Touch Technologies

TOUCH TECHNOLOGIES ARTICLES



Printing in the hobby room: Paper-thin and touch-sensitive displays on various materials

10/13/2014  What if you could integrate paper-thin displays into the cards, which could be printed at home and which would be able to depict self-created symbols or even react to touch? Those only some of the options computer scientists in Saarbrücken can offer.

Capacitive touch controller IC market to grow at double-digit CAGR until 2017

07/16/2014  The capacitive touch controller IC market is predicted to reach about $2.8 billion in 2017, an increase of nearly 50 percent from $1.9 billion in 2013, according to a new report from IHS Technology.

Renasas Electronics announces development of new capacitive-touch sensing technology

07/16/2014  Renesas Electronics America Inc., a supplier of advanced semiconductor solutions, today announced development of innovative new intellectual property (IP) that implements capacitive-touch sensing technology ideal for home appliances and healthcare equipment.

SABIC collaborates with Cima NanoTech on breakthrough display technology

06/05/2014  As smart materials become one of the fastest growing areas of materials technology, SABIC and Cima NanoTech, a Singapore and US-based company, have announced the joint development of a plastics industry first: a transparent conductive polycarbonate film that has the potential to revolutionize the materials used in consumer electronics, household goods, automotive, architecture and healthcare.

Amdolla Group and Cima NanoTech announce industry's first non-ITO film-based 42" multi-touch module

06/04/2014  Cima NanoTech, a smart nanomaterials company specializing in high performance transparent conductive films, announced today the industry’s first ultra responsive, non-ITO film-based, 42-inch projected capacitive multi- touch module for large format touch applications.

Cima NanoTech showcases ultra responsive, large format 42” touch screen at Display Week 2014

06/04/2014  Cima NanoTech, a smart nanomaterials company specializing in high performance transparent conductors, showcased an ultra responsive, non-ITO film-based 42” large format touch screen at SID Display Week.

Touch International unveils new highly advanced projected capacitive touch technology

03/11/2014  Specialty touch screen and display enhancement manufacturer, Touch International confirmed today the release of a new touch sensing technology that overcomes the limitations of current projected capacitive (p-cap) offerings.

Cypress adds one hundredth capacitative touchscreen patent

01/09/2014  Cypress Semiconductor Corp. today announced the US Patent Office has issued Cypress its one hundredth patent related to its TrueTouch capacitive touchscreen controllers.

Shipments of touch-screen panels for notebook PCs accelerate in Q4

12/12/2013  After a decline in the second quarter of 2013 and a tepid expansion in the third, demand for touch-screen panels used in notebook PCs is set to rebound to double-digit growth during the last three months of the year.

Booming market for touch-screen notebook PC displays hits speed bump in second quarter

10/17/2013  How bad were conditions in the notebook PC market during the second quarter?

University of Pennsylvania develops computer model that will help design flexible touchscreens

09/10/2013  Electronic devices with touchscreens are ubiquitous, and one key piece of technology makes them possible: transparent conductors. However, the cost and the physical limitations of the material these conductors are usually made of are hampering progress toward flexible touchscreen devices.

Tablet display market more than doubles in Q1

08/16/2013 

Booming demand for low-priced 7.x-inch products helped shipments of panels used in media tablets to more than double in in the first quarter.

Rolith successfully demonstrates ITO-alternative technology based on rolling mask lithography

08/13/2013 

Rolith, Inc., a developer of advanced nanostructured devices, yesterday announced the successful demonstration of Transparent Metal Grid Electrode technology based on its disruptive nanolithography method (Rolling Mask Lithography – RMLTM).

IHS boosts tablet panel shipment forecast

07/02/2013 

Boosted by orders from unbranded, white-box Chinese manufacturers, global demand for tablet panels is exceeding expectations, spurring IHS to increase its forecast for displays by six percent for 2013.

Tablet IC sales to rise 37% in 2013

06/18/2013 

New market update shows integrated circuit revenues for tablets hitting $27 billion in 2016.

Transparent electrode market to grow to $5.1 billion by 2020

05/29/2013 

Transparent electrodes refer to oxide degenerate semiconductor electrodes that possess a high level of light transmittance (more than 85 percent) in the visible light spectrum, and low resistivity (less than 1×10-3 Ω-㎝) at the same time.

Global touch-screen panel shipments to double by 2016

05/24/2013 

Worldwide shipments of touch-screen panels are set to double from 2012 to 2016, reaching nearly 3 billion units as a wide variety of products beyond smartphones and tablets adopt the technology, particularly notebook PCs.

Flexible devices manufactured by roll-to-roll technologies to reach nearly $22.7 billion by 2017

05/23/2013 

The diffusion of roll-to-roll technologies is expected to have a marked effect in lowering the unit prices of flexible devices. Consequently, while consumption in terms of volume is forecast to rise very rapidly, revenues will increase somewhat more moderately.

Innovation could bring flexible solar cells, transistors, displays

05/22/2013 

Researchers have created a new type of transparent electrode that might find uses in solar cells, flexible displays for computers and consumer electronics and future "optoelectronic" circuits for sensors and information processing.

One quarter of all notebooks to ship with touchscreens by 2016

05/22/2013 

Driven by falling prices and a major initiative from Intel Corp., shipments of touch-enabled mobile PCs are expected to enjoy rapid growth in 2013 and the coming years, rising to about 25 percent of all notebooks by 2016.




FINANCIALS



TECHNOLOGY PAPERS



Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

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Metrology and Failure Analysis

Nov. 2014 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

Materials

Nov. 2014 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:

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