Touch Technologies

TOUCH TECHNOLOGIES ARTICLES



Capacitive touch controller IC market to grow at double-digit CAGR until 2017

07/16/2014  The capacitive touch controller IC market is predicted to reach about $2.8 billion in 2017, an increase of nearly 50 percent from $1.9 billion in 2013, according to a new report from IHS Technology.

Renasas Electronics announces development of new capacitive-touch sensing technology

07/16/2014  Renesas Electronics America Inc., a supplier of advanced semiconductor solutions, today announced development of innovative new intellectual property (IP) that implements capacitive-touch sensing technology ideal for home appliances and healthcare equipment.

SABIC collaborates with Cima NanoTech on breakthrough display technology

06/05/2014  As smart materials become one of the fastest growing areas of materials technology, SABIC and Cima NanoTech, a Singapore and US-based company, have announced the joint development of a plastics industry first: a transparent conductive polycarbonate film that has the potential to revolutionize the materials used in consumer electronics, household goods, automotive, architecture and healthcare.

Amdolla Group and Cima NanoTech announce industry's first non-ITO film-based 42" multi-touch module

06/04/2014  Cima NanoTech, a smart nanomaterials company specializing in high performance transparent conductive films, announced today the industry’s first ultra responsive, non-ITO film-based, 42-inch projected capacitive multi- touch module for large format touch applications.

Cima NanoTech showcases ultra responsive, large format 42” touch screen at Display Week 2014

06/04/2014  Cima NanoTech, a smart nanomaterials company specializing in high performance transparent conductors, showcased an ultra responsive, non-ITO film-based 42” large format touch screen at SID Display Week.

Touch International unveils new highly advanced projected capacitive touch technology

03/11/2014  Specialty touch screen and display enhancement manufacturer, Touch International confirmed today the release of a new touch sensing technology that overcomes the limitations of current projected capacitive (p-cap) offerings.

Cypress adds one hundredth capacitative touchscreen patent

01/09/2014  Cypress Semiconductor Corp. today announced the US Patent Office has issued Cypress its one hundredth patent related to its TrueTouch capacitive touchscreen controllers.

Shipments of touch-screen panels for notebook PCs accelerate in Q4

12/12/2013  After a decline in the second quarter of 2013 and a tepid expansion in the third, demand for touch-screen panels used in notebook PCs is set to rebound to double-digit growth during the last three months of the year.

Booming market for touch-screen notebook PC displays hits speed bump in second quarter

10/17/2013  How bad were conditions in the notebook PC market during the second quarter?

University of Pennsylvania develops computer model that will help design flexible touchscreens

09/10/2013  Electronic devices with touchscreens are ubiquitous, and one key piece of technology makes them possible: transparent conductors. However, the cost and the physical limitations of the material these conductors are usually made of are hampering progress toward flexible touchscreen devices.

Tablet display market more than doubles in Q1

08/16/2013 

Booming demand for low-priced 7.x-inch products helped shipments of panels used in media tablets to more than double in in the first quarter.

Rolith successfully demonstrates ITO-alternative technology based on rolling mask lithography

08/13/2013 

Rolith, Inc., a developer of advanced nanostructured devices, yesterday announced the successful demonstration of Transparent Metal Grid Electrode technology based on its disruptive nanolithography method (Rolling Mask Lithography – RMLTM).

IHS boosts tablet panel shipment forecast

07/02/2013 

Boosted by orders from unbranded, white-box Chinese manufacturers, global demand for tablet panels is exceeding expectations, spurring IHS to increase its forecast for displays by six percent for 2013.

Tablet IC sales to rise 37% in 2013

06/18/2013 

New market update shows integrated circuit revenues for tablets hitting $27 billion in 2016.

Transparent electrode market to grow to $5.1 billion by 2020

05/29/2013 

Transparent electrodes refer to oxide degenerate semiconductor electrodes that possess a high level of light transmittance (more than 85 percent) in the visible light spectrum, and low resistivity (less than 1×10-3 Ω-㎝) at the same time.

Global touch-screen panel shipments to double by 2016

05/24/2013 

Worldwide shipments of touch-screen panels are set to double from 2012 to 2016, reaching nearly 3 billion units as a wide variety of products beyond smartphones and tablets adopt the technology, particularly notebook PCs.

Flexible devices manufactured by roll-to-roll technologies to reach nearly $22.7 billion by 2017

05/23/2013 

The diffusion of roll-to-roll technologies is expected to have a marked effect in lowering the unit prices of flexible devices. Consequently, while consumption in terms of volume is forecast to rise very rapidly, revenues will increase somewhat more moderately.

Innovation could bring flexible solar cells, transistors, displays

05/22/2013 

Researchers have created a new type of transparent electrode that might find uses in solar cells, flexible displays for computers and consumer electronics and future "optoelectronic" circuits for sensors and information processing.

One quarter of all notebooks to ship with touchscreens by 2016

05/22/2013 

Driven by falling prices and a major initiative from Intel Corp., shipments of touch-enabled mobile PCs are expected to enjoy rapid growth in 2013 and the coming years, rising to about 25 percent of all notebooks by 2016.

AMOLED displays to have major influence on innovation in the cloud computer era

05/22/2013 

During the keynote speech, Kim said that the future of displays will change considerably, with special attention to be given for the virtually infinite number of imaging possibilities in AMOLED (Active Matrix Organic Light Emitting Diode) display technology.




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TECHNOLOGY PAPERS



Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

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WEBCASTS



Advanced Packaging

Oct. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:
Metrology

Oct. 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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