Focus on the Edge-for a Competitive Edge

To improve yield and chip performance, it has become important for fabs to characterize and correct changes in the effective focus and exposure at the edge. Monitoring focus and exposure on product wafers is the most effective means for correction, since product wafers provide the most realistic view of exposure tool interactions with the process. In this work, on-product monitoring and correction is based on optical measurement using a compact line-end shortening (LES) target that provides a unique separation of exposure and focus on product wafers. Our ultimate objective is indirect critical dimension (CD) control, with maximum yield and little or no impact on productivity.



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