Wafer Level Packaging

WAFER LEVEL PACKAGING ARTICLES



Will fan-out packaging be sustainable long-term?

08/23/2016  2016 is a turning point for the Fan-Out market since both leaders, Apple and TSMC, changed the game and may create a trend of acceptance of Fan-Out packages

TowerJazz and SMIC’s sales forecast to surge in 2016

08/23/2016  Total pure-play foundry market expected to jump 9% this year, up from 6% growth in 2015.

Intel to produce 10nm ARM chip designs

08/19/2016  ARM and Intel Custom Foundry this week at the Intel Developer Forum in San Francisco an agreement to accelerate the development and implementation of ARM SoCs on Intel’s 10nm process.

Advanced packaging: Hot topic at SEMICON Taiwan 2016

08/17/2016  SEMI announced today that over 43,000 visitors are expected to attend SEMICON Taiwan September 7-9 at the TWTC Nangang Exhibition Hall in Taipei.

Fan-Out Wafer Level Packaging: Breakthrough advantages and surmountable challenges

08/16/2016  New wafer processing technologies overcome FOWLP’s technical hurdles, paving the way for a new generation of ultra compact, high I/O electronic devices.

Time to uncover the process mystery for IC designs

08/15/2016  Semiconductor processes have long been a mystery for many circuit designers. They didn’t need to worry about how chips were fabricated most of the time, thanks to the many EDA innovations that make their jobs easier and complex designs possible.

Mentor Graphics launches new Xpedition Enterprise Platform

08/15/2016  Mentor Graphics Corporation today announced the first phase of the new Xpedition printed circuit design (PCB) flow to address the increasing complexity of today's advanced systems designs.

As Japan seizes lead in growing semiconductor segments, industry leaders exhibit at SEMICON Japan

08/11/2016  SEMI today announced that SEMICON Japan 2016, at Tokyo Big Sight on December 14-16, has increased exhibition and programming to keep pace with high-growth semiconductor segments in Japan.

Global semiconductor sales increase in second quarter

08/02/2016  The Semiconductor Industry Association today announced worldwide sales of semiconductors reached $79.1 billion during the second quarter of 2016, an increase of 1.0 percent over the previous quarter and a decrease of 5.8 percent compared to the second quarter of 2015.

Ultratech receives 'Outstanding Supplier Award' from SJ Semiconductor

08/02/2016  Ultratech, Inc. today announced that it has received an 'Outstanding Supplier Award' from SJ Semiconductor Corp.

SJSemi and Qualcomm announce mass production of 14nm wafer bumping technology

07/28/2016  SJ Semiconductor Corp. and Qualcomm Technologies, Inc. jointly announced that SJSemi has begun mass production of 14nm wafer bumping for Qualcomm Technologies.

China’s final chance to achieve its IC industry ambitions now underway

07/27/2016  Over the past 20 years, China has become increasingly frustrated over the gap between its IC imports and indigenous IC production

Applied Materials appoints Judy Bruner to Board of Directors

07/25/2016  Applied Materials, Inc. today announced the appointment of Judy Bruner to serve on its Board of Directors. Ms. Bruner has also been appointed to serve as a member of the Audit Committee of the Board.

Worldwide semiconductor capital spending to decline 0.7% in 2016, Gartner reports

07/22/2016  Worldwide semiconductor capital spending is projected to decline 0.7 percent in 2016, to $64.3 billion, according to Gartner, Inc. This is up from the estimated 2 percent decline in Gartner's previous quarterly forecast.

North American semiconductor equipment industry posts June 2016 book-to-bill ratio of 1.00

07/22/2016  Billings activity for equipment companies based in North America are at their highest level since February 2011.

2016 IEEE IEDM to showcase the latest tech developments in micro/nanoelectronics

07/21/2016  Paper-submission deadline is August 10 this year; Supplier exhibition to be held in conjunction with technical program.

Packaging and displays drive new litho requirements

07/13/2016  Fan-out wafer level packaging (FOWLP) is gaining traction, leading to higher I/Os and larger formats, and new mobile displays are pushing the limits of pixel per inch (PPI) while also moving to larger formats.

SEMICON West Day 2: Don't Miss

07/13/2016  Gear up for Day 2 of SEMICON West with this list of must-see conference events.

200mm fabs reawakening

07/13/2016  Buoyed by strong investments in China, 200mm wafer production is seeing a re-awakening, with overall 200mm capacity expected to match its previous 2006 peak level by 2019.

Rudolph Technologies announces new Clearfind technology for advanced packaging inspection

07/11/2016  Clearfind technology sees organic defects that often escape detection with conventional white-light inspection technologies.




TWITTER


WEBCASTS



Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

Date and time TBD / Sponsored by Epicor

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
Interconnection Technologies

August 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

More Technology Papers

EVENTS



European MEMS Summit 2016
Stuttgart, Germany
http://www.semi.org/eu/node/8871
September 15, 2016 - September 16, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS