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SEMI book-to-bill ratio indicates bookings decline

Thu, 9 Sep 2013
North America-based manufacturers of semiconductor equipment posted $1.06 billion in orders worldwide in August 2013 (three-month average basis) and a book-to-bill ratio of 0.98, according to the August EMDS Book-to-Bill Report published today by SEMI.

Mobility now driving the industry

Wed, 9 Sep 2013
It’s apparent that the world’s appetite for electronics has never been greater. That has increasingly taken the form of mobile electronics, including smartphones, tablets and tablets and the new “phablets.” People want to watch movies and live sports on their phones.

Cisco awards STMicroelectronics Excellence in Sustainability award

Tue, 10 Oct 2013
STMicroelectronics today announced that it has received the 2013 Excellence in Sustainability Award from Cisco.

MEMS accelerometer from STMicroelectronics part of newly-launched brain sentry impact sensor

Mon, 9 Sep 2013
Practical impact sensor identifies players who have received hits to the head and should be further evaluated for possible concussion.

Graphene Frontiers awarded $745k NSF grant for ‘roll-to-roll’ graphene production

Thu, 9 Sep 2013
Graphene Frontiers, a Philadelphia-based advanced materials and nanotechnology company, has been awarded a $744,600 grant from the National Science Foundation. The funds will be used to develop roll-to-roll production of graphene.

Alpha and Omega Semiconductor announces resignation of its CFO

Tue, 10 Oct 2013
Alpha and Omega Semiconductor today reported that Mary L. Dotz, its Chief Financial Officer, has announced her resignation in order to pursue other interests.

STMicroelectronics and Movea collaborate to bring ultra-low-power, context-aware motion-recognition platform

Fri, 9 Sep 2013
STMicroelectronics and Movea today announced their agreement to integrate Movea’s SmartMotion technology into the STM32F401 microcontroller operating as a low-power sensor-hub controller.

Micron Technology appoints Thomas Snodgrass as VP of System Solutions

Tue, 10 Oct 2013
Micron Technology, Inc. today announced that the company has named Tom Snodgrass, vice president, System Solutions.

Imec and SPTS partner on advanced nanotechnology applications in BioMEMS

Tue, 10 Oct 2013
SPTS Technologies and imec announced a joint partnership to further advance micro- and nanosized components for BioMEMS.

TowerJazz announces the creation and accreditation of Jazz Semiconductor Trusted Foundry

Wed, 8 Aug 2013

Expands support for the US Aerospace and Defense market in its Newport Beach, CA facility


Stanford and UT Austin professors to be honored at annual SRC TECHCON

Thu, 9 Sep 2013
Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, will honor professors from Stanford University and University of Texas at Austin with awards for chip-related research and education at SRC’s annual TECHCON conference Sept. 9-10.

Emerging MEMS will account for 10% of the value of the total MEMS business by 2018

Thu, 8 Aug 2013
Innovation in MEMS no longer comes solely from new devices, but also from the integration of matu...

Renesas introduces R-Car M2 automotive SoC with increased performance

Thu, 9 Sep 2013
Renesas Electronics Corporation today announced the availability of the R-Car M2 automotive Systems-on-Chip (SoC), designed to address growing integrated dashboard and information device market demands.

Method developed at UT Arlington allows quantitative nanoscopic imaging through silicon

Wed, 10 Oct 2013
A team of scientists from The University of Texas at Arlington and MIT has figured out how to quantitatively observe cellular processes taking place on so-called “lab on a chip” devices in a silicon environment.

CU, MIT breakthrough in photonics could lead to faster electronics

Wed, 10 Oct 2013
A pair of breakthroughs in the field of silicon photonics by researchers at the University of Colorado Boulder, the Massachusetts Institute of Technology and Micron Technology Inc. could allow for the trajectory of exponential improvement in microprocessors that began nearly half a century ago—known as Moore's Law—to continue well into the future, allowing for increasingly faster electronics, from supercomputers to laptops to smartphones.

From smart cars to smart cities: Shaping the future of microelectronics at ITPC 2013

Wed, 10 Oct 2013
Experts in aerospace, automotive, mobile communications, Smart Cities and more join semiconductor leaders to shape the future of microelectronics at the International Technology Partners Conference (ITPC), to be held in Maui, Hawaii, on November 10-13.

STMicroelectronics receives Innovation Management Award for chip manufacturing tech

Wed, 10 Oct 2013
STMicroelectronics announced on Tuesday it has won a prestigious BearingPoint Innovation Management Award for its FD-SOI technology in the "Innovation Ecosystem" category.

InvenSense opens Korean design center

Wed, 10 Oct 2013
InvenSense, Inc., the provider of MotionTracking system on chip devices, announced the opening of a new design center in Seoul, Korea.

AppliedMicro appoints Doug Ahrens as Chief Financial Officer

Wed, 10 Oct 2013
Applied Micro Circuits Corporation, also known as AppliedMicro, today announced it has appointed semiconductor veteran Douglas T. Ahrens to serve as Vice President and Chief Financial Officer.

Intermolecular and Russian nanocenter sign joint development agreement

Fri, 10 Oct 2013
Intermolecular, Inc. and RUSNANO, the Fund for Infrastructure and Educational Programs, today announced the signing of a joint development agreement between Intermolecular and Ulnanotech, the leading Russian Federation nanocenter based in Ulyanovsk.

Nordic Semiconductor launches world’s first concurrent ANT+ and Bluetooth low energy combo chip

Wed, 10 Oct 2013
Ultra low power (ULP) RF specialist Nordic Semiconductor ASA today announces the release of the world's first multi-protocol SoC solution offering concurrent ANT+ and Bluetooth low energy wireless communication natively in a single chip.

With carbon nanotubes, a path to flexible, low-cost sensors

Wed, 9 Sep 2013
Researchers at the Technische Universitaet Muenchen (TUM) are showing the way toward low-cost, industrial-scale manufacturing of a new family of electronic devices.

All ST’s front-end manufacturing sites achieves ISO 50001 energy-management certification

Tue, 10 Oct 2013
STMicroelectronics this week has announced that all six of its front-end manufacturing sites have achieved certification to the latest, most stringent ISO 50001 energy-management standard.

The Internet of Things is poised to change everything, says IDC

Fri, 10 Oct 2013
The Internet of Things represents a new construct in the information and communications technology world that is occupying the minds of IT vendors, service providers, and systems integrators as it represents huge potential for new streams of revenue and new customers.

Lone Japanese semiconductor supplier ranked among top 10 in 1H13

Tue, 8 Aug 2013

Competitive pressures, collapse of vertically integrated business model, increasing "asset-lite" strategies lead to Japan mergers, spinoffs

 


Dow Corning and EV Group to collaborate on temporary bonding materials for 3D-IC

Tue, 9 Sep 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced today that Dow Corning has joined its network of top technology providers to support EVG's LowTemp platform for room-temperature wafer bonding and debonding processes.

Advancing graphene for post-silicon computer logic

Tue, 9 Sep 2013
Team of UC Riverside researchers pioneer new approach for graphene logic circuits.

Sand 9 launches new MEMS timing products

Tue, 9 Sep 2013
Sand 9, Inc. today announced the first MEMS timing products specifically designed to meet the stringent performance, cost, size and reliability requirements of high-volume mobile applications

Electronics advance moves closer to a world beyond silicon

Wed, 9 Sep 2013
Researchers in the College of Engineering at Oregon State University have made a significant advance in the function of metal-insulator-metal, or MIM diodes, a technology premised on the assumption that the speed of electrons moving through silicon is simply too slow.

Next level of MEMS industry development to be examined at SEMICON Europa

Thu, 9 Sep 2013
Driven by value-creating applications in mobile phones, automotive, displays and other systems, the global MEMS industry has grown to over $11 billion in 2012, a 10 percent compound annual average growth rate since 2008.

Collaboration needed on 3D-IC

Thu, 9 Sep 2013
The history of semiconductors has been a history of collaboration. Today, a similar industry-wide collaborative approach to 3D stacked ICs is needed to reach widespread 3D-IC adoption and continue the amazing progress our industry has historically achieved.

STMicroelectronics and X2 Biosystems celebrate shipment of 5,000th concussion sensor system

Fri, 9 Sep 2013
As millions of fall sports participants take to the field to kick off the 2013 sports season, players in a wide range of activities are wearing electronic head-impact monitoring patches developed by X2 Biosystems with advanced technology from STMicroelectronics.

Stanford scientists use DNA to assemble a transistor from graphene

Fri, 9 Sep 2013
DNA is the blueprint for life. Could it also become the template for making a new generation of computer chips based not on silicon, but on an experimental material known as graphene?

Tailored gyroscopes from STMicroelectronics target shake-free images on mobiles and cameras

Tue, 9 Sep 2013
STMicroelectronics has introduced a new family of gyroscopes specifically optimized for optical image stabilization in smartphones and digital still cameras.

New Intel CEO, president talk product plans and future of computing

Tue, 9 Sep 2013
From data centers to ultra-mobile devices such as tablets, phones and wearables, computing segments are undergoing exciting and even game-changing transitions, said new Intel CEO Brian Krzanich during today’s opening session of the Intel Developer Forum.

Bruker announces acquisition of Prairie Technologies

Fri, 9 Sep 2013
Bruker Corporation today announced that it has acquired Prairie Technologies, Inc. (Prairie), a provider of life science fluorescence microscopy products.

Researchers demonstrate 'accelerator on a chip'

Fri, 9 Sep 2013
Technology could spawn new generations of smaller, less expensive devices for science, medicine

MediaTek and Imagination expand partnership

Fri, 9 Sep 2013
Imagination Technologies has signed a further license agreement with MediaTek Inc., a fabless semiconductor company for wireless communications and digital multimedia solutions.

Spansion licenses ARM processor technology to power embedded systems

Mon, 9 Sep 2013
Spansion Inc. today announced it has licensed a wide range of ARM processors for its current and future product lineup aimed at embedded applications in the automotive, industrial and consumer markets.

Graphene photodetector integrated into a computer chip

Mon, 9 Sep 2013
Both academia and the industry have high hopes for graphene. The material, which consists of a single layer of hexagonally arranged carbon atoms, has extraordinary properties.

Leading-edge technology to be responsible for 2013 increase in pure-play foundry sales

Tue, 9 Sep 2013
TSMC forecast to sell $6.33 billion worth of ≤28nm devices this year, a 3x increase over 2012.

Sensors market for automotive applications worth $33.59 billion by 2022

Wed, 9 Sep 2013
The total automotive sensor market is expected to reach $33.59 billion by 2022 at a CAGR of 7.8 percent.

STMicroelectronics chip controls Pebble Smartwatch

Wed, 9 Sep 2013
STMicroelectronics announced this week that its STM32 microcontroller is the brain controlling the innovative Pebble Smartwatch for iPhone and Android.

ASMC 2014 offers opportunity for presenters

Thu, 11 Nov 2013
SEMI announced today that the deadline for presenters to submit an abstract for the 25th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 28.

Intersil appoints Roger Wendelken as senior VP of worldwide sales

Tue, 10 Oct 2013
Intersil Corporation, a provider of innovative power management and precision analog solutions, today announced the appointment of Roger Wendelken as senior vice president of worldwide sales effective immediately.

MEMS Technology Showcase finalists highlight “MEMS Inside the Machine”

Thu, 10 Oct 2013
MEMS Technology Showcase will give MEMS Executive Congress US attendees an intimate look at some of the most unique and inspiring MEMS-enabled applications in the business. After a competitive application process, MEMS Industry Group (MIG) has selected five finalists that show how MEMS enhances the consumer experience, highlighting the “MEMS inside the machine.”

UK photonics industry must connect higher in the value chain

Wed, 10 Oct 2013
Carlos Lee, Director General of the European Photonics Industry Consortium (EPIC), moderated a discussion with executives from the UK photonics industry and filed this report.

SRC launches synthetic biology research for novel semiconductor applications

Wed, 10 Oct 2013
Research at six universities including MIT, University of Massachusetts at Amherst, Yale, Georgia Tech, Brigham Young and Washington

Imec and John Hopkins University team to expand healthcare applications for silicon nanotech

Thu, 10 Oct 2013
Researchers and physicians at Johns Hopkins University will collaborate with the nanoelectronics R&D center imec to advance silicon applications in healthcare, beginning with development of a device to enable a broad range of clinical tests.

MEMS devices for biomedical applications

Mon, 10 Oct 2013
Dr. Ramesh Ramadoss, Senior Manager in the MicroProbe Product Group of FormFactor Inc., provides an overview of MEMS and highlights a variety of applications in the biomedical area, including pressure sensors, inertial sensors, transducers for hearing aids, microfluidics for diagnostics and drug delivery, micromachined needles and microsurgical tools.

EV Group ships lithography system to Micronit for lab-on-chip MEMS device production

Mon, 10 Oct 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has delivered an EVG 6200 semi-automated mask alignment system to Micronit, a manufacturer of lab-on-a-chip products used in life sciences applications, such as molecular diagnostics and point-of-care, as well as micro-processed glass substrates for MEMS applications.

InvenSense introduces first MotionTracking SoC for Google's KitKat 4.4

Fri, 11 Nov 2013
InvenSense, Inc., the provider of MotionTracking system on chip devices, announced the 6-axis MPU-6515 MEMS SoC .

Defective nanotubes turned into light emitters

Fri, 11 Nov 2013
UPV/EHU-University of the Basque Country researchers have developed and patented a new source of light emitter based on boron nitride nanotubes and suitable for developing high-efficiency optoelectronic devices.

New techniques produce cleanest graphene yet

Fri, 11 Nov 2013
Columbia Engineers develop new device architecture for 2D materials, making electrical contact from the 1D edge.

SUNY Nanocollege and Albany Law School partner to create nanotech education program

Tue, 11 Nov 2013
‘Ecosystem for Nanotechnology, Entrepreneurship and Law’ (eNTEL) will provide unmatched student experience as launch pad for development of startup companies and attraction of business investment.

Plastic Electronics Conference to rotate between Dresden and Grenoble beginning in 2014

Thu, 11 Nov 2013
SEMI, the global trade organization representing the nano- and micro-electronic manufacturing supply chains, today announced that next year’s Plastic Electronics Conference (PE2014) will be held in Grenoble, France and alternate with Dresden, Germany in future years to better address pan-European opportunities and challenges in Plastic Electronics.

Toshiba starts shipments of CMOS image sensor for automotive view cameras

Mon, 11 Nov 2013
Toshiba Corporation today announced that started sample shipments of a VGA, 1/4 inch CMOS image sensor, “TCM5126GBA,” for automotive view cameras.

STMicroelectronics, Memoir Systems combine breakthrough memory, semiconductor process technologies

Thu, 11 Nov 2013
Efforts make embedded memory faster, cooler and simpler.

MIG honors STMicroelectronics with three different awards

Mon, 11 Nov 2013
STMicroelectronics has been selected by MEMS Industry Group and affiliated voters as the Company of the Year for its continuing success in growing its MEMS business, expanding its product line, and demonstrating industry leadership and vision.

Annual MEMS Executive Conference shows why MEMS is growing 2x faster than semiconductors

Fri, 11 Nov 2013
MEMS Industry Group (MIG)'s MEMS Executive Congress -- held November 7-8, 2013 in Napa, CA -- showed why the MEMS industry is outpacing the semiconductor industry, in both growth and innovation.

Taking a new look at carbon nanotubes

Fri, 11 Nov 2013
Despite their almost incomprehensibly small size – a diameter about one ten-thousandth the thickness of a human hair – single-walled carbon nanotubes come in a plethora of different “species,” each with its own structure and unique combination of electronic and optical properties.

Imagination unveils industry's most scalable image signal processing architecture

Mon, 11 Nov 2013
Imagination Technologies announces a ground-breaking new camera Image Signal Processing (ISP) architecture codenamed 'Raptor.'

EV Group introduces non-contact lithography system

Tue, 11 Nov 2013
Leveraging EVG's expertise in photolithography, the EVG PHABLE system incorporates a unique contactless lithography mask-based approach that enables full-field, high-resolution and cost-efficient micro- and nanopatterning of passive and active photonic components, such as patterned structures on light emitting diode (LED) wafers, in high-throughput production environments.

SUSS MicroTec installs excimer laser stepper at Fraunhofer IZM Berlin

Wed, 11 Nov 2013
SUSS MicroTec has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin.

Will MEMS applications be the driver for future growth of thin film PZT?

Thu, 11 Nov 2013
In September 2013, EPSON announced its next generation inkjet technology, PrecisionCore, introducing for the first time MEMS inkjet heads manufactured with thin film PZT technology. This announcement has been highly publicized: first, thin film PZT MEMS applications are now on the market, proving the reliability and maturity of this technology. Second, more inkjet head players will soon follow.

STMicroelectronics boosts safety, reliability and efficiency of industrial-automation systems

Thu, 11 Nov 2013
STMicroelectronics announced that it is launching its new ISO8200B, an innovative isolated power switch that enables smaller, more robust and energy-efficient controllers for industrial automation equipment.

Open-Silicon and GLOBALFOUNDRIES demonstrate custom 28nm SoC using 2.5D technology

Thu, 11 Nov 2013
Open-Silicon, Inc., and GLOBALFOUNDRIES today announced the industry’s first demonstration of a functional system-on-chip (SoC) solution featuring two 28nm logic chips, with embedded ARM processors, connected across a 2.5D silicon interposer.

Unraveling the mind-body connection with power-efficient IC chip

Fri, 11 Nov 2013
Despite the advances in neuroscience research, the human brain remains a complex puzzle with questions unanswered on how it controls human behaviour, cognitive functions and movements.

Next-generation Leti magnetometers on board Swarm satellites

Fri, 11 Nov 2013
CEA-Leti’s next-generation magnetometer technology was launched into space today on board the European Space Agency’s three Swarm satellites to collect unprecedented detail about the Earth’s magnetic field.

Multitest ships first MEMS tri-temp solution for 3+2 axis magnetic test and calibration

Mon, 11 Nov 2013
Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that its solution for 3-axis magnetometer plus 2-axis low g-test and calibration fully supports the technical features of today’s advanced 3D hall sensors.

Leti announces MEMS research collaboration with OMRON

Wed, 11 Nov 2013
CEA-Leti today announced a development agreement that will utilize Leti’s deep MEMS expertise and leading-edge infrastructure with OMRON, a global leader in factory automation and control solutions for the transportation, healthcare and consumer-goods industries.

STMicroelectronics reveals advanced MEMS accelerometers

Tue, 12 Dec 2013
Innovative design boosts the sensor's thermal and mechanical stability to deliver robust high performance in ultra space-saving footprint.

EV Group introduces full-field UV nanoimprint lithography system

Tue, 12 Dec 2013
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 720 automated UV nanoimprint lithography (UV-NIL) system.

Lab school brings manufacturing technologies to middle-school classrooms

Tue, 12 Dec 2013
A partnership among the University of Virginia's (UVa) Schools of Education and Engineering and the Charlottesville Public Schools has led to the launch of Buford Engineering Design Academy, a laboratory school for advanced manufacturing.

Architecture from STMicroelectronics leads industry transition to 64-bit computing

Mon, 1 Jan 2014
STMicroelectronics has released details of its STi8K architecture addressing future Systems-on-Chips (SoCs).

STMicroelectronics imaging technology helps visually impaired

Wed, 12 Dec 2013
STMicroelectronics announced that its 5.1 mega-pixel camera module and low-power digital image processor are being used in the revolutionary OrCam camera, a small device that clips on to eyeglasses and dramatically improves the mobility and ability of visually-impaired people to "read" signs, packaging and publications.

Growing interest in the physics of nanostructures to drive demand for thin films

Fri, 12 Dec 2013
GIA invites senior industry executives, domain experts, technologists and market strategists to participate in a comprehensive global research initiative studying the “Thin Films” markets.

STMicroelectronics launches new advanced energy-harvesting IC

Tue, 12 Dec 2013
STMicroelectronics is opening new avenues for energy-harvesting applications with its latest IC integrating all the functions needed to power electronic circuits and recharge batteries using either a solar cell or Thermo-Electric Generator (TEG).

SEMICON West “Call for Papers” for New Semiconductor Technology Symposium, Science Park and TechXPOTs

Tue, 12 Dec 2013
SEMI today announced a “Call for Papers” for the new Semiconductor Technology Symposium, the popular TechXPOT programs, and a new Science Park program featuring university research and advanced R&D subjects at SEMICON West, North America’s premier microelectronics event, to be held July 8-10 at the Moscone Center in San Francisco, Calif.

#4: Monolithic 3D Chip

Tue, 12 Dec 2012

#1: Triangular MOSFETs with InGaAs Channels

Tue, 12 Dec 2012

#2: Thermally Stable Magnetic Tunnel Junction Memory

Tue, 12 Dec 2012

#3: TSMC’s Integrated 16nm FinFET Technology Platform

Tue, 12 Dec 2012

#5: Nanofluidic Channels for Lab-on-Chip

Tue, 12 Dec 2012

#6: Novel Nanopore Sensor for DNA Sequencing

Tue, 12 Dec 2012

#7: Hybrid Nanowire/CMOS Biosensor

Tue, 12 Dec 2012

#8: 300mm wafer-scale Ge FinFET

Tue, 12 Dec 2012

#9: Record Silicon Nanowire MOSFETs

Tue, 12 Dec 2012

#10: Visualizing CBRAM Filaments

Tue, 12 Dec 2012

#11: Fastest Ge p-MOSFET

Tue, 12 Dec 2012

Slideshow: IEDM 2013 Highlights

Wed, 12 Dec 2013
This week, industry leaders and experts have gathered in Washington D.C. at the 59th annual IEEE International Electron Device Meeting (IEDM) conference.

Graphene-based nano-antennas may enable networks of tiny machines

Thu, 12 Dec 2013
Networks of nanometer-scale machines offer exciting potential applications in medicine, industry, environmental protection and defense, but until now there's been one very small problem: the limited capability of nanoscale antennas fabricated from traditional metallic components.

Low-power tunneling transistor for high-performance devices at low voltage

Thu, 12 Dec 2013
A new type of transistor that could make possible fast and low-power computing devices for energy-constrained applications such as smart sensor networks, implantable medical electronics and ultra-mobile computing is feasible, according to Penn State researchers.

SPTS named Supplier of the Year at the Annual MEMS Executive Congress

Mon, 12 Dec 2013
SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, was named MEMS Supplier of the Year at the MEMS Executive Congress U.S. 2013 held in Napa last month

Samsung announces Gregory Lee as President and CEO of Samsung Electronics North America headquarters

Mon, 12 Dec 2013
Samsung Electronics Co., Ltd. announced the appointment of Gregory Lee as President of the North America Headquarters in addition to his role as President of Samsung Telecommunications America (STA) effective immediately.

SAMCO unveils deep silicon etching system for MEMS and TSV production processing

Wed, 12 Dec 2013
The RIE-800iPBC is the latest in SAMCO's etching system lineup, and was officially introduced by SAMCO at SEMICON Japan 2013 (the world's largest exhibition for semiconductor equipment and materials), held in Tokyo from December 4-6, 2013.

Intel ends 2013 with a bang

Wed, 12 Dec 2013
ABI Research verified that Intel has a leading position in the mobile processor technology race; launching the first 22nm mobile application processor.

STMicroelectronics joins ARM mbed Project

Thu, 12 Dec 2013
ARM, a semiconductor supplier, and STMicroelectronics today announced that ST has joined the ARM mbed Project.

Penn researchers grow liquid "flowers" that can be used as lenses

Mon, 12 Dec 2013
A team of material scientists, chemical engineers and physicists from the University of Pennsylvania has made another advance in their effort to use liquid crystals as a medium for assembling structures.

STMicroelectronics reveals 9-axis movement/position sensor

Tue, 1 Jan 2014
STMicroelectronics has revealed its most advanced module for 9-axis movement and position sensing in next-generation mobiles and tiny wearable devices.

Oxford Instruments shares expertise with nanotechnology researchers in India

Tue, 1 Jan 2014
Oxford Instruments has just completed its second series of successful and well attended seminars in India following its first in Bangalore in 2012.

New optical image stabilization gyroscope from STMicroelectronics targets tiny smartphones and cameras

Wed, 1 Jan 2014
STMicroelectronics has introduced a new 2-axis gyroscope specifically optimized for optical image stabilization in smartphones and digital still cameras.

TOWA launches new Packaging Development Center

Thu, 1 Jan 2014
The TOWA Corporation of Japan, a supplier of packaging equipment for semiconductor, electronics and LED industries, has decided to expand their activities in Europe with an Innovation Center for Packaging Development and announced the launch of TOWA Europe B.V.

Yole Développement addresses MEMS sensor challenges at January technology seminar

Thu, 1 Jan 2014
Yole Développement will host a MEMS & Imaging Technology Seminar in Korea on January 16, 2014.

"Crisis? What Crisis?": New paradigm adjustments for capacity and equipment spending

Thu, 1 Jan 2014
Worldwide, the semiconductor industry growth rate back in 1973 was about 30 percent and slipped into 1975 with negative sales growth rates.

1) Samsung displays Smart Home service

Sun, 1 Jan 2010

Slideshow: CES 2014 Highlights

Fri, 1 Jan 2014
This week in Las Vegas, the 2014 International Consumer Electronics Show focused on the Internet of Things, displaying many connected gadgets and services.

2) Bosch showcases a world of connected devices enabled by MEMS

Sun, 1 Jan 2010

4) Broadcom displays connected-home technology

Sun, 1 Jan 2010

7) MEMSIC announces wearable connected watch kit

Sun, 1 Jan 2010

8) Entropic and NAGRA to integrate SoC for set-top boxes

Sun, 1 Jan 2010

The cyborgs era has started

Mon, 1 Jan 2014
They are known from science fiction novels and films – technically modified organisms with extraordinary skills, so-called cyborgs.

Nano-capsules show potential for more potent chemoprevention

Mon, 1 Jan 2014
Researchers at the Winship Cancer Institute of Emory University have discovered a more effective drug delivery system using nanotechnology that could one day significantly affect cancer prevention.

Imec celebrates 30 years

Tue, 1 Jan 2014
Nanotechnology research and development center imec, today announced the celebration of its 30th anniversary.

STMicroelectronics reveals industry's best connected STM32 F0 microcontrollers

Thu, 1 Jan 2014
STMicroelectronics has extended its STM32 F0 microcontrollers based on the ARM Cortex-M0 core with new models that support crystal-less USB design, accurate sensing and smart power management for next-generation smart devices and connectivity products.

Natural 3D counterpart to graphene discovered

Tue, 1 Jan 2014
The discovery of what is essentially a 3D version of graphene promises exciting new things to come for the high-tech industry, including much faster transistors and far more compact hard drives.

Semiconductors that detect cancer

Thu, 1 Jan 2014
As exciting as it is to watch the semiconductor industry push to sub-10nm dimensions, 450mm wafers, finFETs, 3D ICs and the like, what’s even cooler is the potential of semiconductor technology to make a real difference in medicine.

Can we keep on benefiting from Moore’s Law?

Thu, 1 Jan 2013
For almost five decades, performance improvements and cost reduction of ICs have been cornerstones of the growth of the semiconductor industry.

2014 Outlook: An era of unprecedented change

Fri, 1 Jan 2014
We asked leading industry experts and analysts to give us their perspectives on what we can expect in 2014.

Cyclical upturn continues in 2014: Positive yet cautious expectations persist

Thu, 1 Jan 2013
In 2013, the IC industry emerged from a difficult 5-year period of minimal growth and started on its next cyclical upturn, a welcome piece of news.

Outlook for semiconductors and the value chain in 2014

Thu, 1 Jan 2013
We approach 2014 with a combination of positive policy, financial, and economic forces that will push world growth up to a +3% range.

Coming year promises increased capital spending and continued need for effective industry collaboration

Thu, 1 Jan 2013
For most of the past 15 years, the industry has displayed a fairly predictable pattern of fab equipment spending, characterized generally by two years of decline followed by two years of positive growth.

The shift to materials-enabled 3D

Thu, 1 Jan 2013
Innovations in mobile computing and communications will continue to be a driving factor for the semiconductor equipment industry.

Innovation and collaboration key in 2014

Thu, 1 Jan 2013
As far as the outlook goes for 2014-2015, investments coming from the semiconductor and microelectronics industries are going to be pretty robust.

Key market and technology trends in the sub-20nm era

Thu, 1 Jan 2013
Keeping up with Moore’s Law has always required significant investment and ingenuity, and this era brings additional challenges in device structures, materials and methodologies.

2014 outlook: MEMS on the rise

Thu, 1 Jan 2013
Looking at the global MEMS market, industry experts are predicting double-digit device growth in the next three to five years.

Keys to success: Testing in the New Mobile World

Thu, 1 Jan 2013
The semiconductor industry is moving from a PC-centric, digital era to a communication and mobile world.

Book-to-bill ratio continues to improve

Fri, 1 Jan 2014
The December three-month average bookings were at the highest level since June 2012 — a positive sign for the 2014 spending outlook.

Slimpin promoted to director in SwRI’s Applied Physics Division

Tue, 1 Jan 2014
David G. Slimpin has been promoted to director of the Electronics Systems and Robotics Department in the Applied Physics Division at Southwest Research Institute (SwRI). He was previously a program manager in the department.

MEMS Industry Group explores the “MEMS-enabled Life” at MEMS Executive Congress Europe 2014

Tue, 1 Jan 2014
MEMS Industry Group (MIG) will host its third annual MEMS Executive Congress® Europe, 11 March, 2014 in Munich, Germany.

New "photodetector" nanotechnology allows photos in near darkness

Wed, 1 Jan 2014
Dark and blurry low light photos could soon be a thing of the past, thanks to the development of game-changing ultrathin “nanosheets,” which could dramatically improve imaging technology used in everything from cell phone cameras, video cameras, solar cells, and even medical imaging equipment such as MRI machines.

Presto and DelfMEMS collaborate to design ultra fast RF MEMS test solution

Thu, 1 Jan 2014
Presto Engineering, Inc. and DelfMEMS announced today that they have worked together to design, from specification to integration, the first full PXI-based test system for ultra-fast characterization testing of radio frequency (RF) micro-electro-mechanical-systems (MEMS).

2014 capital spending up in Korea; SEMICON Korea to address mobile innovation

Fri, 1 Jan 2014
With Korea expected to be the second largest region for fab construction spending in 2014, industry leaders will convene at SEMICON Korea 2014 in Seoul on February 12-14 to discuss the latest trends and technologies shaping the future of microelectronics manufacturing.

Element Six's synthetic diamond proven as viable material for sophisticated optical components

Mon, 2 Feb 2014
Element Six, a developer of synthetic diamond supermaterials and member of the De Beers Group of Companies, today presented new data and announced that its high purity single crystal chemical vapor deposition (CVD) diamond material has been proven for use in intracavity cooling of disc lasers and in development of the first ever tunable diamond Raman laser system.

"MEMS and NEMS processing advances" discussed at IEMN, Lille, France workshop on 8th April 2014

Mon, 2 Feb 2014
"Nanoscale Processing for NEMS and MEMS" is the topic for the next Oxford Instruments technical workshop, being hosted in conjunction with the Institute of Electronics Micro-electronics and Nanotechnology (IEMN) in Lille, France on 8th April 2014.

Entegris to acquire ATMI

Tue, 2 Feb 2014
Entegris, Inc. and ATMI today announced Entegris will acquire ATMI for approximately $1.15 billion, or approximately $850 million net of cash acquired, including the net cash proceeds from the sale of ATMI’s LifeSciences business of $170 million.

Capturing ultrasharp images of multiple cell components at once

Tue, 2 Feb 2014
A new microscopy method could enable scientists to generate snapshots of dozens of different biomolecules at once in a single human cell, a team from the Wyss Institute of Biologically Inspired Engineering at Harvard University reported Sunday in Nature Methods.

Ballistic transport in graphene suggests new type of electronic device

Thu, 2 Feb 2014
Using electrons more like photons could provide the foundation for a new type of electronic device that would capitalize on the ability of graphene to carry electrons with almost no resistance even at room temperature – a property known as ballistic transport.

Intel elects five new corporate vice presidents

Thu, 2 Feb 2014
Intel Corporation today announced that its board of directors elected five new corporate vice presidents.

Executives debate innovation drivers and cost reduction in microelectronics supply chain

Thu, 2 Feb 2014
The closing Executive Panel discussion at the SEMI Industry Strategy Symposium on January 15 provoked diverse views on the drivers and future of innovation in the microelectronics manufacturing supply chain.

CEA-Leti announces the launch of PIEZOMAT

Tue, 2 Feb 2014
CEA-Leti today announced the launch of PIEZOMAT, a research project funded by the European Commission to design and implement a new technology of fingerprint sensor that enables ultra-high resolution reconstruction of the smallest features of human fingerprints.

Chips that listen to bacteria

Tue, 2 Feb 2014
A research team led by Ken Shepard, professor of electrical engineering and biomedical engineering at Columbia Engineering, and Lars Dietrich, assistant professor of biological sciences at Columbia University, has demonstrated that integrated circuit technology, the basis of modern computers and communications devices, can be used for a most unusual application—the study of signaling in bacterial colonies.

Intermolecular and Guardian Industries expand collaboration

Tue, 2 Feb 2014
Intermolecular, Inc. and Guardian Industries announced today the expansion and extension of their collaborative development program and strategic IP licensing agreement.

Fujitsu Labs and imec develop wireless transceiver technology for medical devices

Wed, 2 Feb 2014
Fujitsu Laboratories Ltd. and imec Holst Centre today announced that they have developed a wireless transceiver circuit for use in body area networks (BAN) for medical applications that adheres to the 400 MHz-band international standard.

Imec and Holst Centre demonstrate low-power ECG-acquisition chip at ISSCC 2014

Wed, 2 Feb 2014
At this week’s International Solid State Circuits Conference (ISSCC2014), imec and Holst Centre, together with Olympus, demonstrated a low-power single channel implantable electrocardiography (ECG) acquisition chip with analog feature extraction, which enables precise monitoring of the signal activity in a selected frequency band.

SPTS Technologies opens new office in Korea

Thu, 2 Feb 2014
SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets today announced the opening of a new office in Korea.

Breakthrough development in 1D-1R memory cell array

Tue, 2 Feb 2014
Dr. Tae-Wook Kim at KIST announced their successful development of a 64-bit memory array using flexible and twistable carbon nano material and organo-polymer compound, which can accurately store and delete data.

World's first 79 GHz radar transmitter in 28nm CMOS

Tue, 2 Feb 2014
Imec, in collaboration with Vrije Universiteit Brussel, Brussels, Belgium, presents the world’s first 79 GHz radar transmitter implemented in plain digital 28nm CMOS.

Avantor Performance Materials names Jean-Paul Mangeolle to Board of Directors

Wed, 2 Feb 2014
Avantor Performance Materials, a global manufacturer and supplier of high-performance chemistries, announces the appointment of Jean-Paul Mangeolle to its Board of Directors.

2014 SPIE Startup Challenge winners announced

Thu, 2 Feb 2014
A microscope in a needle, a handheld device that prescribes corrective eyeglasses, and a device for heart attack diagnosis are winning projects in the 2014 SPIE Startup Challenge.

Single chip device to provide real-time 3-D images from inside the heart and blood vessels

Thu, 2 Feb 2014
Researchers have developed the technology for a catheter-based device that would provide forward-looking, real-time, three-dimensional imaging from inside the heart, coronary arteries and peripheral blood vessels.

Samsung and UCSF partner to accelerate new innovations in preventive health technology

Fri, 2 Feb 2014
Samsung Electronics Co., Ltd., and the University of California, San Francisco (UCSF) announced a partnership to accelerate validation and commercialization of promising new sensors, algorithms, and digital health technologies for preventive health solutions.

Call for Papers open for SEMICON Europa 2014, Plastics Electronics Conference

Mon, 2 Feb 2014
SEMI announced the “Call for Papers” for technical sessions and presentations for SEMICON Europa 2014 which takes place October 7-9 in Grenoble, France.

New SEMICON Europa in Grenoble to emphasize innovation and applications

Mon, 3 Mar 2014
SEMICON Europa, the region’s largest event for the microelectronics manufacturing and innovation supply chain, will be held 7-9 October 2014 in Grenoble.

Failure analysis and the innovative pinpoint conductive AFM

Tue, 3 Mar 2014
One of the most challenging issues in the semiconductor industry is the failure analysis (FA) investigation of devices with enduringly shrinking geometries down to single digit nanometer trench widths.

How 19th century physics could change the future of nanotechnology

Tue, 3 Mar 2014
A new twist on a very old physics technique could have a profound impact on one of the most buzzed-about aspects of nanoscience.

Researchers at UC study zero-dimensional quantum dots

Tue, 3 Mar 2014
Zero-dimensional quantum dots identified by University of Cincinnati researchers could someday have a big effect on a variety of technologies, such as solar energy, lasers and medical diagnostics.

Multitest ships fully integrated test cell for pressure sensor application

Wed, 3 Mar 2014
Early this year, Multitest shipped the first fully integrated test cell for a pressure sensor application consisting of handling systems, ATE and contactors including the pressure unit.

Global failure analysis equipment market to grow at CAGR of 8.8% from 2013 to 2019

Wed, 3 Mar 2014
Rapid growth in nanotechnology coupled with growth in medical applications in the Asia Pacific region has fueled the growth of failure analysis equipment market.

Fab equipment spending to increase 20-30% in 2014

Thu, 3 Mar 2014
The release today of the SEMI World Fab Forecast update reveals a 20 to 30 percent projected increase in semiconductor fab equipment spending in 2014.

Weaker yen impact on the 2013 material and equipment market size

Thu, 3 Mar 2014
Semiconductor industry revenues reported by the World Semiconductor Trade Statistics (WSTS) reached a record high in 2013 with global revenues totaling over $305 million.

Squeezing light into metals

Fri, 3 Mar 2014
Using an inexpensive inkjet printer, University of Utah electrical engineers produced microscopic structures that use light in metals to carry information.

New innovation could mean eye injections are a thing of the past

Fri, 3 Mar 2014
Drugs used to treat blindness-causing disorders could be successfully administered by eye drops rather than unpleasant and expensive eye injections, according to new research led by UCL scientists that could be a breakthrough for the millions worldwide suffering from age-related macular degeneration (AMD) and other eye disorders.

Scientists build thinnest-possible LEDs to be stronger, more energy efficient

Mon, 3 Mar 2014
As devices get smaller and faster, there is more demand for such semiconductors that are tinier, stronger and more energy efficient.

Akustica's newest MEMS microphone targets smartphones and wearables

Tue, 3 Mar 2014
Akustica, Inc., a Bosch Group company and provider of MEMS microphones, has added four new high-performance analog microphones to its high definition (HD) voice product line, including the AKU346, the industry’'s smallest MEMS microphone to achieve 64dB SNR.

Bending light with a tiny chip

Tue, 3 Mar 2014
The Caltech chip eliminates the need for bulky and expensive lenses and bulbs and instead uses a so-called integrated optical phased array (OPA) to project the image electronically with only a single laser diode as light source and no mechanically moving parts.

EV Group boosts 2.5D and 3D IC/TSV performance with new NanoSpray application

Wed, 3 Mar 2014
EV Group today announced that its patented NanoSpray conformal coating technology is now available on its newly introduced EVG150XT resist coating and developing system for high-volume manufacturing (HVM) semiconductor applications.

Advancing the Russian microelectronics industry — SEMICON Russia 2014

Wed, 3 Mar 2014
On May 13-15, the key industry players, science institutes and innovation business representatives will gather in Moscow at SEMICON Russia — the premier Russian semiconductor exhibition and conference.

Eveon and Leti mark milestone in fabrication of smart bolus-type micro-pump for drug delivery

Thu, 3 Mar 2014
Eveon and CEA-Leti today announced the demonstration of liquid-pumping for smart drug delivery in the bolus mode using a silicon-based micro-pump fabricated with a standard MEMS process.

Silicon Innovation Forum to expand in 2014

Thu, 3 Mar 2014
Coordinated by SEMI, the Silicon Innovation Forum is organized by leading strategic investment groups in the global semiconductor industry including: Applied Ventures, Dow Ventures, Intel Capital, Micron Ventures, TEL Venture Capital, BASF Ventures, and Samsung Ventures.

Top ten MEMS startup Qualtré secures $8M strategic round

Mon, 3 Mar 2014
Qualtré, Inc., a developer of next generation silicon MEMS inertial sensors, announced today that it has finalized an $8 million Series C strategic round of investment from a new strategic investor and from Matrix Partners and Pilot House Ventures, contributors to Qualtré’s previous rounds.

EV Group establishes China headquarters in Shanghai

Tue, 3 Mar 2014
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has opened a new, wholly owned subsidiary in Shanghai, called EV Group China Ltd.

6 and 9-axis DOF sensors are creating a new paradigm in the combos business

Tue, 3 Mar 2014
Over the last years, inertial MEMS have been subject to dramatic market & technological evolution. This has been driven by a large increase of the consumer market.

Enabling mobility for IoT with advanced semiconductor technology - at SEMICON Singapore 2014

Thu, 3 Mar 2014
SEMICON Singapore will focus on the advanced technology developments to enable mobility for the Internet of Things (IoT).

Mentor Graphics acquires Berkeley Design Automation

Fri, 3 Mar 2014
Mentor Graphics Corp. today announced that it has acquired Berkeley Design Automation, Inc. BDA addresses nanometer circuit design challenges via its Analog FastSPICE unified verification platform and exceptional vertical-application expertise.

InvenSense and Sonion announce MEMS microphone development alliance

Fri, 3 Mar 2014
InvenSense, Inc. and Sonion today announced a strategic alliance in which the two parties will cooperate in the development of MEMS microphones and related technologies for use in a broad range of hearing applications.

Fabricating nanostructures with silk could make clean rooms green rooms

Tue, 4 Apr 2014
Tufts University engineers have demonstrated that it is possible to generate nanostructures from silk in an environmentally friendly process that uses water as a developing agent and standard fabrication techniques.

MEMS microphone market to grow at 13% CAGR, reaching $1.65B by 2019

Wed, 4 Apr 2014
MEMS microphone market has been growing since its first appearance in 2003. The huge worldwide adoption of smartphones, each using more than one MEMS microphone, creates the wide integration and rocketing growth of the MEMS microphone market.

The sustainable manufacturing imperative

Thu, 4 Apr 2014
While sometimes seen as a social, legal and regulatory obligation, sustainability is increasingly considered a differentiating factor in global competitiveness relative to the technologies and products being provided.

2013: A year in review

Fri, 4 Apr 2014
2013 was a record year in terms of semiconductor device revenues; the industry finally exceeded the long elusive $300 billion mark, registering almost 5 percent growth according to the SIA.

MEMS microphones broadcast strong growth

Fri, 4 Apr 2014
Global revenue for MEMS microphones is forecast to reach $1.04 billion this year, up a robust 24 percent from $836.9 million in 2013.

SEMI announces Innovation Village at SEMICON Europa 2014

Wed, 4 Apr 2014
After the successful premier of a program to connect early-stage companies with strategic investors and venture capitalists (VCs) in the U.S., SEMI is expanding the program to Europe as part of SEMICON Europa 2014 in Grenoble, France (October 7-9).

New "switch" could power quantum computing

Thu, 4 Apr 2014
A light lattice that traps atoms may help scientists build networks of quantum information transmitters.

Scalable CVD process for making 2-D molybdenum diselenide

Thu, 4 Apr 2014
Nanoengineering researchers at Rice University and Nanyang Technological University in Singapore have unveiled a potentially scalable method for making one-atom-thick layers of molybdenum diselenide — a highly sought semiconductor that is similar to graphene but has better properties for making certain electronic devices like switchable transistors and light-emitting diodes.

Domain walls in nanowires cleverly set in motion

Thu, 4 Apr 2014
Important prerequisite for the development of nano-components for data storage and sensor technology.

Catching the (invisible) wave

Fri, 4 Apr 2014
UC Santa Barbara researchers create a unique semiconductor that manipulates light in the invisible infrared/terahertz range, paving the way for new and enhanced applications.

Global scientific team "visualizes" a new crystallization process

Thu, 4 Apr 2014
Sometimes engineers invent something before they fully comprehend why it works. To understand the "why," they must often create new tools and techniques in a virtuous cycle that improves the original invention while also advancing basic scientific knowledge.

SEMI announces 2nd Vietnam Semiconductor Strategy Summit

Fri, 4 Apr 2014
Following the successful inaugural event in 2013, the 2nd annual SEMI Vietnam Semiconductor Strategy Summit will be held September 16-17, 2014 at the InterContinental Asiana Saigon Hotel in Ho Chi Minh City.

High-performance, low-cost ultracapacitors built with graphene and carbon nanotubes

Tue, 4 Apr 2014
By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University's Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost.

New technology symposium at SEMICON West 2014 to spotlight critical issues in semiconductor manufacturing

Tue, 4 Apr 2014
The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format.

imec reports 4 percent growth in 2013 fiscal year

Thu, 4 Apr 2014
Revenue for 2013 totaled 332 million euro, a four percent growth from the previous year.

SEMICON Southeast Asia to be launched in 2015

Fri, 4 Apr 2014
Recognizing the changing dynamics of the microelectronics industry in Southeast Asia, SEMI today announced the expanded scope of its industry-leading SEMICON regional exposition which will now rotate between Singapore and other locations within Southeast Asia.

How to create nanowires only 3 atoms wide with an electron beam

Tue, 4 Apr 2014
Junhao Lin, a Vanderbilt University Ph.D. student and visiting scientist at Oak Ridge National Laboratory (ORNL), has found a way to use a finely focused beam of electrons to create some of the smallest wires ever made.

Noel Technologies names Siavash Parsa Director of Technology

Thu, 5 May 2014
Noel Technologies, a Silicon Valley specialty foundry offering process development and substrate fabrication, has added semiconductor industry veteran Siavash Parsa to its growing management staff.

Sensor hubs make big gains while enabling the future of sensing

Wed, 4 Apr 2014
Sensor hubs that offload tasks from power-hungry application processors and let mobile devices like smartphones and tablets run longer on a single battery charge are reaping gargantuan gains thanks to the global microelectromechanical systems (MEMS) market

Abracon announces relaunch of its MEMS oscillators series

Thu, 5 May 2014
Abracon’s miniature ASCSM series was originally launched in 2013 and is being relaunched in June 2014 with the incorporation of enhanced production processes, which further reduce manufacturing costs. The ASCSM devices with an LVCMOS output from 1MHz to 156.25MHz will be available through Abracon beginning in June 2014.

New lab-on-a-chip device overcomes miniaturization problems

Thu, 5 May 2014
UNSW Australia chemists have invented a new type of tiny lab-on-a-chip device that could have a diverse range of applications, including to detect toxic gases, fabricate integrated circuits and screen biological molecules.

An edgy look at 2D molybdenum disulfide

Thu, 5 May 2014
Berkeley Lab researchers observe 1D edge states critical to nanoelectronic and photonic applications.

Minneapolis Heart Institute implants its first world's smallest pacemaker

Mon, 5 May 2014
The Minneapolis Heart Institute Foundation (MHIF) today announced its first implant of the world’s smallest pacemaker: the Medtronic Micra Transcatheter Pacing System (TPS) in the Midwest. The device was implanted by Dr. Charles Gornick as part of the global pivotal clinical trial.

Graphene for real-world devices

Tue, 5 May 2014
New research in phonon scattering sheds more light on graphene as a replacement for silicon.

First quarter semiconductor trends and update

Thu, 5 May 2014
Given the slow economic growth in the U.S. during the first quarter, coupled with challenging geo-political developments around the world,uncertainty once again permeates the industry outlook for the year.

Applied Materials introduces the biggest materials change to interconnect technology in 15 years

Tue, 5 May 2014
Applied Materials, Inc. today announced its Applied Endura Volta CVD Cobalt system, the only tool capable of encapsulating copper interconnects in logic chips beyond the 28nm node by depositing precise, thin cobalt films.

New policy helps combat counterfeit semiconductors

Wed, 5 May 2014
A newly finalized Department of Defense (DoD) rule reduces the risk of counterfeit semiconductor products being used by our military by implementing needed safeguards in the procurement of semiconductors and other electronic parts.

Nanowire bridging transistors open way to next-generation electronics

Wed, 5 May 2014
A new approach to integrated circuits, combining atoms of semiconductor materials into nanowires and structures on top of silicon surfaces, shows promise for a new generation of fast, robust electronic and photonic devices.

New implanted devices may reshape medicine

Wed, 5 May 2014
Researchers from The University of Texas at Dallas and the University of Tokyo have created electronic devices that become soft when implanted inside the body and can deploy to grip 3-D objects, such as large tissues, nerves and blood vessels.

Memory design challenges require giga-scale SPICE simulation

Thu, 5 May 2014
Embedded memory is now consuming most of the area on an SoC chip. Complexity and circuit size are only growing, which means smaller process geometries, larger designs, and tighter design margins.

Improving financial predictability – is it chasing a mirage?

Thu, 5 May 2014
There is continued evidence that despite spending several millions on IT transformations, improving internal planning processes, maturing supply chains, and streamlining product development processes- several companies still struggle with predicting their financial and operational performance.

Domestic outsourcing: A key component in successful reshoring

Fri, 5 May 2014
After nearly a quarter of a century, the off-shoring manufacturing trend that decimated the U.S. manufacturing sector and played a significant role in the slow pace of the current economic recovery seems to be ending.

Brewer Science unveils Apogee temporary wafer bonder

Mon, 5 May 2014
Brewer Science, Inc., a supplier of thin-wafer handling technology, materials, and equipment to the microelectronics industry, today unveiled the Brewer Science Apogee bonder for temporary wafer bonding applications.

Lighting the way to graphene-based devices

Mon, 5 May 2014
Berkeley Lab researchers use light to dope graphene boron nitride heterostructures.

Increase in first quarter 2014 silicon wafer shipments

Tue, 5 May 2014
Worldwide silicon wafer area shipments increased during the first quarter 2014 when compared to fourth quarter 2013 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Google Glass is far more than the sum of its parts, IHS Teardown reveals

Wed, 5 May 2014
Teardown analysis is a useful tool for understanding the component and manufacturing cost of electronics devices—but it doesn’t always tell the whole story of the value of a product.

Smartphone connectivity presents both opportunities and challenges for automotive processor chip suppliers

Mon, 9 Sep 2014
The use of smartphones in motor vehicles—already a near-ubiquitous phenomenon—is the most disruptive trend in the automotive infotainment business today, presenting both challenges and opportunities for automakers and their processor semiconductor suppliers.

Bending helps to control nanomaterials

Thu, 5 May 2014
A new remedy has been found to tackle the difficulty of controlling layered nanomaterials. Control can be improved by simply bending the material.

Engineers build world's smallest, fastest nanomotor

Thu, 5 May 2014
Researchers at the Cockrell School of Engineering at The University of Texas at Austin have built the smallest, fastest and longest-running tiny synthetic motor to date.

UT Dallas team creates flexible electronics that change shape inside body

Tue, 5 May 2014
Transistors maintain electrical properties after implantation.

Penn research combines graphene and painkiller receptor into scalable chemical sensor

Tue, 5 May 2014
Researchers from the University of Pennsylvania have led an effort to create an artificial chemical sensor based on one of the human body's most important receptors, one that is critical in the action of painkillers and anesthetics..

ams reaches out to Chinese engineering community with new micro-site

Tue, 5 May 2014
ams AG, a provider of high performance analog ICs and sensors, has launched a new micro-site in China in an initiative designed to provide a more direct channel for communication with China's one million-strong electronic design and engineering community.

IEDM announces 2014 Call for Papers

Wed, 5 May 2014
The 60th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

Global semiconductor leaders develop plan to promote worldwide industry growth

Wed, 5 May 2014
The Semiconductor Industry Association (SIA) today announced that global semiconductor industry leaders reached an agreement at the 18th annual meeting of the World Semiconductor Council (WSC) last week on a series of policy proposals to strengthen the industry through international cooperation.

ams wins patent validity lawsuit launched by Melexis

Thu, 5 May 2014
ams, a manufacturer of high performance sensor and analog solutions, announces that the company has won a last-instance verdict against Melexis.

MEMSIC introduces world's highest performance three-axis magnetic sensor

Mon, 6 Jun 2014
MEMSIC Inc., a sensing solution provider, today announced the availability of its MMC3524xPJ Three-Axis Magnetic Sensor.

2D transistors promise a faster electronics future

Tue, 6 Jun 2014
Faster electronic device architectures are in the offing with the unveiling of the world’s first fully two-dimensional field-effect transistor (FET) by researchers with the Lawrence Berkeley National Laboratory (Berkeley Lab).

Osamu Nakamura named President of SEMI Japan

Tue, 6 Jun 2014
Nakamura will succeed Yoichi Nakagawa, who is retiring from SEMI.

Strengthening recovery: Fab equipment spending - 24% increase in 2014, possible record in 2015

Wed, 6 Jun 2014
After two years of decline, fab equipment spending is expected to increase 24 percent in 2014 and about 11 percent (US$39.5 billion).

Permanent bonding: A key technology for MEMS, advanced packaging, LEDs and SOI

Mon, 7 Jul 2014
Yole Développement has released a new report, Permanent Wafer Bonding, detailing permanent bonding technologies and the microelectronic applications that use permanent bonding such as MEMS, Advanced Packaging, LEDs and SOI substrates.

Imec and Samsung join to accelerate innovation digital health

Thu, 6 Jun 2014
Imec, a nanoelectronics research center, announced today that it is collaborating with Samsung Electronics to accelerate innovation and collaboration among technology companies and researchers working in the burgeoning mobile wearable field.

IoT devices offer huge potential for components manufacturers

Thu, 6 Jun 2014
While Internet of Things devices offer huge potential, it is clearly not where the value will stop, according to a new report from Yole Developpement.

Design of self-assembling protein nanomachines starts to click

Thu, 6 Jun 2014
A nanocage builds itself from engineered components.

On the road to recovery: Semiconductor growth expected for the next two years

Mon, 6 Jun 2014
According to the IMF and predictions by many other market research firms, 2014 and 2015 are expected to be growth years, comparable to or even better than the past few years.

New class of nanoparticle brings cheaper, lighter solar cells outdoors

Mon, 6 Jun 2014
Researchers in the University of Toronto’s Edward S. Rogers Sr. Department of Electrical & Computer Engineering have designed and tested a new class of solar-sensitive nanoparticle that outshines the current state of the art employing this new class of technology.

InvenSense unveils gyroscope for high speed motion and wearable applications

Wed, 6 Jun 2014
InvenSense, Inc., the provider of MotionTracking system on chip (SoC) and sound devices, announced the world’s widest full scale range (FSR) 3-axis MEMS gyroscope for high impact wearable applications.

ANSYS and Intel collaborate on reference flow for power, EM and reliability sign-off

Wed, 6 Jun 2014
ANSYS, Inc., and Intel Corporation announced the availability of a production-proven reference flow for power, EM and reliability sign-off using ANSYS simulation solutions for Intel's 14nm Tri-Gate process, showcasing it at last week's Design Automation Conference.

Industry sustainability efforts mount with III-Vs and other advanced technologies

Thu, 6 Jun 2014
The introduction of new materials, such as III-Vs, into high-volume manufacturing of semiconductors, likely will occur sometime around the 7nm and/or 5nm nodes.

memsstar relocates; Increases manufacturing capacity by 40%

Wed, 6 Jun 2014
memsstar Limited, a provider of etch and deposition equipment and technology solutions to manufacturers of semiconductors and micro-electrical mechanical systems (MEMS), today announced that it has relocated to a new, larger facility.

200mm equipment market gaining new lease on life

Mon, 6 Jun 2014
In 2004/2005, shipments of 300mm wafer fab equipment (WFE) began to outpace that of 200mm platforms.

Subatmospheric gas storage and delivery: Past, present and future

Thu, 6 Jun 2014
Storing gas on a sorbent provides an innovative, yet simple and lasting solution.

Collecting light with artificial "moth eyes"

Mon, 6 Jun 2014
Empa researchers have developed such a photoelectrochemical cell, recreating a moth’s eye to drastically increase its light collecting efficiency. The cell is made of cheap raw materials – iron and tungsten oxide.

At The ConFab 2014: Do we still need Moore’s Law?

Mon, 6 Jun 2014
Many questions were in the air on the first day of the 10th annual ConFab 2014, and certainly chief among them was raised during Dr. Roawen Chen of Qualcomm’s keynote “What’s On Our Mind” on Monday morning when he asked, “Should we pursue Moore's Law unconditionally?"

ConFab panelists discuss optimizing R&D in the changing semi landscape

Tue, 6 Jun 2014
Overheard @The ConFab: “I feel the best I’ve felt about semi since 2009.” –Mike Noonen, Silicon Catalyst

The bright future of Si photonics

Wed, 6 Jun 2014
Beyond all of the hype and tumult, market drivers and technological developments are converging to ensure a bright future for Si photonics.

Gopal Rao at The ConFab: Scaling isn’t enough anymore

Wed, 6 Jun 2014
The core element of the semiconductor industry’s roadmap has been scaling – but Gopal Rao believes that isn’t enough anymore.

“What comes next?” — Latest technology breakthroughs featured at SEMICON West

Fri, 6 Jun 2014
The latest manufacturing, materials and production developments for emerging and adjacent markets will be featured at SEMICON West 2014, to be held on July 8-10 at the Moscone Center in San Francisco, Calif.

CEA-Leti and CORIMA collaborate on force sensors integrated in cycle wheels

Fri, 6 Jun 2014
CEA-Leti and CORIMA, a supplier of carbon-composite wheels and frames for track and road-racing cyclists, today announced they are developing an integrated sensor system to measure the power output of riders as they pedal.

Nanolab Technologies acquires Microtech Laboratories, LLC

Wed, 7 Jul 2014
Nanolab Technologies, Inc. announced today that it has acquired Microtech Laboratories, LLC a well-established Dallas, Texas, failure analysis laboratory founded in 1999.

Breakthrough research in the semiconductor industry

Mon, 6 Jun 2014
Research forms the DNA of the semiconductor industry — few other industries invest as much as a percentage of revenue.

Smart, sustainable manufacturing: new sensors for process monitoring

Thu, 7 Jul 2014
Industries ranging from chemicals to agri-food to bio-tech and pharmaceuticals are looking at new sensor technologies to streamline processes and improve quality control.

IoT will transform transportation

Thu, 7 Jul 2014
Cars that can get along without drivers are coming, down the road, but they are a small part of the changes that the global transportation industries will undertake as microelectronics and the Internet of Things prompt major changes in infrastructure and logistics, as well as all type of vehicles.

Columbia researchers observe tunable quantum behavior in bilayer graphene

Thu, 7 Jul 2014
Columbia researchers have observed the fractional quantum Hall effect in bilayer graphene and shown that this exotic state of matter can be tuned by an electric field.

Internet of Things: big numbers, many opportunities

Thu, 7 Jul 2014
Whatever forecast one uses for the future of the Internet of Things in terms of connected objects or business opportunities, the IoT will be big.

Orbotech to acquire SPTS Technologies

Mon, 7 Jul 2014
Orbotech Ltd. today announced the acquisition of SPTS Technologies Group Limited, a U.K.-based leading manufacturer of etch, deposition and thermal processing equipment for the microelectronics industry, from European private equity firm Bridgepoint and others.

SEMI and Solid State Technology announce the 2014 “Best of West” Award finalists

Tue, 7 Jul 2014
Each year at SEMICON West, the largest and most influential microelectronics exposition in North America, the “Best of West” awards are presented by Solid State Technology and SEMI. The award was established to recognize contributors moving the industry forward with their technological developments in the microelectronics supply chain.

Boston Semi Equipment expands sales and service organization

Tue, 7 Jul 2014
Boston Semi Equipment LLC (BSE) today announced it has completed the integration of the sales and service teams of MVTS and Aetrium into the BSE distribution channel.

SEMATECH and CNSE/SUNYIT launch CMP Center

Tue, 7 Jul 2014
The Center aims to accelerate the development of next generation CMP technology, and to drive improvement in the yield and cost of ownership of CMP processes.

SEMI forecasts double-digit business growth in 2014, 2015

Wed, 7 Jul 2014
The worldwide semiconductor capital equipment market is forecast to increase 20.8 percent this year to $38.44 billion, compared with 2013’s $31.82 billion, and another 10.8 percent in 2015 to $42.6 billion, according to Semiconductor Equipment and Materials International.

Paradigm shift in semi equipment - Confirmed

Tue, 7 Jul 2014
Technology node transitions slowing below 32nm.

A nanosensor to identify vapors based on a Graphene/Silicon heterojunction Schottky diode

Tue, 7 Jul 2014
Among other carbon-based nanomaterials, graphene represents a great promise for gas sensing applications.

IBM announces $3B research initiative

Tue, 7 Jul 2014
IBM announced it is investing $3 billion over the next 5 years in two broad research and early stage development programs to push the limits of chip technology needed to meet the emerging demands of cloud computing and Big Data systems.

Imaging without limits: Phones lead growth but innovative applications expanding the market

Fri, 7 Jul 2014
To address the rising demands of imaging systems in mobile, medical, automotive and other technology applications, the Imaging Without Limits Conference (7-8 October) will be introduced at SEMICON Europa 2014 this year to address this surging market.

Solid State Equipment wins 2014 3D InCites Award for WaferEtch TSV Revealer

Tue, 7 Jul 2014
Solid State Equipment LLC (SSEC), a provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D ICs), MEMS, and compound semiconductor markets, was awarded a 2014 3D InCites Award in the category of 2.5D/3D Manufacturing Equipment.

SEMI announces new South America Semiconductor Strategy Summit

Tue, 7 Jul 2014
SEMI today announced the launch of the association's first-ever event in Latin America.

Fundamental chemistry findings could help extend Moore’s Law

Wed, 7 Jul 2014
A Berkeley Lab-Intel collaboration outlines the chemistry of photoresist, enabling smaller features for future generations of microprocessors.

A call to provide advanced equipment to growth companies

Mon, 7 Jul 2014
Historically, the major semiconductor capital equipment manufacturers have focused on supporting the bigger semiconductor companies at the expense of the smaller ones.

Can lean innovation bring growth and profits back to semiconductors?

Fri, 7 Jul 2014
New approaches to start-ups can unlock mega-trend opportunities.

3D memory for future nanoelectronic systems

Sun, 7 Jul 2013
Bit-growth slows while specialized stacking accelerates innovation in future memory solutions for communications, energy, and health-care.

Harnessing big data

Mon, 7 Jul 2014
Addressing the analytics challenges in supply chain management.

Silicon Image appoints new Chief Financial Officer

Wed, 7 Jul 2014
Silicon Image, a provider of multimedia connectivity solutions and services, today announced the appointment of Raymond Cook as Chief Financial Officer effective July 28, 2014.

Wireless connectivity semiconductors maintain strong double-digit growth in health and fitness

Thu, 7 Jul 2014
Semiconductors providing wireless connectivity in health and fitness devices are set for solid double-digit growth in 2014 and beyond, especially as a clutch of wireless technologies make their way into a growing number of wearable devices.

Smart cities to rise fourfold in number from 2013 to 2025

Thu, 7 Jul 2014
The number of smart cities worldwide will quadruple within a 12-year period that started last year, proliferating as local governments work with the private sector to cope with a multitude of challenges confronting urban centers.

National Science Foundation tests out the assembly line of the future

Tue, 8 Aug 2014
NSF's Center for Hierarchical Manufacturing proves good test bed for large-scale nanomanufacturing designs .

Sensors, semiconductors, autonomous driving and regulation to drive ADAS revolution

Tue, 8 Aug 2014
In its recent market research report, ABI Research forecasts automotive camera sensor shipments to reach 197 million by 2020.

Global semiconductor industry on pace for record sales through first half of 2014

Tue, 8 Aug 2014
Sales up across every region and nearly all product categories compared to last year; Americas region shows strongest growth.

Taking great ideas from the lab to the fab

Tue, 8 Aug 2014
NSF and Intel support the development of domain-specific hardware to address health care needs.

NJR and UMC extend collaboration on MEMS microphone manufacturing

Thu, 8 Aug 2014
New Japan Radio Co., Ltd. and United Microelectronics Corporation, a global semiconductor foundry, today announced that the two companies have successfully collaborated to achieve high-volume manufacturing for NJR's MEMS microphone products.

SRC, UC Davis explore new materials and device structures to develop next-generation “Race Track Memory” technologies

Tue, 8 Aug 2014
University of California, Davis researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, are exploring new materials and device structures to develop next-generation memory technologies.

FlexTech Alliance announces 2015FLEX conference theme, Call for Papers and advisory committee

Tue, 8 Aug 2014
FlexTech Alliance announced the conference theme, Call for Papers, and the industry chairs for the 14th Annual Flexible & Printed Electronics Conference & Exhibition -- 2015FLEX -- set for February 23 – 26, 2015 at the Monterey Conference Center, Monterey, California.

Eco-friendly "pre-fab nanoparticles" could revolutionize nano manufacturing

Wed, 8 Aug 2014
A team of materials chemists, polymer scientists, device physicists and others at the University of Massachusetts Amherst today report a breakthrough technique for controlling molecular assembly of nanoparticles over multiple length scales that should allow faster, cheaper, more ecologically friendly manufacture of organic photovoltaics and other electronic devices.

Global pressure sensors market is expected to reach $9.36B in 2020

Thu, 8 Aug 2014
The global pressure sensors market was valued at $6.53 billion USD in 2013, growing at a CAGR of 6.2% from 2014 to 2020 to account for $9.36 billion USD in 2020.

MEMSIC introduces the world's first monolithic and wafer level packaged 3D-axis accelerometer

Fri, 8 Aug 2014
MEMSIC, Inc., a MEMS sensing solution provider, announced today the availability of its MXC400xXC, the world's first monolithic 3D accelerometer, and also the first 3D accelerometer to utilize WLP technology.

Himax Technologies and Lumus announce collaboration to develop next-generation smart glasses

Tue, 8 Aug 2014
Himax Technologies, Inc., a supplier and fabless manufacturer of display drivers and other semiconductor products, and Lumus, a producer of Augmented Reality glasses, announced today another joint initiative to continue developing the next-generation of smart glasses that will set new technological standards in image quality and performance.

MIPT and RAS scientists made an important step towards creating medical nanorobots

Tue, 8 Aug 2014
Researchers from the Institute of General Physics of the Russian Academy of Sciences, the Institute of Bioorganic Chemistry of the Russian Academy of Sciences and MIPT have made an important step towards creating medical nanorobots.

Promising ferroelectric materials suffer from unexpected electric polarizations

Tue, 8 Aug 2014
Electronic devices with unprecedented efficiency and data storage may someday run on ferroelectrics—remarkable materials that use built-in electric polarizations to read and write digital information, outperforming the magnets inside most popular data-driven technology.

Quantum Materials acquires Bayer Technology Services quantum dot patents

Wed, 8 Aug 2014
Quantum Materials Corporation today announced the purchase of five diverse sets of patent families from Bayer Technology Services GmbH, the global technological backbone and major innovation driver for Bayer AG of Leverkusen, Germany.

Order activity for semiconductor equipment holds steady in July

Thu, 8 Aug 2014
North America-based manufacturers of semiconductor equipment posted $1.41 billion in orders worldwide in July 2014 (three-month average basis) and a book-to-bill ratio of 1.07, according to the July EMDS Book-to-Bill Report published today by SEMI.

A breakthrough in imaging gold nanoparticles to atomic resolution by electron microscopy

Fri, 8 Aug 2014
Nanometer-scale gold particles are intensively investigated for application as catalysts, sensors, drug delivery devices, biological contrast agents and components in photonics and molecular electronics.

ESI appoints new board member

Mon, 8 Aug 2014
Electro Scientific Industries, Inc., a supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced that Richard H. Wills, former Chairman and Chief Executive Officer of Tektronix, Inc., was appointed to the company’s Board of Directors.

JEDEC releases LPDDR4 Standard for low power memory devices

Mon, 8 Aug 2014
JEDEC Solid State Technology Association today announced the publication of JESD209-4 Low Power Double Data Rate 4 (LPDDR4).

Engineers develop new sensor to detect tiny individual nanoparticles

Tue, 9 Sep 2014
A team of researchers at Washington University in St. Louis, led by Lan Yang, PhD, the Das Family Career Development Associate Professor in Electrical & Systems Engineering, and their collaborators at Tsinghua University in China have developed a new sensor that can detect and count nanoparticles, at sizes as small as 10 nanometers, one at a time.

New ClassOne electroplater a "sellout" at SEMICON West

Mon, 8 Aug 2014
When ClassOne Technology introduced its new Solstice electroplating systems at SEMICON West last month they didn’t expect to actually sell their first production unit off the show floor, but that’s what happened.

S2C opens Korean office and appoints country manager

Tue, 8 Aug 2014
S2C, Inc. announced today the opening of a direct sales and support office in Seoul, Korea, appointing Suk-Ha Lee (SH Lee) as country manager.

Plastic electronics: Opportunity on the edge of commercialization

Wed, 8 Aug 2014
The Plastics Electronics Conference and Exposition will co-locate with SEMICON Europa. Plastic Electronics 2014 (PE 2014) is themed “Enabling Applications beyond Limits in Electronics” and will be held at Alpexpo in Grenoble on 7-9 October.

Scientists craft a semiconductor only three atoms thick

Wed, 8 Aug 2014
Scientists have developed what they believe is the thinnest-possible semiconductor, a new class of nanoscale materials made in sheets only three atoms thick.

The industry's first foundry business for MEMS utilizing thin-film piezoelectric elements

Thu, 8 Aug 2014
ROHM has recently established a process for MEMS utilizing thin-film piezoelectric elements, and implemented the industry's first foundry business that integrates product design and manufacturing processes, from wafer pulling to mounting, in order to meet a variety of customer needs.

MEMS Industry Group hosts 10th annual MEMS Executive Congress US

Thu, 8 Aug 2014
MEMS Industry Group (MIG) will host MEMS Executive Congress US 2014, an annual business conference and networking event for the MEMS and sensors industry, November 5-7, 2014 in Scottsdale, AZ.

Vietnam Semiconductor Strategy Summit —keynotes and highlights announced

Thu, 8 Aug 2014
SEMI today announced the keynotes for the 2nd Vietnam Semiconductor Strategy Summit(September 16-17), an executive conference focused on Vietnam’'s growing role in the global semiconductor industry.

UMC joins Fujitsu's new foundry company

Fri, 8 Aug 2014
United Microelectronics Corporation and Fujitsu Semiconductor Limited today announced an agreement for UMC to become a minority shareholder of a newly formed subsidiary of Fujitsu Semiconductor that will include its 300mm wafer manufacturing facility located in Kuwana, Mie, Japan.

IDC lowers tablet projections for 2014 as demand in mature markets levels off

Tue, 9 Sep 2014
Following a second consecutive quarter of softer than expected demand, International Data Corporation (IDC) has lowered its worldwide tablet plus 2-in-1 forecast for 2014 to 233.1 million units.

SEMICON Taiwan 2014 opens today with spotlight on 3D-IC, sustainable manufacturing, and MEMS

Wed, 9 Sep 2014
Taiwanese chipmakers, LED manufacturers, and Outsourced Semiconductor Assembly and Test (OSAT) firms will spend firm nearly $24 billion in the next two years on equipment and materials, powering excitement for SEMICON Taiwan 2014, which opened today in Taipei.

Analog Devices releases high-temperature MEMS gyroscope

Wed, 9 Sep 2014
Analog Devices, Inc. today introduced the first and only MEMS gyroscope specified to withstand temperatures of up to 175 degrees Celsius commonly encountered by oil and gas drilling equipment.

UCSB researchers develop ultra sensitive biosensor from molybdenite semiconductor

Thu, 9 Sep 2014
Move over, graphene. An atomically thin, two-dimensional, ultrasensitive semiconductor material for biosensing developed by researchers at UC Santa Barbara promises to push the boundaries of biosensing technology in many fields, from health care to environmental protection to forensic industries.

NVIDIA files complaints against Samsung and Qualcomm

Fri, 9 Sep 2014
NVIDIA today announced that it has filed complaints against Samsung and Qualcomm at the International Trade Commission and in the U.S. District Court in Delaware, alleging that the companies are both infringing NVIDIA GPU patents covering technology including programmable shading, unified shaders and multithreaded parallel processing.

Layered graphene sandwich for next generation electronics

Mon, 9 Sep 2014
Sandwiching layers of graphene with white graphene could produce designer materials capable of creating high-frequency electronic devices, University of Manchester scientists have found.

Doped graphene nanoribbons with potential

Mon, 9 Sep 2014
Researchers from Empa and the Max Planck Institute for Polymer Research have now developed a new method to selectively dope graphene molecules with nitrogen atoms.

10nm success depends on concurrent design and development

Mon, 9 Sep 2014
The Prophets of Doom greet every new process node with a chorus of dire warnings about the end of scaling, catastrophic thermal effects, parasitics run amok and . . . you know the rest.

Second quarter 2014 semi equipment billings 28% higher than 2013 second quarter

Tue, 9 Sep 2014
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 9.62 billion in the second quarter of 2014.

A fundamental truth of process control

Tue, 9 Sep 2014
You can’t fix what you can’t find. You can’t control what you can’t measure.

Leti and LUCIOM focusing on high-data-rate bidirectional transceivers for enriched LiFi applications

Wed, 9 Sep 2014
CEA-Leti and LUCIOM, which develops visible-light communication using light-emitting diodes (LEDs), have launched a project to develop high-data-rate LiFi transceivers.

Equipment spending shows strong growth for 2014 and 2015

Wed, 9 Sep 2014
Front End fab equipment spending is projected to increase up to another 20 percent in 2015 to US$ 42 billion.

Outlook: Healthy equipment spending into 2015

Wed, 9 Sep 2014
The general consensus for the semiconductor industry is for this year’s positive trend to continue into 2015 as both revenue growth and unit shipment growth are expected to be in the mid- to high- single digit range.

Oxford Instruments launches 3rd annual Indian nanotechnology seminars in Kolkata and Delhi

Thu, 9 Sep 2014
Oxford Instruments is hosting its third series of annual seminars for the nanotechnology industry in India in November.

Rudolph introduces new acoustic metrology and defect inspection technology

Thu, 9 Sep 2014
Rudolph Technologies has introduced its new SONUS Technology for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs).

Mentor Graphics appoints Vice President for Embedded Technologies

Thu, 9 Sep 2014
Mentor Graphics Corp. today announced the appointment of Glenn Perry to the role of vice president of the company's Embedded Systems Division.

ProPlus Design Solutions expands sales operations to Europe

Thu, 9 Sep 2014
ProPlus Design Solutions, Inc. announced today it expanded its sales operations to Europe.

North American semiconductor equipment industry posts August 2014 book-to-bill ratio of 1.04

Thu, 9 Sep 2014
A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

Northeastern University researchers develop novel method for working with nanotubes

Fri, 9 Sep 2014
Northeastern University researchers have developed a novel method for controllably constructing precise inter-nanotube junctions and a variety of nanocarbon structures in carbon nanotube arrays.

Vesper launches with very high SNR MEMS microphone

Mon, 9 Sep 2014
Intending to improve the smallest audio component found in smartphones, wearables and Internet of Things (IoT) devices, a new Boston-based sensor company called Vesper has designed a microphone that will enhance consumers' acoustic experience with voice capture and sound recording.

Physicists heat freestanding graphene to control curvature of ripples

Mon, 9 Sep 2014
An international team of physicists, led by a research group at the University of Arkansas, has discovered that heating can be used to control the curvature of ripples in freestanding graphene.

SiTime raises $25 Million

Tue, 9 Sep 2014
SiTime Corporation, a MEMS analog semiconductor company, today announced that it has closed $25 million in new financing, which consisted of a combination of structured debt facility of $15 million provided by Capital IP Investment Partners LLC and strategic equity investment from other investors.

New technology may lead to prolonged power in mobile devices

Tue, 9 Sep 2014
Researchers from The University of Texas at Dallas have created technology that could be the first step toward wearable computers with self-contained power sources or, more immediately, a smartphone that doesn’t die after a few hours of heavy use.

All directions are not created equal for nanoscale heat sources

Wed, 10 Oct 2014
Thermal considerations are rapidly becoming one of the most serious design constraints in microelectronics, especially on submicron scale lengths.

SEMICON Japan features "World of IoT"

Wed, 10 Oct 2014
Today, SEMI opens registration for the SEMICON Japan 2014 exposition and programs.

Boston Semi Equipment creates industry's largest independent ATE organization

Wed, 10 Oct 2014
Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name.

Crumpled graphene could provide an unconventional energy storage

Fri, 10 Oct 2014
Two-dimensional carbon 'paper' can form stretchable supercapacitors to power flexible electronic devices.

Europe: Strong growth in chip equipment spending in 2015

Mon, 10 Oct 2014
Global capital spending on semiconductor equipment is projected to grow 21.1 percent in 2014 and 21.0 percent in 2015.

EV Group unveils room-temperature covalent bonder

Mon, 10 Oct 2014
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 580 ComBond.

Adoption of SiC & GaN to directly impact the power electronics industry

Mon, 10 Oct 2014
Emergence of new wide bandgap (WBG) technologies such as SiC and GaN materials will definitely reshape part of the established power electronics industry, according to Yole Développement (Yole).

Global semiconductor sales continue to climb in August

Mon, 10 Oct 2014
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $28.4 billion for the month of August 2014.

SEMI announces rising annual silicon wafer shipment forecast

Tue, 10 Oct 2014
SEMI recently completed its annual silicon shipment forecast for the semiconductor industry. This forecast provides an outlook for the demand in silicon units for the period 2014-–2016.

UMC announce joint venture for a 12" fab in China

Thu, 10 Oct 2014
The Board of Directors of United Microelectronics Corporation, a global semiconductor foundry, today announced a joint venture company focused on 12" wafer foundry services with Xiamen Municipal People's Government and FuJian Electronics & Information Group.

Smallest world record has 'endless possibilities' for bio-nanotechnology

Mon, 10 Oct 2014
Scientists from the University of Leeds have taken a crucial step forward in bio-nanotechnology, a field that uses biology to develop new tools for science, technology and medicine.

New 'lab-on-a-chip' could revolutionize early diagnosis of cancer

Mon, 10 Oct 2014
University of Kansas Medical Center and KU Cancer Center have just published a breakthrough paper in the Royal Society of Chemistry journal describing their invention of a miniaturized biomedical testing device for exosomes.

The mystery of reed relays: Understanding specifications

Wed, 10 Oct 2014
Specifications of reed relays, which are used for current switching in ATE and other applications are explained, including carry current, lifetime, minimum switch capacity, hot switching, operating speed and thermoelectric switching.

Intel and IBM to lay out 14nm FinFET strategies on competing substrates at IEDM 2014

Thu, 10 Oct 2014
The development of increasingly sophisticated and energy-efficient CMOS technology for mobile, client and cloud computing depends on a continuing stream of advances in the process technologies with which the complex integrated circuits are built.

Wearable sensor market to expand sevenfold in five years

Thu, 10 Oct 2014
Driven by rising demand for fitness and health monitoring features as well as by improved user interfaces, shipments of sensors used in wearable electronic devices will rise by a factor of seven from 2013 through 2019

Growing momentum in semiconductor manufacturing in Vietnam

Fri, 10 Oct 2014
The 2nd annual SEMI Vietnam Semiconductor Strategy Summit, co-organized with the Saigon Hi-Tech Park and with FabMax as the premier sponsor, was held September 16-17, 2014 in Ho Chi Minh City.

Magnetic mirrors enable new technologies by reflecting light in uncanny ways

Fri, 10 Oct 2014
As in Alice’s journey through the looking-glass to Wonderland, mirrors in the real world can sometimes behave in surprising and unexpected ways, including a new class of mirror that works like no other.

MEMS Industry Group goes to the 'Shark Tank' for MEMS and sensor-based products

Mon, 10 Oct 2014
MIG announces finalists for Elevator Pitch Session at MEMS Executive Congress US 2014.

Semiconductor equipment book-to-bill declines in September

Tue, 10 Oct 2014
While order activity moderated, equipment spending this year is expected to be robust and remain on pace for double-digit year-over-year growth.

Special UO microscope captures defects in nanotubes

Tue, 10 Oct 2014
University of Oregon chemists have devised a way to see the internal structures of electronic waves trapped in carbon nanotubes by external electrostatic charges.

Mergers, acquisitions reshape the automotive semi supplier landscape

Wed, 10 Oct 2014
Capped by last week’s announcement that Qualcomm Inc. would buy CSR PLC, the automotive semiconductor industry recently has been undergoing a wave of merger and acquisition (M&A) activity that has shaken up the competitive order of the market.

Finalists announced for MEMS Executive Congress US 2014

Thu, 10 Oct 2014
Six companies selected from a pool of applicants will compete in MEMS Industry Group's (MIG)'s MEMS & Sensors Technology Showcase at MEMS Executive Congress.

STMicroelectronics tops five billion MEMS sensors shipped

Thu, 10 Oct 2014
Beyond gaming systems, smartphones, tablets, navigation systems, and other widely adopted applications, ST’s sensors have also been used in thousands of other useful, fun, and valuable applications.

UMC enters volume production for Lantiq's Communication ICs

Tue, 10 Oct 2014
United Microelectronics Corporation, a global semiconductor foundry, and Lantiq, a supplier of broadband access and home networking technologies, today announced that UMC has entered volume production for Lantiq's SPT170 high voltage Power Management ICs.

TSMC, Kilopass deliver non-volatile memory for the 16nm finFET process node

Tue, 10 Oct 2014
Kilopass Technology Inc., a provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), announced today that it has successfully ported its one-time programmable (OTP) NVM technology to TSMC's 16 nanometer (nm) FinFET process.

MegaChips to acquire SiTime for $200M

Wed, 10 Oct 2014
SiTime Corporation, a MEMS and analog semiconductor company, today announced that it has signed a definitive agreement under which MegaChips Corporation, a top 25 fabless semiconductor company based in Japan, will acquire SiTime for $200 million in cash.

SEMICON Japan 2014: New venue and new ideas for rebounding industry

Wed, 10 Oct 2014
Today, SEMI announced an exceptional lineup of speakers for SEMICON Japan’s Opening Day — Accenture, Applied Materials, ARM, IBM Japan, Intel K.K., NIICT, Scripps, Toshiba, and Toyota.

SEMI extends ASMC Call for Papers deadline to November 10

Thu, 10 Oct 2014
SEMI announced today that the deadline for presenters to submit an abstract for the 26th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 10.