Fri, 12 Dec 2015
Wet Processing, including wafer cleaning, is one of the most common yet most critical processing steps in semiconductor manufacturing, since it can have a huge impact on the success of the subsequent process step.
Sat, 6 Jun 2014
Techcet forecasts $1B electronic chemicals business by 2015.
Tue, 5 May 2015
Digital Specialty Chemicals Limited (DSC), a dual bottom line corporation and leading provider of advanced materials to the semiconductor, pharmaceutical, and specialty chemical markets, announced that it has received an equity investment from Intel Capital, Intel Corporation’s global investment organization.
Tue, 9 Sep 2014
MEI Wet Processing Systems and Services revealed performance data today on its newly released Cu & TiW Critical Etch System for compound semiconductor manufacturing.
Wed, 7 Jul 2011
Avantor Performance Materials will launch the first in its new J.T.Baker SLCT Series of selective etch surface treatment chemistries, SLCT 128 sigma etchant, at SEMICON West. The product results from a partnership with etch specialist SACHEM.
Thu, 6 Jun 2016
ClassOne Technology, manufacturer of budget-friendly wet processing equipment, is reporting significant savings in the plating of gold in ≤200mm applications using its Solstice systems.
Tue, 5 May 2016
Worldwide silicon wafer area shipments increased during the first quarter 2016 when compared to fourth quarter 2015 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.
Tue, 6 Jun 2016
Samco, a Japan-based semiconductor processing equipment manufacturer, held a completion ceremony for its second production center on June 17.
Thu, 12 Dec 2016
ClassOne Technology, manufacturer of advanced wet processing equipment for ≤200mm substrates, announced the formation of a Board of Advisors.
Wed, 2 Feb 2017
ClassOne Technology announced a new company-wide initiative to reduce costs of operation (CoO) in copper plating processes.