power-electronics

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EU project to industrialize world record high-density capacitors

Wed, 10 Oct 2013
CEA-Leti, Fraunhofer IPMS-CNT and three European companies have launched a two-year project to industrialize 3D integrated capacitors with world-record density using atomic layer deposition.

Power modules get their own upside-down C-SAM system

Thu, 12 Dec 2013
Sonoscan has shipped the first of its new D9600Z C-SAM systems. This new model is designed expressly to facilitate the imaging of IGBT (Insulated Gate Bipolar Transistor) power modules.

Low-power tunneling transistor for high-performance devices at low voltage

Thu, 12 Dec 2013
A new type of transistor that could make possible fast and low-power computing devices for energy-constrained applications such as smart sensor networks, implantable medical electronics and ultra-mobile computing is feasible, according to Penn State researchers.

Book-to-bill: Year-end activity substantially stronger compared to last year

Fri, 12 Dec 2013
North America-based manufacturers of semiconductor equipment posted $1.24 billion in orders worldwide in November 2013 (three-month average basis) and a book-to-bill ratio of 1.11.

IDT introduces industry’s first single-chip 5V wireless power transmitter solution

Tue, 1 Jan 2014
Integrated Device Technology, Inc. today announced the industry’s first Qi-compliant single-chip wireless power transmitter solution supporting a 5V input.

Slideshow: CES 2014 Highlights

Fri, 1 Jan 2014
This week in Las Vegas, the 2014 International Consumer Electronics Show focused on the Internet of Things, displaying many connected gadgets and services.

6) ZAGG Inc introduces new range of portable batteries and power products

Sun, 1 Jan 2010

Battery development may extend range of electric cars

Mon, 1 Jan 2014
It's known that electric vehicles could travel longer distances before needing to charge and more renewable energy could be saved for a rainy day if lithium-sulfur batteries can just overcome a few technical hurdles.

EV Group ships temporary bonding/debonding system to Fraunhofer ISIT

Tue, 1 Jan 2014
EV Group today announced that the Fraunhofer Institute for Silicon Technology (ISIT) has purchased an EVG 850TB/DB fully automated bonding/debonding equipment solution.

Imec celebrates 30 years

Tue, 1 Jan 2014
Nanotechnology research and development center imec, today announced the celebration of its 30th anniversary.

Cyclical upturn continues in 2014: Positive yet cautious expectations persist

Thu, 1 Jan 2013
In 2013, the IC industry emerged from a difficult 5-year period of minimal growth and started on its next cyclical upturn, a welcome piece of news.

Outlook for semiconductors and the value chain in 2014

Thu, 1 Jan 2013
We approach 2014 with a combination of positive policy, financial, and economic forces that will push world growth up to a +3% range.

Coming year promises increased capital spending and continued need for effective industry collaboration

Thu, 1 Jan 2013
For most of the past 15 years, the industry has displayed a fairly predictable pattern of fab equipment spending, characterized generally by two years of decline followed by two years of positive growth.

The shift to materials-enabled 3D

Thu, 1 Jan 2013
Innovations in mobile computing and communications will continue to be a driving factor for the semiconductor equipment industry.

Key market and technology trends in the sub-20nm era

Thu, 1 Jan 2013
Keeping up with Moore’s Law has always required significant investment and ingenuity, and this era brings additional challenges in device structures, materials and methodologies.

Keys to success: Testing in the New Mobile World

Thu, 1 Jan 2013
The semiconductor industry is moving from a PC-centric, digital era to a communication and mobile world.

North Carolina State University to lead research consortium on power electronics

Thu, 1 Jan 2014
Called the Next Generation Power Electronics Institute, the new consortium will provide shared facilities, equipment and testing to companies from the power electronics industry, focusing and small and medium-sized companies.

Executives debate innovation drivers and cost reduction in microelectronics supply chain

Thu, 2 Feb 2014
The closing Executive Panel discussion at the SEMI Industry Strategy Symposium on January 15 provoked diverse views on the drivers and future of innovation in the microelectronics manufacturing supply chain.

Imec and Holst Centre demonstrate low-power ECG-acquisition chip at ISSCC 2014

Wed, 2 Feb 2014
At this week’s International Solid State Circuits Conference (ISSCC2014), imec and Holst Centre, together with Olympus, demonstrated a low-power single channel implantable electrocardiography (ECG) acquisition chip with analog feature extraction, which enables precise monitoring of the signal activity in a selected frequency band.

SiC & GaN power semiconductors leads power discrete market by 2018

Tue, 2 Feb 2014
Analysts at ReportsNReports forecast the Global Power Discrete market to grow at a CAGR of 8.43% over the period 2013-2018.

International Rectifier opens ultra-thin wafer processing facility in Singapore

Mon, 2 Feb 2014
International Rectifier, IR, today announced that the company has commenced initial production at its new ultra-thin wafer processing facility in Singapore (IRSG).

Renesas Electronics embeds the largest Flash and SRAM together

Wed, 2 Feb 2014
Renesas Electronics Corporation today unveiled the RX64M Group of microcontrollers (MCUs), its first product in the flagship RX Family of 32-bit MCUs to be fabricated in a 40nm process.

Silicon Labs acquires low-power analog IC products

Tue, 3 Mar 2014
Silicon Labs today announced the purchase of the full product portfolio and intellectual property of California-based Touchstone Semiconductor Inc.

Silicon Innovation Forum to expand in 2014

Thu, 3 Mar 2014
Coordinated by SEMI, the Silicon Innovation Forum is organized by leading strategic investment groups in the global semiconductor industry including: Applied Ventures, Dow Ventures, Intel Capital, Micron Ventures, TEL Venture Capital, BASF Ventures, and Samsung Ventures.

EV Group establishes China headquarters in Shanghai

Tue, 3 Mar 2014
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has opened a new, wholly owned subsidiary in Shanghai, called EV Group China Ltd.

GaN-on-Si enables GaN power electronics, will LED transition as well?

Wed, 3 Mar 2014
Today, GaN on Sapphire is the main stream technology for LED manufacturing. GaN-on-Si technology appeared naturally as an alternative to sapphire to reduce cost.

M+W Group and Siemens to collaborate on process control technology solution for battery production

Wed, 3 Mar 2014
Siemens Industry Automation Division and M+W Group have joined forces with the aim to advance the development of production technology for battery manufacturing and develop a complete control technology solution for the mass production of large-size batteries.

SureCore's 28nm silicon tests confirm world leading power efficiency

Tue, 4 Apr 2014
SureCore Ltd has today announced that early testing of its innovative low power SRAM design confirms its simulations that deliver in excess of 50 percent power savings over other SRAM technologies.

The sustainable manufacturing imperative

Thu, 4 Apr 2014
While sometimes seen as a social, legal and regulatory obligation, sustainability is increasingly considered a differentiating factor in global competitiveness relative to the technologies and products being provided.

ROHM Semiconductor and imec join forces for ultra-low power radio R&D

Mon, 4 Apr 2014
Nanoelectronics research center imec and ROHM Semiconductor Co. Ltd., a world-leading supplier of electronic components, announced today that they have entered into a strategic partnership for research collaboration on ultra-low power (ULP) radio technology for small battery-operated wireless devices.

SEMI announces Innovation Village at SEMICON Europa 2014

Wed, 4 Apr 2014
After the successful premier of a program to connect early-stage companies with strategic investors and venture capitalists (VCs) in the U.S., SEMI is expanding the program to Europe as part of SEMICON Europa 2014 in Grenoble, France (October 7-9).

SEMI announces 2nd Vietnam Semiconductor Strategy Summit

Fri, 4 Apr 2014
Following the successful inaugural event in 2013, the 2nd annual SEMI Vietnam Semiconductor Strategy Summit will be held September 16-17, 2014 at the InterContinental Asiana Saigon Hotel in Ho Chi Minh City.