Wafer Processing

WAFER PROCESSING ARTICLES



Mentor Graphics launches Veloce Apps

02/26/2016  Mentor Graphics Corp. ushered in a new era of emulation by announcing new applications for the Veloce emulation platform.

Bipartisan customs bill combats counterfeit semiconductors

02/26/2016  The Semiconductor Industry Association (SIA) applauded congressional approval of legislation that includes a key provision to combat counterfeit semiconductors.

Design-for-Testability (DFT) Verified with Hardware Emulation

02/25/2016  Several years ago, while at Automatic Test Equipment (ATE) leader Teradyne, I witnessed frequent debates on a fundamental dilemma: On the production/testing floor, is it better to pass a failing device or reject a good device?

What’s the Next-Gen Litho Tech? Maybe All of Them

02/25/2016  The annual SPIE Advanced Lithography symposium in San Jose, Calif., hasn’t offered a clear winner in the next-generation lithography race.

Laser Suppliers Move Past the Neon Gas Crisis

02/24/2016  That neon gas shortage? So 2015.

Canon, Toshiba Join eBeam Initiative Group

02/24/2016  The eBeam Initiative announced that Canon and Toshiba are new members of the industry organization.

New industry realities and opportunities at semiconductor manufacturing conference

02/23/2016  The annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2016) will be held May 16-19 in Saratoga Springs, New York.

Semiconductor capital spending rebound fails to materialize in 2015

02/23/2016  Recent capital spending trends indicative of maturing semiconductor industry.

What to See at the SPIE Advanced Lithography Show

02/22/2016  The SPIE Advanced Lithography conference, from Tuesday, February 23, to Thursday, February 25, offers an incredible amount of technical information in a few long, fun days.

SMIC announces collaboration with Leadcore

02/22/2016  Semiconductor Manufacturing International Corporation and Leadcore Technology Co. have announced a collaboration to launch SMIC's 28nm High-K Metal Gate, or HKMG, process.

Soitec announces volume manufacturing of 300mm RF-SOI substrates

02/19/2016  Soitec (Euronext), a manufacturer of semiconductor materials and a supplier of wafers for radio-frequency silicon-on-insulator (RF-SOI) applications, has begun mass production of 300mm RF-SOI substrates for mobile communications.

Neon shortage coming

02/18/2016  Semiconductor lithographic use of Neon is increasing more rapidly than expected for several reasons including the delay of EUVL while demand for finer line width patterning is increasing.

Fairchild rejects proposal from China Resources, Hua Capital

02/18/2016  Fairchild Semiconductor's board of directors has determined that the unsolicited proposal received from China Resources Microelectronics Ltd and Hua Capital Management Co., Ltd. does not constitute a “Superior Proposal” as defined in the company’s agreement with ON Semiconductor.

New 2016 McClean Report examines worldwide GDP growth and its impact on 2016 IC market growth

02/17/2016  Slow-growth regional GDPs weigh heavy on potential global IC growth.

Cadence Innovus Implementation System qualified on Samsung 10nm FinFET process

02/16/2016  Cadence Design Systems, Inc. today announced that the Cadence Innovus Implementation System has been qualified for Samsung Foundry's latest 10-nanometer (10nm) process.

Imec presents compact lens-free digital microscope

02/12/2016  At next week’s SPIE Photonics West 2016, imec will demonstrate a lens-free microscope for large field-of-view live imaging at micrometer resolution.

Mentor Graphics partners with GLOBALFOUNDRIES for 22FDX platform reference flow

02/12/2016  Mentor Graphics Corp. has announced that it is collaborating with GLOBALFOUNDRIES to qualify the Mentor RTL to GDS platform for the current version of the GLOBALFOUNDRIES 22FDX platform reference flow.

Improved ion implant exhaust management reduces energy, capital costs

02/09/2016  How Texas Instruments got greener, safer and saved money.

SUNY Poly, GLOBAL FOUNDRIES announce new $500M R&D program

02/09/2016  SUNY Polytechnic Institute (SUNY Poly) and GLOBALFOUNDRIES today announced the establishment of a new Advanced Patterning and Productivity Center (APPC), which will be located at the Colleges of Nanoscale Science and Engineering (CNSE) in Albany, N.Y.

Helium reduction at pre-metal sub-atmospheric CVD

02/08/2016  A novel SACVD PMD invention sets the benchmark for helium reduction efforts by achieving four key objectives: cost reduction, quality, process robustness and productivity.




TWITTER


WEBCASTS



Advanced Packaging: A Changing Landscape Rife with Opportunities

May 10, 2016 at 1 PM ET / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Trends in MEMS

May 11, 2016 at 12 PM ET / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Fan-Out Wafer Level Packaging

May 2016 (Date and time TBD) / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

Sponsored By:
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TECHNOLOGY PAPERS



Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016
Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016

VIDEOS