Touch Technologies



Led by Apple and Chinese brands, high tech smartphone panel shipments rising

11/24/2015  Demand for LTPS TFT LCD shipments rose 30 percent in September 2015 to reach 51.6 million units, due to strong demand from Apple and Chinese brands.

China to dominate flat panel display manufacturing by 2018, says IHS

11/13/2015  While conventional thin film transistor liquid crystal (TFT LCD) displays are rapidly trending towards commoditization and currently suffering from declining prices and margins, China is quickly adding capacity in all flat-panel display (FPD) manufacturing segments.

The use of sapphire in mobile device and LED industries

11/13/2015  Sapphire is hard, strong, optically transparent and chemically inert.

Stanford engineers create artificial skin that can send pressure sensation to brain cell

10/20/2015  Stanford engineers have created a plastic "skin" that can detect how hard it is being pressed and generate an electric signal to deliver this sensory input directly to a living brain cell.

Hillcrest Labs unveils MotionEngine Wear software

09/29/2015  Hillcrest Labs unveiled its MotionEngine (TM) Wear software with always-on, sensor-enabled features optimized for the latest generation of wearable devices.

UMC enters high volume touch IC production using foundry industry's first 0.11um eFlash process

09/24/2015  United Microelectronics Corporation (UMC), a global semiconductor foundry, today announced that it has entered high volume production for touch IC applications manufactured on UMC's 0.11um eFlash process.

Dialog Semiconductor to acquire Atmel for $4.6 billion

09/21/2015  Dialog Semiconductor and Atmel Corporation announced today that Dialog has agreed to acquire Atmel in a cash and stock transaction for total consideration of approximately $4.6 billion.

Flexible 7 inch touch panel with integrated OLED display developed

09/01/2015  Together with ITRI, Taiwan, Heraeus, demonstrated the integration of Clevios conductive polymer based touch panel with AM OLED technology in a highly flexible device.

Cima NanoTech announces joint venture with Foxconn

08/26/2015  Cima NanoTech, a developer and manufacturer of transparent conductive film solutions, announced today that it has entered into a joint venture with Foxconn, the world’s largest ICT technology provider and vertically integrated device manufacturer, to deliver the industry’s first cost-competitive, projected capacitive (pro-cap) solution for large format touch screens.

Traditional notebook display shipments drop as Chromebooks rise

08/14/2015  Global consumers have lately become less interested in acquiring conventional notebooks with 15-inch displays, and they are instead shifting their spending to smaller product segments.





Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

More Technology Papers


3D NAND Challenges and Opportunities

December 16, 2015 at 12:00 p.m. ET

Flash memory has revolutionized the world of solid-state data storage, mainly because of the advent of NAND technology. However, from the technical point of view, this requires a major change in how these memories are being fabricated. This presentation will discuss this (r)evolution as well as its major scaling limitations.

Sponsored By:
IoT Device Trends and Challenges

January 2016 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts



International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015