sst-semicon-west

Topic Index

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z 0-9


SEMICON West Preview

Thu, 6 Jun 2007
SEMICON West will take place July 16–20 in San Francisco, bringing together equipment suppliers, SATS providers, R&D institutes, and related companies in the semiconductor packaging industry to highlight new processes, systems, and packages.

Tradeshow Preview: SEMICON West

Tue, 6 Jun 2007
Our series of product and event previews leading up to SEMICON West 2007, July 16–20 in San Francisco, continues with summaries of exhibits from Micro Control Company, Hyphenated Systems, Siemens, Ultratech, DfR Solutions, JPSA, Synopsys, and more.

News Wrap from SEMICON West

Tue, 7 Jul 2007
By Françoise von Trapp, managing editor

Following are announcements of expansion, integration, and partnerships made on the floor at SEMICON West this July. News comes from Palomar, Tessera and Alps Electronics, Besi, and Watlow.

SEMICON West Headlines

Sun, 9 Sep 2002
SAN JOSE, CALIF. - Below are some of the many press releases announced during SEMICON West. Visit the Advanced Packaging Web site at www.apmag.com to find links to all these and other stories from SEMICON West.

U.S. Election 2008: SEMI Voices Industry Platform

Tue, 7 Jul 2008
(July 14, 2008) SAN FRANCISCO — Urging presidential candidates to make technology policy a top priority, SEMI North America voiced their agenda for Washington at the SEMI Press Conference, held July 14 during SEMICON West. The agenda zeroed in on four critical areas: technology, tax, talent, and trade.

Stan Myers, SEMI, Provides Perspectives on R&D and Outlook for the Semiconductor Industry

Mon, 7 Jul 2008
(July 14, 2008) SAN FRANCISCO — Setting the tone for the week's events, Stan Myers lead off SEMICON West's opening press conference, presenting the latest trends worldwide, midyear equipment forecast by market segment, and reporting the findings of the SEMI equipment productivity working group's (EPWG).

High-speed, Fully Automatic Wedge Bonder for Wire and Ribbon

Wed, 7 Jul 2008
The BONDJET BJ820, from Hesse & Knipps, is a high-speed, fully automatic wedge bonder for both high-speed round wire and deep access ribbon and wire bonding. It handles all challenging fine pitch wire bonding applications in a single platform - including RF and microwave devices, COB, MCM and hybrids, fiber optics and automotive - using aluminum or gold wire or ribbon. It reportedly offers bond speeds up to 7 wires-per-second.

Amkor Introduces Novel Flip Chip Technology

Wed, 7 Jul 2008
(July 2, 2008) CHANDLER, AZ — Amkor Technology, Inc. announced the introduction of a high-performance flip chip packaging technology using an advanced molding process technology that is expected to provide a number of design, cost and performance advantages for field programmable gate arrays (FPGAs), CPUs, graphics processors, and ASICs. The company plans to feature this technology during SEMICON West 2008, July 15 - 17, in San Jose, CA.

QFN Test Socket

Wed, 7 Jul 2008
The Z-Socket, or impedance socket, from Antares, is an RF QFN test socket developed to combine the reliability of traditional spring-probe technology with the impedance-matching functionality of shorter interconnects at higher price points.

Test Measurement Unit

Wed, 7 Jul 2008
The ITC59200 test measurement unit (TMU), from Integrated Technology Corp. is designed to provide two test functions: die attach and forward bias safe operating area (FBSOA). Die attach testing is performed to detect voids under the die and other types of device construction flaws that could affect the lifetime and safe operating area SOA of the device. The FBSOA non-destructive test is used to determine the SOA of the device.

CT Inspection System Software

Wed, 7 Jul 2008
The Quick View CT inspection system from Dage allows users to obtain initial computerized tomography (CT) reconstructions within 5 minutes, compared to previous times of over 20 minutes. This quick view CT software makes CT a more viable process tool for production and failure analysis applications

Advanced Packaging and Solid State Technology Applaud 2008 ACA Winners

Tue, 7 Jul 2008
(July 22, 2008) NASHUA, NH — On Wednesday, July 16, 2008, the editors and publisher of Solid State Technology (SST) and Advanced Packaging Magazine presented the 2008 ACA Awards, in usual impromptu style on the floor at SEMICON West. This was the sixth straight year attendees of SEMICON West were invited to vote on products they saw at the annual trade show.

SEMICON West Exhibitor 2008 Spotlight

Tue, 7 Jul 2008
by Fran

Mentor Graphics Chairman, CEO Keynotes Semicon West

Mon, 7 Jul 2009
(July 13, 2009) WILSONVILLE, OR — Mentor Graphics Corporation's Walden C. Rhines, Ph.D., will present the keynote at Semicon West 2009 in San Francisco, CA, this week. The chairman and CEO of the design software company will talk about the myths and realities of the global semiconductor industry on July 15, at 10 am.

SEMICON West: Jan Vardaman and Paul Siblerud Analysis

Fri, 7 Jul 2009
Paul Siblerud, SEMITOOL, discusses the role of the EMC-3D consortium in developing new packaging technologies, such as through silicon vias (TSV). Jan Vardaman, TechSearch International, examines the barriers, and breakthroughs, around 3D integration.

Henkel's Dixon at SEMICON West: Silver sintering, die-attach validation

Thu, 8 Aug 2011

Doug Dixon from Henkel explains two announcements the company made at SEMICON West: a silver sintering material that requires no pressure, and joint work with STMicroelectronics on conductive die attach films for very small package configurations.


LED packaging equipment for better throughput, quality, and yields

Thu, 8 Aug 2011

In these 2 video interviews from SEMICON West 2011, ESI technologists John Sabol and Vernon Cooke discuss what LED chips require on the back-end manufacturing line, starting at wafer scribing and moving on through test.


Lack of EDA tools, thermal issues impeding 3D packaging technology

Wed, 8 Aug 2011

Amkor's Ron Huemoeller shares his thoughts about two panels from SEMICON West, on 2.5D silicon interposer packaging technologies and its supply chain, and 3D packaging technology and its ecosystem.


Suss MicroTec 3D IC workshop addresses thin wafer handling and testing

Mon, 7 Jul 2011

At SEMICON West, 100+ attendees gathered at the Suss MicroTec workshop "3D Integration: Are we there yet?" to hear technical experts from around the globe to present updates on the status of 3D technology.


What SEMICON West offers packaging professionals in 2011

Thu, 6 Jun 2011

SEMICON West is a major conference for semiconductor manufacturing professionals. Semiconductor packaging has become a major focus in recent years, and this year, BEOL attendees have ATE Vision 2020, 3D IC standards meetings, a keynote, and multiple sessions dedicated to packaging technologies. Here's your guide to attending SEMICON West on a packaging track.


Notes from SEMICON West: Detecting solder joint fractures

Mon, 7 Jul 2012

Jennifer Wrigley and Robert Bellinger, Olympus, share insights on SEMICON West

Nordson MARCH plasma treatment system handles sensitive semiconductor packaging substrates

Fri, 7 Jul 2012

Nordson MARCH uncrated the FasTRAK Plasma System at SEMICON West. The automated, high-throughput vacuum plasma treatment system processes leadframe strips, laminate substrates, and other strip-type microelectronic components.


2012 ITRS update: Back-end packaging and MEMS

Fri, 7 Jul 2012

At SEMICON West, the working groups of the International Technology Roadmap for Semiconductors (ITRS) outlined 2012 updates to the roadmap. Check out the back-end process info here.


Video: Readiness of 3D technologies from a materials perspective

Fri, 7 Jul 2010

Mark Privett, Brewer Science, says that new technologies allow use of higher temperatures as well as room-temperature processes, such as wafer de-bonding. The 3D industry is nearly ready for high-volume, yet still without industry standards.


EDA in a 3D semiconductor world: Walden Rhines

Tue, 7 Jul 2010

In this video interview from SEMICON West 2010, Walden Rhines, Mentor Graphics, discusses 3D technologies. EDA tools need to be extended to meet the needs of 3D -- parasitic extraction and timing, place-and-route, and other steps are different with 3D. The tools are evolving for the various 3D technologies. He also touches on lithography evolution.


TSV infrastructure and standardization questions with Matt Nowak

Tue, 7 Jul 2010

In this video, Matt Nowak, Qualcomm, talks about his keynote at ASMC on through silicon technologies for stacking die in advanced packaging applications.


SEMICON West Lesson #3: 3D and packaging are hot

Mon, 7 Jul 2010

Wrap-up of what we heard and saw at SEMICON West 2010. Lesson 3: Everything about 3D & packaging was hot, with suppliers jostling to get into this next high-growth market. But are they really prepared for what awaits them?


Semiconductor fab and packaging in the US: Marcy Nano Center

Fri, 7 Jul 2010

In this video, Timothy Dunn, Marcy Nano Center, discusses building an eco system for advanced semiconductor manufacturing in the US. Marcy Nano Center is pre-permitted and site-ready to build a semiconductor site with a packaging focus, with its academic and industry partners.


AMEC targets advanced packaging TSV etc apps

Wed, 7 Jul 2010

Advanced Micro-Fabrication Equipment Inc. (AMEC) is fielding interest from packaging companies in the Primo D-RIE tool, which can be used to etch wafers for through-silicon via (TSV) interconnects.


Listen to the podcast: Back-end test moves to more flexible model

Wed, 7 Jul 2010

Mark Allison, VP, Strategic Marketing, Verigy Ltd., points out that the economic downturn helped promote the outsourced semiconductor assembly and test (OSAT) model, which pushes test platforms into more configurable models.


Roadmapping More than Moore: When the application matters

Fri, 7 Jul 2012

At the ITRS 2012 update, back-end technologies session, at SEMICON West, roadmapping for More than Moore was addressed as both a philosophical and technical matter.


MicroProbe enhances wafer probe card reliability with CCC improvement

Wed, 7 Jul 2012

MicroProbe introduced current-carrying capability of >1A/probe in 90

Contemporary semiconductor packaging experts open up on cost

Tue, 7 Jul 2012

The bulk of packaging falls under the

2.5/3D interposers fabbed at 30% lower COO with USHIO

Mon, 7 Jul 2012

USHIO Inc. is introducing the large-field stepper lithography tool

Epson launches high-throughput IC test handler for volume test

Mon, 7 Jul 2012

Seiko Epson launched the NX1032XS pick-and-place IC test handler, boasting high throughput for transferring, inspecting, and sorting semiconductors.


SEMICON West 2012 exhibits preview: Semiconductor packaging products

Fri, 6 Jun 2012

SEMICON West is taking place July 10-12 in San Francisco, CA. Following are new products for semiconductor packaging and test that will be at the show, from wafer bonders to LED die attach materials.


Via-last 3D packaging and interposer metallization costs chat

Thu, 7 Jul 2011

Steve Lerner, CEO of Alchimer, discusses the company's latest suite of through silicon via (TSV) technologies, focusing on how the platform reduces costs for advanced packaging processes.


SEMICON West workshop addresses stress management for 3D ICs using TSVs

Tue, 7 Jul 2011

Speakers at a SEMATECH/Fraunhofer-hosted workshop at SEMICON West looked at stress management for 3D ICS using TSVs: the state of reliability testing, failure analysis techniques, and why an engineering paradigm shift is needed.


SEMATECH survey on 2.5D, 3D IC; gaps in the via-mid ecosystem

Thu, 7 Jul 2011

Sitaram Arkalgud, director of interconnect at SEMATECH, discusses the high-volume manufacturability issues and gaps in both 2.5D and 3D semiconductor technologies with respect to backside processing and wafer bonding, thinning, and handling. Standards are also covered.


LED packaging equipment debuts at ESI booth: Via drilling and wafer scribing tools

Thu, 7 Jul 2011

ESI uncrated the Model 5390 micromachining system for advanced LED via drilling and the AccuScribe 2600 HB-LED wafer scribing system at SEMICON West.


Henkel power package sintering technology shuns Pb, pressure processing

Wed, 7 Jul 2011

Henkel Electronic Materials introduced a silver (Ag) sintering technology that enables high-volume power package production that skips single-package pressure processing, eliminates lead-based solder, and withstands temperature cycling better than currently available materials.


Henkel develops die attach film for leadframe packages

Wed, 7 Jul 2011

Henkel worked with STMicroelectronics (STM) to qualify Henkel's Ablestik C100 conductive die attach film materials for scalable, adaptable leadframe packaging.


TSV moves to "real engineering," but reliability data needed

Mon, 7 Jul 2011

Jan Vardaman, president and founder of TechSearch International, summarizes highlights from her SEMICON West presentation on TSVs, speaking to RDL development, LED packaging, and TSV-alternative PoP.


Robotic die bonder upgrades SET packaging platform

Fri, 7 Jul 2011

The FC300R performs chip-to-substrate bonding, chip-to-wafer assembly, and chip-to-chip stacking for flip chip, through silicon via (TSV), and other advanced packaging processes, with a robotic handling system for fragile and diverse substrates/wafers.


Advanced packaging programs at SEMICON West emphasize holistic approach

Fri, 6 Jun 2011

SEMICON West preview: This year's SEMICON West Advanced Packaging Program is taking a broad approach, encouraging participation from across the supply chain to help keep pace with a rapidly expanding electronics market -- and in markets beyond, from automotive to aerospace and medical.


Bart Swinnen, IMEC, Discusses TSVs

Fri, 8 Aug 2009

In this video interview from SEMICON West 2009, Bart Swinnen, reviews the established interconnect bonding and through-silicon via (TSV) technologies at the system-integration level. He also discusses the newer TSV possibilities and different application-specific TSVs.


Relocation

Sat, 9 Sep 2001
Moving from California to New Hampshire has been an educational experience. The move, prompted recently by the opportunity to join the Advanced Packaging staff, gave me the chance to learn, among other things, that our family's possessions weigh 9.7 tons

Floor Semicon West 2000

Thu, 6 Jun 2000
It's that time of year again when we all have Semicon West on our minds or agendas. We are anxiously waiting to see the latest and greatest in semiconductor manufacturing - specifically as it relates to packaging, assembly and test

2012 “Best of West” award finalists announced

Thu, 6 Jun 2012

Solid State Technology and SEMI today announced the finalists for the 2012 “Best of West” awards, recognizing important product and technology developments in the microelectronics supply chain.


SEMICON West preview: Metrology, inspection, and process control products

Thu, 6 Jun 2012

Following are some of the process control, device inspection, defect detection, and other metrology and test products that will be on display at SEMICON West 2012, July 10-12 in San Francisco, CA.


Guide to LED and OLED programs at SEMICON West

Thu, 6 Jun 2012

SEMICON West 2012 will take place July 10-12 at the Moscone Center in San Francisco, CA. Following is a preview of the LED and OLED events taking place during SEMICON West, from contributor Paula Doe, SEMI Emerging Markets.


SEMICON West 2012 exhibits preview: Lithography focus

Wed, 6 Jun 2012

SEMICON West is taking place July 10-12 in San Francisco, CA. Following are new products for  lithography, including photoresist coaters and ashers.


SEMICON West preview: OLED displays and lighting adopt printing processes, flexible substrates

Tue, 7 Jul 2012

Technology for making circuits with organic materials, non-vacuum processes, and flexible substrates has made striking progress, but it’s been a challenge to find applications where the new technologies offer must-have advantages. Paula Doe, SEMI, reports on flexible and large-area OLED displays and lighting.


Applied Materials targets 3D memory with new Avatar dielectric etch system

Thu, 6 Jun 2012

Applied Materials introduced a new dielectric etch system called the Centura Avatar, which can etch holes and trenches in complex film stacks with depth to width aspect ratios of up to 80:1. It is designed to meet new requirements in creating 3D memory architectures.


SEMICON West takeaways: Seasonality over cyclicality, lithography and test trends

Mon, 7 Jul 2012

SEMICON West kicked off with a surprise announcement regarding Intel's investment in ASML, but generally the event highlighted trends “as expected” in the fab supply chain, say Barclays analysts.


Terry Brewer chats about SEMI and semiconductors at SEMICON West

Fri, 7 Jul 2012

Terry Brewer, one of the newest members of SEMI's North American advisory board, talks about semiconductor industry consolidation, as well as new technologies and materials in the industry. He shares how SEMI is reacting to this evolution.


LED fab equipment capex to brighten in H2 2012

Fri, 7 Jul 2012

SEMICON West confirmed for Barclays that Q2 2012 orders for MOCVD tools remained flattish with the trough-like Q1 numbers, and LED makers are expected to order more tools in H2 2012.


Bruker metrology suite debuts for 450mm semiconductor fab

Fri, 7 Jul 2012

Bruker introduced three 450mm X-ray and AFM semiconductor metrology tools -- the InSight-450 3DAFM, the D8 FABLINE X-ray system, and the S8 FABLINE-T X-ray system -- during SEMICON West.


2012 ITRS stabilized for front-end, but changes loom for 2013

Fri, 7 Jul 2012

The overriding message for 2012 is that the roadmap has been largely stabilized with the significant changes that were input last year in the 2012 publication,” said Intel’s Alan Allan, speaking at Semicon West.


Microelectronics standards leaders honored by SEMI

Thu, 7 Jul 2012

At SEMICON West, SEMI honored six industry leaders for their outstanding accomplishments in developing standards for the microelectronics and related industries.


Fabless keynote: Xilinx on programmability @ SEMICON West

Thu, 7 Jul 2012

SEMICON West’s Day 2 keynote speaker represented a fabless company: Ivo Bolsens, PhD, SVP and CTO of Xilinx presented on how programmable chips and innovative packaging can advance semiconductors.


Interviews with CEA-Leti researchers at SEMICON West

Thu, 7 Jul 2012

CEA-Leti presented research updates alongside SEMICON West this week. After the talks on device architecture, 3D and 2.5 packaging interconnects, large-scale computing and power consumption, and more, CEA-Leti’s researchers joined Solid State Technology to talk about their fields of interest.


Q3 semiconductor tool capex pull-back: Seasonal, expect Q4 uptick

Thu, 7 Jul 2012

Barclays Capital is seeing various reasons for a Q3 2012 semiconductor fab order/shipment pull-back, following meetings around SEMICON West 2012. The analysts expect strong orders in Q4.


Semiconductor fab tool capex trends gleaned @ SEMICON West

Thu, 7 Jul 2012

After meeting with various semiconductor manufacturing tool suppliers -- Applied Materials, KLA-Tencor, Lam Research, Tokyo Electron, Teradyne and Cymer -- at SEMICON West, Citi analysts share impressions on foundry spending plans and tool choices.


SEMICON West Day 2: DSA lithography and CMP meetings

Thu, 7 Jul 2012

Blogger Michael A. Fury, Ph.D., Techcet Group, reports on Day 2 of SEMICON West with insights from the Sokudo Lithography Forum and NCCAVS CMPUG meeting, and -- sadly -- none on SEMICON West’s Happy Hour.


Jordan Valley Semiconductor's 450mm defect detection tool wins Best of West

Wed, 7 Jul 2012

Solid State Technology and SEMI announced the Best of West Award winner -- Jordan Valley Semiconductor -- during SEMICON West today. Jordan Valley Semiconductor’s QC-TT defect inspection system predicts breakage in 450mm wafers, which are subject to more handling steps and more thermal stresses due to their larger size.


Chat with Intel’s Shekhar Borkar @ SEMICON West 2012: Overpowering power consumption

Wed, 7 Jul 2012

In this video interview, Intel's Shekhar Borkar shares some key topics from SEMICON West keynote: Near-threshold voltage transistor designs, 3D integration for DRAM, unconventional interconnect, and more.


LED insights from SEMICON West 2012

Wed, 7 Jul 2012

Citi analysts surveyed the LED manufacturing market and LED demand at SEMICON West in San Francisco, CA, including a slight uptick in MOCVD orders, and some backlash against Cree's downstream ambitions.


SEMICON West Day 1: Focus on EUV lithography and 450mm

Wed, 7 Jul 2012

Barclays Capital analysts share observations from meetings with semiconductor manufacturing tool suppliers at SEMICON West, noting the enthusiasm and concrete deals around EUV lithography and transitioning to the 450mm wafer size.


Semicon West Day 1: FDSOI and TSV R&D with CEA-Leti

Wed, 7 Jul 2012

Michael A. Fury, Ph.D., reports on the opening day of SEMICON West (July 10), covering exaflop computing, FDSOI, TSV and other integration schemes, and silicon photonics with CEA-Leti.


Imec at SEMICON West: Interview with Luc Van den hove

Tue, 7 Jul 2012

Luc Van den hove, president and CEO, imec, spoke with Solid State Technology, covering imec’s major announcements and research presentations to take place during SEMICON West 2012.


ATMI aims for safer, cleaner liquid containment during semiconductor and related fab

Tue, 7 Jul 2012

ATMI introduced BrightPak, its next-generation liquid containment and delivery system for high-value liquid material transfers during advanced photolithography processes in semiconductor, FPD, and LED manufacturing.


Semiconductor equipment spending to contract 2.6% in 2012, grow in 2013

Tue, 7 Jul 2012

Semiconductor equipment sales will reach $42.4 billion in 2012, according to the mid-year edition of the SEMI Capital Equipment Forecast, released at SEMICON West 2012.


Semicon West 2012 opens with semiconductor revenue forecasts, high-level perspectives

Tue, 7 Jul 2012

Michael A. Fury, Ph.D., reports from the pre-opening day (July 9) of SEMICON West at the Moscone Center in San Francisco, CA. The first day hosts SEMI’s press conference on semiconductor revenues and the SEMI/Gartner Market Symposium.


Intel takes 15% stake in ASML, part of EUV, 450mm development push

Tue, 7 Jul 2012

ASML established a program to enable its largest customers to make minority equity investments in the semiconductor manufacturing tool maker. The program includes commitments to fund ASML's R&D spending, accelerating development of EUVL and 450mm technology for 2015-2020 timeframe.


SEMI Board of Directors election brings new and familiar faces

Tue, 7 Jul 2012

SEMI’s annual Board of Directors election results are in, with new directors Jifan Gao, Trina Solar; Nobu Koshiba, JSR Corp.; Sue Lin, Hermes-Epitek; and Natsunosuke Yago, Ebara Corp., joining.


More SEMICON West exhibit previews

Sun, 7 Jul 2012

Following are some of the new and flagship products that will appear this week at SEMICON West, July 10-12 in the Moscone Center of San Francisco, CA.


USHIO UV irradiance meter offers thin form factor for optical film process control

Mon, 7 Jul 2012

Ushio launched its thinnest UV irradiance meter 'UIT-q365." The meter is 4.9mm thick, used to keep major UV processes within spec. It can be used during optical film manufacturing for flexible electronics, as well as during adhesion of precision optical parts.


SEMICON West 2012 exhibits preview: Wafer processing and handling

Mon, 6 Jun 2012

Some of the new and flagship wafer fab products and supporting facility products, like vacuum valves, that will be on the show floor at SEMICON West, from ion implant to MOCVD traps and gas blenders.


Supply chain readiness in an era of accelerated change

Fri, 8 Aug 2012

In this SEMI News and Views blog, Karen Savala covers EUV lithography, 450mm wafers, and 3D IC developments, based on her recent presentation at SEMICON West, “Supply Chain Readiness in an Era of Accelerated Change.”


SEMATECH to address critical supply chain challenges and more at SEMICON West 2013

Mon, 6 Jun 2013

Through a series of lectures and workshops, SEMATECH will address R&D challenges and closing key infrastructure technology gaps from July 8–12 at SEMICON West in San Francisco, CA.


Multitest VP to discuss quality in 3D assembly at SEMICON West

Tue, 6 Jun 2013

Multitest’s James Quinn will present during the 2013 SEMICON West exhibition and conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA.


SEMI releases report on first quarter 2013 manufacturing equipment billings

Tue, 6 Jun 2013

SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.31 billion in the first quarter of 2013.


"Generation Mobile": Advanced Packaging Technology at SEMICON West

Thu, 6 Jun 2013

Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function.


450mm – It’s bigger than you think

Thu, 6 Jun 2013

Much has been said of the 450mm transition.  But the description of this inflection is something of a misnomer.


Test Vision 2020 at SEMICON West to address emerging test strategies, technologies and challenges

Fri, 5 May 2013

Critical trends and developments in the technologies, methodologies, and applications challenges in semiconductor test will be presented at the 6th annual IEEE Test Vision 2020 Workshop held in conjunction with SEMICON West 2013, on July 10-11 at the San Francisco Marriot Marquis Hotel.


Precision is key to scaling below 14nm

Mon, 6 Jun 2013

In advance of the 2013 SEMICON West TechXPOTs on lithography and nonplanar transistors beyond 20nm, SEMI asked some of the speakers and industry experts to comment on the challenges they wanted to highlight. Many of the inputs focused on the need for precision in the processes used to form transistors, as well as how EDA can contribute to mitigating variability.


Semiconductor R&D: A state of transition

Thu, 4 Apr 2013

Several years ago when the challenges to 450mm wafer processing, EUV development and novel transistor designs were first being discussed, SEMI commissioned a study that predicted the industry could face an R&D funding gap that could exceed $9 billion if current technology and economic trends continue.


SEMICON West 2013 to address industry R&D challenges and opportunities

Tue, 3 Mar 2013

Dynamic changes to R&D processes, tools, technical challenges, and funding/business models will be highlighted at SEMICON West 2013, along with product displays of the latest semiconductor manufacturing technology, components and subsystems.


Production metrology of advanced LED structures using high-resolution X-ray diffraction

Thu, 7 Jul 2010

The latest advances in HRXRD technology to allow true in-line monitoring, are described. Paul Ryan, et al, Jordan Valley Semiconductors UK Ltd.


Yield metrology looking at systematic failure mechanisms: Synopsis

Thu, 7 Jul 2010

In this video from SEMICON West 2010, Sagar Kekare, Synopsis, presents ideas from his paper on rapid root cause analysis and process change validation using design-centric volume diagnostics.


EUV news from SEMICON West with Toppan Photomasks

Tue, 7 Jul 2010

In this video interview, Franklin Kalk, Toppan Photomasks, comments on the big EUV news annouced at SEMICON West. Technical challenges of EUV remain defect management -- finding and fixing defects in masks. Pattern mask inspection may not be ready until 2016.


Video interview with Entegris: Contamination control at 22nm and below

Fri, 7 Jul 2010

Christopher Wargo, Entegris, talks contamination control at 22nm and below. Lithography presents a suite of issues for contamination control. While the technology exists to confront new contaminants, commercialization is key.


SEMICON West, Day 1: CMP, slurries, metrology, thermal, zombies, observations

Wed, 7 Jul 2010

Techcet's Michael Fury reports from Day 1 of SEMICON West, from keynotes to CMP to thermal characterization, and the continued use of “zombie” semiconductor manufacturing technologies.


Soitec platform enables planar FD technology

Tue, 7 Jul 2010

The Soitec Group (Euronext Paris) released the Ultra-Thin Buried Oxide (UTBOX) extension to its Ultra-Thin (UT) silicon-on-insulator (SOI) platform, a robust substrate solution for chip designers tackling the performance, power and density challenges of mobile consumer devices.


Chip makers adopt ASML Holistic Lithography

Tue, 7 Jul 2010

ASML Holding NV (ASML) announced broad customer adoption of holistic lithography products that optimize semiconductor scanner performance and provide a faster start to chip production. All of ASML’s leading-edge scanners are now sold with one or more holistic lithography components.


Applied Materials iSYS Integrated Subfab System wins SEMICON West Sustainable Technologies Award

Mon, 7 Jul 2010

SEMI has announced that Applied Materials, Inc. is the recipient of its 2010 SEMICON West Sustainable Technologies Award in recognition of the Applied iSYS Integrated Subfab System. The Sustainable Technologies Award winner was selected with technical guidance from a panel of technology industry environmental, health and safety experts.


Synchronized plasma pulsing behind Applied’s AdvantEdge Mesa etch tool

Mon, 7 Jul 2010

Applied Materials etch VP Thorsten Lill explains how the company’s AdvantEdge Mesa etch tool, debuting at this year’s SEMICON West, uses synchronizing plasma pulsing to tackle problems inherent with advanced conductor etch.


Real-time CMP monitoring tracks LPCs

Mon, 7 Jul 2010

 

With continued device geometry and new process steps comes increasing use and variety of CMP steps, and an increasing need to learn more about (and ultimately manage/eliminate) particles in the slurry that can wafer defects and yield losses. Enter Vantage Technology, which is debuting a new slurry particle measurement technology, SlurryScope (patented in the US and internationally), to provide undiluted real-time measurement of industry-standard production slurries.


SEMICON West Lesson #1: Good times here, for now

Mon, 7 Jul 2010

Wrap-up of what we heard and saw at SEMICON West 2010. Lesson 1: Good times abound, visibility's increasing, and show stats were better -- though what kind of show is it now?


CEA-Leti debuts low-power reconfigurable multicore chip for software-defined radio, cognitive radio

Mon, 7 Jul 2010

CEA-Leti developed a digital baseband circuit for software-defined-radio and cognitive-radio applications that features less than 50 microseconds (µs) for full reconfiguration and multi-applications support.


Gary Smith EDA market statistics 2010: Summary

Thu, 7 Jul 2010

The biggest change in 2009 was Mentor passing Cadence to become number two in product sales in EDA. This is an indication of the market shift caused by the move into the ESL Methodology. Synopsys remains a strong number one.


SEMICON West Day 3: CMP and beyond, YouTube walkthroughs, PV drinking habits

Tue, 7 Jul 2010

Techcet's Michael A. Fury concludes his observations from this year's SEMICON West. Highlights from Day 3: CMP beyond semiconductors, CMP Q&A, solar panel parallels, and the PV sector's victory toast.


SEMICON West: Shoes vs. phones, CMP users, updating Art's Law

Mon, 7 Jul 2010

Techcet's Michael A. Fury continues his observations from this year's SEMICON West. Highlights from Day 2: A bioelectronic Onstar system; highlights from chemical & gas and CMP users' group sessions; a great place for steaks in SFO; and updating Art Z's Law of ponytails and Ferraris.


Photos from the Applied Materials tour at SEMICON West

Fri, 7 Jul 2010

While we were not allowed to snap photos of the proprietary processes inside Applied Materials, Solid State Technology editor in chief Pete Singer put together these photos with information from the Applied Materials tour. Highlights include a solar-panel roof on the parking area, and discussion of AMAT's new products.


Faster scatterometry metrology: GlobalFoundries

Thu, 7 Jul 2010

Alok Vaid of GlobalFoundries, explains the technology in his paper on time-to-solution for scatterometry metrology. Scatterometry takes a long time, but Vaid proposes a new approach with more automation.


450mm report: Standards, AMHS, platforms getting ready

Thu, 7 Jul 2010

Tom Jefferson, ISMI's 450mm program manager, gives SST an exclusive rundown of ISMI's closed-door update on 450mm progress at SEMICON West.


Inventory concerns prompt IC unit forecast tweak

Thu, 7 Jul 2010

IC Insights analyst Bill McClean explains why he's becoming a little more conservative about 2H10 semiconductor industry growth. (Hint: it's about inventories, and rubber bands.)


SEMICON West Lesson #4: Supply chain challenges

Mon, 7 Jul 2010

Wrap-up of what we heard and saw at SEMICON West 2010. Lesson 4: The semiconductor/equipment/component supply-chain went from ice-cold to red-hot in a matter of months, which brings its own unique challenges to the industry.


SEMI: June data hits milestone, but what's next?

Thu, 7 Jul 2010

SEMI's June numbers for semiconductor equipment demand hit a milestone, officially surpassing pre-meltown levels, but numbers are somewhat mixed -- and the future's as blurry as ever.


SEMICON West wrap with JC Kim

Fri, 7 Jul 2010

SEMICON West 2010 wrapped this week in San Francisco. This article includes JC Kim, SEMI Board of Directors Chair, discussing the show and the semiconductor industry future. We also have POVs from the show floor by the ElectroIQ.com bloggers.


Video interview: Engaging a younger generation in renewable energy

Tue, 7 Jul 2010

In this video, LaMar Hill, North East Sustainability Institute, State University of NY, talks about renewable energy and motivating a younger generation of engineers. Senior technical editor Debra Vogler speaks with Hill at ASMC, taking place in San Francisco with SEMICON West.


Video: Wafer bevel inspection and other defectivity points

Wed, 8 Aug 2010

Jennifer Braggin, Entegris, chaired a session at ASMC on defect inspection. In this video, she summarizes the key points: new processes and materials add new detection challenges, and analysis from the lab is now moving into the fab. Wafer-edge inspection is highlighted.


AMAT findings on virtual metrology

Mon, 8 Aug 2010

James Moyne, Applied Materials, highlights a new technology: virtual metrology. Virtual metrology, on which Moyne presented at ASMC/SEMICON, enables tighter semi fab control using line data analysis. The summarized data is synched with real metrology data. Virtual metrology is now adaptive.


Video interview with SEMATECH: EUV on center stage

Fri, 8 Aug 2010

In this video interview, Bryan Rice, SEMATECH, discusses the readiness of EUV. SEMATECH is partnering with Carl Zeiss for EUV process development. The next phase will be a blank inspection phase, beginning a few months after SEMICON West.


Farewell, Selma Uslaner

Tue, 9 Sep 2010

It is with great sadness that I report the passing of longtime Solid State Technology editor, Selma Uslaner, on September 20th. Selma’s contributions to the industry and the magazine are legendary. Selma worked on the magazine since its inception in 1958. Her various roles included editorial assistant, show coordinator, reporter, news editor, managing editor, and director of industry relations. 


IMEC discusses major projects at SEMICON West

Thu, 8 Aug 2011

Ludo Deferm, IMEC, came to SEMICON West with several major announcements, from the system level to the layers of semiconductors. IMEC's major interests include scaling with 3D technologies, selective epitaxy, RRAM, lithography, and more.


LED, WLP, SiGe metrology challenges of today

Thu, 8 Aug 2011

LEDs, SiGe semiconductors, and WLP bumps each present their own challenges to metrology systems, says Alon Kapel, Jordan Valley Semiconductor.


TI on analog IC platforms, fab expansions

Fri, 7 Jul 2011

Ricky Jackson, Texas Instruments (TI), discusses analog IC developments, and how analog and digital semiconductors are pursuing Moore's Law and More than Moore in different ways. He also touches on TI's new fab capacity.


SEMICON West 2011: New product roundup

Wed, 7 Jul 2011

SEMICON West may not be the big-iron displayfest it once was, but there are still plenty of new product introductions to go around. Here's just a brief rundown of some of the ones we tracked from this year's show.


How EVG accomplished the 1st 450mm printed wafer; HVM expected 2015-2017

Mon, 7 Jul 2011

SEMATECH announced a 450mm imprinted wafer, accomplished by EV Group (EVG). Markus Wimplinger, EVG, described the timeline for the 450mm effort and how the company decided to make a strategic move.


SEMICON West-Day-3: Two eye-catching technologies in CMP slurry, printed electronics

Sat, 7 Jul 2011

Wrapping up SEMICON West, Techcet's Michael A. Fury takes a closer look at a couple of companies and products that caught his attention: Vantage's realtime CMP slurry particle measurement, and Thin Film Electronics' rewriteable printed ferroelectric NVRAM.


SEMICON West, Day 3: Advancement in LED, exec perspectives, solar observations

Sat, 7 Jul 2011

Rounding up observations from Day 3 at SEMICON West, Intermolecular's Russell Kempt looks at LED technology, executive opinions on big-picture industry issues, and the state of play in the solar market.


SigmaTech TSV metrology wins Best of West

Fri, 7 Jul 2011

SigmaTech's UltraMap-TSV system won Best of West at SEMICON West, presented by industry association SEMI and Solid State Technology.


Gigaphoton's EUV debris mitigation tech acheives 93% Sn removal

Fri, 7 Jul 2011

Lithography light source maker Gigaphoton Inc. verified its original technology for mitigating debris with magnetic fields for laser-produced plasma (LPP) light sources, clearing a hurdle for mass-production use.


SEMI comments on 450mm standards collaboration

Fri, 7 Jul 2011

Jonathan Davis, SEMI, chats about standards development in 450mm and 3D IC, as well as the importance of collaboration, and how it is happening at SEMICON West.


SEMICON West: Roaming the floor, LEDs, CMP pads, kudos to Napoleon

Thu, 7 Jul 2011

Exotic pads for CMPs, flow meters with a nod to Napoleon, and driving down LED costs were among themes pursued by Techcet's Michael A. Fury on a walk through the SEMICON West show floor.


SEMICON West Day 2: CMP views, outlooks for breakfast

Thu, 7 Jul 2011

Techcet's Michael A. Fury continues his reporting from SEMICON West, reviewing talks at the NCCAVS CMP User Group forum, as well as a breakfast seminar with outlooks on the semiconductor and related industries.


A lithography-rich Day 2 at SEMICON West

Thu, 7 Jul 2011

Intermolecular's George Mirth reports on interesting keynote speeches and comments from the Sokudo Lithography Breakfast at SEMICON West, in talks from ASML, Nikon, Mapper, Xtreme, and imec.


450mm update: Participation rising, patterning defined, “low risk” determined

Thu, 7 Jul 2011

Updates from ISMI's 450mm industry briefing at SEMICON West reveal intensifying participation and development underway for most required capabilities, and evaluations showing "low risk" for factory integration.


CMP consumables are back faster than expected

Mon, 6 Jun 2011

The global CMP consumables market recovered from the recession, 2 years ahead of schedule. According to Techcet Group's "CMP Consumables 2011 Critical Materials Report," market share is shifting from W and ILD slurry to copper and STI, and fabs are establishing "magic triangles."


Semicon West, Day 0: Market forecasts, supply-chain dynamics

Tue, 7 Jul 2011

On the eve of SEMICON West's official opening, Mike Fury reports on a full day of presentations offered a review of trends and new outlooks for fab capacity, equipment and materials spending, foundries, and packaging technologies.


KLAC targets 28nm and below with Surfscan SP3 inspection systems

Mon, 7 Jul 2011

KLA-Tencor Corporation (KLAC) launched a new generation in its Surfscan family of wafer defect and surface quality inspection systems: the Surfscan SP3. The unpatterned wafer inspection platform uses deep-ultraviolet illumination and is extendible to 450mm wafers. 


Imec brings new device architecture results to SEMICON West

Mon, 7 Jul 2011

At SEMICON West, imec is demonstrating a viable implant-free quantum-well (IF-QW) pFETs with an embedded silicon-germanium (SiGe) source/drain and 3D integration of a commercial DRAM chip on top of a logic IC.


Extending optical lithography with complementary e-beam lithography

Mon, 7 Jul 2011

David Lam summarizes how the industry does not have to "throw out" optical lithography as it proceeds to more advanced nodes -- complementary e-beam lithography (CEBL) is part of the overall solution, "complementary lithography," that can overcome the resolution limitations of 193i technology.


EVG tool bonds 450mm SOI semiconductor wafers

Mon, 7 Jul 2011

EV Group (EVG) released a wafer bonding system for 450mm silicon-on-insulator (SOI) wafers: EVG850SOI/450-mm. EVG's Paul Lindner discusses the tool, and challenges of 450mm and SOI.


Verigy debuts scalable semiconductor testers, digital channel cards

Fri, 7 Jul 2011

Verigy, an Advantest Group company (NYSE: ATE), launched scalable, cost-efficient testers for advanced semiconductors, such as 3D device architectures and 28nm and below technology nodes: V93000 Smart Scale Generation.


Plasma tool from Nordson MARCH handles 5 wafer sizes

Thu, 7 Jul 2011

Nordson MARCH introduced the FlexTRAK-WF low-cost, cassette-based automated plasma treatment system that handles five wafer sizes with minimal hardware change-over.


Avantor, SACHEM selective etch chemisty doubles as wafer cleaner

Wed, 7 Jul 2011

Avantor Performance Materials will launch the first in its new J.T.Baker SLCT Series of selective etch surface treatment chemistries, SLCT 128 sigma etchant, at SEMICON West. The product results from a partnership with etch specialist SACHEM.


Semiconductor industry investing over $40 billion annually, says SEMI

Thu, 6 Jun 2011

The semiconductor industry will invest about $44 billion in production equipment globally in 2011, which industry organization SEMI calls a "record sum."


AVS-ALD, Day 2: Manufacturability takes center stage

Wed, 6 Jun 2011

At this week's AVS/ALD Conference, Intermolecular's Chi-I Lang reports on Day 2 highlights: faster and more flexible approaches to ALD processing, integration challenges with platinum ALD, a peek behind the curtain of equipment development, and the unique challenge of vendor support for high-volume manufacturing.


Alternative semiconductor fabrication methods enable inexpensive, conformable consumer devices

Wed, 6 Jun 2011

SEMICON West preview: Emerging technology and a developing infrastructure for printed electronics is enabling circuitry that is flexible, conformable, and inexpensive to mass-produce, paving the way to a variety of low-cost applications such as electronic packaging, ID tags, and wide-area lighting panels.


Fab spending up, but fewer fabs being built

Wed, 6 Jun 2011

The semiconductor industry's torrid pace of capital equipment expenditures will continue in 2011, but actual construction of new fabs is slowing to "historically low" levels, according to data from SEMI.


LED makers shifting focus from efficacy to manufacturing efficiency for mass-market leap

Wed, 6 Jun 2011

SEMICON West preview: With device efficacy approaching limits and end-costs still too high for mass-market adoption, LED manufacturers are looking to trim costs by improving key manufacturing steps: measuring process conditions, preparing and handling substrates, and wafer-level testing.


SEMICON West keynotes cover research, chip design, packaging

Tue, 6 Jun 2011

Tien Wu, ASE; Rama K. Shukla, Intel; and Luc Van den hove, imec, are the honored presenters for SEMICON West 2011.


Semiconductor industry executives: Can't miss events at SEMICON West

Mon, 6 Jun 2011

To maintain profitability and growth in the next 10 years, semiconductor executives must understand and successfully execute lab-to-fab transitions of new technologies. 2 SEMICON West sessions aim to tackle these issues.


New architectures, litho schemes take the stage at SEMICON West

Fri, 6 Jun 2011

Two TechXPOT sessions at SEMICON West will address the new architectures needed to continue scaling both logic and memory devices, as well as the major challenges facing lithography both for EUV and options for extending 193nm immersion.


Trigate transistors vs FDSOI

Thu, 7 Jul 2011

Dick James, ChipWorks, speaks about Intel's presentations on strain engineering and lithography masks for trigate transistors, and the industry split between FDSOI and trigates.


SEMI shares capex forecasts at SEMICON West 2011

Thu, 7 Jul 2011

SEMI's Dan Tracy expects 12.1% growth in equipment spending overall for the semiconductor manufacturing sector in 2011. SEMI projects 2011 semiconductor equipment sales to reach $44.33 billion, but not every sector will grow this year.


SUSS EUV lithography mask management system debuts with imec install

Wed, 7 Jul 2011

SUSS MicroTec unveiled MaskTrack Pro InSync, a holistic in-fab EUVL mask management product that synchronizes mask cleaning, handling, inspection, and storage.


Day 2: Intersolar wanderings, SEMICON West symposium

Wed, 7 Jul 2011

Techcet's Michael A. Fury reports from busy aisles at Intersolar, and at SEMICON West where a private symposium by CEA Leti reviewed work in FDSOI, 3D integration, TSVs, silicon photonics, and MEMS for medicine.


Day 1: Intersolar wanderings, SEMICON West symposium

Wed, 7 Jul 2011

Techcet's Michael A. Fury reports from busy aisles at Intersolar, and at SEMICON West where a private symposium by CEA Leti reviewed work in FDSOI, 3D integration, TSVs, silicon photonics, and MEMS for medicine.


Cymer talks EUV, TCZ, light source monitoring upgrade

Wed, 7 Jul 2011

Nigel Farrar, Cymer, provides a status report on EUV lithography source technology, extensions to ArF lithography, the laser crystallization process from the company's TCZ display equipment product division, and Cymer's newest DUV source product the OnPulse Plus data monitoring system.


Historic semiconductor industry, SEMI moments from Stanley Myers

Wed, 7 Jul 2011

Stanley T. Myers talks what moments stand out for him as "historic" advances in semiconductor fab and the evolution of SEMI. He also shares advice for young engineers entering the semiconductor industry.


EUV lithography infrastructure update from SEMATECH

Wed, 7 Jul 2011

Stefan Wurm, SEMATECH, discusses EUV lithography's infrastructure. Want milestones? The first EUV litho beta tools have been delivered, and now the motivation is increasing throughput and reducing defects.


Top semiconductor metrology challenges from SEMATECH POV

Wed, 7 Jul 2011

At SEMICON West 2011, Phil Bryson, SEMATECH, covers the top challenges in semiconductor metrology at advanced nodes.


ASML tweaks immersion tool to improve imaging, overlay

Wed, 7 Jul 2011

ASML has added three extensions to its Twinscan NXT 1950i tool, to improve imaging, overlay, and system throughput.


SEMICON West 2011, Day 1: SOI vs. FinFET, ReRAM vs. 3D NAND, and lots of video data

Wed, 7 Jul 2011

The TechXPOT session on Emerging Architectures for Logic and Memory provided a number of interesting perspectives on some of the big transitions in device technologies, which seem to be arriving at an ever-increasing pace, reports Olov Karlsson from Intermolecular.


Novellus uncrates conformal films for sub-2Xnm

Wed, 7 Jul 2011

The Conformal Film Deposition (CFD) suite of dielectric films consists of oxide, doped oxide and nitride films that are deposited below 450

Suss joins imec's EUV mask integrity work

Tue, 7 Jul 2011

Suss Microtec and imec are expanding a research collaboration in mask cleaning to develop an in-fab approach to EUV lithography mask integrity, aiming to develop a sophisticated approach to preserving mask integrity prior to exposure.


AMAT deposition and UV curing toolset enables 22nm interconnects

Tue, 7 Jul 2011

Applied Materials Inc. (AMAT) introduced a toolset for manufacturing low-power, fast interconnects in 22nm and lower logic chips: the Applied Producer Black Diamond 3 deposition system and Applied Producer Nanocure 3 UV curing system.


AMAT debuts full-vacuum gate stack tool for 22nm chip fab

Tue, 7 Jul 2011

Applied Materials (AMAT) launched the Applied Centura Integrated Gate Stack system for creating gate dielectric structures in 22nm logic chips. It processes the entire high-k multilayer stack in a single vacuum environment, preserving integrity of film interfaces.


SEMI names leaders at SEMICON West

Tue, 7 Jul 2011

SEMI appointed Doug Neugold, ATMI, as Chairman of its International Board of Directors, serving his first term on the association's board. Following are all the appointments.


Green wafer fab chemistries that work

Wed, 7 Jul 2011

ATMI's SVP/CTO, Larry Dubois shares the 3 guidelines ATMI keeps in mind when designing eco materials for semiconductor wafer fab, and gives an update on the materials supplier's LED fab products.


Wall Street view: Top takeaways from SEMICON West

Tue, 7 Jul 2011

A trio of analysts who participated in SEMICON West's Bulls/Bears panel have some top-takeaways list for the industry: why WFE spending is slow, why it's only a short pause, and which will comes first, EUV or 450mm.


3 450mm cost challenges

Mon, 7 Jul 2011

Bob MacKnight, president and CEO of Crossing Automation, shares the semiconductor industry's top three cost-related hurdles when it comes to the 450mm wafer size transition -- particularly how automation will mesh with new tools.


ASM covers FinFET precursor needs from epitaxy to HKMG ALD

Fri, 7 Jul 2011

ASM International's Bob Hollands discusses the challenges of making FinFET structures using both epitaxial and high-k/metal gate (HKMG) atomic layer deposition (ALD) processes.


Sokudo litho breakfast: Challenges for the 2Xnm node

Wed, 7 Jul 2011

CEA-Leti's Serge Tedesco and Didier Louis summarize key themes from the Sokudo lithography breakfast forum held last week at SEMICON West.


Litho readiness for next-gen logic, flash, and DRAM

Tue, 7 Jul 2011

Franklin Kalk, Toppan Photomasks, covers the major lithography demands of distinct semiconductor technologies: Logic, Flash, and DRAM. He also gives an update on fabless/foundry options, and Japan's earthquake recovery.


Semi, PV, LED, FPD: Each sector has special reqs

Tue, 7 Jul 2011

Each market in which Edwards is a supplier -- semiconductors, flat panel, photovoltaics, LEDs, has its own cycles and technology requirements. Matthew Taylor, CEO of Edwards, discusses the needs and market personality of each sector.


SEMICON West 2012: Submit an abstract today

Mon, 12 Dec 2011

SEMI is looking for presenters for technical sessions and other opportunities at SEMICON West 2012, July 10-12 in San Francisco, CA.


Solid State Technology, SEMI, plan awards for best products of SEMICON West

Thu, 5 May 2011

For the first time, Solid State Technology will co-present the Best of West product awards with SEMI at SEMICON West. Here are the details on how to enter. The entries period will close June 17th.


Materials, tools, and processing for printed electronics

Thu, 5 May 2011

SEMICON West preview: Recent progress on developing printable conductive inks, flexible substrates, and associated continuous processes for making electronics means there's now an advancing infrastructure ready for the practical manufacture of disruptive new products.


LED forecast and MOCVD utilization chat with Strategies Unlimited

Fri, 8 Aug 2011

Tom Hausken, Strategies Unlimited, shares insights on LED growth, the gap between MOCVD purchasing and utilization, and the global distribution of LED manufacturing.


Inside Leti: FDSOI, 3D packaging, Si photonics work

Fri, 8 Aug 2011

Laurent Malier, CEO of Leti, described the research group's work and the outlook on fully depleted silicon on insulator (FDSOI), 3D packaging technologies, and integrated photonics on silicon.


Mix of end users and challenges drives Qcept Technologies' partnering strategy

Thu, 8 Aug 2011

Robert Newcomb from Qcept explains the two types of customers for inspection technology and their different needs: those on the leading edge who want yield improvements, and mainstream fabs seeking a better yield/cost mix on older processes.


Ultratech's market/technology strategies support revenue growth

Thu, 8 Aug 2011

Scott Zafiropoulo explains Ultratech's business and positioning strategies in an interview at SEMICON West, including how the company weathers market cyclicality and prepares for a 450mm wafer-size transition.


Soitec's extreme SOI: Scalable below 14nm

Wed, 8 Aug 2011

Post-22nm and below, the industry is going to fully depleted structures, either FinFETs or fully-depleted planar SOI (FDSOI), explains Soitec's Steve Longoria.


Gigaphoton extends DUV another generation, makes progress on EUV conversion efficiency

Wed, 8 Aug 2011

Gigaphoton expects to deliver an EUV source to ASML at the beginning of 2012. In the meantime, the company is focusing on throughput, conversion efficiency, and debris mitigation with its EUV source. Phil Alibrandi, director of sales at the company, summarized the activities taking place to support these efforts.


Ultratech to expand the time/temperature space of LSA for 20nm-14nm

Tue, 8 Aug 2011

IC manufacturers are becoming more aggressive with strain engineering as they go from 28nm to more advanced nodes, explains Jeff Hebb, VP of laser product marketing at Ultratech. The company is working on a dual-beam laser-spike annealing to address requirements for 20nm and 14nm.


Projection litho tool lowers CoO for HB-LED manufacturing

Tue, 8 Aug 2011

Doug Anberg, VP of advanced stepper technology at Ultratech, discusses the physics behind improvements in the company's new Sapphire 100E HB-LED tool in a video interview at SEMICON West 2011.


Nonvisual semiconductor defect metrology today, at 22nm, and below

Tue, 8 Aug 2011

Syn: Robert Newcomb from Qcept Technologies discusses non-visual defects in today's wafer fab processes, at 22nm, and in the advanced nodes below 22nm. As nodes shrink, more defects will escape optical metrology, he predicts.


Leti lithography update at SEMICON West

Mon, 8 Aug 2011

Leti's Serge Tedesco, lithography program manager, provides an update on the research group's 193 optical lithography program for 22nm and below, and exploration of multi e-beam lithography techniques.


Progress amid the battle: ISMI's 450mm status report

Thu, 5 May 2008
by Debra Vogler, senior technical editor, Solid State Technology
May 22, 2008 - In the final ConFab 2008 session, amid the verbal volleying about whether 450mm manufacturing is needed and how would it be financed, ISMI's associate director Joe Draina reported on the progress being made in a number of areas, including the silicon wafer readiness project, wafer manufacturing infrastructure readiness, and a 450mm factory integration testbed.

Molecular Imprints chasing multiple markets

Thu, 7 Jul 2008
In an interview at SEMICON West, Mark Melliar-Smith, CEO of Molecular Imprints described two paths for his company: one toward insertion into the semiconductor industry in 2009, and another toward producing a billion disks a year with 20nm features for the hard disk drive industry in 2010.

IMEC, ASML: Another step closer to production-worthy EUV

Mon, 7 Jul 2008
IMEC and ASML give SST an inside scoop on their latest EUV milestone -- functional 32nm SRAM cells (FinFETs) -- and which technology is now under the gun to ensure a production tool is ready as advertised by the end of 2009.

Aquest's Parikh: "Incremental" solutions the way to get fab productivity, savings

Wed, 7 Jul 2008
Mihir Parikh, president/CEO of Aquest Systems, talked with SST about why many fabs are taking a closer look at the systems they have in place and making incremental changes to improve them, rather than diving into new facility upgrades.

Asyst debuts products to address megafab automation challenges

Mon, 7 Jul 2008
Asyst CEO John Swenson talks with SST about Asyst's new "Agile Automation" family of technologies, desgined to address the growing complexity required to automate the massive fabs of today and tomorrow.

Economics, design issues top device-scaling concerns

Wed, 7 Jul 2008
Concerns about the next steps in device scaling -- profitability at 32nm and beyond, challenges of double-patterning, worries about chipmakers' commitment to design-tool functionality -- were aired out in a SEMICON West TechXpot discussion.

AMD's 2020 Vision for 450mm: Leave inefficiency behind

Tue, 7 Jul 2008
There is a lot that can still be done to improve the efficiency of today's 300mm factories, and an early move to 450mm would only carry those inefficiencies forward another generation. That was the main message in an interview with Gerald Goff, principle member of technical staff for Advanced Micro Devices (AMD) in Austin, TX, during last week's SEMICON West.

Bright future for LSA at 32nm and beyond

Thu, 8 Aug 2008
USJ formation at 32nm was the focus of the West Coast Junction Technology Group's meeting at SEMICON West, but also discussed was what lies ahead at the 22nm node. Ultratech execs provide additional insight to SST about the company's WCJTG talk on laser spike annealing.

KLA-Tencor pitches double-patterning with Prolith 11

Wed, 8 Aug 2008
In a post-SEMICON West interview, Edward Charrier, VP/GM of KLA-Tencor's process control information division, described the latest improvements in Prolith, the company's venerable litho simulation tool.

Seeking process windows for 32nm USJs using MSA

Tue, 7 Jul 2008
Susan Felch, principal member of Spansion's frontend development staff, summarized recent work regarding ultrashallow junctions at the West Coast Junction Technology Group meeting held in conjunction with SEMICON West (July 17) in San Francisco.

What materials firms can learn from Yogi Berra

Wed, 7 Jul 2008
Where to turn for inspiration in a tough year 2008 for semiconductor suppliers? Try Yankee baseball great Yogi Berra and famously underappreciated comic Rodney Dangerfield, according to analyst John Housley of Techcet, in a Wednesday talk about materials forecasts at SEMICON West.

Entegris' 5nm filter improves purity without slow-flow

Tue, 7 Jul 2008
Entegris is introducing new filters this week at SEMICON West to help fight the battle against smaller and more difficult to control contaminants in the fab.

PV market outlook: A contrarian's view

Wed, 7 Jul 2008
There's a lot of optimism and interest crowding the photovoltaic space, and this was certainly the case witnessed at several Intersolar presentations during SEMICON West, offering different takes on the direction of the PV market. The first of these offered a decidedly contrarian view about the future (or lack of it) for many PV businesses.

New SRP metrology system eyes small/mid-tier sweetspot

Sat, 8 Aug 2009
Semilab SSM president Chris Moore tells SST how the company's new manual system, the SRP Express 170, hits the spot for small- and mid-tier semiconductor and solar cell manufacturers with density and resistivity depth profiling of electrically active dopants.

SEMATECH takes on funding challenge for EUV mask infrastructure

Tue, 6 Jun 2009
In a pre-SEMICON west technology briefing, SEMATECH's director of lithography, Bryan Rice, gave a sobering assessment of the readiness of EUV mask infrastructure -- currently, there are no commercial suppliers committed to building solutions for high-volume manufacturing mask blank inspection, mask defect inspection, and patterned inspection.

EUV: "Turned the corner to inevitability"

Tue, 7 Jul 2009
SEMATECH's Bryan Rice gives a positive assessment of EUV and offers hope for getting companies to open their checkbooks for mask inspection infrastructure funding. It's no longer a matter of "if" but "when," he says -- and see news below of an imminent 100W source.

Going green gives new life to reclaimed silicon

Mon, 7 Jul 2009
ATMI exec Tod Higinbotham describes his company's latest "green" product, unveiled at SEMICON West: the RegenSi 74, an improvement to its advanced test wafer recycle and reclaim products that it claims can cut film removal cycle times in half and greatly reduce the amount of chemicals required for wafer reclamation.

Best of West: Going green with DI water clusters

Thu, 7 Jul 2009
Improve a process, save money and eliminate waste, with no loss of performance or efficiency, and go green at the same time. They're the reasons Nano Green Technology was awarded SEMI's 2009 Best of West award Wednesday (July 15) at SEMICON West, for its technology that replaces the traditional SC-1 or SC-2 etch-based cleaning process with a megasonics-based solution that relies on water. SST also takes a snapshot of the other Best of West finalists: Alchimer, Gore, IMEC, and K-Patents.

Norcimbus shakes up SEMICON West with variable gas flow mixing system

Tue, 7 Jul 2009
At SEMICON West, Norcimbus is debuting a variable flow gas mixing system that lets fabs blend their own specialty gases in-house -- with a ROI achieved in as little as 60 days.

IMEC's Ludo Deferm: Behind the news

Fri, 7 Jul 2009
IMEC's Ludo Deferm provides a look behind some major announcements the consortium made at SEMICON West: laser anneal over spike anneal, EUV mask cleaning, RuTa metallization showing promise for 22nm PVD.

KLA-Tencor lines up trio of 3X-2X inspection systems

Tue, 7 Jul 2009
KLA-Tencor exec Brian Trafas explains what's under the hood of the company's three new tools for defect wafer inspection and review: the 2830, the Puma 9500, and eDR-5210.

SEMI's PV standard driven by industry demand

Mon, 7 Jul 2009
Matthias Meier, manufacturing engineering & automation at the Fraunhofer Institute, discusses his role as "coach" of the PV Equipment Standards task force in an interview at SEMICON West. SEMI's newly released PV2-0709 standard, which focuses on data acquisition and access, is expected to be widely adopted.

Prelim numbers: "Record" growth for Intersolar NA, SEMICON West slower

Tue, 7 Jul 2009
Preliminary numbers are in from last week's Intersolar North America, where the show more than doubled its exhibition participation and "exceed[ed] organizers expectations for the second straight year," according to a statement put out by group.

SOI group eyes 3D, green benefits

Mon, 7 Jul 2009
Horacio Mendez, executive director of the SOI Industry Consortium, gave SST previews a new study that compares the manufacturability, performance, and cost of 3D transistors using silicon-on-insulator (SOI) vs. bulk. He also discusses the group's new "Simply Green" initiative to help emphasize SOI's power benefits vs. bulk Si.

New SEMI chair Kim: Need to re-eval shows, add green push

Tue, 7 Jul 2009
SEMI's newly appointed chairman, J.C. Kim of Edwards Korea, talks about the need to revisit the value proposition for SEMICON trade shows, the changing mix of members, and the need to emphasize green initiatives.

Wally Rhines: Consolidation and node ramps nothing new, growth coming

Mon, 7 Jul 2009
Wally Rhines, chairman and CEO of Mentor Graphics, summarizes the key themes from his keynote at SEMICON West: no consolidation, the 65nm-45nm ramps are nothing new, and the industry recovery will beat that of the general economy.

Editor's Take: IMEC sees 22nm EUV SRAMs as call to action

Tue, 4 Apr 2009
IMEC provides more details and some broader perspective on its progress using EUV lithography, now on 22nm SRAMs on both the contact and metal-1 layers.

Zeiss buying microscopy firm ALIS

Wed, 7 Jul 2006
July 19, 2006 - Carl Zeiss SMT has acquired all the shares of ALIS Corp., a developer of helium ion microscopy technology, from a group of financial backers and strategic investors, extending its portfolio of nanoscale measurement and probing technologies.

SST On the Scene... at SEMICON West: Video Interviews

Fri, 7 Jul 2006
With escalating R&D costs, economic challenges associated with lithography past 32nm half-pitch, and increasing competition between countries and even regions within countries, industry executives have their hands full.

Panelists debate impact, challenges of "atomic" progression

Tue, 8 Aug 2006
During SEMICON West 2006, a group of the industry's top senior technologists came together to discuss the limits and possibilities for semiconductor material development. One of the main themes of the technical seminar and panel discussion, sponsored by DuPont Semiconductor Materials, involved the ramifications of a clear shift toward dealing with individual countable atoms, and what kind of endgame it leads to in terms of materials development.

SOLAR ENERGY, PART II: The politics of PV

Tue, 8 Aug 2006
Prodded by recent advances in photovoltaics, the US government, after decades of indifference, is aggressively promoting further development and use of the technology as a means of addressing our current energy crisis. Speaking at the SEMICON West conference, Rhone Resch, president of the Solar Energy Industries Association (SEIA), explained how new federal incentives and budgeted federal funding for R&D means that the time is right for high-tech companies to pursue opportunities in solar power.

Excerpts from SST on the Scene: Should government get involved with basic R&D?

Tue, 8 Aug 2006
Anytime government gets into the act of giving money to any endeavor, one can almost imagine the industry holding its collective nose with a clothespin. The money is welcome, but the intrusion that may go along with it is not. Guests of SST On the Scene at SEMICON West shared their thoughts about government getting more involved, and what challenges the industry is facing now when it accepts such help.

SEMICON WEST PREVIEW: Expanded innovation showcase spans gamut from desktop e-beam generation to electrically measuring low-k stacks

Mon, 6 Jun 2006
Visitors to SEMICON West once again will have the opportunity to conveniently meet with a range of entrepreneurs with new ideas at the Technology Innovation Showcase. This year SEMI has expanded it to three separate and more focused areas -- devoted to innovations in DFM and frontend processing, MEMS and nanotechnology, and final manufacturing technologies. Here's the rundown on a few intriguing innovations picked by a volunteer committee of industry executives to have the most potential.

SOLAR ENERGY: Part I:

Tue, 8 Aug 2006
Several talks at SEMICON West this year focused on one of the industry's most rapidly growing segments: solar technology. Equipment suppliers need to address a lack of suitable tools for production of photovoltaic (PV) technology, or else vendors will end up developing their own tools. Meanwhile, PV programs in Japan and Germany are inspiring efforts in the US to spur demand. And the search continues for alternative materials to silicon, with PV products closing in on 40% efficiencies.

Examining litho progress, prospects at SEMICON West

Tue, 7 Jul 2006
In a first-day presentation at SEMICON West, Klaus Rinnen of Gartner/Dataquest reported a bright outlook for 2006, both for the semiconductor industry and its equipment suppliers, followed by a potential "soft patch" in 2007, and an upturn to record levels in 2008. That feeling of comfort combined with tempered optimism characterized the entire atmosphere at SEMICON West -- everyone seemed to feel that things were good now and the future no more uncertain than usual, in our cyclical industries.

SEMICON West preview: Applying beer technology to slurry, and rethinking thin film metrology

Wed, 7 Jul 2006
Among this year's crop of companies in the spotlight at this year's SEMICON West Technology Innovation Showcase include a Swiss company controlling the beer flow at the World Cup stadium, thinking controlling slurry flow will be less demanding; a trio of metrology startups pushing radical new approaches to thin-film metrology; and a familiar face touting a new tungsten slurry for better yields at 45nm.

SEMI tackles industry consensus-building with new advisory group

Tue, 9 Sep 2006
At the behest of its board of directors, SEMI has created a new advisory board to foster better communication among device makers and equipment suppliers, and more promptly develop a clear understanding of what semiconductor manufacturing standards will be needed, and by when. First on the agenda: 300mm Prime, aiming to establish an "incremental" approach toward improving 300mm production and ease the eventual migration to the 450mm new wafer size.

Peering into an industry subculture: SEMI's standards activities

Mon, 7 Jul 2006
Attending a SEMI Standards reception at SEMICON West a few weeks ago was a reminder for this former reliability engineer of the challenging work undertaken day in and day out by those who represent equipment and materials suppliers on SEMI standards committees. So I asked those still active in SEMI Standards -- has developing and negotiating standards had gotten any easier? Or has the process changed significantly, against the backdrop of myriad partnerships, alliances, and consortia?

Micron's Appleton: Why partnerships fail

Tue, 7 Jul 2006
In a revealing keynote address at SEMICON West last week, Micron Technology chairman and CEO Steve Appleton offered a behind-the-scenes look at his company's experience in forming business partnerships, and offered some hard-won insight into why partnerships fail and what can be done to ensure their success.

SEMI tips details about SEMICON West backend pavilion

Mon, 5 May 2006
May 8, 2006 - SEMI has announced additional details about its backend technology-themed content pavilion at this year's SEMICON West, developed in conjunction with leading industry associations and companies including FSA, the International Electronic Manufacturing Initiative (iNEMI), the Microelectronics Packaging and Test Engineering Council (MEPTEC), and TechSearch International.

Sematech seeks to push 300mm, smooth 450mm transition

Mon, 1 Jan 2006
January 30, 2006 - A new program launched by the International SEMATECH Manufacturing Initiative aims to establish an "incremental" approach toward improving 300mm production and ease the eventual migration to the 450mm new wafer size.

Metrology firm tabs FEI exec as CEO

Mon, 1 Jan 2007
January 15, 2007 - Metrosol Inc., Austin-TX, a developer of optical reflectometry systems, has appointed Kevin Fahey as president and CEO, formerly VP and GM of FEI Co.'s fab market division.

SEMICON West: Intermolecular launches platform to improve R&D and ROI

Wed, 7 Jul 2007
July 18, 2007

Amkor, IMEC sign agreement for 3D WLP

Wed, 7 Jul 2007
July 18, 2007 - At SEMICON West, Amkor Technology Inc., a provider of advanced semiconductor assembly and test services, and IMEC, the independent nanoelectronics and nanotechnology research center based in Belgium, announced that they have entered into a 2-year collaboration agreement. They will develop cost-effective, 3D integration technology based on wafer-level processing techniques.

Tiger Optics unveils trace moisture analyzer for ultra-high purity gases

Wed, 7 Jul 2007
July 18, 2007 - Tiger Optics LLC has unveiled at SEMICON West the HALO+, a mini-cavity ring-down spectroscopy (CRDS) analyzer capable of measuring at parts-per-trillion (PPT) levels. Sibling to Tiger's HALO, the new HALO+ is a compact CRDS tool that can analyze moisture in gases down to ultra-low levels.

Novellus launches new PECVD system, new PVD source at SEMICON West

Wed, 7 Jul 2007
July 18, 2007 - Novellus Systems Inc. has launched the VECTOR Extreme plasma enhanced chemical vapor deposition (PECVD) system and the INOVA NExT with HCM IONX ionized physical vapor deposition (PVD) source at SEMICON West.

Carl Zeiss announces new 248nm litho system for 80nm resolution

Wed, 7 Jul 2007
July 18, 2007 - Carl Zeiss SMT AG announced at SEMICON West today its new optical lithography system for KrF, the Starlith 1000, with a numerical aperture (NA) of 0.93, which will reportedly be the highest NA for 248nm exposure wavelength available in the market.

SST ON THE SCENE: R&D effectiveness needs collaboration; unresolved 45nm/32nm metrology issues

Tue, 7 Jul 2007
In video interviews at SEMICON West, Dave Gross of AMD pleads AMD's case for collaboration to maximize the effectiveness of R&D dollars. Alain Diebold (U. at Albany) summarizes unresolved metrology issues at 45nm and discusses the future at 32nm. And John Allgair (ISMI assignee from AMD) outlines the group's current plans as it gears up for a larger presence in Albany and expand its metrology program -- look for intentional defect array wafers to be ready for mass production in 2-3 months.

SST ON THE SCENE @ SEMICON WEST: Cooler industry outlook belies heated 450mm controversy

Tue, 7 Jul 2007
Aida Jebens, Senior Economist at VLSI Research, reviews her firm's industry weather forecast for SST On the Scene, which shows a "cooling" and cloudy outlook for display equipment and "flat" for chip tools, though next year's forecast looks to be improved. She also shares thoughts on the renewed debate over a 450mm wafer-size transition, and what has to happen on all sides to pull through -- and what's already being done.

Is a new business model in the works for small foundries?

Tue, 7 Jul 2007
Silterra recently announced an extension of its JDP with IMEC to create a foundry-compatible 90nm CMOS process technology, with the intent to further scale to 65nm. WaferNEWS caught up with both Silterra president/COO Tzu Yin Chiu and IMEC's Ludo Deferm to talk about the competitive landscape, and the larger issue of what smaller foundries need to do to withstand the industry's drive to consolidate.

To FUSI or not FUSI? That's the question

Thu, 7 Jul 2007
At SEMICON West, SEMATECH is discussing many of the themes from papers it presented at the VLSI Symposium, including its gate first/high-k metal-inserted poly stack (MIPS) electrode approach instead of FUSI or replacement gates. "We chose a path that was more manufacturable and fits in more easily with existing technologies in terms of scalability, contamination prevention, and integration," said Raj Jammy, director of frontend processes, in a pre-show interview with WaferNEWS.

SEMICON WEST REPORT: The transistor is cool again

Thu, 7 Jul 2007
The main topics for discussion at Applied Materials' press event on Tuesday were about high-k/metal gate processes (HK+MG) and double patterning lithography, though much of the talks concentrated on the gate technology -- and how they created the delicately etched iceblocks serving as table centerpieces.

SEMICON WEST REPORT: Interconnect symposium heralds exciting year

Wed, 7 Jul 2007
Participants in Tuesday's Interconnect Symposium hosted by Kulicke & Soffa and Advanced Packaging magazine, examined a list of trends, challenges, and opportunities in advanced packaging (e.g., wire-bonding and flip-chips) that are being thrust into the semiconductor manufacturing spotlight. "If you're an advanced packaging engineer, you're finally getting the recognition you deserve," noted TechSearch International president E. Jan Vardemann.

SEMICON WEST REPORT: Keynotes tap into promises, challenges of solar

Fri, 7 Jul 2007
A pair of Wednesday keynotes at SEMICON West described opportunities for semiconductor suppliers in the solar energy market, but cautioned that there are fundamentally different manufacturing requirements in the two industries.

SEMICON WEST REPORT: Keynote Gargini links past to future of chip innovation

Thu, 7 Jul 2007
In one of his famous tour-de-force portraits of the progression of semiconductor technology, Paolo Gargini, Intel Fellow and director of technology strategy, linked past developments to the future in a SEMICON West keynote talk. An overflow room with piped-in video was needed to accommodate attendees.

Consumerization stressing out semiconductor industry

Wed, 7 Jul 2007
While the consumerization of the electronics industry is creating huge demand for semiconductor content, it is also causing enormous stress for chipmakers and equipment suppliers alike, according to representatives from each group speaking at a SEMI Executive Panel on Monday (July 16) at SEMICON West.

SEMICON WEST REPORT: Do lean principles apply to semi manufacturing?

Wed, 7 Jul 2007
Delivering the opening keynote address at SEMICON West on Tuesday (July 17), Douglas Grose, AMD's SVP of technology development, assailed a widely held "faulty belief" in the uniqueness of the semiconductor manufacturing, calling on the industry to adopt highly successful principles and practices of lean manufacturing deployed in other industries.

SEMICON WEST REPORT: DFM panel trains critical eye on yield progress

Tue, 7 Jul 2007
What happens when you put a design software vendor, a chip manufacturer, and a photomask maker all at one table and ask them to talk about yield? Not surprisingly, the software vendor finds himself on the hot seat.

SEMICON WEST REPORT: Rift grows over 450mm wafer plans

Tue, 7 Jul 2007
Sharp differences on the need to prepare for a shift to 450mm wafers broke into the open on SEMICON West's opening day (Monday, July 16). SEMI and SEMATECH have different timelines for when 450mm might be needed, and how much work should be put into -- and what benefits will come out of -- current 300mm productivity improvement efforts. SEMATECH is even raising the ante by pledging to form a new 450mm program next year to lay the groundwork for evaluating 450mm requirements and standards.

SEMI, SIA join hands to thwart counterfeiting of electronics components

Tue, 7 Jul 2007
Companies faced with the widespread problem of counterfeit electronics components often find themselves in a double bind -- not only do they lose money when counterfeit components enter the supply chain, but their brand equity can suffer if the fraud becomes public knowledge. In an exclusive pre-SEMICON West interview, industry groups SIA and SEMI spoke with WaferNEWS about their new joint efforts to develop authentication standards to help fight the growing counterfeiting conundrum.

SUSS launches, ships 300mm SOI bonding system

Wed, 7 Jul 2007
July 18, 2007 - Today at SEMICON West, SUSS MicroTec launched the ELAN CBC300SOI, its new 300mm SOI wafer bonding system, and said that it has already shipped the SOI bonding system to a leading manufacturer of SOI wafers.

Brewer Science, EV Group debut bonding combo for ultrathin wafers

Wed, 7 Jul 2007
July 17, 2007 - A new system for ultrathin wafer processing developed by Brewer Science Inc. and EV Group aims to provide a temporary wafer bonding technology for reliably processing sub-100-micron thinned wafers.

Test startup decloaks with "virtual probe" for SiPs

Mon, 7 Jul 2007
July 16, 2007 - Scanimetrics Inc. has debuted at SEMICON West with its first product targeting the test sector: a noncontact "virtual probe" technology for system-in-package testing during assembly that it claims can cut manufacturing costs in half.

SEMICON WEST: HK+MG metrology technology takes center stage

Tue, 7 Jul 2007
With High-k (HK) dielectrics and metal-gates (MG) now being ramped into CMOS production at Intel and IBM, much of the excitement at this year's SEMICON West centered around manufacturing technologies needed for these new materials. Much of the discussions in equipment supplier-sponsored seminars and panels centered on the challenges of working with these new materials -- particularly the tricky setup of affordable in-line metrology for these new ultra-thin materials.

AMS: Life under the PE umbrella, and the secret progress of finFETs

Tue, 7 Jul 2007
Days before Semicon West, WaferNEWS caught up with Christopher Moore, president/CEO of Advanced Metrology Systems (AMS), nee Philips AMS, to chat about how life is different nine months after taking the private equity route.

SEMI slashes three-year growth forecast

Mon, 7 Jul 2007
SEMI's new mid-year 2007 capital equipment revenue forecast, unveiled during its annual opening day press conference at SEMICON West 2007 in San Francisco, predicts sharply reduced growth projections for the next three years, compared to figures released in the association's year-end 2006 forecast.

SAFC repositions for semi market push

Thu, 7 Jul 2007
July 5, 2007 - Fresh off its recent acquisition of UK-based Epichem Ltd., a provider of high-purity chemicals, Sigma-Aldrich is turning its focus to the silicon and compound semiconductor markets, touting its beefed-up division's product roadmap at SEMICON West. Company execs talked with WaferNEWS about the company's direction, its focus on collaboration, and how to justify value in an increasingly consumer-oriented industry where lower prices mean tighter investment evaluations.

FEI's Phenom: SEM for the people

Tue, 8 Aug 2007
Traditional scanning electron microscopes (SEM) provide essential information for both R&D and quality control in semiconductor manufacturing, but are generally slow and sensitive and ultimately become R&D bottlenecks. Perusing the aisles at SEMICON West, I ran across FEI's new Phenom, which is the size of a coffeemaker and costs a third of traditional SEMs. Note to academia and fab engineers: you'll want one, and here's why.

SEMICON WEST REPORT: Musings from the show floor

Tue, 8 Aug 2007
Much of the technology discussion at this year's SEMICON West focused on the next shrink, either 45nm or 32nm half-pitch, and high-k and metal gates are the innovation du jour, though there are several flavors being tested. Other highlights: the rare sight of actual processing equipment on display; an interesting new tabletop SEM; and wildly popular keynotes about solar opportunities.

SST ON THE SCENE @ SEMICON WEST: The consortia balancing act; Dishing on the rest of the transistor

Tue, 8 Aug 2007
IMEC's VP of Business Development, Ludo Deferm, takes SST On the Scene down the path from 45nm to 22nm, and points out the tough questions that loom, such as single-node lithography options and introduction of new architectures such as finFETs. Meanwhile, Larry Larson, frontend associate director at SEMATECH, explains whether Schottky contacts could be a solution to the need for lower resistivity contacts.

BlueShift shifts gears

Tue, 8 Aug 2007
BlueShift Technologies, the startup led by former Brooks Automation execs that decloaked from stealth-mode a year ago with support from Intel's VC arm, is now confidently touting its business model combining modular hardware and software, with a handful of shipments now to show for its efforts.

Report: TSMC wants 450mm production by 2012

Sat, 9 Sep 2007
September 14, 2007 - Adding more fuel to an already hot-burning fire, Taiwan foundry giant TSMC reportedly is planning to start production using 450mm wafers in 2012, standing alongside industry leaders Intel and Samsung in pushing adoption of the new wafer size.

September 2007 Exclusive Feature:
SPECIAL REPORT:
The rise of solar power

Tue, 9 Sep 2007
By Phil LoPiccolo, Editor-in-Chief

The promise of photovoltaics (PV)—to solve the world's energy problems as well as fuel semiconductor industry growth—drew overflow crowds to presentations on anything solar at SEMICON West 2007. This two-part series reports on a pair of keynotes headlining the conference that described opportunities and challenges for semiconductor manufacturers and suppliers in the solar market.

SEMI adding solar event to SEMI West agenda

Fri, 11 Nov 2007
November 8, 2007 - In an effort to deepen industry ties to perhaps the best high-growth application area for many equipment suppliers, SEMI is partnering with the organizers of global solar trade fair Intersolar to cohost "Intersolar North America," the largest event serving the solar energy technology supply chain in the US, at next year's SEMICON West (July 15-17, San Francisco's Moscone Center).

Nikon boosts throughput in upgraded i-line stepper

Thu, 11 Nov 2007
November 29, 2007 - Nikon is uncrating a new i-line stepper that it says exceeds 200 wafers/hr throughput, targeting use in sub-critical layers in volume production of memory and microprocessor devices.

SST Attendees Choice Award product winners announced

Fri, 7 Jul 2004
July 19, 2004 - Semicon West attendees have chosen the winners of Solid State Technology's 2nd Annual Attendees' Choice Award competition. The winners are products from Applied Materials Inc., Lighthouse Worldwide Solutions, KLA-Tencor, Multiprobe, and Feinfocus.

Tetsuro Higasi named SEMI chairman

Tue, 7 Jul 2004
July 13, 2004 - SEMI has appointed Tetsuro (Terry) Higashi, chairman of Tokyo Electron Limited (TEL), as chairman of the global industry association's board of diirectors at a meeting held during SEMICON West in San Francisco, CA.

SEMICON West San Francisco opens today

Mon, 7 Jul 2004
July 12, 2004 -- SEMICON West opens today in San Francisco with Steven R. Appleton, chairman, CEO, and president of Micron Technology, presenting a keynote presentation as planned, reports SEMI.

Semicon West to be reunited in 2005

Fri, 5 May 2004
May 28, 2004 -- Due to expanded facilities at San Francisco's Moscone Center, the front-end and final manufacturing segments of Semicon West will be reunited in San Francisco next year, according to Semi, the organization that runs the event.

SEMICON West: Frontend and backend together again?

Mon, 5 May 2004
May 24, 2004 - Semiconductor Equipment and Materials International (SEMI) officials are looking at numerous ways to add value to the SEMICON shows, including the possibility of re-unifying SEMICON West under one roof, according to an exclusive WaferNews report.

SST Attendees' Choice Award product winners announced

Mon, 7 Jul 2005
Semicon West attendees have chosen the winners of Solid State Technology's 3rd Annual Attendees' Choice Award competition. The winners are products from SEZ Group, Applied Materials Inc., Pall Corp., Micro Control Co., Newport Corp., and Ultrasonic Systems Inc.

SEMI names Segal chair, Applied's Splinter to board of directors

Fri, 7 Jul 2005
July 15, 2005 - SEMI has appointed Ed Segal, senior advisor to Metron Technology, as chairman of the industry association's International Board of Directors. The association's membership also elected Michael Splinter, president and CEO of Applied Materials, to the board of directors.

SEMICON West panelists see globalization as growth opportunity

Thu, 7 Jul 2005
July 14, 2005 - A panel of leading executives from the semiconductor equipment and materials industry engaged in a spirited debate over the future direction of the industry on the opening day of SEMICON West Tuesday night. Among the questions addressed is whether the center of the industry will inevitably shift away from North America toward Asia, reflecting the growing size and importance of the Asia-Pacific market.

2005 SST Attendees' Choice Award winners announced

Fri, 8 Aug 2005
Six new industry products received Solid State Technology's Attendees' Choice Awards at Semicon West this year. Please click here for more information on the winning products and companies.

Feinfocus joins forces with Innov-X for analysis products

Wed, 8 Aug 2005
August 10, 2005 - Feinfocus, a Comet business unit and manufacturer of x-ray inspection systems, has entered into a technology alliance with Innov-X Systems, a Woburn, MA manufacturer of high-performance, portable x-ray fluorescence analyzers.

Open architecture vs. standards: Who's on first?

Thu, 9 Sep 2002
One of the first things the new chairman of SEMI, Art Zafiropoulo - also chairman, president, and CEO of Ultratech Stepper - says he is going to do is reduce the time it takes to get standards to the marketplace. He also wants to prioritize standards work - with safety being the highest priority - and put more focus on what's really important, not pet projects.

Semicon Dilemma: Frisco or Vegas?

Mon, 8 Aug 2000
SAN MATEO, Calif.--Aug. 21, 2000--In just 11 months Semicon West will return to the Bay Area, and once again attendees will be fighting to land pricey hotel rooms, and potential exhibitors will be turned away from Moscone Center. Despite these travails, the conference will remain where it is?at least for a few more years. But in the shadows lurks Las Vegas, with its cavernous convention halls and surplus of reasonably priced hotel rooms.

Reporter's SEMICON West Notebook: Vegas by The Bay

Thu, 7 Jul 2000
SEMICON West '00--July 20, 2000--For a first-time visitor to SEMICON, held last week in San Francisco, Calif., the convention was an assault to the senses. It was not unlike the Las Vegas strip, except without the slot machines; although most companies were gambling that their industry's optimism would open their customers' wallets.

Amtech Offers Automating Diffusion Furnaces

Thu, 7 Jul 2000
TEMPE, Ariz.--July 20, 2000--Amtech Systems Inc. has released two new products for automating semiconductor diffusion furnaces after demonstrating them at the recent Semicon West 2000 tradeshow in San Francisco.

Electroglas Announces Prober Upgrade Program

Tue, 7 Jul 2000
SEMICON West '00--July 17, 2000--Electroglas Inc. introduced EG Advantage, offering customers of 2000, 3000, and 4000 Series Electroglas probers up to a $50 thousand discount.

KLA-Tencor Introduces New 300mm Defect Inspection System

Tue, 7 Jul 2000
SEMICON West '00--July 17, 2000--Last week KLA-Tencor Corp. unveiled three new defect inspection solutions that the company says upgrades the throughput and detection sensitivity for 0.13 and 0.10 ?m production.

SVG Introduces New Rapid Thermal Furnace

Mon, 7 Jul 2000
SEMICON West '00--July 14, 2000--Silicon Valley Group (SVG) introduced Xcelerate, a combined single wafer furnace based rapid thermal processing solution for next generation chip manufacturing.

Credence Debuts New ATE Products

Mon, 7 Jul 2000
SEMICON West '00--July 12, 2000--Credence Systems Corporation will demonstrate its new Kalos XW and Quartet One XL memory product lines, as well as its VS 2000 testing system in San Francisco, Calif.

3M Specialty Materials Introduces Safer Cleaning Gas and Dielectric Fluid

Mon, 7 Jul 2000
SEMICON West '00--July 14, 2000--The Specialty Materials division of 3M showcased its new enviro-friendly gas and fluid products in San Francisco, Calif. this week.

Aetrium Showcases New IC Test Handlers

Mon, 7 Jul 2000
SEMICON West '00--July 14, 2000--In San Jose, Cal., Aetrium Incorporated demonstrated its new dynamic temperature IC test handler and its new series of small component IC test handlers.

GaSonics Signs Letter of Intent To Acquire GPT

Mon, 7 Jul 2000
SAN JOSE, Calf.--July 14, 2000--GaSonics International Corporation has signed a non-binding agreement to acquire Gamma Precision Technology (GPT) for approximately $43 million in cash and stock.

Ion Systems Equips Ceiling Emitter with Remote Monitoring

Mon, 7 Jul 2000
SEMICON West '00--July 14, 2000--In San Jose, Calif., Ion Systems introduced a ceiling emitter featuring optional e-Diagnostics capability for remote monitoring.

Silicon Light Machines Licenses its GLV Technology to Sony

Mon, 7 Jul 2000
SUNNYVALE, Calif.--July 14, 2000--Sony Corporation and Silicon Light Machines (SLM) have announced an exclusive licensing agreement for SLM's Grating Light Valve (GLV) technology.

Teradyne Debuts VLSI Test System

Wed, 7 Jul 2000
SEMICON West '00--July 12, 2000--In San Jose, Cal., today, Teradyne Inc. introduced a VLSI test system that the company says will allow a full range of test capability without requiring hardware changes or system upgrades.

Schlumberger Introduces IOT Integrated Services to Speed IC Production

Wed, 7 Jul 2000
SEMICON West '00--July 12, 2000--SABER (Schlumberger Advanced Business Engineering Resources), a unit of the Test & Transactions business segment of Schlumberger, has launched a new outsourcing service to aid customers with the design and lauch of new test cells.

Boxer Cross Unveils Interconnect Measurement System

Wed, 7 Jul 2000
SEMICON West '00--July 12, 2000--Boxer Cross unveiled a new metrology solution today in San Francisco, Calif. at the company's private exhibit at Zeum, the new art and technology center.

Millipore Introduces New Gas Pressure and Filter Products

Wed, 7 Jul 2000
SEMICON West '00--July 12, 2000--Millipore's Microelectronics Gas Process Division unveiled its new pressure scale and filter lines that, according to the company, can help eliminate contaminants before they get onto the wafer.

Yield Dynamics Software Implements 0.12-Micron Design Rules Using Mix-and-Match Lithography

Tue, 7 Jul 2000
SEMICON WEST '00--July 11, 2000--Yield Dynamics has announced a new software package that promises users the ability to meet the overlay threshold required to achieve 0.12-?m rules using mix-and-match lithographic methods.

Ultratech Named Exclusive Lithography Supplier by IEP/Casio

Tue, 7 Jul 2000
SEMICON West '00--July 11, 2000--Ultratech Stepper Inc. has been awarded exclusive supplier status by IEP/Casio (Integrated Electronics & Packaging Technologies Inc.).

SVG Unveils New Lithography Systems, Receives 193-nm Order from Cypress Semiconductor

Tue, 7 Jul 2000
SEMICON West '00--July 11, 2000--Fresh on the heels of two new product additions to its lithography portfolio, Silicon Valley Group (SVG) Lithography Systems has received an order for its Micrascan 193 step-and-scan lithography system from Cypress Semiconductor.

Focus Helps Return Genus to Profitability

Tue, 7 Jul 2000
SEMICON West '00--July 11, 2000--A series of strategic moves, along with the recovery in the chip market, has put Genus Inc. back into growth mode after barely surviving the recent downturn that slammed the semiconductor equipment industry.

Optimism Pervades Semicon West

Tue, 7 Jul 2000
SEMICON West '00--July 11, 2000--Getting half a dozen CEOs to agree on anything isn't easy, but there was no dissent on the outlook for the semiconductor equipment industry during a panel session Monday: the market is going great and there's no end in sight.

AvantCom and IBM Team to Monitor Floor Equipment

Mon, 7 Jul 2000
SEMICON West '00--July 10, 2000--AvantCom Network Inc. today announced the collaboration with IBM Corp. to create an online network for tracking manufacturing floor equipment performance.

Schlumberger Debuts Sub-Micron Metrology Tool

Mon, 7 Jul 2000
SEMICON West '00.--July 10, 2000--In San Francisco, Calif. Schlumberger Semiconductor Solutions today introduced the next evolution of its sub-micron metrology tool, the IVS 135.

ASML Announces TWINSCAN 300mm Lithography Platform

Mon, 7 Jul 2000
SEMICON West '00--July 10, 2000--ASML launches its first product from its new TWINSCAN 300mm photolithography platform, the AT:700S scanner.

Adept FFE 200/300mm Front-End Systems Combine Wafer Sorting & SMIF Loading

Mon, 7 Jul 2000
SEMICON West '00--July 10, 2000--Announced today in San Francisco, Calif., Adept's new Flexible Front-End Systems for 200mm and 300mm are described as combining wafer sorting and SMIF loading into one system.

August Introduces High-Speed Wafer Defect Detection Tools

Mon, 7 Jul 2000
SEMICON West '00--July 10, 2000--At SEMICON West, August Technology today introduced two high-speed wafer inspection systems for defects down to 0.5 ?m.

Semitool Unveils Enhanced Wafer Cleaning System

Mon, 7 Jul 2000
SEMICON West '00--July 10, 2000--Making its debut today in San Francisco, Calif., the Spectrum E automated modular batch wafer cleaning system from Semitool Inc. is the latest version of the company's Spectrum advanced surface preparation system.

Applied Materials Floods Semicon West with Twenty-One Products for 300mm, 0.13-micron Production.

Mon, 7 Jul 2000
SEMICON West '00--July 10, 2000--In San Francisco, Calif. today, Applied Materials used Semicon West to announce more than 21 new 300mm products. From CVD systems to fab automation to CMP systems, the company's rollout new products covered 80 chip manufacturing applications. According to the company, the update of its entire product line will give customers a comprehensive tool-set for implementing 300mm production.

Canon to Introduce Next-Gen Lithography Tools at SEMICON West

Fri, 7 Jul 2000
SAN JOSE, Calif.--July 7, 2000--Canon is introducing its complete set of next-generation lithography tools at the SEMICON/West trade show.

LAM Research Launches Latest Etch Tool

Fri, 7 Jul 2000
FREMONT, Calif.--July 7, 2000--LAM Research Corp. released a new poly etch tool that the company says can perform all critical etch applications in the same chamber.

Zygo Introduces IM-12 Probe Mark Analysis and Inspection System

Fri, 7 Jul 2000
MIDDLEFIELD, CT--July 6, 2000--Slated to debut at the upcoming Semicon West show in San Francisco, Calif., the new IM-12 Probe Mark Analysis System from Zygo is designed to analyze the size and position of probe marks and offers an optional feature to inspect probe needles.

Semicon West to stay in Valley, at least for now

Sun, 8 Aug 1999
In its ongoing effort to find more room for the Semicon West trade show, the SEMI board of directors has agreed to keep the annual gathering in Silicon Valley for the time being, opting instead to study a further segmentation of the event.

SEMICON West Courses Announced

Tue, 2 Feb 2008
(February 19, 2008) — Going to SEMICON West? PTI Seminars and SEMI have announced semiconductor courses at the San Francisco show in July. Some courses of interest include: Fundamentals of MEMS Design and Fabrication, Introduction to Chip and Wire Assembly in Microelectronics Packaging, and Low-cost Flip Chip, WLCSP, and Lead-free Technologies.

SEMICON West Preview

Fri, 7 Jul 2007
(July 13, 2007) SAN FRANCISO — SEMICON West, July 16–20 in San Francisco, will feature more than 1,250 exhibitors in the Moscone Center from the 17th, highlighting new products, processes, and materials. Following are products to look for at the show from Juki, FINETECH, CHAD Industries and Asymtek, Kester, and Wentworth Labs.

This Week in Packaging: SEMICON West Preview

Mon, 7 Jul 2007
By Jeffrey C. Demmin, contributing editor

Are you ready for SEMICON West? The biggest tradeshow in the industry is just around the corner, and here are some highlights of what might be of interest to the packaging professional.

TIS at SEMICON: GE Sensing

Fri, 7 Jul 2007
(July 13, 2007) BILLERICA, MA — GE Sensing's HygroTrace moisture meter will be highlighted in the Technology Innovation Showcase (TIS) during SEMICON West, July 16–20 in San Francisco. The meter uses aluminum oxide sensors with a proprietary process technology, which allows the conventional sensors to make faster, more accurate measurements of moisture percentages in high-purity gases.

TechXPOT at SEMICON West: MEMS

Mon, 7 Jul 2007
(July 16, 2007) SAN FRANCISCO — Discera, Inc., chief technology officer (CTO) Wan-Thai Hsu will present "The New Heart Beat for Electronics — MEMS Oscillators," at the Emerging Technologies and Markets TechXPOT, July 18, during SEMICON West, July 16–20 in San Francisco.

Around the Exhibits at SEMICON West

Mon, 7 Jul 2007
(July 16, 2007) SAN FRANCISCO — The exhibition at SEMICON West, July 17–19 in San Francisco, hosts product introductions and demonstrations, technical talks, networking events, and other happenings. Following are the tradeshow offerings from IMEC, Antares, Cymer, NY Loves Nanotech, Kyzen, and X-tek.

Consumers Impact Industry Cycles: SEMICON Panel

Tue, 7 Jul 2007
(July 17, 2007) SAN FRANCISCO — SEMICON West hosted a panel discussion between executives from equipment and materials suppliers, a design software firm, and an industry association. Panelists discussed the consumer factor on electronics supply chains, design cycles, and capital equipment and consumables. Stanley T. Myers started off the debate by referencing Apple's newly released iPhone, and the "killer apps" that consumers seek in the market.

Vistec Combines Litho Groups

Wed, 7 Jul 2007
(July 18, 2007) SAN FRANCISCO — Visctec Semiconductor Systems GmbH (Weilburg, Germany) will combine its electron beam and lithography business groups to create Vistec Electron Beam Lithography Group, with European and U.S. locations. Jai Hakhu, Ph.D., will lead the business, and realigned global sales, marketing, and service structures will be managed by Maarten Kramer. The newly formed business will present its lithography portfolio at SEMICON West exhibits, July 17–19.

Probe Devices Launch at SEMICON

Thu, 7 Jul 2007
(July 19, 2007) SAN FRANCISCO — SEMICON West, July 16–20 in San Francisco, is featuring next-generation semiconductor and package test technologies on the exhibit floor, in presentations, and during the show's TechXPOTS. Following are the probe-testing product announcements from Scanimetrics, Wentworth Labs, and SUSS.

Two Routes to TSV Emerging

Fri, 7 Jul 2007
By Bob Haavind, editorial director, Solid State Technology

3D chip packaging with through-silicon vias (TSVs) will transform the industry over the next 3–5 years, say presentations and discussions at SEMICON West. Using TSVs could enable compact packaging with increased performance. Two approaches to TSV are leading the evolution.

TechXPOT Focus: Packaging Material Trends

Fri, 7 Jul 2007
By Françoise von Trapp, managing editor, Advanced Packaging

Material science has a firm foothold in the future of advanced packaging. At SEMICON West's Wednesday, July 18, Packaging Materials Trends TechXPOT, sponsored by IMAPS, industry experts shared insights and developments in packaging materials, their applications, and how these innovations will help device packaging address functionality, form factor, and reliability challenges.

SEMICON West 2008: Crossing Boundaries

Fri, 5 May 2008
By Francoise von Trapp, managing editor Driven by end-system-level design, the next era of electronics will call for the integration of processes across the supply chain, from the chip to the board. This concept is the motivator for the programs at SEMICON West 2008, held July 14-17 at the Moscone Center, San Francisco, which will focus more on back-end processes than ever before.

SEMICON WEST (BACK END) DAY 3 NEWS

Thu, 7 Jul 2003
(July 18, 2003) K&S Announces a Volume Purchase Agreement with National Semiconductor; Semiconductor Companies Take Center Stage at AP Award Program; Tessera Presents 3-D Packaging Symposium

SEMICON WEST NEW PRODUCTS (PART 3 OF 3)

Thu, 7 Jul 2003
The following is a selection of new products that you will see on the exhibitor floor at SEMICON West in San Jose, Wednesday, July 16, to Friday, July 18. See the SEMICON WEST EXHIBITOR LIST for booth numbers.

SEMICON West Brings Optimism

Mon, 8 Aug 2003
During SEMICON West in San Jose, Calif., it was announced that unit volumes are up along with utilization and capacity in electronics. (August 6, 2003)

Calendar of 2003 Events

Wed, 1 Jan 2003

SEMICON WEST 2003 SYMPOSIUM

Thu, 6 Jun 2003
Tessera Announces Symposium on 3D Packaging, Advanced Packaging Media Sponsor SAN JOSE, CALIF. As part of its ongoing efforts to educate and elevate awareness of advanced packaging technologies, Tessera Inc. announced it will host a half-day symposium on 3D packaging technologies during the week of SEMICON West 2003. (June 19)

SEMICON West San Jose - Program Highlights

Fri, 6 Jun 2002
(June 24, 2002) San Jose, Calif. -- Held here July 17 through 19, 2002, at the San Jose Convention Center, SEMICON West (Final Manufacturing) is packed with courses, classes and networking opportunities.

SEMICON West - San Francisco - Program Highlights

Mon, 6 Jun 2002
(June 25, 2002) San Francisco -- Held here July 22 through 24, 2002, at the Moscone Center, SEMICON West (Wafer Processing) is packed with courses, classes and networking opportunities.

Muhlbauer Showcases Successful High-Speed Die Sorter at SEMICON West 2002, San Jose, CA

Thu, 8 Aug 2002
The flexible platform for high-volume production has gained worldwide acceptance

Newport Corp. to Introduce New MRSI-375FC Flip Chip Bonder at SEMICON West

Fri, 8 Aug 2002
10 Micron Placement Accuracy

ChipPAC Engineers System Package for High-Performance Applications

Fri, 8 Aug 2002
Fremont, CA, July 17, 2002 - ChipPAC, Inc. (Nasdaq: CHPC), one of the world's largest and most diversified providers of semiconductor assembly and test services, today announced that it has successfully engineered a high performance embedded processor module, named the i-Module, with 5 chips in the footprint of a standard Ball Grid Array (BGA) package.

Advantest Driving Formation of Industry-Wide Consortium Aimed at Establishing First Truly Open Test Architecture

Fri, 8 Aug 2002
Company Working to Bring Together Top Chipmakers and Suppliers to Develop a Highly Scalable, Flexible Test Platform With an Expected Lifetime of 10+ Years

Tessera Introduces µZ-Ball Stacked Memory Package for Computing and Portable Electronic Products

Fri, 8 Aug 2002
Breakthrough Technology Delivers up to Eightfold Increase in Memory Density while Significantly Driving Down Stacked Package Costs

ESEC Introduces Revolutionary Bondhead Technology at Semicon West

Fri, 8 Aug 2002
Cham/Switzerland, July 18, 2002 - ESEC, a leading provider of chip-assembly equipment and system solutions for the semiconductor industry, will be presenting a revolutionary technology based on a rotating bondhead, at the world's largest semiconductor trade fair, Semicon West, taking place on July 17-19, 2002, in San Jose, California/USA.

TRADE NEWS: Agilent Technologies, ACCRETECH and Cascade Microtech to Provide New Cost-Saving Parametric Test Solution

Fri, 8 Aug 2002
Companies to Jointly Offer DC/RF Parametric Test Solution to Enable Customers to Reduce Test Time and Improve Yields

Ultratech Unveils First Line of Nanotechnology Lithography Steppers

Fri, 8 Aug 2002
New NanoTech(TM) Family Builds on Ultratech's Proven Technology Expertise to Provide Highly Flexible, Productive and Cost-Effective Steppers for Emerging Markets

Postmark Entries by Monday for New Awards Program

Fri, 3 Mar 2001
NASHUA, NH - You can't win if you don't enter! Advanced Packaging magazine has launched a new awards competition to celebrate product excellence in semiconductor packaging. Entries need to be postmarked by this Monday (April 16).

EXCLUSIVE PACKAGING SUPPLEMENT

Thu, 4 Apr 2001
Packaging: The Next Step
The editors of Solid State Technology and Advanced Packaging magazines joined forces to create a special supplement for our readers. From electroplating to flip chip to the basics, we're certain you'll learn something in this must-read issue. Enjoy!

Attention SEMICON West Exhibitors!

Thu, 5 May 2001
If you are an exhibitor at SEMICON West 2001 this year in San Jose, don't miss this opportunity to have one of your debut products listed in our special July issue. Click here for more details.

THE 2001 ADVANCED PACKAGING AWARDS

Fri, 5 May 2001
Award Entries Surpass Expectations
In just a few short months, the industry will have a few more stars among them. Partnering with SEMICON West 2001, envelope seals announcing the winners of the the 2001 Advanced Packaging Awards program will be broken on Wednesday, July 18.

NEW! THE WEEKLY WRAP FROM WAFERNEWS

Fri, 8 Aug 2001
A Few SEMICON Superlatives
Now that the dust has settled, we can report on some of the other interesting things from SEMICON West last month. Instead of the usual updates about who claimed the largest market share, read on for an update on Razor Scooters and booth decor.

Q1 2006 Semiconductor Sales Up from 2005

Wed, 5 May 2006
San Jose, CA — Worldwide semiconductor sales of $59.1 billion in Q1 2006 showed 7.3% growth over Q1 2005's $55.1 billion, reports the Semiconductor Industry Association (SIA). However, Q1 sales declined 1.3% from Q4 2005's $59.9 billion in sales, reflecting normal seasonal patterns, according to the SIA.

SEMICON West Exhibit Area to Target Test, Assembly, and Packaging

Thu, 5 May 2006
San Jose, CA — SEMICON West, to take place July 11–13, 2006, in San Francisco, CA, will feature a Test, Assembly, and Packaging TechXPOT exhibit area, located in the Moscone Center's West Hall, Level 2. The Test, Assembly, and Packaging TechXPOT will focus on strides in test, assembly, and packaging, with exhibits, displays, and exhibitor presentations.

FlipChip International and Engent Form Strategic Alliance

Fri, 5 May 2006
Phoenix, AZ — Aiming to speed up development and deployment of 3-D wafer-level chip-scale packages(WLCSP) for integrated stack-die packages, FlipChip International (FCI) and Engent have formed a strategic alliance. FCI specializes in wafer-level bumping, while Engent's focus is 3-D flip chip assembly.

SEMI Announces SEMICON West '06 Lineup

Wed, 5 May 2006
San Jose, CA — This year's SEMICON West 2006, to take place July 10–14 at the Moscone Center in San Francisco, CA, will feature many keynote presentations, as well as a selection of short courses sponsored by IEEE/CPMT, Pinnacle Training International (PTI), SEMI, the International Society for Optical Engineering (SPIE), and the Standards Technology Group (STG).

SEMICON West Wrap-up

Tue, 7 Jul 2006
The emerging technologies TechXPOT stage drew crowds to the third floor of West Hall, giving those exhibitors better exposure than last year. Analyst Jean Christophe Eloy from Yole D

From the Tradeshow Floor

Fri, 8 Aug 2006
SEMICON West Made Simple

By Françoise von Trapp, managing editor

As representatives from different companies described their latest technologies, products, and services during SEMICON West, held at the Moscone Center in San Francisco, July 10 – 13, several key points kept hitting home.

Tessera Outlines Agenda for U.S. Technology Symposium

Fri, 6 Jun 2006
(June 9, 2006) SAN JOSE, CA — A comprehensive discussion of the semiconductor supply chain will be presented at the U.S. Technology Symposium on July 10th, with industry experts from Motorola, Hewlett-Packard, Intel, Samsung, Cadence, Prismark Partners, and Tessera speaking. The symposium — taking place the day before SEMICON West opens — is structured to offer a broad view of the technologies and trends driving the future of electronics miniaturization and performance.

This Week in Packaging

Tue, 6 Jun 2006
The low-hanging fruit of packaging news tends to focus on Asia. This installment is no different, so let's start there. Last week, ASAT opened its manufacturing and test facility in Dongguan, China, to complete the process of establishing all of its production operations in China. A key benefit to locating in China is the proximity of facilities to end-users in the huge and developing Chinese market.

Amkor Partners with Sigrity on SoC Packaging Template Library

Fri, 11 Nov 2004
(November 19, 2004) Chandler, Ariz.—Amkor Technology announces that it is working with EDA tool provider, Sigrity Inc. of Santa Clara, Calif., to develop a package-design template library that will be incorporated into Sigrity's EDA tools. The library will address flip chip and high-end wire bond packages for SoC applications.

APEX EXTRAVAGANZA

Fri, 3 Mar 2003
The following companies will be exhibiting these products at APEX 2003, taking place Monday, March 31 through Wednesday, April 2 in Anaheim, Calif. Be sure to visit them to see their latest innovations, and pick up SMT's official Show Daily for more product coverage. ( March 28)
Click here for these and more product briefs.

SEMICON WEST 2003 SYMPOSIUM

Tue, 7 Jul 2003
Tessera 3-D Symposium Demonstrates Greater Supply Chain Cooperation, Advanced Packaging Media Sponsor SAN JOSE, CALIF. Driven largely by the wireless handset market and emerging high-performance computing requirements, the semiconductor industry is increasingly looking to advanced packaging solutions ... (July 17, 2003)

SEMICON WEST (BACK END) DAY 1 NEWS

Fri, 7 Jul 2003
(July 16, 2003) Synergetix Introduces Test Sockets Built Online, Gartner Forecasts Industry Growth, March Plasma Systems Moves to New Headquarters

SEMICON WEST JULY 16 EVENTS

Fri, 7 Jul 2003
The following are press conferences and educational sessions that will be held at SEMICON West in San Jose, Calif. on July 16, 2003...

SEMICON WEST (BACK END) EXHIBITOR LIST

Fri, 7 Jul 2003
The following is a list of vendors that will be exhibiting at SEMICON West in San Jose, Calif., July 15-18, 2003. Please check the SEMICON West show guide for an updated booth number list, as they may change at the conference.

SEMICON WEST JULY 17 EVENTS

Mon, 7 Jul 2003
The following are press conferences and educational sessions that will be held at SEMICON West in San Jose, Calif. on July 17, 2003.

SEMICON WEST JULY 18 EVENTS

Mon, 7 Jul 2003
The following are press conferences and educational sessions that will be held at SEMICON West in San Jose, Calif. on July 18, 2003.

Panel to discuss migration to 65nm at SEMICON West 2004

Wed, 6 Jun 2004
(June 30, 2004) San Francisco, Calif.—Attendees of the 2004 SEMICON West exposition now have the option of attending a panel discussion about the migration to 65nm, including IP ownership and new models of collaboration. The panel consists of top industry technologists such as Bill Rozich of IBM, Mendi Moussavi of LETI, LaMar Hill of Albany Nanotech, Mark Pinto of Applied Materials and Mark McClear of Dow Chemical.

Siemens announces new CEO

Thu, 7 Jul 2004
(ASSOCIATED PRESS, July 8, 2004) Frankfurt, Germany—Siemens AG, Germany's largest technology company, announced today major changes to its management and corporate structure. Most notably, it proposed that 46-year-old Klaus Kleinfeld, former head of Siemens Corp. in New York, replace Heinrich von Pierer as the company's CEO as of January 27, 2005. Siemens' board of directors will consider this proposal on July 28.

SEZ enters back-end UBM etch market

Mon, 7 Jul 2004
(PRNewswire, July 12, 2004) Villach, Austria and Zurich, Switzerland—The SEZ Group, a provider of single-wafer, wet-processing solutions for the semiconductor industry, announced today that it has entered the back-end under-bump metallization (UBM) etch market. SEZ's pioneer UBM etch customer is a Taiwan-based semiconductor packaging and test company, as well as a provider of solder bumping and BGA and flip-chip packaging.

SEMI names new chairman

Wed, 7 Jul 2004
(July 14, 2004) San Francisco, Calif.—SEMI, an international association for companies in the microelectronics and display industries, announced yesterday the appointment of Tetsuro (Terry) Higashi as its new chairman of the board of directors. The results of the association's annual elections were released at the SEMICON West exposition in San Francisco. Higashi, current chairman of Tokyo Electron Limited, succeeds George Chamillard, who served as SEMI's chairman for the past year.

SEMI releases mid-year forecast for semiconductor industry

Tue, 7 Jul 2004
(July 13, 2004) San Francisco, Calif.—Leading semiconductor equipment manufacturers expect sales to increase 63 percent this year from the $22.2 billion posted in 2003, according to the mid-year edition of the SEMI Capital Equipment Consensus Forecast. This forecast was released yesterday at the SEMICON West 2004 exposition.

2004 Advanced Packaging Awards announced

Thu, 7 Jul 2004
(July 19, 2004) Nashua, N.H.—Advanced Packaging magazine has released the names of the winners of its 2004 Advanced Packaging Awards. Electroglas, Inc., ASAT Holdings Limited and Robotic Vision Systems, Inc. are among the companies that received honors for innovations in advanced packaging technology. The awards ceremony took place July 14 at the SEMICON West 2004 exposition in San Jose, California.

Closing the loop

Mon, 8 Aug 2004
(August 2, 2004) Atlanta, Ga.—In electronics assembly, 60 to 70% of final defects occur during the stencil printing process (SPP), a stage of surface-mount technology for printed circuit board assembly. Researchers at Georgia Tech's Center for Board Assembly Research (CBAR) have developed a new data-driven, closed-loop control technology that adjusts electronics assembly equipment parameters in real-time, resulting in fewer defects and higher yields.

SEMICON West 2005 CALL FOR PRODUCTS

Tue, 4 Apr 2005
Nashua, N.H. — Advanced Packaging Magazine is looking for your latest and greatest products to feature in our July 2005 SEMICON West 2005 Product Preview. If your company plans on exhibiting at SEMICON West 2005, to be held July 11-15, 2005, in San Francisco, Calif., please submit your product press release, preferably with an accompanying electronic image*, to Lee Mather, Advanced Packaging assistant editor, by May 10, 2005.

Advanced Energy to debut Aera(R) PI-980(TM) series pressure-insensitive MFC for advanced processes at SEMICON West 2005

Fri, 7 Jul 2005
FORT COLLINS, Colo., July 7 /PRNewswire-FirstCall/ -- Advanced Energy Industries, Inc. (NASDAQ:AEISE) today announced that it will debut its Aera(R) PI-980(TM) series pressure-insensitive mass flow controller (MFC) during SEMICON West 2005.

Development of a fan filter unit test standard, laboratory validations, and applications across industries

Wed, 11 Nov 2006
Standard testing of FFU performance provides useful data for better understanding and characterization of FFU products

PARTICLES

Wed, 8 Aug 2007
News snippets from the world of contamination control.

‘Green’ light shines on SEMICON West

Mon, 9 Sep 2008
It wasn’t springtime but this year’s SEMICON West was nonetheless green.

Standards Committees Meet at SEMICON West

Sat, 7 Jul 1995
San Francisco, CA--The SEMI International Standards divisions are meeting at the 25th annual SEMICON West conference and exhibition this month. The Contamination in Distribution Systems Subcommittee will discuss ballot results for four test methods relating to gas filters, distribution systems and gas panel systems. In addition, the Minienvironment Contamination Standards Validation Program will discuss results of implementing two new standards, SEMI E45 and E46, specifications for determining

Speedline Technologies to unveil new XyflexPro+ advanced dispensing system at SEMICON West

Mon, 5 May 2005
FRANKLIN, Mass.--(BUSINESS WIRE)--May 16, 2005--Speedline Technologies will shine in the SEMICON West 2005 spotlight on the latest platform enhancements and developments of its soon to be released XyflexPro+ Dispensing System.

Technology utilizes minienvironments to improve ultraclean wipers

Wed, 7 Jul 1998
A technology developed by The Texwipe Co. (Upper Saddle River, NJ) aims to clean up the process of manufacturing wipers used in critical environments.

See the MEMS tech showcase at SEMICON West

Tue, 6 Jun 2011

The MEMS DemoZone Display, presented by the MEMS Industry Group, will display MEMS products and suppliers at SEMICON West, showcasing the diversity, enabling capabilities, and nuances of MEMS technology.


Nordson ASYMTEK film-frame packaging workcell improves MEMS, wafer dicing

Mon, 7 Jul 2011

Nordson ASYMTEK introduced the MH-910W automated workcell for film-frame wafer-level packaging applications, such as capping MEMS die and coating wafers prior to laser dicing.


MEMS testing units bolster Rasco product line with high parallelism

Fri, 7 Jul 2011

Rasco GmbH, a Cohu Inc. (NASDAQ: COHU) subsidiary, added the Pressure Test Unit (PTU) and the Acoustic Test Unit (ATU) to its line of testers for MEMS ICs.


MEMS manufacturing on retuned CMOS lines

Thu, 7 Jul 2011

Tony McKie, GM of MEMSSTAR, tackles the question of how to make MEMS truly manufacturable. "Nobody builds a MEMS manufacturing line anymore," says McKie.


The future of MEMS: Rethinking business strategies and manufacturing technology for volume systems markets

Tue, 6 Jun 2011

SEMICON West preview: Rapid growth in mainstream consumer markets is changing the structure of the MEMS industry from an artisanal to a volume manufacturing business -- creating a new set of challenges and opportunities to companies to find better ways to speed the production ramp, find better ways to integrate multiple die and software, and to find the right business models.


Panasonic invests in Alchimer deposition tech for TSVs

Mon, 7 Jul 2010

Alchimer S.A., a provider of nanometric deposition technology for through-silicon vias (TSV), semiconductor interconnects, and other electronic applications, announced that Panasonic Corporation (NYSE: PC) has become an equity investor in the company.


JC Eloy: What's in store for MEMS

Thu, 8 Aug 2009
August 6, 2009: Jean Christophe (J.C.) Eloy, president and CEO of Yole Développement, talks with Small Times' Pete Singer at SEMICON West, about the MEMS market and notable trends.

SEMICON West preview: MEMS manufacturing changes with HV consumer apps

Wed, 6 Jun 2012

Paula Doe, SEMI Emerging Markets, covers developments at Applied Materials, Coventor, and other members of the MEMS equipment supply chain that will make MEMS less expensive, smaller, and easier to manufacture.


SEMICON West: MEMS key to leading-edge semiconductors?

Wed, 7 Jul 2009
July 15, 2009: A new technology being bundled into lithography equipment supporting leading-edge semiconductor manufacturing utilizes MEMS functionality to push current lithography technology as far as it can go.

Guide to MEMS at SEMICON West 2012

Thu, 6 Jun 2012

Paula Doe, SEMI Emerging Markets, shares the annual guide for navigating the MEMS events at SEMICON West, July 10-12 at Moscone Center in San Francisco, CA.


Diving deep — because materials matter

Thu, 8 Aug 2013

A note from Karen Sevala, president, SEMI Americas.


Boston Semi Equipment announces expansion of front and back end equipment business

Thu, 7 Jul 2013

At SEMICON West 2013, Boston Semi Equipment (BSE), LLC announced the expansion of its semiconductor front end and back end equipment businesses in Tempe, Ariz. into a new and larger facility.


Solid State Technology and SEMI announce 2013 “Best of West” award winner

Thu, 7 Jul 2013

Solid State Technology and SEMI announced the recipient of the 2013 “Best of West” Award — Mentor Graphics — for its Tessent TestKompress with Cell-Aware ATPG.


Growing opportunities in the Asian secondary semiconductor equipment market

Thu, 7 Jul 2013

Bruce Kim, CEO of SurplusGLOBAL,  expects a slight upturn in the Asian Secondary Semiconductor  Equipment Market at Semicon West.


cyberTECHNOLOGIES introduces Interferometric accuracy on suite of Surface Metrology Systems

Thu, 7 Jul 2013

cyberTECHNOLOGIES GmbH announced the addition of White-Light Interferometry (WLI) to its suite of production-proven CT SERIES non-contact surface metrology systems at SEMICON West 2013.


Continued strength of Taiwan’s semiconductor market on display

Thu, 7 Jul 2013

SEMICON Taiwan is set to open in September amidst an improving global and regional outlook for 2013 and 2014 that sees Taiwan remaining the largest and strongest market for semiconductor manufacturing.


Conventor addresses new requirements of 3D fab era

Thu, 7 Jul 2013

Coventor, Inc., a supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), shared the SEMulator3D 2013 software platform at SEMICON West 2013.


Leti discusses different lithography options for advanced technology nodes at SEMICON West 2013

Wed, 7 Jul 2013

Dr. Tedesco suggested that an “optical forever” solution using 193nm immersion lithography in combination with a pitch-multiplication strategy could well provide lithography solutions to very advanced nodes on the industry’s technology roadmap.


SEMI Standards honors industry leaders at SEMICON West 2013

Wed, 7 Jul 2013

SEMI honored 14 industry leaders for their outstanding accomplishments in developing standards for the microelectronics and related industries. The SEMI Standards awards were announced at a reception held during SEMICON West 2013.


Leti and EV Group launch a common lab on wafer bonding technologies

Wed, 7 Jul 2013

Project targets more efficient 3D TSV integration and covalent bonding at room temperature


Element Six increases global manufacturing capacity for microwave CVD synthetic diamond

Tue, 7 Jul 2013

At SEMICON West 2013, Element Six today announced it has expanded its global manufacturing capabilities of microwave chemical vapor deposition (CVD) synthetic diamond by 60 percent compared to last year.


Dow Corning joins imec for advancement of enabling technologies for 3D-IC

Tue, 7 Jul 2013

Dow Corning announced Monday that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics.


EV Group announces strong growth and new manufacturing processes at SEMICON West 2013

Tue, 7 Jul 2013

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved strong revenue growth and expanded its headcount for the first half of 2013.


New methods to reduce time and cost of R&D

Wed, 7 Jul 2013

SEMICON West 2013 included a robust set of technical and marketing presentations on the general theme of developing new semiconductor devices in the session “Lab to Fab: From R&D to High Volume Manufacturing” held 1:30-3:30PM on July 9.


SEMICON West keynoter outlines The Big Five Challenges of the semiconductor industry

Tue, 7 Jul 2013

When Ajit Manocha, GlobalFoundries CEO, polled his audience during his keynote address on Tuesday at SEMICON West 2013, nearly 60 percent of the audience believed that the biggest challenge facing the semiconductor industry was the economy. However, during his presentation, Manocha seemed to suggest otherwise.


SEMICON West R&D panel discusses the future of semiconductor technology

Wed, 7 Jul 2013

Leaders of research consortia from around the world sat down to share updates and insights with SEMICON West attendees on Wednesday morning.


Semiconductor roadmapping update: Front-end technologies Part 1

Mon, 7 Jul 2013

In the afternoon of the last day of SEMICON/West 2013, a session was devoted to updates from the International Technology Roadmap for Semiconductors (ITRS) Front End of Line Technologies.


Semiconductor roadmapping update: Front-end technologies – Part 2

Mon, 7 Jul 2013

SEMATECH's Mark Neisser provided a sobering overview of the challenges associated with extending Lithography technology to pattern device structures below a half-pitch of 20nm.


F450C hosts panel during SEMICON West to address 450mm facility infrastructure

Wed, 7 Jul 2013

Following last week’s formal announcement from Governor Cuomo of the formation of the Facility 450 Consortium (F450C), ten leading nanoelectronics facility companies from around the world will collaborate at CNSE to lead the global effort to design and build the next-generation 450mm computer chip fabrication facilities.


SEMI recognizes GLOBALFOUNDRIES CEO

Tue, 7 Jul 2013

SEMI today announced that Ajit Manocha, CEO of GLOBALFOUNDRIES, has been selected to receive the “SEMI Outstanding EHS Achievement Award — Inspired by Akira Inoue.”


Options for adding memory and logic to printed or flexible electronics

Tue, 7 Jul 2013

Developers have made major progress in the technology to manufacture printed or flexible circuits, sensors, batteries and displays. But frankly it’s been hard to build applications with much market pull without logic or memory as well, and those have been much harder to make.


Getting ready for 10/100/20 – Europe’s manufacturing initiative is underway

Tue, 7 Jul 2013

Europe’s recently launched industrial strategy to reinforce micro- and nanoelectronics manufacturing is more than just a vision — it’s a major opportunity for equipment and material suppliers to participate to large-scale investment projects, increase their holding in key technologies and reach out to new customers and markets.


Imec reveals method of damage free cryogenic etching of ultralow-k dielectrics

Tue, 7 Jul 2013

New method allows IC manufacturers to reach scaling levels at 20nm and beyond, without compromising speed and device cross-talk.


EVG pushes the limits on 3D-IC manufacturing

Tue, 7 Jul 2013

EV Group (EVG), a  supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the latest version of its EVG40NT automated measurement system.


ASML at Semicon West 2013: SRAM scaling has stopped!

Thu, 7 Jul 2013

Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about an ASML presentation from Semicon West. This is a follow up to a previous post: "Dimensional Scaling and the SRAM Bit-Cell."