Wafer Processing

WAFER PROCESSING ARTICLES



Global semiconductor sales in November outpace 2013 totals

01/05/2015  The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $29.7 billion for the month of November 2014.

Solid Doping for Bulk FinFETs

01/05/2015  In another example of the old one-liner that “all that is old is new again,” the old technique of solid-source doping is being used by Intel for a critical process step in so-called “14nm node” finFET manufacturing.

A new hardmask process, Saphira

12/23/2014  A new hardmask material and process was introduced this month by Applied Materials. Designed for advanced logic and memories, including DRAM and vertical NAND, the hardmask is transparent, which simplifies processing.

Global semiconductor market set for strongest growth in four years in 2014

12/23/2014  Worldwide semiconductor market revenue is on track to achieve a 9.4 percent expansion this year, with broad-based growth across multiple chip segments driving the best industry performance since 2010.

Hands on: Crafting ultrathin color coatings

12/22/2014  In Harvard's high-tech cleanroom, applied physicists produce vivid optical effects on paper.

Piezoelectricity in a 2-D semiconductor

12/22/2014  Berkeley Lab researchers discovery of piezoelectricty in molybdenum disulfide holds promise for future MEMS.

Eliminating electrostatic discharge: Protecting tomorrow's technology

12/22/2014  A new range of dissipative materials based on fluoroelastomer and perfluoroelastomer polymers is designed for wafer processing and wafer handling applications.

IoT's divergent needs will drive different types of technologies

12/19/2014  Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical.

The most expensive defect

12/18/2014  Defects that aren’t detected inline cost fabs the most.

From transistors to bumps: Preparing SEM cross-sections by combining site-specific cleaving and broad ion milling

12/18/2014  Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling.

Process Watch: Fab managers don’t like surprises

12/18/2014  Nobody likes surprises - especially the managers of $10 billion factories.

The simplest element: Turning hydrogen into 'graphene'

12/16/2014  New work from Carnegie's Ivan Naumov and Russell Hemley delves into the chemistry underlying some surprising recent observations about hydrogen, and reveals remarkable parallels between hydrogen and graphene under extreme pressures.

IEDM: Thanks for MEMS-ories

12/16/2014  At the 60th annual International Electron Devices Meeting this week in San Francisco, there was much buzz about the 14-nanometer FinFET papers being presented by IBM and Intel. Those papers were the subject of a press release two months in advance.

Innovation in the shadow of volcanic change

12/16/2014  The semiconductor equipment and materials industry is currently enjoying a double-digit annual growth rate and good prospects looking forward to 2015.

Scientists measure speedy electrons in silicon

12/12/2014  An international team of physicists and chemists based at the University of California, Berkeley, has for the first time taken snapshots of this ephemeral event using attosecond pulses of soft x-ray light lasting only a few billionths of a billionth of a second.

Paul Daniel Dapkus wins 2015 John Tyndall Award

12/12/2014  The Optical Society (OSA) and the IEEE Photonics Society announced that Paul Daniel Dapkus, W. M. Keck Distinguished Professor of Engineering at the University of Southern California, is the recipient of the 2015 John Tyndall Award.

Global Semiconductor Alliance announces 2014 Award recipients

12/12/2014  GSA members identified the Most Respected Public Semiconductor Company Award winners by casting ballots for the industry’s most respected companies for its products, vision and future opportunities.

John Neuffer named president and CEO of SIA

12/11/2014  The Semiconductor Industry Association (SIA) announced that John Neuffer has been named president & CEO of the association.

Entegris launches next generation of 450mm wafer carriers

12/10/2014  Entegris, Inc., a developer of yield-enhancing materials and solutions for highly advanced manufacturing environments, announced the release and global availability of their next generation of 450mm wafer carrier solutions (P2) for the safe and reliable transport of 450mm wafers used in semiconductor manufacturing.

Lattice Semiconductor announces appointment of Jeff Richardson to Board of Directors

12/10/2014  Lattice Semiconductor Corporation today announced that its Board of Directors has appointed Jeff Richardson to the company’s Board of Directors and Audit Committee.




FINANCIALS



TECHNOLOGY PAPERS



Epoxies and Glass Transition Temperature

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.January 09, 2015
Sponsored by Master Bond, Inc.,

Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.October 07, 2014
Sponsored by Master Bond, Inc.,

Conformal Coatings for Reliable Electronic Assemblies

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.April 24, 2014
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



FinFETs

February 2015 (Date and time TBD)

FinFETs provide better performance than planar transistor architectures, but the entire 3D structure requires strict process control, including fin and gate dimensions, profiles and roughness, and metal gate undercuts. As more advanced node semiconductors enter production, the application of HKMG will be key to yield and cost improvement. Advanced wafer fab tools are needed for HKMG, such as ALD.

Sponsored By:

3D Integration

March 2015 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Materials

April 2015 (Date and time TBD)

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials will play in the future.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SEMICON Korea 2015
Seoul, Korea
http://www.semiconkorea.org/en/
February 04, 2015 - February 06, 2015
LithoVision 2015
San Jose, California United States
https://www.nikonprecision.com/lithovision/
February 22, 2015 - February 22, 2015
The ConFab
Las Vegas, Nevada
http://www.theconfab.com
May 19, 2015 - May 22, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015