Nanya, Infineon setting up 300mm joint venture

Sept. 6, 2002 – Taipei, Taiwan – Nanya Technology Corp. and Infineon are scheduled to jointly set up a new semiconductor company at the end of this month to produce 300mm wafers.

Nanya and Infineon will each hold an equal share in the joint venture. Initial production capacity is set to be 20,000 wafers/month. But the output for single modules can go up to 50,000 wafers, reported the Financial Times.

The team-up of the two companies will allow them to enhance each other on the increasingly competitive world market. Infineon will soon upgrade its office in Taiwan to a branch company and the company has increased the number of engineers working in Taiwan.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

Introducing Semiconductor Digest
04/30/2019Semiconductor Digest is a new magazine dedicated to the worldwide semiconductor industry...
KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...