Wafer Processing

Semiconductor Channel Sponsor:

WAFER PROCESSING ARTICLES



Building a better semiconductor

06/29/2015  Research led by Michigan State University could someday lead to the development of new and improved semiconductors.

What chipmakers will need to address growing complexity, cost of IC design and yield ramps

06/29/2015  As these early days of the Internet of Things show the network’s promise and reveal technological challenges that could threaten its ability to meet user expectations in the years ahead, technology providers will be charged with supplying the solutions that will meet those challenges.

Stanford researchers stretch a thin crystal to get better solar cells

06/25/2015  Crystalline semiconductors like silicon can catch photons and convert their energy into electron flows. New research shows a little stretching could give one of silicon's lesser-known cousins its own place in the sun.

SMIC receives "2014 Foundry Supplier of the Year" award from Qualcomm

06/25/2015  Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, today announced its receipt of the "2014 Foundry Supplier of the Year" award from customer Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated.

SMIC, Huawei, imec, and Qualcomm in joint investment on SMIC's new R&D company

06/23/2015  The joint venture company will focus on R&D towards next generation CMOS logic technology and build China's most advanced integrated circuit (IC) development R&D platform.

Exagan raises €5.7M to produce high-efficiency GaN-on-Silicon power-switching devices on 200mm wafers

06/23/2015  Exagan, a start-up innovator of gallium-nitride (GaN) semiconductor technology that enables smaller and more efficient electrical converters, today announced it has raised €5.7 million in first-round financing that will be used to produce high-speed power switching devices on 200mm wafers.

Cadence and Applied Materials collaborate on CMP process optimization

06/22/2015  Cadence Design Systems, Inc. and Applied Materials, Inc. today announced the companies are collaborating on a development program to optimize the chemical-mechanical planarization (CMP) process through silicon characterization and modeling for advanced-node designs at 14 nanometer (nm) and below.

Silicon Valley's specialty foundry Noel Technologies promotes Brenda Hill to VP

06/22/2015  Noel Technologies, a specialty foundry in Silicon Valley providing process development and substrate fabrication for a variety of high-technology industries, has promoted Brenda Hill to vice president of business development, marketing and sales.

First solar cell made of highly ordered molecular frameworks

06/19/2015  "We have opened the door to a new room," says Professor Christof Wöll, Director of KIT Institute of Functional Interfaces (IFG).

Sondrel announces further investment in graduate training for the semiconductor sector

06/19/2015  Graham Curren, Sondrel CEO, has announced his commitment to further investment in the training of graduate engineers looking to develop a career in the IC design sector, by providing a teaching fellow, and nine scholarship awards to students engaged on the Sondrel University of Nottingham Ningbo (UNNC) School of VLSI Design.

North American semiconductor equipment industry posts May 2015 book-to-bill ratio of 0.99

06/18/2015  North America-based manufacturers of semiconductor equipment posted $1.56 billion in orders worldwide in May 2015 (three-month average basis) and a book-to-bill ratio of 0.99.

A new look at surface chemistry

06/18/2015  For the first time in the long and vaunted history of scanning electron microscopy, the unique atomic structure at the surface of a material has been resolved.

Researchers create transparent, stretchable conductors using nano-accordion structure

06/18/2015  Researchers from North Carolina State University have created stretchable, transparent conductors that work because of the structures' "nano-accordion" design. The conductors could be used in a wide variety of applications, such as flexible electronics, stretchable displays or wearable sensors.

Entegris reaches milestones at its i2M Center for Advanced Materials Science

06/18/2015  Entegris, Inc., a developer of yield-enhancing materials and solutions for highly advanced manufacturing environments, announced the first shipments of production quantities of UPE (ultra-high molecular weight polyethylene) membrane from its i2M Center for Advanced Materials Science in Bedford, Massachusetts.

IC manufacturers close or repurpose 83 wafer fabs from 2009-2014

06/17/2015  150mm and 200mm wafer fabs account for two-thirds of total closures.

DCG Systems acquires MultiProbe

06/15/2015  DCG Systems announced today that it has acquired the assets of MultiProbe, a provider of atomic force-based nanoprobing solutions for the semiconductor industry.

Startups find strategic investors at SEMICON West 2015

06/15/2015  SEMI today announced that SEMICON West 2015 will feature the Silicon Innovation Forum (SIF), a unique forum for strategic investors and key decision makers to meet new and emerging early-stage companies developing the future of microelectronics.

Researchers grind nanotubes to get nanoribbons

06/15/2015  A simple way to turn carbon nanotubes into valuable graphene nanoribbons may be to grind them, according to research led by Rice University.

More change for the chip industry

06/11/2015  As if scaling to 7nm geometries and going vertical with FinFETs, TSVs and other emerging technologies wasn’t challenge enough, the emerging market for connected smart devices will bring more changes to the semiconductor sector. And then there’s 3D printing looming in the wings.

ASCENT project offers unparalleled access to European nanoelectronics infrastructure

06/11/2015  Europe’s leading nanoelectronics institutes, Tyndall National Institute in Ireland, CEA-Leti in France and imec in Belgium, have entered a €4.7 million collaborative open-access project called ASCENT (Access to European Nanoelectronics Network).




TWITTER


FINANCIALS



TECHNOLOGY PAPERS



How Software Can Impact Your Processes and Maximize Profit

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers

WEBCASTS



Advanced Packaging

September 2015 (Date and time TBD)

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:
Metrology

September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:

Lithography

September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

More Webcasts

VIDEOS



EVENTS



European MEMS Summit
Milan, Italy
http://www.semi.org/eu/node/8871
September 17, 2015 - September 18, 2015
SPIE Photomask Technology 2015
Monterey, CA
http://spie.org/x6323.xml
September 29, 2015 - October 01, 2015
SEMICON Europa 2015
Dresden, Germany
http://www.semiconeuropa.org
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
http://www.his.com/~iedm/
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
http://sites.ieee.org/wf-iot/
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
http://www.semiconjapan.org/en/
December 16, 2015 - December 18, 2015