Wafer Level Packaging

WAFER LEVEL PACKAGING ARTICLES



3D-IC: Two for one

09/25/2013  Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about upcoming events related to 3D ICs.

Pitching for IC packages

09/13/2013  Itty bitty computers, smart phones, ipods, and more – these “must have” small electronic devices that Apple Computer and other companies have popularized, are forcing the hand of IC package designers to shrink the package to fit within these little hand-held gadgets.

The advantages of a hybrid scan test solution

09/12/2013  Scan testing is the standard practice for test of integrated circuits. The vast majority of IC production test is based on automatic test pattern generation (ATPG) using the scan logic.

Fab equipment spending up 25% in 2014

09/09/2013  Semiconductor revenue has improved in 2013 compared to 2012 and early forecasts for 2014 project revenue growth averaging about eight percent.

Will 2014 be the next Golden Year?

09/05/2013  Some unexpected underdogs spur spending spree.

EV Group unveils new via-filling process to improve reliability of 3D-IC/TSV packaging

09/04/2013  EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled a new polymer via-filling process for 3D-IC/through-silicon-via semiconductor packaging applications.

Dow Corning and EV Group to collaborate on temporary bonding materials for 3D-IC

09/03/2013  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced today that Dow Corning has joined its network of top technology providers to support EVG's LowTemp platform for room-temperature wafer bonding and debonding processes.

Cascade Microtech and imec successfully probe 25µm-diameter micro-bumps

08/01/2013 

Cascade Microtech, Inc. and imec today announced breakthroughs in probing stacked integrated circuits (3D-SICs), fueling an important growth engine for the semiconductor market.

Amkor completes acquisition of Toshiba’s Malaysian semiconductor packaging and test operations

07/31/2013 

Toshiba Corporation and Amkor Technology, Inc. today announced that the companies have completed Amkor’s acquisition of Toshiba Electronics Malaysia Sdn. Bhd., Toshiba’s semiconductor packaging operation in Malaysia.

IDC forecasts worldwide semiconductor revenue will grow 6.9% in 2013

07/30/2013 

Semiconductor revenue worldwide will see improved growth this year of 6.9 percent and reaching $320 billion according to the mid-year 2013 update of the Semiconductor Applications Forecaster (SAF) from International Data Corporation (IDC).

Rudolph announces new metrology suite for advanced packaging

07/24/2013 

Rudolph Technologies, Inc., a provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, today released three new application-specific configurations of its industry-leading NSX 320 Automated Macro Defect Inspection System.

Cree SiC MOSFETs to be incorporated into advanced power suppliers from Delta Elektronika

07/22/2013 

Cree, Inc. announces that its 1200 V SiC MOSFETs are being incorporated into the latest advanced power supplies from Delta Elektronika BV.

Alchimer signs collaboration with CEA-Leti

07/09/2013 

Alchimer, S.A. today announced a collaboration with the French research institute CEA-Leti to evaluate and implement Alchimer's wet deposition processes for 300mm high-volume manufacturing.

Options for adding memory and logic to printed or flexible electronics

07/02/2013 

Developers have made major progress in the technology to manufacture printed or flexible circuits, sensors, batteries and displays. But frankly it’s been hard to build applications with much market pull without logic or memory as well, and those have been much harder to make.

Deca Technologies appoints Chris Seams as CEO

06/24/2013 

Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced it has named semiconductor industry veteran Chris Seams its new CEO.

TSMC keynoter suggests WLSI at IITC

06/14/2013 

In a keynote at the IEEE International Interconnect Technology Conference (IITC), Douglas Yu from TSMC talked about Moore’s Law scaling becoming increasingly difficult.

"Generation Mobile": Advanced Packaging Technology at SEMICON West

06/06/2013 

Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function.

Fab equipment spending: 23% growth for 2014

06/04/2013 

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.

Dow Corning and SÜSS MicroTec report new temporary bonding solution for 2.5D and 3D IC packaging

05/29/2013 

The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at ECTC 2013, with the report of an advanced new temporary bonding solution for 3D TSV semiconductor packaging.

OMRON develops MEMS non-contact thermal sensor utilizing wafer-level vacuum packaging

05/29/2013 

OMRON Corporation today announced that they have finished development work on the world's first infrared sensor manufactured with wafer-level vacuum packaging technology to create a 16x16 element MEMS non-contact infrared thermal sensor capable of highly precise 90-degree area detection.




FINANCIALS



TECHNOLOGY PAPERS



UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

Versatile Epoxy Compounds for Electronic Applications

Electronic systems have revolutionized our lives. We use them in nearly all of our daily activities, for communication, computing, navigation, entertainment, payment processing, and more. They are the workhorses in many medical, transportation, aerospace, and military systems, performing functions such as automated control, data analysis, and pattern recognition.February 10, 2014
Sponsored by Master Bond, Inc.,

Enhancing the Performance of Electronic Applications with Versatile Epoxy Compounds

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014