sst-semiconductors

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Xilinx FPGA boasts 6.8B transistors

Tue, 10 Oct 2011

Xilinx Inc. (Nasdaq:XLNX) began shipping its Virtex-7 2000T field programmable gate array (FPGA), a programmable logic device with 6.8 billion transistors: 2 million logic cells, a die-stack architecture, low power consumption, and a more flexible design than large ASICS and monolithic FPGAs.


TSV electroplating dev team unites SVTC, Amerimade Technology, Shanghai Sinyang Semiconductor Materials

Wed, 10 Oct 2011

Nanotech accelerator SVTC Technologies, wet chem equipment maker Amerimade Technology, and chemicals company Shanghai Sinyang Semiconductor Materials will collaborate on electroplating processes for TSV that are production-ready for advanced packages and MEMS.


Air-cooled wafer probe chuck debuts in modular format

Mon, 10 Oct 2011

ERS uncrated the ERS AirCool 3 wafer thermal test system with modular options and easy integration into all major wafer prober systems.


Tamar Technology debuts TSV metrology tool WaferScan

Tue, 10 Oct 2011

Tamar Technology shipped its first fully automated WaferScan system to a major semiconductor fab. The system performs TSV etch depth, deep trench depth, wafer thickness, photo-resist thickness, and hole diameter metrology.


Samsung Electronics ramps embedded multi-chip packaging with memory products

Thu, 1 Jan 2012

Samsung Electronics began producing embedded multi-chip package (eMCP) memory for use in entry- to mid-level smartphones. The products use low power double-data-rate 2 (LPDDR2) 30nm DRAM and 20nm NAND flash memory.


MHI room-temp wafer bonder line grows with 300mm tool

Mon, 1 Jan 2012

Mitsubishi Heavy Industries launched a fully automated 12" (300mm) wafer bonding tool, Bond Meister MWB-12-ST, capable of producing 3D LSI circuits at room temperature. The 300mm bonder targets production of memory chips and MPUs.


JEDEC publishes wide-I/O mobile DRAM standard

Thu, 1 Jan 2012

JEDEC Solid State Technology Association released a new standard for wide I/O mobile DRAM: JESD229 Wide I/O Single Data Rate. Wide I/O mobile DRAM increases die integration -- stacking chips with TSV interconnects with a SoC -- and improves bandwidth, latency, power, weight, and form factor.


Advantest to expand beyond semiconductor test

Thu, 1 Jan 2012

Haruo Matsuno, president and CEO of Advantest Corporation (TSE:6857, NYSE:ATE) shares the company's major goals, including expansion into new measurement applications, utilization of cloud computing, and more.


@ The ConFab: Supply chain or supply web for 3D packaging?

Wed, 6 Jun 2012

With many advanced packaging processes taking place on the semiconductor wafer, the traditional supply chain of front-end fab at the foundry and back-end fab at the packaging and test house is falling apart. The ConFab session,

Semiconductor packaging house orders 14 Rudolph Technologies inspection tools

Tue, 5 May 2012

Rudolph Technologies Inc. will deliver 14 NSX Series 320 inspection systems to a large outsourced semiconductor assembly and test (OSAT) provider.


Direct chip bonding, all-SiC design increase power density in Mitsubishi Electric inverter

Wed, 5 May 2012

Mitsubishi Electric Corporation developed a prototype forced-air-cooled three-phase 400V output inverter with all-silicon carbide (SiC) power modules and direct lead bonding that has a power density of 50kVA per liter.


Indium expands electronics materials manufacturing with new facility in NY

Wed, 5 May 2012

Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds.


Rudolph sells metrology tool for back-end wafer packaging processes

Mon, 2 Feb 2012

Rudolph Technologies (NASDAQ:RTEC) delivered the first MetaPULSE metrology system to measure under bump metallization (UBM) and redistribution layers (RDL) in advanced package manufacturing.


X-FAB Silicon Foundries adopts SFT software

Fri, 2 Feb 2012

X-FAB Silicon Foundries, a More-than-Moore semiconductor foundry, has used SFT's R3D (Resistive 3D) software for its 0.18

USPTO seeks nominees for National Medal of Technology and Innovation

Tue, 1 Jan 2012

The USPTO is looking to increase the diversity of honorees for its annual National Medal of Technology and Innovation (NMTI), honoring "this nation's creative geniuses."


Lifting the veil on silicon interposer pricing

Mon, 12 Dec 2012

Are we closer than we think to our needed mass production costs for silicon interposers? Phil Garrou gleans some insights from the year-ending RTI Architectures for Semiconductor Integration and Packaging conference.


Singapore IME launches 2.5D silicon interposer MPW

Wed, 12 Dec 2012

Singapore's Institute of Microelectronics (IME) has launched a new multiproject wafer service for 2.5D through-silicon interposers, to provide a cost-effective platform for R&D prototyping and proof-of-concept in the technology.


Tezzaron licenses Ziptronix's bonding tech for 3D memory

Mon, 12 Dec 2012

Tezzaron Semiconductor has licensed patents regarding Ziptronix's direct bonding technologies, "direct bond interconnect" (DBI) and "direct oxide bonding (ZiBond), for use in 3D memory.


Will the $2 interposer be silicon or glass?

Tue, 11 Nov 2012

Dr. Phil Garrou reports from the 2nd annual Georgia Tech 2.5D Interposer Conference: what's the market projection for silicon and glass interposers, what's preventing high-volume manufacturing, and is there a crossover with flat-panel display glass manufacturing?


Alchimer pursuing partners with new CEO, CTO

Tue, 11 Nov 2012

Alchimer SA says it is seeking partnerships with various semiconductor equipment and materials companies as it welcomes two top execs: Bruno Morel is the company's CEO since May of this year, and product development director Fr

Deca tips new M-Series chip-scale packaging offering

Wed, 11 Nov 2012

Deca Technologies has introduced a new chip-scale packaging (CSP) product line for applications where its existing wafer-level CSP option isn't a good fit. Details and analysis to come.


New LTXC semiconductor test tools suit ASSP, RF test

Mon, 3 Mar 2012

LTX-Credence Corporation (Nasdaq:LTXC) released the Diamondx test platform for ASSP and the DragonRF for RF device test. In addition, LTX-Credence launched a SerDes test instrument and new testing software.


TEL acquires advanced packaging tool supplier NEXX

Fri, 3 Mar 2012

TEL will acquire semiconductor packaging equipment supplier NEXX Systems. NEXX makes advanced deposition equipment, including ECD and PVD tools, for wafer-level packaging (WLP).


Lockheed Martin develops new Cu solder

Mon, 10 Oct 2012

Lockheed Martin scientists have developed a new "nanotechnology" copper-based solder that it says will produce joints with up to 10

ICECool puts 3D thermal issues back in focus

Mon, 10 Oct 2012

With the approach of full commercial production of 3DIC products, Dr. Phil Garrou shifts his attention to thermal performance questions and proposed thermal solutions for the future.


SPTS Technologies, Fraunhofer IZM researching lower-temp films for TSVs

Thu, 10 Oct 2012

Fraunhofer IZM's All Silicon System Integration Dresden (ASSID) center will add SPTS' etch and PECVD process capabilities to investigate low-temperature dielectric films for through-silicon vias (TSV) in 3D IC packaging.


Why SATS consolidation needs to happen

Fri, 10 Oct 2012

The advent of leading-edge semiconductor packaging technologies dictates efficient use of capital, and only the top-tier semiconductor assembly and test services (SATS) companies will have the financial wherewithal to develop required expertise and capacity, says one analyst.


Nanium ships 200 millionth eWLB component

Wed, 10 Oct 2012

Nanium says it has shipped its 200 millionth embedded wafer-level ball grid array technology (eWLB) component, a 10% year-over-year productivity increase that reflects full conversion to the company's eWLB overmold technology that allows thinner and more robust packages.


Tessera to CEO: Spin off a business by 2015, vest $7.5M shares

Fri, 10 Oct 2012

Tessera Technologies is giving CEO Robert A. Young a big financial incentive to spin off one of its two businesses by March 2015, one of the company's key long-term strategic goals.


KIT develops "photonic wire bond" for optical chip connections

Thu, 9 Sep 2012

Researchers at the Karlsruhe Institute of Technology (KIT) say they have developed a novel optical connection process for semiconductors using "photonic wire bonding" that achieves data transmission rates of several Tbit/sec.


SPTS unveils low-temp PECVD cluster tool for 3D ICs

Wed, 9 Sep 2012

SPTS' Delta fxP cluster system achieves low-temperature deposition of TEOS oxides and nitrides for via-reveal passivation in 3D IC packaging, solving two key problems of low temperatures and bonding adhesive outgassing.


UMC, ST to develop 65nm backside CMOS image sensors

Mon, 9 Sep 2012

Rudolph wins order for advanced packaging metrology systems

Thu, 9 Sep 2012

An unidentified "premier global industry research center in Asia" will use Rudolph Technologies' MetaPulse G metrology system in its advanced packaging process development activities.


Backside-illuminated image sensors: Optimizing manufacturing for a sensitivity payoff

Fri, 11 Nov 2011

Backside-illuminated image sensors require more precise wafer processing -- uniform extreme wafer thinning, dopant control, epitaxy growth, trench manipulation, etc. -- but the payoff in image quality is significant. Researchers at imec experimented with different wafer fab technologies to make a record BSI sensor. They also consider new architectures/packaging techniques for this technology.


WLP start-up combines SunPower solar silicon fab with Cypress semiconductor interconnect

Wed, 11 Nov 2011

Deca Technologies, a new company backed by Cypress Semiconductor and SunPower, will combine solar wafer manufacturing methods with semiconductor manufacturing support to create wafer-level chipscale packaging (WLCSP) derivatives.


IBM fabs Micron memory cube with TSV tech

Fri, 12 Dec 2011

Using the advanced through-silicon via (TSV) fabrication process at IBM (NYSE:IBM), Micron Technology Inc. (NASDAQ:MU) will begin producing its Hybrid Memory Cube. The companies claim that this is the first CMOS design to go commercial with TSV interconnects.


Partnership forms to commercialize advanced photonic chip innovations

Tue, 11 Nov 2011

The Institute of Microelectronics, a research institute of Singapore's A*STAR, plans to commercialize key innovations in silicon photonic chips designed to support high-speed, high-bandwidth optical communications.


Leti on 3D CMOS and photonics interconnect

Mon, 11 Nov 2011

Leti

NeoPhotonics doubles PIC production capacity

Wed, 11 Nov 2011

Citing rising demand and a potential industry shortage, NeoPhotonics is in the process of more than doubling its production capacity of narrow linewidth tunable lasers with minimal expected additional capital expenditures.


22nm requires foundry-to-packaging-house cooperation

Fri, 12 Dec 2011

At the 22nm node, die fragility and challenging interconnect materials will necessitate foundry collaborations with packaging houses, co-designing silicon and package, asserts E. Jan Vardaman, TechSearch International.


Hybrid Memory Cube interface specification draft includes protocol, short-reach PHY interconnection

Wed, 8 Aug 2012

The Hybrid Memory Cube Consortium released the initial draft of the Hybrid Memory Cube (HMC) interface specification, with the final version planned for end of 2012.


Flooding in the Philippines threatens microelectronics facilities

Thu, 8 Aug 2012

Heavy monsoons moving through the Philippines are causing floods in and around Manila, the capital. The Philippines is a small but growing area for microelectronics manufacturing and packaging facilities.


ASIC developers can now access multi-project wafer runs at Tektronix Component Solutions

Wed, 8 Aug 2012

Tektronix Component Solutions, a custom microelectronics services provider, tapped supply chain aggregator MOSIS to help its customers develop complete, high-performance ASICs with lower early-stage ASIC development costs.


Agilent

Tue, 8 Aug 2012

Agilent debuted its compliance test application, Agilent N6462A DDR4, for systems using DDR4 memory.


Semiconductor test terminology guide aims to clarify docking and handling ops

Tue, 7 Jul 2012

SEMI's Collaborative Alliance for Semiconductor Test released a Docking and Mounting Generic Terminology Guideline document that can be used to improve the

ULIS invests EUR20M in advanced IR imaging sensor fab and packaging

Tue, 7 Jul 2012

ULIS invested EUR20 million in a new state-of-the-art facility to meet increasing market demands for IR technology, with a move to 200mm wafers and pixel/wafer-level packaging techniques.


2.5/3D interposers fabbed at 30% lower COO with USHIO

Mon, 7 Jul 2012

USHIO Inc. is introducing the large-field stepper lithography tool

Xilinx boosts silicon and electronics engineering in Ireland

Thu, 7 Jul 2012

Xilinx will invest $50 million to expand its electronics engineering operations, located at the company

3D and 2.5D Integration: A Status Report preview with TechSearch International

Tue, 6 Jun 2012

Solid State Technology is hosting 3D and 2.5D Integration: A Status Report, sponsored by EVG and ALLVIA, and is free for all attendees. This preview shares a sneak peek at

Xilinx speaker joins 3D packaging webcast roster

Tue, 6 Jun 2012

Solid State Technology is hosting a free webcast, 3D and 2.5D Integration: A Status Report. A fourth presenter has just been announced, Brent Przybus, Senior Director, Product Line Marketing, Xilinx Inc.


New speaker added for 3D and 2.5D Integration webcast

Mon, 6 Jun 2012

Solid State Technology will present 3D and 2.5D Integration: A Status Report on June 27, free for all attendees. William Chen, ASE, will join speakers David McCann, GLOBALFOUNDRIES and E. Jan Vardaman, TechSearch International.


ams offers foundry customers KGD with enhanced IC test

Mon, 6 Jun 2012

The Full Service Foundry business unit of ams extended its dedicated test solutions for foundry customers, offering known good die (KGD), with customers' complex analog/mixed-signal ICs 100% electrically tested according to their own test specification.


Conference report: IITC closes with talks from EUV to TSV

Thu, 6 Jun 2012

Day 3 of the 15th IITC (International Interconnect Technology Conference) opened in San Jose, CA under clear sunny skies and a pleasant breeze. The herd thinned a bit, down to ~150 hearty souls from the original 230 the prior two days.


imec, PVA Tepla demo 3D TSV void detection

Thu, 1 Jan 2013

Imec and PVA Tepla say they have achieved void detection in through-silicon vias at wafer level, after TSV copper plating, thanks to a nondestructive high-frequency scanning acoustic microscopy (SAM) technique.


Novati to use Ziptronix bonding tech for 3D assembly

Fri, 1 Jan 2013

Novati Technologies Inc. has licensed Ziptronix's direct bonding technologies, "direct bond interconnect" (DBI) and "direct oxide bonding (ZiBond), to offer 3D stacking services and test to customers.


Ultratech brings former member back to Board

Thu, 4 Apr 2012

Ultratech, lithography and laser-processing system supplier to semiconductor manufacturers and packaging providers, added Michael C. Child to its Board of Directors. Child served on Ultratech

MOSAID multi-chip package stacks 16 NAND Flash die on 1 channel

Thu, 4 Apr 2012

MOSAID Technologies Inc. is sampling a 16-die stack NAND Flash device operating on a single high-performance channel, the 5126Gb HLNAND.


Bruker bolsters CT imaging line with SkyScan buy

Mon, 4 Apr 2012

Bruker Corporation acquired all of the shares of SkyScan NV, a scientific instruments company serving materials science and life sciences/pre-clinical imaging needs.


SUSS buys Tamarack for lithography, laser structuring lines

Fri, 3 Mar 2012

SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.


Semiconductors see some softness in Q1 2012

Tue, 4 Apr 2012

Semiconductor lead times decreased at the end of February 2012, reports analyst firm Gartner Inc. Although Gartner still expects the semiconductor industry to grow in 2012, Q1 showed some signs of softness.


Hynix brings NAND Flash memory to NOR maker Spansion

Tue, 4 Apr 2012

Spansion Inc. (NYSE:CODE) and SK Hynix formed an alliance to deliver Spansion SLC NAND Flash products at the 4x, 3x, and 2x nodes to the embedded market. Spansion is known as a NOR Flash memory provider.


Semiconductor sales flat through February 2012

Tue, 4 Apr 2012

The Semiconductor Industry Association (SIA) measured worldwide semiconductor sales at $22.9 billion in February 2012, down 1.3% from January’s $23.2 billion and 7.3% from February 2011.


Semiconductor makers spend record amount on materials for second straight year

Tue, 4 Apr 2012

The global semiconductor materials -- wafer fabrication and packaging materials -- market increased 7% in 2011 compared to 2010, with record revenues of $47.86 billion, said SEMI.


Analog appraised: Demand and inventories at top chip makers

Mon, 4 Apr 2012

Sterne Agee analyzes top analog semiconductor companies and the analog sector as a whole. Demand is stable (industrial, automotive) to improving (computing), and distributor inventories are low.


SEMICON West heralds 22nm, EUVL, 450mm, mobile electronics speakers

Mon, 4 Apr 2012

Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.


Qualcomm IC design and engineering R&D center to bolster Singapore hub

Fri, 3 Mar 2012

Qualcomm Incorporated (NASDAQ:QCOM) will establish an integrated circuit (IC) design and engineering R&D center in Singapore.


Top 10 semiconductor foundries in 2011

Fri, 3 Mar 2012

The worldwide semiconductor foundry market totaled $29.8 billion in 2011, a 5.1% increase from 2010, according to Gartner. Given aggressive foundry spending in 2010 and 2011, oversupply was "inevitable," Gartner says.


MOCVD advances, InGaN enable record HEMT material from Kopin

Thu, 3 Mar 2012

Kopin Corporation achieved record 1290cm2/V.s electron mobility and 240ohms/square sheet resistance results from GaN-based high electron mobility transistor (HEMT) materials.


Transparent memory chip under development at Rice U

Thu, 3 Mar 2012

Rice University is developing transparent, flexible memory devices based on silicon oxide, enabling future consumer applications with flexible touchscreens, transparent batteries, see-through ICs, and more.


Semiconductor wafer fab utilization rates bucked expectations in late 2011

Thu, 3 Mar 2012

The Global Semiconductor Alliance (GSA) released its GSA Q1 Wafer Fabrication & Back-End Pricing Reports, tracking fab utilization rates, wafer and mask costs, and package pricing.


CMOS power amplifiers grab market share from GaAs

Wed, 3 Mar 2012

In its report, "RF filters, PAs, Antenna Switches & Tunability for Cellular Handsets," Yole Développement notes that new technologies are changing the power amplifier sector. PAs are strategic RF components in cell phones.


EVG wins repeat order from wafer-level camera maker

Tue, 3 Mar 2012

Himax Technologies placed a repeat order for an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EVG.


High voltage SourceMeter introduced

Tue, 3 Mar 2012

Applied Materials analyst day preview

Mon, 3 Mar 2012

Applied Materials will host its annual Analyst meeting this week (March 28). Barclays Capital shares its expectations for AMAT's update and the wafer fab equipment (WFE) outlook in general.


ARM’s Segars sees changing requirements for electronics driven by mobile

Mon, 3 Mar 2012

At the recent Common Platform Technology Forum -- produced by Global Foundries, Samsung and IBM -- Simon Segars, executive vice president and general manager of the physical IP division at ARM, spoke about the impact of the internet of things and mobile computing on the way electronics are designed and used.


2011 ITRS: DRAM, 3D Flash, MEMS, nano scaling steal the show

Wed, 2 Feb 2012

The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.


Compound semiconductor makers focus on growing high-frequency market

Wed, 2 Feb 2012

Handset products dominate compound semiconductor revenue, but microelectronics companies focus development on high-performance, high-frequency applications where volumes are lower and products are differentiated by performance, reports Strategy Analytics.


JPSA expands Ultrafast laser machining technology

Wed, 2 Feb 2012

JP Sercel Associates, Inc. (JPSA) expanded its Ultrafast processing capabilities, using Pico-second lasers with innovative laser beam delivery techniques.


Novellus film deposition tool suits 3D Flash device fab

Tue, 2 Feb 2012

Novellus debuted the VECTOR Strata dielectric deposition tool for high-volume VIM Flash manufacturing. VECTOR Strata aims for ultra-smooth films with exceptional defect performance, enabling in-situ deposition of the alternating silicon-based layers used in the formation of the VIM structure.


Semiconductors to use most ultrapure water in 2012

Tue, 2 Feb 2012

The electronics industry will edge out coal-fired boilers as the biggest purchaser of ultrapure water systems and consumables in 2012, according to the McIlvaine report: Ultrapure Water World Markets.


EVG LED mask aligner offers COO improvement in gen-2

Tue, 2 Feb 2012

EVG uncrated the EVG620HBL Gen II fully automated mask alignment system for volume LED manufacturing. The second generation tool offers 55% higher wafer output per square meter of cleanroom space occupied, EVG reports.


Silicon wafer revenues increased, shipments tapered in 2011

Tue, 2 Feb 2012

Worldwide silicon wafer revenues improved 2% YOY, shows the SEMI Silicon Manufacturers Group. Worldwide silicon wafer area shipments, however, decreased 3%, indicating a loss of momentum in H2 2011, said Kazuyo Heinink, SEMI SMG.


SemiLEDs, LG Siltron, Epistar install Veeco MOCVD tools

Tue, 2 Feb 2012

Veeco Instruments (Nasdaq:VECO) reported 3 wins for its TurboDisc K465i GaN MOCVD tool : the same systems will be used for high-volume LED fab, GaN-on-Si research, and Si-based LED development.


Gigaphoton launches ArF excimer laser for multi-patterning immersion lithography

Mon, 2 Feb 2012

Gigaphoton uncrated the GT63A next-generation ArF excimer laser for multi-patterning immersion lithography scanners.


UPDATED: Record semiconductor sales in 2011, 2012 outlook

Wed, 2 Feb 2012

The SIA shows 2011 worldwide semiconductor sales hit $299.5 billion, a 0.4% year-on-year increase and new record. Semico Research's forecast for 2012 shows a 10.11% growth in semiconductors revenues over 2011. Barclays Capital and Strategy Analytics also weigh in.


Micron (MU) CEO dies unexpectedly; company shares succession plan

Mon, 2 Feb 2012

Micron Technology Inc. (Nasdaq:MU) long-time CEO and chairman Steve Appleton passed away. MU named Mark Durcan, Micron president and COO, to fill the vacant CEO post, and serve on the Board.


Tokyo Electron (TEL) establishes organic EL and FPD departments, eliminates MEMS dev

Fri, 2 Feb 2012

Tokyo Electron Ltd. (TEL) restructured its organization, with a new "Organic EL Division" established under GM Takeshi Okubo, as well as other new and consolidating subsidiaries in the semiconductor and liquid crystal production segments.


AMD outlines SoC-centric strategy

Fri, 2 Feb 2012

AMD's (NYSE:AMD) new president and CEO Rory P. Read detailed what he called an "ambidextrous" strategy for the company, building on its x86 and graphics IP while incorporating other technologies and IP for differentiation in the electronics marketplace.


Smart mobile consumer electronics head for 25%+ growth

Thu, 2 Feb 2012

Consumer electronics devices are shifting from specific functions to multiple functions and Internet connectivity, creating an overlap of features and functions between product categories not only in the mobile segment, but also in other CE devices like digital TVs and set top boxes. This entire category is morphing into a larger "smart devices" grouping.


Wireless leads semiconductor-related OEM spending in 2011

Thu, 2 Feb 2012

Propelled by the appeal of Apple Inc.’s iPhone and iPad, the wireless communications sphere surpassed computers to lead all segments in semiconductor-related spending among top OEMs in 2011.


Tackling EUV lithography shadow distortions with OPC

Thu, 2 Feb 2012

James Word and Christian Zunia, Mentor Graphics, explore the current capabilities of model-based OPC software to model and correct for the shadowing distortions unique to extreme ultra-violet lithography (EUVL).


Wafer-scale graphene grown at lower temp with Cu film

Mon, 3 Mar 2012

University of Texas at Austin researchers demonstrated high-quality, wafer-scale graphene deposition on evaporated copper films, using an AIXTRON cold-wall vertical BM (Black Magic) Pro reactor.


SUSS combines resist coat and develop platforms

Mon, 3 Mar 2012

SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.


CVD Equipment doubles manufacturing space with new NY facility

Mon, 3 Mar 2012

CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its CVD and gas control equipment assembly, and unifying its nano-materials lab.


Semiconductor foundry Dongbu HiTek recruits leadership from Samsung, MagnaChip

Fri, 3 Mar 2012

Dongbu HiTek named Dr. Chang-Sik Choi, former EVP of Samsung Electronics, as its president and CEO and Chan-Hee Lee, former EVP of MagnaChip Semiconductor, as president of its foundry business.


Silicon germanium grown monolithically to avoid crystal defects

Fri, 3 Mar 2012

European researchers have manufactured defect-free structures of different semiconductors on silicon wafers, using semiconductor manufacturing processes.


LED lighting to illuminate power semiconductor sector

Fri, 3 Mar 2012

The global market for power semiconductors used in LED lighting is forecast to reach over $3 billion in 2016. LED lighting systems require complex electronics, IMS Research notes.


AIXTRON opens MOCVD training center in China

Fri, 3 Mar 2012

AIXTRON's training and demonstration center in Suzhou, China, will focus on improving MOCVD in advanced semiconductor and LED manufacturing operations around China, as well as on employee and environmental safety in electronics production environments.


TEL silicon carbide (SiC) epitaxy tool ordered by Infineon

Fri, 3 Mar 2012

Infineon Technologies ordered the Probus-SiC epitaxy film growth tool from TEL for mass production of advanced SiC power devices.


3M expands silicon battery-anode manufacturing in US, bolsters research

Fri, 3 Mar 2012

3M is investing in research and manufacturing of novel silicon (Si) based battery anode materials, for mobile electronics and electric vehicles.


AMAT loses top spot in VLSIresearch semiconductor equipment supplier rankings

Fri, 3 Mar 2012

VLSIresearch released its 2011 Top Semiconductor Equipment suppliers rankings, noting important acquisitions and strong spending in lithography tools in 2011. Semiconductor equipment spending was driven by aggressive capacity expansion in the foundry and logic sectors.


Samsung, IBM and GlobalFoundries look to the future: A report from the Common Platform Technology Forum

Thu, 3 Mar 2012

Execs from Samsung, IBM, GlobalFoundries and ARM looked to the future at The Common Technology Platform Forum in Santa Clara. They focused on the innovation pipeline for 20nm and 14nm technology nodes, and the role that EUV, FinFETs, TSVs, CNTs and DSA will play.


SAFC Hitech expands LED precursor production in Taiwan

Thu, 3 Mar 2012

SAFC Hitech opened a multi-million dollar 270000sq.ft. expansion at its facility in Kaohsiung, Taiwan, increasing capacity for high-quality LED precursor production.


Gallium nitride development accelerates at microelectronics companies

Thu, 3 Mar 2012

As products using gallium nitride (GaN) technology continue to gain acceptance in military and commercial applications, development activities at microelectronics companies are accelerating.


Texas Instruments, SMIC sprout new IC research labs in US and China

Wed, 3 Mar 2012

TI opened a CA-based research lab for analog and mixed-signal circuits, tapping into local universities for a portion of the research. SMIC is teaming with Brite Semiconductor and Zhejiang University for an IC research program in China. Both aim to develop a "home-grown" and dynamic semiconductor industry workforce.


MATHESON incorporates RFID, pressure monitoring in compressed gas control system

Wed, 3 Mar 2012

MATHESON debuted the Lasso System, a customer-centric supply chain and inventory management system that can monitor the location and operating status of gas products and other assets in the REAL-Time Gas and Asset Management System.


How Toshiba's NAND biz survived Japan's Great East Earthquake 1 year ago

Wed, 3 Mar 2012

Japan's NAND flash memory supplier Toshiba rapidly rebounded from the devastating Great East Japan earthquake and tsunami that hit one year ago this week, says IHS, thanks to fortunate fab location, quick wafer supply replenishment, and strong demand.


Silicon wafers sliced to 10% conventional bulk with Hyperion 3

Wed, 3 Mar 2012

Twin Creeks Technologies, semiconductor and solar cell manufacturing equipment supplier, debuted its first commercial silicon wafer production system that reduces solar module and semiconductor device wafers by up to 90%.


imec studies molecular beam epitaxy for advanced CMOS on high-mobility compound semiconductors

Tue, 3 Mar 2012

Riber, MBE tool supplier will work with imec on epitaxy process technologies for next-generation III-V semiconductor CMOS devices.


SiC semiconductor maker SemiSouth expands capacity

Tue, 3 Mar 2012

SemiSouth Laboratories Inc., high-voltage silicon-carbide (SiC) semiconductor device manufacturer, launched its second major capacity expansion within 18 months.


RASIRC wet thermal oxidation cuts oxide film fab time

Tue, 3 Mar 2012

RASIRC determined that a new wet thermal oxidation process on a RASIRC Steamer enables 87% better wafer throughput than dry oxidation of uniform thin oxides.


Semiconductor manufacturing equipment sales rose 9% in 2011

Tue, 3 Mar 2012

Worldwide sales of semiconductor manufacturing equipment totaled $43.53 billion in 2011, representing a year-over-year increase of 9%, shows SEMI. North America surpassed Taiwan as the region with the highest amount of spending.


2012 semiconductor spending forecast nearly doubled at Gartner

Tue, 3 Mar 2012

Worldwide semiconductor revenue is projected to total $316 billion in 2012, a 4% increase from 2011, according to Gartner Inc. This outlook is up from Gartner's previous forecast, made in Q4 2011, for 2.2% growth.


GLOBALFOUNDRIES CEO joins Global Semiconductor Alliance board

Mon, 3 Mar 2012

The Global Semiconductor Alliance (GSA), global semiconductor industry association, appointed Ajit Manocha, CEO of GLOBALFOUNDRIES, to its board of directors. 


Japan 1 year after the earthquake: Supply chain lessons from the disaster

Mon, 3 Mar 2012

Conference report: MRS Spring 2012, Day 2

Wed, 4 Apr 2012

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the second day: OLED TFT displays, single transistor DRAMs, silicon photonic wires, CNTs, 3D optical interconnects, graphene for RF and sensing, transparent ZnO, epidermal electronic systems, stretchable electronics, ultra-low-k dielectrics, patterning of electroceramics, PRAM (an alternative to NRAM), and inkjet printing of superconducting films.


Commercialization of stretchable electronics: The mc10 example

Tue, 4 Apr 2012

Commercialization of stretchable electronics: The mc10 example

Tue, 4 Apr 2012

Vacuum pumps improve throughput by 90% with new rotary design

Tue, 4 Apr 2012

Edwards Limited uncrated the STP-iXR1606 series magnetically-levitated turbo-molecular pumps (TMP) with fully integrated onboard controllers. Its new rotary design improves throughput by about 40% at high gas flow rates; nearly 90% percent in maximum gas flow.


Attend joint sessions at VLSI Technology and Circuits

Tue, 4 Apr 2012

The 2012 Symposia on VLSI Technology and Circuits, this June in Honolulu, HI, will foster joint interactions among device technologists and circuit/system designers with overlapping technical programs of both symposia, and joint focus sessions on important topics.


SEMATECH, centrotherm’s semiconductor-fab subsidiary partner on low-temp processes

Tue, 4 Apr 2012

centrotherm thermal solutions, a semiconductor-manufacturing-focused subsidiary of centrotherm photovoltaics AG, joined the SEMATECH Front End Processes (FEP) program, and will work with SEMATECH to develop low-temperature processing techniques for next-generation logic and memory devices.


SMIC doubles guidance on improved semiconductor wafer fab utilization

Tue, 4 Apr 2012

Semiconductor Manufacturing International Corporation (SMIC, NYSE:SMI, SEHK:981) revised upward its first quarter revenue and gross margin guidance for the three months ended March 31, 2012.


Conference Report: MRS Spring 2012, Day 1

Tue, 4 Apr 2012

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco, describing recent work with graphene, organic electrochemical transistors, pentacene organic TFTs, and functional inks made of CNTs and other nanomaterials.


Semiconductor wafer fab equipment trends

Tue, 4 Apr 2012

Barclays Capital compiled its 2011 analysis of semiconductor wafer fab equipment (WFE) spending, with a look at the top players and underlying trends by process step.


Semiconductor wafer fab equipment trends: Test

Tue, 4 Apr 2012

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse looks at the growth areas for test.


Semiconductor wafer fab equipment trends: Process control/Metrology

Tue, 4 Apr 2012

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse considers the rebound in process control due to weak yields at smaller chip nodes.


Semiconductor wafer fab equipment trends: Deposition

Tue, 4 Apr 2012

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse separates the rising and declining styles of deposition.


TSMC begins Fab 14 expansion for 20nm-node semiconductors

Mon, 4 Apr 2012

TSMC (TWSE: 2330, NYSE:TSM) began Phase 5 of its Fab 14 GigaFab at the South Taiwan Science Park in Tainan, planned to be a “key production center” for advanced 20nm semiconductor chips.


Semiconductor wafer fab equipment trends: Wafer clean

Mon, 4 Apr 2012

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse looks at trends in wafer cleaning, such as single wafer and bevel clean.


Semiconductor wafer fab equipment trends: Etch

Mon, 4 Apr 2012

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse explains changes at the etch step.


Semiconductor wafer fab equipment trends: Ion implant

Mon, 4 Apr 2012

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by step. Barclays looks at the possibilities for ion implant.


Semiconductor wafer fab equipment trends: Lithography

Mon, 4 Apr 2012

Barclays Capital compiled its 2011 analysis of semiconductor wafer fab equipment spending, with a look at the top players and underlying trends by process step. Here, Barclays’ CJ Muse considers lithography’s current state and future.


Wafer fab equipment leaders in 2011 and expectations for 2012

Mon, 4 Apr 2012

Barclays Capital looks at wafer fab equipment trends in 2011, based on Gartner data. Top 5 takeaways? The top 5 vendors continue to gain market share, Intel is a key customer, segment-leading vendors strengthened their holds, intensity edged higher, and changes are in store in 2012.


Elpida bidders and the future mobile DRAM landscape

Mon, 4 Apr 2012

Since Elpida Memory filed for bankruptcy protection, reported bidders have included Micron, Hynix, and Toshiba, and now private equity firms TPG Capital and Hony Capital. CJ Muse of Barclay Capital shares the likely and unlikely scenarios for Elpida, and how these will affect DRAM overall.


ADI names top suppliers

Mon, 4 Apr 2012

Analog Devices Inc. (NASDAQ:ADI) honored 14 companies with the 11th Annual “Supplier Excellence Awards,” selected from among the more than 2,000 companies that contribute to ADI’s global semiconductor manufacturing operations.


EUV lithography optics on order at Zygo

Mon, 4 Apr 2012

The Optical Systems Division of Zygo Corporation recorded a $2+ million order from a major semiconductor manufacturer to produce EUV optics for advanced lithography.


Tanaka Precious Metals platinum electrode enables ozone-based semiconductor cleaning

Mon, 4 Apr 2012

Tanaka Kikinzoku Kogyo K.K. developed a platinum electrode that produces ozone solution at 40x the efficiency of existing technology.


HDD industry hits reset on prices, markets, technologies post-floods

Mon, 4 Apr 2012

 

Worldwide HDD unit shipments experienced a year-over-year decline of 4.5% in 2011. Efforts to clean and repair flooded HDD factory buildings and equipment will take most of H1 2012. HDD and HDD component production should return to pre-flood output levels in H2, reports IDC.


Top 25 semiconductor company rankings reveal big winners, big losers

Thu, 4 Apr 2012

The top 10 and top 25 semiconductor suppliers registered 7% and 4% growth, respectively. However, 15 of the top 25 semiconductor sales leaders posted negative results in 2011. Only 9 of the top 25 suppliers outperformed the total worldwide semiconductor industry 2011/2010 growth rate.


Intel 22nm trigate transistor process chosen for next-gen Netronome flow processors

Thu, 4 Apr 2012

Flow processor developer Netronome extended its strategic relationship with Intel Corp., manufacturing its next-generation Netronome flow processors (NFP) using Intel’s 22nm tri-gate transistor architecture.


Power electronics grow on SiC and GaN innovation

Thu, 4 Apr 2012

Power electronics will grow to $15 billion in sales of discrete components in 2020, says Lux Research. New materials -- SiC and GaN -- are taking a 22% market share for $3.3B in sales. Expect this year to set a record for funding to power electronics companies.


Top 5 counterfeited semiconductors: Analog ICs top the list

Thu, 4 Apr 2012

The top-5 most commonly counterfeit components (based on reported cases) are analog ICs, microprocessors, memory ICs, programmable logic devices, and transistors, shows IHS.


Nanophotonics researchers install NanoInk patterning tool at Osaka U

Wed, 4 Apr 2012

Osaka University’s Photonics Advanced Research Center in Japan installed a NanoInk NanoFabrication Systems DPN 5000 System for patterning various materials with nanoscale accuracy and precision. Osaka University scientists will develop and fabricate nanoscale plasmonic and nanophotonics devices.


Semiconductor foundry integrates Nova metrology for CMP at various nodes

Wed, 4 Apr 2012

Metrology tool supplier Nova Measuring Instruments Ltd. (NASDAQ:NVMI) will provide the production tools of record performing CMP metrology at a leading foundry.


CWS upgrades on-wafer accelerated reliability line for Agilent testers

Tue, 1 Jan 2012

Core Wafer Systems, subsidiary of Action Products International, upgraded its PDQ-WLR on-wafer accelerated reliability product line to version 7.0, designed specifically for Agilent Technologies' Parametric Testers.


North American semiconductor equipment ends 2011 with another book-to-bill climb

Mon, 1 Jan 2012

North America-based manufacturers of semiconductor equipment posted $1.16 billion in orders in December 2011, $1.32 billion in billings, and a book-to-bill ratio of 0.88, according to SEMI. The book-to-bill ratio has been climbing since September 2011. In December, bookings climbed back above the $1 billion mark.


Mask writer collaboration announced: IMS Nanofabrication, DNP, Intel and Photronics

Mon, 1 Jan 2012

IMS Nanofabrication, Dai Nippon Printing Co., Ltd. (DNP), Intel Corporation, and Photronics Inc. are commencing a joint electron multi‐beam mask writer tool collaboration.


Intel, Samsung, TSMC semiconductor capex in 2012 signal market dominance

Mon, 1 Jan 2012

Intel plans $12.5 billion semiconductor capital expeditures in 2012; Samsung plans $12.2 billion. Watch for wide and growing separation between these two companies and their competition, says IC Insights.


Tanaka's ruthenium precursor enables 20nm DRAM semiconductors

Mon, 1 Jan 2012

Tanaka Kikinzoku Kogyo K.K. developed a ruthenium material able to form a film up to 6x the normal depth for capacitor electrodes used in DRAM, working with Professor Seiji Ogo of Kyushu University.


Mobile semiconductor companies see high M&A, flat growth

Fri, 1 Jan 2012

2011 was a big year for M&A in the mobile device semiconductor market, from Intel’s acquisition of Infineon Technologies AG Wireless Solutions, Qualcomm's Atheros buy, to NVIDIA’s purchase of Icera. Despite all the M&A activity, however, the market is still projected to remain relatively flat.


AIXTRON sells SiC CVD tool to United Silicon Carbide

Fri, 1 Jan 2012

USCi will develop next-generation silicon carbide (SiC) devices with AIXTRON SE's VP2400 hot-wall CVD tool. USCi plans to install the CVD system in Q3 2012.


KLA-Tencor uncrates metrology line-up for leading-edge semiconductor wafers

Fri, 1 Jan 2012

KLA-Tencor Corporation launched 3 semiconductor wafer defect inspection systems: the 2900, Puma 9650, and eS800 series. The suite is tailored to detect defects arising from new materials, device structures, and design rules.


Semiconductor foundry adds 200mm compact thermal reactor from Expertech

Thu, 1 Jan 2012

Expertech's Compact Thermal Reactor was ordered by a US semiconductor foundry to bolster 200mm wafer capacity. The CTR offers processes for atmospheric and LPCVD, including hydrogen and high-temperature wafer processing.


Air Liquide doubles semiconductor fab precursor production

Thu, 1 Jan 2012

Air Liquide Electronics completed a series of expansions at its ALOHA manufacturing sites in the US, France and Japan, doubling its advanced precursor production capacity for semiconductor manufacturing applications.


Annealsys MOCVD tool integrates Hine Automation vacuum wafer transfer system

Thu, 1 Jan 2012

Hine Automation shipped its Star SL-300 single-substrate vacuum transfer system to Annealsys, which will integrate the wafer transfer system onto its MC-200 MOCVD tool for R&D and pilot environments.


Supramolecular researchers install NanoInk lithography system

Thu, 1 Jan 2012

Researchers at INCDTIM in Romania will use NanoInk's NanoFabrication Systems Division's DPN 5000 system for supramolecular structure fabrication, molecular recognition and self-assembling process applications.


ISS draws to a close with innovation on the mind

Wed, 1 Jan 2012

Michael A. Fury, Ph.D., Techcet Group, reports from SEMI’s International Semiconductor Strategy meeting, with a closing day focused on innovation and new applications.


SEMI award honors quantum dot research at QD Vision

Wed, 1 Jan 2012

SEMI presented its annual SEMI Award for North America to QD Vision. QD Vision team members made significant progress on the integration and manufacturing processes essential to the commercialization of quantum dot (QD) technology.


Fabs in high-risk zones, 450mm, 3D IC themes of Semico's Semiconductor Fab Database

Wed, 1 Jan 2012

36% of semiconductor fabs are in high-risk zones, finds Semico, noting the industry disruptions caused by the Japan earthquake and tsunami and Thai flooding and the challenges these presented to chip makers in the regions. 


ISS day 2: Cloud computing to drive 450mm, closer collaboration

Wed, 1 Jan 2012

Day 2 of SEMI’s Industry Strategy Symposium (ISS) 2012 included talks by Mike Splinter of Applied Materials, Mark Thirsk of Linx Consulting, Tim Hendry of Intel, David Lazovsky of Intermolecular, a panel session on could computing run by Harvey Frye of TEL, Handel Jones of IBS and another panel session focused on 450mm, moderated by G. Dan Hutcheson of VLSI Research. Michael A. Fury of Techcet reports.


SPIE Advanced Lithography: Intel's, TSMC's tool roadmap takeaways

Wed, 2 Feb 2012

After attending SPIE Advanced Lithography, Barclays Capital came away with a lower lithography tool shipments forecast, more hope for EUV lithography, and expectations of a litho buying spree at Intel.


Smart electronics subject of Renesas ConFab keynote

Tue, 2 Feb 2012

The ConFab's second-day keynote will be "Smart Society, the Sensing Era and Signal Chain" presented by Ali Sebt, CEO of Renesas Electronics America.


Techcet reveals CMP metrology, supply, and process trends

Tue, 2 Feb 2012

Lita Shon-Roy and Michael Fury, PhD, Techcet will present "CMP Market Outlook & New Technology - Dynamic Slurry Metrology," a free webinar at 2 times on February 22.


Brewer Science rolls out gen-2 OptiStack lithography patterning products

Tue, 2 Feb 2012

Brewer Science uncrated the next generation of its OptiStack system of patterning products for semiconductor manufacturing, targeting emerging and existing lithography processes.


TEL joins CEA-Leti's lithography program IMAGINE

Tue, 2 Feb 2012

Tokyo Electron Ltd. (TEL) will join research organization CEA-Leti's IMAGINE open, collaborative industrial program on advanced lithography for semiconductor manufacturing.


European microelectronics fab database tracks major changes over past 5 years

Mon, 2 Feb 2012

Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufacturing fabs, pilot lines, and major R&D organizations.


New RAVE division offers semiconductor makers custom lithography defect study

Mon, 2 Feb 2012

RAVE N.P. Inc. established a new division, Advanced Technical Instruments or ATI, comprising SEM, AFM, and other analysis tools, as well as custom semiconductor and photomask services such as haze generation systems.


Gigaphoton achieves EUV lithography milestone

Mon, 2 Feb 2012

Lithography light source maker Gigaphoton, Inc. achieved 7W of extreme ultra violet (EUV) power on its mass-production laser-produced plasma (LPP) light source, scheduled to be shipped in 2012.


IEEE Frederik Philips Award goes to C.Y. Lu

Mon, 2 Feb 2012

Chih-Yuan (C. Y.) Lu, a semiconductor engineer, scientist, and entrepreneur in Taiwan, is being honored by IEEE with the 2012 IEEE Frederik Philips Award.


Brewer Science, Pixelligent debut hardmask for advanced semiconductor lithography

Mon, 2 Feb 2012

Pixelligent and Brewer Science Inc. developed a spin-on hardmask technology for advanced lithography, combining nanocrystal and microelectronic coating technologies.


SPIE Advanced Lithography preview: eBeam Initiative roadmap

Mon, 2 Feb 2012

The eBeam Initiative, a forum for new IC manufacturing approaches based on electron beam (e-beam) lithography, will unveil its latest roadmap at the SPIE Advanced Lithography Symposium.


ASML's Brion combines OPC techniques for faster 2Xnm lithography mask tapeout

Mon, 2 Feb 2012

ASML's Brion Technologies debuted Tachyon Flexible Mask Optimization, which enables use of multiple OPC techniques in a single mask tapeout for 2Xnm lithography.


Tektronix donates oscilloscopes, other semiconductor metrology equipment to WSU Vancouver

Mon, 2 Feb 2012

Tektronix donated semiconductor test and measurement equipment to Washington State University Vancouver: arbitrary/function generations, a real-time spectrum analyzer, digital phosphor and mixed signal oscilloscopes, Keithley's semiconductor parameter analyzers, and Fluke's True-rms multimeters.


MAPPER Lithography tech resolves 22nm lines, spaces, contact holes in CEA-Leti work

Mon, 2 Feb 2012

CEA-Leti reports that the MAPPER Lithography massively parallel direct write technology resolves 22nm dense lines and spaces and 22nm dense contact holes in positive chemically amplified resist. The maskless lithography tech meets semiconductor requirements for 14nm and 10nm logic nodes.


Semiconductor yield at 450mm: Solid State Technology March 2012 issue preview

Fri, 2 Feb 2012

The March 2012 issue of Solid State Technology will feature "450mm wafer transition" from Dr. Brian Trafas, chief marketing officer at KLA-Tencor. The following is a sneak preview of Dr. Trafas' article.


IC industry headed for 7% growth in 2012; 11 of 33 categories will outperform

Fri, 2 Feb 2012

IC Insights forecasts 7% growth for the total IC industry in 2012. 27 of the 33 major IC product categories will experience growth in 2012. 11 will grow faster than 7%. 6 will show double-digit growth.


imec achieves 300mm wafer-fab-compatible directed self assembly

Fri, 2 Feb 2012

imec successfully implemented a 300mm directed self-assembly (DSA) semiconductor manufacturing process line in its fab, with TEL equipment, AZ Electronic Materials consummables, and research from the University of Wisconsin.


Semiconductor metrology beyond 22nm: FinFET metrology

Thu, 2 Feb 2012

SEMATECH authors discuss semiconductor metrology solutions currently being investigated to address the challenges of future nodes. FinFETs raise new metrology complexities, as the entire 3D structure becomes critical for process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts.


Georgia Institute of Technology, PARC + Thin Film Electronics, Western Michigan University win FLEXIs for flexible electronics advances

Thu, 2 Feb 2012

FlexTech Alliance awarded its 2012 FLEXI Awards for flexible, printed electronics and displays industry to PARC and Thin Film Electronics, Western Michigan University, and the Georgia Institute of Technology.


Theta Delta's burn-in & long-term semiconductor testers gain Core Wafer Systems technologies

Thu, 2 Feb 2012

Theta Delta will incorporate Core Wafer Systems technologies into its burn-in test and long-term reliability test systems for semiconductors. Core Wafer Systems provides parallel measurement schema for semiconductor test.


ISS: Top Ten Economic Trends in 2012

Tue, 1 Jan 2012

The economic outlook for the world is dismal, the semiconductor industry has consolidated and matured to the point where it’s looking for tips from the automotive industry, and unprecedented challenges must be overcome to stay on the path defined by Moore’s Law. Duncan Meldrum of IHS provides a top ten list of economic trends to watch in 2012.


ISS kicks off with IC industry reality talks

Tue, 1 Jan 2012

The Industry Strategy Symposium (ISS) kicked off today in Half Moon Bay, CA under blustery skies with choppy seas, an apt metaphor for the information about to be shared inside, says blogger Michael A. Fury, Techcet.


Advanced NAND flash memory scaling prompts ECC acquisitions

Tue, 1 Jan 2012

NAND flash memories are scaling below 2Xnm process nodes and bit errors are increasing. Research and Markets sees this as the reason for Apple buying Anobit Technologies and Micron buying Storage Genetics (both startups were developing advanced ECC and signal processing technologies).


Organic printed electronics roadmap recognizes market entry

Mon, 1 Jan 2012

The Organic Electronics Association released its "OE-A Roadmap for Organic and Printed Electronics," covering application clusters such as flexible displays and smart systems, as well as the outlook on materials, substrates, and patterning processes.


New installed wafer capacity leader: Taiwan took over in 2011

Mon, 1 Jan 2012

Taiwan became the region with the largest share of installed wafer capacity in 2011, according to IC Insights' Global Wafer Capacity 2011-12 report. This is the first time Taiwan has led the global wafer capacity rankings, with 21% of total in mid-2011.


Vistec installs first e-beam lithography EBPG5000pES in China

Mon, 1 Jan 2012

Wuhan National Laboratory for Optoelectronics at the Huazhong University of Science and Technology (Wuhan, China) has signed off its Vistec Lithography electron-beam lithography system Vistec EBPG5000pES.


Apple shares list of suppliers

Fri, 1 Jan 2012

For the first time, Apple Inc. has publicly published a list of over 150 companies that the electronics giant says represent 97% of its procurement expenditures for materials, manufacturing, and assembly of products worldwide.


Renesas Electronics America taps company veteran as president and CEO

Fri, 1 Jan 2012

Renesas Electronics America Inc. named Ali Sebt, who has served 20 years at the company, as its new president and CEO. Sebt succeeds the retiring Daniel Mahoney.


DRAM oversupply could worsen in 2012

Fri, 1 Jan 2012

The dynamic random access memory (DRAM) market is encountering an "alarming" rise in inventory, low capex, and reduced demand from end-market applications, show analysts from IHS iSuppli, Deutsche Bank, and Barclays Capital.


IBM discovers magnetic storage limit at 12 atoms

Fri, 1 Jan 2012

IBM Research demonstrated the ability to store information in as few as 12 magnetic atoms, 100-10,000x less than today's information storage technologies.


Semiconductor inventory correction balancing out early in 2012

Thu, 1 Jan 2012

Semiconductor sales were weaker than expected in Q3 2011, and Q4 shows weak guidance, prompting chip makers to reduce production. Gartner expects this inventory correction to work out in early 2012.


Intel's CES keynote: Highlights from Otellini's talk

Wed, 1 Jan 2012

Intel's Paul Otellini spoke at the International CES in Las Vegas, providing information on Intel's smartphone moves and ultrabook momentum, and debuting the 32nm Intel Atom SoC for tablets and hybrids.


Ramtron builds 1st 3V F-RAM on IBM fab line

Wed, 1 Jan 2012

Ramtron International Corporation shipped 50,000 initial low-energy, custom, nonvolatile ferroelectric random access memory (F-RAM) devices built on its new IBM manufacturing line in Burlington, VT.


SEMI names Stanley Myers a director emeritus

Wed, 1 Jan 2012

Former SEMI president and CEO Stanley T. Myers was named a director emeritus of the association by itsl Board of Directors. Myers led SEMI for 15 years, was a board member for 24, and has been part of the semiconductor industry for more than 50.


Semiconductor fab capex forecast for 2012

Tue, 1 Jan 2012

Key points from SEMI's 2012 semiconductor fab equipment spending forecast include a predicted decline of 11% to $35 billion, steady growth in 300mm installs, and an H1 dip/H2 surge format.


EVG integrates UV lithography from Eulitha on mask aligner

Tue, 1 Jan 2012

EV Group signed a joint-development and licensing agreement with Eulitha AG, integrating Eulitha's PHABLE mask-based UV photolithography technology with EVG's automated mask aligner platform.


ORNL finds nano-metallic conductivity in ferroelectrics

Mon, 1 Jan 2012

Researchers at Oak Ridge National Laboratory have observed metallic conductance in ferroelectric nanodomains, using piezoresponse force microscopy.


Camtek launches TEM for advanced semiconductor makers

Mon, 1 Jan 2012

Camtek launched Xact200, a transmission electron microscope (TEM) sample preparation system for the semiconductor industry. Camtek calls the system an alternative to FIB analysis.


7 semiconductor and display suppliers to benefit from tablet wars

Fri, 1 Jan 2012

Turner Investments shares the 7 display and semiconductor/microelectronics makers it expects to benefit the most from tablet PC proliferation out of Apple, Samsung, and Amazon.com.


GaN branches out from military apps

Fri, 1 Jan 2012

Gallium nitride (GaN) technology isn't shrinking from military applications any time soon, but GaN adoption is increasing in the commercial sector, from less than $1 million in 2010 to $58 million in 2015, shows Strategy Analytics.


Materion expands PVD shield cleaning facility in NY

Fri, 1 Jan 2012

Materion Microelectronics & Services added 50% more space in its PVD parts cleaning and surface treatment facility, with an automated robotic twin wire arc spray, increased precious metal refining capacity, new cleaning processes, and a Class 10,000-certified cleanroom.


GaAs trends: Foundry outsourcing, rapid market upswing

Sun, 1 Jan 2012

The GaAs device market recovered sharply in 2010, driven mobile handsets. Increased use of pure-play foundries met the surge in demand and was in-line with a trend toward outsourcing, says Strategy Analytics.


Graphene nanowiggles exhibit specific bandgap and magnetic properties

Thu, 1 Jan 2012

RPI scientists studying a promising form of graphene -- graphene nanowiggles -- with exceptionally different properties for each nanowiggle structure. All of the nanoribbon-edge structures have a wiggly appearance like a caterpillar inching across a leaf.


SuVolta raises $17.6M for IC power-control tech

Thu, 1 Jan 2012

SuVolta Inc. secured $17.6 million in venture funding from all existing investors as well as new investor Bright Capital. SuVolta developed the PowerShrink low-power IC technology, which cuts chip power consumption by 50-90%.


Nocilis Materials launches SiGe foundry

Thu, 1 Jan 2012

Nocilis Materials opened its silicon foundry service globally. Nocilis Materials AB provides epitaxy service of advanced Si-Ge-Sn-C alloys for electronic and photonic applications.


Chip inventories contract, reversing 7 quarter trend

Wed, 1 Jan 2012

Chip inventories held by semiconductor suppliers declined in the third quarter of 2011, putting a halt to the steady expansion of the previous seven quarters, as the industry cut production in order to reduce oversupply, shows IHS iSuppli research.


Semiconductor sales tip downward in November

Tue, 1 Jan 2012

The Semiconductor Industry Association (SIA) reports worldwide sales of semiconductors were $25.1 billion for the month of November 2011. The semiconductor industry closed 2011 with growth and looks towards 2012 for further improvement.


Graphene FET enables high-frequency mixer circuits

Tue, 1 Jan 2012

Chalmers University of Technology researchers created a graphene FET (G-FET) that is compatible with silicon devices and offers space and high-frequency benefits over traditional mixer transistors.


20nm mask technology relies on SMO and DPT

Mon, 1 Jan 2012

20nm production will be done with 193nm ArF immersion lithography. The workhorse lithography technologies will be double-patterning, source mask optimization, or some combination of the two, says Franklin Kalk, Toppan Photomasks.


Startups pave the way to CMP at 22nm

Mon, 1 Jan 2012

Defect control at 22nm is a critical focus for chemical mechanical polishing (CMP). Michael A. Fury, Techcet Group, discusses the current companies and trends on the leading edge of CMP for 22nm.


Will 22nm need a mid-node?

Mon, 1 Jan 2012

Art Zafiropoulo of Ultratech shares predictions for 22nm: that everyone will be using gate-last fabrication, that there may be a mid-node at 20nm, and that TSVs and 450mm wafers will play an important role at the new node.


22nm node semiconductors: Technical forecasts

Tue, 1 Jan 2012

Solid State Technology asked top analysts and technologists to provide insights on the transition to 22nm semiconductor devices. Read through the whole 10-forecast series, or check out the individual articles as you have time to see perspectives on lithography, device architecture, and more.


Soitec advances LED strategy with Altatech Semiconductor buy

Wed, 2 Feb 2012

Soitec (Euronext Paris) completed its acquisition of all of the outstanding shares of Altatech Semiconductor S.A. The final purchase price was EUR15 million.


Gore debuts high-purity 20nm PTFE filter for semiconductor, FPD fab

Wed, 2 Feb 2012

Gore introduced a 20nm-rated PTFE filter, available in a HDPE cartridge. The filter is optimized for bulk processing high-purity chemicals used in semiconductor and flat panel display manufacturing.


SRC to advance PV and smart grid technologies

Tue, 2 Feb 2012

Hydro One Networks, NEC and ON Semiconductor join SRC’s global Energy Research Initiative, expanding the focus to include finding new materials, devices and methodologies for power controls/management and energy collection, conversion and storage.


South Korean companies' IC sales surpass Japan for 1st time

Tue, 1 Jan 2012

North American companies made a minor gain in semiconductor marketshare in 2011, keeping the them in the majority worldwide. South Korean companies have gained more than two points of marketshare since 2009, says IC Insights.


Cambrios takes ITO-alternative to strategic phase with Samsung investment, new leader

Tue, 1 Jan 2012

Cambrios Technologies Corporation appointed John LeMoncheck as president and CEO, and announced a $5 million Series D-3 financing round from Samsung Venture Investment Corporation.


Semiconductor industry revenue targets $323.2B in 2012

Tue, 1 Jan 2012

The global semiconductor market will see a slow 2012, reports IHS, with economic uncertainty and semiconductor inventory not moving enough to stimulate new production. Expect negative growth in Q1 2012, a nascent rebound in Q2, and strong growth in Q3 2012, IHS reports.


WTO says China’s export restrictions on silicon and other materials unfair

Mon, 1 Jan 2012

The World Trade Organization found that the export duties and quotas imposed by China on various raw materials -- bauxite, coke, fluorspar, magnesium, manganese, silicon carbide, silicon metal, yellow phosphorus and zinc -- are protectionist measures in breach of WTO rules and that China failed to justify them.


Luxtera supports optoelectronics foundry service

Mon, 1 Jan 2012

Luxtera is teaming up with the new foundry service for Optoelectronic Systems Integration in Silicon (OpSIS), making Luxtera’s Silicon CMOS Photonics device library and process open to the OpSIS community, which shares the cost of fabricating complex chip-scale systems across many projects.


40nm manycore processors roll out at Tilera

Mon, 1 Jan 2012

Tilera launched its 36 and 16-core TILE-Gx 64-bit processors with low power consumption and high performance. The chips increase the number of cores on one die, without complicated redesigns, and are Tilera's first 40nm design.


TI closes semiconductor fabs in TX and Japan

Fri, 1 Jan 2012

Texas Instruments (TI, NASDAQ:TXN) will close 2 older semiconductor manufacturing facilities in Hiji, Japan and Houston, TX over the course of the next 18 months. Production from these analog chip sites will be moved to more advanced TI facilities.


President Obama's Intel visit: Fab 42 update, American manufacturing themes

Fri, 1 Jan 2012

President Barack Obama visited the Intel Ocotillo campus in Chandler, AZ. The President spoke about Intel's technological innovation, and manufacturing jobs in America.


Apple iPhone 4S steals smartphone show in Q4 2011; Samsung wins the year

Fri, 1 Jan 2012

While Apple's release of the iPhone 4S in Q4 2011 "unleashed tremendous pent-up demand" from consumers, Samsung used its broad range of smartphones to take the top spot, reports IHS.


SEM tweak enables crystal study of particles as small as 10nm

Thu, 1 Jan 2012

NIST materials scientists modified a standard SEM for a roughly 10-fold improvement in measuring the crystal structure of nanoparticles and extremely thin films. It enables crystal structure study of particles as small as 10nm.


ABB intros Cleanroom ISO 5 version of multipurpose 6-axis robot

Thu, 1 Jan 2012

ABB Robotics introduced an ISO 5 (Class 100) Cleanroom version of the IRB 120, its smallest multipurpose 6-axis robot. Any source materials in the IRB 120 prone to particle generation were modified to eliminate contamination potential in the manufacturing area.


Soitec joins SEMATECH metrology work on SOI wafers

Thu, 1 Jan 2012

Soitec joined SEMATECH's Front End Processes and Advanced Metrology Programs, bringing SOI wafers and other advanced engineered wafers into the group to work on new processes and technologies enabling high-performance, low-power IC applications.


BSE Group achieves milestones in semiconductor equipment financing biz

Thu, 1 Jan 2012

Test Advantage Capital Group, a business of BSE Group, surpassed $150M in its portfolio of semiconductor manufacturing equipment under management. Boston Semi Equipment's fab equipment leasing business also received a $100M annual commitment from its financial backer, Wafra Capital Partners.


Thai flood update: HDD production returning at expected pace

Wed, 1 Jan 2012

The late-2011 flooding in Thailand caused major disruptions in the semiconductor and electronics manufacturing communities, most acutely felt in hard disk drive (HDD) manufacturing. FBR Capital Markets provides this update on Thai HDD production.


Bilayer graphene's "Higgs boson" insulating property

Wed, 1 Jan 2012

UC Riverside researchers identified the "Higgs boson" property of bilayer graphene: when the electrons come close to 0, BLG becomes insulating. This spontaneous symmetry breaking is the same principle that endows mass for particles in high energy physics.


Apple tops semiconductor buyer list in 2011

Tue, 1 Jan 2012

Leading electronic equipment manufacturers accounted for $105.6 billion of semiconductors on a design TAM basis in 2011, 35% of semiconductor vendors' worldwide chip revenue, according to Gartner. Apple bought the most, spending $17,257 million.


SEMATECH highlights from VLSI-TSA

Thu, 4 Apr 2012

SEMATECH experts reported on innovative processes for advanced CMOS logic and memory device technologies and 3D TSV manufacturing at the International VLSI Technology, System and Applications Symposium (VLSI-TSA).


Vistec delivers electron-beam lithography system to ITME researchers in Poland

Thu, 4 Apr 2012

Vistec Electron Beam GmbH sold a Variable Shaped Beam system SB251 to the Institute of Electronic Materials Technology in Warsaw, Poland, for R&D on micro-optical and diffractive elements, new materials, and masks for optical lithography.


TSMC raises capex more than expected

Thu, 4 Apr 2012

Due to stronger demand for TSMC’s 28nm technology and the pull-in of a 20nm R&D process line, the foundry raised its estimate for 2012 capital expenditures from $6 billion to $8-8.5 billion.


Understanding semiconductor wafer demand growth in 2012

Wed, 4 Apr 2012

Wafer demand grows at a CAGR of about 8-9%, but capital investment in wafer fab capacity does not stick with an 8-10% investment rate every year. Semico tracks wafer demand, which is “anything but stable.”


Semiconductor makers spend most on cleanroom hardware in 2012

Wed, 4 Apr 2012

As semiconductor nodes shrink, filter manufacturers and cleanroom designers must offer products that remove the smallest possible particles. While hardware can accomplish much of this, the cleanliness of a room is a function of the motion of the employees in the room.


2012 semiconductor revenue forecast bumped up 1 point at IHS

Wed, 4 Apr 2012

The overall semiconductor industry will grow 4.3% in 2012, according to IHS, which raised its forecast 1 percentage point based on consumer demand for wireless products like smartphones and tablets.


Major semiconductor makers order EUV lithography metrology tool from Carl Zeiss

Wed, 4 Apr 2012

Carl Zeiss won orders for its EUVL actinic aerial image metrology system, AIMS EUV, from 2 of the 4 members of SEMATECH’s EMI partnership. The tool allows chip makers to review defects in advanced masks needed for EUVL.


Texas Instruments (TI, TXN) reports broad orders increase in Q1 2012

Tue, 4 Apr 2012

"As we expected, our business cycle bottomed in the first quarter, and early signs of growth began to emerge." -- Rich Templeton, TI's chairman, president and CEO.


SEMATECH adds Inpria resists to EUV lithography work

Tue, 4 Apr 2012

Inpria, chemical materials supplier for thin-film deposition, joined the consortium SEMATECH’s Lithography Program. Inpria and SEMATECH will tackle on critical issues for resist in extreme ultraviolet (EUV) lithography.


Intel’s first 22nm trigate transistor products debut

Tue, 4 Apr 2012

Intel Corporation introduced its first product built on the 22nm 3D trigate transistor: the quad-core 3rd-generation Intel Core processor family for desktop, laptop and all-in-one (AIO) designs.


AMD Q1 shows steady improvement, 28nm readiness, heavy competition

Tue, 4 Apr 2012

AMD (NYSE:AMD) announced Q1 2012 revenue of $1.59 billion, a net loss of $590 million and operating loss of $580 million. Analysts share their takes on AMD's 32nm and 28nm situation, ASPs, and more.


Qualcomm’s first 28nm semiconductor outperforms 45nm siblings by 25%

Tue, 4 Apr 2012

The HTC One S HSPA phone runs Android 4.0.3, based on Qualcomm’s first 28nm processor, the MSM8260A, with an Adreno 225 GPU core. ABI Research performed a teardown on the handset.


Toshiba builds semiconductor fab in Thailand to replace flooded fab

Tue, 4 Apr 2012

Toshiba Corporation (TOKYO: 6502) will rebuild its semiconductor manufacturing operations in Thailand by relocating Toshiba Semiconductor Thailand Co., Ltd. (TST) to a new manufacturing facility.


KLA-Tencor wafer defect/metrology cluster tool monitors all wafer surfaces in parallel

Mon, 4 Apr 2012

KLA-Tencor Corporation (NASDAQ:KLAC) debuted the CIRCL suite high-throughput defect inspection/metrology/review system for implementation at lithography, outgoing quality control (OQC) and other process modules in semiconductor manufacturing lines.


Freescale Semiconductor CEO plans retirement, seeks successor

Mon, 4 Apr 2012

Freescale Semiconductor Holdings (NYSE:FSL) launched a formal process to identify a successor to Chairman and CEO Rich Beyer, who will retire as CEO after a transition.


Metrology tool offers economical price point with high accuracy

Mon, 4 Apr 2012

Hexagon Metrology released the Optiv Classic 321GL tp benchtop vision-measuring metrology system for the North American market. It suits electronics and precision parts inspection, including micro-holes, fiber optics, filters, and more.


Semiconductor subsystems see record revenues thanks to 32nm and below

Mon, 4 Apr 2012

Strong lithography spending, as well as several acquisitions and divestures in the space, brought changes to the critical subsystems of semiconductor/related markets sector, says VLSIresearch. 


Semiconductor investments from venture capital sector fall in March

Mon, 4 Apr 2012

Investments in fabless companies, semiconductor suppliers, and other chip companies fell more than 80% month/month and year/year in March, reports the Global Semiconductor Association (GSA).


IBM adds membrane, chemical suppliers to lithium-air battery project

Mon, 4 Apr 2012

IBM welcomed Asahi Kasei and Central Glass to its Battery 500 Project team, collaborating on far-reaching research to improve electric vehicles. Asahi Kasei will engineer membrane technologies and Central Glass will develop electrolytes and additives for lithium-air batteries.


MOCVD and MBE epitaxy trends for compound semiconductors

Fri, 4 Apr 2012

The corresponding combined revenue opportunity for MBE and MOCVD is estimated to be around US $6.1 billion for the 2012-2020 periods, shows Yole Développement.


Multi-core semiconductor scaling enabled with memory communication research

Fri, 4 Apr 2012

Researchers sponsored by Semiconductor Research Corporation have identified a path to overcome challenges for scaling multi-core semiconductors by addressing how to scale memory communications among the cores.


North American semiconductor fab tool makers see March book-to-bill hike

Fri, 4 Apr 2012

With a book-to-bill ratio of 1.13, North America-based manufacturers of semiconductor equipment saw a sixth climb in the ratio, which has steadily improved since it hit 0.71 in September 2011, shows SEMI.


NAND flash memory sees steady growth thanks to ultrabooks, smartphones, tablets

Thu, 4 Apr 2012

The NAND flash memory market will grow 8% in 2012 to $22.9 billion, thanks to major sales drivers such as solid-state-drive (SSD) equipped ultrabooks, according to the IHS iSuppli Data Flash Market Tracker.


Intel’s Q1 2012 earnings: Key takeaways

Thu, 4 Apr 2012

Intel Corporation (NASDAQ:INTC) posted quarterly revenue of $12.9 billion, operating income of $3.8 billion, and net income of $2.7 billion. Analysts from FBR Capital Markets and Barclays Capital break down the numbers.


EPIC names new director general, promises closer ties with EU

Thu, 4 Apr 2012

EPIC, the European Photonics Industry Consortium, announced at its annual general meeting that Carlos Lee has been appointed as director general, succeeding Thomas Pearsall, who has led the association since its founding in 2003.


Texas Instruments (TI, TXN) names top suppliers

Thu, 4 Apr 2012

Texas Instruments awarded 15 of its 12,000 suppliers with Supplier Excellence Awards for delivering outstanding service and support, based on cost, environmental responsibility, technology responsiveness, assurance of supply, and quality.


ASMC will focus on productivity and technology challenges

Wed, 4 Apr 2012

The 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2012) will be held May 15-17 in Saratoga Springs, New York. The conference will feature presentations of more than 85 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features a panel discussion on “Competing for R&D Dollars,” moderated by Solid State Technology Editor-in-Chief Pete Singer.


Soitec's fully depleted (FD) semiconductor product roadmap

Tue, 4 Apr 2012

Soitec, semiconductor materials supplier, released its fully depleted product roadmap, comprising two products designed for both planar and three-dimensional approaches to building semiconductor transistors.


Top 10 semiconductor vendors: Intel broadens lead, Qualcomm sees most growth

Tue, 4 Apr 2012

Total worldwide semiconductor revenue reached $306.8 billion in 2011, up $5.4 billion, or 1.8% from 2010, according to Gartner Inc.


Thinned compound semiconductor wafer handling enabled by 3 Brewer Science tools

Tue, 4 Apr 2012

Brewer Science released new wafer processing equipment for thin wafer separation and post-debond cleaning during compound semiconductor device processing: a thermal debonder, separation tool, and megasonic cleaning system.


Lithography tool buying increases on logic and chip foundry demand

Mon, 4 Apr 2012

Barclays Capital is raising its total lithography units forecast by more than 10 systems, from 234 to 251 in 2012. As many as 260 litho tools could be purchased, as foundries are seeing high demand for 28nm chips.


Electron-beam lithography breakthroughs at Photomask Japan

Mon, 4 Apr 2012

The eBeam Initiative will present at Photomask Japan (PMJ), through member companies, improved photomask critical dimension uniformity (CDU) and wafer yields thanks to eBeam technologies.


Veeco ion beam deposition tool matches PVD speed

Mon, 4 Apr 2012

Veeco Instruments Inc. debuted the SPECTOR-HT ion beam deposition tool for thin-film deposition in optical products, such as lasers, telecommunications chips, and more.


Conference Report: MRS Spring 2012, Day 5

Mon, 4 Apr 2012

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: electronic skin, energy storage with nanowires, printable inks, gas sensing, inkjet printing, semiconductor polymers for organic devices, CNTs, OFETs, touch screen fabrics, and the coffee breaks.


Conference Report: MRS Spring 2012, Day 4

Fri, 4 Apr 2012

Blogger Michael A. Fury, Techcet Group, reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: nanowire FETs, laminate MEMS, nanoparticles in security printing, graphene nanoribbons, Ta2O5 memristors, redox flow batteries, graphene, and more.


Chip sector sets up for high demand in H2

Fri, 4 Apr 2012

Barclays Capital and FBR Capital Markets share their takes on earnings season for public semiconductor companies. Both predict a cycle of inventory replenishment in the semiconductor supply chain that will bode well for chip makers in 2012.


JEDEC taps Nokia, Micron, Samsung Semiconductor for non-volatile wireless memory subcommittee

Fri, 4 Apr 2012

JEDEC Solid State Technology Association will form a subcommittee to its JC-64 Committee for Embedded Memory Storage and Removable Memory Cards focused on standardization of non-volatile memory (NVM) in wireless applications.


Intel awards 9 elite suppliers in 2011

Fri, 4 Apr 2012

Intel Corporation announced 9 winners of the company's Supplier Continuous Quality Improvement (SCQI) award for outstanding commitment to quality and performance excellence.


Sony restructures to boost leading-edge display, electronics products

Fri, 4 Apr 2012

Sony Corporation will implement series of initiatives, under its new management team, to “revitalize and grow the electronics business to generate new value, while further strengthening the stable business foundations of the Entertainment and Financial Service businesses.”


Entegris builds advanced filtration and contamination control R&D center for 2X, 1X semiconductor fab

Thu, 4 Apr 2012

Entegris (NASDAQ:ENTG), contamination control and handling system supplier to the semiconductor and microelectronics industries, will build the Entegris i2M Center for Advanced Materials Science in Bedford, MA, near its headquarters in Billerica. i2M denotes ideas to market.


Intel, Xilinx fund chip design software company Oasys

Thu, 4 Apr 2012

Oasys Design Systems added Intel Capital and Xilinx to its investors in a Series B round. Oasys will use the funds to expand R&D and build a global support structure.


Graphene grown on 300mm wafers with AIXTRON tool in Japan

Thu, 4 Apr 2012

The National Institute of Advanced Industrial Science and Technology in Japan is using its AIXTRON SE BM 300 system to grow monolayer graphene on 300mm wafers.


Top 25 fabless IC companies in 2011

Thu, 4 Apr 2012

The top 25 fabless IC suppliers captured 80% of a total $64.9 billion fabless IC market in 2011, according to IC Insights. Sales topped $1 billion at 12 fabless companies; Qualcomm topped the list with nearly $10 billion in sales. US-based suppliers captured 8 of the top 10 rankings.


Conference Report: MRS Spring 2012, Day 3

Thu, 4 Apr 2012

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- κ dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.


Economy, fabless relationships, 450mm and more on deck at The ConFab 2012

Thu, 4 Apr 2012

The ConFab 2012, an invitation-only global conference and business meeting on semiconductor manufacturing, June 3-6 in Las Vegas, selected speakers and sessions for 2012.


Intel’s top suppliers in 2011

Thu, 4 Apr 2012

Intel Corporation announced its 2011 Intel Preferred Quality Supplier (PQS) awards, selecting 19 of its thousands of suppliers. Two suppliers received Intel’s Achievement Award.


SEMI educates policymakers on 450mm transition

Wed, 4 Apr 2012

This SEMI News and Views blog, written by Jonathan Davis, president, SEMI Semiconductor Business, covers SEMI's efforts with government and policy-shapers in the US and Europe.


Semiconductor foundries expect double-digit growth through 2015

Wed, 4 Apr 2012

The pure-play semiconductor foundry business will ride the growth of tablets, ultrabooks, and smartphones to $29.6 billion in revenues, according to an IHS iSuppli Semiconductor Manufacturing and Supply Market Tracker report.


International Solid-State Circuits preview: imec's wireless sensor, organic electronics work

Mon, 2 Feb 2012

At International Solid-State Circuits Conference (ISSCC), imec and Holst Centre are presenting 14 papers on low-power design for wireless communication and wireless sensor networks, and organic electronics.


Present at the Flash Memory Summit

Fri, 2 Feb 2012

The Flash Memory Summit covers the current state of flash memory and its applications via tutorials, panel discussions, keynote speeches, paper sessions, and more. Submit your abstract by March 16.


Semiconductor industry expectations for 2012: Take the WWK survey

Fri, 2 Feb 2012

Wright Williams & Kelly, Inc. (WWK) opened its 2012 semiconductor industry survey on equipment and process timing. Only participants will receive the full results, free of charge.


Semiconductor metrology beyond 22nm: 3D memory metrology

Thu, 2 Feb 2012

The 22nm node marks the beginning of a major transition from conventional scaling of planar memory devices to complex 3D architectures. SEMATECH authors examine the metrology needs of 3D memory device architectures in Part 2 of this three-part series.


Applied Materials selects Praxair gas system for Varian VIIsta ion implant tools

Wed, 2 Feb 2012

The UpTime sub-atmospheric dopant gas delivery system from Praxair Electronics will be Applied Materials' (AMAT's) factory default standard for the Varian VIISta ion implant platform.


49 semiconductor wafer fabs close 2009-2011

Wed, 2 Feb 2012

IC manufacturers closed 49 wafer fabs between 2009 and 2011, according to IC Insights. Smaller wafer fabs (≤200mm) suffered the most closures, and Japan and North America led the way.


ISMI convenes 200mm semiconductor fab tool obsolescence forum

Wed, 2 Feb 2012

Tool obsolescence is increasingly important to semiconductor manufacturers running 200mm wafer fab lines, reports ISMI, which has chartered an Equipment Obsolescence Forum for alternative sourcing.


Intel (INTC) plans high capex and fast node shrinks, expects chipmaker consolidation

Fri, 5 May 2012

At Intel’s annual investor day, the chipmaker reported that capital spending will be high in 2012 and 2013, noting that its 22nm and 14nm node capabilities are differentiators. Intel focused on its Ultrabook launches, consolidation in the chip industry, and reiterated that capex is for internal use not foundry services.


Micron confirms Elpida takeover discussions

Fri, 5 May 2012

Memory chip maker Micron Technology Inc. (Nasdaq:MU) confirmed that it is engaged in discussions to take over the assets of bankrupt DRAM maker Elpida Memory Inc.


Astro Pak expands precision cleaning cleanrooms in CA

Thu, 5 May 2012

Astro Pak Corporation opened its Class 100 and Class 1000 cleanrooms, recently renovated and expanded, in Downey, CA. The cleanrooms host contract precision cleaning for the semiconductor manufacturing, aerospace, and other industries.


Dow Corning orders AIXTRON epitaxy reactors for power electronics fab

Thu, 5 May 2012

Dow Corning will add 2 AIXTRON AIX 2800G4 WW planetary reactor platforms to its silicon carbide (SiC) epitaxy capacity for next-generation power electronics.


SEMI adds Brewer, Mitchell to North American Advisory Board

Wed, 5 May 2012

EMI added two members its North American Advisory Board: Terry Brewer of Brewer Science and Wayne Mitchell of Air Products.


Coherent achieves ISO/IEC 17025 certification at laser calibration lab

Wed, 5 May 2012

Coherent Inc., supplier of laser power and energy management instruments, achieved a certificate of accreditation to ISO/IEC 17025:2005 at its Wilsonville, OR calibration laboratory.


UNL taps SEMI-GAS for semiconductor metrology lab’s gas needs

Tue, 5 May 2012

SEMI-GAS Systems, ultra-high-purity gas source and distribution system maker, will outfit the University of Nebraska - Lincoln’s new Nanoscience Metrology Facility. Applied Energy Systems will provide field services.


AIXTRON MOCVD tool installed for GaN research at U of Warsaw

Tue, 5 May 2012

University of Warsaw, Poland, researchers will grow GaN materials on a new AIXTRON SE Close Coupled Showerhead MOCVD reactor in a 3 x 2” wafer configuration.


Silicon wafer shipments up sequentially, down 11% Y/Y in Q1 2012

Tue, 5 May 2012

Worldwide silicon wafer area shipments increased slightly during Q1 2012 when compared to Q4 2011 area shipments, according to SEMI. Wafer shipments fell 11% from Q1 2011.


President Obama speaks at Albany Nano-Tech Complex today

Tue, 5 May 2012

President Barack Obama toured the SUNY - Albany Nano-Tech Complex today, speaking about the economy and education in the CNSE NanoFab Extension Building.


III-V Lab shares silicon and compound semiconductor work 1 year in

Mon, 5 May 2012

III-V Lab, a joint lab of Alcatel-Lucent Bell Labs France, Thales Research and Technology and CEA-Leti, provides an update one year into its 4 main research area projects. III-V lab combines compound semiconductor and silicon semiconductor technologies for applications in telecom, industrial control, environmental testing, defense, security, and space.


Micron expected to win Elpida assets in DRAM maker's bankruptcy negotiations

Mon, 5 May 2012

Elpida informally chose Micron to sponsor its restructuring, report severals sources. Micron reportedly will pay about USD1 billion more than it originally offered, investing another $1.25 billion to upgrade 2 fabs in Japan.


Camtek ships semiconductor inspection tools to leading US IDM

Mon, 5 May 2012

A leading, US-based IDM ordered about $5 million of front- and back-end semiconductor automatic optical inspection (AOI) tools from Camtek Ltd.


Texas Instruments (TI, TXN) shares strategy at Analyst Day

Fri, 5 May 2012

Texas Instruments Inc. (NASDAQ:TXN, TI) hosted an Analyst Day this week to discuss and review key strategies and progress achieved over the past 15 years. Barclays Capital “heard few surprises” at TI's Analyst Day; its analysts maintain their view that TI is a “high-quality analog company” that raises some concerns that it is not able to benefit from its scale advantages, with a growth trajectory of only GDP-plus (i.e. in line with overall semiconductors). FBR Capital Markets analysts agree that “little new surfaced.”


Organic complementary logic aim of 2 European research projects

Fri, 5 May 2012

The Heterogeneous Technology Alliance in Europe is focusing on high-performance organic electronic circuits through 2 projects: COSMIC to develop p- and n-type OTFTs for complementary logic, and POLARIC for shrinking critical dimensions of OTFTs.


Top 10 innovative technology firms in Q1

Fri, 5 May 2012

Lux Research profiled 328 companies across 15 different emerging technology domains in Q1 2012. Of these, Lux Research selected its top 10, including a gallium-nitride (GaN) power device maker, printed electronics supplier, and others.


Low-cost Flash memory boosted by gray-market cellphones

Mon, 5 May 2012

The massive “gray market” for cellphones is propelling sales of lower-cost flash memories like eMMC and SPI NOR, as manufacturers of the unregulated phones strive to keep production costs low, says IHS.


Bridging the fabless-foundry gap: Highlighted ConFab presentation

Fri, 5 May 2012

At The ConFab in Las Vegas, TSMC’s BJ Woo, senior director, Graphic/PLD/CPU Business Development Division, will present “Bridging the Fabless-Foundry Gap.”


Lower DRAM prices enable more DRAM per smartphone without higher pricetag

Fri, 5 May 2012

DRAM’ percentage of the cost of a smartphone is decreasing, even as DRAM usage in smartphones is on the rise. Lowering ASPs for DRAM components caused DRAM costs in smartphones to fall by more than half in the course of a year, according to IHS.


Capex expectations update for TSMC, GLOBALFOUNDRIES, SMIC, UMC, more

Fri, 5 May 2012

Barclays Capital updates its wafer fab/semiconductor production equipment (WFE/SPE) capital expenditures expectations for TSMC, Samsung, Intel, UMC, GLOBALFOUNDRIES, SMIC, and Huali.


JEDEC publishes LPDDR3 standard for low-power memory chips

Thu, 5 May 2012

JEDEC Solid State Technology Association published the JESD209-3 LPDDR3 Low Power Memory Device Standard, targeting the performance and density demands of new-gen mobile devices.


Semiconductor companies see increased venture capital funding in April

Thu, 5 May 2012

In April 2012, venture investment dollars received by semiconductor companies was $194.2 million; a 901.0% increase M/M and 461.3% increase Y/Y, reports the Global Semiconductor Alliance (GSA).


Tight 28nm supply shifts GPU maker shares in Q1

Thu, 5 May 2012

Barclays Capital’s C.J. Muse looks at the forecast for PC GPUs based on a new report from Mercury Research. Shipments of PC graphic devices in Q1 2012 came in in-line to slightly below historical trends. Nvidia lost share to Intel and AMD due to tight 28nm chip supply.


Gigaphoton opens Korean subsidiary for DUV, EUV lithography support

Wed, 5 May 2012

Gigaphoton Inc., lithography light source manufacturer, began operations at its wholly owned subsidiary, Gigaphoton Korea Inc. Gigaphoton points to Korea as “one of the most important regions in the global semiconductor industry.”


Microsoft joins Hybrid Memory Cube Consortium

Wed, 5 May 2012

The Hybrid Memory Cube Consortium (HMCC) is a collaboration developing and implementing an open interface standard for Hybrid Memory Cube semiconductor memory architectures. Microsoft Corp. has now joined the consortium.


SMIC expands Beijing fab for smaller-node semiconductor manufacturing

Tue, 5 May 2012

Semiconductor Manufacturing International Corporation (SMIC) signed a cooperation framework document between its subsidiary SMIC Beijing and the Beijing municipal government, forming a joint venture for SMIC Beijing's expansion adjacent to its 12” mega-fab.


Buhler approved to acquire Leybold Optics

Tue, 5 May 2012

Bühler’s acquisition of Leybold Optics from EQT III, for an undisclosed sum, was approved without any restrictions by anti-trust authorities.


SUSS MicroTec takes over SUSS MicroOptics

Tue, 5 May 2012

SÜSS MicroTec AG has increased its shareholding in SUSS MicroOptics S.A. to 100%. SUSS MicroOptics is a leading company for high-quality refractive and diffractive micro-optics.


DRAM partially recovers thanks to Elpida bankruptcy

Tue, 5 May 2012

The market for DRAM is expected to partially reverse the drastic losses it incurred in 2011 and achieve revenue growth this year, the result of balanced supply and demand following the exit of major manufacturer Elpida Memory, according to IHS.


Infineon CEO Bauer resigns for health considerations

Tue, 5 May 2012

Infineon Technologies AG (FSE:IFX, OTCQX:IFNNY) CEO Peter Bauer will resign his post at the end of the current fiscal year (September 30, 2012) due to worsening osteoporosis.


Chinese GaAs foundry installs SPTS PVD tool

Tue, 5 May 2012

SPTS Technologies installed a Sigma fxP physical vapor deposition (PVD) system at a Chinese foundry producing RF devices on gallium arsenide (GaAs) substrates.


GLOBALFOUNDRIES joins top-20 semiconductor suppliers in Q1 2012 on Elpida bankruptcy

Mon, 5 May 2012

The top 20 semiconductor suppliers in Q1 2012, compiled in IC Insights' May Update to The McClean Report, show Intel’s firm hold on the top of the rankings, but a disappointing quarter overall. GLOBALFOUNDRIES replaced bankrupt Elpida on the top 20 charts.


Semiconductor-grade flow sensor measures photoresist, solvent supply

Mon, 5 May 2012

SENSIRION introduced the SLQ-QT105 semiconductor-grade flow sensor for flow rates below 2cc/sec (120ml/min) of hydrocarbon-based liquids, such as photoresists and solvents.


Nanostructured polymer lithography platform established by CEA-Leti and Arkema

Fri, 5 May 2012

Arkema and CEA-Leti, with the help of Professor Hadziioannou’s team of LCPO, have successfully patterned a 20nm pitch and reduced the diameter of contacts down to 7nm with nanostructured polymers.


Precision spray coater builds coatings through layer-by-layer self assembly

Fri, 5 May 2012

Nanotrons Corporation launched the SPray Assisted Layer-by-layer Assembly System (SPALAS) for nano-enabled optical coatings on semiconductor, plastic, and glass substrates using layer-by-layer (LbL) self-assembly.


CMOS image sensor suppliers ramp up 300mm capacity

Fri, 5 May 2012

CMOS image sensors (CIS) are breaking sales records again, after several years without upward momentum, reports IC Insights. New portable systems and embedded imaging are lifting CIS to $6.3 billion in 2012 and new record sales each year through 2016.


Elpida begins reorganization in Tokyo court: Analysts weigh in

Fri, 3 Mar 2012

Elpida Memory Inc. (Tokyo: 6665) resolved to file a petition for the commencement of corporate reorganization proceedings, and filed the same with the Tokyo District Court. Akita Elpida Memory Inc. also saw the commencement of corporate reorganization proceedings


Semiconductor makers ready for H2 2012 snapback

Mon, 2 Feb 2012

FBR Capital released its Q4 2011 semiconductor industry analysis, surveying chip, distributor, EMS, PC OEM, communications equipment OEM, handset OEM, and industrial firms. Their conclusion? Corrective actions in the supply chain have set up a possible H2 2012 snapback for semiconductors.


Intel 22nm 3D trigate transistors chosen for Tabula 3PLD products

Fri, 2 Feb 2012

Tabula is implementing a family of 3PLD products manufactured by Intel using its advanced 22nm manufacturing process featuring 3D tri-gate transistors and co-optimized packaging technology.


North American chip fab tool makers report 4th month of orders growth in January

Fri, 2 Feb 2012

North America-based manufacturers of semiconductor equipment posted $1.18 billion in orders, $1.24 billion in billings, and a book-to-bill of 0.95 in January 2012, according to SEMI.


SEMICON China: Challenges and opportunities for semiconductors, emerging techs

Thu, 2 Feb 2012

SEMICON China takes place March 20-22 in Shanghai. Check out the special pavillions and events, and keynote speakers scheduled.


Semiconductor metrology beyond 22nm: Defect inspection and review

Thu, 2 Feb 2012

As semis are manufactured at the 2X and 1Xnm nodes, new metrology technologies must evolve to fill the gaps. In Part 3 of this 3-part metrology series, SEMATECH discusses the inspection/metrology options for advanced semiconductors.


450mm wafers at SEMI ISS Europe

Thu, 2 Feb 2012

SEMI’s International Strategy Symposium (ISS) meets for its Europe session February 26-28 in Munich, Germany. Following are some of the 450mm wafer presentations scheduled to take place.


IBM, Samsung, GLOBALFOUNDRIES, ARM to keynote Common Platform Technology Forum

Thu, 2 Feb 2012

Simon Segars, ARM, will keynote the Common Platform Technology Forum, along with execs from IBM, Samsung and GLOBALFOUNDRIES, March 14 (Pi Day) in Santa Clara, CA.


AIXTRON deposition tools installed at graphene research lab in Italy

Thu, 2 Feb 2012

AIXTRON SE sold 2 BM Pro 4"-wafer deposition tools to the Italian Institute of Technology for the development and production of graphene used in novel hydrogen storage systems.


NIST reveals how layered memory switches work

Wed, 2 Feb 2012

New information from NIST about how layered switching devices for novel computer memory systems work may now allow these structures to come to market sooner.


ISSCC round-up: 2.5D packaging for IVRs, smallest NAND flash chip, more

Wed, 2 Feb 2012

International Solid-State Circuits Conference (ISSCC) is going on now, gathering semiconductor design and device architecture presentations from research firms like imec to chip companies like IBM. Here are some highlighted presentations.


MIT's nanowire growth control method could optimize LEDs, other semiconductors

Wed, 2 Feb 2012

MIT researchers used gases to precisely control nanowires' width and composition as they grow, which could yield complex structures optimally designed for particular applications, like LED substrates or solar panels.


Chip substrate factory begins producing thermal-control substrates in Russia

Wed, 2 Feb 2012

MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.


Semiconductor inventory correction occurred, shows Gartner lead time analysis

Tue, 2 Feb 2012

Semiconductor vendors had slow Q3 and Q4 revenues, indicating that the anticipated correction to chip inventory levels occurred, Gartner reports. The correction process will be largely completed by Q1 2012, evidenced by rising trends in the lead-time index.


The ultimate limit of Moore’s Law: The one-atom transistor

Tue, 2 Feb 2012

A team of researchers at the University of New South Wales, Purdue University and the University of Melbourne have built the smallest transistor ever using a single phosphorous atom.


IRPS set for April in Anaheim

Tue, 2 Feb 2012

The IEEE International Reliability Physics Symposium (IRPS) is set for April 15, 2012 – April 19, 2012, in Anaheim, CA.


Combo chipsets to suffer against new embedded WiFi chipsets

Tue, 2 Feb 2012

Processors like Qualcomm’s Snapdragon will make an impact on future chip revenues, reports analyst firm In-Stat, an NPD Group company.


SUSS brings GenISys lithography simulation software onto mask aligners

Tue, 2 Feb 2012

SUSS MicroTec will work with GenISys, provider of high-performance software solutions for nano scale fabrication, to combine the SUSS MicroTec mask aligner tools with the GenISys simulation software Layout LAB.


SPIE 2012: The Spring of EUVL

Mon, 2 Feb 2012

Dr. Vivek Bakshi, President of EUV Litho, Inc., reports on the SPIE Advanced Lithography conference. He says that this year even the loudest criticism of EUVL was not about “if” but “when,” and the predicted range of insertion for EUVL in high volume manufacturing (HVM) is now 2013-15.


Metrology project launches in Europe for thin films

Fri, 3 Mar 2012

The National Physical Laboratory in the UK is leading a new EMRP project on thin film manufacturing metrology for industries such as opto electronics, plastic and printed electronics, displays and lighting, memories and solar cells.


ISSCC from a memory analyst’s view

Fri, 3 Mar 2012

The International Solid State Circuits Conference (ISSCC) brought the best and brightest minds in semiconductors together to share the results of the past year’s research and development efforts. Memory analyst Jim Handy, Objective Analysis, was there to cover some highly interesting presentations.


EVG wafer clean tool installed at Tokyo Institute of Technology

Thu, 3 Mar 2012

EV Group (EVG) shipped an EVG301 semi-automated single-wafer cleaning system to Tokyo Institute of Technology, for research on advanced optical communication ICs.


DuPont sells CMP JV interests to Air Products

Thu, 3 Mar 2012

Air Products will acquire all of DuPont's interest in DuPont Air Products NanoMaterials LLC (DA NanoMaterials), a 50-50 JV that the companies set up for the semiconductor and wafer polishing industries.


HDD rankings: Seagate ousts Western Digital after Thailand floods

Wed, 2 Feb 2012

Seagate recaptured the lead in HDD shipments during Q4 2011, ousting Western Digital thanks to "a fortuitous accident in geography" that kept Seagate's Thailand HDD manufacturing plant out of the floods last year, said IHS.


Infineon adds to semiconductor manufacturing complex in Malaysia

Wed, 2 Feb 2012

M+W Group, a global engineering and construction company, is reporting a major contract from Infineon Technologies for a new 100,000-sq.m. semiconductor plant in Kulim/Malaysia.


GLOBALFOUNDRIES hires procurement exec to manage capex expansions

Wed, 2 Feb 2012

GLOBALFOUNDRIES appointed Magnus Matthiasson, formerly of Philips Lumileds, as chief procurement officer (CPO), reporting to CFO Dan Durn.


IBM sets quantum bit (qubit) error reduction records

Wed, 2 Feb 2012

IBM Research established new records for reducing errors in elementary computations and retaining the integrity of quantum mechanical properties in qubits for quantum computing, using superconducting qubits.


Intel (INTC), Micron (MU) expand NAND flash memory JV

Wed, 2 Feb 2012

Intel Corporation and Micron Technology, Inc., entered into agreements to expand their NAND Flash memory joint venture relationship, wherein Intel will sell its stake in 2 fabs to Micron, IMFS and IMFT.


Antenna and RF silicon design work: imec and HiSilicon, Agilent and OSAT Company partner

Tue, 2 Feb 2012

HiSilicon and imec have signed a strategic research collaboration to develop innovative RF transceiver architectures for next-generation mobile terminals. OSAT Company is using Agilent EMPro and the Momentum 3-D planar electromagnetic simulator to design and simulate innovative new antennas and circuits.


PVD handbook updated with cost and performance focus

Tue, 2 Feb 2012

The Handbook of Physical Vapor Deposition (PVD) Processing, Edition No. 2 has been released, covering all aspects of PVD process technology, from characterization and preparation of the substrate material, through deposition and film characterization, to post-deposition processing.


ISS Europe: Bridging the valley of death

Mon, 2 Feb 2012

A common theme among the presenters at SEMI's ISS Europe was how Europe might bridge the so-called “valley of death” between basic research and volume manufacturing.


Bankrupt Elpida leapfrogs likely acquirer Micron in Q1 DRAM rankings

Thu, 5 May 2012

Micron is the generally favored acquirer for bankrupt Elpida. But this did not stop Elpida from displacing MU in the Q1 DRAM supplier rankings in Q1, noted IHS. DRAM as a whole declined in Q1, despite predictions of a strong 2012.


EpiGaN opens GaN-on-Si wafer production at new site

Wed, 5 May 2012

EpiGaN NV opened its GaN epitaxial material production site, on the Research Campus Hasselt in Belgium. EpiGaN’s GaN-on-Si material is used in next-generation power electronics.


CMP carrier upgrades legacy fab tools

Wed, 5 May 2012

Axus Technology introduced the Titan Carrier Upgrade for IPEC and Strasbaugh legacy CMP chemical mechanical polishing/planarization (CMP) tools for semiconductor and related manufacturing.


North American semiconductor tool makers see higher bookings in April

Wed, 5 May 2012

North America-based manufacturers of semiconductor fab equipment posted $1.60 billion in orders and $1.45 billion in billings in April 2012 for a book-to-bill ratio of 1.10, according to SEMI.


Researchers model ion bombardment for better nanofabrication

Wed, 5 May 2012

Brown University is using supercomputer simulations to better understand the ion bombardment of metal surfaces used in manufacturing nanoelectronics.


Present at IEEE IEDM 2012

Wed, 5 May 2012

IEEE International Electron Devices Meeting (IEDM) is seeking original presentations on microelectronics research and development, with a focus on silicon and non-silicon device and process technology, circuit/device interactions; energy-harvesting, biomedical, and power electronics; magnetics and spintronics; and other topics.


Power discrete semiconductors grow with cloud computing, electric vehicle demand

Tue, 5 May 2012

Power discretes’ sales revenue will grow at a CAGR of 6.5%, 2012-2016, estimates GBI Research. Power discretes are meeting demand for energy-efficient and environmentally friendly products.


IRSC brings NanoProfessor nano-science education to southeastern US

Tue, 5 May 2012

Indian River State College in FL will be the first college in the southeastern US to offer students access to the instrumentation and curriculum provided by the NanoProfessor Nanoscience Education Program from NanoInk.


EUV lithography readiness: ConFab presentation preview

Mon, 5 May 2012

Stefan Wurm, director of lithography, SEMATECH will present “EUV Lithography Manufacturing Introduction: Infrastructure Readiness” in the session Technology Trends in Semiconductor Manufacturing at The ConFab 2012, June 3-6 in Las Vegas.


ONNN opens IC design center in Czech Republic

Mon, 5 May 2012

ON Semiconductor (Nasdaq:ONNN) expanded its Roznov, Czech Republic, operations with a new 4,000sq.m. research and design facility, a quarter of which is high-tech laboratories.


Hynix becomes SK group member, focuses on semiconductor leadership beyond memory

Mon, 3 Mar 2012

Hynix officially became a member of SK group, energy and telecommunications conglomerate, changing its name to SK Hynix.


SEMICON Europa 2012 seeks presenters

Fri, 3 Mar 2012

SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30.


Elpida president, independent attorney to co-lead DRAM maker's bankruptcy

Fri, 3 Mar 2012

Elpida's bankruptcy process moved forward another step, with the Tokyo District Court naming Yukio Sakamoto, Elpida president & CEO and Nobuaki Kobayashi, attorney-at-law as the Trustees for the case.


North American semiconductor fab equipment sales above parity in February

Fri, 3 Mar 2012

North America-based makers of semiconductor equipment posted $1.33 billion in orders in February 2012, $1.32 billion in billings, and a book-to-bill ratio of 1.01, according to SEMI.


GLOBALFOUNDRIES signals 32nm yield success with 250k wafers from Fab 1

Thu, 3 Mar 2012

GLOBALFOUNDRIES' Fab 1 in Dresden, Germany has shipped 250,000 semiconductor wafers based on 32nm HKMG technology. AMD commented that it will move ahead with 28nm at GLOBALFOUNDRIES.


DOW opens semiconductor/display R&D center in Seoul with OLED focus

Thu, 3 Mar 2012

The Dow Chemical Company (NYSE: DOW) inaugurated its Dow Seoul Technology Center, a global R&D center with focus on technological advances in display and semiconductor applications.


Apple A5X processor teardown: Bigger die, higher heat?

Thu, 3 Mar 2012

Apple’s ARM-based processors have created a point of hardware differentiation in applications processors. With the A5X, Apple is going with a much larger die at the 45nm node (shared across the 2 prior generations), shares Chipworks. It's also turned off the PoP track.


Gigaphoton opens litho laser training center, regional HQ in OR

Thu, 3 Mar 2012

Lithography light source maker Gigaphoton Inc. opened its new U.S. Regional Headquarters and Training Center in Beaverton, OR.


Gudeng Precision designs EUV lithography pod with VICTREX material for low contamination

Thu, 3 Mar 2012

Gudeng Precision will use VICTREX PEEK-ESD 101 to make its first commercialized extreme ultraviolet (EUV) lithography pod. The material will help prevent contamination.


DOW CMP slurry boasts lower defects and better removal rates

Wed, 3 Mar 2012

Dow Electronic Materials released KLEBOSOL II 1730 colloidal silica slurry for CMP of inter-layer dielectrics and post-metal buff.


Semiconductor inventories coast at record levels into 2012

Wed, 3 Mar 2012

Semiconductor days of inventory rose 3.4%, hitting an 11-year high of 84.1 DOI at chip suppliers in Q4 2011, but this will decline 0.5% in Q1 2012, with hopes that demand is improving, says IHS.


ASIC design starts evolve into 3 SoC types

Wed, 3 Mar 2012

ASIC design starts are evolving under increasing design costs, rising design complexity, and lengthening design cycle times, especially in the SoC market, says Semico Research Corp. New applications are providing an element of stability.


Elpida bankruptcy: Will Micron (MU) take over the DRAM maker?

Wed, 3 Mar 2012

Barclays Capital weighs in on rumors that Micron (MU) offered $1.5 billion to take over Elpida. Should the offer stand, it would be about 20-30 cents on the dollar for Elpida's assets.


Taiwan allows higher Chinese investments in LCDs, semiconductors, fab equipment, more

Wed, 3 Mar 2012

Taiwan raised investment ceilings for Chinese investors in LCDs, semiconductors, IC assembly and test, microelectronics production equipment, and metal tool manufacturing.


Semiconductor capex to fall 11.6% in 2012, says Gartner

Wed, 3 Mar 2012

Worldwide semiconductor manufacturing equipment spending is projected to total $38.9 billion in 2012, an 11.6% decline from 2011 spending of $44 billion, according to Gartner Inc.


High-volume semiconductor fab reduces particle contamination test time

Wed, 3 Mar 2012

A high-volume semiconductor fab using particle monitor wafers to test for contamination in wafer fab tools looked to reduce its labor and test time. The fab switched to wireless wafer-like airborne particle sensors. Allyn Jackson, CyberOptics Semiconductor, shares the case study.


Fraunhofer delivers 300mm wafer processing to North America with Axus Technology

Wed, 3 Mar 2012

Fraunhofer IZM and Fraunhofer CNT will use CMP supplier Axus Technology exclusively to provide advanced 300mm wafer process development and foundry services to North American customers.


NIST offers $2.6M for semiconductor research beyond CMOS

Tue, 3 Mar 2012

NIST is soliciting proposals of long-term research in next-generation semiconductor technology, putting up $2.6 million in federal cost-shared funding for a project’s first year, with the potential for continued funding for up to 5 years.


AMEC installs dielectric etch tool in China for 28nm fab

Tue, 3 Mar 2012

AMEC installed a second-generation dielectric etch tool, the Primo AD-RIE, at Chinese foundry SMIC. It is the first time AMEC has installed the Primo AD-RIE in China.


Japan's aging semiconductor industry revealed by 2011 earthquake

Tue, 3 Mar 2012

One year ago, Japan’s semiconductor industry was rocked by a devastating earthquake and tsunami. However, the real disaster for Japan’s chip industry occurred during the years before the earthquake, says IHS.


CEA-Leti unveils wide-reaching silicon research scope

Wed, 5 May 2012

CEA-Leti has introduced the “LETI-3S” concept, for “Silicon Specialty Solutions.” The research is oriented to start-ups, component integrators, fabless or fablite chip companies, and equipment/consumable suppliers.


Semiconductor sales grew incrementally in March 2012

Wed, 5 May 2012

Global semiconductor sales hit $23.3 billion in March 2012, up 1.5% from February 2012 and down 7.9% from March 2011, reports the Semiconductor Industry Association (SIA).


RFMD intros GaN process for high-voltage power semiconductor devices

Wed, 5 May 2012

RF Micro Devices Inc. (Nasdaq GS:RFMD) expanded its gallium nitride (GaN) portfolio with rGaN-HV, optimized for high-voltage power devices in power conversion applications.


Arkema enters microelectronics manufacturing research area with CEA

Tue, 5 May 2012

CEA will extend its collaboration with Arkema beyond photovoltaics into microelectronics and organic electronics, setting up two joint public-private research projects in CEA-Leti and CEA-Liten.


Global Semiconductor Alliance appoints first China-based director

Tue, 5 May 2012

The Global Semiconductor Alliance (GSA) appointed Dr. Leo Li, chairman, CEO and president of Spreadtrum Communications Inc., to its Board of Directors. Li is GSA’s first China-based executive to join the Board.


450mm wafer handling business unit established by Crossing Automation

Tue, 5 May 2012

Crossing Automation Inc. formed a business unit around 450mm semiconductor wafer automation platforms. The company has a comprehensive line of 450mm wafer handling products currently shipping to fabs and tool makers.


CVD Equipment sells Ronkonkoma building in move to Central Islip location

Tue, 5 May 2012

CVD Equipment completed the sale of its Ronkonkoma, NY, facility, where its Application Laboratory was located. This is part of CVD Equipment’s move to its recently purchased building in Central Islip, NY.


Fujitsu Semiconductor transfers Iwate wafer fab to DENSO

Tue, 5 May 2012

Fujitsu Semiconductor will transfer ownership of its Iwate Plant, a semiconductor wafer fab in Iwate, Japan producing system LSI, microcontrollers, etc., to DENSO.


NASA funds GaN-on-Si power amplifier development at Nitronex

Tue, 5 May 2012

Nitronex was awarded a NASA Phase I SBIR to develop a highly efficient 20W X-band GaN power amplifier MMICs, for use in long range RF telecommunications. The company will deploy its GaN-on-Si technology.


SEMI lauds Congressman Dave Camp (R-MI) for microelectronics/photovoltaics support

Wed, 5 May 2012

SEMI presented US Congressman Dave Camp (R-MI) with its 2012 North American Government Leadership Award for his leadership and support of the US microelectronics and photovoltaic manufacturing value chain.


Micron, Hynix gain share in NAND Flash memory business

Mon, 4 Apr 2012

Micron Technology Inc. and Hynix Semiconductor Inc. achieved strong NAND flash business globally in Q4 2011, thanks to solid manufacturing and pricing. The chipmakers gained market share on the NAND Flash industry leaders Samsung and Toshiba, and will continue to grow in 2012, reports IHS.


Touch controller ICs see fast growth, capacitive display controllers gaining share

Mon, 4 Apr 2012

The global touch controller IC market is growing quickly, thanks to emerging natural user interfaces and touchscreens’ rapid adoption in consumer electronics. From 2011 to 2016, global touch controller revenue will grow from 0.4% of the total semiconductor industry to 1.65%.


Semiconductor revenues topped USD300B in 2011

Mon, 4 Apr 2012

Worldwide semiconductor revenues increased more than 3.7% year over year to $301 billion in 2011, according to the IDC Worldwide Semiconductor Applications Forecaster. IDC expects 2012 growth to be in the 6-7% range.


Logic fab orders MTSN rapid thermal anneal for volume ramp

Mon, 4 Apr 2012

A leading semiconductor manufacturer placed a follow-on order with Mattson Technology Inc. (NASDAQ:MTSN), wafer fab equipment supplier, for a Millios millisecond annealing system (MSA).


MEI semiconductor wet process tools built to prevent contamination

Fri, 4 Apr 2012

MEI uses Vycom Flametec PVC-C for chemical rinse tanks and other wafer-contacting elements of its process tools, reducing tool-based contamination and protecting fab workers. Bill McGinty, MEI operations manager, discusses the benefits the new-generation plastic for semiconductor fab tools.


Qualcomm dominates cellular baseband chip market in 2011

Thu, 4 Apr 2012

The global cellular baseband processor market grew 15% year-on-year in 2011, hitting $15.1 billion, shows Strategy Analytics. Of that, Qualcomm holds 45% market share.


ST-Ericsson adopts FDSOI from Soitec

Mon, 3 Mar 2012

ST-Ericsson, wireless and semiconductor company, selected planar fully depleted silicon on insulator (FD-SOI) technology from Soitec for use in future mobile platforms.


Semiconductor foundries order Nova metrology tools for 2Xnm node

Mon, 3 Mar 2012

Nova Measuring Instruments Ltd. (NASDAQ:NVMI) received $12 million in orders from leading semiconductor foundries for metrology on 2Xnm manufacturing ramp ups.


Fraunhofer partners for eco-friendly semiconductor clean chemistries

Fri, 3 Mar 2012

Fraunhofer Center Nanoelectronic Technologies is collaborating with bubbles & beyond to jointly develop novel cleaning solutions for the microelectronics industry, specifically, removing lithographic materials from semiconductor wafers.


Media tablets join top 5 semiconductor end-markets in 2012

Fri, 3 Mar 2012

Media tablets, experiencing "remarkably rapid ascension," will become the 4th largest application for semiconductors by 2014, up from 35th in 2010, according to IHS.


Siltronic scales down 150mm silicon wafer production in US and Germany

Fri, 3 Mar 2012

Siltronic, subsidiary of Wacker Chemie AG, will stop producing 150mm silicon wafers at its Portland, OR, facility in Fall 2012, and will consolidate 150mm production at its Burghausen, Germany, site.


IBM drills optical vias in chip for 1Tbit/sec transmission

Fri, 3 Mar 2012

IBM scientists developed a prototype optical chipset, Holey Optochip, that can transfer 1Tbit per second as a parallel optical transceiver, using optical vias through a standard 90nm CMOS chip.


Confovis taps Digital Surf for metrology tool imaging software

Fri, 3 Mar 2012

Confovis will begin providing MountainsMap imaging and surface analysis software from Digital Surf with its ConfoCAM LED grid-confocal measuring systems for inspection and research.


Semiconductors swayed by US presidential elections

Thu, 3 Mar 2012

Historically, US presidential election years have been very good for the semiconductor market as many elected officials attempt to pass (mostly short-term) legislation to boost the economy, reports IC Insights.


HDD recovers rapidly from Thailand floods and sluggish market

Thu, 3 Mar 2012

The HDD industry is rapidly recovering in 2012 and beyond, after surviving natural disasters and tepid market conditions in 2011, according to a report by TRENDFOCUS.


Photomask maker Photronics buys out Micron building

Wed, 3 Mar 2012

Photronics, Inc. (NASDAQ:PLAB) purchased its US nanoFab building from Micron Technology Inc., paying approximately $35 million. PLAB expects to save $5 million annually after the deal.


SINGULUS sells vacuum deposition tools to semiconductor sector

Wed, 3 Mar 2012

Singulus Technologies Aktiengesellschaft (SINGULUS) received 2 orders for its TIMARIS vacuum deposition system from the semiconductor industry.


Nitrogen-rich indium nitride wafers debut from Meaglow

Wed, 3 Mar 2012

Meaglow Ltd., MOCVD and epitaxy supplier, launched a range of nitrogen-rich indium nitride (InN) wafers for research and industry development around the compound semiconductor material.


LED makers could diversify with GaN power electronics production

Wed, 3 Mar 2012

The gallium nitride (GaN) power elec market is currently small, but new entrants are ramping to production, silicon-based electronics suppliers developing GaN, and LED makers diversifying capacity to make power semis.


German semiconductor maker revamps DUV lithography steppers with Ventex

Wed, 3 Mar 2012

Ventex performed a major deep ultra violet (DUV) lithography stepper refurbishment and installation project for a tier-one chip manufacturer in Germany.


Automated film frame handlers increase LED and semiconductor production

Tue, 3 Mar 2012

Owens Design Inc. released multiple customized film frame automated handlers to customers in the semiconductor and LED manufacturing tool industries.


imec unveils 14nm PDK, 14nm test chip to follow

Tue, 3 Mar 2012

Imec has released an early-version process development kit (PDK) for 14nm logic chips, targeting the introduction of numerous new key technologies, such as FinFET architectures and EUV lithography.


Semiconductor fab equipment spending to hit a record in 2013

Tue, 3 Mar 2012

Semiconductor fab equipment spending will remain flat in 2012, says SEMI. But look for a record spend from semiconductor makers in 2013, jumping from $38.85 billion spent in 2012 to $45 billion in 2013.


GaN transistors commercially available from HRL

Mon, 3 Mar 2012

HRL Laboratories LLC will now offer products in its GaN high electron mobility transistor (HEMT) technology commercially to customers in select markets, such as high-data-rate wireless links, radars and active sensors.


TSMC establishes 3 COOs under CEO Chang

Mon, 3 Mar 2012

TSMC (NYSE:TSM) named 3 co-chief operating officers at a special meeting of the foundry's Board of Directors. All three executives will report directly to Chairman and CEO Dr. Morris Chang.


Semiconductor demand declines 8.8% to start 2012, but expect positive drivers

Mon, 3 Mar 2012

The SIA reports worldwide semiconductor sales of $23.1 billion in January 2012, an 8.8% decrease year-over-year, but SIA expects positive demand as 2012 progresses.


AMD's new GLOBALFOUNDRIES semiconductor wafer agreement frees up 28nm choices

Mon, 3 Mar 2012

AMD (NYSE:AMD) amended its wafer supply agreement with GLOBALFOUNDRIES. The new agreement most notably gives AMD "flexibility to manufacture 28nm parts elsewhere," reports FBR Capital Markets.


TSMC, Samsung foundries reconsidering 2012 capex on stronger 28nm demand

Mon, 3 Mar 2012

After only 2 months, semiconductor foundries are already considering raising their 2012 capex budgets, says Terence Whalen, Semiconductor Equipment analyst for North America at Citi.


SMC 2012: Supply chain opportunities in OLEDs, energy storage, and power semiconductors

Fri, 11 Nov 2012

Materials experts from across the supply chain gathered at the 2012 Strategic Materials Conference 2012 in San Jose in October, discussing key materials needs for micromanufacturing outside the CMOS mainstream: OLEDs and GaN-on-silicon power semiconductors, graphene, CNTs, and self-assembling polymers.


X-Fab to fab Anvo's nonvolatile memory

Mon, 11 Nov 2012

X-Fab Silicon Foundries has inked a deal with Anvo-Systems Dresden to offer high-speed non-volatile memory (NVM) combining SRAM, DRAM, and SONOS flash technologies in a compact design.


X-Fab offering first 200V SOI foundry service

Thu, 11 Nov 2012

X-Fab Silicon Foundries is now offering what it calls the industry's first 200V SOI foundry technology, a trench dielectric isolated SOI foundry technology that allows blocks at different voltage levels to be integrated on a single chip.


Fujitsu readying GaN power devices by late 2013

Thu, 11 Nov 2012

Fujitsu Semiconductor says it has built a server power-supply unit with 2.5kW of output power using gallium nitride (GaN)-based power devices, and will ramp volume production of the power devices in late 2013.


Advancing CNTs for next-gen chips

Thu, 11 Nov 2012

Researchers from IBM and Georgia Tech have disclosed significant progress in manipulating carbon nanotubes in transistors and interconnects, in ways compatible with traditional fabrication techniques, advancing toward using the materials for next-generation devices.


September IC sales bounce in Americas, tracking to -4% for FY2012

Tue, 11 Nov 2012

A big boost in demand in the US helped ratchet up chip sales growth in September, according to the latest data from the Semiconductor Industry Association (SIA), but annual growth is on pace for a -4% decline from 2011.


GSA working group evaluates new semiconductor startup models to attract investors

Tue, 11 Nov 2012

The Global Semiconductor Alliance (GSA) has formed a new working group and identify various alternatives to encourage startups to innovate, woo investors, generate returns, and keep generating sustainable industry M&A.


OLED TV panels' breakout year delayed, but it's coming

Mon, 11 Nov 2012

Despite continued delays from its two big proponents, OLED TV technology will finally start ramping over the next year, reaching one million unit shipments in 2014 and a 3% market penetration by 2016, says NPD DisplaySearch.


US semiconductor industry employs nearly 250,000 workers

Mon, 11 Nov 2012

Hours away from the US presidential election, here's one last message about jobs and growth in the semiconductor sector.


Imec, Nantero launch joint carbon nanotube memory program

Mon, 11 Nov 2012

Nantero's carbon nanotube-based memory (NRAM) will be manufactured, tested and characterized in imec's facilities targeting application in high-density next-generation sub-20nm memories.


O-S-D market momentum fades as world economy stalls

Fri, 11 Nov 2012

After a strong surge in 2010 and solid growth in 2011, the market for optoelectronics, sensors/actuators, and discrete semiconductors (O-S-D) has lost most of its momentum amid a wobbling world economy, says IC Insights.


OLED lighting sales could reach $1.7B by 2020 -- if panel makers commit now

Fri, 11 Nov 2012

There's a new battleground slowly emerging for OLEDs in lighting applications where the technology could offer some advantages in design and efficiency -- if panel makers are willing to make some sacrifices.


EU partners clarify EUV optics improvements

Thu, 11 Nov 2012

A group of partners in Europe summarize results from their completed project to deliver the first EUV lithography optics, with progress in several optics components and in mask handling, cleaning, and repair.


Applied unveils new PVD, PECVD tools for display manufacturing

Wed, 10 Oct 2012

Applied Materials has announced two new tools for display manufacturing: one with a new design for depositing IGZO films for TFTs, the other handling bigger LTPS-deposited substrates to help lower manufacturing costs.


Why the new Windows 8 won't spur DRAM sales

Mon, 10 Oct 2012

In a departure from past iterations, Windows 8 will not cause any significant rise in DRAM unit shipments, predicts IHS iSuppli.


Brooks Automation buying Crossing Automation

Tue, 10 Oct 2012

Brooks Automation says it has agreed to acquire privately-held Crossing Automation for $63 million, combining two firms in semiconductor automation technology and services.


After worst-ever 2012, FPD equipment to see a brighter 2013

Tue, 10 Oct 2012

This year is shaping up to be a historically lousy year for makers of flat-panel display (FPD) manufacturing equipment, but expectations are looking up that demand will catch up to supply in 2013 and balance the market, according to NPD DisplaySearch projections.


Comm, auto apps are now driving the IC market

Fri, 10 Oct 2012

Communications applications are far and away the leading growth market for ICs over the next five years, and PCs and consumer applications have fallen far back in the pack.


Why bigger is better for FPD recovery and growth

Wed, 10 Oct 2012

DisplaySearch explains why larger panel sizes are a big reason the flat-panel display industry is back on the road to recovery, despite excess capacity and eroding prices (and profits): larger panel sizes. Plus: a Black Friday deal tip-off.


Why node shrinks are no longer offsetting equipment costs

Wed, 10 Oct 2012

Semiconductor manufacturers can expect equipment costs to increase about 15% for each new process node, but previously enjoyed advantages of moving to smaller feature sizes are no longer offsetting those costs -- even with a 450mm wafer transition.


ProTek offering unpackaged die for LEDs

Tue, 10 Oct 2012

ProTek Devices says it is now offering individual unpackaged die for LEDs in wafer form, available as unidirectional and bidirectional electrostatic discharge (ESD) protection diodes.


Wafer shipments back on track: Inside the numbers

Tue, 10 Oct 2012

Wafer demand is slowly turning back toward growth, and a closer look at the numbers from SEMI and Semico Research shows what's behind the trends -- and why they give purchasing managers headaches.


Semi equipment demand still sinking

Mon, 10 Oct 2012

In case anyone needed a reminder or a wake-up, new data from SEMI reiterates chip tool sales are slumping badly in the latter part of this year.


Process Watch: A clean, well-lighted reticle

Fri, 10 Oct 2012

In the fifth installment in a series called Process Watch, the authors discuss the need for proper reticle cleaning and inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.


Flat-panel displays rebounding in 2012 as prices fall, performance rises

Thu, 10 Oct 2012

Worldwide flat-panel display (FPD) revenues will reach a record $120 billion in 2012, up 8% from a challenging year in 2011, and the recovery is entirely on the backs of TFT-LCDs and AMOLED displays, according to NPD DisplaySearch.


European consortia, ASML, supplier network plan for 450mm transition

Thu, 10 Oct 2012

At SEMICON Europa, European government representatives, consortia, and suppliers discussed programs to support and participate in the 450mm wafer-size transition -- including a comprehensive presentation from ASML about its roadmap for 450mm EUV platforms.


ASML buying Cymer to push EUV litho development

Wed, 10 Oct 2012

Pulling Cymer's EUV source technology in-house is hoped to accelerate progress in the technology's long slow march toward production readiness.


Intel offers muted optimism in 3Q12 results, but cutting capex

Wed, 10 Oct 2012

Intel spoke of caution in end markets when discussing its 3Q12 results, but a big dip in capex and lack of 2013 visibility will likely cause concern in the semiconductor manufacturing ecosystem.


SEMI adds session, extends abstract deadline for China chip conference

Tue, 10 Oct 2012

SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.


GSA forms technology steering committee to guide working groups

Tue, 10 Oct 2012

The Global Semiconductor Alliance (GSA) says it has formed a Technology Steering Committee to help address key business and technology areas of interest to its members, and "encourage the advancement and adoption of leading technology and practices."


STMicro: 28nm FD-SOI is ready for manufacturing

Wed, 12 Dec 2012

STMicroelectronics is getting out of the JV chip business with Ericsson, but it's still full-steam ahead for its use of (FD-SOI) technology with its partners. 


Why Taiwan LED equipment vendors can't support a 2013 rebound

Wed, 12 Dec 2012

Taiwan makers of light-emitting diode (LED) products are unlikely to support a recovery in 2013 LED equipment spending due to an alarming cash crunch individually and sector-wide, warns one industry analyst.


Process Watch: Cycle time’s paradoxical relationship to inspection

Tue, 12 Dec 2012

In the seventh installment in a series called Process Watch, the authors discuss cycle time and the impact of inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.


IEDM: Nanoelectronics provide a path beyond CMOS

Tue, 12 Dec 2012

At the International Electron Devices Meeting in San Francisco, An Chen of GLOBALFOUNDRIES presented a survey of emerging nanoelectronic devices, which he divided into two categories: Charge-based and non-charge based.


ST exiting mobile chip JV with Ericsson, but still committed to FD-SOI

Mon, 12 Dec 2012

STMicroelectronics has a new strategic plan that will focus on five product areas (MEMS/sensors, smart power, automotive products, microcontrollers, and application processors), and also exit its mobile chip JV with communications giant Ericsson.


AMD-GlobalFoundries' new wafer deal: What it means

Fri, 12 Dec 2012

A new wafer supply deal between AMD and GlobalFoundries will free up cash in the near-term, but industry watchers fear that long-term issues still loom.


Nikon and Intel announcements highlight 450mm news from Japan

Thu, 12 Dec 2012

In news from Semicon Japan, a Nikon spokesperson said that the company plans to ship high-volume manufacturing (HVM) lithography tools in 2017, and Intel officially announced a 450mm Japan Metrology Center.


Axcelis and Lam enter strategic collaboration agreement

Thu, 12 Dec 2012

Axcelis Technologies, Inc. (NASDAQ: ACLS) and Lam Research Corp., (NASDAQ: LRCX) announced a strategic collaboration agreement focusing on the interrelationship between ion implantation, etch processes, and photoresist strip applications.


KLA-Tencor's updated LED wafer inspection tool boosts throughput, efficiency

Thu, 12 Dec 2012

KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers.


CMP consumables demand rebounding in 2012

Wed, 12 Dec 2012

The global market for consumables used in chemical mechanical planarization (CMP) operations continues to rebound, as "magic triangle" combinations of slurry, pad, and conditioner are emerging to improve performance for ≤45nm requirements, reports TechCet Group.


Advantest will introduce three tools at Semicon Japan

Thu, 11 Nov 2012

In prep for Semicon Japan in December, Advantest announces three new tools: 2 SEMs and a litho system.


Mapping the mismatch in the LCD TV supply chain

Thu, 11 Nov 2012

NPD DisplaySearch's examination of the projected 2013 LCD TV panel product mix finds some big differences between what suppliers offer and what buyers want.


Actinic EUV source firm Adlyte details expansion plans

Wed, 11 Nov 2012

Swiss firm Adlyte, a developer of high-brightness laser-produced plasma (LPP) EUV light source for actinic mask inspection, is outlining its current expansion efforts, which includes appointing a longtime industry exec to its strategic advisory board.


Wafer shipments screech to halt in 3Q, still tracking to 1% growth in 2012

Wed, 11 Nov 2012

After a nice spurt in 2Q12, worldwide silicon wafer area shipments fell back to a -slight decline in 3Q12, according to updated data from SEMI, and remain on track for cautious projections of flat growth for the full year.


Pureplay, foundry firms still shine in IC sales rankings

Tue, 11 Nov 2012

Updating its "top 20" semiconductor supplier rankings from earlier this year, IC Insights finds most of the same trends holding true: a tough year overall for chipmakers, but fabless and foundry firms still showing very good growth.


Process Watch: Breaking parametric correlation

Tue, 11 Nov 2012

In the sixth installment in a series called Process Watch, the authors discuss the ins and outs of parametric correlation when using measurements based on reflectometry, ellipsometry, or a combination of the two. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.


Smartphone demand pushes Soitec to expand bonded SoS wafer output

Tue, 11 Nov 2012

Soitec says it has more than doubled production of bonded silicon-on-sapphire (BSoS) substrates to meet increased demand from partner Peregrine Semiconductor, which has surged its own production capacity for RF switches used in cellular handsets, including the newest iPhone 5.


FEI introduces Helios NanoLab 450 F1 DualBeam for failure analysis

Mon, 11 Nov 2012

FEI, Hillsboro, OR, has introduced its new Helios NanoLab 450 F1 DualBeam system designed to provide faster, better images of their most advanced device architectures.


Imec to collaborate with Canon Anelva and TEL on STT-MRAM

Mon, 11 Nov 2012

imec announced two research collaboration efforts to advance STT-MRAM technology, an alternative high-density memory technology. The developments include working with Canon Anelva Corp. on its deposition tool and working with Tokyo Electron (TEL) on its Tactras etch tool, both installed in imec’s 300mm cleanroom.


When will bulk GaN be price-competitive with silicon?

Mon, 11 Nov 2012

Wide bandgap semiconductor materials can significantly outperform traditional silicon-based devices in power electronics and light-emitting diodes (LEDs), but they're vastly more expensive. So where's the midpoint where GaN's capabilities and extra costs align to make it the preferred technology for each application?


ICPT 2012: Five themes summarizing CMP work and progress

Mon, 11 Nov 2012

This year's International Conference on Planarization/CMP Technology (ICPT) encompassed five themes describing use of CMP: new device structures, equipment and methods, Cu interconnects, consumables, and new CMP methods and processes.


IDTechEx forecasts a $100 million graphene market in 2018

Thu, 11 Nov 2012

Despite graphene's promise as a material in future electronics with excellent properties in almost all applications, it still faces difficulties in market acceptance, according to a report from IDTechEx.


Renesas nearing final bailout: Reports

Wed, 11 Nov 2012

The Japanese rescue of Renesas Electronics partly with state-backed funding is nearing finality, with the company's three largest shareholders approving the deal, according to multiple reports.


Black Friday impressions: Bargains, bigger TVs, and Walmart's muscle

Wed, 11 Nov 2012

NPD DisplaySearch analyst Paul Gagnon took the pulse of consumer shoppers on Black Friday and came away with three observations: bargains are a priority, consumers want bigger upgrades, and Walmart flexed its muscles.


EV Group completes cleanroom expansion, opens new R&D labs

Wed, 11 Nov 2012

EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services.


WSTS trims chip sales outlook for 2012, 2013

Wed, 11 Nov 2012

Persistent global economic uncertainty from Europe to the US to China is weighing down the WSTS' expectations for semiconductor sales for the next two years, with a slow climb back to single-digit growth by 2014.


LED market for indoor residential lighting poised to surge

Tue, 11 Nov 2012

Technology improvements and supportive legislation are gathering momentum to help push LED adoption for residential buildings -- the largest lighting application sector.


Global GDP, smartphones bode good tidings for semiconductor growth

Mon, 11 Nov 2012

Despite lingering clouds obscuring near-term visibility for the semiconductor manufacturing industry, signs of macroeconomic life bode well for sales of electronics devices, and by association the chip technologies that power them.


Growth outlook for industrial semiconductors dims to 3% in 2012

Fri, 11 Nov 2012

Growth in the industrial electronics semiconductor market is set to fall short of previous expectations in 2012 as the business is buffeted by weakening global economic conditions, with the LED market the sole bright spot, says IHS iSuppli.


GSA, IC Insights team on 5th edition of IC Foundry Almanac

Wed, 11 Nov 2012

A reference book from the Global Semiconductor Alliance (GSA) and IC Insights puts foundry information at the fingertips of those who need it the most.


Electronic gases slowing to modest growth in 2012, 2013

Wed, 11 Nov 2012

Sales of electronic gases are seen growing a modest 3.2% growth overall in 2012, following a 15% increase in 2011 to $3.1B, according to an updated report from Techcet Group.


IC content per television increasing even as TV unit growth slows

Tue, 11 Nov 2012

Smart TVs, LED technology, and emerging markets will boost the IC market for TVs, says a new IC Insights study. Another trend: younger tech-savvy consumers are watching TV via the Internet and mobile devices.


Semiconductor equipment demand: Shades of 2009?

Fri, 11 Nov 2012

The latest monthly numbers for semiconductor manufacturing equipment demand aren't pretty: lows in both orders and sales not seen since the last major downcycle three years ago, and the short-term comparisons continue to widen.


TELEFUNKEN expands Roseville facility

Thu, 11 Nov 2012

TELEFUNKEN Semiconductors is expanding its manufacturing capacity at the Roseville, California facility, to 220,000+ 8 inch wafers.


Brewer Science introduces CNT inks for printed electronics

Thu, 11 Nov 2012

Rolla, MO-based Brewer Science introduced a line of conductive CNT ink materials that are surfactant free, require no additional rinse steps, and are compatible with a broad range of printed electronic substrates.


Researchers from ST and CEA-Leti receive Général Ferrié Award

Wed, 12 Dec 2012
p>A team of ST and CEA-Leti researchers have received the 2012 Général Ferrié Award, considered to be the highest award in electronics R&D in France.


iSuppli trims chip forecast again, still expects 2013 rebound

Wed, 12 Dec 2012

Chip sales growth continues to soften in 2012 as the industry slips from "stagnation" to "slump," but the stage is still set for a rebound in 2013, according to updated analysis from IHS iSuppli.


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IEDM 2012 slideshow: Sneak preview of 14 conference papers

Tue, 12 Dec 2012

We've scanned the entire conference program for next week's 58th annual IEEE International Electron Devices Meeting (IEDM), to present a quick sampling of some of the more intriguing papers.


Scholarship created for women going into engineering

Tue, 12 Dec 2012

TechSearch International and the IEEE Women in Engineering Committee (WIE) are establishing a $2500 scholarship for women going into the field of engineering.


Preventice launches clinical trials for its remote patient monitoring system

Mon, 12 Dec 2012

Preventice, Inc. announced that its BodyGuardian Remote Patient Monitoring System (BodyGuardian RMS) will be commercially available in early 2013. Meanwhile, clinical trials are underway in the United States and Europe


"Cloning" could make structurally pure nanotubes for nanoelectronics

Fri, 11 Nov 2012

Researchers have demonstrated a technique for growing virtually pure samples of single-wall carbon nanotubes (CNT) with identical structures, a process likened to "cloning" them -- and possibly an important step toward controlling their manufacture for future electronic devices.


AMD wants to sell, lease back Austin campus

Fri, 11 Nov 2012

AMD hopes to save up to $200M by selling its Lone Star campus in Austin and then leasing the site back, as the company seeks ways to regain its fiscal footing.


In-cell touch, DITO tech gaining ground for mobile device displays

Fri, 11 Nov 2012

More than 7% of all mobile phones will use in-cell touch technology in 2012 while tablet PCs start adopting "DITO" film structures, as both technologies strive to overcome production challenges, explains NPD DisplaySearch.


Applied consolidates solar and displays units, two execs leaving

Fri, 11 Nov 2012

Applied Materials is combining its Display and Energy and Environmental Solutions (EES) under one roof led by former KLA-Tencor exec Ali Salehpour, which also means the departure of those two units' current leaders, Mark Pinto and Tom Edman.


Printed electronics materials swell to $2.6B by 2017

Thu, 11 Nov 2012

The market for materials used in printed electronics manufacturing will nearly double over the next five years as new materials are brought forth to support low-cost volume production of printed electronic devices, according to Lux Research.


FlexTech Alliance, 4D Technology developing R2R surface metrology system

Fri, 12 Dec 2012

The FlexTech Alliance has awarded 4D Technology (Tucson, AZ) a contract to develop an optical system that addresses a shortcoming in roll-to-roll (R2R) electronics manufacturing: in situ, high-resolution mapping of surface topography and defects on a moving, flexible web.


Singapore IME, Nikon building R&D lab for sub-20nm semiconductor litho

Thu, 12 Dec 2012

Nikon and the Singapore A*STAR IME are jointly setting up a R&D lab to develop optical ArF lithography technology for semiconductor manufacturing to and below the 20nm device node.


Gartner: Fab equipment still getting softer, next upcycle starts in 2014

Thu, 12 Dec 2012

Global spending on wafer fab equipment (WFE) is now on pace to finish 2012 with a -17% annual decline, and 2013 now looks like it'll only be slightly better at a -10% dropoff, before the next cyclical spending upturn begins in 2014, according to an updated forecast from Gartner.


SMIC claims breakthrough in backside-illuminated image sensors

Thu, 12 Dec 2012

SMIC is claiming a breakthrough in its development of backside-illuminated (BSI) CMOS image sensor (CIS) technology, with the first test chip demonstrating good image quality even in low-light conditions.


Asylum Research acquired by Oxford Instruments

Wed, 12 Dec 2012

Abingdon, England--Oxford Instrumentshas acquired Asylum Research, a maker of scanning probe microscopes (SPM) with subsidiaries in the UK, Germany, and Taiwan. Its products are used by academic and industrial customers across the world for a wide range of materials and bioscience applications.


Canon stepper targets LED, MEMS, power device manufacturing

Tue, 12 Dec 2012

Canon U.S.A., Inc. recently launched the FPA-3030i5+ i-line stepper, designed for the manufacturing of LEDs, MEMS and power semiconductors.


Samsung reaffirms plans for $4B investment in Austin fab: What it means

Mon, 12 Dec 2012

Samsung's reaffirmation of its planned $4B investments in its Austin, TX facilities don't offer much extra info, but do serve as a message to the market about its future plans -- with or without Apple.


Attend SPIE BACUS Symposium on photomasks in the deep sub-wavelength era

Mon, 8 Aug 2012

The Annual SPIE/BACUS Symposium, serving the worldwide photomask industry, will take place September 10-14, with the theme of successful integration and optimization of design, mask-making, and wafer fabrication in the deep sub-wavelength era.


Wireless consumer devices reenergize magnetic sensor IC sector

Mon, 8 Aug 2012

Magnetic sensor semiconductors are robust but steady in application sectors like automotive, military/medical, and data processing. But the devices saw 50% growth in one segment last year: wireless/consumer, according to IHS.


Qcept sells NVD inspection tool for semiconductor process development and integration

Mon, 8 Aug 2012

A “leading semiconductor technology innovator” ordered Qcept Technologies Inc.’s ChemetriQ 5000 NVD inspection system for unit process development and process integration activities for advanced nodes, including 2Xnm and 1Xnm logic nodes for both front-end-of-line and back-end-of-line processes.


Rubicon orders Zeta 300 optical profilers for sapphire LED substrates

Mon, 8 Aug 2012

Zeta Instruments will install multiple optical profilers for micron-scale surface analysis at sapphire substrate maker Rubicon Technology, for metrology and inspection on sapphire substrates and wafer production aimed at the HB-LED market.


TSMC takes 5% stake in ASML, joining Intel

Mon, 8 Aug 2012

TSMC took a 5% stake in ASML, worth EUR 838 million, as part of the ASML Holding N.V. Customer Co-Investment Program to accelerate development of EUV lithography and 450mm wafer processing. TSMC will also commit EUR 276 million to ASML’s R&D programs.


EUV lithography project launches for better resolution at 14nm

Fri, 8 Aug 2012

Germany has launched a new project, EUV projection optics for 14nm resolution, or ETIK, led by Carl Zeiss and 6 other German companies and research institutes. The aim is to improve extreme ultraviolet (EUV) lithography resolution to the 14nm node.


SIA reports flat semiconductor sales in June with Eastern edge

Fri, 8 Aug 2012

Global semiconductor sales stayed flat in June 2012, hitting $24.38 billion, reports the Semiconductor Industry Association (SIA). Y/Y, sales fell just 2% in June, a slower decline than the semiconductor industry has seen since October 2011.


Panasonic reorgs R&D along medium-, long-term roadmaps

Fri, 8 Aug 2012

Panasonic Corporation (NYSE:PC, TOKYO:6752) will reform its head office and governance as of October 1, aiming to reduce internally focused work and focus on customer needs.


ONNN CFO resigns as chipmaker reports flat growth

Fri, 8 Aug 2012

ON Semiconductor Corporation (Nasdaq: ONNN) will be looking for a new CFO, with Donald Colvin vacating the post within 90 days. ONNN also authorized its first share repurchase program, and reported flat growth for Q2, with similar guidance for Q3.


Process Watch: Bigger and better wafers

Thu, 8 Aug 2012

In the third installment in a series called Process Watch, the authors discuss some of the challenges of 450mm wafers. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.


Foundries take win, place, and show in H1 semiconductor company growth race

Thu, 8 Aug 2012

IC Insights released a Q2 update to its top-20 ranking of semiconductor companies. Three pure-play foundries are in the top 20 ranking, with a cumulative increase of 20% from Q1 2012 to Q2 2012.


The ConFab 2012: A retrospective

Thu, 8 Aug 2012

The ConFab, Solid State Technology’s invitation-only event for the semiconductor industry, took place in June, with presenters from top companies and analyst firms. If you couldn’t be there, check out all the coverage from the event -- reports, presentations, video interviews and more.


Infineon freezes headcount, decreases 2013 spending

Thu, 8 Aug 2012

Following Q3 revenue of EUR990 million, approximately unchanged compared to the previous quarter and outlook for Q4 flat to down slightly, Infineon implemented measures to reduce costs. Full-year revenue will be down approximately 3% from 2011.


UMC’s “green” semiconductor fab in Taiwan certified LEED Gold

Wed, 8 Aug 2012

Semiconductor foundry United Microelectronics Corporation (NYSE:UMC; TWSE:2303) gained LEED-NC Gold recognition for its 300mm Fab 12A P3 & P4 in Tainan, Taiwan, from the U.S. Green Building Council.


Crossing Automation intros Spartan sorter options

Wed, 8 Aug 2012

Crossing Automation, Inc. announced three new options for the Spartan 300 that deliver an end-to-end contamination-free sorter environment. The new options target high volume manufacturing at 32nm and below.


Gentry rejoins Seagate to lead SSD biz

Tue, 7 Jul 2012

Seagate Technology plc (NASDAQ:STX) added Gary Gentry to lead its solid state drive (SSD) business as senior vice president, SSD.


EDAX debuts SDD series for faster electron microscopy without lost data

Tue, 7 Jul 2012

EDAX Inc. introduced the Octane Series silicon drift detectors (SDD) for its TEAM EDS Analysis Systems on electron microscopes.


CGI Americas brings C Sun ovens to North American fabs

Mon, 7 Jul 2012

CGI Americas is introducing the QMO Series inert gas and vacuum ovens and MOL Series Class 100 cleanroom ovens, based on the SMO Series precision ovens from C Sun, to the North American market.


FEI’s extreme-high-resolution SEM enables metrology on semiconductors <22nm

Mon, 7 Jul 2012

FEI (NASDAQ:FEIC) launched the Verios XHR SEM for metrology on beam-sensitive and sub-nanometer-scale materials in advanced semiconductors.


Pfeiffer Vacuum intros gas analysis systems for 50 mbar and lower pressure processes

Mon, 7 Jul 2012

Pfeiffer Vacuum introduced the Sputter Process Monitor SPM 220 and High Pressure Analyzer HPA 220 gas analysis systems to monitor and document vacuum processes.


New cleaning system maintains contact cleaning rollers better than IPA

Mon, 7 Jul 2012

Teknek debuted an elastomer roller care system for all contact cleaning rollers. Unlike IPA cleaning, the elastomer Roller Doctor rejuvenation pad exfoliates the roller surface with a precise quantity of proprietary cleaning solution.


EMCORE switches fab management and process control to Camstar system

Fri, 7 Jul 2012

EMCORE, compound semiconductor-based components and subsystems supplier, will replace multiple legacy manufacturing systems in its compound semiconductor fab and back-end packaging operations with the Camstar Enterprise Platform.


2012 “Best of West” award finalists announced

Thu, 6 Jun 2012

Solid State Technology and SEMI today announced the finalists for the 2012 “Best of West” awards, recognizing important product and technology developments in the microelectronics supply chain.


SEMICON West preview: Metrology, inspection, and process control products

Thu, 6 Jun 2012

Following are some of the process control, device inspection, defect detection, and other metrology and test products that will be on display at SEMICON West 2012, July 10-12 in San Francisco, CA.


Murata researches reconfigurable radio ICs with imec

Wed, 6 Jun 2012

In a 3-year research collaboration, research organization imec and semiconductor provider Murata Manufacturing Co. Ltd. will work on reconfigurable radio IC design.


CEA-Leti installs Soitec CVD tool for HKMG and PCM research

Wed, 6 Jun 2012

CEA-Leti installed a CVD tool from Altatech, a subsidiary of Soitec, to research sub-20nm phase-change memory (PCM) and high-k metal gate (HKMG) semiconductor devices.


DFMSim wins 1st metrology integration for its lithography software

Thu, 6 Jun 2012

DFMSim announced a distribution agreement with a leading US process control OEM that involves the integration of DFMSim’s SMARTlitho manufacturing software into new tools for advanced metrology.


Edwards tailors vacuum pump for LED, compound semiconductor manufacturing

Tue, 6 Jun 2012

Edwards (NASDAQ:EVAC) introduced the new iXH645H dry pump, optimized for metal-organic chemical vapor deposition, a key step in LED and compound semiconductor manufacturing.


JPSA picosecond laser micromachining platform reduces debris and thermal damage

Tue, 6 Jun 2012

JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.


Wafer fabs to spend 8.9% less on equipment in 2012; utilization rates improve

Mon, 6 Jun 2012

Worldwide wafer fab equipment spending will total $33 billion in 2012, down 8.9% from 2011’s $36.2 billion spending level, say Gartner analysts. Chipmakers will spend more than $35.4 billion on WFE in 2013, ramping 7.4% over this year.


EUV lithography update: 1st adopters and supplier support

Mon, 6 Jun 2012

Barclays Capital checks in on the EUV lithography market potential and which semiconductor manufacturers will press adoption. The analysts also update their expectations for lithography tool suppliers on the EUV front.


Lercel to lead SEMATECH's metrology work, new Nanodefect Center

Mon, 6 Jun 2012

SEMATECH added Michael Lercel as senior director for nanodefectivity and metrology, taking the helm on SEMATECH’s ongoing semiconductor wafer metrology program and the new Nanodefect Center in NY.


Electron backscatter diffraction arrives at EAG for crystalline material characterization

Sun, 6 Jun 2012

Evans Analytical Group Inc. (EAG) added electron backscatter diffraction (EBSD) to its analytical and testing services.


SEMICON West 2012 exhibits preview: Lithography focus

Wed, 6 Jun 2012

SEMICON West is taking place July 10-12 in San Francisco, CA. Following are new products for  lithography, including photoresist coaters and ashers.


Linde supports semiconductor manufacturer with expansion in OR

Fri, 6 Jun 2012

Linde North America is expanding its capacity to supply ultra-high purity (UHP) gases to a major global semiconductor manufacturer’s Pacific Northwest location.


Cypress gives Ramtron another extension on acquisition offer

Tue, 8 Aug 2012

Cypress Semiconductor has extended its new, higher bid to acquire Ramtron through August 24, 2012. The bid has been renewed several times. Ramtron has previously rejected the offer.


Semiconductor makers focus on flow control and treatment at leading edge; H20 reuse rises

Fri, 6 Jun 2012

Semiconductor manufacturers will spend $2.3 billion in 2012 for flow control and treatment products, shows McIlvaine Company. Even more pure water is required as the line sizes on chips are decreasing. This aspect, coupled with the opportunity for water reuse, is creating new opportunities.


Global semiconductor funding rose in May

Fri, 6 Jun 2012

The Global Semiconductor Alliance (GSA) shows more than 100% increase in semiconductor company investment Y/Y in May, in the Global Semiconductor Funding, IPO and M&A Update.


North American semiconductor fab tool makers see 4th month of positive book-to-bill ratio

Fri, 6 Jun 2012

North-America-based manufacturers of semiconductor fab equipment posted $1.61 billion in orders worldwide in May 2012, $1.54 billion in billings, and a 1.05 book-to-bill ratio, shows SEMI.


SIA recognizes semiconductor researchers, policy supporters

Wed, 7 Jul 2012

The Semiconductor Industry Association (SIA) presented its 2012 University Researcher Awards to Stanford University professors Krishna Saraswat and Bruce Wooley as well as its 2012 Congressional Leadership Awards to Sen. Carl Levin, Sen. John McCain, Rep. Kevin Brady and Rep. Wally Herger.


May semiconductor sales edge out April numbers for third growth month

Wed, 7 Jul 2012

“The upward trend of global semiconductor sales is encouraging,” said Brian Toohey, SIA. “Recent sales totals are in line with industry projections of modest growth for the remainder of 2012, but a sluggish global economy continues to provide substantial headwinds, limiting more robust growth.”


UMC licenses IBM’s 20nm, FinFET semiconductor technology

Tue, 7 Jul 2012

Semiconductor foundry United Microelectronics Corporation (NYSE:UMC; TWSE:2303) has licensed IBM technology to expedite the development of its 20nm CMOS process with FinFET 3D transistors.


Qualcomm puts semiconductor business into new subsidiary QTI

Tue, 7 Jul 2012

Wireless technology company Qualcomm will change its corporate structure, moving substantially all of its R&D activities, its QCT semiconductor business, and other product and services businesses into a new wholly owned subsidiary, Qualcomm Technologies Inc.


Cypress secures credit from Morgan-Stanley-led group for acquisitions, other purposes

Mon, 7 Jul 2012

Cypress entered into a 5-year senior secured revolving credit facility with a group of lenders led by Morgan Stanley Senior Funding. The facility enables the company to borrow up to $430 million on a revolving basis.


Micron doubles wafer capacity, adds mobile DRAM with Elpida assets buy

Mon, 7 Jul 2012

Micron Technology Inc. (Nasdaq:MU) will acquire and support bankrupt DRAM maker Elpida Memory Inc.’s assets, paying approximately US$2.5 billion total consideration, less certain reorganization proceeding expenses.


EUVL workshop focuses on source power, timing

Mon, 7 Jul 2012

At the recently concluded 2012 EUVL Workshop (held June 4-8 in Maui, HI), attendees shared their latest technology developments and discussed ways to address the challenges of EUVL insertion into high-volume manufacturing (HVM).


SiC's advantages over silicon push more SiC semiconductors over 10 years

Fri, 6 Jun 2012

Silicon carbide (SiC) semiconductors will see 38% CAGR through 2022 thanks to power and efficiency advantages over silicon devices, according to MarketResearch.com.


450mm semiconductor metrology tool to integrate IDE active vibration isolation

Fri, 6 Jun 2012

The IDE Group developed the STC series of Active Vibration Isolation Systems supporting OEMs in the production of 450mm wafer equipment.


Maxim plans major upgrades to US semiconductor fabs

Fri, 6 Jun 2012

Maxim is spending $200 million to upgrade and expand its US semiconductor manufacturing facilities in San Antonio and Dallas, TX; Beaverton, OR; and San Jose, CA. Maxim manufactures about 50% of its products in the US.


ALD partnership enables surface functionalization of powders

Fri, 6 Jun 2012

Cambridge NanoTech entered a licensing agreement with Ghent University in Belgium to commercialize an ALD particle coating technology that uses thermal and plasma processes.


JEDEC updates Flash memory standard for tablet/smartphone reqs

Fri, 6 Jun 2012

Microelectronics industry standards developer JEDEC Solid State Technology Association published key updates to its Universal Flash Storage (UFS) standard, specifically tailored for mobile applications and computing systems requiring high performance and low power consumption.


Productivity challenges identified during ISMI Manufacturing Week

Thu, 6 Jun 2012

Semiconductor manufacturers identified key factory productivity challenges that need to be addressed and shared effective solutions they will need to stay leading-edge and competitive amid turbulent industry transitions during the recent ISMI Manufacturing Week.


Applied Materials targets 3D memory with new Avatar dielectric etch system

Thu, 6 Jun 2012

Applied Materials introduced a new dielectric etch system called the Centura Avatar, which can etch holes and trenches in complex film stacks with depth to width aspect ratios of up to 80:1. It is designed to meet new requirements in creating 3D memory architectures.


ISSI aims to add NOR flash memory to portfolio with Chingis acquisition

Thu, 7 Jul 2012

Integrated Silicon Solution, Inc. (Nasdaq:ISSI) plans to acquire all the outstanding shares of Chingis Technology Corporation pursuant to a cash tender offer valued at $33 million.


IBM adjusts 2012 expectations up with Q2 results

Thu, 7 Jul 2012

IBM is raising its full-year operating earnings per share expectations to “at least $15.10,” said Ginni Rometty, IBM president and CEO, citing H1 performance and IBM’s ability to deliver “greater value to a wider range of clients” for the $0.10 increase.


Semiconductor IP myths and revenue growth

Thu, 7 Jul 2012

With 18.9% revenue growth, third-party semiconductor intellectual property (SIPs) seem to have had a good year in 2011. However, Semico reports, several very interesting trends in the SIP and broader SoC markets are hidden under the top-level numbers.


Intel’s Q2 2012 results are solid, Q3 guidance lowered

Wed, 7 Jul 2012

Intel reported Q2 revenue of $13.5 billion, operating income of $3.8 billion, net income of $2.8 billion and EPS of $0.54. The company lowered its Q3 guidance, citing “a more challenging macroeconomic environment.”


Major semiconductor players increase capex in 2012, total capex falls 3%

Wed, 7 Jul 2012

IC Insights’ latest survey and ranking of the major semiconductor capital spenders shows that only 6 of the 35 major semiconductor suppliers -- Intel, Samsung, Hynix, TSMC, UMC, and Rohm -- with significant capital expenditure budgets are expected to spend more in 2012 than they did in 2011.


C-SAM acoustic micro imaging system meets budget-conscious lab inspection needs

Tue, 7 Jul 2012

Sonoscan unveiled its Lab Model 9600 C-SAM acoustic micro imaging system to serve laboratory/failure analysis applications and for use in low-volume semiconductor production inspection.


Microchip Technology orders diffusion tools for microcontroller fab from BSE Tech

Tue, 7 Jul 2012

BSE Tech, a BSE Group company, sold diffusion equipment for front-end semiconductor production to Microchip Technology Inc. The equipment will be used in the production of PIC microcontrollers in Microchip’s Tempe, AZ, fab.


SEMICON West takeaways: Seasonality over cyclicality, lithography and test trends

Mon, 7 Jul 2012

SEMICON West kicked off with a surprise announcement regarding Intel's investment in ASML, but generally the event highlighted trends “as expected” in the fab supply chain, say Barclays analysts.


Cymer reports chipmakers’ adoption of lithography light source support products

Mon, 7 Jul 2012

Cymer is seeing adoption of its focus drilling technology for ArF immersion light sources and SmartPulse data management tool for light source performance monitoring, both introduced in 2011.


Samsung president Woo to keynote 2013 International CES

Mon, 7 Jul 2012

Dr. Stephen Woo, president of Samsung Electronics’ Device Solutions will keynote the 2013 International CES, January 8-11 in Las Vegas, NV, hosted by the CEA.


Terry Brewer chats about SEMI and semiconductors at SEMICON West

Fri, 7 Jul 2012

Terry Brewer, one of the newest members of SEMI's North American advisory board, talks about semiconductor industry consolidation, as well as new technologies and materials in the industry. He shares how SEMI is reacting to this evolution.


NOR Flash makers balance cellphone slowdown with new design wins

Fri, 7 Jul 2012

NOR flash memory sales growth may be tapering off in mobile handsets/smartphones, but embedded applications in the tablet, automotive, and industrial markets are picking up the slack, says IHS.


Bruker metrology suite debuts for 450mm semiconductor fab

Fri, 7 Jul 2012

Bruker introduced three 450mm X-ray and AFM semiconductor metrology tools -- the InSight-450 3DAFM, the D8 FABLINE X-ray system, and the S8 FABLINE-T X-ray system -- during SEMICON West.


2012 ITRS stabilized for front-end, but changes loom for 2013

Fri, 7 Jul 2012

The overriding message for 2012 is that the roadmap has been largely stabilized with the significant changes that were input last year in the 2012 publication,” said Intel’s Alan Allan, speaking at Semicon West.


Newport introduces 450mm air bearing stages

Thu, 7 Jul 2012

Newport Corporation introduced a line of high-performance air bearing stages specifically designed for the 450mm semiconductor wafer initiative.


Microelectronics standards leaders honored by SEMI

Thu, 7 Jul 2012

At SEMICON West, SEMI honored six industry leaders for their outstanding accomplishments in developing standards for the microelectronics and related industries.


Fabless keynote: Xilinx on programmability @ SEMICON West

Thu, 7 Jul 2012

SEMICON West’s Day 2 keynote speaker represented a fabless company: Ivo Bolsens, PhD, SVP and CTO of Xilinx presented on how programmable chips and innovative packaging can advance semiconductors.


Interviews with CEA-Leti researchers at SEMICON West

Thu, 7 Jul 2012

CEA-Leti presented research updates alongside SEMICON West this week. After the talks on device architecture, 3D and 2.5 packaging interconnects, large-scale computing and power consumption, and more, CEA-Leti’s researchers joined Solid State Technology to talk about their fields of interest.


Q3 semiconductor tool capex pull-back: Seasonal, expect Q4 uptick

Thu, 7 Jul 2012

Barclays Capital is seeing various reasons for a Q3 2012 semiconductor fab order/shipment pull-back, following meetings around SEMICON West 2012. The analysts expect strong orders in Q4.


Picosecond laser enables new high-tech devices

Thu, 7 Jul 2012

Industrially proven and robust, picosecond lasers are proving their worth in cutting and patterning of delicate materials for a wide variety of industrial applications.


How to cope with semiconductor fab tool obsolescence: ConFab preview

Thu, 5 May 2012

Sanjay Rajguru, director of ISMI, will present “Tool Obsolescence and the Impact on 200mm Manufacturing” at The ConFab 2012’s final session, Maximizing the Longevity of Investments.


EUVL insertion timing, readiness and scaling

Thu, 5 May 2012

Dr. Vivek Bakshi blogs about trends he expect to see at the upcoming 2012 International Workshop on EUV Lithography, in Maui Hawaii. 


CNTs produced with >95% semiconducting content now available from SWeNT

Thu, 5 May 2012

SouthWest NanoTechnologies (SWeNT) released SG65i, a single-wall carbon nanotube product with >95% semiconducting concentration, before secondary processing to remove metallic SWCNT content.


Uppsala U installs second Picosun ALD tool for advanced materials research

Thu, 5 May 2012

Picosun Oy delivered a second PICOSUN ALD tool to Uppsala University’s Ångström Laboratory in Sweden for work on surface treatment of carbon nanostructures, transition metal and compound semiconductor thin film manufacturing, and ultrathin polymer layer deposition on various substrates.


Element Six opens synthetic diamond fab in Silicon Valley to serve US customers

Wed, 5 May 2012

Element Six, maker of synthetic diamond supermaterials, opened its first US manufacturing facility in Silicon Valley, housing production, technical, and customer service.


Metrology needs double as semiconductors move from 90nm to 32nm node

Tue, 5 May 2012

KLA-Tencor Corporation (NASDAQ:KLAC) measures a 70% increase in fab process steps from 90nm to 32nm semiconductor nodes. This doubles the critical inspection steps required, report Citi analysts.


Directed self-assembly lithography research yields contact holes on semiconductor wafer

Mon, 5 May 2012

Stanford University researchers, sponsored by Semiconductor Research Corporation (SRC), have created contact hole patterns for logic and memory semiconductors using a next-generation directed self-assembly (DSA) lithography process.


Spansion (CODE) unveils SLC NAND with extended roadmap for embedded designs

Fri, 5 May 2012

Flash memory chip maker Spansion Inc. (NYSE:CODE) debuted its first family of single-level cell (SLC) NAND products using 4Xnm floating-gate technology. Spansion plans to roll out 3X and 2Xnm node versions of the NAND chips in the near future, without obsoleting the more mature designs.


The ConFab: Chasing Price, Power and Performance

Tue, 6 Jun 2012

At The ConFab 2012, fabless companies and foundries have a common goal: reduce power, increase performance and reduce price (not necessarily in that order).


ConFab interview: Dai Nippon Printing's Naoya Hayashi

Tue, 6 Jun 2012

Naoya Hayashi, research fellow for electronic device operations at Dai Nippon Printing, speaks with Solid State Technology chief editor Pete Singer during The ConFab 2012. Hayashi presented “NGL Mask Readiness” in The ConFab’s session on technology trends.


The ConFab: Turning the technology knobs for system scaling

Tue, 6 Jun 2012

Chip scaling will go on for the foreseeable future, enabling new product with more compute power, more memory, faster on-chip communication. That was one of the conclusions put forth by imec’s An Steegen, speaking on technology trends at The ConFab 2012.


Semiconductor fabs use significantly less energy today, but work remains

Tue, 6 Jun 2012

Semiconductor manufacturing facilities dramatically decreased their normalized fab energy consumption from 1997 to 2011, shows ISMI's Worldwide Fab Energy Study.


ConFab interview: Semico's Jim Feldhan on solid-state drives and semiconductor trends

Tue, 6 Jun 2012

Jim Feldhan of Semico speaks with Solid State Technology editor-in-chief Pete Singer about expectations for the semiconductor industry and solid-state drives.


ConFab interview: Nvidia's John Chen on semiconductor industry success

Tue, 6 Jun 2012

John Chen of Nvidia gave the opening keynote address of The ConFab 2012, presenting the concept of a “virtual IDM” comprising fabless companies, semiconductor foundries, and packaging houses working seamlessly together. After his speech, Chen caught up with Pete Singer.


ConFab interview: VLSI Research's Dan Hutcheson on silicon cycles

Mon, 6 Jun 2012

Dan Hutcheson, VLSI Research Inc. spoke with Solid State Technology editor-in-chief Pete Singer at The ConFab 2012. Hutcheson presented on the cyclical nature of the semiconductor industry.


@ The ConFab: How to prevail over silicon cycles

Mon, 6 Jun 2012

At The ConFab’s opening session, “The Economic Outlook for the Semiconductor Industry,” capex was a major point of interest. Jackie Sturm of Intel, Dan Hutcheson of VLSIresearch, and Jim Feldhan of Semico all touched on it, with Hutcheson expanding on the idea of capex trends to present an entire ecosystem of semiconductor business management.


@ The ConFab: Semiconductor industry experts look to the future

Mon, 6 Jun 2012

The ConFab’s sessions opened with “The Economic Outlook for the Semiconductor Industry,” featuring Jackie Sturm of Intel, Dan Hutcheson of VLSIresearch, and Jim Feldhan of Semico.


A virtual IDM concept can unite semiconductor foundries, fabless companies, and packaging houses

Mon, 6 Jun 2012

The ConFab 2012, Solid State Technology’s invitation-only meeting of the semiconductor industry, opened today in Las Vegas with a keynote address from John Chen, PhD, VP of technology and foundry operations at Nvidia Corporation.


Metrology method measures <50nm particles in semiconductor processes to eliminate contaminants down to 12nm

Tue, 6 Jun 2012

W. L. Gore & Associates and CT Associates developed a method for measuring <50nm particles in ultra-pure water (UPW) used in semiconductor processes, and removing particles as small as 12nm, through a combination of ultrafiltration and microfiltration.


Cymer demos 50W EUV lithography litho source

Mon, 6 Jun 2012

Cymer presented at Barclays Capital’s TMT Conference, providing information on semiconductor makers’ transition from deep ultra violet (DUV) to extreme ultraviolet (EUV) lithography, pre-pulse technology demonstrations, and more.


Argonne Labs to characterize diamond microelectronic material with AKHAN

Mon, 6 Jun 2012

AKHAN Technologies will collaborate with the Center for Nanoscale Materials at Argonne National Laboratory to fully characterize Miraj Diamond devices and materials, which are made by doping n-type diamond and can be used in the semiconductor industry.


Argonne Labs to characterize diamond microelectronic material with AKHAN

Mon, 6 Jun 2012

AKHAN Technologies will collaborate with the Center for Nanoscale Materials at Argonne National Laboratory to fully characterize Miraj Diamond devices and materials, which are made by doping n-type diamond and can be used in the semiconductor industry.


NXP develops GaN-on-Si for power semiconductors with Singapore’s A*STAR

Fri, 6 Jun 2012

A*STAR Institute of Microelectronics and NXP Semiconductors (NASDAQ:NXPI) will collaborate on 200mm GaN-on-Si process and technology development for high-voltage power devices.


ITF: Reconfigurable radios and scaled CMOS for a true mobile life

Fri, 5 May 2012

The next big thing according to Charlotte Soens, manager mm-wave communication program at imec, is that people will start using these mobile devices to watch high-quality photos and videos, stored in the cloud. Soens presented details at imec's International Technology Forum.


ITF: The technology knobs for system scaling

Fri, 5 May 2012

At imec's International Technology Forum, An Steegen, Senior Vice President Process Technology at imec, discusses the three technology knobs that are key for a further system scaling.


ITF: Life has changed

Fri, 5 May 2012

At imec's International Technology Forum, the research consortium's CEO, Lec van den Hove, draws attention to the need for the industry to solve the world's health problems.


Top suppliers of wafer processing equipment: VLSIresearch survey

Fri, 5 May 2012

THE BEST rankings from VLSIresearch identify the highest-rated suppliers of wafer processing, assembly, and test equipment. Check out the top-rated suppliers of wafer processing equipment, by company size and customer ranking.


ITF: The collaboration engine that drives our industry

Fri, 5 May 2012

At imec's International Technology Forum, SEMI's Denny McGuirck describes how Moore's Law has been the major driver in the semiconducotr industry.


Best semiconductor fab tool suppliers: VLSIresearch survey results

Fri, 5 May 2012

VLSIresearch polled semiconductor manufacturers about their tool suppliers, asking chipmakers to rank equipment providers on customer satisfaction. This year’s results show renewed focus on fab needs.


How emerging growth sectors impact the overall semiconductor industry: ConFab preview

Thu, 5 May 2012

Intel's Jackie Sturm will bring to light some of the emerging, growth markets for semiconductors, and what they mean for chipmakers and the fab suppliers in the first session of The ConFab, “The Economic Outlook for the Semiconductor Industry.”


Power management semiconductors grow after a rocky Q4 2011

Thu, 5 May 2012

The market for power management semiconductors grew for 7 quarters before declining grossly in Q4 2011, flattened in Q1 2012, and is now “on its way to discernible growth in Q2,” reports IHS.


SEMICON West Day 2: DSA lithography and CMP meetings

Thu, 7 Jul 2012

Blogger Michael A. Fury, Ph.D., Techcet Group, reports on Day 2 of SEMICON West with insights from the Sokudo Lithography Forum and NCCAVS CMPUG meeting, and -- sadly -- none on SEMICON West’s Happy Hour.


Why Micron’s Elpida buy is undeterred by unsecured bondholder action

Thu, 7 Jul 2012

A group of unsecured Elpida bondholders filed documents indicating an alternative proposal to Micron's acquisition of Elpida Memory’s assets. Barclays Capital believes the counter move is unlikely to have a material impact on the actual outcome. Here's why.


Pall joins SEMATECH’s ISMI to address semiconductor fab contamination control

Wed, 7 Jul 2012

Pall Corporation, filtration, separation and purification technology provider, joined the International SEMATECH Manufacturing Initiative (ISMI) program on equipment productivity and factory automation projects to address equipment stability and sustainability challenges as well as next-generation processing issues.


Rudolph launches noncontact metal film metrology for FPD panels

Wed, 7 Jul 2012

Rudolph Technologies launched the MetaPULSE FP thin film metrology system with an initial sale to a major manufacturer of flat panel displays (FPD) for handheld mobile devices.


Jordan Valley Semiconductor's 450mm defect detection tool wins Best of West

Wed, 7 Jul 2012

Solid State Technology and SEMI announced the Best of West Award winner -- Jordan Valley Semiconductor -- during SEMICON West today. Jordan Valley Semiconductor’s QC-TT defect inspection system predicts breakage in 450mm wafers, which are subject to more handling steps and more thermal stresses due to their larger size.


IBM partners with ATMI to address 14nm semiconductor process challenges

Wed, 7 Jul 2012

ATMI Inc. (NASDAQ-GS:ATMI) entered into a joint development agreement with IBM to address critical wet process challenges at the14nm semiconductor node and smaller.


Chat with Intel’s Shekhar Borkar @ SEMICON West 2012: Overpowering power consumption

Wed, 7 Jul 2012

In this video interview, Intel's Shekhar Borkar shares some key topics from SEMICON West keynote: Near-threshold voltage transistor designs, 3D integration for DRAM, unconventional interconnect, and more.


SEMICON West Day 1: Focus on EUV lithography and 450mm

Wed, 7 Jul 2012

Barclays Capital analysts share observations from meetings with semiconductor manufacturing tool suppliers at SEMICON West, noting the enthusiasm and concrete deals around EUV lithography and transitioning to the 450mm wafer size.


ASM debuts 300mm epitaxy and PEALD/PECVD tools for HV transistor fab

Wed, 7 Jul 2012

ASM International (ASMI) launched advanced deposition systems for epitaxy, PEALD and PECVD. The 2 tools enable high-volume 300mm wafer processing for 20nm and smaller nodes and 3D transistors.


Semicon West Day 1: FDSOI and TSV R&D with CEA-Leti

Wed, 7 Jul 2012

Michael A. Fury, Ph.D., reports on the opening day of SEMICON West (July 10), covering exaflop computing, FDSOI, TSV and other integration schemes, and silicon photonics with CEA-Leti.


Imec at SEMICON West: Interview with Luc Van den hove

Tue, 7 Jul 2012

Luc Van den hove, president and CEO, imec, spoke with Solid State Technology, covering imec’s major announcements and research presentations to take place during SEMICON West 2012.


ATMI aims for safer, cleaner liquid containment during semiconductor and related fab

Tue, 7 Jul 2012

ATMI introduced BrightPak, its next-generation liquid containment and delivery system for high-value liquid material transfers during advanced photolithography processes in semiconductor, FPD, and LED manufacturing.


Semiconductor equipment spending to contract 2.6% in 2012, grow in 2013

Tue, 7 Jul 2012

Semiconductor equipment sales will reach $42.4 billion in 2012, according to the mid-year edition of the SEMI Capital Equipment Forecast, released at SEMICON West 2012.


Semicon West 2012 opens with semiconductor revenue forecasts, high-level perspectives

Tue, 7 Jul 2012

Michael A. Fury, Ph.D., reports from the pre-opening day (July 9) of SEMICON West at the Moscone Center in San Francisco, CA. The first day hosts SEMI’s press conference on semiconductor revenues and the SEMI/Gartner Market Symposium.


SMART Storage Systems plans SSD R&D facility in CO

Tue, 7 Jul 2012

SMART Storage Systems, solid-state drive (SSD) technology developer, will open an R&D facility in Longmont, CO, to support hardware and software innovation for SSD products and company growth.


Intel takes 15% stake in ASML, part of EUV, 450mm development push

Tue, 7 Jul 2012

ASML established a program to enable its largest customers to make minority equity investments in the semiconductor manufacturing tool maker. The program includes commitments to fund ASML's R&D spending, accelerating development of EUVL and 450mm technology for 2015-2020 timeframe.


SEMI Board of Directors election brings new and familiar faces

Tue, 7 Jul 2012

SEMI’s annual Board of Directors election results are in, with new directors Jifan Gao, Trina Solar; Nobu Koshiba, JSR Corp.; Sue Lin, Hermes-Epitek; and Natsunosuke Yago, Ebara Corp., joining.


imec chat: Inside a new 450mm cleanroom investment

Mon, 7 Jul 2012

imec will build a 450mm wafer fab cleanroom at the research organization’s site in Belgium, with a new EUR100 million Belgian investment. We caught up with Luc Van den hove of imec to discuss the implications for semiconductor manufacturing at 450mm, how to build a 450mm-capable cleanroom, and more.


More SEMICON West exhibit previews

Sun, 7 Jul 2012

Following are some of the new and flagship products that will appear this week at SEMICON West, July 10-12 in the Moscone Center of San Francisco, CA.


Micron’s Elpida acquisition: Analysts weigh in

Sat, 7 Jul 2012

With Micron Technology Inc. (Nasdaq:MU) acquiring bankrupt DRAM maker Elpida Memory Inc.’s assets for 200 billion Yen (approximately US$2.5 billion), several analysts are looking at the move and how it affects the DRAM manufacturing landscape, as well as the Flash memory sector.


Gigaphoton intros ArF excimer laser improvement tools

Mon, 7 Jul 2012

Gigaphoton Inc. will uncrate “s” series hardware and software products in Q3 2012, enhancing lithography exposure performance and reducing operating costs and downtime of the GT6xA ArF excimer laser series for multi-pattern immersion lithography scanners.


Top conference reports from H1 2012

Fri, 7 Jul 2012

We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco.


USHIO UV irradiance meter offers thin form factor for optical film process control

Mon, 7 Jul 2012

Ushio launched its thinnest UV irradiance meter 'UIT-q365." The meter is 4.9mm thick, used to keep major UV processes within spec. It can be used during optical film manufacturing for flexible electronics, as well as during adhesion of precision optical parts.


SlurryScope CMP metrology tool qualified at major semiconductor fabs

Fri, 7 Jul 2012

Vantage Technology formally qualified its SlurryScope System for analysis of undiluted slurry used during CMP at major IC production fabs.


Renesas outlines recovery plan with front-/back-end fab, worker reductions

Fri, 7 Jul 2012

Semiconductor maker Renesas Electronics Corporation (TSE: 6723) will reorganize, in “urgent need of business recovery,” reforming semiconductor fabs in Japan and “streamlining employees.”


Semico reins in semiconductor growth forecast

Thu, 7 Jul 2012

Semico Research has just updated its 2012 semiconductor industry forecast. Semico’s semiconductor growth forecast has stayed between 8 and 10% over about a year. The latest update holds Semico’s forecast at the bottom of that range: 8.6%.


Gigaphoton EUV lithography conversion efficiency tops semiconductor fab sector target

Thu, 7 Jul 2012

Gigaphoton Inc. reached a maximum of 5.2% EUV coversion efficiency (CE), beating the semiconductor manufacturing industry’s target of 5.0% for a first-generation EUV lithography scanner. These data show an average of 4.7% CE.


NAND Flash sees weak Q1 2012; no one told Toshiba

Wed, 6 Jun 2012

Toshiba Corp achieved double-digit growth that defied an industry-wide contraction in revenue in the Q1 2012 NAND Flash sector. Overall, Q1 NAND flash sales amounted to $4.99 billion, down 1% sequentially.


SK Hynix expands environmentally friendly fab gas implementation with Linde Group

Tue, 6 Jun 2012

Linde Gases, a division of The Linde Group, will deliver on-site fluorine (F2) for SK Hynix Inc., under a new long-term supply contract for multiple volume semiconductor production sites in Korea.


SPIE -JM3 Journal publishes special issue on EUV lithography sources

Mon, 6 Jun 2012

Dr. Vivek Bakshi blogs about an upcoming SPIE journal, the Journal of Micro/Nanolithography, MEMS, and MOEMS (JM3), which has a focus on EUV sources.


Process Watch: Skewing the defect pareto

Mon, 6 Jun 2012

In the second installment in a series called Process Watch, the author provides tips on how to make sure you’re reviewing the yield killing defects and not wasting time reviewing nuisance events. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions for chip manufacturing at the leading edge.


GLOBALFOUNDRIES to produce ST’s 28nm and 20nm FD-SOI

Mon, 6 Jun 2012

STMicroelectronics announced that GLOBALFOUNDRIES has agreed to manufacture devices for ST using ST’s proprietary Fully Depleted Silicon-on-Insulator (FD-SOI) technology in both the 28nm and 20nm nodes.


Freescale picks new CEO from Texas Instruments

Fri, 6 Jun 2012

Freescale Semiconductor (FSL) named Gregg A. Lowe president and CEO, replacing Rich Bayer. Lowe joins Freescale from Texas Instruments (TI, TXN), where he was SVP and manager of the Analog business.


Semiconductor makers increase inventories ahead of higher demand

Thu, 6 Jun 2012

Semiconductor stockpiles held by chip suppliers increased during Q1 2012, but the rise in inventory for a second straight quarter was driven by the anticipation of higher demand from customers, according to IHS.


ConFab interview: G450 Consortium's Tom Jefferson on 450mm timeline

Wed, 6 Jun 2012

Tom Jefferson, G450 Consortium, shares an update on 450mm wafers for semiconductor manufacturing. The consortium is adding staff and ramping its silicon supply, and getting ready for equipment selection.


ConFab interview: Bill Tobey on EUV lithography

Wed, 6 Jun 2012

Bill Tobey, president of ACT International Consulting, speaks about the evolution of extreme ultra violet (EUV) lithography at The ConFab 2012.


April semiconductor sales jump; SIA predicts modest but building growth

Wed, 6 Jun 2012

Worldwide sales of semiconductors hit $24.1 billion in April 2012, a 3.4% increase from March and the largest month-over-month growth for the industry since May 2010, reports the SIA.


AMAT debuts ion implant tool for high-yield 20nm semiconductor fab

Wed, 6 Jun 2012

Applied Materials introduced the Applied Varian VIISta Trident single-wafer, high-current ion implant system, which embeds dopant atoms on 20nm semiconductor wafers at high yields.


ConFab interview: ISMI’s Bill Ross on managing legacy fabs and supply obsolescence

Wed, 6 Jun 2012

Bill Ross, ISMI, is moderating a session today at The ConFab 2012 on managing legacy semiconductor fabs and dealing with tool and materials obsolescence at 200mm and smaller. He speaks with Pete Singer about coping with these changes.


TI could struggle with semiconductor fab overcapacity til 2013

Fri, 7 Jul 2012

Texas Instruments Incorporated (TI, NASDAQ:TXN) announced Q2 2012 revenue of $3.34 billion, and expects Q3 to be about flat. Fab under-absorption charges will weigh on TI in Q3 and into Q4, analysts point out.


Printed electronics researchers in Europe install Optomec jet deposition tools

Fri, 7 Jul 2012

Optomec’s Aerosol Jet deposition tools are being used for printed sensor, display, solar cell, CMOS and passive devices, and other development areas, with new installations at CEA Liten (France), Innovation Lab (Germany) and the University of Sheffield (UK).


TI tops industrial electronics rankings, growing market share with NatSemi

Thu, 7 Jul 2012

Texas Instruments Inc. (TI) leads the fast-growing industrial electronics semiconductor market, growing its market share in 2011 in large part due to its acquisition of National Semiconductor, according to IHS.


Apple dominates semiconductor purchasing landscape

Thu, 7 Jul 2012

Apple Inc. is not only the world’s leading original equipment manufacturer (OEM) in terms of semiconductor purchasing, its also is increasing semiconductor buying at a faster rate than other top firms, reports IHS.


Analog IC manufacturing moves to 300mm; new growth applications arise

Thu, 7 Jul 2012

While communications make up the bulk of analog IC sales, growth is coming from automotive, energy, mobility, and medical/healthcare apps, according to Semico. This semiconductor sector is also moving to 300mm wafer production at smaller device nodes, which offers cost advantages.


AIXTRON debuts GaN-on-Si MOCVD reactor technology

Thu, 7 Jul 2012

AIXTRON SE introduced a 5 x 200mm gallium nitride on silicon (GaN-on-Si) reactor design for its G5 Planetary Reactor MOCVD platform. AIX G5+ comprises special reactor hardware and process design, developed with customers in AIXTRON’s R&D lab.


GLOBALFOUNDRIES green-lights Fab 8 expansion

Wed, 7 Jul 2012

GLOBALFOUNDRIES will add 90,000 more square feet of semiconductor manufacturing space to Module 1 of Fab 8 in NY. The completed semiconductor manufacturing area will total 300,000sq.ft.


Micron must avoid integration pitfalls now that Elpida deal is done

Wed, 7 Jul 2012

Micron is more than doubling its DRAM manufacturing capacity by buying bankrupt Elpida Memory’s assets. But the move is “not without risk,” according to IHS.


Semiconductor foundry installs Mattson etch tool

Wed, 7 Jul 2012

Mattson Technology installed its paradigmE etch system at a major foundry, expanding the tool's customer base.


Toshiba cuts NAND Flash memory fab by 30%

Tue, 7 Jul 2012

One year after ramping Fab 5 at the site, Toshiba will reduce its NAND Flash memory semiconductor production at its Yokkaichi Operation fab in Mie Prefecture, Japan.


Majority of semiconductor manufacturing suppliers experience IP challenges

Tue, 7 Jul 2012

SEMI recently conducted a survey of semiconductor fab equipment and materials suppliers, finding that 60+% of respondents say that IP challenges have had an adverse impact on their companies.


SiC manufacturing: Patents don’t equal revenue/market share, and watch for challengers to PVT growth

Tue, 7 Jul 2012

SiC is a niche material for semiconductor, power electronics, and LED manufacturing. Yole analyzed patents related to SiC growth and wafer manufacturing to glean trends in production, R&D, top companies, barriers to entry, and more.


Semiconductor content in vehicles on the rise

Tue, 7 Jul 2012

The automotive IC market will grow 8% this year, to $19.6 billion, reports IC Insights. Semiconductor content per vehicle is increasing to $380 in 2012, up 9% from 2011. And the growth will continue in the near future.


Qualcomm’s semiconductor biz dips, promises rebound on 28nm ramp

Mon, 7 Jul 2012

Qualcomm (QCOM) announced results for Q3 of fiscal 2012. Qualcomm reduced its outlook for semiconductor volumes in fiscal Q4. CEO and chairman Dr. Jacobs pointed out that QCOM is ramping 28nm chip supply, aiming for a strong December quarter.


Can imec bring semiconductor economies of scale to genetic analysis technology?

Mon, 7 Jul 2012

Pacific Biosciences of California will join imec in a multi-year research collaboration focused on the development of advanced microchips for highly multiplexed single-molecule genetic analysis. Pacific Biosciences brings its proprietary zero-mode waveguide technology; imec is contributing expertise in nanophotonics, CMOS sensors, technology integration and fabrication.


Real-time monitoring slashes water and energy usage in semiconductor manufacturing on 300mm and 450mm wafers

Mon, 7 Jul 2012

SRC-sponsored researchers developed new sensor-based metrology technology that can significantly reduce water and related energy usage during semiconductor manufacturing.


Secondary semiconductor equipment: Turnkey services offer a fab-centric approach

Mon, 7 Jul 2012

RED Equipment’s Carl McMahon suggests a different model for handling secondary semiconductor equipment for greater efficiency, cost reduction and quality control: full turnkey services engineered to the fab’s needs without the expense of customization.


Printed electronics standards initiative starts with substrate materials

Fri, 7 Jul 2012

IPC and JPCA released their first operational-level standard for the printed electronics industry, defining terms and establishes basic requirements for substrate materials used in printed electronics: ceramic, organic, metal, glass and other.


North American semiconductor fab tool book-to-bill drops below parity in June

Fri, 7 Jul 2012

"Following seven months of increases, the three-month average bookings declined in June and likely reflects some slowing in investment plans attributed to weaknesses in the broader economy," said Denny McGuirk, SEMI.  "While order activity may slow, equipment spending this year will continue to be directed towards advanced technologies in wafer processing and packaging assembly."


AMD reports lagging demand for desktop processors late in Q2

Fri, 7 Jul 2012

AMD reported a “challenging” end to Q2, with president and CEO Rory Read citing "overall weakness in the global economy, softer consumer spending and lower channel demand for [AMD] desktop processors in China and Europe.”


MIT team models electronic behavior of OLEDs and other organic electronics

Fri, 6 Jun 2012

A multidisciplinary research team at MIT and the Universidad Autónoma de Madrid developed a new mathematical approach to simulating the electronic behavior of noncrystalline materials, with applications in OLEDs, flexible printable organic electronic circuits, and solar cells.


Rudolph buys NanoPhotonics to bolster advanced packaging inspection offering

Thu, 6 Jun 2012

Rudolph Technologies Inc. (NASDAQ:RTEC) acquired the assets of NanoPhotonics GmbH, adding inspection technology and an intellectual property (IP) portfolio to serve its advanced package inspection tool customers.


STT-MRAM scale up boosts magnetic metrology orders at MicroSense

Thu, 6 Jun 2012

MicroSense reports an increase in orders for its MRAM magnetic metrology systems. The metrology tools characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM.


Asian semiconductor foundry orders Ultratech laser spike anneal system

Thu, 6 Jun 2012

Ultratech Inc. (UTEK) shipped its 50th laser spike anneal (LSA) system, with an order from a major Asian foundry.


Chipmakers and equipment OEMs adopt Qcept NVD inspection services

Wed, 6 Jun 2012

Qcept Technologies Inc. has received more than 30 orders from 8 customers for its new ChemetriQ Inspection Services (Q-Services), which enable semiconductor manufacturers and equipment vendors to begin implementing non-visual defect (NVD) inspection programs tailored to their needs prior to purchasing a Qcept ChemetriQ NVD inspection system.


Conference Report: TechConnect 2012, Day 1

Wed, 6 Jun 2012

The 2012 TechConnect World Summit, Expo & Showcase opened Tuesday, June 19, 2012 at the Santa Clara Convention Center. The event serves as host to the National Innovation Showcase, whose mission is to accelerate the commercialization of “the world’s top innovations.”


June 27th webcast on 3D integration

Wed, 6 Jun 2012

In a webcast scheduled for June 27th at 1:00 Eastern, 11:00 Pacific, David McCann of GLOBALFOUNDRIES will provide a status report on advanced packaging and 3D integration. McCann is responsible for Packaging R&D and back-end strategy and implementation at GLOBALFOUNDRIES.


AMAT’s Varian integration continues with Dickerson named president

Wed, 6 Jun 2012

In mid-2011, semiconductor manufacturing and assembly equipment supplier Applied Materials (NASDAQ:AMAT) acquired Varian Semiconductor Equipment Associates Inc. Now, the company is adding Varian’s former CEO Gary Dickerson as president.


Mitutoyo debuts portable surface roughness tester

Wed, 6 Jun 2012

Mitutoyo America Corporation launched the Surftest SJ-411/412 portable surface roughness tester, conforming to roughness standards JIS-B0601-2001, JIS-B0601-1994, JIS-B0601-1982, VDA, ISO-1997 and ANSI.


Global DRAM recovery: Is DRAM becoming NAND-like?

Tue, 6 Jun 2012

Barclays Capital analysts say DRAM benefits from a supply discipline that was bolstered by oligopoly/DRAM consolidation and the Elpida bankruptcy; robust demand growth from non-PC applications (server/mobile DRAM bit demand to exceed PC for the first time in 2013E); and potential for additional positives related to Elpida (Hiroshima/Rexchip converted to non-DRAM).


SEMICON West 2012 exhibits preview: Wafer processing and handling

Mon, 6 Jun 2012

Some of the new and flagship wafer fab products and supporting facility products, like vacuum valves, that will be on the show floor at SEMICON West, from ion implant to MOCVD traps and gas blenders.


Samsung earmarks $1.94B for new 14/20nm semiconductor manufacturing line

Mon, 6 Jun 2012

The management committee of Samsung Electronics authorized the KRW2.25 trillion investment for construction of a new production line serving Samsung’s System LSI business.


Easier manual 450mm wafer carrier handling with H-Square Ergolift

Mon, 6 Jun 2012

H-Square Corp introduced its 450mm Ergolift for handling new 450mm semiconductor wafer FOSB/MACs, which can weigh more than 60lbs.


Canon DUV stepping scanner promises 60% higher lithography throughput

Fri, 6 Jun 2012

Canon U.S.A. Inc. introduced the FPA-6300ES6a DUV stepping scanner, a lithography tool with a KrF excimer laser light source for the high-volume production of memory, logic and image-processing devices.


Ultrabook storage architectures: Hybrid HDD vs cache SSD

Fri, 6 Jun 2012

Cache SSDs will remain the mainstream ultrabook storage solution, says IHS, even as hybrid HDDs offer some consolidated storage advantage. Hybrid HDDs use a built-in layer of NAND flash memory.


Panasonic re-ups imec research partnership on CMOS, flexible electronics, more

Thu, 6 Jun 2012

imec and Panasonic Inc. have entered into the next phase of a comprehensive and broadened collaboration agreement for joint R&D on healthcare, wireless communication, flexible electronics and advanced CMOS process technologies.


Legacy semiconductor fab issues @ The ConFab 2012

Wed, 6 Jun 2012

Older production facilities face equipment obsolescence; skills obsolescence; scarce availability of parts, software, and support; and equipment capability extension and tool re-use. At the ConFab 2012 Executive Roundtable, representatives from Sematech/ISMI, IDMs, OEMs, equipment dealers, and industry consultants gathered to have an open discussion on concerns, roadblocks, and possible solutions.


Metrology merger: MicroSense acquires SigmaTech

Wed, 6 Jun 2012

MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.


Semiconductor fab tool makers see sequential increase in Q1

Wed, 6 Jun 2012

Semiconductor manufacturing equipment billings and bookings were virtually tied in Q1 2012, reports SEMI, with $10.61 billion in billings and $10.07 in bookings. This is a 13-14% improvement sequentially, and 9% below the same quarter last year.


Using waste silicon to make Li-ion batteries

Fri, 9 Sep 2012

Researchers at Rice U. and the Université catholique de Louvain in Belgium have devised a method for converting discarded silicon into a key material for lithium-ion batteries.


iPhone 5: Which semiconductor suppliers are the big winners?

Fri, 9 Sep 2012

As the dust settles after the launch of the iPhone 5, analysts tally which suppliers in the semiconductor ecosphere are most likely to gain the most.


DAS tips system for safe, clean LED waste process gas disposal

Fri, 9 Sep 2012

DAS Environmental Expert says it has a new system that offers a more environmentally friendly way to clean waste process gases produced in LED manufacturing.


Dow launches CMP polishing pad platform

Fri, 9 Sep 2012

Dow Electronic Materials introduced its new IKONIC polishing pad platform for chemical mechanical planarization (CMP).


NIST tips "hybrid" metrology method to test chips

Thu, 9 Sep 2012

The National Institute of Standards and Technology (NIST) says it's combined scanning techniques and statistical data to both more precisely and less expensively measure features on a chip -- and two big chip firms are already on board.


Samsung breaks ground on Chinese NAND fab

Wed, 9 Sep 2012

Samsung Electronics Co., Ltd. has held a groundbreaking ceremony for a new leading-edge NAND memory fab line in Xi'an, China, to be fully on line by 2014 making "10nm-class" process technologies.


Samsung breaks ground for memory manufacturing in China

Wed, 9 Sep 2012

Samsung Electronics Co., Ltd., held a groundbreaking ceremony for a major new memory fabrication line in Xi'an, China. Once completed, the new facility will make use of advanced 10-19nm technology to produce NAND flash memory chips, according to the company.


Chip tool demand slumps in 2Q12, though Taiwan shines

Wed, 9 Sep 2012

Global demand for semiconductor manufacturing equipment slipped -4% in 2Q12 with softness in just about every region -- except Taiwan which stepped on the pedal during the quarter, according to updated data from SEMI and SEAJ.


GaAs nanowires on graphene focus of NTNU research

Wed, 9 Sep 2012

Researchers at the Norwegian University of Science and Technology in Trondheim (NTNU)  have patented and are commercializing GaAs nanowires grown on graphene.


Scotch tape induces high-temp superconductivity

Wed, 9 Sep 2012

A team led by University of Toronto physicists has developed a simple new technique using Scotch poster tape that has enabled them to induce high-temperature superconductivity in a semiconducto.


SRC honors professors from UC Berkeley and MIT

Wed, 9 Sep 2012

Semiconductor Research Corporation (SRC) recognized two outstanding professors in SRC-supported, chip-related research and education for 2012.


LED makers urge DoE for more support

Wed, 9 Sep 2012

Stakeholders in LED manufacturing have met with US Department of Energy officials to plead their case for increased support in solid-state lighting (SSL) R&D and manufacturing, asserting that the technology's energy conservation benefits and ROI surpasses those of renewable energy technologies that get much more backing.


Tablets, smartphones driving turnaround in power management chips

Tue, 9 Sep 2012

Demand for power management semiconductors recovered in 2Q12 after declining for half a year, thanks to strong demand from electronic products such as smartphones and media tablets, according to IHS iSuppli.


TSMC, UMC sales rise in August on customer pull-ins

Tue, 9 Sep 2012

Taiwan's two biggest semiconductor foundries saw sales jump in August, and business for the full third quarter is looking up as customers pull in some orders.


Nanya gets equity investment from ISSI, deepens ties across memory and analog

Mon, 9 Sep 2012

Taiwanese DRAM manufacturer Nanya Technology has received a $27M equity investment from a subsidiary of Integrated Silicon Solution to bolster the companies' foundry partnership.


UMC, ST to develop 65nm backside CMOS image sensors

Mon, 9 Sep 2012

Intel lowers 3Q outlook: What's the real driving factor?

Fri, 9 Sep 2012

Analysts weigh the reasons behind Intel's downwardly-revised 3Q12 results, from macroeconomic sluggishness to tablet-PC cannibalization -- and whether its pullback in 2012 capex plans spells trouble for the market overall.


Intel lowers 3Q outlook: What's the real driving factor?

Fri, 9 Sep 2012

Analysts weigh the reasons behind Intel's downwardly-revised 3Q12 results, from macroeconomic sluggishness to tablet-PC cannibalization -- and whether its pullback in 2012 capex plans spells trouble for the market overall.


Waiting for the next "golden year"

Fri, 9 Sep 2012

While various industry segments appear to be tapping the brakes, others are revving their engines, observes SEMI's Christian Gregor Dieseldorff -- and a 2012 stall could pave the way for a record-breaking 2013.


Hidden trends amid slowing GaAs epi substrate output

Thu, 9 Sep 2012

GaAs epitaxial substrate production rose just 3% in 2011 as handset power amplifiers offset a shift away from GaAs for handset switches, but inside that slowing slope are two key market drivers, according to Strategy Analytics.


Semiconductor R&D spending rising 10% in 2012 to meet design, process challenges

Thu, 9 Sep 2012

Spending on R&D by semiconductor companies worldwide is expected to grow 10% in 2012 to a record $53.4 billion, as companies all across the ecosystem try to keep up with more complex IC designs and new process technologies, according to data from IC Insights.


SemiLEDs replaces president, adds sales exec

Thu, 9 Sep 2012

Taiwan-based SemiLED says it has replaced two top execs, weeks after posting another quarter of weak financials and a patent litigation settlement that restricts its product sales in the US.


DisplaySearch: LCD industry poised for recovery in 2012

Wed, 9 Sep 2012

Despite the gloomy economy and softness in consumer LCD products, suppliers of thin-film transistor liquid crystal displays (TFT-LCD) expect moderate 8%-13% growth in sales and shipments in 2012, according to DisplaySearch.


SIA: July semiconductor sales inch up, unevenly

Wed, 9 Sep 2012

Global semiconductor sales totaled $24.34B in July, a scant 0.2% increase from the prior month and down -1.9% from a year ago, as macroeconomic challenges weigh down demand particularly in Europe and the Americas, according to the latest monthly data from the Semiconductor Industry Association (SIA).


Singapore IME, MOSIS to offer silicon photonics wafer prototyping service

Tue, 9 Sep 2012

Singapore's Institute of Microelectronics (IME) and MOSIS have signed a memorandum of understanding (MOU) to offer a multiple-project wafer service targeting silicon integrated photonics.


Technology alliance formed for glass and brittle materials processing

Fri, 8 Aug 2012

Three leaders in their respective fields have formed a technology alliance to bring a new glass cutting technology to market. InnoLas Systems GmbH licensed process technology developed by FiLaser LLC and will use ultra-short pulse lasers produced exclusively for InnoLas by LUMERA LASER GmbH.


IBM spintronics researchers map semiconductor’s persistent spin helix

Mon, 8 Aug 2012

Researchers from IBM and ETH Zurich revealed the first-ever direct mapping of the formation of a persistent spin helix in a semiconductor. This discovery answers the physics question as to whether electron spins possess the capability to preserve encoded information long enough before rotating.


Hong Kong X’tals takes share of oscillator manufacturer

Mon, 8 Aug 2012

Hong Kong X’tals Ltd, part of the Kolinker Group, has acquired a 40% shareholding in IQD FOQ GmbH, the specialist OCXO manufacturing division of IQD, for an undisclosed sum.


Flex, printed & organic electronics could save money in healthcare

Mon, 8 Aug 2012

Emerging technologies in printed, flexible, and organic electronics are poised to reduce costs in the $300 billion global medical device market as governments, insurers and patients seek to bring down healthcare costs, according to Lux Research.


AKM tops magnetic sensor rankings, but competition looms with 6-axis compasses

Fri, 8 Aug 2012

Propelled by strong sales to tablet and cellphone manufacturers, AKM led the semiconductor magnetic sensor market for the third year in a row in 2011. Of the top-10 magnetic sensor suppliers, Memsic saw the highest growth: 1340%.


Laser nanofabrication for mass production at the nanoscale

Fri, 8 Aug 2012

Laser nanofabrication can now meet the needs of submicron and nanoscale feature size manufacturing, and can operate in air, vacuum, or liquid processes. Sister publication Industrial Laser Solutions recently published Laser nanofabrication: A route toward next-generation mass production.


Supply chain readiness in an era of accelerated change

Fri, 8 Aug 2012

In this SEMI News and Views blog, Karen Savala covers EUV lithography, 450mm wafers, and 3D IC developments, based on her recent presentation at SEMICON West, “Supply Chain Readiness in an Era of Accelerated Change.”


Liam Madden, Xilinx VP, joins The ConFab advisory board

Thu, 8 Aug 2012

Liam Madden of Xilinx, Inc. has joined the advisory board of The ConFab, Solid State Technology and PennWell's event focused on the economics of semiconductor manufacturing.


Semiconductor segments ready for strong annual market growth

Thu, 8 Aug 2012

Following a lackluster period of average annual market growth in the semiconductor industry, a significant upturn is in store for the next five years, according to IC Insights.


Integrating power electronics design technologies

Thu, 8 Aug 2012

The field of power electronics, the application of electronics for the control and conversion of electric power, is underpinned by basic electrical principles that were established in the distant past by the pioneers of electrical science. But today, the need to supply, modify and control the voltage, current or frequency of electric power arises in a vast number of applications and products spanning a huge range in terms of power handling capability.


AIXTRON tool supports OTFT, OLED, other organic electronics manufacturing

Thu, 8 Aug 2012

AIXTRON launched the PRODOS-200 PVPD system for deposition of organic thin film materials, used to make OTFT displays and OLEDs, and in other manufacturing applications.


ARM and Cadence collaborate on SoC design solutions

Thu, 8 Aug 2012

ARM and Cadence announced the availability of the first in a series of combined solutions enabling designers to improve performance, power and time-to-market for ARM's processor-based system-on-chips (SoCs). 


Semico downgrades 2012 semiconductor industry forecast to 6-8%

Wed, 8 Aug 2012

Citing continued financial struggles in Europe, an inventory buildup at TSMC, and lower US GDP, Semico revised its 2012 semiconductor industry forecast from 8-10% to 6-8%.


Marvell drops out of top 5 smartphone applications processor rankings

Tue, 8 Aug 2012

Global smartphone applications processor revenues grew 55% Y/Y in Q1 2012, reaching $2.47 billion, according to Strategy Analytics. Qualcomm dominates in revenues and units sold, though it faces increasing competition.


Mobile DRAM on the rise with growth in tablets, smartphones, and ultrathin laptops

Tue, 8 Aug 2012

The biggest change in the DRAM industry in 2012 has been Micron’s acquisition of Elpida. One key asset for Micron is mobile DRAM, which is growing in adoption thanks to integration into smartphones and tablets.


Measuring inside an active OLED

Mon, 10 Oct 2012

Researchers at the National Institute of Advanced Industrial Science say they have devised a way to selectively and nondestructively evaluate molecules within a sealed organic light-emitting diode (OLED) in operation, in hopes to further understand and eventually minimize performance degradation.


From fuzzy to focused: Phase I in project development

Fri, 10 Oct 2012

Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.


Soitec, SEH extend Smart Cut licensing deal to "silicon-on-anything"

Thu, 10 Oct 2012

Soitec and Shin-Etsu Handotai (SEH) have extended their cooperation in Soitec's Smart Cut technology with an extended 10-year licensing agreement, including a new level of joint technology cooperation, to facilitate development and wafer supply of silicon-on-insulator (SOI) wafers.


Azzurro, Epistar achieve GaN-on-Si on 150mm

Wed, 10 Oct 2012

Azzurro and Epistar say they have achieved GaN-on-Si based high-brightness LEDs on 150mm GaN-on-Si substrates, billed as "one step further towards implementation in mass production."


Devan Iyer, director of TI's semiconductor packaging operations, joins The ConFab advisory board

Tue, 10 Oct 2012

Devan Iyer, director of Semiconductor Packaging in Texas Instrument’s Manufacturing Group, has joined the advisory board of The ConFab.


EUV Symposium takeaways: Slow and steady progress, much improvement expected in early 2013

Tue, 10 Oct 2012

EUV Symposium host imec and a pair of industry analysts gauge the pace of improvements in EUV lithography and its long march toward production readiness.


Semiconductors and healthcare converging

Mon, 10 Oct 2012

At the recent imec International Technology Forum Press Gathering in Leuven, Belgium, imec CEO Luc Van den hove outlined uses in blood cell sorting, mobile apps for personalized medicine (such as brain monitoring of EEG activity), and advanced bio research.


EEG headset prototype developed

Mon, 10 Oct 2012

Imec, Holst Centre and Panasonic have developed a new prototype of a wireless EEG (electroencephalogram) headset.


Europe to unite research efforts in Silicon Europe cluster alliance

Mon, 10 Oct 2012

Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”


imec to begin 450mm cleanroom construction in 2013

Sun, 10 Oct 2012

Imec, the research consortium in Leuven, Belgium, plans to start construction of a 450mm pilot line next year, with early production focused on sub-10nm devices starting at the end of 2016. 


Solvay unveils high-performance polyester material for LED TV components

Mon, 10 Oct 2012

Solvay Specialty Polymers USA LLC has extended its line of high-performance polyester compounds with a new version targeting light-emitting diode (LED) TVs with higher heat and light stability.


Q2 semiconductor revenue may be “troubling” indicator of market health

Thu, 8 Aug 2012

Global semiconductor market revenue in Q2 2012 fell by 3% Y/Y to $75.2 billion, and grew sequentially <3%, resulting in widespread revenue declines for chip suppliers, particularly those headquartered in Japan and Europe, according to IHS.


UC Berkeley, PARC, Thinfilm Electronics pursue printed sensors with FlexTech Alliance grant

Wed, 8 Aug 2012

GaAs faces slowing demand from 2011 on

Wed, 8 Aug 2012

H2 2011 saw slow growth for gallium arsenide (GaAs) substrates in semiconductor and related devices, as well as a shift away from GaAs as a handset switch technology. However, the March 2011 earthquake and tsunami in Japan disrupted the supply chain, driving up substrate pricing and overall revenue to nearly $230 million.


New tool performs metal dicing, scribing for LED manufacturing

Thu, 8 Aug 2012

JP Sercel Associates' new IX-6100-MD can scribe and dice a variety of metal layers and alloys used in LED manufacturing.


UMC to close semiconductor foundry in Japan, dissolve subsidiary

Wed, 8 Aug 2012

Semiconductor foundry United Microelectronics Corporation (NYSE:UMC; TWSE:2303) will close its fab operation in Japan through the dissolution and liquidation of its wholly-owned subsidiary, UMC Japan.


Dynamic changes impacting advanced electronic materials industry

Wed, 8 Aug 2012

Learn about the changes in semiconductor manufacturing as well as related markets -- photovoltaics, displays, LEDs, etc -- at the 2012 Strategic Materials Conference (SMC), to be held on October 23-24 in San Jose, CA. SEMI reports.


Present on semiconductor metrology and more at ASMC 2013

Wed, 8 Aug 2012

ASMC 2013, the leading international technical conference for exploring solutions to improve collective microelectronics manufacturing expertise, has issued a call for papers.


FEI, Hitachi High-Tech settle focused ion beam patent dispute

Tue, 8 Aug 2012

FEI will pay $15M to settle the dispute over focused ion beam systems, in exchange for dropping litigation and cross-licensing FIB technologies.


Aixtron ships Prodos polymer PVD tool to Asian flexible electronics maker

Tue, 8 Aug 2012

An unnamed "major Asian customer" will use Aixtron's Prodos polymer PVD tool to deposit organic polymer thin films for production of flexible electronic devices.


IEEE recognizes impact of floating gate EEPROM for Flash memory

Tue, 8 Aug 2012

IEEE has awarded a prestigious IEEE Milestone in Electrical Engineering and Computing award for the floating gate electrically erasable programmable read only memory (EEPROM), a significant technological innovation that enabled data storage in Flash memory.


Reports: Will Micron spend more on DRAM maker Elpida?

Tue, 8 Aug 2012

Several news reports say that Micron Technology Inc. (Nasdaq:MU) will pay an incremental Yen 80 billion above the previously agreed upon price for debt guarantees at Elpida. But interpretations are not all the same.


Top 12 semiconductor foundries of 2012

Tue, 8 Aug 2012

A ranking of the forecasted top 2012 12 IC foundries (pure-play and IDM) was released by IC Insights.


Samsung spending $4B to update Austin semiconductor factory

Tue, 8 Aug 2012

Samsung Austin Semiconductor LLC says it will spend "about $4 billion" to renovate and retrofit its existing facility for "full system LSI production," mainly to produce mobile SoCs on 300mm wafers using 28nm process technologies.


DoD mandates DNA-based component counterfeiting protection measures

Mon, 8 Aug 2012

Applied DNA Sciences, a provider of DNA-based anti-counterfeiting and security solutions, was named by the DoD Defense Logistics Agency as the provider of authentication services for microcircuits supplied by defense contractors.


Gartner identifies fast-moving technologies with Hype Cycle report

Fri, 8 Aug 2012

Big data, 3D printing, activity streams, Internet TV, Near Field Communication (NFC) payment, cloud computing and media tablets are some of the fastest-moving technologies identified in Gartner Inc.'s 2012 Hype Cycle for Emerging Technologies.


Augmented reality means augmented NAND, mobile DRAM demand

Fri, 8 Aug 2012

Augmented reality (AR) is a disruptive yet nascent technology. According to Semico, AR will increase demand for NAND and mobile DRAM memory, as well as other technologies.


H2 NAND pricing: iPhone 5, DRAM, and other influencing factors

Fri, 8 Aug 2012

Barclays Capital analyzed the underlying factors for current NAND prices, and where the NAND industry is expected to go in the near future. Factors include the Apple Inc. iPhone 5, reduced NAND production at key chipmakers, and changes to the DRAM sector, among other influences.


Fraunhofer develops new silicon photomultiplier

Thu, 8 Aug 2012

Scientists at Fraunhofer Research Institution for Modular Solid State Technologies EMFT, together with Ketek GmbH, have developed a novel, silicon-based optical sensor component called a silicon photomultiplier (SiPM).


Gas systems firms unite: Matheson takes majority stake in RASIRC

Thu, 8 Aug 2012

Matheson has acquired a majority stake in RASIRC, supplementing its gas purification and material businesses with RASIRC's water vapor systems.


GlobalFoundries hires Xilinx exec as marketing VP

Wed, 8 Aug 2012

Bruce Kleinman, former VP of platform marketing at Xilinx, will now lead GlobalFoundries' product marketing efforts


SRC to host TECHCON conference in September

Wed, 8 Aug 2012

Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, is poised to celebrate its 30th anniversary at its annual TECHCON conference Sept. 10-11.


Western tops Seagate in HDDs as Thai flood recovery completed

Wed, 8 Aug 2012

Western Digital and Seagate Technology enjoy record sales of hard-disk drives after Thai flood recovery efforts, and the rivalry heats up amid questions about PC demand.


FEI Launches Helios TEM sample prep platform

Tue, 8 Aug 2012

FEI announced two new Helios NanoLab systems, the 450HP and 1200HP DualBeam systems, which include new capability that meets the critical requirements for semiconductor process development at the 28nmdevice geometry node and below.


Brooks Automation updates vacuum monitoring equipment

Tue, 8 Aug 2012

Two extensions to Brooks Automation's vacuum quality monitoring (VQM) components make it easier to measure gases and conditions inside a vacuum chamber.


SEMI builds portal for 450mm info

Mon, 8 Aug 2012

SEMI's new "450 Central" information portal offers news and perspectives about the 450mm wafer-size transition.


ASML adds Samsung as third chipmaker investor, closes funding plan

Mon, 8 Aug 2012

Lithography leader ASML completes its Co-Investment Program, tallying €3.85 billion in equity funds and €1.38B to support R&D into EUV and 450mm.


IHS iSuppli downgrades chip market outlook on PC weakness

Mon, 8 Aug 2012

IHS iSuppli now predicts a decline in global semiconductor revenues in 2012, the first since 2009, due to a weakening economy that has eroded demand for PCs and related components.


TSMC joins <10nm lithography mask writer project

Fri, 8 Aug 2012

TSMC joined IMS’s multibeam mask writer development collaboration to develop an electron multi-beam mask writer for use in advanced mask lithography applications, joining founding members DNP, Intel, and Photronics.


Molybdenum disulfide has all the 2D potential of graphene, with a bandgap

Thu, 8 Aug 2012

MIT researchers are building various electronic components out of a 2D form of molybdenum disulfide (MoS2). This is the start of a “new realm” of research into 2D materials for electronic materials and devices, according to one researcher.


Semiconductor funding activity increases in July

Thu, 8 Aug 2012

The Global Semiconductor Alliance (GSA) released the global semiconductor funding, IPO, and M&A statistics for July 2012, noting a steep ramp from June, but small decline from July 2011.


Technology licensing company Rambus restructures, creates CTO role

Thu, 8 Aug 2012

Rambus Inc. (NASDAQ:RMBS), a technology licensing company, will undergo a restructuring and related cost saving measures to cut its expenses by$30-35 million annually.


IBM buys solid-state storage maker Texas Memory Systems

Thu, 8 Aug 2012

IBM (NYSE:IBM) will acquire Texas Memory Systems (TMS), a leading developer of high-performance flash memory semiconductors based in Houston, TX.


Locals lead semiconductor purchasing in Asia-Pacific

Thu, 8 Aug 2012

On a worldwide basis, Apple Inc. and other multinational OEMs may be the top semiconductor purchasers in 2012, but within the all-important Asia-Pacific region, locally based companies lead the pack when it comes to chip spending growth.


Microsemi adds director with medical optics experience

Wed, 8 Aug 2012

Microsemi (Nasdaq:MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, appointed James V. Mazzo to its board of directors.


AKHAN characterizes diamond semiconductor material with Argonne Labs

Wed, 8 Aug 2012

AKHAN Technologies is sharing characterization data relating to its Miraj Diamond materials, gleaned in collaborative work with the CNM at Argonne National Laboratory.


Apple’s iPhone 5: Implications for the semiconductor supply chain

Wed, 8 Aug 2012

Apple Inc. is expected to release the iPhone 5 this fall. FBR Capital Markets says the smartphone could be “one of the most important catalysts for the overall chip manufacturers and service providers, as well as competitors in the handset space.”


TSMC approves capex spending at board meeting

Wed, 8 Aug 2012

At a meeting of its Board, TSMC approved capital appropriations to expand and upgrade advanced technology capacity, and to construct a semiconductor fab building.


Printing methodologies for various electronic devices

Tue, 8 Aug 2012

Printing is emerging as a technology that can replace traditional photolithography processes for electronics manufacturing, reducing costly material use, very complex processes, and expensive equipment.


Researchers install AIXTRON MOCVD for GaN-on-Si power device R&D

Tue, 8 Aug 2012

National Central University (NCU) in Taiwan will use an AIXTRON MOCVD system to research GaN-on-Si power semiconductors.


SEMATECH reports EUV lithography mask defect and cleaning breakthroughs

Tue, 8 Aug 2012

SEMATECH researchers have deposited EUV multi-layers with as few as 8 defects per lithography mask, at 50nm sensitivity. The milestone shows that tool-generated defects during multi-layer deposition of mask blanks used for EUV lithography can be reduced enough to enable high-volume manufacturing.


ARM, GLOBALFOUNDRIES collaborate on 20nm and FinFET semiconductor technologies

Tue, 8 Aug 2012

GLOBALFOUNDRIES and ARM will jointly work to optimize SoC technology for ARM processor designs on GLOBALFOUNDRIES’ 20nm and FinFET process technologies, in a new multi-year agreement.


Bruker improves AFMs for semiconductor metrology with KPFM mode

Tue, 8 Aug 2012

Bruker released the PeakForce Kelvin Probe Force Microscopy mode for its AFMs. PeakForce KPFM improves quantitative surface potential data for semiconductor metrology and materials research.


Semiconductor silicon demand grew in Q2, expect flat 2012

Tue, 8 Aug 2012

Worldwide silicon wafer area shipments increased during Q2 2012, compared to Q1 and to Q2 2011, reports SEMI’s Silicon Manufacturers Group (SMG).


Tokyo Electron to acquire FSI International

Mon, 8 Aug 2012

Tokyo Electron Limited and FSI International entered into a definitive agreement under which TEL will acquire FSI for approximately $252.5 million.


GaN power chip startup Transphorm raises $35M, led by Japanese backers

Fri, 10 Oct 2012

GaN power device developer Transphorm Inc. has secured a $35M Series E financing round led by the Japanese government-backed Innovation Network Corporation of Japan (INCJ), and Nihon Inter electronic Company with whom it has signed a second-source manufacturing deal.


ON Semiconductor joins imec’s GaN-on-Si research program

Fri, 10 Oct 2012

ON Semiconductor has joined imec to collaborate on the development of next-generation GaN-on-Si power devices. ON Semiconductor is presently building a GaN processing line in its Oudenaarde facility in Belgium Oudenaarde, and it is expected to employ GaN-on-Si technology.


TV makers expanding low-brightness LED backlit models into entry-level market

Thu, 10 Oct 2012

Responding to consumer demand, TV suppliers are expanding their lineups of low-brightness LED backlight TVs with technology options that actually compete against each other more than traditional CCFL, according to DisplaySearch.


Applied Materials cutting 1300 jobs, reallocating funds to "key growth initiatives"

Thu, 10 Oct 2012

Applied Materials says it will reduce its work force by between 6% and 9% (900-1300 positions) amid a global realignment deemed necessary to achieve certain strategic objectives, freeing up to $190M annually "to fund key growth initiatives."


Analyst: Fab spending softness 2012 extending into 2013

Thu, 10 Oct 2012

Fab equipment spending continues to soften in 2012, and hopes for a reprieve in 2013 are waning, warns one analyst.


Japan's semiconductor industry: Fabs, equipment, and materials

Wed, 10 Oct 2012

Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy,  the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.


SIA: Chip sales essentially flat in August

Wed, 10 Oct 2012

Macroeconomic malaise continues to weigh down global semiconductor sales, although there's a possible ray of hope for a boost by year's end thanks to introduction of much-desired electronics devices (hello iPhone 5).


Intermolecular, GlobalFoundries, IBM stepping to 10nm node

Tue, 10 Oct 2012

Intermolecular says that it is working with both GlobalFoundries and IBM to speed development of manufacturing technologies down to the 10nm node, using its High Productivity Combinatorial (HPC) technology.


New method monitors, catalyzes semiconductor etch in real time

Tue, 10 Oct 2012

Researchers at the U. of Illinois have devised a method to monitor a semiconductor surface as it is etched, in real time, with nanometer precision.


Axcelis signs $30M fab tool management contract for chipmakers' US sites

Tue, 10 Oct 2012

Axcelis Technologies said it has signed a five-year $30M contract with "one of the world's leading semiconductor manufacturers" to support its implant, cleaning, and thermal processing equipment at multiple fabs in the US.


LED industry shifting production to 6-inch wafers

Tue, 10 Oct 2012

Driven by market demand, the semiconductor industry is progressing toward consensus on building-block standards for automating LED production on 6-in wafers, explains Paula Doe in an article for SST sister magazine LEDs Magazine.


ST pairs with Samsung for 32/28nm HKMG

Mon, 10 Oct 2012

STMicroelectronics says it is using Samsung Electronics' foundry services for 32nm/28nm high-k/metal gate (HKMG) process technology, and have taped out a dozen system-on-chip devices.


Tezzaron takes over SVTC's Austin fab amid layoff reports

Mon, 10 Oct 2012

Tezzaron Semiconductor is taking over SVTC Technologies' wafer fab in Austin, TX, amid reports that the semiconductor/MEMS development organization is cutting back activities in Austin and in California.


Laser spike anneal for photoresists outperforms hotplate bake

Mon, 10 Oct 2012

Researchers at Cornell have developed a new laser-based method for ultra-fast anneal of thin photoresist films. The research, sponsored by Semiconductor Research Corporation (SRC), has shown that the new anneal outperforms state-of-art hotplate bake for both 193nm and EUV lithography applications.


Why 2Q makes or breaks a "good" year for IC sales

Tue, 9 Sep 2012

In an analysis of quarterly IC market growth rates, IC Insights pulls up an unusual phenomenon: the performance during the second calendar quarter takes the spotlight in years of better growth, which is counter to historical norms.


Foundries, leading-edge nodes, and profits: Narrowing the field in a two-man race

Fri, 9 Sep 2012

Want another snapshot of who's leading the pack among pure-play foundries, and who's falling off the curve? Look more closely at &lt;45nm offerings, as framed by a recent analysis from IC Insights.


Everspin to unveil highest-density ST-MRAM

Thu, 9 Sep 2012

In an invited paper at the International Electron Devices Meeting, researchers from Everspin Technologies will describe how they built the largest functional ST-MRAM circuit ever built, a 64-Mb device with good electrical characteristics.


Better than FinFETs: Hybrid-Channel SOI

Thu, 9 Sep 2012

At the International Electron Devices Meeting (IEDM) in December, a team led by IBM will report on the world’s first high-performance hybrid-channel ETSOI CMOS device.The researchers built a ring oscillator circuit to benchmark performance that worked even better than FinFETs.


Why IC market growth will expand despite economic and technology challenges

Thu, 9 Sep 2012

Even with the persistent troubles in global economics and various technology hurdles in advanced semiconductor manufacturing, IC market growth will continue to improve -- and the key is a shift away from what's been driving the market dynamics, explains IC Insights.


China's IMR orders Aixtron system for carbon nanotube, graphene research

Thu, 9 Sep 2012

The Institute of Metal Research (IMR) at the Chinese Academy of Sciences has ordered a new Aixtron tool to support its research in carbon nanotubes and graphene technologies.


Semi-Gas uncrates gas mixture automation system

Thu, 9 Sep 2012

Semi-Gas Systems is now offering an automatic gas sampling system that eliminates operator touch time while certifying cylinders of blended gas mixtures.


Brooks Automation laying off 10% of workforce

Wed, 9 Sep 2012

The semiconductor equipment maker is battening down the hatches to reduce costs and improve profitability in the face of near-term macroeconomic conditions.


LFoundry to invest EUR 25 million in R&D

Wed, 9 Sep 2012

LFoundry says it will invest a total of €25 million in R&D and innovative projects over the next three years, thanks to " the materialization of several large-scale projects."


Process Watch: Taming the overlay beast

Tue, 9 Sep 2012

In the fourth installment in a series called Process Watch, the authors discuss overlay registration and new capabilities to align to buried layers. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.


imec advances electronics that flex and stretch

Tue, 9 Sep 2012

imec announced that it has integrated an ultra-thin, flexible chip with bendable and stretchable interconnects into a package that adapts dynamically to curving and bending surfaces.


IBM demos high-performance CMOS on flexible plastic substrates

Tue, 9 Sep 2012

At IEDM, IBM researchers will demonstrate high-performance state-of-the-art CMOS circuits —including SRAM memory and ring oscillators—on a flexible plastic substrate.


Tablet display shipments booming in 2012, big panel makers joining the fray

Mon, 9 Sep 2012

Shipments of tablets are booming, and that means demand for tablet displays is set to spike as well -- and some new panel makers are getting in on the action, reports IHS iSuppli.


IEDM unveils 2012 program highlights

Mon, 9 Sep 2012

The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.


IBM gets sneak-peek at a molecule's bonds

Mon, 9 Sep 2012

IBM researchers have peered further inside a molecule's structure to distinguish the individual bonds, pointing the way to building an understanding of how graphene devices could work.


NanoYield: new design for yield software released

Thu, 9 Sep 2012

ProPlus Design Solutions, Inc. unveiled NanoYield, yield prediction and optimization software for memory, logic, analog and digital circuit design.


EV Group sells first ZoneBOND tech for compound semi work

Wed, 9 Sep 2012

EV Group says it has received an order for its EVG850 temporary bonding/debonding systems from a leading maker of compound semiconductor-based components, what it says is the first use of its ZoneBOND technology in this area.


Sumitomo Chemical joins Holst Center for OLED materials research

Wed, 9 Sep 2012

Sumitomo Chemical has joined the Holst Center's shared research program on printed organic lighting and signage, to contribute to research into multilayer solution processes for high-efficiency organic light-emitting diodes (OLEDs).


TSMC's schedule for 450mm mass production -- and lithography is the key

Wed, 9 Sep 2012

During sessions at this month's SEMICON Taiwan, execs from TEL, Lam Research, Applied Materials and KLA-Tencor revealed the latest developments in 450mm technology.


GlobalFoundries tips 14nm FinFETs with 20nm underpinnings

Tue, 9 Sep 2012

GlobalFoundries announced it has developed a 14nm process technology built off its 20nm planar (LPM) process, which it says will offer improved battery life and higher performance vs. other 20nm 2D planar transistors.


EU partners complete three-year OLED materials program

Tue, 9 Sep 2012

NEMO, a three-year European project to research solution-processable materials for OLEDs, has concluded with newly developed materials that can be integrated into large-surface OLED components and are suited for printing processes.


TriQuint to boost GaN power amplifiers for DARPA

Mon, 9 Sep 2012

TriQuint Semiconductor says it has received a $2.7M contract from the Defense Advanced Research Projects Agency (DARPA) to triple the power handling performance of gallium nitride (GaN) circuits.


Sharp, Intel tieup rumored for ultrabook LCDs

Mon, 9 Sep 2012

Sharp Corp. reportedly is in discussions with Intel to use the Japanese firm's LCD panels in new ultrabook laptops, and could be seeking a more substantial partnership that would make the chipmaking giant its top stakeholder.


Chip demand still sliding, hopes for soft 3Q landing and recovery

Fri, 9 Sep 2012

Demand for chip tools fell again in August and is off by -30% from its peak in early summer, fulfilling fears that the second half of 2012 will be sluggish for chipmaking investments, according to the latest data from SEMI.


Hynix joins SEMATECH's EUV mask group

Fri, 9 Sep 2012

SK Hynix has joined SEMATCH's EUV Mask Infrastructure (EMI) partnership to help develop metrology tools for reviewing defects in advanced masks needed for extreme ultraviolet lithography (EUVL).


TSMC integrates Ge on Si in p-type FinFETs

Thu, 9 Sep 2012

At this year’s International Electron Devices Meeting (IEDM), foundry TSMC will describe a heterogeneous epitaxial growth process which for the first time enables Ge to be directly grown on Si.


Horizontal channels key to ultra-small 3D NAND

Thu, 9 Sep 2012

The first working 3D NAND flash memory at sub-40nm feature sizes will be described by Macronix researchers at this year’s International Electron Devices Meeting (IEDM).


Toshiba to showcase leading-edge semiconductor solutions for mobile devices at Mobile Asia Expo 2013

Mon, 6 Jun 2013

Toshiba Corporation today announced that it will showcase its leading-edge semiconductor solutions for mobile devices at Mobile Asia Expo 2013.


Deca Technologies appoints Chris Seams as CEO

Mon, 6 Jun 2013

Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced it has named semiconductor industry veteran Chris Seams its new CEO.


GaN microelectronics revenue forecast to reach $334M by 2017

Mon, 6 Jun 2013

While military applications continue to drive the GaN device market, commercial applications have emerged that will help fuel rapid market growth.


Beyond silicon: Transistors without semiconductors

Fri, 6 Jun 2013

For decades, electronic devices have been getting smaller, and smaller, and smaller. It's now possible—even routine—to place millions of transistors on a single silicon chip. But transistors based on semiconductors can only get so small.


Market participants back microelectronics development potential in Russia

Fri, 6 Jun 2013

Over 45 percent market participants forecast a positive market trend with their company turnover growth outpacing that of the industry as a whole.


Two-dimensional atomically-flat transistors show promise for next-generation green electronics

Fri, 6 Jun 2013

UC Santa Barbara researchers demonstrate first n-type field effect transistors on monolayer tungsten diselenide with record performance.


Technology visionary Edward Iacobucci passes away at 59

Fri, 6 Jun 2013

VirtualWorks Group co-founder and Chairman Edward E. Iacobucci passed away at his home this morning after a 16-month battle with pancreatic cancer.


North American semiconductor equipment industry posts May 2013 book-to-bill ratio

Fri, 6 Jun 2013

A book-to-bill of 1.08 means that $108 worth of orders were received for every $100 of product billed for the month.


EPIC publishes European photonics database

Wed, 4 Apr 2013

EPIC, the European Photonics Industry Consortium, has published a public database of more than 5000 company entries, an interactive map, and a report on the photonics ecosystem in Europe.


Global semiconductor manufacturing equipment spending to decline in 2013, says Gartner

Thu, 6 Jun 2013

Outlook for semiconductor equipment market improves, but remains soft in the short term.


SEMATECH to address critical supply chain challenges and more at SEMICON West 2013

Mon, 6 Jun 2013

Through a series of lectures and workshops, SEMATECH will address R&D challenges and closing key infrastructure technology gaps from July 8–12 at SEMICON West in San Francisco, CA.


Samsung now mass producing industry’s first PCI-Express solid state drive

Mon, 6 Jun 2013

Samsung announced today that it has begun mass producing the industry’s first PCI-Express (PCIe) solid state drive (SSD) for next-generation ultra-slim notebook PCs.


SEMATECH names William R. Rozich chairman of the board

Mon, 6 Jun 2013

Rozich, who previously was a member of the company’s board, succeeds Michael R. Polcari, who served as chairman since November 2009.


Shipments of NFC-enabled handsets grew 300 percent in 2012

Mon, 6 Jun 2013

Global sales of handsets featuring Near Field Communication (NFC) grew 300 percent in 2012 to reach 140 million units, according to a new research report by Berg Insight.


Tablet IC sales to rise 37% in 2013

Tue, 6 Jun 2013

New market update shows integrated circuit revenues for tablets hitting $27 billion in 2016.


SoC design cost analysis: Costs for higher complexity continue to rise

Wed, 6 Jun 2013

Everywhere we turn we hear speakers give presentations at conferences and industry events despairing how the rise in silicon design costs is hampering the semiconductor industries growth path.


Semiconductor inventory falls in Q1 as outlook for electronics demand rises

Thu, 6 Jun 2013

Total inventory held by semiconductor suppliers declined significantly in the first quarter as excess stockpiles created during the global economic malaise of 2012 were cleared away, done in anticipation of a resurgence in consumer demand for electronic products expected by the second half of 2013.


TowerJazz to service infrared markets

Wed, 6 Jun 2013

Markets predicted by Maxtech International to reach >$5B by 2015.


Researchers report quantum networking milestone

Wed, 6 Jun 2013

Using clouds of ultra-cold atoms and a pair of lasers operating at optical wavelengths, researchers have reached a quantum network milestone: entangling light with an optical atomic coherence composed of interacting atoms in two different states. The development could help pave the way for functional, multi-node quantum networks.


Market for hard drives in video surveillance to hit billion-dollar mark by 2017

Tue, 6 Jun 2013

Revenue for both internal and external HDDs in video-surveillance applications will rise from $638.7 million this year to $1.0 billion by 2017, a remarkable 57 percent increase.


Rockchip launches new tablet SoCs on GLOBALFOUNDRIES’ 28nm HKMG process technology

Tue, 6 Jun 2013

The combination of Rockchip’s design and GLOBALFOUNDRIES’ 28nm HKMG process technology resulted in a mainstream tablet System-on-Chip (SoC) capable of operating at up to 1.8 GHz performance, while still maintaining the power efficiency expected by mobile device users.


Imec presents 4K2K CMOS image sensor together with Panasonic

Tue, 6 Jun 2013

The co-developed imager sensor chip targets high speed, high resolution imaging applications such as next generation HDTV.


Multitest VP to discuss quality in 3D assembly at SEMICON West

Tue, 6 Jun 2013

Multitest’s James Quinn will present during the 2013 SEMICON West exhibition and conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA.


DRAM market grows up

Wed, 6 Jun 2013

Industry’s newfound maturity yields growth amid adversity.


Imec and Renesas pioneer high-performance RF solutions in 28nm CMOS technology

Fri, 6 Jun 2013

The companies released this new development at this week’s VLSI circuits Symposium in Kyoto, Japan.


Multitest to host annual Open House Week

Thu, 6 Jun 2013

Multitest today announced that it will hold its annual Open House Week July 9-11, 2013.


Imec shows multiple enhancement options for next-generation finFETs

Thu, 6 Jun 2013

Nano-electronics R&D center addresses key challenges of Germanium finFET technology at VLSI 2013.


Producing cheaper and more flexible multiple thin crystalline silicon wafers

Wed, 6 Jun 2013

A team of researchers has found a way to make the manufacture of crystalline silicon materials faster and more affordable.


UMC opens office in Korea

Wed, 6 Jun 2013

The global semiconductor foundry United Microelectronics Corporation announced the opening of its UMC Korea office.


Spansion appoints Robin Jigour as senior vice president and general manager

Wed, 6 Jun 2013

Spansion Inc., a provider of flash memory solutions for embedded markets, today announced the appointment of Robin J. Jigour as senior vice president and general manager of the company's Flash Memory Business Group.


Imec and Holst Centre unveil fully-organic imager

Wed, 6 Jun 2013

At this week’s International Image Sensor Workshop, imec and Holst Centre presented a large-area fully-organic photodetector array fabricated on a flexible substrate.


World's first large(wafer)-scale production of III-V semiconductor nanowire

Mon, 6 Jun 2013

The research team demonstrated a novel method to epitaxially synthesize structurally and compositionally homogeneous and spatially uniform ternary InAsyP1-y nanowire on Si at wafer-scale using metal-organic chemical vapor deposition (MOCVD).


SEMI releases report on first quarter 2013 manufacturing equipment billings

Tue, 6 Jun 2013

SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.31 billion in the first quarter of 2013.


US Army validates SiOnyx XQE sensor performance

Thu, 6 Jun 2013

SiOnyx Inc. announced independent validation of its image sensor technology.


UMC joins IBM chip alliance for 10nm process development

Thu, 6 Jun 2013

IBM and United Microelectronics Corporation, a global semiconductor foundry, today announced that UMC will join the IBM Technology Development Alliances as a participant in the group's development of 10nm CMOS process technology.


EVG and Dynaloy develop single-wafer cleaning solution

Mon, 6 Jun 2013

Single-wafer cleaning solution is suitable for 3D-IC/TSV, advanced packaging, MEMS and compound semiconductor applications.


International Conference on Group IV Photonics will feature advancements in silicon photonics

Tue, 6 Jun 2013

The 10th International Conference on Group IV Photonics (GFP 2013) will feature presentations spanning a broad range of topics focused on silicon photonics and other Group IV element-based photonic materials and devices.


Applied Seals North America partners with SEMATECH

Tue, 6 Jun 2013

SEMATECH announced today that Applied Seals North America (ASNA) has joined SEMATECH’s Manufacturing Technology Center, which is designed to improve semiconductor equipment manufacturing productivity, yield and cost.


Alchimer to collaborate with imec on advanced nano-interconnect technologies

Tue, 6 Jun 2013

In an industry where finer features are driving market needs, current deposition processes are no longer sufficient to address challenges like interconnect dimensions below 16/14nm or high aspect ratio TSVs (>8) without experiencing defects, voids, or low reliability.


Freescale appoints Krishnan Balasubramanian to board of directors

Mon, 6 Jun 2013

Mr. Balasubramanian (known as Bala) brings more than 37 years experience in the semiconductor industry to his new role on Freescale's board of directors.


eMemory and UMC expand non-volatile memory cooperation to advanced 28nm process

Mon, 6 Jun 2013

The agreement will broaden the foundry's specialty process portfolio that already includes a range of eMemory eNVM IP solutions from 0.18um and below.


Olympus launches LEXT OLS4100 laser confocal microscope

Fri, 6 Jun 2013

New 3D measuring system offers auto brightness and high-speed stitching.


Leti Innovation Days to present preview of future developments in nanotechnologies

Thu, 6 Jun 2013

CEA-Leti will present recent advances and a preview of future developments in micro- and nanotechnologies, followed by workshops on key technical fields, during Leti Innovation Days, June 25-28, on the MINATEC campus.


"Generation Mobile": Advanced Packaging Technology at SEMICON West

Thu, 6 Jun 2013

Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function.


450mm – It’s bigger than you think

Thu, 6 Jun 2013

Much has been said of the 450mm transition.  But the description of this inflection is something of a misnomer.


Silicon Labs to acquire Energy Micro

Fri, 6 Jun 2013

Silicon Labs today announced that it has signed a definitive agreement to acquire Energy Micro AS.


All-in-one microscope for advanced imaging, recording and measurement

Fri, 6 Jun 2013

Building on its extensive microscope lineup, KEYENCE Corporation has released a new multipurpose microscope.


Fujitsu touts GaN HEMT millimeter-wave transceiver

Fri, 6 Jun 2013

Fujitsu Laboratories Limited has launched millimeter-wave transceiver based on gallium-nitride high-electron mobility transistor (GaN HEMT). The device operates at frequencies up to the millimeter-wave band and features an output of 10W.


Altera Corp introduces Generation 10 FPGAs and SoCs

Mon, 6 Jun 2013

Altera Corporation today introduced its Generation 10 FPGAs and SoCs, offering system developers breakthrough levels of performance and power efficiencies.


Defense semiconductor and similar applications represent 25% of sapphire industry revenue

Mon, 6 Jun 2013

Crystal growth equipment manufacturer GTAT is leading the charge and recently created a lot of buzz around this application and on the OEM front.


Peregrine Semiconductor completes license agreement with Murata

Thu, 5 May 2013

Peregrine Semiconductor Corporation, a fabless provider of high-performance radio frequency integrated circuits (RFICs), today announced the signing of a collaborative agreement with Murata Manufacturing Company.


GLOBALFOUNDRIES introduces certified design flows for multi-die integration using 2.5D IC technology

Fri, 5 May 2013

The foundry plans to unveil a comprehensive set of certified design flows to support 2.5D IC product development with its most advanced manufacturing processes at next week’s 50th Design Automation Conference (DAC) in Austin, Texas.


GLOBALFOUNDRIES unveils plans to accelerate adoption of 20nm-LPM and 14nm-XM FinFET processes

Fri, 5 May 2013

At next week's 50th Design Automation Conference in Austin, Texas, GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support its most advanced manufacturing processes.


Aptina appoints Phil Carmack as CEO

Thu, 5 May 2013

Aptina’s board of directors yesterday announced that Phil Carmack has joined Aptina as chief executive officer and as a member of the board of directors.


NXP leads automotive ASSP semiconductor market for second year in a row in 2012

Thu, 5 May 2013

Benefiting from its leadership position in AM/FM tuner and audio processing chips, NXP Semiconductors NV in 2012 retained its rank as the world’s top supplier of application-specific standard product semiconductors for the automotive infotainment market.


PCB book-to-bill ratio reaches 34-month high

Thu, 5 May 2013

Association Connecting Electronics Industries announced today the PCB book-to-bill ratio, which reached 1.10, its highest level since July 2010.


Test Vision 2020 at SEMICON West to address emerging test strategies, technologies and challenges

Fri, 5 May 2013

Critical trends and developments in the technologies, methodologies, and applications challenges in semiconductor test will be presented at the 6th annual IEEE Test Vision 2020 Workshop held in conjunction with SEMICON West 2013, on July 10-11 at the San Francisco Marriot Marquis Hotel.


Fraunhofer ISE and EVG develop direct semiconductor wafer bonds for solar cells

Tue, 6 Jun 2013

Fraunhofer Institute for Solar Energy Systems ISE has joined forces with EV Group (EVG) to develop equipment and process technology to enable electrically conductive and optically transparent direct wafer bonds at room temperature. 


Precision is key to scaling below 14nm

Mon, 6 Jun 2013

In advance of the 2013 SEMICON West TechXPOTs on lithography and nonplanar transistors beyond 20nm, SEMI asked some of the speakers and industry experts to comment on the challenges they wanted to highlight. Many of the inputs focused on the need for precision in the processes used to form transistors, as well as how EDA can contribute to mitigating variability.


Fab equipment spending: 23% growth for 2014

Tue, 6 Jun 2013

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.


Smartphones forecast to represent over 50% of total cellphone sales for the first time in 2013

Tue, 6 Jun 2013

A new report from IC Insights shows that we could be on the verge of entering into “the post-PC era.”


Learning the secrets of design for yield

Tue, 6 Jun 2013

Dr. Zhihong Liu, Executive Chairman of ProPlus Design Solutions, Inc., says that design-for-yield (DFY) considerations are more important than ever. And yet, we as an industry may not fully understand device modeling and its impact on DFY results.


Transparent electrode market to grow to $5.1 billion by 2020

Wed, 5 May 2013

Transparent electrodes refer to oxide degenerate semiconductor electrodes that possess a high level of light transmittance (more than 85 percent) in the visible light spectrum, and low resistivity (less than 1×10-3 Ω-㎝) at the same time.


Mentor Graphics and TSMC collaborate on 20nm IC physical verifications

Wed, 5 May 2013

Mentor Graphics Corp. today announced significant achievements in its continued collaboration with TSMC on 20nm physical verification kit optimizations.


New power management IC helps reduce thermal stress on processors in phones and tablets

Tue, 5 May 2013

ams AG, a provider of high performance analog ICs and sensors, today introduced the AS3721, a power management IC (PMIC) with an innovative remote-feedback circuit that helps reduce the thermal stress of applications processors in smartphones and tablets.


Abu Dhabi doubles down on semiconductor research

Wed, 5 May 2013

ATIC and SRC today launched the ATIC-SRC Center of Excellence for Energy Efficient Electronic Systems (ACE4S), to be hosted jointly in Abu Dhabi by Khalifa University of Science, Technology and Research, and Masdar Institute of Science and Technology.


Updated: STMicroelectronics announces sale of ST-Ericsson mobile connectivity GNSS business to Intel

Wed, 5 May 2013

ST-Ericsson, a joint venture of STMicroelectronics and Ericsson, today announced the signature of a definitive agreement to sell the assets and intellectual property rights associated with its mobile connectivity Global Navigation Satellite System (GNSS) business to a semiconductor company.


Element Six acquires assets of Group4Labs

Wed, 5 May 2013

Element Six today announced it has acquired the assets and intellectual property of Group4 Labs, Inc. (Group4), a semiconductor wafer materials company that manufactured gallium nitride (GaN) on-diamond semiconductor technology for RF and high-power devices.


First quarter results for graphics chip shipments: Nvidia a clear winner but bad news for Intel

Mon, 5 May 2013

Jon Peddie Research (JPR) announced estimated graphics chip shipments and suppliers’ market share for 2013 Q1. The news was disappointing for Intel, but encouraging for Nvidia and for AMD on the desktop.


Extending optical lithography; outlook for DSA

Mon, 5 May 2013

This year’s SEMICON West front-end processing TechXPOTs on lithography and transistors below 20nm will provide critical updates on how technologists are coping with the next scaling challenges.


How Intel can enable a successful $200 PC in the age of the media tablet

Mon, 5 May 2013

Can PC makers produce ultrathin, touch-screen PCs that are appealing to consumers—and that are priced at just $200?


Printed, flexible and organic electronics sees 15.2% CAGR over the next decade

Fri, 5 May 2013

The new report from IDTechEx titled "Printed, Organic & Flexible Electronics: Forecasts, Players & Opportunities 2013-2023" finds that the total market for these technologies will grow from $16.04 billion in 2013 to $76.79 billion in 2023.


Samsung announces industry-first 45nm embedded flash logic process development

Fri, 5 May 2013

Samsung Electronics Co., Ltd., a provider of advanced semiconductor solutions, today announced the industry’s first 45nm embedded flash logic process development called eFlash. Samsung successfully implemented the new process into the smart card test chip, which means that this process technology fulfills the stringent quality requirements of the security solution market and can be successfully deployed on a commercial scale.


GT Advanced Technologies acquires Thermal Technology LLC

Thu, 5 May 2013

GT Advanced Technologies today announced that it has acquired substantially all of the business of Thermal Technology LLC for purchase consideration.


SMIC deploys NanoYield High-Sigma for 28nm process development

Thu, 5 May 2013

ProPlus Design Solutions, Inc. announced today that Semiconductor Manufacturing International Corporation has deployed ProPlus' NanoYield High-Sigma (HS) within its advanced technology development flow.


Vishay Intertechnology enhances precision thin film chip resistor arrays

Thu, 5 May 2013

Vishay Intertechnology, Inc. today announced that the company has enhanced its ACAS 0606 AT and ACAS 0612 AT precision thin film chip resistor arrays with tighter absolute tolerance, relative tolerance, and relative TCR for the new S, T, and U accuracy grades.


Imec and Renesas collaborate on ultra-low power short range radios

Thu, 5 May 2013

Imec and Renesas Electronics Corporation announced today that they have entered into a new strategic research collaboration at Holst Centre.


Silicon Valley foundry Noel Technologies adds advanced lithography services

Thu, 5 May 2013

Foundry hires former ASML’s Keith Best as director of photolithography; tasked with driving roadmap to 0.15 microns


EU announces achievements of three-year power microelectronics program

Thu, 5 May 2013

LAST POWER, the European Union-sponsored program aimed at developing a cost-effective and reliable technology for power electronics, today announced its three-year program achievements.


SiC and GaN semiconductors: What to expect in the next decade

Wed, 4 Apr 2013

The market for GaN and SiC power semiconductors is set to rise by factor of 18 from 2012 to 2022.


Confronting sub-20nm front-end challenges with the “duck and weave”

Wed, 4 Apr 2013

Just as a boxer avoids a surprise shot to the head or torso by using a “duck and weave” maneuver, so to must front-end technologists confront the challenges associated with extending optical lithography while planning for EUV lithography’s eventual high-productivity solution.


New nanowire structure has potential to increase semiconductor applications

Tue, 4 Apr 2013

New research led by University of Cincinnati physics professors Howard Jackson and Leigh Smith could contribute to better ways of harnessing solar energy, more effective air quality sensors or even stronger security measures against biological weapons such as anthrax


Critical updates on EUV, 3D transistors and 450mm manufacturing at SEMICON West 2013

Tue, 4 Apr 2013

The critical processes and technologies necessary to continue Moore’s Law are currently more uncertain than ever before in the history of advanced semiconductor manufacturing.


AG Semiconductor appoints new senior director of sales

Tue, 4 Apr 2013

AG Semiconductor Services today announced that Michael (Mike) Mardesich has joined the company in the role of senior director of sales.


MoSys announces support of GigaChip interface

Tue, 4 Apr 2013

MoSys, a provider of semiconductor solutions, today announced that Macnica Americas, a provider of semiconductor distribution and design services, will support the GigaChip Interface in its distribution and technology innovation business.


MEMSIC to be acquired by IDG-Accel China

Tue, 4 Apr 2013

MEMSIC, Inc., a MEMS solution provider, today announced that it has agreed to be acquired by IDG-Accel China Capital II, L.P. and its affiliates MZ Investment Holdings Limited and MZ Investment Holdings Merger Sub Limited, for $4.225 per share in cash.


SAMCO to relocate and expand Silicon Valley office

Mon, 4 Apr 2013

SAMCO Inc, head quartered in Kyoto, Japan, has expanded its OPTO Films Research Laboratory in California’s Silicon Valley in order to strengthen its research structure and after-sale process support.


University of Illinois researchers measure behavior of semiconductor plasmonic microparticles

Mon, 4 Apr 2013

Recent progress in the engineering of plasmonic structures has enabled new kinds of nanometer-scale optoelectronic devices as well as high-resolution optical sensing.


Element Six and Delft University demonstrate milestone in solid-state diamond research

Mon, 5 May 2013

Element Six last week announced, in collaboration with Delft University of Technology, the entanglement of electron spin qubits (quantum bits) in two synthetic diamonds separated in space.


IEDM announces 2013 call for papers

Fri, 5 May 2013

The 59th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking original work in microelectronics research and development. The paper submission deadline is Monday, June 24, 2013.


Intel board elects Brian Krzanich as CEO, Renée James as President

Thu, 5 May 2013

Intel announced that the board of directors has unanimously elected Brian Krzanich as its next chief executive officer (CEO), succeeding Paul Otellini. The board also named Renée James, 48, to be president of Intel.

MOSIS collaborates with imec, Tyndall and ePIXfab on silicon photonics

Thu, 5 May 2013

MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with imec, Ireland's Tyndall National Institute and ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs.


New method joins gallium nitride and diamond for better thermal management

Wed, 5 May 2013

DARPA's Near Junction Thermal Transport (NJTT) effort recently demonstrated the first-ever GaN-on-diamond high electron mobility transistor (HEMT).


SRC and NSF partner to develop compact models for emerging nanotech

Wed, 5 May 2013

Semiconductor Research Corporation (SRC) recently joined the National Science Foundation (NSF) as a partner in an ongoing NSF project to further develop compact models of emerging nanoelectronic devices such as might be used in next-generation consumer electronics.


IBM Research makes world’s smallest movie using atoms

Wed, 5 May 2013

Scientists from IBM today unveiled the world's smallest movie, made with one of the tiniest elements in the universe: atoms. Named "A Boy and His Atom," the Guinness World Records -verified movie used thousands of precisely placed atoms to create nearly 250 frames of stop-motion action.


Amkor Technology appoints Steve Kelley president and CEO

Wed, 5 May 2013

Amkor Technology, Inc. today announced that Stephen D. Kelley has been appointed to serve as president and chief executive officer and as a director of the company, effective May 8, 2013.


Quartz Imaging introduces automated measurement for semiconductor images

Tue, 4 Apr 2013

It can be very time-consuming for engineers to measure the various features of an X-SEM image of a semiconductor device.


Cache solid state drives prevail over pure SSD storage in Ultrabooks And ultrathins

Tue, 4 Apr 2013

The most popular storage medium this year for superthin Ultrabooks and similarly built laptops won’t be the pricey solid state drives (SSD) that initially created a buzz for their astonishing speeds.


How war on the Korean peninsula could affect worldwide electronics production

Tue, 4 Apr 2013

What would happen if half of all global production for dynamic random access memory (DRAM), two-thirds of NAND flash manufacturing and 70 percent of the world’s tablet display supply suddenly disappeared from the market?


University of Manchester researchers cultivate first graphene-based transistor

Tue, 4 Apr 2013

University of Manchester researchers reported to Nature Communications that they have developed the first graphene-based transistor with bistable characteristics.


Strategic approach to R&D is goal at National Photonics Initiative Event

Thu, 3 Mar 2013

More than 100 representatives from government and the photonics industry convened in Washington, D.C., on February 28 to identify focus areas for a national photonics initiative (NPI), engaging academia, industry, and government in a collaboration to address barriers to continued U.S. leadership in photonics.


AIXTRON sees signs of market stabilization in report of 2012 fiscal year

Thu, 3 Mar 2013

Management expects demand for MOCVD production equipment to potentially improve as demand for LEDs increases later in the current year.


'Key' EUV milestone, DSA progress, more reported at SPIE Advanced Lithography

Thu, 3 Mar 2013

Over 2,000 industry professionals attended last week’s SPIE Advanced Lithography, where important progress reports were revealed on extreme ultraviolet (EUV), lithography, directed self-assembly (DSA), metrology, and related topics. The event ran February 24-28 in San Jose, California.


STMicroelectronics makes analog 130nm H9A CMOS process available through CMP

Thu, 3 Mar 2013

Semiconductor technology leaders ST and CMP help universities, research labs and companies prototype next generation of Systems-on-Chip.


Aptina and LFoundry to partner on CMOS image sensor manufacturing

Thu, 3 Mar 2013

LFoundry to manufacture wafers for Aptina following LFoundry’s purchase of Micron’s Avezzano, Italy semiconductor fabrication facility.


EPIC to develop industry database and interactive map

Wed, 3 Mar 2013

The European Photonics Industry Consortium recently embarked on an ambitious project to map all the companies in Europe active in photonics, which amounts to over 3000 companies.


January DRAM, NAND flash sales indicate a promising year

Wed, 3 Mar 2013

Industry consolidation to just three big DRAM suppliers and a reduction in capital expenditures among these manufacturers helped propel DRAM average selling prices (ASPs) up 13% year over year in January, which contributed to a 19.9% jump in the total memory market and a 6.2% increase for the total IC market in January 2013. 


Car infotainment semiconductor market hits speed bump in 2013

Wed, 3 Mar 2013

Following a healthy expansion in 2012, the growth of the global automotive semiconductor market will decelerate slightly this year because of a slowdown in the aftermarket and portable navigation device (PND) segments.


Diodes Incorporated closes acquisition of BCD Semiconductor

Wed, 3 Mar 2013

Diodes Incorporated today announced that it has completed its acquisition of BCD Semiconductor Manufacturing Limited in an all cash deal, valued at approximately $151 million.


Short-range wireless technology IC market to reach almost 5 billion units shipped in 2013

Wed, 3 Mar 2013

The total market for open short-range wireless (SRW) technology based ICs, such as Bluetooth, Wi-Fi, ZigBee, NFC, and GPS, is expected to reach almost 5 billion units in 2013 and grow to nearly 8 billion by 2018, according to ABI Research. This includes standalone wireless connectivity ICs, wireless connectivity combo ICs, and also platforms with integrated wireless connectivity.


Spectra-Physics introduces industrial picosecond laser

Fri, 5 May 2013

Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision micromachining applications.


North American Semiconductor Industry: Continuing with high levels of investments

Thu, 5 May 2013

While investments and capital spending in Asia-Pacific garner much of the attention regarding semiconductor manufacturing, spending on equipment and materials in North America has totaled more than $100 billion over the past decade as leading device manufacturers expand capacity and invest in new facilities.


Top industrial electronics semiconductor suppliers suffer declining revenue in 2012

Thu, 5 May 2013

The eight leading suppliers of industrial electronics suffered revenue declines in 2012, reflecting weak conditions for the beleaguered market.


A new way to discover and monitor defects

Thu, 5 May 2013

In the world of optical defect inspection, finding on defect on a 300mm wafer can be like trying to find a single coin on the island of Taiwan. Now imagine being able to find that coin in just an hour, along with any other coins that look exactly like it.


First quarter 2013 reports slight decrease in silicon wafer shipments

Thu, 5 May 2013

Worldwide silicon wafer area shipments decreased during the first quarter 2013 when compared to fourth quarter 2012 area shipments, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.


Researchers discover a new model for creating ultra-low resistance metal/oxide contacts

Wed, 5 May 2013

A pathway to creating low-resistance Ohmic contacts at nanoscale has been reported in Advanced Materials this week; a development which is of critical importance to the on-going advancement of oxide electronics.


Despite overall power electronics 2012 downturn, SiC kept on growing

Wed, 5 May 2013

Starting late in 2011, the power electronics downturn in 2012 was quite severe, exhibiting -20 percent negative growth. However, the SiC device market kept on growing with a +38 percent increase year to year.


Second phase of Nanoelectronics Research Initiative to focus on post-CMOS electronics

Wed, 5 May 2013

SRC and NIST will provide a combined $5 million in annual funding for three multi-university research centers tasked with demonstrating non-conventional, low-energy technologies that outperform current technologies on critical applications in 10 years and beyond.


SSDs to account for one-third of worldwide PC storage shipments by 2017

Tue, 5 May 2013

Global shipments of solid state drives (SSD) in PCs are set to rise by a factor of seven by 2017, allowing them to claim more than one-third of the market for PC storage solutions by that time.


Intel launches low-power, high-performance microarchitecture

Tue, 5 May 2013

Intel Corporation today took the wraps off its brand new, low-power, high-performance microarchitecture named Silvermont.


LFoundry completes acquisition of Micron’s facility in Avezzano

Mon, 5 May 2013

LFoundry confirmed the signature of the final agreement regarding the acquisition of Avezzano (Italy) manufacturing facility.


Analog Devices signs worldwide distribution agreement with Mouser Electronics

Mon, 5 May 2013

Analog Devices, Inc., a provider of high-performance semiconductors for signal-processing applications, announced today that it has entered into a worldwide distribution agreement with Mouser Electronics, Inc. Mouser supplies design engineers and buyers with the newest products and leading-edge technologies.


Analog Devices appoints Vincent Roche CEO

Mon, 5 May 2013

Analog Devices, Inc. today announced the appointment of Vincent Roche as president and chief executive officer (CEO) and his election to the Board of Directors, effective immediately.


Photonics societies launch the National Photonics Initiative to increase R&D and economy

Thu, 5 May 2013

Photonics societies across the United States today announced the launch of the National Photonics Initiative.


Innovation could bring flexible solar cells, transistors, displays

Wed, 5 May 2013

Researchers have created a new type of transparent electrode that might find uses in solar cells, flexible displays for computers and consumer electronics and future "optoelectronic" circuits for sensors and information processing.


Four-junction solar cell achieves 43.6% efficiency

Wed, 5 May 2013

Soitec announced the PV industry’s first four-junction solar cell device, which uses two dual-junction sub cells grown on different III-V compound  materials, which allows optimal band-gap combinations tailored to capture a broader range of the solar spectrum.


IDC predicts semiconductor market to experience 3-4% revenue growth in 2013

Wed, 5 May 2013

IDC expects the semiconductor market to return to growth in 2013 with revenues forecast to increase by 3.5 percent this year.


North American semiconductor equipment industry posts April 2013 book-to-bill ratio of 1.08

Wed, 5 May 2013

North America-based manufacturers of semiconductor equipment posted $1.17 billion in orders worldwide in April 2013 (three-month average basis) and a book-to-bill ratio of 1.08.


NSF and SRC to fund research to create failure-resistant systems and circuits

Tue, 5 May 2013

Leaders of the National Science Foundation (NSF) and the Semiconductor Research Corporation (SRC) today announced 18 new projects funded through a joint initiative to address research challenges in the design of failure-resistant circuits and systems.


Eleven companies move up in Q1’13 top 20 semi supplier ranking

Tue, 5 May 2013

Qualcomm, TSMC, and SK Hynix each register greater than 20 percent year-over-year growth.


Mouser Electronics’ president and CEO celebrates 40 years of service

Tue, 5 May 2013

In 1973, Pong was cutting edge in the world of video games, music came on eight-track tapes, TV viewing was limited to three networks and Glenn Smith was a college kid who went to work part-time in the warehouse of what was little more than a mom and pop electronics catalog start-up in San Diego.


Qualcomm and Samsung pass AMD in MPU ranking

Tue, 5 May 2013

Slow notebook and desktop PC sales and strong growth in mobile processors for smartphones and tablet PCs continues to lower Intel's marketshare as well.


Toshiba to start mass production of next generation NAND flash memory

Tue, 5 May 2013

Toshiba Corporation today announced that the company has developed second generation 19nm process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month.


Imec and GLOBALFOUNDRIES collaborate to advance high-density memory technology

Tue, 5 May 2013

Imec and GLOBALFOUNDRIES announced today that they have expanded joint development efforts to advance STT-MRAM (spin-transfer torque magnetoresistive random access memory) technology.


Axcelis launches Purion XE high energy implanter

Tue, 4 Apr 2013

Axcelis Technologies, Inc. today announced the introduction of the Purion XE next generation single wafer high energy implanter, the second tool in its expanding family of Purion ion implanters. 


Spansion to acquire microcontroller and analog business from Fujitsu

Tue, 4 Apr 2013

Spansion Inc. and Fujitsu Semiconductor Limited today announced they have executed a definitive agreement for Spansion to acquire the Microcontroller and Analog Business of Fujitsu Semiconductor for approximately $110 million, plus approximately $65 million for inventory.


Samsung now producing 4Gb LPDDR3 mobile DRAM at 20nm

Tue, 4 Apr 2013

Samsung Electronics Co., Ltd. today announced the industry’s first production of ultra-high-speed four gigabit (Gb) low power double data rate 3 (LPDDR3) mobile DRAM, which is being produced at a 20nm-class process node.


China becomes world’s leading PC market in 2012

Mon, 4 Apr 2013

China rose to the top of the PC market for the first time ever on an annual basis last year, relegating the United States to second place with a lead of more than 3 million units, according to an IHS iSuppli PC Dynamics Market Brief from information and analytics provider IHS.


Semiconductor industry to recognize Philip Yeo and Lee Kok Choy at SEMICON Singapore 2013

Mon, 4 Apr 2013

SEMI today announced that Philip Yeo, chairman of SPRING Singapore, and Lee Kok Choy, country manager of Micron Technology Inc. Singapore, have been voted by the SEMI Singapore Regional Advisory Board as recipients of two prestigious awards recognizing their contributions to the development and success of the Southeast Asian semiconductor industry.


Rudolph purchases assets from Tamar Technology

Mon, 4 Apr 2013

Rudolph Technologies, Inc. announced today that it has purchased selected assets, including a patent portfolio, relating to metrology capability from Tamar Technology, Newbury Park, Calif.


Cadence and GLOBALFOUNDRIES to improve DFM signoff for 20 and 14nm nodes

Mon, 4 Apr 2013

Cadence Design Systems, Inc. announced today that GLOBALFOUNDRIES has collaborated with Cadence to provide pattern classification data for manufacturing processes of 20 and 14 nanometers.


Morgan Advanced Materials joins SEMATECH to develop process solutions

Mon, 4 Apr 2013

Morgan Advanced Materials has joined SEMATECH’s International SEMATECH Manufacturing Initiative (ISMI), a program designed to improve semiconductor equipment manufacturing productivity, yield, and cost.


Infineon and GLOBALFOUNDRIES announce collaboration for 40nm embedded flash process

Mon, 4 Apr 2013

Infineon Technologies and GLOBALFOUNDRIES Inc. today announced a joint technology development and production agreement for 40nm embedded flash (eFlash) process technology.


Renesas Electronics to release intelligent power device for IGBT drive with micro-isolator

Fri, 4 Apr 2013

Renesas Electronics Corporation this week announced the development of the R2A25110KSP intelligent power device of isolated IGBT driver for use in electric and hybrid vehicle power inverters.


Global semiconductor industry to witness a CAGR of 4.3% over next five years

Fri, 4 Apr 2013

Global macroeconomic developments and technological advances, personal computers, and memory markets are expected to drive demand over the forecast period, Research and Markets predicts in their report, “Global Semiconductor Industry 2012-2017: Trend, Profit and Forecast Analysis.”


Digital power market booms as technology spreads to consumer and lighting areas

Fri, 4 Apr 2013

The global markets for digital power supplies and digital power integrated circuits (ICs) are projected to boom from 2013 to 2017, as their use in IT infrastructure increases and as the technology expands into lighting and consumer-oriented applications including PCs, appliances and cellphones.


Handset market grows in Q1, despite Samsung and Apple’s different approaches

Fri, 4 Apr 2013

An estimated 405 million handsets, including 197 million smartphones, were shipped in the first quarter of 2013, according to market intelligence firm ABI Research.


Hitachi launches brand-new GaN-template product

Fri, 4 Apr 2013

Hitachi Cable, Ltd. announced today that it has developed a new mass-production technology for GaN-templates, in which a high-quality gallium nitride (GaN) single-crystal thin film is grown on a sapphire substrate.


Dongbu HiTek starts volume production of ALPS chips for Clairpixel

Thu, 4 Apr 2013

Dongbu HiTek today announced that it has begun volume production of Ambient Light Proximity Sensor (ALPS) chips for Clairpixel Co., Ltd., a Korean company specializing in single-chip image and motion sensor solutions for mobile, automotive, medical and security applications.


Breakthroughs in transistors and more to be discussed at VLSI Symposia 2013

Thu, 4 Apr 2013

About 1,000 of the world’s leading experts in the field of microelectronics will gather here for the 2013 Symposia on VLSI Technology and Circuits, from June 11-13, 2013 (Technology) and from June 12-14, 2013 (Circuits).


Nanowires grown on graphene have surprising structure

Wed, 4 Apr 2013

When a team of University of Illinois engineers set out to grow nanowires of a compound semiconductor on top of a sheet of graphene, they did not expect to discover a new paradigm of epitaxy.


NexPlanar announces major expansion for semiconductor CMP pads

Fri, 5 May 2013

Rapidly increasing customer demand for NexPlanar's advanced semiconductor CMP pads has necessitated a significant capacity expansion in both the U.S. and Asia.


Flexible devices manufactured by roll-to-roll technologies to reach nearly $22.7 billion by 2017

Thu, 5 May 2013

The diffusion of roll-to-roll technologies is expected to have a marked effect in lowering the unit prices of flexible devices. Consequently, while consumption in terms of volume is forecast to rise very rapidly, revenues will increase somewhat more moderately.


Personal computer shipments post worst quarter on record, says IDC

Thu, 4 Apr 2013

In another sign of the worldwide shift in preferred personal devices, PC shipments posted the steepest decline ever in a single quarter, according to the International Data Corporation Worldwide Quarterly PC Tracker (IDC).


Memory, foundry and LED markets drive fab spending in southeast Asia

Thu, 4 Apr 2013

Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia.


Natcore announces advancements and new applications in black silicon

Thu, 4 Apr 2013

Natcore Technology Inc. announced major strides in advancing its black silicon solar cells to commercial levels of efficiency and, as part of its development process, has discovered that its technology could finally provide a low-cost selective emitter application.


Samsung mass producing high-performance NAND Flash memory using 10nm-class process technology

Thu, 4 Apr 2013

Samsung has begun mass producing a 128-gigabit (Gb), 3-bit multi-level-cell (MLC) NAND memory chip using 10 nanometer (nm)-class process technology this month. This chip will enable high-density memory solutions such as embedded NAND storage and solid state drives (SSDs).


NikkoIA SAS announces production of new organic image sensors

Wed, 4 Apr 2013

NikkoIA announces the production of several innovative organic image sensors, confirming the potential of its technology, and validates the technology building blocks that can be immediately implemented to build its product lines.


Picosun’s 300mm ALD cluster tools selected for new memory applications

Wed, 4 Apr 2013

Picosun Oy, an Atomic Layer Deposition (ALD) equipment manufacturer, reports that its PICOPLATFORM 300 ALD cluster tool has been selected by a key customer in Asia for new memory applications.


ESI acquires Semiconductor Systems business of GSI Group

Wed, 4 Apr 2013

 Electro Scientific Industries, Inc. today announced it had signed a definitive agreement to acquire the Semiconductor Systems business of GSI Group, Inc., a supplier of precision photonics, laser-based solutions and precision motion devices to the medical, industrial, scientific, and electronics markets


AMEC develops process technology for dry etching at 20nm

Wed, 4 Apr 2013

Advanced Micro-Fabrication Equipment Inc. (AMEC) said today that it has developed a Single-Station Chamber Advanced Dielectric Etcher (SSC AD-RIE) capable of processing the most rigorous semiconductor applications.


Fourth-quarter reprieve spurs 2013 rebound for semiconductor makers

Wed, 4 Apr 2013

Despite stronger-than-expected growth during the fourth quarter, 2012 was still a miserable year for the semiconductor market and suppliers, with only eight out of the Top 25 chipmakers managing to eke out revenue growth—but nine suffering double-digit declines.


Veredus confirms VereFlu lab-on-chip detects the current subtype of avian flu

Wed, 4 Apr 2013

Veredus Laboratories today announced that the current version of VereFlu detects the current subtype of H7N9 (Avian Flu) that is responsible for the flu outbreak in China. H7N9 is the latest mutation to cause concern and increased surveillance in the region.


memsstar appoints Tony McKie CEO

Tue, 4 Apr 2013

memsstar Limited, a provider of etch and deposition equipment and technology solutions to manufacturers of semiconductors and MEMS, today announced the appointment of Tony McKie as its new chief executive officer (CEO). McKie is tasked with capitalising on the company's experience and reputation in the semiconductor and MEMS markets to drive its growth.


SEMI reports 2012 global semiconductor materials sales of $47.1 billion

Tue, 4 Apr 2013

The global semiconductor materials market decreased 2 percent in 2012 compared to 2011 while worldwide semiconductor revenues declined 3 percent. Revenues of $47.11 mark the first decline in the semiconductor materials market in three years.


Opportunities for electronics manufacturing services in medical industry are increasing

Wed, 5 May 2013

Original equipment manufacturers (OEMs) are increasingly turning to electronics manufacturing service (EMS) providers to better handle the escalating volumes of electronic content in the medical industry.


UC Riverside scientists discover new uses for carbon nanotubes

Wed, 5 May 2013

The atom-sized world of carbon nanotubes holds great promise for a future demanding smaller and faster electronic components.


Global semiconductor sales outpace last year through Q1 of 2013

Tue, 5 May 2013

Sales in March 2013 were up slightly compared to February 2013 and March 2012.


NeoPhotonics opens sales and R&D office in Moscow

Tue, 5 May 2013

NeoPhotonics Corporation today announced the opening of a sales and R&D office in Moscow and servicing the Russian Federation and the broader eastern European market.


Chip Memory Technologies Inc. reveals unique embedded NV memory solution

Tue, 5 May 2013

Chip Memory Technology Inc. (CMT), a new embedded memory technology developer, has emerged from stealth mode to reveal company details and its latest product.


HELIOS develops supply chain for integrating photonics with CMOS circuit

Tue, 5 May 2013

The €8.5 million European Commission project developed a complete design and fabrication supply chain for integrating a photonic layer with a CMOS circuit, using microelectronics fabrication processes.


Studying 1/f noise

Mon, 5 May 2013

1/f noise is an important characteristic for various semiconductor devices, such as MOSFETs, BJTs, JFETs, Diode, and IC resistors. Not only does it directly impact the circuit performance of modern ICs, but it has been used also as an important technique to characterize the manufacturing process quality.


Teledyne acquires Axiom IC

Mon, 5 May 2013

Teledyne Technologies Incorporated announced today that its subsidiary, Teledyne DALSA B.V., has acquired Axiom IC B.V.


TowerJazz and TLi Korea to collaborate on sensor ICs for mobile market

Mon, 5 May 2013

TowerJazz today announced collaboration with TLi (Technology Leaders and Innovators), a fabless company that designs non-memory integrated circuits (ICs) focused on timing controllers and driver ICs on TFT-LCD panel modules.


IQE and II-VI Inc. launch 150mm GaN HEMT epi wafers on SiC substrates

Mon, 5 May 2013

IQE plc announces the launch of gallium nitride-based, high electron mobility transistor (GaN HEMT) epitaxial wafers on 150mm diameter semi-insulating silicon carbide (SiC) substrates.


New magnetic graphene may revolutionize electronics

Fri, 5 May 2013

Researchers from IMDEA-Nanociencia Institute and from Autonoma and Complutense Universities of Madrid have managed to give graphene magnetic properties.


Perfectly doped quantum dots yield colors to dye for

Fri, 5 May 2013

Researchers at the University of Illinois at Chicago have developed a way to introduce precisely four copper ions into each and every quantum dot.


Bluetooth chip shipments to nearly double by 2017

Fri, 4 Apr 2013

The market for Bluetooth semiconductors is expected to boom by nearly 100 percent from 2011 to 2017, with the majority of the growth driven by demand for wireless combination integrated circuits (ICs) and mobile system-on-chip (MSoC) devices with integrated wireless connectivity that are used in mobile devices like smartphones and media tablets.


Reinventing Intel

Fri, 4 Apr 2013

The semiconductor chip giant revealed plans to branch out beyond PCs. Will it work?


Freescale Semiconductor to open 10 sales offices in China in 2013

Fri, 4 Apr 2013

In order to meet the rapidly growing business demands in the Chinese market and further expand the mass market in that region, Freescale Semiconductor announced today that the company plans to open ten new sales offices covering key areas across the mainland area.


SEMI reports March book-to-bill ratio of 1.14

Fri, 4 Apr 2013

North America-based manufacturers of semiconductor equipment posted $1.14 billion in orders worldwide in March 2013 (three-month average basis) and a book-to-bill ratio of 1.14, according to the March Book-to-Bill Report published today by SEMI.


Smartphones, tablets, SSDs propelling NAND flash sales in 2013

Thu, 4 Apr 2013

Increasing HD video content, social networking, shared data via the cloud, low power consumption, and “instant on” features continue to drive growth of consumer, communication, and computing devices that use NAND flash memory.


University of Cambridge installs AIXTRON MOCVD reactor for GaN-on-Si wafers

Thu, 4 Apr 2013

AIXTRON SE today announced that the University of Cambridge has successfully commissioned another multi-wafer Close Coupled Showerhead (CCS) MOCVD reactor at its new facility at the Department of Material Science and Metallurgy. The CCS 6x2-inch system will be configured to handle single 6-inch (150mm) wafers (1x6-inch).


Cree SiC MOSFETs enable next-generation solar inverters

Wed, 4 Apr 2013

Cree, Inc. and Delta Energy Systems announce a breakthrough in the photovoltaic (PV) inverter industry with the release of Delta’s new generation of solar inverters, which utilize SiC power MOSFETs from Cree. The use of SiC MOSFETs in the next-generation PV inverters can enable significant new milestones in power density, efficiency and weight.


Intermolecular announces agreement with Micron

Wed, 4 Apr 2013

Intermolecular, Inc. today announced that it has entered into a multi-year technology development and IP licensing agreement with Micron Technology, Inc., focused on technology development and related IP for advanced memory technologies.


“Smart Skin” sensors could provide remote monitoring of aging infrastructure

Wed, 4 Apr 2013

Researchers at the Georgia Institute of Technology are developing a novel technology that would facilitate close monitoring of structures for strain, stress and early formation of cracks.


BeSpoon and CEA-Leti establish world-record distance measurement on a single chip

Wed, 4 Apr 2013

BeSpoon, a fabless semiconductor company, and CEA-Leti have demonstrated an IR-UWB integrated circuit able to measure distances within a few centimeters’ accuracy, and have established a world-record operating range at 880m (standard regulation) and 3,641m (emergency situations).


E.ON steps up to big data metering with Ericsson

Wed, 4 Apr 2013

The evolution of smart grids is a priority in a number of countries, including EU and the US, and will eventually create a smart energy network that manages a huge amount of data in 24-hour intervals.


IRPS 2013: New insight into erratic bits

Tue, 4 Apr 2013

Error correction code and redundant addresses are both techniques well-known in memories as a way of optimizing yield. But new data from the University of Ferrara shows that these common techniques may be overused. By classifying erratic bits more carefully, it’s possible to use less ECC and up to 35 percent less redundancy.


IRPS 2013: Oxygen interstitials can impact RRAM retention time

Tue, 4 Apr 2013

The ability of a resistive RAM device to maintain its resistance state, otherwise known as retention time, can be impacted by the electrode materials used.


IRPS 2013: Discrete trapping and detrapping seen in flash memories

Tue, 4 Apr 2013

New flash memory chips are replacing the floating gate with thin layers of material that "trap the charge." The charge trap is a sandwich of materials such as silicon-oxide-nitride-oxide-silicon (SONOS), metal-oxide-nitride-oxide-silicon (MONOS) and tantalum-aluminum oxide-nitride-oxide-silicon (TANOS), all of which are substantially smaller than the floating gate.


Layered '2-D nanocrystals' are a promising new semiconductor

Tue, 4 Apr 2013

Researchers are developing a new type of semiconductor technology for future computers and electronics based on "two-dimensional nanocrystals" layered in sheets less than a nanometer thick that could replace today's transistors.


IRPS 2013: Breakdown voltage dependent on polarity

Tue, 4 Apr 2013

At the International Reliability Physics Symposium (IRPS), being held April 14-18, 2013 at the Hyatt Regency Monterey Resort & Spa in Monterey, CA, imec will present new research focused on the stress induced breakdown between the tungsten trench local interconnects (M1, M2) and metal gate in a 28nm CMOS technology. Imec’s Thomas Kauerauf will present a paper titled “Reliability of MOL local interconnects.”


IRPS 2013: High-k oxides pose new reliability challenges

Tue, 4 Apr 2013

New finFETs feature high-k dielectrics, which are better than conventional silicon nitride dielectrics in that they can be thinner, yet still enable good control of the transistor’s channel region from the gate.


IRPS 2013: Self-heating to accelerate aging in FinFETs

Tue, 4 Apr 2013

It’s well-known that transistors generate heat when they’re operating, and that can have a significant impact on the chip’s reliability and longterm longevity. A small increase of 10°C–15°C in the junction temperature may result in ∼ 2× reduction in the lifespan of the device.


IRPS 2013: NBTI worsens with FinFET scaling

Tue, 4 Apr 2013

FinFETs offer several advantages compared to traditional planar transistors, but it’s not yet clear what kind of new reliability problems might arise as FinFETs are scaled to smaller dimensions.


Anapass to collaborate and invest with GCT Semiconductor

Mon, 4 Apr 2013

Anapass, Inc, a display SoC solution provider listed on the KOSDAQ, today announced that it has entered into strategic collaboration and investment agreements with GCT Semiconductor, Inc., a designer and supplier of advanced 4G mobile semiconductor solutions, to develop and commercialize mobile application processors (AP) for use in smartphones.


Thin-layer germanium may replace silicon in semiconductors

Mon, 4 Apr 2013

Chemists at Ohio State University have developed the technology for making a one-atom-thick sheet of germanium, and found that it conducts electrons more than ten times faster than silicon and five times faster than conventional germanium.


SPIE leaders encouraged by increased science funding in Obama budget proposal

Mon, 4 Apr 2013

Proposed increases in funds for scientific R&D and a greater emphasis on STEM education in the 2014 budget proposal announced by the White House this week reflect the President’s commitment to science and engineering, SPIE leaders said.


IBM announces $1B investment in flash memory R&D

Fri, 4 Apr 2013

IBM announced plans on Thursday to invest $1 billion in flash memory research and development and launch a series of systems that will use solid state drives.


Net loss for netbooks: Product set for extinction by 2015

Fri, 4 Apr 2013

Once a white-hot PC product that sold in the tens of millions of units annually, netbook computers are now marking their final days, with the rise of tablets causing their shipments to wind down to virtually zero after next year, according to an IHS iSuppli Compute Electronics Market Tracker Report from information and analytics provider IHS.


BlinkSight and imec announce world’s first single-chip indoor GPS solution

Fri, 4 Apr 2013

Imagine if you could track and trace connected goods, assets and people in real-time, anywhere, at any time with high accuracy. BlinkSight and imec recently made this future a reality, with the launch of the first ever single-chip indoor GPS solution.


Semiconductor R&D: A state of transition

Thu, 4 Apr 2013

Several years ago when the challenges to 450mm wafer processing, EUV development and novel transistor designs were first being discussed, SEMI commissioned a study that predicted the industry could face an R&D funding gap that could exceed $9 billion if current technology and economic trends continue.


Cracking the potential of the glass wafer market

Thu, 4 Apr 2013

Over the last few years, glass has gained considerable interest from the semiconductor industry due to its very attractive electrical, physical and chemical properties, as well as its prospects for a relevant and cost-efficient solution. The application scope of glass substrates in the semiconductor field is broad and highly diversified.


Corporate partnership produces next generation MEMS handler

Fri, 2 Feb 2013

TESEC Corporation today announced the development and sales of the ULTRA MEMS Handler, targeting Inertial (Accelerometer, Gyroscope and Magnetometer) MEMS devices.


Painting with catalysts: Nano-engineered materials for detoxifying water

Fri, 2 Feb 2013

Only light, aerial oxygen, and a catalyst are needed to remove pollutants from water. Ruhr-Universitat Bochum researchers led by Professor Radim Beránek are collaborating with colleagues from seven different countries in order to develop a photocatalyst that is efficient enough to be profitable.


Ultra-low power processor operates at near-threshold voltage

Thu, 2 Feb 2013

At this week’s International Solid State Circuits Conference (ISSCC 2013), imec and Holst Centre presented an ultra-low power processor that operates reliably at near-threshold voltages.


1.9nJ/b Ultra-low power 2.4GHz multi-standard radio compliant to Bluetooth Low Energy and ZigBee

Thu, 2 Feb 2013

Imec and Holst Centre presented at ISSCC an ultra-low power multi-standard 2.3/2.4GHz short range radio. The 1.9nJ/b radio is compliant with three wireless standards: Bluetooth Low Energy, ZigBee and Medical Body Area Networks.


RRAM: Understanding reliability issues

Thu, 2 Feb 2013

Tim Turner, the Reliability Center Business Development Manager at the College of Nanoscale Science and Engineering (CNSE), Albany, NY, blogs about the potential of resistive memory and the reliability challenges the must be overcome.


Low-power chip for intra-cardiac ventricular fibrillation detection presented at ISSCC 2013

Wed, 2 Feb 2013

Imec demonstrated a low-power (20µW), intra-cardiac signal processing chip for the detection of ventricular fibrillation at this week’s International Solid State Circuits Conference (ISSCC 2013) in San Francisco with Olympus.


Imec demonstrates low power beamforming transceiver chipset

Wed, 2 Feb 2013

New advancement enables the development of low-power, low-cost, high-data rate solutions for true mobile devices.


Leti to coordinate European supply chain in silicon photonics

Wed, 2 Feb 2013

CEA-Leti today announced that it will coordinate a four-year project aimed at building a European-based supply chain in silicon photonics and speeding industrialization of the technology.


Poongsan to partner with SEMATECH

Wed, 2 Feb 2013

Joint effort to explore novel process techniques to improve device performance and reliability in semiconductor manufacturing for sub 20nm technology node.


STMicroelectronics 28nm FD-SOI technology hits 3GHz operating speed

Wed, 2 Feb 2013

STMicroelectronics announced today another milestone in its testing of its 28nm FD-SOI Technology Platform.


2013: Beyond CMOS, steady growth and accelerating change across non-mainstream chip markets

Thu, 1 Jan 2013

Sensors and optoelectronics will continue to grow faster than the mainstream semiconductor market. We currently expect 9%-13% growth in these sectors in 2013, accompanied by rapid changes in technology and  market structures.


2013: 450mm is the next big opportunity

Thu, 1 Jan 2013

In semiconductor manufacturing, 450mm is the next big opportunity. Issues of economic scale and complexity will force fab designers, OEMs and process integrators to investigate all open avenues in the search for solutions to the huge challenges that accompany 450mm.


2013: The year of the diamond?

Thu, 1 Jan 2013

Recent advances in diamond applications (diamond-on-silicon, MEMS, optical) suggest that its utilization into a broader scope of commercial products is not far away.


2013: Outlook for secondary equipment

Thu, 1 Jan 2013

The multibillion-dollar secondary or used semiconductor equipment market has gone through significant changes over the past five years and has become increasingly sophisticated in its approach.


2013: Continued strength in 200mm

Thu, 1 Jan 2013

80 percent of the devices used for portable and mobile applications are currently manufactured on 200mm or smaller wafers. How this plays out going forward could change who the dominant players will be.


2013: Accelerating R&D and decreasing time to yield

Thu, 1 Jan 2013

In order to maintain profitability manufacturers must increase the productivity and return from their R&D investments.


Small, medium-size AMOLED displays doubling by 2015

Thu, 1 Jan 2013

Active matrix OLED (AMOLED) displays will continue to encroach upon LCD technology through small and medium-sized (9-in. and smaller) displays used in mobile phones, according to recent analysis by NPD DisplaySearch.


2013: Next-generation 3-D NAND flash technology

Wed, 1 Jan 2013

NAND flash has embarked on its own 3-D scaling program, whereby the stacking of bit cells allows continuous cost-per-bit scaling while relaxing the lateral feature size scaling.


2013: Facing unprecedented precision engineering challenges

Wed, 1 Jan 2013

Unprecedented precision engineering will be needed to manufacture chips features measured in nanometers.  At these dimensions every atom counts and controlling variability is vital to meet performance and productivity targets.


2013: Multiple inflection points provide opportunity to extend benefits of Moore’s Law

Wed, 1 Jan 2013

While solutions are available to extend Moore’s Law, these solutions come at considerable increases in cost and complexity. As it has in the past, this industry will find more innovative solutions to overcome the challenges of inflection.


2013: Building the internet of things with MEMS and 3D advances

Wed, 1 Jan 2013

It is becoming increasingly clear that new MEMS and 3D high-volume, low-cost manufacturing technologies will accelerate a radical change to society’s cyber skyline.


2013: Look for continued consolidation

Wed, 1 Jan 2013

In 2013, it is anticipated that M&A transaction activities will increase and result in further consolidation of the semiconductor supply chain.


2013: The beginning of the next IC industry upturn

Wed, 1 Jan 2013

2013 will mark the beginning of the next cyclical upturn—one in which the IC market CAGR will more than triple to 7.4% in the 2012-2017 time period.


2013: Fab Equipment Spending Shrinks Back to Flat

Wed, 1 Jan 2013

The SEMI Consensus Forecast and the SEMI World Fab Forecast, with data collected from two different methodologies, point to the same conclusion: 0% growth for 2013.


Global forecast and analysis of GaN semiconductor market released

Wed, 2 Feb 2013

Today, Research and Markets released the Gallium Nitride (GaN) Semiconductor Devices (Discretes & ICs) Market, Global Forecast & Analysis: 2012 – 2022.


Global market for MEMS microphone to more than double in five years

Wed, 2 Feb 2013

The global market for MEMS microphones has reached approximately $422 million in 2012. The market is predicted to increase to $865 million in 2017.


ISSCC 2013: Radio frequency trends

Tue, 2 Feb 2013

Andreia Cathelin, subcommittee chair, reflects on the trends of radio frequency design and usage in her submission to ISSCC.


10 IC product segments to exceed total IC market growth in 2013

Tue, 2 Feb 2013

Tablet and cellphone processors, NAND flash, and telecom-specific ICs to enjoy best growth.


Solid state thin film batteries market worth $6 Billion by 2019

Tue, 2 Feb 2013

Markets for solid state thin-film batteries at $65.9 million in 2012 are anticipated to reach $5.95 billion by 2019, according to a new report released by ReportsnReports.com.


Silicon wafer revenues decline in 2012

Tue, 2 Feb 2013

Worldwide silicon wafer revenues declined by 12 percent in 2012 compared to 2011, according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.


ISSCC 2013: Imagers, MEMS, medical and displays

Mon, 2 Feb 2013

Roland Thomas, subcommittee chair of ISSCC, writes of the substantial growth and future in key areas of technology.


Econometric Forecast: Semiconductor growth should recover by 2014

Fri, 2 Feb 2013

In the second of two installments, Linx Consulting reports a steady growth in semiconductor production, as released in The Econometric Semiconductor Forecast.


SEMI China releases Top Ten list of packaging and assembling facilities

Thu, 2 Feb 2013

Although many are small companies manufacturing low-pin count devices, all of the world’s “Top 10” OSAT, Outsourced Semiconductor Assembly and Test, players have one or more assembly and testing facilities in China.


Econometric Forecast: Regional developments to affect growth of semiconductor industry

Thu, 2 Feb 2013

In the first of two installments, we examine the global issues facing the semiconductor industry, as released by Linx Consulting in The Econometric Semiconductor Forecast.


Econometric forecasting service predicts 6% growth in semiconductor wafers in 2013

Thu, 2 Feb 2013

A new econometric semiconductor industry forecast predicts semiconductor wafer area production to grow slightly less than 6% in 2013, according to Linx Consulting.


TU Dresden realized 28nm low-power test chip with Tensilica processor and RacyICs power management

Wed, 2 Feb 2013

Technische Universität (TU) Dresden announced Monday the successful initial operation of a low-power test chip featuring a Tensilica Xtensa LX4 DSP equipped with RacyICs power management IP implemented in GLOBALFOUNDRIES' advanced 28nm Super Low Power, or SLP, technology.


ISMI to partner with Araca

Wed, 2 Feb 2013

SEMATECH announced today that Araca Inc., a leading provider of products and services for chemical mechanical planarization research and development, and the International SEMATECH Manufacturing Initiative (ISMI) are partnering to deliver CMP processing and productivity solutions to help chip manufacturers increase yields, reduce equipment downtime and lower consumables costs.


Looking for an integrated post-tapeout flow

Wed, 2 Feb 2013

Dr. Steffen Schulz discusses the role of a flexible platform for computational lithography in a successful business strategy.


Microchip unveils three new low-power devices

Tue, 2 Feb 2013

Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, announced an expansion of its SPI Flash memory portfolio yesterday.


Agilent Technologies commits $90 million gift of software to Georgia Institute of Technology

Tue, 2 Feb 2013

Agilent Technologies Inc. announced yesterday the intent to donate a $90 million in software to Georgia Institute of Technology, the largest in-kind software donation ever in its longstanding relationship with the university.


Dow Corning and IBM scientists develop new materials for board-level photonics

Tue, 2 Feb 2013

Dow Corning and IBM scientists unveiled a major step in photonics yesterday at the Photonics West conference, using a new type of polymer material to transmit light instead of electrical signals within supercomputers and data centers.


Despite surging demand from Apple, NAND market contracts in 2012

Tue, 2 Feb 2013

Global NAND flash memory market revenue fell 7 percent in 2012 as disappointing Ultrabook sales negated the impact of surging demand from Apple Inc. for its iPhone line, according to an IHS iSuppli Data Flash Market Tracker Report from information and analytics provider IHS (NYSE: IHS).


Semiconductor R&D spending rises 7% despite weak market

Tue, 2 Feb 2013

Spending on research and development by semiconductor companies grew 7% in 2012 to a record-high $53.0 billion, even though the semiconductor market declined 1% to $317.6 billion.


Hard disk drive market revenue set for double-digit decline

Mon, 2 Feb 2013

Facing a relentless onslaught from tablets, smartphones and solid state drives (SSD), global hard disk drive (HDD) market revenue in 2013 will decline by about 12 percent this year, according to IHS.


FAME center to focus on advanced electronics

Mon, 2 Feb 2013

Five University of California, Riverside professors will receive a total of $5 million as part of a $35 million research center aimed at developing materials and structures.


New research to improve efficiency, fabrication of optoelectronics

Fri, 2 Feb 2013

Scientists at RTI International are advancing the state of science in electronic devices for optical systems by using superlattice structures to optimize the performance of germanium optical detectors on silicon chips.


Japan Prize awarded for chemically amplified resists

Thu, 1 Jan 2013

C. Grant Willson and Jean M.J. Fréchet won the Japan Prize, an international award similar to the Nobel Prize, for their work on chemically amplified resists. 


KLA-Tencor announces new e-beam inspection system

Wed, 1 Jan 2013

KLA-Tencor Corporation (NASDAQ: KLAC) announced the eS805, a new electron-beam inspection system capable of detecting very small defects, and defects that cause electrical problems.


GSA adds three members to board of directors

Wed, 1 Jan 2013

The Global Semiconductor Alliance (GSA) announced the appointment of three new members to the GSA Board of Directors.


SEMI honors JC Kim with SEMI Sales and Marketing Excellence Award

Wed, 1 Jan 2013

SEMI announced that Joung Cho (JC) Kim, chairman, Edwards Korea Limited, is the recipient of the 14th annual SEMI Sales and Marketing Excellence Award.


Gigaphoton achieves maximum 20W EUV light source output

Mon, 2 Feb 2013

Gigaphoton, Inc., a major lithography light source manufacturer, announced today that the company has achieved EUV light output equivalent to maximum of 20W for its laser-produced plasma, or LPP light sources for EUV lithography scanners.


Shimadzu introduces high-sensitivity gas chromatograph

Mon, 2 Feb 2013

Shimadzu Corporation today introduced the Tracera, a high-sensitivity gas chromatograph. Tracera is equipped with the newly developed barrier discharge ionization detector BID, which is capable of detecting all types of trace organic and inorganic compounds.


ISSCC 2013: High-performance digital trends

Mon, 2 Feb 2013

Subcommittee chair Stefan Rusu of Intel in Santa Clara, CA will present on trends in high-performance digital. The relentless march of process technology, he says, brings more integration and performance.


ISSCC 2013: Memory trends

Fri, 2 Feb 2013

Kevin Zhang, subcommittee chair of ISSCC, writes on the trends of memory devices for 2013 and beyond.


STMicroelectronics and Hyundai Autron cooperate to develop integrated products for next-generation vehicles

Fri, 2 Feb 2013

Joint effort will drive innovative engine-train and smart-power products


APIX Technology introduces gas chromatography device based on silicon nano-scale components

Thu, 2 Feb 2013

GCAP targets a range of industrial applications as well as research labs, advanced gas analysis and biomedical screening.


SEMI announces Silicon Innovation Forum to bridge funding gaps for early-stage companies

Thu, 2 Feb 2013

SEMI, in collaboration with strategic investing groups throughout the global semiconductor industry, has announced the Silicon Innovation Forum, or SIF, to bridge funding gaps for new and early-stage companies with valuable semiconductor manufacturing and technology solutions.


Engineers at University of Buffalo develop hyperbolic metamaterial waveguide

Thu, 2 Feb 2013

By creating a material that slows light, engineers open new possibilities in solar energy, military technology and other fields of research.


ISSCC 2013: Wireless trends

Thu, 2 Feb 2013

David Su, ISSCC subcommittee chair, writes on the trends of modern wireless standards.


ISSCC 2013: Analog trends

Thu, 2 Feb 2013

Bill Redman-White, chair of the ISSCC Analog Subcommittee, shares on challenges facing analog systems in 2013.


SEMATECH and Cabot Microelectronics to collaborate

Thu, 2 Feb 2013

Cabot will collaborate with SEMATECH to develop advanced solutions for emerging CMP applications.


SRC, DARPA unveil university research center network

Thu, 1 Jan 2013

Semiconductor Research Corporation (SRC) and the Defense Advanced Research Projects Agency (DARPA) announced that $194 million will be dedicated during the next five years to STARnet, which encompasses six new university microelectronics research centers.


ISS 2013: Semiconductor leaders see massive industry transformation

Tue, 1 Jan 2013

The rise in mobile computing, changes to the fabless-foundry model, uncertainties in technical innovation, and global macroeconomic trends are becoming the dominant forces in 2013 and beyond, according to industry leaders speaking at this week's SEMI Industry Strategy Symposium (ISS).


CES: Phablets and table PCs break the PC mold

Fri, 1 Jan 2013

Among the usual confluences of useful and cool gadgets (not to mention bizarre) at this week's annual Consumer Electronics Show in Las Vegas, two types of devices with new formfactors aimed to rethink the PC model.


By the numbers: The rise of fabless IC sales, 1999-2010 and beyond

Thu, 1 Jan 2013

Fabless IC suppliers saw sales rise 6% in 2012, again outperforming IDMs and the total IC market, and by 2017 fabless ICs will make up a full third of the overall market, says IC Insights.


CES 2013: The brains behind smart devices are front and center

Wed, 1 Jan 2013

Components are prominent this year, on the main stage, and the CES exhibit floors.Todd Traylor of Smith & Associates reports.


SEMI approves first HB-LED standards

Wed, 1 Jan 2013

SEMI's HB-LED Standards Committee has approved its first standard, specifying sapphire wafers used in making high-brightness light-emitting diode (HB-LED) devices.


The gleam of well-polished sapphire

Tue, 1 Jan 2013

Is it time for high-brightness LED manufacturing to get serious about process control?  If so, what lessons can be learned from traditional, silicon-based integrated circuit manufacturing?


Innovations in computational lithography for 20nm

Tue, 1 Jan 2013

Several innovations in computational lithography have been developed in order to squeeze every possible process margin out of the lithography/patterning process.  In this blog, Gandharv Bhatara of Mentor Graphicsl talks about two specific advances that are currently in deployment at 20nm.


Cymer hires AMAT roadmap exec to lead EUV development

Tue, 1 Jan 2013

Klaus Schuegraf, former exec at Applied Materials responsible for the company's semiconductor products technology roadmap, will now lead Cymer's EUV engineering and development programs.


Look for 4K LCDs, OLEDs at CES

Mon, 1 Jan 2013

As the annual Consumer Electronics Show and hordes of techie enthusiasts descends over Las Vegas this week, NPD DisplaySearch revisits the battle between two display technologies -- 4K × 2K vs. OLEDs.


2013: Advanced chemistry moves center stage

Fri, 1 Jan 2013

We are in an age where chemistry is center stage in the race to advance Moore’s Law and More Than Moore.


IDC: Semiconductor revenues will grow 4.9% in 2013

Fri, 1 Jan 2013

The International Data Corporation is forecasting that semiconductor revenues worldwide will improve by 4.9% to $319 billion in 2013 and log a compound annual growth rate (CAGR) of 4.1% from 2011-2016.


2013: Healthy revenue growth, but capex likely flat

Fri, 1 Jan 2013

Based on current indications, capital spending would seem to be flat in 2013.  However, Semico predicts healthy revenue growth this year, which may encourage more spending, particularly in the second half of the year.  This may bring total capex for 2013 into the positive range.


2013: An economic outlook for the global IC market

Thu, 1 Jan 2013

Predictions for 2013 show several notable trends: overall silicon area growth for 2013 should average approximately 6%; the first quarter and the second half are likely to show slower growth than the second quarter; and the modest growth forecast for 2013 is predominantly demand driven.


2013: The New New York

Thu, 1 Jan 2013

New York represents Exhibit A of a new way of thinking; a true 21st century model for technology, workforce and economic development.


Analyst: Chip inventory at semiconductor suppliers reaches worrisome high

Tue, 1 Jan 2013

Chip inventory held by semiconductor suppliers reached alarmingly high levels in the third quarter of 2012 amid weak market conditions, according to an IHS iSuppli Semiconductor Inventory Insider Market Brief.


Opinion: Managing process variations

Tue, 1 Jan 2013

Dr. Zhihong Liu, Executive Chairman, ProPlus Design Solutions, blogs about dealing with increased random variations and layout-dependent effects.


Newport introduces long-lived deep UV excimer laser mirrors

Tue, 1 Jan 2013

Newport Corporation introduced long-lived deep ultraviolet (UV) excimer laser mirrors with projected lifetimes greater than 30 billion pulses.


Foreign acquisitions are just the beginning of China’s global ambition

Tue, 1 Jan 2013

China’s rapid transition from a low-cost manufacturing hub to an innovation hotspot with growing foreign ambitions represents both a threat and an opportunity for companies and investors around the globe, according to Lux Research.


Cadence unveils Virtuoso Advanced Node for 20nm design

Tue, 1 Jan 2013

Cadence Design Systems, Inc. announced the availability of Virtuoso® Advanced Node, a new set of custom/analog capabilities designed for the advanced technology nodes of 20nm and below.


1/f noise measurement system unveiled

Tue, 1 Jan 2013

ProPlus Design Solutions announced it is shipping a new wafer-level, 1/f noise measurement system. Increasingly, circuit designers are interested in 1/f noise data at higher frequencies.


Process Watch: Exploring the dark side

Fri, 1 Jan 2013

A particle as small as three microns in diameter, attached to the back side of the wafer—the dark side, if you will—can cause yield-limiting defects on the front side of the wafer during patterning of a critical layer.


SIA's 2013 policy priorities: Protect IP, relax exports, more funding

Thu, 1 Jan 2013

Protecting intellectual property, protecting federal funding for R&D, and enabling friendlier export, tax, and other policies are the top priorities for the Semiconductor Industry Association (SIA) in 2013.


Is Apple changing its mind on touch panel structures?

Tue, 1 Jan 2013

Reports are circling around Apple's supply chain of a potential shift in the company's display technology for its future iPhones and iPads -- moving back to LCDs and away from touch panels -- but a drastic realignment of its supply chain is probably not likely, observes DisplaySearch.


Fraunhofer IAP opens pilot line for organic electronics

Tue, 1 Jan 2013

The Fraunhofer Institute for Applied Polymer Research (IAP) in Potsdam-Golm and fab/cleanroom developer MBRAUN have commissioned a new "near industrial-scale" pilot line for organic light-emitting diodes (OLEDs) and organic solar cells.


LED manufacturing investment declines as industry contemplates future directions

Fri, 1 Jan 2013

Spending on LED fab manufacturing equipment will decline 9.2% in 2013 as the industry faces weak long-term demand and consolidates manufacturing capacity.


Samsung grabs No.3 foundry spot on smartphone dominance

Thu, 1 Jan 2013

In the ranks of top foundries, there's a new Number Three in town: Samsung, which climbed up the ranks again in 2012 thanks to its ubiquity in smart phone technology, according to updated rankings by IC Insights.


IBM team wins Feynman Prize for scanning probe microscopy

Thu, 1 Jan 2013

IBM Researchers won the prestigious Feynman prize given by the Foresight Group. The team was the first to produce images detailed enough to identify the structure of individual molecules, as well as metal-molecule complexes.


World’s most complex 2d laser beamsteering array demonstrated

Thu, 1 Jan 2013

DARPA researchers have recently demonstrated the most complex 2-D optical phased array ever. The array, which has dimensions of only 576µm x 576µm is composed of 4,096 (64 x 64) nanoantennas integrated onto a silicon chip.


Report: "Glaring imbalances" in printed electronics venture funding

Thu, 1 Jan 2013

Printed, flexible, and organic electronics have garnered more than $7.5 billion in venture funding from 1996-2011, though it's declined sharply since 2007. A new Lux Research report looks at who's getting attention and who's not.


Five IC suppliers to hold one-third of 300mm wafer capacity in 2013

Wed, 2 Feb 2013

Samsung tops list; IC foundries expected to show biggest capacity gains through 2017.


Researchers create semiconductor 'nano-shish-kebabs' with potential for 3-D technologies

Wed, 2 Feb 2013

Researchers at North Carolina State University have developed a new type of nanoscale structure that resembles a “nano-shish-kebab,” consisting of multiple two-dimensional nanosheets that appear to be impaled upon a one-dimensional nanowire.


Production process doubles speed and efficiency of flexible electronics

Wed, 2 Feb 2013

Stretched-out clothing might not be a great practice for laundry day, but in the case of microprocessor manufacture, stretching out the atomic structure of the silicon in the critical components of a device can be a good way to increase a processor's performance.


Global SiC semiconductor devices market to grow at a CAGR of 31.6% during 2012-2016

Tue, 2 Feb 2013

One of the key factors contributing to this market growth is the high demand of SiC in industrial applications. The global SiC semiconductor devices market has also been witnessing rapid technological advancement. However, the fluctuations in demand and supply could pose a challenge to the growth of this market.


Energy-Efficiency Trends

Tue, 12 Dec 2012

Analog Trends

Tue, 12 Dec 2012

RF Trends

Tue, 12 Dec 2012

Large-Area Flexible Electronics Trends

Tue, 12 Dec 2012

Imagers, MEMs, Medical & Displays

Tue, 12 Dec 2012

ISSCC 2013 Slideshow: Highlights

Tue, 2 Feb 2013

ISSCC, the International Solid-State Circuits Conference, is being held on February 17-21, 2013, at the San Francisco Marriott Marquis Hotel. This year, in honor of the conference’s 60th anniversary, we have assembled highlights of the topics and trends that are being discussed.


Memory Trends

Tue, 12 Dec 2012

DRS Technologies and Cypress Semiconductor reach agreement to manufacture uncooled detectors

Tue, 2 Feb 2013

DRS Technologies, Inc., a Finmeccanica Company, and Cypress Semiconductor Corp. (NASDAQ: CY) today announced that DRS will transfer its Microbolometer technology for uncooled infrared detectors to Cypress for high-volume manufacturing.


MRAM/STTMRAM and PCM forecasted to represent a $1.6B business by 2018

Tue, 2 Feb 2013

Yole Développement’s report provides an analysis of the emerging Non Volatile Memories (NVM) five applications fields that will fuel market growth and a description and forecasts of the four emerging NVM (MRAM, PCM, RRAM, FeRAM) technologies.


Intersil Corporation to cut 18% of workforce

Tue, 2 Feb 2013

Intersil Corporation today announced restructuring initiatives designed to prioritize the company's sales and development efforts, strengthen financial performance and improve cash flow.


300-millimeter thin-wafer products by Infineon now being shipped worldwide

Tue, 2 Feb 2013

In February, Infineon received the first customer go-aheads for products of the CoolMOS family produced by the 300-millimeter line at their site in Villach, Austria.


SPIE Advanced Lithography will bring industry focus to next-generation tools and systems

Tue, 2 Feb 2013

SPIE Advanced Lithography, the annual forum for discussions on state-of-the-art lithographic tools, resists, metrology, materials characterization, and design and process integration, will bring the community together in San Jose, California, next week to address those challenges.


SEMATECH to demonstrate advances and technical breakthroughs at SPIE 2013

Tue, 2 Feb 2013

Papers showcase EUV extendibility and metrology techniques for defect inspection and 3D TSVs.


GaN Systems expands with new UK location

Tue, 2 Feb 2013

New marketing and technical support center opened in Reading, UK.


Qualcomm processor first to use TSMC’s 28 HPM advanced process technology

Tue, 2 Feb 2013

Snapdragon 800 processor on 28nm HPM process delivers high performance and low power for mobile devices.


Messe Düsseldorf and ESNA Coorperation to address fast-growing printed electronics market

Tue, 2 Feb 2013

Messe Düsseldorf and ESNA have formed a cooperation to address the printed electronics market by organizing a new tradeshow, PEPSO.


New Product: Engineered Material Systems introduces die attach for temperature-sensitive applications

Tue, 2 Feb 2013

Engineered Material Systems, a global supplier of electronic materials for circuit assembly applications, debuts its DB-1568-1 low-temperature cure die attach adhesive for attaching semiconductor die in temperature-sensitive devices.


Infographic: Computers with human senses

Tue, 2 Feb 2013

We are entering the era of cognitive systems, where electronic devices will mimic the human senses—in their own way, to see, smell, touch, taste and hear. IBM assembled this infographic to illustrate what they call the “5 in 5,” five innovations that will change our lives within five years.


New Product: KLA-Tencor announces two new litho/etch process control tools

Tue, 2 Feb 2013

New metrology and inspection products facilitate advanced patterning techniques for manufacturing sub-20nm memory and microprocessor chips.


Molecular Imprints’ advanced lithography platform uses Xaar printheads to pattern 450mm wafers

Tue, 2 Feb 2013

Molecular Imprints, Inc. (MII), a developer of advanced semiconductor lithography, has announced the delivery of an advanced lithography platform which uses Xaar 1001 inkjet printheads to pattern 450mm silicon wafer substrates.


SEMATECH’s Bryan Rice named 2013 SPIE Fellow

Tue, 2 Feb 2013
SEMATECH announced today that Dr. Bryan J. Rice, on assignment from Intel Corporation as SEMATECH’s director of Strategic Initiatives, was inducted as a 2013 Fellow by SPIE, the international society for optics and photonics, during its annual SPIE Advanced Lithography conferences in San Francisco, CA.


Lux Research names top firms in LEDS and power electronics

Tue, 2 Feb 2013

As power electronics grow to $15 billion and LEDs to $100 billion, Lux Research identifies the leading technology companies addressing these markets.


Rise of smartphones reshapes competitive order in the cellphone chip market

Mon, 2 Feb 2013

The competitive landscape of the cellphone core integrated circuit (IC) business has completely transformed over the past five years, with Qualcomm Inc. and Samsung capitalizing on the rise of smartphones and 4G.


DNP and Luminescent Technologies achieve milestone in development of metrology and inspection program

Mon, 2 Feb 2013

Luminescent Technologies Inc., a provider of computational metrology and inspection solutions for the global semiconductor manufacturing industry, and Dai Nippon Printing Company, Ltd. announced today the successful completion of the first phase of a three-year joint development program for computational metrology and inspection using Luminescent’s Automated Image Processing Hub (LAIPH) platform.


Toshiba develops CMOS image sensor for small and low power applications

Mon, 2 Feb 2013

Toshiba Corporation announced the development of a CMOS image sensor with a small area and low power pixel readout circuits. A sample sensor embedded with the readout circuits shows double the performance of a conventional one. Toshiba presented this development at ISSCC 2013 in San Francisco, CA on Feb. 20.


Toshiba develops low power technology for embedded SRAM

Fri, 2 Feb 2013

-27% active power reduction and 85% standby power reduction is confirmed at International Solid-State Circuits Conference 2013.


eMemory’s eNVM SIPs reach 5 million wafer production record

Wed, 3 Mar 2013
eMemory announced today that the accumulated number of customers’ wafers incorporating eMemory’s eNVM SIPs have now surpassed 5 million production mark.

Fab Spending Forecast: Equipment spending is expected to remain flat in 2013

Wed, 3 Mar 2013

Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase.


Dongbu HiTek and Cortus to develop platform for the MCU market

Tue, 3 Mar 2013

Korean foundry Dongbu HiTek and French IP provider Cortus are to develop a design platform combining Dongbu HiTek’s embedded flash technology and Cortus processor and peripheral IP.


Toshiba develops intelligent, wearable vital signs sensor module

Tue, 3 Mar 2013

Toshiba Corporation today announced that it has developed an intelligent vital signs sensor module: Smart healthcare Intelligent Monitor Engine and Ecosystem with Silmee, that simultaneously senses information on key vital signs, Electric Cardio Gram, pulse, body temperature and movements, and that can deliver the data to smartphones and tablet PCs with wireless technology.


EV Group to develop equipment to enable covalent bonds at room temperature

Tue, 3 Mar 2013

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is developing equipment and process technology to enable covalent bonds at room temperature.


Peregrine Semiconductor to license its UltraCMOS design to Murata

Tue, 3 Mar 2013

Peregrine Semiconductor Corporation, a fabless provider of high-performance radio frequency integrated circuits (RFICs), yesterday announced plans to collaborate with Murata Manufacturing Company on a multisource arrangement for RF switches and other components based on Peregrine’s proprietary UltraCMOS technology


Samsung issues apology for fatal acid spill at its Korean semiconductor plant

Mon, 3 Mar 2013

Samsung Vice-President Kwon Oh-hyun released a statement today, apologizing for the fatal hydrofluoric acid spill that left one worker dead and four others injured.


Deposition Sciences increases photolithography patterning capacity

Mon, 3 Mar 2013

New 200 mm diameter wafer enhances photolithography capability.


Coherent introduces highest power ultrafast laser for materials processing

Mon, 3 Mar 2013

Coherent, Inc. has expanded its family of industrial ultrafast lasers with the new Talisker 1000 series. This new series of high power picosecond lasers is designed for high-throughput, precision materials processing applications in the semiconductor, solar (photovoltaics), medical devices, consumer electronics and automotive industries.


Semiconductor sales rose in January

Mon, 3 Mar 2013

Worldwide sales of semiconductors were $24.05 billion the month of January, up 3.8% from January 2012 and down 2.8% from December 2012, according to the Semiconductor Industry Association (SIA).


World Semiconductor Trade Statistics predicts worldwide semiconductor market to rebound in 2013

Fri, 3 Mar 2013

After experiencing a slowdown in 2012, the global semiconductor market is set for growth. The World Semiconductor Trade Statistics predicts the global semiconductor market to grow by 4.5% in 2013 after declining 3.2 percent in 2012.


GEO Semiconductor to partner with Tensoft

Fri, 3 Mar 2013

Tensoft's web-based product will streamline operations for recently-acquired product line.


U.S. PVMC and NREL to partner on development of thin film PV cells and modules

Thu, 3 Mar 2013

The U.S. Photovoltaic Manufacturing Consortium (PVMC), an industry-led collaboration headquartered in New York at the SUNY College of Nanoscale Science and Engineering (CNSE), has partnered with the U.S. Department of Energy’s National Renewable Energy Laboratory (NREL) to improve manufacturing processes for thin film CIGS photovoltaic (PV)  cells and modules, including products, metrology and reliability that will support the U.S. solar industry in the development, manufacturing, and commercialization of next-generation solar PV systems.


Seven opto-sensor-discrete products achieved record sales in 2012

Thu, 3 Mar 2013

O-S-D’s marketshare of total semiconductor sales in 2012 was highest since 1991. Seven O-S-D product categories and device groups reached record-high sales in 2012 compared to 14 new records being set in 2011, according to data shown in the 2013 edition of IC Insights’ O-S-D Report.


Yoon-Woo Lee of Samsung Electronics to give keynote address at The ConFab 2013

Wed, 3 Mar 2013

Solid State Technology is proud to announce that Yoon-Woo Lee will be speaking at The ConFab 2013. The event will be held June 23-26, 2013 at The Encore at The Wynn in Las Vegas. Lee is the Executive Advisor of Samsung Electronics.


Intel leads unexpectedly large decline in semiconductor market inventory

Wed, 3 Mar 2013

After reaching a worrisome high in the third quarter of 2012, global semiconductor inventories held by chip suppliers fell at a surprisingly fast rate in the fourth quarter, led by dramatic reductions for market leader Intel Corp.


EV Group ships 300mm wafer bonding system to leading Chinese semiconductor foundry

Wed, 3 Mar 2013

Foundry to use wafers for 3D IC and advanced packaging volume production applications.


Avago MEMS Filter: The highest volume production MEMS using TSV

Wed, 3 Mar 2013

System Plus Consulting analyzed a BAW MEMS Filter manufactured by Avago Technologies, assessing its manufacturing process, costing results and breakdown. With more than 1 billion units produced per year and a market share of 65%, System Plus Consulting found that Avago Technologies clearly dominates the BAW filter market. Avago BAW filters are all-silicon MEMS devices manufactured with Avago's FBAR and Microcap technologies.


Is the power electronics industry a world apart?

Wed, 3 Mar 2013

In the power electronics field, the fabless business model is not as common compared to the MEMS industry. For example, most power electronics players have their own capabilities/fabs dedicated mainly to silicon wafer manufacturing. According to Yole Développement, $4B was generated by MEMS fabless companies in 2012, against less than $300K in the power electronics area. Is power electronics a world apart?


New Product: Hiden launches integration of on-board timers

Tue, 3 Mar 2013

Hiden announced this week the integration of on-board timers for real-time pulsed plasma measurement, the fast gating fully controllable within the MASsoft operating program. Two timers provide “gate open/close” and “gate increment” periodicity with sub-microsecond gating resolution to just 100 nanoseconds, phasing data acquisition precisely with each individual plasma pulse.


ATLIS Semiconductor selected as IBM Microelectronics’ long-term foundry partner for 180nm SOI technology

Tue, 3 Mar 2013

ALTIS Semiconductor, a global specialty foundry based in France, announced today the finalization of a foundry agreement with IBM Microelectronics. Under the terms of this agreement, ALTIS will be the foundry partner for the IBM 180nm SOI technology. ALTIS will deliver high volume products starting Q2 2013 and will secure capacity increase for 2014 and beyond to address the IBM forecasted demand.


OKI delivers exhaust gas treatment equipment for ON Semiconductor’s European plants

Tue, 3 Mar 2013

OKI Engineering, provider of reliability evaluations and environmental conservation technologies for the OKI Group, recently delivered KGT-3MM-AP exhaust gas treatment equipment for atmospheric pressure CVD manufacturing equipment to semiconductor manufacturer ON Semiconductor's European plants.


Intersil Corporation appoints Necip Sayiner President and CEO and Mercedes Johnson as Interim CFO

Tue, 3 Mar 2013

Intersil Corporation this week announced major staff changes, with the appointment of new president and CEO and interim CFO.


Cadence to acquire Tensilica

Tue, 3 Mar 2013

Cadence Design Systems, Inc. today announced plans to aquire Tensilica, Inc. for approximately $380 million in cash. Tensilica had approximately $30 million of cash as of December 31, 2012.


DRAM content growth in PCs slows

Tue, 3 Mar 2013

PC capabilities and market are undergoing a historical deceleration, in another sign of shifting technology markets.


Georgia Tech’s research on improving energy storage

Thu, 2 Feb 2013

Neutron scattering technique provides new data on absorption of ion in microporous materials.


GLOBALFOUNDRIES enhances 55nm CMOS logic process

Thu, 2 Feb 2013

55nm LPe 1V is optimized for ultra-low power, reduced cost and improved design flexibility.


India's efforts to appeal to semiconductor manufacturers

Thu, 2 Feb 2013

This week, India’s Finance Minister P Chidambaram offered incentives to chip makers to set up headquarters in India, in an effort to encourage local electronics manufacturing. However, the response from the industry has been less than positive. Many believe that is it is a good start, but far from sufficient.


A single European semiconductor strategy is on its way

Thu, 2 Feb 2013

STM, Imec, CEA-LETI, ASML, Soitec and EU representatives discussed directions at ISS Europe 2013 in Italy.


Brooks Instrument to launch new mass flow controller at SEMICON China

Thu, 2 Feb 2013

Brooks Instrument, a provider of flow measurement and control instrumentation to the microelectronics industry, will launch the GF135 pressure transient insensitive (PTI) mass flow controller at SEMICON China, March 19-21 at Shanghai New International Expo Center.


Researcher finds faster, more efficient technique for creating high-density ceramics

Wed, 2 Feb 2013

A researcher from North Carolina State University has developed a technique for creating high-density ceramic materials that requires far lower temperatures than current techniques – and takes less than a second, as opposed to hours. Ceramics are used in a wide variety of technologies, including body armor, fuel cells, spark plugs, nuclear rods and superconductors.


New Product: Mentor Graphics launches cell characterization and analysis platform

Wed, 2 Feb 2013

Mentor Graphics Corp. today announced availability of the Kronos Cell Characterization and Analysis platform. The Kronos platform quickly produces accurate performance models for standard cells, I/Os, and complex cells within an advanced, integrated environment.


Altera to build FPGAs on Intel’s 14nm tri-gate technology

Wed, 2 Feb 2013

Intel announced Monday a major move to expand its foundry business. Altera Corporation and Intel Corporation have entered into an agreement for the future manufacture of Altera FPGAs on Intel's 14nm tri-gate transistor technology.


Expert group seeks to advise European Commission on advancement of KETs

Wed, 2 Feb 2013

The global market in Key Enabling Technologies (KET) is forecast to grow from about 650 billion euro in 2008 to over one trillion euro in 2015. In response to this growth, top professionals in fields utilizing KETs have formed an expert group to assist the European Commission in the implementation of the strategy to boost the industrial production of KETs-based products in Europe.


Emerging technologies create strong opportunity for automotive ICs

Wed, 2 Feb 2013

New automotive technologies that go beyond touchscreens, satellite radio, and voice-activated GPS commands are being tested and improved, and will soon begin to appear in many more new car models, resulting in solid growth for the automotive IC market through 2016.


World’s first GaN-based high power converter to be demonstrated at APEC 2013

Wed, 2 Feb 2013

Transphorm Inc. today announced at the 2013 ARPA-E Energy Innovation Summit that its novel 600V Gallium Nitride (GaN) module has enabled the world’s first GaN-based high power converter. Transphorm will demonstrate the product built with its customer-partner Yaskawa Electric, Japan at the upcoming APEC 2013 industry conference.


LFoundry to acquire Micron manufacturing plant

Wed, 2 Feb 2013

LFoundry, an analog mixed signal and specialized technologies foundry, today announced that it has entered into an agreement with Micron Technology, Inc. (NASDAQ: MU) to acquire Micron Technology Italia, Srl. and all of its semiconductor fabrication facility assets in Avezzano, Italy.


DFM Services in the Cloud

Wed, 2 Feb 2013

Joe Kwan is the Product Marketing Manager for Calibre LFD and DFM Services at Mentor Graphics. He is also responsible for the management of Mentor’s Foundry Programs. He previously worked at VLSI Technology, COMPASS Design Automation, and Virtual Silicon. Joe received a BA in Computer Science from the University of California Berkeley and an MS in Electrical Engineering from Stanford University.


Connecting the (quantum) dots

Tue, 2 Feb 2013

New spin technique moves researchers at the University of Pittsburgh and Delft University of Technology closer to creating the first viable high-speed quantum computer.


Imec VP of Process Technology to present on CMOS scaling at The ConFab 2013

Mon, 3 Mar 2013

Solid State Technology is pleased to announce that Dr. An Steegen, Senior Vice President of Process Technology at imec, will be presenting on CMOS scaling by 10nm at The ConFab 2013. In her presentation, Steegen will explain the paradigm shift underway in the semiconductor industry, where chip scaling is possible with the right materials and new design architectures to enable tomorrow’s smart systems.


SPIE volunteers urge Congress to boost jobs, economy through photonics support

Mon, 3 Mar 2013

Volunteers sponsored by SPIE, the international society for optics and photonics, were in Washington, D.C., last week to thank Congressional representatives for recent support for photonics R&D and to urge future support for in several key areas vital to economic growth and scientific progress.


Sidense qualifies 1T-OTP non-volatile memory for MagnaChip 180nm mixed-signal and HV CMOS process

Mon, 3 Mar 2013

MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, and Sidense Corp., a developer of logic non-volatile memory one-time programmable (OTP) memory IP cores today announced that Sidense's SLP 1T-OTP macros have been fully qualified for MagnaChip's 180nm 1.8/3.3/18V high-voltage CMOS and mixed-signal process.


IME to address copper interconnects reliability issues at Copper Wire Consortium

Mon, 3 Mar 2013

The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR) in Singapore, has launched the Copper (Cu) Wire Bonding Consortium II. The consortium which rides on the successes of Phase I launched in 2010 aims to improve the reliability of semiconductor devices by tackling copper wire bonding issues related to corrosion and stress.


Leading photonics and laser researchers to present latest work at SPIE Optics and Optoelectronics

Fri, 3 Mar 2013

Advances in petawatt photonics, laser systems, optical sensing, holography, metamaterials, nonlinear and quantum optics, and related topics will be presented by leading experts at SPIE Optics + Optoelectronics in Prague next month. The weeklong conference will also feature sessions for industry and presentation of three prestigious awards from the International Commission for Optics (ICO).


Demand for exports will allow semiconductor industry to maintain modest revenue growth

Fri, 3 Mar 2013

Over the past five years, revenue dipped and spiked from the impact of the global recession; in the five years to come, increased offshoring will detract from the growth in global demand from an improved economy.


DELTA Microelectronics to partner with ChipStart

Fri, 3 Mar 2013

ChipStart LLC, a provider of semiconductor intellectual property (SIP), and DELTA Microelectronics, a provider of ASIC services for the semiconductor industry, announced a new joint venture this week.


North American semiconductor equipment industry posts February 2013 book-to-bill ratio of 1.10

Fri, 3 Mar 2013

North America-based manufacturers of semiconductor equipment posted $1.07 billion in orders worldwide in February 2013 (three-month average basis) and a book-to-bill ratio of 1.10, according to the February Book-to-Bill Report published today by SEMI.  A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month.


Non-volatile memory market report: Drivers and challenges of emerging memory technologies

Fri, 3 Mar 2013

Next generation memories are the emerging non-volatile memory technologies, which are expected to replace existing memories. However, not all existing memories will be replaced.


STMicroelectronics requests ITC investigation of InvenSense

Tue, 3 Mar 2013

STMicroelectronics yesterday filed a complaint with the United States International Trade Commission (ITC). The complaint requests that the ITC initiate an investigation into the alleged infringement of five ST patents covering all of InvenSense, Inc.'s MEMS device offerings, as well as products from two of InvenSense's customers.


China’s RFID card market to nearly double to $807 million in 2017

Tue, 3 Mar 2013

The futuristic “Internet of Things” will more than double to 2.1 billion units, leading to a dramatic growth of domestic companies, says Lux Research.


AGC and nMode launch subsidiary to develop advanced packaging technology

Tue, 3 Mar 2013

Tokyo-based Asahi Glass Co., Ltd. and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1 million to co-found a subsidiary business, Triton Micro Technologies , to develop via-fill technology for interposers, enabling next-generation semiconductor packaging solutions using ultra-thin glass.


STMicroelectronics announces resignation of COO and Interim President, Didier Lamouche

Mon, 3 Mar 2013

STMicroelectronics announced today that Didier Lamouche, Chief Operating Officer, whose operational role was suspended when he took the assignment as President and Chief Executive Officer at ST-Ericsson in December 2011, has decided to resign from the company effective March 31, 2013 to pursue other opportunities.


OE automotive semiconductor market grew 12% in 2012

Mon, 3 Mar 2013

According to the latest analysis by Semicast Research, Renesas Electronics was again the leading vendor of semiconductors to the OE automotive sector in 2012, ahead of Infineon Technologies. STMicroelectronics retained its position as third largest supplier, with Freescale fourth and NXP fifth. Semicast calculates that revenues for OE automotive semiconductors grew by 12% to USD $25.5 billion in 2012, while the total semiconductor industry is judged to have declined by almost three percent to USD $292 billion.


Long-predicted atomic collapse state observed in graphene

Mon, 3 Mar 2013

Berkeley Lab researchers recreate elusive phenomenon with artificial nuclei; highly relevant for future nanoscle devices where electrical charge is concentrated into very small areas


Lattice announces world’s smallest FPGA

Mon, 3 Mar 2013

Lattice Semiconductor Corporation today announced the iCE40 LP384 FPGA, the smallest member of its iCE40 family of ultra-low density FPGAs. Enabling designers to rapidly add new features and differentiate cost-sensitive, space-constrained, low-power products, the new small footprint FPGA is ideal for applications such as portable medical monitors, smartphones, digital cameras, eReaders, and compact embedded systems.


MRAM: Disruptive technology for storage applications

Fri, 3 Mar 2013

Everyone wants faster access to stored data, and the issue is becoming critical with Big Data and cloud initiatives. With the speed of DRAM and the non-volatility of storage, Magnetoresistive Random Access Memory (MRAM) encourages a new way of thinking about storage applications. Storage is associated with longer latencies, but with MRAM storage can have similar latencies to memory. These capabilities and others make MRAM a catalyst for new thinking about how we design storage applications.


Digi-Key Corporation and MEMSIC announce global distribution agreement

Fri, 3 Mar 2013

Global electronic components distributor Digi-Key Corporation today announced the signing of a global distribution agreement with MEMSIC, a provider of MEMS sensor components, sophisticated inertial systems, and leading-edge wireless sensor networks.


STMicroelectronics proximity sensor solves smartphone hang-ups

Fri, 3 Mar 2013

Smartphones are set to become even more flexible and more satisfying to use, thanks to a unique sensor system developed by STMicroelectronics. Combining three optical elements in a single compact package, the VL6180 is the first member of ST’s FlightSense family and uses a new optical-sensing technology that reduces the incidence of dropped calls and enables innovative new user interactions with smartphones.


Nanoelectronics Conference will focus on semiconductor industry’s future

Fri, 3 Mar 2013

How the semiconductor industry can create the next generations of nanoscale computing technology will be one of the themes of the 2013 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics, to be held at the National Institute of Standards and Technology (NIST), March 25-28, 2013, at its campus in Gaithersburg, Md.


Broadcom tops three ABI Research wireless connectivity IC competitive assessments

Fri, 3 Mar 2013

Broadcom has been ranked number one vendor in three recent competitive assessments released by ABI Research on wireless connectivity IC markets. One was for overall wireless connectivity ICs, another on Bluetooth ICs, and a final on Wi-Fi ICs.


Mediatek trumps Qualcomm in RF with world’s smallest transceiver

Fri, 3 Mar 2013

ABI Research finds that Mediatek has delivered the world’s smallest multimode transceiver. Coming just a week after Qualcomm announced its intentions to produce RF front ends for high tier LTE smartphones, Mediatek releases the world’s smallest RF transceiver which is also the world’s first 40nm transceiver.


SRC, UCLA and ERC utilize atomic layer etch analysis to accelerate development of green chemistries

Thu, 3 Mar 2013

Researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, today announced development of a modeling process designed to simulate atomic-level etching with chemicals that are effective alternatives to widely used perfluorocarbon (PFC) gases.


Blog: Dimensional scaling and the SRAM bit-cell

Thu, 3 Mar 2013

Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. and Benjamin S. Louie of Zeno Semiconductor blog about dimensional scaling as it relates to EUV and future per transistor device cost.


Design for reliability of multi-layer thin film stretchable interconnects to be presented at ECTC

Thu, 3 Mar 2013

Most electronic systems that power our digital life are inflexible and flat. Rigid electronic designs work for our computers and phones but not for our bodies. Humans are soft and curved. Electronic systems capable of bending, twisting, and stretching have great potential for applications in which conventional, stiff semiconductor microelectronics would not suffice.


President of Semico Research will share the semiconductor economic outlook at The ConFab 2013

Wed, 3 Mar 2013

Solid State Technology is excited to have Jim Feldhan, President of Semico Research, present data and analysis from Semico’s MAP model, which provides insight into semiconductor revenues, units and wafer demand by computing, communications and consumer end markets.


GLOBALFOUNDRIES partners with ASML for chip tape-outs

Wed, 3 Mar 2013

Brion Technologies, a division of ASML, announced a major milestone today in its partnership with GLOBALFOUNDRIES. The companies are collaborating to deliver high-volume computational lithography capabilities for 28 nm and 20 nm tapeouts, while also accelerating the development of future nodes, including extreme ultraviolet (EUV) lithography.


PI miCos releases 2-axis precision linear translation stage for surface metrology

Wed, 3 Mar 2013

PI miCos announced the release of a new 2-axis precision linear translation stage. The new MCS XY precision linear stage was designed for industrial precision motion control and surface metrology applications and combines robustness and high accuracy.


Critical process technologies and fab productivity addressed at ASMC 2013

Wed, 3 Mar 2013

Semiconductor manufacturers, suppliers and academia to collaborate on real-world issues at SEMI event.


InnoLas Semiconductor on course for 450mm

Wed, 3 Mar 2013

Wafers with a diameter of 450mm enable the micro-chip industry an increase in yield of up to 80%. This leads to an enormous increase in productivity. In order to control the product quality, these wafers receive a specific marking from the manufacturer.


Modern power design challenges to be discussed at APEC 2013

Wed, 3 Mar 2013

ON Semiconductor will demonstrate new digital AC-DC PWM controllers, motor drivers and IGBTs at industry’s premier power electronics show.


SEMICON West 2013 to address industry R&D challenges and opportunities

Tue, 3 Mar 2013

Dynamic changes to R&D processes, tools, technical challenges, and funding/business models will be highlighted at SEMICON West 2013, along with product displays of the latest semiconductor manufacturing technology, components and subsystems.


Next-generation batteries eye slice of $10 billion Li-ion market

Tue, 3 Mar 2013

Mobile energy storage is critical for everything from the phones and computers we carry, to the soldiers and weapons that protect us – and even to the cars we drive. While lithium-ion (Li-ion) batteries have established themselves as the leading technology today, exotic ideas such as lithium-air, lithium-sulfur, solid-state and zinc-air batteries offer up to 10 times better energy density.


GaAs device revenue grows in 2012

Tue, 3 Mar 2013

Growth in the last quarter of 2012 pulled GaAs device revenue to a slight gain for 2012. The Strategy Analytics GaAs and Compound Semiconductor Technologies Service (GaAs) Insight, “GaAs Device Industry Closes up in 2012,” explores GaAs device revenue growth and trends. It also presents the revenue performance of leading GaAs device manufacturers and foundries like RFMD, Skyworks, TriQuint Semiconductor, Avago Technologies and WIN Semiconductors.


ARM Holdings plc announces CEO succession

Tue, 3 Mar 2013

ARM Holdings plc, a semiconductor intellectual property (IP) supplier, announces today that Chief Executive Officer Warren East has decided to retire from the company, effective 1 July 2013, after nearly 12 years as CEO and 19 years at the company. Simon Segars, currently President of ARM, will become the company’s new CEO.


SEMATECH and Intermolecular partner to accelerate EUV lithography

Tue, 4 Apr 2013

In an effort that will accelerate commercialization of extreme ultraviolet (EUV) lithography technology and the development of next-generation transistors, SEMATECH announced today that Intermolecular, Inc. has joined SEMATECH’s Lithography and Front End Processes (FEP) programs.


Cadence and TSMC to collaborate on design infrastructure for 16nm FinFET process technology

Mon, 4 Apr 2013

Cadence Design Systems, Inc. today announced an ongoing multi-year agreement with TSMC to develop the design infrastructure for 16-nanometer FinFET technology, targeting advanced node designs for mobile, networking, servers and FPGA applications.


Implementation of next-generation device technology to be discussed at The ConFab 2013

Fri, 4 Apr 2013

Solid State Technology is excited to announce that Mark Thirsk, managing partner at Linx Consulting, will be discussing the cost and technology needed to implement next-generation device technology at The ConFab 2013. Thirsk has over 20 years of experience in the chemical industry, working with a variety of materials and processes utilized in wafer fabrication.


Gigaphoton starts business operations in Singapore branch

Fri, 4 Apr 2013

Gigaphoton, Inc., a lithography light source manufacturer, announced today that as of April 2013, it has started business operations at the Gigaphoton Singapore Branch, its newly established branch in that country.


University of Cambridge researchers seek to further reduce cost and improve efficiency with GaN LEDs

Fri, 4 Apr 2013

A new £1million (or US$1,530,700) growth facility will allow University of Cambridge researchers to further reduce the cost and improve the efficiency of LEDs, with potentially huge cost-saving implications.


ARM and Cadence to partner to implement 64-bit processor on TSMC 16nm FinFET process

Thu, 4 Apr 2013

Fulfilling the promise of performance and power scaling at 16nm, ARM and Cadence today announced details behind their collaboration to implement the first ARM Cortex-A57 processor on TSMC's 16nm FinFET manufacturing process.


AIXTRON leads workpackage production in Graphene Flagship project

Thu, 4 Apr 2013

AIXTRON SE today announced that it is participating as a key partner in the recently announced European Union (EU) Future Emerging Technology (FET) flagship project “Graphene.”


Manchester leads the way in graphene membrane research

Thu, 4 Apr 2013

University of Manchester graphene researchers have been awarded a £3.5 million (or approximately US$5 million) funding boost that could bring desalination plants, safer food packaging and enhanced disease detection closer to reality.


How Samsung is climbing the charts

Thu, 4 Apr 2013

It’s no secret that Samsung is up against Apple in many ways, in products, sales and innovation. However, even in the face of Apple’s patent infringement lawsuits, Samsung is still climbing the charts.


Bruker introduces new AFM semiconductor characterization solution

Thu, 4 Apr 2013

Bruker announced today the release of the Dimension Icon SSRM-HR, a new atomic force microscope (AFM) configuration including the Scanning Spreading Resistance Microscopy (SSRM) module, designed specifically for high-resolution (HR) semiconductor characterization.


Chinese machinery production to enjoy 11 percent recovery in 2013

Wed, 4 Apr 2013

Machinery Production in China is forecast this year to rebound 11 percent to $426 billion after suffering from overcapacity in 2012 that limited industry growth, according to a new report from IMS Research, now part of IHS Inc.


Ferrotec Temescal introduces electron beam metallization system

Wed, 4 Apr 2013

The Temescal Division of Ferrotec Corporation today announced the Temescal UEFC-5700, a ultra-high efficiency electron beam metallization system for lift-off compound semiconductor applications.


Kotura establishes fabless semiconductor model

Tue, 3 Mar 2013

Kotura inks fab agreement; announces relationships with Mindspeed and BinOptics.


MV launches multi-trap vacuum pump inlet for 300mm wafer fabrication process

Tue, 3 Mar 2013

MV Products has announced that their high-capacity, modular vacuum pump inlet-exhaust traps can be stacked for semiconductor wafer fabrication processes which produce a lot of heavy particulates.


Spansion and XMC Semiconductor announce partnership on 32nm flash memory

Mon, 3 Mar 2013

Spansion Inc., a developer flash memory solutions for embedded markets, and XMC, China’s fastest-growing 300mm semiconductor foundry, today announced an expanded partnership, to develop and manufacture Spansion 32nm NOR Flash memory. The agreement expands XMC’s current 300mm manufacturing of Spansion’s proprietary 65nm and 45nm flash memory technology.


Brooks Instrument launches upgrades to thermal mass flow controllers

Mon, 3 Mar 2013

Brooks Instrument, a provider of advanced flow, pressure, vacuum and level solutions, has expanded its GF 40/80 Series portfolio of thermal mass flow controllers. Broader capabilities, including increased flow rates up to 50 slpm and a “normally open” valve for non-hazardous gas applications, are ideal upgrades for users of Aera (Hitachi), Celerity, Tylan, Mykrolis, Millipore and Unit mass flow controllers, as well as other competitive devices.


EU-funded SYNAPTIC project delivers design-synthesis tool flow

Mon, 3 Mar 2013

A joint industry/academia consortium, supported by the European Union's Seventh Framework Programme, has reported the successful conclusion of a three-year project and the release of its design-synthesis tool flow and related litho-friendly cell libraries and evaluation metrics.


American Graphite Technologies announces successful test production of graphene paper

Mon, 3 Mar 2013

American Graphite Technologies Inc. announced today the successful production of test samples of a graphene paper product by its development and manufacturing partner, CTI Nanotechnologies LLC.


President of IC Insights, Inc. to discuss the “new” IC industry cycle at The ConFab 2013

Fri, 3 Mar 2013

It’s no secret: the past five years for the IC industry have been full of challenges. From 2007-2013, the IC market grew at an average annual rate of only 2.1%. One of the speakers slated to speak at The ConFab 2013 in Las Vegas has good reason to believe the IC industry is set to emerge from this difficult cycle.


Mentor Graphics User Conference 2013 to feature former TSMC CTO

Fri, 3 Mar 2013

Mentor Graphics User Conference 2013 speaker line-up boasts a host of industry bigwigs, including former foundry CTO, Dr. Chenming Hu.  Hu will give the keynote address on April 25 in San Jose, California, addressing the future of FinFET.


$14 trillion opportunity in Internet of Things, predicts Cisco

Fri, 3 Mar 2013

Cisco Systems is preparing for a major shift in the industry, as the Internet of Things starts to become a reality. At an annual press event in San Jose, California this week, Cisco officials claimed that the much-anticipated IoT industry could be a $14 trillion opportunity, and they are ready to embrace the change.


OneChip announces partnerships and plans to expand into the DCI and PON markets

Fri, 3 Mar 2013

OneChip Photonics this week revealed strategic, outsourcing plans to expand into new markets, with announcements of newly-established relationships with semiconductor foundry GCS and wafer supplier IQE. Both announcements related to OneChip’s bigger, strategic plan to expand its services into the high-volume DCI market.


CEO of VLSI Research to give State of the Semiconductor Industry address at The ConFab 2013

Thu, 3 Mar 2013

Solid State Technology is thrilled to announce that Dan Hutcheson, CEO of VLSI Research, will be addressing the state of the semiconductor industry at The ConFab 2013. Hutcheson is a well-known visionary, helping companies make business out of technology for over thirty years and is best known for his many predictions of strategic industry infrastructure shifts.


Imec to offer fully integrated silicon photonics platform in a multi-project wafer service

Thu, 3 Mar 2013

Imec announced today the launch of its fully integrated silicon photonics platform through a cost-sharing Multi-Project Wafer (MPW) service via ePIXfab.


Nanoplas introduces a new class of dry-etching technology

Thu, 3 Mar 2013

Nanoplas, a global supplier of plasma processing equipment to the semiconductor industry, today announced a new dry-etch process offering virtually unlimited etch selectivity for removing dielectric films on microprocessors and memories at high throughput.


SEMATECH executive joins Intermolecular to head semiconductor group

Mon, 4 Apr 2013

Intermolecular, Inc. today announced that Dr. Raj Jammy has joined the company as senior vice president and general manager of the semiconductor group.


Pixelligent Technologies launches PixClear Zirconia nanocrystals for increased light output in touchscreens

Thu, 3 Mar 2013

Pixelligent Technologies, a manufacturer of nanocrystal additives for the electronics and semiconductor markets, last week announced the launch of its PixClear Zirconia nanocrystals. When incorporated into existing products, the nanoadditives can dramatically increase light output and readability of modern touch screens and displays.


Microstructures made of adjoining semiconductor disks could lead to powerful nanoscale sensors

Thu, 3 Mar 2013

Many users of microwave ovens have had the frightening experience of leaving a fork, crumpled piece of aluminum foil or some other pointy metal item inside the cooking chamber. The sharp metal object acts as an antenna for the oven’s microwave radiation, causing strong local heating or sparking.


The secrets of 14nm lithography

Thu, 3 Mar 2013

The long-expected demise of optical lithography for manufacturing ICs has been delayed again, even though the technology itself has reached a plateau with a numerical aperture of 1.35 and an exposure wavelength of 193nm. Immersion lithography is planned for the 20/22nm node, and with the continued delay of EUV, is now the plan of record for 14nm.


Aledia makes its first LEDS on 8-inch silicon wafers using microwire technology

Wed, 3 Mar 2013

Aledia, a developer of LEDs-based on disruptive microwire GaN-on-Silicon technology, announced today that it has made its first LEDs on 8-inch (200mm) silicon wafers.


New energy-efficient interface IC to provide voltage regulation for piezoelectric energy harvesters

Tue, 3 Mar 2013

Holst Centre and imec have developed an integrated piezoelectric energy interface IC with zero bias rectifier circuit and energy-aware supply regulator.


NAND flash market defies trends and grows to record level in Q4

Wed, 3 Mar 2013

Despite facing five consecutive quarters of decline and a slowdown in consumption in smartphones and tablets, the global market for NAND flash memory pulled off a surprise growth spurt during the last three months of 2012, causing sales to reach a record high.


IBM Fellow Subu Iyer to give keynote address at The ConFab 2013

Tue, 3 Mar 2013

Solid State Technology is pleased to announce Subu Iyer, IBM Fellow, will be giving the keynote address at The ConFab 2013 in Las Vegas on Tuesday, June 25, 2013. Iyer will speak on orthogonal scaling to fill today’s fabs in the future.


University of Central Florida launches new undergrad program in photonics

Tue, 3 Mar 2013

A new undergraduate program approved this week at the University of Central Florida (UCF) will help the U.S. stay competitive in global technology as well as broaden the path for students seeking rewarding careers in the important field of optics and photonics, say leaders of SPIE, the international society for optics and photonics.


Cleanzone 2013 focuses on technology and life sciences

Wed, 4 Apr 2013

The second Cleanzone on October 22 and 23, 2013 in Frankfurt am Main is off to a promising start with a stronger profile. Last year, the trade fair and congress made a successful debut as the new international industry meeting point for cleanroom technology. It is targeted towards all companies and sectors in which industrial production is taking place under cleanroom conditions today and tomorrow.


Mobile video streaming drives demand for networking semiconductors in cars

Wed, 4 Apr 2013

Consumers increasingly want to use their media tablets and smartphones to stream high-definition video to displays in their cars, a phenomenon that will help to nearly double the size of the market for semiconductors used in automotive wired and wireless network applications from 2011 to 2018.


ProPlus Design Solutions launches SPICE simulator for giga-scale simulations

Wed, 4 Apr 2013

ProPlus Design Solutions, Inc. yesterday launched NanoSpice, the next-generation high-capacity, high-performance parallel SPICE simulator for giga-scale circuit simulation.


Nitronex welcomes new VP of engineering

Tue, 4 Apr 2013

Nitronex, a designer and manufacturer of gallium nitride (GaN) based RF solutions for high performance applications, has named David W. Runton as its new Vice President of Engineering.


"Veeco MOCVD chosen for CEA-Leti"

Tue, 4 Apr 2013

ARM and TSMC today announced the first tape-out of an ARM Cortex-A57 processor on FinFET process technology.  The Cortex-A57 processor is ARM's highest performing processor, designed to further extend the capabilities of future mobile and enterprise computing, including compute intensive applications such as high-end computer, tablet and server products.


Over 221 million mobile devices shipped in India during 2012

Tue, 4 Apr 2013

India registered 221.6 million mobile handset shipments during 2012, according to CMR’s India Mobile Handsets Market Review, CY 2012, March 2013 release. During the same period, 15.2 million smartphones were shipped in the country.


Clariant acquires Nano-Silver Ink Technology from Bayer

Tue, 4 Apr 2013

Swiss specialty chemicals group Clariant International AG acquired the nano-silver ink technology platform developed under the trademark Bayink from Bayer Group, Germany.


Global semiconductor sales remain ahead of 2012 pace in February

Mon, 4 Apr 2013

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $23.25 billion for the month of February 2013, an increase of 1.4 percent from February 2012 when sales were $22.93 billion. Effective government policies needed to spur stronger growth.


SUMCO's 200mm OH fab for sale, eyeing non-chip buyers

Thu, 4 Apr 2010

SUMCO is putting its semiconductor wafer manufacturing facility near Cincinnati, OH, up for sale, seeking buyers from "alternative advanced technology" areas including solar PV, batteries, and even data centers.


Selecting PTFE for ultrahigh-purity fluid handling applications

Thu, 4 Apr 2010

Paul Hooge from Plastomer discusses the selection criteria when using polytetrafluoroethylene (PTFE) for ultrahigh-purity fluid handling applications.


MRS Day 5: Flexible electronics, Ge-Si integration, CNTs, OPV, and PCBs

Tue, 4 Apr 2010

Techcet's Michael A. Fury closes out his series of observations from this year's MRS Spring meeting in San Francisco. From Day 5: Ge-Si integration, carbon nanotubes in organic photovoltaics, energy storage using paper, printable GaN semiconductors, and stretchable circuit boards and conductors.


MRS Day 4: TSVs and CMOS+MEMS, wafer bonding, CNT interfaces, ALD for rare-earth HK, graphene redux

Mon, 4 Apr 2010

Highlights from Day 4 of the 2010 MRS Spring meeting, reported by Techcet's Michael A. Fury: TSVs and flexible interconnects for 3D CMOS/MEMS; 300mm BCB wafer bonding; carbon nanotube interfaces for interconnects and vias; phase-change memory devices; interfaces during ALD of rare earth-based high-k dielectrics; and graphene's use in on-chip interconnects and transparent conductor electrodes.


MRS Day 3: Nanoimprint litho, 32nm memories, FET/Si/CNT sensors

Fri, 4 Apr 2010

Techcet's Michael A. Fury continues his series of observations from this year's MRS Spring meeting in San Francisco. From Day 3: Noncontact planarization; nanoimprint lithography; sub-32nm memory; sensors made with FETs, Si, and CNTs, solution-phase metal-semiconductor nanowires; patterned organic electronics, inkjet printed sensors, and a flow coating method for highly aligned semiconducting polymer films.


TIPS for the future of organic electronics

Fri, 4 Apr 2010

Organic electronics such as TIPS pentacene show promise for lower costs and improved functionality in applications from handheld displays to sensors to RFID -- but a steep learning curve means collaborative multidisciplinary efforts are essential, explain David Redinger and Karl Manske from 3M.


MRS Day 2: CVD for Cu, low-k etch stop, future FETs, graphene "atom hopping"

Wed, 4 Apr 2010

Techcet's Michael A. Fury continues his series of observations from this year's MRS Spring meeting in San Francisco. From Day 2: CVD for Cu interconnects, controlling low-k etch-stop layers, materials challenges for future FETs, "atom hopping" in graphene, and oxide nanoelectronics on demand.


MRS Spring 2010 meeting, Day 1: Charge-trapping NVM, organics, graphene, PV

Tue, 4 Apr 2010

In an SST exclusive, Techcet's Michael A. Fury offers a series of observations from this year's MRS Spring meeting in San Francisco. First up: Day 1 discussions ranging from memory architectures, organic electronics, graphene, and solar photovoltaics.


CMP-retaining-rings from Willbe use molded Victrex PEEK design

Tue, 11 Nov 2010

cmp retaining ringWillbe S&T selected VICTREX PEEK polymer as the material in its chemical mechanical planarization (CMP) retaining rings. Willbe S&T’s insert molded CMP ring provides better performance, longer life and reduced cost compared to traditional two-piece bonded type CMP retaining rings made with stainless steel and polyphenylene sulfide.


Evaluating-polymer-wear-and-particulation-for-semiconductors and data storage

Fri, 11 Nov 2010

polymer wearPolymers used in wafer shippers, read-write head trays, etc., are susceptible to wear. Wear testing the right way is key to improving use of polymers for data storage and semiconductor fab lines. Jeffrey A. Galloway and Sanjiv Bhatt, Entegris Inc., describe a method for testing polymer wear.


optimized-cylinder-materials-for-hydrogen-bromide-for-silicon-etch

Mon, 11 Nov 2010

Minimize silicon trench etch process variations with optimized cylinder materials for hydrogen bromide deliveryHBr with consistently low water vapor levels is critical to prevent delivery system corrosion and device performance issues during trench etch for CMOS fabrication. Jianlong Yao et al, Matheson, present the effect of cylinder material on delivered moisture concentration in gas phase HBr. Polished AISI Cr-Mo steel, Nickel-lined AISI Cr-Mo steel, and 316L stainless steel cylinders show markedly different results.


Smart strategic outsourcing of product development: Ask the right questions

Fri, 10 Oct 2010

Mark Danna, Owens Design, discusses the key questions that should be asked when selecting a strategic outsource partner particularly in the area semiconductor and solar manufacturing equipment development.


Vacuum/abatement technology saves the bottom line and the planet

Fri, 10 Oct 2010
Recent advances in vacuum and abatement technology are providing significant reductions in energy costs and carbon footprint for semiconductor, FPD, LED and PV manufacturing operations. Mike Czerniak, Edwards, Clevedon, North Somerset, UK

New tech enables polyimide crosslink temp control

Mon, 10 Oct 2010

Nexam Chemical introduced Neximid PETA, which enables heat-activated ethynyl crosslinking of Polyimides at lower temperatures than previously possible.Nexam Chemical introduced Neximid PETA, which enables heat-activated ethynyl crosslinking of Polyimides at lower temperatures than previously possible.


Edwards-expands-vacuum-pumps-for-wafer-fab-LCD-etch-solar-manufacturing

Fri, 12 Dec 2010

 Edwards, vacuum and abatement equipment and services provider, expanded its iXA family of magnetically-levitated turbomolecular pumps with the introduction of the STP-iXA2206 and STP-iXA3306 pumps.


SAFC Hitech expands HB-LED operations in Taiwan

Thu, 12 Dec 2010

SAFC Hitech announced plans to build a new, dedicated facility in Kaohsiung, Taiwan for transfilling, technical service and production of chemical precursors used for high brightness LED and silicon semiconductor manufacturing.


ATREG spins off to ride semi market waves

Tue, 9 Sep 2010

Stephen Rothrock from ATREG talks about his company's spinoff to provide technology manufacturing asset consulting services, how the industry's volatility keeps them in business, and how they'll go after a potential $300B market.


Thin wafer handling: Analysis of wafer-support tooling for stencil-print coating of thinned wafers

Mon, 9 Sep 2010

Jeff Schake, et al, DEK Printing Machines, discuss the flatness characteristics of available wafer pallets, and use them in an experiment with thinned wafers in automated printing. With thin wafers, and the requirement for low coating thickness, the wafer-support tooling surface metrology should have an appreciable impact on coating thickness control.Jeff Schake, et al, DEK Printing Machines, discuss the flatness characteristics of available wafer pallets, and use them in an experiment with thinned wafers in automated printing. With thin wafers, and the requirement for low coating thickness, the wafer-support tooling surface metrology should have an appreciable impact on coating thickness control.


Showa Denko JV to make resist solvent in China

Thu, 3 Mar 2010

Showa Denko says it will spend ¥200M for a new JV in China to supply photoresist solvent for domestic manufacturers of semiconductors and LCD panels, expanding its business in Asia outside Japan.


Time to go labless for new product ramp-up

Mon, 3 Mar 2010
The semiconductor industry is ready to see a new foundry lik model emerge, supporting the transition to "Labless" manufacturing just as the development of foundries fostered the emergence of fabless semiconductor companies, Michel Villemain, Presto Engineering Inc., San Jose, CA USA

Entegris details progress on microbridging defects, lens haze

Tue, 3 Mar 2010

Entegris execs summarize two poster papers from the SPIE Advanced Lithography Conference that covered the company's methods to detect ppt levels of trimethylsilanol (TMS), and evaluating microbridging defects in which 5nm filtration was compared to 3nm filtration levels.


Crossing Automation pursues new strategy

Wed, 3 Mar 2010

Crossing Automation says it is riding a wave generated in part by last year's acquisition of Asyst's frontend component technologies, with multiple new design wins and repeat business, says top exec Robert MacKnight.


Pyrolysis-electrochemical sensor for monitoring carbonyl sulfide levels in ambient air

Thu, 7 Jul 2010
A pyrolyzer-electrochemical cell-based sensor can detect COS (as H2S) from tens of ppm up to 100ppm. Dan Chase, et al, Matheson Tri-Gas Inc.

Video interview with Entegris: Contamination control at 22nm and below

Fri, 7 Jul 2010

Christopher Wargo, Entegris, talks contamination control at 22nm and below. Lithography presents a suite of issues for contamination control. While the technology exists to confront new contaminants, commercialization is key.


Lockheed Martin expands cleanroom, meeting space in PA

Tue, 7 Jul 2010

Lockheed Martin (NYSE: LMT) opened new facilities at its Space Systems Company operations in Newtown, PA. The additions include more clean room space, demonstration areas, antenna range, and more.


Technical debt in semiconductor equipment: it's time to pay it down

Thu, 7 Jul 2010
This is a good time to take stock of your development readiness and how well legacy software assets will support the product roadmap. Dan O

Milara debuts wafer handling line

Fri, 7 Jul 2010

The Diamond series atmospheric robots use ultra low inertia, high-response brushless servomotors coupled with zero-backlash Harmonic Drive gears to achieve greatly enhanced dexterity and precision.


Contamination control today with Entegris

Tue, 8 Aug 2010

AMC concerns have changed over time: what were chip makers and exposure tool OEMs concerned about 10 years ago and now, with 248nm, 193nm, and 192 immersion processes? In this video interview, Jürgen M Lobert, Ph.D., Entegris, discusses AMC tools and process protection in micro lithograhy.


Fire-safe materials debut for semiconductor clean room environments

Thu, 8 Aug 2010

Fire-safe materials debut for semiconductor clean room environmentsFlametec fire-safe materials are formulated to exceed fire compliances for polymers in semiconductor, clean room, and other applications. Flametec is used for a variety of applications including tools, wet benches, cabinetry and furniture. 


CHAD adapts wafer handlers to LED sapphire wafer sizes

Wed, 8 Aug 2010

CHAD Industries developed wafer-handling capabilities for Sapphire wafers used in the LED market.


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