Credence to join China’s CASPA organization

Sept. 9, 2002 – Fremont, CA – Credence Systems Corp., a provider of solutions from design-to-production test for the worldwide semiconductor industry, will join the Chinese American Semiconductor Professional Association (CASPA) as a corporate sponsor.

The association includes global leaders in the semiconductor industry and serves to promote technical communication, professional collaboration, and networking among individuals and companies.
Credence will officially become a corporate member of CASPA this month.

With over 60 corporate members worldwide, CASPA is an organization that covers the US as well as China, Taiwan, and Hong Kong. CASPA consists of individual members, corporate members, a board of directors, a board of advisors, and honorable advisors. Mark Ding, Credence’s business development director for China, serves as the group’s CIO and is a member of its board of directors.

“We are pleased to accept the invitation to join CASPA, which will help strengthen Credence’s presence in Asia and further solidify our relationships within the industry,” said Steven Chen, GM of Credence’s China operations.

Founded in 1991, CASPA is an officially registered non-profit organization with both the IRS and the State of California. The group holds a series of industrywide meetings, conferences and other events, and publishes quarterly newsletters to inform its members of key industry issues.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

Introducing Semiconductor Digest
04/30/2019Semiconductor Digest is a new magazine dedicated to the worldwide semiconductor industry...
KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...