Wafer Processing

WAFER PROCESSING ARTICLES



CEA-Leti and CEA-Inac pave the way for quantum information processing on SOI CMOS platform

12/07/2015  CEA-Leti today announced preliminary steps for demonstrating a quantum bit, or qubit, the building block of quantum information, in a process utilizing a silicon-on-insulator (SOI) CMOS platform.

Leti to collaborate with Keysight Technologies to enable expansion of FD-SOI technology

12/07/2015  CEA-Leti today announced it has signed an agreement with Keysight Technologies, a device-modeling software supplier, to adapt Leti’s UTSOI extraction flow methodology within Keysight’s device modeling solutions for high-volume SPICE model generation.

Atomically-flat tunnel transistor overcomes fundamental power challenge of electronics

12/07/2015  A new transistor developed by UC Santa Barbara engineers overcomes one of the fundamental limitations of conventional transistors and reduces power dissipation by over 90 percent.

Semiconductor sales: slight growth projected for next three years

12/07/2015  Market projected to grow by 0.2 percent in 2015, 1.4 percent in 2016, and 3.1 percent in 2017.

imec, Coventor expand project on 7nm semiconductor manufacturing process

12/07/2015  Kicking off IEDM, imec and Coventor are expanding their existing joint development project to explore process variation issues in 7nm chip technology.

Measuring nanoscale features with fractions of light

12/04/2015  National Institute of Standards and Technology (NIST) researchers are seeing the light, but in an altogether different way. And how they are doing it just might be the semiconductor industry's ticket for extending its use of optical microscopes to measure computer chip features that are approaching 10 nanometers, tiny fractions of the wavelength of light.

Intersil CEO Necip Sayiner elected chair of Semiconductor Industry Association

12/04/2015  The Semiconductor Industry Association (SIA) today announced the SIA Board of Directors has elected Dr. Necip Sayiner, President, CEO and Director of Intersil, as its 2016 Chair and Tunç Doluca, President and CEO of Maxim Integrated, as its 2016 Vice Chair.

IDMs could top fabless semiconductor company growth for only the second time in history

12/03/2015  Sales of top 10 IDMs forecast to be flat; top 10 fabless companies expected to slip into negative growth this year.

Quantum computer made of standard semiconductor materials

12/02/2015  Physicists at the Technical University of Munich, the Los Alamos National Laboratory and Stanford University (USA) have tracked down semiconductor nanostructure mechanisms that can result in the loss of stored information - and halted the amnesia using an external magnetic field.

ORNL process could be white lightning to the electronics industry

12/02/2015  A new era of electronics and even quantum devices could be ushered in with the fabrication of a virtually perfect single layer of "white graphene," according to researchers at the Department of Energy's Oak Ridge National Laboratory.

Global discrete semiconductors market expected to surpass $24B by 2019

12/01/2015  The new industry research report from Technavio discusses in detail the key drivers and trends responsible for the growth of this market and its sub-segments.

IU chemists craft molecule that self-assembles into flower-shaped crystalline patterns

12/01/2015  The National Science Foundation has awarded $1.2 million to three research groups at Indiana University to advance research on self-assembling molecules and computer-aided design software required to create the next generation of solar cells, circuits, sensors and other technology.

Measuring 5nm Particles In-Line

11/30/2015  ITRI and TSMC co-develop aerosol method to monitor liquids and slurries.

Stanford technology makes metal wires on solar cells nearly invisible to light

11/30/2015  Stanford University scientists have discovered how to hide the reflective upper contact and funnel light directly to the semiconductor below.

Tallness Makes Reliable Spindt Tip Cold Cathodes

11/30/2015  Vacuum nanowire arrays of cold cathodes for high frequency sources and amplifiers

Doping powers new thermoelectric material

11/30/2015  In the production of power, nearly two-thirds of energy input from fossil fuels is lost as waste heat. Industry is hungry for materials that can convert this heat to useful electricity, but a good thermoelectric material is hard to find.

Mergers: Commission clears Avago's acquisition of Broadcom

11/25/2015  The Commission concluded that the merged entity would continue to face effective competition in Europe.

Cambridge CMOS Sensors wins again at NMI awards

11/24/2015  Cambridge CMOS Sensors (CCS), a semiconductor company with gas sensor solutions to monitor the local environment, today announced that it has been crowned winner of the Product of the Year category at this year's National Microelectronics Institute (NMI) Awards, held at the Grange Tower Bridge Hotel in London.

AKHAN Semiconductor opens facility to produce diamond-based semiconductor technology

11/24/2015  The AKHAN facility is slated to begin production in Q1 2016 and will produce and deliver more than 1,000 diamond-based technology windows.

Trillium announces acquisition of Oxford Instruments - Austin Division

11/24/2015  Trillium US Inc, headquartered in Clackamas, OR, has announced the acquisition of the Oxford Instruments - Austin division.




TWITTER


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TECHNOLOGY PAPERS



Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Trends in MEMS

February 2016 (Date and time TBD) / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
2.5D and 3D Integration

March 2016 (Date and time TBD) / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Metrology and Inspection Challenges and Opportunities

March 2016 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

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LithoVision 2016
San Jose, CA
https://lithovision.com
February 21, 2016 - February 21, 2016
SEMI-THERM 32
San Jose, CA
http://www.semi-therm.org
March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016