Touch Technologies

TOUCH TECHNOLOGIES ARTICLES



C3nano seals acquisition of Asia's largest manufacturer of silver nanowire, Aiden Co. Ltd. Korea

04/28/2015  C3nano, Inc. announced today that it has acquired the major supplier of silver nanowire (AgNW) in Asia, Aiden Co. Ltd. of Korea.

Canatu launches high transmittance CNB transparent conductive film for touch sensors

04/27/2015  Canatu, a manufacturer of next generation transparent conductive films and touch sensors, announces a new generation of high optical transmittance CNB (Carbon NanoBud) transparent conductive films at Printed Electronics Europe.

ITRS 2.0: Top-Down System Integration

04/22/2015  ITRS2.0 will, for the first time, develop a top-down system-driven roadmap framework for key semiconductor industry drivers in the 2015-2030 period.

Global 4K display market to reach $52B in 2020

04/20/2015  Once a feature mainly found in next-gen TVs, 4K resolution displays now being adopted in smartphones, PC monitors, OLED displays and notebook PCs.

SOI: Revolutionizing RF and expanding in to new frontiers

04/17/2015  SOI provides the capability to revolutionize RF Front Ends and WAN RFSOCs through innovation in radio architectures.

Solid State Watch: April 10-16, 2015

04/17/2015  SEMI reports 2014 semiconductor photomask sales of $3.2B; Automotive touch panel revenues to hit $1.5B by 2018; Sensor shipments strengthen but falling prices cut sales growth; ClassOne enters ECD lab partnership with Shanghai Sinyang

Monolithic 3D processing using non-equilibrium RTP

04/17/2015  Qualcomm endorses CEA-Leti’s “CoolCube” transistor stacking approach.

Automotive touch panel revenues to hit $1.5B by 2018

04/10/2015  The explosion of touch-enabled screens used in smartphones, tablets and other consumer devices, along with improvements in touch technology, are increasing demand for touch-screen automotive displays.

Solid State Watch: April 3-9, 2015

04/10/2015  SEMI reports 2014 global semiconductor materials sales of $44.3B; Cavendish Kinetics adopts STATS ChipPAC’s wafer level technology; MEMS shipments to reach 43.3B units by 2018; TSMC certifies Synopsys design tools for 16nm finFET plus production

C3Nano Inc. and Kimoto Ltd. Japan partner in a strategic alliance

04/02/2015  C3Nano, Inc., a developer and supplier of solution-based, transparent conductive inks and films announced today that it has entered into a partnership with Kimoto, Ltd. Japan.

Deeper Dive: Xpedition Enables Co-Design of Chips, Packages, Boards

03/31/2015  A new product from Mentor Graphics called Xpedition® Package Integrator provides a new methodology and platform in addition to a new suite of EDA tools. The platform enables chip, package and board designers to easily see how changing various design elements impact adjacent designs, an industry first.

Synopsys founder has plenty of work to do, isn't interested in politics

03/26/2015  Aart de Geus is not running for governor of California.

Cypress and Spansion complete $5 Billion merger

03/13/2015  Cypress Semiconductor Corp. and Spansion, Inc. announced that they have closed the merger of the two companies in an all-stock, tax-free transaction valued at approximately $5 billion.

MicroWatt Chips shown at ISSCC

03/05/2015  With much of future demand for silicon ICs forecasted to be for mobile devices that must conserve battery power, it was natural for much of the focus at the just concluded 2015 International Solid State Circuits Conference (ISSCC) in San Francisco to be on ultra-low-power circuits that run on mere microWatts (µW).

Time to “shift left” in chip design and verification, Synopsys founder says

03/04/2015  Taking “Smart Design from Silicon to Software” as his official theme, Aart de Geus urged attendees to “shift left” – in other words, “squeezing the schedule” to design, verify, debug, and manufacture semiconductors.

Cypress debuts reliable, secure fingerprint sensing solution for mobile devices

03/02/2015  The flexible solution enables designers to create custom home buttons with specialized shapes and sizes or to integrate the sensor into any mobile device’s industrial design or home button.

SPIE Advanced Lithography conference concludes

02/27/2015  Exposures, and reducing their cost, were a theme running through the 2015 SPIE Advanced Lithography Symposium this week in San Jose, Calif., the center of Silicon Valley.

Learning to live with negative tone

02/27/2015  In lithography for manufacturing semiconductors, a negative tone can be a positive attribute.

Directed Self Assembly Hot Topic at SPIE

02/25/2015  At this week’s SPIE Advanced Lithography Symposium in San Jose, Calif., the hottest three-letter acronym is less EUV and more DSA, as in directed self-assembly.

Proponents of EUV, immersion lithography face off at SPIE

02/25/2015  The two main camps in optical lithography are arrayed for battle at the SPIE Advanced Lithography Symposium. EUVt lithography, on one side, is represented by ASML Holding, its Cymer subsidiary, and ASML’s EUV customers, notably Intel, Samsung Electronics, and TSMC. On the other side is 193i immersion lithography, represented by Nikon and its customers, which also include Intel and other leading chipmakers.




HEADLINES

FINANCIALS



TECHNOLOGY PAPERS



Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

ASIC Design Made Cost Effective with Low Cost Tools and Masks

For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs. April 13, 2015
Sponsored by Mentor Graphics

High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

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WEBCASTS



Sensor Fusion and the Role of MEMS in IoT

Thursday May 28, 2015 at 1:00 p.m. EST

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Interconnects

June 2015 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Understanding Defects

July 2015 (Date and time TBD)

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
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VIDEOS



EVENTS



65th Annual ECTC
San Diego, CA
http://www.ectc.net
May 26, 2015 - May 29, 2015
SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015
Design Automation Conference (DAC)
San Francisco, CA
https://dac.com
June 07, 2015 - June 11, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015
SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015