Wafer Processing

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WAFER PROCESSING ARTICLES



North American semiconductor equipment industry posts April 2016 book-to-bill ratio of 1.10

05/24/2016  North America-based manufacturers of semiconductor equipment posted $1.59 billion in orders worldwide in April 2016 (three-month average basis) and a book-to-bill ratio of 1.10.

Synopsys launches pre-wafer simulation solution to reduce semiconductor process development time

05/24/2016  Synopsys, Inc. today announced a pre-wafer simulation solution to help semiconductor manufacturers reduce process node development time.

Diamonds closer to becoming ideal semiconductors

05/24/2016  Researchers find new method for doping single crystals of diamond.

First Strategic Materials Conference in Korea: A success

05/23/2016  SEMI announced today that the first SEMI Strategic Materials Conference (SMC) was held in Korea COEX in Seoul on May 18.

Fujitsu boosts efficiency of manufacturing processes at Shimane Fujitsu through IoT collaboration with Intel

05/19/2016  Fujitsu Limited today announced that it has with Intel Corporation carried out a field trial to visualize manufacturing processes at Shimane Fujitsu Limited.

IBM scientists achieve storage memory breakthrough

05/18/2016  For the first time, scientists at IBM Research have demonstrated reliably storing 3 bits of data per cell using a relatively new memory technology known as phase-change memory (PCM).

IQE joins imec's GaN-on-Si Industrial Affiliation Program

05/17/2016  Nanoelectronics research center imec today announced a strategic partnership on GaN-on-Si (Gallium Nitride-on-Silicon) technology with IQE, a designer and manufacturer of advanced semiconductor wafer products and services.

POET Technologies to acquire BB Photonics

05/17/2016  POET Technologies Inc., a developer of opto-electronics fabrication processes for the semiconductor industry, today announced that it has signed a definitive agreement to acquire all the shares of BB Photonics Inc.

First quarter 2016 silicon wafer shipments increase quarter-over-quarter

05/17/2016  Worldwide silicon wafer area shipments increased during the first quarter 2016 when compared to fourth quarter 2015 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Seven Top-20 semiconductor suppliers show double-digit declines

05/12/2016  Qualcomm, Micron, and SK Hynix registered ≥25% drops, with total top-20 sales off by 6%.

SEMICON Southeast Asia 2016: Connecting in Penang

05/12/2016  Nearly 5,000 visitors and exhibitor personnel assembled in Penang last month for SEMICON Southeast Asia 2016, the largest trade show for the electronics manufacturing supply chain in the region.

Worldwide semiconductor capital spending to decline 2 percent in 2016

05/11/2016  Worldwide semiconductor capital spending is projected to decline 2 percent in 2016, to $62.8 billion, according to Gartner, Inc. This is up from the estimated 4.7 percent decline in Gartner's previous quarterly forecast.

SEMICON West expands to take on the Extended Supply Chain Forum

05/10/2016  To meet the changing needs of today’s increasingly interconnected supply chain, SEMICON West has added eight vertically integrated forums to its 2016 lineup.

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TWITTER


WEBCASTS



Fan-Out Wafer Level Packaging

May 26, 2016 at 1 PM ET / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

Sponsored By:
High Mobility Transistors

June 21, 2016 at 1 PM ET / Sponsored by Air Products

Transistor performance has been greatly improved with strained silicon and high-k metal gates. Further performance improvements could be had by implementing III-V materials in the channel of nMOS transistors. Both III-V and Ge-based channels being considered for the pMOS device. High electron-mobility III-V semiconductors have been intensely researched as alternative channel materials for sub-7 nm technology nodes, but one of the main stumbling blocks is how to integrate them monolithically and cost-effectively with traditional CMOS silicon technology. This webcast will discuss the latest efforts in this area, including vertically stacked III-V nanowire.

Sponsored By:
Interconnection Technologies

June 2016 (Date and time TBD)/Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

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EVENTS



Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS