Wafer Level Packaging


Altatech adds new high-speed inspection system dedicated to ultra-thin substrates for 3D applications

10/05/2015  Altatech announced the expansion of its Eclipse series with a new, high-speed inspection system dedicated to ultra-thin, transparent and bonded substrates inspection for 3D applications in power, MEMS, and mobile technologies.

SDK to Offer SiC Epitaxial Wafers with very low defect density

10/05/2015  Showa Denko has developed a new grade of silicon carbide (SiC) epitaxial wafers for power devices with very low defect density.

Monolithic 3D - Game-Changing 2.0 at IEEE S3S

10/05/2015  The path to alternative scaling is now open.

SPIE Photomask Panel: Money Is An Issue

10/02/2015  "Money (That’s What I Want)" could have been the theme song for playing off the EUV Mask Readiness panel discussion on Thursday morning (October 1) at the SPIE Photomask Technology conference in Monterey, California.

Novati Technologies launches advanced integrated sensor platform

09/30/2015  Novati Technologies Inc. announced the availability of an advanced Integrated Sensor Platform, placing a wide variety of sensors onto multi-layer stacks of wafers in order to consume less power and perform significantly faster while reducing overall footprint.

Intel Mask Engineer Reports "Steady Progress" in EUV Masks

09/30/2015  Intel has been working on photomasks for extreme-ultraviolet lithography for more than a decade, and has recently logged significant progress.

Mask Conference Highlights Progress in Lithography

09/30/2015  Harry J. Levinson, senior director of technology research at GlobalFoundries, took “Lithography and Mask Challenges at the Leading Edge” as the theme for his keynote presentation Tuesday morning, opening the SPIE Photomask Technology 2015 conference in Monterey, California.

Advantest and D2S partner to tackle CD uniformity errors for advanced photomasks

09/29/2015  D2S announced that it has partnered with Advantest to integrate D2S' Wafer Plane Analysis engine into Advantest's Mask MVM-SEM (Multi Vision Metrology Scanning Electron Microscope) systems.

Rudolph acquires inspection technology of Stella Alliance, LLC

09/29/2015  Acquired patents to enhance Rudolph’s inspection capabilities in advanced packaging and extend inspection into new applications

2016 Symposia on VLSI Technology and Circuits announces call for papers

09/28/2015  The official Call for Papers has been issued for the 2016 Symposia on VLSI Technology and Circuits, to be held at the Hilton Hawaiian Village June 13-16, 2016 (Technology) and June 15-17, 2016 (Circuits).

CMP Technology Evolving to Engineer Surfaces

09/28/2015  New devices, materials, and substrates challenge atomic-scale integration.

ams offers truly scalable transistors in High-Voltage CMOS

09/28/2015  The Full Service Foundry division of ams AG today announced a further expansion of its industry-leading 0.35µm High-Voltage CMOS specialty process platform.

SEMI Conference Addresses Issues in Semiconductor Materials

09/25/2015  The overall theme for the conference was “Materials for a Smart and Interconnected World.” It featured sessions on “Material Enabling Silicon Everywhere”, “New Emerging Materials Technology & Opportunities at the Edge,” sustainable manufacturing, and a panel of executives from semiconductor manufacturers providing “A View from the Fabs.”

Linde Electronics Presents 2014 Global Supplier Awards

09/25/2015  Electronic Fluorocarbons LLC and Albemarle Corporation recognized for quality, safety, service and technology performance.

GlobalFoundries CTO Calls for Innovation in Chip Materials

09/24/2015  Gary Patton, chief technology officer of GlobalFoundries and head of the company’s worldwide research and development, called for innovation in chip materials in his keynote address on Tuesday at SEMI’s Strategic Materials Conference in Mountain View, Calif.

Mentor Graphics Presents at TSMC Forum

09/21/2015  Mentor Graphics had a hand in presenting two of the 30 papers offered Thursday at Taiwan Semiconductor Manufacturing’s Open Innovation Platform Ecosystem Forum in Santa Clara, Calif.

TSMC Moves from 16nm to 10nm to 7nm

09/21/2015  While Taiwan Semiconductor Manufacturing continues to fine-tune its 16-nanometer FinFET process, the world’s largest silicon foundry will begin making chips with 10nm features later this year and will put 7nm chips into risk production in early 2017.

Process Watch: Risky business

09/18/2015  This is the ninth in a series of 10 installments that explore certain fundamental truths about process control--defect inspection and metrology--for the semiconductor industry.

TSMC Forum Emphasizes Industry Collaboration

09/17/2015  Taiwan Semiconductor Manufacturing kicked off its Open Innovation Platform (OIP) Ecosystem Forum with thanks – not for another beautiful day in Silicon Valley, but for the collaborative work it does with its customers, suppliers, and other industry partners.

OEM Group Announces New Cintillio-S (TM) Automated Batch Wet Chemical Processing System

09/14/2015  Global semiconductor capital equipment manufacturer OEM Group announced today that it has launched its new Cintillio-S (TM) automated batch wet chemical processing system.




Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

More Technology Papers


3D NAND Challenges and Opportunities

December 16, 2015 at 12:00 p.m. ET

Flash memory has revolutionized the world of solid-state data storage, mainly because of the advent of NAND technology. However, from the technical point of view, this requires a major change in how these memories are being fabricated. This presentation will discuss this (r)evolution as well as its major scaling limitations.

Sponsored By:
IoT Device Trends and Challenges

January 2016 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts



International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015