Thanks to MEMS, 3D packaging, LEDs, power devices, and other applications, thinned wafers will be the majority of wafers in the market by 2016, according to Yole D
Seiko Epson Corporation introduced the IP-2000 inkjet semiconductor marking system to print identification data on the surface of a semiconductor package without the danger of damage from laser cutting
Doug Dixon from Henkel explains two announcements the company made at SEMICON West: a silver sintering material that requires no pressure, and joint work with STMicroelectronics on conductive die attach films for very small package configurations.
In these 2 video interviews from SEMICON West 2011, ESI technologists John Sabol and Vernon Cooke discuss what LED chips require on the back-end manufacturing line, starting at wafer scribing and moving on through test.
Dr. Phil Garrou summarizes the significant commercial strides made over the past 12 months in 3D IC integration -- as defined vs. other "3D" technologies -- thanks to the promised combination of low cost and high performance.
As gold becomes more expensive, copper wire bonding becomes more appealing for chip packaging. Reverse bonding, fine-pitch bonding, looping, second bonds, and other technologies are ramping on roadmaps, according to Kulicke & Soffa (K&S).
InVisage Technologies, image sensor technology start-up, received its series C round of venture funding, led by Intel Capital. The undisclosed amount will be used to bring the company's quantum-dot-based QuantumFilm technology and products into mass production.
Palomar Technologies, precision microelectronics and optoelectronic packaging systems provider, will hold meetings at Stategies in Light to discuss its recent upgrades to high-brightness LED (HB-LED) assembly.
Displaybank published a 2009-2014 analysis of LED packages, the finished LED components used in various applications. While LED package units will grow steadily through the forecast period, revenues will remain mostly flat from 2010 to 2013.
Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds.
Kulicke & Soffa broke ground on its Singapore global headquarters expansion, near the current leased headquarters location. A state-of-the-art facility in Serangoon will bolster the company
During the past ten years, Clarkson University has received more than $1.4 million of direct and indirect (through Semiconductor Research Corporation) funding from Intel Corporation.
SEMI named Thomas DiStefano, John W. Smith Jr., and Michael Warner as recipients of the 2010 SEMI Award for North America for contributions to the development and commercialization of Micro Ball Grid Array (μBGA) technology.
CEA-Leti and IPDiA have formed a common lab to capitalize on their complementary expertise in miniaturization and 3D integration on silicon. The common lab will develop very high-end passive components that will resist harsh environments, functional sub-mounts for LEDs, and assembly technologies.
KLA-Tencor Corporation (Nasdaq: KLAC) introduced the ICOS CI-T620, a high-performance component inspector system for tape and reel. The CI-T620 system has dual tapers working sequentially with minimal operator intervention to increase units per hour.
With thermal issues accounting for half of all lighting failures, and costs prohibitive to widespread adoption, assembly and packaging are keys to improving LEDs. TechSearch International tracks LED packaging materials and methods, as well as reliability and package efficiency.
Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.
Engineered Material Systems released the DA-5045-2 and DA-5045-4 high-thermal-conductivity die attach adhesives for LEDs and small power semiconductor die packaging.
The USPTO is looking to increase the diversity of honorees for its annual National Medal of Technology and Innovation (NMTI), honoring "this nation's creative geniuses."
Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity TSV etch tool for 200mm wafers.
Kulicke & Soffa launched the LUMOS Capillary for LED die wire bonding. The capillary can bond with gold or gold-alloy wires and uses a new TG ceramic material for better workability.
Tessera Technologies Inc. (Nasdaq:TSRA - News) began two corporate initiatives to expand its technologies in semiconductor microelectronics beyond packaging, and to potentially separate its Imaging & Optics business.
Keithley Instruments Inc., advanced electrical test instruments and systems provider, introduced the Model 2651A High Power System SourceMeter instrument to characterize high-power electronics, like HB-LEDs, power semiconductors, DC-DC converters, batteries, etc.
Daniel Duffy, research scientist in Henkel's Advanced Technology Group, notes pros and cons of epoxy and silicone encapsulants for high-brightness LED (HB-LED) manufacturing, and what HB-LED manufacturers need from die attach materials. He also considers quantum dots.
Rogers Corporation's (NYSE:ROG) Board of Directors elected Bruce D. Hoechner as the materials company's new president and CEO, effective October 3, 2011. Hoechner's past positions were with Rohm and Haas and Dow Chemical.
Samsung LED's mid-power 2323 LED package exceeded 6,000 hours of independent, EPA-recognized 3rd-party IES LM80 testing. Samsung LED will provide LM80 test data upon request.
LED lighting maker Gem Hsin Electronics reduced the size of heatsinks in its LED products by drilling miniscule holes beneath LEDs. The holes allow heated air to escape the LED package.
OSRAM Opto Semiconductors increased its IR Power Topled with lens optical output by 80% over the standard version by integrating a thin-film chip. The IR LED maintains the same surface area and drive current.
Supertex (NASDAQ: SUPX) will package its HV2601 and HV2701 16-channel, low-charge injection, 200V analog switch ICs in 5.29 x 5.30mm, 42-ball bumped die packages. This packaging represents a 50% space savings over the previous 48-ball fpBGA package.
IEEE reached the 400,000 member mark for the first time in its history. By the end of 2010, total IEEE membership had surpassed 400,000, making it the seventh consecutive year the association had experienced membership growth.
Nordson ASYMTEK introduced jet dispensing for manufacturing of side-view LEDs, which it says is better than needle-based systems. The Spectrum S-920N fluid dispenser jets 0.1 to 0.2mm dots through windows as small as 0.4mm into LED cavities.
Kulicke & Soffa Industries Inc. (NASDAQ:KLIC or K&S) named Chin Hu Lim to its Board of Directors, also serving on KLIC's Management Development & Compensation Committee.
OSRAM Opto Semiconductors introduced the Oslon Square LED for lighting applications, packaged enclosed in a reflective layer to boost light output.
Cree Inc. added 2 Cree TEMPO offerings to its design and evaluation services: TEMPO (Thermal Electrical Mechanical Photometric Optical) thermal simulation and photometric testing.
inTEST will acquire the assets and certain liabilities of Thermonics from Test Enerprises. inTEST's Temptronic Corporation, of the Thermal Solutions Group, will integrate the company.
Mentor Graphics Corporation (NASDAQ:MENT) has combined technologies for thermal characterization and simulation with T3Ster hardware test products and its FloTHERM software, enabling better heat management in power semiconductor packages, such as LEDs.
Yole Développement forecasts the temporary wafer bonding process growth and worth through 2016, and explains why there are so many process options, and who is working on them.
RJR Polymers debuted liquid crystal polymer (LCP) semiconductor packaging technology for RF and microwave system designers that is competitive with ceramic ACPs, improving thermal management and offering design flexibility based on the company’s epoxy range.
Cascade Microtech Inc. (NASDAQ: CSCD) released WinCalXE version 4.5 calibration software, with improved model and process quality. WinCalXE 4.5 contains the features of WinCalXE and SussCal, and operates with all manual and semi-automatic Cascade Microtech and former SUSS MicroTec probe stations.
Kulicke & Soffa Industries, Inc. (K&S, NASDAQ:KLIC) appointed Irene Lee to the role of chief quality officer. Lee will oversee quality assurance functions across Kulicke & Soffa
The group will work on standard terminology and reference points for the mechanical interfaces of probers, handlers, testers, dockings, contactors and load boards. All companies that use or supply test equipment are invited to actively contribute.
O2 Investment Partners, LLC, announced it has acquired all outstanding shares of Silbond Corporation, a specialty chemical manufacturing business based in Weston in southeastern Michigan.
Nanometrics Incorporated (Nasdaq: NANO) announced that a leading semiconductor foundry has ordered a UniFire 7900 metrology system for advanced 3D wafer-scale packaging process control.
Diodes Incorporated (Nasdaq: DIOD) released its first device in its unique PowerDI5060 package, the DMP3010LPS 30V rated p-channel enhancement mode MOSFET.
Ultratech Inc. (Nasdaq: UTEK) opened an advanced manufacturing facility in Singapore. Ultratech plans to spend more than $125 million dollars over the next several years in support of its Singapore International Operations.
Shin-Etsu Silicones of America Inc., U.S. subsidiary of Shin-Etsu Chemical Co. Ltd., Japan, launched the TC-CA Series, comprised of Shin-Etsu’s advanced polymer and thermally conductive filler composite material technologies. The low-hardness silicone soft pad series of products have both high thermal conductivity and excellent electrical insulation properties.
Gartner VP of semiconductor manufacturing research, Jim Walker, notes that, for the first time, 2 SATS companies joined the top 20 capital spenders in 2010. He also predicts solid growth for advanced packaging tooling with memory ATE and copper wire bonders being the top performers. Walker says the conversion to copper wire from gold is a wise move.
Palomar Technologies introduced the fully automated 3800 Ultra Flexible Die Bonder for eutectic die attach, laser diode packaging and high-power LED packaging.
Laird Technologies released the Tflex XS400 Series thermal gap filler, a compliant elastomer gap filler for moderate thermal performance with a thermal conductivity of 2.0W/mK. This soft interface pad conforms with minimal pressure, resulting in minimal thermal resistance even at low pressure with little or no stress on mating parts.
RJR Polymers debuted a new-generation LCP quad flat-pack no-lead (QFN), air-cavity package that will support finer lead pitches, thinner leadframes and shorter wire bond lengths in a near hermetic, ROHS-compliant solution.
Nordson ASYMTEK was selected by LG Display Co. Ltd. as the exclusive provider of dispensing equipment for LG Display's LED BLU manufacturing operations in Nanjing and Guangzhou, China.
Dow Electronic Materials has broken ground for a new metalorganic precursor manufacturing plant in Cheonan, Korea. Dow is expanding TrimethylGallium (TMG) production capacity to meet the surging global demand for the material in the LED and related electronics markets.
Bare die in yarn, comfortable electronics, stretchable interposers, washable photovoltaic clothes, and other elements will be on the table for the PASTA project to bring smart textiles from the lab to industrial manufacturability. Imec leads the program.
Kulicke & Soffa Industries Inc. (Nasdaq: KLIC) introduced the IConnPS ProCu wire bonder optimized for copper wire bonding. The K&S IConnPS ProCu offers a significant and new level of capability for packaging lines transitioning from gold to copper wire bonding.
To increase the performance and service life of LEDs and LED assemblies, Momentive Performance Materials introduced a line of thermally conductive silicones to be considered for use in LED manufacturing and assembly.
Semtech Corp. (Nasdaq: SMTC), analog and mixed-signal semiconductor supplier, announced the SC442, its first 10-channel white LED driver with an integrated 3A boost power switch.
The advanced packaging and test track of SEMICON Europa will deal with the industry shift away from high-lead solders, digital test and testing integrated analog/mixed-signal packages, package design in the electronics design workflow, and LEDs, among other topics.
In this podcast interview, Smith discusses the three generations in the transition to 3D packaging and how the OSATs shape the development roadmap. Smith says that we need complete supply chain collaboration: EDA tool suppliers, equipment/materials suppliers, logic, memory, fabless, IDMs, and the SATs, to develop and deploy the technologies.
ICAP Ocean Tomo, the intellectual property brokerage division of ICAP Plc (IAP.L), is offering for sale a patent portfolio relating to wafer-level semiconductor packaging owned by Hymite A/S. The 77 issued U.S. and foreign patents and patent applications cover new packaging technologies for optical communications components, LED emitters, and semiconductor fabrication.
Attendance was high at this year's Electronic Component Technology Conference (ECTC) in San Diego. Sandra Winkler is senior industry analyst at New Venture Research and IEEE/CPMT Luncheon Program Chair, shares the key trends in ECTC's sessions, like WLP, 2.5D, LED packaging, and more.
ESI uncrated the Model 5390 micromachining system for advanced LED via drilling and the AccuScribe 2600 HB-LED wafer scribing system at SEMICON West.
Henkel Electronic Materials introduced a silver (Ag) sintering technology that enables high-volume power package production that skips single-package pressure processing, eliminates lead-based solder, and withstands temperature cycling better than currently available materials.
Tanaka Kikinzoku Kogyo KK will partner with SUSS MicroTec KK to develop pattern transfer and bonding technology using sub-micron gold particles. The companies hope to replace gold bumping, sputtering, and other technologies in MEMS, LED, and 3D IC packaging.
TechSearch International has put out a study on HB-LED assembly trends and challenges, highlighting materials
WACKER began operating several silicone-polymer production lines at its Burghausen, Germany, site, expanding production of high-purity specialty silicones, encapsulation and coating compounds, as well as UV-activated silicones.
Until now, LED makers used retrofitted IC equipment and materials. Yole predicts that the market has enough sway now to attract dedicated toolsets for LED fab and packaging. LED growth will not be boring, however, as a few mini down-/up-turn cycles will occur through 2016.
DEK has teamed up with Irisys, infrared products supplier, to develop a robust fine-pitch isotropic conductive adhesive (ICA) interconnection process designed to drive Irisys’ latest generation of advanced infrared sensor products. The project led to the development of an optimized process for the assembly of pyroelectric thermal sensing arrays.
The Asys Group say it has acquired the IP and patents of fellow German firm DynTest Technologies, seeking to apply the company's wafer singulation technology to high-brightness LEDs.
Indium Corporation acquired the processes, equipment, and know-how of Reactive NanoTechnologies Inc. (RNT), developer and manufacturer of NanoFoil. NanoFoil delivers precise, instantaneous heat energy for advanced joining applications. RNT developed the NanoBond joining process to simplify manufacturing and ensure the benefits of NanoFoil are maximized.
Semiconductor packaging and test services provider Carsem will assemble and test LED packages, partnering with a key customer and applying semiconductor packaging technologies for better LEDs.
Ultratech, lithography and laser-processing system supplier to semiconductor manufacturers and packaging providers, added Michael C. Child to its Board of Directors. Child served on Ultratech
SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.
Samsung Electronics' Galaxy Tab 7.7 uses an AMOLED display, gaining benefits in the weight, thickness, and battery life, but at a higher material cost, says research firm Displaybank, part of IHS.
Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.
An LED manufacturing joint venture is the “final due diligence” Viper Networks Inc. will execute with its targeted acquisition: a profitable LED manufacturing company in the US.
Barclays Capital finds that LED manufacturing and materials patents will soon run out, potentially draining value from material/chip/package suppliers and turning LEDs into commodities.
Kopin Corporation achieved record 1290cm2/V.s electron mobility and 240ohms/square sheet resistance results from GaN-based high electron mobility transistor (HEMT) materials.
LED replacement lamps for legacy lighting sources will see 30% unit growth 2012-2016, says Strategies Unlimited. But ASPs will fall 14%/year in that time.
LED revenues are slowing down in 2012, after two years of remarkable growth, according to Strategy Analytics. LED fab equipment spending and epitaxial substrate demand in the LED sector will decline in 2012.
Barclays Capital shares some take-aways from the Intertech Pira Phosphor Summit, a conference on phosphors being used in the LED industry. The analysts touch on color mixing, remote phosphors, silicone encapsulants, and more
Printed flexible electronics represent the future of sensors, displays, power electronics, and lighting, according to experts at the FlexTech Alliance 2012 Flexible Electronics & Displays Conference & Exhibition.
Raja Parvez, president and CEO of Rubicon Technology (RBCN) will speak about the "Move to Larger Diameter Sapphire Substrates" at the Strategies in Light today during the LED Manufacturing track.
Cree Inc. (Nasdaq:CREE) reports doubling the lumens/dollar of light emitting diodes (LEDs) with its new silicon carbide (SiC) LED substrate technology.
The global HB-LED market grew from $11.3 billion in 2010 to $12.5 billion in 2011, surging 9.8%, according to Strategies Unlimited. 10 companies accounted for more than 68% of the global LED supply.
JP Sercel Associates, Inc. (JPSA) expanded its Ultrafast processing capabilities, using Pico-second lasers with innovative laser beam delivery techniques.
The 2012 Strategies in Light conference kicked off today at the Santa Clara Convention Center with a series of five workshops, two tutorials and one all-day investor forum.
Chung Hoon Lee, CEO of LED manufacturer Seoul Semiconductor keynoted at Strategies in Light today. Lee’s keynote, "A View from Seoul," marked the first time a Korean LED maker has spoken at the conference. Following are highlights from his talk.
eMagin was awarded a $1.12 million SBIR contract from the United States Special Operations Command (USSOCOM) to optimize its WUXGA OLED micro display for mass production.
Plessey has acquired CamGaN, a University of Cambridge spin-out with novel GaN technology for HB-LEDs on large-area silicon substrates. Plessey will bring the technology into its 6" wafer processing facility in the U.K.
EVG uncrated the EVG620HBL Gen II fully automated mask alignment system for volume LED manufacturing. The second generation tool offers 55% higher wafer output per square meter of cleanroom space occupied, EVG reports.
Veeco Instruments (Nasdaq:VECO) reported 3 wins for its TurboDisc K465i GaN MOCVD tool : the same systems will be used for high-volume LED fab, GaN-on-Si research, and Si-based LED development.
Eastman Kodak and Heraeus Precious Metals will demonstrate a 3.5" touchscreen panel for cell phone applications using Kodak HCF-225 Film/ESTAR Base as the transparent conductive component at Flexible Electronics & Displays 2012.
The SIA shows 2011 worldwide semiconductor sales hit $299.5 billion, a 0.4% year-on-year increase and new record. Semico Research's forecast for 2012 shows a 10.11% growth in semiconductors revenues over 2011. Barclays Capital and Strategy Analytics also weigh in.
Corning Incorporated (NYSE:GLW) and Samsung Mobile Display Co. Ltd. will establish a new equity venture for the manufacture of specialty glass substrates for organic light emitting diode (OLED) devices.
"Opportunities for Power Components in LED Lighting" from IMS Research reveals that rapid uptake of LED lighting, driven by legislation and rising costs of electricity, will result in a potential market of 4 billion power supply units by 2016, worth $10 billion.
Hanwha L&C of Korea signed a letter of intent to obtain manufacturing and distribution rights to ElectriPlast from Integral Technologies Inc, hybrid conductive plastics maker. The LOI is applicable for various parts of Asia.
Rice University studied the fluorescence of single-walled carbon nanotubes (SWCNT) in new research, finding that the lengths and imperfections of individual nanotubes affect their fluorescence.
Novaled AG filed a registration statement with the US SEC for a proposed initial public offering. Novaled makes technologies and materials for organic electronics, particularly OLEDs.
SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.
CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its CVD and gas control equipment assembly, and unifying its nano-materials lab.
SiGen developed its second-generation production system for fabricating thin-silicon solar wafers, as well as HB-LED, and 3D semiconductor packaging wafers. The system tailored for silicon, GaAs, germanium, SiC, GaN and sapphire materials.
The global market for power semiconductors used in LED lighting is forecast to reach over $3 billion in 2016. LED lighting systems require complex electronics, IMS Research notes.
AIXTRON SE sold 5 multi-wafer MOCVD systems to a new customer, Huaian Aucksun Optoelectronics Technology Ltd., China. The tools will grow materials for HB-LEDs.
AIXTRON's training and demonstration center in Suzhou, China, will focus on improving MOCVD in advanced semiconductor and LED manufacturing operations around China, as well as on employee and environmental safety in electronics production environments.
SAFC Hitech opened a multi-million dollar 270000sq.ft. expansion at its facility in Kaohsiung, Taiwan, increasing capacity for high-quality LED precursor production.
MATHESON debuted the Lasso System, a customer-centric supply chain and inventory management system that can monitor the location and operating status of gas products and other assets in the REAL-Time Gas and Asset Management System.
The US DoD awarded QD Vision Inc. a $1.38 million/12-month contract for specialized devices based on electroluminescent quantum dots. The program will result in prototype devices for armed forces.
Twin Creeks Technologies, semiconductor and solar cell manufacturing equipment supplier, debuted its first commercial silicon wafer production system that reduces solar module and semiconductor device wafers by up to 90%.
Intematix, phosphor and phosphor component maker for high-quality LEDs, received $16.2 million in funding from Draper Fisher Jurvetson and Crosslink Capital, as well as a new financial investor.
Edwards Limited uncrated the STP-iXR1606 series magnetically-levitated turbo-molecular pumps (TMP) with fully integrated onboard controllers. Its new rotary design improves throughput by about 40% at high gas flow rates; nearly 90% percent in maximum gas flow.
Power electronics will grow to $15 billion in sales of discrete components in 2020, says Lux Research. New materials -- SiC and GaN -- are taking a 22% market share for $3.3B in sales. Expect this year to set a record for funding to power electronics companies.
Engineered Conductive Materials LLC uncrated a low-temperature curing conductive adhesive, DB-1541-LTC, for OLED assembly.
SABIC’s Innovative Plastics business released 3 Lexan LUX resin grades for LED applications such as light guides and lenses. They are transparent and use a new formulation to improve initial color, color stability, and light transmission during heat aging.
AMOLED TVs drew a crowd at CES, but manufacturing challenges and expensive fab materials will limit global shipments of the sets for several years, says IHS iSuppli. IHS compares the 55" AMOLED TVs from LG Display and Samsung, each using different manufacturing technologies.
Seoul Semiconductor Co. Ltd. has applied, registered, and secured more than 10,000 patents for light emitting diodes (LEDs) globally. The company invests 10-20% of its annual revenue in R&D.
USCi will develop next-generation silicon carbide (SiC) devices with AIXTRON SE's VP2400 hot-wall CVD tool. USCi plans to install the CVD system in Q3 2012.
imec and Holst Centre, with associated industry partners, are developing flexible active-matrix OLED display technology, the associated drivers and circuits, and new manufacturing equipment to build the displays, all with an eye on low-cost and high-volume production.
Hine Automation shipped its Star SL-300 single-substrate vacuum transfer system to Annealsys, which will integrate the wafer transfer system onto its MC-200 MOCVD tool for R&D and pilot environments.
SEMI presented its annual SEMI Award for North America to QD Vision. QD Vision team members made significant progress on the integration and manufacturing processes essential to the commercialization of quantum dot (QD) technology.
Consumers are adopting LED-backlit LCD TVs more slowly than expected, prompting TV makers to design lower-power, lower-cost LED backlights using fewer LEDs per TV set, shows the NPD DisplaySearch Quarterly LED Backlight Report.
36% of semiconductor fabs are in high-risk zones, finds Semico, noting the industry disruptions caused by the Japan earthquake and tsunami and Thai flooding and the challenges these presented to chip makers in the regions.
The gallium nitride (GaN) LED market declined in 2011, but 2012 marks the beginning of a growth curve, with double-digit growth in 2013 and 2014, says IMS Research. Lighting revenues will overtake TV revenues for GaN LEDs a year earlier than expected.
While the FPD industry faces severe challenges, long-term supply demand models show a positive future. DisplaySearch tracks the near- and long-term outlook for FPDs, with input from Barclays Capital and IHS.
Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufacturing fabs, pilot lines, and major R&D organizations.
GT Crystal Systems will supply 500,000 TIE 6" C-plane sapphire cores to Silian, which produces high-quality sapphire substrates for HB-LED manufacturing.
Jefferies' and Barclays' analysts attended the Strategy in Light conference in Long Beach, CA, and report on a challenging LED market with near-term positive boosts.
Day 3 of the 2012 Strategies in Light conference continued the LED Manufacturing session. Presenters covered LED manufacture, advanced packaging, metrology and testing, high-performance materials, and other topics, such as dimming. Blogger Michael A. Fury, Techcet Group, reports.
The manufacturing conference at Strategies in Light focused on methods for reducing cost through the manufacturing supply chain. Presenters discussed various methods of reducing manufacturing costs, from improved automation and standards implementation, automation to new packaging technologies. Laura Peters, LEDs Magazine, reports.
Rubicon Technology, Inc. (RBCN) entered into a new contract with its largest customer for large-diameter sapphire wafers. Shipments will total at minimum $20 million.
Minsheng Financial Leasing (MSFL), China's main non-banking financial institution, formed a strategic alliance with AIXTRON, making fab tool leasing options available to AIXTRON's customers in China.
Blogger Michael A. Fury, Techcet Group, reports from Day 2 of Strategies in Light: immersing himself in the LEDs manufacturing track of the conference.
The Organic Electronics Association released its "OE-A Roadmap for Organic and Printed Electronics," covering application clusters such as flexible displays and smart systems, as well as the outlook on materials, substrates, and patterning processes.
Taiwan's LED chip and package manufacturers failed to reproduce the booming revenue growth of H1 2011 in H2, according to LEDinside. Given inventory pressure, many LED makers are actively seeking joint ventures and improving product quality to create greater product differentiation.
For the first time, Apple Inc. has publicly published a list of over 150 companies that the electronics giant says represent 97% of its procurement expenditures for materials, manufacturing, and assembly of products worldwide.
OSRAM Opto Semiconductors manufactured high-performance LED prototypes, growing the light-emitting gallium-nitride (GaN) layers on 150mm silicon (Si) wafers rather than sapphire substrates.
Worldwide LED manufacturing capacity will reach 2M wafers in 2012, up 27%. More wafers do not neccessarily mean more LED fab equipment, however. Global LED manufacturing equipment spending will fall 18%, shows SEMI.
Lumiotec will use phosphorescent and other organic light emitting diode (OLED) technologies from Universal Display Corporation (NASDAQ:PANL), under an OLED technology license agreement.
Philips Lumileds appointed Pierre Yves Lesaicherre as CEO, succeeding the company's first CEO Michael C. Holt. Lesaicherre spent 2 decades in the semiconductor and components industry.
EV Group signed a joint-development and licensing agreement with Eulitha AG, integrating Eulitha's PHABLE mask-based UV photolithography technology with EVG's automated mask aligner platform.
Printed, flexible, and organic electronics enable next-gen displays and other applications; however, technical hurdles and dev cycles impede ROI. The key is partnerships sharing materials, equipment, and device development expertise, shows Jonathan Melnick, Lux Research.
OLED manufacturing advanced rapidly in 2011, making gains in organic materials, color patterning, electronic driving methods, and encapsulation, shows NPD DisplaySearch.
Materion Microelectronics & Services added 50% more space in its PVD parts cleaning and surface treatment facility, with an automated robotic twin wire arc spray, increased precious metal refining capacity, new cleaning processes, and a Class 10,000-certified cleanroom.
US FPD Smart Displays -- From Emerging to Mainstream, taking place in February in San Diego, will feature forecasts and analysis from DisplaySearch and In-Stat analysts, as well as presentations from smart display industry executives. Check out the sessions preview.
Barclays Capital forecasts 2012 as a "subdued year" for the light-emitting diode (LED) industry, but there will be opportunities for MOCVD sales in the LED and power semiconductor sectors, as well as MOCVD upgrades.
Nocilis Materials opened its silicon foundry service globally. Nocilis Materials AB provides epitaxy service of advanced Si-Ge-Sn-C alloys for electronic and photonic applications.
AIXTRON SE (NASDAQ:AIXG) delivered multiple AIX G5 HT MOCVD reactors to existing customer Nantong Tongfang in China, fueling the company's HB-LED production expansion.
Soitec (Euronext Paris) completed its acquisition of all of the outstanding shares of Altatech Semiconductor S.A. The final purchase price was EUR15 million.
Novaled AG has been certified according to the ISO 9001:2008 international quality management standard by external auditors DQS GmbH.
Cambrios Technologies Corporation appointed John LeMoncheck as president and CEO, and announced a $5 million Series D-3 financing round from Samsung Venture Investment Corporation.
The Thick Film Division of Heraeus announced a new name, Celcion, for its Insulated Aluminum Materials System. Celcion allows LED circuits to run cooler than MCPCBs.
Gamma Scientific introduced a low-cost spectrometer for quick and accurate testing for LEDs. The RadOMA Lite linear CCD array spectrometer tests LED intensity and total flux.
Requirements for LED processing equipment are changing from cost driven to more technology driven decisions, a clear trend to more complex and more efficient manufacturing, according to Thomas Uhrmann and Thorsten Matthias of EV Group.
Near-eye micro-display maker MicroOLED introduced a 5.4-million-pixel-density, 0.61"-diagonal, low-power-consumption organic light-emitting diode (OLED) microdisplay on silicon.
Umicore will consolidate production of its germanium-based optics products in the US, citing a majority market in the country. Umicore will phase out optics production in Olen, Belgium.
Soitec (Euronext) and Sumitomo Electric Industries Ltd. demonstrated 4" and 6" engineered gallium nitride (GaN) substrates, and launched pilot production lines to enable wider market adoption.
Luminus Devices Inc. unveiled its round LED architecture, meeting the circular aperture designs of many optical devices.
Investments in fabless companies, semiconductor suppliers, and other chip companies fell more than 80% month/month and year/year in March, reports the Global Semiconductor Association (GSA).
Everlight Electronics Co. Ltd. filed a patent infringement lawsuit against Nichia Corp., seeking enforcement of a patent covering LED metallization technology, and asked that 2 Nichia patents on LED phosphor technology be rendered invalid.
The corresponding combined revenue opportunity for MBE and MOCVD is estimated to be around US $6.1 billion for the 2012-2020 periods, shows Yole Développement.
Organic light-emitting diode (OLED) will be a nearly $11 billion market in 2017, and will take some display market share from the $100-billion LCD sector, according to a Lux Research report.
Boosted by LEDs, semiconducting (SC) GaAs substrates will lead growth of the GaAs market. In 2011, semi-inductive (SI) GaAs substrates held ~56% (M$) of the overall GaAs substrate market (SC GaAs held ~44%), a trend that is likely to reverse in the short term.
EPIC, the European Photonics Industry Consortium, announced at its annual general meeting that Carlos Lee has been appointed as director general, succeeding Thomas Pearsall, who has led the association since its founding in 2003.
Positives for LED makers -- improved utilization rates in Taiwan, growing LED lighting demand -- will not immediately equal more orders for MOCVD tool suppliers, reports Barclays Capital. The analysts expect 525 MOCVD tool orders in 2012, most in the second half of the year.
Veeco Instruments Inc. debuted the SPECTOR-HT ion beam deposition tool for thin-film deposition in optical products, such as lasers, telecommunications chips, and more.
Intematix released ChromaLit XT remote phosphor technology for high-lumen LEDs in small form factors, enabling blue LED packages instead of binned white LEDs.
LED-IT Fusion Technology Research Center of Korea tapped Veeco for a TurboDisc K465i GaN MOCVD system for research and development of LEDs, including green LEDs and UV versions.
Cree Inc. (Nasdaq:CREE) achieved 254 lumen/watt on a white-light, power LED in research. The correlated color temperature is 4408 K.
Active matrix organic light-emitting diodes (AMOLEDs) are moving from small-quantity development into higher volumes, with shipments destined for smartphones driving growth in the small- and medium-sized display market in February, said IHS.
Verticle began mass production of its hexagonal-shaped LED chip Honeycomb, developed with a proprietary copper substrate and chemical chip separation technology.
Samsung Electronics' Board of Directors approved a merger with Samsung LED, Ltd. The BOD also decided to request Samsung Mobile Display to pay infrastructure construction costs.
Strategies in Light Europe, September in Munich, is accepting presentation abstracts through February 29. Submit a paper on LED technology, LED manufacturing and the supply chain, markets, LED applications, or a related topic.
Samsung Electronics is under rumors about spinning off its LCD manufacturing division, which could lead into a displays business restructuring involving Samsung Mobile Display and Samsung LCD. NPD DisplaySearch shares the root motivation for changes, and how Samsung's potential moves will affect the industry.
Shin-Etsu Chemical Co. Ltd.'s new KER-7000 Series silicone encapsulating materials offer a low (1.38) refractive index (RI) for HB-LED packaging with lower gas permeability and higher transparency.
LED supply exceeded demand by 30% in 2011, thanks to poor LED TV sales and slow growth in lighting. Look for the industry to start close this gap in 2012, shows NPD DisplaySearch.
Iljin Materials Co. Ltd., a developer and producer of elecfoils for use in the electronic components, has signed a statutory merger agreement with LED manufacturer ILJIN Semiconductor Co. Ltd.
The Innovation Award Laser Technology 2012 recognized 3D metal micro-structuring laser technology from Schepers, excimer laser design for OLED and LCD display fab from Coherent, and a laser brazing head technology from Precitec Optronik.
In light of “challenging industry conditions” in the LED and PV manufacturing sectors, Applied Materials (AMAT) decided to restructure its Energy and Environmental Solutions (EES) segment.
OLEDs are gaining adopters in small screen sizes, and just moving into large-size displays. Mass production color-patterning technology for large-area OLED is increasingly an issue. Displaybank looks at new technologies under development at major display makers.
GE’s 27-watt Energy Smart LED bulb is in a standard “A-19” bulb shape, manufactured with a proprietary synthetic jet technology enabled by Nuventix’ collaboration.
Vanderbilt University researchers have used formic acid to develop white-light quantum dots' fluorescent efficiency to 45%, enabling UV LED efficiency of 40 lumens/watt.
SunSun Lighting, a provider of high-performance, energy-efficient and low-cost LED lighting technologies, received $30 million in Series B financing from GSR Ventures and Oak Investment Partners and additional commitments from its original angel investors. Allan Kwan, a China-based advisor for Oak, is joining the board of SunSun.
SEMI’s Paula Doe covers the “commodity market” of LEDs, including capacity utilization at LED fabs, automation in manufacturing that could improve yields, LEDs fabbed on silicon and GaN instead of sapphire wafers, and more.
University of Warsaw, Poland, researchers will grow GaN materials on a new AIXTRON SE Close Coupled Showerhead MOCVD reactor in a 3 x 2” wafer configuration.
Low-cost direct LED-backlit LCD TVs were introduced in March 2011, targeting share in the entry/mainstream LCD TV market currently dominated by CCFL-backlit TVs. They will eliminate CCFLs by 2014, says DisplaySearch.
AIXTRON SE’s long-time customer Formosa Epitaxy Inc. (FOREPI) ordered several MOCVD systems: 4 CRIUS II-XL systems in a 19 x 4” wafer configuration and 2 G5 HT reactors in a 14 x 4” wafer configuration.
Sapphire wafers grown using ARC Energy’s Controlled Heat Extraction System furnaces for Trinity Material was certified for high-quality LED chip production at two leading LED chip companies.
eMagin Corporation (NYSE Amex:EMAN) received a $3.1 million follow-on order for OLED microdisplays under an existing US Army Remote Viewer Program.
China has designated LEDs as one of the 7th emerging industries to be fostered in the Twelfth Five-year Plan. China is accelerating standardization plans, encouraging local production, and subsidizing purchases of LED lighting, Displaybank reports.
Barclays Capital’s Asia IT analyst Jones Ku shares details of China's State Council’s subsidy program for household electrical appliances. The program sets aside RMB2.2 billion to promote consumption of LEDs and “other energy-saving light bulbs.”
Lightscape Materials offers IP in specialty phosphor technology, which Dow will add to its LED technologies portfolio. Lightscape co-founders Gerard Frederickson and Yongchi Tian will join Dow’s LED Technologies team.
After a surge in 2010 and oversupply in 2011 that suppressed 2012 fab, LED makers will see a leveling out of supply and demand into better equilibrium, according to NPD DisplaySearch. Demand will shift from LCD-backlit LEDs to LEDs for lighting.
LEDs are typically manufactured on sapphire substrates, about 90% of the blue LEDs currently in production. SiC substrates are used for virtually all the remaining 10% of blue LEDs. To improve efficiency and brightness, as well as cost, LED makers are looking to other substrates, such as Si and ZnO.
Barclays Capital analysts attended Lightfair International and gleaned several trends in LEDs and OLEDs for lighting, including an interesting phenomenon around MOCVD utilization rates and new orders.
A team of scientists at Los Alamos National Laboratory has developed a process for creating glass-based, inorganic LEDs that produce light in the UV range.
In this series, CMC Laboratories describes a new LED-grade AlN and what it accomplishes as a ceramic substrate. The AlN offers better heat dissipation for LED packages than alumina, at a lower cost than previous formulations.
SEMICON China takes place March 20-22 in Shanghai. Check out the special pavillions and events, and keynote speakers scheduled.
coolingZONE LED, May 29-31 in Berlin, is soliciting technical presentations on LED energy consumption, LED packaging, heat and air-flow simulations of LED products, and related topics.
MIT researchers used gases to precisely control nanowires' width and composition as they grow, which could yield complex structures optimally designed for particular applications, like LED substrates or solar panels.
MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.
The National Physical Laboratory in the UK is leading a new EMRP project on thin film manufacturing metrology for industries such as opto electronics, plastic and printed electronics, displays and lighting, memories and solar cells.
Part 2 of this series covers furnace considerations for a new HB-LED-grade AlN, as well as furnace throughput. Jonathan Harris, CMC Laboratories, covers the role of the oxide sintering phase in AlN in defining the materials microstructure and thus determining key properties such as thermal conductivity and mechanical strength.
Dynamic changes in the FPD industry range from new LCD, AMOLED, touch, and flexible technologies to the emergence of China as the leading consumer and manufacturer of display products. FPD China covers the entire industry supply chain.
OSRAM Opto Semiconductors released the Oslon SSL LED, using optimized LED chips and packaging technologies to boost light output, with a 25% efficiency increase over previous-generation LEDs.
Gamma Scientific developed the Bi-Spectral Fluorescence Spectroradiometer to quickly obtain detailed fluorescence data for LED phosphors and other fluorescent or reflective materials.
Epistar installed its first AIXTRON SE CRIUS II-XL system in a 19 x 4" wafer configuration to mass produce ultra-high-brightness (UHB) blue and white LEDs.
The formal announcement of China's light emitting diode (LED) subsidy program, likely in the first half of March, may drive tool utilization expansions for LED chip makers, reports Barclays Capital.
Cleantech Solutions International has delivered two units of sample sapphire chambers and one unit of a solar furnace to an international customer.
UL has been named a Zhaga-authorized LED testing center. Zhaga standards cover the physical dimensions, as well as the photometric, electrical and thermal behavior of LED light engines.
“LED is now the dominant force in lighting for the foreseeable future,” reports Ted Konnerth of Egret Consulting Group, after LightFair 2012. What does that mean for traditional lighting products, applications, distribution channels, and talent?
EpiGaN NV opened its GaN epitaxial material production site, on the Research Campus Hasselt in Belgium. EpiGaN’s GaN-on-Si material is used in next-generation power electronics.
JEDEC Solid State Technology Association created a series of standards, JESD51-5x, for component-level testing of high-brightness/power LEDs.
Quantum dots will grow to a $7480.25 million market by 2022, at a ten-year CAGR of 55.2%, according to Electronics.ca Publications.
M’s Optical Systems Division made its flexible, optically clear 3M FTB3-50 and FTB3-125 films available commercially, to protect sensitive electronics displays from water vapor and oxygen. The films previously were sold under limited R&D agreements.
DisplaySearch's Paul Gray advises that TV makers “think deeply about how consumers are watching long-form video at home” before leaping to conclusions about OLED’s impact. “The industry need not take billion dollar technology bets to provide better products.”
LED manufacturers must choose the appropriate materials and processes to fight low yields, writes Thomas Uhrmann of EV Group (EVG).
342 MOCVD tools for LED manufacture will ship in 2012, compared to 654 last year, IMS Research reports in its most recent GaN LED Quarterly Supply and Demand report. Without China, the market would be nearly still.
SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30.
Luminus Devices received accreditation to test its LEDs to the LM-80 standard, the approved method for measuring LED light sources under ISO/IEC 17025:2005.
H.C. Starck notes that the majority of FPD production occurs in Japan, Korea, Taiwan and China. The rapid growth of OLED screens in the FPD industry punctuates the increased need for high-tech materials, the company asserts.
Linde LienHwa (LLH) China will be the exclusive gas supplier to Kaistar, delivering bulk gases and high-purity ammonia (NH3) to Kaistar’s new LED production facility in Xiamen, China.
The Dow Chemical Company (NYSE: DOW) inaugurated its Dow Seoul Technology Center, a global R&D center with focus on technological advances in display and semiconductor applications.
Intematix debuted ChromaLit Contour remote phosphor architecture. ChromaLit Contour is shaped to enable internal and external convection airflow, cooling LEDs in 60, 75 and 100W-equivalent omni-directional lights.
Cree Inc. added TEMPO 24 tests to its Cree Services for LED luminaires. TEMPO 24 combines the IES LM-79-08 photometric test with nearly a dozen other LED performance tests.
Showa Denko KK will transfer 70% of its gallium-nitride (GaN)-based blue light emitting diode (LED) chip business into a new company, TS Opto Co. Ltd, with Toyoda Gosei Co. Ltd.
SEMI presented US Congressman Dave Camp (R-MI) with its 2012 North American Government Leadership Award for his leadership and support of the US microelectronics and photovoltaic manufacturing value chain.
Lumichip Limited, an LED manufacturer, expanded its commercial operations in Finland and opened a new development center in Espoo, Finland.
Active-matrix organic light-emitting diode (AMOLED) displays manufacturing is virtually 100% concentrated in Korea, according to Displaybank, with Samsung Mobile Display (SMD) and LG Display (LGD) scaling up capacity.
MEI uses Vycom Flametec PVC-C for chemical rinse tanks and other wafer-contacting elements of its process tools, reducing tool-based contamination and protecting fab workers. Bill McGinty, MEI operations manager, discusses the benefits the new-generation plastic for semiconductor fab tools.
OEM Group began shipping a multi-tool order to a major LED manufacturer, including Spray Ozone Tool and Spray Acid Tool semi-automated batch surface preparation systems.
Media tablets, experiencing "remarkably rapid ascension," will become the 4th largest application for semiconductors by 2014, up from 35th in 2010, according to IHS.
PLANSEE developed Mo-Cu R670, a new molybdenum-copper composite material for optimizing heat dissipation in light-emitting diodes (LEDs).
AIXTRON received a new MOCVD systems order from existing customer Quantum Wafer Inc., China. The 3 additional MOCVD units will process HB-LED wafers based on GaN materials.
Meaglow Ltd., MOCVD and epitaxy supplier, launched a range of nitrogen-rich indium nitride (InN) wafers for research and industry development around the compound semiconductor material.
The gallium nitride (GaN) power elec market is currently small, but new entrants are ramping to production, silicon-based electronics suppliers developing GaN, and LED makers diversifying capacity to make power semis.
Owens Design Inc. released multiple customized film frame automated handlers to customers in the semiconductor and LED manufacturing tool industries.
The market volume for HB-LEDs reached $12 billion in 2011, a 4.3% growth over 2010, reports EPIC, The European Photonics Industry Consortium.
Materials experts from across the supply chain gathered at the 2012 Strategic Materials Conference 2012 in San Jose in October, discussing key materials needs for micromanufacturing outside the CMOS mainstream: OLEDs and GaN-on-silicon power semiconductors, graphene, CNTs, and self-assembling polymers.
Despite continued delays from its two big proponents, OLED TV technology will finally start ramping over the next year, reaching one million unit shipments in 2014 and a 3% market penetration by 2016, says NPD DisplaySearch.
There's a new battleground slowly emerging for OLEDs in lighting applications where the technology could offer some advantages in design and efficiency -- if panel makers are willing to make some sacrifices.
ProTek Devices says it is now offering individual unpackaged die for LEDs in wafer form, available as unidirectional and bidirectional electrostatic discharge (ESD) protection diodes.
FlexTech Alliance announced the completion of a development project with Etched in Time, Inc. (EITI), for a plasma etch system that is compatible with a wide array of roll-to-roll equipment.
In the seventh installment in a series called Process Watch, the authors discuss cycle time and the impact of inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.
Despite weak financial performances, sluggish global markets and strong regional competition, Japanese consumer electronics giants Sony and Toshiba are increasing their investments in new products to revitalize their businesses.
KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers.
Wide bandgap semiconductor materials can significantly outperform traditional silicon-based devices in power electronics and light-emitting diodes (LEDs), but they're vastly more expensive. So where's the midpoint where GaN's capabilities and extra costs align to make it the preferred technology for each application?
EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services.
Technology improvements and supportive legislation are gathering momentum to help push LED adoption for residential buildings -- the largest lighting application sector.
Growth in the industrial electronics semiconductor market is set to fall short of previous expectations in 2012 as the business is buffeted by weakening global economic conditions, with the LED market the sole bright spot, says IHS iSuppli.
Rolla, MO-based Brewer Science introduced a line of conductive CNT ink materials that are surfactant free, require no additional rinse steps, and are compatible with a broad range of printed electronic substrates.
The market for materials used in printed electronics manufacturing will nearly double over the next five years as new materials are brought forth to support low-cost volume production of printed electronic devices, according to Lux Research.
Industry watchers have been lowering their outlooks for 2013 over the past few weeks, but there's one set of opinions that still see optimism for an industry rebound in 2013 -- chip industry executives themselves.
Ultratech has acquired the assets of Cambridge Nanotech, a developer and supplier of atomic-layer deposition (ALD) technology, which had quietly been put on the auction block after ceasing operations in November.
Canon U.S.A., Inc. recently launched the FPA-3030i5+ i-line stepper, designed for the manufacturing of LEDs, MEMS and power semiconductors.
With OLED adoption, the total market value of materials used in OLED applications will grow quickly from about $500 million in 2012 to over $7 billion by the end of 2019, reports NanoMarkets.
Zeta Instruments will install multiple optical profilers for micron-scale surface analysis at sapphire substrate maker Rubicon Technology, for metrology and inspection on sapphire substrates and wafer production aimed at the HB-LED market.
Panasonic Corporation (NYSE:PC, TOKYO:6752) will reform its head office and governance as of October 1, aiming to reduce internally focused work and focus on customer needs.
Siemens will publicly list OSRAM via a spinoff to Siemens shareholders, rather than an IPO. Spinning off OSRAM will make the public listing more independent of capital market conditions.
Most firms offering alternatives to ITO focus on the touch-screen sensor market; however, this sector is too small for many of these firms to generate significant revenues. NanoMarkets outlines the various ITO alternatives, and their possible application spaces.
NanoMarkets issued a new white paper on LED phosphors, "LED Lighting Driving Demand for New Phosphors," that covers the shifting use of phosphors, which modulate the light emitted by LEDs, from LCD backlighting to solid-state lighting.
LED encapsulants are closely related to the LED’s lifespan and light transmittance. With high-power and high-brightness LEDs emerging, the encapsulant’s role is becoming more important, says Displaybank.
Toshiba will start mass production of white LEDs on a new 200mm wafer production line in its Kaga Toshiba Electronics Corporation fab in northern Japan.
Plessey Semiconductors is installing a multi-million pound HB-LED production line at its Plymouth, UK facility, including a new AIXTRON reactor.
SEMICON West 2012 will take place July 10-12 at the Moscone Center in San Francisco, CA. Following is a preview of the LED and OLED events taking place during SEMICON West, from contributor Paula Doe, SEMI Emerging Markets.
Edwards (NASDAQ:EVAC) introduced the new iXH645H dry pump, optimized for metal-organic chemical vapor deposition, a key step in LED and compound semiconductor manufacturing.
JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.
Panasonic and Sony will combine their core and printing technology to jointly develop next-generation organic light-emitting diode (OLED) panel and module manufacturing technology.
Technology for making circuits with organic materials, non-vacuum processes, and flexible substrates has made striking progress, but it’s been a challenge to find applications where the new technologies offer must-have advantages. Paula Doe, SEMI, reports on flexible and large-area OLED displays and lighting.
LED makers Cree Inc. (NASDAQ:CREE) and SemiLEDs Corporation (NASDAQ:LEDS) have agreed to end their respective patent infringement litigation against each other.
SemiLEDs Corporation (NASDAQ:LEDS) combined its vertical LED chip architecture with a proprietary metal alloy substrate to create the Enhanced Vertical (EV) LED product line.
Samsung Mobile Display (SMD) wiill purchase dopant materials used in the transport layers of its AMOLED display modules from Novaled. Novaled will also provide its proprietary PIN OLED technology to SMD for use in the production of SMD’s AMOLED display modules.
OLED thin film encapsulation technology is the one of technologies emerging as the core technology of flexible OLED, and technology development and patent securing competition between world’s leading OLED companies will increase accordingly, shows Displaybank.
Silicon carbide (SiC) semiconductors will see 38% CAGR through 2022 thanks to power and efficiency advantages over silicon devices, according to MarketResearch.com.
Cambridge NanoTech entered a licensing agreement with Ghent University in Belgium to commercialize an ALD particle coating technology that uses thermal and plasma processes.
Osram Opto Semiconductors developed a concept for uniform solder pads based on the Oslon LED component family. This enables second sourcing by Osram’s LED customers without an additional soldering board, potentially reduces the costs of storage and process modification.
Avnet Electronics Marketing Americas, part of Avnet Inc. (NYSE:AVT) opened a lighting lab in Chandler, AZ, to measure LED properties for various applications.
Intematix Corporation, phosphor and phosphor component developer for LEDs, plans to conduct a registered initial public offering (IPO) of its common stock.
LED prices are declining, as revenues are growing through 2016, according to a report from Strategies Unlimited. Trends include multi-chip packaging and different LED power levels for different applications.
Lily Li, patent strategist at IP Checkups, examines remote phosphors for LED bulbs, in "Patents compete for priority in the remote-phosphor LED technology space," LEDs Magazine, July/August issue.
The price of a LED bulb will fall by about half by 2020, hitting $11.06, according to Lux Research. With the LED chip package seeing 70%+ cost reduction, technology innovation will shift to the surrounding elements: thermal management, drivers and optics.
Terry Brewer, one of the newest members of SEMI's North American advisory board, talks about semiconductor industry consolidation, as well as new technologies and materials in the industry. He shares how SEMI is reacting to this evolution.
SEMICON West confirmed for Barclays that Q2 2012 orders for MOCVD tools remained flattish with the trough-like Q1 numbers, and LED makers are expected to order more tools in H2 2012.
After meeting with various semiconductor manufacturing tool suppliers -- Applied Materials, KLA-Tencor, Lam Research, Tokyo Electron, Teradyne and Cymer -- at SEMICON West, Citi analysts share impressions on foundry spending plans and tool choices.
OSRAM AG will build a new LED assembly plant in Wuxi, Jiangsu, China, packaging LED chips fabbed at its Regensburg, Germany and Penang, Malaysia wafer processing facilities.
Industrially proven and robust, picosecond lasers are proving their worth in cutting and patterning of delicate materials for a wide variety of industrial applications.
Novaled debuted a class of n-doped electron transport layer (ETL) materials for OLED TV and mobile displays.
SouthWest NanoTechnologies (SWeNT) released SG65i, a single-wall carbon nanotube product with >95% semiconducting concentration, before secondary processing to remove metallic SWCNT content.
The Flexible Display Center at ASU, in conjunction with Army Research Labs scientists, manufactured what it is reporting as the world's largest flexible, full-color OLED display prototype. FDC used advanced mixed-oxide TFTs to build the 7.4” device.
Phosphors used in LED lighting applications will see a market increase to over $1.6 billion by 2019, says NanoMarkets. Phosphors help control LED luminous efficacy and color to bring the technology on a level with traditional lighting.
Universal Display Corporation (NASDAQ: PANL) introduced new red, green, and yellow UniversalPHOLED products, combining UniversalPHOLED emitter materials with novel host systems.
LED specialist Marl will install the DEK Horizon 03iX print platform to adapt to new circuit board size requirements, and will use the VectorGuard stencil system and Nano-ProTek.
A*STAR Institute of Microelectronics and NXP Semiconductors (NASDAQ:NXPI) will collaborate on 200mm GaN-on-Si process and technology development for high-voltage power devices.
Kyma Technologies demonstrated a 10" AlN on sapphire template, manufactured on its plasma vapor deposition on nanocolumns technology. The 10” sapphire substrate was provided by Monocrystal.
Intel's Jackie Sturm will bring to light some of the emerging, growth markets for semiconductors, and what they mean for chipmakers and the fab suppliers in the first session of The ConFab, “The Economic Outlook for the Semiconductor Industry.”
Citi analysts surveyed the LED manufacturing market and LED demand at SEMICON West in San Francisco, CA, including a slight uptick in MOCVD orders, and some backlash against Cree's downstream ambitions.
Soitec partnered with Silian to jointly develop GaN template wafers using hydride vapor phase epitaxy (HVPE). The resulting GaN template wafers will reduce the cost of manufacturing LEDs.
AMOLED is entrenched in the small- and medium-sized displays market. For the technology to capture significant market share in the large-size, TV-bound display market, manufacturers will need to invest in better, higher throughput processing, shares Displaybank.
We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco.
Sapphire grown in ARC Energy’s proprietary CHES yields 5% brighter LEDs than the industry standard, according to the company’s study.
Cree Inc. (Nasdaq:CREE) is opening new technology centers in Shenzhen and Shanghai, China, expanding Cree TEMPO (Thermal, Electrical, Mechanical, Photometric, Optical) Services for LED lighting manufacturers evaluating LED luminaires.
Lattice Power Corporation started volume production of its new-generation gallium nitride (GaN) high-power LEDs on silicon substrates.
High Tech Lights is participating in a “Reshoring Initiative” by bringing job positions from China to the US for LED and laser diode scientists, manufacturing and assembly workers, and R&D staff.
Universal Display Corporation (NASDAQ: PANL) announced record-breaking performance of its white organic light-emitting diode (OLED) lighting technology.
A balance of LED demand and supply in 2012 is based on the downward-stabilized price of sapphire wafers. More ingot suppliers are coming online, with new entrants in Korea and China, providing a broader supplier base for LED makers, shows Displaybank.
Veeco Instruments added 3 new models of its TurboDisc MOCVD systems for HB-LED production: TurboDisc MaxBright M and MHP, and TurboDisc K465i HP.
FUJIFILM sold its 1,200+ OLED patents and patent applications to Universal Display for $105 million, with the companies embarking on a strategic relationship in this technology space.
AIXTRON SE introduced a 5 x 200mm gallium nitride on silicon (GaN-on-Si) reactor design for its G5 Planetary Reactor MOCVD platform. AIX G5+ comprises special reactor hardware and process design, developed with customers in AIXTRON’s R&D lab.
DisplaySearch has lowered its 2012 mobile phone displays forecast from 1,917 million units to 1,729 million units. Comparing last quarter's forecasts and actual shipment results by technology, NPD DisplaySearch found that AMOLED actually had higher growth, but other technologies showed declines.
Panasonic, LG Chem and Philips are among the presenters for the upcoming 14th annual OLEDs World Summit, September 26-28, in San Francisco, CA.
Polarizers used in display manufacturing will form a $9.94 billion market in 2012, up 4% from 2011, according to Displaybank. Sequentially, the polarizer market decreased by 9% in Q1 2012, hitting 2.235 billion. This was down 6% from Q1 2011.
SiC is a niche material for semiconductor, power electronics, and LED manufacturing. Yole analyzed patents related to SiC growth and wafer manufacturing to glean trends in production, R&D, top companies, barriers to entry, and more.
Strategies in Light 2013 will take place February 12-14 in Santa Clara, CA, hosted by PennWell Co.’s Strategies Unlimited and LEDs Magazine. The event’s theme is “Exploring the Growth Opportunities in the LED and Lighting Markets.”
Maxim Group analyzed MOCVD utilization and revenues at LED makers in Taiwan, finding that MOCVD orders are placed just to maintain capacity, not add, and high utilization rates are only at the top LED makers.
Veeco hosted more than 150 LED manufacturers and customers of its MOCVD products recently during its MOCVD User Meeting in Taiwan. The talks largely focused on reducing LED cost through manufacturing, as well as using silicon as an LED substrate.
Universal Display broadened its work with Plextronics to accelerate the development and commercialization of solution-based OLED material systems. They will combine Plextronics’ hole injection and hole transport materials with Universal Display’s phosphorescent OLED emissive layer materials.
A multidisciplinary research team at MIT and the Universidad Autónoma de Madrid developed a new mathematical approach to simulating the electronic behavior of noncrystalline materials, with applications in OLEDs, flexible printable organic electronic circuits, and solar cells.
To support the next cycle of LED manufacturing, tools such as MOCVD, plasma etch, lithography, and others must undergo cost efficiency and yield improvements, says Yole Développement. Trends include migrating to larger wafers, silicon substrates, and tools developed specifically for LED fab, rather than retooled from semiconductor manufacturing specs.
PLANSEE has developed a pressed-sintered tungsten crucible with an ultra-smooth surface to avoid sapphire ingot or crucible damage in the Kyropoulos method.
LTI Optics’ Photopia Parametric Optical Design Tools module enables creation of optical designs to achieve a prescribed distribution of light. LUXeXcel introduced its one-step 3D Printoptical printing process for plastic optics for lighting fixtures, which can create custom optics from the LTI Optics' CAD model at prices competitive with injection molding.
Daewon Innost achieved what it says is the LED industry’s best thermal dissipation performance on its Glaxum LED Array family, based on the proprietary Nano-Pore Silicon Substrate (NPSS) technology.
Luminus Devices Inc. is reducing thermal resistance in its Big Chip LED devices by 30% with new packaging technology.
MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.
Guangzhou (China) Lightfair Conference is the biggest lighting fair in Asia. Citi analyst Timothy Arcuri notes trends in LED manufacturing and pricing ahead of China’s subsidy program going into effect.
As the dust settles after the launch of the iPhone 5, analysts tally which suppliers in the semiconductor ecosphere are most likely to gain the most.
Researchers at the Norwegian University of Science and Technology in Trondheim (NTNU) have patented and are commercializing GaAs nanowires grown on graphene.
Stakeholders in LED manufacturing have met with US Department of Energy officials to plead their case for increased support in solid-state lighting (SSL) R&D and manufacturing, asserting that the technology's energy conservation benefits and ROI surpasses those of renewable energy technologies that get much more backing.
While various industry segments appear to be tapping the brakes, others are revving their engines, observes SEMI's Christian Gregor Dieseldorff -- and a 2012 stall could pave the way for a record-breaking 2013.
GaAs epitaxial substrate production rose just 3% in 2011 as handset power amplifiers offset a shift away from GaAs for handset switches, but inside that slowing slope are two key market drivers, according to Strategy Analytics.
Taiwan-based SemiLED says it has replaced two top execs, weeks after posting another quarter of weak financials and a patent litigation settlement that restricts its product sales in the US.
Three leaders in their respective fields have formed a technology alliance to bring a new glass cutting technology to market. InnoLas Systems GmbH licensed process technology developed by FiLaser LLC and will use ultra-short pulse lasers produced exclusively for InnoLas by LUMERA LASER GmbH.
In 2011, LEDs were expected to grab market share from CCFLs in the display backlighting segment. However, prices for CCFL-backlight TVs fell alongside prices for LED-backlit TVs. Now, CCFL raw materials costs have exploded, setting the stage for market share grabs by LEDs, albeit later than expected, reports Jimmy Kim, DisplaySearch.
Albemarle will expand its facility in Yeosu, Korea, with additional manufacturing capacity for PureGrowth products for MOCVD processes.
AMOLED displays are growing rapidly and offer many performance benefits over LCDs. However, 55” AMOLED TV displays cost 8-10x as much as a comparable LCD to manufacture. NPD DisplaySearch looks at ways to improve costs/fab.
AIXTRON launched the PRODOS-200 PVPD system for deposition of organic thin film materials, used to make OTFT displays and OLEDs, and in other manufacturing applications.
Cree saw 8% quarter-to-quarter growth in FY2012 Q4, but only 2% growth in its LED component business. Reasons could include customer pushback from Cree's move into their space, lower average selling prices for LED chips, and more efficient LED modules that use fewer chips.
The LED industry is entering its third growth cycle, general lighting, according to Yole and EPIC’s report, “Status of the LED Industry.” However, the cost of a packaged LED still needs to be reduced by a factor x10 to enable massive adoption. New business models are mandatory to capture added value of LED lighting.
Researchers at the National Institute of Advanced Industrial Science say they have devised a way to selectively and nondestructively evaluate molecules within a sealed organic light-emitting diode (OLED) in operation, in hopes to further understand and eventually minimize performance degradation.
Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.
Azzurro and Epistar say they have achieved GaN-on-Si based high-brightness LEDs on 150mm GaN-on-Si substrates, billed as "one step further towards implementation in mass production."
Solvay Specialty Polymers USA LLC has extended its line of high-performance polyester compounds with a new version targeting light-emitting diode (LED) TVs with higher heat and light stability.
H2 2011 saw slow growth for gallium arsenide (GaAs) substrates in semiconductor and related devices, as well as a shift away from GaAs as a handset switch technology. However, the March 2011 earthquake and tsunami in Japan disrupted the supply chain, driving up substrate pricing and overall revenue to nearly $230 million.
JP Sercel Associates' new IX-6100-MD can scribe and dice a variety of metal layers and alloys used in LED manufacturing.
Learn about the changes in semiconductor manufacturing as well as related markets -- photovoltaics, displays, LEDs, etc -- at the 2012 Strategic Materials Conference (SMC), to be held on October 23-24 in San Jose, CA. SEMI reports.
OSRAM AG and Samsung Electronics Co., Ltd. have reached an agreement to settle all patent suits between them worldwide. The parties have reached license agreements for their respective LED patent portfolios.
Jilin University China has installed an AIXTRON CCS MOCVD 3 x 2” wafer configuration system for GaN UV and white LED research.
Cree announced the availability of high quality, low micropipe 150mm 4H n-type silicon carbide (SiC) epitaxial wafers. 150mm epitaxial wafers with highly uniform epitaxial layers as thick as 100µm are available for immediate purchase
MIT researchers are building various electronic components out of a 2D form of molybdenum disulfide (MoS2). This is the start of a “new realm” of research into 2D materials for electronic materials and devices, according to one researcher.
Optoelectronics researchers at the Ferdinand-Braun-Institut ordered an Optofab3000 for Laser Bar Facet Coating from Oxford Instruments Plasma Technology.
Rambus Inc. (NASDAQ:RMBS), a technology licensing company, will undergo a restructuring and related cost saving measures to cut its expenses by$30-35 million annually.
LED maker Epistar will completely take over its subsidiary Huga Optotech, which produces LED wafers and chips, through a share swap.
Printing is emerging as a technology that can replace traditional photolithography processes for electronics manufacturing, reducing costly material use, very complex processes, and expensive equipment.
OSRAM AG, LED manufacturer, laid the foundation for its Wuxi, China, plant, in a ceremony attended by high-ranking representatives of the Jiangsu province.
ON Semiconductor has joined imec to collaborate on the development of next-generation GaN-on-Si power devices. ON Semiconductor is presently building a GaN processing line in its Oudenaarde facility in Belgium Oudenaarde, and it is expected to employ GaN-on-Si technology.
Responding to consumer demand, TV suppliers are expanding their lineups of low-brightness LED backlight TVs with technology options that actually compete against each other more than traditional CCFL, according to DisplaySearch.
Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy, the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.
Driven by market demand, the semiconductor industry is progressing toward consensus on building-block standards for automating LED production on 6-in wafers, explains Paula Doe in an article for SST sister magazine LEDs Magazine.
imec announced that it has integrated an ultra-thin, flexible chip with bendable and stretchable interconnects into a package that adapts dynamically to curving and bending surfaces.
Sumitomo Chemical has joined the Holst Center's shared research program on printed organic lighting and signage, to contribute to research into multilayer solution processes for high-efficiency organic light-emitting diodes (OLEDs).
Road and street lighting is a key driver for LED technology in general lighting.
At this week’s International Image Sensor Workshop, imec and Holst Centre presented a large-area fully-organic photodetector array fabricated on a flexible substrate.
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.31 billion in the first quarter of 2013.
CEA-Leti announced today that researchers Dominique Vicard and Jean Brun received the Avantex Innovation Prize for the use of the E-Thread technology in textiles.
CEA-Leti will present recent advances and a preview of future developments in micro- and nanotechnologies, followed by workshops on key technical fields, during Leti Innovation Days, June 25-28, on the MINATEC campus.
Shipments of television sets in the United States declined by 11 percent in the first quarter of 2013 compared to one year earlier.
Crystal growth equipment manufacturer GTAT is leading the charge and recently created a lot of buzz around this application and on the OEM front.
Fab equipment spending will grow two percent year-over-year (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.
GT Advanced Technologies today announced that it has acquired substantially all of the business of Thermal Technology LLC for purchase consideration.
The critical processes and technologies necessary to continue Moore’s Law are currently more uncertain than ever before in the history of advanced semiconductor manufacturing.
AG Semiconductor Services today announced that Michael (Mike) Mardesich has joined the company in the role of senior director of sales.
Samsung Electronics Co., Ltd. announced today that it is introducing a new 129lm/W high efficiency, chip-on-board (COB) family of LED packages, LC013/26/40B, which features a compact light emitting surface (LES), designed for use in high performance indoor and outdoor lighting, and ideally suited for spotlight applications.
Recent progress in the engineering of plasmonic structures has enabled new kinds of nanometer-scale optoelectronic devices as well as high-resolution optical sensing.
The 59th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking original work in microelectronics research and development. The paper submission deadline is Monday, June 24, 2013.
Management expects demand for MOCVD production equipment to potentially improve as demand for LEDs increases later in the current year.
The European Photonics Industry Consortium recently embarked on an ambitious project to map all the companies in Europe active in photonics, which amounts to over 3000 companies.
Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision micromachining applications.
Worldwide silicon wafer area shipments decreased during the first quarter 2013 when compared to fourth quarter 2012 area shipments, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.
The LED industry gained a foothold for growth in the parts and materials industry after LED technology was applied to the TV backlight unit (BLU).
Aledia today announced that solid-state lighting (SSL) industry veteran Dr. Bernhard Stapp has joined its board of directors.
IDC expects the semiconductor market to return to growth in 2013 with revenues forecast to increase by 3.5 percent this year.
North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in April 2013 (three-month average basis) and a book-to-bill ratio of 1.08.
Engineered Material Systems debuted its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.
Hitachi Cable, Ltd. announced today that it has developed a new mass-production technology for GaN-templates, in which a high-quality gallium nitride (GaN) single-crystal thin film is grown on a sapphire substrate.
Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia.
Despite stronger-than-expected growth during the fourth quarter, 2012 was still a miserable year for the semiconductor market and suppliers, with only eight out of the Top 25 chipmakers managing to eke out revenue growth—but nine suffering double-digit declines.
The global semiconductor materials market decreased 2 percent in 2012 compared to 2011 while worldwide semiconductor revenues declined 3 percent. Revenues of $47.11 mark the first decline in the semiconductor materials market in three years.
Researchers at the University of Illinois at Chicago have developed a way to introduce precisely four copper ions into each and every quantum dot.
AIXTRON SE today announced that the University of Cambridge has successfully commissioned another multi-wafer Close Coupled Showerhead (CCS) MOCVD reactor at its new facility at the Department of Material Science and Metallurgy. The CCS 6x2-inch system will be configured to handle single 6-inch (150mm) wafers (1x6-inch).
OLED lighting developments are taking place worldwide, with a lot of the research focused on phosphorescent OLED materials, which have a theoretical luminous efficacy four times higher than fluorescent materials.
Chemists at Ohio State University have developed the technology for making a one-atom-thick sheet of germanium, and found that it conducts electrons more than ten times faster than silicon and five times faster than conventional germanium.
Proposed increases in funds for scientific R&D and a greater emphasis on STEM education in the 2014 budget proposal announced by the White House this week reflect the President’s commitment to science and engineering, SPIE leaders said.
Once a white-hot PC product that sold in the tens of millions of units annually, netbook computers are now marking their final days, with the rise of tablets causing their shipments to wind down to virtually zero after next year, according to an IHS iSuppli Compute Electronics Market Tracker Report from information and analytics provider IHS.
The quantum dot recently emerged as a next-generation display material. Quantum dots, whose diameter is just a few nanometers, are semiconductor crystals.
Recent advances in diamond applications (diamond-on-silicon, MEMS, optical) suggest that its utilization into a broader scope of commercial products is not far away.
The SEMI Consensus Forecast and the SEMI World Fab Forecast, with data collected from two different methodologies, point to the same conclusion: 0% growth for 2013.
CoorsTek, one of the largest technical ceramics manufacturers, today announced introduction of aluminum nitride substrates.
Today, Research and Markets released the Gallium Nitride (GaN) Semiconductor Devices (Discretes & ICs) Market, Global Forecast & Analysis: 2012 – 2022.
Strategies Unlimited has issued new figures since the first edition of this article. Solid State Technology now brings you updated figures and additional information on the worldwide LED market.
InfiniLED’s latest MicroLEDs, or µLEDs, have produced record optical beam intensity
Andreia Cathelin, subcommittee chair, reflects on the trends of radio frequency design and usage in her submission to ISSCC.
Stephen Kosonocky, subcommittee chair of ISSCC, writes on the growing need for technologies to be both energy and cost-efficient.
Tablet and cellphone processors, NAND flash, and telecom-specific ICs to enjoy best growth.
Hoi-Jun Yoo, subcommittee chair of ISSCC 2013, writes on the focus of technology directions in the field of large-area and low-temperature electronics.
In the second article of the MEMS new product development blog, the importance of the first prototype will be discussed.
Mitsubishi Electric Corporation announced this week that is has developed a prototype to improve productivity of SiC slice processing for semiconductor wafers.
To help the Taiwan LED industry tackle the increasing challenges, an in-depth analysis of LED global market opportunities and technology breakthroughs were recently provided at the 2013 LED Market and Outlook seminar held by SEMI Taiwan.
Agilent Technologies Inc. announced yesterday the intent to donate a $90 million in software to Georgia Institute of Technology, the largest in-kind software donation ever in its longstanding relationship with the university.
A new report from IHS Displaybank examined a total of 483 patents on roll-to-roll processing technologies, focusing on 32 that were flexible, OLED-related.
Five University of California, Riverside professors will receive a total of $5 million as part of a $35 million research center aimed at developing materials and structures.
SEMI, in collaboration with strategic investing groups throughout the global semiconductor industry, has announced the Silicon Innovation Forum, or SIF, to bridge funding gaps for new and early-stage companies with valuable semiconductor manufacturing and technology solutions.
MOCON, Inc., a manufacturer of package integrity instrumentation, is launching a new system to measure the water vapor transmission rate, or WVTR, of ultra-high barrier films with greater sensitivity than ever before possible.
Soraa announced yesterday the next generation of its high external quantum efficiency GaN on GaN LEDs.
The rise in mobile computing, changes to the fabless-foundry model, uncertainties in technical innovation, and global macroeconomic trends are becoming the dominant forces in 2013 and beyond, according to industry leaders speaking at this week's SEMI Industry Strategy Symposium (ISS).
Is it time for high-brightness LED manufacturing to get serious about process control? If so, what lessons can be learned from traditional, silicon-based integrated circuit manufacturing?
Based on current indications, capital spending would seem to be flat in 2013. However, Semico predicts healthy revenue growth this year, which may encourage more spending, particularly in the second half of the year. This may bring total capex for 2013 into the positive range.
Professor Yue Kuo at Texas A&M University has fabricated a new type of LED, based on light emission from an ultra-thin amorphous dielectric layer.
One of the key factors contributing to this market growth is the high demand of SiC in industrial applications. The global SiC semiconductor devices market has also been witnessing rapid technological advancement. However, the fluctuations in demand and supply could pose a challenge to the growth of this market.
ISSCC, the International Solid-State Circuits Conference, is being held on February 17-21, 2013, at the San Francisco Marriott Marquis Hotel. This year, in honor of the conference’s 60th anniversary, we have assembled highlights of the topics and trends that are being discussed.
CRS Electronics Inc., a developer and manufacturer of LED lighting, today announced the appointment of Mr. Travis Jones to the position of Chief Executive Officer. Mr. Scott Riesebosch, founder and former CEO will assume the role of Chief Technology Officer.
AIXTRON SE today announced that, in the third quarter of 2012, long-term customer Formosa Epitaxy Inc. (FOREPI), Taiwan, placed a new order for multiple CRIUS II-L MOCVD production systems in a 69x2-inch configuration. All systems will be used for the manufacturing of ultra-high brightness (UHB) GaN-based blue and white LEDs.
As power electronics grow to $15 billion and LEDs to $100 billion, Lux Research identifies the leading technology companies addressing these markets.
China looks a good bet to be the engine of growth again in 2013, while U.S. will see improving PC market and more software growth.
HVPE system expected to lower the cost of LED production and accelerate adoption in commercial and residential lighting.
Silicon nanocrystals have a size of a few nanometers and possess a high luminous potential. Scientists of Karlsruhe Institute of Technology (KIT) and the University of Toronto/Canada have now succeeded in manufacturing silicon-based light-emitting diodes (SiLEDs). They are free of heavy metals and can emit light in various colors.
Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase.
Cree, Inc. introduces a game-changing series of LED bulbs, with bulbs starting at a new low price of $9.97 for a 40-watt bulb. The new bulbs shine as brightly as comparable incandescents, while saving 84% of the energy compared to traditional bulbs.
Recently, as the importance of environmental protection grows, the method of saving energy of products and using eco-friendly materials is on the rise. Of these, since lighting accounts for about 20% of the overall power consumption, the efforts to replace with high-efficiency and eco-friendly products are being made actively.
LED driver matches flash LED input current with safe output capability of battery – in real time.
After experiencing a slowdown in 2012, the global semiconductor market is set for growth. The World Semiconductor Trade Statistics predicts the global semiconductor market to grow by 4.5% in 2013 after declining 3.2 percent in 2012.
O-S-D’s marketshare of total semiconductor sales in 2012 was highest since 1991. Seven O-S-D product categories and device groups reached record-high sales in 2012 compared to 14 new records being set in 2011, according to data shown in the 2013 edition of IC Insights’ O-S-D Report.
Solid State Technology is proud to announce that Yoon-Woo Lee will be speaking at The ConFab 2013. The event will be held June 23-26, 2013 at The Encore at The Wynn in Las Vegas. Lee is the Executive Advisor of Samsung Electronics.
Cree, Inc. announces the release of its second generation SiC MOSFET, enabling systems to have higher efficiency and smaller size at cost parity with silicon-based solutions. These new 1200V MOSFETs deliver power density and switching efficiency at half the cost per amp of Cree’s previous generation MOSFETs.
Dramatically falling costs and improvements in efficiency are driving increased sales of light emitting diode (LED) lamps for street lighting. Costs have fallen as much as 50% over the past two years and are expected to continue falling. By 2015, LEDs will become the second-leading type of lamp for street lights in terms of sales, behind only high pressure sodium lamps, according to a new report from Pike Research, a part of Navigant’s Energy Practice. By 2020, the study concludes, LED lamps for street lights will generate more than $2 billion in annual revenue.
New automotive technologies that go beyond touchscreens, satellite radio, and voice-activated GPS commands are being tested and improved, and will soon begin to appear in many more new car models, resulting in solid growth for the automotive IC market through 2016.
The way the world is lit up could be revolutionized by a new European-wide research project being led by the University of Dundee.
New spin technique moves researchers at the University of Pittsburgh and Delft University of Technology closer to creating the first viable high-speed quantum computer.
Volunteers sponsored by SPIE, the international society for optics and photonics, were in Washington, D.C., last week to thank Congressional representatives for recent support for photonics R&D and to urge future support for in several key areas vital to economic growth and scientific progress.
MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, and Sidense Corp., a developer of logic non-volatile memory one-time programmable (OTP) memory IP cores today announced that Sidense's SLP 1T-OTP macros have been fully qualified for MagnaChip's 180nm 1.8/3.3/18V high-voltage CMOS and mixed-signal process.
North America-based manufacturers of semiconductor equipment posted $1.07 billion in orders worldwide in February 2013 (three-month average basis) and a book-to-bill ratio of 1.10, according to the February Book-to-Bill Report published today by SEMI. A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month.
Higher performance UVC LEDs help to realize ever more increasing range of customer applications including scientific instrumentation and water disinfection.
Yole Développement announced today its new report “UV LEDs: Technology & Application Trends” which presents UV LED new applications and associated market metrics for the period 2012-2020, and a deep analysis of UV LED technology and UV LED lighting industry.
Rensselaer Polytechnic Institute student Ming Ma has developed a new method to manufacture light-emitting diodes (LEDs) that are brighter, more energy efficient and have superior technical properties than those on the market today.
PPG Industries has been recognized by the U.S. Department of Energy (DOE) for “significant achievements” in advancing organic light-emitting diode (OLED) lighting technology.
LED makers climb in the overall list of top suppliers of optoelectronics, sensors/actuators, and discretes, says 2013 O-S-D Report.
Bridgelux, a developer and manufacturer of LED lighting technologies and solutions, today unveiled the Vero LED array, a new lighting platform that simplifies design integration and manufacturing and gives designers a more flexible LED lighting solution.
ON Semiconductor will demonstrate new digital AC-DC PWM controllers, motor drivers and IGBTs at industry’s premier power electronics show.
Dynamic changes to R&D processes, tools, technical challenges, and funding/business models will be highlighted at SEMICON West 2013, along with product displays of the latest semiconductor manufacturing technology, components and subsystems.
Plessey today announced that samples of its Gallium Nitride (GaN) on silicon LED products are today available. These entry level products are the first LEDs manufactured on 6-inch GaN on silicon substrates to be commercially available anywhere in the world.
A new £1million (or US$1,530,700) growth facility will allow University of Cambridge researchers to further reduce the cost and improve the efficiency of LEDs, with potentially huge cost-saving implications.
It’s no secret that Samsung is up against Apple in many ways, in products, sales and innovation. However, even in the face of Apple’s patent infringement lawsuits, Samsung is still climbing the charts.
Samsung Electronics Co Ltd of Seoul, South Korea has introduced a new lineup of Zhaga-compliant LED H-Series linear modules with high efficacy and light quality, as well as color consistency for use in a wide range of LED lighting applications including ambient lighting and linear fixtures.
Oxford Instruments Plasma Technology has just announced an evolution in batch etch technology with the launch of the PlasmaPro 1000 Astrea etch system, a large batch etch solution for PSS, GaN and AlGaInP that will offer HBLED production manufacturers high throughput.
Stung by plunging sales in Japan and declining demand in North America and Western Europe, global television shipments in 2012 fell, marking a major inflection point that will have a lasting impact on the market, according to an IHS iSuppli Worldwide Television Market Tracker Report from the IHS TV Systems Intelligence Service at information and analytics provider IHS.
Quantum dots will cascade into the marketplace. They offer lower cost, longer life, and brighter lighting, according to WinterGreen Research’s new study Quantum Dot and Quantum Dot Display (QLED) Market Shares, Strategy, and Forecasts, Worldwide, 2013 to 2019.
Pixelligent Technologies, a manufacturer of nanocrystal additives for the electronics and semiconductor markets, last week announced the launch of its PixClear Zirconia nanocrystals. When incorporated into existing products, the nanoadditives can dramatically increase light output and readability of modern touch screens and displays.
The global LED lighting market will be worth $25.4 billion in 2013, representing 54% growth on the 2012 figure of $16.5, while the LED lighting penetration rate will also rise to 18.6%, according to a new DIGITIMES Research Special Report titled "Global high-brightness LED market forecast."
Aledia, a developer of LEDs-based on disruptive microwire GaN-on-Silicon technology, announced today that it has made its first LEDs on 8-inch (200mm) silicon wafers.
A new undergraduate program approved this week at the University of Central Florida (UCF) will help the U.S. stay competitive in global technology as well as broaden the path for students seeking rewarding careers in the important field of optics and photonics, say leaders of SPIE, the international society for optics and photonics.
While speculation abounds about what will be the next generation of memories and their applications, CNRS, a French government-funded research organization, has 4 new concepts of memories in 2010. The organization is actively recruiting collaborators on RE-RAM, A-RAM, MS-DRAM, and MELRAM memory technologies.
The packaged LED market is experiencing tremendous growth with an expected CAGR of 28.2% between 2009 and 2015. Yole and EPIC will publish their new market & technological studies dedicated to LED market and manufacturing technologies in November.
Seeking to capitalize on the fast growth of the tablet market relative to its core PC business, Intel Corp. has come off the sidelines with a microprocessor designed specifically for iPad-type devices, according to the market research firm iSuppli Corp.
The Veeco GEN10 design allows researchers to grow complex crystals with better quality control than has been possible in the past. The system allows independent growth of multiple incompatible materials in a single system architecture.
The IEEE Standards Association signed 4 MOUs with standards organizations in Korea, Japan and the Middle East to share knowledge of each group's standards development activities, facilitate technical cooperation, and seek opportunities for future collaboration.
Global semiconductor sales rose to a new record high of $23.6B as the industry continues to march back from a bruising downturn into seasonal patterns again -- and analysts suggest expectations may not be high enough.
Veeco exec Jim Jenson explains the workings of the company's new MOCVD tool targeting high-volume high-brightness LED manufacturing, a market expected to triple in the next four years to $15B.
Just two months after beefing up its semiconductor sales forecast because of the sector's "roid rage," iSuppli has put those numbers on a cooldown rep, citing concern over end-user demand vs. inventories.
At the upcoming International Electron Devices Meeting (IEDM), researchers from IBM and Macronix will report on their findings of electromigration-induced failures when phase-change memory (PCM) cells are reverse-stressed.
The Extreme Ultraviolet Lithography System Development Association (EUVA) says it has surpassed 100W output at intermediate focus for an EUV light source, another big step to address a big hurdle facing EUV lithography as a production-viable candidate for next-generation semiconductor manufacturing.
According to Dean Freeman, research VP at Gartner, the LED market will see ~11% growth in 2010, and ~35% growth in 2011. Reaping the benefits of the accelerating interest in LEDs is the MOCVD equipment market.
Soitec and Sumitomo Electric Industries are working together to develop engineered gallium nitride (GaN) substrates. The alliance will draw on Sumitomo Electric’s GaN wafer manufacturing technology and Soitec’s Smart Cut layer transfer technology.
SAFC Hitech announced plans to build a new, dedicated facility in Kaohsiung, Taiwan for transfilling, technical service and production of chemical precursors used for high brightness LED and silicon semiconductor manufacturing.
The latest advances in HRXRD technology to allow true in-line monitoring, are described. Paul Ryan, et al, Jordan Valley Semiconductors UK Ltd.
TSMC has officially broken ground for its new LED lighting R&D center and fab in Taiwan's Hsinchu Science Park, part of its multibillion-dollar initiative to establish a foothold in higher-growth markets outside of core IC fabrication.
The light-emitting diode (LED) market has gone through two cycles of major growth, but an even bigger "third cycle" based on super-efficient lighting looms ahead, reports SST's Bob Haavind from a recent SEMI breakfast at Teradyne near Boston on March 10. And the wide range of problems to be tackled will make it an attractive target for those now in the semiconductor processing markets.
A year after calling a new deal with TSMC to make some of its Atom processors "an important step in a long-term strategic technology cooperation", that partnership apparently has floundered -- and it's a good example of the complex battles the top chipmaker is trying to fight, according to one analyst.
If the industry's rapid recovery this year seems familiar, it's because we saw it six years ago, says IDC, which projects a ~22% bounceback in 2010 -- if demand holds up its end of the bargain.
Anyone getting tired of hearing this? Global chip sales continue to climb for another month to yet another record high, and are on pace for a stellar ~30% annual growth rate, according to the latest data from the Semiconductor Industry Association (SIA).
CHAD Industries developed wafer-handling capabilities for Sapphire wafers used in the LED market.
AMD (NYSE: AMD) appointed Donald Newell as VP and CTO, Server. A distinguished engineer with more than 20 patents filed, Newell previously served as a senior principle engineer leading the System-on-Chip (SoC) and datacenter networking architecture groups within Intel Labs before joining AMD to lead its server roadmap and platform design programs.
SEMI has reorged into three groups to align its focus areas into IC manufacturing, solar photovoltaic (PV), and related/tangential markets including MEMS and LEDs.
The World Fab Forecast released at the end of August indicates a 133% increase in equipment spending for front-end fabs this year and about 18% growth in 2011. The data reveals that for both 2010 and 2011, over 150 fab projects will contribute an estimated $83 billion in spending.
Since the fabless model established itself more than a decade ago, it has assumed higher and higher bars of excellence annually. Jodi Shelton, Global Semiconductor Alliance (GSA), has witnessed fabless companies emerge, grow and prosper -- many of them becoming the best-of-breed in their end market sector. This article summarizes the accomplishments of the fabless model.
IMS Research’s latest Quarterly GaN LED Supply and Demand Report features a new LED supply and demand model that shows LED supply growth is significantly outpacing demand growth. The research report also shows Samsung leading LG in Q3 and Q4, though LG is expected to consume more LEDs in all of 2010.
The ConFab, an invitation-only global conference and networking event for semiconductor industry executives, announces the appointment of five new advisory board members for 2011. The ConFab also welcomes the industry association SEMI, which has agreed for the first time to sponsor The ConFab in 2011.
Techcet's Michael A. Fury continues his observations from this year's International Symposium on CMP at Clarkson U. in New York. Highlights from Day 3: Horrifying CMP "fangs," dissolved gases in megasonics, a dual-purpose slurry injector, the usefulness of CMP levelers, CVD Co as a Cu barrier, HB-LED sapphire wafer polishing, and a CMP Broadway moment.
Techcet's Michael A. Fury offers his observations from this year's International Symposium on CMP at Clarkson U. in New York. Highlights from Day 2: Creating "porosity on demand;" a CMP Rubik's Cube vs. Whack-A-Mole; the evolution of CMP process control; and a missing manufacturing acronym.
The BIANCHO project (BIsmide And Nitride Components for High temperature Operation) will develop new semiconductor materials to allow lasers and other photonic components to become more energy efficient and also more tolerant of high operating temperatures.
The Global Semiconductor Alliance presented awards to top private and public companies at its annual ceremony, as well as honoring Dr. John Hennessy, president of Stanford Univeristy, with the Dr. Morris Chang Exemplary Leadership Award.
The top makers of LEDs; how LED fab is changing, in technological scope and geographical size; and the driving applications for LED adoption are covered in two recent reports. IMS Research covers primarily LED suppliers and markets, while EPIC and Yole look mainly at the markets and fab equipment.
In a podcast interview, Paul Semenza, SVP of Analyst Services at DisplaySearch, explains how a maturing OLED manufacturing capability is contributing to the surge in interest, as is consumer response to products that use OLEDs. One challenge, however, is scaling up vapor deposition, and solutions are being developed.
Researchers at Rice U. say they've figured out that new switching memory they built with electrically manipulated 10nm graphite strips doesn't actually need the graphite -- good ol' reliable silicon oxide will do just fine.
Techcet's Michael A. Fury reports from SEMI's NCCAVS CMP Users Group meeting in San Jose, CA. Highlights included a market growth overview, and talks ranging from market growth to consumables challenges to new technologies for chromatography, noncontact probe, 3D topography, polishing, and HDD substrate slurry.
GEO Semiconductor Inc., provider of high-performance, programmable video and geometry pixel processor ICs for LED-backlit LCD displays and smartphone cameras (optics through sensor), raised $2 million in additional funding comprised of venture debt and equity.
Sunnyvale, CA--As of October 1, 2010, Aldo Kamper is succeeding retiring CEO Rüdiger Müller at OSRAM Opto Semiconductors.
LEDs, SiGe semiconductors, and WLP bumps each present their own challenges to metrology systems, says Alon Kapel, Jordan Valley Semiconductor.
Sapphire Materials Company (SMC), a subsidiary of Silicon Chemical Corporation (SCC), completed Phase I of its sapphire manufacturing business. Initial shipments of sapphire product will begin this November.
Translucent demonstrated its Mirrored Si technology on a 100mm-diameter wafer that exhibits high reflectivity using a lattice-matched REO material grown on a Si substrate, capped by a GaN layer that can support further nitride epitaxy for LED structure growth.
Rounding up observations from Day 3 at SEMICON West, Intermolecular's Russell Kempt looks at LED technology, executive opinions on big-picture industry issues, and the state of play in the solar market.
Exotic pads for CMPs, flow meters with a nod to Napoleon, and driving down LED costs were among themes pursued by Techcet's Michael A. Fury on a walk through the SEMICON West show floor.
In an exclusive series of blogs, imec reports from its International Technology Forum (ITF) last week in Brussels. Els Parton, science editor, imec, shares Jy Bhardwaj's (Philips Lumileds) points about LEDs costs improvements.
Tsinghua Tongfang Company ordered Veeco's new TurboDisc MaxBright multi-reactor MOCVD system for HB-LED production.
On the eve of SEMICON West's official opening, Mike Fury reports on a full day of presentations offered a review of trends and new outlooks for fab capacity, equipment and materials spending, foundries, and packaging technologies.
SmartKem Limited tested its advanced semiconductor materials against amorphous silicon at the National Printable Electronics Technology Centre, where it achieved better thin-film transistor (TFT) mobility rating.
Semiconductor wet chemicals saw 13% growth year-over-year in 2010, while the electronics fab gasses market grew 16%, according to 2 new reports from Techcet Group.
Sharon Stiefel, IHS iSuppli, reports that a cushion in the semiconductor supply chain helped balance out off-line fabs in Japan following the Sendai-area earthquake and tsunami. As fabs ramp back up, or products are transferred to lines in other facilities, Q2 should avoid component shortages as well. But will the disaster be the end of just-in-time inventory management?
Lattice Power Corporation and ShineOn Inc. jointly demonstrated a high-brightness LED (HB-LED) product based on GaN-on-Si technology.
Chinese researchers used a supercomputer to run high-performance molecular simulation, looking to improve production and use of crystalline silicon (c-Si) for photovoltaics and semiconductors.
The Large Area, Organic and Printed Electronics Convention (LOPE-C) conference and exhibition, June 28-30 in Frankfurt, Germany, will focus largely on organic photovoltaics (OPV) and organic light emitting diodes (OLEDs).
SEMICON West preview: Emerging technology and a developing infrastructure for printed electronics is enabling circuitry that is flexible, conformable, and inexpensive to mass-produce, paving the way to a variety of low-cost applications such as electronic packaging, ID tags, and wide-area lighting panels.
The semiconductor industry's torrid pace of capital equipment expenditures will continue in 2011, but actual construction of new fabs is slowing to "historically low" levels, according to data from SEMI.
In his second-day keynote at the Confab, IC Insights' Bill McClean offered an updated look at why semiconductor and supporting markets should follow up 2010's record success with another good year all around.
SEMICON West preview: With device efficacy approaching limits and end-costs still too high for mass-market adoption, LED manufacturers are looking to trim costs by improving key manufacturing steps: measuring process conditions, preparing and handling substrates, and wafer-level testing.
As LED adoption continues to grow, LED driver ICs face pressure from increased IC integration, driver-less AC-LEDs and other technologies, and falling prices. However, the driver IC unit can bring performance and power enhancements that consumers want for LED lighting adoption.
About a hundred people gathered at the San Jose Marriott on June 22 for the first IHS Global Design & Supply Chain Summit, where a series of speakers presented on everything from spending on consumer gadgets to telecom systems to fabs, lessons learned from the Japan disaster, and why the Pentagon is a poster child for counterfeit parts.
The board of directors of GLOBALFOUNDRIES appointed new leadership to run GlobalFoundries, the company's first CEO change since its inception.
Stanley T. Myers talks what moments stand out for him as "historic" advances in semiconductor fab and the evolution of SEMI. He also shares advice for young engineers entering the semiconductor industry.
Organic light emitting diode (OLED) lighting can be manufactured into aesthetically pleasing, unique products. However, the immature technology is costly today, and even with a price decline of more than an order of magnitude over the next 10 years, OLED lights will remain uncompetitive with other lighting options, Lux Research finds.
ATMI's SVP/CTO, Larry Dubois shares the 3 guidelines ATMI keeps in mind when designing eco materials for semiconductor wafer fab, and gives an update on the materials supplier's LED fab products.
Nuventix, LED cooling technology developer, received capital from GE (NYSE:GE) and other investors. GE will also license Nuventix's patent portfolio.
Wrapping up the Organic Microelectronics & Optoelectronics Workshop, Michael A. Fury reports on vertical structures for OLEDs, solution processing for OLEDs and organic TFTs, small-molecule organic semiconductors, and characterizing mobility and recombination in organic PV devices.
Strategies in Light 2012 will take place in February in Santa Clara, CA. The Strategies in Light Advisory Board seeks abstracts for the conference, which is themed "The Booming LED Market."
A four-month fab design verification project was approved for CEITEC S.A., for what is said to be the first semi conductor manufacturing facility to be built in Central and South America. CEITEC S.A. is a Brazilian company that produces application-specific standard products (ASSPs) for RFID, wireless communication and digital multimedia. The design verification project was overseen by Lotus Technical Services, one of five operational divisions of the LotusWorks based in Sligo, Ireland.
CEA-Leti's Serge Tedesco and Didier Louis summarize key themes from the Sokudo lithography breakfast forum held last week at SEMICON West.
Techcet's Michael A. Fury reports from the Organic Microelectronics & Optoelectronics Workshop in San Francisco, where talks delved into flexible displays, organic molecular tunnel junctions, thin-film microprocessors, and a microphone that can "see" sound.
Each market in which Edwards is a supplier -- semiconductors, flat panel, photovoltaics, LEDs, has its own cycles and technology requirements. Matthew Taylor, CEO of Edwards, discusses the needs and market personality of each sector.
The updated "Garment System Considerations for Cleanrooms and Other Controlled Environments" document includes new sections on measuring footwear, frocks and other garments, as well as a new subsection for tracking system use, such as RFID chips and barcodes.
Maxim Group, in its equity research on LED sector companies, finds that competition and demand strategies will push LED prices lower in the near future, and the capital expenditures surge of 2010-2011 is giving way to a tool spending downturn.
Cree Inc. (Nasdaq:CREE) granted 5 LED lighting manufacturers licenses to select Cree patents through its remote phosphor licensing program. Cree's licensing program facilitates the development of LED lights combining remote phosphor optical elements with blue LEDs.
Strategies in Light Europe 2012, September 18-20 in Munich, Germany, is accepting abstracts through February 17. Strategies in Light Europe covers the rapidly growing LED lighting industry.
MicroTech has developed a wet process station to etch patterned sapphire substrate (PSS) wafers in a way that increases LEDs' light output and efficiency while increasing manufacturing throughput.
AKHAN Technologies has developed a shallow n-type diamond material over silicon that has characteristics such as a shallow ionization energy, high carrier mobility, and no graphitic phases. Adam Khan, president of AKHAN Technologies, says that the bottleneck in development of diamond films has always been the fabrication of n-type diamond.
Organic light-emitting diode (OLED) company Novaled AG founders Professor Karl Leo, Dr. Jan Blochwitz-Nimoth, and Dr. Martin Pheiffer received the Deutscher Zukunftspreis from German Federal President Christian Wulff.
Altatech Semiconductor S.A. launched its first LED inspection system, the non-contact AltaSight LEDMax, for detecting, classifying and characterizing defects on wafers used in manufacturing LEDs.
SEMI is looking for presenters for technical sessions and other opportunities at SEMICON West 2012, July 10-12 in San Francisco, CA.
Researchers at the Samsung Advanced Institute of Technology and Seoul National University have demonstrated the first LEDs to be fabricated on amorphous glass substrates.
A number of big-name frontend equipment firms highlight TSMC's annual supplier awards in 2011, as the foundry expands its list of top suppliers.
Strategy Analytics asserts that the optoelectronics segment of the compound semiconductor industry continued to grow into the close of 2010, driven by broader adoption of LEDs for general and automotive lighting applications, as well as increased performance demand by the optical transport market.
Techcet's Michael A. Fury reports from the second day of presentations at ISS 2011: talks on cleantech and energy management, LEDs, capital efficiency, and creating value through semiconductor "differentiation."
AMD (NYSE: AMD) announced that its Board of Directors has appointed SVP and CFO Thomas Seifert as interim CEO following the resignation of Dirk Meyer as president, CEO, and a director of the company, effective immediately.
SEMI appointed Debasish Paul Choudhury to the position of president of SEMI India, effective January 15, 2011. Choudhury will succeed Sathya Prasad, who is leaving SEMI but will continue to participate as a member of the SEMI India PV Advisory Committee through the management transition.
The top 20 semiconductor firms paced at 11% growth in 1Q11, raking in $54.8B in sales, led by the usual suspects, according to rankings from IC Insights.
High performance and low power consumption are expected of today's chips and LEDs. Today's chip makers still expect to keep their costs down. The key to making this work, says Brian Trafas, KLAC, is yield optimization. Trafas, speaking at The ConFab 2011 in Las Vegas, touches on tool supplier/user collaborations as well.
Synaptics will develop reference designs incorporating Cambrios ClearOhm material as a transparent electrode in projected capacitive touch sensors, enabling a wide variety of clear, multi-touch solutions for electronic devices.
Small-sized OLEDs are mature, now that rapid adoption has occured in the mobile phone sector. With technical advances and mass production processes, larger-sized OLEDs will come to the fore, according to CCID Consulting. Advancements are needed in the areas of process equipment and driver IC technology for China to become an OLED leader. CCID and NanoMarkets summarize their OLED market assessments for China, Japan, and Korea.
Ultratech, Inc. (Nasdaq: UTEK) announced an Asia Technology Center (ATC) in Taiwan to develop processes for HB-LED manufacture on its Sapphire 100 lithography system.
Nanometrics Incorporated (Nasdaq:NANO), advanced process control metrology provider, launched the Mosaic II turnkey image-based overlay metrology solution for advanced high-volume IC manufacturing. NANO reports an initial delivery to a leading Asian memory customer.
Researchers from North Carolina State University have investigated the viability of a technique called spincasting for creating thin films of nanoparticles on an underlying substrate, creating materials with a variety of uses, from optics to electronics.
austriamicrosystems (SIX:AMS) conditionally released its advanced 0.18µm High-Voltage CMOS process technology "H18" to for volume production. It will be manufactured in IBM's 200mm Burlington wafer facility.
Defect source analysis (DSA) and spatial signature analysis (SSA) go beyond process control to determine where in the process defects are introduced, which defects are common from one process step to the next, how defects propagate throughout the production line, and defect signatures and causes. John Robinson, KLA-Tencor, offers examples of defects and how these can be missed or mis-identified, wasting wafers and time.
Applied Materials said it will acquire Varian Semi in a $4.9B deal. VSEA stockholders have now approved the buy.
LED fab growth was explosive in 2010, and it's not done yet: SEMI predicts a 40% increase in LED equipment spending for 2011. Nearly 30 LED fabs will come on-line this year. China is leading the pack, and nearing a majority share in LED equipment spending.
Crossing Automation received both new and follow-on orders for multiple 300mm Spartan Sorters. The orders were received from a single foundry customer and the systems will be installed in two of its leading-edge semiconductor manufacturing facilities for use in volume production.
President and CEO Stanley T. Myers has informed the SEMI International Board of Directors of his intention to step back from executive leadership of SEMI this year. An executive search team will immediately begin looking for his successor.
TCZ, Cymer Inc. (Nasdaq: CYMI) display equipment product division, received a volume order for the TCZ-1500B Gen 5.5 crystallization system from a leading Asian flat panel display manufacturer. This is TCZ's second volume order in 2011 and fourth tool customer.
Researchers at Eindhoven University of Technology have developed a replacement for indium tin oxide (ITO). This transparent, conducting film is produced in water, and based on electrically conducting carbon nanotubes (CNT) and plastic nanoparticles. The film currently provides a factor 100 lower conductivity than ITO, but this could rapidly change.
University of Maryland researchers found the Kondo effect in graphene without magnetic additives. With "defect engineering" of graphene, nanoscale magnetic sensors, magnetic storage, and magnetic random access memory applications could be possible.
Two keynote talks at The ConFab 2011 will address the impact of the ongoing disaster in Japan, including the state of Japan’s semiconductor manufacturing operations and the impact of lost production on the supply chain. Keenan Evans, the Senior Vice President for Quality, Reliability & EHS for ON Semiconductor, will give the keynote on the first day of the conference, May 16th. Bill McClean, President of IC Insights, will give the keynote on the second day, May 17th.
University of Illinois researchers found that graphene transistors have a nanoscale thermoelectric cooling effect that can be stronger at graphene contacts than resistive heating, lowering the temperature of the transistor.
Advanced solid state non-volatile memory (NVM) chips, which retain data when the power is off, are expected to see phenomenal growth in the next five years, says iRAP Inc. In 2010, the potential market for zero capacitor (ZRAM) was highest, but by 2015, it will be phase change memory (PCM, PC-RAM, PRAM, OUM) at the lead.
With escalating demand for larger fabs of Gen 8, Gen 8.5 and Gen 10, the liquid crystal display (LCD) and organic light emitting diode (OLED) manufacturing equipment market has witnessed a growth spur, which could last 7 years, says Frost & Sullivan.
Universal Display Corporation (NASDAQ: PANL) announced advances in the performance of its UniversalP2OLED solution-processible, phosphorescent OLED material systems for use with solution-based manufacturing processes (such as ink-jet printing).
Michael A. Fury looks at papers from the opening day of this year's MRS Spring meeting, including various takes on light-emitting devices, nanotubes for optoelectronic devices, and switching behavior of ultrathin films.
GT Solar International Inc. (NASDAQ:SOLR) introduced the ASF100 advanced sapphire growth system, which produces larger 100kg sapphire boules in the standard furnace chamber. Larger sapphire boules can enable lower costs for LED chips.
LED manufacturing processes lack the level of automation seen in the semi chip fab industry. Wafer size transitions are occuring rapidly, and thicknesses also vary. The forefront of LED fab, much like chip fab, is wafer level packaging, cluster tools for automation, and advanced substrate materials. Iain Black, Philips Lumileds, presents an overview of LED fabrication, device architectures, and markets for the end products.
Tom Morrow, EVP, Emerging Markets Group/Chief Marketing Officer, speaks at ConFab 2011 about the semiconductor market's rebound from March 11's Japan earthquake, emerging markets like LEDs, and the trade organization's standards program for 3D ICs.
The National Institute of Standards and Technology (NIST) George Mason University (GMU) researchers are studying the optimal characteristics of silicon nanowires and dielectric stacks for charge-trapping memory.
Ionizers can improve wafer back- and frontside particle performance in PVD processing tools by removing surface charges that hold electrostatically adhered particles. Controlling charges results in higher yields for chip manufacturers and improved tool performance. Viraj Pandit and Emery Kuo, Novellus Systems and Cheryl Avery, ION Systems show that the INOVA PVD system’s good particle performance (with good quality wafers) is made more robust with an ionizer installation (with marginal quality wafers).
BluGlass (ASX:BLG) has commissioned the foundry services of Rainbow Optoelectronics Materials Shanghai to provide device fabrication and processing services for the purposes of creating a nitride solar cell prototype designed by BluGlass.
KLA-Tencor (KLAC) debuted an automated inspection system for substrates and epitaxial wafers used in HBLED manufacturing. The Candela 8620 provides automated defect inspection for LED materials such as gallium nitride, sapphire, and silicon carbide, enabling enhanced quality control of both opaque and transparent substrates, faster time-to-root cause, and improved MOCVD reactor uptime and yield. Frank Burkeen, KLA-Tencor, discusses the Candela 8620 inspection system.
Speaking at SEMI’s Industry Strategy Symposium, Christian Dieseldorff, SEMI senior analyst, provided an in-depth look at fab construction, capacity, and capex in 2011 and 2012. In this podcast, Dieseldorff walks listeners through fab construction projects by region and device type (LED, non-memory, memory, etc.)
Researchers from North Carolina State University have now developed a new technique that reduces defects in the gallium nitride (GaN) films used to create LEDs, making them more efficient.
For the "more than Moore" domain, Leti researchers at IEEE’s IEDM 2010 focused on RF applications in the paper #2.6, "Engineered substrates and 3D integration technology based on direct bonding for future More Moore and More than Moore integrated devices." Laurent Clavelier, head of solar technologies department at Leti, discusses the RF research with Debra Vogler.
Steed Technology, thermal processing equipment provider for semiconductor, LED, and solar cell manufacturers, acquired all of the outstanding stock of Applied Technology Specialists, Inc. (ATSI), an advanced engineering firm that specializes in developing advanced pollution control equipment and technology. The merger will enable equipment integration and additional "green" consulting expertise at Steed.
GT Crystal Systems COO, Kurt Schmid provides details about the company's directional solidification process based on the heat exchanger method. Schmid observes that wafer manufacturers using MOCVD equipment will need to move to traditional semiconductor manufacturing technologies, which are based on 6"-diameter and larger size substrates.
The NH-ICC has attracted a $100,000 grant from the NHIRC to help commercialize semiconductor technology developed by startup Innovacene.
Displaybank reports that LG Chemical secured its number one position in the large-area TFT-LCD polarizer market for the second straight year, followed by Nitto Denko and Sumitomo Chem. For the large-area TFT-LCD polarizer market in 2010, these top 3 suppliers' market share exceeded 80% of the total market.
Eulitha AG and Dai Nippon Printing (DNP) say they have successfully patterned 4-in Si wafers with Eulitha's "PHABLE" technology, creating uniform photonic crystal patterns with 600nm period and hexagonal symmetry.
Common Platform Technology execs have declared that they will switch from a gate-first approach to a gate-last approach starting with the 20nm process technology node, essentially reversing their position for the past few years. Analysts told SST why the CPA had a change of heart, why it's not unexpected, and why other concerns will very soon overshadow this switchover -- and likely resurrect the debate.
Professor Kohei Itoh, who is developing quantum computers based on silicon semiconductors at Keio University's Faculty of Science and Technology, together with Dr. John Morton at Oxford University and others, successfully generated and detected quantum entanglement between electron spin and nuclear spin in phosphorus impurities added to silicon.
The imec multi-partner industrial R&D program on GaN semiconductor materials and device technologies focuses next-generation GaN power device and LED development. The collaboration between Dow Corning and imec will concentrate on bringing the GaN epi-technology on silicon wafers to a manufacturing scale.
Brewer Science launched the OptiStack system of advanced lithography products: a combination of materials, software and process support. In tandem, Brewer Science debuted the ARC 300 coating series, designed to work with OptiStack.
Editor-in-chief Pete Singer will gather 7 industry experts to discuss LED manufacturing technology advances that will be critical in dropping LED costs at the chip and packaged device level. Speakers from the Department of Energy, EV Group, Semilab AMS, Rudolph, SAFC Hitech, and more will cover metrology, yield, automation, and the semiconductor-to-LED facility transition.
Tabula will use the new capital to accelerate production of their 3PLD ABAX product family, expand customer and partner support infrastructures, and further next-generation product development in the rapidly growing programmable logic sector.
Key takeaways from Applied Material's analyst day meetings this week: Where wafer-fab equipment demand is strongest, how solar manufacturing technology can expand, and why tablet computers and electric vehicles are underpinning a resurgence in 200mm demand.
While semiconductor fab has always created nanoscale dimensions, a new class of nanomaterials -- graphene, carbon nanotubes (CNTs), nano-metal alloys, quantum dots -- behave radically differently than current materials. Nanotechnology promises higher-performance memory capacity and transistors in future semiconductors, says Giles Humpston, Tessera.
András Poppe, PhD, marketing manager in Mentor Graphics' MicReD division, discusses LED testing challenges, such as neglected power flux, LED cooling, and the gap between lab and real operating conditions.
Thermal Technology, crystal growth equipment and high-temperature furnace manufacturer, recently received 59 orders for their Model K1 90kg sapphire crystal grower from customers in Taiwan, Korea and China. In total, these growers will produce 5.2 million two-in-equivalents (TIE) per year.
NanoMarkets issued a report, "The Business Case for Indium Tin Oxide and Alternative Transparent Conductors," that addresses the viability of transparent conductor alternatives to indium tin oxide (ITO).
Veeco Instruments' new TurboDisc MaxBright GaN MOCVD multi-reactor system is poised to take advantage of what the company believes is an accelerated rate of LED TV penetration. The new system targets manufacturing of HB-LEDs and is capable of single- or multi-chamber layer growth.
Nanolasers grown directly on a silicon surface could be a starting point for better microprocessors, biochemical sensors, and other optoelectronic products. UC Berkeley researchers grew nanopillars made of indium gallium arsenide, a III-V material, onto a silicon surface at 400°C.
SPTS completed the acquisition of deep reactive ion etch (DRIE) technology and certain related assets from Tegal Corporation. In addition, the deal includes the transfer to SPTS of the capital stock and operations of Tegal France SAS.
On March 2, Solid State Technology and LEDs Magazine will co-host "Light and Color Measurement of Today's LED Technology," a free webcast sponsored by Konica Minolta Sensing Americas. The company's presenters will provide in-depth information on optical measurement techniques of LED technology, such as lighting, color theory, and LED structure.
United LED Shan Dong, UMC and Epistar JV, placed a multi-tool order for Veeco's TurboDisc K465i metal organic chemical vapor deposition (MOCVD) systems, to ramp HB-LED manufacturing.
The adaptive SMIF-LPT solutions offer cost-effective upgrades of non-SMIF tools to SMIF, thereby enabling the conversion of existing 200mm facilities for semiconductor manufacturing at technology nodes below 180nm.
The Optogan Group placed a multi-system order for Oxford Instruments' etch and deposition systems. These include PlasmaPro System133 ICP and PlasmaPro 800Plus RIE etch systems, and a PlasmaPro 800Plus deposition system.
Applied Materials Inc. (Nasdaq:AMAT) presented five companies with awards for helping Applied meet its strategic business goals in 2011.
The Global Semiconductor Alliance (GSA) shares financial reports on the top three emerging semiconductor industry companies of 2011, as voted by suppliers, customers, peers, and other members of the sector.
Philips Lumileds, solid state lighting (LED) maker, deployed Camstar Systems Inc.'s Manufacturing Execution System (MES) at all global sites in less than 12 months.
Scanning the latest reports from a quartet of Wall Street analysts, a number of key themes emerge explaining what's driving a MOCVD slump in 2011-2012 (and maybe beyond), and how and when the situation might improve.
TSMC's Board of Directors approved additional capital expenditures for advanced semiconductor manufacturing technologies and more 12" wafer capacity. The company also nailed down its R&D and 2012 capex budgets.
China lays out its five-year plan to phase out old bulbs and spur LED demand; and Taiwan leaders invoke painful memories of DRAM and LCD market squeezes to urge more support for their own LED industry.
Fabricated silicon parts for semiconductor and LED equipment use made up a $310 million market in 2010, according to the Techcet Group. By 2014, the market will reach $412 million.
Gallium nitride (GaN) based devices are launching for applications in defense, wireless infrastructure, CATV, satellite and power electronics markets, according to the Strategy Analytics GaAs and Compound Semiconductor Technologies Service viewpoint.
AIXTRON SE received an order from Jiangsu CANYANG Optoelectronics LTD. for four CRIUS II metal-organic chemical vapor deposition systems in a 55 x 2" configuration. All systems will be dedicated to the growth of high brightness blue LEDs.
One of two suitors to take a major stake in Korea's Hynix Semiconductor has bowed out of the running, leaving just one suitor for the planet's second-largest memory chipmaker in the latest push by creditors/owners to slough off some of the burden.
The viability of LEDs in outdoor applications will be a test for LED technology's competitiveness as a whole. Particularly in China, street lighting is the biggest sector for LED adoption. China is seeing problems with LED quality, while North America tends to see less-eventful LED integration.
Argonne Lab researchers have created an e-beam lithography process that boosts resist layers to eliminate the hard mask application. It results in more precise features and deeper etch for semiconductor, solar energy, and other products.
Rubicon Technology (RBCN) completed company-wide enhancements to its proprietary crystal growth furnaces, upgrading to Rubicon Furnace Version ES2-XLG3.0, which produces large-diameter sapphire material with greater automation and higher yields.
A rising LED surplus, slowed LED adoption, tighter credit in China, and other factors are converging to stall out MOCVD equipment installs in 2011. Once the LED oversupply is drained off, LED manufacturers will kickstart capacity expansions, likely in 2012, according to IMS Research.
CHAD Industries launched the WaferMate300-2SS sorter/stocker workcell with multiple customer installations. The compact wafer buffer modules each hold 150 wafers.
KLA-Tencor Corporation (NASDAQ:KLAC) launched the eDR-7000 electron-beam (e-beam) wafer defect review system for chip manufacturing at the 20nm device nodes and below.
Translucent launched its Si wafer templates commerically for GaN growth, and Bridgelux set a new Lumens/W record for Gan-on-Si LEDs.
Stanford researchers have combined two known topological insulators to create a new one, fabricated small plates with the new topological insulator, and gated them. The result is an insulator-based transistor.
University of Florida researchers developed a manufacturing process for quantum dot LEDs that is lower cost and higher volume than previous attempts, eliminating vacuum-based steps. The research spawned a start-up company: NanoPhotonica.
SEMICON Taiwan (Sept. 7-9) approaches, the island's most celebrated event for microelectronics manufacturing, coorganized by SEMI and the Taiwan External Trade Development Council (TAITRA), offers more than 60 programs and sessions and 550 exhibitors spanning the entire semiconductor value chain and related high-growth industries.
The IEEE Photonics Conference 2011, previously known as the IEEE LEOS Annual Meeting, will offer more than 550 technical presentations by the world
SEMI appointed Dennis P. McGuirk as president and CEO. He replaces Stanley T. Myers, who is retiring. McGuirk comes to SEMI from IPC -- Association Connecting Electronics Industries, where he led a globalization effort.
Tom Hausken, Strategies Unlimited, shares insights on LED growth, the gap between MOCVD purchasing and utilization, and the global distribution of LED manufacturing.
Scott Zafiropoulo explains Ultratech's business and positioning strategies in an interview at SEMICON West, including how the company weathers market cyclicality and prepares for a 450mm wafer-size transition.
China has develped government support infrastructure for LED manufacturing and consumption. LED production investments have rapidly escalated in China, and the country is the world's leading consumer of solid state lighting.
Doug Anberg, VP of advanced stepper technology at Ultratech, discusses the physics behind improvements in the company's new Sapphire 100E HB-LED tool in a video interview at SEMICON West 2011.
Samsung Venture Investment Corporation has become a shareholder in Novaled AG, high-efficiency OLED maker with expertise in synthetic and analytical chemistry.
The US DOE is accepting funding applications through December 15, 2011, for developers of solid-state lighting such as LEDs and OLEDs. Up to $10 million is available to research lower-cost manufacturing methods.
InstruTech released its Cold cathode Ionization vacuum gauge CCM501, which the company is calling its Hornet module. The CCM501 is a rugged Cold Cathode gauge based on double inverted magnetron technology. It measures pressures from 1 x 10-8 to 1 x 10-2 Torr.
Strategies in Light, an annual tradeshow on high-brightness LEDs and lighting hosted by Strategies Unlimited and PennWell Corporation, will take place February 7-9, 2012 in Santa Clara, CA. New this year, the conference will include a full parallel track on LED manufacturing.
Bridgelux closed an additional $15 million in financing to accelerate R&D and scaling of Bridgelux's gallium nitride on silicon (GaN-on-Si) LED chip technologies.
Rubicon Technology Inc. (NASDAQ:RBCN) will transition to on-premise aluminum oxide processing to better control the quality of its sapphire wafers, and reduce manufacturing expenses while ensuring a steady supply of raw materials for large-diameter wafers.
Optogan opened its LED production site in Landshut, Germany, planning to produce 1 billion chips/year initially.
While the market has currently softened, early-2011 momentum will carry the year's semiconductor silicon sales to a higher total than 2010, said Stanley T. Myers, president and CEO of SEMI, noting the figures are an industry record. Growth will continue at "modest levels" through 2013.
Several speakers at the recent OLEDs World Summit 2011 (9/26-28 in San Francisco) discussed the appeal of organic light emitting diodes (OLEDs) for large-format image displays, rising in appeal over liquid-crystal displays (LCD).
Revenues for HB-LEDs grew 108% to $11.2 billion in 2010, driven by applications in TV backlight units, according to Strategies Unlimited. The party is quieting down though, as expanding supply and a slowdown in overall TV demand in 2011 pushed LED prices drastically lower and squeezing out weaker makers.
Mentor Graphics Corporation (NASDAQ:MENT) completed a 20nm test chip tapeout with STMicroelectronics (NYSE:STM), overcoming low-power and double-patterning challenges.
The Semiconductor Industry Association (SIA) elected Freescale Semiconductor CEO Rich Beyer as its 2012 chairman. This will be the SIA's 35th year.
Imec and its project partners launched IMOLA (Intelligent light Management for organic light-emitting diode on foil Applications), tasked with making large-area OLED-based lighting modules with built-in intelligent light management.
DuPont has signed a technology licensing agreement allowing an Asian display maker to use DuPont process technology to make large AMOLED television displays at significantly lower cost than alternative technologies.
The University of Toronto's organic light-emitting diode (OLED) on plastic reportedly boasts the highest efficiency for plastic-based OLEDs to date, comprable to the top-of-the-line glass-based OLEDs.
GLOBALFOUNDRIES named Ajit Manocha its permanent CEO, chosen by the foundry's Board of Directors. He had served as interim CEO since June 2011.
Georgia Tech researchers have found that GaN LEDs get a significant efficiency boost from zinc oxide microwires. The piezo-phototronic effect charges LEDs' ability to convert electricity to UV light, which GA Tech believes is a first for the LED industry.
Printed electronics can improve existing electronics and energy applications, replacing non-printed layers in displays or increasing crystalline silicon photovoltaics efficiency, among other applications shared by IDTechEx.
The SST Editorial Staff recaps SEMI's recent Industry Strategy Symposium (ISS), and the Strategic Materials Conference (SMC) that followed, with this special report series available only on our website.
Intel expanded its four-year-running dominance of the microprocessor segment in 2Q09, widening its lead by nearly a point-and-a-half over AMD and topping a four-year high in market share, according to the latest numbers from iSuppli.
September 14, 2009 - A 2H09 rebound in the chipmaking equipment sector won't be enough to make up for the horrid performance in late 2008 andearly 2009, but analyst firm Gartner does see much better times in 2010 and beyond, according to its newly updated forecast.
A Delaware bankruptcy court has approved the sale of Electroglas' wafer probe assets, including name and trademarks, to private financial group EG Systems -- formed specifically for this purpose.
IQE plc has agreed to acquire UK compatriot NanoGaN, which offers processes and IP related to gallium nitride (GaN) materials and devices, in a deal worth up to £3.6M.
Things have picked up dramatically in the past few months, according to World Semiconductor Trade Statistics (WSTS) organization, which has hiked its outlook for various chip industry segments -- not just in 2010 but 2011 as well.
The success of semiconductor technology has been due to our choice of semiconductor material
Multilayer barrier coatings for flexible organic electronics
All electronic and optoelectronic devices require protection from the influences of the environment. A thin-film, transparent, and flexible moisture and gas barrier called Barix can be applied at low temperatures (e.g., <80°C). Although this type of barrier layer can be used in many applications, its attributes make it a key enabling technology for creating plastic flexible substrates...
Using AFM to enhance MOCVD-grown OE devices
Metal-organic chemical-vapor deposition has steadily progressed from small-scale materials research to a mass production technology, enabling such complex optoelectronic devices as laser diodes and ultrahigh-brightness light-emitting diodes...
Technology for deposition and patterning of OLEDs
VTE has been the leading technology for OLED production, but OVPD, IJP and LITI have the potential to drive display performance and manufacturing efficiencies in future device generations. For OLED technology to advance in FPD applications, its production technology must continue to achieve device performance advances and manufacturing cost reductions.
In situ measurements for reducing across-wafer CDU
Jason Tiffany, Infineon Technologies; Barney Cohen, SensArray Corp.
As linewidths approach 90nm node in volume production, post exposure bake (PEB) uniformity becomes a much larger component of the across-wafer critical dimension uniformity (CDU). In production, the need for PEB plate matching has led to novel solutions such as plate-specific dose offsets.