Wafer Processing

WAFER PROCESSING ARTICLES



Bipartisan customs bill combats counterfeit semiconductors

02/26/2016  The Semiconductor Industry Association (SIA) applauded congressional approval of legislation that includes a key provision to combat counterfeit semiconductors.

Design-for-Testability (DFT) Verified with Hardware Emulation

02/25/2016  Several years ago, while at Automatic Test Equipment (ATE) leader Teradyne, I witnessed frequent debates on a fundamental dilemma: On the production/testing floor, is it better to pass a failing device or reject a good device?

What’s the Next-Gen Litho Tech? Maybe All of Them

02/25/2016  The annual SPIE Advanced Lithography symposium in San Jose, Calif., hasn’t offered a clear winner in the next-generation lithography race.

Laser Suppliers Move Past the Neon Gas Crisis

02/24/2016  That neon gas shortage? So 2015.

Canon, Toshiba Join eBeam Initiative Group

02/24/2016  The eBeam Initiative announced that Canon and Toshiba are new members of the industry organization.

New industry realities and opportunities at semiconductor manufacturing conference

02/23/2016  The annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2016) will be held May 16-19 in Saratoga Springs, New York.

Semiconductor capital spending rebound fails to materialize in 2015

02/23/2016  Recent capital spending trends indicative of maturing semiconductor industry.

What to See at the SPIE Advanced Lithography Show

02/22/2016  The SPIE Advanced Lithography conference, from Tuesday, February 23, to Thursday, February 25, offers an incredible amount of technical information in a few long, fun days.

SMIC announces collaboration with Leadcore

02/22/2016  Semiconductor Manufacturing International Corporation and Leadcore Technology Co. have announced a collaboration to launch SMIC's 28nm High-K Metal Gate, or HKMG, process.

Soitec announces volume manufacturing of 300mm RF-SOI substrates

02/19/2016  Soitec (Euronext), a manufacturer of semiconductor materials and a supplier of wafers for radio-frequency silicon-on-insulator (RF-SOI) applications, has begun mass production of 300mm RF-SOI substrates for mobile communications.

Neon shortage coming

02/18/2016  Semiconductor lithographic use of Neon is increasing more rapidly than expected for several reasons including the delay of EUVL while demand for finer line width patterning is increasing.

Fairchild rejects proposal from China Resources, Hua Capital

02/18/2016  Fairchild Semiconductor's board of directors has determined that the unsolicited proposal received from China Resources Microelectronics Ltd and Hua Capital Management Co., Ltd. does not constitute a “Superior Proposal” as defined in the company’s agreement with ON Semiconductor.

New 2016 McClean Report examines worldwide GDP growth and its impact on 2016 IC market growth

02/17/2016  Slow-growth regional GDPs weigh heavy on potential global IC growth.

Cadence Innovus Implementation System qualified on Samsung 10nm FinFET process

02/16/2016  Cadence Design Systems, Inc. today announced that the Cadence Innovus Implementation System has been qualified for Samsung Foundry's latest 10-nanometer (10nm) process.

Imec presents compact lens-free digital microscope

02/12/2016  At next week’s SPIE Photonics West 2016, imec will demonstrate a lens-free microscope for large field-of-view live imaging at micrometer resolution.

Mentor Graphics partners with GLOBALFOUNDRIES for 22FDX platform reference flow

02/12/2016  Mentor Graphics Corp. has announced that it is collaborating with GLOBALFOUNDRIES to qualify the Mentor RTL to GDS platform for the current version of the GLOBALFOUNDRIES 22FDX platform reference flow.

Improved ion implant exhaust management reduces energy, capital costs

02/09/2016  How Texas Instruments got greener, safer and saved money.

SUNY Poly, GLOBAL FOUNDRIES announce new $500M R&D program

02/09/2016  SUNY Polytechnic Institute (SUNY Poly) and GLOBALFOUNDRIES today announced the establishment of a new Advanced Patterning and Productivity Center (APPC), which will be located at the Colleges of Nanoscale Science and Engineering (CNSE) in Albany, N.Y.

Helium reduction at pre-metal sub-atmospheric CVD

02/08/2016  A novel SACVD PMD invention sets the benchmark for helium reduction efforts by achieving four key objectives: cost reduction, quality, process robustness and productivity.

Yield and cost challenges at 16nm and beyond

02/08/2016  A new 5D solution utilizes multiple types of metrology systems to identify and control fab-wide sources of pattern variation, with an intelligent analysis system to handle the data being generated.




TWITTER


WEBCASTS



High Mobility Transistors

June 21, 2016 at 1 PM ET / Sponsored by Air Products

Transistor performance has been greatly improved with strained silicon and high-k metal gates. Further performance improvements could be had by implementing III-V materials in the channel of nMOS transistors. Both III-V and Ge-based channels being considered for the pMOS device. High electron-mobility III-V semiconductors have been intensely researched as alternative channel materials for sub-7 nm technology nodes, but one of the main stumbling blocks is how to integrate them monolithically and cost-effectively with traditional CMOS silicon technology. This webcast will discuss the latest efforts in this area, including vertically stacked III-V nanowire.

Sponsored By:
Interconnection Technologies

June 2016 (Date and time TBD)/Sponsored by Air Products

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:
Is the Semiconductor Industry Ready for Industry 4.0 and the IIoT?

June 2016 (Date and time TBD)/ Sponsored by Epicor and Siemens

An industrial revolution is in the making, equivalent some say to the introduction of steam power at the tail end of the 18th century. Known as smart manufacturing, Industry 4.0 (after the German initiative Industrie 4.0), the industrial internet of things (IIoT), or simply the fourth industrial revolution, the movement will radically change how manufacturing is done. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs. There will be a paradigm shift from “centralized” to “decentralized” production. Semiconductor manufacturing has long been thought of as the most advanced manufacturing process in the world, but it’s not clear if long-held beliefs about how proprietary data, such as process recipes, are managed. Industry experts will examine the potential for the semiconductor factory of the future, and discuss potential roadblocks.

Sponsored By:
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TECHNOLOGY PAPERS



Specialized Materials Meet Critical Packaging Needs in MEMS Devices

Microelectromechanical systems (MEMS) present both unique market opportunities and significant manufacturing challenges for product designers in nearly every application segment. Used as accelerometers, pressure sensors, optical devices, microfluidic devices, and more, these microfabricated sensors and actuators often need to be exposed to the environment, but also need to be protected from environmental factors. Although standard semiconductor manufacturing methods provide a baseline capability in meeting these challenges, the unique requirements of MEMS devices drive a need for specialized epoxies and adhesives able to satisfy often-conflicting demands.May 12, 2016
Sponsored by Master Bond, Inc.,

Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

More Technology Papers

EVENTS



Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016
SEMICON Europa 2016
Grenoble, France
http://www.semiconeuropa.org
October 25, 2016 - October 27, 2016

VIDEOS