Wafer Processing

WAFER PROCESSING ARTICLES



Cadence appoints Anirudh Devgan as President

11/17/2017  Cadence Design Systems, Inc. today announced that Anirudh Devgan, executive vice president and general manager of the Digital & Signoff Group and the System & Verification Group, has been appointed president of Cadence, effective immediately.

A new window into electron behavior

11/17/2017  Scientists invent technique to map energy and momentum of electrons beneath a material's surface.

TEL NEXX modernizes shop floor data collection and quality control with InfinityQS ProFicient

11/16/2017  Quality Intelligence solution enables chip metallization provider to improve accuracy and timeliness of data capture, rapidly respond to issues, and identify opportunities for continuous improvement.

SkyWater significantly expands pure-play technology foundry customer base

11/16/2017  SkyWater Technology Foundry announces that it has been assigned the Specialty Foundry customer relationships from Cypress Semiconductor Corporation.

Marvell Semiconductor president and CEO Matt Murphy elected chair of SIA

11/16/2017  The Semiconductor Industry Association today announced the SIA Board of Directors has elected Matt Murphy, president and CEO of Marvell Semiconductor, Inc., as its 2018 Chair and Sanjay Mehrotra, president and CEO of Micron Technology, Inc., as its 2018 Vice Chair.

Japan issues landmark diamond semiconductor patent to AKHAN

11/15/2017  AKHAN Semiconductor, a technology company specializing in the fabrication and application of lab-grown, electronics-grade diamond, announced today the issuance by the Japan Patent Office of a patent covering a method for the fabrication of diamond semiconductor materials.

Will Samsung's 2017 semi capex deliver knockout blow to competition?

11/15/2017  The company’s $26 billion in 2017 outlays expected to be more than Intel and TSMC combined.

SUNY Poly, IBM celebrates 20th anniversary of copper interconnects during Albany nanotechnology symposium

11/14/2017  SUNY Polytechnic Institute (SUNY Poly) is hosting the 11th IEEE Nanotechnology Symposium at its world-class Albany NanoTech Complex on Wednesday, November 15, from 9 a.m. to 5:30 p.m.

First SEMICON Europa opens this year in co-location with productronica

11/14/2017  Semiconductor industry back on track for growth in Europe -- major new investments.

Ben-Gurion University researchers achieve breakthrough in camouflaging an optical chip rendering it invisible

11/14/2017  Ben-Gurion University of the Negev (BGU) researchers have achieved a breakthrough in manipulating light to render an object, such as an optical chip, invisible.

Improving sensor accuracy to prevent electrical grid overload

11/13/2017  Engineers take note -- new current sensors need fine-tuning to accurately inform monitors of the electrical grid about incoming surges.

Transfer technique produces wearable gallium nitride gas sensors

11/10/2017  A transfer technique based on thin sacrificial layers of boron nitride could allow high-performance gallium nitride gas sensors to be grown on sapphire substrates and then transferred to metallic or flexible polymer support materials.

2017 Global Semiconductor Alliance Award nominees announced

11/09/2017  The Global Semiconductor Alliance (GSA) today announced the 2017 award nominees for the GSA Awards Dinner Celebration.

Enabling the A.I. era

11/08/2017  There’s a strongly held belief now that the way in which semiconductors will be designed and manufactured in the future will be largely determined by a variety of rapidly growing applications, including artificial intelligence/deep learning, virtual and augmented reality, 5G, automotive, the IoT and many other uses, such as bioelectronics and drones. The key question for most semiconductor manufacturers is how can they benefit from these trends?

Temperature impact on UHP pressure transducer performance

11/08/2017  The temperature impact on the performance of UHP pressure transducers is discussed.

The intelligence that leads to artificial intelligence

11/08/2017  Artificial intelligence (AI) may be a hot topic today, but SEMI has helped to incubate Big Data and AI since its founding.

Semiconductor super cycle: Market trends, drivers and forecasts

11/08/2017  2017 will be a record-breaking year. Semiconductor sales will exceed $400 billion for the first time and semiconductor equipment sales will finally shatter the historic high set in 2000. What is driving this growth?

Third quarter 2017 silicon wafer shipments hit another quarterly record

11/08/2017  Worldwide silicon wafer area shipments increased during the third quarter 2017 when compared to second quarter 2017 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Kyma demonstrates high quality 200mm diameter GaN on QST templates

11/07/2017  Kyma Technologies, Inc. announced it has used its new K200 hydride vapor phase epitaxy (HVPE) growth tool to produce high quality 200mm diameter HVPE GaN on QST (QROMIS Substrate Technology) templates.

2017 sees advances in connected devices, memory

11/07/2017  The technologies to watch identified by TechInsights analysts at the beginning of the year have not been disappointing.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

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ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018
DesignCon
Santa Clara, CA
http://www.designcon.com/
January 30, 2018 - February 01, 2018
2018FLEX
Monterey, CA
http://www.semi.org/en/2018flex
February 12, 2018 - February 15, 2018
IPC APEX EXPO
San Diego, CA
http://www.ipcapexexpo.org/html/default.htm
February 24, 2018 - March 01, 2018
LithoVision 2018
San Jose, CA
http://www.lithovision.com
February 25, 2018 - February 25, 2018


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