power-electronics

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EU project to industrialize world record high-density capacitors

Wed, 10 Oct 2013
CEA-Leti, Fraunhofer IPMS-CNT and three European companies have launched a two-year project to industrialize 3D integrated capacitors with world-record density using atomic layer deposition.

Power modules get their own upside-down C-SAM system

Thu, 12 Dec 2013
Sonoscan has shipped the first of its new D9600Z C-SAM systems. This new model is designed expressly to facilitate the imaging of IGBT (Insulated Gate Bipolar Transistor) power modules.

Low-power tunneling transistor for high-performance devices at low voltage

Thu, 12 Dec 2013
A new type of transistor that could make possible fast and low-power computing devices for energy-constrained applications such as smart sensor networks, implantable medical electronics and ultra-mobile computing is feasible, according to Penn State researchers.

Book-to-bill: Year-end activity substantially stronger compared to last year

Fri, 12 Dec 2013
North America-based manufacturers of semiconductor equipment posted $1.24 billion in orders worldwide in November 2013 (three-month average basis) and a book-to-bill ratio of 1.11.

IDT introduces industry’s first single-chip 5V wireless power transmitter solution

Tue, 1 Jan 2014
Integrated Device Technology, Inc. today announced the industry’s first Qi-compliant single-chip wireless power transmitter solution supporting a 5V input.

Slideshow: CES 2014 Highlights

Fri, 1 Jan 2014
This week in Las Vegas, the 2014 International Consumer Electronics Show focused on the Internet of Things, displaying many connected gadgets and services.

6) ZAGG Inc introduces new range of portable batteries and power products

Sun, 1 Jan 2010

Battery development may extend range of electric cars

Mon, 1 Jan 2014
It's known that electric vehicles could travel longer distances before needing to charge and more renewable energy could be saved for a rainy day if lithium-sulfur batteries can just overcome a few technical hurdles.

EV Group ships temporary bonding/debonding system to Fraunhofer ISIT

Tue, 1 Jan 2014
EV Group today announced that the Fraunhofer Institute for Silicon Technology (ISIT) has purchased an EVG 850TB/DB fully automated bonding/debonding equipment solution.

Imec celebrates 30 years

Tue, 1 Jan 2014
Nanotechnology research and development center imec, today announced the celebration of its 30th anniversary.

Cyclical upturn continues in 2014: Positive yet cautious expectations persist

Thu, 1 Jan 2013
In 2013, the IC industry emerged from a difficult 5-year period of minimal growth and started on its next cyclical upturn, a welcome piece of news.

Outlook for semiconductors and the value chain in 2014

Thu, 1 Jan 2013
We approach 2014 with a combination of positive policy, financial, and economic forces that will push world growth up to a +3% range.

Coming year promises increased capital spending and continued need for effective industry collaboration

Thu, 1 Jan 2013
For most of the past 15 years, the industry has displayed a fairly predictable pattern of fab equipment spending, characterized generally by two years of decline followed by two years of positive growth.

The shift to materials-enabled 3D

Thu, 1 Jan 2013
Innovations in mobile computing and communications will continue to be a driving factor for the semiconductor equipment industry.

Key market and technology trends in the sub-20nm era

Thu, 1 Jan 2013
Keeping up with Moore’s Law has always required significant investment and ingenuity, and this era brings additional challenges in device structures, materials and methodologies.

Keys to success: Testing in the New Mobile World

Thu, 1 Jan 2013
The semiconductor industry is moving from a PC-centric, digital era to a communication and mobile world.

North Carolina State University to lead research consortium on power electronics

Thu, 1 Jan 2014
Called the Next Generation Power Electronics Institute, the new consortium will provide shared facilities, equipment and testing to companies from the power electronics industry, focusing and small and medium-sized companies.

Executives debate innovation drivers and cost reduction in microelectronics supply chain

Thu, 2 Feb 2014
The closing Executive Panel discussion at the SEMI Industry Strategy Symposium on January 15 provoked diverse views on the drivers and future of innovation in the microelectronics manufacturing supply chain.

Imec and Holst Centre demonstrate low-power ECG-acquisition chip at ISSCC 2014

Wed, 2 Feb 2014
At this week’s International Solid State Circuits Conference (ISSCC2014), imec and Holst Centre, together with Olympus, demonstrated a low-power single channel implantable electrocardiography (ECG) acquisition chip with analog feature extraction, which enables precise monitoring of the signal activity in a selected frequency band.

SiC & GaN power semiconductors leads power discrete market by 2018

Tue, 2 Feb 2014
Analysts at ReportsNReports forecast the Global Power Discrete market to grow at a CAGR of 8.43% over the period 2013-2018.

International Rectifier opens ultra-thin wafer processing facility in Singapore

Mon, 2 Feb 2014
International Rectifier, IR, today announced that the company has commenced initial production at its new ultra-thin wafer processing facility in Singapore (IRSG).

Renesas Electronics embeds the largest Flash and SRAM together

Wed, 2 Feb 2014
Renesas Electronics Corporation today unveiled the RX64M Group of microcontrollers (MCUs), its first product in the flagship RX Family of 32-bit MCUs to be fabricated in a 40nm process.

Silicon Labs acquires low-power analog IC products

Tue, 3 Mar 2014
Silicon Labs today announced the purchase of the full product portfolio and intellectual property of California-based Touchstone Semiconductor Inc.

Silicon Innovation Forum to expand in 2014

Thu, 3 Mar 2014
Coordinated by SEMI, the Silicon Innovation Forum is organized by leading strategic investment groups in the global semiconductor industry including: Applied Ventures, Dow Ventures, Intel Capital, Micron Ventures, TEL Venture Capital, BASF Ventures, and Samsung Ventures.

EV Group establishes China headquarters in Shanghai

Tue, 3 Mar 2014
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has opened a new, wholly owned subsidiary in Shanghai, called EV Group China Ltd.

GaN-on-Si enables GaN power electronics, will LED transition as well?

Wed, 3 Mar 2014
Today, GaN on Sapphire is the main stream technology for LED manufacturing. GaN-on-Si technology appeared naturally as an alternative to sapphire to reduce cost.

M+W Group and Siemens to collaborate on process control technology solution for battery production

Wed, 3 Mar 2014
Siemens Industry Automation Division and M+W Group have joined forces with the aim to advance the development of production technology for battery manufacturing and develop a complete control technology solution for the mass production of large-size batteries.

SureCore's 28nm silicon tests confirm world leading power efficiency

Tue, 4 Apr 2014
SureCore Ltd has today announced that early testing of its innovative low power SRAM design confirms its simulations that deliver in excess of 50 percent power savings over other SRAM technologies.

The sustainable manufacturing imperative

Thu, 4 Apr 2014
While sometimes seen as a social, legal and regulatory obligation, sustainability is increasingly considered a differentiating factor in global competitiveness relative to the technologies and products being provided.

ROHM Semiconductor and imec join forces for ultra-low power radio R&D

Mon, 4 Apr 2014
Nanoelectronics research center imec and ROHM Semiconductor Co. Ltd., a world-leading supplier of electronic components, announced today that they have entered into a strategic partnership for research collaboration on ultra-low power (ULP) radio technology for small battery-operated wireless devices.

SEMI announces Innovation Village at SEMICON Europa 2014

Wed, 4 Apr 2014
After the successful premier of a program to connect early-stage companies with strategic investors and venture capitalists (VCs) in the U.S., SEMI is expanding the program to Europe as part of SEMICON Europa 2014 in Grenoble, France (October 7-9).

SEMI announces 2nd Vietnam Semiconductor Strategy Summit

Fri, 4 Apr 2014
Following the successful inaugural event in 2013, the 2nd annual SEMI Vietnam Semiconductor Strategy Summit will be held September 16-17, 2014 at the InterContinental Asiana Saigon Hotel in Ho Chi Minh City.

Julian Styles of GaN Systems elected to board of Power Electronics Industry Collaborative

Fri, 4 Apr 2014
GaN Systems, a developer of gallium nitride power switching semiconductors, has announced that Julian Styles, Director of Business Development USA, has been elected to the Board of the Power Electronics Industry Collaborative (PEIC).

Dow Corning launches power electronics industry's first SiC wafer grading structure

Mon, 5 May 2014
Dow Corning today established a higher industry standard for silicon carbide (SiC) crystal quality by introducing a product grading structure that specifies ground-breaking new tolerances on killer device defects, such as micropipe dislocations (MPD), threading screw dislocations (TSD) and basal plane dislocations (BPD).

First quarter semiconductor trends and update

Thu, 5 May 2014
Given the slow economic growth in the U.S. during the first quarter, coupled with challenging geo-political developments around the world,uncertainty once again permeates the industry outlook for the year.

New low-stress silicone encapsulant from Dow Corning

Tue, 5 May 2014
Dow Corning today introduced Dow Corning EE-3200 Low-Stress Silicone Encapsulant – the latest addition to its portfolio of advanced solutions designed to expand performance and durability of solar micro-inverters, power optimizers and other high value components.

Mentor Graphics launches MicReD industrial power tester for power cycle testing of electronic components

Tue, 5 May 2014
Mentor Graphics Corporation today announced the new MicReD Industrial Power Tester 1500A for power cycling and thermal testing of electronics components to simulate and measure lifetime performance.

Element Six's GaN-on-diamond wafers proven to provide three times improvement in power density in RF devices

Wed, 5 May 2014
Element Six today announced that its Gallium Nitride (GaN)-on-Diamond wafers have been proven by Raytheon Company to significantly outperform industry standard Gallium Nitride-on-Silicon Carbide (GaN-on-SiC) in RF devices.

Transphorm obtains exclusive licensing rights to Furukawa Electric's GaN patent portfolio

Wed, 5 May 2014
Transphorm Inc. today announced that it has obtained a sole worldwide license to Furukawa Electric Co., Ltd.'s extensive Gallium Nitride (GaN) power device portfolio that includes approximately 40 U.S. issued patents and 110 Japanese issued patents.

New policy helps combat counterfeit semiconductors

Wed, 5 May 2014
A newly finalized Department of Defense (DoD) rule reduces the risk of counterfeit semiconductor products being used by our military by implementing needed safeguards in the procurement of semiconductors and other electronic parts.

Improving financial predictability – is it chasing a mirage?

Thu, 5 May 2014
There is continued evidence that despite spending several millions on IT transformations, improving internal planning processes, maturing supply chains, and streamlining product development processes- several companies still struggle with predicting their financial and operational performance.

Domestic outsourcing: A key component in successful reshoring

Fri, 5 May 2014
After nearly a quarter of a century, the off-shoring manufacturing trend that decimated the U.S. manufacturing sector and played a significant role in the slow pace of the current economic recovery seems to be ending.

SMIC and other groups collaborate to setup the "IC Advanced Technology Research Institute"

Mon, 5 May 2014
China's, largest and most advanced semiconductor foundry, today announced that SMIC, Wuhan Xinxin, Tsinghua University, Beijing University, Fudan University and the Chinese Academy of Sciences and Microelectronics have collaborated to setup the "IC Advanced Technology Research Institute" to create the most advanced IC technology research and development institution in China.

Increase in first quarter 2014 silicon wafer shipments

Tue, 5 May 2014
Worldwide silicon wafer area shipments increased during the first quarter 2014 when compared to fourth quarter 2013 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Top 10 power supply vendors vie in tumultuous market; rankings shift for the year

Wed, 5 May 2014
The global market for AC-DC and DC-DC power supplies rose by a modest 2.4 percent last year, but much of this growth was limited to specific markets, leading to some substantial shifts in the rankings of major players.

ON Semiconductor introduces new family of low voltage power MOSFETs

Tue, 5 May 2014
ON Semiconductor has introduced a new family of six N-channel MOSFETS that have been designed and optimized to deliver efficiency.

IEDM announces 2014 Call for Papers

Wed, 5 May 2014
The 60th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

Global semiconductor leaders develop plan to promote worldwide industry growth

Wed, 5 May 2014
The Semiconductor Industry Association (SIA) today announced that global semiconductor industry leaders reached an agreement at the 18th annual meeting of the World Semiconductor Council (WSC) last week on a series of policy proposals to strengthen the industry through international cooperation.

Osamu Nakamura named President of SEMI Japan

Tue, 6 Jun 2014
Nakamura will succeed Yoichi Nakagawa, who is retiring from SEMI.

Synopsys, STMicroelectronics and Samsung to collaborate on adoption of 28nm FD-SOI technology

Wed, 6 Jun 2014
Synopsys, Inc. today announced it has extended its collaboration with STMicroelectronics to include Samsung Electronics, enabling broader market adoption of ST's 28nm FD-SOI technology for SoC design.

First automotive MCU manufactured using GlobalFoundries' 55nm automotive-specific platform

Wed, 6 Jun 2014
Scaleo chip, the fabless semiconductor company in automotive electronics for powertrain, body control and driver-information, has used the GLOBALFOUNDRIES 55nm eFlash NVM Platform to develop a new family of microcontrollers.

Strengthening recovery: Fab equipment spending - 24% increase in 2014, possible record in 2015

Wed, 6 Jun 2014
After two years of decline, fab equipment spending is expected to increase 24 percent in 2014 and about 11 percent (US$39.5 billion).

Wireless infrastructure drives RF power semiconductor markets to well over $1B in 2013

Wed, 6 Jun 2014
Spending on RF power semiconductors for the wireless infrastructure markets has taken another jump in 2013.

Dow Corning launches power electronic industry's first SiC wafer grading structure

Wed, 6 Jun 2014
Dow Corning today established a higher industry standard for silicon carbide (SiC) crystal quality by introducing a product grading structure that specifies ground-breaking new tolerances on killer device defects.

Industry sustainability efforts mount with III-Vs and other advanced technologies

Thu, 6 Jun 2014
The introduction of new materials, such as III-Vs, into high-volume manufacturing of semiconductors, likely will occur sometime around the 7nm and/or 5nm nodes.

200mm equipment market gaining new lease on life

Mon, 6 Jun 2014
In 2004/2005, shipments of 300mm wafer fab equipment (WFE) began to outpace that of 200mm platforms.

The GaN power industry is consolidating in preparation for significant growth

Tue, 6 Jun 2014
The power supply/PFC segment will dominate the business from 2015-2018, ultimately representing 50 percent of device sales. At that point, automotive will then catch-up.

SEMI releases first quarter 2014 worldwide PV equipment market report

Wed, 6 Jun 2014
Bookings recover for second consecutive quarter; above parity for first time since 2011

UC Riverside to lead new energy frontier research center project

Wed, 6 Jun 2014
SHINES will investigate several aspects of basic research: new ultrathin films, nanostructured composites, high resolution imaging, the transport of electrical signals, heat and light.

Subatmospheric gas storage and delivery: Past, present and future

Thu, 6 Jun 2014
Storing gas on a sorbent provides an innovative, yet simple and lasting solution.

ConFab panelists discuss optimizing R&D in the changing semi landscape

Tue, 6 Jun 2014
Overheard @The ConFab: “I feel the best I’ve felt about semi since 2009.” –Mike Noonen, Silicon Catalyst

Gopal Rao at The ConFab: Scaling isn’t enough anymore

Wed, 6 Jun 2014
The core element of the semiconductor industry’s roadmap has been scaling – but Gopal Rao believes that isn’t enough anymore.

Internet of Things: big numbers, many opportunities

Thu, 7 Jul 2014
Whatever forecast one uses for the future of the Internet of Things in terms of connected objects or business opportunities, the IoT will be big.

SEMI and Solid State Technology announce the 2014 “Best of West” Award finalists

Tue, 7 Jul 2014
Each year at SEMICON West, the largest and most influential microelectronics exposition in North America, the “Best of West” awards are presented by Solid State Technology and SEMI. The award was established to recognize contributors moving the industry forward with their technological developments in the microelectronics supply chain.

SEMI forecasts double-digit business growth in 2014, 2015

Wed, 7 Jul 2014
The worldwide semiconductor capital equipment market is forecast to increase 20.8 percent this year to $38.44 billion, compared with 2013’s $31.82 billion, and another 10.8 percent in 2015 to $42.6 billion, according to Semiconductor Equipment and Materials International.

IBM announces $3B research initiative

Tue, 7 Jul 2014
IBM announced it is investing $3 billion over the next 5 years in two broad research and early stage development programs to push the limits of chip technology needed to meet the emerging demands of cloud computing and Big Data systems.

Power supply market to grow by $3.5B in four years

Wed, 7 Jul 2014
The global market outlook for AC-DC and DC-DC power supplies is set for healthy expansion starting this year until at least 2018, with revenue during these four years projected to grow by $3.5 billion.

Allegro MicroSystems announces new silicon carbide Schottky barrier diode FMCA series

Tue, 7 Jul 2014
Allegro MicroSystems, LLC announces the release of the next generation series of silicon carbide Schottky barrier diodes.

SEMI announces new South America Semiconductor Strategy Summit

Tue, 7 Jul 2014
SEMI today announced the launch of the association's first-ever event in Latin America.

Compact vibration harvester power supply with highest efficiency opens door to “Fix-and-Forget” sensor nodes

Wed, 7 Jul 2014
OMRON and Holst Centre/imec have unveiled a prototype of an extremely compact vibrational energy harvesting DC power supply with worlds’ highest efficiency.

Can lean innovation bring growth and profits back to semiconductors?

Fri, 7 Jul 2014
New approaches to start-ups can unlock mega-trend opportunities.

Harnessing big data

Mon, 7 Jul 2014
Addressing the analytics challenges in supply chain management.