Wafer Level Packaging

WAFER LEVEL PACKAGING ARTICLES



Semiconductor plastic packaging materials market to approach $21B by 2017

01/15/2014  The market for semiconductor packaging materials, including thermal interface materials, is expected to maintain its $20 billion value through 2017, despite shifts away from the use of precious metals such as gold in wire bonding.

Xilinx and University of Florida honored with SEMI Award for advancements in interposers and CMOS fab process

01/15/2014  SEMI today announced that two teams — from the University of Florida and Xilinx — are recipients of the 2013 SEMI Award for North America.

Economic recovery and pervasive computing to propel semiconductor manufacturing supply chain

01/14/2014  Macroeconomic and microelectronic industry growth opportunities and innovation challenges underscored diverse perspectives from analysts, economists, technologists, semiconductor manufacturers and supply chain executives speaking at the SEMI Industry Strategy Symposium (ISS) that opened yesterday.

Imec celebrates 30 years

01/14/2014  Nanotechnology research and development center imec, today announced the celebration of its 30th anniversary.

Imec, AlixPartners to develop model for lowering costs of advanced semiconductor tech

01/13/2014  Patterning options for N10/N7 nodes, advanced packaging solutions and 3D NAND memory to be targeted.

Safety critical devices drive fast adoption of advanced DFT

01/06/2014  Devices used in safety critical applications such as automobiles need be known to work and have the ability to be regularly verified. Therefore, a very high-quality test is important as well as method to perform a built-in self-test.

Why SOI is the Future Technology of Semiconductors

12/23/2013  Zvi Or-Bach, President and CEO of MonolithIC 3D, blogs that this is the "one learning" we can take away from IEDM 2013.

The Week in Review: Dec. 20, 2013

12/20/2013  AMD and Hynix close to commercialization of HBM; Intel's 22nm mobile processor; SEMI's book-to-bill report; Soitec and CEA renew partnership; Micron collaborates with Broadcom on DRAM timing issue

Experts At The Table: Exploring the relationship between board-level design and 3D, and stacked, dies

12/17/2013  SemiMD discussed what board level design can tell us about chip-level (three-dimensional) 3D and stacked dies with Sesh Ramaswami, Applied Materials’ Managing Director, TSV and Advanced Packaging, Advanced Product Technology Development, and Kevin Rinebold, Cadence’s Senior Product Marketing Manager.

AMD and Hynix announce joint development of HBM memory stacks

12/16/2013  3DIC memory, and therefore all of 2.5/3D technology, took one step closer to full commercialization last week with the HBM joint development announcement from AMD and Hynix at the RTI 3D ASIP meeting in Burlingame CA.

Singapore-MIT Alliance for Research Technology orders EV Group automated production bonding system

12/10/2013  SMART, which is a leading research center established by the Massachusetts Institute of Technology (MIT) in partnership with the National Research Foundation of Singapore, will utilize the EVG850LT system to support its advanced substrate development efforts.

Research Alert: Dec. 10, 2013

12/10/2013  Thin, flexible solar cells; Polymers can be semimetals; MOF materials

Growing interest in the physics of nanostructures to drive demand for thin films

12/06/2013  GIA invites senior industry executives, domain experts, technologists and market strategists to participate in a comprehensive global research initiative studying the “Thin Films” markets.

The Week in Review: Dec. 6, 2013

12/06/2013  Worldwide semiconductor sales; Soitec announces high-volume manufacturing of eSI substrates; SEMI releases World Fab Forecast; Micron announces new VP of Quality; Industry on track for highest-ever annual sales in 2013

Equipment spending down 2013; expect 33% growth in 2014

12/06/2013  Fab construction projects boom in 2013 but slow in 2014.

RF-SOI Wafers for Wireless Applications

12/05/2013  The increasing demand for wireless data bandwidth and the emergence of LTE and LTE Advanced standards pushes radio-frequency (RF) IC designers to develop devices with higher levels of integrated RF functions, meeting more and more stringent specification levels. The substrates on which those devices are manufactured play a major role in achieving that level of performance.

FinFET on SOI: Potential Becomes Reality

12/05/2013  We report here empirical results demonstrating the electrical benefits of SOI-based FinFETs. There are benefits inherent in the elimination of dopant as the means to establish the effective device dimensions. However, significant compromise is unavoidable when using doping as a means of isolation, as in bulk-based FinFETs.

Research Alert: Dec. 3, 2013

12/03/2013  Imec integrates CCD and CMOS technology; New thermoelectronic generator; Nanoscale coating improves stability and efficiency of devices for renewable fuel generation

Blog Review: December 2, 2013

12/02/2013  New blogs examine packaging news from Semicon Taiwan, how dynamic resource allocation during post-tapeout flow can increase turnaround time, the role of hardware in sensor fusion, and the Internet’s progress since its birth 44 years ago.

Advances in Post-Tape Out Resource Management

11/25/2013  Foundries, both pure-play and independent device manufacturers (IDM), rigorously compete for market share. One factor that helps them get and keep business is turnaround time (TAT). As technology nodes advance, achieving targeted production runtimes in the post-tapeout flow gets ever more challenging.




FINANCIALS



TECHNOLOGY PAPERS



UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

Versatile Epoxy Compounds for Electronic Applications

Electronic systems have revolutionized our lives. We use them in nearly all of our daily activities, for communication, computing, navigation, entertainment, payment processing, and more. They are the workhorses in many medical, transportation, aerospace, and military systems, performing functions such as automated control, data analysis, and pattern recognition.February 10, 2014
Sponsored by Master Bond, Inc.,

Enhancing the Performance of Electronic Applications with Versatile Epoxy Compounds

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014