Wafer Processing

WAFER PROCESSING ARTICLES



ISS Europe 2017: European innovation leadership

02/06/2017  Electronics manufacturing solutions for Automotive, Smart Manufacturing and Healthcare enabling the future of European technology.

Global semiconductor sales reach $339B in 2016

02/03/2017  Worldwide industry posts highest-ever annual sales; year-to-year sales increase 12 percent in December.

Germanium outperforms silicon in energy efficient transistors with n- und p- conduction

02/03/2017  A team of scientists from the Nanoelectronic Materials Laboratory (NaMLab gGmbH) and the Cluster of Excellence Center for Advancing Electronics Dresden (cfaed) at the Dresden University of Technology have demonstrated the world-wide first transistor based on germanium that can be programmed between electron- (n) and hole- (p) conduction.

Full(erene) potential

02/03/2017  The addition of specific molecules to 'trap' charge carriers in semiconducting polymers proves to be a powerful method of mastering the materials' electrical properties.

Samsung and Apple continued to lead as top global semiconductor customers in 2016

02/01/2017  Samsung Electronics and Apple remained the top two semiconductor chip buyers in 2016, representing 18.2 percent of the total worldwide market, according to Gartner, Inc.

Reliability Symposium coming to Silicon Valley

02/01/2017  The Silicon Valley Reliability Symposium will be held on Thursday, February 9th, 2017 at the Biltmore Hotel and Suites in Santa Clara, CA from 8:00 AM until noon.

SEMI 2020: "There are far better things ahead than any we leave behind"

02/01/2017  “Do not go where the path may lead, go instead where there is no path and leave a trail,” was how I started last week’s article. In that article we looked back on 2016 and the incredible progress of the industry and how it continually cuts new trail and keeps moving at the speed of Moore’s Law.

Without technology, China's "MIC 2025" results for ICs likely to fall woefully short of its goals

02/01/2017  IC Insights believes China's self-sufficiency targets for ICs of 40% in 2020 and 70% in 2025 are unrealistic.

CVD announces expansion plans for Tantaline in US

01/31/2017  CVD Equipment Corporation, a provider of chemical vapor deposition systems, announced today that its CVD Materials Corporation subsidiary plans to open a US facility for expansion of the corrosion resistant coating services currently offered through its Tantaline CVD ApS subsidiary in Nordborg, Denmark.

China's role in supply chains continues to grow

01/30/2017  Slight shift in sourcing from U.S. to Mexico, India, and Asia; most companies taking cautious approach to sourcing outside home region in 2017.

Research and Markets releases new report on semiconductor epitaxy wafer manufacturing market

01/30/2017  Globally, development of efficient and advanced technology, rising demand for electronic devices including laptops, tablets, gaming consoles, smartphones, flourishing electronics and semiconductor industry, and advantageous properties of semiconductor Epi' (Epitaxy) wafer are the prime growth drivers of the semiconductor Epi' (Epitaxy) wafer manufacturing market.

Understanding breakups

01/30/2017  A new model describing the deformation and breakup of droplets could help improve nanoscale printing and spraying.

New 'needle-pulse' beam pattern packs a punch

01/27/2017  A new beam pattern devised by University of Rochester researchers could bring unprecedented sharpness to ultrasound and radar images, burn precise holes in manufactured materials at a nano scale -- even etch new properties onto their surfaces.

MACOM successfully completes acquisition of AppliedMicro

01/27/2017  MACOM Technology Solutions Holdings, Inc. today announced that it has successfully completed its previously announced acquisition of Applied Micro Circuits Corporation.

Do not go where the path may lead

01/27/2017  What follows, in Part 1 of this two-part article, is a quick look back at the industry in 2016 and the road ahead in 2017 followed by what SEMI achieved in 2016 and where SEMI’s road will lead in 2017 to keep pace our industry charging forward where there is no path.

Executive viewpoints: 2017 outlook

01/25/2017  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2017.

Vital Control in Fab Materials Supply-Chains

01/25/2017  Expert panel discussion at Critical Materials Council (CMC) conference.

ISS Europe 2017: European innovation leadership

01/24/2017  Electronics manufacturing solutions for Automotive, Smart Manufacturing and Healthcare enabling the future of European technology.

2015-2016 deals dominate semiconductor M&A ranking

01/20/2017  U.S. companies making acquisitions accounted for more than half of the value in announced transactions in the last two years, while Asia-Pacific represented 23%.

Analog Devices announces changes to membership of Board of Directors

01/19/2017  Richard Beyer and John Hodgson will retire from the Company's Board of Directors, effective as of the Company's 2017 Annual Meeting of Shareholders.




TWITTER


WEBCASTS



Internet of Things

February 2017 - Date and time TBD / Sponsored by Epicor

The age of IoT is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Fab Cost Reduction

February 2017 - Date and time TBD / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



ISS Europe 2017
Munich, Germany
http://www.semi.org/eu/iss-europe-2017
March 05, 2017 - March 07, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS