Wafer Processing

MAGAZINE



WAFER PROCESSING ARTICLES



Mentor Graphics CEO Walden C. Rhines named IEEE Fellow

01/17/2017  Dr. Rhines is being recognized for leadership and technology innovation in integrated circuit design and automation.

$24B semiconductor assembly and testing services market poised for steady growth

01/13/2017  This week, Future Market Insights (FMI) releases its latest report on the semiconductor assembly and testing services market.

Worldwide semiconductor capital spending is forecast to grow 2.9% in 2017

01/12/2017  Worldwide semiconductor capital spending is projected to increase 2.9 percent in 2017, to $69.9 billion, according to Gartner, Inc.

Pure-play foundry market surges 11% in 2016 to reach $50B

01/12/2017  X-Fab, SMIC, and TowerJazz each grew by ≥30% last year.

NXP honored as 2016 Top 100 Global Innovator

01/10/2017  NXP Semiconductors N.V. today announced that Clarivate Analytics, formerly the Intellectual Property & Science business of Thomson Reuters, has listed NXP in its highly anticipated list of 2016 Top 100 Global Innovators.

SEMI ISS 2017 uncovers new growth, forecast upgrades

01/10/2017  SEMI's Industry Strategy Symposium (ISS) opened yesterday with a theme focused on new industry forces and new markets.

ON Semiconductor, Hexius Semiconductor expand scope of analog functionality for next gen mixed signal ASICs

01/09/2017  ON Semiconductor announced a collaboration with Hexius Semiconductor to qualify several of their analog intellectual property (IP) blocks in its popular ONC18 0.18 µm CMOS process.

Versum Materials reaches milestone with installation of 200th CHEMGUARD Gen. III refill system

01/06/2017  The Delivery Systems and Services Group (DS&S) of Versum Materials, Inc. (NYSE: VSM) has realized an important milestone: the sale and commissioning of its 200th CHEMGUARD Gen III high purity, liquid delivery system since the product line launched in early 2016.

2017 Symposia on VLSI Technology & Circuits opens online submission for papers

01/05/2017  Online paper submissions are now open for the 2017 Symposia on VLSI Technology and Circuits, to be held at the Rihga Royal Hotel in Kyoto, Japan from June 5 - 8, 2017.

Global semiconductor sales up 7% year-to-year

01/04/2017  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $31.0 billion for the month of November 2016, an increase of 7.4 percent compared to the November 2015 total.

Process Watch: Hitback analysis improves defect visibility

12/27/2016  In order to maximize the profitability of an IC manufacturer’s new process node or product introduction, an early and fast yield ramp is required. Key to achieving this rapid yield ramp is the ability to provide quality and actionable data to the engineers making decisions on process quality and needed improvements.

A year in review: Top 10 stories of 2016

12/23/2016  From the ground-breaking research breakthroughs to the shifting supplier landscape, these are the stories the Solid State Technology audience read the most during 2016.

Advances in artificial intelligence, IoT highlight IHS Markit's global technology predictions for 2017

12/21/2016  From artificial intelligence to the Internet of Things (IoT), far-reaching innovations are unfolding in virtually every technology sector around the globe, continuing to change the way consumers, businesses and machines interact while also spurring the next revolution in tech market growth.

MORE WAFER-PROCESSING ARTICLES

TWITTER


WEBCASTS



Internet of Things

January 2017 - Date and time TBD / Sponsored by Epicor

The age of IoT is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Fab Cost Reduction

February 2017 - Date and time TBD / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
ISS Europe 2017
Munich, Germany
http://www.semi.org/eu/iss-europe-2017
March 05, 2017 - March 07, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS