Wafer Processing

WAFER PROCESSING ARTICLES



Murphy, Choh and Pilla join ClassOne Technology's Board of Advisors

12/01/2016  ClassOne Technology, manufacturer of advanced wet processing equipment for ≤200mm substrates, announced the formation of a Board of Advisors.

SEMI adds industry veteran to Americas leadership

11/30/2016  David Anderson joins as SEMI Americas President.

IoT and automotive to drive IC market growth through 2020

11/30/2016  New report also projects good IC sales increases in medical electronics, digital TVs, and servers.

SiFive launches industry's first open-source RISC-V SoC

11/29/2016  SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced the availability of its Freedom Everywhere 310 (FE310) system on a chip (SoC).

North American semiconductor equipment industry posts October 2016 book-to-bill ratio of 0.91

11/28/2016  The book-to bill ratio for October dropped below parity for the first time in 11 months, even though bookings and billings activity remains at elevated levels relative to last year.

Microsemi to offer FPGA-based RISC-V IP core

11/21/2016  Microsemi Corporation (Nasdaq: MSCC) announced it is the first field programmable gate array (FPGA) provider to offer a comprehensive software tool chain and intellectual property (IP) core for RISC-V designs.

Executives to get strategic perspectives for success at SEMI ISS 2017

11/17/2016  Electronics manufacturing executives will examine growth prospects, global industry developments and technology strategy at the SEMI Industry Strategy Symposium (ISS) 2017 to be held January 8-11 at the Ritz-Carlton, Half Moon Bay.

Qualcomm, Samsung collaborate on 10nm process tech for the latest Snapdragon 835 mobile processor

11/17/2016  Qualcomm Incorporated today announced that its subsidiary, Qualcomm Technologies, Inc., and Samsung Electronics Co., Ltd., have extended their decade-long strategic foundry collaboration to manufacture Qualcomm Technologies' latest Snapdragon premium processor, Qualcomm Snapdragon 835, with Samsung's 10nm FinFET process technology.

UMC holds grand opening ceremony for new 12-inch wafer fab in China

11/16/2016  The fab, which was completed in record time, realized volume production for customer products merely 20 months after groundbreaking in March of 2015.

Mentor Graphics Signs Agreement with ARM to Accelerate Early Hardware/Software Development

11/16/2016  Mentor Graphics Corporation (NASDAQ: MENT) has signed a multiyear license agreement with ARM to gain early access to a broad range of ARM Fast Models, Cycle Models and related technologies.

Siemens announces plans to acquire Mentor Graphics in $4.5B deal

11/14/2016  Siemens and Mentor Graphics today announced that they have entered into a merger agreement under which Siemens will acquire Mentor for an enterprise value of $4.5 billion.

Smartphone unit shipments forecast to grow at single-digit rates through 2020

11/09/2016  IC Market Drivers 2017 analyzes end-use applications and impact on IC market growth.

Third quarter 2016 silicon wafer shipments set a new record

11/09/2016  Worldwide silicon wafer area shipments increased during the third quarter 2016 when compared to second quarter 2016 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

New record for silicon-based multi-junction solar cell

11/09/2016  Researchers at the Fraunhofer Institute for Solar Energy Systems ISE together with the Austrian company EV Group (EVG) have successfully manufactured a silicon-based multi-junction solar cell with two contacts and an efficiency exceeding the theoretical limit of silicon solar cells.

The silicon photonics industry is ready for take-off

11/08/2016  Silicon photonic technologies have reached the tipping point that precedes massive growth.

President’s Council launches semiconductor working group

11/08/2016  Tthe President’s Council of Advisors on Science and Technology (PCAST) announced the formation of a new working group focused on strengthening the U.S. semiconductor industry in ways that benefit the nation’s economic and security interests.

SunEdison Semiconductor announces regulatory approvals from Taiwan and Austria for proposed acquisition

11/07/2016  SunEdison Semiconductor Limited announced today that it has received notice that the Investment Committee of the Ministry of the Economic Affairs of the Republic of China has approved the proposed acquisition of SunEdison Semiconductor by GlobalWafers Co., Ltd.

Astronics Test Systems announces new semiconductor system-level test platform

11/07/2016  Astronics Corporation (NASDAQ:ATRO), through its wholly-owned subsidiary Astronics Test Systems, introduced its new breakthrough System-Level Test (SLT) platform that is expected to revolutionize the testing of high volume integrated semiconductor devices.

SMIC Shenzhen launches construction of the first 12-in IC production line in South China

11/04/2016  Semiconductor Manufacturing International Corporation announces the official launch of a 12-inch integrated circuit (IC) production line at SMIC's Shenzhen facility. It will be the very first 12-inch fab in South China.

Samsung expands its advanced foundry offerings with 14LPU and 10LPU processes

11/03/2016  The new foundry process offerings as well as EUV-enabled 7nm wafer are presented at the Samsung Foundry Forum.




TWITTER


WEBCASTS



Internet of Things

January 2017 - Date and time TBD / Sponsored by Epicor

The age of IoT is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Fab Cost Reduction

February 2017 - Date and time TBD / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
ISS Europe 2017
Munich, Germany
http://www.semi.org/eu/iss-europe-2017
March 05, 2017 - March 07, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS