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TOUCH TECHNOLOGIES ARTICLES



Leti and partners in PiezoMAT Project develop new fingerprint technology

09/05/2017  Leti today announced that the European R&D project known as PiezoMAT has developed a pressure-based fingerprint sensor that enables resolution more than twice as high as currently required by the U.S. Federal Bureau of Investigation (FBI).

Panel makers forecast to maintain high fab utilization rates in Q3

08/29/2017  The overall utilization rate of display panel fabrication (fab) plants is expected to remain high in the third quarter of 2017, recording similar levels for the fifth consecutive quarter.

AMOLED fine metal mask market expected to reach $1.2B by 2022

07/20/2017  As active-matrix organic light-emitting diode (AMOLED) displays quickly displace liquid crystal displays (LCDs) in smartphones, panel makers are rapidly adding new production capacity, accelerating the demand for the fine metal mask.

MagnaChip and ELAN Microelectronics announce partnership

07/17/2017  MagnaChip Semiconductor Corporation announced today it was selected as a foundry partner by ELAN Microelectronics to manufacture the world's first fingerprint sensor IC-based smartcard.

Automotive touch screen shipments to top 50M units in 2017

06/12/2017  With consumers already accustomed with using smartphones and tablet PCs in their everyday lives, touch screens are now increasingly making their way into their vehicles, too.

AMOLED TV panel shipments to top 10 million units by 2023

06/06/2017  As panel makers are increasingly targeting the premium TV market, active-matrix organic light-emitting diode TV panel shipments are expected to exceed 10 million units by 2023, growing at a compound annual growth rate (CAGR) of 42 percent from 2017.

2017FLEX Monterey focuses on accelerating to manufacturing as industry growth escalates

05/15/2017  FlexTech's annual Flexible Electronics Conference and Exhibit -- 2017FLEX -- is set for the Hyatt Regency Hotel & Spa in Monterey, Calif. from June 19-22, 2017.

Galaxy S8 materials costs highest by far compared to previous versions, IHS Markit teardown reveals

04/25/2017  The new Samsung Galaxy S8 equipped with 64 gigabytes (GB) of NAND flash memory carries a bill of materials (BOM) cost that comes out to US$301.60, much higher than for previous versions of the company’s smartphones, according to a preliminary estimate from IHS Markit.

BOE takes first spot in large display unit shipment, IHS Markit reports

02/28/2017  BOE, a Chinese display maker, takes top position in terms of large TFT-LCD display unit shipments in January 2017, according to IHS Markit.

UniPixel prepares for flexible display market

02/07/2017  UniPixel touch sensors pass 200,000 cycle fold test.

As larger TVs gain popularity, TV panel area demand to grow 8% in 2017

01/23/2017  Demand for TV panels in terms of area is forecast to reach 143 million square meters in 2017, up 8 percent from 2016, contributing to a 6 percent growth in the overall display market, according to IHS Markit.

Large area displays market to witness growth owing to the high investments in OLED displays

01/18/2017  According to the latest market study released by Technavio, the global large area displays market is expected to reach USD 78.41 billion by 2021, growing at a CAGR of close to 2%.

Chinese panel makers top over 1M units in quarterly shipments for AMOLED smartphone displays

12/22/2016  Significant improvement in Chinese panel manufacturing technology offers domestic smartphone brands an alternative AMOLED supplier.

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3D NAND: Trends in Processes, Circuits

October 3, 2017 at 1 p.m. ET

Conventional planar flash memory technology is approaching critical scaling limitations that are driving the transition to 3D solutions. 3D NAND is expected to scale in height, from 16-bit-tall strings to string heights of more than 128 bits. Meanwhile NAND makers will find ways of placing these strings closer to each other through more aggressive lithography.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

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TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

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EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS