Touch Technologies

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TOUCH TECHNOLOGIES ARTICLES



Touch International unveils new highly advanced projected capacitive touch technology

03/11/2014  Specialty touch screen and display enhancement manufacturer, Touch International confirmed today the release of a new touch sensing technology that overcomes the limitations of current projected capacitive (p-cap) offerings.

Cypress adds one hundredth capacitative touchscreen patent

01/09/2014  Cypress Semiconductor Corp. today announced the US Patent Office has issued Cypress its one hundredth patent related to its TrueTouch capacitive touchscreen controllers.

Shipments of touch-screen panels for notebook PCs accelerate in Q4

12/12/2013  After a decline in the second quarter of 2013 and a tepid expansion in the third, demand for touch-screen panels used in notebook PCs is set to rebound to double-digit growth during the last three months of the year.

Booming market for touch-screen notebook PC displays hits speed bump in second quarter

10/17/2013  How bad were conditions in the notebook PC market during the second quarter?

University of Pennsylvania develops computer model that will help design flexible touchscreens

09/10/2013  Electronic devices with touchscreens are ubiquitous, and one key piece of technology makes them possible: transparent conductors. However, the cost and the physical limitations of the material these conductors are usually made of are hampering progress toward flexible touchscreen devices.

Tablet display market more than doubles in Q1

08/16/2013 

Booming demand for low-priced 7.x-inch products helped shipments of panels used in media tablets to more than double in in the first quarter.

Rolith successfully demonstrates ITO-alternative technology based on rolling mask lithography

08/13/2013 

Rolith, Inc., a developer of advanced nanostructured devices, yesterday announced the successful demonstration of Transparent Metal Grid Electrode technology based on its disruptive nanolithography method (Rolling Mask Lithography – RMLTM).

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FINANCIALS



TECHNOLOGY PAPERS



UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

Versatile Epoxy Compounds for Electronic Applications

Electronic systems have revolutionized our lives. We use them in nearly all of our daily activities, for communication, computing, navigation, entertainment, payment processing, and more. They are the workhorses in many medical, transportation, aerospace, and military systems, performing functions such as automated control, data analysis, and pattern recognition.February 10, 2014
Sponsored by Master Bond, Inc.,

Enhancing the Performance of Electronic Applications with Versatile Epoxy Compounds

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014
Sponsored by Master Bond, Inc.,

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WEBCASTS



Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014