Wafer Level Packaging


Comparison 1Y nanometer NAND architecture and beyond

08/17/2015  Do we still think the 2D NAND Flash technologies have hit the scaling wall?

Samsung Begins Mass Producing Industry First 256-Gigabit, 3D V-NAND

08/11/2015  Samsung Electronics has begun mass producing the industry’s first 256-gigabit (Gb), three-dimensional (3D) Vertical NAND (V-NAND) flash memory based on 48 layers of 3-bit multi-level-cell (MLC) arrays for use in solid state drives (SSDs).

Samsung cuts Intel's semiconductor sales lead to 16% in second quarter

08/06/2015  Samsung’s excellent growth rate in 2Q15 put the company closer to catching Intel and becoming the world’s leading semiconductor supplier.

STATS ChipPAC appoints co-president and CEO

08/05/2015  STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, announced today the promotion and appointment of Dr. Han Byung Joon as Co-President and Chief Executive Officer for the Company, together with Mr. Tan Lay Koon.

A*STAR's IME Consortium announces development of innovative advanced packaging solutions

08/04/2015  Following the launch of the 12th Electronics Packaging Research Consortium (EPRC12) in 2013, A*STAR’s Institute of Microelectronics (IME) and 11 of its consortium partners across the semiconductor supply chain have developed novel solutions in integrated circuit (IC) packaging.

Qualcomm appoints Sunil Lalvani as vice president and president of Qualcomm India

07/27/2015  Qualcomm Incorporated today announced the appointment of Sunil Lalvani as vice president and president of Qualcomm India, and the departure of Avneesh Agrawal, senior vice president and president of Qualcomm India and South Asia.

Got MEMS? Get In Touch With memsstar For Production Equipment

07/17/2015  As you might guess from the company’s name, memsstar is involved in microelectromechanical system (MEMS) devices. The company offers manufacturing equipment for “MEMS-specific production,” says CEO Tony McKie.

Tanaka Precious Metals Is Big in Bonding Wires, Other Products

07/17/2015  Tanaka Precious Metals, a company dating back to 1885, is a leading supplier of gold bonding wire and other types of bonding wire for semiconductor packaging. It also specializes in electroplating equipment, unveiling a new system for research and development applications at SEMICON West 2015.

Business is good for vendors of test and inspection/metrology equipment

07/16/2015  Semiconductor test equipment and inspection/metrology equipment are unglamorous yet critical segments of the equipment field.

Inspection smooths a bumpy road

07/16/2015  Wafer bumping has several advantages over traditional wire bonding. Bumps can be placed almost anywhere on the die, where wire bonding is limited to the periphery of the devices. And bumps give you the ability to put many more I/O points on an individual die.

International Consortium Sets Up Shop for Advanced Manufacturing Research

07/16/2015  A metropolitan area in the center of the state is putting together a public-private partnership to attract high-tech companies, convincing them to set up shop and create jobs. Part of the attraction is a big public university, engaging in advanced research.

Low-Cost Manufacturing of Flexible Functionalities

07/15/2015  FlexTech Alliance updates on substrates, processes, and devices.

Gases: Completely Necessary to Semiconductor Manufacturing

07/15/2015  Silicon wafers. Semiconductor packaging. These are commonly known products in materials for manufacturing and assembling microchips. Process gases? Not as familiar a commodity, yet they are just as critical to semiconductor manufacturing.

CoorsTek Increases its Business with Covalent Acquisition, Organic Growth

07/14/2015  CoorsTek made one of the biggest acquisitions of its century-long history late last year in purchasing Covalent Materials, formerly known as Toshiba Ceramics.

Keynote panel: Challenges abound for sub-14nm

07/14/2015  SEMICON West 2015 kicked off Tuesday morning with a keynote panel session that addressed the challenges of "Scaling the Walls of Sub-14nm Manufacturing."

Technologies for Advanced Systems Shown at IMEC Tech Forum USA

07/14/2015  R&D summarized of the nanoscale building blocks for our fab future.

Controlling measurements of WLP on high mix, high volume manufacturing

07/14/2015  The demand for 4-mask layer Cu-plated wafer-level chip scale packaging (WLCSP) is increasing rapidly, and the current capability for in-line Cu height measurements is not suitable for high volume manufacturing (HVM).

Process Watch: Increasing process steps and the tyranny of numbers

07/06/2015  Moving to the next design rule can be stressful for the inspection and metrology engineer. Like everything else in the fab, process control generally doesn’t get any easier as design rules shrink and new processes are introduced.

GLOBALFOUNDRIES completes acquisition of IBM Microelectronics business

07/01/2015  GLOBALFOUNDRIES today announced that it has completed its acquisition of IBM’s Microelectronics business.

EMC2015 - New Devices, Old Tricks

06/30/2015  The 57th annual Electronic Materials Conference, held June 24-26 in Columbus, Ohio, showcased research and development (R&D) of new device structures, as well as new insights into the process-structure-properties relationships of electronic devices now running in high-volume manufacturing (HVM) lines globally.




Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

More Technology Papers


3D NAND Challenges and Opportunities

December 16, 2015 at 12:00 p.m. ET

Flash memory has revolutionized the world of solid-state data storage, mainly because of the advent of NAND technology. However, from the technical point of view, this requires a major change in how these memories are being fabricated. This presentation will discuss this (r)evolution as well as its major scaling limitations.

Sponsored By:
IoT Device Trends and Challenges

January 2016 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts



International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015