Wafer Level Packaging


SkyWater significantly expands pure-play technology foundry customer base

11/16/2017  SkyWater Technology Foundry announces that it has been assigned the Specialty Foundry customer relationships from Cypress Semiconductor Corporation.

Will Samsung's 2017 semi capex deliver knockout blow to competition?

11/15/2017  The company’s $26 billion in 2017 outlays expected to be more than Intel and TSMC combined.

First SEMICON Europa opens this year in co-location with productronica

11/14/2017  Semiconductor industry back on track for growth in Europe -- major new investments.

Leti demonstrates world's first 300mm wafer-to-wafer direct hybrid bonding with 1-micron pitch

11/13/2017  New pitch record in copper hybrid bonding with outstanding wafer-to-wafer overlay accuracy represents a breakthrough in enabling 3D high-density IC applications.

A*STAR IME's new multi-chip FOWLP development line to drive innovation and growth in semiconductor industry

11/08/2017  A*STAR’s Institute of Microelectronics (IME) has established a development line to accelerate the development of fan-out wafer level packaging (FOWLP) capabilities for next-generation Internet of Things (IoT) technologies.

DARPA's new initiative

11/08/2017  Earlier this year, DARPA's Microsystems Technology Office (MTO) announced a new Electronics Resurgence Initiative (ERI) "to open pathways for far-reaching improvements in electronics performance well beyond the limits of traditional scaling."

Enabling the A.I. era

11/08/2017  There’s a strongly held belief now that the way in which semiconductors will be designed and manufactured in the future will be largely determined by a variety of rapidly growing applications, including artificial intelligence/deep learning, virtual and augmented reality, 5G, automotive, the IoT and many other uses, such as bioelectronics and drones. The key question for most semiconductor manufacturers is how can they benefit from these trends?

The intelligence that leads to artificial intelligence

11/08/2017  Artificial intelligence (AI) may be a hot topic today, but SEMI has helped to incubate Big Data and AI since its founding.

2017 sees advances in connected devices, memory

11/07/2017  The technologies to watch identified by TechInsights analysts at the beginning of the year have not been disappointing.

How to solve the BEOL RC delay problem?

11/07/2017  The RC delay issues started a few nodes ago, and the problems are becoming worse.

Broadcom proposes to acquire Qualcomm

11/06/2017  The Broadcom proposal stands whether Qualcomm's pending acquisition of NXP Semiconductors N.V. is consummated on the currently disclosed terms of $110 per NXP share or the transaction is terminated.

Global semiconductor industry posts highest-ever quarterly sales

11/01/2017  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $107.9 billion for the third quarter of 2017, marking the industry’s highest-ever quarterly sales and an increase of 10.2 percent compared to the previous quarter.

Wafer-level packaging device shipments to overtake flip chip tech in 2018

10/24/2017  The number of IC packages utilizing wafer-level packaging (WLP) will overtake flip chip shipments in 2018 and then continue growing at a compound annual growth rate of 15% (between 2014 and 2020) compared to just 5% for flip chip, according to the report recently published by The Information Network.

ASE, Amkor and JCET expected to top TrendForce's revenue ranking of OSAT providers for 2017

10/18/2017  The annual revenue from the global IC testing and packaging industry for 2017 is estimated to grow by 2.2% to reach US$51.73 billion, according to the latest research from TrendForce.

2017 IEDM features rich technical program, focus sessions

10/17/2017  Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

China IC industry outlook

10/17/2017  With an increasing presence in the global semiconductor manufacturing supply chain, the market opportunities in China are expanding dramatically.

Leti to present update of CoolCube/3D VLSI tech developments at 2017 IEEE S3S

10/13/2017  Leti, a research institute of CEA Tech, will hold a workshop on Oct. 17 to present updates on their progress developing CoolCube high-density 3D sequential, monolithic-integration technology, and their supporting design-and-manufacturing ecosystems.

IC makers maximize 300mm, 200mm wafer capacity

10/13/2017  A total of 25 new 300mm wafer fabs is expected between 2016 and 2021 as the outlook for 450mm wafers fades.

CMOS image sensor market to witness growth owing to high adoption of innovative technologies

10/10/2017  The global CMOS image sensor market is expected to grow at a CAGR of more than 12% during the forecast period, according to Technavio’s latest market research.

Monthly semiconductor sales reach $35B globally for first time in August

10/04/2017  Worldwide sales up 24 percent year-to-year and 4 percent month-to-month; Americas market leads the way with growth of 39 percent year-to-year and 9 percent month-to month.



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:


Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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San Jose, CA
March 19, 2018 - March 23, 2018
LED Expo Thailand
Bangkok, Thailand
May 10, 2018 - May 12, 2018

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