05/26/2016 As the opening day of SEMICON West (July 12-14) approaches, the electronics manufacturing industry is experiencing disruptive changes, making “business as usual” a thing of the past. To help technical and business professionals navigate this fast-changing landscape, SEMICON West programming has been upgraded extensively.
05/24/2016 North America-based manufacturers of semiconductor equipment posted $1.59 billion in orders worldwide in April 2016 (three-month average basis) and a book-to-bill ratio of 1.10.
05/18/2016 For the first time, scientists at IBM Research have demonstrated reliably storing 3 bits of data per cell using a relatively new memory technology known as phase-change memory (PCM).
05/12/2016 Qualcomm, Micron, and SK Hynix registered ≥25% drops, with total top-20 sales off by 6%.
05/11/2016 EV Group (EVG) announced that it has received multiple orders for its GEMINI FB XT automated fusion wafer bonders from multiple leading device manufacturers.
05/11/2016 Reflects strong demand for eWLB in mobile market with accelerating adoption in Internet of Things, wearables, MEMS and automotive applications.
05/06/2016 Advanced Semiconductor Engineering, Inc. and Deca Technologies, a subsidiary of Cypress Semiconductor Corp., announced the signing of an agreement whereby ASE will invest $60 million in Deca and will license Deca's M-Series Fan-out Wafer-Level Packaging (FOWLP) technologies and processes.
05/06/2016 The Semiconductor Industry Association (SIA) this week announced worldwide sales of semiconductors reached $26.1 billion for the month of March 2016, a slight increase of 0.3 percent compared to the previous month's total of $26.0 billion.
05/02/2016 According to the latest research study released by Technavio, the global semiconductor stepper system market is expected to reach over USD 6 billion by 2020.
04/29/2016 The world’s leading lithographers gather each year in San Jose, California at SPIE’s Advanced Lithography conference to discuss how to extend optical lithography. So of all the NGL technologies, which will win out in the end?
04/14/2016 To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have been developed by industrial companies.
04/06/2016 Worldwide semiconductor wafer-level manufacturing equipment revenue totaled $33.6 billion in 2015, a 1 percent decline from 2014, according to final results by Gartner, Inc.
03/29/2016 Texas Instruments Incorporated (TI) announced that Devan Iyer has been elected vice president of the company.
June 21, 2016 at 1 PM ET / Sponsored by Air Products
June 2016 (Date and time TBD)/Sponsored by Air Products
June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,
This whitepaper provides a comprehensive overview of parylene conformal
coating, advantages of parylene, and applications for parylene to
protect electronic devices.
As technology continues to advance, devices will encounter rugged
environments and it is vital that they are properly protected. Parylene
conformal coating is one way that manufacturers are giving their devices
a higher level of protection, along with increasing the overall quality
of their products.
Parylene conformal coating applications for Electronics include:
· I/O & PCI Modules
· Power Converters and Supplies
· Other Embedded Computing applications
· Other specialty electronics and assemblies April 26, 2016Sponsored by Diamond-MT
XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016Sponsored by XwinSys Technology Development Ltd.