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SPICEing up circuit design

Wed, 9 Sep 2013
Dr. Zhihong Liu, Executive Chairman, ProPlus Design Solutions, blogs about the challenges of designing for yield using SPICE models.

FREE WEBCAST: Light and Color Measurement of Today's LED Technology

Thu, 3 Mar 2011

The seminar is an ideal fit for anyone interested in characterizing and communicating the light and color properties of LED’s accurately.


Innovation in Semiconductor Manufacturing Instrumentation

Tue, 3 Mar 2013

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more demanding of all the variable parameters on a process tool, including process gas accuracy. Cutting down on variability in the process positively impacts productivity and yield.


450mm Status Report

Wed, 4 Apr 2013

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business development director, Lode Lauwers, on why 450mm is important for Europe, and the status of 450mm research on processes and devices.


DFM Strategy for Yield Closure

Thu, 4 Apr 2006
Looking to improve your bottom line and maximize yield for your next design? This seminar covers the latest causes of yield problems and how the new Calibre DFM tools from Mentor Graphics can help you identify, analyze and modify your designs to increase yield. This seminar also includes a rundown on what Calibre is doing to address random, systematic and parametric yield problems.


SST On the Scene at SEMICON West

The Next 10 Years: cost-effective lithography, managing R&D costs, scheduling invention, transitioning to 450mm wafers, and new business models.

Tue, 7 Jul 2006
With escalating R&D costs, economic challenges associated with lithography past the 32nm half-pitch, and increasing competition between countries and even regions within countries, industry executives have their hands full. Among the questions explored in 14 video interviews conducted at SEMICON West are the following:
  • Are finishing fabs the answer to the industry's economic challenges going forward?
  • Are ever-larger consortia and alliances feeling growing pains, or does size drive momentum for solutions?
  • As the government gets more involved in basic research, will you be happy that someone from the government is there to help you?
  • Will high-throughput e-beam direct write lithography be ready in time for 32nm half-pitch?
  • Is there a solution to the raw polysilicon availability crunch?
  • Are universities competing "too much" with industry?
  • Is scheduling invention possible?
Hear what industry executives have to say about these and other issues.

Issues Facing High Speed DRAM Frequency Scaling

Wed, 6 Jun 2010

It will also show some new multi-die DRAM package structures designed to offer improved electrical performance using the existing manufacturing infrastructure.


PC outlook lowered again

Fri, 8 Aug 2013
Worldwide PC shipments are now expected to fall by -9.7 percent in 2013, further deepening what is already the longest market contraction on record.

Pfeiffer Vacuum introduces energy-saving dry pumps

Mon, 10 Oct 2013
The dry pumps A 100 L with their compact dimensions were specially developed for flexible integration in semiconductor production facilities.

Imec and SPTS partner on advanced nanotechnology applications in BioMEMS

Tue, 10 Oct 2013
SPTS Technologies and imec announced a joint partnership to further advance micro- and nanosized components for BioMEMS.

Brooks Instrument unveils new MFCs

Mon, 10 Oct 2013
Brooks Instrument, a provider of advanced flow, pressure, vacuum and level solutions, has expanded its GF 40/80 Series portfolio of thermal mass flow controllers (MFCs) to enable a broader range of applications.

IBM breaks record with silicon nanowire MOSFET

Fri, 10 Oct 2013
IBM devices with a 90nm gate pitch demonstrated the highest performance ever reported for a SiNW device at a gate pitch below 100 nm.

TSMC to unveil 16nm FinFET platform at IEDM

Fri, 10 Oct 2013
At the International Electron Devices Meeting (IEDM) in December, TSMC researchers will unveil a 16nm FinFET process that by many measures is one of the world’s most advanced semiconductor technologies.

High mobility InGaAs MOSFETs get triangular

Tue, 10 Oct 2013
A research team in Japan has built a triangular InGaAs-on-insulator n-MOSFETs using MOVPE that has a high on-current of 930 µA/µm.

Advances in Wet Processing and Wafer Cleaning

Mon, 5 May 2014
August 14th, 2014

Wet Processing, including wafer cleaning, is one of the most common yet most critical processing step, since it can have a huge impact on the success of the subsequent process step. Not only does it involve the removal of organic and metal contaminants, but it must leave the surface in a desired state (hydrophilic or hydrophobic, for example), with minimal roughness and minimal surface loss – all on a growing list of different types of materials. In this webcast, experts will identify industry challenges and possible solutions, including a new concept of tailoring chemistries to dissolve very small particles rather than physically removing them.


MEMS devices for biomedical applications

Mon, 10 Oct 2013
Dr. Ramesh Ramadoss, Senior Manager in the MicroProbe Product Group of FormFactor Inc., provides an overview of MEMS and highlights a variety of applications in the biomedical area, including pressure sensors, inertial sensors, transducers for hearing aids, microfluidics for diagnostics and drug delivery, micromachined needles and microsurgical tools.

Mentor Graphics introduces new Valor supply chain tools

Thu, 10 Oct 2013
Mentor Graphics Corporation yesterday announced the Valor Information Highway and the Valor Warehouse Management products, two supply chain-focused tools designed to enhance Enterprise Resource Planning (ERP) effectiveness and assist electronics manufacturers in reducing material costs.

inTEST Thermal launches mobile temperature control system

Tue, 11 Nov 2013
inTEST Thermal today announced the launch of a mobile temperature control system for high-speed thermal testing of chips, components and PCBs.

Chip sales log 6.4% growth in September, says SIA

Tue, 11 Nov 1999
Worldwide sales of semiconductors totaled $12.7 billion in September, marking a 6.4% rise over August and a 24% rise over year-ago levels, said the Semiconductor Industry Association and the World Semiconductor Trade Statistics group in the latest global sales report.

AMD breaks ground on test manufacturing facility in Singapore

Tue, 2 Feb 2001
February 27, 2001--Singapore--AMD today broke ground on a new $45 million, 345,000-sq.-ft., 7-story semiconductor testing facility and design center in Singapore. The new facility will operate as a test center for microprocessors, engineering R&D, and IC design activities.

Fujitsu to establish research institute for advanced computer technology

Tue, 2 Feb 2001
February 27, 2001--Tokyo, Japan--Fujitsu Laboratories Ltd. and its Sunnyvale, CA-based subsidiary Fujitsu Laboratories of America will establish a new research institute for advanced computer technology on April 1 in College Park, MD, located near the campus of the University of Maryland.

Worldwide digital handset semiconductor revenues forecast to reach $38 billion in 2004

Tue, 2 Feb 2001
February 27, 2001--Mountain View, California--The migration to next-generation handsets is driving chip growth, according to IDC market researchers, and worldwide digital handset semiconductor revenues will increase at a compound annual growth rate (CAGR) of 18%, from approximately $17 billion in 1999 to over $38 billion in 2004. IDC also believes that handset shipments will post a healthy 24.4% CAGR during this same period to reach over 780 million units in 2004.

Intel invests heavily in new silicon technologies

Wed, 2 Feb 2001
February 28, 2001--San Jose, California--Intel Corp. CEO Craig Barrett told the audience attending the Intel Developers Forum yesterday in San Jose, CA, that the company is investing $12 billion this year in new silicon technologies and manufacturing capacity that will enable them to pursue future growth opportunities.

ITC to investigate UMC complaint against SiS

Wed, 2 Feb 2001
February 28, 2001--Sunnyvale, California--The U.S. International Trade Commission (ITC) voted yesterday to investigate whether Silicon Integrated Systems Corp. (SiS) is infringing two patents owned by United Microelectronics Corp. (UMC) of Taiwan. This is the first step toward possible U.S. Government action to exclude all SiS-manufactured ICs from the U.S. market.

Corning's Photonic Technologies businesses to reduce workforce

Fri, 3 Mar 2001
March 2, 2001--Corning, New York--In response to softness in the telecommunications industry, Corning Inc., a manufacturer and supplier of photonic devices, has announced a layoff involving 825 employees of Photonic Technologies' Benton Park, PA, and Erwin Park, NY, manufacturing facilities.

Entegris completes acquisition of NSE's fluid handling component product line

Mon, 3 Mar 2001
March 5, 2001--Chaska, Minnesota--Entegris, Inc. has completed the acquisition of Nisso Engineering Co. Ltd.'s (NSE) fluid handling component product line for $10.375 million in cash. NSE is a leading semiconductor OEM and fluid handling component manufacturer located in Tokyo, Japan.

Rodel, Eternal Chemical team to provide copper CMP solutions

Mon, 3 Mar 2001
March 5, 2001--Phoenix, Arizona--Rodel Inc., an innovator of integrated materials for the microelectronics industry, has completed an agreement with Eternal Chemical Co. Ltd. to distribute and market Eternal Chemical's advanced copper CMP slurry solutions. Eternal Chemical, a leading chemical company in Taiwan, will use Rodel's market channel to the global semiconductor industry and customer support infrastructure to bring its copper slurry products to the marketplace.

NEC raises $90,000 to assist earthquake victims in India

Wed, 3 Mar 2001
March 7, 2001--Tokyo, Japan--Employees of NEC Corp. and its subsidiaries and affiliates across Japan, have raised $90,000 (11 million Yen) to help victims of the January 26th earthquake in India.

SiGe Microsystems produces 6 million ICs, changes name

Wed, 3 Mar 2001
March 7, 2001--Ottawa, Canada--SiGe Microsystems announced today that it has manufactured more than six million ICs to date, and achieved several key design wins. The company also recently changed its name to SiGe Semiconductor to reflect the completion of its transition to a product-oriented, fabless semiconductor company.

Cypress Semiconductor completes International Microcircuits Inc. acquisition

Mon, 3 Mar 2001
March 12, 2001--Boston, Massachusetts--TA Associates, a leading private equity firm, announced today that Cypress Semiconductor Corp. has completed the acquisition of its portfolio company, International Microcircuits Inc. (IMI), for approximately $125 million.

OSI Systems sells subsidiary SMI to Elmos Semiconductor

Tue, 3 Mar 2001
March 13, 2001--Hawthorne, California--OSI Systems Inc. today announced that it has signed a definitive agreement to sell its wholly owned subsidiary Silicon Microstructures (SMI) to ELMOS Semiconductor AG for approximately $6.5 million. The transaction is scheduled to close by the end of March.

HITACHI CABLE ADDS LEAD FRAME CAPACITY

Tue, 3 Mar 2001
Hitachi Cable Ltd. says it plans to invest some $8 million (Y1 billion) to expand its capacity to make lead frames by 50%.

Semiconductor equipment sales total in 2000 higher than previous 2 years combined

Thu, 3 Mar 2001
March 1, 2001--San Jose, California--Sales of worldwide semiconductor equipment nearly doubled in 2000, increasing 90% over the previous year, according to Semiconductor Equipment and Materials International's (SEMI) just-released 'Worldwide Semiconductor Equipment Market Statistics Report.'

Lam Research issues revised business outlook

Thu, 3 Mar 2001
March 1, 2001--As a result of the continuing weakness in semiconductor industry fundamentals, Lam Research Corp. has issued a revised business outlook and is implementing a cost-reduction plan. However, the company intends to maintain its spending on strategic development programs that address the ongoing transition to new materials such as copper and low-k dielectrics.

Lattice lowers March 2001 revenue expectations

Fri, 3 Mar 2001
March 2, 2001--Hillsboro, Oregon--Lattice Semiconductor Corp. today announced that it expects revenue for the March 2001 quarter to be approximately 20% lower than revenue reported in the prior quarter. The company believes that this shortfall is the result of a general decline in PLD consumption within the communications and computing end markets.

Fujitsu cuts earnings estimate

Fri, 3 Mar 2001
March 2, 2001--Tokyo, Japan--Fujitsu Ltd. expects that it will see about 34% growth in its sales of semiconductors for the fiscal year ending March 31, not the 41% increase it expected as recently as October, on slower sales of logic chips for consumer products and personal computers.

Worldwide semiconductor sales for January 2001 came in at $16.87 billion, reports SIA

Mon, 3 Mar 2001
March 5, 2001--San Jose, California--Worldwide sales of semiconductors totaled $16.87 billion in January 2001, an increase of 13.7% over $14.84 billion a year ago, the Semiconductor Industry Association (SIA) reported today. On a sequential basis, January sales dropped 5.7% below the December 2000 level of $17.89 billion.

IDT cuts jobs

Wed, 6 Jun 2001
June 13, 2001 - Santa Clara, CA - Integrated Device Technology (IDT) is going to cut 900 jobs, or 18% of its work force, due to a slowing demand for chips.

Quake: No major impact, says Taiwan semiconductor center

Thu, 6 Jun 2001
June 14, 2001 - Taipei, Taiwan - The administration of Hsinchu Science-based Industrial Park, which accommodates Taiwan's major semiconductor companies such as TSMC, UMC, Winbond Electronics Co, Mosel Vitelic, and Macronix International Ltd., said the earthquake that occurred on June 13 did not have any major impact on manufacturing lines' operations.

Asuka project to select tools this year

Thu, 6 Jun 2001
It looks like suppliers already working with Selete will have the advantage in getting their tools into a fab now being planned for Japan's new research consortium's fab. The Asuka project researchers plan to start selecting tools this year to install in the government's new 300mm research fab in Tsukuba the first half of 2002.

Agere cuts 4,000 more jobs, sees Q3 revs below plan

Fri, 6 Jun 2001
June 29, 2001 - Allentown, PA - Agere Systems said it was cutting another 4,000 employees, or about 25% of its work force, and expected to take up to $900 million in charges as it restructures its business to cope with the severe downturn in the semiconductor industry.

Solving the collaborative inventory puzzle

Fri, 6 Jun 2001
A recent report by AMR Research recommends a unified system of joint risk management to address collaborative inventory problems among the original equipment manufacturers (OEMs), electronic manufacturing service (EMS) providers, and semiconductor component manufacturers.

Agere Systems changes US sales channel

Mon, 7 Jul 2001
July 9, 2001 - Allentown, PA - Agere Systems will streamline its sales operations and rely solely on a direct sales force to serve all of its US customers by forging closer, more strategic working relationships.

ST publishes corporate environmental report

Tue, 7 Jul 2001
July 10, 2001 - Gevena, Switzerland - STMicroelectronics (ST) has published its fourth corporate environmental report, documenting in precise detail the company's environmental achievements for the year 2000.

Infineon eyes Friday the 13th public offering

Mon, 7 Jul 2001
July 2, 2001 -- Munich, Germany -- Chipmaker Infineon Technologies AG announced today that it plans to go ahead with a public offering of up to 60 million newly issued shares, likely on Friday, July 13.

Defect reduction takes center stage

Tue, 7 Jul 2001
Through intense concentration on cause-and-effect, and careful yield analysis, fabs are getting a much better handle on defect reduction. A wide range of approaches and solutions, and projections for the future in contamination and defect control, were explored recently in Santa Clara, CA, at a Materials Integrity Symposium sponsored by Entegris, Inc., Chaska, MN.

ASML expects losses of up to $90M

Fri, 7 Jul 2001
July 6, 2001 - Veldhoven, Netherlands - Dutch semiconductor toolmaker ASML Holding NV expects a first-half loss of up to $90 million (105 million Euros) after a 'sudden and sharp' decline in orders by chipmakers.

Infineon offers newly issued shares

Fri, 7 Jul 2001
Infineon Technologies AG announced on July 13 the sale of 52,174,000 newly issued American Depositary Shares at a price of Euro25.00/share and $21.33/ADS.

Mitsubishi Materials Silicon makes SIMOX SOI wafers with IBM technology

Mon, 7 Jul 2001
Mitsubishi Materials Silicon is starting production of 200mm and 300mm SOI wafers using IBM's SIMOX technology. It plans to ship 300mm samples by the 2H02.

NEC and TSMC to use common 0.1-micron design rule technology

Mon, 7 Jul 2001
NEC Electron Devices will standardize its UX6 0.1-micron process technology with Taiwan Semiconductor Manufacturing Co., Ltd.

Sansumg builds new lab for research on displays and batteries

Mon, 7 Jul 2001
Samsung SDI Co. Ltd. plans a new research lab to work on next generation displays and advanced batteries.

Court to appoint technical expert for Rambus/Infineon case

Fri, 7 Jul 2001
July 20, 2001, - Los Altos, CA -The District Court in Mannheim, Germany, today decided to appoint an independent technical expert to evaluate the infringement of Rambus' patent by Infineon Technologies' SDRAM and DDR SDRAM memory products.

Agere Systems to sell Madrid chip fabrication facility

Thu, 7 Jul 2001
July 26, 2001 - Allentown, PA - Agere Systems has signed a definitive agreement to sell its Madrid, Spain chip fabrication facility to BP, a leading global energy company.

Fraud found in Rambus case; $3.5 million judgment served

Wed, 5 May 2001
May 9, 2001 - Richmond, VA - It's yet more bad news for Rambus Inc., Los Altos, CA, as a jury found the company guilty of fraud with regard to Rambus' participation with JEDEC, as charged by German firm Infineon.

Mitel lays off 17% of its work force

Thu, 5 May 2001
May 10, 2001 - Ottawa, Canada, - Mitel Corp. has announced further workforce reductions, after releasing 5% of its team during 1Q01.

Lam opens new Singapore office and training center

Fri, 5 May 2001
May 18, 2001 - Fremont, CA - Lam Research Corp. is opening a combined sales office and training center in Singapore. The new center expands sales and service support and meets the increased need for equipment training locally, which lowers costs for customers, according to Lam. The 20,000-square-foot-plus facility houses sales offices, training rooms, and a training lab.

TEL sues Discreet, others in US District Court

Mon, 5 May 2001
May 21, 2001 - Gilbert AZ - Tokyo Electron Arizona today sued Discreet Industries Corp., Mineola, NY, in the US District Court for the Eastern District of NY.

Intel, Philips to furlough employees

Thu, 5 May 2001
May 24, 2001 - Albuquerque, NM - Intel Corp., Santa Clara, CA, is seeking volunteers to take two weeks of unpaid leave while Philips Semiconductors, Eindhoven, Netherlands, plans to furlough about 180 employees for three months without pay, the companies have announced.

Tokyo Electron Kyushu to slash capex

Fri, 5 May 2001
May 25, 2001 - Kumamoto, Japan - Semiconductor manufacturer Tokyo Electron Kyushu Ltd., will cut capital spending down to $58.4 million (7 billion yen) in the current fiscal year, a year-on-year decline of 70%.

Applied Materials to acquire Oramir

Wed, 5 May 2001
May 30, 2001 - Santa Clara, CA - Applied Materials, has signed an agreement to acquire Oramir Semiconductor Equipment Ltd., Yoqneam, Israel.

National Semi may close plant again

Mon, 6 Jun 2001
June 11, 2001 - Santa Clara, CA - National Semiconductor's Arlington, TX, plant resumed production Monday after an eight-day shutdown, the third time this year that chip manufacturing has been halted.

TI senior VP Elwin Skiles Jr. dies

Wed, 6 Jun 2001
June 13, 2001 - Dallas, TX - Elwin Skiles Jr., senior VP for public affairs at Texas Instruments, died Sunday after a lengthy battle with cancer. A 24-year TI veteran and member of the company's senior management team, Skiles, 60, was responsible for TI's government, philanthropic and community activities.

Nikon introduces ultra-high NA ArF Scanner

Fri, 6 Jun 2001
June 29, 2001 - Belmont, CA - Nikon Precision Inc. (NPI) has announced its fourth-generation lens-based 193nm scanner designed to meet the stringent manufacturing requirements for 100nm semiconductor devices.

Ibis reduces headcount by 14%

Fri, 6 Jun 2001
June 1, 2001 - Danvers, MA - Ibis Technology Corp. has reduced its headcount by 14%, in addition to other cost cutting measures. The company cites the continuing downturn of the semiconductor and telecommunications industries as the reason for the cutbacks.

Trikon announces job cuts

Fri, 6 Jun 2001
June 1, 2001 - Newport, Wales, United Kingdom - Trikon Technologies Inc. announced today that it had initiated a cost reduction program that will reduce its quarterly operating costs by approximately 10% with measures that include a 12% global headcount cut.

ON Semiconductor lays off 1,000 workers

Thu, 6 Jun 2001
June 7, 2001 - Phoenix, AZ - ON Semiconductor Corp. is laying off about 1,000 workers worldwide and cutting back the salaries of remaining staff by 10%.

Intel: Still on course with earlier projections

Fri, 6 Jun 2001
June 7, 2001- Santa Clara, CA - Intel Corp. affirmed its earlier projections for the second quarter, which ends June 30, in the company's first-ever mid-quarter update, giving some credence to the industry's hope for a light at the end of the downturn tunnel.

Semitool files suit

Tue, 6 Jun 2001
June 12, 2001 - Kalispell, MT - Semitool has filed suits against Applied Materials is the US District Court for the Northern District of CA, and against Novellus Systems, Ebara Corp., and Ebara Technologies, in the US District Court for Oregon.

ARM and Intel extend licensing agreement

Mon, 7 Jul 2001
July 30, 2001 - Cambridge, England, and Santa Clara, CA - ARM and Intel Corp. announced that theys have signed a new licensing agreement, extending Intel's existing license to include the next generation ARMv6 architecture as well as providing Intel with the ability to offer specific ARM core design implementations.

Vishay acquires Infineon's IR components business

Mon, 7 Jul 2001
July 30, 2001 - Malvern, PA - Vishay Intertechnology Inc. has completed its acquisition of Infineon's entire infrared components business for approximately $120 million. Under the terms of the agreement, Vishay will take over Infineon's development, marketing, and distribution activities located in the San Jose, CA, headquarters, as well as a production facility in Krubong, Malaysia.

Typhoon hits Taiwan; 35 dead, 108 missing

Mon, 7 Jul 2001
Deadly Typhoon Toraji hit east and south Taiwan on Monday, triggering what officials called the worst mudslides and floods in over 50 years.

Asyst Technologies CFO to resign

Wed, 8 Aug 2001
August 8, 2001 - Fremont, CA - Asyst Technologies' Douglas McCutcheon, senior VP and CFO, plans to leave the company within the next few months. McCutcheon has agreed to continue in his current role until a successor has been identified to support a smooth transition and to complete various projects. He intends ultimately to pursue other business opportunities in the San Francisco Bay area. A search for a successor to McCutcheon is under way.

Rambus shareholders file class action suit

Mon, 8 Aug 2001
Aug. 13, 2001 - New York, NY - A class action lawsuit has been filed against Rambus Inc. on behalf of all shareholders who purchased common stock between February 11, 2000 and May 9, 2001.

Tegal calls appeal a win

Mon, 8 Aug 2001
Aug. 13, 2001 - PETALUMA, CA - Tegal Corp. said today that an appellate court has affirmed in virtually every respect a judgment entered for Tegal in 1999 against Tokyo Electron Limited for infringing US patent No. 4,464,223.

Toshiba Ceramics to trim output at 10 plants

Tue, 8 Aug 2001
August 14, 2001 - Tokyo, Japan - Toshiba Ceramics Co. will reduce output at 10 factories due to falling orders for its mainline silicon wafers on the back of the sluggish semiconductor market.

Fujitsu lays out roadmap for lower cost FeRAMs to replace some E2PROMs and SRAMs

Thu, 8 Aug 2001
August 16, 2001 - Fujitsu says it will move to a 0.35-micron, one-transistor, one-capacitor (1T1C) FeRAM by spring of 2002, and a 0.18-micron version by the middle of 2003.

TranSwitch to buy Onex

Fri, 8 Aug 2001
Aug. 17, 2001 - Shelton, CT - TranSwitch Corp. has agreed to buy fellow communications chipmaker Onex Communications Corp., Bedford, MA, for about $75 million in cash and stock.

International Rectifier launches Chinese website

Tue, 8 Aug 2001
Aug. 21, 2001 - El Segundo, CA - International Rectifier (IR), a supplier of power semiconductors and systems solutions, has launched a Chinese-language website, www.irf.com.cn, to increase communication channels for customers in China.

Industry giants give boost to education

Tue, 8 Aug 2001
Two industry leaders, Dell and Texas Instruments, recently announced separate initiatives to aid local school systems.

Silicon Labs expands executive management team

Tue, 8 Aug 2001
August 28, 2001 - Austin, TX - Daniel Artusi has joined Silicon Laboratories Inc. as COO, effective immediately. Artusi will oversee Silicon Labs' daily business operations, including the Wireless, Wireline and Optical Networking Divisions, Sales, and Manufacturing.

Genus' CFO resigns to leave Silicon Valley

Thu, 8 Aug 2001
August 30, 2001 - Sunnyvale, CA - Genus Inc.'s CFO, Kenneth Schwanda, is resigning after nine years with Genus and is relocating out of the Bay Area. Bill Elder, CEO of Genus, will act in an interim capacity until a permanent replacement is found. Schwanda will be retained as a consultant through the transition period.

Dai Nippon Printing to begin consigned MEMS processing

Wed, 8 Aug 2001
August 15, 2001 - Tokyo, Japan - Dai Nippon Printing Co. will begin a consignment business fabricating micrometer-scale structures on silicon substrates for microelectromechanical systems (MEMS).

Taiwan's optoelectronic industry reports 11.5% rise in industrial output for 1H01

Mon, 8 Aug 2001
August 20, 2001 - Taiwan - Taiwan's optoelectronic industry reported an 11.5% rise in industrial output for 1H01, according to the Commercial Times. The industry's output of optoelectronic monitors rose 30%, optoelectronic components grew 15%, and optoelectronic input and output equipment gained 11%.

SEMI study identifies eBusiness opportunities

Tue, 8 Aug 2001
The results of a recent eBusiness study conducted by SEMI (Semiconductor Equipment and Materials International) San Jose, CA, found that knowledge management, supply chain integration and customer relationship management are the key areas the industry needs to address.

National Scientific, UMC team up for WLAN development

Mon, 4 Apr 2001
April 16, 2001 - National Scientific Corporation and United Microelectronics Corp. today announced they are aligning to gain the capacity required for manufacturing a new family of wireless products that target the requirements of the wireless local area network industry.

TI reportedly to lay off at least 2,000

Tue, 4 Apr 2001
April 17, 2001 - Texas Instruments Inc. plans to lay off at least 2,000 workers in response to the soft demand for its semiconductor products, according to published reports.

TI confirms layoffs to cut costs

Tue, 4 Apr 2001
April 17, 2001 - Dallas, TX - Texas Instruments announced today it would lay off about 2,500, or 6%, of its worldwide work force.

Dow, Samsung partner for low-k research

Tue, 4 Apr 2001
April 24, 2001 - Midland, MI and Seoul, Korea - Dow Corning Corp. and Samsung Electronics Co. Ltd. have signed an agreement to develop and refine interlayer dielectric applications using Dow Corning XKL Spin-on Dielectric.

Court rejects Applied Materials' motion to dismiss

Thu, 4 Apr 2001
April 26, 2001 - Beverly, MA - Axcelis Technologies announced that the US District Court in Massachusetts has rejected a motion filed by Applied Materials, Santa Clara, CA, that sought to dismiss three of the four claims brought against it by Axcelis.

Infineon sets sail with startup Catamaran

Mon, 4 Apr 2001
April 30, 2001- Munich, Germany - Infineon Technologies AG will acquire Catamaran Communications Inc., San Jose CA, a fabless optical IC startup. Infineon will pay $250 million in common stock for the company, which was founded in 1999.

Cymer to reduce work force

Fri, 5 May 2001
May 4, 2001 - San Diego, CA - Cymer Inc. is set to reduce its worldwide work force by approximately 9% as part of its previously announced cost-reduction program.

Atmel floats new SOC

Mon, 5 May 2001
May 7, 2001 - San Jose, CA - Atmel(R) Corp. has unveiled a new programmable system-on-a-chip designed specifically for low-power, high performance portable applications.

Lambda introduces PowerGator laser

Wed, 5 May 2001
May 16, 2001 - Fort Lauderdale, FL - Lambda Physik introduces its PowerGator 532-15, the latest in the company's series of industrial-grade DPSS lasers.

Judge tosses all but 3 claims against Infineon

Tue, 5 May 2001
May 1, 2001 - Richmond, VA - The federal judge presiding over the Infineon/Rambus trial tossed out 54 claims brought by Rambus Inc. against Infineon, leaving only three patent infringement claims upon which the case now centers.

Mattson to reduce work force and operating expenses

Fri, 5 May 2001
May 4, 2001 - Fremont, CA - Mattson Technology will implement a global cost reduction program, targeting a 20% overall expense reduction for fiscal 2001.

Claims against Infineon tossed; Rambus vows appeal

Fri, 5 May 2001
May 4, 2001- Richmond, VA - The judge presiding over the Rambus/Infineon trial has tossed out the remaining three patent infringement claims against Infineon, and Rambus has promised an appeal.

Entegris to realign manufacturing facilities

Wed, 5 May 2001
May 9, 2001 - Chaska, MN - Entegris, Inc. is set to realign the company's manufacturing facilities to increase the efficient and effective utilization of its manufacturing capabilities worldwide. As part of the realignment, facilities in Castle Rock, Colorado, and Munmak, Korea will be closed and production shifted worldwide to optimize global production.

National Semiconductor reports net income of $48.9 million for 3Q'01

Thu, 3 Mar 2001
March 8, 2001--Santa Clara, California--National Semiconductor Corp. (NEC) today reported net income of $48.9 million, or 27 cents per share, on revenues of $475.6 million for the third quarter of fiscal 2001, which ended February 25, 2001. This excludes a pretax charge of $12.1 million for in process R&D related to the acquisition of innoCOMM during the quarter. Including that charge, the company reported net earnings of $39.2 million, or 21 cents per share.

Teradyne adjusts 1Q earnings guidance

Fri, 3 Mar 2001
March 9, 2001--Boston, Massachusetts--Teradyne Inc. is lowering its guidance for sales and earnings for the first quarter of 2001 and has put several expense control measures into effect.

ON Semiconductor sales down 30% from last quarter

Mon, 3 Mar 2001
March 12, 2001--Phoenix, Arizona--ON Semiconductor Corp. recently announced that product revenues for the first quarter of 2001 are expected to be down approximately 30% from the fourth quarter of 2000, with an expected loss per share of 13 to 15 cents, excluding restructuring charges, amortization of goodwill, and other intangibles.

TranSwitch predicts flat quarter

Mon, 3 Mar 2001
March 12, 2001--Shelton, Connecticut--TranSwitch Corp. has announced that due to increased weakness in the telecommunications systems market in North America, as evidenced by recent announcements by major telecom systems vendors, it expects that its first quarter 2001 revenue will be essentially flat compared to fourth quarter 2000 revenue of $51million.

General Semiconductor expects first quarter revenues to be down

Mon, 3 Mar 2001
March 12, 2001--Melville, New York--General Semiconductor, Inc., a leading manufacturer of power management devices, today updated its business outlook for the first quarter. As a result of the continued slowdown in our customers' markets and excess inventory still in the channels, first quarter revenues are expected to be 14 to 16% below the $119.9 million reported in the previous quarter.

Asyst lowers revenue expectations, implements workforce reductions

Wed, 3 Mar 2001
March 14, 2001--Fremont, California--Citing the sharp economic slowdown and accompanying inventory corrections in worldwide technology markets, Asyst Technologies, Inc. has revised its expectations for revenues in the fourth quarter of fiscal year 2001 (ending March 31, 2001), and announced that a workforce reduction of 17% will take place.

Quake develops two physical-layer chips

Thu, 3 Mar 2001
March 1, 2001--Ottawa, Canada--Quake Technologies Inc., a fabless semiconductor start up, announced today that it is developing two revolutionary physical-layer chips for high-speed optical networking applications.

Infineon introduces leadless package for discrete semiconductors

Wed, 3 Mar 2001
March 7, 2001--Munich, Germany--Infineon Technologies AG, one of the leading suppliers of radio frequency (RF) and audio frequency (AF) discrete semiconductors to the communication industry, today introduced a revolutionary packaging technology. The thin, small, leadless package (TSLP) represents a milestone in size, performance, and package innovation, meeting market demands for smaller components in a broad range of wireless and portable products.

Robotic handler hits reliability milestone

Thu, 3 Mar 2001
The robotic handler of Solid State Equipment Corp.?s (SSEC) Trilennium processor has passed 100,000 unattended cycles of in factor life-testing. No interruptions or failures were recorded.

Axcelis extends ion implantation to 70nm technology node

Mon, 3 Mar 2001
March 5, 2001--Beverly, Massachusetts--Axcelis Technologies, Inc. has integrated its patented decaborane source technology onto a conventional ion implantation system and successfully implanted device wafers. Decaborane, a molecule containing ten boron atoms, provides the equivalent of a ten-fold increase in beam current at one-tenth the energy. Axcelis' decaborane source provides a viable path for extending the technology of ion implantation.

MIT pioneers online lab in microelectronics

Wed, 3 Mar 2001
March 7, 2001--Cambridge, Massachusetts--Massachusetts Institute of Technology (MIT) students now can test and probe fragile, microscopic electronic structures via a novel online lab that can be accessed from dorm rooms and other convenient locations 24 hours a day.

IC Insights forecasts quarterly IC market growth to begin in 3Q01

Fri, 3 Mar 2001
March 2, 2001--Scottsdale, Arizona--IC Insights, a market research firm based in Scottsdale, AZ, believes that sequential quarterly growth will return to the IC industry beginning in 3Q01. Examining the last 5 IC industry downturns that have occurred over the past 20 years, IC Insights reports that there is both good and bad news regarding the current situation.

Fujitsu opens testing center

Fri, 3 Mar 2001
March 2, 2001--Tokyo, Japan--Fujitsu Ltd. now has its new $43 million systems chip testing center in Aizu Wakamatsu up and running, consolidating the testing of systems chips from its various assembly plants.

Dow achieves ultra low-k dielectric material with k=2.0

Mon, 3 Mar 2001
March 5, 2001--Midland, Michigan--Dow Chemical Co. today announced a breakthrough in the development of SiLK semiconductor dielectric resin for 100nm chip designs and beyond, achieving a viable ultra low-k material with k=2.0. The porous, spin-on film will enable the continued miniaturization of ICs to improve their speed and performance.

Motorola, Elmos form partnership to drive standard architectures for the automotive market

Tue, 3 Mar 2001
March 6, 2001--Austin, Texas--Motorola, the leading supplier of semiconductors to the automotive industry, and Germany-based Elmos Semiconductor AG, a leading manufacturer of application-specific ICs for automotive electronics, today announced a long-term partnership to jointly drive innovative architectures for the automotive market.

Foundries expected to outperform the industry as a whole in 2001

Tue, 3 Mar 2001
March 6, 2001--Scottsdale, Arizona--Cahners In-Stat market researchers report that while the overall semiconductor industry grew by 36.8% in 2000, leading foundries experienced a faster growth rates in the 60 to 125% range.

Silicon Integrated Systems, IBM enter patent cross-licensing agreement

Wed, 3 Mar 2001
March 7, 2001--Taipei, Taiwan--Silicon Integrated Systems Corp. (SiS) and IBM Corp. have signed a patent cross-licensing agreement that includes design and process related patents. Specific details of the agreement have not yet been disclosed.

Intel lowers first quarter outlook, reduces workforce

Fri, 3 Mar 2001
March 9, 2001--Santa Clara, California--Intel Corp. yesterday lowered its revenue outlook for the first quarter of 2001 and announced plans to reduce its workforce by 5,000. Intel now predicts that revenue for the first quarter will be down approximately 25% from its fourth quarter 2000 revenue of $8.7 billion.

U.S. EPA, SIA partner to reduce emissions of perfluorocompounds by 10%

Tue, 3 Mar 2001
March 13, 2001--Washington, DC--The U.S. Environmental Protection Agency (EPA) and the Semiconductor Industry Association (SIA) today will enter a new voluntary partnership to reduce emissions of perfluorocompounds--the most potent and persistent of all global warming gases, which are used by the semiconductor industry to clean semiconductor manufacturing equipment and to etch wafers--10% from 1995 levels by the end of 2010.

Matsushita signs SDRAM and DDR controller license agreement with Rambus

Wed, 3 Mar 2001
March 14, 2001--Osaka, Japan--Matsushita Electric Industrial Co. Ltd. has signed a patent license agreement with Los Altos, CA-based Rambus Inc. for SDRAM controllers and double data rate (DDR) controllers that directly interface with these types of memory.

Infineon develops silicon carbide power semiconductors

Tue, 2 Feb 2001
FEB. 6 Munich, Germany--Infineon Technologies AG is believed to have become the world's first manufacturer of power semiconductors producing Schottky diodes based on silicon carbide (SiC) technology. These new diodes allow significantly lower switching losses and higher switching frequencies, according to the company, while offering much higher operating voltage ranges than traditional silicon Schottky diodes.

NEC, NTT to collaborate on quantum device research

Wed, 2 Feb 2001
FEB. 14 Tokyo, Japan--NEC Corp. and Nippon Telegraph & Telephone Corp., both of Tokyo, have agreed to work together on basic research into quantum devices for future ultra-high-speed computers.

Fundamental limit defines future opportunities for silicon nanoelectronics

Tue, 2 Feb 2001
FEB. 20 Atlanta, Georgia--Electronics researchers have defined a fundamental limit that will help extend a half-century's progress in producing ever-smaller microelectronic devices for increasingly more powerful and less expensive computerized equipment.

Hitachi joins IMEC's high-k dielectrics program

Fri, 2 Feb 2001
February 23, 2001--Tokyo, Japan--Hitachi Ltd. has joined Belgium-based independent research center IMEC's industrial affiliation program on high-k dielectrics with the goal of overcoming one of the major roadblocks of the International Technology Roadmap for Semiconductors (ITRS). IMEC and Hitachi will cooperate for 3 years on the development of gate-stack processes needed for sub-70nm devices.

'Nanowires' with low resistance may lead to faster, smaller circuits

Tue, 2 Feb 2001
February 27, 2001--Upton, New York--Scientists at the U.S. Department of Energy's Brookhaven National Laboratory (BNL) and Stanford University have developed molecular wires millions of times smaller in diameter than a human hair. These nanowires have high rates of electron transfer with very low resistance.

TEL to acquire Timbre Technologies

Tue, 2 Feb 2001
Tokyo, Japan--Tokyo Electron Ltd. (TEL), a leading supplier of semiconductor and LCD production equipment, has signed a definitive agreement to acquire Fremont, CA-based Timbre Technologies Inc.

Kopin, RSC to develop InP HBTs for ultra-high-speed circuits

Thu, 2 Feb 2001
Taunton, Massachusetts--Kopin Corp., a provider of heterojunction bipolar transistors (HBTs) for wireless and fiber-optic telecom applications, has entered into an agreement with Rockwell Science Center (RSC) of Thousand Oaks, CA, a leader in the development of ultra-high-speed device and circuit technologies and advanced HBT technologies, to accelerate the development of indium phosphide (InP)-based HBTs for commercial applications.

Motorola cutting 4,000 semiconductor jobs

Fri, 2 Feb 2001
Austin, Texas--In a continuation of cost-reduction measures Motorola began in the fourth quarter, the company's Semiconductor Products Sector today announced further steps to boost efficiency and improve profitability.

Amkor expands product test capabilities

Tue, 2 Feb 2001
FEB. 13 Chandler, Arizona--Amkor Technology is expanding its product test capabilities by adding two additional test development centers, located in San Jose, CA, and Wichita, KS, to its worldwide test services organization.

Brooks Automation acquires SEMY Engineering

Tue, 2 Feb 2001
FEB. 20 Chelmsford, Massachusetts--Brooks Automation, Inc., a supplier of tool and factory hardware and software automation solutions for the semiconductor industry, announced today that it has acquired SEMY Engineering, Inc. (SEMY) of Phoenix, Arizona, a wholly owned subsidiary of Semitool, Inc. and a leading provider of advanced process and equipment control systems for the semiconductor industry.

Semiconductor sales transacted via e-commerce projected to reach 38% by 2003

Tue, 2 Feb 2001
FEB. 20 Scottsdale, Arizona--Semiconductor manufacturers and suppliers are rapidly boosting their e-commerce capabilities, according to a new market research study by Cahners In-Stat Group, which creates benefits throughout the supply chain.

TranSwitch acquires Horizon Semiconductors

Wed, 2 Feb 2001
February 21, 2001--Shelton, Connecticut--TranSwitch Corp. today announced the acquisition of privately held Horizon Semiconductors, Inc., a specialized design for test and diagnostics engineering service company. Horizon's design for test expertise will be used to support the product development efforts going on in all of TranSwitch's design centers in North America, Europe, and Asia.

Motorola, Blue Wave sign merger agreement

Wed, 2 Feb 2001
February 21, 2001--Tempe, Arizona--Motorola, Inc. and Blue Wave Systems, Inc., a leading provider of high-performance digital signal processor solutions to OEMs, have signed a definitive merger agreement.

Wacker Siltronic AG's expansion plans for silicon wafers on hold

Thu, 2 Feb 2001
February 22, 2001--Burghausen, Germany--Citing growing signs of weakness in the global semiconductor markets, Wacker Siltronic AG, a major supplier of silicon wafers, has suspended and will review its fast-track capacity expansion plans.

ITC sets date to hear Tessera's patent dispute with Sharp

Thu, 2 Feb 2001
February 22, 2001--San Jose, California--The U.S. International Trade Commission (ITC) has scheduled an April 5 investigation into a patent infringement dispute filed by Tessera Inc. against Sharp Corp. and Sharp Electronics Corp last year. Tessera's complaint alleges that Sharp semiconductor chips in certain chip-scale packages infringe Tessera patents, and seeks an exclusion order that would ban importation of Sharp's packaging semiconductors and the OEM products that incorporate them.

Intel to acquire VxTel for $550 million

Mon, 2 Feb 2001
February 26, 2001--Santa Clara, California--Intel Corp. today announced it has entered into a definitive agreement to acquire privately held VxTel Inc. in a cash transaction worth approximately $550 million. VxTel is a semiconductor company that has developed unique Voice over Packet (VoP) products that deliver high-quality voice and data communications over next-generation optical networks.

Texas Instruments to close Santa Cruz facility

Thu, 3 Mar 2001
March 15, 2001--Dallas, Texas--Texas Instruments Inc. yesterday announced plans to consolidate its Santa Cruz, CA, operations into other existing manufacturing facilities, primarily in Dallas and Houston. The TI-Santa Cruz facility, which primarily manufactures semiconductors used in computer hard-disk drives, will be closed in phases through the end of 2001. About 600 people are employed at the site.

Applied introduces CVD TiSiN barrier process

Thu, 3 Mar 2001
Applied Materials has introduced a CVD TiSiN (titanium silicon nitride) barrier process.

LSI Logic acquires C-Cube

Mon, 3 Mar 2001
LSI Logic Corp., and C-Cube Microsystems announced a definitive merger agreement in which LSI Logic will acquire C-Cube in a stock-for-stock transaction.

Altera, Nuvation form partnership

Fri, 4 Apr 2001
April 6, 2001 - San Jose, CA - Altera Corp. and Nuvation Labs Corp. have partnered through the Altera Consultant Alliance Program.

Applied unveils new EpiClean technology

Fri, 4 Apr 2001
April 6, 2001 - Santa Clara, CA - Anticipating growth in the SiGe market, Applied Materials Inc. has rolled out new EpiClean technology for its Epi Centura systems.

Adept releases new machine vision software

Mon, 4 Apr 2001
April 9, 2001 - San Jose, CA - Adept Technology, Inc. has released its new machine vision software product for robot guidance and parts inspection.

Altera launches embedded processor solution

Tue, 4 Apr 2001
April 10, 2001 - San Francisco, CA - Altera Corp. unveiled its ARM9-based Excalibur embedded processor solution for system-on-a-programmable-chip (SOPC) designs at the Embedded Systems Conference, held this week in San Francisco, CA.

MUSIC sings praises of new queueing chip

Mon, 4 Apr 2001
April 16, 2001 - Milpitas, CA - MUSIC Semiconductors Inc. has introduced an application-specific standard product family that combines proprietary active memory technology with embedded microsequencer techniques to manage packet prioritization and quality of service in high-speed networks.

UMC unveils new logic process option

Mon, 4 Apr 2001
April 16, 2001 - Sunnyvale, CA - UMC announced today that its foundry now offers a process to combine high-speed and low-power logic transistors into one design.

Infineon introduces 1300nm Vertical Cavity Surface-Emitting Lasers

Mon, 4 Apr 2001
April 9, 2001 - Munich, Germany - Infineon Technologies says it has achieved a breakthrough in 1300nm Vertical Cavity Surface-Emitting Laser (VCSEL) technology.

STMicroelectronics, Hitachi to create new company

Tue, 4 Apr 2001
April 2, 2001 - San Jose, CA - STMicroelectronics and Hitachi, Ltd. have signed an agreement to establish an independent company, named SuperH, Inc., to develop and license RISC microprocessor cores of the SuperH(TM) family.

National Semiconductor fined by EPA

Wed, 4 Apr 2001
April 4, 2001 - South Portland, ME - The U.S. EPA has ordered National Semiconductor Corp. to pay more than $302,990 for violating hazardous waste regulations.

Agilent acquires Italian fiber-optics firm

Fri, 4 Apr 2001
April 6, 2001 - Boblingen, Germany - Agilent Technologies Inc. has completed its $55 million acquisition of Gefran Silicon Micro Systems S.r.l., a subsidiary of Gefran S.p.A. of Provaglio d'Iseo, Italy.

Vitesse lowers 2Q01 outlook

Fri, 4 Apr 2001
March 27, 2001 - Camarillo, California - Vitesse Semiconductor Corp. has reduced its 2Q01 revenue forecast to $120 to $125 million, down from the previously-forecasted $150 to $160 million.

UMC collaborates with Synopsys and Virtual Silicon

Tue, 4 Apr 2001
April 10, 2001 - Mountain View, CA - United Microelectronics Corp., Synopsys, Inc., and Virtual Silicon are collaborating in an effort to give their customers a new alternative for getting their designs to tape out, and therefore final production, more quickly.

Dutch STE advises investigation of Philips' CEO Boonstra

Thu, 4 Apr 2001
April 12, 2001 - Amsterdam, Netherlands - The Dutch stock exchange regulator (STE) has confirmed its recommendation that the Attorney General of Amsterdam launch an investigation of Cor Boonstra, president and CEO of Royal Philips NV.

UMC breaks ground on Singapore foundry

Thu, 4 Apr 2001
April 12, 2001 - Singapore - UMC held a groundbreaking ceremony today for its new 300-mm fab of its new Singapore affiliate company, UMCi Pte Ltd.

LSI to close Colorado plant

Thu, 4 Apr 2001
April 12, 2001 - Milpitas, CA - LSI Logic announced it would close its Colorado Springs, CO, manufacturing facility in August.

Cypress close to HiBand acquisition

Fri, 4 Apr 2001
April 13, 2001 - San Jose, CA - Cypress Semiconductor Corp. has satisfied closing conditions for the acquisition of HiBand Semiconductors.

Rolling blackouts in CA leave electronics industry questioning reliability of power supply

Mon, 1 Jan 2001
San Jose, California--As California heads into its third week of electricity shortages, the bout of rolling blackouts has left many in the electronics industry questioning the reliability of adequate power within the state.

NEC joins Cypress, IDT, and Micron in QDR static RAMS effort

Mon, 1 Jan 2001
San Jose, California--NEC Corp. has joined Cypress Semiconductor Corp., IDT, Inc., and Micron Technology Inc. in their efforts to design and manufacture Quad Data Rate (QDR) static RAMs.

Maxim to acquire Dallas Semiconductor

Mon, 1 Jan 2001
Sunnyvale, California--Maxim Integrated Products, Inc. and Dallas Semiconductor Corp. today announced an agreement under which Maxim will purchase Dallas Semiconductor, a leading provider of specialty semiconductors.

Allegro and partners to form front-end equipment foundry in Singapore

Mon, 1 Jan 2001
Singapore--Allegro Manufacturing Pte Ltd. announced today that it has secured investments from EDB Investments Pte Ltd. of Singapore, Hermes-Epitek Corp. of Taiwan, Lam Research Corp. of CA, Tokyo Electron Ltd. of Japan, and other private investors to form a semiconductor front-end equipment foundry in Singapore.

Credence lowers revenue outlook, reduces workforce

Mon, 2 Feb 2001
February 12, 2001--Fremont, California--Credence Systems Corp. has laid off 200 people in an attempt to reduce company costs, in line with previously announced lower anticipated revenues for the first quarter of 2001. Other initiatives, including the consolidation and reorganization of certain functions and operations, also are being implemented.

Praxair increasing price of sputtering targets and evaporation materials

Tue, 2 Feb 2001
February 12, 2001--Orangeburg, New York--The Materials Research Division of Praxair Surface Technologies, Inc. has increased prices for sputtering targets and evaporation materials by 5% to 13%, depending on materials and configuration.

Kulicke & Soffa to cut workforce by 300

Wed, 2 Feb 2001
February 14, 2001--Willow Grove, Pennsylvania--Kulicke & Soffa Industries, Inc., a leading supplier of semiconductor interconnect equipment, materials and technology, has announced a workforce reduction of approximately 300 people representing about 7% of its total workforce.

Rippey Corp. awarded patents

Wed, 2 Feb 2001
February 14, 2001--El Dorado Hills, California--Rippey Corp., a global leader in semiconductor and rigid disk media critical cleaning products and technology, announced today that it has received three patents relating to the manufacture, packaging, and processes for producing their Rippey Microclean PVA products line.

Lam ships 1,000th post-CMP clean system

Thu, 2 Feb 2001
February 15, 2001--Fremont, California--Lam Research Corp. yesterday announced the shipment of its 1,000th post-CMP clean system. The Lam Synergy Integra clean system, which is integrated with Lam's Teres CMP system, was delivered to Philips Semiconductor's San Antonio, Texas facility, where it will be used for post-CMP clean following direct-polish shallow trench isolation.

Mattson to divest single-wafer RT-CVD business unit

Wed, 2 Feb 2001
February 21, 2001--Fremont, California--Mattson Technology, Inc., a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that the company plans to divest its single-wafer RT-CVD business unit, previously known as STEAG CVD Systems.

Sumitomo Electric files patent infringement suit against Furukawa

Tue, 2 Feb 2001
February 27, 2001--Osaka, Japan--Sumitomo Electric Industries, Ltd. (SEI) has filed a patent infringement lawsuit in Delaware Federal Court against Furukawa Electric Co., Ltd. and two of its U.S. subsidiaries, Furukawa Electric North America, Inc., and FITEL Technologies, Inc. SEI alleges in its complaint that Furukawa's Rainbow Pump semiconductor pump laser module products infringe its U.S. Patent No. 5,845,030.

Comdisco Electronics tops $100 million during first year in Mexico

Tue, 2 Feb 2001
February 12, 2001--San Diego--Comdisco Electronics Co., a division of Comdisco Inc., today announced that revenues from its year-old operation in Mexico have topped more than $100 million in lease volume and services. During the past year, Comdisco Electronics has supplied funded equipment rental, planning, upgrading, and remarketing services to leading electronics companies in Mexico.

AMD reached profit sharing distribution record of $103 million in 2000

Tue, 2 Feb 2001
February 12, 2001--Sunnyvale, California--Advanced Micro Devices (AMD) yesterday distributed $23.6 million in profit sharing to U.S. employees for the fourth quarter of 2000. Employees received the equivalent of approximately 3 weeks' pay, half in cash and half in deferred compensation. The cumulative profit-sharing payout for 2000 amounted to an AMD record of more than $103 million, or nearly 12 weeks' pay.

QUALCOMM invests in ChipPac's assembly and test operations in China

Tue, 1 Jan 2001
San Diego, California--QUALCOMM Inc. has invested $25 million in ChipPac, Inc. and signed an agreement with the company for supply and test services for its mobile station modem (MSM) ICs. The investment, which was finalized in August 2000, combined with ChipPac's recent announcement of direct sales in China, allows QUALCOMM to assemble and test its chips in China for future Chinese customers, and ensures capacity availability for semiconductor production in China.

Worldwide semiconductor market reached $222.1B in 2000

Tue, 1 Jan 2001
San Jose, California--The worldwide semiconductor market reached $222.1 billion in 2000, up 31% from 1999, according to San Jose, California-based market research firm Dataquest Inc., a unit of Gartner Group, Inc.

Nanometrics lowers Q4 expectations

Tue, 1 Jan 2001
Milpitas, California--Nanometrics Inc. is expecting to report lower than anticipated revenues for its fourth quarter (Q4), which ended December 31, 2000. The company says that it now expects revenues of approximately $20 million, and attributes the shortfall to shipment rescheduling by a large customer that resulted in a mismatch of available material.

Fairchild's Q4 sales up slightly from Q3

Mon, 1 Jan 2001
South Portland, Maine--Fairchild Semiconductor International, Inc. has announced fourth quarter (Q4) 2000 sales in the range of $468 million to $470 million. Trade revenues were up 36% from Q4 1999 and up slightly from third quarter (Q3) 2000, while foundry revenues from manufacturing service agreements with other semiconductor vendors dropped sequentially.

Semtech Corp. forecasts sequentially flat Q4

Mon, 1 Jan 2001
Newbury Park, California--Semtech Corp. recently announced that it expects to achieve analysts' consensus earnings estimates of 23 cents per share for the fourth quarter (Q4) ending January 28, 2001. Semtech is forecasting that Q4 revenue will be sequentially flat compared with third quarter levels.

Celeritek reports Q3'01 revenue results up 105% over Q3'00

Thu, 1 Jan 2001
Santa Clara, California--Celeritek, Inc., a designer and manufacturer of GaAs semiconductor components and GaAs-based subsystems for broadband transmission of voice, video, and data over wireless networks, recently announced results for the quarter ended December 31, 2000, the third quarter (Q3) of fiscal year 2001.

Motorola's Q4'00 sales up slightly over Q4'99

Thu, 1 Jan 2001
Schaumburg, Illinois--Motorola, Inc. has reported sales of $10.1 billion in the fourth quarter (Q4) of 2000, an increase of 11% from $9.1 billion a year earlier. Excluding special items, earnings were $335 million, or 15 cents per share, down 41% from $564 million, or 25 cents per share a year ago.

TriQuint reaches $300 million mark, executives lose hair

Fri, 1 Jan 2001
Hillsboro, Oregon--TriQuint Semiconductor, Inc. today announced that annual revenues for 2000 are expected to come in better than anticipated, and will be about $300.6 million. The results prompted the company's senior management team to make good on a wager made with its sales force at the beginning of the year to shave each of the senior executives' heads should revenues exceed the $300 million milestone as compared with the $163.6 million recorded in 1999.

Teradyne announces Q4 results

Wed, 1 Jan 2001
Boston, Massachusetts--Teradyne, Inc. reported sales of $789.2 million and net income of $117.7 million ($0.66 per share) for the fourth quarter (Q4) of 2000, excluding the impact of the adoption of Staff Accounting Bulletin (SAB) 101. Orders for Q4 of 2000 totaled $651.6 million.

Applied Micro Circuits Corp. reports Q3 revenue up

Wed, 1 Jan 2001
San Diego, California--Applied Micro Circuits Corp. recently reported its financial results for the third quarter (Q3) of fiscal 200. Net revenues for Q3 of fiscal 2001 were $143.3 million, an increase of 213% over the $45.8 million reported in the same period of fiscal 2000.

Intel's revenue up for 14th consecutive year

Wed, 1 Jan 2001
Santa Clara, California--Intel Corp. has announced revenue for 2000 of $33.7 billion, up 15% from 1999, resulting in the company's 14th consecutive year of revenue growth. Fourth quarter (Q4) revenue was $8.7 billion, up 6% from Q4 of 1999, and approximately flat with the third quarter of 2000.

Credence lowers revenue expectations, cites weakening demand

Thu, 1 Jan 2001
Fremont, California--Credence Systems Corp., a leading manufacturer of automatic test equipment (ATE) for the worldwide semiconductor industry, announced that based on weakening order activity and customer-requested shipment delays from its existing backlog, particularly with its customers in Asia, the company now expects revenue in the current fiscal quarter ending January 31, 2001 to be at least 40% below the fourth fiscal quarter of 2000.

Lattice reports Q4 revenues

Mon, 1 Jan 2001
Hillsboro, Oregon--Lattice Semiconductor Corp. recently announced financial results for its fourth quarter (Q4) and year ending December 2000. Revenue was a record $567.8 million and earnings before goodwill (EBG) were a record $233.2 million ($2.02 per diluted share), or $141.1 million ($1.25 per diluted share) excluding a one-time gain on foundry investments.

Asyst's Q3'01 sales reach $127.4 million

Mon, 1 Jan 2001
Fremont, California--Asyst Technologies, Inc., the world's largest semiconductor fab automation company, recently reported results for its third quarter (Q3) of Fiscal Year 2001 ended December 31, 2000.

Microsemi reports sales increase of 23% during Q1'01

Mon, 1 Jan 2001
Santa Ana, California--Microsemi Corp. recently announced results for the first quarter (Q1) of fiscal year 2001. For the first quarter ended Dec. 31, 2000, the company's net sales increased 23% to $63 million, compared with pro forma net sales of $51.1 million in the prior year period, which excludes net sales of a business sold in June 2000.

Cabot Microelectronics revenues up 97%

Mon, 1 Jan 2001
Aurora, Illinois--Cabot Microelectronics Corp., a leading supplier of chemical mechanical planarization (CMP) polishing slurries to the semiconductor industry, today reported operating results for its first fiscal quarter ended December 31, 2000. Revenues for the quarter increased 97% to $68.6 million. Net income for the quarter increased 206% over the prior year to $14.4 million, and diluted earnings per share grew to $0.59.

Dialog Semiconductor reports record revenues in 2000

Wed, 2 Feb 2001
February 21, 2001--Dusseldorf, Germany--Dialog Semiconductor Plc., a developer and supplier of mixed signal ASICs to the mobile telecommunications industry, today announced record results for fiscal year 2000 with revenues rising to EURO 214.5 million (US$195 million), an increase of 146% from EURO 87.2 million in the previous fiscal year.

Matsushita cuts back earnings estimate

Thu, 2 Feb 2001
February 22, 2001--Osaka, Japan--Matsushita Electric Industrial Co. Ltd. recently cut its earnings projection in half for the fiscal year that ends March 31, 2001.

Motorola not expecting to achieve first quarter sales, earnings guidance

Fri, 2 Feb 2001
February 23, 2001--Schaumburg, Illinois--Motorola, Inc. today announced that as a result of significant weakness in first quarter order input across its business segments, it does not expect to achieve the first-quarter 2001 sales guidance of $8.8 billion or the earnings guidance of 12 cents per share given on Jan. 11, 2001.

Semtech reports record revenues for fiscal year ended Jan. 28, 2001

Fri, 2 Feb 2001
February 23, 2001--Newbury Park, California--Semtech Corp., a leading supplier of analog and mixed-signal semiconductors, today announced record net sales, gross margin and net income for the fourth quarter and the fiscal year ended Jan. 28, 2001.

TI revises first quarter outlook

Mon, 2 Feb 2001
February 26, 2001--Dallas, Texas--Texas Instruments Inc. reports that revenue for the first quarter of 2001 will be lower than previously expected, due to the economic slowdown that is continuing to constrain demand for technology products.

Elantec Semiconductor lowers expectations for Q2'01

Wed, 2 Feb 2001
February 28, 2001--Milpitas, California--Elantec Semiconductor, Inc. today announced that sales for the second quarter of fiscal 2001 will be below previous expectations as a result of continued economic slowdown and weakening demand, particularly in the PC industry.

Fairchild debuts mini-flat package configuration for optocouplers

Thu, 2 Feb 2001
South Portland, Maine--Fairchild Semiconductor International has introduced a new mini-flat package configuration for optocouplers, according to Steve Sherman, Fairchild's senior vice president for the Optoelectronics Group.

Peregrine introduces second-generation FET QUAD mixer

Thu, 2 Feb 2001
San Diego, California--Peregrine Semiconductor, a supplier of high-performance communications-based ICs, recently introduced PE4122, the first in a family of second-generation FET Quad mixers with integrated RF and LO balun networks.

Vitesse expands optoelectronics device family

Mon, 2 Feb 2001
February 12, 2001--Camarillo, California--Vitesse Semiconductor Corp. today announced the expansion of its optoelectronic product offering with the addition of 10 new products targeted at next-generation OC-48 SONET/SDH DWDM systems up to 3.125 Gb/s, Gigabit Ethernet, and Fibre Channel equipment manufacturers.

Toshiba extends family of RF ICs for Bluetooth-enabled and mobile communications products

Mon, 2 Feb 2001
February 12, 2001--San Jose, California--Toshiba America Electronic Corp. today announced that it has expanded its family of RF IC packages, known as Cell Packs. The new Cell Packs offer designers a quick and easy way to implement a variety of important functions required for Bluetooth-enabled devices and mobile communications products.

Cadence unveils integration ensemble

Mon, 2 Feb 2001
February 26, 2001--San Jose, California--Cadence Design Systems, Inc. today introduced the Cadence Integration Ensemble hierarchical IC implementation tool for designing complex systems-on-chips (SOCs). IE is the next generation of Cadence's synthesis/place-and-route (SP&R) solutions.

Super-small silicon-controlled rectifier developed by Microsemi

Tue, 2 Feb 2001
February 27, 2001--Santa Ana, California--Microsemi Corp. has announced a new silicon-controlled rectifier (SCR) in its patented Powermite 3 surface mount package that is three times smaller than competing products having similar power handling capability.

Tegal, Applied Materials sign patent license deal

Tue, 1 Jan 2001
Petaluma, California--Tegal Corp. announced today that it has granted to Applied Materials Inc. a nonexclusive license to U.S. Patent Nos. 4,464,223 and 4,579,618--covering dual-frequency etch technology--for an undisclosed amount.

AMI acquisition complete, new name unveiled

Tue, 1 Jan 2001
San Diego, California--American Microsystems Inc. (AMI) today announced that Francisco Partners and a Citicorp Venture Capital unit have acquired approximately 80% of the AMI business from Japan Energy Corp. subsidiary GA-TEK, with an enterprise value of more than $525 million. In a related move to reflect its refocused direction, AMI's name has been changed to AMI Semiconductor (AMIS).

Brooks Automation gets 300mm sorter technology order

Fri, 1 Jan 2001
Chelmsford, Massachusetts--Brooks Automation Inc., a provider of tool and automation solutions, has received a multi-million dollar order for its 300mm sorter technology from an unidentified fab located in Dresden, Germany.

Ibis now ISO 9002 certified

Wed, 1 Jan 2001
Danvers, Massachusetts--Ibis Technology Corp. has been certified by Perry Johnson Registrars, Inc., to the ISO 9002 standard for its facility in Danvers, MA. Ibis is the leading manufacturer and supplier of SIMOX-SOI implantation equipment and wafers to semiconductor manufacturers.

ON Semiconductor unveils advanced technology development center

Wed, 1 Jan 2001
Phoenix, Arizona--To accelerate the development of advanced broadband semiconductors critical to high-speed communications, ON Semiconductor today unveiled its advanced technology development center. The addition of the center will enable the company to offer advanced processes that address 10 to 40Gbit applications (OC-192 to OC-768), while minimizing development time and costs.

Lam, Strasbaugh enter CMP intellectual rights agreement

Thu, 1 Jan 2001
Fremont, California--Lam Research Corp. has entered into a $14 million strategic agreement with Strasbaugh, of San Luis Obispo, CA, to purchase a portfolio of chemical mechanical planarization (CMP) intellectual rights. Under the agreement, Lam also receives a minority interest in Strasbaugh and gains a seat on the company's board of directors.

NEC still planning 300mm California fab, opening slated for 2003

Fri, 1 Jan 2001
Sacramento, California--NEC Electronics and its parent, NEC Corp., are moving ahead with plans first announced in June 1998 to invest $1.4 billion to build a 300mm fab adjacent to the existing NEC Electronics plant in Roseville, CA. The new line is now expected to begin operation in 2003, rather than the original target of 2002.

Semico forecast sees industry sales growth decline in 2001, 2002

Mon, 1 Jan 2001
Phoenix, Arizona--Total worldwide semiconductor sales will reach $412 billion by 2005, with bumps along the way, according to Semico Research Corp.'s just-released quarterly industry forecast.

Infineon, 3Com awarded patent

Mon, 1 Jan 2001
Munich, Germany--Infineon Technologies AG, one of the world's leading providers of commmunications ICs and a pioneer in the field of VDSL, today announced that the company, together with 3COM, has been awarded a patent for Ethernet Transport Facility over DSL technology.

Axcelis files patent infringement suit against Applied Materials

Tue, 1 Jan 2001
Beverly, Massachusetts--Axcelis Technologies, Inc., a semiconductor equipment manufacturer, has filed a lawsuit against Applied Materials, Inc. In its suit, Axcelis charges that Applied is using its patented technology unlawfully and asks the court to put a stop to it and to order Applied to pay money damages.

Mitsubishi plans 300mm fab

Wed, 1 Jan 2001
Tokyo, Japan--Mitsubishi Electric's President Ichiro Taniguchi announced yesterday that the company is planning to invest 200 billion yen (US$1.72 billion) to build a 300mm fab, which is expected to become operational in 2003, in Kochi Prefecture on Shikoku Island.

NEC divests semiconductor operations to form new company

Wed, 1 Jan 2001
Tokyo, Japan--NEC Corp. today announced plans to divest its optical semiconductor, microwave silicon, and compound semiconductor operations to a new company it will form in October 2001. The move is aimed at reinforcing NEC's position as a global leader in broadband and mobile networking equipment, while maximizing the overall corporate value of the NEC Group.

Alpha receives GaAs IC order from Siemens

Wed, 1 Jan 2001
Woburn, Massachusetts--Alpha Industries, Inc. has begun shipping volume production of its GaAs ICs to Germany-based Siemens AG for use in its newest dual-band GSM wireless handsets for the European market. Alpha expects full production to begin by June 2001.

Sony set to launch 'Sony Semiconductor Kyushu Corp.'

Thu, 1 Jan 2001
Tokyo, Japan-- In a move to strengthen its overall semiconductor business, Sony Corp. is set to integrate three fabs-- Sony Kokubu, Sony Oita, Sony Nagasaki--in the Kyushu region into a new company, to be launched on April 1, 2001. The Kumato fab, currently under construction, will also be included.

NEC planning output expansion in China

Fri, 1 Jan 2001
Tokyo, Japan--To meet surging demand for semiconductor devices in China, NEC Corp. will invest 35 billion yen (US$300 million) to expand output at its Beijing fab, Shanghai Hua Hong NEC Electronics Co. Ltd., from 20,000 to 30,000 8-in. wafers per month by December.

Intel to acquire Xircom

Mon, 1 Jan 2001
Santa Clara, California--Intel Corp. and Xircom, Inc. today announced that they have entered into a definitive agreement under which Intel, through a wholly owned subsidiary, will acquire Xircom for $25 per share in an all-cash tender offer valued at approximately $748 million. The acquisition complements Intel's existing desktop PC and server-based network access businesses by enabling Intel to provide new products for notebook and mobile computing uses.

GEM Services opens assembly and test facility in China

Thu, 1 Jan 2001
Santa Clara, California--GEM Services, Inc., a multinational semiconductor assembly and test service provider specializing in power semiconductor packages and modules, recently opened an assembly and test facility in China's Shanghai Jiading Industrial Zone and now plans to invest $40 million to equip the facility. The company expects the new 30,000-sq.-ft. building to reach full production capacity of 1.1 billion units per year by the end of 2001.

TranSwitch, Intellectual Capital for Integrated Circuits enter technology agreement

Thu, 1 Jan 2001
Shelton, Connecticut--TranSwitch Corp.,a leading developer and global supplier of innovative high-speed VLSI solutions for communications applications, has entered into a strategic technology partnership and OEM agreement with a fabless semiconductor company called Intellectual Capital for Integrated Circuits (IC4IC).

AMAT warns of revenue woes

Wed, 1 Jan 2001
Santa Clara, California--Applied Materials warned the industry that its earnings for the first quarter, ending January 28, would be lower than previous estimates. During the company's fourth quarter conference call, Applied estimated its earnings, for the first quarter, to be $2.9 to 2.95 billion. The company now expects to be 7 to 10% below that target.

Avant! Corp. delivers inductance analysis solution for SOC designs

Tue, 1 Jan 2001
Fremont, California--Avant! Corp. today unveiled details of its high-capacity, high-throughput inductance analysis solution capable of handling 25 million gate system-on-chip (SOC) designs.

RF Micro Devices' SiGe receiver front-end for PCS CDMA now available

Mon, 1 Jan 2001
Greensboro, North Carolina--RF Micro Devices, Inc. (RFMD), a provider of proprietary radio frequency integrated circuits (RFICs) for wireless communications applications, has announced the availability of the RF2460 LNA/mixer--a complete receiver front-end chip for the PCS CDMA market.

USB 2.0 high-speed bridge chip meets USB-IF compliance testing standards

Mon, 1 Jan 2001
Boise, Idaho--In-System Design Inc. (ISD), a system-on-chip design company specializing in digital bridging solutions, announced today that its Universal Serial Bus (USB) 2.0 high-speed bridge chip, the ISD-300, has successfully met the compliance testing standards set by the USB Implementers Forum (USB-IF) for inclusion in its Integrators List.

Stream Machine announces SM2288 AV codec

Thu, 1 Jan 2001
San Jose, California--Stream Machine recently announced its new SM2288 AV codec, adding audio encoding and decoding and system control to its video codec technology. The new chip will further reduce the cost of video disk recorders and personal video recorders and accelerate the adoption of these products into the mainstream market, according to the company.

Tundra Semiconductor expands DSP interconnect family

Mon, 1 Jan 2001
Ontario, Canada--Tundra Semiconductor Corp., a leader in System Interconnect for the Internet and communications infrastructure market, today announced that the Tsi921 is available to communications infrastructure vendors for prototype testing. The chip was designed to enable communications infrastructure companies to build smaller network components at a lower cost and get them to market more quickly.

IBM awarded most patents in U.S. for 8th consecutive year

Thu, 1 Jan 2001
East Fishkill, New York--For the eighth consecutive year, IBM has been awarded the most U.S. patents--with a record 2,886 issued by the U.S. Patent and Trademark Office in 2000.

Nitronex producing GaN-based HEMTs on 4-in. Si wafers

Fri, 1 Jan 2001
Raleigh, North Carolina--Nitronex Corp., one of the first wireless components suppliers to focus exclusively on GaN, today announced that it is producing the industry's first GaN-based high electron mobility transistors (HEMTs) on low-cost, 4-in. silicon wafers. Until now, industry efforts were limited to 2-in. wafers.

Amkor working on 'green' halide-free IC packages

Thu, 1 Jan 2001
Chandler, Arizona--In response to worldwide environmental concerns, Amkor Technologies is working to complete qualification of halide-free IC packages early this year. The company is replacing minute amounts of halides, commonly used as a fire retardant in IC components, with environmentally safe alternatives such as magnesium oxide.

7.1% growth forecast for Japanese electronics industry in 2001

Tue, 1 Jan 2001
Tokyo, Japan--After a record-breaking year of electronics production in Japan, the Japanese Electronics and Information Technology Industries Association (JEITA) is forecasting stable electronics production growth of 7.1%, or $248 billion, during 2001.

Mitsubishi Electric, Rambus sign SDRAM/DDR SDRAM patent license agreement

Wed, 1 Jan 2001
Mountain View, California--Mitsubishi Electric Corp. has signed a patent license agreement with Rambus Inc. for SDRAM, double data rate (DDR) SDRAM memory, and controllers that directly interface with these types of memory.

Cadence to acquire CadMOS

Thu, 1 Jan 2001
San Jose, California--Cadence Design Systems, Inc., a supplier of electronic design products and services, has signed a definitive agreement to acquire CadMOS Design Technology, Inc., a privately held design tools firm headquartered in San Jose, California.

Conexant takes next step to create three independent companies

Mon, 12 Dec 2001
Dec. 17, 2001 - Newport Beach, CA - Conexant Systems, Inc. a semiconductor system solutions provider for communications applications, has taken the next step in its strategic evolution toward the creation of three independent, publicly traded companies focused on growth opportunities in the mobile communications, broadband access and Internet infrastructure markets.

Infineon, Toshiba to end negotiations on memory chip JV

Tue, 12 Dec 2001
Dec. 18, 2001 - Munich, Germany - Infineon Technologies AG and Toshiba have been unable to reach a mutual agreement in their negotiations on potential cooperation in the memory segment. Following intensive talks, both Infineon and Toshiba agreed that none of the options that were discussed would be feasible strategies for both companies, and the negotiations were brought to an end.

Motorola slices another 9,400 jobs

Wed, 12 Dec 2001
Dec. 19, 2001 - Schaumburg, IL - Motorola Inc. has announced another round of layoffs -- 9,400 jobs, or more than 8% of its work force -- as it heads toward the end of a fourth straight quarter in the red.

SICK Group acquires RVS' Material Handling biz

Wed, 12 Dec 2001
Dec. 18, 2001 -- MINNEAPOLIS, MN & CANTON, MA -- The SICK Group, a privately held sensor technology firm based in Minneapolis, MN, has acquired Canton, MA-based Robotic Vision Systems Inc.'s Material Handling business.

Hynix stocks jump on Micron news

Wed, 12 Dec 2001
Dec. 26, 2001 -- Seoul, Korea -- Hynix Semiconductor Inc. shares jumped today following the memory chipmaker's announcement that it expected to sign an alliance with US rival Micron Technology Inc. next month.

Taiwan chip equipment market expected to shrink

Fri, 12 Dec 2001
Dec. 28, 2001 - Taipei, Taiwan - The Industrial Economics and Knowledge Center (IEK) of the semi-official Industrial Technology Research Institute (ITRI) estimates that Taiwan's market for chipmaking equipment will dive 56% in value to US$4.9 billion in 2001 from last year's US$9 billion.

$2.8M judgment entered against International Rectifier

Fri, 12 Dec 2001
Dec. 28, 2001 - Detroit, MI - A federal district court judgment entered a judgment of $2.86 million against International Rectifier Inc. (IRF) in a civil suit brought against the semiconductor manufacturer by sales firm Multimore Sales Inc., Novi, MI.

On the way up: VC funding increases in 3Q01

Fri, 12 Dec 2001
It's nice to see some encouraging news for a change, especially within the semiconductor investment community. Venture capital funding dollars rose from 2Q01 to 3Q01, according to PricewaterhouseCoopers MoneyTree Survey, conducted in partnership with VentureOne.

inSilicon Corp. to reduce work force

Wed, 12 Dec 2001
Dec. 5, 2001 - San Jose, CA - inSilicon Corp., a provider of communications technology for complex SoC, is set to cut its work force by approximately 20% as part of its ongoing efforts to reduce costs and return to profitability.

Agere to cut work force by 950

Thu, 12 Dec 2001
Dec. 6, 2001 - Allentown, PA - Agere Systems Inc. is set for another round of job cuts, targeting roughly 950 employees, as it continues to battle a sharp downturn in semiconductor demand.

Semi industry encouraged by House passage on TPA bill

Fri, 12 Dec 2001
Dec. 7, 2001 - San Jose, CA - The Semiconductor Industry Association (SIA) commended the House of Representatives on its vote passing H.R. 3005, the Bipartisan Trade Promotion Authority (TPA) Act of 2001.

At AVS/AVEM: Bio-sensors, SAMS, quantum dots and more

Tue, 12 Dec 2001
Of the numerous topics covered in technical sessions at the recent American Vacuum Society (AVS) conference in San Francisco, arguably one of the timeliest was the matter of self-assembled monolayers (SAMs) - already being used for bio/chemical sensors.

Applied Materials to cut 1,700 jobs

Wed, 12 Dec 2001
Dec. 12, 2001 - Santa Clara, CA - Applied Materials Inc. will reduce its global work force by approximately 1,700 positions, or some 10%, in response to the continuing downturn in the semiconductor industry.

Hynix creditors consider capital reduction

Tue, 12 Dec 2001
Dec. 11, 2001 - Seoul, South Korea - Creditors of Hynix Semiconductor are considering a capital reduction for major shareholders, a creditor bank official told Reuters.

LTX elects Roger Blethen chairman of the board

Thu, 12 Dec 2001
Dec. 13, 2001 - Westwood, MA - LTX Corp., a supplier of test equipment, announced that Roger Blethen, president and CEO, has been unanimously elected by the board of directors to the position of chairman of the board.

PSi Technologies signs agreement with Power Integrations

Tue, 12 Dec 2001
Dec.18, 2001 - Manila, Philippines - PSi Technologies Holdings Inc. has signed a supply agreement with Power Integrations Inc., San Jose, CA, designer and maker of high-voltage ICs for AC to DC power conversion.

Sony opens R&D center for chip-mounting technology

Fri, 12 Dec 2001
Dec. 21, 2001 - Tokyo, Japan - Sony Corp. has opened a semiconductor-mounting technology R&D facility within its semiconductor assembly plant in Oita Prefecture.

Fairchild Semiconductor to expand manufacturing, warehousing facilities in China

Tue, 12 Dec 2001
Dec. 4, 2001 - South Portland, ME - Fairchild Semiconductor International has plans to construct a new manufacturing and warehouse facility in China.

Keeping us safe with technology

Wed, 12 Dec 2001
The Silicon Valley Technology and Homeland Security Summit and Expo, a conference to showcase the technologies, products, and companies battling terrorism at home and abroad, will be held in San Jose, CA, on Dec. 13.

Tokyo Seimitsu turns Leepl into subsidiary

Thu, 12 Dec 2001
Dec. 13, 2001 - Tokyo, Japan - Tokyo Seimitsu Co. has turned its affiliate, Leepl Corp., into a subsidiary, raising its stake in the unit from 49% to 67%.

Thailand's big backend houses wait for bottom

Mon, 12 Dec 2001
With no clear sign of recovery, Thailand's assembly and test companies are attempting to navigate through waters infested with deterioration of output, production slowdowns, low utilization rates, cuts in orders, and subsequent cuts in planned capex.

IC B-to-B up to 1.19 for November

Tue, 12 Dec 2001
Showing some small signs of hope for the semiconductor industry, VLSI Research, San Jose, CA, reported that the worldwide IC book-to-bill ratio rose to 1.19 for the month of November. That number is an increase of .17 from October's revised 1.02. The research firm forecasts this figure to drop to 1.01 for the month of December.

Advantest to close two manufacturing units

Fri, 12 Dec 2001
Dec. 28, 2001 - Tokyo, Japan - Major semiconductor testing equipment maker Advantest Corp. is closing down two domestic manufacturing units in January, the Financial Times reported.

Cypress and SiGe Semiconductor to collaborate on SiGe process

Mon, 12 Dec 2001
Dec. 3, 2001 - San Jose, CA - Cypress Semiconductor and SiGe Semiconductor have signed an agreement to collaborate on an advanced Silicon Germanium (SiGe) process.

IBM advances new form of transistor

Thu, 12 Dec 2001
Dec. 6, 2001 - East Fishkill, NY - IBM has unveiled advances in the development of an alternate type of transistor that could lead to performance, function, and power consumption improvements in semiconductors within several years.

Nanometrics appoints Papken Der Torossian to board

Tue, 9 Sep 2001
September 11, 2001 - Milpitas, CA - Nanometrics Inc., a supplier of advanced integrated and stand alone metrology equipment for the semiconductor industry, has appointed Papken Der Torossian to its board of directors.

Asyst Technologies establishes matching gift fund

Tue, 9 Sep 2001
Sept. 25, 2001 - Fremont, CA - Ayst Technologies Inc. a provider of standard mechanical interface (SMIF)-based automation manufacturing systems, today announced the establishment of a matching gift relief program for employees who wish to aid the victims of the September 11, 2001, terrorist attacks on the United States.

QUALCOMM, Mobens sign license agreement

Tue, 9 Sep 2001
Sept. 25, 2001 - San Diego, CA - QUALCOMM Inc. a pioneer of code division multiple access (CDMA) digital wireless technology, and Mobens Co., developer of CDMA test and measurement instruments, today announced that they have entered into a CDMA test equipment license agreement.

Mosaid cuts work force

Thu, 9 Sep 2001
September 13, 2001 - Ottawa, Canada - Mosaid Technologies Inc. said it has cut 44 staff after negotiations for new business broke down and the company was hit by poor market conditions in the semiconductor industry.

Applied Materials donates $250,000 and creates $750,000 matching fund for relief efforts

Thu, 9 Sep 2001
September 13, 2001 - Santa Clara, CA - Applied Materials Inc. said that it plans to donate $250,000 to the ongoing relief efforts following Tuesday's tragic events in the United States, and match company employee donations up to an additional $750,000.

Chip exports likely to fall more than 30%

Mon, 9 Sep 2001
September 17, 2001 - Korea - Korea's semiconductor exports for this year are likely to fall about 31 to 35% from last year to between 17 billion and 18 billion won, the Korea Semiconductor Industry Association said.

Applied Materials cuts 2,000 jobs

Thu, 9 Sep 2001
September 20, 2001 - Santa Clara, CA - Applied Materials will reduce its global work force by approximately 2,000 positions, or approximately 10%, to address the continuing downturn in the semiconductor industry.

Atmel joins industry-academic alliance to create new IC R&D center

Wed, 9 Sep 2001
September 26, 2001 - Heilbronn, Germany - Atmel Corp., together with Multilink Technology Corp. and United Monolithic Semiconductors, has teamed up with the U. of Ulm to create a joint R&D group operated in public-private partnership.

Infineon cuts capex, reduces work force by 5,000 as part of cost reduction plans

Wed, 9 Sep 2001
September 26, 2001 - Munich, Germany - Infineon is implementing its extensive cost reduction program, including capital expenditure reductions of almost Euro 600 million and reducing its work force by 5,000.

Praxair to lay off 900

Fri, 9 Sep 2001
September 28, 2001 - Danbury, CT. - Praxair, Inc. is reducing its global work force by about 900 positions in response to weaker economic conditions and an expected slowdown in the aviation industry.

Microchip Technology announces six new LDOs

Wed, 9 Sep 2001
September 5, 2001 - Chandler, AZ - Microchip Technology Inc. has released six new additions to its low dropout (LDO) regulator family, the TC2014, TC2015, TC2054, TC2055, TC2185, and TC2186.

VIA files lawsuits against Intel

Mon, 9 Sep 2001
September 10, 2001 - Taipei, Taiwan - VIA Technologies Inc, an innovator and developer of core logic chipsets, microprocessors, multimedia and communications chips, has begun filing lawsuits against Intel Corp., Santa Clara, CA, in the US and Taiwan courts for the infringement of VIA patents by Intel processors and chipsets.

Brooks Automation signs multi million dollar agreement with ProMOS

Tue, 9 Sep 2001
September 18, 2001 - Chelmsford, MA - Brooks Automation Inc., a supplier of tool and factory hardware and software automation solutions for the global semiconductor industry, has received a multi million-dollar order from ProMOS Technologies for its SEARAMS product and installation services. ProMOS will deploy SEARAMS in both its 200mm and 300mm factories. Installation services will begin immediately.

RF Micro Devices increases guidance for 2Q01

Mon, 9 Sep 2001
September 10, 2001 - Greensboro, NC - RF Micro Devices Inc., provider of proprietary radio frequency integrated circuits for wireless communications applications, said it expects financial results for its 2Q01 ending September 30, will significantly exceed previously announced forecasts.

STMicroelectronics and Huawei Technologies to develop custom chip

Mon, 9 Sep 2001
September 10, 2001 - Geneva, Switzerland - STMicroelectronics has signed an agreement with Huawei Technologies for the joint development of a silicon chip for subscriber line interface cards in telephone networks.

STARC standardizes 0.1 micron design rules

Mon, 9 Sep 2001
Japan's design consortium STARC has set standard 0.1 micron design rules. It plans to create a cell library using these standards by the end of 2002.

Korea opens first biochip R&D center

Thu, 9 Sep 2001
September 13, 2001 - Korea - Korea will open its first R&D center dedicated to state-of-the-art biochips, Hanyang U. said.

Lawsuit alleges Transmeta IPO wrongdoings

Fri, 11 Nov 2001
Nov. 16, 2001 -- Microprocessor developer Transmeta Corp., Santa Clara, CA, is facing a class-action lawsuit filed on behalf of investors who bought the company's common stock between Nov. 6 and Dec. 6, 2000.

Hynix, Aralion to discuss sale of fabs

Mon, 11 Nov 2001
Nov. 19, 2001 - Korea - Hynix Semiconductor and Aralion, leader of an ASIC consortium, will reportedly sign a non-disclosure agreement (NDA) to discuss the sale of Hynix's chipmaking facilities.

Agilent doubles planned job cuts to 8,000

Mon, 11 Nov 2001
Nov. 19, 2001 - San Francisco, CA - Agilent Technologies has doubled the number of planned job cuts to 8,000 as business for the test and measurement company continues to decline.

NEC to invest 3 billion yen in broadband chip facility

Tue, 11 Nov 2001
Nov. 20, 2001 - Tokyo, Japan - NEC Corp. aims to spend some 3 billion yen to set up a trial production line for advanced semiconductors for use in broadband telecommunications and other equipment, company sources said.

Nova Measuring cuts 10% more from work force

Mon, 11 Nov 2001
Nov. 26, 2001 - Rehovoth, Israel - Nova Measuring Instruments Ltd. is taking further cost-cutting measures, including another 10% work force reduction, additional employee salary reductions of up to 10% and a 15% salary reduction for senior management, and further reduction of outsourcing, travel and communication expenses.

inTEST lowers Q4 earnings expectations

Tue, 12 Dec 2000
Cherry Hill, New Jersey--inTEST Corp., an independent designer, manufacturer, and marketer of interface solutions and temperature management products used by semiconductor manufacturers in conjunction with automatic test equipment in the testing of integrated circuits, today announced that it anticipates lower than expected net revenues and net earnings for its fourth quarter (Q4) ending December 31, 2000.

Electroglas introduces inspection system for gold-bumped wafers

Thu, 12 Dec 2000
Chiba, Japan--The Inspection Products division of Electroglas, Inc., a supplier of process management tools for the semiconductor industry, has introduced a high-speed, automated optical inspection system for the identification and classification of defects on wafers with gold, bumped die contacts.

Microsemi sampling InGaAs/InP photodetectors for fiber optic applications

Thu, 12 Dec 2000
Santa Ana, California--Microsemi Corp. has begun sampling parts from a second family of high-speed gallium arsenide photodetectors for fiber optic applications.

ON Semiconductor announces availability of ultra-low voltage operational amplifiers

Wed, 12 Dec 2000
Phoenix, Arizona--ON Semiconductor, a provider of power management and broadband integrated circuits that enable mobile communication and power the Internet, has announced the availability of ultra-low voltage operational amplifiers (op amps) that can be powered from a single NiCd, NiMH, or alkaline battery cell.

Elantec Semiconductor releases cutting-edge laser driver

Tue, 12 Dec 2000
Milpitas, California--Elantec Semiconductor, Inc. has released its EL6249C, a new cutting-edge laser driver designed to enable higher speed factors in the production of compact disk-read/write (CD-R/W) optical disk drives.

TI rolls out highly integrated delta-sigma ADC

Wed, 12 Dec 2000
Tucson, Arizona--Texas Instruments Inc. today announced a highly integrated delta-sigma analog-to-digital converter (ADC) from the company's Burr-Brown product line, which features 24 bits of no missing code (NMC) performance, operates from 2.7V to 5.25V, and consumes less than 1mW of power.

International SEMATECH demonstrates Dow Corning's low-k technology

Mon, 12 Dec 2000
Midland, Michigan--Dow Corning has announced International SEMATECH's successful integration of its XLK Spin-On Dielectric--a next-generation, low-k film--in a double-level metal copper damascene test structure. Following the evaluation of XLK in one-level copper damascene stacks, this work represents further development of the integration process to fabricate double-level copper damascene 0.25-micron via chain structures, according to Dow Corning.

Simulation tool indicates new transistor may keep Moore's Law in force until 2050

Mon, 12 Dec 2000
West Lafayette, Indiana--Purdue University engineers have developed a new simulation tool, which they say shows that an innovative type of new transistor may keep Moore's Law in force until 2025, or beyond. This is contrary to some industry predictions that Moore's Law will hit a brick wall in about 10 years, and could provide scientists with enough time to develop new technologies to replace ICs made from silicon.

Sequence awarded patent covering technology for analysis of power behavior in SOC ICs

Tue, 12 Dec 2000
Santa Clara, California--Sequence Design, Inc., a specialist in timing and power optimization solutions for system-on-chip (SOC) design, has received U.S. Patent No. 6,151,568 to protect its technology for the analysis and optimization of power behavior in very large SOC integrated circuits (ICs).

Motorola and Aura to develop wireless technology

Thu, 11 Nov 2000
Schaumburg, Illinois--Nov. 16, 2000--Motorola, Inc. and Wilmington, Massachusetts-based Aura Communications, Inc. have agreed to work together to expand the development and use of Aura's short-range wireless communication technology.

SanDisk/Lexar patent disputes settled

Thu, 11 Nov 2000
Fremont, California--Nov. 16, 2000--SanDisk Corp. and Lexar Media, Inc. have reached a settlement agreement concerning patent infringement actions and all other claims and counterclaims currently before the U.S. District Courts of the Northern District of California and the District of Delaware.

Metron completes acquisition of Intec Technology

Mon, 11 Nov 2000
Burlingame, California--Nov. 20, 2000--Metron Technology N.V. has completed the acquisition of privately held Intec Technology Pte. Ltd., a Singapore-based supplier of cleanroom garments used for contamination control in critical environments.

Holiday-season consumers expected to spend $10B on tech gadgets

Tue, 11 Nov 2000
Dallas, Texas--Nov. 21, 2000--A poll conducted in the U.S. for Texas Instruments Inc. (TI) predicts that 40 million people will purchase personal technology items for their loved ones this holiday season.

New technique shows unprecedented accuracy in measuring materials defects

Tue, 11 Nov 2000
Upton, New York--Nov. 21, 2000--Researchers at the U.S. Department of Energy's Brookhaven National Laboratory (BNL) have developed a technique to detect defects in materials with picometer (one trillionth of a meter) accuracy.

Emerging nations propelling worldwide electronics market

Tue, 11 Nov 2000
Scottsdale, Arizona--Emerging nations such as Brazil, China, Israel, Malaysia, Mexico, Philippines, Singapore, Taiwan, Thailand, and Venezuela are playing increasingly greater roles in the growth of both regional and global electronics markets.

TRW and NASA develop highest frequency chips reported

Mon, 11 Nov 2000
Pasadena, California--Indium phosphate (InP) chips developed jointly by TRW Inc. and the U.S. National Aeronautics and Space Administration's (NASA) Jet Propulsion Laboratory (JPL), boasting a frequency of 215 GHz, are believed to be the highest frequency ICs ever reported. The chips were developed to enable increased data rates, while shrinking the size and increasing the overall performance capabilities of next-generation satellite communications and remote sensing payloads.

SEMI posts October book-to-bill ratio of 1.17

Tue, 11 Nov 2000
North American-based manufacturers of semiconductor equipment posted orders of more than $3 billion in October 2000, reports Semiconductor Equipment and Materials International (SEMI), with a book-to-bill ratio of 1.17. Worldwide bookings and shipments in October topped September 2000 figures.

Detecting materials defects with picometer accuracy

Tue, 11 Nov 2000
Upton, New York--Researchers at the U.S. Department of Energy's Brookhaven National Laboratory (BNL) have developed a technique to detect defects in materials with picometer (one trillionth of a meter) accuracy. This is the highest accuracy ever achieved in such measurements, akin to finding a speck of dust in an area as large as the U.S.

'Chip-on-chip' patent granted to IXYS

Wed, 11 Nov 2000
Santa Clara, California--IXYS Corp. has been awarded U.S. Patent No. 6,107,674 for its chip-on-chip technology, which the company says enables a new level of integration for smart power semiconductors.

ASM International to begin volume production of 300mm furnaces

Thu, 11 Nov 2000
Bilthoven, The Netherlands--ASM Europe B.V., a subsidiary of ASM International N.V., has signed a lease contract for an assembly and test facility that will be used to produce 300mm vertical furnaces. When fully operational, the company reports that the new facility is expected to double its capacity.

ChipPAC acquires VIKO Test Labs

Thu, 11 Nov 2000
Santa Clara, California--ChipPAC, Inc. a provider of semiconductor test and packaging services, has acquired VIKO Test Labs, a division of VIKO Technology, Inc.

IBM plans capital investments for Canadian facility

Fri, 12 Dec 2000
Bromont, Canada--IBM is investing approximately CA$150 million (US$97.7 million) in its high-tech assembly plant in Bromont, Canada, to meet growing demand in semiconductor-related products and services.

PRI Automation expands manufacturing capability in Asia

Mon, 12 Dec 2000
Billerica, Massachusetts--PRI Automation, Inc. has signed a strategic alliance agreement with Shinsung Engineering Co. Ltd., a South Korean manufacturer of semiconductor cleanroom equipment and other industrial systems. Under the terms of the deal, Shinsung will assemble PRI's automated storage and retrieval systems for customers in Asia.

Infringement suit filed by KLA-Tencor against ADE Corp.

Tue, 11 Nov 2000
San Jose, California--KLA Tencor Corp. recently filed patent infringement counterclaims against ADE Corp. in U.S. District Court in Delaware. The counterclaims allege that ADE has infringed upon and continues to infringe upon three patents owned by KLA-Tencor.

Applied Materials to establish Taiwan R&D fund

Tue, 11 Nov 2000
Taipei, Taiwan--Applied Materials, Inc. has signed a memorandum of understanding with the Republic of China National Science Council to establish a research and development fund in Taiwan. Based on this agreement, Applied Materials plans to donate a total of US$1 million over the next 5 years to encourage and promote innovative research and semiconductor applications development programs in Taiwan.

Diodes receives ISO-14001 certification

Tue, 11 Nov 2000
Westlake Village, California--Diodes Inc., a manufacturer and supplier of high quality discrete semiconductors, primarily to the communications, computing, electronics and automotive industries, has announced that its Chinese manufacturing facility has been granted ISO-14001 certification.

ASM International and Philips confirm 70-nm technology

Wed, 11 Nov 2000
Bilthoven, The Netherlands--Nov. 1, 2000--ASM International N.V. (ASMI) and Philips N.V. have teamed up to produce what is believed to be the thinnest gate dielectric with commercially acceptable leakage current.

Sumitomo Electric to open fab in Oregon

Fri, 11 Nov 2000
Hillsboro, Oregon--Nov. 3, 2000--Sumitomo Electric Industries, Ltd., of Japan, has announced plans to build its first U.S. fab in Hillsboro, Oregon.

Philips Semiconductors and WIDCOMM form Bluetooth alliance

Mon, 11 Nov 2000
San Diego, California--Nov. 6, 2000--Philips Semiconductors, a division of Royal Philips Electronics, has teamed up with WIDCOMM Inc. to speed the development of its Bluetooth products.

Sales of CMP materials booming

Wed, 11 Nov 2000
Little Falls, New Jersey--Nov. 8, 2000--Sales of materials used by the semiconductor industry for chemical mechanical planarization (CMP), such as slurries and polishing pads, continue to grow at a rapid rate.

Ashland Specialty Chemical Co. expands manufacturing capacity

Thu, 11 Nov 2000
Dublin, Ohio--Nov. 9, 2000--The Electronics Division of Ashland Specialty Chemical Co., a wholly owned division of Ashland, Inc., has completed capacity expansion for photoresist stripper and etch residue remover manufacturing at the company's subsidiary Ashland-ACT Korea Ltd. (AAKL), in Pyongtaek, Korea.

IBM, NTK sign deal to increase ceramic substrate supply

Mon, 11 Nov 2000
East Fishkill, New York--Nov. 13, 2000--A multi-year agreement has been announced between IBM and NTK Technical Ceramics, an Aichi, Japan-based division of NGK Spark Plug Co. Ltd., in which NTK will supply IBM with added capacity for the production of ceramic substrate chip carriers.

IBM to receive technology innovation award

Tue, 11 Nov 2000
Washington, DC--Nov. 14, 2000--IBM Corp. has been selected to receive the U.S. National Medal of Technology--an award that recognizes lasting contributions to America's competitiveness and standard of living--in recognition of the company's leadership in developing and commercializing data storage technologies.

Legerity IC technology combines ADSL with voice

Tue, 11 Nov 2000
Austin, Texas--Nov. 14, 2000--Legerity Inc. recently demonstrated IC technology that simultaneously delivers full-rate asymmetric digital subscriber line (ADSL) and carrier-class voice services.

Intermec and Philips team to develop RFID technology

Tue, 11 Nov 2000
Everett, Washington--Nov. 14, 2000--Intermec Technologies Corp. and Philips Semiconductor have formed a partnership to define, develop, and market radio frequency identification (RFID) ICs for smart labels and tags in the 13.56 MHz, 800/900 MHz, and 2.4 GHz frequency bands.

Micron breaks ground on Singapore testing facility

Wed, 11 Nov 2000
Boise, Idaho--Nov. 15, 2000--The groundbreaking for a new Micron Technology, Inc. assembly and test facility gets underway today in Singapore at the Tampines Industrial Cresent.

Kulicke and Soffa to acquire Probe Technology

Wed, 11 Nov 2000
Willow Grove, Pennsylvania--Nov. 15, 2000--Kulicke and Soffa Industries Inc. (K&S), a supplier of semiconductor assembly equipment and materials, has signed a $65 million definitive agreement to acquire Santa Clara, California-based Probe Technology Corp., a privately held manufacturer of probe cards for the semiconductor industry.

IBM's flip-chip plans for Power4 discussed in Napa

Wed, 11 Nov 2000
Napa, California--Nov. 15, 2000--Paul Totta, an IBM fellow emeritus, treated attendees of the IEEE KGD Packaging and Test Workshop to some insights into IBM's flip-chip history and future plans.

MKS Instruments and ASTeX Announce Merger

Tue, 10 Oct 2000
Andover, Massachusetts--Oct. 3, 2000--MKS Instruments, Inc., a supplier of gas measurement, control, and analysis products used in semiconductor and other advanced thin-film manufacturing processes, has entered into a definitive merger agreement to acquire Applied Science and Technology, Inc. (ASTeX), a Wilmington, Massachusetts-based company that develops and manufactures precision reactive gas solutions.

Fabs Reduce Water Use

Wed, 10 Oct 2000
Austin, Texas--Oct. 4, 2000--Fabs participating in a rinse water optimization program initiated by semiconductor research consortium International SEMATECH in 1997 have reduced their water use by as much as 40%.

Semi Sales Reach 2000 Industry High

Wed, 10 Oct 2000
San Jose, California--Oct. 4, 2000--Worldwide semiconductor sales reached an industry high of $18.19 billion for August 2000, according to a Semiconductor Industry Association (SIA) global sales report released on Oct. 3. This is an increase from the $11.91 billion reached in August 2000, and represents a 52.7% year-over-year growth in chip sales.

Semi Industry on Target for Continued Growth

Fri, 10 Oct 2000
San Jose, California--Oct. 6, 2000--The semiconductor industry is on target to experience a continued healthy growth rate, according to Dataquest Inc., a unit of Gartner Group, Inc., as semiconductor technologies become even more prevalent in next-generation hardware and software platforms.

U.S. Department of Justice Investigates Applied Materials, Inc.

Mon, 10 Oct 2000
Santa Clara, California--Oct. 9, 2000--Applied Materials, Inc., a supplier of products and services to the semiconductor industry, has been notified by the U.S. Department of Justice (DOJ) that it has begun an investigation of the company's licensing of technology.

IBM to build 300mm fab in New York

Thu, 10 Oct 2000
East Fishkill, New York--Oct. 12, 2000--IBM plans to invest $2.5 billion in building a technologically advanced fab in East Fishkill, New York. The company's facility will combine--reportedly, for the first time--copper interconnects, silicon-on-insulator (SOI), and low-k dielectric insulation on 300mm (12-inch) wafers. IBM also expects to be the first chipmaker to mass-produce semiconductors at line widths below 0.10 micron--more than 1,000 times thinner than a human hair.

ATMI Plans Expansion of GaAs Capacity

Wed, 10 Oct 2000
Danbury, Connecticut--Oct. 18, 2000--ATMI, Inc., a provider of specialty materials and related equipment to the worldwide semiconductor industry, is planning to expand its gallium arsenide (GaAs) epi capacity with a new 50,000-square-ft. facility in Phoenix, Arizona.

Analysts Revise 2001 Semiconductor Capital Expenditure Spending Forecast

Thu, 10 Oct 2000
Amsterdam--Oct.19, 2000--Chase Securities analysts are now reporting that capital expenditure on semiconductor equipment will rise at most 10% in 2001, rather than the 25-30% currently forecast for the market.

Hyundai amends complaint against Rambus

Fri, 10 Oct 2000
San Jose, California--Oct. 20, 2000--An amended complaint recently filed by Hyundai Electronics Industries Co., Ltd. and Hyundai Electronics America in their pending action against Rambus Inc. alleges that Rambus engaged in anticompetitive, exclusionary, and unfair conduct by manipulating the standards-setting process of JEDEC.

Fab utilization dips slightly as IC sales soar

Mon, 10 Oct 2000
San Jose, California--Oct. 23, 2000--Worldwide front-end capacity utilization was 97.1% for September, down 0.5% from August's revised figure of 97.6%, according to the latest Industry Pulse Pro Report from VLSI Research.

UMC Goes Live with eService Solution

Mon, 10 Oct 2000
Hsinchu, Taiwan--Oct. 23, 2000--UMC, a semiconductor foundry service provider, has announced the availability of 'My UMC' for Web-based supply chain management services.

Semi Equipment Industry Posts $2.8B September Orders

Tue, 10 Oct 2000
San Jose, California--Oct. 24, 2000--North American-based manufacturers of semiconductor equipment posted orders of $2.8 billion in September 2000, reports Semiconductor Equipment and Materials International (SEMI), with a book-to-bill ratio of 1.16--indicating an expanding market.

Micronas Acquires Infineon's Electronics Operations

Wed, 10 Oct 2000
Zurich, Switzerland--Oct. 25, 2000--Micronas Semiconductor Holding AG recently acquired Germany-based Infineon Technologies' consumer electronics integrated circuits (ICs) operations. The deal, reportedly worth EUR 250 million, includes development and sales activities and 130 former Infineon employees, but does not include manufacturing facilities.

TelesciCOM Selects IBM to Manufacture RF Chips

Wed, 10 Oct 2000
Tel Aviv, Israel--Oct. 25, 2000--Israel-based TelesciCOM Ltd. has selected IBM's advanced silicon germanium (SiGe) process technology for its upcoming radio frequency (RF) chip.

ASML Acquires SVG in $1.6 Billion Deal

Mon, 10 Oct 2000
Veldhoven, The Netherlands--Oct. 2, 2000--ASM Lithography Holding N.V. (ASML) and Silicon Valley Group (SVG) have signed a merger agreement that creates the world's largest provider of photolithography equipment to the semiconductor industry.

Intel to buy Rockwell fab, will invest $1.5B in Colorado site

Thu, 2 Feb 2000
In its second announcement of a multi-million dollar fab investment in two weeks, Intel said it plans to purchase and completely renovate a Rockwell International facility for $1.5 billion.

SIA says chip sales hit $14.7B in December

Fri, 2 Feb 2000
Worldwide sales of semiconductors reached a new record in December, climbing to $14.7 billion in the month, according to a new global sales report from the Semiconductor Industry Association.

Cypress sells NVE stake

Thu, 9 Sep 2003
September 9, 2003 - Sypress Semiconductor, San Jose, CA, yas sold a portion of its stake in NVE Corp., a developer of "spintronics" memory IC technology.

Soundview continues V-chip battles

Thu, 9 Sep 2003
September 9, 2003 - Soundview Technologies, a unit of the Acacia Technologies Group, Newport Beach, CA, plans to appeal recent rulings relating to its "V-chip" technology used to screen television programming.

Tegal shareholders approve financing

Thu, 9 Sep 2003
September 9, 2003 - Stockholders in Tegal Corp., Petaluma, CA, approved several measures at their recent meeting, including the final step of a financing plan of more than $7 million in gross proceeds.

AmberWave names chief

Thu, 9 Sep 2003
September 9, 2003 - AmberWave Systems, Salem, NH, has appointed Richard Faubert as president and CEO.

Dow Corning forms compound semi biz

Fri, 9 Sep 2003
September 11, 2003 - Dow Corning, Midland, MI, has formed a new business to gather together its thin film technologies and target the wideband gap semiconductor industry.

Siemens expands microbeam business to Taiwan

Tue, 9 Sep 2003
September 11, 2003 - Siemens Dematic hopes to strengthen its business for microbeam lasers, used to create tiny drillings for bonding circuit path levels, with a new sales office in Taiwan.

Shin-Etsu adds capacity

Tue, 9 Sep 2003
September 15, 2003 - Shin-Etsu Chemical plans to invest $830 million in new facilities by the end of this year, and double the output of 300mm wafers in Japan to 200,000 wafers/year, according to local reports.

Fujitsu completes China plant

Tue, 9 Sep 2003
September 15, 2003 - Fujitsu has completed its IC packaging and testing plant in Nantong, in the eastern Chinese province of Jiangsu.

Matsushita to expand in Singapore

Tue, 9 Sep 2003
September 15, 2003 - Matsushita says it will invest over $85 million in its operations in Singapore, part of which will go towards the island republic's first facility for manufacturing CCD image sensors.

UMC ups 300mm investment

Mon, 9 Sep 2003
September 19, 2003 - UMC's Japanese subsidiary has invested $45 million to expand manufacturing capabilities at UMCi, the company's 300mm affiliate in Singapore.

TI waves flag for RFID

Mon, 9 Sep 2003
September 16, 2003 - Texas Instruments' RFID systems division says it is developing UHF RFID tags for use in supply chain and logistics applications.

DongbuAnam boosts capacity

Mon, 9 Sep 2003
September 16, 2003 - South Korean chip foundry Dongbu Anam Semiconductor has increased production capacity by 50% at its Sangwoo facility in North Chungcheong province.

Sinomos ships equipment to China

Mon, 9 Sep 2003
September 16, 2003 - China's Sinomos Semiconductor Ningbo Inc. is moving equipment into its facilities in the southern Yangtze delta region, with plans to expand operations there, according to local reports.

Asyst CFO departs

Mon, 9 Sep 2003
September 17, 2003 - Asyst Technologies, Fremont, CA, is searching for a new CFO after the departure of Geoffrey Ribar to pursue other interests.

Nat'l Semi opens China IC lab

Mon, 9 Sep 2003
September 17, 2003 - National Semiconductor, Santa Clara, CA, and Zhejiang University have jointly opened an IC lab in China.

Therma-Wave picks Korean rep

Mon, 9 Sep 2003
September 18, 2003 - Therma-Wave Inc., Fremont, CA, has named Yun-Jin Kim as president and representative director of its Korean branch.

Intel auctions Puerto Rico plant

Mon, 9 Sep 2003
September 19, 2003 - After trying to sell directly for two year without success, Intel has auctioned off its plant in Puerto Rico for an undisclosed amount.

Agilent inks HK test center deal

Mon, 9 Sep 2003
September 19, 2003 - Agilent Technologies, Palo Alto, CA, plans to establish a probe and test development center in the Hong Kong Science Park at Pak Shek Kok.

Credence names board member

Mon, 9 Sep 2003
September 19, 2003 - Credence Systems Corp., Fremont, CA, has named Rich Beyer as the seventh member of its board of directors.

Original owners buy WWK

Thu, 9 Sep 2003
September 22, 2003 - A group of current management leaders has acquired the assets of Wright Williams & Kelly, a subsidiary of semiconductor engineering services provider CH2M Hill Industrial Design & Construction.

Motorola CEO steps down

Thu, 9 Sep 2003
September 22, 2003 - Motorola chairman and CEO Chris Galvin, the grandson of company founder Paul Galvin, says he will retire as soon as a successor can be found.

Axcelis axes workforce

Thu, 9 Sep 2003
September 23, 2003 - Axcelis Technologies, Beverly, MA, has announced plans to trim roughly 200 positions, or 11% of its workforce.

Brooks elects director

Thu, 9 Sep 2003
September 23, 2003 - Brooks Automation, Chelmsford, MA, has named company president and COO Edward Grady to its board of directors.

Grace Semi ramps up

Thu, 9 Sep 2003
September 24, 2003 - China's Grace Semiconductor has begun production of 4000 8-in. wafers/month at its fab in Shanghai, with plans to ramp up to 10,000 wafers/month by the end of the year.

JEDEC launches China conference

Tue, 9 Sep 2003
August 28, 2003 - Semiconductor standards organization JEDEC will hold a two-day conference in Shanghai in October to discuss topics and technologies relevant to the global semiconductor industry.

Toshiba, ARM partner for SoC

Tue, 9 Sep 2003
September 2, 2003 - Toshiba Corp., Tokyo, Japan, and ARM, Cambridge, UK, have extended a partnership agreement whereby Toshiba will license an ARM core for system-on-chip applications.

AKN snubs Memstech

Tue, 9 Sep 2003
September 2, 2003 - AKN Technology Bhd. has abandoned its proposed acquisition of Memstech Sdn Bhd, in order to avoid a negative rating on its bonds, according to local media.

Malaysia buys chip tech

Thu, 9 Sep 2003
September 9, 2003 - The Malaysian government has purchased ownership rights of a RFID chip technology from Japanese semiconductor developer FEC Inc., for an undisclosed amount.

Ixys acquires Microwave Tech

Thu, 9 Sep 2003
September 9, 2003 - Ixys Corp., Santa Clara, CA, has acquired Microwave Technology, a Fremont, CA, manufacturer of gallium arsenide devices, in an all-stock deal.

Renesas, chip firms in plant talks

Thu, 9 Sep 2003
September 9, 2003 - Renesas Technology Corp., the chipmaking JV between Hitachi Ltd. and Mitsubishi Electric Corp., is in talks with Japanese chipmakers to invest $1.7 billion in a new 300mm factory.

TSMC buys gear from ASML, TEL

Thu, 9 Sep 2003
September 9, 2003 - A report filed with the Taiwan stock exchange indicates TSMC purchased more than $100 million in chipmaking equipment systems from ASML Hong Kong and Tokyo Electron Ltd. between June and September.

Cadence, CoWare ink pact

Thu, 9 Sep 2003
September 9, 2003 - Cadence Design Systems and CoWare Inc., both of San Jose, CA, have agreed to jointly develop and market system-on-chip efforts based on the SystemC standard of system-to-silicon-design.

Oki to take quake-related charge

Mon, 8 Aug 2003
August 14, 2003 - Oki Electric Industry Co. says it will report a $25 million charge related to damage caused by recent earthquakes in northern Japan. The quakes on July 26 forced the company to temporarily suspend operations at its Miyagi Oki 200mm fab.

Intel to invest in Malaysia

Mon, 8 Aug 2003
August 14, 2003 - Intel plans to invest approximately $80 million in a new R&D facility in Malaysia, adding to existing manufacturing facilities in Penang, according to a Reuters report.

ASAT opens China facility

Mon, 8 Aug 2003
August 18, 2003 - Semiconductor assembly and test services provider ASAT Holdings has officially opened a new 225,000-square-foot facility in Dongguan, China, 65 miles north of Hong Kong.

Cygnal signs Japanese distributors

Fri, 8 Aug 2003
August 19, 2003 - Cygnal Integrated Products, Austin, TX, has signed three distributors for its mixed-signal microcontrollers in Japan.

Silicon Image names CTO

Mon, 8 Aug 2003
August 20, 2003 - Silicon Image, Sunnyvale, CA, a developer of high-bandwidth semiconductors and systems, has appointed Duane Northcutt as its new CTO.

Agilent names semi products exec

Tue, 8 Aug 2003
August 25, 2003 - Agilent Technologies, Palo Alto, CA, has named Young K. Sohn as senior VP and GM of its semiconductor products group.

Unaxis consolidates front- and back-end businesses

Thu, 8 Aug 2003
August 27, 2003 - To better cope with the cyclical semiconductor industry and improve its position in the global marketplace, Unaxis Corp., Cham, Switzerland, is planning to merge several of its operations under one organizational roof.

Raytheon, IBM ink chip design deal

Thu, 8 Aug 2003
August 5, 2003 - Raytheon, Lexington, MA, and IBM, Armonk, NY, have announced a deal to design and market systems for the aerospace and defense industries.

Trio joins for 65nm development

Fri, 8 Aug 2003
August 7, 2003 - Chartered Semiconductor, Singapore, IBM, East Fishkill, NY, and Infineon, Munich, Germany, say they're working together to develop an advanced foundry process at 65nm.

UMC buys out Infineon from JV

Mon, 8 Aug 2003
August 9, 2003 - United Microelectronics Corp. (UMC) says it will buy Infineon's 30% stake in their chip manufacturing joint venture for up to $130 million. The deal will raise UMC's stake in the 12-in. fab in Singapore to 80%.

AMD purchases Nat'l Semi unit

Mon, 8 Aug 2003
August 9, 2003 - Advanced Micro Devices (AMD), Sunnyvale, CA, plans to acquire the information appliances unit of National Semiconductor. Terms of the deal, scheduled to be completed in August, were not disclosed.

Trio joins VSI board

Mon, 8 Aug 2003
August 9, 2003 - The VSI Alliance has named three new representatives to its board of directors. William Billowitch of Agere Systems, Peter Hirt of STMicroelectronics, and Andrew Moore of TSMC will join other members from Alcatel, Cadence Design, Infineon, Mentor Graphics, Motorola, Sonics and IBM.

Memec inks distribution pacts

Mon, 8 Aug 2003
August 9, 2003 - Semiconductor distributor The Memec Group, San Diego, CA, has agreed to distribute products from M-Systems, Fremont, CA, in North America. The deal covers M-Systems' DiskOnChip and FFD flash disks. Meanwhile, Memec Design, the group's design and engineering division, has signed a deal to distribute Mentor Graphics' Inventra IP portfolio, which is used in FPGA silicon.

Honeywell protests chemicals deal

Mon, 8 Aug 2003
August 9, 2003 - Honeywell is seeking an injunction to put on hold Air Products' $300 million acquisition of Ashland's chemicals business last month. Honeywell claims the purchase violates a strategic alliance between Air Products and GEM Microelectronic Materials, a JV owned by Honeywell and Mitsubishi Chemical that makes wet process chemicals for the semiconductor industry.

Credence, Reptron call truce

Mon, 8 Aug 2003
August 11, 2003 - Credence Systems Corp., Hillsboro, OR, and Reptron Electronics, Tampa, FL, an electronics manufacturing supply chain services company, have settled a dispute over an alleged breach of contract. As part of the deal, Credence will pay $1.3 million to Reptron, which will supply components for Credence's Quartet and Octet test systems.

Sematech: We'll stay in Texas

Mon, 8 Aug 2003
August 18, 2003 - Sematech directors have officially voted to keep the consortium's headquarters in Austin, TX. The vote to stay in the Lone Star Sate squashes speculation about a potential move to New York.

NARM names new leader

Mon, 8 Aug 2003
August 18, 2003 - The National Association of Relay Manufacturers (NARM) has named former Tyco Electronics business director Jeffrey Boyce as its interim executive director, after the passing of longtime executive director Don Dangott. NARM, an affiliate of the Electronic Components, Assemblies & Materials Association (ECA), hosts the annual International Relay Conference.

Credence opens China test center

Tue, 8 Aug 2003
August 25, 2003 - Credence Systems Corp., Hillsboro, OR, and the Hong Kong Science and Technology Parks Corp. are partnering to establish a probe and test development center.

Vitesse sells optical division

Tue, 8 Aug 2003
August 25, 2003 - Vitesse Semiconductor Corp., San Jose, CA, has agreed to sell its optical systems division to Avanex Corp., Fremont, CA, a developer of photonic processing subsystems, in an all-stock deal worth approximately $5.9 million.

SigmaTel sets IPO

Mon, 8 Aug 2003
August 5, 2003 - SigmaTel, Austin, TX, says it will offer 7.5 million shares at $9 to $11 per share at its initial public offering later this year. In filings with the SEC, the company said it expects the IPO to generate as much as $110 million, compared with previous estimates of $75 million.

GlobiTech secures $7 million in funding

Thu, 8 Aug 2003
August 6, 2003 - GlobiTech, Sherman, TX, has secured $7 million in new equity funding. The funding will be used for working capital to finance growth and increase capacity of the company's epi reactor production, which is targeted at the company's power MOS/discrete customers.

India tech leaders want to shift toward chips

Fri, 8 Aug 2003
August 6, 2003 - India enjoys a healthy mind- and market share for its outsourced services business, but some analysts think the country's IT industry needs a new fix: chip development.

Si-Soft opens R&D center

Mon, 8 Aug 2003
August 9, 2003 - Officials in Hsinchu City, Taiwan, have officially opened a research & development center for Si-Soft, part of a nationwide project aimed at increasing the company's profile in semiconductor production and design.

Chartered taking second look at 90nm demand

Mon, 8 Aug 2003
August 14, 2003 - Chartered Semiconductor, Singapore, says in a new SEC filing that it is reevaluating market demand for 90nm chips, as it considers what to do with its Fab 7 facility scheduled to begin 300mm-wafer production late next year.

WSTS trims chip market growth forecast for 2003

Tue, 6 Jun 2003
June 3, 2003 - The World Semiconductor Trade Statistics (WSTS) organization expects the worldwide semiconductor industry to grow 11.5% to $156.9 billion in 2003, according to Dow Jones. The trade group's projection was lower than its previous forecast, made last October, for 16.6% growth.

SEMATECH to stay in Texas if incentives go through

Wed, 6 Jun 2003
June 3, 2003 - Austin, TX - International SEMATECH, which has been based in Austin, TX, since its inception in 1988, is likely to remain there after state lawmakers approved a new development fund that's expected to provide substantial economic incentives for the semiconductor research consortium, reported Dow Jones.

PDF to acquire IDS Software

Fri, 6 Jun 2003
June 20, 2003 - San Jose, CA - PDF Solutions, a San Jose-based provider of services for improving yield and optimizing IC performance, has agreed to acquire software development company IDS Software Systems in a cash-and-stock deal worth $50.6 million.

Magma snaps up Aplus

Mon, 6 Jun 2003
June 23, 2003 - Cupertino, CA - Magma Design Automation Inc., a provider of electronic design automation software, will acquire Aplus Design Technologies, Inc., Los Angeles, CA. Terms of the stock-based deal were not disclosed.

Study: China tops in US tech suppliers

Mon, 6 Jun 2003
June 23, 2003 - A new study says China has surpassed Mexico and Japan as the largest supplier of high-tech goods to the US, shipping $35 billion worth of technology products, more than a third of China's entire technology exports.

Trio forges Thai chip R&D pact

Mon, 6 Jun 2003
June 30, 2003 - Marubeni Corp., Oki Electric Industry co., and NTT Advanced Technology Corp. have agreed to jointly develop a microchip R&D project funded by the Thai government.

Synopsys acquires InnoLogic Systems

Mon, 6 Jun 2003
June 30, 2003 - Mountain View, CA - In an effort to beef up the verification component of its system-on-chip design offerings, Synopsys has acquired InnoLogic Systems, a San Jose-based provider of memory and equivalence checking technology, for an undisclosed amount.

Air Products to acquire Ashland chemicals business

Mon, 6 Jun 2003
June 30, 2003 - Lehigh Valley, PA - Air Products has agreed to acquire the electronic chemicals business of Ashland Specialty Chemical Co., a division of Ashland Inc., Covington, KY, for $300 million in cash.

China electronics output to exceed Europe's by 2005

Wed, 6 Jun 2003
June 4, 2003 - Beijing, China - Electronics manufacturers, facing continuing pressure to cut costs, will transfer even more of their production to developing countries in coming years, with China the biggest beneficiary, predicts a new study by consultants Booz Allen Hamilton and the International Finance Corp., an arm of the World Bank, and reported in Dow Jones.

TSMC, UMC grew sales in May

Fri, 6 Jun 2003
June 9, 2003 - Strong demand for semiconductors helped boost May sales figures for the world's two leading foundries. Industry watchers, however, continue to question whether the increased demand, which began in February, is a result of customer demand or product launches and inventory replacement.

Lattice to redeem notes

Mon, 6 Jun 2003
June 23, 2003 - Hillsboro, OR - Lattice Semiconductor Corp. has called for redemption of all of its 4-3/4% converticle subordinated notes due 2006, worth approximately $172.3 million. Shareholders may convert their notes into shares of Lattice common stock at a price of $20.72 per share.

UMC takes wraps off new strained silicon process

Mon, 6 Jun 2003
June 12, 2003 - UMC, Taipei, Taiwan, has unveiled new strained silicon technology using wafers built on substrate technology from AmberWave Systems, Salem, NH.

Renesas, Matsushita Electric streamline 90nm

Mon, 6 Jun 2003
June 16, 2003 - Japan's Renesas Technology Corp. and Matsushita Electrical Industrial Co. have developed technology that can cut power consumption of 90nm conductors by more than 90%.

Entegris subsidiary unveils sensing technology

Tue, 6 Jun 2003
June 17, 2003 - Chaska, MN - NT International, a susidiary of materials integrity management company Entegris, has launched a new sensing and control product.

Kinetic takes wraps off vibration system

Thu, 6 Jun 2003
June 19, 2003 - Boston, MA - Kinetic Systems has unveiled a new portable tabletop active vibration control system designed to help isolate high-resolution instruments.

LightPath launches new collimators

Mon, 6 Jun 2003
June 23, 2003 - Orlando, FL - LightPath Technologies has announced a new product line of standard and custom connectorized fiber collimators.

Metrowerks, Motorola join for wireless devices

Tue, 7 Jul 2003
July 1, 2003 - Austin, TX - Motorola says its application microprocessors now support the OpenPDA platform from its subsidiary Metrowerks.

TI to build 300mm fab in Texas

Tue, 7 Jul 2003
July 1, 2003 - Dallas, TX - Texas Instruments has confirmed reports that it will build a $3 billion fab in Richardson, Texas, just outside of Dallas.

STATS to open facility in China

Thu, 7 Jul 2003
July 3, 2003 - ST Assembly Test Services Ltd. (STATS), Singapore, an independent semiconductor test and advanced packaging service provider, has announced plans to open a manufacturing facility in Shanghai's Zhangjiang Park.

Tower names customer service veep

Thu, 7 Jul 2003
July 3, 2003 - Migdal Haemek, Israel - Tower Semiconductor Ltd. has appointed Rafi Nave as its new VP of customer services. Nave was previously VP of R&D for NDS Group.

Lattice president resigns

Mon, 10 Oct 2003
October 17, 2003 - Lattice Semiconductor Corp. president Steven Laub has resigned citing personal reasons. He will be replaced by CFO Stephen Skaggs.

Microsemi to consolidate plant

Fri, 10 Oct 2003
October 21, 2003 - Microsemi Corp., Irvine, CA, plans to consolidate its facility in Santa Ana, CA, which employs 380 workers.

Praxair expands for 300mm

Fri, 10 Oct 2003
October 21, 2003 - Praxair Inc., Danbury, CT, has completed a $19 million upgrade of its manufacturing and support infrastructure to meet customer demand for 300mm deposition materials.

PEER to adopt SEMI 300mm tests

Fri, 10 Oct 2003
October 22, 2003 - The PEER Group, Kitchener, Ontario, Canada, plans to add International Sematech's 300mm equipment integration and automation conformance tests into its automation compliance methodology.

Hitachi shuffling chip business

Fri, 10 Oct 2003
October 23, 2003 - Hitachi Ltd. plans to reorganize two of its chip equipment and inspection subsidiaries, according to the local reports.

UMC: We're ready to build

Fri, 10 Oct 2003
October 23, 2003 - UMC plans to build new chip plants, particularly for 300mm, ahead of an anticipated pickup in demand.

Exclusive Feature: DEPOSITION

Using variance analysis to set up a BBr3
pre-deposition process

Thu, 10 Oct 2003
By Hamidreza Simchi, Semiconductor Component Industry, Tehran, Iran

The diffusion process has generally been explained using Fick's law without considering the effect of process gases. The amounts of pre-deposition gases, however, are critical with respect to uniformity and repeatability. Using experimental data and SPSS software, it is shown that sheet resistance depends on FN2, FO2, and FBBr3 for a BBr3 deposition process.

SAES, Aeronex settle litigation

Thu, 10 Oct 2003
September 24, 2003 - Aeronex Inc.. San Diego, CA, and Italy's SAES Getters have ended their patent litigation concerning ammonia and hydride purifiers.

TSMC: Watch China grow

Thu, 10 Oct 2003
September 24, 2003 - China's importance in the semiconductor industry will eclipse that of South Korea and Taiwan, who have dominated in the last decade, according to TSMC Chairman Morris Chang.

Tessera, Sanyo ink licensing deal

Thu, 10 Oct 2003
September 24, 2003 - Tessera Inc., San Jose, CA, and Japan's Sanyo Electric Co. Ltd. have signed a licensing agreement to use Tessera's packaging technology for Sanyo's consumer electronics products.

Bookham acquires pair

Thu, 10 Oct 2003
September 25, 2003 - Bookham Technology, Oxfordshire, UK, has agreed to acquire a pair of companies in all-stock transactions.

Varian, Unaxis settle patent dispute

Thu, 10 Oct 2003
September 25, 2005 - Varian Inc. has settled a patent infringment suit concerning leak detection technologies brought against it by Unaxis Balzers Aktiengesellschaft.

NEC to cut manager bonuses by 40% in FY02

Mon, 2 Feb 2002
Tokyo, Japan - NEC Corp. will cut bonuses of 12,000 managers by 40% in FY02, as it is likely to post a group operating loss of 57 billion yen in the current term through March due to poor semiconductor and communications business, company sources said.

SIA identifies key trade priorities

Wed, 2 Feb 2002
San Jose, CA - Semiconductor Industry Association (SIA) President George Scalise has been asked to testify before the Senate Finance Committee to discuss the importance of the new round of World Trade Organization (WTO) talks to America's semiconductor industry.

J.P. Morgan Partners adds nanotech exec.

Thu, 2 Feb 2002
Feb. 7, 2002 - New York, NY - Alan Marty has joined JPMorgan Partners (JPMP), the private equity arm of J. P. Morgan Chase & Co., as an executive-in-residence to drive the expansion of the firm's investment in the nanotechnology arena.

Taiwan's "Silicon Valley" posts first fall in revenues in 2001

Fri, 2 Feb 2002
Feb. 8, 2002 - Hsinchu, Taiwan - Total revenues from hi-tech companies at Taiwan's Hsinchu Science-based Industrial Park posted the first ever annual decline in 2001, park administration said.

Hynix/Micron deal delayed by $2B price dispute

Mon, 1 Jan 2002
Seoul, Korea - Hynix Semiconductor Inc. wants nearly $2 billion more for its core assets than Micron Technology Inc. is offering.

FEI founder, CFO to resign

Tue, 1 Jan 2002
Hillsboro, OR - FEI Co. founder, Dr. Lynwood Swanson, has retired as chairman of the company and John Hodgson, the company's CFO, is also leaving.

Report: LSI to cut Japan production

Tue, 1 Jan 2002
Jan. 29, 2002 - Tokyo, Japan - Calfornia-based LSI Logic Corp. announced plans to cut production in Japan, in line with its major restructuring push in the US, company sources said.

Intel appoints Fellow

Thu, 1 Jan 2002
Jan. 31, 2002 - Santa Clara, CA - Intel Corp. has appointed Richard Grove to the company's highest technical position, Intel Fellow.

Vitesse expands distribution channels in Asia-Pacific

Wed, 2 Feb 2002
Feb. 6, 2002 - Camarillo, CA - Vitesse Semiconductor Corp. has added Memec Japan K.K., part of Memec Components Group, as the newest member of its international distribution team.

ST to leave PC graphics market

Fri, 2 Feb 2002
Feb. 8, 2002 - Geneva, Switzerland - STMicroelectronics said that it is withdrawing from the PC graphics accelerator IC market and is seeking a buyer for the related assets and activities of its PC graphics business, which accounted for approximately $15 million of ST's $6.36 billion revenues in 2001.

PTSC to acquire Aspect SemiQuip International

Wed, 2 Feb 2002
Feb. 13, 2002 - San Diego, CA - Patriot Scientific Corp. (PTSC) has signed a letter of intent to acquire Aspect SemiQuip International (ASI), a privately held manufacturer of capital equipment used in the production of semiconductor chips.

Alcatel, ST sign agreement to develop GSM/GPRS chipsets

Thu, 2 Feb 2002
Feb. 14, 2002 - Gevena, Switzerland - STMicroelectronics and Alcatel have signed a new cooperation agreement for the development of future GSM/GPRS chipsets for mobile phones and other wireless connectivity applications.

SpeedFam-IPEC terminates proposed sale/leaseback of HQ

Wed, 2 Feb 2002
Feb. 20, 2002 - Chandler, AZ - SpeedFam-IPEC Inc., a global supplier of CMP systems, has terminated discussions related to the proposed sale/leaseback of its corporate headquarters.

Intel names CIOs

Thu, 2 Feb 2002
Feb. 21, 2002 - Santa Clara, CA - Intel Corp. has named Douglas Busch and Sandra Morris each as chief information officers, making them the first CIOs in the company's history.

Cirrus Logic, UMC form foundry relationship

Mon, 2 Feb 2002
Feb. 4, 2002 - Hsinchu, Taiwan, & Austin, TX - Cirrus Logic Inc. and UMC have signed a multi-year manufacturing agreement that establishes the foundry as a volume supplier for Cirrus' advanced chip solutions.

ISSI acquires R&D company

Wed, 2 Feb 2002
Feb. 13, 2002 - Santa Clara, CA - Integrated Silicon Solution Inc. (ISSI) has acquired Purple Ray Inc., a privately held R&D company developing network search engines and content addressable memory ICs.

Philips, ST to develop MHP technology

Tue, 2 Feb 2002
Feb. 26, 2002 - Eindhoven, Netherlands, and Geneva, Switzerland - Philips, an provider of Multimedia Home Platform (MHP) software solutions, and STMicroelectronics have signed an agreement to develop solutions for applying MHP technology in set-top boxes and digital television sets.

LSI Logic joins HyperTransport Technology Consortium

Tue, 1 Jan 2002
Jan 15, 2002 - Milpitas, CA - LSI Logic Corp. has joined the HyperTransport Technology Consortium. By incorporating HyperTransport technology into its product plans, LSI Logic is demonstrating its commitment to this free and open industry standard aimed at removing system design bottlenecks and dramatically increasing the performance of future equipment designs.

Philips Semi joins Flarion's flash-OFDM alliance

Tue, 1 Jan 2002
Jan. 15, 2002 - San Jose, CA - Philips Semiconductors, a division of Royal Philips Electronics, has joined together with wireless infrastructure companies to support Flarion Technologies' flash-OFDM alliance program.

Silterra creates Asia business team

Wed, 1 Jan 2002
Jan. 23, 2002 - Kulim, Malaysia - Silterra Malaysia Sdn. Bhd. has appointed Pankaj Gadani to head its new Asia business team.

Vishay acquires Sensortronics' businesses

Thu, 1 Jan 2002
Jan. 31, 2002 - Malvern, PA - Vishay Intertechnology Inc. has acquired the transducer and strain gage businesses of Sensortronics Inc., a manufacturer of load cells and torque transducers, with manufacturing facilities in Covina, CA, Costa Rica, and India.

Uniroyal Technology to cut positions, freeze salaries

Mon, 1 Jan 2002
Jan. 7, 2002 - Sarasota, FL - Uniroyal Technology Corp. is set to consolidate its business to further its goal of transitioning to a company focused on optoelectronics and electronic devices.

Fujitsu to cut Japanese workers' hours

Thu, 1 Jan 2002
Jan. 10, 2002 - Tokyo, Japan - Fujitsu Ltd. plans to cut its workweek by 33% for about 5,000 employees at its semiconductor plants in Japan to save money, a company spokeswoman said.

Amkor to buy Citizen's assembly biz

Thu, 1 Jan 2002
Jan. 24, 2002 - Chandler, AZ - Amkor Technology Inc. has signed a definitive agreement to acquire the semiconductor assembly business of Citizen Watch Co., Ltd.

China semi market expects growth

Tue, 1 Jan 2002
The Chinese semiconductor market is forecasted to grow rapidly, at an annual expansion rate of 15% during the next 10 years as investments in the sector reach $26 billion by 2010, according to the Ministry of Commerce, Industry, and Energy.

TriQuint Semiconductor introduces fiber optic modulator driver

Tue, 1 Jan 2002
Jan 15, 2002 - Hillsboro, OR - TriQuint Semiconductor Inc. has introduced the TGA4802 modulator driver amplifier for high-speed optical networking applications.

Delft Institute to research RF silicon

Fri, 1 Jan 2002
Jan. 4, 2002 - Delft, Netherlands - The Delft Institute of Microelectronics and Submicron technology (DIMES) was chosen by Philips to carry out a major research program in high-frequency silicon technology for communications and connectivity.

MoSys, Mentor Graphics to deliver BIST for 1T-SRAM memories

Mon, 1 Jan 2002
Jan. 14, 2002 - Sunnyvale, CA - MoSys Inc., a provider of high-density SoC embedded memory solutions, and Mentor Graphics are collaborating to qualify and deliver memory built-in self-test (BIST) solutions optimized for the MoSys 1T-SRAM family of high-density embedded memories to reduce test cost.

TRW, CSIRO work toward GaAs, InP

Wed, 1 Jan 2002
TRW Inc., Redondo Beach, CA, and Australia's Commonwealth Scientific and Industrial Research Organization have formed a strategic alliance to develop high-performance gallium arsenide and indium phosphide components for radio astronomy, advanced millimeter-wave sensors, and telecommunications systems.

Worldwide chip sales up in November

Wed, 1 Jan 2002
Semiconductor sales worlwide rose to $10.6 billion in November, an increase of 1.6% month-over-month from the $10.44 billion posted in October.

Hynix raises memory chip prices

Thu, 1 Jan 2002
Jan. 3, 2002 - Seoul, Korea - Hynix Semiconductor Inc. has raised prices for its long-term customers for the third time in a month.

Motorola to cut 700 to 800 jobs in Hong Kong

Mon, 1 Jan 2002
Jan. 7, 2002 - Hong Kong - Motorola Inc. said it will cut 700 to 800 jobs at its Hong Kong semiconductor test and assembly facility and shift production to its plants in Kuala Lumpur and Tianjin.

STATS appoints president & CEO

Mon, 1 Jan 2002
Jan. 7, 2002 - Singapore & Milpitas, CA - ST Assembly Test Services Ltd. has appointed Harry Davoody as its president and CEO, effective Jan. 8. He will also be appointed as a director to STATS' board of directors.

Matsushita to restructure operations

Fri, 1 Jan 2002
Jan. 11, 2002 - Tokyo, Japan - Matsushita Electric Industrial Co. is restructuring its operations to avoid overlap in research and speed up product development.

Hynix lenders rule out write-off in Micron talks

Wed, 1 Jan 2002
Jan. 16, 2002 - Seoul, Korea - Creditors of Korea's Hynix Semiconductor Inc. said they were ruling out a major debt write-off in merger talks with Micron Technology Inc.

LSI Logic to cut 1,400 from work force

Wed, 1 Jan 2002
Jan. 16, 2002 - Milpitas, CA - LSI Logic Corp. is cutting 20% of its work force and is divesting two businesses in an effort to return to profitability in the second half of the year.

Mitsubishi Electric to cut 2,000 jobs by end of March

Wed, 1 Jan 2002
Jan. 16, 2002 - Tokyo, Japan - Mitsubishi Electric Corp. will eliminate 2,000 jobs at domestic factories by the end of March due to weak demand for semiconductor products, a spokesman said.

Hynix, Micron to meet this week

Mon, 1 Jan 2002
Seoul, Korea - Officials of Hynix Semiconductor Inc. will resume talks with Micron Technology Inc. concerning the possibility of an alliance between the two chipmakers, the Korean Yonhap News Agency said.

Furukawa to enter chip equipment biz

Wed, 1 Jan 2002
Jan. 23, 2002 - Tokyo, Japan - Furukawa Co. is set to launch a chipmaking equipment business, aiming for sales of one billion yen in the initial year.

Hynix to sell Hyundai Syscomm to 3R

Fri, 1 Jan 2002
Jan. 25, 2002 - Seoul, Korea - Hynix Semiconductor Inc. said that it has concluded negotiations to sell its CDMA equipment production subsidiary, Hyundai Syscomm Inc., to 3R Inc., a Korean company that specializes in digital imaging equipment.

RF Micro begins production in second GaAs HBT fab

Thu, 1 Jan 2002
Jan. 3, 2002 - Greensboro, NC - RF Micro Devices, a provider of radio frequency integrated circuits (RFICs) for wireless communications applications, has begun production in its second gallium arsenide heterojunction bipolar transistor (GaAs HBT) fab at the company's headquarters.

Karl Wang joins UMC as VP of design technology

Mon, 1 Jan 2002
Jan. 7 2002 - Hsinchu, Taiwan - Karl Wang has joined UMC Corp. as VP of design technology.

Mitsubishi Electric, Toshiba ally for 3G phones

Wed, 3 Mar 2002
March 13, 2002 - Tokyo, Japan - Mitsubishi Electric Corp. and Toshiba Corp. have reached an agreement to collaborate in the development of 3G mobile phones.

Reality check made at semiconductor venture capital fair

Wed, 3 Mar 2002
Familiar themes - real technology, real products, and real revenue - were echoed as often as possible by numerous presenters at the Semiconductor Venture Fair, held recently in San Francisco, CA. If there are any entrepreneurs in Silicon Valley who don't yet have a clue as to what is expected of them, Dado Banatao, managing partner at Tallwood Venture Capital, put everyone on notice that investing is a business and should be run as such.

Hynix creditors mull Micron's new offer

Wed, 3 Mar 2002
March 27, 2002 - Seoul, Korea - Hynix Semiconductor Inc. creditors have reviewed a new takeover offer by Micron Technology Inc., as the authorities insisted a deal was close.

Intersil buy of Elantec wins US approva

Thu, 3 Mar 2002
March 28, 2002 - Intersil Corp., a maker of wireless communication and power management chips, has won antitrust clearance from US regulators to acquire Elantec Semiconductor Inc. for $998 million.

NEC to restructure system chip production

Thu, 4 Apr 2002
April 4, 2002 - Tokyo, Japan - NEC Corp. has reorganized the structure of its system chip business, the core of its semiconductor division, aiming to restore the division to profitability.

Praxair breaks ground for new filling center in Oevel, Belgium

Tue, 4 Apr 2002
April 16, 2002 - Danbury, CT - Praxair Inc.'s subsidiary, Praxair N.V., has broken ground in Oevel, Belgium, for what will be a filling center for the semiconductor industry.

Uniroyal Technology to sell Sterling Semiconductor

Thu, 4 Apr 2002
April 18, 2002 - Sarasota, FL - Uniroyal Technology Corp. has reached an agreement to sell its Sterling Semiconductor Inc. subsidiary to Umicore USA Inc. The sale, contingent upon certain regulatory requirements, is anticipated to be completed in May 2002.

LogicVision signs AMOS Technologies as its major distributor in Israel

Mon, 4 Apr 2002
April 29, 2002 - San Jose, CA - LogicVision Inc., a provider of embedded test IP for ICs and systems, named AMOS Technologies Ltd. as its major distributor for LogicVision products in Israel.

TriQuint to buy Infineon gallium arsenide chip operations

Tue, 4 Apr 2002
April 30, 2002 - Hillsboro, OR, and Munich, Germany - TriQuint Semiconductor Inc. and Infineon Technologies AG will partner and join forces for radio designs for wireless phones and devices. The two companies entered into a partnership to develop and produce highly integrated RF components and modules for customized wireless system solutions.

Chipmakers plan JV

Tue, 3 Mar 2002
March 19, 2002 -Tokyo, Japan - Japanese electronics makers Hitachi and Mitsubishi Electric Corp. plan to bring together a part of their computer chip operations under a single brand to boost profitability.

Axsys, Palomar enter strategic alliance to market automated photonic equipment

Wed, 3 Mar 2002
March 20, 2002 - Rocky Hill, CT, and Vista, CA - Axsys Technologies Inc., a provider of micro-positioning and precision optical systems, and Palomar Technologies Inc., a manufacturer of automated assembly systems for broadband communications, have signed a strategic alliance agreement.

LSI Logic, ACM Research sign JD agreement

Mon, 3 Mar 2002
March 4, 2002 - Milpitas, CA, and Fremont, CA - ACM Research Inc., and LSI Logic Corp. have signed a joint development agreement, calling for LSI Logic to be the first semiconductor designer and manufacturer to incorporate ACM's stress-free polishing tool into its 90nm copper/low-k technology development program.

Walking on a (nano)wire

Thu, 3 Mar 2002
Nanosys Inc. co-founder and professor of chemistry at UC-Berkeley Peidong Yang has published a paper in which he and his graduate students describe a new synthetic method for growing heteronuclear semiconductor nanowires, 20 to 100nm in diameter, made of alternating blocks of both Si and SiGe on a single wire.

Japanese gov't likely to help fund national 0.1-micron fab

Wed, 2 Feb 2002
The Japanese government has essentially decided to invest about $240 million (31.5 billion yen) in a joint national 0.1-micron fab, according to Nikkei Microdevices Online, though the Diet still needs to approve the budgeted amount. Now the hot issue is apparently whether Japan's chipmakers can get it up and running fast enough - say by the second half of this year.

NVIDIA launches internal review

Thu, 2 Feb 2002
Santa Clara, CA - Graphics semiconductor company NVIDIA Corp. is conducting an internal review of the recording of certain reserves and the timing of recording certain expenses relating to the 4Q00 and the first three quarters of FY01 in response to an inquiry by the Securities and Exchange Commission (SEC).

Toshiba, MIPS begin J.D. of RISC processors

Tue, 2 Feb 2002
Feb. 19, 2002 - Tokyo, Japan, and Mountain View, CA - Toshiba Corp. and MIPS Technologies Inc., a provider of processor architectures and cores for embedded applications, have agreed to jointly develop a next generation 64-bit microprocessor based on an enhanced MIPS core.

RF Solutions, Ellipsis to partner

Tue, 2 Feb 2002
Feb. 26, 2002 - Norcross, GA, and Carlsbad, CA - RF Solutions Inc., a supplier of WLAN RF ICs, and Ellipsis Digital Systems Inc., a developer of integrated silicon and software solutions for broadband communications systems, have engaged in a strategic partnership to develop a dual-band (5GHz, 2.4 GHz) multi-protocol wireless LAN chipset for network interface cards, access points and gateways.

Advantest America forms advisory board

Fri, 3 Mar 2002
Advantest America Inc., Santa Clara, CA, a subsidiary of Advantest Corp., has formed the Advantest America Technology Advisory Board, with inaugural members including experts from Carnegie Mellon University, Stanford University and Canada's McGill University, who will advise Advantest America on technological trends of importance to its future development and product plans.

Synopsys, ST form partnership to lower cost of test for SoCs

Wed, 3 Mar 2002
March 6, 2002 - Paris, France - Synopsys Inc. has formed a two-year partnership with STMicroelectronics, Geneva, Switzerland, focused on creating new methodologies and technologies to reduce manufacturing test development cost and effort while simultaneously improving test quality.

Tru-Si, OSE-USA sign JD for thin-wafer development

Wed, 3 Mar 2002
March 6, 2002 - Sunnyvale, CA - Tru-Si Technologies Inc. and OSE-USA have signed a joint development agreement to create strong, ultra-thin microchip die that can be stacked and interconnected with up to four die per package, with very high yields in volume manufacturing.

LSI joins Link Alliance

Thu, 3 Mar 2002
March 7, 2002 - Milpitas, CA - LSI Logic Corp. has joined Eurologic Systems' LINK Alliance Program. LSI will work in collaboration with Eurologic to enable users of storage-critical applications to implement pre-tested, interoperable SCSI and fibre channel host bus adapters (HBAs) with Eurologic's network storage systems across a SAN environment.

ARM, UMC expand foundry program alliance

Tue, 3 Mar 2002
March 12, 2002 - Sunnyvale, CA, and Taipei, Taiwan - UMC has licensed the ARM946E and ARM1022E cores from ARM, a provider of 16/32-bit embedded RISC microprocessor solutions. With this new agreement, UMC, an ARM foundry program partner, offers an expanded portfolio of cores to designers of ARM core-based solutions.

CoorsTek signs LOI for assembly contract

Thu, 3 Mar 2002
March 14, 2002 - Golden, CO - CoorsTek Inc., a designer and manufacturer of critical components and integrated assemblies for the semiconductor capital equipment industry, has signed a letter of intent with InVision Technologies, Newark, CA, a provider of detection and inspection technologies, to oversee the supply chain management of, and provide outsourced manufacturing and assembly services for its CTX explosives detection systems.

Axcelis opens CS and support center in Shanghai

Mon, 3 Mar 2002
March 18, 2002 - Beverly, MA - Axcelis Technologies Inc. has opened a new facility in Shanghai, giving Axcelis' customers direct access to equipment, services, and support in a market that is widely expected to be the second largest for semiconductors by 2010.

Axcelis partners with Fudan U. for semiconductor R&D

Mon, 3 Mar 2002
March 25, 2002 - Beverly, MA - Axcelis Technologies Inc. has formed a cooperative R&D partnership with Fudan U. in Shanghai, China.

Canon to quadruple basic research staff to 1,000 by FY05

Tue, 3 Mar 2002
March 26, 2002 - Tokyo, Japan - Canon Inc. plans to quadruple the number of researchers focusing on basic research to 1,000 by as early as fiscal 2005, the Nihon Keizai Shimbun reported.

IBM, Xilinx sign multimillion-dollar manufacturing deal

Mon, 3 Mar 2002
March 4, 2002 - East Fishkill, NY, and San Jose, CA - IBM and Xilinx have signed a two-year, multimillion-dollar agreement under which IBM will manufacture Xilinx Virtex-II Pro semiconductor products.

AmberWave partners with IQE for 200mm strained silicon epiwafers

Wed, 3 Mar 2002
March 13, 2002 - Salem, NH - AmberWave Systems Corp., a provider of semiconductor IP, has partnered with IQE Silicon Compounds Ltd., a wholly owned subsidiary of IQE plc, an outsource manufacturer of epitaxial wafers and services, for the high-volume production of epiwafers based on AmberWave's proprietary (epsilon)MOS strained silicon technology.

Hitachi halts closure of chip plants amid recovering demand

Mon, 7 Jul 2002
Tokyo, Japan - Recovering semiconductor demand has prompted Hitachi Ltd. to cancel plans to close a chip production line and an assembly and inspection subsidiary.

Nikon Instruments to launch dedicated semiconductor inspection group

Tue, 7 Jul 2002
Melville, NY - Nikon Instruments Inc. has formed the Nikon semiconductor inspection technologies group (Nikon SITECH). The newly formed group is a move by Nikon Instruments to offer more comprehensive service and support to its current and future customer base.

Hynix says it is not in merger or sale talks

Wed, 7 Jul 2002
Seoul, Korea - Hynix Semiconductor Inc. said it was not in sale or merger talks, a day after Micron Technology Inc. said it was open to restarting negotiations with the chipmaker.

Flextronics to cut 1,000 Czech jobs

Thu, 7 Jul 2002
Singapore - Flextronics International, a manufacturer of electronic products, said it would close down its Czech plant and lay off almost 1,000 workers.

Intel to cut jobs while net income falls in line with forecasts

Tue, 7 Jul 2002
Santa Clara, CA - Intel Corp. reported second-quarter earnings in line with its own diminished forecasts, blaming sluggish sales in Europe. The world's biggest chipmaker forecasted third-quarter revenue to be flat to slightly higher than the second quarter.

Xicor and Catalyst Semiconductor announce settlement

Wed, 7 Jul 2002
July 17, 2002 - Milpitas, CA - Xicor Inc. and Catalyst Semiconductor have settled a patent infringement case filed by Xicor against Catalyst on July 16, 2001 in Delaware Federal District Court.

Toshiba chipmaking plants forgo summer holidays

Thu, 7 Jul 2002
Tokyo, Japan - Toshiba Corp. said that its four chipmaking plants will continue to fully operate during the upcoming summer holiday period thanks to an upturn in the market.

Mykrolis to open service center in Pudong, Shanghai

Mon, 7 Jul 2002
Billerica, MA - Mykrolis Corp., a supplier of components and systems, is presently constructing a product service facility to provide customers in the area with turnkey product service and support.

Atmel closes manufacturing facility in Irving, TX

Tue, 7 Jul 2002
San Jose, CA - Atmel Corp. has closed its manufacturing facility in Irving, TX, effective immediately.

FEI purchases new Hillsboro campus

Tue, 7 Jul 2002
Hillsboro, OR - FEI Co. has purchased a new Oregon campus to consolidate its local operations t0 one site and to provide room for expansion as the company grows.

AMD, Infineon, UMC to develop advanced manufacturing platform technologies

Tue, 7 Jul 2002
Hsinchu, Taiwan and Munich, Germany - AMD, Infineon Technologies, and UMC plan to collaborate on the development of common 65/45nm manufacturing platform technologies for the high-volume production of semiconductor logic products on 300mm wafers.

Cabot, Metron modify distribution agreement

Tue, 8 Aug 2002
Aug. 6, 2002 - Aurora, IL - Cabot Microelectronics Corp. and Metron Technology have modified their distribution agreement.

RF Micro Devices officially opens sales and support office in Japan

Tue, 8 Aug 2002
Aug. 6, 2002 - Greensboro, NC - RF Micro Devices Inc. (RFMD), a provider of proprietary RFICs for wireless communications applications, has opened a new sales and customer support office located at the Imperial Tower in Tokyo, Japan.

Flextronics cuts over 500 jobs in Sweden

Thu, 8 Aug 2002
Aug. 8, 2002 - Oak Ridge, TN - Electronics contract manufacturer Flextronics will cut 527 jobs in Sweden from its current staff of almost 9,000, mainly due to weakness in the telecommunications industry, Swedish news reported.

Hynix creditors may seek debt-for-equity swap

Mon, 8 Aug 2002
Aug. 19, 2002 - Seoul, Korea - Creditors of Hynix Semiconductor Inc. may swap more debt into equity as part of their restructuring initiatives.

Hynix creditors may write off more debt

Wed, 8 Aug 2002
Aug. 21, 2002 - Seoul, Korea - Creditors of Hynix Semiconductor Inc. may write off some of their debt exposures as part of a restructuring plan proposed by financial adviser Deutsche Bank AG, according to a Korean finance ministry official.

Motorola sponsors National Fallen Firefighters Foundation

Fri, 8 Aug 2002
Schaumburg, IL - The National Fallen Firefighters Foundation (NFFF) has formed a strategic alliance with Motorola Inc.

Uniroyal files voluntary petitions for reorganization under Chapter 11

Mon, 8 Aug 2002
Aug. 26, 2002 - Sarasota, FL - Uniroyal Technology Corp. and its subsidiaries have filed voluntary petitions for reorganization under Chapter 11 of the US Bankruptcy Code in order to facilitate a restructuring of debt and relieve cash-flow issues.

TriQuint to reduce work force

Wed, 8 Aug 2002
Aug. 28, 2002 - Hillsboro, OR - TriQuint Semiconductor Inc., has reduced 7% of its worldwide work force.

K&S to terminate substrate venture

Wed, 8 Aug 2002
Aug. 28, 2002 - Willow Grove, PA - Kulicke & Soffa Industries Inc. will close its substrate operations in Milpitas, CA, due to the extended downturn in the semiconductor industry.

KEB denies report of possible Hynix sale

Thu, 8 Aug 2002
Aug. 29, 2002 - Seoul, Korea - Hynix Semiconductor Inc.'s lead creditor Korea Exchange Bank (KEB) denied a report that said creditors aim to sell the company before Korea's presidential election in December.

Trikon to cut workforce by 20%

Fri, 8 Aug 2002
Aug. 30, 2002 - Newport, Wales, UK -- Trikon Technologies Inc. has started a payroll reduction program that is projected to reduce its quarterly operating expenses by approximately $4 million in a full year. As part of the program, about 20% of its 400-person work force (80 positions) will be eliminated worldwide.

MoSys completes acquisition of Atmos

Tue, 9 Sep 2002
Sept. 3, 2002 - Sunnyvale, CA - MoSys Inc., a provider of high density SoC embedded memory solutions, has completed its acquisition of ATMOS Corp.

Philips Semiconductors cutting 70 jobs In Albuquerque, NM

Fri, 9 Sep 2002
Sept. 6, 2002 - Albuquerque, NM - Philips Semiconductor has cut 70 jobs at its Albuquerque plant.

Synopsys completes acquisition of inSilicon Corp.

Fri, 9 Sep 2002
Sept. 20, 2002 - Mountain View, CA - Synopsys Inc., a provider of complex IC design, has closed its acquisition of inSilicon Corp.

ANADIGICS to cuts jobs

Tue, 9 Sep 2002
Sept. 24, 2002 - Warren, NJ - ANADIGICS Inc. is set to cut 10% of its 450 employees, but said that it is on track to meet previous 3Q guidance.

Korean regulator wants Hynix sold by the end of 2002

Thu, 9 Sep 2002
Sept. 5, 2002 - Seoul, Korea - Korea's top financial regulator said it wanted a sale of Hynix Semiconductor Inc. completed by the end of this year.

Thai tech firm to hire 3,000 engineers, scientists

Fri, 9 Sep 2002
Sept. 6, 2002 - Thailand - The revival of Submicron Technologies, Thailand's fabrication project, is expected to provide a sharp boost in demand for the high-skilled labor market.

Veeco and Chinese Academy of Sciences open nanotech center in Beijing

Tue, 9 Sep 2002
Sept. 3, 2002 - Woodbury, NY - Veeco Instruments Inc. has established a China Nanotechnology Center facility (CNC) in Beijing, China.

TEL, Ebara, Dainippon Screen found joint venture company

Thu, 9 Sep 2002
Sept. 5, 2002 - Tokyo, Japan - Tokyo Electron Ltd. (TEL), Ebara Corp., and Dainippon Screen Mfg. Co. Ltd. have entered into a memorandum of agreement to found a joint venture company, to develop, manufacture, and market a low energy e-beam direct writing system.

Air Liquide, BOC to combine Japanese ops

Thu, 9 Sep 2002
Sept. 5, 2002 - France and Great Britain - Air Liquide and BOC intend to combine their Japanese industrial and medical gases businesses within Air Liquide Japan (ALJ) and Osaka Sanso Kogyo (OSK), creating a new entity, to be named Japan Air Gases Ltd.

Nanya, Infineon setting up 300mm joint venture

Fri, 9 Sep 2002
Sept. 6, 2002 - Taipei, Taiwan - Nanya Technology Corp. and Infineon are scheduled to jointly set up a new semiconductor company at the end of this month to produce 300mm wafers.

Credence to join China's CASPA organization

Mon, 9 Sep 2002
Sept. 9, 2002 - Fremont, CA - Credence Systems Corp., a provider of solutions from design-to-production test for the worldwide semiconductor industry, will join the Chinese American Semiconductor Professional Association (CASPA) as a corporate sponsor.

ESI forms partnership with OptiViz Technology

Wed, 5 May 2002
May 1, 2002 - Portland, OR - Electro Scientific Industries Inc. (ESI) has developed a new IC package inspection system in a strategic partnership with OptiViz Technology Inc.

PerkinElmer Fluid Sciences opens facilities in Asia Pacific

Tue, 5 May 2002
May 7, 2002 - Singapore - PerkinElmer Fluid Sciences has expanded its operations in the Asia Pacific region and opened PerkinElmer Fluid Sciences, Asia.

UMC and Ricoh broaden manufacturing partnership

Mon, 5 May 2002
May 13, 2002 - Taipei, Taiwan, and Sunnyvale, CA - UMC has developed a specialized ASIC for Ricoh Company Ltd. The IC, built for imaging processing equipment, is based on UMC's 130nm copper/low-k technology with mass production for the chip expected in August.

Nassda, Virage Logic to optimize verification of embedded memory

Tue, 5 May 2002
May 14, 2002 - Santa Clara, CA - Nassda Corp. and Virage Logic Corp. have integrated Nassda's HSIM timing, power, and signal-integrity analysis software into Virage Logic's Embed-It! software, an embedded memory design platform.

STATS' VP resigns

Fri, 5 May 2002
May 17, 2002--Singapore--Chan Kok Yong, executive VP for operations at ST Assembly Test Services Ltd. (STATS), has resigned for personal reasons.

Mentor Graphics to acquire Innoveda

Fri, 5 May 2002
Mentor Graphics Corp., the supplier of electronic hardware and software design solutions, today announced that on May 16, 2002, it received early termination of the waiting period required under the Hart-Scott-Rodino Act in connection with the previously announced proposed acquisition of Innoveda, Inc.

Rosencwaig resigns from Therma-Wave board

Wed, 5 May 2002
Allan Rosencwaig, a co-founder of Therma-Wave Inc., Fremont, CA, has resigned from the company's board of directors.

Kulicke & Soffa names Oscilowski president

Wed, 5 May 2002
Kulicke & Soffa Industries Inc., Willow Grove, PA, has appointed Alexander A. Oscilowski president.

Microchip signs definitive agreement to acquire PowerSmart

Thu, 5 May 2002
May 23, 2002 - Chandler, AZ - Microchip Technology Inc. has signed a definitive agreement to acquire PowerSmart Inc., a privately held fabless semiconductor company.

Bob Schultz to leave Adaptec

Fri, 5 May 2002
May 24, 2002 - Milpitas, CA - Adaptec Inc., a provider of storage access solutions, announced that Robert Schultz Jr., COO, will be leaving the company at the end of June 2002.

ASAT Holdings opens European HQ in Munich

Wed, 5 May 2002
May 29, 2002 - Fremont, CA - ASAT Holdings Ltd. and ASAT Inc., providers of solutions in IC package design, assembly, and test, have opened a European headquarters in Munich, Germany, to provide comprehensive support to new and existing customers in Europe. Christopher Buckley who was recently named VP of European operations, will manage the territory.

Cypress invests in SunPower

Fri, 5 May 2002
May 31, 2002 - San Jose, CA - Cypress Semiconductor Corp. has signed an agreement to invest in SunPower Corp., Athens, OH, a manufacturer of ultra-high-efficiency silicon solar cells.

August to acquire Semiconductor Technologies and Instruments

Fri, 5 May 2002
May 24, 2002 - Minneapolis, MN - August Technology Corp. has entered into a definitive agreement to acquire Semiconductor Technologies and Instruments Inc. (STI), Plano, TX.

Nat Semi and Unisys equip Brazil with new voting machines

Mon, 5 May 2002
May 6, 2002 - Santa Clara, CA - To help ensure fast and error-free ballot counting and election results, National Semiconductor Corp. and Unisys Corp. will provide Brazil with 52,000 state-of-the-art electronic voting machines for Brazil's national elections this fall.

Advantest, Synopsys to develop failure diagnostics solution for SoC devices

Thu, 5 May 2002
May 23, 2002 - Santa Clara, CA - Advantest Corp. plans to develop a fast, accurate failure diagnostics solution for deep-sub-micron, high-speed SoC designs leveraging TetraMAX automatic test pattern generation (ATPG) technology from EDA tool provider Synopsys Inc.

Hynix names new CEO

Fri, 5 May 2002
May 3, 2002 - Seoul, Korea - Hynix Semiconductor Inc. has promoted COO Park Sang-ho to CEO, after CEO Park Chong-sup resigned.

Konarka licenses more polymer-PV IP from DuPont

Wed, 10 Oct 2007
October 31, 2007 - Konarka Technologies Inc. has expanded its existing licensing agreement with DuPont Displays to include and advance technology for polymer-based photovoltaic applications and related technology.

Nokia hands R&D keys to IBM

Tue, 10 Oct 2007
October 1, 2007 - Call it a "R&D lite" strategy. Nokia Siemens Networks has signed a deal giving specific parts of R&D activities for four business lines of its service and applications business unit, including voice/multimedia, mobile Internet, and consumer/business VOIP, to an IBM subsidiary.

Matsushita: Electronics with 45nm chips going on sale in Nov.

Tue, 10 Oct 2007
Matsushita Electric Industrial Co. is again touting its 45nm work, saying that six video recorders are set to hit the market in November incorporating a 45nm version of the company's UniPhier system LSI.

Johns Hopkins tips tiny self-contained microincubator for labs

Thu, 10 Oct 2007
October 4, 2007 - Researchers from Johns Hopkins U. have created a CMOS-based thumb-size microincubator to culture living cells for lab tests, offering a mobile yet still protected and relatively low-cost advancement over traditional biology lab equipment.

NEC tips multicore dynamic control tech

Fri, 10 Oct 2007
October 5, 2007 - NEC says it has developed technology that allocates performance from multicore processors and let embedded devices coordinate via the Internet, saying it will offer more scalability and security for embedded systems.

SEMATECH, UK researchers eye charge-trapping polarons

Tue, 10 Oct 2007
October 15, 2007 - Researchers at SEMATECH and University College London (UCL) say they may have figured out why novel dielectric materials capture electrons and holes, and that the phenomenon which degrades device performance may be more common than thought.

Semitool adds solar customer for Raider tool

Tue, 10 Oct 2007
October 16, 2007 - Semitool Inc. says it has sold an advanced Raider tool for use in porous silicon formation as part of development of high-efficiency, low cost-per-watt solar devices.

GCS, Micromem to develop MRAMs

Tue, 9 Sep 2007
September 18, 2007 - Micromem Technologies Inc. has signed a deal to have pure-play GaAs foundry Global Communication Semiconductors Inc. (GCS) to help make Micromem's first MRAM devices.

Intel shows working 32nm chips at IDF

Tue, 9 Sep 2007
September 18, 2007 - At its annual developer forum, Intel debuted working test chips built with 32nm process technology, saying it will start production at the next node sometime in 2009. In a Tuesday keynote presentation, Paul Otellini noted that the 32nm SRAMs utilize high-k and metal gate technologies, and house more than 1.9 billion transistors.

EGLS outsources prober work to Flextronics

Fri, 9 Sep 2007
September 21, 2007 - Electroglas Inc. has agreed to have Flextronics International Inc. manufacture its full line of probers at a site in Malu, China, in an effort to reduce cost and lead-times for global customers.

Update: Foundry GCS testing Micromem MRAMs, eyeing military apps

Mon, 9 Sep 2007
September 24, 2007 - A week after announcing their partnership, Micromem Technologies Inc. and pure-play GaAs foundry Global Communication Semiconductors Inc. (GCS) say they have started processing MRAM wafers.

Wall Street analyst: Take long view on solar PV

Fri, 9 Sep 2007
The cost to produce electricity with solar photovoltaics technology could reach grid parity with traditional utility electricity generation in five to eight years, after which the industry would take off on its own merits without the need for incentives -- and that's a conservative estimate, according to Deutsche Bank Securities' Stephen O'Rourke, speaking at a recent SEMI-sponsored breakfast panel near Boston.

Korean test firm fends off patent suit

Tue, 9 Sep 2007
September 4, 2007 - Korean specialty memory test handler supplier TechWing Inc. says it has won a civil lawsuit filed by Mirae Corp. regarding patent infringement and compensation for damages.

AMAT, Oerlikon roll out PV manufacturing products

Tue, 9 Sep 2007
September 4, 2007 - With Applied Materials and Oerlikon Solar rolling out new technologies targeting manufacturing of thin-film solar modules, one analyst handicaps the PV manufacturing field, concluding that AMAT has a leg up on the competition.

ChipMOS sues Walton over BGA patents

Wed, 9 Sep 2007
September 5, 2007 - ChipMOS Technologies' Taiwan division has filed suit against domestic firm Walton Advanced Engineering Inc. alleging infringement of ball-grid array package-related patents used in DDR2 SDRAM devices.

ASE, Mitsui collaborating on hybrid packaging

Thu, 9 Sep 2007
September 6, 2007 - Advanced Semiconductor Engineering Inc. and Mitsui High-tec Inc. have signed a multiyear (minimum five years) cross-licensing agreement to design and make hybrid manufacturing technologies (HMT), with each side sharing IP rights and technical expertise.

US feds remove export restrictions on China chip firms

Fri, 10 Oct 2007
October 19, 2007 - Chinese foundries Semiconductor Manufacturing International Corp. (SMIC) and Shanghai Hua Hong NEC Corp. (HHNEC), plus local subsidiaries of two US chip industry firms, have been granted "validated end-user" (VEU) status from the US government, essentially removing licensing requirements to obtain equipment and materials from US suppliers.

Report: Thin-film solar firms need >12% efficiency, or else

Fri, 10 Oct 2007
October 19, 2007 - Thin-film solar cell makers will need to deliver power conversion rates of 12%-13%+ if they want to remain viable, according to a top exec at Japanese solar module maker Kaneka.

Heliovolt closes $101M funding round

Mon, 10 Oct 2007
October 22, 2007 - HelioVolt Corp., a developer of CIGS thin-film solar products, says it has closed a Series B round of funding adding another $24M in investments to a previous $77M in commitments, bringing the entire Series B round to $101M.

Fuji Electric expanding solar module site

Mon, 10 Oct 2007
October 22, 2007 - Fuji Electric Holdings Co. plans add up to six new production lines over the next five years, at a cost of 37 billion yen (US $323.4M), to expand output of solar modules.

Report: Suntech, Sino-American deal highlights cross-strait PV chain

Mon, 10 Oct 2007
October 22, 2007 - A reported deal between mainland Chinese solar module maker Suntech Power Holdings Co. and Taiwan firm Sino-American Silicon Products Inc. exemplifies a model of cooperation between front- and back-end providers in the photovoltaic industry between the two regions, notes a story in the Taiwan Economic News.

Microchip Tech sells idle 200mm fab

Wed, 10 Oct 2007
October 24, 2007 - Microchip Technology Inc. says it has sold its idle Fab 3 facility in Puyallup, WA, for $30M following an unsolicited offer received in September, saying it can increase capacity and sales through "nominal" investments in its other fabs and foundry partners.

Intel, Transmeta bury patent hatchet with $250M license pact

Wed, 10 Oct 2007
October 24, 2007 - Transmeta and Intel have buried the axe in their year-old litigation over patents, with Intel agreeing to license all Transmeta patents and patent applications for $150M and five years of $20M annual payments.

Air Products sells HPPC biz, completes restructuring efforts

Thu, 10 Oct 2007
October 25, 2007 - Weeks after selling its photoresist developer line to Fujifilm, Air Products has shed another part of its business, this time its high-purity process chemicals (HPPC) unit to Houston-based KMG Chemicals.

Rohm & Haas hiking chemical prices

Thu, 10 Oct 2007
October 25, 2007 - Citing unabating high prices for raw materials, Rohm and Haas Co. says it will implement a 5%-15% price increase across most of its chemical products starting Nov. 1.

Skyworks expanding capacity with 150mm upgrade, foundry push

Thu, 10 Oct 2007
October 25, 2007 - In a bid to increase its manufacturing capacity for products used in handsets and analog devices, Skyworks Solutions Inc. says it has started converting its gallium arsenide heterojunction bipolar transistor (HBT) fab in Newbury Park, CA, from 4-in. to 6-in. wafers, and is expanding its work with Taiwan foundry partners.

MEMC inks new $8B solar wafer pact, amends another

Thu, 10 Oct 2007
October 25, 2007 - US-based wafer supplier MEMC Electronic Materials says it has signed a 10-year, $7-$8B deal to supply solar grade silicon wafers to Germany's Conergy, billed as the worlds' largest installer of photovoltaic systems.

Taiwan to revisit China investment rules

Tue, 10 Oct 2007
October 30, 2007 - Following a court decision overturning an indictment of former UMC execs charged with illegal business dealings with Chinese chip company He Jian, the Taiwan government says it will take another look at whether it should further loosen restrictions on local IC makers' investments in the mainland, and even help them develop domestic 450mm capabilities to support the local IC industry.

SST November 2007: Intel's evolution: Strained silicon to high-k and metal gate

Fri, 10 Oct 2007
EXECUTIVE OVERVIEW As we head toward Intel's announced 45nm launch this month, Dick James looks at the changes from the company's 90nm node transistor, through the 65nm node, and take a few guesses about what we might see in the upcoming 45nm part.

SPICE sim startup nabs $7.2M in funds

Wed, 9 Sep 2007
September 12, 2007 - Nascentric Inc., a provider of Fast-SPICE simulation and analysis tools, says it has closed a $7.2 million Series C round of financing, with new investor Intel Capital and existing investors Austin Ventures, Silverton Partners, Needham Capital and EDA veteran Jim Solomon (founder of SDA, which later became Cadence Design Systems).

Aviza: Scotts Valley site sale called off

Sat, 9 Sep 2007
September 14, 2007 - Aviza Technology says the proposed buyer of its Scotts Valley headquarters has terminated the $16 million purchase agreement because a timeframe to get the project approved by the city could not be determined.

Wacker Chemie to supply China PV firm

Mon, 9 Sep 2007
September 17, 2007 - Wacker Chemie AG has signed a deal to extend its polysilicon supplies to Chinese PV product manufacturer Yingli Green Energy Holding Co. Ltd. for a two-year period from 2009-2011.

Unnamed US IDM to help fill Tower's Fab 2

Thu, 9 Sep 2007
September 20, 2007 - Israeli foundry Tower Semiconductor says it has signed a "multimillion-dollar/month" deal with an unidentified first-tier US IDM to manufacture devices using 0.13-micron processes in the foundry's Fab 2 200mm facility, which it is currently upgrading.

Report: Toshiba selling original HQ to fund Sony chip JV

Thu, 9 Sep 2007
September 20, 2007 - Toshiba Corp. is selling its initial headquarters in Tokyo's Ginza district for 161 billion yen (US ~$1.4 billion), in order to support its investment in new chip business with Sony, according to Japanese media reports.

Infineon follows through with Qimonda stake cut

Fri, 9 Sep 2007
September 21, 2007 - Infineon Technologies AG has finalized a proposed reduction in its ownership stake in former memory chipmaking division Qimonda, reducing its stake from about 86% to 78.6% (and maybe down to 77.5% if options are exercised). At a price of $10.92/share, the offering is worth about 194 million euros (US ~$272M).

ASAT China unit nails down $20M in financing

Mon, 9 Sep 2007
September 24, 2007 - Semiconductor packaging/assembly/test services provider ASAT Holdings Ltd. said its Chinese subsidiary ASAT Semiconductor (Dongguan) Ltd. has received a commitment for RMB 150 million (roughly US $20 million) in financing from a Chinese bank.

Cadence expands Berkeley EDA labs

Mon, 9 Sep 2007
September 24, 2007 - Cadence Design Systems Inc. has opened a new facility for its research labs near the U. of California/Berkeley, to host research for next-generation electronic design automation (EDA) challenges.

ASE, NXP finalize China backend JV

Fri, 9 Sep 2007
September 28, 2007 - Advanced Semiconductor Engineering Inc. (ASE) and NXP Semiconductors have completed their assembly/test JV in Suzhou, China, about 10 months after its formation.

Intel tabs Synopsys for EDA tools

Tue, 8 Aug 2007
August 7, 2007 - Synopsys Inc. says that it has been selected by Intel to be the chipmaker's primary EDA supplier, signing a multiyear expanded commercial and technology agreement to collaborate on advanced design flows.

Report: Thin-film PV sales surging past $7B by 2015

Wed, 8 Aug 2007
August 8, 2007 - The global thin-film photovoltaics (PV) market stands at just over $1 billion today, but should surge to $7.2 billion by 2015, driven by the technology's low cost and weight, and ability to manufacture the films on flexible substrates to increase their usability, according to a report from NanoMarkets LLC.

TSMC producing 0.13-micron embedded flash

Tue, 8 Aug 2007
August 21, 2007 - TSMC says it has qualified and begun production of its "fully logic compatible" 0.13-micron embedded flash process, the first version to use copper wiring.

JSR makes spin-coated insulator for 45nm chips

Wed, 8 Aug 2007
August 22, 2007 - JSR Corp. says it has developed an insulating material that can be spin-coated on substrates for use in 45nm chip manufacturing, according to the Nikkei Business Daily.

Synopsys, SMIC pushing low-power TV chips

Wed, 8 Aug 2007
August 29, 2007 - Synopsys Inc. and Chinese foundry SMIC say they will develop a low-power design for mobile TV ICs, using 130nm and 90nm fab processes.

Jazz to fab Infinera's ICs for optical networks

Wed, 8 Aug 2007
August 29, 2007 - Infinera Corp. and Jazz Semiconductor have agreed to manufacture Infinera's 100Bv/sec ICs for optical networks, using Jazz's 0.18-micron SiGe BiCMOS process, with four layers of metal.

BTU, DEK deal for solar cell metallization

Fri, 8 Aug 2007
August 31, 2007 - BTU International and DEK International have formed a strategic partnership to provide complete in-line metallization processes for photovoltaic (solar cell) manufacturing.

UMC shuffles board, fab ops execs

Fri, 8 Aug 2007
August 17, 2007 - Taiwan foundry UMC says that it has made a couple of executive moves to establish separate organizations to manage its different technology operations.

TI buys RF design firm

Fri, 8 Aug 2007
August 17, 2007 - Texas Instruments has acquired privately held Integrated Circuit Designs Inc., to combine its designs for radio-frequency ICs with TI's high-performance analog and low-power microcontroller products.

Report: Renesas, NEC stepping up local Chinese sales efforts

Fri, 8 Aug 2007
August 17, 2007 - Renesas Technology Corp. and NEC Electronics Corp. plan to increase their sales and technology support staff in China in order to build ties with local design houses making chip modules, and thus increase the share of business from domestic companies, according to the Nikkei Business Daily.

SEMI: July equipment demand plummets on DRAM fall, foundry pause

Fri, 8 Aug 2007
August 17, 2007 - Orders for semiconductor equipment from North American-based manufacturers sunk to an eight-month low in July, though sales still remain high as previous demand pushes through the pipeline -- sending the B:B ratio, an indicator of healthy demand, plunging to its lowest level in more than two years.

Tower: Supply chain tweaking saves $15M

Mon, 8 Aug 2007
August 20, 2007 - Israeli foundry Tower Semiconductor says it will use an "inventory lifecycle" program to manage its spare parts for chipmaking tools, in an effort to streamline its parts usage, help raise capacity, and ultimately save millions of dollars over the next several years.

HelioVolt eyeing 20MW factory in US, says CEO

Mon, 8 Aug 2007
August 20, 2007 - HelioVolt aims to use its newly nailed-down $77M in Series B financing to help achieve its goal of a first factory, a proposed 20MW site in the US with room to expand capacity as needed, according to company CEO B.J. Stanbery, in an email Q&A with WaferNEWS.

Another fabless step: LSI sells mobile slice to Infineon

Tue, 8 Aug 2007
August 21, 2007 - LSI Corp., the merged entity of LSI Logic and Agere Systems, is selling its mobility products business to German chipmaker Infineon Technologies for $450 million plus a $50M performance-based bonus, in its latest efforts to carve out noncore operations and transform into a fabless manufacturing business model.

Analysis: Cadence "gets" DFM with ClearShape deal

Tue, 8 Aug 2007
August 21, 2007 - The acquisition of DFM darling ClearShape shows Cadence is finally getting serious about DFM, according to analyst and EDA guru Gary Smith. Although there are still some areas to address, he says, the DFM market now seems to be a two-horse race until competitors answer back.

Report: AMD's Luther Forest fab still "on track"

Fri, 8 Aug 2007
August 24, 2007 - Despite recent financial woes and product delays, AMD has assured New York state officials that its proposed $3.2M 300mm fab complex in the Luther Forest Technology Campus in Malta, NY, is still very much in the works, according to a local report.

Maxim buys Vitesse's storage biz

Fri, 8 Aug 2007
August 24, 2007 - Maxim Integrated Products has agreed to acquire a portion of Vitesse Semiconductor's storage products business for $63 million in cash, plus up to $12 million in performance incentives, in a deal that bolster's Maxim's storage portfolio and lets Vitesse focus on its networking/Ethernet business.

Ultra Clean president retiring

Fri, 8 Aug 2007
August 24, 2007 - Chip equipment subsystems provider Ultra Clean Technology says that its president, Leonid (Leonard) Mezhvinsky, will retire at year's end, though he will remain a director and assist the transition of responsibilities to a successor, the search for whom will begin "immediately."

Analyst: MCUs recovering, DSPs still struggling

Fri, 8 Aug 2007
August 24, 2007 - After nearly a year and a half of price competition that undercut ASPs, the microprocessor market should cover "modestly" in 2007 as PC demand now picks up, according to a report from IC Insights.

ISS REPORT: Don't be afraid of the big bad economy, urges Nobel Laureate Prescott

Tue, 1 Jan 2007
Caution, even fear, is the feeling of many executives as they plan for a slowdown in 2007 -- the global economy is of major concern because it's tracked much more closely now by the semiconductor industry due to consumerization. Are we heading into a recession with the US dollar slumping and the stock market plunging? No way, suggested Nobel economist Edward Prescott of Arizona State U., in his opening talk at the recent Industry Strategy Symposium (ISS) in Half Moon Bay, CA.

Cypress sells image sensor unit

Thu, 3 Mar 2007
March 1, 2007 - Continuing a restructuring that has already seen a pullback from leading-edge chip development, Cypress Semiconductors says it has agreed to sell its automotive image sensor subsidiary to Sensata Technologies Inc. for an undisclosed amount.

Avanex sells French opto fabs

Thu, 3 Mar 2007
March 1, 2007 - Photonics developer Avanex Corp. says it has agreed to sell a 90% interest in its French subsidiary, including indium phosphide and gallium arsenide fabs, to limited liability firm Global Research Co. and current management

AE moving German manufacturing to China, US

Fri, 3 Mar 2007
March 2, 2007 - Advanced Energy Industries Inc. says it is closing its RF components operation in Stolberg, Germany, and will transfer manufacturing operations to facilities in China and the US by the beginning of 4Q07.

AMD exec warns of supply shortfall

Tue, 3 Mar 2007
March 6, 2007 - AMD is struggling to supply microprocessors to distribution processors due to problems related changing its distribution strategy for some new large customers, according to AMD CEO Hector Ruiz, talking to investors at a conference yesterday.

Intel says it's lost antitrust documents

Tue, 3 Mar 2007
March 6, 2007 - Intel Corp. says that "inadvertent mistakes" resulted in some employees not retaining key email correspondences as required in its antitrust lawsuit filed by rival AMD, according to media reports.

Gartner cuts chip estimates amid 'sluggish start' to 2007

Tue, 3 Mar 2007
March 6, 2007 - Citing reasons for a sluggish start to 2007, including soft end markets and an inventory surplus weighing 1Q07 chip sales, Gartner Dataquest has revised its full-year outlook for chip sales to 6.4% growth, vs. estimates of 9.2% just two months ago. The firm also has slightly lowered its outlook for 2008, seen as the next cyclical peak, to 8% from a projected 11.6% in previous forecasts.

Chinese equipment startup backed by Samsung, Qualcomm

Wed, 3 Mar 2007
March 7, 2007 - Advanced Micro-Fabrication Equipment Inc. (AMEC), a Shanghai, China-based startup developing etch and chemical vapor deposition (CVD) systems targeting 65nm-45nm nodes and beyond processes, has received another cash infusion from sources including Qualcomm and Samsung.

Top nations in nanotech must look beyond borders

Thu, 3 Mar 2007
March 8, 2007

Spansion to increase foundry outsource

Mon, 3 Mar 2007
March 12, 2007 - According to chipmaking equipment suppliers, NOR flash chipmaker Spansion Inc. reportedly will begin increasing outsource to dedicated chipmakers next quarter, says the Taiwan Economic News (CENS).

Claims limited to domestic competition in Intel suit

Mon, 3 Mar 2007
March 12, 2007 - A federal judge has limited the scope of a class-action lawsuit filed against Intel Corp., which alleges that the company raised computer prices through anticompetitive conduct.

FSA reports 2006 public fabless company revenue of $49.7B

Tue, 3 Mar 2007
March 13, 2007 - The Fabless Semiconductor Association (FSA) has announced in its recent "CYQ4 2006/Year-End 2006 Global Fabless Fundings & Financials Report," that the fabless industry revenue totaled $49.7 billion, which equated to 20 percent of the semiconductor sales total of $247.7 billion.

Qimonda planning memory dev center in China

Tue, 8 Aug 2007
August 7, 2007 - Qimonda AG plans to set up a new memory products development center in Suzhou, China, adding facilities at its existing site for memory IC assembly/testing operations.

AMD launches $1.5B notes sale to pay off loan

Thu, 8 Aug 2007
August 9, 2007 - AMD says it plans to raise $1.5 billion through the private placement of 5.75% convertible senior notes due 2012, plus another $225 million to cover any overallotments.

Report: ST eyeing Infineon bid

Mon, 8 Aug 2007
August 13, 2007 - German chipmaker Infineon reportedly could be the target of a takeover bid from STMicroelectronics, with a potential price of 12.50 euros/share, about a 16% premium above Friday's closing price.

Reports: Taiwan gov seeks jail for UMC execs

Tue, 8 Aug 2007
August 14, 2007 - Taiwanese prosecutors are pushing for jail time for former UMC chairman Robert Tsao for his company's alleged illegal technology involvement with a Chinese partner, even though a lower court recently threw out fines levied against him, according to local media reports in Taiwan.

Tower sales up, but not yet profitable

Wed, 8 Aug 2007
August 15, 2007 - Israeli foundry Tower Semiconductor says sales rose 3% sequentially in 2Q07 and 28% year-on-year to $57.1 million, and it trimmed its net loss to $9.2M vs. $37.4M in 1Q07 and $34.4M a year ago.

Solar systems firm HelioVolt nails down $77M VC funds

Thu, 8 Aug 2007
August 16, 2007 - HelioVolt Corp., a developer of CIGS thin-film solar products, says it has closed a $77 million round of Series B financing, which will be used to help build the Austin-based startup's first factory.

Test giant ASE taking division private

Tue, 9 Sep 2007
September 4, 2007 - Semiconductor test firm ASE Group says it wants to buy the remaining 49% ownership in subsidiary ASE Test Ltd. it does not own, in a cash offer valued at $784 million.

UK startup nabs $16M to launch "software defined silicon"

Thu, 9 Sep 2007
September 6, 2007 - XMOS Semiconductor, a UK startup developing a type of programmable semiconductor technology dubbed "software defined silicon," has closed a $16 million Series A round of VC funding with support from Foundation capital, Amadeus Capital Partners, and DFJ Esprit.

UMC sales up 4% in August

Fri, 9 Sep 2007
September 7, 2007 - Taiwan foundry UMC says sales rose 3.8% in August from the previous month to about $315.8 million, and are 10.8% ahead of sales from August 2006.

Analyst: Slumping analog market to bounce back in 2008

Fri, 9 Sep 2007
September 7, 2007 - Sales of analog ICs are mired in a "temporary" loss of momentum in 2007, resulting in the first year-on-year decline since the 2001 recession, but for 2008 the outlook looks a lot better, according to analysis from IC Insights.

TSMC hikes 3Q guidance on pull-ins

Mon, 9 Sep 2007
September 10, 2007 - TSMC posted slightly better sales in August than the previous month, but said that full 3Q07 sales and margins would be better than expected, fulfilling at least one analyst's predictions.

Intel hikes sales outlook on computing demand

Mon, 9 Sep 2007
September 10, 2007 - Citing strong demand in the computing sector, Intel is upping its estimates for its 3Q07 sales forecast to $9.4-$9.8 billion, above the higher end of a previous range of $9.0-$9.6 billion, and roughly 8%-12% higher than 2Q07.

Tower closes $60M credit lines for Fab2 expansion

Mon, 9 Sep 2007
September 10, 2007 - Israeli foundry Tower Semiconductor Ltd. says it has closed funding commitments totaling $60 million to expand its 200mm Fab 2 facility.

Report: TI laying off 200 at Dallas site

Tue, 9 Sep 2007
September 11, 2007 - Texas Instruments reportedly is laying off nearly 200 workers at its KFAB 200mm manufacturing facility in Dallas, who were unable to find other jobs in the company six months after the layoffs were announced.

Analyst: Intel, AMD still battling in MPUs, but others hurting more

Tue, 9 Sep 2007
September 11, 2007 - AMD did a better job than expected of gaining microprocessor market share on Intel in 2Q07, but from a wider perspective, the story is less about the two market giants and more about the smaller suppliers squashed in their "elephant dance," according to new analysis from iSuppli Corp.

News from Japan: Tool firms sweating out dog days of summer

Tue, 9 Sep 2007
September 11, 2007 - Investors for several tool firms are sweltering more than usual during the "dog days" of summer, and sales are heating up for one prominent silicon supplier, according to a scan of the past week's headlines in Japan.

TI tightens 3Q sales, but no up/down surprise

Wed, 9 Sep 2007
September 12, 2007 - Texas Instruments has narrowed its projected 3Q07 sales to a range of $3.56-$3.72 billion, vs. initial projections of $3.49-$3.79B. Semiconductor revenue outlook has been similarly narrowed around the midpoint of guidance to $3.36-$3.50B, vs. $3.29-$3.57B.

Report: TI job cuts about to start in TX

Fri, 3 Mar 2007
March 23, 2007 - Layoffs at Texas Instruments reportedly are ready to begin by as soon as April 3 lasting through year's end, starting with more than 200 positions at the company's Dallas campus.

NXP sales up 9% in 2006, 1Q07 looks weak

Mon, 3 Mar 2007
March 26, 2007 - NXP Semiconductors says it raked in profits of 325 million euros before earnings and charges, up 16% from 2005, on 9% higher sales of 4.96 billion euros, though it sees a weak market for 1Q07 due to seasonal patterns.

AMAT'S Brooks Software purchase gets DoJ thumbs-up

Tue, 3 Mar 2007
March 27, 2007 - The US Department of Justice's Antitrust Division has closed its investigation of the proposed sale of Brooks Automation's software division to Applied Materials, and the Hart-Scott-Rodino waiting period has been terminated, meaning that the companies are free to close the proposed transaction as soon as practicable.

Intel gives kudos to 54 top suppliers

Tue, 3 Mar 2007
March 27, 2007 - Intel has given a nod to more than four dozen suppliers -- an all-time high number of recognitions -- from its roster of thousands of supply-chain partners, ranging from capital equipment manufacturers to materials, components, and service providers.

Gartner: Chartered reclaims No.3 foundry spot in 2006

Tue, 3 Mar 2007
March 28, 2006 - Singapore's Chartered Semiconductor regained the No.3 spot among worldwide foundry sales in 2006, retaking the ranking behind foundry stalwards TSMC and UMC after losing the spot to SMIC a year ago, according to data from Gartner Dataquest.

Intel, IRS settle tax dispute

Thu, 3 Mar 2007
March 29, 2007 - Intel reportedly has been notified by the IRS that the government agency has closed an examination of the company's taxes from 1999-2002 and 2003-2005 regarding taxing of export sales.

AMAT extends multiyear/$200M service deal with India firm

Thu, 3 Mar 2007
March 29, 2007 - Applied Materials Inc. has extended its services partnership with Indian IT services firm Satyam Computer Services Ltd. in a new signed a five-year, $200 million contract, under which Satyam will provide application development, maintenance, and support (ADMS), as well as "business transformation" technology services, via a managed services delivery model.

Analyst: R2R, printable inks lead higher-growth segments for thin-film solar cell manufacturing

Fri, 3 Mar 2007
March 30, 2007 - Adoption of thin-film technology by solar cell manufacturers seeking an alternative to scarce and expensive polysilicon opens up new growth opportunities for production equipment suppliers, notes analyst firm The Information Network in a new report.

Hatching new fabless business models

Tue, 3 Mar 2007
The old fabless business model is dead...long live the new fabless business models! Tracking recent evolutionary changes to the business of fabless IC manufacturing was the topic on the table at a Feb. 28 luncheon panel discussion hosted by the Fabless Semiconductor Association (FSA) and moderated by Charles DiLisio of D-Side Advisors.

March 2007 Exclusive Feature 1:
FAB CONSTRUCTION
Anatomy of a fab addition: IBM's B323 annex

Wed, 3 Mar 2007
By John P. Henderson, CH2M HILL, Spartanburg, SC; Ronald J. Lorefice, IBM, East Fishkill, NY

This article addresses the architectural aspects of the design and construction of IBM's B323 annex, which was designed in 2003 and built in 2004. The design intent was to continue the existing material palette, to unify the two buildings into one, and to insure that new ideas and concepts were implemented into B323A, allowing the new annex to stand on its own merits.

Philips chip unit relaunched as NXP

Fri, 9 Sep 2006
September 1, 2006 - The former semiconductor unit of Royal Philips Electronics, recently sold to a group of equity firms for 8.3 billion euros (about US $10.6 billion), has been relaunched as a new company, NXP ("Next Experience"). The firm will remain headquartered in Eindhoven, the Netherlands.

Silicon supplier Hemlock seeks new production site

Mon, 7 Jul 2006
July 31, 2006 - Hemlock Semiconductor Corp., the biggest supplier of polycrystalline silicon, has launched a worldwide search for a new manufacturing sit. The company hopes to have a second facility online within five years to expand its supply to both the solar and electronics markets.

July 2006 Exclusive Feature:

Economics of sub-45nm chipmaking for equipment suppliers

Mon, 7 Jul 2006
By Bob Haavind, Editorial Director, Solid State Technology

Tough challenges facing process tool vendors as the industry moves toward sub-45nm chip features will require imaginative solutions. An analysis relating important application trends to process tool requirements was presented by Masayuki Tomoyasu, director of development and planning for Tokyo Electron Ltd. (TEL), who then proposed a wide range of potential solutions for toolmakers.

German scientist scores with nanoscale soccer field

Wed, 7 Jul 2006
A German scientist has got into the spirit of the World Cup soccer fever, by creating a nano-scale version of a playing field.

IBM again tops supercomputer list

Wed, 7 Jul 2006
The latest list of the top 500 global supercomputers is out, and Moore's Law appears to be holding its own even at the most crushing levels of systems performance. Although the performance ramp appears to be bending under the strain of higher frequencies, the gains made in the world of big iron continue to reach astonishing heights.

U. of Oregon gains $3.2M funding for nano materials R&D

Thu, 7 Jul 2006
July 6, 2006 - The U. of Oregon has received a five-year, $3.2 million grant from the National Science Foundation (NSF) to fund graduate studies in materials sciences and nanoscience research.

ATMI unveils new copper electrochemical deposition process

Mon, 7 Jul 2006
July 10, 2006 - ATMI Inc., Danbury, CT, and Enthone Inc., a division of Cookson Group PLC, have introduced a new copper electrochemical deposition process for 45nm process technologies and below, developed for Novellus Systems Inc.'s Sabre tool.

Chartered, Singapore university join for 65nm packaging

Tue, 7 Jul 2006
July 11, 2006 - Chartered Semiconductor Manufacturing and Singapore's Institute of Microelectronics, part of Singapore's Agency for Science, Technology and Research (A*STAR), have agreed to collaboration on research to optimize a range of fine-pitch packaging technologies for copper metallization and low-k dielectric silicon processes at 65nm and below.

Power.org updates platform specs, roster

Mon, 7 Jul 2006
July 24, 2006 - Power.org, an organization promoting the Power Architecture technology, has unveiled a new list of initiatives to accelerate development of power-efficient devices. The efforts include a new merged instruction set architecture and platform architecture specification, as well as a more unified branding strategy.

SRS offloads chip biz in management buyout

Mon, 7 Jul 2006
July 17, 2006 - Following its intentions stated several months ago, audio and communications technology developer SRS Labs Inc., Santa Ana, CA, has agreed to sell its Hong Kong-based semiconductor business, Valence Technology Ltd., to a holding company and members of Valence's management team.

Samsung profits drop due to NAND flash price slump

Wed, 7 Jul 2006
July 19, 2006 - Samsung Electronics Co. said group operating profits fell 12% in its fiscal 2Q06 ended in June, mainly due to a drop in NAND flash chip prices. Semiconductor sales rose 2% sequentially and 6% year-on-year to 4.42 trillion won (US $), while the unit's operating profits of 980 billion won ($) were down 12% vs. 1Q06 and 11% vs. a year ago.

Tessera, Micron drop swords, sign licensing deal

Fri, 7 Jul 2006
July 21, 2006 - Tessera Technologies Inc. and Micron Technology Inc. have settled a 15-month court battle with Micron agreeing to pay $30 million for a royalty-bearing license to Tessera's "compliant chip" packaging technology.

Unaxis, Intevac trade barbs over sputtering patent suit

Fri, 7 Jul 2006
July 21, 2006 - Earlier this month, Intevac Inc., Santa Clara, CA, a developer of magnetic media sputtering equipment for hard disk drives, filed a patent infringement lawsuit in US District Court in central California against Unaxis USA and Unaxis Balzers, alleging infringement of technology relating to its magnetic media sputtering equipment. Now, Unaxis is firing back, calling the move a futile attempt to block sales of its new product in the US.

AMD buying ATI for $5.4B, touts future micro/graphics integration

Mon, 7 Jul 2006
July 24, 2006 - Touting a vision of a silicon platform with integrated microprocessor and graphics processor capabilities, AMD and ATI Technologies Inc. have agreed to a $5.4 billion cash-and-stock deal to bring the graphics chip firm under AMD's wing. With the deal, AMD gains access to one of the two big graphics processor companies (the other being Nvidia), as well as a top supplier of chipsets for both AMD and Intel.

Report: Bids for Philips chip unit top $10B

Mon, 7 Jul 2006
July 24, 2006 - A trio of private equity firms are jostling for position to be the new owner of Royal Philips Electronics' semiconductor division, with bids for the unit topping $10 billion (8 billion euros), more than 30% above previous valuations, according to media reports.

FEI tabs Veeco exec as CEO

Mon, 7 Jul 2006
July 24, 2006 - FEI Co. has hired Don Kania, president and CEO of Veeco Instruments Inc., as its new president and CEO, replacing interim CEO Ray Link, who took over when Vahe Sarkissian stepped down in April.

SEMATECH adds NEC to ISMI roster

Tue, 7 Jul 2006
July 25, 2006 - NEC Electronics Corp. has joined the International SEMATECH Manufacturing Initiative (ISMI), bringing a background of technical depth and consumer-market experience. The firm says it is particularly interested in ISMI's programs on benchmarketing and productivity improvement.

TSMC: 2Q revs beat outlook, 3Q looking slower

Thu, 7 Jul 2006
July 27, 2006 - Taiwan Semiconductor Manufacturing Co. (TSMC) said it earned record profits in its 2Q06, as revenues exceeded the high end of expectations due to strong demand from customers in communications and consumer markets. But inventory concerns have caused the top foundry to pull back its estimates across the board for 3Q.

Cymer repurchasing $150M in stock

Fri, 7 Jul 2006
July 28, 2006 - Seeing an opportunity to help fund future growth, Cymer Inc. said it plans to repurchase up to $150 million of its common stock, on both the open market and in private transactions.

ASM to reorg Pacific unit after CEO retirement

Mon, 7 Jul 2006
July 31, 2006 - Dutch equipment firm ASM International NV is reshuffling the top management structure at its 54%-owned subsidiary ASM Pacific Technology Ltd., following the announced retirement of its cofounder and longtime CEO.

Analysts: Inventory seems to be at sweet spot

Tue, 10 Oct 2006
Analysts interviewed by WaferNEWS indicated the industry seems to be in a fairly good situation with regards to overall inventory levels heading into the holiday season.

Analyst: No must-have gadgets this Xmas, but that's OK

Tue, 10 Oct 2006
October 31, 2006 - The year-end holiday season has become an even more bellwether period for the chip industry, which is increasingly tied to demand for consumer electronics. This year has seen a host of delays in rollouts for some hotly anticipated gadgets, noted an analyst for iSuppli Corp., but that doesn't necessarily mean bad news for electronics and components suppliers.

Reports: Court dismisses UMC/China case

Tue, 1 Jan 2009
Jan. 5, 2009 - The Taiwan High Court has found former UMC top execs not guilty of allegedly illegally forging ties with Chinese chip company HeJian Technology.

MRS Spring Day 1: Intro and scope

Wed, 4 Apr 2009
In an exclusive daily blog for SST, Techcet's Michael A. Fury soaks in the MRS Spring meeting's wide scope, and the papers likely to be of interest during the week.

MRS Spring Day 5: Thin films for sensors, searching for a higher-k dielectric

Mon, 4 Apr 2009
Blogging exclusively for SST, Techcet's Michael A. Fury sums up papers on the MRS Spring meeting's final day, with discussion of thin films for magnetic sensors, advances in phase-change memory, and progress in the combinatorial searches for a higher-k dielectric than HfO2 and carbon-doped TaN metal gate compositions for HK.

Mallinckrodt Baker's solar cell surface modifiers increase cell efficiency

Wed, 7 Jul 2009
Mallinckrodt Baker exec explains how the company's two new solar cell surface modifier products, the PV-162 and PV-200, will enhance solar cell efficiency by up to 0.7% absolute, increasing cell energy output for both inline and batch solar cell manufacturing processes.

ARC + anti-soiling: Two coats better than one for solar module cover glass

Tue, 7 Jul 2009
Australian firm XeroCoat tells PV World about its plans to combine anti-soiling and antireflective coating technologies to deliver more light to solar modules and increase energy output.

Thin-film PV's path to 30% market share

Wed, 7 Jul 2009
On a cost/Watt basis, thin-film solar PV is potentially very attractive, with CdTe leading the way today and tandem silicon cells and CIGS not far from catching up, notes Linx Consulting's Mark Thirsk. And if the technical challenges with thin-film technology are solved, he's bullish that it may take over a 30% share of the market.

Francois Henley shows off 20μm kerf-free foil

Fri, 7 Jul 2009
Silicon Genesis president & CEO, Francois Henley, showcases the company's 20μm kerf-free foil, which is particularly well-suited to BIPV applications and capable of being made into solar cells with 20% efficiency. He also discusses the company's progress in bringing the technology to market, addressing manufacturers' ability to handle such ultra-thin foils.

Japan slips, China/TW/US climb in PV ranks

Wed, 7 Jul 2009
The global breadth suppliers of photovoltaic cells and panels continued to ploy out in 2008, as several competitors across the globe continue to push past Japan's major suppliers who once held the lion's share of the market, according to data from IC Insights.

NIST creates toughness test for low-k films

Mon, 1 Jan 2009
Researchers at the National Institute of Standards and Technology (NIST) have updated a well-known technique for measuring material properties to gauge the mechanical strength of low-k films, to help devicemakers better identify interconnect dielectric film candidates.

SIA: Chip sales pushing higher

Mon, 7 Jul 2009
Worldwide sales of semiconductors continue to creep up, and some comparisons are starting to look a little healthier -- particularly compared with the end of 2008.

Chip slump steadying, but optimism "premature"

Mon, 4 Apr 2009
In times like this, what counts as good news in the industry is that the bad news isn't getting any worse. The rate of decline in chip sales vs. the prior month seems to be slowing, according to data from the SIA, but it's perhaps too soon to take hope from it as a trend.

Analyst: PV firms hurting too, but long-term picture still bright

Thu, 4 Apr 2009
Photovoltaic solar cell manufacturers are feeling the pinch in these economic times like many other sectors, but recent reports from Gartner suggest the outlook over the next few years is fundamentally the same: growth opportunities, and continued dominance by silicon-based technologies.

China takes steps to rebalance its solar industry

Thu, 4 Apr 2009
The Chinese have much work ahead, to reorient their industries from an excessive reliance on foreign trade to one that is more balanced, and to fix a serious imbalance between domestic growth of installed solar power and the output capacity of China's PV manufacturing industry.

SIA: Sales drop off a cliff in Nov.

Mon, 1 Jan 2009
Global semiconductor sales dropped precipitously in November, which though not unexpected adds an extra layer of anxiety as the industry analyzes consumers' holiday spending patterns and their influence over the early part of 2009.

Restructuring: A prelude to growth

Thu, 1 Jan 2009
The dangerous combination of a memory downturn (supply growing faster than demand) in parallel with a buckling financial infrastructure has the potential to prolong the semiconductor downcycle due to its effect on consumers worldwide. It will be the rise in global consumer spending that brings us out of this turbulent economic storm.

The future of PVs remains bright

Thu, 1 Jan 2009
Clean technologies, and specifically photovoltaics, remain a bright and promising spot on the economic horizon, despite the spreading global economic downturn in financial and industrial markets. In 2009 and beyond, solar-module fabs will compete for quick ramp up and maximum efficiency and yield -- just as semiconductor fabs began to do in the 1980s. The solar industry will benefit strongly from the lessons learned and achievements of the semiconductor sector.

Solar tech sets sales record -- just as demand slows

Fri, 4 Apr 2009
If 2008 was a party for the solar PV industry, 2009 will be the morning after, warns Navigant Consulting's Paula Mints -- strong revenues and sales will be remembered fondly as demand softens and technology prices continue falling. But remember: this too shall pass.

Analyst: PV industry to "mature" thanks to downturn

Tue, 4 Apr 2009
While the PV industry, along with many others, is handwringing over the current severe downturn, it may in fact be just what is needed -- thinning the herd and rebalancing production and capacity to demand, according to a new report from iSuppli.

IMEC, Cytec aim to increase organic PV lifetimes

Thu, 4 Apr 2009
European R&D consortium IMEC and chemicals/materials supplier Cytec Industries are collaborating to develop "a commercially viable" technology for organic photovoltaic devices that's more stable and longer-life technology.

Key chemical and physical hazards in PV R&D/manufacturing

Fri, 7 Jul 2009
Advances in PV technologies have introduced a range of new manufacturing and R&D chemical and physical hazards that require appropriate engineering, administrative and personal protective equipment controls to minimize the potential for employee illness and/or injuries.

Controlling molecular contaminants at 32nm, 22nm

Wed, 8 Aug 2009
Jim Ohlsen, director of materials characterization at Entegris, discusses methods to improve yield at 32nm by controlling molecular contaminants in microenvironments. He also describes the multiple solutions that will be needed at 22nm to keep molecular contaminants at very low levels for long periods of time.

Microenvironments at 22nm

Tue, 8 Aug 2009
Entegris principal scientist Chuck Extrand discusses the impact constituents such as oxygen and water have on microenvironments at advanced nodes, challenges with respect to purging, and the multipronged approach needed for microenvironments at 22nm.

Toshiba opens doors to solar PV biz

Mon, 1 Jan 2009
Toshiba Corp. has established a "photovoltaic systems" division to supply large solar power generation systems, combining its systems integration know-how with existing work on high-efficiency power conditioning systems and rechargeable ion batteries.

Don't forget about organic solar cells

Fri, 1 Jan 2009
Inorganic thin-film solar cells have begun to erode the market share of wafer-based silicon cells, while cells based on organic semiconductors have fallen short of some of the more aggressive timetables set by their proponents. Still, organic cells offer an intriguing combination of flexible integration schemes and low cost.

Russian firms commit to 90nm site

Mon, 10 Oct 2009

JSC Sitronics units NIIME and Mikron and RUSNANO plan to build a new ~$560M site for 90nm chip production in Zelenograd, Russia.


Xerox: Silver ink pushes plastic electronics forward

Fri, 10 Oct 2009

Xerox researchers say they've development a new silver ink to print conductors, the third required material necessary for printing plastic circuits to replace silicon.


SIA: Chip sales keep climbing -- but do we know why?

Mon, 10 Oct 2009

Global semiconductor sales continued to rebound in August, rising 5% from the previous month, according to the latest data from the Semiconductor Industry Association (SIA). But the question is: is it end-demand driven, or just an inventory rebuild?


Gartner: How contract chip designers can survive

Mon, 10 Oct 2009

After three years of solid double-digit growth, the sector for third-party chip design services stumbled in 2008 and fell hard in 2009 -- and how these firms address three key challenges will shape the sector landscape over the next five years, according to a new report from Gartner.


Key takeaways from Intel's quarter: Historic margins, demand vs. inventory, capex cut

Mon, 10 Oct 2009

Now that everyone's had their spin on Intel's generally upbeat quarter, let's boil it down to a few key bullet points.


SEMATECH names ex-IBMer Armbrust as CEO; Polcari now chair

Mon, 11 Nov 2009

Semiconductor consortium SEMATECH has named Daniel Armbrust as president/CEO effective immediately, succeeding Michael Polcari who after nearly seven years in the position becomes board chairman.


Reports: Hynix creditors seeking alternative sale after Hyosung exit

Thu, 11 Nov 2009

With the pullout of proposed investor Hyosung Corp., creditors of Hynix Semiconductor are still looking to push ahead with a sale, though the clock may be ticking, according to local reports.


SIA: Chip sales up 5% in October, supplies tighten

Mon, 11 Nov 2009

The historically busy holiday-ramp period of October proved to be that again, and tight supplies could keep chip sales higher than usual for another few weeks, according to the latest data from the Semiconductor Industry Association (SIA).


IEDM 2009: MIT bolstering silicon chips with III-V

Fri, 12 Dec 2009

Scientists at MIT showed work at this week's IEDM in building and measuring multiple transistors using III-V materials (in this case, InGaAs) to determine optimal conditions for making a logic element, and a pathway to make them smaller and better.


Gartner: Most, but not all, chip firms down in 2009

Tue, 12 Dec 2009

Preliminary rankings for 2009 worldwide semiconductor sales not surprisingly show a lot of declines, but not as much as had been feared as recently as just a couple of months ago -- and some firms will even eke out positive growth by year's end, according to data from Gartner.


Demand surge, looming capacity shortages -- and fab lite's death knell

Mon, 12 Dec 2009

After slumbering for the past year, the industry is ill-equipped to handle surging chip demand heading into 2010 and beyond -- and tightened capacity will spell the end of the fab-lite model, predicts analyst Malcolm Penn of Future Horizons.


EU, US PV groups laud "exceptional" growth in 2008

Mon, 3 Mar 2009
Global PV output surged to 5.5GW in 2008 according to preliminary data from the European Photovoltaic Industry Association (EPIA). Meanwhile, the US-based Solar Energy Industries Association said domestic PV manufacturing capacity increased 65% vs. 2007, and production rose 53%.

Wacker buys major source of silicon metal

Thu, 7 Jul 2010

Wacker Chemie AG has successfully concluded its acquisition of the silicon-metal production site in Holla, Norway, from FESIL Group. Holla Metall’s production capacity is around one third of WACKER’s annual needs.


Inside SOI Consortium's new IP program

Wed, 3 Mar 2010

SOI Industry Consortium execs explain to SST the goals and future plans for their new "Ready for SOI Technology" program to broaden access to and encourage adoption of silicon-on-insulator (SOI) technology, its key inclusions, and what they hope to add next.


Intel buying Infineon wireless chip business

Mon, 8 Aug 2010

Intel plans to purchase Infineon’s Wireless Solutions Business (WLS) in a cash transaction valued at approximately $1.4b. Infineon will subsequently focus on automotive, industry and security technologies. The acquisition expands Intel’s current Wi-Fi and 4G WiMAX offerings to include Infineon’s 3G capabilities and supports Intel’s plans to accelerate LTE.


SIA: Looking for opportunities in slowdowns

Mon, 8 Aug 2010

Another month, another record -- and more signs that the chip industry might be softening a bit.


The economic realities of 450mm

Fri, 2 Feb 2010

John Ellis from SEMI takes issue with "a pervasive misconception" about the economics and timing of a wafer-size transition to 450mm and how these have changed with the 2008-2009 industry bust, and suggests ways to tackle the issues surrounding 450mm and keep other technologies on-track.


Setting the record straight on 450mm vs. 300mm

Fri, 2 Feb 2010

The 450mm transition continues to be a hotly debated topic. Scotten Jones from IC Knowledge responds to SEMI's John Ellis about 450mm production capabilities vs. efforts to improve 300mm, laying out his own numbers for 450mm costs and productivity.


IEDM preview: IBM Alliance simplifies pFET HKMG

Mon, 10 Oct 2010

At the upcoming International Electron Devices Meeting (IEDM), researchers from the IBM Alliance will describe a new germanium ion implantation process that implants Ge into the shallow silicon channel region prior to high-k/metal gate (HKMG) stack depositions.


Mentor Graphics talks about its new CFD analysis software and heat flow congestion in chip design

Mon, 10 Oct 2010

Mentor Graphics talks about its new CFD analysis software and heat flow congestion in chip designMentor Graphics Corporation (NASDAQ: MENT) announced its next-generation FloTHERM 3D computational fluid dynamics (CFD) software for electronics cooling applications. Called FloTHERM 9, the software provides bottleneck (Bn) and shortcut (Sc) fields. Erich Bürgel, GM, Mechanical Analysis Division at Mentor Graphics, describes the process in a podcast interview.


SIA: August IC growth mixed, forecasts still in line

Mon, 10 Oct 2010

Overall semiconductor sales are still in positive growth territory but the numbers slowed a bit in August for all but one region, according to the latest data from the Semiconductor Industry Association.


Intel gets Israeli backing for fab upgrade

Tue, 10 Oct 2010

The Israeli government is giving Intel hundreds of millions of dollars to infuse its 300mm/45nm fab in Kiryat Gat -- but it's a lot less than Intel had been hoping for.


AMD not for sale, but not shutting door on offers

Fri, 10 Oct 2010

Advanced Micro Devices (AMD) is not for sale, however the chip maker will listen to interesting proposals, chief executive Dirk Meyer said when asked about Oracle's recent interest in the sector.


China patent filings could overtake US, Japan in 2011

Mon, 10 Oct 2010

According to a detailed IP analysis published by the IP Solutions business of Thomson Reuters, China's patents focus has continued to be digital computing, a trend started in the 1990s/2000s outsourcing boom to China, but increasingly these are Chinese companies, not multinational parent companies, filing.


UMC, TSMC close sales year on a high

Fri, 1 Jan 2010

Taiwan's top two foundries both posted December sales that were up a few percentage points from the prior month, and more than double that from the same period a year ago.


ISS: Positive outlook for chip industry -- "W", "V," or square-root path?

Tue, 1 Jan 2010

Economists at this week's Industry Strategy Symposium (ISS) paint a positive picture for the semiconductor industry for the next few years, and for the economy in general.


ISS: Major consolidation concerns as R&D rift deepens

Wed, 1 Jan 2010

While analysts at this week's Industry Strategy Symposium (ISS) predict strong growth ahead for the semiconductor industry, they also foretell a fundamental change in structure that will leave only a handful of companies producing devices at the leading edge.


Around the horn: Reax to Intel's blowout 4Q09

Tue, 1 Jan 2010

A quick highlight list of Intel's blowout 4Q09 numbers, released after markets closed on Thursday 1/14.


Freed from fabs, AMD crashes fabless party

Thu, 1 Jan 2010

Having spun off its chip manufacturing operations into GlobalFoundries, AMD has positioned itself as the No.2 global fabless IC supplier in terms of sales, second only to Qualcomm, according to IC Insights.


Inventory management: Key to 2009 re-emergence, 2010 surge

Mon, 1 Jan 2010

Despite reported warnings of inventory bloat at electronic distributors, nearly all segments of the chip supply chain remain lean, according to a report from iSuppli.


Hynix: No bidders, block sale imminent?

Fri, 1 Jan 2010

A second window of opportunity to sell a controlling stake in Korea's Hynix Semiconductor has come and gone with no bidders coming forward, so the company's investors are looking at other ways to slough off their interest, according to multiple reports.


HP: Memristors now a reality

Fri, 4 Apr 2010

New insights into memristors could offer an offramp to the increasingly challenging navigations of Moore's Law scaling, and some very interesting applications in biomed research.


IMEC tips work in Ge CMP, epitaxy

Mon, 4 Apr 2010

European R&D consortium IMEC recently offered more details of its work in Ge-on-Si and other novel materials, in efforts to improve two processes: optimizing chemical mechanical planarization (CMP), and improving epitaxial growth using hydrogen and "inert species."


Chip sales slip in Feb., but prospects still bright

Mon, 4 Apr 2010

Chip sales slipped a bit in February after a better-than-expected January performance, but overall the market still shows recovering demand particularly in key markets and in emerging economies, particularly in the Asia-Pacific.


Gartner: 2009 tool sales -46%, strong comeback in 2010

Fri, 4 Apr 2010

Global semiconductor capital equipment spending totaled $16.78B in 2009, roughly a -46% dropoff from 2008 as chipmakers put the brakes on all but essential spending in order to preserve cash, according to the final tallies from Gartner.


Analyst: Si wafer demand "robust"

Mon, 4 Apr 2010

As with sister markets, demand for silicon wafers used in making semiconductors is expected to ramp up in 2010, driven by a single keyword: "innovation," according to analyst firm iSuppli.


ConFab: Good years through 2012, says McClean

Wed, 5 May 2010

Key takeaways from Bill McClean, speaking at The ConFab this week in Las Vegas: The industry's low-teens growth path in 2010 might be conservative, and could last all the way through 2012. And a possible 60% snapback in capital spending, particularly focused on memory, "is still not even close to being enough."


ConFab video: Precisely timed fab investments; the "post-NAND world"

Wed, 5 May 2010

In a video interview at The ConFab, SanDisk founder/president/CEO Eli Harari expands on two themes in his Monday keynote address: the precise timing of new fab investments to promote a healthy supply/demand balance, and what it will take to get to the "post-NAND" world.


ConFab video: Shifting to "systemic collaboration"

Wed, 5 May 2010

Aart de Geus of Synopsys elaborates on the industry's shift toward "systemic collaboration" to envelop all functionality of semiconductor systems, from power management to embedded software.


ConFab video: ASPs holding on, capacity build will take time

Wed, 5 May 2010

Bill McClean, president of IC Insights, tells SST's Debra Vogler that ASPs are still holding and it will take the industry some time to build up its capacity.


ConFab video: Systems-driven collaboration creates opportunities

Thu, 5 May 2010

Lode Lauwers, senior business development director at IMEC, describes the drivers of new collaboration between systems companies and technology companies, and where platforms such as IMEC fit in.


Space-sector-semiconductor-manufacturing-expansion-Rochester-Electronics

Wed, 11 Nov 2010

space-level semiconductor from Rochester ElectronicsRochester Electronics, authorized manufacturer and distributor of end-of-life and mature semiconductors, has expanded its space-level continuing manufacturing services and product offering to provide a continuous, long-term source of certified semiconductor devices.


Verigy-merges-with-LTX-Credence

Thu, 11 Nov 2010

The Verigy (NASDAQ: VRGY), LTX-Credence (NASDAQ: LTXC) merger proposes to add scale with increased presence in the SOC test market; combine complementary products, markets, customers and channels; and generate annualized synergies of at least $25 million, following the completion of the integration. But some say LTX didn't shop around for the best share value.


Picochip-engages-9-million-debt facility with Silicon Valley Bank

Fri, 11 Nov 2010

Fabless company Picochip Limited, femtocell technology and silicon provider, completed a new $9 million debt facility with Silicon Valley Bank. The facility consists of a $4.0 million three-year term loan and a two-year $5.0 million working capital line of credit. The combined facility will provide Picochip with access to additional working capital to support growth.


AMAT, Samsung settle spat over leaks

Tue, 11 Nov 2010

Applied and key customer Samsung clear the air over alleged chip technology leaks, with pricing concessions that could actually help AMAT in the long run.


Achronix-FPGA-built-on-Intel-22nm-fab tech

Mon, 11 Nov 2010

Achronix Semiconductor Corp. announced strategic access to Intel Corporation's 22nm process technology, and plans to develop the most advanced field programmable gate arrays (FPGAs).


Teradyne grants SEMI license to Standard Test Data Format (STDF)

Tue, 11 Nov 2010

TER granted a worldwide royalty-free license of Standard Test Data Format (STDF), and any intellectual property rights, to SEMI to use, distribute, modify and support STDF. Under the supervision of SEMI International Standards, the STDF license will ensure standards development and new products will be unencumbered by IP ownership conflicts.


ITC recap: How smart does silicon need to be?

Wed, 11 Nov 2010

How to close the gulf between design models and manufactured silicon? An expert panel at this week's International Test Conference cast doubt on excessive use of guardbanding, and shed light on a possible new option: on-chip sensors  to collect data from the manufactured silicon itself.


Verific-licenses-front-end-software-to-Veridae-for-debug-and-validation products

Wed, 11 Nov 2010

Verific Design Automation and Veridae Systems jointly announced that the Verific front-end software has been licensed to Veridae for inclusion in the new Clarus family of debug and validation products.


GF pouring $3B into US, EU fab expansions

Tue, 6 Jun 2010

Confident in its place at the IC foundry table yet hungry for more, Globalfoundries says it will invest another $3B in new capacity expansions in the US and Europe.


WSTS, SIA forecasts upgrades reflect fast changes

Tue, 6 Jun 2010

With the industry roaring back to life in the past few months, major changes are in the semiannual industry forecasts from the WSTS and SIA.


Analyst: Double-ordering common, but chip levels still low

Tue, 6 Jun 2010

Semiconductor inventories should pick up the pace a little bit in 2Q10, but the numbers are "misleadingly elevated" and in reality stockpiles are quite lean, according to an iSuppli analyst.


SIA: Mope no more, seasonality returns in 1Q

Mon, 2 Feb 2010

Healthy end-market demand in consumer electronics, and now signs of recovery in the corporate IT sector as well, bode well for chip sales as finally show emergence from the downturn and return to normal seasonal patters, according to the Semiconductor Industry Association (SIA).


Analysts, execs take view of 2010 rebound

Tue, 2 Feb 2010

Continuing with our running theme of industry outlooks for 2010 and beyond, here are three viewpoints recently expressed: Bill McClean from IC Insights with strong optimism macroeconomically all the way down to semiconductors; Terry Brewer from Brewer Science outlining the opportunities for materials suppliers; and Craig Ramsey from CyberOptics Semiconductor, relating how his company withstood a tough 2009 and what it's doing to ensure 2010 growth.


Chip sales keep climbing to record highs

Mon, 5 May 2010

Semiconductor sales set a new high in the first months of 2010, and appear to be on their way to one of the best growth years of all time, according to new industry data and analysis.


Why 2010 will be "happy memory" -- and 2011 too

Thu, 5 May 2010

After 2+ years of slogging, there are happy tidings all around for memory firms in 2010 as demand increases, capacity tightens, and ASPs rise, according to a market analyst.


ConFab: "Delaying forever" with an IFM model

Tue, 5 May 2010

In his Monday (May 17) presentation at The ConFab, Qualcomm's Jim Clifford talked about the technical and economic challenges brought on by the convergence and ubiquity of wireless connectivity, and the importance of "early engagement" to cost-effectively research and develop products.


ICPT 2010: Exceeding expectations

Mon, 11 Nov 2010

Techcet's Karey Holland reviews key technical themes and presentations from the ICPT conference in Phoenix, ranging from HKMG and new device designs to Cu interconnects, cleans and metrology, and emerging/non-traditional CMP applications.


AMD analyst day takeaways: Closing the INTC gap with 2011 product roadmap, GloFo execution

Mon, 11 Nov 2010

Several analysts reporting from AMD's analyst day break down the company's proposed growth and profit plans, and new products coming down the pipeline -- and how the company could offer a new challenge to longtime rival Intel, if its leading-edge manufacturing partners can execute.


SPTS-opens-Silicon-Valley-Research Center in San Jose

Mon, 11 Nov 2010

SPP Process Technology Systems (SPTS) opened its new facility in San Jose, CA, the home for SPTS’ Thermal Products Division, and sales and support headquarters for North America. The Thermal Products Division was relocated from Scotts Valley, CA. Senior technical editor Debra Vogler attended and shares this report.


3M invests in printed electronics with Printechnologics

Mon, 10 Oct 2010

3M, through its New Ventures business, invested in Printechnologics, a German printed electronics specialist, aimed at joint efforts for providing innovative solutions for electronic circuitry on paper or foil.


Fusion-io creates solid state drive alliance for flash-optimized software, storage

Tue, 10 Oct 2010

Fusion-io announced the Fusion-io Technology Alliance Program, an initiative to develop new "Fusion Powered" technologies, including flash-optimized software, a new generation of storage appliances and virtualization solutions.


Tokyo Electron looks to LCD panel equipment fab in China

Thu, 10 Oct 2010

Tokyo Electron Ltd. plans to invest around 5 billion yen in China to build a new manufacturing plant for equipment used to produce LCD panels. Tokyo Electron has, to this point, manufactured its LCD panel fab equipment in Japan. The Nikkei (10/20) reports that competition from South Korean and Taiwanese rivals has intensified for TOELF.


Semico_ASIC_market_update_pent_up_silicon_design_demand

Tue, 10 Oct 2010

Semico recently presented an ASIC market update, noting a low growth forecast for the traditional ASIC market, and programmable logic growth driven by increasing requirement for bandwidth for portable connectivity. Designs are getting stale, and pent-up demand for fresh silicon will burst in 2011. Presenter Richard Wawrzyniak's discussion is summarized.


Plans Are Nothing; Planning Is Everything

Wed, 8 Aug 2007
This well-worn axiom from a top military planner, General Dwight D. Eisenhower, describes the mindset necessary to survive and prevail in the melee of business.

Single Wafer Surface Conditioning

Wed, 8 Aug 2007
The need for back-side metal adhesion and solder contact for ultra-thin, discrete, high-power semiconductor devices has increased significantly over the past several years.

Solutions and Solvents for Removing Silicone: A Practical Guide

Wed, 8 Aug 2007
Silicone adhesives are becoming more widely used in microelectronic hybrid assemblies due to their inherently low elastic modulus, which relieves stress between substrates with different coefficients of thermal expansion (CTE) during thermal cycling.

Correct-by-construction Methodology Enables Consumer Electronics Designs

Sat, 9 Sep 2007
The Japanese market, with its focus on consumer electronics and telecommunications, has embraced chip/package co-design and optimization for wire-bonded and system-in-package (SiP) devices.

The Occam Process: A Package-first Approach to Electronics Assembly

Sat, 9 Sep 2007
Tin-lead solder was pressed into service as means of making reliable permanent interconnections between electronic elements in the early years of the electronics industry.

PVD Processing for Flip Chip

Sat, 9 Sep 2007
Advanced packaging processes use physical vapor deposition (PVD) for gold bumping, solder bumping, redistribution (RDL), and integrated passive components.

NEW PRODUCTS

Sat, 9 Sep 2007

Coming Soon in 3D

Sat, 9 Sep 2007

Integrating Thermal Management and Burn-in Operations

Sat, 9 Sep 2007
In the semiconductor industry challenges appear to be directly related to Moore’s Law. In reality the culprit is consumer demand for more functionality, faster speeds, and smaller features. Technically, the integrated circuit (IC) industry is progressing at a rate that’s unmatched by any other industry. Yet, moving forward, it faces technical hurdles that slow progress, and must create advanced solutions without increasing costs.

Automatic Optical Inspection of IC Connections

Sat, 9 Sep 2007
Die and wire bonding are among the most important IC connection technologies in electronic production.

Molding Transforms to Meet Advanced Market Requirements

Sat, 9 Sep 2007
Integral to the packaging process for over three decades, epoxy molding compounds have undergone significant advancements due to revolutions in semiconductor package geometries, and legislative requirements surrounding lead-free and “green” material adoption.

Direct Laser Marking System

Wed, 3 Mar 2000
The fiber, laser-based 3000 Series Direct Marking System features LaserSmith legend design software designed for marking applications. The unit requires very low power to operate. Reportedly one of the smallest direct laser marking systems in the industry, it can be integrated into an existing system and provide a variety of mark solutions. In testing, the system is said to have performed for more than 500,000 operating hours with zero fiber failures.

Inspection System

Wed, 3 Mar 2000
The built-in 2-D inspection system on the DEK 265 and DEK 288 surface mount screen printers reportedly is now able to validate stencil apertures and paste-on-pad for µBGA patterns at a high rate of speed. The inspection system inspects automatically for stencil cleanliness and paste-on-pad to enhance process quality while maintaining rapid cycle times. Patterns for devices with pitches as fine as 0.8 and 0.75 mm may be inspected. A typical µBGA with 48 I/Os in a 6 x 8 matrix requires f

Inspection/Analysis Software

Wed, 3 Mar 2000
The Advanced Image Processor is a fully integrated inspection and analysis software package for real-time inspection and failure analysis. It is integrated into most of the company`s X-ray systems and may be used in "interactive" (live-image viewing) or "stand-alone" (previously captured image viewing) modes. The software is suitable for inspection and verification of boards using BGAs, flip chips, µBGAs and other high density packages.

Cleaning Systems

Wed, 3 Mar 2000
Systronic`s Stencil/Screen/PCB Cleaning Systems are pneumatic-operated, stand-alone and self-contained cleaning systems that reportedly do not require electricity or water in-feed connection. The system is designed for solvent-based as well as water-based room-temperature cleaning processes. The cleaning cycle consists of three stages: wash, rinse and dry, to clean and dry the product.

High Speed Robot

Wed, 3 Mar 2000
New to Toshiba Machine`s line of HSP series Scara robots is the SR-424HSP. With a total arm length of 420 mm, the robot can work within an area the size of a pallet. By bringing four-axis, multitasking capability and 32-bit control to a robot with an arm height of 479 mm and a weight of 21 kg, this pick-and-place solution can help reduce the overall size of a variety of machines. This robot is said to be fast and accurate, offering rotational speeds of up to 480°/sec and repeatability accur

Test Sockets

Wed, 3 Mar 2000
Yamaichi`s line of Test Contactor sockets are designed for automated or manual testing of BGA, LGA, CSP (with micro miniature balls down to 0.3 mm in diameter), QFP and other gullwing leaded IC packages. The test contactors combine a low profile, small body with long life and good electrical characteristics.

Manual Wafer-bumping System

Wed, 3 Mar 2000
Motorola Manufacturing Systems has entered the wafer-level CSP arena with the Model SA-20 manual wafer-bumping system. It is said to be capable of depositing 0.010- to 0.012-in. diameter solder spheres onto 6- or 8-in. diameter wafers for interconnect formation. The system reportedly provides cost-effective methods that device and package-development engineers can use to create flip-chip bumps on silicon from development through production stages.

DIP Adapter Modules

Wed, 3 Mar 2000
DIP Adapter Modules feature 8 to 32 pins for converting an IC that is packaged in a surface mount SOJ, TSOP, PLCC or SOIC package to a pin-compatible direct drop-in replacement for end-of-life DIP ICs. Developed for users with motherboard designs that require DIPs now obsolete, an on-board decoupling capacitor is included. Measuring from 0.400- to 1.6-in. long, depending upon the number of pins, the modules reportedly can incorporate 0.300- to 0.600-in. row-to-row spacing with 0.100-in. lead spa

High-frequency Laminate

Wed, 3 Mar 2000
The ComClad high-frequency laminate is said to be the first of its kind to combine high- performance antenna capabilities at a lower initial and applied cost. It is suitable for use in microwave and RF segments of the wireless market. Its strength reportedly lies in its ability to combine a low dielectric constant with low-loss factor materials. The laminate consists of Noryl plastic material as the base dielectric, which is said to offer a homogenous dielectric with a dielectric constant of 2.6

Syringe-filling System

Wed, 3 Mar 2000
The Syringe-filling System repackages material from a large cartridge or reservoir to smaller, manageable syringe packages. It is said to be suitable for companies looking to reduce costs by packaging their own material. To transfer material, an operator loads a full cartridge onto the retainer assembly, then secures it using the universal cartridge cap (with a 90° adapter). An empty plastic syringe can then be screwed on tightly, and a piston is moved into position. Using a foot pedal, th

Test Socket

Wed, 3 Mar 2000
This socket reportedly uses a proprietary pressure-conductive silicone technology to deliver extremely low inductance and high reliability. In production test, the contact is said to be good for more than 50,000 insertions, has a very low profile (less than 0.5 mm) and is a single-piece contact. Each is individually machined to fit a specific interface. The sockets are available from stock to four weeks.

Illumination Module

Wed, 3 Mar 2000
The UniversaLight illumination module offers a solution to the problem of imaging ceramic, flex and other substrates. This illumination module, which is available as an option for several models of Universal Instruments` GSM product line, includes a polarizing kit that provides high-contrast images of light-colored ceramic substrates. The one-piece design is said to be easy to mount and adjust. It reportedly also provides flexibility in the areas of illumination wavelength, polarization, and ill

TQFP-to-PGA Adapter

Wed, 3 Mar 2000
The A14450-1 TQFP-to-PGA adapter converts a 144-lead TQFP with 0.5-mm lead pitch to a standard 15 x 15 PGA footprint. The adapter is routed with a one-to-one interconnect and can be used for prototyping as well as production requirements. It is available in single pieces or in pallet form for high-volume applications.

Ceramic BGA

Wed, 3 Mar 2000
VIA/BGA is a leadless, thin film, ceramic BGA developed for packaging devices used in broadband data links, transmitting at 10 to 20 Gbps data rates and also for packaging KA-band GaAs MMICs used in broadband wireless access systems, such as LMDS. The package is said to support the new SiGe ICs developed for OC-192 SONET/SDH systems with the capability of extending its range to more than 20 Gbps data rates. It is being adopted in millimeter-wave applications, such as LMDS and SATCOM for broadban

Interconnection Interposer

Wed, 3 Mar 2000
The Chip-Coupler is a molecularly flexible, high-density interconnection interposer technology that differs in material and mechanical construction to the traditional flexible interposer using polyimide film. The technology reportedly eliminates the need and problems of underfill. Comparable interposers of the same interconnection density are said to cost two to three times more than the solution provided with this intrinsically flexible substrate with low-dielectric constant and dissipation.

SOI Wafers

Wed, 3 Mar 2000
Unibond silicon-on-insulator wafers are produced using commercially available equipment with a proprietary process that uses both ion implantation and wafer bonding technologies. The silicon quality is said to exceed that of standard or low-dose wafers, and the uniformity of the silicon dioxide layer is reportedly better than SOI wafers produced by the bond and etch-stop method. Key advantages include increased power efficiency and reduced power consumption.

Plated Copper on Ceramic

Wed, 3 Mar 2000
Power Board technology combines the thermal and mechanical features of ceramics with the electrical and thermal advantages of pure copper metalization. Features include plated through-hole capability, copper-plated solid thermal and hermetic vias, plated up copper heat spreaders, good solderability, ability to withstand high temperature die attach and high frequency, good gold and aluminum wire bondability, fine line resolution, and low conductor resistance.

Ultra Miniature Ceramic Crystal

Wed, 3 Mar 2000
The FX532A ultra miniature SMD ceramic crystal measures 5.0 mm x 3.2 mm with a profile of 1.00 mm. It has a frequency range of 14 MHz to 40 MHz, a frequency tolerance of ±100PPM, and an operating temperature range of -10°C to 60°C. Other tolerances and stabilities are available, as are 2,000-piece tape or reel for automatic mounting machines.

FibreChannel Connector

Wed, 3 Mar 2000
The FibreChannel GBIC Module connector eliminates hand soldering, meets FibreChannel and SCA-2 requirements, has pre-deposited solder and flux on each contact lead, and is available with lead-free technology. The connector is hot pluggable and blind mateable, has a UL 94 V-0 high temperature housing and gold or gold/palladium nickel plated signal contacts and tin or tin/lead plated ground contacts.

DC to DC Converters

Wed, 3 Mar 2000
The LPD301 series of DC to DC converters is detailed in a new brochure from Powercube. A variety of full-brick footprint converters are available from 50-200 Watts, offer efficiencies up to 90 percent, and provide total isolation of input, output and baseplate, with standard features including over-voltage and over-current protection, thermal shutdown, and frequency synchronization. The converters are available in commercial, industrial and military versions.

Surface Enrichment System

Wed, 3 Mar 2000
The SE contact system enables metallized particle interconnect to interface to a tin/lead surface. SE provides a means of interfacing LGA and BGA packages to the printed wire board (PWB) and works on both tin/lead pads on the PWB and eutectic solder balls on a BGA package. SE fulfills the low profile requirement of 5 mm stack height for notebook computers and is scalable to 0.8-mm pitch in pin counts from 400 to 5,000.

Press-fit Connectors

Wed, 3 Mar 2000
Multi-line Module 2 mm hard metric press-fit connectors meet CompactPCI/IEC 1076-4-101 specifications and are available with type A, B and C right angle receptacles for daughter cards, type A, B and C straight plugs for backplanes, type A, B and C shrouds for backplanes and coding keys for type A. The 8071 series receptacles are available with 55, 95, 110 and 125 signal contacts arranged in five-pin rows plus shield, while plugs have five signal rows plus two ground rows. The connectors provide

BGA Prototyping Adapter

Wed, 3 Mar 2000
The 1.0 mm BGA prototyping adapter uses a zero insertion force socket, which enables multiple chip testing of up to 10,000 insertions. The adapter eliminates the need to design-in additional signal access pins/points, prevents board revisions, is easily removed and has a low profile for minimal clearance. Delivery is stock to 10 days.

Surface Mount Pin Receptacles

Wed, 3 Mar 2000
Surface mount pin receptacles are discrete sockets that permit lead components to be plugged into SMT circuits. They are supplied on tape per EIA-481 for assembly with industry standard pick-and-place equipment and are made by press-fitting a stamped beryllium copper spring contact into a precision-machined housing. Mill-Max offers 35 sizes to accept pins ranging in diameter from .012 to .102 inches, as well as square and rectangular component leads.

Opening the door to wireless innovations

Wed, 3 Mar 2000
The second generation (2G) wireless phone will soon be history, replaced by the 2.5G handset offering a range of new features, including improved Internet and e-mail access, and many of the features of a personal digital assistant (PDA). The growth of wireless applications, combined with these new features, continues to challenge radio frequency (RF) designers to incorporate more functions into a smaller space while at the same time increasing battery life, improving display quality, lowering co

The Effect of Contract Manufacturing on OEM Financial Metrics

Tue, 2 Feb 2000
Original equipment manufacturers (OEMs) commonly use metrics to allocate assets and develop strategies for future performance. Department budgets are calculated, goals are set and success or failure is measured by a carefully predetermined set of metrics. Unfortunately, this same level of precision is often not applied to calculate the return on investment provided by outsourcing.

Die placement

Tue, 2 Feb 2000
With the ongoing demand to reduce product size while producing more functionality, die placement continues to be an important step in the advanced package assembly process. Crucial die placement considerations include the die presentation and metrics, material properties of the flux, force of placement, and substrate imaging capabilities.

Two Companies to Co-develop RFICs

Sat, 1 Jan 2000
IBM (Fishkill, N.Y.) and RF Micro Devices Inc. (Greensboro, N.C.) have agreed to develop radio frequency integrated circuits based on IBM`s silicon germanium process technology. The new RFICs are targeted for the next generation of cellular phones and are expected to reduce the chips in wireless handsets, shorten time-to-market and produce smaller phones that use less power.

Raychem Forms New Division

Sat, 1 Jan 2000
Raychem Interconnect is now an independent division of the newly formed Tyco Electronics Group, which was created from the integration of Raychem Corp. and AMP Incorporated. The Menlo Park, Calif.-based operation will run as a stand-alone provider of interconnect solutions plus products for sealing, connecting, protecting, and identifying wire and cable harnesses and components.

FD-FBGA Reduces Mount Space

Sat, 1 Jan 2000
San Jose, Calif. - A new small-footprint array package called the Face-Down Fine Pitch Ball Grid Array (FD-FBGA), intended for wireless and computer assemblies, measures only 6.4 x 10.10 mm. At a maximum elevation of 1 mm and weighing only 0.11 g with a 0.65 mm ball pitch, it is said to require 75 percent less mounting area and volume than the ubiquitous thin small-outline package.

New Alternative to Screen Printing

Sat, 1 Jan 2000
Honeoye Falls, N.Y. - A thick film deposition system is based on the concept of "direct writing." Called the MicroPen, fluid materials are extruded from a tool`s tip onto a substrate, producing an image directly from computer-generated data without the use of hard tooling. In operation, an integral computer with pattern-design software designs a part and sends the data to the dispensing/plotting system. Keeping the "pen" assembly stationary while moving the writing surface permits the use of dis

SOI Technology Improves Smart Cards

Sat, 1 Jan 2000
Bernin, France - Silicon On Insulator Technologies (SOITEC), a manufacturer of silicon-on-insulator (SOI) wafers, has announced a joint program with Gemplus, a smart card producer, to use integrated circuit (IC) manufacturing technology on SOI substrates for smart card applications. Smart card functions are increasingly requiring complex ICs featuring high-speed and low-power requirements, and SOI technology is said to be the key to achieving both qualities.

Self-test Technology Tackles Mixed-signal Devices

Sat, 1 Jan 2000
Fremont, Calif. - An expansion of built-off/self-test (BOST) technology by Credence Systems Corp. is set to bring the approach into the mixed-signal testing arena. The Phase-Lock-Loop BOST (PLLBOST) leverages voltage-controlled oscillator built-in self-test (BIST), or VCOBIST (Fluence Technology), engineering into the company`s suite of digital mixed-signal test platforms to provide a robust test coverage solution for volume production testing. The method measures frequency and jitter used to te

IMAPS Elects New Officers

Sat, 1 Jan 2000
Reston, Va. - Dr. Paul Van Loan, president of the International Microelectronics and Packaging Society, has revealed the organization`s new executive council for 2000 as the result of a recent election. Among the 16 new oYcers who will monitor the microelectronics and electronic packaging industry for the new decade are Gregory Caswell (Xetel Corp.), president; Dr. Len Schaper (University of Arkansas), vice president of technology; Ronald Baldan (AccuTech Laser), vice president of information di

Two-metal Substrate Development Underway

Sat, 1 Jan 2000
San Jose, Calif. - Korean substrate maker LG Electronics Inc. has agreed with Tessera Inc. on a deal to use the latter`s basic chip scale package technology to make and market two-metal-tape substrates for high pin count applications, such as those for application-specific integrated circuits and digital signal processors. Though the operation will be run by LG at Tessera`s site in San Jose, the two companies will cooperate in staffing the activity until the fully developed process may be transf

Fairchild Semiconductor, South Portland, Maine, promoted Darrell Mayeux to executive vice president of worldwide sales and marketing.

Sat, 1 Jan 2000

San Jose, Calif.-based Tessera named Bruce McWilliams as president and CEO.

Sat, 1 Jan 2000

National Starch and Chemical Co., Bridgewater, N.J., promoted Anthony Rindone to divisional vice president of adhesives manufacturing.

Sat, 1 Jan 2000

Cary, N.C.-based Lord Corp. announced the retirement of Donald Alstadt from board chairman.

Sat, 1 Jan 2000

Palomar Technologies, Vista, Calif., promoted Michael Criscuolo to customer service manager, and Gabriel Perez and Jerrol Olsen joined the group as field engineers.

Sat, 1 Jan 2000

Beaverton, Ore.-based Cascade Microtech Inc. appointed Craig Swanson to the position of CFO.

Sat, 1 Jan 2000

Manufacturers Services, Concord, Mass., named Eugene Bullis as CFO and executive vice president and Manuel Ruiz as vice president of program management.

Sat, 1 Jan 2000

Austin, Texas-based onQ Technology named Robert Jensen as CFO.

Sat, 1 Jan 2000

Conceptronic Inc., Portsmouth, N.H., appointed William Almond as president.

Sat, 1 Jan 2000

Unitive Electronics Inc., Research Triangle Park, N.C., promoted Robert Lanzone to vice president of sales and marketing.

Sat, 1 Jan 2000

CR Technology, Aliso Viejo, Calif., relocated to a 20,000 sq. ft. facility to accommodate recent growth.

Sat, 1 Jan 2000

Amarel Precision Instruments Inc., Fairport, N.Y., changed its name to Optem, Avimo Precision Instruments Inc.

Sat, 1 Jan 2000

Solkatronic Chemicals, Fairfield, N.J., relocated to 351 Philadelphia Avenue, Morrisville, PA 19067.

Sat, 1 Jan 2000

Eastern Air Devices, Dover, N.H., changed its name to EADmotors.

Sat, 1 Jan 2000

Menlo Park, Calif.-based OK International acquired Semtronics Corp. of Georgia.

Sat, 1 Jan 2000

Applied Microelectronics, Novia Scotia, Canada, is now AMIRIX Systems Inc. and is located at 77 Chain Lake Drive, Halifax, NS, Canada B3S 1E1.

Sat, 1 Jan 2000

Design validation at first silicon

Wed, 3 Mar 2000
As micropro-cessor performance exceeds 850MHz, de-vice dimensions shrink below .25 microns and logic density explodes into tens of millions of gates, design and simulation tools are being pushed beyond traditional models and engineering experience to successfully verify these advanced designs. The ability to achieve full design functionality at speed is being challenged. To ensure a quick hand-off to produce these higher performance designs, there is a critical need to validate design performanc

Die Attach

Wed, 3 Mar 2000
Four die attach methods - epoxy, eutectic, soft solder and flip chip - serve to attach the semiconductor chip to the package and meet the demanding functionality requirements of today`s advanced semiconductor devices.

SEMATECH offers new methodology

Tue, 2 Feb 2000
The SEMATECH reliability technology advisory board developed a reliability evaluation test methodology to keep pace with market trends. The "Use Condition Methodology" is based on conditions in which the semiconductor package will be used. Detailed process steps are described for suppliers to establish the reliability stress program and evaluate all encountered failure mechanisms. This methodology requires extensive knowledge of the physics of failure mechanisms and the anticipated use of the co

Photon to acquire CR Technology

Tue, 2 Feb 2000
An agreement for Photon Dynamics Inc. to purchase CR Technology is intended to expand Photon`s geographic presence and leverage its technology into new markets. Photon is a provider of inspection and test equipment for the flat panel display industry, and CR Technology manufactures X-ray and optical inspection systems. The acquisition is expected to increase Photon`s inspection capability and ensure defect-free bonding to glass substrates.

Raychem launches Web site

Tue, 2 Feb 2000
Raychem Corp. introduced a new Web site dedicated to its gel products. Located at http://gels.raychem.com, the site enables design engineers and buyers to locate product information, technical and performance data, and tips on identifying the gels to best meet application needs. The site offers visitors a product selector, the ability to view, download and request information, and a search function to locate distributors and representatives.

August Technology ranked tenth fastest in growth

Tue, 2 Feb 2000
Edina, Minn.-based August Technology, a worldwide supplier of automated, 100 percent micro-defect inspection equipment to the semiconductor industry, has been given a "Minnesota Technology Fast 50" award as the tenth fastest growing technology company in Minnesota, based on revenue growth. From 1994 to 1998, the company enjoyed an increase in revenue of 895 percent.

MeltroniX to build for high-bandwidth-access markets

Tue, 2 Feb 2000
San Diego, Calif.-based Microelectronic Packaging Inc. has changed its name to MeltroniX Inc. and has a new focus in microelectronic design, volume manufacturing and test services on wireless/telecom and internet equipment companies that serve high-bandwidth-access markets associated with e-commerce. Because the company discontinued its ceramic package operations in Singapore, it was felt that the previous name did not accurately reflect its current business.

Static-control info now on web

Tue, 2 Feb 2000
Hatfield, Pa.-based Chapman-SIMCO has launched a new Web site containing data on static elimination, electrostatic charging and web cleaning at www.chapman-static.com. The site also includes information on how charges occur, methods of static elimination/charging for electrostatic bonding and a general positioning guide for control devices.

DARPA commissions PPI for laser tool

Tue, 2 Feb 2000
Lanham, Md.-based Potomac Photonics Inc. is in receipt of a $7.5 million contract from the Defense Advanced Research Projects Agency to develop a laser-based tool for fabrication of the next-generation of resistors and capacitors. The overall goal is a commercially available machine able to produce mesoscale electronic devices in a conformal manner on virtually any substrate.

SEMI applauds Chinas entry into the WTO

Tue, 2 Feb 2000
WASHINGTON, D.C. - The United States and the People`s Republic of China have reached an agreement on terms governing China`s entry into the World Trade Organization (WTO). Under the reported terms of the accession package, China will participate in the Information Technology Agreement (ITA), eliminating tariffs on a number of high technology products, including semiconductor manufacturing equipment, by 2005. The agreement would also establish trading distribution rights and other rules on the tr

Tosoh SMD, Grove City, Ohio, has appointed Robert Cross to product support specialist.

Tue, 2 Feb 2000

William Stone has been promoted to president of Temptronic Corp., Newton, Mass.

Tue, 2 Feb 2000

Quad Systems Corp., Willow Grove, Pa., has appointed Elmer OBrien to vice president of technical services and support, Matt Stackhouse to senior director of technical services,

Tue, 2 Feb 2000
Quad Systems Corp., Willow Grove, Pa., has appointed Elmer O`Brien to vice president of technical services and support, Matt Stackhouse to senior director of technical services, and Edward Conson to Eastern region (U.S.) service manager.

Santa Clara, Calif.-based ChipPac Inc. appointed Robert Krakauer to chief financial officer.

Tue, 2 Feb 2000

Electro Scientific Industries Inc., Portland, Ore., announced the retirement of company founder Douglas C. Strain from his position as vice chairman of the board of directors.

Tue, 2 Feb 2000

National Technical Systems Inc., Calabasas, Calif., has named Martin M. Dresser as marketing director for com- puter software/hardware testing.

Tue, 2 Feb 2000

The International Microelectronics and Packaging Society award selection committee has chosen Lee R. Levine, principal metallurgical engineer with Kulicke & Soffa Industries Inc.,

Tue, 2 Feb 2000
The International Microelectronics and Packaging Society award selection committee has chosen Lee R. Levine, principal metallurgical engineer with Kulicke & Soffa Industries Inc., to receive the John A. Wagnon Technical Achievement Award.

Standardizing lead scan tolerances: It can and should be done

Sat, 4 Apr 2000
It goes without saying that standardization is beneficial - a concept that the industry and individual companies should strive toward. While wafer fabrication, probe and even final component test have been achieving this, there seems to be a lack of standardization for back-end component finishing processes - particularly lead scan. This is a problem that presents itself most clearly to professionals who are working in contract scanning and tape and reel/scan services.

Wire bonding

Sat, 4 Apr 2000
Wire bonding, a low-temperature welding process, continues to dominate semiconductor interconnection. New technologies, such as copper wire and wafer metallization, promise increased flexibility and performance.

Flip chip soldering flux: Clean or no-clean processing?

Wed, 3 Mar 2000
Flux is an interesting substance that has a long history. Its use can be traced back to the Bronze Age when brazing was developed to make weapons and jewelry. Commonly used rosin flux, in its natural form, is the "life blood" or sap of an evergreen tree. Today`s sophisticated synthetic fluxes are formulated from base chemicals. Flux enhances the bonding of similar or dissimilar metal surfaces during the soldering process; this enhancement is achieved by the flux chemically breaking down oxides o

Kyocera purchases VisPro

Wed, 3 Mar 2000
Kyocera America Inc., a packaging solutions designer, manufacturer and assembler, has purchased VisPro Corp., a supplier of LTCC multilayer ceramic substrates and structural ceramic components. VisPro is now a new division of Kyocera, and the division`s 60 employees will continue to operate out of its Beaverton, Ore. facility.

Ceramic industry roadmap

Wed, 3 Mar 2000
The International Microelectronics and Packaging Society (IMAPS) will introduce an updated ceramic industry roadmap in March. The roadmap demonstrates the competitive advantages of ceramic technologies and their potential uses in the design, development, manufacturing and marketing of microelectronics applications over the next decade. For more information, visit the IMAPS Web site at www.imaps.org or call 1-888-GO-IMAPS.

ABI forecasts wireless to grow by billions

Wed, 3 Mar 2000
The market for wireless power products, including gallium arsenide (GaAs) integrated circuits (ICs) and transistors, and silicon power modules and transistors, will grow from $1.7 billion in 1999 to $5 billion in 2004, according to a recent study by Allied Business Intelligence (ABI). According to ABI, "Early growth will be driven by the use of GaAs IC power amplifiers in the fast-paced cellular/PCS handset market. Wireless broadband strategies, such as local multipoint distribution systems (LMD

Applied Materials buys Etec in $1.8 billion stock deal

Wed, 3 Mar 2000
Applied Materials Inc., the world`s largest maker of semiconductor manufacturing equipment, announced that it would buy Etec Systems Inc. in a stock deal currently valued at approximately $1.8 billion. Etec, based in Hayward, Calif., develops technology to make masks, which are used to print circuitry patterns onto silicon wafers. Each share of Etec`s stock will be exchanged for 0.649 shares of Applied Materials` common stock; the acquisition will be accounted for as a pooling of interests and i

Call for papers on lead solder alternatives

Wed, 3 Mar 2000
PORTSMOUTH, R.I. - The Military and Aerospace Electronics Committee of the ASME Electrical and Electronic Packaging Division has announced a workshop on the use of lead solder alternatives in military electronics. The workshop will be held during the 2000 International Mechanical Engineering Congress and Exposition, November 5-10, at the Walt Disney World Dolphin Resort. Papers are requested to discuss or present concerns, issues or work addressing this topic. Suggested technical topics include:

SAL Inc., South Burlington, Vt., has appointed Dan Fleming to president and chief executive officer.

Wed, 3 Mar 2000

DSM Engineering Plastics, Evansville, Ind., has named Roeland H. Polet vice president of marketing and sales.

Wed, 3 Mar 2000

Laser Fare Inc., Smithfield, R.I., has appointed Joseph J. Reddy to vice president of operations.

Wed, 3 Mar 2000

Mydata Automation Worldwide has appointed Pierre Martin to president of Mydata Japan, Joel Girard to managing director of Mydata France and Cheng Chong Foo to managing director of Mydata Asia.

Wed, 3 Mar 2000

Ultron Systems Inc., Moorpark, Calif., has expanded into a facility four times the size of its previous one.

Wed, 3 Mar 2000

Electro-Science Laboratories, King of Prussia, Pa., has made the purchase of thick film materials available on-line at www.ElectroScience.com.

Wed, 3 Mar 2000

ChipPAC Inc., Santa Clara, Calif., has received SAC Level 1 certification for its Korea facility.

Wed, 3 Mar 2000

Aegis Industrial Software, Philadelphia, Pa., has received certification from Siemens Energy and Automation Inc. for its CircuitCAM Version 4.1.2.6 computer integrated manufacturing software.

Wed, 3 Mar 2000

Silver Conductors

Wed, 3 Mar 2000
The KQ610 is a photoengraveable silver conductor paste that is said to produce ultra-high density interconnections using a combination of screen printing and photoengraving. The material reportedly creates dense fired films with smooth fired finishes that support the production of conductor geometries of 50 µm or better.

Electric Truck Oven

Wed, 3 Mar 2000
The No. 817 is a 500°F electric truck oven and is a modified version of the standard TBH-500 truck oven. Portions of the oven that come into contact with the heated air are constructed from Type 304 stainless-steel interior, including supply and return ductwork, the entire heat chamber and the recirculating blower wheel. Workspace dimensions inside the unit measure 48 x 48 x 60 inches high.

Hot Air Leveling Tape

Tue, 2 Feb 2000
Scapa 657 is a tough masking tape for protecting gold or rhodium finger contacts during hot air leveling and wave soldering processes. With durability and low static characteristics, the product is a specially treated paper laminated to a polyester film and coated with a silicone adhesive that allows the tape to withstand temperatures of nearly 500∞F without leaking. The product protects finger connectors against chemical solvents, solder and rinse water; detaches from the substrate withou

Rework System

Tue, 2 Feb 2000
The Sniper II is an extension of the Sniper Split Vision BGA/CSP and QFP rework system and includes a multiple profile storage system for data logging, and automatic loading and storage of rework temperature profiles. This low-temperature convection rework technology is enhanced with 16 multiple segment profile patterns and can be operated without a computer.

SMT Assembly System

Tue, 2 Feb 2000
The MP 1260 series SMT assembly systems feature continued operation while changing components or jobs and may be configured with up to 328 feed locations, and up to 10 flexible vacuum placement heads, gripper and dispense heads. The systems handle parts from 0201 to 55 mm2. Its vision system and ability to simultaneously pick up to five components allow for placement rates up to 5,000 CPH.

Stress Test System

Tue, 2 Feb 2000
The Accelerated Stress Test system can demonstrate in hours how a product will hold up after years of use. The system applies environmental stresses that accelerate product fatigue and expose defects that surface over time under normal conditions. Extreme stresses are imparted to products under test through ultra-high rates of temperature change in excess of 70∞C/min and multi-aces, repetitive shock vibration capable of producing acceleration forces over 50 g.

Test methodologies and systems require paradigm shift

Tue, 2 Feb 2000
Leading semiconductor manufacturers argue that the cost of test is the single greatest contributor to the total cost of bringing an integrated circuit (IC) to market. If this is true, this plays a critical role in the success and profitability of newly emerging system-on-chip (SOC) technology. Semiconductor manufacturers hope to keep the cost of test and time-to-market for SOC development in line with today`s application-specific integrated circuit (ASIC) devices; this may prove to be a daunting

Lead-free project focuses on electronics assemblies

Tue, 2 Feb 2000
There has been increasing interest in the electronics assembly community regarding environmentally friendly assembly processes, including lead-free assembly, because of regulatory and consumer pressure from Europe and Japan. In the past year, leading Japanese original equipment manufacturers (OEMs) have made numerous pronouncements about their goals to reduce and eliminate lead in their products, and they have demonstrated that such "green" products can increase market share. In Europe, the prop

Void-free, flux-free process for placement and attach of solder balls

Tue, 2 Feb 2000
As production of wafer bumping, chip scale packages (CSPs), micro ball grid array (µBGA) and flip chip packages increases, so does the need for cost-effective and high yield production. The present method can produce unacceptable yields because it requires the use of flux; when the flux liquifies during the reflow soldering operations, the bonds between the flux, balls and pads are destroyed and the balls are free to move. Defects, such as vacancies, bridging of adjacent balls, loss of posi

Using stencil printing to bump wafers: convergence in action

Tue, 2 Feb 2000
The traditional division of the electronics industry into two segments - "back end" component packaging and "front end" product assembly, each with its own distinct production techniques - was rarely questioned as the industry has evolved. However, recent advances in both packaging and assembly technologies have raised the issue of convergence: Is there a potential for overlap between these two distinct areas of the industry? In a number of instances, each of the two segments already has product

The new challenges in die attach

Thu, 6 Jun 2000
Addressing the flexibility and complexity of accommodating new package technologies on a single machine, while also improving accuracy.

New innovations in dispensing liquid encapsulants

Thu, 6 Jun 2000
A viable alternative to transfer molding for fine-pitch advanced IC packages gains acceptance. A dual chamber driven by an LPD pump provides continuous dispensing for maximum equipment usage.

Step 6: Lead forming

Thu, 6 Jun 2000
Since the advent of surface mount technology (SMT), chip designers have benefited from the doubling of the amount of available board real estate and ever-developing means of assembly and packaging

Who's winning the pitch war - ICs or substrates?

Thu, 6 Jun 2000
In today's state-of-the-art designs, an interconnect war is being fought between the input/output (I/O) pitch of semiconductors and the substrates/packages to which they are connected

Ceramic Technology Meets Market Demands

Sat, 1 Jan 2000
The global demand for smaller electronic products is pushing manufacturers to use higher-density components. For companies that must develop them, an added complexity lies in meeting marketplace demands for higher quality and improved reliability, which, in turn, involves overcoming considerable technological challenges beginning with the creation of comprehensive research and development programs.

White Paper: A Mission Critical Document

Sat, 1 Jan 2000
The purpose of a "white paper" is to ensure compliance of a particular product being built to a customer`s specifications - to validate product and process by optimizing and verifying them at the pre-production stage. Additionally, information derived and presented as part of a white paper is based on statistically sound and valid data, thus it establishes the best-known method (BKM) for producing a particular product. The BKM will achieve optimum product production repeatability, product qualit

Flexible Lighting Modules

Mon, 5 May 2000
Four engineers focus on versatile lighting's serious impact on substrate imaging. Machine vision, used for substrate recognition, component centering/inspection and machine setup procedures, is an essential component of today's advanced automated assembly equipment. Machine vision's primary task - distinguishing features of interest from the background - is easier if the input image has a high degree of contrast.

Dispensed thermal gels: Reducing stress on components

Mon, 5 May 2000
In selecting thermal solutions, packaging designers can easily agree that minimizing thermal resistance is critical, and numerous articles now focus on performance and improvements in thermal resistance of interface materials.

Intarsia advances RF design with seamless simulation

Thu, 6 Jun 2000
As electronic products increase in functionality, the true challenge lies in maintaining outlines that are equivalent to or smaller than their predecessors

Semicon West PRODUCT ROUNDUP

Thu, 6 Jun 2000
At long last, it is time again for Semicon West. The conference and exhibition, which feature technical sessions and various assembly, test and packaging booths, will be held in San Jose, Calif., July 12-14

New Products

Thu, 6 Jun 2000
The Flexplacer's direct drive X- and Y-axis linear encoders control head travel and 100-percent touchless combined laser/vision centering on all components

Few-chip packaging

Sat, 9 Sep 2001
An SoC alternative offers miniaturization, enhanced electrical performance and greater interconnect density

The back-end process: Step 9 - Handling and test for RF devices

Sat, 9 Sep 2001
Driven by growth of the worldwide wireless revolution, electronics component manufacturers are increasingly being faced with new challenges when it comes to reliably producing high-performance radio frequency (RF) devices in large quantities

Building optical networks

Mon, 10 Oct 2001
Applying automated solutions to photonics manufacturing

Test and X-ray inspection for optoelectronics

Mon, 10 Oct 2001
The role of automatic defect recognition

Reworkable component attach adhesives

Mon, 10 Oct 2001
The role of automatic defect recognition

The back-end process: Step 10 - Laser marking

Mon, 10 Oct 2001
As electronic devices get smaller, components that go into them get smaller as well. A few years ago, many electronic packages were made with ceramic and in some cases were covered with gold lids

Flex tape for BGA applications

Mon, 5 May 2000
There are four primary substrate types used for ball grid array (BGA) packages: ceramic, plastic PCB materials, such as bismaleimide triazine (BT), metal and flexible tape. Of these, the most widely used and accepted are BT substrates and flexible tape.

What's driving environmentally friendly product designs?

Mon, 5 May 2000
Contrary to conventional wisdom, drivers for environmentally safe products exist in addition to government legislation. Electronic companies are concerned about environmentally safe designs, manufacturing processes and product recycling. What's more, from the commercial side, environmentally friendly products appeal to consumers who, with each generation, are becoming more environmentally conscious.

Coating and dispensing equipment product roundup

Mon, 5 May 2000
A wide variety of coating and dispensing equipment is available to meet the needs of semiconductor packaging and flip chip underfill applications. The following is a sampling of platforms, valves, pumps, jets, syringes and other items that address the increasingly complex needs of dispensing applications.

Spheres, springs, columns and beams

Sun, 7 Jul 2001
Emerging technologies in bumped interconnections

Is wafer-level packaging ready for 300 mm?

Sun, 7 Jul 2001
SECAP is making progress on the many challenges

A new career...perhaps

Sun, 7 Jul 2001
The past few months have been a disaster for most in the packaging world. Factory run rates are way down, and sales forecasts are dismal

SEMICON West Preview

Sun, 7 Jul 2001
This issue of Advanced Packaging magazine will hit readers' desks just before the industry's premier event - SEMICON West 2001.

Xradia Attains Series D Investment

Tue, 1 Jan 2007
(January 17, 2007) NEW YORK — Harris & Harris Group, in a Series D Preferred round of financing, invested $4 million in Xradia, Inc. (Concord, CA). Alexei A. Andreev, Ph.D., of Harris & Harris will join the imaging company's board of directors.

Actel Broadens Partnerships for FPGA Design

Tue, 1 Jan 2007
(January 17, 2007) MOUNTAIN VIEW, CA — Actel Corporation expanded its partnership with Mentor Graphics Corporation (Wilsonville, OR) through a new OEM agreement and technology and marketing partnership. Actel incorporates tools from Mentor, Synplicity, and SynaptiCAD in its next-generation integrated design environment (IDE) for FPGAs.

Lloyd Doyle Signs Agency Agreement

Tue, 1 Jan 2007
(January 17, 2007) WALTON-ON-THAMES, Surrey, U.K. — Lloyd Doyle Ltd. signed an agency agreement making Sigmatek Corporation its representative in Taiwan. 2007 will be a growth year for bumped-substrate manufacturing in the region, predicts Richard Frisk, president of Lloyd Doyle.

electronica Records Positive Statistics

Tue, 1 Jan 2007
(January 16, 2007) Munich, Germany — electronica 2006 hosted approximately 78,000 attendees, with rises in international attendance and exhibiting, and leadership attendance. The trade show also used an application-specific layout to focus on individual platforms such as wireless and automotive electronics sectors.

Gartner Dataquest Predicts SATS, PAE Scenarios

Wed, 1 Jan 2007
(January 17, 2007) STAMFORD, CT — Gartner Dataquest released near-future predictions for the packaging industry and capital equipment market, with numbers representing an overall positive outlook through 2008.

HP Presents FPGA Research Using Nanowires

Thu, 1 Jan 2007
(January 18, 2007) PALO ALTO, CA — Greg Snider and Stan Williams, HP researchers, created a hybrid circuit, in simulation, that could lead to FPGAs that are up to eight times denser that current devices. The concept combines conventional CMOS technology with nanoscale switching devices in a hybrid circuit. The chips could be constructed without modifying transistor size.

EDA Consortium Identifies Sector Growth

Thu, 1 Jan 2007
(January 18, 2007) SAN JOSE, CA — The EDA Consortium's market statistics service (MSS) released estimates of electronic design automation (EDA) industry revenue growth from Q'03 2005 to Q'03 2006. The industry as a whole reached $1,309 million, up about 16% from $1,122 a year ago. Professionals in the EDA companies tracked by MSS rose 11% to 25,018 year-to-year.

Blaze DFM Adds Staff and Space

Mon, 1 Jan 2007
(January 22, 2007) SUNNYVALE, CA — Blaze DFM opened a development and support center in San Diego for its electrical design for manufacture (DfM) products. The company concurrently appointed Steffen Rochel, Ph.D., as vice president of engineering. President and CEO Jacob Jacobsson remarked that the moves coincide with the company shipping initial products and initiating further development of intellectual property (IP).

Omron Expands Distribution Agreement

Mon, 1 Jan 2007
(January 22, 2007) HOOFDDROP, The Netherlands — RS Components and Omron Electronic Components Business Europe, with corporate headquarters in Japan, signed a pan-European distribution agreement. RS Components will carry a broader offering of Omron products and technologies under the extended partnership.

Military Supplier Places GaN Order

Thu, 1 Jan 2007
(January 25, 2007) GREENSBORO, NC — RF Micro Devices, Inc., received its first order for gallium nitride (GaN) power amplifier ICs produced with proprietary GaN high electron mobility transistor (HEMT) process technology. The tier-one military customer ordered RF3825 power IC broadband amplifiers, 15-W devices used in software-defined military-communications radios.

Fotofab Chooses Distributor Digi-Key

Thu, 1 Jan 2007
(January 25, 2007) THIEF RIVER FALLS, MN and CHICAGO — Digi-Key Corporation and Fotofab signed a distribution agreement wherein Digi-Key will carry Fotofab's precision metal parts, photochemical machining products, and custom items.

F&K Delvotec Repositions European Team

Fri, 1 Jan 2007
(January 26, 2007) OTTOBRUNN, Germany — F&K Delvotec announced two appointments within its European sales organization. Philip Homami became sales and marketing manager Europe. Effective March 1, 2007, Ralph Christoph will be account manager in European sales.

EU Approves Acquisition for H.C. Starck

Fri, 1 Jan 2007
(January 26, 2007) BRUSSELS, Belgium — The EU approved a bid by Advent International and the Carlyle Group to purchase Goslar, Germany-based H.C. Starck, a MaterialScience Group subsidiary of the Bayer Group. H.C. Starck, which specializes in high-purity refractory metals and ceramics in powder and engineered parts, will likely make an initial public offering (IPO) in 3 to 5 years.

AMI Ramps Production with AIT SiP

Mon, 1 Jan 2007
(January 29, 2007) SINGAPORE — AMI Semiconductor is in full production mode with Advanced Interconnect Technologies (AIT) stacked-die quad flat package no leads (QFN) modules. AMI will incorporate the packages into several consumer electronics applications. The QFN-MCM product uses a pyramid formation of stacked, wire-bonded die in a system-in-package (SiP), explained Chris Stai of AIT.

Transistor Technology Claims Low Leakage

Tue, 1 Jan 2007
(January 30, 2007) SANTA CLARA, CA — Intel Corporation is using new materials to build insulating walls and switching gates to enable 45-nm transistor technology. The hafnium-based high-k gate dielectric and metal-composite transistor gate electrode will be incorporated into a product family codenamed Penryn.

Canada Steps Up Presence at Photonics West

Tue, 1 Jan 2007
(January 30, 2007) OTTAWA — Ottawa-based companies, researchers, and scientists formed part of a Canadian delegation to Photonics West, held January 23–25, 2007, in San Jose, CA. The Canadian Photonics Pavilion represented the first booth dedicated to Canadian exhibitors in the show's history. Photonics West is a global platform, said Greg Bell, VP of marketing at Lumenera Corporation in Ottawa.

Dage's Bernard to Staff APEX Process Clinic

Wed, 1 Jan 2007
(January 31, 2007) FREMONT, CA — David Bernard, Ph.D., product manager of X-ray systems at Dage Precision Industries, will staff the Process Advice and Defect Clinic held during IPC Printed Circuits Expo/APEX/Designers Summit, February 20–22 in Los Angeles.

Nano-silver Powder

Tue, 1 Jan 2007
Designed for cost-efficient performance and high-volume applications, the Nano Silver 7000-95 powder suits radio frequency identification (RFID), flexible displays, and printed flexible circuits.

Memory Test System

Tue, 1 Jan 2007
The T5761/T5761ES, for NAND flash memory wafer- and package-level test, was created to address efficiency and cost issues with testing NAND components in consumer devices, such as digital cameras.

Software Upgrade

Thu, 1 Jan 2007
For use with Medalist 5DX automated X-ray inspection (AXI) systems, Agilent's version 8.4 software includes new algorithms and an additional inspection threshold.

Cleanroom Dispense System

Tue, 1 Jan 2007
The Axiom X-1000 series dispensing system, with a stainless steel enclosure, targets manufacturing applications in Class 100 cleanrooms, such as wafer-level packaging (WLP) and others sensitive to contamination by sub-micron sized particles.

Preassembled Pistons for Dispense Systems

Tue, 1 Jan 2007
A next-generation line of preassembled pistons for potting and encapsulant dispensing systems features improved air venting. The design improvement allows for more efficient, clean use of cartridges.

RFID Production Laser

Tue, 1 Jan 2007
The ProtoLaser 200 laser system reportedly accelerates the production of prototype RFID antennae and small-batch prototypes. It replaces chemical and mechanical production methods, structuring circuits on substrates such as aluminum, copper-coated PET films, and others.

ASIC, Power Designs Intro at DesignCon

Thu, 2 Feb 2007
(February 1, 2007) SANTA CLARA, CA — DesignCon, held January 29–February 1, 2007, in Santa Clara, highlighted several products and services introduced to advance the packaging industry. The show also hosted the DesignVision awards and a two-day business forum, and closes with half-day technical programs.

XJTAG Implements Global Plan

Thu, 2 Feb 2007
(February 1, 2007) CAMBRIDGE, U.K. — XJTAG appointed eight distributors to expand representation outside of England, which is the first phase of a strategy to ramp sales in the global market. The distributors cover 21 countries across Europe, the Far East, Australasia, North America, and the Middle East.

Tessera to Acquire Eyesquad

Fri, 2 Feb 2007
(February 2, 2007) SAN JOSE, CA — Tessera Technologies Inc. signed a definitive agreement to acquire Eyesquad, a Tel-Aviv, Israel-based development and design company for digital auto-focus and optical zoom solutions in camera phones and other electronic applications. Tessera is building an integrated consumer optics module solution through acquisitions of Shellcase Ltd., Digital Optics Corporation, and Eyesquad.

Joint Venture Developing in Suzhou

Fri, 2 Feb 2007
(February 2, 2007) EINDHOVEN, the Netherlands and TAIPEI, Taiwan — NXP Semiconductors, founded by Philips Semiconductors, and Advanced Semiconductor Engineering, Inc. (ASE), signed a memorandum of understanding to form a joint venture in Suzhou, China, focused on packaging and test.

Digital Underfill Dispenser

Tue, 5 May 2007
The DX-350 series of digital dispensers/controllers target precise fluid volumes with accuracy and repeatability for solder paste or underfill dispensing. The DX-350, with operating pressure between 0 and 100 psi, controls variation in pneumatic dispense valves and suits a range of fluid viscosities. The DX-355 dispenses low-viscosity fluids, with an operating pressure of 0–15 psi.

Plastic Hermetic Package

Tue, 5 May 2007
HermeTech, a hermetic plastic package that meets JEDEC standards, combines Quantech materials with the UltraSeal ultrasonic lid process to offer adjustable properties, low moisture permeability, and high temperature stability.

Hermetic Microelectronics Packages

Tue, 5 May 2007
Highly engineered, the CPS hermetic package is made from Kovar, aluminum (Al), steel, and other materials. It suits military, satellite, and aerospace end products.

SST ConFab Examines:
The New Rules for Packaging Strategies

Mon, 6 Jun 2007
By Bob Haavind, editorial director, Solid State Technology

At sister publication Solid State Technology's (SST) ConFab conference, a panel titled "Think Outside the Fab," chaired by James Doyle, VP, packaging and supply chain at IBM, explored the dramatic shifts that are reshaping packaging strategies at all chipmakers.

To Short or Not to Short:
Power Supply Shorting in Packaging, Part I

Mon, 6 Jun 2007
By Javier DeLaCruz, eSilicon Corp.

There are several notions that govern when to short power supplies in a package together. Many of these are driven by incorrect "rules of thumb," instead of a clear understanding of possible ramifications. Some IP providers also give misleading instructions with respect to supply shorts. The following guidelines for when to short supplies in a package and how to handle signal routing with these options offer practical solutions.

Digi-Key to Distribute ISSI

Tue, 6 Jun 2007
(June 6, 2007) THIEF RIVER FALLS, MN and SAN JOSE, CA — Electronic component distributor Digi-Key Corporation and memory provider Integrated Silicon Solution, Inc. (ISSI) signed a global distribution agreement, wherein Digi-Key will distribute ISSI EEPROM chips, SDRAM, and SRAM components in various package form factors and memory capacities.

Amkor Exec Keynotes IWLPC

Fri, 6 Jun 2007
(June 8, 2007) SAN JOSE, CA and CHANDLER, AZ — Oleg Khaykin, chief operation officer (COO) and executive VP of Amkor Technology, Inc., will keynote the International Wafer-level Packaging Conference (IWLPC), September 17–19 in San Jose. The event, co-sponsored by the SMTA, also hosts workshops, panels, and technical presentations.

Synova, Disco Co-develop Hybrid Dicing Tool

Mon, 6 Jun 2007
(June 11, 2007) LAUSANNE, Switzerland and MUNICH, Germany — Synova and Disco Hi-Tec Europe will partner to develop a hybrid dicing tool that uses both Synova's Laser Microjet (LMJ) water-jet-guided laser technology and the latest-generation blade-saw dicing systems for advanced dicing applications. The resulting tool is expected to allow semiconductor manufacturers to achieve a high throughput while minimizing damage to silicon and advanced-material wafers of any thickness.

Tessera Introduces Wafer-level Camera Technology

Mon, 6 Jun 2007
By Françoise von Trapp, managing editor

(June 11, 2007) SAN JOSE, CA — Moore's Law is about to be tested — again. Tessera Technologies added to its wafer-level technology portfolio with the unveiling of the OptiML WLC, a wafer-level camera technology that will reportedly advance the integration of miniaturized cameras in cell phones, personal computers, security cameras, and other electronics.

STATS Transfers Out Discrete Power Packages

Tue, 6 Jun 2007
(June 12, 2007) SINGAPORE — As part of a long-term portfolio refocusing onto advanced products, STATS ChipPAC Ltd. signed a definitive agreement to sell select manufacturing assets to Ningbo Mingxin Microelectronics, a high-volume manufacturer that caters to the power semiconductor market. Divesting assembly and test assets for discrete-power-package manufacture will allow STATS to concentrate resources on high-growth, advanced packages, noted Tan Lay Koon, president and CEO, STATS.

Test Enterprises Expands in Asia

Thu, 6 Jun 2007
(June 14, 2007) SUNNYVALE, CA — Test-equipment supplier Test Enterprises expanded its sales and support throughout Asia by opening TEST Inc. Asia, a wholly owned subsidiary dedicated to direct sales and service support for the group of Test Enterprises companies. These include Thermonics Inc., with a line of precision temperature forcing systems; and FETtest, with discrete and analog/mixed signal semiconductor test systems.

IEEE Awards Packaging Professionals

Fri, 6 Jun 2007
(June 15, 2007) PISCATAWAY, NJ — During the Electronic Components and Technology Conference in Reno, NV, the IEEE presented Dimitry Grabbe; Rao R. Tummala; Philip Garrou, Ph.D.; Chin C. Lee, Ph.D.; Herbert Reichl, Ph.D.; and Myung Jin Yim, Ph.D., its technical awards for contributions to components, packaging and electronics manufacturing technology.

To Short or Not to Short
Power Supply Shorting in Packaging, Part II

Mon, 6 Jun 2007
By Javier DeLaCruz, eSilicon Corp.

Part I of this article discussed noise sources in packages, supply collapse and bounce, and return paths. Part II covers more on return paths, noise ripple, resonances, differential signals, thermal benefits, and the exceptions to the rule.

Laurier Joins Datacon Group

Mon, 6 Jun 2007
(June 18, 2007) LONDONDERRY, NH — BESI will consolidate its Laurier division into the Datacon Technology GmbH die-attach equipment division, integrating sales, customer support, and manufacturing and product management. The reorganization is based on complementary product lines and markets, said Helmut Rutterschmidt, president and CEO, Datacon.

IMAPS, China Electronics Packaging Society Collaborate

Tue, 6 Jun 2007
(June 19, 2007) WASHINGTON — A Memorandum of Cooperation — developed during a visit in China between Jim Drehle, first past president, IMAPS; Steve Adamson, president elect, IMAPS; and professor BI Keyun, president of China Electronics Packaging Society (CEPS) and China Institute of Electronics (CIE) — will enable the societies to develop relationships in technical participation and international chapters.

XSiL Completes Expansion

Tue, 6 Jun 2007
(June 20, 2007) DUBLIN, Ireland — Laser system provider XSiL completed a relocation and renovation project, moving its headquarters to a larger, more modern facility in Dublin's Sandyford enterprise center.

Freescale Names CTO

Tue, 6 Jun 2007
(June 19, 2007) AUSTIN, TX — Freescale Semiconductor named Lisa Su, Ph.D., as senior vice president and chief technology officer (CTO), leading the company's global technical R&D activities. Su served previously as VP of semiconductor R&D at IBM, and received her electrical engineering education at Massachusetts Institute of Technology (MIT).

SW Test: The Place to Be for Die- and Wafer-level Testing

Tue, 6 Jun 2007
By Terence Q. Collier, contributing editor

If you want to know the latest and greatest on how to test complete packages, the BiTS Workshop provides an opportunity to interact with peers, suppliers, and other renegades. However, if die- and wafer-level testing is your niche, the complementary equivalent is an exciting show held annually at Paradise Point (yes, it is as great as it sounds) in San Diego: IEEE's SWTest Workshop, held June 3–6, 2007.

MagnaChip Implements Circuit under Pad

Thu, 6 Jun 2007
(June 21, 2007) SEOUL, South Korea — MagnaChip Semiconductor Ltd. has applied circuit under pad (CUP) technology to its foundry business processes for image sensor, mixed-signal, and digital multimedia components. CUP places the I/O circuit on the unused area of a chip, under the pad, and can reduce semiconductor sizes without reducing I/O count.

DEK Adds Asia Product Support

Mon, 6 Jun 2007
(June 25, 2007) WEYMOUTH, U.K. — DEK promoted David Hayes and Leon Lee to product support positions in Asia, aiding in R&D, region-specific product development, and opening a service control center in Shenzhen, China. Hayes was named product support manager; Lee will become Asia product manager.

Spansion Awards Suppliers

Mon, 6 Jun 2007
(June 25, 2007) BROOKFIELD, CT — Flash-memory supplier Spansion recognized Wentworth Laboratories, Inc., with one of 17 "World Class Supplier Achievement Awards for 2006," based on an evaluation of supplier performance in technology, quality, cost, flexibility, and service parameters. Spansion also recognized Oerlikon Assembly Equipment with a "Spotlight Award."

Elmos Transfers IC Assembly to AIT

Mon, 6 Jun 2007
(June 25, 2007) SINGAPORE — Advanced Interconnect Technologies (AIT) signed a multi-year assembly service agreement with Elmos Semiconductor of Dortmund, Germany, wherein Elmos will transfer IC assembly and supporting equipment from Holland to an AIT facility in Batam, Indonesia. Elmos is a global mixed-signal ASIC provider primarily serving automotive applications.

JPSA Adds Quality, Applications Staff

Tue, 6 Jun 2007
(June 26, 2007) MANCHESTER, NH — J P Sercel Associates (JPSA) appointed Joseph Brun as quality assurance manager and Ji Fu, Ph.D., as laser applications engineer.

iSuppli: 2007 Outlook Dims, 2008 Steady

Tue, 6 Jun 2007
(June 26, 2007) EL SEGUNDO, CA — In the industry's latest bearish move, research firm iSuppli Corp. has tweaked its outlook for 2007 downward again, though the firm expects chip sales "will gain momentum throughout 2007 following the first-quarter trough."

Equity Group Proposes UTAC Acquisition

Wed, 6 Jun 2007
(June 27, 2007) SINGAPORE — United Test and Assembly Center Ltd. (UTAC) confirmed that Affinity Equity Partners and TPG Capital, under a combined umbrella company, Global A&T Electronics, would acquire all issued ordinary shares in UTAC for up to $0.71–0.77/share in cash. The purchase is valued at about $2.2 billion.

Taiwan Approves Packaging in China

Thu, 6 Jun 2007
(June 28, 2007) TAIPEI, Taiwan — Taiwan's government approved plans for four domestic packaging-and-test firms to invest in mainland China operations, relaxing restrictions on advanced technology outsourcing and investment in China. Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Greatek Electronics, and Walton Advanced Engineering received approval to operate packaging houses or invest in China subsidiaries.

Gartner Finalizes 2006 Figures

Thu, 6 Jun 2007
(June 28, 2007) STAMFORD, CT — Gartner, Inc., finalized figures for the global semiconductor assembly and test services (SATS) market in 2006, indicating 26.5% growth, about 1% higher than previously indicated. This marks the fifth consecutive year this sector has exhibited double-digit growth. Revenues totaled $19.2 billion for the SATS industry.

Cohu Unit Acquires Component Manufacturer

Fri, 4 Apr 2007
(April 6, 2007) POWAY, CA — Broadcast Microwave Services, Inc. (BMS), subsidiary of Cohu, Inc., purchased Tandberg Televisions AVS GmbH (AVS) for about $8.3 million cash. Cohu supplies test handling, burn-in, and thermal solutions for semiconductor, microwave, and closed-circuit-television equipment markets.

Invetech Automates Thin-foil Capacitor Production

Mon, 4 Apr 2007
(April 9, 2007) SAN FRANCISCO — Invetech completed a commercialization project developing high-volume, low-cost processes for prismatic supercapacitor manufacturing. CAP-XX (Sydney, Australia) partnered with Invetech for product development and manufacturing technologies to commercialize the proprietary power-storage devices in mobile telecom, medical, automotive, and industrial markets.

Materials Upgrade for Test Sockets

Mon, 4 Apr 2007
(April 9, 2007) CHANDLER, AZ and LIBERTYVILLE, IL — Piper Plastics, Inc., a plastics-parts machining company, is producing test socket components from EPM-2204U-W: a proprietary grade, based on VICTREX PEEK polymer, that resists moisture absorption and suits tight pitch and fine-diameter holes. The plastic components offer advantages over ceramics and other polymers, according to Dave Wilkinson, materials engineering manager.

Johnson Recognized with TEEM Award

Tue, 4 Apr 2007
(April 10, 2007) DEARBORN, MI — The Society of Manufacturing Engineers (SME) electronics manufacturing tech group honored professor R. Wayne Johnson with the 2007 Total Excellence in Electronics Manufacturing (TEEM) award, in recognition of dedication and innovation in electronics manufacturing.

Discera, Tyco Qualify MOS1 for Military

Tue, 4 Apr 2007
(April 10, 2007) SAN JOSE, CA — Tyco Electronics' M/A-COM division, which provides wireless RF, microwave, and millimeter-wave components and systems, qualified Discera, Inc., MEMS-based oscillators, MOS1, for use in telemetry transmitters. Component volumes and delivery times are still to be determined, said Venkat Bahl of Discera.

Antares Co-brands Gryphics Socket

Thu, 4 Apr 2007
(April 12, 2007) VANCOUVER, WA; PLYMOUTH, MN; and BEAVERTON, OR — Antares Advanced Test Technologies and Gryphics, Inc., wholly owned subsidiary of Cascade Microtech, Inc., partnered for sales, distribution, and service on Gryphics' LQFN test-socket product line. Antares will rename the sockets "Kalypso," and provide global distribution and service.

Asymtek Presents Coating and Dispensing Workshop

Fri, 4 Apr 2007
(April 13, 2007) Carlsbad, CA —Asymtek, a Nordson company, is sponsoring a conformal coating and jet dispensing workshop on Thursday, May 3 at the Doubletree Hotel in Orlando, FL. The workshop will focus on electronics assembly for military and industrial applications and will feature speakers from Dymax, Henkel, Humiseal, Lockheed Martin, and Asymtek.

SolVision Inspects Flip Chip Substrates

Tue, 4 Apr 2007
(April 17, 2007) BOUCHERVILLE, Quebec — SolVision installed a Nano 3D SX bump metrology system at a flip chip substrate manufacturer based in Japan. The repeat order resulted from the machine's flexibility, support for lead-free bumps, and multi-die-substrate capabilities, said Jean-Lévy Beaudoin, product manager, substrate inspection, SolVision. The machine will be used for flip chip substrate inspection.

Gartner Forecasts Lower Revenue in 2007

Thu, 4 Apr 2007
(April 19, 2007) STAMFORD, CT — Gartner published a Dataquest Insight report predicting a 3% decline in sales revenues for semiconductor capital equipment in 2007. The research firm indicates that growth will begin in 2008, slow in 2009, and pick up again in 2010. Consumer spending, investments, and inventory control will dictate the semiconductor markets.

SMT/Hybrid/Packaging Highlights

Wed, 4 Apr 2007
(April 25, 2007) NUREMBERG, Germany — SMT/Hybrid/Packaging, April 24–26 in Nuremberg, hosts technical sessions, tutorials, exhibitions, live packaging demonstrations, and other events geared toward advanced applications in packaging and electronics assembly. Following are some highlights from the show.

Microscopic Glass Beads

Mon, 4 Apr 2007
Designed to produce hermetic glass-to-metal seals in IC packages, Direct-Draw- and Redraw-formed beads offer small quantities in a range of colored or opaque glass, or larger quantities of continuously formed clear glass tubing and rod.

Upgrade for Device Programmer

Mon, 4 Apr 2007
The Version 1.1 application software and device support upgrade for the FLX500 desktop automated device programmer enables real-time, on-demand statistical reporting and other features.

Hot Wax Dispensing

Mon, 4 Apr 2007
Hot wax, used as a gate or valve, enables lab-on-a-chip applications, containing fluids on a chip until they are released, by temperature change, to interact with other fluids or specimens deposited on the chip, for diagnostic testing. The DispenseJet DJ-9000 jet dispenses wax onto discrete locations on the chip, enabling biological testing on-chip without contaminations.

Low Outgassing Dielectric Gels

Tue, 4 Apr 2007
EPM-2480, 2481, and 2482 dielectric gels are designed to encapsulate packages when outgassing-related contamination poses a problem within a device. The products cure to a soft and compliant silicone, and reportedly reduce stress on assemblies during temperature cycling.

Optical Inspection Station

Tue, 4 Apr 2007
The SPM ProberStation 150 combines 3-D inspection and modern optical microscopy in a vision inspection system for atomic force microscopy (AFM) and scanning probe microscopy (SPM) studies. Travel area across the motorized stage accommodates samples up to 150 × 250 mm; measurements are said to be highly repeatable at ±200 nm for measuring surface roughness and features.

Ironwood Debuts QFN Socket

Fri, 6 Jun 2007
(June 29, 2007) BURNSVILLE, MN — Designed to last 100,000 insertions, the DG-QFN40C-01 socket for 0.4-mm-pitch QFN 40-pin ICs from Ironwood Electronics suits a 5- × 5-mm package and operates at up to 40 GHz with <1 dB insertion loss. The socket is constructed with high-performance, low-inductance diamond particle interconnect contactor.

Power-device Characterization Test System

Tue, 6 Jun 2007
The Telsa power-device characterization system tests and characterizes power devices prior to packaging, providing on-wafer probing for over-temperature, low-contact-resistance measurement up to 60 A and 3,000 V. Characterization prior to packaging is said to improve accuracy of test data and models.

Enhanced Temperature Differential

Tue, 6 Jun 2007
The eTEC thin-film miniature embedded thermoelectric component was enhanced to achieve 55°–60°C temperature differentials at room temperature in a research environment. Proprietary materials for cooling or power generation measure 5–15-µm thick.

Ceramic BGA Resistor Components

Tue, 6 Jun 2007
With all circuits wired on the bottom of the ceramic BGA (CBGA) package, the CHC-Precision series resistor network components eliminates wrap-around terminations to reduce parasitic effects and enable under-side washing.

Compact Wind Tunnel

Tue, 6 Jun 2007
The BWT-104 research-quality, open-loop, benchtop wind tunnel suits thermal characterization for components, PCB assemblies (PCBAs), and heatsink-type cooling devices. Twelve ports allow users to insert probes and temperature and velocity sensors for analysis, while a Plexiglass viewing section enables visual flow characterization.

Complex Package Analysis Tool

Tue, 6 Jun 2007
The PakSi-E quasi-static electromagnetic analysis software for IC, system-in-package (SiP), and PCB design includes various updates and improvements that reportedly enhance performance up to 3× that of previous versions. It targets a unified analysis environment for signal, power, and thermal integrity through multi-port design, front-end CAD import uniformity, and streamlined user interfacing.

Microprobing Inspection Microscope

Mon, 6 Jun 2007
Developed for university and research laboratories inspecting wafers and substrates, the NAT-31 42×–540× microscope inspection system includes a USB 2.0 color camera with high-clarity-zoom optics and 1-µm or below feature resolution. When used in conjunction with the company's probe station, the system detects defects, alignment, and probe placement.

ICE Executes Counterfeit Components Raid

Thu, 8 Aug 2007
(August 2, 2007) WASHINGTON, DC — U.S. Immigration and Customs Enforcement (ICE) agents, assisted by electronics industry representatives, executed a large-scale raid on businesses and residences suspected of imports, sales and distribution, and installation of illegal modification chips (mods) and other IP violations. The investigation, comprising 32 federal search warrants in 16 states, and 22 ICE offices, targeted illegal chip and software manufacture for gaming consoles.

IBM Streamlines VT Package-and-test Facility

Thu, 8 Aug 2007
(August 2, 2007) ESSEX JUNCTION, VT — IBM reportedly will lay off up to 450 employees, mostly from its systems and technologies group in upstate NY, amid cost-cutting efforts. About 90 layoffs will come from the company's site in Essex Junction, VT, notes the Associated Press (AP).

DEK Plans Shenzhen Facility Grand Opening

Thu, 8 Aug 2007
(August 2, 2007) WEYMOUTH, U.K. — DEK will host SMTA members, customers and suppliers, and local government representatives at a grand opening for its Shenzhen, China, manufacturing facility on August 27, 2007. The facility will expand DEK's production capacity for entry-level and medium-range printer platforms, and support for Asia-Pacific customers.

Package-first Electronics Assembly

Fri, 8 Aug 2007
(August 3, 2007) SANTA CLARA, CA — Verdant Electronics will develop a PCB and PCB assembly (PCBA) technique, Occam, that eliminates soldering in favor of an encapsulation and plating process. The reverse-order interconnection process directly connects component terminations with circuit traces, and may eliminate issues with lead-free assembly.

STATS Adds Director

Mon, 8 Aug 2007
(August 6, 2007) SINGAPORE — SATS provider STATS ChipPAC named Jimmy Phoon Siew Heng to its Board of Directors, effective immediately, citing Phoon's financial and investment experience. Phoon is senior managing director and chief investment officer at Temasek Holdings Limited, which has previously bid to acquire STATS, and holds majority stock in the company.

Carsem Installs Teradyne Test

Thu, 8 Aug 2007
(August 9, 2007) NORTH READING, MA — SATS provider Carsem will install a Teradyne, Inc., microFLEX test system at its Ipoh, Malaysia, facility. Carsem plans to test battery-management devices used in automotive applications, with the microFLEX equipped with DC90 instrumentation.

Qualmark Sees Japan HALT/HASS Market Up

Thu, 8 Aug 2007
(August 9, 2007) DENVER — Qualmark Corporation sold a Typhoon Chamber HALT/HASS system to a major consumer-electronics manufacturer in Japan. The country provides advanced electronic components and products, said Charles Johnston, president and CEO, Qualmark, adding that this niche suits use of accelerated test systems to help bring products to market.

Turnkey Modules for Cell Phones

Thu, 8 Aug 2007
By Erkki Soininen, Elcoteq

As EMS providers become more involved in design and R&D, they have started working on advanced miniaturization technologies and different component packaging methods. One method to improve TCO and solve design challenges for multifunctional phones is modules. Mobile phones can be designed using modules and hardware and software platforms that adapt quickly. Multiple functions can be combined in a single module to save space.

TI Buys RFIC Design Business

Thu, 8 Aug 2007
(August 16, 2007) DALLAS — Texas Instruments Inc. (TI) acquired Integrated Circuit Designs, Inc. (ICD — Ellicott City, MD) to enhance its low-power RF industrial, commercial, and consumer solutions. Transactions terms were undisclosed.

TDI Ramps InGaN Substrates

Fri, 8 Aug 2007
(August 17, 2007) SILVER SPRING, MD — Technologies and Devices International, Inc. (TDI), began producing indium-gallium-nitride (InGaN) substrates for packaging GaN-based high-brightness LEDs and blue and green laser diodes. The material's crystal lattice and thermal properties are composed to match the given overgrown GaN device, which can reduce defects, improve device efficiency and output, and boost lifetime and power usage.

QES Distributes RVSI to Southeast Asia

Wed, 5 May 2007
(May 3, 2007) HAUPPAUGE, NY — RVSI Inspection LLC appointed QES, headquartered in Kuala Lumpur, Malaysia, to represent its Lead Scanner and Wafer Scanner product lines in Singapore, Malaysia, Indonesia, and Thailand. QES serves front- and back-end markets.

From the Tradeshow Floor: IMAPS Device Packaging

Thu, 5 May 2007
By Meredith Courtemanche, assistant editor

IMAPS Device Packaging in Scottsdale, AZ, brought me from a below-freezing New England blizzard to the hot, sunny Arizona desert alongside dedicated members of the advanced packaging industry. Lead-free, flip chips, MEMS, and every variety of stacked package seemed to be the main topics around the tradeshow floor.

Mentor Graphics Appoints CFO

Fri, 5 May 2007
(May 4, 2007) WILSONVILLE, OR — Mentor Graphics Corporation named Maria M. Pope vice president and chief financial officer (CFO), responsible for treasury, tax, accounting, internal audit, corporate development, and investor relationships. She also will manage facilities and purchasing.

Indium Names Business Directors

Wed, 5 May 2007
(May 9, 2007) CLINTON, NY — Indium Corporation named Terry Guckes as business development director for metals and chemicals, and Bill Brunstedt as associate director of Asia-Pacific sales and marketing. Both men will be responsible for developing business relationships.

Nordson Adds Businesses to Dage, Asymtek Subsidiaries

Wed, 5 May 2007
(May 9, 2007) WESTLAKE, OH — Nordson Corporation acquired YESTech, Inc., adding the AOI and X-ray supplier to its Dage Holdings company; and PICO Dosiertechnik (PICODOSTEC), a piezoelectric dispensing system company that will join Nordson's Asymtek subsidiary, in two separate purchases. The total acquisition cost about $53 million. Nordson expects to leverage the business' core technologies across its advanced technology segment for packaging and electronics assembly products.

2D, 3D and Beyond: Inspecting Stacked Die in MCPs

Fri, 5 May 2007
By Matt Wilson and Rajiv Roy, Rudolph Technologies, Inc.

The value of fast, accurate inspection capability, which can detect existing defects and preempt further process investment, is multiplied in multichip packaging (MCP) applications by the large investment already made in multiple, fully processed die and the unrecoverable nature of the packaging process. One serious defect can kill its own die and take the rest of the stack down as well.

Experimental Satellite Integrates SIX SIGMA CGA

Fri, 5 May 2007
(May 11, 2007) MILPITAS, CA — SIX SIGMA, a division of Winslow Automation, Inc., integrated its SolderQuik reinforced column grid array technology onto six FPGAs on the Los Alamos National Laboratory Cibola Flight Experiment Satellite (CFEsat). SIX SIGMA reconfigured the FPGAs for Los Alamos to allow these components to withstand extreme thermal cycling while the satellite monitors weather patterns.

DAC Approaching in June

Tue, 5 May 2007
Keynoters, workshops, tutorials, and panel discussions covering wild-and-wacky to practical will highlight this year's DAC, June 4–8 in San Diego. The conference will host 161 papers, eight special sessions, seven full-day tutorials, eight panels, 18 pavilion panels, and seven hand-on tutorials in its 44th year. Technical presentations, submitted from 25 countries, cover electronics design from design for manufacture (DfM) to low-power design and a range of other topics.

Smart Phones to Drive Mobile Chips Market

Thu, 5 May 2007
(May 17, 2007) BEIJING — The Semiconductor Industry Research Center of CCID Consulting reports that mobile phone production in China experienced typically slow growth in Q'01 2007 from Q'04 2006, but overall grew 45.7% in 2006. The mobile phone chip market did not slow as much as mobile phone production, due in part to the increasing prevalence of smart phones.

Sonoscan Investigates Air and Fluid Contamination

Fri, 5 May 2007
(May 18, 2007) ELK GROVE Village, IL — Sonoscan determined that some delaminations in plastic IC packages contain air and fluid contaminants, possibly caused by silicone used as a release agent in molding equipment. Acoustic microscopic imaging identified partly red and partly white delaminations on plastic-encapsulated microcircuits, which indicated two types of contaminants.

Temasek Increases STATS ChipPAC Holdings

Mon, 5 May 2007
(May 21, 2007) SINGAPORE — Singapore Technologies Semiconductors Pte Ltd., wholly owned subsidiary of Temasek Holdings Limited, closed its voluntary conditional cash offer for STATS ChipPAC shares and convertible notes by increasing its holdings to 83.1%.

Avago Cuts Manufacturing in Strategic Shift

Mon, 5 May 2007
(May 21, 2007) SAN JOSE, Calif. — Avago Technologies expanded its manufacturing outsourcing program as part of a business model shift announced in January 2007. The component supplier will reduce its Singapore manufacturing staff by about 230 people to allot resources to higher value-added activities.

FETtest Completes Amicronix Buy

Wed, 5 May 2007
(May 23, 2007) MORGAN HILL, CA — FETtest, Inc., acquired Amicronix, Inc. (San Jose, CA), adding production mixed-signal semiconductor test equipment to its product portfolio.

ECTC Paper Presentation Preview

Wed, 5 May 2007
(May 23, 2007) RENO, NV — The 57th annual Electronic Components and Technology Conference (ECTC), May 29 to June 1 in Reno, NV, will feature developments in packaging, components, and microelectronic systems technology. Paper presentations include four technical pieces from Endicott Interconnect (EI — Endicott, NY) and five by Freescale Semiconductor (Austin, TX).

EI Adds LDI and AOI Systems for BGAs

Thu, 5 May 2007
(May 24, 2007) BILLERICA, MA — Orbotech, Inc., North American subsidiary of Orbotech Ltd., received a multi-million-dollar order from Endicott Interconnect Technologies, Inc. (EI), for its laser direct imaging (LDI) and automated optical inspection (AOI) equipment. EI will incorporate the machines in its production facility in Endicott, NY, making it Orbotech's largest client in the Americas.

SENSOR + TEST Attendance Up 15%

Tue, 5 May 2007
(May 29, 2007) NURNBERG, Germany — SENSOR + TEST conference and exhibition reports 15% higher attendance in 2007 than 2006, with 8,600 visitors and 610 exhibitors. The show was held in conjunction with GESA Expert Forum; OPTO conference on optical technologies, optical sensors, and measuring techniques; and the IRS2 conference on infrared (IR) sensors and systems, May 22–24 in Nürnberg.

EI Enters Long-term DoD Contract

Wed, 5 May 2007
(May 30, 2007) ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI), received a $49 million follow-on production contract from the U.S. Department of Defense (DoD) for a new generation of packaging, PCB, and substrate technologies. The R&D will focus on high-productivity computing, and is part of a five-year agreement.

Consumer Strong, Military Slow in New Year

Tue, 3 Mar 2007
(March 7, 2007) BEIJING and SAN JOSE, CA — Global semiconductor sales rose 9.2% in January, due in large part to strong consumer sectors — cell phones, personal computers, digital cameras, and music players. The year-to-year increase brought chip sales to $21.47B, according to the Semiconductor Industry Association (SIA), although global sales dipped 1.2% from December 2006.

IMEC Predicts Increased Packaging Research

Thu, 3 Mar 2007
(March 8, 2007) LEUVEN, Belgium — IMEC and the Government of Flanders, represented by the Flemish Minister of Science and Innovation, Fientje Moerman, signed a frame agreement for the period 2007–2011. The research institute underwent an evaluation by a group of independent external consultants and peer reviewers to determine grant budgets for upcoming years.

Synthesis Support for Complex FPGAs

Fri, 3 Mar 2007
(March 9, 2007) WILSONVILLE, Ore. — Mentor Graphics Corporation, after a collaboration with Xilinx, Inc., released an update to Precision Synthesis (2006a Update 2) to support Virtex-5 SXT FPGAs. Support within Mentor's LeonardoSpectrum tool suite is expected shortly.

K&S Receives Combined Wire-, Die-bonder Order

Fri, 3 Mar 2007
(March 9, 2007) FORT WASHINGTON, PA — Kulicke & Soffa Industries, Inc., received purchase orders for a combination of 12 Easyline die bonders and 50 Maxum Ultra/Elite wire bonders from a customer in northwestern China equipping its new start-up production facility.

Antares Reps Speak at BiTS

Mon, 3 Mar 2007
(March 12, 2007) VANCOUVER, WA and MESA, AZ — Steven B. Strauss, VP of engineering at Antares Advanced Test Technologies, spoke at the opening dinner of the eighth annual Burn-in and Test Socket Workshop (BiTS) March 11–14 in Mesa. The test supply company will also present four papers at the conference.

EI Names Rajinder Rai VP R&D

Tue, 3 Mar 2007
(March 13, 2007) ENDICOTT, NY — Endicott Interconnect Technologies, Inc. (EI), appointed Rajinder Rai as VP of R&D. Rai will assume immediate responsibility for assembling a development team to implement advanced processes and manufacturing, and will manage resources and support functions for the company's current and future R&D projects. He will also monitor and respond to state and federal program agencies for R&D opportunities.

Manufacturing Begins for Printed Sensors

Tue, 3 Mar 2007
(March 13, 2007) LINZ, Austria — NANOIDENT Technologies AG opened its first manufacturing facility for printed semiconductor-based optoelectronic sensors, NANOIDENT ORGANIC FAB, in Linz. The production facility uses no toxic materials, according to the company, and supports prototype through high-volume production.

Zuken Joins SiP Partnership

Wed, 3 Mar 2007
(March 14, 2007) MUNICH, Germany and WESTFORD, MA — Zuken joined the ADEPT-SiP project, a collaboration between industry partners, academia, and the U.K. government to develop a design and manufacturing methodology for system-in-package (SiP) technology.

Benchtop Dispensing Suits Prototypes

Thu, 3 Mar 2007
(March 15, 2007) CARLSBAD, CA — Asymtek, a Nordson company, released an automated dispensing system, the DispenseMate D583/585, based on the company's DispenseMate D-550 benchtop series. It targets dispensing applications that require compact, benchtop equipment, such as batch productions, laboratories, new product development, and prototyping.

Book-to-Bill Continues to Climb in February

Fri, 3 Mar 2007
(March 16, 2007) SAN JOSE, CA — North America-based semiconductor-equipment manufactures posted a 1.05 book-to-bill ratio in February 2007, with $1.65B in orders received and $1.58B billings worldwide. The book-to-bill, published by SEMI, has risen incrementally since October 2006, and remained above parity since December.

Methods of Comparing Junction Temperatures

Fri, 3 Mar 2007
By Jia-Sheng Huang, Rongsheng Miao, Hanh Lu, Charlie Wang, Chris Helms, and Hamdi Demerci, Emcore

To design device performance and reliability accurately, knowledge of junction temperature is important. One common method used to estimate heating is by wavelength shift, measured at a room temperature, free-standing condition. The deduced junction temperature from the wavelength method is often used as a reference; however, such approach may lead to inaccurate life test estimates.

Antares Distributes 3M Outside Japan

Thu, 3 Mar 2007
(March 22, 2007) AUSTIN, TX — Antares Advanced Test Technologies will distribute 3M Textool-branded BGA test and burn-in sockets outside of Japan, under a global distribution agreement between the companies.

EI Receives DoD Contracts

Fri, 3 Mar 2007
(March 23, 2007) ENDICOTT, NY — The U.S. Department of Defense (DoD) awarded $164 million in contracts for engineering, verification, and production to Endicott Interconnect Technologies, Inc. (EI). The project includes organic packaging; module assembly; PCB design and fabrication; board assembly; verification and test of these systems; and support for logistics, shipping, and storage. The end product is a high-reliability, high-performance computing application.

Fan-in PoP Allows Flexible Die Parameters

Mon, 3 Mar 2007
(March 26, 2007) SINGAPORE — STATS ChipPAC Ltd. developed a fan-in package-on-package (FiPoP) assembly solution that enables designers to integrate a wider range of die sizes than with conventional PoP packages. The FiPoP reportedly builds on the capabilities of PoP, including use of known good die (KGD) and use of the Z space, without the footprint and ball-height constraints of prior designs.

SEMI Launches High Tech U. en Français

Wed, 3 Mar 2007
(March 28, 2007) CROLLES, France — SEMI is hosting its High Tech U. program for about 40 secondary school students in Crolles March 27–29. Students will learn — in a play-oriented, interactive, hands-on experimental environment — how semiconductors and microelectronics are made, the science of microchips and interconnect, and the scope of career opportunities in this sector. This marks SEMI's first presentation of the class in Europe.

Intel Recognizes Suppliers

Thu, 3 Mar 2007
(March 29, 2007) SANTA CLARA, CA — Intel Corporation recognized 44 companies with the preferred quality supplier (PQS) award acknowledging quality and performance in 2006. Winners received the award at a ceremony in Burlingame, CA, this week. The awards are part of Intel's supplier continuous quality improvement (SCQI) process.

USDC Adds Governing Members

Fri, 3 Mar 2007
(March 30, 2007) SAN JOSE, CA — The U.S. Display Consortium (USDC) elected Michael McCreary as chairman of the consortium's governing board. James R. Buntaine, Ph.D., of Eastman Kodak; Steven Frilich, Ph.D., of DuPont; and Daniel Gamota, Ph.D., Motorola, also joined the board.

Updated Identification Software

Tue, 3 Mar 2007
The latest version of EconoCR industrial optical character recognition (OCR) software suits smart cameras, micro vision systems, and sensors tracking substrates, PCBs, glass, or electronic components in laboratory, manufacturing, and material-handling processes.

RF Calibration Software

Tue, 3 Mar 2007
WinCal XE calibration software addresses complexities encountered with complex, wafer-level RF measurements. Automated hybrid calibration algorithms allow users to calibrate up to four ports with a "precision probing tolerant" in place for differential measurements. Multi-port setup guides, calibration-standards management, and vector network analyzer (VNA) ports support the tool.

Peristaltic Pump Dispenser

Tue, 3 Mar 2007
Precision dispensing of dangerous or toxic substances can be controlled by the model PPD-130 peristaltic pump dispenser, which accurately and repeatably deposits low-viscosity fluids such as adhesives, oils, solvents, and other materials. The peristaltic pumping principle applies pressure to a soft Teflon tube, which accepts deformation and recovers its initial shape, improving occlusion.

Planar Heat Spreader

Fri, 3 Mar 2007
A thin, planar superconducting heat spreader, IsoSkin provides thermal conductivities as high as 10,000 W/mK. The product is available in thicknesses down to 500 µm. It can replace the outer shell of electronic components, and is said to eliminate the need for heatsinks or other cooling devices in some applications.

BGA Rework Station for Lead-free

Fri, 3 Mar 2007
The APR-5000-XLS array package rework system incorporates six convection underboard heaters, an upper nozzle, and revised heating algorithms for reworking lead-free BGAs without damaging ICs.

APEX 2007 Pursues Interest in Packaging

Tue, 1 Jan 2007
Following is a preview of the advanced packaging industry on display at IPC Printed Circuits/APEX/Designers Summit 2007, February 20 – 22, in Los Angeles. Look for more APEX previews leading up to the show in the newsletter and the January/February issue of Advanced Packaging.

Aetrium Divests Certain Test Technologies

Tue, 1 Jan 2007
(January 3, 2007) ST. PAUL, MN — Aetrium Inc., test equipment supplier for the semiconductor industry, divested product lines manufactured at its Dallas, TX, facility, including burn-in board loaders and turret-based test handlers. The intellectual property (IP), inventory, equipment, and other assets divested will transfer to privately held WEB Technology, Inc., a group formed with members of the Dallas business. Aetrium announced that it will focus on reliability-test equipment.

Soft Landing Forecast for Components Market

Tue, 1 Jan 2007
(January 3, 2007) EL SEGUNDO, CA — While 2007 will be a modest "peak year" for the semiconductor industry historically, global revenue should avoid damaging contractions in this growth cycle, according to a report released by iSuppli. The forecasting firm predicts double-digit growth tempered by changing business dynamics to about 10.6%, below previous peak years of 30 or 40% growth.

Taiwan Green-lights Advanced Components in China

Tue, 1 Jan 2007
(January 3, 2007) TAIPEI, Taiwan — The Taiwan Cabinet approved legislation to allow domestic chipmakers to produce advanced electronic components in mainland China, although concerns for intellectual property (IP) protection were raised.

Carl Freidhoff's Work in Aerospace Electronics Recognized

Tue, 1 Jan 2007
(January 3, 2007) BALTIMORE — The selection committee of Cambridge Who's Who, a database of executives and other professionals, awarded Carl Freidhoff Professional of the Year in aerospace electronics. Freidhoff — fellow engineer; modeling, simulation, and analysis at Northrop Grumman Corporation — co-developed mass spectrography on a chip, such as MEMS-based pumps with piezoelectric actuators.

Companies Collaborate for ID ICs

Tue, 1 Jan 2007
(January 2, 2007) SUNNYVALE, CA — Fujitsu Microelectronics America Inc., together with Cryptolex Trust Systems Inc. and Biometric Solutions LLC, integrated the MBF200 single-touch sensor IC into Cryptolex's Mobio handheld biometric security device.

Hymite Closes European Investment Round

Mon, 1 Jan 2007
(January 8, 2007) COPENHAGEN, Denmark — Hymite A/S, wafer-level packaging supplier, closed a round of series preferred B financing at 9 million euros. A European consortium proffered the investment.

Sigrity Enhances Electrical-analysis Software

Mon, 1 Jan 2007
(January 8, 2007) SANTA CLARA, CA — Sigrity, Inc., upgraded its PowerSI electrical analysis tool for IC packages and PCBs with a parallel/distributed computing feature.

WUS Closes Microelectronics Business

Tue, 1 Jan 2007
(January 9, 2007) TAIPEI, Taiwan — WUS Printed Circuit Co., Ltd., will shutter packaging-substrate supplier WUS Microelectronics Co., Ltd., due to long-term operating losses. The microelectronics unit was formed in 2000 from the company's tape automated bonding (TAB) and flexible printed circuits businesses.

MEPTEC optoelectronics update

Mon, 7 Jul 2002
MEPTEC held its second optoelectronics symposium in April. The symposium, entitled "The Opto-Mystic Industry," had a smaller crowd than last year's standing-room-only event.

Kyocera combines copper conductors and alumina ceramic

Mon, 7 Jul 2002
Kyocera Corp. has developed a new ceramic packaging technology that combines features of low-temperature co-fired ceramics (LTCC) with tradition alumina ceramics.

China update: K&S, Intel making progress

Mon, 7 Jul 2002
Intel has announced plans for a $100 million expansion of its Pentium 4 assembly and test facilities in Shanghai. It reported that work would be completed on the plant this year, as part of a $500 million investment in facilities in China

Novel processes at IMAPS Garden State symposium

Mon, 7 Jul 2002
The Garden State Chapter of the International Microelectronics and Packaging Society (IMAPS) held its Spring Packaging Symposium in May where companies provided the latest updates on their new advanced packaging technologies

Semicon West Products

Mon, 7 Jul 2002
For more information, circle the corresponding numbers on the reader service card and mail back. For faster results, fax the card to 413-637-4343, or visit www.onlinecenter.to/ap.

Think TANK

Mon, 7 Jul 2002
Tom bought black and white tiles, 12 x 12-inches each, to lay on his square patio deck. He planned to have a perfect square of black tiles in the center of the deck with a border of white tiles around it

Don't Forget the Equipment Engineers

Sun, 9 Sep 2002
Last month in this space I highlighted the importance of the material suppliers to the future of our industry. As if they had a preview copy of that, the equipment engineers ambushed me at SEMICON West with more brilliant developments than I have ever seen at a single event

"Manufacturing-less" IC companies

Sun, 9 Sep 2002
As consumer and computing applications increase in functionality, semiconductor components are becoming more complex to meet the technology requirements of these products

Movers and shakers

Sun, 9 Sep 2002
MRSI, A Newport Corp. Co., (North Billerica, Mass.) appointed Vincent Chin to applications engineer for the Asia Pacific region.

Auburn Offers Wireless Engineering Degree

Sun, 9 Sep 2002
AUBURN, ALA. - This fall, Auburn University's Samuel Ginn College of Engineering will launch the nation's first bachelor of wireless engineering degree program to provide students with the expertise needed for many related emerging technologies.

Palomar Creates Process Development, Prototyping Capability

Sun, 9 Sep 2002
VISTA, CALIF. - Palomar Technologies established a new service that provides design, engineering and prototyping for its customers

IBM Introduces New Technology, Collaborations

Sun, 9 Sep 2002
EAST FISHKILL, N.Y. - IBM announced its second-generation "surface laminar circuit" (SLC) flip chip packaging technology, as well as agreements with Amkor Technologies, ASAT Holdings Ltd. and Advanced Semiconductor Engineering Inc. to provide the technology for their customers.

NEXX Systems Joins SECAP

Sun, 9 Sep 2002
MUNICH - NEXX Systems, an advanced packaging equipment supplier, joined the Semiconductor Equipment Consortium for Advanced Packaging (SECAP)

SIA Releases Annual Global Semiconductor Sales Forecast

Thu, 11 Nov 2005
San Jose, Calif. — The Semiconductor Industry Association (SIA)'s forecast of global semiconductor sales this year projects a compound annual growth rate (CAGR) of nearly 10% for the 2005–2008 forecast period. The new forecast projects that worldwide sales of microchips will reach $309 billion in 2008 — a 45% increase from 2004's $213 billion record level.

New Copper IPD Process Suits RF Wireless Systems Miniaturization

Mon, 11 Nov 2005
Fremont, Calif., and Singapore — STATS ChipPAC Ltd. has qualified a copper process for integrated passive devices (IPDs) for miniaturization in RF wireless systems. Since the wireless market has to optimize size, performance, and cost, passive integration technology offers advantages for such applications as GSM/DCS and CDMA cell phones, Wireless LAN 802.11 a/b/g, and WiMax systems, primarily in RF power amplifiers and front-end modules (FEMs), which are a critical part of those systems.

Tessera's Senior VP and CFO Announces Retirement

Wed, 11 Nov 2005
San Jose, CA — Tessera Technologies' senior VP and CTO, R. Douglas Norby, has informed the company of his plans to retire, and will remain in his position until Tessera names a successor. A search for Norby's replacement is currently underway.

Cookson Nabs Patent for Stencil Software

Wed, 11 Nov 2005
Jersey City, NJ — The U.S. Patent Office awarded patent #6,938,227 B2 to Cookson Electronics Assembly Materials Group for its ALPHA DIMENSIONS stencil configuration, design, and ordering software, effective August 30, 2005.

October's Global Chip Sales Top $20B

Mon, 12 Dec 2005
San Jose, CA — Worldwide semiconductor sales beat $20 billion in October, a new industry feat, according to the Semiconductor Industry Association's (SIA) Global Sales Report (GSR), which is a 3-month moving average of sales activity. Worldwide semiconductor sales of $20.0 billion increased 6.75% from the $18.8 billion reported for October 2004. Sales were up 2.5% sequentially from the $19.6 billion reported for September.

LSI Logic's New Prototyping Platform Speeds SoC Development

Mon, 12 Dec 2005
Milpitas, CA — The RapidChip system-on-chip (SoC) prototyping platform is based on the ARM926EJ-S processor, and is now available from LSI Logic Corp. The new platform enables designers to emulate their cell-based ASIC or RapidChip Platform ASIC design before tape out, provides FPGA-based system verification, and enables earlier beginnings for software development.

ASAT Names New Senior VP of Worldwide Sales

Mon, 12 Dec 2005
Hong Kong and Pleasanton, CA — ASAT Holdings Limited and ASAT Inc. have appointed Alan Dworak as senior VP of worldwide sales, in which he will be in charge of all aspects of the company's global sales and customer service. Effective in his new position immediately, he will be based in the Singapore office.

Indium Grows Global Sales Team

Tue, 12 Dec 2005
Clinton, NY — Indium Corp. has recently promoted Tony Howard to global account manager — in this position, he is responsible for promoting Indium's products and services by focusing on several key global accounts. He reports to Dave Preische, global sales manager.

Dow Corning Wins Frost & Sullivan Award

Tue, 12 Dec 2005
Midland, MI — Dow Corning Corp. has been named Specialty Chemicals Company of the Year by global market analysts Frost & Sullivan, who highlighted Dow Corning's ability to drive innovation, its customer solutions approach, success in geographic expansion, and exceptional financial results.

IEEE Approves Standard for System-level Chip Design

Fri, 12 Dec 2005
Piscataway, NJ — The IEEE has approved a new electronic design standard for the SystemC 2.1 language, titled "Standard SystemC Language Reference Manual." The standard addresses the increasing complexity of system-on-chip (SoC) design at the systems level.

AMIS, Mentor Graphics Team Up in Mixed-signal TDK

Mon, 12 Dec 2005
Pocatello, ID — AMI Semiconductor (AMIS) and Mentor Graphics are partnering with the development of an analog/mixed-signal technology design kit (TDK) containing comprehensive and proven building blocks at the device level. This kit enables semiconductor companies and electronic systems manufacturers to kick off their design cycles on AMIS's foundry process using Mentor's analog/mixed-signal IC flow.

Speedprint Offers Novatec Tool to Enhance Printing Platform

Wed, 12 Dec 2005
DORSET, UNITED KINGDOM — Through an OEM supply agreement, Speedprint Technology Ltd., a division of Blakell Europlacer Group, will offer Novatec's VacuNest Shape Memory Tool solution on its printer platforms.

SIA says second half of 2003 ranks among strongest growth on record

Mon, 1 Jan 2004
(January 5, 2004) San Jose, Calif.—Worldwide sales of semiconductors rose to $16.13 billion in November 2003, a 4.5 percent increase from the $15.43 billion recorded in October, and a 25.7 percent rise from November of 2002, reports the Semiconductor Industry Association (SIA).

ChipPAC appoints Robert Lanzone as VP of global business development

Tue, 1 Jan 2004
(January 6, 2004) Fremont, Calif.—ChipPAC Inc. has announced the appointment of Robert Lanzone as vice president of Global Business Development. Lanzone will be responsible for worldwide sales and business development for ChipPAC.

Amkor completes acquisition of Toshiba assembly and test joint venture

Tue, 1 Jan 2004
(January 6, 2004) Chandler, Ariz.—Amkor Technology Inc. recently completed the acquisition of its semiconductor assembly and test joint venture with Toshiba by purchasing Toshiba's 40 percent interest in Amkor Iwate Co. Ltd. for around $14 million. The buyout is being executed according to the schedule agreed by Amkor and Toshiba when the original deal was signed three years ago.

Light-emitting transistor may revolutionize electronics industry

Tue, 1 Jan 2004
(January 6, 2004) Champaign, Ill.—Put the inventor of the light-emitting diode and the maker of the world's fastest transistor together in a research laboratory and what kinds of bright ideas might surface? One answer is a light-emitting transistor that could revolutionize the electronics industry.

Purdue engineers develop method to prototype microchips

Wed, 1 Jan 2004
(January 7, 2004) West Lafayette, Ind.—Purdue University researchers have developed a new method to quickly and inexpensively create microfluidic chips, analytic devices with potential applications in food safety, biosecurity, clinical diagnostics, pharmaceuticals and other industries.

ASAT announces proposed offering of notes

Thu, 1 Jan 2004
(January 8, 2004) Pleasanton, Calif.—ASAT Holdings Ltd. intends to offer, subject to market and other conditions, approximately $125 million aggregate principal amount of its Senior Notes due 2011, through an offering within the U.S. to qualified institutional buyers.

TI Revises Guidance as Inventory Issues Remain

Thu, 12 Dec 2004
(December 9, 2004) Manhasset, N.Y. — Texas Instruments (TI) says that it expects sales for the fourth quarter, ending in December, to top out at $3.02 to $3.14 billion, compared with a previous guidance of $2.96 to $3.20 billion. The company states that the market continues to undergo inventory adjustments, especially in standard products sold through distribution.

FlipChip International Announces Agreement to Acquire Assets of IC Services

Thu, 12 Dec 2004
(December 9, 2004) Phoenix, Ariz. — FlipChip International has announced an agreement to acquire substantially all of the assets of IC Services Inc. IC Services is a supplier of merchant semiconductor services, including substantial dicing, automated inspection, backgrinding, and tape-and-reel capabilities.

National Semiconductor Reports 18% Decline in Sales as Fab Utilization Falls

Fri, 12 Dec 2004
(December 10, 2004) San Jose, Calif. — Amid a huge drop in its fab utilization rates, National Semiconductor reports sales of $448.9 million for its second fiscal quarter, down 18% from $548 million in the previous quarter and a 5% decline from $473.5 million in the same period a year ago.

Amkor and PSi Sign Patent License Agreement

Mon, 12 Dec 2004
(December 13, 2004) Chandler, Ariz. & San Francisco, Calif. — Amkor Technology and PSi Technologies Holdings Inc. have signed a broad, multi-year patent license agreement that allows PSi to practice under Amkor's portfolio of micro-lead-frame patents, granting Amkor access to the intellectual property being developed by PSi related to its PowerQFN technology.

Fujitsu Names New Senior VP of Marketing and Sales

Tue, 12 Dec 2004
(December 14, 2004) Sunnyvale, Calif. — Keith Horn has been named senior VP of marketing and sales for Fujitsu Microelectronics America (FMA), with full responsibility for all FMA products and services, including packaging and foundry services. Horn moves to the new post from his position as FMA's VP of marketing. Ray Abrishami, who has served as senior director of SoC engineering, now also assumes responsibility for FMA's marketing organization, and reports to Horn.

FSA Announces Winners for 2004 Awards

Tue, 12 Dec 2004
(December 14, 2004) San Jose, Calif. — The Fabless Semiconductor Association (FSA), the voice of the global fabless business model, announced the winners for its 2004 awards, presented at the 10th annual FSA Awards Dinner Celebration on December 9, 2004, in Santa Clara, Calif.

Honeywell Confirms 2004 Earnings Per Share Guidance

Wed, 12 Dec 2004
(December 15, 2004) Morris Township, N.J. — Honeywell announces that it expects fourth-quarter 2004 earnings of $0.49 per share, which is at the high end of prior guidance, and full-year 2004 earnings per share of $1.68. The company expects 2004 cash flow from operations and free cash flow to reach approximately $2.3 billion and $1.6 billion, respectively.

MagnaChip closes $750M Offering of High-yield Notes

Tue, 12 Dec 2004
(December 28, 2004) New York, N.Y.—MagnaChip Semiconductor recently announced the successful sale of US$750 million of high-yield notes in a private offering. The company plans to use the proceeds from this offering to refinance existing indebtedness, redeem existing preferred equity interests of MagnaChip Semiconductor LLC, and for general corporate purposes

NIST's Chip Scale Magnetic Sensor Draws on Mini Clock Design

Wed, 12 Dec 2004
(December 29, 2004) Gaithersburg, Md.—A low-power, magnetic sensor about the size of a grain of rice that can detect magnetic field changes as small as 50 picoteslas — a million times weaker than the Earth's magnetic field — has been demonstrated by researchers at the National Institute of Standards and Technology (NIST).

Freescale Plans Inaugural Technology Forum for June 2005

Wed, 12 Dec 2004
(December 29, 2004) Austin, Texas — Freescale Semiconductor's inaugural Freescale Technology Forum is slated to be held June 20-23, 2005, in Orlando, Fla. This event combines elements of prior Freescale events, such as the Smart Networks Developer Forum and Embedded Connectivity Summit, offering technical education and hands-on training.

The 2002 Back-End Process: Step-by-Step

Mon, 1 Jan 2003
As a quick reference tool for Web site visitors, here's a compilation of articles from The Back-End Process Series: Step by Step from 2002. To read recent updates and new topics of this ever-popular series, click on our most recent issue of Advanced Packaging magazine.

NEW PRODUCT HIGHTLIGHTS

Mon, 1 Jan 2003
Wavetek Digital Multimeters
(January 14)

Machine Capability Product from Eagle-Eyed-One
(January 14)
Click here for these and more product briefs.

VLSI predicting 'blockbuster' growth in 2004

Mon, 1 Jan 2004
(January 12, 2004) Santa Clara, Calif.—For equipment manufacturers, VLSI Research is forecasting a price-led upturn in 2004, thanks to the strong likelihood that the equipment industry won't be able to respond fast enough to the sudden spike in demand.

Amkor achieves Sony's 'green partner' status

Tue, 1 Jan 2004
(January 13, 2004) Chandler, Ariz.—Amkor Technology Inc. has achieved 'green partner' status as part of a Sony Corp. program to ensure that consumer products and the components inside are environmentally friendly. The qualification covers all 10 Amkor facilities in Japan, Korea, Philippines, Taiwan and China.

UMC names Patrick Lin as chief SoC architect

Thu, 1 Jan 2004
(January 15, 2004) Sunnyvale, Calif.—UMC, a global semiconductor foundry, has appointed Patrick Lin as chief SOC architect to lead the company's System Architecture Support group. The creation of this new position, based at the company's Silicon Valley office, adds a unique dimension to foundry services by providing focused, targeted support for customers designing sophisticated SoCs on UMC's process technologies.

PSi enters supply agreement with Philips

Mon, 1 Jan 2004
(January 19, 2004) Hong Kong, China—PSi Technologies has signed a long-term supply agreement with Royal Philips Electronics to provide outsourced power semiconductor assembly and test services through PSi's facility in Chengdu, Sichuan Province, Peoples' Republic of China.

Advanced Switching V1.0 specification ratification complete

Tue, 1 Jan 2004
(January 20, 2004) Santa Clara, Calif.—The Advanced Switching (ASI-SIG) Interconnect Special Interest Group has completed the ratification of the AS V1.0 specification and has made it available to communications designers everywhere.

NIST researchers develop micro-oscillators

Tue, 1 Jan 2004
(January 20, 2004) Gaitherburg, Md.—A tiny, novel device for generating tunable microwave signals has been developed by researchers at the National Institute of Standards and Technology (NIST).

Profits and shares to improve, despite overall maturing of tech sector

Tue, 1 Jan 2004
(January 20, 2004) New York, N.Y.—Shares of companies in the semiconductor group overall have the potential to appreciate between 20 to 25 percent over the next 12 months, according to a Standard & Poor's Equity Research Services report on the semiconductor industry.

Kulicke & Soffa releases 1Q results

Wed, 1 Jan 2004
(January 21, 2004) Willow Grove, Penn.—Kulicke & Soffa's financial results for its first quarter of fiscal year 2004, ended December 31, 2003, show that revenue was $160.4 million for the chip assembly and test interconnect services provider—compared to revenue in the quarter ended December 2002 of $111.4 million.

Mentor Graphics releases 2004 outlook

Tue, 1 Jan 2004
(January 27, 2004) Wilsonville, Ore.—Mentor Graphics Corp., a provider of electronic hardware and software design services, has released its outlook for 2004. The company is expecting total revenue of $722 million; split $165 million in the first quarter; $170 million in each of the second and third quarters; and $217 million in the fourth.

2003 was a record year for Tessera

Wed, 1 Jan 2004
(January 28, 2004) San Jose, Calif.—Tessera Technologies Inc., a technology developer and services provider for semiconductor chip-scale and multichip packages, has announced financial results for the fourth quarter and year ended December 31, 2003.

Sandia, UNM researchers manipulate platinum at the nanoscale

Wed, 1 Jan 2004
(January 28, 2004) Albuquerque, N.M.—Researchers from the Department of Energy's Sandia National Laboratories and the University of New Mexico have developed a new way of mimicking photosynthetic proteins to manipulate platinum at the nanoscale. The method has the potential of changing the metal's properties and benefiting emerging technologies.

SI Technologies' CEO resigns

Thu, 1 Jan 2004
(January 29, 2004) Tustin, Calif.—SI Technologies Inc., which designs, manufactures and markets high-performance industrial sensors, weighing and factory automation equipment and systems, announced that Rick A. Beets has resigned as the company's president, CEO and CFO, effective January 28, 2004. Beets, who will retain his seat on the board of directors, has served as CEO of SI Technologies Inc. since August 1, 1993.

Kester, Feinfocus to co-host lead-free seminars

Fri, 1 Jan 2004
(January 30, 2004) Des Plaines, Ill.—Kester and Feinfocus are planning to co-host two non-commercial seminars focusing on lead-free technology. The first seminar is scheduled for Wednesday, February 4 from 9:00 a.m. to 4:30 p.m. in Dallas, Texas. The second seminar is Thursday, February 5 from 9:00 a.m. to 4:30 p.m. in Austin, Texas.

Worldwide semiconductor sales up 18.3% in 2003

Mon, 2 Feb 2004
(February 2, 2004) San Jose, Calif.—Worldwide sales of semiconductors rose to $166.4 billion in 2003, up 18.3 percent from the $140.8 billion in global revenue recorded in 2002, reports the Semiconductor Industry Association (SIA).

ChipPac completes qualification of single- and stacked-die CSPs and BGAs

Tue, 2 Feb 2004
(February 2, 2004) Fremont, Calif.—ChipPac Inc. has completed customer qualification of single- and stacked-die CSPs and BGAs for 90-nm silicon technology with copper and two types of low-k dielectrics — including an inorganic and an organic dielectric from two foundries.

'Nanoruler' makes fast work of gratings

Tue, 2 Feb 2004
(February 2, 2004) Cambridge, Mass.—An MIT device that makes the world's most precise rulers—with "ticks" only a few hundred billionths of a meter apart—may impact fields from the manufacture of computer chips to space physics.

ASE acquires NEC Electronics' packaging and testing operations

Tue, 2 Feb 2004
(February 3, 2004) Kawasaki, Japan and Taipei, Taiwan—NEC Electronics Corp. and ASE Inc. have announced a strategic partnership, including ASE's acquisition of NEC Electronics' IC packaging and testing operation in Takahata, Yamagata, combined with a 4-year service agreement for ASE to provide IC back-end manufacturing services to NEC Electronics.

Carsem completes construction of packaging facility in China

Wed, 2 Feb 2004
(February 4, 2004) Scotts Valley, Calif.—Carsem has completed construction of their Carsem-Suzhou Ltd. facility, located in the province of Jiangsu, 50 miles (80 km) west of Shanghai. The new factory is 172,000 sq. ft. and is located in the Suzhou Industrial Park.

FSA says fabless funding increased in 2003

Wed, 2 Feb 2004
(February 11, 2004) San Jose, Calif.—The Fabless Semiconductor Association (FSA) announced that the amount of funding raised by fabless companies increased sequentially 23 percent quarter-over-quarter (QoQ) in Q4 2003.

Amkor acquires Taiwan assembly and test facility

Fri, 2 Feb 2004
(February 13, 2004) Chandler, Ariz.—Amkor Technology Inc. has entered into an asset purchase agreement to acquire a 354,000-sq.-ft. assembly and test facility in Taiwan's Hsinchu Industrial Park from FICTA Technology Inc. This acquisition more than doubles Amkor's potential manufacturing footprint in Taiwan.

SEMI posts January book-to-bill ratio of 1.18

Fri, 2 Feb 2004
(February 20, 2004) San Jose, Calif.—North American-based manufacturers of semiconductor equipment posted $1.22 billion in orders in January 2004, according to SEMI, and a book-to-bill ratio of 1.18.

Toshiba's newest fab gears up for SoC LSI production this fall

Mon, 3 Mar 2004
(March 01, 2004) Tokyo, Japan—Toshiba Corp. recently completed construction of a 300-mm wafer fab at its Oita Operations in Kyushu, Japan. Toshiba plans to begin mass producing high-performance system-on-chip (SoC) LSIs this fall, with an initial capacity of 12,500 wafers per month.

Wafers growing, but will profits?

Mon, 3 Mar 2004
(March 01, 2004) Phoenix, Ariz.—A new study from Semico Research, 'Wafer Demand 2004-2008: Wafers Growing But Will Profits?,' addresses the key questions of will there be enough capacity to fulfill the growth in demand next year, and can we make enough profit during this upswing to carry us through the next downturn?

SIA numbers show January sales down 3% from December

Mon, 3 Mar 2004
(March 01, 2004) San Jose, Calif.—Worldwide sales of semiconductors rose 26.6 percent year-over-year to $15.5 billion in January 2004, from the $12.28 billion recorded in January 2003. Sales also recorded a typical month-over-month decrease in January 2004 of 3 percent from December 2003, the Semiconductor Industry Association (SIA) reported today.

IPAC, Twin Advance launch joint venture company

Fri, 3 Mar 2004
(March 05, 2004) San Jose, Calif.—A joint venture between California-based Integrated Packaging Assembly Corp. (IPAC) and Twin Advance of Penang, Malaysia is launching a new company called IPAC Twin Advance that will offer advanced module and system-in-package (SiP) development and manufacturing services.

High-performance, single-crystal plastic transistors reveal hidden behavior

Thu, 3 Mar 2004
(March 11, 2004) Champaign, Ill.—Printing circuits on sheets of plastic may offer a low-cost technique for manufacturing thin-film transistors for flexible displays, but maximizing the performance of such devices will require a detailed, fundamental understanding of how charge flows through organic semiconductors.

FROM THE EDITOR

Tue, 10 Oct 2004
(October 19, 2004) Nashua, N.H.—Advanced Packaging Magazine invites you to share your thoughts in our rapidly approaching January 2005 State-of- the-Industry issue. As a leader in the industry, your participation is important to us.

DAFCA receives $1.9 million Advanced Technology Program grant to develop reconfigurable infrastructure platform for SoCs

Fri, 10 Oct 2004
(October 1, 2004) Framingham, Mass.—DAFCA Inc. announces that the company has been awarded an Advanced Technology Program (ATP) grant totaling $1.9 million from the National Institute of Standards and Technology (NIST).

FlipChip International receives ISO 9001-2000 certification

Mon, 10 Oct 2004
(October 4, 2004) Phoenix, Ariz.—FlipChip International (FCI) announced the successful ISO 9001-2000 certification of its Phoenix, Arizona semiconductor wafer bumping and wafer-level packaging business. ISO is an internationally recognized accreditation organization focused on world-class quality management systems. FCI's certification process was administered by SGS Systems and Services.

Indium Corporation Opens China Facility

Wed, 10 Oct 2004
(October 6, 2004) Clinton, N.Y.—Indium Corporation of America announced the opening of their newest facility. Located in the Suzhou Industrial Park in Jiangsu, China, the facility houses solder-paste manufacturing and quality operations as well as fully integrated sales and technical support teams. This new facility offers prompt responses to customer needs to ensure world-class service throughout China.

Kester, Metcal, BTU International, and STI Will Present Upcoming Lead-free Assembly Seminar

Tue, 10 Oct 2004
(October 12, 2004) Des Plaines, Ill.—Kester, Metcal, BTU International, and Soldering Technology Inc. (STI) will present a series of Lead-free Technology Seminars scheduled to take place throughout 2004. The next seminar will take place Tuesday, November 9 through Wednesday, November 10, 2004, in Atlanta, Ga.

FlipChip International Opens Reliability & Design Center

Wed, 10 Oct 2004
(October 13, 2004) Phoenix, Ariz.—FlipChip International (FCI) announces the opening of a Reliability & Design Center for wafer level packaging (WLP) and flip chip bumping technologies within its Phoenix, Ariz. facility.

Amkor Discloses Informal SEC Inquiry

Wed, 10 Oct 2004
(October 13, 2004) Chandler, Ariz.—Amkor Technology announces that the Securities and Exchange Commission (SEC) is conducting an informal inquiry into trading in the securities of Amkor.

Amkor Technology Announces Intent to Enter $300 Million Term Loan

Thu, 10 Oct 2004
(October 14, 2004) Chandler, Ariz.—Amkor Technology announces that it has begun discussions with a group of institutional lenders concerning entering into a credit facility for a $300 million term loan.

Research and Markets Announces Regulations Impacting Green Labelling

Thu, 10 Oct 2004
(October 14, 2004) Dublin, Ireland—Research and Markets has announced the addition of Green Labelling: Global Guide for Marketers in the New Millennium to their offering.

WEEE services introduced by Ageus Solutions

Fri, 10 Oct 2004
(October 15, 2004) Ottawa, Ontario, Canada—Ageus Solutions announces the launch of a complete, end-to-end WEEE compliance package. Ageus is now ready to provide full-service logistical, operational, financial, and engineering solutions for issues related to WEEE fulfillment.

MW Associates Announces Lead-free Series of Seminars in China

Mon, 10 Oct 2004
(October 18, 2004) Naples, Fla.—Megan Wendling, president of MW Associates, has recognized a need within the electronics industry, and has introduced of a series of lead-free seminars to be held throughout China in 2004 and 2005.

STATS CHIPPAC solicits consents from holders of ChipPAC notes

Mon, 10 Oct 2004
(October 18, 2004) Singapore and Fremont, Calif.—STATS ChipPAC announces that its wholly owned subsidiary ChipPAC Inc. is soliciting consents from holders of ChipPAC's 2.5% Convertible Subordinated Notes due 2008 to amend certain provisions of the indenture pursuant to which the Notes were issued. The consent solicitation will expire at 5:00 pm, New York City time, on Monday, November 1, 2004, unless extended by ChipPAC.

KIC Forms Partnership with Tamura Corporation

Tue, 10 Oct 2004
(October 19, 2004) San Diego, Calif.—Tamura H.A. has established a partnership with KIC. This cooperation enables Tamura H.A. to sell KIC products together with its lead-free-ready reflow ovens and wave solder machines.

Amkor Completes Discussions for $300 Million Term Loan

Wed, 10 Oct 2004
(October 20, 2004) Chandler, Ariz.—Amkor Technology Inc. announces that it has completed discussions with a group of institutional lenders concerning a new $300 million term loan credit facility, and has allocated all $300 million to the lenders.

Motorola Reports Strong Sales

Wed, 10 Oct 2004
(October 20, 2004) Manhasset, N.Y.—Motorola Inc., located in Schaumburg, Ill., reported sales of $8.624 billion in the third quarter, up 26% from $6.829 billion a year ago, as revenue improved in all the company's operating sectors.

Carsem Ships One Billion MLPs

Thu, 10 Oct 2004
(October 21, 2004) Scotts Valley, Calif.—Carsem, a provider of turnkey packaging and test services to the semiconductor industry, announces that they have recently shipped their one billionth micro leadframe package (MLP).

Tessera Technologies Announces Third Quarter 2004 Results

Thu, 10 Oct 2004
(October 21, 2004) San Jose, Calif.—Tessera Technologies Inc. announces financial results for the quarter and the nine-month period that ended September 30, 2004.

HP, Dell, and IBM Release Electronics Industry Code of Conduct

Fri, 10 Oct 2004
(October 22, 2004) Palo Alto, Calif., Round Rock, Texas, & Armonk, N.Y.—HP, Dell, and IBM release an Electronics Industry Code of Conduct to promote industry standards for socially responsible business practices across their global supply chains.

Plastronics and RTI Announce Failure Analysis Sockets for QFN

Mon, 10 Oct 2004
(October 25, 2004) Irving, Texas—Plastronics Socket Company and Robson Technologies Inc. (RTI) have entered into a technology partnership and distributor agreement to manufacture and sell failure analysis QFN sockets.

Packaging researchers help design all-electric warship

Mon, 10 Oct 2004
(October 25, 2004) Buffalo, N.Y.— A University at Buffalo packaging researcher is helping the U.S. Navy develop a next generation all-electric warship that will revolutionize the Navy's use of weaponry and manpower.

Indium Corp. Division Awarded ISO-9001:2000 Certification

Tue, 10 Oct 2004
(October 26, 2004) Clinton, N.Y.—Indium Corp. of America's Germanium Chemicals Division has passed its ISO-9001:2000 certification audit. This means that Germanium will be included within the scope of Indium's U.S. ISO-9001:2000 certification.

Amkor Reports Third Quarter 2004 Results

Wed, 10 Oct 2004
(October 27, 2004) Chandler, Ariz.—Amkor reports third-quarter sales of $491 million, essentially flat with the second quarter of 2004 and up 16% over the third quarter of 2003.

Virginia Tech teaches students that design verification is critical

Thu, 10 Oct 2004
(October 28, 2004) Blacksburg, Va.—To the average American, the importance of designing semiconductors rests in the hands of the electrical engineer. But when one considers that semiconductors are integral parts of everything from video games to diagnostic medical equipment to security devices, the demand for flawless design is universal.

Key component for photonic chips

Thu, 10 Oct 2004
(October 28, 2004) Itaca, N.Y.—Cornell University researchers have demonstrated a device that allows one low-powered beam of light to switch another on and off on silicon, a key component for future "photonic" microchips in which light replaces electrons.

Virginia Tech teaches students that verifying design is critical

Thu, 10 Oct 2004
(October 28, 2004) Blacksburg, Va.—To the average American, the importance of designing semiconductors rests in the hands of the electrical engineer. But when one considers that semiconductors are integral parts of everything from video games to diagnostic medical equipment to security devices, the demand for flawless design is universal.

DPC Presents Award to Die Products Standards Expert

Thu, 10 Oct 2004
(October 28, 2004) Austin, Texas—Recently at the 11th Annual KGD Packaging & Test Workshop in Napa, Calif., the Die Products Consortium (DPC) presented the Industry Achievement Award to Jim Wolbert of Chip Supply Inc. for his leadership in developing international standards for semiconductor die products. The DPC presents the award annually to an individual for exemplary contributions to enlarging the world-wide markets for die products.

Siliconware Precision Industries Reports Q3 2004 Results

Thu, 10 Oct 2004
(October 29, 2004) Taichung, Taiwan—Siliconware Precision Industries Co. Ltd. (SPIL) announces that its sales revenues for Q3 2004 were $8,946 million, representing a 2.7% increase QoQ and a 24.2% increase compared to the same period in 2003.

ASE Reports Consolidated 2004 Q3 Financials

Mon, 11 Nov 2004
(November 1, 2004) Taipei, Taiwan—Advanced Semiconductor Engineering Inc. (ASE) reports unaudited consolidated net revenues of $22,023 million for Q3 2004, up 52% year-over-year and up 9% sequentially. Net income for the quarter totaled $1,960 million, up 236% year-over-year and down 3% sequentially. EPS for the quarter was $0.49, or $0.069, per ADS, up 227% year-over-year and flat sequentially. ASE's Q3 revenue marks the highest quarterly revenue level in the Company's history.

Innovation & Collaboration: The Magic Potion for Success in 2005

Mon, 11 Nov 2004
(November 1, 2004) Mountain View, Calif. — 2004 has been a strong growth year for the semiconductor industry; however, a new round of uncertainty has surfaced as the industry enters the fourth quarter. That's why it's more important than ever for semiconductor companies to find the right potion for that magical production win. Many people in the industry today feel that innovative new products and collaboration between links in the supply chain are the best way to achieve this.

Global Chip Sales Rise Slightly in September to $18.4 Billion

Tue, 11 Nov 2004
(November 2, 2004) San Jose, Calif.—Global semiconductor sales rose to $18.4 billion in September 2004, a sequential increase of 1% from the $18.2 billion sales in August 2004, the Semiconductor Industry Association (SIA) reports.

SEMI book-to-bill ratio rises, hits 1.14 in April

Thu, 5 May 2004
(May 20, 2004) San Jose, Calif.—North American-based manufacturers of semiconductor equipment posted $1.59 billion in orders in April 2004 (three-month average basis) and a book-to-bill ratio of 1.14, according to the April 2004 Express Report published today by SEMI. A book-to-bill of 1.14 means that $114 worth of new orders were received for every $100 of product billed for the month.

Challenges ahead for 3-D CSP suppliers

Wed, 5 May 2004
(May 27, 2004) Natick, Mass.—A number of 3-D chip scale packaging studies conducted by VDC, a technology market research and consulting firm, indicate that 3-D chip scale packaging solutions will play an increasingly vital role in meeting performance and size requirements for future generations of mobile electronics.

Newport to buy Spectra-Physics for $300M

Tue, 6 Jun 2004
(June 1, 2004) Irvine, Calif.—Newport Corp. has signed a definitive agreement with Thermo Electron Corp. to purchase Spectra-Physics for $300 million, subject to a post-closing net asset adjustment. Spectra-Physics represents substantially all of the optical technologies business of Thermo Electron.

ASE completes acquisition of NEC packaging and test plant

Wed, 6 Jun 2004
(June 2, 2004) Taipei, Taiwan—Advanced Semiconductor Engineering Inc. (ASE), the world's largest independent provider of semiconductor packaging and testing services, has completed the acquisition of packaging and testing operation in Takahata, Yamagata from NEC Electronics Corp.

TI appoints Julie England as general manager of its RFID Systems Group

Tue, 6 Jun 2004
(June 8, 2004) Dallas, Texas—Julie England has been named general manager of Texas Instruments' radio frequency identification (RFID) Systems group, a business unit of Texas Instruments Sensors & Controls Division. Previously, she was a general manager of TI's Sun business within the Semiconductor group and has been a TI vice president since 1994.

Allan Calamoneri named VP of Carsem's Test Business Development

Tue, 6 Jun 2004
(June 8, 2004) Scotts Valley, Calif.—Carsem, a provider of turnkey packaging and test services, announced that Allan Calamoneri has joined the company as the new vice president of its Test Business Development.

Revised SIA forecast for '04 may hurt semi equipment sales

Fri, 6 Jun 2004
(June 11, 2004) New Tripoli, Pa.—The SIA forecast that revised semiconductor growth from 19% and 6% growth in '04 and '05, respectively, to 29% and 4%, should negatively impact equipment sales for 2004, according to a report recently published by The Information Network, a New Tripoli, Pa.-based market research company.

Honeywell Announces Price Increase for Electronic Chemicals Products

Mon, 6 Jun 2004
(June 16, 2004) Sunnyvale, Calif. — Honeywell announces that the company will be implementing price increases between 4 to 14 percent for part of its Electronic Chemicals product line.

FSA to host test, assembly and packaging suppliers forum

Tue, 6 Jun 2004
(June 22, 2004) San Jose, Calif.—The Fabless Semiconductor Association (FSA) will host a forum featuring semiconductor test, assembly and packaging companies on Tuesday, June 29, 2004, from 8:30 a.m. to 2:15 p.m. at the Santa Clara Convention Center in Santa Clara, Calif.

SEMATECH identifies technical challenges for 2005

Thu, 6 Jun 2004
(June 24, 2004) Austin, TX—International SEMATECH recently released its Top Technical Challenges for 2005, re-emphasizing advanced gate stack, 193-nm immersion and EUV lithography, and low-k dielectrics, and placing 3-D interconnect on the list for the first time.

In-process Warpage Technology

Mon, 6 Jun 2004
AkroMetrix, an advanced thermo-mechanical characterization of substrates and packages provider, introduces TherMoire, in-process warpage measurement and analysis technology that enables real-time data acquisition during dynamic temperature profiling.

Advanced materials industry veteran joins NanoDynamics

Wed, 6 Jun 2004
(Business Wire, June 28, 2004) Buffalo, N.Y.—NanoDynamics, Inc., a manufacturer of nanomaterials, today announced that Dr. Alan Rae has joined the company as vice president of market and business development. In this role, Dr. Rae will manage the ND innovations strategic business unit and will be responsible for developing business opportunities for commercial products.

NEW PRODUCT

Tue, 6 Jun 2004
Semiconductor supply chain tracking system
(June 29, 2004—Sunnyvale, Calif.)
A leading custom chip supplier announced that the United States Patent and Trademark Office has awarded it a patent for its new eSilicon Access work-in-progress (WIP) tracking system.

Emerging nanofilms will represent 39% of total thin films market by 2008, study says

Thu, 7 Jul 2004
(July 1, 2004) Norwalk, Conn.—A soon-to-be-released report published by Business Communications Company, Inc. projects the value of emerging nanofilms will be $196.5 million by 2006 and grow at a 22% average annual growth rate to reach $292.6 million by 2008. Established and emerging nanofilms will represent 39% of total thin film materials by 2008.

Newport Corporation acquires Spectra-Physics

Tue, 7 Jul 2004
(July 16, 2004) Irvine, Calif.—Newport Corporation completed today its acquisition of Spectra-Physics for $300 million. The final price is subject to a post-closing net asset adjustment.

Imagers beating out traditional laser scanners, research shows

Tue, 7 Jul 2004
(July 20, 2004) Natick, Mass.—A new report released by the Venture Development Corporation, an independent technology market research firm, estimates that the global market for hand-held bar code scanners will reach nearly $974 million by the end of 2008.

Americans hold favorable view of nanotechnology, survey shows

Mon, 7 Jul 2004
(SAN JOSE BUSINESS JOURNAL, July 26, 2004) Raleigh, N.C.—Americans generally view nanotechnology in a positive light, although they admittedly know little to nothing about this emerging science, according to a recent survey conducted by North Carolina State University researchers.

IMAPs names new executive director

Tue, 7 Jul 2004
(July 26, 2004) Washington, D.C.—IMAPs has chosen Michael O'Donoghue to replace Richard M. Breck as its executive director, effective September 1, 2004.

Asyst CFO to step down

Wed, 7 Jul 2004
(ELECTRONIC NEWS, July 28, 2004) Fremont, Calif.—Asyst Technologies Inc., supplier of semiconductor manufacturing equipment, announced that its vice president and CFO David White will step down. The company states that the move is not in response to Asyst's lower-than-forecasted revenues for the first quarter (Q1) of 2004.

Andigilog welcomes new vice president of engineering

Thu, 7 Jul 2004
(BUSINESS WIRE, July 29, 2004) Chandler, Ariz.—Andigilog, a fabless analog and mixed-signal semiconductor provider, announced today that Dr. David Cave has joined the company as its vice president of engineering. Cave, a 35-year veteran of the analog and mixed-signal semiconductor industry, spent 33 years at Motorola, most recently as vice president and director of Motorola Semiconductor Research Europe, where he directed research in China, Western Europe and the former Soviet Union.

Shenzhen Kaifa enters joint venture with three U.S. companies

Fri, 7 Jul 2004
(INTERFAX INFORMATION SERVICES, B.V., July 30, 2004) Beijing, China—The Shenzhen Kaifa Technology Company won 100% of all votes at a shareholders' meeting to decide on the establishment of a semiconductor joint venture in Shenzhen. The whole investment of the joint venture will be $280 million, with Shenzhen Kaifa as the largest shareholder.

SEMI VP receives honor for contributions to 'High Tech U'

Thu, 7 Jul 2004
(July 29, 2004) San Jose, Calif.—SEMI's vice president of workforce development, Lisa Anderson, received the Maricopa Advanced Technology Education Center (MATEC) Industry Recognition Award for her contributions to SEMI's High Tech U programs. The award recognizes key industry personnel for promoting high-tech education and career awareness. It was presented at the annual Semiconductors, Automated Manufacturing and Electronics - Training and Education Conference in San Jose.

Analysts concerned by chip inventory buildup

Tue, 8 Aug 2004
(August 3, 2004) El Segundo, Calif.—Two research firms have expressed concerns about swelling chip inventories and their potential impact on prices in the second half of the year However, Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), the world's largest foundry, said last week that the situation is not uniform throughout the industry and market demand is healthy.

STATS shareholders vote to approve ChipPAC merger

Wed, 8 Aug 2004
(August 4, 2004) Singapore—ST Assembly Test Services Ltd. (STATS) announced today that all of the shareholder resolutions proposed by STATS at its general meeting of shareholders held on August 4, 2004 were approved by STATS shareholders, including the resolutions related to the merger with ChipPAC, Inc.

ATS receives $10.7 million in orders from one of the world's largest medical device companies

Thu, 8 Aug 2004
(August 5, 2004) Cambridge, Ontario—ATS Automation Tooling Systems Inc. announced it has received a total of US $10.7 million in orders from one of the world's largest manufacturers of self-use medical diagnostic systems. This brings the value of orders for automation systems ATS has won over the past year from this particular customer to more than US $21 million.

Freescale Semiconductor wins 'First-Year Global Supplier' award

Thu, 8 Aug 2004
(August 5, 2004) Austin, Texas—Freescale Semiconductor, Inc. won a First-Year Partners in Performance award by Celestica, a leading electronics manufacturing services provider, for its contribution to the company in 2003.

It's official: STATS and ChipPAC complete merger

Thu, 8 Aug 2004
(August 5, 2004) Singapore—ST Assembly Test Services Ltd. and ChipPAC Inc. announced today the successful completion of their previously announced merger. As a result of the merger, the name of the new company is STATS ChipPAC Ltd. ChipPAC will continue operations as a wholly owned subsidiary of STATS ChipPAC Ltd.

New process prints silicon on plastic

Mon, 8 Aug 2004
(August 9, 2004) Urbana, Ill.—Many research groups today work to improve the electrical capabilities of organic, or plastic, materials. But researchers from the University of Illinois at Urbana-Champaign are finding ways to produce extremely small electrical components from crystalline silicon that can be attached to a plastic backing.

STATS ChipPAC Malaysia predicts 20-30% rise in revenue

Wed, 8 Aug 2004
(August 11, 2004) Kuala Lumpur, Malaysia—STATS ChipPAC Malaysia, a semiconductor test and assembly company, expects revenue to increase between 30 and 40% this year, after having invested an additional RM200 million to its support expansion and technological enhancements. The company's president and managing director, J.A. Lew, says the expansion involved upgrading the plant in terms of capacity, infrastructure and installing state-of-the-art equipment.

Global chip equipment sales rise 46.2%

Thu, 8 Aug 2004
(August 11, 2004) Tokyo, Japan—Global sales of chip-making equipment rose 46.2 percent in June compared with May to $3.75 billion, helped by a sharp rise in sales in Taiwan and China, the Semiconductor Equipment Association of Japan reported Wednesday. The June figure was up 106.7 percent from a year earlier, marking it the eleventh straight month of year-on-year rises.

Nanotech research spending to reach $8.6 billion, report says

Wed, 8 Aug 2004
(August 18, 2004) San Francisco, Calif.—Money spent worldwide on research and development in the nanotechnology field should rise about 10 percent in 2004 to $8.6 billion, according to a report released by Lux Research Inc., a New York-based research and consulting firm.

IPC launches lead-free website

Wed, 8 Aug 2004
(August 18, 2004) Northbrook, Ill.—IPC recently launched a website for lead-free information and trends: http://leadfree.ipc.org.

ChipMOS earnings and sales exceed forecast

Thu, 8 Aug 2004
(August 19, 2004) New York, N.Y.—The stock of ChipMOS Technologies Ltd., a semiconductor packing and testing company, rose Wednesday after it reported earnings and sales that exceeded its forecast.

Nvidia postpones delivery of 20K processed uncut wafers

Mon, 8 Aug 2004
(August 23, 2004) Santa Clara, Calif.—Nvidia postponed the delivery of about 20,000 processed uncut wafers from Taiwan Semiconductor Manufacturing Company (TSMC) to avoid further buildup of its entry-level graphics chips inventory. Instead of being delivered to testing and packaging companies for back-end processing, the wafers will remain at TSMC's warehouse.

FlipChip International successfully demonstrates 95 micron pitch bumping technology

Tue, 8 Aug 2004
(August 24, 2004) Phoenix, Ariz.—FlipChip International today announced its successful demonstration of 95 micron pitch bumping technology for advanced semiconductor devices at its laboratory in Phoenix, Arizona. FlipChip International has ongoing research and development projects in sub-100 micron bumping technologies as part of its extensive bumping and wafer level packaging roadmap.

ASAT Appoints VP of Worldwide Customer Quality

Thu, 9 Sep 2005
Hong Kong and Pleasanton, Calif. — ASAT Holdings Limited and ASAT Inc. has appointed Kenneth Sicz as VP of worldwide customer quality. Sicz will be located in Hong Kong and will report to Robert Gange, president and CEO. With more than 30 years of quality assurance, operations, and marketing experience in the semiconductor industry, Sicz most recently worked in director-level positions at ChipPAC, where he was in charge of worldwide procurement and quality and reliability assurance.

Carsem Names General Manager for S-Site Factory

Tue, 9 Sep 2005
Scotts Valley, Calif. — Carsem announces that M.H. Toh recently joined as Carsem's S-Site factory's general manager. He reports to S.W. Woo, Carsem's COO, and succeeds Alex Khor, who retired in June 2005. Toh has over 25 years of experience in the semiconductor industry with a background in both assembly and test operations, so he has held various management positions in production, quality assurance, and process engineering.

Conformal Coating Workshops Make Their Way to Canada

Wed, 9 Sep 2005
Carlsbad, Calif. — Asymtek, Dow Corning, Dymax, EMI, and Humiseal collectively will offer conformal coating workshops in Montreal and Toronto, Canada on October 11 and 13, 2005, respectively. Each one-day training program will teach attendees about the various types of available coatings, including silicone, acrylics, urethanes, UV-curable coatings, and adhesives. The most recent automated equipment options for mask-free conformal coating will also be covered.

Upcoming MEPTEC Symposium Targets Packaging Roadmaps

Tue, 9 Sep 2005
Mountain View, Calif. — MEPTEC's next one-day technical symposium is titled "Roadmaps for the Next Generation of Semiconductor Packaging," and will be held on November 17, 2005 in San Jose, Calif. Presentations from such product/device sectors as ASIC/PLD, analog, memory, graphics, microprocessor, and FPGA will discuss their companies' future horizons in device applications, and what some of the critical technology or market roadblocks may be in reaching those goals.

Honeywell Steps Up Titanium Sponge Production

Fri, 9 Sep 2005
Tempe, Ariz. — Honeywell Electronic Materials is increasing production of titanium sponge to meet global demand for the material, which is the basic form of titanium. Since Honeywell produces titanium sponge for its own production of materials and products for the semiconductor industry, they have begun selling sponge externally to meet growing demand and plans to increase the amount available.

Freescale Names New VP/CIO

Fri, 9 Sep 2005
Austin, Texas — Freescale Semiconductor has appointed Sam Coursen as its new VP and CIO, overseeing Freescale's strategic, operational, and financial information technology (IT) infrastructure.

FSA Suppliers Expo/Conference '05 Hits on Association Initiatives

Fri, 9 Sep 2005
San Jose, Calif. — The Fabless Semiconductor Association (FSA) will host the FSA Annual Briefing during the 2005 FSA Suppliers Expo and Conference, to be held October 5–6, 2005, at the San Jose McEnery Convention Center in San Jose. The briefing will discuss the latest updates on FSA resources, tools, and initiatives, and will take place on October 5th from 4:00 – 5:00 p.m., and on October 6th from 8:00 – 9:00 a.m.

Speedline Receives Patent for Bridge Detection Method

Fri, 10 Oct 2005
Franklin, Mass. — Speedline Technologies has received U.S. Patent #6,891,967 for its MPM BridgeVision inspection method. Awarded for its innovative analysis technique used to quantify both the amount and geometry of solder paste between printed deposits, the technique uses the solder paste's texture to identify its position relative to the smooth pad and solder mask. This method shows the difference between the gray solder paste and the dark solder mask.

Keithley Opens New Asia Offices, Expands Singapore Office

Mon, 10 Oct 2005
Cleveland, Ohio — Keithley Instruments, Inc. is expanding its existing office in Singapore and opening two new offices in Malaysia for direct sales and support of its electrical test and measurement solutions, both significantly expanding its business presence in southeast Asia.

IPC/JEDEC Lead-free Conference to Target Components, Assemblies

Mon, 10 Oct 2005
Bannockburn, Ill. — IPC–Association Connecting Electronics Industries and JEDEC will host the 11th International Conference on Lead-free Electronic Components and Assemblies on December 6–8, 2005, in Boston. To help prepare for such issues as new alloys and materials evaluations, inspection changes, tin whiskers, reliability, and increased assembly costs, top experts will come together to deliver an educational program and technical conference.

New Wire-bonding Process for High-temp Applications Available

Tue, 10 Oct 2005
Colorado Springs, Colo. — IC Interconnect (ICI) has qualified its Ni/Au pad resurfacing process for high-temperature wire-bond applications, producing bonds that are stable at high temperatures with a thinner gold layer, particularly useful in avionics and automotive applications. This new process eliminates Kirkendall voiding that occurs in an Al/Au interface at 200°C thermal exposures.

KIC Announces Homepage Redesign

Wed, 10 Oct 2005
San Diego, Calif. — KIC has redesigned its website's homepage to provide a straightforward layout where visitors can learn about KIC's solutions. The redesign aims to aid the transition to lead-free production and includes such lead-free highlights as KIC's Lead-free Seminar Series and the KIC Advantage, which provides an overview of KIC and its technologies.

JPSA, BOET Form China Distribution and Service Partnership

Mon, 10 Oct 2005
Hollis, N.H. — J P Sercel Associates (JPSA) and Beijing Opto-Electronics Technology Co. Ltd. (BOET) have entered into an agreement, in which BOET will sell and service JPSA laser systems in China, including the IX-300 ChromaDice UV laser system for semiconductor wafer processing (scribing and dicing in production volumes).

AIM Adds Personnel for Mexico Technical Applications Support

Tue, 10 Oct 2005
Cd. Juarez, Mexico — AIM has appointed Carlos Tafoya as its new Technical Applications Manager – Mexico, where he will be based out of AIM's Cd. Juarez, Mexico-based production facility. He will be responsible for providing technical applications support to the customers of AIM's full line of electronic solders and chemicals throughout Mexico.

TSMC Becomes Core Partner in IMEC Research Program

Thu, 10 Oct 2005
Leuven, Belgium — Taiwan Semiconductor Manufacturing Co. has agreed to become a core partner in IMEC's sub-45-nm CMOS research program. With TSMC joining this core program, eight IC manufacturers — Infineon, Intel, Matsushita/Panasonic, Philips, Samsung, STMicroelectronics, Texas Instruments, and TSMC — now collaborate in IMEC's 300-mm research facilities to conquer the ITRS challenges.

RSVI Appoints New President

Fri, 10 Oct 2005
Hauppauge, N.Y. — RVSI Inspection LLC has recently appointed Kevin Maddy as its new president, where he will be responsible for managing products and applications sales that meet and exceed the demands of the global industry, while cultivating customer relationships. With his 25 years of manufacturing experience, he spent the past 14 years as a general management executive with P&L responsibility, specializing in turnaround management, organizational reengineering, and lean manufacturing.

September's Global Semiconductor Sales Rise 5.2%

Mon, 10 Oct 2005
San Jose, Calif. — Worldwide semiconductor sales increased to $19.6 billion in September, a 5.2% increase from the $18.6 billion reported in August, reports the Semiconductor Industry Association (SIA).

COMET Names New Sales and Marketing Manager for FEINFOCUS

Tue, 11 Nov 2005
Garbsen, Germany — COMET, who supplies FEINFOCUS X-ray inspection systems, has appointed Axel Bermeitinger as sales and marketing manager for the FEINFOCUS Business Unit. Bermeitinger has an extensive sales and marketing background in such industries as materials, electronics, and medical devices. Previously, he held management positions at a specialty laser application machines supplier and a Swiss Holderbank AG subsidiary.

WELLS-CTI Launches Socket Family for Programmable ICs

Fri, 11 Nov 2005
Phoenix, Ariz. — Burn-in sockets supplier WELLS-CTI has developed a high-performance, high-cycle-life programming socket family — designated the 780 Series — aiming to increase customer yields. Ideal for volume production, this socket offering accommodates CSP and fBGA packages, and accepts both lead-free and eutectic solder balls.

Freescale Enters European R&D Program

Fri, 7 Jul 2005
(July 1, 2005) Austin, Texas — Freescale Semiconductor has recently joined NANOCMOS, an integrated project funded by the European Commission's Information Society Technologies Program that breaks new ground in materials, processes, device architectures, and interconnections to push performance and density limits of semiconductors. Freescale's participation was approved by the project partners during the NANOCMOS general assembly, and was validated by the European Commission.

May's Global Semiconductor Sales Drop 0.5%

Tue, 7 Jul 2005
(July 5, 2005) San Jose, Calif. — Worldwide semiconductor sales declined slightly in May to $18.05 billion, a 0.5% sequential decline from April's $18.14 billion, the Semiconductor Industry Association (SIA) reports. However, May sales were up 4.1% from the $17.34 billion reported in May 2004.

August Installs 500th Automated Inspection System

Fri, 7 Jul 2005
(July 8, 2005) Minneapolis, Minn. — August Technology Corp. has installed its 500th NSX Series automated defect inspection system. First introduced in 1997, the NSX Series detects defects greater than 0.5 µm, and also performs advanced macro inspection.

Entegris Opens New Taiwan Service Center

Mon, 7 Jul 2005
(July 11, 2005) Chaska, Minn. — Effective July 11, Entegris Inc. is opening a new regional service center in Chin-Yu, Taiwan. The facility's business includes sub-micron cleaning, logistics, and product repair to support semiconductor, data storage, and flat-panel display customers. The new Chin-Yu service center is located a few miles north of Entegris' administrative/sales office in Hsinchu.

Honeywell Expands Asia-Pacific Materials Manufacturing

Tue, 7 Jul 2005
(July 12, 2005) Morris Township, N.J. — Honeywell's Electronic Materials business will expand its Asia-Pacific manufacturing capabilities to include 300-mm PVD (physical vapor deposition) sputtering targets production. Since the Asia-Pacific region is critical, the Jincheon, Korea-based plant will provide customers with technology materials for semiconductor production. Current capabilities at the site include production of materials supporting 200-mm semiconductor manufacturing.

SEMI Posts Book-to-Bill Ratio for June 2005

Wed, 7 Jul 2005
(July 20, 2005) San Jose, Calif. — On a three-month average, North American-based semiconductor equipment manufacturers posted $1.07 billion in orders and a book-to-bill ratio of 0.93 in June 2005, according to the June 2005 Book-to-Bill Report published by SEMI.

Miniaturization Advancements Call for Co-design, Collaboration

Mon, 7 Jul 2005
(July 25, 2005) San Jose, Calif. — The 2005 Electronic Product Miniaturization Symposium, held in conjunction with SEMICON West in San Francisco, Calif., gave semiconductor industry leaders from companies such as Cadence, IBM, Qualcomm, Samsung, and Tessera an opportunity to share ideas and explore new technologies for designing next-generation electronic products.

Three pilot plant roles: Development, training, and innovation

Tue, 5 May 2007
More than simply a site for small-scale bioprocessing, a pilot plant can be an engine of development.

Points to consider for developing a USP-797 compliant cleaning and sanitization program

Wed, 8 Aug 2007
The obvious objective in effective cleaning is the removal of contamination acquired from daily activities in the cleanroom.

Molecular matters

Wed, 8 Aug 2007
I had some very interesting conversations at this year’s “SEMICON West” conference and exhibition in San Francisco.

Cleaning the cleanroom

Wed, 8 Aug 2007
New technologies, chemistries and value-adds notwithstanding, cleanroom consumables are driven by two tenets for suppliers and users alike: They have to function properly and consistently, and they have to do so cost-effectively.

Hunting contaminants: Choosing the right vacuum for your cleanroom

Wed, 8 Aug 2007
From pharmaceuticals to semiconductors, cleanrooms are highly regulated environments. Under the International Organization for Standardization’s (ISO) strict criteria put forth in 2001, manufacturers across the board have fallen under a great amount of pressure to keep cleanrooms clean and have been forced to evaluate and improve their housekeeping regimens.

Using disposables to reduce cost and increase flexibility in bioreactor processes

Wed, 8 Aug 2007
It’s no secret that biopharmaceutical companies are moving rapidly toward disposable products for the production of protein therapeutics and vaccines.

High-speed doors serve cleanroom applications

Wed, 8 Aug 2007
Beginning about 35 years ago, manufacturers began to recognize that to achieve greater productivity, they would need faster, more efficient internal factory transportation and logistics systems.

Garments

Wed, 8 Aug 2007
Since human-generated contamination plays a large role in critical environments, special care must be taken to provide appropriate garments to minimize the human impact on the cleanroom.

Applied Mechanical acquires cleanroom certification company

Thu, 2 Feb 2007
Applied Mechanical Corporation (Austin, TX), provider of outsourced technical, engineering and project management services to the semiconductor industry, has announced its acquisition of Phoenix-based Cleanroom Sciences (CRS).

Growing demand for optical, automotive and medical products spurs Fabrinet expansion

Thu, 2 Feb 2007
Fabrinet, provider of manufacturing services for complex optical components, recently announced that its third and latest factory, completed in Nov 2005, is near capacity.

Contamination control event offers USP 797 seminar

Thu, 2 Feb 2007
ESTECH, the IEST’s 53rd annual technical meeting and exposition, will take place April 29-May 2 at the Indian Lakes Resort in Bloomingdale, Illinois.

ISPE releases water and steam guide

Thu, 2 Feb 2007
The International Society for Pharmaceutical Engineering (ISPE) has released its latest technical publication, ISPE Good Practice Guide: Commissioning and Qualification of Pharmaceutical Water and Steam Systems.

Facility Design Critical to Food Safety

Thu, 2 Feb 2007
A few years ago, members from across the food industry did something radical: They set aside competition and worked together to find better ways to battle contamination in food processing facilities.

Environmental control systems and their use in cleanroom applications

Thu, 2 Feb 2007
Every cleanroom or special environment utilizes some type of control system to operate the mechanical equipment that maintains the environment.

CIP systems critical to validatable, cost-effective cleaning

Thu, 2 Feb 2007
Clean-in-place, commonly referred to as CIP, is an automated method of cleaning processing equipment without disassembly using validated procedures.

Pass-throughs

Thu, 2 Feb 2007
Pass-throughs specifically designed for clean processing environments can help prevent contamination events from occurring as a result of the transfer of product or equipment from one area to another.

New Products

Thu, 2 Feb 2007
Each month, Cleanrooms brings you a collection of the latest product innovations in the contamination control industry.

Common cause

Thu, 3 Mar 2007
I don’t usually, if ever, review industry trade shows on this page, even when they’re our own events.

IEST: Building on its strengths

Thu, 3 Mar 2007
Giant conglomerates and mergers dominate today’s corporate world. Therefore, it is not surprising that not-for-profit organizations too are feeling economic and marketing pressures to follow the path of expansion into new areas.

Webcast wrap-up: The plain truth about USP <797>

Thu, 3 Mar 2007
Attendee questions from the CleanRooms Webcast are answered

Differences in sterility assurance for manufacture vs. compounding

Thu, 3 Mar 2007
The following statement by the FDA highlights the critical factors that are required to perform aseptic manipulations

Two new certificate programs at ESTECH 2007

Thu, 3 Mar 2007
The Institute of Environmental Sciences and Technology (IEST) will offer two new certificate programs to contamination control professionals at ESTECH 2007, the organization’s annual technical meeting and exposition being held April 29-May 2, 2007, in Bloomingdale, Illinois.

BOC Edwards donates equipment to nanotech research program

Thu, 3 Mar 2007
BOC Edwards, a leading supplier of semiconductor equipment and services, recently donated a dense fluid processor system to the MassNanoTech Institute, a campuswide nanoscale science and engineering initiative at the University of Massachusetts-Amherst.

BASF production plant nears completion

Thu, 3 Mar 2007
BASF’s new production plant for semiconductor process chemicals is on track for completion by end of 2007, according to a recent press release from the company.

Pilot program aims to improve recall process

Thu, 3 Mar 2007
In recent weeks there have been a number of food-related recalls-from baby food to peanut butter.

Particles

Thu, 3 Mar 2007
News snippets from the world of contamination control.

ISO/FDIS 14644-6, Vocabulary, available

Thu, 3 Mar 2007
The Institute of Environmental Sciences and Technology (IEST) has announced that the final draft International Standard (FDIS) version of International Organization for Standardization (ISO) Standard 14644-6, Cleanrooms and controlled environments, Part 6: Vocabulary, is now available.

Interphex 2007: Conference and Exhibition

Thu, 3 Mar 2007
Click here to download a .pdf of the Interphex 2007 Conference and Exhibition

Advanced aseptic processing technology

Thu, 3 Mar 2007
Advanced aseptic processing strategies offer manufacturers the best solution for protecting the quality and safety of their products and for ensuring the highest contamination control standards possible for products that cannot be terminally sterilized-but it comes at a cost.

Gas/liquid delivery

Thu, 6 Jun 2006
Keeping process gases and/or water free from contamination is vital, regardless of the classification level of the surrounding environment or cleanliness of the equipment.

Each month, CleanRooms brings you a collection of the latest product innovations in the contamination control industry

Thu, 6 Jun 2006

You get what you pay for

Sat, 7 Jul 2006
When it comes, what will have been the total cost of the cure for cancer? What is the cost to discover and bring to market a single blockbuster drug? Way too much to calculate would be the answer to the first.

IEST-RP-CC012.2, Considerations in Cleanroom Design

Sat, 7 Jul 2006
IEST recommended practice IEST-RP-CC012.1, Considerations in Cleanroom Design, has recently been revised and is scheduled for publication later this year.

Surface preparation prior to deposition

Sat, 7 Jul 2006
Integrated circuit design is constantly being scaled down in pursuit of faster circuit operation and lower power consumption.

Microsoft announces 2006 Pharmaceutical and Life Sciences Innovation Award Winners

Sat, 7 Jul 2006
Microsoft Corp. has announced the winners of the Microsoft(R) Pharmaceutical and Life Sciences Innovation Awards 2006, honoring the breakthrough contributions that companies are making in the pharmaceutical and life sciences industries through the best use of Microsoft-based solutions.

FDA inspection insights

Sat, 7 Jul 2006
MasterControl Inc., provider of innovative quality management software solutions, recently released an article addressing facility inspections.

Ecolab buys U.K. contamination control products company

Sat, 7 Jul 2006
Ecolab Inc. has purchased Shield Medicare Ltd.

Contec’s new China facility services dynamic electronics market

Sat, 7 Jul 2006
Last month, Contec Inc. (Spartanburg, S. C.) officially opened its new manufacturing facility in Suzhou, China.

particles

Sat, 7 Jul 2006
News snippets from the world of contamination control

IEST elects new officers

Sat, 7 Jul 2006
The Institute of Environmental Sciences and Technology (IEST) has announced its new officers for the term beginning July 1, 2006.

World cleanroom projects

Sat, 7 Jul 2006
The following cleanroom projects have been either first announced or revised in the month of June.

New Products

Wed, 8 Aug 2007
Each month, Cleanrooms brings you a collection of the latest product innovations in the contamination control industry.

Fluid dynamics leading the way to safer flights

Wed, 8 Aug 2007
University researchers working to optimize airflow patterns in commercial airplane cabins have uncovered new ways of containing the spread of toxic and infectious agents in these environments, and have taken the first steps toward development of a contaminant alert and detection system that can pinpoint the source to an individual passenger.

IEST provides new online educational opportunities

Wed, 8 Aug 2007
The Institute of Environmental Sciences and Technology (IEST) continues to offer valuable online education classes in the ongoing Access the Experts series with its one-hour class, “Sustainability Considerations in Cleanroom Design and Operation,” and two-part online education tutorial, “Healthcare Airborne Molecular Contamination,” both to be presented in September.

FDA is out of step

Sat, 9 Sep 2007
Sometimes epiphanies just jump out at me. For example, here’s one that just came to me recently.

Adopting appropriate aseptic technique

Sat, 9 Sep 2007
Compounding sterile preparations (CSPs) are made utilizing aseptic technique. Aseptic technique is a microbiological term referring to the prevention of microorganism contamination.

Particles

Sat, 9 Sep 2007
News snippets from the world of contamination control.

CleanRooms to host third webcast in series

Sat, 9 Sep 2007
On October 16, 2007, at 1:00pm EST, CleanRooms magazine editor-in-chief John Haystead will moderate the third in a series of live, interactive webcasts-“USP <797>: Implementing Practical & Available Solutions”-which will host a select mix of contamination control solution providers.

Purafil director honored with ASHRAE Distinguished Service Award

Sat, 9 Sep 2007
During the American Society of Heating, Refrigerating and Air-Conditioning Engineers’ (ASHRAE) annual meeting in Long Beach, CA, Purafil’s technical director Chris Muller was honored with a Distinguished Service Award (DSA).

Funding future semiconductor contamination control

Wed, 2 Feb 2006
Along with the usual New Year’s resolutions, the semiconductor industry has one that impacts contamination control and cleanrooms.

University of Cincinnati’s BSL3 lab enters second year

Wed, 2 Feb 2006
In February 2005, the University of Cincinnati opened a microbiological research laboratory to train researchers in the study of infectious agents and examine pathogens falling within the Bio Safety Level 3 (BSL3) category.

FDA offers guidance for efficient early-stage drug development

Wed, 2 Feb 2006
As part of a major new initiative to modernize current good manufacturing practice (cGMP) regulations and simplify clinical development, the FDA (www.fda.gov) has released two documents offering guidance for advancing the earliest phases of clinical research.

CC experts share real-world experiences

Wed, 2 Feb 2006
Procedures and protocol are important and necessary, but gathering information and advice from experienced peers is priceless.

Particles

Wed, 2 Feb 2006
Compiled by Angela Godwin

Rising energy costs dictate cleanroom design

Wed, 2 Feb 2006
Cleanroom owners industrywide look to shrink expenses while battling high utility bills and the lure of cheap foreign labor

Exhibitor showcase

Wed, 2 Feb 2006

Conference track explores USP 797

Sun, 1 Jan 2006
An important new program track entitled Hospital pharmacy compounding-Compliance challenges and USP 797 has been added to this year's CleanRooms Contamination Control Technology (CCT) conference program being presented this March in Boston.

CleanRooms Puerto Rico attracts island’s brightest and best

Sun, 1 Jan 2006
The 2005 CleanRooms Puerto Rico Contamination Control Technology Conference and Exhibition posted record attendance last November at San Juan’s Wyndham Condado Plaza Hotel.

Small world, big challenges

Sun, 1 Jan 2006
Nanotechnology is a major new force in the manufacture of products as diverse as car bumpers and drug-delivery micromachines.

NIOSH director to keynote CleanRooms CCT 2006

Sun, 1 Jan 2006
Safe advancement of nanotechnology will be addressed

New Products

Sun, 1 Jan 2006
Each month, CleanRooms brings you a collection of the latest product innovations in the contamination-control industry.

Cleanroom garments and fabrics

Sun, 1 Jan 2006

It’s your event! It’s free!! Take advantage of it!!!

Wed, 2 Feb 2006
With the CleanRooms Contamination Control Technology (CCT) Conference and Exhibition coming to Boston on March 15 and 16, it should be a busy and exciting month for all of us at CleanRooms and, hopefully, for many others in the contamination-control profession as well.

IEST-RP-CC001.4: HEPA and ULPA filters

Wed, 2 Feb 2006
In most cleanrooms, the final step in removing airborne particles occurs in the HEPA or ULPA filter that’s delivering air into a controlled space.

There’s some thing in the water

Thu, 11 Nov 2007
With the health and wellbeing of end customers on the line, pharmaceutical manufacturers put ultra-pure water systems to the test.

Resisting resistance: The need for next-generation disinfectants

Thu, 11 Nov 2007
A new silver-based disinfectant could rise to challenges presented by resistant bacteria in health care environments

Product Spotlight

Thu, 11 Nov 2007
Critical environments differ from one application to the next, but one aspect they all share is the need for adequate hand protection.

New Products

Thu, 11 Nov 2007

New nutraceutical manufacturing standards

Wed, 3 Mar 2006
FDA regulations promise opportunity for contamination-control industry

Fundamentals of particle counting

Wed, 3 Mar 2006
Selecting an airborne-particle counter for ISO 14644-1 certification

Balancing infection control, care, and cost in isolation rooms

Wed, 3 Mar 2006
Best practices in mitigating the spread of nosocomial infection and airborne diseases in hospitals and emergency departments

Consultant services

Wed, 3 Mar 2006
Compiled by Angela Godwin

New products

Wed, 3 Mar 2006
Compiled by Angela Godwin

Sounds like contamination control to me

Sat, 4 Apr 2006
Having just returned from a few days in Europe, visiting SEMICON Europe as well as a hospital equipment show in the Czech Republic in preparation for the CleanRooms Europe Conference & Exhibition coming up this October in Brno, I thought it was particularly appropriate that our Special Report this month is addressing the subject of microbial contamination and infection control.

Help yourself: How membership in the IEST benefits you

Sat, 4 Apr 2006
So, how’s your career going? Are you satisfied with your place in the industry? Have you reached the pinnacle of your profession? Do you know as much as you’d like to know? Are you looked upon as the technical go-to person in your organization?

Device for storing and moving substrate cassettes

Mon, 5 May 2006
Semiconductor devices are made on substrates, such as silicon wafers or glass plates.

Cleanroom market misconceptions

Mon, 5 May 2006
Sometimes what appears logical is, in fact, incorrect when it comes to cleanroom markets and technologies

Filter industry is standardizing, hopefully, on a standard

Mon, 5 May 2006
Unlike heads, two technical standards aren't better than one.

Contact lenses in compliance, but component interactions could be cause of recent outbreak

Mon, 5 May 2006
Although the outbreak last month of contact lens-related Fusarium keratitis bore the initial markings of a manufacturing-related contamination problem, government and industry officials involved with the investigation are close to fingering a combination of product factors in the field as the likely cause.

Three ISO cleanroom documents now American National Standards

Mon, 5 May 2006
The Institute of Environmental Sciences and Technology (IEST) recently announced that three ISO/TC 209 Cleanrooms and associated controlled environments documents have become American National Standards: ISO 14644-3, Test Methods; ISO 14644-5, Operations; and ISO 14644-7, Separative devices (clean-air hoods, glove boxes, isolators, mini-environments).

Contamination control in space

Mon, 5 May 2006
Containment a key issue as space agencies move closer to collecting Mars samples

Monitoring AMC

Mon, 5 May 2006
Protect your yield from molecular contaminants

A look at the future of reactivity monitoring for cleanroom AMC

Mon, 5 May 2006
Characterizing the destructive potential of corrosive contaminants

Inventor’s corner

Sat, 4 Apr 2006
The latest contamination-control innovations and inventions

Clarifying statements about disposable cleanroom garments

Sat, 4 Apr 2006
Observations concerning a recent column addressing disposable garment use and markets

Japanese companies collaborate for semiconductor development

Sat, 4 Apr 2006
Collaboration appears to be a sign of the times and may impact future cleanrooms

CH2M HILL clears final hurdle, obtains a general contracting license to operate in China

Sat, 4 Apr 2006
Following a complex, 14-month application process, engineering firm CH2M HILL (Denver, CO) received a general contractor’s license from the Shanghai Ministry of Construction in China, enabling the company to extend its range of services in what has become one of the largest markets in the world.

Family business celebrates a century in contamination control

Sat, 4 Apr 2006
Lymtech Scientific, a division of John R. Lyman Company, celebrated its 100th-year anniversary last month at the annual CleanRooms Contamination Control Technology (CCT) Conference & Exhibition in Boston.

CleanRooms CCT Conference and Expo scores well with attendees

Sat, 4 Apr 2006
Nearly 800 attendees of the CleanRooms Contamination Control Technology (CCT) Conference and Exhibition last month in Boston were introduced to state-of-the-art contamination-control products ranging from filtration, to cleanroom garments, to testing equipment and more, all presented by a host of vendors with displays on the sizable show floor.

Particles

Sat, 4 Apr 2006
Compiled by Karen Moltenbrey

Drug-resistant pathogens drive a more concerted effort against microbial contamination

Sat, 4 Apr 2006
The threat of “superbugs” and the frustrating prevalence of hospital-acquired (nosocomial) infections are spurring stepped-up vigilance for microbial contamination in health-care settings.

Safety first

Sat, 12 Dec 2007
Apparently, as far as the general media is concerned, anyone with a big mouth and a web site can qualify as an instant expert on biolaboratory safety.

Journal of the IEST celebrates 50 years of publication

Sat, 12 Dec 2007
IEST journeys to the past to move forward into the future of contamination control

Lab biosafety hearings conjure Cold War fears

Sat, 12 Dec 2007
A government report has resorted to Cold War language and imagery: High-Containment Biosafety Laboratories: Preliminary Observations on the Oversight of the Proliferation of BSL-3 and BSL-4 Laboratories in the United States.

Food safety plan emphasizes ‘effective action’ to prevent food supply contamination

Sat, 12 Dec 2007
U.S. Department of Health and Human Services (HHS) Secretary Mike Leavitt recently announced a comprehensive initiative by the Food and Drug Administration (FDA) designed to proactively address the safety of the nation’s food supply.

New Products

Sat, 12 Dec 2007

Inventor's Corner

Sun, 1 Jan 2006
This invention relates to the decontamination of transfer containers for use with rapid transfer port (RTP) systems, which are used to transfer articles between two environments, such as an isolator barrier system and a transfer container, that are adapted to be brought into close proximity to one another by a docking operation.

Exciting news from current IEST contamination control working groups

Sun, 1 Jan 2006
Newly graduated engineers, scientists and technicians working in the contamination-control, design, test and evaluation, and product reliability industries are discovering that

Final certification doesn’t have to be a hurdle

Sun, 1 Jan 2006
What's the last thing on the schedule prior to start-up of a new cleanroom or controlled environment? It's normally the one thing given the least weight...

Still in business with you

Sun, 1 Jan 2006
The title of this column in the January 1995 issue of CleanRooms was “In business with you.

What’s in a number?

Sun, 1 Jan 2006
ISO cleanroom standards continue to give solid foundation to contamination-control community

Microscopic cleaning for cleanrooms

Sun, 1 Jan 2006
Ultrasonic cleaning offers several advantages

Cleanroom floors: Supporting our future

Sat, 4 Apr 2006
Design, construction must keep pace with evolving needs

Biosensor monitoring of the cleanroom environment

Sat, 4 Apr 2006
Integrated circuit sensors: Combining the living bacterial cell with microchips

Understanding USP 797

Sat, 4 Apr 2006
Unraveling the requirements for compounding sterile preparations

Cleanroom packaging materials

Sat, 4 Apr 2006
Many manufacturing companies need to properly package delicate products for shipment around the world.

New products

Sat, 4 Apr 2006
Compiled by Angela Godwin

Smarten up, people!

Mon, 5 May 2006
Ok, maybe the headline is a bit disingenuous, but I’m actually not writing to castigate anyone for his or her poor judgment or lack of intelligence.

Matching sealing materials to CIP and SIP processes

Wed, 2 Feb 2006
Specifying the right seal material when CIP and SIP are used is not a simple matter.

New Products

Wed, 2 Feb 2006
Compiled by Angela Godwin

Show me the manufacturing!

Wed, 3 Mar 2006
The biotech industry has political clout.

IEST-RP-CC034.2: HEPA- and ULPA-filter leak tests

Wed, 3 Mar 2006
The performance of any cleanroom and its ability to achieve and maintain the designed cleanliness class are critically dependent on the performance of the air filters used in its construction.

Reusable Cleanroom Garments Part 2

Wed, 3 Mar 2006
Last month, this column focused on the use of reusable cleanroom garments as an alternative to disposable garments.

BU emphasizes redundancy in its NIH contract for Level 4 lab

Wed, 3 Mar 2006
There are legitimate concerns about building a Level 4 biosafety laboratory in an urban center such as Boston, but there are also benefits.

45nm processes pose challenges for conventional contamination control

Wed, 3 Mar 2006
For semiconductor processing, being small is big-especially if you’re the first to reach a process node.

Virtual is for real

Sat, 11 Nov 2008
Many months ago, when we first started talking about the concept and prospect of hosting a “virtual” conference and exhibition, I have to admit I was a little skeptical about how realistic a possibility it actually was.

cleaning and disinfection supplies

Sat, 11 Nov 2008
Cleaning and disinfecting products are a vital part of ensuring that a clean environment is sterile and contaminant-free.

New Products

Sat, 11 Nov 2008
Compiled by Carrie Meadows

Genzyme captures gold in R&D lab design

Sat, 11 Nov 2008
Confronting the difficult head-on, Genzyme Corp. has achieved a high-level certification for energy and environmental design in its Framingham, MA R&D facility unveiled in late September.

Destruction of Legionella collection shows inconsistencies in federal handling

Sat, 11 Nov 2008
As the wheels of Congress start grinding out legislation to protect federally funded biospecimen collections from inadvertent and malicious destruction, practitioners are of two minds about the government involvement.

FDA releases update on melamine investigation

Sat, 11 Nov 2008
Since September, the U.S. Food and Drug Administration (FDA) has been investigating possible contaminated milk-based products coming out of China.

The high cost of low-end swabs

Sat, 11 Nov 2008
Buying swabs in bulk at the lowest price may seem like a cost-effective choice, but those little penny-per-use disposable devices can track contamination into a cleanroom, cloud test results, and cause ESD events if they aren’t chosen with care.

TOC analysis pinpoints water chemistry changes

Sat, 11 Nov 2008
Direct conductometric TOC analyzer alerts engineers to potentially damaging trihalomethane excursions in pharmaceutical water.