Wafer Processing

MAGAZINE



WAFER PROCESSING ARTICLES



Order activity for semiconductor equipment holds steady in July

08/21/2014  North America-based manufacturers of semiconductor equipment posted $1.41 billion in orders worldwide in July 2014 (three-month average basis) and a book-to-bill ratio of 1.07, according to the July EMDS Book-to-Bill Report published today by SEMI.

Promising ferroelectric materials suffer from unexpected electric polarizations

08/19/2014  Electronic devices with unprecedented efficiency and data storage may someday run on ferroelectrics—remarkable materials that use built-in electric polarizations to read and write digital information, outperforming the magnets inside most popular data-driven technology.

ON Semiconductor completes acquisition of Aptina Imaging

08/18/2014  ON Semiconductor today announced the completion of its acquisition of Aptina Imaging.

Researchers prove stability of wonder material silicene

08/15/2014  An international team of researchers has taken a significant step towards understanding the fundamental properties of the two-dimensional material silicene by showing that it can remain stable in the presence of oxygen.

The growing semiconductor market in India

08/14/2014  The semiconductor industry in India is estimated to grow from $10.02 billion in 2013 to $52.58 billion in 2020 at CAGR of 26.72%, according to Research and Markets new report the "Semiconductor Market in India 2014 - 2020."

New test reveals purity of graphene

08/13/2014  Graphene may be tough, but those who handle it had better be tender. The environment surrounding the atom-thick carbon material can influence its electronic performance, according to researchers at Rice and Osaka universities who have come up with a simple way to spot contaminants.

Pairing old technologies with new for next-generation electronic devices

08/12/2014  UCL scientists have discovered a new method to efficiently generate and control currents based on the magnetic nature of electrons in semiconducting materials, offering a radical way to develop a new generation of electronic devices.

MORE WAFER-PROCESSING ARTICLES

HEADLINES

Harwood Feffer LLP Announces Investigation of Peregrine Semiconductor Corporation
August 22, 2014

QuantumClean® and ChemTrace® to exhibit at SEMICON Taiwan 2014; Leading global provider of validated high-purity outsourced process tool parts cleaning, performance coatings, refurbishment, and analytical & engineering services, and leading reference microcontamination analytical laboratory to the semiconductor industry exhibit at SEMICON Taiwan 2014 tradeshow.
August 22, 2014

QuantumClean® and ChemTrace® to exhibit at SEMICON Taiwan 2014; Leading global provider of validated high-purity outsourced process tool parts cleaning, performance coatings, refurbishment, and analytical & engineering services, and leading reference microcontamination analytical laboratory to the semiconductor industry exhibit at SEMICON Taiwan 2014 tradeshow.
August 22, 2014

PEREGRINE ALERT: Proposed Sale of Peregrine Semiconductor Corporation Being Investigated by Johnson & Weaver, LLP
August 22, 2014

Energy Efficiency Electrifies SEMICON Europa: Low Power and Power Electronics
August 22, 2014

North American Semiconductor Equipment Industry Posts July 2014 Book-to-Bill Ratio of 1.07
August 22, 2014

Murata Electronics North America Inc agreed to acquire Peregrine Semiconductor Corp
August 22, 2014

Germany,United States : INFINEON inks deal to buy International Rectifier
August 22, 2014

Concord Components announces distribution agreement with America Semiconductor
August 20, 2014

RIT HOSTS WAYNE COUNTY HIGH SCHOOL TEACHERS AS PART OF STEM MATH AND SCIENCE PARTNERSHIPS GRANT FUNDS PROFESSIONAL DEVELOPMENT IN SCIENCE, MATH AND ENGINEERING INSTRUCTIONAL PRACTICES FOR REGIONAL SCIENCE CONSORTIUM
August 19, 2014

FINANCIALS



TECHNOLOGY PAPERS



Parylene 101: Learn about the best protection for MEMS

This paper explains the basic history, processes, and applications of the ultimate conformal coating, parylene. Parylene has historically been used to protect printed circuit boards, LEDS, and medical devices from rugged environments and the human body, but now the pin-hole free coating is being used increasingly by the leaders in the MEMS market. With no known chemical that can harm the film, it is a perfect application for fuel tanks, water meters, or any product that must function in a hazardous environment. May 22, 2014
Sponsored by Diamond-MT

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Learn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, earn more about RCD as the next step in diagnosis solution enhancement. Where layout-aware diagnosis points to a segment, RCD can isolate a particular root cause in that segment. RCD, a statistical enhancement technology in Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout diagnosis reports together to identify the underlying defect distribution that is more likely to explain this set of diagnosis results. RCD does not require any additional data beyond what is required for layout-aware diagnosis. This means that RCD fits well into existing diagnosis flows. April 24, 2014
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Metrology

August 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Advanced Packaging

Sept. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



SEMICON Taiwan 2014
Taiwan
http://www.semicontaiwan.org/en/
September 03, 2014 - September 05, 2014
Vietnam Semiconductor Strategy Summit
Ho Chi Minh City, Vietnam
http://www.semi.org/en/node/46001
September 16, 2014 - September 17, 2014
APC (Advanced Process Control) Conference XXVI 2014
Ann Arbor, Michigan
http://www.apcconference.com/
September 29, 2014 - October 01, 2014