Doug Dixon from Henkel explains two announcements the company made at SEMICON West: a silver sintering material that requires no pressure, and joint work with STMicroelectronics on conductive die attach films for very small package configurations.
In these 2 video interviews from SEMICON West 2011, ESI technologists John Sabol and Vernon Cooke discuss what LED chips require on the back-end manufacturing line, starting at wafer scribing and moving on through test.
Amkor's Ron Huemoeller shares his thoughts about two panels from SEMICON West, on 2.5D silicon interposer packaging technologies and its supply chain, and 3D packaging technology and its ecosystem.
At SEMICON West, 100+ attendees gathered at the Suss MicroTec workshop "3D Integration: Are we there yet?" to hear technical experts from around the globe to present updates on the status of 3D technology.
SEMICON West is a major conference for semiconductor manufacturing professionals. Semiconductor packaging has become a major focus in recent years, and this year, BEOL attendees have ATE Vision 2020, 3D IC standards meetings, a keynote, and multiple sessions dedicated to packaging technologies. Here's your guide to attending SEMICON West on a packaging track.
Jennifer Wrigley and Robert Bellinger, Olympus, share insights on SEMICON West
Nordson MARCH uncrated the FasTRAK Plasma System at SEMICON West. The automated, high-throughput vacuum plasma treatment system processes leadframe strips, laminate substrates, and other strip-type microelectronic components.
At SEMICON West, the working groups of the International Technology Roadmap for Semiconductors (ITRS) outlined 2012 updates to the roadmap. Check out the back-end process info here.
Mark Privett, Brewer Science, says that new technologies allow use of higher temperatures as well as room-temperature processes, such as wafer de-bonding. The 3D industry is nearly ready for high-volume, yet still without industry standards.
In this video interview from SEMICON West 2010, Walden Rhines, Mentor Graphics, discusses 3D technologies. EDA tools need to be extended to meet the needs of 3D -- parasitic extraction and timing, place-and-route, and other steps are different with 3D. The tools are evolving for the various 3D technologies. He also touches on lithography evolution.
In this video, Matt Nowak, Qualcomm, talks about his keynote at ASMC on through silicon technologies for stacking die in advanced packaging applications.
Wrap-up of what we heard and saw at SEMICON West 2010. Lesson 3: Everything about 3D & packaging was hot, with suppliers jostling to get into this next high-growth market. But are they really prepared for what awaits them?
In this video, Timothy Dunn, Marcy Nano Center, discusses building an eco system for advanced semiconductor manufacturing in the US. Marcy Nano Center is pre-permitted and site-ready to build a semiconductor site with a packaging focus, with its academic and industry partners.
Advanced Micro-Fabrication Equipment Inc. (AMEC) is fielding interest from packaging companies in the Primo D-RIE tool, which can be used to etch wafers for through-silicon via (TSV) interconnects.
Mark Allison, VP, Strategic Marketing, Verigy Ltd., points out that the economic downturn helped promote the outsourced semiconductor assembly and test (OSAT) model, which pushes test platforms into more configurable models.
At the ITRS 2012 update, back-end technologies session, at SEMICON West, roadmapping for More than Moore was addressed as both a philosophical and technical matter.
MicroProbe introduced current-carrying capability of >1A/probe in 90
The bulk of packaging falls under the
USHIO Inc. is introducing the large-field stepper lithography tool
Seiko Epson launched the NX1032XS pick-and-place IC test handler, boasting high throughput for transferring, inspecting, and sorting semiconductors.
SEMICON West is taking place July 10-12 in San Francisco, CA. Following are new products for semiconductor packaging and test that will be at the show, from wafer bonders to LED die attach materials.
Steve Lerner, CEO of Alchimer, discusses the company's latest suite of through silicon via (TSV) technologies, focusing on how the platform reduces costs for advanced packaging processes.
Speakers at a SEMATECH/Fraunhofer-hosted workshop at SEMICON West looked at stress management for 3D ICS using TSVs: the state of reliability testing, failure analysis techniques, and why an engineering paradigm shift is needed.
Sitaram Arkalgud, director of interconnect at SEMATECH, discusses the high-volume manufacturability issues and gaps in both 2.5D and 3D semiconductor technologies with respect to backside processing and wafer bonding, thinning, and handling. Standards are also covered.
ESI uncrated the Model 5390 micromachining system for advanced LED via drilling and the AccuScribe 2600 HB-LED wafer scribing system at SEMICON West.
Henkel Electronic Materials introduced a silver (Ag) sintering technology that enables high-volume power package production that skips single-package pressure processing, eliminates lead-based solder, and withstands temperature cycling better than currently available materials.
Henkel worked with STMicroelectronics (STM) to qualify Henkel's Ablestik C100 conductive die attach film materials for scalable, adaptable leadframe packaging.
Jan Vardaman, president and founder of TechSearch International, summarizes highlights from her SEMICON West presentation on TSVs, speaking to RDL development, LED packaging, and TSV-alternative PoP.
The FC300R performs chip-to-substrate bonding, chip-to-wafer assembly, and chip-to-chip stacking for flip chip, through silicon via (TSV), and other advanced packaging processes, with a robotic handling system for fragile and diverse substrates/wafers.
SEMICON West preview: This year's SEMICON West Advanced Packaging Program is taking a broad approach, encouraging participation from across the supply chain to help keep pace with a rapidly expanding electronics market -- and in markets beyond, from automotive to aerospace and medical.
In this video interview from SEMICON West 2009, Bart Swinnen, reviews the established interconnect bonding and through-silicon via (TSV) technologies at the system-integration level. He also discusses the newer TSV possibilities and different application-specific TSVs.
Solid State Technology and SEMI today announced the finalists for the 2012 “Best of West” awards, recognizing important product and technology developments in the microelectronics supply chain.
Following are some of the process control, device inspection, defect detection, and other metrology and test products that will be on display at SEMICON West 2012, July 10-12 in San Francisco, CA.
SEMICON West 2012 will take place July 10-12 at the Moscone Center in San Francisco, CA. Following is a preview of the LED and OLED events taking place during SEMICON West, from contributor Paula Doe, SEMI Emerging Markets.
SEMICON West is taking place July 10-12 in San Francisco, CA. Following are new products for lithography, including photoresist coaters and ashers.
Technology for making circuits with organic materials, non-vacuum processes, and flexible substrates has made striking progress, but it’s been a challenge to find applications where the new technologies offer must-have advantages. Paula Doe, SEMI, reports on flexible and large-area OLED displays and lighting.
Applied Materials introduced a new dielectric etch system called the Centura Avatar, which can etch holes and trenches in complex film stacks with depth to width aspect ratios of up to 80:1. It is designed to meet new requirements in creating 3D memory architectures.
SEMICON West kicked off with a surprise announcement regarding Intel's investment in ASML, but generally the event highlighted trends “as expected” in the fab supply chain, say Barclays analysts.
Terry Brewer, one of the newest members of SEMI's North American advisory board, talks about semiconductor industry consolidation, as well as new technologies and materials in the industry. He shares how SEMI is reacting to this evolution.
SEMICON West confirmed for Barclays that Q2 2012 orders for MOCVD tools remained flattish with the trough-like Q1 numbers, and LED makers are expected to order more tools in H2 2012.
Bruker introduced three 450mm X-ray and AFM semiconductor metrology tools -- the InSight-450 3DAFM, the D8 FABLINE X-ray system, and the S8 FABLINE-T X-ray system -- during SEMICON West.
The overriding message for 2012 is that the roadmap has been largely
stabilized with the significant changes that were input last year in the
2012 publication,” said Intel’s Alan Allan, speaking at Semicon West.
At SEMICON West, SEMI honored six industry leaders for their outstanding accomplishments in developing standards for the microelectronics and related industries.
SEMICON West’s Day 2 keynote speaker represented a fabless company: Ivo Bolsens, PhD, SVP and CTO of Xilinx presented on how programmable chips and innovative packaging can advance semiconductors.
CEA-Leti presented research updates alongside SEMICON West this week. After the talks on device architecture, 3D and 2.5 packaging interconnects, large-scale computing and power consumption, and more, CEA-Leti’s researchers joined Solid State Technology to talk about their fields of interest.
Barclays Capital is seeing various reasons for a Q3 2012 semiconductor fab order/shipment pull-back, following meetings around SEMICON West 2012. The analysts expect strong orders in Q4.
After meeting with various semiconductor manufacturing tool suppliers -- Applied Materials, KLA-Tencor, Lam Research, Tokyo Electron, Teradyne and Cymer -- at SEMICON West, Citi analysts share impressions on foundry spending plans and tool choices.
Blogger Michael A. Fury, Ph.D., Techcet Group, reports on Day 2 of SEMICON West with insights from the Sokudo Lithography Forum and NCCAVS CMPUG meeting, and -- sadly -- none on SEMICON West’s Happy Hour.
Solid State Technology and SEMI announced the Best of West Award winner -- Jordan Valley Semiconductor -- during SEMICON West today. Jordan Valley Semiconductor’s QC-TT defect inspection system predicts breakage in 450mm wafers, which are subject to more handling steps and more thermal stresses due to their larger size.
In this video interview, Intel's Shekhar Borkar shares some key topics from SEMICON West keynote: Near-threshold voltage transistor designs, 3D integration for DRAM, unconventional interconnect, and more.
Citi analysts surveyed the LED manufacturing market and LED demand at SEMICON West in San Francisco, CA, including a slight uptick in MOCVD orders, and some backlash against Cree's downstream ambitions.
Barclays Capital analysts share observations from meetings with semiconductor manufacturing tool suppliers at SEMICON West, noting the enthusiasm and concrete deals around EUV lithography and transitioning to the 450mm wafer size.
Michael A. Fury, Ph.D., reports on the opening day of SEMICON West (July 10), covering exaflop computing, FDSOI, TSV and other integration schemes, and silicon photonics with CEA-Leti.
Luc Van den hove, president and CEO, imec, spoke with Solid State Technology, covering imec’s major announcements and research presentations to take place during SEMICON West 2012.
ATMI introduced BrightPak, its next-generation liquid containment and delivery system for high-value liquid material transfers during advanced photolithography processes in semiconductor, FPD, and LED manufacturing.
Semiconductor equipment sales will reach $42.4 billion in 2012, according to the mid-year edition of the SEMI Capital Equipment Forecast, released at SEMICON West 2012.
Michael A. Fury, Ph.D., reports from the pre-opening day (July 9) of SEMICON West at the Moscone Center in San Francisco, CA. The first day hosts SEMI’s press conference on semiconductor revenues and the SEMI/Gartner Market Symposium.
ASML established a program to enable its largest customers to make minority equity investments in the semiconductor manufacturing tool maker. The program includes commitments to fund ASML's R&D spending, accelerating development of EUVL and 450mm technology for 2015-2020 timeframe.
SEMI’s annual Board of Directors election results are in, with new directors Jifan Gao, Trina Solar; Nobu Koshiba, JSR Corp.; Sue Lin, Hermes-Epitek; and Natsunosuke Yago, Ebara Corp., joining.
Following are some of the new and flagship products that will appear this week at SEMICON West, July 10-12 in the Moscone Center of San Francisco, CA.
Ushio launched its thinnest UV irradiance meter 'UIT-q365." The meter is 4.9mm thick, used to keep major UV processes within spec. It can be used during optical film manufacturing for flexible electronics, as well as during adhesion of precision optical parts.
Some of the new and flagship wafer fab products and supporting facility products, like vacuum valves, that will be on the show floor at SEMICON West, from ion implant to MOCVD traps and gas blenders.
In this SEMI News and Views blog, Karen Savala covers EUV lithography, 450mm wafers, and 3D IC developments, based on her recent presentation at SEMICON West, “Supply Chain Readiness in an Era of Accelerated Change.”
Through a series of lectures and workshops, SEMATECH will address R&D challenges and closing key infrastructure technology gaps from July 8–12 at SEMICON West in San Francisco, CA.
Multitest’s James Quinn will present during the 2013 SEMICON West exhibition and conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA.
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.31 billion in the first quarter of 2013.
Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function.
Much has been said of the 450mm transition. But the description of this inflection is something of a misnomer.
Critical trends and developments in the technologies, methodologies, and applications challenges in semiconductor test will be presented at the 6th annual IEEE Test Vision 2020 Workshop held in conjunction with SEMICON West 2013, on July 10-11 at the San Francisco Marriot Marquis Hotel.
In advance of the 2013 SEMICON West TechXPOTs on lithography and nonplanar transistors beyond 20nm, SEMI asked some of the speakers and industry experts to comment on the challenges they wanted to highlight. Many of the inputs focused on the need for precision in the processes used to form transistors, as well as how EDA can contribute to mitigating variability.
Several years ago when the challenges to 450mm wafer processing, EUV development and novel transistor designs were first being discussed, SEMI commissioned a study that predicted the industry could face an R&D funding gap that could exceed $9 billion if current technology and economic trends continue.
Dynamic changes to R&D processes, tools, technical challenges, and funding/business models will be highlighted at SEMICON West 2013, along with product displays of the latest semiconductor manufacturing technology, components and subsystems.
The latest advances in HRXRD technology to allow true in-line monitoring, are described. Paul Ryan, et al, Jordan Valley Semiconductors UK Ltd.
In this video from SEMICON West 2010, Sagar Kekare, Synopsis, presents ideas from his paper on rapid root cause analysis and process change validation using design-centric volume diagnostics.
In this video interview, Franklin Kalk, Toppan Photomasks, comments on the big EUV news annouced at SEMICON West. Technical challenges of EUV remain defect management -- finding and fixing defects in masks. Pattern mask inspection may not be ready until 2016.
Christopher Wargo, Entegris, talks contamination control at 22nm and below. Lithography presents a suite of issues for contamination control. While the technology exists to confront new contaminants, commercialization is key.
Techcet's Michael Fury reports from Day 1 of SEMICON West, from keynotes to CMP to thermal characterization, and the continued use of “zombie” semiconductor manufacturing technologies.
The Soitec Group (Euronext Paris) released the Ultra-Thin Buried Oxide (UTBOX) extension to its Ultra-Thin (UT) silicon-on-insulator (SOI) platform, a robust substrate solution for chip designers tackling the performance, power and density challenges of mobile consumer devices.
ASML Holding NV (ASML) announced broad customer adoption of holistic lithography products that optimize semiconductor scanner performance and provide a faster start to chip production. All of ASML’s leading-edge scanners are now sold with one or more holistic lithography components.
SEMI has announced that Applied Materials, Inc. is the recipient of its 2010 SEMICON West Sustainable Technologies Award in recognition of the Applied iSYS Integrated Subfab System. The Sustainable Technologies Award winner was selected with technical guidance from a panel of technology industry environmental, health and safety experts.
Applied Materials etch VP Thorsten Lill explains how the company’s AdvantEdge Mesa etch tool, debuting at this year’s SEMICON West, uses synchronizing plasma pulsing to tackle problems inherent with advanced conductor etch.
With continued device geometry and new process steps comes increasing use and variety of CMP steps, and an increasing need to learn more about (and ultimately manage/eliminate) particles in the slurry that can wafer defects and yield losses. Enter Vantage Technology, which is debuting a new slurry particle measurement technology, SlurryScope (patented in the US and internationally), to provide undiluted real-time measurement of industry-standard production slurries.
Wrap-up of what we heard and saw at SEMICON West 2010. Lesson 1: Good times abound, visibility's increasing, and show stats were better -- though what kind of show is it now?
CEA-Leti developed a digital baseband circuit for software-defined-radio and cognitive-radio applications that features less than 50 microseconds (µs) for full reconfiguration and multi-applications support.
The biggest change in 2009 was Mentor passing Cadence to become number two in product sales in EDA. This is an indication of the market shift caused by the move into the ESL Methodology. Synopsys remains a strong number one.
Techcet's Michael A. Fury concludes his observations from this year's SEMICON West. Highlights from Day 3: CMP beyond semiconductors, CMP Q&A, solar panel parallels, and the PV sector's victory toast.
Techcet's Michael A. Fury continues his observations from this year's SEMICON West. Highlights from Day 2: A bioelectronic Onstar system; highlights from chemical & gas and CMP users' group sessions; a great place for steaks in SFO; and updating Art Z's Law of ponytails and Ferraris.
While we were not allowed to snap photos of the proprietary processes inside Applied Materials, Solid State Technology editor in chief Pete Singer put together these photos with information from the Applied Materials tour. Highlights include a solar-panel roof on the parking area, and discussion of AMAT's new products.
Alok Vaid of GlobalFoundries, explains the technology in his paper on time-to-solution for scatterometry metrology. Scatterometry takes a long time, but Vaid proposes a new approach with more automation.
Tom Jefferson, ISMI's 450mm program manager, gives SST an exclusive rundown of ISMI's closed-door update on 450mm progress at SEMICON West.
IC Insights analyst Bill McClean explains why he's becoming a little more conservative about 2H10 semiconductor industry growth. (Hint: it's about inventories, and rubber bands.)
Wrap-up of what we heard and saw at SEMICON West 2010. Lesson 4: The semiconductor/equipment/component supply-chain went from ice-cold to red-hot in a matter of months, which brings its own unique challenges to the industry.
SEMI's June numbers for semiconductor equipment demand hit a milestone, officially surpassing pre-meltown levels, but numbers are somewhat mixed -- and the future's as blurry as ever.
SEMICON West 2010 wrapped this week in San Francisco. This article includes JC Kim, SEMI Board of Directors Chair, discussing the show and the semiconductor industry future. We also have POVs from the show floor by the ElectroIQ.com bloggers.
In this video, LaMar Hill, North East Sustainability Institute, State University of NY, talks about renewable energy and motivating a younger generation of engineers. Senior technical editor Debra Vogler speaks with Hill at ASMC, taking place in San Francisco with SEMICON West.
Jennifer Braggin, Entegris, chaired a session at ASMC on defect inspection. In this video, she summarizes the key points: new processes and materials add new detection challenges, and analysis from the lab is now moving into the fab. Wafer-edge inspection is highlighted.
James Moyne, Applied Materials, highlights a new technology: virtual metrology. Virtual metrology, on which Moyne presented at ASMC/SEMICON, enables tighter semi fab control using line data analysis. The summarized data is synched with real metrology data. Virtual metrology is now adaptive.
In this video interview, Bryan Rice, SEMATECH, discusses the readiness of EUV. SEMATECH is partnering with Carl Zeiss for EUV process development. The next phase will be a blank inspection phase, beginning a few months after SEMICON West.
It is with great sadness that I report the passing of longtime Solid State Technology editor, Selma Uslaner, on September 20th. Selma’s contributions to the industry and the magazine are legendary. Selma worked on the magazine since its inception in 1958. Her various roles included editorial assistant, show coordinator, reporter, news editor, managing editor, and director of industry relations.
Ludo Deferm, IMEC, came to SEMICON West with several major announcements, from the system level to the layers of semiconductors. IMEC's major interests include scaling with 3D technologies, selective epitaxy, RRAM, lithography, and more.
LEDs, SiGe semiconductors, and WLP bumps each present their own challenges to metrology systems, says Alon Kapel, Jordan Valley Semiconductor.
Ricky Jackson, Texas Instruments (TI), discusses analog IC developments, and how analog and digital semiconductors are pursuing Moore's Law and More than Moore in different ways. He also touches on TI's new fab capacity.
SEMICON West may not be the big-iron displayfest it once was, but there are still plenty of new product introductions to go around. Here's just a brief rundown of some of the ones we tracked from this year's show.
SEMATECH announced a 450mm imprinted wafer, accomplished by EV Group (EVG). Markus Wimplinger, EVG, described the timeline for the 450mm effort and how the company decided to make a strategic move.
Wrapping up SEMICON West, Techcet's Michael A. Fury takes a closer look at a couple of companies and products that caught his attention: Vantage's realtime CMP slurry particle measurement, and Thin Film Electronics' rewriteable printed ferroelectric NVRAM.
Rounding up observations from Day 3 at SEMICON West, Intermolecular's Russell Kempt looks at LED technology, executive opinions on big-picture industry issues, and the state of play in the solar market.
SigmaTech's UltraMap-TSV system won Best of West at SEMICON West, presented by industry association SEMI and Solid State Technology.
Lithography light source maker Gigaphoton Inc. verified its original technology for mitigating debris with magnetic fields for laser-produced plasma (LPP) light sources, clearing a hurdle for mass-production use.
Jonathan Davis, SEMI, chats about standards development in 450mm and 3D IC, as well as the importance of collaboration, and how it is happening at SEMICON West.
Exotic pads for CMPs, flow meters with a nod to Napoleon, and driving down LED costs were among themes pursued by Techcet's Michael A. Fury on a walk through the SEMICON West show floor.
Techcet's Michael A. Fury continues his reporting from SEMICON West, reviewing talks at the NCCAVS CMP User Group forum, as well as a breakfast seminar with outlooks on the semiconductor and related industries.
Intermolecular's George Mirth reports on interesting keynote speeches and comments from the Sokudo Lithography Breakfast at SEMICON West, in talks from ASML, Nikon, Mapper, Xtreme, and imec.
Updates from ISMI's 450mm industry briefing at SEMICON West reveal intensifying participation and development underway for most required capabilities, and evaluations showing "low risk" for factory integration.
The global CMP consumables market recovered from the recession, 2 years ahead of schedule. According to Techcet Group's "CMP Consumables 2011 Critical Materials Report," market share is shifting from W and ILD slurry to copper and STI, and fabs are establishing "magic triangles."
On the eve of SEMICON West's official opening, Mike Fury reports on a full day of presentations offered a review of trends and new outlooks for fab capacity, equipment and materials spending, foundries, and packaging technologies.
KLA-Tencor Corporation (KLAC) launched a new generation in its Surfscan family of wafer defect and surface quality inspection systems: the Surfscan SP3. The unpatterned wafer inspection platform uses deep-ultraviolet illumination and is extendible to 450mm wafers.
At SEMICON West, imec is demonstrating a viable implant-free quantum-well (IF-QW) pFETs with an embedded silicon-germanium (SiGe) source/drain and 3D integration of a commercial DRAM chip on top of a logic IC.
David Lam summarizes how the industry does not have to "throw out" optical lithography as it proceeds to more advanced nodes -- complementary e-beam lithography (CEBL) is part of the overall solution, "complementary lithography," that can overcome the resolution limitations of 193i technology.
EV Group (EVG) released a wafer bonding system for 450mm silicon-on-insulator (SOI) wafers: EVG850SOI/450-mm. EVG's Paul Lindner discusses the tool, and challenges of 450mm and SOI.
Verigy, an Advantest Group company (NYSE: ATE), launched scalable, cost-efficient testers for advanced semiconductors, such as 3D device architectures and 28nm and below technology nodes: V93000 Smart Scale Generation.
Nordson MARCH introduced the FlexTRAK-WF low-cost, cassette-based automated plasma treatment system that handles five wafer sizes with minimal hardware change-over.
Avantor Performance Materials will launch the first in its new J.T.Baker SLCT Series of selective etch surface treatment chemistries, SLCT 128 sigma etchant, at SEMICON West. The product results from a partnership with etch specialist SACHEM.
The semiconductor industry will invest about $44 billion in production equipment globally in 2011, which industry organization SEMI calls a "record sum."
At this week's AVS/ALD Conference, Intermolecular's Chi-I Lang reports on Day 2 highlights: faster and more flexible approaches to ALD processing, integration challenges with platinum ALD, a peek behind the curtain of equipment development, and the unique challenge of vendor support for high-volume manufacturing.
SEMICON West preview: Emerging technology and a developing infrastructure for printed electronics is enabling circuitry that is flexible, conformable, and inexpensive to mass-produce, paving the way to a variety of low-cost applications such as electronic packaging, ID tags, and wide-area lighting panels.
The semiconductor industry's torrid pace of capital equipment expenditures will continue in 2011, but actual construction of new fabs is slowing to "historically low" levels, according to data from SEMI.
SEMICON West preview: With device efficacy approaching limits and end-costs still too high for mass-market adoption, LED manufacturers are looking to trim costs by improving key manufacturing steps: measuring process conditions, preparing and handling substrates, and wafer-level testing.
Tien Wu, ASE; Rama K. Shukla, Intel; and Luc Van den hove, imec, are the honored presenters for SEMICON West 2011.
To maintain profitability and growth in the next 10 years, semiconductor executives must understand and successfully execute lab-to-fab transitions of new technologies. 2 SEMICON West sessions aim to tackle these issues.
Two TechXPOT sessions at SEMICON West will address the new architectures needed to continue scaling both logic and memory devices, as well as the major challenges facing lithography both for EUV and options for extending 193nm immersion.
Dick James, ChipWorks, speaks about Intel's presentations on strain engineering and lithography masks for trigate transistors, and the industry split between FDSOI and trigates.
SEMI's Dan Tracy expects 12.1% growth in equipment spending overall for the semiconductor manufacturing sector in 2011. SEMI projects 2011 semiconductor equipment sales to reach $44.33 billion, but not every sector will grow this year.
SUSS MicroTec unveiled MaskTrack Pro InSync, a holistic in-fab EUVL mask management product that synchronizes mask cleaning, handling, inspection, and storage.
Techcet's Michael A. Fury reports from busy aisles at Intersolar, and at SEMICON West where a private symposium by CEA Leti reviewed work in FDSOI, 3D integration, TSVs, silicon photonics, and MEMS for medicine.
Nigel Farrar, Cymer, provides a status report on EUV lithography source technology, extensions to ArF lithography, the laser crystallization process from the company's TCZ display equipment product division, and Cymer's newest DUV source product the OnPulse Plus data monitoring system.
Stanley T. Myers talks what moments stand out for him as "historic" advances in semiconductor fab and the evolution of SEMI. He also shares advice for young engineers entering the semiconductor industry.
Stefan Wurm, SEMATECH, discusses EUV lithography's infrastructure. Want milestones? The first EUV litho beta tools have been delivered, and now the motivation is increasing throughput and reducing defects.
At SEMICON West 2011, Phil Bryson, SEMATECH, covers the top challenges in semiconductor metrology at advanced nodes.
ASML has added three extensions to its Twinscan NXT 1950i tool, to improve imaging, overlay, and system throughput.
The TechXPOT session on Emerging Architectures for Logic and Memory provided a number of interesting perspectives on some of the big transitions in device technologies, which seem to be arriving at an ever-increasing pace, reports Olov Karlsson from Intermolecular.
The Conformal Film Deposition (CFD) suite of dielectric films consists of oxide, doped oxide and nitride films that are deposited below 450
Suss Microtec and imec are expanding a research collaboration in mask cleaning to develop an in-fab approach to EUV lithography mask integrity, aiming to develop a sophisticated approach to preserving mask integrity prior to exposure.
Applied Materials Inc. (AMAT) introduced a toolset for manufacturing low-power, fast interconnects in 22nm and lower logic chips: the Applied Producer Black Diamond 3 deposition system and Applied Producer Nanocure 3 UV curing system.
Applied Materials (AMAT) launched the Applied Centura Integrated Gate Stack system for creating gate dielectric structures in 22nm logic chips. It processes the entire high-k multilayer stack in a single vacuum environment, preserving integrity of film interfaces.
SEMI appointed Doug Neugold, ATMI, as Chairman of its International Board of Directors, serving his first term on the association's board. Following are all the appointments.
ATMI's SVP/CTO, Larry Dubois shares the 3 guidelines ATMI keeps in mind when designing eco materials for semiconductor wafer fab, and gives an update on the materials supplier's LED fab products.
A trio of analysts who participated in SEMICON West's Bulls/Bears panel have some top-takeaways list for the industry: why WFE spending is slow, why it's only a short pause, and which will comes first, EUV or 450mm.
Bob MacKnight, president and CEO of Crossing Automation, shares the semiconductor industry's top three cost-related hurdles when it comes to the 450mm wafer size transition -- particularly how automation will mesh with new tools.
ASM International's Bob Hollands discusses the challenges of making FinFET structures using both epitaxial and high-k/metal gate (HKMG) atomic layer deposition (ALD) processes.
CEA-Leti's Serge Tedesco and Didier Louis summarize key themes from the Sokudo lithography breakfast forum held last week at SEMICON West.
Franklin Kalk, Toppan Photomasks, covers the major lithography demands of distinct semiconductor technologies: Logic, Flash, and DRAM. He also gives an update on fabless/foundry options, and Japan's earthquake recovery.
Each market in which Edwards is a supplier -- semiconductors, flat panel, photovoltaics, LEDs, has its own cycles and technology requirements. Matthew Taylor, CEO of Edwards, discusses the needs and market personality of each sector.
SEMI is looking for presenters for technical sessions and other opportunities at SEMICON West 2012, July 10-12 in San Francisco, CA.
For the first time, Solid State Technology will co-present the Best of West product awards with SEMI at SEMICON West. Here are the details on how to enter. The entries period will close June 17th.
SEMICON West preview: Recent progress on developing printable conductive inks, flexible substrates, and associated continuous processes for making electronics means there's now an advancing infrastructure ready for the practical manufacture of disruptive new products.
Tom Hausken, Strategies Unlimited, shares insights on LED growth, the gap between MOCVD purchasing and utilization, and the global distribution of LED manufacturing.
Laurent Malier, CEO of Leti, described the research group's work and the outlook on fully depleted silicon on insulator (FDSOI), 3D packaging technologies, and integrated photonics on silicon.
Robert Newcomb from Qcept explains the two types of customers for inspection technology and their different needs: those on the leading edge who want yield improvements, and mainstream fabs seeking a better yield/cost mix on older processes.
Scott Zafiropoulo explains Ultratech's business and positioning strategies in an interview at SEMICON West, including how the company weathers market cyclicality and prepares for a 450mm wafer-size transition.
Post-22nm and below, the industry is going to fully depleted structures, either FinFETs or fully-depleted planar SOI (FDSOI), explains Soitec's Steve Longoria.
Gigaphoton expects to deliver an EUV source to ASML at the beginning of 2012. In the meantime, the company is focusing on throughput, conversion efficiency, and debris mitigation with its EUV source. Phil Alibrandi, director of sales at the company, summarized the activities taking place to support these efforts.
IC manufacturers are becoming more aggressive with strain engineering as they go from 28nm to more advanced nodes, explains Jeff Hebb, VP of laser product marketing at Ultratech. The company is working on a dual-beam laser-spike annealing to address requirements for 20nm and 14nm.
Doug Anberg, VP of advanced stepper technology at Ultratech, discusses the physics behind improvements in the company's new Sapphire 100E HB-LED tool in a video interview at SEMICON West 2011.
Syn: Robert Newcomb from Qcept Technologies discusses non-visual defects in today's wafer fab processes, at 22nm, and in the advanced nodes below 22nm. As nodes shrink, more defects will escape optical metrology, he predicts.
Leti's Serge Tedesco, lithography program manager, provides an update on the research group's 193 optical lithography program for 22nm and below, and exploration of multi e-beam lithography techniques.
The promise of photovoltaics (PV)to solve the world's energy problems as well as fuel semiconductor industry growthdrew overflow crowds to presentations on anything solar at SEMICON West 2007. This two-part series reports on a pair of keynotes headlining the conference that described opportunities and challenges for semiconductor manufacturers and suppliers in the solar market.
The MEMS DemoZone Display, presented by the MEMS Industry Group, will display MEMS products and suppliers at SEMICON West, showcasing the diversity, enabling capabilities, and nuances of MEMS technology.
Nordson ASYMTEK introduced the MH-910W automated workcell for film-frame wafer-level packaging applications, such as capping MEMS die and coating wafers prior to laser dicing.
Rasco GmbH, a Cohu Inc. (NASDAQ: COHU) subsidiary, added the Pressure Test Unit (PTU) and the Acoustic Test Unit (ATU) to its line of testers for MEMS ICs.
Tony McKie, GM of MEMSSTAR, tackles the question of how to make MEMS truly manufacturable. "Nobody builds a MEMS manufacturing line anymore," says McKie.
SEMICON West preview: Rapid growth in mainstream consumer markets is changing the structure of the MEMS industry from an artisanal to a volume manufacturing business -- creating a new set of challenges and opportunities to companies to find better ways to speed the production ramp, find better ways to integrate multiple die and software, and to find the right business models.
Alchimer S.A., a provider of nanometric deposition technology for through-silicon vias (TSV), semiconductor interconnects, and other electronic applications, announced that Panasonic Corporation (NYSE: PC) has become an equity investor in the company.
Paula Doe, SEMI Emerging Markets, covers developments at Applied Materials, Coventor, and other members of the MEMS equipment supply chain that will make MEMS less expensive, smaller, and easier to manufacture.
Paula Doe, SEMI Emerging Markets, shares the annual guide for navigating the MEMS events at SEMICON West, July 10-12 at Moscone Center in San Francisco, CA.
A note from Karen Sevala, president, SEMI Americas.
At SEMICON West 2013, Boston Semi Equipment (BSE), LLC announced the expansion of its semiconductor front end and back end equipment businesses in Tempe, Ariz. into a new and larger facility.
Solid State Technology and SEMI announced the recipient of the 2013 “Best of West” Award — Mentor Graphics — for its Tessent TestKompress with Cell-Aware ATPG.
Bruce Kim, CEO of SurplusGLOBAL, expects a slight upturn in the Asian Secondary Semiconductor Equipment Market at Semicon West.
cyberTECHNOLOGIES GmbH announced the addition of White-Light Interferometry (WLI) to its suite of production-proven CT SERIES non-contact surface metrology systems at SEMICON West 2013.
SEMICON Taiwan is set to open in September amidst an improving global and regional outlook for 2013 and 2014 that sees Taiwan remaining the largest and strongest market for semiconductor manufacturing.
Coventor, Inc., a supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), shared the SEMulator3D 2013 software platform at SEMICON West 2013.
Dr. Tedesco suggested that an “optical forever” solution using 193nm immersion lithography in combination with a pitch-multiplication strategy could well provide lithography solutions to very advanced nodes on the industry’s technology roadmap.
SEMI honored 14 industry leaders for their outstanding accomplishments in developing standards for the microelectronics and related industries. The SEMI Standards awards were announced at a reception held during SEMICON West 2013.
Project targets more efficient 3D TSV integration and covalent bonding at room temperature
At SEMICON West 2013, Element Six today announced it has expanded its global manufacturing capabilities of microwave chemical vapor deposition (CVD) synthetic diamond by 60 percent compared to last year.
Dow Corning announced Monday that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics.
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved strong revenue growth and expanded its headcount for the first half of 2013.
SEMICON West 2013 included a robust set of technical and marketing presentations on the general theme of developing new semiconductor devices in the session “Lab to Fab: From R&D to High Volume Manufacturing” held 1:30-3:30PM on July 9.
When Ajit Manocha, GlobalFoundries CEO, polled his audience during his keynote address on Tuesday at SEMICON West 2013, nearly 60 percent of the audience believed that the biggest challenge facing the semiconductor industry was the economy. However, during his presentation, Manocha seemed to suggest otherwise.
Leaders of research consortia from around the world sat down to share updates and insights with SEMICON West attendees on Wednesday morning.
In the afternoon of the last day of SEMICON/West 2013, a session was devoted to updates from the International Technology Roadmap for Semiconductors (ITRS) Front End of Line Technologies.
SEMATECH's Mark Neisser provided a sobering overview of the challenges associated with extending Lithography technology to pattern device structures below a half-pitch of 20nm.
Following last week’s formal announcement from Governor Cuomo of the formation of the Facility 450 Consortium (F450C), ten leading nanoelectronics facility companies from around the world will collaborate at CNSE to lead the global effort to design and build the next-generation 450mm computer chip fabrication facilities.
SEMI today announced that Ajit Manocha, CEO of GLOBALFOUNDRIES, has been selected to receive the “SEMI Outstanding EHS Achievement Award — Inspired by Akira Inoue.”
Developers have made major progress in the technology to manufacture printed or flexible circuits, sensors, batteries and displays. But frankly it’s been hard to build applications with much market pull without logic or memory as well, and those have been much harder to make.
Europe’s recently launched industrial strategy to reinforce micro- and nanoelectronics manufacturing is more than just a vision — it’s a major opportunity for equipment and material suppliers to participate to large-scale investment projects, increase their holding in key technologies and reach out to new customers and markets.
New method allows IC manufacturers to reach scaling levels at 20nm and beyond, without compromising speed and device cross-talk.
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the latest version of its EVG40NT automated measurement system.
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about an ASML presentation from Semicon West. This is a follow up to a previous post: "Dimensional Scaling and the SRAM Bit-Cell."