Wafer Processing


Stanford technology makes metal wires on solar cells nearly invisible to light

11/30/2015  Stanford University scientists have discovered how to hide the reflective upper contact and funnel light directly to the semiconductor below.

Tallness Makes Reliable Spindt Tip Cold Cathodes

11/30/2015  Vacuum nanowire arrays of cold cathodes for high frequency sources and amplifiers

Doping powers new thermoelectric material

11/30/2015  In the production of power, nearly two-thirds of energy input from fossil fuels is lost as waste heat. Industry is hungry for materials that can convert this heat to useful electricity, but a good thermoelectric material is hard to find.

Mergers: Commission clears Avago's acquisition of Broadcom

11/25/2015  The Commission concluded that the merged entity would continue to face effective competition in Europe.

Cambridge CMOS Sensors wins again at NMI awards

11/24/2015  Cambridge CMOS Sensors (CCS), a semiconductor company with gas sensor solutions to monitor the local environment, today announced that it has been crowned winner of the Product of the Year category at this year's National Microelectronics Institute (NMI) Awards, held at the Grange Tower Bridge Hotel in London.

AKHAN Semiconductor opens facility to produce diamond-based semiconductor technology

11/24/2015  The AKHAN facility is slated to begin production in Q1 2016 and will produce and deliver more than 1,000 diamond-based technology windows.

Trillium announces acquisition of Oxford Instruments - Austin Division

11/24/2015  Trillium US Inc, headquartered in Clackamas, OR, has announced the acquisition of the Oxford Instruments - Austin division.

InvenSense CEO touts the Internet of Sensors

11/23/2015  InvenSense president and chief executive officer Behrooz Abdi sees the Internet of Things as an Internet of Sensors, a theme he explored Tuesday afternoon (November 17) at the opening of the fourth annual InvenSense Developers Conference.

Strange quantum phenomenon achieved at room temperature in semiconductor wafers

11/23/2015  Today, entanglement is accepted as a fact of nature and is actively being explored as a resource for future technologies including quantum computers, quantum communication networks, and high-precision quantum sensors.

Quantum spin could create unstoppable, one-dimensional electron waves

11/23/2015  A pair of scientists from the U.S. Department of Energy's Brookhaven National Laboratory and Ludwig Maximilian University in Munich have proposed the first solution to subatomic stoppage: a novel way to create a more robust electron wave by binding together the electron's direction of movement and its spin.

InvenSense Developers Conference Tackles Sensor Security, New Technologies

11/23/2015  The second day of the InvenSense Developers Conference saw presenters get down to cases – use cases for sensors.

Inotera appoints new president

11/19/2015  Inotera's Board of Directors announced this week that they have approved the appointment of Mr. Rod Morgan as president, succeeding Dr. Scott Meikle. The change is effective January 1, 2016.

GLOBALFOUNDRIES receives quality award from INOVA Semiconductors GmbH

11/19/2015  GLOBALFOUNDRIES today announced it has been presented with an Award of Excellence from INOVA Semiconductors GmbH, a specialist in the development of products for Gigabit/s serial data communication for in-vehicle Display- and Driver Assistance Systems.

ON Semiconductor to acquire Fairchild for $2.4B

11/18/2015  The acquisition creates a leader in the power semiconductor market with combined revenue of approximately $5 billion, diversified across multiple markets with a strategic focus on automotive, industrial and smartphone end markets.

Leti and partners announce developments on three mature platforms

11/18/2015  CEA-Leti and its partners in the European FP7 project PLAT4M today announced they have built three silicon photonics platforms.

Stacking instead of mixing

11/18/2015  A team from Jülich and Aachen has now found a way to control the desired conducting properties of this type of material more precisely and reliably than ever before.

TowerJazz to acquire Maxim Integrated's Texas wafer manufacturing plant

11/18/2015  TowerJazz announced today it has signed an agreement with Maxim Integrated Products, Inc. to purchase Maxim's 8-inch fabrication facility in San Antonio, Texas, United States.

Taking 2D materials from lab to fab, and to technology

11/17/2015  Due to their exciting properties, 2D crystals like graphene and transition metal dichalcogenides promise to become the material of the future.

Wally Rhines of Mentor Graphics Gets Phil Kaufman Award

11/16/2015  The Phil Kaufman Award is presented by the Electronic Design Automation Consortium (EDAC) and the IEEE Council on Electronic Design Automation (CEDA). It honors the memory of Philip A. Kaufman, the EDA industry pioneer, electronics engineer, and entrepreneur, who died in 1992.

Silicon shipment levels decline in third quarter 2015

11/13/2015  Worldwide silicon wafer area shipments decreased during the third quarter 2015 when compared to second quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.




Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

More Technology Papers


3D NAND Challenges and Opportunities

December 16, 2015 at 12:00 p.m. ET

Flash memory has revolutionized the world of solid-state data storage, mainly because of the advent of NAND technology. However, from the technical point of view, this requires a major change in how these memories are being fabricated. This presentation will discuss this (r)evolution as well as its major scaling limitations.

Sponsored By:
IoT Device Trends and Challenges

January 2016 (Date and time TBD)

The age of the Internet of Things is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts



International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015