sst-leds

Topic Index

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z 0-9


X-ray Inspection: Evolution from Microfocus to Nanofocus

Mon, 12 Dec 2003
Today's trend of increased miniaturization of components and packages is continuing in the electronics and micromechanics industries. Design and manufacturing technologies such as optoelectronics, microelectromechanical systems (MEMS) and micro-opto-electromechanical systems (MOEMS) are creating new application requirements and inspection needs.

K&S adds packaging know-how to low-k alliance

Wed, 5 May 2002
Dow Chemical Co. announced the addition of five new members to its SiLKnet Alliance, a collaboration working to create products and processes for low-k dielectric materials

Fast Moiré Interferometry

Thu, 8 Aug 2002
Semiconductor manufacturers are pressured these days to decrease the size of components while increasing their functionality

Series C Nets $17.5M

Tue, 3 Mar 2007
(March 27, 2007) SAN JOSE, CA — Discera Inc. completed a series C funding round with $17.5 million, led by Scale Venture Partners in Foster City, CA. The investment will be allocated to increasing production, distribution, and marketing. Discera concurrently announced a strategic partnership with distributor ABRACON.

Qimonda Expands Back-end Capacity

Fri, 3 Mar 2007
(March 9, 2007) MUNICH, Germany; SUZHOU, China; JOHOR, Malaysia; and THIEF RIVER FALLS, MN — Qimonda AG plans to expand its assembly-and-test facilities for memory ICs in the Suzhou Industrial Park, west of Shanghai. Growth in front-end capacities led to requisite back-end expansion, said Kin Wah Loh, president and CEO.

OLED Cross-licensing for Active Matrix Displays

Fri, 5 May 2007
(May 25, 2007) ROCHESTER, NY and TAINAN, Taiwan — Eastman Kodak Company (Rochester) will cross license its active matrix organic LED (OLED) intellectual property (IP) and manufacturing processes to Chi Mei Optoelectronics (CMO) and its subsidiary Chi Mei EL (CMEL), both based in the South Taiwan Science Park (Tainan). CMEL expects to use the technology for small-panel mobile displays.

LED Lab Optimizes Operating Parameters

Thu, 5 May 2007
(May 10, 2007) NEW YORK — TT electronics OPTEK Technology opened an in-house visible LED laboratory with resources to assess LED packages on junction temperature variation, optical performance, and other parameters. The lab aids in design, manufacturing, and test.

Intel Capital Invests in Phoenix Micro

Thu, 5 May 2007
(May 10, 2007) CARLSBAD, CA — Intel Capital, the venture capital branch of Intel Corporation, invested in six new companies, totaling $31 million. In the semiconductor space, Intel invested in China-based Phoenix Microelectronics.

July Book-to-Bill Tumbles to 0.84

Fri, 8 Aug 2007
(August 17, 2007) SAN JOSE, CA — The July book-to-bill for North America-based semiconductor equipment manufacturers fell to 0.84, reports SEMI. The book-to-bill has hovered around parity throughout 2007, but July saw lower order levels than any previous months in 2007, with a month-to-month drop of $167.6 million.

No Reprieve in Raw Metals Costs

Tue, 8 Aug 2007
(August 15, 2007) LONDON, NEW YORK and TOKYO — Data from the London Mercantile Exchange (LME) confirms that — at mid-year 2007 — copper, lead, and tin raw metal prices remain above 2006 levels. Leadframe materials, including copper and nickel, are hitting record prices, asserts The Nikkei Business Daily, which suggests that component manufacturers are resistant to absorbing the higher raw metals costs.

Job Shop Serves Emerging Markets

Fri, 8 Aug 2007
(August 10, 2007) MANCHESTER, NH — J P Sercel Associates (JPSA) expanded its contract manufacturing, job shop, and applications laboratory capabilities with various laser types, including infrared (IR) and "green" lasers for thin-film solar-panel manufacturing and other developing industries. The company also supplemented its DPSS and excimer laser capacity with more workstations, performing tasks such as wafer singulation and LED lift-off.

Flexible Circuit Substrate

Mon, 6 Jun 2007
Keratherm 86/77 flexible thermal circuit (FTC) comprises a thin, etchable copper layer bonded to a thermally conductive silicone film. It can be attached with thermally conductive adhesive to to non-linear, heat-spreading structures, and provides an electrically conductive bonding site for LEDs and other high-heat components.

Molded Ceramic Packages

Tue, 6 Jun 2007
MIL-STD-883-certified hermetic, the molded ceramic surface-mount packages are low profile and target aerospace, avionics, and telecom applications, packaging LEDs, MEMS, and optical devices.

$7M Raised for High-power LED Engines

Wed, 4 Apr 2007
(April 25, 2007) WESTHAMPTON, NJ — In series D funding, Lamina Ceramics, Inc., raised $7 million to fund expansion of its high-brightness, high-power LED business. Easton Capital Investment Group (New York and Florida) led the round.

Zuken Offers TI DSP Data to Package Engineers

Tue, 4 Apr 2007
(April 24, 2007) MUNICH, Germany and WESTFORD, MA — Zuken is supporting free footprint data for Texas Instruments' digital signal processor (DSP) products to CR-5000 users. The engineering consulting firm's Japanese, European, and American operations joined the TI DSP Third Party Network, increasing customer access to DSP designs.

Major MEMS Manufacturers Dominate Market Share

Thu, 4 Apr 2007
(April 19, 2007) LYON, France — Yole Développement compiled a list of major MEMS manufacturers globally, market drivers, and industry shifts in "Analysis: Top 30 MEMS Manufacturers." The top 30 represent 88% of the total MEMS industry, with $5.2B in 2006 sales. Minimum sales in the top ranking grew to $26 million, up from $15 million in 2005. Yole noted that military MEMS business is difficult to track, and may represent a larger portion of the industry than predicted.

LED Output Increases with 100-mm Dicing

Thu, 4 Apr 2007
(April 12, 2007) MANCHESTER, NH — A 100-mm sapphire wafer-dicing capability, developed on J.P. Sercel Associates' IX-200 Chromadice DPSS UV laser wafer-singulation system, reportedly increases LED yields by processing larger sapphire wafers than prior methods.

EoPlex Achieves 'Cool Vendor' Status

Wed, 4 Apr 2007
(April 11, 2007) REDWOOD CITY, CA — EoPlex Technologies has been named a "Cool Vendor" by Gartner, Inc. as part of the research company's 2007 report "Cool Vendors in Semiconductors, 2007". Gartner defines a Cool Vendor as a company that offers technologies or solutions that are innovative, impactful, and intriguing; having caught Gartner's interest or curiosity in the past six months.

Dense CNTs Viable 3D Interconnects

Thu, 6 Jun 2007
(June 14, 2007) TROY, NY — As part of research designed to manufacture carbon nanotubes (CNTs) as viable replacements for copper in 3D die-stacking applications, researchers at Rensselaer Polytechnic Institute have implemented a method for compacting CNTs into bundles, enabling better thermal and electrical conductivity. Densification occurs post-growth, allowing scientists to use a known, conventional CNT growth process. CNT density was increased 5–25× in the experiments.

OTB Display Produces Hermetic OLED Packages

Thu, 1 Jan 2007
(January 18, 2007) EINDHOVEN, The Netherlands — OTB Display, a subsidiary of OTB Group BV, created a method of producing thin-film-encapsulated organic light-emitting diode (OLED) devices for commercial applications. The process of multilayer thin-film stacking eliminates clean room equipment, facilitating mass production.

Automotive LED Manufacturer Selects Henkel Materials

Fri, 9 Sep 2007
(September 7, 2007) IRVINE, CA — Grote Industries selected a custom-formulated Hysol potting compound from Henkel to enable full automation at its 1-million-parts per year LED lamp assembly line. The compound met 19 engineering requirements for environmental friendliness, thermal conductivity, reliability, and other criteria, and will be deployed for use across 10 product families.

GE, TOKKI Incorporating Encapsulation into OLED Manufacture

Mon, 3 Mar 2007
(March 5, 2007) NISKAYUNA, N.Y. — GE Global Research and OLED-manufacturing equipment supplier TOKKI Corporation (Tokyo) partnered to use plasma enhanced chemical vapor deposition (PECVD) film encapsulation technology and manufacturing equipment to build organic electronics, such as OLED flat panel displays, in thinner and more cost-effective packages.

EoPlex Raises $8M to Expand Printed Circuitry Technology

Mon, 2 Feb 2007
(February 12, 2007) REDWOOD CITY, CA — EoPlex Technologies closed Series C financing with $8 million in investments, led by ATA Ventures. The company plans to expand design and manufacturing capacities, and increase its customer base, with the funding.

Wafer-bump, LED Cluster

Mon, 8 Aug 2007
An advanced coating cluster, the Gamma XPress suits gold bump coating, under bump metallization or redistribution coating, high-volume LED coating, and other film-development applications based on chosen configuration. It is said to shorten lead times with flexible production setup.

MILMEGA Puts Cree MESFETS in UHF Amplifiers

Wed, 8 Aug 2007
(August 29, 2007) DURHAM, NC — In a move to reduce form factor while increasing power of its UHF power amplifiers, MILMEGA Ltd. has chosen Cree silicon carbide (SiC) MESFETS to power its new line. Cree's SiC MESFETs are said to provide greater power density than conventional semiconductor materials, allowing for improved efficiency and more capabilities in a smaller form factor.

Rohm and Haas Receives SMIC Excellent Supplier Award

Tue, 8 Aug 2007
(August 28, 2007) PHEONIX, AZ — Semiconductor Manufacturing International Corporation honored Rohm and Haas Electronic Materials, CMP Technologies with the company's 2007 Excellent Supplier Award, recognizing the efforts of the four Rohm and Haas business units that support SMIC: CMP Technologies, Microelectronic Technologies, Packaging and Finishing Technologies and Ion Exchange Resins.

The Changing Role of the Materials Supplier

Sun, 12 Dec 2002
Electronics packaging materials suppliers traditionally have functioned as developers of continuously evolving formulations that enhance both component and assembly performance and reliability.

Thin wafers win majority in electronics by 2016

Thu, 10 Oct 2011

Thanks to MEMS, 3D packaging, LEDs, power devices, and other applications, thinned wafers will be the majority of wafers in the market by 2016, according to Yole D

Epson inkjet semiconductor marking system prevents die damage

Tue, 9 Sep 2011

Seiko Epson Corporation introduced the IP-2000 inkjet semiconductor marking system to print identification data on the surface of a semiconductor package without the danger of damage from laser cutting


Thermoelectric Cooler

Mon, 11 Nov 2008
The OptoCooler HV series, a new class of RoHS-compliant high voltage, heat pumping thermoelectric coolers, has been optimized for standard circuitry and power requirements. The OptoCooler HV14, the first module in the series, has been designed for the optoelectronics and telecom industry.

DuPont Teijin Films Joins Holst Centre Systems-in-Foil Research Program

Thu, 11 Nov 2008
(November 6, 2008) EINDHOVEN, the Netherlands — DuPont Teijin Films joined the systems-in-foil program of Holst Centre, a research initiative of the Flemish and Dutch research centers IMEC and TNO. DuPont Teijin, as a major substrate vendor, completes the ecosystem of industrial players for its systems-in-foil program line.

June Names in the News

Mon, 6 Jun 2008
(June 30, 2008) It was a month for names in the news as acquisitions and evolving business strategies inspired executive appointments and reorganization; industry organizations added members and directors, and books got published. Company announcements came in from JP Sercel Associates, TRUMPF, Dage Precision Industries, ECD, Jordan Valley, Rogers Corp., Formfactor, Unisem Group, Mentor Graphics, and Alchimer.

SEMICON Europe: Connecting Companies for 3D Interconnects

Fri, 10 Oct 2008
By Paul Collander, Poltronics, Inc. At the recent Advanced Packaging Conference at SEMICON Europe in Stuttgart, Germany, (October 7-9, 2008) Fran

Online Intervew: Paul Magill Recaps Nextreme's Cool Year

Wed, 10 Oct 2008
(October 29, 2008) DURHAM, NC —Time flies when you're having fun, or when you're getting a start-up off the ground. From the introduction of an enabling technology, through several rounds of funding, award of a grant, four product launches incorporating said technology, the construction and grand opening of a manufacturing facility, RoHS compliance, and ongoing plans for more, the past year has been peppered with notable events for Nextreme Thermal Solutions.

Protecting Brand Reputation

Fri, 8 Aug 2008
By Carsten Barth, Elcoteq
At this time of economic downturn and with reduced consumer confidence, the equity of a brand can be one critical factor in ensuring that sales and margins are maintained while lesser brands get squeezed. Brand equity can be a function of many things — image, price, innovation, tradition — but at the end of the day, they all boil down to reputation.

JPSA Partners with DynTest for Wafer Scriber/Breaker Development

Thu, 7 Jul 2008
(July 24, 2008) MANCHESTER, NH — J P Sercel Associates (JPSA) and DynTest Technologies of Grassau, Germany, have entered into a collaborative partnership reportedly to develop and manufacture high-precision scriber / breaker solutions for wafer singulation. DynTest specializes in precise, accurate, and efficient breaking systems, while JPSA specializes in high-speed, high-accuracy laser workstations for wafer scribing.

Henkel's Dixon at SEMICON West: Silver sintering, die-attach validation

Thu, 8 Aug 2011

Doug Dixon from Henkel explains two announcements the company made at SEMICON West: a silver sintering material that requires no pressure, and joint work with STMicroelectronics on conductive die attach films for very small package configurations.


LED packaging equipment for better throughput, quality, and yields

Thu, 8 Aug 2011

In these 2 video interviews from SEMICON West 2011, ESI technologists John Sabol and Vernon Cooke discuss what LED chips require on the back-end manufacturing line, starting at wafer scribing and moving on through test.


3D IC with TSV show significant advances in last 12 months

Tue, 7 Jul 2011

Dr. Phil Garrou summarizes the significant commercial strides made over the past 12 months in 3D IC integration -- as defined vs. other "3D" technologies -- thanks to the promised combination of low cost and high performance.


K&S high volume fine pitch Cu wire bonding

Wed, 2 Feb 2011

Figure. Copper transition and roadmap planning. SOURCE: Kulicke & SoffaAs gold becomes more expensive, copper wire bonding becomes more appealing for chip packaging. Reverse bonding, fine-pitch bonding, looping, second bonds, and other technologies are ramping on roadmaps, according to Kulicke & Soffa (K&S).


Intel Capital leads InVisage Series C venture funding

Tue, 2 Feb 2011

InVisage pixel capture as compared to traditional image sensors.InVisage Technologies, image sensor technology start-up, received its series C round of venture funding, led by Intel Capital. The undisclosed amount will be used to bring the company's quantum-dot-based QuantumFilm technology and products into mass production.


Palomar discusses high volume HB LED assembly at Strategies in Light

Fri, 2 Feb 2011

Palomar Technologies, precision microelectronics and optoelectronic packaging systems provider, will hold meetings at Stategies in Light to discuss its recent upgrades to high-brightness LED (HB-LED) assembly.


LED package sales to increase but revenues will stay flat until 2014

Mon, 6 Jun 2012

Displaybank published a 2009-2014 analysis of LED packages, the finished LED components used in various applications. While LED package units will grow steadily through the forecast period, revenues will remain mostly flat from 2010 to 2013.


Indium expands electronics materials manufacturing with new facility in NY

Wed, 5 May 2012

Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds.


Kulicke & Soffa expands Singapore HQ, bolsters bonder tool R&D and manufacturing

Wed, 5 May 2012

Kulicke & Soffa broke ground on its Singapore global headquarters expansion, near the current leased headquarters location. A state-of-the-art facility in Serangoon will bolster the company

Clarkson U tallies 1.4M support from Intel

Fri, 2 Feb 2011

During the past ten years, Clarkson University has received more than $1.4 million of direct and indirect (through Semiconductor Research Corporation) funding from Intel Corporation.


Chipscale packaging tech garners SEMI award

Mon, 1 Jan 2011

SEMI named Thomas DiStefano, John W. Smith Jr., and Michael Warner as recipients of the 2010 SEMI Award for North America for contributions to the development and commercialization of Micro Ball Grid Array (μBGA) technology.


CEA Leti IPDiA partner 3D integration for passives on Si

Mon, 3 Mar 2011

CEA-Leti and IPDiA have formed a common lab to capitalize on their complementary expertise in miniaturization and 3D integration on silicon. The common lab will develop very high-end passive components that will resist harsh environments, functional sub-mounts for LEDs, and assembly technologies.


KLAC packaged IC inspector ICOS CI T620

Tue, 3 Mar 2011

KLAC's ICOS CI-T620, a high-performance component inspector system for tape and reel.KLA-Tencor Corporation (Nasdaq: KLAC) introduced the ICOS CI-T620, a high-performance component inspector system for tape and reel. The CI-T620 system has dual tapers working sequentially with minimal operator intervention to increase units per hour.


LED packaging report reveals costs, reliability impact of package

Fri, 2 Feb 2012

With thermal issues accounting for half of all lighting failures, and costs prohibitive to widespread adoption, assembly and packaging are keys to improving LEDs. TechSearch International tracks LED packaging materials and methods, as well as reliability and package efficiency.


Present at ESTC 2012 in Amsterdam

Tue, 2 Feb 2012

Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.


LEDs, power semiconductors packaged with high-thermal-conductivity die attach adhesives

Wed, 2 Feb 2012

Engineered Material Systems released the DA-5045-2 and DA-5045-4 high-thermal-conductivity die attach adhesives for LEDs and small power semiconductor die packaging.


USPTO seeks nominees for National Medal of Technology and Innovation

Tue, 1 Jan 2012

The USPTO is looking to increase the diversity of honorees for its annual National Medal of Technology and Innovation (NMTI), honoring "this nation's creative geniuses."


AMEC debuts TSV etch tool with Chinese installations

Wed, 3 Mar 2012

Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity TSV etch tool for 200mm wafers.


K&S capillary specifically suits LED wire bonding

Fri, 3 Mar 2012

Kulicke & Soffa launched the LUMOS Capillary for LED die wire bonding. The capillary can bond with gold or gold-alloy wires and uses a new TG ceramic material for better workability.


Tessera focuses on semiconductor technologies beyond packaging

Thu, 4 Apr 2011

Tessera Technologies Inc. (Nasdaq:TSRA - News) began two corporate initiatives to expand its technologies in semiconductor microelectronics beyond packaging, and to potentially separate its Imaging & Optics business.


Keithley 2652A SourceMeter tests high power semiconductors

Wed, 4 Apr 2011

Keithley Instruments Model 2651A High Power System SourceMeter Keithley Instruments Inc., advanced electrical test instruments and systems provider, introduced the Model 2651A High Power System SourceMeter instrument to characterize high-power electronics, like HB-LEDs, power semiconductors, DC-DC converters, batteries, etc.


HB LED packaging materials pros and cons

Fri, 4 Apr 2011

LEDDaniel Duffy, research scientist in Henkel's Advanced Technology Group, notes pros and cons of epoxy and silicone encapsulants for high-brightness LED (HB-LED) manufacturing, and what HB-LED manufacturers need from die attach materials. He also considers quantum dots.


Rogers names president and CEO from specialty materials industry

Thu, 9 Sep 2011

Rogers Corporation's (NYSE:ROG) Board of Directors elected Bruce D. Hoechner as the materials company's new president and CEO, effective October 3, 2011. Hoechner's past positions were with Rohm and Haas and Dow Chemical.


Samsung LED package completes 6000-hour test

Wed, 9 Sep 2011

Samsung LED's mid-power 2323 LED package exceeded 6,000 hours of independent, EPA-recognized 3rd-party IES LM80 testing. Samsung LED will provide LM80 test data upon request.


LED maker shrinks heatsinks with air holes

Thu, 11 Nov 2011

LED lighting maker Gem Hsin Electronics reduced the size of heatsinks in its LED products by drilling miniscule holes beneath LEDs. The holes allow heated air to escape the LED package.


Thin-film chip boosts LED optical output without changing footprint

Thu, 11 Nov 2011

OSRAM Opto Semiconductors increased its IR Power Topled with lens optical output by 80% over the standard version by integrating a thin-film chip. The IR LED maintains the same surface area and drive current.


Thailand flood update from key semiconductor assembly and test companies

Fri, 11 Nov 2011
Numerous global semiconductor suppliers maintain assembly and test operations in Thailand. Many of these facilities have been affected by the disaster. IHS iSuppli pulled together a list of those affected, and those that have thus-far escaped damage.

Supertex halves board space with 42 ball bumped die package

Wed, 3 Mar 2011

 Supertex (NASDAQ: SUPX) will package its HV2601 and HV2701 16-channel, low-charge injection, 200V analog switch ICs in 5.29 x 5.30mm, 42-ball bumped die packages. This packaging represents a 50% space savings over the previous 48-ball fpBGA package.


IEEE surpasses 400000 members

Fri, 3 Mar 2011

IEEE reached the 400,000 member mark for the first time in its history. By the end of 2010, total IEEE membership had surpassed 400,000, making it the seventh consecutive year the association had experienced membership growth.


Nordson ASYMTEK targets side view LED manufacturing with jet dispenser

Thu, 3 Mar 2011

Nordson ASYMTEK introduced jet dispensing for manufacturing of side-view LEDs, which it says is better than needle-based systems. The Spectrum S-920N fluid dispenser jets 0.1 to 0.2mm dots through windows as small as 0.4mm into LED cavities.


KLIC appoints Director from telecom industry

Fri, 12 Dec 2011

Kulicke & Soffa Industries Inc. (NASDAQ:KLIC or K&S) named Chin Hu Lim to its Board of Directors, also serving on KLIC's Management Development & Compensation Committee.


OSRAM envelops LED chip in reflective package

Tue, 11 Nov 2011

OSRAM Opto Semiconductors introduced the Oslon Square LED for lighting applications, packaged enclosed in a reflective layer to boost light output.


Cree LED simulation and testing options speed time-to-market

Wed, 12 Dec 2011

Cree Inc. added 2 Cree TEMPO offerings to its design and evaluation services: TEMPO (Thermal Electrical Mechanical Photometric Optical) thermal simulation and photometric testing.


inTEST to acquire Thermonics division of Test Enterprises

Tue, 12 Dec 2011

inTEST will acquire the assets and certain liabilities of Thermonics from Test Enerprises. inTEST's Temptronic Corporation, of the Thermal Solutions Group, will integrate the company.


Mentor Graphics integrates T3Ster and FloTHERM for power device thermal management

Mon, 12 Dec 2011

Mentor Graphics Corporation (NASDAQ:MENT) has combined technologies for thermal characterization and simulation with T3Ster hardware test products and its FloTHERM software, enabling better heat management in power semiconductor packages, such as LEDs.


Temporary wafer bonding market: More than 10 approaches today

Thu, 6 Jun 2011

Figure. Temporary bonding tools used during a temporary bonding step. The figures in red show the order of the steps. Source: Yole, Thin Wafer Manufacturing Equipment & Materials Markets Report, June 2011. Yole Développement forecasts the temporary wafer bonding process growth and worth through 2016, and explains why there are so many process options, and who is working on them.


LCP packaging tech from RJR Polymers competes with ceramics for QFN, RF power packages

Tue, 5 May 2011

RJR Polymers debuted liquid crystal polymer (LCP) semiconductor packaging technology for RF and microwave system designers that is competitive with ceramic ACPs, improving thermal management and offering design flexibility based on the company’s epoxy range.


Cascade Microtech's WinCalXE integrates SussCal for better on-wafer VNA measurements

Mon, 5 May 2011

Cascade Microtech Inc. (NASDAQ: CSCD) released WinCalXE version 4.5 calibration software, with improved model and process quality. WinCalXE 4.5 contains the features of WinCalXE and SussCal, and operates with all manual and semi-automatic Cascade Microtech and former SUSS MicroTec probe stations.


Kulicke & Soffa drives semiconductor packaging tool quality with new CQO

Wed, 8 Aug 2012

Kulicke & Soffa Industries, Inc. (K&S, NASDAQ:KLIC) appointed Irene Lee to the role of chief quality officer. Lee will oversee quality assurance functions across Kulicke & Soffa

Docking and Mounting Interface Workgroup releases main goals

Thu, 8 Aug 2010

The group will work on standard terminology and reference points for the mechanical interfaces of probers, handlers, testers, dockings, contactors and load boards. All companies that use or supply test equipment are invited to actively contribute.


Silbond semiconductor chemical supplier acquired by investment firm

Tue, 12 Dec 2010

O2 Investment Partners, LLC, announced it has acquired all outstanding shares of Silbond Corporation, a specialty chemical manufacturing business based in Weston in southeastern Michigan.


Foundry-orders-Nanometrics-TSV-metrology-system

Fri, 12 Dec 2010

Nanometrics Incorporated (Nasdaq: NANO) announced that a leading semiconductor foundry has ordered a UniFire 7900 metrology system for advanced 3D wafer-scale packaging process control.


DIOD releases first product in thermally enhanced PowerDI5060 package

Fri, 12 Dec 2010

Diodes Incorporated (Nasdaq: DIOD) released its first device in its unique PowerDI5060 package, the DMP3010LPS 30V rated p-channel enhancement mode MOSFET.


Ultratech-opens-Singapore-lithograph-ops

Mon, 12 Dec 2010

Ultratech Inc. (Nasdaq: UTEK) opened an advanced manufacturing facility in Singapore. Ultratech plans to spend more than $125 million dollars over the next several years in support of its Singapore International Operations.


Soft-pad silicone thermal management material from Shin-Etsu

Fri, 7 Jul 2010

Shin-Etsu Silicones of America Inc., U.S. subsidiary of Shin-Etsu Chemical Co. Ltd., Japan, launched the TC-CA Series, comprised of Shin-Etsu’s advanced polymer and thermally conductive filler composite material technologies. The low-hardness silicone soft pad series of products have both high thermal conductivity and excellent electrical insulation properties.


SATS providers join top 20, says Gartner

Fri, 9 Sep 2010

Gartner VP of semiconductor manufacturing research, Jim Walker, notes that, for the first time, 2 SATS companies joined the top 20 capital spenders in 2010. He also predicts solid growth for advanced packaging tooling with memory ATE and copper wire bonders being the top performers. Walker says the conversion to copper wire from gold is a wise move.


Palomar intros ultra flexible die bonder

Fri, 9 Sep 2010

Palomar Technologies introduced the fully automated 3800 Ultra Flexible Die Bonder for eutectic die attach, laser diode packaging and high-power LED packaging.


Thermal gap filler provides electrical isolation with high tolerance stack-up

Tue, 9 Sep 2010

Laird Technologies released the Tflex XS400 Series thermal gap filler, a compliant elastomer gap filler for moderate thermal performance with a thermal conductivity of 2.0W/mK. This soft interface pad conforms with minimal pressure, resulting in minimal thermal resistance even at low pressure with little or no stress on mating parts.


LCP QFN packaging tech supports finer pitch, thinner leadframes

Thu, 9 Sep 2010

LCP based QFN semiconductor packages.RJR Polymers debuted a new-generation LCP quad flat-pack no-lead (QFN), air-cavity package that will support finer lead pitches, thinner leadframes and shorter wire bond lengths in a near hermetic, ROHS-compliant solution.


LED-manufacturing-ops-at-LG-Display-Nordson-ASYMTEK-dispensing-equipment

Thu, 11 Nov 2010

Nordson ASYMTEK was selected by LG Display Co. Ltd. as the exclusive provider of dispensing equipment for LG Display's LED BLU manufacturing operations in Nanjing and Guangzhou, China.


Dow-Electronic-Materials-opening-TMG-facility-in-Korea

Fri, 11 Nov 2010

Dow Electronic Materials has broken ground for a new metalorganic precursor manufacturing plant in Cheonan, Korea. Dow is expanding TrimethylGallium (TMG) production capacity to meet the surging global demand for the material in the LED and related electronics markets.


Smart textile large-area manufacturability at heart of PASTA project

Wed, 11 Nov 2010

imec PASTA smart textile project aimsBare die in yarn, comfortable electronics, stretchable interposers, washable photovoltaic clothes, and other elements will be on the table for the PASTA project to bring smart textiles from the lab to industrial manufacturability. Imec leads the program.


Kulicke-Soffa-pushes-copper-wire-bonding-transition with IConnPS ProCu

Tue, 11 Nov 2010

Kulicke & Soffa Industries Inc. (Nasdaq: KLIC) introduced the IConnPS ProCu wire bonder optimized for copper wire bonding. The K&S IConnPS ProCu offers a significant and new level of capability for packaging lines transitioning from gold to copper wire bonding.


Momentive-thermal-management-materials-LEDs

Mon, 11 Nov 2010

To increase the performance and service life of LEDs and LED assemblies, Momentive Performance Materials introduced a line of thermally conductive silicones to be considered for use in LED manufacturing and assembly.


Semtech offers 10-channel LED driver platform in 4x4x0.6mm package

Wed, 8 Aug 2010

Semtech Corp. (Nasdaq: SMTC), analog and mixed-signal semiconductor supplier, announced the SC442, its first 10-channel white LED driver with an integrated 3A boost power switch.


SEMICON Europa plans dedicated semiconductor packaging and test track

Fri, 9 Sep 2010

The advanced packaging and test track of SEMICON Europa will deal with the industry shift away from high-lead solders, digital test and testing integrated analog/mixed-signal packages, package design in the electronics design workflow, and LEDs, among other topics.


Amkor-3-generations-of-3D-packaging

Mon, 11 Nov 2010

In this podcast interview, Smith discusses the three generations in the transition to 3D packaging and how the OSATs shape the development roadmap. Smith says that we need complete supply chain collaboration: EDA tool suppliers, equipment/materials suppliers, logic, memory, fabless, IDMs, and the SATs, to develop and deploy the technologies.


Hymite will sell portfolio of wafer-level semiconductor packaging patents

Mon, 2 Feb 2010

ICAP Ocean Tomo, the intellectual property brokerage division of ICAP Plc (IAP.L), is offering for sale a patent portfolio relating to wafer-level semiconductor packaging owned by Hymite A/S. The 77 issued U.S. and foreign patents and patent applications cover new packaging technologies for optical communications components, LED emitters, and semiconductor fabrication.


ECTC

Fri, 6 Jun 2012

Attendance was high at this year's Electronic Component Technology Conference (ECTC) in San Diego. Sandra Winkler is senior industry analyst at New Venture Research and IEEE/CPMT Luncheon Program Chair, shares the key trends in ECTC's sessions, like WLP, 2.5D, LED packaging, and more.


LED packaging equipment debuts at ESI booth: Via drilling and wafer scribing tools

Thu, 7 Jul 2011

ESI uncrated the Model 5390 micromachining system for advanced LED via drilling and the AccuScribe 2600 HB-LED wafer scribing system at SEMICON West.


Henkel power package sintering technology shuns Pb, pressure processing

Wed, 7 Jul 2011

Henkel Electronic Materials introduced a silver (Ag) sintering technology that enables high-volume power package production that skips single-package pressure processing, eliminates lead-based solder, and withstands temperature cycling better than currently available materials.


Gold pattern transfer/bonding tech for MEMS, LED packaging under dev at SUSS, Tanaka

Tue, 7 Jul 2011

Tanaka Kikinzoku Kogyo KK will partner with SUSS MicroTec KK to develop pattern transfer and bonding technology using sub-micron gold particles. The companies hope to replace gold bumping, sputtering, and other technologies in MEMS, LED, and 3D IC packaging.


HB-LED packaging materials vs heat

Thu, 7 Jul 2011

TechSearch International has put out a study on HB-LED assembly trends and challenges, highlighting materials

WACKER makes semiconductor-bound silicone elastomers under cleanroom reqs

Tue, 7 Jul 2011

WACKER began operating several silicone-polymer production lines at its Burghausen, Germany, site, expanding production of high-purity specialty silicones, encapsulation and coating compounds, as well as UV-activated silicones.


LED manufacturers need dedicated toolset and cost savings

Mon, 6 Jun 2011

Until now, LED makers used retrofitted IC equipment and materials. Yole predicts that the market has enough sway now to attract dedicated toolsets for LED fab and packaging. LED growth will not be boring, however, as a few mini down-/up-turn cycles will occur through 2016.


DEK develops fine-pitch isotropic conductive adhesive for infrared product maker

Thu, 10 Oct 2010

DEK develops fine-pitch isotropic conductive adhesive for infrared product makerDEK has teamed up with Irisys, infrared products supplier, to develop a robust fine-pitch isotropic conductive adhesive (ICA) interconnection process designed to drive Irisys’ latest generation of advanced infrared sensor products. The project led to the development of an optimized process for the assembly of pyroelectric thermal sensing arrays.


Fiducial Locator for Jet Dispense

Mon, 6 Jun 2009
The Fids-on-the-Fly option for Asymtek's Spectrum S-900N series dispensing platforms was developed in response to customer need for increased speed and precision for dispense operations on more densely populated substrates. The substrate is scanned in one pass to locate fiducials prior to the jet dispensing operation.

The Riley Report

Tue, 5 May 2009
Flip Chips and Flashlights by George A. Riley, Contributing Editor
With the industry's attention riveted on the next-generation of TSV- enhanced stacked - everything 3D marvels, we sometimes forget how microelectronics are changing everyday products in our world.

Harman Receives IEEE Award for Wire Bonding Improvements

Wed, 5 May 2009
(May 13, 2009) PISCATAWAY, NJ — George G. Harman, a researcher at NIST, contributed enormously to wire bonding technology and helped transform a labor-intensive, manual procedure into the present automated, reliable process capable of producing hundreds of billions of packaged semiconductor devices/year. The IEEE honors him with the 2009 IEEE Components, Packaging, and Manufacturing Technology Award.

Extreme Electronics: A Show-Within-A-Show at SEMICON West

Mon, 6 Jun 2009
Something is emerging at SEMICON West this year, July 14-16, 2009, at San Francisco's Moscone Center. It's Extreme Electronics, focusing on MEMS, high brightness LEDs and solid state lighting, nanotechnology, and printed and flexible electronics.

Asys plucks DynTest for LED singulation tech

Mon, 5 May 2010

The Asys Group say it has acquired the IP and patents of fellow German firm DynTest Technologies, seeking to apply the company's wafer singulation technology to high-brightness LEDs.


Indium Corporation Acquires Assets of Reactive NanoTechnologies

Tue, 9 Sep 2009

Indium Corporation acquired the processes, equipment, and know-how of Reactive NanoTechnologies Inc. (RNT), developer and manufacturer of NanoFoil. NanoFoil delivers precise, instantaneous heat energy for advanced joining applications. RNT developed the NanoBond joining process to simplify manufacturing and ensure the benefits of NanoFoil are maximized.


Zuken Collaborates with Major Automotive Companies for Improved EMC and Power Integrity Capabilities in CR-5000 Lightning

Tue, 8 Aug 2009
(August 4, 2009) MUNICH, Germany and Westford, MA — Zuken completed a three-year European research project focused on improving the development process and modeling of new chip sets and dedicated high-density interconnect (HDI) that will bring major improvements to the company's high-speed design software, CR-5000 Lightning for Power Integrity analysis.

Optoelectronics: The Comeback Kid

Thu, 11 Nov 2007
In 1887, Heinrich Hertz first observed the photoelectric effect. Over the intervening years, that early observation gave rise to the optoelectronics industry.

Synova Boosts Korea Presence

Thu, 3 Mar 2007
SEOUL, South Korea- Synova received tool orders from a Korea-based organic LED (OLED) manufacturer and a U.S.-based semiconductor manufacturer’s Korea facility.

Compact Thermal Modeling: Impacting the industry

Thu, 3 Mar 2007
Simulation tools for thermal modeling of semiconductor packages have become routine in most design processes.

UV Cure Adhesive

Tue, 2 Feb 2000
The Ablelux AA50 UV/visible blue light curable adhesive is for quick fixturing LED and laser light sources during the active alignment of transceiver package assemblies. Bonding is reportedly achieved in seconds. It is said to be a high-Tg, low-shrinkage material with adhesion to gold.

Lead-free ... Are You Ready?

Tue, 2 Feb 2000
Word has it that a prominent Silicon Valley-based semiconductor company president decreed to his packaging group that Japan`s requirement on lead-free electronic assemblies and the elimination of lead from the external solder on an integrated circuit (IC) package by the first quarter of 2001 (1Q01) will not be an impediment to his company`s shipment into Japan. In other words, "Packaging engineering, don`t let lead-free be another obstacle between Japan and U.S. trade; make sure you have a fix!"

Semiconductor slowdown is imminent

Wed, 3 Mar 2000
Although you are reading this column in the March issue of Advanced Packaging, it was written in January, which is, coincidentally, the time of year when set my annual forecast. Actually, I started my forecasting research for 2000 in the fourth quarter of 1999 (4Q99), but I didn`t really solidify it until the first week or two of January. I only hope that it reaches you in time for you to have a chance to revise your forecast for the 2000 calendar year.

Digital Dispenser

Wed, 3 Mar 2000
The Portion-Aire PV-2000DT series digital dispenser applies any liquid, paste or gel used in the production process. It features an LED countdown timer with two different time ranges: 00.0 to 99.9 sec and 0.00 to 9.99 sec with a membrane switch for upward or downward adjustment. The use of this dispenser allows dispense process verification for ISO certification and provides a repeatable process when the dispenser will apply different materials. The units feature either a 0 to 100 psi or a 0 to

High-brightness Matrix LEDs

Sat, 9 Sep 2007
Light-emitting diode (LED)-based applications are growing, and cover a broad range of markets including automotive lighting applications such as indicators, spot utility, and headlamps; camera functions like display backlights and camera flashes; consumer products such as LCD display backlight and projection systems; architectural uses like accent lighting for buildings, and signs; and many others. LEDs are bright, efficient, and quick to react.

SATS provider Carsem begins LED packaging and test

Fri, 5 May 2012

Semiconductor packaging and test services provider Carsem will assemble and test LED packages, partnering with a key customer and applying semiconductor packaging technologies for better LEDs.


Ultratech brings former member back to Board

Thu, 4 Apr 2012

Ultratech, lithography and laser-processing system supplier to semiconductor manufacturers and packaging providers, added Michael C. Child to its Board of Directors. Child served on Ultratech

SUSS buys Tamarack for lithography, laser structuring lines

Fri, 3 Mar 2012

SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.


AMOLED display gives Samsung Galaxy Tab 7.7 the edge on weight, thickness, battery life

Mon, 4 Apr 2012

Samsung Electronics' Galaxy Tab 7.7 uses an AMOLED display, gaining benefits in the weight, thickness, and battery life, but at a higher material cost, says research firm Displaybank, part of IHS.


SEMICON West heralds 22nm, EUVL, 450mm, mobile electronics speakers

Mon, 4 Apr 2012

Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.


LED fab JV forms between Viper Networks and acquisition target

Mon, 4 Apr 2012

An LED manufacturing joint venture is the “final due diligence” Viper Networks Inc. will execute with its targeted acquisition: a profitable LED manufacturing company in the US.


As LED patents run out, supply chain value will shift downstream

Fri, 3 Mar 2012

Barclays Capital finds that LED manufacturing and materials patents will soon run out, potentially draining value from material/chip/package suppliers and turning LEDs into commodities.


MOCVD advances, InGaN enable record HEMT material from Kopin

Thu, 3 Mar 2012

Kopin Corporation achieved record 1290cm2/V.s electron mobility and 240ohms/square sheet resistance results from GaN-based high electron mobility transistor (HEMT) materials.


LED replacement lamp market to shift from developed to developing countries

Thu, 3 Mar 2012

LED replacement lamps for legacy lighting sources will see 30% unit growth 2012-2016, says Strategies Unlimited. But ASPs will fall 14%/year in that time.


LED manufacturing tool orders to dip in 2012 between LED demand waves

Thu, 3 Mar 2012

LED revenues are slowing down in 2012, after two years of remarkable growth, according to Strategy Analytics. LED fab equipment spending and epitaxial substrate demand in the LED sector will decline in 2012.


Phosphor trends for LED manufacturing

Tue, 3 Mar 2012

Barclays Capital shares some take-aways from the Intertech Pira Phosphor Summit, a conference on phosphors being used in the LED industry. The analysts touch on color mixing, remote phosphors, silicone encapsulants, and more


2012 Flexible Electronics & Displays: The future is flexible

Wed, 2 Feb 2012

Printed flexible electronics represent the future of sensors, displays, power electronics, and lighting, according to experts at the FlexTech Alliance 2012 Flexible Electronics & Displays Conference & Exhibition.


Large-diameter sapphire LED substrates on-trend at Strategies in Light

Wed, 2 Feb 2012

Raja Parvez, president and CEO of Rubicon Technology (RBCN) will speak about the "Move to Larger Diameter Sapphire Substrates" at the Strategies in Light today during the LED Manufacturing track.


Cree's new silicon carbide (SiC) platform cuts initial LED cost

Wed, 2 Feb 2012

Cree Inc. (Nasdaq:CREE) reports doubling the lumens/dollar of light emitting diodes (LEDs) with its new silicon carbide (SiC) LED substrate technology.


Top 10 LED manufacturers in 2011, and shifting regional dominance

Wed, 2 Feb 2012

The global HB-LED market grew from $11.3 billion in 2010 to $12.5 billion in 2011, surging 9.8%, according to Strategies Unlimited. 10 companies accounted for more than 68% of the global LED supply.


JPSA expands Ultrafast laser machining technology

Wed, 2 Feb 2012

JP Sercel Associates, Inc. (JPSA) expanded its Ultrafast processing capabilities, using Pico-second lasers with innovative laser beam delivery techniques.


Strategies in Light: Day 1, LED Lighting Report, New Start-ups

Wed, 2 Feb 2012

The 2012 Strategies in Light conference kicked off today at the Santa Clara Convention Center with a series of five workshops, two tutorials and one all-day investor forum.


Seoul Semiconductor keynote at Strategies in Light: Highlights

Wed, 2 Feb 2012

Chung Hoon Lee, CEO of LED manufacturer Seoul Semiconductor keynoted at Strategies in Light today. Lee’s keynote, "A View from Seoul," marked the first time a Korean LED maker has spoken at the conference. Following are highlights from his talk.


USSOCOM awards eMagin $1M+ to optimize OLED micro display for mass production

Tue, 2 Feb 2012

eMagin was awarded a $1.12 million SBIR contract from the United States Special Operations Command (USSOCOM) to optimize its WUXGA OLED micro display for mass production.


Plessey acquires CamGaN for GaN-on-Si LED technology

Tue, 2 Feb 2012

Plessey has acquired CamGaN, a University of Cambridge spin-out with novel GaN technology for HB-LEDs on large-area silicon substrates. Plessey will bring the technology into its 6" wafer processing facility in the U.K.


EVG LED mask aligner offers COO improvement in gen-2

Tue, 2 Feb 2012

EVG uncrated the EVG620HBL Gen II fully automated mask alignment system for volume LED manufacturing. The second generation tool offers 55% higher wafer output per square meter of cleanroom space occupied, EVG reports.


SemiLEDs, LG Siltron, Epistar install Veeco MOCVD tools

Tue, 2 Feb 2012

Veeco Instruments (Nasdaq:VECO) reported 3 wins for its TurboDisc K465i GaN MOCVD tool : the same systems will be used for high-volume LED fab, GaN-on-Si research, and Si-based LED development.


Kodak, Heraeus projected capacitive touch screen showcases ITO alternative

Mon, 2 Feb 2012

Eastman Kodak and Heraeus Precious Metals will demonstrate a 3.5" touchscreen panel for cell phone applications using Kodak HCF-225 Film/ESTAR Base as the transparent conductive component at Flexible Electronics & Displays 2012.


UPDATED: Record semiconductor sales in 2011, 2012 outlook

Wed, 2 Feb 2012

The SIA shows 2011 worldwide semiconductor sales hit $299.5 billion, a 0.4% year-on-year increase and new record. Semico Research's forecast for 2012 shows a 10.11% growth in semiconductors revenues over 2011. Barclays Capital and Strategy Analytics also weigh in.


Corning, Samsung Mobile Display form OLED glass substrate venture

Fri, 2 Feb 2012

Corning Incorporated (NYSE:GLW) and Samsung Mobile Display Co. Ltd. will establish a new equity venture for the manufacture of specialty glass substrates for organic light emitting diode (OLED) devices.


LED lighting increases power electronics complexity, drives new power supply market

Fri, 2 Feb 2012

"Opportunities for Power Components in LED Lighting" from IMS Research reveals that rapid uptake of LED lighting, driven by legislation and rising costs of electricity, will result in a potential market of 4 billion power supply units by 2016, worth $10 billion.


Hanwha moves to manufacture ElectriPlast moldable conductive plastic

Fri, 2 Feb 2012

Hanwha L&C of Korea signed a letter of intent to obtain manufacturing and distribution rights to ElectriPlast from Integral Technologies Inc, hybrid conductive plastics maker. The LOI is applicable for various parts of Asia.


Can carbon nanotubes fluoresce fully?

Thu, 2 Feb 2012

Rice University studied the fluorescence of single-walled carbon nanotubes (SWCNT) in new research, finding that the lengths and imperfections of individual nanotubes affect their fluorescence.


OLED maker Novaled plans IPO

Tue, 3 Mar 2012

Novaled AG filed a registration statement with the US SEC for a proposed initial public offering. Novaled makes technologies and materials for organic electronics, particularly OLEDs.


SUSS combines resist coat and develop platforms

Mon, 3 Mar 2012

SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.


CVD Equipment doubles manufacturing space with new NY facility

Mon, 3 Mar 2012

CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its CVD and gas control equipment assembly, and unifying its nano-materials lab.


Silicon Genesis wafering tool designed for solar, LED, packaging sectors

Mon, 3 Mar 2012

SiGen developed its second-generation production system for fabricating thin-silicon solar wafers, as well as HB-LED, and 3D semiconductor packaging wafers. The system tailored for silicon, GaAs, germanium, SiC, GaN and sapphire materials.


LED lighting to illuminate power semiconductor sector

Fri, 3 Mar 2012

The global market for power semiconductors used in LED lighting is forecast to reach over $3 billion in 2016. LED lighting systems require complex electronics, IMS Research notes.


AIXTRON wins MOCVD customer making LEDs in China

Fri, 3 Mar 2012

AIXTRON SE sold 5 multi-wafer MOCVD systems to a new customer, Huaian Aucksun Optoelectronics Technology Ltd., China. The tools will grow materials for HB-LEDs.


AIXTRON opens MOCVD training center in China

Fri, 3 Mar 2012

AIXTRON's training and demonstration center in Suzhou, China, will focus on improving MOCVD in advanced semiconductor and LED manufacturing operations around China, as well as on employee and environmental safety in electronics production environments.


SAFC Hitech expands LED precursor production in Taiwan

Thu, 3 Mar 2012

SAFC Hitech opened a multi-million dollar 270000sq.ft. expansion at its facility in Kaohsiung, Taiwan, increasing capacity for high-quality LED precursor production.


MATHESON incorporates RFID, pressure monitoring in compressed gas control system

Wed, 3 Mar 2012

MATHESON debuted the Lasso System, a customer-centric supply chain and inventory management system that can monitor the location and operating status of gas products and other assets in the REAL-Time Gas and Asset Management System.


DoD orders quantum dot electroluminescent devices from QD Vision

Wed, 3 Mar 2012

The US DoD awarded QD Vision Inc. a $1.38 million/12-month contract for specialized devices based on electroluminescent quantum dots. The program will result in prototype devices for armed forces.


Silicon wafers sliced to 10% conventional bulk with Hyperion 3

Wed, 3 Mar 2012

Twin Creeks Technologies, semiconductor and solar cell manufacturing equipment supplier, debuted its first commercial silicon wafer production system that reduces solar module and semiconductor device wafers by up to 90%.


LED phosphor provider Intematix raises $16.2M from investors

Tue, 3 Mar 2012

Intematix, phosphor and phosphor component maker for high-quality LEDs, received $16.2 million in funding from Draper Fisher Jurvetson and Crosslink Capital, as well as a new financial investor.


Vacuum pumps improve throughput by 90% with new rotary design

Tue, 4 Apr 2012

Edwards Limited uncrated the STP-iXR1606 series magnetically-levitated turbo-molecular pumps (TMP) with fully integrated onboard controllers. Its new rotary design improves throughput by about 40% at high gas flow rates; nearly 90% percent in maximum gas flow.


Power electronics grow on SiC and GaN innovation

Thu, 4 Apr 2012

Power electronics will grow to $15 billion in sales of discrete components in 2020, says Lux Research. New materials -- SiC and GaN -- are taking a 22% market share for $3.3B in sales. Expect this year to set a record for funding to power electronics companies.


OLED adhesive cures at low temperatures to rubber-like consistency

Thu, 4 Apr 2012

Engineered Conductive Materials LLC uncrated a low-temperature curing conductive adhesive, DB-1541-LTC, for OLED assembly.


SABIC LED resins offer improved color under heat exposure

Wed, 4 Apr 2012

SABIC’s Innovative Plastics business released 3 Lexan LUX resin grades for LED applications such as light guides and lenses. They are transparent and use a new formulation to improve initial color, color stability, and light transmission during heat aging.


AMOLED TV manufacturing status, price trends

Tue, 1 Jan 2012

AMOLED TVs drew a crowd at CES, but manufacturing challenges and expensive fab materials will limit global shipments of the sets for several years, says IHS iSuppli. IHS compares the 55" AMOLED TVs from LG Display and Samsung, each using different manufacturing technologies.


Seoul Semiconductor LED patents top 10K mark

Fri, 1 Jan 2012

Seoul Semiconductor Co. Ltd. has applied, registered, and secured more than 10,000 patents for light emitting diodes (LEDs) globally. The company invests 10-20% of its annual revenue in R&D.


AIXTRON sells SiC CVD tool to United Silicon Carbide

Fri, 1 Jan 2012

USCi will develop next-generation silicon carbide (SiC) devices with AIXTRON SE's VP2400 hot-wall CVD tool. USCi plans to install the CVD system in Q3 2012.


imec launches flexible OLED display manufacturing research with Holst Centre

Thu, 1 Jan 2012

imec and Holst Centre, with associated industry partners, are developing flexible active-matrix OLED display technology, the associated drivers and circuits, and new manufacturing equipment to build the displays, all with an eye on low-cost and high-volume production.


Annealsys MOCVD tool integrates Hine Automation vacuum wafer transfer system

Thu, 1 Jan 2012

Hine Automation shipped its Star SL-300 single-substrate vacuum transfer system to Annealsys, which will integrate the wafer transfer system onto its MC-200 MOCVD tool for R&D and pilot environments.


SEMI award honors quantum dot research at QD Vision

Wed, 1 Jan 2012

SEMI presented its annual SEMI Award for North America to QD Vision. QD Vision team members made significant progress on the integration and manufacturing processes essential to the commercialization of quantum dot (QD) technology.


Cheaper LED backlights require LED, plate materials changes

Wed, 1 Jan 2012

Consumers are adopting LED-backlit LCD TVs more slowly than expected, prompting TV makers to design lower-power, lower-cost LED backlights using fewer LEDs per TV set, shows the NPD DisplaySearch Quarterly LED Backlight Report.


Fabs in high-risk zones, 450mm, 3D IC themes of Semico's Semiconductor Fab Database

Wed, 1 Jan 2012

36% of semiconductor fabs are in high-risk zones, finds Semico, noting the industry disruptions caused by the Japan earthquake and tsunami and Thai flooding and the challenges these presented to chip makers in the regions. 


GaN LED market growth starts in 2012

Tue, 1 Jan 2012

The gallium nitride (GaN) LED market declined in 2011, but 2012 marks the beginning of a growth curve, with double-digit growth in 2013 and 2014, says IMS Research. Lighting revenues will overtake TV revenues for GaN LEDs a year earlier than expected.


FPD manufacturers face 2012 crunch before 2013 rebound

Tue, 2 Feb 2012

While the FPD industry faces severe challenges, long-term supply demand models show a positive future. DisplaySearch tracks the near- and long-term outlook for FPDs, with input from Barclays Capital and IHS.


European microelectronics fab database tracks major changes over past 5 years

Mon, 2 Feb 2012

Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufacturing fabs, pilot lines, and major R&D organizations.


GTAT wins 6" sapphire ingot order from LED substrate maker

Fri, 2 Feb 2012

GT Crystal Systems will supply 500,000 TIE 6" C-plane sapphire cores to Silian, which produces high-quality sapphire substrates for HB-LED manufacturing.


Strategies in Light takeaways: LED expectations for the short- and long-term

Mon, 2 Feb 2012

Jefferies' and Barclays' analysts attended the Strategy in Light conference in Long Beach, CA, and report on a challenging LED market with near-term positive boosts.


Lithography, direct-attach LEDs, packaging trends at Strategies in Light Day 3

Fri, 2 Feb 2012

Day 3 of the 2012 Strategies in Light conference continued the LED Manufacturing session. Presenters covered LED manufacture, advanced packaging, metrology and testing, high-performance materials, and other topics, such as dimming. Blogger Michael A. Fury, Techcet Group, reports.


LED cost reduction to come from manufacturing: Strategies in Light

Fri, 2 Feb 2012

The manufacturing conference at Strategies in Light focused on methods for reducing cost through the manufacturing supply chain. Presenters discussed various methods of reducing manufacturing costs, from improved automation and standards implementation, automation to new packaging technologies. Laura Peters, LEDs Magazine, reports.


Rubicon re-ups sapphire wafer contract with largest customer

Thu, 2 Feb 2012

Rubicon Technology, Inc. (RBCN) entered into a new contract with its largest customer for large-diameter sapphire wafers. Shipments will total at minimum $20 million.


AIXTRON MOCVD tools easier to lease in China with new MSFL alliance

Thu, 2 Feb 2012

Minsheng Financial Leasing (MSFL), China's main non-banking financial institution, formed a strategic alliance with AIXTRON, making fab tool leasing options available to AIXTRON's customers in China.


LED manufacturing highlights from Strategies in Light Day 2

Thu, 2 Feb 2012

Blogger Michael A. Fury, Techcet Group, reports from Day 2 of Strategies in Light: immersing himself in the LEDs manufacturing track of the conference.


Organic printed electronics roadmap recognizes market entry

Mon, 1 Jan 2012

The Organic Electronics Association released its "OE-A Roadmap for Organic and Printed Electronics," covering application clusters such as flexible displays and smart systems, as well as the outlook on materials, substrates, and patterning processes.


Taiwan's LED makers' and packagers' 2011 results

Fri, 1 Jan 2012

Taiwan's LED chip and package manufacturers failed to reproduce the booming revenue growth of H1 2011 in H2, according to LEDinside. Given inventory pressure, many LED makers are actively seeking joint ventures and improving product quality to create greater product differentiation.


Apple shares list of suppliers

Fri, 1 Jan 2012

For the first time, Apple Inc. has publicly published a list of over 150 companies that the electronics giant says represent 97% of its procurement expenditures for materials, manufacturing, and assembly of products worldwide.


OSRAM fabs LED chips on silicon

Thu, 1 Jan 2012

OSRAM Opto Semiconductors manufactured high-performance LED prototypes, growing the light-emitting gallium-nitride (GaN) layers on 150mm silicon (Si) wafers rather than sapphire substrates.


LED makers to spend less on MOCVD in 2012, more on other LED fab tools

Wed, 1 Jan 2012

Worldwide LED manufacturing capacity will reach 2M wafers in 2012, up 27%. More wafers do not neccessarily mean more LED fab equipment, however. Global LED manufacturing equipment spending will fall 18%, shows SEMI.


Lumiotec licenses OLED tech from Universal Display, plans mass production in 2012

Tue, 1 Jan 2012

Lumiotec will use phosphorescent and other organic light emitting diode (OLED) technologies from Universal Display Corporation (NASDAQ:PANL), under an OLED technology license agreement.


Philips Lumileds names CEO from semi sector

Tue, 1 Jan 2012

Philips Lumileds appointed Pierre Yves Lesaicherre as CEO, succeeding the company's first CEO Michael C. Holt. Lesaicherre spent 2 decades in the semiconductor and components industry.


EVG integrates UV lithography from Eulitha on mask aligner

Tue, 1 Jan 2012

EV Group signed a joint-development and licensing agreement with Eulitha AG, integrating Eulitha's PHABLE mask-based UV photolithography technology with EVG's automated mask aligner platform.


ROI potential for OLED, emerging display technologies

Mon, 1 Jan 2012

Printed, flexible, and organic electronics enable next-gen displays and other applications; however, technical hurdles and dev cycles impede ROI. The key is partnerships sharing materials, equipment, and device development expertise, shows Jonathan Melnick, Lux Research.


OLED trends: Materials, color patterning advances and the display race

Fri, 1 Jan 2012

OLED manufacturing advanced rapidly in 2011, making gains in organic materials, color patterning, electronic driving methods, and encapsulation, shows NPD DisplaySearch.


Materion expands PVD shield cleaning facility in NY

Fri, 1 Jan 2012

Materion Microelectronics & Services added 50% more space in its PVD parts cleaning and surface treatment facility, with an automated robotic twin wire arc spray, increased precious metal refining capacity, new cleaning processes, and a Class 10,000-certified cleanroom.


Attend US FPD Smart Displays -- From Emerging to Mainstream

Thu, 1 Jan 2012

US FPD Smart Displays -- From Emerging to Mainstream, taking place in February in San Diego, will feature forecasts and analysis from DisplaySearch and In-Stat analysts, as well as presentations from smart display industry executives. Check out the sessions preview.


10 LED manufacturing themes in 2012

Thu, 1 Jan 2012

Barclays Capital forecasts 2012 as a "subdued year" for the light-emitting diode (LED) industry, but there will be opportunities for MOCVD sales in the LED and power semiconductor sectors, as well as MOCVD upgrades.


Nocilis Materials launches SiGe foundry

Thu, 1 Jan 2012

Nocilis Materials opened its silicon foundry service globally. Nocilis Materials AB provides epitaxy service of advanced Si-Ge-Sn-C alloys for electronic and photonic applications.


AIXTRON sells multiple MOCVD reactors to HB-LED maker

Wed, 1 Jan 2012

AIXTRON SE (NASDAQ:AIXG) delivered multiple AIX G5 HT MOCVD reactors to existing customer Nantong Tongfang in China, fueling the company's HB-LED production expansion.


Soitec advances LED strategy with Altatech Semiconductor buy

Wed, 2 Feb 2012

Soitec (Euronext Paris) completed its acquisition of all of the outstanding shares of Altatech Semiconductor S.A. The final purchase price was EUR15 million.


Novaled achieves ISO 9001:2008 quality certification

Wed, 2 Feb 2012

Novaled AG has been certified according to the ISO 9001:2008 international quality management standard by external auditors DQS GmbH.


Cambrios takes ITO-alternative to strategic phase with Samsung investment, new leader

Tue, 1 Jan 2012

Cambrios Technologies Corporation appointed John LeMoncheck as president and CEO, and announced a $5 million Series D-3 financing round from Samsung Venture Investment Corporation.


Heraeus thick film division renames insulated aluminum materials system Celcion

Tue, 1 Jan 2012

The Thick Film Division of Heraeus announced a new name, Celcion, for its Insulated Aluminum Materials System. Celcion allows LED circuits to run cooler than MCPCBs.


Gamma Scientific uncrates LED tester

Mon, 1 Jan 2012

Gamma Scientific introduced a low-cost spectrometer for quick and accurate testing for LEDs. The RadOMA Lite linear CCD array spectrometer tests LED intensity and total flux. 


MOCVD cools down, LED downstream processing heats up

Mon, 1 Jan 2012

Requirements for LED processing equipment are changing from cost driven to more technology driven decisions, a clear trend to more complex and more efficient manufacturing, according to Thomas Uhrmann and Thorsten Matthias of EV Group.


MicroOLED OLED micro-display reaches 5.4M-pixels on 0.61" panel

Fri, 1 Jan 2012

Near-eye micro-display maker MicroOLED introduced a 5.4-million-pixel-density, 0.61"-diagonal, low-power-consumption organic light-emitting diode (OLED) microdisplay on silicon.


Umicore consolidates germanium optics production to US

Thu, 1 Jan 2012

Umicore will consolidate production of its germanium-based optics products in the US, citing a majority market in the country. Umicore will phase out optics production in Olen, Belgium.


Soitec, Sumitomo Electric scale GaN engineered wafers to 6"

Tue, 1 Jan 2012

Soitec (Euronext) and Sumitomo Electric Industries Ltd. demonstrated 4" and 6" engineered gallium nitride (GaN) substrates, and launched pilot production lines to enable wider market adoption.


Round LEDs released by Luminus Devices

Mon, 4 Apr 2012

Luminus Devices Inc. unveiled its round LED architecture, meeting the circular aperture designs of many optical devices.


Semiconductor investments from venture capital sector fall in March

Mon, 4 Apr 2012

Investments in fabless companies, semiconductor suppliers, and other chip companies fell more than 80% month/month and year/year in March, reports the Global Semiconductor Association (GSA).


Nichia sued over LED fab IP by Everlight

Mon, 4 Apr 2012

Everlight Electronics Co. Ltd. filed a patent infringement lawsuit against Nichia Corp., seeking enforcement of a patent covering LED metallization technology, and asked that 2 Nichia patents on LED phosphor technology be rendered invalid.


MOCVD and MBE epitaxy trends for compound semiconductors

Fri, 4 Apr 2012

The corresponding combined revenue opportunity for MBE and MOCVD is estimated to be around US $6.1 billion for the 2012-2020 periods, shows Yole Développement.


OLEDs erode LCD dominance, starting in small displays

Fri, 4 Apr 2012

Organic light-emitting diode (OLED) will be a nearly $11 billion market in 2017, and will take some display market share from the $100-billion LCD sector, according to a Lux Research report.


As LEDs ramp, GaAs wafers shift from SI to SC type

Thu, 4 Apr 2012

Boosted by LEDs, semiconducting (SC) GaAs substrates will lead growth of the GaAs market. In 2011, semi-inductive (SI) GaAs substrates held ~56% (M$) of the overall GaAs substrate market (SC GaAs held ~44%), a trend that is likely to reverse in the short term.


EPIC names new director general, promises closer ties with EU

Thu, 4 Apr 2012

EPIC, the European Photonics Industry Consortium, announced at its annual general meeting that Carlos Lee has been appointed as director general, succeeding Thomas Pearsall, who has led the association since its founding in 2003.


MOCVD suppliers await H2 payoff for H1 LED gains

Mon, 4 Apr 2012

Positives for LED makers -- improved utilization rates in Taiwan, growing LED lighting demand -- will not immediately equal more orders for MOCVD tool suppliers, reports Barclays Capital. The analysts expect 525 MOCVD tool orders in 2012, most in the second half of the year.


Veeco ion beam deposition tool matches PVD speed

Mon, 4 Apr 2012

Veeco Instruments Inc. debuted the SPECTOR-HT ion beam deposition tool for thin-film deposition in optical products, such as lasers, telecommunications chips, and more.


Intematix remote phosphor targets high-lumen small-size LED lights

Mon, 4 Apr 2012

Intematix released ChromaLit XT remote phosphor technology for high-lumen LEDs in small form factors, enabling blue LED packages instead of binned white LEDs.


LED researchers install VECO MOCVD in Korea

Fri, 4 Apr 2012

LED-IT Fusion Technology Research Center of Korea tapped Veeco for a TurboDisc K465i GaN MOCVD system for research and development of LEDs, including green LEDs and UV versions.


Cree LED achieves 254 lumen/watt on SiC, optimized chip/packaging tech

Fri, 4 Apr 2012

Cree Inc. (Nasdaq:CREE) achieved 254 lumen/watt on a white-light, power LED in research. The correlated color temperature is 4408 K.


AMOLED use in small/medium displays prompts more suppliers, more adopters

Thu, 4 Apr 2012

Active matrix organic light-emitting diodes (AMOLEDs) are moving from small-quantity development into higher volumes, with shipments destined for smartphones driving growth in the small- and medium-sized display market in February, said IHS.


Verticle takes hexagonal LED chips to mass production

Mon, 2 Feb 2012

Verticle began mass production of its hexagonal-shaped LED chip Honeycomb, developed with a proprietary copper substrate and chemical chip separation technology.


Samsung approves LED business absorption

Mon, 2 Feb 2012

Samsung Electronics' Board of Directors approved a merger with Samsung LED, Ltd. The BOD also decided to request Samsung Mobile Display to pay infrastructure construction costs.


Present at Strategies in Light Europe

Mon, 2 Feb 2012

Strategies in Light Europe, September in Munich, is accepting presentation abstracts through February 29. Submit a paper on LED technology, LED manufacturing and the supply chain, markets, LED applications, or a related topic.


Will Samsung reorganize LCD and AMOLED display units?

Mon, 2 Feb 2012

Samsung Electronics is under rumors about spinning off its LCD manufacturing division, which could lead into a displays business restructuring involving Samsung Mobile Display and Samsung LCD. NPD DisplaySearch shares the root motivation for changes, and how Samsung's potential moves will affect the industry.


Shin-Etsu Chemical releases low-RI LED encapsulants

Fri, 2 Feb 2012

Shin-Etsu Chemical Co. Ltd.'s new KER-7000 Series silicone encapsulating materials offer a low (1.38) refractive index (RI) for HB-LED packaging with lower gas permeability and higher transparency.


LED oversupply shrinks in 2012 on consumer demand uptick

Thu, 2 Feb 2012

LED supply exceeded demand by 30% in 2011, thanks to poor LED TV sales and slow growth in lighting. Look for the industry to start close this gap in 2012, shows NPD DisplaySearch.


Iljin Materials and LED maker ILJIN Semiconductor plan merger

Thu, 2 Feb 2012

Iljin Materials Co. Ltd., a developer and producer of elecfoils for use in the electronic components, has signed a statutory merger agreement with LED manufacturer ILJIN Semiconductor Co. Ltd.


3D micro-structuring, OLED display fab nab laser awards

Fri, 5 May 2012

The Innovation Award Laser Technology 2012 recognized 3D metal micro-structuring laser technology from Schepers, excimer laser design for OLED and LCD display fab from Coherent, and a laser brazing head technology from Precitec Optronik.


AMAT throws the brakes on LED fab equipment

Fri, 5 May 2012

In light of “challenging industry conditions” in the LED and PV manufacturing sectors, Applied Materials (AMAT) decided to restructure its Energy and Environmental Solutions (EES) segment.


OLED manufacturers develop new color patterning technologies for large-area fab

Thu, 5 May 2012

OLEDs are gaining adopters in small screen sizes, and just moving into large-size displays. Mass production color-patterning technology for large-area OLED is increasingly an issue. Displaybank looks at new technologies under development at major display makers.


GE integrates LED thermal management for 100W bulb within A-19 form factor

Wed, 5 May 2012

GE’s 27-watt Energy Smart LED bulb is in a standard “A-19” bulb shape, manufactured with a proprietary synthetic jet technology enabled by Nuventix’ collaboration.


LED efficiency boosted by quantum dot and formic acid combo

Wed, 5 May 2012

Vanderbilt University researchers have used formic acid to develop white-light quantum dots' fluorescent efficiency to 45%, enabling UV LED efficiency of 40 lumens/watt.


LED maker SunSun Lighting raises $30M from investors

Wed, 5 May 2012

SunSun Lighting, a provider of high-performance, energy-efficient and low-cost LED lighting technologies, received $30 million in Series B financing from GSR Ventures and Oak Investment Partners and additional commitments from its original angel investors. Allan Kwan, a China-based advisor for Oak, is joining the board of SunSun.


HB-LED makers drive economic improvement with alternative substrates, automation, and yield

Tue, 5 May 2012

SEMI’s Paula Doe covers the “commodity market” of LEDs, including capacity utilization at LED fabs, automation in manufacturing that could improve yields, LEDs fabbed on silicon and GaN instead of sapphire wafers, and more.


AIXTRON MOCVD tool installed for GaN research at U of Warsaw

Tue, 5 May 2012

University of Warsaw, Poland, researchers will grow GaN materials on a new AIXTRON SE Close Coupled Showerhead MOCVD reactor in a 3 x 2” wafer configuration.


Lower-cost LED backlights darken CCFL's future

Mon, 5 May 2012

Low-cost direct LED-backlit LCD TVs were introduced in March 2011, targeting share in the entry/mainstream LCD TV market currently dominated by CCFL-backlit TVs. They will eliminate CCFLs by 2014, says DisplaySearch.


AIXTRON wins repeat MOCVD order from LED maker

Mon, 5 May 2012

AIXTRON SE’s long-time customer Formosa Epitaxy Inc. (FOREPI) ordered several MOCVD systems: 4 CRIUS II-XL systems in a 19 x 4” wafer configuration and 2 G5 HT reactors in a 14 x 4” wafer configuration.


LED makers qualify c-axis sapphire wafers from ARC Energy, Trinity Material

Fri, 5 May 2012

Sapphire wafers grown using ARC Energy’s Controlled Heat Extraction System furnaces for Trinity Material was certified for high-quality LED chip production at two leading LED chip companies.


EMAN wins OLED micro-display follow-on order from Army

Fri, 5 May 2012

eMagin Corporation (NYSE Amex:EMAN) received a $3.1 million follow-on order for OLED microdisplays under an existing US Army Remote Viewer Program.


China’s LED production, consumption plans

Fri, 5 May 2012

China has designated LEDs as one of the 7th emerging industries to be fostered in the Twelfth Five-year Plan. China is accelerating standardization plans, encouraging local production, and subsidizing purchases of LED lighting, Displaybank reports.


China's LED subsidy totals RMB2.2B

Thu, 5 May 2012

Barclays Capital’s Asia IT analyst Jones Ku shares details of China's State Council’s subsidy program for household electrical appliances. The program sets aside RMB2.2 billion to promote consumption of LEDs and “other energy-saving light bulbs.”


Dow acquires LED phosphor technology IP in Lightscape Materials buy

Wed, 5 May 2012

Lightscape Materials offers IP in specialty phosphor technology, which Dow will add to its LED technologies portfolio. Lightscape co-founders Gerard Frederickson and Yongchi Tian will join Dow’s LED Technologies team.


Is the LED boom and bust cycle leveling out?

Wed, 5 May 2012

After a surge in 2010 and oversupply in 2011 that suppressed 2012 fab, LED makers will see a leveling out of supply and demand into better equilibrium, according to NPD DisplaySearch. Demand will shift from LCD-backlit LEDs to LEDs for lighting.


Beyond sapphire: LED substrates from GaN to ZnO, SiC, and Si

Mon, 5 May 2012

LEDs are typically manufactured on sapphire substrates, about 90% of the blue LEDs currently in production. SiC substrates are used for virtually all the remaining 10% of blue LEDs. To improve efficiency and brightness, as well as cost, LED makers are looking to other substrates, such as Si and ZnO.


The low utilization/MOCVD uptick phenomenon, LED efficacy and price, more from Lightfair

Mon, 5 May 2012

Barclays Capital analysts attended Lightfair International and gleaned several trends in LEDs and OLEDs for lighting, including an interesting phenomenon around MOCVD utilization rates and new orders.


UV-LEDs fabricated with solution process, oxide-in-oxide design

Fri, 2 Feb 2012

A team of scientists at Los Alamos National Laboratory has developed a process for creating glass-based, inorganic LEDs that produce light in the UV range.


HB-LED grade aluminum nitride meets thermal needs of today's LEDs

Fri, 2 Feb 2012

In this series, CMC Laboratories describes a new LED-grade AlN and what it accomplishes as a ceramic substrate. The AlN offers better heat dissipation for LED packages than alumina, at a lower cost than previous formulations.


SEMICON China: Challenges and opportunities for semiconductors, emerging techs

Thu, 2 Feb 2012

SEMICON China takes place March 20-22 in Shanghai. Check out the special pavillions and events, and keynote speakers scheduled.


Present at coolingZONE LED 2012 in Berlin

Thu, 2 Feb 2012

coolingZONE LED, May 29-31 in Berlin, is soliciting technical presentations on LED energy consumption, LED packaging, heat and air-flow simulations of LED products, and related topics.


MIT's nanowire growth control method could optimize LEDs, other semiconductors

Wed, 2 Feb 2012

MIT researchers used gases to precisely control nanowires' width and composition as they grow, which could yield complex structures optimally designed for particular applications, like LED substrates or solar panels.


Chip substrate factory begins producing thermal-control substrates in Russia

Wed, 2 Feb 2012

MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.


Metrology project launches in Europe for thin films

Fri, 3 Mar 2012

The National Physical Laboratory in the UK is leading a new EMRP project on thin film manufacturing metrology for industries such as opto electronics, plastic and printed electronics, displays and lighting, memories and solar cells.


HB-LED grade aluminum nitride (AlN) sintering

Fri, 3 Mar 2012

Part 2 of this series covers furnace considerations for a new HB-LED-grade AlN, as well as furnace throughput. Jonathan Harris, CMC Laboratories, covers the role of the oxide sintering phase in AlN in defining the materials microstructure and thus determining key properties such as thermal conductivity and mechanical strength.


Attend FPD China for next-gen display technologies and China's displays industry role

Thu, 3 Mar 2012

Dynamic changes in the FPD industry range from new LCD, AMOLED, touch, and flexible technologies to the emergence of China as the leading consumer and manufacturer of display products. FPD China covers the entire industry supply chain.


OSRAM optimizes LED for improved efficiency with stable luminous flux

Thu, 3 Mar 2012

OSRAM Opto Semiconductors released the Oslon SSL LED, using optimized LED chips and packaging technologies to boost light output, with a 25% efficiency increase over previous-generation LEDs.


Spectroradiometer measures LED phosphors

Wed, 2 Feb 2012

Gamma Scientific developed the Bi-Spectral Fluorescence Spectroradiometer to quickly obtain detailed fluorescence data for LED phosphors and other fluorescent or reflective materials.


AIXTRON installs high-capacity epitaxy system at Epistar for LED fab

Wed, 2 Feb 2012

Epistar installed its first AIXTRON SE CRIUS II-XL system in a 19 x 4" wafer configuration to mass produce ultra-high-brightness (UHB) blue and white LEDs.


China's LED subsidy update

Tue, 2 Feb 2012

The formal announcement of China's light emitting diode (LED) subsidy program, likely in the first half of March, may drive tool utilization expansions for LED chip makers, reports Barclays Capital.


Cleantech Solutions sends sample sapphire chambers to LED maker

Mon, 2 Feb 2012

Cleantech Solutions International has delivered two units of sample sapphire chambers and one unit of a solar furnace to an international customer.


UL authorized for LED testing to Zhaga standards

Mon, 2 Feb 2012

UL has been named a Zhaga-authorized LED testing center. Zhaga standards cover the physical dimensions, as well as the photometric, electrical and thermal behavior of LED light engines.


LEDs outshine legacy lighting business structure at LightFair 2012

Thu, 5 May 2012

“LED is now the dominant force in lighting for the foreseeable future,” reports Ted Konnerth of Egret Consulting Group, after LightFair 2012. What does that mean for traditional lighting products, applications, distribution channels, and talent?


EpiGaN opens GaN-on-Si wafer production at new site

Wed, 5 May 2012

EpiGaN NV opened its GaN epitaxial material production site, on the Research Campus Hasselt in Belgium. EpiGaN’s GaN-on-Si material is used in next-generation power electronics.


JEDEC creates LED test standards series

Wed, 5 May 2012

JEDEC Solid State Technology Association created a series of standards, JESD51-5x, for component-level testing of high-brightness/power LEDs.


Quantum dots to see 55% 10-year CAGR on LED, display, healthcare, other applications

Tue, 5 May 2012

Quantum dots will grow to a $7480.25 million market by 2022, at a ten-year CAGR of 55.2%, according to Electronics.ca Publications.


3M flexible barrier films for displays come to market

Tue, 5 May 2012

M’s Optical Systems Division made its flexible, optically clear 3M FTB3-50 and FTB3-125 films available commercially, to protect sensitive electronics displays from water vapor and oxygen. The films previously were sold under limited R&D agreements.


OLED is a technology, not an answer, for TVs: DisplaySearch

Mon, 5 May 2012

DisplaySearch's Paul Gray advises that TV makers “think deeply about how consumers are watching long-form video at home” before leaping to conclusions about OLED’s impact. “The industry need not take billion dollar technology bets to provide better products.”


Wafer bonding enables better LEDs with right process and materials

Mon, 5 May 2012

LED manufacturers must choose the appropriate materials and processes to fight low yields, writes Thomas Uhrmann of EV Group (EVG).


MOCVD sales halved from 2011 to 2012

Fri, 3 Mar 2012

342 MOCVD tools for LED manufacture will ship in 2012, compared to 654 last year, IMS Research reports in its most recent GaN LED Quarterly Supply and Demand report. Without China, the market would be nearly still.


SEMICON Europa 2012 seeks presenters

Fri, 3 Mar 2012

SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30.


LED maker Luminus Devices accredited to LM-80 test standard

Fri, 3 Mar 2012

Luminus Devices received accreditation to test its LEDs to the LM-80 standard, the approved method for measuring LED light sources under ISO/IEC 17025:2005.


HC Starck tailors thin-film sputtering for OLED displays

Fri, 3 Mar 2012

H.C. Starck notes that the majority of FPD production occurs in Japan, Korea, Taiwan and China. The rapid growth of OLED screens in the FPD industry punctuates the increased need for high-tech materials, the company asserts.


Kaistar to fab LEDs with ultra-high-purity ammonia from LLH China

Thu, 3 Mar 2012

Linde LienHwa (LLH) China will be the exclusive gas supplier to Kaistar, delivering bulk gases and high-purity ammonia (NH3) to Kaistar’s new LED production facility in Xiamen, China.


DOW opens semiconductor/display R&D center in Seoul with OLED focus

Thu, 3 Mar 2012

The Dow Chemical Company (NYSE: DOW) inaugurated its Dow Seoul Technology Center, a global R&D center with focus on technological advances in display and semiconductor applications.


Intematix remote phosphor enables 100W-equivalent LED bulbs

Thu, 5 May 2012

Intematix debuted ChromaLit Contour remote phosphor architecture. ChromaLit Contour is shaped to enable internal and external convection airflow, cooling LEDs in 60, 75 and 100W-equivalent omni-directional lights.


Cree LED test suite TEMPO 24 incorporates IES LM-79

Tue, 5 May 2012

Cree Inc. added TEMPO 24 tests to its Cree Services for LED luminaires. TEMPO 24 combines the IES LM-79-08 photometric test with nearly a dozen other LED performance tests.


Toyoda Gosei, Showa Denko form GaN LED JV

Tue, 5 May 2012

Showa Denko KK will transfer 70% of its gallium-nitride (GaN)-based blue light emitting diode (LED) chip business into a new company, TS Opto Co. Ltd, with Toyoda Gosei Co. Ltd.


SEMI lauds Congressman Dave Camp (R-MI) for microelectronics/photovoltaics support

Wed, 5 May 2012

SEMI presented US Congressman Dave Camp (R-MI) with its 2012 North American Government Leadership Award for his leadership and support of the US microelectronics and photovoltaic manufacturing value chain.


LED manufacturer Lumichip expands in Finland, opens development center

Fri, 4 Apr 2012

Lumichip Limited, an LED manufacturer, expanded its commercial operations in Finland and opened a new development center in Espoo, Finland.


AMOLED scales up with virtually 100% concentration in Korea

Fri, 4 Apr 2012

Active-matrix organic light-emitting diode (AMOLED) displays manufacturing is virtually 100% concentrated in Korea, according to Displaybank, with Samsung Mobile Display (SMD) and LG Display (LGD) scaling up capacity.


MEI semiconductor wet process tools built to prevent contamination

Fri, 4 Apr 2012

MEI uses Vycom Flametec PVC-C for chemical rinse tanks and other wafer-contacting elements of its process tools, reducing tool-based contamination and protecting fab workers. Bill McGinty, MEI operations manager, discusses the benefits the new-generation plastic for semiconductor fab tools.


LED maker orders multiple fab tools from OEM Group

Thu, 4 Apr 2012

OEM Group began shipping a multi-tool order to a major LED manufacturer, including Spray Ozone Tool and Spray Acid Tool semi-automated batch surface preparation systems.


Media tablets join top 5 semiconductor end-markets in 2012

Fri, 3 Mar 2012

Media tablets, experiencing "remarkably rapid ascension," will become the 4th largest application for semiconductors by 2014, up from 35th in 2010, according to IHS.


MoCu LED material optimizes thermal management

Fri, 3 Mar 2012

PLANSEE developed Mo-Cu R670, a new molybdenum-copper composite material for optimizing heat dissipation in light-emitting diodes (LEDs).


China-based LED maker orders 3 AIXTRON MOCVD tools

Thu, 3 Mar 2012

AIXTRON received a new MOCVD systems order from existing customer Quantum Wafer Inc., China. The 3 additional MOCVD units will process HB-LED wafers based on GaN materials.


Nitrogen-rich indium nitride wafers debut from Meaglow

Wed, 3 Mar 2012

Meaglow Ltd., MOCVD and epitaxy supplier, launched a range of nitrogen-rich indium nitride (InN) wafers for research and industry development around the compound semiconductor material.


LED makers could diversify with GaN power electronics production

Wed, 3 Mar 2012

The gallium nitride (GaN) power elec market is currently small, but new entrants are ramping to production, silicon-based electronics suppliers developing GaN, and LED makers diversifying capacity to make power semis.


Automated film frame handlers increase LED and semiconductor production

Tue, 3 Mar 2012

Owens Design Inc. released multiple customized film frame automated handlers to customers in the semiconductor and LED manufacturing tool industries.


HB-LED market grew 4.3% in 2011, with uneven distribution

Tue, 3 Mar 2012

The market volume for HB-LEDs reached $12 billion in 2011, a 4.3% growth over 2010, reports EPIC, The European Photonics Industry Consortium.


SMC 2012: Supply chain opportunities in OLEDs, energy storage, and power semiconductors

Fri, 11 Nov 2012

Materials experts from across the supply chain gathered at the 2012 Strategic Materials Conference 2012 in San Jose in October, discussing key materials needs for micromanufacturing outside the CMOS mainstream: OLEDs and GaN-on-silicon power semiconductors, graphene, CNTs, and self-assembling polymers.


OLED TV panels' breakout year delayed, but it's coming

Mon, 11 Nov 2012

Despite continued delays from its two big proponents, OLED TV technology will finally start ramping over the next year, reaching one million unit shipments in 2014 and a 3% market penetration by 2016, says NPD DisplaySearch.


OLED lighting sales could reach $1.7B by 2020 -- if panel makers commit now

Fri, 11 Nov 2012

There's a new battleground slowly emerging for OLEDs in lighting applications where the technology could offer some advantages in design and efficiency -- if panel makers are willing to make some sacrifices.


ProTek offering unpackaged die for LEDs

Tue, 10 Oct 2012

ProTek Devices says it is now offering individual unpackaged die for LEDs in wafer form, available as unidirectional and bidirectional electrostatic discharge (ESD) protection diodes.


Roll-to-roll plasma etch equipment project completed

Wed, 10 Oct 2012

FlexTech Alliance announced the completion of a development project with Etched in Time, Inc. (EITI), for a plasma etch system that is compatible with a wide array of roll-to-roll equipment.


Process Watch: Cycle time’s paradoxical relationship to inspection

Tue, 12 Dec 2012

In the seventh installment in a series called Process Watch, the authors discuss cycle time and the impact of inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.


Sony and Toshiba fight declines with chip spending -- can it work?

Mon, 12 Dec 2012

Despite weak financial performances, sluggish global markets and strong regional competition, Japanese consumer electronics giants Sony and Toshiba are increasing their investments in new products to revitalize their businesses.


KLA-Tencor's updated LED wafer inspection tool boosts throughput, efficiency

Thu, 12 Dec 2012

KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers.


When will bulk GaN be price-competitive with silicon?

Mon, 11 Nov 2012

Wide bandgap semiconductor materials can significantly outperform traditional silicon-based devices in power electronics and light-emitting diodes (LEDs), but they're vastly more expensive. So where's the midpoint where GaN's capabilities and extra costs align to make it the preferred technology for each application?


EV Group completes cleanroom expansion, opens new R&D labs

Wed, 11 Nov 2012

EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services.


LED market for indoor residential lighting poised to surge

Tue, 11 Nov 2012

Technology improvements and supportive legislation are gathering momentum to help push LED adoption for residential buildings -- the largest lighting application sector.


Growth outlook for industrial semiconductors dims to 3% in 2012

Fri, 11 Nov 2012

Growth in the industrial electronics semiconductor market is set to fall short of previous expectations in 2012 as the business is buffeted by weakening global economic conditions, with the LED market the sole bright spot, says IHS iSuppli.


Brewer Science introduces CNT inks for printed electronics

Thu, 11 Nov 2012

Rolla, MO-based Brewer Science introduced a line of conductive CNT ink materials that are surfactant free, require no additional rinse steps, and are compatible with a broad range of printed electronic substrates.


Printed electronics materials swell to $2.6B by 2017

Thu, 11 Nov 2012

The market for materials used in printed electronics manufacturing will nearly double over the next five years as new materials are brought forth to support low-cost volume production of printed electronic devices, according to Lux Research.


Semi execs see a bright 2013, says survey

Fri, 12 Dec 2012

Industry watchers have been lowering their outlooks for 2013 over the past few weeks, but there's one set of opinions that still see optimism for an industry rebound in 2013 -- chip industry executives themselves.


Ultratech buys Cambridge Nanotech assets, adds ALD tech

Thu, 12 Dec 2012

Ultratech has acquired the assets of Cambridge Nanotech, a developer and supplier of atomic-layer deposition (ALD) technology, which had quietly been put on the auction block after ceasing operations in November.


Canon stepper targets LED, MEMS, power device manufacturing

Tue, 12 Dec 2012

Canon U.S.A., Inc. recently launched the FPA-3030i5+ i-line stepper, designed for the manufacturing of LEDs, MEMS and power semiconductors.


OLED materials ramp to $7B in 2019

Tue, 8 Aug 2012

With OLED adoption, the total market value of materials used in OLED applications will grow quickly from about $500 million in 2012 to over $7 billion by the end of 2019, reports NanoMarkets.


Rubicon orders Zeta 300 optical profilers for sapphire LED substrates

Mon, 8 Aug 2012

Zeta Instruments will install multiple optical profilers for micron-scale surface analysis at sapphire substrate maker Rubicon Technology, for metrology and inspection on sapphire substrates and wafer production aimed at the HB-LED market.


Panasonic reorgs R&D along medium-, long-term roadmaps

Fri, 8 Aug 2012

Panasonic Corporation (NYSE:PC, TOKYO:6752) will reform its head office and governance as of October 1, aiming to reduce internally focused work and focus on customer needs.


Siemens to spin off LED and lighting subsidiary OSRAM

Thu, 8 Aug 2012

Siemens will publicly list OSRAM via a spinoff to Siemens shareholders, rather than an IPO. Spinning off OSRAM will make the public listing more independent of capital market conditions.


ITO alternatives for transparent conductors: From nanotubes to ZnO, adoption varies

Wed, 8 Aug 2012

Most firms offering alternatives to ITO focus on the touch-screen sensor market; however, this sector is too small for many of these firms to generate significant revenues. NanoMarkets outlines the various ITO alternatives, and their possible application spaces.


As LED growth switches from backlights to home lamps, phosphors gain importance

Tue, 7 Jul 2012

NanoMarkets issued a new white paper on LED phosphors, "LED Lighting Driving Demand for New Phosphors," that covers the shifting use of phosphors, which modulate the light emitted by LEDs, from LCD backlighting to solid-state lighting.


LED encapsulants grow with increased LED adoption

Tue, 7 Jul 2012

LED encapsulants are closely related to the LED’s lifespan and light transmittance. With high-power and high-brightness LEDs emerging, the encapsulant’s role is becoming more important, says Displaybank.


Toshiba plans GaN-on-Si LED production line in Japan

Mon, 7 Jul 2012

Toshiba will start mass production of white LEDs on a new 200mm wafer production line in its Kaga Toshiba Electronics Corporation fab in northern Japan.


Plessey invests in GaN-on-Si HB-LED production, adds AIXTRON reactor

Mon, 7 Jul 2012

Plessey Semiconductors is installing a multi-million pound HB-LED production line at its Plymouth, UK facility, including a new AIXTRON reactor.


Guide to LED and OLED programs at SEMICON West

Thu, 6 Jun 2012

SEMICON West 2012 will take place July 10-12 at the Moscone Center in San Francisco, CA. Following is a preview of the LED and OLED events taking place during SEMICON West, from contributor Paula Doe, SEMI Emerging Markets.


Edwards tailors vacuum pump for LED, compound semiconductor manufacturing

Tue, 6 Jun 2012

Edwards (NASDAQ:EVAC) introduced the new iXH645H dry pump, optimized for metal-organic chemical vapor deposition, a key step in LED and compound semiconductor manufacturing.


JPSA picosecond laser micromachining platform reduces debris and thermal damage

Tue, 6 Jun 2012

JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.


Sony, Panasonic combine OLED manufacturing expertise to achieve large-panel, low-cost fab

Mon, 6 Jun 2012

Panasonic and Sony will combine their core and printing technology to jointly develop next-generation organic light-emitting diode (OLED) panel and module manufacturing technology.


SEMICON West preview: OLED displays and lighting adopt printing processes, flexible substrates

Tue, 7 Jul 2012

Technology for making circuits with organic materials, non-vacuum processes, and flexible substrates has made striking progress, but it’s been a challenge to find applications where the new technologies offer must-have advantages. Paula Doe, SEMI, reports on flexible and large-area OLED displays and lighting.


Cree, SemiLEDs end LED patent litigation with settlement

Tue, 7 Jul 2012

LED makers Cree Inc. (NASDAQ:CREE) and SemiLEDs Corporation (NASDAQ:LEDS) have agreed to end their respective patent infringement litigation against each other.


Vertical LED + metal alloy substrate = higher thermal endurance

Mon, 7 Jul 2012

SemiLEDs Corporation (NASDAQ:LEDS) combined its vertical LED chip architecture with a proprietary metal alloy substrate to create the Enhanced Vertical (EV) LED product line.


Samsung Mobile Display sources OLED materials from Novaled

Mon, 7 Jul 2012

Samsung Mobile Display (SMD) wiill purchase dopant materials used in the transport layers of its AMOLED display modules from Novaled. Novaled will also provide its proprietary PIN OLED technology to SMD for use in the production of SMD’s AMOLED display modules.


OLED thin-film encapsulation technology key to new applications

Fri, 6 Jun 2012

OLED thin film encapsulation technology is the one of technologies emerging as the core technology of flexible OLED, and technology development and patent securing competition between world’s leading OLED companies will increase accordingly, shows Displaybank.


SiC's advantages over silicon push more SiC semiconductors over 10 years

Fri, 6 Jun 2012

Silicon carbide (SiC) semiconductors will see 38% CAGR through 2022 thanks to power and efficiency advantages over silicon devices, according to MarketResearch.com.


ALD partnership enables surface functionalization of powders

Fri, 6 Jun 2012

Cambridge NanoTech entered a licensing agreement with Ghent University in Belgium to commercialize an ALD particle coating technology that uses thermal and plasma processes.


Osram devises LED solder pad concept for easier second sourcing

Thu, 7 Jul 2012

Osram Opto Semiconductors developed a concept for uniform solder pads based on the Oslon LED component family. This enables second sourcing by Osram’s LED customers without an additional soldering board, potentially reduces the costs of storage and process modification.


Avnet opens US light lab for LED measurement and testing

Tue, 7 Jul 2012

Avnet Electronics Marketing Americas, part of Avnet Inc. (NYSE:AVT) opened a lighting lab in Chandler, AZ, to measure LED properties for various applications.


LED phosphor supplier Intematix plans IPO

Tue, 7 Jul 2012

Intematix Corporation, phosphor and phosphor component developer for LEDs, plans to conduct a registered initial public offering (IPO) of its common stock.


LEDs revenues grow even as prices fall through 2016

Mon, 7 Jul 2012

LED prices are declining, as revenues are growing through 2016, according to a report from Strategies Unlimited. Trends include multi-chip packaging and different LED power levels for different applications.


LED balance of system trends: Patents in the remote phosphor technology space

Mon, 7 Jul 2012

Lily Li, patent strategist at IP Checkups, examines remote phosphors for LED bulbs, in "Patents compete for priority in the remote-phosphor LED technology space," LEDs Magazine, July/August issue.


LED bulb cost halved by 2020

Mon, 7 Jul 2012

The price of a LED bulb will fall by about half by 2020, hitting $11.06, according to Lux Research. With the LED chip package seeing 70%+ cost reduction, technology innovation will shift to the surrounding elements: thermal management, drivers and optics.


Terry Brewer chats about SEMI and semiconductors at SEMICON West

Fri, 7 Jul 2012

Terry Brewer, one of the newest members of SEMI's North American advisory board, talks about semiconductor industry consolidation, as well as new technologies and materials in the industry. He shares how SEMI is reacting to this evolution.


LED fab equipment capex to brighten in H2 2012

Fri, 7 Jul 2012

SEMICON West confirmed for Barclays that Q2 2012 orders for MOCVD tools remained flattish with the trough-like Q1 numbers, and LED makers are expected to order more tools in H2 2012.


Semiconductor fab tool capex trends gleaned @ SEMICON West

Thu, 7 Jul 2012

After meeting with various semiconductor manufacturing tool suppliers -- Applied Materials, KLA-Tencor, Lam Research, Tokyo Electron, Teradyne and Cymer -- at SEMICON West, Citi analysts share impressions on foundry spending plans and tool choices.


Osram plans LED packaging facility in Wuxi

Fri, 6 Jun 2012

OSRAM AG will build a new LED assembly plant in Wuxi, Jiangsu, China, packaging LED chips fabbed at its Regensburg, Germany and Penang, Malaysia wafer processing facilities.


Picosecond laser enables new high-tech devices

Thu, 7 Jul 2012

Industrially proven and robust, picosecond lasers are proving their worth in cutting and patterning of delicate materials for a wide variety of industrial applications.


Novaled's new OLED materials set could double OLED lifetimes

Thu, 5 May 2012

Novaled debuted a class of n-doped electron transport layer (ETL) materials for OLED TV and mobile displays.


CNTs produced with >95% semiconducting content now available from SWeNT

Thu, 5 May 2012

SouthWest NanoTechnologies (SWeNT) released SG65i, a single-wall carbon nanotube product with >95% semiconducting concentration, before secondary processing to remove metallic SWCNT content.


Largest flexible OLED display fabbed with mixed-oxide TFT

Wed, 5 May 2012

The Flexible Display Center at ASU, in conjunction with Army Research Labs scientists, manufactured what it is reporting as the world's largest flexible, full-color OLED display prototype. FDC used advanced mixed-oxide TFTs to build the 7.4” device.


Phosphor market expands as LEDs move into lighting applications

Wed, 5 May 2012

Phosphors used in LED lighting applications will see a market increase to over $1.6 billion by 2019, says NanoMarkets. Phosphors help control LED luminous efficacy and color to bring the technology on a level with traditional lighting.


Cree CFO departs after growing the LEDs company to $1B+

Mon, 5 May 2012

Universal Display intros novel emission layer systems for OLEDs

Tue, 6 Jun 2012

Universal Display Corporation (NASDAQ: PANL) introduced new red, green, and yellow UniversalPHOLED products, combining UniversalPHOLED emitter materials with novel host systems.


LED manufacturer Marl taps DEK for print tool

Sun, 6 Jun 2012

LED specialist Marl will install the DEK Horizon 03iX print platform to adapt to new circuit board size requirements, and will use the VectorGuard stencil system and Nano-ProTek.


NXP develops GaN-on-Si for power semiconductors with Singapore’s A*STAR

Fri, 6 Jun 2012

A*STAR Institute of Microelectronics and NXP Semiconductors (NASDAQ:NXPI) will collaborate on 200mm GaN-on-Si process and technology development for high-voltage power devices.


PVD process generates 10" AlN-on-sapphire template wafer at Kyma

Fri, 6 Jun 2012

Kyma Technologies demonstrated a 10" AlN on sapphire template, manufactured on its plasma vapor deposition on nanocolumns technology. The 10” sapphire substrate was provided by Monocrystal.


How emerging growth sectors impact the overall semiconductor industry: ConFab preview

Thu, 5 May 2012

Intel's Jackie Sturm will bring to light some of the emerging, growth markets for semiconductors, and what they mean for chipmakers and the fab suppliers in the first session of The ConFab, “The Economic Outlook for the Semiconductor Industry.”


LED insights from SEMICON West 2012

Wed, 7 Jul 2012

Citi analysts surveyed the LED manufacturing market and LED demand at SEMICON West in San Francisco, CA, including a slight uptick in MOCVD orders, and some backlash against Cree's downstream ambitions.


Soitec claims lower-cost GaN template wafers for LED fab with HVPE, partners with Silian

Tue, 7 Jul 2012

Soitec partnered with Silian to jointly develop GaN template wafers using hydride vapor phase epitaxy (HVPE). The resulting GaN template wafers will reduce the cost of manufacturing LEDs.


AMOLED manufacturing improvements to enable TV market share grab

Mon, 7 Jul 2012

AMOLED is entrenched in the small- and medium-sized displays market. For the technology to capture significant market share in the large-size, TV-bound display market, manufacturers will need to invest in better, higher throughput processing, shares Displaybank.


Top conference reports from H1 2012

Fri, 7 Jul 2012

We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco.


Brighter LEDs with ARC Energy's sapphire technology

Thu, 7 Jul 2012

Sapphire grown in ARC Energy’s proprietary CHES yields 5% brighter LEDs than the industry standard, according to the company’s study.


Cree opens LED technical eval centers in China

Wed, 6 Jun 2012

Cree Inc. (Nasdaq:CREE) is opening new technology centers in Shenzhen and Shanghai, China, expanding Cree TEMPO (Thermal, Electrical, Mechanical, Photometric, Optical) Services for LED lighting manufacturers evaluating LED luminaires.


Lattice Power ramps high-power GaN-on-Si LED production

Tue, 6 Jun 2012

Lattice Power Corporation started volume production of its new-generation gallium nitride (GaN) high-power LEDs on silicon substrates.


High Tech Lights "reshores" LED manufacturing and R&D jobs

Tue, 6 Jun 2012

High Tech Lights is participating in a “Reshoring Initiative” by bringing job positions from China to the US for LED and laser diode scientists, manufacturing and assembly workers, and R&D staff.


PANL hits white OLED performance record

Mon, 6 Jun 2012

Universal Display Corporation (NASDAQ: PANL) announced record-breaking performance of its white organic light-emitting diode (OLED) lighting technology.


LED wafer prices stabilize with more suppliers and steadier demand

Mon, 6 Jun 2012

A balance of LED demand and supply in 2012 is based on the downward-stabilized price of sapphire wafers. More ingot suppliers are coming online, with new entrants in Korea and China, providing a broader supplier base for LED makers, shows Displaybank.


Veeco adds high-performance, compact MOCVD tools to TurboDisco line-up

Thu, 6 Jun 2012

Veeco Instruments added 3 new models of its TurboDisc MOCVD systems for HB-LED production: TurboDisc MaxBright M and MHP, and TurboDisc K465i HP.


FUJIFILM sells OLED patent portfolio to Universal Display for $105M

Thu, 7 Jul 2012

FUJIFILM sold its 1,200+ OLED patents and patent applications to Universal Display for $105 million, with the companies embarking on a strategic relationship in this technology space.


AIXTRON debuts GaN-on-Si MOCVD reactor technology

Thu, 7 Jul 2012

AIXTRON SE introduced a 5 x 200mm gallium nitride on silicon (GaN-on-Si) reactor design for its G5 Planetary Reactor MOCVD platform. AIX G5+ comprises special reactor hardware and process design, developed with customers in AIXTRON’s R&D lab.


2012 smartphone displays forecast lowered, but display type matters

Thu, 7 Jul 2012

DisplaySearch has lowered its 2012 mobile phone displays forecast from 1,917 million units to 1,729 million units. Comparing last quarter's forecasts and actual shipment results by technology, NPD DisplaySearch found that AMOLED actually had higher growth, but other technologies showed declines.


OLEDs World Summit agenda doubles focus on lighting

Wed, 7 Jul 2012

Panasonic, LG Chem and Philips are among the presenters for the upcoming 14th annual OLEDs World Summit, September 26-28, in San Francisco, CA.


Polarizer film trends: AMOLED growth, and acrylics move in

Wed, 7 Jul 2012

Polarizers used in display manufacturing will form a $9.94 billion market in 2012, up 4% from 2011, according to Displaybank. Sequentially, the polarizer market decreased by 9% in Q1 2012, hitting 2.235 billion. This was down 6% from Q1 2011.


SiC manufacturing: Patents don’t equal revenue/market share, and watch for challengers to PVT growth

Tue, 7 Jul 2012

SiC is a niche material for semiconductor, power electronics, and LED manufacturing. Yole analyzed patents related to SiC growth and wafer manufacturing to glean trends in production, R&D, top companies, barriers to entry, and more.


Present on LEDs at Strategies in Light 2013

Mon, 7 Jul 2012

Strategies in Light 2013 will take place February 12-14 in Santa Clara, CA, hosted by PennWell Co.’s Strategies Unlimited and LEDs Magazine. The event’s theme is “Exploring the Growth Opportunities in the LED and Lighting Markets.”


Tier-1 LED makers see high utilization, but MOCVD demand won’t leap

Fri, 7 Jul 2012

Maxim Group analyzed MOCVD utilization and revenues at LED makers in Taiwan, finding that MOCVD orders are placed just to maintain capacity, not add, and high utilization rates are only at the top LED makers.


LED cost and manufacturing topics of Veeco LED maker gathering in Taiwan

Fri, 7 Jul 2012

Veeco hosted more than 150 LED manufacturers and customers of its MOCVD products recently during its MOCVD User Meeting in Taiwan. The talks largely focused on reducing LED cost through manufacturing, as well as using silicon as an LED substrate.


PANL, Plextronics expand OLED partnership to cover hole injection, transport materials

Fri, 7 Jul 2012

Universal Display broadened its work with Plextronics to accelerate the development and commercialization of solution-based OLED material systems. They will combine Plextronics’ hole injection and hole transport materials with Universal Display’s phosphorescent OLED emissive layer materials.


MIT team models electronic behavior of OLEDs and other organic electronics

Fri, 6 Jun 2012

A multidisciplinary research team at MIT and the Universidad Autónoma de Madrid developed a new mathematical approach to simulating the electronic behavior of noncrystalline materials, with applications in OLEDs, flexible printable organic electronic circuits, and solar cells.


LED manufacturing equipment status report

Thu, 6 Jun 2012

To support the next cycle of LED manufacturing, tools such as MOCVD, plasma etch, lithography, and others must undergo cost efficiency and yield improvements, says Yole Développement. Trends include migrating to larger wafers, silicon substrates, and tools developed specifically for LED fab, rather than retooled from semiconductor manufacturing specs.


PLANSEE ultra-smooth tungsten crucibles yield more sapphire wafers for LED fab

Wed, 6 Jun 2012

PLANSEE has developed a pressed-sintered tungsten crucible with an ultra-smooth surface to avoid sapphire ingot or crucible damage in the Kyropoulos method.


LUXeXceL, LTI Optics enable "digitization" of lighting optics

Wed, 6 Jun 2012

LTI Optics’ Photopia Parametric Optical Design Tools module enables creation of optical designs to achieve a prescribed distribution of light. LUXeXcel introduced its one-step 3D Printoptical printing process for plastic optics for lighting fixtures, which can create custom optics from the LTI Optics' CAD model at prices competitive with injection molding.


Silicon chip-on-board LED substrate enables best thermal dissipation

Mon, 6 Jun 2012

Daewon Innost achieved what it says is the LED industry’s best thermal dissipation performance on its Glaxum LED Array family, based on the proprietary Nano-Pore Silicon Substrate (NPSS) technology.


OLED adoption means shifting reqs for OLED materials

Mon, 6 Jun 2012

Luminus Devices cuts LEDs’ thermal resistance 30% with new packaging

Thu, 6 Jun 2012

Luminus Devices Inc. is reducing thermal resistance in its Big Chip LED devices by 30% with new packaging technology.


Metrology merger: MicroSense acquires SigmaTech

Wed, 6 Jun 2012

MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.


Low LED prices, subsidy’s role, and MOCVD update from China

Wed, 6 Jun 2012

Guangzhou (China) Lightfair Conference is the biggest lighting fair in Asia. Citi analyst Timothy Arcuri notes trends in LED manufacturing and pricing ahead of China’s subsidy program going into effect.


iPhone 5: Which semiconductor suppliers are the big winners?

Fri, 9 Sep 2012

As the dust settles after the launch of the iPhone 5, analysts tally which suppliers in the semiconductor ecosphere are most likely to gain the most.


GaAs nanowires on graphene focus of NTNU research

Wed, 9 Sep 2012

Researchers at the Norwegian University of Science and Technology in Trondheim (NTNU)  have patented and are commercializing GaAs nanowires grown on graphene.


LED makers urge DoE for more support

Wed, 9 Sep 2012

Stakeholders in LED manufacturing have met with US Department of Energy officials to plead their case for increased support in solid-state lighting (SSL) R&D and manufacturing, asserting that the technology's energy conservation benefits and ROI surpasses those of renewable energy technologies that get much more backing.


Waiting for the next "golden year"

Fri, 9 Sep 2012

While various industry segments appear to be tapping the brakes, others are revving their engines, observes SEMI's Christian Gregor Dieseldorff -- and a 2012 stall could pave the way for a record-breaking 2013.


Hidden trends amid slowing GaAs epi substrate output

Thu, 9 Sep 2012

GaAs epitaxial substrate production rose just 3% in 2011 as handset power amplifiers offset a shift away from GaAs for handset switches, but inside that slowing slope are two key market drivers, according to Strategy Analytics.


SemiLEDs replaces president, adds sales exec

Thu, 9 Sep 2012

Taiwan-based SemiLED says it has replaced two top execs, weeks after posting another quarter of weak financials and a patent litigation settlement that restricts its product sales in the US.


Technology alliance formed for glass and brittle materials processing

Fri, 8 Aug 2012

Three leaders in their respective fields have formed a technology alliance to bring a new glass cutting technology to market. InnoLas Systems GmbH licensed process technology developed by FiLaser LLC and will use ultra-short pulse lasers produced exclusively for InnoLas by LUMERA LASER GmbH.


LEDs to get backlighting market share help from rising CCFL costs

Mon, 8 Aug 2012

In 2011, LEDs were expected to grab market share from CCFLs in the display backlighting segment. However, prices for CCFL-backlight TVs fell alongside prices for LED-backlit TVs. Now, CCFL raw materials costs have exploded, setting the stage for market share grabs by LEDs, albeit later than expected, reports Jimmy Kim, DisplaySearch.


Albermarle expands MOCVD materials production with Korean plant

Fri, 8 Aug 2012

Albemarle will expand its facility in Yeosu, Korea, with additional manufacturing capacity for PureGrowth products for MOCVD processes.


How to reduce large-size AMOLED display fab costs

Thu, 8 Aug 2012

AMOLED displays are growing rapidly and offer many performance benefits over LCDs. However, 55” AMOLED TV displays cost 8-10x as much as a comparable LCD to manufacture. NPD DisplaySearch looks at ways to improve costs/fab.


AIXTRON tool supports OTFT, OLED, other organic electronics manufacturing

Thu, 8 Aug 2012

AIXTRON launched the PRODOS-200 PVPD system for deposition of organic thin film materials, used to make OTFT displays and OLEDs, and in other manufacturing applications.


What Cree's record Q4 means for the LED industry

Thu, 8 Aug 2012

Cree saw 8% quarter-to-quarter growth in FY2012 Q4, but only 2% growth in its LED component business. Reasons could include customer pushback from Cree's move into their space, lower average selling prices for LED chips, and more efficient LED modules that use fewer chips.


LED industry will change significantly as lighting takes off

Wed, 8 Aug 2012

The LED industry is entering its third growth cycle, general lighting, according to Yole and EPIC’s report, “Status of the LED Industry.” However, the cost of a packaged LED still needs to be reduced by a factor x10 to enable massive adoption. New business models are mandatory to capture added value of LED lighting.


Measuring inside an active OLED

Mon, 10 Oct 2012

Researchers at the National Institute of Advanced Industrial Science say they have devised a way to selectively and nondestructively evaluate molecules within a sealed organic light-emitting diode (OLED) in operation, in hopes to further understand and eventually minimize performance degradation.


From fuzzy to focused: Phase I in project development

Fri, 10 Oct 2012

Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.


Azzurro, Epistar achieve GaN-on-Si on 150mm

Wed, 10 Oct 2012

Azzurro and Epistar say they have achieved GaN-on-Si based high-brightness LEDs on 150mm GaN-on-Si substrates, billed as "one step further towards implementation in mass production."


Solvay unveils high-performance polyester material for LED TV components

Mon, 10 Oct 2012

Solvay Specialty Polymers USA LLC has extended its line of high-performance polyester compounds with a new version targeting light-emitting diode (LED) TVs with higher heat and light stability.


GaAs faces slowing demand from 2011 on

Wed, 8 Aug 2012

H2 2011 saw slow growth for gallium arsenide (GaAs) substrates in semiconductor and related devices, as well as a shift away from GaAs as a handset switch technology. However, the March 2011 earthquake and tsunami in Japan disrupted the supply chain, driving up substrate pricing and overall revenue to nearly $230 million.


New tool performs metal dicing, scribing for LED manufacturing

Thu, 8 Aug 2012

JP Sercel Associates' new IX-6100-MD can scribe and dice a variety of metal layers and alloys used in LED manufacturing.


Dynamic changes impacting advanced electronic materials industry

Wed, 8 Aug 2012

Learn about the changes in semiconductor manufacturing as well as related markets -- photovoltaics, displays, LEDs, etc -- at the 2012 Strategic Materials Conference (SMC), to be held on October 23-24 in San Jose, CA. SEMI reports.


Samsung and LED maker OSRAM settle patent disputes globally

Mon, 8 Aug 2012

OSRAM AG and Samsung Electronics Co., Ltd. have reached an agreement to settle all patent suits between them worldwide. The parties have reached license agreements for their respective LED patent portfolios.


LED researchers in China order AIXTRON MOCVD tool

Fri, 8 Aug 2012

Jilin University China has installed an AIXTRON CCS MOCVD 3 x 2” wafer configuration system for GaN UV and white LED research.


Cree intros 150mm 4HN SiC epi wafers

Fri, 8 Aug 2012

Cree announced the availability of high quality, low micropipe 150mm 4H n-type silicon carbide (SiC) epitaxial wafers. 150mm epitaxial wafers with highly uniform epitaxial layers as thick as 100µm are available for immediate purchase


Molybdenum disulfide has all the 2D potential of graphene, with a bandgap

Thu, 8 Aug 2012

MIT researchers are building various electronic components out of a 2D form of molybdenum disulfide (MoS2). This is the start of a “new realm” of research into 2D materials for electronic materials and devices, according to one researcher.


Laser diode researchers order Oxford Instruments ion beam depo tool

Thu, 8 Aug 2012

Optoelectronics researchers at the Ferdinand-Braun-Institut ordered an Optofab3000 for Laser Bar Facet Coating from Oxford Instruments Plasma Technology.


Technology licensing company Rambus restructures, creates CTO role

Thu, 8 Aug 2012

Rambus Inc. (NASDAQ:RMBS), a technology licensing company, will undergo a restructuring and related cost saving measures to cut its expenses by$30-35 million annually.


LED maker Epistar plans takeover of subsidiary

Wed, 8 Aug 2012

LED maker Epistar will completely take over its subsidiary Huga Optotech, which produces LED wafers and chips, through a share swap.


Printing methodologies for various electronic devices

Tue, 8 Aug 2012

Printing is emerging as a technology that can replace traditional photolithography processes for electronics manufacturing, reducing costly material use, very complex processes, and expensive equipment.


OSRAM lays foundation for LED plant in China

Mon, 8 Aug 2012

OSRAM AG, LED manufacturer, laid the foundation for its Wuxi, China, plant, in a ceremony attended by high-ranking representatives of the Jiangsu province.


ON Semiconductor joins imec’s GaN-on-Si research program

Fri, 10 Oct 2012

ON Semiconductor has joined imec to collaborate on the development of next-generation GaN-on-Si power devices. ON Semiconductor is presently building a GaN processing line in its Oudenaarde facility in Belgium Oudenaarde, and it is expected to employ GaN-on-Si technology.


TV makers expanding low-brightness LED backlit models into entry-level market

Thu, 10 Oct 2012

Responding to consumer demand, TV suppliers are expanding their lineups of low-brightness LED backlight TVs with technology options that actually compete against each other more than traditional CCFL, according to DisplaySearch.


Japan's semiconductor industry: Fabs, equipment, and materials

Wed, 10 Oct 2012

Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy,  the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.


LED industry shifting production to 6-inch wafers

Tue, 10 Oct 2012

Driven by market demand, the semiconductor industry is progressing toward consensus on building-block standards for automating LED production on 6-in wafers, explains Paula Doe in an article for SST sister magazine LEDs Magazine.


imec advances electronics that flex and stretch

Tue, 9 Sep 2012

imec announced that it has integrated an ultra-thin, flexible chip with bendable and stretchable interconnects into a package that adapts dynamically to curving and bending surfaces.


Sumitomo Chemical joins Holst Center for OLED materials research

Wed, 9 Sep 2012

Sumitomo Chemical has joined the Holst Center's shared research program on printed organic lighting and signage, to contribute to research into multilayer solution processes for high-efficiency organic light-emitting diodes (OLEDs).


Report forecasts that LED luminaire business will reach $516M market by 2016

Wed, 6 Jun 2013

Road and street lighting is a key driver for LED technology in general lighting.


Imec and Holst Centre unveil fully-organic imager

Wed, 6 Jun 2013

At this week’s International Image Sensor Workshop, imec and Holst Centre presented a large-area fully-organic photodetector array fabricated on a flexible substrate.


SEMI releases report on first quarter 2013 manufacturing equipment billings

Tue, 6 Jun 2013

SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.31 billion in the first quarter of 2013.


CEA-Leti wins Avantex Innovation Prize for E-Thread technology

Mon, 6 Jun 2013

CEA-Leti announced today that researchers Dominique Vicard and Jean Brun received the Avantex Innovation Prize for the use of the E-Thread technology in textiles.


Leti Innovation Days to present preview of future developments in nanotechnologies

Thu, 6 Jun 2013

CEA-Leti will present recent advances and a preview of future developments in micro- and nanotechnologies, followed by workshops on key technical fields, during Leti Innovation Days, June 25-28, on the MINATEC campus.


US TV shipments decline in Q1 – but prices rise as consumers gravitate to larger screens

Thu, 6 Jun 2013

Shipments of television sets in the United States declined by 11 percent in the first quarter of 2013 compared to one year earlier.


Defense semiconductor and similar applications represent 25% of sapphire industry revenue

Mon, 6 Jun 2013

Crystal growth equipment manufacturer GTAT is leading the charge and recently created a lot of buzz around this application and on the OEM front.


Fab equipment spending: 23% growth for 2014

Tue, 6 Jun 2013

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.


GT Advanced Technologies acquires Thermal Technology LLC

Thu, 5 May 2013

GT Advanced Technologies today announced that it has acquired substantially all of the business of Thermal Technology LLC for purchase consideration.


Critical updates on EUV, 3D transistors and 450mm manufacturing at SEMICON West 2013

Tue, 4 Apr 2013

The critical processes and technologies necessary to continue Moore’s Law are currently more uncertain than ever before in the history of advanced semiconductor manufacturing.


AG Semiconductor appoints new senior director of sales

Tue, 4 Apr 2013

AG Semiconductor Services today announced that Michael (Mike) Mardesich has joined the company in the role of senior director of sales.


Samsung introduces new, high efficacy chip on board LED packages

Mon, 4 Apr 2013

Samsung Electronics Co., Ltd. announced today that it is introducing a new 129lm/W high efficiency, chip-on-board (COB) family of LED packages, LC013/26/40B, which features a compact light emitting surface (LES), designed for use in high performance indoor and outdoor lighting, and ideally suited for spotlight applications.


University of Illinois researchers measure behavior of semiconductor plasmonic microparticles

Mon, 4 Apr 2013

Recent progress in the engineering of plasmonic structures has enabled new kinds of nanometer-scale optoelectronic devices as well as high-resolution optical sensing.


IEDM announces 2013 call for papers

Fri, 5 May 2013

The 59th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking original work in microelectronics research and development. The paper submission deadline is Monday, June 24, 2013.


AIXTRON sees signs of market stabilization in report of 2012 fiscal year

Thu, 3 Mar 2013

Management expects demand for MOCVD production equipment to potentially improve as demand for LEDs increases later in the current year.


EPIC to develop industry database and interactive map

Wed, 3 Mar 2013

The European Photonics Industry Consortium recently embarked on an ambitious project to map all the companies in Europe active in photonics, which amounts to over 3000 companies.


Spectra-Physics introduces industrial picosecond laser

Fri, 5 May 2013

Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision micromachining applications.


First quarter 2013 reports slight decrease in silicon wafer shipments

Thu, 5 May 2013

Worldwide silicon wafer area shipments decreased during the first quarter 2013 when compared to fourth quarter 2012 area shipments, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.


LED ingot market to reach $325M by 2015

Tue, 5 May 2013

The LED industry gained a foothold for growth in the parts and materials industry after LED technology was applied to the TV backlight unit (BLU).


Solid-state lighting expert Bernhard Stapp named to board of Aledia

Wed, 5 May 2013

Aledia today announced that solid-state lighting (SSL) industry veteran Dr. Bernhard Stapp has joined its board of directors.


IDC predicts semiconductor market to experience 3-4% revenue growth in 2013

Wed, 5 May 2013

IDC expects the semiconductor market to return to growth in 2013 with revenues forecast to increase by 3.5 percent this year.


North American semiconductor equipment industry posts April 2013 book-to-bill ratio of 1.08

Wed, 5 May 2013

North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in April 2013 (three-month average basis) and a book-to-bill ratio of 1.08.


EMS debuts low-cost conductive LED die attach adhesive

Mon, 4 Apr 2013

Engineered Material Systems debuted its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.


Hitachi launches brand-new GaN-template product

Fri, 4 Apr 2013

Hitachi Cable, Ltd. announced today that it has developed a new mass-production technology for GaN-templates, in which a high-quality gallium nitride (GaN) single-crystal thin film is grown on a sapphire substrate.


Memory, foundry and LED markets drive fab spending in southeast Asia

Thu, 4 Apr 2013

Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia.


Fourth-quarter reprieve spurs 2013 rebound for semiconductor makers

Wed, 4 Apr 2013

Despite stronger-than-expected growth during the fourth quarter, 2012 was still a miserable year for the semiconductor market and suppliers, with only eight out of the Top 25 chipmakers managing to eke out revenue growth—but nine suffering double-digit declines.


SEMI reports 2012 global semiconductor materials sales of $47.1 billion

Tue, 4 Apr 2013

The global semiconductor materials market decreased 2 percent in 2012 compared to 2011 while worldwide semiconductor revenues declined 3 percent. Revenues of $47.11 mark the first decline in the semiconductor materials market in three years.


Perfectly doped quantum dots yield colors to dye for

Fri, 5 May 2013

Researchers at the University of Illinois at Chicago have developed a way to introduce precisely four copper ions into each and every quantum dot.


University of Cambridge installs AIXTRON MOCVD reactor for GaN-on-Si wafers

Thu, 4 Apr 2013

AIXTRON SE today announced that the University of Cambridge has successfully commissioned another multi-wafer Close Coupled Showerhead (CCS) MOCVD reactor at its new facility at the Department of Material Science and Metallurgy. The CCS 6x2-inch system will be configured to handle single 6-inch (150mm) wafers (1x6-inch).


Flexible OLED lighting developments in East Asia

Tue, 4 Apr 2013

OLED lighting developments are taking place worldwide, with a lot of the research focused on phosphorescent OLED materials, which have a theoretical luminous efficacy four times higher than fluorescent materials.


Thin-layer germanium may replace silicon in semiconductors

Mon, 4 Apr 2013

Chemists at Ohio State University have developed the technology for making a one-atom-thick sheet of germanium, and found that it conducts electrons more than ten times faster than silicon and five times faster than conventional germanium.


SPIE leaders encouraged by increased science funding in Obama budget proposal

Mon, 4 Apr 2013

Proposed increases in funds for scientific R&D and a greater emphasis on STEM education in the 2014 budget proposal announced by the White House this week reflect the President’s commitment to science and engineering, SPIE leaders said.


Net loss for netbooks: Product set for extinction by 2015

Fri, 4 Apr 2013

Once a white-hot PC product that sold in the tens of millions of units annually, netbook computers are now marking their final days, with the rise of tablets causing their shipments to wind down to virtually zero after next year, according to an IHS iSuppli Compute Electronics Market Tracker Report from information and analytics provider IHS.


Key patent analysis on quantum dot displays released

Thu, 2 Feb 2013

The quantum dot recently emerged as a next-generation display material. Quantum dots, whose diameter is just a few nanometers, are semiconductor crystals.


2013: The year of the diamond?

Thu, 1 Jan 2013

Recent advances in diamond applications (diamond-on-silicon, MEMS, optical) suggest that its utilization into a broader scope of commercial products is not far away.


2013: Fab Equipment Spending Shrinks Back to Flat

Wed, 1 Jan 2013

The SEMI Consensus Forecast and the SEMI World Fab Forecast, with data collected from two different methodologies, point to the same conclusion: 0% growth for 2013.


CoorsTek introduces high-performance aluminum nitride substrates

Wed, 2 Feb 2013

CoorsTek, one of the largest technical ceramics manufacturers, today announced introduction of aluminum nitride substrates.


Global forecast and analysis of GaN semiconductor market released

Wed, 2 Feb 2013

Today, Research and Markets released the Gallium Nitride (GaN) Semiconductor Devices (Discretes & ICs) Market, Global Forecast & Analysis: 2012 – 2022.


UPDATED: Worldwide LED component market grows 9% with lighting

Wed, 2 Feb 2013

Strategies Unlimited has issued new figures since the first edition of this article. Solid State Technology now brings you updated figures and additional information on the worldwide LED market.


InfiniLED MicroLEDs achieve ultra-high light intensity

Wed, 2 Feb 2013

InfiniLED’s latest MicroLEDs, or µLEDs, have produced record optical beam intensity


ISSCC 2013: Radio frequency trends

Tue, 2 Feb 2013

Andreia Cathelin, subcommittee chair, reflects on the trends of radio frequency design and usage in her submission to ISSCC.


ISSCC 2013: Energy efficient digital trends

Tue, 2 Feb 2013

Stephen Kosonocky, subcommittee chair of ISSCC, writes on the growing need for technologies to be both energy and cost-efficient.


10 IC product segments to exceed total IC market growth in 2013

Tue, 2 Feb 2013

Tablet and cellphone processors, NAND flash, and telecom-specific ICs to enjoy best growth.


ISSCC 2013: Large-area flexible electronics

Mon, 2 Feb 2013

Hoi-Jun Yoo, subcommittee chair of ISSCC 2013, writes on the focus of technology directions in the field of large-area and low-temperature electronics.


Opinion: MEMS new product development: The first prototype

Mon, 2 Feb 2013

In the second article of the MEMS new product development blog, the importance of the first prototype will be discussed.


Mitsubishi develops SiC ingot slicing technology

Fri, 2 Feb 2013

Mitsubishi Electric Corporation announced this week that is has developed a prototype to improve productivity of SiC slice processing for semiconductor wafers.


LED technology and market challenges addressed in Taiwan

Thu, 2 Feb 2013

To help the Taiwan LED industry tackle the increasing challenges, an in-depth analysis of LED global market opportunities and technology breakthroughs were recently provided at the 2013 LED Market and Outlook seminar held by SEMI Taiwan.


Agilent Technologies commits $90 million gift of software to Georgia Institute of Technology

Tue, 2 Feb 2013

Agilent Technologies Inc. announced yesterday the intent to donate a $90 million in software to Georgia Institute of Technology, the largest in-kind software donation ever in its longstanding relationship with the university.


Patent analysis: Flexible roll-to-roll processing

Tue, 2 Feb 2013

A new report from IHS Displaybank examined a total of 483 patents on roll-to-roll processing technologies, focusing on 32 that were flexible, OLED-related.


FAME center to focus on advanced electronics

Mon, 2 Feb 2013

Five University of California, Riverside professors will receive a total of $5 million as part of a $35 million research center aimed at developing materials and structures.


SEMI announces Silicon Innovation Forum to bridge funding gaps for early-stage companies

Thu, 2 Feb 2013

SEMI, in collaboration with strategic investing groups throughout the global semiconductor industry, has announced the Silicon Innovation Forum, or SIF, to bridge funding gaps for new and early-stage companies with valuable semiconductor manufacturing and technology solutions.


MOCON unveils WVTR instrument for ultra-high barrier films

Thu, 2 Feb 2013

MOCON, Inc., a manufacturer of package integrity instrumentation, is launching a new system to measure the water vapor transmission rate, or WVTR, of ultra-high barrier films with greater sensitivity than ever before possible.


Soraa announces next generation of GaN on GaN LEDs

Thu, 2 Feb 2013

Soraa announced yesterday the next generation of its high external quantum efficiency GaN on GaN LEDs.


ISS 2013: Semiconductor leaders see massive industry transformation

Tue, 1 Jan 2013

The rise in mobile computing, changes to the fabless-foundry model, uncertainties in technical innovation, and global macroeconomic trends are becoming the dominant forces in 2013 and beyond, according to industry leaders speaking at this week's SEMI Industry Strategy Symposium (ISS).


The gleam of well-polished sapphire

Tue, 1 Jan 2013

Is it time for high-brightness LED manufacturing to get serious about process control?  If so, what lessons can be learned from traditional, silicon-based integrated circuit manufacturing?


2013: Healthy revenue growth, but capex likely flat

Fri, 1 Jan 2013

Based on current indications, capital spending would seem to be flat in 2013.  However, Semico predicts healthy revenue growth this year, which may encourage more spending, particularly in the second half of the year.  This may bring total capex for 2013 into the positive range.


New type of LED produced with simple, low cost process

Mon, 1 Jan 2013

Professor Yue Kuo at Texas A&M University has fabricated a new type of LED, based on light emission from an ultra-thin amorphous dielectric layer.     


Global SiC semiconductor devices market to grow at a CAGR of 31.6% during 2012-2016

Tue, 2 Feb 2013

One of the key factors contributing to this market growth is the high demand of SiC in industrial applications. The global SiC semiconductor devices market has also been witnessing rapid technological advancement. However, the fluctuations in demand and supply could pose a challenge to the growth of this market.


Energy-Efficiency Trends

Tue, 12 Dec 2012

Analog Trends

Tue, 12 Dec 2012

RF Trends

Tue, 12 Dec 2012

High-Performance Digital Trends

Tue, 12 Dec 2012

Large-Area Flexible Electronics Trends

Tue, 12 Dec 2012

ISSCC 2013 Slideshow: Highlights

Tue, 2 Feb 2013

ISSCC, the International Solid-State Circuits Conference, is being held on February 17-21, 2013, at the San Francisco Marriott Marquis Hotel. This year, in honor of the conference’s 60th anniversary, we have assembled highlights of the topics and trends that are being discussed.


CRS Electronics appoints Travis Jones as Chief Executive Officer

Tue, 2 Feb 2013

CRS Electronics Inc., a developer and manufacturer of LED lighting, today announced the appointment of Mr. Travis Jones to the position of Chief Executive Officer. Mr. Scott Riesebosch, founder and former CEO will assume the role of Chief Technology Officer.


FOREPI signs multiple order for AIXTRON production system

Tue, 2 Feb 2013

AIXTRON SE today announced that, in the third quarter of 2012, long-term customer Formosa Epitaxy Inc. (FOREPI), Taiwan, placed a new order for multiple CRIUS II-L MOCVD production systems in a 69x2-inch configuration. All systems will be used for the manufacturing of ultra-high brightness (UHB) GaN-based blue and white LEDs.


Lux Research names top firms in LEDS and power electronics

Tue, 2 Feb 2013

As power electronics grow to $15 billion and LEDs to $100 billion, Lux Research identifies the leading technology companies addressing these markets.


Tech spending still strong, despite economic volatility

Mon, 2 Feb 2013

China looks a good bet to be the engine of growth again in 2013, while U.S. will see improving PC market and more software growth.


GT Advanced Technologies to produce low-cost GaN template substrates with Soitec

Mon, 2 Feb 2013

HVPE system expected to lower the cost of LED production and accelerate adoption in commercial and residential lighting.


Scientists develop multicolor LEDs without heavy metals

Mon, 2 Feb 2013

Silicon nanocrystals have a size of a few nanometers and possess a high luminous potential. Scientists of Karlsruhe Institute of Technology (KIT) and the University of Toronto/Canada have now succeeded in manufacturing silicon-based light-emitting diodes (SiLEDs). They are free of heavy metals and can emit light in various colors.


Fab Spending Forecast: Equipment spending is expected to remain flat in 2013

Wed, 3 Mar 2013

Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase.


Cree introduces new LED bulb for under $10

Tue, 3 Mar 2013

Cree, Inc. introduces a game-changing series of LED bulbs, with bulbs starting at a new low price of $9.97 for a 40-watt bulb. The new bulbs shine as brightly as comparable incandescents, while saving 84% of the energy compared to traditional bulbs.


Displaybank releases forecast and analysis of the OLED lighting market

Tue, 3 Mar 2013

Recently, as the importance of environmental protection grows, the method of saving energy of products and using eco-friendly materials is on the rise. Of these, since lighting accounts for about 20% of the overall power consumption, the efforts to replace with high-efficiency and eco-friendly products are being made actively.


ams introduces intelligent flash LED driver

Tue, 3 Mar 2013

LED driver matches flash LED input current with safe output capability of battery – in real time.


World Semiconductor Trade Statistics predicts worldwide semiconductor market to rebound in 2013

Fri, 3 Mar 2013

After experiencing a slowdown in 2012, the global semiconductor market is set for growth. The World Semiconductor Trade Statistics predicts the global semiconductor market to grow by 4.5% in 2013 after declining 3.2 percent in 2012.


Seven opto-sensor-discrete products achieved record sales in 2012

Thu, 3 Mar 2013

O-S-D’s marketshare of total semiconductor sales in 2012 was highest since 1991. Seven O-S-D product categories and device groups reached record-high sales in 2012 compared to 14 new records being set in 2011, according to data shown in the 2013 edition of IC Insights’ O-S-D Report.


Yoon-Woo Lee of Samsung Electronics to give keynote address at The ConFab 2013

Wed, 3 Mar 2013

Solid State Technology is proud to announce that Yoon-Woo Lee will be speaking at The ConFab 2013. The event will be held June 23-26, 2013 at The Encore at The Wynn in Las Vegas. Lee is the Executive Advisor of Samsung Electronics.


Cree announces volume production of second generation SiC MOSFET

Wed, 3 Mar 2013

Cree, Inc. announces the release of its second generation SiC MOSFET, enabling systems to have higher efficiency and smaller size at cost parity with silicon-based solutions. These new 1200V MOSFETs deliver power density and switching efficiency at half the cost per amp of Cree’s previous generation MOSFETs.


LED-based street lighting market forecasted to surpass $2 billion in 2020

Thu, 2 Feb 2013

Dramatically falling costs and improvements in efficiency are driving increased sales of light emitting diode (LED) lamps for street lighting. Costs have fallen as much as 50% over the past two years and are expected to continue falling. By 2015, LEDs will become the second-leading type of lamp for street lights in terms of sales, behind only high pressure sodium lamps, according to a new report from Pike Research, a part of Navigant’s Energy Practice. By 2020, the study concludes, LED lamps for street lights will generate more than $2 billion in annual revenue.


Emerging technologies create strong opportunity for automotive ICs

Wed, 2 Feb 2013

New automotive technologies that go beyond touchscreens, satellite radio, and voice-activated GPS commands are being tested and improved, and will soon begin to appear in many more new car models, resulting in solid growth for the automotive IC market through 2016.


NEWLED aims to revolutionize the way the world is lit

Tue, 2 Feb 2013

The way the world is lit up could be revolutionized by a new European-wide research project being led by the University of Dundee.


Connecting the (quantum) dots

Tue, 2 Feb 2013

New spin technique moves researchers at the University of Pittsburgh and Delft University of Technology closer to creating the first viable high-speed quantum computer.


SPIE volunteers urge Congress to boost jobs, economy through photonics support

Mon, 3 Mar 2013

Volunteers sponsored by SPIE, the international society for optics and photonics, were in Washington, D.C., last week to thank Congressional representatives for recent support for photonics R&D and to urge future support for in several key areas vital to economic growth and scientific progress.


Sidense qualifies 1T-OTP non-volatile memory for MagnaChip 180nm mixed-signal and HV CMOS process

Mon, 3 Mar 2013

MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, and Sidense Corp., a developer of logic non-volatile memory one-time programmable (OTP) memory IP cores today announced that Sidense's SLP 1T-OTP macros have been fully qualified for MagnaChip's 180nm 1.8/3.3/18V high-voltage CMOS and mixed-signal process.


North American semiconductor equipment industry posts February 2013 book-to-bill ratio of 1.10

Fri, 3 Mar 2013

North America-based manufacturers of semiconductor equipment posted $1.07 billion in orders worldwide in February 2013 (three-month average basis) and a book-to-bill ratio of 1.10, according to the February Book-to-Bill Report published today by SEMI.  A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month.


Crystal IS announces record performance from a single chip UVC LED

Thu, 3 Mar 2013

Higher performance UVC LEDs help to realize ever more increasing range of customer applications including scientific instrumentation and water disinfection.


The UV LED market is booming

Mon, 3 Mar 2013

Yole Développement announced today its new report “UV LEDs: Technology & Application Trends” which presents UV LED new applications and associated market metrics for the period 2012-2020, and a deep analysis of UV LED technology and UV LED lighting industry.


Student develops brighter, smarter and more efficient LEDs

Fri, 3 Mar 2013

Rensselaer Polytechnic Institute student Ming Ma has developed a new method to manufacture light-emitting diodes (LEDs) that are brighter, more energy efficient and have superior technical properties than those on the market today.


U.S. Department of Energy honors PPG scientists for advances in OLED lighting

Thu, 3 Mar 2013

PPG Industries has been recognized by the U.S. Department of Energy (DOE) for “significant achievements” in advancing organic light-emitting diode (OLED) lighting technology.


Samsung tops optoelectronics ranking after absorbing LED venture

Thu, 3 Mar 2013

LED makers climb in the overall list of top suppliers of optoelectronics, sensors/actuators, and discretes, says 2013 O-S-D Report.


New packaging system broadens array performance while reducing the cost of LED lighting

Thu, 3 Mar 2013

Bridgelux, a developer and manufacturer of LED lighting technologies and solutions, today unveiled the Vero LED array, a new lighting platform that simplifies design integration and manufacturing and gives designers a more flexible LED lighting solution.


Modern power design challenges to be discussed at APEC 2013

Wed, 3 Mar 2013

ON Semiconductor will demonstrate new digital AC-DC PWM controllers, motor drivers and IGBTs at industry’s premier power electronics show.


SEMICON West 2013 to address industry R&D challenges and opportunities

Tue, 3 Mar 2013

Dynamic changes to R&D processes, tools, technical challenges, and funding/business models will be highlighted at SEMICON West 2013, along with product displays of the latest semiconductor manufacturing technology, components and subsystems.


Plessey is first to release GaN on silicon LEDs

Mon, 4 Apr 2013

Plessey today announced that samples of its Gallium Nitride (GaN) on silicon LED products are today available. These entry level products are the first LEDs manufactured on 6-inch GaN on silicon substrates to be commercially available anywhere in the world.


University of Cambridge researchers seek to further reduce cost and improve efficiency with GaN LEDs

Fri, 4 Apr 2013

A new £1million (or US$1,530,700) growth facility will allow University of Cambridge researchers to further reduce the cost and improve the efficiency of LEDs, with potentially huge cost-saving implications.


How Samsung is climbing the charts

Thu, 4 Apr 2013

It’s no secret that Samsung is up against Apple in many ways, in products, sales and innovation. However, even in the face of Apple’s patent infringement lawsuits, Samsung is still climbing the charts.


Samsung launches Zhaga-compliant LED linear modules with 145lm/W efficacy

Thu, 4 Apr 2013

Samsung Electronics Co Ltd of Seoul, South Korea has introduced a new lineup of Zhaga-compliant LED H-Series linear modules with high efficacy and light quality, as well as color consistency for use in a wide range of LED lighting applications including ambient lighting and linear fixtures.


Oxford Instruments’ newest tool streamlines batch production for HBLED

Mon, 3 Mar 2013

Oxford Instruments Plasma Technology has just announced an evolution in batch etch technology with the launch of the PlasmaPro 1000 Astrea etch system, a large batch etch solution for PSS, GaN and AlGaInP that will offer HBLED production manufacturers high throughput.


Following decline of 2012, global TV market won’t recover until 2015

Mon, 4 Apr 2013

Stung by plunging sales in Japan and declining demand in North America and Western Europe, global television shipments in 2012 fell, marking a major inflection point that will have a lasting impact on the market, according to an IHS iSuppli Worldwide Television Market Tracker Report from the IHS TV Systems Intelligence Service at information and analytics provider IHS.


QLED market forecast reports mass production of commercialized quantum dots is a game-changer

Thu, 3 Mar 2013

Quantum dots will cascade into the marketplace. They offer lower cost, longer life, and brighter lighting, according to WinterGreen Research’s  new study Quantum Dot and Quantum Dot Display (QLED) Market Shares, Strategy, and Forecasts, Worldwide, 2013 to 2019. 


Pixelligent Technologies launches PixClear Zirconia nanocrystals for increased light output in touchscreens

Thu, 3 Mar 2013

Pixelligent Technologies, a manufacturer of nanocrystal additives for the electronics and semiconductor markets, last week announced the launch of its PixClear Zirconia nanocrystals. When incorporated into existing products, the nanoadditives can dramatically increase light output and readability of modern touch screens and displays.


Global LED lighting market will be worth $25.4 billion in 2013

Wed, 3 Mar 2013

The global LED lighting market will be worth $25.4 billion in 2013, representing 54% growth on the 2012 figure of $16.5, while the LED lighting penetration rate will also rise to 18.6%, according to a new DIGITIMES Research Special Report titled "Global high-brightness LED market forecast."


Aledia makes its first LEDS on 8-inch silicon wafers using microwire technology

Wed, 3 Mar 2013

Aledia, a developer of LEDs-based on disruptive microwire GaN-on-Silicon technology, announced today that it has made its first LEDs on 8-inch (200mm) silicon wafers.


University of Central Florida launches new undergrad program in photonics

Tue, 3 Mar 2013

A new undergraduate program approved this week at the University of Central Florida (UCF) will help the U.S. stay competitive in global technology as well as broaden the path for students seeking rewarding careers in the important field of optics and photonics, say leaders of SPIE, the international society for optics and photonics.


Veeco MOCVD chosen for CEA-Leti and Aledia’s new nano-LED venture

Wed, 4 Apr 2013
p>Veeco Instruments Inc. announced today that CEA-Leti, a research lab based in Grenoble, France, has selected Veeco’s TurboDisc K465i Metal Organic Chemical Vapor Deposition (MOCVD) system for its program with Aledia, its nanowire-LED partner.


RAM-memory-research-A-RAM-RERAM-MSDRAM-MELRAM projects

Wed, 10 Oct 2010

CNRS research on memory wafer fabWhile speculation abounds about what will be the next generation of memories and their applications, CNRS, a French government-funded research organization, has 4 new concepts of memories in 2010. The organization is actively recruiting collaborators on RE-RAM, A-RAM, MS-DRAM, and MELRAM memory technologies.


LED-industry-LED-manufacturing-tech-report due out from Yole, EPIC

Wed, 10 Oct 2010

The packaged LED market is experiencing tremendous growth with an expected CAGR of 28.2% between 2009 and 2015. Yole and EPIC will publish their new market & technological studies dedicated to LED market and manufacturing technologies in November.


Intel aims to enter tablet market with Oak Trail processor

Fri, 10 Oct 2010

Seeking to capitalize on the fast growth of the tablet market relative to its core PC business, Intel Corp. has come off the sidelines with a microprocessor designed specifically for iPad-type devices, according to the market research firm iSuppli Corp.


Veeco-VECO-GEN10-MBE-for-epitaxy-research at UNM

Wed, 11 Nov 2010

The Veeco GEN10 design allows researchers to grow complex crystals with better quality control than has been possible in the past.  The system allows independent growth of multiple incompatible materials in a single system architecture.


IEEE, standards orgs in Korea, Japan, and MENA sign MOUs for standards development

Mon, 11 Nov 2010

The IEEE Standards Association signed 4 MOUs with standards organizations in Korea, Japan and the Middle East to share knowledge of each group's standards development activities, facilitate technical cooperation, and seek opportunities for future collaboration.


Chip sales top new record, on path back to seasonality

Tue, 6 Jun 2010

Global semiconductor sales rose to a new record high of $23.6B as the industry continues to march back from a bruising downturn into seasonal patterns again -- and analysts suggest expectations may not be high enough.


CMP for metal-gate integration in advanced CMOS transistors

Mon, 11 Nov 2010
The needs of replacement metal gate HKMG process flows for 45nm node and below CMOS manufacturing are now being met with processes using consumables designed specifically for these steps. Paul Feeney, CMP Fellow, Cabot Microelectronics Corp., Aurora, Illinois, USA

Veeco eyes high-volume HB-LED gains with new GaN MOCVD tool

Tue, 1 Jan 2010

Veeco exec Jim Jenson explains the workings of the company's new MOCVD tool targeting high-volume high-brightness LED manufacturing, a market expected to triple in the next four years to $15B.


iSuppli trims forecast on soft demand, inventories

Tue, 10 Oct 2010

Just two months after beefing up its semiconductor sales forecast because of the sector's "roid rage," iSuppli has put those numbers on a cooldown rep, citing concern over end-user demand vs. inventories.


IBM, Macronix identify phase-change memory failure mode: IEDM Preview

Fri, 11 Nov 2010

At the upcoming International Electron Devices Meeting (IEDM), researchers from IBM and Macronix will report on their findings of electromigration-induced failures when phase-change memory (PCM) cells are reverse-stressed.


EUV players hit 100W output with LPP source

Tue, 4 Apr 2010

The Extreme Ultraviolet Lithography System Development Association (EUVA) says it has surpassed 100W output at intermediate focus for an EUV light source, another big step to address a big hurdle facing EUV lithography as a production-viable candidate for next-generation semiconductor manufacturing.


LEDs-ramp-MOCVD-reaps-benefit-Gartner-forecast

Fri, 11 Nov 2010

MOCVD equipment and the LED market: Gartner forecast through 2020According to Dean Freeman, research VP at Gartner, the LED market will see ~11% growth in 2010, and ~35% growth in 2011. Reaping the benefits of the accelerating interest in LEDs is the MOCVD equipment market.


Soitec and Sumitomo Electric collaborate on engineered GaN substrates

Thu, 12 Dec 2010

Soitec and Sumitomo Electric Industries are working together to develop engineered gallium nitride (GaN) substrates. The alliance will draw on Sumitomo Electric’s GaN wafer manufacturing technology and Soitec’s Smart Cut layer transfer technology.


SAFC Hitech expands HB-LED operations in Taiwan

Thu, 12 Dec 2010

SAFC Hitech announced plans to build a new, dedicated facility in Kaohsiung, Taiwan for transfilling, technical service and production of chemical precursors used for high brightness LED and silicon semiconductor manufacturing.


Production metrology of advanced LED structures using high-resolution X-ray diffraction

Thu, 7 Jul 2010

The latest advances in HRXRD technology to allow true in-line monitoring, are described. Paul Ryan, et al, Jordan Valley Semiconductors UK Ltd.


TSMC begins "phase 1" for LED aspirations

Fri, 3 Mar 2010

TSMC has officially broken ground for its new LED lighting R&D center and fab in Taiwan's Hsinchu Science Park, part of its multibillion-dollar initiative to establish a foothold in higher-growth markets outside of core IC fabrication.


LED boom based on lighting expected to lead to "third cycle" in the market

Fri, 3 Mar 2010

The light-emitting diode (LED) market has gone through two cycles of major growth, but an even bigger "third cycle" based on super-efficient lighting looms ahead, reports SST's Bob Haavind from a recent SEMI breakfast at Teradyne near Boston on March 10. And the wide range of problems to be tackled will make it an attractive target for those now in the semiconductor processing markets.


Analysis: Why Intel+TSMC "Atom" pact was "a bad idea"

Mon, 3 Mar 2010

A year after calling a new deal with TSMC to make some of its Atom processors "an important step in a long-term strategic technology cooperation", that partnership apparently has floundered -- and it's a good example of the complex battles the top chipmaker is trying to fight, according to one analyst.


IDC: 2010 chip sales familiar, demand is the key

Tue, 7 Jul 2010

If the industry's rapid recovery this year seems familiar, it's because we saw it six years ago, says IDC, which projects a ~22% bounceback in 2010 -- if demand holds up its end of the bargain.


SIA: Another month, another chip sales record

Tue, 7 Jul 2010

Anyone getting tired of hearing this? Global chip sales continue to climb for another month to yet another record high, and are on pace for a stellar ~30% annual growth rate, according to the latest data from the Semiconductor Industry Association (SIA).


CHAD adapts wafer handlers to LED sapphire wafer sizes

Wed, 8 Aug 2010

CHAD Industries developed wafer-handling capabilities for Sapphire wafers used in the LED market.


AMD names Newell tech chief in server business

Mon, 8 Aug 2010

AMD (NYSE: AMD) appointed Donald Newell as VP and CTO, Server. A distinguished engineer with more than 20 patents filed, Newell previously served as a senior principle engineer leading the System-on-Chip (SoC) and datacenter networking architecture groups within Intel Labs before joining AMD to lead its server roadmap and platform design programs.


SEMI reorgs, splits into three-way focus groups

Mon, 8 Aug 2010

SEMI has reorged into three groups to align its focus areas into IC manufacturing, solar photovoltaic (PV), and related/tangential markets including MEMS and LEDs.


150+ fab projects lead to strong 2010, 2011

Tue, 9 Sep 2010

The World Fab Forecast released at the end of August indicates a 133% increase in equipment spending for front-end fabs this year and about 18% growth in 2011. The data reveals that for both 2010 and 2011, over 150 fab projects will contribute an estimated $83 billion in spending.


How-fabless-companies-drive-tech

Wed, 12 Dec 2010

Since the fabless model established itself more than a decade ago, it has assumed higher and higher bars of excellence annually. Jodi Shelton, Global Semiconductor Alliance (GSA), has witnessed fabless companies emerge, grow and prosper -- many of them becoming the best-of-breed in their end market sector. This article summarizes the accomplishments of the fabless model.


Samsung-LCD-LG-Display-battleover-LEDs-Oversupply-imminent

Wed, 12 Dec 2010

IMS Research’s latest Quarterly GaN LED Supply and Demand Report features a new LED supply and demand model that shows LED supply growth is significantly outpacing demand growth. The research report also shows Samsung leading LG in Q3 and Q4, though LG is expected to consume more LEDs in all of 2010.


The ConFab welcomes new Advisory Board members, SEMI as sponsor

Tue, 12 Dec 2010

The ConFab, an invitation-only global conference and networking event for semiconductor industry executives, announces the appointment of five new advisory board members for 2011. The ConFab also welcomes the industry association SEMI, which has agreed for the first time to sponsor The ConFab in 2011.


CAMP CMP, Day 3: CMP fangs, dual-purpose slurry injector, "true CMP" HB-LED wafer polishing; karaoke time!

Mon, 8 Aug 2010

Techcet's Michael A. Fury continues his observations from this year's International Symposium on CMP at Clarkson U. in New York. Highlights from Day 3: Horrifying CMP "fangs," dissolved gases in megasonics, a dual-purpose slurry injector, the usefulness of CMP levelers, CVD Co as a Cu barrier, HB-LED sapphire wafer polishing, and a CMP Broadway moment.


CAMP CMP, Day 2: Porosity on demand, CMP whack-a-mole, end-of-line acronym soup

Fri, 8 Aug 2010

Techcet's Michael A. Fury offers his observations from this year's International Symposium on CMP at Clarkson U. in New York. Highlights from Day 2: Creating "porosity on demand;" a CMP Rubik's Cube vs. Whack-A-Mole; the evolution of CMP process control; and a missing manufacturing acronym.


Euro consortium targets telecom energy reductions via semiconductor material efficiencies

Mon, 8 Aug 2010

The BIANCHO project (BIsmide And Nitride Components for High temperature Operation) will develop new semiconductor materials to allow lasers and other photonic components to become more energy efficient and also more tolerant of high operating temperatures.


The rule of three for CMP

Sun, 8 Aug 2010
Michael A. Fury, Techcet Group, LLC, Del Mar, CA

Foundry-orders-Nanometrics-TSV-metrology-system

Fri, 12 Dec 2010

Nanometrics Incorporated (Nasdaq: NANO) announced that a leading semiconductor foundry has ordered a UniFire 7900 metrology system for advanced 3D wafer-scale packaging process control.


Global Semiconductor Alliance announces award winners

Mon, 12 Dec 2010

The Global Semiconductor Alliance presented awards to top private and public companies at its annual ceremony, as well as honoring Dr. John Hennessy, president of Stanford Univeristy, with the Dr. Morris Chang Exemplary Leadership Award.


Top-LEDs-technologies-suppliers-markets

Fri, 12 Dec 2010

LEDsThe top makers of LEDs; how LED fab is changing, in technological scope and geographical size; and the driving applications for LED adoption are covered in two recent reports. IMS Research covers primarily LED suppliers and markets, while EPIC and Yole look mainly at the markets and fab equipment.


OLEDs see manufacturing tech, consumer response ripen

Tue, 8 Aug 2010

OLED versus LCD demand. Courtesy of DisplaySearchIn a podcast interview, Paul Semenza, SVP of Analyst Services at DisplaySearch, explains how a maturing OLED manufacturing capability is contributing to the surge in interest, as is consumer response to products that use OLEDs. One challenge, however, is scaling up vapor deposition, and solutions are being developed. 


Researchers: SiOx just fine for sub-10nm memory switch

Fri, 9 Sep 2010

Researchers at Rice U. say they've figured out that new switching memory they built with electrically manipulated 10nm graphite strips doesn't actually need the graphite -- good ol' reliable silicon oxide will do just fine.


NCCAVS CMPUG: Trends and technologies for CMP in hard-disk drives

Fri, 9 Sep 2010

Techcet's Michael A. Fury reports from SEMI's NCCAVS CMP Users Group meeting in San Jose, CA. Highlights included a market growth overview, and talks ranging from market growth to consumables challenges to new technologies for chromatography, noncontact probe, 3D topography, polishing, and HDD substrate slurry.


GEO Semiconductor closes $2 million in venture debt and equity financing

Wed, 9 Sep 2010

GEO Semiconductor Inc., provider of high-performance, programmable video and geometry pixel processor ICs for LED-backlit LCD displays and smartphone cameras (optics through sensor), raised $2 million in additional funding comprised of venture debt and equity.


New CEO takes the reins at OSRAM Opto Semiconductors

Mon, 9 Sep 2010

Sunnyvale, CA--As of October 1, 2010, Aldo Kamper is succeeding retiring CEO Rüdiger Müller at OSRAM Opto Semiconductors.


LED, WLP, SiGe metrology challenges of today

Thu, 8 Aug 2011

LEDs, SiGe semiconductors, and WLP bumps each present their own challenges to metrology systems, says Alon Kapel, Jordan Valley Semiconductor.


Sapphire Materials Company readies sapphire fab

Fri, 7 Jul 2011

Sapphire Materials Company (SMC), a subsidiary of Silicon Chemical Corporation (SCC), completed Phase I of its sapphire manufacturing business. Initial shipments of sapphire product will begin this November.


Translucent demos LED growth via one-step epitaxy with rare earth oxides on Si

Mon, 7 Jul 2011

Translucent demonstrated its Mirrored Si technology on a 100mm-diameter wafer that exhibits high reflectivity using a lattice-matched REO material grown on a Si substrate, capped by a GaN layer that can support further nitride epitaxy for LED structure growth.


SEMICON West, Day 3: Advancement in LED, exec perspectives, solar observations

Sat, 7 Jul 2011

Rounding up observations from Day 3 at SEMICON West, Intermolecular's Russell Kempt looks at LED technology, executive opinions on big-picture industry issues, and the state of play in the solar market.


SEMICON West: Roaming the floor, LEDs, CMP pads, kudos to Napoleon

Thu, 7 Jul 2011

Exotic pads for CMPs, flow meters with a nod to Napoleon, and driving down LED costs were among themes pursued by Techcet's Michael A. Fury on a walk through the SEMICON West show floor.


Imec ITF: Reduce LEDs costs 10x, says Philips Lumileds

Tue, 5 May 2011

In an exclusive series of blogs, imec reports from its International Technology Forum (ITF) last week in Brussels. Els Parton, science editor, imec, shares Jy Bhardwaj's (Philips Lumileds) points about LEDs costs improvements.


VECO sells MOCVD to Tsinghua Tongfang for China HB-LED fab

Mon, 6 Jun 2011

Tsinghua Tongfang Company ordered Veeco's new TurboDisc MaxBright multi-reactor MOCVD system for HB-LED production.


Centralized automation control increases performance and reduces costs

Wed, 6 Jun 2011
The capabilities of advanced motion controllers enable OEMs to achieve high-performance requirements. Cameron Sheikholeslami, ACS Motion Control, Eden Prairie, MN

Semicon West, Day 0: Market forecasts, supply-chain dynamics

Tue, 7 Jul 2011

On the eve of SEMICON West's official opening, Mike Fury reports on a full day of presentations offered a review of trends and new outlooks for fab capacity, equipment and materials spending, foundries, and packaging technologies.


Novel organic semiconductors from SmartKem best amorphous silicon

Tue, 7 Jul 2011

SmartKem Limited tested its advanced semiconductor materials against amorphous silicon at the National Printable Electronics Technology Centre, where it achieved better thin-film transistor (TFT) mobility rating.


Semiconductor gases bounce back, wet chemicals on their way

Thu, 6 Jun 2011

Semiconductor wet chemicals saw 13% growth year-over-year in 2010, while the electronics fab gasses market grew 16%, according to 2 new reports from Techcet Group.


Semiconductor inventory surplus mitigates fab losses in Japan disaster, for now

Thu, 6 Jun 2011

Average days of inventory for semiconductor suppliers. SOURCE: IHS iSuppli, May 2011.Sharon Stiefel, IHS iSuppli, reports that a cushion in the semiconductor supply chain helped balance out off-line fabs in Japan following the Sendai-area earthquake and tsunami. As fabs ramp back up, or products are transferred to lines in other facilities, Q2 should avoid component shortages as well. But will the disaster be the end of just-in-time inventory management?


GaN-on-Si HB-LED demo from Lattice Power, ShineOn

Fri, 6 Jun 2011

Lattice Power Corporation and ShineOn Inc. jointly demonstrated a high-brightness LED (HB-LED) product based on GaN-on-Si technology.


Supercomputing simulations promise better silicon understanding

Fri, 6 Jun 2011

Chinese researchers used a supercomputer to run high-performance molecular simulation, looking to improve production and use of crystalline silicon (c-Si) for photovoltaics and semiconductors.


OPV, OLEDs headline at LOPE-C 2011

Fri, 6 Jun 2011

The Large Area, Organic and Printed Electronics Convention (LOPE-C) conference and exhibition, June 28-30 in Frankfurt, Germany, will focus largely on organic photovoltaics (OPV) and organic light emitting diodes (OLEDs).


Alternative semiconductor fabrication methods enable inexpensive, conformable consumer devices

Wed, 6 Jun 2011

SEMICON West preview: Emerging technology and a developing infrastructure for printed electronics is enabling circuitry that is flexible, conformable, and inexpensive to mass-produce, paving the way to a variety of low-cost applications such as electronic packaging, ID tags, and wide-area lighting panels.


Fab spending up, but fewer fabs being built

Wed, 6 Jun 2011

The semiconductor industry's torrid pace of capital equipment expenditures will continue in 2011, but actual construction of new fabs is slowing to "historically low" levels, according to data from SEMI.


Market update: Growth still good, avoiding excess

Wed, 5 May 2011

 

In his second-day keynote at the Confab, IC Insights' Bill McClean offered an updated look at why semiconductor and supporting markets should follow up 2010's record success with another good year all around.


LED makers shifting focus from efficacy to manufacturing efficiency for mass-market leap

Wed, 6 Jun 2011

SEMICON West preview: With device efficacy approaching limits and end-costs still too high for mass-market adoption, LED manufacturers are looking to trim costs by improving key manufacturing steps: measuring process conditions, preparing and handling substrates, and wafer-level testing.


LED adoption pushes driver IC changes and growth

Tue, 6 Jun 2011

As LED adoption continues to grow, LED driver ICs face pressure from increased IC integration, driver-less AC-LEDs and other technologies, and falling prices. However, the driver IC unit can bring performance and power enhancements that consumers want for LED lighting adoption.


Talkin' ecosystems, supply chain issues at IHS Summit

Mon, 6 Jun 2011

About a hundred people gathered at the San Jose Marriott on June 22 for the first IHS Global Design & Supply Chain Summit, where a series of speakers presented on everything from spending on consumer gadgets to telecom systems to fabs, lessons learned from the Japan disaster, and why the Pentagon is a poster child for counterfeit parts.


GLOBALFOUNDRIES' new leadership

Fri, 6 Jun 2011

The board of directors of GLOBALFOUNDRIES appointed new leadership to run GlobalFoundries, the company's first CEO change since its inception.


Historic semiconductor industry, SEMI moments from Stanley Myers

Wed, 7 Jul 2011

Stanley T. Myers talks what moments stand out for him as "historic" advances in semiconductor fab and the evolution of SEMI. He also shares advice for young engineers entering the semiconductor industry.


Will OLED lighting ever see the light of day?

Wed, 7 Jul 2011

Organic light emitting diode (OLED) lighting can be manufactured into aesthetically pleasing, unique products. However, the immature technology is costly today, and even with a price decline of more than an order of magnitude over the next 10 years, OLED lights will remain uncompetitive with other lighting options, Lux Research finds.


Green wafer fab chemistries that work

Wed, 7 Jul 2011

ATMI's SVP/CTO, Larry Dubois shares the 3 guidelines ATMI keeps in mind when designing eco materials for semiconductor wafer fab, and gives an update on the materials supplier's LED fab products.


LED cooling tech attracts investors to Nuventix

Tue, 7 Jul 2011

Nuventix, LED cooling technology developer, received capital from GE (NYSE:GE) and other investors. GE will also license Nuventix's patent portfolio.


Organic Electronics Workshop, Day 3: OLEDs, OTFTs, OPV, and futile resistance

Thu, 7 Jul 2011

Wrapping up the Organic Microelectronics & Optoelectronics Workshop, Michael A. Fury reports on vertical structures for OLEDs, solution processing for OLEDs and organic TFTs, small-molecule organic semiconductors, and characterizing mobility and recombination in organic PV devices.


Present at Strategies in Light 2012

Thu, 7 Jul 2011

Strategies in Light 2012 will take place in February in Santa Clara, CA. The Strategies in Light Advisory Board seeks abstracts for the conference, which is themed "The Booming LED Market."


First Semiconductor Fab for Central and South America Gains Design Approval

Thu, 7 Jul 2011

A four-month fab design verification project was approved for CEITEC S.A., for what is said to be the first semi conductor manufacturing facility to be built in Central and South America. CEITEC S.A. is a Brazilian company that produces application-specific standard products (ASSPs) for RFID, wireless communication and digital multimedia. The design verification project was overseen by Lotus Technical Services, one of five operational divisions of the LotusWorks based in Sligo, Ireland.



Sokudo litho breakfast: Challenges for the 2Xnm node

Wed, 7 Jul 2011

CEA-Leti's Serge Tedesco and Didier Louis summarize key themes from the Sokudo lithography breakfast forum held last week at SEMICON West.


Organic Electronics Workshop: TFTs, FETs, and a seeing microphone

Wed, 7 Jul 2011

Techcet's Michael A. Fury reports from the Organic Microelectronics & Optoelectronics Workshop in San Francisco, where talks delved into flexible displays, organic molecular tunnel junctions, thin-film microprocessors, and a microphone that can "see" sound.


Semi, PV, LED, FPD: Each sector has special reqs

Tue, 7 Jul 2011

Each market in which Edwards is a supplier -- semiconductors, flat panel, photovoltaics, LEDs, has its own cycles and technology requirements. Matthew Taylor, CEO of Edwards, discusses the needs and market personality of each sector.


IEST cleanroom apparel doc update includes measurement guide

Thu, 12 Dec 2011

The updated "Garment System Considerations for Cleanrooms and Other Controlled Environments" document includes new sections on measuring footwear, frocks and other garments, as well as a new subsection for tracking system use, such as RFID chips and barcodes.


LED fab trends: Capex decline, cost-effective fab key

Wed, 12 Dec 2011

Maxim Group, in its equity research on LED sector companies, finds that competition and demand strategies will push LED prices lower in the near future, and the capital expenditures surge of 2010-2011 is giving way to a tool spending downturn.


Cree licenses remote phosphor patents to LED lighting makers

Thu, 12 Dec 2011

Cree Inc. (Nasdaq:CREE) granted 5 LED lighting manufacturers licenses to select Cree patents through its remote phosphor licensing program. Cree's licensing program facilitates the development of LED lights combining remote phosphor optical elements with blue LEDs.


Present at Strategies in Light Europe 2012

Mon, 12 Dec 2011

Strategies in Light Europe 2012, September 18-20 in Munich, Germany, is accepting abstracts through February 17. Strategies in Light Europe covers the rapidly growing LED lighting industry.


LED PSS etch station speeds throughput with higher temps

Wed, 11 Nov 2011

MicroTech has developed a wet process station to etch patterned sapphire substrate (PSS) wafers in a way that increases LEDs' light output and efficiency while increasing manufacturing throughput.


Diamond films no longer in the rough with AKHAN Technologies launch

Mon, 11 Nov 2011

AKHAN Technologies has developed a shallow n-type diamond material over silicon that has characteristics such as a shallow ionization energy, high carrier mobility, and no graphitic phases. Adam Khan, president of AKHAN Technologies, says that the bottleneck in development of diamond films has always been the fabrication of n-type diamond.


Novaled wins Deutscher Zukunftspreis for OLEDs

Fri, 12 Dec 2011

Organic light-emitting diode (OLED) company Novaled AG founders Professor Karl Leo, Dr. Jan Blochwitz-Nimoth, and Dr. Martin Pheiffer received the Deutscher Zukunftspreis from German Federal President Christian Wulff.


LED inspection unit launches Altatech Semiconductor's LEDs line

Wed, 12 Dec 2011

Altatech Semiconductor S.A. launched its first LED inspection system, the non-contact AltaSight LEDMax, for detecting, classifying and characterizing defects on wafers used in manufacturing LEDs.


SEMICON West 2012: Submit an abstract today

Mon, 12 Dec 2011

SEMI is looking for presenters for technical sessions and other opportunities at SEMICON West 2012, July 10-12 in San Francisco, CA.


First LEDs fabricated on amorphous glass substrates

Wed, 12 Dec 2011

Researchers at the Samsung Advanced Institute of Technology and Seoul National University have demonstrated the first LEDs to be fabricated on amorphous glass substrates.


Frontend process, materials firms get high marks from TSMC

Wed, 12 Dec 2011

A number of big-name frontend equipment firms highlight TSMC's annual supplier awards in 2011, as the foundry expands its list of top suppliers.


LEDs-and-optoelectronic-semiconductors-grew-in-2010

Tue, 1 Jan 2011

Strategy Analytics asserts that the optoelectronics segment of the compound semiconductor industry continued to grow into the close of 2010, driven by broader adoption of LEDs for general and automotive lighting applications, as well as increased performance demand by the optical transport market.


ISS 2011: Cleantech, LEDs, capital efficiency, setting 2011 expectations

Wed, 1 Jan 2011

Techcet's Michael A. Fury reports from the second day of presentations at ISS 2011: talks on cleantech and energy management, LEDs, capital efficiency, and creating value through semiconductor "differentiation."


AMD-CEO-Dirk-Meyer-resigns

Tue, 1 Jan 2011

AMD (NYSE: AMD) announced that its Board of Directors has appointed SVP and CFO Thomas Seifert as interim CEO following the resignation of Dirk Meyer as president, CEO, and a director of the company, effective immediately.


SEMI-India-names-Choudhury-president

Thu, 1 Jan 2011

SEMI appointed Debasish Paul Choudhury to the position of president of SEMI India, effective January 15, 2011. Choudhury will succeed Sathya Prasad, who is leaving SEMI but will continue to participate as a member of the SEMI India PV Advisory Committee through the management transition.


Big chip firms get bigger, quicker in 1Q11

Mon, 5 May 2011

The top 20 semiconductor firms paced at 11% growth in 1Q11, raking in $54.8B in sales, led by the usual suspects, according to rankings from IC Insights.


KLAC: Yields are key to low costs, in traditional chips and emerging LEDs

Tue, 5 May 2011

High performance and low power consumption are expected of today's chips and LEDs. Today's chip makers still expect to keep their costs down. The key to making this work, says Brian Trafas, KLAC, is yield optimization. Trafas, speaking at The ConFab 2011 in Las Vegas, touches on tool supplier/user collaborations as well.


Synaptics accelerating Cambrios ClearOhm conductive film use in capacitive touch sensors

Fri, 4 Apr 2011

Synaptics will develop reference designs incorporating Cambrios ClearOhm material as a transparent electrode in projected capacitive touch sensors, enabling a wide variety of clear, multi-touch solutions for electronic devices.


Large OLEDs top lists in China

Thu, 4 Apr 2011

Small-sized OLEDs are mature, now that rapid adoption has occured in the mobile phone sector. With technical advances and mass production processes, larger-sized OLEDs will come to the fore, according to CCID Consulting. Advancements are needed in the areas of process equipment and driver IC technology for China to become an OLED leader. CCID and NanoMarkets summarize their OLED market assessments for China, Japan, and Korea.


Tessera focuses on semiconductor technologies beyond packaging

Thu, 4 Apr 2011

Tessera Technologies Inc. (Nasdaq:TSRA - News) began two corporate initiatives to expand its technologies in semiconductor microelectronics beyond packaging, and to potentially separate its Imaging & Optics business.


Ultratech plans HB-LED dev center in Taiwan

Thu, 5 May 2011

Ultratech, Inc. (Nasdaq: UTEK) announced an Asia Technology Center (ATC) in Taiwan to develop processes for HB-LED manufacture on its Sapphire 100 lithography system.


Nanometrics-launches-overlay-metrology-system-wins-Asia-order

Tue, 3 Mar 2011

Nanometrics Incorporated (Nasdaq:NANO), advanced process control metrology provider, launched the Mosaic II turnkey image-based overlay metrology solution for advanced high-volume IC manufacturing. NANO reports an initial delivery to a leading Asian memory customer.


Spincasting-nanoparticles-into-thin-films

Thu, 3 Mar 2011

Spincasting creates thin films of nanoparticles on an underlying substrate. SOURCE: North Carolina State UniversityResearchers from North Carolina State University have investigated the viability of a technique called spincasting for creating thin films of nanoparticles on an underlying substrate, creating materials with a variety of uses, from optics to electronics.


austriamicrosystems-sends-high-voltage-0.18micron-CMOS-process-to-volume-production-at-IBM

Wed, 3 Mar 2011

austriamicrosystems (SIX:AMS) conditionally released its advanced 0.18µm High-Voltage CMOS process technology "H18" to for volume production. It will be manufactured in IBM's 200mm Burlington wafer facility.


Manufacture-HB-LEDs-with-holistic-defect-analysis

Wed, 3 Mar 2011

Advanced defect source analysis (DSA). KLARITY LED provides defect source analysis including interactive wafer maps and images.Defect source analysis (DSA) and spatial signature analysis (SSA) go beyond process control to determine where in the process defects are introduced, which defects are common from one process step to the next, how defects propagate throughout the production line, and defect signatures and causes. John Robinson, KLA-Tencor, offers examples of defects and how these can be missed or mis-identified, wasting wafers and time.


AMAT buying VSEA, extends WFE, solar inroads

Mon, 8 Aug 2011

Applied Materials said it will acquire Varian Semi in a $4.9B deal. VSEA stockholders have now approved the buy.


LED fab investment elevates equipment spending

Wed, 4 Apr 2011

LED fab growth was explosive in 2010, and it's not done yet: SEMI predicts a 40% increase in LED equipment spending for 2011. Nearly 30 LED fabs will come on-line this year. China is leading the pack, and nearing a majority share in LED equipment spending.


Crossing Automation wins 300mm Spartan sorter orders

Tue, 4 Apr 2011

Crossing Automation received both new and follow-on orders for multiple 300mm Spartan Sorters. The orders were received from a single foundry customer and the systems will be installed in two of its leading-edge semiconductor manufacturing facilities for use in volume production.


SEMI's Stan Myers will retire in 2011

Thu, 4 Apr 2011

President and CEO Stanley T. Myers has informed the SEMI International Board of Directors of his intention to step back from executive leadership of SEMI this year. An executive search team will immediately begin looking for his successor.


Asian FPD maker orders Cymer TCZ Gen5.5 crystallization systems

Tue, 4 Apr 2011

TCZ, Cymer Inc. (Nasdaq: CYMI) display equipment product division, received a volume order for the TCZ-1500B Gen 5.5 crystallization system from a leading Asian flat panel display manufacturer. This is TCZ's second volume order in 2011 and fourth tool customer.


"Green" ITO replacement suits flex displays, EMI shielding

Fri, 4 Apr 2011

4-point conductivity measurement of the new transparent conducting film developed by Prof. Cor Koning (left) and prof. Paul van der Schoot (right). The black pot contains a dispersion of carbon nanotubes in water, and the white pot contains the conducting latex. Photo: Bart van Overbeeke.Researchers at Eindhoven University of Technology have developed a replacement for indium tin oxide (ITO). This transparent, conducting film is produced in water, and based on electrically conducting carbon nanotubes (CNT) and plastic nanoparticles. The film currently provides a factor 100 lower conductivity than ITO, but this could rapidly change.


MRAM improvement from graphene's magnetic vacancies

Fri, 4 Apr 2011

Image. Schematic of a graphene transistor showing graphene (red), gold electrodes (yellow), silicon dioxide (clear) and silicon substrate (black). Inset shows the graphene lattice with vacancy defects. Vacancies (missing atoms) are shown surrounded by blue carbon atoms. Graphic by Jianhao Chen and Michael S. Fuhrer, University of Maryland. University of Maryland researchers found the Kondo effect in graphene without magnetic additives. With "defect engineering" of graphene, nanoscale magnetic sensors, magnetic storage, and magnetic random access memory applications could be possible.


The ConFab 2011 Keynotes to Address Disaster in Japan

Tue, 4 Apr 2011

Two keynote talks at The ConFab 2011 will address the impact of the ongoing disaster in Japan, including the state of Japan’s semiconductor manufacturing operations and the impact of lost production on the supply chain. Keenan Evans, the Senior Vice President for Quality, Reliability & EHS for ON Semiconductor, will give the keynote on the first day of the conference, May 16th. Bill McClean, President of IC Insights, will give the keynote on the second day, May 17th.


Graphene transistors cool off at the nano level

Tue, 4 Apr 2011

Image: An atomic force microscope tip scans the surface of a graphene-metal contact to measure temperature with spatial resolution of about 10nm and temperature resolution of about 250 mK.  Color represents temperature data. Alex Jerez, Beckman Institute Imaging Technology Group.University of Illinois researchers found that graphene transistors have a nanoscale thermoelectric cooling effect that can be stronger at graphene contacts than resistive heating, lowering the temperature of the transistor.


Non-volatile-memory-technology-trending-up

Fri, 4 Apr 2011

Figure. Market share for emerging advanced solid state non-volatile random access memory products by region, 2010 and 2015. ($ Millions) Source: iRAP, Inc. April 2011.Advanced solid state non-volatile memory (NVM) chips, which retain data when the power is off, are expected to see phenomenal growth in the next five years, says iRAP Inc. In 2010, the potential market for zero capacitor (ZRAM) was highest, but by 2015, it will be phase change memory (PCM, PC-RAM, PRAM, OUM) at the lead.


LCD-OLED-manufacturing-equipment-on-a-growth-tear

Fri, 4 Apr 2011

With escalating demand for larger fabs of Gen 8, Gen 8.5 and Gen 10, the liquid crystal display (LCD) and organic light emitting diode (OLED) manufacturing equipment market has witnessed a growth spur, which could last 7 years, says Frost & Sullivan.


OLED materials progress at Universal Display advances print/deposition fab method

Tue, 4 Apr 2011

Universal Display Corporation (NASDAQ: PANL) announced advances in the performance of its UniversalP2OLED solution-processible, phosphorescent OLED material systems for use with solution-based manufacturing processes (such as ink-jet printing).


MRS Spring 2011: Lighting the paths for LED materials

Tue, 4 Apr 2011

Michael A. Fury looks at papers from the opening day of this year's MRS Spring meeting, including various takes on light-emitting devices, nanotubes for optoelectronic devices, and switching behavior of ultrathin films.


LED volume ramps motivate GT Solar's new sapphire growth system with larger boule growth

Tue, 5 May 2011

GT Solar International Inc. (NASDAQ:SOLR) introduced the ASF100 advanced sapphire growth system, which produces larger 100kg sapphire boules in the standard furnace chamber. Larger sapphire boules can enable lower costs for LED chips.


LEDs are fundamentally semiconductors, running up against fab and packaging issues, says Philips Lumileds

Thu, 5 May 2011

LED manufacturing processes lack the level of automation seen in the semi chip fab industry. Wafer size transitions are occuring rapidly, and thicknesses also vary. The forefront of LED fab, much like chip fab, is wafer level packaging, cluster tools for automation, and advanced substrate materials. Iain Black, Philips Lumileds, presents an overview of LED fabrication, device architectures, and markets for the end products.


SEMI says innovation is in, expensive differentiation is out

Mon, 5 May 2011

Tom Morrow, EVP, Emerging Markets Group/Chief Marketing Officer, speaks at ConFab 2011 about the semiconductor market's rebound from March 11's Japan earthquake, emerging markets like LEDs, and the trade organization's standards program for 3D ICs.


Nanowire-based charge-trapping memory optimized by NIST, GMU

Mon, 5 May 2011

TEM of a Si nanowire is shown surrounded by a stack of thin dielectric layers. SOURCE: NISTThe National Institute of Standards and Technology (NIST) George Mason University (GMU) researchers are studying the optimal characteristics of silicon nanowires and dielectric stacks for charge-trapping memory.


Backside wafer particle reduction using ionization in PVD

Thu, 1 Jan 2011

Ionizers used in PVD wafer processingIonizers can improve wafer back- and frontside particle performance in PVD processing tools by removing surface charges that hold electrostatically adhered particles. Controlling charges results in higher yields for chip manufacturers and improved tool performance. Viraj Pandit and Emery Kuo, Novellus Systems and Cheryl Avery, ION Systems show that the INOVA PVD system’s good particle performance (with good quality wafers) is made more robust with an ionizer installation (with marginal quality wafers).


Semiconductor fab to make InGan solar cells for BluGlass

Fri, 1 Jan 2011

BluGlass (ASX:BLG) has commissioned the foundry services of  Rainbow Optoelectronics Materials Shanghai to provide device fabrication and processing services for the purposes of creating a nitride solar cell prototype designed by BluGlass.


KLA-Tencor debuts LED substrate epi-wafer inspection system

Mon, 1 Jan 2011

KLAC inspection system debuts for HBLED substratesKLA-Tencor (KLAC) debuted an automated inspection system for substrates and epitaxial wafers used in HBLED manufacturing. The Candela 8620 provides automated defect inspection for LED materials such as gallium nitride, sapphire, and silicon carbide, enabling enhanced quality control of both opaque and transparent substrates, faster time-to-root cause, and improved MOCVD reactor uptime and yield. Frank Burkeen, KLA-Tencor, discusses the Candela 8620 inspection system.


Semi LED fab capacity: Cause for concern, says Dieseldorff, SEMI

Fri, 1 Jan 2011

Semiconductor/LED fab capacity analysis 2011Speaking at SEMI’s Industry Strategy Symposium, Christian Dieseldorff, SEMI senior analyst, provided an in-depth look at fab construction, capacity, and capex in 2011 and 2012. In this podcast, Dieseldorff walks listeners through fab construction projects by region and device type (LED, non-memory, memory, etc.)


Gallium nitride defect reduction technique improves LEDs

Wed, 1 Jan 2011

Researchers from North Carolina State University have now developed a new technique that reduces defects in the gallium nitride (GaN) films used to create LEDs, making them more efficient.


Leti-on-More-than-Moore-for-RF-filters

Mon, 1 Jan 2011

Engineered substrates and 3D integration technology based on direct bonding for future More Moore and More than Moore integrated devicesFor the "more than Moore" domain, Leti researchers at IEEE’s IEDM 2010 focused on RF applications in the paper #2.6, "Engineered substrates and 3D integration technology based on direct bonding for future More Moore and More than Moore integrated devices." Laurent Clavelier, head of solar technologies department at Leti, discusses the RF research with Debra Vogler.


Potential opportunities for nanotechnology in electronics manufacturing

Sat, 1 Jan 2011
At this point, the NRI program has not yet identified any single, most-promising candidate for a beyond CMOS nanotechnology, but there may eventually be several, spanning and extending the wide range of applications that CMOS FETs currently continue to address very well. Robert Doering, Texas Instruments, Dallas, Texas, USA

Steed-buys-ATSI-adds-gas-abatement-to-semiconductor-LED-solar-fab-equipment

Wed, 1 Jan 2011

Steed Technology, thermal processing equipment provider for semiconductor, LED, and solar cell manufacturers, acquired all of the outstanding stock of Applied Technology Specialists, Inc. (ATSI), an advanced engineering firm that specializes in developing advanced pollution control equipment and technology. The merger will enable equipment integration and additional "green" consulting expertise at Steed.


GT-Crystal-LEDs-market-and-fab-technology

Thu, 2 Feb 2011

GT Crystal Systems COO, Kurt Schmid provides details about the company's directional solidification process based on the heat exchanger method. Schmid observes that wafer manufacturers using MOCVD equipment will need to move to traditional semiconductor manufacturing technologies, which are based on 6"-diameter and larger size substrates.


UNH startup Innovacene wins $100K OLED grant from NHIRC

Thu, 2 Feb 2011

The NH-ICC has attracted a $100,000 grant from the NHIRC to help commercialize semiconductor technology developed by startup Innovacene.


Large-area-TFT-LCD-polarizer-market-for-2010: LG Chemical holds top position

Tue, 2 Feb 2011

Large-area TFT-LCD report, DisplaybankDisplaybank reports that LG Chemical secured its number one position in the large-area TFT-LCD polarizer market for the second straight year, followed by Nitto Denko and Sumitomo Chem. For the large-area TFT-LCD polarizer market in 2010, these top 3 suppliers' market share exceeded 80% of the total market.


Eulitha, DNP pattern photonic crystals on 4-in wafers

Tue, 2 Feb 2011

Eulitha AG and Dai Nippon Printing (DNP) say they have successfully patterned 4-in Si wafers with Eulitha's "PHABLE" technology, creating uniform photonic crystal patterns with 600nm period and hexagonal symmetry.


Analyst's take: Why the gate first-last debate isn't over

Mon, 1 Jan 2011

Common Platform Technology execs have declared that they will switch from a gate-first approach to a gate-last approach starting with the 20nm process technology node, essentially reversing their position for the past few years. Analysts told SST why the CPA had a change of heart, why it's not unexpected, and why other concerns will very soon overshadow this switchover -- and likely resurrect the debate.


Silicon-semiconductor-entanglement-realized-by-quantum-computing-researchers

Fri, 1 Jan 2011

Quantum computing entanglement research. Source: Keio UniversityProfessor Kohei Itoh, who is developing quantum computers based on silicon semiconductors at Keio University's Faculty of Science and Technology, together with Dr. John Morton at Oxford University and others, successfully generated and detected quantum entanglement between electron spin and nuclear spin in phosphorus impurities added to silicon.


Dow-Corning-joins-imec-GaN-Affiliation-Program

Thu, 1 Jan 2011

GaN-on-Si wafer processed at imec with Au-free MOSHEMT flowThe imec multi-partner industrial R&D program on GaN semiconductor materials and device technologies focuses next-generation GaN power device and LED development. The collaboration between Dow Corning and imec will concentrate on bringing the GaN epi-technology on silicon wafers to a manufacturing scale.


Brewer-Science-immersion-lithography-products

Mon, 2 Feb 2011

Brewer Science launched the OptiStack system of advanced lithography products: a combination of materials, software and process support. In tandem, Brewer Science debuted the ARC 300 coating series, designed to work with OptiStack.


LED manufacturing workshop with Solid State Technology, industry leaders: Tomorrow at Strategies in Light

Mon, 2 Feb 2011

Editor-in-chief Pete Singer will gather 7 industry experts to discuss LED manufacturing technology advances that will be critical in dropping LED costs at the chip and packaged device level. Speakers from the Department of Energy, EV Group, Semilab AMS, Rudolph, SAFC Hitech, and more will cover metrology, yield, automation, and the semiconductor-to-LED facility transition.


HBLED Manufacturing: Gearing Up

Tue, 2 Feb 2011
Peter Singer, Editor-in-Chief

Tabula-3D-PLD-fabless-raises-$108-million

Mon, 3 Mar 2011

Tabula will use the new capital to accelerate production of their 3PLD ABAX product family, expand customer and partner support infrastructures, and further next-generation product development in the rapidly growing programmable logic sector.


WFE projections, solar growth, tablets & 200mm highlight AMAT's analyst day

Fri, 3 Mar 2011

Key takeaways from Applied Material's analyst day meetings this week: Where wafer-fab equipment demand is strongest, how solar manufacturing technology can expand, and why tablet computers and electric vehicles are underpinning a resurgence in 200mm demand.


Nanotechnology-for-semiconductors

Thu, 3 Mar 2011

While semiconductor fab has always created nanoscale dimensions, a new class of nanomaterials -- graphene, carbon nanotubes (CNTs), nano-metal alloys, quantum dots -- behave radically differently than current materials. Nanotechnology promises higher-performance memory capacity and transistors in future semiconductors, says Giles Humpston, Tessera.


LED-test-standards-talk-with-Poppe-MENT

Wed, 3 Mar 2011

Comprehensive LED testing. SOURCE: Mentor GraphicsAndrás Poppe, PhD, marketing manager in Mentor Graphics' MicReD division, discusses LED testing challenges, such as neglected power flux, LED cooling, and the gap between lab and real operating conditions.


Update on sapphire crystal grower orders for LED substrate fab

Fri, 2 Feb 2011

Thermal Technology, crystal growth equipment and high-temperature furnace manufacturer, recently received 59 orders for their Model K1 90kg sapphire crystal grower from customers in Taiwan, Korea and China. In total, these growers will produce 5.2 million two-in-equivalents (TIE) per year.


Transparent conductors, ITO and alternatives

Wed, 2 Feb 2011

NanoMarkets issued a report, "The Business Case for Indium Tin Oxide and Alternative Transparent Conductors," that addresses the viability of transparent conductor alternatives to indium tin oxide (ITO).


Veeco GaN MOCVD tool debut

Thu, 2 Feb 2011

Veeco's TurboDisc MaxBright MOCVD, LED TV penetration Veeco Instruments' new TurboDisc MaxBright GaN MOCVD multi-reactor system is poised to take advantage of what the company believes is an accelerated rate of LED TV penetration. The new system targets manufacturing of HB-LEDs and is capable of single- or multi-chamber layer growth.


Nanolasers grown on silicon using MOCVD

Thu, 2 Feb 2011

UC Berkeley research on nano lasers for Si, III-V integrationNanolasers grown directly on a silicon surface could be a starting point for better microprocessors, biochemical sensors, and other optoelectronic products. UC Berkeley researchers grew nanopillars made of indium gallium arsenide, a III-V material, onto a silicon surface at 400°C.


DRIE tech transferred from Tegal to SPTS

Thu, 2 Feb 2011

SPTS completed the acquisition of deep reactive ion etch (DRIE) technology and certain related assets from Tegal Corporation. In addition, the deal includes the transfer to SPTS of the capital stock and operations of Tegal France SAS.


LED measurement webcast

Tue, 2 Feb 2011

On March 2, Solid State Technology and LEDs Magazine will co-host "Light and Color Measurement of Today's LED Technology," a free webcast sponsored by Konica Minolta Sensing Americas. The company's presenters will provide in-depth information on optical measurement techniques of LED technology, such as lighting, color theory, and LED structure.


United-LED-selects-Veeco-MOCVD-for-HB-LED-fab-ramp

Tue, 3 Mar 2011

United LED Shan Dong, UMC and Epistar JV, placed a multi-tool order for Veeco's TurboDisc K465i metal organic chemical vapor deposition (MOCVD) systems, to ramp HB-LED manufacturing.


Crossing-Automation-adds-SMIF-LPT-for-200mm-semiconductor-fabs

Fri, 3 Mar 2011

The adaptive SMIF-LPT solutions offer cost-effective upgrades of non-SMIF tools to SMIF, thereby enabling the conversion of existing 200mm facilities for semiconductor manufacturing at technology nodes below 180nm.


LED-maker-taps-Oxford-Instruments-for-etch-deposition

Mon, 3 Mar 2011

The Optogan Group placed a multi-system order for Oxford Instruments' etch and deposition systems. These include PlasmaPro System133 ICP and PlasmaPro 800Plus RIE etch systems, and a PlasmaPro 800Plus deposition system. 


Applied Materials' 2011 supplier awards

Tue, 11 Nov 2011

Applied Materials Inc. (Nasdaq:AMAT) presented five companies with awards for helping Applied meet its strategic business goals in 2011.


Emerging semiconductor companies: Financial analysis with GSA

Fri, 11 Nov 2011

The Global Semiconductor Alliance (GSA) shares financial reports on the top three emerging semiconductor industry companies of 2011, as voted by suppliers, customers, peers, and other members of the sector.


Philips Lumileds deploys MES from Camstar globally

Thu, 11 Nov 2011

Philips Lumileds, solid state lighting (LED) maker, deployed Camstar Systems Inc.'s Manufacturing Execution System (MES) at all global sites in less than 12 months.


LEDs and a MOCVD bubble: We've only just begun

Wed, 11 Nov 2011

Scanning the latest reports from a quartet of Wall Street analysts, a number of key themes emerge explaining what's driving a MOCVD slump in 2011-2012 (and maybe beyond), and how and when the situation might improve.


TSMC approves capex bump for advanced fab tech

Wed, 11 Nov 2011

TSMC's Board of Directors approved additional capital expenditures for advanced semiconductor manufacturing technologies and more 12" wafer capacity. The company also nailed down its R&D and 2012 capex budgets.


China lights up LED roadmap; Taiwan leaders seek similar support

Mon, 11 Nov 2011

China lays out its five-year plan to phase out old bulbs and spur LED demand; and Taiwan leaders invoke painful memories of DRAM and LCD market squeezes to urge more support for their own LED industry.


Fabricated silicon parts hit 200% growth on semiconductor, LED equipment bounceback

Mon, 9 Sep 2011

Fabricated silicon parts for semiconductor and LED equipment use made up a $310 million market in 2010, according to the Techcet Group. By 2014, the market will reach $412 million.


Gallium nitride extends beyond defense products

Fri, 9 Sep 2011

Gallium nitride (GaN) based devices are launching for applications in defense, wireless infrastructure, CATV, satellite and power electronics markets, according to the Strategy Analytics GaAs and Compound Semiconductor Technologies Service viewpoint.


AIXTRON sells MOCVD systems to Jiangsu CANYANG for blue LED fab

Tue, 9 Sep 2011

AIXTRON SE received an order from Jiangsu CANYANG Optoelectronics LTD. for four CRIUS II metal-organic chemical vapor deposition systems in a 55 x 2" configuration. All systems will be dedicated to the growth of high brightness blue LEDs.


Hynix suitor exits, leaving only one

Tue, 9 Sep 2011

One of two suitors to take a major stake in Korea's Hynix Semiconductor has bowed out of the running, leaving just one suitor for the planet's second-largest memory chipmaker in the latest push by creditors/owners to slough off some of the burden.


Outdoor LED adoption trends

Tue, 8 Aug 2011

The viability of LEDs in outdoor applications will be a test for LED technology's competitiveness as a whole. Particularly in China, street lighting is the biggest sector for LED adoption. China is seeing problems with LED quality, while North America tends to see less-eventful LED integration.


SIS lithography eliminates hard mask for deep patterns at Argonne Labs

Fri, 8 Aug 2011

Argonne Lab researchers have created an e-beam lithography process that boosts resist layers to eliminate the hard mask application. It results in more precise features and deeper etch for semiconductor, solar energy, and other products.


RBCN upgrages to larger sapphire wafer furnaces company-wide

Thu, 8 Aug 2011

Rubicon Technology (RBCN) completed company-wide enhancements to its proprietary crystal growth furnaces, upgrading to Rubicon Furnace Version ES2-XLG3.0, which produces large-diameter sapphire material with greater automation and higher yields.


MOCVD shipments stall, but restart in 2012

Thu, 8 Aug 2011

A rising LED surplus, slowed LED adoption, tighter credit in China, and other factors are converging to stall out MOCVD equipment installs in 2011. Once the LED oversupply is drained off, LED manufacturers will kickstart capacity expansions, likely in 2012, according to IMS Research.


Compact workcell kits 600 wafers in cleanroom conditions

Wed, 8 Aug 2011

CHAD Industries launched the WaferMate300-2SS sorter/stocker workcell with multiple customer installations. The compact wafer buffer modules each hold 150 wafers.


KLAC debuts 20nm-node defect inspection system

Tue, 8 Aug 2011

KLA-Tencor Corporation (NASDAQ:KLAC) launched the eDR-7000 electron-beam (e-beam) wafer defect review system for chip manufacturing at the 20nm device nodes and below.


GaN-on-Si advances from Translucent and Bridgelux

Mon, 8 Aug 2011

Translucent launched its Si wafer templates commerically for GaN growth, and Bridgelux set a new Lumens/W record for Gan-on-Si LEDs.


Stanford, SLAC researchers gate a topological insulator

Wed, 10 Oct 2011

Stanford researchers have combined two known topological insulators to create a new one, fabricated small plates with the new topological insulator, and gated them. The result is an insulator-based transistor.


Quantum dot OLEDs fabbed via spin coating

Thu, 9 Sep 2011

University of Florida researchers developed a manufacturing process for quantum dot LEDs that is lower cost and higher volume than previous attempts, eliminating vacuum-based steps. The research spawned a start-up company: NanoPhotonica.


SEMICON Taiwan preview: Forums span key technology, markets

Tue, 8 Aug 2011

SEMICON Taiwan (Sept. 7-9) approaches, the island's most celebrated event for microelectronics manufacturing, coorganized by SEMI and the Taiwan External Trade Development Council (TAITRA), offers more than 60 programs and sessions and 550 exhibitors spanning the entire semiconductor value chain and related high-growth industries.


IEEE Photonics conference highlights lasers, LEDs, optical communications, sensors, displays and more

Tue, 8 Aug 2011

The IEEE Photonics Conference 2011, previously known as the IEEE LEOS Annual Meeting, will offer more than 550 technical presentations by the world

SEMI hands the reins to Denny McGuirk

Mon, 8 Aug 2011

SEMI appointed Dennis P. McGuirk as president and CEO. He replaces Stanley T. Myers, who is retiring. McGuirk comes to SEMI from IPC -- Association Connecting Electronics Industries, where he led a globalization effort.


LED forecast and MOCVD utilization chat with Strategies Unlimited

Fri, 8 Aug 2011

Tom Hausken, Strategies Unlimited, shares insights on LED growth, the gap between MOCVD purchasing and utilization, and the global distribution of LED manufacturing.


Ultratech's market/technology strategies support revenue growth

Thu, 8 Aug 2011

Scott Zafiropoulo explains Ultratech's business and positioning strategies in an interview at SEMICON West, including how the company weathers market cyclicality and prepares for a 450mm wafer-size transition.


China makes LED investments coming and going

Wed, 8 Aug 2011

China has develped government support infrastructure for LED manufacturing and consumption. LED production investments have rapidly escalated in China, and the country is the world's leading consumer of solid state lighting.


Projection litho tool lowers CoO for HB-LED manufacturing

Tue, 8 Aug 2011

Doug Anberg, VP of advanced stepper technology at Ultratech, discusses the physics behind improvements in the company's new Sapphire 100E HB-LED tool in a video interview at SEMICON West 2011.


Samsung invests in OLED maker Novaled

Wed, 9 Sep 2011

Samsung Venture Investment Corporation has become a shareholder in Novaled AG, high-efficiency OLED maker with expertise in synthetic and analytical chemistry.


DOE funds LED manufacturing R&D with up to $10M

Tue, 9 Sep 2011

The US DOE is accepting funding applications through December 15, 2011, for developers of solid-state lighting such as LEDs and OLEDs. Up to $10 million is available to research lower-cost manufacturing methods.


Vacuum gauge sensor prevents temperature drift

Wed, 9 Sep 2011

InstruTech released its Cold cathode Ionization vacuum gauge CCM501, which the company is calling its Hornet module. The CCM501 is a rugged Cold Cathode gauge based on double inverted magnetron technology. It measures pressures from 1 x 10-8 to 1 x 10-2 Torr.


Strategies in Light adds LED manufacturing track

Tue, 10 Oct 2011

Strategies in Light, an annual tradeshow on high-brightness LEDs and lighting hosted by Strategies Unlimited and PennWell Corporation, will take place February 7-9, 2012 in Santa Clara, CA. New this year, the conference will include a full parallel track on LED manufacturing.


Bridgelux fundraises for GaN-on-Si LED ramp

Tue, 10 Oct 2011

Bridgelux closed an additional $15 million in financing to accelerate R&D and scaling of Bridgelux's gallium nitride on silicon (GaN-on-Si) LED chip technologies.


RBCN brings aluminum oxide processing in-house

Fri, 10 Oct 2011

Rubicon Technology Inc. (NASDAQ:RBCN) will transition to on-premise aluminum oxide processing to better control the quality of its sapphire wafers, and reduce manufacturing expenses while ensuring a steady supply of raw materials for large-diameter wafers.


Optogan LED chip fab opens in Germany

Fri, 10 Oct 2011

Optogan opened its LED production site in Landshut, Germany, planning to produce 1 billion chips/year initially.


Flat silicon wafer shipments will pick up in 2012, 2013

Wed, 10 Oct 2011

While the market has currently softened, early-2011 momentum will carry the year's semiconductor silicon sales to a higher total than 2010, said Stanley T. Myers, president and CEO of SEMI, noting the figures are an industry record. Growth will continue at "modest levels" through 2013.


OLEDs Summit: OLED TV development and barriers from LG Display, DuPont

Mon, 10 Oct 2011

Several speakers at the recent OLEDs World Summit 2011 (9/26-28 in San Francisco) discussed the appeal of organic light emitting diodes (OLEDs) for large-format image displays, rising in appeal over liquid-crystal displays (LCD).


HB-LED revenues contend with supply growth, demand slowing

Fri, 10 Oct 2011

Revenues for HB-LEDs grew 108% to $11.2 billion in 2010, driven by applications in TV backlight units, according to Strategies Unlimited. The party is quieting down though, as expanding supply and a slowdown in overall TV demand in 2011 pushed LED prices drastically lower and squeezing out weaker makers.


STM completes 20nm chip tapeout with MENT design tools

Mon, 11 Nov 2011

Mentor Graphics Corporation (NASDAQ:MENT) completed a 20nm test chip tapeout with STMicroelectronics (NYSE:STM), overcoming low-power and double-patterning challenges.


Freescale Semiconductor CEO takes SIA lead

Thu, 11 Nov 2011

The Semiconductor Industry Association (SIA) elected Freescale Semiconductor CEO Rich Beyer as its 2012 chairman. This will be the SIA's 35th year.


OLED lighting on foil project launches with imec at helm

Thu, 11 Nov 2011

Imec and its project partners launched IMOLA (Intelligent light Management for organic light-emitting diode on foil Applications), tasked with making large-area OLED-based lighting modules with built-in intelligent light management.


DuPont AMOLED fab tech draws TV display maker's interest

Thu, 11 Nov 2011

DuPont has signed a technology licensing agreement allowing an Asian display maker to use DuPont process technology to make large AMOLED television displays at significantly lower cost than alternative technologies.


OLED on plastic rivals glass-based OLED efficiency

Tue, 11 Nov 2011

The University of Toronto's organic light-emitting diode (OLED) on plastic reportedly boasts the highest efficiency for plastic-based OLEDs to date, comprable to the top-of-the-line glass-based OLEDs.


GlobalFoundries names CEO: Manocha keeps the job

Mon, 10 Oct 2011

GLOBALFOUNDRIES named Ajit Manocha its permanent CEO, chosen by the foundry's Board of Directors. He had served as interim CEO since June 2011.


LEDs get efficiency boost from ZnO microwires

Mon, 10 Oct 2011

Georgia Tech researchers have found that GaN LEDs get a significant efficiency boost from zinc oxide microwires. The piezo-phototronic effect charges LEDs' ability to convert electricity to UV light, which GA Tech believes is a first for the LED industry.


Printed electronics improve displays, lithium-ion batteries, c-Si solar cells

Fri, 10 Oct 2011

Printed electronics can improve existing electronics and energy applications, replacing non-printed layers in displays or increasing crystalline silicon photovoltaics efficiency, among other applications shared by IDTechEx.


AMAT alarm: Capex sliding back to "like 2003"

Thu, 5 May 2008
by James Montgomery, News Editor, Solid State Technology
May 14, 2008 - Industry projections of a soft 2008 aren't nearly soft enough, according to AMAT president/CEO Mike Splinter -- he projects capex could be down 35% or more this year. "There's not a good story" being told in any chipmaking sector, he told listeners in a quarterly results conference call, adding that capex levels will be similar to those from 2003.

Analyst: Big 4 still rule foundry roost, but Samsung moving up

Tue, 5 May 2008
May 6, 2008 - The top four foundries stayed comfortably ahead of the pack in 2007, with SMIC and Chartered still battling for third place behind TSMC and UMC, according to IC Insights. But making a big push into the top 10 is a big-name IDM with a burgeoning foundry biz of its own.

Analyst: Metrology/inspection sector did better in 2007, but still underperformed

Tue, 5 May 2008
May 6, 2008 - The semiconductor metrology/inspection equipment market grew 7.2% in 2007, according to calculations from market research firm The Information Network. Good news: That's double the ~3% growth it expected at the mid-year point. Bad news: it's still well below the 11% growth for the frontend wafer processing side of the equipment sector.

Analyst: Deposition segments to accelerate growth through 2013

Thu, 5 May 2008
May 1, 2008 - Three segments of thin-layer deposition will see their growth rates increase over the next six years, with the top two (CVD and ion implant) enjoying the best growth over the period, according to data from BCC Research.

Analyst: Automation tools to slump 34% in 2008

Mon, 6 Jun 2008
June 9, 2008 - Semiconductor equipment sales in general are expected to slump in 2008, and the automation segment is no exception, though there is some motion in the sector among suppliers, according to a brief analysis by The Information Network.

Analysis: Oki-Rohm chip sale epitomizes Japan industry's path

Wed, 5 May 2008
May 28, 2008 - Japan's Electric Industry Co. is spinning off its chipmaking operation into a new company and giving a majority ownership to Rohm Co., a move that illustrates the history of Japan's chip industry since the 1980s and the hazard of trying to do business at the leading-edge of technology.

PV tool suppliers form association

Wed, 5 May 2008
May 28, 2008 - A group of more than 30 companies in the US, Europe, and Asia have organized a new association to share information and ideas, and develop business deals and strategic partnerships.

Analyst: Display driver ICs "maturing" as FPD demand surges

Tue, 6 Jun 2008
June 2, 2008 - As global flat-panel displays become ubiquitous, sales of display driver ICs are about to decelerate due to pricing pressures and technology advancements, according to a report from iSuppli.

Report: Intel's Dalian fab attracting LED work

Tue, 3 Mar 2008
Mar. 25, 2008 - Intel's decision to locate a 300mm fab in Dalian, China, has spurred interest in the area for other industries, including LED makers from Taiwan, with Epistar and Everlight Electronics considering building a joint facility there, according to the Taiwan Economic News.

iSuppli lowers 2007 chip tally on memory weakness

Thu, 3 Mar 2008
Mar. 20, 2008 - An unexpectedly soft memory market in 4Q07 has caused analyst firm iSuppli to trim about $2B off its totals for the full year, pushing overall annual growth down to 3.3% vs. a preliminary forecast of 4.1% in November.

Analyst: Top IC suppliers remain largely unchanged 2007

Tue, 3 Mar 2008
Mar. 18, 2008 - Despite a late-year slowdown among industry and US economic uncertainty, 2007 turned out to be a decent year for major IC and related equipment suppliers, with just a few shufflings in the rankings reflecting marketshare gains and losses, according to new data from VLSI Research.

SPIE NEWS: SEMATECH, Carl Zeiss finalize design for DP photomask metrology system

Tue, 2 Feb 2008
Feb. 26, 2008 - Carl Zeiss and SEMATECH say they have completed final design for a next-generation photomask registration and overlay metrology system, dubbed "Prove," that will enable production of advanced photomasks "with substantially improved image placement accuracy," eyeing in particular the tighter placement control required for double-patterning technology.

Fraunhofer-led EU solar R&D adds Synova as partner

Tue, 2 Feb 2008
Feb. 26, 2008 - Synova says it has joined a research alliance led by the Fraunhofer Institute for Solar Energy Systems to explore how its water jet-guided laser technology could be used as a manufacturing method to speed processing and improve performance of solar cells.

SEMI: Wafer shipments rose 8% in 2007

Wed, 2 Feb 2008
Feb. 6, 2008 - Worldwide silicon wafer area shipments came in right around SEMI's revised projections in 2007, squeaking back into positive growth territory by year's end, according to the latest data from SEMI's SEMI Silicon Manufacturers Group (SMG).

TSMC's Morris Chang: Healthy growth ahead as semi's become "ubiquitous"

Fri, 2 Feb 2008
by Bob Haavind, Editorial Director, Solid State Technology
Jan. 31, 2008 - TSMC founder Morris Chang's speech at December's IEDM predicted healthy growth for semiconductors as they become "ubiquitous," with different values from different chip technologies. In a separate chat with reporters, he also opined about the global economy and sweeping changes in the semiconductor industry, including how foundries work with their design customers and the key to future SoC success.

ISS Wall Street panel: Solid growth, clean financials, alternate markets key to stock evaluations

Wed, 1 Jan 2008
What makes a process tool or material stock attractive to investors? Will private funds take over some equipment companies? How will the chip industry deal with exponentially rising design costs? These were some of the tough questions dealt with by an all-star investment analyst panel at the 2008 Industry Strategy Symposium in Half Moon Bay, CA.

Japan's PV suppliers tout improved efficiencies

Fri, 1 Jan 2008
SST partner Nikkei Microdevices reports from the 17th International Photovoltaic Science and Engineering Conference in Fukuoka, Japan, where leading Japanese photovoltaic suppliers described technologies for improved efficiencies now starting to move into production. Also, details on TEL's pending entry into the solar equipment market with a thin-film deposition system.

Novel device concepts explored at IEDM

Mon, 1 Jan 2008
While several papers at the recent International Electron Devices Meeting (IEDM) explored high-k/metal gate dielectric concepts to cut leakage currents, there was also some discussion of performance enhancement by using metal for the source and drain. Also, IBM showed a novel implant technique enabling very low leakage SOI CMOS for 65nm and below, and UC-Berkeley researchers have a new concept for optoelectronic tweezers that can trap and move objects down to the nanoscale.

Wafer inspection firm Qcept adds more funding

Mon, 3 Mar 2008
Mar. 3, 2008 - Qcept Technologies, an Atlanta, GA-based developer of surface inspection systems for semiconductor manufacturing, has raised another $9.5M in a Series C round of funding, led by previous investors (Siemens Venture Capital, along with Pittco Capital Management and others), bringing the overall total financing raised to roughly $25M.

Molecular Imprints announces 4WPH step-and-flash imprint tool

Mon, 2 Feb 2008
by M. David Levenson, Editor-in-Chief, Microlithography World
Feb. 25, 2008 - Molecular Imprints CEO Mark Melliar-Smith tells WaferNEWS why its Imprio 300 imprint lithography tool is the "only game in town" for semiconductor prototyping and process development in the <30nm realm, capable of printing 32nm, 28nm and 22nm features at 4WPH with 35nm overlay.

eASIC nails down $48M in funding

Thu, 3 Mar 2008
Mar. 13, 2008 - eASIC, a company that develops technology for making structured ASICs, say sit has raised $48M in "late stage" financing.

RF MEMS designer nails down $7M funding

Mon, 3 Mar 2008
Mar. 10, 2008 - WiSpry, a developer of programmable radio frequency (RF) semiconductor products, says it has tacked on another $7M to its Series B round of funding, for a total of $18M raised in the round. The funds will be used to transition from technology development into product qualification, the company noted in a statement.

Report: Indium-tin-oxide replacements eye application entry points

Tue, 3 Mar 2008
Mar. 18, 2008 - The market for transparent semiconductors used in display, photovoltaics, and lighting markets will surge to ~$9.4B by 2015, according to a study from analysis firm NanoMarkets. And a key element in the devices, indium tin oxide (ITO), will continue to be in heavy demand despite surging prices and other limitations.

March 2008 SST Exclusive Feature:
Special Report Series: ISS and SMC

Mon, 3 Mar 2008
By SST Editorial Staff

The SST Editorial Staff recaps SEMI's recent Industry Strategy Symposium (ISS), and the Strategic Materials Conference (SMC) that followed, with this special report series available only on our website.

Pixelated phase-shift computational techniques developed for sub-wavelength 4X maskmaking

Tue, 3 Mar 2008
by Bob Haavind, Editorial Director, Solid State Technology
Problems with complex circuit patterns using alternating phase shift masks for low k1 lithography led Intel to experiment with using trillions of pixels for imaging. A number of papers at this year's SPIE Advanced Lithography Conference described the techniques developed to successfully do the critical first metallization layer (M1) on a microprocessor using pixelated phase-shift masks.

NEWS ANALYSIS: Wanna buy a semi implant biz?

Mon, 2 Feb 2008
Feb. 25, 2008 - In a move to narrow its focus to homeland security applications, Implant Sciences is putting its semiconductor subsidiary, Core Systems up for sale.

Credence sells diagnostics biz to former GM

Mon, 2 Feb 2008
Feb. 24, 2008 - Credence Systems has sold its diagnostics and characterization business to DCG Systems, an independent company led by Israel Niv, former GM of the business from 2003-2005 and founder of Optonics, an emission-based optical diagnostics and failure analysis supplier bought by Credence in late 2002.

KLA-Tencor scoops up ICOS for backend, LCD/solar play

Thu, 2 Feb 2008
Feb. 21, 2008 - The latest move in metrology industry consolidation has occurred with KLA-Tencor's proposed "friendly" acquisition of Belgium firm ICOS Vision Systems in a proposed €316.9M (US $465.8M) cash transaction.

Stealth solar firm claims $10M funding

Mon, 2 Feb 2008
Deb. 18, 2008 - Israeli company Pythagoras Solar, claiming to have a play in the photovoltaic sector, says it has completed a $10M round of Series A funding for domestic R&D and global commercialization of its technology and products, which the firm boasts "have the potential to change the economics of solar power."

Inside Oxford/TDI's HVPE technique for InGaN growth

Thu, 10 Oct 2008
TDI, an Oxford Instruments company, talks with SST about its hydride vapor phase epitaxy (HVPE) technology, which shows promise in growth of high-quality InGaN layers for blue-green LED production.

Chip sales slipping, following consumer concerns

Thu, 10 Oct 2008
Thanks to the global economic shakiness and consumer wariness, the SIA's forecast of ~4.5% growth for 2008 is in jeopardy. Through the first nine months of 2008, chip sales total $196.4B, about 4% higher than the same period a year ago.

Extending/complementing optical litho using S-FIL for memory applications

Fri, 7 Jul 2008
New technologies are needed to keep the semiconductor industry on track with Moore's Law. Step and Flash Imprint Lithography (S-FIL) has gained traction in recent years among several leading memory manufacturers.

IMEC, Taiyo Nippon Sanso collaborate on green LEDs

Mon, 10 Oct 2008
Oct. 6, 2008 -- European nanoelectronics research consortium IMEC and Japanese gases/equipment supplier Taiyo Nippon Sanso Corp. (TNSC) say they will jointly develop manufacturing technology for high-efficiency LED devices, TNSC's first such collaboration in Europe.

Aviza's Cutini optimistic about 3D IC, MEMS market

Mon, 7 Jul 2008
Speaking at the SEMInvest forum on Monday, Aviza's CEO Jerry Cutini said that the MEMS and through-silicon-via/3D IC markets are finally starting to buy equipment in production quantities. He said these markets plus ALD represent a billion dollar TAM (total available market) by 2011 for all products, with a compound annual growth rate of ~18%.

Credence, LTX propose "merger of equals"

Mon, 6 Jun 2008
June 23, 2008 - Automated test equipment providers Credence and LTX say they have agreed to merge their companies in a deal that they project will save them ~$25M. While bullish on their combined prospects, investors seem to think otherwise.

SEMI: 1Q08 demand soft, but some regions doing ok

Tue, 6 Jun 2008
June 17, 2008 - Worldwide demand for semiconductor manufacturing was notably soft in 1Q08, with bookings down >20% from a year ago, but some regions are clearly working through the downturn better than others, according to the latest data from SEMI.

Report: Insiders mull LED play from TSMC

Mon, 4 Apr 2008
April 21, 2008 - A $40M VC investment in a US-based LED epitaxy technology is generating rumors that TSMC is making a push into this market segment.

Taiwan chip assemblers' China investments approved

Fri, 4 Apr 2008
Apr. 11, 2008 - Four Taiwanese chip assembly firms have received approval from the Ministry of Economic Affairs (MOEA) to send nearly $90M in investments to business interests in China, ahead of what may be an increase in cross-strait business deals following the appointment of a more liberally minded Taiwan government.

Xilinx hires Cadence EVP/GM to replace Roelandts

Wed, 1 Jan 2008
Jan. 9, 2007 - After a five-month search, fabless firm Xilinx has hired Moshe Gavrielov, former EVP/GM at Cadence Design Systems, as its next president/CEO effective immediately, taking over for the retiring Willem Roelandts, who will remain chairman of the board.

IEDM Day 4: Sub-45nm roundup

Fri, 12 Dec 2008
Wednesday morning at IEDM was an endurance test, with nine consecutive papers on 22, 32, and 45nm devices. A lot of strained silicon, and not a few strained attendees! Rather than cherry-pick, here's a run-through of Session 27.

IEDM: IMEC optimizes 65nm Ge pFET

Mon, 12 Dec 2008
Minimizing the Ge in diffusion into a silicon capping layer is the key to boost electrical performance and reach 1nm EOT (equivalent oxide thickness) devices, according to IMEC researchers presenting at IEDM this week.

Researchers: Two types of solar-cell materials are better than one

Fri, 1 Jan 2008
Jan. 17, 2008 - Combining two methods for making solar cell materials appears to yield better results than either one alone, according to researchers from the U. of California/Santa Cruz, China, and Mexico who say their nanocomposite thin film doped with nitrogen and sensitized with quantum dots performs "better than predicted."

JSPA gets Korea patent for LED wafer scribing

Fri, 1 Jan 2008
Jan. 4, 2008 - JP Sercel Associates says it has been awarded a patent in Korea for its front-side laser scribing technique for LED wafers.

SMC highlights PV, LED, packaging materials

Wed, 1 Jan 2008
Last week hundreds of microelectronics industry executives gathered at ISS and SMC, absorbing the conventional forecasts for semiconductor manufacturing equipment and materials. But on the technology side, SMC showed truly amazing perspective on new electronic materials markets of gigantic scales like photovoltaics, high-efficiency lighting, and advanced 3D and WLP packages.

KLA-Tencor paying $65M to end investor suit over options

Mon, 1 Jan 2008
Jan. 28, 2008 - KLA-Tencor says it has "agreed in principle" to pay $65M to settle a shareholder lawsuit stemming from its longtime backdating of employee stock options, which if approved would be the second-biggest shareholder payout stemming from the industrywide backdating scandal that erupted in 2006.

Fabless, foundries top YTD chip growth

Wed, 11 Nov 2008
The ranks of top semiconductor suppliers in terms of sales is missing a lot of memory these days, but that means those who are left are enjoying better growth than the industry average, particularly those in the fabless/foundry segment, according to recent rankings from IC Insights.

iSuppli: 3Q08 MPU sales shift, picture better than feared

Thu, 11 Nov 2008
Intel regained market share in the latest quarterly tallies of microprocessor (MPU) sales that it had lost to rival AMD a year ago, and overall sales were still healthy Y-Y despite slowing PC demand, according to data from iSuppli.

Oxford Instruments buys TDI, expands HB-LED biz

Fri, 4 Apr 2008
Apr. 11, 2008 - UK-based Oxford Instruments says it has acquired Silver Spring, MD-based Technologies and Devices International, a developer of hydride vapor phase epitaxy (HVPE) technology and processes, in a bid to expand its offerings for makers of high-brightness LEDs.

Gartner: 2008 chip decline, 2009 "considerably worse"

Tue, 12 Dec 2008
A month after dropping its outlook for both 2008 and 2009, Gartner has decided its previous "worst-case scenario" for the chip industry isn't nearly bad enough -- it now projects only the fifth decline in the past 25 years for 2008, and says 2009 will be "considerably worse."

Silicon-on-sapphire market to surge 21% through 2012

Tue, 9 Sep 2008
The sapphire substrate market will grow at a 21% annual clip through 2012 to top $400M, led by demand from LED makers now focused on Western markets where pricing remains stable, according to a report from Yole Développement.

iSuppli: Auto MEMS sensors to surge by 2012

Mon, 9 Sep 2008
New government mandates will help nearly double the global shipments of automotive microelectromechanical systems (MEMS) from 2006-2012 (a 12% CAGR), while sales surge to $2.1B (8% CAGR), according to data from iSuppli.

Analysts, audience mix it up at SEMI breakfast

Mon, 9 Sep 2008
This year's annual fall gathering of a SEMI-hosted industry panel discussion with Wall Street watchers didn't quite follow script. The end result was a more open and energetic back-and-forth dialog about the tense relationships between the semiconductor industry, the investment community, and the government.

How IT supports integrated global/local strategies and operations for Toshiba

Tue, 5 May 2008
by Bob Haavind, Editorial Director, Solid State Technology
May 20, 2008 - In his presentation during a "Fab Lite" session at the ConFab, Giichi Inoue of Toshiba Semiconductor explained how IT plays multiple supporting roles in marketing and manufacturing, interlinking many intricate tasks and strategies to allow smooth global operation across many markets with fast response to customer needs. Plus: why Japanese firms are "agrarian" and US firms are "hunters."

Global Solar scaling CIGS heights

Fri, 7 Jul 2008
Unlike its flashier competitors, Global Solar has quietly achieved fully commercialized solar products involving depositing CIGS films and solar cells for modules designed for crystalline silicon. Tim Teich, VP for sales and marketing, tells SST more about the company and its seemingly low profile in Tuscon, AZ, and where he sees the most promising growth ahead.

On display: Tech, strategy, glimpses at FPDI

Tue, 11 Nov 2008
Among the high-level takeaways from the recent FPDI displays event in Japan: Digital signage looks like the next "big" near-term market, Hollywood is pinning hopes on 3D technology, LCD TVs continue to improve thanks to backlight technology; and newer technologies (OLEDs, e-inks, R2R) are progressing but not yet ready.

Analysis: July chip data reiterates recovery well underway

Mon, 8 Aug 2009
July is a historically slow month in the annual semiconductor picture, but this year is the exception to the rule, and one analyst suggests that gloom-&-doomers need to rethink their outlook.

News from Japan: Mirai out-sims Monte Carlo

Wed, 2 Feb 2009
Scanning headlines from Japan this week: the Mirai project's blazing SRAM simulations, Toshiba and Fujitsu's HDD handoff, Renesas' rebellious union, and what might be the next fullerene.

SPIE keynote: "Virtuous cycle" for ICs, LCD applies to PV too

Tue, 2 Feb 2009
The same "Virtuous Cycle" that has led to business success in semiconductor and display markets can be used to generate significant growth in PV markets, according to Applied Materials SVP Gilad Almogy, in his SPIE keynote address.

Global PV market may decline in 2009 as Spain caps subsidies

Tue, 8 Aug 2009
The robust 40% CAGR for the global photovoltaic (PV) market is likely to slow down in 2009, and may even decline, partly due to the recession but also because of Spain's PV pullback. The world market has a big shortfall to match, which many believe is unlikely.

As demand for solar tech deepens, where do thin films stand?

Wed, 5 May 2009
Thin films are facing difficult times; the clear theme at conferences has been survival during a prolonged period of sluggish demand and lower crystalline prices. With no certain answers or paths to recovery, one thing is becoming clear to the thin-film sector -- the promise of unlimited demand was a dream, and it is time to wake up.

iSuppli: Intel tightens MPU grip in 2Q

Wed, 9 Sep 2009

Intel expanded its four-year-running dominance of the microprocessor segment in 2Q09, widening its lead by nearly a point-and-a-half over AMD and topping a four-year high in market share, according to the latest numbers from iSuppli.


Gartner darkens 2009 outlook, but brightens 2010-2012

Mon, 9 Sep 2009

September 14, 2009 - A 2H09 rebound in the chipmaking equipment sector won't be enough to make up for the horrid performance in late 2008 andearly 2009, but analyst firm Gartner does see much better times in 2010 and beyond, according to its newly updated forecast.


Analyst: Buckle up for double-digit growth again

Tue, 6 Jun 2009
It's increasingly clear that 2009 will be a tough year for the semiconductor industry, but if historic trends hold up we can expect to enjoy a return to double-digit growth, at least for 2010 and 2011, according to an optimistic analyst speaking at The ConFab in Las Vegas this week.

TSMC's Morris Chang back at the helm, steering toward solar, LEDs

Fri, 6 Jun 2009
Media and investors are abuzz with word from top global foundry bellwether TSMC that Morris Chang has retaken the helm of the company, with goals to make a concerted push outside the semiconductor world into LEDs and solar energy.

Electroglas reforms around prober assets

Tue, 10 Oct 2009

A Delaware bankruptcy court has approved the sale of Electroglas' wafer probe assets, including name and trademarks, to private financial group EG Systems -- formed specifically for this purpose.


Wafer supplier IQE buys GaN materials firm

Wed, 10 Oct 2009

IQE plc has agreed to acquire UK compatriot NanoGaN, which offers processes and IP related to gallium nitride (GaN) materials and devices, in a deal worth up to £3.6M.


WSTS sees better chip sales in 2010

Fri, 11 Nov 2009

Things have picked up dramatically in the past few months, according to World Semiconductor Trade Statistics (WSTS) organization, which has hiked its outlook for various chip industry segments -- not just in 2010 but 2011 as well.


The global economy fell down and went boom -- will solar follow?

Fri, 1 Jan 2009
It's clear that the gloomy global economy will have an affect on the market for solar electric systems, but this is not the only situation currently affecting demand. Still, Paula Mints of Navigant Consulting thinks the PV market's momentum will continue thanks largely to new technologies and business models maturing during the economic downturn.

ISS '09: Semi outlook grim -- is boom or lengthy downturn next?

Mon, 1 Jan 2009
Who's upbeat about the semiconductor sector, and why? When will this downturn turn into sustainable growth again? What will fix the memory sector to make money again? Who's a bigger economic pariah than Bernie Madoff? SST's Bob Haavind ties it all together from presentations at ISS '09.

Generating variable and capital cost reduction in implant modules

Tue, 8 Aug 2009
This article tells how Texas Instruments' incorporation of SAG technology into its fabs resulted in close to $1 million in capital savings and ~$150,000 in recurring annual energy savings; it is anticipated that ROI for the project in the long term will continue to increase.

Is the past a prologue for this cycle?

Thu, 1 Jan 2009
Every semiconductor downturn raises two key questions: How long will it last, and who will survive? For answers, we must look at the causes of these cyclical events, and hazard some crystal-ball gazing into the current crisis.

Analysis: Qimonda flop not surprising, won't help DRAM slump much

Tue, 1 Jan 2009
Qimonda's filing for bankruptcy, while perhaps not entirely surprising, is nonetheless sending shockwaves through the industry, and it's likely that no matter what happens, the consolidation of the DRAM industry is now underway.

JAPAN NEWS: Analyzing the Renesas-NEC deal; fleeing to solar, LEDs

Tue, 4 Apr 2009
Renesas and NEC are reportedly mulling a merger, but traditional M&A benefits may be trumped in the interest of pure survival. Also from Japanese headlines: nervous firms ahead of quarterly results, and how chipmaking equipment firms are staying above water until the industry turns around.

Optimism rules at Intersolar despite slowdown

Thu, 7 Jul 2009
The global recession, slow recovery of lending, soft demand, and crashing prices could not dampen the hope found everywhere at Intersolar North America last week (July 14-16). The industry will prosper and profit thanks to the visions of such true believers -- because if a thing is worth doing, it is worth continuing to do despite obstacles.

Catching up with Sumika

Mon, 7 Jul 2009
PV World caught up with Ken Campmann, GM of Sumika's epi operations, before Intersolar North America, for an update on the company's work with GaAs-based epitaxial wafers for solar cells, as well as partnerships to explore I-band and indium nitride-based technologies.

Automation is key to getting lean for 450mm manufacturing

Wed, 4 Apr 2009
ISMI has been the leader in implementing small-lot manufacturing and single wafer processing for 300mm Prime and next-generation factory (NGF) 450mm manufacturing.

Leverage strong cash position with leading-edge technology for continued growth

Thu, 1 Jan 2009
To successfully maneuver in today's restless economic waters, companies must possess a stellar balance sheet with a strong cash position, and provide leading-edge technology.

Yield management strategies need to keep pace with semiconductor innovation

Thu, 1 Jan 2009
Amid the gloomy outlook on IC demand in the coming quarters, many chip manufacturers are cutting back on their investments to build capacity. However, it is at this time -- when demand is at its softest -- that the wisest of chip manufacturers are continuing to make strategic investments in new manufacturing technologies and methodologies in order to position themselves to quickly ramp up on new chip designs when semiconductor demand inevitably swings upward once again.

ISMI REPORT: Intel touts environmental benefits of 300mm conversion

Tue, 10 Oct 2006
Efficiencies and cost benefits have driven the shift from 200mm to 300mm wafers for semiconductor manufacturing. But in a detailed study presented earlier this month at the third annual International SEMATECH Manufacturing Initiative (ISMI) Symposium on Manufacturing Effectiveness in Austin, TX, Intel found its ramp of 300mm manufacturing has also led to significant environmental benefits -- with lessons that could result in further gains if and when the industry moves to 450mm production.

AmberWave closes $25M in funding

Fri, 7 Jul 2006
July 21, 2006 - AmberWave Systems Corp., a Salem, NH-based developer of IP relating to strained silicon and other advanced materials, has closed an oversubscribed $25 million Series E round of funding, bringing its total cash raised in five rounds to more than $91 million.

Intel cuts 2006 capex, R&D targets after 2Q shortfall

Thu, 7 Jul 2006
July 20, 2006 - Price cuts and rising inventory dented Intel Corp.'s 2Q06 performance, and the company has responded by cutting its capital spending and R&D targets for the rest of the year.

Report: Semi R&D spending up 10% in 2005

Wed, 7 Jul 2006
July 19, 2006 - Worldwide semiconductor companies spend more than $30 billion in 2005 on R&D, 10% more than the previous year, and slighly ahead of the 9% compound annual growth rate over the past five years, according to new data from analyst firm IC Insights Inc., Scottsdale, AZ.

SRC opening compound semi research center

Wed, 7 Jul 2006
July 12, 2006 - Semiconductor Research Corp., a university-research consortium for semiconductor technologies, has opened a Non-Classical CMOS Research Center for five universities to collaborate on development III-V compound semiconductors, seeking production-quality results that could replace classical silicon CMOS as early as 2012.

ASAT replaces CEO, shuffles board

Fri, 9 Sep 2006
September 1, 2006 - ASAT Holdings Ltd. has appointed Tung Kok Li as acting CEO effective immediately, succeeding Robert Gange who has resigned citing personal reasons, but will serve as a consultant during a transition period.

Analyst: Flip-chip demand boosting litho, wet etch markets

Wed, 7 Jul 2006
July 12, 2006 - A projected 28% compound annual growth rate for the flip-chip packaging sector will give a big boost to vendors of lithography and etch systems, according to data from The Information Network.

Synova expands manufacturing ops to US

Mon, 7 Jul 2006
July 10, 2006 - Synova, a privately held Swiss developer of water jet-guided laser technology, is planning to open a micromachining center in Silicon Valley to tap into local growth markets including inkjet printer head MEMS, hard disk drive (HDD) and organic light emitting diodes (OLEDs).

Vacuum automation firm nabs funding from Intel, VCs

Mon, 7 Jul 2006
July 10, 2006 - BlueShift Technologies Inc., a manufacturer of a wafer-processing platform utilizing vacuum and automation technologies founded by former Brooks Automation execs, has secured a Series B round of financing totaling $12 million, to accelerate product launch activities and fuel expansion into international markets.

Air Products, UConn pushing OLED materials

Mon, 8 Aug 2006
August 7, 2006 - Air Products has signed a deal to license, develop, and market products based on technology from the U. of Connecticut that aims to help increase the lifetime of polymer light-emitting diodes (P-OLED) for displays.

Wireless chip startup adds $20M funding

Wed, 8 Aug 2006
August 30, 2006 - SiGe Semiconductor, a provider of ICs and chipscale modules, has raised $19.5 million in an expansion round of funding, to fund new product development and support expanding operations for an expanding global customer base.

Analyst: Metrology tools the first casualty in chipmaker capex cuts

Wed, 8 Aug 2006
August 30, 2006 - Semiconductor manufacturers are increasingly trying to cut expenses and spending, and the first casualty appears to be metrology equipment investments, according to a new report from The Information Network.

Surface analysis firm adds AML's spectrometry assets

Thu, 8 Aug 2006
August 24, 2006 - Evans Analytical Group LLC, Sunnyvale, CA, a provider of microanalytical surface analysis and materials characterization services, has acquired the operations and assets of Applied Microanalysis Labs Inc. (AML), an independent lab specializing in static and dynamic secondary ion mass spectrometry (SIMS) techniques, for an undisclosed amount.

Analyst: Don't use GDP to forecast the IC industry

Wed, 8 Aug 2006
August 23, 2006 - The surge in demand for consumer electronics has led to tracking broader economic trends such as consumer spending as a factor in semiconductor industry growth projections, but adopting one of the major economic benchmarks -- US gross domestic product (GDP) -- as a leading indicator for the IC industry is not the way to go, according to analyst firm Advanced Forecasting.

Synova using extra funding for global expansion

Tue, 8 Aug 2006
August 15, 2006 - Synova, a privately held Swiss developer of water jet-guided laser technology, has secured an additional $8.1 million (CHF 10 million) in funding from Swiss banks, to help fuel its push to create several micromachining centers in key high-tech regions around the world.

Scientists eyeing "electrically jumpy" molecules for electronics promise

Wed, 7 Jul 2006
July 5, 2006 - Researchers at the U. of Pennsylvania and St. Josephs U. are pursuing work on "chromophores," which linked together enable transfer of electrical charges that exceed mobility in today's best organic semiconductors by a factor of three.

Flash memory inventor, Toshiba settle landmark litigation

Thu, 7 Jul 2006
July 27, 2006 - Toshiba Corp. has agreed to settle a dispute with an ex-engineer who was instrumental in the creation of flash memory, two years after he sued them for reimbursement for his work while at the company.

Worldwide chip tool sales inch up in 2Q

Tue, 8 Aug 2006
August 15, 2006 - Worldwide sales of semiconductor manufacturing equipment rose just a fraction in 2Q06 from the previous quarter, but a big push in orders suggests significant demand for new tools, according to new data from SEMI.

SIA: 2Q chip sales up overall, micro segment slumping

Thu, 8 Aug 2006
August 3, 2006 - Worldwide sales of semiconductors slipped 0.9% in 2Q06 from the previous quarter, but were up 9% year-on-year, as the industry tries to balance strong unit demand with downward pressure on average selling prices (ASP).

Blackstone group wins $17.6B Freescale bidding war

Fri, 9 Sep 2006
September 15, 2006 - Confirming rampant rumors, Freescale Semiconductor Inc. says it has agreed to be acquired for $17.6 billion in cash by a private equity consortium consisting of The Blackstone Group, The Carlyle Group, Permira Funds, and Texas Pacific Group.

Analyst: Photomask growth slowing, marketshare gap narrowing

Thu, 9 Sep 2006
September 14, 2006 - Toppan Photomasks is seeing its lead shrink in the semiconductor photomask this year, as the overall segment adjusts to smaller growth due to design activity and a shift in capex from memory firms, according to a new report from The Information Network.

Making sense of GDP for semi industry projections

Tue, 9 Sep 2006
The surge in demand for consumer electronics has led to tracking broader economic trends such as consumer spending as one more factor influencing semiconductor demand, and thus industry growth projections. But analysts are split as to whether the industry should adopt such a broad-based economic benchmark as a leading indicator.

Report: Freescale poised for buyout

Mon, 9 Sep 2006
September 11, 2006 - Two investment firm consortiums are in a bidding war to acquire Freescale Semiconductor, with the pricetag for the former Motorola chipmaking arm soaring past $16 billion, according to a New York Times report.

Brewer takes on Dow's dielectric coating line

Thu, 9 Sep 2006
September 7, 2006 - The Dow Chemical Co. is transferring development, manufacturing, and sales and marketing for spin-on silicon containing its "Ensemble" dielectric coatings to Brewer Science, Rolla, MO, as part of efforts to focus on its core business of dielectric materials for wafer-level chip-scale packaging, integrated passives, and SiLK dielectric materials.

Micron's Appleton: Why partnerships fail

Tue, 7 Jul 2006
In a revealing keynote address at SEMICON West last week, Micron Technology chairman and CEO Steve Appleton offered a behind-the-scenes look at his company's experience in forming business partnerships, and offered some hard-won insight into why partnerships fail and what can be done to ensure their success.

ED'S THREADS: SEMInvest panel bullish on torpor

Tue, 9 Sep 2006
Last week, a SEMInvest breakfast panel in Palo Alto, CA, was a tale of two messages. Underlying business seems solid, despite the lackluster forecast for stock prices, and a high trough for capacity utilization suggests strong growth during the next uptick. But analysts also seemed to be saying that the chip industry has has matured to the point that it no longer fits into a "growth" category for investors. We've become too popular, so no one likes us anymore.

NXP ups stake in Singapore chipmaker

Thu, 9 Sep 2006
September 28, 2006 - NXP, the former chipmaking arm of Royal Philips, is buying out minority partner EDB Investments Pte. (EDBI) in Systems on Silicon Manufacturing Co. Pte. Ltd. (SSMC), their Singapore chipmaking JV with TSMC.

TAP partner Amkor joins IBM/Chartered/Samsung alliance

Tue, 9 Sep 2006
September 26, 2006 - The chipmaking manufacturing alliance led by IBM, Chartered Semiconductor Manufacturing, and Samsung Electronics Co. Ltd. has added another supplier to their roster. Amkor Technology Inc. is collaborating with the group to qualify 90nm and 65nm flip-chip packaging and design capabilities for the group's "Common Platform," and has begun 45nm qualifications for next-generation semiconductor applications.

Runner-up ends Freescale pursuit, but bidding still open?

Tue, 9 Sep 2006
September 19, 2006 - The group of private investors that swooped in with an 11th hour bid for Freescale Semiconductor Inc. reportedly has backed out of the running, after the company accepted a $17.6 million offer by a rival group -- even though the chipmaker left the door open for other buyout offers.

DFM firm adds $7.2M in funding

Wed, 10 Oct 2006
October 4, 2006 - Achor Semiconductor Inc., a developer of technology providing control of IC layout-to-silicon pattern transfer, has closed a second round of financing totaling $7.2 million, to "significantly grow R&D, applications engineering, sales and the marketing team," the company said in a statement.

Freescale reveals prior plans for Philips buyout

Wed, 10 Oct 2006
October 4, 2006 - In a new SEC filing, Freescale Semiconductor Inc. details the steps and considerations over the past few months that led up to its eventual buyout agreement with private equity firms. Among the info being revealed: the company privately mulled an acquisition of Philips Electronics' former semiconductor business long ago, as well as a possible merger with an unidentified third party.

SIA: Record chip sales in August led by DRAM, NAND flash demand

Mon, 10 Oct 2006
October 2, 2006 ¿ Worldwide sales of semiconductors to a record $20.5 billion in August, thanks to surging demand for both DRAM and NAND flash memory to meet holiday purchasing projections, according to the Semiconductor Industry Association (SIA). Chip sales surged 10.5% from the same month a year ago and 2.1% sequentially, to surpass the previous record of $20.4 billion set in Nov. 2005.

Oki debuts thin-film bonding technology for LEDs, compound devices

Thu, 9 Sep 2006
September 7, 2007 - Oki Electric Industry Co. Ltd. and Oki Printing Solutions (aka Oki Data Corp.) say they have achieved volume production of LED array chips for LED printheads using a new "epi film bonding" (EFB) technology, in which thin films are released and bonded on dissimilar materials. The technology also shows promise in manufacturing lower-cost and higher-density compound semiconductor devices.

Future of ICs seen in Belgium

Fri, 10 Oct 2006
The beautiful tree-covered campus of the Katholieke Universiteit Leuven was the backdrop for Flemish research institution IMEC's annual progress review meeting, where I and other invitees heard about the first major reorganization in its 20-year history. The re-org, partly driven by IMEC's growth to approximately 1500 permanent staff and visiting researchers, primarily aims to break down the conceptual walls between manufacturing technology development, multi-chip packaging, and circuit design.

Tegal names new chairman

Tue, 10 Oct 2006
October 31, 2006 - Tegal Corp. says it has appointed company president and CEO Thomas Mika as chairman and new board director effective immediately, and Ralph Martin and Brad Mattson have resigned.

How an IDM can maximize vertical integration advantages

Mon, 5 May 2006
Panasonic has developed strategies and business models aimed at vertically integrating its chipmaking with its appliances and electronic equipment. This approach was detailed by Michihiro Inoue, executive engineer with Matsushita Electric Industrial Co. Ltd.'s semiconductor company, in his ConFab presentation on a new IDM business model.

At a crossroads: How fabless companies can address rising costs, and avoid consolidation

Mon, 5 May 2006
With costs soaring to support nanometer-era IC production, has the fabless industry finally come the point where widespread consolidation is imminent? Or, can fabless companies continue to operate much as they have for the last 15+ years? Daniel Gitlin, VP of semiconductor technology for Xilinx, presented ideas for a new business model for fabless companies in his presentation during the first day of The ConFab in Las Vegas, NV.

SEMI: 1Q tool sales spike 20%

Thu, 5 May 2006
May 18, 2006 - Worldwide semiconductor manufacturing equipment sales jumped 20% in 1Q06 from the prior quarter, due to robust growth in North America and South Korea, although Korea's tool sales have slowed significantly from last year's levels, according to new data from SEMI.

Alliance keeps divesting with mixed-signal sale

Mon, 5 May 2006
May 1, 2006 - Alliance Semiconductor Corp. is selling its analog and mixed-signal business unit to a group of investors for $9.25 million in cash, in an effort to end "years of losses" from its semiconductor operations.

SIA: Cell phones, China boost 1Q chip growth

Mon, 5 May 2006
May 1, 2006 - Strong sales of cell phones, particularly in China, drove higher semiconductor sales in 1Q06 to a 7.3% increase from a year ago, according to the Semiconductor Industry Association (SIA).

SEMI honors Congresswoman for leadership

Wed, 5 May 2006
May 10, 2006 - SEMI has bestowed its 2006 North American Government Leadership award to Representative Anna Eshoo (D-CA), praising her strong support on issues important to SEMI members and the nation's high-tech community.

Cree, Seoul Semi expand LED pact

Tue, 5 May 2006
May 9, 2006 - Cree Inc., Durham, Nc, has signed a five-year agreement to supply LEDs to Seoul Semiconductor Co. Ltd., which will purchase at least $40 million of the products during the first five quarters of the contract.

SEMI tips details about SEMICON West backend pavilion

Mon, 5 May 2006
May 8, 2006 - SEMI has announced additional details about its backend technology-themed content pavilion at this year's SEMICON West, developed in conjunction with leading industry associations and companies including FSA, the International Electronic Manufacturing Initiative (iNEMI), the Microelectronics Packaging and Test Engineering Council (MEPTEC), and TechSearch International.

ASMI shareholder lays out demands for change

Fri, 5 May 2006
May 5, 2006 - Investment firm Mellon HBV Alternative Strategies, a 6% owner of ASM International NV, said it intends to attend the company's shareholders meeting on May 18 with its own agenda -- to come up with an endgame strategy for the company's frontend business, seen as not synergistic with its other areas of business.

Mitsubishi unveils organic FPD material

Thu, 5 May 2006
May 18, 2006 - Researchers at Mitsubishi Chemical Corp.'s Science and Technology Research Center (MCRC) and Japan's Ehime U. and Kyushu U. have developed a new organic semiconductor material, processed by low-cost wet coating methods, for use with new large flat-panel displays (FPD).

Researchers develop "fishy" way to improve OLEDs

Wed, 5 May 2006
May 17, 2006 - Scientists from the U. of Cincinnati claim to have developed a method to make organic light-emitting diodes (OLED) as much as 10x more efficient and 30x brighter -- with a little help from the humble salmon fish.

Netherlands scientists fab molecular diodes

Thu, 5 May 2006
May 4, 2006 - Philips Research and the U. of Groningen in The Netherlands say they have fabricated arrays of molecular diodes on standard substrates with "high yields," for potential use in plastic electronics requiring low-temperature or low-cost in-line manufacturing processes.

SMIC poised to ride the China wave

Thu, 5 May 2006
In a one-on-one interview at The ConFab, Charles Huang, SVP of SMIC's Shanghai operation, followed up on his Monday presentation about general strategies foundries can take to produce next-generation semiconductor technology, and outlined his company's plans to exploit the burgeoning demand for ICs in China -- now the world's largest regional IC market.

Interconnect startup scores $32M in funds

Wed, 6 Jun 2006
June 14, 2006 - NanoNexus, San Jose, CA, a developer of semiconductor interconnect technology, has secured $32 million in an oversubscribed Series A round of financing, with participation from new investor Cypress Semiconductor.

SMIC adds $600M through bank loans

Thu, 6 Jun 2006
June 8, 2006 - Fresh off a $300M infusion to support expansion at its Tianjin facilities, Chinese flagship foundry Semiconductor Manufacturing International Corp. (SMIC) said its Shanghai subsidiary has closed a five-year, $600 million secured term loan facility with a consortium of international and Chinese banks.

UDC, Mitsubishi Chem to work on inkjet-printable OLEDs

Wed, 5 May 2006
May 31, 2006 - Universal Display Corp. (UDC) and Mitsubishi Chemical Corp. have agreed to codevelop materials for phosphorescent organic light-emitting diode (OLED) displays that are processable through solution, or "wet" processing methods, such as inkjet printing.

Osram touts laser bar efficiency mark

Wed, 4 Apr 2006
April 12, 2006 - Osram Opto Semiconductors says its laser bars have achieved a efficiency record of 808nm at optical output of 120W, under a project sponsored by the German government, double the mark of conventional devices

Nano firm touts printable semiconductors

Wed, 6 Jun 2006
June 14, 2006 - Researchers at Advance Nanotech Inc. and the Center for Advanced Photonics and Electronics (CAPE) at the U. of Cambridge, UK, say they have developed novel composites made from organic polymers and nanostructured materials that provide "printable" semiconductors for low-cost inkjet print manufacturing.

DFM startup decloaks with tools, customers, design flow

Mon, 11 Nov 2006
November 27, 2006 - After three years of behind-the-curtain development and joint work with several customers and foundries, Clear Shape Technologies Inc. has officially launched with an announcement of two flagship products, and a DFM-aware IC design flow resulting from a collaboration with Taiwan foundry United Microelectronics Corp. (UMC).

AXT announces founder resignation, shrugs off China VAT changes

Mon, 11 Nov 2006
November 27, 2006 - AXT Inc., a manufacturer of compound semiconductor substrates, said that founder and CTO Morris Young would retire from his position by year's end, although he will continue as a director. The company also indicated that new export rules in China will not have a significant impact on its financials.

Veeco CEO Braun to step aside

Mon, 11 Nov 2006
November 27, 2006 - Edward Braun, chairman and CEO of Veeco Instruments Inc., plans to transition out of the CEO role during 2007. He will continue as CEO until a replacement is selected by a succession planning committee, led by independent director Roger McDaniel.

Carlyle's $5.5B offer for ASE sends Taiwan gov't scrambling

Mon, 11 Nov 2006
November 27, 2006 - In what could be the biggest acquisition ever in Taiwan, Advanced Semiconductor Engineering Inc. says it has fielded an offer from a consortium of investors led by The Carlyle Group, worth roughly $5.46 billion. Carlyle was part of the consortium of investors that bought Freescale earlier this year, and recently assisted in buyout deals for Jazz Semiconductor, AZ Electronics, and Toshiba Ceramics.

SEMI: 3Q global tool sales grow 37% to $11B

Wed, 11 Nov 2006
November 22, 2006 - Global orders for semiconductor manufacturing equipment slipped in 3Q06 but sales chugged right along, and both are enjoying growth well above a year ago, according to data compiled by SEMI and SEAJ.

Reports: Taiwan set to lower China chip investment bar

Wed, 11 Nov 2006
November 15, 2006 - After months of pressure from domestic chipmakers, the Taiwan government says that by year's end it will lower the restrictions for transferring process technologies to mainland China to 0.18-micron, from the current 0.25-micron level.

OLED films maker shifts to IP licensing

Thu, 2 Feb 2006
February 23, 2006 - Vitex Systems Inc., San Jose, CA, a developer of equipment and films used for organic light-emitting diode (OLED) displays, says it is changing its business model to focus on licensing IP for its thin-film encapsulation technology.

Chemical inspection firm adds funding

Mon, 4 Apr 2006
April 24, 2006 - Qcept Technologies Inc., Atlanta, GA, a developer of surface inspection systems for semiconductor manufacturing, has closed a follow-on Series B round of funding to help accelerate product development, sales, and marketing brand awareness.

Intel-backed storage firm nabs funding

Thu, 4 Apr 2006
April 20, 2006 - Nanochip Inc. has secured $10 million in funding from sources including Intel Capital, to support its push toward commercialization of MEMS-based data storage chips.

Spansion forms CEO office, execs step aside

Mon, 2 Feb 2006
February 6, 2006 - Spansion Inc., the former memory chip unit of AMD and Fujitsu, has formed an "Office of the CEO" to improve execution and efficiency following the company's transition to a public entity.

EOS technology targets brighter, long-lasting LEDs

Wed, 1 Jan 2006
January 25, 2005 - Edmund Optics Inc., Barrington, NJ, has unveiled an illumination delivery technology to increasing illumination brightness in LEDs as well as their lifetimes.

Japan joint foundry plans unveiled

Wed, 1 Jan 2006
January 18, 2006 - Hitachi Ltd., Toshiba Corp., and Renesas Technology Corp. have officially set up a planning company to determine the feasibility of a joint semiconductor foundry for producing system LSI products based on 65nm and below process technologies.

Taiwan-China chip tech transfers welcome, but devil's in the details

Tue, 11 Nov 2006
After months of pressure from domestic chipmakers, the Taiwan government says that by year's end it will lower the restrictions for transferring chipmaking technologies to mainland China to 0.18-micron processes. But with a lot of unanswered questions about the specifics -- and the government's history of delays and silence in previous related policy moves -- for now the decision seems to be as politically motivated as it is supportive of Taiwan's technology competitiveness.

Nanometrics beefing process control with Accent buy

Thu, 1 Jan 2006
January 26, 2006 - Nanometrics Inc., Milpitas, CA, is acquiring Accent Optical Technologies Inc., Bend, OR, in a stock deal worth approximately $80.9 million in a deal that combines Nanometrics' and Accent's process control and metrology technologies.

Firm touts GaN-on-diamond

Tue, 2 Feb 2006
February 14, 2006 - Group4 Labs LLC has developed a gallium nitride (GaN)-on-diamond semiconductor wafer, targeting high-power, high-frequency applications such as solid-state white lighting.

Nichia cedes blue LED win to worker

Mon, 2 Feb 2006
February 13, 2006 - Nichia Corp. has agreed to a 600 million yen (US $5.1 million) settlement with former employee Shuji Nakamura, effectively ending litigation concerning royalties over patented blue LED technology

FEI CEO steps down

Tue, 4 Apr 2006
April 4, 2006 - FEI Co., Hillsboro, OR, said that its president and CEO Vahe Sarkissian has resigned, and will step down from his chairman/board position prior to the company's annual shareholders meeting on May 11.

Süss, Instrument Systems building LED test tool

Thu, 3 Mar 2006
March 9, 2006 - Süss MicroTec and Instrument Systems say they've developed a new high-throughput test system for LED devices at wafer level

Showa Denko tips LED crystal growth process

Tue, 2 Feb 2007
February 20, 2007 - Showa Denko KK says it has developed a new hybrid process for making compound semiconductors based on gallium nitride (GaN) and other nitrides, using a combination of conventional metal organic chemical vapor deposition (MOCVD) and a proprietary plasma-assisted physical deposition.

Toko shifting to 0.35-micron LCD drivers

Wed, 4 Apr 2007
April 18, 2007 - Toko Inc. is shifting to 0.35-micron process technology for driver chips used in displays to adjust brightness of LEDs, investing 200-300 million yen (US $1.7-$2.5 million) to upgrade etching equipment from 0.64-micron design rules, according to the Nikkei Business Daily.

Firm wins Taiwan injunction vs. Japanese toolmaker

Fri, 4 Apr 2007
April 13, 2007 - New Wave Research Inc. says it has obtained a preliminary injunction ruling in Taiwan against Japan's Laser Solutions, prohibiting that firm from manufacturing, selling, or importing some of its equipment that allegedly infringes New Wave patents unless and until a final judgment is issued denying the patent claims.

Data's in: We're increasingly living in a materials world

Tue, 2 Feb 2007
Advanced process materials and the continued adoption march of 300mm are driving materials growth in 2007, and fabs seem to be finally learning to make smarter purchasing decisions, according to top analysts tracking the market, interviewed by WaferNEWS. Potentially troubling signs seem to be offset by mitigating factors -- yet there is still no short-term answer for stretched-to-the-limit polysilicon demand, particularly from the solar segment.

"Commoditization," competition force Applied out of beamline implant market

Tue, 2 Feb 2007
Applied says the beamline implant business won't return enough profits to justify future R&D investments, but the decision may also be just as much about the dynamics of a fiercely competitive market segment -- and possibly another implant card up the company's sleeve.

TSMC, Power Analog develop 0.25-micron BCD

Thu, 2 Feb 2007
February 8, 2007 - Foundry TSMC and Power Analog Microelectronics say they have jointly developed a bipolar-CMOS-DMOS (BCD) technology based on a 0.25-micron high-voltage process, built for high-performance power analog ICs used in audio and video displays and devices.

Mosaid pulls out of ATE with sale to Teradyne

Fri, 2 Feb 2007
February 23, 2007 - Mosaid Technologies Inc. is bowing out of the automatic test equipment (ATE) market, selling assets and IP related to its high-performance memory tester platform to Teradyne Inc. for about US $17 million.

Singapore EDB, universities promise fab jobs

Thu, 5 May 2007
May 3, 2007 - To match a flurry of local activity with new fab activity and upgrades, Singapore's Economic Development Board (EDB) says it is investing about $5.2 million for a program to prepare up to 300 undergraduate engineers each year for engineering jobs within the nation's wafer fabs.

SIA: Chip sales up 9% in "year of consumer"

Fri, 2 Feb 2007
February 2, 2007 - Global sales of semiconductors rose 8.9% to a record $247.7 billion in 2006, driven mainly by a host of consumer-oriented end products including cell phones and HDTV sets, according to final tallies by the Semiconductor Industry Association (SIA).

Farewell to industry peer

Tue, 2 Feb 2007
Our condolences to family and friends of Dr. Doug Smeaton, president and CEO of Semiconductor Insights, who passed away on Feb. 18 after a diving accident. He served as president/CEO of the firm since 1992, led its management buyout in 1994, and oversaw its expansion from just over a dozen employees to over 155.

ASE freed from breakup fee, able to pursue other buyouts

Fri, 2 Feb 2007
February 16, 2007 - Advanced Semiconductor Engineering Inc.'s chairman/CEO Jason Chang and a consortium led by the Carlyle Group that has offered to buy the packaging services firm, have agreed to drop the proposed exclusivity clause and breakup fee arrangements as a condition to the proposed deal -- essentially allowing ASE to shop for other deals without penalty.

ASE, Carlyle inch closer to deal

Fri, 2 Feb 2007
February 9, 2007 - Advanced Semiconductor Engineering Inc. has appointed financial advisors and legal counsel to help evaluate the buyout offer proposed late last year by a consortium of investors, suggesting negotiations have taken a significant step forward, according to media reports.

Spansion tops Intel in tough NOR flash market

Thu, 2 Feb 2007
February 8, 2007 - Market conditions for NOR flash memory weren't as harsh as in 2005, but it's still no picnic with ASPs still getting pummeled, especially in the mobile phone sector, according to data from iSuppli Corp.

Prominent Silicon Valley VC firm heading to China

Wed, 4 Apr 2007
April 25, 2007 - Kleiner Perkins Caufield & Byers (KPCB), a longtime fixture on the investment landscape of Silicon Valley, is acquiring Shanghai-based TDF Capital, and is committing $360 million to fund investments there, notes the San Jose Mercury News.

Study: TI, inkjet print heads top MEMS drivers ranks

Mon, 4 Apr 2007
April 23, 2007 - Texas Instruments is the number one MEMS company worldwide thanks to its DLP chips business, raking in a record-setting $905 million in sales in 2006, nearly twice as much as No. 2 ranked Hewlett-Packard, according to German research firm Wicht Technologie Consulting. The firm's updated MEMS market survey also shows that HP led a pack of firms focusing on the biggest current MEMS cash cow: inkjet print heads.

Deal's off: Investor group drops ASE bid

Tue, 4 Apr 2007
April 17, 2007 - In an abrupt about-face, the investor group seeking to snap up Taiwanese packaging services firm Advanced Semiconductor Engineering (ASE) has called off its pursuit, with both sides apparently unable to agree on a final pricetag.

Semi printing startup gains funding

Mon, 4 Apr 2007
April 16, 2007 - Semprius Inc., a company developing transfer printing technology for manufacturing semiconductor devices, has closed a $4.1 million round of Series A venture funding

AMD, memory firms shine in final 2006 chip ranks

Thu, 4 Apr 2007
April 5, 2007 - Strong sales of DRAM memory and wireless communications devices boosted several vendors in the final tally of 2006 worldwide semiconductor sales, according to new figures from Gartner Dataquest. Best growth was at Hynix and Infineon, and Intel is starting to regain ground lost during the year.

Synova, Manz Automation eye growth in PV sector

Tue, 4 Apr 2007
April 3, 2007 - Manz Automation AG, a laser process technology component supplier, and Synova SA, a privately held Swiss developer of water jet-guided laser technology, will integrate their technologies into manufacturing equipment for photovoltaics applications through a new technology licensing agreement.

SIA: March chip sales up, despite ASP/sales slumps

Mon, 4 Apr 2007
April 30, 2007 - Pricing woes continued in March across major markets in the semiconductor industry, which all saw sales decline despite higher unit shipments, according to the SIA's latest monthly data. Overall chip sales managed to inch up in March and 1Q07, but are still well below expectations.

Analyst: AMAT, Rohm/Haas still dominate CMP

Mon, 4 Apr 2007
April 30, 2007 - The market for chemical mechanical planarization (CMP) equipment and materials kept apace with the overall semiconductor equipment market in 2006, growing at about 24%, but despite a growing number of competitors two stalwarts still dominate the market, according to market research firm The Information Network.

Rite Track, TEL extend 200mm track pact

Tue, 1 Jan 2007
January 16, 2007 - Rite Track, West Chester, OH, and Japan's Tokyo Electron Ltd. have extended their existing partnership, adding the TEL Clean Track ACT 8 to the family of TEL Clean Track Mark 200mm track systems sold and serviced by Rite Track.

SEMICON WEST REPORT: High time for solar power

Tue, 7 Jul 2007
The promise of solar power, both to solve the world's energy problems as well as to fuel stellar market growth, packed SEMICON West's center stage venue Wednesday. Rhone Resch, president of the Solar Energy Industries Association, delivered a keynote outlining the opportunities for the semiconductor industry to expand the adoption of photovoltaics (PV) technology in the US.

Novellus sees bright future after waning memory capex, but no solar flare

Wed, 7 Jul 2007
In a Tuesday analyst/press event at SEMICON West, Novellus execs discussed the company's soft-yet-optimistic 2Q07 results, why copper is already king among memory firms, and why they see empty economic promises in the solar market

Sumitomo Chemical buys display-LED maker CDT

Tue, 7 Jul 2007
July 31, 2007 - Sumitomo Chemical Co. has agreed to acquire UK-based Cambridge Display Technology, a developer of polymer-organic LED (P-OLED) technologies seen as future LCD replacements in displays, for about $285 million in cash, nearly a 100% premium on CDT's current stock price.

Solar firm nabs $50M funding, secures 1.35GW supply

Mon, 7 Jul 2007
July 23, 2007 - Solaria Corp. says it has closed a $50 million Series C round of funding led by Q-Cells AG, the world's No.2 solar cell manufacturer, and has secured access to 1.35GW of power over the next 10 years to produce >2.7GW of PV modules.

NY firm rolls out nanowire deposition tools

Mon, 7 Jul 2007
July 16, 2007 - First Nano, a division of CVD Equipment Corp., has unveiled two solid source deposition systems specifically for producing semiconducting nanowires, saying that solid sources such as gallium and zinc powders are less expensive and safer than conventional metal organic sources used in metal organic vapor deposition chemical vapor deposition (MOCVD) methods for manufacturing LEDs.

Analyst: Litho sales top 2000 record

Thu, 1 Jan 2007
January 25, 2007 - The semiconductor lithography market expanded at nearly twice the rate of the rest of the equipment industry in 2006 to top $6.7 billion, finally eclipsing the $6.0 billion mark achieved back in 2000, according to a report from The Information Network.

AXT nabs $3.6M from share sale

Tue, 1 Jan 2007
January 9, 2007 - AXT Inc. says it closed a sale of an additional 862,500 shares for an overallotment option in its Dec. 19 public offering, with net proceeds of about $3.6 million.

KLA-Tencor snaps up Therma-Wave for $75M

Mon, 1 Jan 2007
January 8, 2006 - Months after being rescued by a new credit line following a "going concern" warning, Therma-Wave Inc. has found a new savior -- KLA-Tencor Corp., which has agreed to acquire the process control metrology system provider for $75 million in cash.

Plastic Logic raises $100M, eyes new site by 2008

Thu, 1 Jan 2007
January 4, 2007 - Plastic Logic, Cambridge, UK, says it has closed $100 million in equity financing, one of the largest VC deals ever in Europe, to help it build a new facility to produce commercial volumes of flexible active-matrix display modules by 2008.

Taiwan Premier reiterates China chip transfer policy

Wed, 1 Jan 2007
January 3, 2007 - The Taiwanese government's recent approval to allow domestic chipmakers to transfer more leading-edge technology to mainland China is necessary to maintain global prospects for the island's chip industry, according to statements from Premier Su Tsen-chang, reported by several media outlets. However, he also reiterated that wider policies regarding "Taiwan priority" and "Taiwan sovereignty" remain intact.

SEMATECH, IBM: We're using high-k, too

Mon, 1 Jan 2007
January 29, 2007 - Hours after Intel uncrated its 45nm transistors using high-k dielectric and metal gates for shipment later this year, SEMATECH and the IBM Common Platform Alliance both released statements indicating that they, too, are in the final stages of tinkering with the technologies.

MIT spinoff touts quantum-dot LED materials work

Fri, 1 Jan 2007
January 19, 2007 - QD Vision, a startup founded by MIT scientists in 2004 says it has received a US patent for "Stabilized Semiconductor Nanocrystals," materials that the company says can enhance the performance of quantum dots, for use in quantum dot light-emitting devices (LED) for flat displays.

UDC, Nippon Steel tout green OLED performance mark

Wed, 1 Jan 2007
January 3, 2007 - Universal Display Corp., a developer of OLED technologies and materials, and Nippon Steel Chemical Co. Ltd., a provider of super-purified OLED materials, say they have achieved a "significant enhancement" in the performance of green phosphorescent OLEDs, doubling the device's operational lifetime while maintaining existing color and efficiency characteristics.

SIA: Chip sales crept up in May

Mon, 7 Jul 2007
July 2, 2007 - After a slight downtick in April, global chip sales moved back into positive growth again in May -- but just barely, according to new data from the Semiconductor Industry Association (SIA). Worldwide semiconductor sales moved back above the $20 billion benchmark to $20.3 billion in May, a scant 1.2% growth vs. April and 2.4% above May 2006 levels.

Dow takes three-pronged approach to better R&D

Wed, 5 May 2007
Three key approaches have helped Dow Chemical launch nearly 20 products over the last decade, rethink how effective R&D is done, and generate significant improvements in cycle times. These factors include a molecular architecture approach, a focus on "speed-based development," and adoption of high-throughput technology, noted Kurt Swogger, VP of PP&C business development, in his Wednesday presentation at the ConFab in Las Vegas, NV.

High-throughput research: What we're learning from the world of drugs

Wed, 5 May 2007
A technique pioneered for drug discovery has successfully been adopted for materials research, to speed up the process for finding and characterizing new structures. Early adopters of this method are realizing "powerful, sustainable competitive advantages" in terms of R&D speed and efficiency, according to Isy Goldwasser, president/COO of Symyx Technologies, speaking to a ConFab audience on Wednesday about "Lessons Learned from Other Industries."

Path to manufacturing alliance success paved with shared intentions

Mon, 5 May 2007
Flash memory manufacturer Spansion, is the outgrowth of the successful AMD/Fujitsu joint venture, so Spansion EVP & COO, James Doran, brings solid experience to bear on the ConFab topic of how to manage successful manufacturing alliances. "Manufacturing alliances work best when each partner provides something the other partner needs, and both partners, together, benefit from the outcome," Doran said.

Trio to collaborate on e-beam tech for sub-10nm devices

Mon, 6 Jun 2007
June 4, 2007 - GenISys GmbH, JEOL Ltd., and Cornell U. are partnering to develop advanced technologies for direct-write e-beam data preparation and electron process correction technologies for nanometer-range structures.

SEMI: Fab spending, construction slowing in 2007, back up in 2008

Tue, 5 May 2007
Investments to equip semiconductor fabs will slow to just 3% growth this year, down from a 25% surge in 2006. Fab construction investments also are seen in the low single digits (4%-5%) this year -- but both areas are expected to pick up again in 2008, according to a new report from SEMI.

Cypress carving out PSRAMs to Taiwan firm

Mon, 5 May 2007
May 14, 2007 - Continuing a multistep process to slough off noncore businesses, Cypress Semiconductor is selling its PSRAM product line, including IP, photomasks, and probe card assets, to Taiwan's Elite Semiconductor Memory Technology Inc. (ESMT), who had been rumored to be interested in the business.

Applied eyes silicon savings with wafer reclaim site

Wed, 6 Jun 2007
June 27, 2007 - Targeting a cost-conservation angle for what it says is "the single largest consumable cost contributor for a fab," Applied Materials Inc. has opened a new 300mm wafer reclaim center in the Tainan Science-Based Industrial Park in Taiwan.

Luminescent adds $9M financing, swaps CEO

Thu, 6 Jun 2007
June 14, 2007 - Luminescent Technologies Inc. says it has raised $9 million in a new round of financing, led by new investor Adams Capital Management along with existing investor Sevin Rosen Funds. The funds will be used to continue driving adoption of the company's inverse lithography technology (ILT), which it is touting as an alternative to optical proximity correction (OPC), offering better pattern fidelity and broader lithography process windows.

Researchers: Polymer "grease" paving organic semi pathway

Thu, 6 Jun 2007
June 28, 2007 - Carnegie Mellon scientists say they have figured out a chemical process that makes block copolymers more effective electrical conductors, by treating the transistor's silicon dioxide base layer with a "grease"-like coating.

NIST using nanowires to make UV LEDs

Tue, 5 May 2007
May 29, 2007 - Researchers from the National Institute of Standards and Technology (NIST), with help from the U. of Maryland and Howard U., have devised a fabrication method that creates tiny ultraviolet light-emitting diodes from nanowires, and NIST says the technique is "well-suited" for scaling to commercial production.

Conexant exec named new FSA chairman

Wed, 7 Jul 2007
July 17, 2007 - Dwight Decker, non-executive chairman at Conexant Systems Inc., has been appointed chairman of the Fabless Semiconductor Association (FSA), taking over from Sanjay Jha who held the position f or nearly three years and will assume Decker's previous role as vice-chairman.

Process control firm Tevet tacks on new funding

Fri, 7 Jul 2007
July 13, 2007 - Days after appointing a new CEO and president, Israeli metrology firm Tevet Process Control Technologies Ltd. says it has received $2.75 million in new financing, including support from the VC arm of customer Intel Corp.

SAFC repositions for semi market push

Thu, 7 Jul 2007
July 5, 2007 - Fresh off its recent acquisition of UK-based Epichem Ltd., a provider of high-purity chemicals, Sigma-Aldrich is turning its focus to the silicon and compound semiconductor markets, touting its beefed-up division's product roadmap at SEMICON West. Company execs talked with WaferNEWS about the company's direction, its focus on collaboration, and how to justify value in an increasingly consumer-oriented industry where lower prices mean tighter investment evaluations.

Analyst: Photomask market rebounding in 2007

Thu, 6 Jun 2007
June 7, 2007 - The market for lithography photomasks continued to slow in 2006, reaching $2.2 billion (5.4% growth), but should pick up again in 2007 thanks to increased demand from the logic segment which uses more and higher-priced masks, according to a report from The Information Market.

Nanometrics tabs Imago's Stultz to reverse integration "challenges"

Mon, 8 Aug 2007
August 6, 2007 - Nanometrics Inc. has appointed Timothy Stultz, former president/CEO of Imago Scientific Instruments, as its new CEO, taking over for Bruce Rhine who held the spot since March and move to the position of chairman, in a culmination of moves in what the company admits has been a year of "challenges."

AMAT gives funding, process help to solid-state lighting startup

Tue, 8 Aug 2007
A new round of financing for Group IV Semiconductor Inc., an Ottawa-based startup developing silicon-based solid-state light emitters, comes with a twist: support from Applied Materials' VC arm and a promise to work together to get the company's technology to a cost-effective production model within two years.

OSRAM giving up display OLED biz

Wed, 8 Aug 2007
August 1, 2007 - OSRAM Opto Semiconductors says it will stop making its "Pictiva" organic LEDs (OLEDs) for passive matrix displays by year's end, instead focusing on its OLED activities for "market-ready" lighting solutions.

Analyst: Discretes sales outpaced ICs in 2006, keeping pace in 2007

Fri, 3 Mar 2007
March 23, 2007 - Boosted by refreshed inventories and demand for power transistors, sales of discrete semiconductor devices grew faster than IC sales in 2006 for the first time in nearly two decades, and only the second time since the 1970s, according to data from IC Insights Inc.

DISCO, Ultratech leaders named SEMI emeritus directors

Wed, 3 Mar 2007
March 21, 2007 - Kenici Sekiya, former president/CEO/chairman of DISCO Corp., and Arthur Zafiropoulo, chairman/CEO of Ultratech Inc., have been appointed emeritus members of the SEMI board of directors, in recognition of their service to SEMI and the semiconductor industry.

Report: Compound semi firms enjoying profitability

Wed, 3 Mar 2007
March 21, 2007 - Compound semiconductor firms showed mixed fortunes in 2006, but in general ended the year with positive results, including profit margins approaching 35% for gallium arsenide (GaAs) device manufacturers, and >25% for some substrate and equipment suppliers at year's end, according to data from Strategy Analytics.

Blaze DFM closes $10M Series B funding

Tue, 3 Mar 2007
March 13, 2007 - Blaze DFM, an electrical design for manufacturing (DFM) company, has closed its Series B round of funding for $10 million.

Printed silicon startup nabs $20M in funds

Wed, 9 Sep 2007
September 4, 2007 - Kovio Inc. says it has raised $19.5 million in the first closing of a Series D round of funding, to help develop and commercialize products that use its proprietary printed silicon technology.

Former Helix chief replacing Grady as Brooks' CEO

Thu, 8 Aug 2007
August 16, 2006 - Brooks Automation Inc. has appointed Robert Lepofsky, formerly chairman/CEO of Helix Technology Corp., as its next CEO following Ed Grady's scheduled retirement next month.

SEMI: 300mm fab investments undeterred by memory price slump

Wed, 8 Aug 2007
August 8, 2007 - Despite worries that plunging memory device ASPs would dent profits and ultimately capacity investment plans, it seems device manufacturers are still pouring investments into 300mm capacity, according to data from SEMI.

Xilinx CEO Roelandts stepping down

Wed, 8 Aug 2007
August 8, 2007 - Willem Roelandts, CEO/president/chairman of fabless firm Xilinx, is retiring from his executive positions, though will remain chairman of the company he has led for more than a decade.

Philips plans to sell its stake in TSMC

Fri, 3 Mar 2007
March 9, 2007 - Royal Philips Electronics NV, Europe's largest consumer electronics maker, revealed today that it plans to sell its 16.2% stake in Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) over the next few years.

SIA: Low chip prices spur demand in January

Mon, 3 Mar 2007
March 5, 2007 - Worldwide sales of semiconductors remain on pace at 9% year-on-year growth, though they were also down ~1% from December along seasonal norms, according to data from the Semiconductor Industry Association (SIA).

BlueShift shifts gears

Tue, 8 Aug 2007
BlueShift Technologies, the startup led by former Brooks Automation execs that decloaked from stealth-mode a year ago with support from Intel's VC arm, is now confidently touting its business model combining modular hardware and software, with a handful of shipments now to show for its efforts.

TDI ramps InGaN substrates for LEDs

Mon, 8 Aug 2007
August 17, 2007 - Technologies and Devices International Inc. (TDI) says it is now producing indium-gallium-nitride (InGaN) substrates for packaging GaN-based high-brightness LEDs and blue and green laser diodes, targeting volume production for early 2008.

UT-Austin researchers track "deep trap" formations

Thu, 8 Aug 2007
August 9, 2007 - Researchers at the U. of Texas/Austin say they've developed a nanoparticle technique that provides more insight into the formation of "deep traps," which are desired for memory devices built with plastic semiconductors but undesirable for things like solar cells and LEDs.

Report: PE firm Advantage wins Sanyo chip biz sale

Mon, 9 Sep 2007
September 24, 2007 - Private equity firm Advantage Partners LLP reportedly is the winner in the auction for Sanyo Electric Co.'s chipmaking operations, outbidding and outlasting up to six other potential suitors, according to various media reports.

Grace Semi hires ex-Infineon chief

Fri, 9 Sep 2007
September 21, 2007 - China's Grace Semiconductor has named Ulrich Schumacher, former CEO of German chipmaker Infineon Technologies, as its new president and CEO, as well as a director.

Analyst: Notebooks, TVs flex strength in TFT-LCD shipments

Mon, 9 Sep 2007
September 17, 2007 - AU Optronics shipped 7.6 million thin-film transistor/flat-panel displays (TFT-LCD) in August, exceeding SEC and LPL to become the first Taiwanese firm to unseat Korean suppliers, according to data from DisplaySearch.

Soitec, EC finalize NanoSmart R&D backing

Sat, 9 Sep 2007
September 14, 2007 - The European Commission has authorized 200 million euros (about US $277 million) in funding over five years to support the "NanoSmart" R&D program, which aims to develop advanced substrates for microelectronic and optoelectronic components.

SIA: September chip sales surge with PC, phone push

Mon, 10 Oct 2007
October 29, 2007 - Worldwide semiconductor sales rose ~5% for the second consecutive month to a record $22.60 billion in Sept. 2007, riding demand for PCs and cell phones as seasonal patterns build to a head, according to data from the SIA.

UMC execs acquitted in He Jian case

Mon, 10 Oct 2007
October 29, 2007 - After two years of legal battles, a district court in Hsinchu, Taiwan, has ruled that three former execs of foundry UMC broke no laws in their roles helping to set up Chinese chip company He Jian Technology (Suzhou) Co.

TI's Stork jumps ship, lands at AMAT

Thu, 10 Oct 2007
October 25, 2007 - Hans Stork, formerly CTO and SVP of silicon technology development at Texas Instruments, has left his position to take on the role of CTO and group VP of Applied Materials' silicon systems group, responsible for the company's development of semiconductor equipment technologies.

Researchers tout "fracture-induced" process for making chip lines

Thu, 9 Sep 2007
September 6, 2007 - Scientists at Princeton U. say they've figured out how make gratings on microchips with 60nm half-pitch periodic lines, using what they call a simple, low-cost technique called "fracture-induced structuring."

Synova, Manz ready combined PV "edge isolation" system

Wed, 9 Sep 2007
September 5, 2007 - Synova SA and Manz Automation say they've created a hybrid tool combining their technologies: an inline laser edge isolation system for photovoltaic manufacturing of solar cells.

Analyst: AMAT "at a crossroads" as solar biz ramps

Thu, 10 Oct 2007
October 4, 2007 - Applied Materials is on track to recognize its first revenues for thin-film solar modules by the April quarter, earlier than many analysts have been expecting, and a first customer thumbs-up could set off a "domino effect" that generates a wave of solar business and a push toward end-market grid parity, according to one analyst's report.

VACUUM: Fifty years of vacuum technology marked by evolutionary advances

Tue, 10 Oct 2007
By Stephen Ormrod, Edwards, West Sussex, United Kingdom EXECUTIVE OVERVIEW Vacuum technology is not often considered as leading semiconductor manufacturing. However, a look back at the last 50 years reveals that it has played an essential supporting role. Complex interactions between vacuum and manufacturing technologies have inspired

Silicon quantum dots promise solar cell efficiency boost

Mon, 10 Oct 2007
Efficiency is one of the biggest challenges for solar cells: most of the sun's incoming light is dissipated as heat, not converted to electricity. Yet researchers think the strange behavior of tiny particles known as quantum dots may help break the efficiency barrier, using energy that might otherwise be lost to excite additional free carriers.

Report: TSMC, Hon Hai partnering in LEDs

Tue, 11 Nov 2007
November 6, 2007 - TSMC and Hon Hai Group are reportedly teaming up in the LED industry, via a business deal involving two partners.

ZRAM, SoC firms extend VC funding

Tue, 11 Nov 2007
November 6, 2007 - A pair of industry firms have each secured at least $20M in continued VC funding, to support their respective development of memory and system-on-chip design technology.

Analyst: "Explosive" demand coming for LCD TV chips

Tue, 10 Oct 2007
October 2, 2007 - Global revenues for semiconductors used in LCD TVs should nearly quadruple from now to 2011, due to multiple factors led by a migration to digital TV sources, and availability of displays with better formfactors at a much cheaper price, according to new data from iSuppli Corp.

Report: Taiwan petro firms making PV plans

Tue, 10 Oct 2007
October 1, 2007 - A group of Taiwanese petrochemical manufacturers are setting up shop in the photovoltaic industry, though most of them are choosing the JV route rather than go it alone, notes the Taiwan Economic News.

Reports: Taiwan's AU Optronics eyeing LEDs

Fri, 12 Dec 2007
December 21, 2007 - Taiwan's top display panel supplier AU Optronics is reportedly venturing into production of epitaxy for LEDs with a new subsidiary, gaining a foothold in a market seen as key for displays, according to local reports.

Matsushita moves to boost Japan's LCD makers

Thu, 12 Dec 2007
December 20, 2007 - Matsushita Electric Industrial Co., Canon Inc., and Hitachi Ltd. are in talks to form a partnership for organic electroluminescence (OEL) flat panels, likely involving hundreds of billions of yen to establish minority stakes in Hitachi's display subsidiary, according to local media reports.

SRC, Glasgow to research compound semis for 8nm features

Thu, 12 Dec 2007
December 13, 2007 - The Semiconductor Research Corp. (SRC) and U. of Glasgow are partnering to identify "the best" p-channel material to scale MOSFET minimum feature sizes, including gate length, down to 8nm, possibly extending scaling for another 4-6 years beyond current projections.

Firm tips all-epi LED

Tue, 12 Dec 2007
December 10, 2007 - Carlsbad, CA-based light source technology manufacturer Goldeneye says it has developed an "epi-only" light-emitting diode (LED), using what it calls an "economical" thick epitaxial layer in a "novel" patent-pending fabrication process.

October 2007 Exclusive Feature #2:
Functional scaling: A new paradigm in semiconductor technology

Tue, 11 Nov 2007
By Raj Jammy, Director of Front End Processes, SEMATECH, and SST Editorial Advisory Board member

The success of semiconductor technology has been due to our choice of semiconductor material

Successful MEDEA+ collaboration to continue under CATRENE

Fri, 12 Dec 2007
This year's MEDEA+ annual forum in Budapest, Hungary (Nov. 26-28) reviewed final projects for the eight-year pan-European collaborate program for microelectronics R&D, set to expire in 2008 after overseeing three generations of CMOS technology and making the European industry a world leader in such sectors as automotive electronics, smart card technology, and image sensing.

Veeco, Dow joint program receives NIST/ATP award

Fri, 10 Oct 2004
October 1, 2004 - Veeco Instruments Inc. and The Dow Chemical Co. have received $6.6 million in funding from the US Commerce Department's National Institute of Standards and Technology Advanced Technology Program for a three-year project to develop a quantitative nano-mechanical measurement instrument.

Consortium seeks to protect Korean patents

Thu, 12 Dec 2004
December 23, 2004 - A group of South Korean semiconductor and flat-panel display manufacturers have banded together in a consortium to better manage and defend intellectual property rights.

SEMATECH North reduces defects in mask blanks at 80nm

Tue, 12 Dec 2004
December 21, 2004 - Researchers at SEMATECH North have reached a milestone in reducing deposition tool-generated defects in mask blanks used for extreme ultraviolet lithography (EUVL). They have deposited EUV multilayers with as few as one defect/mask at 80nm resolution, which translates into 0.005 defects/square centimeter.

Researchers tout III-V silicon achievement

Thu, 11 Nov 2004
November 4, 2004 - Scientists from Royal Philips Electronics and the Kavli Institute of Nanoscience at Delft U., The Netherlands, claim they've achieved the first successful integration of III-V nanowires on germanium and silicon substrates.

VLSI: Demand, utilization rates still falling

Wed, 11 Nov 2004
Worldwide demand for chip manufacturing equipment continued to slow down in October, and capacity utilization rates are inching toward slipping below the 80% mark, according to VLSI Research.

SIA: September chip sales slump, but growth stats remain steady

Tue, 11 Nov 2004
November 2, 2004 - Inventory corrections are putting a damper on a traditionally strong month for semiconductor sales, but overall growth for the year is about on target with projections, according to the latest data from the Semiconductor Industry Association (SIA).

SIA: Chip sales on track for double-digit gains

Tue, 1 Jan 2004
January 6, 2004 - Worldwide semiconductor sales continued to report solid gains in November 2003, posting growth for the ninth consecutive month and a solid double-digit increase from a year ago, according to data from the Semiconductor Industry Association (SIA).

CMP firm secures funding

Fri, 1 Jan 2004
January 16, 2004 - PsiloQuest, Orlando, FL, a manufacturer of polishing pads used in chemical mechanical planarization (CMP) processes, has closed a $7.0 million round of Series B funding.

Israeli company closes funding

Tue, 1 Jan 2004
January 6, 2004 - Elbit Vision Systems Ltd., Yoqneam, Israel, a manufacturer of optical inspection equipment, has closed a $2.3 million round of funding.

Infineon expands China operations

Thu, 1 Jan 2004
January 15, 2004 - Infineon Technologies has established a new subsidiary and IC design center in China, Infineon Technologies Xi'an Co. Ltd., focusing on applications for communications, automotive, and industrial electronics.

US, China pace worldwide chip sales growth in May

Tue, 7 Jul 2004
June 6, 2004 - Still-rising utilization rates and healthy economic growth in the US and China added up to another monthly boost in global semiconductor demand, according to data from the Semiconductor Industry Association (SIA).

AIXTRON and Genus planning to merge

Fri, 7 Jul 2004
July 2, 2004 - AIXTRON AG, Aachen, Germany, and Genus Inc., Sunnyvale, CA, announced today that they are planning to merge, according to Genus. AIXTRON plans to acquire all outstanding Genus shares in a stock-for-stock transaction.

IBM tweaks spin-on films for better mobility

Wed, 3 Mar 2004
March 17, 2004 - IBM researchers have developed a method for making thin films of semiconducting materials that allow up to 10x better mobility than typical materials made with spin-coating techniques.

Korea circling chip equipment wagons

Thu, 3 Mar 2004
March 25, 2004 - The Korean government reportedly is creating a consortium of chipmaking equipment and material suppliers, academia, research institutes, and government organizations, in an effort to boost the domestic industry's competitiveness.

SEMI: Wafer shipments still growing

Fri, 8 Aug 2004
August 27, 2004 - Tightening capacity utilization in 2Q04 led to double-digit growth in silicon revenues, according to the SEMI Silicon Manufacturers Group.

China's Lianchuang Optoelectronics to build complete LED chain

Fri, 7 Jul 2004
July 23, 2004 - Shanghai-listed Jiangxi Lianchuang Optoelectronic Science and Technology Co., Ltd., one of four national semiconductor lighting bases in China, aims at building a complete LED industrial chain covering epitaxial wafer, chip manufacture and packaging.

Infineon shuffles memory execs

Thu, 5 May 2004
May 19, 2004 -- Harald Eggers, the CEO of Infineon AG's memory products business group, will step down "of his own request" effective June 1, the company said. Thomas Seifert, head of the company's wireline communications business group, will assume the role.

Cree and Sumitomo sign contract for $160 million of LED chips

Tue, 5 May 2004
May 18, 2004 -- Sumitomo Corp. has agreed to purchase $160 million of Cree Inc.'s light emitting diode products during Cree's fiscal year ending June 2005, subject to end customer demand and other terms and conditions.

Researchers close in on MRAM

Fri, 5 May 2004
May 14, 2004 - Scientists from Japan have succeeded in running magnetoresistive random access memory (MRAM) with one-hundredth of the amount of current needed for current prototype MRAMS, seen as a key step toward commercializing the technology.

SIA: First-quarter blues turn to green lights for chip industry

Thu, 5 May 2004
May 6, 2004 - According to the latest data from the Semiconductor Industry Association (SIA), chip sales in 1Q04 -- typically a slow post-holiday period -- blew the doors off of historical norms.

Korea IT exports up, but does a "crisis" loom?

Thu, 5 May 2004
Technology exports were up more than 42% in April to $5.88 billion, but South Korea's electronics industry could be facing "huge challenges" over the next couple of years, according to an analyst.

Cree buys ATMI's GaN business

Thu, 3 Mar 2004
March 25, 2004 - Cree Inc., Durham, NC, has acquired the gallium nitride (GaN) substrate and epitaxy business of Advanced Technology Materials Inc. (ATMI), Danbury, CT, for an undisclosed cash amount.

Infineon CEO unexpectedly quits

Thu, 3 Mar 2004
March 25, 2004 - Germany's Infineon Technologies AG said that CEO Ulrich Schumacher has resigned effective immediately, replaced on an interim basis by chairman Max Dietrich Kley.

Flash inventor seeks payday

Wed, 3 Mar 2004
March 3, 2004 - Former Toshiba Corp. engineer Fujio Masuoka has filed a suit in the Tokyo District Court seeking 1 billion yen ($9.2 million) from his former employer for his contributions toward the creation of flash memory.

SIA: 2H03 chip sales streak toward the record books

Tue, 2 Feb 2004
February 3, 2004 - Worldwide semiconductor sales in 2003 topped $166 billion, besting earlier projections to achieve 18.3% growth, thanks to a big ramp-up in the second half of the year, according to data from the Semiconductor Industry Association (SIA).

SoC techniques sniff out new markets

Thu, 2 Feb 2004
February 19, 2004 - Researchers at UC-Berkeley have created a miniature detector for testing everything from agricultural toxins to DNA, built with familiar IC manufacturing techniques.

Judge to Nichia: Pay up for LEDs

Mon, 2 Feb 2004
February 2, 2004 - The Tokyo District Court has ruled that Nichia Corp. must pay a record 20 billion yen to a former employee for royalties from using a patented blue LED technology.

Applied reports 1Q profit, orders spike

Wed, 2 Feb 2004
February 18, 2004 - Applied Materials, Santa Clara, CA, reported growing earnings and revenues in 1Q04, amid strong growth in orders and customers "regained confidence" in expanding capacity.

Elpida to build mammoth DRAM fab

Wed, 6 Jun 2004
June 9, 2004 -- Elpida Memory Inc. plans to invest up to 500 billion yen over three years to construct what would be the world's largest DRAM facility.

SIA: Another month, another record for chip sales

Thu, 6 Jun 2004
June 2, 2004 - April proved true to its historical roots as a strong month for the industry, as worldwide chip sales continued to venture into territory not seen in four years, according to the latest data from the Semiconductor Industry Association (SIA).

Elpida wants Japan to tax Hynix chips

Wed, 6 Jun 2004
June 16, 2004 - Memory firm Elpida Memory Inc. and the Japanese business of Micron Technology Inc. have petitioned the Japanese government to impose countervailing duties on imports of DRAM chips from Hynix.

Luxxon awards gas delivery system contract to Praxair Chemax

Mon, 8 Aug 2004
August 23, 2004 - Praxair Chemax Semiconductor Materials Co. Ltd., a joint venture between Praxair Inc. and China Petrochemical Development Corp., has been awarded a contract by LED manufacturer, Luxxon Technology Corp.

European semiconductors strong in 1H04

Tue, 8 Aug 2004
August 3, 2004 - The first half of 2004 shows a continuous increasing growth in the European semiconductor market over the first half of 2003, according to Dow Jones and Company Inc. Worldwide year-on-year growth on a three-month moving average is now already higher than 40%.

Fabless companies keep pace with chipmakers in 2003

Fri, 4 Apr 2004
Worldwide public fabless revenue rose 16.2% to $24.2 billion in 2003, keeping pace with overall industry growth of 18% and representing 16.6% of total semiconductor industry sales, according to a recent report from the Fabless Semiconductor Association (FSA).

AIXTRON delivers additional MOCVD system to Taiwan company

Tue, 5 May 2005
May 31, 2005 - AIXTRON AG today announced the delivery of an additional Thomas Swan MOCVD system for the mass production of gallium nitride (GaN)-based ultra high brightness LED wafers and chips to Genesis Photonics Inc., Taiwan.

Holes boost light-emitting efficiency of LEDs

Fri, 5 May 2005
May 27, 2005 - A research team from Kyoto University and the Japan Science and Technology Agency has developed a way to significantly boost the efficiency of light-emitting diodes, according to Nihon Keizai Shimbun.

Study finds nanotech patent 'gold rush'

Mon, 4 Apr 2005
April 25, 2005 - More than 3800 US nanotechnology patents have been issued as of late March and another 1777 patents applications are pending, according to a study released April 21 that concludes a "gold-rush mentality" grips nanotechnology research.

China establishing foundry market foothold

Tue, 4 Apr 2005
The traditional three leaders - TSMC, UMC, and Chartered - continued to dominate the pure-play IC foundry market in 2004, according to a new ranking by IC Insights. But a wider look at the top foundries shows that hungry Chinese foundries are staking their claim in the industry, led by up-and-coming SMIC, which more than doubled its sales in 2004 to nearly $1.0 billion.

Global semiconductor sales strong in Feb. 05; chip sales up 16% from Feb. 04

Tue, 4 Apr 2005
April 5, 2005 - Worldwide microchip sales of $18.1 billion in February were 2% below the revised January sales of $18.4 billion but 15.8% higher than February 2004 sales of $15.6 billion, the Semiconductor Industry Association (SIA) reported today. SIA noted that February is normally one of the weaker months for microchip sales.

Raytheon awarded $26.9M DARPA research contract for GaN semiconductors

Tue, 4 Apr 2005
April 19, 2005 - Raytheon Co.'s Integrated Defense Systems (IDS) has been awarded a three-year, $26.9 million Defense Advanced Research Projects Agency (DARPA) contract with a potential award value of $59.4 million if all program options are exercised. The program will optimize and refine the use of gallium nitride (GaN) semiconductors for use in military and civilian systems. Raytheon is the prime contractor, having teamed with Cree Inc. on this leading edge technology.

Golden Gate Capital acquires TDK Semiconductor

Wed, 4 Apr 2005
April 13, 2005 - Golden Gate Capital has acquired TDK Semiconductor Corp. for an undisclosed sum from TDK U.S.A. Corp., a subsidiary of Japan-based TDK Corp. and regional headquarters for TDK's operations in the Americas, said the Asia Pulse Pte Ltd.

New Chinese LED maker orders Aixtron systems

Wed, 6 Jun 2005
June 22, 2005 - Aixtron AG has received an order from Hangzhou Silan Azure Optoelectronics Co. Ltd., Hangzhou, China, for an AIX 2400G3 HT and a Thomas Swan close-coupled showerhead system. Silan Azure, a new LED start-up, plans to mass produce high brightness LEDs with Aixtron and Thomas Swan thin-film growth systems.

Samsung companies to spend $44.9B on 5-year R&D plan

Wed, 11 Nov 2005
November 9, 2005 - Samsung has announced a 47 trillion (US$44.9 billion) Korean won (KRW) investment plan aimed at vastly expanding the R&D capabilities of Samsung affiliates in the areas of electronics, mechanics, and chemicals. This plan also envisions the recruitment of some 30,000 new R&D staff by 2010.

US, EU, Asia officials squash MCP tariffs

Thu, 11 Nov 2005
November 4, 2005 - Officials from the US, Europe, Japan, South Korea, and Taiwan have agreed to eliminate duties on multichip packages (MCP) beginning in January 2006, praised by industry associations as a gesture of support for fast-growing technology areas.

Researchers use GaN to extract hydrogen from water

Thu, 10 Oct 2005
October 27, 2005 - The inventor of the blue LED and a research team from Tokyo U. of Science said yesterday that they have succeeded in producing hydrogen from water through the use of gallium nitride (GaN) crystals, reported the Nikkei English News. If commercializable, this technology is expected to lead to the development of fuel cells that run on water and can be used in a wide range of products, from automobiles to computers.

Energy efficient system found in "walking" protein

Tue, 10 Oct 2005
October 11, 2005 - A protein called kinesin has a "walking" mechanism that is very energy efficient and could be used to develop future molecular-sized machines without worries about problems caused by heat, Japanese researchers said Monday, reports the Jiji Press.

Global semiconductor sales hit record $213 B in 2004

Tue, 2 Feb 2005
February 1, 2005 - Worldwide sales of semiconductors reached a record $213 billion in 2004, a year-on-year increase of 28% from the $166.4 billion recorded in 2003, the Semiconductor Industry Association (SIA) reported today. Chip sales declined in December by 3.5% sequentially to $18.4 billion from the $19.0 billion reported for November, in line with historical seasonality. December sales were 14.6% higher than in December 2003.

Global semiconductor sales surpass $19 billion in November

Mon, 1 Jan 2005
January 3, 2005 - Worldwide sales of semiconductors grew to $19.02 billion in November, an increase of 1.3% from the $18.8 billion in October, and an increase of 18% from the $16.12 billion in October 2003, the Semiconductor Industry Association (SIA) reported today.

New crystal structure promises brighter blue LEDs

Thu, 9 Sep 2005
September 22, 2005 - An international research team led by Shuji Nakamura, inventor of the blue LED, has developed gallium nitride thin films with a new type of crystal structure that opens the door to brighter light sources, said the Nikkei English News. Nakamura, who is based at the U. of California at Santa Barbara, held a news conference in Tokyo to reveal the development.

Scottish scientists able to move an object without touching

Fri, 9 Sep 2005
September 9, 2005 - Scientists at Edinburgh University have developed a way of moving an object without touching it, a development especially useful in the area of nanotechnology, reported the Ediburgh, Scotland, Evening News. The team of researchers has been able to move objects across flat surfaces and even up a slope with nothing more than a light beam.

October 2005 Exclusive Feature: MATERIALS

Multilayer barrier coatings for flexible organic electronics

Fri, 9 Sep 2005
L.L. Moro, N.M. Rutherford, X. Chu, R.J. Visser, Vitex Systems, San Jose, California

All electronic and optoelectronic devices require protection from the influences of the environment. A thin-film, transparent, and flexible moisture and gas barrier called Barix can be applied at low temperatures (e.g., <80°C). Although this type of barrier layer can be used in many applications, its attributes make it a key enabling technology for creating plastic flexible substrates...

IC utilization back above 90%, led by leading-edge tech

Fri, 12 Dec 2005
December 2, 2005 - Total utilization rates for IC production rose slightly to 90.1% in 3Q05, up from 89.1% in 2Q05 and 84.8% in 1Q05, with run rates for leading-edge technologies (<0.12 microns, and 0.12-0.16 microns) pushing to 96%-97% by the end of September, according to data from Semiconductor International Capacity Statistics (SICAS).

December 2005 Exclusive Feature: COMPOUND SEMICONDUCTORS

Using AFM to enhance MOCVD-grown OE devices

Tue, 11 Nov 2005
Doru I. Florescu, Veeco Instruments Inc.

Metal-organic chemical-vapor deposition has steadily progressed from small-scale materials research to a mass production technology, enabling such complex optoelectronic devices as laser diodes and ultrahigh-brightness light-emitting diodes...

Nano suppliers to double sales by 2010

Fri, 11 Nov 2005
November 18, 2005 - The markets for materials, tools, and equipment supporting development of nanoelectronics will more than double to $4.23 billion by 2010, led by development activities in five key areas of the electronics industry, including semiconductors and MEMS/NEMS, according to a new report from SEMI.

Toshiba, Sony develop transistor technology for 45nm ICs

Thu, 12 Dec 2005
December 22, 2005 - Toshiba Corp. and Sony Corp. have developed promising semiconductor technology that could help realize next-generation large-scale ICs with 45nm line-widths, reported the Nikkei English News. The new technology makes it easier for current to flow in transistor devices by bending silicon crystals.

Nanopowder for white LEDs yields brighter light

Thu, 12 Dec 2005
December 15, 2005 - A research group from Idemitsu Kosan Co. and Keio University has developed a way of producing YAG (yttrium aluminum garnet) phosphor in the form of a powder with particles measuring just 10nm dia., reports the Nikkei English News.

January 2005 Exclusive Feature:
FLAT PANEL DISPLAYS

Technology for deposition and patterning of OLEDs

Tue, 1 Jan 2005
By Janice K. Mahon, Min-Hao Michael Lu, Universal Display Corp., Ewing, New Jersey

VTE has been the leading technology for OLED production, but OVPD, IJP and LITI have the potential to drive display performance and manufacturing efficiencies in future device generations. For OLED technology to advance in FPD applications, its production technology must continue to achieve device performance advances and manufacturing cost reductions.

Intel founder Gordon Moore to receive Marconi Society's Lifetime Achievement Award

Thu, 3 Mar 2005
March 3, 2005 - Gordon E. Moore, the chemical engineer who in 1968 co-founded Intel, spearheading decades of technological research and developments that made the company a leader in semiconductor manufacturing and technology, has been named the Marconi Society's 2005 Lifetime Achievement recipient. The award will be presented on November 4, at the annual Marconi Society awards dinner at the Waldorf Astoria Hotel in New York City.

SIA toasts record 2004, stays modest about early '05

Tue, 2 Feb 2005
Worldwide chip sales in December dropped 3.5% sequentially to $18.4 billion, a sour ending note to an otherwise outstanding performance in 2004: a record $213 billion in sales, 28% growth from 2003 and surpassing the previous mark of $205 billion in 2000, according to the Semiconductor Industry Association (SIA).

GaN technology market is forecast to have a continuing positive outlook

Wed, 3 Mar 2005
March 30, 2005 - Having achieved a worldwide device market of $3.2 billion in 2004, gallium nitride (GaN) technology continues to be one of the biggest success stories in compound semiconductors, according to Silicon Valley-based market research firm Strategies Unlimited in its Gallium Nitride 2005 -T echnology Status, Applications, and Market Forecasts report.

Genus shareholders approve acquisition by merger with AIXTRON

Mon, 3 Mar 2005
March 14, 2005 - Genus Inc. announced today that the merger with AIXTRON AG, a provider of equipment for compound semiconductor epitaxy, has been completed pursuant to the laws of the state of California. The shareholders of Genus, at a special meeting held on March 10, approved the merger with a majority of approximately 61% of the Genus outstanding shares entitled to vote at the meeting. Of the shareholders who voted, 94% were in favor of the transaction.

Blue Whale Consortium members complete WSP for RF SoC

Tue, 8 Aug 2005
August 2, 2005 - The members of the Blue Whale Consortium have announced the successful completion of their mission to develop high-performance, cost-effective chip-size wafer-scale packaging (WSP) for system-on-chip (SoC) for handheld devices.

August 2005 Exclusive Feature: THERMAL PROCESSING

In situ measurements for reducing across-wafer CDU

Thu, 7 Jul 2005

Jason Tiffany, Infineon Technologies; Barney Cohen, SensArray Corp.

As linewidths approach 90nm node in volume production, post exposure bake (PEB) uniformity becomes a much larger component of the across-wafer critical dimension uniformity (CDU). In production, the need for PEB plate matching has led to novel solutions such as plate-specific dose offsets.

SMIC reportedly led TSMC in capacity utilization competition in 2Q

Wed, 7 Jul 2005
July 6, 2005 - In the second quarter, Semiconductor Manufacturing International Corp. (SMIC) ran its capacity at an 86% rate, higher than the 84% recorded by foundry Taiwan Semiconductor Manufacturing Co., a Merrill Lynch & Co.'s study shows, according to Taiwan Economic News.

Brooks buys Helix for $454M in stock

Tue, 7 Jul 2005
July 12, 2005 - Brooks Automation Inc., Chelmsford, MA, plans to acquire Helix Technology Corp., Mansfield, MA, for $454 million in stock, creating a company with combined trailing revenues of $720 million with strong complementary offerings in vacuum modules and systems businesses.

Cree awarded $15M defense contract to advance SiC microwave chip production

Thu, 9 Sep 2005
September 15, 2005 - Cree Inc. has been awarded a $15 million contract by the Department of Defense's Title III Program, which is administered by the Air Force Research Laboratory (AFRL). Under the new five-year contract, Cree will focus on advancing silicon carbide (SiC) microwave monolithic integrated circuit (MMIC) processing techniques to transition the production of SiC MMICs to 100mm substrates and reduce cost/chip.

TDI demonstrates InN epitaxial materials and nanostructures

Tue, 8 Aug 2005
August 23, 2005 - Technologies and Devices International Inc. (TDI) has demonstrated indium nitride (InN) epitaxial layers and structures. Novel 2-inch diameter InN-on-sapphire templates and InN/GaN heterostructures will be featured at the 6th International Conference on Nitride Semiconductors in Bremen, Germany, from August 27 through September 3.

AMRC developing nanometrology to probe chip structures at atomic level

Wed, 8 Aug 2005
August 17, 2005 - Engineers at Sematech's Advanced Materials Research Center (AMRC), Austin, TX, are investigating a nanoscale approach to metrology that will allow them to examine new semiconductor structures at the atomic level, and so prepare the way for next-generation electronics.

TDI releases semi-insulating substrates for AlGaN/GaN HEMTs

Tue, 8 Aug 2005
August 16, 2005 - Technologies and Devices International Inc. (TDI) has announced the availability of novel 3-in. dia. semi insulating substrate materials for nitride-based semiconductor devices. The group-III nitride compound semiconductor material family includes gallium nitride (GaN), aluminum nitride (AlN), and their alloys. The GaN-based market is projected at least $5B for 2007 and more than $7B for 2009.

Universal Display achieves 30 lumens/W white OLED

Wed, 8 Aug 2005
August 3, 2005 - A white OLED lighting panel with a record power efficiency of 30 lumens per watt (lm/W) has been demonstrated using Universal Display's PHOLED phosphorescent OLED technology at The International Society for Optical Engineering (SPIE) Symposia and Exhibition held in San Diego, CA.

Agilent divests semiconductor-related businesses, cuts costs

Mon, 8 Aug 2005
August 15, 2005 - Agilent Technologies Inc. has agreed to a series of actions, including divesting its semiconductor products segment for $2.66 billion, in order to ...

Feds probe Micron, Samsung

Wed, 6 Jun 2002
Memory chipmakers Micron Technology Inc., Boise ID, and Samsung Semiconductor Inc. of Seoul, Korea, have received subpoenas seeking information as part of a federal investigation into alleged anticompetitive practices, speculated to be dumping.

FSI joins SiLKnet to develop low-k cleaning

Mon, 6 Jun 2002
Chaska, MN - The surface conditioning division of FSI International Inc. has joined The Dow Chemical Co.-sponsored SiLKnet Alliance to participate in the advancement of low-k surface conditioning solutions, for use in processing SiLK semiconductor dielectric resins.

NEC semiconductor spin-off to focus on system chips

Thu, 7 Jul 2002
July 25, 2002 - Tokyo, Japan - The semiconductor business that NEC Corp. will spin off in November will focus on system chips and will be led by Kaoru Tosaka, currently head of NEC's chip business, the company said.

Intel expands European R&D operations

Tue, 5 May 2002
May 28, 2002 - Santa Clara, CA - Intel Corp. has signed an agreement to conduct microprocessor R&D at the Universitat Politecnica de Catalunya (UPC) in Barcelona, Spain.

Hitachi, others to join Sony-led stepper development project

Wed, 4 Apr 2002
April 10, 2002 - Tokyo, Japan - Hitachi Ltd., Mitsubishi Electric Corp., and Seiko Epson Corp. will participate in a joint stepper development project led by Sony Corp. and Tokyo Seimitsu Co., sources at the companies said.

Glimmer of activity seen by toolmakers; action in Asia, as well

Tue, 4 Apr 2002
It's widely acknowledged that 2002 will be essentially flat for the equipment industry, with real recovery later in the second half. But, those in the field are already seeing some early signs of life.

Bell Labs scientists image single impurity atoms in silicon

Thu, 4 Apr 2002
April 25, 2002 - Murray Hill, NJ - Scientists at Bell Labs, the research and development arm of Lucent Technologies, have found a way to peer deep inside a semiconductor and create an image of a single impurity atom in silicon. The feat - claimed by Bell Labs to be the first time that an individual impurity has been pictured in its undisturbed state within a crystal -- was achieved using a special electron microscope, and is as difficult as seeing a footprint on the moon from the Earth.

Sandia lights the way with LEDs

Thu, 4 Apr 2002
Some 25 Sandia National Laboratories researchers are working on an project that will establish the fundamental science and technology base to replace the country's primary lighting source, incandescent bulbs and fluorescent tubes, with semiconductor light-emitting diodes (LEDs) - solid state lighting.

Biggest China opportunity may be for older equipment

Tue, 5 May 2002
It may not be the big guys who benefit most from China's expanding semiconductor production. While the top tool companies focus on shipping the latest technology, smaller equipment makers and remarketers of used equipment may actually find a bigger market for their older generation products.

TSMC: Planned China fabs aimed at local market

Tue, 5 May 2002
Hsinchu, Taiwan - Taiwan Semiconductor Manufacturing Co (TSMC) said its planned manufacturing facilities in China will be aimed at the growing mainland market and not exports.

UltraRF, Hitachi Kokusai to develop RF power amplifier modules

Tue, 5 May 2002
May 14, 2002 - Sunnyvale, CA - UltraRF Inc., a wholly owned subsidiary of Cree Inc., has signed an agreement with Hitachi Kokusai Electric of Japan for the development of high power amplifier modules based on UltraRF's LDMOS-8 technology.

Ultratech CEO Zafiropoulo elected SEMI chairman

Tue, 7 Jul 2002
SEMICON West - Ultratech Stepper Inc.'s chairman and CEO Arthur Zafiropoulo, has been elected by the membership of Semiconductor Equipment and Materials International (SEMI) as chairman of the industry association's board of directors for 2002.

Acer Inc./Acer Sertek merger completed

Thu, 3 Mar 2002
March 28, 2002 -- The merger of Acer Inc. with Acer Sertek took place yesterday, completing another step forward in Acer's ongoing restructuring effort.

Gov't urged to fund university research

Wed, 3 Mar 2002
Semiconductor technology is a key driver for not only the US economy, but for the world's, as well, but the future of the industry may be in peril if the US government doesn't step up to the financial plate, according to the Semiconductor Industry Association (SIA).

Cree to open Japan office

Tue, 4 Apr 2002
April 9, 2002 - Durham, NC - Cree Inc. plans to open a Japan office in Tokyo to bring Cree's technology and engineering support closer to the Japanese customer.

Downsized industry considers staying that way

Fri, 1 Jan 2002
Suppliers of semiconductor equipment trimmed at least 20,000 workers worldwide and cut out at least $1 billion a year in overhead expenses as they aggressively sliced costs in 2001 to survive the industry's worst downturn. And this time many are thinking seriously about not building back up so much again in the next upturn, hoping leaner management and more reliance on outsourcing can make it easier to survive these cycles.

Intel names Paul Otellini president and COO

Thu, 1 Jan 2002
Jan. 17, 2002 - Santa Clara, CA - Intel Corp.'s board of directors has elected 27-year Intel veteran Paul Otellini president and COO.

Message from IEDM: CMOS needed, still viable

Wed, 1 Jan 2002
Looking for an application that will bring the IC industry out of its current slump? Consider the projected growth of broadband and in particular the microelectronics necessary to establish "residential gateways" and "simple to use home networks."

Breakthrough work in nanostructures detailed in paper

Mon, 2 Feb 2002
Feb. 11, 2002 - Cambridge, MA - Nanosys Inc. announced the publication of a landmark paper in the Feb. 7 issue of Nature, entitled "Growth of Nanowire Superlattice Structures for Nanoscale Photonics and Electronics."

US executives file $25M suit against SUMCO

Mon, 9 Sep 2002
Sept. 23, 2002 - Santa Clara, CA - Nine individuals have filed a $25 million suit in Santa Clara County California Superior Court against SUMCO Oregon Corp., a company formed from Mitsubishi Silicon America (MSA), Mitsubishi Materials Corp. (MMC), Sumitomo Metals Industries (SMI), Sumitomo Mitsubishi Silicon Corp. (SMSC), and SUMCO USA Corp.

Open architecture vs. standards: Who's on first?

Thu, 9 Sep 2002
One of the first things the new chairman of SEMI, Art Zafiropoulo - also chairman, president, and CEO of Ultratech Stepper - says he is going to do is reduce the time it takes to get standards to the marketplace. He also wants to prioritize standards work - with safety being the highest priority - and put more focus on what's really important, not pet projects.

DuPont Displays, UDC form alliance to develop displays

Wed, 12 Dec 2002
Dec. 11, 2002 - Wilmington, DE, and Ewing, NJ - DuPont Displays, a business unit of DuPont and a developer and manufacturer of polymer OLED displays, together with Universal Display Corp. (UDC), an innovator of OLED technologies, have signed a joint development agreement to create a new generation of soluble OLED materials and technology.

CoorsTek agrees to $220 million buyout

Mon, 12 Dec 2002
Dec. 23, 2002 - Golden, CO - CoorsTek Inc., a semiconductor equipment maker, would be acquired for more than $220 million by a private investment group led by top CoorsTek management and other members of the Coors brewing family.

Global chip sales growth slows in March

Mon, 4 Apr 2003
April 28, 2003 - Amsterdam, the Netherlands - Global semiconductor sales growth slowed to 13 percent year on year in March from 17.9 percent in February, according to a report by Reuters' European technology correspondent Lucas van Grinsven. The industry has been hit by oversupply and pricing pressure, industry associations said.

Irish chip IP company gets funding

Thu, 6 Jun 2003
June 19, 2003 - Belfast, Ireland - Amphion, a provider of semiconductor IP cores, has closed a $5 million round of funding led by ACT Venture Capital, the largets VC investor in Ireland, and Invest Northern Ireland Enterprise Equity.

Kyma gets more funding

Mon, 6 Jun 2003
June 11, 2003 - Kyma Technologies, Research Triangle Park, NC, a supplier of GaN substrates, has obtained $4 million in new venture capital funding, with which it plans to add staff and build a new fab space in North Carolina. Digital Power Capital and Siemens Venture Capital co-led the funding, which was also supported by former Kyma investors.

Air Products signs agreement with Shanghai LanBao

Tue, 4 Apr 2003
April 29, 2003 - Lehigh Valley, PA - Air Products and Chemicals Inc. said that it has signed an exclusive multiyear agreement to supply its ultrahigh purity White Ammonia product, as well as other electronic specialty gases, to Shanghai LanBao Photoelectric Materials Co. Ltd. of China.

Applied Materials consolidates facilities, cuts 2,000 jobs

Mon, 3 Mar 2003
March 17, 2003 - Santa Clara, CA - Applied Materials Inc., the world's largest supplier of wafer fabrication solutions to the semiconductor industry, has unveiled a plan to align the company's cost structure with current business conditions. The realignment plan has two major elements: restructuring actions -- including consolidation of facilities and a reduction in work force of some 2,000 employees; and second, focused program management to provide additional cost savings.

Tahoe RF Semiconductor launched

Thu, 1 Jan 2003
Jan. 9, 2003 - Auburn, CA - A team of engineers formerly with IBM Microelectronics' wireless division have formed a new radio and analog IC design company, Tahoe RF Semiconductor Inc.

Cree stakes new GaN claim

Mon, 12 Dec 2003
December 15, 2003 - Cree Inc., Durham, NC, says it has developed new gallium nitride power transistors with much higher power densities than previously achieved.

Fabless startup wins business

Mon, 12 Dec 2003
December 15, 2003 - Kenet Inc., Reading, MA, a fabless semiconductor company for mixed-signal devices led by industry veteran John Fan, has won a contract with the Defense Advanced Research Projects Agency (DARPA).

Isonics gains wafer patent

Fri, 12 Dec 2003
December 12, 2003 - Isonics Corp., Golden, CO, has been awarded a US patent for its method of lowering the temperature of semiconductor devices built onto the wafer surface.

AMD unveils chip plant plans

Thu, 12 Dec 2003
November 21, 2003 - It's official: AMD's new $2.4 billion 300mm fab will be built in Dresden, Germany, the first new chipmaking facility in Europe in years.

LSI to sell storage business

Thu, 12 Dec 2003
November 17, 2003 - LSI Logic, Milpitas, CA, plans to spin its storage systems business into an independent storage systems company, separate from its semiconductor business.

Veeco buys Emcore's MOCVD business

Fri, 11 Nov 2003
November 3, 2003 - Filling out its compound-semiconductor epitaxial deposition offerings, Veeco Instruments, Woodbury, NY, has purchased Emcore Corp.'s, Somerset, NJ, TurboDisc metal-organic chemical vapor deposition (MOCVD) business for $60 million

Writing another chapter for display technologies

Mon, 12 Dec 2003
December 29, 2003 - Technology dreamworks and Xerox subsidiary PARC has produced another brainchild: a prototype flat-panel display circuit, using a modified inkjet printer and a new polymer-based semiconductor "ink."

Intel announces high-k/metal gate breakthrough

Thu, 12 Dec 2003
Intel Corp. has presented results of its high-k/metal gate transistor development aimed at reducing current leakage as device dimensions shrink and transistor gate dielectrics become thinner.

SIA: Chip sales continue double-digit growth

Thu, 12 Dec 2003
December 1, 2003 - Worldwide semiconductor sales continued to rebound in October, posting the eighth consecutive monthly increase and largest month-to-month gains since 1990, according to data from the Semiconductor Industry Association (SIA).

Global chip sales increase in May, says SIA

Thu, 7 Jul 2003
July 3, 2003 - Worldwide sales of semiconductors totaled $12.50 billion in May, up 2.0% from $12.26 million in revenues in April 2003 and a 9.9% increase from May 2002 revenue of $11.38 billion, according to data from the Semiconductor Industry Association (SIA). The total revenue is the highest in four months. The April figures were revised upwards from SIA's earlier estimates of $12.14 billion, which would have been essentially flat growth from March to April.

Matheson forms new specialty unit

Thu, 7 Jul 2003
July 9, 2003 - Parsippany, NJ - Matheson Tri-Gas Inc. has formed a new electronic and specialty gas equipment team to serve customers requiring high-purity gas delivery systems. The team will be led by John Smickenbecker, director of ESG equipment sales, and be supported by the company's equipment technology center in Montgomeryville, PA.

RF design company closes funding

Thu, 9 Sep 2003
September 22, 2003 - RFco Inc., a Los Gatos, CA, fabless semiconductor company, has closed a $16.5 million Series A round of funding, led by a trio of venture capital firms.

eSilicon secures funding

Mon, 9 Sep 2003
September 19, 2003 - eSilicon Corp., Sunnyvale, CA, has secured $21 million in series E funding, led by Crescendo Ventures and RWI Group.

Nantero wins funding

Thu, 9 Sep 2003
September 9, 2003 - Nantero, Woburn, MA, a developer of nonvolatile random access memory (NRAM) chips using nanotechnology, has completed a second round of investments totaling $10.5 million.

Korean semi exports up

Fri, 10 Oct 2003
October 10, 2003 - South Korean exports rose in September thanks to continued growth in semiconductor exports, according to the Ministry of Commerce, Industry, and Energy.

K&S names board member

Thu, 10 Oct 2003
October 16, 2003 - Kulicke & Soffa, Willow Grove, PA, has named Brian Bachman, former CEO of Axcelis Technologies, to its board of directors.

IBM opts for CVD low-k solution

Fri, 9 Sep 2003
September 18, 2003 - Although IBM Microelectronics had previously demonstrated "manufacturing success" using an enhanced version of Dow Chemical's SiLK inter-level low-k dielectric resin, the company has decided to opt for a CVD low-k approach to satisfy the wishes of customers.

Chartered takes wraps off 90nm

Fri, 9 Sep 2003
September 18, 2003 - Singapore's Chartered Semiconductor Manufacturing has taken the wraps off its "NanoAccess" 90nm SoC process technology, based on its development work with IBM.

Elixent raises $10 million in funds

Thu, 7 Jul 2003
July 9, 2003 - Semiconductor IP company Elixent, Bristol, UK, has closed a second round of funding worth $10 million, led by GIMV and NIF Ventures as well as founding investor 3i. The funds will be used to expand the company's engineering group and accelerate the international rollout of its products. The startup raised $14 million in its first round of funding in 2001.

Varian, Tegal tops in wafer-processing rankings

Fri, 7 Jul 2003
July 18, 2003 - Customers of both large and small wafer-processing companies gave kudos to a wide range of vendors, but overall rankings were lower than in previous years, according to a new report from VLSI. The ratings are calculated based on customer surveys in which suppliers were ranked on a ten-point scale, covering thirteen categories describing equipment performance and customer service.

Isonics finds investors

Mon, 8 Aug 2003
August 15, 2003 - Isonics Corp., Golden, CO, a developer of isotopically-engineered semiconductor materials, says it has received a commitment for $8 million in equity financing from Quivira Venture Partners, led by a former Isonics director.

Japan execs: Forget chips, embrace nano

Fri, 10 Oct 2003
A new survey of more than 100 Japanese CTOs indicates that most favor a shift in technology strategy away from semiconductors and liquid crystals toward nanotechnology, suggesting that Japanese companies may be feeling the heat from South Korean and Taiwanese chipmakers.

Nichia wins Taiwan LED dispute

Thu, 10 Oct 2003
September 25, 2003 - Taiwan's Nichia Corp. has won a patent dispute against rival Epistar Corp. concerning blue LED technology.

Honeywell names execs

Fri, 10 Oct 2003
October 22, 2003 - Honeywell Electronic Materials (HEM), Sunnyvale, CA, has appointed three new executives.

SIA revises market outlook

Thu, 6 Jun 2003
June 11, 2003 - Palo Alto, CA - The worldwide semiconductor market should grow 10.1% this year, according to the Semiconductor Industry Association (SIA), and reported by Dow Jones. This reflects a more modest expansion than the organization had projected last November.

Global chip sales total $12.1 billion in April says SIA

Mon, 6 Jun 2003
May 30, 2003 - San Jose, CA - Worldwide sales of semiconductors totaled $12.1 billion in April, 2003, sequentially unchanged from the $12.1 billion in revenue reported in March of 2003, and a 9.7% increase from April 2002 revenue of $11.3 billion, the Semiconductor Industry Association (SIA) reported today.

Gartner: Asia extends chipmaking lead

Mon, 6 Jun 2003
June 16, 2003 - Asian foundries are extending their lead in the global chipmaking industry, according to a recent report from Gartner Inc., Stamford, CT.

Aixtron, Lumileds ink LED agreement

Fri, 8 Aug 2003
August 19, 2003 - German semiconductor equipment maker Aixtron has signed a multi-year agreement to provide LED production equipment to Lumileds, a JV between Agilent and Philips, The Netherlands.

Cree, APT sign die pact

Thu, 8 Aug 2003
August 5, 2003 - Advanced Power Technology, Bend, OR, has signed a deal to repackage and sell the SiC Zero Recovery Schottky diode die from Cree Inc., Durham, NC. APT will add its MOSFETs and IGBTs to the diodes in various combinations, including boost and buck configurations and power modules. Volume production is slated for 4Q03.

Amkor, Triquint join for flip-chip

Thu, 9 Sep 2003
September 9, 2003 - Triquint Semiconductor, Hillsboro, Oregon, and Amkor Technology, Chandler, AZ, are collaborating on a low-cost low-cost flip-chip assembly process for gallium arsenide (GaAs) semiconductors.

Sapphire substrates for LEDs

Thu, 9 Sep 2003
September 9, 2003 - Japanese company Shoko says it will sell sapphire substrates used in blue and white LEDs in Japan and Taiwan.

Kyma develops 2-inch GaN epitaxial substrate

Mon, 11 Nov 2000
Research Triangle Park, North Carolina--Nov. 6, 2000--Kyma Technologies, a developer and supplier of nitride substrates, has developed a 2-inch-diameter, 50-micron-thick epitaxial gallium nitride (GaN) layer on a sapphire wafer, to be used as the core technology for a variety of applications within the semiconductor, optoelectronic, and communications industries.

Cree and Rohm form alliance

Mon, 12 Dec 2000
Durham, North Carolina--Cree, Inc., a developer and manufacturer of semiconductor materials and devices made from silicon carbide (SiC), announced today that it has formed an alliance with Rohm Co. Ltd., a Japanese manufacturer of ICs and other electronic components.

Product -- April 18, 2000 -- Numerical Adds Browser Access to Virtual Stepper

Tue, 4 Apr 2000
The growing complexity of their products are requiring semiconductor manufacturers to share development costs and other resources have led companies to consider Internet-enabled tools, such as the second iteration of Numeritech's Virtual Stepper System.

Technology -- April 11, 2000 -- IBM Outlines First-generation Copper and Low-k Products.

Tue, 4 Apr 2000
IBM announced it will use Dow Chemical's SiLK dielectric resin to integrate copper metal in the company's next line of CMOS 9S process technology. Using spin-on equipment, the company says the low-k resin will become part of its recipe for next-generation products.

Technology -- March 21, 2000 -- Dow Chemical Outlines Capabilities of SiLK, Low-k Solution

Wed, 3 Mar 2000
Dow Chemical officials say they have created devices with as many as six layers of its low-k dielectric resin, dubbed SiLK, without the buckling plaguing many similar materials.

Novellus: Q4 revenues make record at $192M

Wed, 1 Jan 2000
Logging another quarter of strong growth, Novellus Systems, San Jose, CA, said its fourth quarter revenues climbed 81% over year-ago levels to a record $191.7 million. Net income in the quarter totaled $33 million (27 cents/share), up 305% from the end of 1998.

Cree Claims Record Power Performance at 10 GHz

Mon, 8 Aug 2000
DURHAM, N.C.--Aug. 21, 2000--Claiming an industry first, Cree Inc. recently demonstrated a 10-GHz RF power performance from a gallium nitride (GaN) High Electron Mobility Transistor (HEMT).

FSI, Dow Chemical to Develop Dual-Damascene Processes

Fri, 7 Jul 2000
MINNEAPOLIS, Minn.--July 6, 2000--FSI and Dow Chemical Company have announced an agreement to jointly develop dual-damascene processes using Dow?s dielectric SiLK resins.

New Taiwan Government Delays S3-VIA Graphics Joint Venture

Fri, 7 Jul 2000
SANTA CLARA, Calif.--July 6, 2000--S3 Inc. and VIA Technologies announced that recent changes in Taiwan's government have led to delays in regulatory approval of S3 and VIA's graphics joint venture.

Hynix considers selling factory

Tue, 10 Oct 2001
October 9, 2001 - Seoul, Korea - Hynix Semiconductor Inc., said it is considering selling one of its semiconductor facilities as part of its restructuring efforts, but denied reports that it is in advanced talks with a Chinese consortium, according to the Korea Herald.

USDC seeks FPD RFPs

Tue, 10 Oct 2001
The United States Display Consortium (USDC), aimed at developing the flat panel display (FPD) supply chain, is issuing four new Requests for Proposals (RFPs) and an Open Solicitation for RFPs.

OLED displays gain on LCDs

Tue, 10 Oct 2001
An organic light emitting diode (OLED) display technology has been developed that exhibits up to 16 million colors. Based on Kodak patents, the full-color active matrix OLED developed by eMagin Corp., Hopewell Junction, NY, contains more than 1.5 million individually addressable picture elements.

UMass team unveils new deposition method

Tue, 10 Oct 2001
A research team led by U. of Massachusetts Chemical Engineer James Watkins has developed a new method of depositing copper films within tiny channels etched in silicon wafers.

Japanese chipmaking equipment sale slump 74.7%

Wed, 8 Aug 2001
August 15, 2001 - Tokyo, Japan - Global sales of Japanese semiconductor manufacturing equipment totaled 57.85 billion yen in June, down 74.7% from the year-earlier level, the Semiconductor Equipment Association of Japan said Tuesday.

Osram acquires all Infineon shares in joint venture

Tue, 8 Aug 2001
Aug. 14, 2001 - Munich, Germany - Osram GmbH will acquire all Infineon Technologies AG shares in their joint venture, Osram Opto Semiconductors GmbH & Co. OHG, at a cost of Euro 565 million.

SMIC raises $1.09B in first-round sales of shares

Fri, 11 Nov 2001
Nov. 16, 2001 - Shanghai, China - Semiconductor Manufacturing International Corp. (SMIC) has successfully secured more than $1 billion of capital through the sale of Series A Preferred Shares earlier this fall.

DuPont Photomasks founder Kenneth Rygler to resign

Thu, 11 Nov 2001
November 1, 2001 - Round Rock, TX - DuPont Photomasks Inc. founder Kenneth Rygler is resigning to pursue personal and other interests. Rygler, exec. VP of worldwide marketing and strategic planning at DuPont, will serve as a consultant to the company.

International SEMATECH to supply wafers to SiLKnet alliance

Fri, 11 Nov 2001
November 16, 2001 - Midland, MI - International SEMATECH will supply process wafers to the SiLKnet Alliance, an industrywide collaboration of materials and equipment suppliers working toward integrated low-k process development.

ON Semiconductor unveils tiny eight-pin devices

Mon, 9 Sep 2001
September 17, 2001 - Phoenix, AZ - Adding to its emerging MiniGate portfolio, ON Semiconductor today unveiled six high-performance triple-gate devices in tiny Ultra-Small-8 (US8) packages drivers/buffers for computing, networking and portable applications including LEDs.

HPL Technologies names Mark Milligan VP and GM

Wed, 12 Dec 2001
Dec. 12, 2001 - San Jose, CA - Mark Milligan has joined HPL Technologies Inc., a provider of yield optimization solutions for manufacturers and fabless design companies, as VP and GM for a new division that will increase the company's focus on addressing manufacturing issues during the design process. In his new role, Milligan will be responsible for directing the division formation, including R&D, marketing, and sales.

Hynix prefers cash injection from Micron

Thu, 12 Dec 2001
Dec. 6, 2001 - Seoul, South Korea - Hynix Semiconductor Inc. said it wants US chipmaker Micron Technology Inc. to inject cash into the company under a proposed alliance aimed at easing the global glut of computer memory chips.

Court orders Samsung execs to pay $74.5M for mismanagement

Fri, 12 Dec 2001
Dec. 28, 2001 - Seoul, Korea - In a landmark ruling earlier this week, a provincial court ordered 10 executives of Samsung Electronics Co. to pay the electronics manufacturer 97.8 billion won ($74.5 million) for mismanagement.

Korean consortium plans to buy Hynix non-memory lines

Mon, 12 Dec 2001
Dec 17, 2001 - Seoul, Korea - A South Korean consortium led by chip design firm Aralion Inc. said on Monday it expected to sign a deal to buy Hynix Semiconductor's non-memory chip lines next March.

Researchers attempt to 'unmask' lithography

Thu, 1 Jan 2001
Berkeley, California--Today's chips, built from more than a dozen layers of material etched with electronic circuits, each need a photomask to project the circuit pattern--an expensive and time-consuming process. An effort to eliminate photomasks from the lithography process has led researchers at the U.S. Department of Energy's Ernest Orlando Lawrence Berkeley National Laboratory (LBNL) to investigate ion beam technology and a dot-matrix lithography technique as a possible solution.

Peregrine gains investors

Wed, 1 Jan 2001
San Diego, California--Peregrine Semiconductor Corp. today announced that it has raised a total of $37.5 million in its Series G Preferred financing.

Solidum receives backing to expand packet classification product family

Tue, 1 Jan 2001
Ottawa, Canada / Scotts Valley, California--Solidum Systems Corp., a fabless semiconductor company and leader in wirespeed packet processing technology, today announced that it has secured US$16.5 million in financing. The financing will help Solidum expand its packet classification product family, grow the engineering and operations team, and also provide working capital to establish volume revenue streams from key customers.

DC/DC boost converter for driving white LEDs now available from Micrel

Tue, 2 Feb 2001
February 27, 2001--San Jose, California--A super-high efficiency DC/DC boost converter for driving white LEDs and biasing Notebook PC LCD panels is now available from Micrel Semiconductor, an industry leader in analog and power management ICs.

Analyst sees slow start, recovery to SEMIndex in 2001

Mon, 1 Jan 2001
San Jose, California--The SEMIndex, a web-based global equity index of 68 manufacturers of semiconductor equipment and materials, produced for Semiconductor Equipment and Materials International (SEMI) by Beacon Hill Partners, Inc., closed the fourth quarter of 2000 on December 31 at 217.06--down 23.35% from the previous year period, but up 117% from its inception at 100 on January 4, 1999.

New York launches high-tech development initiative

Fri, 1 Jan 2001
Albany, New York--The Governor of New York, George E. Pataki, recently kicked off a $1 billion, high-tech initiative to fund advanced university R&D and economic outreach. As a result, ground will be broken early this year at the University of Albany on a state-of-the-art microchip prototyping laboratory--Center of Excellence in Nanoelectronics at Albany--capable of processing 300mm wafers.

2000 was a banner year for the semiconductor industry, SIA reports

Mon, 2 Feb 2001
San Jose, California--Worldwide semiconductor sales reached $17.9 billion in December 2000, the Semiconductor Industry Association (SIA) today reported, with year-end industry sales of $204 billion setting a new industry record. The SIA forecast for 2001 calls for 22% year-over-year growth, although the association no longer expects that projection to be achieved due to the inventory overhang going into 2001.

Teradyne rolls out 'Optima 7350 Post-Solder Bottomside AOI System'

Wed, 2 Feb 2001
February 28, 2001--Anaheim, California--Teradyne Inc. has introduced its new Optima 7350 Post-Solder Bottomside AOI System. As the newest member of the company's high-performance Optima 7000 series, the Optima 7350 is the industry's only bottomside automated inspection system for full solder defect coverage.

Agilent, Synopsis launch initiative to reduce cost of testing semiconductor devices

Tue, 3 Mar 2001
March 13, 2001--Munich, Germany--Responding to escalating concerns that the cost of testing complex semiconductor devices may soon exceed the cost of fabrication, Synopsys, Inc. and Agilent Technologies Inc. today announced an agreement targeted at reducing the overall cost of test by bridging the gap between electronic design automation (EDA) test software and automated test equipment (ATE) hardware.

IBM joins EUV LLC to support development of EUV lithography technology

Mon, 3 Mar 2001
March 12, 2001--Santa Clara, California--IBM Corp. has joined the Extreme Ultra Violet (EUV) LLC industry consortium to support the development of EUV lithography technology. EUV lithography technology is being developed to allow semiconductor manufacturers to etch circuit lines smaller than 0.1-micron, creating future generations of more powerful microprocessors and higher density memory chips.

No clear winner in battle between DDR DRAM and RDRAM this year, analysts predict

Thu, 3 Mar 2001
March 8, 2001--San Jose, California--The critical battle for the future of DRAM technology is being waged in the PC memory arena between DDR DRAM and RDRAM, but San Jose, CA-based market research firm Gartner Dataquest cautions not to expect to see an end to the dispute this year.

RosettaNet extends global e-business outlook to China's leading high-tech companies

Wed, 3 Mar 2001
March 7, 2001--Santa Ana, California--A delegation led by RosettaNet CEO Jennifer Hamilton this week visited Beijing, China, to augment the organization's ongoing dialogue and activities in the region.

Dow to cut 4,500 jobs

Tue, 5 May 2001
May 1, 2001 - Detroit, Michigan - Dow Chemical plans to cut 4,500 jobs (8% of its work force), which is double its earlier job-reduction estimate. The company said it plans to cut annual costs by $1.1 billion by early 2003, more than double its $500 million projection when the takeover of Union Carbide was announced in 1999.

New benchmark in 300mm wafer coating, says DNS

Fri, 4 Apr 2001
April 27, 2001 - Kyoto, Japan - Dainippon Screen Mfg. Co. Ltd. (DNS) has demonstrated uniform 300mm wafer coatings using less than 1 milliliter of Dow Chemical's SiLK semiconductor dielectric resin.

Ibis elects Yuri Erokhin as VP of wafer technology

Thu, 8 Aug 2001
August 23, 2001 - Danvers, MA - Ibis Technology Corp. has elected Yuri Erokhin as its VP of wafer technology. Ibis also announced the resignations of two directors, Geoffrey Ryding and Peter Rose, who resigned to pursue other business opportunities together.

TranSwitch, Cree, Elantec top speediest list

Fri, 8 Aug 2001
Aug. 10, 2001 -- Three semi-related firms have made the top 10 tier of Fortune Small Business' 100 fastest growing small company list.

Cree announces issuance of patent on pendeoepitaxy process

Wed, 8 Aug 2001
August 8, 2001 - Durham, NC - Cree Inc. has been issued US patent no. 6,265,289 entitled ``Methods of Fabricating Gallium Nitride (GaN) semiconductor Layers by Lateral Growth from Sidewalls into Trenches, and Gallium Nitride Semiconductor Structures Fabricated Thereby.''

Dow Corning, Axcelis look to future with ultra-low-k process

Tue, 6 Jun 2001
June 6, 2001 - Beverly, MA, and Midland, MI - Axcelis Technologies Inc. and Dow Corning Corp. are working together to develop a novel process that enables use of porous ultra-low-k dielectric materials in next-generation semiconductor manufacturing.

CoorsTek cuts 960 jobs this year

Fri, 6 Jun 2001
June 29, 2001 - Golden, CO - CoorsTek has laid off 960 employees this year, including 333 in Colorado. Most recently, the company cut 91 jobs at its Grand Junction office, said spokeswoman Terry Terens.

Okmetic, UniSil buy epi plants

Fri, 8 Aug 1999
After several months of negotiations, Finnish wafer maker Okmetic has purchased Crysteco's epitaxial wafer plant in Allen, TX, for an undisclosed sum.

Thermoelectric Platform

Tue, 1 Jan 2008
The ultra-high packing fraction (UPF) OptoCooler module addresses the latest cooling and temperature control requirements for optoelectronics, electronics, medical, military and aerospace applications.

Braggone Receives Multimillion Dollar Funding to Commercialize Nano-Engineered Polymers

Fri, 1 Jan 2008
(January 04, 2008) OULU, Finland — Braggone, an optoelectronics materials company, has received multimillion dollar funding from TEKES (The National Technology Agency of Finland) to commercialize their polymer materials. Semiconductor devices and flat panel displays are primary targets.

Princeton Technology Selects Verigy V93000 SOC Test Platform

Tue, 1 Jan 2008
(January 15, 2008) CUPERTINO, CA — Verigy has announced that Princeton Technology Corp. (PTC), a fabless IC design company in Taiwan's consumer IC market, has selected the Verigy V93000 pin scale test solution as its next-generation SOC testing platform.

SUSS Installs First 300-mm WLR Test System

Tue, 4 Apr 2008
(April 8, 2008) Yokohama, JAPAN — SUSS MicroTec AG announced the first installation of its PM300WLR, said to be the world's first dedicated 300-mm wafer-level reliability (WLR) test system, at a leading Japanese semiconductor device manufacturer. According to the company, it will be used for testing the reliability of current and next-generation devices.

ESI Receives Multi-system Order from Hangzhou Silan Azure Corp.

Tue, 4 Apr 2008
(April 8, 2008) San Jose, CA — ESI announced that its New Wave Research (NWR) Division has received a multiple system order from Hangzhou Silan Azure Corp., Ltd. for its AccuScribe 2112 laser-scribing equipment. China-based Silan Azure

SEMICON Singapore Targets Assembly, Test and Packaging

Tue, 4 Apr 2008
(April 15, 2008) SINGAPORE — SEMI is gearing up for the SEMICON Singapore, which takes place May 5-7, 2008 at the Suntec Singapore International Convention and Exhibition Centre. Southeast Asia is reportedly the leading region for test, assembly and packaging (TAP), so the event is expected to draw global semiconductor manufacturing executives from that sector of the industry.

University of Michigan Team Receives Grant to Research Electronics Heat Management

Wed, 4 Apr 2008
(April 30, 2008) Ann Arbor MI — A team led by a University of Michigan mechanical engineer has received a five-year, $6.8-million grant from the Air Force to examine heat management issues in the spectrum of electronic devices from jet engines to personal electronics to nano-scale transistors.

Automatic Multi-chip Bonder

Mon, 4 Apr 2008
ASM Pacific Technology's latest generation large-area chip bonder, the MCM12, is said to address the growing market for MCM, SIP, and hybrid applications. It is a fully automatic multiple die, SMD, and flip chip bonding system with up to 300-mm wafer handling capability. Direct die, flip chip, stack die, and SMD bonding can all be integrated into this single platform tool.

China Packaging Society President to be Speaker at GBC Conference

Fri, 2 Feb 2008
(February 29, 2008) Scottsdale, AZ — The IMAPS Global Business Council (GBC) is pleased to announce that Bi Keyun, PhD and president of the China Electronic Packaging Society, will head a delegation from China and will speak at GBC Spring Conference in Scottsdale, AZ, on March 16 and 17, 2008.

Stand-alone Break Processor

Mon, 3 Mar 2008
The model DB-6100 stand-alone break processor speeds up sapphire wafer separation. Increasing quantities and continuous price pressure, resulting in cost reduction programs, is driving the die size of photonics components, especially LEDs, further down. Efficient die separation with very small compound semiconductor devices is becoming therefore more of an issue.

IPC, Jisso Sponsor Advanced Interconnect Seminar

Thu, 5 May 2008
(May 1, 2008) Bannockburn, IL. — IPC — and the Jisso International Council (JIC) are sponsoring a technical seminar, "Implementing Advanced Interconnect Technology Solutions," May 21

SMTA's 3D/SiP Symposium Promotes Industry-wide Collaboration

Tue, 5 May 2008
Last week's 3D/SiP Symposium hosted by SMTA, and co-sponsored by Advanced Packaging magazine, turned out to be an intimate gathering of approximately 55 attendees representing not only the U.S., but Canada, France, Japan, Taiwan, United Kingdom, Austria and the Republic of Korea.

Hitting the Fast Track

Mon, 5 May 2008
by Fran

Palomar Reveals Key Assembly Processes for Brighter LEDS

Tue, 5 May 2008
(May 20, 2008) Carlesbad, CA — LED lighting is expected to replace fluorescent lighting by 2012, according to Daniel Evans, senior scientist at Palomar Technologies. This is largely due to the fact that LED lighting capabilities already match those of both incandescent and fluorescent in many applications. However, Evans says to achieve this will require continuous improvements in LED devices and packaging to extract ever increasing lumens per watt.

3D Integration Tour: Are TSVs the Future of Advanced Packaging?

Thu, 5 May 2008
By Julia Goldstein, contributing editor
(May 22, 2008) San Jose, CA — The "3D Integration North American Tour" came to San Jose on May 15 after stops in Durham, NC and Dallas, TX. The event, hosted by SUSS MicroTec, Surface Technology Systems (STS) and NEXX Systems outlined the current state of the art in through silicon vias (TSVs) and related technology.

Automatic 200-mm Prober for LED Market

Mon, 4 Apr 2008
The Pegasus S200A automatic 200-mm prober from Wentworth Laboratories, Inc. is the latest addition to the company's wafer prober line. Intended for high-volume wafer probing of light emitting diodes (LEDs), it also tests discrete devices and wafers up to 200-mm. Pegasus S200A is integrated with production LED testers to bring a fully automatic test platform to the LED production test floor.

High-performance Thermally Conductive Adhesive

Thu, 12 Dec 2008
Thermal conductivity and elastomeric properties after aging reportedly make Dow Corning TC-2030 A&B thermally conductive adhesive suited for use in automotive electronics, LED assembly, and in the computer market. The silicone-based material provides long-term reliability and good adhesion to various substrates, such as anodized or cast aluminum, tin-plated copper and PCBs.

Learn, Explore, Share at BiTS Workshop 2009

Thu, 12 Dec 2008
By Fred Taber, BiTS Workshop
(December 11, 2008) MESA, AZ — The Burn-in and Test Socket Workshop (BiTS), co-sponsored by Advanced Packaging magazine, celebrates its tenth annual gathering, March 8

CVD Diamond Solves Thermal Challenges

Sun, 10 Oct 2006
The miniaturization and increased functionality of electronic devices is causing manufacturers to seek new thermal management solutions.

Subcontractor Update: Uniformly Down in Q1, Optimism Looking Ahead

Fri, 7 Jul 2005
The major assembly and test subcontractors started 2005 with financial results that were surprisingly uniform and generally as projected, but they were negative by most measures.

High-power LED Stud-bump Packaging

Sat, 4 Apr 2006
Delivering a Bright Future

Inspecting Post Wire-bond Interconnects

Sat, 4 Apr 2006
An AOI Approach

INDUSTRY NEWS TODAY

Thu, 10 Oct 2003
Fairchild Semiconductor Purchases the RF Components Division Commercial Business Unit of Raytheon Company South Portland, Maine—Fairchild Semiconductor, a leading supplier of high performance products that optimize system power for multiple end markets, announced it has purchased the commercial unit of the RF Components Division of the Raytheon Company.
(October 30)
Click here for the full story.

Choosing the Right Sorbent for Electronics Applications

Wed, 11 Nov 2006
Maintaining the stability of moisture-sensitive electronic components and assemblies is a fundamental concern of manufacturers.

New Lead-free Processes Require Industry Collaboration

Tue, 6 Jun 2004
The electronics industry is making steady progress toward developing lead-free assembly processes to meet the EU's Restriction on Hazardous Substances (RoHS) directive, which calls for the elimination of lead and other hazardous substances from new electrical and electronic equipment by July 2006.

In the News

Wed, 9 Sep 2004

THERMAL AND POWER MANAGEMENT CONFERENCE

Thu, 2 Feb 2002
Cool Chips 2002 Conference Lineup
Intertech has a set agenda for its power and thermal management development conference, "Cool Chips 2002 -- Developing New Market, Material and Design Strategies for Thermal and Power Management," which will be held April 3-4 in Monterey, California. With packaging being a critical part of thermal management in electronic products, Advanced Packaging magazine is acting as the media partner for the event.

K&S To Acquire Orthodyne Electronics; Divest Wire Business Unit to Heraeus

Fri, 8 Aug 2008
FORT WASHINGTON PA — In a strategic move to further capitalize on its strengths as an equipment manufacturer, Kulicke & Soffa Industries announced that the company will acquire the assets of Orthodyne Electronics Corp, while also divesting its wire business unit to W.C. Heraeus GmbH.

Live from Orlando: Freescale’s Technology Forum

Tue, 7 Jul 2008
ORLANDO, FL —Everything about the Freescale Technology Forum Americas conference, held June 16 & 17, at the JW Marriott and Ritz Carlton Conference Center in Orlando, provided the attendee an opportunity to interact with the Freescale community.

Elastic Interconnections for Stretchable Electronics

Tue, 1 Jan 2008
Although most electronic appliances are rigid, or at most mechanically flexible, future applications will require them to be flexible, stretchable, and offer maximum user comfort.

Amtech Systems Announces $8.9M in Solar Orders

Mon, 12 Dec 2007
(December 17, 2007) TEMPE, AZ —Amtech Systems Inc., a global supplier of production and automation systems and related supplies for the manufacture of solar cells, semiconductors, and silicon wafers, today announced that its subsidiary, Tempress Systems Inc., has received an additional $8.9 million in orders for diffusion processing systems from the solar cell industry.

Chunghwa Picture Tubes to Enter LED Market

Mon, 12 Dec 2007
(December 17, 2007) TAIPEI, Taiwan — In line with the increasing use of LED backlight modules in display applications, Chunghwa Picture Tubes Ltd. (CPT) reportedly plans to step into upstream LED manufacturing, according to industry sources, reported CENS. CPT reportedly plans to have its affiliated Sintronic Technology Inc. take charge of LED packaging, and San Chih Semiconductor Co., Ltd. will be responsible for LED epitaxy.

Toshiba Gains Stacking Technologies

Thu, 7 Jul 2006
(July 6, 2006) AUSTIN, TX — Staktek Holdings, Inc. formed a licensing agreement with Toshiba Corporation involving Staktek's NAND flash-memory stacking technologies. According to the terms of the agreement, Toshiba will be able to use certain Staktek stacking technologies for flash leaded packages until 2008.

Early MEMS Accelerometer Adopters See Profits Roll In

Thu, 11 Nov 2007
(November 15, 2007) SCOTTSDALE, AZ — Accelerometers — devices that sense motion — have been with us for a long time, but only recently have they have been miniaturized as silicon-based devices. Consumer electronics makers who saw their hidden potential and built new products such as Nintendo's Wii, Apple's iPhone, and Activision's "Guitar Hero" game around them have achieved huge market success by revolutionizing the user-interface.

The Latest in LED Packaging

Thu, 11 Nov 2007
(November 15, 2007) SAN JOSE, CA and SANTA CLARA, CA — Two companies have recently launched new LED packaging products. Philips Lumileds has launched its new cool-white LUXEON K2 with TFFC LED that is designed, binned and tested for standard operation at 1000 mA and can be driven at 1500 mA. In addition, LedEngin Inc. has announced its 10W, multiwavelength RGBA emitter, the LZ4-00MA10, which contains individually addressable dies in an 7mm square power LED package.

Two Trade Shows to Run at Same Time in October 08 Stuttgart

Thu, 11 Nov 2007
November 29, 2007 — MiNaT, a trade fair for precision mechanics and ultra-precision micro- and nanotechnologies, has shifted its dates so that it will take place at the same time as SEMICON Europa from October 7-9, 2008, in Stuttgart, Germany, to be able to share synergies and boost attendance and exhibitors at both shows.

CAP-XX Wins Award for Prismatic Supercapacitors

Wed, 2 Feb 2006
Sydney, Australia — CAP-XX Inc. has received Frost & Sullivan's 2005 Technology Innovation of the Year Award in nanotechnology-enabled supercapacitors for research that led to a breakthrough nanotechnology process for producing thin and flat, or prismatic, supercapacitors to meet the pulse-power requirements of portable devices.

SUSS MicroTec, Instrument Systems Form Test System Partnership

Mon, 3 Mar 2006
Munich, Germany — SUSS MicroTec and Instrument Systems have formed a strategic partnership to develop a next-generation, high-throughput test system for LED devices at wafer-level that tests up to 70,000 LED dies per hour.

Sunic System, Novaled Join Forces on Thin-film Encapsulation

Mon, 10 Oct 2007
(October 22, 2007) DRESDEN, Germany & SUWON, South Korea— Sunic System, a producer of vacuum deposition equipment for OLED, and Novaled, a provider of doping technology and materials for organic electronics, will work together to build up the next generation of thin-film encapsulation (TFE) tools, technologies, and materials.

Silicone Encapsulants for LEDs
Dow-Corning

Tue, 10 Oct 2007
Dow-Corning introduced three two-part high refractive index (HRI) silicone encapsulants to serve the light-emitting diode (LED) market. These encapsulants are said to offer increased light output, a range of hardnesses to suit a variety of applications, and resistance to heat, chemical, and ultraviolet (UV) light exposure.

Motion-control Encoder

Mon, 7 Jul 2006
Avago Technologies introduced a higher-resolution option, AEDR-8300-1Wx, to its series of reflective optical encoders containing an emitter and detector in one package. The encoder offers 8.35 lines per mm (212 lines per inch [LPI]), higher-maximum-count frequency at 60 kHz, and operation based on a single 3.3 – 5-V supply.

iTi Opens European Office, Names VP of EMEA Operations

Tue, 1 Jan 2006
Boulder, CO — imaging Technology international (iTi), a global designer and manufacturer of industrial inkjet systems, has opened an office in Cambridge, England, which is the first stage of iTi's international expansion plan. Also, Debbie Thorp has been named VP of EMEA Operations.

Philips Opens First Luxeon Power LED Facility in Asia

Thu, 11 Nov 2007
(November 29, 2007) Singapore — Royal Philips Electronics has announced the opening of its first Luxeon high power LED production facility outside of Silicon Valley. The site has become operational in less than a year since the company' site selection was finalized.

Encapsulants for LEDs

Mon, 11 Nov 2007
These three new two-part high refractive index (HRI) silicone encapsulants serve the light-emitting diode (LED) market and offer increased light output, a range of hardnesses to suit a variety of applications, and reportedly superior resistance to heat, chemical and ultraviolet (UV) light exposure.

BPM Microsystems' Flash Programmer Reduces Programming Time for STMicro

Tue, 12 Dec 2007
(December 4, 2007) Houston, TX — BPM Microsystems has announced that its newest flash memory programmer, the Flashstream, has dramatically reduced the programming time for the NAND Flash Large Page Family from chipmaker STMicroelectronics.

Palomar Partners with Vision Manufacturing to Add PWB and SMT Services

Tue, 12 Dec 2007
(December 11, 2007) CARLSBAD, CA — Palomar Technologies has announced a partnership with Vision Manufacturing Inc. (VMI) of Vista, CA. Through VMI, Palomar Microelectronics can offer printed wiring board (PWB) and surface mount technology (SMT) services for its customers to supplement the process development, prototyping, and low volume assembly services Palomar Microelectronics provides.

HB LEDs Slow but Healthy

Thu, 6 Jun 2006
(June 22, 2006) MOUNTAIN VIEW, CA — A history of successful growth may be tempered in the years to come for high brightness LEDs (HB LEDs). A report released by Strategies Unlimited shows that the market grew by 6.2% to $3.9B in 2005, a drop from the average 46% annual growth from 2001-2004. The report analyzes the "applications, markets, and supply of high-brightness LEDs."

Single-packaged LEDs

Mon, 6 Jun 2006
A high-brightness, surface-mount 1-watt LED in a energy-efficient package, this miniature device has a thermal resistance of 2°C/watt. Janie Haynie, product marketing director, Visible LEDs, OPTEK, credits the packaging of the device for its thermal resistance. The packaging allows the heat to come out of the leads as well as out of the bottom of the cup, directly into the substrate. It is also designed to mount onto a metal core substrate without additional underfill or adhesives.

INDUSTRY NEWS ARCHIVE

Fri, 10 Oct 2003
Missed a Prior Industry News Article?
(Updated November 20)
Click here to view the Industry News Archive.

Fabless revenue grew 44% year over year in Q2

Mon, 9 Sep 2004
(September 20, 2004) Dallas, Texas—The Fabless Semiconductor Association (FSA) announced today that global public fabless revenue grew 44 percent year over year in the second quarter (Q2) of 2004, totaling $8.3 billion. North American fabless companies represented 76 percent of Q2 2004 total fabless revenue, followed by Taiwan, which contributed 20 percent, the FSA said. Europe and China each represented two percent of worldwide sales.

Inapac Technology Appoints New President and CEO

Tue, 11 Nov 2004
(November 9, 2004) San Jose, Calif.—Inapac Technology Inc. announces that Richard Egan has joined the company as president and CEO. Egan will be responsible for guiding Inapac as it rapidly scales up production to meet the growing demands for its proprietary high-performance DRAM die for stackable and multichip applications.

Quicker high level chip design

Wed, 3 Mar 2004
(March 24, 2004) Oldenburg, Germany—Competitiveness in the chip design and fabrication sector depends on fast turn-arounds and ever shorter concept-to-product cycles. New hardware design tools based on object-oriented methods may help shorten the design cycle.

Cree buys ATMI's gallium nitride business

Thu, 3 Mar 2004
(March 25, 2004) Danbury, Conn.—ATMI Inc., a supplier of materials and materials packaging to semiconductor manufacturers, has entered into a definitive agreement to sell its gallium nitride substrates and epitaxy business to Cree Inc. of Durham, North Carolina, subject to customary closing conditions and certain third party approvals.

Plastic packaging materials market set for growth, led by laminate substrates

Thu, 3 Mar 2004
(March 11, 2004) San Jose, Calif.—The market for semiconductor packaging materials is expected to grow from $7.9 billion in 2003 to $11.7 billion by 2008, according to a just-released study, 'Global Semiconductor Packaging Materials Outlook,' by SEMI and TechSearch International.

Panel to discuss migration to 65nm at SEMICON West 2004

Wed, 6 Jun 2004
(June 30, 2004) San Francisco, Calif.—Attendees of the 2004 SEMICON West exposition now have the option of attending a panel discussion about the migration to 65nm, including IP ownership and new models of collaboration. The panel consists of top industry technologists such as Bill Rozich of IBM, Mendi Moussavi of LETI, LaMar Hill of Albany Nanotech, Mark Pinto of Applied Materials and Mark McClear of Dow Chemical.

New physics law unifies several superconducting compounds

Wed, 8 Aug 2004
(August 4, 2004) Upton, N.Y.—A research group led by a scientist at the U.S. Department of Energy's Brookhaven National Laboratory has discovered a simple relationship that mathematically links the properties of a class of high-temperature superconductors, materials that, below a certain temperature, conduct electricity with no resistance.

Carlyle Group Plans to Acquire ASE

Mon, 11 Nov 2006
(November 27, 2006) TAIPEI, Taiwan — Carlyle Group, a Washington D.C.-based investment firm, plans to buy Advanced Semiconductor Engineering (ASE). Taiwanese ASE received an indication of interest from a consortium of private equity firms led by Carlyle, offering to buy 100% of the package-and-test business at NT $39 per share, equally approximately NT $179 B, or $5.46 B U.S.

NL Nanosemiconductor Acquires Zia Laser

Mon, 12 Dec 2006
(December 4, 2006) DORTMUND, Germany and SAN JOSE, CA — NL Nanosemiconductor GmBH acquired Zia Laser, Inc., to advance quantum dot technology for IC and optoelectronics manufacture. The transaction closed with each company securing board and investor approval; financial terms were not disclosed.

ODM Chip Purchases 2006

Wed, 10 Oct 2006
(October 18, 2006) EL SEGUNDO, CA — Taiwanese original design manufacturers (ODMs) will dominate purchasing in semiconductor chips in 2006, primarily for PC manufacturing, says iSuppli report "ODM Semiconductor Spending Analysis." Quanta, Asustek, and Wistron — the top three spenders worldwide — are all based in Taiwan. All three also reportedly use the majority of chips purchased to make PCs, notably laptops.

Private Holders Acquire Freescale

Mon, 9 Sep 2006
(September 18, 2006) AUSTIN, TX — Freescale Semiconductor, Inc., has entered into a definitive merger agreement with a private equity consortium. The group plans to acquire Freescale at a total equity value of $17.6B. The merger is led by Blackstone Group, Carlyle Group, Permira, and Texas Pacific Group.

LSI Logic Raises Q1 2005 Revenue Range

Mon, 3 Mar 2005
(March 14, 2005) Milpitas, Calif. — LSI Logic Corp. has increased its first-quarter 2005 revenue guidance to a range of $420 million to $435 million. LSI Logic had previously forecasted first-quarter revenue in the range of $400 million to $415 million.

August Tech. Appoints New President, COO, and Board Member

Fri, 4 Apr 2005
(April 1, 2005) Minneapolis — August Technology Corp. announces that Lynn Davis has been named as its new president and COO, as well as also having been elected to the Board of Directors.

Organic Electronics Take Commercial Path

Tue, 12 Dec 2006
(December 19, 2006) GLEN ALLEN, VA — A report by NanoMarkets, LC, "Organic Electronics: A Market and Technology Assessment," predicts the market for organic LEDs (OLEDs), transistors, and other organic-material electronics to reach $34.4B in 2014. The research firm cites several trends in the organic-electronics industry as indicators of commercialization.

Global Semiconductor Sales Surpass $19 Billion in November 2004

Mon, 1 Jan 2005
(January 03, 2005) San Jose, Calif. — Worldwide sales of semiconductors grew to $19.02 billion in November 2004, an increase of 1.3% from the $18.8 billion in October 2004, and an increase of 18% from the $16.12 billion in October 2003, the Semiconductor Industry Association (SIA) reports.

GE unveils Humilab

Wed, 10 Oct 2003
SEPT. 30--WILMINGTON, Mass.--GE General Eastern Instruments, Inc. a business unit of GE Industrial Systems and the General Electric Company has announced the availability of the Humilab product line, a NIST traceable humidity generator and chamber ideal for calibrating a wide variety of humidity sensors, transmitters and instruments.

IC Insights forecast top chip suppliers 2003

Tue, 10 Oct 2003
OCT. 28--SCOTTSDALE, Ariz.--IC Insights today released its forecast for the 2003 ranking of worldwide top 10 semiconductor suppliers.

Cree awarded millions in government contracts

Fri, 7 Jul 2002
July 12--DURHAM, N.C--Chipmaker Cree, Inc. has been awarded more than $26 million in government contracts from the Office of Naval Research (ONR) and Air Force Research Laboratories (AFRL) for silicon carbide (SiC) microwave monolithic integrated circuit (MMIC) process development.

Expert says IBM cleanrooms lacked fresh air

Tue, 12 Dec 2003
DEC. 16--SAN JOSE, Calif-- Attorneys for IBM Corp. are trying to block testimony about chemical exposure levels in cleanrooms models simulating the company's former disk drive manufacturing plant here.

Fry steps down as PDA president, Maitra named European director

Fri, 8 Aug 2002
AUG. 16--BETHESDA, MD -- PDA Chair Floyd Benjamin today announced with regret that, after 11 years, Edmund M. Fry, president of the international association for pharmaceutical science and technology, will embark upon a new career this September

New York Launches Hi-Tech Initiative

Mon, 1 Jan 2001
NEW YORK, NY -- Gov. George Pataki recently kicked off a $1 billion high-tech initiative to fund advanced university research and development and economic outreach.

Report: Medical Plastics Market To Grow

Tue, 1 Jan 2001
A number of recent studies say the US medical plastics market is expected to grow 5 to 7 percent over the next several years.

Dow Develops New CE Glove

Mon, 7 Jul 2001
July 30, 2001 -- MIDLAND, MI -- The Dow Chemical Company has developed new critical environment glove made with the company's INTACTA performance polymer.

Malaria, schizophrenia drugs could hinder mad cow disease

Wed, 8 Aug 2001
August 15, 2001 -- SAN FRANCISCO -- Researchers believe the same drugs that are used to treat malaria and schizophrenia may also fight a human brain-wasting illness that is similar to mad cow disease.

N.J. company launches meat recall

Thu, 11 Nov 2002
NOV. 21--CAMDEN, NJ--A New Jersey company already under investigation for a listeriosis outbreak is expanding a nationwide recall of chicken and turkey meat to 4.2 million pounds, the Department of Agriculture (USDA) announced today.

Uniroyal Technology Ships High Brightness Blue 2 Milliwatt LEDS

Thu, 4 Apr 2001
April 5, 2001 -- SARASOTA, FL -- Uniroyal Technology Corporation's Uniroyal Optoelectronics (UOE) division has begun distribution of two high brightness blue light emitting diode (LED) products.

Medical Journal Blasts FDA

Mon, 5 May 2001
May 21, 2001 -- LONDON -- A top medical journal in England is taking on the U.S. Food and Drug Administration, calling it a 'servant of the industry.'

NEW PRODUCTS

Wed, 6 Jun 2005
Each month CleanRooms brings you a collection of the latest innovations in the contamination-control industry.

GlaxoSmithKline: Manufacturing processes being addressed to correct drug defects

Wed, 6 Jun 2005
ROCKVILLE, Md.-British pharmaceutical manufacturer GlaxoSmithKline (GSK; Brentford, U.K.; www.gsk.com) says it has identified and is addressing unspecified manufacturing processes at its Cidra, Puerto Rico, facility that led to a March raid by the Food and Drug Administration (FDA; www.fda.gov, during which batches of defective medications were seized.

Company’s nanobacteria research leads to manufacturing, contamination-control initiatives

Thu, 9 Sep 2005
Ongoing research by Nanobac Life Sciences (www.nanobaclifesciences.com) has led to the discovery of the structure and pathogenic characteristics of nanobacteria that it says can lead to coronary artery disease and other plaque-related diseases.

Pharmaceutical developer liquidates in wake of FDA inspections

Thu, 9 Sep 2005
Able Laboratories Inc. (www.ablelabs.com), which in July had filed Chapter 11 bankruptcy in hopes of restructuring while it worked with the Food and Drug Administration (FDA; www.fda.gov) to settle regulatory issues that led to the recall of its products and suspension of all manufacturing operations, has decided instead to sell the business and its assets to one or more third-party purchasers.

Particles

Thu, 9 Sep 2005
News snippets from the world of contamination control.

Preparations underway for Boston conference

Tue, 11 Nov 2005
The CleanRooms Contamination Control Technology (CCT) Conference and Exhibition 2006 will take place March 15-16 in Boston.

Spaces of innovation

Thu, 12 Dec 2005
Cleanroom environments are being found in more diverse settings than ever before

Advanced Particle Counting Technology:

Sat, 7 Jul 2006
Concurrent need for speed, resolution, cost-effectiveness and other factors shape new products

Transparency is key to neighborhood acceptance of biosafety labs

Sun, 7 Jul 2007
Despite the highly publicized antics, a poorly attended biolab protest may have done more to illustrate the growing acceptance of Biosafety Level 3 and 4 facilities-even in urban areas-than to rile up residents.

Does a ‘one-size-fits-all’ pharmacy compounding regulation really work?

Sun, 7 Jul 2007
Accepting USP <797>as a robust quality and patient safety regulation is the first step to enforcing it.

Are no nodes good news?

Tue, 5 May 2007
When Intel (Santa Clara, CA) recently announced volume manufacturing in the second half of 2007 of a 45 nm process, something was missing: mention of a technology node.

Cleanroom Lighting

Sat, 9 Sep 2007
Because there are no formal standards for lighting in cleanrooms, contractors and operators must have a thorough understanding of the different types of lighting, fixtures, and installation options available and consider which one will best suit the level of cleanliness required in their critical environments.

Pall opens life sciences center in India

Fri, 6 Jun 2007
Pall Corporation has inaugurated its newest Life Sciences Centre of Excellence in Bangalore, India, which is intended to drive innovations in global life sciences processes throughout Asia.

U.S. food scientist to receive world’s highest food honor

Wed, 8 Aug 2007
Philip E. Nelson, past president of the Institute of Food Technologists (IFT) and food science professor at Purdue University, has been recognized as the 2007 recipient of the World Food Prize in an announcement from the U.S. Department of State.

Fan Filter Units

Sat, 12 Dec 2007
Air quality is a dominant factor in any clean environment. Fan filter units (FFUs) are often used in “clean zones” because of their ability to be added to existing areas without major refitting.

It’s showtime, folks!

Sun, 6 Jun 2008
I’m thrilled to formally announce the return of the CleanRooms USA Conference & Exhibition. After a two-year hiatus, CleanRooms USA will return to Boston, MA on May 12

White Knight turns adversity into advancement

Thu, 5 May 2008
Pre-planning and coordinated response to disaster helps garment manufacturer speed return to productivity.

Update on ISO nanotechnology standards activities

Thu, 2 Feb 2007
In 2005, Technical Committee (TC) 229, Nanotechnologies (ISO/TC 229), was established by the International Organization for Standardization (ISO) with the British Standards Institute (BSI) serving as the secretariat and Dr. Peter Hatto of the United Kingdom as the chairman.

New biolab at K-State focuses on food safety

Sun, 4 Apr 2007
As reported in the Wichita Eagle, Pat Roberts Hall, home of the new $50 million Biosecurity Research Institute, recently opened at Kansas State University.

FDA releases Food Protection Plan progress report

Fri, 8 Aug 2008
The U.S. Food and Drug Administration (FDA) unveiled its Food Protection Plan just months ago with the intention of maintaining a safe food supply for Americans.

Particles

Fri, 8 Aug 2008
compiled by Carrie Meadows

JDV Products acquires Standard Pneumatic & Electric Tool Company

Thu, 8 Aug 2007
July 23, 2007 -- FAIR LAWN, NJ -- As of July 1st 2007, JDV Products Inc. is proud to announce the acquisition of Standard Pneumatic & Electronic Tool Company from the Hamilton Group located in Reno, NV.

Pall opens new Centre of Excellence in India

Tue, 6 Jun 2007
May 16, 2007 -- EAST HILLS, NY -- As part of its global initiative to align with customers worldwide, Pall Corporation today inaugurated its newest Life Sciences Centre of Excellence in Bangalore, India.

Inscent receives federal grant to develop novel biosensor

Wed, 6 Jun 2007
May 24, 2007 -- /PRNewswire/ -- IRVINE, CA -- Inscent, Inc. has received a Small Business Innovative Research grant from the U.S. National Science Foundation to develop a novel biosensor that will protect public health and national security.

Advanced Medical Optics recalls Complete MoisturePlus Contact Lens Solution

Wed, 6 Jun 2007
May 25, 2007 -- /FDA News/ -- The U.S. Food and Drug Administration is alerting health care professionals and their patients who wear soft contact lenses about a voluntary recall of Complete MoisturePlus Multi Purpose Solution manufactured by Advanced Medical Optics of Santa Ana, CA.

FDA advises manufacturers to test glycerin for possible contamination

Thu, 5 May 2007
May 7, 2007 -- /FDA News/ -- The FDA is warning pharmaceutical manufacturers, suppliers, drug repackers, and health professionals who compound medications to be especially vigilant in assuring that glycerin, a sweetener commonly used worldwide in liquid over-the-counter and prescription drug products, is not contaminated with diethylene glycol (DEG).

Digestive Care, Inc. announces expansion of manufacturing facility

Tue, 6 Jun 2007
May 16, 2007 -- /PRNewswire/ -- BETHLEHEM, PA -- Digestive Care, Inc (DCI) announced today that it is quadrupling the capacity of its manufacturing, research and development facility in order to meet the growing demand for PANCRECARB(R) (pancrelipase).

CEL-SCI secures manufacturing facility for cancer drug

Thu, 8 Aug 2007
August 14, 2007 -- /PRNewswire/ -- VIENNA, VA -- CEL-SCI Corporation announced today that it has entered into an agreement with a biomedical real estate group under which CEL-SCI acquires long term use of a dedicated manufacturing facility for its cancer drug Multikine(R).

Joint update: FDA/USDA update on tainted animal feed

Sun, 5 May 2007
April 28, 2007 -- /FDA News/ -- The U.S. Department of Agriculture (USDA) and the U.S. Food and Drug Administration (FDA) continue their investigation of imported rice protein concentrate which has been found to contain melamine and melamine-related compounds.

Digital air pressure sensor

Sun, 1 Jan 1995
The SUNX DP series digital air pressure sensor offers two digital outputs that can be programmed three different ways. The three-digit, red LED display can be programmed to display Pa (Pascal) or Kgf/cm2 (Positive types) of 100k Hz and repeatability of 0.2 percent FS.

Particle counting systems

Wed, 5 May 1996
Malvern Instruments offers a large range of particle counting systems for cleanroom monitoring--from hand-held instruments to fully automated monitoring systems for sampling particles and environmental sensors at multiple locations. The Malvern range of portable particle counters provides measurements of particles down to 0.1 micron. Both particle concentration measurements and total particle counts are displayed with results on a LED display or printed out.

Dow announces formation of water solutions business

Wed, 9 Sep 2006
September 8, 2006 -- /PRNewswire-FirstCall/ -- MIDLAND, Mich. -- The Dow Chemical Company (NYSE:DOW) has announced the formation of Dow Water Solutions, a business unit comprised of world-class brands and enabling component technologies designed to advance the science of desalination, water purification, contaminant removal and water recycling.

FDA issues guidance to tissue establishments

Thu, 9 Sep 2006
September 13, 2006 -- /FDA News/ -- The Food and Drug Administration (FDA) is reminding companies that manufacture human cells, tissues, and cellular and tissue-based products (HCT/Ps) that they must comply with FDA regulations.

Two Abtox execs convicted in unapproved sterilization device scheme

Wed, 5 May 2006
May 3, 2006 -- MEDICAL INDUSTRY E-MAIL NEWS SERVICE(TM) -- COSTA MESA Calif. -- The US FDA announced today that 2 executives of AbTox, a Mundelein IL company, were convicted April 13 2006, of fraudulently selling uncleared surgical sterilizing devices that led to eye damage in 18 patients, causing them to lose sight in 1 eye.

Eugene Science granted patent for AD/ADD production technology

Thu, 8 Aug 2006
August 03, 2006 -- /MARKET WIRE/ -- LOS ANGELES, CA -- Eugene Science, Inc. (OTCBB: EUSI), a developer and marketer of advanced nutraceutical products, today announced that the Korean Industrial Property Office has granted the Company a patent on its AD/ADD production process.

Genetically engineered rubber newest glove material

Fri, 11 Nov 1996
Albany, CA--Ten years of genetic engineering has led the USDA Western Regional Research Center to perfect Parthenium argentatum, commonly known as Guayule--a plant from which rubber is extracted. Guayule`s rubber is comparable in quality to latex from Brazilian rubber trees, however, Guayule`s latex does not cause allergies.

Pressurization monitor for cleanrooms

Sun, 12 Dec 1996
The Henry G. Dietz Co.`s Model 192PDI pressurization monitor for cleanrooms detects negative pressure in biocontainment areas common to biopharmaceutical applications or positive pressure in electronic facilities. The instrument features excellent repeatability, low hysteresis, accurate operation over a broad temperature range and exceptional insensitivity to vibration and increasing common mode line pressure. The Dietz Model 192PDI can have its 10-in. ¥ 10-in. stainless steel monitor panel

Convection oven

Wed, 5 May 1996
Lindberg/Blue M introduces a 260°C mechanical convection oven developed for general laboratory applications such as drying, conditioning, sterilizing, life testing, baking and quality control. Available in four 3-ft3 models with painted or stainless steel finishes and operating at 120V or 208V, the oven maintains close temperature control and uniformity throughout the chamber. A multi-blade blower creates a multi-directional airflow across all shelf levels to heat the work load faster (ambi

Self-cleaning dew point monitor

Wed, 5 May 1996
The Dew Stat MA-99 Dew Point Monitor from General Eastern Instruments has a self-cleaning feature to help accurately measure dew point temperature of compressed air in hospital breathing air systems.

Manual Minis Save Money for IBM

Fri, 12 Dec 1995
Essex Junction, VT--To avoid retrofit costs, IBM Microelectronics is installing 240 manual minienvironments at its fabrication facilities in Vermont. Installation began after the company completed a study indicating the feasibility of maintaining a clean environment during manual loading/unloading of cassettes within a minienvironment.

Fluid monitoring system

Sun, 10 Oct 1995
The new Liquid-Sense fluid monitoring system from Barnant Co. reduces damages due to fluid leaks, and dry-pumping time due to out-of-fluid conditions.

Using Good Contamination Control Practices Can Improve Health

Sun, 10 Oct 1995
As a contamination control professional, you probably know how important cleanliness is. It is true that many contamination control practices can be applied to everyday life--outside of our jobs--to improve our health.

AC/DC combination test unit

Fri, 12 Dec 1995
Wescorp`s AC/DC combination test unit features four test resistance ranges covering U.S. and European specifications/standards ranging from 750K-10 meg, 750K-35 meg, 900K-35 meg, and 500K-50 meg, all ۯ percent. Any of the four ranges can be factory pre-set to customer specifications for wrist strap tester (Mode 1) and wrist strap and footwear tester (Mode 2)--one range for each mode--prior to shipment. The unit has four LED indicators for High Fail, Low Fail, Pass, and Low Battery. It uses

Simplifi 797 updated to meet finalized USP chapter 797 standards

Thu, 2 Feb 2008
February 28, 2008 -- /BELLEVUE, WA/ -- Pharmacy OneSource, creator of the Simplifi 797 quality assurance web application, is pleased to announce that industry expert Eric S. Kastango, MBA, RPh, FASHP, CEO of Clinical IQ, has updated the included policies and procedures reference section in Simplifi 797 to match USP's revised chapteron pharmaceutical compounding, "Sterile Preparations."

New IEST Executive Board Announced

Wed, 5 May 2009
MAY 27, 2009 -- ARLINGTON HEIGHTS, IL -- The Institute of Environmental Sciences and Technology (IEST) has announced its new officers for the one-year term beginning July 1, 2009.

Vacuum Pump Inlet Traps For Solar Cell and LED Manufacturing

Wed, 7 Jul 2009
JULY 22, 2009

Purdue technology detects contaminant in milk products

Mon, 2 Feb 2009
JANUARY 21, 2009--WEST LAFAYETTE, IN--A new analysis method can detect the kidney-damaging chemical melamine, used to contaminate infant formula in China last September, at very low levels within a matter of seconds.

FDA names permanent director for Center for Drug Evaluation and Research

Mon, 3 Mar 2008
March 17, 2008 -- /FDA/ -- Commissioner of Food and Drugs Dr. Andrew C. von Eschenbach announced March 10, after a national search, the appointment of Janet Woodcock, M.D., as director of the agency's Center for Drug Evaluation and Research.

ATMI acquires LEVTECH

Thu, 1 Jan 2008
January 15, 2008 -- /DANBURY, CT/ -- ATMI, Inc. today announced it has acquired LevTech, Inc., a market-leading provider of disposable mixing technologies to the biotechnology and pharmaceutical industries, in a $27 million cash transaction.

Fake chips rattle Asian markets

Thu, 1 Jan 2004
JAN 1---TAIPEI--An ongoing analog chip shortage and strong demand before the Chinese New Year holidays have led to more fake analog chips showing up in China, according to sources with Taiwan-based analog IC design companies.

Commonwealth of PA, Ben Franklin Technology Partners of Southeastern PA, and U.S. Commerce Department's National Institute of Standards and Technology to cooperate on research, development

Wed, 6 Jun 2005
PHILADELPHIA, June 21, 2005 (PRIMEZONE) -- The Commonwealth of Pennsylvania's Department of Community and Economic Development, Ben Franklin Technology Partners of Southeastern Pennsylvania and the United States Commerce Department's National Institute of Standards and Technology (NIST) have agreed to establish a broad framework for cooperation to help promote research, technology transfer and commercialization of new discoveries and capabilities in nanotechnology.

Antibiotic Resistant Bacteria a Major Health Threat to Worldwide Population

Mon, 6 Jun 2005
The National Foundation for Infectious Disease's annual meeting on Antimicrobial Resistance (NFID) will host experts presenting the latest research in the ongoing battle against the growing threat of bacterial infections that are increasingly resistant to available antibiotics.

ISPE Chicago Training Series to focus on pharmaceutical automated systems, with GAMP(r) Americas Forum and two GAMP training courses

Wed, 7 Jul 2005
TAMPA, FL, USA--05 July 2005--Three different sessions addressing Good Automated Manufacturing Practice (GAMP) issues will highlight ISPE's Chicago Training Series, scheduled for 22-25 August at the Eaglewood Conference Resort and Spa in Itasca, Illinois.

SinoFresh Nasal Spray tests positive against deadly methicillin-resistant Staphylococcus aureus (MRSA) bacteria in vitro

Wed, 7 Jul 2005
ENGLEWOOD, Fla.--July 12, 2005 (PRIMEZONE)--SinoFresh HealthCare, Inc. (OTCBB:SFSH) today announced positive results of a controlled laboratory experiment studying the killing effectiveness of SinoFresh(tm) Nasal Spray against the deadly MRSA bacteria in vitro.

Study: Antibacterials provide little protection

Tue, 3 Mar 2004
MARCH 2--NEW YORK--The antibacterial soaps, laundry detergents and other household cleaning products that have become increasingly popular in recent years apparently offer little protection against the most common germs, the first major test in people's homes has found.

New National Pet Food Commission formed to further build on safety and quality standards

Sat, 4 Apr 2007
April 12, 2007 -- /PRNewswire-USNewswire/ -- WASHINGTON, DC -- The Pet Food Institute (PFI), which represents pet food manufacturers, today announced the formation of the National Pet Food Commission, composed of nationally-recognized veterinarians, toxicologists, state and federal regulators and nutritionists, to further strengthen industry procedures and safeguards in light of recent pet food recalls.

HDR, CUH2A to form comprehensive S+T design firm

Tue, 7 Jul 2008
JUNE 2, 2008 -- The combined companies will employ nearly 1,700 architecture, engineering, and planning (AEP) staff members in more than 40 locations worldwide.

M+W Zander selected to design nano center in Portugal

Wed, 7 Jul 2008
JUNE 10, 2008 -- Located on the campus of the University of Minho in Braga, the 230,000-sq.-ft. project will feature Class 100 and Class 1000 cleanrooms, central characterization, including electron and scanning-probe microscopy, and labs suited for a wide range of scientific disciplines.

Palomar Technologies triples cleanroom capacity for microelectronics assembly services

Thu, 4 Apr 2008
April 17, 2008 -

Osram Opto Semiconductor opens optical chip factory

Mon, 4 Apr 2008
April 7, 2008 -- /SANTA CLARA, CA/ -- OSRAM CEO Martin Goetzeler and Dr. R

Siemens to emphasize emerging fields of oncology, neurology biomarkers with exclusive new state-of-the-art research facility

Thu, 2 Feb 2007
February 7, 2007 -- LOS ANGELES & HOFFMAN ESTATES, Ill.--(BUSINESS WIRE)--Siemens Medical Solutions today opened the doors to a new state-of-the-art research facility dedicated exclusively to the development of molecular imaging biomarkers, which will become in vivo diagnostic tools for identifying debilitating diseases such as cancer, and neurological diseases at their earliest stages.

SARS travel warnings lifted

Fri, 6 Jun 2003
JUNE 13--GENEVA, Switzerland--The World Health Organization lifted SARS-related warnings against unnecessary travel to four regions of China, while Beijing remains under an advisory that helped cripple traffic at its biggest airport last month, officials said.

SARS stopped "dead in its tracks"

Tue, 6 Jun 2003
JUNE 17--KUALA LUMPUR, Malaysia -- The chief of the World Health Organization declared Tuesday that SARS has been "stopped dead in its tracks," but experts said China holds the key to whether it resurfaces.

Dow transfers glove business to YTY

Thu, 4 Apr 2003
APRIL 10--HONG KONG--The Dow Chemical Co. has signed an agreement to transfer its Intacta polyurethane glove business to Malaysia-based YTY Industry.

Leslye M. Fraser, S.M., J.D., named Director of FDA's Office of Regulations and Policy, Center for Food Safety and Applied Nutrition

Mon, 8 Aug 2004
August 20--The Food and Drug Administration (FDA) today announced that its Center for Food Safety and Applied Nutrition (CFSAN) has appointed Leslye M. Fraser, S.M., J.D., as the Director of the Office of Regulations and Policy, effective September 5, 2004.

Mykrolis gas purification systems to be used in LED production

Wed, 9 Sep 2004
September 14--Mykrolis Corporation, a leading supplier of components and subsystems to the semiconductor industry, today announced that it has shipped four Aeronex Infinity Gas Purification Systems to a major epi-wafer manufacturer located in Tainan, Taiwan.

Martin D. Madaus named new president and CEO of Millipore

Tue, 10 Oct 2004
October 25--Millipore Corporation announced the appointment of Martin D. Madaus, Ph.D., to President and CEO of Millipore, effective no later than February 1, 2005. Dr. Madaus comes to Millipore from Roche Diagnostics Corporation where he led a $1.9 billion business with 4,000 employees.

Name change for film and bag company

Tue, 8 Aug 2003
AUG. 5--ORANGE, Calif.--Officials at UltraSonic Cleaning/Film Division have announced the changing of their company's name from UltraSonic Cleaning /Film Division to Cleanroom Film and Bags

Genome comparison points to why bacteria becomes lethal

Thu, 8 Aug 2003
AUG. 14--NEW YORK--Looking closely into the iris-shaped map of a microbial genome, the Sanger Institute's Julian Parkhill sees more than just sequence, Genomeweb.com reports.

FDA unveils plan to "Protect and Advance America's Health"

Thu, 8 Aug 2003
AUG. 21--ROCKVILLE, Md--In a 5-part strategic action plan entitled "Protecting and Advancing America's Health: A Strategic Action Plan for the 21st Century," the Food and Drug Administration (FDA) today outlined how it is taking new steps to protect and advance public health for America.

Dow Corning's photonics and electronics partnership opens research center at Cambridge University

Fri, 4 Apr 2006
April 24, 2006 -- /PRNewswire/ -- MIDLAND, Mich. -- Dow Corning Corporation, a member of the Centre for Advanced Photonics and Electronics (CAPE) consortium, today announced that Cambridge University Electrical Engineering Division has completed and equipped a new research facility for the development of emerging technologies across a variety of markets, including optoelectronics, nanoelectronics and displays.

ESTECH 2006 features education and working groups in nanotechnology

Mon, 2 Feb 2006
February 9, 2006 -- /IEST/ -- ROLLING MEADOWS, Ill. -- The Institute of Environmental Sciences and Technology (IEST) will hold its annual technical meeting and exposition, ESTECH 2006, May 7-10, 2006 at the Hyatt Regency Phoenix in Phoenix, Arizona.

ISPE welcomes Balwant Grewal as vice president of Asia Pacific operations

Wed, 2 Feb 2006
February 14, 2006 -- /ISPE/ -- TAMPA, Fla. -- ISPE, a global not-for-profit Society of pharmaceutical manufacturing professionals, today announced the appointment of Balwant Grewal as Vice President of Asia Pacific Operations, effective immediately.

Water-cooled chiller proposal represents energy savings for 90.1

Sun, 10 Oct 2007
October 16, 2007 -- /ASHRAE News/ -- ATLANTA, GA -- An estimated annual energy savings of 13 percent relative to ASHRAE/IESNA Standard 90.1-2004 should result from a proposed addendum regarding air- and water-cooled chillers.

Purdue to break ground on Hockmeyer Hall of Structural Biology

Sun, 10 Oct 2007
October 18, 2007 -- WEST LAFAYETTE, IN -- Purdue University will break ground on the new Wayne T. and Mary T. Hockmeyer Hall of Structural Biology at 2:30 p.m. Friday (Oct. 19).

Temperature monitor

Sat, 5 May 1999
The HPS low temperature alert monitor for the Series 45 heated pumping line jackets indicates by LED if the temperature of the heaters has fallen below a set temperature. According to the manufacturer, the monitor has been enhanced for easier set up and the design has been streamlined to require less space in the system.

Continuous monitor

Sat, 5 May 1999
Model 41137 monitors the ground integrity of two operators and a worksurface with an RTT of less than 5x10e8, according to the manufacturer. Red and green LEDs indicate grounding status. The unit incorporates a data output signal, an audio alarm time out, a mounting bracket, a power supply and two remote jacks.

Fluid seal inventor makes mark with filters

Thu, 1 Jan 1998
Editor`s Note: This is the first in a series of articles celebrating the accomplishments of the distinguished members of the CleanRooms Hall of Fame.

Centrifugal air sampler

Thu, 1 Jan 1998
Biotest Diagnostics Corp. introduces an enhanced version of its Standard RCS Centrifugal Air Sampler which is used to measure the concentration of airborne microorganisms in ambient air. Upgraded features include an easy-to-read LED panel for selection of sampling times; red, alarm LED lights to indicate impeller blade obstruction and low battery voltage; automatic shut-off during non-use; and an optional infrared remote control. Additional information is available upon request.