Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business development director, Lode Lauwers, on why 450mm is important for Europe, and the status of 450mm research on processes and devices.
The seminar is an ideal fit for anyone interested in characterizing and communicating the light and color properties of LED’s accurately.
This webinar will provide an introduction to miniature auto-focus camera technology and voice coil motors.
As the industry is incorporating more MEMS devices with integrated magnetic sensors, they are encountering challenges that cannot be overcome with existing toolsets. The deposition and magnetic alignment of these materials are critical for proper device performance and require special hardware configurations and process optimization.
As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more demanding of all the variable parameters on a process tool, including process gas accuracy. Cutting down on variability in the process positively impacts productivity and yield.
This webcast will explore the present status of 2.5 and 3D integration, including TSV formation.
It will also show some new multi-die DRAM package structures designed to offer improved electrical performance using the existing manufacturing infrastructure.
Hear (and see!) what industry experts at the SPIE Microlithography Conference have to say about extending immersion, the readiness of EUV, and other topics.
Lithographers, maskmakers, and chemists have made great strides in identifying challenges and pursuing solutions that are expected to extend immersion lithography - perhaps to the 32nm half-pitch. Some of the topics our guests tackled include double patterning, CD overlay, using polarized light for specific orientations of features, and its impact on layout design. Guests' impressions of industry's progress in moving EUV along as a viable and cost-effective chip production technology are also shared with viewers, along with opinions about the important developments and papers at the show.
This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL process steps. An additional challenge is that the reduction in device size and an increase in device topography makes the removal of small particles even more challenging.