Wafer Processing

WAFER PROCESSING ARTICLES



Lam Research Takes Uniformity Control to the Edge

08/16/2017  Chipmakers want every part of the wafer to yield good die. Advances in process technologies have just about made this a reality, even as feature dimensions continue to shrink and devices grow more complex.

New ultrathin semiconductor materials exceed some of silicon's "secret" powers

08/16/2017  Electrical engineers at Stanford have identified two semiconductors that share or even exceed some of silicon’s desirable traits, starting with the fact that all three materials can "rust."

Everspin Announces 1-Gigabit MRAM

08/10/2017  Everspin Technologies, Inc. has begun sampling its new 1-Gigabit Spin Torque Magnetoresistive Random Access Memory (ST-MRAM) with lead customers.

NanoString and Lam Research announce strategic development collaboration

08/09/2017  NanoString Technologies, Inc. and Lam Research Corporation today announced a strategic collaboration to develop NanoString's proprietary Hyb & Seq next-generation sequencing platform.

Worldwide semiconductor capital spending is forecast to grow 10.2% in 2017

08/07/2017  Worldwide semiconductor capital spending is projected to increase 10.2 percent in 2017, to $77.7 billion, according to Gartner, Inc.

Mid-year global semiconductor sales up 21% compared to 2016

08/04/2017  Q2 sales are highest on record, 5.8 percent more than previous quarter, 23.7 percent higher than Q2 of last year.

Toshiba Memory's investment in production equipment for Fab 6 at Yokkaichi Operations

08/03/2017  Toshiba Corporation today announced that Toshiba Memory Corporation (TMC) will unilaterally invest in manufacturing equipment for the Fab 6 clean room at Yokkaichi Operations.

Significant mid-year revision to 2017 IC market forecast

08/02/2017  DRAM, NAND flash memory markets drive the first annual double-digit upturn since 2010.

A semiconductor that can beat the heat

07/31/2017  Berkeley Lab, UC Berkeley scientists discover unique thermoelectric properties in cesium tin iodide.

Silicon wafer shortage starts in 2018

07/31/2017  TECHCET's model shows all slack soon gone from supply-chain for both 300mm and 200mm diameter.

Enhanced vacuum security using advanced sub-fab monitoring and data analytics

07/28/2017  Sub-Fab Fault Detection and Classification (FDC) software platforms collect, integrate and analyze operational data.

North American semiconductor equipment industry posts June 2017 billings

07/26/2017  Through the first half of the year, 2017 equipment billings are 50 percent above the same period last year.

Second quarter 2017 silicon wafer shipments increase quarter-over-quarter

07/25/2017  Worldwide silicon wafer area shipments increased during the second quarter 2017 when compared to first quarter 2017 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Value of semiconductor industry M&A deals slows dramatically in 1H17

07/25/2017  Numerous smaller deals have been made but “megadeals” have yet to surface this year.

UV-C LED research company selects Veeco MOCVD system for nanowire on graphene development

07/24/2017  CrayoNano will use the system to grow semiconductor nanowires on graphene for water disinfection, air purification, food processing and life science applications.

NUS engineers achieve significant breakthrough in spin wave-based information processing technology

07/24/2017  Novel method of propagating spin waves could pave the way for high-speed, miniaturized data processing devices.

2017 IEEE IEDM to showcase technology and device breakthroughs in logic, memory, bioelectronics, silicon photonics

07/20/2017  Advances in semiconductor and related devices are driving significant progress in our increasingly digital world, and the place to learn about cutting-edge research in the field is the annual IEEE International Electron Devices Meeting (IEDM), to be held December 2-6, 2017 at the Hilton San Francisco Union Square hotel.

SUNY Poly awarded $720,000 by U.S. Department of Energy for next-generation semiconductor research

07/20/2017  Grant from Energy Department's Advanced Research Projects Agency-Energy supports further development of cutting-edge gallium nitride-based power electronics at SUNY Poly.

China will dominate the global semiconductor market in the next 5 years

07/19/2017  The semiconductor market in China continues to grow at a staggering speed. The current backbone of the electronics and telecom industry in China, semiconductor companies in China are driving innovation with new trends like spending on wafer fab equipment.

AIM Photonics welcomes Mentor as newest Tier 1 member

07/18/2017  The American Institute for Manufacturing Integrated Photonics (AIM Photonics) announced Mentor, a Siemens Business and global EDA leader, as the newest Tier 1 member of AIM Photonics.




TWITTER


WEBCASTS



Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Wednesday, August 9, 2017 at 1 p.m. ET

The slowing down of Moore's Law even at leading CMOS Fabs due to approaching Physics limits, while at the same time the explosion in demand for chips and systems across a wide range of market segments (compact wearable / portable consumer systems, the transfer and processing of data to and from the cloud, at the high performance end specialized architectures e,g for AI) has revived interest in Dense Off Chip Integration (DOCI ), first used in MCMs (Multi Chip Modules) for mainframes some 3 decades ago.

Sponsored By:
Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS