Touch Technologies

TOUCH TECHNOLOGIES ARTICLES



C3nano seals acquisition of Asia's largest manufacturer of silver nanowire, Aiden Co. Ltd. Korea

04/28/2015  C3nano, Inc. announced today that it has acquired the major supplier of silver nanowire (AgNW) in Asia, Aiden Co. Ltd. of Korea.

Canatu launches high transmittance CNB transparent conductive film for touch sensors

04/27/2015  Canatu, a manufacturer of next generation transparent conductive films and touch sensors, announces a new generation of high optical transmittance CNB (Carbon NanoBud) transparent conductive films at Printed Electronics Europe.

ITRS 2.0: Top-Down System Integration

04/22/2015  ITRS2.0 will, for the first time, develop a top-down system-driven roadmap framework for key semiconductor industry drivers in the 2015-2030 period.

Global 4K display market to reach $52B in 2020

04/20/2015  Once a feature mainly found in next-gen TVs, 4K resolution displays now being adopted in smartphones, PC monitors, OLED displays and notebook PCs.

SOI: Revolutionizing RF and expanding in to new frontiers

04/17/2015  SOI provides the capability to revolutionize RF Front Ends and WAN RFSOCs through innovation in radio architectures.

Solid State Watch: April 10-16, 2015

04/17/2015  SEMI reports 2014 semiconductor photomask sales of $3.2B; Automotive touch panel revenues to hit $1.5B by 2018; Sensor shipments strengthen but falling prices cut sales growth; ClassOne enters ECD lab partnership with Shanghai Sinyang

Monolithic 3D processing using non-equilibrium RTP

04/17/2015  Qualcomm endorses CEA-Leti’s “CoolCube” transistor stacking approach.

Automotive touch panel revenues to hit $1.5B by 2018

04/10/2015  The explosion of touch-enabled screens used in smartphones, tablets and other consumer devices, along with improvements in touch technology, are increasing demand for touch-screen automotive displays.

Solid State Watch: April 3-9, 2015

04/10/2015  SEMI reports 2014 global semiconductor materials sales of $44.3B; Cavendish Kinetics adopts STATS ChipPAC’s wafer level technology; MEMS shipments to reach 43.3B units by 2018; TSMC certifies Synopsys design tools for 16nm finFET plus production

C3Nano Inc. and Kimoto Ltd. Japan partner in a strategic alliance

04/02/2015  C3Nano, Inc., a developer and supplier of solution-based, transparent conductive inks and films announced today that it has entered into a partnership with Kimoto, Ltd. Japan.

Deeper Dive: Xpedition Enables Co-Design of Chips, Packages, Boards

03/31/2015  A new product from Mentor Graphics called Xpedition® Package Integrator provides a new methodology and platform in addition to a new suite of EDA tools. The platform enables chip, package and board designers to easily see how changing various design elements impact adjacent designs, an industry first.

Synopsys founder has plenty of work to do, isn't interested in politics

03/26/2015  Aart de Geus is not running for governor of California.

Cypress and Spansion complete $5 Billion merger

03/13/2015  Cypress Semiconductor Corp. and Spansion, Inc. announced that they have closed the merger of the two companies in an all-stock, tax-free transaction valued at approximately $5 billion.

MicroWatt Chips shown at ISSCC

03/05/2015  With much of future demand for silicon ICs forecasted to be for mobile devices that must conserve battery power, it was natural for much of the focus at the just concluded 2015 International Solid State Circuits Conference (ISSCC) in San Francisco to be on ultra-low-power circuits that run on mere microWatts (µW).

Time to “shift left” in chip design and verification, Synopsys founder says

03/04/2015  Taking “Smart Design from Silicon to Software” as his official theme, Aart de Geus urged attendees to “shift left” – in other words, “squeezing the schedule” to design, verify, debug, and manufacture semiconductors.

Cypress debuts reliable, secure fingerprint sensing solution for mobile devices

03/02/2015  The flexible solution enables designers to create custom home buttons with specialized shapes and sizes or to integrate the sensor into any mobile device’s industrial design or home button.

SPIE Advanced Lithography conference concludes

02/27/2015  Exposures, and reducing their cost, were a theme running through the 2015 SPIE Advanced Lithography Symposium this week in San Jose, Calif., the center of Silicon Valley.

Learning to live with negative tone

02/27/2015  In lithography for manufacturing semiconductors, a negative tone can be a positive attribute.

Directed Self Assembly Hot Topic at SPIE

02/25/2015  At this week’s SPIE Advanced Lithography Symposium in San Jose, Calif., the hottest three-letter acronym is less EUV and more DSA, as in directed self-assembly.

Proponents of EUV, immersion lithography face off at SPIE

02/25/2015  The two main camps in optical lithography are arrayed for battle at the SPIE Advanced Lithography Symposium. EUVt lithography, on one side, is represented by ASML Holding, its Cymer subsidiary, and ASML’s EUV customers, notably Intel, Samsung Electronics, and TSMC. On the other side is 193i immersion lithography, represented by Nikon and its customers, which also include Intel and other leading chipmakers.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
2.5D and 3D Integration

March 2016 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Metrology and Inspection Challenges and Opportunities

March 2016 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



LithoVision 2016
San Jose, CA
https://lithovision.com
February 21, 2016 - February 21, 2016
SEMI-THERM 32
San Jose, CA
http://www.semi-therm.org
March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016