Wafer Processing

WAFER PROCESSING ARTICLES



Qualcomm receives authorization from the European Commission and Korea Fair Trade Commission for NXP Semiconductors acquisition

01/19/2018  Qualcomm Incorporated today announced that the European Commission and the Korea Fair Trade Commission authorized the acquisition by Qualcomm River Holdings B.V. of NXP Semiconductors N.V.

2-D tin (stanene) without buckling: A possible topological insulator

01/19/2018  Nagoya University-led researchers produce 2D sheets of tin atoms predicted to have exotic uses in electronics.

Silicon photonics has reached its tipping point

01/19/2018  Silicon photonics is still a small market today, with sales at die level estimated to be US$30 million in 2016. However, it has big promise, with a 2025 market value of US$560 million at chip level and almost US$4 billion at transceiver level.

Value of semiconductor industry M&A deals slows dramatically in 2017

01/18/2018  Numerous smaller deals were made but "megadeals" were scarce last year.

SkyWater Technology Foundry appoints Steve Wold as Chief Financial Officer

01/18/2018  SkyWater Technology Foundry, the industry's most advanced U.S.-based and U.S.-owned trusted foundry, announced today that it has appointed Steve Wold as Chief Financial Officer.

NAURA Akrion Inc. acquired Akrion’s surface preparation business

01/18/2018  Beijing NAURA Microelectronics Equipment Co.,Ltd. and Akrion Systems LLC today jointly announced that the previously announced acquisition by NAURA has been completed.

Korea is at full throttle on memory investments

01/17/2018  2017 proved to be record-setting year for the semiconductor industry. According to World Semiconductor Trade Statistics (WSTS), worldwide semiconductor market will have grown 20 percent, exceeding $400 billion for the first time.

Peregrine Semiconductor is now pSemi

01/17/2018  Peregrine Semiconductor Corporation today announces its corporate name change to pSemi™ Corporation, a Murata company focused on semiconductor integration.

Littelfuse completes acquisition of IXYS Corporation

01/17/2018  Littelfuse, Inc. today announced the completion of its acquisition of IXYS Corporation.

Picosun provides 300mm ALD technology for green power electronics

01/16/2018  Picosun Oy, a supplier of Atomic Layer Deposition (ALD) thin film coating technology for global industries, partners with STMicroelectronics S.r.l. to develop the next generation 300mm production solutions for advanced power electronics.

Analog IC market forecast with strongest annual growth through 2022

01/12/2018  Power management, signal conversion, and automotive-specific analog markets drive expansion.

Worldwide semiconductor revenue grew 22.2% in 2017; Samsung takes over No. 1 position

01/11/2018  Worldwide semiconductor revenue totalled $419.7 billion in 2017, a 22.2 percent increase from 2016, according to preliminary results by Gartner, Inc. Undersupply helped drive 64 percent revenue growth in the memory market, which accounted for 31 percent of total semiconductor revenue in 2017.

Luc Van den hove to receive SEMI Sales and Marketing Excellence Award

01/11/2018  SEMI today announced that Luc Van den hove, president and CEO of imec, has been selected as the 2018 recipient of the SEMI Sales and Marketing Excellence Award, inspired by Bob Graham. He will be honored for outstanding achievement in semiconductor equipment and materials marketing during ceremonies at ISS 2018 on January 17 in Half Moon Bay, California.

Process Watch: The (automotive) problem with semiconductors

01/11/2018  This article is the first in a five-part series on semiconductors in the automotive industry. In this article, we introduce some of the challenges involved in the automotive supply chain. Future articles in the series will address specific process control solutions to those challenges.

Talent pipeline key to enabling industry growth: Takeaways from SEMI Member Forum

01/10/2018  These were key highlights from a SEMI Member Forum in December that brought together industry representatives and students in Dresden to weigh in on job-skills challenges facing the electronics manufacturers and solutions for the industry to consider.

New oxide and semiconductor combination builds new device potential

01/10/2018  Researchers integrated oxide two-dimensional electron gases with gallium arsenide and paved the way toward new opto-electrical devices.

Xilinx appoints Victor Peng as president and CEO

01/05/2018  Xilinx, Inc. today announced that its board of directors has appointed Victor Peng as president and chief executive officer, effective January 29, 2018.

Fabless IC company sales top $100B for first time ever

01/04/2018  Two Chinese companies -- HiSilicon and Unigroup -- are among the top 10 fabless IC sales leaders.

Touchy nanotubes work better when clean

01/04/2018  Rice, Swansea scientists show that decontaminating nanotubes can simplify nanoscale devices.

Surprising changes in semiconductor equipment market share in 2017

01/04/2018  Through three quarters of calendar year 2017, market shares of top semiconductor equipment manufacturers indicate large gains by Tokyo Electron and Lam Research.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018


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VIDEOS