May 25, 2005 – A round-up of recent industry activity shows new orders for Akrion, Mattson Technology, Synopsys, and Ultratech products.
Mattson Technology Inc.’s strip and RTP systems will be used to support the production ramp at ProMOS Technologies’ newest 300mm wafer fab in the Central Taiwan Science Park (CTSP), Taiwan. The systems, which include the Aspen III ICPHT and the Helios, will be used in ProMOS’ Fab III for volume production of advanced memory devices. The facility is expected to produce 80,000 wafers/month by 2010.
Akrion has received an order for a Goldfinger Mach2HP single-wafer system from a top-tier manufacturer of memory and logic devices in Asia for use on its most advanced 300mm copper interconnect manufacturing line. The tool set will be used for back-end-of-line post etch/ash cleaning. The four-chamber system utilizes an advanced stacked process chamber design to reduce footprint and allow multiple configurations for both FEOL and BEOL processing.
UMC has adopted Synopsys’ i-Virtual Stepper system for photomask inspection qualification. The system enhances mask inspection turnaround time and yield and is part of Synopsys’ Design for Manufacturing (DFM) tool suite. i-VSS’s Web-based architecture is designed to help foundries connect multiple fab sites to centralize the mask qualification process.
Ultratech has received multiple system orders from several customers in Taiwan and China for its advanced-packaging lithography systems. Ultratech’s lithography systems are to be used for gold-bump processing for flat panel displays and display-driver ICs for liquid crystal displays for both consumer electronic devices and communication applications.