polishing-pads

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Chemical Mechanical Planarization

Fri, 12 Dec 2015
In chemical mechanical planarization (CMP), the top surface of the wafer is polished or planarized to create a flat surface.

The latest in CMP tech will be on offer at SEMICON West

Wed, 7 Jul 2015
Chemical mechanical planarization (CMP) technology has been around for a long time. In addition to the semiconductor industry, CMP has applications in data storage, polishing the rigid disks and magnetic heads of hard-disk drives.

Dow Electronic Materials launches CMP polishing pads

Fri, 2 Feb 2014
Dow Electronic Materials, a business unit of The Dow Chemical Company, today introduced the IKONIC 4000 series of chemical mechanical planarization (CMP) polishing pads.

Entegris announces new post-CMP cleaning solutions

Tue, 1 Jan 2016
Entegris, Inc., a developer of yield-enhancing materials and solutions, today announced new post-chemical mechanical planarization (post-CMP) cleaning solutions for semiconductor manufacturing.