Wafer Processing

MAGAZINE



WAFER PROCESSING ARTICLES



It’s time for new innovation

06/20/2017  What if the automotive industry had achieved the incredible pace of innovation as the semiconductor industry during the last 52 years?

How SEMI Standard E175 is saving energy and cutting costs

06/20/2017  Industry experts answer questions about the new standard in a virtual roundtable.

Cellphone IC sales will top total personal computing in 2017

06/20/2017  Higher memory prices accelerate sales growth in both cellphones and personal computing systems but cellular handsets will become the largest application for ICs this year.

Alloying materials of different structures offers new tool for controlling properties

06/19/2017  New research into the largely unstudied area of heterostructural alloys could lead to greater materials control and in turn better semiconductors, advances in nanotechnology for pharmaceuticals and improved metallic glasses for industrial applications.

North American semiconductor equipment industry posts May 2017 billings

06/16/2017  North America-based manufacturers of semiconductor equipment posted $2.27 billion in billings worldwide in May 2017 (three-month average basis)

UMC restructures executive team

06/15/2017  UMC today announced that its board of directors has appointed senior vice presidents SC Chien and Jason Wang as co-presidents of the company, following Po-Wen Yen’s retirement as UMC CEO.

GLOBALFOUNDRIES on track to deliver Leading-Performance 7nm FinFET technology

06/14/2017  GLOBALFOUNDRIES this week announced the availability of its 7nm Leading-Performance (7LP) FinFET semiconductor technology, delivering a 40 percent generational performance boost.

Imec world-first to develop 200V, 650V dispersion free normally-off/e-mode power devices on 200mm/8-inch Si wafers

06/13/2017  Imec announced today that it has developed 200V and 650V normally-off/enhancement mode (e-mode) on 200mm/8-inch GaN-on-Silicon wafers.

NREL-led research effort creates new alloys, phase diagram

06/13/2017  A multi-institutional team led by the U.S. Department of Energy's National Renewable Energy Laboratory (NREL) discovered a way to create new alloys that could form the basis of next-generation semiconductors.

Cypress Executive Chairman Ray Bingham steps down from Board

06/12/2017  Cypress Semiconductor Corporation announced that Executive Chairman Ray Bingham has tendered his resignation as Executive Chairman and is stepping down from the Board of Directors.

Researchers image quasiparticles that could lead to faster circuits, higher bandwidths

06/09/2017  A research team led by Iowa State University's Zhe Fei has made the first images of half-light, half-matter quasiparticles called exciton-polaritons. The discovery could be an early step to developing nanophotonic circuits that are up to 1 million times faster than current electrical circuits.

Long-term IoT semiconductor forecast reduced

06/08/2017  Total IoT forecast scaled back mostly because of lower revenue projections for connected cities.

Global semiconductor sales increase 21% year-to-year in April

06/07/2017  Double-digit annual growth projected for 2017.

MORE WAFER-PROCESSING ARTICLES

TWITTER


WEBCASTS



Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Date and time TBD

The slowing down of Moore's Law even at leading CMOS Fabs due to approaching Physics limits, while at the same time the explosion in demand for chips and systems across a wide range of market segments (compact wearable / portable consumer systems, the transfer and processing of data to and from the cloud, at the high performance end specialized architectures e,g for AI) has revived interest in Dense Off Chip Integration (DOCI ), first used in MCMs (Multi Chip Modules) for mainframes some 3 decades ago.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



Microelectronics Tech Asia Singapore 2017
ITE College Center, Singapore
http://www.microelectronics.sg
July 04, 2017 - July 05, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017
SEMICON West 2017
San Francisco, CA
http://www.semiconwest.org
July 11, 2017 - July 13, 2017

VIDEOS