Wafer Processing

WAFER PROCESSING ARTICLES



IDMs could top fabless semiconductor company growth for only the second time in history

12/03/2015  Sales of top 10 IDMs forecast to be flat; top 10 fabless companies expected to slip into negative growth this year.

Quantum computer made of standard semiconductor materials

12/02/2015  Physicists at the Technical University of Munich, the Los Alamos National Laboratory and Stanford University (USA) have tracked down semiconductor nanostructure mechanisms that can result in the loss of stored information - and halted the amnesia using an external magnetic field.

ORNL process could be white lightning to the electronics industry

12/02/2015  A new era of electronics and even quantum devices could be ushered in with the fabrication of a virtually perfect single layer of "white graphene," according to researchers at the Department of Energy's Oak Ridge National Laboratory.

Global discrete semiconductors market expected to surpass $24B by 2019

12/01/2015  The new industry research report from Technavio discusses in detail the key drivers and trends responsible for the growth of this market and its sub-segments.

IU chemists craft molecule that self-assembles into flower-shaped crystalline patterns

12/01/2015  The National Science Foundation has awarded $1.2 million to three research groups at Indiana University to advance research on self-assembling molecules and computer-aided design software required to create the next generation of solar cells, circuits, sensors and other technology.

Measuring 5nm Particles In-Line

11/30/2015  ITRI and TSMC co-develop aerosol method to monitor liquids and slurries.

Stanford technology makes metal wires on solar cells nearly invisible to light

11/30/2015  Stanford University scientists have discovered how to hide the reflective upper contact and funnel light directly to the semiconductor below.

Tallness Makes Reliable Spindt Tip Cold Cathodes

11/30/2015  Vacuum nanowire arrays of cold cathodes for high frequency sources and amplifiers

Doping powers new thermoelectric material

11/30/2015  In the production of power, nearly two-thirds of energy input from fossil fuels is lost as waste heat. Industry is hungry for materials that can convert this heat to useful electricity, but a good thermoelectric material is hard to find.

Mergers: Commission clears Avago's acquisition of Broadcom

11/25/2015  The Commission concluded that the merged entity would continue to face effective competition in Europe.

Cambridge CMOS Sensors wins again at NMI awards

11/24/2015  Cambridge CMOS Sensors (CCS), a semiconductor company with gas sensor solutions to monitor the local environment, today announced that it has been crowned winner of the Product of the Year category at this year's National Microelectronics Institute (NMI) Awards, held at the Grange Tower Bridge Hotel in London.

AKHAN Semiconductor opens facility to produce diamond-based semiconductor technology

11/24/2015  The AKHAN facility is slated to begin production in Q1 2016 and will produce and deliver more than 1,000 diamond-based technology windows.

Trillium announces acquisition of Oxford Instruments - Austin Division

11/24/2015  Trillium US Inc, headquartered in Clackamas, OR, has announced the acquisition of the Oxford Instruments - Austin division.

InvenSense CEO touts the Internet of Sensors

11/23/2015  InvenSense president and chief executive officer Behrooz Abdi sees the Internet of Things as an Internet of Sensors, a theme he explored Tuesday afternoon (November 17) at the opening of the fourth annual InvenSense Developers Conference.

Strange quantum phenomenon achieved at room temperature in semiconductor wafers

11/23/2015  Today, entanglement is accepted as a fact of nature and is actively being explored as a resource for future technologies including quantum computers, quantum communication networks, and high-precision quantum sensors.

Quantum spin could create unstoppable, one-dimensional electron waves

11/23/2015  A pair of scientists from the U.S. Department of Energy's Brookhaven National Laboratory and Ludwig Maximilian University in Munich have proposed the first solution to subatomic stoppage: a novel way to create a more robust electron wave by binding together the electron's direction of movement and its spin.

InvenSense Developers Conference Tackles Sensor Security, New Technologies

11/23/2015  The second day of the InvenSense Developers Conference saw presenters get down to cases – use cases for sensors.

Inotera appoints new president

11/19/2015  Inotera's Board of Directors announced this week that they have approved the appointment of Mr. Rod Morgan as president, succeeding Dr. Scott Meikle. The change is effective January 1, 2016.

GLOBALFOUNDRIES receives quality award from INOVA Semiconductors GmbH

11/19/2015  GLOBALFOUNDRIES today announced it has been presented with an Award of Excellence from INOVA Semiconductors GmbH, a specialist in the development of products for Gigabit/s serial data communication for in-vehicle Display- and Driver Assistance Systems.

ON Semiconductor to acquire Fairchild for $2.4B

11/18/2015  The acquisition creates a leader in the power semiconductor market with combined revenue of approximately $5 billion, diversified across multiple markets with a strategic focus on automotive, industrial and smartphone end markets.




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

Parylene & Sensors

Learn about how parylene, as an enabling technology, can significantly increase the performance of sensors as they become increasingly integrated into our daily lives. You will learn: 1) Parylene specifications and properties 2) How parylene can improve the performance of sensors 3) Different uses for parylene on different sensor applicationsNovember 17, 2015
Sponsored by Diamond-MT

Potting Compounds Protect Electronic Circuits

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. October 15, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Trends in MEMS

February 2016 (Date and time TBD)

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
2.5D and 3D Integration

March 2016 (Date and time TBD)

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:

Metrology and Inspection Challenges and Opportunities

March 2016 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



LithoVision 2016
San Jose, CA
https://lithovision.com
February 21, 2016 - February 21, 2016
SEMI-THERM 32
San Jose, CA
http://www.semi-therm.org
March 14, 2016 - March 17, 2016
SEMICON China 2016
Shanghai, China
http://www.semiconchina.org
March 15, 2016 - March 17, 2016
SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016