Wafer Processing

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WAFER PROCESSING ARTICLES



Rice University finding could lead to cheap, efficient metal-based solar cells

07/27/2015  New research from Rice University could make it easier for engineers to harness the power of light-capturing nanomaterials to boost the efficiency and reduce the costs of photovoltaic solar cells.

More efficient process to produce graphene developed by Ben-Gurion University researchers

07/23/2015  Ben-Gurion University of the Negev (BGU) and University of Western Australia researchers have developed a new process to develop few-layer graphene for use in energy storage and other material applications that is faster, potentially scalable and surmounts some of the current graphene production limitations.

ORNL researchers make scalable arrays of 'building blocks' for ultrathin electronics

07/22/2015  Researchers at the Department of Energy's Oak Ridge National Laboratory have combined a novel synthesis process with commercial electron-beam lithography techniques to produce arrays of semiconductor junctions in arbitrary patterns within a single, nanometer-thick semiconductor crystal.

An easy, scalable and direct method for synthesizing graphene in silicon microelectronics

07/21/2015  In the last decade, graphene has been intensively studied for its unique optical, mechanical, electrical and structural properties.

Analog Devices joins SRC's Trustworthy and Secure Semiconductors and Systems Initiative

07/20/2015  Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, today announced that Analog Devices, Inc. has joined SRC’s hardware cybersecurity research program called Trustworthy and Secure Semiconductors and Systems (T3S).

Business is good for vendors of test and inspection/metrology equipment

07/16/2015  Semiconductor test equipment and inspection/metrology equipment are unglamorous yet critical segments of the equipment field.

TÜV Rheinland showcases services & abilities for semi industry focus is on OSHA and EMC testing certification

07/15/2015  TÜV Rheinland, a full-service testing, inspection and certification company, exhibiting at the annual SEMICON West expo, announced the expansion of services to include Environmental, Health & Safety testing and certification of Group III-V compounds in semiconductor manufacturing environments.

Rudolph Technologies and DISCO Corporation partner to improve wafer saw process

07/14/2015  Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy.

Keynote panel: Challenges abound for sub-14nm

07/14/2015  SEMICON West 2015 kicked off Tuesday morning with a keynote panel session that addressed the challenges of "Scaling the Walls of Sub-14nm Manufacturing."

SEMI forecasts three years of growth in chip equipment spending

07/14/2015  SEMI projects three consecutive years of growth in worldwide semiconductor equipment sales according to the mid-year edition of the SEMI Capital Equipment Forecast, released today at the SEMICON West exposition.

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TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Isolating Electrical Faults in Advanced IC Devices

July 29, 2015 at 2:00 p.m. ET

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
The Path to Future Interconnects

August 6, 2015 at 1:00 p.m. ET

Jon Candelaria, Semiconductor Research Corp.’s director of interconnect and packaging sciences, will summarize a SEMICON West Semiconductor Technology Symposium Session focused on interconnects. He’ll describe the challenges for interconnect technology up to the end of the CMOS roadmap, and a few of the alternatives to address them. Next, he’ll discuss possible directions beyond the roadmap, as well as interconnectivity requirements and solution paths for emerging applications.

Sponsored By:
Lock-in Thermography for Advanced Assembly Qualification

August 26, 2015 at 1:00 p.m. ET

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015