Touch Technologies

TOUCH TECHNOLOGIES ARTICLES



LCD glass area demand to rise 13% from 2015 to 2018

03/23/2016  Unit demand for display glass used for liquid crystal display (LCD) TVs, desktop monitors, mobile PCs and other major large panel applications is forecast to fall in 2016.

3D Chips, New Packaging Challenge Metrology and Inspection Gear

03/21/2016  Metrology and inspection technology is growing more complicated as device dimensions continue to shrink. Discussing crucial trends in the field are Lior Engel, vice president of the Imaging and Process Control Group at Applied Materials, and Rudolph Technologies.

Molecular Modeling of Materials Defects for Yield Recovery

03/21/2016  New materials are being integrated into High Volume Manufacturing (HVM) of semiconductor ICs, while old materials are being extended with more stringent specifications.

Mentor Graphics Enhances Support for TSMC 7nm Design Starts and 10nm Production

03/17/2016  Mentor Graphics Corporation today announced further enhancements and optimizations to the Calibre® platform and Analog FastSPICE™ (AFS) platform by completing TSMC 10nm FinFET V1.0 certification.

Linde Supports New Wave of PV Plants in SE Asia

03/17/2016  The Linde Group supports the expansion of photovoltaic solar cell manufacturing in Southeast Asia by offering its full portfolio of gases and wet chemicals, along with engineering services, to help the new PV cell plants being established in the region.

New MEMS Design Contest Encourages Advances in MEMS Technology

03/16/2016  Jointly sponsored by Cadence Design Systems, Coventor, X-FAB and Reutlingen University, a new MEMS Design Contest is being launched at DATE 2016.

Mentor Graphics Adds Support for Integrated Fan-Out (InFO) Packaging Technology at TSMC

03/14/2016  Mentor Graphics Corporation today announced a design, layout, and verification solution to support design applications for TSMC’s Integrated Fan-Out (InFO) wafer-level packaging technology.

Many Mixes to Match Litho Apps

03/03/2016  "Mix and Match" has long been a mantra for lithographers in the deep-sub-wavelength era of IC device manufacturing.

Microchip announces kit for integrated 2D projected capacitive touch, 3D gestures on displays

02/29/2016  Microchip Technology Inc. today announced the industry's first development kit for integrated 2D projective capacitive touch and 3D gesture recognition on displays.

Wearable device display unit shipments to hit $39M by 2016

02/26/2016  The growing popularity of wearable applications is driving up shipments of the displays used in these devices.

Design-for-Testability (DFT) Verified with Hardware Emulation

02/25/2016  Several years ago, while at Automatic Test Equipment (ATE) leader Teradyne, I witnessed frequent debates on a fundamental dilemma: On the production/testing floor, is it better to pass a failing device or reject a good device?

What’s the Next-Gen Litho Tech? Maybe All of Them

02/25/2016  The annual SPIE Advanced Lithography symposium in San Jose, Calif., hasn’t offered a clear winner in the next-generation lithography race.

Laser Suppliers Move Past the Neon Gas Crisis

02/24/2016  That neon gas shortage? So 2015.

Canon, Toshiba Join eBeam Initiative Group

02/24/2016  The eBeam Initiative announced that Canon and Toshiba are new members of the industry organization.

What to See at the SPIE Advanced Lithography Show

02/22/2016  The SPIE Advanced Lithography conference, from Tuesday, February 23, to Thursday, February 25, offers an incredible amount of technical information in a few long, fun days.

Oversupply to overshadow LCD market in 2016

01/26/2016  The ongoing issue of liquid crystal display (LCD) oversupply -- exacerbated by China’s aggressive investment in production capacity as well as high fab utilization -- will continue well into 2016.

Memristor Variants and Models from Knowm

01/22/2016  Knowm Inc., a start-up pioneering next-generation advanced computing architectures and technology, recently announced the availability of two new variations of memristors targeting different neuromorphic applications.

AMD Net Loss Widens in 2015 on Lower Revenue

01/20/2016  Advanced Micro Devices on Tuesday reported a net loss of $660 million on revenue of $3.99 billion for 2015, compared with a net loss of $403 million on revenue of $5.51 billion in 2014.

ASML Has Record Revenue for 2015; Will Raise Dividend, Buy Back More Stock

01/20/2016  ASML Holding today reported net income of about $1.5 billion on revenue of $6.855 billion for 2015. That compared with 2014’s net income of $1.3 billion on revenue of $6.385 billion.

Apple products spur growth in force sensing display technologies

12/23/2015  Apple’s use of Force Touch technology in the Apple Watch and 3D Touch in the iPhone 6S line is leading to growth in force sensing and other touch-panel enhancements in mobile devices.




TWITTER


WEBCASTS



Semiconductors and the IoT

Tuesday, March 28, 2017 at 1pm ET / Sponsored by Epicor

The rise of Internet of Things (IoT) and the cloud and their associated technologies and platforms are slowly but surely fueling the emergence of new market segments that are shaping and transforming our way of life. Learn how the IoT applications and use-cases that span clients/devices, networks, and data centers are driving new requirements for semiconductors including ultra-low power, ultra-low leakage, smaller and denser packaging, and cost effectiveness. And find out exactly how this IoT trend represents a growth opportunity for the semiconductor industry that has not been seen since the early days of the Internet.

Sponsored By:
Advanced Process Control in Microelectronics Manufacturing: Leveraging Smart Manufacturing and Big Data

Friday, April 7, 2017 at 1pm ET / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

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TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

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EVENTS



CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017

VIDEOS