06/28/2016 FormFactor, Inc. today announced that it has completed the acquisition of Beaverton, Oregon-based Cascade Microtech, Inc.
06/27/2016 Synopsys, Inc. today announced a multi-year extension of its OEM agreement with Lattice Semiconductor Corporation for Synopsys' Synplify Pro FPGA synthesis tools.
06/24/2016 Qualcomm Incorporated announced that it has filed a complaint against Meizu in the Beijing Intellectual Property Court.
06/24/2016 In the early stages of development, having more process control can help reduce both the number and duration of cycles-of-learning (the iterations required to solve a particular problem).
06/23/2016 According to the latest market research report by Technavio, the global semiconductor capital equipment market is expected to reach $47.34 billion mark by 2020.
06/21/2016 Samco, a Japan-based semiconductor processing equipment manufacturer, held a completion ceremony for its second production center on June 17.
06/16/2016 FEI announced today the release of three new tools for process control and defect/failure analysis in advanced semiconductor manufacturing.
06/15/2016 Leti, an institute of CEA Tech, is hosting a one-day conference covering "System Reliability & Security in a Connected World" in Lyon, France, on June 23.
06/13/2016 The changing market for ICs means the end of business as usual for the greater semiconductor supply chain. Smarter use of data analytics looks like a key strategy to get new products more quickly into high yield production at improved margins.
06/13/2016 The ConFab 2016 kicked off this morning with speakers from GlobalFoundries, Silicon Catalyst, imec, TechInsights, CEA Leti, and New York Empire State Development.
06/10/2016 The Semiconductor Industry Association (SIA) this week announced worldwide sales of semiconductors reached $25.8 billion for the month of April 2016.
06/10/2016 A forum of industry experts at SEMICON West 2016 will discuss the challenges associated with getting from node 10 -- which seems set for HVM -- to nodes 7 and 5.
06/10/2016 While semiconductor fab equipment spending is off to a slow start in 2016, it is expected to gain momentum through the end of the year. For 2016, 1.5 percent growth over 2015 is expected while 13 percent growth is forecast in 2017.
June 2016 (Date and time TBD)/ Sponsored by Air Products
June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens
Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016Sponsored by Master Bond, Inc.,
This whitepaper provides a comprehensive overview of parylene conformal
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XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016Sponsored by XwinSys Technology Development Ltd.