Wafer Processing


SCREEN Semiconductor Solutions and Axcelis Technologies announce distribution and support agreement

03/09/2018  Agreement brings Purion ion implant platform to Japan market.

Synopsys collaborates with Samsung Foundry to develop DesignWare IP for Samsung 8nm finFET process

03/08/2018  Synopsys, Inc. today announced a collaboration with Samsung Foundry to develop DesignWare Foundation IP for Samsung's 8nm Low Power Plus (8LPP) FinFET process technology.

Simulation and experiment help TU Dresden researchers study next-generation semiconductors

03/08/2018  Theoretical physicists and experimentalists collaborate to identify dopants capable of enabling new designs of semiconducting materials.

KLA-Tencor receives Intel's Preferred Quality Supplier award

03/08/2018  KLA-Tencor Corporation has been recognized by Intel as a recipient of a 2017 Preferred Quality Supplier (PQS) award.

Applied Materials receives Intel's Preferred Quality Supplier award

03/07/2018  Applied Materials, Inc. has been recognized by Intel as a recipient of a 2017 Preferred Quality Supplier (PQS) award.

Are the major DRAM suppliers stunting DRAM demand?

03/07/2018  Skyrocketing DRAM prices potentially open the door for startup Chinese competitors.

January semiconductor sales up 22.7% compared to last year

03/06/2018  Global semiconductor market grows year-to-year for the 18th consecutive month; month-to-month sales decrease slightly.

Presto Engineering provides high-volume wafer-level test for Maja Systems wireless data-center connectivity solutions

03/06/2018  Launch of Maja Systems terabit connectivity solutions in millimeter wave CMOS accelerated by Presto’s high-volume wireless and RF test expertise.

SUNY Poly's Center for Semiconductor Research in Albany earns TÜV SÜD AMERICA INC. ISO 9001:2015 certification

03/06/2018  SUNY Polytechnic Institute today announced that its advanced semiconductor-based research and development efforts at its Albany NanoTech Complex have successfully received ISO 9001:2015 certification from TÜV SÜD AMERICA INC. for its effective quality management system.

Silvaco completes acquisition of NanGate

03/05/2018  Silvaco today announced that it has acquired NanGate, a developer of Electronic Design Automation (EDA) software, that offers tools and services for creation, optimization, characterization and validation of physical library IP.

Executive viewpoints: 2018 outlook

03/05/2018  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2018.

Work to do to keep the good times rolling

03/02/2018  2017 was a terrific year for SEMI members. Chip revenues closed at nearly $440B, an impressive 22 percent year- over-year growth.

Understanding ALD, MLD and SAMs as they enter the fab

03/01/2018  As the world of advanced manufacturing enters the sub-nanometer scale era, it is clear that ALD, MLD and SAM represent viable options for delivering the required few-atoms-thick layers required with uniformity, conformality, and purity.

Semiconductor Manufacturing Electronics Corporation formally signed a joint venture agreement

03/01/2018  SMIC, Shaoxing Government, and Shengyang Group together announced today the founding of the Semiconductor Manufacturing Electronics (Shaoxing) Corporation (planned) with joint capital contributions. T

92 IC wafer fabs closed or repurposed from 2009-2017

03/01/2018  150mm and 200mm wafer fabs accounted for two-thirds of total closures.

Samsung Electronics breaks ground on new EUV line in Hwaseong

02/28/2018  Construction will be completed in the second half of 2019 and ready for production in 2020 Samsung aims to maintain its leadership in cutting-edge process technology under 7nm.

GLOBALFOUNDRIES strengthens 22FDX eMRAM platform with eVaderis' ultra-low power MCU reference design

02/27/2018  Co-developed technology solution enables significant power and die size reductions for IoT and wearable products.

Brewer Science announces new OptiLign DSA product family

02/27/2018  Brewer Science, Inc., today from SPIE Advanced Lithography 2018 introduced its OptiLign commercial-quality directed self-assembly (DSA) material set developed in collaboration with Arkema.

ClassOne Equipment selected to upgrade major UK fab

02/27/2018  ClassOne Equipment, Atlanta-based provider of refurbished name-brand semiconductor processing equipment, has announced the sale of multiple systems to a major global components manufacturer as part of a significant upgrade to their UK fab.

SILTECTRA's "twinning" breakthrough promises to vastly reduce wafering costs for manufacturers of silicon carbide-based IC devices

02/26/2018  SILTECTRA GmbH today reports that it has validated a breakthrough capability for its COLD SPLIT technology.



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:


Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts


Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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