New process prints silicon on plastic

Traditional silicon components have much better electrical properties than organic ones. The components could be used in flexible large-area displays, radiofrequency ID tags, sensors and flexible, high-performance applications like reconfigurable antennas, according to the researchers.

(August 11, 2004) Kuala Lumpur, Malaysia&#8212STATS ChipPAC Malaysia, a semiconductor test and assembly company, expects revenue to increase between 30 and 40% this year, after having invested an additional RM200 million to its support expansion and technological enhancements. The company’s president and managing director, J.A. Lew, says the expansion involved upgrading the plant in terms of capacity, infrastructure and installing state-of-the-art equipment.

The new company’s name embodies the merger of the former ChipPAC Inc., of the U.S., with ST Assembly Test Services Ltd., of Singapore. The merger was first announced in February 2004 and was completed August 5, 2004, with STATS ChipPAC Ltd. becoming the second largest test house in the world.


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