Wafer Level Packaging

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WAFER LEVEL PACKAGING ARTICLES



Silego announces GFET3 integrated power switches in wafer level chip scale packaging

03/27/2017  Silego Technology, a developer of Configurable Mixed-signal Integrated Circuits (CMICs), announced today an extension of its performance-driven GFET3 Integrated Power Switch (IPS) portfolio.

European SEMI Award honors advanced packaging technologists

03/23/2017  At the SEMI Industry Strategy Symposium in Munich, SEMI announced recipients of the European SEMI Award for 2016.

STATS ChipPAC achieves 1.5B unit milestone in fan-out wafer level packaging shipments

03/15/2017  STATS ChipPAC Pte. Ltd., a provider of advanced semiconductor packaging and test services, announced today that it has shipped 1.5 billion fan-out wafer level packages (FOWLP), also known in the industry as embedded Wafer Level Ball Grid Array (eWLB).

Walker discusses emergence of new business models in semiconductor industry

03/14/2017  Jim Walker, who retired from Gartner and is now consulting as World Level Packaging Concepts, gave a plenary talk at the recent IMAPS Device Packaging Conference in Scottsdale on the state of the semiconductor industry which contained some interesting perspectives on emerging new business models.

SEMICON China 2017 opens tomorrow in Shanghai

03/13/2017  Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC).

January semiconductor sales up 14% compared to last year

03/06/2017  Year-to-year growth is market's largest since November 2010; month-to-month sales decrease slightly.

Advanced substrates: A key enabler of future advanced packaging solutions

03/03/2017  Yole analysts provide an overview of advanced substrate technologies, markets, and supply chain.

SEMI appoints Ajit Manocha as president and CEO

02/21/2017  SEMI today announced the appointment of Ajit Manocha as its president and CEO.

Invensas announces Teledyne DALSA sign DBI technology transfer and license agreement

02/17/2017  Wafer bonding and 3D interconnect technology to enable delivery of next-generation MEMS and image sensor solutions.

GE Ventures and Samsung Electro-Mechanics announce global microelectronics packaging patent agreement

02/17/2017  With this partnership, SEMCO will license GE microelectronics packaging patent portfolio, covering the fabrication of substrates embedded with electronic circuits.

Huge growth in cloud memory changes semiconductor supply chain

02/17/2017  The explosive growth in demand for internet bandwidth and cloud computing capacity brings a new set of technology challenges and opportunities for the semiconductor supply chain.

3D and 2.5D IC packaging market expected to be worth $170B by 2022

02/14/2017  The market is expected to be worth USD 170.46 billion in 2022, at a CAGR of 38.30% between 2016 and 2022.

GlobalFoundries 12-inch wafer production line in Chengdu commences operation

02/13/2017  The company will continue investing in its wafer plants in the United States and Germany, expand its capacity in Singapore, and construct a facility to produce 12-inch wafers in Chengdu, China in order to satisfy Chinese and global demands for the company's 22FDX technology.

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TWITTER


WEBCASTS



Semiconductors and the IoT

Tuesday, March 28, 2017 at 1pm ET / Sponsored by Epicor

The rise of Internet of Things (IoT) and the cloud and their associated technologies and platforms are slowly but surely fueling the emergence of new market segments that are shaping and transforming our way of life. Learn how the IoT applications and use-cases that span clients/devices, networks, and data centers are driving new requirements for semiconductors including ultra-low power, ultra-low leakage, smaller and denser packaging, and cost effectiveness. And find out exactly how this IoT trend represents a growth opportunity for the semiconductor industry that has not been seen since the early days of the Internet.

Sponsored By:
Advanced Process Control in Microelectronics Manufacturing: Leveraging Smart Manufacturing and Big Data

Friday, April 7, 2017 at 1pm ET / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

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TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

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EVENTS



CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017

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