Wafer Processing


Intel appoints Bob Swan Executive Vice President and Chief Financial Officer

09/20/2016  Intel Corporation today announced the appointment of Robert H. Swan as executive vice president and chief financial officer (CFO), effective Oct. 10, 2016.

≤200mm semiconductor manufacturing is here to stay

09/20/2016  Ted Shafer of ASML reports on the highlights from the ≤200mm manufacturing session during SEMICON West, organized by the SEMI Secondary Equipment and Applications Special Interest Group.

Synopsys and TSMC collaborate on development of interface and foundation IP for 7nm FinFET process

09/19/2016  Synopsys, Inc. today announced the successful tapeout of multiple customer test chips with DesignWare Logic Libraries and Embedded Memories for TSMC's 7nm FinFET process.

Moore's Law did indeed stop at 28nm

09/19/2016  As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

Cascade Microtech introduces wafer-level electromigration test system

09/15/2016  Cascade Microtech today announced the launch of the Estrada-EM system.

Global semiconductor sales rebound in July

09/14/2016  The Semiconductor Industry Association announced worldwide sales of semiconductors reached $27.1 billion for the month of July 2016.

The future of Europe pitch their startups at SEMICON Europa's Innovation Village

09/14/2016  SEMI today announced that twenty-one start-ups have been selected to pitch to investors and exhibit their products at SEMICON Europa's INNOVATION VILLAGE in Grenoble, France at the Alpexpo from 25-27 October, 2016.

UC Berkeley, University of Minnesota professors recognized at annual SRC TECHCON Conference

09/13/2016  Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, presented its highest honors Sept. 12 to professors from University of California, Berkeley and University of Minnesota at SRC's annual TECHCON conference in Austin, Texas.

Silicon nanoparticles instead of expensive semiconductors

09/12/2016  Within an international collaboration, physicists of the Moscow State University replace expensive semiconductors with affordable silicon nanoparticles for display production.

Qualcomm Communication Technologies opens in Shanghai for semiconductor test manufacturing

09/12/2016  Qualcomm Incorporated (NASDAQ: QCOM) today announced the opening of Qualcomm Communication Technologies (Shanghai) Co. Ltd., a semiconductor test facility in the Waigaoqiao (WGQ) free-trade zone in Shanghai, and its first foray into providing manufacturing services for semiconductors.

Liquid to liquid ambient cooling systems for semiconductor tools

09/09/2016  An overview of liquid-to-liquid cooling systems and their operating principles.

M+W Group presents an integrated waste program for semiconductor facilities

09/08/2016  The global high-tech engineering and construction company M+W Group has presented current and future trends, as well as state of the art solutions, for an integrated approach to waste reduction in order to improve the sustainability of semiconductor fabs

Lam Research introduces dielectric atomic layer etching capability for advanced logic

09/07/2016  Lam Research Corp., an advanced manufacturer of semiconductor equipment, today announced that it is expanding its atomic layer etching (ALE) portfolio with the addition of ALE capability on its Flex dielectric etch systems.

SPTS Technologies collaborates with Novati Technologies to establish new plasma dicing line

09/07/2016  SPTS Technologies today announced its collaboration with Novati Technologies to establish Novati’s new plasma dicing line at their fab in Austin, Texas.

SEMI recognizes UMC CEO Po Wen Yen for sustainable semiconductor manufacturing leadership

09/07/2016  SEMI today presented its industry leadership award for sustainable manufacturing to Po Wen Yen, CEO of United Microelectronics Corporation (UMC).

SEMICON Taiwan 2016 opens tomorrow; 43,000 attendees expected

09/06/2016  Upbeat about the growth prospects of Taiwan's semiconductor sector, SEMICON Taiwan 2016 features 600 exhibitors covering over 1,600 booths,and is expected to attract more than 43,000 visitors in three days.

ZEISS launches a new high performance wafer and mask tuning system

09/06/2016  ZEISS introduces the new ZEISS ForTune system for photomask tuning. With its latest optical design, it takes two main mask tuning processes to the next level in terms of efficiency, accuracy and throughput. The first tool has already been delivered to the first customer.

Thinner wafers are fostering the growth and emergence of new dicing technologies

09/06/2016  Driven by rising demand for thinner wafers and stronger die, dicing technology is evolving.

Cabot Microelectronics appoints Thomas F. Kelly as VP of Corporate Development

09/02/2016  Cabot Microelectronics Corporation announced the appointment of Thomas F. Kelly, Vice President, Corporate Development, which is effective as of September 6, 2016.

Semiconductor industry icons to gather at SIA Award Dinner Nov. 10 in San Jose

09/02/2016  The Semiconductor Industry Association today announced more than a dozen semiconductor industry icons, leaders, and founders will come together at the annual SIA Award Dinner on Thursday, Nov. 10 in San Jose to celebrate the 25th anniversary of the Robert N. Noyce Award, the industry's highest honor.



Heterogeneous Integration: An Emerging Trend for Next Generation Microelectronic Devices and a Tremendous Opportunity for Advanced Packaging

October 26, 2016 at 1 p.m. ET / Sponsored by Air Products

With the change in the traditional IC scaling cadence, the expansive growth of “Big data,” and the pervasive nature of computing, rises a paradigm shift in integrated circuit scaling and microelectronic devices. The pervasive nature of computing drives a need for connecting billions of people and tens of billions of devices/things via cloud computing. Such connectivity effect will generate tremendous amount of data and would require a revolutionary change in the technology infrastructures being used to transmit, store and analyze data. Heterogeneous integration through package with technologies such as system in package (SIP), on package integration (OPI) and fan-out (WLFO and PLFO) are poised to change the packaging industry and play a disruptive role in enabling next generation devices.

Sponsored By:
Enabling The Future Of Information Technology Without Moore’s Law Scaling

November 17, 2016 at 1:00 p.m. ET / Sponsored by Astronics

Moore’s Law scaling can no longer maintain the pace of progress just when we need it most. Data, logic and applications are migrating to the cloud, consumerization of data and the rise of the Internet of Things are placing new demands and they are all occurring at the same time. Difficult challenges in power, performance, latency, bandwidth density, security and cost threaten our ability to maintain the progress that has enabled the growth of information technology. Meeting these challenges will require reduction in power and cost per function by a factor of 104 over the next 15 years while improving performance and decreasing latency. Only a revolution in packaging through Complex 3D-SiP can provide a solution. This will require new tools for design and simulation, new packaging architectures, production processes, materials, and equipment. The difficult challenges and potential solutions will be discussed.

Sponsored By:
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New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers


Electronics Packaging Technology Conference
November 30, 2016 - December 03, 2016
International Electron Devices Meeting 2016 (IEDM)
San Francisco, CA
December 03, 2016 - December 07, 2016
The ConFab 2017
San Diego, CA
May 14, 2017 - May 17, 2017