Wafer Processing

WAFER PROCESSING ARTICLES



Understanding the structural and optical properties of silicon nitride

05/07/2015  Using first-principles calculations, the electronic structures and optical properties that arise on doping-atom-containing silicon nitride systems are reported as a function of dielectric constant, reflectivity, absorption and loss spectra.

Enhanced thermal management solutions for RF power amplifiers

05/06/2015  Synthetic diamond heat spreaders and GaN-on-Diamond wafers have emerged as a leading thermal- management technology for RF Power Amplifiers.

"Microcombing" creates stronger, more conductive carbon nanotube films

05/05/2015  Researchers from North Carolina State University and China's Suzhou Institute of Nano-Science and Nano-Biotics have developed an inexpensive technique called "microcombing" to align carbon nanotubes.

Defects in atomically thin semiconductor emit single photons

05/05/2015  Researchers at the University of Rochester have shown that defects on an atomically thin semiconductor can produce light-emitting quantum dots.

Improving organic transistors that drive flexible and conformable electronics

05/05/2015  A revolution is coming in flexible electronic technologies as cheaper, more flexible, organic transistors come on the scene to replace expensive, rigid, silicone-based semiconductors, but not enough is known about how bending in these new thin-film electronic devices will affect their performance.

New study suggests that rapid innovation in semiconductors provides hope for better economic times ahead

05/04/2015  A new study coauthored by Wellesley economist, Professor Daniel E. Sichel, reveals that innovation in an important technology sector is happening faster than experts had previously thought, creating a backdrop for better economic times ahead.

SEMATECH and Exogenesis form strategic alliance to commercialize accelerated neutral atom beam tech

05/04/2015  SEMATECH and Exogenesis Corp. have agreed to a strategic alliance to commercialize Exogenesis' Accelerated Neutral Atom Beam (ANAB) technology and their nAcceltm accelerated particle beam equipment platform.

Solid State Watch: April 24-30, 2015

05/04/2015  Applied Materials and Tokyo Electron terminate merger; Sensor competition, actuator recovery impact supplier ranking; Georgia Tech research offers novel cellular sensing platform for expanded use of semiconductor in biotech applications; Silicon Motion announces agreement to acquire Shannon Systems

Dow's SOLDERON tin-silver plating chemistry wins prestigious Bronze Edison Award

05/01/2015  Dow Electronic Materials, a business unit of The Dow Chemical Company, today announced that its SOLDERON BP TS 6000 Tin-Silver Plating Chemistry was honored as a Bronze 2015 Edison Award winner in the Material Science: Manufacturing category.

Entegris elects James P. Lederer to Board of Directors

05/01/2015  Entegris, Inc., a provider of yield-enhancing materials and solutions for advanced manufacturing processes, announced the election of James P. Lederer as an independent director at the Company's Annual Meeting of Shareholders held today.

It’s blue skies for Jabil and its customers

05/01/2015  While making printed circuit boards is still a big business for the St. Petersburg, Fla.-based Jabil, which boasts 90 plants in 24 countries around the world, the Blue Sky Center emphasizes that Jabil has progressed from being a board manufacturer to a full-service supply chain management firm.

Georgia Tech research offers novel cellular sensing platform for expanded use of semiconductor in biotech applications

04/30/2015  Researchers from the Georgia Institute of Technology have developed a novel cellular sensing platform that promises to expand the use of semiconductor technology in the development of next-generation bioscience and biotech applications.

Safe CMP slurries for future IC materials

04/29/2015  New CMP processes for new materials planned to be used in building future IC devices are now in R&D. Early data on process trade-offs as well as on EHS aspects were presented at the CMP Users Group meeting.

Brewer Science and Nissan Chemical Industries formalize agreement expanding support for the semiconductor industry

04/28/2015  Brewer Science, Inc., and Nissan Chemical Industries, Ltd., announced they have formally extended their business relationship through 2028.

Two-dimensional semiconductor comes clean

04/28/2015  Researchers at Columbia Engineering, Harvard, Cornell, University of Minnesota, Yonsei University in Korea, Danish Technical University, and the Japanese National Institute of Materials Science have shown that the performance of another 2D material--molybdenum disulfide (MoS2)--can be similarly improved by BN-encapsulation.

Applied Materials and Tokyo Electron terminate merger

04/27/2015  The decision came after the U.S. Department of Justice (DoJ) advised the parties that the coordinated remedy proposal submitted to all regulators would not be sufficient to replace the competition lost from the merger

UGA chemists' synthesis of silicon oxides opens 'new world in a grain of sand'

04/23/2015  In an effort that reaches back to the 19th-century laboratories of Europe, a discovery by University of Georgia chemistry researchers establishes new research possibilities for silicon chemistry and the semiconductor industry.

From metal to insulator and back again

04/23/2015  New work from Carnegie's Russell Hemley and Ivan Naumov hones in on the physics underlying the recently discovered fact that some metals stop being metallic under pressure.

How emerging IoT impacts the semiconductor sector

04/23/2015  In this 50th year anniversary of Moore’s Law, the steady scaling of silicon chips’ cost and performance that has so changed our world over the last half century is now poised to change it even further through the Internet of Things.

North American semiconductor equipment industry posts March 2015 book-to-bill ratio of 1.10

04/22/2015  A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month.




HEADLINES

FINANCIALS



TECHNOLOGY PAPERS



Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

ASIC Design Made Cost Effective with Low Cost Tools and Masks

For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs. April 13, 2015
Sponsored by Mentor Graphics

High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Sensor Fusion and the Role of MEMS in IoT

Thursday May 28, 2015 at 1:00 p.m. EST

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Interconnects

June 2015 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Understanding Defects

July 2015 (Date and time TBD)

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015
Design Automation Conference (DAC)
San Francisco, CA
https://dac.com
June 07, 2015 - June 11, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015
SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015