Wafer Processing

WAFER PROCESSING ARTICLES



New fab facilities: China dominates, followed by Americas and Taiwan

12/14/2016  The 62 facilities and lines range from R&D to high-volume fabs. Most of the newly operating facilities will be volume fabs; only seven are R&Ds or Pilot facilities.

Semiconductor equipment sales forecast: $40 Billion

12/13/2016  SEMI today reported that worldwide sales of new semiconductor manufacturing equipment are projected to increase 8.7 percent to $39.7 billion in 2016.

SEMICON Japan 2016 opens tomorrow at Tokyo Big Sight

12/13/2016  SEMICON Japan 2016, the largest and most influential event for the electronics manufacturing supply chain in Japan, opens tomorrow at Tokyo Big Sight.

Silicon Labs wins GSA's "Most Respected Public Semiconductor Company" for the second year in a row

12/12/2016  Silicon Labs takes the top spot among semiconductor companies achieving $500 million to $1 billion in annual sales at the Global Semiconductor Alliance (GSA) awards celebration held on Dec. 8 in Santa Clara, California.

Global Semiconductor Alliance announces 2016 Award recipients

12/09/2016  The Global Semiconductor Alliance (GSA) is proud to announce the award recipients honored at the 2016 GSA Awards Dinner Celebration that took place in Santa Clara, California.

University of California, Berkeley places order for PEALD deposition system from Ultratech Cambridge Nanotech

12/08/2016  Ultratech, Inc. announced that the Laboratory for Emerging and Exploratory Devices has chosen the Ultratech-CNT Fiji G2 PEALD system as its instrument of choice for its research activities.

Global semiconductor sales increase 5% year-over-year in October

12/08/2016  The global semiconductor market has rebounded in recent months, with October marking the largest year-to-year sales increase since March 2015.

Five suppliers to hold 41% of global semiconductor marketshare in 2016

12/07/2016  Two years of busy M&A activity boost marketshare among top suppliers.

Third quarter 2016 worldwide semiconductor equipment billings reach $11B, reports SEMI

12/06/2016  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$11.0 billion in the third quarter of 2016.

Human-focused research and IoT promise profound, positive changes, say Leti CEO

12/06/2016  Leti CEO Marie Semeria today delivered a sweeping, optimistic assessment of a rapidly evolving world where "hyperconnectivity" and the Internet of Things – guided by a "human-centered research approach and symbiotic development strategies" – herald profound changes in the way individuals relate to each other and to the physical world.

GlobalWafers completes acquisition of SunEdison

12/05/2016  GlobalWafers Co., Ltd. announced that the acquisition of SunEdison Semiconductor Limited by GlobalWafers has been successfully completed.

Simple processing technique could cut cost of organic PV and wearable electronics

12/05/2016  A simple solution-based electrical doping technique could help reduce the cost of polymer solar cells and organic electronic devices, potentially expanding the applications for these technologies.

Infineon celebrates the expansion of its Mesa semiconductor fabrication facility

12/01/2016  The multi-million-dollar expansion project added approximately 11,500 square foot and will create more than 20 new high-quality jobs.

Synopsys completes acquisitions of Cigital and Codiscope

12/01/2016  Synopsys, Inc. has completed its acquisitions of Cigital, a privately held provider of software security managed and professional services, and Codiscope, a 2015 spinoff of Cigital and provider of complementary security tools.

Murphy, Choh and Pilla join ClassOne Technology's Board of Advisors

12/01/2016  ClassOne Technology, manufacturer of advanced wet processing equipment for ≤200mm substrates, announced the formation of a Board of Advisors.

SEMI adds industry veteran to Americas leadership

11/30/2016  David Anderson joins as SEMI Americas President.

IoT and automotive to drive IC market growth through 2020

11/30/2016  New report also projects good IC sales increases in medical electronics, digital TVs, and servers.

SiFive launches industry's first open-source RISC-V SoC

11/29/2016  SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced the availability of its Freedom Everywhere 310 (FE310) system on a chip (SoC).

North American semiconductor equipment industry posts October 2016 book-to-bill ratio of 0.91

11/28/2016  The book-to bill ratio for October dropped below parity for the first time in 11 months, even though bookings and billings activity remains at elevated levels relative to last year.

Microsemi to offer FPGA-based RISC-V IP core

11/21/2016  Microsemi Corporation (Nasdaq: MSCC) announced it is the first field programmable gate array (FPGA) provider to offer a comprehensive software tool chain and intellectual property (IP) core for RISC-V designs.




TWITTER


WEBCASTS



Internet of Things

February 2017 - Date and time TBD / Sponsored by Epicor

The age of IoT is upon us, with the expectation that tens of billions of devices will be connected to the internet by 2020. This explosion of devices will make our lives simpler, yet create an array of new challenges and opportunities in the semiconductor industry. At the sensor level, very small, inexpensive, low power devices will be gathering data and communicating with one another and the “cloud.” On the other hand, this will mean huge amounts of small, often unstructured data (such as video) will rippling through the network and the infrastructure. The need to convert that data into “information” will require a massive investment in data centers and leading edge semiconductor technology.

Sponsored By:
Fab Cost Reduction

February 2017 - Date and time TBD / Sponsored by Epicor

One of the primary concerns of today’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

Sponsored By:
Advanced Packaging

March 2017 - Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

What You Should Know About 802.11ax

The upcoming IEEE 802.11ax High-Efficiency Wireless (HEW) standard promises to deliver four times greater data throughput per user. It relies on multiuser technologies to make better use of the available Wi-Fi channels and serve more devices in dense user environments. Explore this technology introduction white paper to learn about the new applications of 802.11ax, the key technical innovations to the standard, and its test and measurement challenges. January 10, 2017
Sponsored by National Instruments

Electrically Conductive Adhesives Make the Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



LithoVision 2017
San Jose, CA
http://www.lithovision.com
February 26, 2017 - February 26, 2017
ISS Europe 2017
Munich, Germany
http://www.semi.org/eu/iss-europe-2017
March 05, 2017 - March 07, 2017
SEMI-THERM 33rd Annual Symposium & Exhibit
San Jose, CA
http://semi-therm.org
March 13, 2017 - March 17, 2017
CMC Conference 2017
Dallas, TX
http://cmcfabs.org
May 11, 2017 - May 12, 2017
The ConFab 2017
San Diego, CA
http://www.theconfab.com
May 14, 2017 - May 17, 2017
ASMC 2017
Saratoga Springs, NY
http://www.semi.org/en/asmc2017
May 15, 2017 - May 18, 2017

VIDEOS