Loop Before You Yield

This article presents the application of KLA-Tencor’s µLoop inline electrical defect monitoring method for the front-end-ofline (FEOL) process of a 90-nm node logic device. Using this method, killer defects in the FEOL process were as easily detected as in the back-end-of-line (BEOL) process. In addition, the defect density value (D0) was obtained in less than one-third of the time than with the conventional electrical-testing method. This demonstrates that the µLoop method in the FEOL is very powerful and useful for detecting killer defects and for inline monitoring of the FEOL process.

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