Wafer Processing

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Rudolph Technologies and DISCO Corporation partner to improve wafer saw process

07/14/2015  Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy.

CoorsTek Increases its Business with Covalent Acquisition, Organic Growth

07/14/2015  CoorsTek made one of the biggest acquisitions of its century-long history late last year in purchasing Covalent Materials, formerly known as Toshiba Ceramics.

Keynote panel: Challenges abound for sub-14nm

07/14/2015  SEMICON West 2015 kicked off Tuesday morning with a keynote panel session that addressed the challenges of "Scaling the Walls of Sub-14nm Manufacturing."

Technologies for Advanced Systems Shown at IMEC Tech Forum USA

07/14/2015  R&D summarized of the nanoscale building blocks for our fab future.

SEMI forecasts three years of growth in chip equipment spending

07/14/2015  SEMI projects three consecutive years of growth in worldwide semiconductor equipment sales according to the mid-year edition of the SEMI Capital Equipment Forecast, released today at the SEMICON West exposition.

ECAE improves sputtering target performance

07/14/2015  Because it can achieve extreme deformation, Equal Channel Angular Extrusion (ECAE) can deliver submicron, high strength and uniform microstructures. The resulting improvements in strength allow for monolithic targets with a longer target life of 20-100%.

Controlling measurements of WLP on high mix, high volume manufacturing

07/14/2015  The demand for 4-mask layer Cu-plated wafer-level chip scale packaging (WLCSP) is increasing rapidly, and the current capability for in-line Cu height measurements is not suitable for high volume manufacturing (HVM).

Applied Materials' new etch system provides atomic-level precision

07/13/2015  Applied Materials, Inc. today announced a next-generation etch tool, the Applied Centris Sym3 Etch system, featuring an entirely new chamber for atomic-level precision manufacturing.

Imec and Panasonic demonstrate breakthrough RRAM cell

07/13/2015  Imec and Panasonic Corp. announced today that they have fabricated a 40nm TaOx-based RRAM (resistive RAM) technology with precise filament positioning and high thermal stability.

Applied Materials introduces high-performance ALD technology for the 3D era

07/13/2015  Applied Materials, Inc. today unveiled the Applied Olympia ALD system, featuring a unique, modular architecture that delivers high-performance ALD technology to manufacturers of leading-edge 3D memory and logic chips.

Graphene gets competition

07/09/2015  Graphene, the only one atom thick carbon network, achieved overnight fame with the 2010 Nobel Prize. But now comes competition: Such layers can also be formed by black phosphorous.

IBM Research alliance produces industry's first 7nm node test chips

07/09/2015  IBM Research today announced that working with alliance partners at SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE) it has produced the semiconductor industry’s first 7nm (nanometer) node test chips with functional transistors.

SEMI updates key safety guidelines for semiconductor manufacturing equipment

07/08/2015  SEMI today announced the cornerstone safety Standard S2 (Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment) will be updated this month.

Could black phosphorus be the next silicon?

07/07/2015  New material could make it possible to pack more transistors on a chip, research suggests.

Down to the quantum dot

07/07/2015  Using a single molecule as a sensor, scientists in Jülich have successfully imaged electric potential fields with unrivalled precision.

The big picture: More than 850 volume fabs in 2017

07/06/2015  We, in the semiconductor supply chain, are constantly immersed in detailed numbers. It’s important to pull back and look at the major trends that have profoundly changed and are reshaping our industry.

Process Watch: Increasing process steps and the tyranny of numbers

07/06/2015  Moving to the next design rule can be stressful for the inspection and metrology engineer. Like everything else in the fab, process control generally doesn’t get any easier as design rules shrink and new processes are introduced.

Tackling advanced litho challenges on the path to node 5

07/02/2015  If you attended just about any mask making conference in the last five to seven years, you would have heard the lament about exploding data volumes and their impact on mask writing time and, by extension, mask costs.

New method can make cheaper solar energy storage

07/01/2015  EPFL scientists have now developed a simple, unconventional method to fabricate high-quality, efficient solar panels for direct solar hydrogen production with low cost.

GLOBALFOUNDRIES completes acquisition of IBM Microelectronics business

07/01/2015  GLOBALFOUNDRIES today announced that it has completed its acquisition of IBM’s Microelectronics business.




Success in the Electronic and High Tech Industry

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015
Sponsored by Epicor

Three Key Factors to Create Leak-Free Fitting Assemblies for Fluid Processing Applications

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015
Sponsored by Fit-LINE, Inc.

Silicones Meet the Needs of the Electronics Industry

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.May 12, 2015
Sponsored by Master Bond, Inc.,

More Technology Papers



September 2015 (Date and time TBD)

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Sponsored By:


September 2015 (Date and time TBD)

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Trends in Flexible and Printed Electronics

October 2015 (Date and time TBD)

Printed electronics are at a pivotal moment. There are not only tremendous opportunities for innovation and growth in new verticals and industries, but a new way of thinking about how electronics are made, combining techniques and materials used by printed electronics with those of 3D printing. Presenters will review printed electronics and discuss future directions, from smart labels and wearables, to trends and technologies that enable the printing of IoT devices with embedded sensors, transistors, displays, batteries and memory.

Sponsored By:

More Webcasts



SEMICON Europa 2015
Dresden, Germany
October 06, 2015 - October 08, 2015
International Electron Device Meeting 2015
Washington D.C. United States
December 07, 2015 - December 09, 2015
2015 IEEE World Forum on Internet of Things
Milan, Italy
December 14, 2015 - December 16, 2015
SEMICON Japan 2015
Tokyo, Japan
December 16, 2015 - December 18, 2015