Topic Index

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Entegris launches ultra clean filter for semiconductor manufacturing

Tue, 7 Jul 2014
Entegris, Inc. announced the latest addition to its Torrento family of ultra clean liquid filtration solutions used in the semiconductor manufacturing process.

Applied Materials unveils CVD and CMP systems

Tue, 7 Jul 2014
On Monday, Applied Materials announced two new systems, a Reflexion LK Prime CMP system and a Producer XP Precision CVD system, both aimed at complex devices with 3D architectures.

The latest in CMP tech will be on offer at SEMICON West

Wed, 7 Jul 2015
Chemical mechanical planarization (CMP) technology has been around for a long time. In addition to the semiconductor industry, CMP has applications in data storage, polishing the rigid disks and magnetic heads of hard-disk drives.

Tackling advanced litho challenges on the path to node 5

Thu, 7 Jul 2015
If you attended just about any mask making conference in the last five to seven years, you would have heard the lament about exploding data volumes and their impact on mask writing time and, by extension, mask costs.

Leti reports FinFET feasibility and circuit design with CoolCube tech

Mon, 7 Jul 2015
CEA-Leti today announced its first results towards the demonstration of CoolCube’s feasibility in FinFET technology on its 300mm production line, and new CoolCube circuit designs that improve the trade off between area, speed and power.

Imec introduces self-assembled monomolecular organic films to seal ultra-porous low- k materials

Tue, 7 Jul 2015
Nano-electronics research center imec announced today at SEMICON West that it has demonstrated concept and feasibility for pore-sealing low-k dielectrics in advanced interconnects.

Rudolph Technologies and DISCO Corporation partner to improve wafer saw process

Tue, 7 Jul 2015
Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy.

Is silicon’s heyday over? New materials challenge the industry workhorse

Tue, 7 Jul 2015
The short answer to that headline’s question is “no.” Longer term, in going beyond the 5-nanometer process node, silicon may finally reach the end of its usefulness to the semiconductor industry.

ClassOne develops new Solstice solution for >200mm TSV plating

Tue, 7 Jul 2015
Semiconductor equipment manufacturer ClassOne Technology today announced a configuration for optimizing Through Silicon Via (TSV) and Through Wafer Via (TWV) processes on its affordable Solstice electroplating systems.

New materials require new approaches

Wed, 7 Jul 2015
Continued advances in the semiconductor will increasingly be enabled by materials technology, versus the scaling that has been commonplace over the last 50 years as defined by Moore’s Law.

A new sensor from Golden Valley-based CyberOptics will advance digital gadgets

Wed, 7 Jul 2015
CyberOptics’ latest product ultimately will make digital gadgets better, cheaper.

TÜV Rheinland showcases services & abilities for semi industry focus is on OSHA and EMC testing certification

Wed, 7 Jul 2015
TÜV Rheinland, a full-service testing, inspection and certification company, exhibiting at the annual SEMICON West expo, announced the expansion of services to include Environmental, Health & Safety testing and certification of Group III-V compounds in semiconductor manufacturing environments.

Tanaka launches semiconductor wafer cup-type ultra-compact plating laboratory equipment

Wed, 7 Jul 2015