Haruo Matsuno, president and CEO of Advantest Corporation (TSE:6857, NYSE:ATE) shares the company's major goals, including expansion into new measurement applications, utilization of cloud computing, and more.
With many advanced packaging processes taking place on the semiconductor wafer, the traditional supply chain of front-end fab at the foundry and back-end fab at the packaging and test house is falling apart. The ConFab session,
Displaybank published a 2009-2014 analysis of LED packages, the finished LED components used in various applications. While LED package units will grow steadily through the forecast period, revenues will remain mostly flat from 2010 to 2013.
Xilinx Inc. (NASDAQ:XLNX) began shipping a 3D heterogeneous all-programmable FPGA, the Virtex-7 H580T FPGA, using its stacked silicon interconnect (SSI) technology to reach up to 16 28Gbps and 72 13.1Gbps transceiver bandwidth.
Rudolph Technologies Inc. will deliver 14 NSX Series 320 inspection systems to a large outsourced semiconductor assembly and test (OSAT) provider.
Advanced Semiconductor Engineering Incorporated (ASE) opened its Phase 3 manufacturing facility in Weihai, Shangdong province, China, boosting discrete packaging and test capacity.
Invensas Corporation, Tessera subsidiary, debuted bond via array (BVA) technology, an ultra-high-I/O PoP semiconductor packaging alternative to wide-I/O TSV packaging.
Synova SA formed an OEM agreement with its partner Makino Milling Machine Co. Ltd., wherein Makino will manufacture Laser MicroJet (LMJ) tools based on Synova technology.
The USPTO is looking to increase the diversity of honorees for its annual National Medal of Technology and Innovation (NMTI), honoring "this nation's creative geniuses."
Are we closer than we think to our needed mass production costs for silicon interposers? Phil Garrou gleans some insights from the year-ending RTI Architectures for Semiconductor Integration and Packaging conference.
Deca Technologies has introduced a new chip-scale packaging (CSP) product line for applications where its existing wafer-level CSP option isn't a good fit. Details and analysis to come.
Imec developed a via-middle approach to through-silicon via (TSV) manufacturing for 3D packaging, using wafer thinning and a silicon etch process to reveal TSV contacts on the wafer.
Multitest launched a new Quad Tech contactor, the Triton contactor, for high-end digital test applications such as server, computer, mobile smartphone, digital TV, and graphics chips.
The US SEC adopted a rule that requires companies to publicly disclose their use of conflict minerals -- including tantalum, tin, gold, and tungsten -- that originated in the Democratic Republic of the Congo (DRC) or an adjoining country.
At the 22nm node, die fragility and challenging interconnect materials will necessitate foundry collaborations with packaging houses, co-designing silicon and package, asserts E. Jan Vardaman, TechSearch International.
AVX Corporation has ensured that all its tantalum powder and wire suppliers are fully compliant with the independently audited Conflict-Free Smelter Program (CFS).
Semiconductor packaging materials will be a $22.8 billion market this year, and should grow to $25.7 billion by 2015, says SEMI and TechSearch International.
Hesse & Knipps Inc. will demo a new 3mil wire bonding capability on its BJ935 automatic heavy wire bonder for back-end semiconductor packaging at IMAPS in San Diego.
The Hybrid Memory Cube Consortium released the initial draft of the Hybrid Memory Cube (HMC) interface specification, with the final version planned for end of 2012.
Sonoscan introduced a simulator software, SonoSimulator, that enables stacked die makers to check nondestructively for delaminations between layers. SonoSimulator software is now a standard feature on the Gen6 C-SAM acoustic microscope.
At SEMICON West, the working groups of the International Technology Roadmap for Semiconductors (ITRS) outlined 2012 updates to the roadmap. Check out the back-end process info here.
SEMATECH qualified EVG's GEMINI automated wafer bonding system through its Equipment Maturity Assessment implemented within SEMATECH's 3D Interconnect program and ISMI's EMA team.
The bulk of packaging falls under the
USHIO Inc. is introducing the large-field stepper lithography tool
SEMICON West is taking place July 10-12 in San Francisco, CA. Following are new products for semiconductor packaging and test that will be at the show, from wafer bonders to LED die attach materials.
ESCATEC added package-on-package (PoP) capability at its Heerbrugg, Switzerland, facility, adding a dipping unit for ball grid array (BGA) packages on its Siplace assembly line.
Multitest has made its InCarrier Loader/Unloader available in a variety of configurations, e.g. for loading from tube, bowl, tray and for unloading into tube, bulk or metal mag in any combination.
Day 3 of the 15th IITC (International Interconnect Technology Conference) opened in San Jose, CA under clear sunny skies and a pleasant breeze. The herd thinned a bit, down to ~150 hearty souls from the original 230 the prior two days.
Sales of semiconductor probe cards grew 17% in 2011, reaching $1.17 billion, VLSIresearch reports. While short of a record, 2011 was one of the probe card sector
Multitest introduced the ecoAmp Kelvin contactor for high-power device test of 500+ Amperes. It meets the needs of high voltage/high current test with high thermal and mechanical stability.
At its Fab 8, GLOBALFOUNDRIES is installing a special set of production tools to create TSV in 20nm wafers. 3D die stacking of leading-edge chips will enable mobile and consumer electronics.
Nordson ASYMTEK uncrated the NexJet System for jetting, with a newly designed jet cartridge and new software control for semiconductor packaging applications.
NXP Semiconductors released the new SOT1226 "Diamond" package using a
Silex Microsystems brought its Met-Via full-wafer-thickness TSV technology into Chip Architectures by Joint Associated Labs for European Diagnostics, where it is being used to create cost-effective molded chip-level packaging with through metal vias.
Georgia Tech's Packaging Research Center proposes a new consortium on 3D semiconductor packaging called 3D ThinPack for ultra-miniaturized 3D heterogeneous, RF, digital and power modules in partnership with global companies.
MOSAID Technologies Inc. is sampling a 16-die stack NAND Flash device operating on a single high-performance channel, the 5126Gb HLNAND.
Mereco Technologies' METADUCT 1202 is an electrically conductive silver epoxy adhesive for lead attachment cold soldering, chip bonding, and leadframe bonding applications.
Ferro Electronic Materials expanded its LTCC portfolio, adding a line of cost-effective matched materials. The L8 LTCC system claims better performance over a greater range of frequencies and easier manufacturability.
Yamaichi developed a test adapter with the European Design Centre, suitable for test and programming of embedded modules such as Qseven or MXM.
Research organization imec introduces important changes to its ultrathin chip packaging (UTCP) technology, increasing yields 15-20%.
Keithley Instruments introduced the Model 2657A High Power System SourceMeter instrument, adding high voltage test to its line of high-speed, precision source measurement units for power semiconductors.
Karen Lightman, the Managing Director of the MEMS Industry Group, blogs from the MEMS Executive Congress Europe, which was held March 20th, in Zurich, Switzerland.
Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.
As electronic devices with ITO-based displays proliferate, as is the case with smartphones and media tablets, indium market prices are soaring, Displaybank reports. ITO electrodes are also prone to cracking, which presents a problem for flexible displays.
Rice University is developing transparent, flexible memory devices based on silicon oxide, enabling future consumer applications with flexible touchscreens, transparent batteries, see-through ICs, and more.
Sensors in Design 2012 was opened March 28 at the San Jose McEnery Convention Center, in conjunction with Design West. Blogger Mike Fury reports.
Barclays Capital shares some take-aways from the Intertech Pira Phosphor Summit, a conference on phosphors being used in the LED industry. The analysts touch on color mixing, remote phosphors, silicone encapsulants, and more
The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.
Novellus debuted the VECTOR Strata dielectric deposition tool for high-volume VIM Flash manufacturing. VECTOR Strata aims for ultra-smooth films with exceptional defect performance, enabling in-situ deposition of the alternating silicon-based layers used in the formation of the VIM structure.
Worldwide silicon wafer revenues improved 2% YOY, shows the SEMI Silicon Manufacturers Group. Worldwide silicon wafer area shipments, however, decreased 3%, indicating a loss of momentum in H2 2011, said Kazuyo Heinink, SEMI SMG.
Propelled by the appeal of Apple Inc.’s iPhone and iPad, the wireless communications sphere surpassed computers to lead all segments in semiconductor-related spending among top OEMs in 2011.
Rice University studied the fluorescence of single-walled carbon nanotubes (SWCNT) in new research, finding that the lengths and imperfections of individual nanotubes affect their fluorescence.
SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.
VLSIresearch released its 2011 Top Semiconductor Equipment suppliers rankings, noting important acquisitions and strong spending in lithography tools in 2011. Semiconductor equipment spending was driven by aggressive capacity expansion in the foundry and logic sectors.
Worldwide television shipments fell in 2011, the first decline since NPD DisplaySearch began tracking global TV shipments in 2004. LCD TV shipments rose 7%, not enough to offset declines in plasma and CRT TVs.
TI opened a CA-based research lab for analog and mixed-signal circuits, tapping into local universities for a portion of the research. SMIC is teaming with Brite Semiconductor and Zhejiang University for an IC research program in China. Both aim to develop a "home-grown" and dynamic semiconductor industry workforce.
Japan's NAND flash memory supplier Toshiba rapidly rebounded from the devastating Great East Japan earthquake and tsunami that hit one year ago this week, says IHS, thanks to fortunate fab location, quick wafer supply replenishment, and strong demand.
Worldwide sales of semiconductor manufacturing equipment totaled $43.53 billion in 2011, representing a year-over-year increase of 9%, shows SEMI. North America surpassed Taiwan as the region with the highest amount of spending.
Barclays Capital looks at wafer fab equipment trends in 2011, based on Gartner data. Top 5 takeaways? The top 5 vendors continue to gain market share, Intel is a key customer, segment-leading vendors strengthened their holds, intensity edged higher, and changes are in store in 2012.
Analog Devices Inc. (NASDAQ:ADI) honored 14 companies with the 11th Annual “Supplier Excellence Awards,” selected from among the more than 2,000 companies that contribute to ADI’s global semiconductor manufacturing operations.
The LCD TV market saw a rapid shift toward sizes larger than 40" at the end of 2011, as consumers, particularly in North America and China, took advantage of new sizes and affordable prices. The increase in LCD TV area demand means more capacity consumption.
Intel plans $12.5 billion semiconductor capital expeditures in 2012; Samsung plans $12.2 billion. Watch for wide and growing separation between these two companies and their competition, says IC Insights.
Seoul Semiconductor Co. Ltd. has applied, registered, and secured more than 10,000 patents for light emitting diodes (LEDs) globally. The company invests 10-20% of its annual revenue in R&D.
Air Liquide Electronics completed a series of expansions at its ALOHA manufacturing sites in the US, France and Japan, doubling its advanced precursor production capacity for semiconductor manufacturing applications.
Michael A. Fury, Ph.D., Techcet Group, reports from SEMI’s International Semiconductor Strategy meeting, with a closing day focused on innovation and new applications.
While the FPD industry faces severe challenges, long-term supply demand models show a positive future. DisplaySearch tracks the near- and long-term outlook for FPDs, with input from Barclays Capital and IHS.
Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufacturing fabs, pilot lines, and major R&D organizations.
GT Crystal Systems will supply 500,000 TIE 6" C-plane sapphire cores to Silian, which produces high-quality sapphire substrates for HB-LED manufacturing.
imec successfully implemented a 300mm directed self-assembly (DSA) semiconductor manufacturing process line in its fab, with TEL equipment, AZ Electronic Materials consummables, and research from the University of Wisconsin.
SEMATECH authors discuss semiconductor metrology solutions currently being investigated to address the challenges of future nodes. FinFETs raise new metrology complexities, as the entire 3D structure becomes critical for process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts.
NAND flash memories are scaling below 2Xnm process nodes and bit errors are increasing. Research and Markets sees this as the reason for Apple buying Anobit Technologies and Micron buying Storage Genetics (both startups were developing advanced ECC and signal processing technologies).
The Organic Electronics Association released its "OE-A Roadmap for Organic and Printed Electronics," covering application clusters such as flexible displays and smart systems, as well as the outlook on materials, substrates, and patterning processes.
Taiwan became the region with the largest share of installed wafer capacity in 2011, according to IC Insights' Global Wafer Capacity 2011-12 report. This is the first time Taiwan has led the global wafer capacity rankings, with 21% of total in mid-2011.
Taiwan's LED chip and package manufacturers failed to reproduce the booming revenue growth of H1 2011 in H2, according to LEDinside. Given inventory pressure, many LED makers are actively seeking joint ventures and improving product quality to create greater product differentiation.
Renesas Electronics America Inc. named Ali Sebt, who has served 20 years at the company, as its new president and CEO. Sebt succeeds the retiring Daniel Mahoney.
Semiconductor sales were weaker than expected in Q3 2011, and Q4 shows weak guidance, prompting chip makers to reduce production. Gartner expects this inventory correction to work out in early 2012.
Worldwide LED manufacturing capacity will reach 2M wafers in 2012, up 27%. More wafers do not neccessarily mean more LED fab equipment, however. Global LED manufacturing equipment spending will fall 18%, shows SEMI.
Philips Lumileds appointed Pierre Yves Lesaicherre as CEO, succeeding the company's first CEO Michael C. Holt. Lesaicherre spent 2 decades in the semiconductor and components industry.
Camtek launched Xact200, a transmission electron microscope (TEM) sample preparation system for the semiconductor industry. Camtek calls the system an alternative to FIB analysis.
The GaAs device market recovered sharply in 2010, driven mobile handsets. Increased use of pure-play foundries met the surge in demand and was in-line with a trend toward outsourcing, says Strategy Analytics.
RPI scientists studying a promising form of graphene -- graphene nanowiggles -- with exceptionally different properties for each nanowiggle structure. All of the nanoribbon-edge structures have a wiggly appearance like a caterpillar inching across a leaf.
Chip inventories held by semiconductor suppliers declined in the third quarter of 2011, putting a halt to the steady expansion of the previous seven quarters, as the industry cut production in order to reduce oversupply, shows IHS iSuppli research.
The Semiconductor Industry Association (SIA) reports worldwide sales of semiconductors were $25.1 billion for the month of November 2011. The semiconductor industry closed 2011 with growth and looks towards 2012 for further improvement.
Chalmers University of Technology researchers created a graphene FET (G-FET) that is compatible with silicon devices and offers space and high-frequency benefits over traditional mixer transistors.
The Thick Film Division of Heraeus announced a new name, Celcion, for its Insulated Aluminum Materials System. Celcion allows LED circuits to run cooler than MCPCBs.
The global semiconductor market will see a slow 2012, reports IHS, with economic uncertainty and semiconductor inventory not moving enough to stimulate new production. Expect negative growth in Q1 2012, a nascent rebound in Q2, and strong growth in Q3 2012, IHS reports.
Gamma Scientific introduced a low-cost spectrometer for quick and accurate testing for LEDs. The RadOMA Lite linear CCD array spectrometer tests LED intensity and total flux.
Charles Annis, DisplaySearch, shares 10 trends in LCD manufacturing, covering LTPS, IGZO, alignment technologies, metallization techs, 2µm resolution lithograhy patterns on Gen 8, and more.
NIST materials scientists modified a standard SEM for a roughly 10-fold improvement in measuring the crystal structure of nanoparticles and extremely thin films. It enables crystal structure study of particles as small as 10nm.
Leading electronic equipment manufacturers accounted for $105.6 billion of semiconductors on a design TAM basis in 2011, 35% of semiconductor vendors' worldwide chip revenue, according to Gartner. Apple bought the most, spending $17,257 million.
Touch sensors for displays grew to 66% to 9.6 million square meters in 2011, according to NPD DisplaySearch. This includes resistive, projected capacitive, sensor-on-cover, and on-cell touch sensors. Touch sensors will continue growing, attracting new entrants and raising concerns about supply/demand balance.
KLA-Tencor Corporation (NASDAQ:KLAC) debuted the CIRCL suite high-throughput defect inspection/metrology/review system for implementation at lithography, outgoing quality control (OQC) and other process modules in semiconductor manufacturing lines.
The corresponding combined revenue opportunity for MBE and MOCVD is estimated to be around US $6.1 billion for the 2012-2020 periods, shows Yole Développement.
The NAND flash memory market will grow 8% in 2012 to $22.9 billion, thanks to major sales drivers such as solid-state-drive (SSD) equipped ultrabooks, according to the IHS iSuppli Data Flash Market Tracker.
Barclays Capital is raising its total lithography units forecast by more than 10 systems, from 234 to 251 in 2012. As many as 260 litho tools could be purchased, as foundries are seeing high demand for 28nm chips.
Positives for LED makers -- improved utilization rates in Taiwan, growing LED lighting demand -- will not immediately equal more orders for MOCVD tool suppliers, reports Barclays Capital. The analysts expect 525 MOCVD tool orders in 2012, most in the second half of the year.
Barclays Capital and FBR Capital Markets share their takes on earnings season for public semiconductor companies. Both predict a cycle of inventory replenishment in the semiconductor supply chain that will bode well for chip makers in 2012.
Active matrix organic light-emitting diodes (AMOLEDs) are moving from small-quantity development into higher volumes, with shipments destined for smartphones driving growth in the small- and medium-sized display market in February, said IHS.
Intel Corporation announced its 2011 Intel Preferred Quality Supplier (PQS) awards, selecting 19 of its thousands of suppliers. Two suppliers received Intel’s Achievement Award.
Wright Williams & Kelly, Inc. (WWK) opened its 2012 semiconductor industry survey on equipment and process timing. Only participants will receive the full results, free of charge.
LED supply exceeded demand by 30% in 2011, thanks to poor LED TV sales and slow growth in lighting. Look for the industry to start close this gap in 2012, shows NPD DisplaySearch.
IC manufacturers closed 49 wafer fabs between 2009 and 2011, according to IC Insights. Smaller wafer fabs (≤200mm) suffered the most closures, and Japan and North America led the way.
With tentative consumers in developed regions, growth in TV shipments will remain in check in 2012. LCDs will continue to take market share from CRT and plasma TVs; OLED TVs are hitting the market in 2012.
GE’s 27-watt Energy Smart LED bulb is in a standard “A-19” bulb shape, manufactured with a proprietary synthetic jet technology enabled by Nuventix’ collaboration.
SEMI’s Paula Doe covers the “commodity market” of LEDs, including capacity utilization at LED fabs, automation in manufacturing that could improve yields, LEDs fabbed on silicon and GaN instead of sapphire wafers, and more.
Texas Instruments Inc. (NASDAQ:TXN, TI) hosted an Analyst Day this week to discuss and review key strategies and progress achieved over the past 15 years. Barclays Capital “heard few surprises” at TI's Analyst Day; its analysts maintain their view that TI is a “high-quality analog company” that raises some concerns that it is not able to benefit from its scale advantages, with a growth trajectory of only GDP-plus (i.e. in line with overall semiconductors). FBR Capital Markets analysts agree that “little new surfaced.”
Many display manufacturers are transitioning tablet panel production to larger plants, including Gen 6 and Gen 8, which will lead to greater capacity for tablet displays, as well as lower prices, shares NPD DisplaySearch.
DRAM’ percentage of the cost of a smartphone is decreasing, even as DRAM usage in smartphones is on the rise. Lowering ASPs for DRAM components caused DRAM costs in smartphones to fall by more than half in the course of a year, according to IHS.
After a surge in 2010 and oversupply in 2011 that suppressed 2012 fab, LED makers will see a leveling out of supply and demand into better equilibrium, according to NPD DisplaySearch. Demand will shift from LCD-backlit LEDs to LEDs for lighting.
Barclays Capital analysts attended Lightfair International and gleaned several trends in LEDs and OLEDs for lighting, including an interesting phenomenon around MOCVD utilization rates and new orders.
Elpida Memory Inc. (Tokyo: 6665) resolved to file a petition for the commencement of corporate reorganization proceedings, and filed the same with the Tokyo District Court. Akita Elpida Memory Inc. also saw the commencement of corporate reorganization proceedings
Harvard researchers developed a new kind of tunable color filter that uses optical nanoantennae to control color output. A single active filter under exposure to different types of light can produce a range of colors.
A team of scientists at Los Alamos National Laboratory has developed a process for creating glass-based, inorganic LEDs that produce light in the UV range.
As semis are manufactured at the 2X and 1Xnm nodes, new metrology technologies must evolve to fill the gaps. In Part 3 of this 3-part metrology series, SEMATECH discusses the inspection/metrology options for advanced semiconductors.
AIXTRON SE sold 2 BM Pro 4"-wafer deposition tools to the Italian Institute of Technology for the development and production of graphene used in novel hydrogen storage systems.
New information from NIST about how layered switching devices for novel computer memory systems work may now allow these structures to come to market sooner.
Neonode introduced Multi-Sensing technology, which is calls a "more augmented and profound user experience" than traditional multi touch displays.
Semiconductor vendors had slow Q3 and Q4 revenues, indicating that the anticipated correction to chip inventory levels occurred, Gartner reports. The correction process will be largely completed by Q1 2012, evidenced by rising trends in the lead-time index.
A team of researchers at the University of New South Wales, Purdue University and the University of Melbourne have built the smallest transistor ever using a single phosphorous atom.
Dr. Vivek Bakshi, President of EUV Litho, Inc., reports on the SPIE Advanced Lithography conference. He says that this year even the loudest criticism of EUVL was not about “if” but “when,” and the predicted range of insertion for EUVL in high volume manufacturing (HVM) is now 2013-15.
The International Solid State Circuits Conference (ISSCC) brought the best and brightest minds in semiconductors together to share the results of the past year’s research and development efforts. Memory analyst Jim Handy, Objective Analysis, was there to cover some highly interesting presentations.
OSRAM Opto Semiconductors released the Oslon SSL LED, using optimized LED chips and packaging technologies to boost light output, with a 25% efficiency increase over previous-generation LEDs.
Epistar installed its first AIXTRON SE CRIUS II-XL system in a 19 x 4" wafer configuration to mass produce ultra-high-brightness (UHB) blue and white LEDs.
A*STAR’s IMRE in Singapore and their commercial partners developed a plastic that reflects 0.09-0.20% of the visible light hitting its surface, thanks to a nanostructuring that mimics the folds in a moth’s eye, fabricated with nanoimprinting.
IEEE International Electron Devices Meeting (IEDM) is seeking original presentations on microelectronics research and development, with a focus on silicon and non-silicon device and process technology, circuit/device interactions; energy-harvesting, biomedical, and power electronics; magnetics and spintronics; and other topics.
LED manufacturers must choose the appropriate materials and processes to fight low yields, writes Thomas Uhrmann of EV Group (EVG).
The touchscreen display market will reach $14 billion in 2012, driven by the two largest applications, mobile phones and tablet PCs, IDTechEx reports. While projected capacitive touch sensors are the main technology, several others exist for various touch display applications.
Taiwan raised investment ceilings for Chinese investors in LCDs, semiconductors, IC assembly and test, microelectronics production equipment, and metal tool manufacturing.
Applied Materials Inc. (NASDAQ:AMAT) debuted a SiO2 PECVD film technology for display manufacturers targeting the high resolution needs of tablet devices and TVs.
Solid State Technology and SEMI will present the 2012 Best of West product awards at SEMICON West 2012, July 10-12 in San Francisco. Best of West recognizes important product and technology developments in the microelectronics industries.
LCD panel shipments to Chinese TV makers peaked in December, fell sharply in January, and recovered in February, shows NPD DisplaySearch. Panel makers need to reduce their shipment plans to better react to soft demand and avoid inventory problems.
Active-matrix organic light-emitting diode (AMOLED) displays manufacturing is virtually 100% concentrated in Korea, according to Displaybank, with Samsung Mobile Display (SMD) and LG Display (LGD) scaling up capacity.
Media tablets, experiencing "remarkably rapid ascension," will become the 4th largest application for semiconductors by 2014, up from 35th in 2010, according to IHS.
IBM scientists developed a prototype optical chipset, Holey Optochip, that can transfer 1Tbit per second as a parallel optical transceiver, using optical vias through a standard 90nm CMOS chip.
Historically, US presidential election years have been very good for the semiconductor market as many elected officials attempt to pass (mostly short-term) legislation to boost the economy, reports IC Insights.
The HDD industry is rapidly recovering in 2012 and beyond, after surviving natural disasters and tepid market conditions in 2011, according to a report by TRENDFOCUS.
The gallium nitride (GaN) power elec market is currently small, but new entrants are ramping to production, silicon-based electronics suppliers developing GaN, and LED makers diversifying capacity to make power semis.
The market volume for HB-LEDs reached $12 billion in 2011, a 4.3% growth over 2010, reports EPIC, The European Photonics Industry Consortium.
Semiconductor fab equipment spending will remain flat in 2012, says SEMI. But look for a record spend from semiconductor makers in 2013, jumping from $38.85 billion spent in 2012 to $45 billion in 2013.
The SIA reports worldwide semiconductor sales of $23.1 billion in January 2012, an 8.8% decrease year-over-year, but SIA expects positive demand as 2012 progresses.
A big boost in demand in the US helped ratchet up chip sales growth in September, according to the latest data from the Semiconductor Industry Association (SIA), but annual growth is on pace for a -4% decline from 2011.
Hours away from the US presidential election, here's one last message about jobs and growth in the semiconductor sector.
There's a new battleground slowly emerging for OLEDs in lighting applications where the technology could offer some advantages in design and efficiency -- if panel makers are willing to make some sacrifices.
Applied Materials has announced two new tools for display manufacturing: one with a new design for depositing IGZO films for TFTs, the other handling bigger LTPS-deposited substrates to help lower manufacturing costs.
In a departure from past iterations, Windows 8 will not cause any significant rise in DRAM unit shipments, predicts IHS iSuppli.
Communications applications are far and away the leading growth market for ICs over the next five years, and PCs and consumer applications have fallen far back in the pack.
Wafer demand is slowly turning back toward growth, and a closer look at the numbers from SEMI and Semico Research shows what's behind the trends -- and why they give purchasing managers headaches.
Worldwide flat-panel display (FPD) revenues will reach a record $120 billion in 2012, up 8% from a challenging year in 2011, and the recovery is entirely on the backs of TFT-LCDs and AMOLED displays, according to NPD DisplaySearch.
Pulling Cymer's EUV source technology in-house is hoped to accelerate progress in the technology's long slow march toward production readiness.
With this week's IEEE International Electron Devices Meeting (IEDM 2012) now underway, here are four of the papers that were accepted late: on 90nm integrated silicon photonics, ZnNO for next-gen displays, and III-V TFETs for the 7nm node.
Despite weak financial performances, sluggish global markets and strong regional competition, Japanese consumer electronics giants Sony and Toshiba are increasing their investments in new products to revitalize their businesses.
Semiconductor equipment demand is persistently sluggish as the industry takes a break from a "multiyear expansion period" to digest recent investments and wrestle with a broader economic slowdown, acknowledges SEMI in its updated year-end forecast. But make no mistake: leading-edge technology investments are still happening, and growth will return in the typical cyclical pattern.
NPD DisplaySearch's examination of the projected 2013 LCD TV panel product mix finds some big differences between what suppliers offer and what buyers want.
Persistent global economic uncertainty from Europe to the US to China is weighing down the WSTS' expectations for semiconductor sales for the next two years, with a slow climb back to single-digit growth by 2014.
Despite lingering clouds obscuring near-term visibility for the semiconductor manufacturing industry, signs of macroeconomic life bode well for sales of electronics devices, and by association the chip technologies that power them.
Growth in the industrial electronics semiconductor market is set to fall short of previous expectations in 2012 as the business is buffeted by weakening global economic conditions, with the LED market the sole bright spot, says IHS iSuppli.
TELEFUNKEN Semiconductors is expanding its manufacturing capacity at the Roseville, California facility, to 220,000+ 8 inch wafers.
Chip sales growth continues to soften in 2012 as the industry slips from "stagnation" to "slump," but the stage is still set for a rebound in 2013, according to updated analysis from IHS iSuppli.
More than 7% of all mobile phones will use in-cell touch technology in 2012 while tablet PCs start adopting "DITO" film structures, as both technologies strive to overcome production challenges, explains NPD DisplaySearch.
Joining the growing chorus of industry watchers lowering their outlooks on the semiconductor sector, Gartner has reduced both its 2012 and 2013 forecasts for semiconductor sales but is remarkably more bullish on prospects in 2014.
A “leading semiconductor technology innovator” ordered Qcept Technologies Inc.’s ChemetriQ 5000 NVD inspection system for unit process development and process integration activities for advanced nodes, including 2Xnm and 1Xnm logic nodes for both front-end-of-line and back-end-of-line processes.
Global semiconductor sales stayed flat in June 2012, hitting $24.38 billion, reports the Semiconductor Industry Association (SIA). Y/Y, sales fell just 2% in June, a slower decline than the semiconductor industry has seen since October 2011.
Charles Annis, DisplaySearch, reports on new thin glass products for lighter, thinner, and flexible displays, and shares the pros and cons of thinned glass and polymer substrates.
IC Insights released a Q2 update to its top-20 ranking of semiconductor companies. Three pure-play foundries are in the top 20 ranking, with a cumulative increase of 20% from Q1 2012 to Q2 2012.
Siemens will publicly list OSRAM via a spinoff to Siemens shareholders, rather than an IPO. Spinning off OSRAM will make the public listing more independent of capital market conditions.
Crossing Automation, Inc. announced three new options for the Spartan 300 that deliver an end-to-end contamination-free sorter environment. The new options target high volume manufacturing at 32nm and below.
NanoMarkets issued a new white paper on LED phosphors, "LED Lighting Driving Demand for New Phosphors," that covers the shifting use of phosphors, which modulate the light emitted by LEDs, from LCD backlighting to solid-state lighting.
Average retail pricing for U.S. flat-panel televisions rose to the highest level in 2.5 years during Q2, thanks to advanced features and larger displays in a growing proportion of TV sets, according to IHS (NYSE:IHS).
FEI (NASDAQ:FEIC) launched the Verios XHR SEM for metrology on beam-sensitive and sub-nanometer-scale materials in advanced semiconductors.
Plessey Semiconductors is installing a multi-million pound HB-LED production line at its Plymouth, UK facility, including a new AIXTRON reactor.
Following are some of the process control, device inspection, defect detection, and other metrology and test products that will be on display at SEMICON West 2012, July 10-12 in San Francisco, CA.
JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.
Barclays Capital checks in on the EUV lithography market potential and which semiconductor manufacturers will press adoption. The analysts also update their expectations for lithography tool suppliers on the EUV front.
North-America-based manufacturers of semiconductor fab equipment posted $1.61 billion in orders worldwide in May 2012, $1.54 billion in billings, and a 1.05 book-to-bill ratio, shows SEMI.
“The upward trend of global semiconductor sales is encouraging,” said Brian Toohey, SIA. “Recent sales totals are in line with industry projections of modest growth for the remainder of 2012, but a sluggish global economy continues to provide substantial headwinds, limiting more robust growth.”
Technology for making circuits with organic materials, non-vacuum processes, and flexible substrates has made striking progress, but it’s been a challenge to find applications where the new technologies offer must-have advantages. Paula Doe, SEMI, reports on flexible and large-area OLED displays and lighting.
Seiko Epson reached the milestone of 80 million high-temperature polysilicon (HTPS) TFT LCD panels for 3LCD projectors, enough for more than 26.5 million projector units.
The IDE Group developed the STC series of Active Vibration Isolation Systems supporting OEMs in the production of 450mm wafer equipment.
IC Insights’ latest survey and ranking of the major semiconductor capital spenders shows that only 6 of the 35 major semiconductor suppliers -- Intel, Samsung, Hynix, TSMC, UMC, and Rohm -- with significant capital expenditure budgets are expected to spend more in 2012 than they did in 2011.
Total touchscreen module revenue will reach $16 billion in 2012, and nearly double in six years, reaching $31.9 billion by 2018, according to the most recent NPD DisplaySearch 2012 Touch Panel Market Analysis.
LED prices are declining, as revenues are growing through 2016, according to a report from Strategies Unlimited. Trends include multi-chip packaging and different LED power levels for different applications.
CEA-Leti presented research updates alongside SEMICON West this week. After the talks on device architecture, 3D and 2.5 packaging interconnects, large-scale computing and power consumption, and more, CEA-Leti’s researchers joined Solid State Technology to talk about their fields of interest.
Dr. Vivek Bakshi blogs about trends he expect to see at the upcoming 2012 International Workshop on EUV Lithography, in Maui Hawaii.
AGC has developed 0.5mm carrier glass for handling and transport of its 0.1mm-thick ultra-thin glass during product manufacturing processes.
Flash memory chip maker Spansion Inc. (NYSE:CODE) debuted its first family of single-level cell (SLC) NAND products using 4Xnm floating-gate technology. Spansion plans to roll out 3X and 2Xnm node versions of the NAND chips in the near future, without obsoleting the more mature designs.
Chip scaling will go on for the foreseeable future, enabling new product with more compute power, more memory, faster on-chip communication. That was one of the conclusions put forth by imec’s An Steegen, speaking on technology trends at The ConFab 2012.
The ConFab’s sessions opened with “The Economic Outlook for the Semiconductor Industry,” featuring Jackie Sturm of Intel, Dan Hutcheson of VLSIresearch, and Jim Feldhan of Semico.
The market for power management semiconductors grew for 7 quarters before declining grossly in Q4 2011, flattened in Q1 2012, and is now “on its way to discernible growth in Q2,” reports IHS.
Solid State Technology and SEMI announced the Best of West Award winner -- Jordan Valley Semiconductor -- during SEMICON West today. Jordan Valley Semiconductor’s QC-TT defect inspection system predicts breakage in 450mm wafers, which are subject to more handling steps and more thermal stresses due to their larger size.
Luc Van den hove, president and CEO, imec, spoke with Solid State Technology, covering imec’s major announcements and research presentations to take place during SEMICON West 2012.
AMOLED is entrenched in the small- and medium-sized displays market. For the technology to capture significant market share in the large-size, TV-bound display market, manufacturers will need to invest in better, higher throughput processing, shares Displaybank.
We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco.
ITO is the basis of more than 90% of TCFs, used in displays, flexible photovoltaics, and other devices, reports Cathleen Thiele, IDTechEx. With indium prices rising, and technical challenges related to indium’s brittle nature, manufacturers are looking to new technologies, such as finely printed conductive meshes, layers of silver or copper that are highly transparent, organic transparent conductors and variations such as carbon nanotubes and graphene.
SCHOTT announced the market entry of its Xensation cover glass, an alumino-silicate glass offering improved resistance to breakage and scratches for touchscreen panels. The company also debuted a special anti-glare effect capable of significantly reducing glare on high-resolution displays.
Texas Instruments Incorporated (TI, NASDAQ:TXN) announced Q2 2012 revenue of $3.34 billion, and expects Q3 to be about flat. Fab under-absorption charges will weigh on TI in Q3 and into Q4, analysts point out.
Polarizers used in display manufacturing will form a $9.94 billion market in 2012, up 4% from 2011, according to Displaybank. Sequentially, the polarizer market decreased by 9% in Q1 2012, hitting 2.235 billion. This was down 6% from Q1 2011.
Micron is more than doubling its DRAM manufacturing capacity by buying bankrupt Elpida Memory’s assets. But the move is “not without risk,” according to IHS.
One year after ramping Fab 5 at the site, Toshiba will reduce its NAND Flash memory semiconductor production at its Yokkaichi Operation fab in Mie Prefecture, Japan.
The automotive IC market will grow 8% this year, to $19.6 billion, reports IC Insights. Semiconductor content per vehicle is increasing to $380 in 2012, up 9% from 2011. And the growth will continue in the near future.
RED Equipment’s Carl McMahon suggests a different model for handling secondary semiconductor equipment for greater efficiency, cost reduction and quality control: full turnkey services engineered to the fab’s needs without the expense of customization.
Maxim Group analyzed MOCVD utilization and revenues at LED makers in Taiwan, finding that MOCVD orders are placed just to maintain capacity, not add, and high utilization rates are only at the top LED makers.
MicroSense reports an increase in orders for its MRAM magnetic metrology systems. The metrology tools characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM.
PLANSEE has developed a pressed-sintered tungsten crucible with an ultra-smooth surface to avoid sapphire ingot or crucible damage in the Kyropoulos method.
Mitutoyo America Corporation launched the Surftest SJ-411/412 portable surface roughness tester, conforming to roughness standards JIS-B0601-2001, JIS-B0601-1994, JIS-B0601-1982, VDA, ISO-1997 and ANSI.
Some of the new and flagship wafer fab products and supporting facility products, like vacuum valves, that will be on the show floor at SEMICON West, from ion implant to MOCVD traps and gas blenders.
H-Square Corp introduced its 450mm Ergolift for handling new 450mm semiconductor wafer FOSB/MACs, which can weigh more than 60lbs.
Canon U.S.A. Inc. introduced the FPA-6300ES6a DUV stepping scanner, a lithography tool with a KrF excimer laser light source for the high-volume production of memory, logic and image-processing devices.
Cache SSDs will remain the mainstream ultrabook storage solution, says IHS, even as hybrid HDDs offer some consolidated storage advantage. Hybrid HDDs use a built-in layer of NAND flash memory.
As LEDs replace CCFLs for backlighting of LCDs, manufactures face LCD upgrades and supporting electronics redesigns. ERG developed the Smart Bridge module to quickly, easily and economically upgrade to LEDs, using the system’s existing input power signals.
As the dust settles after the launch of the iPhone 5, analysts tally which suppliers in the semiconductor ecosphere are most likely to gain the most.
DAS Environmental Expert says it has a new system that offers a more environmentally friendly way to clean waste process gases produced in LED manufacturing.
Global demand for semiconductor manufacturing equipment slipped -4% in 2Q12 with softness in just about every region -- except Taiwan which stepped on the pedal during the quarter, according to updated data from SEMI and SEAJ.
Taiwan's two biggest semiconductor foundries saw sales jump in August, and business for the full third quarter is looking up as customers pull in some orders.
Analysts weigh the reasons behind Intel's downwardly-revised 3Q12 results, from macroeconomic sluggishness to tablet-PC cannibalization -- and whether its pullback in 2012 capex plans spells trouble for the market overall.
Despite the gloomy economy and softness in consumer LCD products, suppliers of thin-film transistor liquid crystal displays (TFT-LCD) expect moderate 8%-13% growth in sales and shipments in 2012, according to DisplaySearch.
Three leaders in their respective fields have formed a technology alliance to bring a new glass cutting technology to market. InnoLas Systems GmbH licensed process technology developed by FiLaser LLC and will use ultra-short pulse lasers produced exclusively for InnoLas by LUMERA LASER GmbH.
Researchers from IBM and ETH Zurich revealed the first-ever direct mapping of the formation of a persistent spin helix in a semiconductor. This discovery answers the physics question as to whether electron spins possess the capability to preserve encoded information long enough before rotating.
Propelled by strong sales to tablet and cellphone manufacturers, AKM led the semiconductor magnetic sensor market for the third year in a row in 2011. Of the top-10 magnetic sensor suppliers, Memsic saw the highest growth: 1340%.
The PVA protection film industry will change significantly in 2012, with many display makers actively pursuing PVA-free and TAC-free designs. Display manufacturers are looking for costs savings, designs that suit tablet PCs and smartphones, and alternatives to Fuji Film, Displaybank reports.
The field of power electronics, the application of electronics for the control and conversion of electric power, is underpinned by basic electrical principles that were established in the distant past by the pioneers of electrical science. But today, the need to supply, modify and control the voltage, current or frequency of electric power arises in a vast number of applications and products spanning a huge range in terms of power handling capability.
AMOLED displays are growing rapidly and offer many performance benefits over LCDs. However, 55” AMOLED TV displays cost 8-10x as much as a comparable LCD to manufacture. NPD DisplaySearch looks at ways to improve costs/fab.
The LED industry is entering its third growth cycle, general lighting, according to Yole and EPIC’s report, “Status of the LED Industry.” However, the cost of a packaged LED still needs to be reduced by a factor x10 to enable massive adoption. New business models are mandatory to capture added value of LED lighting.
Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.
H2 2011 saw slow growth for gallium arsenide (GaAs) substrates in semiconductor and related devices, as well as a shift away from GaAs as a handset switch technology. However, the March 2011 earthquake and tsunami in Japan disrupted the supply chain, driving up substrate pricing and overall revenue to nearly $230 million.
Learn about the changes in semiconductor manufacturing as well as related markets -- photovoltaics, displays, LEDs, etc -- at the 2012 Strategic Materials Conference (SMC), to be held on October 23-24 in San Jose, CA. SEMI reports.
FEI will pay $15M to settle the dispute over focused ion beam systems, in exchange for dropping litigation and cross-licensing FIB technologies.
A ranking of the forecasted top 2012 12 IC foundries (pure-play and IDM) was released by IC Insights.
Big data, 3D printing, activity streams, Internet TV, Near Field Communication (NFC) payment, cloud computing and media tablets are some of the fastest-moving technologies identified in Gartner Inc.'s 2012 Hype Cycle for Emerging Technologies.
Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, is poised to celebrate its 30th anniversary at its annual TECHCON conference Sept. 10-11.
FEI announced two new Helios NanoLab systems, the 450HP and 1200HP DualBeam systems, which include new capability that meets the critical requirements for semiconductor process development at the 28nmdevice geometry node and below.
IHS iSuppli now predicts a decline in global semiconductor revenues in 2012, the first since 2009, due to a weakening economy that has eroded demand for PCs and related components.
Optoelectronics researchers at the Ferdinand-Braun-Institut ordered an Optofab3000 for Laser Bar Facet Coating from Oxford Instruments Plasma Technology.
Despite overall weaker shipments in 2012, new display and touch technology in small/medium devices continues to drive demand, especially in the smartphone sector.
Printing is emerging as a technology that can replace traditional photolithography processes for electronics manufacturing, reducing costly material use, very complex processes, and expensive equipment.
Following a sharp 30% drop during Q1 2012, worldwide shipments of flat-panel televisions returned to growth in Q2, according to IHS's Displaybank.
Tokyo Electron Limited and FSI International entered into a definitive agreement under which TEL will acquire FSI for approximately $252.5 million.
Fab equipment spending continues to soften in 2012, and hopes for a reprieve in 2013 are waning, warns one analyst.
Macroeconomic malaise continues to weigh down global semiconductor sales, although there's a possible ray of hope for a boost by year's end thanks to introduction of much-desired electronics devices (hello iPhone 5).
Researchers at the U. of Illinois have devised a method to monitor a semiconductor surface as it is etched, in real time, with nanometer precision.
In an analysis of quarterly IC market growth rates, IC Insights pulls up an unusual phenomenon: the performance during the second calendar quarter takes the spotlight in years of better growth, which is counter to historical norms.
Want another snapshot of who's leading the pack among pure-play foundries, and who's falling off the curve? Look more closely at <45nm offerings, as framed by a recent analysis from IC Insights.
Even with the persistent troubles in global economics and various technology hurdles in advanced semiconductor manufacturing, IC market growth will continue to improve -- and the key is a shift away from what's been driving the market dynamics, explains IC Insights.
In the fourth installment in a series called Process Watch, the authors discuss overlay registration and new capabilities to align to buried layers. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.
The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.
NEMO, a three-year European project to research solution-processable materials for OLEDs, has concluded with newly developed materials that can be integrated into large-surface OLED components and are suited for printing processes.
For decades, electronic devices have been getting smaller, and smaller, and smaller. It's now possible—even routine—to place millions of transistors on a single silicon chip. But transistors based on semiconductors can only get so small.
Industry’s newfound maturity yields growth amid adversity.
Nano-electronics R&D center addresses key challenges of Germanium finFET technology at VLSI 2013.
In an industry where finer features are driving market needs, current deposition processes are no longer sufficient to address challenges like interconnect dimensions below 16/14nm or high aspect ratio TSVs (>8) without experiencing defects, voids, or low reliability.
Fraunhofer Institute for Solar Energy Systems ISE has joined forces with EV Group (EVG) to develop equipment and process technology to enable electrically conductive and optically transparent direct wafer bonds at room temperature.
Shipments in March of large-sized liquid crystal displays (LCD) exceeded total production when measured in terms of area, the result of a deliberate move by panel manufacturers to digest accumulated inventory.
Can PC makers produce ultrathin, touch-screen PCs that are appealing to consumers—and that are priced at just $200?
LAST POWER, the European Union-sponsored program aimed at developing a cost-effective and reliable technology for power electronics, today announced its three-year program achievements.
Initiated by the arrival of Google Glass and magnified by Google’s efforts to promote application development for the product, the global market for smart glasses could amount to almost 10 million units from 2012 through 2016.
MEMS pressure sensors will achieve accelerated growth this year and become the leading type of MEMS device, driven by increasing use in automotive and the fast-growing handset space, according to insights from the IHS iSuppli MEMS & Sensors Service from information and analytics provider IHS.
Intel announced that the board of directors has unanimously elected Brian Krzanich as its next chief executive officer (CEO), succeeding Paul Otellini. The board also named Renée James, 48, to be president of Intel.
What would happen if half of all global production for dynamic random access memory (DRAM), two-thirds of NAND flash manufacturing and 70 percent of the world’s tablet display supply suddenly disappeared from the market?
More than 100 representatives from government and the photonics industry convened in Washington, D.C., on February 28 to identify focus areas for a national photonics initiative (NPI), engaging academia, industry, and government in a collaboration to address barriers to continued U.S. leadership in photonics.
Following a healthy expansion in 2012, the growth of the global automotive semiconductor market will decelerate slightly this year because of a slowdown in the aftermarket and portable navigation device (PND) segments.
Starting late in 2011, the power electronics downturn in 2012 was quite severe, exhibiting -20 percent negative growth. However, the SiC device market kept on growing with a +38 percent increase year to year.
Global shipments of solid state drives (SSD) in PCs are set to rise by a factor of seven by 2017, allowing them to claim more than one-third of the market for PC storage solutions by that time.
IDC expects the semiconductor market to return to growth in 2013 with revenues forecast to increase by 3.5 percent this year.
Leaders of the National Science Foundation (NSF) and the Semiconductor Research Corporation (SRC) today announced 18 new projects funded through a joint initiative to address research challenges in the design of failure-resistant circuits and systems.
Demand for 4-inch or larger AMOLED panels has continued to increase in the fourth quarter of 2012 thanks to strong growth in the market for high-end smartphones with large screens, such as the Galaxy S and Note series by Samsung Electronics.
Global flat-panel television shipments fell by 10 percent in February and by an estimated 4 percent in March compared to the same months in 2012 as Chinese demand plunged following the Lunar New Year buying season.
U.S. television shipments are forecast to decline for a second year in a row in 2013, but growth will resume next year as the liquid crystal display television (LCD TV) segment regains some of the strength it had lost in the past year.
Combo MEMS sensors for automotive applications are off to another exhilarating ride this year as revenue continues to climb, spurred by rapidly accelerating use in car safety systems.
The fast growing market for sensors for smart phones is re-shuffling the ranks of MEMS suppliers. For the first time, suppliers of inertial sensors have surpassed the major makers of micro mirrors and inkjet heads that have long dominated the industry on Yole Développement’s annual ranking of the Top 30 MEMS companies.
Increasing HD video content, social networking, shared data via the cloud, low power consumption, and “instant on” features continue to drive growth of consumer, communication, and computing devices that use NAND flash memory.
Researchers are developing a new type of semiconductor technology for future computers and electronics based on "two-dimensional nanocrystals" layered in sheets less than a nanometer thick that could replace today's transistors.
Over the last few years, glass has gained considerable interest from the semiconductor industry due to its very attractive electrical, physical and chemical properties, as well as its prospects for a relevant and cost-efficient solution. The application scope of glass substrates in the semiconductor field is broad and highly diversified.
Active matrix OLED (AMOLED) displays will continue to encroach upon LCD technology through small and medium-sized (9-in. and smaller) displays used in mobile phones, according to recent analysis by NPD DisplaySearch.
Markets for solid state thin-film batteries at $65.9 million in 2012 are anticipated to reach $5.95 billion by 2019, according to a new report released by ReportsnReports.com.
In the second of two installments, Linx Consulting reports a steady growth in semiconductor production, as released in The Econometric Semiconductor Forecast.
A new econometric semiconductor industry forecast predicts semiconductor wafer area production to grow slightly less than 6% in 2013, according to Linx Consulting.
Spending on research and development by semiconductor companies grew 7% in 2012 to a record-high $53.0 billion, even though the semiconductor market declined 1% to $317.6 billion.
Facing a relentless onslaught from tablets, smartphones and solid state drives (SSD), global hard disk drive (HDD) market revenue in 2013 will decline by about 12 percent this year, according to IHS.
Scientists at RTI International are advancing the state of science in electronic devices for optical systems by using superlattice structures to optimize the performance of germanium optical detectors on silicon chips.
C. Grant Willson and Jean M.J. Fréchet won the Japan Prize, an international award similar to the Nobel Prize, for their work on chemically amplified resists.
Smartphones and media tablets continue to the prime movers of technology industries, with the two mobile platforms spurring a double-digit increase in the market for microelectromechanical system (MEMS) motion sensors this year.
The rise in mobile computing, changes to the fabless-foundry model, uncertainties in technical innovation, and global macroeconomic trends are becoming the dominant forces in 2013 and beyond, according to industry leaders speaking at this week's SEMI Industry Strategy Symposium (ISS).
As the annual Consumer Electronics Show and hordes of techie enthusiasts descends over Las Vegas this week, NPD DisplaySearch revisits the battle between two display technologies -- 4K × 2K vs. OLEDs.
Chip inventory held by semiconductor suppliers reached alarmingly high levels in the third quarter of 2012 amid weak market conditions, according to an IHS iSuppli Semiconductor Inventory Insider Market Brief.
Spending on LED fab manufacturing equipment will decline 9.2% in 2013 as the industry faces weak long-term demand and consolidates manufacturing capacity.
Samsung tops list; IC foundries expected to show biggest capacity gains through 2017.
Intersil Corporation today announced restructuring initiatives designed to prioritize the company's sales and development efforts, strengthen financial performance and improve cash flow.
As power electronics grow to $15 billion and LEDs to $100 billion, Lux Research identifies the leading technology companies addressing these markets.
The competitive landscape of the cellphone core integrated circuit (IC) business has completely transformed over the past five years, with Qualcomm Inc. and Samsung capitalizing on the rise of smartphones and 4G.
Worldwide sales of semiconductors were $24.05 billion the month of January, up 3.8% from January 2012 and down 2.8% from December 2012, according to the Semiconductor Industry Association (SIA).
CEO believes that the technology may be made available in simple products this year.
O-S-D’s marketshare of total semiconductor sales in 2012 was highest since 1991. Seven O-S-D product categories and device groups reached record-high sales in 2012 compared to 14 new records being set in 2011, according to data shown in the 2013 edition of IC Insights’ O-S-D Report.
In the power electronics field, the fabless business model is not as common compared to the MEMS industry. For example, most power electronics players have their own capabilities/fabs dedicated mainly to silicon wafer manufacturing. According to Yole Développement, $4B was generated by MEMS fabless companies in 2012, against less than $300K in the power electronics area. Is power electronics a world apart?
PC capabilities and market are undergoing a historical deceleration, in another sign of shifting technology markets.
Yole Développement’s research has credited STMicroelectronics for capitalizing on the booming demand for MEMS in mobile devices by shipping 58% more MEMS units in 2012, to become the first company to reach $1 billion in MEMS sales.
Within the mobile handset display market, the market share for AMOLED displays is forecast to grow from 7.9% in 2013 to 15.2% in 2017, as presented in the figure below. AMOLED’s market share for 4-inch or larger handset displays employed in smartphones is set to increase to 24.4% in 2017, up from 23.0% in 2013.
North America-based manufacturers of semiconductor equipment posted $1.07 billion in orders worldwide in February 2013 (three-month average basis) and a book-to-bill ratio of 1.10, according to the February Book-to-Bill Report published today by SEMI. A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month.
Berkeley Lab researchers recreate elusive phenomenon with artificial nuclei; highly relevant for future nanoscle devices where electrical charge is concentrated into very small areas
Shipments this year are expected to double to 162 million units, as presented in the attached figure, primarily due to Samsung’s usage of pressure sensors in the Galaxy S4 and other smartphone models.
It’s no secret that Samsung is up against Apple in many ways, in products, sales and innovation. However, even in the face of Apple’s patent infringement lawsuits, Samsung is still climbing the charts.
Cisco Systems is preparing for a major shift in the industry, as the Internet of Things starts to become a reality. At an annual press event in San Jose, California this week, Cisco officials claimed that the much-anticipated IoT industry could be a $14 trillion opportunity, and they are ready to embrace the change.
Despite facing five consecutive quarters of decline and a slowdown in consumption in smartphones and tablets, the global market for NAND flash memory pulled off a surprise growth spurt during the last three months of 2012, causing sales to reach a record high.
The high-value microelectromechanical system (MEMS) market experienced soft growth last year, mainly due to weakness in the mainstay medical electronics and industrial sectors, according to an IHS iSuppli MEMS High-Value MEMS Market Tracker Report from information and analytics provider IHS.
The updated "Garment System Considerations for Cleanrooms and Other Controlled Environments" document includes new sections on measuring footwear, frocks and other garments, as well as a new subsection for tracking system use, such as RFID chips and barcodes.
The transition to 22nm silicon will have a major impact on the design community, most notably in process variation: timing and power. Because of this, we are seeing a dramatic increase in the 22nm process design rules, says Gary Smith. More and more design teams will decide to leave the IC layout portion of the design to the experts.
The Global Semiconductor Alliance (GSA) released its Global Semiconductor Funding, IPO and M&A Update, showing that initial public offerings surged in November, with 3 companies entering the stock market.
Intel's Atom chips saw plunging sales as the netbook market was swallowed by smartphones, media tablets, and like devices, but the company expanded its microprocessor leadership in Q3 2011, shows IHS iSuppli.
Advanced manufacturing methods, such as using high-mobility semiconductor materials, will be the key to serving mobile-electronics TFT displays with high brightness and low power consumption, shows NPD Displaysearch analysis. These require technical expertise and skill, but can yield higher profits and better products.
Rapid adoption of smart meters to save energy and improve grid efficiency means an opportunity for a broad range of semiconductor suppliers.
Displays for pure-play e-book readers will see 108% higher shipments in 2011, but slower growth ahead. In the future, e-reader makers will turn to color display technologies, predicts IHS iSuppli.
Strategies in Light Europe 2012, September 18-20 in Munich, Germany, is accepting abstracts through February 17. Strategies in Light Europe covers the rapidly growing LED lighting industry.
Applied Materials released a new film treatment, Applied Producer Onyx, that reduces the power consumption in semiconductor chips while increasing mechanical strength. The product targets the challenges associated with 3D packaging applications and technologies.
SEMI reports worldwide semiconductor manufacturing equipment bookings fell 38% year-over-year in Q3 2011; billings dropped 5% for the same quarter.
Bosch Sensortec has integrated two triaxial MEMS sensors in 1 package, claiming the smallest IMU to date. Solid State Technology spoke with Leopold Beer at Bosch about MEMS integration and the sensor fusion software element of sensing.
Karen Lightman, MEMS Industry Group (MIG), lets us in on the real meaning of MEMS new product development. MEMS are micro electro mechanical systems.
Ali Sebt, CEO of Renesas Electronics America, keynoted Day 2 of Solid State Technology’s The ConFab 2012. Here, he discusses the role of inexpensive sensors and microcontrollers in energy savings, in a video interview.
Semiconductor sensor sales will grow 18% in 2012 to a record $5.7 billion, and continue double-digit growth rates and record-high revenues each year through 2016, says IC Insights. MEMS-based devices now account for about 70% of total sensor revenues compared to 54% in 2005.
Driven by the volume consumer business, the maturing MEMS sector starts to look at ways to reduce costs and speed time to market by coming together on things like easing integration, common test methods, and tool replacement parts, reports Paula Doe, SEMI. Fast-moving high-volume markets may also drive MEMS makers toward paring down the vast diversity of processes and packages used, and into more collaboration on a mature ecosystem.
Paula Doe, SEMI Emerging Markets, covers developments at Applied Materials, Coventor, and other members of the MEMS equipment supply chain that will make MEMS less expensive, smaller, and easier to manufacture.
Growing use of disposable devices and respiratory monitoring are underpinning growing use of microelectromechanical systems (MEMS) used as pressure sensors in medical electronics, according to IHS iSuppli.
Mike Rosa, MEMS global product manager at Applied Materials, blogs about recent advances in MEMS, as described at the recent MEMS Executive Congress.
SEMICON Taiwan 2012, held September 5-7, will feature both Taiwan MEMS suppliers and global MEMS elites -- including Asia Pacific Microsystems, Freescale, InvenSense, and STMicroelectronics -- who will discuss innovation in MEMS design, manufacture, packaging, testing and equipment.
The market for semiconductor magnetic sensors used in industrial and medical applications expanded by 6% in 2011 to $118.2 million, with green energy initiatives acting as a major growth driver, according to IHS iSuppli.
High pricing and ineffective marketing are weighing down expectations for ultrabook demand, but the future's still bright with new models promising new features -- and that's great news for one component sector.
SiTime Corporation has shipped 100 million units of its MEMS devices, including oscillators, clock generators and resonators.
Audio Precision released a pulse density modulation (PDM) audio interface option on its APx500 for direct I/O, modulation, and decimation on MEMS microphones and other PDM devices.
Western Michigan University developed a device combining a laser and diamond cutting system, enabling users to process hard, brittle materials that are difficult to machine. Initial applications include MEMS manufacturing, and other fabrication on semiconductor materials.
Baolab Microsystems will modify the structures of its 3D NanoCompass to build a range of other motion sensors, with the end-goal of low-cost, smart, reconfigurable inertial measurement units (IMUs).
Oxford Instruments launched the PlasmaPro 100 etch and deposition tool for manufacturing MEMS, HB-LED, semiconductors, and other applications.
Purdue researchers have demonstrated self-calibrating MEMS, which enable higher accuracy for existing and new MEMS applications and could eliminate 30% of manufacturing costs by skipping test processes.
Ian Chen, Sensor Platforms Inc., discusses the role of sensors in smart devices, evolving from pure metrological instruments to context-aware user assistance devices. Key points include sensor fusion with data input and algorithms, and power consumption control.
Standardized testing and measurement methods, NIST argues, will enable MEMS lab-on-chip manufacturers to accurately determine important physical characteristics of LOC devices such as dimensions, electrical surface properties, and fluid flow rates and temperatures. These must be calculable at all stages of production, from processing of raw materials to final rollout of products.
Embedded features and sensor integration will determine the future applications of MEMS sensors. Jay Esfandyari et al, STMicroelectronics, share an overview of future trends of sensor integration -- sensor fusion -- and some of the features available today in digital MEMS inertial sensors.
Fraunhofer Institute for Photonic Microsystems IPMS has placed its Light Deflection Cube evaluation kit custom-configuration and ordering on the Internet. The LDC is used to evaluate single-axis MEMS scanning mirrors.
The new Samsung Focus Flash Windows smartphone includes a WiSpry RF MEMS device, starting off a 200x expansion of the RF MEMS industry through 2015, the analyst firm predicts.
IBM scientists have developed a flexible, non-contact, silicon microfluidic probe to accurately stain tissue sections at the micrometer scale for drug discovery and disease diagnostics research.
In 2011, Apple Inc. became the world’s largest purchaser of MEMS microphones, passing Samsung Electronics Co. Ltd. Apple’s share of MEMS buying amounted to 27% for the year, compared to 20% for Samsung.
SCHOTT North America Inc. introduced MEMpax borosilicate glass for use in MEMS manufacturing, available in thicknesses from 1.1 to 0.1mm and with a CTE corresponding to Si.
Genalyte developed and produced a set of disposable silicon photonics biosensor chips with research body imec, for use in its diagnostic and molecular detection equipment. The chips use imec’s standard silicon photonic waveguide devices, modified for bio-compatibility.
New MEMS thermopile players and applications are boosting market growth for infrared (IR) detectors, finds Yole Développement.
The Great East Japan Earthquake, March 11, 2011 off Sendai, was "a Darwinian event" for the MEMS market. The MEMS supply chain came out of the disaster much richer, more diverse, and better positioned for growth, shows the IHS iSuppli MEMS & Sensors Service.
Advantest Corporation began producing MEMS relays for semiconductor testing equipment, high-speed communications devices, HF wave measurement equipment and their components.
SPTS Technologies delivered its first VHF etch system in China, installing a Primaxx Monarch 3 at the Shanghai Institute of Microsystem and Information Technology for a MEMS accelerometer development project.
Strong demand for MEMS sensors, CMOS image sensors, LEDs, fiber-optic laser transmitters, and power transistors enabled the OSD semiconductors market to grow by 8% in 2011, hitting a new record revenue and beating out the overall IC market, according to IC Insights.
Micronova Nanofabrication Centre selected a Vistec Lithography e-beam litho system for its nanotechnology laboratory in Finland. The litho tool will be used for nanoelectronics, nanofabrication, microelectronics, nanophotonics and microfabrication research in a multi-user environment.
Digital MEMS microphones see widespread use in mass-market consumer electronics, pushing revenues high enough to overtake the analog segment by 2013.
The market for automotive MEMS expanded after natural disasters in Japan and Thailand last year, with car electronic systems makers seeking to expand their supply chains to mitigate risk. Auto MEMS revenue in 2011 amounted to $2.2 billion.
Nextreme Thermal Solutions announced that its thin-film thermoelectric technology has achieved a 60.1°C temperature difference between its cold and hot sides at an ambient temperature of 24.7°C, bringing it on par with the performance of bulk thermoelectric technology.
After 5 straight months of steep declines, prices for large-sized LCD panels stabilized in December 2011, thanks to better-than expected sales and decreased production, says IHS.
Dolomite and GigaGen are collaborating on a novel Droplet Merger Chip for massively parallel single cell genetic analysis. The 15 x 22.5mm glass microfluidic chip merges 2 droplet streams consistently and quickly.
STMicroelectronics (STM) is implementing shape memory alloys (SMA) in its optical image stabilization (OIS) motion sensor designs. Actuators made of SMAs contract upon heating.
MIT researchers have come up with a new approach to MEMS design that enables engineers to design 3D configurations using existing fabrication processes. They built a MEMS device that enables 3D sensing on a single chip.
Researchers from Rice U. say they have developed a micron-scale spatial light modulator (SLM) built on SOI that runs orders-of-magnitude faster than its siblings used in sensing and imaging devices.
New technology represents a breakthrough in overcoming NAND scaling limit and ushers in a new 3D memory era.
The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $74.65 billion during the second quarter of 2013, an increase of 6 percent from the first quarter when sales were $70.45 billion.
Samsung today introduced the first solid state drive (SSD) based on its recently released 3D V-NAND technology. Samsung announced its new SSD, designed for use in enterprise servers and data centers, during a keynote at the Flash Memory Summit 2013.
In an illustration of the massive power it wields in the electronics supply chain, Apple Inc.’s migration of the production of key semiconductors from Samsung to pure-play foundries will single-handedly boost the growth of the chip contract manufacturing market this year.
Whereas the current display industry has developed its technology and products centered on scaling-up to large sizes and realizing high-resolution images, the future industry development direction is expected to focus on flexible displays.
Competitive pressures, collapse of vertically integrated business model, increasing "asset-lite" strategies lead to Japan mergers, spinoffs
Project targets more efficient 3D TSV integration and covalent bonding at room temperature
World’s smallest semiconductor process node will feed the storage demands of consumer applications and data centers.
Boston University filed a lawsuit against Apple Inc. and several other big tech companies over an alleged patent infringement, a thin film semiconductor technology that they claim was developed by one of their professors.
CEA-Leti today announced that a group of European and Japanese companies, research institutes, universities and cities will work together in the ClouT project to deliver ways for cities to leverage the Internet of Things (IoT) and cloud computing – to become smart cities.
In a season when their sales should be rising sharply, suppliers of large-sized liquid-crystal (LCD) panels instead are encountering weak demand growth in the third quarter, exacerbating the glut already plaguing the market.
Cascade Microtech, Inc. and imec today announced breakthroughs in probing stacked integrated circuits (3D-SICs), fueling an important growth engine for the semiconductor market.