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Inside the Hybrid Memory Cube

Wed, 9 Sep 2013
The HMC provides a breakthrough solution that delivers unmatched performance with the utmost reliability.

Package level integration: challenges and opportunities

Wed, 9 Sep 2013
A wide array of package level integration technologies now available to chip and system designers are reviewed.

High temperature reverse bias reliability testing of high power devices

Wed, 9 Sep 2013
Power device characterization and reliability testing require instrumentation capable of sourcing higher voltages and more sensitive current measurements than ever before.

Logic gates in graphene technology

Wed, 9 Sep 2013
Serial production of a QCA graphene cell could be possible. Simple, well-defined process steps are identified.

Thermal considerations in LED modules

Wed, 9 Sep 2013
Common thermal considerations in LEDs include test point temperature and thermal power.