Wafer Processing

WAFER PROCESSING ARTICLES



New ClassOne chamber cuts copper plating costs 95%

04/20/2017  ClassOne Technology announced it's new CopperMax chamber -- a design that is demonstrating major copper plating cost reductions for users of ≤200mm wafers.

Global semiconductor wafer-level equipment revenue to grow 11% in 2016

04/20/2017  Worldwide semiconductor wafer-level manufacturing equipment (WFE) revenue totaled $37.4 billion in 2016, an 11.3 percent increase from 2015, according to final results by Gartner, Inc.

Brewer Science earns GreenCircle Certification for zero waste to landfill for second consecutive year

04/19/2017  Brewer Science announced the achievement of Zero Waste to Landfill Certification for the second consecutive year.

Samsung completes qualification of its 2nd gen 10nm process technology

04/19/2017  Samsung expands 10nm capacity, to be ready for production by the fourth quarter of this year.

Graphene 'copy machine' may produce cheap semiconductor wafers

04/19/2017  Engineers use graphene as a 'copy machine' to produce cheaper semiconductor wafers.

3D-Micromac receives large volume orders from solar industry for its microCELL TLS system

04/18/2017  3D-Micromac AG today announced that the total received order volume for its microCELL TLS high-throughput half-cell cutting tools tops 1.5 GW for tool deliveries in 2017 to date.

NREL researchers capture excess photon energy to produce solar fuels

04/18/2017  Scientists at the U.S. Department of Energy's National Renewable Energy Laboratory (NREL) have developed a proof-of-principle photoelectrochemical cell capable of capturing excess photon energy normally lost to generating heat.

SEMICON Southeast Asia 2017: Disruption and the value of digital transformation in manufacturing

04/17/2017  At SEMICON Southeast Asia 2017, Dr. Chen Fusen, CEO of Kulicke & Soffa Pte Ltd, Singapore, will give a keynote on digital transformation in the manufacturing sector.

Gartner: Worldwide semiconductor revenue forecast to increase 12.3% in 2017

04/14/2017  Worldwide semiconductor revenue is forecast to total $386 billion in 2017, an increase of 12.3 percent from 2016, according to Gartner, Inc.

Kulicke & Soffa opens latest process and applications laboratory

04/13/2017  Kulicke & Soffa Industries, Inc. announced today the opening of its latest Process and Applications laboratory at the K&S Netherlands facility.

PolyU develops novel semiconductor nanofiber with superb charge conductivity

04/13/2017  The Department of Mechanical Engineering of The Hong Kong Polytechnic University (PolyU) has developed a novel technology of embedding highly conductive nanostructure into semiconductor nanofiber.

Si2 contributes advanced IC power modeling technology to IEEE

04/11/2017  Silicon Integration Initiative, Inc. (Si2), a integrated circuit research and development joint venture, has contributed new power modeling technology to the IEEE P2416 System Level Power Model Working Group.

MagnaChip to host its annual Foundry Technology Symposium in Santa Clara, California

04/10/2017  MagnaChip Semiconductor Corporation announced today that it will host its Annual U.S. Foundry Technology Symposium at Hilton Santa Clara, California, on June 7th, 2017.

SEMI reports 2016 semiconductor photomask sales of $3.3B

04/10/2017  SEMI today announced that the worldwide semiconductor photomask market was $3.32 billion in 2016 and is forecasted to reach $3.57 billion in 2018.

Shanhai Capital completes acquisition of Analogix Semiconductor

04/07/2017  Analogix Semiconductor, Inc. and Beijing Shanhai Capital Management Co, Ltd. today jointly announced the completion of the approximately $500 million acquisition of Analogix Semiconductor.

2016 marks year of recovery for global semiconductor market

04/07/2017  In 2016, the market posted a year-end growth rate of 2 percent with chip growth seen across multiple market segments. Global revenue came in at $352.4 billion, up from $345.6 billion in 2015.

Cadence unveils expanded Virtuoso Advanced-Node Platform for 7nm processes

04/05/2017  Cadence Design Systems, Inc. today announced the release of the new Virtuoso Advanced-Node Platform supporting advanced 7nm designs.

Ultratech receives multiple commitments for laser melt anneal system evaluation

04/05/2017  Ultratech, Inc. today announced that it has received multiple commitments for its LM7 laser melt anneal system.

Global semiconductor sales up 16.5% year-to-year

04/04/2017  Year-to-year sales increased by double digits across most regional markets, with the China and Americas markets showing particularly strong growth.

To e-, or not to e-, the question for the exotic 'Si-III' phase of silicon

04/04/2017  Discovery of semiconducting properties of Si-III might lead to unpredictable technological advancement.




TWITTER


WEBCASTS



Dense Off Chip Integration (DOCI): Advanced Packaging, low cost alternatives to boost electronic system performance

Date and time TBD

The slowing down of Moore's Law even at leading CMOS Fabs due to approaching Physics limits, while at the same time the explosion in demand for chips and systems across a wide range of market segments (compact wearable / portable consumer systems, the transfer and processing of data to and from the cloud, at the high performance end specialized architectures e,g for AI) has revived interest in Dense Off Chip Integration (DOCI ), first used in MCMs (Multi Chip Modules) for mainframes some 3 decades ago.

Sponsored By:

Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

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TECHNOLOGY PAPERS



Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

More Technology Papers

EVENTS



Microelectronics Tech Asia Singapore 2017
ITE College Center, Singapore
http://www.microelectronics.sg
July 04, 2017 - July 05, 2017
Intersolar North America
San Francisco, CA
http://www.intersolar.us
July 10, 2017 - July 13, 2017
ees North America
San Francisco, CA
http://www.ees-northamerica.com
July 10, 2017 - July 13, 2017
SEMICON West 2017
San Francisco, CA
http://www.semiconwest.org
July 11, 2017 - July 13, 2017

VIDEOS