China IC packaging and testing firm to offer chip-scale packaging

(October 4, 2004) Taipei&#8212China-based Jiangyin Changdian Advanced Packaging (JCAP) is setting up chip-scale packaging lines and wafer-bumping lines, slated for mass production next year.

(October 5, 2004) San Jose, Calif.&#8212SEMI has published six new technical standards applicable to the semiconductor, flat panel display, and MEMS manufacturing industries. The new standards, developed by technical experts from equipment suppliers, device manufacturers, and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format, or can be downloaded from the SEMI website at


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