Topic Index

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z 0-9

Entegris launches ultra clean filter for semiconductor manufacturing

Tue, 7 Jul 2014
Entegris, Inc. announced the latest addition to its Torrento family of ultra clean liquid filtration solutions used in the semiconductor manufacturing process.

Applied Materials unveils CVD and CMP systems

Tue, 7 Jul 2014
On Monday, Applied Materials announced two new systems, a Reflexion LK Prime CMP system and a Producer XP Precision CVD system, both aimed at complex devices with 3D architectures.

The latest in CMP tech will be on offer at SEMICON West

Wed, 7 Jul 2015
Chemical mechanical planarization (CMP) technology has been around for a long time. In addition to the semiconductor industry, CMP has applications in data storage, polishing the rigid disks and magnetic heads of hard-disk drives.

Tackling advanced litho challenges on the path to node 5

Thu, 7 Jul 2015
If you attended just about any mask making conference in the last five to seven years, you would have heard the lament about exploding data volumes and their impact on mask writing time and, by extension, mask costs.

Leti reports FinFET feasibility and circuit design with CoolCube tech

Mon, 7 Jul 2015
CEA-Leti today announced its first results towards the demonstration of CoolCube’s feasibility in FinFET technology on its 300mm production line, and new CoolCube circuit designs that improve the trade off between area, speed and power.

Imec introduces self-assembled monomolecular organic films to seal ultra-porous low- k materials

Tue, 7 Jul 2015
Nano-electronics research center imec announced today at SEMICON West that it has demonstrated concept and feasibility for pore-sealing low-k dielectrics in advanced interconnects.

Rudolph Technologies and DISCO Corporation partner to improve wafer saw process

Tue, 7 Jul 2015
Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy.

Is silicon’s heyday over? New materials challenge the industry workhorse

Tue, 7 Jul 2015
The short answer to that headline’s question is “no.” Longer term, in going beyond the 5-nanometer process node, silicon may finally reach the end of its usefulness to the semiconductor industry.

ClassOne develops new Solstice solution for >200mm TSV plating

Tue, 7 Jul 2015
Semiconductor equipment manufacturer ClassOne Technology today announced a configuration for optimizing Through Silicon Via (TSV) and Through Wafer Via (TWV) processes on its affordable Solstice electroplating systems.

New materials require new approaches

Wed, 7 Jul 2015
Continued advances in the semiconductor will increasingly be enabled by materials technology, versus the scaling that has been commonplace over the last 50 years as defined by Moore’s Law.

A new sensor from Golden Valley-based CyberOptics will advance digital gadgets

Wed, 7 Jul 2015
CyberOptics’ latest product ultimately will make digital gadgets better, cheaper.

TÜV Rheinland showcases services & abilities for semi industry focus is on OSHA and EMC testing certification

Wed, 7 Jul 2015
TÜV Rheinland, a full-service testing, inspection and certification company, exhibiting at the annual SEMICON West expo, announced the expansion of services to include Environmental, Health & Safety testing and certification of Group III-V compounds in semiconductor manufacturing environments.

Tanaka launches semiconductor wafer cup-type ultra-compact plating laboratory equipment

Wed, 7 Jul 2015

New motion sensor from STMicroelectronics enhances user interface and image stabilization in smartphones and tablets

Thu, 9 Sep 2015
STMicroelectronics has introduced a six-axis motion-sensing device fully supporting image stabilization in smartphones, tablets, and digital still cameras.

Perovskite photovoltaics excitement

Tue, 9 Sep 2015
Perovskite photovoltaics efficiency gains are double those of organic PV, exciting researchers from KIMM in Korea to Dyesol in Australia.

SUNY Poly announces joint development agreement with INFICON

Mon, 9 Sep 2015
The collaboration is expected to advance semiconductor manufacturing processes and lead to the creation of 50 jobs at SUNY Poly statewide facilities.

UMC enters high volume touch IC production using foundry industry's first 0.11um eFlash process

Thu, 9 Sep 2015
United Microelectronics Corporation (UMC), a global semiconductor foundry, today announced that it has entered high volume production for touch IC applications manufactured on UMC's 0.11um eFlash process.

New software update for parametric test system reduces test times by 25 percent

Thu, 9 Sep 2015
Tektronix, Inc. announced the release of a major system software update for the Keithley S530 Parametric Test System that can reduce measurement speed by as much as 25 percent.

X-FAB sets benchmark for low-noise CMOS

Fri, 9 Sep 2015
Enhanced XH035 and XH018 CMOS transistors deliver industry-leading performance for highly noise-sensitive applications.

First circularly polarized light detector on a silicon chip

Thu, 10 Oct 2015
Invention of the first integrated circularly polarized light detector on a silicon chip opens the door for development of small, portable sensors that could expand the use of polarized light for many applications.

Organic semiconductors get weird at the edge: University of British Columbia research

Thu, 10 Oct 2015
As the push for tinier and faster electronics continues, a new finding by University of British Columbia scientists could help inform the design of the next generation of cheaper, more efficient devices.

Next-generation perovskite solar cells made stable by metal oxide "sandwich"

Mon, 10 Oct 2015
New solar cell construction extends the cell's effective life in air by more than 10 times, with only a marginal loss of efficiency converting sunlight to electricity.

Successful industrialization of high-density 3D integrated silicon capacitors for ultra-miniaturized electronic components

Thu, 10 Oct 2015
Two years after the launch of the PICS project , three European SMEs, IPDiA, Picosun, and SENTECH Instruments along with CEA-Leti and Fraunhofer IPMS-CNT announce the major technological results achieved.