wet-processing-equipment

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MEI Wet Processing Systems reveals performance data for new critical etch system

Tue, 9 Sep 2014
MEI Wet Processing Systems and Services revealed performance data today on its newly released Cu & TiW Critical Etch System for compound semiconductor manufacturing.

ClassOne announces major savings with Solstice gold plating

Thu, 6 Jun 2016
ClassOne Technology, manufacturer of budget-friendly wet processing equipment, is reporting significant savings in the plating of gold in ≤200mm applications using its Solstice systems.

Samco boosts shipment capacity with second production center

Tue, 6 Jun 2016
Samco, a Japan-based semiconductor processing equipment manufacturer, held a completion ceremony for its second production center on June 17.

Murphy, Choh and Pilla join ClassOne Technology's Board of Advisors

Thu, 12 Dec 2016
ClassOne Technology, manufacturer of advanced wet processing equipment for ≤200mm substrates, announced the formation of a Board of Advisors.

ClassOne initiative aims to reduce CoO in ≤200mm copper plating

Wed, 2 Feb 2017
ClassOne Technology announced a new company-wide initiative to reduce costs of operation (CoO) in copper plating processes.