Wafer Processing

WAFER PROCESSING ARTICLES



Evolution of across-wafer uniformity control in plasma etch

08/12/2016  A look at control of process uniformity across the wafer during plasma etch processes.

As Japan seizes lead in growing semiconductor segments, industry leaders exhibit at SEMICON Japan

08/11/2016  SEMI today announced that SEMICON Japan 2016, at Tokyo Big Sight on December 14-16, has increased exhibition and programming to keep pace with high-growth semiconductor segments in Japan.

Power semiconductor market revenues decline

08/11/2016  Overall revenue for the power semiconductors market globally dropped slightly in 2015, due primarily to macroeconomic factors and application-specific issues.

POET Technologies announces milestone toward commercialization integrated opto-electronics tech platform

08/10/2016  The milestone achieved is the first demonstration of functional Hetero-junction Field Effect Transistors (HFETs) down to 250nm effective gate lengths on the same proprietary epitaxy and utilizing the same integrated process sequence that was previously used to demonstrate high performance detectors.

Expanded focus areas and opportunities to exhibit at SEMICON Europa

08/10/2016  Europe's largest electronics manufacturing exhibition SEMICON Europa (25-27 October) will take place in Grenoble at ALPEXPO.

Lam Research enables next-generation memory with industry's first ALD process for low-fluorine tungsten fill

08/09/2016  Lam Research Corp. (NASDAQ: LRCX), an advanced manufacturer of semiconductor equipment, today introduced an atomic layer deposition (ALD) process for depositing low-fluorine-content tungsten films, the latest addition to its ALTUS family of products.

Making a solar energy conversion breakthrough with help from a ferroelectrics pioneer

08/08/2016  Philadelphia-based team shows how a ferroelectric insulator can surpass shockley-queisser limit.

Park Systems launches Park NX20 300mm research AFM with full 300mm semiconductor wafer scan

08/05/2016  Park Systems announced NX20 300mm, the only AFM on the market capable of scanning the entire sample area of 300mm wafers using a 300mm vacuum chuck while keeping the system noise level below 0.5angstrom RMS.

Samco opens new office in Malaysia

08/04/2016  Samco, a semiconductor process equipment developer and manufacturer based in Japan, announced that it will open its Malaysia branch office on Aug. 10, 2016 in Petaling Jaya, a suburb of Kuala Lumpur.

Huge 2H16 spending surge expected from Samsung, TSMC, and Intel

08/04/2016  Combined outlays from the “Big 3” spenders is forecast to almost double in 2H16 over 1H16.

Hardware/Software Co-Development for IoT Applications: Q&A with Marie Semeria, CEO of CEA-Leti

08/03/2016  Marie Semeria, chief executive officer of CEA-Leti (http://www.leti.fr/en), sat down with SemiMD during SEMICON West to discuss how the French R&D and pilot manufacturing campus—located at the foot of the beautiful French alps near Grenoble—is expanding the scope of it’s activities to develop systems solutions for the Internet-of-Things (IoT).

GLOBALFOUNDRIES appoints Wallace Pai as General Manager to oversee China business development

08/02/2016  GLOBALFOUNDRIES announced that Wallace Pai has been appointed as vice president and general manager of China.

Global semiconductor sales increase in second quarter

08/02/2016  The Semiconductor Industry Association today announced worldwide sales of semiconductors reached $79.1 billion during the second quarter of 2016, an increase of 1.0 percent over the previous quarter and a decrease of 5.8 percent compared to the second quarter of 2015.

What’s happening to Japan’s semiconductor industry?

07/28/2016  The 2016 global semiconductor market is forecast to decrease by 2.4 percent from the previous year according to the World Semiconductor Trade Statistics (WSTS).

SJSemi and Qualcomm announce mass production of 14nm wafer bumping technology

07/28/2016  SJ Semiconductor Corp. and Qualcomm Technologies, Inc. jointly announced that SJSemi has begun mass production of 14nm wafer bumping for Qualcomm Technologies.

China’s final chance to achieve its IC industry ambitions now underway

07/27/2016  Over the past 20 years, China has become increasingly frustrated over the gap between its IC imports and indigenous IC production

Second quarter 2016 silicon wafer shipments increase quarter-over-quarter; sets a new record

07/27/2016  Worldwide silicon wafer area shipments increased during the second quarter 2016 when compared to first quarter 2016 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Chemical etching method helps transistors stand tall

07/26/2016  University of Illinois researchers have developed a way to etch very tall, narrow finFETs, a type of transistor that forms a tall semiconductor "fin" for the current to travel over. The etching technique addresses many problems in trying to create 3-D devices, typically done now by stacking layers or carving out structures from a thicker semiconductor wafer.

Peregrine Semiconductor announces new VP General Manager

07/26/2016  Peregrine Semiconductor Corp. today announced the promotion of Takaki Murata to vice president and general manager of the high performance analog (HPA) business unit.

Worldwide semiconductor capital spending to decline 0.7% in 2016, Gartner reports

07/22/2016  Worldwide semiconductor capital spending is projected to decline 0.7 percent in 2016, to $64.3 billion, according to Gartner, Inc. This is up from the estimated 2 percent decline in Gartner's previous quarterly forecast.




TWITTER


WEBCASTS



Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

September 27, 2016 at 1 p.m. ET / Sponsored by Epicor

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
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TECHNOLOGY PAPERS



New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016
Sponsored by XwinSys Technology Development Ltd.

Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

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EVENTS



SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017

VIDEOS