Wafer Level Packaging

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WAFER LEVEL PACKAGING ARTICLES



2017 IEDM features rich technical program, focus sessions

10/17/2017  Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

China IC industry outlook

10/17/2017  With an increasing presence in the global semiconductor manufacturing supply chain, the market opportunities in China are expanding dramatically.

Leti to present update of CoolCube/3D VLSI tech developments at 2017 IEEE S3S

10/13/2017  Leti, a research institute of CEA Tech, will hold a workshop on Oct. 17 to present updates on their progress developing CoolCube high-density 3D sequential, monolithic-integration technology, and their supporting design-and-manufacturing ecosystems.

IC makers maximize 300mm, 200mm wafer capacity

10/13/2017  A total of 25 new 300mm wafer fabs is expected between 2016 and 2021 as the outlook for 450mm wafers fades.

CMOS image sensor market to witness growth owing to high adoption of innovative technologies

10/10/2017  The global CMOS image sensor market is expected to grow at a CAGR of more than 12% during the forecast period, according to Technavio’s latest market research.

Monthly semiconductor sales reach $35B globally for first time in August

10/04/2017  Worldwide sales up 24 percent year-to-year and 4 percent month-to-month; Americas market leads the way with growth of 39 percent year-to-year and 9 percent month-to month.

Robotics and chip industries in Japan

10/02/2017  Japan chip industry finds growth opportunities in robotics; explored at SEMICON Japan (December 13-15) in Tokyo.

New 3D packaging & integration committee

10/02/2017  The SEMI International Standards Committee, at their SEMICON West 2017 meeting, approved the transformation of the existing 3D Stacked IC Committee and Assembly & Packaging Committee into a single, unified 3D Packaging and Integration Committee.

It’s gonna be a bright, bright sun-shiny day

09/26/2017  Last year was a great year for photovoltaic (PV) technology.

North American semiconductor equipment industry posts August 2017 billings 

09/22/2017  Equipment billings in August declined relative to July, signaling a pause in this year's extraordinary growth.

Leading-edge paves the way for pure-play foundry growth

09/20/2017  Sales of ICs built using <40nm process technology forecast to rise 18% at pure-play foundries.

Scientists demonstrated 1.3 μm submilliamp threshold quantum dot micro-lasers on Si

09/18/2017  Decades ago, the Moore's law predicted that the number of transistors in a dense integrated circuit doubles approximately every two years. This prediction was proved to be right in the past few decades, and the quest for ever smaller and more efficient semiconductor devices have been a driving force in breakthroughs in the technology.

IMAPS 2017 to showcase advances in microelectronics technology

09/15/2017  Researchers and exhibitors will showcase their work during a comprehensive conference program of technical papers, panels, special sessions, short courses/tutorials, and an exhibition that will spotlight premier work in the fields of microelectronics, semiconductor packaging and circuit design.

MORE WAFER-LEVEL-PACKAGING ARTICLES

TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



ITPC2017
Big Island, Hawaii
http://www.semi.org/en/itpc
November 05, 2017 - November 08, 2017
SEMICON Europa
Munich, Germany
http://www.semiconeuropa.org/
November 14, 2017 - November 17, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018

VIDEOS