces single-chip display power and LED driver for smartphones

Tue, 8 Aug 2014
Intersil Corporation, a provider of power management and precision analog solutions, today announced the ISL98611 display power and LED driver for smartphones.

Himax Technologies and Lumus announce collaboration to develop next-generation smart glasses

Tue, 8 Aug 2014
Himax Technologies, Inc., a supplier and fabless manufacturer of display drivers and other semiconductor products, and Lumus, a producer of Augmented Reality glasses, announced today another joint initiative to continue developing the next-generation of smart glasses that will set new technological standards in image quality and performance.

MIPT and RAS scientists made an important step towards creating medical nanorobots

Tue, 8 Aug 2014
Researchers from the Institute of General Physics of the Russian Academy of Sciences, the Institute of Bioorganic Chemistry of the Russian Academy of Sciences and MIPT have made an important step towards creating medical nanorobots.

Promising ferroelectric materials suffer from unexpected electric polarizations

Tue, 8 Aug 2014
Electronic devices with unprecedented efficiency and data storage may someday run on ferroelectrics—remarkable materials that use built-in electric polarizations to read and write digital information, outperforming the magnets inside most popular data-driven technology.

Renesas Electronics expands portfolio of Simple Power Supply ICs

Wed, 8 Aug 2014
Renesas Electronics America, a leading supplier of advanced semiconductor solutions, today expands its portfolio of Simple Power Supply ICs, with innovative 16V input capable synchronous buck regulators that deliver up to 3A continuous current to loads at voltages as low as 0.8V.

A breakthrough in imaging gold nanoparticles to atomic resolution by electron microscopy

Fri, 8 Aug 2014
Nanometer-scale gold particles are intensively investigated for application as catalysts, sensors, drug delivery devices, biological contrast agents and components in photonics and molecular electronics.

JEDEC releases LPDDR4 Standard for low power memory devices

Mon, 8 Aug 2014
JEDEC Solid State Technology Association today announced the publication of JESD209-4 Low Power Double Data Rate 4 (LPDDR4).

Renasas introduces new package for safety systems for industrial equipment

Tue, 8 Aug 2014
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today announced that it has obtained IEC 61508 (Functional Safety) certification for the RX631, RX63N Safety Package.

Engineers develop new sensor to detect tiny individual nanoparticles

Tue, 9 Sep 2014
A team of researchers at Washington University in St. Louis, led by Lan Yang, PhD, the Das Family Career Development Associate Professor in Electrical & Systems Engineering, and their collaborators at Tsinghua University in China have developed a new sensor that can detect and count nanoparticles, at sizes as small as 10 nanometers, one at a time.

SemiLEDs launches EF FlipChip LED series

Wed, 8 Aug 2014
SemiLEDs Corporation, a global provider of vertical LED technology solutions, today announced sampling and volume availability of the first in its new Enhanced FlipChip, or EF, LED series.

Competition for graphene

Wed, 8 Aug 2014
A new argument has just been added to the growing case for graphene being bumped off its pedestal as the next big thing in the high-tech world by the two-dimensional semiconductors known as MX2 materials.

The industry's first foundry business for MEMS utilizing thin-film piezoelectric elements

Thu, 8 Aug 2014
ROHM has recently established a process for MEMS utilizing thin-film piezoelectric elements, and implemented the industry's first foundry business that integrates product design and manufacturing processes, from wafer pulling to mounting, in order to meet a variety of customer needs.

Seoul Semiconductor launches smart lighting Acrich LED Light Engine

Thu, 8 Aug 2014
Seoul Semiconductor announced the release of a new LED light engine with Acrich 3 technology.

SEMI-GAS broadens gas mixing capabilities for highly corrosive gases

Thu, 8 Aug 2014
SEMI-GAS Systems, a provider of ultra-high purity gas delivery equipment, recently broadened the capabilities of its custom Xturion Blixer gas blender product line.

A new, tunable device for spintronics

Fri, 8 Aug 2014
An international team of scientists including physicist Jairo Sinova from the University of Mainz realises a tunable spin-charge converter made of GaAs.

Copper shines as flexible conductor

Fri, 8 Aug 2014
Bend them, stretch them, twist them, fold them: modern materials that are light, flexible and highly conductive have extraordinary technological potential, whether as artificial skin or electronic paper.

MEI Wet Processing Systems reveals performance data for new critical etch system

Tue, 9 Sep 2014
MEI Wet Processing Systems and Services revealed performance data today on its newly released Cu & TiW Critical Etch System for compound semiconductor manufacturing.

TowerJazz and Triune Systems announce Neo-Iso Products ramping to mass production

Tue, 9 Sep 2014
TowerJazz, the global specialty foundry, and Triune Systems LLC, a mixed signal and power management IC provider, today announced that Triune has developed a proprietary isolated power and data technology using the TowerJazz TS18PM process on its 0.18um based power management platform.

Breakthrough in light sources for new quantum technology

Tue, 9 Sep 2014
Electronic circuits are based on electrons, but one of the most promising technologies for future quantum circuits are photonic circuits, i.e. circuits based on light (photons) instead of electrons.

Analog Devices releases high-temperature MEMS gyroscope

Wed, 9 Sep 2014
Analog Devices, Inc. today introduced the first and only MEMS gyroscope specified to withstand temperatures of up to 175 degrees Celsius commonly encountered by oil and gas drilling equipment.

Samsung adopts ProPlus Designs' 14nm finFET process

Wed, 9 Sep 2014
ProPlus Design Solutions, Inc. today announced Samsung Electronics has extended its partnership with ProPlus through the deployment of ProPlus' BSIMProPlus modeling platform for its 14-nanometer (nm) FinFET SPICE modeling.

UCSB researchers develop ultra sensitive biosensor from molybdenite semiconductor

Thu, 9 Sep 2014
Move over, graphene. An atomically thin, two-dimensional, ultrasensitive semiconductor material for biosensing developed by researchers at UC Santa Barbara promises to push the boundaries of biosensing technology in many fields, from health care to environmental protection to forensic industries.

Sidense demonstrates working one-time programmable bit cells in TSMC 16nm finFET technology

Fri, 9 Sep 2014
Sidense Corp., a developer of non-volatile memory OTP IP cores, today announced that it successfully demonstrated read and write capability for its 1T-OTP bit-cell architecture on test silicon fabricated in a 16nm CMOS FinFET process.

Cree SiC MOSFETs help power Japan’s growing solar energy infrastructure

Mon, 9 Sep 2014
Cree, Inc. has announced that its C2M, 1200V, 80mOhm SiC MOSFETs have been selected by Sanix Corporation, Japan, to be designed into their new 9.9kW three-phase solar inverters for use in the construction of commercial photovoltaic systems in the fast-growing Japanese solar energy market.

Layered graphene sandwich for next generation electronics

Mon, 9 Sep 2014
Sandwiching layers of graphene with white graphene could produce designer materials capable of creating high-frequency electronic devices, University of Manchester scientists have found.

Doped graphene nanoribbons with potential

Mon, 9 Sep 2014
Researchers from Empa and the Max Planck Institute for Polymer Research have now developed a new method to selectively dope graphene molecules with nitrogen atoms.

NSF and SRC announce research awards to 10 universities

Tue, 9 Sep 2014
The National Science Foundation (NSF) and Semiconductor Research Corporation (SRC) today announced nine research awards to 10 universities totaling nearly $4 million under a joint program focused on Secure, Trustworthy, Assured and Resilient Semiconductors and Systems (STARSS).

GLOBALFOUNDRIES and SRC announce new scholarship for undergraduate engineering students

Tue, 9 Sep 2014
GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced the “GLOBALFOUNDRIES Undergraduate Research Scholarship,” a new scholarship recognizing and rewarding aspiring, leadership-oriented engineering students interested in careers in the semiconductor industry.

Fermilab implements Ziptronix's DBI hybrid bonding in high-end 3D image sensors

Tue, 9 Sep 2014
Ziptronix Inc. today announced that its Direct Bond Interconnect (DBI) hybrid bonding has been implemented by Fermi National Accelerator Laboratory (Fermilab) to improve the performance of high-end 3D sensor arrays, which are used for particle detection in large-scale particle physics and x-ray imaging experiments.

Intematix and SABIC collaborate to deliver increased efficiency solutions for LED systems

Tue, 9 Sep 2014
Intematix Corporation, a manufacturer of phosphor solutions for LED lighting, has collaborated with SABIC's Innovative Plastics business to create the ChromaLit Linear - a LED offering developed for the lighting industry.

Global shutter image sensors

Tue, 9 Sep 2014
Different GS pixel architectures and technologies are presented and performances compared.

Leti and LUCIOM focusing on high-data-rate bidirectional transceivers for enriched LiFi applications

Wed, 9 Sep 2014
CEA-Leti and LUCIOM, which develops visible-light communication using light-emitting diodes (LEDs), have launched a project to develop high-data-rate LiFi transceivers.

Beautiful, brilliant people

Wed, 9 Sep 2014
It would be difficult to overstate how critical the development of a workable, high volume manufacturing EUV lithography solution is to the semiconductor industry.

eBeam Initiative Survey indicates new eBeam expectations for photomask production

Tue, 9 Sep 2014
Continued semiconductor scaling drives new mask design requirements; use of complex mask shapes predicted to increase

Element Six selected by European Consortium as a partner to develop ultrafast pulse disk lasers

Tue, 9 Sep 2014
Element Six today announced it has been selected by the European Commission’s Seventh Framework Programme for Research and Technological Development to help develop a new ultrafast pulse disk laser.

Veeco Ion Beam Deposition technology reaches significant milestone to support EUV commercialization roadmap

Wed, 9 Sep 2014
Veeco Instruments Inc. announced today that its new Odyssey Ion Beam Deposition (IBD) Upgrade for the NEXUS IBD-LDD System has repeatedly produced photomask blanks with zero deposition defects larger than 70nm.

Oxford Instruments launches 3rd annual Indian nanotechnology seminars in Kolkata and Delhi

Thu, 9 Sep 2014
Oxford Instruments is hosting its third series of annual seminars for the nanotechnology industry in India in November.

New research proves whiteness and color rendering has strong effect on LED lamp preference

Thu, 9 Sep 2014
Soraa, a developer of GaN on GaN LED technology, announced today new psychophysical research proving that whiteness and color rendering have a strong effect on the perception of energy-efficient LED lighting.

Samsung now mass producing industry’s first 20nm 6Gb LPDDR3 mobile DRAM

Thu, 9 Sep 2014
The new mobile memory chip will enable longer battery run-time and faster application loading on large screen mobile devices with higher resolution.

Making quantum dots glow brighter

Thu, 9 Sep 2014
Ultrathin layers of metal oxides can change the way quantum dots behave, in some cases turning them into more efficient light emitters.

Toward optical chips

Fri, 9 Sep 2014
A promising light source for optoelectronic chips can be tuned to different frequencies.

Northeastern University researchers develop novel method for working with nanotubes

Fri, 9 Sep 2014
Northeastern University researchers have developed a novel method for controllably constructing precise inter-nanotube junctions and a variety of nanocarbon structures in carbon nanotube arrays.

NVIDIA unveils Maxwell GPU architecture

Fri, 9 Sep 2014
In a major leap forward for gaming, NVIDIA today introduced the first high-end products based on its Maxwell chip architecture -- the new GeForce GTX 980 and 970 GPUs -- delivering unmatched performance, major new graphics capabilities and twice the energy efficiency of the previous generation.

Vesper launches with very high SNR MEMS microphone

Mon, 9 Sep 2014
Intending to improve the smallest audio component found in smartphones, wearables and Internet of Things (IoT) devices, a new Boston-based sensor company called Vesper has designed a microphone that will enhance consumers' acoustic experience with voice capture and sound recording.

Physicists heat freestanding graphene to control curvature of ripples

Mon, 9 Sep 2014
An international team of physicists, led by a research group at the University of Arkansas, has discovered that heating can be used to control the curvature of ripples in freestanding graphene.

Future flexible electronics based on carbon nanotubes

Wed, 9 Sep 2014
Study in Applied Physics Letters show how to improve nanotube transistor and circuit performance with fluoropolymers

Flexible LEDs

Wed, 9 Sep 2014
Flexible light-emitting diode (LED) displays and solar cells crafted with inorganic compound semiconductor micro-rods are moving one step closer to reality, thanks to graphene and the work of a team of researchers in Korea.

Southampton scientists grow a new challenger to graphene

Wed, 9 Sep 2014
A team of researchers from the University of Southampton's Optoelectronics Research Centre (ORC) has developed a new way to fabricate a potential challenger to graphene.

Honeywell advanced materials help mobile devices dissipate heat

Thu, 9 Sep 2014
Honeywell Electronic Materials announced today that its advanced materials are being integrated into the production of tablets and smartphones, helping them stay cool and perform better.

Photomask Technology speaker says EUV is nearly production-ready

Fri, 10 Oct 2014
Highlights at the recent SPIE Photomask Technology 2014 conference included a confident announcement from ASML about current EUV source capabilities, an insightful industry-expert panel discussion on mask-making complexities, and fresh energy from the co-located SPIE Scanning Microscopies conference.

New technology may lead to prolonged power in mobile devices

Tue, 9 Sep 2014
Researchers from The University of Texas at Dallas have created technology that could be the first step toward wearable computers with self-contained power sources or, more immediately, a smartphone that doesn’t die after a few hours of heavy use.

All directions are not created equal for nanoscale heat sources

Wed, 10 Oct 2014
Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths.

Quantum Materials scaling up photoactive quantum dot production for solar power generation

Wed, 10 Oct 2014
Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies.

FlipChip International creates 250 multi-product wafer bump designs

Wed, 10 Oct 2014
FlipChip International (FCI), the global technology leader in flip chip bumping and advanced wafer level packaging, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013.

Crumpled graphene could provide an unconventional energy storage

Fri, 10 Oct 2014
Two-dimensional carbon 'paper' can form stretchable supercapacitors to power flexible electronic devices.

Platinum meets its match in quantum dots from coal

Fri, 10 Oct 2014
Graphene quantum dots created at Rice University grab onto graphene platelets like barnacles attach themselves to the hull of a boat. But these dots enhance the properties of the mothership, making them better than platinum catalysts for certain reactions within fuel cells.

EV Group unveils room-temperature covalent bonder

Mon, 10 Oct 2014
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 580 ComBond.

Albert Theuwissen of Harvest Imaging honored with European SEMI Award 2014

Wed, 10 Oct 2014
Albert Theuwissen, CEO of Harvest Imaging and professor at Delft University of Technology, is the recipient of the European SEMI Award 2014.

Next-generation nanoimprint lithography technology

Tue, 10 Oct 2014
EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process.

Seoul Semiconductor announces the mass production of the Acrich MJT 3030

Thu, 10 Oct 2014
Seoul Semiconductor, a global LED manufacturer, announced the availability of Acrich MJT 3030 a new LED in the Acrich MJT product family which improves on performance and enables lower system costs.

A novel platform for future spintronic technologies

Mon, 10 Oct 2014
Scientists at EPFL, working with Université Paris-Sud and Paul Scherrer Institut, have discovered that a common insulating material behaves as a perfect spintronic conductor because it is not affected by background electron charge.

Revving up fluorescence for superfast LEDs

Mon, 10 Oct 2014
Duke University researchers have made fluorescent molecules emit photons of light 1,000 times faster than normal -- setting a speed record and making an important step toward realizing superfast light emitting diodes (LEDs) and quantum cryptography.

Smallest world record has 'endless possibilities' for bio-nanotechnology

Mon, 10 Oct 2014
Scientists from the University of Leeds have taken a crucial step forward in bio-nanotechnology, a field that uses biology to develop new tools for science, technology and medicine.

Printing in the hobby room: Paper-thin and touch-sensitive displays on various materials

Mon, 10 Oct 2014
What if you could integrate paper-thin displays into the cards, which could be printed at home and which would be able to depict self-created symbols or even react to touch? Those only some of the options computer scientists in Saarbrücken can offer.

The mystery of reed relays: Understanding specifications

Wed, 10 Oct 2014
Specifications of reed relays, which are used for current switching in ATE and other applications are explained, including carry current, lifetime, minimum switch capacity, hot switching, operating speed and thermoelectric switching.

Element Six introduces new thermal grade of CVD diamond

Wed, 10 Oct 2014
Element Six this week announced the development of a new thermal grade of diamond grown by chemical vapor deposition (CVD), DIAFILM TM130.

Beyond LEDs: Brighter, new energy-saving flat panel lights based on carbon nanotubes

Thu, 10 Oct 2014
Planar light source using a phosphor screen with highly crystalline single-walled carbon nanotubes (SWCNTs) as field emitters demonstrates its potential for energy-efficient lighting device.

Magnetic mirrors enable new technologies by reflecting light in uncanny ways

Fri, 10 Oct 2014
As in Alice’s journey through the looking-glass to Wonderland, mirrors in the real world can sometimes behave in surprising and unexpected ways, including a new class of mirror that works like no other.

Semiconductor “dust” enables low cost solar cells, LEDs

Fri, 10 Oct 2014
The U.S. Patent Office has issued US Patent No. 8,859,310 to Versatilis LLC that shows how fine semiconductor particles, powders or fines, often the waste byproduct of dicing semiconductor wafers into ever smaller chips, can be processed into a sea of low cost solar cells or micro-LEDs.

MEMS Industry Group goes to the 'Shark Tank' for MEMS and sensor-based products

Mon, 10 Oct 2014
MIG announces finalists for Elevator Pitch Session at MEMS Executive Congress US 2014.

Entegris' VaporSorb filter line protects advanced yield production

Tue, 10 Oct 2014
Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters.

Special UO microscope captures defects in nanotubes

Tue, 10 Oct 2014
University of Oregon chemists have devised a way to see the internal structures of electronic waves trapped in carbon nanotubes by external electrostatic charges.

Samsung starts mass production of 8Gb DDR4 based on 20nm process technology

Wed, 10 Oct 2014
Samsung today announced that it is mass producing the industry’s most advanced 8-gigabit (Gb) DDR4 memory and 32-gigabyte (GB) module, both of which will be manufactured based on a new 20-nanometer (nm) process technology, for use in enterprise servers.

Imec presents back-side illuminated CMOS image sensor with UV-optimized antireflective coating

Tue, 11 Nov 2014
At this week’s VISION 2014 exhibition, imec presents a backside-illuminated (BSI) CMOS image sensor chip featuring a new anti-reflective coating (ARC) optimized for UV light.

Cree's new SC5 Technology Platform doubles light output to radically lower system cost

Thu, 10 Oct 2014
This new class of LEDs can reduce system costs by up to 40 percent in most lighting applications.

SMIC and Maxscend collaborate on 55nm RF IP platform

Thu, 10 Oct 2014
Semiconductor Manufacturing International Corporation and Maxscend Technologies Inc., a RF IP company based in China, announced that Maxscend Bluetooth RF IP has been silicon proven on SMIC's 55nm low leakage logic process.

New 3D display technology promises greater energy efficiency

Thu, 10 Oct 2014
LCD technology developed in Hong Kong maintains the 3D images it displays without drawing power.

TSMC, Kilopass deliver non-volatile memory for the 16nm finFET process node

Tue, 10 Oct 2014
Kilopass Technology Inc., a provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), announced today that it has successfully ported its one-time programmable (OTP) NVM technology to TSMC's 16 nanometer (nm) FinFET process.

Synopsys announces availability of DesignWare, non-volatile memory IP for TowerJazz 180nm process technology

Thu, 10 Oct 2014
Synopsys, Inc. today announced the availability of the silicon-proven DesignWare AEON Few Time Programmable (FTP) Trim Non-Volatile Memory (NVM) IP for TowerJazz 180-nanometer (nm) SL process technology.

Rice chemists gain edge in next-generation energy

Tue, 11 Nov 2014
Rice University scientists who want to gain an edge in energy production and storage report they have found it in molybdenum disulfide.

Better bomb-sniffing technology

Tue, 11 Nov 2014
University of Utah engineers have developed a new type of carbon nanotube material for handheld sensors that will be quicker and better at sniffing out explosives, deadly gases and illegal drugs.

'Nanomotor lithography' answers call for affordable, simpler device manufacturing

Tue, 11 Nov 2014
Nanoengineers at the University of California, San Diego recently invented a new method of lithography in which nanoscale robots swim over the surface of light-sensitive material to create complex surface patterns that form the sensors and electronics components on nanoscale devices.

Crocus MLU sensors aim to put more 'flex' into flexible displays

Wed, 11 Nov 2014
Crocus Technology, a provider of magnetically enhanced semiconductor technologies and products, today announces a new Magnetic Logic Unit (MLU) based solution that can detect the position and shape of flexible two dimensional surfaces.

Clearing a path for electrons in polymers: Closing in on the speed limits

Wed, 11 Nov 2014
Researchers from the University of Cambridge have identified a class of low-cost, easily-processed semiconducting polymers which, despite their seemingly disorganised internal structure, can transport electrons as efficiently as expensive crystalline inorganic semiconductors.

ORNL thermomagnetic processing method provides path to new materials

Thu, 11 Nov 2014
For much the same reason LCD televisions offer eye-popping performance, a thermomagnetic processing method developed at the Department of Energy’s Oak Ridge National Laboratory can advance the performance of polymers.

Soraa solves compatibility issues by launching new constant current LED lamp

Mon, 11 Nov 2014
Soraa announced today that it has introduced a perfectly compatible version of its award-winning MR16 LED lamp.

Sand 9 granted core patent for piezoelectric MEMS microphones

Mon, 11 Nov 2014
Sand 9, Inc., a developer of piezoelectric MEMS timing products for wireless and wired applications, today announced that the United States Patent and Trademark Office has granted the company a core patent based on the use of piezoelectric MEMS for a wafer-level, chip-scale packaged microphone.

On-demand conductivity for graphene nanoribbons

Mon, 11 Nov 2014
New research may help to develop graphene-based electronic devices that only become conductors when an external ultra-short pulse is applied, and are otherwise insulators.

Freescale and Intel processors now active at Rochester Electronics

Tue, 11 Nov 2014
Rochester Electronics, a fully-authorized manufacturer and distributor of semiconductors, will launch 2015 with the re-introduction of many popular processors from Freescale and Intel.

Bending -- but not breaking -- in search of new materials

Wed, 11 Nov 2014
Researchers at Drexel University and Dalian University of Technology in China have chemically engineered a new, electrically conductive nanomaterial that is flexible enough to fold, but strong enough to support many times its own weight.

Samsung heats up indoor lighting market with 6W and 8W chip-on-board LED packages

Thu, 11 Nov 2014
Samsung Electronics Co. today introduced new chip-on-board (COB) LED package products, the LC006B and LC008B, with six and eight watts of power respectively.

Display industry recognizes Plastic Logic's flexible AMOLED technology with Innovation Excellence Award

Thu, 11 Nov 2014
Plastic Logic, experts in the development and industrialisation of flexible organic electronics, won the OLED Innovation Excellence award for its truly flexible AMOLED display technology.

New way to move atomically thin semiconductors for use in flexible devices

Thu, 11 Nov 2014
Researchers from North Carolina State University have developed a new way to transfer thin semiconductor films, which are only one atom thick, onto arbitrary substrates, paving the way for flexible computing or photonic devices.

New process isolates promising material

Tue, 11 Nov 2014
Molybdenum disulfide has emerged as a leading successor to graphene.

DuPont Microcircuit Materials introduces pure copper conductive ink

Fri, 11 Nov 2014
DuPont Microcircuit Materials introduced its first pure copper conductive ink for photonic curing, DuPont PE510 copper conductor.

Revolutionary solar-friendly form of silicon shines

Tue, 11 Nov 2014
Silicon is the second most-abundant element in the earth's crust. When purified, it takes on a diamond structure, which is essential to modern electronic devices--carbon is to biology as silicon is to technology. A team of Carnegie scientists led by Timothy Strobel has synthesized an entirely new form of silicon, one that promises even greater future applications.

Canatu launches CNB in-mold film for transparent touch on 3D Surfaces

Wed, 11 Nov 2014
Canatu today launched CNB In-Mold Film, a stretchable, formable, conductive film optimized for 3D formed capacitive touch displays and touch surfaces in automobile center consoles and dashboards, home appliance control panels, remote controls, smartwatches and portable electronic devices.

Dynaloy unveils safer cleaners

Wed, 11 Nov 2014
In response to evolving industry trends and customer preferences for products with better environmental, health, and safety (EHS) profiles, Dynaloy LLC is launching three new formulated products that offer exceptional performance without the use of certain chemicals, while continuing to offer its line of traditional cleaners.

Holst Centre, imec and CARTAMUNDI join forces to create the near field communication chip of the future

Wed, 11 Nov 2014
Holst Centre, set up by the Belgian nanoelectronics research center imec and the Dutch research institute TNO, and Cartamundi NV have announced a collaboration to develop ultra-thin flexible near field communication (NFC) tags.

NC State researchers create 'nanofiber gusher'

Thu, 3 Mar 2015
Engineers and researchers at North Carolina State University and one of its start-up companies have now reported a method that can produce unprecedented amounts of polymer nanofibers, which have potential applications in filtration, batteries and cell scaffolding.

Georgia Tech research offers novel cellular sensing platform for expanded use of semiconductor in biotech applications

Thu, 4 Apr 2015
Researchers from the Georgia Institute of Technology have developed a novel cellular sensing platform that promises to expand the use of semiconductor technology in the development of next-generation bioscience and biotech applications.

SCHOTT advances MEMS technology by using HermeS glass wafers with through glass vias

Wed, 11 Nov 2014
The international technology group SCHOTT is expanding its HermeS wafers with hermetically sealed, solid through glass vias (TGV) into MEMS applications.

A path to brighter images and more efficient LCD displays

Thu, 11 Nov 2014
University of Utah engineers have developed a polarizing filter that allows in more light, leading the way for mobile device displays that last much longer on a single battery charge and cameras that can shoot in dim light.

GIGAPHOTON provides new function for 50% reduction of neon gas consumption for ArF immersion laser users

Tue, 11 Nov 2014
Gigaphoton Inc., a lithography light source manufacturer, today announces the provision of a new function, called “eTGM (eco-Total Gas Management),” for the existing users of its flagship high-output GT Series of ArF immersion laser products free of charge for a fixed period of time.

UO-industry collaboration points to improved nanomaterials

Fri, 11 Nov 2014
A potential path to identify imperfections and improve the quality of nanomaterials for use in next-generation solar cells has emerged from a collaboration of University of Oregon and industry researchers.

Physicists and chemists work to improve digital memory technology

Mon, 11 Nov 2014
The improvements in random access memory that have driven many advances of the digital age owe much to the innovative application of physics and chemistry at the atomic scale.

Hybrid Memory Cube Consortium releases new specification

Mon, 11 Nov 2014
The Hybrid Memory Cube Consortium (HMCC), dedicated to the development and establishment of an industry-standard interface specification for Hybrid Memory Cube (HMC) technology, today announced the finalization and public availability of its HMCC 2.0 specification (HMCC 2.0).

Research yields material made of single-atom layers that snap together like Legos

Tue, 11 Nov 2014
Physicists at the University of Kansas have fabricated an innovative substance from two different atomic sheets that interlock much like Lego toy bricks.

Protons fuel graphene prospects

Wed, 11 Nov 2014
Published in the journal Nature, the discovery could revolutionise fuel cells and other hydrogen-based technologies as they require a barrier that only allow protons - hydrogen atoms stripped off their electrons - to pass through.

Van der Waals force re-measured

Wed, 11 Nov 2014
Although the van der Waals force was discovered around 150 years ago, it is still difficult to quantify when predicting the behaviour of solids, liquids, and molecules.

Cymer announces its new XLR 700ix DUV light source

Mon, 12 Dec 2014
Cymer, LLC, an ASML company, a supplier of light sources used by chipmakers to pattern advanced semiconductor chips, today announced its new argon fluoride (ArF) immersion light source, the XLR 700ix.

Imec partners with Huawei on high-bandwidth optical data link technology

Wed, 12 Dec 2014
Nanoelectronics research center imec and global ICT leader Huawei announced today that they have taken a further step in their strategic partnership focusing on optical data link technology.

AXSEM and SIGFOX announce ‘ultra-low-power’ System-on-Chip solution

Wed, 12 Dec 2014
AXSEM, a developer of lowest-power radio microcontrollers, and SIGFOX, a developer of cost-effective, energy-efficient Internet of Things connectivity, today announced that AXSEM’s system-on-chip (SoC) with an AX8052 microcontroller has been certified SIGFOX Ready for two-way connectivity.

Wireless nanorod-nanotube film enables light stimulation of blind retina

Wed, 12 Dec 2014
Breakthrough could lead to artificial retinas for visually impaired. Combining semiconductor nanorods and carbon nanotubes, it could potentially form part of a future prosthetic device that replaces damaged retinal cells.

Imec and Holst Centre announce IC and open hardware development kit for personal health monitoring

Thu, 12 Dec 2014
At next week’s mHealth Summit 2014, held Dec. 7-11 in Washington, D.C., nanoelectronics research center imec and Holst Centre will showcase at their booth a development kit based on an open hardware platform using a highly integrated multi-sensor data acquisition chip.

High photosensitivity 2-D-few-layered molybdenum diselenide phototransistors

Mon, 12 Dec 2014
Two-dimensional (2D) layered materials are now attracting a lot of interest due to their unique optoelectronic properties at atomic thicknesses.

Crossbar to demonstrate resistive RRAM innovation at IEDM 2014

Tue, 12 Dec 2014
Crossbar, Inc., a start-up company pioneering a new category of very high capacity and high-performance non-volatile memory, today announced it will be disclosing another major technology breakthrough in their development of Resistive RAM (RRAM) at next week’s IEEE International Electron Devices Meeting (IEDM).

OCEASOFT harnesses SIGFOX IoT network in Cobalt S3 sensor family for cloud connectivity

Tue, 12 Dec 2014
Industrial Internet of Things sensor-monitoring solution opens new vistas in pollution and environmental applications, other remote-sensing sectors.

Entegris launches next generation of 450mm wafer carriers

Wed, 12 Dec 2014
Entegris, Inc., a developer of yield-enhancing materials and solutions for highly advanced manufacturing environments, announced the release and global availability of their next generation of 450mm wafer carrier solutions (P2) for the safe and reliable transport of 450mm wafers used in semiconductor manufacturing.

Holst Centre and imec develop thin-film hybrid oxide-organic microprocessor

Thu, 12 Dec 2014
Holst Centre, imec and their partner Evonik have realized a general-purpose 8-bit microprocessor, manufactured using complementary thin-film transistors (TFTs) processed at temperatures compatible with plastic foil substrates (250°C).

Leti will discuss CoolCube technology for 3D transistor stacking at workshop preceding IEDM 2014

Thu, 12 Dec 2014
CEA-Leti will present its latest results on CoolCube, the technique for stacking transistors sequentially in the same process flow for 3D-VLSI, at a Dec. 14 workshop in San Francisco, Calif.

System Plus analyzes the world's smallest microbolometer-based thermal imaging camera core released by FLIR

Thu, 12 Dec 2014
Initially focused on the military, uncooled thermal camera sales have grown significantly due to substantial cost reduction of micro bolometers and growing adoption in commercial markets, including thermography, automotive and surveillance applications.

LED manufacturing with NMP-free resist stripping

Fri, 12 Dec 2014
The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry.

Scientists measure speedy electrons in silicon

Fri, 12 Dec 2014
An international team of physicists and chemists based at the University of California, Berkeley, has for the first time taken snapshots of this ephemeral event using attosecond pulses of soft x-ray light lasting only a few billionths of a billionth of a second.

Lead islands in a sea of graphene magnetize the material of the future

Tue, 12 Dec 2014
Researchers in Spain have discovered that if lead atoms are intercalated on a graphene sheet, a powerful magnetic field is generated by the interaction of the electrons' spin with their orbital movement.

Imec demonstrates broadband graphene optical modulator on silicon

Wed, 12 Dec 2014
At this week’s IEEE International Electron Devices Meeting (IEDM 2014), nanoelectronics research center imec and its associated lab at Ghent University have demonstrated the industry’s first integrated graphene optical electro-absorption modulator (EAM) capable of 10Gb/s modulation speed.

Imec presents ultralow power RFID transponder chip in thin-film transistor technology on plastic at IEDM 2014

Wed, 12 Dec 2014
At this week’s IEDM 2014, held in San Francisco, California, nanoelectronics research center imec demonstrated an ultra-low power RFID transponder chip.

From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

Thu, 12 Dec 2014
Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling.

Zinc oxide materials tapped for tiny energy harvesting devices

Tue, 1 Jan 2015
New research helps pave the way toward highly energy-efficient zinc oxide-based micro energy harvesting devices with applications in portable communications, healthcare and environmental monitoring, and more.

Piezoelectricity in a 2-D semiconductor

Mon, 12 Dec 2014
Berkeley Lab researchers discovery of piezoelectricty in molybdenum disulfide holds promise for future MEMS.

Hands on: Crafting ultrathin color coatings

Mon, 12 Dec 2014
In Harvard's high-tech cleanroom, applied physicists produce vivid optical effects on paper.

MEMSensing launches the world's smallest commercial 3-axis accelerometer with SMIC

Mon, 1 Jan 2015
MEMSensing Microsystems Co. and Semiconductor Manufacturing International Corporation jointly announced the launch of the world's smallest 3-axis accelerometer MSA330, which utilizes SMIC's CMOS integrated MEMS device fabrication and TSV-based wafer level packaging technologies.

HLMC develops specialty technology in pursuit of growing IoT market

Mon, 1 Jan 2015
Chinese IC manufacturer Shanghai Huali Microelectronics Corporation gave a presentation on its outlook for the Internet of Things (IoT) market and the wide application of its specialty technology at the 2014 China Semiconductor Industry Association IC Design Branch Annual Conference ("ICCAD"), which was recently held at Hong Kong Science Park.

ON Semiconductor demonstrates high efficiency 3D sensor stacking technology

Tue, 1 Jan 2015
ON Semiconductor has successfully characterized and demonstrated its first fully-functional stacked CMOS imaging sensor featuring a smaller die footprint, higher pixel performance and better power consumption compared to traditional monolithic non-stacked designs.

Shedding light on why blue LEDS are so tricky to make

Thu, 1 Jan 2015
Scientists at UCL, in collaboration with groups at the University of Bath and the Daresbury Laboratory, have uncovered the mystery of why blue light-emitting diodes (LEDs) are so difficult to make, by revealing the complex properties of their main component - gallium nitride - using sophisticated computer simulations.

Silicon Space Technology partners with GLOBALFOUNDRIES to deliver processors and memory solutions

Fri, 1 Jan 2015
Silicon Space Technology, an industry innovator in high-temp and rad-hard embedded system solutions, announced today the company has partnered with GLOBALFOUNDRIES to build commercial-ready products for extreme environments and applications.

Graphene plasmons go ballistic

Mon, 1 Jan 2015
Graphene combined with the insulting power of boron nitride enables light control in tiny circuits with dramatically reduced energy loss.

MagnaChip offers automotive semiconductor manufacturing process technology

Tue, 1 Jan 2015
MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products announced today that it has started to offer 0.18um automotive qualified process technology to foundry customers focused on high reliability automotive semiconductor applications.

SAMCO announces MOCVD demonstration availability for the GaN-550 MOCVD system

Thu, 1 Jan 2015
SAMCO has announced MOCVD demonstration capability on a new gallium nitride (GaN-on-Si) system, the GaN-550, from Valence Process Equipment Inc.

UC Berkeley Extension launches three online programs in semiconductor technology

Thu, 1 Jan 2015
UC Berkeley Extension announces three online integrated circuit (IC) semiconductor technology programs to meet the training needs of the surging worldwide semiconductor industry; the industry is predicted to reach $345 billion in sales this year.

Samsung Electronics starts mass producing industry’s first 8-gigabit graphics DRAM

Thu, 1 Jan 2015
Samsung Electronics Co., Ltd. announced today that it has begun mass producing the industry’s first 8 gigabit (Gb) GDDR5 DRAM, based on the company’s leading-edge 20-nanometer (nm) process technology.

AKHAN Semiconductor first to invent fully transparent circuit creation process

Thu, 1 Jan 2015
Adam Khan, founder and CEO of AKHAN Semiconductor, Inc. was granted a US patent by the US Patent and Trademark Office today for a groundbreaking process that adheres diamond, the only truly transparent semiconductor, to metals and alloys (including transparent metals) in a way that allows for reliable wire bonding and high conductivity.

Solving an organic semiconductor mystery

Fri, 1 Jan 2015
Berkeley Lab researchers uncover hidden structures in domain interfaces that hamper performance.

Temporary tattoo offers needle-free way to monitor glucose levels

Fri, 1 Jan 2015
Nanoengineers at the University of California, San Diego have tested a temporary tattoo that both extracts and measures the level of glucose in the fluid in between skin cells. This first-ever example of the flexible, easy-to-wear device could be a promising step forward in noninvasive glucose testing for patients with diabetes.

Rice-sized laser, powered one electron at a time, bodes well for quantum computing

Fri, 1 Jan 2015
Princeton University researchers have built a rice grain-sized laser powered by single electrons tunneling through artificial atoms known as quantum dots.

Carbon nanotube finding could lead to flexible electronics with longer battery life

Fri, 1 Jan 2015
University of Wisconsin-Madison materials engineers have made a significant leap toward creating higher-performance electronics with improved battery life -- and the ability to flex and stretch.

Researchers at Penn, UC Berkeley and Illinois use oxides to flip graphene conductivity

Tue, 1 Jan 2015
Graphene, a one-atom thick lattice of carbon atoms, is often touted as a revolutionary material that will take the place of silicon at the heart of electronics. The unmatched speed at which it can move electrons, plus its essentially two-dimensional form factor, make it an attractive alternative, but several hurdles to its adoption remain.

Silver nanowires demonstrate unexpected self-healing mechanism

Fri, 1 Jan 2015
With its high electrical conductivity and optical transparency, indium tin oxide is one of the most widely used materials for touchscreens, plasma displays, and flexible electronics. But its rapidly escalating price has forced the electronics industry to search for other alternatives.

Graphene enables all-electrical control of energy flow from light emitters

Fri, 1 Jan 2015
Scientists from ICFO, MIT, CNRS, CNISM and Graphenea have now demonstrated active, in-situ electrical control of the energy flow from erbium ions into photons and plasmons.

Scientists 'bend' elastic waves with new metamaterials that could have commercial applications

Fri, 1 Jan 2015
Engineering researchers at the University of Missouri have developed a material that has the ability to control these waves, creating possible medical, military and commercial applications with the potential to greatly benefit society.

Self-assembled nanotextures create antireflective surface on silicon solar cells

Fri, 1 Jan 2015
Scientists at the U.S. Department of Energy's Brookhaven National Laboratory show that etching a nanoscale texture onto the silicon material itself creates an antireflective surface that works as well as state-of-the-art thin-film multilayer coatings.

New Soitec eSI90 RF-SOI wafer improves RF performance of high-end smart phone components

Mon, 1 Jan 2015
Soitec (Euronext) has introduced its eSI90 substrate, the newest high-end wafer in its radio-frequency silicon-on-insulator (RF-SOI) product family.

Rice U. discovery may boost memory technology

Tue, 8 Aug 2015
Scientists at Rice University have created a solid-state memory technology that allows for high-density storage with a minimum incidence of computer errors.

New pathway to valleytronics

Tue, 1 Jan 2015
A potential avenue to quantum computing currently generating quite the buzz in the high-tech industry is "valleytronics," in which information is coded based on the wavelike motion of electrons moving through certain two-dimensional (2D) semiconductors.

CMR induced in pure lanthanum manganite

Tue, 8 Aug 2015
Colossal magnetoresistance is a property with practical applications in a wide array of electronic tools including magnetic sensors and magnetic RAM. New research successfully used high-pressure conditions to induce colossal magnetoresistance for the first time in a pure sample of a compound called lanthanum manganite, LaMnO3.

Fabrication of patterns with linewidths down to 1.5nm

Tue, 2 Feb 2015
Researchers at aBeam Technologies, Lawrence Berkeley National Laboratory and Argonne National Laboratory have developed a technology to fabricate test patterns with a minimum linewidth down to 1.5nm.

Crystal light: New light-converting materials point to cheaper, more efficient solar power

Fri, 1 Jan 2015
University of Toronto engineers study first single crystal perovskites for new applications Engineers have shone new light on an emerging family of solar-absorbing materials that could clear the way for cheaper and more efficient solar panels and LEDs.

Demystifying nanocrystal solar cells

Fri, 1 Jan 2015
Scientists are focusing on nanometer-sized crystals for the next generation of solar cells. These nanocrystals have excellent optical properties. Compared with silicon in today's solar cells, nanocrystals can be designed to absorb a larger fraction of the solar light spectrum. However, the development of nanocrystal-based solar cells is challenging.

New method allows for greater variation in band gap tunability

Fri, 1 Jan 2015
If you can't find the ideal material, then design a new one.

Status of the power electronics industry: It is now a question of integration

Mon, 2 Feb 2015
According to Yole Développement’s team, wide band gap (WBG) technologies are almost ready to be used by power electronics integrators. The question is now: How?

CARDIS, a new European effort targeting mobile early-stage cardio vascular disease detection

Tue, 2 Feb 2015
Imec, Medtronic, Ghent University and their project partners today announced the launch of the CARDIS project.

Ultra fast diaphragm valve for ALD applications

Tue, 2 Feb 2015
HAM-LET, a global manufacturer of instrumentation valves and fittings for industrial and high purity fluid and gas delivery systems is showcasing its Ultra Fast (UF series) Diaphragm Valve for Atomic Layer Deposition.

Entegris launches Dispense System optimized for 3D and MEMS applications

Tue, 2 Feb 2015
Entegris, Inc. announced the latest addition to its IntelliGen family of two-stage dispense technologies used in microelectronics manufacturing processes.

Imec introduces new snapshot hyperspectral image sensors with mosaic filter architecture

Wed, 2 Feb 2015
At next week’s SPIE Photonics West 2015, imec will present a new set of snapshot hyperspectral CMOS image sensors featuring spectral filter structures in a mosaic layout, processed per-pixel on 4x4 and 5x5 ‘Bayer-like’ arrays.

Fairchild simplifies dimmable LED lighting design

Wed, 2 Feb 2015
Fairchild, a global supplier of high-performance power semiconductor solutions, today announced the FL7734 Phase-Cut Dimmable Single- Stage LED Driver.

ROHM Semiconductor announces monolithic EDLC cell balancing IC

Thu, 2 Feb 2015
ROHM recently announced the development of a cell balancing IC that contributes to increased miniaturization, greater stability, and longer life for EDLCs.

Breakthrough may lead to industrial production of graphene devices

Mon, 2 Feb 2015
With properties that promise faster computers, better sensors and much more, graphene has been dubbed the 'miracle material'. But progress in producing it on an industrial scale without compromising its properties has proved elusive.

One-atom-thin silicon transistors hold promise for super-fast computing

Mon, 2 Feb 2015
Researchers at The University of Texas at Austin's Cockrell School of Engineering have created the first transistors made of silicene, the world's thinnest silicon material.

TMC introduces stage-base 450 with voice coil technology

Tue, 2 Feb 2015
TMC, a developer of high-performance vibration and motion cancellation technology, has introduced Stage-Base 450, its next generation of frame-mountable, active vibration and motion cancellation systems designed to control building floor vibration in semiconductor facilities, while increasing wafer-processing throughput.

Precision growth of light-emitting nanowires

Tue, 2 Feb 2015
A novel approach to growing nanowires promises a new means of control over their light-emitting and electronic properties.

Imec and Holst Centre to present key achievements at ISSCC 2015

Thu, 2 Feb 2015
At this year’s International Solid State Circuits Conference to be held in San Francisco, Calif., Feb. 22-26, imec and Holst Centre will present eight scientific papers covering groundbreaking results on ultra-low power design for wireless broadband communication, for wireless sensor networks, and organic electronics.

Researchers glimpse distortions in atomic structure of materials

Fri, 2 Feb 2015
Researchers from North Carolina State University are using a technique they developed to observe minute distortions in the atomic structure of complex materials, shedding light on what causes these distortions and opening the door to studies on how such atomic-scale variations can influence a material's properties.

Extreme-temperature electronics

Fri, 2 Feb 2015
Many industries are calling for electronics that can operate reliably in a harsh environment, including extreme temperatures above 200° Celsius.

Novel solid-state nanomaterial platform enables terahertz photonics

Tue, 2 Feb 2015
cientists are pioneering the use of nanomaterials in compact, sensitive, fast, low-cost terahertz detectors with potential in applications such as biomedical diagnostics, airport security screening and high data-rate wireless communication

A new spin on spintronics

Tue, 2 Feb 2015
A team of researchers from the University of Michigan and Western Michigan University is exploring new materials that could yield higher computational speeds and lower power consumption, even in harsh environments.

Novel crumpling method takes flat graphene from 2-D to 3-D

Tue, 2 Feb 2015
Researchers at the University of Illinois at Urbana-Champaign have developed a unique single-step process to achieve three-dimensional (3D) texturing of graphene and graphite.

MIG announces finalists for MEMS & Sensors Technology Showcase

Thu, 2 Feb 2015
Selected from a pool of applicants, finalist companies will demo their MEMS/sensors-based applications as they vie for attendees’ votes.

New nanowire structure absorbs light efficiently

Fri, 2 Feb 2015
Researchers at Aalto University, Finland have developed a new method to implement different types of nanowires side-by-side into a single array on a single substrate.

KLA-Tencor extends its 5D patterning control solution with new metrology systems

Thu, 2 Feb 2015
Today, KLA- Tencor Corporation introduced two advanced metrology systems that support the development and production of 16nm and below IC devices: Archer 500LCM and SpectraFilm LD10.

Penn researchers develop new technique for making molybdenum disulfide

Fri, 2 Feb 2015
University of Pennsylvania researchers have made an advance in manufacturing one such material, molybdenum disulphide.

The future of electronics -- now in 2-D

Fri, 2 Feb 2015
The future of electronics could lie in a material from its past, as researchers from The Ohio State University work to turn germanium--the material of 1940s transistors--into a potential replacement for silicon.

Optical nanoantennas set the stage for a NEMS lab-on-a-chip revolution

Tue, 2 Feb 2015
Newly developed tiny antennas, likened to spotlights on the nanoscale, offer the potential to measure food safety, identify pollutants in the air and even quickly diagnose and treat cancer, according to the Australian scientists who created them.

Thermal performance of 3DICs

Fri, 2 Feb 2015
3DICs are assumed to suffer from stronger thermal issues when compared to equivalent implementations in traditional single-die integration technologies.

Radio chip for the 'Internet of things'

Tue, 2 Feb 2015
At this year's Consumer Electronics Show in Las Vegas, the big theme was the "Internet of things" -- the idea that everything in the human environment, from kitchen appliances to industrial equipment, could be equipped with sensors and processors that can exchange data, helping with maintenance and the coordination of tasks.

Imec and Panasonic present breakthrough in CMOS-based transceivers for mm-wave radar systems

Wed, 2 Feb 2015
Today, at the 2015 International Solid State Circuits Conference (ISSCC), imec and Panasonic presented a transceiver chip for phase-modulated continuous-wave radar at 79GHz.

Imec demonstrates compact wavelength-division multiplexing CMOS silicon photonics transceiver

Thu, 2 Feb 2015
This week, at the 2015 International Solid State Circuits Conference (ISSCC), imec, in collaboration with Tyndall National Institute, the University of Leuven (KULeuven) and the Ghent University, demonstrated a 4x20Gb/s wavelength division multiplexing (WDM) hybrid CMOS silicon photonics transceive

Cypress debuts reliable, secure fingerprint sensing solution for mobile devices

Mon, 3 Mar 2015
The flexible solution enables designers to create custom home buttons with specialized shapes and sizes or to integrate the sensor into any mobile device’s industrial design or home button.

UT Dallas technology could make night vision, thermal imaging affordable

Wed, 3 Mar 2015
Semiconductors made in CMOS technology reach nearly 10 terahertz.

IRT Nanoelec and CMP team up to offer world’s first service for post-process 3D technologies on multi-project-wafer

Thu, 3 Mar 2015
IRT Nanoelec, an R&D consortium focused on ICT using micro- and nanoelectronics, and CMP, which provides prototyping and low-volume production of ICs and MEMS, are launching a platform for multi-project-wafer, post-process 3D integration (3D-MPW).

Graphene meets heat waves

Fri, 3 Mar 2015
In the race to miniaturize electronic components, researchers are challenged with a major problem: the smaller or the faster your device, the more challenging it is to cool it down.

SPIE 2015 Awards honor achievements in light-based technologies

Mon, 3 Mar 2015
The awards recognize outstanding technical accomplishments and meritorious service to the society.

Squeezing out new science from material interfaces

Mon, 3 Mar 2015
With more than five times the thermal conductivity of copper, diamond is the ultimate heat spreader. But the slow rate of heat flow into diamond from other materials limits its use in practice.

CEA-Leti announces launch of Silicon Impulse IC design competence center

Tue, 3 Mar 2015
CEA-Leti today announced the launch of its Silicon Impulse IC design competence center, a comprehensive IC technology platform offering IC design, advanced intellectual property, emulator and test services along with industrial multi-project wafer (MPW) shuttles.

MKS introduces the Cirrus 3-XD Atmospheric gas analysis system

Tue, 3 Mar 2015
MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced the Cirrus 3-XD Atmospheric gas analysis system in both benchtop and rack mounted models.

Mid-IR frequency combs enable high resolution spectroscopy for sensitive gas sensing

Tue, 3 Mar 2015
The results are an important step towards a small-footprint chip scale mid-infrared frequency comb source.

Marktech Optoelectronics adds miniature Point Source LED packages to product lineup

Wed, 3 Mar 2015
Marktech Optoelectronics Corp. announces the addition of a PLCC-4 and miniature ceramic package to the 650nm and 850nm Point Source LED series.

Dramatic results achieved in cleaving glass using ultra-short pulsed lasers

Wed, 3 Mar 2015
ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cleaving and drilling of glass up to 10mm thickness.

Engineers create chameleon-like artificial 'skin' that shifts color on demand

Thu, 3 Mar 2015
Borrowing a trick from nature, engineers from the University of California at Berkeley have created an incredibly thin, chameleon-like material that can be made to change color -- on demand -- by simply applying a minute amount of force.

New technology may double radio frequency data capacity

Fri, 3 Mar 2015
Columbia engineers invent nanoscale IC that enables simultaneous transmission and reception at the same frequency in a wireless radio.

Microsemi introduces second generation 64GB solid state drive

Tue, 3 Mar 2015
Microsemi Corporation, a provider of semiconductor solutions differentiated by power, security, reliability and performance, today introduced its second generation highly secure 64 gigabyte (GB) solid state drive (SSD).

EV Group releases new configurations to its high-vacuum wafer bonding technology

Tue, 3 Mar 2015
EV Group introduced two new configurations to its EVG 580 ComBond series of automated high-vacuum covalent wafer bonding systems.

Notchless wafer standard approved

Tue, 3 Mar 2015
450mm notchless wafer standardization has been under discussion for over a year.

MACOM announces new 650 W GaN on SiC HEMT pulsed power transistor

Wed, 3 Mar 2015
M/A-COM Technology Solutions Inc. today announced a 650 W gallium nitride (GaN) on silicon carbide (SiC) HEMT pulsed power transistor for L-band pulsed avionics applications.

Rice fine-tunes quantum dots from coal

Wed, 3 Mar 2015
Rice University scientists gain control of electronic, fluorescent properties of coal-based graphene.

Cambridge Nanotherm publishes results of first independent test of thermal management substrates for LEDs

Thu, 3 Mar 2015
The tests were conducted by The LIA Laboratories (part of The LIA - Europe’s largest lighting trade association) and showed Cambridge Nanotherm’s thermal management technology outperforming all the thermal management substrates tested in terms of its thermal conductivity.

UW scientists build a nanolaser using a single atomic sheet

Tue, 3 Mar 2015
University of Washington scientists have built a new nanometer-sized laser -- using the thinnest semiconductor available today -- that is energy efficient, easy to build and compatible with existing electronics.

Silicon Labs and Digi-Key challenge developer innovation with "Your IoT" design competition

Tue, 3 Mar 2015
Silicon Labs and Digi-Key today announced an IoT design contest for pioneering developers who want to create connected "things" that will help make the world a smarter, more connected and energy-friendly place.

'Goldilocks material' could change spintronics

Tue, 3 Mar 2015
Attempting to develop a novel type of permanent magnet, a team of researchers at Trinity College in Dublin, Ireland has discovered a new class of magnetic materials based on Mn-Ga alloys.

Thin wafer processing temporary bonding adhesive film for 3D wafer integration

Tue, 3 Mar 2015
AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thin wafer processing of bonding device wafer to carrier wafer.

Imec demonstrates 50GHz Ge waveguide electro-absorption modulator

Wed, 3 Mar 2015
At this week’s OFC 2015, the largest global conference and exposition for optical communications, nanoelectronics research center imec, its associated lab at Ghent University (Intec), and Stanford University have demonstrated a compact germanium (Ge) waveguide electro-absorption modulator (EAM) with a modulation bandwidth beyond 50GHz.

ULVAC announces world's first, low temperature PZT sputtering technology

Thu, 3 Mar 2015
ULVAC, Inc. this week announced industry's first low temperature PZT sputtering technology in mass production scale, enabling future advanced MEMS device integrated on CMOS which will be the mainstream of next generation MEMS devices.

University of Illinois at Urbana-Champaign research reduces microprocessor serial link power consumption

Tue, 3 Mar 2015
SRC sponsored research promises to cut serial link power by 80 Percent, helping extend Moore’s Law.

Chemists make new silicon-based nanomaterials

Fri, 3 Mar 2015
Chemists from Brown University have come up with a way to make new nanomaterials from a silicon-based compound.

Solving molybdenum disulfide's 'thin' problem

Fri, 3 Mar 2015
Research team increases material's light emission by twelve times.

Roll up your screen and stow it away?

Tue, 3 Mar 2015
Tel Aviv University researchers develop molecular backbone of super-slim, bendable digital displays.

Pibond introduces a new product line for logic, memory, power and MEMS devices

Wed, 4 Apr 2015
Targeting 10nm node semiconductor processing, 3D NAND, power ICs as well as MEMS applications, this technology enables advanced device manufacturing through reduced cost of ownership (COO) and simplified processing.

Light-powered gyroscope is world's smallest

Wed, 4 Apr 2015
A pair of light waves - one zipping clockwise the other counterclockwise around a microscopic track - may hold the key to creating the world's smallest gyroscope: one a fraction of the width of a human hair.

Consider packaging requirements at the beginning, not the end, of the design cycle

Thu, 4 Apr 2015
Consider these eight issues where the packaging team should be closely involved with the circuit design team.

TSMC certifies Synopsys design tools for 16nm finFET plus production and for 10nm early design starts

Mon, 4 Apr 2015
This certification enables mutual customers to deploy tools in Synopsys' Galaxy Design Platform for 16nm production designs and 10nm early engagements.

Future electronics based on carbon nanotubes

Tue, 4 Apr 2015
The exceptional properties of tiny molecular cylinders known as carbon nanotubes have tantalized researchers for years because of the possibility they could serve as a successors to silicon in laying the logic for smaller, faster and cheaper electronic devices.

Web tension control in roll-to-roll web processing

Tue, 4 Apr 2015
Achieving precise registration accuracy is a factor of two related variables: web tension and transport velocity.

Better sensors for medical imaging, contraband detection

Tue, 4 Apr 2015
MIT researchers have developed a new, ultrasensitive magnetic-field detector that is 1,000 times more energy-efficient than its predecessors.

Quantization of 'surface Dirac states' could lead to exotic applications

Tue, 4 Apr 2015
Researchers from the RIKEN Center for Emergent Matter Science in Japan have uncovered the first evidence of an unusual quantum phenomenon--the integer quantum Hall effect--in a new type of film, called a 3D topological insulator.

Graphene looking promising for future spintronic devices

Fri, 4 Apr 2015
Researchers at Chalmers University of Technology have discovered that large area graphene is able to preserve electron spin over an extended period, and communicate it over greater distances than had previously been known.

New understanding of electromagnetism could enable 'antennas on a chip'

Fri, 4 Apr 2015
A team of researchers from the University of Cambridge have unravelled one of the mysteries of electromagnetism, which could enable the design of antennas small enough to be integrated into an electronic chip. These ultra-small antennas - the so-called 'last frontier' of semiconductor design - would be a massive leap forward for wireless communications.

Duke University research advances testing of 3D integrated circuits for cost-effective development of electronics

Tue, 4 Apr 2015
Duke University researchers are working to advance the tools and methodologies used to test 3D integrated circuits (ICs), which promise to help ensure the ongoing development of higher performance, lower power semiconductor chips.

Solution-grown nanowires make the best lasers

Tue, 4 Apr 2015
Take a material that is a focus of interest in the quest for advanced solar cells. Discover a "freshman chemistry level" technique for growing that material into high-efficiency, ultra-small lasers. The result, disclosed Monday, April 13 in Nature Materials, is a shortcut to lasers that are extremely efficient and able to create many colors of light.

KLA-Tencor introduces new portfolio for advanced semiconductor packaging

Thu, 4 Apr 2015
Today, KLA-Tencor Corporation announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830.

New AFM with high definition electrical measurement capabilities

Thu, 4 Apr 2015
The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications.

Engineer improves rechargeable batteries with MoS2 nano 'sandwich'

Fri, 4 Apr 2015
The key to better cellphones and other rechargeable electronics may be in tiny "sandwiches" made of nanosheets, according to mechanical engineering research from Kansas State University.

Applied Materials announces new photomask etch system

Mon, 4 Apr 2015
Applied Materials today announced the Applied Centura Tetra Z Photomask Etch system for etching next-generation optical lithographic photomasks needed by the industry to continue multiple patterning scaling to the 10nm node and beyond.

MagnaChip to offer diversified products for Internet of Things applications

Mon, 4 Apr 2015
MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products announced today that it has kicked-off an Internet of Things (IoT) task force and will offer diversified products with ultra-low power technology in anticipation of the fast growing IoT market.

Synopsys' modeling of 10nm parasitic variation effects ratified by open-source standards board

Tue, 4 Apr 2015
Synopsys, Inc. today announced new extensions to its open-source Interconnect Technology Format (ITF) which enable modeling of complex device and interconnect parasitic effects at the advanced 10-nanometer (nm) process node.

SiVance, LLC opens R&D lab to drive innovations in specialty silane and silicone technologies

Tue, 4 Apr 2015
SiVance, LLC, a subsidiary of Milliken & Company, today announced the opening of a new, 11,000 sq.ft. research and development (R&D) laboratory.

From metal to insulator and back again

Thu, 4 Apr 2015
New work from Carnegie's Russell Hemley and Ivan Naumov hones in on the physics underlying the recently discovered fact that some metals stop being metallic under pressure.

UGA chemists' synthesis of silicon oxides opens 'new world in a grain of sand'

Thu, 4 Apr 2015
In an effort that reaches back to the 19th-century laboratories of Europe, a discovery by University of Georgia chemistry researchers establishes new research possibilities for silicon chemistry and the semiconductor industry.

Surface matters: Huge reduction of heat conduction observed in flat silicon channels

Thu, 4 Apr 2015
A paper published in ACS Nano describes how the nanometre-scale topology and the chemical composition of the surface control the thermal conductivity of ultrathin silicon membranes.

Canatu launches high transmittance CNB transparent conductive film for touch sensors

Mon, 4 Apr 2015
Canatu, a manufacturer of next generation transparent conductive films and touch sensors, announces a new generation of high optical transmittance CNB (Carbon NanoBud) transparent conductive films at Printed Electronics Europe.

Two-dimensional semiconductor comes clean

Tue, 4 Apr 2015
Researchers at Columbia Engineering, Harvard, Cornell, University of Minnesota, Yonsei University in Korea, Danish Technical University, and the Japanese National Institute of Materials Science have shown that the performance of another 2D material--molybdenum disulfide (MoS2)--can be similarly improved by BN-encapsulation.

Picture this: Graphene brings 3-D holograms clearer and closer

Tue, 4 Apr 2015
From mobile phones and computers to television, cinema and wearable devices, the display of full color, wide-angle, 3D holographic images is moving ever closer to fruition, thanks to international research featuring Griffith University.

Co-design of chips, packages and boards

Wed, 5 May 2015
A new product from Mentor Graphics called Xpedition® Package Integrator provides a new methodology and platform in addition to a new suite of EDA tools.

Dow's SOLDERON tin-silver plating chemistry wins prestigious Bronze Edison Award

Fri, 5 May 2015
Dow Electronic Materials, a business unit of The Dow Chemical Company, today announced that its SOLDERON BP TS 6000 Tin-Silver Plating Chemistry was honored as a Bronze 2015 Edison Award winner in the Material Science: Manufacturing category.

Improving organic transistors that drive flexible and conformable electronics

Tue, 5 May 2015
A revolution is coming in flexible electronic technologies as cheaper, more flexible, organic transistors come on the scene to replace expensive, rigid, silicone-based semiconductors, but not enough is known about how bending in these new thin-film electronic devices will affect their performance.

Defects in atomically thin semiconductor emit single photons

Tue, 5 May 2015
Researchers at the University of Rochester have shown that defects on an atomically thin semiconductor can produce light-emitting quantum dots.

"Microcombing" creates stronger, more conductive carbon nanotube films

Tue, 5 May 2015
Researchers from North Carolina State University and China's Suzhou Institute of Nano-Science and Nano-Biotics have developed an inexpensive technique called "microcombing" to align carbon nanotubes.

New JEOL e-beam lithography system to enhance Quantum NanoFab capabilities

Wed, 5 May 2015
A JEOL e-beam lithography system will soon be a new resource for quantum information science researchers that utilize the cutting-edge facilities at the University of Waterloo Quantum NanoFab in Waterloo, Ontario.

Visualizing formation in BEOL

Thu, 5 May 2015
New tests show in real-time that cracks can run on top of and through metal layers.

Channeling valleytronics in graphene

Thu, 5 May 2015
To the list of potential applications of graphene - a two-dimensional semiconductor of pure carbon that is stronger and much faster than silicon - we can now add valleytronics.

High-performance 3-D microbattery suitable for large-scale on-chip integration

Tue, 5 May 2015
By combining 3D holographic lithography and 2D photolithography, researchers from the University of Illinois at Urbana-Champaign have demonstrated a high-performance 3D microbattery suitable for large-scale on-chip integration with microelectronic devices.

New approaches to vision with microchips holds out prospects for the blind

Mon, 5 May 2015
To date, chip-based retinal implants have only permitted a rudimentary restoration of vision. However, modifying the electrical signals emitted by the implants could change that.

New device could greatly improve speech and image recognition

Tue, 5 May 2015
Researchers have demonstrated pattern recognition using a magnonic holographic memory device.

Samsung announces ARTIK platform to accelerate Internet of Things development

Tue, 5 May 2015
Samsung Electronics Co., Ltd. today announced the Samsung ARTIK platform to allow faster, simpler development of new enterprise, industrial and consumer applications for the Internet of Things (IoT).

Freescale speeds the creation of sensor applications for a secure IoT

Thu, 5 May 2015
Freescale Semiconductor today introduced its Intelligent Sensing Framework (ISF) 2.1, which now includes integration with Freescale’s Processor Expert tool to help create, configure, and generate embedded sensor-based applications for Freescale microcontrollers (MCUs).

Freescale introduces its first GaN RF power transistor for cellular base stations

Tue, 5 May 2015
Freescale Semiconductor today introduced its first gallium nitride (GaN) RF power transistor for cellular base stations.

Researchers grind nanotubes to get nanoribbons

Mon, 6 Jun 2015
A simple way to turn carbon nanotubes into valuable graphene nanoribbons may be to grind them, according to research led by Rice University.

Silicon Storage Technology, GLOBALFOUNDRIES announce qualification of automotive grade 55nm embedded flash tech

Fri, 5 May 2015
Microchip Technology Inc. and GLOBALFOUNDRIES today announced the full qualification and availability of SST's 55nm embedded SuperFlash non-volatile memory (NVM) on GLOBALFOUNDRIES' 55nm Low Power Extended (LPx)/ RF enabled platform.

Random nanowire configurations increase conductivity over heavily ordered configurations

Fri, 5 May 2015
Researchers at Lehigh University have identified for the first time that a performance gain in the electrical conductivity of random metal nanowire networks can be achieved by slightly restricting nanowire orientation.

imec and Lam Research develop novel metallization method

Tue, 5 May 2015
During the IEEE IITC conference in Grenoble, the nanoelectronics research center imec and Lam Research Corporation today presented a novel bottom-up prefill technique for vias and contacts.

Computing at the speed of light

Tue, 5 May 2015
University of Utah engineers have taken a step forward in creating the next generation of computers and mobile devices capable of speeds millions of times faster than current machines.

Advantest launches its first integrated test solution for optical transceivers

Tue, 5 May 2015
Semiconductor test equipment supplier Advantest Corporation has introduced its new 28G OPM (28-gigabit Optical Port Module), the company's first solution designed specifically for testing optical transceivers.

GLOBALFOUNDRIES offers new low-power 28nm solution for high-performance mobile and IoT applications

Wed, 5 May 2015
Technology is the first in the industry to provide design enablement support optimized to meet low power requirements of RF SoCs.

imec and Tokyo Electron demonstrate electrical advantages of direct Cu etch scheme for advanced interconnects

Wed, 5 May 2015
Today, at the IEEE IITC conference, nano-electronics research center imec and Tokyo Electron Limited (TEL) presented a direct Cu etch scheme for patterning Cu interconnects.

Dow Corning introduces next-generation thermal interface material

Tue, 5 May 2015
Dow Corning, a developer of silicones, silicon-based technology and innovation, today unveiled new Dow Corning TC-3040 Thermally Conductive Gel, a next-generation thermal interface material.

Advantest develops semiconductor circuit analysis terahertz technology

Thu, 5 May 2015
Semiconductor test equipment supplier Advantest Corporation announced today that it has developed a technology utilizing short-pulse terahertz waves for analysis of electrical circuits.

Infinitesima Ltd announces major RPM design win with Zeiss

Tue, 5 May 2015
Infinitesima announced today that its groundbreaking probe microscope has been integrated into the ZEISS MeRiT neXT photomask repair tool.

GaN Systems power transistors are 50% smaller

Tue, 5 May 2015
GaN Systems, a developer of gallium nitride power switching semiconductors, today confirmed the world’s smallest 650V, 15A gallium nitride transistor.

UMC unveils UMC Auto Platform to enable automotive IC designs

Tue, 5 May 2015
United Microelectronics Corporation, a global semiconductor foundry, today unveiled its UMC Auto technology platform to target IC companies designing chips for automotive applications.

Collaboration could lead to biodegradable computer chips

Fri, 5 May 2015
Portable electronics - typically made of non-renewable, non-biodegradable and potentially toxic materials - are discarded at an alarming rate in consumers' pursuit of the next best electronic gadget.

Diverse packaging and test issues up for debate at SEMICON West 2015

Fri, 5 May 2015
SEMI this week announced the SEMICON West 2015 test and packaging program agendas.

Technology for tomorrow’s market opportunities and challenges at LetiDays Grenoble

Fri, 5 May 2015
The 17th annual LetiDays Grenoble on June 24-25 will expand the conversation with presentations about Internet of Things-augmented mobility, which is revolutionizing the way we interact with appliances, infrastructure and countless common objects that are part of our daily lives.

Successful boron-doping of graphene nanoribbon

Thu, 8 Aug 2015
Physicists at the University of Basel succeed in synthesizing boron-doped graphene nanoribbons and characterizing their structural, electronic and chemical properties.

Leti demos new process to fabricate high-brightness micro-LED arrays for next-gen head-mounted and head-up displays

Tue, 6 Jun 2015
CEA-Leti today announced that it has demonstrated a path to fabricating high-density micro-LED arrays for the next generation of wearable and nomadic systems in a process that is scalable to the IC manufacturing process.

Fujifilm and imec demonstrate full-color OLEDs with photoresist technology for organic semiconductors

Tue, 6 Jun 2015
FUJIFILM Corporation and nano-electronics research institute, imec have demonstrated full-color organic light-emitting diodes (OLED) by using their jointly-developed photoresist technology for organic semiconductors.

GLOBALFOUNDRIES solidifies 14nm finFET design infrastructure for next-generation chip design

Tue, 6 Jun 2015
GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced it has reached a critical milestone in providing a design infrastructure for its 14-nanometer (nm) FinFET process technology.

A major advance in mastering the extraordinary properties of an emerging semiconductor

Fri, 6 Jun 2015
Black phosphorus reveals its secrets thanks to a scientific breakthrough made by a team from Universite de Montreal, Polytechnique Montreal and CNRS in France.

Is it time to switch to OASIS.MASK?

Thu, 6 Jun 2015
A summary of OASIS standard advantages and weaknesses is presented, based on six years of experience with customer databases.

A novel characterization technique unveils the 3D structure of conductive filaments in resistive switching memories

Fri, 6 Jun 2015
Imec researchers have developed a novel technique – termed conductive atomic force microscopy tomography (or scalpel C-AFM) – that enables a three-dimensional characterization of emerging logic and memory devices.

Futuristic components on silicon chips, fabricated successfully

Mon, 6 Jun 2015
IBM researchers develop a technique for integrating 'III-V' materials onto silicon wafers, a breakthrough that may allow an extension to Moore's Law.

The impact of consumer demand for cutting-edge display technology on the gases market

Tue, 6 Jun 2015
How gases are used in the manufacture of displays is being impacted by new technologies, consumer demand, and the burgeoning China market.

Going organic: The cost-down route to foldable display manufacture

Tue, 6 Jun 2015
Organic semiconductors now offer the performance, cost and route to adoption, for foldable displays; from ultra-thin, conformal, wearables to truly foldable smartphones and tablets.

Next-generation illumination using silicon quantum dot-based white-blue LED

Tue, 6 Jun 2015
A hybrid LED is expected to be a next-generation illumination device for producing flexible lighting and display, and this is achieved for the Si QD-based white-blue LED.

imec presents large area industrial crystalline silicon n-PERT solar cell with record 22.5% efficiency

Wed, 6 Jun 2015
Nano-electronics research center imec announced today at Intersolar Europe, a new efficiency record for its large area n-type PERT (passivated emitter, rear totally diffused) crystalline silicon (Cz-Si) solar cell, now reaching 22.5 percent (calibrated at ISE CalLab).

Slip sliding away: Graphene and diamonds prove a slippery combination

Wed, 6 Jun 2015
Scientists at the U.S. Department of Energy's Argonne National Laboratory have found a way to use tiny diamonds and graphene to give friction the slip, creating a new material combination that demonstrates the rare phenomenon of "superlubricity."

MIPT physicists develop ultrasensitive nanomechanical biosensor

Wed, 6 Jun 2015
t can analyze the chemical composition of substances and detect biological objects, such as viral disease markers, which appear when the immune system responds to incurable or hard-to-cure diseases, including HIV, hepatitis, herpes, and many others.

Leti Workshop on June 26 to cover latest R&D successes in innovative memory technologies

Wed, 6 Jun 2015
CEA-Leti is hosting its seventh workshop on innovative memory technologies following the 17th annual LetiDays Grenoble, June 24-25, on the Minatec campus.

World's thinnest lightbulb -- graphene gets bright

Mon, 6 Jun 2015
A team of scientists from Columbia, Seoul National University (SNU), and Korea Research Institute of Standards and Science (KRISS) reported today that they have demonstrated -- for the first time -- an on-chip visible light source using graphene, an atomically thin and perfectly crystalline form of carbon, as a filament.

A KAIST research team develops the first flexible phase-change random access memory

Mon, 6 Jun 2015
Phase change random access memory (PRAM) is one of the strongest candidates for next-generation nonvolatile memory for flexible and wearable electronics.

Time-resolved measurement of the anomalous velocity

Wed, 12 Dec 2015
Movement of charge carriers perpendicular to an electric driving field in a solid state system detected for the first time with sub-picosecond time resolution.

SK Hynix ramps production of high bandwidth memory

Tue, 6 Jun 2015
SK Hynix Inc. announced today that it is shipping mass production volumes of 1st generation High Bandwidth Memory (HBM1) based on SK hynix’s advanced 20nm-class DRAM process technology.

Optimized printing process enables custom organic electronics

Tue, 6 Jun 2015
They are thin, light-weight, flexible and can be produced cost- and energy-efficiently: printed microelectronic components made of synthetics. Flexible displays and touch screens, glowing films, RFID tags and solar cells represent a future market.

Leti workshop covers major trends in FD-SOI technologies

Tue, 6 Jun 2015
CEA-Leti will host a workshop on major trends in Fully Depleted Silicon-on-Insulator process and design technologies in connection with the 17th annual LetiDays Grenoble, June 24-25.

Plasma-Therm presents workshop at China University

Tue, 6 Jun 2015
Plasma-Therm recently presented an advanced plasma processing workshop at Xidian University in Xi’an, China that was attended by researchers, students and industry representatives and featured a day-long series of presentations about plasma processing.

Dow Corning granted Korean patent for LED optical silicone encapsulant technology

Wed, 6 Jun 2015
Dow Corning reported today that the Korean Intellectual Property Office (KIPO) granted a patent protecting the company’s high refractive index (RI) phenyl-based optical silicone encapsulant technology, which targets advanced LED lighting applications.

Researchers create transparent, stretchable conductors using nano-accordion structure

Thu, 6 Jun 2015
Researchers from North Carolina State University have created stretchable, transparent conductors that work because of the structures' "nano-accordion" design. The conductors could be used in a wide variety of applications, such as flexible electronics, stretchable displays or wearable sensors.

Organ-on-a-chip technology helps researchers better understand pregnancy

Thu, 6 Jun 2015
National Institutes of Health (NIH) researchers and their colleagues have developed a "placenta-on-a-chip" to study the inner workings of the human placenta and its role in pregnancy.

A new look at surface chemistry

Thu, 6 Jun 2015
For the first time in the long and vaunted history of scanning electron microscopy, the unique atomic structure at the surface of a material has been resolved.

First solar cell made of highly ordered molecular frameworks

Fri, 6 Jun 2015
"We have opened the door to a new room," says Professor Christof Wöll, Director of KIT Institute of Functional Interfaces (IFG).

imec and Holst Centre present a gas sensing platform for intuitive IoT applications

Tue, 6 Jun 2015
Imec and Holst Centre have developed a small NO2 sensor featuring a low power consumption in the mW range.

Freescale takes its next generation QorIQ multicore platform to 16nm FinFET technology

Wed, 6 Jun 2015
Freescale Semiconductor has disclosed initial details regarding the next generation of its successful QorIQ multicore processor portfolio, today announcing it will drive innovation for the secure Internet of Tomorrow (IoT) on highly advanced 16nm FinFET process technology.

Toward tiny, solar-powered sensors

Wed, 6 Jun 2015
Last week, at the Symposia on VLSI Technology and Circuits, MIT researchers presented a new power converter chip that can harvest more than 80 percent of the energy trickling into it, even at the extremely low power levels characteristic of tiny solar cells.

Nanowires could be the LEDs of the future

Thu, 6 Jun 2015
The latest research from the Niels Bohr Institute shows that LEDs made from nanowires will use less energy and provide better light.

Stanford researchers stretch a thin crystal to get better solar cells

Thu, 6 Jun 2015
Crystalline semiconductors like silicon can catch photons and convert their energy into electron flows. New research shows a little stretching could give one of silicon's lesser-known cousins its own place in the sun.

“What’s next?” ─ Advances in technology at SEMICON West 2015

Thu, 6 Jun 2015
The latest manufacturing, materials and production developments in semiconductor and related technologies will be featured at SEMICON West 2015 on July 14-16 at Moscone Center in San Francisco, Calif.

Biodegradable, flexible silicon transistors

Tue, 6 Jun 2015
Wisconsin researchers have developed a new biodegradable silicon transistor based on a material derived from wood, opening the door for green, flexible, low-cost portable electronics in future.

Making new materials with micro-explosions

Mon, 6 Jun 2015
Scientists have made exotic new materials by creating laser-induced micro-explosions in silicon, the common computer chip material.

Opening a new route to photonics

Mon, 6 Jun 2015
A new route to ultrahigh density, ultracompact integrated photonic circuitry has been discovered by researchers with the Lawrence Berkeley National Laboratory (Berkeley Lab) and the University of California (UC) Berkeley.

The peaks and valleys of silicon

Mon, 6 Jun 2015
When the new iPhone came out, customers complained that it could be bent -- but what if you could roll up your too big 6 Plus to actually fit in your pocket? That technology might be available sooner than you think, based on the work of USC Viterbi engineers.

New method can make cheaper solar energy storage

Wed, 7 Jul 2015
EPFL scientists have now developed a simple, unconventional method to fabricate high-quality, efficient solar panels for direct solar hydrogen production with low cost.

Graphene flexes its electronic muscles

Wed, 7 Jul 2015
Flexing graphene may be the most basic way to control its electrical properties, according to calculations by theoretical physicists at Rice University and in Russia.

EV Group ramps nanoimprint lithography into high-volume manufacturing with HERCULES NIL Track System

Tue, 7 Jul 2015
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the HERCULES NIL—a fully integrated track system that combines cleaning, resist coating and baking pre-processing steps with EVG's SmartNIL large-area nanoimprint lithography (NIL) process in a single platform.

New technology using silver may hold key to electronics advances

Thu, 7 Jul 2015
Engineers at Oregon State University have invented a way to fabricate silver, a highly conductive metal, for printed electronics that are produced at room temperature.

Could black phosphorus be the next silicon?

Tue, 7 Jul 2015
New material could make it possible to pack more transistors on a chip, research suggests.

Peregrine Semiconductor introduces first RF SOI 300mm technology platform

Mon, 7 Jul 2015
Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the UltraCMOS 11 platform.

Down to the quantum dot

Tue, 7 Jul 2015
Using a single molecule as a sensor, scientists in Jülich have successfully imaged electric potential fields with unrivalled precision.

Genmark Automation launches CODEX Stocker

Mon, 7 Jul 2015
Genmark Automation, a developer of tool and factory automation solutions for the semiconductor and related industries, today announced the launch of its new CODEX Stocker.

IRT Nanoelec partners achieve 3D chip-stacking technology & 3D network-on-chip framework

Thu, 7 Jul 2015
IRT Nanoelec, an R&D consortium focused on Information and Communication Technologies (ICT) using micro- and nanoelectronics, and its partners CEA-Leti, STMicroelectronics and Mentor Graphics have realized an innovative 3D chip called “3DNoC” to demonstrate the use of 3D stacking technology in scalable, complex digital systems-on-chip (SoCs).

Graphene gets competition

Thu, 7 Jul 2015
Graphene, the only one atom thick carbon network, achieved overnight fame with the 2010 Nobel Prize. But now comes competition: Such layers can also be formed by black phosphorous.

Graphene-based film can be used for efficient cooling of electronics

Fri, 7 Jul 2015
Researchers at Chalmers University of Technology have developed a method for efficiently cooling electronics using graphene-based film.

Applied Materials introduces high-performance ALD technology for the 3D era

Mon, 7 Jul 2015
Applied Materials, Inc. today unveiled the Applied Olympia ALD system, featuring a unique, modular architecture that delivers high-performance ALD technology to manufacturers of leading-edge 3D memory and logic chips.

Imec and Panasonic demonstrate breakthrough RRAM cell

Mon, 7 Jul 2015
Imec and Panasonic Corp. announced today that they have fabricated a 40nm TaOx-based RRAM (resistive RAM) technology with precise filament positioning and high thermal stability.

Applied Materials' new etch system provides atomic-level precision

Mon, 7 Jul 2015
Applied Materials, Inc. today announced a next-generation etch tool, the Applied Centris Sym3 Etch system, featuring an entirely new chamber for atomic-level precision manufacturing.

Imec introduces self-assembled monomolecular organic films to seal ultra-porous low- k materials

Tue, 7 Jul 2015
Nano-electronics research center imec announced today at SEMICON West that it has demonstrated concept and feasibility for pore-sealing low-k dielectrics in advanced interconnects.

Rudolph Technologies and DISCO Corporation partner to improve wafer saw process

Tue, 7 Jul 2015
Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy.

ClassOne develops new Solstice solution for >200mm TSV plating

Tue, 7 Jul 2015
Semiconductor equipment manufacturer ClassOne Technology today announced a configuration for optimizing Through Silicon Via (TSV) and Through Wafer Via (TWV) processes on its affordable Solstice electroplating systems.

Save costs by conserving energy in the sub-fab

Wed, 7 Jul 2015
Opportunities for cost savings abound in the “sub-fab” of semiconductor operations where the vacuum pumps and gas abatement systems reside.

HORIBA Semiconductor introduces the HD-960L monitor for dissolved oxygen

Wed, 7 Jul 2015
HORIBA Semiconductor, global leader in process metrology and control components, introduces its new HD-960L for sub-parts-per-billion level monitoring of DO in chemicals with a low sample-consumption rate.

TÜV Rheinland showcases services & abilities for semi industry focus is on OSHA and EMC testing certification

Wed, 7 Jul 2015
TÜV Rheinland, a full-service testing, inspection and certification company, exhibiting at the annual SEMICON West expo, announced the expansion of services to include Environmental, Health & Safety testing and certification of Group III-V compounds in semiconductor manufacturing environments.

Managing hazardous process exhaust in high volume manufacturing

Wed, 7 Jul 2015
“Let no element on the periodic table go un-used!” That may well be the rallying cry of the semiconductor industry moving forward.

Inspection smooths a bumpy road

Thu, 7 Jul 2015
Wafer bumping has several advantages over traditional wire bonding. Bumps can be placed almost anywhere on the die, where wire bonding is limited to the periphery of the devices. And bumps give you the ability to put many more I/O points on an individual die.

An easy, scalable and direct method for synthesizing graphene in silicon microelectronics

Tue, 7 Jul 2015
In the last decade, graphene has been intensively studied for its unique optical, mechanical, electrical and structural properties.

Sticky tape and phosphorus the key to ultrathin solar cells

Tue, 7 Jul 2015
Scientists studying thin layers of phosphorus have found surprising properties that could open the door to ultrathin and ultralight solar cells and LEDs.

Penn researchers discover new chiral property of silicon, with photonic applications

Fri, 7 Jul 2015
By encoding information in photons via their spin, "photonic" computers could be orders of magnitude faster and efficient than their current-day counterparts. Likewise, encoding information in the spin of electrons, rather than just their quantity, could make "spintronic" computers with similar advantages.

New fiber optic temperature sensing and control system ideal for RF environments

Wed, 7 Jul 2015
Watlow, a designer and manufacturer of complete thermal systems, announced its new EZ-ZONE RM fiber optic temperature measurement system, a compact sensing and control solution ideal for plasma environments.

Compact point of use fluid delivery heater replaces multiple components in a system

Wed, 7 Jul 2015
Watlow, a designer and manufacturer of complete thermal systems, announces its new point-of-use fluid delivery heater, a compact solution used to provide precise and uniform heat to gases flowing into the chamber.

More efficient process to produce graphene developed by Ben-Gurion University researchers

Thu, 7 Jul 2015
Ben-Gurion University of the Negev (BGU) and University of Western Australia researchers have developed a new process to develop few-layer graphene for use in energy storage and other material applications that is faster, potentially scalable and surmounts some of the current graphene production limitations.

Reshaping the solar spectrum to turn light to electricity

Tue, 7 Jul 2015
A team of chemists at the University of California, Riverside found an ingenious way to make solar energy conversion more efficient.

Superfast fluorescence sets new speed record

Mon, 7 Jul 2015
Researchers have developed an ultrafast light-emitting device that can flip on and off 90 billion times a second and could form the basis of optical computing.

Rice University finding could lead to cheap, efficient metal-based solar cells

Mon, 7 Jul 2015
New research from Rice University could make it easier for engineers to harness the power of light-capturing nanomaterials to boost the efficiency and reduce the costs of photovoltaic solar cells.

Short wavelength plasmons observed in nanotubes

Tue, 7 Jul 2015
A team of researchers with Berkeley Lab's Materials Sciences Division, working at the Advanced Light Source (ALS), has generated and detected plasmons that boast one of the strongest confinement factors ever: the plasmon wavelength is only one hundredth of the free-space photon wavelength.

Meet the high-performance single-molecule diode

Wed, 7 Jul 2015
A team of researchers from Berkeley Lab and Columbia University has passed a major milestone in molecular electronics with the creation of the world's highest-performance single-molecule diode.

Sol-gel capacitor dielectric offers record-high energy storage

Thu, 7 Jul 2015
Using a hybrid silica sol-gel material and self-assembled monolayers of a common fatty acid, researchers have developed a new capacitor dielectric material that provides an electrical energy storage capacity rivaling certain batteries, with both a high energy density and high power density.

SEMICON West: The road forward is 3DIC

Fri, 7 Jul 2015
SEMICON West 2015 had a strong and rich undercurrent – the roadmap forward is most certainly 3DIC.

A*STAR's IME Consortium announces development of innovative advanced packaging solutions

Tue, 8 Aug 2015
Following the launch of the 12th Electronics Packaging Research Consortium (EPRC12) in 2013, A*STAR’s Institute of Microelectronics (IME) and 11 of its consortium partners across the semiconductor supply chain have developed novel solutions in integrated circuit (IC) packaging.

Pixelligent launches new PixClear light extraction materials for OLED lighting

Mon, 8 Aug 2015
Pixelligent Technologies, a manufacturer of high index materials for demanding optoelectronics applications, announces the addition of four new OLED lighting products to its PixClear Zirconia nanocrystal family.

Better together: Graphene-nanotube hybrid switches

Mon, 8 Aug 2015
Yoke Khin Yap, a professor of physics at Michigan Technological University, has worked with a research team that created these digital switches by combining graphene and boron nitride nanotubes.

ON Semiconductor introduces new ICs for next generation auto designs

Mon, 8 Aug 2015
ON Semiconductor has introduced an array of new AEC-Q100-compliant integrated circuits (ICs) optimized for implementation into next generation automobile designs.

Spintronics, low-energy electricity take a step closer

Wed, 12 Dec 2015
A new class of topological insulators discovered.

Flexible dielectric polymer can stand the heat

Fri, 8 Aug 2015
Easily manufactured, low cost, lightweight, flexible dielectric polymers that can operate at high temperatures may be the solution to energy storage and power conversion in electric vehicles and other high temperature applications, according to a team of Penn State engineers.

Toshiba develops world’s first 256Gb, 48-layer BiCS FLASH

Tue, 8 Aug 2015
Toshiba America Electronic Components, Inc. (TAEC) today unveiled the new generation of BiCS FLASH, a three-dimensional (3D) stacked cell structure flash memory.

Intel to collaborate with Georgia Tech

Wed, 8 Aug 2015
Intel Corporation announced it will invest $5 million over the next five years to deepen its engineering pipeline partnership with the Georgia Institute of Technology and deploy research-driven solutions to inspire and retain women and underrepresented minorities to start and complete computer science and engineering degrees.

Toshiba launches 16MP CMOS image sensors targeting smartphones and tablets

Mon, 8 Aug 2015
Designed for use in smartphones and tablets, the backside-illuminated (BSI) chips are among the world's smallest class of CMOS image sensors, and achieve both high-performance image capture and low power consumption.

New research may enhance display & LED lighting technology

Mon, 8 Aug 2015
Researchers from the University of Illinois at Urbana-Champaign have produced some promising results toward that goal, developing a new method to extract more efficient and polarized light from quantum dots (QDs) over a large-scale area.

Imec pushes the boundaries of GaN technology

Wed, 8 Aug 2015
Nano-electronics research center imec announced today that it is extending its Gallium Nitride-on-Silicon (GaN-on-Si) R&D program, and is now offering joint research on GaN-on-Si 200mm epitaxy and enhancement mode device technology.

Black phosphorus surges ahead of graphene

Fri, 8 Aug 2015
A Korean team of scientists tune BP's band gap to form a superior conductor, allowing for the application to be mass produced for electronic and optoelectronics devices

Discovery in growing graphene nanoribbons could enable faster, more efficient electronics

Fri, 8 Aug 2015
University of Wisconsin-Madison engineers have discovered a way to grow graphene nanoribbons with desirable semiconducting properties directly on a conventional germanium semiconductor wafer.

Surprising discoveries about 2-D molybdenum disulfide

Mon, 8 Aug 2015
Scientists with the U.S. Department of Energy (DOE)'s Lawrence Berkeley National Laboratory (Berkeley Lab) have used a unique nano-optical probe to study the effects of illumination on two-dimensional semiconductors at the molecular level.

Drexel engineers 'sandwich' atomic layers to make new materials for energy storage

Mon, 8 Aug 2015
A team from Drexel's Department of Materials Science and Engineering created the material-making method, that can sandwich 2-D sheets of elements that otherwise couldn't be combined in a stable way.

"Quantum dot" technology may help light the future

Wed, 8 Aug 2015
Advances at Oregon State University in manufacturing technology for “quantum dots” may soon lead to a new generation of LED lighting that produces a more user-friendly white light, while using less toxic materials and low-cost manufacturing processes that take advantage of simple microwave heating.

Laser-burned graphene gains metallic powers

Thu, 8 Aug 2015
Rice University chemists who developed a unique form of graphene have found a way to embed metallic nanoparticles that turn the material into a useful catalyst for fuel cells and other applications.

Manchester team reveal new, stable 2-D materials

Thu, 8 Aug 2015
Dozens of new 2-dimensional materials similar to graphene are now available, thanks to research from University of Manchester scientists.

Peregrine Semiconductor announces next chapter in intelligent integration

Thu, 8 Aug 2015
Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the next chapter in intelligent integration -- integrated phase and amplitude control at microwave frequencies.

Cypress introduces the world's lowest-power energy harvesting power management ICs

Fri, 8 Aug 2015
Cypress Semiconductor Corp. today announced a new family of Energy Harvesting Power Management Integrated Circuits (PMICs) that enable tiny, solar-powered wireless sensors for Internet of Things (IoT) applications.

GaN nanoelectronics-transistor blocking voltage exceeds 1kV

Mon, 8 Aug 2015
Research reported in Applied Physics Express (APEX) by Tohru Oka and colleagues at the Research and Development Headquarters for TOYODA GOSEI Co., Ltd in Japan describe the development of ‘vertically orientated’ GaN-based transistors with blocking voltages exceeding 1kV.

Imec and Holst Centre launch comfortable EEG headset for consumer applications

Wed, 8 Aug 2015
The headset enables effective brain-computer interfacing and can monitor emotions and mood in daily life situations using a smartphone application.

Another milestone in hybrid artificial photosynthesis

Wed, 8 Aug 2015
Berkeley Lab researchers use solar energy and renewable hydrogen to produce methane.

These microscopic fish are 3-D-printed to do more than swim

Wed, 8 Aug 2015
These proof-of-concept synthetic microfish will inspire a new generation of "smart" microrobots that have diverse capabilities such as detoxification, sensing and directed drug delivery, researchers said.

University of Colorado and SRC research accelerates microscopic imaging for next-generation nanoelectronics

Thu, 8 Aug 2015
University of Colorado researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductor technologies, have developed new microscopic imaging techniques to help advance next-generation nanotechnology in applications ranging from data storage to medicine.

Mouth guard monitors health markers, transmits information wirelessly to smart phone

Mon, 8 Aug 2015
Engineers at the University of California, San Diego, have developed a mouth guard that can monitor health markers, such as lactate, cortisol and uric acid, in saliva and transmit the information wirelessly to a smart phone, laptop or tablet.

BeSpoon's position-tracking system captures and displays real-time data to improve sports teams' performance

Mon, 8 Aug 2015
BeSpoon SAS today launched BeSpoon Sport Edition, an ultra-precise position-tracking system that allows teams to measure and analyze player movement in three dimensions and provide immediate feedback to improve performance.

Flexible 7 inch touch panel with integrated OLED display developed

Tue, 9 Sep 2015
Together with ITRI, Taiwan, Heraeus, demonstrated the integration of Clevios conductive polymer based touch panel with AM OLED technology in a highly flexible device.

Wearables and bioelectronics seek better energy storage

Tue, 9 Sep 2015
Energy storage players are eyeing emerging opportunities in bioelectronics as wearable, implantable and other medical devices create energy demands and design requirements beyond conventional batteries, according to Lux Research.

CyberOptics demonstrates new WaferSense and ReticleSense Auto Multi Sensors

Wed, 9 Sep 2015
CyberOptics Corporation, a global developer and manufacturer of high precision 3D sensing technology solutions, will demonstrate the first wireless sensor to combine leveling, vibration and Relative humidity (RH) measurement in an all-in-one device at SEMICON Taiwan in Taipei, September 2-4, 2015.

SEMI-GAS unveils new custom-engineered ultra high purity liquid push system

Wed, 9 Sep 2015
The fully automatic system, operated by a GigaGuard PLC controller, features an intuitive 9” color touchscreen and user-definable alarms and set points.

DCG Systems extends circuit edit capability to the 10nm node with the introduction of OptiFIB Taipan

Wed, 9 Sep 2015
DCG Systems today announces the release of the OptiFIB Taipan circuit edit solution for the most advanced integrated circuit (IC) nodes.

Made from solar concentrate

Wed, 9 Sep 2015
Solar cell from Berkeley Lab/University of Illinois absorbs high-energy light at 30-fold higher concentration than conventional cells.

Turning clothing into information displays

Thu, 9 Sep 2015
Researchers from Holst Centre (set up by TNO and imec), imec and CMST, imec’s associated lab at Ghent University, have demonstrated the world’s first stretchable and conformable thin-film transistor (TFT) driven LED display laminated into textiles.

QEOS and GLOBALFOUNDRIES to offer industry’s first CMOS platform for millimeter-wave markets

Fri, 9 Sep 2015
QEOS, Inc., a designer of connectivity and sensing CMOS millimeter-wave (mmWave) solutions, and GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced they are partnering to co-develop the industry’s first mmW CMOS platform.

New findings move flexible lighting technology toward commercial feasibility

Fri, 9 Sep 2015
Next directions in organic light-emitting diode (OLED) technology for lighting identified in Journal of Photonics for Energy.

Researchers in Basel develop ideal single-photon source

Tue, 9 Sep 2015
With the help of a semiconductor quantum dot, physicists at the University of Basel have developed a new type of light source that emits single photons. For the first time, the researchers have managed to create a stream of identical photons.

Entegris expands CMP filtration technology solutions and research, analytical and manufacturing capabilities

Fri, 9 Sep 2015
The Entegris filter platform using NMB media now includes the Planargard bulk, Solaris point-of-tool and Planarcap point-of-dispense families to provide contamination control solutions throughout the CMP process area.

MACOM announces milestone in the commercialization of GaN on Silicon technology

Tue, 9 Sep 2015
M/A-COM Technology Solutions Inc., a supplier of high-performance analog, RF, microwave, millimeterwave and photonic semiconductor products, announced that it has shipped more than one million GaN-on-Silicon (GaN on Si) RF power devices to date to customers for use in communications, military and other RF applications.

Realizing carbon nanotube integrated circuits

Wed, 9 Sep 2015
Encapsulation layers keep carbon nanotube transistors stable in open air.

OEM Group Announces New Cintillio-S (TM) Automated Batch Wet Chemical Processing System

Mon, 9 Sep 2015
Global semiconductor capital equipment manufacturer OEM Group announced today that it has launched its new Cintillio-S (TM) automated batch wet chemical processing system.

Radiant introduces the ProMetric (R) I29 ultra high-resolution imaging colorimeter

Wed, 9 Sep 2015
Radiant Vision Systems announced the release of the ProMetric (R) I29, an ultra high-resolution imaging colorimeter developed for high-volume display and consumer electronics manufacturers.

Professors from UT Austin and Carnegie Mellon honored for excellence in semiconductor technology and design research

Wed, 9 Sep 2015
The Semiconductor Industry Association, in consultation with Semiconductor Research Corporation, today presented its University Research Award to professors from the University of Texas at Austin and Carnegie Mellon University in recognition of their outstanding contributions to semiconductor research.

Leti demos MEMS fabrication on its 300mm line, pointing the way to lower manufacturing costs

Thu, 9 Sep 2015
CEA-Leti has manufactured micro-accelerometers on 300mm wafers, a development that could lead to significantly lower MEMS manufacturing costs.

Researchers developed highly accurate method for measuring luminous efficacy of LEDs

Thu, 9 Sep 2015
Researchers at Aalto University and VTT Technical Research Centre of Finland have developed a method which helps to improve the relative uncertainty in measuring the luminous efficacy of LEDs from approximately 5 percent of today to 1 percent in the future.

FlexEnable Atmel launches self/mutual capacitance automotive-qualified touchscreen controllers for up to 10" touchscreens

Thu, 9 Sep 2015
Atmel Corporation today announced the company has expanded its portfolio of automotive-qualified maXTouch (R) touchscreen controllers with the mXT641T family.

New motion sensor from STMicroelectronics enhances user interface and image stabilization in smartphones and tablets

Thu, 9 Sep 2015
STMicroelectronics has introduced a six-axis motion-sensing device fully supporting image stabilization in smartphones, tablets, and digital still cameras.

Alcatel-Lucent acquires Mformation

Fri, 9 Sep 2015
Alcatel-Lucent has announced the acquisition of Mformation, a leading provider of mobile and "Internet of Things" security and device management solutions for mobile operators, service providers and enterprises. Terms of the deal were not disclosed.

Perovskite photovoltaics excitement

Tue, 9 Sep 2015
Perovskite photovoltaics efficiency gains are double those of organic PV, exciting researchers from KIMM in Korea to Dyesol in Australia.

SUNY Poly announces joint development agreement with INFICON

Mon, 9 Sep 2015
The collaboration is expected to advance semiconductor manufacturing processes and lead to the creation of 50 jobs at SUNY Poly statewide facilities.

Silicone shines new light on optical applications

Tue, 9 Sep 2015
As a response to meet the increasing demands of cutting-edge LED technologies, Shin-Etsu Silicones of America has recently introduced its new optically clear LIMS (Liquid Injection Molding System) X-34-1972-3 material.

UMC enters high volume touch IC production using foundry industry's first 0.11um eFlash process

Thu, 9 Sep 2015
United Microelectronics Corporation (UMC), a global semiconductor foundry, today announced that it has entered high volume production for touch IC applications manufactured on UMC's 0.11um eFlash process.

New software update for parametric test system reduces test times by 25 percent

Thu, 9 Sep 2015
Tektronix, Inc. announced the release of a major system software update for the Keithley S530 Parametric Test System that can reduce measurement speed by as much as 25 percent.

X-FAB sets benchmark for low-noise CMOS

Fri, 9 Sep 2015
Enhanced XH035 and XH018 CMOS transistors deliver industry-leading performance for highly noise-sensitive applications.

ULVAC launches dry vacuum pump accessory ECO-SHOCK ES4A

Fri, 9 Sep 2015
ULVAC, Inc. announced that it has recently developed and started selling the ECO-SHOCK ES4A, a power saving accessory for dry vacuum pumps that can reduce power consumption.

ULVAC launches G-TRAN series multi ionization gauge ST2

Mon, 9 Sep 2015
ULVAC, Inc. announced that the company has developed G-TRAN series multi ionization gauge ST2, a transducer-type ionization vacuum gauge.

Hillcrest Labs unveils MotionEngine Wear software

Tue, 9 Sep 2015
Hillcrest Labs unveiled its MotionEngine (TM) Wear software with always-on, sensor-enabled features optimized for the latest generation of wearable devices.

Functionalized graphene ink opens door to innovative screen-printing applications

Tue, 9 Sep 2015
A screen-printable functionalized graphene ink supplied by Goodfellow performs better than normal carbon-based ink.

ams introduces solution for 24/7 heart rate measurement for wearables

Wed, 9 Sep 2015
ams AG announced the launch of the AS7000, the first member of a new family of health/fitness solutions aimed at wearable devices.

Novati Technologies launches advanced integrated sensor platform

Wed, 9 Sep 2015
Novati Technologies Inc. announced the availability of an advanced Integrated Sensor Platform, placing a wide variety of sensors onto multi-layer stacks of wafers in order to consume less power and perform significantly faster while reducing overall footprint.

DuPont Displays opens OLED materials scale-up facility for next generation TVs

Thu, 10 Oct 2015
DuPont Displays announced the opening of a state-of-the-art, scale-up manufacturing facility designed to deliver production scale quantities of advanced materials that enable large-format, solution-based printed Organic Light Emitting Diode (OLED) displays.

Yang awarded MacArthur "genius" fellowship for synthetic "leaf" of nanowires, bacteria

Thu, 10 Oct 2015
Yang and his collaborators have created a synthetic “leaf” that is a hybrid system of semiconducting nanowires and bacteria.

First circularly polarized light detector on a silicon chip

Thu, 10 Oct 2015
Invention of the first integrated circularly polarized light detector on a silicon chip opens the door for development of small, portable sensors that could expand the use of polarized light for many applications.

LG Innotek announces high power LED packages

Thu, 10 Oct 2015
LG Innotek announced that the company started to produce high-power LED packages (H35C4 Series) featuring 180lm/W.

Yamaichi Electronics 0.35mm pitch test contactor for semiconductor evaluation

Fri, 10 Oct 2015
Yamaichi Electronics presents Test Contactors for lab and reliability applications and ultra fine pitch semiconductor devices.

SDK to Offer SiC Epitaxial Wafers with very low defect density

Mon, 10 Oct 2015
Showa Denko has developed a new grade of silicon carbide (SiC) epitaxial wafers for power devices with very low defect density.

Altatech adds new high-speed inspection system dedicated to ultra-thin substrates for 3D applications

Mon, 10 Oct 2015
Altatech announced the expansion of its Eclipse series with a new, high-speed inspection system dedicated to ultra-thin, transparent and bonded substrates inspection for 3D applications in power, MEMS, and mobile technologies.

JEOL introduces the JSM-6000PLUS NeoScope

Tue, 10 Oct 2015
JEOL's benchtop SEM makes it possible to bring basic high resolution imaging and analysis features of a full-sized Scanning Electron Microscope into the lab.

Entegris introduces SmartStack 300 mm contactless horizontal wafer shipper

Tue, 10 Oct 2015
Entegris, Inc. has expanded its wafer shipper family of products with the SmartStack (R) 300 mm Contactless Horizontal Wafer Shipper.

DCG Systems introduces Meridian M for static optical failure analysis

Tue, 10 Oct 2015
DCG Systems announced the release of the Meridian M (TM) system for isolation of routine and challenging electrical faults at the wafer level.

SEMI announces FlexTech Alliance as first Strategic Association Partner

Wed, 10 Oct 2015
SEMI announced today that FlexTech Alliance has become the first SEMI Strategic (Association) Partner.

Organic semiconductors get weird at the edge: University of British Columbia research

Thu, 10 Oct 2015
As the push for tinier and faster electronics continues, a new finding by University of British Columbia scientists could help inform the design of the next generation of cheaper, more efficient devices.

Two polymer-blend could boost efficiency of LEDs

Thu, 10 Oct 2015
A blend of two polymers can be used to boost the efficiency of LEDs, according to a research study published in the journal Applied Materials Today.

mCube introduces smallest and most power-efficient accelerometer for wearables and Internet of Moving Things

Thu, 10 Oct 2015
mCube announced the sampling of its new MC3635 3-axis accelerometer featuring the industry's lowest power consumption and a microscopic 1.6x1.6 mm Land Grid Array package.

Vanadium dioxide leads to a better transistor

Mon, 10 Oct 2015
Penn State materials scientists have discovered a way to give the transistor a boost by incorporating vanadium oxide.

Applied Materials advances OLED display manufacturing for flexible mobile products and curved TVs

Mon, 10 Oct 2015
Applied Materials, Inc. unveiled two new systems that enable the volume production of high-resolution, thin and lightweight flexible OLED displays for mobile products and TVs.

Scientists paint quantum electronics with beams of light

Mon, 10 Oct 2015
Scientists from the University of Chicago and Penn State University accidentally discovered a new way of using light to draw and erase quantum-mechanical circuits in a unique class of materials called topological insulators.

FlexEnable spearheads breakthrough in flexible electronics

Wed, 10 Oct 2015
FlexEnable has successfully validated a new class of high performance organic semiconductors in a million pound project funded by Innovate UK.

Silver: The promising electrode winner for low-cost perovskite solar cells

Fri, 10 Oct 2015
A study published in Advanced Materials Interfaces by the Energy Materials and Surface Sciences Unit at the Okinawa Institute of Science and Technology Graduate University (OIST) reveals a cause for the short lifetime of perovskite solar cells with silver electrodes.

Next-generation perovskite solar cells made stable by metal oxide "sandwich"

Mon, 10 Oct 2015
New solar cell construction extends the cell's effective life in air by more than 10 times, with only a marginal loss of efficiency converting sunlight to electricity.

MOSFETs automatically balance supercapacitors in industrial applications

Wed, 10 Oct 2015
Advanced Linear Devices, Inc. (ALD) announced a family of Supercapacitor Auto Balancing (SAB) Metal Oxide Semiconductor Field Effect Transistors (MOSFET) designed for industrial applications.

Successful industrialization of high-density 3D integrated silicon capacitors for ultra-miniaturized electronic components

Thu, 10 Oct 2015
Two years after the launch of the PICS project , three European SMEs, IPDiA, Picosun, and SENTECH Instruments along with CEA-Leti and Fraunhofer IPMS-CNT announce the major technological results achieved.

Light goes infinitely fast with new on-chip material

Fri, 10 Oct 2015
Researchers at the Harvard John A. Paulson School of Engineering and Applied Sciences (SEAS) have designed the first on-chip metamaterial with a refractive index of zero.

Berkeley Lab researchers demonstrate atomically thin excitonic laser

Fri, 10 Oct 2015
An important step towards next-generation ultra-compact photonic and optoelectronic devices has been taken with the realization of a two-dimensional excitonic laser.

Mentor Graphics updates Nucleus RTOS for Internet of Things and embedded connected devices

Mon, 10 Oct 2015
Mentor Graphics Corporation announced an update to the Mentor (R) Embedded Nucleus (R) real time operating system (RTOS) targeting low power, next-generation applications for connected embedded and IoTdevices.

Manipulating wrinkles could lead to graphene semiconductors

Mon, 10 Oct 2015
RIKEN scientists have discovered that wrinkles in graphene can restrict the motion of electrons to one dimension, forming a junction-like structure that changes from zero-gap conductor to semiconductor back to zero-gap conductor.

Imec and Ghent University present thermoplastically deformable electronic circuits

Tue, 10 Oct 2015
imec and CMST have developed a novel technology for thermoplastically deformable electronics enabling low-cost 2.5D free-form rigid electronic objects.

mCube unveils the world's smallest 1x1mm accelerometer

Tue, 10 Oct 2015
mCube announced the industry’s first 3-axis accelerometer which is less than a cubic millimeter in total size.

Quantum dots making inroads in displays

Wed, 10 Oct 2015
As part of a new market report, IDTechEx Research has looked at quantum dots' impact on the display industry. Is this the technology that will enable LCD to rival OLED?

Pixelligent introduces OLED light extraction technology at 2015 OLEDs World Summit

Thu, 10 Oct 2015
Pixelligent announced the development of a new OLED light extraction technology that dramatically increases light output in OLED Lighting devices.

DCG Systems addresses localization of electrical shorts with EBIRCH technology

Tue, 11 Nov 2015
DCG Systems announced the release of EBIRCH, a technology for localizing shorts and other low-resistance faults that may reside in the interconnect structures or the polysilicon base layer of integrated circuits.

New Helios G4 Series DualBeam from FEI sets new standards

Tue, 11 Nov 2015
FEI announced the Helios G4 DualBeam series, which offers the highest throughput ultra-thin TEM lamella preparation for leading-edge semiconductor manufacturing and failure analysis applications.

Allegro MicroSystems announces new 2D speed and direction sensor IC using vertical and planar Hall elements

Wed, 11 Nov 2015
Allegro MicroSystems announced the release of a dual-channel Hall-effect latch featuring two-dimensional (2D) sensing via a combination of vertical Hall and planar Hall elements.

GLOBALFOUNDRIES achieves 14nm finFET technology success for next-generation AMD products

Fri, 11 Nov 2015
GLOBALFOUNDRIES today announced it has demonstrated silicon success on the first AMD products using its most advanced 14nm FinFET process technology.

Advance could bring commercial applications for silver nanowires

Tue, 11 Nov 2015
New research suggests wrapping silver nanowires with an ultrathin layer of graphene protects the structures from damage and could represent a key to realizing their commercial potential.

Pixelligent launches new PixClear Dispersions for display and printed electronics

Wed, 11 Nov 2015
Pixelligent launched a new family of PixClear materials for display and optical components and films.

GLOBALFOUNDRIES launches high-performance ASIC offering on 14nm FinFET process technology

Wed, 11 Nov 2015
GLOBALFOUNDRIES today announced the availability of FX-14, an ASIC offering built on the company's next-generation 14nm FinFET process technology.

Ultratech introduces superfast 4G+ low-cost in-line inspection system for patterned wafers

Wed, 11 Nov 2015
Ultratech, Inc. today introduced the Superfast 4G+ in-line, 3D topography inspection system.

A new slant on semiconductor characterization

Thu, 11 Nov 2015
Method analyzes non-uniform conductors with a magnetic field.

Security by design

Fri, 11 Nov 2015
The advent of Internet-connected devices, the so-called Internet of Things (IoT), offers myriad opportunities and significant risks. It is our collective responsibility, as an industry, to secure the transport and storage of the data. Failing to properly secure the data risks turning the digital threat into a physical threat.

The use of sapphire in mobile device and LED industries

Fri, 11 Nov 2015
Sapphire is hard, strong, optically transparent and chemically inert.

Micron introduces persistent memory tech that combines DRAM performance with NAND flash reliability

Fri, 11 Nov 2015
Micron Technology, Inc. this week announced the production of 8GB DDR4 NVDIMM, the company's first commercially available solution in the persistent memory category.

Photons on a chip set new paths for secure communications

Mon, 11 Nov 2015
Researchers from RMIT University in Melbourne have helped crack the code to ultra-secure telecommunications of the future in an international research project that could also expedite the advent of quantum computing.

Researchers design and patent graphene biosensors

Mon, 11 Nov 2015
Graphene is the first truly two-dimensional crystal, which was obtained experimentally and investigated regarding its unique chemical and physical properties. There has now been a considerable increase in the number of research studies aimed at finding commercial applications for graphene and other two-dimensional materials.

The use of sapphire in mobile device and LED industries: Part 2

Tue, 11 Nov 2015
The use of sapphire in the manufacturing of Light Emitting Diodes (LEDs) is covered in the second part of a two part series.

Taking 2D materials from lab to fab, and to technology

Tue, 11 Nov 2015
Due to their exciting properties, 2D crystals like graphene and transition metal dichalcogenides promise to become the material of the future.

Intel and ASM look to TCB

Tue, 11 Nov 2015
Is there any question that TCB is real and will be the next big bonding technology? The focus this month is more on this very important new assembly process from Intel and ASM.

Stacking instead of mixing

Wed, 11 Nov 2015
A team from Jülich and Aachen has now found a way to control the desired conducting properties of this type of material more precisely and reliably than ever before.

Highlights from Day 1 of IDTechEx Printed Electronics USA 2015

Thu, 11 Nov 2015
IDTechEx Printed Electronics USA 2015, held in Santa Clara, CA Nov 18-19, is one mega conference with eight co-located tracks ranging from sensor technology & wearables to IoT, energy harvesting & storage to electric vehicles, 3D printing and graphene.

Quantum spin could create unstoppable, one-dimensional electron waves

Mon, 11 Nov 2015
A pair of scientists from the U.S. Department of Energy's Brookhaven National Laboratory and Ludwig Maximilian University in Munich have proposed the first solution to subatomic stoppage: a novel way to create a more robust electron wave by binding together the electron's direction of movement and its spin.

Strange quantum phenomenon achieved at room temperature in semiconductor wafers

Mon, 11 Nov 2015
Today, entanglement is accepted as a fact of nature and is actively being explored as a resource for future technologies including quantum computers, quantum communication networks, and high-precision quantum sensors.

Tandem solar cells are simply better

Tue, 11 Nov 2015
What is true for double-blade razors is also true for solar cells: two work steps are more thorough than one.

Cambridge CMOS Sensors wins again at NMI awards

Tue, 11 Nov 2015
Cambridge CMOS Sensors (CCS), a semiconductor company with gas sensor solutions to monitor the local environment, today announced that it has been crowned winner of the Product of the Year category at this year's National Microelectronics Institute (NMI) Awards, held at the Grange Tower Bridge Hotel in London.

Imec advances drive current in vertical 3D NAND memory devices

Wed, 12 Dec 2015
At this week’s IEEE IEDM conference, nano-electronics research center imec showed for the first time the integration of high mobility InGaAs as a channel material for 3D vertical NAND memory devices formed in the plug (holes) with the diameter down to 45nm.

Doping powers new thermoelectric material

Mon, 11 Nov 2015
In the production of power, nearly two-thirds of energy input from fossil fuels is lost as waste heat. Industry is hungry for materials that can convert this heat to useful electricity, but a good thermoelectric material is hard to find.

Stanford technology makes metal wires on solar cells nearly invisible to light

Mon, 11 Nov 2015
Stanford University scientists have discovered how to hide the reflective upper contact and funnel light directly to the semiconductor below.

IU chemists craft molecule that self-assembles into flower-shaped crystalline patterns

Tue, 12 Dec 2015
The National Science Foundation has awarded $1.2 million to three research groups at Indiana University to advance research on self-assembling molecules and computer-aided design software required to create the next generation of solar cells, circuits, sensors and other technology.

Exploring the limits for high-performance LEDs and solar cells

Thu, 12 Dec 2015
Hybrid optoelectronic devices based on blends of hard and soft semiconductors can combine the properties of the two material types, opening the possibility for devices with novel functionality and properties, such as cheap and scalable solution-based processing methods.

ORNL process could be white lightning to the electronics industry

Wed, 12 Dec 2015
A new era of electronics and even quantum devices could be ushered in with the fabrication of a virtually perfect single layer of "white graphene," according to researchers at the Department of Energy's Oak Ridge National Laboratory.

Quantum computer made of standard semiconductor materials

Wed, 12 Dec 2015
Physicists at the Technical University of Munich, the Los Alamos National Laboratory and Stanford University (USA) have tracked down semiconductor nanostructure mechanisms that can result in the loss of stored information - and halted the amnesia using an external magnetic field.

Photonic 'sintering' may create new solar, electronics manufacturing technologies

Thu, 12 Dec 2015
Engineers at Oregon State University have made a fundamental breakthrough in understanding the physics of photonic "sintering," which could lead to many new advances in solar cells, flexible electronics, various types of sensors and other high-tech products printed onto something as simple as a sheet of paper or plastic.

Penn researchers make thinnest plates that can be picked up by hand

Fri, 12 Dec 2015
Despite being thousands of times thinner than a sheet of paper and hundreds of times thinner than household cling wrap or aluminum foil, their corrugated plates of aluminum oxide spring back to their original shape after being bent and twisted.

Measuring nanoscale features with fractions of light

Fri, 12 Dec 2015
National Institute of Standards and Technology (NIST) researchers are seeing the light, but in an altogether different way. And how they are doing it just might be the semiconductor industry's ticket for extending its use of optical microscopes to measure computer chip features that are approaching 10 nanometers, tiny fractions of the wavelength of light.

Nanoscale drawbridges open path to color displays

Fri, 12 Dec 2015
A new method for building "drawbridges" between metal nanoparticles may allow electronics makers to build full-color displays using light-scattering nanoparticles that are similar to the gold materials that medieval artisans used to create red stained-glass.

Atomically-flat tunnel transistor overcomes fundamental power challenge of electronics

Mon, 12 Dec 2015
A new transistor developed by UC Santa Barbara engineers overcomes one of the fundamental limitations of conventional transistors and reduces power dissipation by over 90 percent.

CEA-Leti and CEA-Inac pave the way for quantum information processing on SOI CMOS platform

Mon, 12 Dec 2015
CEA-Leti today announced preliminary steps for demonstrating a quantum bit, or qubit, the building block of quantum information, in a process utilizing a silicon-on-insulator (SOI) CMOS platform.

Leti develops local-strain techniques in FD-SOI fabrication to improve next-generation performance

Tue, 12 Dec 2015
CEA-Leti today announced it has developed two techniques to induce local strain in FD-SOI processes for next-generation FD-SOI circuits that will produce more speed at the same, or lower, power consumption, and improve performance.

Imec improves performance and reliability of deeply-scaled CMOS logic devices

Wed, 12 Dec 2015
At this week’s IEEE International Electron Devices Meeting 2015, nano-electronics research center imec presented breakthrough results to increase performance and improve reliability of deeply scaled silicon CMOS logic devices.

Variation in build-up substrate layer thicknesses and its impact on FCBGA BLR performance

Tue, 12 Dec 2015
Subtleties in thicknesses between the alternating Cu metal and dielectric layers within a build-up substrate can impact BLR performance.

When front-end-of-line and back-end-of-line reliability meet

Wed, 12 Dec 2015
Due to the further scaling and increasing complexity of transistors, the boundaries between back-end-of-line and front-end-of-line reliability research are gradually fading. Imec’s team leaders Kristof Croes and Dimitri Linten give their vision on the future of reliability research.

Nanostructured metal coatings let the light through for electronic devices

Thu, 12 Dec 2015
Light and electricity dance a complicated tango in devices like LEDs, solar cells and sensors. A new anti-reflection coating developed by engineers at the University of Illinois at Urbana Champaign, in collaboration with researchers at the University of Massachusetts at Lowell, lets light through without hampering the flow of electricity, a step that could increase efficiency in such devices.

Imec boosts performance of beyond-silicon devices

Thu, 12 Dec 2015
At this week’s IEEE IEDM conference, nano-electronics research center imec demonstrates record enhancement of novel InGaAs Gate-All-Around (GAA) channel devices integrated on 300mm Silicon and explores emerging tunnel devices based on optimization of the same III-V compound semiconductor.

New approaches for hybrid solar cells

Thu, 12 Dec 2015
Using a new procedure researchers at the Technical University of Munich (TUM) and the Ludwig Maximillians University of Munich (LMU) can now produce extremely thin and robust, yet highly porous semiconductor layers. A very promising material - for small, light-weight, flexible solar cells, for example, or electrodes improving the performance of rechargeable batteries.

Leti to demonstrate three consumer technology breakthroughs at CES 2016

Tue, 12 Dec 2015
CEA-Leti, an applied-research institute for microelectronics, will demonstrate at CES 2016 three disruptive innovations, ranging from ultra-high-brightness, augmented-reality glasses to extremely high-speed wireless data transmission between mobile devices, and the world’s first TV white-space modem limiting interference in adjacent spectrum bands.

Imec advances 200mm GaN-on-Si tech closer to manufacturing

Mon, 12 Dec 2015
At last week’s IEEE International Electron Devices Meeting 2015, nano-electronics research center imec presented three novel aluminum gallium nitride (AlGaN)/ gallium nitride (GaN) stacks featuring optimized low dispersion buffer designs.

Applied Materials' Chorng-Ping Chang named 2016 IEEE Fellow

Tue, 12 Dec 2015
Applied Materials, Inc. today announced that Dr. Chorng-Ping Chang, who leads the company's strategic external research with universities and industry consortia, has been named a 2016 IEEE Fellow.

Building blocks for GaN power switches

Tue, 12 Dec 2015
A team of engineers from Cornell University, the University of Notre Dame and the semiconductor company IQE has created gallium nitride (GaN) power diodes capable of serving as the building blocks for future GaN power switches -- with applications spanning nearly all electronics products and electricity distribution infrastructures.

Imec, KU Leuven and NERF combine electronics and photonics in neural probes

Thu, 12 Dec 2015
At last week’s IEEE International Electron Devices Meeting 2015, nanoelectronics research center imec, KU Leuven, and Neuro-Electronics Research Flanders (NERF, set up by VIB/KU Leuven and imec) presented a set of silicon neural probes that combine 12 monolithically integrated optrodes using a CMOS compatible process.

SAMCO launches ALD system for electronic devices and next-generation power devices

Fri, 12 Dec 2015
SAMCO has developed and launched a new Atomic Layer Deposition (ALD) system focusing on gate oxide formation of Silicon Carbide (SiC) and Gallium Nitride (GaN) power devices, which are key for energy-saving devices or “green electronics.”

New device uses carbon nanotubes to snag molecules

Tue, 12 Dec 2015
Engineers at MIT have devised a new technique for trapping hard-to-detect molecules, using forests of carbon nanotubes.

A microfluidic biochip for blood cell counts at the point-of-care

Tue, 12 Dec 2015
Teams of researchers from the University of Illinois at Urbana-Champaign (UIUC) have demonstrated a biosensor capable of counting the blood cells electrically using only a drop of blood.

Choreographing the dance of electrons

Mon, 1 Jan 2016
NUS scientists have discovered how to manipulate electrons in thin semiconductors by encapsulating them in atomically thin materials and changing the electric field.

New bimetallic alloy nanoparticles for printed electronic circuits

Tue, 1 Jan 2016
"Printed electronics" has the potential to enable low-cost fabrication of electronics on flexible or curved surfaces, which will lead to the use of electronics in more varied applications.

Promising new approach for controlled fabrication of carbon nanostructures

Tue, 1 Jan 2016
An international team of researchers including Professor Federico Rosei and members of his group at INRS has developed a new strategy for fabricating atomically controlled carbon nanostructures used in molecular carbon-based electronics.

Nanoworld 'snow blowers' carve straight channels in semiconductor surfaces

Wed, 1 Jan 2016
The surprising trenching capability, reported by scientists from the National Institute of Standards and Technology (NIST) and IBM, is an important addition to the toolkit of nature-supplied 'self-assembly' methods that researchers aim to harness for making useful devices.

Aluminum nanoparticles could improve electronic displays

Wed, 1 Jan 2016
Whether showing off family photos on smartphones or watching TV shows on laptops, many people look at liquid crystal displays (LCDs) every day.

Imec and Cloudtag collaborate on frictionless wearables

Thu, 1 Jan 2016
Cloudtag and imec, the nanoelectronics research center, today presented the first results of their collaboration on accurate frictionless wearable health solutions.

Researchers gauge quantum properties of nanotubes, essential for next-gen electronics

Thu, 1 Jan 2016
Imaging method allowed researchers to measure the nanotube quantum capacitance-a very unique property of an object from the nano-world.

Electronically connected graphene nanoribbons foresee high-speed electronics

Fri, 1 Jan 2016
Chemical interconnection bridges electronic properties of graphene-nanoribbons with zigzag-edge features.

Wide Band Gap technologies: An opportunity to increase power devices performance

Fri, 1 Jan 2016
When people think about Wide Band Gap (WBG) materials for power electronics applications, they usually think of GaN or SiC. However, there are materials with an even larger band gap which can further increase power device performance.

Wirelessly supplying power to brain

Mon, 2 Feb 2016
A research team at the Department of Electrical and Electronic Information Engineering at Toyohashi University of Technology has developed a wafer-level packaging technique to integrate a silicon large-scale integration (LSI) chip in a very thin film of a thickness 10 μm.

Visualizing atoms of perovskite crystals

Fri, 1 Jan 2016
OIST researchers conduct the first atomic resolution study of perovskites used in next generation solar cells.

Collaboration is the centerpiece to push the limits of lithography

Mon, 1 Jan 2016
The continuation of Moore’s Law requires a combination of both physical and functional scaling, where our main challenge in lithography is to continue pushing the physical scaling limits in a controlled and cost-effective way.

Flash, STT-MRAM and resistive RAM: They all come with different challenges

Mon, 1 Jan 2016
Research in memory is really exciting these days: in parallel you have the scaling of classical memories (SRAM, DRAM, Flash) and the emergence of new memories capable of enabling new applications or even new system hierarchies. At imec, we mostly focus on three concepts which all come with different challenges.

Stanford researchers advance area selective ALD to develop more energy efficient electronics

Tue, 1 Jan 2016
Stanford University researchers sponsored by Semiconductor Research Corporation (SRC) have developed a new area selective atomic layer deposition (ALD) process that promises to accelerate the manufacturing of higher performing, more energy efficient semiconductors.

Uncovering oxygen's role in enhancing red LEDs

Wed, 1 Jan 2016
While oxygen can impede the effectiveness of gallium nitride (GaN), an enabling material for LEDs, small amounts of oxygen in some cases are needed to enhance the devices' optical properties.

How copper makes organic light-emitting diodes more efficient

Wed, 1 Jan 2016
Scientists of Karlsruhe Institute of Technology (KIT), CYNORA, and the University of St Andrews have now measured the underlying quantum mechanics phenomenon of intersystem crossing in a copper complex.

New LED with luminescent proteins

Wed, 1 Jan 2016
Scientists from Germany and Spain have discovered a way to create a BioLED by packaging luminescent proteins in the form of rubber.

Annihilating nanoscale defects

Thu, 1 Jan 2016
Researchers at the University of Chicago and the U.S. Department of Energy's Argonne National Laboratory, led by Juan de Pablo and Paul Nealey, may have found a way for the semiconductor industry to hit miniaturization targets on time and without defects.

Engineers invent a bubble-pen to write with nanoparticles

Thu, 1 Jan 2016
Researchers at the Cockrell School of Engineering at The University of Texas at Austin have developed a device and technique, called bubble-pen lithography, that can gently and effectively handle nanoparticles.

Bismuth-based nanoribbons show 'topological' transport, potential for new technologies

Tue, 1 Jan 2016
Researchers have created nanoribbons of an emerging class of materials called topological insulators and used a magnetic field to control their semiconductor properties, a step toward harnessing the technology to study exotic physics and building new spintronic devices or quantum computers.

Team develops wireless, dissolvable sensors to monitor brain

Mon, 1 Jan 2016
A team of neurosurgeons and engineers has developed wireless brain sensors that monitor intracranial pressure and temperature and then are absorbed by the body, negating the need for surgery to remove the devices.

Pfeiffer Vacuum presents innovative vacuum solutions at the trade fairs Semicon Korea and Semicon China

Mon, 1 Jan 2016
Pfeiffer Vacuum, a global supplier of vacuum technology, will be exhibiting at the SEMICON Korea Trade Fair in Seoul from January 27 to 29 and Semicon China in Shanghai from March 15 to 17.

Physicists develop a cooling system for the processors of the future

Tue, 1 Jan 2016
Researchers from MIPT have found a solution to the problem of overheating of active plasmonic components.

Graphene oxide 'paper' changes with strain

Tue, 1 Jan 2016
The same slip-and-stick mechanism that leads to earthquakes is at work on the molecular level in nanoscale materials, where it determines the shear plasticity of the materials, according to scientists at Rice University and the State University of Campinas, Brazil.

Switchable material could enable new memory chips

Wed, 1 Jan 2016
Two MIT researchers have developed a thin-film material whose phase and electrical properties can be switched between metallic and semiconducting simply by applying a small voltage.

New process enables easier isolation of carbon nanotubes

Wed, 1 Jan 2016
A newly developed method has opened up new possibilities in carbon nanotube development.

Molecular-like photochemistry from semiconductor nanocrystals

Thu, 1 Jan 2016
Researchers from North Carolina State University have demonstrated the transfer of triplet exciton energy from semiconductor nanocrystals to surface-bound molecular acceptors, extending the lifetime of the originally prepared excited state by six orders of magnitude.

Cypress supports wafer sales on leading F-RAM and nvSRAM Portfolio

Thu, 1 Jan 2016
Cypress Semiconductor Corp., today announced the addition of wafer products to its industry-leading nonvolatile random access memory (NVRAM) portfolio.

Microsemi launches PIN diode switch element

Thu, 1 Jan 2016
Microsemi Corporation today announced a new high power monolithic microwave surface mount (MMSM) series-shunt SP2T PIN diode reflective switch.

Cornell-led team creates gallium nitride power diode

Fri, 1 Jan 2016
Making tiny switches do enormous jobs in a more efficient way than current technology allows is one of the goals of a research team led by Cornell engineering professor Huili (Grace) Xing.

Entegris announces new post-CMP cleaning solutions

Tue, 1 Jan 2016
Entegris, Inc., a developer of yield-enhancing materials and solutions, today announced new post-chemical mechanical planarization (post-CMP) cleaning solutions for semiconductor manufacturing.

IBS report electric transport across molybdenum disulfide grain boundaries

Wed, 1 Jan 2016
The Center for Integrated Nanostructure Physics (CINAP) within IBS has reported results correlating the flake merging angle with grain boundary (GBs) properties, and proven that increasing the merging angle of GBs drastically improves the flow of electrons.

A step towards keeping up with Moore's Law

Thu, 1 Jan 2016
POSTECH researchers develop a novel and efficient fabrication technology for cross-shaped memristor.

Breakthrough enables ultra-fast transport of electrical charges in polymers

Thu, 1 Jan 2016
A research team at Umeå University in Sweden has showed, for the first time, that a very efficient vertical charge transport in semiconducting polymers is possible by controlled chain and crystallite orientation.

Strain allows control of the magnetic properties of individual iron atom

Fri, 1 Jan 2016
A team of scientists from the University of Warsaw has just shown that by using sufficiently large strain it is possible to tailor the energy spectrum of the iron atom to obtain doubly degenerate (magnetic) ground state.

A new approach to chip fabrication

Fri, 1 Jan 2016
MIT researchers and their colleagues report the first chip-fabrication technique that enables significantly different materials to be deposited in the same layer.

Electrons and liquid helium advance understanding of zero-resistance

Mon, 2 Feb 2016
The end of Moore's Law -- the prediction that transistor density would double every two years -- was one of the hottest topics in electronics-related discussions in 2015.

Imec and Vrije Universiteit Brussel present small, low-cost, low-power chip for multi-gigabit 60GHz communication

Wed, 2 Feb 2016
At this week's IEEE International Solid-State Circuits Conference (ISSCC2016), nanoelectronics research center imec and Vrije Universiteit Brussel (VUB) presented a four-antenna path beamforming transceiver for 60GHz multi Gb/s communication in 28nm CMOS technology.

Spin dynamics in an atomically thin semiconductor

Tue, 2 Feb 2016
Researchers at the National University of Singapore and Yale-NUS College have established the mechanisms for spin motion in molybdenum disulfide, an emerging 2-dimensional material.

Self-calibrated 10 Mbit/s phase modulator exceeds state-of-the-art performance

Wed, 2 Feb 2016
At this week's IEEE International Solid-State Circuits Conference (ISSCC2016), nanoelectronics research center imec and Vrije Universiteit Brussel (VUB) presented a self-calibrated high-speed (10Mbits/s) phase modulator achieving an excellent Error Vector Magnitude (EVM) of -37dB at 10.25 GHz.

Researchers discover new phase of boron nitride and a new way to create pure c-BN

Wed, 2 Feb 2016
Researchers at North Carolina State University have discovered a new phase of the material boron nitride (Q-BN), which has potential applications for both manufacturing tools and electronic displays.

Scientists guide gold nanoparticles to form 'diamond' superlattices

Thu, 2 Feb 2016
Scientists have devised a way to trap and arrange nanoparticles in a way that mimics the crystalline structure of diamond. The achievement of this complex yet elegant arrangement may open a path to new materials that take advantage of the optical and mechanical properties of this crystalline structure for applications such as optical transistors, color-changing materials, and lightweight yet tough materials.

Researchers develop hack-proof RFID chips

Thu, 2 Feb 2016
New technology could secure credit cards, key cards, and pallets of goods in warehouses.

The iron stepping stones to better wearable tech without semiconductors

Fri, 2 Feb 2016
The road to more versatile wearable technology is dotted with iron. Specifically, quantum dots of iron arranged on boron nitride nanotubes (BNNTs).

Helium reduction at pre-metal sub-atmospheric CVD

Mon, 2 Feb 2016
A novel SACVD PMD invention sets the benchmark for helium reduction efforts by achieving four key objectives: cost reduction, quality, process robustness and productivity.

New thin film transistor may lead to flexible devices

Wed, 2 Feb 2016
An engineering research team at the University of Alberta has invented a new transistor that could revolutionize thin-film electronic devices.

Renesas unveils 90nm one-transistor MONOS flash memory tech

Thu, 2 Feb 2016
Renesas Electronics Corp. reported the development of 90nm one-transistor MONOS (1T-MONOS) flash memory technology that can be used in combination with a variety of processes.

Graphene leans on glass to advance electronics

Fri, 2 Feb 2016
Scientists have developed a simple and powerful method for creating resilient, customized, and high-performing graphene: layering it on top of common glass.

Imec presents compact lens-free digital microscope

Fri, 2 Feb 2016
At next week’s SPIE Photonics West 2016, imec will demonstrate a lens-free microscope for large field-of-view live imaging at micrometer resolution.

Imec introduces broad spectrum hyperspectral imaging solutions

Mon, 2 Feb 2016
At this week's SPIE Photonics West, imec will present a new set of hyperspectral sensor and camera solutions with extended spectral range, going from the visible light (VIS) up to near infrared (NIR).

Engineering material magic

Mon, 2 Feb 2016
University of Utah engineers have discovered a new kind of 2D semiconducting material for electronics that opens the door for much speedier computers and smartphones that also consume a lot less power.

A new spin on quantum computing: Scientists train electrons with microwaves

Mon, 2 Feb 2016
Experiment with Berkeley lab-developed material shows promise for quantum information processing.

Cadence Innovus Implementation System qualified on Samsung 10nm FinFET process

Tue, 2 Feb 2016
Cadence Design Systems, Inc. today announced that the Cadence Innovus Implementation System has been qualified for Samsung Foundry's latest 10-nanometer (10nm) process.

New technique for turning sunlight into hydrogen

Tue, 2 Feb 2016
A team of Korean researchers, affiliated with UNIST has recently pioneered in developing a new type of multilayered (Au NPs/TiO2/Au) photoelectrode that boosts the ability of solar water-splitting to produce hydrogen.

CU-Boulder ultrafast microscope used to make slow-motion electron movie

Wed, 2 Feb 2016
University of Colorado Boulder researchers have demonstrated the use of the world's first ultrafast optical microscope, allowing them to probe and visualize matter at the atomic level with mind-bending speed.

Veeco launches new K475i As/P MOCVD system

Thu, 2 Feb 2016
Veeco Instruments Inc. announced today the launch of the new TurboDisc K475i Arsenic Phosphide MOCVD System for the production of red, orange, yellow light emitting diodes.

Low-outgassing Faraday Isolators to improve lifetime and reliability of optical systems

Thu, 2 Feb 2016
Qioptiq, an Excelitas Technologies company introduces the LINOS Low-outgassing Faraday Isolators, the first of their kind.

Advance could aid development of nanoscale biosensors

Thu, 2 Feb 2016
Researchers from Brown University's School of Engineering have made an important fundamental advance that could make such devices more practical.

First-of-a-kind tunable balance network for electrical balance duplexers supporting all LTE bands from 0.7-1GHz

Fri, 2 Feb 2016
Nanoelectronics research center imec and Vrije Universiteit Brussel (VUB) present a frequency division duplex (FDD) balance network, capable of dual-frequency impedance tuning for all LTE bands in the 0.7-to-1GHz range.

Soitec announces volume manufacturing of 300mm RF-SOI substrates

Fri, 2 Feb 2016
Soitec (Euronext), a manufacturer of semiconductor materials and a supplier of wafers for radio-frequency silicon-on-insulator (RF-SOI) applications, has begun mass production of 300mm RF-SOI substrates for mobile communications.

Bosch Sensortec launches vital sensor hubs for wearables at Mobile World Congress 2016

Mon, 2 Feb 2016
Today, at the 2016 Mobile World Congress, Bosch Sensortec introduces its first generation of sensor hub products with optimized vital sensing features.

imec reveals impact of DSA process variations on electrical performance of DSA-formed vias

Wed, 2 Feb 2016
Today, at SPIE Advanced Lithography Conference, imec will present electrical results of DSA-formed vias, gaining insight in the impact of DSA processing variations on electrical readout.

Imec, Inpria and TEL demonstrate integrated fab process for metal-oxide EUV photoresist

Tue, 2 Feb 2016
imec, Inpria and TEL will present the first integrated patterning process for next generation high-resolution devices using a non-chemically amplified metal containing photoresist and EUV lithography.

New NTU microchip shrinks radar cameras to fit into a palm

Tue, 2 Feb 2016
NTU's new radar chip was presented and published at the prestigious International Solid-State Circuits Conference (ISSCC) 2016.

Call for Papers open for SEMICON Europa 2016 and 2016FLEX Europe

Wed, 2 Feb 2016
SEMI today announced the "Call for Papers" for technical sessions and presentations for SEMICON Europa 2016 which takes place 25-27 October in Grenoble, France.

New molecular property may mean more efficient solar and opto-electronic devices

Thu, 2 Feb 2016
Scientists at the University of Massachusetts Amherst identified an unexpected property in an organic semiconductor molecule that could lead to more efficient and cost-effective materials for use in displays.

Physicists promise a copper revolution in nanophotonics

Thu, 2 Feb 2016
Researchers from the Moscow Institute of Physics and Technology (MIPT) have for the first time experimentally demonstrated that copper nanophotonic components can operate successfully in photonic devices.

ORNL researchers stack the odds for novel optoelectronic 2-D materials

Thu, 3 Mar 2016
Stacking layers of nanometer-thin semiconducting materials at different angles is a new approach to designing the next generation of energy-efficient transistors and solar cells.

Artificial control of exciplexes opens possibilities for new electronics

Fri, 2 Feb 2016
Researchers at Kyushu University were able to widely vary the emission color and efficiency of OLEDs.

Nova and imec developed scatterometry approach for self-aligned quadruple patterning process control

Fri, 2 Feb 2016
imec and Nova Measuring Instruments announced this week that they are jointly developing an innovative scatterometry approach to enable SAQP process control.

Stretchable electronics that quadruple in length

Mon, 2 Feb 2016
EPFL researchers have developed conductive tracks that can be bent and stretched up to 4 times their original length; they could be used in artificial skin, connected clothing and on­-body sensors.

New form of electron-beam imaging can see elements that are 'invisible' to common methods

Mon, 2 Feb 2016
Scientists at Berkeley Lab developed a new imaging technique that greatly improves images of light elements using fewer electrons.

Lifetime breakthrough promising for low-cost and efficient OLED displays and lights

Tue, 3 Mar 2016
Researchers increased the device lifetime of OLEDs that use a recently developed class of molecules to convert electricity into light.

Spinning better electronic devices

Wed, 3 Mar 2016
Researchers demonstrate a proof-of-concept device that could take advantage of spin of electrons to potentially create more energy efficient electronic devices.

NREL collaboration boosts potential for CdTe solar cells

Wed, 3 Mar 2016
A critical milestone has been reached in cadmium telluride (CdTe) solar cell technology, helping pave the way for solar energy to directly compete with electricity generated by conventional energy sources.

Carbon nanotubes improve metal's longevity under radiation

Thu, 3 Mar 2016
A team of researchers at MIT and elsewhere has found that, at least in some reactors, adding a tiny quantity of carbon nanotubes to the metal can dramatically slow this breakdown process.

Electricity can flow through graphene at high frequencies without energy loss

Fri, 3 Mar 2016
Research has shown graphene out-performs any other known material, including superconductors, when carrying high-frequency electrical signals compared to direct current, essentially transmitting signals without any additional energy loss.

The secret to 3-D graphene? Just freeze it

Fri, 3 Mar 2016
A recent study describes how a research team used a modified 3-D printer and frozen water to create lattice-shaped cubes and a three-dimensional truss with overhangs using graphene oxide.

'Bending current' opens up the way for a new type of magnetic memory

Mon, 3 Mar 2016
Use your computer without the need to start it up: a new type of magnetic memory makes it possible. This "MRAM" is faster, more efficient and robust than other kinds of data storage. However, switching bits still requires too much electrical power to make large-scale application practicable.

Building a better mouse trap, from the atoms up

Mon, 3 Mar 2016
For most of human history, the discovery of new materials has been a crapshoot. But now, UConn researchers have systematized the search with machine learning that can scan millions of theoretical compounds for qualities that would make better solar cells, fibers, and computer chips. The search for new materials may never be the same.

Researchers take giant step towards 'holy grail' of silicon photonics

Mon, 3 Mar 2016
A group of researchers from the UK, including academics from Cardiff University, has demonstrated the first practical laser that has been grown directly on a silicon substrate.

Warming up optoelectronic research

Tue, 3 Mar 2016
A team of physicists from the University of California, San Diego and The University of Manchester is creating tailor-made materials for cutting-edge research and perhaps a new generation of optoelectronic devices.

Think small

Wed, 3 Mar 2016
Students learn huge challenges involved in making tiny devices in SEAS Microfabrication Laboratory.

Light helps the transistor laser switch faster

Wed, 3 Mar 2016
A new study by University of Illinois engineers found that in the transistor laser, a device for next-generation high-speed computing, the light and electrons spur one another on to faster switching speeds than any devices available.

JOANNEUM RESEARCH and EV Group develop large-area nanoimprint lithography solutions

Thu, 3 Mar 2016
EVG and JOANNEUM RESEARCH today announced that they are collaborating on a joint-solution for research and development activities in large-area nanoimprinting leveraging the EVG770 automated UV-nanoimprint lithography step-and-repeat system.

GLOBALFOUNDRIES releases new 7SW SOI RF PDK featuring latest Keysight Technologies design software

Thu, 3 Mar 2016
GLOBALFOUNDRIES today announced the availability of a new set of process design kits (PDKs) with an interoperable co-design flow to help chip designers improve design efficiency and deliver differentiated RF front-end solutions in increasingly sophisticated mobile devices.

Multitest introduces mmWave Contactor

Thu, 3 Mar 2016
Multitest successfully introduced a contacting solution for testing of extremely high frequency semiconductors in high volume production.

World's thinnest lens to revolutionize cameras

Fri, 3 Mar 2016
Scientists have created the world's thinnest lens, one two-thousandth the thickness of a human hair, opening the door to flexible computer displays and a revolution in miniature cameras.

EV Group scales up nanoimprint lithography for display manufacturing

Mon, 3 Mar 2016
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 7200 LA SmartNIL system for display manufacturing and other applications that require large-area substrates.

GLOBALFOUNDRIES broadens SiGe power amplifier portfolio

Tue, 3 Mar 2016
GLOBALFOUNDRIES today announced new advanced radio-frequency (RF) silicon solutions, further expanding the portfolio of Silicon Germanium (SiGe) power amplifier (PA) technologies designed to enable performance-optimized cellular and Wi-Fi solutions in increasingly sophisticated mobile devices and hardware.

Edwards launches new vacuum pumps at SEMICON China 2016

Tue, 3 Mar 2016
Edwards announced the availability of two new vacuum pump product families at SEMICON China: the iXM Series for semiconductor etch and chemical vapor deposition (CVD) applications, and the iXL900R for fast pump down of large flat panel display (FPD) loadlock chambers.

Making electronics safer with perovskites

Wed, 3 Mar 2016
Scientists in Japan are developing methods to manufacture safer ceramic capacitors.

Nanostructures promise big impact on higher-speed, lower-power optical devices

Wed, 3 Mar 2016
With new technology getting smaller and smaller, requiring lower power, University of Cincinnati physics research points to new robust electronic technologies using quantum nanowire structures.

Replacement for silicon devices looms big with ORNL discovery

Thu, 3 Mar 2016
Two-dimensional electronic devices could inch closer to their ultimate promise of low power, high efficiency and mechanical flexibility with a processing technique developed at the Department of Energy's Oak Ridge National Laboratory.

New research shows how nanowires can be formed

Thu, 3 Mar 2016
Researchers learning to control the properties of materials this way can lead the way to more efficient electronic devices.

IRT Nanoelec project integrates laser directly on silicon with a modulator

Fri, 3 Mar 2016
IRT Nanoelec today announced the first co-integration of a III-V/silicon laser and silicon Mach Zehnder modulator demonstrating 25 Gbps transmission on a single channel.

Imec enhances its silicon photonics platform to support 50Gb/s non-return-to-zero optical lane rates

Mon, 3 Mar 2016
Nanoelectronics research center imec presents at OFC 2016, the international event for both the science and business of optical communications held March 20-24, performance improvements of various key building blocks of its wafer-scale integrated silicon photonics platform (iSiPP).

Pumping up energy storage with metal oxides

Mon, 3 Mar 2016
Material scientists at Lawrence Livermore National Laboratory have found certain metal oxides increase capacity and improve cycling performance in lithium-ion batteries.

New way to control particle motions on 2-D materials

Mon, 3 Mar 2016
Researchers at MIT and other institutions have found a new phenomenon in the behavior of a kind of quasiparticles called plasmons as they move along tiny ribbons of two-dimensional materials such as graphene and TMDs

Wrinkles and crumples make graphene better

Tue, 3 Mar 2016
Crumple a piece of paper and it's probably destined for the trash can, but new research shows that repeatedly crumpling sheets of the nanomaterial graphene can actually enhance some of its properties. In some cases, the more crumpled the better.

Printing nanomaterials with plasma

Wed, 3 Mar 2016
Printing has come a long way since the days of Johannes Gutenberg. Now, researchers have developed a new method that uses plasma to print nanomaterials onto a 3-D object or flexible surface, such as paper or cloth. The technique could make it easier and cheaper to build devices like wearable chemical and biological sensors, flexible memory devices and batteries, and integrated circuits.

Bath semiconductor research boosted by new nano-scale patterning equipment

Thu, 3 Mar 2016
The University of Bath is the only university in the UK to have installed a unique Nano-Lithography printing system, enabling Bath to lead the way in the development of advanced manufacturing techniques for nano-engineered semiconductors.

Graphene nanoribbons: It's all about the edges

Thu, 3 Mar 2016
As electronic components are becoming ever smaller, the industry is gradually approaching the limits of what is achievable using the traditional approach with silicon as a semiconductor material.

Trace metal contamination: Choosing elastomer materials for critical operations

Fri, 3 Mar 2016
An exploration of where trace metals come from, the impact they have on the industry and what can be done to reduce the risks.

ACM demonstrates damage-free cleaning technology on 1Xnm patterned wafer

Mon, 3 Mar 2016
ACM Research (Shanghai), Inc. has announced that it has solved the problem of patterned wafer cleaning.

CyberOptics showcases high-precision humidity measurement sensor at SEMICON China

Tue, 3 Mar 2016
CyberOptics Corporation, a global developer and manufacturer of high precision 3D sensing technology solutions, will showcase WaferSense and ReticleSense Auto Multi Sensors (AMS) at SEMICON China, March 15-17, 2015 in the PSC and KNG booth #3358 and the Winifred booth #1461.

Effective graphene doping depends on substrate material

Tue, 3 Mar 2016
Juelich physicists have discovered unexpected effects in doped graphene - i.e. graphene that is mixed with foreign atoms.

New magnet discovered

Wed, 3 Mar 2016
A group of researchers from Osaka University and The University of Tokyo discovered a new magnet capable of controlling Dirac fermions with zero mass.

Managing hazardous process exhausts in high volume manufacturing

Wed, 3 Mar 2016
Integrated sub-fab systems allow HVM fab operators to safely and efficiently implement new processes containing hazardous process chemicals.

A new class of MFCs with embedded flow diagnostics

Thu, 3 Mar 2016
Recent trends in multi-sensor measurements within a mass flow controller are reviewed, with a focus on controller self-diagnostics.

Molecular-scale ALD discovery could have industrial-sized impact

Thu, 3 Mar 2016
In the world of nano-scale technology, where work is conducted at the atomic level, even the smallest changes can have an enormous impact. And a new discovery by a University of Alberta materials engineering researchers has caught the attention of electronics industry leaders looking for more efficient manufacturing processes.

Becoming crystal clear

Wed, 4 Apr 2016
UCSB researchers identify specific defects in LED diodes that lead to less efficient solid state lighting.

TowerJazz announces its SiGe Terabit Platform

Tue, 4 Apr 2016
TowerJazz, the global specialty foundry, today announced its SiGe Terabit Platform targeting high-speed wireline communications for the terabit age.

For rechargeable batteries that crush the competition, crush this material

Fri, 4 Apr 2016
By chemically modifying and pulverizing a promising group of compounds, scientists at the National Institute of Standards and Technology (NIST) have potentially brought safer, solid-state rechargeable batteries two steps closer to reality.

Heat and light get larger at the nanoscale

Fri, 4 Apr 2016
In a new study recently published in Nature Nanotechnology, researchers from Columbia Engineering, Cornell, and Stanford have demonstrated heat transfer can be made 100 times stronger than has been predicted, simply by bringing two objects extremely close--at nanoscale distances--without touching.

Nanotubes line up to form films

Mon, 4 Apr 2016
A simple filtration process helped Rice University researchers create flexible, wafer-scale films of highly aligned and closely packed carbon nanotubes.

IEEE Photonics Society's Issues Call for Papers for 13th International Group IV Photonics Conference

Mon, 4 Apr 2016
The 2016 International Group IV Photonics Conference, sponsored by the IEEE Photonics Society, has announced the Call for Papers seeking original research on the Novel Materials & Nanophotonics; Photonic Devices; and Silicon Photonics Applications & Systems.

NREL reveals potential for capturing waste heat via nanotubes

Wed, 4 Apr 2016
A finely tuned carbon nanotube thin film has the potential to act as a thermoelectric power generator that captures and uses waste heat, according to researchers at the Energy Department's National Renewable Energy Laboratory (NREL).

Crumpling approach enhances photodetectors' light responsivity

Thu, 4 Apr 2016
Researchers from the University of Illinois at Urbana-Champaign have demonstrated a new approach to modifying the light absorption and stretchability of atomically thin two-dimensional (2D) materials by surface topographic engineering using only mechanical strain.

Rudolph adds high-speed 3D metrology to the NSX Series for advanced packaging process control

Thu, 4 Apr 2016
Rudolph Technologies, Inc. today announced the availability of new, high-speed 3D metrology on its flagship NSX Series, a highly-flexible inspection and measurement platform for process development and control of die-level interconnects.

Quantum dots enhance light-to-current conversion in layered semiconductors

Fri, 4 Apr 2016
Harnessing the power of the sun and creating light-harvesting or light-sensing devices requires a material that both absorbs light efficiently and converts the energy to highly mobile electrical current.

The future is here: Interactive screens on your packages

Fri, 4 Apr 2016
Instead of reading a label, consumers could be interacting with an electronic screen on packaging in the future, thanks to a revolutionary new development by scientists at the University of Sheffield.

Topology explains strange electrical current boost in non-magnetic metal

Mon, 4 Apr 2016
Insights from pure mathematics are lending new insights to material physics, which could aid in development of new devices and sensors.

Leti extends collaboration with Qualcomm on CoolCube 3D integration technology

Tue, 4 Apr 2016
Leti, an institute of CEA Tech, today announced the continuation of its collaboration with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to develop CoolCube.

Micron accelerates data center storage with new NVMe PCIe SSD portfolio

Tue, 4 Apr 2016
Micron Technology, Inc. today announced a new portfolio of PCIe solid state drives (SSDs) that leverage the high-performance NVMe protocol.

Imec Technology Forum Brussels puts nanotechnology in the hot seat

Wed, 4 Apr 2016
Imec, the nanoelectronics research center, today announced that its annual Imec Technology Forum (ITF) in Brussels will take place May 24-25, 2016 in Brussels, Belgium at SQUARE, Brussels Meeting Centre

imec and Crystal Solar demonstrate 22.5% nPERT Si solar cells on kerfless epitaxial wafers

Thu, 4 Apr 2016
Crystal Solar’s kerfless wafers are a disruptive solution for the solar cell industry, substantially reducing the cost of Si solar cells.

MU, STMicroelectronics improve medical care with miniature ultrasound diagnostic device

Thu, 4 Apr 2016
MU, a medical-device manufacturer, and STMicroelectronics today announced that MU's US-304 portable ultrasound imager, powered by ST's STHV800 pulser, is aiming to increase the quality of point-of-care medical diagnostics in remote rural areas of Africa.

IEEE International Electron Devices Meeting announces 2016 Call for Papers

Fri, 4 Apr 2016
The 62nd annual IEEE International Electron Devices Meeting (IEDM), to be held at the San Francisco Union Square Hilton hotel December 3 - 7, 2016, has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

'Odd couple' monolayer semiconductors align to advance optoelectronics

Fri, 4 Apr 2016
In a study led by the Department of Energy's Oak Ridge National Laboratory, scientists synthesized a stack of atomically thin monolayers of two lattice-mismatched semiconductors.

New nanodevice shifts light's color at single-photon level

Mon, 4 Apr 2016
Scientists at the National Institute of Standards and Technology (NIST) have now developed a miniaturized version of a frequency converter, using technology similar to that used to make computer chips.

What screens are made of: New twists (and bends) in LCD research

Mon, 4 Apr 2016
Using a pioneering X-ray technique developed at Berkeley Lab, a research team has recorded the first direct measurements confirming a tightly wound spiral molecular arrangement that could help unravel the mysteries of its formation and possibly improve LCD performance.

Dow Corning previews upcoming products, showcases optical silicones benefits at LIGHTFAIR 2016

Tue, 4 Apr 2016
Dow Corning will present an exclusive glimpse of upcoming products and technologies at LIGHTFAIR International 2016.

Researchers develop new semiconducting polymer for forthcoming flexible electronics

Wed, 4 Apr 2016
A joint research team has developed a new n-type semiconducting polymer with superior electron mobility and oxidative stability.

UW-Madison engineers fabricate fastest flexible silicon transistor

Wed, 4 Apr 2016
Working in collaboration with colleagues around the country, University of Wisconsin-Madison engineers have pioneered a unique method that could allow manufacturers to easily and cheaply fabricate high-performance transistors with wireless capabilities on huge rolls of flexible plastic.

NRL reveals novel uniform coating process of p-ALD

Wed, 4 Apr 2016
Scientists at the U.S. Naval Research Laboratory (NRL) have devised a clever combination of materials to reveal that particle atomic layer deposition deposits a uniform nanometer-thick shell on core particles regardless of core size.

Astronics announces orders for its test systems semiconductor product line

Thu, 4 Apr 2016
Astronics Test Systems ("ATS") has been awarded a number of follow-on orders from its largest customer valued at approximately $20 million.

Gigaphoton unveils "GIGANEX"

Fri, 4 Apr 2016
Gigaphoton Inc., a major semiconductor lithography light source manufacturer, announced its new excimer laser brand “GIGANEX” on April 1, 2016.

Rare Earth atoms see the light

Mon, 4 Apr 2016
Physicist Dirk Bouwmeester discovers a promising route for combined optical and solid state-based quantum information processing.

NREL theory establishes a path to high-performance 2-D semiconductor devices

Tue, 4 Apr 2016
Researchers at the Energy Department's National Renewable Energy Laboratory (NREL) have uncovered a way to overcome a principal obstacle in using two-dimensional (2D) semiconductors in electronic and optoelectronic devices.

NREL finds nanotube semiconductors well-suited for PV systems

Wed, 4 Apr 2016
Researchers at the Energy Department's National Renewable Energy Laboratory (NREL) discovered single-walled carbon nanotube semiconductors could be favorable for photovoltaic systems because they can potentially convert sunlight to electricity or fuels without losing much energy.

University of Illinois researchers create 1-step graphene patterning method

Thu, 4 Apr 2016
Researchers from the University of Illinois at Urbana-Champaign have developed a one-step, facile method to pattern graphene by using stencil mask and oxygen plasma reactive-ion etching, and subsequent polymer-free direct transfer to flexible substrates.

Hybrid nanoantennas -- next-generation platform for ultradense data recording

Thu, 4 Apr 2016
A group of scientists from ITMO University in Saint Petersburg has put forward a new approach to effective manipulation of light at the nanoscale based on hybrid metal-dielectric nanoantennas.

GLOBALFOUNDRIES releases performance-enhanced 130nm SiGe RF technology

Mon, 5 May 2016
GLOBALFOUNDRIES today announced a next-generation radio-frequency (RF) silicon solution for its Silicon Germanium (SiGe) high-performance technology portfolio.

Could aluminum nitride be engineered to produce quantum bits?

Mon, 5 May 2016
Silicon semiconductors are reaching their physical limits—it’ll probably happen within the next five to 10 years—but if we can implement qubits into semiconductors, we will be able to move beyond silicon.

Exploring phosphorene, a promising new material

Tue, 5 May 2016
Researchers have developed a new method to quickly and accurately determine the orientation of phosphorene, a promising material with potential application as a material for semiconducting transistors in ever faster and more powerful computers.

Dow's Peter Trefonas, Ph.D, to receive prestigious Perkin Medal

Thu, 5 May 2016
The Society of Chemical Industry (SCI), America Group, announced today that Peter Trefonas, Ph.D., corporate fellow in Electronic Materials at The Dow Chemical Company, has won the 2016 SCI Perkin Medal.

Molybdenum disulfide holds promise for light absorption

Thu, 5 May 2016
Rice University researchers probe light-capturing properties of atomically thin MoS2.

A compact, efficient single photon source that operates at ambient temperatures on a chip

Fri, 5 May 2016
Highly directional single photon source concept is expected to lead to a significant progress in producing compact, cheap, and efficient sources of quantum information bits for future applications.

Making invisible physics visible

Fri, 5 May 2016
The Jayich Lab has created a new sensor technology that captures nanoscale images with high spatial resolution and sensitivity.

Best of both worlds

Mon, 5 May 2016
More, faster, better, cheaper. These are the demands of our device-happy and data-centered world. Meeting these demands requires technologies for processing and storing information.

NUS scientists develop method to improve photoluminescence efficiency of 2-D semiconductors

Mon, 5 May 2016
A team led by researchers from the National University of Singapore (NUS) has developed a method to enhance the photoluminescence efficiency of tungsten diselenide, a two-dimensional semiconductor, paving the way for the application of such semiconductors in advanced optoelectronic and photonic devices.

Researchers integrate diamond/boron nitride crystalline layers for high-power devices

Tue, 5 May 2016
Materials researchers at North Carolina State University have developed a new technique to deposit diamond on the surface of cubic boron nitride (c-BN), integrating the two materials into a single crystalline structure.

Novel functionalized nanomaterials for CO2 capture

Tue, 5 May 2016
Climate change due to excessive CO2 levels is one of the most serious problems mankind has ever faced. CO2 emissions need to be reduced urgently to avoid potentially dangerous and irreversible effects of climate change. To mitigate such emissions, CO2 capture is one of the best solutions. Scientists at the Tata Institute of Fundamental Research, Mumbai, have developed novel functionalized nanomaterials that can capture CO2 with superior capture capacity and stability over conventional sorbents.

EV Group receives multiple orders for GEMINI FB XT fusion bonder for 3D chip stacking production applications

Wed, 5 May 2016
EV Group (EVG) announced that it has received multiple orders for its GEMINI FB XT automated fusion wafer bonders from multiple leading device manufacturers.

New research shows how silver could be the key to gold-standard flexible gadgets

Wed, 5 May 2016
Research published in the journals Materials Today Communications and Scientific Reports has described how silver nanowires are proving to be the ideal material for flexible, touch-screen technologies while also exploring how the material can be manipulated to tune its performance for other applications.

Si2 launches project to develop new integrated circuit power modeling technology

Thu, 5 May 2016
Silicon Integration Initiative (Si2), an Austin-based integrated circuit research and development joint venture, has launched a project to help designers reduce power consumption, a growing challenge for most system-on-chip designs.

Samsung PhD Fellowship program recognizes best and brightest student innovators

Thu, 5 May 2016
Each student will receive a Fellowship award of $50,000 as well as mentorship to support their ground-breaking research.

This 'nanocavity' may improve ultrathin solar panels, video cameras and more

Fri, 5 May 2016
The future of movies and manufacturing may be in 3-D, but electronics and photonics are going 2-D; specifically, two-dimensional semiconducting materials.

New technique could make large, flexible solar panels more feasible

Mon, 5 May 2016
A new, high-pressure technique may allow the production of huge sheets of thin-film silicon semiconductors at low temperatures in simple reactors at a fraction of the size and cost of current technology.

Ultratech Cambridge Nanotech forms research collaboration with Northeastern University

Tue, 5 May 2016
Ultratech, Inc. announced the formation of a research collaboration with Professor Thomas J. Webster, Ph.D. at Northeastern University, to study the use of nano-materials produced via ALD for medical applications.

TowerJazz begins mass producing new integrated SiGe-based "front-end module on a chip" RF platform for IoT applications

Tue, 5 May 2016
TowerJazz today announced volume production of a new RF technology capable of integrating a wireless front-end module (FEM) on a single chip, tailored to meet the challenges of Internet of Things (IoT) applications.

Imec expands its silicon platform for quantum computing applications

Wed, 5 May 2016
At the Quantum Europe conference, taking place in Amsterdam, Belgian's nanoelectronincs research center imec announced today that it is ramping-up its R&D activities focused on quantum computing.

New type of graphene-based transistor will increase the clock speed of processors

Wed, 5 May 2016
Scientists have developed a new type of graphene-based transistor and using modeling they have demonstrated that it has ultralow power consumption compared with other similar transistor devices.

STMicroelectronics, Arduino launch cooperation to expand maker-community access to STM32 MCUs and sensors

Thu, 5 May 2016
Moving to enable makers to make even more than before, STMicroelectronics and Arduino today announced an agreement that brings the STM32 family of microcontrollers (MCU), along with ST's full portfolio of sensing, power, and connectivity technology, even closer to the Arduino maker community.

Graphene: A quantum of current

Fri, 5 May 2016
Viennese scientists unravel the quantum properties of the carbon material graphene.

ORNL demonstrates large-scale technique to produce quantum dots

Fri, 5 May 2016
A method to produce significant amounts of semiconducting nanoparticles for light-emitting displays, sensors, solar panels and biomedical applications has gained momentum with a demonstration by researchers at the Department of Energy's Oak Ridge National Laboratory.

Imec and Holst Centre present multi-standard low-power wide-area radio chip

Tue, 5 May 2016
The nanoelectronics research centers imec and Holst Centre (set up by imec and TNO), presented a low-power wide-area (LPWA) multi-standard radio chip today at imec's annual technology forum in Brussels (ITF Brussels 2016).

Diamonds closer to becoming ideal semiconductors

Tue, 5 May 2016
Researchers find new method for doping single crystals of diamond.

Gigantic ultrafast spin currents

Wed, 5 May 2016
Scientists from TU Wien (Vienna) are proposing a new method for creating extremely strong spin currents. They are essential for spintronics, a technology that could replace today's electronics.

Optics breakthrough to revamp night vision

Wed, 5 May 2016
A breakthrough by an Australian collaboration of researchers could make infra-red technology easy-to-use and cheap, potentially saving millions of dollars in defence and other areas using sensing devices, and boosting applications of technology to a host of new areas, such as agriculture.

Light can 'heal' defects in new solar cell materials

Wed, 5 May 2016
Defects in some new electronic materials can be removed by making ions move under illumination.

The next generation of carbon monoxide nanosensors

Thu, 5 May 2016
Scientists have been investigating sensors that can determine CO concentration, and a team from the Okinawa Institute of Science and Technology Graduate University (OIST), in tandem with the University of Toulouse, has found an innovative method to build such sensors.

MACOM launches new GaN power transistors

Thu, 5 May 2016
MACOM Technology Solutions reported the newest entries in its MAGb series of GaN on Silicon power transistors for use in macro wireless basestations.

AGC develops amorphous thin film using unique sputtering target material

Thu, 5 May 2016
GC Asahi Glass (AGC) today announced it has developed a uniform amorphous thin film using a unique sputtering target material, and has started industrialization and commercial production of the material.

Engineers discover a new gatekeeper for light

Fri, 5 May 2016
Finding paves the way for devices that switch quickly between transparency and opacity to specific forms of light.

Micron introduces fast, secure, power-efficient 3D NAND flash solid state drives

Tue, 5 May 2016
Micron Technology, Inc. today introduced Micron 1100 SATA and Micron 2100 PCIe NVMe, two new solid state drive (SSD) product lines designed to tackle client computing workloads from web browsing and email, to video editing and auto CAD design.

Advanced power technology from STMicroelectronics enables unique portable e-car charger from Zaptec

Tue, 5 May 2016
Silicon-carbide (SiC) power electronics from STMicroelectronics has enabled the creation of ZapCharger Portable, the world's smallest, smartest, and safest electric-car charging station from Zaptec, an innovative start-up company that has revolutionized the transformer industry.

NanoFocus AG introduces new inspection system for semiconductors industry

Tue, 5 May 2016
NanoFocus AG, the developer and manufacturer of optical 3D surface measuring technology, introduces the new measuring system µsprint hp-opc 3000 for the optical inspection of probe cards within the framework of the 26th Annual SW Test Workshop in San Diego from 5th - 8th June 2016.

'Weak' materials offer strong possibilities for electronics

Wed, 6 Jun 2016
New fundamental research by UT Dallas physicists may accelerate the drive toward more advanced electronics and more powerful computers.

Using solid-state materials with gold nanoantennas for more durable solar cells

Wed, 6 Jun 2016
Hokkaido University scientists are testing the development of solar cells made of solid materials to improve their ability to function under harsh environmental conditions.

Will conductive inks help wearables go truly wearable?

Thu, 6 Jun 2016
The first generation of wearable devices are constructed using mature, rigid technologies put inside a new box that can be worn. These are often bulky devices that are not truly wearable in the sense that our clothes are. This is, however, beginning to change, albeit slowly.

A switch for light wave electronics

Thu, 6 Jun 2016
Physicists from the Laboratory for Attosecond Physics have already found out that it is possible to manipulate the electronic properties of matter at optical frequencies. In a follow-up experiment the researchers, in a manner similar to their previous approach, shot extremely strong, femtosecond-laser pulses (one femtosecond is a millionth of a billionth of a second) onto silicon dioxide glass.

Tiny lasers enable faster, less power-hungry next-gen microprocessors

Fri, 6 Jun 2016
A group of scientists were able to fabricate tiny lasers directly on silicon, a huge breakthrough for the semiconductor industry and well beyond.

imec, partners develop Wi-Fi HaLow radio solution for IoT applications

Mon, 6 Jun 2016
At this week’s Design Automation Conference (DAC 2016), nanoelectronics research center imec, Holst Centre (initiated by imec and TNO), and Wi-Fi IP provider Methods2Bussiness will present a complete Wi-Fi HaLow radio solution.

Spintronics development gets boost with new findings into ferromagnetism in Mn-doped GaAs

Tue, 6 Jun 2016
A research group at Tohoku University's WPI-AIMR has succeeded in finding the origin and the mechanism of ferromagnetism in Mn-doped GaAs.

Tiny diamonds could enable huge advances in nanotechnology

Wed, 6 Jun 2016
UMD researchers develop a new method for pairing nanoscale diamonds with other nano materials.

Nanotubes' 'stuffing' as is

Wed, 6 Jun 2016
A scientist from the Lomonosov Moscow State University studied the types of carbon nanotubes' 'stuffing'.

Perovskite solar cells surpass 20 percent efficiency

Thu, 6 Jun 2016
EPFL researchers are pushing the limits of perovskite solar cell performance by exploring the best way to grow these crystals.

Novel energy inside a microcircuit chip

Thu, 6 Jun 2016
VTT developed an efficient nanomaterial-based integrated energy.

Scientists design energy-carrying particles called 'topological plexcitons'

Fri, 6 Jun 2016
Scientists at UC San Diego, MIT and Harvard University have engineered "topological plexcitons," energy-carrying particles that could help make possible the design of new kinds of solar cells and miniaturized optical circuitry.

New nanomaterial offers promise in bendable, wearable electronic devices

Mon, 6 Jun 2016
Electroplated polymer makes transparent, highly conductive, ultra thin film.

Efficient hydrogen production made easy

Mon, 6 Jun 2016
Sticking electrons to a semiconductor with hydrazine creates an electrocatalyst.

Novel capping strategy improves stability of perovskite nanocrystals

Tue, 6 Jun 2016
Study addresses instability issues with organometal-halide perovskites, a promising class of materials for solar cells, LEDs, and other applications.

CWRU physicists deploy magnetic vortex to control electron spin

Wed, 6 Jun 2016
Researchers at Case Western Reserve University have developed a way to swiftly and precisely control electron spins at room temperature.

Imec demonstrates junction-less gate-all-around lateral and vertical nanowire FET devices

Thu, 6 Jun 2016
The new GAA-NWFET is a promising candidate for advanced logic & analog/RF applications, and scaled SRAM cells.

Electronic nose using CMOS integrated circuits analyzes breath

Thu, 6 Jun 2016
Researchers at the Texas Analog Center of Excellence(TxACE), a Semiconductor Research Corporation(SRC)-funded research effort centered at the University of Texas at Dallas (UT Dallas), are working to develop an affordable electronic nose that can be used in breath analysis for a wide range of health diagnosis.

Ultratech enables world's lowest contact resistivity for finFETs with LXA melt laser annealing technology

Thu, 6 Jun 2016
This record achievement, as well as additional results, was presented in a paper at the 2016 Symposia on VLSI Technology and Circuits held June 13-17, at the Hilton Hawaiian Village in Honolulu, Hawaii.

Leti extends CMOS platforms' lifespan and explores new computing paradigms

Fri, 6 Jun 2016
Leti, an institute of CEA Tech, said today its teams have demonstrated how Fully Depleted Silicon on Insulator (FDSOI) technology can be scaled downwards and how the experience in thin-film engineering built on FDSOI development can be harnessed for innovative architectures and computing paradigms.

Let there be light

Fri, 6 Jun 2016
Utah engineer discovers light can stamp out defects in semiconductors for better solar panels and LED bulbs.

Circuit technology that resolves issues with high-frequency piezoelectric resonators

Fri, 6 Jun 2016
Realizing compact, low-cost, high-speed radio communication systems for the IoT age.

Accelerate and de-risk materials decisions for semiconductor R&D with IMI Labs from Intermolecular

Tue, 6 Jun 2016
Intermolecular, Inc. today announced IMI Labs for Semiconductor, a materials innovation service to help semiconductor companies explore, discover and characterize new materials.

Solar cells for greener and safer energies

Tue, 6 Jun 2016
ICFO researchers report on low-temperature, solution-processed, environmentally friendly inorganic solar cells made with Earth-abundant materials capable of operating with a power conversion of 6.3 percent.

Samsung introduces new line-up of LED components for automotive lighting, featuring chip-scale packaging

Tue, 6 Jun 2016
Samsung Electronics Co., Ltd. announced today that it has introduced “Fx-CSP,” a line-up of LED packages which features chip-scale packaging and flexible circuit board technology, for use in automotive lighting applications.

Diamond-based resonators might become highly sensitive detectors

Wed, 6 Jun 2016
Physicists from the Technological Institute for Superhard and Novel Carbon Materials, the Moscow Institute of Physics and Technology, and the Siberian Federal University have mathematically modelled diamond-based microstructures for producing compact high sensitivity sensors.

Building U.S. manufacturing ecosystems for emerging advanced packaging technologies

Wed, 6 Jun 2016
Emerging opportunities for advanced packaging solutions for heterogeneous integration include a lot more than logic, memory and sensors.

AI Technology, Inc. introduces temporary bonding adhesive for thin wafer handling

Thu, 6 Jun 2016
For fan-out wafer-level packaging and 3D packaging, thin wafer handling is critical; the wafer must not warp, bend or shift during any wafer-processing steps.

Gigaphoton first to introduce new excimer laser to flat panel display industry

Thu, 6 Jun 2016
Gigaphoton Inc., a major semiconductor lithography light source manufacturer, announced the successful development of a new series of excimer lasers, the GIGANEX series.

Photovoltaic cells replicate rose petals

Fri, 6 Jun 2016
With a surface resembling that of plants, solar cells improve light-harvesting and thus generate more power.