prepared-by-editor-news

Topic Index

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z 0-9


Kateeva receives $38 million in financing

Mon, 9 Sep 2014
Kateeva announced that it has closed its Series D round with $38 million in financing. The newest participant is Samsung Venture Investment Corporation (SVIC).

IBM breaks record with silicon nanowire MOSFET

Fri, 10 Oct 2013
IBM devices with a 90nm gate pitch demonstrated the highest performance ever reported for a SiNW device at a gate pitch below 100 nm.

High mobility InGaAs MOSFETs get triangular

Tue, 10 Oct 2013
A research team in Japan has built a triangular InGaAs-on-insulator n-MOSFETs using MOVPE that has a high on-current of 930 µA/µm.

Jordan Valley lands order for FEOL tool

Tue, 10 Oct 2013
Jordan Valley Semiconductors Ltd. received another order for its recently introduced JVX7300LMI scanning X-ray in-line metrology tool for patterned and blanket wafers

IBM develops sub-20nm nanofluidic channels for lab-on-chip

Tue, 10 Oct 2013
At IEDM, IBM researchers will report on a CMOS-compatible 200 mm wafer-scale sub-20nm nanochannel fabrication method that enables stretching, translocation and real-time fluorescence microscopy imaging of single DNA molecules.

Grant funds development of improved nanoscale additive manufacturing

Tue, 10 Oct 2013
A new Department of Energy grant will fund research to advance an additive manufacturing technique for fabricating three-dimensional (3D) nanoscale structures from a variety of materials. Using high-speed, thermally-energized jets to deliver both precursor materials and inert gas, the research will focus on dramatically accelerating growth, improving the purity and increasing the aspect ratio of the 3D structures.

35 European start-ups showcased at SEMICON Europa’s Innovation Village

Mon, 9 Sep 2014
35 major European start-ups will participate in the Innovation Village and present their new technologies at SEMICON Europa.