Wafer Processing


Orbotech's SPTS Technologies receives $37M in multiple system orders from RF device manufacturers

02/14/2018  Orbotech Ltd. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has received approximately $37M in orders for multiple etch and deposition systems from two GaAs foundry customers.

Applied Materials named one of the World's Most Ethical Companies for 2018

02/12/2018  Applied Materials, Inc. announced today that it has been recognized by the Ethisphere Institute, a global leader in defining and advancing the standards of ethical business practices, on its 2018 list as one of the World's Most Ethical Companies.

Amkor Technology names Doug Alexander and MaryFrances McCourt to Board of Directors

02/09/2018  Amkor Technology, Inc. today announced that Doug Alexander and MaryFrances McCourt have been appointed as new members of the Company's Board of Directors. With these appointments, Amkor's Board has been expanded to twelve members.

Mass production of new class of semiconductors closer to reality

02/09/2018  Two Waterloo chemists have made it easier for manufacturers to produce a new class of faster and cheaper semiconductors.

Leak check semiconductor process chambers quickly and reliably

02/08/2018  INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams to easily check the tightness of vacuum chambers for wafer production.

New IC manufacturing lines to boost total industry wafer capacity 8%

02/08/2018  Wafer capacity growth of 8% forecast for 2018 and 2019 versus 4.8% average yearly growth from 2012-2017.

SEMI forms Technology Communities to speed industry collaboration and innovation

02/08/2018  SEMI President & CEO Ajit Manocha has formed a new group, Technology Communities, to better collaborate, align, and enhance all of SEMI’s technology-focused activities by operating them under one umbrella.

MACOM and STMicroelectronics to bring GaN on silicon to mainstream RF markets and applications

02/07/2018  MACOM Technology Solutions Holdings, Inc. and STMicroelectronics announced an agreement to develop GaN (Gallium Nitride) on Silicon wafers to be manufactured by ST for MACOM's use across an array of RF applications.

First Trump State of the Union address: How it stacks up against SEMI public policy priorities

02/07/2018  SEMI evaluates the implications of the SOTU address for Trade, Taxes, Technology, Talent and other SEMI public policy priorities.

Lam Research and Tokyo Electron gained in full year 2017 semiconductor equipment market shares

02/06/2018  Market shares of top semiconductor equipment manufacturers for the full year 2017 indicate large gains by Tokyo Electron and Lam Research while top supplier Applied Materials dropped.

ON Semiconductor names 2017 Distribution Partner Award winners

02/06/2018  These awards honor the distributor in each region that led overall channel sales, grew market share, captured increased sales of products from ON Semiconductor’s acquisitions and scored highly on overall process excellence.

The dawn of gallium oxide microelectronics

02/06/2018  Gallium oxide has an advantage over silicon in producing cheaper and smaller devices.

Annual semiconductor sales increase 21.6%, top $400B for first time

02/05/2018  Global industry posts highest-ever annual, quarterly, and monthly sales.

Air Products to supply Samsung Electronics' second 3D V-NAND fab in western China

02/02/2018  Air Products today announced it has been awarded the industrial gases supply for Samsung Electronics' second semiconductor fab in Xi'an, Shaanxi Province, western China.

Smart manufacturing fuels digital transformation: Takeaways from SEMI Member Forum

02/01/2018  Driven by emerging technologies like Artificial Intelligence (AI), Internet of Things (IoT), machine learning and big data, the digital transformation has become an irreversible trend for the electronics manufacturing industry. The global market for smart manufacturing and smart factory technologies is expected to reach US$250 billion in 2018.

Boston Semi Equipment develops custom automation modules for strip handling equipment

01/31/2018  Boston Semi Equipment (BSE) today announced that it has started shipping units of its new strip load/unload module to a top 10 semiconductor manufacturer.

Largest SEMICON Korea ever highlights smart manufacturing, automotive

01/31/2018  SEMICON Korea 2018 opens at COEX in Seoul today with its largest-ever exhibition and an expected 50,000 attendees at the premier event for the Korean semiconductor and electronics manufacturing supply chain.

Mike Noonen joins efabless' Advisory Board

01/30/2018  efabless corporation, the world's first crowd sourcing platform for electronics solutions, today announced Mike Noonen joined its advisory board.

Researchers boost efficiency and stability of optical rectennas

01/29/2018  The research team that announced the first optical rectenna in 2015 is now reporting a two-fold efficiency improvement in the devices — and a switch to air-stable diode materials. The improvements could allow the rectennas – which convert electromagnetic fields at optical frequencies directly to electrical current – to operate low-power devices such as temperature sensor

Electronics manufacturing in critical need of new talent

01/29/2018  SEMI, the global industry association representing the electronics manufacturing supply chain, today announced an urgent call to action to overcome the pressing semiconductor industry challenge of recruiting new talent.



3D NAND Flash Process Integration and Architecture from A to Z

April 24, 2018 at 1:00 p.m. ET

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

Sponsored By:

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:


Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

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Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
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Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

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San Jose, CA
March 19, 2018 - March 23, 2018
LED Expo Thailand
Bangkok, Thailand
May 10, 2018 - May 12, 2018

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