Wafer Processing

MAGAZINE



WAFER PROCESSING ARTICLES



Praxair signs long-term agreement to supply nitrogen to GLOBALFOUNDRIES

10/18/2017  Praxair will build, own and operate a plant to support GLOBALFOUNDRIES’ advanced manufacturing processes at its Malta fabrication facility.

2017 IEDM features rich technical program, focus sessions

10/17/2017  Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

Wafer shipments forecast to increase in 2017, 2018 and 2019

10/17/2017  Total wafer shipments this year are expected to exceed the market high set in 2016 and are forecast to continue shipping at record levels in 2018 and 2019.

China IC industry outlook

10/17/2017  With an increasing presence in the global semiconductor manufacturing supply chain, the market opportunities in China are expanding dramatically.

Dr. Haijun Zhao, Dr. Liang Mong Song appointed as SMIC co-CEO and Executive Director

10/16/2017  Semiconductor Manufacturing International Corporation today announced the appointment of Dr. Haijun Zhao and Dr. Liang Mong Song as SMIC Co-CEO and Executive Director.

sureCore joins GLOBALFOUNDRIES FDXcelerator Partner Program

10/16/2017  sureCore to make its Low Power SRAMs available in 22FDX.

Spin current detection in quantum materials unlocks potential for alternative electronics

10/13/2017  A new method that precisely measures the mysterious behavior and magnetic properties of electrons flowing across the surface of quantum materials could open a path to next-generation electronics.

ClassOne’s new integrated financing streamlines equipment purchasing

10/13/2017  ClassOne Group, provider of semiconductor processing systems, today announced a special new financing program that seeks to give more attractive options to equipment purchasers.

IC makers maximize 300mm, 200mm wafer capacity

10/13/2017  A total of 25 new 300mm wafer fabs is expected between 2016 and 2021 as the outlook for 450mm wafers fades.

A new miniature solution for storing renewable energy

10/12/2017  Novel two-dimensional, metal organic hybrids efficiently move charge, eventually storing renewable energy.

Semiconductor IP market worth $6.22B by 2023

10/11/2017  The semiconductor IP market is expected to be valued at USD 6.22 billion by 2023, at a CAGR of 4.87% between 2017 and 2023.

A massive adoption of laser technologies for semiconductor manufacturing

10/11/2017  According to Yole Développement (Yole), the laser equipment market will grow at a 15% CAGR between 2016 and 2022 and should reach more than US$4 billion by 2022.

Fujitsu Semiconductor and ON Semiconductor announce increased strategic partnership

10/10/2017  ON Semiconductor agrees to purchase 30 percent incremental share of Fujitsu’s 8-inch wafer fab in Aizu-Wakamatsu, Japan, resulting in 40 percent ownership with plans to increase to 60 percent by the second half of 2018 and full ownership in the first half of 2020.

MORE WAFER-PROCESSING ARTICLES

TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



ITPC2017
Big Island, Hawaii
http://www.semi.org/en/itpc
November 05, 2017 - November 08, 2017
SEMICON Europa
Munich, Germany
http://www.semiconeuropa.org/
November 14, 2017 - November 17, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018

VIDEOS