Wafer Processing

WAFER PROCESSING ARTICLES



LG-Swiss researchers announce graphene membrane breakthrough

04/18/2014  The findings open up the possibility in the future to develop highly efficient filters to treat air and water.

SMIC appoints Hiroshi Ogawa as General Manager of SMIC Japan

04/15/2014  Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, announced today that Hiroshi Ogawa was appointed as General Manager of SMIC Japan Corporation.

Mentor Graphics design and verification tools certified for TSMC 16nm FinFET production

04/15/2014  Mentor Graphics Corp. today announced that its IC design to silicon solution has achieved certification for TSMC's Design Rule Manual (DRM) and SPICE model version 1.0 for its 16nm FinFET process.

SEMI reports 2013 semiconductor photomask sales of $3.1B

04/14/2014  SEMI reports that the worldwide semiconductor photomask market was $3.1 billion in 2013 and is forecasted to reach $3.3 billion in 2015.

Catching the (invisible) wave

04/11/2014  UC Santa Barbara researchers create a unique semiconductor that manipulates light in the invisible infrared/terahertz range, paving the way for new and enhanced applications.

Scalable CVD process for making 2-D molybdenum diselenide

04/10/2014  Nanoengineering researchers at Rice University and Nanyang Technological University in Singapore have unveiled a potentially scalable method for making one-atom-thick layers of molybdenum diselenide — a highly sought semiconductor that is similar to graphene but has better properties for making certain electronic devices like switchable transistors and light-emitting diodes.

Sunlight generates hydrogen in new porous silicon

04/10/2014  Porous silicon manufactured in a bottom up procedure using solar energy can be used to generate hydrogen from water, according to a team of Penn State mechanical engineers, who also see applications for batteries, biosensors and optical electronics as outlets for this new material.

SEMI releases fourth quarter 2013 worldwide photovoltaic equipent market statistics report

04/09/2014  Billings and bookings show improvement in the fourth quarter.

February semiconductor sales up 11.4 percent compared to last year

04/09/2014  The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $25.87 billion for the month of February 2014, an increase of 11.4 percent from February 2013 when sales were $23.23 billion.

Global Semiconductor Alliance celebrates 20 years of industry collaboration

04/08/2014  The Global Semiconductor Alliance (GSA) is celebrating 20 years of industry collaboration this year.

SEMI reports 2013 global semiconductor materials sales of $43.5B USD

04/07/2014  The global semiconductor materials market decreased 3 percent in 2013 compared to 2012 while worldwide semiconductor revenues increased 5 percent.

Park Systems introduces automatic defect review for semiconductor wafers

04/03/2014  Park Systems this week introduced the Automatic Defect Review (ADR)AFM for 300mm bare wafers, a fully automated AFM solution that improves throughput of AFM defect review by up to 1,000 percent.

Quantum Polymers announces 8 inch diameter carbon and glass filled PEEK rod products

04/01/2014  These products work well for applications requiring a balance of chemical resistance and mechanical strength in high temperature environments like those frequently found in the oil and gas, chemical processing, and semiconductor industries.

MACOM announces IP licensing program for GaN-on-Si technology

04/01/2014  M/A-COM Technology Solutions Inc. this week announced an IP licensing program for Gallium Nitride (GaN) on Silicon technology.

Fabricating nanostructures with silk could make clean rooms green rooms

04/01/2014  Tufts University engineers have demonstrated that it is possible to generate nanostructures from silk in an environmentally friendly process that uses water as a developing agent and standard fabrication techniques.

Researchers improve performance of III-V nanowire solar cells on graphene

04/01/2014  Researchers at the University of Illinois at Urbana-Champaign have achieved new levels of performance for seed-free and substrate-free arrays of nanowires from class of materials called III-V (three-five) directly on graphene

University of Washington selects Altatech’s CVD system to develop new process materials

03/31/2014  Altatech, a subsidiary of Soitec, has received an order from the University of Washington in Seattle for an AltaCVD chemical vapor deposition (CVD) system whose unique combination of capabilities allows users to develop new process materials with high added value.

SEMATECH announces leadership changes

03/31/2014  SEMATECH, the global consortium of semiconductor manufacturers, announced today that Ronald Goldblatt, vice president of Technical Strategy and Operations, has been appointed by the board of directors as acting president and chief executive officer, effective immediately.

Silicon Valley specialty foundry Noel Technologies names Joe Medeiros Director of Reclaim

03/27/2014  Noel Technologies, a Silicon Valley specialty foundry offering process development and substrate fabrication, has added semiconductor industry veteran Joe Medeiros to its growing management staff.

Nanolab Technologies expands services with new analytical and surface measurement tools

03/26/2014  Nanolab Technologies, a Silicon Valley-based analytical services lab, has purchased and installed new tools and moved to a seven-day workweek.




FINANCIALS



TECHNOLOGY PAPERS



UV LED Curing for the Electronics Industry

This paper provides an introduction to UV LED curing and the many benefits UV LED curing provides for bonding and coating applications in the electronics industry. Product manufacturers, machine builders, and chemistry formulators will gain an understanding of the benefits and how to apply UV LED curing in manufacturing processes. Included are specific examples of how manufacturers are using UV LED to make touch screens, mobile phones, micro speakers, and hard disk drives.April 03, 2014
Sponsored by Phoseon Technology

Versatile Epoxy Compounds for Electronic Applications

Electronic systems have revolutionized our lives. We use them in nearly all of our daily activities, for communication, computing, navigation, entertainment, payment processing, and more. They are the workhorses in many medical, transportation, aerospace, and military systems, performing functions such as automated control, data analysis, and pattern recognition.February 10, 2014
Sponsored by Master Bond, Inc.,

Enhancing the Performance of Electronic Applications with Versatile Epoxy Compounds

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.January 06, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Multiphysics Modeling of MEMS Devices

April 30 at 2:00 p.m. ET. Microelectromechanical systems (MEMS), such as actuators, sensors and resonators, rely on the interactions between multiple physical effects. In this webinar, we will show how a multiphysics simulation approach allows you to combine electrical, thermal and structural effects accurately in order to design reliable and high-performance MEMS devices.

Sponsored By:
MEMS

May 2014 (date and time TBD) MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Packaging Materials

May 2014 (date and time TBD) Advanced packages rely on high-performance materials – die-attach film, solder bumps, conductive adhesive, underfill, TIM – to ensure reliability, fine-pitch interconnect, thermal management, and chip performance are optimized. Learn about the latest assembly materials and how they can improve the package, speed packaging throughput, and even lower packaging costs in the webcast.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



The ConFab
Las Vegas, Nevada
http://www.theconfab.com
June 22, 2014 - June 25, 2014
2014 International Workshop on EUV Lithography
Maui, Hawaii, USA
http://www.euvlitho.com
June 23, 2014 - June 27, 2014
SEMICON West 2014
San Francisco, California
http://www.semiconwest.org
July 08, 2014 - July 10, 2014
SPIE Photomask Technology 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 18, 2014
Photomask Technology Exhibition 2014
Monterey Conference Center and Monterey Marriott,
http://spie.org/photomask.xml?WT.mc_id=RCal-PMW
September 16, 2014 - September 17, 2014