Wafer Processing

WAFER PROCESSING ARTICLES



Two-dimensional semiconductor process and device simulator MicroTec: Development status update

08/28/2017  Siborg Systems Inc. develops new tools for practical optical sensor prototype development using MicroTec.

The ConFab announces mainstream semiconductor and emerging technologies 2018 conference focus

08/28/2017  The ConFab – an exclusive conference and networking event for semiconductor manufacturing and design executives from leading device makers, OEMs, OSATs, fabs, suppliers and fabless/design companies – announces the 2018 event will be held at THE COSMOPOLITAN of LAS VEGAS on May 20-23.

New results reveal high tunability of 2-D material

08/28/2017  Berkeley Lab-led team also provides most precise band gap measurement yet for hotly studied monolayer moly sulfide.

North American semiconductor equipment industry posts July 2017 billings

08/23/2017  North America-based manufacturers of semiconductor equipment posted $2.27 billion in billings worldwide in July 2017.

LTX-Credence ships the 600th PAx test system for testing RF front end devices

08/22/2017  LTX-Credence shipped the 600th PAx test system to Skyworks Solutions, Inc.

Semiconductor industry capital spending forecast to jump 20% in 2017

08/22/2017  Samsung remains the “wild card” with regard to 2H17 capital expenditures.

TowerJazz and Tacoma announce a partnership for a new 8-inch fabrication facility in Nanjing, China

08/21/2017  TowerJazz to gain up to 50% of the planned fab loading capacity.

SEMI Foundation celebrates New York State United Teachers, Recognizes Applied Materials & KLA-Tencor Volunteers of the Year

08/21/2017  The SEMI Foundation today announced that it will be celebrating its 10th anniversary of partnership with New York State United Teachers (NYSUT) on August 22-23 in Latham, New York at the NYSUT headquarters.

Global GaAs wafers market to grow at a CAGR of 11.9% by 2021

08/21/2017  The global gallium arsenide wafer market to decline at a CAGR of 11.9% during the period 2017-2021.

Lam Research takes uniformity control to the edge

08/16/2017  Chipmakers want every part of the wafer to yield good die. Advances in process technologies have just about made this a reality, even as feature dimensions continue to shrink and devices grow more complex.

New ultrathin semiconductor materials exceed some of silicon's "secret" powers

08/16/2017  Electrical engineers at Stanford have identified two semiconductors that share or even exceed some of silicon’s desirable traits, starting with the fact that all three materials can "rust."

Everspin Announces 1-Gigabit MRAM

08/10/2017  Everspin Technologies, Inc. has begun sampling its new 1-Gigabit Spin Torque Magnetoresistive Random Access Memory (ST-MRAM) with lead customers.

NanoString and Lam Research announce strategic development collaboration

08/09/2017  NanoString Technologies, Inc. and Lam Research Corporation today announced a strategic collaboration to develop NanoString's proprietary Hyb & Seq next-generation sequencing platform.

Worldwide semiconductor capital spending is forecast to grow 10.2% in 2017

08/07/2017  Worldwide semiconductor capital spending is projected to increase 10.2 percent in 2017, to $77.7 billion, according to Gartner, Inc.

Mid-year global semiconductor sales up 21% compared to 2016

08/04/2017  Q2 sales are highest on record, 5.8 percent more than previous quarter, 23.7 percent higher than Q2 of last year.

Toshiba Memory's investment in production equipment for Fab 6 at Yokkaichi Operations

08/03/2017  Toshiba Corporation today announced that Toshiba Memory Corporation (TMC) will unilaterally invest in manufacturing equipment for the Fab 6 clean room at Yokkaichi Operations.

Significant mid-year revision to 2017 IC market forecast

08/02/2017  DRAM, NAND flash memory markets drive the first annual double-digit upturn since 2010.

A semiconductor that can beat the heat

07/31/2017  Berkeley Lab, UC Berkeley scientists discover unique thermoelectric properties in cesium tin iodide.

Silicon wafer shortage starts in 2018

07/31/2017  TECHCET's model shows all slack soon gone from supply-chain for both 300mm and 200mm diameter.

Enhanced vacuum security using advanced sub-fab monitoring and data analytics

07/28/2017  Sub-Fab Fault Detection and Classification (FDC) software platforms collect, integrate and analyze operational data.




TWITTER


WEBCASTS



Materials

Date and time TBD

Success in electronics manufacturing increasingly relies on the materials used in production and packaging. More than 50 different elements from the periodic table are now used in semiconductor manufacturing, and the list grows even longer when you consider the requirements of flexible/printed electronics, LEDs, compound semiconductors, power electronics, displays, MEMS and bioelectronics. In this webcast, experts will focus on changing material requirements, the evolving material supply chain, recent advances in process and packaging materials and substrates, and the role new materials such as carbon nanotubes will play in the future.

Sponsored By:

MEMS

Date and time TBD

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

Sponsored By:

Interconnects

Date and time TBD

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

Learn the Basics of Power Amplifier and Front End Module Measurements

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017
Sponsored by National Instruments

Wafer Handler Predictive Monitor and Equipment Verification, Excursion Detection, Defect Reduction & Tool Matching

Consistent equipment performance, avoiding unscheduled downtime, reducing defects and preventing excursions is key to reducing cost and improving die and line yield in semiconductor manufacturing. The fully automated InnerSense SmartWafer (SMW2) system addresses these key metrics. The SMW2 system is effectively being used as a predictive monitor for handler PM’s, a leading indicator for mechanical defects and can detect, predict and prevent most mechanical related excursions, including wafer damage that can lead to subsequent wafer breakage. The SMW2 system can further improve tool availability by improving post PM recovery and tool matching.January 24, 2017
Sponsored by InnerSense

More Technology Papers

EVENTS



ITPC2017
Big Island, Hawaii
http://www.semi.org/en/itpc
November 05, 2017 - November 08, 2017
SEMICON Europa
Munich, Germany
http://www.semiconeuropa.org/
November 14, 2017 - November 17, 2017
IEDM 2017
San Francisco, CA
http://ieee-iedm.org
December 02, 2017 - December 06, 2017
ISS 2018
Half Moon Bay, CA
http://www.semi.org/en/ISS
January 15, 2018 - January 18, 2018

VIDEOS