Wafer Processing

WAFER PROCESSING ARTICLES



Qualcomm files complaint against Meizu in China

06/24/2016  Qualcomm Incorporated announced that it has filed a complaint against Meizu in the Beijing Intellectual Property Court.

Process Watch: Process control and production cycle time

06/24/2016  In the early stages of development, having more process control can help reduce both the number and duration of cycles-of-learning (the iterations required to solve a particular problem).

Increased use of semiconductors in auto industry to boost global semiconductor capital equipment until 2020

06/23/2016  According to the latest market research report by Technavio, the global semiconductor capital equipment market is expected to reach $47.34 billion mark by 2020.

Samco boosts shipment capacity with second production center

06/21/2016  Samco, a Japan-based semiconductor processing equipment manufacturer, held a completion ceremony for its second production center on June 17.

FEI launches three new tools for next-generation semiconductor manufacturing

06/16/2016  FEI announced today the release of three new tools for process control and defect/failure analysis in advanced semiconductor manufacturing.

Leti Innovation Day in Lyon will explore new security challenges and responses for a safe connected world

06/15/2016  Leti, an institute of CEA Tech, is hosting a one-day conference covering "System Reliability & Security in a Connected World" in Lyon, France, on June 23.

Changing markets drive smarter manufacturing by IC sector

06/13/2016  The changing market for ICs means the end of business as usual for the greater semiconductor supply chain. Smarter use of data analytics looks like a key strategy to get new products more quickly into high yield production at improved margins.

Kicking off #TheConFab2016

06/13/2016  The ConFab 2016 kicked off this morning with speakers from GlobalFoundries, Silicon Catalyst, imec, TechInsights, CEA Leti, and New York Empire State Development.

Solid State Watch: June 3-9, 2016

06/10/2016  Semiconductor Industry Association announced worldwide sales of semiconductors reached $25.8 billion; SEMI announced that 19 new fabs and lines are forecasted to begin construction in 2016 and 2017; Tiny lasers enable faster, less power-hungry next-gen microprocessors; IC Insights releases update to Market Drivers Report

Global semiconductor sales decrease in April; Annual sales projected to dip slightly in 2016

06/10/2016  The Semiconductor Industry Association (SIA) this week announced worldwide sales of semiconductors reached $25.8 billion for the month of April 2016.

Countdown to Node 5: Moving beyond FinFETs

06/10/2016  A forum of industry experts at SEMICON West 2016 will discuss the challenges associated with getting from node 10 -- which seems set for HVM -- to nodes 7 and 5.

Equipment spending up: 19 new fabs and lines to start construction

06/10/2016  While semiconductor fab equipment spending is off to a slow start in 2016, it is expected to gain momentum through the end of the year. For 2016, 1.5 percent growth over 2015 is expected while 13 percent growth is forecast in 2017.

Perovskite solar cells surpass 20 percent efficiency

06/09/2016  EPFL researchers are pushing the limits of perovskite solar cell performance by exploring the best way to grow these crystals.

Boston Semi Equipment secures additional investment to expand test automation product lines

06/08/2016  Boston Semi Equipment, LLC (BSE), the semiconductor equipment company redefining the price-performance model for semiconductor test automation equipment, announced today that its senior investment partner has committed to a new round of capital funding.

Spintronics development gets boost with new findings into ferromagnetism in Mn-doped GaAs

06/07/2016  A research group at Tohoku University's WPI-AIMR has succeeded in finding the origin and the mechanism of ferromagnetism in Mn-doped GaAs.

SEMI reports first quarter 2016 worldwide semiconductor equipment figures; billings $8.3B

06/07/2016  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$8.3 billion in the first quarter of 2016.

Mentor Graphics Offers Tanner Calibre One Verification Suite for the Tanner Analog/Mixed-Signal IC Design Environment

06/06/2016  The Tanner Calibre One IC verification suite is now an integral part of the Tanner analog/mixed-signal (AMS) physical design environment

Soitec receives Best Quality Award from NXP Semiconductors

06/06/2016  Soitec's Power SOI substrates use to manufacture smart power IC's for automotive applications represent a significant and strategic market for Soitec's business, which is growing at a steady rate.

Mentor’s Pattern Matching Tackles IC Verification and Manufacturing Problems

06/05/2016  Mentor Graphics Corporation announced that customers and ecosystem partners are expanding their use of Calibre Pattern Matching solution to overcome previously intractable IC verification and manufacturing problems.

Samsung’s Closed-Loop DFM Solution Accelerates Yield Ramps

06/05/2016  Mentor Graphics Corp. announced that Samsung Foundry’s Closed-Loop DFM solution uses production Mentor Calibre and Tessent platforms to accelerate customer yield ramps




TWITTER


WEBCASTS



Interconnection Technologies

June 2016 (Date and time TBD)/ Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
More Webcasts

TECHNOLOGY PAPERS



Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS