Touch Technologies

TOUCH TECHNOLOGIES ARTICLES



AMOLED panel demand in smartphone market expected to grow much slower than expected

04/16/2018  After showing triple-digit growth in 2017, flexible AMOLED panel is only expected to grow 34 percent in 2018 compared to the previous year.

ABI Research's Teardowns service finds first hidden under-display fingerprint sensor bites into Apple's face recognition technology

04/11/2018  What makes the Vivo X20 Plus UD smartphone so important is that it is the first smartphone to use Synaptics' under-display fingerprint sensor, and it has the potential to bite into Apple's face recognition technology, announced the Teardowns service of ABI Research.

Samsung Electronics diversifies its 8-inch foundry offerings with new RF/IoT and fingerprint technology solutions

03/21/2018  Samsung Electronics Co., Ltd. today announced more value added 8-inch (200mm) technology solutions for its foundry customers.

Immersion files lawsuits against Samsung in U.S. and China

03/09/2018  The complaint seeks to stop further infringement by Samsung and to recover damages.

Driven by size migration and high-end products, large TFT display market continued to grow in 2017

02/16/2018  Despite slower demand from end market and panel price erosion, the large thin-film transistor (TFT) display market expanded in 2017 in all three aspects -- unit shipments, area shipments and revenue.

Rutgers-led innovation could spur faster, cheaper, nano-based manufacturing

02/14/2018  Scalable and cost-effective manufacturing of thin film devices.

Chinese panel makers catching up fast in LTPS LCD panel shipments for mobile phones

02/12/2018  Total shipments of mobile phone displays, including thin-film transistor liquid crystal display (TFT LCD) and active matrix organic light-emitting diode (AMOLED) panels, reached 2.01 billion units in 2017, up 3 percent from 2016.

NXP unveils breakthrough tech for payment cards

10/27/2017  NXP Semiconductors N.V. (NASDAQ:NXPI) today debuted two significant technology breakthroughs at the largest fintech innovation event, Money 20/20, October 22-25, 2017, in Las Vegas.

Global AMOLED panel production capacity set to more than quadruple over next five years

10/27/2017  Samsung Display and LG Display to remain as market leaders.

NVIDIA, Taiwan's Ministry of Science and Technology to accelerate Taiwan AI revolution with NVIDIA AI computing platform

10/26/2017  NVIDIA today announced that it is collaborating with Taiwan's Ministry of Science and Technology (MOST) to accelerate the development of artificial intelligence across Taiwan's commercial sector in support of its recently announced AI Grand Plan to help foster domestic AI-related industries.

Sussex physicists have breakthrough on brittle smart phone screens

10/25/2017  New 'potato stamp' technique combining silver and graphene may create cheaper, more flexible and eco-friendly screens.

Sun Chemical enters into license agreement to introduce new screen printable molecular inks

10/12/2017  Sun Chemical has entered into a license agreement to introduce a new family of molecular inks for the printed electronics market with Groupe Graham International (GGI).

Leti and partners in PiezoMAT Project develop new fingerprint technology

09/05/2017  Leti today announced that the European R&D project known as PiezoMAT has developed a pressure-based fingerprint sensor that enables resolution more than twice as high as currently required by the U.S. Federal Bureau of Investigation (FBI).

Panel makers forecast to maintain high fab utilization rates in Q3

08/29/2017  The overall utilization rate of display panel fabrication (fab) plants is expected to remain high in the third quarter of 2017, recording similar levels for the fifth consecutive quarter.

AMOLED fine metal mask market expected to reach $1.2B by 2022

07/20/2017  As active-matrix organic light-emitting diode (AMOLED) displays quickly displace liquid crystal displays (LCDs) in smartphones, panel makers are rapidly adding new production capacity, accelerating the demand for the fine metal mask.

MagnaChip and ELAN Microelectronics announce partnership

07/17/2017  MagnaChip Semiconductor Corporation announced today it was selected as a foundry partner by ELAN Microelectronics to manufacture the world's first fingerprint sensor IC-based smartcard.

Automotive touch screen shipments to top 50M units in 2017

06/12/2017  With consumers already accustomed with using smartphones and tablet PCs in their everyday lives, touch screens are now increasingly making their way into their vehicles, too.

AMOLED TV panel shipments to top 10 million units by 2023

06/06/2017  As panel makers are increasingly targeting the premium TV market, active-matrix organic light-emitting diode TV panel shipments are expected to exceed 10 million units by 2023, growing at a compound annual growth rate (CAGR) of 42 percent from 2017.

2017FLEX Monterey focuses on accelerating to manufacturing as industry growth escalates

05/15/2017  FlexTech's annual Flexible Electronics Conference and Exhibit -- 2017FLEX -- is set for the Hyatt Regency Hotel & Spa in Monterey, Calif. from June 19-22, 2017.

Galaxy S8 materials costs highest by far compared to previous versions, IHS Markit teardown reveals

04/25/2017  The new Samsung Galaxy S8 equipped with 64 gigabytes (GB) of NAND flash memory carries a bill of materials (BOM) cost that comes out to US$301.60, much higher than for previous versions of the company’s smartphones, according to a preliminary estimate from IHS Markit.




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3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:
Artificial Intelligence and Machine Learning in Semiconductor Manufacturing: The Rise of Computational Process Control

Thursday, May 17, 2018 at 1:00 p.m. ET

The increased use of artificial intelligence (AI) and machine learning (ML) techniques such as deep learning is creating a myriad of both challenges and opportunities for enhancements in manufacturing in terms of improved capacity, quality, and efficiency. The semiconductor industry poses somewhat unique challenges arising from its complex, high precision and highly dynamic production environment. One key way that these challenges are being addressed in semiconductor is by using an approach called “computational process control” or “CPC” in which AI and ML are combined with subject matter expertise to provide higher quality analytical solutions. This webcast will look at the AI/ML explosion, what it means to the semiconductor industry, and how CPC is being used to enhance the benefits of these analytical techniques.

Sponsored By:
Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

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TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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