Wafer Processing


New perovskite solar cell design could outperform existing commercial technologies

10/21/2016  Stanford, Oxford team creates high-efficiency tandem cells.

Researchers find way to tune thermal conductivity of 2-D materials

10/21/2016  Researchers have found an unexpected way to control the thermal conductivity of two-dimensional (2-D) materials, which will allow electronics designers to dissipate heat in electronic devices that use these materials.

Semiconductor equipment bookings continue to outpace equipment billings in new book-to-bill report

10/21/2016  A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.

Avalanche Technology announces the start of volume production of STT-MRAM on 300mm wafers

10/20/2016  Avalanche Technology, Inc., has entered into a manufacturing agreement with Sony Semiconductor Manufacturing Corporation to begin production of it's Spin Transfer Torque Magnetic RAM (STT-MRAM) on 300mm wafers at various advanced geometry nodes.

Raytheon awarded Title III contract to advance its Gallium Nitride technology

10/20/2016  The U.S. Air Force Research Laboratory and the Office of the Secretary of Defense have awarded Raytheon Company [NYSE: RTN] a $14.9M contract to further enhance its process for producing gallium nitride-based semiconductors.

Scientists find technique to improve carbon superlattices for quantum electronic devices

10/20/2016  In a paradigm shift from conventional electronic devices, exploiting the quantum properties of superlattices holds the promise of developing new technologies.

POET Technologies to expand compound semiconductor operations in Singapore

10/19/2016  POET Technologies Inc. today announced that on October 17, 2016, it entered into an Agreement with the Singapore Economic Development Board (EDB) to expand POET's research and development (R&D) operations in Singapore.

SEMI Korea Members Day provides industry insights and networking

10/19/2016  SEMI Korea has hosted a SEMI member event every year for its members since 2008 to provide networking opportunities and insight on the ever-changing issues in the industry.

SMIC TianJin launches capacity expansion project

10/18/2016  After the project's completion, SMIC TianJin is expected to become the world's largest integrated 8-inch IC production line.

Avery Dennison and NXP lead the industry in more sustainable RFID production

10/18/2016  NXP doubles production capacity with new innovation for UHF RFID solutions.

Compact graphene-based plasmon generator developed by physicists from MIPT

10/17/2016  Russian and Japanese scientists demonstrate that compact coherent plasmon sources based on van der Waals heterostructures can be designed for use in optoelectronics.

Scientists develop a semiconductor nanocomposite material that moves in response to light

10/17/2016  A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used in a variety of applications, including microscopic actuators and grippers for surgical robots, light-powered micro-mirrors for optical telecommunications systems, and more efficient solar cells and photodetectors.

SMIC Shanghai starts construction of a new 12-inch wafer fab

10/13/2016  Semiconductor Manufacturing International Corporation, the largest and most advanced foundry in Mainland China, today held the groundbreaking ceremony of a new 12-inch wafer fab in Shanghai to meet SMIC Shanghai's increasing production and development needs.

Wafer shipments forecast to increase in 2016, 2017 and 2018

10/13/2016  SEMI recently completed its annual silicon shipment forecast for the semiconductor industry. This forecast provides an outlook for the demand in silicon units for the period 2016–2018.

SEMI announces retirement of president and CEO

10/13/2016  McGuirk will continue to lead SEMI in his current capacity until a successor is appointed.

Dr. Raul Camposano joins Silvaco's Technical Advisory Board

10/12/2016  Silvaco, Inc., a provider of electronic design automation software and semiconductor IP, today announced that Dr. Raul Camposano has joined Silvaco's Technical Advisory Board (TAB).

2016 wafer demand grows while semiconductor chip revenue declines, says Semico Research

10/11/2016  Total wafer demand is expected to return to historical growth rates over the next five years. However, what is uncharacteristic of the past is the wide range of decline and growth that will be logged by specific product categories and technologies.

Astronics Corporation expands Board of Directors with three new appointments

10/11/2016  Astronics Corporation announced that it has appointed three new independent directors to its Board: Jeffry D. Frisby, Warren C. Johnson and Neil Kim.

200mm fabs on the rise

10/11/2016  Examining 200mm capacity over the years, the highest level of 200mm capacity was recorded in 2007 and the lowest following this peak in 2009.

Peregrine Semiconductor moves UK team to larger facility

10/10/2016  Located in Theale, this new office quadruples the working area and laboratory space to better accommodate the UK team's 90-percent growth since the Murata acquisition in Dec. 2014.



Heterogeneous Integration: An Emerging Trend for Next Generation Microelectronic Devices and a Tremendous Opportunity for Advanced Packaging

October 26, 2016 at 1 p.m. ET / Sponsored by Air Products

With the change in the traditional IC scaling cadence, the expansive growth of “Big data,” and the pervasive nature of computing, rises a paradigm shift in integrated circuit scaling and microelectronic devices. The pervasive nature of computing drives a need for connecting billions of people and tens of billions of devices/things via cloud computing. Such connectivity effect will generate tremendous amount of data and would require a revolutionary change in the technology infrastructures being used to transmit, store and analyze data. Heterogeneous integration through package with technologies such as system in package (SIP), on package integration (OPI) and fan-out (WLFO and PLFO) are poised to change the packaging industry and play a disruptive role in enabling next generation devices.

Sponsored By:
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New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

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SEMICON Europa 2016
Grenoble, France
October 25, 2016 - October 27, 2016
Electronics Packaging Technology Conference
November 30, 2016 - December 03, 2016
International Electron Devices Meeting 2016 (IEDM)
San Francisco, CA
December 03, 2016 - December 07, 2016
The ConFab 2017
San Diego, CA
May 14, 2017 - May 17, 2017