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Singapore researchers use FEI Titan S/TEM to link plasmonics with molecular electronics

Tue, 6 Jun 2014
The National University of Singapore, Singapore University of Technology and Design, and the A*STAR institutes: Institute of High Performance Computing and Institute of Materials Research and Engineering announced their recent discovery of quantum plasmonic tunneling.

Gopal Rao at The ConFab: Scaling isn’t enough anymore

Wed, 6 Jun 2014
The core element of the semiconductor industry’s roadmap has been scaling – but Gopal Rao believes that isn’t enough anymore.

Applied Materials and Tokyo Electron unveil new company name

Tue, 7 Jul 2014
Applied Materials, Inc. and Tokyo Electron Limited today unveiled the new name and logo of their combined company which will be used once the merger closes.

Paradigm shift in semi equipment - Confirmed

Tue, 7 Jul 2014
Technology node transitions slowing below 32nm.

IBM announces $3B research initiative

Tue, 7 Jul 2014
IBM announced it is investing $3 billion over the next 5 years in two broad research and early stage development programs to push the limits of chip technology needed to meet the emerging demands of cloud computing and Big Data systems.

Process Watch: The 10 fundamental truths of process control for the semiconductor IC industry

Tue, 7 Jul 2014
This is the first in a series of 10 installments which will discuss fundamental truths about process control - inspection and metrology - for the semiconductor industry.

VCs still investing in semiconductor technology, but need strategic partners and capital efficiency

Thu, 7 Jul 2014
Investors are still looking for differentiated technologies that solve high-value problems in semiconductor manufacturing, or that bring semiconductor technology to disruptive applications in other fields, particularly in the medical and environmental sectors

Can lean innovation bring growth and profits back to semiconductors?

Fri, 7 Jul 2014
New approaches to start-ups can unlock mega-trend opportunities.

Cryogenic etching reduces plasma-induced damage of ultralow-k dielectrics

Mon, 7 Jul 2014
Reducing plasma-induced damage is key to advancing the scaling limits.

Global semiconductor industry on pace for record sales through first half of 2014

Tue, 8 Aug 2014
Sales up across every region and nearly all product categories compared to last year; Americas region shows strongest growth.

SEMATECH and CNSE/SUNY launch new patterning center

Thu, 8 Aug 2014
SEMATECH and the newly merged SUNY College of Nanoscale Science and Engineering (CNSE) / SUNY Institute of Technology (SUNYIT) announced today they have launched their joint Patterning Center of Excellence.

Strong growth in second quarter 2014 silicon wafer shipments

Tue, 8 Aug 2014
Worldwide silicon wafer area shipments increased during the second quarter 2014 when compared to first quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

UMC joins Fujitsu's new foundry company

Fri, 8 Aug 2014
United Microelectronics Corporation and Fujitsu Semiconductor Limited today announced an agreement for UMC to become a minority shareholder of a newly formed subsidiary of Fujitsu Semiconductor that will include its 300mm wafer manufacturing facility located in Kuwana, Mie, Japan.

Fairchild Semiconductor to close two facilities, cutting 15% of workforce

Mon, 8 Aug 2014
Fairchild Semiconductor, a supplier of high performance power and mobile products, today announced it will eliminate its internal five-inch and significantly reduce six-inch wafer fabrication lines.

GaAs device market posts record revenues in 2013

Fri, 9 Sep 2014
Ongoing growth in cellular and Wi-Fi applications will continue to drive GaAs device revenues higher.

Gas applications in lithography

Mon, 9 Sep 2014
Lithography is a key enabling process with very demanding requirements. Shrinking feature sizes will raise the bar even further.

10nm success depends on concurrent design and development

Mon, 9 Sep 2014
The Prophets of Doom greet every new process node with a chorus of dire warnings about the end of scaling, catastrophic thermal effects, parasitics run amok and . . . you know the rest.

SEMI wins request for etch equipment export control review

Tue, 9 Sep 2014
Major milestone in longstanding push to remove etch equipment from U.S. export control list.

Rigorously tuned compact models: Extending predictive models to full-chip

Tue, 9 Sep 2014
Fast and predictive 3D resist compact models are needed for OPC applications. A methodology to build such models is described, starting from a 3D bulk image, and including resist interface effects such as diffusion.

Equipment spending shows strong growth for 2014 and 2015

Wed, 9 Sep 2014
Front End fab equipment spending is projected to increase up to another 20 percent in 2015 to US$ 42 billion.

The semiconductor industry: Out in front, but lagging behind

Wed, 9 Sep 2014
Capital equipment suppliers must provide advanced analytical systems that leverage data generated by their tools to help their fab customers address the challenges of Big Data and advanced analytics.

Outlook: Healthy equipment spending into 2015

Wed, 9 Sep 2014
The general consensus for the semiconductor industry is for this year’s positive trend to continue into 2015 as both revenue growth and unit shipment growth are expected to be in the mid- to high- single digit range.