Wafer Processing

WAFER PROCESSING ARTICLES



Samsung expands its advanced foundry offerings with 14LPU and 10LPU processes

11/03/2016  The new foundry process offerings as well as EUV-enabled 7nm wafer are presented at the Samsung Foundry Forum.

2016 Global Semiconductor Alliance Award nominees announced

11/03/2016  The Global Semiconductor Alliance (GSA) announced the 2016 award nominees for the GSA Awards Dinner Celebration.

Qualcomm/NXP deal underscores semiconductor merger trend

11/02/2016  Qualcomm's proposed acquisition of NXP Semiconductors marks the latest deal in a wave of industry consolidation that includes increasingly expensive transactions with greater focus on expanding scope rather than economies of scale.

Edwards and GlobalFoundries recognized by Singapore's National Environmental Agency

11/01/2016  Edwards and GlobalFoundries Singapore were recognized by Singapore’s National Environment Agency in the Best Practices category at the 2016 Energy Efficiency National Partnership (EENP) Awards.

Samsung Austin Semiconductor continues central Texas growth with more than $1B in investment

11/01/2016  Investments in its facilities will enhance current System LSI production to meet the growing demands in the industry for advanced system-on-chip (SoC) products especially for mobile and other electronic devices.

Global semiconductor sales increase 11.5% in Q3

11/01/2016  Industry posts highest-ever quarterly sales; market still behind 2015's year-to-date total.

van der Pauw and Hall voltage measurements with a parameter analyzer

10/31/2016  van der Pauw measurements with a parameter analyzer are examined followed by a look at Hall effects measurements.

ON Semiconductor selects DSI to improve stock accuracy with Digital Supply Chain Platform

10/31/2016  DSI announced today that ON Semiconductor has selected DSI’s Digital Supply Chain Platform (DSCP) to increase stock accuracy and improve worker productivity in its inventory processes across the global supply chain.

Managing particle flows in process exhaust for safety and profitability

10/28/2016  Solid particles in the abatement exhaust must be properly managed, and in some cases, substantially reduced from the gas stream before it is released into the environment.

Power electronics powered by Picosun's batch aluminum nitride

10/27/2016  Picosun Oy, a supplier of advanced industrial ALD (Atomic Layer Deposition) technology, now provides its customers production-scale aluminum nitride batch process with superior film thickness uniformity and fast speed.

Cadence CEO to be awarded Dr. Morris Chang Exemplary Leadership Award

10/27/2016  He will be presented with this achievement award during the GSA Awards Dinner Celebration on Thursday, December 8, 2016, at the Santa Clara Convention Center in Santa Clara, Calif.

Qualcomm to acquire NXP

10/27/2016  Qualcomm Incorporated and NXP Semiconductors N.V. today announced a definitive agreement, unanimously approved by the boards of directors of both companies, under which Qualcomm will acquire NXP.

Cadence reference flow with digital and signoff tools certified on Samsung's 10nm process technology

10/25/2016  Reference flow enables system and semiconductor companies to accelerate delivery of designs on Samsung's second-generation 10nm process (10LPP).

SEMICON Europa opens tomorrow in Grenoble, France

10/24/2016  SEMICON Europa will open its doors tomorrow, showcasing the latest product, tools, and technologies for advanced microelectronics manufacturing.

ams schedules 2017 multi-project wafer starts for analog foundry customers

10/24/2016  180nm CMOS and HV-CMOS MPW runs are now manufactured in ams' 200mm fabrication facility in Austria.

Messe München and SEMI Europe announce new alliance

10/24/2016  SEMICON Europa co-locating with productronica and electronica, expanding electronics focus.

New perovskite solar cell design could outperform existing commercial technologies

10/21/2016  Stanford, Oxford team creates high-efficiency tandem cells.

Researchers find way to tune thermal conductivity of 2-D materials

10/21/2016  Researchers have found an unexpected way to control the thermal conductivity of two-dimensional (2-D) materials, which will allow electronics designers to dissipate heat in electronic devices that use these materials.

Semiconductor equipment bookings continue to outpace equipment billings in new book-to-bill report

10/21/2016  A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.

Avalanche Technology announces the start of volume production of STT-MRAM on 300mm wafers

10/20/2016  Avalanche Technology, Inc., has entered into a manufacturing agreement with Sony Semiconductor Manufacturing Corporation to begin production of it's Spin Transfer Torque Magnetic RAM (STT-MRAM) on 300mm wafers at various advanced geometry nodes.




TWITTER


WEBCASTS



Smartphone Market Driving 7nm & 5nm Node 3-D Transistors and Stacked Devices

December 15, 2016 at 1 p.m. ET / Hosted by Solid State Technology

The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.

Sponsored By:

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TECHNOLOGY PAPERS



Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

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EVENTS



Industry Strategy Symposium 2017
Half Moon Bay, CA
http://www.semi.org/en/en/node/71404
January 08, 2017 - January 11, 2017
European 3D Summit 2017
Grenoble, France
http://www.semi.org/eu/european-3d-summit-2017
January 23, 2017 - January 25, 2017
LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS