The seminar is an ideal fit for anyone interested in characterizing and communicating the light and color properties of LED’s accurately.
As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more demanding of all the variable parameters on a process tool, including process gas accuracy. Cutting down on variability in the process positively impacts productivity and yield.
Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business development director, Lode Lauwers, on why 450mm is important for Europe, and the status of 450mm research on processes and devices.
It will also show some new multi-die DRAM package structures designed to offer improved electrical performance using the existing manufacturing infrastructure.
Using variance analysis to set up a BBr3 pre-deposition process
The diffusion process has generally been explained using Fick's law without considering the effect of process gases. The amounts of pre-deposition gases, however, are critical with respect to uniformity and repeatability. Using experimental data and SPSS software, it is shown that sheet resistance depends on FN2, FO2, and FBBr3 for a BBr3 deposition process.
This article addresses the architectural aspects of the design and construction of IBM's B323 annex, which was designed in 2003 and built in 2004. The design intent was to continue the existing material palette, to unify the two buildings into one, and to insure that new ideas and concepts were implemented into B323A, allowing the new annex to stand on its own merits.
Economics of sub-45nm chipmaking for equipment suppliers
Tough challenges facing process tool vendors as the industry moves toward sub-45nm chip features will require imaginative solutions. An analysis relating important application trends to process tool requirements was presented by Masayuki Tomoyasu, director of development and planning for Tokyo Electron Ltd. (TEL), who then proposed a wide range of potential solutions for toolmakers.
JSC Sitronics units NIIME and Mikron and RUSNANO plan to build a new ~$560M site for 90nm chip production in Zelenograd, Russia.
Xerox researchers say they've development a new silver ink to print conductors, the third required material necessary for printing plastic circuits to replace silicon.
Global semiconductor sales continued to rebound in August, rising 5% from the previous month, according to the latest data from the Semiconductor Industry Association (SIA). But the question is: is it end-demand driven, or just an inventory rebuild?
After three years of solid double-digit growth, the sector for third-party chip design services stumbled in 2008 and fell hard in 2009 -- and how these firms address three key challenges will shape the sector landscape over the next five years, according to a new report from Gartner.
Now that everyone's had their spin on Intel's generally upbeat quarter, let's boil it down to a few key bullet points.
Semiconductor consortium SEMATECH has named Daniel Armbrust as president/CEO effective immediately, succeeding Michael Polcari who after nearly seven years in the position becomes board chairman.
With the pullout of proposed investor Hyosung Corp., creditors of Hynix Semiconductor are still looking to push ahead with a sale, though the clock may be ticking, according to local reports.
The historically busy holiday-ramp period of October proved to be that again, and tight supplies could keep chip sales higher than usual for another few weeks, according to the latest data from the Semiconductor Industry Association (SIA).
Scientists at MIT showed work at this week's IEDM in building and measuring multiple transistors using III-V materials (in this case, InGaAs) to determine optimal conditions for making a logic element, and a pathway to make them smaller and better.
Preliminary rankings for 2009 worldwide semiconductor sales not surprisingly show a lot of declines, but not as much as had been feared as recently as just a couple of months ago -- and some firms will even eke out positive growth by year's end, according to data from Gartner.
After slumbering for the past year, the industry is ill-equipped to handle surging chip demand heading into 2010 and beyond -- and tightened capacity will spell the end of the fab-lite model, predicts analyst Malcolm Penn of Future Horizons.
Wacker Chemie AG has successfully concluded its acquisition of the silicon-metal production site in Holla, Norway, from FESIL Group. Holla Metall’s production capacity is around one third of WACKER’s annual needs.
SOI Industry Consortium execs explain to SST the goals and future plans for their new "Ready for SOI Technology" program to broaden access to and encourage adoption of silicon-on-insulator (SOI) technology, its key inclusions, and what they hope to add next.
Intel plans to purchase Infineon’s Wireless Solutions Business (WLS) in a cash transaction valued at approximately $1.4b. Infineon will subsequently focus on automotive, industry and security technologies. The acquisition expands Intel’s current Wi-Fi and 4G WiMAX offerings to include Infineon’s 3G capabilities and supports Intel’s plans to accelerate LTE.
Another month, another record -- and more signs that the chip industry might be softening a bit.
John Ellis from SEMI takes issue with "a pervasive misconception" about the economics and timing of a wafer-size transition to 450mm and how these have changed with the 2008-2009 industry bust, and suggests ways to tackle the issues surrounding 450mm and keep other technologies on-track.
The 450mm transition continues to be a hotly debated topic. Scotten Jones from IC Knowledge responds to SEMI's John Ellis about 450mm production capabilities vs. efforts to improve 300mm, laying out his own numbers for 450mm costs and productivity.
At the upcoming International Electron Devices Meeting (IEDM), researchers from the IBM Alliance will describe a new germanium ion implantation process that implants Ge into the shallow silicon channel region prior to high-k/metal gate (HKMG) stack depositions.
Mentor Graphics Corporation (NASDAQ: MENT) announced its next-generation FloTHERM 3D computational fluid dynamics (CFD) software for electronics cooling applications. Called FloTHERM 9, the software provides bottleneck (Bn) and shortcut (Sc) fields. Erich Bürgel, GM, Mechanical Analysis Division at Mentor Graphics, describes the process in a podcast interview.
Overall semiconductor sales are still in positive growth territory but the numbers slowed a bit in August for all but one region, according to the latest data from the Semiconductor Industry Association.
The Israeli government is giving Intel hundreds of millions of dollars to infuse its 300mm/45nm fab in Kiryat Gat -- but it's a lot less than Intel had been hoping for.
Advanced Micro Devices (AMD) is not for sale, however the chip maker will listen to interesting proposals, chief executive Dirk Meyer said when asked about Oracle's recent interest in the sector.
According to a detailed IP analysis published by the IP Solutions business of Thomson Reuters, China's patents focus has continued to be digital computing, a trend started in the 1990s/2000s outsourcing boom to China, but increasingly these are Chinese companies, not multinational parent companies, filing.
Taiwan's top two foundries both posted December sales that were up a few percentage points from the prior month, and more than double that from the same period a year ago.
Economists at this week's Industry Strategy Symposium (ISS) paint a positive picture for the semiconductor industry for the next few years, and for the economy in general.
While analysts at this week's Industry Strategy Symposium (ISS) predict strong growth ahead for the semiconductor industry, they also foretell a fundamental change in structure that will leave only a handful of companies producing devices at the leading edge.
A quick highlight list of Intel's blowout 4Q09 numbers, released after markets closed on Thursday 1/14.
Having spun off its chip manufacturing operations into GlobalFoundries, AMD has positioned itself as the No.2 global fabless IC supplier in terms of sales, second only to Qualcomm, according to IC Insights.
Despite reported warnings of inventory bloat at electronic distributors, nearly all segments of the chip supply chain remain lean, according to a report from iSuppli.
A second window of opportunity to sell a controlling stake in Korea's Hynix Semiconductor has come and gone with no bidders coming forward, so the company's investors are looking at other ways to slough off their interest, according to multiple reports.
New insights into memristors could offer an offramp to the increasingly challenging navigations of Moore's Law scaling, and some very interesting applications in biomed research.
European R&D consortium IMEC recently offered more details of its work in Ge-on-Si and other novel materials, in efforts to improve two processes: optimizing chemical mechanical planarization (CMP), and improving epitaxial growth using hydrogen and "inert species."
Chip sales slipped a bit in February after a better-than-expected January performance, but overall the market still shows recovering demand particularly in key markets and in emerging economies, particularly in the Asia-Pacific.
Global semiconductor capital equipment spending totaled $16.78B in 2009, roughly a -46% dropoff from 2008 as chipmakers put the brakes on all but essential spending in order to preserve cash, according to the final tallies from Gartner.
As with sister markets, demand for silicon wafers used in making semiconductors is expected to ramp up in 2010, driven by a single keyword: "innovation," according to analyst firm iSuppli.
Key takeaways from Bill McClean, speaking at The ConFab this week in Las Vegas: The industry's low-teens growth path in 2010 might be conservative, and could last all the way through 2012. And a possible 60% snapback in capital spending, particularly focused on memory, "is still not even close to being enough."
In a video interview at The ConFab, SanDisk founder/president/CEO Eli Harari expands on two themes in his Monday keynote address: the precise timing of new fab investments to promote a healthy supply/demand balance, and what it will take to get to the "post-NAND" world.
Aart de Geus of Synopsys elaborates on the industry's shift toward "systemic collaboration" to envelop all functionality of semiconductor systems, from power management to embedded software.
Bill McClean, president of IC Insights, tells SST's Debra Vogler that ASPs are still holding and it will take the industry some time to build up its capacity.
Lode Lauwers, senior business development director at IMEC, describes the drivers of new collaboration between systems companies and technology companies, and where platforms such as IMEC fit in.
Rochester Electronics, authorized manufacturer and distributor of end-of-life and mature semiconductors, has expanded its space-level continuing manufacturing services and product offering to provide a continuous, long-term source of certified semiconductor devices.
The Verigy (NASDAQ: VRGY), LTX-Credence (NASDAQ: LTXC) merger proposes to add scale with increased presence in the SOC test market; combine complementary products, markets, customers and channels; and generate annualized synergies of at least $25 million, following the completion of the integration. But some say LTX didn't shop around for the best share value.
Fabless company Picochip Limited, femtocell technology and silicon provider, completed a new $9 million debt facility with Silicon Valley Bank. The facility consists of a $4.0 million three-year term loan and a two-year $5.0 million working capital line of credit. The combined facility will provide Picochip with access to additional working capital to support growth.
Applied and key customer Samsung clear the air over alleged chip technology leaks, with pricing concessions that could actually help AMAT in the long run.
Achronix Semiconductor Corp. announced strategic access to Intel Corporation's 22nm process technology, and plans to develop the most advanced field programmable gate arrays (FPGAs).
TER granted a worldwide royalty-free license of Standard Test Data Format (STDF), and any intellectual property rights, to SEMI to use, distribute, modify and support STDF. Under the supervision of SEMI International Standards, the STDF license will ensure standards development and new products will be unencumbered by IP ownership conflicts.
How to close the gulf between design models and manufactured silicon? An expert panel at this week's International Test Conference cast doubt on excessive use of guardbanding, and shed light on a possible new option: on-chip sensors to collect data from the manufactured silicon itself.
Verific Design Automation and Veridae Systems jointly announced that the Verific front-end software has been licensed to Veridae for inclusion in the new Clarus family of debug and validation products.
Confident in its place at the IC foundry table yet hungry for more, Globalfoundries says it will invest another $3B in new capacity expansions in the US and Europe.
With the industry roaring back to life in the past few months, major changes are in the semiannual industry forecasts from the WSTS and SIA.
Semiconductor inventories should pick up the pace a little bit in 2Q10, but the numbers are "misleadingly elevated" and in reality stockpiles are quite lean, according to an iSuppli analyst.
Healthy end-market demand in consumer electronics, and now signs of recovery in the corporate IT sector as well, bode well for chip sales as finally show emergence from the downturn and return to normal seasonal patters, according to the Semiconductor Industry Association (SIA).
Continuing with our running theme of industry outlooks for 2010 and beyond, here are three viewpoints recently expressed: Bill McClean from IC Insights with strong optimism macroeconomically all the way down to semiconductors; Terry Brewer from Brewer Science outlining the opportunities for materials suppliers; and Craig Ramsey from CyberOptics Semiconductor, relating how his company withstood a tough 2009 and what it's doing to ensure 2010 growth.
Semiconductor sales set a new high in the first months of 2010, and appear to be on their way to one of the best growth years of all time, according to new industry data and analysis.
After 2+ years of slogging, there are happy tidings all around for memory firms in 2010 as demand increases, capacity tightens, and ASPs rise, according to a market analyst.
In his Monday (May 17) presentation at The ConFab, Qualcomm's Jim Clifford talked about the technical and economic challenges brought on by the convergence and ubiquity of wireless connectivity, and the importance of "early engagement" to cost-effectively research and develop products.
Techcet's Karey Holland reviews key technical themes and presentations from the ICPT conference in Phoenix, ranging from HKMG and new device designs to Cu interconnects, cleans and metrology, and emerging/non-traditional CMP applications.
Several analysts reporting from AMD's analyst day break down the company's proposed growth and profit plans, and new products coming down the pipeline -- and how the company could offer a new challenge to longtime rival Intel, if its leading-edge manufacturing partners can execute.
SPP Process Technology Systems (SPTS) opened its new facility in San Jose, CA, the home for SPTS’ Thermal Products Division, and sales and support headquarters for North America. The Thermal Products Division was relocated from Scotts Valley, CA. Senior technical editor Debra Vogler attended and shares this report.
3M, through its New Ventures business, invested in Printechnologics, a German printed electronics specialist, aimed at joint efforts for providing innovative solutions for electronic circuitry on paper or foil.
Fusion-io announced the Fusion-io Technology Alliance Program, an initiative to develop new "Fusion Powered" technologies, including flash-optimized software, a new generation of storage appliances and virtualization solutions.
Tokyo Electron Ltd. plans to invest around 5 billion yen in China to build a new manufacturing plant for equipment used to produce LCD panels. Tokyo Electron has, to this point, manufactured its LCD panel fab equipment in Japan. The Nikkei (10/20) reports that competition from South Korean and Taiwanese rivals has intensified for TOELF.
Semico recently presented an ASIC market update, noting a low growth forecast for the traditional ASIC market, and programmable logic growth driven by increasing requirement for bandwidth for portable connectivity. Designs are getting stale, and pent-up demand for fresh silicon will burst in 2011. Presenter Richard Wawrzyniak's discussion is summarized.