Wafer Processing

WAFER PROCESSING ARTICLES



Imec world-first to develop 200V, 650V dispersion free normally-off/e-mode power devices on 200mm/8-inch Si wafers

06/13/2017  Imec announced today that it has developed 200V and 650V normally-off/enhancement mode (e-mode) on 200mm/8-inch GaN-on-Silicon wafers.

NREL-led research effort creates new alloys, phase diagram

06/13/2017  A multi-institutional team led by the U.S. Department of Energy's National Renewable Energy Laboratory (NREL) discovered a way to create new alloys that could form the basis of next-generation semiconductors.

Cypress Executive Chairman Ray Bingham steps down from Board

06/12/2017  Cypress Semiconductor Corporation announced that Executive Chairman Ray Bingham has tendered his resignation as Executive Chairman and is stepping down from the Board of Directors.

Researchers image quasiparticles that could lead to faster circuits, higher bandwidths

06/09/2017  A research team led by Iowa State University's Zhe Fei has made the first images of half-light, half-matter quasiparticles called exciton-polaritons. The discovery could be an early step to developing nanophotonic circuits that are up to 1 million times faster than current electrical circuits.

Long-term IoT semiconductor forecast reduced

06/08/2017  Total IoT forecast scaled back mostly because of lower revenue projections for connected cities.

Global semiconductor sales increase 21% year-to-year in April

06/07/2017  Double-digit annual growth projected for 2017.

SIA welcomes DARPA initiative to advance transformative semiconductor technologies

06/06/2017  New program aims to progress beyond traditional scaling, catalyze next-generation semiconductor technologies.

SEMI reports record quarterly billings of $13.1B

06/06/2017  The quarter ended very strong, with March billings reaching $5.6 billion, an all-time monthly record.

Record fab spending for 2017 and 2018

06/06/2017  In 2017, over US$49 billion will be spent on equipment alone, a record for the semiconductor industry. Spending on new fab construction is projected to reach over $8 billion, the second largest year on record.

"Billion Dollar Capex Club" forecast to swell to 15 companies in 2017

06/01/2017  Top spenders expected to represent 83% of total semiconductor industry spending this year.

Volatility in electronic equipment supply chain

06/01/2017  SEMI’s year-to-date worldwide semiconductor equipment billings year-to-date through March show a 59.6 percent gain to the same period last year.

EV Group expands production capacity at corporate headquarters in Austria

05/31/2017  EV Group (EVG) announced that it is expanding production capacity at its corporate headquarters in St. Florian am Inn, Austria.

OEM Group expands P5000 capabilities to compound semiconductor substrates

05/25/2017  OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market.

IEEE International Electron Devices Meeting announces 2017 Call for Papers

05/23/2017  The 63rd annual IEEE International Electron Devices Meeting (IEDM), to be held at the Hilton San Francisco Union Square hotel December 2-6, 2017, has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

North American semiconductor equipment industry posts April 2017 billings

05/23/2017  North America-based manufacturers of semiconductor equipment posted $2.17 billion in billings worldwide in April 2017 (three-month average basis), according to the April Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

Technology partners at SEMICON West focus on innovations driving industry growth

05/22/2017  SEMI today announced its plans to deliver specialized programs at SEMICON West 2017 (July 11-13 at Moscone Center in San Francisco, Calif.) in partnership with IEEE (Institute of Electrical and Electronics Engineers), Society of Automotive Engineers International (SAE), and imec.

China's semiconductor industry and "win-win" growth

05/22/2017  As China embarks on the Made in China 2025 plan with electronics and semiconductor technology as one of the Top 10 focus areas, China's semiconductor industry has an unprecedented growth opportunity.

Lam Research appoints Dr. Y.B. Koh to Board of Directors

05/15/2017  Lam Research today announced that Dr. Young Bum Koh has joined the company's board of directors effective as of May 10, 2017.

Worldwide semiconductor revenue grew 2.6% in 2016, reports Gartner

05/15/2017  Worldwide semiconductor revenue totaled $343.5 billion in 2016, a 2.6 percent increase from 2015 revenue of $334.9 billion, according to final results by Gartner, Inc.

ON Semiconductor wins Gold Stevie American Business Award for Large Manufacturing Company of the Year

05/15/2017  ON Semiconductor Corporation announced that it is has been named the winner of the Gold Stevie Award for Large Manufacturing Company of the Year in The 15th Annual American Business Awards (ABAs).




TWITTER


WEBCASTS



Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Wednesday, August 9, 2017 at 1 p.m. ET

The slowing down of Moore's Law even at leading CMOS Fabs due to approaching Physics limits, while at the same time the explosion in demand for chips and systems across a wide range of market segments (compact wearable / portable consumer systems, the transfer and processing of data to and from the cloud, at the high performance end specialized architectures e,g for AI) has revived interest in Dense Off Chip Integration (DOCI ), first used in MCMs (Multi Chip Modules) for mainframes some 3 decades ago.

Sponsored By:
Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



Advanced Process Control Conference
Austin, Texas
http://www.apcconference.com
October 09, 2017 - October 12, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
SEMI-THERM
San Jose, CA
http://semi-therm.org
March 19, 2018 - March 23, 2018

VIDEOS