Topic Index

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z 0-9

Fan-out Wafer Level Packaging (FOWLP)

Thu, 12 Dec 2015
Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets.

Chemical Vapor Deposition

Fri, 12 Dec 2015
Chemical vapor deposition (CVD) is used to produce high-purity thin films.

Chemical Mechanical Planarization

Fri, 12 Dec 2015
In chemical mechanical planarization (CMP), the top surface of the wafer is polished or planarized to create a flat surface.

Atomic Layer Deposition

Fri, 12 Dec 2015
ALD is a technique capable of depositing a variety of thin film materials from the vapor phase.


Fri, 12 Dec 2015
“Dry” (plasma) etching is used for circuit-defining steps, while “wet” etching (using chemical baths) is used mainly to clean wafers.

Ion Implantation

Fri, 12 Dec 2015
Ion implantation is a materials engineering process by which ions of a material are accelerated in an electrical field and directed into the wafer, typically to form the source and drain regions of the transistor.

Mass Flow Controllers

Fri, 12 Dec 2015
In plasma-etch, chemical vapor deposition and many other processes, accurate metering of gas flow into the process chamber is critical.

Vacuum Pumps

Fri, 12 Dec 2015
Many semiconductor manufacturing process steps require a mid- to high-level of vacuum in the process chamber to operate effectively.

Wet Processing and Wafer Cleaning

Fri, 12 Dec 2015
Wet Processing, including wafer cleaning, is one of the most common yet most critical processing steps in semiconductor manufacturing, since it can have a huge impact on the success of the subsequent process step.

Cryogenic Vacuum Pumps

Wed, 12 Dec 2015
The cryopump provides fast, clean pumping of all gases in the mid- to high-vacuum range.

CVD Source Materials

Thu, 12 Dec 2015
Reaction materials for chemical vapor deposition are typically delivered into the chamber in a gaseous form. The source materials can be gases or liquids.


Wed, 1 Jan 2016
Lithography is used to create a pattern on the wafer.

Automated Test Equipment

Wed, 1 Jan 2016
Automatic or automated test equipment (ATE) is a system that performs tests on a device, known as the Device Under Test (DUT), using automation to quickly perform measurements and evaluate the test results.


Wed, 1 Jan 2016
Semiconductor manufacturing facilities or wafer “fabs” are huge affairs costing billions of dollars.


Fri, 12 Dec 2015
A variety of gases are used in semiconductor manufacturing for process reactions in chemical vapor deposition, etching, ion implantation and many other processes.


Fri, 12 Dec 2015
Beyond the wafers themselves, the semiconductor industry employs thousands of different kinds of materials.

Packaging Materials

Fri, 12 Dec 2015
According to a newly released report from SEMI and TechSearch International, the $18 billion semiconductor packaging materials market will undergo steady single-digit unit volume growth for many material segments through 2019, including laminate substrates, IC leadframes, underfill, and copper wire.

Nova selected by a leading foundry for its most advanced 10nm and 7nm FinFET nodes

Tue, 2 Feb 2016
Nova Measuring Instruments, a provider of metrology solutions for advanced process control used in semiconductor manufacturing, announced today that a leading foundry recently selected Nova's optical and X-ray metrology solutions for multiple process steps.

North American semiconductor equipment industry posts January 2016 book-to-bill Ratio of 1.08

Wed, 2 Feb 2016
A book-to-bill of 1.08 means that $108 worth of orders were received for every $100 of product billed for the month.

Global semiconductor sales off to sluggish start in 2016

Fri, 3 Mar 2016
The Semiconductor Industry Association today announced worldwide sales of semiconductors reached $26.9 billion for the month of January 2016, 2.7 percent lower than the previous month's total of $27.6 billion and 5.8 percent down from the January 2015 total of $28.5 billion.

SEMI reports 2015 global semiconductor equipment sales of $36.5B

Tue, 3 Mar 2016
SEMI today reported that worldwide sales of semiconductor manufacturing equipment totaled $36.53 billion in 2015, representing a year-over-year decrease of 3 percent.

CyberOptics showcases high-precision humidity measurement sensor at SEMICON China

Tue, 3 Mar 2016
CyberOptics Corporation, a global developer and manufacturer of high precision 3D sensing technology solutions, will showcase WaferSense and ReticleSense Auto Multi Sensors (AMS) at SEMICON China, March 15-17, 2015 in the PSC and KNG booth #3358 and the Winifred booth #1461.

A new class of MFCs with embedded flow diagnostics

Thu, 3 Mar 2016
Recent trends in multi-sensor measurements within a mass flow controller are reviewed, with a focus on controller self-diagnostics.

Worldwide semiconductor wafer-level manufacturing equipment market declined 1% in 2015

Wed, 4 Apr 2016
Worldwide semiconductor wafer-level manufacturing equipment revenue totaled $33.6 billion in 2015, a 1 percent decline from 2014, according to final results by Gartner, Inc.

Samco increases local sales staff for North American, European and Asian locations

Thu, 4 Apr 2016
Samco, a Japan-based semiconductor process equipment developer and manufacturer, is employing around 20 more people at its locations in North America, China, Taiwan and Singapore, as well as its subsidiary Samco-UCP in Liechtenstein.

North American semiconductor equipment industry posts March 2016 book-to-bill ratio of 1.15

Fri, 4 Apr 2016
Order activity remains steady and is on par with both the previous quarter and one year ago.

ClassOne announces major savings with Solstice gold plating

Thu, 6 Jun 2016
ClassOne Technology, manufacturer of budget-friendly wet processing equipment, is reporting significant savings in the plating of gold in ≤200mm applications using its Solstice systems.

Global semiconductor sales increase slightly in March

Fri, 5 May 2016
The Semiconductor Industry Association (SIA) this week announced worldwide sales of semiconductors reached $26.1 billion for the month of March 2016, a slight increase of 0.3 percent compared to the previous month's total of $26.0 billion.

Busch wins annual NXP Semiconductors Best Supplier Award

Wed, 5 May 2016
NXP Semiconductors N.V. announced Busch Semiconductor Vacuum Group LLC as the Best Supplier for Front-end equipment (semiconductor equipment) at NXP’s first Supplier Day Awards ceremony in Austin, Texas.

Equipment spending up: 19 new fabs and lines to start construction

Fri, 6 Jun 2016
While semiconductor fab equipment spending is off to a slow start in 2016, it is expected to gain momentum through the end of the year. For 2016, 1.5 percent growth over 2015 is expected while 13 percent growth is forecast in 2017.

Samco boosts shipment capacity with second production center

Tue, 6 Jun 2016
Samco, a Japan-based semiconductor processing equipment manufacturer, held a completion ceremony for its second production center on June 17.

Nitrous oxide no laughing matter

Wed, 7 Jul 2016
N2O, or Nitrous Oxide, also known as laughing gas, is a weak anesthetic gas that has been in use since the late 18th century.

Lam Research enables next-generation memory with industry's first ALD process for low-fluorine tungsten fill

Tue, 8 Aug 2016
Lam Research Corp. (NASDAQ: LRCX), an advanced manufacturer of semiconductor equipment, today introduced an atomic layer deposition (ALD) process for depositing low-fluorine-content tungsten films, the latest addition to its ALTUS family of products.

Cabot Microelectronics appoints Thomas F. Kelly as VP of Corporate Development

Fri, 9 Sep 2016
Cabot Microelectronics Corporation announced the appointment of Thomas F. Kelly, Vice President, Corporate Development, which is effective as of September 6, 2016.

Lam Research introduces dielectric atomic layer etching capability for advanced logic

Wed, 9 Sep 2016
Lam Research Corp., an advanced manufacturer of semiconductor equipment, today announced that it is expanding its atomic layer etching (ALE) portfolio with the addition of ALE capability on its Flex dielectric etch systems.

Managing particle flows in process exhaust for safety and profitability

Fri, 10 Oct 2016
Solid particles in the abatement exhaust must be properly managed, and in some cases, substantially reduced from the gas stream before it is released into the environment.

Murphy, Choh and Pilla join ClassOne Technology's Board of Advisors

Thu, 12 Dec 2016
ClassOne Technology, manufacturer of advanced wet processing equipment for ≤200mm substrates, announced the formation of a Board of Advisors.

North American semiconductor equipment industry posts November 2016 book-to-bill ratio of 0.96

Fri, 12 Dec 2016
A book-to-bill of 0.96 means that $96 worth of orders were received for every $100 of product billed for the month.

Executive viewpoints: 2017 outlook

Wed, 1 Jan 2017
Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2017.

SEMI appoints Ajit Manocha as president and CEO

Tue, 2 Feb 2017
SEMI today announced the appointment of Ajit Manocha as its president and CEO.

ClassOne initiative aims to reduce CoO in ≤200mm copper plating

Wed, 2 Feb 2017
ClassOne Technology announced a new company-wide initiative to reduce costs of operation (CoO) in copper plating processes.

Global MEMS manufacturer selects ULVAC Technologies' plasma ashing system

Wed, 3 Mar 2017
ULVAC Technologies, Inc. has been selected by a global MEMS inertial sensor manufacturer to deliver an ULVAC ENVIRO-1Xa advanced plasma ashing system for running critical low-temp descum processes and high-temp bulk photoresist strip processes.

Record spending for fab equipment expected in 2017 and 2018

Tue, 3 Mar 2017
Today, SEMI announced updates to its World Fab Forecast report, revealing that fab equipment spending is expected to reach an industry all-time record − more than US$46 billion in 2017.

EVG breaks speed and accuracy barrier in mask alignment lithography for semiconductor packaging

Wed, 3 Mar 2017
New IQ Aligner NT achieves double throughput and alignment accuracy over previous-generation platform; opens up new applications for EVG lithography solutions.

3D-Micromac receives large volume orders from solar industry for its microCELL TLS system

Tue, 4 Apr 2017
3D-Micromac AG today announced that the total received order volume for its microCELL TLS high-throughput half-cell cutting tools tops 1.5 GW for tool deliveries in 2017 to date.

Global semiconductor wafer-level equipment revenue to grow 11% in 2016

Thu, 4 Apr 2017
Worldwide semiconductor wafer-level manufacturing equipment (WFE) revenue totaled $37.4 billion in 2016, an 11.3 percent increase from 2015, according to final results by Gartner, Inc.