Wafer Level Packaging

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WAFER LEVEL PACKAGING ARTICLES



SEMICON West 2016 expands technical programming by nearly 50%

05/26/2016  As the opening day of SEMICON West (July 12-14) approaches, the electronics manufacturing industry is experiencing disruptive changes, making “business as usual” a thing of the past. To help technical and business professionals navigate this fast-changing landscape, SEMICON West programming has been upgraded extensively.

North American semiconductor equipment industry posts April 2016 book-to-bill ratio of 1.10

05/24/2016  North America-based manufacturers of semiconductor equipment posted $1.59 billion in orders worldwide in April 2016 (three-month average basis) and a book-to-bill ratio of 1.10.

IBM scientists achieve storage memory breakthrough

05/18/2016  For the first time, scientists at IBM Research have demonstrated reliably storing 3 bits of data per cell using a relatively new memory technology known as phase-change memory (PCM).

Seven Top-20 semiconductor suppliers show double-digit declines

05/12/2016  Qualcomm, Micron, and SK Hynix registered ≥25% drops, with total top-20 sales off by 6%.

EV Group receives multiple orders for GEMINI FB XT fusion bonder for 3D chip stacking production applications

05/11/2016  EV Group (EVG) announced that it has received multiple orders for its GEMINI FB XT automated fusion wafer bonders from multiple leading device manufacturers.

STATS ChipPAC's fan-out wafer level packaging shipments exceed 1 billion units

05/11/2016  Reflects strong demand for eWLB in mobile market with accelerating adoption in Internet of Things, wearables, MEMS and automotive applications.

Cypress subsidiary Deca Technologies to receive $60M investment from ASE

05/06/2016  Advanced Semiconductor Engineering, Inc. and Deca Technologies, a subsidiary of Cypress Semiconductor Corp., announced the signing of an agreement whereby ASE will invest $60 million in Deca and will license Deca's M-Series Fan-out Wafer-Level Packaging (FOWLP) technologies and processes.

Global semiconductor sales increase slightly in March

05/06/2016  The Semiconductor Industry Association (SIA) this week announced worldwide sales of semiconductors reached $26.1 billion for the month of March 2016, a slight increase of 0.3 percent compared to the previous month's total of $26.0 billion.

Demand for miniaturization and integration of ICs to drive the global semiconductor stepper system market until 2020

05/02/2016  According to the latest research study released by Technavio, the global semiconductor stepper system market is expected to reach over USD 6 billion by 2020.

Many mixes to match litho apps

04/29/2016  The world’s leading lithographers gather each year in San Jose, California at SPIE’s Advanced Lithography conference to discuss how to extend optical lithography. So of all the NGL technologies, which will win out in the end?

The advanced packaging industry has reached its zenith

04/14/2016  To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have been developed by industrial companies.

Worldwide semiconductor wafer-level manufacturing equipment market declined 1% in 2015

04/06/2016  Worldwide semiconductor wafer-level manufacturing equipment revenue totaled $33.6 billion in 2015, a 1 percent decline from 2014, according to final results by Gartner, Inc.

Texas Instruments names Devan Iyer Vice President

03/29/2016  Texas Instruments Incorporated (TI) announced that Devan Iyer has been elected vice president of the company.

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TWITTER


WEBCASTS



High Mobility Transistors

June 21, 2016 at 1 PM ET / Sponsored by Air Products

Transistor performance has been greatly improved with strained silicon and high-k metal gates. Further performance improvements could be had by implementing III-V materials in the channel of nMOS transistors. Both III-V and Ge-based channels being considered for the pMOS device. High electron-mobility III-V semiconductors have been intensely researched as alternative channel materials for sub-7 nm technology nodes, but one of the main stumbling blocks is how to integrate them monolithically and cost-effectively with traditional CMOS silicon technology. This webcast will discuss the latest efforts in this area, including vertically stacked III-V nanowire.

Sponsored By:
Interconnection Technologies

June 2016 (Date and time TBD)/Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
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TECHNOLOGY PAPERS



Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

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EVENTS



Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS