Touch Technologies


As larger TVs gain popularity, TV panel area demand to grow 8% in 2017

01/23/2017  Demand for TV panels in terms of area is forecast to reach 143 million square meters in 2017, up 8 percent from 2016, contributing to a 6 percent growth in the overall display market, according to IHS Markit.

Large area displays market to witness growth owing to the high investments in OLED displays

01/18/2017  According to the latest market study released by Technavio, the global large area displays market is expected to reach USD 78.41 billion by 2021, growing at a CAGR of close to 2%.

Chinese panel makers top over 1M units in quarterly shipments for AMOLED smartphone displays

12/22/2016  Significant improvement in Chinese panel manufacturing technology offers domestic smartphone brands an alternative AMOLED supplier.

Mentor Graphics Joins GLOBALFOUNDRIES FDXcelerator Partner Program

12/22/2016  Mentor Graphics Corp. today announced that it has joined GLOBALFOUNDRIES' FDXcelerator Partner Program.

Linde Korea acquires Air Liquide Korea’s industrial merchant and electronics on-site and liquid bulk air gases business

12/15/2016  Linde Korea, a member of The Linde Group, today announced that it has completed the takeover of Air Liquide Korea’s industrial merchant and electronics on-site and liquid bulk air gases business in South Korea.

EVG and Korea National NanoFab Center program on novel display coatings delivers outstanding results

12/07/2016  EV Group and the Korea National NanoFab Center announced preliminary results on improved transparent nanostructured anti-reflective coatings for next-generation displays.

LCD TV panel makers set lower shipment target for 2017

11/29/2016  Restructuring of older display fabs, migration to larger-sized LCD TV panels and business strategy adjustments are some of the factors prompting LCD TV panel manufacturers to set a conservative shipment goal of 258.4 million units in 2017, a 1.2 percent decline from 2016.

Mentor Graphics Signs Agreement with ARM to Accelerate Early Hardware/Software Development

11/16/2016  Mentor Graphics Corporation (NASDAQ: MENT) has signed a multiyear license agreement with ARM to gain early access to a broad range of ARM Fast Models, Cycle Models and related technologies.

South Korean IT display manufacturers replacing LCD with OLED

10/05/2016  Due to increasing capacity from China, South Korean LCD panel makers are quickly realizing that LCD displays profitability may eventually erode, due to growing capacity and price competition from China, so they are betting their future on organic light-emitting diode (OLED) displays.

Elusive Analog Fault Simulation Finally Grasped

09/27/2016  The test time per logic gate in ICs has greatly decreased in the last 20 years, thanks to scan-based design-for-test (DFT), automatic test pattern generation (ATPG) tools, and scan compression.

SID announces new award for outstanding contributions for active matrix addressed information displays

09/23/2016  The Peter Brody Prize will be awarded to a young researcher under age 40 who has made outstanding contributions in innovating the design and enhancing the performance of active matrix addressed information displays.

Mentor Graphics Extends Offering to Support TSMC 7nm and 16FFC FinFET Process Technologies

09/21/2016  Mentor Graphics Corp. today announced further enhancements and optimizations for various products within the Calibre Platform, and Analog FastSPICE (AFS) Platform, as well as the completion of further certifications and reference flows for Taiwan Semiconductor Manufacturing Corporation (TSMC) 16FFC FinFET and 7nm FinFET processes.

Mentor Graphics Veloce Emulation Platform Used by Starblaze for Verification of SSD Enterprise Storage Design

09/21/2016  Mentor Graphics Corporation today announced that the Veloce emulation platform was successfully used by Starblaze Technology for a specialized high-speed, enterprise-based Solid State Drive (SSD) storage design.

Applied Materials brings its e-beam review technology to the display industry

09/21/2016  Applied Materials, Inc. today introduced the display industry's first high-resolution inline e-beam review (EBR) system, increasing the speed at which manufacturers of OLED and UHD LCD screens can achieve optimum yields and bring new display concepts to market.

Solid State Watch: August 19-25, 2016

08/30/2016  TowerJazz and SMIC’s sales forecast to surge in 2016; Intel to produce 10nm ARM chip designs; GlobalWafers to acquire SunEdison Semiconductor; SEMI posts July 2016 book-to-bill report

Quantum dots with an impermeable shell

08/11/2016  Scientists from the Institute of Physical Chemistry of the Polish Academy of Sciences (IPC PAS) in Warsaw and the Faculty of Chemistry of the Warsaw University of Technology (FC WUT) have shown that zinc oxide (ZnO) quantum dots prepared by an original method developed by them, after modification by the click reaction with the participation of copper ions, fully retain their ability to emit light.

Hardware/Software Co-Development for IoT Applications: Q&A with Marie Semeria, CEO of CEA-Leti

08/03/2016  Marie Semeria, chief executive officer of CEA-Leti (, sat down with SemiMD during SEMICON West to discuss how the French R&D and pilot manufacturing campus—located at the foot of the beautiful French alps near Grenoble—is expanding the scope of it’s activities to develop systems solutions for the Internet-of-Things (IoT).

TouchSystems announces new multi-touch display

08/01/2016  TouchSystems, a provider of professional-grade touch display and digital signage solutions, announced today the latest generation of its P-Series large format touch displays.

OLED to become leading smartphone display technology in 2020

07/25/2016  Although liquid-crystal display (LCD) has dominated mobile phone displays for more than 15 years, organic light-emitting diode (OLED) display technology is set to become the leading smartphone display technology in 2020.

Kateeva: Enabling OLED success

07/13/2016  Kateeva is out to change the way displays are being made, and during Tuesday’s Silicon Innovation Forum keynote, Kateeva President and COO Conor Madigan, PhD, laid out how their YIELDJet inkjet system is making that happen.



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:


Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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