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Stanford engineers envision an electronic switch just 3 atoms thick

Tue, 7 Jul 2014
Computer simulation shows how to make a crystal that would toggle like a light switch between conductive and non-conductive structures; this could lead to flexible electronic materials and enable a cell phone to be woven into a shirt.

Ghent University and imec demonstrate interaction between light and sound in nanoscale waveguide

Tue, 2 Feb 2015
Silicon photonics enables extreme light-matter interaction.

Laser spike annealing resolves sub-20nm logic device manufacturing challenges

Thu, 12 Dec 2014
LSA technology plays an enabling role to overcoming manufacturing challenges for sub-20nm logic devices.

New discovery could pave the way for spin-based computing

Fri, 9 Sep 2014
A University of Pittsburgh research team has discovered a way to fuse these two distinct properties in a single material, paving the way for new ultrahigh density storage and computing architectures.

Collecting light with artificial "moth eyes"

Mon, 6 Jun 2014
Empa researchers have developed such a photoelectrochemical cell, recreating a moth’s eye to drastically increase its light collecting efficiency. The cell is made of cheap raw materials – iron and tungsten oxide.

Flexible glass firms branch into new applications

Sun, 6 Jun 2014
Ultrathin glass is well suited for use as interposers in semiconductor packaging applications.

Noise cancellation: The new failure and yield analysis superpower

Sun, 6 Jun 2014
Root cause deconvolution is a quick and cost effective way to determine the underlying root causes represented in a population of failing devices from test data alone.

A silicon replacement? USC Viterbi School of Engineering overcomes major issue in carbon nanotube tech

Mon, 6 Jun 2014
Researchers from the USC Viterbi School of Engineering describe how they have overcome a major issue in carbon nanotube technology by developing a flexible, energy-efficient hybrid circuit combining carbon nanotube thin film transistors with other thin film transistors.

Singapore researchers use FEI Titan S/TEM to link plasmonics with molecular electronics

Tue, 6 Jun 2014
The National University of Singapore, Singapore University of Technology and Design, and the A*STAR institutes: Institute of High Performance Computing and Institute of Materials Research and Engineering announced their recent discovery of quantum plasmonic tunneling.

ConFab panelists discuss optimizing R&D in the changing semi landscape

Tue, 6 Jun 2014
Overheard @The ConFab: “I feel the best I’ve felt about semi since 2009.” –Mike Noonen, Silicon Catalyst

“What comes next?” — Latest technology breakthroughs featured at SEMICON West

Fri, 6 Jun 2014
The latest manufacturing, materials and production developments for emerging and adjacent markets will be featured at SEMICON West 2014, to be held on July 8-10 at the Moscone Center in San Francisco, Calif.

CEA-Leti and CORIMA collaborate on force sensors integrated in cycle wheels

Fri, 6 Jun 2014
CEA-Leti and CORIMA, a supplier of carbon-composite wheels and frames for track and road-racing cyclists, today announced they are developing an integrated sensor system to measure the power output of riders as they pedal.

EVG clears key barriers to 3DIC/TSV HVM with fusion wafer bonding solution

Mon, 6 Jun 2014
EV Group today unveiled the GEMINI FB XT—its next-generation fusion wafer bonding platform, which combines several performance breakthroughs to move the semiconductor industry closer to the goal of high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs).

Gigaphoton develops world's first helium-free purge process for ArF immersion lasers

Mon, 6 Jun 2014
Gigaphoton Inc., a major lithography light source manufacturer, announced today that it has succeeded in the development of an innovative purge process, one that does not use the rare gas helium, for its flagship "GT Series" of ArF immersion lasers.

Bending the rules

Tue, 7 Jul 2014
A UCSB postdoctoral scholar in physics discovers a counterintuitive phenomenon: the coexistence of superconductivity with dissipation.

Columbia researchers observe tunable quantum behavior in bilayer graphene

Thu, 7 Jul 2014
Columbia researchers have observed the fractional quantum Hall effect in bilayer graphene and shown that this exotic state of matter can be tuned by an electric field.

Making dreams come true : Making graphene from plastic?

Thu, 7 Jul 2014
Recently, a domestic research team developed a carbon material without artificial defects commonly found during the production process of graphene while maintaining its original characteristics.

With "ribbons" of graphene, width matters

Thu, 7 Jul 2014
Using graphene ribbons of unimaginably small widths – just several atoms across – a group of researchers at the University of Wisconsin-Milwaukee (UWM) has found a novel way to "tune" the wonder material, causing the extremely efficient conductor of electricity to act as a semiconductor.

Entegris launches ultra clean filter for semiconductor manufacturing

Tue, 7 Jul 2014
Entegris, Inc. announced the latest addition to its Torrento family of ultra clean liquid filtration solutions used in the semiconductor manufacturing process.

Applied Materials unveils CVD and CMP systems

Tue, 7 Jul 2014
On Monday, Applied Materials announced two new systems, a Reflexion LK Prime CMP system and a Producer XP Precision CVD system, both aimed at complex devices with 3D architectures.

Entegris announces new VaporSorb filter for advanced yield protection

Wed, 7 Jul 2014
Entegris, Inc. today announced a product extension for its VaporSorb line of airborne molecular contamination (AMC) filters.

A cool approach to flexible electronics

Thu, 7 Jul 2014
A nanoparticle ink that can be used for printing electronics without high-temperature annealing presents a possible profitable approach for manufacturing flexible electronics.

2014 iTherm

Thu, 7 Jul 2014
iTherm is the Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. The 2014 iTherm was held concurrently with the ECTC in Orlando, FL. This year’s General Chair was Mehdi Basheghi of Stanford and program chair was Madhusudan of Google. Attendance this year was up 50% to ~ 400.

Bruker introduces Inspire nanoscale chemical mapping system

Tue, 7 Jul 2014
Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial resolution in chemical and materials property mapping.

Graphene grain boundaries reviewed

Tue, 7 Jul 2014
Graphene has attracted overwhelming attention both for exploring fundamental science and for a wide range of technological applications.

A nanosensor to identify vapors based on a Graphene/Silicon heterojunction Schottky diode

Tue, 7 Jul 2014
Among other carbon-based nanomaterials, graphene represents a great promise for gas sensing applications.

Renasas Electronics announces development of new capacitive-touch sensing technology

Wed, 7 Jul 2014
Renesas Electronics America Inc., a supplier of advanced semiconductor solutions, today announced development of innovative new intellectual property (IP) that implements capacitive-touch sensing technology ideal for home appliances and healthcare equipment.

Former NetLogic CEO and Broadcom executive, Ron Jankov, joins eASIC board of directors

Wed, 7 Jul 2014
eASIC Corporation, a provider of Single Mask Adaptable ASIC devices, today announced the appointment of Ron Jankov to the company’s Board of Directors.

Solid State Equipment wins 2014 3D InCites Award for WaferEtch TSV Revealer

Tue, 7 Jul 2014
Solid State Equipment LLC (SSEC), a provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D ICs), MEMS, and compound semiconductor markets, was awarded a 2014 3D InCites Award in the category of 2.5D/3D Manufacturing Equipment.

Allegro MicroSystems announces new silicon carbide Schottky barrier diode FMCA series

Tue, 7 Jul 2014
Allegro MicroSystems, LLC announces the release of the next generation series of silicon carbide Schottky barrier diodes.

Compact vibration harvester power supply with highest efficiency opens door to “Fix-and-Forget” sensor nodes

Wed, 7 Jul 2014
OMRON and Holst Centre/imec have unveiled a prototype of an extremely compact vibrational energy harvesting DC power supply with worlds’ highest efficiency.

Fundamental chemistry findings could help extend Moore’s Law

Wed, 7 Jul 2014
A Berkeley Lab-Intel collaboration outlines the chemistry of photoresist, enabling smaller features for future generations of microprocessors.

Understanding graphene’s electrical properties on an atomic level

Wed, 7 Jul 2014
Graphene, a material that consists of a lattice of carbon atoms, one atom thick, is widely touted as being the most electrically conductive material ever studied. However, not all graphene is the same. With so few atoms comprising the entirety of the material, the arrangement of each one has an impact on its overall function.

A new multi-bit 'spin' for MRAM storage

Wed, 7 Jul 2014
Interest in magnetic random access memory (MRAM) is escalating, thanks to demand for fast, low-cost, nonvolatile, low-consumption, secure memory devices. MRAM, which relies on manipulating the magnetization of materials for data storage rather than electronic charges, boasts all of these advantages as an emerging technology, but so far it hasn't been able to match flash memory in terms of storage density.

SMIC and JCET establish a joint venture

Fri, 8 Aug 2014
Semiconductor Manufacturing International Corporation and Jiangsu Changjiang Electronics Technology Co., Ltd. announced today the formation of a joint venture for 12-inch bumping and related testing, from the previously signed joint venture agreement, which will be established in Jiangyin National High-Tech Industrial Development Zone (JOIND), in Jiangsu Province, China.

A*STAR and industry partners form S$200M semiconductor R&D joint labs

Thu, 7 Jul 2014
Four joint laboratories, representing a commitment of S$200m between private and public sectors, were launched today between A*STAR's Institute of Microelectronics (IME), and its 10 industry partners.

National Science Foundation tests out the assembly line of the future

Tue, 8 Aug 2014
NSF's Center for Hierarchical Manufacturing proves good test bed for large-scale nanomanufacturing designs .

New material allows for ultra-thin solar cells

Mon, 8 Aug 2014
Extremely thin, semi-transparent, flexible solar cells could soon become reality.

Taking great ideas from the lab to the fab

Tue, 8 Aug 2014
NSF and Intel support the development of domain-specific hardware to address health care needs.

SEMATECH and CNSE/SUNY launch new patterning center

Thu, 8 Aug 2014
SEMATECH and the newly merged SUNY College of Nanoscale Science and Engineering (CNSE) / SUNY Institute of Technology (SUNYIT) announced today they have launched their joint Patterning Center of Excellence.

STATS ChipPAC’s fcCuBE technology surpasses 100 million unit milestone

Wed, 8 Aug 2014
STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, announced today that it has shipped over 100 million semiconductor packages with the company’s fcCuBE technology, advanced flip chip packaging with fine pitch copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and enhanced assembly processes.

SRC, UC Davis explore new materials and device structures to develop next-generation “Race Track Memory” technologies

Tue, 8 Aug 2014
University of California, Davis researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, are exploring new materials and device structures to develop next-generation memory technologies.

Notre Dame paper offers insights into a new class of semiconducting materials

Tue, 8 Aug 2014
A new paper by University of Notre Dame researchers describes their investigations of the fundamental optical properties of a new class of semiconducting materials known as organic-inorganic "hybrid" perovskites.

Pairing old technologies with new for next-generation electronic devices

Tue, 8 Aug 2014
UCL scientists have discovered a new method to efficiently generate and control currents based on the magnetic nature of electrons in semiconducting materials, offering a radical way to develop a new generation of electronic devices.

Finding the Achilles' heel of GaN-based LEDs in harsh radiation environments

Mon, 12 Dec 2014
Gallium nitride (GaN) based devices are attractive for harsh environment electronics because of their high chemical and the mechanical stability of GaN itself that has a higher atomic displacement energy than other semiconductor materials.

Micron and Intel unveil new 3D NAND flash memory

Thu, 3 Mar 2015
Micron Technology, Inc. and Intel Corporation today revealed the availability of their 3D NAND technology, the world’s highest-density flash memory.

Eco-friendly "pre-fab nanoparticles" could revolutionize nano manufacturing

Wed, 8 Aug 2014
A team of materials chemists, polymer scientists, device physicists and others at the University of Massachusetts Amherst today report a breakthrough technique for controlling molecular assembly of nanoparticles over multiple length scales that should allow faster, cheaper, more ecologically friendly manufacture of organic photovoltaics and other electronic devices.

New test reveals purity of graphene

Wed, 8 Aug 2014
Graphene may be tough, but those who handle it had better be tender. The environment surrounding the atom-thick carbon material can influence its electronic performance, according to researchers at Rice and Osaka universities who have come up with a simple way to spot contaminants.

Researchers prove stability of wonder material silicene

Fri, 8 Aug 2014
An international team of researchers has taken a significant step towards understanding the fundamental properties of the two-dimensional material silicene by showing that it can remain stable in the presence of oxygen.

Gigaphoton unveils new function that enables 50% reduction of neon gas consumption for ArF immersion lasers

Mon, 8 Aug 2014
Gigaphoton Inc., a lithography light source manufacturer, today unveils a new function, called “eTGM,” available for its flagship high-output GT Series of ArF immersion laser products.

Mentor Graphics announces 25th annual PCB Technology Leadership Awards program

Tue, 8 Aug 2014
Mentor Graphics Corporation today announced the call-for-entries of its 25th annual Technology Leadership Awards (TLA) competition, continuing its tradition of recognizing excellence in printed circuit board (PCB) design.

Intersil announces single-chip display power and LED driver for smartphones

Tue, 8 Aug 2014
Intersil Corporation, a provider of power management and precision analog solutions, today announced the ISL98611 display power and LED driver for smartphones.

Himax Technologies and Lumus announce collaboration to develop next-generation smart glasses

Tue, 8 Aug 2014
Himax Technologies, Inc., a supplier and fabless manufacturer of display drivers and other semiconductor products, and Lumus, a producer of Augmented Reality glasses, announced today another joint initiative to continue developing the next-generation of smart glasses that will set new technological standards in image quality and performance.

MIPT and RAS scientists made an important step towards creating medical nanorobots

Tue, 8 Aug 2014
Researchers from the Institute of General Physics of the Russian Academy of Sciences, the Institute of Bioorganic Chemistry of the Russian Academy of Sciences and MIPT have made an important step towards creating medical nanorobots.

Promising ferroelectric materials suffer from unexpected electric polarizations

Tue, 8 Aug 2014
Electronic devices with unprecedented efficiency and data storage may someday run on ferroelectrics—remarkable materials that use built-in electric polarizations to read and write digital information, outperforming the magnets inside most popular data-driven technology.

Renesas Electronics expands portfolio of Simple Power Supply ICs

Wed, 8 Aug 2014
Renesas Electronics America, a leading supplier of advanced semiconductor solutions, today expands its portfolio of Simple Power Supply ICs, with innovative 16V input capable synchronous buck regulators that deliver up to 3A continuous current to loads at voltages as low as 0.8V.

A breakthrough in imaging gold nanoparticles to atomic resolution by electron microscopy

Fri, 8 Aug 2014
Nanometer-scale gold particles are intensively investigated for application as catalysts, sensors, drug delivery devices, biological contrast agents and components in photonics and molecular electronics.

JEDEC releases LPDDR4 Standard for low power memory devices

Mon, 8 Aug 2014
JEDEC Solid State Technology Association today announced the publication of JESD209-4 Low Power Double Data Rate 4 (LPDDR4).

Renasas introduces new package for safety systems for industrial equipment

Tue, 8 Aug 2014
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today announced that it has obtained IEC 61508 (Functional Safety) certification for the RX631, RX63N Safety Package.

Engineers develop new sensor to detect tiny individual nanoparticles

Tue, 9 Sep 2014
A team of researchers at Washington University in St. Louis, led by Lan Yang, PhD, the Das Family Career Development Associate Professor in Electrical & Systems Engineering, and their collaborators at Tsinghua University in China have developed a new sensor that can detect and count nanoparticles, at sizes as small as 10 nanometers, one at a time.

SemiLEDs launches EF FlipChip LED series

Wed, 8 Aug 2014
SemiLEDs Corporation, a global provider of vertical LED technology solutions, today announced sampling and volume availability of the first in its new Enhanced FlipChip, or EF, LED series.

Competition for graphene

Wed, 8 Aug 2014
A new argument has just been added to the growing case for graphene being bumped off its pedestal as the next big thing in the high-tech world by the two-dimensional semiconductors known as MX2 materials.

The industry's first foundry business for MEMS utilizing thin-film piezoelectric elements

Thu, 8 Aug 2014
ROHM has recently established a process for MEMS utilizing thin-film piezoelectric elements, and implemented the industry's first foundry business that integrates product design and manufacturing processes, from wafer pulling to mounting, in order to meet a variety of customer needs.

Seoul Semiconductor launches smart lighting Acrich LED Light Engine

Thu, 8 Aug 2014
Seoul Semiconductor announced the release of a new LED light engine with Acrich 3 technology.

SEMI-GAS broadens gas mixing capabilities for highly corrosive gases

Thu, 8 Aug 2014
SEMI-GAS Systems, a provider of ultra-high purity gas delivery equipment, recently broadened the capabilities of its custom Xturion Blixer gas blender product line.

A new, tunable device for spintronics

Fri, 8 Aug 2014
An international team of scientists including physicist Jairo Sinova from the University of Mainz realises a tunable spin-charge converter made of GaAs.

Copper shines as flexible conductor

Fri, 8 Aug 2014
Bend them, stretch them, twist them, fold them: modern materials that are light, flexible and highly conductive have extraordinary technological potential, whether as artificial skin or electronic paper.

MEI Wet Processing Systems reveals performance data for new critical etch system

Tue, 9 Sep 2014
MEI Wet Processing Systems and Services revealed performance data today on its newly released Cu & TiW Critical Etch System for compound semiconductor manufacturing.

TowerJazz and Triune Systems announce Neo-Iso Products ramping to mass production

Tue, 9 Sep 2014
TowerJazz, the global specialty foundry, and Triune Systems LLC, a mixed signal and power management IC provider, today announced that Triune has developed a proprietary isolated power and data technology using the TowerJazz TS18PM process on its 0.18um based power management platform.

Breakthrough in light sources for new quantum technology

Tue, 9 Sep 2014
Electronic circuits are based on electrons, but one of the most promising technologies for future quantum circuits are photonic circuits, i.e. circuits based on light (photons) instead of electrons.

Analog Devices releases high-temperature MEMS gyroscope

Wed, 9 Sep 2014
Analog Devices, Inc. today introduced the first and only MEMS gyroscope specified to withstand temperatures of up to 175 degrees Celsius commonly encountered by oil and gas drilling equipment.

Samsung adopts ProPlus Designs' 14nm finFET process

Wed, 9 Sep 2014
ProPlus Design Solutions, Inc. today announced Samsung Electronics has extended its partnership with ProPlus through the deployment of ProPlus' BSIMProPlus modeling platform for its 14-nanometer (nm) FinFET SPICE modeling.

UCSB researchers develop ultra sensitive biosensor from molybdenite semiconductor

Thu, 9 Sep 2014
Move over, graphene. An atomically thin, two-dimensional, ultrasensitive semiconductor material for biosensing developed by researchers at UC Santa Barbara promises to push the boundaries of biosensing technology in many fields, from health care to environmental protection to forensic industries.

Sidense demonstrates working one-time programmable bit cells in TSMC 16nm finFET technology

Fri, 9 Sep 2014
Sidense Corp., a developer of non-volatile memory OTP IP cores, today announced that it successfully demonstrated read and write capability for its 1T-OTP bit-cell architecture on test silicon fabricated in a 16nm CMOS FinFET process.

Cree SiC MOSFETs help power Japan’s growing solar energy infrastructure

Mon, 9 Sep 2014
Cree, Inc. has announced that its C2M, 1200V, 80mOhm SiC MOSFETs have been selected by Sanix Corporation, Japan, to be designed into their new 9.9kW three-phase solar inverters for use in the construction of commercial photovoltaic systems in the fast-growing Japanese solar energy market.

Layered graphene sandwich for next generation electronics

Mon, 9 Sep 2014
Sandwiching layers of graphene with white graphene could produce designer materials capable of creating high-frequency electronic devices, University of Manchester scientists have found.

Doped graphene nanoribbons with potential

Mon, 9 Sep 2014
Researchers from Empa and the Max Planck Institute for Polymer Research have now developed a new method to selectively dope graphene molecules with nitrogen atoms.

NSF and SRC announce research awards to 10 universities

Tue, 9 Sep 2014
The National Science Foundation (NSF) and Semiconductor Research Corporation (SRC) today announced nine research awards to 10 universities totaling nearly $4 million under a joint program focused on Secure, Trustworthy, Assured and Resilient Semiconductors and Systems (STARSS).

GLOBALFOUNDRIES and SRC announce new scholarship for undergraduate engineering students

Tue, 9 Sep 2014
GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced the “GLOBALFOUNDRIES Undergraduate Research Scholarship,” a new scholarship recognizing and rewarding aspiring, leadership-oriented engineering students interested in careers in the semiconductor industry.

Fermilab implements Ziptronix's DBI hybrid bonding in high-end 3D image sensors

Tue, 9 Sep 2014
Ziptronix Inc. today announced that its Direct Bond Interconnect (DBI) hybrid bonding has been implemented by Fermi National Accelerator Laboratory (Fermilab) to improve the performance of high-end 3D sensor arrays, which are used for particle detection in large-scale particle physics and x-ray imaging experiments.

Intematix and SABIC collaborate to deliver increased efficiency solutions for LED systems

Tue, 9 Sep 2014
Intematix Corporation, a manufacturer of phosphor solutions for LED lighting, has collaborated with SABIC's Innovative Plastics business to create the ChromaLit Linear - a LED offering developed for the lighting industry.

Global shutter image sensors

Tue, 9 Sep 2014
Different GS pixel architectures and technologies are presented and performances compared.

Leti and LUCIOM focusing on high-data-rate bidirectional transceivers for enriched LiFi applications

Wed, 9 Sep 2014
CEA-Leti and LUCIOM, which develops visible-light communication using light-emitting diodes (LEDs), have launched a project to develop high-data-rate LiFi transceivers.

Beautiful, brilliant people

Wed, 9 Sep 2014
It would be difficult to overstate how critical the development of a workable, high volume manufacturing EUV lithography solution is to the semiconductor industry.

eBeam Initiative Survey indicates new eBeam expectations for photomask production

Tue, 9 Sep 2014
Continued semiconductor scaling drives new mask design requirements; use of complex mask shapes predicted to increase

Element Six selected by European Consortium as a partner to develop ultrafast pulse disk lasers

Tue, 9 Sep 2014
Element Six today announced it has been selected by the European Commission’s Seventh Framework Programme for Research and Technological Development to help develop a new ultrafast pulse disk laser.

Veeco Ion Beam Deposition technology reaches significant milestone to support EUV commercialization roadmap

Wed, 9 Sep 2014
Veeco Instruments Inc. announced today that its new Odyssey Ion Beam Deposition (IBD) Upgrade for the NEXUS IBD-LDD System has repeatedly produced photomask blanks with zero deposition defects larger than 70nm.

Oxford Instruments launches 3rd annual Indian nanotechnology seminars in Kolkata and Delhi

Thu, 9 Sep 2014
Oxford Instruments is hosting its third series of annual seminars for the nanotechnology industry in India in November.

New research proves whiteness and color rendering has strong effect on LED lamp preference

Thu, 9 Sep 2014
Soraa, a developer of GaN on GaN LED technology, announced today new psychophysical research proving that whiteness and color rendering have a strong effect on the perception of energy-efficient LED lighting.

Samsung now mass producing industry’s first 20nm 6Gb LPDDR3 mobile DRAM

Thu, 9 Sep 2014
The new mobile memory chip will enable longer battery run-time and faster application loading on large screen mobile devices with higher resolution.

Making quantum dots glow brighter

Thu, 9 Sep 2014
Ultrathin layers of metal oxides can change the way quantum dots behave, in some cases turning them into more efficient light emitters.

Toward optical chips

Fri, 9 Sep 2014
A promising light source for optoelectronic chips can be tuned to different frequencies.

Northeastern University researchers develop novel method for working with nanotubes

Fri, 9 Sep 2014
Northeastern University researchers have developed a novel method for controllably constructing precise inter-nanotube junctions and a variety of nanocarbon structures in carbon nanotube arrays.

NVIDIA unveils Maxwell GPU architecture

Fri, 9 Sep 2014
In a major leap forward for gaming, NVIDIA today introduced the first high-end products based on its Maxwell chip architecture -- the new GeForce GTX 980 and 970 GPUs -- delivering unmatched performance, major new graphics capabilities and twice the energy efficiency of the previous generation.

Vesper launches with very high SNR MEMS microphone

Mon, 9 Sep 2014
Intending to improve the smallest audio component found in smartphones, wearables and Internet of Things (IoT) devices, a new Boston-based sensor company called Vesper has designed a microphone that will enhance consumers' acoustic experience with voice capture and sound recording.

Physicists heat freestanding graphene to control curvature of ripples

Mon, 9 Sep 2014
An international team of physicists, led by a research group at the University of Arkansas, has discovered that heating can be used to control the curvature of ripples in freestanding graphene.

Future flexible electronics based on carbon nanotubes

Wed, 9 Sep 2014
Study in Applied Physics Letters show how to improve nanotube transistor and circuit performance with fluoropolymers

Flexible LEDs

Wed, 9 Sep 2014
Flexible light-emitting diode (LED) displays and solar cells crafted with inorganic compound semiconductor micro-rods are moving one step closer to reality, thanks to graphene and the work of a team of researchers in Korea.

Southampton scientists grow a new challenger to graphene

Wed, 9 Sep 2014
A team of researchers from the University of Southampton's Optoelectronics Research Centre (ORC) has developed a new way to fabricate a potential challenger to graphene.

Honeywell advanced materials help mobile devices dissipate heat

Thu, 9 Sep 2014
Honeywell Electronic Materials announced today that its advanced materials are being integrated into the production of tablets and smartphones, helping them stay cool and perform better.

Photomask Technology speaker says EUV is nearly production-ready

Fri, 10 Oct 2014
Highlights at the recent SPIE Photomask Technology 2014 conference included a confident announcement from ASML about current EUV source capabilities, an insightful industry-expert panel discussion on mask-making complexities, and fresh energy from the co-located SPIE Scanning Microscopies conference.

New technology may lead to prolonged power in mobile devices

Tue, 9 Sep 2014
Researchers from The University of Texas at Dallas have created technology that could be the first step toward wearable computers with self-contained power sources or, more immediately, a smartphone that doesn’t die after a few hours of heavy use.

All directions are not created equal for nanoscale heat sources

Wed, 10 Oct 2014
Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths.

Quantum Materials scaling up photoactive quantum dot production for solar power generation

Wed, 10 Oct 2014
Quantum Materials Corp today announced that it is scaling volume production of photoactive quantum dots for use in next-generation photovoltaic solar power technologies.

FlipChip International creates 250 multi-product wafer bump designs

Wed, 10 Oct 2014
FlipChip International (FCI), the global technology leader in flip chip bumping and advanced wafer level packaging, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013.

Crumpled graphene could provide an unconventional energy storage

Fri, 10 Oct 2014
Two-dimensional carbon 'paper' can form stretchable supercapacitors to power flexible electronic devices.

Platinum meets its match in quantum dots from coal

Fri, 10 Oct 2014
Graphene quantum dots created at Rice University grab onto graphene platelets like barnacles attach themselves to the hull of a boat. But these dots enhance the properties of the mothership, making them better than platinum catalysts for certain reactions within fuel cells.

EV Group unveils room-temperature covalent bonder

Mon, 10 Oct 2014
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 580 ComBond.

Albert Theuwissen of Harvest Imaging honored with European SEMI Award 2014

Wed, 10 Oct 2014
Albert Theuwissen, CEO of Harvest Imaging and professor at Delft University of Technology, is the recipient of the European SEMI Award 2014.

Next-generation nanoimprint lithography technology

Tue, 10 Oct 2014
EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process.

Seoul Semiconductor announces the mass production of the Acrich MJT 3030

Thu, 10 Oct 2014
Seoul Semiconductor, a global LED manufacturer, announced the availability of Acrich MJT 3030 a new LED in the Acrich MJT product family which improves on performance and enables lower system costs.

A novel platform for future spintronic technologies

Mon, 10 Oct 2014
Scientists at EPFL, working with Université Paris-Sud and Paul Scherrer Institut, have discovered that a common insulating material behaves as a perfect spintronic conductor because it is not affected by background electron charge.

Revving up fluorescence for superfast LEDs

Mon, 10 Oct 2014
Duke University researchers have made fluorescent molecules emit photons of light 1,000 times faster than normal -- setting a speed record and making an important step toward realizing superfast light emitting diodes (LEDs) and quantum cryptography.

Smallest world record has 'endless possibilities' for bio-nanotechnology

Mon, 10 Oct 2014
Scientists from the University of Leeds have taken a crucial step forward in bio-nanotechnology, a field that uses biology to develop new tools for science, technology and medicine.

Printing in the hobby room: Paper-thin and touch-sensitive displays on various materials

Mon, 10 Oct 2014
What if you could integrate paper-thin displays into the cards, which could be printed at home and which would be able to depict self-created symbols or even react to touch? Those only some of the options computer scientists in Saarbrücken can offer.

The mystery of reed relays: Understanding specifications

Wed, 10 Oct 2014
Specifications of reed relays, which are used for current switching in ATE and other applications are explained, including carry current, lifetime, minimum switch capacity, hot switching, operating speed and thermoelectric switching.

Element Six introduces new thermal grade of CVD diamond

Wed, 10 Oct 2014
Element Six this week announced the development of a new thermal grade of diamond grown by chemical vapor deposition (CVD), DIAFILM TM130.

Beyond LEDs: Brighter, new energy-saving flat panel lights based on carbon nanotubes

Thu, 10 Oct 2014
Planar light source using a phosphor screen with highly crystalline single-walled carbon nanotubes (SWCNTs) as field emitters demonstrates its potential for energy-efficient lighting device.

Magnetic mirrors enable new technologies by reflecting light in uncanny ways

Fri, 10 Oct 2014
As in Alice’s journey through the looking-glass to Wonderland, mirrors in the real world can sometimes behave in surprising and unexpected ways, including a new class of mirror that works like no other.

Semiconductor “dust” enables low cost solar cells, LEDs

Fri, 10 Oct 2014
The U.S. Patent Office has issued US Patent No. 8,859,310 to Versatilis LLC that shows how fine semiconductor particles, powders or fines, often the waste byproduct of dicing semiconductor wafers into ever smaller chips, can be processed into a sea of low cost solar cells or micro-LEDs.

MEMS Industry Group goes to the 'Shark Tank' for MEMS and sensor-based products

Mon, 10 Oct 2014
MIG announces finalists for Elevator Pitch Session at MEMS Executive Congress US 2014.

Entegris' VaporSorb filter line protects advanced yield production

Tue, 10 Oct 2014
Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters.

Special UO microscope captures defects in nanotubes

Tue, 10 Oct 2014
University of Oregon chemists have devised a way to see the internal structures of electronic waves trapped in carbon nanotubes by external electrostatic charges.

Samsung starts mass production of 8Gb DDR4 based on 20nm process technology

Wed, 10 Oct 2014
Samsung today announced that it is mass producing the industry’s most advanced 8-gigabit (Gb) DDR4 memory and 32-gigabyte (GB) module, both of which will be manufactured based on a new 20-nanometer (nm) process technology, for use in enterprise servers.

Imec presents back-side illuminated CMOS image sensor with UV-optimized antireflective coating

Tue, 11 Nov 2014
At this week’s VISION 2014 exhibition, imec presents a backside-illuminated (BSI) CMOS image sensor chip featuring a new anti-reflective coating (ARC) optimized for UV light.

Cree's new SC5 Technology Platform doubles light output to radically lower system cost

Thu, 10 Oct 2014
This new class of LEDs can reduce system costs by up to 40 percent in most lighting applications.

SMIC and Maxscend collaborate on 55nm RF IP platform

Thu, 10 Oct 2014
Semiconductor Manufacturing International Corporation and Maxscend Technologies Inc., a RF IP company based in China, announced that Maxscend Bluetooth RF IP has been silicon proven on SMIC's 55nm low leakage logic process.

New 3D display technology promises greater energy efficiency

Thu, 10 Oct 2014
LCD technology developed in Hong Kong maintains the 3D images it displays without drawing power.

TSMC, Kilopass deliver non-volatile memory for the 16nm finFET process node

Tue, 10 Oct 2014
Kilopass Technology Inc., a provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), announced today that it has successfully ported its one-time programmable (OTP) NVM technology to TSMC's 16 nanometer (nm) FinFET process.

Synopsys announces availability of DesignWare, non-volatile memory IP for TowerJazz 180nm process technology

Thu, 10 Oct 2014
Synopsys, Inc. today announced the availability of the silicon-proven DesignWare AEON Few Time Programmable (FTP) Trim Non-Volatile Memory (NVM) IP for TowerJazz 180-nanometer (nm) SL process technology.

Rice chemists gain edge in next-generation energy

Tue, 11 Nov 2014
Rice University scientists who want to gain an edge in energy production and storage report they have found it in molybdenum disulfide.

Better bomb-sniffing technology

Tue, 11 Nov 2014
University of Utah engineers have developed a new type of carbon nanotube material for handheld sensors that will be quicker and better at sniffing out explosives, deadly gases and illegal drugs.

'Nanomotor lithography' answers call for affordable, simpler device manufacturing

Tue, 11 Nov 2014
Nanoengineers at the University of California, San Diego recently invented a new method of lithography in which nanoscale robots swim over the surface of light-sensitive material to create complex surface patterns that form the sensors and electronics components on nanoscale devices.

Crocus MLU sensors aim to put more 'flex' into flexible displays

Wed, 11 Nov 2014
Crocus Technology, a provider of magnetically enhanced semiconductor technologies and products, today announces a new Magnetic Logic Unit (MLU) based solution that can detect the position and shape of flexible two dimensional surfaces.

Clearing a path for electrons in polymers: Closing in on the speed limits

Wed, 11 Nov 2014
Researchers from the University of Cambridge have identified a class of low-cost, easily-processed semiconducting polymers which, despite their seemingly disorganised internal structure, can transport electrons as efficiently as expensive crystalline inorganic semiconductors.

ORNL thermomagnetic processing method provides path to new materials

Thu, 11 Nov 2014
For much the same reason LCD televisions offer eye-popping performance, a thermomagnetic processing method developed at the Department of Energy’s Oak Ridge National Laboratory can advance the performance of polymers.

Soraa solves compatibility issues by launching new constant current LED lamp

Mon, 11 Nov 2014
Soraa announced today that it has introduced a perfectly compatible version of its award-winning MR16 LED lamp.

Sand 9 granted core patent for piezoelectric MEMS microphones

Mon, 11 Nov 2014
Sand 9, Inc., a developer of piezoelectric MEMS timing products for wireless and wired applications, today announced that the United States Patent and Trademark Office has granted the company a core patent based on the use of piezoelectric MEMS for a wafer-level, chip-scale packaged microphone.

On-demand conductivity for graphene nanoribbons

Mon, 11 Nov 2014
New research may help to develop graphene-based electronic devices that only become conductors when an external ultra-short pulse is applied, and are otherwise insulators.

Freescale and Intel processors now active at Rochester Electronics

Tue, 11 Nov 2014
Rochester Electronics, a fully-authorized manufacturer and distributor of semiconductors, will launch 2015 with the re-introduction of many popular processors from Freescale and Intel.

Bending -- but not breaking -- in search of new materials

Wed, 11 Nov 2014
Researchers at Drexel University and Dalian University of Technology in China have chemically engineered a new, electrically conductive nanomaterial that is flexible enough to fold, but strong enough to support many times its own weight.

Samsung heats up indoor lighting market with 6W and 8W chip-on-board LED packages

Thu, 11 Nov 2014
Samsung Electronics Co. today introduced new chip-on-board (COB) LED package products, the LC006B and LC008B, with six and eight watts of power respectively.

Display industry recognizes Plastic Logic's flexible AMOLED technology with Innovation Excellence Award

Thu, 11 Nov 2014
Plastic Logic, experts in the development and industrialisation of flexible organic electronics, won the OLED Innovation Excellence award for its truly flexible AMOLED display technology.

New way to move atomically thin semiconductors for use in flexible devices

Thu, 11 Nov 2014
Researchers from North Carolina State University have developed a new way to transfer thin semiconductor films, which are only one atom thick, onto arbitrary substrates, paving the way for flexible computing or photonic devices.

New process isolates promising material

Tue, 11 Nov 2014
Molybdenum disulfide has emerged as a leading successor to graphene.

DuPont Microcircuit Materials introduces pure copper conductive ink

Fri, 11 Nov 2014
DuPont Microcircuit Materials introduced its first pure copper conductive ink for photonic curing, DuPont PE510 copper conductor.

Revolutionary solar-friendly form of silicon shines

Tue, 11 Nov 2014
Silicon is the second most-abundant element in the earth's crust. When purified, it takes on a diamond structure, which is essential to modern electronic devices--carbon is to biology as silicon is to technology. A team of Carnegie scientists led by Timothy Strobel has synthesized an entirely new form of silicon, one that promises even greater future applications.

Canatu launches CNB in-mold film for transparent touch on 3D Surfaces

Wed, 11 Nov 2014
Canatu today launched CNB In-Mold Film, a stretchable, formable, conductive film optimized for 3D formed capacitive touch displays and touch surfaces in automobile center consoles and dashboards, home appliance control panels, remote controls, smartwatches and portable electronic devices.

Dynaloy unveils safer cleaners

Wed, 11 Nov 2014
In response to evolving industry trends and customer preferences for products with better environmental, health, and safety (EHS) profiles, Dynaloy LLC is launching three new formulated products that offer exceptional performance without the use of certain chemicals, while continuing to offer its line of traditional cleaners.

Holst Centre, imec and CARTAMUNDI join forces to create the near field communication chip of the future

Wed, 11 Nov 2014
Holst Centre, set up by the Belgian nanoelectronics research center imec and the Dutch research institute TNO, and Cartamundi NV have announced a collaboration to develop ultra-thin flexible near field communication (NFC) tags.

NC State researchers create 'nanofiber gusher'

Thu, 3 Mar 2015
Engineers and researchers at North Carolina State University and one of its start-up companies have now reported a method that can produce unprecedented amounts of polymer nanofibers, which have potential applications in filtration, batteries and cell scaffolding.

Georgia Tech research offers novel cellular sensing platform for expanded use of semiconductor in biotech applications

Thu, 4 Apr 2015
Researchers from the Georgia Institute of Technology have developed a novel cellular sensing platform that promises to expand the use of semiconductor technology in the development of next-generation bioscience and biotech applications.

SCHOTT advances MEMS technology by using HermeS glass wafers with through glass vias

Wed, 11 Nov 2014
The international technology group SCHOTT is expanding its HermeS wafers with hermetically sealed, solid through glass vias (TGV) into MEMS applications.

A path to brighter images and more efficient LCD displays

Thu, 11 Nov 2014
University of Utah engineers have developed a polarizing filter that allows in more light, leading the way for mobile device displays that last much longer on a single battery charge and cameras that can shoot in dim light.

GIGAPHOTON provides new function for 50% reduction of neon gas consumption for ArF immersion laser users

Tue, 11 Nov 2014
Gigaphoton Inc., a lithography light source manufacturer, today announces the provision of a new function, called “eTGM (eco-Total Gas Management),” for the existing users of its flagship high-output GT Series of ArF immersion laser products free of charge for a fixed period of time.

UO-industry collaboration points to improved nanomaterials

Fri, 11 Nov 2014
A potential path to identify imperfections and improve the quality of nanomaterials for use in next-generation solar cells has emerged from a collaboration of University of Oregon and industry researchers.

Physicists and chemists work to improve digital memory technology

Mon, 11 Nov 2014
The improvements in random access memory that have driven many advances of the digital age owe much to the innovative application of physics and chemistry at the atomic scale.

Hybrid Memory Cube Consortium releases new specification

Mon, 11 Nov 2014
The Hybrid Memory Cube Consortium (HMCC), dedicated to the development and establishment of an industry-standard interface specification for Hybrid Memory Cube (HMC) technology, today announced the finalization and public availability of its HMCC 2.0 specification (HMCC 2.0).

Research yields material made of single-atom layers that snap together like Legos

Tue, 11 Nov 2014
Physicists at the University of Kansas have fabricated an innovative substance from two different atomic sheets that interlock much like Lego toy bricks.

Protons fuel graphene prospects

Wed, 11 Nov 2014
Published in the journal Nature, the discovery could revolutionise fuel cells and other hydrogen-based technologies as they require a barrier that only allow protons - hydrogen atoms stripped off their electrons - to pass through.

Van der Waals force re-measured

Wed, 11 Nov 2014
Although the van der Waals force was discovered around 150 years ago, it is still difficult to quantify when predicting the behaviour of solids, liquids, and molecules.

Cymer announces its new XLR 700ix DUV light source

Mon, 12 Dec 2014
Cymer, LLC, an ASML company, a supplier of light sources used by chipmakers to pattern advanced semiconductor chips, today announced its new argon fluoride (ArF) immersion light source, the XLR 700ix.

Imec partners with Huawei on high-bandwidth optical data link technology

Wed, 12 Dec 2014
Nanoelectronics research center imec and global ICT leader Huawei announced today that they have taken a further step in their strategic partnership focusing on optical data link technology.

AXSEM and SIGFOX announce ‘ultra-low-power’ System-on-Chip solution

Wed, 12 Dec 2014
AXSEM, a developer of lowest-power radio microcontrollers, and SIGFOX, a developer of cost-effective, energy-efficient Internet of Things connectivity, today announced that AXSEM’s system-on-chip (SoC) with an AX8052 microcontroller has been certified SIGFOX Ready for two-way connectivity.

Wireless nanorod-nanotube film enables light stimulation of blind retina

Wed, 12 Dec 2014
Breakthrough could lead to artificial retinas for visually impaired. Combining semiconductor nanorods and carbon nanotubes, it could potentially form part of a future prosthetic device that replaces damaged retinal cells.

Imec and Holst Centre announce IC and open hardware development kit for personal health monitoring

Thu, 12 Dec 2014
At next week’s mHealth Summit 2014, held Dec. 7-11 in Washington, D.C., nanoelectronics research center imec and Holst Centre will showcase at their booth a development kit based on an open hardware platform using a highly integrated multi-sensor data acquisition chip.

High photosensitivity 2-D-few-layered molybdenum diselenide phototransistors

Mon, 12 Dec 2014
Two-dimensional (2D) layered materials are now attracting a lot of interest due to their unique optoelectronic properties at atomic thicknesses.

Crossbar to demonstrate resistive RRAM innovation at IEDM 2014

Tue, 12 Dec 2014
Crossbar, Inc., a start-up company pioneering a new category of very high capacity and high-performance non-volatile memory, today announced it will be disclosing another major technology breakthrough in their development of Resistive RAM (RRAM) at next week’s IEEE International Electron Devices Meeting (IEDM).

OCEASOFT harnesses SIGFOX IoT network in Cobalt S3 sensor family for cloud connectivity

Tue, 12 Dec 2014
Industrial Internet of Things sensor-monitoring solution opens new vistas in pollution and environmental applications, other remote-sensing sectors.

Entegris launches next generation of 450mm wafer carriers

Wed, 12 Dec 2014
Entegris, Inc., a developer of yield-enhancing materials and solutions for highly advanced manufacturing environments, announced the release and global availability of their next generation of 450mm wafer carrier solutions (P2) for the safe and reliable transport of 450mm wafers used in semiconductor manufacturing.

Holst Centre and imec develop thin-film hybrid oxide-organic microprocessor

Thu, 12 Dec 2014
Holst Centre, imec and their partner Evonik have realized a general-purpose 8-bit microprocessor, manufactured using complementary thin-film transistors (TFTs) processed at temperatures compatible with plastic foil substrates (250°C).

Leti will discuss CoolCube technology for 3D transistor stacking at workshop preceding IEDM 2014

Thu, 12 Dec 2014
CEA-Leti will present its latest results on CoolCube, the technique for stacking transistors sequentially in the same process flow for 3D-VLSI, at a Dec. 14 workshop in San Francisco, Calif.

System Plus analyzes the world's smallest microbolometer-based thermal imaging camera core released by FLIR

Thu, 12 Dec 2014
Initially focused on the military, uncooled thermal camera sales have grown significantly due to substantial cost reduction of micro bolometers and growing adoption in commercial markets, including thermography, automotive and surveillance applications.

LED manufacturing with NMP-free resist stripping

Fri, 12 Dec 2014
The use of a semi-aqueous organic film stripper and residue remover that does not contain N-Methyl-2 pyrrolidone (NMP) is compared with current NMP-based chemistry.

Scientists measure speedy electrons in silicon

Fri, 12 Dec 2014
An international team of physicists and chemists based at the University of California, Berkeley, has for the first time taken snapshots of this ephemeral event using attosecond pulses of soft x-ray light lasting only a few billionths of a billionth of a second.

Lead islands in a sea of graphene magnetize the material of the future

Tue, 12 Dec 2014
Researchers in Spain have discovered that if lead atoms are intercalated on a graphene sheet, a powerful magnetic field is generated by the interaction of the electrons' spin with their orbital movement.

Imec demonstrates broadband graphene optical modulator on silicon

Wed, 12 Dec 2014
At this week’s IEEE International Electron Devices Meeting (IEDM 2014), nanoelectronics research center imec and its associated lab at Ghent University have demonstrated the industry’s first integrated graphene optical electro-absorption modulator (EAM) capable of 10Gb/s modulation speed.

Imec presents ultralow power RFID transponder chip in thin-film transistor technology on plastic at IEDM 2014

Wed, 12 Dec 2014
At this week’s IEDM 2014, held in San Francisco, California, nanoelectronics research center imec demonstrated an ultra-low power RFID transponder chip.

From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

Thu, 12 Dec 2014
Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling.

Zinc oxide materials tapped for tiny energy harvesting devices

Tue, 1 Jan 2015
New research helps pave the way toward highly energy-efficient zinc oxide-based micro energy harvesting devices with applications in portable communications, healthcare and environmental monitoring, and more.

Piezoelectricity in a 2-D semiconductor

Mon, 12 Dec 2014
Berkeley Lab researchers discovery of piezoelectricty in molybdenum disulfide holds promise for future MEMS.

Hands on: Crafting ultrathin color coatings

Mon, 12 Dec 2014
In Harvard's high-tech cleanroom, applied physicists produce vivid optical effects on paper.

MEMSensing launches the world's smallest commercial 3-axis accelerometer with SMIC

Mon, 1 Jan 2015
MEMSensing Microsystems Co. and Semiconductor Manufacturing International Corporation jointly announced the launch of the world's smallest 3-axis accelerometer MSA330, which utilizes SMIC's CMOS integrated MEMS device fabrication and TSV-based wafer level packaging technologies.

HLMC develops specialty technology in pursuit of growing IoT market

Mon, 1 Jan 2015
Chinese IC manufacturer Shanghai Huali Microelectronics Corporation gave a presentation on its outlook for the Internet of Things (IoT) market and the wide application of its specialty technology at the 2014 China Semiconductor Industry Association IC Design Branch Annual Conference ("ICCAD"), which was recently held at Hong Kong Science Park.

ON Semiconductor demonstrates high efficiency 3D sensor stacking technology

Tue, 1 Jan 2015
ON Semiconductor has successfully characterized and demonstrated its first fully-functional stacked CMOS imaging sensor featuring a smaller die footprint, higher pixel performance and better power consumption compared to traditional monolithic non-stacked designs.

Shedding light on why blue LEDS are so tricky to make

Thu, 1 Jan 2015
Scientists at UCL, in collaboration with groups at the University of Bath and the Daresbury Laboratory, have uncovered the mystery of why blue light-emitting diodes (LEDs) are so difficult to make, by revealing the complex properties of their main component - gallium nitride - using sophisticated computer simulations.

Silicon Space Technology partners with GLOBALFOUNDRIES to deliver processors and memory solutions

Fri, 1 Jan 2015
Silicon Space Technology, an industry innovator in high-temp and rad-hard embedded system solutions, announced today the company has partnered with GLOBALFOUNDRIES to build commercial-ready products for extreme environments and applications.

Graphene plasmons go ballistic

Mon, 1 Jan 2015
Graphene combined with the insulting power of boron nitride enables light control in tiny circuits with dramatically reduced energy loss.

MagnaChip offers automotive semiconductor manufacturing process technology

Tue, 1 Jan 2015
MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products announced today that it has started to offer 0.18um automotive qualified process technology to foundry customers focused on high reliability automotive semiconductor applications.

SAMCO announces MOCVD demonstration availability for the GaN-550 MOCVD system

Thu, 1 Jan 2015
SAMCO has announced MOCVD demonstration capability on a new gallium nitride (GaN-on-Si) system, the GaN-550, from Valence Process Equipment Inc.

UC Berkeley Extension launches three online programs in semiconductor technology

Thu, 1 Jan 2015
UC Berkeley Extension announces three online integrated circuit (IC) semiconductor technology programs to meet the training needs of the surging worldwide semiconductor industry; the industry is predicted to reach $345 billion in sales this year.

Samsung Electronics starts mass producing industry’s first 8-gigabit graphics DRAM

Thu, 1 Jan 2015
Samsung Electronics Co., Ltd. announced today that it has begun mass producing the industry’s first 8 gigabit (Gb) GDDR5 DRAM, based on the company’s leading-edge 20-nanometer (nm) process technology.

AKHAN Semiconductor first to invent fully transparent circuit creation process

Thu, 1 Jan 2015
Adam Khan, founder and CEO of AKHAN Semiconductor, Inc. was granted a US patent by the US Patent and Trademark Office today for a groundbreaking process that adheres diamond, the only truly transparent semiconductor, to metals and alloys (including transparent metals) in a way that allows for reliable wire bonding and high conductivity.

Solving an organic semiconductor mystery

Fri, 1 Jan 2015
Berkeley Lab researchers uncover hidden structures in domain interfaces that hamper performance.

Temporary tattoo offers needle-free way to monitor glucose levels

Fri, 1 Jan 2015
Nanoengineers at the University of California, San Diego have tested a temporary tattoo that both extracts and measures the level of glucose in the fluid in between skin cells. This first-ever example of the flexible, easy-to-wear device could be a promising step forward in noninvasive glucose testing for patients with diabetes.

Rice-sized laser, powered one electron at a time, bodes well for quantum computing

Fri, 1 Jan 2015
Princeton University researchers have built a rice grain-sized laser powered by single electrons tunneling through artificial atoms known as quantum dots.

Carbon nanotube finding could lead to flexible electronics with longer battery life

Fri, 1 Jan 2015
University of Wisconsin-Madison materials engineers have made a significant leap toward creating higher-performance electronics with improved battery life -- and the ability to flex and stretch.

Researchers at Penn, UC Berkeley and Illinois use oxides to flip graphene conductivity

Tue, 1 Jan 2015
Graphene, a one-atom thick lattice of carbon atoms, is often touted as a revolutionary material that will take the place of silicon at the heart of electronics. The unmatched speed at which it can move electrons, plus its essentially two-dimensional form factor, make it an attractive alternative, but several hurdles to its adoption remain.

Silver nanowires demonstrate unexpected self-healing mechanism

Fri, 1 Jan 2015
With its high electrical conductivity and optical transparency, indium tin oxide is one of the most widely used materials for touchscreens, plasma displays, and flexible electronics. But its rapidly escalating price has forced the electronics industry to search for other alternatives.

Graphene enables all-electrical control of energy flow from light emitters

Fri, 1 Jan 2015
Scientists from ICFO, MIT, CNRS, CNISM and Graphenea have now demonstrated active, in-situ electrical control of the energy flow from erbium ions into photons and plasmons.

Scientists 'bend' elastic waves with new metamaterials that could have commercial applications

Fri, 1 Jan 2015
Engineering researchers at the University of Missouri have developed a material that has the ability to control these waves, creating possible medical, military and commercial applications with the potential to greatly benefit society.

Self-assembled nanotextures create antireflective surface on silicon solar cells

Fri, 1 Jan 2015
Scientists at the U.S. Department of Energy's Brookhaven National Laboratory show that etching a nanoscale texture onto the silicon material itself creates an antireflective surface that works as well as state-of-the-art thin-film multilayer coatings.

New Soitec eSI90 RF-SOI wafer improves RF performance of high-end smart phone components

Mon, 1 Jan 2015
Soitec (Euronext) has introduced its eSI90 substrate, the newest high-end wafer in its radio-frequency silicon-on-insulator (RF-SOI) product family.

New pathway to valleytronics

Tue, 1 Jan 2015
A potential avenue to quantum computing currently generating quite the buzz in the high-tech industry is "valleytronics," in which information is coded based on the wavelike motion of electrons moving through certain two-dimensional (2D) semiconductors.

Fabrication of patterns with linewidths down to 1.5nm

Tue, 2 Feb 2015
Researchers at aBeam Technologies, Lawrence Berkeley National Laboratory and Argonne National Laboratory have developed a technology to fabricate test patterns with a minimum linewidth down to 1.5nm.

Crystal light: New light-converting materials point to cheaper, more efficient solar power

Fri, 1 Jan 2015
University of Toronto engineers study first single crystal perovskites for new applications Engineers have shone new light on an emerging family of solar-absorbing materials that could clear the way for cheaper and more efficient solar panels and LEDs.

Demystifying nanocrystal solar cells

Fri, 1 Jan 2015
Scientists are focusing on nanometer-sized crystals for the next generation of solar cells. These nanocrystals have excellent optical properties. Compared with silicon in today's solar cells, nanocrystals can be designed to absorb a larger fraction of the solar light spectrum. However, the development of nanocrystal-based solar cells is challenging.

New method allows for greater variation in band gap tunability

Fri, 1 Jan 2015
If you can't find the ideal material, then design a new one.

Status of the power electronics industry: It is now a question of integration

Mon, 2 Feb 2015
According to Yole Développement’s team, wide band gap (WBG) technologies are almost ready to be used by power electronics integrators. The question is now: How?

CARDIS, a new European effort targeting mobile early-stage cardio vascular disease detection

Tue, 2 Feb 2015
Imec, Medtronic, Ghent University and their project partners today announced the launch of the CARDIS project.

Ultra fast diaphragm valve for ALD applications

Tue, 2 Feb 2015
HAM-LET, a global manufacturer of instrumentation valves and fittings for industrial and high purity fluid and gas delivery systems is showcasing its Ultra Fast (UF series) Diaphragm Valve for Atomic Layer Deposition.

Entegris launches Dispense System optimized for 3D and MEMS applications

Tue, 2 Feb 2015
Entegris, Inc. announced the latest addition to its IntelliGen family of two-stage dispense technologies used in microelectronics manufacturing processes.

Imec introduces new snapshot hyperspectral image sensors with mosaic filter architecture

Wed, 2 Feb 2015
At next week’s SPIE Photonics West 2015, imec will present a new set of snapshot hyperspectral CMOS image sensors featuring spectral filter structures in a mosaic layout, processed per-pixel on 4x4 and 5x5 ‘Bayer-like’ arrays.

Fairchild simplifies dimmable LED lighting design

Wed, 2 Feb 2015
Fairchild, a global supplier of high-performance power semiconductor solutions, today announced the FL7734 Phase-Cut Dimmable Single- Stage LED Driver.

ROHM Semiconductor announces monolithic EDLC cell balancing IC

Thu, 2 Feb 2015
ROHM recently announced the development of a cell balancing IC that contributes to increased miniaturization, greater stability, and longer life for EDLCs.

Breakthrough may lead to industrial production of graphene devices

Mon, 2 Feb 2015
With properties that promise faster computers, better sensors and much more, graphene has been dubbed the 'miracle material'. But progress in producing it on an industrial scale without compromising its properties has proved elusive.

One-atom-thin silicon transistors hold promise for super-fast computing

Mon, 2 Feb 2015
Researchers at The University of Texas at Austin's Cockrell School of Engineering have created the first transistors made of silicene, the world's thinnest silicon material.

TMC introduces stage-base 450 with voice coil technology

Tue, 2 Feb 2015
TMC, a developer of high-performance vibration and motion cancellation technology, has introduced Stage-Base 450, its next generation of frame-mountable, active vibration and motion cancellation systems designed to control building floor vibration in semiconductor facilities, while increasing wafer-processing throughput.

Precision growth of light-emitting nanowires

Tue, 2 Feb 2015
A novel approach to growing nanowires promises a new means of control over their light-emitting and electronic properties.

Imec and Holst Centre to present key achievements at ISSCC 2015

Thu, 2 Feb 2015
At this year’s International Solid State Circuits Conference to be held in San Francisco, Calif., Feb. 22-26, imec and Holst Centre will present eight scientific papers covering groundbreaking results on ultra-low power design for wireless broadband communication, for wireless sensor networks, and organic electronics.

Researchers glimpse distortions in atomic structure of materials

Fri, 2 Feb 2015
Researchers from North Carolina State University are using a technique they developed to observe minute distortions in the atomic structure of complex materials, shedding light on what causes these distortions and opening the door to studies on how such atomic-scale variations can influence a material's properties.

Extreme-temperature electronics

Fri, 2 Feb 2015
Many industries are calling for electronics that can operate reliably in a harsh environment, including extreme temperatures above 200° Celsius.

Novel solid-state nanomaterial platform enables terahertz photonics

Tue, 2 Feb 2015
cientists are pioneering the use of nanomaterials in compact, sensitive, fast, low-cost terahertz detectors with potential in applications such as biomedical diagnostics, airport security screening and high data-rate wireless communication

A new spin on spintronics

Tue, 2 Feb 2015
A team of researchers from the University of Michigan and Western Michigan University is exploring new materials that could yield higher computational speeds and lower power consumption, even in harsh environments.

Novel crumpling method takes flat graphene from 2-D to 3-D

Tue, 2 Feb 2015
Researchers at the University of Illinois at Urbana-Champaign have developed a unique single-step process to achieve three-dimensional (3D) texturing of graphene and graphite.

MIG announces finalists for MEMS & Sensors Technology Showcase

Thu, 2 Feb 2015
Selected from a pool of applicants, finalist companies will demo their MEMS/sensors-based applications as they vie for attendees’ votes.

New nanowire structure absorbs light efficiently

Fri, 2 Feb 2015
Researchers at Aalto University, Finland have developed a new method to implement different types of nanowires side-by-side into a single array on a single substrate.

KLA-Tencor extends its 5D patterning control solution with new metrology systems

Thu, 2 Feb 2015
Today, KLA- Tencor Corporation introduced two advanced metrology systems that support the development and production of 16nm and below IC devices: Archer 500LCM and SpectraFilm LD10.

Penn researchers develop new technique for making molybdenum disulfide

Fri, 2 Feb 2015
University of Pennsylvania researchers have made an advance in manufacturing one such material, molybdenum disulphide.

The future of electronics -- now in 2-D

Fri, 2 Feb 2015
The future of electronics could lie in a material from its past, as researchers from The Ohio State University work to turn germanium--the material of 1940s transistors--into a potential replacement for silicon.

Optical nanoantennas set the stage for a NEMS lab-on-a-chip revolution

Tue, 2 Feb 2015
Newly developed tiny antennas, likened to spotlights on the nanoscale, offer the potential to measure food safety, identify pollutants in the air and even quickly diagnose and treat cancer, according to the Australian scientists who created them.

Thermal performance of 3DICs

Fri, 2 Feb 2015
3DICs are assumed to suffer from stronger thermal issues when compared to equivalent implementations in traditional single-die integration technologies.

Radio chip for the 'Internet of things'

Tue, 2 Feb 2015
At this year's Consumer Electronics Show in Las Vegas, the big theme was the "Internet of things" -- the idea that everything in the human environment, from kitchen appliances to industrial equipment, could be equipped with sensors and processors that can exchange data, helping with maintenance and the coordination of tasks.

Imec and Panasonic present breakthrough in CMOS-based transceivers for mm-wave radar systems

Wed, 2 Feb 2015
Today, at the 2015 International Solid State Circuits Conference (ISSCC), imec and Panasonic presented a transceiver chip for phase-modulated continuous-wave radar at 79GHz.

Imec demonstrates compact wavelength-division multiplexing CMOS silicon photonics transceiver

Thu, 2 Feb 2015
This week, at the 2015 International Solid State Circuits Conference (ISSCC), imec, in collaboration with Tyndall National Institute, the University of Leuven (KULeuven) and the Ghent University, demonstrated a 4x20Gb/s wavelength division multiplexing (WDM) hybrid CMOS silicon photonics transceive

Cypress debuts reliable, secure fingerprint sensing solution for mobile devices

Mon, 3 Mar 2015
The flexible solution enables designers to create custom home buttons with specialized shapes and sizes or to integrate the sensor into any mobile device’s industrial design or home button.

UT Dallas technology could make night vision, thermal imaging affordable

Wed, 3 Mar 2015
Semiconductors made in CMOS technology reach nearly 10 terahertz.

IRT Nanoelec and CMP team up to offer world’s first service for post-process 3D technologies on multi-project-wafer

Thu, 3 Mar 2015
IRT Nanoelec, an R&D consortium focused on ICT using micro- and nanoelectronics, and CMP, which provides prototyping and low-volume production of ICs and MEMS, are launching a platform for multi-project-wafer, post-process 3D integration (3D-MPW).

Graphene meets heat waves

Fri, 3 Mar 2015
In the race to miniaturize electronic components, researchers are challenged with a major problem: the smaller or the faster your device, the more challenging it is to cool it down.

SPIE 2015 Awards honor achievements in light-based technologies

Mon, 3 Mar 2015
The awards recognize outstanding technical accomplishments and meritorious service to the society.

Squeezing out new science from material interfaces

Mon, 3 Mar 2015
With more than five times the thermal conductivity of copper, diamond is the ultimate heat spreader. But the slow rate of heat flow into diamond from other materials limits its use in practice.

CEA-Leti announces launch of Silicon Impulse IC design competence center

Tue, 3 Mar 2015
CEA-Leti today announced the launch of its Silicon Impulse IC design competence center, a comprehensive IC technology platform offering IC design, advanced intellectual property, emulator and test services along with industrial multi-project wafer (MPW) shuttles.

MKS introduces the Cirrus 3-XD Atmospheric gas analysis system

Tue, 3 Mar 2015
MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced the Cirrus 3-XD Atmospheric gas analysis system in both benchtop and rack mounted models.

Mid-IR frequency combs enable high resolution spectroscopy for sensitive gas sensing

Tue, 3 Mar 2015
The results are an important step towards a small-footprint chip scale mid-infrared frequency comb source.

Marktech Optoelectronics adds miniature Point Source LED packages to product lineup

Wed, 3 Mar 2015
Marktech Optoelectronics Corp. announces the addition of a PLCC-4 and miniature ceramic package to the 650nm and 850nm Point Source LED series.

Dramatic results achieved in cleaving glass using ultra-short pulsed lasers

Wed, 3 Mar 2015
ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cleaving and drilling of glass up to 10mm thickness.

Engineers create chameleon-like artificial 'skin' that shifts color on demand

Thu, 3 Mar 2015
Borrowing a trick from nature, engineers from the University of California at Berkeley have created an incredibly thin, chameleon-like material that can be made to change color -- on demand -- by simply applying a minute amount of force.

New technology may double radio frequency data capacity

Fri, 3 Mar 2015
Columbia engineers invent nanoscale IC that enables simultaneous transmission and reception at the same frequency in a wireless radio.

Microsemi introduces second generation 64GB solid state drive

Tue, 3 Mar 2015
Microsemi Corporation, a provider of semiconductor solutions differentiated by power, security, reliability and performance, today introduced its second generation highly secure 64 gigabyte (GB) solid state drive (SSD).

EV Group releases new configurations to its high-vacuum wafer bonding technology

Tue, 3 Mar 2015
EV Group introduced two new configurations to its EVG 580 ComBond series of automated high-vacuum covalent wafer bonding systems.

Notchless wafer standard approved

Tue, 3 Mar 2015
450mm notchless wafer standardization has been under discussion for over a year.

MACOM announces new 650 W GaN on SiC HEMT pulsed power transistor

Wed, 3 Mar 2015
M/A-COM Technology Solutions Inc. today announced a 650 W gallium nitride (GaN) on silicon carbide (SiC) HEMT pulsed power transistor for L-band pulsed avionics applications.

Rice fine-tunes quantum dots from coal

Wed, 3 Mar 2015
Rice University scientists gain control of electronic, fluorescent properties of coal-based graphene.

Cambridge Nanotherm publishes results of first independent test of thermal management substrates for LEDs

Thu, 3 Mar 2015
The tests were conducted by The LIA Laboratories (part of The LIA - Europe’s largest lighting trade association) and showed Cambridge Nanotherm’s thermal management technology outperforming all the thermal management substrates tested in terms of its thermal conductivity.

UW scientists build a nanolaser using a single atomic sheet

Tue, 3 Mar 2015
University of Washington scientists have built a new nanometer-sized laser -- using the thinnest semiconductor available today -- that is energy efficient, easy to build and compatible with existing electronics.

Silicon Labs and Digi-Key challenge developer innovation with "Your IoT" design competition

Tue, 3 Mar 2015
Silicon Labs and Digi-Key today announced an IoT design contest for pioneering developers who want to create connected "things" that will help make the world a smarter, more connected and energy-friendly place.

'Goldilocks material' could change spintronics

Tue, 3 Mar 2015
Attempting to develop a novel type of permanent magnet, a team of researchers at Trinity College in Dublin, Ireland has discovered a new class of magnetic materials based on Mn-Ga alloys.

Thin wafer processing temporary bonding adhesive film for 3D wafer integration

Tue, 3 Mar 2015
AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thin wafer processing of bonding device wafer to carrier wafer.

Imec demonstrates 50GHz Ge waveguide electro-absorption modulator

Wed, 3 Mar 2015
At this week’s OFC 2015, the largest global conference and exposition for optical communications, nanoelectronics research center imec, its associated lab at Ghent University (Intec), and Stanford University have demonstrated a compact germanium (Ge) waveguide electro-absorption modulator (EAM) with a modulation bandwidth beyond 50GHz.

ULVAC announces world's first, low temperature PZT sputtering technology

Thu, 3 Mar 2015
ULVAC, Inc. this week announced industry's first low temperature PZT sputtering technology in mass production scale, enabling future advanced MEMS device integrated on CMOS which will be the mainstream of next generation MEMS devices.

University of Illinois at Urbana-Champaign research reduces microprocessor serial link power consumption

Tue, 3 Mar 2015
SRC sponsored research promises to cut serial link power by 80 Percent, helping extend Moore’s Law.

Chemists make new silicon-based nanomaterials

Fri, 3 Mar 2015
Chemists from Brown University have come up with a way to make new nanomaterials from a silicon-based compound.

Solving molybdenum disulfide's 'thin' problem

Fri, 3 Mar 2015
Research team increases material's light emission by twelve times.

Roll up your screen and stow it away?

Tue, 3 Mar 2015
Tel Aviv University researchers develop molecular backbone of super-slim, bendable digital displays.

Pibond introduces a new product line for logic, memory, power and MEMS devices

Wed, 4 Apr 2015
Targeting 10nm node semiconductor processing, 3D NAND, power ICs as well as MEMS applications, this technology enables advanced device manufacturing through reduced cost of ownership (COO) and simplified processing.

Light-powered gyroscope is world's smallest

Wed, 4 Apr 2015
A pair of light waves - one zipping clockwise the other counterclockwise around a microscopic track - may hold the key to creating the world's smallest gyroscope: one a fraction of the width of a human hair.

Consider packaging requirements at the beginning, not the end, of the design cycle

Thu, 4 Apr 2015
Consider these eight issues where the packaging team should be closely involved with the circuit design team.

TSMC certifies Synopsys design tools for 16nm finFET plus production and for 10nm early design starts

Mon, 4 Apr 2015
This certification enables mutual customers to deploy tools in Synopsys' Galaxy Design Platform for 16nm production designs and 10nm early engagements.

Future electronics based on carbon nanotubes

Tue, 4 Apr 2015
The exceptional properties of tiny molecular cylinders known as carbon nanotubes have tantalized researchers for years because of the possibility they could serve as a successors to silicon in laying the logic for smaller, faster and cheaper electronic devices.

Web tension control in roll-to-roll web processing

Tue, 4 Apr 2015
Achieving precise registration accuracy is a factor of two related variables: web tension and transport velocity.

Better sensors for medical imaging, contraband detection

Tue, 4 Apr 2015
MIT researchers have developed a new, ultrasensitive magnetic-field detector that is 1,000 times more energy-efficient than its predecessors.

Quantization of 'surface Dirac states' could lead to exotic applications

Tue, 4 Apr 2015
Researchers from the RIKEN Center for Emergent Matter Science in Japan have uncovered the first evidence of an unusual quantum phenomenon--the integer quantum Hall effect--in a new type of film, called a 3D topological insulator.

Graphene looking promising for future spintronic devices

Fri, 4 Apr 2015
Researchers at Chalmers University of Technology have discovered that large area graphene is able to preserve electron spin over an extended period, and communicate it over greater distances than had previously been known.

New understanding of electromagnetism could enable 'antennas on a chip'

Fri, 4 Apr 2015
A team of researchers from the University of Cambridge have unravelled one of the mysteries of electromagnetism, which could enable the design of antennas small enough to be integrated into an electronic chip. These ultra-small antennas - the so-called 'last frontier' of semiconductor design - would be a massive leap forward for wireless communications.

Duke University research advances testing of 3D integrated circuits for cost-effective development of electronics

Tue, 4 Apr 2015
Duke University researchers are working to advance the tools and methodologies used to test 3D integrated circuits (ICs), which promise to help ensure the ongoing development of higher performance, lower power semiconductor chips.

Solution-grown nanowires make the best lasers

Tue, 4 Apr 2015
Take a material that is a focus of interest in the quest for advanced solar cells. Discover a "freshman chemistry level" technique for growing that material into high-efficiency, ultra-small lasers. The result, disclosed Monday, April 13 in Nature Materials, is a shortcut to lasers that are extremely efficient and able to create many colors of light.

KLA-Tencor introduces new portfolio for advanced semiconductor packaging

Thu, 4 Apr 2015
Today, KLA-Tencor Corporation announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830.

New AFM with high definition electrical measurement capabilities

Thu, 4 Apr 2015
The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications.

Engineer improves rechargeable batteries with MoS2 nano 'sandwich'

Fri, 4 Apr 2015
The key to better cellphones and other rechargeable electronics may be in tiny "sandwiches" made of nanosheets, according to mechanical engineering research from Kansas State University.

Applied Materials announces new photomask etch system

Mon, 4 Apr 2015
Applied Materials today announced the Applied Centura Tetra Z Photomask Etch system for etching next-generation optical lithographic photomasks needed by the industry to continue multiple patterning scaling to the 10nm node and beyond.

MagnaChip to offer diversified products for Internet of Things applications

Mon, 4 Apr 2015
MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products announced today that it has kicked-off an Internet of Things (IoT) task force and will offer diversified products with ultra-low power technology in anticipation of the fast growing IoT market.

Synopsys' modeling of 10nm parasitic variation effects ratified by open-source standards board

Tue, 4 Apr 2015
Synopsys, Inc. today announced new extensions to its open-source Interconnect Technology Format (ITF) which enable modeling of complex device and interconnect parasitic effects at the advanced 10-nanometer (nm) process node.

SiVance, LLC opens R&D lab to drive innovations in specialty silane and silicone technologies

Tue, 4 Apr 2015
SiVance, LLC, a subsidiary of Milliken & Company, today announced the opening of a new, 11,000 sq.ft. research and development (R&D) laboratory.

From metal to insulator and back again

Thu, 4 Apr 2015
New work from Carnegie's Russell Hemley and Ivan Naumov hones in on the physics underlying the recently discovered fact that some metals stop being metallic under pressure.

UGA chemists' synthesis of silicon oxides opens 'new world in a grain of sand'

Thu, 4 Apr 2015
In an effort that reaches back to the 19th-century laboratories of Europe, a discovery by University of Georgia chemistry researchers establishes new research possibilities for silicon chemistry and the semiconductor industry.

Surface matters: Huge reduction of heat conduction observed in flat silicon channels

Thu, 4 Apr 2015
A paper published in ACS Nano describes how the nanometre-scale topology and the chemical composition of the surface control the thermal conductivity of ultrathin silicon membranes.

Canatu launches high transmittance CNB transparent conductive film for touch sensors

Mon, 4 Apr 2015
Canatu, a manufacturer of next generation transparent conductive films and touch sensors, announces a new generation of high optical transmittance CNB (Carbon NanoBud) transparent conductive films at Printed Electronics Europe.

Two-dimensional semiconductor comes clean

Tue, 4 Apr 2015
Researchers at Columbia Engineering, Harvard, Cornell, University of Minnesota, Yonsei University in Korea, Danish Technical University, and the Japanese National Institute of Materials Science have shown that the performance of another 2D material--molybdenum disulfide (MoS2)--can be similarly improved by BN-encapsulation.

Picture this: Graphene brings 3-D holograms clearer and closer

Tue, 4 Apr 2015
From mobile phones and computers to television, cinema and wearable devices, the display of full color, wide-angle, 3D holographic images is moving ever closer to fruition, thanks to international research featuring Griffith University.

Co-design of chips, packages and boards

Wed, 5 May 2015
A new product from Mentor Graphics called Xpedition® Package Integrator provides a new methodology and platform in addition to a new suite of EDA tools.

Dow's SOLDERON tin-silver plating chemistry wins prestigious Bronze Edison Award

Fri, 5 May 2015
Dow Electronic Materials, a business unit of The Dow Chemical Company, today announced that its SOLDERON BP TS 6000 Tin-Silver Plating Chemistry was honored as a Bronze 2015 Edison Award winner in the Material Science: Manufacturing category.

Improving organic transistors that drive flexible and conformable electronics

Tue, 5 May 2015
A revolution is coming in flexible electronic technologies as cheaper, more flexible, organic transistors come on the scene to replace expensive, rigid, silicone-based semiconductors, but not enough is known about how bending in these new thin-film electronic devices will affect their performance.

Defects in atomically thin semiconductor emit single photons

Tue, 5 May 2015
Researchers at the University of Rochester have shown that defects on an atomically thin semiconductor can produce light-emitting quantum dots.

"Microcombing" creates stronger, more conductive carbon nanotube films

Tue, 5 May 2015
Researchers from North Carolina State University and China's Suzhou Institute of Nano-Science and Nano-Biotics have developed an inexpensive technique called "microcombing" to align carbon nanotubes.

New JEOL e-beam lithography system to enhance Quantum NanoFab capabilities

Wed, 5 May 2015
A JEOL e-beam lithography system will soon be a new resource for quantum information science researchers that utilize the cutting-edge facilities at the University of Waterloo Quantum NanoFab in Waterloo, Ontario.

Visualizing formation in BEOL

Thu, 5 May 2015
New tests show in real-time that cracks can run on top of and through metal layers.

Channeling valleytronics in graphene

Thu, 5 May 2015
To the list of potential applications of graphene - a two-dimensional semiconductor of pure carbon that is stronger and much faster than silicon - we can now add valleytronics.

High-performance 3-D microbattery suitable for large-scale on-chip integration

Tue, 5 May 2015
By combining 3D holographic lithography and 2D photolithography, researchers from the University of Illinois at Urbana-Champaign have demonstrated a high-performance 3D microbattery suitable for large-scale on-chip integration with microelectronic devices.

New approaches to vision with microchips holds out prospects for the blind

Mon, 5 May 2015
To date, chip-based retinal implants have only permitted a rudimentary restoration of vision. However, modifying the electrical signals emitted by the implants could change that.

New device could greatly improve speech and image recognition

Tue, 5 May 2015
Researchers have demonstrated pattern recognition using a magnonic holographic memory device.

Samsung announces ARTIK platform to accelerate Internet of Things development

Tue, 5 May 2015
Samsung Electronics Co., Ltd. today announced the Samsung ARTIK platform to allow faster, simpler development of new enterprise, industrial and consumer applications for the Internet of Things (IoT).

Freescale speeds the creation of sensor applications for a secure IoT

Thu, 5 May 2015
Freescale Semiconductor today introduced its Intelligent Sensing Framework (ISF) 2.1, which now includes integration with Freescale’s Processor Expert tool to help create, configure, and generate embedded sensor-based applications for Freescale microcontrollers (MCUs).

Freescale introduces its first GaN RF power transistor for cellular base stations

Tue, 5 May 2015
Freescale Semiconductor today introduced its first gallium nitride (GaN) RF power transistor for cellular base stations.

Researchers grind nanotubes to get nanoribbons

Mon, 6 Jun 2015
A simple way to turn carbon nanotubes into valuable graphene nanoribbons may be to grind them, according to research led by Rice University.

Silicon Storage Technology, GLOBALFOUNDRIES announce qualification of automotive grade 55nm embedded flash tech

Fri, 5 May 2015
Microchip Technology Inc. and GLOBALFOUNDRIES today announced the full qualification and availability of SST's 55nm embedded SuperFlash non-volatile memory (NVM) on GLOBALFOUNDRIES' 55nm Low Power Extended (LPx)/ RF enabled platform.

Random nanowire configurations increase conductivity over heavily ordered configurations

Fri, 5 May 2015
Researchers at Lehigh University have identified for the first time that a performance gain in the electrical conductivity of random metal nanowire networks can be achieved by slightly restricting nanowire orientation.

imec and Lam Research develop novel metallization method

Tue, 5 May 2015
During the IEEE IITC conference in Grenoble, the nanoelectronics research center imec and Lam Research Corporation today presented a novel bottom-up prefill technique for vias and contacts.

Computing at the speed of light

Tue, 5 May 2015
University of Utah engineers have taken a step forward in creating the next generation of computers and mobile devices capable of speeds millions of times faster than current machines.

Advantest launches its first integrated test solution for optical transceivers

Tue, 5 May 2015
Semiconductor test equipment supplier Advantest Corporation has introduced its new 28G OPM (28-gigabit Optical Port Module), the company's first solution designed specifically for testing optical transceivers.

GLOBALFOUNDRIES offers new low-power 28nm solution for high-performance mobile and IoT applications

Wed, 5 May 2015
Technology is the first in the industry to provide design enablement support optimized to meet low power requirements of RF SoCs.

imec and Tokyo Electron demonstrate electrical advantages of direct Cu etch scheme for advanced interconnects

Wed, 5 May 2015
Today, at the IEEE IITC conference, nano-electronics research center imec and Tokyo Electron Limited (TEL) presented a direct Cu etch scheme for patterning Cu interconnects.

Dow Corning introduces next-generation thermal interface material

Tue, 5 May 2015
Dow Corning, a developer of silicones, silicon-based technology and innovation, today unveiled new Dow Corning TC-3040 Thermally Conductive Gel, a next-generation thermal interface material.

Advantest develops semiconductor circuit analysis terahertz technology

Thu, 5 May 2015
Semiconductor test equipment supplier Advantest Corporation announced today that it has developed a technology utilizing short-pulse terahertz waves for analysis of electrical circuits.

Infinitesima Ltd announces major RPM design win with Zeiss

Tue, 5 May 2015
Infinitesima announced today that its groundbreaking probe microscope has been integrated into the ZEISS MeRiT neXT photomask repair tool.

GaN Systems power transistors are 50% smaller

Tue, 5 May 2015
GaN Systems, a developer of gallium nitride power switching semiconductors, today confirmed the world’s smallest 650V, 15A gallium nitride transistor.

UMC unveils UMC Auto Platform to enable automotive IC designs

Tue, 5 May 2015
United Microelectronics Corporation, a global semiconductor foundry, today unveiled its UMC Auto technology platform to target IC companies designing chips for automotive applications.

Collaboration could lead to biodegradable computer chips

Fri, 5 May 2015
Portable electronics - typically made of non-renewable, non-biodegradable and potentially toxic materials - are discarded at an alarming rate in consumers' pursuit of the next best electronic gadget.

Diverse packaging and test issues up for debate at SEMICON West 2015

Fri, 5 May 2015
SEMI this week announced the SEMICON West 2015 test and packaging program agendas.

Technology for tomorrow’s market opportunities and challenges at LetiDays Grenoble

Fri, 5 May 2015
The 17th annual LetiDays Grenoble on June 24-25 will expand the conversation with presentations about Internet of Things-augmented mobility, which is revolutionizing the way we interact with appliances, infrastructure and countless common objects that are part of our daily lives.

Leti demos new process to fabricate high-brightness micro-LED arrays for next-gen head-mounted and head-up displays

Tue, 6 Jun 2015
CEA-Leti today announced that it has demonstrated a path to fabricating high-density micro-LED arrays for the next generation of wearable and nomadic systems in a process that is scalable to the IC manufacturing process.

Fujifilm and imec demonstrate full-color OLEDs with photoresist technology for organic semiconductors

Tue, 6 Jun 2015
FUJIFILM Corporation and nano-electronics research institute, imec have demonstrated full-color organic light-emitting diodes (OLED) by using their jointly-developed photoresist technology for organic semiconductors.

GLOBALFOUNDRIES solidifies 14nm finFET design infrastructure for next-generation chip design

Tue, 6 Jun 2015
GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced it has reached a critical milestone in providing a design infrastructure for its 14-nanometer (nm) FinFET process technology.

A major advance in mastering the extraordinary properties of an emerging semiconductor

Fri, 6 Jun 2015
Black phosphorus reveals its secrets thanks to a scientific breakthrough made by a team from Universite de Montreal, Polytechnique Montreal and CNRS in France.

Is it time to switch to OASIS.MASK?

Thu, 6 Jun 2015
A summary of OASIS standard advantages and weaknesses is presented, based on six years of experience with customer databases.

A novel characterization technique unveils the 3D structure of conductive filaments in resistive switching memories

Fri, 6 Jun 2015
Imec researchers have developed a novel technique – termed conductive atomic force microscopy tomography (or scalpel C-AFM) – that enables a three-dimensional characterization of emerging logic and memory devices.

Futuristic components on silicon chips, fabricated successfully

Mon, 6 Jun 2015
IBM researchers develop a technique for integrating 'III-V' materials onto silicon wafers, a breakthrough that may allow an extension to Moore's Law.

The impact of consumer demand for cutting-edge display technology on the gases market

Tue, 6 Jun 2015
How gases are used in the manufacture of displays is being impacted by new technologies, consumer demand, and the burgeoning China market.

Going organic: The cost-down route to foldable display manufacture

Tue, 6 Jun 2015
Organic semiconductors now offer the performance, cost and route to adoption, for foldable displays; from ultra-thin, conformal, wearables to truly foldable smartphones and tablets.

Next-generation illumination using silicon quantum dot-based white-blue LED

Tue, 6 Jun 2015
A hybrid LED is expected to be a next-generation illumination device for producing flexible lighting and display, and this is achieved for the Si QD-based white-blue LED.

imec presents large area industrial crystalline silicon n-PERT solar cell with record 22.5% efficiency

Wed, 6 Jun 2015
Nano-electronics research center imec announced today at Intersolar Europe, a new efficiency record for its large area n-type PERT (passivated emitter, rear totally diffused) crystalline silicon (Cz-Si) solar cell, now reaching 22.5 percent (calibrated at ISE CalLab).

Slip sliding away: Graphene and diamonds prove a slippery combination

Wed, 6 Jun 2015
Scientists at the U.S. Department of Energy's Argonne National Laboratory have found a way to use tiny diamonds and graphene to give friction the slip, creating a new material combination that demonstrates the rare phenomenon of "superlubricity."

MIPT physicists develop ultrasensitive nanomechanical biosensor

Wed, 6 Jun 2015
t can analyze the chemical composition of substances and detect biological objects, such as viral disease markers, which appear when the immune system responds to incurable or hard-to-cure diseases, including HIV, hepatitis, herpes, and many others.

Leti Workshop on June 26 to cover latest R&D successes in innovative memory technologies

Wed, 6 Jun 2015
CEA-Leti is hosting its seventh workshop on innovative memory technologies following the 17th annual LetiDays Grenoble, June 24-25, on the Minatec campus.

World's thinnest lightbulb -- graphene gets bright

Mon, 6 Jun 2015
A team of scientists from Columbia, Seoul National University (SNU), and Korea Research Institute of Standards and Science (KRISS) reported today that they have demonstrated -- for the first time -- an on-chip visible light source using graphene, an atomically thin and perfectly crystalline form of carbon, as a filament.

A KAIST research team develops the first flexible phase-change random access memory

Mon, 6 Jun 2015
Phase change random access memory (PRAM) is one of the strongest candidates for next-generation nonvolatile memory for flexible and wearable electronics.

SK Hynix ramps production of high bandwidth memory

Tue, 6 Jun 2015
SK Hynix Inc. announced today that it is shipping mass production volumes of 1st generation High Bandwidth Memory (HBM1) based on SK hynix’s advanced 20nm-class DRAM process technology.

Optimized printing process enables custom organic electronics

Tue, 6 Jun 2015
They are thin, light-weight, flexible and can be produced cost- and energy-efficiently: printed microelectronic components made of synthetics. Flexible displays and touch screens, glowing films, RFID tags and solar cells represent a future market.

Leti workshop covers major trends in FD-SOI technologies

Tue, 6 Jun 2015
CEA-Leti will host a workshop on major trends in Fully Depleted Silicon-on-Insulator process and design technologies in connection with the 17th annual LetiDays Grenoble, June 24-25.

Plasma-Therm presents workshop at China University

Tue, 6 Jun 2015
Plasma-Therm recently presented an advanced plasma processing workshop at Xidian University in Xi’an, China that was attended by researchers, students and industry representatives and featured a day-long series of presentations about plasma processing.

Dow Corning granted Korean patent for LED optical silicone encapsulant technology

Wed, 6 Jun 2015
Dow Corning reported today that the Korean Intellectual Property Office (KIPO) granted a patent protecting the company’s high refractive index (RI) phenyl-based optical silicone encapsulant technology, which targets advanced LED lighting applications.

Researchers create transparent, stretchable conductors using nano-accordion structure

Thu, 6 Jun 2015
Researchers from North Carolina State University have created stretchable, transparent conductors that work because of the structures' "nano-accordion" design. The conductors could be used in a wide variety of applications, such as flexible electronics, stretchable displays or wearable sensors.

Organ-on-a-chip technology helps researchers better understand pregnancy

Thu, 6 Jun 2015
National Institutes of Health (NIH) researchers and their colleagues have developed a "placenta-on-a-chip" to study the inner workings of the human placenta and its role in pregnancy.

A new look at surface chemistry

Thu, 6 Jun 2015
For the first time in the long and vaunted history of scanning electron microscopy, the unique atomic structure at the surface of a material has been resolved.

First solar cell made of highly ordered molecular frameworks

Fri, 6 Jun 2015
"We have opened the door to a new room," says Professor Christof Wöll, Director of KIT Institute of Functional Interfaces (IFG).

imec and Holst Centre present a gas sensing platform for intuitive IoT applications

Tue, 6 Jun 2015
Imec and Holst Centre have developed a small NO2 sensor featuring a low power consumption in the mW range.

Freescale takes its next generation QorIQ multicore platform to 16nm FinFET technology

Wed, 6 Jun 2015
Freescale Semiconductor has disclosed initial details regarding the next generation of its successful QorIQ multicore processor portfolio, today announcing it will drive innovation for the secure Internet of Tomorrow (IoT) on highly advanced 16nm FinFET process technology.

Toward tiny, solar-powered sensors

Wed, 6 Jun 2015
Last week, at the Symposia on VLSI Technology and Circuits, MIT researchers presented a new power converter chip that can harvest more than 80 percent of the energy trickling into it, even at the extremely low power levels characteristic of tiny solar cells.

Nanowires could be the LEDs of the future

Thu, 6 Jun 2015
The latest research from the Niels Bohr Institute shows that LEDs made from nanowires will use less energy and provide better light.

Stanford researchers stretch a thin crystal to get better solar cells

Thu, 6 Jun 2015
Crystalline semiconductors like silicon can catch photons and convert their energy into electron flows. New research shows a little stretching could give one of silicon's lesser-known cousins its own place in the sun.

“What’s next?” ─ Advances in technology at SEMICON West 2015

Thu, 6 Jun 2015
The latest manufacturing, materials and production developments in semiconductor and related technologies will be featured at SEMICON West 2015 on July 14-16 at Moscone Center in San Francisco, Calif.

Biodegradable, flexible silicon transistors

Tue, 6 Jun 2015
Wisconsin researchers have developed a new biodegradable silicon transistor based on a material derived from wood, opening the door for green, flexible, low-cost portable electronics in future.

Making new materials with micro-explosions

Mon, 6 Jun 2015
Scientists have made exotic new materials by creating laser-induced micro-explosions in silicon, the common computer chip material.

Opening a new route to photonics

Mon, 6 Jun 2015
A new route to ultrahigh density, ultracompact integrated photonic circuitry has been discovered by researchers with the Lawrence Berkeley National Laboratory (Berkeley Lab) and the University of California (UC) Berkeley.

The peaks and valleys of silicon

Mon, 6 Jun 2015
When the new iPhone came out, customers complained that it could be bent -- but what if you could roll up your too big 6 Plus to actually fit in your pocket? That technology might be available sooner than you think, based on the work of USC Viterbi engineers.

New method can make cheaper solar energy storage

Wed, 7 Jul 2015
EPFL scientists have now developed a simple, unconventional method to fabricate high-quality, efficient solar panels for direct solar hydrogen production with low cost.

Graphene flexes its electronic muscles

Wed, 7 Jul 2015
Flexing graphene may be the most basic way to control its electrical properties, according to calculations by theoretical physicists at Rice University and in Russia.

EV Group ramps nanoimprint lithography into high-volume manufacturing with HERCULES NIL Track System

Tue, 7 Jul 2015
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the HERCULES NIL—a fully integrated track system that combines cleaning, resist coating and baking pre-processing steps with EVG's SmartNIL large-area nanoimprint lithography (NIL) process in a single platform.

New technology using silver may hold key to electronics advances

Thu, 7 Jul 2015
Engineers at Oregon State University have invented a way to fabricate silver, a highly conductive metal, for printed electronics that are produced at room temperature.

Could black phosphorus be the next silicon?

Tue, 7 Jul 2015
New material could make it possible to pack more transistors on a chip, research suggests.

Peregrine Semiconductor introduces first RF SOI 300mm technology platform

Mon, 7 Jul 2015
Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the UltraCMOS 11 platform.

Down to the quantum dot

Tue, 7 Jul 2015
Using a single molecule as a sensor, scientists in Jülich have successfully imaged electric potential fields with unrivalled precision.

Genmark Automation launches CODEX Stocker

Mon, 7 Jul 2015
Genmark Automation, a developer of tool and factory automation solutions for the semiconductor and related industries, today announced the launch of its new CODEX Stocker.

IRT Nanoelec partners achieve 3D chip-stacking technology & 3D network-on-chip framework

Thu, 7 Jul 2015
IRT Nanoelec, an R&D consortium focused on Information and Communication Technologies (ICT) using micro- and nanoelectronics, and its partners CEA-Leti, STMicroelectronics and Mentor Graphics have realized an innovative 3D chip called “3DNoC” to demonstrate the use of 3D stacking technology in scalable, complex digital systems-on-chip (SoCs).

Graphene gets competition

Thu, 7 Jul 2015
Graphene, the only one atom thick carbon network, achieved overnight fame with the 2010 Nobel Prize. But now comes competition: Such layers can also be formed by black phosphorous.

Graphene-based film can be used for efficient cooling of electronics

Fri, 7 Jul 2015
Researchers at Chalmers University of Technology have developed a method for efficiently cooling electronics using graphene-based film.

Applied Materials introduces high-performance ALD technology for the 3D era

Mon, 7 Jul 2015
Applied Materials, Inc. today unveiled the Applied Olympia ALD system, featuring a unique, modular architecture that delivers high-performance ALD technology to manufacturers of leading-edge 3D memory and logic chips.

Imec and Panasonic demonstrate breakthrough RRAM cell

Mon, 7 Jul 2015
Imec and Panasonic Corp. announced today that they have fabricated a 40nm TaOx-based RRAM (resistive RAM) technology with precise filament positioning and high thermal stability.

Applied Materials' new etch system provides atomic-level precision

Mon, 7 Jul 2015
Applied Materials, Inc. today announced a next-generation etch tool, the Applied Centris Sym3 Etch system, featuring an entirely new chamber for atomic-level precision manufacturing.

Imec introduces self-assembled monomolecular organic films to seal ultra-porous low- k materials

Tue, 7 Jul 2015
Nano-electronics research center imec announced today at SEMICON West that it has demonstrated concept and feasibility for pore-sealing low-k dielectrics in advanced interconnects.

Rudolph Technologies and DISCO Corporation partner to improve wafer saw process

Tue, 7 Jul 2015
Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy.

ClassOne develops new Solstice solution for >200mm TSV plating

Tue, 7 Jul 2015
Semiconductor equipment manufacturer ClassOne Technology today announced a configuration for optimizing Through Silicon Via (TSV) and Through Wafer Via (TWV) processes on its affordable Solstice electroplating systems.

Save costs by conserving energy in the sub-fab

Wed, 7 Jul 2015
Opportunities for cost savings abound in the “sub-fab” of semiconductor operations where the vacuum pumps and gas abatement systems reside.

HORIBA Semiconductor introduces the HD-960L monitor for dissolved oxygen

Wed, 7 Jul 2015
HORIBA Semiconductor, global leader in process metrology and control components, introduces its new HD-960L for sub-parts-per-billion level monitoring of DO in chemicals with a low sample-consumption rate.

TÜV Rheinland showcases services & abilities for semi industry focus is on OSHA and EMC testing certification

Wed, 7 Jul 2015
TÜV Rheinland, a full-service testing, inspection and certification company, exhibiting at the annual SEMICON West expo, announced the expansion of services to include Environmental, Health & Safety testing and certification of Group III-V compounds in semiconductor manufacturing environments.

Managing hazardous process exhaust in high volume manufacturing

Wed, 7 Jul 2015
“Let no element on the periodic table go un-used!” That may well be the rallying cry of the semiconductor industry moving forward.

Inspection smooths a bumpy road

Thu, 7 Jul 2015
Wafer bumping has several advantages over traditional wire bonding. Bumps can be placed almost anywhere on the die, where wire bonding is limited to the periphery of the devices. And bumps give you the ability to put many more I/O points on an individual die.

An easy, scalable and direct method for synthesizing graphene in silicon microelectronics

Tue, 7 Jul 2015
In the last decade, graphene has been intensively studied for its unique optical, mechanical, electrical and structural properties.

Sticky tape and phosphorus the key to ultrathin solar cells

Tue, 7 Jul 2015
Scientists studying thin layers of phosphorus have found surprising properties that could open the door to ultrathin and ultralight solar cells and LEDs.

Penn researchers discover new chiral property of silicon, with photonic applications

Fri, 7 Jul 2015
By encoding information in photons via their spin, "photonic" computers could be orders of magnitude faster and efficient than their current-day counterparts. Likewise, encoding information in the spin of electrons, rather than just their quantity, could make "spintronic" computers with similar advantages.

New fiber optic temperature sensing and control system ideal for RF environments

Wed, 7 Jul 2015
Watlow, a designer and manufacturer of complete thermal systems, announced its new EZ-ZONE RM fiber optic temperature measurement system, a compact sensing and control solution ideal for plasma environments.

Compact point of use fluid delivery heater replaces multiple components in a system

Wed, 7 Jul 2015
Watlow, a designer and manufacturer of complete thermal systems, announces its new point-of-use fluid delivery heater, a compact solution used to provide precise and uniform heat to gases flowing into the chamber.

More efficient process to produce graphene developed by Ben-Gurion University researchers

Thu, 7 Jul 2015
Ben-Gurion University of the Negev (BGU) and University of Western Australia researchers have developed a new process to develop few-layer graphene for use in energy storage and other material applications that is faster, potentially scalable and surmounts some of the current graphene production limitations.

Reshaping the solar spectrum to turn light to electricity

Tue, 7 Jul 2015
A team of chemists at the University of California, Riverside found an ingenious way to make solar energy conversion more efficient.

Superfast fluorescence sets new speed record

Mon, 7 Jul 2015
Researchers have developed an ultrafast light-emitting device that can flip on and off 90 billion times a second and could form the basis of optical computing.

Rice University finding could lead to cheap, efficient metal-based solar cells

Mon, 7 Jul 2015
New research from Rice University could make it easier for engineers to harness the power of light-capturing nanomaterials to boost the efficiency and reduce the costs of photovoltaic solar cells.

Short wavelength plasmons observed in nanotubes

Tue, 7 Jul 2015
A team of researchers with Berkeley Lab's Materials Sciences Division, working at the Advanced Light Source (ALS), has generated and detected plasmons that boast one of the strongest confinement factors ever: the plasmon wavelength is only one hundredth of the free-space photon wavelength.

Meet the high-performance single-molecule diode

Wed, 7 Jul 2015
A team of researchers from Berkeley Lab and Columbia University has passed a major milestone in molecular electronics with the creation of the world's highest-performance single-molecule diode.

Sol-gel capacitor dielectric offers record-high energy storage

Thu, 7 Jul 2015
Using a hybrid silica sol-gel material and self-assembled monolayers of a common fatty acid, researchers have developed a new capacitor dielectric material that provides an electrical energy storage capacity rivaling certain batteries, with both a high energy density and high power density.