2.5D, 3D and Beyond - Bringing 3D Integration to the Packaging Mainstream will take place November 9 in Santa Clara, CA. The MEPTEC conference follows the trend of 3D and 2.5D packaging moving from roadmap to factory production.
ON Semi believes that its SANYO Semiconductor division's Thai operations in the Rojana Industrial Park have been severely damaged by Thailand's flood. Another facility in Bang Pa In, previously unaffected, is now flooded. ONNN says none of its employees in Thailand have been endangered by flood waters on-site.
Spansion Inc. (NYSE:CODE) will consolidate its 2 semiconductor assembly and test services (SATS) operations, closing its facility in Kuala Lumpur, Malaysia, to reduce costs by about $30 million annually.
Multitest debuted the Quad Tech concept, next-generation vertical contact technology with a barrel-less architecture.
Global Unichip Corp. (GUC; TW:3443) refined its business and technology model to become a full-service, flexible ASIC company. President Jim Lai refers to the model as GUC's branded Flexible ASIC Model, covering SoC integration, implementation methodologies, and integrated manufacturing.
ACM Research Shanghai, Ltd., introduced the integrated Ultra iSFP stress-free polishing (SFP) semiconductor manufacturing tool for 65-45nm copper (Cu) interconnects, improving through silicon vias (TSV) with better heat dissipation.
Levi & Korsinsky is bringing a class action lawsuit against OmniVision Technologies Inc. (NASDAQ:OVTI) on behalf of stockholders that allege that OmniVision failed to disclose properly the loss of an exclusive contract with Apple for image sensors, in-house production delays, as well as other counts.
EV Group (EVG) launched a suite of temporary bonding and debonding equipment modules that support ZoneBOND technology.
North Dakota State University, Fargo, researchers have developed a packaging technology using Thermo-Mechanical Selective Laser Assisted Die Transfer (tmSLADT) to reduce the size and cost of microelectronics packages.
Xilinx Inc. (Nasdaq:XLNX) began shipping its Virtex-7 2000T field programmable gate array (FPGA), a programmable logic device with 6.8 billion transistors: 2 million logic cells, a die-stack architecture, low power consumption, and a more flexible design than large ASICS and monolithic FPGAs.
Brewer Science Inc. and EV Group (EVG) will both commercialize ZoneBOND technology for temporary wafer bonding, thin wafer processing, and debonding applications.
Nanotech accelerator SVTC Technologies, wet chem equipment maker Amerimade Technology, and chemicals company Shanghai Sinyang Semiconductor Materials will collaborate on electroplating processes for TSV that are production-ready for advanced packages and MEMS.
NEXX Systems shipped a Stratus electrochemical deposition tool to Nantong Fujitsu Microelectronics Co. Ltd. (NFME), based in Jiangsu province, China. NFME will use the Stratus for copper pillar and RDL advanced packaging applications.
SUSS MicroTec, in partnership with temporary bonding adhesive maker TMAT, will deliver SUSS MicroTec's new-generation high-volume temporary wafer bond tool clusters to a leading IDM.
MVTS Technologies opened new offices in San Jose, CA; Penang, Malaysia; and Hsinchu, Taiwan to support growing demand for test, assembly, and other IC production equipment and services among semiconductor manufacturers.
ERS uncrated the ERS AirCool 3 wafer thermal test system with modular options and easy integration into all major wafer prober systems.
At the IMAPS 44th International Symposium on Microelectronics in Long Beach, CA, Voya Markovich, well-known industry PCB and packaging expert, took over the reins as the organization
Steven J. Adamson, marketing specialist with Nordson ASYMTEK, received the Daniel C. Hughes, Jr., Memorial Award, for the greatest contribution to IMAPS and the microelectronics packaging industry.
EV Group (EVG) will work with Fraunhofer IZM's ASSID research center to develop temporary bonding/debonding technologies for thicker die structures, some as large as 600
Cascade Microtech Inc. debuted InfinityQuad, a multi-contact probe head capable of automatically probing aluminum (Al), copper (cu), or gold (Au) pads as small as 30 x 50
All Silicon System Integration Dresden (ASSID) installed an Altatech 300mm CVD tool for dielectric film deposition on advanced through silicon vias (TSV), with diameters as small as 10
DuPont Microcircuit Materials, part of DuPont Electronics & Communications, uncrated its DuPont GreenTape 9K5 low temperature co-fired ceramic (LTCC) packaging material, offering good dielectric constant properties for higher speed, frequency, and reliability applications.
Test equipment provider Multitest installed a MT9928 XM Gravity Test Handler at a semiconductor production facility after a 1-year+ benchmarking against two major competitors.
Thanks to MEMS, 3D packaging, LEDs, power devices, and other applications, thinned wafers will be the majority of wafers in the market by 2016, according to Yole D
Analog Devices Inc. (ADI) introduced a packaging technology for digital isolators that achieves a minimum of 8mm creepage distance required by global industry standards to ensure safe operation in high-voltage medical and industrial applications.
Tamar Technology shipped its first fully automated WaferScan system to a major semiconductor fab. The system performs TSV etch depth, deep trench depth, wafer thickness, photo-resist thickness, and hole diameter metrology.
IMAPS 2011, the 44th International Symposium on Microelectronics, will take place in less than one week at the Long Beach Convention Center. Ahead of the show, here are some of the highlights for attendees.
Rudolph Technologies Inc. (NASDAQ:RTEC) shipped its Wafer Scanner 3880 3D Inspection System, multiple NSX Macro Defect Inspection Systems and its Discover Yield Management Software Suite to a leading semiconductor manufacturer for use in developing through silicon via (TSV) structures.
Amkor will acquire Toshiba Electronics Malaysia Sdn. Bhd., Toshiba
Samsung Electronics Co. Ltd. developed a high-performance 64GB embedded memory with 64Gb NAND. The package contains an 8 die stack in a low profile for smartphones, tablets and other mobile devices.
Seiko Epson Corporation introduced the IP-2000 inkjet semiconductor marking system to print identification data on the surface of a semiconductor package without the danger of damage from laser cutting
Cascade Microtech (NASDAQ:CSCD) completed the sale of its test socket manufacturing business for $550,000 to R&D Interconnect Solutions. Cascade's board of directors also authorized a stock repurchase program under which up to $2,000,000 of its common stock may be repurchased.
In a podcast interview with ElectroIQ.com, Ziptronix president & CEO, Daniel Donabedian, and company CTO, Paul Enquist, discussed both the Ziptronix wafer bonding technology and their partnership with Sony.
The SMTA will host conference events with Amkor, Research in Motion, and TechLead Corporation on package-on-package (PoP) 3D stacking at SMTA International (SMTAI), October 16-20 in Fort Worth, TX.
An IDM recently performed side-by-side comparisons of a Multitest Mercury test contactor and an "established contactor of an incumbent Asian competitor" during high-volume production package testing.
The annual Known Good Die (KGD) conference, taking place Nov. 10 in Santa Clara, CA, will address semiconductor die testing, assembly, manufacturing, and business challenges, with the tagline "KGD in an Era of Multi-Die Packaging and 3D Integration."
The 2011 iNEMI Roadmap, published by the International Electronics Manufacturing Initiative (iNEMI), includes a new chapter on MEMS and sensors, and an expanded chapter on packaging to include substrates discussions.
Tessera Technologies appointed Anthony J. Tether, Ph.D., to its board of directors. Tether is CEO of The Sequoia Group, and has held executive positions at DARPA and Ford Aerospace Corp., among others.
SEMI will hold the first-ever SiP Global Summit, September 7-9, co-located with SEMICON Taiwan. Three forums cover system in package (SiP) test, the "3D IC era," and the requirements of mobile electronics.
The Unifire 7900IR provides 3D inspection of wafer-scale packaging features as well as registration for wafer-to-wafer bonding applications for use in advanced wafer scale packaging process control.
Agilent Technologies Inc. (NYSE:A) expanded its mixed-signal and digital-storage oscilloscope portfolio with 26 new models that comprise its next-generation InfiniiVision 2000 and 3000 X-Series. Entry-level mixed-signal oscilloscopes and an integrated function generator are part of the 2 new product groups.
Minco Technology Labs, hi-rel semiconductor die processing, packaging and test provider, appointed board member Bill Bradford as president and CEO.
Samsung Electronics began producing embedded multi-chip package (eMCP) memory for use in entry- to mid-level smartphones. The products use low power double-data-rate 2 (LPDDR2) 30nm DRAM and 20nm NAND flash memory.
Hitachi Chemical filed a lawsuit against INNOX in Taiwan, alleging infringement on Hitachi Chemical's Taiwanese patent related to die bonding film used in semiconductor packaging processes.
Optomec opened its new and expanded Advanced Applications Lab and Product Development Facility in St. Paul, MN. The facility will help Optomec grow its Aerosol Jet additive manufacturing technology for advanced printed electronics applications.
The College of Nanoscale Science and Engineering (CNSE) and Applied DNA Sciences (APDN) are partnering to prevent the counterfeiting of computer chips.
Hesse & Knipps Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Wedge Bonding for RF and Microwave Devices" at the Advanced Technology Workshop and Tabletop Exhibition on RF and Microwave Packaging
Mitsubishi Heavy Industries launched a fully automated 12" (300mm) wafer bonding tool, Bond Meister MWB-12-ST, capable of producing 3D LSI circuits at room temperature. The 300mm bonder targets production of memory chips and MPUs.
Zymet introduced the CN-1736 reworkable underfill encapsulant for 0.4mm-pitch package-on-package (PoP) assemblies.
Increased I/O density, power/performance reqs, and other factors are increasing use of flip chip, 2.5D and 3D technologies, a boon to packaging subcontractors. But they face a challenge from foundries, and must navigate under-utilization of wire bonding capacity.
The SMTA released its call for presenters for SMTA International (SMTAI) 2012, October 14-18 in Orlando, FL. The association, along with Chip Scale Review magazine, also announced the keynote for the International Wafer-level Packaging Conference (IWLPC), held November 5-8, San Jose, CA.
Teledyne Microelectronic Technologies will expand its optical packaging portfolio in a partnership with Zephyr Photonics, which makes a proprietary high-temp vertical-cavity surface-emitting laser (VCSEL).
Packaging house Inari Berhad signed an MOU to acquire Amertron Global, which operates in the Philippines and China providing microelectronics and optoelectronics manufacturing services.
Multitest qualified its UltraFlat process for high parallel vertical probe card tests. UltraFlat provides permanent overall PCB flatness for better wafer-level test.
Hesse & Knipps Inc. introduced its next-generation BONDJET BJ93X heavy wire bonder for back-end semiconductor assembly, targeting manufacturers of power semiconductors and automotive electronics.
JEDEC Solid State Technology Association released a new standard for wide I/O mobile DRAM: JESD229 Wide I/O Single Data Rate. Wide I/O mobile DRAM increases die integration -- stacking chips with TSV interconnects with a SoC -- and improves bandwidth, latency, power, weight, and form factor.
Haruo Matsuno, president and CEO of Advantest Corporation (TSE:6857, NYSE:ATE) shares the company's major goals, including expansion into new measurement applications, utilization of cloud computing, and more.
STATS ChipPAC held the groundbreaking ceremony for a new factory in Singapore, which will enable STATS ChipPAC to expand its manufacturing capabilities for advanced wafer level technologies.
Tessera Technologies (TSRA) received a letter from Starboard Value and Opportunity Master Fund Ltd, intending to nominate 3 candidates for the TSRA Board of Directors. Tessera issued a response, saying that it has the right Board and management team in place.
NEXX Systems sold a 300mm Stratus electrochemical deposition (ECD) system to Powertech Technology for copper pillar bumps and re-distribution layers (RDL) fab, and possibly to make TSVs.
The benefits of 3D IC integration can be combined with aggressively scaled 22nm semiconductor devices, with More Moore (scaling) and More than Moore (package advances) developing in parallel but relatively independently, says Paul Lindner, EV Group (EVG).
FormFactor Inc. (NASDAQ: FORM) introduced TrueScale Matrix probe cards for 200mm and 300mm Full Wafer Contact system-on-chip (SoC) test applications.
Ron Huemoeller of Amkor presented in the Advanced Packaging session of Solid State Technology
As packaging has played a larger and larger role in chip performance, form factor, and capabilities, The ConFab has increased its focus on back-end processes. Cue
Aehr Test Systems (Nasdaq:AEHR) will install an additional FOX-1 full-wafer test system at a leading flash memory manufacturer.
Displaybank published a 2009-2014 analysis of LED packages, the finished LED components used in various applications. While LED package units will grow steadily through the forecast period, revenues will remain mostly flat from 2010 to 2013.
The New York State Center of Excellence in Small Scale Systems Integration and Packaging at Binghamton University (S3IP), and Applied DNA Sciences will develop new ways to embed and authenticate DNA on various substrates. This may involve marking semiconductor packaging, and exploring rapid-reading technologies to screen chips.
Xilinx Inc. (NASDAQ:XLNX) began shipping a 3D heterogeneous all-programmable FPGA, the Virtex-7 H580T FPGA, using its stacked silicon interconnect (SSI) technology to reach up to 16 28Gbps and 72 13.1Gbps transceiver bandwidth.
Mentor Graphics collaborated with Austria Technologie & Systemtechnik (AT&S) to implement AT&S Embedded Component Package (ECP) process in Mentor Graphics
Ziptronix Inc. is helping a 3D memory device maker replace standard die stacking with its DBI wafer-stacking technology, which has been proven in image sensor packaging.
New Japan Radio Co. Ltd. adopted Tanaka Denshi Kogyo KK
Increased demand for product functionality is driving up IC packaging revenue faster -- a 9.8% compound annual growth rate (CAGR) -- than IC unit growth -- 7.3% CAGR 2010-2016, says New Venture Research (NVR).
Rudolph Technologies Inc. will deliver 14 NSX Series 320 inspection systems to a large outsourced semiconductor assembly and test (OSAT) provider.
Advanced Semiconductor Engineering Incorporated (ASE) opened its Phase 3 manufacturing facility in Weihai, Shangdong province, China, boosting discrete packaging and test capacity.
THE BEST rankings from VLSIresearch identify the highest-rated suppliers of wafer processing, assembly, and test equipment. The top 2 test equipment suppliers were just fractions apart in the rankings.
Mitsubishi Electric Corporation developed a prototype forced-air-cooled three-phase 400V output inverter with all-silicon carbide (SiC) power modules and direct lead bonding that has a power density of 50kVA per liter.
Applied Nanotech Holdings Inc. uncrated the THERCOBOND family of highly thermally conductive bonding and printed materials for power electronics and photonics packaging.
Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds.
Invensas Corporation, Tessera subsidiary, debuted bond via array (BVA) technology, an ultra-high-I/O PoP semiconductor packaging alternative to wide-I/O TSV packaging.
Bhavesh Muni took the helm as global business director for the Advanced Packaging Technologies business of Dow Electronic Materials, covering Dow's semiconductor packaging materials product portfolio and its manufacturing capabilities.
Amkor Technology Inc. (NASDAQ:AMKR) plans to build a state-of-the-art factory and global research and development center in the Incheon Free Economic Zone, which is located in the greater metropolitan area of Seoul, Korea.
In 2012, the global IC substrate market will reach a value of USD8.67 billion, according to Research in China
Mixed-signal IC maker Silicon Laboratories Inc. (NASDAQ: SLAB) introduced a microcontroller (MCU) die sales program with a minimum order quantity of 1 wafer.
The ASM iHawk Xpress Opto Wire Bonder from backend semiconductor assembly equipment supplier ASM Pacific Technology offers new innovations in transport, copper-wire bonding, and automatic rethreading.
Kulicke & Soffa broke ground on its Singapore global headquarters expansion, near the current leased headquarters location. A state-of-the-art facility in Serangoon will bolster the company
Heraeus introduced its high-reliability composite aluminum/copper (CucorAl) semiconductor bonding wire, which offers strong mechanical and electrical bonds to semiconductor pads, with good thermal properties.
Dave Rose, Keithley Instruments, addresses specific cabling techniques for DC, multi-frequency capacitance, and ultra-fast I-V and pulse testing, as well as the importance of proper grounding and shielding, choosing the proper interconnect for a specific measurement, and troubleshooting common interconnect problems.
Agilent Technologies Inc. (NYSE: A) enhanced the memory depth of its Infiniium oscilloscope lineup. All 30 models now ship with the industry's deepest standard memory and offer the deepest memory options, according to the company.
The development effort involves the integration of defect inspection with a debonding tool. Manufacturing efficiencies, along with the ability to handle ultra-thin wafers, necessitates the integration of inspection in de-bonding applications. Rudolph is bringing its inspection technologies to this three-way collaboration to provide this integrated process control solution.
Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers machined high-frequency center probe test sockets to accommodate IC devices with a lead pitch of 0.30mm.
The trend toward complex semiconductor devices is fueling demand for more advanced wafer probe cards capable of accurately and cost-effectively testing these ICs, says January Kister, Microprobe. Kister examines the variables that impact current carrying capability (CCC) during semiconductor wafer test, and describe an optimal probe design with a composite metal structure.
KLA-Tencor Corporation (Nasdaq: KLAC) introduced the ICOS CI-T620, a high-performance component inspector system for tape and reel. The CI-T620 system has dual tapers working sequentially with minimal operator intervention to increase units per hour.
TeraView and HELIOS are partnering to improve semiconductor package failure analysis using terahertz technology. The technology was originally developed with Intel and isolates faults in advanced 3D semiconductor packages.
Docea Power, power and thermal analysis software supplier, released AceThermalModeler for generating compact thermal models of SoCs, 3D ICs, SiP devices, and complete boards.
Nemotek Technologie uncrated a two-element wafer-level camera, Exiguus H12-A2. The two-element lense gives Exiguus H12-A2 high resolution and low (<0.5%) distortion.
With thermal issues accounting for half of all lighting failures, and costs prohibitive to widespread adoption, assembly and packaging are keys to improving LEDs. TechSearch International tracks LED packaging materials and methods, as well as reliability and package efficiency.
Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.
The 2012 IMAPS Device Packaging Conference will take place March 6-8 in Fountain Hills, AZ, with Amkor's Dr. Robert Darveaux presenting "Escalating Challenges in Developing Complex Solutions for Next Generation Package and Interconnect Technologies."
iNEMI will hold the industry kick-off for its 2013 Roadmap in an open workshop immediately following IPC APEX EXPO in San Diego, CA, March 1-2.
Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges.
Backend packaging equipment supplier Hesse & Knipps Inc. opened a West Coast Demo and Applications Laboratory at its manufacturer rep Chalman Technologies.
Engineered Material Systems released the DA-5045-2 and DA-5045-4 high-thermal-conductivity die attach adhesives for LEDs and small power semiconductor die packaging.
Amkor (NASDAQ:AMKR) shared that it cut costs through workforce reductions in Q4 2012, and announced a voluntary retirement program in Japan to continue this initiative.
Synova SA formed an OEM agreement with its partner Makino Milling Machine Co. Ltd., wherein Makino will manufacture Laser MicroJet (LMJ) tools based on Synova technology.
BTU International Inc. won multiple orders for PYRAMAX solder reflow ovens from semiconductor assembly and test subcontractors (SATS) in Asia.
Kyocera America, Inc. doubled its flip chip assembly capacity for microelectronic devices with a $3.5 million Class-10,000 cleanroom, offering lead-free processes in San Diego.
Rudolph Technologies (NASDAQ:RTEC) delivered the first MetaPULSE metrology system to measure under bump metallization (UBM) and redistribution layers (RDL) in advanced package manufacturing.
SUSS MicroTec launched the XBC300 Gen2 high-volume 3D wafer processing tool for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers.
X-FAB Silicon Foundries, a More-than-Moore semiconductor foundry, has used SFT's R3D (Resistive 3D) software for its 0.18
3M launched a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced electromagnetic interference (EMI).
Multitest launched its tri-temp 16-site pick-and-place platform, MT9510 x16, with an installation at a high-volume chip test site in Asia.
STATS ChipPAC decided not to resume semiconductor assembly operations in its Thailand plant, owing to extensive equipment and facility damages sustained during the disastrous floods in 2011.
CEA-Leti launched a major new platform, Open 3D, that provides industrial and academic partners with a global offer of mature 3D packaging technologies for their advanced semiconductor products and research projects.
Tanaka Denshi Kogyo K.K., of Tanaka Precious Metals, will establish a production subsidiary for manufacturing copper bonding wire in Taiwan, with manufacturing ramp on February 1.
Keithley Instruments Inc. upgraded the capabilities of its Automated Characterization Suite Test Environment to ACS Version 4.4. The software is used with several Keithley instrument and system configurations for automated device characterization and reliability analysis.
2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device flow sensor that uses Ticona's Vectra E840i LDS laser-activated LCP for electronic circuits. The Vectra E840i forms circuits on 3D injection moldings produced with an LDS process.
Presto Engineering, integrated semiconductor test and product engineering services provider, opened its newest Hub to serve the semiconductor design community, in Israel.
The USPTO is looking to increase the diversity of honorees for its annual National Medal of Technology and Innovation (NMTI), honoring "this nation's creative geniuses."
Sony has developed a backside-illuminated CMOS image sensor that layers the pixel section with back-illuminated structures over the chips containing signal processing circuits, instead of using supporting substrates.
Dr. Phil Garrou reports from the 2nd annual Georgia Tech 2.5D Interposer Conference: what's the market projection for silicon and glass interposers, what's preventing high-volume manufacturing, and is there a crossover with flat-panel display glass manufacturing?
Alchimer SA says it is seeking partnerships with various semiconductor equipment and materials companies as it welcomes two top execs: Bruno Morel is the company's CEO since May of this year, and product development director Fr
Deca Technologies has introduced a new chip-scale packaging (CSP) product line for applications where its existing wafer-level CSP option isn't a good fit. Details and analysis to come.
Texas Instruments' MicroSiP module is the first embedded die package in high volume production. Yole D
Altera Corporation will use an exposed-die molded flip chip technology from Amkor on its 28nm Arria V FPGA. Amkor
Imec developed a via-middle approach to through-silicon via (TSV) manufacturing for 3D packaging, using wafer thinning and a silicon etch process to reveal TSV contacts on the wafer.
Teradyne uncrated its Magnum semiconductor test system with a proprietary scalable chassis design and tester-per-board architecture for high compound parallel test efficiency on consumer digital devices.
LTX-Credence Corporation (Nasdaq:LTXC) released the Diamondx test platform for ASSP and the DragonRF for RF device test. In addition, LTX-Credence launched a SerDes test instrument and new testing software.
TEL will acquire semiconductor packaging equipment supplier NEXX Systems. NEXX makes advanced deposition equipment, including ECD and PVD tools, for wafer-level packaging (WLP).
Amkor Technology Inc. (Nasdaq: AMKR) added Mike Liang as president of Amkor Technology Taiwan. Liang's background includes stints with Phoenix Semiconductor, Ti-Acer, UMC, and others.
Presto Engineering selected an LTX-Credence Corporation (Nasdaq:LTXC) X-Series platform for testing wireless communications, automotive and industrial customer devices.
Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity TSV etch tool for 200mm wafers.
EV Group (EVG) welcomed Shin-Etsu Chemical into its open platform for temporary bonding/debonding materials supporting 3D semiconductor packaging.
ULVAC Inc. developed solder deposition processes for silicon device manufacturing, including power devices, that sputters solder to deposit it rather than printing or evaporating the materials. The 2 processes eliminate gold, or gold and nickel, from the step.
Dr. Phil Garrou, a contributing editor and regular blogger on Solid State Technology, shares the highlights of an Evolving 2.5D/3D Infrastructure panel he hosted at IMAPS Device Packaging. On the table: where TSVs and interposers are made, a TSV/interposer timeline and cost analysis, and the requirements of mobile electronics.
Kulicke & Soffa Industries Inc. (K&S, NASDAQ:KLIC) introduced its ConnX Plus high-speed ball bonder for low-pin-count semiconductor packaging.
Kulicke & Soffa launched the LUMOS Capillary for LED die wire bonding. The capillary can bond with gold or gold-alloy wires and uses a new TG ceramic material for better workability.
Kulicke & Soffa Industries Inc. (K&S, NASDAQ:KLIC) launched its AccuPlus Hub Blades product line, customizable blades for discrete wafer dicing.
AGC (Asahi Glass Co. Ltd.) developed ultra-high-speed processing technology for micro hole drilling of 0.1mm-thin glass, targeting leading-edge applications such as 3D semiconductor packages.
Surrey NanoSystems raised third-round funding of
Applied Materials Inc. (AMAT) opened the new Centre of Excellence in Advanced Packaging at Singapore
Henkel developed LOCTITE UF3810 underfill for high reliability and ease of rework when applied to next-generation wafer-level chipscale packages (WLCSP) and package-on-package (PoP) devices.
DfR Solutions installed micro testing tools from XYZTEC for JEDEC qualification, dynamic bend testing, copper wire bond pull and shear testing, and material characterization of lead-free solders.
STATS ChipPAC Ltd. (SGX-ST:STATSChP) uncrated its next-generation eWLB package-on-package (PoP) technology, with a package profile height below 1.0mm.
"Together, FCI and NANIUM offer a complete WLP service portfolio covering 150, 200 and 300mm wafer sizes," summarized Armando Tavares, NANIUM president of Executive Board.
Plessey Semiconductors developed the Electric Potential Integrated Circuit (EPIC) sensor, optimized for use as an ECG sensor, at a reportedly lower cost and better resolution than conventional electrodes. It enables ECG monitoring in mobile phone applications.
Multitest launched a new Quad Tech contactor, the Triton contactor, for high-end digital test applications such as server, computer, mobile smartphone, digital TV, and graphics chips.
WACKER expanded and relocated its South Korea technical laboratories and offices, bringing together R&D operations, applications technology, and basic and advanced training in silicones and polymers applications.
Applied Materials and Singapore's A*STAR Institute of Microelectronics will officially open the Centre of Excellence in Advanced Packaging, in Singapore
Lockheed Martin scientists have developed a new "nanotechnology" copper-based solder that it says will produce joints with up to 10
With the approach of full commercial production of 3DIC products, Dr. Phil Garrou shifts his attention to thermal performance questions and proposed thermal solutions for the future.
Fraunhofer IZM's All Silicon System Integration Dresden (ASSID) center will add SPTS' etch and PECVD process capabilities to investigate low-temperature dielectric films for through-silicon vias (TSV) in 3D IC packaging.
The advent of leading-edge semiconductor packaging technologies dictates efficient use of capital, and only the top-tier semiconductor assembly and test services (SATS) companies will have the financial wherewithal to develop required expertise and capacity, says one analyst.
Nanium says it has shipped its 200 millionth embedded wafer-level ball grid array technology (eWLB) component, a 10% year-over-year productivity increase that reflects full conversion to the company's eWLB overmold technology that allows thinner and more robust packages.
Tessera Technologies is giving CEO Robert A. Young a big financial incentive to spin off one of its two businesses by March 2015, one of the company's key long-term strategic goals.
Researchers at the Karlsruhe Institute of Technology (KIT) say they have developed a novel optical connection process for semiconductors using "photonic wire bonding" that achieves data transmission rates of several Tbit/sec.
SPTS' Delta fxP cluster system achieves low-temperature deposition of TEOS oxides and nitrides for via-reveal passivation in 3D IC packaging, solving two key problems of low temperatures and bonding adhesive outgassing.
EV Group's updated modular EVG150 high-volume coater/developer adds new modules for conformal coating of high topography surfaces, and coating surfaces with vertical sidewall angles, such as through-silicon vias (TSV).
An unidentified "premier global industry research center in Asia" will use Rudolph Technologies' MetaPulse G metrology system in its advanced packaging process development activities.
Ultra Tec Manufacturing has released a new endpoint detection module for its ASAP-1 IPS selected area preparation system, for improving electronic package decapsulation and sample preparation.
Microsemi says its new die packaging technology, targeting implantable medical devices such as pacemakers and cardiac defibrillators, can be paired with an ultralow-power radio for wireless health monitoring.
The US SEC adopted a rule that requires companies to publicly disclose their use of conflict minerals -- including tantalum, tin, gold, and tungsten -- that originated in the Democratic Republic of the Congo (DRC) or an adjoining country.
New work from Stanford goes beyond simple bump shear testing to allow simulation of stresses exerted on chips during semiconductor packaging. The researchers are able to explore how the stresses affect back-end structures. Alex Hsing, a PhD student in Professor Reinhold Dauskardt's Group at Stanford University, summarizes the group's approach.
Sonoscan has demonstrated the single-scan imaging of a sample at 50 different depths, or gates, a technique called PolyGate. It reveals how features, including defects, change from one gate to the next.
Advanced Thermal Solutions, ATS, has released the iQ-200 thermal analysis system for precisely and simultaneously measuring the temperatures of solid materials and the surrounding air, as well as tracking air velocity and air pressure at multiple points to comprehensively profile heat sinks, components, and PCBs.
Keithley Instruments Inc., advanced electrical test instruments and systems provider, introduced the Model 2651A High Power System SourceMeter instrument to characterize high-power electronics, like HB-LEDs, power semiconductors, DC-DC converters, batteries, etc.
Research and Markets released "Wafer Packaging Fab Database," providing a global overview over 150 companies' 250+ mid-end semiconductor packaging houses.
Rogers Corporation's (NYSE:ROG) Board of Directors elected Bruce D. Hoechner as the materials company's new president and CEO, effective October 3, 2011. Hoechner's past positions were with Rohm and Haas and Dow Chemical.
X-RAY WorX GmbH introduced electronically controlled venting valves for open X-ray tubes. This avoids the manual venting typically performed during X-ray tool maintenance.
The first annual Global Interposer Technology Workshop at Georgia Tech will convene students, academics, researchers, and industry to share information on silicon and glass interposers for semiconductor packaging.
IRphotonics added a high-resolution FLIR thermal imaging camera to its application engineering lab. The camera will be used to analyze heat distribution during iCure use.
Invensas Corporation, a Tessera subsidiary, will demonstrate dual-face down implementation of its new multi-die face-down packaging technology at the Intel Developer's Forum. The multi-die package is wire bonded, mounting ICs upside down and staggering them in a shingle-like configuration.
EV Group (EVG) launched a new flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system throughput 26% to 18-20WPH with enhanced automation capabilities and low-temperature processing.
Forget "3D stacking" -- the two companies say a special electronic "glue" applied to the wafer will help stack dozens of chips into a "silicon skyscraper" that will be much faster and more efficient than current chip technology.
Alchimer's AquiVia film-deposition technology promises to cut fill deposition times and cost even with complex through-silicon via (TSV) 3D packaging structures. The product targets TSV ramp-up at production levels, according to the company.
The PDC concept on the Multitest MT2168 uses sensor-based alignment in the standard pick-and-place processes to reduce small package misplacements and test system jams.
STATS ChipPAC Ltd. completed the expansion of its 300mm wafer bump and wafer-level chipscale packaging (WLCSP) operation in Taiwan.
Nanotechnology accelerator SVTC Technologies partnered with SUSS MicroTec on wafer-level packaging for MEMS, and 3D IC bonding technology development.
Microsemi SoC Products Group will use outsourced semiconductor assembly and test (OSAT) provider Amkor Philippines (ATP) for final electrical package test on nearly all its products.
Fujikura Ltd. and FlipChip International LLC (FCI) released ChipletT and ChipsetT embedded die packages for single die or multi-die semiconductor packaging applications.
Backside-illuminated image sensors require more precise wafer processing -- uniform extreme wafer thinning, dopant control, epitaxy growth, trench manipulation, etc. -- but the payoff in image quality is significant. Researchers at imec experimented with different wafer fab technologies to make a record BSI sensor. They also consider new architectures/packaging techniques for this technology.
LED lighting maker Gem Hsin Electronics reduced the size of heatsinks in its LED products by drilling miniscule holes beneath LEDs. The holes allow heated air to escape the LED package.
OSRAM Opto Semiconductors increased its IR Power Topled with lens optical output by 80% over the standard version by integrating a thin-film chip. The IR LED maintains the same surface area and drive current.
Deca Technologies, a new company backed by Cypress Semiconductor and SunPower, will combine solar wafer manufacturing methods with semiconductor manufacturing support to create wafer-level chipscale packaging (WLCSP) derivatives.
Invenios developed a 3D Direct Write laser patterning technology for microelectronics packaging that integrates optical, mechatronic, and housing functionalities into the package substrate.
PVA is introducing the PVA6000 flexible coating and dispensing tool with new features based on customer feedback to improve accessibility for maintenance and improve ease of use.
SEMATECH has created an online 3D Standards Dashboard, allowing 3D semiconductor and MEMS interconnect professionals to exchange standards activity information.
Amkor will convert all of its 19mm through 31mm body size plastic ball grid array (PBGA) packages to pin-gate molding (PGM) over the next few years.
Nordson Corporation will honor the life of Steven J. Adamson, former Nordson ASYMTEK marketing specialist and electronics industry mentor, by funding a $3,000 annual scholarship in Adamson's name with the IMAPS Educational Foundation.
Multitest's Mercury contactor passed a "thorough BGA test evaluation," landing on the qualified contactors list for all business units of an international IDM.
Amkor Technology Inc. (NASDAQ:AMKR) honored 7 companies with its 2011 Supplier Award, for substrates, materials, and equipment.
Henkel will launch several new electronics assembly materials at Productronica, November 15-18 in Munich, Germany. The new HYSOL underfill is a halogen free, reworkable epoxy capillary underfill with a high Tg.
Henkel will launch several new electronics assembly materials at Productronica. The ABLESTIK ICP-4000 has been qualified to bond components to metal leadframes in plastic housings.
MOSAID launched the 256Gb HLNAND2 semiconductor memory device, operating at up to 800MB/s per channel for mass storage applications. Winpac will package and distribute HLNAND devices for MOSAID.
Sonix Inc. introduced its Molded Flip Chip Imaging (MFCI) enhancement. Sonix MFCI improves image quality and defect detection in molded flip chips and packages with polyimide (PI) layers.
Multitest's ECON contactor exceeded 4.5 million insertions at an Asian test house. The contactor performance resulted in a 99% stable test yield.
Mentor Graphics (MENT) says many of its EDA customers are designing, verifying, manufacturing and testing integrated circuit products using multi-die vertical stacking technology, 3D-IC. The company is deploying a multiple-component Tessent design-for-test product line for integrated multi-die hierarchical scan and built-in self-test methodologies.
Xradia has unveiled its latest micro computed tomography (CT) 3D X-ray imaging system, the VersaXRM. Kevin Fahey, PhD, VP of marketing at Xradia, discusses how the new platform uses geometrical magnification in tandem with an X-ray microscope.
Henkel Electronics released 2 formulations of Ablestik C100 conductive die attach film for leadframe packages, including QFNs. It eliminates die tilt, processes thin wafer die, and enables bondline control.
Sonix Inc., scanning acoustic microscope designer and manufacturer, introduced its Stacked Die Imaging (SDI) enhancement, which effectively inspects for defects in semiconductor stacked die and wafer level packages (WLP) by selectively increasing the ultrasonic signal gain for deeper interfaces of interest.
Honeywell Microelectronics will use Tezzaron's 3D stacking on Honeywell
Kulicke & Soffa Industries Inc. (NASDAQ:KLIC or K&S) named Chin Hu Lim to its Board of Directors, also serving on KLIC's Management Development & Compensation Committee.
Arteris Inc., network-on-chip (NoC) interconnect IP company, will incorporate its FlexNoC NoC interconnect IP into an SoC die on silicon interposer test chip with TSMC.
Singapore's A*STAR IME and 3D IC developer Tezzaron Semiconductor signed a research collaboration agreement to develop and exploit advanced through silicon interposer (TSI) technology.
Tokyo Electron Limited (TEL) launched a suite of 3D packaging tools: the Tactras FAVIAS TSV deep-silicon etch system; the TELINDY PLUS VDP film deposition tool; and the wafer bonder/debonder Synapse Series.
Tokyo Electron Limited (TEL) has successfully demonstrated dynamicing -- device switching/dynamic characteristic (AC) -- of a power device at the wafer level.
At the recent Global Interposer Technology workshop at Georgia Tech, Xilinx and TSMC discussed 2.5D chip packaging technologies and others touted the potential of glass as an interposer substrate material, reports Dr. Phil Garrou.
Technic Inc. is entering the last development phase on technologies to reduce gold consumption in electronics packaging and connector applications, a product group it will call "Goldeneye."
SUSS MicroTec launched the XBS300 temporary bonder for high-volume wafer manufacturing. The Bond Cluster is configured to temporarily bond 200mm and 300mm wafers for 3D integration applications as well as other processes that require thin wafer handling.
Brewer Science Inc. will offer the ZoneBOND process on equipment supplier SUSS MicroTec's XBC300 and XBS300 wafer bonding platforms.
Using the advanced through-silicon via (TSV) fabrication process at IBM (NYSE:IBM), Micron Technology Inc. (NASDAQ:MU) will begin producing its Hybrid Memory Cube. The companies claim that this is the first CMOS design to go commercial with TSV interconnects.
International Rectifier (IR) purchased multiple Apollo physical vapor deposition (PVD) systems from packaging equipment maker NEXX Systems for its Newport, Wales fab.
The Institute of Microelectronics, a research institute of Singapore's A*STAR, plans to commercialize key innovations in silicon photonic chips designed to support high-speed, high-bandwidth optical communications.
Dainippon Screen Mfg. Co. Ltd. developed the DW-3000 direct imaging exposure system for next-generation semiconductor packaging, exposing complex 3D multilayer substrates while adjusting for warping and distortion of individual wafers.
OSRAM Opto Semiconductors introduced the Oslon Square LED for lighting applications, packaged enclosed in a reflective layer to boost light output.
SATS provider STATS ChipPAC Ltd. (SGX-ST:STATSChP) was named "Supplier of the Year" by Cirrus Logic Inc. (NASDAQ:CRUS), analog and mixed-signal processing components maker.
Hynix Semiconductor Inc. exercised the renewal option in its March 31, 2005 license agreement with Tessera Technologies Inc. (NASDAQ:TSRA) to extend the term of that license to May 22, 2017.
ChipMOS subsidiary ThaiLin Semiconductor Corp. will take on dedicated semiconductor testing capacity for a new long-term service agreement with its client Asahi Kasei Microdevices Corporation (AKM).
At the 22nm node, die fragility and challenging interconnect materials will necessitate foundry collaborations with packaging houses, co-designing silicon and package, asserts E. Jan Vardaman, TechSearch International.
Newport Corporation (NASDAQ:NEWP) will acquire ILX Lightwave Corporation, which makes high-performance test and measurement products for laser diodes and other photonics components. Newport will pay $9.3 million in cash.
The Global Semiconductor Alliance released "3D IC Architecture: A Natural Evolution," a report sponsored by Macronix International and Etron Technology. GSA also published the 2nd edition of the 3D IC Design Tools and Services Tour Guide.
Small, mobile, Internet-connected devices are bucking the slow economy and use advanced packaging technologies to pack an enormous amount of functionality into a very small form factor, notes New Venture Research, which provides forecasts for each advanced packaging device type.
Amkor Technology Inc. (Nasdaq:AMKR), semiconductor assembly and test services (SATS) provider, has shipped more than 100 million units of its Through Mold Via (TMV) package-on-package (PoP) products.
Yole identifies the fan-in wafer-level chipscale packaging (WLCSP) market for strong growth, and a diverse base of chip technologies. Fan-in WLCSP reached 2.3 million 300mm-equivalent wafers shipped in 2011, or about $1.7 billion in revenue.
Aries Electronics debuted AR4HT Series chipscale package (CSP) test sockets that accept any area-array device for testing up to 200
AVX Corporation has ensured that all its tantalum powder and wire suppliers are fully compliant with the independently audited Conflict-Free Smelter Program (CFS).
Powertech Technology Inc. (PTI) has approved a tender offer of NT$25.28 per share for the common shares of Greatek with a minimum acquisition target of 30% of outstanding shares.
Quik-Pak, a division of Delphon Industries, is performing copper wire bonding on a Kulicke & Soffa (K&S) Maxum Ultra wire bonder. Available wires include bare copper and palladium-coated copper.
Licensing company Rambus Inc. (Nasdaq:RMBS) is engaging with the Industrial Technology Research Institute (ITRI) in Taiwan on the development of interconnect and 3D packaging technologies.
IPC and JEDEC created
CHAD Industries integrated its WaferMate300-1 automated wafer handling workcell with Nordson DAGE's 4300 Bond Shear inspection tool, allowing for hands-off 300mm handling and bond shear inspection.
Semiconductor packaging materials will be a $22.8 billion market this year, and should grow to $25.7 billion by 2015, says SEMI and TechSearch International.
inTEST will acquire the assets and certain liabilities of Thermonics from Test Enerprises. inTEST's Temptronic Corporation, of the Thermal Solutions Group, will integrate the company.
Mentor Graphics Corporation (NASDAQ:MENT) has combined technologies for thermal characterization and simulation with T3Ster hardware test products and its FloTHERM software, enabling better heat management in power semiconductor packages, such as LEDs.
Rudolph Technologies debuted the NSX 320 Automated Macro Inspection System for through silicon vias (TSV) and other advanced package process inspection, edge trimming metrology, wafer alignment for bonding, and inspection of sawn wafers on film frames and other TSV-related processes.
The AccumaxDirect premier vertical probe card from Wentworth Laboratories withstands "severe test parameters" in high-volume flip chip/C4 test. It was just approved for use with Verigy testers.
FormFactor (NASDAQ:FORM) introduced its new generation of the SmartMatrix 300mm full wafer contact probe cards for DRAM device test. The SmartMatrix 100XP probe card uses FORM's MicroSpring 3D MEMS contact technology and increases probe card parallelism to over 850 die, enabling single touchdown DRAM wafer test.
Agilent Technologies Inc. (NYSE:A) released the B2900A Series line of compact benchtop source/measure units (SMU) for semiconductor, component, and materials testing. The company claims that these SMUs offer capabilities competitive with semiconductor device analyzers.
Cascade Microtech Inc. (NASDAQ: CSCD) released WinCalXE version 4.5 calibration software, with improved model and process quality. WinCalXE 4.5 contains the features of WinCalXE and SussCal, and operates with all manual and semi-automatic Cascade Microtech and former SUSS MicroTec probe stations.
Rudolph Technologies (NASDAQ: RTEC) released the Wafer Scanner 3880 to inspect micro and standard bumps, through silicon via (TSV) post-via-fill copper protrusions (nails) and re-distribution layers (RDL) used in 3D IC packaging.
Multitest, a designer and manufacturer of final test handlers, contactors and load boards, now provides extended temperature control with its extended temperature calibration (XTX) on the MT9510 test handler.
Cascade Microtech (CSCD) launched a WLCSP probe card series that retains pin position, scales from x1 to x8 on a per-die basis, and can be configured for individual die testing. The Viper series will be used for high-volume test to qualify known good die (KGD).
The U.S. Court of Appeals for the Federal Circuit issued a favorable ruling in Amkor's appeal in its patent infringement case against Carsem and affliates before the U.S. ITC, Amkor reports.
iNEMI is starting a new convergence project on semiconductor packaging equipment requirements, and is seeking input from the industry.
Tessera received an initial payment of approximately $20 million from semiconductor packaging company Amkor, related to the interim award issued by the International Court of Arbitration of the International Chamber of Commerce (ICC).
Deca Technologies, wafer-level packaging (WLP) services to the semiconductor industry, added Iain Meikle as VP of operations and managing director in the Philippines.
Hesse & Knipps Inc. will demo a new 3mil wire bonding capability on its BJ935 automatic heavy wire bonder for back-end semiconductor packaging at IMAPS in San Diego.
Tessera appointed Rick Neely, Jr. as EVP and CFO, responsible for the company
The Hybrid Memory Cube Consortium released the initial draft of the Hybrid Memory Cube (HMC) interface specification, with the final version planned for end of 2012.
Kulicke & Soffa Industries, Inc. (K&S, NASDAQ:KLIC) appointed Irene Lee to the role of chief quality officer. Lee will oversee quality assurance functions across Kulicke & Soffa
Monolithic Power Systems (MPS) implemented yieldWerx Semiconductor Test and Yield Management tools. MPS required a robust and centralized system for effective storage, analysis, and sharing of testing and product data received from multiple foundries, assembly, and testing facilities in the US and Asia.
Researchers at National Cheng Kung University (NCKU) in southern Taiwan developed a tin/zinc/silver/aluminum/gallium solder alloy for semiconductor packaging, which was tested by ASE.
Heavy monsoons moving through the Philippines are causing floods in and around Manila, the capital. The Philippines is a small but growing area for microelectronics manufacturing and packaging facilities.
Multitest, semiconductor test equipment supplier, added a 2D code reader option to its MT2168 pick-and-place test handler, for package test customers that require 100% device traceability and lot integrity.
Henkel Electronic Materials developed a new underfill system designed to reduce flip chip package stress by controlling die and substrate warpage, LOCTITE ECCOBOND UF 8840.
Tektronix Component Solutions, a custom microelectronics services provider, tapped supply chain aggregator MOSIS to help its customers develop complete, high-performance ASICs with lower early-stage ASIC development costs.
Agilent debuted its compliance test application, Agilent N6462A DDR4, for systems using DDR4 memory.
Zuken updated its CR-5000 design software to version 14, with greater collaboration in FPGA development and targeting high-speed design. Many enhancements have also been included in CR-5000 Lightning, Zuken
Unisem named Lee Hoong Leong as group COO, replacing Ang Chye Hock, who has retired. Lee brings experience from UTAC, STATS ChipPAC, TI, and National Semiconductor.
Park Electrochemical plans to cease operations at its Nelco Technology (Zhuhai FTZ) Ltd. facility in Zhuhai, China. Nelco products include microwave and RF component substrates, printed circuit materials, and advanced substrates such as BT.
FlipChip International (FCI), wafer-level packaging and flip chip bumping provider, named Weng Kay Lui as Asian sales director, overseeing sales for, among other areas, FCI's recently expanded FlipChip Millennium (Shanghai).
Mesuro, semiconductor testing and services provider, raised
Cascade Microtech introduced the modular MPS150 manual wafer probe station with six application-specific test packages for RF, mmW, and I-V/C-V measurement; failure analysis; and high-power device characterization.
Henkel Electronic Materials added LOCTITE ABLESTIK CDF 200P to its conductive die attach film offering. The pre-cut film is available in 150mm and 200mm diameter sizes for easy wafer-form matching. The film is both a dicing tape and die attach tape.
Dr. Phil Garrou, contributing editor, shares Nanya Technology
Cascade Microtech Inc. (NASDAQ:CSCD), supplier of wafer-level measurement instruments for ICs, held its first Innovation Awards Ceremony to honor inventors, authors and other innovators at the company.
ASM Pacific Technology Limited noted in its H1 2012 results a record level of orders for leadframes in Q2. It also delivered what it calls the largest leadframe packaging set up to date.
SEMI Europe will host a new event, the European 3D TSV Summit, January 22-23, 2013 in Grenoble, France. This inaugural meeting will revolve around the theme: "On the Road towards TSV Manufacturing," denoting how device designers and manufacturers are crossing from 2D packaging to 3D for more functionality in a smaller form factor.
STATS ChipPAC appointed Gary Tanner as a member to its Board of Directors. Tanner brings experience from Zarlink Semiconductor, Intel, Texas Instruments, and other semiconductor companies.
Global Semiconductor Alliance (GSA) recently named Jay Esfandyari, STMicroelectronics, as its MEMS Working Group chairman and Ken Potts, Cadence Design Systems, as the 3D IC Working Group chairman.
3D TSV chips will represent 9% of the total semiconductors value in 2017, according to Yole D
Kyocera Industrial Ceramics Corporation, Chemical Sales Division introduced the environmentally friendly XKE-G5633 Epoxy Molding Compound (EMC) for BGA and LGA package encapsulation.
STATS ChipPAC presented its annual Supplier Awards to its top supplier partners for their excellent performance and outstanding support in 2011. Supplies are scored on technology, quality, delivery, responsiveness, service, and cost competiveness criteria.
SEMI's Collaborative Alliance for Semiconductor Test released a Docking and Mounting Generic Terminology Guideline document that can be used to improve the
Ziptronix Inc., which develops direct bonding technology for advanced semiconductor applications, has licensed its technology for a high-volume cellular handset application.
Sonoscan introduced a simulator software, SonoSimulator, that enables stacked die makers to check nondestructively for delaminations between layers. SonoSimulator software is now a standard feature on the Gen6 C-SAM acoustic microscope.
Jennifer Wrigley and Robert Bellinger, Olympus, share insights on SEMICON West
Nordson MARCH uncrated the FasTRAK Plasma System at SEMICON West. The automated, high-throughput vacuum plasma treatment system processes leadframe strips, laminate substrates, and other strip-type microelectronic components.
At SEMICON West, the working groups of the International Technology Roadmap for Semiconductors (ITRS) outlined 2012 updates to the roadmap. Check out the back-end process info here.
SemiProbe has developed proprietary technologies awarded a patent by the United States Patent and Trademark Office. The Probe System for Life allows the company and users to configure test and inspection systems that meet unique requirements usually served by custom products.
The group will work on standard terminology and reference points for the mechanical interfaces of probers, handlers, testers, dockings, contactors and load boards. All companies that use or supply test equipment are invited to actively contribute.
Wire bond inspection system maker Viscom introduced software tools for its very high resolution (VHR) camera module, which has the ability to provide exact measurements of balls and wedges. With this technology, 25-µm gold thin-wire wedge sizes can be measured with a standard deviation of 1 µm. In addition to inspecting qualitative characteristics of wire bonds, balls and wedges statistical evaluation and trend analysis of critical geometric dimensions can also be performed in the production process.
Multitest designed differential contactors that are customized for each semiconductor test application. The selection of the contactor materials and probes are optimized for the desired impedance.
Mark Allison, VP, Strategic Marketing, Verigy Ltd., points out that the economic downturn helped promote the outsourced semiconductor assembly and test (OSAT) model, which pushes test platforms into more configurable models.
MicroProbe Inc., supplier of wafer test technology to the global semiconductor industry, released the MEMS-based Mx-FinePitch (Mx-FP) probe card. The test card series targets ultra-fine-pitch testing of leading-edge SoC and logic devices found in applications like digital cameras, set-top boxes and digital TVs.
Multitest expanded the portfolio of its Singapore spare parts distribution center for pogo pin-based test contactors. With this step, all major spare parts for semiconductor package test handlers and contactors are now available for fast delivery to Asian package test sites.
Cascade Microtech (NASDAQ: CSCD), supplier of production probe cards with signal integrity for multi-site die testing, released S-Technology, which provides a unique mechanical architecture for Pyramid probe cards to consistently deliver evenly distributed contact force for solder bump technologies in die tests.
Picotest released a new family of Signal Injectors, or adapters, to improve voltage regulator, LDO, and power supply testing accuracy. Increased bandwidth and higher resolution measurements are enabled for PSRR, stability, crosstalk, reverse transfer, input impedance, Bode plots, and crosstalk tests along with non-invasive ICT for load transients, stability and output impedance.
Nordson DAGE, a subsidiary of Nordson Corporation (NASDAQ: NDSN) and provider of bond testing technology, introduced Paragon intelligent bond testing software for semiconductor packaging.
Users of WIN's GaAs foundry services can engage in wafer-level and package test in Silicon Valley, CA, and Grenoble, France.
The phoenix nanotom m, from GE´s Inspection Technologies business, has been developed for high resolution and high precision X-ray computed tomography (CT) in non-destructive 3D analysis and 3D metrology.
LTX-Credence (LTXC) introduced the ASLx, a new test system extending the capabilities of the ASL low-cost analog and mixed-signal test platform. ASLx provides 4x the analog and digital pin count and 5x the power capability of the ASL1000.
MicroProbe, wafer test technology supplier, is extending its direct-dock offering to support Advantest's T2000 SoC test platform. The T2000 platform-compatible option enables test coverage at wafer sort. More than 100 direct-dock probe cards are already in the field.
The test community is embracing 3D ICs, as evidenced by presentations at the first IEEE International Workshop on Testing 3D stacked ICs that addressed a range of test challenges and solutions, reports Dr. Phil Garrou.
The Burn-in & Test Socket (BiTS) Workshop will take place March 7–10, 2010 at the Hilton Phoenix East/Mesa Hotel in Mesa, AZ. More than 30 papers and posters will be presented; participants include end users and suppliers of sockets, boards, burn-in systems, handlers, and packages; and other related equipment, materials, and services. The TechTalk session on PCB design, fabrication and assembly is booked full, as is the tutorial on RF socket characterization by Gert Hohenwarter, Ph.D. of Gatewave Northern Inc. Here are some of the show highlights.
At the ITRS 2012 update, back-end technologies session, at SEMICON West, roadmapping for More than Moore was addressed as both a philosophical and technical matter.
SEMATECH qualified EVG's GEMINI automated wafer bonding system through its Equipment Maturity Assessment implemented within SEMATECH's 3D Interconnect program and ISMI's EMA team.
MicroProbe introduced current-carrying capability of >1A/probe in 90
The bulk of packaging falls under the
ULIS invested EUR20 million in a new state-of-the-art facility to meet increasing market demands for IR technology, with a move to 200mm wafers and pixel/wafer-level packaging techniques.
Ultratech formed 'exclusive supplier' and 'preferred tool vendor' agreements with several top-tier advanced packaging companies around the world.
STATS ChipPAC brought its fcCuBE advanced flip chip semiconductor packaging technology with copper column bumps, bond-on-lead interconnection, and enhanced assembly processes into high-volume manufacturing for multiple customers.
Multitest installed the first Multitest Plug & Yield integrated hardware set up for testing 3D semiconductor packages at a customer. The Plug & Yield design enables highly parallel electrical in-process test of stacked dies during the assembly process of 3D packages.
USHIO Inc. is introducing the large-field stepper lithography tool
Xilinx will invest $50 million to expand its electronics engineering operations, located at the company
EVG introduced the EVG 850TB/DB automated temporary bonding and debonding system built on the company's new XT Frame platform, which has been optimized to support thin-wafer processing for high-volume 3D IC and TSV manufacturing.
Electro Scientific Industries Inc. (ESI, NASDAQ:ESIO) received multiple-unit orders for its model 3510 test system from leading Japanese and Korean MLCC manufacturers.
Seiko Epson launched the NX1032XS pick-and-place IC test handler, boasting high throughput for transferring, inspecting, and sorting semiconductors.
Tessera received notice from Powertech Technology Inc. (PTI) that it will terminate its license agreement with the semiconductor packaging and optics technology company. Tessera also completed phase 1 of its acquisition of camera module technologies from Flextronics.
UNISEM relaunched its business model with the name
Ultratech acquired IBM patents on semiconductor packaging technologies, including C4 bumping, ball grid array (BGA) methods, lead-free solders, and 3D packaging.
Solid State Technology is hosting 3D and 2.5D Integration: A Status Report, sponsored by EVG and ALLVIA, and is free for all attendees. This preview shares a sneak peek at
Solid State Technology is hosting a free webcast, 3D and 2.5D Integration: A Status Report. A fourth presenter has just been announced, Brent Przybus, Senior Director, Product Line Marketing, Xilinx Inc.
Dow Corning will collaborate with SUSS MicroTec on a temporary bonding process (materials and equipment) for through-silicon vias (TSV) in high-volume advanced semiconductor packaging.
Solid State Technology will present 3D and 2.5D Integration: A Status Report on June 27, free for all attendees. William Chen, ASE, will join speakers David McCann, GLOBALFOUNDRIES and E. Jan Vardaman, TechSearch International.
SEMICON West is taking place July 10-12 in San Francisco, CA. Following are new products for semiconductor packaging and test that will be at the show, from wafer bonders to LED die attach materials.
DELO introduced the DELOMONOPOX AD268 epoxy resin to meet the low-cost, reliable-attach needs of RFID device makers. The anisotropic, electrically conductive adhesive provides fast cure at chip attach, and is designed for flip-chip RFID packaging, as well as other packaging applications.
Pure-play foundry Shanghai Hua Hong NEC and test equipment supplier Advantest co-developed a wafer-level, multi-site parallel test scheme for RFID semiconductor devices that meets industry-standard ISO 14443 guidelines.
Signetics Corporation approved plans to purchase additional semiconductor assembly process equipment -- wafer grinders, wafer saws, die attach tools, and wire bonders -- to grow its packaging capacity for mobile chips.
STATS ChipPAC Ltd. (SGX-ST: STATSChP) marked the milestone of 1 billion copper wirebonded semiconductor units shipped.
Attendance was high at this year's Electronic Component Technology Conference (ECTC) in San Diego. Sandra Winkler is senior industry analyst at New Venture Research and IEEE/CPMT Luncheon Program Chair, shares the key trends in ECTC's sessions, like WLP, 2.5D, LED packaging, and more.
Anritsu will demonstrate its broadband Vector Network Analyzer (VNA), which conducts single sweeps from 70kHz to 140GHz during wafer probe test, at IMS, showcasing a new 0.8mm connector.
The LL leaded laminate copper-moly-copper base packages dissipates heat from high-power compound semiconductor devices, such as gallium nitride, gallium arsenide, and silicon carbide chips.
UltraSource Inc. announced CopperVia, a process that fills vias with pure copper to yield low-cost, high-conductivity, reliable electrical and thermal interconnects in ceramic thin film circuit substrates.
ESCATEC added package-on-package (PoP) capability at its Heerbrugg, Switzerland, facility, adding a dipping unit for ball grid array (BGA) packages on its Siplace assembly line.
Terepac Corp. will produce high volumes of its proprietary micro circuits for Rockwell Automation, supporting the "Internet of Things" with RFID tags. Rockwell Automation will support the infrastructure that Terepac uses, enabling it to miniaturize significantly more circuits than its current capability.
Semiconductor assembly tool maker Kulicke & Soffa (KLIC) named Pui Yee Lee as VP and corporate treasurer, reporting to SVP and CFO Jonathan Chou.
The Full Service Foundry business unit of ams extended its dedicated test solutions for foundry customers, offering known good die (KGD), with customers' complex analog/mixed-signal ICs 100% electrically tested according to their own test specification.
Advantest is developing a line of fully automated and integrated test and handling solutions for TSV-based 2.5D and 3D packages. The concept model test cell, DIMENSION, integrates a high parallel test cluster along with singulated die and 3D die stack automated handling capabilities.
Multitest has made its InCarrier Loader/Unloader available in a variety of configurations, e.g. for loading from tube, bowl, tray and for unloading into tube, bulk or metal mag in any combination.
Day 3 of the 15th IITC (International Interconnect Technology Conference) opened in San Jose, CA under clear sunny skies and a pleasant breeze. The herd thinned a bit, down to ~150 hearty souls from the original 230 the prior two days.
The Multitest next-generation MT9928 bowl feed module, which passed the strict QA and production approval requirements of an international IDM, is a gravity feed handler with a variety of loading and unloading options. With a throughput of up to 14,500 uph, the bowl feed loading module is the loading option of choice for small package sizes during semiconductor test.
Through the Component Test organization of Sypris Test & Measurement, Maxtek now provides component testing, including electrical and package integrity testing, COTS up-screening, qualification, and characterization. These complement Maxtek's full-custom ASIC design, package development, assembly, and test services.
Taiwanese subcon ASE has ordered "multiple" tools for backend inspection from Rudolph Technologies, illustrating a trend to incorporate real-time process control into advanced backend fabrication processes.
X-RAY WorX presented its new concepts for the cooling of high resolution microfocus X-ray tubes. The company offers a new, modular cooling concept with an optimized internal cooling of the target inside the tube head.
Cascade Microtech Inc. (NASDAQ: CSCD) announced new programs to drive down ownership costs and provide customers with increased access to experts in probe technology. The new programs involve direct sales channels and a repair program, among other efforts.
Global Industry Analysts released a report analyzes the global market for IC sockets in US$ Million by dual in-line memory module sockets, production sockets, test/burn-in sockets, and others. Regional IC sockets markets are analyzed as a consolidated whole with no granular level breakup offered by product group/segment. Annual estimates and forecasts are provided for the period 2006 through 2015.
Aries Electronics, manufacturer of interconnection products, now offers a CSP test socket with a window that optically exposes 100% of the top of the device under test (DUT) for failure analysis (FA) testing for emission microscopy (EMMI) or optical sensor applications.
Asia-based ASM Pacific Technology (ASMPT) Group, a supplier of semiconductor assembly, bonding, and packaging equipment, will integrate with the SIPLACE organization in Europe.
Sales of semiconductor probe cards grew 17% in 2011, reaching $1.17 billion, VLSIresearch reports. While short of a record, 2011 was one of the probe card sector
Semiconductor packaging and test services provider Carsem will assemble and test LED packages, partnering with a key customer and applying semiconductor packaging technologies for better LEDs.
GaN Systems and Arkansas Power Electronics International will co-develop a high-temperature, high-performance package optimized for gallium nitride (GaN) transistors and diodes.
Nitto Denko Corporation approved a transfer of its semiconductor encapsulating materials business to Hitachi Chemical Co. Ltd.
Multitest introduced the ecoAmp Kelvin contactor for high-power device test of 500+ Amperes. It meets the needs of high voltage/high current test with high thermal and mechanical stability.
The top three outsourced semiconductor assembly and test services (OSATS) providers raised 2012 capex during their earnings reports, from initial plans announced in January, report analysts at Citi.
After pioneering low-cost wafer- and panel-based glass and silicon interposers in Phase 1 of its SiGI consortium, Georgia Tech Packaging Research Center is beginning Phase 2 in June.
At its Fab 8, GLOBALFOUNDRIES is installing a special set of production tools to create TSV in 20nm wafers. 3D die stacking of leading-edge chips will enable mobile and consumer electronics.
Nordson ASYMTEK uncrated the NexJet System for jetting, with a newly designed jet cartridge and new software control for semiconductor packaging applications.
NXP Semiconductors released the new SOT1226 "Diamond" package using a
EoPlex Limited, a subsidiary of ASTI Holdings Limited, Singapore, will open a new factory for its xLC semiconductor package technology in Q2 2012, in Malaysia.
Aeroflex will supply manufacturing test technology for radio frequency (RF) devices at Qualcomm customers, under a new licensing agreement with Qualcomm.
Semiconductor packaging service provider STATS ChipPAC Ltd. (SGX-ST:STATSChP) appointed Pasquale Pistorio as a member of the Board of Directors, effective immediately.
Silex Microsystems brought its Met-Via full-wafer-thickness TSV technology into Chip Architectures by Joint Associated Labs for European Diagnostics, where it is being used to create cost-effective molded chip-level packaging with through metal vias.
Ultratech, lithography and laser-processing system supplier to semiconductor manufacturers and packaging providers, added Michael C. Child to its Board of Directors. Child served on Ultratech
ChipMOS TECHNOLOGIES INC. (ChipMOS Taiwan), purchased a 393,173sq.ft. building adjacent to its existing facility in Southern Taiwan Science Park.
Micro Control Company uncrated the HPB-5C High-Power Burn-In System, with variable airflow control for active thermal control of each device under test. The HPB-5C provides individual temperature control to each device under test.
WLCSP start-up Deca Technologies might take over SunPower Corp.'s Fab 1, when the solar photovoltaics supplier consolidates its Philippine manufacturing operations to Fab 2 this quarter.
DARPA gave Raytheon an 18-month, $1.8 million contract to develop next-generation GaN devices on diamond substrates, named Thermally Enhanced Gallium Nitride (TEGaN). The diamond packaging boosts GaN power handling capability by at least 3x.
DELO introduced DELOMONOPOX die attach adhesives, promising strong mechanical/environmental protection, low-temperature cure, and compatibility with various substrates.
Georgia Tech's Packaging Research Center proposes a new consortium on 3D semiconductor packaging called 3D ThinPack for ultra-miniaturized 3D heterogeneous, RF, digital and power modules in partnership with global companies.
Invensas Corporation, a wholly owned subsidiary of Tessera, unveiled a DIMM-IN-A-PACKAGE multi-die face-down (xFD) packaging architecture for memory semiconductors in low-profile devices.
Agilent launched Express Test for ultra-fast, high-precision nanomechanical testing on thin films, low-k materials, composites, and more. It allows 100 indents on 100 surface sites in 100 seconds.
Endicott Interconnect Technologies has appointed David W. Van Rossum to the position of Chief Financial Officer, effective immediately.
CEA-Leti and passive component maker IPDiA developed an atomic layer deposition (ALD) process to apply medium-k dielectric layers on a metal-insulator-metal capacitor architecture, enabling 3D capacitors.
ON Semiconductor (Nasdaq: ONNN) will develop a next-generation star tracker CMOS image sensor with the European Space Agency. The sensor will be used in star trackers, sun sensors and other scientific applications.
Rogers Corporation (NYSE: ROG) shared an update on its restructuring and streamlining initiatives, which are expected to save about $13 million (annualized savings) by Q4.
MOSAID Technologies Inc. is sampling a 16-die stack NAND Flash device operating on a single high-performance channel, the 5126Gb HLNAND.
Georgia Tech's Packaging Research Center is adding ultra-fine-pitch interconnect, thermal reliability, and more to its work on silicon and glass interposers for 2.5D semiconductor packaging.
Mereco Technologies' METADUCT 1202 is an electrically conductive silver epoxy adhesive for lead attachment cold soldering, chip bonding, and leadframe bonding applications.
Ferro Electronic Materials expanded its LTCC portfolio, adding a line of cost-effective matched materials. The L8 LTCC system claims better performance over a greater range of frequencies and easier manufacturability.
Terepac Corporation, developer of tiny digital electronics, has launched the TereTag miniaturized circuit design that is embedded in items to enable the "Internet of Things."
Bruker Corporation acquired all of the shares of SkyScan NV, a scientific instruments company serving materials science and life sciences/pre-clinical imaging needs.
Yamaichi developed a test adapter with the European Design Centre, suitable for test and programming of embedded modules such as Qseven or MXM.
Amkor Technology Inc. granted SHINKO ELECTRIC INDUSTRIES CO., LTD. (Tokyo:6967) a non-exclusive license to its proprietary Through Mold Via (TMV) semiconductor packaging technology.
SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.
Cypress Semiconductor transferred 7 back-end semiconductor package assembly lines from its Philippines facility to Chinese packaging subcontractor Jiangsu Changjiang Electronics Technology Co.
Texas Instruments Incorporated (TI, TXN) now offers bare die in quantities as low as 10 pieces for initial prototyping, and larger quantities (full waffle trays) for production volumes.
Camtek Ltd. sold $3.5 million of Falcon inspection tools to a global outsourced semiconductor assembly and test (OSAT) provider, for various applications in the backend assembly process.
Synopsys is combining several products into a 3D-IC initiative for semiconductor designers moving to stacked-die silicon systems in 3D packaging. The 3D-IC initiative will bring in leading IC design and manufacturing companies to work with Synopsys on a comprehensive EDA solution.
Research organization imec introduces important changes to its ultrathin chip packaging (UTCP) technology, increasing yields 15-20%.
Keithley Instruments introduced the Model 2657A High Power System SourceMeter instrument, adding high voltage test to its line of high-speed, precision source measurement units for power semiconductors.
The global semiconductor materials -- wafer fabrication and packaging materials -- market increased 7% in 2011 compared to 2010, with record revenues of $47.86 billion, said SEMI.
Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.
The Global Semiconductor Alliance (GSA) released its GSA Q1 Wafer Fabrication & Back-End Pricing Reports, tracking fab utilization rates, wafer and mask costs, and package pricing.
Sensors in Design 2012 was opened March 28 at the San Jose McEnery Convention Center, in conjunction with Design West. Blogger Mike Fury reports.
RED Micro Wire (RWM), a subsidiary of RED Equipment, announced a new high-quality copper wire featuring glass insulation for use in semiconductor wire bonding.
Applied Materials will host its annual Analyst meeting this week (March 28). Barclays Capital shares its expectations for AMAT's update and the wafer fab equipment (WFE) outlook in general.
The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.
SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.
CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its CVD and gas control equipment assembly, and unifying its nano-materials lab.
SiGen developed its second-generation production system for fabricating thin-silicon solar wafers, as well as HB-LED, and 3D semiconductor packaging wafers. The system tailored for silicon, GaAs, germanium, SiC, GaN and sapphire materials.
Execs from Samsung, IBM, GlobalFoundries and ARM looked to the future at The Common Technology Platform Forum in Santa Clara. They focused on the innovation pipeline for 20nm and 14nm technology nodes, and the role that EUV, FinFETs, TSVs, CNTs and DSA will play.
Worldwide sales of semiconductor manufacturing equipment totaled $43.53 billion in 2011, representing a year-over-year increase of 9%, shows SEMI. North America surpassed Taiwan as the region with the highest amount of spending.
Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the second day: OLED TFT displays, single transistor DRAMs, silicon photonic wires, CNTs, 3D optical interconnects, graphene for RF and sensing, transparent ZnO, epidermal electronic systems, stretchable electronics, ultra-low-k dielectrics, patterning of electroceramics, PRAM (an alternative to NRAM), and inkjet printing of superconducting films.
The 2012 Symposia on VLSI Technology and Circuits, this June in Honolulu, HI, will foster joint interactions among device technologists and circuit/system designers with overlapping technical programs of both symposia, and joint focus sessions on important topics.
Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse looks at the growth areas for test.
Core Wafer Systems, subsidiary of Action Products International, upgraded its PDQ-WLR on-wafer accelerated reliability product line to version 7.0, designed specifically for Agilent Technologies' Parametric Testers.
Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufacturing fabs, pilot lines, and major R&D organizations.
Theta Delta will incorporate Core Wafer Systems technologies into its burn-in test and long-term reliability test systems for semiconductors. Core Wafer Systems provides parallel measurement schema for semiconductor test.
For the first time, Apple Inc. has publicly published a list of over 150 companies that the electronics giant says represent 97% of its procurement expenditures for materials, manufacturing, and assembly of products worldwide.
Camtek launched Xact200, a transmission electron microscope (TEM) sample preparation system for the semiconductor industry. Camtek calls the system an alternative to FIB analysis.
Art Zafiropoulo of Ultratech shares predictions for 22nm: that everyone will be using gate-last fabrication, that there may be a mid-node at 20nm, and that TSVs and 450mm wafers will play an important role at the new node.
Solid State Technology asked top analysts and technologists to provide insights on the transition to 22nm semiconductor devices. Read through the whole 10-forecast series, or check out the individual articles as you have time to see perspectives on lithography, device architecture, and more.
While Apple's release of the iPhone 4S in Q4 2011 "unleashed tremendous pent-up demand" from consumers, Samsung used its broad range of smartphones to take the top spot, reports IHS.
Test Advantage Capital Group, a business of BSE Group, surpassed $150M in its portfolio of semiconductor manufacturing equipment under management. Boston Semi Equipment's fab equipment leasing business also received a $100M annual commitment from its financial backer, Wafra Capital Partners.
SEMATECH experts reported on innovative processes for advanced CMOS logic and memory device technologies and 3D TSV manufacturing at the International VLSI Technology, System and Applications Symposium (VLSI-TSA).
Toshiba Corporation (TOKYO: 6502) will rebuild its semiconductor manufacturing operations in Thailand by relocating Toshiba Semiconductor Thailand Co., Ltd. (TST) to a new manufacturing facility.
Hexagon Metrology released the Optiv Classic 321GL tp benchtop vision-measuring metrology system for the North American market. It suits electronics and precision parts inspection, including micro-holes, fiber optics, filters, and more.
Texas Instruments awarded 15 of its 12,000 suppliers with Supplier Excellence Awards for delivering outstanding service and support, based on cost, environmental responsibility, technology responsiveness, assurance of supply, and quality.
The 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2012) will be held May 15-17 in Saratoga Springs, New York. The conference will feature presentations of more than 85 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features a panel discussion on “Competing for R&D Dollars,” moderated by Solid State Technology Editor-in-Chief Pete Singer.
Intel Corporation announced 9 winners of the company's Supplier Continuous Quality Improvement (SCQI) award for outstanding commitment to quality and performance excellence.
Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- κ dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.
The ConFab 2012, an invitation-only global conference and business meeting on semiconductor manufacturing, June 3-6 in Las Vegas, selected speakers and sessions for 2012.
Intel Corporation announced its 2011 Intel Preferred Quality Supplier (PQS) awards, selecting 19 of its thousands of suppliers. Two suppliers received Intel’s Achievement Award.
Shin-Etsu Chemical Co. Ltd.'s new KER-7000 Series silicone encapsulating materials offer a low (1.38) refractive index (RI) for HB-LED packaging with lower gas permeability and higher transparency.
Wright Williams & Kelly, Inc. (WWK) opened its 2012 semiconductor industry survey on equipment and process timing. Only participants will receive the full results, free of charge.
A leading, US-based IDM ordered about $5 million of front- and back-end semiconductor automatic optical inspection (AOI) tools from Camtek Ltd.
Solid State Technology is proud to announce that David McCann will speak at The ConFab 2012. David, the Senior Director for Packaging R&D at GLOBALFOUNDRIES in Malta, New York, will speak on the evolution toward silicon-based interconnect and packaging, which is having profound impact on how we think about technology development and the supply chain.
CMOS image sensors (CIS) are breaking sales records again, after several years without upward momentum, reports IC Insights. New portable systems and embedded imaging are lifting CIS to $6.3 billion in 2012 and new record sales each year through 2016.
Elpida Memory Inc. (Tokyo: 6665) resolved to file a petition for the commencement of corporate reorganization proceedings, and filed the same with the Tokyo District Court. Akita Elpida Memory Inc. also saw the commencement of corporate reorganization proceedings
In this series, CMC Laboratories describes a new LED-grade AlN and what it accomplishes as a ceramic substrate. The AlN offers better heat dissipation for LED packages than alumina, at a lower cost than previous formulations.
SEMICON China takes place March 20-22 in Shanghai. Check out the special pavillions and events, and keynote speakers scheduled.
coolingZONE LED, May 29-31 in Berlin, is soliciting technical presentations on LED energy consumption, LED packaging, heat and air-flow simulations of LED products, and related topics.
International Solid-State Circuits Conference (ISSCC) is going on now, gathering semiconductor design and device architecture presentations from research firms like imec to chip companies like IBM. Here are some highlighted presentations.
MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.
The IEEE International Reliability Physics Symposium (IRPS) is set for April 15, 2012 – April 19, 2012, in Anaheim, CA.
Part 2 of this series covers furnace considerations for a new HB-LED-grade AlN, as well as furnace throughput. Jonathan Harris, CMC Laboratories, covers the role of the oxide sintering phase in AlN in defining the materials microstructure and thus determining key properties such as thermal conductivity and mechanical strength.
Air Products will acquire all of DuPont's interest in DuPont Air Products NanoMaterials LLC (DA NanoMaterials), a 50-50 JV that the companies set up for the semiconductor and wafer polishing industries.
The 10th Annual MEMS Technology Symposium sponsored by MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 23 at the San Jose Holiday Inn. This year’s theme was “Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion.”
SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30.
The Dow Chemical Company (NYSE: DOW) inaugurated its Dow Seoul Technology Center, a global R&D center with focus on technological advances in display and semiconductor applications.
Apple’s ARM-based processors have created a point of hardware differentiation in applications processors. With the A5X, Apple is going with a much larger die at the 45nm node (shared across the 2 prior generations), shares Chipworks. It's also turned off the PoP track.
Taiwan raised investment ceilings for Chinese investors in LCDs, semiconductors, IC assembly and test, microelectronics production equipment, and metal tool manufacturing.
Worldwide semiconductor manufacturing equipment spending is projected to total $38.9 billion in 2012, an 11.6% decline from 2011 spending of $44 billion, according to Gartner Inc.
Fraunhofer IZM and Fraunhofer CNT will use CMP supplier Axus Technology exclusively to provide advanced 300mm wafer process development and foundry services to North American customers.
IBM scientists developed a prototype optical chipset, Holey Optochip, that can transfer 1Tbit per second as a parallel optical transceiver, using optical vias through a standard 90nm CMOS chip.
In case anyone needed a reminder or a wake-up, new data from SEMI reiterates chip tool sales are slumping badly in the latter part of this year.
SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.
The Global Semiconductor Alliance (GSA) says it has formed a Technology Steering Committee to help address key business and technology areas of interest to its members, and "encourage the advancement and adoption of leading technology and practices."
STMicroelectronics is getting out of the JV chip business with Ericsson, but it's still full-steam ahead for its use of (FD-SOI) technology with its partners.
In the seventh installment in a series called Process Watch, the authors discuss cycle time and the impact of inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.
At the International Electron Devices Meeting in San Francisco, An Chen of GLOBALFOUNDRIES presented a survey of emerging nanoelectronic devices, which he divided into two categories: Charge-based and non-charge based.
Attendees at this year’s International Electron Devices Meeting (IEDM) were delighted and perhaps somewhat horrified when the plenary speaker popped some electronics gear in his mouth and proclaimed, “It tastes like chicken!”
Despite weak financial performances, sluggish global markets and strong regional competition, Japanese consumer electronics giants Sony and Toshiba are increasing their investments in new products to revitalize their businesses.
Semiconductor equipment demand is persistently sluggish as the industry takes a break from a "multiyear expansion period" to digest recent investments and wrestle with a broader economic slowdown, acknowledges SEMI in its updated year-end forecast. But make no mistake: leading-edge technology investments are still happening, and growth will return in the typical cyclical pattern.
In prep for Semicon Japan in December, Advantest announces three new tools: 2 SEMs and a litho system.
This year's International Conference on Planarization/CMP Technology (ICPT) encompassed five themes describing use of CMP: new device structures, equipment and methods, Cu interconnects, consumables, and new CMP methods and processes.
New NEAPs are independent of the adhesion performance of various types of dielectric materials, and the new NEAP process adds surface area to the conductors.
EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services.
A reference book from the Global Semiconductor Alliance (GSA) and IC Insights puts foundry information at the fingertips of those who need it the most.
Sales of electronic gases are seen growing a modest 3.2% growth overall in 2012, following a 15% increase in 2011 to $3.1B, according to an updated report from Techcet Group.
STATS ChipPAC Ltd. plans to expand its semiconductor assembly and test operation in South Korea.
The latest monthly numbers for semiconductor manufacturing equipment demand aren't pretty: lows in both orders and sales not seen since the last major downcycle three years ago, and the short-term comparisons continue to widen.
Rolla, MO-based Brewer Science introduced a line of conductive CNT ink materials that are surfactant free, require no additional rinse steps, and are compatible with a broad range of printed electronic substrates.
ATMI Inc. has introduced the eVOLV process and system that represents a sustainable solution for recycling electronic waste (e-waste).
Chip sales growth continues to soften in 2012 as the industry slips from "stagnation" to "slump," but the stage is still set for a rebound in 2013, according to updated analysis from IHS iSuppli.
TechSearch International and the IEEE Women in Engineering Committee (WIE) are establishing a $2500 scholarship for women going into the field of engineering.
Industry watchers have been lowering their outlooks for 2013 over the past few weeks, but there's one set of opinions that still see optimism for an industry rebound in 2013 -- chip industry executives themselves.
The FlexTech Alliance has awarded 4D Technology (Tucson, AZ) a contract to develop an optical system that addresses a shortcoming in roll-to-roll (R2R) electronics manufacturing: in situ, high-resolution mapping of surface topography and defects on a moving, flexible web.
Global spending on wafer fab equipment (WFE) is now on pace to finish 2012 with a -17% annual decline, and 2013 now looks like it'll only be slightly better at a -10% dropoff, before the next cyclical spending upturn begins in 2014, according to an updated forecast from Gartner.
SMIC is claiming a breakthrough in its development of backside-illuminated (BSI) CMOS image sensor (CIS) technology, with the first test chip demonstrating good image quality even in low-light conditions.
Samsung's reaffirmation of its planned $4B investments in its Austin, TX facilities don't offer much extra info, but do serve as a message to the market about its future plans -- with or without Apple.
Each December, IBM unveils the 5 in 5 -- five predictions about technology innovations that will change the way we work, live and play within the next five years.
Rudolph Technologies, Inc. (Nasdaq: RTEC) has entered the back-end advanced packaging lithography market, with the acquisition of Azores Corp., and the introduction of a new 2X reduction stepper called the JetStep.
The ConFab, Solid State Technology’s invitation-only event for the semiconductor industry, took place in June, with presenters from top companies and analyst firms. If you couldn’t be there, check out all the coverage from the event -- reports, presentations, video interviews and more.
LED encapsulants are closely related to the LED’s lifespan and light transmittance. With high-power and high-brightness LEDs emerging, the encapsulant’s role is becoming more important, says Displaybank.
CGI Americas is introducing the QMO Series inert gas and vacuum ovens and MOL Series Class 100 cleanroom ovens, based on the SMO Series precision ovens from C Sun, to the North American market.
EMCORE, compound semiconductor-based components and subsystems supplier, will replace multiple legacy manufacturing systems in its compound semiconductor fab and back-end packaging operations with the Camstar Enterprise Platform.
Solid State Technology and SEMI today announced the finalists for the 2012 “Best of West” awards, recognizing important product and technology developments in the microelectronics supply chain.
Following are some of the process control, device inspection, defect detection, and other metrology and test products that will be on display at SEMICON West 2012, July 10-12 in San Francisco, CA.
JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.
IC Insights’ latest survey and ranking of the major semiconductor capital spenders shows that only 6 of the 35 major semiconductor suppliers -- Intel, Samsung, Hynix, TSMC, UMC, and Rohm -- with significant capital expenditure budgets are expected to spend more in 2012 than they did in 2011.
SEMICON West’s Day 2 keynote speaker represented a fabless company: Ivo Bolsens, PhD, SVP and CTO of Xilinx presented on how programmable chips and innovative packaging can advance semiconductors.
CEA-Leti presented research updates alongside SEMICON West this week. After the talks on device architecture, 3D and 2.5 packaging interconnects, large-scale computing and power consumption, and more, CEA-Leti’s researchers joined Solid State Technology to talk about their fields of interest.
After meeting with various semiconductor manufacturing tool suppliers -- Applied Materials, KLA-Tencor, Lam Research, Tokyo Electron, Teradyne and Cymer -- at SEMICON West, Citi analysts share impressions on foundry spending plans and tool choices.
OSRAM AG will build a new LED assembly plant in Wuxi, Jiangsu, China, packaging LED chips fabbed at its Regensburg, Germany and Penang, Malaysia wafer processing facilities.
A main focus of this year’s Electronic Components and Technology Conference (ECTC), held this week in San Diego, is 3D integration and through silicon vias (TSVs).
The ConFab 2012, Solid State Technology’s invitation-only meeting of the semiconductor industry, opened today in Las Vegas with a keynote address from John Chen, PhD, VP of technology and foundry operations at Nvidia Corporation.
In this video interview, Intel's Shekhar Borkar shares some key topics from SEMICON West keynote: Near-threshold voltage transistor designs, 3D integration for DRAM, unconventional interconnect, and more.
Michael A. Fury, Ph.D., reports on the opening day of SEMICON West (July 10), covering exaflop computing, FDSOI, TSV and other integration schemes, and silicon photonics with CEA-Leti.
Luc Van den hove, president and CEO, imec, spoke with Solid State Technology, covering imec’s major announcements and research presentations to take place during SEMICON West 2012.
Semiconductor equipment sales will reach $42.4 billion in 2012, according to the mid-year edition of the SEMI Capital Equipment Forecast, released at SEMICON West 2012.
Following are some of the new and flagship products that will appear this week at SEMICON West, July 10-12 in the Moscone Center of San Francisco, CA.
We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco.
IPC and JPCA released their first operational-level standard for the printed electronics industry, defining terms and establishes basic requirements for substrate materials used in printed electronics: ceramic, organic, metal, glass and other.
"Following seven months of increases, the three-month average bookings declined in June and likely reflects some slowing in investment plans attributed to weaknesses in the broader economy," said Denny McGuirk, SEMI. "While order activity may slow, equipment spending this year will continue to be directed towards advanced technologies in wafer processing and packaging assembly."
Rudolph Technologies Inc. (NASDAQ:RTEC) acquired the assets of NanoPhotonics GmbH, adding inspection technology and an intellectual property (IP) portfolio to serve its advanced package inspection tool customers.
In a webcast scheduled for June 27th at 1:00 Eastern, 11:00 Pacific, David McCann of GLOBALFOUNDRIES will provide a status report on advanced packaging and 3D integration. McCann is responsible for Packaging R&D and back-end strategy and implementation at GLOBALFOUNDRIES.
In mid-2011, semiconductor manufacturing and assembly equipment supplier Applied Materials (NASDAQ:AMAT) acquired Varian Semiconductor Equipment Associates Inc. Now, the company is adding Varian’s former CEO Gary Dickerson as president.
Daewon Innost achieved what it says is the LED industry’s best thermal dissipation performance on its Glaxum LED Array family, based on the proprietary Nano-Pore Silicon Substrate (NPSS) technology.
Luminus Devices Inc. is reducing thermal resistance in its Big Chip LED devices by 30% with new packaging technology.
MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.
As the dust settles after the launch of the iPhone 5, analysts tally which suppliers in the semiconductor ecosphere are most likely to gain the most.
Singapore’s A*STAR’s Institute of Microelectronics (IME), and Hitachi Chemical Co., will be collaborating on a joint research program to develop high performance material technologies for thin wafer processing for 3D IC packaging.
While various industry segments appear to be tapping the brakes, others are revving their engines, observes SEMI's Christian Gregor Dieseldorff -- and a 2012 stall could pave the way for a record-breaking 2013.
Singapore's Institute of Microelectronics (IME) and MOSIS have signed a memorandum of understanding (MOU) to offer a multiple-project wafer service targeting silicon integrated photonics.
Bruker said that a leading semiconductor supplier purchased multiple ContourGT-X 3D optical microscope systems for its packaging factories in Asia and North America to support copper wire bond inspection and process control needs.
Kulicke & Soffa Industries, Inc. launched its next generation manual wire bonder series, the iBond5000. The series, which is based on the company’s 4500 line, includes ball, wedge and dual-capability bonding options.
Laser nanofabrication can now meet the needs of submicron and nanoscale feature size manufacturing, and can operate in air, vacuum, or liquid processes. Sister publication Industrial Laser Solutions recently published Laser nanofabrication: A route toward next-generation mass production.
In this SEMI News and Views blog, Karen Savala covers EUV lithography, 450mm wafers, and 3D IC developments, based on her recent presentation at SEMICON West, “Supply Chain Readiness in an Era of Accelerated Change.”
Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.
Devan Iyer, director of Semiconductor Packaging in Texas Instrument’s Manufacturing Group, has joined the advisory board of The ConFab.
At the recent imec International Technology Forum Press Gathering in Leuven, Belgium, imec CEO Luc Van den hove outlined uses in blood cell sorting, mobile apps for personalized medicine (such as brain monitoring of EEG activity), and advanced bio research.
Imec, Holst Centre and Panasonic have developed a new prototype of a wireless EEG (electroencephalogram) headset.
Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”
ASMC 2013, the leading international technical conference for exploring solutions to improve collective microelectronics manufacturing expertise, has issued a call for papers.
Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, is poised to celebrate its 30th anniversary at its annual TECHCON conference Sept. 10-11.
STATS ChipPAC says it has expanded its through-silicon via (TSV) capabilities with a 300mm mid-end manufacturing operation targeting mid-end-of-line semiconductor manufacturing, including microbump technology down to 40μm, temporary bond/de-bonding, backside via reveal, isolation, and metallization.
Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders.
Brian Cronquist, MonolithIC 3D Inc.'s VP of Technology and IP reports on recent progress on low temperature (less than 400°C) bonding and cleaving processes.
Rambus Inc. (NASDAQ:RMBS), a technology licensing company, will undergo a restructuring and related cost saving measures to cut its expenses by$30-35 million annually.
ON Semiconductor has joined imec to collaborate on the development of next-generation GaN-on-Si power devices. ON Semiconductor is presently building a GaN processing line in its Oudenaarde facility in Belgium Oudenaarde, and it is expected to employ GaN-on-Si technology.
Applied Materials says it will reduce its work force by between 6% and 9% (900-1300 positions) amid a global realignment deemed necessary to achieve certain strategic objectives, freeing up to $190M annually "to fund key growth initiatives."
Fab equipment spending continues to soften in 2012, and hopes for a reprieve in 2013 are waning, warns one analyst.
Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy, the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.
Tezzaron Semiconductor is taking over SVTC Technologies' wafer fab in Austin, TX, amid reports that the semiconductor/MEMS development organization is cutting back activities in Austin and in California.
At the upcoming International Electron Device Meeting, Macronix researchers will describe how they built flash memories that could heal themselves by means of tiny onboard heaters that provide thermal annealing just at the spots where it is needed.
In an invited paper at the International Electron Devices Meeting, researchers from Everspin Technologies will describe how they built the largest functional ST-MRAM circuit ever built, a 64-Mb device with good electrical characteristics.
imec announced that it has integrated an ultra-thin, flexible chip with bendable and stretchable interconnects into a package that adapts dynamically to curving and bending surfaces.
At IEDM, IBM researchers will demonstrate high-performance state-of-the-art CMOS circuits —including SRAM memory and ring oscillators—on a flexible plastic substrate.
The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.
EV Group says it has received an order for its EVG850 temporary bonding/debonding systems from a leading maker of compound semiconductor-based components, what it says is the first use of its ZoneBOND technology in this area.
Demand for chip tools fell again in August and is off by -30% from its peak in early summer, fulfilling fears that the second half of 2012 will be sluggish for chipmaking investments, according to the latest data from SEMI.
At this year’s IEDM, a team led by Korea’s Gwangju Institute of Science and Technology will detail a high-speed pattern-recognition system comprising CMOS “neurons” and an array of resistive-RAM (RRAM)-based “synapses,” which demonstrated STDP, a brain-like function.
Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced it has named semiconductor industry veteran Chris Seams its new CEO.
For decades, electronic devices have been getting smaller, and smaller, and smaller. It's now possible—even routine—to place millions of transistors on a single silicon chip. But transistors based on semiconductors can only get so small.
Over 45 percent market participants forecast a positive market trend with their company turnover growth outpacing that of the industry as a whole.
VirtualWorks Group co-founder and Chairman Edward E. Iacobucci passed away at his home this morning after a 16-month battle with pancreatic cancer.
Outlook for semiconductor equipment market improves, but remains soft in the short term.
Samsung announced today that it has begun mass producing the industry’s first PCI-Express (PCIe) solid state drive (SSD) for next-generation ultra-slim notebook PCs.
Global sales of handsets featuring Near Field Communication (NFC) grew 300 percent in 2012 to reach 140 million units, according to a new research report by Berg Insight.
New market update shows integrated circuit revenues for tablets hitting $27 billion in 2016.
Everywhere we turn we hear speakers give presentations at conferences and industry events despairing how the rise in silicon design costs is hampering the semiconductor industries growth path.
Markets predicted by Maxtech International to reach >$5B by 2015.
Using clouds of ultra-cold atoms and a pair of lasers operating at optical wavelengths, researchers have reached a quantum network milestone: entangling light with an optical atomic coherence composed of interacting atoms in two different states. The development could help pave the way for functional, multi-node quantum networks.
Revenue for both internal and external HDDs in video-surveillance applications will rise from $638.7 million this year to $1.0 billion by 2017, a remarkable 57 percent increase.
The combination of Rockchip’s design and GLOBALFOUNDRIES’ 28nm HKMG process technology resulted in a mainstream tablet System-on-Chip (SoC) capable of operating at up to 1.8 GHz performance, while still maintaining the power efficiency expected by mobile device users.
The co-developed imager sensor chip targets high speed, high resolution imaging applications such as next generation HDTV.
Multitest’s James Quinn will present during the 2013 SEMICON West exhibition and conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA.
Industry’s newfound maturity yields growth amid adversity.
In a keynote at the IEEE International Interconnect Technology Conference (IITC), Douglas Yu from TSMC talked about Moore’s Law scaling becoming increasingly difficult.
Multitest today announced that it will hold its annual Open House Week July 9-11, 2013.
Nano-electronics R&D center addresses key challenges of Germanium finFET technology at VLSI 2013.
Spansion Inc., a provider of flash memory solutions for embedded markets, today announced the appointment of Robin J. Jigour as senior vice president and general manager of the company's Flash Memory Business Group.
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.31 billion in the first quarter of 2013.
Single-wafer cleaning solution is suitable for 3D-IC/TSV, advanced packaging, MEMS and compound semiconductor applications.
ISORG and Plastic Logic have co-developed the first conformable organic image sensor on plastic, with the potential to revolutionize weight/power trade-offs and optical design parameters for any systems with a digital imaging element.
SEMATECH announced today that Applied Seals North America (ASNA) has joined SEMATECH’s Manufacturing Technology Center, which is designed to improve semiconductor equipment manufacturing productivity, yield and cost.
CEA-Leti announced today that researchers Dominique Vicard and Jean Brun received the Avantex Innovation Prize for the use of the E-Thread technology in textiles.
CEA-Leti will present recent advances and a preview of future developments in micro- and nanotechnologies, followed by workshops on key technical fields, during Leti Innovation Days, June 25-28, on the MINATEC campus.
Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function.
Silicon Labs today announced that it has signed a definitive agreement to acquire Energy Micro AS.
Altera Corporation today introduced its Generation 10 FPGAs and SoCs, offering system developers breakthrough levels of performance and power efficiencies.
Peregrine Semiconductor Corporation, a fabless provider of high-performance radio frequency integrated circuits (RFICs), today announced the signing of a collaborative agreement with Murata Manufacturing Company.
The foundry plans to unveil a comprehensive set of certified design flows to support 2.5D IC product development with its most advanced manufacturing processes at next week’s 50th Design Automation Conference (DAC) in Austin, Texas.
At next week's 50th Design Automation Conference in Austin, Texas, GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support its most advanced manufacturing processes.
Aptina’s board of directors yesterday announced that Phil Carmack has joined Aptina as chief executive officer and as a member of the board of directors.
A new report from IC Insights shows that we could be on the verge of entering into “the post-PC era.”
Signetics Corporation today announced that it has again approved capex plans that will further expand their capacity for flip chip package assembly at their factory in Paju, South Korea.
Mentor Graphics Corp. today announced significant achievements in its continued collaboration with TSMC on 20nm physical verification kit optimizations.
ams AG, a provider of high performance analog ICs and sensors, today introduced the AS3721, a power management IC (PMIC) with an innovative remote-feedback circuit that helps reduce the thermal stress of applications processors in smartphones and tablets.
The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at ECTC 2013, with the report of an advanced new temporary bonding solution for 3D TSV semiconductor packaging.
ATIC and SRC today launched the ATIC-SRC Center of Excellence for Energy Efficient Electronic Systems (ACE4S), to be hosted jointly in Abu Dhabi by Khalifa University of Science, Technology and Research, and Masdar Institute of Science and Technology.
ST-Ericsson, a joint venture of STMicroelectronics and Ericsson, today announced the signature of a definitive agreement to sell the assets and intellectual property rights associated with its mobile connectivity Global Navigation Satellite System (GNSS) business to a semiconductor company.
Element Six today announced it has acquired the assets and intellectual property of Group4 Labs, Inc. (Group4), a semiconductor wafer materials company that manufactured gallium nitride (GaN) on-diamond semiconductor technology for RF and high-power devices.
OMRON Corporation today announced that they have finished development work on the world's first infrared sensor manufactured with wafer-level vacuum packaging technology to create a 16x16 element MEMS non-contact infrared thermal sensor capable of highly precise 90-degree area detection.
Mentor Graphics Corp. and Tezzaron Semiconductor Corp. today announced they are collaborating to integrate the Mentor Calibre 3DSTACK product into Tezzaron’s 3D-IC offerings.
Can PC makers produce ultrathin, touch-screen PCs that are appealing to consumers—and that are priced at just $200?
Vishay Intertechnology, Inc. today announced that the company has enhanced its ACAS 0606 AT and ACAS 0612 AT precision thin film chip resistor arrays with tighter absolute tolerance, relative tolerance, and relative TCR for the new S, T, and U accuracy grades.
LAST POWER, the European Union-sponsored program aimed at developing a cost-effective and reliable technology for power electronics, today announced its three-year program achievements.
Yole Développement announced its 2.5D, 3DIC and TSV Interconnect Patent Investigation report. For this analysis of 3D packaging technology patents, more than 1800 patent families have been screened.
The critical processes and technologies necessary to continue Moore’s Law are currently more uncertain than ever before in the history of advanced semiconductor manufacturing.
AG Semiconductor Services today announced that Michael (Mike) Mardesich has joined the company in the role of senior director of sales.
The 59th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking original work in microelectronics research and development. The paper submission deadline is Monday, June 24, 2013.
Intel announced that the board of directors has unanimously elected Brian Krzanich as its next chief executive officer (CEO), succeeding Paul Otellini. The board also named Renée James, 48, to be president of Intel.
MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with imec, Ireland's Tyndall National Institute and ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs.
Endicott Interconnect Technologies, Inc. (EI) announced that its System-In-Package (SiP) technology performed successfully in a military test of a small hit-to-kill interceptor designed to defeat rocket, artillery and mortar attacks.
The worldwide semiconductor assembly and test services (SATS) market totaled $24.5 billion in 2012, a 2.1 percent increase from 2011, according to final results from Gartner, Inc.
Amkor Technology, Inc. today announced that Stephen D. Kelley has been appointed to serve as president and chief executive officer and as a director of the company, effective May 8, 2013.
More than 100 representatives from government and the photonics industry convened in Washington, D.C., on February 28 to identify focus areas for a national photonics initiative (NPI), engaging academia, industry, and government in a collaboration to address barriers to continued U.S. leadership in photonics.
Management expects demand for MOCVD production equipment to potentially improve as demand for LEDs increases later in the current year.
LFoundry to manufacture wafers for Aptina following LFoundry’s purchase of Micron’s Avezzano, Italy semiconductor fabrication facility.
Industry consolidation to just three big DRAM suppliers and a reduction in capital expenditures among these manufacturers helped propel DRAM average selling prices (ASPs) up 13% year over year in January, which contributed to a 19.9% jump in the total memory market and a 6.2% increase for the total IC market in January 2013.
Following a healthy expansion in 2012, the growth of the global automotive semiconductor market will decelerate slightly this year because of a slowdown in the aftermarket and portable navigation device (PND) segments.
Diodes Incorporated today announced that it has completed its acquisition of BCD Semiconductor Manufacturing Limited in an all cash deal, valued at approximately $151 million.
The eight leading suppliers of industrial electronics suffered revenue declines in 2012, reflecting weak conditions for the beleaguered market.
Starting late in 2011, the power electronics downturn in 2012 was quite severe, exhibiting -20 percent negative growth. However, the SiC device market kept on growing with a +38 percent increase year to year.
Multitest announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive application at a European based IDM.
Global shipments of solid state drives (SSD) in PCs are set to rise by a factor of seven by 2017, allowing them to claim more than one-third of the market for PC storage solutions by that time.
Intel Corporation today took the wraps off its brand new, low-power, high-performance microarchitecture named Silvermont.
Photonics societies across the United States today announced the launch of the National Photonics Initiative.
Invensas Corporation, a subsidiary of Tessera Technologies, Inc., will showcase its latest mobility solution, an ultra-high bandwidth Bond Via Array (BVATM) Package-on-Package (PoP) product, at the upcoming IEEE Electronic Components & Technology Conference (ECTC) in Las Vegas, NV on May 28 - 31, 2013.
IDC expects the semiconductor market to return to growth in 2013 with revenues forecast to increase by 3.5 percent this year.
North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in April 2013 (three-month average basis) and a book-to-bill ratio of 1.08.
Leaders of the National Science Foundation (NSF) and the Semiconductor Research Corporation (SRC) today announced 18 new projects funded through a joint initiative to address research challenges in the design of failure-resistant circuits and systems.
In 1973, Pong was cutting edge in the world of video games, music came on eight-track tapes, TV viewing was limited to three networks and Glenn Smith was a college kid who went to work part-time in the warehouse of what was little more than a mom and pop electronics catalog start-up in San Diego.
Slow notebook and desktop PC sales and strong growth in mobile processors for smartphones and tablet PCs continues to lower Intel's marketshare as well.
Toshiba Corporation today announced that the company has developed second generation 19nm process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month.
Samsung Electronics Co., Ltd. today announced the industry’s first production of ultra-high-speed four gigabit (Gb) low power double data rate 3 (LPDDR3) mobile DRAM, which is being produced at a 20nm-class process node.
China rose to the top of the PC market for the first time ever on an annual basis last year, relegating the United States to second place with a lead of more than 3 million units, according to an IHS iSuppli PC Dynamics Market Brief from information and analytics provider IHS.
SEMI today announced that Philip Yeo, chairman of SPRING Singapore, and Lee Kok Choy, country manager of Micron Technology Inc. Singapore, have been voted by the SEMI Singapore Regional Advisory Board as recipients of two prestigious awards recognizing their contributions to the development and success of the Southeast Asian semiconductor industry.
Rudolph Technologies, Inc. announced today that it has purchased selected assets, including a patent portfolio, relating to metrology capability from Tamar Technology, Newbury Park, Calif.
An estimated 405 million handsets, including 197 million smartphones, were shipped in the first quarter of 2013, according to market intelligence firm ABI Research.
About 1,000 of the world’s leading experts in the field of microelectronics will gather here for the 2013 Symposia on VLSI Technology and Circuits, from June 11-13, 2013 (Technology) and from June 12-14, 2013 (Circuits).
STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, today announced the appointment of Mr. James A. Norling to succeed Mr. Charles R. Wofford as chairman of the Board of Directors with immediate effect.
In another sign of the worldwide shift in preferred personal devices, PC shipments posted the steepest decline ever in a single quarter, according to the International Data Corporation Worldwide Quarterly PC Tracker (IDC).
Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia.
Natcore Technology Inc. announced major strides in advancing its black silicon solar cells to commercial levels of efficiency and, as part of its development process, has discovered that its technology could finally provide a low-cost selective emitter application.
NikkoIA announces the production of several innovative organic image sensors, confirming the potential of its technology, and validates the technology building blocks that can be immediately implemented to build its product lines.
Electro Scientific Industries, Inc. today announced it had signed a definitive agreement to acquire the Semiconductor Systems business of GSI Group, Inc., a supplier of precision photonics, laser-based solutions and precision motion devices to the medical, industrial, scientific, and electronics markets
Alliance Memory today extended its 128M and 256M lines of high-speed CMOS synchronous DRAMs (SDRAM) with new devices in a 54-ball 8 mm by 8mm by 1.2mm TFBGA package.
The global semiconductor materials market decreased 2 percent in 2012 compared to 2011 while worldwide semiconductor revenues declined 3 percent. Revenues of $47.11 mark the first decline in the semiconductor materials market in three years.
Original equipment manufacturers (OEMs) are increasingly turning to electronics manufacturing service (EMS) providers to better handle the escalating volumes of electronic content in the medical industry.
Sales in March 2013 were up slightly compared to February 2013 and March 2012.
Chip Memory Technology Inc. (CMT), a new embedded memory technology developer, has emerged from stealth mode to reveal company details and its latest product.
The €8.5 million European Commission project developed a complete design and fabrication supply chain for integrating a photonic layer with a CMOS circuit, using microelectronics fabrication processes.
Silex Microsystems, the world’s largest pure-play MEMS foundry, today announced that it has joined an international European Union-funded program aimed at developing a new MEMS manufacturing platform based on advanced inkjet-based printing technologies.
The market for Bluetooth semiconductors is expected to boom by nearly 100 percent from 2011 to 2017, with the majority of the growth driven by demand for wireless combination integrated circuits (ICs) and mobile system-on-chip (MSoC) devices with integrated wireless connectivity that are used in mobile devices like smartphones and media tablets.
North America-based manufacturers of semiconductor equipment posted $1.14 billion in orders worldwide in March 2013 (three-month average basis) and a book-to-bill ratio of 1.14, according to the March Book-to-Bill Report published today by SEMI.
Increasing HD video content, social networking, shared data via the cloud, low power consumption, and “instant on” features continue to drive growth of consumer, communication, and computing devices that use NAND flash memory.
With time running out until U.S. component manufacturers are legally required to disclose their usage of conflict minerals to the federal government, many companies are woefully unprepared for the new regulations, with more than one-third of firms indicating they haven’t even commenced compliance planning, according to a survey from information and analytics provider IHS.
Intermolecular, Inc. today announced that it has entered into a multi-year technology development and IP licensing agreement with Micron Technology, Inc., focused on technology development and related IP for advanced memory technologies.
BeSpoon, a fabless semiconductor company, and CEA-Leti have demonstrated an IR-UWB integrated circuit able to measure distances within a few centimeters’ accuracy, and have established a world-record operating range at 880m (standard regulation) and 3,641m (emergency situations).
Chemists at Ohio State University have developed the technology for making a one-atom-thick sheet of germanium, and found that it conducts electrons more than ten times faster than silicon and five times faster than conventional germanium.
Proposed increases in funds for scientific R&D and a greater emphasis on STEM education in the 2014 budget proposal announced by the White House this week reflect the President’s commitment to science and engineering, SPIE leaders said.
IBM announced plans on Thursday to invest $1 billion in flash memory research and development and launch a series of systems that will use solid state drives.
Over the last few years, glass has gained considerable interest from the semiconductor industry due to its very attractive electrical, physical and chemical properties, as well as its prospects for a relevant and cost-efficient solution. The application scope of glass substrates in the semiconductor field is broad and highly diversified.
Only light, aerial oxygen, and a catalyst are needed to remove pollutants from water. Ruhr-Universitat Bochum researchers led by Professor Radim Beránek are collaborating with colleagues from seven different countries in order to develop a photocatalyst that is efficient enough to be profitable.
The ability to improve silicon transistors is reaching its fundamental limit, so researchers are searching for new ways to keep making electronic devices faster and more powerful. University of Nebraska-Lincoln physicists and colleagues have taken a major step toward breaking that silicon barrier.
At this week’s International Solid State Circuits Conference (ISSCC 2013), imec and Holst Centre presented an ultra-low power processor that operates reliably at near-threshold voltages.
The Hiden IG20 high-brightness gas ion gun is further enhanced by the introduction of a new beam optic and ion source configuration to enable both increased beam brightness and beam contrast, together with a significant reduction in ultimate spot size.
CEA-Leti today announced that it will coordinate a four-year project aimed at building a European-based supply chain in silicon photonics and speeding industrialization of the technology.
STMicroelectronics announced today another milestone in its testing of its 28nm FD-SOI Technology Platform.
In semiconductor manufacturing, 450mm is the next big opportunity. Issues of economic scale and complexity will force fab designers, OEMs and process integrators to investigate all open avenues in the search for solutions to the huge challenges that accompany 450mm.
Recent advances in diamond applications (diamond-on-silicon, MEMS, optical) suggest that its utilization into a broader scope of commercial products is not far away.
The multibillion-dollar secondary or used semiconductor equipment market has gone through significant changes over the past five years and has become increasingly sophisticated in its approach.
80 percent of the devices used for portable and mobile applications are currently manufactured on 200mm or smaller wafers. How this plays out going forward could change who the dominant players will be.
In order to maintain profitability manufacturers must increase the productivity and return from their R&D investments.
Advanced packaging requirements are driving the evolution of back end manufacturing to become more similar to the front end.
It is becoming increasingly clear that new MEMS and 3D high-volume, low-cost manufacturing technologies will accelerate a radical change to society’s cyber skyline.
In 2013, it is anticipated that M&A transaction activities will increase and result in further consolidation of the semiconductor supply chain.
2013 will mark the beginning of the next cyclical upturn—one in which the IC market CAGR will more than triple to 7.4% in the 2012-2017 time period.
The SEMI Consensus Forecast and the SEMI World Fab Forecast, with data collected from two different methodologies, point to the same conclusion: 0% growth for 2013.
Markets for solid state thin-film batteries at $65.9 million in 2012 are anticipated to reach $5.95 billion by 2019, according to a new report released by ReportsnReports.com.
Worldwide silicon wafer revenues declined by 12 percent in 2012 compared to 2011, according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.
Although many are small companies manufacturing low-pin count devices, all of the world’s “Top 10” OSAT, Outsourced Semiconductor Assembly and Test, players have one or more assembly and testing facilities in China.
In the first of two installments, we examine the global issues facing the semiconductor industry, as released by Linx Consulting in The Econometric Semiconductor Forecast.
A new econometric semiconductor industry forecast predicts semiconductor wafer area production to grow slightly less than 6% in 2013, according to Linx Consulting.
Technische Universität (TU) Dresden announced Monday the successful initial operation of a low-power test chip featuring a Tensilica Xtensa LX4 DSP equipped with RacyICs power management IP implemented in GLOBALFOUNDRIES' advanced 28nm Super Low Power, or SLP, technology.
SEMATECH announced today that Araca Inc., a leading provider of products and services for chemical mechanical planarization research and development, and the International SEMATECH Manufacturing Initiative (ISMI) are partnering to deliver CMP processing and productivity solutions to help chip manufacturers increase yields, reduce equipment downtime and lower consumables costs.
Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, announced an expansion of its SPI Flash memory portfolio yesterday.
Dow Corning and IBM scientists unveiled a major step in photonics yesterday at the Photonics West conference, using a new type of polymer material to transmit light instead of electrical signals within supercomputers and data centers.
Spending on research and development by semiconductor companies grew 7% in 2012 to a record-high $53.0 billion, even though the semiconductor market declined 1% to $317.6 billion.
Facing a relentless onslaught from tablets, smartphones and solid state drives (SSD), global hard disk drive (HDD) market revenue in 2013 will decline by about 12 percent this year, according to IHS.
Five University of California, Riverside professors will receive a total of $5 million as part of a $35 million research center aimed at developing materials and structures.
IPC recently released the C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
STATS ChipPAC and UMC announced the world's first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem collaboration.
Renesas and J-Devices signed a memorandum of understanding regarding the transfer of the semiconductor back-end production business of three facilities operated by Renesas’ wholly owned manufacturing subsidiaries
Shimadzu Corporation today introduced the Tracera, a high-sensitivity gas chromatograph. Tracera is equipped with the newly developed barrier discharge ionization detector BID, which is capable of detecting all types of trace organic and inorganic compounds.
TechNavio's analysts forecast the global 3D IC market to grow at a CAGR of 19.7 percent over the period 2012-2016. However, the thermal conductivity issues could pose a challenge to the growth of this market.
Subcommittee chair Stefan Rusu of Intel in Santa Clara, CA will present on trends in high-performance digital. The relentless march of process technology, he says, brings more integration and performance.
SEMI, in collaboration with strategic investing groups throughout the global semiconductor industry, has announced the Silicon Innovation Forum, or SIF, to bridge funding gaps for new and early-stage companies with valuable semiconductor manufacturing and technology solutions.
By creating a material that slows light, engineers open new possibilities in solar energy, military technology and other fields of research.
The rise in mobile computing, changes to the fabless-foundry model, uncertainties in technical innovation, and global macroeconomic trends are becoming the dominant forces in 2013 and beyond, according to industry leaders speaking at this week's SEMI Industry Strategy Symposium (ISS).
GlobalFoundries says it plans to build a $2 billion "Technology Development Center" R&D facility at its Fab 8 campus in Saratoga County, NY, for semiconductor technology development and manufacturing: EUV lithography photomasks to new interconnect and packaging technologies enabling 3D chip stacking, "and everything in between."
Components are prominent this year, on the main stage, and the CES exhibit floors.Todd Traylor of Smith & Associates reports.
The International Data Corporation is forecasting that semiconductor revenues worldwide will improve by 4.9% to $319 billion in 2013 and log a compound annual growth rate (CAGR) of 4.1% from 2011-2016.
Based on current indications, capital spending would seem to be flat in 2013. However, Semico predicts healthy revenue growth this year, which may encourage more spending, particularly in the second half of the year. This may bring total capex for 2013 into the positive range.
Korean DRAM maker SK Hynix has entered into new eight-year patent licensing agreements with Tessera Inc. and Invensas.
China’s rapid transition from a low-cost manufacturing hub to an innovation hotspot with growing foreign ambitions represents both a threat and an opportunity for companies and investors around the globe, according to Lux Research.
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc., blogs about the evolution of 3D technology seen at the International Electron Devices Meeting.
Reports are circling around Apple's supply chain of a potential shift in the company's display technology for its future iPhones and iPads -- moving back to LCDs and away from touch panels -- but a drastic realignment of its supply chain is probably not likely, observes DisplaySearch.
Printed, flexible, and organic electronics have garnered more than $7.5 billion in venture funding from 1996-2011, though it's declined sharply since 2007. A new Lux Research report looks at who's getting attention and who's not.
Samsung tops list; IC foundries expected to show biggest capacity gains through 2017.
Researchers at North Carolina State University have developed a new type of nanoscale structure that resembles a “nano-shish-kebab,” consisting of multiple two-dimensional nanosheets that appear to be impaled upon a one-dimensional nanowire.
ISSCC, the International Solid-State Circuits Conference, is being held on February 17-21, 2013, at the San Francisco Marriott Marquis Hotel. This year, in honor of the conference’s 60th anniversary, we have assembled highlights of the topics and trends that are being discussed.
In February, Infineon received the first customer go-aheads for products of the CoolMOS family produced by the 300-millimeter line at their site in Villach, Austria.
New marketing and technical support center opened in Reading, UK.
Snapdragon 800 processor on 28nm HPM process delivers high performance and low power for mobile devices.
Messe Düsseldorf and ESNA have formed a cooperation to address the printed electronics market by organizing a new tradeshow, PEPSO.
Engineered Material Systems, a global supplier of electronic materials for circuit assembly applications, debuts its DB-1568-1 low-temperature cure die attach adhesive for attaching semiconductor die in temperature-sensitive devices.
We are entering the era of cognitive systems, where electronic devices will mimic the human senses—in their own way, to see, smell, touch, taste and hear. IBM assembled this infographic to illustrate what they call the “5 in 5,” five innovations that will change our lives within five years.
New metrology and inspection products facilitate advanced patterning techniques for manufacturing sub-20nm memory and microprocessor chips.
China looks a good bet to be the engine of growth again in 2013, while U.S. will see improving PC market and more software growth.
The competitive landscape of the cellphone core integrated circuit (IC) business has completely transformed over the past five years, with Qualcomm Inc. and Samsung capitalizing on the rise of smartphones and 4G.
Toshiba Corporation announced the development of a CMOS image sensor with a small area and low power pixel readout circuits. A sample sensor embedded with the readout circuits shows double the performance of a conventional one. Toshiba presented this development at ISSCC 2013 in San Francisco, CA on Feb. 20.
Silicon nanocrystals have a size of a few nanometers and possess a high luminous potential. Scientists of Karlsruhe Institute of Technology (KIT) and the University of Toronto/Canada have now succeeded in manufacturing silicon-based light-emitting diodes (SiLEDs). They are free of heavy metals and can emit light in various colors.
-27% active power reduction and 85% standby power reduction is confirmed at International Solid-State Circuits Conference 2013.
Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase.
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is developing equipment and process technology to enable covalent bonds at room temperature.
Peregrine Semiconductor Corporation, a fabless provider of high-performance radio frequency integrated circuits (RFICs), yesterday announced plans to collaborate with Murata Manufacturing Company on a multisource arrangement for RF switches and other components based on Peregrine’s proprietary UltraCMOS technology
Flip-Chip is big on value: in 2012, it was a $20B market, making it the biggest market in the middle-end area, and Yole Développement expects it to continue growing at a 9% clip, ultimately reaching $35 billion by 2018.
Companies will develop integrated logic and Flash memory to enable creation of high-performance and low power electronics.
After experiencing a slowdown in 2012, the global semiconductor market is set for growth. The World Semiconductor Trade Statistics predicts the global semiconductor market to grow by 4.5% in 2013 after declining 3.2 percent in 2012.
Tensoft's web-based product will streamline operations for recently-acquired product line.
O-S-D’s marketshare of total semiconductor sales in 2012 was highest since 1991. Seven O-S-D product categories and device groups reached record-high sales in 2012 compared to 14 new records being set in 2011, according to data shown in the 2013 edition of IC Insights’ O-S-D Report.
Solid State Technology is proud to announce that Yoon-Woo Lee will be speaking at The ConFab 2013. The event will be held June 23-26, 2013 at The Encore at The Wynn in Las Vegas. Lee is the Executive Advisor of Samsung Electronics.
After reaching a worrisome high in the third quarter of 2012, global semiconductor inventories held by chip suppliers fell at a surprisingly fast rate in the fourth quarter, led by dramatic reductions for market leader Intel Corp.
Foundry to use wafers for 3D IC and advanced packaging volume production applications.
In the power electronics field, the fabless business model is not as common compared to the MEMS industry. For example, most power electronics players have their own capabilities/fabs dedicated mainly to silicon wafer manufacturing. According to Yole Développement, $4B was generated by MEMS fabless companies in 2012, against less than $300K in the power electronics area. Is power electronics a world apart?
ALTIS Semiconductor, a global specialty foundry based in France, announced today the finalization of a foundry agreement with IBM Microelectronics. Under the terms of this agreement, ALTIS will be the foundry partner for the IBM 180nm SOI technology. ALTIS will deliver high volume products starting Q2 2013 and will secure capacity increase for 2014 and beyond to address the IBM forecasted demand.
Signetics Corporation today introduced their new MapBGA package to the industry. This alternative to standard PBGA packaging has improved reliability and design flexibility due to its unique assembly process.
OKI Engineering, provider of reliability evaluations and environmental conservation technologies for the OKI Group, recently delivered KGT-3MM-AP exhaust gas treatment equipment for atmospheric pressure CVD manufacturing equipment to semiconductor manufacturer ON Semiconductor's European plants.
Cadence Design Systems, Inc. today announced plans to aquire Tensilica, Inc. for approximately $380 million in cash. Tensilica had approximately $30 million of cash as of December 31, 2012.
Neutron scattering technique provides new data on absorption of ion in microporous materials.
55nm LPe 1V is optimized for ultra-low power, reduced cost and improved design flexibility.
This week, India’s Finance Minister P Chidambaram offered incentives to chip makers to set up headquarters in India, in an effort to encourage local electronics manufacturing. However, the response from the industry has been less than positive. Many believe that is it is a good start, but far from sufficient.
STM, Imec, CEA-LETI, ASML, Soitec and EU representatives discussed directions at ISS Europe 2013 in Italy.
Brooks Instrument, a provider of flow measurement and control instrumentation to the microelectronics industry, will launch the GF135 pressure transient insensitive (PTI) mass flow controller at SEMICON China, March 19-21 at Shanghai New International Expo Center.
A researcher from North Carolina State University has developed a technique for creating high-density ceramic materials that requires far lower temperatures than current techniques – and takes less than a second, as opposed to hours. Ceramics are used in a wide variety of technologies, including body armor, fuel cells, spark plugs, nuclear rods and superconductors.
Intel announced Monday a major move to expand its foundry business. Altera Corporation and Intel Corporation have entered into an agreement for the future manufacture of Altera FPGAs on Intel's 14nm tri-gate transistor technology.
New automotive technologies that go beyond touchscreens, satellite radio, and voice-activated GPS commands are being tested and improved, and will soon begin to appear in many more new car models, resulting in solid growth for the automotive IC market through 2016.
LFoundry, an analog mixed signal and specialized technologies foundry, today announced that it has entered into an agreement with Micron Technology, Inc. (NASDAQ: MU) to acquire Micron Technology Italia, Srl. and all of its semiconductor fabrication facility assets in Avezzano, Italy.
Yole Développement’s research has credited STMicroelectronics for capitalizing on the booming demand for MEMS in mobile devices by shipping 58% more MEMS units in 2012, to become the first company to reach $1 billion in MEMS sales.
The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR) in Singapore, has launched the Copper (Cu) Wire Bonding Consortium II. The consortium which rides on the successes of Phase I launched in 2010 aims to improve the reliability of semiconductor devices by tackling copper wire bonding issues related to corrosion and stress.
North America-based manufacturers of semiconductor equipment posted $1.07 billion in orders worldwide in February 2013 (three-month average basis) and a book-to-bill ratio of 1.10, according to the February Book-to-Bill Report published today by SEMI. A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month.
Tokyo-based Asahi Glass Co., Ltd. and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1 million to co-found a subsidiary business, Triton Micro Technologies , to develop via-fill technology for interposers, enabling next-generation semiconductor packaging solutions using ultra-thin glass.
Heraeus will present numerous product highlights with regard to bonding wires, assembly materials and sputtering targets at this year's Semicon China, taking place on March 19-21, 2013 in Shanghai.
Everyone wants faster access to stored data, and the issue is becoming critical with Big Data and cloud initiatives. With the speed of DRAM and the non-volatility of storage, Magnetoresistive Random Access Memory (MRAM) encourages a new way of thinking about storage applications. Storage is associated with longer latencies, but with MRAM storage can have similar latencies to memory. These capabilities and others make MRAM a catalyst for new thinking about how we design storage applications.
Smartphones are set to become even more flexible and more satisfying to use, thanks to a unique sensor system developed by STMicroelectronics. Combining three optical elements in a single compact package, the VL6180 is the first member of ST’s FlightSense family and uses a new optical-sensing technology that reduces the incidence of dropped calls and enables innovative new user interactions with smartphones.
Broadcom has been ranked number one vendor in three recent competitive assessments released by ABI Research on wireless connectivity IC markets. One was for overall wireless connectivity ICs, another on Bluetooth ICs, and a final on Wi-Fi ICs.
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. and Benjamin S. Louie of Zeno Semiconductor blog about dimensional scaling as it relates to EUV and future per transistor device cost.
Wafers with a diameter of 450mm enable the micro-chip industry an increase in yield of up to 80%. This leads to an enormous increase in productivity. In order to control the product quality, these wafers receive a specific marking from the manufacturer.
ON Semiconductor will demonstrate new digital AC-DC PWM controllers, motor drivers and IGBTs at industry’s premier power electronics show.
Dynamic changes to R&D processes, tools, technical challenges, and funding/business models will be highlighted at SEMICON West 2013, along with product displays of the latest semiconductor manufacturing technology, components and subsystems.
Mobile energy storage is critical for everything from the phones and computers we carry, to the soldiers and weapons that protect us – and even to the cars we drive. While lithium-ion (Li-ion) batteries have established themselves as the leading technology today, exotic ideas such as lithium-air, lithium-sulfur, solid-state and zinc-air batteries offer up to 10 times better energy density.
Silex Microsystems and BroadPak today announced the immediate availability of their jointly developed silicon interposer solution in high-volume manufacturing.
Cadence Design Systems, Inc. today announced an ongoing multi-year agreement with TSMC to develop the design infrastructure for 16-nanometer FinFET technology, targeting advanced node designs for mobile, networking, servers and FPGA applications.
Solid State Technology is excited to announce that Mark Thirsk, managing partner at Linx Consulting, will be discussing the cost and technology needed to implement next-generation device technology at The ConFab 2013. Thirsk has over 20 years of experience in the chemical industry, working with a variety of materials and processes utilized in wafer fabrication.
Fulfilling the promise of performance and power scaling at 16nm, ARM and Cadence today announced details behind their collaboration to implement the first ARM Cortex-A57 processor on TSMC's 16nm FinFET manufacturing process.
University of Manchester graphene researchers have been awarded a £3.5 million (or approximately US$5 million) funding boost that could bring desalination plants, safer food packaging and enhanced disease detection closer to reality.
It’s no secret that Samsung is up against Apple in many ways, in products, sales and innovation. However, even in the face of Apple’s patent infringement lawsuits, Samsung is still climbing the charts.
Kotura inks fab agreement; announces relationships with Mindspeed and BinOptics.
FlipChip International (FCI), a developer of flip chip bumping, Wafer Level and embedded die packaging and EZconn Czech a.s. announced a partnership agreement today.
It’s no secret: the past five years for the IC industry have been full of challenges. From 2007-2013, the IC market grew at an average annual rate of only 2.1%. One of the speakers slated to speak at The ConFab 2013 in Las Vegas has good reason to believe the IC industry is set to emerge from this difficult cycle.
In 2012, global PCB industry saw a jump in terms of output value, benefitting in a large part from the rapid growth in the shipment of Apple and Samsung. However, there is no such possibility of a huge jump in 2013, as the report states the expected growth rate will slow down to 2.7%.
Cisco Systems is preparing for a major shift in the industry, as the Internet of Things starts to become a reality. At an annual press event in San Jose, California this week, Cisco officials claimed that the much-anticipated IoT industry could be a $14 trillion opportunity, and they are ready to embrace the change.
OneChip Photonics this week revealed strategic, outsourcing plans to expand into new markets, with announcements of newly-established relationships with semiconductor foundry GCS and wafer supplier IQE. Both announcements related to OneChip’s bigger, strategic plan to expand its services into the high-volume DCI market.
Despite facing five consecutive quarters of decline and a slowdown in consumption in smartphones and tablets, the global market for NAND flash memory pulled off a surprise growth spurt during the last three months of 2012, causing sales to reach a record high.
Solid State Technology is pleased to announce Subu Iyer, IBM Fellow, will be giving the keynote address at The ConFab 2013 in Las Vegas on Tuesday, June 25, 2013. Iyer will speak on orthogonal scaling to fill today’s fabs in the future.
A new undergraduate program approved this week at the University of Central Florida (UCF) will help the U.S. stay competitive in global technology as well as broaden the path for students seeking rewarding careers in the important field of optics and photonics, say leaders of SPIE, the international society for optics and photonics.
The second Cleanzone on October 22 and 23, 2013 in Frankfurt am Main is off to a promising start with a stronger profile. Last year, the trade fair and congress made a successful debut as the new international industry meeting point for cleanroom technology. It is targeted towards all companies and sectors in which industrial production is taking place under cleanroom conditions today and tomorrow.
Nitronex, a designer and manufacturer of gallium nitride (GaN) based RF solutions for high performance applications, has named David W. Runton as its new Vice President of Engineering.
Swiss specialty chemicals group Clariant International AG acquired the nano-silver ink technology platform developed under the trademark Bayink from Bayer Group, Germany.
GLOBALFOUNDRIES today announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications.
Diodes Incorporated (Nasdaq:DIOD) began packaging MOSFETs in the miniature DFN1212-3 package for cooler operation than the equivalent-footprint SOT723 package.
The updated "Garment System Considerations for Cleanrooms and Other Controlled Environments" document includes new sections on measuring footwear, frocks and other garments, as well as a new subsection for tracking system use, such as RFID chips and barcodes.
A group from the U. of Illinois has devised a way to identify and patch flaws in semiconductors within seconds, saving much analysis and manual fixing and sparing otherwise functioning chips from the trash heap.
EV Group (EVG), wafer bonding and lithography equipment supplier, introduced the XT Frame equipment platform for better process throughput and tool functionality. The platform will be used for all high-volume manufacturing tool offerings.
Applied Materials released a new film treatment, Applied Producer Onyx, that reduces the power consumption in semiconductor chips while increasing mechanical strength. The product targets the challenges associated with 3D packaging applications and technologies.
The Design Automation Conference (DAC) is soliciting semiconductor industry experts for participation in invited sessions, panels, and other events at the 49th DAC, June 3-7, 2012 in San Francisco, CA.
SEMI is looking for presenters for technical sessions and other opportunities at SEMICON West 2012, July 10-12 in San Francisco, CA.
imec is presenting a record number of 17 papers at the IEEE International Electron Device Meeting (IEDM), ending today in Washington, DC.
Applied Materials Inc. (Nasdaq:AMAT) presented five companies with awards for helping Applied meet its strategic business goals in 2011.
Jim Walker, VP, Research of Semiconductor Manufacturing and Emerging Technologies, at Gartner, speaks with Solid State Technology about revising Gartner
SEMICON Taiwan (Sept. 7-9) approaches, the island's most celebrated event for microelectronics manufacturing, coorganized by SEMI and the Taiwan External Trade Development Council (TAITRA), offers more than 60 programs and sessions and 550 exhibitors spanning the entire semiconductor value chain and related high-growth industries.
Laurent Malier, CEO of Leti, described the research group's work and the outlook on fully depleted silicon on insulator (FDSOI), 3D packaging technologies, and integrated photonics on silicon.
The 2012 Symposia on VLSI Technology & Circuits, to be held in Hawaii, June 12-14 (Technology) and 13-15 (Circuits), will accept innovative, original work on microelectronics, ranging from gate stacks and advanced lithography to 3D packaging.
SEMI honored Dr. Tibor Pavelka (Semilab) with the European SEMI Award; Heinz Kundert (SEMI Europe) with the IC Industry Award for Excellence; and Christian Prischmann (UIbrich) with the SEMI Europe Standards Leadership Award.
Both graphene and carbon nanotubes (CNT) suit applications from flexible displays to silicon-replacing transistors. In a relatively short time, graphene has emerged as a low-cost, tunable material for all kinds of electronics. Will graphene overtake CNTs as the nanomaterial of future devices?
Yole studies the evolution of inertial MEMS and magnetometers and provides reverse costing analysis of the MEMS devices in "Technology Trends for Inertial MEMS." The report considers 23 MEMS devices.
STMicroelectronics (NYSE:STM) has implemented through-silicon vias (TSV) in high-volume micro electro mechanical system (MEMS) devices. ST is using TSV in its smart sensors and multi-axis inertial modules.
IHS and Chipworks share details from their preliminary teardowns of the Apple iPhone 4S. The device resembles an iPad/iPhone hybrid, and the 5-lens autofocus camera module is the first IHS has encountered in a smartphone.
Imec engineers have simplified the thin-film wafer-level MEMS packaging process with nanopores that prevent leaks into the package and a low-temperature processing approach.
SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announces the cooperation with Swansea University´s Centre for NanoHealth (CNH).
Applied Materials Inc. (AMAT) launched the Applied Producer Optiva chemical vapor deposition (CVD) system for back-side-illuminated (BSI) image sensor manufacturing. It deposits low-temperature conformal films that boost the low-light performance of the sensor while improving its durability.
Silex Microsystems licensed its Silex Sil-Via through-silicon-via (TSV) packaging platform to Nanoshift for use in early development of complex MEMS products.
Dr. Giles Humpston, Tessera, presents the free, on-demand webcast Lens Tilt in Small Auto-Focus Cameras. Dr. Humpston covers the dominant auto-focus miniature camera technology today -- VCM -- and an improved technology based on MEMS, which is being commercialized now.
Ziptronix ZiBond direct bonding process contribute minimum distortion in backside illuminated (BSI) image sensors because of its low-temperature processing and high bond strength, the company reports.
The Heterogeneous Technology Alliance in Europe is developing new packaging and test methods for MEMS targeting space missions.
Precision Mechatronics Pty Ltd acquired Surfx Technologies, which specializes in high-speed atmospheric plasma technology for MEMS, microfluidics, semiconductors, solar cells, medical devices, and other manufacturing.
Tohoku University of Sendai, Japan and imec signed a collaboration agreement during the Belgian economic mission to Japan, expanding their R&D into areas such as MRAM and 3D semiconductor packaging.
A major high-volume MEMS maker has purchased a FOGALE nanotech T-MAP DUAL 3D 200A for its US manufacturing facility. The tool will be equipped with 2 load ports and will be fully automated.
X-Fab Silicon Foundries says it has become the majority shareholder in German MEMS Foundry Itzehoe GmbH (MFI), the latest in a series of recent moves to raise its profile as a top MEMS foundry.
The MEMS Industry Group (MIG) is planning webinars on micro electro mechanical systems (MEMS) from packaging challenges to how MEMS can benefit healthcare.
Heptagon, wafer-level optics maker, ordered an advanced DWL 2000 maskless lithography system from Heidelberg Instruments. The tool has sophisticated Gray Scale Exposure capability.
Sand 9 is partnering with GlobalFoundries for high-volume manufacturing of its microelectromechanical systems (MEMS) timing technology, which incorporates silicon-on-insulator (SOI) and through-silicon vias (TSV).
Micropelt has raised EUR6.5 million for the roll-out and global expansion of its thin-film thermoelectric energy harvesting technology: EUR5 million by Ludgate Environmental Fund (LEF); EUR1 million from the MUCAP; and EUR0.5 million by the existing shareholders IBG/Goodvent, KfW, L-Bank and SHS.
SUSS MicroTec uncrated the third generation of the ACS200 Coating and Developing Platform, developed from the company’s ACS200Plus and Gamma platforms for a compact, highly precise MEMS, LED, and related fab tool.
The MiQro Innovation Collaborative Centre (C2MI) is improving its state-of-the-art MEMS facility with Eyelit Manufacturing software to support R&D and the commercial activities of sponsor companies. C2MI is also installing a suite of new wafer processing tools from SPTS Technologies.
Enpirion, Inc. entered into a strategic partnership agreement with JiangyinChangdian Advanced Packaging Co., Ltd. (JCAP) for the manufacturing of silicon-based magnetics utilizing Enpirion's proprietary micro electronic magnetic silicon (MEMS) technology.
Silex Microsystems joined Energy-efficient Piezo-MEMS Tunable RF Front-End Antenna Systems for Mobile Devices to develop TSVs, PZT thin films, and other technologies for high-performance RF systems targeting mobile devices.
Si-Ware Systems debuted the SiMOST platform to fab and package single-chip optical systems with validated MEMS components. Multiple MOEMS structures can be patterned and etched on SOI wafers using DRIE. The structures are then wafer-level packaged and diced.
Nextreme Thermal Solutions announced that its thin-film thermoelectric technology has achieved a 60.1°C temperature difference between its cold and hot sides at an ambient temperature of 24.7°C, bringing it on par with the performance of bulk thermoelectric technology.
CMOS image sensors in 2011 continued to push CCD sensors into a smaller, isolated section of the market. CMOS image sensors are growing on use in mobile electronics and emerging applications, shows analyst firm IHS, and will find more adoption as back-side illumination costs come down.
STI Certified Electronics announced the appointment of Jim Panfil as Vice President of Business Development.
Integrated Silicon Solution, Inc. today announced the sampling of its new family of 72Mb Synchronous SRAMs.
New technology represents a breakthrough in overcoming NAND scaling limit and ushers in a new 3D memory era.
DRAM capex as a percent of sales forecast to reach all-time low in 2013.
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about Samsung's recent announcement on 3D vertical NAND.
Ultratech, Inc. announced last week that it has moved Ultratech/Cambridge NanoTech to Waltham, Mass.
Graphene has moved swiftly from the research laboratory to the marketplace, driven by demand from markets where advanced materials are required.
Crossbar, Inc., a start-up company, unveiled a new Resistive RAM (RRAM) technology that will be capable of storing up to one terabyte (TB) of data on a single 200mm2 chip.
SEMATECH today announced that Silvaco, Inc., a provider of Technology Computer Aided Design and Electronic Design Automation (EDA) software, has joined SEMATECH to collaboratively develop advanced modeling and simulation tools.
Spansion Inc., a developer of Flash memory-based embedded systems solutions, and XMC, China's fastest growing 300mm semiconductor foundry, today announced an agreement for XMC to license Spansion's floating gate NOR Flash technology.
Later this month, IC Insights’ August Update to the 2013 McClean Report will show a ranking of the top 25 semiconductor suppliers in 1H13.
Micron Technology, Inc. and Elpida Memory, Inc. trustees announced today the closing of Micron’s acquisition of 100 percent of Elpida’s equity, pursuant to a Sponsor Agreement entered into on July 2, 2012 in connection with Elpida's corporate reorganization.
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about the appearance of 3D integration on several roadmaps.
The U.S. image sensors market was worth USD 2.0 billion in 2011 and is forecasted to reach USD 3.7 billion in 2017 at a CAGR of 11.1 percent from 2011 to 2017.
The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $74.65 billion during the second quarter of 2013, an increase of 6 percent from the first quarter when sales were $70.45 billion.
Samsung today introduced the first solid state drive (SSD) based on its recently released 3D V-NAND technology. Samsung announced its new SSD, designed for use in enterprise servers and data centers, during a keynote at the Flash Memory Summit 2013.
Total microprocessor sales are forecast to rise 8 percent in 2013 and reach $61.0 billion.
Solid-state drives (SSD) got a huge push in the first quarter from greatly expanded usage in ultrathin/Ultrabook PCs as well as in PC tablets, where shipment volume to those sectors tripled within a year’s time in a mighty display of growth,
An international team of researchers has described a new physical effect that could be used to develop more efficient magnetic chips for information processing.
Everspin Technologies today announced that it has closed a Series B financing, raising $15 million to accelerate growth in the enterprise storage market and support the launch of its ground-breaking Spin-Torque MRAM (ST-MRAM) products.
Advanced semiconductor and computer manufacturer Adapteva today introduced its Parallella University Program (PUP) for academic institutions that conduct leading parallel programing research and/or education.
For most of us, a modern lifestyle without polymers is unthinkable…if only we knew what they were.
Worldwide silicon wafer area shipments increased during the second quarter 2013 when compared to first quarter 2013 area shipments, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.
A note from Karen Sevala, president, SEMI Americas.
Flexible thin film solar cells that can be produced by roll-to-roll manufacturing are a highly promising route to cheap solar electricity.
While the news was disappointing year-to-year, the news was encouraging quarter-to-quarter.
New technology allows process even more difficult than glass-to-glass welding, expanding the ways in which industries can take advantage of the versatile and popular sapphire.
Bruker Corporation today announced the appointment of Thomas Bachmann as the new president of its Bruker BioSpin Group.
The market for semiconductors used in industrial electronics applications relished a better-than-expected first quarter as macroeconomic headwinds turned out to be less severe than initially feared.
Michael R. Splinter will serve as executive chairman.
The Storage Products Business Unit of Toshiba is pleased to announce that its solid state hybrid drive (SSHD) series has been honored with a Best of Show Award at this year’s Flash Memory Summit.
Anapass, Inc, a display SoC solution provider, today announced that it has successfully completed development of a leading-edge panel controller system on chip “SoC” for UHD TV applications and has recently started mass production.
MTPV received the Top Pitch award for its breakthrough technology for converting heat to electricity using semiconductor chips as judged by several industry professionals, strategic partners and investors at SEMICON West’s Silicon Innovation Summit held in July of this year.
SunEdison Inc said it would spin off its semiconductor business in an initial public offering and use the proceeds to build solar farms.
The total applied market created by printed electronics technology is expected to grow at a compound annual growth rate (CAGR) of 47 percent to $24.3 billion by 2020 from $3.3 billion in 2013
Competitive pressures, collapse of vertically integrated business model, increasing "asset-lite" strategies lead to Japan mergers, spinoffs
RFMD today announced it has shipped more than one million RF7196D high-power, high-efficiency CMOS power amplifiers (PAs).
Share of total IC market by foundry-produced devices is forecast to reach over 45 percent in 2017.
Expands support for the US Aerospace and Defense market in its Newport Beach, CA facility
Entegris, Inc. and imec announced they are collaborating to advance the development and broaden the adoption of 3D integrated circuits.
Solid State Technology and SEMI announced the recipient of the 2013 “Best of West” Award — Mentor Graphics — for its Tessent TestKompress with Cell-Aware ATPG.
Bruce Kim, CEO of SurplusGLOBAL, expects a slight upturn in the Asian Secondary Semiconductor Equipment Market at Semicon West.
SEMICON Taiwan is set to open in September amidst an improving global and regional outlook for 2013 and 2014 that sees Taiwan remaining the largest and strongest market for semiconductor manufacturing.
SEMI honored 14 industry leaders for their outstanding accomplishments in developing standards for the microelectronics and related industries. The SEMI Standards awards were announced at a reception held during SEMICON West 2013.
Battered by the nonstop onslaught of media tablets, the mobile PC market in 2013 delivered the worst second-quarter performance in 11 years.
Memory and foundry account for more than half of worldwide IC capacity.
Project targets more efficient 3D TSV integration and covalent bonding at room temperature
Dow Corning announced Monday that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics.
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved strong revenue growth and expanded its headcount for the first half of 2013.
Alchimer, S.A. today announced a collaboration with the French research institute CEA-Leti to evaluate and implement Alchimer's wet deposition processes for 300mm high-volume manufacturing.
SEMI forecasts semiconductor equipment sales will reach $43.98 billion in 2014, a 21 percent increase over estimated 2013 equipment spending.
When Ajit Manocha, GlobalFoundries CEO, polled his audience during his keynote address on Tuesday at SEMICON West 2013, nearly 60 percent of the audience believed that the biggest challenge facing the semiconductor industry was the economy. However, during his presentation, Manocha seemed to suggest otherwise.
Leaders of research consortia from around the world sat down to share updates and insights with SEMICON West attendees on Wednesday morning.
Researchers sponsored by Semiconductor Research Corporation (SRC), the world's leading university-research consortium for semiconductors and related technologies, today announced that they have developed a more efficient purge technique that reduces the consumption of ultra-high purity (UHP) purge gases by more than 20 percent during the production of semiconductors.
World’s smallest semiconductor process node will feed the storage demands of consumer applications and data centers.
Executives from the world’s leading microelectronics companies will meet with delegates representing Vietnamese government, academia, research, and industry to explore and discuss the key strategies and opportunities in the growing Vietnam semiconductor industry at the SEMI Vietnam Semiconductor Strategy Summit.
With most of the top brands introducing new flagship models in the first half of 2013, smartphone buyers now have more choices than ever, a phenomenon that will contribute to an expected doubling in market shipments from 2012 to 2017.
The latest trends, challenges and business opportunities in advanced materials for semiconductors, MEMs, power devices, storage, and other electronic devices will be addressed at the 2013 SEMI Strategic Materials Conference (SMC), to be held on October 16-17 at the Santa Clara Marriott in Silicon Valley, California.
SEMI today announced that Ajit Manocha, CEO of GLOBALFOUNDRIES, has been selected to receive the “SEMI Outstanding EHS Achievement Award — Inspired by Akira Inoue.”
Developers have made major progress in the technology to manufacture printed or flexible circuits, sensors, batteries and displays. But frankly it’s been hard to build applications with much market pull without logic or memory as well, and those have been much harder to make.
Europe’s recently launched industrial strategy to reinforce micro- and nanoelectronics manufacturing is more than just a vision — it’s a major opportunity for equipment and material suppliers to participate to large-scale investment projects, increase their holding in key technologies and reach out to new customers and markets.
The future is bright for the future semiconductor and IT industry, according to Samsung exec Yoon Woo (Y.W.) Lee. In a keynote talk at The ConFab, Mr. Lee described a future with dramatic advances in almost every field, including healthcare, nano, energy and the environment, all powered by semiconductors
This technology paves the way towards interconnect Cu metallization into the 7nm node and beyond.
China’s total IC production is forecast to represent only 6% of the worldwide IC market in 2017.
After a flat year in 2012, global purchasing of semiconductors by the world’s top electronic brands is set to return to growth in 2013, as Apple Inc. and Samsung Electronics contend to claim the title of biggest spender.
Cree, Inc. announces that its 1200 V SiC MOSFETs are being incorporated into the latest advanced power supplies from Delta Elektronika BV.
Engineering samples of The Hybrid Memory Cube (HMC) are expected this summer, with high volume manufacturing coming next year. It will be one of the first high volume devices employing 3D integration and through silicon vias (TSVs), employing a bottom logic layer and 4-8 stacked DRAM layers.
North America-based manufacturers of semiconductor equipment posted $1.33 billion in orders worldwide in June 2013 (three-month average basis) and a book-to-bill ratio of 1.10.
A new generation of thin hard disk drives (HDD) only 5.0 and 7.0mm thick are expected to enjoy fast sales growth in coming years, as mobile computers including ultrathin PCs and PC tablets drive up demand by a factor of more than 25 from 2012 to 2017.
A variety of techniques and materials have been developed to successfully achieve bonding/debonding for 3D integration, but Tony Flaim, chief technology officer of Brewer Science (Rolla, MO) says they are still too complicated.
Rudolph Technologies, Inc., a provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, today released three new application-specific configurations of its industry-leading NSX 320 Automated Macro Defect Inspection System.
Dialog Semiconductor plc, a provider of highly integrated power management, audio, AC/DC and short-range wireless technologies today announced that Richard Beyer, appointed to the board in February this year, as an independent non-executive director, will succeed Gregorio Reyes as chairman of the board. Greg will continue to serve as a board member.
CEA-Leti today announced that a group of European and Japanese companies, research institutes, universities and cities will work together in the ClouT project to deliver ways for cities to leverage the Internet of Things (IoT) and cloud computing – to become smart cities.
Together with its partners STFC and Fraunhofer IIS, imec announced today that the European Commission has pledged to continue funding the Europractice IC services for another three years under the Seventh Framework Programme (FP7).
Toshiba Corporation and Amkor Technology, Inc. today announced that the companies have completed Amkor’s acquisition of Toshiba Electronics Malaysia Sdn. Bhd., Toshiba’s semiconductor packaging operation in Malaysia.
Israel Beinglass, CTO of MonolithIC 3D Inc., blogs about roadmap misses and the relationship between two seemingly unrelated technologies.
Spansion Inc. today announced production of a new family of 16 Mb, 32 Mb and 64 Mb Spansion FL-1K Serial Flash memory devices.
Samsung announced today that it is mass producing the world’s fastest embedded memory – the industry’s first eMMC 5.0 devices – in 16 gigabyte (GB), 32GB and 64GB densities for next-generation smartphones and tablets.
Cascade Microtech, Inc. and imec today announced breakthroughs in probing stacked integrated circuits (3D-SICs), fueling an important growth engine for the semiconductor market.
Semiconductor revenue worldwide will see improved growth this year of 6.9 percent and reaching $320 billion according to the mid-year 2013 update of the Semiconductor Applications Forecaster (SAF) from International Data Corporation (IDC).
Mike Splinter, chairman and chief executive officer of Applied Materials, was awarded the 2013 Robert N. Noyce Award, presented annually by the Semiconductor Industry Association, for outstanding achievement and leadership in support of the U.S. semiconductor industry. Splinter has been on the SEMI International Board of Directors since 2005.