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TOUCH TECHNOLOGIES ARTICLES



BOE takes first spot in large display unit shipment, IHS Markit reports

02/28/2017  BOE, a Chinese display maker, takes top position in terms of large TFT-LCD display unit shipments in January 2017, according to IHS Markit.

UniPixel prepares for flexible display market

02/07/2017  UniPixel touch sensors pass 200,000 cycle fold test.

As larger TVs gain popularity, TV panel area demand to grow 8% in 2017

01/23/2017  Demand for TV panels in terms of area is forecast to reach 143 million square meters in 2017, up 8 percent from 2016, contributing to a 6 percent growth in the overall display market, according to IHS Markit.

Large area displays market to witness growth owing to the high investments in OLED displays

01/18/2017  According to the latest market study released by Technavio, the global large area displays market is expected to reach USD 78.41 billion by 2021, growing at a CAGR of close to 2%.

Chinese panel makers top over 1M units in quarterly shipments for AMOLED smartphone displays

12/22/2016  Significant improvement in Chinese panel manufacturing technology offers domestic smartphone brands an alternative AMOLED supplier.

EVG and Korea National NanoFab Center program on novel display coatings delivers outstanding results

12/07/2016  EV Group and the Korea National NanoFab Center announced preliminary results on improved transparent nanostructured anti-reflective coatings for next-generation displays.

LCD TV panel makers set lower shipment target for 2017

11/29/2016  Restructuring of older display fabs, migration to larger-sized LCD TV panels and business strategy adjustments are some of the factors prompting LCD TV panel manufacturers to set a conservative shipment goal of 258.4 million units in 2017, a 1.2 percent decline from 2016.

South Korean IT display manufacturers replacing LCD with OLED

10/05/2016  Due to increasing capacity from China, South Korean LCD panel makers are quickly realizing that LCD displays profitability may eventually erode, due to growing capacity and price competition from China, so they are betting their future on organic light-emitting diode (OLED) displays.

SID announces new award for outstanding contributions for active matrix addressed information displays

09/23/2016  The Peter Brody Prize will be awarded to a young researcher under age 40 who has made outstanding contributions in innovating the design and enhancing the performance of active matrix addressed information displays.

Applied Materials brings its e-beam review technology to the display industry

09/21/2016  Applied Materials, Inc. today introduced the display industry's first high-resolution inline e-beam review (EBR) system, increasing the speed at which manufacturers of OLED and UHD LCD screens can achieve optimum yields and bring new display concepts to market.

Quantum dots with an impermeable shell

08/11/2016  Scientists from the Institute of Physical Chemistry of the Polish Academy of Sciences (IPC PAS) in Warsaw and the Faculty of Chemistry of the Warsaw University of Technology (FC WUT) have shown that zinc oxide (ZnO) quantum dots prepared by an original method developed by them, after modification by the click reaction with the participation of copper ions, fully retain their ability to emit light.

TouchSystems announces new multi-touch display

08/01/2016  TouchSystems, a provider of professional-grade touch display and digital signage solutions, announced today the latest generation of its P-Series large format touch displays.

OLED to become leading smartphone display technology in 2020

07/25/2016  Although liquid-crystal display (LCD) has dominated mobile phone displays for more than 15 years, organic light-emitting diode (OLED) display technology is set to become the leading smartphone display technology in 2020.

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TWITTER


WEBCASTS



Semiconductors and the IoT

Tuesday, March 28, 2017 at 1pm ET / Sponsored by Epicor

The rise of Internet of Things (IoT) and the cloud and their associated technologies and platforms are slowly but surely fueling the emergence of new market segments that are shaping and transforming our way of life. Learn how the IoT applications and use-cases that span clients/devices, networks, and data centers are driving new requirements for semiconductors including ultra-low power, ultra-low leakage, smaller and denser packaging, and cost effectiveness. And find out exactly how this IoT trend represents a growth opportunity for the semiconductor industry that has not been seen since the early days of the Internet.

Sponsored By:
Advanced Process Control in Microelectronics Manufacturing: Leveraging Smart Manufacturing and Big Data

Friday, April 7, 2017 at 1pm ET / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

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TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

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EVENTS



CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017

VIDEOS