Wafer Processing

WAFER PROCESSING ARTICLES



Presto Engineering expands turnkey IC production management services with three new operations in Asia

02/02/2016  Presto Engineering Inc. announced this week that it has significantly expanded its turnkey capabilities with the opening of two new manufacturing hubs and a world-wide logistics center in Asia.

TowerJazz completes acquisition of Maxim's San Antonio fabrication facility

02/02/2016  TowerJazz, the global specialty foundry leader, announced today that it completed its previously announced acquisition of an 8-inch wafer fabrication facility in San Antonio, Texas, United States from Maxim Integrated Products, Inc.

ISS Europe 2016: Reaching into a new era

02/01/2016  At the SEMI Industry Strategy Symposium Europe (SEMI ISS Europe) on 6-8 March, industry experts will delve into the disruptions and opportunities impacting the electronics manufacturing supply chain.

Entegris expands R&D operations for semiconductor process liquid filtration in South Korea

01/27/2016  Entegris, Inc. announced today the expansion of its liquid filtration/purification analytical science and research and development facility in Suwon, South Korea.

Thin wafer market worth $9.17B by 2022

01/27/2016  According to a new marketsandmarkets report, the market was valued $6.76 Billion in 2015 and estimated to reach $9.17 Billion by 2022, at a CAGR of 3.7% between 2016 and 2022.

Memristor Variants and Models from Knowm

01/22/2016  Knowm Inc., a start-up pioneering next-generation advanced computing architectures and technology, recently announced the availability of two new variations of memristors targeting different neuromorphic applications.

Semiconductor veteran Tom Werthan to lead finance operations as Chief Financial Officer of Phononic

01/20/2016  Tom Werthan, a veteran semiconductor and finance executive experienced in leading financial operations at public and privately-held technology companies, has been appointed Chief Financial Officer at Phononic.

AMD Net Loss Widens in 2015 on Lower Revenue

01/20/2016  Advanced Micro Devices on Tuesday reported a net loss of $660 million on revenue of $3.99 billion for 2015, compared with a net loss of $403 million on revenue of $5.51 billion in 2014.

ASML Has Record Revenue for 2015; Will Raise Dividend, Buy Back More Stock

01/20/2016  ASML Holding today reported net income of about $1.5 billion on revenue of $6.855 billion for 2015. That compared with 2014’s net income of $1.3 billion on revenue of $6.385 billion.

Annihilating nanoscale defects

01/14/2016  Researchers at the University of Chicago and the U.S. Department of Energy's Argonne National Laboratory, led by Juan de Pablo and Paul Nealey, may have found a way for the semiconductor industry to hit miniaturization targets on time and without defects.

SEMI Awards honor process and technology integration achievements

01/14/2016  SEMI announced the recipients of the 2015 SEMI Awards for the Americas.

Ferrotec receives multi-system endorsement of e-beam evaporator systems from WIN Semiconductors

01/12/2016  Ferrotec Corporation this week announced that the largest pure-play GaAs foundry company, WIN Semiconductors Corp., has selected Temescal systems from Ferrotec Corporation for its next stage of expansion by ordering multiple e-beam evaporators for metal deposition

Semiconductor capital spending to decline 4.7% in 2016, according to Gartner

01/12/2016  Worldwide semiconductor capital spending is projected to decline 4.7 percent in 2016, to $59.4 billion, according to Gartner, Inc.

Semiconductor capital spending market in the US to reach over $31B by 2019

01/11/2016  Technavio's market research analysts estimate the semiconductor capital spending market in the US, to grow at a CAGR of around 9% between 2015 and 2019.

Worldwide semiconductor revenue declined 1.9% in 2015, Gartner reports

01/08/2016  Worldwide semiconductor revenue totaled $333.7 billion in 2015, a 1.9 percent decrease from 2014 revenue of $340.3 billion, according to preliminary results by Gartner, Inc.

Samsung, TSMC remain tops in available wafer fab capacity

01/07/2016  GlobalFoundries, TSMC, SK Hynix show greatest gains in wafer capacity in 2015.

A wild ride in 2015 - and two steps forward in 2016

01/07/2016  “In like a lion, out like a lamb” is just half the story for 2015. While initial expectations forecasted a double-digit growth year, the world economy faded and dragged our industry down to nearly flat 2015/2014 results.

EUV, multiple patterning, integrated circuits among topics for SPIE Advanced Lithography 2016

01/06/2016  EUV lithography is on the threshold of becoming a mainstream patterning technology for sub-10nm chips, featured speaker Anthony Yen of Taiwan Semiconductor Manufacturing Co. (TSMC) will tell fellow attendees at SPIE Advanced Lithography 2016.

Nanoworld 'snow blowers' carve straight channels in semiconductor surfaces

01/06/2016  The surprising trenching capability, reported by scientists from the National Institute of Standards and Technology (NIST) and IBM, is an important addition to the toolkit of nature-supplied 'self-assembly' methods that researchers aim to harness for making useful devices.

Choreographing the dance of electrons

01/04/2016  NUS scientists have discovered how to manipulate electrons in thin semiconductors by encapsulating them in atomically thin materials and changing the electric field.




TWITTER


WEBCASTS



Advanced Packaging: A Changing Landscape Rife with Opportunities

May 10, 2016 at 1 PM ET / Sponsored by Brewer Science

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Through-silicon vias are moving into volume packaging production, but problems with reliability, cost, and scaling remain. The supply chain also must adjust to this “mid” step between front- and back-end chip production. This webcast will explore the wafer thinning, bonding, TSV formation and other critical process steps necessary to enable 3D integration.

Sponsored By:
Trends in MEMS

May 11, 2016 at 12 PM ET / Sponsored by Boston Semi Equipment

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. This webcast will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:
Fan-Out Wafer Level Packaging

May 2016 (Date and time TBD) / Sponsored by Zeta Instruments

Wafer level packaging (WLP) using fan-out technology is an attractive platform for achieving low-cost low-profile package solutions for smart-phones and tablets, which require cost-effective, high-density interconnects in small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.

Sponsored By:
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TECHNOLOGY PAPERS



Protecting Electronics with Parylene

This whitepaper provides a comprehensive overview of parylene conformal coating, advantages of parylene, and applications for parylene to protect electronic devices. As technology continues to advance, devices will encounter rugged environments and it is vital that they are properly protected. Parylene conformal coating is one way that manufacturers are giving their devices a higher level of protection, along with increasing the overall quality of their products. Parylene conformal coating applications for Electronics include: · I/O & PCI Modules · Power Converters and Supplies · Backplanes · Other Embedded Computing applications · Other specialty electronics and assemblies April 26, 2016
Sponsored by Diamond-MT

NMT: A Novel Technology for In-Line Ultra-Thin Film Measurements

XwinSys identified the semiconductors recent market trends and developed a novel XRF technology, named NMT: Noise-reduced Multilayer Thin-film measurement. This innovative approach can be used for in-line inspection and metrology features, to accurately and precisely analyze single and multi-layered elements in ultra-thin films. NMT novel technology can be utilized for in-line applications ranging from localized ultra-thin film stacks to the inspection of 3D localized features to the analysis of defects involving geometries, voids and material elements. February 23, 2016
Sponsored by XwinSys Technology Development Ltd.

Adhesives for Electronic Applications

Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.January 05, 2016
Sponsored by Master Bond, Inc.,

More Technology Papers

EVENTS



SID Display Week 2016
San Francisco, CA
http://www.displayweek.org
May 22, 2016 - May 27, 2016
Design Automation Conference
Austin, TX
https://dac.com
June 05, 2016 - June 09, 2016
The ConFab
Las Vegas, NV
http://theconfab.com
June 12, 2016 - July 15, 2016
SEMICON West 2016
San Francisco, CA
http://www.semiconwest.org
July 12, 2016 - July 14, 2016

VIDEOS