wet-processing

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Wet Processing and Wafer Cleaning

Fri, 12 Dec 2015
Wet Processing, including wafer cleaning, is one of the most common yet most critical processing steps in semiconductor manufacturing, since it can have a huge impact on the success of the subsequent process step.

Semiconductor wet chemicals fall short of 2008 levels

Sat, 6 Jun 2014
Techcet forecasts $1B electronic chemicals business by 2015.

Digital Specialty Chemicals receives investment from Intel Capital

Tue, 5 May 2015
Digital Specialty Chemicals Limited (DSC), a dual bottom line corporation and leading provider of advanced materials to the semiconductor, pharmaceutical, and specialty chemical markets, announced that it has received an equity investment from Intel Capital, Intel Corporation’s global investment organization.

MEI Wet Processing Systems reveals performance data for new critical etch system

Tue, 9 Sep 2014
MEI Wet Processing Systems and Services revealed performance data today on its newly released Cu & TiW Critical Etch System for compound semiconductor manufacturing.

Avantor, SACHEM selective etch chemisty doubles as wafer cleaner

Wed, 7 Jul 2011

Avantor Performance Materials will launch the first in its new J.T.Baker SLCT Series of selective etch surface treatment chemistries, SLCT 128 sigma etchant, at SEMICON West. The product results from a partnership with etch specialist SACHEM.


ClassOne announces major savings with Solstice gold plating

Thu, 6 Jun 2016
ClassOne Technology, manufacturer of budget-friendly wet processing equipment, is reporting significant savings in the plating of gold in ≤200mm applications using its Solstice systems.

First quarter 2016 silicon wafer shipments increase quarter-over-quarter

Tue, 5 May 2016
Worldwide silicon wafer area shipments increased during the first quarter 2016 when compared to fourth quarter 2015 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Samco boosts shipment capacity with second production center

Tue, 6 Jun 2016
Samco, a Japan-based semiconductor processing equipment manufacturer, held a completion ceremony for its second production center on June 17.

Murphy, Choh and Pilla join ClassOne Technology's Board of Advisors

Thu, 12 Dec 2016
ClassOne Technology, manufacturer of advanced wet processing equipment for ≤200mm substrates, announced the formation of a Board of Advisors.

ClassOne initiative aims to reduce CoO in ≤200mm copper plating

Wed, 2 Feb 2017
ClassOne Technology announced a new company-wide initiative to reduce costs of operation (CoO) in copper plating processes.

OEM Group announces post-dice clean solutions for plasma and laser dicing methods

Thu, 9 Sep 2017
OEM Group announced today a post-dice clean solution on the proven Cintillio Batch Spray platform following plasma and laser dicing methods.