Wafer Processing

MAGAZINE



WAFER PROCESSING ARTICLES



MEI Wet Processing Systems reveals performance data for new critical etch system

09/02/2014  MEI Wet Processing Systems and Services revealed performance data today on its newly released Cu & TiW Critical Etch System for compound semiconductor manufacturing.

A new, tunable device for spintronics

08/29/2014  An international team of scientists including physicist Jairo Sinova from the University of Mainz realises a tunable spin-charge converter made of GaAs.

Competition for graphene

08/27/2014  A new argument has just been added to the growing case for graphene being bumped off its pedestal as the next big thing in the high-tech world by the two-dimensional semiconductors known as MX2 materials.

New ClassOne electroplater a "sellout" at SEMICON West

08/25/2014  When ClassOne Technology introduced its new Solstice electroplating systems at SEMICON West last month they didn’t expect to actually sell their first production unit off the show floor, but that’s what happened.

Fairchild Semiconductor to close two facilities, cutting 15% of workforce

08/25/2014  Fairchild Semiconductor, a supplier of high performance power and mobile products, today announced it will eliminate its internal five-inch and significantly reduce six-inch wafer fabrication lines.

SRC TECHCON 2014 Conference to feature speakers from GLOBALFOUNDRIES, LinkedIn, High Point University

08/25/2014  The TECHCON 2014 conference hosted by Semiconductor Research Corporation (SRC), the university-research consortium for semiconductors and related technologies, will feature immediate past GLOBALFOUNDRIES CEO Ajit Manocha among the list of executive speakers at the Sept. 7-9 annual event.

Order activity for semiconductor equipment holds steady in July

08/21/2014  North America-based manufacturers of semiconductor equipment posted $1.41 billion in orders worldwide in July 2014 (three-month average basis) and a book-to-bill ratio of 1.07, according to the July EMDS Book-to-Bill Report published today by SEMI.

MORE WAFER-PROCESSING ARTICLES

HEADLINES

u-blox launches low-cost Wi-Fi / Bluetooth "Internet of Things" module; Rugged ODIN-W160 supports dual-band Wi-Fi & dual-mode Bluetooth for reliable connectivity
September 02, 2014

Mouser Electronics Signs Global Agreement to Distribute Broadcom Mass Market Products
September 02, 2014

By Switching Catalyst From Silver to Copper, Natcore Finds Additional Solar Cell Savings.; Research is Published in the Royal Society of Chemistry's Journal of Materials Chemistry A.
September 02, 2014

NETGEAR's Nighthawk X4 Soars With Quantenna Wi-Fi; Quantenna's 4x4 802.11ac Technology Delivers Whole-Home Coverage, Flawless HD Video Streaming, and Lag-free Gaming
September 02, 2014

Presto Engineering Expands RF Capacity; Growing market drives Presto Engineering expansion in RF (including millimeter wavelength) test and production services in its North American and European Hubs.;
September 02, 2014

Tehuti Networks Showcasing 4K Video Streaming Over 10 Gigabit Ethernet Thunderbolt TM 2 Adapter Prototype at IDF San Francisco 2014; Tehuti 10GBase-T Thunderbolt TM 2 Adapter Reference Design Prototype Enables 4K Media Delivery to Thunderbolt Technology Enabled Ultrabooks and Workstations
September 02, 2014

Tehuti Networks Showcasing 4K Video Streaming Over 10 Gigabit Ethernet Thunderbolt TM 2 Adapter Prototype at IDF San Francisco 2014; Tehuti 10GBase-T Thunderbolt TM 2 Adapter Reference Design Prototype Enables 4K Media Delivery to Thunderbolt Technology Enabled Ultrabooks and Workstations
September 02, 2014

TowerJazz and Triune Systems Announce Neo-Iso(TM) Products Ramping to Mass Production; Neo-Iso(TM) enables HVAC and home automation systems to reduce form factor, increase reliability and reduce cost; Home Automation Market expected to reach $16.4 billion by 2019, growing at a CAGR of 24.6% from 2014 to 2019
September 02, 2014

TowerJazz and Triune Systems Announce Neo-Iso(TM) Products Ramping to Mass Production; Neo-Iso(TM) enables HVAC and home automation systems to reduce form factor, increase reliability and reduce cost; Home Automation Market expected to reach $16.4 billion by 2019, growing at a CAGR of 24.6% from 2014 to 2019
September 02, 2014

China's premier electronics design show IIC-China opens today in Shenzhen with new product announcements and close to 100 presentations given by global technology leaders over four days; Event focuses on what is critical for future electronics innovation: IoT, wearable, smartphone, power, EDA, automotive, industrial and medical electronics design technologies, and more
September 02, 2014

FINANCIALS



TECHNOLOGY PAPERS



Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

The Next Step in Diagnosis Resolution Improvement

Root Cause Deconvolution (RCD), a statistical enhancement technology recently made available in Mentor Graphics’ Tessent Diagnosis and YieldInsight products, is the next step in diagnosis resolution enhancement. It works by analyzing multiple layout-aware diagnosis reports together to identify the underlying defect distribution (root cause distribution) that is most likely to explain this set of diagnosis results. The results are then back- annotated to the individual diagnosis suspects.April 24, 2014
Sponsored by Mentor Graphics

UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

More Technology Papers

WEBCASTS



Metrology

September 2014 (date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions.

Sponsored By:
Advanced Packaging

Sept. 2014 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Interconnects

Oct. 2014 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



Vietnam Semiconductor Strategy Summit
Ho Chi Minh City, Vietnam
http://www.semi.org/en/node/46001
September 16, 2014 - September 17, 2014
APC (Advanced Process Control) Conference XXVI 2014
Ann Arbor, Michigan
http://www.apcconference.com/
September 29, 2014 - October 01, 2014
Strategic Materials Conference
Santa Clara, CA
http://www.semi.org/node/41386
September 30, 2014 - October 01, 2014