Cypress and SiGe Semiconductor to collaborate on SiGe process

Dec. 3, 2001 – San Jose, CA – Cypress Semiconductor and SiGe Semiconductor have signed an agreement to collaborate on an advanced Silicon Germanium (SiGe) process.

Under the agreement, the companies will merge SiGe Semiconductor’s RF process and device modeling expertise with Cypress’ BiCMOS and manufacturing capabilities to bring performance, integration and power advantages to manufacturers of wireless and broadband communications equipment, the companies said. Cypress and SiGe expect to deliver production-ready SiGe processes during the 1Q02.

“Developing a SiGe process internally strengthens our position in the communications markets, as the technology is uniquely capable of meeting the growing expectations of this market,” said Chris Seams, Cypress’s VP of technology development & wafer manufacturing.

SiGe processes are gaining importance with wireless and broadband equipment, as the expectations for size, performance and power consumption exceed what can cost-effectively be achieved in silicon-based CMOS.

According to the companies, the technology reduces power consumption to extend the battery life in handheld devices; improves phase noise to increase performance, data rates, transmission range, and stability over a broad temperature range; and allows more circuitry to be integrated on a single die, reducing the number of external components and associated board space.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

Introducing Semiconductor Digest
04/30/2019Semiconductor Digest is a new magazine dedicated to the worldwide semiconductor industry...
KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...