Wafer Processing

WAFER PROCESSING ARTICLES



Silver nanowires demonstrate unexpected self-healing mechanism

01/23/2015  With its high electrical conductivity and optical transparency, indium tin oxide is one of the most widely used materials for touchscreens, plasma displays, and flexible electronics. But its rapidly escalating price has forced the electronics industry to search for other alternatives.

2015 outlook: Tech trends and drivers

01/20/2015  Leading industry experts provide their perspectives on what to expect in 2015. 3D devices and 3D integration, rising process complexity and “big data” are among the hot topics.

Rice-sized laser, powered one electron at a time, bodes well for quantum computing

01/16/2015  Princeton University researchers have built a rice grain-sized laser powered by single electrons tunneling through artificial atoms known as quantum dots.

Solving an organic semiconductor mystery

01/16/2015  Berkeley Lab researchers uncover hidden structures in domain interfaces that hamper performance.

AKHAN Semiconductor first to invent fully transparent circuit creation process

01/15/2015  Adam Khan, founder and CEO of AKHAN Semiconductor, Inc. was granted a US patent by the US Patent and Trademark Office today for a groundbreaking process that adheres diamond, the only truly transparent semiconductor, to metals and alloys (including transparent metals) in a way that allows for reliable wire bonding and high conductivity.

UC Berkeley Extension launches three online programs in semiconductor technology

01/15/2015  UC Berkeley Extension announces three online integrated circuit (IC) semiconductor technology programs to meet the training needs of the surging worldwide semiconductor industry; the industry is predicted to reach $345 billion in sales this year.

Orbotech announces collaboration between SPTS and Fraunhofer on process development of wafer level packaging

01/15/2015  Orbotech Ltd. today announced that SPTS Technologies is collaborating with Fraunhofer IZM, an international institute specializing in applied and industrial contract research, on next generation wafer level packaging of microelectronic devices.

SAMCO announces MOCVD demonstration availability for the GaN-550 MOCVD system

01/15/2015  SAMCO has announced MOCVD demonstration capability on a new gallium nitride (GaN-on-Si) system, the GaN-550, from Valence Process Equipment Inc.

Two companies honored with SEMI Award

01/14/2015  SEMI today announced that two companies, Brewer Science and Advanced Semiconductor Engineering, Inc. (ASE), are recipients of the 2014 SEMI Award for North America.

JEOL and UC Irvine partner to develop electron microscopy and materials research center

01/14/2015  JEOL USA and the University of California's Irvine Materials Research Institute (IMRI) have entered into a strategic partnership to create a premier electron microscopy and materials science research facility.

SUNY Board appoints Dr. Alain Kaloyeros as founding president of SUNY Polytechnic Institute

01/14/2015  SUNY Polytechnic Institute (SUNY Poly) yesterday announced the SUNY Board of Trustees has appointed Dr. Alain Kaloyeros as the founding President of SUNY Poly.

Graphene plasmons go ballistic

01/12/2015  Graphene combined with the insulting power of boron nitride enables light control in tiny circuits with dramatically reduced energy loss.

Silicon Space Technology partners with GLOBALFOUNDRIES to deliver processors and memory solutions

01/09/2015  Silicon Space Technology, an industry innovator in high-temp and rad-hard embedded system solutions, announced today the company has partnered with GLOBALFOUNDRIES to build commercial-ready products for extreme environments and applications.

GLOBALFOUNDRIES and Linear Dimensions to offer joint analog solution for wearables and MEMs sensors markets

01/09/2015  GLOBALFOUNDRIES and Linear Dimensions Semiconductor Inc. today announced that they are working together to manufacture a 14-channel programmable reference from Linear Dimensions for multiple markets including IoT (Internet of Things) sensor and wearable device applications.

Freshmen-level chemistry solves the solubility mystery of graphene oxide films

01/06/2015  A Northwestern University-led team recently found the answer to a mysterious question that has puzzled the materials science community for years--and it came in the form of some surprisingly basic chemistry.

Global semiconductor sales in November outpace 2013 totals

01/05/2015  The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $29.7 billion for the month of November 2014.

A new hardmask process, Saphira

12/23/2014  A new hardmask material and process was introduced this month by Applied Materials. Designed for advanced logic and memories, including DRAM and vertical NAND, the hardmask is transparent, which simplifies processing.

Global semiconductor market set for strongest growth in four years in 2014

12/23/2014  Worldwide semiconductor market revenue is on track to achieve a 9.4 percent expansion this year, with broad-based growth across multiple chip segments driving the best industry performance since 2010.

Hands on: Crafting ultrathin color coatings

12/22/2014  In Harvard's high-tech cleanroom, applied physicists produce vivid optical effects on paper.

Piezoelectricity in a 2-D semiconductor

12/22/2014  Berkeley Lab researchers discovery of piezoelectricty in molybdenum disulfide holds promise for future MEMS.




FINANCIALS



TECHNOLOGY PAPERS



Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



FinFETs

February 2015 (Date and time TBD)

FinFETs provide better performance than planar transistor architectures, but the entire 3D structure requires strict process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts. As more advanced node semiconductors enter production, the application of HKMG will be key to yield and cost improvement. Advanced wafer fab tools are needed for HKMG, such as ALD.

Sponsored By:

3D Integration

March 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015
LithoVision 2015
San Jose, California United States
https://www.nikonprecision.com/lithovision/
February 22, 2015 - February 22, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015