Wafer Processing

WAFER PROCESSING ARTICLES



Synopsys' modeling of 10nm parasitic variation effects ratified by open-source standards board

04/21/2015  Synopsys, Inc. today announced new extensions to its open-source Interconnect Technology Format (ITF) which enable modeling of complex device and interconnect parasitic effects at the advanced 10-nanometer (nm) process node.

SiVance, LLC opens R&D lab to drive innovations in specialty silane and silicone technologies

04/21/2015  SiVance, LLC, a subsidiary of Milliken & Company, today announced the opening of a new, 11,000 sq.ft. research and development (R&D) laboratory.

Applied Materials announces new photomask etch system

04/20/2015  Applied Materials today announced the Applied Centura Tetra Z Photomask Etch system for etching next-generation optical lithographic photomasks needed by the industry to continue multiple patterning scaling to the 10nm node and beyond.

SOI: Revolutionizing RF and expanding in to new frontiers

04/17/2015  SOI provides the capability to revolutionize RF Front Ends and WAN RFSOCs through innovation in radio architectures.

Top 10 2015 semiconductor sales leaders forecast to include NXP/Freescale

04/17/2015  Total top 10 marketshare of semiconductor industry now back over 50 percent.

Solid State Watch: April 10-16, 2015

04/17/2015  SEMI reports 2014 semiconductor photomask sales of $3.2B; Automotive touch panel revenues to hit $1.5B by 2018; Sensor shipments strengthen but falling prices cut sales growth; ClassOne enters ECD lab partnership with Shanghai Sinyang

Monolithic 3D processing using non-equilibrium RTP

04/17/2015  Qualcomm endorses CEA-Leti’s “CoolCube” transistor stacking approach.

Quantization of 'surface Dirac states' could lead to exotic applications

04/14/2015  Researchers from the RIKEN Center for Emergent Matter Science in Japan have uncovered the first evidence of an unusual quantum phenomenon--the integer quantum Hall effect--in a new type of film, called a 3D topological insulator.

SEMI reports 2014 semiconductor photomask sales of $3.2B

04/14/2015  SEMI reports that the worldwide semiconductor photomask market was $3.2 billion in 2014 and is forecasted to reach $3.4 billion in 2016.

Graphene looking promising for future spintronic devices

04/10/2015  Researchers at Chalmers University of Technology have discovered that large area graphene is able to preserve electron spin over an extended period, and communicate it over greater distances than had previously been known.

Solid State Watch: April 3-9, 2015

04/10/2015  SEMI reports 2014 global semiconductor materials sales of $44.3B; Cavendish Kinetics adopts STATS ChipPAC’s wafer level technology; MEMS shipments to reach 43.3B units by 2018; TSMC certifies Synopsys design tools for 16nm finFET plus production

Flexible facilities for 450mm wafer fabs

04/07/2015  When the commercial semiconductor manufacturing industry decides to move to the next wafer size of 450mm, it will be time to re-consider equipment and facilities strategies.

Future electronics based on carbon nanotubes

04/07/2015  The exceptional properties of tiny molecular cylinders known as carbon nanotubes have tantalized researchers for years because of the possibility they could serve as a successors to silicon in laying the logic for smaller, faster and cheaper electronic devices.

TSMC certifies Synopsys design tools for 16nm finFET plus production and for 10nm early design starts

04/06/2015  This certification enables mutual customers to deploy tools in Synopsys' Galaxy Design Platform for 16nm production designs and 10nm early engagements.

AWSC purchases ClassOne’s Solstice S8 electroplater

04/03/2015  Semiconductor equipment manufacturer ClassOne Technology announced the sale and delivery of its Solstice S8 Plating System to Advanced Wireless Semiconductor Company (AWSC) of Taiwan.

Advanced analytics for yield improvement and zero defect in semiconductors

04/02/2015  Machine learning based advanced analytics for anomaly detection offers powerful techniques that can be used to achieve breakthroughs in yield and field defect rates.

Supplier Hub answers the needs of a changing semiconductor industry

04/02/2015  Supplier Hub answers the needs of a changing semiconductor industry.

Pibond introduces a new product line for logic, memory, power and MEMS devices

04/01/2015  Targeting 10nm node semiconductor processing, 3D NAND, power ICs as well as MEMS applications, this technology enables advanced device manufacturing through reduced cost of ownership (COO) and simplified processing.

Deeper Dive: Xpedition Enables Co-Design of Chips, Packages, Boards

03/31/2015  A new product from Mentor Graphics called Xpedition® Package Integrator provides a new methodology and platform in addition to a new suite of EDA tools. The platform enables chip, package and board designers to easily see how changing various design elements impact adjacent designs, an industry first.

Chemists make new silicon-based nanomaterials

03/27/2015  Chemists from Brown University have come up with a way to make new nanomaterials from a silicon-based compound.




HEADLINES

FINANCIALS



TECHNOLOGY PAPERS



Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

ASIC Design Made Cost Effective with Low Cost Tools and Masks

For smaller projects or companies with modest design budgets, ASIC design is becoming a viable option due to low cost design tools and easy access to flexible, mature IC processes. This is especially compelling for developing mixed-signal ASICs for cost-sensitive sensor applications for the Internet of things (IoT). This paper discusses how costs and risks can be reduced using multi-project wafer services, coupled with affordable design tools for developing mixed-signal ASICs. April 13, 2015
Sponsored by Mentor Graphics

High-Performance Analog and RF Circuit Simulation

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Key challenges in the design of these circuits include block-level characterization and full-circuit verification. This paper highlights these verification challenges by discussing the results of a 2.2 GHz PLL LC-VCO, a 12-bit pipeline ADC, and an ultra-wideband transceiver.March 13, 2015
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS



Sensor Fusion and the Role of MEMS in IoT

Thursday May 28, 2015 at 1:00 p.m. EST

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Interconnects

June 2015 (Date and time TBD)

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Understanding Defects

July 2015 (Date and time TBD)

Yield improvement and production engineers working on today's ICs encounter many challenges as defects affecting device operation go undetected by traditional in-line techniques. Electrical Failure Analysis (EFA) is a suite of techniques that helps the modern day fab increase yields by isolating faults to areas small enough for Physical Failure Analysis (PFA). In this Webinar, we showcase a few of the proven EFA fault isolation techniques and describe how EFA helps to characterize the underlying defects.

Sponsored By:
More Webcasts

VIDEOS



EVENTS



SID Display Week 2015
San Jose, California
http://www.displayweek.org
May 31, 2015 - June 05, 2015
Design Automation Conference (DAC)
San Francisco, CA
https://dac.com
June 07, 2015 - June 11, 2015
SEMICON West 2015
San Francisco, CA
http://www.semiconwest.org
July 14, 2015 - July 16, 2015
SPIE Optics and Photonics
San Diego, CA
http://spie.org/x30491.xml
August 09, 2015 - August 13, 2015
European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015