Wafer Processing

WAFER PROCESSING ARTICLES



Soitec begins ramping up production of 200mm SOI wafers in China at SOI manufacturing partner's fab

03/09/2017  Soitec has announced that the ramp up to high-volume production of 200mm silicon-on-insulator (SOI) wafers has begun at the manufacturing facility of its Chinese partner Shanghai Simgui Technology Co., Ltd.

ClassOne signs Scientech as rep for China, Taiwan and SE Asia

03/08/2017  ClassOne Technology, manufacturer of wet processing equipment for 200mm and smaller wafers, announced that Scientech Corporation of Taipei, Taiwan, will become the company’s new representative for China, Taiwan and Southeast Asia, starting immediately.

Skyworks Solutions, Inc., Western Digital Corporation join Semiconductor Industry Association

03/07/2017  The Semiconductor Industry Association (SIA) today announced the addition of two leading U.S. semiconductor companies, Skyworks Solutions, Inc. and Western Digital Corporation, as SIA members.

Record spending for fab equipment expected in 2017 and 2018

03/07/2017  Today, SEMI announced updates to its World Fab Forecast report, revealing that fab equipment spending is expected to reach an industry all-time record − more than US$46 billion in 2017.

Mentor Graphics Launches Unique Xpedition PCB Systems Vibration and Acceleration Simulation Solution

03/06/2017  Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® vibration and acceleration simulation product for printed circuit board (PCB) systems reliability and failure prediction.

Cypress closes sale of Minnesota wafer fabrication facility

03/06/2017  Cypress Semiconductor Corp. (Nasdaq: CY) today announced it has sold the subsidiary that owns its semiconductor wafer fabrication facility in Bloomington, Minnesota to SkyWater Technology Foundry for $30 million.

January semiconductor sales up 14% compared to last year

03/06/2017  Year-to-year growth is market's largest since November 2010; month-to-month sales decrease slightly.

Coffee-ring effect leads to crystallization control

03/06/2017  Varying the thickness of crystallizing materials facilitates control over the patterns and properties of crystals.

Semiconductor manufacturing's next big thing at ASMC 2017

03/02/2017  Manufacturers, suppliers and academia gather to understand the road ahead.

A SOI wafer is a suitable substrate for gallium nitride crystals

03/02/2017  Improved characteristics in power electronics and radio applications can be achieved by using a SOI wafer for gallium nitride growth.

Eleven companies forecast to account for 78% of semi capex in 2017

03/02/2017  Three of the top 11 companies are expected to increase capex spending by 25% or more.

Renesas Electronics completes acquisition of Intersil

02/27/2017  Renesas Electronics Corporation and Intersil Corporation announced the completion of Renesas' acquisition of Intersil Corporation.

Imec presents patterning solutions for N5-equivalent metal layers

02/27/2017  At the SPIE Advanced Lithography conference in San Jose, Calif. (USA), imec and its partners will present a patterning solution for a 42nm-pitch M1 layer and a 32nm-pitch M2 layer in logic design compatible with the foundry N5 requirements.

Picosun and Hitachi MECRALD Process

02/24/2017  ALD fab films at lower temperatures.

Taiwan maintains largest share of global IC wafer fab capacity

02/23/2017  South Korea narrows gap with Taiwan; China shows biggest increase, accounts for nearly 11%.

ClassOne initiative aims to reduce CoO in ≤200mm copper plating

02/22/2017  ClassOne Technology announced a new company-wide initiative to reduce costs of operation (CoO) in copper plating processes.

North American semiconductor equipment industry posts January 2017 billings

02/22/2017  North America-based manufacturers of semiconductor equipment posted $1.86 billion in billings worldwide in January 2017 (three-month average basis).

SEMI appoints Ajit Manocha as president and CEO

02/21/2017  SEMI today announced the appointment of Ajit Manocha as its president and CEO.

Brooks Instrument names Mohamed Saleem as new Chief Technology Officer

02/21/2017  Mohamed Saleem has joined Brooks Instrument as the company's new chief technology officer (CTO), where he will oversee its California-based technology development center.

Innovations at 7nm to keep Moore’s Law alive

02/20/2017  EUV, cobalt contacts, are expected to be introduced at the 7nm node by several semiconductor manufacturers.




TWITTER


WEBCASTS



Metrology Challenges and Opportunities

Wednesday, April 26, 2017 at 2 p.m. ET

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:
Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

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EVENTS



CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017
Design Automation Conference 2017 (DAC)
Austin, TX
https://dac.com
June 18, 2017 - June 22, 2017

VIDEOS