Xilinx Inc. (Nasdaq:XLNX) began shipping its Virtex-7 2000T field programmable gate array (FPGA), a programmable logic device with 6.8 billion transistors: 2 million logic cells, a die-stack architecture, low power consumption, and a more flexible design than large ASICS and monolithic FPGAs.
Nanotech accelerator SVTC Technologies, wet chem equipment maker Amerimade Technology, and chemicals company Shanghai Sinyang Semiconductor Materials will collaborate on electroplating processes for TSV that are production-ready for advanced packages and MEMS.
ERS uncrated the ERS AirCool 3 wafer thermal test system with modular options and easy integration into all major wafer prober systems.
Tamar Technology shipped its first fully automated WaferScan system to a major semiconductor fab. The system performs TSV etch depth, deep trench depth, wafer thickness, photo-resist thickness, and hole diameter metrology.
Samsung Electronics began producing embedded multi-chip package (eMCP) memory for use in entry- to mid-level smartphones. The products use low power double-data-rate 2 (LPDDR2) 30nm DRAM and 20nm NAND flash memory.
Mitsubishi Heavy Industries launched a fully automated 12" (300mm) wafer bonding tool, Bond Meister MWB-12-ST, capable of producing 3D LSI circuits at room temperature. The 300mm bonder targets production of memory chips and MPUs.
JEDEC Solid State Technology Association released a new standard for wide I/O mobile DRAM: JESD229 Wide I/O Single Data Rate. Wide I/O mobile DRAM increases die integration -- stacking chips with TSV interconnects with a SoC -- and improves bandwidth, latency, power, weight, and form factor.
Haruo Matsuno, president and CEO of Advantest Corporation (TSE:6857, NYSE:ATE) shares the company's major goals, including expansion into new measurement applications, utilization of cloud computing, and more.
With many advanced packaging processes taking place on the semiconductor wafer, the traditional supply chain of front-end fab at the foundry and back-end fab at the packaging and test house is falling apart. The ConFab session,
Rudolph Technologies Inc. will deliver 14 NSX Series 320 inspection systems to a large outsourced semiconductor assembly and test (OSAT) provider.
Mitsubishi Electric Corporation developed a prototype forced-air-cooled three-phase 400V output inverter with all-silicon carbide (SiC) power modules and direct lead bonding that has a power density of 50kVA per liter.
Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds.
Rudolph Technologies (NASDAQ:RTEC) delivered the first MetaPULSE metrology system to measure under bump metallization (UBM) and redistribution layers (RDL) in advanced package manufacturing.
X-FAB Silicon Foundries, a More-than-Moore semiconductor foundry, has used SFT's R3D (Resistive 3D) software for its 0.18
The USPTO is looking to increase the diversity of honorees for its annual National Medal of Technology and Innovation (NMTI), honoring "this nation's creative geniuses."
Are we closer than we think to our needed mass production costs for silicon interposers? Phil Garrou gleans some insights from the year-ending RTI Architectures for Semiconductor Integration and Packaging conference.
Singapore's Institute of Microelectronics (IME) has launched a new multiproject wafer service for 2.5D through-silicon interposers, to provide a cost-effective platform for R&D prototyping and proof-of-concept in the technology.
Tezzaron Semiconductor has licensed patents regarding Ziptronix's direct bonding technologies, "direct bond interconnect" (DBI) and "direct oxide bonding (ZiBond), for use in 3D memory.
Dr. Phil Garrou reports from the 2nd annual Georgia Tech 2.5D Interposer Conference: what's the market projection for silicon and glass interposers, what's preventing high-volume manufacturing, and is there a crossover with flat-panel display glass manufacturing?
Alchimer SA says it is seeking partnerships with various semiconductor equipment and materials companies as it welcomes two top execs: Bruno Morel is the company's CEO since May of this year, and product development director Fr
Deca Technologies has introduced a new chip-scale packaging (CSP) product line for applications where its existing wafer-level CSP option isn't a good fit. Details and analysis to come.
LTX-Credence Corporation (Nasdaq:LTXC) released the Diamondx test platform for ASSP and the DragonRF for RF device test. In addition, LTX-Credence launched a SerDes test instrument and new testing software.
TEL will acquire semiconductor packaging equipment supplier NEXX Systems. NEXX makes advanced deposition equipment, including ECD and PVD tools, for wafer-level packaging (WLP).
Lockheed Martin scientists have developed a new "nanotechnology" copper-based solder that it says will produce joints with up to 10
With the approach of full commercial production of 3DIC products, Dr. Phil Garrou shifts his attention to thermal performance questions and proposed thermal solutions for the future.
Fraunhofer IZM's All Silicon System Integration Dresden (ASSID) center will add SPTS' etch and PECVD process capabilities to investigate low-temperature dielectric films for through-silicon vias (TSV) in 3D IC packaging.
The advent of leading-edge semiconductor packaging technologies dictates efficient use of capital, and only the top-tier semiconductor assembly and test services (SATS) companies will have the financial wherewithal to develop required expertise and capacity, says one analyst.
Nanium says it has shipped its 200 millionth embedded wafer-level ball grid array technology (eWLB) component, a 10% year-over-year productivity increase that reflects full conversion to the company's eWLB overmold technology that allows thinner and more robust packages.
Tessera Technologies is giving CEO Robert A. Young a big financial incentive to spin off one of its two businesses by March 2015, one of the company's key long-term strategic goals.
Researchers at the Karlsruhe Institute of Technology (KIT) say they have developed a novel optical connection process for semiconductors using "photonic wire bonding" that achieves data transmission rates of several Tbit/sec.
SPTS' Delta fxP cluster system achieves low-temperature deposition of TEOS oxides and nitrides for via-reveal passivation in 3D IC packaging, solving two key problems of low temperatures and bonding adhesive outgassing.
An unidentified "premier global industry research center in Asia" will use Rudolph Technologies' MetaPulse G metrology system in its advanced packaging process development activities.
Backside-illuminated image sensors require more precise wafer processing -- uniform extreme wafer thinning, dopant control, epitaxy growth, trench manipulation, etc. -- but the payoff in image quality is significant. Researchers at imec experimented with different wafer fab technologies to make a record BSI sensor. They also consider new architectures/packaging techniques for this technology.
Deca Technologies, a new company backed by Cypress Semiconductor and SunPower, will combine solar wafer manufacturing methods with semiconductor manufacturing support to create wafer-level chipscale packaging (WLCSP) derivatives.
Using the advanced through-silicon via (TSV) fabrication process at IBM (NYSE:IBM), Micron Technology Inc. (NASDAQ:MU) will begin producing its Hybrid Memory Cube. The companies claim that this is the first CMOS design to go commercial with TSV interconnects.
The Institute of Microelectronics, a research institute of Singapore's A*STAR, plans to commercialize key innovations in silicon photonic chips designed to support high-speed, high-bandwidth optical communications.
Citing rising demand and a potential industry shortage, NeoPhotonics is in the process of more than doubling its production capacity of narrow linewidth tunable lasers with minimal expected additional capital expenditures.
At the 22nm node, die fragility and challenging interconnect materials will necessitate foundry collaborations with packaging houses, co-designing silicon and package, asserts E. Jan Vardaman, TechSearch International.
The Hybrid Memory Cube Consortium released the initial draft of the Hybrid Memory Cube (HMC) interface specification, with the final version planned for end of 2012.
Heavy monsoons moving through the Philippines are causing floods in and around Manila, the capital. The Philippines is a small but growing area for microelectronics manufacturing and packaging facilities.
Tektronix Component Solutions, a custom microelectronics services provider, tapped supply chain aggregator MOSIS to help its customers develop complete, high-performance ASICs with lower early-stage ASIC development costs.
Agilent debuted its compliance test application, Agilent N6462A DDR4, for systems using DDR4 memory.
SEMI's Collaborative Alliance for Semiconductor Test released a Docking and Mounting Generic Terminology Guideline document that can be used to improve the
ULIS invested EUR20 million in a new state-of-the-art facility to meet increasing market demands for IR technology, with a move to 200mm wafers and pixel/wafer-level packaging techniques.
USHIO Inc. is introducing the large-field stepper lithography tool
Xilinx will invest $50 million to expand its electronics engineering operations, located at the company
Solid State Technology is hosting 3D and 2.5D Integration: A Status Report, sponsored by EVG and ALLVIA, and is free for all attendees. This preview shares a sneak peek at
Solid State Technology is hosting a free webcast, 3D and 2.5D Integration: A Status Report. A fourth presenter has just been announced, Brent Przybus, Senior Director, Product Line Marketing, Xilinx Inc.
Solid State Technology will present 3D and 2.5D Integration: A Status Report on June 27, free for all attendees. William Chen, ASE, will join speakers David McCann, GLOBALFOUNDRIES and E. Jan Vardaman, TechSearch International.
The Full Service Foundry business unit of ams extended its dedicated test solutions for foundry customers, offering known good die (KGD), with customers' complex analog/mixed-signal ICs 100% electrically tested according to their own test specification.
Day 3 of the 15th IITC (International Interconnect Technology Conference) opened in San Jose, CA under clear sunny skies and a pleasant breeze. The herd thinned a bit, down to ~150 hearty souls from the original 230 the prior two days.
Imec and PVA Tepla say they have achieved void detection in through-silicon vias at wafer level, after TSV copper plating, thanks to a nondestructive high-frequency scanning acoustic microscopy (SAM) technique.
Novati Technologies Inc. has licensed Ziptronix's direct bonding technologies, "direct bond interconnect" (DBI) and "direct oxide bonding (ZiBond), to offer 3D stacking services and test to customers.
Ultratech, lithography and laser-processing system supplier to semiconductor manufacturers and packaging providers, added Michael C. Child to its Board of Directors. Child served on Ultratech
MOSAID Technologies Inc. is sampling a 16-die stack NAND Flash device operating on a single high-performance channel, the 5126Gb HLNAND.
Bruker Corporation acquired all of the shares of SkyScan NV, a scientific instruments company serving materials science and life sciences/pre-clinical imaging needs.
SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.
Semiconductor lead times decreased at the end of February 2012, reports analyst firm Gartner Inc. Although Gartner still expects the semiconductor industry to grow in 2012, Q1 showed some signs of softness.
Spansion Inc. (NYSE:CODE) and SK Hynix formed an alliance to deliver Spansion SLC NAND Flash products at the 4x, 3x, and 2x nodes to the embedded market. Spansion is known as a NOR Flash memory provider.
The Semiconductor Industry Association (SIA) measured worldwide semiconductor sales at $22.9 billion in February 2012, down 1.3% from January’s $23.2 billion and 7.3% from February 2011.
The global semiconductor materials -- wafer fabrication and packaging materials -- market increased 7% in 2011 compared to 2010, with record revenues of $47.86 billion, said SEMI.
Sterne Agee analyzes top analog semiconductor companies and the analog sector as a whole. Demand is stable (industrial, automotive) to improving (computing), and distributor inventories are low.
Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.
Qualcomm Incorporated (NASDAQ:QCOM) will establish an integrated circuit (IC) design and engineering R&D center in Singapore.
The worldwide semiconductor foundry market totaled $29.8 billion in 2011, a 5.1% increase from 2010, according to Gartner. Given aggressive foundry spending in 2010 and 2011, oversupply was "inevitable," Gartner says.
Kopin Corporation achieved record 1290cm2/V.s electron mobility and 240ohms/square sheet resistance results from GaN-based high electron mobility transistor (HEMT) materials.
Rice University is developing transparent, flexible memory devices based on silicon oxide, enabling future consumer applications with flexible touchscreens, transparent batteries, see-through ICs, and more.
The Global Semiconductor Alliance (GSA) released its GSA Q1 Wafer Fabrication & Back-End Pricing Reports, tracking fab utilization rates, wafer and mask costs, and package pricing.
In its report, "RF filters, PAs, Antenna Switches & Tunability for Cellular Handsets," Yole Développement notes that new technologies are changing the power amplifier sector. PAs are strategic RF components in cell phones.
Himax Technologies placed a repeat order for an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EVG.
Applied Materials will host its annual Analyst meeting this week (March 28). Barclays Capital shares its expectations for AMAT's update and the wafer fab equipment (WFE) outlook in general.
At the recent Common Platform Technology Forum -- produced by Global Foundries, Samsung and IBM -- Simon Segars, executive vice president and general manager of the physical IP division at ARM, spoke about the impact of the internet of things and mobile computing on the way electronics are designed and used.
The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.
Handset products dominate compound semiconductor revenue, but microelectronics companies focus development on high-performance, high-frequency applications where volumes are lower and products are differentiated by performance, reports Strategy Analytics.
JP Sercel Associates, Inc. (JPSA) expanded its Ultrafast processing capabilities, using Pico-second lasers with innovative laser beam delivery techniques.
Novellus debuted the VECTOR Strata dielectric deposition tool for high-volume VIM Flash manufacturing. VECTOR Strata aims for ultra-smooth films with exceptional defect performance, enabling in-situ deposition of the alternating silicon-based layers used in the formation of the VIM structure.
The electronics industry will edge out coal-fired boilers as the biggest purchaser of ultrapure water systems and consumables in 2012, according to the McIlvaine report: Ultrapure Water World Markets.
EVG uncrated the EVG620HBL Gen II fully automated mask alignment system for volume LED manufacturing. The second generation tool offers 55% higher wafer output per square meter of cleanroom space occupied, EVG reports.
Worldwide silicon wafer revenues improved 2% YOY, shows the SEMI Silicon Manufacturers Group. Worldwide silicon wafer area shipments, however, decreased 3%, indicating a loss of momentum in H2 2011, said Kazuyo Heinink, SEMI SMG.
Veeco Instruments (Nasdaq:VECO) reported 3 wins for its TurboDisc K465i GaN MOCVD tool : the same systems will be used for high-volume LED fab, GaN-on-Si research, and Si-based LED development.
Gigaphoton uncrated the GT63A next-generation ArF excimer laser for multi-patterning immersion lithography scanners.
The SIA shows 2011 worldwide semiconductor sales hit $299.5 billion, a 0.4% year-on-year increase and new record. Semico Research's forecast for 2012 shows a 10.11% growth in semiconductors revenues over 2011. Barclays Capital and Strategy Analytics also weigh in.
Micron Technology Inc. (Nasdaq:MU) long-time CEO and chairman Steve Appleton passed away. MU named Mark Durcan, Micron president and COO, to fill the vacant CEO post, and serve on the Board.
Tokyo Electron Ltd. (TEL) restructured its organization, with a new "Organic EL Division" established under GM Takeshi Okubo, as well as other new and consolidating subsidiaries in the semiconductor and liquid crystal production segments.
AMD's (NYSE:AMD) new president and CEO Rory P. Read detailed what he called an "ambidextrous" strategy for the company, building on its x86 and graphics IP while incorporating other technologies and IP for differentiation in the electronics marketplace.
Consumer electronics devices are shifting from specific functions to multiple functions and Internet connectivity, creating an overlap of features and functions between product categories not only in the mobile segment, but also in other CE devices like digital TVs and set top boxes. This entire category is morphing into a larger "smart devices" grouping.
Propelled by the appeal of Apple Inc.’s iPhone and iPad, the wireless communications sphere surpassed computers to lead all segments in semiconductor-related spending among top OEMs in 2011.
James Word and Christian Zunia, Mentor Graphics, explore the current capabilities of model-based OPC software to model and correct for the shadowing distortions unique to extreme ultra-violet lithography (EUVL).
University of Texas at Austin researchers demonstrated high-quality, wafer-scale graphene deposition on evaporated copper films, using an AIXTRON cold-wall vertical BM (Black Magic) Pro reactor.
SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.
CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its CVD and gas control equipment assembly, and unifying its nano-materials lab.
Dongbu HiTek named Dr. Chang-Sik Choi, former EVP of Samsung Electronics, as its president and CEO and Chan-Hee Lee, former EVP of MagnaChip Semiconductor, as president of its foundry business.
European researchers have manufactured defect-free structures of different semiconductors on silicon wafers, using semiconductor manufacturing processes.
The global market for power semiconductors used in LED lighting is forecast to reach over $3 billion in 2016. LED lighting systems require complex electronics, IMS Research notes.
AIXTRON's training and demonstration center in Suzhou, China, will focus on improving MOCVD in advanced semiconductor and LED manufacturing operations around China, as well as on employee and environmental safety in electronics production environments.
Infineon Technologies ordered the Probus-SiC epitaxy film growth tool from TEL for mass production of advanced SiC power devices.
3M is investing in research and manufacturing of novel silicon (Si) based battery anode materials, for mobile electronics and electric vehicles.
VLSIresearch released its 2011 Top Semiconductor Equipment suppliers rankings, noting important acquisitions and strong spending in lithography tools in 2011. Semiconductor equipment spending was driven by aggressive capacity expansion in the foundry and logic sectors.
Execs from Samsung, IBM, GlobalFoundries and ARM looked to the future at The Common Technology Platform Forum in Santa Clara. They focused on the innovation pipeline for 20nm and 14nm technology nodes, and the role that EUV, FinFETs, TSVs, CNTs and DSA will play.
SAFC Hitech opened a multi-million dollar 270000sq.ft. expansion at its facility in Kaohsiung, Taiwan, increasing capacity for high-quality LED precursor production.
As products using gallium nitride (GaN) technology continue to gain acceptance in military and commercial applications, development activities at microelectronics companies are accelerating.
TI opened a CA-based research lab for analog and mixed-signal circuits, tapping into local universities for a portion of the research. SMIC is teaming with Brite Semiconductor and Zhejiang University for an IC research program in China. Both aim to develop a "home-grown" and dynamic semiconductor industry workforce.
MATHESON debuted the Lasso System, a customer-centric supply chain and inventory management system that can monitor the location and operating status of gas products and other assets in the REAL-Time Gas and Asset Management System.
Japan's NAND flash memory supplier Toshiba rapidly rebounded from the devastating Great East Japan earthquake and tsunami that hit one year ago this week, says IHS, thanks to fortunate fab location, quick wafer supply replenishment, and strong demand.
Twin Creeks Technologies, semiconductor and solar cell manufacturing equipment supplier, debuted its first commercial silicon wafer production system that reduces solar module and semiconductor device wafers by up to 90%.
Riber, MBE tool supplier will work with imec on epitaxy process technologies for next-generation III-V semiconductor CMOS devices.
SemiSouth Laboratories Inc., high-voltage silicon-carbide (SiC) semiconductor device manufacturer, launched its second major capacity expansion within 18 months.
RASIRC determined that a new wet thermal oxidation process on a RASIRC Steamer enables 87% better wafer throughput than dry oxidation of uniform thin oxides.
Worldwide sales of semiconductor manufacturing equipment totaled $43.53 billion in 2011, representing a year-over-year increase of 9%, shows SEMI. North America surpassed Taiwan as the region with the highest amount of spending.
Worldwide semiconductor revenue is projected to total $316 billion in 2012, a 4% increase from 2011, according to Gartner Inc. This outlook is up from Gartner's previous forecast, made in Q4 2011, for 2.2% growth.
The Global Semiconductor Alliance (GSA), global semiconductor industry association, appointed Ajit Manocha, CEO of GLOBALFOUNDRIES, to its board of directors.
Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the second day: OLED TFT displays, single transistor DRAMs, silicon photonic wires, CNTs, 3D optical interconnects, graphene for RF and sensing, transparent ZnO, epidermal electronic systems, stretchable electronics, ultra-low-k dielectrics, patterning of electroceramics, PRAM (an alternative to NRAM), and inkjet printing of superconducting films.
Edwards Limited uncrated the STP-iXR1606 series magnetically-levitated turbo-molecular pumps (TMP) with fully integrated onboard controllers. Its new rotary design improves throughput by about 40% at high gas flow rates; nearly 90% percent in maximum gas flow.
The 2012 Symposia on VLSI Technology and Circuits, this June in Honolulu, HI, will foster joint interactions among device technologists and circuit/system designers with overlapping technical programs of both symposia, and joint focus sessions on important topics.
centrotherm thermal solutions, a semiconductor-manufacturing-focused subsidiary of centrotherm photovoltaics AG, joined the SEMATECH Front End Processes (FEP) program, and will work with SEMATECH to develop low-temperature processing techniques for next-generation logic and memory devices.
Semiconductor Manufacturing International Corporation (SMIC, NYSE:SMI, SEHK:981) revised upward its first quarter revenue and gross margin guidance for the three months ended March 31, 2012.
Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco, describing recent work with graphene, organic electrochemical transistors, pentacene organic TFTs, and functional inks made of CNTs and other nanomaterials.
Barclays Capital compiled its 2011 analysis of semiconductor wafer fab equipment (WFE) spending, with a look at the top players and underlying trends by process step.
Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse looks at the growth areas for test.
Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse considers the rebound in process control due to weak yields at smaller chip nodes.
Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse separates the rising and declining styles of deposition.
TSMC (TWSE: 2330, NYSE:TSM) began Phase 5 of its Fab 14 GigaFab at the South Taiwan Science Park in Tainan, planned to be a “key production center” for advanced 20nm semiconductor chips.
Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse looks at trends in wafer cleaning, such as single wafer and bevel clean.
Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse explains changes at the etch step.
Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by step. Barclays looks at the possibilities for ion implant.
Barclays Capital compiled its 2011 analysis of semiconductor wafer fab equipment spending, with a look at the top players and underlying trends by process step. Here, Barclays’ CJ Muse considers lithography’s current state and future.
Barclays Capital looks at wafer fab equipment trends in 2011, based on Gartner data. Top 5 takeaways? The top 5 vendors continue to gain market share, Intel is a key customer, segment-leading vendors strengthened their holds, intensity edged higher, and changes are in store in 2012.
Since Elpida Memory filed for bankruptcy protection, reported bidders have included Micron, Hynix, and Toshiba, and now private equity firms TPG Capital and Hony Capital. CJ Muse of Barclay Capital shares the likely and unlikely scenarios for Elpida, and how these will affect DRAM overall.
Analog Devices Inc. (NASDAQ:ADI) honored 14 companies with the 11th Annual “Supplier Excellence Awards,” selected from among the more than 2,000 companies that contribute to ADI’s global semiconductor manufacturing operations.
The Optical Systems Division of Zygo Corporation recorded a $2+ million order from a major semiconductor manufacturer to produce EUV optics for advanced lithography.
Tanaka Kikinzoku Kogyo K.K. developed a platinum electrode that produces ozone solution at 40x the efficiency of existing technology.
Worldwide HDD unit shipments experienced a year-over-year decline of 4.5% in 2011. Efforts to clean and repair flooded HDD factory buildings and equipment will take most of H1 2012. HDD and HDD component production should return to pre-flood output levels in H2, reports IDC.
The top 10 and top 25 semiconductor suppliers registered 7% and 4% growth, respectively. However, 15 of the top 25 semiconductor sales leaders posted negative results in 2011. Only 9 of the top 25 suppliers outperformed the total worldwide semiconductor industry 2011/2010 growth rate.
Flow processor developer Netronome extended its strategic relationship with Intel Corp., manufacturing its next-generation Netronome flow processors (NFP) using Intel’s 22nm tri-gate transistor architecture.
Power electronics will grow to $15 billion in sales of discrete components in 2020, says Lux Research. New materials -- SiC and GaN -- are taking a 22% market share for $3.3B in sales. Expect this year to set a record for funding to power electronics companies.
The top-5 most commonly counterfeit components (based on reported cases) are analog ICs, microprocessors, memory ICs, programmable logic devices, and transistors, shows IHS.
Osaka University’s Photonics Advanced Research Center in Japan installed a NanoInk NanoFabrication Systems DPN 5000 System for patterning various materials with nanoscale accuracy and precision. Osaka University scientists will develop and fabricate nanoscale plasmonic and nanophotonics devices.
Metrology tool supplier Nova Measuring Instruments Ltd. (NASDAQ:NVMI) will provide the production tools of record performing CMP metrology at a leading foundry.
Core Wafer Systems, subsidiary of Action Products International, upgraded its PDQ-WLR on-wafer accelerated reliability product line to version 7.0, designed specifically for Agilent Technologies' Parametric Testers.
North America-based manufacturers of semiconductor equipment posted $1.16 billion in orders in December 2011, $1.32 billion in billings, and a book-to-bill ratio of 0.88, according to SEMI. The book-to-bill ratio has been climbing since September 2011. In December, bookings climbed back above the $1 billion mark.
IMS Nanofabrication, Dai Nippon Printing Co., Ltd. (DNP), Intel Corporation, and Photronics Inc. are commencing a joint electron multi‐beam mask writer tool collaboration.
Intel plans $12.5 billion semiconductor capital expeditures in 2012; Samsung plans $12.2 billion. Watch for wide and growing separation between these two companies and their competition, says IC Insights.
Tanaka Kikinzoku Kogyo K.K. developed a ruthenium material able to form a film up to 6x the normal depth for capacitor electrodes used in DRAM, working with Professor Seiji Ogo of Kyushu University.
2011 was a big year for M&A in the mobile device semiconductor market, from Intel’s acquisition of Infineon Technologies AG Wireless Solutions, Qualcomm's Atheros buy, to NVIDIA’s purchase of Icera. Despite all the M&A activity, however, the market is still projected to remain relatively flat.
USCi will develop next-generation silicon carbide (SiC) devices with AIXTRON SE's VP2400 hot-wall CVD tool. USCi plans to install the CVD system in Q3 2012.
KLA-Tencor Corporation launched 3 semiconductor wafer defect inspection systems: the 2900, Puma 9650, and eS800 series. The suite is tailored to detect defects arising from new materials, device structures, and design rules.
Expertech's Compact Thermal Reactor was ordered by a US semiconductor foundry to bolster 200mm wafer capacity. The CTR offers processes for atmospheric and LPCVD, including hydrogen and high-temperature wafer processing.
Air Liquide Electronics completed a series of expansions at its ALOHA manufacturing sites in the US, France and Japan, doubling its advanced precursor production capacity for semiconductor manufacturing applications.
Hine Automation shipped its Star SL-300 single-substrate vacuum transfer system to Annealsys, which will integrate the wafer transfer system onto its MC-200 MOCVD tool for R&D and pilot environments.
Researchers at INCDTIM in Romania will use NanoInk's NanoFabrication Systems Division's DPN 5000 system for supramolecular structure fabrication, molecular recognition and self-assembling process applications.
Michael A. Fury, Ph.D., Techcet Group, reports from SEMI’s International Semiconductor Strategy meeting, with a closing day focused on innovation and new applications.
SEMI presented its annual SEMI Award for North America to QD Vision. QD Vision team members made significant progress on the integration and manufacturing processes essential to the commercialization of quantum dot (QD) technology.
36% of semiconductor fabs are in high-risk zones, finds Semico, noting the industry disruptions caused by the Japan earthquake and tsunami and Thai flooding and the challenges these presented to chip makers in the regions.
Day 2 of SEMI’s Industry Strategy Symposium (ISS) 2012 included talks by Mike Splinter of Applied Materials, Mark Thirsk of Linx Consulting, Tim Hendry of Intel, David Lazovsky of Intermolecular, a panel session on could computing run by Harvey Frye of TEL, Handel Jones of IBS and another panel session focused on 450mm, moderated by G. Dan Hutcheson of VLSI Research. Michael A. Fury of Techcet reports.
After attending SPIE Advanced Lithography, Barclays Capital came away with a lower lithography tool shipments forecast, more hope for EUV lithography, and expectations of a litho buying spree at Intel.
The ConFab's second-day keynote will be "Smart Society, the Sensing Era and Signal Chain" presented by Ali Sebt, CEO of Renesas Electronics America.
Lita Shon-Roy and Michael Fury, PhD, Techcet will present "CMP Market Outlook & New Technology - Dynamic Slurry Metrology," a free webinar at 2 times on February 22.
Brewer Science uncrated the next generation of its OptiStack system of patterning products for semiconductor manufacturing, targeting emerging and existing lithography processes.
Tokyo Electron Ltd. (TEL) will join research organization CEA-Leti's IMAGINE open, collaborative industrial program on advanced lithography for semiconductor manufacturing.
Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufacturing fabs, pilot lines, and major R&D organizations.
RAVE N.P. Inc. established a new division, Advanced Technical Instruments or ATI, comprising SEM, AFM, and other analysis tools, as well as custom semiconductor and photomask services such as haze generation systems.
Lithography light source maker Gigaphoton, Inc. achieved 7W of extreme ultra violet (EUV) power on its mass-production laser-produced plasma (LPP) light source, scheduled to be shipped in 2012.
Chih-Yuan (C. Y.) Lu, a semiconductor engineer, scientist, and entrepreneur in Taiwan, is being honored by IEEE with the 2012 IEEE Frederik Philips Award.
Pixelligent and Brewer Science Inc. developed a spin-on hardmask technology for advanced lithography, combining nanocrystal and microelectronic coating technologies.
The eBeam Initiative, a forum for new IC manufacturing approaches based on electron beam (e-beam) lithography, will unveil its latest roadmap at the SPIE Advanced Lithography Symposium.
ASML's Brion Technologies debuted Tachyon Flexible Mask Optimization, which enables use of multiple OPC techniques in a single mask tapeout for 2Xnm lithography.
Tektronix donated semiconductor test and measurement equipment to Washington State University Vancouver: arbitrary/function generations, a real-time spectrum analyzer, digital phosphor and mixed signal oscilloscopes, Keithley's semiconductor parameter analyzers, and Fluke's True-rms multimeters.
CEA-Leti reports that the MAPPER Lithography massively parallel direct write technology resolves 22nm dense lines and spaces and 22nm dense contact holes in positive chemically amplified resist. The maskless lithography tech meets semiconductor requirements for 14nm and 10nm logic nodes.
The March 2012 issue of Solid State Technology will feature "450mm wafer transition" from Dr. Brian Trafas, chief marketing officer at KLA-Tencor. The following is a sneak preview of Dr. Trafas' article.
IC Insights forecasts 7% growth for the total IC industry in 2012. 27 of the 33 major IC product categories will experience growth in 2012. 11 will grow faster than 7%. 6 will show double-digit growth.
imec successfully implemented a 300mm directed self-assembly (DSA) semiconductor manufacturing process line in its fab, with TEL equipment, AZ Electronic Materials consummables, and research from the University of Wisconsin.
SEMATECH authors discuss semiconductor metrology solutions currently being investigated to address the challenges of future nodes. FinFETs raise new metrology complexities, as the entire 3D structure becomes critical for process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts.
FlexTech Alliance awarded its 2012 FLEXI Awards for flexible, printed electronics and displays industry to PARC and Thin Film Electronics, Western Michigan University, and the Georgia Institute of Technology.
Theta Delta will incorporate Core Wafer Systems technologies into its burn-in test and long-term reliability test systems for semiconductors. Core Wafer Systems provides parallel measurement schema for semiconductor test.
The economic outlook for the world is dismal, the semiconductor industry has consolidated and matured to the point where it’s looking for tips from the automotive industry, and unprecedented challenges must be overcome to stay on the path defined by Moore’s Law. Duncan Meldrum of IHS provides a top ten list of economic trends to watch in 2012.
The Industry Strategy Symposium (ISS) kicked off today in Half Moon Bay, CA under blustery skies with choppy seas, an apt metaphor for the information about to be shared inside, says blogger Michael A. Fury, Techcet.
NAND flash memories are scaling below 2Xnm process nodes and bit errors are increasing. Research and Markets sees this as the reason for Apple buying Anobit Technologies and Micron buying Storage Genetics (both startups were developing advanced ECC and signal processing technologies).
The Organic Electronics Association released its "OE-A Roadmap for Organic and Printed Electronics," covering application clusters such as flexible displays and smart systems, as well as the outlook on materials, substrates, and patterning processes.
Taiwan became the region with the largest share of installed wafer capacity in 2011, according to IC Insights' Global Wafer Capacity 2011-12 report. This is the first time Taiwan has led the global wafer capacity rankings, with 21% of total in mid-2011.
Wuhan National Laboratory for Optoelectronics at the Huazhong University of Science and Technology (Wuhan, China) has signed off its Vistec Lithography electron-beam lithography system Vistec EBPG5000pES.
For the first time, Apple Inc. has publicly published a list of over 150 companies that the electronics giant says represent 97% of its procurement expenditures for materials, manufacturing, and assembly of products worldwide.
Renesas Electronics America Inc. named Ali Sebt, who has served 20 years at the company, as its new president and CEO. Sebt succeeds the retiring Daniel Mahoney.
The dynamic random access memory (DRAM) market is encountering an "alarming" rise in inventory, low capex, and reduced demand from end-market applications, show analysts from IHS iSuppli, Deutsche Bank, and Barclays Capital.
IBM Research demonstrated the ability to store information in as few as 12 magnetic atoms, 100-10,000x less than today's information storage technologies.
Semiconductor sales were weaker than expected in Q3 2011, and Q4 shows weak guidance, prompting chip makers to reduce production. Gartner expects this inventory correction to work out in early 2012.
Intel's Paul Otellini spoke at the International CES in Las Vegas, providing information on Intel's smartphone moves and ultrabook momentum, and debuting the 32nm Intel Atom SoC for tablets and hybrids.
Ramtron International Corporation shipped 50,000 initial low-energy, custom, nonvolatile ferroelectric random access memory (F-RAM) devices built on its new IBM manufacturing line in Burlington, VT.
Former SEMI president and CEO Stanley T. Myers was named a director emeritus of the association by itsl Board of Directors. Myers led SEMI for 15 years, was a board member for 24, and has been part of the semiconductor industry for more than 50.
Key points from SEMI's 2012 semiconductor fab equipment spending forecast include a predicted decline of 11% to $35 billion, steady growth in 300mm installs, and an H1 dip/H2 surge format.
EV Group signed a joint-development and licensing agreement with Eulitha AG, integrating Eulitha's PHABLE mask-based UV photolithography technology with EVG's automated mask aligner platform.
Researchers at Oak Ridge National Laboratory have observed metallic conductance in ferroelectric nanodomains, using piezoresponse force microscopy.
Camtek launched Xact200, a transmission electron microscope (TEM) sample preparation system for the semiconductor industry. Camtek calls the system an alternative to FIB analysis.
Turner Investments shares the 7 display and semiconductor/microelectronics makers it expects to benefit the most from tablet PC proliferation out of Apple, Samsung, and Amazon.com.
Gallium nitride (GaN) technology isn't shrinking from military applications any time soon, but GaN adoption is increasing in the commercial sector, from less than $1 million in 2010 to $58 million in 2015, shows Strategy Analytics.
Materion Microelectronics & Services added 50% more space in its PVD parts cleaning and surface treatment facility, with an automated robotic twin wire arc spray, increased precious metal refining capacity, new cleaning processes, and a Class 10,000-certified cleanroom.
The GaAs device market recovered sharply in 2010, driven mobile handsets. Increased use of pure-play foundries met the surge in demand and was in-line with a trend toward outsourcing, says Strategy Analytics.
RPI scientists studying a promising form of graphene -- graphene nanowiggles -- with exceptionally different properties for each nanowiggle structure. All of the nanoribbon-edge structures have a wiggly appearance like a caterpillar inching across a leaf.
SuVolta Inc. secured $17.6 million in venture funding from all existing investors as well as new investor Bright Capital. SuVolta developed the PowerShrink low-power IC technology, which cuts chip power consumption by 50-90%.
Nocilis Materials opened its silicon foundry service globally. Nocilis Materials AB provides epitaxy service of advanced Si-Ge-Sn-C alloys for electronic and photonic applications.
Chip inventories held by semiconductor suppliers declined in the third quarter of 2011, putting a halt to the steady expansion of the previous seven quarters, as the industry cut production in order to reduce oversupply, shows IHS iSuppli research.
The Semiconductor Industry Association (SIA) reports worldwide sales of semiconductors were $25.1 billion for the month of November 2011. The semiconductor industry closed 2011 with growth and looks towards 2012 for further improvement.
Chalmers University of Technology researchers created a graphene FET (G-FET) that is compatible with silicon devices and offers space and high-frequency benefits over traditional mixer transistors.
20nm production will be done with 193nm ArF immersion lithography. The workhorse lithography technologies will be double-patterning, source mask optimization, or some combination of the two, says Franklin Kalk, Toppan Photomasks.
Defect control at 22nm is a critical focus for chemical mechanical polishing (CMP). Michael A. Fury, Techcet Group, discusses the current companies and trends on the leading edge of CMP for 22nm.
Art Zafiropoulo of Ultratech shares predictions for 22nm: that everyone will be using gate-last fabrication, that there may be a mid-node at 20nm, and that TSVs and 450mm wafers will play an important role at the new node.
Solid State Technology asked top analysts and technologists to provide insights on the transition to 22nm semiconductor devices. Read through the whole 10-forecast series, or check out the individual articles as you have time to see perspectives on lithography, device architecture, and more.
Soitec (Euronext Paris) completed its acquisition of all of the outstanding shares of Altatech Semiconductor S.A. The final purchase price was EUR15 million.
Gore introduced a 20nm-rated PTFE filter, available in a HDPE cartridge. The filter is optimized for bulk processing high-purity chemicals used in semiconductor and flat panel display manufacturing.
Hydro One Networks, NEC and ON Semiconductor join SRC’s global Energy Research Initiative, expanding the focus to include finding new materials, devices and methodologies for power controls/management and energy collection, conversion and storage.
North American companies made a minor gain in semiconductor marketshare in 2011, keeping the them in the majority worldwide. South Korean companies have gained more than two points of marketshare since 2009, says IC Insights.
Cambrios Technologies Corporation appointed John LeMoncheck as president and CEO, and announced a $5 million Series D-3 financing round from Samsung Venture Investment Corporation.
The global semiconductor market will see a slow 2012, reports IHS, with economic uncertainty and semiconductor inventory not moving enough to stimulate new production. Expect negative growth in Q1 2012, a nascent rebound in Q2, and strong growth in Q3 2012, IHS reports.
The World Trade Organization found that the export duties and quotas imposed by China on various raw materials -- bauxite, coke, fluorspar, magnesium, manganese, silicon carbide, silicon metal, yellow phosphorus and zinc -- are protectionist measures in breach of WTO rules and that China failed to justify them.
Luxtera is teaming up with the new foundry service for Optoelectronic Systems Integration in Silicon (OpSIS), making Luxtera’s Silicon CMOS Photonics device library and process open to the OpSIS community, which shares the cost of fabricating complex chip-scale systems across many projects.
Tilera launched its 36 and 16-core TILE-Gx 64-bit processors with low power consumption and high performance. The chips increase the number of cores on one die, without complicated redesigns, and are Tilera's first 40nm design.
Texas Instruments (TI, NASDAQ:TXN) will close 2 older semiconductor manufacturing facilities in Hiji, Japan and Houston, TX over the course of the next 18 months. Production from these analog chip sites will be moved to more advanced TI facilities.
President Barack Obama visited the Intel Ocotillo campus in Chandler, AZ. The President spoke about Intel's technological innovation, and manufacturing jobs in America.
While Apple's release of the iPhone 4S in Q4 2011 "unleashed tremendous pent-up demand" from consumers, Samsung used its broad range of smartphones to take the top spot, reports IHS.
NIST materials scientists modified a standard SEM for a roughly 10-fold improvement in measuring the crystal structure of nanoparticles and extremely thin films. It enables crystal structure study of particles as small as 10nm.
ABB Robotics introduced an ISO 5 (Class 100) Cleanroom version of the IRB 120, its smallest multipurpose 6-axis robot. Any source materials in the IRB 120 prone to particle generation were modified to eliminate contamination potential in the manufacturing area.
Soitec joined SEMATECH's Front End Processes and Advanced Metrology Programs, bringing SOI wafers and other advanced engineered wafers into the group to work on new processes and technologies enabling high-performance, low-power IC applications.
Test Advantage Capital Group, a business of BSE Group, surpassed $150M in its portfolio of semiconductor manufacturing equipment under management. Boston Semi Equipment's fab equipment leasing business also received a $100M annual commitment from its financial backer, Wafra Capital Partners.
The late-2011 flooding in Thailand caused major disruptions in the semiconductor and electronics manufacturing communities, most acutely felt in hard disk drive (HDD) manufacturing. FBR Capital Markets provides this update on Thai HDD production.
UC Riverside researchers identified the "Higgs boson" property of bilayer graphene: when the electrons come close to 0, BLG becomes insulating. This spontaneous symmetry breaking is the same principle that endows mass for particles in high energy physics.
Leading electronic equipment manufacturers accounted for $105.6 billion of semiconductors on a design TAM basis in 2011, 35% of semiconductor vendors' worldwide chip revenue, according to Gartner. Apple bought the most, spending $17,257 million.
SEMATECH experts reported on innovative processes for advanced CMOS logic and memory device technologies and 3D TSV manufacturing at the International VLSI Technology, System and Applications Symposium (VLSI-TSA).
Vistec Electron Beam GmbH sold a Variable Shaped Beam system SB251 to the Institute of Electronic Materials Technology in Warsaw, Poland, for R&D on micro-optical and diffractive elements, new materials, and masks for optical lithography.
Due to stronger demand for TSMC’s 28nm technology and the pull-in of a 20nm R&D process line, the foundry raised its estimate for 2012 capital expenditures from $6 billion to $8-8.5 billion.
Wafer demand grows at a CAGR of about 8-9%, but capital investment in wafer fab capacity does not stick with an 8-10% investment rate every year. Semico tracks wafer demand, which is “anything but stable.”
As semiconductor nodes shrink, filter manufacturers and cleanroom designers must offer products that remove the smallest possible particles. While hardware can accomplish much of this, the cleanliness of a room is a function of the motion of the employees in the room.
The overall semiconductor industry will grow 4.3% in 2012, according to IHS, which raised its forecast 1 percentage point based on consumer demand for wireless products like smartphones and tablets.
Carl Zeiss won orders for its EUVL actinic aerial image metrology system, AIMS EUV, from 2 of the 4 members of SEMATECH’s EMI partnership. The tool allows chip makers to review defects in advanced masks needed for EUVL.
"As we expected, our business cycle bottomed in the first quarter, and early signs of growth began to emerge." -- Rich Templeton, TI's chairman, president and CEO.
Inpria, chemical materials supplier for thin-film deposition, joined the consortium SEMATECH’s Lithography Program. Inpria and SEMATECH will tackle on critical issues for resist in extreme ultraviolet (EUV) lithography.
Intel Corporation introduced its first product built on the 22nm 3D trigate transistor: the quad-core 3rd-generation Intel Core processor family for desktop, laptop and all-in-one (AIO) designs.
AMD (NYSE:AMD) announced Q1 2012 revenue of $1.59 billion, a net loss of $590 million and operating loss of $580 million. Analysts share their takes on AMD's 32nm and 28nm situation, ASPs, and more.
The HTC One S HSPA phone runs Android 4.0.3, based on Qualcomm’s first 28nm processor, the MSM8260A, with an Adreno 225 GPU core. ABI Research performed a teardown on the handset.
Toshiba Corporation (TOKYO: 6502) will rebuild its semiconductor manufacturing operations in Thailand by relocating Toshiba Semiconductor Thailand Co., Ltd. (TST) to a new manufacturing facility.
KLA-Tencor Corporation (NASDAQ:KLAC) debuted the CIRCL suite high-throughput defect inspection/metrology/review system for implementation at lithography, outgoing quality control (OQC) and other process modules in semiconductor manufacturing lines.
Freescale Semiconductor Holdings (NYSE:FSL) launched a formal process to identify a successor to Chairman and CEO Rich Beyer, who will retire as CEO after a transition.
Hexagon Metrology released the Optiv Classic 321GL tp benchtop vision-measuring metrology system for the North American market. It suits electronics and precision parts inspection, including micro-holes, fiber optics, filters, and more.
Strong lithography spending, as well as several acquisitions and divestures in the space, brought changes to the critical subsystems of semiconductor/related markets sector, says VLSIresearch.
Investments in fabless companies, semiconductor suppliers, and other chip companies fell more than 80% month/month and year/year in March, reports the Global Semiconductor Association (GSA).
IBM welcomed Asahi Kasei and Central Glass to its Battery 500 Project team, collaborating on far-reaching research to improve electric vehicles. Asahi Kasei will engineer membrane technologies and Central Glass will develop electrolytes and additives for lithium-air batteries.
The corresponding combined revenue opportunity for MBE and MOCVD is estimated to be around US $6.1 billion for the 2012-2020 periods, shows Yole Développement.
Researchers sponsored by Semiconductor Research Corporation have identified a path to overcome challenges for scaling multi-core semiconductors by addressing how to scale memory communications among the cores.
With a book-to-bill ratio of 1.13, North America-based manufacturers of semiconductor equipment saw a sixth climb in the ratio, which has steadily improved since it hit 0.71 in September 2011, shows SEMI.
The NAND flash memory market will grow 8% in 2012 to $22.9 billion, thanks to major sales drivers such as solid-state-drive (SSD) equipped ultrabooks, according to the IHS iSuppli Data Flash Market Tracker.
Intel Corporation (NASDAQ:INTC) posted quarterly revenue of $12.9 billion, operating income of $3.8 billion, and net income of $2.7 billion. Analysts from FBR Capital Markets and Barclays Capital break down the numbers.
EPIC, the European Photonics Industry Consortium, announced at its annual general meeting that Carlos Lee has been appointed as director general, succeeding Thomas Pearsall, who has led the association since its founding in 2003.
Texas Instruments awarded 15 of its 12,000 suppliers with Supplier Excellence Awards for delivering outstanding service and support, based on cost, environmental responsibility, technology responsiveness, assurance of supply, and quality.
The 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2012) will be held May 15-17 in Saratoga Springs, New York. The conference will feature presentations of more than 85 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features a panel discussion on “Competing for R&D Dollars,” moderated by Solid State Technology Editor-in-Chief Pete Singer.
Soitec, semiconductor materials supplier, released its fully depleted product roadmap, comprising two products designed for both planar and three-dimensional approaches to building semiconductor transistors.
Total worldwide semiconductor revenue reached $306.8 billion in 2011, up $5.4 billion, or 1.8% from 2010, according to Gartner Inc.
Brewer Science released new wafer processing equipment for thin wafer separation and post-debond cleaning during compound semiconductor device processing: a thermal debonder, separation tool, and megasonic cleaning system.
Barclays Capital is raising its total lithography units forecast by more than 10 systems, from 234 to 251 in 2012. As many as 260 litho tools could be purchased, as foundries are seeing high demand for 28nm chips.
The eBeam Initiative will present at Photomask Japan (PMJ), through member companies, improved photomask critical dimension uniformity (CDU) and wafer yields thanks to eBeam technologies.
Veeco Instruments Inc. debuted the SPECTOR-HT ion beam deposition tool for thin-film deposition in optical products, such as lasers, telecommunications chips, and more.
Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: electronic skin, energy storage with nanowires, printable inks, gas sensing, inkjet printing, semiconductor polymers for organic devices, CNTs, OFETs, touch screen fabrics, and the coffee breaks.
Blogger Michael A. Fury, Techcet Group, reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: nanowire FETs, laminate MEMS, nanoparticles in security printing, graphene nanoribbons, Ta2O5 memristors, redox flow batteries, graphene, and more.
Barclays Capital and FBR Capital Markets share their takes on earnings season for public semiconductor companies. Both predict a cycle of inventory replenishment in the semiconductor supply chain that will bode well for chip makers in 2012.
JEDEC Solid State Technology Association will form a subcommittee to its JC-64 Committee for Embedded Memory Storage and Removable Memory Cards focused on standardization of non-volatile memory (NVM) in wireless applications.
Intel Corporation announced 9 winners of the company's Supplier Continuous Quality Improvement (SCQI) award for outstanding commitment to quality and performance excellence.
Sony Corporation will implement series of initiatives, under its new management team, to “revitalize and grow the electronics business to generate new value, while further strengthening the stable business foundations of the Entertainment and Financial Service businesses.”
Entegris (NASDAQ:ENTG), contamination control and handling system supplier to the semiconductor and microelectronics industries, will build the Entegris i2M Center for Advanced Materials Science in Bedford, MA, near its headquarters in Billerica. i2M denotes ideas to market.
Oasys Design Systems added Intel Capital and Xilinx to its investors in a Series B round. Oasys will use the funds to expand R&D and build a global support structure.
The National Institute of Advanced Industrial Science and Technology in Japan is using its AIXTRON SE BM 300 system to grow monolayer graphene on 300mm wafers.
The top 25 fabless IC suppliers captured 80% of a total $64.9 billion fabless IC market in 2011, according to IC Insights. Sales topped $1 billion at 12 fabless companies; Qualcomm topped the list with nearly $10 billion in sales. US-based suppliers captured 8 of the top 10 rankings.
Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- κ dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.
The ConFab 2012, an invitation-only global conference and business meeting on semiconductor manufacturing, June 3-6 in Las Vegas, selected speakers and sessions for 2012.
Intel Corporation announced its 2011 Intel Preferred Quality Supplier (PQS) awards, selecting 19 of its thousands of suppliers. Two suppliers received Intel’s Achievement Award.
This SEMI News and Views blog, written by Jonathan Davis, president, SEMI Semiconductor Business, covers SEMI's efforts with government and policy-shapers in the US and Europe.
The pure-play semiconductor foundry business will ride the growth of tablets, ultrabooks, and smartphones to $29.6 billion in revenues, according to an IHS iSuppli Semiconductor Manufacturing and Supply Market Tracker report.
At International Solid-State Circuits Conference (ISSCC), imec and Holst Centre are presenting 14 papers on low-power design for wireless communication and wireless sensor networks, and organic electronics.
The Flash Memory Summit covers the current state of flash memory and its applications via tutorials, panel discussions, keynote speeches, paper sessions, and more. Submit your abstract by March 16.
Wright Williams & Kelly, Inc. (WWK) opened its 2012 semiconductor industry survey on equipment and process timing. Only participants will receive the full results, free of charge.
The 22nm node marks the beginning of a major transition from conventional scaling of planar memory devices to complex 3D architectures. SEMATECH authors examine the metrology needs of 3D memory device architectures in Part 2 of this three-part series.
The UpTime sub-atmospheric dopant gas delivery system from Praxair Electronics will be Applied Materials' (AMAT's) factory default standard for the Varian VIISta ion implant platform.
IC manufacturers closed 49 wafer fabs between 2009 and 2011, according to IC Insights. Smaller wafer fabs (≤200mm) suffered the most closures, and Japan and North America led the way.
Tool obsolescence is increasingly important to semiconductor manufacturers running 200mm wafer fab lines, reports ISMI, which has chartered an Equipment Obsolescence Forum for alternative sourcing.
At Intel’s annual investor day, the chipmaker reported that capital spending will be high in 2012 and 2013, noting that its 22nm and 14nm node capabilities are differentiators. Intel focused on its Ultrabook launches, consolidation in the chip industry, and reiterated that capex is for internal use not foundry services.
Memory chip maker Micron Technology Inc. (Nasdaq:MU) confirmed that it is engaged in discussions to take over the assets of bankrupt DRAM maker Elpida Memory Inc.
Astro Pak Corporation opened its Class 100 and Class 1000 cleanrooms, recently renovated and expanded, in Downey, CA. The cleanrooms host contract precision cleaning for the semiconductor manufacturing, aerospace, and other industries.
Dow Corning will add 2 AIXTRON AIX 2800G4 WW planetary reactor platforms to its silicon carbide (SiC) epitaxy capacity for next-generation power electronics.
EMI added two members its North American Advisory Board: Terry Brewer of Brewer Science and Wayne Mitchell of Air Products.
Coherent Inc., supplier of laser power and energy management instruments, achieved a certificate of accreditation to ISO/IEC 17025:2005 at its Wilsonville, OR calibration laboratory.
SEMI-GAS Systems, ultra-high-purity gas source and distribution system maker, will outfit the University of Nebraska - Lincoln’s new Nanoscience Metrology Facility. Applied Energy Systems will provide field services.
University of Warsaw, Poland, researchers will grow GaN materials on a new AIXTRON SE Close Coupled Showerhead MOCVD reactor in a 3 x 2” wafer configuration.
Worldwide silicon wafer area shipments increased slightly during Q1 2012 when compared to Q4 2011 area shipments, according to SEMI. Wafer shipments fell 11% from Q1 2011.
President Barack Obama toured the SUNY - Albany Nano-Tech Complex today, speaking about the economy and education in the CNSE NanoFab Extension Building.
III-V Lab, a joint lab of Alcatel-Lucent Bell Labs France, Thales Research and Technology and CEA-Leti, provides an update one year into its 4 main research area projects. III-V lab combines compound semiconductor and silicon semiconductor technologies for applications in telecom, industrial control, environmental testing, defense, security, and space.
Elpida informally chose Micron to sponsor its restructuring, report severals sources. Micron reportedly will pay about USD1 billion more than it originally offered, investing another $1.25 billion to upgrade 2 fabs in Japan.
A leading, US-based IDM ordered about $5 million of front- and back-end semiconductor automatic optical inspection (AOI) tools from Camtek Ltd.
Texas Instruments Inc. (NASDAQ:TXN, TI) hosted an Analyst Day this week to discuss and review key strategies and progress achieved over the past 15 years. Barclays Capital “heard few surprises” at TI's Analyst Day; its analysts maintain their view that TI is a “high-quality analog company” that raises some concerns that it is not able to benefit from its scale advantages, with a growth trajectory of only GDP-plus (i.e. in line with overall semiconductors). FBR Capital Markets analysts agree that “little new surfaced.”
The Heterogeneous Technology Alliance in Europe is focusing on high-performance organic electronic circuits through 2 projects: COSMIC to develop p- and n-type OTFTs for complementary logic, and POLARIC for shrinking critical dimensions of OTFTs.
Lux Research profiled 328 companies across 15 different emerging technology domains in Q1 2012. Of these, Lux Research selected its top 10, including a gallium-nitride (GaN) power device maker, printed electronics supplier, and others.
The massive “gray market” for cellphones is propelling sales of lower-cost flash memories like eMMC and SPI NOR, as manufacturers of the unregulated phones strive to keep production costs low, says IHS.
At The ConFab in Las Vegas, TSMC’s BJ Woo, senior director, Graphic/PLD/CPU Business Development Division, will present “Bridging the Fabless-Foundry Gap.”
DRAM’ percentage of the cost of a smartphone is decreasing, even as DRAM usage in smartphones is on the rise. Lowering ASPs for DRAM components caused DRAM costs in smartphones to fall by more than half in the course of a year, according to IHS.
Barclays Capital updates its wafer fab/semiconductor production equipment (WFE/SPE) capital expenditures expectations for TSMC, Samsung, Intel, UMC, GLOBALFOUNDRIES, SMIC, and Huali.
JEDEC Solid State Technology Association published the JESD209-3 LPDDR3 Low Power Memory Device Standard, targeting the performance and density demands of new-gen mobile devices.
In April 2012, venture investment dollars received by semiconductor companies was $194.2 million; a 901.0% increase M/M and 461.3% increase Y/Y, reports the Global Semiconductor Alliance (GSA).
Barclays Capital’s C.J. Muse looks at the forecast for PC GPUs based on a new report from Mercury Research. Shipments of PC graphic devices in Q1 2012 came in in-line to slightly below historical trends. Nvidia lost share to Intel and AMD due to tight 28nm chip supply.
Gigaphoton Inc., lithography light source manufacturer, began operations at its wholly owned subsidiary, Gigaphoton Korea Inc. Gigaphoton points to Korea as “one of the most important regions in the global semiconductor industry.”
The Hybrid Memory Cube Consortium (HMCC) is a collaboration developing and implementing an open interface standard for Hybrid Memory Cube semiconductor memory architectures. Microsoft Corp. has now joined the consortium.
Semiconductor Manufacturing International Corporation (SMIC) signed a cooperation framework document between its subsidiary SMIC Beijing and the Beijing municipal government, forming a joint venture for SMIC Beijing's expansion adjacent to its 12” mega-fab.
Bühler’s acquisition of Leybold Optics from EQT III, for an undisclosed sum, was approved without any restrictions by anti-trust authorities.
SÜSS MicroTec AG has increased its shareholding in SUSS MicroOptics S.A. to 100%. SUSS MicroOptics is a leading company for high-quality refractive and diffractive micro-optics.
The market for DRAM is expected to partially reverse the drastic losses it incurred in 2011 and achieve revenue growth this year, the result of balanced supply and demand following the exit of major manufacturer Elpida Memory, according to IHS.
Infineon Technologies AG (FSE:IFX, OTCQX:IFNNY) CEO Peter Bauer will resign his post at the end of the current fiscal year (September 30, 2012) due to worsening osteoporosis.
SPTS Technologies installed a Sigma fxP physical vapor deposition (PVD) system at a Chinese foundry producing RF devices on gallium arsenide (GaAs) substrates.
The top 20 semiconductor suppliers in Q1 2012, compiled in IC Insights' May Update to The McClean Report, show Intel’s firm hold on the top of the rankings, but a disappointing quarter overall. GLOBALFOUNDRIES replaced bankrupt Elpida on the top 20 charts.
SENSIRION introduced the SLQ-QT105 semiconductor-grade flow sensor for flow rates below 2cc/sec (120ml/min) of hydrocarbon-based liquids, such as photoresists and solvents.
Arkema and CEA-Leti, with the help of Professor Hadziioannou’s team of LCPO, have successfully patterned a 20nm pitch and reduced the diameter of contacts down to 7nm with nanostructured polymers.
Nanotrons Corporation launched the SPray Assisted Layer-by-layer Assembly System (SPALAS) for nano-enabled optical coatings on semiconductor, plastic, and glass substrates using layer-by-layer (LbL) self-assembly.
CMOS image sensors (CIS) are breaking sales records again, after several years without upward momentum, reports IC Insights. New portable systems and embedded imaging are lifting CIS to $6.3 billion in 2012 and new record sales each year through 2016.
Elpida Memory Inc. (Tokyo: 6665) resolved to file a petition for the commencement of corporate reorganization proceedings, and filed the same with the Tokyo District Court. Akita Elpida Memory Inc. also saw the commencement of corporate reorganization proceedings
FBR Capital released its Q4 2011 semiconductor industry analysis, surveying chip, distributor, EMS, PC OEM, communications equipment OEM, handset OEM, and industrial firms. Their conclusion? Corrective actions in the supply chain have set up a possible H2 2012 snapback for semiconductors.
Tabula is implementing a family of 3PLD products manufactured by Intel using its advanced 22nm manufacturing process featuring 3D tri-gate transistors and co-optimized packaging technology.
North America-based manufacturers of semiconductor equipment posted $1.18 billion in orders, $1.24 billion in billings, and a book-to-bill of 0.95 in January 2012, according to SEMI.
SEMICON China takes place March 20-22 in Shanghai. Check out the special pavillions and events, and keynote speakers scheduled.
As semis are manufactured at the 2X and 1Xnm nodes, new metrology technologies must evolve to fill the gaps. In Part 3 of this 3-part metrology series, SEMATECH discusses the inspection/metrology options for advanced semiconductors.
SEMI’s International Strategy Symposium (ISS) meets for its Europe session February 26-28 in Munich, Germany. Following are some of the 450mm wafer presentations scheduled to take place.
Simon Segars, ARM, will keynote the Common Platform Technology Forum, along with execs from IBM, Samsung and GLOBALFOUNDRIES, March 14 (Pi Day) in Santa Clara, CA.
AIXTRON SE sold 2 BM Pro 4"-wafer deposition tools to the Italian Institute of Technology for the development and production of graphene used in novel hydrogen storage systems.
New information from NIST about how layered switching devices for novel computer memory systems work may now allow these structures to come to market sooner.
International Solid-State Circuits Conference (ISSCC) is going on now, gathering semiconductor design and device architecture presentations from research firms like imec to chip companies like IBM. Here are some highlighted presentations.
MIT researchers used gases to precisely control nanowires' width and composition as they grow, which could yield complex structures optimally designed for particular applications, like LED substrates or solar panels.
MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.
Semiconductor vendors had slow Q3 and Q4 revenues, indicating that the anticipated correction to chip inventory levels occurred, Gartner reports. The correction process will be largely completed by Q1 2012, evidenced by rising trends in the lead-time index.
A team of researchers at the University of New South Wales, Purdue University and the University of Melbourne have built the smallest transistor ever using a single phosphorous atom.
The IEEE International Reliability Physics Symposium (IRPS) is set for April 15, 2012 – April 19, 2012, in Anaheim, CA.
Processors like Qualcomm’s Snapdragon will make an impact on future chip revenues, reports analyst firm In-Stat, an NPD Group company.
SUSS MicroTec will work with GenISys, provider of high-performance software solutions for nano scale fabrication, to combine the SUSS MicroTec mask aligner tools with the GenISys simulation software Layout LAB.
Dr. Vivek Bakshi, President of EUV Litho, Inc., reports on the SPIE Advanced Lithography conference. He says that this year even the loudest criticism of EUVL was not about “if” but “when,” and the predicted range of insertion for EUVL in high volume manufacturing (HVM) is now 2013-15.
The National Physical Laboratory in the UK is leading a new EMRP project on thin film manufacturing metrology for industries such as opto electronics, plastic and printed electronics, displays and lighting, memories and solar cells.
The International Solid State Circuits Conference (ISSCC) brought the best and brightest minds in semiconductors together to share the results of the past year’s research and development efforts. Memory analyst Jim Handy, Objective Analysis, was there to cover some highly interesting presentations.
EV Group (EVG) shipped an EVG301 semi-automated single-wafer cleaning system to Tokyo Institute of Technology, for research on advanced optical communication ICs.
Air Products will acquire all of DuPont's interest in DuPont Air Products NanoMaterials LLC (DA NanoMaterials), a 50-50 JV that the companies set up for the semiconductor and wafer polishing industries.
Seagate recaptured the lead in HDD shipments during Q4 2011, ousting Western Digital thanks to "a fortuitous accident in geography" that kept Seagate's Thailand HDD manufacturing plant out of the floods last year, said IHS.
M+W Group, a global engineering and construction company, is reporting a major contract from Infineon Technologies for a new 100,000-sq.m. semiconductor plant in Kulim/Malaysia.
GLOBALFOUNDRIES appointed Magnus Matthiasson, formerly of Philips Lumileds, as chief procurement officer (CPO), reporting to CFO Dan Durn.
IBM Research established new records for reducing errors in elementary computations and retaining the integrity of quantum mechanical properties in qubits for quantum computing, using superconducting qubits.
Intel Corporation and Micron Technology, Inc., entered into agreements to expand their NAND Flash memory joint venture relationship, wherein Intel will sell its stake in 2 fabs to Micron, IMFS and IMFT.
HiSilicon and imec have signed a strategic research collaboration to develop innovative RF transceiver architectures for next-generation mobile terminals. OSAT Company is using Agilent EMPro and the Momentum 3-D planar electromagnetic simulator to design and simulate innovative new antennas and circuits.
The Handbook of Physical Vapor Deposition (PVD) Processing, Edition No. 2 has been released, covering all aspects of PVD process technology, from characterization and preparation of the substrate material, through deposition and film characterization, to post-deposition processing.
A common theme among the presenters at SEMI's ISS Europe was how Europe might bridge the so-called “valley of death” between basic research and volume manufacturing.
Micron is the generally favored acquirer for bankrupt Elpida. But this did not stop Elpida from displacing MU in the Q1 DRAM supplier rankings in Q1, noted IHS. DRAM as a whole declined in Q1, despite predictions of a strong 2012.
EpiGaN NV opened its GaN epitaxial material production site, on the Research Campus Hasselt in Belgium. EpiGaN’s GaN-on-Si material is used in next-generation power electronics.
Axus Technology introduced the Titan Carrier Upgrade for IPEC and Strasbaugh legacy CMP chemical mechanical polishing/planarization (CMP) tools for semiconductor and related manufacturing.
North America-based manufacturers of semiconductor fab equipment posted $1.60 billion in orders and $1.45 billion in billings in April 2012 for a book-to-bill ratio of 1.10, according to SEMI.
Brown University is using supercomputer simulations to better understand the ion bombardment of metal surfaces used in manufacturing nanoelectronics.
IEEE International Electron Devices Meeting (IEDM) is seeking original presentations on microelectronics research and development, with a focus on silicon and non-silicon device and process technology, circuit/device interactions; energy-harvesting, biomedical, and power electronics; magnetics and spintronics; and other topics.
Power discretes’ sales revenue will grow at a CAGR of 6.5%, 2012-2016, estimates GBI Research. Power discretes are meeting demand for energy-efficient and environmentally friendly products.
Indian River State College in FL will be the first college in the southeastern US to offer students access to the instrumentation and curriculum provided by the NanoProfessor Nanoscience Education Program from NanoInk.
Stefan Wurm, director of lithography, SEMATECH will present “EUV Lithography Manufacturing Introduction: Infrastructure Readiness” in the session Technology Trends in Semiconductor Manufacturing at The ConFab 2012, June 3-6 in Las Vegas.
ON Semiconductor (Nasdaq:ONNN) expanded its Roznov, Czech Republic, operations with a new 4,000sq.m. research and design facility, a quarter of which is high-tech laboratories.
Hynix officially became a member of SK group, energy and telecommunications conglomerate, changing its name to SK Hynix.
SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30.
Elpida's bankruptcy process moved forward another step, with the Tokyo District Court naming Yukio Sakamoto, Elpida president & CEO and Nobuaki Kobayashi, attorney-at-law as the Trustees for the case.
North America-based makers of semiconductor equipment posted $1.33 billion in orders in February 2012, $1.32 billion in billings, and a book-to-bill ratio of 1.01, according to SEMI.
GLOBALFOUNDRIES' Fab 1 in Dresden, Germany has shipped 250,000 semiconductor wafers based on 32nm HKMG technology. AMD commented that it will move ahead with 28nm at GLOBALFOUNDRIES.
The Dow Chemical Company (NYSE: DOW) inaugurated its Dow Seoul Technology Center, a global R&D center with focus on technological advances in display and semiconductor applications.
Apple’s ARM-based processors have created a point of hardware differentiation in applications processors. With the A5X, Apple is going with a much larger die at the 45nm node (shared across the 2 prior generations), shares Chipworks. It's also turned off the PoP track.
Lithography light source maker Gigaphoton Inc. opened its new U.S. Regional Headquarters and Training Center in Beaverton, OR.
Gudeng Precision will use VICTREX PEEK-ESD 101 to make its first commercialized extreme ultraviolet (EUV) lithography pod. The material will help prevent contamination.
Dow Electronic Materials released KLEBOSOL II 1730 colloidal silica slurry for CMP of inter-layer dielectrics and post-metal buff.
Semiconductor days of inventory rose 3.4%, hitting an 11-year high of 84.1 DOI at chip suppliers in Q4 2011, but this will decline 0.5% in Q1 2012, with hopes that demand is improving, says IHS.
ASIC design starts are evolving under increasing design costs, rising design complexity, and lengthening design cycle times, especially in the SoC market, says Semico Research Corp. New applications are providing an element of stability.
Barclays Capital weighs in on rumors that Micron (MU) offered $1.5 billion to take over Elpida. Should the offer stand, it would be about 20-30 cents on the dollar for Elpida's assets.
Taiwan raised investment ceilings for Chinese investors in LCDs, semiconductors, IC assembly and test, microelectronics production equipment, and metal tool manufacturing.
Worldwide semiconductor manufacturing equipment spending is projected to total $38.9 billion in 2012, an 11.6% decline from 2011 spending of $44 billion, according to Gartner Inc.
A high-volume semiconductor fab using particle monitor wafers to test for contamination in wafer fab tools looked to reduce its labor and test time. The fab switched to wireless wafer-like airborne particle sensors. Allyn Jackson, CyberOptics Semiconductor, shares the case study.
Fraunhofer IZM and Fraunhofer CNT will use CMP supplier Axus Technology exclusively to provide advanced 300mm wafer process development and foundry services to North American customers.
NIST is soliciting proposals of long-term research in next-generation semiconductor technology, putting up $2.6 million in federal cost-shared funding for a project’s first year, with the potential for continued funding for up to 5 years.
AMEC installed a second-generation dielectric etch tool, the Primo AD-RIE, at Chinese foundry SMIC. It is the first time AMEC has installed the Primo AD-RIE in China.
One year ago, Japan’s semiconductor industry was rocked by a devastating earthquake and tsunami. However, the real disaster for Japan’s chip industry occurred during the years before the earthquake, says IHS.
CEA-Leti has introduced the “LETI-3S” concept, for “Silicon Specialty Solutions.” The research is oriented to start-ups, component integrators, fabless or fablite chip companies, and equipment/consumable suppliers.
Global semiconductor sales hit $23.3 billion in March 2012, up 1.5% from February 2012 and down 7.9% from March 2011, reports the Semiconductor Industry Association (SIA).
RF Micro Devices Inc. (Nasdaq GS:RFMD) expanded its gallium nitride (GaN) portfolio with rGaN-HV, optimized for high-voltage power devices in power conversion applications.
CEA will extend its collaboration with Arkema beyond photovoltaics into microelectronics and organic electronics, setting up two joint public-private research projects in CEA-Leti and CEA-Liten.
The Global Semiconductor Alliance (GSA) appointed Dr. Leo Li, chairman, CEO and president of Spreadtrum Communications Inc., to its Board of Directors. Li is GSA’s first China-based executive to join the Board.
Crossing Automation Inc. formed a business unit around 450mm semiconductor wafer automation platforms. The company has a comprehensive line of 450mm wafer handling products currently shipping to fabs and tool makers.
CVD Equipment completed the sale of its Ronkonkoma, NY, facility, where its Application Laboratory was located. This is part of CVD Equipment’s move to its recently purchased building in Central Islip, NY.
Fujitsu Semiconductor will transfer ownership of its Iwate Plant, a semiconductor wafer fab in Iwate, Japan producing system LSI, microcontrollers, etc., to DENSO.
Nitronex was awarded a NASA Phase I SBIR to develop a highly efficient 20W X-band GaN power amplifier MMICs, for use in long range RF telecommunications. The company will deploy its GaN-on-Si technology.
SEMI presented US Congressman Dave Camp (R-MI) with its 2012 North American Government Leadership Award for his leadership and support of the US microelectronics and photovoltaic manufacturing value chain.
Micron Technology Inc. and Hynix Semiconductor Inc. achieved strong NAND flash business globally in Q4 2011, thanks to solid manufacturing and pricing. The chipmakers gained market share on the NAND Flash industry leaders Samsung and Toshiba, and will continue to grow in 2012, reports IHS.
The global touch controller IC market is growing quickly, thanks to emerging natural user interfaces and touchscreens’ rapid adoption in consumer electronics. From 2011 to 2016, global touch controller revenue will grow from 0.4% of the total semiconductor industry to 1.65%.
Worldwide semiconductor revenues increased more than 3.7% year over year to $301 billion in 2011, according to the IDC Worldwide Semiconductor Applications Forecaster. IDC expects 2012 growth to be in the 6-7% range.
A leading semiconductor manufacturer placed a follow-on order with Mattson Technology Inc. (NASDAQ:MTSN), wafer fab equipment supplier, for a Millios millisecond annealing system (MSA).
MEI uses Vycom Flametec PVC-C for chemical rinse tanks and other wafer-contacting elements of its process tools, reducing tool-based contamination and protecting fab workers. Bill McGinty, MEI operations manager, discusses the benefits the new-generation plastic for semiconductor fab tools.
The global cellular baseband processor market grew 15% year-on-year in 2011, hitting $15.1 billion, shows Strategy Analytics. Of that, Qualcomm holds 45% market share.
ST-Ericsson, wireless and semiconductor company, selected planar fully depleted silicon on insulator (FD-SOI) technology from Soitec for use in future mobile platforms.
Nova Measuring Instruments Ltd. (NASDAQ:NVMI) received $12 million in orders from leading semiconductor foundries for metrology on 2Xnm manufacturing ramp ups.
Fraunhofer Center Nanoelectronic Technologies is collaborating with bubbles & beyond to jointly develop novel cleaning solutions for the microelectronics industry, specifically, removing lithographic materials from semiconductor wafers.
Media tablets, experiencing "remarkably rapid ascension," will become the 4th largest application for semiconductors by 2014, up from 35th in 2010, according to IHS.
Siltronic, subsidiary of Wacker Chemie AG, will stop producing 150mm silicon wafers at its Portland, OR, facility in Fall 2012, and will consolidate 150mm production at its Burghausen, Germany, site.
IBM scientists developed a prototype optical chipset, Holey Optochip, that can transfer 1Tbit per second as a parallel optical transceiver, using optical vias through a standard 90nm CMOS chip.
Confovis will begin providing MountainsMap imaging and surface analysis software from Digital Surf with its ConfoCAM LED grid-confocal measuring systems for inspection and research.
Historically, US presidential election years have been very good for the semiconductor market as many elected officials attempt to pass (mostly short-term) legislation to boost the economy, reports IC Insights.
The HDD industry is rapidly recovering in 2012 and beyond, after surviving natural disasters and tepid market conditions in 2011, according to a report by TRENDFOCUS.
Photronics, Inc. (NASDAQ:PLAB) purchased its US nanoFab building from Micron Technology Inc., paying approximately $35 million. PLAB expects to save $5 million annually after the deal.
Singulus Technologies Aktiengesellschaft (SINGULUS) received 2 orders for its TIMARIS vacuum deposition system from the semiconductor industry.
Meaglow Ltd., MOCVD and epitaxy supplier, launched a range of nitrogen-rich indium nitride (InN) wafers for research and industry development around the compound semiconductor material.
The gallium nitride (GaN) power elec market is currently small, but new entrants are ramping to production, silicon-based electronics suppliers developing GaN, and LED makers diversifying capacity to make power semis.
Ventex performed a major deep ultra violet (DUV) lithography stepper refurbishment and installation project for a tier-one chip manufacturer in Germany.
Owens Design Inc. released multiple customized film frame automated handlers to customers in the semiconductor and LED manufacturing tool industries.
Imec has released an early-version process development kit (PDK) for 14nm logic chips, targeting the introduction of numerous new key technologies, such as FinFET architectures and EUV lithography.
Semiconductor fab equipment spending will remain flat in 2012, says SEMI. But look for a record spend from semiconductor makers in 2013, jumping from $38.85 billion spent in 2012 to $45 billion in 2013.
HRL Laboratories LLC will now offer products in its GaN high electron mobility transistor (HEMT) technology commercially to customers in select markets, such as high-data-rate wireless links, radars and active sensors.
TSMC (NYSE:TSM) named 3 co-chief operating officers at a special meeting of the foundry's Board of Directors. All three executives will report directly to Chairman and CEO Dr. Morris Chang.
The SIA reports worldwide semiconductor sales of $23.1 billion in January 2012, an 8.8% decrease year-over-year, but SIA expects positive demand as 2012 progresses.
AMD (NYSE:AMD) amended its wafer supply agreement with GLOBALFOUNDRIES. The new agreement most notably gives AMD "flexibility to manufacture 28nm parts elsewhere," reports FBR Capital Markets.
After only 2 months, semiconductor foundries are already considering raising their 2012 capex budgets, says Terence Whalen, Semiconductor Equipment analyst for North America at Citi.
Materials experts from across the supply chain gathered at the 2012 Strategic Materials Conference 2012 in San Jose in October, discussing key materials needs for micromanufacturing outside the CMOS mainstream: OLEDs and GaN-on-silicon power semiconductors, graphene, CNTs, and self-assembling polymers.
X-Fab Silicon Foundries has inked a deal with Anvo-Systems Dresden to offer high-speed non-volatile memory (NVM) combining SRAM, DRAM, and SONOS flash technologies in a compact design.
X-Fab Silicon Foundries is now offering what it calls the industry's first 200V SOI foundry technology, a trench dielectric isolated SOI foundry technology that allows blocks at different voltage levels to be integrated on a single chip.
Fujitsu Semiconductor says it has built a server power-supply unit with 2.5kW of output power using gallium nitride (GaN)-based power devices, and will ramp volume production of the power devices in late 2013.
Researchers from IBM and Georgia Tech have disclosed significant progress in manipulating carbon nanotubes in transistors and interconnects, in ways compatible with traditional fabrication techniques, advancing toward using the materials for next-generation devices.
A big boost in demand in the US helped ratchet up chip sales growth in September, according to the latest data from the Semiconductor Industry Association (SIA), but annual growth is on pace for a -4% decline from 2011.
The Global Semiconductor Alliance (GSA) has formed a new working group and identify various alternatives to encourage startups to innovate, woo investors, generate returns, and keep generating sustainable industry M&A.
Despite continued delays from its two big proponents, OLED TV technology will finally start ramping over the next year, reaching one million unit shipments in 2014 and a 3% market penetration by 2016, says NPD DisplaySearch.
Hours away from the US presidential election, here's one last message about jobs and growth in the semiconductor sector.
Nantero's carbon nanotube-based memory (NRAM) will be manufactured, tested and characterized in imec's facilities targeting application in high-density next-generation sub-20nm memories.
After a strong surge in 2010 and solid growth in 2011, the market for optoelectronics, sensors/actuators, and discrete semiconductors (O-S-D) has lost most of its momentum amid a wobbling world economy, says IC Insights.
There's a new battleground slowly emerging for OLEDs in lighting applications where the technology could offer some advantages in design and efficiency -- if panel makers are willing to make some sacrifices.
A group of partners in Europe summarize results from their completed project to deliver the first EUV lithography optics, with progress in several optics components and in mask handling, cleaning, and repair.
Applied Materials has announced two new tools for display manufacturing: one with a new design for depositing IGZO films for TFTs, the other handling bigger LTPS-deposited substrates to help lower manufacturing costs.
In a departure from past iterations, Windows 8 will not cause any significant rise in DRAM unit shipments, predicts IHS iSuppli.
Brooks Automation says it has agreed to acquire privately-held Crossing Automation for $63 million, combining two firms in semiconductor automation technology and services.
This year is shaping up to be a historically lousy year for makers of flat-panel display (FPD) manufacturing equipment, but expectations are looking up that demand will catch up to supply in 2013 and balance the market, according to NPD DisplaySearch projections.
Communications applications are far and away the leading growth market for ICs over the next five years, and PCs and consumer applications have fallen far back in the pack.
DisplaySearch explains why larger panel sizes are a big reason the flat-panel display industry is back on the road to recovery, despite excess capacity and eroding prices (and profits): larger panel sizes. Plus: a Black Friday deal tip-off.
Semiconductor manufacturers can expect equipment costs to increase about 15% for each new process node, but previously enjoyed advantages of moving to smaller feature sizes are no longer offsetting those costs -- even with a 450mm wafer transition.
ProTek Devices says it is now offering individual unpackaged die for LEDs in wafer form, available as unidirectional and bidirectional electrostatic discharge (ESD) protection diodes.
Wafer demand is slowly turning back toward growth, and a closer look at the numbers from SEMI and Semico Research shows what's behind the trends -- and why they give purchasing managers headaches.
In case anyone needed a reminder or a wake-up, new data from SEMI reiterates chip tool sales are slumping badly in the latter part of this year.
In the fifth installment in a series called Process Watch, the authors discuss the need for proper reticle cleaning and inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.
Worldwide flat-panel display (FPD) revenues will reach a record $120 billion in 2012, up 8% from a challenging year in 2011, and the recovery is entirely on the backs of TFT-LCDs and AMOLED displays, according to NPD DisplaySearch.
At SEMICON Europa, European government representatives, consortia, and suppliers discussed programs to support and participate in the 450mm wafer-size transition -- including a comprehensive presentation from ASML about its roadmap for 450mm EUV platforms.
Pulling Cymer's EUV source technology in-house is hoped to accelerate progress in the technology's long slow march toward production readiness.
Intel spoke of caution in end markets when discussing its 3Q12 results, but a big dip in capex and lack of 2013 visibility will likely cause concern in the semiconductor manufacturing ecosystem.
SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.
The Global Semiconductor Alliance (GSA) says it has formed a Technology Steering Committee to help address key business and technology areas of interest to its members, and "encourage the advancement and adoption of leading technology and practices."
STMicroelectronics is getting out of the JV chip business with Ericsson, but it's still full-steam ahead for its use of (FD-SOI) technology with its partners.
Taiwan makers of light-emitting diode (LED) products are unlikely to support a recovery in 2013 LED equipment spending due to an alarming cash crunch individually and sector-wide, warns one industry analyst.
In the seventh installment in a series called Process Watch, the authors discuss cycle time and the impact of inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.
At the International Electron Devices Meeting in San Francisco, An Chen of GLOBALFOUNDRIES presented a survey of emerging nanoelectronic devices, which he divided into two categories: Charge-based and non-charge based.
STMicroelectronics has a new strategic plan that will focus on five product areas (MEMS/sensors, smart power, automotive products, microcontrollers, and application processors), and also exit its mobile chip JV with communications giant Ericsson.
A new wafer supply deal between AMD and GlobalFoundries will free up cash in the near-term, but industry watchers fear that long-term issues still loom.
In news from Semicon Japan, a Nikon spokesperson said that the company plans to ship high-volume manufacturing (HVM) lithography tools in 2017, and Intel officially announced a 450mm Japan Metrology Center.
Axcelis Technologies, Inc. (NASDAQ: ACLS) and Lam Research Corp., (NASDAQ: LRCX) announced a strategic collaboration agreement focusing on the interrelationship between ion implantation, etch processes, and photoresist strip applications.
KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers.
The global market for consumables used in chemical mechanical planarization (CMP) operations continues to rebound, as "magic triangle" combinations of slurry, pad, and conditioner are emerging to improve performance for ≤45nm requirements, reports TechCet Group.
In prep for Semicon Japan in December, Advantest announces three new tools: 2 SEMs and a litho system.
NPD DisplaySearch's examination of the projected 2013 LCD TV panel product mix finds some big differences between what suppliers offer and what buyers want.
Swiss firm Adlyte, a developer of high-brightness laser-produced plasma (LPP) EUV light source for actinic mask inspection, is outlining its current expansion efforts, which includes appointing a longtime industry exec to its strategic advisory board.
After a nice spurt in 2Q12, worldwide silicon wafer area shipments fell back to a -slight decline in 3Q12, according to updated data from SEMI, and remain on track for cautious projections of flat growth for the full year.
Updating its "top 20" semiconductor supplier rankings from earlier this year, IC Insights finds most of the same trends holding true: a tough year overall for chipmakers, but fabless and foundry firms still showing very good growth.
In the sixth installment in a series called Process Watch, the authors discuss the ins and outs of parametric correlation when using measurements based on reflectometry, ellipsometry, or a combination of the two. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.
Soitec says it has more than doubled production of bonded silicon-on-sapphire (BSoS) substrates to meet increased demand from partner Peregrine Semiconductor, which has surged its own production capacity for RF switches used in cellular handsets, including the newest iPhone 5.
FEI, Hillsboro, OR, has introduced its new Helios NanoLab 450 F1 DualBeam system designed to provide faster, better images of their most advanced device architectures.
imec announced two research collaboration efforts to advance STT-MRAM technology, an alternative high-density memory technology. The developments include working with Canon Anelva Corp. on its deposition tool and working with Tokyo Electron (TEL) on its Tactras etch tool, both installed in imec’s 300mm cleanroom.
Wide bandgap semiconductor materials can significantly outperform traditional silicon-based devices in power electronics and light-emitting diodes (LEDs), but they're vastly more expensive. So where's the midpoint where GaN's capabilities and extra costs align to make it the preferred technology for each application?
This year's International Conference on Planarization/CMP Technology (ICPT) encompassed five themes describing use of CMP: new device structures, equipment and methods, Cu interconnects, consumables, and new CMP methods and processes.
Despite graphene's promise as a material in future electronics with excellent properties in almost all applications, it still faces difficulties in market acceptance, according to a report from IDTechEx.
The Japanese rescue of Renesas Electronics partly with state-backed funding is nearing finality, with the company's three largest shareholders approving the deal, according to multiple reports.
NPD DisplaySearch analyst Paul Gagnon took the pulse of consumer shoppers on Black Friday and came away with three observations: bargains are a priority, consumers want bigger upgrades, and Walmart flexed its muscles.
EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services.
Persistent global economic uncertainty from Europe to the US to China is weighing down the WSTS' expectations for semiconductor sales for the next two years, with a slow climb back to single-digit growth by 2014.
Technology improvements and supportive legislation are gathering momentum to help push LED adoption for residential buildings -- the largest lighting application sector.
Despite lingering clouds obscuring near-term visibility for the semiconductor manufacturing industry, signs of macroeconomic life bode well for sales of electronics devices, and by association the chip technologies that power them.
Growth in the industrial electronics semiconductor market is set to fall short of previous expectations in 2012 as the business is buffeted by weakening global economic conditions, with the LED market the sole bright spot, says IHS iSuppli.
A reference book from the Global Semiconductor Alliance (GSA) and IC Insights puts foundry information at the fingertips of those who need it the most.
Sales of electronic gases are seen growing a modest 3.2% growth overall in 2012, following a 15% increase in 2011 to $3.1B, according to an updated report from Techcet Group.
Smart TVs, LED technology, and emerging markets will boost the IC market for TVs, says a new IC Insights study. Another trend: younger tech-savvy consumers are watching TV via the Internet and mobile devices.
The latest monthly numbers for semiconductor manufacturing equipment demand aren't pretty: lows in both orders and sales not seen since the last major downcycle three years ago, and the short-term comparisons continue to widen.
TELEFUNKEN Semiconductors is expanding its manufacturing capacity at the Roseville, California facility, to 220,000+ 8 inch wafers.
Rolla, MO-based Brewer Science introduced a line of conductive CNT ink materials that are surfactant free, require no additional rinse steps, and are compatible with a broad range of printed electronic substrates.
Chip sales growth continues to soften in 2012 as the industry slips from "stagnation" to "slump," but the stage is still set for a rebound in 2013, according to updated analysis from IHS iSuppli.
We've scanned the entire conference program for next week's 58th annual IEEE International Electron Devices Meeting (IEDM), to present a quick sampling of some of the more intriguing papers.
TechSearch International and the IEEE Women in Engineering Committee (WIE) are establishing a $2500 scholarship for women going into the field of engineering.
Preventice, Inc. announced that its BodyGuardian Remote Patient Monitoring System (BodyGuardian RMS) will be commercially available in early 2013. Meanwhile, clinical trials are underway in the United States and Europe
Researchers have demonstrated a technique for growing virtually pure samples of single-wall carbon nanotubes (CNT) with identical structures, a process likened to "cloning" them -- and possibly an important step toward controlling their manufacture for future electronic devices.
AMD hopes to save up to $200M by selling its Lone Star campus in Austin and then leasing the site back, as the company seeks ways to regain its fiscal footing.
More than 7% of all mobile phones will use in-cell touch technology in 2012 while tablet PCs start adopting "DITO" film structures, as both technologies strive to overcome production challenges, explains NPD DisplaySearch.
Applied Materials is combining its Display and Energy and Environmental Solutions (EES) under one roof led by former KLA-Tencor exec Ali Salehpour, which also means the departure of those two units' current leaders, Mark Pinto and Tom Edman.
The market for materials used in printed electronics manufacturing will nearly double over the next five years as new materials are brought forth to support low-cost volume production of printed electronic devices, according to Lux Research.
The FlexTech Alliance has awarded 4D Technology (Tucson, AZ) a contract to develop an optical system that addresses a shortcoming in roll-to-roll (R2R) electronics manufacturing: in situ, high-resolution mapping of surface topography and defects on a moving, flexible web.
Nikon and the Singapore A*STAR IME are jointly setting up a R&D lab to develop optical ArF lithography technology for semiconductor manufacturing to and below the 20nm device node.
Global spending on wafer fab equipment (WFE) is now on pace to finish 2012 with a -17% annual decline, and 2013 now looks like it'll only be slightly better at a -10% dropoff, before the next cyclical spending upturn begins in 2014, according to an updated forecast from Gartner.
SMIC is claiming a breakthrough in its development of backside-illuminated (BSI) CMOS image sensor (CIS) technology, with the first test chip demonstrating good image quality even in low-light conditions.
Abingdon, England--Oxford Instrumentshas acquired Asylum Research, a maker of scanning probe microscopes (SPM) with subsidiaries in the UK, Germany, and Taiwan. Its products are used by academic and industrial customers across the world for a wide range of materials and bioscience applications.
Canon U.S.A., Inc. recently launched the FPA-3030i5+ i-line stepper, designed for the manufacturing of LEDs, MEMS and power semiconductors.
Samsung's reaffirmation of its planned $4B investments in its Austin, TX facilities don't offer much extra info, but do serve as a message to the market about its future plans -- with or without Apple.
The Annual SPIE/BACUS Symposium, serving the worldwide photomask industry, will take place September 10-14, with the theme of successful integration and optimization of design, mask-making, and wafer fabrication in the deep sub-wavelength era.
Magnetic sensor semiconductors are robust but steady in application sectors like automotive, military/medical, and data processing. But the devices saw 50% growth in one segment last year: wireless/consumer, according to IHS.
A “leading semiconductor technology innovator” ordered Qcept Technologies Inc.’s ChemetriQ 5000 NVD inspection system for unit process development and process integration activities for advanced nodes, including 2Xnm and 1Xnm logic nodes for both front-end-of-line and back-end-of-line processes.
Zeta Instruments will install multiple optical profilers for micron-scale surface analysis at sapphire substrate maker Rubicon Technology, for metrology and inspection on sapphire substrates and wafer production aimed at the HB-LED market.
TSMC took a 5% stake in ASML, worth EUR 838 million, as part of the ASML Holding N.V. Customer Co-Investment Program to accelerate development of EUV lithography and 450mm wafer processing. TSMC will also commit EUR 276 million to ASML’s R&D programs.
Germany has launched a new project, EUV projection optics for 14nm resolution, or ETIK, led by Carl Zeiss and 6 other German companies and research institutes. The aim is to improve extreme ultraviolet (EUV) lithography resolution to the 14nm node.
Global semiconductor sales stayed flat in June 2012, hitting $24.38 billion, reports the Semiconductor Industry Association (SIA). Y/Y, sales fell just 2% in June, a slower decline than the semiconductor industry has seen since October 2011.
Panasonic Corporation (NYSE:PC, TOKYO:6752) will reform its head office and governance as of October 1, aiming to reduce internally focused work and focus on customer needs.
ON Semiconductor Corporation (Nasdaq: ONNN) will be looking for a new CFO, with Donald Colvin vacating the post within 90 days. ONNN also authorized its first share repurchase program, and reported flat growth for Q2, with similar guidance for Q3.
In the third installment in a series called Process Watch, the authors discuss some of the challenges of 450mm wafers. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.
IC Insights released a Q2 update to its top-20 ranking of semiconductor companies. Three pure-play foundries are in the top 20 ranking, with a cumulative increase of 20% from Q1 2012 to Q2 2012.
The ConFab, Solid State Technology’s invitation-only event for the semiconductor industry, took place in June, with presenters from top companies and analyst firms. If you couldn’t be there, check out all the coverage from the event -- reports, presentations, video interviews and more.
Following Q3 revenue of EUR990 million, approximately unchanged compared to the previous quarter and outlook for Q4 flat to down slightly, Infineon implemented measures to reduce costs. Full-year revenue will be down approximately 3% from 2011.
Semiconductor foundry United Microelectronics Corporation (NYSE:UMC; TWSE:2303) gained LEED-NC Gold recognition for its 300mm Fab 12A P3 & P4 in Tainan, Taiwan, from the U.S. Green Building Council.
Crossing Automation, Inc. announced three new options for the Spartan 300 that deliver an end-to-end contamination-free sorter environment. The new options target high volume manufacturing at 32nm and below.
Seagate Technology plc (NASDAQ:STX) added Gary Gentry to lead its solid state drive (SSD) business as senior vice president, SSD.
EDAX Inc. introduced the Octane Series silicon drift detectors (SDD) for its TEAM EDS Analysis Systems on electron microscopes.
CGI Americas is introducing the QMO Series inert gas and vacuum ovens and MOL Series Class 100 cleanroom ovens, based on the SMO Series precision ovens from C Sun, to the North American market.
FEI (NASDAQ:FEIC) launched the Verios XHR SEM for metrology on beam-sensitive and sub-nanometer-scale materials in advanced semiconductors.
Pfeiffer Vacuum introduced the Sputter Process Monitor SPM 220 and High Pressure Analyzer HPA 220 gas analysis systems to monitor and document vacuum processes.
Teknek debuted an elastomer roller care system for all contact cleaning rollers. Unlike IPA cleaning, the elastomer Roller Doctor rejuvenation pad exfoliates the roller surface with a precise quantity of proprietary cleaning solution.
EMCORE, compound semiconductor-based components and subsystems supplier, will replace multiple legacy manufacturing systems in its compound semiconductor fab and back-end packaging operations with the Camstar Enterprise Platform.
Solid State Technology and SEMI today announced the finalists for the 2012 “Best of West” awards, recognizing important product and technology developments in the microelectronics supply chain.
Following are some of the process control, device inspection, defect detection, and other metrology and test products that will be on display at SEMICON West 2012, July 10-12 in San Francisco, CA.
In a 3-year research collaboration, research organization imec and semiconductor provider Murata Manufacturing Co. Ltd. will work on reconfigurable radio IC design.
CEA-Leti installed a CVD tool from Altatech, a subsidiary of Soitec, to research sub-20nm phase-change memory (PCM) and high-k metal gate (HKMG) semiconductor devices.
DFMSim announced a distribution agreement with a leading US process control OEM that involves the integration of DFMSim’s SMARTlitho manufacturing software into new tools for advanced metrology.
Edwards (NASDAQ:EVAC) introduced the new iXH645H dry pump, optimized for metal-organic chemical vapor deposition, a key step in LED and compound semiconductor manufacturing.
JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.
Worldwide wafer fab equipment spending will total $33 billion in 2012, down 8.9% from 2011’s $36.2 billion spending level, say Gartner analysts. Chipmakers will spend more than $35.4 billion on WFE in 2013, ramping 7.4% over this year.
Barclays Capital checks in on the EUV lithography market potential and which semiconductor manufacturers will press adoption. The analysts also update their expectations for lithography tool suppliers on the EUV front.
SEMATECH added Michael Lercel as senior director for nanodefectivity and metrology, taking the helm on SEMATECH’s ongoing semiconductor wafer metrology program and the new Nanodefect Center in NY.
Evans Analytical Group Inc. (EAG) added electron backscatter diffraction (EBSD) to its analytical and testing services.
SEMICON West is taking place July 10-12 in San Francisco, CA. Following are new products for lithography, including photoresist coaters and ashers.
Linde North America is expanding its capacity to supply ultra-high purity (UHP) gases to a major global semiconductor manufacturer’s Pacific Northwest location.
Cypress Semiconductor has extended its new, higher bid to acquire Ramtron through August 24, 2012. The bid has been renewed several times. Ramtron has previously rejected the offer.
Semiconductor manufacturers will spend $2.3 billion in 2012 for flow control and treatment products, shows McIlvaine Company. Even more pure water is required as the line sizes on chips are decreasing. This aspect, coupled with the opportunity for water reuse, is creating new opportunities.
The Global Semiconductor Alliance (GSA) shows more than 100% increase in semiconductor company investment Y/Y in May, in the Global Semiconductor Funding, IPO and M&A Update.
North-America-based manufacturers of semiconductor fab equipment posted $1.61 billion in orders worldwide in May 2012, $1.54 billion in billings, and a 1.05 book-to-bill ratio, shows SEMI.
The Semiconductor Industry Association (SIA) presented its 2012 University Researcher Awards to Stanford University professors Krishna Saraswat and Bruce Wooley as well as its 2012 Congressional Leadership Awards to Sen. Carl Levin, Sen. John McCain, Rep. Kevin Brady and Rep. Wally Herger.
“The upward trend of global semiconductor sales is encouraging,” said Brian Toohey, SIA. “Recent sales totals are in line with industry projections of modest growth for the remainder of 2012, but a sluggish global economy continues to provide substantial headwinds, limiting more robust growth.”
Semiconductor foundry United Microelectronics Corporation (NYSE:UMC; TWSE:2303) has licensed IBM technology to expedite the development of its 20nm CMOS process with FinFET 3D transistors.
Wireless technology company Qualcomm will change its corporate structure, moving substantially all of its R&D activities, its QCT semiconductor business, and other product and services businesses into a new wholly owned subsidiary, Qualcomm Technologies Inc.
Cypress entered into a 5-year senior secured revolving credit facility with a group of lenders led by Morgan Stanley Senior Funding. The facility enables the company to borrow up to $430 million on a revolving basis.
Micron Technology Inc. (Nasdaq:MU) will acquire and support bankrupt DRAM maker Elpida Memory Inc.’s assets, paying approximately US$2.5 billion total consideration, less certain reorganization proceeding expenses.
At the recently concluded 2012 EUVL Workshop (held June 4-8 in Maui, HI), attendees shared their latest technology developments and discussed ways to address the challenges of EUVL insertion into high-volume manufacturing (HVM).
Silicon carbide (SiC) semiconductors will see 38% CAGR through 2022 thanks to power and efficiency advantages over silicon devices, according to MarketResearch.com.
The IDE Group developed the STC series of Active Vibration Isolation Systems supporting OEMs in the production of 450mm wafer equipment.
Maxim is spending $200 million to upgrade and expand its US semiconductor manufacturing facilities in San Antonio and Dallas, TX; Beaverton, OR; and San Jose, CA. Maxim manufactures about 50% of its products in the US.
Cambridge NanoTech entered a licensing agreement with Ghent University in Belgium to commercialize an ALD particle coating technology that uses thermal and plasma processes.
Microelectronics industry standards developer JEDEC Solid State Technology Association published key updates to its Universal Flash Storage (UFS) standard, specifically tailored for mobile applications and computing systems requiring high performance and low power consumption.
Semiconductor manufacturers identified key factory productivity challenges that need to be addressed and shared effective solutions they will need to stay leading-edge and competitive amid turbulent industry transitions during the recent ISMI Manufacturing Week.
Applied Materials introduced a new dielectric etch system called the Centura Avatar, which can etch holes and trenches in complex film stacks with depth to width aspect ratios of up to 80:1. It is designed to meet new requirements in creating 3D memory architectures.
Integrated Silicon Solution, Inc. (Nasdaq:ISSI) plans to acquire all the outstanding shares of Chingis Technology Corporation pursuant to a cash tender offer valued at $33 million.
IBM is raising its full-year operating earnings per share expectations to “at least $15.10,” said Ginni Rometty, IBM president and CEO, citing H1 performance and IBM’s ability to deliver “greater value to a wider range of clients” for the $0.10 increase.
With 18.9% revenue growth, third-party semiconductor intellectual property (SIPs) seem to have had a good year in 2011. However, Semico reports, several very interesting trends in the SIP and broader SoC markets are hidden under the top-level numbers.
Intel reported Q2 revenue of $13.5 billion, operating income of $3.8 billion, net income of $2.8 billion and EPS of $0.54. The company lowered its Q3 guidance, citing “a more challenging macroeconomic environment.”
IC Insights’ latest survey and ranking of the major semiconductor capital spenders shows that only 6 of the 35 major semiconductor suppliers -- Intel, Samsung, Hynix, TSMC, UMC, and Rohm -- with significant capital expenditure budgets are expected to spend more in 2012 than they did in 2011.
Sonoscan unveiled its Lab Model 9600 C-SAM acoustic micro imaging system to serve laboratory/failure analysis applications and for use in low-volume semiconductor production inspection.
BSE Tech, a BSE Group company, sold diffusion equipment for front-end semiconductor production to Microchip Technology Inc. The equipment will be used in the production of PIC microcontrollers in Microchip’s Tempe, AZ, fab.
SEMICON West kicked off with a surprise announcement regarding Intel's investment in ASML, but generally the event highlighted trends “as expected” in the fab supply chain, say Barclays analysts.
Cymer is seeing adoption of its focus drilling technology for ArF immersion light sources and SmartPulse data management tool for light source performance monitoring, both introduced in 2011.
Dr. Stephen Woo, president of Samsung Electronics’ Device Solutions will keynote the 2013 International CES, January 8-11 in Las Vegas, NV, hosted by the CEA.
Terry Brewer, one of the newest members of SEMI's North American advisory board, talks about semiconductor industry consolidation, as well as new technologies and materials in the industry. He shares how SEMI is reacting to this evolution.
NOR flash memory sales growth may be tapering off in mobile handsets/smartphones, but embedded applications in the tablet, automotive, and industrial markets are picking up the slack, says IHS.
Bruker introduced three 450mm X-ray and AFM semiconductor metrology tools -- the InSight-450 3DAFM, the D8 FABLINE X-ray system, and the S8 FABLINE-T X-ray system -- during SEMICON West.
The overriding message for 2012 is that the roadmap has been largely
stabilized with the significant changes that were input last year in the
2012 publication,” said Intel’s Alan Allan, speaking at Semicon West.
Newport Corporation introduced a line of high-performance air bearing stages specifically designed for the 450mm semiconductor wafer initiative.
At SEMICON West, SEMI honored six industry leaders for their outstanding accomplishments in developing standards for the microelectronics and related industries.
SEMICON West’s Day 2 keynote speaker represented a fabless company: Ivo Bolsens, PhD, SVP and CTO of Xilinx presented on how programmable chips and innovative packaging can advance semiconductors.
CEA-Leti presented research updates alongside SEMICON West this week. After the talks on device architecture, 3D and 2.5 packaging interconnects, large-scale computing and power consumption, and more, CEA-Leti’s researchers joined Solid State Technology to talk about their fields of interest.
Barclays Capital is seeing various reasons for a Q3 2012 semiconductor fab order/shipment pull-back, following meetings around SEMICON West 2012. The analysts expect strong orders in Q4.
Industrially proven and robust, picosecond lasers are proving their worth in cutting and patterning of delicate materials for a wide variety of industrial applications.
Sanjay Rajguru, director of ISMI, will present “Tool Obsolescence and the Impact on 200mm Manufacturing” at The ConFab 2012’s final session, Maximizing the Longevity of Investments.
Dr. Vivek Bakshi blogs about trends he expect to see at the upcoming 2012 International Workshop on EUV Lithography, in Maui Hawaii.
SouthWest NanoTechnologies (SWeNT) released SG65i, a single-wall carbon nanotube product with >95% semiconducting concentration, before secondary processing to remove metallic SWCNT content.
Picosun Oy delivered a second PICOSUN ALD tool to Uppsala University’s Ångström Laboratory in Sweden for work on surface treatment of carbon nanostructures, transition metal and compound semiconductor thin film manufacturing, and ultrathin polymer layer deposition on various substrates.
Element Six, maker of synthetic diamond supermaterials, opened its first US manufacturing facility in Silicon Valley, housing production, technical, and customer service.
KLA-Tencor Corporation (NASDAQ:KLAC) measures a 70% increase in fab process steps from 90nm to 32nm semiconductor nodes. This doubles the critical inspection steps required, report Citi analysts.
Stanford University researchers, sponsored by Semiconductor Research Corporation (SRC), have created contact hole patterns for logic and memory semiconductors using a next-generation directed self-assembly (DSA) lithography process.
Flash memory chip maker Spansion Inc. (NYSE:CODE) debuted its first family of single-level cell (SLC) NAND products using 4Xnm floating-gate technology. Spansion plans to roll out 3X and 2Xnm node versions of the NAND chips in the near future, without obsoleting the more mature designs.
At The ConFab 2012, fabless companies and foundries have a common goal: reduce power, increase performance and reduce price (not necessarily in that order).
Naoya Hayashi, research fellow for electronic device operations at Dai Nippon Printing, speaks with Solid State Technology chief editor Pete Singer during The ConFab 2012. Hayashi presented “NGL Mask Readiness” in The ConFab’s session on technology trends.
Chip scaling will go on for the foreseeable future, enabling new product with more compute power, more memory, faster on-chip communication. That was one of the conclusions put forth by imec’s An Steegen, speaking on technology trends at The ConFab 2012.
Semiconductor manufacturing facilities dramatically decreased their normalized fab energy consumption from 1997 to 2011, shows ISMI's Worldwide Fab Energy Study.
Jim Feldhan of Semico speaks with Solid State Technology editor-in-chief Pete Singer about expectations for the semiconductor industry and solid-state drives.
John Chen of Nvidia gave the opening keynote address of The ConFab 2012, presenting the concept of a “virtual IDM” comprising fabless companies, semiconductor foundries, and packaging houses working seamlessly together. After his speech, Chen caught up with Pete Singer.
Dan Hutcheson, VLSI Research Inc. spoke with Solid State Technology editor-in-chief Pete Singer at The ConFab 2012. Hutcheson presented on the cyclical nature of the semiconductor industry.
At The ConFab’s opening session, “The Economic Outlook for the Semiconductor Industry,” capex was a major point of interest. Jackie Sturm of Intel, Dan Hutcheson of VLSIresearch, and Jim Feldhan of Semico all touched on it, with Hutcheson expanding on the idea of capex trends to present an entire ecosystem of semiconductor business management.
The ConFab’s sessions opened with “The Economic Outlook for the Semiconductor Industry,” featuring Jackie Sturm of Intel, Dan Hutcheson of VLSIresearch, and Jim Feldhan of Semico.
The ConFab 2012, Solid State Technology’s invitation-only meeting of the semiconductor industry, opened today in Las Vegas with a keynote address from John Chen, PhD, VP of technology and foundry operations at Nvidia Corporation.
W. L. Gore & Associates and CT Associates developed a method for measuring <50nm particles in ultra-pure water (UPW) used in semiconductor processes, and removing particles as small as 12nm, through a combination of ultrafiltration and microfiltration.
Cymer presented at Barclays Capital’s TMT Conference, providing information on semiconductor makers’ transition from deep ultra violet (DUV) to extreme ultraviolet (EUV) lithography, pre-pulse technology demonstrations, and more.
AKHAN Technologies will collaborate with the Center for Nanoscale Materials at Argonne National Laboratory to fully characterize Miraj Diamond devices and materials, which are made by doping n-type diamond and can be used in the semiconductor industry.
A*STAR Institute of Microelectronics and NXP Semiconductors (NASDAQ:NXPI) will collaborate on 200mm GaN-on-Si process and technology development for high-voltage power devices.
The next big thing according to Charlotte Soens, manager mm-wave communication program at imec, is that people will start using these mobile devices to watch high-quality photos and videos, stored in the cloud. Soens presented details at imec's International Technology Forum.
At imec's International Technology Forum, An Steegen, Senior Vice President Process Technology at imec, discusses the three technology knobs that are key for a further system scaling.
At imec's International Technology Forum, the research consortium's CEO, Lec van den Hove, draws attention to the need for the industry to solve the world's health problems.
THE BEST rankings from VLSIresearch identify the highest-rated suppliers of wafer processing, assembly, and test equipment. Check out the top-rated suppliers of wafer processing equipment, by company size and customer ranking.
At imec's International Technology Forum, SEMI's Denny McGuirck describes how Moore's Law has been the major driver in the semiconducotr industry.
VLSIresearch polled semiconductor manufacturers about their tool suppliers, asking chipmakers to rank equipment providers on customer satisfaction. This year’s results show renewed focus on fab needs.
Intel's Jackie Sturm will bring to light some of the emerging, growth markets for semiconductors, and what they mean for chipmakers and the fab suppliers in the first session of The ConFab, “The Economic Outlook for the Semiconductor Industry.”
The market for power management semiconductors grew for 7 quarters before declining grossly in Q4 2011, flattened in Q1 2012, and is now “on its way to discernible growth in Q2,” reports IHS.
Blogger Michael A. Fury, Ph.D., Techcet Group, reports on Day 2 of SEMICON West with insights from the Sokudo Lithography Forum and NCCAVS CMPUG meeting, and -- sadly -- none on SEMICON West’s Happy Hour.
A group of unsecured Elpida bondholders filed documents indicating an alternative proposal to Micron's acquisition of Elpida Memory’s assets. Barclays Capital believes the counter move is unlikely to have a material impact on the actual outcome. Here's why.
Pall Corporation, filtration, separation and purification technology provider, joined the International SEMATECH Manufacturing Initiative (ISMI) program on equipment productivity and factory automation projects to address equipment stability and sustainability challenges as well as next-generation processing issues.
Rudolph Technologies launched the MetaPULSE FP thin film metrology system with an initial sale to a major manufacturer of flat panel displays (FPD) for handheld mobile devices.
Solid State Technology and SEMI announced the Best of West Award winner -- Jordan Valley Semiconductor -- during SEMICON West today. Jordan Valley Semiconductor’s QC-TT defect inspection system predicts breakage in 450mm wafers, which are subject to more handling steps and more thermal stresses due to their larger size.
ATMI Inc. (NASDAQ-GS:ATMI) entered into a joint development agreement with IBM to address critical wet process challenges at the14nm semiconductor node and smaller.
In this video interview, Intel's Shekhar Borkar shares some key topics from SEMICON West keynote: Near-threshold voltage transistor designs, 3D integration for DRAM, unconventional interconnect, and more.
Barclays Capital analysts share observations from meetings with semiconductor manufacturing tool suppliers at SEMICON West, noting the enthusiasm and concrete deals around EUV lithography and transitioning to the 450mm wafer size.
ASM International (ASMI) launched advanced deposition systems for epitaxy, PEALD and PECVD. The 2 tools enable high-volume 300mm wafer processing for 20nm and smaller nodes and 3D transistors.
Michael A. Fury, Ph.D., reports on the opening day of SEMICON West (July 10), covering exaflop computing, FDSOI, TSV and other integration schemes, and silicon photonics with CEA-Leti.
Luc Van den hove, president and CEO, imec, spoke with Solid State Technology, covering imec’s major announcements and research presentations to take place during SEMICON West 2012.
ATMI introduced BrightPak, its next-generation liquid containment and delivery system for high-value liquid material transfers during advanced photolithography processes in semiconductor, FPD, and LED manufacturing.
Semiconductor equipment sales will reach $42.4 billion in 2012, according to the mid-year edition of the SEMI Capital Equipment Forecast, released at SEMICON West 2012.
Michael A. Fury, Ph.D., reports from the pre-opening day (July 9) of SEMICON West at the Moscone Center in San Francisco, CA. The first day hosts SEMI’s press conference on semiconductor revenues and the SEMI/Gartner Market Symposium.
SMART Storage Systems, solid-state drive (SSD) technology developer, will open an R&D facility in Longmont, CO, to support hardware and software innovation for SSD products and company growth.
ASML established a program to enable its largest customers to make minority equity investments in the semiconductor manufacturing tool maker. The program includes commitments to fund ASML's R&D spending, accelerating development of EUVL and 450mm technology for 2015-2020 timeframe.
SEMI’s annual Board of Directors election results are in, with new directors Jifan Gao, Trina Solar; Nobu Koshiba, JSR Corp.; Sue Lin, Hermes-Epitek; and Natsunosuke Yago, Ebara Corp., joining.
imec will build a 450mm wafer fab cleanroom at the research organization’s site in Belgium, with a new EUR100 million Belgian investment. We caught up with Luc Van den hove of imec to discuss the implications for semiconductor manufacturing at 450mm, how to build a 450mm-capable cleanroom, and more.
Following are some of the new and flagship products that will appear this week at SEMICON West, July 10-12 in the Moscone Center of San Francisco, CA.
With Micron Technology Inc. (Nasdaq:MU) acquiring bankrupt DRAM maker Elpida Memory Inc.’s assets for 200 billion Yen (approximately US$2.5 billion), several analysts are looking at the move and how it affects the DRAM manufacturing landscape, as well as the Flash memory sector.
Gigaphoton Inc. will uncrate “s” series hardware and software products in Q3 2012, enhancing lithography exposure performance and reducing operating costs and downtime of the GT6xA ArF excimer laser series for multi-pattern immersion lithography scanners.
We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco.
Ushio launched its thinnest UV irradiance meter 'UIT-q365." The meter is 4.9mm thick, used to keep major UV processes within spec. It can be used during optical film manufacturing for flexible electronics, as well as during adhesion of precision optical parts.
Vantage Technology formally qualified its SlurryScope System for analysis of undiluted slurry used during CMP at major IC production fabs.
Semiconductor maker Renesas Electronics Corporation (TSE: 6723) will reorganize, in “urgent need of business recovery,” reforming semiconductor fabs in Japan and “streamlining employees.”
Semico Research has just updated its 2012 semiconductor industry forecast. Semico’s semiconductor growth forecast has stayed between 8 and 10% over about a year. The latest update holds Semico’s forecast at the bottom of that range: 8.6%.
Gigaphoton Inc. reached a maximum of 5.2% EUV coversion efficiency (CE), beating the semiconductor manufacturing industry’s target of 5.0% for a first-generation EUV lithography scanner. These data show an average of 4.7% CE.
Toshiba Corp achieved double-digit growth that defied an industry-wide contraction in revenue in the Q1 2012 NAND Flash sector. Overall, Q1 NAND flash sales amounted to $4.99 billion, down 1% sequentially.
Linde Gases, a division of The Linde Group, will deliver on-site fluorine (F2) for SK Hynix Inc., under a new long-term supply contract for multiple volume semiconductor production sites in Korea.
Dr. Vivek Bakshi blogs about an upcoming SPIE journal, the Journal of Micro/Nanolithography, MEMS, and MOEMS (JM3), which has a focus on EUV sources.
In the second installment in a series called Process Watch, the author provides tips on how to make sure you’re reviewing the yield killing defects and not wasting time reviewing nuisance events. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions for chip manufacturing at the leading edge.
STMicroelectronics announced that GLOBALFOUNDRIES has agreed to manufacture devices for ST using ST’s proprietary Fully Depleted Silicon-on-Insulator (FD-SOI) technology in both the 28nm and 20nm nodes.
Freescale Semiconductor (FSL) named Gregg A. Lowe president and CEO, replacing Rich Bayer. Lowe joins Freescale from Texas Instruments (TI, TXN), where he was SVP and manager of the Analog business.
Semiconductor stockpiles held by chip suppliers increased during Q1 2012, but the rise in inventory for a second straight quarter was driven by the anticipation of higher demand from customers, according to IHS.
Tom Jefferson, G450 Consortium, shares an update on 450mm wafers for semiconductor manufacturing. The consortium is adding staff and ramping its silicon supply, and getting ready for equipment selection.
Bill Tobey, president of ACT International Consulting, speaks about the evolution of extreme ultra violet (EUV) lithography at The ConFab 2012.
Worldwide sales of semiconductors hit $24.1 billion in April 2012, a 3.4% increase from March and the largest month-over-month growth for the industry since May 2010, reports the SIA.
Applied Materials introduced the Applied Varian VIISta Trident single-wafer, high-current ion implant system, which embeds dopant atoms on 20nm semiconductor wafers at high yields.
Bill Ross, ISMI, is moderating a session today at The ConFab 2012 on managing legacy semiconductor fabs and dealing with tool and materials obsolescence at 200mm and smaller. He speaks with Pete Singer about coping with these changes.
Texas Instruments Incorporated (TI, NASDAQ:TXN) announced Q2 2012 revenue of $3.34 billion, and expects Q3 to be about flat. Fab under-absorption charges will weigh on TI in Q3 and into Q4, analysts point out.
Optomec’s Aerosol Jet deposition tools are being used for printed sensor, display, solar cell, CMOS and passive devices, and other development areas, with new installations at CEA Liten (France), Innovation Lab (Germany) and the University of Sheffield (UK).
Texas Instruments Inc. (TI) leads the fast-growing industrial electronics semiconductor market, growing its market share in 2011 in large part due to its acquisition of National Semiconductor, according to IHS.
Apple Inc. is not only the world’s leading original equipment manufacturer (OEM) in terms of semiconductor purchasing, its also is increasing semiconductor buying at a faster rate than other top firms, reports IHS.
While communications make up the bulk of analog IC sales, growth is coming from automotive, energy, mobility, and medical/healthcare apps, according to Semico. This semiconductor sector is also moving to 300mm wafer production at smaller device nodes, which offers cost advantages.
AIXTRON SE introduced a 5 x 200mm gallium nitride on silicon (GaN-on-Si) reactor design for its G5 Planetary Reactor MOCVD platform. AIX G5+ comprises special reactor hardware and process design, developed with customers in AIXTRON’s R&D lab.
GLOBALFOUNDRIES will add 90,000 more square feet of semiconductor manufacturing space to Module 1 of Fab 8 in NY. The completed semiconductor manufacturing area will total 300,000sq.ft.
Micron is more than doubling its DRAM manufacturing capacity by buying bankrupt Elpida Memory’s assets. But the move is “not without risk,” according to IHS.
Mattson Technology installed its paradigmE etch system at a major foundry, expanding the tool's customer base.
One year after ramping Fab 5 at the site, Toshiba will reduce its NAND Flash memory semiconductor production at its Yokkaichi Operation fab in Mie Prefecture, Japan.
SEMI recently conducted a survey of semiconductor fab equipment and materials suppliers, finding that 60+% of respondents say that IP challenges have had an adverse impact on their companies.
SiC is a niche material for semiconductor, power electronics, and LED manufacturing. Yole analyzed patents related to SiC growth and wafer manufacturing to glean trends in production, R&D, top companies, barriers to entry, and more.
The automotive IC market will grow 8% this year, to $19.6 billion, reports IC Insights. Semiconductor content per vehicle is increasing to $380 in 2012, up 9% from 2011. And the growth will continue in the near future.
Qualcomm (QCOM) announced results for Q3 of fiscal 2012. Qualcomm reduced its outlook for semiconductor volumes in fiscal Q4. CEO and chairman Dr. Jacobs pointed out that QCOM is ramping 28nm chip supply, aiming for a strong December quarter.
Pacific Biosciences of California will join imec in a multi-year research collaboration focused on the development of advanced microchips for highly multiplexed single-molecule genetic analysis. Pacific Biosciences brings its proprietary zero-mode waveguide technology; imec is contributing expertise in nanophotonics, CMOS sensors, technology integration and fabrication.
SRC-sponsored researchers developed new sensor-based metrology technology that can significantly reduce water and related energy usage during semiconductor manufacturing.
RED Equipment’s Carl McMahon suggests a different model for handling secondary semiconductor equipment for greater efficiency, cost reduction and quality control: full turnkey services engineered to the fab’s needs without the expense of customization.
IPC and JPCA released their first operational-level standard for the printed electronics industry, defining terms and establishes basic requirements for substrate materials used in printed electronics: ceramic, organic, metal, glass and other.
"Following seven months of increases, the three-month average bookings declined in June and likely reflects some slowing in investment plans attributed to weaknesses in the broader economy," said Denny McGuirk, SEMI. "While order activity may slow, equipment spending this year will continue to be directed towards advanced technologies in wafer processing and packaging assembly."
AMD reported a “challenging” end to Q2, with president and CEO Rory Read citing "overall weakness in the global economy, softer consumer spending and lower channel demand for [AMD] desktop processors in China and Europe.”
A multidisciplinary research team at MIT and the Universidad Autónoma de Madrid developed a new mathematical approach to simulating the electronic behavior of noncrystalline materials, with applications in OLEDs, flexible printable organic electronic circuits, and solar cells.
Rudolph Technologies Inc. (NASDAQ:RTEC) acquired the assets of NanoPhotonics GmbH, adding inspection technology and an intellectual property (IP) portfolio to serve its advanced package inspection tool customers.
MicroSense reports an increase in orders for its MRAM magnetic metrology systems. The metrology tools characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM.
Ultratech Inc. (UTEK) shipped its 50th laser spike anneal (LSA) system, with an order from a major Asian foundry.
Qcept Technologies Inc. has received more than 30 orders from 8 customers for its new ChemetriQ Inspection Services (Q-Services), which enable semiconductor manufacturers and equipment vendors to begin implementing non-visual defect (NVD) inspection programs tailored to their needs prior to purchasing a Qcept ChemetriQ NVD inspection system.
The 2012 TechConnect World Summit, Expo & Showcase opened Tuesday, June 19, 2012 at the Santa Clara Convention Center. The event serves as host to the National Innovation Showcase, whose mission is to accelerate the commercialization of “the world’s top innovations.”
In a webcast scheduled for June 27th at 1:00 Eastern, 11:00 Pacific, David McCann of GLOBALFOUNDRIES will provide a status report on advanced packaging and 3D integration. McCann is responsible for Packaging R&D and back-end strategy and implementation at GLOBALFOUNDRIES.
In mid-2011, semiconductor manufacturing and assembly equipment supplier Applied Materials (NASDAQ:AMAT) acquired Varian Semiconductor Equipment Associates Inc. Now, the company is adding Varian’s former CEO Gary Dickerson as president.
Mitutoyo America Corporation launched the Surftest SJ-411/412 portable surface roughness tester, conforming to roughness standards JIS-B0601-2001, JIS-B0601-1994, JIS-B0601-1982, VDA, ISO-1997 and ANSI.
Barclays Capital analysts say DRAM benefits from a supply discipline that was bolstered by oligopoly/DRAM consolidation and the Elpida bankruptcy; robust demand growth from non-PC applications (server/mobile DRAM bit demand to exceed PC for the first time in 2013E); and potential for additional positives related to Elpida (Hiroshima/Rexchip converted to non-DRAM).
Some of the new and flagship wafer fab products and supporting facility products, like vacuum valves, that will be on the show floor at SEMICON West, from ion implant to MOCVD traps and gas blenders.
The management committee of Samsung Electronics authorized the KRW2.25 trillion investment for construction of a new production line serving Samsung’s System LSI business.
H-Square Corp introduced its 450mm Ergolift for handling new 450mm semiconductor wafer FOSB/MACs, which can weigh more than 60lbs.
Canon U.S.A. Inc. introduced the FPA-6300ES6a DUV stepping scanner, a lithography tool with a KrF excimer laser light source for the high-volume production of memory, logic and image-processing devices.
Cache SSDs will remain the mainstream ultrabook storage solution, says IHS, even as hybrid HDDs offer some consolidated storage advantage. Hybrid HDDs use a built-in layer of NAND flash memory.
imec and Panasonic Inc. have entered into the next phase of a comprehensive and broadened collaboration agreement for joint R&D on healthcare, wireless communication, flexible electronics and advanced CMOS process technologies.
Older production facilities face equipment obsolescence; skills obsolescence; scarce availability of parts, software, and support; and equipment capability extension and tool re-use. At the ConFab 2012 Executive Roundtable, representatives from Sematech/ISMI, IDMs, OEMs, equipment dealers, and industry consultants gathered to have an open discussion on concerns, roadblocks, and possible solutions.
MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.
Semiconductor manufacturing equipment billings and bookings were virtually tied in Q1 2012, reports SEMI, with $10.61 billion in billings and $10.07 in bookings. This is a 13-14% improvement sequentially, and 9% below the same quarter last year.
Researchers at Rice U. and the Université catholique de Louvain in Belgium have devised a method for converting discarded silicon into a key material for lithium-ion batteries.
As the dust settles after the launch of the iPhone 5, analysts tally which suppliers in the semiconductor ecosphere are most likely to gain the most.
DAS Environmental Expert says it has a new system that offers a more environmentally friendly way to clean waste process gases produced in LED manufacturing.
Dow Electronic Materials introduced its new IKONIC polishing pad platform for chemical mechanical planarization (CMP).
The National Institute of Standards and Technology (NIST) says it's combined scanning techniques and statistical data to both more precisely and less expensively measure features on a chip -- and two big chip firms are already on board.
Samsung Electronics Co., Ltd. has held a groundbreaking ceremony for a new leading-edge NAND memory fab line in Xi'an, China, to be fully on line by 2014 making "10nm-class" process technologies.
Samsung Electronics Co., Ltd., held a groundbreaking ceremony for a major new memory fabrication line in Xi'an, China. Once completed, the new facility will make use of advanced 10-19nm technology to produce NAND flash memory chips, according to the company.
Global demand for semiconductor manufacturing equipment slipped -4% in 2Q12 with softness in just about every region -- except Taiwan which stepped on the pedal during the quarter, according to updated data from SEMI and SEAJ.
Researchers at the Norwegian University of Science and Technology in Trondheim (NTNU) have patented and are commercializing GaAs nanowires grown on graphene.
A team led by University of Toronto physicists has developed a simple new technique using Scotch poster tape that has enabled them to induce high-temperature superconductivity in a semiconducto.
Semiconductor Research Corporation (SRC) recognized two outstanding professors in SRC-supported, chip-related research and education for 2012.
Stakeholders in LED manufacturing have met with US Department of Energy officials to plead their case for increased support in solid-state lighting (SSL) R&D and manufacturing, asserting that the technology's energy conservation benefits and ROI surpasses those of renewable energy technologies that get much more backing.
Demand for power management semiconductors recovered in 2Q12 after declining for half a year, thanks to strong demand from electronic products such as smartphones and media tablets, according to IHS iSuppli.
Taiwan's two biggest semiconductor foundries saw sales jump in August, and business for the full third quarter is looking up as customers pull in some orders.
Taiwanese DRAM manufacturer Nanya Technology has received a $27M equity investment from a subsidiary of Integrated Silicon Solution to bolster the companies' foundry partnership.
Analysts weigh the reasons behind Intel's downwardly-revised 3Q12 results, from macroeconomic sluggishness to tablet-PC cannibalization -- and whether its pullback in 2012 capex plans spells trouble for the market overall.
While various industry segments appear to be tapping the brakes, others are revving their engines, observes SEMI's Christian Gregor Dieseldorff -- and a 2012 stall could pave the way for a record-breaking 2013.
GaAs epitaxial substrate production rose just 3% in 2011 as handset power amplifiers offset a shift away from GaAs for handset switches, but inside that slowing slope are two key market drivers, according to Strategy Analytics.
Spending on R&D by semiconductor companies worldwide is expected to grow 10% in 2012 to a record $53.4 billion, as companies all across the ecosystem try to keep up with more complex IC designs and new process technologies, according to data from IC Insights.
Taiwan-based SemiLED says it has replaced two top execs, weeks after posting another quarter of weak financials and a patent litigation settlement that restricts its product sales in the US.
Despite the gloomy economy and softness in consumer LCD products, suppliers of thin-film transistor liquid crystal displays (TFT-LCD) expect moderate 8%-13% growth in sales and shipments in 2012, according to DisplaySearch.
Global semiconductor sales totaled $24.34B in July, a scant 0.2% increase from the prior month and down -1.9% from a year ago, as macroeconomic challenges weigh down demand particularly in Europe and the Americas, according to the latest monthly data from the Semiconductor Industry Association (SIA).
Singapore's Institute of Microelectronics (IME) and MOSIS have signed a memorandum of understanding (MOU) to offer a multiple-project wafer service targeting silicon integrated photonics.
Three leaders in their respective fields have formed a technology alliance to bring a new glass cutting technology to market. InnoLas Systems GmbH licensed process technology developed by FiLaser LLC and will use ultra-short pulse lasers produced exclusively for InnoLas by LUMERA LASER GmbH.
Researchers from IBM and ETH Zurich revealed the first-ever direct mapping of the formation of a persistent spin helix in a semiconductor. This discovery answers the physics question as to whether electron spins possess the capability to preserve encoded information long enough before rotating.
Hong Kong X’tals Ltd, part of the Kolinker Group, has acquired a 40% shareholding in IQD FOQ GmbH, the specialist OCXO manufacturing division of IQD, for an undisclosed sum.
Emerging technologies in printed, flexible, and organic electronics are poised to reduce costs in the $300 billion global medical device market as governments, insurers and patients seek to bring down healthcare costs, according to Lux Research.
Propelled by strong sales to tablet and cellphone manufacturers, AKM led the semiconductor magnetic sensor market for the third year in a row in 2011. Of the top-10 magnetic sensor suppliers, Memsic saw the highest growth: 1340%.
Laser nanofabrication can now meet the needs of submicron and nanoscale feature size manufacturing, and can operate in air, vacuum, or liquid processes. Sister publication Industrial Laser Solutions recently published Laser nanofabrication: A route toward next-generation mass production.
In this SEMI News and Views blog, Karen Savala covers EUV lithography, 450mm wafers, and 3D IC developments, based on her recent presentation at SEMICON West, “Supply Chain Readiness in an Era of Accelerated Change.”
Liam Madden of Xilinx, Inc. has joined the advisory board of The ConFab, Solid State Technology and PennWell's event focused on the economics of semiconductor manufacturing.
Following a lackluster period of average annual market growth in the semiconductor industry, a significant upturn is in store for the next five years, according to IC Insights.
The field of power electronics, the application of electronics for the control and conversion of electric power, is underpinned by basic electrical principles that were established in the distant past by the pioneers of electrical science. But today, the need to supply, modify and control the voltage, current or frequency of electric power arises in a vast number of applications and products spanning a huge range in terms of power handling capability.
AIXTRON launched the PRODOS-200 PVPD system for deposition of organic thin film materials, used to make OTFT displays and OLEDs, and in other manufacturing applications.
ARM and Cadence announced the availability of the first in a series of combined solutions enabling designers to improve performance, power and time-to-market for ARM's processor-based system-on-chips (SoCs).
Citing continued financial struggles in Europe, an inventory buildup at TSMC, and lower US GDP, Semico revised its 2012 semiconductor industry forecast from 8-10% to 6-8%.
Global smartphone applications processor revenues grew 55% Y/Y in Q1 2012, reaching $2.47 billion, according to Strategy Analytics. Qualcomm dominates in revenues and units sold, though it faces increasing competition.
The biggest change in the DRAM industry in 2012 has been Micron’s acquisition of Elpida. One key asset for Micron is mobile DRAM, which is growing in adoption thanks to integration into smartphones and tablets.
Researchers at the National Institute of Advanced Industrial Science say they have devised a way to selectively and nondestructively evaluate molecules within a sealed organic light-emitting diode (OLED) in operation, in hopes to further understand and eventually minimize performance degradation.
Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.
Soitec and Shin-Etsu Handotai (SEH) have extended their cooperation in Soitec's Smart Cut technology with an extended 10-year licensing agreement, including a new level of joint technology cooperation, to facilitate development and wafer supply of silicon-on-insulator (SOI) wafers.
Azzurro and Epistar say they have achieved GaN-on-Si based high-brightness LEDs on 150mm GaN-on-Si substrates, billed as "one step further towards implementation in mass production."
Devan Iyer, director of Semiconductor Packaging in Texas Instrument’s Manufacturing Group, has joined the advisory board of The ConFab.
EUV Symposium host imec and a pair of industry analysts gauge the pace of improvements in EUV lithography and its long march toward production readiness.
At the recent imec International Technology Forum Press Gathering in Leuven, Belgium, imec CEO Luc Van den hove outlined uses in blood cell sorting, mobile apps for personalized medicine (such as brain monitoring of EEG activity), and advanced bio research.
Imec, Holst Centre and Panasonic have developed a new prototype of a wireless EEG (electroencephalogram) headset.
Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”
Imec, the research consortium in Leuven, Belgium, plans to start construction of a 450mm pilot line next year, with early production focused on sub-10nm devices starting at the end of 2016.
Solvay Specialty Polymers USA LLC has extended its line of high-performance polyester compounds with a new version targeting light-emitting diode (LED) TVs with higher heat and light stability.
Global semiconductor market revenue in Q2 2012 fell by 3% Y/Y to $75.2 billion, and grew sequentially <3%, resulting in widespread revenue declines for chip suppliers, particularly those headquartered in Japan and Europe, according to IHS.
H2 2011 saw slow growth for gallium arsenide (GaAs) substrates in semiconductor and related devices, as well as a shift away from GaAs as a handset switch technology. However, the March 2011 earthquake and tsunami in Japan disrupted the supply chain, driving up substrate pricing and overall revenue to nearly $230 million.
JP Sercel Associates' new IX-6100-MD can scribe and dice a variety of metal layers and alloys used in LED manufacturing.
Semiconductor foundry United Microelectronics Corporation (NYSE:UMC; TWSE:2303) will close its fab operation in Japan through the dissolution and liquidation of its wholly-owned subsidiary, UMC Japan.
Learn about the changes in semiconductor manufacturing as well as related markets -- photovoltaics, displays, LEDs, etc -- at the 2012 Strategic Materials Conference (SMC), to be held on October 23-24 in San Jose, CA. SEMI reports.
ASMC 2013, the leading international technical conference for exploring solutions to improve collective microelectronics manufacturing expertise, has issued a call for papers.
FEI will pay $15M to settle the dispute over focused ion beam systems, in exchange for dropping litigation and cross-licensing FIB technologies.
An unnamed "major Asian customer" will use Aixtron's Prodos polymer PVD tool to deposit organic polymer thin films for production of flexible electronic devices.
IEEE has awarded a prestigious IEEE Milestone in Electrical Engineering and Computing award for the floating gate electrically erasable programmable read only memory (EEPROM), a significant technological innovation that enabled data storage in Flash memory.
Several news reports say that Micron Technology Inc. (Nasdaq:MU) will pay an incremental Yen 80 billion above the previously agreed upon price for debt guarantees at Elpida. But interpretations are not all the same.
A ranking of the forecasted top 2012 12 IC foundries (pure-play and IDM) was released by IC Insights.
Samsung Austin Semiconductor LLC says it will spend "about $4 billion" to renovate and retrofit its existing facility for "full system LSI production," mainly to produce mobile SoCs on 300mm wafers using 28nm process technologies.
Applied DNA Sciences, a provider of DNA-based anti-counterfeiting and security solutions, was named by the DoD Defense Logistics Agency as the provider of authentication services for microcircuits supplied by defense contractors.
Big data, 3D printing, activity streams, Internet TV, Near Field Communication (NFC) payment, cloud computing and media tablets are some of the fastest-moving technologies identified in Gartner Inc.'s 2012 Hype Cycle for Emerging Technologies.
Augmented reality (AR) is a disruptive yet nascent technology. According to Semico, AR will increase demand for NAND and mobile DRAM memory, as well as other technologies.
Barclays Capital analyzed the underlying factors for current NAND prices, and where the NAND industry is expected to go in the near future. Factors include the Apple Inc. iPhone 5, reduced NAND production at key chipmakers, and changes to the DRAM sector, among other influences.
Scientists at Fraunhofer Research Institution for Modular Solid State Technologies EMFT, together with Ketek GmbH, have developed a novel, silicon-based optical sensor component called a silicon photomultiplier (SiPM).
Matheson has acquired a majority stake in RASIRC, supplementing its gas purification and material businesses with RASIRC's water vapor systems.
Bruce Kleinman, former VP of platform marketing at Xilinx, will now lead GlobalFoundries' product marketing efforts
Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, is poised to celebrate its 30th anniversary at its annual TECHCON conference Sept. 10-11.
Western Digital and Seagate Technology enjoy record sales of hard-disk drives after Thai flood recovery efforts, and the rivalry heats up amid questions about PC demand.
FEI announced two new Helios NanoLab systems, the 450HP and 1200HP DualBeam systems, which include new capability that meets the critical requirements for semiconductor process development at the 28nmdevice geometry node and below.
Two extensions to Brooks Automation's vacuum quality monitoring (VQM) components make it easier to measure gases and conditions inside a vacuum chamber.
SEMI's new "450 Central" information portal offers news and perspectives about the 450mm wafer-size transition.
Lithography leader ASML completes its Co-Investment Program, tallying €3.85 billion in equity funds and €1.38B to support R&D into EUV and 450mm.
IHS iSuppli now predicts a decline in global semiconductor revenues in 2012, the first since 2009, due to a weakening economy that has eroded demand for PCs and related components.
TSMC joined IMS’s multibeam mask writer development collaboration to develop an electron multi-beam mask writer for use in advanced mask lithography applications, joining founding members DNP, Intel, and Photronics.
MIT researchers are building various electronic components out of a 2D form of molybdenum disulfide (MoS2). This is the start of a “new realm” of research into 2D materials for electronic materials and devices, according to one researcher.
The Global Semiconductor Alliance (GSA) released the global semiconductor funding, IPO, and M&A statistics for July 2012, noting a steep ramp from June, but small decline from July 2011.
Rambus Inc. (NASDAQ:RMBS), a technology licensing company, will undergo a restructuring and related cost saving measures to cut its expenses by$30-35 million annually.
IBM (NYSE:IBM) will acquire Texas Memory Systems (TMS), a leading developer of high-performance flash memory semiconductors based in Houston, TX.
On a worldwide basis, Apple Inc. and other multinational OEMs may be the top semiconductor purchasers in 2012, but within the all-important Asia-Pacific region, locally based companies lead the pack when it comes to chip spending growth.
Microsemi (Nasdaq:MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, appointed James V. Mazzo to its board of directors.
AKHAN Technologies is sharing characterization data relating to its Miraj Diamond materials, gleaned in collaborative work with the CNM at Argonne National Laboratory.
Apple Inc. is expected to release the iPhone 5 this fall. FBR Capital Markets says the smartphone could be “one of the most important catalysts for the overall chip manufacturers and service providers, as well as competitors in the handset space.”
At a meeting of its Board, TSMC approved capital appropriations to expand and upgrade advanced technology capacity, and to construct a semiconductor fab building.
Printing is emerging as a technology that can replace traditional photolithography processes for electronics manufacturing, reducing costly material use, very complex processes, and expensive equipment.
National Central University (NCU) in Taiwan will use an AIXTRON MOCVD system to research GaN-on-Si power semiconductors.
SEMATECH researchers have deposited EUV multi-layers with as few as 8 defects per lithography mask, at 50nm sensitivity. The milestone shows that tool-generated defects during multi-layer deposition of mask blanks used for EUV lithography can be reduced enough to enable high-volume manufacturing.
GLOBALFOUNDRIES and ARM will jointly work to optimize SoC technology for ARM processor designs on GLOBALFOUNDRIES’ 20nm and FinFET process technologies, in a new multi-year agreement.
Bruker released the PeakForce Kelvin Probe Force Microscopy mode for its AFMs. PeakForce KPFM improves quantitative surface potential data for semiconductor metrology and materials research.
Worldwide silicon wafer area shipments increased during Q2 2012, compared to Q1 and to Q2 2011, reports SEMI’s Silicon Manufacturers Group (SMG).
Tokyo Electron Limited and FSI International entered into a definitive agreement under which TEL will acquire FSI for approximately $252.5 million.
GaN power device developer Transphorm Inc. has secured a $35M Series E financing round led by the Japanese government-backed Innovation Network Corporation of Japan (INCJ), and Nihon Inter electronic Company with whom it has signed a second-source manufacturing deal.
ON Semiconductor has joined imec to collaborate on the development of next-generation GaN-on-Si power devices. ON Semiconductor is presently building a GaN processing line in its Oudenaarde facility in Belgium Oudenaarde, and it is expected to employ GaN-on-Si technology.
Responding to consumer demand, TV suppliers are expanding their lineups of low-brightness LED backlight TVs with technology options that actually compete against each other more than traditional CCFL, according to DisplaySearch.
Applied Materials says it will reduce its work force by between 6% and 9% (900-1300 positions) amid a global realignment deemed necessary to achieve certain strategic objectives, freeing up to $190M annually "to fund key growth initiatives."
Fab equipment spending continues to soften in 2012, and hopes for a reprieve in 2013 are waning, warns one analyst.
Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy, the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.
Macroeconomic malaise continues to weigh down global semiconductor sales, although there's a possible ray of hope for a boost by year's end thanks to introduction of much-desired electronics devices (hello iPhone 5).
Intermolecular says that it is working with both GlobalFoundries and IBM to speed development of manufacturing technologies down to the 10nm node, using its High Productivity Combinatorial (HPC) technology.
Researchers at the U. of Illinois have devised a method to monitor a semiconductor surface as it is etched, in real time, with nanometer precision.
Axcelis Technologies said it has signed a five-year $30M contract with "one of the world's leading semiconductor manufacturers" to support its implant, cleaning, and thermal processing equipment at multiple fabs in the US.
Driven by market demand, the semiconductor industry is progressing toward consensus on building-block standards for automating LED production on 6-in wafers, explains Paula Doe in an article for SST sister magazine LEDs Magazine.
STMicroelectronics says it is using Samsung Electronics' foundry services for 32nm/28nm high-k/metal gate (HKMG) process technology, and have taped out a dozen system-on-chip devices.
Tezzaron Semiconductor is taking over SVTC Technologies' wafer fab in Austin, TX, amid reports that the semiconductor/MEMS development organization is cutting back activities in Austin and in California.
Researchers at Cornell have developed a new laser-based method for ultra-fast anneal of thin photoresist films. The research, sponsored by Semiconductor Research Corporation (SRC), has shown that the new anneal outperforms state-of-art hotplate bake for both 193nm and EUV lithography applications.
In an analysis of quarterly IC market growth rates, IC Insights pulls up an unusual phenomenon: the performance during the second calendar quarter takes the spotlight in years of better growth, which is counter to historical norms.
Want another snapshot of who's leading the pack among pure-play foundries, and who's falling off the curve? Look more closely at <45nm offerings, as framed by a recent analysis from IC Insights.
In an invited paper at the International Electron Devices Meeting, researchers from Everspin Technologies will describe how they built the largest functional ST-MRAM circuit ever built, a 64-Mb device with good electrical characteristics.
At the International Electron Devices Meeting (IEDM) in December, a team led by IBM will report on the world’s first high-performance hybrid-channel ETSOI CMOS device.The researchers built a ring oscillator circuit to benchmark performance that worked even better than FinFETs.
Even with the persistent troubles in global economics and various technology hurdles in advanced semiconductor manufacturing, IC market growth will continue to improve -- and the key is a shift away from what's been driving the market dynamics, explains IC Insights.
The Institute of Metal Research (IMR) at the Chinese Academy of Sciences has ordered a new Aixtron tool to support its research in carbon nanotubes and graphene technologies.
Semi-Gas Systems is now offering an automatic gas sampling system that eliminates operator touch time while certifying cylinders of blended gas mixtures.
The semiconductor equipment maker is battening down the hatches to reduce costs and improve profitability in the face of near-term macroeconomic conditions.
LFoundry says it will invest a total of €25 million in R&D and innovative projects over the next three years, thanks to " the materialization of several large-scale projects."
In the fourth installment in a series called Process Watch, the authors discuss overlay registration and new capabilities to align to buried layers. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.
imec announced that it has integrated an ultra-thin, flexible chip with bendable and stretchable interconnects into a package that adapts dynamically to curving and bending surfaces.
At IEDM, IBM researchers will demonstrate high-performance state-of-the-art CMOS circuits —including SRAM memory and ring oscillators—on a flexible plastic substrate.
Shipments of tablets are booming, and that means demand for tablet displays is set to spike as well -- and some new panel makers are getting in on the action, reports IHS iSuppli.
The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.
IBM researchers have peered further inside a molecule's structure to distinguish the individual bonds, pointing the way to building an understanding of how graphene devices could work.
ProPlus Design Solutions, Inc. unveiled NanoYield, yield prediction and optimization software for memory, logic, analog and digital circuit design.
EV Group says it has received an order for its EVG850 temporary bonding/debonding systems from a leading maker of compound semiconductor-based components, what it says is the first use of its ZoneBOND technology in this area.
Sumitomo Chemical has joined the Holst Center's shared research program on printed organic lighting and signage, to contribute to research into multilayer solution processes for high-efficiency organic light-emitting diodes (OLEDs).
During sessions at this month's SEMICON Taiwan, execs from TEL, Lam Research, Applied Materials and KLA-Tencor revealed the latest developments in 450mm technology.
GlobalFoundries announced it has developed a 14nm process technology built off its 20nm planar (LPM) process, which it says will offer improved battery life and higher performance vs. other 20nm 2D planar transistors.
NEMO, a three-year European project to research solution-processable materials for OLEDs, has concluded with newly developed materials that can be integrated into large-surface OLED components and are suited for printing processes.
TriQuint Semiconductor says it has received a $2.7M contract from the Defense Advanced Research Projects Agency (DARPA) to triple the power handling performance of gallium nitride (GaN) circuits.
Sharp Corp. reportedly is in discussions with Intel to use the Japanese firm's LCD panels in new ultrabook laptops, and could be seeking a more substantial partnership that would make the chipmaking giant its top stakeholder.
Demand for chip tools fell again in August and is off by -30% from its peak in early summer, fulfilling fears that the second half of 2012 will be sluggish for chipmaking investments, according to the latest data from SEMI.
SK Hynix has joined SEMATCH's EUV Mask Infrastructure (EMI) partnership to help develop metrology tools for reviewing defects in advanced masks needed for extreme ultraviolet lithography (EUVL).
At this year’s International Electron Devices Meeting (IEDM), foundry TSMC will describe a heterogeneous epitaxial growth process which for the first time enables Ge to be directly grown on Si.
The first working 3D NAND flash memory at sub-40nm feature sizes will be described by Macronix researchers at this year’s International Electron Devices Meeting (IEDM).
Toshiba Corporation today announced that it will showcase its leading-edge semiconductor solutions for mobile devices at Mobile Asia Expo 2013.
Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced it has named semiconductor industry veteran Chris Seams its new CEO.
While military applications continue to drive the GaN device market, commercial applications have emerged that will help fuel rapid market growth.
For decades, electronic devices have been getting smaller, and smaller, and smaller. It's now possible—even routine—to place millions of transistors on a single silicon chip. But transistors based on semiconductors can only get so small.
Over 45 percent market participants forecast a positive market trend with their company turnover growth outpacing that of the industry as a whole.
UC Santa Barbara researchers demonstrate first n-type field effect transistors on monolayer tungsten diselenide with record performance.
VirtualWorks Group co-founder and Chairman Edward E. Iacobucci passed away at his home this morning after a 16-month battle with pancreatic cancer.
A book-to-bill of 1.08 means that $108 worth of orders were received for every $100 of product billed for the month.
EPIC, the European Photonics Industry Consortium, has published a public database of more than 5000 company entries, an interactive map, and a report on the photonics ecosystem in Europe.
Outlook for semiconductor equipment market improves, but remains soft in the short term.
Through a series of lectures and workshops, SEMATECH will address R&D challenges and closing key infrastructure technology gaps from July 8–12 at SEMICON West in San Francisco, CA.
Samsung announced today that it has begun mass producing the industry’s first PCI-Express (PCIe) solid state drive (SSD) for next-generation ultra-slim notebook PCs.
Rozich, who previously was a member of the company’s board, succeeds Michael R. Polcari, who served as chairman since November 2009.
Global sales of handsets featuring Near Field Communication (NFC) grew 300 percent in 2012 to reach 140 million units, according to a new research report by Berg Insight.
New market update shows integrated circuit revenues for tablets hitting $27 billion in 2016.
Everywhere we turn we hear speakers give presentations at conferences and industry events despairing how the rise in silicon design costs is hampering the semiconductor industries growth path.
Total inventory held by semiconductor suppliers declined significantly in the first quarter as excess stockpiles created during the global economic malaise of 2012 were cleared away, done in anticipation of a resurgence in consumer demand for electronic products expected by the second half of 2013.
Markets predicted by Maxtech International to reach >$5B by 2015.
Using clouds of ultra-cold atoms and a pair of lasers operating at optical wavelengths, researchers have reached a quantum network milestone: entangling light with an optical atomic coherence composed of interacting atoms in two different states. The development could help pave the way for functional, multi-node quantum networks.
Revenue for both internal and external HDDs in video-surveillance applications will rise from $638.7 million this year to $1.0 billion by 2017, a remarkable 57 percent increase.
The combination of Rockchip’s design and GLOBALFOUNDRIES’ 28nm HKMG process technology resulted in a mainstream tablet System-on-Chip (SoC) capable of operating at up to 1.8 GHz performance, while still maintaining the power efficiency expected by mobile device users.
The co-developed imager sensor chip targets high speed, high resolution imaging applications such as next generation HDTV.
Multitest’s James Quinn will present during the 2013 SEMICON West exhibition and conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA.
Industry’s newfound maturity yields growth amid adversity.
The companies released this new development at this week’s VLSI circuits Symposium in Kyoto, Japan.
Multitest today announced that it will hold its annual Open House Week July 9-11, 2013.
Nano-electronics R&D center addresses key challenges of Germanium finFET technology at VLSI 2013.
A team of researchers has found a way to make the manufacture of crystalline silicon materials faster and more affordable.
The global semiconductor foundry United Microelectronics Corporation announced the opening of its UMC Korea office.
Spansion Inc., a provider of flash memory solutions for embedded markets, today announced the appointment of Robin J. Jigour as senior vice president and general manager of the company's Flash Memory Business Group.
At this week’s International Image Sensor Workshop, imec and Holst Centre presented a large-area fully-organic photodetector array fabricated on a flexible substrate.
The research team demonstrated a novel method to epitaxially synthesize structurally and compositionally homogeneous and spatially uniform ternary InAsyP1-y nanowire on Si at wafer-scale using metal-organic chemical vapor deposition (MOCVD).
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.31 billion in the first quarter of 2013.
SiOnyx Inc. announced independent validation of its image sensor technology.
IBM and United Microelectronics Corporation, a global semiconductor foundry, today announced that UMC will join the IBM Technology Development Alliances as a participant in the group's development of 10nm CMOS process technology.
Single-wafer cleaning solution is suitable for 3D-IC/TSV, advanced packaging, MEMS and compound semiconductor applications.
The 10th International Conference on Group IV Photonics (GFP 2013) will feature presentations spanning a broad range of topics focused on silicon photonics and other Group IV element-based photonic materials and devices.
SEMATECH announced today that Applied Seals North America (ASNA) has joined SEMATECH’s Manufacturing Technology Center, which is designed to improve semiconductor equipment manufacturing productivity, yield and cost.
In an industry where finer features are driving market needs, current deposition processes are no longer sufficient to address challenges like interconnect dimensions below 16/14nm or high aspect ratio TSVs (>8) without experiencing defects, voids, or low reliability.
Mr. Balasubramanian (known as Bala) brings more than 37 years experience in the semiconductor industry to his new role on Freescale's board of directors.
The agreement will broaden the foundry's specialty process portfolio that already includes a range of eMemory eNVM IP solutions from 0.18um and below.
New 3D measuring system offers auto brightness and high-speed stitching.
CEA-Leti will present recent advances and a preview of future developments in micro- and nanotechnologies, followed by workshops on key technical fields, during Leti Innovation Days, June 25-28, on the MINATEC campus.
Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function.
Much has been said of the 450mm transition. But the description of this inflection is something of a misnomer.
Silicon Labs today announced that it has signed a definitive agreement to acquire Energy Micro AS.
Building on its extensive microscope lineup, KEYENCE Corporation has released a new multipurpose microscope.
Fujitsu Laboratories Limited has launched millimeter-wave transceiver based on gallium-nitride high-electron mobility transistor (GaN HEMT). The device operates at frequencies up to the millimeter-wave band and features an output of 10W.
Altera Corporation today introduced its Generation 10 FPGAs and SoCs, offering system developers breakthrough levels of performance and power efficiencies.
Crystal growth equipment manufacturer GTAT is leading the charge and recently created a lot of buzz around this application and on the OEM front.
Peregrine Semiconductor Corporation, a fabless provider of high-performance radio frequency integrated circuits (RFICs), today announced the signing of a collaborative agreement with Murata Manufacturing Company.
The foundry plans to unveil a comprehensive set of certified design flows to support 2.5D IC product development with its most advanced manufacturing processes at next week’s 50th Design Automation Conference (DAC) in Austin, Texas.
At next week's 50th Design Automation Conference in Austin, Texas, GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support its most advanced manufacturing processes.
Aptina’s board of directors yesterday announced that Phil Carmack has joined Aptina as chief executive officer and as a member of the board of directors.
Benefiting from its leadership position in AM/FM tuner and audio processing chips, NXP Semiconductors NV in 2012 retained its rank as the world’s top supplier of application-specific standard product semiconductors for the automotive infotainment market.
Association Connecting Electronics Industries announced today the PCB book-to-bill ratio, which reached 1.10, its highest level since July 2010.
Critical trends and developments in the technologies, methodologies, and applications challenges in semiconductor test will be presented at the 6th annual IEEE Test Vision 2020 Workshop held in conjunction with SEMICON West 2013, on July 10-11 at the San Francisco Marriot Marquis Hotel.
Fraunhofer Institute for Solar Energy Systems ISE has joined forces with EV Group (EVG) to develop equipment and process technology to enable electrically conductive and optically transparent direct wafer bonds at room temperature.
In advance of the 2013 SEMICON West TechXPOTs on lithography and nonplanar transistors beyond 20nm, SEMI asked some of the speakers and industry experts to comment on the challenges they wanted to highlight. Many of the inputs focused on the need for precision in the processes used to form transistors, as well as how EDA can contribute to mitigating variability.
Fab equipment spending will grow two percent year-over-year (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.
A new report from IC Insights shows that we could be on the verge of entering into “the post-PC era.”
Dr. Zhihong Liu, Executive Chairman of ProPlus Design Solutions, Inc., says that design-for-yield (DFY) considerations are more important than ever. And yet, we as an industry may not fully understand device modeling and its impact on DFY results.
Transparent electrodes refer to oxide degenerate semiconductor electrodes that possess a high level of light transmittance (more than 85 percent) in the visible light spectrum, and low resistivity (less than 1×10-3 Ω-㎝) at the same time.
Mentor Graphics Corp. today announced significant achievements in its continued collaboration with TSMC on 20nm physical verification kit optimizations.
ams AG, a provider of high performance analog ICs and sensors, today introduced the AS3721, a power management IC (PMIC) with an innovative remote-feedback circuit that helps reduce the thermal stress of applications processors in smartphones and tablets.
ATIC and SRC today launched the ATIC-SRC Center of Excellence for Energy Efficient Electronic Systems (ACE4S), to be hosted jointly in Abu Dhabi by Khalifa University of Science, Technology and Research, and Masdar Institute of Science and Technology.
ST-Ericsson, a joint venture of STMicroelectronics and Ericsson, today announced the signature of a definitive agreement to sell the assets and intellectual property rights associated with its mobile connectivity Global Navigation Satellite System (GNSS) business to a semiconductor company.
Element Six today announced it has acquired the assets and intellectual property of Group4 Labs, Inc. (Group4), a semiconductor wafer materials company that manufactured gallium nitride (GaN) on-diamond semiconductor technology for RF and high-power devices.
Jon Peddie Research (JPR) announced estimated graphics chip shipments and suppliers’ market share for 2013 Q1. The news was disappointing for Intel, but encouraging for Nvidia and for AMD on the desktop.
This year’s SEMICON West front-end processing TechXPOTs on lithography and transistors below 20nm will provide critical updates on how technologists are coping with the next scaling challenges.
Can PC makers produce ultrathin, touch-screen PCs that are appealing to consumers—and that are priced at just $200?
The new report from IDTechEx titled "Printed, Organic & Flexible Electronics: Forecasts, Players & Opportunities 2013-2023" finds that the total market for these technologies will grow from $16.04 billion in 2013 to $76.79 billion in 2023.
Samsung Electronics Co., Ltd., a provider of advanced semiconductor solutions, today announced the industry’s first 45nm embedded flash logic process development called eFlash. Samsung successfully implemented the new process into the smart card test chip, which means that this process technology fulfills the stringent quality requirements of the security solution market and can be successfully deployed on a commercial scale.
GT Advanced Technologies today announced that it has acquired substantially all of the business of Thermal Technology LLC for purchase consideration.
ProPlus Design Solutions, Inc. announced today that Semiconductor Manufacturing International Corporation has deployed ProPlus' NanoYield High-Sigma (HS) within its advanced technology development flow.
Vishay Intertechnology, Inc. today announced that the company has enhanced its ACAS 0606 AT and ACAS 0612 AT precision thin film chip resistor arrays with tighter absolute tolerance, relative tolerance, and relative TCR for the new S, T, and U accuracy grades.
Imec and Renesas Electronics Corporation announced today that they have entered into a new strategic research collaboration at Holst Centre.
Foundry hires former ASML’s Keith Best as director of photolithography; tasked with driving roadmap to 0.15 microns
LAST POWER, the European Union-sponsored program aimed at developing a cost-effective and reliable technology for power electronics, today announced its three-year program achievements.
The market for GaN and SiC power semiconductors is set to rise by factor of 18 from 2012 to 2022.
Just as a boxer avoids a surprise shot to the head or torso by using a “duck and weave” maneuver, so to must front-end technologists confront the challenges associated with extending optical lithography while planning for EUV lithography’s eventual high-productivity solution.
New research led by University of Cincinnati physics professors Howard Jackson and Leigh Smith could contribute to better ways of harnessing solar energy, more effective air quality sensors or even stronger security measures against biological weapons such as anthrax
The critical processes and technologies necessary to continue Moore’s Law are currently more uncertain than ever before in the history of advanced semiconductor manufacturing.
AG Semiconductor Services today announced that Michael (Mike) Mardesich has joined the company in the role of senior director of sales.
MoSys, a provider of semiconductor solutions, today announced that Macnica Americas, a provider of semiconductor distribution and design services, will support the GigaChip Interface in its distribution and technology innovation business.
MEMSIC, Inc., a MEMS solution provider, today announced that it has agreed to be acquired by IDG-Accel China Capital II, L.P. and its affiliates MZ Investment Holdings Limited and MZ Investment Holdings Merger Sub Limited, for $4.225 per share in cash.
SAMCO Inc, head quartered in Kyoto, Japan, has expanded its OPTO Films Research Laboratory in California’s Silicon Valley in order to strengthen its research structure and after-sale process support.
Recent progress in the engineering of plasmonic structures has enabled new kinds of nanometer-scale optoelectronic devices as well as high-resolution optical sensing.
Element Six last week announced, in collaboration with Delft University of Technology, the entanglement of electron spin qubits (quantum bits) in two synthetic diamonds separated in space.
The 59th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking original work in microelectronics research and development. The paper submission deadline is Monday, June 24, 2013.
Intel announced that the board of directors has unanimously elected Brian Krzanich as its next chief executive officer (CEO), succeeding Paul Otellini. The board also named Renée James, 48, to be president of Intel.
MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with imec, Ireland's Tyndall National Institute and ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs.
DARPA's Near Junction Thermal Transport (NJTT) effort recently demonstrated the first-ever GaN-on-diamond high electron mobility transistor (HEMT).
Semiconductor Research Corporation (SRC) recently joined the National Science Foundation (NSF) as a partner in an ongoing NSF project to further develop compact models of emerging nanoelectronic devices such as might be used in next-generation consumer electronics.
Scientists from IBM today unveiled the world's smallest movie, made with one of the tiniest elements in the universe: atoms. Named "A Boy and His Atom," the Guinness World Records -verified movie used thousands of precisely placed atoms to create nearly 250 frames of stop-motion action.
Amkor Technology, Inc. today announced that Stephen D. Kelley has been appointed to serve as president and chief executive officer and as a director of the company, effective May 8, 2013.
It can be very time-consuming for engineers to measure the various features of an X-SEM image of a semiconductor device.
The most popular storage medium this year for superthin Ultrabooks and similarly built laptops won’t be the pricey solid state drives (SSD) that initially created a buzz for their astonishing speeds.
What would happen if half of all global production for dynamic random access memory (DRAM), two-thirds of NAND flash manufacturing and 70 percent of the world’s tablet display supply suddenly disappeared from the market?
University of Manchester researchers reported to Nature Communications that they have developed the first graphene-based transistor with bistable characteristics.
More than 100 representatives from government and the photonics industry convened in Washington, D.C., on February 28 to identify focus areas for a national photonics initiative (NPI), engaging academia, industry, and government in a collaboration to address barriers to continued U.S. leadership in photonics.
Management expects demand for MOCVD production equipment to potentially improve as demand for LEDs increases later in the current year.
Over 2,000 industry professionals attended last week’s SPIE Advanced Lithography, where important progress reports were revealed on extreme ultraviolet (EUV), lithography, directed self-assembly (DSA), metrology, and related topics. The event ran February 24-28 in San Jose, California.
Semiconductor technology leaders ST and CMP help universities, research labs and companies prototype next generation of Systems-on-Chip.
LFoundry to manufacture wafers for Aptina following LFoundry’s purchase of Micron’s Avezzano, Italy semiconductor fabrication facility.
The European Photonics Industry Consortium recently embarked on an ambitious project to map all the companies in Europe active in photonics, which amounts to over 3000 companies.
Industry consolidation to just three big DRAM suppliers and a reduction in capital expenditures among these manufacturers helped propel DRAM average selling prices (ASPs) up 13% year over year in January, which contributed to a 19.9% jump in the total memory market and a 6.2% increase for the total IC market in January 2013.
Following a healthy expansion in 2012, the growth of the global automotive semiconductor market will decelerate slightly this year because of a slowdown in the aftermarket and portable navigation device (PND) segments.
Diodes Incorporated today announced that it has completed its acquisition of BCD Semiconductor Manufacturing Limited in an all cash deal, valued at approximately $151 million.
The total market for open short-range wireless (SRW) technology based ICs, such as Bluetooth, Wi-Fi, ZigBee, NFC, and GPS, is expected to reach almost 5 billion units in 2013 and grow to nearly 8 billion by 2018, according to ABI Research. This includes standalone wireless connectivity ICs, wireless connectivity combo ICs, and also platforms with integrated wireless connectivity.
Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision micromachining applications.
While investments and capital spending in Asia-Pacific garner much of the attention regarding semiconductor manufacturing, spending on equipment and materials in North America has totaled more than $100 billion over the past decade as leading device manufacturers expand capacity and invest in new facilities.
The eight leading suppliers of industrial electronics suffered revenue declines in 2012, reflecting weak conditions for the beleaguered market.
In the world of optical defect inspection, finding on defect on a 300mm wafer can be like trying to find a single coin on the island of Taiwan. Now imagine being able to find that coin in just an hour, along with any other coins that look exactly like it.
Worldwide silicon wafer area shipments decreased during the first quarter 2013 when compared to fourth quarter 2012 area shipments, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.
A pathway to creating low-resistance Ohmic contacts at nanoscale has been reported in Advanced Materials this week; a development which is of critical importance to the on-going advancement of oxide electronics.
Starting late in 2011, the power electronics downturn in 2012 was quite severe, exhibiting -20 percent negative growth. However, the SiC device market kept on growing with a +38 percent increase year to year.
SRC and NIST will provide a combined $5 million in annual funding for three multi-university research centers tasked with demonstrating non-conventional, low-energy technologies that outperform current technologies on critical applications in 10 years and beyond.
Global shipments of solid state drives (SSD) in PCs are set to rise by a factor of seven by 2017, allowing them to claim more than one-third of the market for PC storage solutions by that time.
Intel Corporation today took the wraps off its brand new, low-power, high-performance microarchitecture named Silvermont.
LFoundry confirmed the signature of the final agreement regarding the acquisition of Avezzano (Italy) manufacturing facility.
Analog Devices, Inc., a provider of high-performance semiconductors for signal-processing applications, announced today that it has entered into a worldwide distribution agreement with Mouser Electronics, Inc. Mouser supplies design engineers and buyers with the newest products and leading-edge technologies.
Analog Devices, Inc. today announced the appointment of Vincent Roche as president and chief executive officer (CEO) and his election to the Board of Directors, effective immediately.
Photonics societies across the United States today announced the launch of the National Photonics Initiative.
Researchers have created a new type of transparent electrode that might find uses in solar cells, flexible displays for computers and consumer electronics and future "optoelectronic" circuits for sensors and information processing.
Soitec announced the PV industry’s first four-junction solar cell device, which uses two dual-junction sub cells grown on different III-V compound materials, which allows optimal band-gap combinations tailored to capture a broader range of the solar spectrum.
IDC expects the semiconductor market to return to growth in 2013 with revenues forecast to increase by 3.5 percent this year.
North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in April 2013 (three-month average basis) and a book-to-bill ratio of 1.08.
Leaders of the National Science Foundation (NSF) and the Semiconductor Research Corporation (SRC) today announced 18 new projects funded through a joint initiative to address research challenges in the design of failure-resistant circuits and systems.
Qualcomm, TSMC, and SK Hynix each register greater than 20 percent year-over-year growth.
In 1973, Pong was cutting edge in the world of video games, music came on eight-track tapes, TV viewing was limited to three networks and Glenn Smith was a college kid who went to work part-time in the warehouse of what was little more than a mom and pop electronics catalog start-up in San Diego.
Slow notebook and desktop PC sales and strong growth in mobile processors for smartphones and tablet PCs continues to lower Intel's marketshare as well.
Toshiba Corporation today announced that the company has developed second generation 19nm process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month.
Imec and GLOBALFOUNDRIES announced today that they have expanded joint development efforts to advance STT-MRAM (spin-transfer torque magnetoresistive random access memory) technology.
Axcelis Technologies, Inc. today announced the introduction of the Purion XE next generation single wafer high energy implanter, the second tool in its expanding family of Purion ion implanters.
Spansion Inc. and Fujitsu Semiconductor Limited today announced they have executed a definitive agreement for Spansion to acquire the Microcontroller and Analog Business of Fujitsu Semiconductor for approximately $110 million, plus approximately $65 million for inventory.
Samsung Electronics Co., Ltd. today announced the industry’s first production of ultra-high-speed four gigabit (Gb) low power double data rate 3 (LPDDR3) mobile DRAM, which is being produced at a 20nm-class process node.
China rose to the top of the PC market for the first time ever on an annual basis last year, relegating the United States to second place with a lead of more than 3 million units, according to an IHS iSuppli PC Dynamics Market Brief from information and analytics provider IHS.
SEMI today announced that Philip Yeo, chairman of SPRING Singapore, and Lee Kok Choy, country manager of Micron Technology Inc. Singapore, have been voted by the SEMI Singapore Regional Advisory Board as recipients of two prestigious awards recognizing their contributions to the development and success of the Southeast Asian semiconductor industry.
Rudolph Technologies, Inc. announced today that it has purchased selected assets, including a patent portfolio, relating to metrology capability from Tamar Technology, Newbury Park, Calif.
Cadence Design Systems, Inc. announced today that GLOBALFOUNDRIES has collaborated with Cadence to provide pattern classification data for manufacturing processes of 20 and 14 nanometers.
Morgan Advanced Materials has joined SEMATECH’s International SEMATECH Manufacturing Initiative (ISMI), a program designed to improve semiconductor equipment manufacturing productivity, yield, and cost.
Infineon Technologies and GLOBALFOUNDRIES Inc. today announced a joint technology development and production agreement for 40nm embedded flash (eFlash) process technology.
Renesas Electronics Corporation this week announced the development of the R2A25110KSP intelligent power device of isolated IGBT driver for use in electric and hybrid vehicle power inverters.
Global macroeconomic developments and technological advances, personal computers, and memory markets are expected to drive demand over the forecast period, Research and Markets predicts in their report, “Global Semiconductor Industry 2012-2017: Trend, Profit and Forecast Analysis.”
The global markets for digital power supplies and digital power integrated circuits (ICs) are projected to boom from 2013 to 2017, as their use in IT infrastructure increases and as the technology expands into lighting and consumer-oriented applications including PCs, appliances and cellphones.
An estimated 405 million handsets, including 197 million smartphones, were shipped in the first quarter of 2013, according to market intelligence firm ABI Research.
Hitachi Cable, Ltd. announced today that it has developed a new mass-production technology for GaN-templates, in which a high-quality gallium nitride (GaN) single-crystal thin film is grown on a sapphire substrate.
Dongbu HiTek today announced that it has begun volume production of Ambient Light Proximity Sensor (ALPS) chips for Clairpixel Co., Ltd., a Korean company specializing in single-chip image and motion sensor solutions for mobile, automotive, medical and security applications.
About 1,000 of the world’s leading experts in the field of microelectronics will gather here for the 2013 Symposia on VLSI Technology and Circuits, from June 11-13, 2013 (Technology) and from June 12-14, 2013 (Circuits).
When a team of University of Illinois engineers set out to grow nanowires of a compound semiconductor on top of a sheet of graphene, they did not expect to discover a new paradigm of epitaxy.
Rapidly increasing customer demand for NexPlanar's advanced semiconductor CMP pads has necessitated a significant capacity expansion in both the U.S. and Asia.
The diffusion of roll-to-roll technologies is expected to have a marked effect in lowering the unit prices of flexible devices. Consequently, while consumption in terms of volume is forecast to rise very rapidly, revenues will increase somewhat more moderately.
In another sign of the worldwide shift in preferred personal devices, PC shipments posted the steepest decline ever in a single quarter, according to the International Data Corporation Worldwide Quarterly PC Tracker (IDC).
Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia.
Natcore Technology Inc. announced major strides in advancing its black silicon solar cells to commercial levels of efficiency and, as part of its development process, has discovered that its technology could finally provide a low-cost selective emitter application.
Samsung has begun mass producing a 128-gigabit (Gb), 3-bit multi-level-cell (MLC) NAND memory chip using 10 nanometer (nm)-class process technology this month. This chip will enable high-density memory solutions such as embedded NAND storage and solid state drives (SSDs).
NikkoIA announces the production of several innovative organic image sensors, confirming the potential of its technology, and validates the technology building blocks that can be immediately implemented to build its product lines.
Picosun Oy, an Atomic Layer Deposition (ALD) equipment manufacturer, reports that its PICOPLATFORM 300 ALD cluster tool has been selected by a key customer in Asia for new memory applications.
Electro Scientific Industries, Inc. today announced it had signed a definitive agreement to acquire the Semiconductor Systems business of GSI Group, Inc., a supplier of precision photonics, laser-based solutions and precision motion devices to the medical, industrial, scientific, and electronics markets
Advanced Micro-Fabrication Equipment Inc. (AMEC) said today that it has developed a Single-Station Chamber Advanced Dielectric Etcher (SSC AD-RIE) capable of processing the most rigorous semiconductor applications.
Despite stronger-than-expected growth during the fourth quarter, 2012 was still a miserable year for the semiconductor market and suppliers, with only eight out of the Top 25 chipmakers managing to eke out revenue growth—but nine suffering double-digit declines.
Veredus Laboratories today announced that the current version of VereFlu detects the current subtype of H7N9 (Avian Flu) that is responsible for the flu outbreak in China. H7N9 is the latest mutation to cause concern and increased surveillance in the region.
memsstar Limited, a provider of etch and deposition equipment and technology solutions to manufacturers of semiconductors and MEMS, today announced the appointment of Tony McKie as its new chief executive officer (CEO). McKie is tasked with capitalising on the company's experience and reputation in the semiconductor and MEMS markets to drive its growth.
The global semiconductor materials market decreased 2 percent in 2012 compared to 2011 while worldwide semiconductor revenues declined 3 percent. Revenues of $47.11 mark the first decline in the semiconductor materials market in three years.
Original equipment manufacturers (OEMs) are increasingly turning to electronics manufacturing service (EMS) providers to better handle the escalating volumes of electronic content in the medical industry.
The atom-sized world of carbon nanotubes holds great promise for a future demanding smaller and faster electronic components.
Sales in March 2013 were up slightly compared to February 2013 and March 2012.
NeoPhotonics Corporation today announced the opening of a sales and R&D office in Moscow and servicing the Russian Federation and the broader eastern European market.
Chip Memory Technology Inc. (CMT), a new embedded memory technology developer, has emerged from stealth mode to reveal company details and its latest product.
The €8.5 million European Commission project developed a complete design and fabrication supply chain for integrating a photonic layer with a CMOS circuit, using microelectronics fabrication processes.
1/f noise is an important characteristic for various semiconductor devices, such as MOSFETs, BJTs, JFETs, Diode, and IC resistors. Not only does it directly impact the circuit performance of modern ICs, but it has been used also as an important technique to characterize the manufacturing process quality.
Teledyne Technologies Incorporated announced today that its subsidiary, Teledyne DALSA B.V., has acquired Axiom IC B.V.
TowerJazz today announced collaboration with TLi (Technology Leaders and Innovators), a fabless company that designs non-memory integrated circuits (ICs) focused on timing controllers and driver ICs on TFT-LCD panel modules.
IQE plc announces the launch of gallium nitride-based, high electron mobility transistor (GaN HEMT) epitaxial wafers on 150mm diameter semi-insulating silicon carbide (SiC) substrates.
Researchers from IMDEA-Nanociencia Institute and from Autonoma and Complutense Universities of Madrid have managed to give graphene magnetic properties.
Researchers at the University of Illinois at Chicago have developed a way to introduce precisely four copper ions into each and every quantum dot.
The market for Bluetooth semiconductors is expected to boom by nearly 100 percent from 2011 to 2017, with the majority of the growth driven by demand for wireless combination integrated circuits (ICs) and mobile system-on-chip (MSoC) devices with integrated wireless connectivity that are used in mobile devices like smartphones and media tablets.
The semiconductor chip giant revealed plans to branch out beyond PCs. Will it work?
In order to meet the rapidly growing business demands in the Chinese market and further expand the mass market in that region, Freescale Semiconductor announced today that the company plans to open ten new sales offices covering key areas across the mainland area.
North America-based manufacturers of semiconductor equipment posted $1.14 billion in orders worldwide in March 2013 (three-month average basis) and a book-to-bill ratio of 1.14, according to the March Book-to-Bill Report published today by SEMI.
Increasing HD video content, social networking, shared data via the cloud, low power consumption, and “instant on” features continue to drive growth of consumer, communication, and computing devices that use NAND flash memory.
AIXTRON SE today announced that the University of Cambridge has successfully commissioned another multi-wafer Close Coupled Showerhead (CCS) MOCVD reactor at its new facility at the Department of Material Science and Metallurgy. The CCS 6x2-inch system will be configured to handle single 6-inch (150mm) wafers (1x6-inch).
Cree, Inc. and Delta Energy Systems announce a breakthrough in the photovoltaic (PV) inverter industry with the release of Delta’s new generation of solar inverters, which utilize SiC power MOSFETs from Cree. The use of SiC MOSFETs in the next-generation PV inverters can enable significant new milestones in power density, efficiency and weight.
Intermolecular, Inc. today announced that it has entered into a multi-year technology development and IP licensing agreement with Micron Technology, Inc., focused on technology development and related IP for advanced memory technologies.
Researchers at the Georgia Institute of Technology are developing a novel technology that would facilitate close monitoring of structures for strain, stress and early formation of cracks.
BeSpoon, a fabless semiconductor company, and CEA-Leti have demonstrated an IR-UWB integrated circuit able to measure distances within a few centimeters’ accuracy, and have established a world-record operating range at 880m (standard regulation) and 3,641m (emergency situations).
The evolution of smart grids is a priority in a number of countries, including EU and the US, and will eventually create a smart energy network that manages a huge amount of data in 24-hour intervals.
Error correction code and redundant addresses are both techniques well-known in memories as a way of optimizing yield. But new data from the University of Ferrara shows that these common techniques may be overused. By classifying erratic bits more carefully, it’s possible to use less ECC and up to 35 percent less redundancy.
The ability of a resistive RAM device to maintain its resistance state, otherwise known as retention time, can be impacted by the electrode materials used.
New flash memory chips are replacing the floating gate with thin layers of material that "trap the charge." The charge trap is a sandwich of materials such as silicon-oxide-nitride-oxide-silicon (SONOS), metal-oxide-nitride-oxide-silicon (MONOS) and tantalum-aluminum oxide-nitride-oxide-silicon (TANOS), all of which are substantially smaller than the floating gate.
Researchers are developing a new type of semiconductor technology for future computers and electronics based on "two-dimensional nanocrystals" layered in sheets less than a nanometer thick that could replace today's transistors.
At the International Reliability Physics Symposium (IRPS), being held April 14-18, 2013 at the Hyatt Regency Monterey Resort & Spa in Monterey, CA, imec will present new research focused on the stress induced breakdown between the tungsten trench local interconnects (M1, M2) and metal gate in a 28nm CMOS technology. Imec’s Thomas Kauerauf will present a paper titled “Reliability of MOL local interconnects.”
New finFETs feature high-k dielectrics, which are better than conventional silicon nitride dielectrics in that they can be thinner, yet still enable good control of the transistor’s channel region from the gate.
It’s well-known that transistors generate heat when they’re operating, and that can have a significant impact on the chip’s reliability and longterm longevity. A small increase of 10°C–15°C in the junction temperature may result in ∼ 2× reduction in the lifespan of the device.
FinFETs offer several advantages compared to traditional planar transistors, but it’s not yet clear what kind of new reliability problems might arise as FinFETs are scaled to smaller dimensions.
Anapass, Inc, a display SoC solution provider listed on the KOSDAQ, today announced that it has entered into strategic collaboration and investment agreements with GCT Semiconductor, Inc., a designer and supplier of advanced 4G mobile semiconductor solutions, to develop and commercialize mobile application processors (AP) for use in smartphones.
Chemists at Ohio State University have developed the technology for making a one-atom-thick sheet of germanium, and found that it conducts electrons more than ten times faster than silicon and five times faster than conventional germanium.
Proposed increases in funds for scientific R&D and a greater emphasis on STEM education in the 2014 budget proposal announced by the White House this week reflect the President’s commitment to science and engineering, SPIE leaders said.
IBM announced plans on Thursday to invest $1 billion in flash memory research and development and launch a series of systems that will use solid state drives.
Once a white-hot PC product that sold in the tens of millions of units annually, netbook computers are now marking their final days, with the rise of tablets causing their shipments to wind down to virtually zero after next year, according to an IHS iSuppli Compute Electronics Market Tracker Report from information and analytics provider IHS.
Imagine if you could track and trace connected goods, assets and people in real-time, anywhere, at any time with high accuracy. BlinkSight and imec recently made this future a reality, with the launch of the first ever single-chip indoor GPS solution.
Several years ago when the challenges to 450mm wafer processing, EUV development and novel transistor designs were first being discussed, SEMI commissioned a study that predicted the industry could face an R&D funding gap that could exceed $9 billion if current technology and economic trends continue.
Over the last few years, glass has gained considerable interest from the semiconductor industry due to its very attractive electrical, physical and chemical properties, as well as its prospects for a relevant and cost-efficient solution. The application scope of glass substrates in the semiconductor field is broad and highly diversified.
TESEC Corporation today announced the development and sales of the ULTRA MEMS Handler, targeting Inertial (Accelerometer, Gyroscope and Magnetometer) MEMS devices.
Only light, aerial oxygen, and a catalyst are needed to remove pollutants from water. Ruhr-Universitat Bochum researchers led by Professor Radim Beránek are collaborating with colleagues from seven different countries in order to develop a photocatalyst that is efficient enough to be profitable.
At this week’s International Solid State Circuits Conference (ISSCC 2013), imec and Holst Centre presented an ultra-low power processor that operates reliably at near-threshold voltages.
Imec and Holst Centre presented at ISSCC an ultra-low power multi-standard 2.3/2.4GHz short range radio. The 1.9nJ/b radio is compliant with three wireless standards: Bluetooth Low Energy, ZigBee and Medical Body Area Networks.
Tim Turner, the Reliability Center Business Development Manager at the College of Nanoscale Science and Engineering (CNSE), Albany, NY, blogs about the potential of resistive memory and the reliability challenges the must be overcome.
Imec demonstrated a low-power (20µW), intra-cardiac signal processing chip for the detection of ventricular fibrillation at this week’s International Solid State Circuits Conference (ISSCC 2013) in San Francisco with Olympus.
New advancement enables the development of low-power, low-cost, high-data rate solutions for true mobile devices.
CEA-Leti today announced that it will coordinate a four-year project aimed at building a European-based supply chain in silicon photonics and speeding industrialization of the technology.
Joint effort to explore novel process techniques to improve device performance and reliability in semiconductor manufacturing for sub 20nm technology node.
STMicroelectronics announced today another milestone in its testing of its 28nm FD-SOI Technology Platform.
Sensors and optoelectronics will continue to grow faster than the mainstream semiconductor market. We currently expect 9%-13% growth in these sectors in 2013, accompanied by rapid changes in technology and market structures.
In semiconductor manufacturing, 450mm is the next big opportunity. Issues of economic scale and complexity will force fab designers, OEMs and process integrators to investigate all open avenues in the search for solutions to the huge challenges that accompany 450mm.
Recent advances in diamond applications (diamond-on-silicon, MEMS, optical) suggest that its utilization into a broader scope of commercial products is not far away.
The multibillion-dollar secondary or used semiconductor equipment market has gone through significant changes over the past five years and has become increasingly sophisticated in its approach.
80 percent of the devices used for portable and mobile applications are currently manufactured on 200mm or smaller wafers. How this plays out going forward could change who the dominant players will be.
In order to maintain profitability manufacturers must increase the productivity and return from their R&D investments.
Active matrix OLED (AMOLED) displays will continue to encroach upon LCD technology through small and medium-sized (9-in. and smaller) displays used in mobile phones, according to recent analysis by NPD DisplaySearch.
NAND flash has embarked on its own 3-D scaling program, whereby the stacking of bit cells allows continuous cost-per-bit scaling while relaxing the lateral feature size scaling.
Unprecedented precision engineering will be needed to manufacture chips features measured in nanometers. At these dimensions every atom counts and controlling variability is vital to meet performance and productivity targets.
While solutions are available to extend Moore’s Law, these solutions come at considerable increases in cost and complexity. As it has in the past, this industry will find more innovative solutions to overcome the challenges of inflection.
It is becoming increasingly clear that new MEMS and 3D high-volume, low-cost manufacturing technologies will accelerate a radical change to society’s cyber skyline.
In 2013, it is anticipated that M&A transaction activities will increase and result in further consolidation of the semiconductor supply chain.
2013 will mark the beginning of the next cyclical upturn—one in which the IC market CAGR will more than triple to 7.4% in the 2012-2017 time period.
The SEMI Consensus Forecast and the SEMI World Fab Forecast, with data collected from two different methodologies, point to the same conclusion: 0% growth for 2013.
Today, Research and Markets released the Gallium Nitride (GaN) Semiconductor Devices (Discretes & ICs) Market, Global Forecast & Analysis: 2012 – 2022.
The global market for MEMS microphones has reached approximately $422 million in 2012. The market is predicted to increase to $865 million in 2017.
Andreia Cathelin, subcommittee chair, reflects on the trends of radio frequency design and usage in her submission to ISSCC.
Tablet and cellphone processors, NAND flash, and telecom-specific ICs to enjoy best growth.
Markets for solid state thin-film batteries at $65.9 million in 2012 are anticipated to reach $5.95 billion by 2019, according to a new report released by ReportsnReports.com.
Worldwide silicon wafer revenues declined by 12 percent in 2012 compared to 2011, according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.
Roland Thomas, subcommittee chair of ISSCC, writes of the substantial growth and future in key areas of technology.
In the second of two installments, Linx Consulting reports a steady growth in semiconductor production, as released in The Econometric Semiconductor Forecast.
Although many are small companies manufacturing low-pin count devices, all of the world’s “Top 10” OSAT, Outsourced Semiconductor Assembly and Test, players have one or more assembly and testing facilities in China.
In the first of two installments, we examine the global issues facing the semiconductor industry, as released by Linx Consulting in The Econometric Semiconductor Forecast.
A new econometric semiconductor industry forecast predicts semiconductor wafer area production to grow slightly less than 6% in 2013, according to Linx Consulting.
Technische Universität (TU) Dresden announced Monday the successful initial operation of a low-power test chip featuring a Tensilica Xtensa LX4 DSP equipped with RacyICs power management IP implemented in GLOBALFOUNDRIES' advanced 28nm Super Low Power, or SLP, technology.
SEMATECH announced today that Araca Inc., a leading provider of products and services for chemical mechanical planarization research and development, and the International SEMATECH Manufacturing Initiative (ISMI) are partnering to deliver CMP processing and productivity solutions to help chip manufacturers increase yields, reduce equipment downtime and lower consumables costs.
Dr. Steffen Schulz discusses the role of a flexible platform for computational lithography in a successful business strategy.
Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, announced an expansion of its SPI Flash memory portfolio yesterday.
Agilent Technologies Inc. announced yesterday the intent to donate a $90 million in software to Georgia Institute of Technology, the largest in-kind software donation ever in its longstanding relationship with the university.
Dow Corning and IBM scientists unveiled a major step in photonics yesterday at the Photonics West conference, using a new type of polymer material to transmit light instead of electrical signals within supercomputers and data centers.
Global NAND flash memory market revenue fell 7 percent in 2012 as disappointing Ultrabook sales negated the impact of surging demand from Apple Inc. for its iPhone line, according to an IHS iSuppli Data Flash Market Tracker Report from information and analytics provider IHS (NYSE: IHS).
Spending on research and development by semiconductor companies grew 7% in 2012 to a record-high $53.0 billion, even though the semiconductor market declined 1% to $317.6 billion.
Facing a relentless onslaught from tablets, smartphones and solid state drives (SSD), global hard disk drive (HDD) market revenue in 2013 will decline by about 12 percent this year, according to IHS.
Five University of California, Riverside professors will receive a total of $5 million as part of a $35 million research center aimed at developing materials and structures.
Scientists at RTI International are advancing the state of science in electronic devices for optical systems by using superlattice structures to optimize the performance of germanium optical detectors on silicon chips.
C. Grant Willson and Jean M.J. Fréchet won the Japan Prize, an international award similar to the Nobel Prize, for their work on chemically amplified resists.
KLA-Tencor Corporation (NASDAQ: KLAC) announced the eS805, a new electron-beam inspection system capable of detecting very small defects, and defects that cause electrical problems.
The Global Semiconductor Alliance (GSA) announced the appointment of three new members to the GSA Board of Directors.
SEMI announced that Joung Cho (JC) Kim, chairman, Edwards Korea Limited, is the recipient of the 14th annual SEMI Sales and Marketing Excellence Award.
Gigaphoton, Inc., a major lithography light source manufacturer, announced today that the company has achieved EUV light output equivalent to maximum of 20W for its laser-produced plasma, or LPP light sources for EUV lithography scanners.
Shimadzu Corporation today introduced the Tracera, a high-sensitivity gas chromatograph. Tracera is equipped with the newly developed barrier discharge ionization detector BID, which is capable of detecting all types of trace organic and inorganic compounds.
Subcommittee chair Stefan Rusu of Intel in Santa Clara, CA will present on trends in high-performance digital. The relentless march of process technology, he says, brings more integration and performance.
Kevin Zhang, subcommittee chair of ISSCC, writes on the trends of memory devices for 2013 and beyond.
Joint effort will drive innovative engine-train and smart-power products
GCAP targets a range of industrial applications as well as research labs, advanced gas analysis and biomedical screening.
SEMI, in collaboration with strategic investing groups throughout the global semiconductor industry, has announced the Silicon Innovation Forum, or SIF, to bridge funding gaps for new and early-stage companies with valuable semiconductor manufacturing and technology solutions.
By creating a material that slows light, engineers open new possibilities in solar energy, military technology and other fields of research.
David Su, ISSCC subcommittee chair, writes on the trends of modern wireless standards.
Bill Redman-White, chair of the ISSCC Analog Subcommittee, shares on challenges facing analog systems in 2013.
Cabot will collaborate with SEMATECH to develop advanced solutions for emerging CMP applications.
Semiconductor Research Corporation (SRC) and the Defense Advanced Research Projects Agency (DARPA) announced that $194 million will be dedicated during the next five years to STARnet, which encompasses six new university microelectronics research centers.
The rise in mobile computing, changes to the fabless-foundry model, uncertainties in technical innovation, and global macroeconomic trends are becoming the dominant forces in 2013 and beyond, according to industry leaders speaking at this week's SEMI Industry Strategy Symposium (ISS).
Among the usual confluences of useful and cool gadgets (not to mention bizarre) at this week's annual Consumer Electronics Show in Las Vegas, two types of devices with new formfactors aimed to rethink the PC model.
Fabless IC suppliers saw sales rise 6% in 2012, again outperforming IDMs and the total IC market, and by 2017 fabless ICs will make up a full third of the overall market, says IC Insights.
Components are prominent this year, on the main stage, and the CES exhibit floors.Todd Traylor of Smith & Associates reports.
SEMI's HB-LED Standards Committee has approved its first standard, specifying sapphire wafers used in making high-brightness light-emitting diode (HB-LED) devices.
Is it time for high-brightness LED manufacturing to get serious about process control? If so, what lessons can be learned from traditional, silicon-based integrated circuit manufacturing?
Several innovations in computational lithography have been developed in order to squeeze every possible process margin out of the lithography/patterning process. In this blog, Gandharv Bhatara of Mentor Graphicsl talks about two specific advances that are currently in deployment at 20nm.
Klaus Schuegraf, former exec at Applied Materials responsible for the company's semiconductor products technology roadmap, will now lead Cymer's EUV engineering and development programs.
As the annual Consumer Electronics Show and hordes of techie enthusiasts descends over Las Vegas this week, NPD DisplaySearch revisits the battle between two display technologies -- 4K × 2K vs. OLEDs.
We are in an age where chemistry is center stage in the race to advance Moore’s Law and More Than Moore.
The International Data Corporation is forecasting that semiconductor revenues worldwide will improve by 4.9% to $319 billion in 2013 and log a compound annual growth rate (CAGR) of 4.1% from 2011-2016.
Based on current indications, capital spending would seem to be flat in 2013. However, Semico predicts healthy revenue growth this year, which may encourage more spending, particularly in the second half of the year. This may bring total capex for 2013 into the positive range.
Predictions for 2013 show several notable trends: overall silicon area growth for 2013 should average approximately 6%; the first quarter and the second half are likely to show slower growth than the second quarter; and the modest growth forecast for 2013 is predominantly demand driven.
New York represents Exhibit A of a new way of thinking; a true 21st century model for technology, workforce and economic development.
Chip inventory held by semiconductor suppliers reached alarmingly high levels in the third quarter of 2012 amid weak market conditions, according to an IHS iSuppli Semiconductor Inventory Insider Market Brief.
Dr. Zhihong Liu, Executive Chairman, ProPlus Design Solutions, blogs about dealing with increased random variations and layout-dependent effects.
Newport Corporation introduced long-lived deep ultraviolet (UV) excimer laser mirrors with projected lifetimes greater than 30 billion pulses.
China’s rapid transition from a low-cost manufacturing hub to an innovation hotspot with growing foreign ambitions represents both a threat and an opportunity for companies and investors around the globe, according to Lux Research.
Cadence Design Systems, Inc. announced the availability of Virtuoso® Advanced Node, a new set of custom/analog capabilities designed for the advanced technology nodes of 20nm and below.
ProPlus Design Solutions announced it is shipping a new wafer-level, 1/f noise measurement system. Increasingly, circuit designers are interested in 1/f noise data at higher frequencies.
A particle as small as three microns in diameter, attached to the back side of the wafer—the dark side, if you will—can cause yield-limiting defects on the front side of the wafer during patterning of a critical layer.
Protecting intellectual property, protecting federal funding for R&D, and enabling friendlier export, tax, and other policies are the top priorities for the Semiconductor Industry Association (SIA) in 2013.
Reports are circling around Apple's supply chain of a potential shift in the company's display technology for its future iPhones and iPads -- moving back to LCDs and away from touch panels -- but a drastic realignment of its supply chain is probably not likely, observes DisplaySearch.
The Fraunhofer Institute for Applied Polymer Research (IAP) in Potsdam-Golm and fab/cleanroom developer MBRAUN have commissioned a new "near industrial-scale" pilot line for organic light-emitting diodes (OLEDs) and organic solar cells.
Spending on LED fab manufacturing equipment will decline 9.2% in 2013 as the industry faces weak long-term demand and consolidates manufacturing capacity.
In the ranks of top foundries, there's a new Number Three in town: Samsung, which climbed up the ranks again in 2012 thanks to its ubiquity in smart phone technology, according to updated rankings by IC Insights.
IBM Researchers won the prestigious Feynman prize given by the Foresight Group. The team was the first to produce images detailed enough to identify the structure of individual molecules, as well as metal-molecule complexes.
DARPA researchers have recently demonstrated the most complex 2-D optical phased array ever. The array, which has dimensions of only 576µm x 576µm is composed of 4,096 (64 x 64) nanoantennas integrated onto a silicon chip.
Printed, flexible, and organic electronics have garnered more than $7.5 billion in venture funding from 1996-2011, though it's declined sharply since 2007. A new Lux Research report looks at who's getting attention and who's not.
Samsung tops list; IC foundries expected to show biggest capacity gains through 2017.
Researchers at North Carolina State University have developed a new type of nanoscale structure that resembles a “nano-shish-kebab,” consisting of multiple two-dimensional nanosheets that appear to be impaled upon a one-dimensional nanowire.
Stretched-out clothing might not be a great practice for laundry day, but in the case of microprocessor manufacture, stretching out the atomic structure of the silicon in the critical components of a device can be a good way to increase a processor's performance.
One of the key factors contributing to this market growth is the high demand of SiC in industrial applications. The global SiC semiconductor devices market has also been witnessing rapid technological advancement. However, the fluctuations in demand and supply could pose a challenge to the growth of this market.
ISSCC, the International Solid-State Circuits Conference, is being held on February 17-21, 2013, at the San Francisco Marriott Marquis Hotel. This year, in honor of the conference’s 60th anniversary, we have assembled highlights of the topics and trends that are being discussed.
DRS Technologies, Inc., a Finmeccanica Company, and Cypress Semiconductor Corp. (NASDAQ: CY) today announced that DRS will transfer its Microbolometer technology for uncooled infrared detectors to Cypress for high-volume manufacturing.
Yole Développement’s report provides an analysis of the emerging Non Volatile Memories (NVM) five applications fields that will fuel market growth and a description and forecasts of the four emerging NVM (MRAM, PCM, RRAM, FeRAM) technologies.
Intersil Corporation today announced restructuring initiatives designed to prioritize the company's sales and development efforts, strengthen financial performance and improve cash flow.
In February, Infineon received the first customer go-aheads for products of the CoolMOS family produced by the 300-millimeter line at their site in Villach, Austria.
SPIE Advanced Lithography, the annual forum for discussions on state-of-the-art lithographic tools, resists, metrology, materials characterization, and design and process integration, will bring the community together in San Jose, California, next week to address those challenges.
Papers showcase EUV extendibility and metrology techniques for defect inspection and 3D TSVs.
New marketing and technical support center opened in Reading, UK.
Snapdragon 800 processor on 28nm HPM process delivers high performance and low power for mobile devices.
Messe Düsseldorf and ESNA have formed a cooperation to address the printed electronics market by organizing a new tradeshow, PEPSO.
Engineered Material Systems, a global supplier of electronic materials for circuit assembly applications, debuts its DB-1568-1 low-temperature cure die attach adhesive for attaching semiconductor die in temperature-sensitive devices.
We are entering the era of cognitive systems, where electronic devices will mimic the human senses—in their own way, to see, smell, touch, taste and hear. IBM assembled this infographic to illustrate what they call the “5 in 5,” five innovations that will change our lives within five years.
New metrology and inspection products facilitate advanced patterning techniques for manufacturing sub-20nm memory and microprocessor chips.
Molecular Imprints, Inc. (MII), a developer of advanced semiconductor lithography, has announced the delivery of an advanced lithography platform which uses Xaar 1001 inkjet printheads to pattern 450mm silicon wafer substrates.
As power electronics grow to $15 billion and LEDs to $100 billion, Lux Research identifies the leading technology companies addressing these markets.
The competitive landscape of the cellphone core integrated circuit (IC) business has completely transformed over the past five years, with Qualcomm Inc. and Samsung capitalizing on the rise of smartphones and 4G.
Luminescent Technologies Inc., a provider of computational metrology and inspection solutions for the global semiconductor manufacturing industry, and Dai Nippon Printing Company, Ltd. announced today the successful completion of the first phase of a three-year joint development program for computational metrology and inspection using Luminescent’s Automated Image Processing Hub (LAIPH) platform.
Toshiba Corporation announced the development of a CMOS image sensor with a small area and low power pixel readout circuits. A sample sensor embedded with the readout circuits shows double the performance of a conventional one. Toshiba presented this development at ISSCC 2013 in San Francisco, CA on Feb. 20.
-27% active power reduction and 85% standby power reduction is confirmed at International Solid-State Circuits Conference 2013.
Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase.
Korean foundry Dongbu HiTek and French IP provider Cortus are to develop a design platform combining Dongbu HiTek’s embedded flash technology and Cortus processor and peripheral IP.
Toshiba Corporation today announced that it has developed an intelligent vital signs sensor module: Smart healthcare Intelligent Monitor Engine and Ecosystem with Silmee, that simultaneously senses information on key vital signs, Electric Cardio Gram, pulse, body temperature and movements, and that can deliver the data to smartphones and tablet PCs with wireless technology.
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is developing equipment and process technology to enable covalent bonds at room temperature.
Peregrine Semiconductor Corporation, a fabless provider of high-performance radio frequency integrated circuits (RFICs), yesterday announced plans to collaborate with Murata Manufacturing Company on a multisource arrangement for RF switches and other components based on Peregrine’s proprietary UltraCMOS technology
Samsung Vice-President Kwon Oh-hyun released a statement today, apologizing for the fatal hydrofluoric acid spill that left one worker dead and four others injured.
New 200 mm diameter wafer enhances photolithography capability.
Coherent, Inc. has expanded its family of industrial ultrafast lasers with the new Talisker 1000 series. This new series of high power picosecond lasers is designed for high-throughput, precision materials processing applications in the semiconductor, solar (photovoltaics), medical devices, consumer electronics and automotive industries.
Worldwide sales of semiconductors were $24.05 billion the month of January, up 3.8% from January 2012 and down 2.8% from December 2012, according to the Semiconductor Industry Association (SIA).
After experiencing a slowdown in 2012, the global semiconductor market is set for growth. The World Semiconductor Trade Statistics predicts the global semiconductor market to grow by 4.5% in 2013 after declining 3.2 percent in 2012.
Tensoft's web-based product will streamline operations for recently-acquired product line.
The U.S. Photovoltaic Manufacturing Consortium (PVMC), an industry-led collaboration headquartered in New York at the SUNY College of Nanoscale Science and Engineering (CNSE), has partnered with the U.S. Department of Energy’s National Renewable Energy Laboratory (NREL) to improve manufacturing processes for thin film CIGS photovoltaic (PV) cells and modules, including products, metrology and reliability that will support the U.S. solar industry in the development, manufacturing, and commercialization of next-generation solar PV systems.
O-S-D’s marketshare of total semiconductor sales in 2012 was highest since 1991. Seven O-S-D product categories and device groups reached record-high sales in 2012 compared to 14 new records being set in 2011, according to data shown in the 2013 edition of IC Insights’ O-S-D Report.
Solid State Technology is proud to announce that Yoon-Woo Lee will be speaking at The ConFab 2013. The event will be held June 23-26, 2013 at The Encore at The Wynn in Las Vegas. Lee is the Executive Advisor of Samsung Electronics.
After reaching a worrisome high in the third quarter of 2012, global semiconductor inventories held by chip suppliers fell at a surprisingly fast rate in the fourth quarter, led by dramatic reductions for market leader Intel Corp.
Foundry to use wafers for 3D IC and advanced packaging volume production applications.
System Plus Consulting analyzed a BAW MEMS Filter manufactured by Avago Technologies, assessing its manufacturing process, costing results and breakdown. With more than 1 billion units produced per year and a market share of 65%, System Plus Consulting found that Avago Technologies clearly dominates the BAW filter market. Avago BAW filters are all-silicon MEMS devices manufactured with Avago's FBAR and Microcap technologies.
In the power electronics field, the fabless business model is not as common compared to the MEMS industry. For example, most power electronics players have their own capabilities/fabs dedicated mainly to silicon wafer manufacturing. According to Yole Développement, $4B was generated by MEMS fabless companies in 2012, against less than $300K in the power electronics area. Is power electronics a world apart?
Hiden announced this week the integration of on-board timers for real-time pulsed plasma measurement, the fast gating fully controllable within the MASsoft operating program. Two timers provide “gate open/close” and “gate increment” periodicity with sub-microsecond gating resolution to just 100 nanoseconds, phasing data acquisition precisely with each individual plasma pulse.
ALTIS Semiconductor, a global specialty foundry based in France, announced today the finalization of a foundry agreement with IBM Microelectronics. Under the terms of this agreement, ALTIS will be the foundry partner for the IBM 180nm SOI technology. ALTIS will deliver high volume products starting Q2 2013 and will secure capacity increase for 2014 and beyond to address the IBM forecasted demand.
OKI Engineering, provider of reliability evaluations and environmental conservation technologies for the OKI Group, recently delivered KGT-3MM-AP exhaust gas treatment equipment for atmospheric pressure CVD manufacturing equipment to semiconductor manufacturer ON Semiconductor's European plants.
Intersil Corporation this week announced major staff changes, with the appointment of new president and CEO and interim CFO.
Cadence Design Systems, Inc. today announced plans to aquire Tensilica, Inc. for approximately $380 million in cash. Tensilica had approximately $30 million of cash as of December 31, 2012.
PC capabilities and market are undergoing a historical deceleration, in another sign of shifting technology markets.
Neutron scattering technique provides new data on absorption of ion in microporous materials.
55nm LPe 1V is optimized for ultra-low power, reduced cost and improved design flexibility.
This week, India’s Finance Minister P Chidambaram offered incentives to chip makers to set up headquarters in India, in an effort to encourage local electronics manufacturing. However, the response from the industry has been less than positive. Many believe that is it is a good start, but far from sufficient.
STM, Imec, CEA-LETI, ASML, Soitec and EU representatives discussed directions at ISS Europe 2013 in Italy.
Brooks Instrument, a provider of flow measurement and control instrumentation to the microelectronics industry, will launch the GF135 pressure transient insensitive (PTI) mass flow controller at SEMICON China, March 19-21 at Shanghai New International Expo Center.
A researcher from North Carolina State University has developed a technique for creating high-density ceramic materials that requires far lower temperatures than current techniques – and takes less than a second, as opposed to hours. Ceramics are used in a wide variety of technologies, including body armor, fuel cells, spark plugs, nuclear rods and superconductors.
Mentor Graphics Corp. today announced availability of the Kronos Cell Characterization and Analysis platform. The Kronos platform quickly produces accurate performance models for standard cells, I/Os, and complex cells within an advanced, integrated environment.
Intel announced Monday a major move to expand its foundry business. Altera Corporation and Intel Corporation have entered into an agreement for the future manufacture of Altera FPGAs on Intel's 14nm tri-gate transistor technology.
The global market in Key Enabling Technologies (KET) is forecast to grow from about 650 billion euro in 2008 to over one trillion euro in 2015. In response to this growth, top professionals in fields utilizing KETs have formed an expert group to assist the European Commission in the implementation of the strategy to boost the industrial production of KETs-based products in Europe.
New automotive technologies that go beyond touchscreens, satellite radio, and voice-activated GPS commands are being tested and improved, and will soon begin to appear in many more new car models, resulting in solid growth for the automotive IC market through 2016.
Transphorm Inc. today announced at the 2013 ARPA-E Energy Innovation Summit that its novel 600V Gallium Nitride (GaN) module has enabled the world’s first GaN-based high power converter. Transphorm will demonstrate the product built with its customer-partner Yaskawa Electric, Japan at the upcoming APEC 2013 industry conference.
LFoundry, an analog mixed signal and specialized technologies foundry, today announced that it has entered into an agreement with Micron Technology, Inc. (NASDAQ: MU) to acquire Micron Technology Italia, Srl. and all of its semiconductor fabrication facility assets in Avezzano, Italy.
Joe Kwan is the Product Marketing Manager for Calibre LFD and DFM Services at Mentor Graphics. He is also responsible for the management of Mentor’s Foundry Programs. He previously worked at VLSI Technology, COMPASS Design Automation, and Virtual Silicon. Joe received a BA in Computer Science from the University of California Berkeley and an MS in Electrical Engineering from Stanford University.
New spin technique moves researchers at the University of Pittsburgh and Delft University of Technology closer to creating the first viable high-speed quantum computer.
Solid State Technology is pleased to announce that Dr. An Steegen, Senior Vice President of Process Technology at imec, will be presenting on CMOS scaling by 10nm at The ConFab 2013. In her presentation, Steegen will explain the paradigm shift underway in the semiconductor industry, where chip scaling is possible with the right materials and new design architectures to enable tomorrow’s smart systems.
Volunteers sponsored by SPIE, the international society for optics and photonics, were in Washington, D.C., last week to thank Congressional representatives for recent support for photonics R&D and to urge future support for in several key areas vital to economic growth and scientific progress.
MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, and Sidense Corp., a developer of logic non-volatile memory one-time programmable (OTP) memory IP cores today announced that Sidense's SLP 1T-OTP macros have been fully qualified for MagnaChip's 180nm 1.8/3.3/18V high-voltage CMOS and mixed-signal process.
The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR) in Singapore, has launched the Copper (Cu) Wire Bonding Consortium II. The consortium which rides on the successes of Phase I launched in 2010 aims to improve the reliability of semiconductor devices by tackling copper wire bonding issues related to corrosion and stress.
Advances in petawatt photonics, laser systems, optical sensing, holography, metamaterials, nonlinear and quantum optics, and related topics will be presented by leading experts at SPIE Optics + Optoelectronics in Prague next month. The weeklong conference will also feature sessions for industry and presentation of three prestigious awards from the International Commission for Optics (ICO).
Over the past five years, revenue dipped and spiked from the impact of the global recession; in the five years to come, increased offshoring will detract from the growth in global demand from an improved economy.
ChipStart LLC, a provider of semiconductor intellectual property (SIP), and DELTA Microelectronics, a provider of ASIC services for the semiconductor industry, announced a new joint venture this week.
North America-based manufacturers of semiconductor equipment posted $1.07 billion in orders worldwide in February 2013 (three-month average basis) and a book-to-bill ratio of 1.10, according to the February Book-to-Bill Report published today by SEMI. A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month.
Next generation memories are the emerging non-volatile memory technologies, which are expected to replace existing memories. However, not all existing memories will be replaced.
STMicroelectronics yesterday filed a complaint with the United States International Trade Commission (ITC). The complaint requests that the ITC initiate an investigation into the alleged infringement of five ST patents covering all of InvenSense, Inc.'s MEMS device offerings, as well as products from two of InvenSense's customers.
The futuristic “Internet of Things” will more than double to 2.1 billion units, leading to a dramatic growth of domestic companies, says Lux Research.
Tokyo-based Asahi Glass Co., Ltd. and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1 million to co-found a subsidiary business, Triton Micro Technologies , to develop via-fill technology for interposers, enabling next-generation semiconductor packaging solutions using ultra-thin glass.
STMicroelectronics announced today that Didier Lamouche, Chief Operating Officer, whose operational role was suspended when he took the assignment as President and Chief Executive Officer at ST-Ericsson in December 2011, has decided to resign from the company effective March 31, 2013 to pursue other opportunities.
According to the latest analysis by Semicast Research, Renesas Electronics was again the leading vendor of semiconductors to the OE automotive sector in 2012, ahead of Infineon Technologies. STMicroelectronics retained its position as third largest supplier, with Freescale fourth and NXP fifth. Semicast calculates that revenues for OE automotive semiconductors grew by 12% to USD $25.5 billion in 2012, while the total semiconductor industry is judged to have declined by almost three percent to USD $292 billion.
Berkeley Lab researchers recreate elusive phenomenon with artificial nuclei; highly relevant for future nanoscle devices where electrical charge is concentrated into very small areas
Lattice Semiconductor Corporation today announced the iCE40 LP384 FPGA, the smallest member of its iCE40 family of ultra-low density FPGAs. Enabling designers to rapidly add new features and differentiate cost-sensitive, space-constrained, low-power products, the new small footprint FPGA is ideal for applications such as portable medical monitors, smartphones, digital cameras, eReaders, and compact embedded systems.
Everyone wants faster access to stored data, and the issue is becoming critical with Big Data and cloud initiatives. With the speed of DRAM and the non-volatility of storage, Magnetoresistive Random Access Memory (MRAM) encourages a new way of thinking about storage applications. Storage is associated with longer latencies, but with MRAM storage can have similar latencies to memory. These capabilities and others make MRAM a catalyst for new thinking about how we design storage applications.
Global electronic components distributor Digi-Key Corporation today announced the signing of a global distribution agreement with MEMSIC, a provider of MEMS sensor components, sophisticated inertial systems, and leading-edge wireless sensor networks.
Smartphones are set to become even more flexible and more satisfying to use, thanks to a unique sensor system developed by STMicroelectronics. Combining three optical elements in a single compact package, the VL6180 is the first member of ST’s FlightSense family and uses a new optical-sensing technology that reduces the incidence of dropped calls and enables innovative new user interactions with smartphones.
How the semiconductor industry can create the next generations of nanoscale computing technology will be one of the themes of the 2013 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics, to be held at the National Institute of Standards and Technology (NIST), March 25-28, 2013, at its campus in Gaithersburg, Md.
Broadcom has been ranked number one vendor in three recent competitive assessments released by ABI Research on wireless connectivity IC markets. One was for overall wireless connectivity ICs, another on Bluetooth ICs, and a final on Wi-Fi ICs.
ABI Research finds that Mediatek has delivered the world’s smallest multimode transceiver. Coming just a week after Qualcomm announced its intentions to produce RF front ends for high tier LTE smartphones, Mediatek releases the world’s smallest RF transceiver which is also the world’s first 40nm transceiver.
Researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, today announced development of a modeling process designed to simulate atomic-level etching with chemicals that are effective alternatives to widely used perfluorocarbon (PFC) gases.
Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. and Benjamin S. Louie of Zeno Semiconductor blog about dimensional scaling as it relates to EUV and future per transistor device cost.
Most electronic systems that power our digital life are inflexible and flat. Rigid electronic designs work for our computers and phones but not for our bodies. Humans are soft and curved. Electronic systems capable of bending, twisting, and stretching have great potential for applications in which conventional, stiff semiconductor microelectronics would not suffice.
Solid State Technology is excited to have Jim Feldhan, President of Semico Research, present data and analysis from Semico’s MAP model, which provides insight into semiconductor revenues, units and wafer demand by computing, communications and consumer end markets.
Brion Technologies, a division of ASML, announced a major milestone today in its partnership with GLOBALFOUNDRIES. The companies are collaborating to deliver high-volume computational lithography capabilities for 28 nm and 20 nm tapeouts, while also accelerating the development of future nodes, including extreme ultraviolet (EUV) lithography.
PI miCos announced the release of a new 2-axis precision linear translation stage. The new MCS XY precision linear stage was designed for industrial precision motion control and surface metrology applications and combines robustness and high accuracy.
Semiconductor manufacturers, suppliers and academia to collaborate on real-world issues at SEMI event.
Wafers with a diameter of 450mm enable the micro-chip industry an increase in yield of up to 80%. This leads to an enormous increase in productivity. In order to control the product quality, these wafers receive a specific marking from the manufacturer.
ON Semiconductor will demonstrate new digital AC-DC PWM controllers, motor drivers and IGBTs at industry’s premier power electronics show.
Dynamic changes to R&D processes, tools, technical challenges, and funding/business models will be highlighted at SEMICON West 2013, along with product displays of the latest semiconductor manufacturing technology, components and subsystems.
Mobile energy storage is critical for everything from the phones and computers we carry, to the soldiers and weapons that protect us – and even to the cars we drive. While lithium-ion (Li-ion) batteries have established themselves as the leading technology today, exotic ideas such as lithium-air, lithium-sulfur, solid-state and zinc-air batteries offer up to 10 times better energy density.
Growth in the last quarter of 2012 pulled GaAs device revenue to a slight gain for 2012. The Strategy Analytics GaAs and Compound Semiconductor Technologies Service (GaAs) Insight, “GaAs Device Industry Closes up in 2012,” explores GaAs device revenue growth and trends. It also presents the revenue performance of leading GaAs device manufacturers and foundries like RFMD, Skyworks, TriQuint Semiconductor, Avago Technologies and WIN Semiconductors.
ARM Holdings plc, a semiconductor intellectual property (IP) supplier, announces today that Chief Executive Officer Warren East has decided to retire from the company, effective 1 July 2013, after nearly 12 years as CEO and 19 years at the company. Simon Segars, currently President of ARM, will become the company’s new CEO.
In an effort that will accelerate commercialization of extreme ultraviolet (EUV) lithography technology and the development of next-generation transistors, SEMATECH announced today that Intermolecular, Inc. has joined SEMATECH’s Lithography and Front End Processes (FEP) programs.
Cadence Design Systems, Inc. today announced an ongoing multi-year agreement with TSMC to develop the design infrastructure for 16-nanometer FinFET technology, targeting advanced node designs for mobile, networking, servers and FPGA applications.
Solid State Technology is excited to announce that Mark Thirsk, managing partner at Linx Consulting, will be discussing the cost and technology needed to implement next-generation device technology at The ConFab 2013. Thirsk has over 20 years of experience in the chemical industry, working with a variety of materials and processes utilized in wafer fabrication.
Gigaphoton, Inc., a lithography light source manufacturer, announced today that as of April 2013, it has started business operations at the Gigaphoton Singapore Branch, its newly established branch in that country.
A new £1million (or US$1,530,700) growth facility will allow University of Cambridge researchers to further reduce the cost and improve the efficiency of LEDs, with potentially huge cost-saving implications.
Fulfilling the promise of performance and power scaling at 16nm, ARM and Cadence today announced details behind their collaboration to implement the first ARM Cortex-A57 processor on TSMC's 16nm FinFET manufacturing process.
AIXTRON SE today announced that it is participating as a key partner in the recently announced European Union (EU) Future Emerging Technology (FET) flagship project “Graphene.”
University of Manchester graphene researchers have been awarded a £3.5 million (or approximately US$5 million) funding boost that could bring desalination plants, safer food packaging and enhanced disease detection closer to reality.
It’s no secret that Samsung is up against Apple in many ways, in products, sales and innovation. However, even in the face of Apple’s patent infringement lawsuits, Samsung is still climbing the charts.
Bruker announced today the release of the Dimension Icon SSRM-HR, a new atomic force microscope (AFM) configuration including the Scanning Spreading Resistance Microscopy (SSRM) module, designed specifically for high-resolution (HR) semiconductor characterization.
Machinery Production in China is forecast this year to rebound 11 percent to $426 billion after suffering from overcapacity in 2012 that limited industry growth, according to a new report from IMS Research, now part of IHS Inc.
The Temescal Division of Ferrotec Corporation today announced the Temescal UEFC-5700, a ultra-high efficiency electron beam metallization system for lift-off compound semiconductor applications.
Kotura inks fab agreement; announces relationships with Mindspeed and BinOptics.
MV Products has announced that their high-capacity, modular vacuum pump inlet-exhaust traps can be stacked for semiconductor wafer fabrication processes which produce a lot of heavy particulates.
Spansion Inc., a developer flash memory solutions for embedded markets, and XMC, China’s fastest-growing 300mm semiconductor foundry, today announced an expanded partnership, to develop and manufacture Spansion 32nm NOR Flash memory. The agreement expands XMC’s current 300mm manufacturing of Spansion’s proprietary 65nm and 45nm flash memory technology.
Brooks Instrument, a provider of advanced flow, pressure, vacuum and level solutions, has expanded its GF 40/80 Series portfolio of thermal mass flow controllers. Broader capabilities, including increased flow rates up to 50 slpm and a “normally open” valve for non-hazardous gas applications, are ideal upgrades for users of Aera (Hitachi), Celerity, Tylan, Mykrolis, Millipore and Unit mass flow controllers, as well as other competitive devices.
A joint industry/academia consortium, supported by the European Union's Seventh Framework Programme, has reported the successful conclusion of a three-year project and the release of its design-synthesis tool flow and related litho-friendly cell libraries and evaluation metrics.
American Graphite Technologies Inc. announced today the successful production of test samples of a graphene paper product by its development and manufacturing partner, CTI Nanotechnologies LLC.
It’s no secret: the past five years for the IC industry have been full of challenges. From 2007-2013, the IC market grew at an average annual rate of only 2.1%. One of the speakers slated to speak at The ConFab 2013 in Las Vegas has good reason to believe the IC industry is set to emerge from this difficult cycle.
Mentor Graphics User Conference 2013 speaker line-up boasts a host of industry bigwigs, including former foundry CTO, Dr. Chenming Hu. Hu will give the keynote address on April 25 in San Jose, California, addressing the future of FinFET.
Cisco Systems is preparing for a major shift in the industry, as the Internet of Things starts to become a reality. At an annual press event in San Jose, California this week, Cisco officials claimed that the much-anticipated IoT industry could be a $14 trillion opportunity, and they are ready to embrace the change.
OneChip Photonics this week revealed strategic, outsourcing plans to expand into new markets, with announcements of newly-established relationships with semiconductor foundry GCS and wafer supplier IQE. Both announcements related to OneChip’s bigger, strategic plan to expand its services into the high-volume DCI market.
Solid State Technology is thrilled to announce that Dan Hutcheson, CEO of VLSI Research, will be addressing the state of the semiconductor industry at The ConFab 2013. Hutcheson is a well-known visionary, helping companies make business out of technology for over thirty years and is best known for his many predictions of strategic industry infrastructure shifts.
Imec announced today the launch of its fully integrated silicon photonics platform through a cost-sharing Multi-Project Wafer (MPW) service via ePIXfab.
Nanoplas, a global supplier of plasma processing equipment to the semiconductor industry, today announced a new dry-etch process offering virtually unlimited etch selectivity for removing dielectric films on microprocessors and memories at high throughput.
Intermolecular, Inc. today announced that Dr. Raj Jammy has joined the company as senior vice president and general manager of the semiconductor group.
Pixelligent Technologies, a manufacturer of nanocrystal additives for the electronics and semiconductor markets, last week announced the launch of its PixClear Zirconia nanocrystals. When incorporated into existing products, the nanoadditives can dramatically increase light output and readability of modern touch screens and displays.
Many users of microwave ovens have had the frightening experience of leaving a fork, crumpled piece of aluminum foil or some other pointy metal item inside the cooking chamber. The sharp metal object acts as an antenna for the oven’s microwave radiation, causing strong local heating or sparking.
The long-expected demise of optical lithography for manufacturing ICs has been delayed again, even though the technology itself has reached a plateau with a numerical aperture of 1.35 and an exposure wavelength of 193nm. Immersion lithography is planned for the 20/22nm node, and with the continued delay of EUV, is now the plan of record for 14nm.
Aledia, a developer of LEDs-based on disruptive microwire GaN-on-Silicon technology, announced today that it has made its first LEDs on 8-inch (200mm) silicon wafers.
Holst Centre and imec have developed an integrated piezoelectric energy interface IC with zero bias rectifier circuit and energy-aware supply regulator.
Despite facing five consecutive quarters of decline and a slowdown in consumption in smartphones and tablets, the global market for NAND flash memory pulled off a surprise growth spurt during the last three months of 2012, causing sales to reach a record high.
Solid State Technology is pleased to announce Subu Iyer, IBM Fellow, will be giving the keynote address at The ConFab 2013 in Las Vegas on Tuesday, June 25, 2013. Iyer will speak on orthogonal scaling to fill today’s fabs in the future.
A new undergraduate program approved this week at the University of Central Florida (UCF) will help the U.S. stay competitive in global technology as well as broaden the path for students seeking rewarding careers in the important field of optics and photonics, say leaders of SPIE, the international society for optics and photonics.
The second Cleanzone on October 22 and 23, 2013 in Frankfurt am Main is off to a promising start with a stronger profile. Last year, the trade fair and congress made a successful debut as the new international industry meeting point for cleanroom technology. It is targeted towards all companies and sectors in which industrial production is taking place under cleanroom conditions today and tomorrow.
Consumers increasingly want to use their media tablets and smartphones to stream high-definition video to displays in their cars, a phenomenon that will help to nearly double the size of the market for semiconductors used in automotive wired and wireless network applications from 2011 to 2018.
ProPlus Design Solutions, Inc. yesterday launched NanoSpice, the next-generation high-capacity, high-performance parallel SPICE simulator for giga-scale circuit simulation.
Nitronex, a designer and manufacturer of gallium nitride (GaN) based RF solutions for high performance applications, has named David W. Runton as its new Vice President of Engineering.
ARM and TSMC today announced the first tape-out of an ARM Cortex-A57 processor on FinFET process technology. The Cortex-A57 processor is ARM's highest performing processor, designed to further extend the capabilities of future mobile and enterprise computing, including compute intensive applications such as high-end computer, tablet and server products.
India registered 221.6 million mobile handset shipments during 2012, according to CMR’s India Mobile Handsets Market Review, CY 2012, March 2013 release. During the same period, 15.2 million smartphones were shipped in the country.
Swiss specialty chemicals group Clariant International AG acquired the nano-silver ink technology platform developed under the trademark Bayink from Bayer Group, Germany.
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $23.25 billion for the month of February 2013, an increase of 1.4 percent from February 2012 when sales were $22.93 billion. Effective government policies needed to spur stronger growth.
SUMCO is putting its semiconductor wafer manufacturing facility near Cincinnati, OH, up for sale, seeking buyers from "alternative advanced technology" areas including solar PV, batteries, and even data centers.
Paul Hooge from Plastomer discusses the selection criteria when using polytetrafluoroethylene (PTFE) for ultrahigh-purity fluid handling applications.
Techcet's Michael A. Fury closes out his series of observations from this year's MRS Spring meeting in San Francisco. From Day 5: Ge-Si integration, carbon nanotubes in organic photovoltaics, energy storage using paper, printable GaN semiconductors, and stretchable circuit boards and conductors.
Highlights from Day 4 of the 2010 MRS Spring meeting, reported by Techcet's Michael A. Fury: TSVs and flexible interconnects for 3D CMOS/MEMS; 300mm BCB wafer bonding; carbon nanotube interfaces for interconnects and vias; phase-change memory devices; interfaces during ALD of rare earth-based high-k dielectrics; and graphene's use in on-chip interconnects and transparent conductor electrodes.
Techcet's Michael A. Fury continues his series of observations from this year's MRS Spring meeting in San Francisco. From Day 3: Noncontact planarization; nanoimprint lithography; sub-32nm memory; sensors made with FETs, Si, and CNTs, solution-phase metal-semiconductor nanowires; patterned organic electronics, inkjet printed sensors, and a flow coating method for highly aligned semiconducting polymer films.
Organic electronics such as TIPS pentacene show promise for lower costs and improved functionality in applications from handheld displays to sensors to RFID -- but a steep learning curve means collaborative multidisciplinary efforts are essential, explain David Redinger and Karl Manske from 3M.
Techcet's Michael A. Fury continues his series of observations from this year's MRS Spring meeting in San Francisco. From Day 2: CVD for Cu interconnects, controlling low-k etch-stop layers, materials challenges for future FETs, "atom hopping" in graphene, and oxide nanoelectronics on demand.
In an SST exclusive, Techcet's Michael A. Fury offers a series of observations from this year's MRS Spring meeting in San Francisco. First up: Day 1 discussions ranging from memory architectures, organic electronics, graphene, and solar photovoltaics.
Willbe S&T selected VICTREX PEEK polymer as the material in its chemical mechanical planarization (CMP) retaining rings. Willbe S&T’s insert molded CMP ring provides better performance, longer life and reduced cost compared to traditional two-piece bonded type CMP retaining rings made with stainless steel and polyphenylene sulfide.
Polymers used in wafer shippers, read-write head trays, etc., are susceptible to wear. Wear testing the right way is key to improving use of polymers for data storage and semiconductor fab lines. Jeffrey A. Galloway and Sanjiv Bhatt, Entegris Inc., describe a method for testing polymer wear.
HBr with consistently low water vapor levels is critical to prevent delivery system corrosion and device performance issues during trench etch for CMOS fabrication. Jianlong Yao et al, Matheson, present the effect of cylinder material on delivered moisture concentration in gas phase HBr. Polished AISI Cr-Mo steel, Nickel-lined AISI Cr-Mo steel, and 316L stainless steel cylinders show markedly different results.
Mark Danna, Owens Design, discusses the key questions that should be asked when selecting a strategic outsource partner particularly in the area semiconductor and solar manufacturing equipment development.
Nexam Chemical introduced Neximid PETA, which enables heat-activated ethynyl crosslinking of Polyimides at lower temperatures than previously possible.
Edwards, vacuum and abatement equipment and services provider, expanded its iXA family of magnetically-levitated turbomolecular pumps with the introduction of the STP-iXA2206 and STP-iXA3306 pumps.
SAFC Hitech announced plans to build a new, dedicated facility in Kaohsiung, Taiwan for transfilling, technical service and production of chemical precursors used for high brightness LED and silicon semiconductor manufacturing.
Stephen Rothrock from ATREG talks about his company's spinoff to provide technology manufacturing asset consulting services, how the industry's volatility keeps them in business, and how they'll go after a potential $300B market.
Jeff Schake, et al, DEK Printing Machines, discuss the flatness characteristics of available wafer pallets, and use them in an experiment with thinned wafers in automated printing. With thin wafers, and the requirement for low coating thickness, the wafer-support tooling surface metrology should have an appreciable impact on coating thickness control.
Showa Denko says it will spend ¥200M for a new JV in China to supply photoresist solvent for domestic manufacturers of semiconductors and LCD panels, expanding its business in Asia outside Japan.
Entegris execs summarize two poster papers from the SPIE Advanced Lithography Conference that covered the company's methods to detect ppt levels of trimethylsilanol (TMS), and evaluating microbridging defects in which 5nm filtration was compared to 3nm filtration levels.
Crossing Automation says it is riding a wave generated in part by last year's acquisition of Asyst's frontend component technologies, with multiple new design wins and repeat business, says top exec Robert MacKnight.
Christopher Wargo, Entegris, talks contamination control at 22nm and below. Lithography presents a suite of issues for contamination control. While the technology exists to confront new contaminants, commercialization is key.
Lockheed Martin (NYSE: LMT) opened new facilities at its Space Systems Company operations in Newtown, PA. The additions include more clean room space, demonstration areas, antenna range, and more.