IMEC reports record in tall triple-gate device SRAM cell for 45nm node

December 13, 2004 – At today’s IEEE International Electron Devices Meeting in San Francisco, IMEC is expected to announce that it has achieved the smallest triple-gate device SRAM cell reported to date. IMEC’s device is a fully working 6-transistor SRAM cell with an area of only 0.314 x 0.314 mm.

The SRAM cell achieves excellent static-noise margin of 240mV at 1.0V operation and shows good functionality down to 0.4V with a symmetric butterfly curve. Further, the cell shows great potential for scaling down to the 32nm node.

Nonplanar device architectures such as multigate-FETs (MuGFET) are emerging as candidates for the 45nm node and below due to their improved current density, reduced short-channel effects, and improved gate control compared to conventionally scaled transistors.

The MuGFETs implemented in the SRAM cell distinguish themselves by a tall fin of 70nm, 40nm higher than typically reported so far, resulting in an increased current density. The transistors have a physical gate length of 40nm and 35nm wide fins. A NiSi source/drain has been used to lower access resistance and a Cu/low-k metallization finishes the cell.

Mature 193nm lithography with 0.75 NA and RET allowed the patterning of fins, gates, and contact holes with 150nm pitch. The cell layout has been optimized, taking into account the different reticle (PSM) technologies, illumination possibilities (Quasar or Dipole) and optical proximity corrections for each critical layer. Only uni-directional patterns are used, leading to a truly lithography-friendly design.

Currently, IMEC is pursuing the development of smaller SRAM cells and advanced logic circuits. Metal gates, using standard available materials, have been implemented to allow scaling below the 45nm node. Because of their process complexity, the SRAM cell will be used as a test module in IMEC’s sub-45nm CMOS research platform. This program includes advanced lithography, gate-stack technology, ultra-shallow junctions, silicides and strain, interconnect, cleaning and emerging device programs, and aims to prove the feasibility of the developed technology elements.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...