Wafer Processing

WAFER PROCESSING ARTICLES



GLOBALFOUNDRIES announces enhanced RF SOI process design kit

09/18/2017  GLOBALFOUNDRIES today announced the availability of a new set of enhanced RF SOI process design kits (PDKs) to help designers improve their designs of RF switches and deliver differentiated RF front-end solutions for a wide range of markets including front-end modules for mobile devices, mmWave, 5G and other high-frequency applications.

IMAPS 2017 to showcase advances in microelectronics technology

09/15/2017  Researchers and exhibitors will showcase their work during a comprehensive conference program of technical papers, panels, special sessions, short courses/tutorials, and an exhibition that will spotlight premier work in the fields of microelectronics, semiconductor packaging and circuit design.

Cadence appoints John Wall as next Chief Financial Officer

09/15/2017  Cadence Design Systems, Inc. today announced that John Wall, corporate vice president of finance and corporate controller of Cadence, has been appointed senior vice president and chief financial officer of Cadence, effective October 1, 2017.

TowerJazz announces 5V 65nm CMOS & low voltage power process

09/15/2017  TowerJazz, the global specialty foundry, today announced the release of its advanced 5V 65nm power process providing customers with multiple advantages over 0.18um 5V technologies.

Lam Research announces 2017 Supplier Excellence Award recipients

09/14/2017  Lam Research Corp. today announced it has recognized seven companies with Supplier Excellence Awards.

Orbotech's SPTS Technologies' Sigma fxP PVD system chosen by Chipmore

09/14/2017  SPTS Technologies today announced that it has been selected by Chipmore Technology Corporation Limited.

Semiconductor industry records best second quarter in three years

09/14/2017  Despite a slightly down first quarter, the semiconductor industry achieved near record growth in the second quarter of 2017, posting a 6.1 percent growth from the previous quarter, according to IHS Markit.

Josh Shiode joins Semiconductor Industry Association as Government Affairs Director

09/13/2017  In this role, Shiode will help advance the U.S. semiconductor industry’s key legislative and regulatory priorities related to semiconductor research and technology, product security, and high-skilled immigration, among others.

Soitec launches FD-SOI pilot line in Singapore

09/13/2017  This is the first stage in beginning FD-SOI production in Singapore and providing multi-site FD-SOI substrate sourcing to the global semiconductor market.

SEMI reports second quarter 2017 worldwide semiconductor equipment figures

09/12/2017  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$14.1 billion for the second quarter of 2017.

Fab equipment spending breaking industry records

09/12/2017  2017 fab equipment spending (new and refurbished) is expected to increase by 37 percent, reaching a new annual spending record of about US$55 billion.

Global semiconductor sales increase 24% year-to-year in July

09/08/2017  Worldwide sales up 3 percent compared to previous month; Americas market leads the way with growth of 36 percent year-to-year and 5 percent month-to month.

Cadence delivers comprehensive IP portfolio for TSMC 16FFC automotive design enablement platform

09/07/2017  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced it is delivering a comprehensive automotive IP portfolio for the TSMC 16nm FinFET Compact (16FFC) automotive process technology.

Kulicke & Soffa and Kinik sign collaboration agreement to provide comprehensive dicing blades solutions

09/07/2017  Kulicke & Soffa Industries, Inc. announced today its collaboration agreement with Kinik Company, to provide comprehensive dicing blades solutions.

SiFive and UltraSoC partner to accelerate RISC-V development through DesignShare

09/07/2017  SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced that UltraSoC will provide debug and trace technology for the SiFive Freedom platform, based on the RISC-V open source processor specification as part of the DesignShare initiative.

Microsemi appoints Richard Beyer to its Board of Directors

09/07/2017  Microsemi Corporation today announced the appointment of Richard M. Beyer to its board of directors.

Newly-discovered semiconductor dynamics may help improve energy efficiency

09/06/2017  Researchers examining the flow of electricity through semiconductors have uncovered another reason these materials seem to lose their ability to carry a charge as they become more densely "doped." Their results, which may help engineers design faster semiconductors in the future, are published online in the journal ACS Nano.

Stay ahead of the curve with SMC 2017 - Materials accelerating innovation

09/06/2017  Slated for September 18-20 in San Jose, Calif., the 18th annual SMC “offers a unique chance to network and discover opportunities in and around the industry in a year where dramatic growth has returned to the semiconductor market,” observes SMC 2017 co-chair Mark Thirsk of Linx Consulting, who will provide opening remarks at the conference.

Securing talent to connect, collaborate and innovate

09/06/2017  Our industry has a significant need for additional workers and several trends are working against us.

ASE K7 receives Green Factory Label

09/01/2017  Advanced Semiconductor Engineering, Inc, a semiconductor assembly and test service provider, announced that its K7 manufacturing facility in Kaohsiung has received the Green Factory Label from the Industrial Development Bureau, Ministry of Economic Affairs, Taiwan.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



ITPC2017
Big Island, Hawaii
http://www.semi.org/en/itpc
November 05, 2017 - November 08, 2017
SEMICON Europa
Munich, Germany
http://www.semiconeuropa.org/
November 14, 2017 - November 17, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018

VIDEOS